®
Intel Desktop Board
DZ75ML-45K
Optimized for Intel® -K Processors
microATX Form Factor
proDucT brieF
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intel® Desktop board DZ75ML-45K
Features and Benefits
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8
7
1
Support for the intel® core™ i7 processor
in the LGA 1155 package. optimized
for the intel® -K processors. Features
Intel® Turbo Boost Technology2, Intel®
Hyper-Threading Technology3
10 HDMi* and DVi-i Video connectors.
2
3
11 intel® Gigabit ethernet LAN: Features
onboard 10/100/1000 Mb/s Ethernet LAN
connectivity.
12 microATX (9.6” × 9.6”) Form Factor.
for exceptional performance and scalability.
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3
intel® Z75 express chipset: Features
Overclocking1 Support.
1
Four DiMM slots: Designed to support
overclocked1 DDR3 2400MHz + O.C.4
memory, delivering up to 32 GB/s
memory bandwidth.
5
6
4
Four Super-Speed uSb 3.0 ports
(2 external, 2 via internal header),
ten uSb 2.0 ports (4 external,
6 via internal headers).
opTiMiZeD For iNTeL®-K proceSSorS
Intel® Desktop Board optimized for Intel®
-K processors for maximum overclocking1
performance and best experience.
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4
5
6
pci express 3.0* ×16 slot.
10
9
12
pci express* x16 (x4 electrical)
and 2 pci express* x1 connectors.
9.6” (24.38 cm)
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Two SATA 6.0 Gb/s ports, four SATA
3.0 Gb/s ports.
iNTeL® FAST booT TecHNoLoGY
Go from system off to Windows*
in mere seconds.
ersal.GPU.Virtualization
intel® rapid Storage Technology:
Performance and reliability with support
for RAID 0, 1, 5, 10.
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4
9
10
9
8 channel (5.1+2) intel® High
-Definition-Audio5 Enables high-quality
integrated audio that rivals the perfor-
mance of high-end discrete solutions.
poWer SuperViSor
Active monitoring of power ensures
system protection.
3
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intel® Desktop board DZ75ML-45K
Technical Specifications
proceSSor
processor Support
eXpANSioN cApAbiLiTieS
•
•
•
One PCI Express* 3.0 x16 connector
One PCI Express* 2.0 x16 connector (x4 Electrical)
Two PCI Express* 2.0 x1 connector
MecHANicAL
board Style
eMc reGuLATioNS (cLASS b)
united States
FCC CFR Title 47, Chapter I, Part 15, Subparts A/B
canada
ICES-003
europe
(EMC Directive 2004/108/EC)
EN 55022 and EN 55024
Australia/New Zealand
EN 55022
•
Optimized for Intel® -K processors. Supports 2nd and 3rd
Generation Intel® Core™, and other Intel® processors
in the LGA1155 package
•
microATX
board Size
AuDio
•
9.6” x 9.6” (24.38 cm x 24.38 cm)
cHipSeT
intel® Z75 express chipset
•
•
5.1 + 2 Intel® High Definition Audio5
Three stack analog audio ports plus internal S/PDIF
headers
baseboard power requirements
•
ATX 12 V
•
•
Intel® Z75 PCH
Intel® Rapid Storage Manager (RAID 0, 1, 5, 10)
eNViroNMeNT
operating Temperature
ViDeo
HDMI* and DVI-I Video connectors for Intel® processors
with Intel® HD Graphics
peripHerAL coNNecTiViTY
•
•
0° C to +55° C
Storage Temperature
• –20° C to +70° C
Japan
•
•
•
Two SATA 6.0 Gb/s ports
Four SATA 3.0 Gb/s ports
Four SuperSpeed USB 3.0 ports with 5.0 Gb/s link speed
(two back panel and two via internal headers)
Ten Hi-Speed USB 2.0 ports (four back panel ports
and six ports via internal headers)
VCCI V-3, V-4
South Korea
KN-22 and KN-24
Taiwan
CNS 13438
international
CISPR 22
SYSTeM MeMorY
Memory capacity
•
•
Four 240-pin DIMM connectors supporting up to four
double-sided DIMMs
reGuLATioNS AND SAFeTY STANDArDS
united States
UL 60950-1
•
Maximum system memory up to 32 GB6 using 8 GB
doublesided DIMMs
SYSTeM bioS
canada
•
•
•
•
•
64 Mb Flash EEPROM with Intel® Platform
Innovation Framework for EFI Plug and Play
Advanced configuration and power interface
V3.0b, SMBIOS2.5
CAN/CSA-C22.2 No. 60950-1
europe
(Low Voltage Directive 2006/95/EC)
EN 60950-1
international
IEC 60950-1
eNViroNMeNTAL coMpLiANce
europe
Europe RoHS (Directive 2002/95/EC)
WEEE (Directive 2002/96/EC)
china
Intel® Express BIOS update support
China RoHS
HArDWAre MANAGeMeNT FeATureS
•
•
•
•
•
Processor fan speed control
Front and rear system chassis fan speed control
Voltage and temperature sensing
Fan sensor inputs used to monitor fan activity
ACPI-compliant power management support
JuMperS AND FroNT pANeL coNNecTorS
Jumpers
•
Jumper access for BIOS maintenance mode
Front panel connectors
•
•
Reset, HD LED, Power LEDs, power on/off
Front-panel audio header
iNTeL® pro 10/100/1000 NeTWorK coNNecTioN
Low-power design
•
other connectors
Chassis intrusion detect header
•
1
2
3
4
Warning: Altering clock frequency and/or voltage may (i) reduce system stability
and useful life of the system and processor; (ii) cause the processor and other
system components to fail; (iii) cause reductions in system performance; (iv) cause
additional damage; and (v) affect system data integrity. Intel has not tested,
and does not warranty, the operation of the processor beyond its specifications.
Intel® Turbo Boost Technology requires a PC with a processor with Intel Turbo
Boost Technology capability. Intel Turbo Boost Technology performance varies
depending on hardware, software, and overall system configuration. Check with
your PC manufacturer on whether your system delivers Intel Turbo Boost Technology.
Intel® Hyper-Threading Technology requires a computer system with a procesor
supporting HT Technology and an HT Technology-enabled chipset, BIOS,
and operating system. Performance will vary depending on the specific hardware
and software you use. For more information including details on which processors
5 Intel® High Definition Audio requires a system with an appropriate Intel® chipset
and a motherboard with an appropriate codec and the necessary drivers installed.
System sound quality will vary depending on actual implementation, controller,
codec, drivers, and speakers. For more information about Intel® HD Audio, refer
6 System resources and hardware (such as PCI and PCI Express*) require physical
memory address locations that can reduce available addressable system memory.
This could result in a reduction of as much as 1 GB or more of physical addressable
memory being available to the operating system and applications, depending
on the system configuration and operating system.
Intel products are not intended for use in medical, life-saving, or life sustaining
applications. Intel may make changes to specifications and product descriptions
at any time, without notice.
All products, dates, and figures specified are preliminary based on current expec-
tations, and are subject to change without notice. Availability in different channels
may vary.
For ordering information, visit
For the most current product information, visit
Actual Intel® Desktop Board may differ from the image shown.
Other names and brands may be claimed as the property of others.
*
Copyright 2012 Intel Corporation 09/12/FB/MED/PDF 327986-001US
©
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL®
PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,
TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT.
EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH
PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS
ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL
PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR
A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT,
COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT.
Maximum peak memory bandwidth requires four DDR 3 modules to be populated
in each of the blue memory slots. DDR 3 2400 memory support on this
motherboard requires advanced knowledge of BIOS and memory tuning; individual
results may vary. For specific supported memory for this motherboard, please
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