Intel Mobile Board MGM45WU User Manual

Intel® Mobile Board MGM45WU  
Product Guide  
Order Number: E41916-002  
Preface  
This Product Guide gives information about board layout, component installation, BIOS  
update, and regulatory requirements for Intel® Mobile Board MGM45WU.  
Intended Audience  
The Product Guide is intended for technically qualified personnel. It is not intended for  
general audiences.  
Use Only for Intended Applications  
All Intel Mobile Boards are evaluated as Information Technology Equipment (I.T.E.) for  
use in personal computers (PC) for installation in homes, offices, schools, computer  
rooms, and similar locations. The suitability of this product for other PC or embedded  
non-PC applications or other environments, such as medical, industrial, alarm systems,  
test equipment, etc. may not be supported without further evaluation by Intel.  
Document Organization  
The chapters in this Product Guide are arranged as follows:  
1 Mobile Board Features: a summary of product features  
2 Installing and Replacing Mobile Board Components: instructions on how to install  
the Mobile Board and other hardware components  
3 Updating the BIOS: instructions on how to update the BIOS  
A Intel® Mobile Utility: information how to use this software to manage your  
computer  
B Regulatory Compliance: safety standards, regulations, and product certifications  
Conventions  
The following conventions are used in this manual:  
CAUTION  
Cautions warn the user about how to prevent damage to hardware or loss of data.  
NOTE  
Notes call attention to important information.  
iii  
Intel Mobile Board MGM45WU Product Guide  
Terminology  
The table below gives descriptions of some common terms used in the product guide.  
Term  
GB  
Description  
Gigabyte (1,073,741,824 bytes)  
Gigahertz (one billion hertz)  
Kilobyte (1024 bytes)  
GHz  
KB  
MB  
Megabyte (1,048,576 bytes)  
Megabit (1,048,576 bits)  
Megahertz (one million hertz)  
Mbit  
MHz  
iv  
Contents  
1 Mobile Board Features  
Mobile Board Components...................................................................................11  
Processor..........................................................................................................17  
System Memory.................................................................................................17  
Intel® GM45 Express Chipset ...............................................................................18  
Intel GM45 Graphics Subsystem...........................................................................18  
Mobile Embedded Controller ................................................................................19  
Intel® Turbo Memory..........................................................................................19  
Audio Subsystem ...............................................................................................19  
Touch Pad Support.............................................................................................20  
Status LEDs and Quick Buttons ............................................................................20  
Status LEDs...............................................................................................20  
Quick Buttons ............................................................................................22  
Keyboard Support..............................................................................................23  
Language Support ......................................................................................23  
Function Keys/Hot Keys...............................................................................24  
Connectivity......................................................................................................26  
Integrated Gigabit Ethernet LAN ...................................................................26  
LAN Software......................................................................................26  
LAN Status Indicators ..........................................................................26  
Wireless LAN Support..................................................................................27  
Bluetooth* Technology Support ....................................................................27  
Modem Support..........................................................................................27  
Microphone Support ...........................................................................................27  
Intel® Active Management Technology (Intel® AMT)................................................28  
Expandability.....................................................................................................28  
External USB 2.0 Support ............................................................................28  
ExpressCard* Support.................................................................................29  
PCI Express* Support .................................................................................29  
Docking Station Connector...........................................................................29  
Storage ............................................................................................................30  
BIOS................................................................................................................30  
Serial ATA Auto Configuration.......................................................................30  
PCI Express Auto Configuration ....................................................................30  
Security Passwords.....................................................................................30  
Hard Disk Drive Passwords...........................................................................31  
Hard Disk Drive Password Feature During BIOS POST...............................31  
Intel® Trusted Platform Module (Intel® TPM)..........................................................32  
Fingerprint Reader Support (optional)...................................................................32  
Smart Card Reader Support (optional) ..................................................................32  
Power and Power Management.............................................................................33  
Power Supply and Battery Pack ....................................................................33  
Power Management ....................................................................................33  
CMOS Battery....................................................................................................34  
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Intel Mobile Board MGM45WU Product Guide  
2 Installing and Replacing Mobile Board Components  
Before You Begin ...............................................................................................35  
Installing a Processor .........................................................................................37  
Installing the Thermal Module..............................................................................38  
Attaching the I/O Bezel.......................................................................................40  
Installing a Modem.............................................................................................41  
Installing Expansion Board A ...............................................................................42  
Installing the Mobile Board..................................................................................43  
Connecting the Mobile Board to Expansion Board A..........................................43  
Attaching the C-plate to the D-tray ...............................................................45  
Connecting Cables to the Bottom of the Mobile Board..............................................46  
Attaching the Touch Pad and the Fingerprint Reader (optional) Cables.......................47  
Attaching the Lid/LCD.........................................................................................49  
Installing an Optical Disk Drive ............................................................................52  
Installing a Hard Disk Drive.................................................................................53  
Installing a Keyboard and Keyboard Cover.............................................................54  
Installing a Keyboard ..................................................................................54  
Installing the Keyboard Cover ......................................................................55  
Installing System Memory...................................................................................56  
Installing a Wireless LAN Card .............................................................................57  
Installing an Intel® Turbo Memory Card.................................................................59  
Setting the BIOS Configuration Jumper .................................................................61  
Completing Assembly of the Chassis.....................................................................62  
Installing the Hard Disk Drive Bay Cover........................................................62  
Installing the D-tray Door............................................................................63  
Clearing or Changing Passwords...........................................................................64  
Clearing BIOS Security Passwords.................................................................64  
Clearing or Changing Hard Disk Drive Passwords.............................................65  
3 Updating the BIOS  
Updating the BIOS with the Intel® Express BIOS Update Utility.................................67  
Updating the BIOS with the ISO Image BIOS Update File or the Iflash  
Memory Update Utility...................................................................................68  
Obtaining the BIOS Update File ....................................................................68  
Updating the BIOS with the ISO Image BIOS Update File .................................68  
Updating the BIOS with the Iflash Memory Update Utility .................................69  
Recovering the BIOS...................................................................................70  
A Intel® Mobile Utility  
B Regulatory Compliance  
Safety Standards ...............................................................................................75  
Battery Disposal Information ...............................................................................76  
European Union Declaration of Conformity Statement..............................................80  
Product Ecology Statements ................................................................................81  
Recycling Considerations .............................................................................81  
Lead-free 2LI/Pb-free 2LI Board ...................................................................84  
Restriction of Hazardous Substances (RoHS) ..................................................85  
EU RoHS............................................................................................85  
China RoHS........................................................................................86  
vi  
Contents  
EMC Regulations................................................................................................88  
Ensure Electromagnetic Compatibility (EMC) Compliance..................................89  
Product Certifications..........................................................................................90  
Board-Level Certification Markings ................................................................90  
Chassis and Component Certifications............................................................91  
Figures  
1. Intel Mobile Board MGM45WU Components (top) ..............................................11  
2. Intel Mobile Board MGM45WU Components (bottom).........................................13  
3. Intel Mobile Board MGM45WU I/O Ports...........................................................15  
4. Expansion Board A Components .....................................................................15  
5. Expansion Board A I/O Ports ..........................................................................16  
6. Intel Mobile Board MGM45WU Indicator LEDs ...................................................20  
7. Intel Mobile Board MGM45WU Quick Buttons ....................................................22  
8. Intel Mobile Board MGM45WU Hot Keys ...........................................................24  
9. Installing a Processor....................................................................................37  
10. Installing the Thermal Module ........................................................................39  
11. Attaching the I/O Bezel .................................................................................40  
12. Installing a Modem .......................................................................................41  
13. Installing Expansion Board A in the D-tray .......................................................42  
14. Connecting the Mobile Board to Expansion Board A ...........................................44  
15. Attaching the C-plate to the D-tray .................................................................45  
16. Connecting Cables to the Bottom of the Mobile Board ........................................46  
17. Attaching the Touch Pad and Fingerprint Reader Cables .....................................48  
18. Attaching the Lid/LCD to the Hinges and Connecting the LVDS Cable ...................50  
19. Securing the Lid/LCD Hinge Alignment Pins ......................................................51  
20. Installing an Optical Disk Drive.......................................................................52  
21. Installing a Hard Disk Drive............................................................................53  
22. Installing a Keyboard ....................................................................................54  
23. Installing a Keyboard Cover ...........................................................................55  
24. Installing DIMMs ..........................................................................................56  
25. Installing a PCI Express Full-Mini Wireless LAN Card..........................................57  
26. Installing a PCI Express Half-Mini Wireless LAN Card .........................................58  
27. Connecting the Antenna Wires........................................................................58  
28. Installing a PCI Express Full-Mini Intel Turbo Memory Card.................................59  
29. Installing a PCI Express Half-Mini Intel Turbo Memory Card................................60  
30. BIOS Configuration Jumper............................................................................61  
31. Installing the Hard Disk Drive Cover................................................................62  
32. Installing the D-tray Door..............................................................................63  
33. Intel Mobile Board MGM45WU China RoHS Material Self Declaration Table ............87  
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Intel Mobile Board MGM45WU Product Guide  
Tables  
1. Feature Summary.......................................................................................... 9  
2. Intel Mobile Board MGM45WU Components (top) ..............................................12  
3. Intel Mobile Board MGM45WU Components (bottom).........................................14  
4. Intel Mobile Board MGM45WU I/O Ports...........................................................15  
5. Expansion Board A Components .....................................................................16  
6. Expansion Board A I/O Ports ..........................................................................16  
7. Intel Mobile Board MGM45WU Indicator LEDs ...................................................21  
8. Intel Mobile Board MGM45WU Quick Buttons ....................................................22  
9. Keyboard Matrix Assignment for 32 Languages .................................................23  
10. Intel Mobile Board MGM45WU Hot Keys ...........................................................25  
11. LAN Connector LEDs .....................................................................................26  
12. Wake-up Devices and Events When Operating on Battery Power..........................33  
13. Wake-up Devices and Events When Operating on AC Adapter Power....................34  
14. Jumper Settings for the BIOS Setup Program Modes..........................................61  
15. Safety Standards..........................................................................................75  
16. Lead-Free Second Level Interconnect Marks .....................................................85  
17. China RoHS Environmentally Friendly Use Period Mark.......................................86  
18. EMC Regulations...........................................................................................88  
19. Product Certification Markings ........................................................................90  
viii  
1 Mobile Board Features  
This chapter briefly describes the features of Intel® Mobile Board MGM45WU. Table 1  
summarizes the major features of the Mobile Board.  
Table 1. Feature Summary  
Rich Creek 2 standard (220 mm x 213 mm) form factor  
Board Dimensions  
Processor  
Support for Intel® Core™2 Duo mobile processors with a  
1066/800 FSB and Intel® Celeron® mobile processors with a 667 FSB  
via an mPGA479 socket  
System Memory  
Two 200-pin, DDR2 SDRAM Small Outline Dual Inline Memory  
Module (SO-DIMM) sockets  
800/667 MHz dual-channel interleaved mode DDR2 SDRAM interface  
Support for up to 4 GB of system memory (2 GB per channel)  
Intel® Turbo  
Memory  
Support for an optional Intel® Turbo Memory card via the PCI Express*  
Full-Mini and Half-Mini Card connectors  
Chipset  
Mobile Intel® GM45 Express Chipset consisting of:  
Mobile Intel GM45 Express Chipset Graphics and Memory Controller  
Hub (GMCH)  
Intel® 82801IEM ICH9 Mobile Enhanced (Intel® ICH9M-E) I/O  
Controller  
Graphics  
Audio  
Mobile Intel® Graphics Media Accelerator 4500MHD (Intel® GMA  
4500MHD)  
DVI-I single link output (VGA is available with a DVI-I-to-VGA  
adapter)  
Intel® High Definition Audio (Intel® HD Audio) via the RealTek*  
ALC269 audio codec  
Onboard analog microphone  
Two analog audio jacks (Mic/Line in and Line out/headphones) on  
Expansion Board B  
Connectivity  
Expandability  
Intel 82567LM Gigabit (10/100/1000 Mb/s) Ethernet LAN controller  
including support for AMT  
Support for an optional 56K modem via an RJ-11 connector and an  
onboard MDC connector  
Support for an optional 802.11 A/G/N wireless LAN add-in card via  
the PCI Express Full-Mini and Half-Mini Card connectors  
BlueTooth* support  
Four external USB 2.0 ports:  
one on the Mobile Board  
two on Expansion Board A  
one on Expansion Board B  
ExpressCard*/34 slot  
One PCI Express Full-Mini Card connector  
One PCI Express Half-Mini Card connector  
Bottom docking connector  
continued  
9
 
Intel Mobile Board MGM45WU Product Guide  
Table 1. Feature Summary (continued)  
Storage  
Two 300 Mb/s SATA interfaces: one supporting a hard disk drive  
and one supporting an optical disk drive  
Embedded  
Controller  
Winbond* WPC8763L Mobile Embedded Controller which provides  
the following:  
Keyboard control  
Touch pad  
Thermal module fan control  
SPI Flash interface  
BIOS  
Intel® Extensible Firmware Interface (EFI) BIOS  
Support for SMBIOS  
Intel® Rapid BIOS Boot  
Intel® Express BIOS Update  
Support for Intel® Active Management Technology (Intel® AMT)  
Intel® Trusted Platform Module (Intel® TPM), revision 1.2, enhances  
platform security.  
Manageability  
Security  
Operating System  
Support  
Microsoft Windows Vista*, SP1  
All 32-bit versions  
All 64-bit versions  
Microsoft Windows* XP, SP2 and SP3  
Professional  
Home  
Microsoft Windows* XP 64-bit  
64-bit driver support for all subsystems  
Miscellaneous  
Support for a Fingerprint Reader via USB  
Support for a Web Camera via USB  
Support for a Smart Card Reader via Expansion Board B  
Support for Digital Array Microphones  
Support for Intel® Power Manager  
Support for Wave Systems Corporation EMBASSY* Trust Suite  
(ETS) OEM version  
10  
Mobile Board Features  
Mobile Board Components  
Figure 1 shows the location of the major components on the top side of Intel Mobile  
Board MGM45WU; Table 2 identifies the components.  
Figure 1. Intel Mobile Board MGM45WU Components (top)  
11  
   
Intel Mobile Board MGM45WU Product Guide  
Table 2. Intel Mobile Board MGM45WU Components (top)  
Label  
Description  
A
B
C
D
E
F
ExpressCard/34 slot  
Power button  
LVDS/Lid connector  
Analog microphone  
ID expansion connector A  
Keyboard connector  
ID expansion connector B (fingerprint reader)  
Touch pad connector  
Touch pad buttons  
Battery LED  
G
H
I
J
K
L
Machine status LED  
Hard disk drive LED  
Caps lock LED  
M
N
O
P
Num lock LED  
Wireless LED  
Bluetooth LED  
12  
 
Mobile Board Features  
Figure 2 shows the location of the major components on the bottom side of Intel  
Figure 2. Intel Mobile Board MGM45WU Components (bottom)  
13  
 
Intel Mobile Board MGM45WU Product Guide  
Table 3. Intel Mobile Board MGM45WU Components (bottom)  
Label  
A
Description  
DVI-I connector  
B
USB 2.0 connector  
C
RJ-11 (telephone) connector  
Modem (MDC) connector  
CMOS battery  
D
E
F
BIOS configuration jumper  
Processor socket  
G
H
I
Modem connector  
Thermal module fan connector  
PCI Express full-mini card connector  
Speakers connector  
J
K
L
Expansion Board B connector  
Bluetooth connector  
M
N
O
P
Hard disk drive (SATA) connector  
PCI Express half-mini card connector  
Optical disk drive (SATA) connector  
Expansion Board A board-to-board connector  
Expansion Board A connector  
Battery pack connector  
Docking connector  
Q
R
S
T
U
V
DIMM 2 socket  
DIMM 1 socket  
14  
 
Mobile Board Features  
Figure 3 is a side view of the Mobile Board showing its I/O ports; Table 4 identifies the  
ports.  
Figure 3. Intel Mobile Board MGM45WU I/O Ports  
Table 4. Intel Mobile Board MGM45WU I/O Ports  
Label  
Description  
A
B
C
D
ExpressCard/34 slot  
RJ-11 connector  
USB 2.0 connector  
DVI-I connector  
Figure 4 shows the location of the major components on the top and bottom of  
Figure 4. Expansion Board A Components  
15  
     
Intel Mobile Board MGM45WU Product Guide  
Table 5. Expansion Board A Components  
Label  
Description  
A
B
C
D
E
F
Expansion Board A connector  
Expansion Board A board-to-board connector  
DC power jack  
RJ-45 (LAN) connector  
USB 2.0 connector  
USB 2.0 connector  
G
H
I
Audio mute button  
+ Volume button  
– Volume button  
J
Wireless radio on/off button  
Launch Internet browser button  
K
the ports.  
Figure 5. Expansion Board A I/O Ports  
Table 6. Expansion Board A I/O Ports  
Label  
Description  
A
B
C
D
USB 2.0 connector  
USB 2.0 connector  
RJ-45 (LAN) connector  
DC power jack  
16  
     
Mobile Board Features  
Processor  
Intel Mobile Board MGM45WU supports the following Intel® processors in the mPGA479  
package:  
Intel Core 2 Duo mobile processors with a 1066/800 FSB  
Intel Celeron mobile processors with a 667 FSB  
Processors are not included with the Mobile Board and must be purchased separately.  
For instructions on installing a processor, go to page 37 in Chapter 2.  
System Memory  
NOTE  
To be fully compliant with all applicable Intel® SDRAM memory specifications, the  
board should be populated with DIMMs that support the Serial Presence Detect (SPD)  
data structure. If your memory modules do not support SPD, you will see a  
notification to this effect on the screen at power up. The BIOS will attempt to  
configure the memory controller for normal operation.  
The Mobile Board supports the dual or single channel memory configurations defined  
below.  
Two 200-pin Double Data Rate 2 (DDR2) Small Outline Dual Inline Memory Module  
(SO-DIMM) sockets with gold-plated contacts  
Support for:  
Non-ECC DDR2 800/667 memory  
Serial Presence Detect (SPD) memory only  
Unbuffered, non-registered single- or double-sided DIMMs  
Memory configurations listed below:  
Up to 2.0 GB utilizing 256 Mb technology  
Up to 4.0 GB utilizing 512 Mb or 1 Gb technology  
For instructions on installing memory, refer to “Installing System Memory” on page 56  
in Chapter 2.  
17  
   
Intel Mobile Board MGM45WU Product Guide  
Intel® GM45 Express Chipset  
The Intel GM45 Express Chipset consists of the following devices:  
Intel GM45 Express Chipset Graphics and Memory Controller Hub (GMCH) with  
Direct Media Interface (DMI)  
Intel 82801IEM ICH9 Mobile Enhanced (Intel ICH9M-E) I/O Controller Hub  
The GMCH provides interfaces to the processor, memory, and the DMI interconnect.  
The component also provides integrated graphics capabilities supporting 3D, 2D, and  
display capabilities.  
The Intel ICH9M-E is the centralized controller for the board’s I/O paths.  
For more information on the Intel GM45 Express Chipset, go to  
Intel GM45 Graphics Subsystem  
The Intel GM45 Express Chipset contains the Intel Graphics Media Accelerator  
4500MHD (GMA 4500MHD) graphics controller.  
The graphics controller supports external displays via the DVI-I connector on the side  
of the Mobile Board.  
The Intel GMA 4500MHD graphics controller has the following features:  
Advanced graphics performance, including:  
DirectX10.0* and OpenGL* 2.0 compliance  
Shader Model 4.0 support  
Enhanced video playback support, including:  
Playback of HD-DVD and Blu-ray Disc* technology DVDs  
Software DVD at 30 fps full screen  
Advanced Display support, including:  
DVI specification 1.0 compliance  
High Definition Content Protection (HDCP) version 1.1 compliance  
External digital and analog DVI display support. Analog signals are available  
with a DVI-to-VGA adapter.  
HD display support including 720p, 1080i, and 1080p  
External digital and analog display support up to 2048 x 1536 at a 75-Hz  
refresh rate (QXGA). Also supports 1920 x 1080 resolution for full High  
Definition video playback quality.  
18  
   
Mobile Board Features  
Mobile Embedded Controller  
The Winbond* WPC8763L Mobile Embedded Controller features the following:  
Low pin count (LPC) interface  
Fan speed closed loop control via Pulse Width Modulation (PWM)  
Keyboard/mouse controller  
Touch pad controller  
Intel® Turbo Memory  
The Mobile Board provides support for Intel Turbo Memory by providing two onboard  
PCI Express Mini Card connectors in which an Intel Turbo Memory card can be  
installed: one half-mini and one full-mini connector.  
Intel Turbo Memory uses Flash memory technology and software drivers to deliver an  
enhanced mobile experience when using Microsoft Windows Vista. Intel Turbo Memory  
enhances processor performance by speeding up data going to the Intel Core 2 Duo  
processor. It helps the processor by storing large amounts of frequently used  
information for faster access:  
Results in less system lag time  
Stores data the processor is likely to need  
Enhances the ability of Windows Vista to remember and store key data from your  
frequently used applications  
Refer to “Installing an Intel® Turbo Memory Card” on page 59 for instructions for  
installing an Intel Turbo memory card on the Mobile Board.  
Audio Subsystem  
The onboard audio subsystem features the following:  
RealTek* ALC269 audio codec with a signal-to-noise (S/N) ratio of 95 dB  
Intel High Definition Audio using integrated chassis speakers  
Support for independent multistreaming audio for audio out the integrated  
speakers and stereo out the notebook headphone jack  
Support for two integrated 1-watt, 8-ohm speakers via the speakers connector on  
the Mobile Board  
Support for two analog external audio ports on Expansion Board B:  
Mic/Line-in jack  
Headphone jack  
Support for two digital array microphones via the Lid/LVDS features connector on  
the Mobile Board  
Onboard analog microphone  
19  
     
Intel Mobile Board MGM45WU Product Guide  
Go to the following locations for more information about:  
Audio drivers and utilities http://support.intel.com/support/mobile  
Location of the onboard audio connectors see , Figure 2 on page 13  
Touch Pad Support  
The Mobile Board supports a Touch Pad for cursor control. The Touch Pad is  
preinstalled in the chassis. The Mobile Board includes a Touch Pad connector  
(Figure 1, G) and two Touch Pad button switches (Figure 1, H). The Touch Pad and  
button switches can be disabled in the Mobile Board BIOS. Refer to “Attaching the  
connecting the Touch Pad cable to the Mobile Board.  
Status LEDs and Quick Buttons  
This section presents an overview of the status LEDs and “quick buttons” included on  
the Mobile Board.  
Status LEDs  
The indicator LEDs included on the Mobile Board are show in Figure 6 and described in  
Figure 6. Intel Mobile Board MGM45WU Indicator LEDs  
20  
       
Mobile Board Features  
Table 7. Intel Mobile Board MGM45WU Indicator LEDs  
Figure  
Ref.  
LED  
Color  
State  
Indicates  
A
Bluetooth Wireless  
Green  
Blinking  
Bluetooth Wireless activity is  
occurring.  
Off  
Bluetooth Wireless connection is not  
established.  
B
Wireless LAN  
Green  
Blinking  
Off  
Wireless LAN activity is occurring.  
Wireless LAN connection is not  
established.  
C
D
E
F
Num Lock  
Green  
Green  
Green  
Green  
Green  
On  
Num Lock is on.  
Off  
Num Lock is off.  
Caps Lock  
On  
Caps Lock is on.  
Off  
Caps Lock is off.  
HDD Activity  
Machine Status  
Battery/AC Power  
Blinking  
Off  
Hard disk drive is being accessed.  
Hard disk drive is idle.  
Board is in ACPI state S0 or S4.  
Board is in ACPI state S3.  
Off  
On  
G
On  
Battery not installed; operating on AC  
power  
On  
Operating on battery; battery fully  
charged  
Blinking  
On  
Battery charging; charge >90%  
Battery charging; charge <90%  
Low battery  
Amber  
Blinking  
21  
 
Intel Mobile Board MGM45WU Product Guide  
Quick Buttons  
The Quick Buttons are located on the top of Expansion Board A (see Figure 7). They  
control certain pre-defined functions of the notebook. After chassis assembly, the  
Quick Buttons are accessible to the user on the top left of the chassis directly above  
the keyboard. These buttons provide quick access to the common functions listed in  
Figure 7. Intel Mobile Board MGM45WU Quick Buttons  
Table 8. Intel Mobile Board MGM45WU Quick Buttons  
Button Function  
A
B
C
D
E
Internet: Pressing this button launches the default  
Web Browser.  
Wireless Radios On/Off: Pressing this button toggles  
the wireless radios on and off.  
Volume Down: Pressing this button decreases the  
audio from the notebook speakers.  
Volume Up: Pressing this button increases the audio  
from the notebook speakers.  
Audio Mute: Pressing this button silences the audio  
from the notebook speakers.  
22  
     
Mobile Board Features  
Keyboard Support  
The Mobile Board supports CBB keyboards which support 32 languages and 12  
function keys.  
Language Support  
The Mobile Board supports 32 languages via four keyboard matrices that can be  
selected in the BIOS setup program. The keyboard matrix choices are as follows:  
United States (US) (default)  
United Kingdom (UK)  
Japan (JA)  
Brazil (BR)  
Table 9 lists the languages and countries supported by each of the matrices.  
Table 9. Keyboard Matrix Assignment for 32 Languages  
Number  
1
Languages and Countries  
US  
Abbreviation  
Keyboard Matrix  
US  
CF  
US  
UK  
UK  
UK  
US  
UK  
UK  
UK  
UK  
UK  
UK  
UK  
UK  
UK  
UK  
UK  
UK  
UK  
UK  
UK  
UK  
JA  
2
Fr Canada  
Arabia  
3
AR  
BE  
4
Belgium  
5
Czech Republic  
Denmark  
CZ  
DM  
FR  
6
7
France  
8
Germany  
GR  
GK  
HG  
HB  
IT  
9
Greece/Poland  
Hungary  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
Israel (Hebrew)  
Italy  
Netherlands  
Norway  
DT  
NW  
PO  
RU  
SP  
Portugal  
Russian  
Spain  
Sweden/Finland  
Switzerland (GR/FR/IT/EN)  
Turkey  
SD/FL  
SW  
TR  
UK  
UK  
JA  
Japan  
Iceland  
ICE  
LA  
UK  
UK  
Latin America  
continued  
23  
     
Intel Mobile Board MGM45WU Product Guide  
Table 9. Keyboard Matrix Assignment for 32 Languages (continued)  
Number  
25  
Languages and Countries  
Abbreviation  
Keyboard Matrix  
Brazil  
UK  
TI  
BR  
US  
US  
UK  
US  
US  
US  
UK  
26  
Thailand  
PRC Chinese  
Slovakia  
Taiwan  
27  
SC  
SK  
CH  
KR  
UI  
28  
29  
30  
Korea  
31  
US-INTL  
Poland  
32  
PL  
Function Keys/Hot Keys  
The top row of the keys on the keyboard are the function keys: F1 to F12 (see  
Figure 8 for the location of the function keys). Function keys are multi-purpose keys  
that perform functions defined by individual programs.  
Hot key functions are assigned to the F1 to F12 keys by your computer. When the  
Mobile Utility software is installed on your computer, the functions defined in Table 10  
are available to the user. Refer to Appendix A for more information on the Mobile  
Utility.  
Figure 8. Intel Mobile Board MGM45WU Hot Keys  
24  
   
Mobile Board Features  
Table 10.Intel Mobile Board MGM45WU Hot Keys  
Function Key  
Description  
Sleep/Hibernate: Pressing this key combination causes a pop-up window  
to appear and ask the user if they want to place the computer in Sleep  
(S3) or Hibernate (S4) mode.  
Wireless Radios On/Off: Pressing this key combination causes a pop-up  
window to appear and ask the user if they want to turn Wireless LAN or  
Bluetooth off or on.  
Video Output Selection: Pressing this key combination causes a pop-up  
window to appear which allows the user to switch the display to external  
devices.  
Decrease LCD Brightness: Pressing this key combination decreases the  
LCD brightness.  
Increase LCD Brightness: Pressing this key combination increases the LCD  
brightness.  
Audio Mute: Pressing this key combination silences the audio.  
Volume Decrease: Pressing this key combination decreases the audio  
volume.  
Volume Increase: Pressing this key combination increases the audio  
volume.  
Play/Pause: Pressing this key combination plays or pauses audio or video  
playback.  
Stop: Pressing this key combination stops audio or video playback.  
Rewind: Pressing this key combination rewinds video or moves audio back  
a track.  
Fast Forward: Pressing this key combination fast forwards a video or  
moves audio forward a track.  
25  
 
Intel Mobile Board MGM45WU Product Guide  
Connectivity  
This section describes the various features the Mobile Board provides to connect to  
networks and the Internet.  
Integrated Gigabit Ethernet LAN  
The LAN subsystem includes:  
Intel ICH9M-E  
Intel 82567LM Gigabit (10/100/1000 Mb/s) Ethernet LAN controller with support  
for:  
Intel AMT  
Alert Standard Format (ASF) 2.0  
Virtual LAN driver support for Intel® Virtualization Technology (Intel® VT)  
partitions  
RJ-45 LAN connector with integrated status LEDs on Expansion Board A  
The subsystem also features:  
CSMA/CD protocol engine  
LAN connect interface between the ICH9M-E and the LAN controller  
PCI bus power management  
LAN Software  
For information about LAN software and drivers go to  
LAN Status Indicators  
Two LEDs are built into the RJ-45 LAN connector located on Expansion Board A (see  
Figure 5, C). These LEDs indicate the operating states of the LAN.  
Table 11 describes the LED states when the board is powered on and the LAN  
subsystem is operating.  
Table 11.LAN Connector LEDs  
LED  
LED Color  
LED State  
Off  
Indicates  
Link  
Yellow  
LAN link is not established.  
LAN link is established.  
LAN activity is occurring.  
10 Mb/s data rate  
On  
Blinking  
On  
Speed  
Amber  
Green  
Yellow  
On  
100 Mb/s data rate  
1000 Mb/s data rate  
On  
26  
         
Mobile Board Features  
Wireless LAN Support  
The Mobile Board provides support for a Wireless LAN via the onboard PCI Express Mini  
Card connectors. Both full-mini and half-mini cards are supported (refer to “Installing  
a Wireless LAN Card” on page 57 for installation instructions). Wireless connectivity  
can be provided by Intel® PRO/Wireless network connection cards. The Intel  
PRO/Wireless network connection provides deployment flexibility and connectivity  
convenience by offering a choice of products including a tri-mode (supporting  
802.11a/g/n) product.  
Bluetooth* Technology Support  
The Mobile Board includes a Bluetooth USB connector to support a Bluetooth module  
installed in the notebook chassis. The Bluetooth module must have the following  
features:  
Self-contained antenna  
Support for USB selective suspend  
Coexistence with the Wireless LAN adapter  
Able to be completely disabled by the Mobile Board BIOS  
Modem Support  
The Mobile Board supports a 56K Modem by providing the following:  
Onboard modem-only Motherboard Daughter Card (MDC) 1.5 connector  
MDC mounting standoffs  
RJ-11 connector  
Refer to “Installing a Modem” on page 41 for modem installation instructions.  
Microphone Support  
Intel Mobile Board MGM45WU supports analog and digital microphones. An analog  
microphone (see Figure 1, D) is located on the Mobile Board under the notebook  
keyboard cover. An optional digital array microphone can be installed in the lid of the  
notebook. The Mobile Board BIOS setup has a microphone selection option to allow  
the user to select either an analog or digital microphone. Only one microphone type  
can be used at a time.  
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Intel Mobile Board MGM45WU Product Guide  
Intel® Active Management Technology  
(Intel® AMT)  
Intel AMT offers IT organizations tamper-resistant and persistent management  
capabilities. Intel AMT is a hardware-based solution that uses out of band  
communication to manage access to client systems in addition to offering encrypted  
and persistent asset management and remote diagnostics and/or recovery capabilities  
for networked platforms. With Intel AMT, IT organizations can easily get accurate  
platform information, and can perform remote updating, diagnostics, debugging and  
repair of a system, regardless of the state of the operating system or the power state  
of the system.  
The Intel AMT subsystem consists of:  
ARC4 microcontroller embedded in the Intel GM45 Graphics and Memory Controller  
Hub (GMCH)  
Intel ICH9M-E  
Intel 82567LM Gigabit (10/100/1000 Mb/s) Ethernet LAN controller  
Channel A SO-DIMM  
BIOS/SPI Flash  
NOTE  
Software with Intel AMT capability is required to take advantage of the Intel AMT  
platform management capabilities.  
For more information about Intel AMT and the availability of third-party software, go to  
Expandability  
For system expansion, the Mobile Board provides the following:  
External USB 2.0 ports  
ExpressCard*/34 socket  
Two PCI Express Mini Card slots  
Docking connector  
External USB 2.0 Support  
The Mobile Board supports four external USB 2.0 ports as follows:  
One port on the Mobile Board  
Two ports on Expansion Board A  
One port on Expansion Board B  
USB 2.0 ports are backward compatible with USB 1.1 devices. USB 1.1 devices will  
function normally at USB 1.1 speeds.  
28  
     
Mobile Board Features  
USB 2.0 support requires both an operating system and drivers that fully support  
USB 2.0 transfer rates. Disabling Hi-Speed USB in the BIOS reverts all USB 2.0 ports  
to USB 1.1 operation. This may be required to accommodate operating systems that  
do not support USB 2.0.  
ExpressCard* Support  
The Mobile Board includes an ExpressCard/34 (34 mm wide) slot that accepts a  
standard ExpressCard/34 module. This slot allows you to easily add features that are  
not otherwise available in your notebook. You can add features such as memory,  
digital media readers (CompactFlash*, SD*, etc.), wireless connectivity, or a TV tuner.  
PCI Express* Support  
The Mobile Board includes two PCI Express Mini Card connectors: one Full-Mini card  
connector and one Half-Mini Card connector. These connectors are used to add  
Wireless LAN and Intel Turbo Memory cards to the Mobile Board. Refer to “Installing a  
page 59 for information on installing cards in these connectors.  
Docking Station Connector  
The docking station connector (Figure 2, U) located on the bottom of the Mobile Board  
provides an external interface to a Docking Station. The connector provides the  
signals to support the following connectors on the Docking Station:  
VGA (the analog signals to the Mobile Board DVI-I connector are disabled when the  
docking station is detected)  
DVI (the digital signals to the Mobile Board DVI-I connector are disabled when the  
docking station is detected)  
One USB 2.0 port (used for USB hub in the docking station which provides four  
USB ports)  
One eSATA port  
RJ-45 (the RJ-45 connector on the notebook is disabled when the docking station is  
detected)  
Headphone jack (speakers on the notebook are muted when a device is detected  
on this jack)  
Microphone jack (the microphone jack on the notebook is disabled when a device is  
detected on this jack)  
DC Power In (used to power the notebook and charge the battery pack)  
Power On/Off Switch (used to power the notebook on and off with the lid open or  
closed)  
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Intel Mobile Board MGM45WU Product Guide  
Storage  
The Mobile Board supports two types of storage devices:  
Optical Disk Drives  
Hard Disk Drives  
The Mobile Board supports two Serial ATA channels (3.0 Gb/s) via the Intel ICH9M-E,  
connecting one device per channel. Two connectors are provided: one for an optical  
disk drive (Figure 2, P) and one for a hard disk drive (Figure 2, N). Refer to Chapter 2  
for instructions on how to install an optical disk drive or a hard disk drive.  
BIOS  
The BIOS provides the Power-On Self-Test (POST), the BIOS Setup program, the PCI  
Express auto-configuration utilities, and the video BIOS. The BIOS is stored in the  
Serial Peripheral Interface (SPI) Flash device.  
The BIOS can be updated by following the instructions in Chapter 3.  
Serial ATA Auto Configuration  
If you install a Serial ATA device (such as a hard disk drive or optical disk drive) in  
your notebook, the auto-configuration utility in the BIOS automatically detects and  
configures the device for your computer. You do not need to run the BIOS Setup  
program after installing a Serial ATA device. You can override the auto-configuration  
options by specifying manual configuration in the BIOS Setup program.  
PCI Express Auto Configuration  
If you install a PCI Express mini card in your computer, the PCI Express auto-  
configuration utility in the BIOS automatically detects and configures the resources  
(IRQs, DMA channels, and I/O space) for that card. You do not need to run the BIOS  
Setup program after you install a PCI Express mini card.  
Security Passwords  
The BIOS includes security features that restrict whether the BIOS Setup program can  
be accessed and who can boot the computer. A supervisor password and a user  
password can be set for the BIOS Setup and for booting the computer, with the  
following restrictions:  
The supervisor password gives unrestricted access to view and change all Setup  
options. If only the supervisor password is set, pressing <Enter> at the password  
prompt of Setup gives the user restricted access to Setup.  
If both the supervisor and user passwords are set, you must enter either the  
supervisor password or the user password to access Setup. Setup options are then  
available for viewing and changing depending on whether the supervisor or user  
password was entered.  
30  
         
Mobile Board Features  
Setting a user password restricts who can boot the computer. The password  
prompt is displayed before the computer is booted. If only the supervisor  
password is set, the computer boots without asking for a password. If both  
passwords are set, you can enter either password to boot the computer.  
For instructions on resetting the password, see “Clearing BIOS Security Passwords” on  
page 64.  
Hard Disk Drive Passwords  
The hard disk drive password security feature will lock a particular drive from read or  
write accesses until the hard disk drive password is entered at the startup prompt.  
Passwords are set in BIOS Setup under the “Security” heading, but do not interact  
with other system passwords.  
There are two levels of hard disk drive passwords: Master and User. Both the Master  
and User hard disk drive passwords can be used to unlock a locked drive. Valid  
passwords are between two and eight characters.  
The passwords function as follows:  
The User hard disk drive password will lock the drive and block read and write  
accesses to a hard disk upon each power cycle or reset.  
The Master hard disk drive password by itself will not lock the drive, but instead  
acts as an unlock override in the event that the User hard disk drive password is  
unavailable. Only the installation of the User hard disk drive password will cause a  
hard disk to be locked upon a system power cycle or reset.  
For convenient support of S3 resume, the system BIOS will automatically unlock drives  
on resume from S3 and will not prompt for a hard disk drive password.  
For instructions on resetting the password, see “Clearing or Changing Hard Disk Drive  
Passwords” on page 65.  
Hard Disk Drive Password Feature During BIOS POST  
During every BIOS POST execution, if a User hard disk drive password is present on  
the hard drive, POST execution will pause to prompt the user to enter the Master or  
User password:  
Enter Hard Disk Drive Password:  
Upon successful entry of the Master or User hard disk drive password, the system will  
continue with normal POST.  
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Intel Mobile Board MGM45WU Product Guide  
If the hard disk drive password is not correctly entered, the system will go back to the  
above prompt. The user will have three attempts to correctly enter the correct hard  
disk drive password. After the third unsuccessful attempt, the system will halt with  
the following message:  
Hard Disk Drive Password Entry Error  
The BIOS will then lock the drive from further activity, requiring a power-cycle to re-  
attempt hard disk drive password entry.  
Intel® Trusted Platform Module (Intel® TPM)  
The Intel TPM component is designed to enhance platform security above and beyond  
the capabilities of today’s software by providing a protected space for key operations  
and other security critical tasks. Using both hardware and software, the TPM protects  
encryption and signature keys at their most vulnerable stages—operations when the  
keys are being used unencrypted in plain-text form. The TPM is specifically designed  
to shield unencrypted keys and platform authentication information from software-  
based attacks.  
The Wave Systems Corporation EMBASSY* Trust Suite (ETS) 6 is included on the Intel  
Express Installer DVD included with the Mobile Board. ETS 6 works with the TPM  
device on the Mobile Board to deliver advanced levels of security to your notebook PC.  
NOTE  
The Intel TPM uses the onboard coin-cell battery (CR2032) to maintain its monotonic  
counters. One major function of the monotonic counters is for anti-replay protection  
of the internal Intel TPM data. If the battery is removed or exhausted, the Intel TPM  
data will be deleted in accordance with Trusted Computing Group guidelines. Please  
read the Intel TPM user guide and back-up Intel TPM keys and data before removing  
the battery.  
Fingerprint Reader Support (optional)  
Intel Mobile Board MGM45WU will support the use of a fingerprint reader for secure  
access to the notebook and data. The finger print reader is supported in Microsoft  
Windows XP and Microsoft Windows Vista when used with the Wave Systems EMBASSY  
Trust Suite application. The Mobile Board has support for using the fingerprint reader  
for pre-boot authentication during boot of the notebook. This feature can be enabled  
from the Wave Systems EMBASSY Trust Suite application.  
Smart Card Reader Support (optional)  
Intel Mobile Board MGM45WU will support a Smart Card Reader on Expansion Board B  
for secure access to the notebook and data. Support for this device is available when  
using the Wave Systems EMBASSY Trust Suite application.  
32  
     
Mobile Board Features  
Power and Power Management  
Power Supply and Battery Pack  
A CBB-compliant 65 W AC power adapter is used to supply DC power to the Mobile  
Board.  
2200 mAh/2400 mAh/2600 mAh 6-cell or 2400 mAh/2600 mAh 9-cell LI compliant  
battery packs can be used for mobile power. The battery pack plugs into a connector  
on the Mobile Board (see Figure 2, S).  
Refer to the Notebook Motherboard Specification for more information.  
Power Management  
The Mobile Board supports the latest version of the Advanced Configuration and Power  
Interface (ACPI) specification.  
ACPI gives the operating system direct control over the power management and Plug  
and Play functions of a computer. The use of ACPI with the board requires an  
operating system that provides full ACPI support such as Microsoft Windows Vista.  
ACPI features include:  
Plug and Play (including bus and device enumeration)  
Power management control of individual devices, add-in cards (some add-in cards  
may require an ACPI-aware driver), and hard disk drives  
A soft-off feature that enables the operating system to power-off the computer  
Support for multiple wake-up events (see Table 12 and Table 13)  
Support for a sleep/hibernate mode switch  
ACPI gives the operating system direct control over the power management and Plug  
and Play functions of a computer. The use of ACPI with the Mobile Board requires an  
operating system that provides full ACPI support.  
Table 12.Wake-up Devices and Events When Operating on Battery Power  
These devices/events can wake up the computer…  
…from this state  
Power button  
RTC alarm  
LAN (onboard)  
USB  
S3, S4, S5  
S3  
N/A  
N/A  
PCI Express (WLAN)  
Lid switch  
N/A  
S3  
Keyboard  
N/A  
Touch Pad  
Modem  
N/A  
N/A  
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Intel Mobile Board MGM45WU Product Guide  
Table 13.Wake-up Devices and Events When Operating on AC Adapter Power  
These devices/events can wake up the computer…  
…from this state  
S3, S4, S5  
S3, S4, S5  
S3, S4, S5  
S3  
Power button  
RTC alarm  
LAN (onboard)  
USB  
PCI Express (WLAN)  
Lid switch  
S3, S4  
S3  
Keyboard  
S3  
Touch Pad  
Modem  
N/A  
S3, S4  
CMOS Battery  
A battery (Figure 2, E) on the Mobile Board keeps the values in CMOS RAM and the  
clock current when the computer is turned off. If you should need to replace the  
information.  
34  
   
2 Installing and Replacing Mobile  
Board Components  
This chapter tells you how to:  
Install a processor  
Install the thermal module  
Attach the I/O bezel  
Install a modem  
Install Expansion Board A  
Installing the Mobile Board in the chassis  
Connect cables to the bottom of the Mobile Board  
Attach the Touch Pad and Fingerprint Reader (optional) cables  
Attach the Lid/LCD  
Install an optical disk drive  
Install a hard disk drive  
Install a keyboard and keyboard cover  
Install system memory  
Install a wireless LAN card  
Install Intel Turbo Memory  
Set the BIOS configuration jumper  
Complete assembly of the chassis  
Clear passwords  
NOTE  
The procedures in this chapter are illustrated by installing the Mobile Board in a typical  
chassis that complies with the Notebook Motherboard Specification. Your chassis may  
vary in some instances. Refer to the chassis manufacturer for more information.  
Before You Begin  
CAUTION  
The procedures in this chapter assume familiarity with the general terminology  
associated with personal computers and with the safety practices and regulatory  
compliance required for using and modifying electronic equipment.  
Follow these guidelines before you begin:  
Always follow the steps in each procedure in the correct order.  
Set up a log to record information about your computer, such as model, serial  
numbers, installed options, and configuration information.  
35  
   
Intel Mobile Board MGM45WU Product Guide  
Electrostatic discharge (ESD) can damage components. Perform the procedures  
described in this chapter only at an ESD workstation using an antistatic wrist strap  
and a conductive foam pad. If such a station is not available, you can provide  
some ESD protection by wearing an antistatic wrist strap and attaching it to a  
ground.  
When you install and test the Intel Mobile Board, observe all warnings and cautions in  
the installation instructions.  
To avoid injury, be careful of:  
Sharp pins on connectors  
Sharp pins on printed circuit assemblies  
Hot components (such as processors and heat sinks)  
Damage to wires that could cause a short circuit  
Observe all warnings and cautions that instruct you to refer servicing to qualified  
technical personnel.  
Read and adhere to the instructions in this chapter and the instructions supplied with  
the chassis and associated components. If you do not follow these instructions and  
the instructions provided by the chassis and component suppliers, you increase safety  
risk and the possibility of noncompliance with regional laws and regulations. If the  
instructions for the chassis are inconsistent with these instructions or the instructions  
for other components, contact the supplier’s technical support to find out how you can  
ensure that your notebook meets safety and regulatory requirements.  
For information about regulatory compliance, go to Appendix B on page 75.  
36  
Installing and Replacing Mobile Board Components  
Installing a Processor  
This section describes how to install a processor on the Mobile Board (see Figure 9).  
CAUTION  
Take care when handling the processor. Hold it by the edges to avoid touching the  
pins. Touching the pins may damage the processor.  
To install a processor, follow these steps:  
1. Observe the precautions in "Before You Begin" on page 35.  
2. Locate the processor socket on the bottom of the Mobile Board (Figure 2, G).  
3. Using a small flat-blade screwdriver, rotate the processor socket locking screw to  
the unlocked position (Figure 9, ).  
4. Align the processor (Figure 9, A) with the processor socket (Figure 9, B) so that  
the triangles match as shown in the figure.  
5. Insert the processor in the processor socket (Figure 9, ).  
6. Rotate the processor socket locking screw to the locked position (Figure 9, ).  
Figure 9. Installing a Processor  
37  
   
Intel Mobile Board MGM45WU Product Guide  
Installing the Thermal Module  
To install the thermal module on the processor and the GMCH and connect the thermal  
module fan, see Figure 10 and follow these steps:  
1. Observe the precautions in "Before You Begin" on page 35.  
2. Remove the thermal interface material (TIM) protective covering (Figure 10, A)  
from the bottom of the thermal module as shown in the figure.  
3. Remove the paper backing from the heatsink backing plate (Figure 10, B) to  
expose the adhesive and then insert the backing plate into the three matching  
holes on the top of the Mobile Board. The adhesive will hold the backing plate in  
place while you are attaching the thermal module.  
4. Attach the thermal module to the Mobile Board using the eight captive screws as  
shown in the figure. Tighten the screws as follows:  
a. Starting with screw  
, loosely tighten the screws in numerical order.  
b.  
Securely retighten each screw in the same order (  
to  
ꢃ ꢄ).  
5. Attach the thermal module fan connector (Figure 10, C) to the fan header  
(Figure 10, D) on the Mobile Board.  
38  
 
Installing and Replacing Mobile Board Components  
Figure 10. Installing the Thermal Module  
39  
 
Intel Mobile Board MGM45WU Product Guide  
Attaching the I/O Bezel  
To attach the I/O bezel to Mobile Board, see Figure 11 and follow these steps:  
1. Observe the precautions in "Before You Begin" on page 35.  
2. Slide the I/O bezel (Figure 11, A) onto the edge of the Mobile Board as shown in  
the figure.  
3. Install the hex standoffs (Figure 11, B) on the DVI-I connector.  
Figure 11. Attaching the I/O Bezel  
40  
   
Installing and Replacing Mobile Board Components  
Installing a Modem  
To install a Mobile Daughter Card (MDC) modem-only card on the Mobile Board, see  
Figure 12 and follow these steps:  
1. Observe the precautions in "Before You Begin" on page 35.  
2. Insert the black connector (Figure 12, B) on the modem cable into the connector  
on the modem card. These connectors are keyed and will fit only one way.  
3. Insert the white connector (Figure 12, C) on the modem cable into the connector  
on the Mobile Board. These connectors are keyed and will fit only one way.  
4. Align the connector on the bottom of the modem card with the matching MDC  
connector (Figure 12, D) on the Mobile Board and secure the modem card to the  
Mobile Board with two screws (Figure 12, E) as shown.  
Figure 12. Installing a Modem  
41  
   
Intel Mobile Board MGM45WU Product Guide  
Installing Expansion Board A  
To install Expansion Board A in the D-tray, see Figure 13 and follow these steps:  
1. Observe the precautions in "Before You Begin" on page 35.  
2. Connect the Expansion Board A cable connector (Figure 13, A) to the connector  
(Figure 13, B) on the bottom of Expansion Board A.  
3. Place Expansion Board A (Figure 13, C) into the D-tray (Figure 13, D) on the  
matching standoffs (Figure 13, E). Make sure that the I/O ports align with the  
chassis I/O port openings and the alignment pin (Figure 13, F).  
4. Route the Expansion Board A cable (Figure 13, G) through the chassis as shown in  
the figure.  
5. Secure Expansion Board A to the D-tray with four screws (Figure 13, H) as shown.  
Figure 13. Installing Expansion Board A in the D-tray  
42  
   
Installing and Replacing Mobile Board Components  
Installing the Mobile Board  
This section describes how to install the Mobile Board in the notebook chassis. The  
installation consists of the following procedures:  
1. Connecting the Mobile Board to Expansion Board A  
2. Attaching the C-plate to the D-tray  
Before you perform these procedures, observe the precautions in "Before You Begin"  
on page 35.  
Connecting the Mobile Board to Expansion Board A  
To connect the Mobile Board to Expansion Board A, see Figure 14 and follow these  
steps:  
1. Connect the Expansion Board A cable (Figure 14, B) to the Expansion Board A  
connector (Figure 14, A) on the bottom of the Mobile Board.  
2. Turn the board over and place it into the D-tray as show in the figure. Take note  
of the location of the Expansion Board A board-to-board connector (Figure 14, D)  
on the bottom of the Mobile Board.  
3. Connect the Mobile Board board-to-board connector (Figure 14, D) to the board-to-  
board connector (Figure 14, C) on the top of Expansion Board A and snap them  
together. The Mobile Board mounting holes will align with the matching standoffs  
in the D-tray.  
4. Secure the Mobile Board to Expansion Board A with the screw (Figure 14, E)  
supplied with Expansion Board A.  
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Intel Mobile Board MGM45WU Product Guide  
Figure 14. Connecting the Mobile Board to Expansion Board A  
44  
 
Installing and Replacing Mobile Board Components  
Attaching the C-plate to the D-tray  
To complete the installation of the Mobile Board, attach the C-plate to the D-tray. See  
Figure 15 and follow these steps:  
1. Turn the C-plate (Figure 15, A) over so the top side is facing up as shown in the  
figure and place it on the matching standoffs in the D-tray (Figure 15, B).  
2. Partially secure the C-plate with an M2.5X6 screw (Figure 15, C).  
3. Turn the C-plate/D-tray over and secure it with 11 M2.5X6 screws (Figure 15, D) at  
the locations indicated in the figure.  
Figure 15. Attaching the C-plate to the D-tray  
45  
   
Intel Mobile Board MGM45WU Product Guide  
Connecting Cables to the Bottom of the  
Mobile Board  
This section describes where to connect various cables to the bottom of the Mobile  
Board after it has been installed in the chassis. To connect the cables, see Figure 16  
and follow these steps:  
1. Observe the precautions in "Before You Begin" on page 35.  
2. With the chassis oriented as shown in Figure 16 (bottom side facing up), connect  
the cable from Expansion Board B to the Expansion Board B connector  
(Figure 16, B) on the Mobile Board.  
3. Connect the Bluetooth cable to the Bluetooth connector (Figure 16, A) on the  
Mobile Board.  
4. Connect the speakers cable to the speakers connector (Figure 16, C) on the Mobile  
Board.  
Figure 16. Connecting Cables to the Bottom of the Mobile Board  
46  
   
Installing and Replacing Mobile Board Components  
Attaching the Touch Pad and the Fingerprint  
Reader (optional) Cables  
This section describes how to connect the touch pad and fingerprint reader cables to  
the Mobile Board after it has been installed in the chassis. To connect the cables, see  
Figure 17 and follow these steps:  
1. Observe the precautions in "Before You Begin" on page 35.  
2. Turn the chassis over so that it is oriented (top side up) as shown in Figure 17.  
3. If the touch pad installed in the C-tray includes an optional fingerprint reader,  
there will be two cables to connect. The touch pad cable attaches to the touch pad  
connector (Figure 1, H) and the fingerprint reader cable attaches to ID Expansion  
Connector B (Figure 1, G). The installation process is the same for both cables.  
4. To connect either of the cables:  
a. Open the connector locking mechanism (Figure 17, A) by sliding it out as shown  
in the figure.  
b. Insert the cable into the connector (Figure 17, B).  
c. Push the locking mechanism (Figure 17, A) back in to lock the cable in place.  
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Figure 17. Attaching the Touch Pad and Fingerprint Reader Cables  
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Installing and Replacing Mobile Board Components  
Attaching the Lid/LCD  
This section describes how to attach the lid/LCD to the chassis and connect the  
associated cables. See Figure 18 and follow these steps:  
1. Observe the precautions in "Before You Begin" on page 35.  
2. Place the Lid/LCD hinges over the matching holes in the chassis. Note that each  
hinge has an alignment pin. Attach the hinges (Figure 18, A) with two screws as  
shown in the figure.  
3. Connect the LCD video cable connector (Figure 18, C) to the LVDS connector  
(Figure 18, D) on the Mobile Board.  
4. Route the three antenna cables (Figure 18, E) under the C-plate to the Mobile  
Board. These cables will be connected in a later section.  
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Figure 18. Attaching the Lid/LCD to the Hinges and Connecting  
the LVDS Cable  
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Installing and Replacing Mobile Board Components  
5. Close the lid and turn the chassis over.  
6. Secure the hinge alignment pins with two screws through the bottom of the chassis  
as shown in Figure 19.  
Figure 19. Securing the Lid/LCD Hinge Alignment Pins  
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Intel Mobile Board MGM45WU Product Guide  
Installing an Optical Disk Drive  
To install an optical disk drive in the chassis, see Figure 20 and follow these steps:  
1. Observe the precautions in "Before You Begin" on page 35.  
2. Attach the disk drive mounting bracket (Figure 20, A) to the rear of the optical disk  
drive with two screws (Figure 20, B) as shown.  
3. Snap the bezel (Figure 20, C) onto the front of the optical disk drive.  
NOTE  
If there is a bezel already attached to the front of the optical disk drive,  
remove it. You must replace it with the bezel that was included with your  
chassis for a proper fit.  
4. Insert the optical disk drive into the chassis opening as shown in the figure so that  
it engages the Mobile Board connector. Secure the optical disk drive to the chassis  
with a screw (Figure 20, D) as shown in the figure.  
Figure 20. Installing an Optical Disk Drive  
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Installing and Replacing Mobile Board Components  
Installing a Hard Disk Drive  
To install a hard disk drive in the chassis, see Figure 21 and follow these steps:  
1. Observe the precautions in "Before You Begin" on page 35.  
2. Attach the disk drive mounting bracket (Figure 21, A) to the hard disk drive  
(Figure 21, B) with four screws (Figure 21, C) as shown.  
3. Insert the hard disk drive/bracket assembly into the disk drive bay (Figure 21, E)  
and engage the Mobile Board connector. You can use the pull tab (Figure 21, D) to  
facilitate installation.  
Figure 21. Installing a Hard Disk Drive  
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Intel Mobile Board MGM45WU Product Guide  
Installing a Keyboard and Keyboard Cover  
This section describes how to install a keyboard and a keyboard cover in the chassis.  
Be sure to observe the precautions in "Before You Begin" on page 35.  
Installing a Keyboard  
The keyboard cable (Figure 22, A) is located on the bottom of the keyboard. To install  
a keyboard and connect it to the Mobile Board, see Figure 22 and follow these steps:  
1. Locate the keyboard connector (Figure 22, B) on the Mobile Board and unlock the  
connector locking mechanism (Figure 22, C) by rotating it upward.  
2. Insert the keyboard cable into the connector and rotate the connector locking  
mechanism downward as shown in the figure to lock the cable in place.  
3. Install the keyboard by inserting the edge tabs (Figure 22, D) into the matching  
slots in the C-tray and slide the keyboard into place.  
Figure 22. Installing a Keyboard  
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Installing and Replacing Mobile Board Components  
Installing the Keyboard Cover  
To install the keyboard cover (Figure 23, A), see Figure 23 and follow these steps:  
1. Observe the precautions in "Before You Begin" on page 35.  
2. Insert the two tabs (Figure 23, B) on the front edge of the keyboard cover into the  
corresponding slots (Figure 23, C) in the C-tray (make sure that the keyboard is  
attached under the keyboard cover) and rotate the cover downward until it snaps  
into place.  
3. Close the lid and turn the chassis over. Secure the keyboard cover with two  
screws (Figure 23, D) through the battery bracket as shown in the figure.  
Figure 23. Installing a Keyboard Cover  
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Intel Mobile Board MGM45WU Product Guide  
Installing System Memory  
The Mobile Board includes two SO-DIMM sockets that support up to 4 GB of system  
memory. To install system memory on bottom of the Mobile Board, see Figure 25 and  
follow these steps:  
1. Observe the precautions in "Before You Begin" on page 35.  
2. Locate the memory sockets (Figure 2, V and U).  
3. Install the first (or only) DIMM in the bottom (DIMM 1) socket (Figure 25, B). Hold  
the DIMM (Figure 25, A) with the back edge tilted slightly upwards, insert the  
DIMM in the socket and gently push the back edge of the DIMM down until it snaps  
into the retention arms (Figure 25, C).  
4. If you are installing a second DIMM, repeat Step 3 using the top (DIMM 2) socket  
Figure 24. Installing DIMMs  
56  
   
Installing and Replacing Mobile Board Components  
Installing a Wireless LAN Card  
A wireless LAN card can be installed in either the Mobile Board’s PCI Express Full-Mini  
connector (Figure 2, J) or its PCI Express Half-Mini card connector (Figure 2, P).  
To install a wireless LAN card on the Mobile Board, see Figure 25 and Figure 26 and  
follow these steps:  
1. Observe the precautions in "Before You Begin" on page 35.  
2. Insert the wireless LAN card (Figure 25, A and Figure 26, A) into the PCI Express  
Mini Card connector (Figure 25, B and Figure 26, B) at a slightly upward angle.  
3. Align the mounting holes (Figure 25, C and Figure 26, C) and snap the card in  
place.  
Figure 25. Installing a PCI Express Full-Mini Wireless LAN Card  
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Figure 26. Installing a PCI Express Half-Mini Wireless LAN Card  
4. Attach the antenna wires (Figure 27, A) to the connectors (Figure 27, B) on the  
Wireless LAN card as shown.  
Figure 27. Connecting the Antenna Wires  
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Installing and Replacing Mobile Board Components  
Installing an Intel® Turbo Memory Card  
An Intel Turbo Memory card can be installed in either the Mobile Board’s PCI Express  
Full-Mini connector (Figure 2, J) or its PCI Express Half-Mini card connector  
To install an Intel Turbo Memory card on the Mobile Board, see Figure 28 and  
Figure 29 and follow these steps:  
1. Observe the precautions in "Before You Begin" on page 35.  
2. Insert the Intel Turbo Memory card (Figure 28, A and Figure 29, A) into the PCI  
Express Mini Card connector (Figure 28, B and Figure 29, B) at a slightly upward  
angle.  
3. Align the mounting holes (Figure 28, C and Figure 29, C) and snap the card in  
place.  
Figure 28. Installing a PCI Express Full-Mini Intel Turbo Memory Card  
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Intel Mobile Board MGM45WU Product Guide  
Figure 29. Installing a PCI Express Half-Mini Intel Turbo Memory Card  
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Installing and Replacing Mobile Board Components  
Setting the BIOS Configuration Jumper  
Ensure that the BIOS configuration jumper is set to Normal (pins 1 and 2) as shown in  
Figure 30 before finishing assembly of the chassis. If the jumper is not in the correct  
position, move it to the correct position. Refer to Table 14 for a description of the  
jumper settings.  
Figure 30. BIOS Configuration Jumper  
Table 14.Jumper Settings for the BIOS Setup Program Modes  
Jumper Setting  
Mode  
Description  
Normal (default) (1-2)  
The BIOS uses the current configuration and  
passwords for booting.  
Configure (2-3)  
Recovery (None)  
After the Power-On Self-Test (POST) runs, the  
BIOS displays the Maintenance Menu. Use this  
menu to clear passwords.  
The BIOS recovers data in the event of a failed  
BIOS update.  
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Completing Assembly of the Chassis  
This section describes how to complete chassis assembly by installing the hard disk  
drive bay cover and the D-tray door. Observe the precautions in "Before You Begin"  
on page 35 while performing these procedures.  
Installing the Hard Disk Drive Bay Cover  
To install the hard disk drive bay cover, see Figure 31 and follow these steps:  
1. Align the two tabs (Figure 31, B) on the hard disk drive bay cover (Figure 31, A)  
with the matching slots in the D-tray and lower the cover into place over the hard  
disk drive bay (Figure 31, C).  
2. Secure the cover to the D-tray with two screws (Figure 31, D) as shown in the  
figure.  
Figure 31. Installing the Hard Disk Drive Cover  
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Installing and Replacing Mobile Board Components  
Installing the D-tray Door  
To install the D-tray door, see Figure 32 and follow these steps:  
1. Align the D-tray door (Figure 32, A) with the opening in the D-tray and lower the  
door into place.  
2. Secure the door to the D-tray with nine screws (Figure 32, B) as shown in the  
figure.  
Figure 32. Installing the D-tray Door  
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Clearing or Changing Passwords  
This section describes how to clear or change the following passwords:  
BIOS security passwords (user and supervisor)  
Hard disk drive passwords (User and Master)  
Clearing BIOS Security Passwords  
This procedure assumes that the board is installed in the chassis and the BIOS  
configuration jumper is set to Normal mode.  
1. Observe the precautions in "Before You Begin" on page 35.  
2. Turn off all peripheral devices connected to the computer. Turn off the computer,  
disconnect the computer’s AC power adapter (if connected), and remove the  
battery pack.  
3. Turn the computer over and remove the D-tray door by removing the nine screws  
holding it in place (see Figure 32).  
4. Locate the BIOS configuration jumper (see Figure 30).  
5. Place the jumper on pins 2-3 as shown below.  
6. Reassemble the computer, insert the battery pack in the computer, turn on the  
computer, and allow it to boot.  
7. The computer starts the Setup program. Setup displays the Maintenance menu.  
8. Use the arrow keys to select Clear Passwords. Press <Enter> and Setup displays a  
pop-up screen requesting that you confirm clearing the password. Select Yes and  
press <Enter>. Setup displays the maintenance menu again.  
9. Press <F10> to save the current values and exit Setup.  
10.Turn off the computer and remove the battery pack.  
11.Remove the D-tray door.  
12.To restore normal operation, place the jumper on pins 1-2 as shown below.  
13.Replace the D-tray door (see Figure 32), insert the battery pack or connect the AC  
adapter, and turn on the computer.  
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Installing and Replacing Mobile Board Components  
Clearing or Changing Hard Disk Drive Passwords  
This section describes how to clear or change User and Master hard disk drive  
passwords. The procedures for clearing the passwords are as follows:  
User Hard Disk Drive Passwords:  
If a valid User hard disk drive password has been entered and the user wishes to  
change or delete the password, the user must first enter the existing User hard  
disk drive password in BIOS Setup for security confirmation.  
To delete an existing User hard disk drive password, the user can enter a blank  
password for the new password.  
Master Hard Disk Drive Passwords:  
If a valid Master hard disk drive password has been entered and the user wishes to  
change or delete the password, the user must first enter the existing Master hard  
disk drive password in BIOS Setup for security confirmation.  
To delete an existing Master hard disk drive password, the user can enter a blank  
password for the new password.  
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66  
3 Updating the BIOS  
The BIOS Setup program can be used to view and change the BIOS settings for the  
computer. You can access the BIOS Setup program by pressing the <F2> or <Del>  
key after the Power-On Self-Test (POST) memory test begins and before the operating  
system boot begins.  
This chapter tells you how to update the BIOS by either using the Intel Express BIOS  
Update utility or the Iflash Memory Update utility, and how to recover the BIOS if an  
update fails.  
Updating the BIOS with the Intel® Express  
BIOS Update Utility  
With the Intel Express BIOS Update utility you can update the system BIOS while in  
the Windows environment. The BIOS file is included in an automated update utility  
that combines the functionality of the Intel® Flash Memory Update Utility and the ease  
of use of Windows-based installation wizards.  
To update the BIOS with the Intel Express BIOS Update utility:  
1. Go to the Intel World Wide Web site:  
2. Navigate to the MGM45WU page. Under the “Software and drivers” heading, click  
on “Latest BIOS” to locate the latest BIOS files. Click on the “BIOS Update” link  
and select the Express BIOS Update file.  
3. Download the file to your hard drive. (You can also save this file to a removable  
USB device. This is useful if you are updating the BIOS for multiple identical  
systems.)  
4. Close all other applications. This step is required. Your system will be rebooted at  
the last Express BIOS Update window.  
5. Double-click the executable file from the location on your hard drive where it was  
saved. This runs the update program.  
6. Follow the instructions provided in the dialog boxes to complete the BIOS update.  
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Updating the BIOS with the ISO Image BIOS  
Update File or the Iflash Memory Update  
Utility  
You can use the information in this section to update the BIOS using either the Iflash  
Memory Update Utility or the ISO Image BIOS update file.  
Obtaining the BIOS Update File  
You can update to a new version of the BIOS by using the ISO Image BIOS update file  
(recommended), or Iflash BIOS update file.  
The ISO Image BIOS update file is a standardized image of a bootable CD-ROM that  
can be used to create a bootable CD that will update the BIOS.  
The Iflash BIOS update file is a compressed file that contains the files you need to  
update the BIOS. The Iflash BIOS update file contains:  
New BIOS file (including the Intel® Management Engine Firmware Image)  
Intel® Integrator Toolkit Configuration File (optional)  
Intel Flash Memory Update Utility  
You can obtain either of these files through your computer supplier or by navigating to  
the Intel Mobile Board MGM45WU page on the Intel World Wide Web site.  
Navigate to the Intel Mobile Board MGM45WU page. Under the “Software and drivers”  
heading, click on “Latest BIOS” to locate the latest BIOS files. Click on the “BIOS  
Update” link and select the ISO Image BIOS Update file or the Iflash BIOS Update file.  
Updating the BIOS with the ISO Image BIOS Update  
File  
The ISO Image BIOS update allows for the update of an Intel® Mobile Board BIOS to  
the latest production release regardless of the operating system installed on the  
computer's hard drive and without the need to remove the BIOS configuration jumper.  
It requires a blank CD-R, a read/writeable CD drive, and software capable of  
uncompressing and writing the ISO image file to CD.  
The image uses ISOLINUX* bootloader and automatically launches a script to upgrade  
the BIOS via the Iflash utility.  
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Updating the BIOS  
CAUTION  
Do not interrupt the process or the system may not function properly.  
Follow these instructions to upgrade the BIOS using the ISO Image BIOS file:  
1. Download the ISO Image BIOS file.  
2. Using software capable of uncompressing and writing an ISO image file to CD, burn  
the data to a blank CD.  
NOTE  
Copying the ISO Image BIOS file to CD will not work. The completed CD should  
contain multiple files and a directory.  
3. Insert the CD that was created in the CD-ROM drive of the computer to be  
upgraded and boot the system.  
4. When the "Press ENTER to continue booting from CD-ROM" prompt appears, press  
the Enter key. The system will boot from the hard drive if no key is pressed within  
15 seconds.  
5. At the "Welcome to the Intel Mobile Board BIOS Upgrade CD-ROM" page, press any  
key to confirm the BIOS upgrade operation.  
6. Wait for the BIOS upgrade process to complete.  
CAUTION  
DO NOT POWER DOWN YOUR COMPUTER before the update is complete. The update  
may take up to 5 minutes.  
Updating the BIOS with the Iflash Memory Update  
Utility  
With the Iflash Memory update utility you can update the system BIOS from a  
bootable CD-ROM, bootable USB flash drive, or other bootable USB media. The utility  
available on the Intel World Wide Web site provides a simple method for creating a  
bootable CD-ROM that will automatically update your BIOS. The Iflash BIOS update  
files can also be extracted locally to your hard drive and copied to a bootable USB  
flash drive or other bootable USB media.  
The Iflash Memory update utility allows you to:  
Update the BIOS and Intel Management Engine in flash memory  
Update the language section of the BIOS  
NOTE  
Review the instructions distributed with the update utility before attempting a BIOS  
update.  
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CAUTION  
Do not interrupt the process or the system may not function properly.  
1. Uncompress the BIOS update file and copy the .BIO file, IFLASH.EXE, and .ITK file  
(optional) to a bootable USB flash drive or other bootable USB media.  
2. Configure the BIOS or use the F10 option during POST to boot to the USB device.  
3. Manually run the IFLASH.EXE file from the USB device and manually update the  
BIOS.  
Recovering the BIOS  
It is unlikely that anything will interrupt the BIOS update; however, if an interruption  
occurs, the BIOS could be damaged. Due to BIOS size and recovery requirements, a  
CD-R with the .BIO file in the root directory will be required.  
NOTE  
For more information about updating the Intel Mobile Board BIOS or recovering from a  
BIOS update failure, go to  
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A Intel® Mobile Utility  
This appendix describes the functions of the Intel® Mobile Utility software included on  
the Intel® Express Installer DVD.  
With the Intel Mobile Utility software installed, pressing the function key combinations  
shown below will allow you to activate or control the following notebook functions:  
Sleep/Hibernate  
Wireless radio  
Video output  
Display brightness  
Audio volume  
Function Key  
Display  
Sleep/Hibernate  
A screen pops up allowing you to select either  
Sleep mode or Hibernate mode. Click the  
button and  
the notebook will enter Sleep mode or Hibernate mode.  
To exit the screen, click the Close button or the  
button.  
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Function Key  
Display  
Wireless Radios On/Off  
A screen pops up allowing you to turn or off the wireless  
LAN and Bluetooth feature. Click the  
the feature on or off. To exit the screen, click the Close  
button or the button.  
button to turn  
Video Output Selection  
A screen pops up that presents a menu of all the  
external display options available to you. Connect the  
external display and select the appropriate menu item.  
To exit the screen, click the Close button or the  
button.  
Menu when the notebook is not attached to a  
docking station  
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Intel Mobile Utility  
Function Key  
Display  
Video Output Selection  
Menu when the notebook is attached to a docking  
station  
Adjust Display Brightness  
A bar briefly appears on the screen when you use these  
hot keys to the adjust the display brightness level.  
Mute Audio  
This icon briefly appears on the screen to indicate that  
the sound is muted when you press this hot key.  
Adjust Volume  
A bar briefly appears on the screen when you use these  
hot keys to adjust the audio volume of your notebook.  
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74  
B Regulatory Compliance  
This appendix contains the following regulatory compliance information for Intel Mobile  
Board MGM45WU:  
Safety standards  
European Union Declaration of Conformity statement  
Product Ecology statements  
Electromagnetic Compatibility (EMC) regulations  
Product certifications  
Safety Standards  
Intel Mobile Board MGM45WU complies with the safety standards stated in Table 15  
when correctly installed in a compatible chassis.  
Table 15.Safety Standards  
Regulation  
Title  
CSA/UL 60950-1, First  
Edition  
Information Technology Equipment – Safety - Part 1: General  
Requirements (USA and Canada)  
EN 60950-1:2006, Second  
Edition  
Information Technology Equipment – Safety - Part 1: General  
Requirements (European Union)  
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Battery Disposal Information  
A Lithium coin-cell battery (CR2032) powers the real-time clock and CMOS memory on  
the Mobile Board. When the computer is not plugged into a wall socket, the battery  
has an estimated life of three years.  
If the battery requires replacement, observe the caution below.  
CAUTION  
Risk of explosion if the battery is replaced with an incorrect type. Batteries should be  
recycled where possible. Disposal of used batteries must be in accordance with local  
environmental regulations.  
PRÉCAUTION  
Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les  
piles usagées doivent être recyclées dans la mesure du possible. La mise au rebut des  
piles usagées doit respecter les réglementations locales en vigueur en matière de  
protection de l'environnement.  
FORHOLDSREGEL  
Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier  
bør om muligt genbruges. Bortskaffelse af brugte batterier bør foregå i  
overensstemmelse med gældende miljølovgivning.  
OBS!  
Det kan oppstå eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier  
bør kastes i henhold til gjeldende miljølovgivning.  
VIKTIGT!  
Risk för explosion om batteriet ersätts med felaktig batterityp. Batterier ska kasseras  
enligt de lokala miljövårdsbestämmelserna.  
VARO  
Räjähdysvaara, jos pariston tyyppi on väärä. Paristot on kierrätettävä, jos se on  
mahdollista. Käytetyt paristot on hävitettävä paikallisten ympäristömääräysten  
mukaisesti.  
VORSICHT  
Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie  
darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen  
Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen  
des Herstellers entsprechend.  
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Regulatory Compliance  
AVVERTIMENTO  
Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto.  
Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per  
disfarsi delle pile usate, seguire le istruzioni del produttore.  
PRECAUCIÓN  
Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice  
solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del  
equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del  
fabricante.  
WAARSCHUWING  
Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type  
batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het  
weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving.  
ATENÇÃO  
Haverá risco de explosão se a bateria for substituída por um tipo de bateria incorreto.  
As baterias devem ser recicladas nos locais apropriados. A eliminação de baterias  
usadas deve ser feita de acordo com as regulamentações ambientais da região.  
AŚCIAROŽZNAŚĆ  
Існуе рызыка выбуху, калі заменены акумулятар неправільнага тыпу.  
Акумулятары павінны, па магчымасці, перепрацоўвацца. Пазбаўляцца ад старых  
акумулятараў патрэбна згодна з мясцовым заканадаўствам па экалогіі.  
UPOZORNÌNÍ  
V případě výměny baterie za nesprávný druh může dojít k výbuchu. Je-li to možné,  
baterie by měly být recyklovány. Baterie je třeba zlikvidovat v souladu s místními  
předpisy o životním prostředí.  
Προσοχή  
Υπάρχει κίνδυνος για έκρηξη σε περίπτωση που η μπαταρία αντικατασταθεί από μία  
λανθασμένου τύπου. Οι μπαταρίες θα πρέπει να ανακυκλώνονται όταν κάτι τέτοιο είναι  
δυνατό. Η απόρριψη των χρησιμοποιημένων μπαταριών πρέπει να γίνεται σύμφωνα με  
τους κατά τόπο περιβαλλοντικούς κανονισμούς.  
VIGYÁZAT  
Ha a telepet nem a megfelelő típusú telepre cseréli, az felrobbanhat. A telepeket  
lehetőség szerint újra kell hasznosítani. A használt telepeket a helyi környezetvédelmi  
előírásoknak megfelelően kell kiselejtezni.  
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Intel Mobile Board MGM45WU Product Guide  
AWAS  
Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri  
sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi  
peraturan alam sekitar tempatan.  
OSTRZEŻENIE  
Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu  
baterii. Zużyte baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi  
przepisami ochrony środowiska.  
PRECAUŢIE  
Risc de explozie, dacă bateria este înlocuită cu un tip de baterie necorespunzător.  
Bateriile trebuie reciclate, dacă este posibil. Depozitarea bateriilor uzate trebuie să  
respecte reglementările locale privind protecţia mediului.  
ВНИМАНИЕ  
При использовании батареи несоответствующего типа существует риск ее взрыва.  
Батареи должны быть утилизированы по возможности. Утилизация батарей должна  
проводится по правилам, соответствующим местным требованиям.  
UPOZORNENIE  
Ak batériu vymeníte za nesprávny typ, hrozí nebezpečenstvo jej výbuchu. Batérie by  
sa mali podľa možnosti vždy recyklovať. Likvidácia použitých batérií sa musí vykonávať  
v súlade s miestnymi predpismi na ochranu životného prostredia.  
POZOR  
Zamenjava baterije z baterijo drugačnega tipa lahko povzroči eksplozijo.  
Če je mogoče, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi  
okoljevarstvenimi predpisi.  
.
78  
Regulatory Compliance  
UYARI  
Yanlış türde pil takıldığında patlama riski vardır. Piller mümkün olduğunda geri  
dönüştürülmelidir. Kullanılmış piller, yerel çevre yasalarına uygun olarak atılmalıdır.  
OСТОРОГА  
Використовуйте батареї правильного типу, інакше існуватиме ризик вибуху.  
Якщо можливо, використані батареї слід утилізувати. Утилізація використаних  
батарей має бути виконана згідно місцевих норм, що регулюють охорону довкілля.  
79  
Intel Mobile Board MGM45WU Product Guide  
European Union Declaration of Conformity  
Statement  
We, Intel Corporation, declare under our sole responsibility that the product Intel®  
Mobile Board MGM45WU is in conformity with all applicable essential requirements  
necessary for CE marking, following the provisions of the European Council Directives  
2004/108/EC (EMC Directive) and 2006/95/EC (Low Voltage Directive).  
The product is properly CE marked demonstrating this conformity and is for  
distribution within all member states of the EU with no restrictions.  
This product follows the provisions of the European Directives 2004/108/EC and  
2006/95/EC.  
Čeština Tento výrobek odpovídá požadavkům evropských směrnic 2004/108/EC a  
2006/95/EC.  
Dansk Dette produkt er i overensstemmelse med det europæiske direktiv  
2004/108/EC & 2006/95/EC.  
Dutch Dit product is in navolging van de bepalingen van Europees Directief  
2004/108/EC & 2006/95/EC.  
Eesti Antud toode vastab Euroopa direktiivides 2004/108/EC ja 2006/95/EC  
kehtestatud nõuetele.  
Suomi Tämä tuote noudattaa EU-direktiivin 2004/108/EC & 2006/95/EC määräyksiä.  
Français Ce produit est conforme aux exigences de la Directive Européenne  
2004/108/EC & 2006/95/EC.  
Deutsch Dieses Produkt entspricht den Bestimmungen der Europäischen Richtlinie  
2004/108/EC & 2006/95/EC.  
Ελληνικά Το παρόν προϊόν ακολουθεί τις διατάξεις των Ευρωπαϊκών Οδηγιών  
2004/108/EC και 2006/95/EC.  
Magyar E termék megfelel a 2004/108/EC és 2006/95/EC Európai Irányelv  
előírásainak.  
Icelandic Þessi vara stenst reglugerð Evrópska Efnahags Bandalagsins númer  
2004/108/EC & 2006/95/EC.  
Italiano Questo prodotto è conforme alla Direttiva Europea 2004/108/EC &  
2006/95/EC.  
Latviešu Šis produkts atbilst Eiropas Direktīvu 2004/108/EC un 2006/95/EC  
noteikumiem.  
80  
 
Regulatory Compliance  
Lietuvių Šis produktas atitinka Europos direktyvų 2004/108/EC ir 2006/95/EC  
nuostatas.  
Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej  
2004/108/EC u 2006/95/EC.  
Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet  
2004/108/EC & 2006/95/EC.  
Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej  
2004/108/EC i 2006/95/EC.  
Portuguese Este produto cumpre com as normas da Diretiva Européia 2004/108/EC  
& 2006/95/EC.  
Español Este producto cumple con las normas del Directivo Europeo 2004/108/EC &  
2006/95/EC.  
Slovensky Tento produkt je v súlade s ustanoveniami európskych direktív  
2004/108/EC a 2006/95/EC.  
Slovenščina Izdelek je skladen z določbami evropskih direktiv 2004/108/EC in  
2006/95/EC.  
Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 2004/108/EC &  
2006/95/EC.  
Türkçe Bu ürün, Avrupa Birliği’nin 2004/108/EC ve 2006/95/EC yönergelerine uyar.  
Product Ecology Statements  
The following information is provided to address worldwide product ecology concerns  
and regulations.  
Recycling Considerations  
As part of its commitment to environmental responsibility, Intel has implemented the  
Intel® Product Recycling Program to allow retail consumers of Intel’s branded products  
to return used products to selected locations for proper recycling.  
for the details of this program, including the scope of covered products, available  
locations, shipping instructions, terms and conditions, etc.  
中文  
作为其对环境责任之承诺的部分,英特尔已实施 Intel Product Recycling Program  
(英特尔产品回收计划),以允许英特尔品牌产品的零售消费者将使用过的产品退还至指定地点作恰  
当的重复使用处理。  
了解此计划的详情,包括涉及产品之范围、回收地点、运送指导、条款和条件等。  
81  
   
Intel Mobile Board MGM45WU Product Guide  
Deutsch  
Als Teil von Intels Engagement für den Umweltschutz hat das Unternehmen das Intel  
Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel  
Markenprodukten ermöglicht, gebrauchte Produkte an ausgewählte Standorte für  
ordnungsgemäßes Recycling zurückzugeben.  
Details zu diesem Programm, einschließlich der darin eingeschlossenen Produkte,  
verfügbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der  
Español  
Como parte de su compromiso de responsabilidad medioambiental, Intel ha  
implantado el programa de reciclaje de productos Intel, que permite que los  
consumidores al detalle de los productos Intel devuelvan los productos usados en los  
lugares seleccionados para su correspondiente reciclado.  
para ver los detalles del programa, que incluye los productos que abarca, los lugares  
disponibles, instrucciones de envío, términos y condiciones, etc.  
Français  
Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis  
en œuvre le programme Intel Product Recycling Program (Programme de recyclage  
des produits Intel) pour permettre aux consommateurs de produits Intel de recycler  
les produits usés en les retournant à des adresses spécifiées.  
savoir plus sur ce programme, à savoir les produits concernés, les adresses  
disponibles, les instructions d'expédition, les conditions générales, etc.  
日本語  
インテルでは、環境保護活動の一環として、使い終えたインテル  
ブランド製品を指定の場所へ返送していただき、リサイクルを適切に行えるよう、インテル製品リサイクル  
プログラムを発足させました。  
対象製品、返送先、返送方法、ご利用規約など、このプログラムの詳細情報は、http://www.intel.com/in  
tel/other/ehs/product_ecology (英語)をご覧ください。  
Malay  
Sebagai sebahagian daripada komitmennya terhadap tanggungjawab persekitaran,  
Intel telah melaksanakan Program Kitar Semula Produk untuk membenarkan  
pengguna-pengguna runcit produk jenama Intel memulangkan produk terguna ke  
lokasi-lokasi terpilih untuk dikitarkan semula dengan betul.  
butir-butir program ini, termasuklah skop produk yang dirangkumi, lokasi-lokasi  
tersedia, arahan penghantaran, terma & syarat, dsb.  
82  
Regulatory Compliance  
Portuguese  
Como parte deste compromisso com o respeito ao ambiente, a Intel implementou o  
Programa de Reciclagem de Produtos para que os consumidores finais possam enviar  
produtos Intel usados para locais selecionados, onde esses produtos são reciclados de  
maneira adequada.  
Consulte o site http://www.intel.com/intel/other/ehs/product_ecology (em Inglês) para  
obter os detalhes sobre este programa, inclusive o escopo dos produtos cobertos, os  
locais disponíveis, as instruções de envio, os termos e condições, etc.  
Russian  
В качестве части своих обязательств к окружающей среде, в Intel создана  
программа утилизации продукции Intel (Product Recycling Program) для  
предоставления конечным пользователям марок продукции Intel возможности  
возврата используемой продукции в специализированные пункты для должной  
утилизации.  
Пожалуйста, обратитесь на веб-сайт  
http://www.intel.com/intel/other/ehs/product_ecology за информацией об этой  
программе, принимаемых продуктах, местах приема, инструкциях об отправке,  
положениях и условиях и т.д.  
Türkçe  
Intel, çevre sorumluluğuna bağımlılığının bir parçası olarak, perakende tüketicilerin  
Intel markalı kullanılmış ürünlerini belirlenmiş merkezlere iade edip uygun şekilde geri  
dönüştürmesini amaçlayan Intel Ürünleri Geri Dönüşüm Programı’nı uygulamaya  
koymuştur.  
Bu programın ürün kapsamı, ürün iade merkezleri, nakliye talimatları, kayıtlar ve  
şartlar v.s dahil bütün ayrıntılarını ögrenmek için lütfen  
83  
Intel Mobile Board MGM45WU Product Guide  
Lead-free 2LI/Pb-free 2LI Board  
The electronics industry is transitioning to European Union (EU) Restriction of  
Hazardous Substances (RoHS)-compliant products. The RoHS legislation restricts the  
use of six materials. One of these restricted materials is lead. Lead is the most  
common and problematic of the RoHS restricted materials.  
There are exemptions in RoHS that allow the use of lead in some very limited locations  
in electronic products. Maximum lead concentration values have been established for  
RoHS-compliant electronic products that allow up to 1000 ppm of lead.  
Lead-free/Pb-free is a nickname that is often used (or misused) for RoHS-compliant  
products. In this case, the term "Lead-free/Pb-free" means that lead has been  
removed where required by the RoHS legislation but still may exist as an impurity  
below 1000 ppm.  
The term "Lead-free 2LI/Pb-free 2LI" means lead-free second level interconnect (2LI).  
The balls, leads, or pads used to connect the component to a printed circuit board are  
lead-free, but the first level interconnect (FLI) is not lead-free. The use of lead in the  
FLI is acceptable because of the RoHS "flip chip" or "die bump" interconnect  
exemption.  
Intel Mobile Board MGM45WU is a lead-free second level interconnect product.  
Table 16 shows the lead-free second level interconnect marks as they appear on the  
board and accompanying collateral. These marks are based on JEDEC standard  
J-STD-609, “Marking and Labeling of Components, PCBs and PCBAs to Identify Lead,  
Lead Free and Other Attributes.”  
For more information concerning Intel’s lead-free initiatives, refer to  
84  
 
Regulatory Compliance  
Table 16.Lead-Free Second Level Interconnect Marks  
Description  
Mark  
This symbol is used to identify  
electrical and electronic  
assemblies and components in  
which the Pb concentration  
level in the board substrate  
and the solder connections  
from the board to the  
components (second-level  
interconnect) is not greater  
than 0.1% by weight  
or  
or  
(1000 ppm).  
Restriction of Hazardous Substances (RoHS)  
EU RoHS  
EU RoHS Directive 2002/95/EC restricts the use of the following six materials in  
various types of electronic and electrical equipment:  
Lead  
Mercury  
Cadmium  
Hexavalent chromium  
Polybrominated biphenyls (PBB)  
Polybrominated diphenyl ether (PBDE)  
The maximum concentrations allowed are 0.1% or 1000 ppm (except for cadmium,  
which is limited to 0.01% or 100 ppm) by weight of homogeneous material.  
Intel Mobile Board MGM45WU complies with these restrictions.  
85  
     
Intel Mobile Board MGM45WU Product Guide  
China RoHS  
“China RoHS” is the term used by industry generally to describe legislation  
implemented by the Ministry of Information Industry (MII) in the People's Republic of  
China for the control of pollution by electronic information products (EIP). The official  
title of the China RoHS regulation is “Management Methods for Controlling Pollution by  
Electronic Information Products.”  
China RoHS bans the same substances and has the same limits as EU RoHS.  
However, the China RoHS regulation requires specific product marking and a self-  
declaration of the controlled substances contained in each product.  
Intel Mobile Board MGM45WU is a China RoHS-compliant product.  
The required China RoHS mark indicates the product’s Environmental Friendly Usage  
Period (EFUP). The EFUP is defined as the number of years for which listed controlled  
substances will not leak or chemically deteriorate while in the product. The EFUP for  
Intel Mobile Boards has been determined to be 10 years.  
The EFUP for Intel Mobile Board MGM45WU is shown in Table 17.  
Table 17.China RoHS Environmentally Friendly Use Period Mark  
Description  
Mark  
This is an example of the  
symbol used on Intel Mobile  
Boards and associated  
collateral. The color of the  
mark may vary depending  
upon the application. The  
Environmental Friendly Usage  
Period (EFUP) for Intel Mobile  
Boards has been determined  
to be 10 years.  
86  
   
Regulatory Compliance  
The China MII stipulates that a material Self Declaration Table (SDT) must be included  
in a product’s user documentation. The SDT for Intel Mobile Board MGM45WU is  
shown in Figure 33.  
Figure 33. Intel Mobile Board MGM45WU China RoHS Material  
Self Declaration Table  
87  
 
Intel Mobile Board MGM45WU Product Guide  
EMC Regulations  
Intel Mobile Board MGM45WU complies with the EMC regulations stated in Table 18  
when correctly installed in a compatible host system.  
Table 18.EMC Regulations  
Regulation (Class B)  
Title  
FCC 47 CFR Part 15,  
Subpart B  
Title 47 of the Code of Federal Regulations, Part 15, Subpart B,  
Radio Frequency Devices. (USA)  
ICES-003 Issue 4  
Interference-Causing Equipment Standard, Digital Apparatus.  
(Canada)  
EN55022:2006  
Limits and methods of measurement of Radio Interference  
Characteristics of Information Technology Equipment. (European  
Union)  
EN55024:1998  
EN55022:2006  
Information Technology Equipment – Immunity Characteristics  
Limits and methods of measurement. (European Union)  
Australian Communications Authority, Standard for  
Electromagnetic Compatibility. (Australia and New Zealand)  
CISPR 22:2005  
+A1:2005 +A2:2006  
Limits and methods of measurement of Radio Disturbance  
Characteristics of Information Technology Equipment.  
(International)  
CISPR 24:1997  
+A1:2001 +A2:2002  
Information Technology Equipment – Immunity Characteristics –  
Limits and Methods of Measurement. (International)  
VCCI V-3/2007.04,  
V-4/2007.04  
Voluntary Control for Interference by Information Technology  
Equipment (Japan)  
Japanese Kanji statement translation: This is a Class B product based on the standard  
of the Voluntary Control Council for Interference from Information Technology  
Equipment (VCCI). If this is used near a radio or television receiver in a domestic  
environment, it may cause radio interference. Install and use the equipment  
according to the instruction manual.  
88  
   
Regulatory Compliance  
Korean Class B statement translation: This is household equipment that is certified to  
comply with EMC requirements. You may use this equipment in residential  
environments and other non-residential environments.  
Ensure Electromagnetic Compatibility (EMC)  
Compliance  
Before computer integration, make sure that the power supply and other modules or  
peripherals, as applicable, have passed Class B EMC testing and are marked  
accordingly.  
Pay close attention to the following when reading the installation instructions for the  
host chassis, power supply, and other modules:  
Product certifications or lack of certifications  
External I/O cable shielding and filtering  
Mounting, grounding, and bonding requirements  
Keying connectors when mating the wrong connectors could be hazardous  
If the power supply and other modules or peripherals, as applicable, are not Class B  
EMC compliant before integration, then EMC testing may be required on a  
representative sample of the newly completed computer.  
89  
 
Intel Mobile Board MGM45WU Product Guide  
Product Certifications  
Board-Level Certification Markings  
Intel Mobile Board MGM45WU has the product certification markings shown in  
Table 19.Product Certification Markings  
Description  
Mark  
UL joint US/Canada Recognized Component mark. Includes adjacent  
UL file number for Intel Mobile Boards: E210882.  
FCC Declaration of Conformity logo mark for Class B equipment.  
Includes Intel name and MGM45WU model designation.  
CE mark. Declaring compliance to European Union (EU) EMC  
directive and Low Voltage directive.  
Australian Communications Authority (ACA) and New Zealand Radio  
Spectrum Management (NZ RSM) C-tick mark. Includes adjacent  
Intel supplier code number, N-232.  
Japan VCCI (Voluntary Control Council for Interference) mark.  
S. Korea MIC (Ministry of Information and Communication) mark.  
Includes adjacent MIC certification number: CPU-MGM45WU (B).  
Taiwan BSMI (Bureau of Standards, Metrology and Inspections)  
mark. Includes adjacent Intel company number, D33025.  
Printed wiring board manufacturer’s recognition mark. Consists of a  
unique UL recognized manufacturer’s logo, along with a flammability  
rating (solder side).  
V-0  
90  
     
Regulatory Compliance  
Chassis and Component Certifications  
Ensure that the chassis and certain components; such as the power supply, peripheral  
drives, wiring, and cables; are components certified for the country or market where  
used. Agency certification marks on the product are proof of certification. Typical  
product certifications include:  
In Europe  
The CE marking signifies compliance with all applicable European requirements. If the  
chassis and other components are not properly CE marked, a supplier’s Declaration of  
Conformity statement to the European EMC directive and Low Voltage directive (as  
applicable), should be obtained. Additionally, other directives, such as the Radio and  
Telecommunications Terminal Equipment (R&TTE) directive may also apply depending  
on product features.  
In the United States  
A certification mark by a Nationally Recognized Testing Laboratory (NRTL) such as UL,  
CSA, or ETL signifies compliance with safety requirements. Wiring and cables must  
also be UL listed or recognized and suitable for the intended use. The FCC Class B  
logo for home or office use signifies compliance with electromagnetic interference  
(EMI) requirements.  
In Canada  
A nationally recognized certification mark such as CSA or cUL signifies compliance with  
safety requirements. The Industry Canada statement at the front of this product guide  
demonstrates compliance with Canadian EMC regulations.  
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Intel Mobile Board MGM45WU Product Guide  
92  

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