HP Hewlett Packard Server 642106 001 User Manual

HP ProLiant DL380p Gen8 Server  
User Guide  
Abstract  
This document is for the person who installs, administers, and troubleshoots servers and storage systems. HP assumes you are qualified in the  
servicing of computer equipment and trained in recognizing hazards in products with hazardous energy levels.  
Part Number: 661848-005a  
August 2013  
Edition: 5  
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Contents  
Contents  
3
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Contents  
4
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Contents  
5
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Component identification  
Front panel components  
SFF model (8-drive)  
Item  
Description  
Video connector  
SATA optical drive bay  
Drive bays  
1
2
3
4
5
Systems Insight Display  
USB connectors (2)  
SFF model with optional hard drive cage (16-drive)  
Item  
Description  
Video connector  
1
2
3
4
5
Drive bays (box 1)  
Drive bays (box 2)  
Systems Insight Display  
USB connectors (2)  
Component identification  
7
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SFF model (25-drive)  
Item  
Description  
Video connector  
Quick release levers (2)  
Drive bays  
1
2
3
4
USB connector  
LFF model (8-drive)  
Item  
Description  
Video connector  
SATA optical drive bay  
Drive bays  
1
2
3
4
5
Systems Insight Display  
USB connectors (2)  
Component identification  
8
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LFF model (12-drive)  
Item  
Description  
Video connector  
Quick-release levers (2)  
Drive bays  
1
2
3
4
USB connector  
Front panel LEDs and buttons  
Item  
Description  
Status  
Power On/Standby button  
and system power LED  
Solid green = System on  
Flashing green (1 Hz/cycle per sec) = Performing power on sequence  
Solid amber = System in standby  
1
Off = No power present*  
Component identification  
9
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Item  
Description  
Status  
Health LED  
Solid green = Normal  
Flashing amber = System degraded  
2
Flashing red (1 Hz/cycle per sec) = System critical  
Fast-flashing red (4 Hz/cycles per sec) = Power fault**  
NIC status LED  
UID button/LED  
Solid green = Link to network  
Flashing green (1 Hz/cycle per sec) = Network active  
Off = No network activity  
3
4
Solid blue = Activated  
Flashing blue (1 Hz/cycle per sec) = Remote management or  
firmware upgrade in progress  
Off = Deactivated  
*Facility power is not present, power cord is not attached, no power supplies are installed, power supply failure has  
occurred, or the power button cable is disconnected.  
**To identify components in a degraded or critical state, see the Systems Insight Display LEDs, check iLO/BIOS logs, and  
reference the server troubleshooting guide.  
Access the Systems Insight Display  
To access a pop-out HP Systems Insight Display:  
1.  
2.  
Press and release the panel.  
After the display fully ejects, rotate the display downward to view the LEDs.  
Component identification 10  
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Systems Insight Display LEDs  
The HP Systems Insight Display LEDs represent the system board layout. The display enables diagnosis with  
the access panel installed.  
Item  
Description  
Status  
Power cap  
Off = System is in standby, or no cap is set.  
Solid green = Power cap applied  
1
NIC link/activity  
Off = No link to network. If the power is off,  
view the rear panel RJ-45 LEDs for status  
2
Flashing green = Network link and activity  
Solid green = Network link  
AMP status  
Off = AMP modes disabled  
Solid green = AMP mode enabled  
Solid amber = Failover  
3
Flashing amber = Invalid configuration  
Over temp  
Off = Normal  
Solid amber = High system temperature  
detected  
4
All other LEDs  
Off = Normal  
Amber = Failure  
For more information on the activation of  
these LEDs, see "Systems Insight Display  
LED combinations (on page 12)."  
Component identification 11  
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Systems Insight Display LED combinations  
When the health LED on the front panel illuminates either amber or red, the server is experiencing a health  
event. Combinations of illuminated Systems Insight Display LEDs, the system power LED, and the health LED  
indicate system status.  
Systems Insight Display Health LED  
LED and color  
System power  
LED  
Status  
Red  
Amber  
One or more of the following conditions may  
exist:  
Processor (amber)  
Processor in socket X has failed.  
Processor X is not installed in the socket.  
Processor X is unsupported.  
ROM detects a failed processor during  
POST.  
Amber  
Green  
Processor in socket X is in a pre-failure  
condition.  
Processor (amber)  
Red  
Green  
Green  
Green  
One or more DIMMs have failed.  
DIMM (amber)  
DIMM (amber)  
Over temp (amber)  
Amber  
Amber  
DIMM in slot X is in a pre-failure condition.  
The Health Driver has detected a cautionary  
temperature level.  
Red  
Amber  
The server has detected a hardware critical  
temperature level.  
Over temp (amber)  
Red  
Green  
Green  
Green  
The PCI riser cage is not seated properly.  
One fan has failed or has been removed.  
PCI riser (amber)  
Fan (amber)  
Amber  
Red  
Two or more fans have failed or been  
removed.  
Fan (amber)  
Red  
Amber  
One or more of the following conditions may  
exist:  
Power supply (amber)  
Only one power supply is installed and  
that power supply is in standby.  
Power supply fault  
System board fault  
Amber  
Green  
One or more of the following conditions may  
exist:  
Power supply (amber)  
Redundant power supply is installed and  
only one power supply is functional.  
AC power cord is not plugged into  
redundant power supply.  
Redundant power supply fault  
Power supply mismatch at POST or  
power supply mismatch through hot-plug  
addition  
Amber  
Standby  
Power cap (off)  
Flashing green  
Green  
Waiting for power  
Power is available.  
Power is not available.  
Power cap (green)  
Power cap (green)  
Amber  
Power cap (flashing  
amber)  
Component identification 12  
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IMPORTANT: If more than one DIMM slot LED is illuminated, further troubleshooting is required.  
Test each bank of DIMMs by removing all other DIMMs. Isolate the failed DIMM by replacing  
each DIMM in a bank with a known working DIMM.  
Rear panel components  
Item Description  
PCIe slots 1–3 (top to bottom)  
1
2
3
4
5
6
7
8
9
10  
PCIe slots 4–6 (top to bottom)  
Power supply 1 (PS1)  
PS1 power connector  
PS2 power connector  
Power supply 2 (PS2)  
USB connectors (4)  
Video connector  
iLO connector  
Serial connector  
FlexibleLOM ports (Shown: 4x1Gb/Optional: 2x10Gb); port 1 on right side  
11  
Component identification 13  
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Rear panel LEDs and buttons  
Item Description  
Status  
UID LED/button  
Off = Deactivated  
Solid blue = Activated  
1
Flashing blue = System being managed remotely  
Power supply 2  
LED  
Off = System is off or power supply has failed.  
Solid green = Normal  
2
3
4
5
Power supply 1  
LED  
Off = System is off or power supply has failed.  
Solid green = Normal  
NIC link LED  
Off = No network link  
Green = Network link  
NIC activity LED  
Off = No network activity  
Solid green = Link to network  
Flashing green = Network activity  
Non-hot-plug PCI riser board slot definitions  
Primary riser cage connector, connected to processor 1 or the southbridge  
PCIe 3-slot riser cage*  
PCIe 2-slot x16 riser cage  
PCIe2 or PCIe3** x16 (16,8,4,2,1)  
1 - FL/FH  
PCIe2 or PCIe3** x8 (8,4,2,1)  
PCIe2 x8 (4,2,1)†  
2 - HL/FH  
3 - HL/FH  
Secondary riser cage connector, connected to processor 2 (Processor 2 must be installed)  
PCIe 3-slot riser cage*  
PCIe 2-slot x16 riser cage  
PCIe2 or PCIe3** x16 (16,8,4,2,1)  
PCIe2 or PCIe3** x16 (16,8,4,2,1)  
PCIe2 or PCIe3** x16 (16,8,4,2,1)  
PCIe2 or PCIe3** x8 (8,4,2,1)  
PCIe2 or PCIe3** x8 (8,4,2,1)  
4 - FL/FH  
5 - HL/FH  
6 - HL/FH  
Component identification 14  
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*The server ships with one PCIe3 riser cage installed in the primary riser cage connector.  
**These slots can run 8 GT/s signaling rate in either PCIe2 or PCIe3 mode, depending on the capability of  
the installed processor.  
†PCIe slot 3 is connected to the southbridge and runs at the Gen2 signaling rate.  
Notes:  
"Primary" denotes the riser cage is installed in the primary riser connector.  
"Secondary" denotes the riser cage is installed in the secondary riser connector.  
Installing the riser cages listed in the table above in either the primary or secondary riser connectors  
determines the form factor of the PCI cards supported by those riser cages.  
FL/FH denotes full-length, full-height. HL/FH denotes half-length, full-height. LP denotes low profile.  
The PCIe2 x16 riser cage supports a maximum power of 150 W with an HP power cable. This cable  
must be used for PCIe card wattages greater than 75 W.  
System board components  
Component identification 15  
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Item  
Description  
Fan connector 6  
1
Systems Insight Display connector  
Fan connector 5  
2
3
Processor 1 DIMM slots  
Fan connector 4  
4
5
Front I/O connector  
6
Front USB connector  
7
Fan connector 3  
8
First drive cage, box 2 power connector  
Fan connector 2  
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
Processor 2 DIMM slots  
Second drive cage, box 1 power connector  
Fan connector 1  
Discovery services connector  
Front video connector  
USB connector  
Power supply backplane connector  
SATA optical drive connector  
NMI jumper  
System battery  
SD card slot  
Secondary (processor 2) PCI riser connector  
System maintenance switch  
Processor 2 socket  
TPM connector  
Primary (processor 1) PCI riser connector  
FlexibleLOM  
SAS connector 1  
SAS connector 2  
Cache module connector  
Processor 1 socket  
RDX power connector  
System maintenance switch  
Position  
Default  
Function  
Off  
Off = HP iLO security is enabled.  
On = HP iLO security is disabled.  
S1  
Off  
Off = System configuration can be  
changed.  
S2  
On = System configuration is locked.  
Off  
Off  
Reserved  
Reserved  
S3  
S4  
Component identification 16  
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Position  
Default  
Function  
Off  
Off = Power-on password is enabled.  
On = Power-on password is disabled.  
S5  
Off  
Off = No function  
S6  
On = ROM reads system configuration  
as invalid.  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
S7  
S8  
S9  
S10  
S11  
S12  
To access the redundant ROM, set S1, S5, and S6 to on.  
When the system maintenance switch position 6 is set to the On position, the system is prepared to erase all  
system configuration settings from both CMOS and NVRAM.  
CAUTION: Clearing CMOS and/or NVRAM deletes configuration information. Be sure to  
properly configure the server or data loss could occur.  
NMI functionality  
An NMI crash dump enables administrators to create crash dump files when a system is hung and not  
responding to traditional debug mechanisms.  
Crash dump log analysis is an essential part of diagnosing reliability problems, such as hangs in operating  
systems, device drivers, and applications. Many crashes freeze a system, and the only available action for  
administrators is to cycle the system power. Resetting the system erases any information that could support  
problem analysis, but the NMI feature preserves that information by performing a memory dump before a  
hard reset.  
To force the OS to invoke the NMI handler and generate a crash dump log, the administrator can use the iLO  
Virtual NMI feature.  
For more information, see the white paper on the HP website  
Component identification 17  
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DIMM slot locations  
DIMM slots are numbered sequentially (1 through 12) for each processor. The supported AMP modes use the  
letter assignments for population guidelines.  
SAS and SATA device numbers  
SFF 8-device bay numbering  
Optional SFF 16-device bay numbering  
SFF 25-device bay numbering  
Component identification 18  
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LFF 8-device bay numbering  
LFF 12-device bay numbering  
Hot-plug drive LED definitions  
Item LED  
Status  
Definition  
Locate  
Solid blue  
Flashing blue  
The drive is being identified by a host application.  
The drive carrier firmware is being updated or requires an update.  
1
Activity ring  
Rotating green  
Off  
Drive activity  
2
No drive activity  
Component identification 19  
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Item LED  
Status  
Definition  
Do not remove  
Solid white  
Do not remove the drive. Removing the drive causes one or more of  
the logical drives to fail.  
3
Off  
Removing the drive does not cause a logical drive to fail.  
Drive status  
Solid green  
The drive is a member of one or more logical drives.  
4
Flashing green  
The drive is rebuilding or performing a RAID migration, strip size  
migration, capacity expansion, or logical drive extension, or is  
erasing.  
Flashing  
amber/green  
The drive is a member of one or more logical drives and predicts  
the drive will fail.  
Flashing amber The drive is not configured and predicts the drive will fail.  
Solid amber  
Off  
The drive has failed.  
The drive is not configured by a RAID controller.  
PCI riser cage LED  
CAUTION: To prevent damage to the server or expansion boards, power down the server and  
remove all AC power cords before removing or installing the PCI riser cage.  
Status  
On = AC power is connected.  
Off = AC power is disconnected.  
Component identification 20  
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FBWC module LEDs (P222, P420, P421)  
The FBWC module has three single-color LEDs (one amber and two green). The LEDs are duplicated on the  
reverse side of the cache module to facilitate status viewing.  
1 - Amber  
2 - Green  
3 - Green  
Interpretation  
Off  
Off  
The cache module is not powered.  
Off  
Off  
Flashing 0.5 Hz Flashing 0.5 Hz The cache microcontroller is executing from within its  
boot loader and receiving new flash code from the host  
controller.  
Flashing 1 Hz  
Flashing 1 Hz  
Flashing 1 Hz  
On  
The cache module is powering up, and the capacitor  
pack is charging.  
Off  
Off  
Off  
Off  
Off  
Off  
On  
The cache module is idle, and the capacitor pack is  
charging.  
The cache module is idle, and the capacitor pack is  
charged.  
On  
The cache module is idle, the capacitor pack is charged,  
and the cache contains data that has not yet been  
written to the drives.  
Flashing 1 Hz  
On  
Off  
Off  
Off  
On  
A backup is in progress.  
Off  
The current backup is complete with no errors.  
The current backup failed, and data has been lost.  
Off  
Flashing 1 Hz  
Flashing 1 Hz  
Flashing 1 Hz  
Flashing 1 Hz  
A power error occurred during the previous or current  
boot. Data may be corrupt.  
On  
Off  
Off  
On  
An overtemperature condition exists.  
The capacitor pack is not attached.  
Flashing 1 Hz  
Flashing 2 Hz  
Flashing 2 Hz  
Flashing 2 Hz  
Flashing 2 Hz  
The capacitor has been charging for 10 minutes, but  
has not reached sufficient charge to perform a full  
backup.  
On  
On  
Off  
On  
The current backup is complete, but power fluctuations  
occurred during the backup.  
On  
On  
The cache module microcontroller has failed.  
Hot-plug fans  
Component identification 21  
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CAUTION: To avoid damage to server components, fan blanks must be installed in fan bays 1  
and 2 in a single-processor configuration.  
The only two valid fan configurations are listed in the following table.  
Configuration  
Fan bay 1 Fan bay 2 Fan bay 3 Fan bay 4 Fan bay 5 Fan bay 6  
Fan blank  
Fan blank  
Fan  
Fan  
Fan  
Fan  
1 processor  
Fan  
Fan  
Fan  
Fan  
Fan  
Fan  
2 processors  
For a single-processor configuration, four fans and two blanks are required in specific fan bays for  
redundancy. A fan failure or missing fan causes a loss of redundancy. A second fan failure or missing fan  
causes an orderly shutdown of the server.  
Installing more than the required number of fans in a single-processor configuration is not a supported  
configuration.  
For a dual-processor configuration, six fans are required for redundancy. A fan failure or missing fan causes  
a loss of redundancy. A second fan failure or missing fan causes an orderly shutdown of the server.  
The server supports variable fan speeds. The fans operate at minimum speed until a temperature change  
requires a fan speed increase to cool the server. The server shuts down during the following  
temperature-related scenarios:  
At POST and in the OS, HP iLO performs an orderly shutdown if a cautionary temperature level is  
detected. If the server hardware detects a critical temperature level before an orderly shutdown occurs,  
the server performs an immediate shutdown.  
When the Thermal Shutdown feature is disabled in RBSU, HP iLO does not perform an orderly shutdown  
when a cautionary temperature level is detected. Disabling this feature does not disable the server  
hardware from performing an immediate shutdown when a critical temperature level is detected.  
CAUTION: A thermal event can damage server components when the Thermal Shutdown feature  
is disabled in RBSU.  
Component identification 22  
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Operations  
Power up the server  
To power up the server, press the Power On/Standby button.  
Power down the server  
Before powering down the server for any upgrade or maintenance procedures, perform a backup of critical  
server data and programs.  
IMPORTANT: When the server is in standby mode, auxiliary power is still being provided to the  
system.  
To power down the server, use one of the following methods:  
Press and release the Power On/Standby button.  
This method initiates a controlled shutdown of applications and the OS before the server enters standby  
mode.  
Press and hold the Power On/Standby button for more than 4 seconds to force the server to enter  
standby mode.  
This method forces the server to enter standby mode without properly exiting applications and the OS.  
If an application stops responding, you can use this method to force a shutdown.  
Use a virtual power button selection through HP iLO.  
This method initiates a controlled remote shutdown of applications and the OS before the server enters  
standby mode.  
Before proceeding, verify the server is in standby mode by observing that the system power LED is amber.  
Extend the server from the rack  
1.  
2.  
Pull down the quick release levers on each side of the server.  
Extend the server from the rack.  
WARNING: To reduce the risk of personal injury or equipment damage, be sure that the rack is  
adequately stabilized before extending a component from the rack.  
Operations 23  
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3.  
After performing the installation or maintenance procedure, slide the server back into the rack, and then  
press the server firmly into the rack to secure it in place.  
WARNING: To reduce the risk of personal injury, be careful when pressing the server rail-release  
latches and sliding the server into the rack. The sliding rails could pinch your fingers.  
Remove the access panel  
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the  
internal system components to cool before touching them.  
CAUTION: Do not operate the server for long periods with the access panel open or removed.  
Operating the server in this manner results in improper airflow and improper cooling that can  
lead to thermal damage.  
Operations 24  
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To remove the component:  
1.  
2.  
3.  
Power down the server (on page 23).  
Extend the server from the rack (on page 23).  
Open or unlock the locking latch, slide the access panel to the rear of the chassis, and remove the  
access panel.  
Install the access panel  
1.  
Place the access panel on top of the server with the hood latch open. Allow the panel to extend past the  
rear of the server approximately 1.25 cm (0.5 in).  
2.  
3.  
Push down on the hood latch. The access panel slides to a closed position.  
Tighten the security screw on the hood latch.  
Access the product rear panel  
Opening the cable management arm  
To access the server rear panel:  
1.  
Release the cable management arm.  
Operations 25  
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2.  
Open the cable management arm. Note that the cable management arm can be right-mounted or  
left-mounted.  
Remove the hot-plug fan cage  
To remove the component:  
1.  
2.  
Power down the server (on page 23).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Extend ("Extend the server from the rack" on page 23) or remove the server from the rack.  
Remove the access panel (on page 24).  
3.  
4.  
5.  
Remove the air baffle (on page 32).  
Operations 26  
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6.  
Remove the fan cage.  
CAUTION: Do not operate the server for long periods with the access panel open or removed.  
Operating the server in this manner results in improper airflow and improper cooling that can  
lead to thermal damage.  
IMPORTANT: For optimum cooling, install fans in all primary fan locations. For more  
information, refer to the fan locations table ("Hot-plug fans" on page 21).  
To replace the component, reverse the removal procedure.  
Remove the hot-plug fan  
To remove the component:  
1.  
2.  
Extend or remove the server from the rack ("Extend the server from the rack" on page 23).  
Remove the access panel (on page 24).  
Operations 27  
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3.  
Remove the fan.  
CAUTION: Do not operate the server for long periods with the access panel open or removed.  
Operating the server in this manner results in improper airflow and improper cooling that can  
lead to thermal damage.  
IMPORTANT: For optimum cooling, install fans in all primary fan locations. For more  
information, refer to the fan locations table ("Hot-plug fans" on page 21).  
To replace the component, reverse the removal procedure.  
Remove the full-length expansion board  
WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment,  
remove the power cord to remove power from the server. The front panel Power On/Standby  
button does not completely shut off system power. Portions of the power supply and some internal  
circuitry remain active until AC power is removed.  
To remove the component:  
1.  
2.  
Power down the server (on page 23).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
3.  
4.  
5.  
6.  
Extend ("Extend the server from the rack" on page 23) or remove the server from the rack.  
Remove the access panel (on page 24).  
Disconnect any external cables that are connected to the expansion board.  
Disconnect any internal cables that are connected to the expansion board.  
Operations 28  
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7.  
Release the full-length expansion board retainer, and then remove the PCIe riser cage.  
8.  
Remove the full-length expansion board.  
To replace the component, reverse the removal procedure.  
Remove the PCI riser cage  
CAUTION: To prevent damage to the server or expansion boards, power down the server and  
remove all AC power cords before removing or installing the PCI riser cage.  
1.  
2.  
Power down the server (on page 23).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Extend the server from the rack (on page 23).  
Remove the access panel (on page 24).  
3.  
4.  
Operations 29  
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5.  
Release the full-length expansion board retainer, and then remove the PCI riser cage.  
6.  
Remove the full-length expansion board.  
Install the PCI riser cage  
WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment,  
remove the power cord to remove power from the server. The front panel Power On/Standby  
button does not completely shut off system power. Portions of the power supply and some internal  
circuitry remain active until AC power is removed.  
1.  
2.  
Power down the server (on page 23).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Extend the server from the rack (on page 23).  
Remove the access panel (on page 24).  
3.  
4.  
Operations 30  
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5.  
Install the PCI riser cage.  
6.  
7.  
8.  
9.  
Install the access panel (on page 25).  
Install the server into the rack ("Installing the server into the rack" on page 38).  
Connect each power cord to the server.  
Connect each power cord to the power source.  
10. Power up the server (on page 23).  
Secure the full-length expansion board retainer  
1.  
2.  
Power down the server (on page 23).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Extend the server from the rack (on page 23).  
Remove the access panel (on page 24).  
3.  
4.  
5.  
6.  
Install a full-length expansion board ("Installing a full-length expansion board" on page 73).  
Install the PCI riser cage (on page 30).  
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7.  
Secure the full-length expansion board retainer.  
8.  
9.  
Install the access panel (on page 25).  
Install the server into the rack ("Installing the server into the rack" on page 38).  
10. Connect each power cord to the server.  
11. Connect each power cord to the power source.  
12. Power up the server (on page 23).  
Remove the air baffle  
CAUTION: For proper cooling, do not operate the server without the access panel, baffles,  
expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize  
the amount of time the access panel is open.  
To remove the component:  
1.  
2.  
Power down the server (on page 23).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Extend or remove the server from the rack ("Extend the server from the rack" on page 23).  
Remove the access panel (on page 24).  
3.  
4.  
CAUTION: Do not detach the cable that connects the battery pack to the cache module.  
Detaching the cable causes any unsaved data in the cache module to be lost.  
IMPORTANT: It is necessary to remove the PCI riser cage only if there is a full-length expansion  
board installed.  
Operations 32  
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5.  
Release the full-length expansion board retainer, and then remove the PCI riser cage.  
6.  
Remove the air baffle.  
To replace the component, reverse the removal procedure.  
Operations 33  
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Setup  
Optional installation services  
Delivered by experienced, certified engineers, HP Care Pack services help you keep your servers up and  
running with support packages tailored specifically for HP ProLiant systems. HP Care Packs let you integrate  
both hardware and software support into a single package. A number of service level options are available  
to meet your needs.  
HP Care Pack Services offer upgraded service levels to expand your standard product warranty with  
easy-to-buy, easy-to-use support packages that help you make the most of your server investments. Some of  
the Care Pack services are:  
Hardware support  
o
o
o
6-Hour Call-to-Repair  
4-Hour 24x7 Same Day  
4-Hour Same Business Day  
Software support  
o
o
o
o
Microsoft®  
Linux  
HP ProLiant Essentials (HP SIM and RDP)  
VMware  
Integrated hardware and software support  
o
o
o
o
Critical Service  
Proactive 24  
Support Plus  
Support Plus 24  
Startup and implementation services for both hardware and software  
For more information on HP Care Pack Services, see the HP website  
Optimum environment  
When installing the server in a rack, select a location that meets the environmental standards described in  
this section.  
Space and airflow requirements  
To allow for servicing and adequate airflow, observe the following space and airflow requirements when  
deciding where to install a rack:  
Setup 34  
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Leave a minimum clearance of 63.5 cm (25 in) in front of the rack.  
Leave a minimum clearance of 76.2 cm (30 in) behind the rack.  
Leave a minimum clearance of 121.9 cm (48 in) from the back of the rack to the back of another rack  
or row of racks.  
HP servers draw in cool air through the front door and expel warm air through the rear door. Therefore, the  
front and rear rack doors must be adequately ventilated to allow ambient room air to enter the cabinet, and  
the rear door must be adequately ventilated to allow the warm air to escape from the cabinet.  
CAUTION: To prevent improper cooling and damage to the equipment, do not block the  
ventilation openings.  
When vertical space in the rack is not filled by a server or rack component, the gaps between the  
components cause changes in airflow through the rack and across the servers. Cover all gaps with blanking  
panels to maintain proper airflow.  
CAUTION: Always use blanking panels to fill empty vertical spaces in the rack. This arrangement  
ensures proper airflow. Using a rack without blanking panels results in improper cooling that can  
lead to thermal damage.  
The 9000 and 10000 Series Racks provide proper server cooling from flow-through perforations in the front  
and rear doors that provide 64 percent open area for ventilation.  
CAUTION: When using a Compaq branded 7000 series rack, install the high airflow rack door  
insert (PN 327281-B21 for 42U rack, PN 157847-B21 for 22U rack) to provide proper  
front-to-back airflow and cooling.  
CAUTION: If a third-party rack is used, observe the following additional requirements to ensure  
adequate airflow and to prevent damage to the equipment:  
Front and rear doors—If the 42U rack includes closing front and rear doors, you must allow  
5,350 sq cm (830 sq in) of holes evenly distributed from top to bottom to permit adequate  
airflow (equivalent to the required 64 percent open area for ventilation).  
Side—The clearance between the installed rack component and the side panels of the rack  
must be a minimum of 7 cm (2.75 in).  
IMPORTANT: The HP ProLiant DL380p Gen8 Server cable management arm is not supported on  
Compaq branded 7000 series racks.  
Temperature requirements  
To ensure continued safe and reliable equipment operation, install or position the system in a well-ventilated,  
climate-controlled environment.  
The maximum recommended ambient operating temperature (TMRA) for most server products is 35°C  
(95°F). The temperature in the room where the rack is located must not exceed 35°C (95°F).  
CAUTION: To reduce the risk of damage to the equipment when installing third-party options:  
Do not permit optional equipment to impede airflow around the server or to increase the  
internal rack temperature beyond the maximum allowable limits.  
Do not exceed the manufacturer’s TMRA.  
Setup 35  
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Power requirements  
Installation of this equipment must comply with local and regional electrical regulations governing the  
installation of information technology equipment by licensed electricians. This equipment is designed to  
operate in installations covered by NFPA 70, 1999 Edition (National Electric Code) and NFPA-75, 1992  
(code for Protection of Electronic Computer/Data Processing Equipment). For electrical power ratings on  
options, refer to the product rating label or the user documentation supplied with that option.  
WARNING: To reduce the risk of personal injury, fire, or damage to the equipment, do not  
overload the AC supply branch circuit that provides power to the rack. Consult the electrical  
authority having jurisdiction over wiring and installation requirements of your facility.  
CAUTION: Protect the server from power fluctuations and temporary interruptions with a  
regulating uninterruptible power supply. This device protects the hardware from damage caused  
by power surges and voltage spikes and keeps the system in operation during a power failure.  
When installing more than one server, you may need to use additional power distribution devices to safely  
provide power to all devices. Observe the following guidelines:  
Balance the server power load between available AC supply branch circuits.  
Do not allow the overall system AC current load to exceed 80% of the branch circuit AC current rating.  
Do not use common power outlet strips for this equipment.  
Provide a separate electrical circuit for the server.  
Electrical grounding requirements  
The server must be grounded properly for proper operation and safety. In the United States, you must install  
the equipment in accordance with NFPA 70, 1999 Edition (National Electric Code), Article 250, as well as  
any local and regional building codes. In Canada, you must install the equipment in accordance with  
Canadian Standards Association, CSA C22.1, Canadian Electrical Code. In all other countries, you must  
install the equipment in accordance with any regional or national electrical wiring codes, such as the  
International Electrotechnical Commission (IEC) Code 364, parts 1 through 7. Furthermore, you must be sure  
that all power distribution devices used in the installation, such as branch wiring and receptacles, are listed  
or certified grounding-type devices.  
Because of the high ground-leakage currents associated with multiple servers connected to the same power  
source, HP recommends the use of a PDU that is either permanently wired to the building’s branch circuit or  
includes a nondetachable cord that is wired to an industrial-style plug. NEMA locking-style plugs or those  
complying with IEC 60309 are considered suitable for this purpose. Using common power outlet strips for  
the server is not recommended.  
Connecting a DC power cable to a DC power source  
WARNING: To reduce the risk of electric shock or energy hazards:  
This equipment must be installed by trained service personnel, as defined by the NEC and IEC  
60950-1, Second Edition, the standard for Safety of Information Technology Equipment.  
Connect the equipment to a reliably grounded SELV source. An SELV source is a secondary  
circuit that is designed so normal and single fault conditions do not cause the voltages to  
exceed a safe level (60 V direct current).  
The branch circuit overcurrent protection must be rated 20A.  
Setup 36  
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WARNING: When installing a DC power supply, the ground wire must be connected before the  
positive or negative leads.  
WARNING: Remove power from the power supply before performing any installation steps or  
maintenance on the power supply.  
CAUTION: The server equipment connects the earthed conductor of the DC supply circuit to the  
earthing conductor at the equipment. For more information, see the HP 750W Common Slot -48V  
DC Input Hot-Plug Power Supply Kit Installation Instructions.  
CAUTION: If the DC connection exists between the earthed conductor of the DC supply circuit and  
the earthing conductor at the server equipment, the following conditions must be met:  
This equipment must be connected directly to the DC supply system earthing electrode  
conductor or to a bonding jumper from an earthing terminal bar or bus to which the DC supply  
system earthing electrode conductor is connected.  
This equipment should be located in the same immediate area (such as adjacent cabinets) as  
any other equipment that has a connection between the earthed conductor of the same DC  
supply circuit and the earthing conductor, and also the point of earthing of the DC system. The  
DC system should be earthed elsewhere.  
The DC supply source is to be located within the same premises as the equipment.  
Switching or disconnecting devices should not be in the earthed circuit conductor between the  
DC source and the point of connection of the earthing electrode conductor.  
To connect a DC power cable to a DC power source:  
1.  
2.  
Cut the DC power cord ends no shorter than 150 cm (59.06 in).  
If the power source requires ring tongues, use a crimping tool to install the ring tongues on the power  
cord wires.  
IMPORTANT: The ring tongues must be UL approved and accommodate 12 gauge wires.  
IMPORTANT: The minimum nominal thread diameter of a pillar or stud type terminal must be 3.5  
mm (0.138 in); the diameter of a screw type terminal must be 4.0 mm (0.157 in).  
3.  
Stack each same-colored pair of wires and then attach them to the same power source. The power cord  
consists of three wires (black, red, and green).  
For more information, see the HP 750W Common Slot -48V DC Input Hot-Plug Power Supply Installation  
Instructions.  
Rack warnings  
WARNING: To reduce the risk of personal injury or damage to the equipment, be sure that:  
The leveling jacks are extended to the floor.  
The full weight of the rack rests on the leveling jacks.  
The stabilizing feet are attached to the rack if it is a single-rack installation.  
The racks are coupled together in multiple-rack installations.  
Only one component is extended at a time. A rack may become unstable if more than one  
component is extended for any reason.  
Setup 37  
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WARNING: To reduce the risk of personal injury or equipment damage when unloading a rack:  
At least two people are needed to safely unload the rack from the pallet. An empty 42U rack  
can weigh as much as 115 kg (253 lb), can stand more than 2.1 m (7 ft) tall, and might  
become unstable when being moved on its casters.  
Never stand in front of the rack when it is rolling down the ramp from the pallet. Always handle  
the rack from both sides.  
Identifying the contents of the server shipping carton  
Unpack the server shipping carton and locate the materials and documentation necessary for installing the  
server. All the rack mounting hardware necessary for installing the server into the rack is included with the  
rack or the server.  
The contents of the server shipping carton include:  
Server  
Power cord  
Hardware documentation, Documentation CD, and software products  
Rack-mounting hardware  
In addition to the supplied items, you might need:  
Operating system or application software  
Hardware options  
Installing hardware options  
Install any hardware options before initializing the server. For options installation information, refer to the  
option documentation. For server-specific information, refer to "Hardware options installation (on page 42)."  
Installing the server into the rack  
CAUTION: Always plan the rack installation so that the heaviest item is on the bottom of the rack.  
Install the heaviest item first, and continue to populate the rack from the bottom to the top.  
1.  
2.  
Install the server and cable management arm into the rack. For more information, see the installation  
instructions that ship with the 2U Quick Deploy Rail System.  
Connect peripheral devices to the server. For information on identifying connectors, see "Rear panel  
components (on page 13)."  
WARNING: To reduce the risk of electric shock, fire, or damage to the equipment, do not plug  
telephone or telecommunications connectors into RJ-45 connectors.  
3.  
Connect the power cord to the rear of the server.  
Setup 38  
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4.  
Install the power cord anchors.  
5.  
Secure the cables to the cable management arm.  
IMPORTANT: When using cable management arm components, be sure to leave enough slack  
in each of the cables to prevent damage to the cables when the server is extended from the rack.  
6.  
Connect the power cord to the AC power source.  
WARNING: To reduce the risk of electric shock or damage to the equipment:  
Do not disable the power cord grounding plug. The grounding plug is an important safety  
feature.  
Plug the power cord into a grounded (earthed) electrical outlet that is easily accessible at all  
times.  
Unplug the power cord from the power supply to disconnect power to the equipment.  
Do not route the power cord where it can be walked on or pinched by items placed against it.  
Pay particular attention to the plug, electrical outlet, and the point where the cord extends from  
the server.  
Setup 39  
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Installing the operating system  
This HP ProLiant server does not ship with provisioning media. Everything needed to manage and install the  
system software and firmware is preloaded on the server.  
To operate properly, the server must have a supported operating system. For the latest information on  
operating system support, see the HP website (http://www.hp.com/go/supportos).  
To install an operating system on the server, use one of the following methods:  
Intelligent Provisioning—The iLO Management Engine is a new feature on ProLiant servers that contains  
Intelligent Provisioning for embedded deployment, updating, and provisioning capabilities. Intelligent  
Provisioning can configure the server and install an operating system, eliminating the need for  
SmartStart CDs and Smart Update Firmware DVDs.  
To install an operating system on the server with Intelligent Provisioning (local or remote):  
a. Connect the Ethernet cable between the network connector on the server and a network jack.  
b. Press the Power On/Standby button.  
c. During server POST, press the F10 key.  
d. Complete the initial Preferences and Registration portion of Intelligent Provisioning (on page 100).  
e. At the 1 Start screen, click the Configure and Install button.  
f. To finish the installation, follow the onscreen prompts. An Internet connection is required to update  
the firmware and systems software.  
Remote deployment installation—To deploy an operating system remotely, use Insight Control server  
deployment for an automated solution.  
For additional system software and firmware updates, download the HP Service Pack for ProLiant from the HP  
website (http://www.hp.com/go/spp/download). Software and firmware must be updated before using  
the server for the first time, unless any installed software or components require an older version. For more  
information, see "Keeping the system current (on page 108)."  
For more information on using these installation methods, see the HP website (http://www.hp.com/go/ilo).  
Powering on and selecting boot options  
1.  
2.  
3.  
Connect the Ethernet cable.  
Press the Power On/Standby button.  
During the initial boot:  
o
To modify the server configuration ROM default settings, press F9 when prompted from the start up  
sequence to enter the RBSU. By default, RBSU runs in the English language.  
o
If you do not need to modify the server configuration and are ready to install the system software,  
press F10 to access Intelligent Provisioning.  
NOTE: If an HP Smart Array controller has been added or is embedded in the system, the  
controller defaults to a RAID configuration based on the size and number of hard drives installed.  
For more information on modifying the controller default settings, see the documentation on the  
Documentation CD.  
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For more information on automatic configuration, see the HP ROM-Based Setup Utility User Guide on the  
Documentation CD or the iLO Management Engine Information Library  
Registering the server  
To experience quicker service and more efficient support, register the product at the HP Product Registration  
Setup 41  
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Hardware options installation  
Introduction  
If more than one option is being installed, read the installation instructions for all the hardware options and  
identify similar steps to streamline the installation process.  
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the  
internal system components to cool before touching them.  
CAUTION: To prevent damage to electrical components, properly ground the server before  
beginning any installation procedure. Improper grounding can cause electrostatic discharge.  
Processor and fan option  
The server supports single- and dual-processor operation.  
CAUTION: To avoid damage to the processor and system board, only authorized personnel  
should attempt to replace or install the processor in this server.  
CAUTION: To prevent possible server malfunction and damage to the equipment, multiprocessor  
configurations must contain processors with the same part number.  
IMPORTANT: If installing a processor with a faster speed, update the system ROM before  
installing the processor.  
To install a processor:  
1.  
2.  
Power down the server (on page 23).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Extend the server from the rack (on page 23).  
Remove the access panel (on page 24).  
3.  
4.  
Hardware options installation 42  
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5.  
If any full-length PCI riser boards are installed, release the full-length expansion board retainer, and then  
remove the PCI riser cage.  
6.  
7.  
Remove the air baffle (on page 32).  
Open the heatsink retaining bracket, and then remove the blank.  
CAUTION: The pins on the processor socket are very fragile. Any damage to them may require  
replacing the system board.  
Hardware options installation 43  
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8.  
Open each of the processor locking levers in the order indicated, and then open the processor retaining  
bracket.  
9.  
Remove the clear processor socket cover. Retain the processor socket cover for future use.  
Hardware options installation 44  
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10. Install the processor. Verify that the processor is fully seated in the processor retaining bracket by  
visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE  
SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.  
CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To  
avoid damage to the system board, do not touch the processor or the processor socket contacts.  
11. Close the processor retaining bracket. When the processor is installed properly inside the processor  
retaining bracket, the processor retaining bracket clears the flange on the front of the socket.  
CAUTION: Do not press down on the processor. Pressing down on the processor may cause  
damage to the processor socket and the system board. Press only in the area indicated on the  
processor retaining bracket.  
Hardware options installation 45  
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12. Press and hold the processor retaining bracket in place, and then close each processor locking lever.  
Press only in the area indicated on the processor retaining bracket.  
13. Remove the thermal interface protective cover from the heatsink.  
Hardware options installation 46  
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14. Install the heatsink.  
15. Remove the two fan blanks.  
Hardware options installation 47  
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16. Install the two additional fans included with the processor.  
You can install memory ("Installing a DIMM" on page 54) on the second processor. HP recommends  
balancing memory between both processors for improved performance. For more information on  
memory configurations, see "Memory Options (on page 49)."  
17. Install the air baffle ("Remove the air baffle" on page 32).  
18. Install any full-length expansion boards ("Installing a full-length expansion board" on page 73), if  
previously removed.  
19. Install the access panel (on page 25).  
20. Install the server into the rack ("Installing the server into the rack" on page 38).  
21. Connect each power cord to the server.  
22. Connect each power cord to the power source.  
23. Power up the server (on page 23).  
Hardware options installation 48  
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Memory options  
IMPORTANT: This server does not support mixing LRDIMMs, RDIMMs, UDIMMs, or HDIMMs.  
Attempting to mix any combination of these DIMMs can cause the server to halt during BIOS  
initialization.  
The memory subsystem in this server can support LRDIMMs, RDIMMs, UDIMMs, or HDIMMs:  
UDIMMs represent the most basic type of memory module and offer lower latency in one DIMM per  
channel configurations and (relatively) low power consumption, but are limited in capacity.  
RDIMMs offer larger capacities than UDIMMs and include address parity protection.  
LRDIMMs support higher densities than single- and dual-rank RDIMMs, and higher speeds than  
quad-rank RDIMMs. This support enables you to install more high capacity DIMMs, resulting in higher  
system capacities and higher bandwidth.  
HDIMMs provide faster speeds than other DIMMs. 12 DIMMs per processor are required with  
HDIMMs.  
All types are referred to as DIMMs when the information applies to all types. When specified as LRDIMM,  
RDIMM, UDIMM, or HDIMM, the information applies to that type only. All memory installed in the server must  
be the same type.  
The server supports the following DIMM speeds:  
Single- and dual-rank PC3-10600 (DDR3-1333) RDIMMs operating at up to 1333 MT/s  
Single- and dual-rank PC3-12800 (DDR3-1600) RDIMMs operating at up to 1600 MT/s  
Single- and dual-rank PC3-14900 (DDR3-1866) RDIMMs operating at up to 1866 MT/s  
Single- and dual-rank PC3-10600 (DDR3-1333) UDIMMs operating at up to 1333 MT/s  
Quad-rank PC3L-10600 (DDR3-1333) LRDIMMs, operating as dual-rank DIMMs, at up to 1333 MT/s  
Quad-rank PC3L-14900 (DDR3-1866) LRDIMMs operating as dual-rank DIMMs at up to 1866 MT/s  
For the latest memory configuration information, see the product QuickSpecs on the HP Product Bulletin  
HP SmartMemory  
HP SmartMemory, introduced for Gen8 servers, authenticates and unlocks certain features available only on  
HP Qualified memory and verifies whether installed memory has passed HP qualification and test processes.  
Qualified memory is performance-tuned for HP ProLiant and BladeSystem servers and provides future  
enhanced support through HP Active Health and manageability software.  
Certain performance features are unique with HP SmartMemory. HP SmartMemory 1.35V DDR3-1333  
Registered memory is engineered to achieve the same performance level as 1.5V memory. For example,  
while the industry supports DDR3-1333 RDIMM at 1.5V, this Gen8 server supports DDR3-1333 RDIMM up  
to 3 DIMMs per channel at 1066 MT/s running at 1.35V. This equates to up to 20% less power at the DIMM  
level with no performance penalty. In addition, the industry supports UDIMM at 2 DIMMs per channel at  
1066 MT/s. HP SmartMemory supports 2 DIMMs per channel at 1333 MT/s, or 25% greater bandwidth.  
Hardware options installation 49  
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Memory subsystem architecture  
The memory subsystem in this server is divided into channels. Each processor supports four channels, and  
each channel supports three DIMM slots, as shown in the following table.  
Channel  
Population order  
Slot number  
A
E
I
12  
11  
10  
1
B
F
J
9
8
7
2
C
G
K
1
2
3
3
4
D
H
L
4
5
6
For the location of the slot numbers, see "DIMM slot locations (on page 18)."  
This multi-channel architecture provides enhanced performance in Advanced ECC mode. This architecture  
also enables Lockstep and Online Spare Memory modes.  
DIMM slots in this server are identified by number and by letter. Letters identify the population order. Slot  
numbers indicate the DIMM slot ID for spare replacement.  
Single-, dual-, and quad-rank DIMMs  
To understand and configure memory protection modes properly, an understanding of single-, dual-, and  
quad-rank DIMMs is helpful. Some DIMM configuration requirements are based on these classifications.  
A single-rank DIMM has one set of memory chips that is accessed while writing to or reading from the  
memory. A dual-rank DIMM is similar to having two single-rank DIMMs on the same module, with only one  
rank accessible at a time. A quad-rank DIMM is, effectively, two dual-rank DIMMs on the same module. Only  
one rank is accessible at a time. The server memory control subsystem selects the proper rank within the  
DIMM when writing to or reading from the DIMM.  
Dual- and quad-rank DIMMs provide the greatest capacity with the existing memory technology. For  
example, if current DRAM technology supports 8-GB single-rank DIMMs, a dual-rank DIMM would be 16  
GB, and a quad-rank DIMM would be 32 GB.  
LRDIMMs are labeled as quad-rank DIMMs; however, they function more like dual-rank DIMMs. There are  
four ranks of DRAM on the DIMM, but the LRDIMM buffer creates an abstraction that allows the DIMM to  
appear as a dual-rank DIMM to the system. The LRDIMM buffer also isolates the electrical loading of the  
DRAM from the system to allow for faster operation. These two changes allow the system to support up to  
three LRDIMMs per memory channel, providing for up to 50% greater memory capacity and higher memory  
operating speed compared to quad-rank RDIMMs.  
Hardware options installation 50  
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DIMM identification  
To determine DIMM characteristics, use the label attached to the DIMM and the following illustration and  
table.  
Item Description  
Definition  
Size  
1
2
Rank  
1R = Single-rank  
2R = Dual-rank  
4R = Quad-rank  
Data width  
x4 = 4-bit  
x8 = 8-bit  
3
4
Voltage rating  
L = Low voltage (1.35v)  
U = Ultra low voltage (1.25v)  
Blank or omitted = Standard  
Memory speed  
DIMM type  
12800 = 1600-MT/s  
10600 = 1333-MT/s  
8500 = 1066-MT/s  
5
6
R = RDIMM (registered)  
E = UDIMM (unbuffered with ECC)  
L = LRDIMM (load reduced)  
H = HDIMM (HyperCloud)  
For the latest supported memory information, see the QuickSpecs on the HP website  
geographic region, and then locate the product by name or product category.  
Memory configurations  
To optimize server availability, the server supports the following AMP modes:  
Advanced ECC—provides up to 4-bit error correction and enhanced performance over Lockstep mode.  
This mode is the default option for this server.  
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Online spare memory—provides protection against failing or degraded DIMMs. Certain memory is  
reserved as spare, and automatic failover to spare memory occurs when the system detects a DIMM that  
is degrading. This allows DIMMs that have a higher probability of receiving an uncorrectable memory  
error (which would result in system downtime) to be removed from operation.  
Advanced Memory Protection options are configured in RBSU. If the requested AMP mode is not supported  
by the installed DIMM configuration, the server boots in Advanced ECC mode. For more information, see  
"HP ROM-Based Setup Utility (on page 103)."  
The server also can operate in independent channel mode or combined channel mode (lockstep). When  
running in lockstep mode, you gain reliability in one of two ways:  
If running with UDIMMs (built with x8 DRAM devices), the system can survive a complete DRAM failure  
(SDDC). In independent channel mode, this failure would be an uncorrectable error.  
If running with RDIMM (built with x4 DRAM devices), the system can survive the complete failure of two  
DRAM devices (DDDC). Running in independent mode, the server can only survive the complete failure  
of a single DRAM device (SDDC).  
Maximum capacity  
DIMM type  
DIMM rank  
Single-rank  
Dual-rank  
One processor  
96 GB  
Two processors  
192 GB  
RDIMM  
RDIMM  
LRDIMM  
UDIMM  
UDIMM  
HDIMM  
192 GB  
384 GB  
32 GB  
384 GB  
Quad-rank  
Single-rank  
Dual-rank  
768 GB  
64 GB  
64 GB  
128 GB  
Dual-rank  
192 GB  
384 GB  
For the latest memory configuration information, see the QuickSpecs on the HP website  
Advanced ECC memory configuration  
Advanced ECC memory is the default memory protection mode for this server. Standard ECC can correct  
single-bit memory errors and detect multi-bit memory errors. When multi-bit errors are detected using  
Standard ECC, the error is signaled to the server and causes the server to halt.  
Advanced ECC protects the server against some multi-bit memory errors. Advanced ECC can correct both  
single-bit memory errors and 4-bit memory errors if all failed bits are on the same DRAM device on the DIMM.  
Advanced ECC provides additional protection over Standard ECC because it is possible to correct certain  
memory errors that would otherwise be uncorrected and result in a server failure. Using HP Advanced  
Memory Error Detection technology, the server provides notification when a DIMM is degrading and has a  
higher probability of uncorrectable memory error.  
Online Spare memory configuration  
Online spare memory provides protection against degraded DIMMs by reducing the likelihood of  
uncorrected memory errors. This protection is available without any operating system support.  
Online spare memory protection dedicates one rank of each memory channel for use as spare memory. The  
remaining ranks are available for OS and application use. If correctable memory errors occur at a rate  
higher than a specific threshold on any of the non-spare ranks, the server automatically copies the memory  
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contents of the degraded rank to the online spare rank. The server then deactivates the failing rank and  
automatically switches over to the online spare rank.  
Lockstep memory configuration  
Lockstep mode provides protection against multi-bit memory errors that occur on the same DRAM device.  
Lockstep mode can correct any single DRAM device failure on x4 and x8 DIMM types. The DIMMs in each  
channel must have identical HP part numbers.  
General DIMM slot population guidelines  
Observe the following guidelines for all AMP modes:  
Install DIMMs only if the corresponding processor is installed.  
When two processors are installed, balance the DIMMs across the two processors.  
White DIMM slots denote the first slot of a channel (Ch 1-A, Ch 2-B, Ch 3-C, Ch 4-D).  
Do not mix LRDIMMs, UDIMMs, RDIMMs, or HDIMMs.  
Do not install more than two UDIMMs per channel. UDIMMs should not be installed in slots Ch 1-I, Ch  
2-J, Ch 3-K, or Ch 4-L.  
HDIMMs require 12 DIMMs per processor.  
When two processors are installed, install the DIMMs in sequential alphabetical order balanced  
between the two processors: P1-A, P2-A, P1-B, P2-B, P1-C, P2-C, and so on.  
For detailed memory configuration rules and guidelines, use the Online DDR3 Memory Configuration Tool  
DIMM speeds are supported as indicated in the following table.  
Populated slots  
(per channel)  
Rank  
Speeds supported (MT/s)  
Single- or dual-rank  
Quad-rank  
1333, 1600  
1333  
1
1
2
3
Single- or dual-rank  
Single- or dual-rank  
1333  
1066  
Advanced ECC population guidelines  
For Advanced ECC mode configurations, observe the following guidelines:  
Observe the general DIMM slot population guidelines.  
DIMMs may be installed individually.  
Online spare population  
For Online Spare memory mode configurations, observe the following guidelines:  
Observe the general DIMM slot population guidelines.  
Each channel must have a valid online spare configuration.  
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Each channel can have a different valid online spare configuration.  
Each populated channel must have a spare rank:  
o
o
A single dual-rank DIMM is not a valid configuration.  
LRDIMMs are treated as dual-rank DIMMs.  
Lockstep Memory population guidelines  
For Lockstep memory mode configurations, observe the following guidelines:  
Observe the general DIMM slot population guidelines.  
DIMM configuration on all channels of a processor must be identical.  
In multi-processor configurations, each processor must have a valid Lockstep Memory configuration.  
In multi-processor configurations, each processor may have a different valid Lockstep Memory  
configuration.  
Population order  
For memory configurations with a single processor or multiple processors, populate the DIMM slots in the  
following order:  
LRDIMM: Sequentially in alphabetical order (A through L)  
RDIMM: Sequentially in alphabetical order (A through L)  
UDIMM: A through H, sequentially in alphabetical order. Do not populate DIMM slots I through L.  
HDIMM: All 12 DIMMs per processor must be populated.  
After installing the DIMMs, use RBSU to configure Advanced ECC, online spare, or lockstep memory support.  
Installing a DIMM  
The server supports up to 24 DIMMs. To install a DIMM:  
1.  
2.  
Power down the server (on page 23).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Extend the server from the rack (on page 23).  
Remove the access panel (on page 24).  
Remove the air baffle (on page 32).  
Open the DIMM slot latches.  
3.  
4.  
5.  
6.  
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7.  
Install the DIMM.  
8.  
9.  
Install the access panel (on page 25).  
Install the server into the rack ("Installing the server into the rack" on page 38).  
10. Connect each power cord to the server.  
11. Connect each power cord to the power source.  
12. Power up the server (on page 23).  
Use RBSU ("HP ROM-Based Setup Utility" on page 103) to configure the memory mode.  
For more information about LEDs and troubleshooting failed DIMMs, see "Systems Insight Display LED  
combinations (on page 12)."  
Hot-plug hard drive options  
When adding hard drives to the server, observe the following general guidelines:  
The system automatically sets all device numbers.  
If only one hard drive is used, install it in the bay with the lowest device number.  
Drives should be the same capacity to provide the greatest storage space efficiency when drives are  
grouped together into the same drive array.  
Installing a hot-plug SAS or SATA hard drive  
The server can support 8 SAS or SATA hard drives in a SFF or LFF configuration, or 16 drives in a SFF  
configuration with the optional hard drive cage ("Hard drive cage option" on page 76).  
To install the component:  
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1.  
Remove the drive blank.  
2.  
Prepare the drive.  
3.  
Install the drive.  
4.  
Determine the status of the drive from the drive LED definitions ("Hot-plug drive LED definitions" on page  
Removing a hot-plug SAS or SATA hard drive  
CAUTION: For proper cooling, do not operate the server without the access panel, baffles,  
expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize  
the amount of time the access panel is open.  
1.  
2.  
Determine the status of the drive from the hot-plug SAS drive LED combinations ("Hot-plug drive LED  
Back up all server data on the drive.  
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3.  
Remove the drive.  
Controller options  
The server ships with an embedded Smart Array P420i controller. For more information about the controller  
and its features, see the HP Smart Array Controllers for HP ProLiant Servers User Guide on the HP website  
(http://www.hp.com/support/SAC_UG_ProLiantServers_en). To configure arrays, see the Configuring  
Arrays on HP Smart Array Controllers Reference Guide on the HP website  
Upgrade options exist for the integrated array controller. For a list of supported options, see the QuickSpecs  
The server supports FBWC. FBWC consists of a cache module and a capacitor pack. The DDR cache module  
buffers and stores data being written by the controller. When the system is powered on, the capacitor pack  
charges fully in about 5 minutes. In the event of a system power failure, a fully charged capacitor pack  
provides power for up to 80 seconds. During that interval, the controller transfers the cached data from DDR  
memory to flash memory, where the data remains indefinitely or until a controller retrieves the data.  
CAUTION: The cache module connector does not use the industry-standard DDR3 mini-DIMMs.  
Do not use the controller with cache modules designed for other controller models, because the  
controller can malfunction and you can lose data. Also, do not transfer this cache module to an  
unsupported controller model, because you can lose data.  
CAUTION: To prevent a server malfunction or damage to the equipment, do not add or remove  
the battery pack while an array capacity expansion, RAID level migration, or stripe size migration  
is in progress.  
CAUTION: After the server is powered down, wait 15 seconds and then check the amber LED  
before unplugging the cable from the cache module. If the amber LED blinks after 15 seconds, do  
not remove the cable from the cache module. The cache module is backing up data, and data is  
lost if the cable is detached.  
IMPORTANT: The battery pack might have a low charge when installed. In this case, a POST  
error message is displayed when the server is powered up, indicating that the battery pack is  
temporarily disabled. No action is necessary on your part. The internal circuitry automatically  
recharges the batteries and enables the battery pack. This process might take up to four hours.  
During this time, the cache module functions properly, but without the performance advantage of  
the battery pack.  
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NOTE: The data protection and the time limit also apply if a power outage occurs. When power  
is restored to the system, an initialization process writes the preserved data to the hard drives.  
Installing the flash-backed write cache module  
CAUTION: The cache module connector does not use the industry-standard DDR3 mini-DIMMs.  
Do not use the controller with cache modules designed for other controller models, because the  
controller can malfunction and you can lose data. Also, do not transfer this cache module to an  
unsupported controller model, because you can lose data.  
To install the component:  
1.  
2.  
Back up all data.  
Close all applications.  
CAUTION: In systems that use external data storage, be sure that the server is the first unit to be  
powered down and the last to be powered back up. Taking this precaution ensures that the system  
does not erroneously mark the drives as failed when the server is powered up.  
3.  
4.  
Power down the server (on page 23).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Extend the server from the rack (on page 23).  
Remove the access panel (on page 24).  
Install the cache module.  
5.  
6.  
7.  
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8.  
Connect the capacitor pack cable to the connector on the top of the cache module.  
9.  
Install the access panel (on page 25).  
10. Install the server into the rack ("Installing the server into the rack" on page 38).  
11. Connect each power cord to the server.  
12. Connect each power cord to the power source.  
13. Power up the server (on page 23).  
Installing the flash-backed write cache capacitor pack  
CAUTION: The cache module connector does not use the industry-standard DDR3 mini-DIMMs.  
Do not use the controller with cache modules designed for other controller models, because the  
controller can malfunction and you can lose data. Also, do not transfer this cache module to an  
unsupported controller model, because you can lose data.  
To install the component:  
1.  
2.  
Back up all data.  
Close all applications.  
CAUTION: In systems that use external data storage, be sure that the server is the first unit to be  
powered down and the last to be powered back up. Taking this precaution ensures that the system  
does not erroneously mark the drives as failed when the server is powered up.  
3.  
4.  
Power down the server (on page 23).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Extend the server from the rack (on page 23).  
Remove the access panel (on page 24).  
5.  
6.  
7.  
Install the FBWC module ("Installing the flash-backed write cache module" on page 58), if it is not  
already installed.  
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8.  
Connect the capacitor pack cable to the connector on the top of the cache module.  
9.  
Install one or two FBWC capacitor packs into the FBWC capacitor pack holder.  
10. Install the FBWC capacitor pack holder into the server:  
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o
8 or 16 drive SFF  
o
8 drive LFF  
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o
12 drive LFF or 25 drive SFF, or secondary location for 8 or 16 drive SFF or 8 drive LFF  
o
Secondary location for 12 drive LFF or 25 drive SFF:  
a. Remove the Velcro liner.  
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b. Install the FBWC capacitor pack holder into the server.  
11. Install the access panel (on page 25).  
12. Install the server into the rack ("Installing the server into the rack" on page 38).  
13. Connect each power cord to the server.  
14. Connect each power cord to the power source.  
15. Power up the server (on page 23).  
Optical drive option  
1.  
2.  
Power down the server (on page 23).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Extend the server from the rack (on page 23).  
Remove the access panel (on page 24).  
3.  
4.  
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5.  
Remove the existing media drive option or blank.  
6.  
Slide the optical drive into the drive bay.  
7.  
Connect the power and data cable to the system board and the optical drive.  
8.  
Install the access panel (on page 25).  
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9.  
Install the server into the rack ("Installing the server into the rack" on page 38).  
10. Connect each power cord to the server.  
11. Connect each power cord to the power source.  
12. Power up the server (on page 23).  
Redundant hot-plug power supply option  
CAUTION: All power supplies installed in the server must have the same output power capacity.  
Verify that all power supplies have the same part number and label color. The system becomes  
unstable and may shut down when it detects mismatched power supplies.  
Label color  
Output  
460W  
Blue  
750W  
Orange  
White  
Green  
750W 48V DC  
1,200W  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all bays are populated with either a component or a blank.  
To install the component:  
1.  
2.  
Access the product rear panel (on page 25).  
Remove the blank.  
WARNING: To reduce the risk of personal injury from hot surfaces, allow the power supply or  
power supply blank to cool before touching it.  
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3.  
Insert the power supply into the power supply bay until it clicks into place.  
4.  
5.  
Connect the power cord to the power supply.  
Route the power cord. Use best practices when routing power cords and other cables. A cable  
management arm is available to help with routing. To obtain a cable management arm, contact an HP  
authorized reseller.  
6.  
7.  
Connect the power cord to the AC power source.  
Be sure that the power supply LED is green ("Rear panel LEDs and buttons" on page 14).  
48V DC power supply option  
One of the following optional HP input cables with pre-fastened ring tongues may be purchased from HP or  
an authorized reseller:  
A5S97A—1.3-m (4.27-ft) 48V DC Power Cable Kit  
A5S98A—2.5-m (8.20-ft) 48V DC Power Cable Kit  
If you are not using an optional HP input cable, use an HP-approved 10 or 12 AWG green and yellow  
ground cable, no shorter than 150 cm (59.06 in), and 10 or 12 AWG power cables.  
To install the component:  
1.  
Remove the blank.  
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2.  
If you are not using an optional HP input cable, with the ground cable disconnected from the 48V power  
source, crimp the ring tongues to the power and ground cables coming from the 48V source.  
IMPORTANT: The power supply uses two power ring tongues and one ground ring tongue. They  
are not interchangeable.  
3.  
Remove the safety cover from the terminal block on the front of the power supply.  
4.  
Remove the screws from the terminal block.  
IMPORTANT: The minimum nominal thread diameter of a pillar or stud type terminal must be 3.5  
mm (0.138 in); the diameter of a screw type terminal must be 4.0 mm (0.157 in).  
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5.  
Attach the ground (earthed) wire to the ground screw and washer and tighten to 1.47 N m (13 lb-in) of  
torque. The ground wire must be connected before the positive or negative lead wires.  
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6.  
Attach the power ring tongues to the terminal block, following the polarity label below the terminal  
block, and then tighten the screws to 1.47 N m (13 lb-in) of torque.  
7.  
Replace the safety cover.  
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8.  
Insert the power supply into the power supply bay until it clicks into place.  
9.  
Route the power cord. Use best practices when routing power cords and other cables. A cable  
management arm is available to help with routing. To obtain a cable management arm, contact an HP  
authorized reseller.  
10. Make sure the 48V DC power source is off or the PDU breaker is in the off position, and then connect  
the power cord to the 48V DC power source or PDU.  
11. Turn on the 48V power source or switch the PDU breaker to the on position to supply 48V to the power  
supply.  
12. Be sure that the green power supply LED is on.  
FlexibleLOM option  
WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment,  
remove the power cord to remove power from the server. The front panel Power On/Standby  
button does not completely shut off system power. Portions of the power supply and some internal  
circuitry remain active until AC power is removed.  
1.  
2.  
Power down the server (on page 23).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Remove any attached network cables.  
Extend the server from the rack (on page 23).  
Remove the access panel (on page 24).  
Loosen the thumbscrew.  
3.  
4.  
5.  
6.  
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7.  
Remove the existing FlexibleLOM.  
To replace the component:  
1.  
Firmly seat the FlexibleLOM in the slot, and then tighten the thumbscrew.  
2.  
3.  
4.  
5.  
6.  
7.  
Install the access panel (on page 25).  
Slide the server into the rack.  
Connect the LAN segment cables.  
Connect each power cord to the server.  
Connect each power cord to the power source.  
Power up the server (on page 23).  
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Expansion board options  
The server supports PCI Express expansion boards. The server ships with PCIe riser boards and expansion  
slots. PCIe expansion boards are supported with optional riser boards.  
Removing the expansion slot blanks  
WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment,  
remove the power cord to remove power from the server. The front panel Power On/Standby  
button does not completely shut off system power. Portions of the power supply and some internal  
circuitry remain active until AC power is removed.  
CAUTION: For proper cooling, do not operate the server without the access panel, baffles,  
expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize  
the amount of time the access panel is open.  
To remove the component:  
1.  
2.  
Power down the server (on page 23).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
3.  
4.  
5.  
6.  
7.  
8.  
Extend ("Extend the server from the rack" on page 23) or remove the server from the rack.  
Remove the access panel (on page 24).  
Disconnect any external cables that are connected to the expansion board.  
Disconnect any internal cables that are connected to the expansion board.  
Remove the PCIe riser cage ("Remove the PCI riser cage" on page 29).  
Remove the expansion slot blank.  
To replace the component, reverse the removal procedure.  
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Installing a half-length expansion board  
1.  
2.  
Power down the server (on page 23).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Extend the server from the rack (on page 23).  
Remove the access panel (on page 24).  
3.  
4.  
5.  
6.  
7.  
Remove the PCI riser cage (on page 29).  
Remove the expansion slot blank ("Removing the expansion slot blanks" on page 72).  
Install the expansion board.  
8.  
9.  
Connect any required internal or external cables to the expansion board. See the documentation that  
ships with the expansion board.  
Install the PCI riser cage (on page 30).  
10. Install the access panel (on page 25).  
11. Install the server into the rack ("Installing the server into the rack" on page 38).  
12. Connect each power cord to the server.  
13. Connect each power cord to the power source.  
14. Power up the server (on page 23).  
Installing a full-length expansion board  
1.  
2.  
Power down the server (on page 23).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Extend the server from the rack (on page 23).  
Remove the access panel (on page 24).  
3.  
4.  
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5.  
Release the full-length expansion board retainer, and then remove the PCI riser cage.  
6.  
7.  
8.  
Remove the expansion slot cover ("Removing the expansion slot blanks" on page 72).  
Install the expansion board.  
Connect any required internal or external cables to the expansion board. See the documentation that  
ships with the expansion board.  
9.  
Install the PCI riser cage (on page 30).  
10. Secure the full-length expansion board retainer (on page 31) if any full-length expansion boards are  
installed.  
11. Install the access panel (on page 25).  
12. Install the server into the rack ("Installing the server into the rack" on page 38).  
13. Connect each power cord to the server.  
14. Connect each power cord to the power source.  
15. Power up the server (on page 23).  
Secondary PCI riser cage option  
WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment,  
remove the power cord to remove power from the server. The front panel Power On/Standby  
button does not completely shut off system power. Portions of the power supply and some internal  
circuitry remain active until AC power is removed.  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all PCI slots have either an expansion slot cover or an expansion board installed.  
IMPORTANT: The secondary PCI riser cage option requires both processors.  
To install the component:  
1.  
Power down the server (on page 23).  
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2.  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Extend the server from the rack (on page 23).  
Remove the access panel (on page 24).  
Remove the PCI riser blank.  
3.  
4.  
5.  
6.  
Remove the blank from the optional secondary PCI riser cage.  
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7.  
Install an expansion board into the PCI riser cage.  
8.  
Install the optional secondary PCI riser cage.  
9.  
If not already installed, install the secondary processor ("Processor and fan option" on page 42).  
10. Install the access panel (on page 25).  
11. Install the server into the rack ("Installing the server into the rack" on page 38).  
12. Connect each power cord to the server.  
13. Connect each power cord to the power source.  
14. Power up the server (on page 23).  
Hard drive cage option  
A SAS expander card or an additional SAS controller option is required to support the hard drive cage  
option.  
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To install the component:  
1.  
2.  
Power down the server (on page 23).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Extend the server from the rack (on page 23).  
Remove the access panel (on page 24).  
3.  
4.  
5.  
Release the full-length expansion board retainer, and then remove the PCI riser cage.  
6.  
Remove the air baffle.  
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7.  
Remove the fan cage.  
8.  
Disconnect and remove the optical drive cable, if installed.  
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9.  
Using a T-15 Torx screwdriver, remove the two optical drive retaining screws, and then remove the  
optical drive cage.  
10. Install the optional hard drive cage.  
11. Install the hard drives and hard drive blanks.  
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12. To access the cables, remove the fan bracket on the right side of the chassis.  
13. Connect the cables:  
a. Connect one end of the power cable to the SAS backplane and the other end to the power  
connector on the system board.  
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b. Remove the existing SAS cable from the cable guide and from the system board.  
14. Connect the end of each SAS signal cable to the SAS backplane, and then route the SAS signal cables  
behind the cable guide. Do not connect the other ends yet.  
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15. Install the fan bracket. Be sure that the cables are properly routed in the channel along the fan bracket.  
16. Remove the blank from the PCI riser cage.  
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17. Install the SAS controller board into the PCI riser cage.  
18. Install the fan cage.  
19. Install the air baffle.  
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If you do not have a full-length expansion board, the air baffle can be installed last.  
20. Connect the other end of the SAS signal cables to the SAS controller board and to the system board.  
Then, install the PCI riser cage.  
SAS cables can be connected to the PCI riser cage and the system board before or after the PCI riser  
cage is installed. For ease of accessing connectors, HP recommends connecting the cables before the  
PCI riser cage is installed.  
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Completed SAS cabling:  
21. Make sure any installed full-length expansion boards are seated in the retainer clip on the air baffle.  
22. Install the access panel (on page 25).  
23. Install the server into the rack.  
24. Connect each power cord to the server.  
25. Connect each power cord to the power source.  
26. Power up the server (on page 23).  
2U rack bezel option  
The 2U rack bezel helps prevent any unauthorized physical access to the server in the rack configuration. To  
access the hard drive cage, you must unlock and open the 2U rack bezel.  
To unlock the 2U rack bezel, use the key provided with the kit.  
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Install the 2U rack bezel into the chassis, and then lock the 2U rack bezel with the key.  
HP Trusted Platform Module option  
For more information about product features, specifications, options, configurations, and compatibility, see  
the product QuickSpecs on the HP Product Bulletin website (http://www.hp.com/go/productbulletin).  
Use these instructions to install and enable a TPM on a supported server. This procedure includes three  
sections:  
1.  
2.  
3.  
Installing the Trusted Platform Module board.  
Retaining the recovery key/password (on page 88).  
Enabling the Trusted Platform Module (on page 88).  
Enabling the TPM requires accessing RBSU ("HP ROM-Based Setup Utility" on page 103). For more  
information about RBSU, see the HP website (http://www.hp.com/go/ilomgmtengine/docs).  
TPM installation requires the use of drive encryption technology, such as the Microsoft Windows BitLocker  
Drive Encryption feature. For more information on BitLocker, see the Microsoft website  
CAUTION: Always observe the guidelines in this document. Failure to follow these guidelines  
can cause hardware damage or halt data access.  
When installing or replacing a TPM, observe the following guidelines:  
Do not remove an installed TPM. Once installed, the TPM becomes a permanent part of the system  
board.  
When installing or replacing hardware, HP service providers cannot enable the TPM or the encryption  
technology. For security reasons, only the customer can enable these features.  
When returning a system board for service replacement, do not remove the TPM from the system board.  
When requested, HP Service provides a TPM with the spare system board.  
Any attempt to remove an installed TPM from the system board breaks or disfigures the TPM security  
rivet. Upon locating a broken or disfigured rivet on an installed TPM, administrators should consider the  
system compromised and take appropriate measures to ensure the integrity of the system data.  
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When using BitLocker, always retain the recovery key/password. The recovery key/password is  
required to enter Recovery Mode after BitLocker detects a possible compromise of system integrity.  
HP is not liable for blocked data access caused by improper TPM use. For operating instructions, see the  
encryption technology feature documentation provided by the operating system.  
Installing the Trusted Platform Module board  
WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment,  
remove the power cord to remove power from the server. The front panel Power On/Standby  
button does not completely shut off system power. Portions of the power supply and some internal  
circuitry remain active until AC power is removed.  
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the  
internal system components to cool before touching them.  
1.  
2.  
Power down the server (on page 23).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Remove the server from the rack, if necessary.  
Place the server on a flat, level work surface.  
Remove the access panel (on page 24).  
Remove the PCI riser cage (on page 29).  
Remove the air baffle (on page 32).  
3.  
4.  
5.  
6.  
7.  
CAUTION: Any attempt to remove an installed TPM from the system board breaks or disfigures  
the TPM security rivet. Upon locating a broken or disfigured rivet on an installed TPM,  
administrators should consider the system compromised and take appropriate measures to ensure  
the integrity of the system data.  
8.  
Install the TPM board. Press down on the connector to seat the board ("System board components" on  
page 15).  
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9.  
Install the TPM security rivet by pressing the rivet firmly into the system board.  
10. Install the air baffle.  
11. Install the PCI riser cage (on page 30).  
12. Install the access panel (on page 25).  
13. Install the server into the rack ("Installing the server into the rack" on page 38).  
14. Connect each power cord to the server.  
15. Connect each power cord to the power source.  
16. Power up the server (on page 23).  
Retaining the recovery key/password  
The recovery key/password is generated during BitLocker™ setup, and can be saved and printed after  
BitLocker™ is enabled. When using BitLocker™, always retain the recovery key/password. The recovery  
key/password is required to enter Recovery Mode after BitLocker™ detects a possible compromise of system  
integrity.  
To help ensure maximum security, observe the following guidelines when retaining the recovery  
key/password:  
Always store the recovery key/password in multiple locations.  
Always store copies of the recovery key/password away from the server.  
Do not save the recovery key/password on the encrypted hard drive.  
Enabling the Trusted Platform Module  
1.  
2.  
3.  
4.  
5.  
When prompted during the start-up sequence, access RBSU by pressing the F9 key.  
From the Main Menu, select Server Security.  
From the Server Security Menu, select Trusted Platform Module.  
From the Trusted Platform Module Menu, select TPM Functionality.  
Select Enable, and then press the Enter key to modify the TPM Functionality setting.  
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6.  
7.  
8.  
Press the Esc key to exit the current menu, or press the F10 key to exit RBSU.  
Reboot the server.  
Enable the TPM in the OS. For OS-specific instructions, see the OS documentation.  
CAUTION: When a TPM is installed and enabled on the server, data access is locked if you fail  
to follow the proper procedures for updating the system or option firmware, replacing the system  
board, replacing a hard drive, or modifying OS application TPM settings.  
For more information on firmware updates and hardware procedures, see the HP Trusted Platform Module  
Best Practices White Paper on the HP website (http://www.hp.com/support).  
For more information on adjusting TPM usage in BitLocker™, see the Microsoft website  
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Cabling  
SAS hard drive cabling  
SFF hard drive cabling  
SFF cabling, with optional drive cage  
Cabling 90  
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LFF hard drive cabling  
Optical drive cabling  
Cabling 91  
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FBWC cabling  
8 or 16 drive SFF  
8 drive LFF  
Cabling 92  
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12 drive LFF or 25 drive SFF  
PCIe option  
Depending on the server configuration, you may need to remove the primary PCI riser cage ("Remove  
the PCI riser cage" on page 29) before cabling to a PCIe expansion board.  
Chipset SATA cable option  
With the chipset SATA cable option, the chipset SATA controller can be used with a single SATA hard drive  
that is installed in one hard drive bay of the SFF or LFF hard drive cage.  
When using the chipset SATA configuration, the following conditions apply:  
o
o
Only drive bay 5 is enabled. The remaining drive bays are disabled.  
The optical bay is disabled because the chipset SATA controller port on the system board is  
redirected from the optical bay to the drive cage.  
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o
o
o
Hard drive status LEDs are not supported.  
Hard drive thermal status monitoring is not supported.  
Hot-plug operation is not supported.  
Because only one drive bay is enabled, all remaining drives can be removed.  
For proper thermal cooling, install blanks in all bays that do not have a drive installed. Order a sufficient  
number of 6.35-cm (2.5-in) or 8.89-cm (3.5-in) hard drive blank option kits from an HP authorized  
reseller. For more information, see the server maintenance and service guide.  
The standard SATA driver is included with supported operating systems. No additional driver is  
required.  
To install the component:  
1.  
2.  
Power down the server (on page 23).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Extend the server from the rack (on page 23).  
Remove the access panel (on page 24).  
3.  
4.  
WARNING: Eliminate the risk of electric shock by removing all AC power from the system before  
installing or replacing any non-hot-plug hardware option. Disconnect all power cords to  
completely remove power from the server.  
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the  
internal system components to cool before touching them.  
IMPORTANT: It is necessary to remove the PCI riser cage only if there is a full-length expansion  
board installed.  
5.  
Release the full-length expansion board retainer, and then remove the PCI riser cage.  
6.  
7.  
Remove the air baffle (on page 32).  
Remove the fan cage.  
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8.  
Disconnect any SAS cables from the hard drive cage and either the embedded SAS controller or an  
optional SAS controller. Do not disconnect the power cable.  
9.  
Disconnect the SATA cable from the optical drive and the SATA connector on the system board. The  
optical bay is disabled with the chipset SATA cable option.  
10. Connect the chipset SATA cable:  
a. Connect the chipset SATA cable connector to the chipset SATA controller port on the system board.  
The chipset SATA connector on the SATA cable is narrower than the chipset SATA controller port  
header on the system board.  
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b. Connect the remaining chipset SATA cable connector to the SATA header on the hard drive cage.  
11. Coil the cables behind the hard drive backplane to minimize airflow impact.  
12. Install the fan cage.  
13. Install the air baffle ("Remove the air baffle" on page 32).  
14. Install the PCI riser cage (on page 30), if removed.  
15. Secure any full-length PCI expansion boards with the retaining latch on the air baffle ("Secure the  
16. Install the access panel (on page 25).  
17. Install the server in the rack ("Installing the server into the rack" on page 38).  
18. Remove any installed hard drives ("Removing a hot-plug SAS or SATA hard drive" on page 56).  
19. Install a SATA hard drive ("Installing a hot-plug SAS or SATA hard drive" on page 55) in hard drive bay  
5.  
20. Install hard drive blanks in any empty hard drive bays.  
21. Connect each power cord to the server.  
22. Connect each power cord to the power source.  
23. Power up the server (on page 23).  
24. Using the HP ROM-Based Setup Utility (on page 103), disable the embedded HP Smart Array P420i  
Controller, if necessary.  
150W PCIe power cable option  
CAUTION: To prevent damage to the server or expansion boards, power down the server and  
remove all AC power cords before removing or installing the PCI expansion cage.  
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Connect the cable as indicated.  
Cabling 97  
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Software and configuration utilities  
Server mode  
The software and configuration utilities presented in this section operate in online mode, offline mode, or in  
both modes.  
Software or configuration utility  
Server mode  
Online and Offline  
HP iLO (on page 98)  
Online and Offline  
Online and Offline  
Offline  
Active Health System (on page 99)  
Integrated Management Log (on page 100)  
Intelligent Provisioning (on page 100)  
Online and Offline  
Online  
HP Insight Diagnostics (on page 101)  
HP Insight Remote Support software  
HP Insight Online  
Online  
Offline  
Erase Utility (on page 101)  
Scripting Toolkit (on page 102)  
Online  
Online and Offline  
Online and Offline  
Offline  
HP Service Pack for ProLiant (on page 102)  
HP Smart Update Manager (on page 102)  
HP ROM-Based Setup Utility (on page 103)  
Array Configuration Utility (on page 105)  
Option ROM Configuration for Arrays (on page 107)  
ROMPaq utility (on page 107)  
Online and Offline  
Offline  
Offline  
HP product QuickSpecs  
For more information about product features, specifications, options, configurations, and compatibility, see  
the product QuickSpecs on the HP Product Bulletin website (http://www.hp.com/go/productbulletin).  
HP iLO Management Engine  
The HP iLO Management Engine is a set of embedded management features supporting the complete  
lifecycle of the server, from initial deployment through ongoing management.  
HP iLO  
The HP iLO subsystem is a standard component of selected HP ProLiant servers that simplifies initial server  
setup, server health monitoring, power and thermal optimization, and remote server administration. The HP  
iLO subsystem includes an intelligent microprocessor, secure memory, and a dedicated network interface.  
This design makes HP iLO independent of the host server and its operating system.  
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HP iLO enables and manages the Active Health System (on page 99) and also features Agentless  
Management. All key internal subsystems are monitored by HP iLO. SNMP alerts are sent directly by HP iLO  
regardless of the host operating system or even if no host operating system is installed.  
HP Insight Remote Support software is also available in HP iLO with no operating system software, drivers,  
or agents.  
Using HP iLO, you can do the following:  
Access a high-performance and secure Remote Console to the server from anywhere in the world.  
Use the shared HP iLO Remote Console to collaborate with up to six server administrators.  
Remotely mount high-performance Virtual Media devices to the server.  
Securely and remotely control the power state of the managed server.  
Have true Agentless Management with SNMP alerts from HP iLO regardless of the state of the host  
server.  
Access Active Health System troubleshooting features through the HP iLO interface.  
Subscribe to HP Insight Remote Support software without installing any drivers or agents.  
For more information about HP iLO features (which may require an iLO Advanced Pack or iLO Advanced for  
BladeSystem license), see the HP iLO documentation on the Documentation CD or on the HP website  
Active Health System  
HP Active Health System provides the following features:  
Combined diagnostics tools/scanners  
Always on, continuous monitoring for increased stability and shorter downtimes  
Rich configuration history  
Health and service alerts  
Easy export and upload to Service and Support  
The HP Active Health System monitors and records changes in the server hardware and system configuration.  
The Active Health System assists in diagnosing problems and delivering rapid resolution when server failures  
occur.  
The Active Health System collects the following types of data:  
Server model  
Serial number  
Processor model and speed  
Storage capacity and speed  
Memory capacity and speed  
Firmware/BIOS  
HP Active Health System does not collect information about Active Health System users' operations, finances,  
customers, employees, partners, or data center, such as IP addresses, host names, user names, and  
passwords. HP Active Health System does not parse or change operating system data from third-party error  
event log activities, such as content created or passed through by the operating system.  
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The data that is collected is managed according to the HP Data Privacy policy. For more information see the  
The Active Health System log, in conjunction with the system monitoring provided by Agentless Management  
or SNMP Pass-thru, provides continuous monitoring of hardware and configuration changes, system status,  
and service alerts for various server components.  
The Agentless Management Service is available in the SPP, which is a disk image (.iso) that you can  
download from the HP website (http://www.hp.com/go/spp/download). The Active Health System log can  
be downloaded manually from HP iLO or HP Intelligent Provisioning and sent to HP. For more information,  
see the HP iLO User Guide or HP Intelligent Provisioning User Guide on the HP website  
Integrated Management Log  
The IML records hundreds of events and stores them in an easy-to-view form. The IML timestamps each event  
with 1-minute granularity.  
You can view recorded events in the IML in several ways, including the following:  
From within HP SIM  
From within operating system-specific IML viewers  
o
o
For Windows: IML Viewer  
For Linux: IML Viewer Application  
From within the HP iLO user interface  
From within HP Insight Diagnostics (on page 101)  
Intelligent Provisioning  
Several packaging changes have taken place with HP ProLiant Gen8 servers: SmartStart CDs and the Smart  
Update Firmware DVD will no longer ship with these new servers. Instead, the deployment capability is  
embedded in the server as part of HP iLO Management Engine’s Intelligent Provisioning.  
Intelligent Provisioning is an essential single-server deployment tool embedded in HP ProLiant Gen8 servers  
that simplifies HP ProLiant server setup, providing a reliable and consistent way to deploy HP ProLiant server  
configurations.  
Intelligent Provisioning assists with the OS installation process by preparing the system for installing  
"off-the-shelf" versions of leading operating system software and automatically integrating optimized  
HP ProLiant server support software from SPP. SPP is the installation package for operating  
system-specific bundles of HP ProLiant optimized drivers, utilities, management agents, and system  
firmware.  
Intelligent Provisioning provides maintenance-related tasks through Perform Maintenance features.  
Intelligent Provisioning provides installation help for Microsoft Windows, Red Hat and SUSE Linux, and  
VMware. For specific OS support, see the HP Intelligent Provisioning Release Notes on the HP website  
For more information about Intelligent Provisioning software, see the HP website  
(http://www.hp.com/go/intelligentprovisioning). For more information about Intelligent Provisioning  
drivers, firmware, and SPP, see the HP website (http://www.hp.com/go/spp/download).  
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HP Insight Diagnostics  
HP Insight Diagnostics is a proactive server management tool, available in both offline and online versions,  
that provides diagnostics and troubleshooting capabilities to assist IT administrators who verify server  
installations, troubleshoot problems, and perform repair validation.  
HP Insight Diagnostics Offline Edition performs various in-depth system and component testing while the OS  
is not running. To run this utility, boot the server using Intelligent Provisioning (on page 100).  
HP Insight Diagnostics Online Edition is a web-based application that captures system configuration and  
other related data needed for effective server management. Available in Microsoft Windows and Linux  
versions, the utility helps to ensure proper system operation.  
For more information or to download the utility, see the HP website (http://www.hp.com/servers/diags). HP  
Insight Diagnostics Online Edition is also available in the SPP. For more information, see the HP website  
HP Insight Diagnostics survey functionality  
HP Insight Diagnostics (on page 101) provides survey functionality that gathers critical hardware and  
software information on ProLiant servers.  
This functionality supports operating systems that are supported by the server. For operating systems  
supported by the server, see the HP website (http://www.hp.com/go/supportos).  
If a significant change occurs between data-gathering intervals, the survey function marks the previous  
information and overwrites the survey data files to reflect the latest changes in the configuration.  
Survey functionality is installed with every Intelligent Provisioning-assisted HP Insight Diagnostics installation,  
or it can be installed through the SPP ("HP Service Pack for ProLiant" on page 102).  
Erase Utility  
CAUTION: Perform a backup before running the System Erase Utility. The utility sets the system  
to its original factory state, deletes the current hardware configuration information, including  
array setup and disk partitioning, and erases all connected hard drives completely. Refer to the  
instructions for using this utility.  
Use the Erase Utility to erase hard drives and Active Health System logs, and to reset RBSU settings. Run the  
Erase Utility if you must erase the system for the following reasons:  
You want to install a new operating system on a server with an existing operating system.  
You encounter an error when completing the steps of a factory-installed operating system installation.  
To access the Erase Utility, click the Perform Maintenance icon from the Intelligent Provisioning home screen,  
and then select Erase.  
Run the Erase utility to:  
Do not erase — does not erase hard drive operations.  
Reset — erases the master boot record for the hard drives so they are no longer bootable.  
Secure erase —performs an overwrite pattern erase so no data is recoverable.  
After selecting the appropriate option, click Erase Selected. A Confirm Erase window is displayed, prompting  
you to confirm or cancel the Erase.  
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HP Insight Remote Support software  
HP strongly recommends that you install HP Insight Remote Support software to complete the installation or  
upgrade of your product and to enable enhanced delivery of your HP Warranty, HP Care Pack Service, or  
HP contractual support agreement. HP Insight Remote Support supplements your monitoring continuously to  
ensure maximum system availability by providing intelligent event diagnosis, and automatic, secure  
submission of hardware event notifications to HP, which will initiate a fast and accurate resolution, based on  
your product’s service level. Notifications may be sent to your authorized HP Channel Partner for onsite  
service, if configured and available in your country.  
For more information, see the HP website (http://www.hp.com/go/insightremotesupport). The HP Insight  
Remote Support Release Notes detail the prerequisites, supported hardware, and associated operating  
systems. The release notes are available on the HP website  
(http://www.hp.com/go/insightremotesupport/docs). HP Insight Remote Support is included as part of HP  
Warranty, HP Care Pack Service, or HP contractual support agreement.  
Scripting Toolkit  
The Scripting Toolkit is a server deployment product that enables you to build an unattended automated  
installation for high-volume server deployments. The Scripting Toolkit is designed to support ProLiant BL, ML,  
DL, and SL servers. The toolkit includes a modular set of utilities and important documentation that describes  
how to apply these tools to build an automated server deployment process.  
The Scripting Toolkit provides a flexible way to create standard server configuration scripts. These scripts are  
used to automate many of the manual steps in the server configuration process. This automated server  
configuration process cuts time from each deployment, making it possible to scale rapid, high-volume server  
deployments.  
For more information, and to download the Scripting Toolkit, see the HP website  
HP Service Pack for ProLiant  
SPP is a release set that contains a comprehensive collection of firmware and system software components,  
all tested together as a single solution stack for HP ProLiant servers, their options, BladeSystem enclosures,  
and limited HP external storage.  
SPP has several key features for updating HP ProLiant servers. Using HP SUM as the deployment tool, SPP can  
be used in an online mode on a Windows or Linux hosted operating system, or in an offline mode where the  
server is booted to the ISO so that the server can be updated automatically with no user interaction or  
updated in interactive mode.  
For more information or to download SPP, see the HP website (http://www.hp.com/go/spp).  
HP Smart Update Manager  
HP SUM is included in many HP products for installing and updating firmware and software on HP ProLiant  
servers. HP SUM provides a GUI and a command-line scriptable interface for deployment of firmware and  
software for single or one-to-many HP ProLiant servers and network-based targets, such as iLOs, OAs, and  
VC Ethernet and Fibre Channel modules.  
Key features of HP SUM include:  
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Dependency checking, which ensures appropriate installation order and dependency checking  
between components  
Intelligent deployment of only required updates  
Simultaneous firmware and software deployment for multiple remote targets in both GUI and CLI modes  
Improved deployment performance  
Local online deployment of HP ProLiant servers and enclosures  
Remote (one-to-many) online deployment of HP ProLiant servers and enclosures  
Local offline firmware deployments with HP Support Pack for ProLiant deliverables  
Remote offline deployment when used with the Scripting Toolkit (HP ProLiant Gen8 and later), iLO  
Virtual Media, or PXE booted media  
GUI or CLI scripts with extensive logging  
Remote command-line deployment  
Support for updating firmware on network-based targets such as the OA, iLO through the Network  
Management Port, VC Ethernet and Fibre Channel modules, and 3Gb/6Gb SAS BL Switch  
interconnects on HP ProLiant servers  
For more information about HP SUM and to access the HP Smart Update Manager User Guide, see the HP  
HP ROM-Based Setup Utility  
RBSU is a configuration utility embedded in HP ProLiant servers that performs a wide range of configuration  
activities that can include the following:  
Configuring system devices and installed options  
Enabling and disabling system features  
Displaying system information  
Selecting the primary boot controller  
Configuring memory options  
Language selection  
For more information on RBSU, see the HP ROM-Based Setup Utility User Guide on the Documentation CD or  
Using RBSU  
To use RBSU, use the following keys:  
To access RBSU, press the F9 key during power-up when prompted.  
To navigate the menu system, use the arrow keys.  
To make selections, press the Enter key.  
To access Help for a highlighted configuration option, press the F1 key.  
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IMPORTANT: RBSU automatically saves settings when you press the Enter key. The utility does  
not prompt you for confirmation of settings before you exit the utility. To change a selected setting,  
you must select a different setting and press the Enter key.  
Default configuration settings are applied to the server at one of the following times:  
Upon the first system power-up  
After defaults have been restored  
Default configuration settings are sufficient for proper typical server operation, but configuration settings can  
be modified using RBSU. The system will prompt you for access to RBSU with each power-up.  
Auto-configuration process  
The auto-configuration process automatically runs when you boot the server for the first time. During the  
power-up sequence, the system ROM automatically configures the entire system without needing any  
intervention. During this process, the ORCA utility, in most cases, automatically configures the array to a  
default setting based on the number of drives connected to the server.  
NOTE: If the boot drive is not empty or has been written to in the past, ORCA does not  
automatically configure the array. You must run ORCA to configure the array settings.  
NOTE: The server may not support all the following examples.  
Drives installed  
Drives used  
1
RAID level  
RAID 0  
RAID 1  
RAID 5  
None  
1
2
2
3, 4, 5, or 6  
0
3, 4, 5, or 6  
More than 6  
To change any ORCA default settings and override the auto-configuration process, press the F8 key when  
prompted.  
For more information on RBSU, see the HP ROM-Based Setup Utility User Guide on the Documentation CD or  
Boot options  
Near the end of the boot process, the boot options screen is displayed. This screen is visible for several  
seconds before the system attempts to boot from a supported boot device. During this time, you can do the  
following:  
Access RBSU by pressing the F9 key.  
Access Intelligent Provisioning Maintenance Menu by pressing the F10 key.  
Access the boot menu by pressing the F11 key.  
Force a PXE Network boot by pressing the F12 key.  
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Configuring AMP modes  
Not all HP ProLiant servers support all AMP modes. RBSU provides menu options only for the modes  
supported by the server. Advanced memory protection within RBSU enables the following advanced memory  
modes:  
Advanced ECC Mode—Provides memory protection beyond Standard ECC. All single-bit failures and  
some multi-bit failures can be corrected without resulting in system downtime.  
Online Spare Mode—Provides protection against failing or degraded DIMMs. Certain memory is set  
aside as spare, and automatic failover to spare memory occurs when the system detects a degraded  
DIMM. DIMMs that are likely to receive a fatal or uncorrectable memory error are removed from  
operation automatically, resulting in less system downtime.  
For DIMM population requirements, see the server-specific user guide.  
Re-entering the server serial number and product ID  
After you replace the system board, you must re-enter the server serial number and the product ID.  
1.  
2.  
3.  
4.  
During the server startup sequence, press the F9 key to access RBSU.  
Select the Advanced Options menu.  
Select Service Options.  
Select Serial Number. The following warnings appear:  
WARNING! WARNING! WARNING! The serial number is loaded into the system during  
the manufacturing process and should NOT be modified. This option should only  
be used by qualified service personnel. This value should always match the  
serial number sticker located on the chassis.  
Warning: The serial number should ONLY be modified by qualified service  
personnel. This value should always match the serial number located on the  
chassis.  
5.  
6.  
7.  
Press the Enter key to clear the warning.  
Enter the serial number and press the Enter key.  
Select Product ID. The following warning appears:  
Warning: The Product ID should ONLY be modified by qualified service  
personnel. This value should always match the Product ID on the chassis.  
8.  
9.  
Enter the product ID and press the Enter key.  
Press the Esc key to close the menu.  
10. Press the Esc key to exit RBSU.  
11. Press the F10 key to confirm exiting RBSU. The server automatically reboots.  
Utilities and features  
Array Configuration Utility  
ACU is a utility with the following features:  
Runs as a local application or remote service accessed through the HP System Management Homepage  
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Supports online array capacity expansion, logical drive extension, assignment of online spares, and  
RAID or stripe size migration  
Suggests the optimum configuration for an unconfigured system  
For supported controllers, provides access to licensed features, including:  
o
o
o
o
o
o
o
Moving and deleting individual logical volumes  
Advanced Capacity Expansion (SATA to SAS and SAS to SATA)  
Offline Split Mirror  
RAID 6 and RAID 60  
RAID 1 (ADM) and RAID 10 (ADM)  
HP Drive Erase  
Video-On-Demand Advanced Controller Settings  
Provides different operating modes, enabling faster configuration or greater control over the  
configuration options  
Remains available any time that the server is on  
Displays on-screen tips for individual steps of a configuration procedure  
Provides context-sensitive searchable help content  
Provides diagnostic and SmartSSD Wear Gauge functionality on the Diagnostics tab  
ACU is now available as an embedded utility, starting with HP ProLiant Gen8 servers. To access ACU, use  
one of the following methods:  
If an optional controller is not installed, press F10 during boot.  
If an optional controller is installed, when the system recognizes the controller during POST, press F5.  
For optimum performance, the minimum display settings are 1024 × 768 resolution and 16-bit color. Servers  
running Microsoft® operating systems require one of the following supported browsers:  
Internet Explorer 6.0 or later  
Mozilla Firefox 2.0 or later  
For Linux servers, see the README.TXT file for additional browser and support information.  
For more information about the controller and its features, see the HP Smart Array Controllers for HP ProLiant  
Servers User Guide on the HP website (http://www.hp.com/support/SAC_UG_ProLiantServers_en). To  
configure arrays, see the Configuring Arrays on HP Smart Array Controllers Reference Guide on the HP  
HP Smart Storage Administrator  
HP SSA is a configuration and management tool for HP Smart Array controllers. Starting with HP ProLiant  
Gen8 servers, HP SSA replaces ACU with an enhanced GUI and additional configuration features.  
HP SSA exists in three interface formats: the HP SSA GUI, the HP SSA CLI, and HP SSA Scripting. Although  
all formats provide support for configuration tasks, some of the advanced tasks are available in only one  
format.  
Some HP SSA features include the following:  
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Supports online array capacity expansion, logical drive extension, assignment of online spares, and  
RAID or stripe size migration  
Suggests the optimal configuration for an unconfigured system  
Provides diagnostic and SmartSSD Wear Gauge functionality on the Diagnostics tab  
For supported controllers, provides access to additional features.  
For more information about HP SSA, see the HP website (http://www.hp.com/go/hpssa).  
Option ROM Configuration for Arrays  
Before installing an operating system, you can use the ORCA utility to create the first logical drive, assign  
RAID levels, and establish online spare configurations.  
The utility also provides support for the following functions:  
Reconfiguring one or more logical drives  
Viewing the current logical drive configuration  
Deleting a logical drive configuration  
Setting the controller to be the boot controller  
Selecting the boot volume  
If you do not use the utility, ORCA will default to the standard configuration.  
For more information regarding the default configurations that ORCA uses, see the HP ROM-Based Setup  
Utility User Guide on the Documentation CD or the HP website (http://www.hp.com/support/rbsu).  
For more information about the controller and its features, see the HP Smart Array Controllers for HP ProLiant  
Servers User Guide on the HP website (http://www.hp.com/support/SAC_UG_ProLiantServers_en). To  
configure arrays, see the Configuring Arrays on HP Smart Array Controllers Reference Guide on the HP  
ROMPaq utility  
The ROMPaq utility enables you to upgrade the system firmware (BIOS). To upgrade the firmware, insert a  
ROMPaq USB Key into an available USB port and boot the system. In addition to ROMPaq, Online Flash  
Components for Windows and Linux operating systems are available for updating the system firmware.  
The ROMPaq utility checks the system and provides a choice (if more than one exists) of available firmware  
revisions.  
For more information, go to the HP website (http://www.hp.com/go/hpsc) and click on Drivers, Software  
& Firmware. Then, enter your product name in the Find an HP product field and click Go.  
Automatic Server Recovery  
ASR is a feature that causes the system to restart when a catastrophic operating system error occurs, such as  
a blue screen, ABEND (does not apply to HP ProLiant DL980 Servers), or panic. A system fail-safe timer, the  
ASR timer, starts when the System Management driver, also known as the Health Driver, is loaded. When the  
operating system is functioning properly, the system periodically resets the timer. However, when the  
operating system fails, the timer expires and restarts the server.  
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ASR increases server availability by restarting the server within a specified time after a system hang. At the  
same time, the HP SIM console notifies you by sending a message to a designated pager number that ASR  
has restarted the system. You can disable ASR from the System Management Homepage or through RBSU.  
USB support  
HP provides both standard USB 2.0 support and legacy USB 2.0 support. Standard support is provided by  
the OS through the appropriate USB device drivers. Before the OS loads, HP provides support for USB  
devices through legacy USB support, which is enabled by default in the system ROM.  
Legacy USB support provides USB functionality in environments where USB support is not available normally.  
Specifically, HP provides legacy USB functionality for the following:  
POST  
RBSU  
Diagnostics  
DOS  
Operating environments which do not provide native USB support  
Redundant ROM support  
The server enables you to upgrade or configure the ROM safely with redundant ROM support. The server has  
a single ROM that acts as two separate ROM images. In the standard implementation, one side of the ROM  
contains the current ROM program version, while the other side of the ROM contains a backup version.  
NOTE: The server ships with the same version programmed on each side of the ROM.  
Safety and security benefits  
When you flash the system ROM, ROMPaq writes over the backup ROM and saves the current ROM as a  
backup, enabling you to switch easily to the alternate ROM version if the new ROM becomes corrupted for  
any reason. This feature protects the existing ROM version, even if you experience a power failure while  
flashing the ROM.  
Keeping the system current  
Drivers  
IMPORTANT: Always perform a backup before installing or updating device drivers.  
The server includes new hardware that may not have driver support on all OS installation media.  
If you are installing an Intelligent Provisioning-supported OS, use Intelligent Provisioning (on page 100) and  
its Configure and Install feature to install the OS and latest supported drivers.  
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If you do not use Intelligent Provisioning to install an OS, drivers for some of the new hardware are required.  
These drivers, as well as other option drivers, ROM images, and value-add software can be downloaded as  
part of an SPP.  
If you are installing drivers from SPP, be sure that you are using the latest SPP version that your server  
supports. To verify that your server is using the latest supported version and for more information about SPP,  
To locate the drivers for a particular server, go to the HP website (http://www.hp.com/go/hpsc) and click  
on Drivers, Software & Firmware. Then, enter your product name in the Find an HP product field and click  
Go.  
Software and firmware  
Software and firmware should be updated before using the server for the first time, unless any installed  
software or components require an older version. For system software and firmware updates, download the  
Version control  
The VCRM and VCA are web-enabled Insight Management Agents tools that HP SIM uses to schedule  
software update tasks to the entire enterprise.  
VCRM manages the repository for SPP. Administrators can view the SPP contents or configure VCRM to  
automatically update the repository with internet downloads of the latest software and firmware from  
HP.  
VCA compares installed software versions on the node with updates available in the VCRM managed  
repository. Administrators configure VCA to point to a repository managed by VCRM.  
For more information about version control tools, see the HP Systems Insight Manager User Guide, the HP  
Version Control Agent User Guide, and the HP Version Control Repository User Guide on the HP website  
HP operating systems and virtualization software support for  
ProLiant servers  
For information about specific versions of a supported operating system, see the HP website  
HP Technology Service Portfolio  
HP Technology Services offers a targeted set of consultancy, deployment, and service solutions to meet the  
support needs of most business and IT environments.  
Foundation Care services—Delivers scalable hardware and software support packages for HP ProLiant  
server and industry-standard software. You can choose the type and level of service that is most suitable for  
your business needs.  
HP Collaborative Support—With a single call, HP addresses initial hardware and software support needs  
and helps to quickly identify if a problem is related to hardware or software. If the problem is related to  
hardware, HP resolves the problem according to service level commitments. If the reported incident is related  
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to an HP software product or a supported third-party software product and cannot be resolved by applying  
known fixes, HP contacts the third-party vendor and creates a problem incident on your behalf.  
HP Proactive Care—For customers running business critical environments where downtime is not an option,  
HP Proactive Care helps to deliver high levels of availability. Key to these service options is the delivery of  
proactive service management tools to help you avoid the causes of downtime. If a problem arises, then HP  
offers advanced technical response from critical system support specialists for problem identification and  
resolution.  
HP Support Center—For all service options, the HP Support Center delivers the information, tools, and  
experts required to support HP business products.  
HP Insight Remote Support—Provides 24x7 secure remote monitoring, diagnosis, and problem resolution.  
For more information, see one of the following websites:  
HP ProLiant Server Services website (http://www.hp.com/services/proliant)  
HP BladeSystem Services website (http://www.hp.com/services/bladesystem)  
Change control and proactive notification  
HP offers Change Control and Proactive Notification to notify customers 30 to 60 days in advance of  
upcoming hardware and software changes on HP commercial products.  
For more information, refer to the HP website (http://www.hp.com/go/pcn).  
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Troubleshooting  
Troubleshooting resources  
The HP ProLiant Gen8 Troubleshooting Guide, Volume I: Troubleshooting provides procedures for resolving  
common problems and comprehensive courses of action for fault isolation and identification, issue resolution,  
and software maintenance on ProLiant servers and server blades. To view the guide, select a language:  
The HP ProLiant Gen8 Troubleshooting Guide, Volume II: Error Messages provides a list of error messages  
and information to assist with interpreting and resolving error messages on ProLiant servers and server  
blades. To view the guide, select a language:  
Troubleshooting 111  
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Battery replacement  
If the server no longer automatically displays the correct date and time, you may need to replace the battery  
that provides power to the real-time clock.  
WARNING: The computer contains an internal lithium manganese dioxide, a vanadium  
pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not  
properly handled. To reduce the risk of personal injury:  
Do not attempt to recharge the battery.  
Do not expose the battery to temperatures higher than 60°C (140°F).  
Do not disassemble, crush, puncture, short external contacts, or dispose of in fire or water.  
Replace only with the spare designated for this product.  
To remove the component:  
1.  
2.  
Power down the server (on page 23).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Extend ("Extend the server from the rack" on page 23) or remove the server from the rack.  
Remove the access panel (on page 24).  
3.  
4.  
5.  
6.  
7.  
If installed, remove the secondary PCIe riser cage.  
Locate the battery ("System board components" on page 15).  
Remove the battery.  
To replace the component, reverse the removal procedure.  
For more information about battery replacement or proper disposal, contact an authorized reseller or an  
authorized service provider.  
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Regulatory information  
Safety and regulatory compliance  
For safety, environmental, and regulatory information, see Safety and Compliance Information for Server,  
Storage, Power, Networking, and Rack Products, available at the HP website  
Turkey RoHS material content declaration  
Ukraine RoHS material content declaration  
Warranty information  
HP ProLiant and X86 Servers and Options (http://www.hp.com/support/ProLiantServers-Warranties)  
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Electrostatic discharge  
Preventing electrostatic discharge  
To prevent damaging the system, be aware of the precautions you need to follow when setting up the system  
or handling parts. A discharge of static electricity from a finger or other conductor may damage system  
boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the device.  
To prevent electrostatic damage:  
Avoid hand contact by transporting and storing products in static-safe containers.  
Keep electrostatic-sensitive parts in their containers until they arrive at static-free workstations.  
Place parts on a grounded surface before removing them from their containers.  
Avoid touching pins, leads, or circuitry.  
Always be properly grounded when touching a static-sensitive component or assembly.  
Grounding methods to prevent electrostatic discharge  
Several methods are used for grounding. Use one or more of the following methods when handling or  
installing electrostatic-sensitive parts:  
Use a wrist strap connected by a ground cord to a grounded workstation or computer chassis. Wrist  
straps are flexible straps with a minimum of 1 megohm ±10 percent resistance in the ground cords. To  
provide proper ground, wear the strap snug against the skin.  
Use heel straps, toe straps, or boot straps at standing workstations. Wear the straps on both feet when  
standing on conductive floors or dissipating floor mats.  
Use conductive field service tools.  
Use a portable field service kit with a folding static-dissipating work mat.  
If you do not have any of the suggested equipment for proper grounding, have an authorized reseller install  
the part.  
For more information on static electricity or assistance with product installation, contact an authorized  
reseller.  
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Specifications  
Environmental specifications  
Specification  
Value  
Temperature range*  
Operating  
10°C to 35°C (50°F to 95°F)  
-30°C to 60°C (-22°F to 140°F)  
Non-operating  
Relative humidity  
(noncondensing)  
10% to 90%  
Operating  
28°C (82.4°F), maximum wet bulb  
temperature  
5% to 95%  
Non-operating  
38.7°C (101.7°F), maximum wet  
bulb temperature  
* All temperature ratings shown are for sea level. An altitude derating of 1°C per 304.8 m (1.8°F per 1,000 ft) to 3048  
m (10,000 ft) is applicable. No direct sunlight allowed.  
Mechanical specifications  
Specification  
Value  
8.73 cm (3.44 in)  
69.85 cm (27.54 in)  
74.93 cm (29.5 in)  
44.54 cm (17.54 in)  
27.66 kg (61.0 lb)  
Height  
Depth, SFF  
Depth, LFF  
Width  
Weight (maximum—all LFF  
drives)  
18.59 kg (41.0 lb)  
Weight (minimum—one SFF  
drive)  
Power supply specifications  
Depending on installed options, the server is configured with one of the following power supplies:  
HP 460 W CS HE Power Supply (92% efficiency) (on page 116)  
HP 460 W CS Platinum Power Supply (94% efficiency) (on page 116)  
HP 500 W CS 277 V AC power supply (94% efficiency) (on page 117)  
HP 750 W CS 277 V AC power supply (94% efficiency) (on page 117)  
HP 750 W CS HE Power Supply (92% efficiency) (on page 117)  
HP 750 W CS Titanium power supply (96% efficiency) (on page 118)  
Specifications 115  
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HP 750 W CS Platinum Power Supply (94% efficiency) (on page 118)  
HP 750 W 48V CS Power Supply (on page 119)  
HP 1200 W CS HE Power Supply (94% efficiency) (on page 119)  
HP 460 W CS HE Power Supply (92% efficiency)  
Specification  
Value  
Input requirements  
100 to 120 VAC, 200 to  
240 VAC  
Rated input voltage  
50 Hz to 60 Hz  
Rated input frequency  
Rated input current  
5.5 A at 100 VAC  
2.6 A at 200 VAC  
526 W at 100V AC input  
505 W at 200V AC input  
Rated input power  
BTUs per hour  
1794 at 100V AC input  
1725 at 200V AC input  
Power supply output  
460 W at 100V to 120V AC input  
460 W at 200V to 240V AC input  
Rated steady-state power  
460 W at 100V to 120V AC input  
460 W at 200V to 240V AC input  
Maximum peak power  
HP 460 W CS Platinum Power Supply (94% efficiency)  
Specification  
Value  
Input requirements  
100 to 120 VAC, 200 to  
240 VAC  
Rated input voltage  
50 Hz to 60 Hz  
Rated input frequency  
Rated input current  
5.2 A at 100 VAC  
2.5 A at 200 VAC  
517 W at 100V AC input  
496 W at 200V AC input  
Rated input power  
Btus per hour  
1764 at 100V AC input  
1694 at 200V AC input  
Power supply output  
460 W at 100V to 120V AC input  
460 W at 200V to 240V AC input  
Rated steady-state power  
460 W at 100V to 120V AC input  
460 W at 200V to 240V AC input  
Maximum peak power  
Specifications 116  
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HP 500 W CS 277 V AC power supply (94% efficiency)  
Specification  
Value  
Input requirements  
Rated input voltage  
Rated input frequency  
Rated input current  
200 V to 277 V AC  
50 Hz–60 Hz  
3.0 A at 200 V AC  
2.0 A at 277 V AC  
600 W at 200 V AC input  
554 W at 277 V AC input  
Rated input power  
Btus per hour  
1843 at 200 V AC input  
1831 at 277 V AC input  
Power supply output  
500 W at 200 V AC to 277 V AC  
input  
Rated steady-state power  
500 W at 200 V AC to 277 V AC  
input  
Maximum peak power  
HP 750 W CS 277 V AC power supply (94% efficiency)  
Specification  
Value  
Input requirements  
Rated input voltage  
Rated input frequency  
Rated input current  
200 V to 277 V AC  
50 Hz–60 Hz  
4.5 A at 200 V AC  
3.0 A at 277 V AC  
900 W at 200 V AC input  
831 W at 277 V AC input  
Rated input power  
Btus per hour  
2796 at 200 V AC input  
2767 at 277 V AC input  
Power supply output  
750 W at 200 V AC to 277 V AC  
input  
Rated steady-state power  
750 W at 200 V AC to 277 V AC  
input  
Maximum peak power  
HP 750 W CS HE Power Supply (92% efficiency)  
Specification  
Value  
Input requirements  
100 to 120 VAC, 200 to  
240 VAC  
Rated input voltage  
50 Hz to 60 Hz  
Rated input frequency  
Rated input current  
8.9 A at 100 VAC  
4.3 A at 200 VAC  
857 W at 100V AC input  
824 W at 200V AC input  
Rated input power  
Specifications 117  
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2925 at 100V AC input  
2812 at 200V AC input  
BTUs per hour  
Power supply output  
750 W at 100V to 120V AC input  
750 W at 200V to 240V AC input  
Rated steady-state power  
750 W at 100V to 120V AC input  
750 W at 200V to 240V AC input  
Maximum peak power  
HP 750 W CS Titanium power supply (96% efficiency)  
Specification  
Value  
Input requirements  
200 to 240 V AC  
Rated input voltage  
Rated input frequency  
Rated input current  
50 Hz to 60 Hz  
4.1 A at 200 V AC  
3.3 A at 240 V AC  
820 W at 200 V AC  
792 W at 240 V AC  
Maximum rated input power  
Btus per hour  
2739 at 200 V AC  
2724 at 240 V AC  
Power supply output  
750 W at 200 V AC to 240 V AC  
input  
Rated steady-state power  
750 W at 200 V AC to 240 V AC  
input  
Maximum peak power  
HP 750 W CS Platinum Power Supply (94% efficiency)  
Specification  
Value  
Input requirements  
100 to 120 VAC, 200 to  
240 VAC  
Rated input voltage  
50 Hz to 60 Hz  
Rated input frequency  
Rated input current  
8.5 A at 100 VAC  
4.1 A at 200 VAC  
843 W at 100V AC input  
811 W at 200V AC input  
Maximum rated input power  
Btus per hour  
2878 at 100V AC input  
2769 at 200V AC input  
Power supply output  
750 W at 100V to 120V AC input  
750 W at 200V to 240V AC input  
Rated steady-state power  
750 W at 100V to 120V AC input  
750 W at 200V to 240V AC input  
Maximum peak power  
Specifications 118  
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HP 750 W 48V CS Power Supply  
Specification  
Value  
Input requirements  
100 to 240 VAC  
50 HZ to 60 HZ  
9 to 4.5 A  
Rated input voltage  
Rated Input frequency  
Rated input current  
815 W at 36 VDC input  
805 W at 48 VDC input  
795 W at 72 VDC input  
Maximum rated input power  
2780 at 36 VDC input  
2740 at 48 VDC input  
2720 at 72 VDC input  
Btus per hour  
Power supply output  
750 W  
750 W  
Rated steady-state power  
Maximum peak power  
HP 1200 W CS HE Power Supply (94% efficiency)  
Specification  
Value  
Input requirements  
100 to 120 VAC, 200 to  
240 VAC  
Rated input voltage  
50 Hz to 60 Hz  
Rated input frequency  
Rated input current  
9.1 A at 100 VAC  
6.7 A at 200 VAC  
897 W at 100V AC input  
1321 W at 200V AC input  
Maximum rated input power  
Btus per hour  
3408 at 120V AC input  
4433 at 200V to 240V AC input  
Power supply output  
800 W at 100V AC input  
900 W at 120V AC input  
1200 W at 200V to 240V AC  
input  
Rated steady-state power  
800 W at 100V AC input  
900 W at 120V AC input  
1200 W at 200V to 240V AC  
input  
Maximum peak power  
Specifications 119  
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Support and other resources  
Before you contact HP  
Be sure to have the following information available before you call HP:  
Active Health System log (HP ProLiant Gen8 or later products)  
Download and have available an Active Health System log for 3 days before the failure was detected.  
For more information, see the HP iLO 4 User Guide or HP Intelligent Provisioning User Guide on the HP  
Onboard Administrator SHOW ALL report (for HP BladeSystem products only)  
For more information on obtaining the Onboard Administrator SHOW ALL report, see the HP website  
Technical support registration number (if applicable)  
Product serial number  
Product model name and number  
Product identification number  
Applicable error messages  
Add-on boards or hardware  
Third-party hardware or software  
Operating system type and revision level  
HP contact information  
For United States and worldwide contact information, see the Contact HP website  
In the United States:  
To contact HP by phone, call 1-800-334-5144. For continuous quality improvement, calls may be  
recorded or monitored.  
If you have purchased a Care Pack (service upgrade), see the Support & Drivers website  
(http://www8.hp.com/us/en/support-drivers.html). If the problem cannot be resolved at the website,  
call 1-800-633-3600. For more information about Care Packs, see the HP website  
Customer Self Repair  
HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for  
greater flexibility in performing defective parts replacement. If during the diagnosis period HP (or HP service  
Support and other resources 120  
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providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will  
ship that part directly to you for replacement. There are two categories of CSR parts:  
Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts,  
you will be charged for the travel and labor costs of this service.  
Optional—Parts for which customer self repair is optional. These parts are also designed for customer  
self repair. If, however, you require that HP replace them for you, there may or may not be additional  
charges, depending on the type of warranty service designated for your product.  
NOTE: Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty,  
HP requires that an authorized service provider replace the part. These parts are identified as "No" in the  
Illustrated Parts Catalog.  
Based on availability and where geography permits, CSR parts will be shipped for next business day  
delivery. Same day or four-hour delivery may be offered at an additional charge where geography permits.  
If assistance is required, you can call the HP Technical Support Center and a technician will help you over the  
telephone. HP specifies in the materials shipped with a replacement CSR part whether a defective part must  
be returned to HP. In cases where it is required to return the defective part to HP, you must ship the defective  
part back to HP within a defined period of time, normally five (5) business days. The defective part must be  
returned with the associated documentation in the provided shipping material. Failure to return the defective  
part may result in HP billing you for the replacement. With a customer self repair, HP will pay all shipping  
and part return costs and determine the courier/carrier to be used.  
For more information about HP's Customer Self Repair program, contact your local service provider. For the  
North American program, refer to the HP website (http://www.hp.com/go/selfrepair).  
Réparation par le client (CSR)  
Les produits HP comportent de nombreuses pièces CSR (Customer Self Repair = réparation par le client) afin  
de minimiser les délais de réparation et faciliter le remplacement des pièces défectueuses. Si pendant la  
période de diagnostic, HP (ou ses partenaires ou mainteneurs agréés) détermine que la réparation peut être  
effectuée à l'aide d'une pièce CSR, HP vous l'envoie directement. Il existe deux catégories de pièces CSR:  
Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de  
remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.  
Facultatif - Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également  
conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de  
remplacer ces pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à  
votre produit.  
REMARQUE: Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la  
réparation. Pour que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit effectué  
par un Mainteneur Agréé. Ces pièces sont identifiées par la mention "Non" dans le Catalogue illustré.  
Les pièces CSR sont livrées le jour ouvré suivant, dans la limite des stocks disponibles et selon votre situation  
géographique. Si votre situation géographique le permet et que vous demandez une livraison le jour même  
ou dans les 4 heures, celle-ci vous sera facturée. Pour bénéficier d'une assistance téléphonique, appelez le  
Centre d'assistance technique HP. Dans les documents envoyés avec la pièce de rechange CSR, HP précise  
s'il est nécessaire de lui retourner la pièce défectueuse. Si c'est le cas, vous devez le faire dans le délai  
indiqué, généralement cinq (5) jours ouvrés. La pièce et sa documentation doivent être retournées dans  
l'emballage fourni. Si vous ne retournez pas la pièce défectueuse, HP se réserve le droit de vous facturer les  
coûts de remplacement. Dans le cas d'une pièce CSR, HP supporte l'ensemble des frais d'expédition et de  
retour, et détermine la société de courses ou le transporteur à utiliser.  
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Pour plus d'informations sur le programme CSR de HP, contactez votre Mainteneur Agrée local. Pour plus  
d'informations sur ce programme en Amérique du Nord, consultez le site Web HP  
Riparazione da parte del cliente  
Per abbreviare i tempi di riparazione e garantire una maggiore flessibilità nella sostituzione di parti  
difettose, i prodotti HP sono realizzati con numerosi componenti che possono essere riparati direttamente  
dal cliente (CSR, Customer Self Repair). Se in fase di diagnostica HP (o un centro di servizi o di assistenza  
HP) identifica il guasto come riparabile mediante un ricambio CSR, HP lo spedirà direttamente al cliente per  
la sostituzione. Vi sono due categorie di parti CSR:  
Obbligatorie – Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la  
riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio.  
Opzionali – Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti  
progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere  
spese addizionali a seconda del tipo di garanzia previsto per il prodotto.  
NOTA: alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la  
garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono  
identificate da un "No" nel Catalogo illustrato dei componenti.  
In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il  
giorno lavorativo seguente. La consegna nel giorno stesso o entro quattro ore è offerta con un supplemento  
di costo solo in alcune zone. In caso di necessità si può richiedere l'assistenza telefonica di un addetto del  
centro di supporto tecnico HP. Nel materiale fornito con una parte di ricambio CSR, HP specifica se il cliente  
deve restituire dei componenti. Qualora sia richiesta la resa ad HP del componente difettoso, lo si deve  
spedire ad HP entro un determinato periodo di tempo, generalmente cinque (5) giorni lavorativi. Il  
componente difettoso deve essere restituito con la documentazione associata nell'imballo di spedizione  
fornito. La mancata restituzione del componente può comportare la fatturazione del ricambio da parte di HP.  
Nel caso di riparazione da parte del cliente, HP sostiene tutte le spese di spedizione e resa e sceglie il  
corriere/vettore da utilizzare.  
Per ulteriori informazioni sul programma CSR di HP contattare il centro di assistenza di zona. Per il  
programma in Nord America fare riferimento al sito Web HP (http://www.hp.com/go/selfrepair).  
Customer Self Repair  
HP Produkte enthalten viele CSR-Teile (Customer Self Repair), um Reparaturzeiten zu minimieren und höhere  
Flexibilität beim Austausch defekter Bauteile zu ermöglichen. Wenn HP (oder ein HP Servicepartner) bei der  
Diagnose feststellt, dass das Produkt mithilfe eines CSR-Teils repariert werden kann, sendet Ihnen HP dieses  
Bauteil zum Austausch direkt zu. CSR-Teile werden in zwei Kategorien unterteilt:  
Zwingend – Teile, für die das Customer Self Repair-Verfahren zwingend vorgegeben ist. Wenn Sie den  
Austausch dieser Teile von HP vornehmen lassen, werden Ihnen die Anfahrt- und Arbeitskosten für diesen  
Service berechnet.  
Optional – Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für Customer  
Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten,  
können bei diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche  
Kosten anfallen.  
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HINWEIS: Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des  
Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog  
sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet.  
CSR-Teile werden abhängig von der Verfügbarkeit und vom Lieferziel am folgenden Geschäftstag geliefert.  
Für bestimmte Standorte ist eine Lieferung am selben Tag oder innerhalb von vier Stunden gegen einen  
Aufpreis verfügbar. Wenn Sie Hilfe benötigen, können Sie das HP technische Support Center anrufen und  
sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien, die mit einem CSR-Ersatzteil geliefert  
werden, können Sie entnehmen, ob das defekte Teil an HP zurückgeschickt werden muss. Wenn es  
erforderlich ist, das defekte Teil an HP zurückzuschicken, müssen Sie dies innerhalb eines vorgegebenen  
Zeitraums tun, in der Regel innerhalb von fünf (5) Geschäftstagen. Das defekte Teil muss mit der zugehörigen  
Dokumentation in der Verpackung zurückgeschickt werden, die im Lieferumfang enthalten ist. Wenn Sie das  
defekte Teil nicht zurückschicken, kann HP Ihnen das Ersatzteil in Rechnung stellen. Im Falle von Customer  
Self Repair kommt HP für alle Kosten für die Lieferung und Rücksendung auf und bestimmt den  
Kurier-/Frachtdienst.  
Weitere Informationen über das HP Customer Self Repair Programm erhalten Sie von Ihrem Servicepartner  
vor Ort. Informationen über das CSR-Programm in Nordamerika finden Sie auf der HP Website unter  
Reparaciones del propio cliente  
Los productos de HP incluyen muchos componentes que el propio usuario puede reemplazar (Customer Self  
Repair, CSR) para minimizar el tiempo de reparación y ofrecer una mayor flexibilidad a la hora de realizar  
sustituciones de componentes defectuosos. Si, durante la fase de diagnóstico, HP (o los proveedores o socios  
de servicio de HP) identifica que una reparación puede llevarse a cabo mediante el uso de un componente  
CSR, HP le enviará dicho componente directamente para que realice su sustitución. Los componentes CSR se  
clasifican en dos categorías:  
Obligatorio: componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a  
HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de  
desplazamiento y de mano de obra de dicho servicio.  
Opcional: componentes para los que la reparación por parte del usuario es opcional. Estos  
componentes también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si  
precisa que HP realice su sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de  
servicio de garantía correspondiente al producto.  
NOTA: Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que  
el usuario haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado  
realice la sustitución de estos componentes. Dichos componentes se identifican con la palabra "No" en el  
catálogo ilustrado de componentes.  
Según la disponibilidad y la situación geográfica, los componentes CSR se enviarán para que lleguen a su  
destino al siguiente día laborable. Si la situación geográfica lo permite, se puede solicitar la entrega en el  
mismo día o en cuatro horas con un coste adicional. Si precisa asistencia técnica, puede llamar al Centro de  
asistencia técnica de HP y recibirá ayuda telefónica por parte de un técnico. Con el envío de materiales  
para la sustitución de componentes CSR, HP especificará si los componentes defectuosos deberán  
devolverse a HP. En aquellos casos en los que sea necesario devolver algún componente a HP, deberá  
hacerlo en el periodo de tiempo especificado, normalmente cinco días laborables. Los componentes  
defectuosos deberán devolverse con toda la documentación relacionada y con el embalaje de envío. Si no  
enviara el componente defectuoso requerido, HP podrá cobrarle por el de sustitución. En el caso de todas  
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sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de  
componentes y escogerá la empresa de transporte que se utilice para dicho servicio.  
Para obtener más información acerca del programa de Reparaciones del propio cliente de HP, póngase en  
contacto con su proveedor de servicios local. Si está interesado en el programa para Norteamérica, visite  
la página web de HP siguiente (http://www.hp.com/go/selfrepair).  
Customer Self Repair  
Veel onderdelen in HP producten zijn door de klant zelf te repareren, waardoor de reparatieduur tot een  
minimum beperkt kan blijven en de flexibiliteit in het vervangen van defecte onderdelen groter is. Deze  
onderdelen worden CSR-onderdelen (Customer Self Repair) genoemd. Als HP (of een HP Service Partner) bij  
de diagnose vaststelt dat de reparatie kan worden uitgevoerd met een CSR-onderdeel, verzendt HP dat  
onderdeel rechtstreeks naar u, zodat u het defecte onderdeel daarmee kunt vervangen. Er zijn twee  
categorieën CSR-onderdelen:  
Verplicht: Onderdelen waarvoor reparatie door de klant verplicht is. Als u HP verzoekt deze onderdelen  
voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon in rekening gebracht.  
Optioneel: Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn ontworpen  
voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen  
daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het  
product.  
OPMERKING: Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met  
de garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen.  
Deze onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".  
Afhankelijk van de leverbaarheid en de locatie worden CSR-onderdelen verzonden voor levering op de  
eerstvolgende werkdag. Levering op dezelfde dag of binnen vier uur kan tegen meerkosten worden  
aangeboden, indien dit mogelijk is gezien de locatie. Indien assistentie gewenst is, belt u een HP Service  
Partner om via de telefoon technische ondersteuning te ontvangen. HP vermeldt in de documentatie bij het  
vervangende CSR-onderdeel of het defecte onderdeel aan HP moet worden geretourneerd. Als het defecte  
onderdeel aan HP moet worden teruggezonden, moet u het defecte onderdeel binnen een bepaalde  
periode, gewoonlijk vijf (5) werkdagen, retourneren aan HP. Het defecte onderdeel moet met de  
bijbehorende documentatie worden geretourneerd in het meegeleverde verpakkingsmateriaal. Als u het  
defecte onderdeel niet terugzendt, kan HP u voor het vervangende onderdeel kosten in rekening brengen. Bij  
reparatie door de klant betaalt HP alle verzendkosten voor het vervangende en geretourneerde onderdeel en  
kiest HP zelf welke koerier/transportonderneming hiervoor wordt gebruikt.  
Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programma  
van HP. Informatie over Service Partners vindt u op de HP website (http://www.hp.com/go/selfrepair).  
Reparo feito pelo cliente  
Os produtos da HP são projetados com muitas peças para reparo feito pelo cliente (CSR) de modo a  
minimizar o tempo de reparo e permitir maior flexibilidade na substituição de peças com defeito. Se,  
durante o período de diagnóstico, a HP (ou fornecedores/parceiros de serviço da HP) concluir que o reparo  
pode ser efetuado pelo uso de uma peça CSR, a peça de reposição será enviada diretamente ao cliente.  
Existem duas categorias de peças CSR:  
Obrigatória – Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças,  
serão cobradas as despesas de transporte e mão-de-obra do serviço.  
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Opcional – Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o  
reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de  
taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.  
OBSERVAÇÃO: Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de  
cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão  
identificadas com a marca "No" (Não), no catálogo de peças ilustrado.  
Conforme a disponibilidade e o local geográfico, as peças CSR serão enviadas no primeiro dia útil após o  
pedido. Onde as condições geográficas permitirem, a entrega no mesmo dia ou em quatro horas pode ser  
feita mediante uma taxa adicional. Se precisar de auxílio, entre em contato com o Centro de suporte técnico  
da HP para que um técnico o ajude por telefone. A HP especifica nos materiais fornecidos com a peça CSR  
de reposição se a peça com defeito deve ser devolvida à HP. Nos casos em que isso for necessário, é  
preciso enviar a peça com defeito à HP dentro do período determinado, normalmente cinco (5) dias úteis.  
A peça com defeito deve ser enviada com a documentação correspondente no material de transporte  
fornecido. Caso não o faça, a HP poderá cobrar a reposição. Para as peças de reparo feito pelo cliente, a  
HP paga todas as despesas de transporte e de devolução da peça e determina a transportadora/serviço  
postal a ser utilizado.  
Para obter mais informações sobre o programa de reparo feito pelo cliente da HP, entre em contato com o  
fornecedor de serviços local. Para o programa norte-americano, visite o site da HP  
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Acronyms and abbreviations  
ABEND  
abnormal end  
ACU  
Array Configuration Utility  
AMP  
Advanced Memory Protection  
ASR  
Automatic Server Recovery  
CSA  
Canadian Standards Association  
CSR  
Customer Self Repair  
DDDC  
Double Device Data Correction  
DDR  
double data rate  
FBWC  
flash-backed write cache  
HDIMM  
HyperCloud DIMM  
IEC  
International Electrotechnical Commission  
iLO  
Integrated Lights-Out  
Acronyms and abbreviations 128  
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IML  
Integrated Management Log  
ISEE  
Instant Support Enterprise Edition  
LFF  
large form factor  
NMI  
nonmaskable interrupt  
NVRAM  
nonvolatile memory  
ORCA  
Option ROM Configuration for Arrays  
PCIe  
Peripheral Component Interconnect Express  
POST  
Power-On Self Test  
PSP  
HP ProLiant Support Pack  
RBSU  
ROM-Based Setup Utility  
RDIMM  
registered dual in-line memory module  
RDP  
Rapid Deployment Pack  
SAS  
serial attached SCSI  
SATA  
serial ATA  
Acronyms and abbreviations 129  
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SDDC  
Single Device Data Correction  
SELV  
separated extra low voltage  
SFF  
small form factor  
SIM  
Systems Insight Manager  
SSA  
HP Smart Storage Administrator  
TMRA  
recommended ambient operating temperature  
TPM  
Trusted Platform Module  
UDIMM  
unregistered dual in-line memory module  
UID  
unit identification  
UPS  
uninterruptible power system  
USB  
universal serial bus  
VCA  
Version Control Agent  
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Documentation feedback  
HP is committed to providing documentation that meets your needs. To help us improve the documentation,  
send any errors, suggestions, or comments to Documentation Feedback (mailto:[email protected]).  
Include the document title and part number, version number, or the URL when submitting your feedback.  
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Index  
default settings 52  
diagnostic tools 98, 101, 107  
diagnostics utility 101  
DIMM identification 51  
DIMM population guidelines 53  
DIMM slot locations 18  
DIMMs 18, 50  
DIMMs, installing 54  
DIMMs, single- and dual-rank 50  
drive LEDs 19  
A
AC power supply 65, 116, 117, 118, 119  
access panel 24  
Advanced ECC memory 52, 53, 105  
air baffle 32  
Array Configuration Utility (ACU) 105  
ASR (Automatic Server Recovery) 107  
authorized reseller 120  
auto-configuration process 104  
Automatic Server Recovery (ASR) 107  
drivers 108  
drives 19  
B
E
battery 112  
electrical grounding requirements 36  
electrostatic discharge 114  
enabling the Trusted Platform Module 88  
environmental requirements 34  
environmental specifications 115  
Erase Utility 98, 101  
before you contact HP 120  
BIOS upgrade 98, 107  
blue screen event 17  
boot options 40, 104  
BSMI notice 113  
buttons 7  
error messages 111  
European Union notice 113  
expansion board options 72  
expansion boards 72  
expansion slot blanks 72  
expansion slots 73  
C
cable management arm 25, 38  
cables 90  
Canadian notice 113  
capacitor pack 58, 59  
Care Pack 34, 102, 109  
Change Control 110  
chipset SATA cable 93  
components 7  
components, identification 7  
configuration of system 40, 98  
connectors 7  
contacting HP 120  
controller 57  
crash dump analysis 17  
CSR (customer self repair) 120  
customer self repair (CSR) 120  
extending server from rack 23  
F
fan cage 26  
fans 42  
fans, installing 42  
FBWC cabling 92  
FBWC module 21, 58, 59  
features 7, 105  
Federal Communications Commission (FCC)  
notice 113  
firmware 109  
firmware update 102, 109  
firmware, updating 102, 109  
FlexibleLOM 70  
front panel buttons 9  
front panel components 7  
D
DC power supply 36, 66  
Index 132  
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front panel LEDs 9  
full-length expansion board 28, 31  
LEDs, troubleshooting 20, 111  
lockstep memory 53, 54  
G
M
grounding methods 114  
grounding requirements 36  
mechanical specifications 115  
memory configurations 51, 52  
memory dump 17  
H
memory subsystem architecture 50  
memory, configuration requirements 51, 54  
memory, configuring 51, 52, 53  
memory, lockstep 53, 54  
hard drive bays 7  
hard drive cage 76  
hard drive LEDs 19  
hard drives, determining status of 19  
hardware options installation 38, 42  
health driver 107  
memory, online spare 52, 105  
N
health LEDs 9  
help resources 120  
NMI header 17  
hot-plug fans 21, 25, 27  
hot-plug SAS hard drive options 55  
HP Insight Diagnostics 101  
HP Insight Remote Support software 109  
HP Service Pack for ProLiant 98, 102  
HP Smart Update Manager overview 98, 102  
HP SmartMemory 49  
O
online spare memory 52, 53, 105  
operating system crash 17, 107  
operating systems 109  
optical drive 7, 63  
optical drive cable 91  
optimum environment 34  
Option ROM Configuration for Arrays (ORCA) 98,  
HP technical support 109, 120  
I
iLO (Integrated Lights-Out) 98, 99, 100  
IML (Integrated Management Log) 98, 100  
Insight Diagnostics 101, 108  
options installation 38, 42  
ORCA (Option ROM Configuration for Arrays) 98,  
installation services 34  
installation, server options 38, 42  
installing a hot-plug SAS hard drive 55  
installing hardware 42  
installing the full-length expansion board retainer 30  
installing the server into the rack 38  
installing the Trusted Platform Module board 87  
Integrated Lights-Out (iLO) 98, 100  
Integrated Management Log (IML) 100  
Intelligent Provisioning 98, 100, 101  
P
part numbers 113  
PCI expansion slots 14  
PCI riser cage 29, 30, 74  
phone numbers 120  
POST error messages 111  
power cabling 96  
power distribution unit (PDU) 36  
Power On button 23, 40  
power requirements 36  
power supply 65, 66  
J
Japanese notice 113  
power supply LEDs 14  
power supply specifications 116, 117, 118, 119  
powering down 23  
L
powering up 23  
preparation procedures 23  
problem diagnosis 111  
processor option 42  
LEDs, front panel 19  
LEDs, hard drive 19  
LEDs, SAS hard drive 19  
Index 133  
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processors 42  
system maintenance switch 16, 17  
system power LED 9  
Systems Insight Display 10, 11, 12  
Systems Insight Display LEDs 11, 12  
Q
QuickSpecs 98  
T
R
Taiwan battery recycling notice 113  
technical support 109, 120  
telephone numbers 120  
temperature requirements 35  
TPM (Trusted Platform Module) 86, 88  
troubleshooting 111  
rack bezel 85  
rack installation 34, 37  
rack mounting hardware 38  
rack warnings 37  
RAID configuration 105  
RBSU (ROM-Based Setup Utility) 98, 103, 104, 105  
rear panel buttons 14  
rear panel components 13  
rear panel LEDs 14  
U
UID LED 17  
rear panel, accessing 25  
redundant ROM 108  
registering the server 41  
updating the system ROM 108  
USB connector 7  
USB support 108  
regulatory compliance notices 113  
removing a hot-plug SAS hard drive 56  
removing the access panel 24  
retaining the recovery key/password 88  
ROM redundancy 108  
utilities 98, 105  
utilities, deployment 98, 102, 103  
V
ventilation 34  
Version Control 109  
video connector 7  
ROMPaq utility 98, 107, 108  
S
safety considerations 37, 108, 113, 114  
SAS and SATA device numbers 18  
scripted installation 102  
serial number 105  
W
warnings 37  
website, HP 120  
series number 113  
server features and options 42  
server setup 34, 108  
Service Packs 102  
shipping carton contents 38  
space and airflow requirements 34  
specifications, environmental 115  
specifications, mechanical 115  
specifications, power 116, 117, 118, 119  
specifications, server 115  
SPP 102  
static electricity 114  
support 120  
supported operating systems 109  
switches 17  
system battery 112  
system board components 15  
system components 7  
Index 134  
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