Philips Stereo Amplifier TDA7050 User Manual

INTEGRATED CIRCUITS  
DATA SHEET  
TDA7050  
Low voltage mono/stereo power  
amplifier  
June 1989  
Product specification  
File under Integrated Circuits, IC01  
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Philips Semiconductors  
Product specification  
Low voltage mono/stereo power amplifier  
TDA7050  
RATINGS  
Limiting values in accordance with the Absolute Maximum System (IEC 134)  
Supply voltage  
V
max.  
max.  
6 V  
P
Peak output current  
I
150 mA  
OM  
Total power dissipation  
Storage temperature range  
Crystal temperature  
see derating curve Fig.1  
T
T
55 to + 150 °C  
stg  
c
max.  
100 °C  
A.C. and d.c. short-circuit duration  
at V = 3,0 V (during mishandling)  
t
max.  
5 s  
P
sc  
Fig.1 Power derating curve.  
THERMAL RESISTANCE  
From junction to ambient  
R
=
110 K/W  
thj-a  
June 1989  
3
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Philips Semiconductors  
Product specification  
Low voltage mono/stereo power amplifier  
TDA7050  
CHARACTERISTICS  
V = 3 V; f = 1 kHz; R = 32 ; T  
= 25 °C; unless otherwise specified  
P
L
amb  
PARAMETER  
SYMBOL  
MIN.  
TYP.  
MAX.  
UNIT  
Supply  
Supply voltage  
V
1,6  
6,0  
V
P
Total quiescent current  
I
3,2  
4
mA  
tot  
Bridge-tied load application (BTL); see Fig.4  
Output power; note 1  
V = 3,0 V; d = 10%  
P
P
140  
150  
32  
mW  
mW  
dB  
P
tot  
o
V = 4,5 V; d = 10% (R = 64 )  
P
tot  
L
o
Voltage gain  
G
v
Noise output voltage (r.m.s. value)  
R = 5 k; f = 1 kHz  
V
1
140  
tbf  
40  
70  
µV  
µV  
mV  
MΩ  
nA  
S
no(rms)  
no(rms)  
R = 0 ; f = 500 kHz; B = 5 kHz  
V
S
D.C. output offset voltage (at R = 5 k)  
|V|  
|Z |  
S
Input impedance (at R = )  
S
i
Input bias current  
I
i
Stereo application; see Fig.5  
Output power; note 1  
V = 3,0 V; d = 10%  
P
35  
75  
26  
mW  
mW  
dB  
P
tot  
o
V = 4,5 V; d = 10%  
P
P
tot  
o
Voltage gain  
G
24.5  
27.5  
v
Noise output voltage (r.m.s. value)  
R = 5 k; f = 1 kHz  
V
100  
tbf  
µV  
µV  
S
no(rms)  
no(rms)  
R = 0 ; f = 500 kHz; B = 5 kHz  
V
S
Channel separation  
R = 0 ; f = 1 kHz  
Input impedance (at R = )  
α
|Z |  
30  
2
40  
dB  
MΩ  
nA  
S
S
i
Input bias current  
I
20  
i
Note  
1. Output power is measured directly at the output pins of the IC. It is shown as a function of the supply voltage in Fig.2  
(BTL application) and Fig.3 (stereo application).  
June 1989  
4
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Philips Semiconductors  
Product specification  
Low voltage mono/stereo power amplifier  
TDA7050  
Fig.2 Output power across the load impedance (R ) as a function of supply voltage (V ) in BTL application.  
L
P
Measurements were made at f = 1 kHz; d = 10%; T  
= 25 °C.  
tot  
amb  
Fig.3 Output power across the load impedance (R ) as a function of supply voltage (V ) in stereo application.  
L
P
Measurements were made at f = 1 kHz; d = 10%; T  
= 25 °C.  
tot  
amb  
June 1989  
5
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Philips Semiconductors  
Product specification  
Low voltage mono/stereo power amplifier  
TDA7050  
APPLICATION INFORMATION  
Fig.4 Application diagram (BTL); also used as test circuit.  
Fig.5 Application diagram (stereo); also used as test circuit.  
6
June 1989  
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Philips Semiconductors  
Product specification  
Low voltage mono/stereo power amplifier  
TDA7050  
PACKAGE OUTLINE  
DIP8: plastic dual in-line package; 8 leads (300 mil)  
SOT97-1  
D
M
E
A
2
A
A
1
L
c
w M  
Z
b
1
e
(e )  
1
M
H
b
b
2
8
5
pin 1 index  
E
1
4
0
5
10 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
(1)  
Z
A
A
A
(1)  
(1)  
1
2
w
UNIT  
mm  
b
b
b
c
D
E
e
e
L
M
M
H
1
2
1
E
max.  
min.  
max.  
max.  
1.73  
1.14  
0.53  
0.38  
1.07  
0.89  
0.36  
0.23  
9.8  
9.2  
6.48  
6.20  
3.60  
3.05  
8.25  
7.80  
10.0  
8.3  
4.2  
0.51  
3.2  
2.54  
0.10  
7.62  
0.30  
0.254  
0.01  
1.15  
0.068 0.021 0.042 0.014  
0.045 0.015 0.035 0.009  
0.39  
0.36  
0.26  
0.24  
0.14  
0.12  
0.32  
0.31  
0.39  
0.33  
inches  
0.17  
0.020  
0.13  
0.045  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
92-11-17  
95-02-04  
SOT97-1  
050G01  
MO-001AN  
June 1989  
7
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Philips Semiconductors  
Product specification  
Low voltage mono/stereo power amplifier  
TDA7050  
The device may be mounted up to the seating plane, but  
the temperature of the plastic body must not exceed the  
SOLDERING  
Introduction  
specified maximum storage temperature (T  
). If the  
stg max  
printed-circuit board has been pre-heated, forced cooling  
may be necessary immediately after soldering to keep the  
temperature within the permissible limit.  
There is no soldering method that is ideal for all IC  
packages. Wave soldering is often preferred when  
through-hole and surface mounted components are mixed  
on one printed-circuit board. However, wave soldering is  
not always suitable for surface mounted ICs, or for  
printed-circuits with high population densities. In these  
situations reflow soldering is often used.  
Repairing soldered joints  
Apply a low voltage soldering iron (less than 24 V) to the  
lead(s) of the package, below the seating plane or not  
more than 2 mm above it. If the temperature of the  
soldering iron bit is less than 300 °C it may remain in  
contact for up to 10 seconds. If the bit temperature is  
between 300 and 400 °C, contact may be up to 5 seconds.  
This text gives a very brief insight to a complex technology.  
A more in-depth account of soldering ICs can be found in  
our “IC Package Databook” (order code 9398 652 90011).  
Soldering by dipping or by wave  
The maximum permissible temperature of the solder is  
260 °C; solder at this temperature must not be in contact  
with the joint for more than 5 seconds. The total contact  
time of successive solder waves must not exceed  
5 seconds.  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
June 1989  
8
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