Atmel 8 bit AVR Microcontrollers AVR430_ MC300 User Manual

AVR430: MC300 Hardware User Guide  
Features  
8-bit  
Microcontrollers  
General-purpose power stage for DC and stepper motors  
Modular system with 2,54mm pin header connector for device boards  
Four half-bridges with independent control of high and low side  
Onboard voltage regulators for device board (5/3,3V) and Hall sensors (5V)  
Hall sensor, back-EMF and center voltage feedback to device board  
Shunt resistor feedback to device board  
Application Note  
Electric specifications:  
-
-
Driver circuit: Vin 10-20V  
Motor: Vm 0-40V, Immax=6A  
Dimension: 100x100mm  
1 Introduction  
The MC300 is a general-purpose power stage board able to drive brushless DC,  
brushed DC and stepper motors. The board is designed to be a flexible platform for  
developing motor control applications. Power and all signals needed for a controller  
(AVR® CPU) are available on the left side of the board, giving a modular system  
where boards with different microcontrollers can easily be connected.  
Figure 1-1. MC300 Motor control driver board.  
Rev. 8124C-AVR-10/08  
AVR430  
2.2 Connections  
Figure 2-1. MC300 with device board, connector details and prototype board fitted.  
2.2.1 Device board connector  
The MC300 driver board can directly connect to an AVR device board. This is  
accomplished by a horizontal female 0.1” pin header connector located on the left  
side of the board, shown in Figure 2-1.  
The device board interface on MC300 connector is split into four eight-pin connectors.  
Electric schematics and mechanical specifications are shown in Figure 2-2 and  
signal description in Table 2-2.  
The connectors are mounted on the same 0.1” grid. The grid is positioned so the  
connectors will fit an angled pin header on a prototype Vero-board, shown in Figure  
2-1.  
2.2.2 Power and motor connectors  
The board has two power connectors located on the top, one 4 pin 3.81mm connector  
(J3) and one DC-jack (J5) with 2.0mm center tap. J3 allows for separate power inputs  
to Vin and Vm, while J5 powers both Vin and Vm via diodes. Refer to chapter 4.1 for  
more details.  
The motor connector (J7), a 10 pin 3.81mm connector, is found on the lower right  
side of the board. Signals and voltages associated with the motor are easy accessible  
on the pin row (J6) above the motor connector. Refer to the schematics for signals  
and pinout on J6 and J7.  
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Figure 2-2. Device board connector mechanical specification and schematics.  
2.3 Jumpers  
Refer to component floorplan for location of jumpers.  
Table 2-1. Jumpers and their functions.  
Designator  
Use and settings  
Selects voltage source to Hall sensors (VHa)  
J1 open  
– VHa not connected  
J1 pin 2 & 3 connected  
J1 pin 1 & 2 connected  
– VHa = Vcc  
J1 (VHa)  
J2 (VCC)  
– VHa = 5V (from separate regulator)  
Selects voltage from onboard regulated supply (Vcc).  
J2 connected  
J2 open  
– Vcc = 3.3V  
– Vcc = 5V  
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Table 2-2. MC300 device board connector signal description.  
Pin  
Located  
J9p1  
J9p2  
J9p3  
J9p4  
J9p5  
J9p6  
J9p7  
J9p8  
Name  
GND  
GND  
GND  
Vin  
Direction  
Description  
1
-
2
3
4
5
6
7
8
-
System ground (Vin/VCC)  
Input power Vin (10-20V)  
Regulated power Vcc (3.3V/5V)  
System ground (Vin/VCC)  
-
Output  
Output  
Output  
Output  
-
VCC  
VCC  
VCC  
GND  
9
J11p1  
UH  
UL  
VH  
VL  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Phase U Highside control input  
Phase U Lowside control input  
Phase V Highside control input  
Phase V Lowside control input  
Phase W Highside control input  
Phase W Lowside control input  
Phase X Highside control input  
Phase X Lowside control input  
10 J11p2  
11 J11p3  
12 J11p4  
13 J11p5  
14 J11p6  
15 J11p7  
16 J11p8  
WH  
WL  
XH  
XL  
17 J13p1  
18 J13p2  
19 J13p3  
20 J13p4  
21 J13p5  
22 J13p6  
23 J13p7  
24 J13p8  
GNDm  
-
Motor ground (Vmotor)  
Vmotor filtered/divided  
Vmotor’ Output  
ShCom’ Output  
Voltage over ShCom filtered/divided  
Voltage over ShU filtered/divided  
BackEMF phase U filtered/divided  
Voltage over ShV filtered/divided  
BackEMF phase V filtered/divided  
Voltage over ShW filtered/divided  
ShU’  
U’  
Output  
Output  
Output  
Output  
Output  
ShV’  
V’  
ShW’  
25 J15p1  
26 J15p2  
27 J15p3  
28 J15p4  
29 J15p5  
30 J15p6  
31 J15p7  
32 J15p8  
W’  
Output  
Output  
Output  
-
BackEMF phase W filtered/divided  
Voltage over ShX filtered/divided  
BackEMF phase X filtered/divided  
System ground (Vin/VCC)  
Hall sensor 1 signal  
ShX’  
X’  
GND  
H1  
Output  
Output  
Output  
Output  
H2  
Hall sensor 2 signal  
H3  
Hall sensor 3 signal  
Vn’  
Vn (neutral point) filtered/divided  
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3 PCB  
3.1 PCB Layout  
The MC300 is organized as shown in Figure 3-1. Most signals, important components  
and jumper information are written on the silk screen. For individual component  
placement refer to the component floorplan.  
Figure 3-1. MC300 PCB layout.  
In Figure 3-1 the following areas are marked:  
1. Device board connector.  
2. Power connectors  
3. Motor connector  
4. Phase area  
5. Indicator LEDs for power  
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3.1.1 Phase area  
Each phase has its own area with a frame drawn on silkscreen. In Figure 3-2 the area  
for phase ‘V’ is shown, and everything inside this frame regards this phase only.  
Figure 3-2. Phase ‘V’ area on MC300 PCB.  
From the left we see:  
1. Shunt filter/damping block – denoted ‘Sh’  
2. Back EMF filter/damping block – denoted ‘EMF’  
3. Shunt resistor testpoints – denoted ‘-‘ and ‘+’ (above shunt resistor)  
4. Bootstrap voltage testpoint – denoted ‘Vboot’  
5. MOS Gate voltage testpoints – denoted ‘VGl’ (low side) and ‘VGh’ (high side)  
3.1.2 Common shunt and filters/dividers  
The common shunt (R62) with testpoints is found above phase ‘U’ and denoted  
‘ShCom’. Filters/dividers for Vm, ShCom and Vn are found on the left of the phase  
areas.  
3.2 Schematics, component floorplan and bill of materials  
The schematics, component floorplan and bill of materials (BOM) for MC300 are  
found as separate PDF files distributed with this application note, they can be  
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8124C-AVR-10/08  
4 Detailed description  
4.1 Power  
The MC300 has two power circuits. Vin for powering driver ICs and voltage  
regulators, and Vmotor (Vm) for powering the output stage (MOSFETs). The separate  
power supply for the motor, Vm, allows the use of motor voltages outside the voltage  
range of the driver ICs. This also isolates noise generated by the output stage/motor.  
There is a separate ground plane for each power circuit, GND for Vin and GNDmotor  
(GNDm) for Vm. This is done to separate the high currents to the motor from the rest.  
The ground planes are connected together at one single point, under the J3  
connector (shown in Figure 4-1).  
A regulated power supply for Vcc is included on the board. The voltage for Vcc is  
selectable by J2, if open Vcc = 5V and if set Vcc = 3.3V.  
4.1.1 Input  
The MC300 can be powered in two ways. With J3, a four pin 3,81mm pitch connector,  
separate power supplies can be connected to Vin and Vm. But it is also possible to  
power the MC300 from a single DC-Jack connector, J5. J5 is connected to Vin and  
Vm via diodes as shown in Figure 4-1. When J5 is used as power input, the supply  
voltage must not exceed 20V and maximum current is 5A.  
Figure 4-1. MC300 Power input.  
4.1.2 Fuses  
Vin is protected by a resettable 0,75A polyfuse (F1). If the current through it exceeds  
0,75A, the fuse will heat up and go into a high resistance mode for as long as the load  
is retained, and will reset when allowed to cool down.  
A socket mounted 6,3A 5x20 mm fuse protects Vm (F2). Using a socket mounted  
fuse allows the user to replace and change it easily. When developing software it is  
also practical to not power the output stages until correct operation of the software is  
ensured, and this can be done by simply removing the fuse.  
4.1.3 LEDs  
Vcc, Vin and Vm each have their own green LED to indicate if voltage is present. The  
Vcc LED (D3) is connected to Vcc by a resistor and hence it will emit less light when  
Vcc is 3,3V. Vin and Vm LEDs (D1 and D2) have a constant current sources, so they  
have a constant intensity even if Vin or Vm changes.  
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4.1.4 Hall sensors  
VHall (VHa) is available on J7 as power source for Hall sensors, typically found on  
BLDC motors. With J1 VHa can be connected to Vcc or to a 5V regulator (U2). A  
separate 5V regulator for the Hall sensors is included so Vcc can be 3,3V while using  
Hall sensors, since most Hall sensors will not work on 3,3V.  
4.2 Half bridges  
The half bridge consists of two n-channel power MOSFETs, driven by an integrated  
high and low side driver IC (IR2101S). The integrated driver IC is powered from Vin  
and provides gate voltages to the high and low side power MOSFETs. Schematics for  
the half bridge for phase U is shown in Figure 4-2  
Figure 4-2. Phase U half bridge.  
4.2.1 High side driving considerations  
The high side of the half-bridge uses a bootstrap circuit. This means the duty cycle  
and the on-time are limited by the requirement to refresh the charge in the bootstrap  
capacitor. If the driving logic fails to do this, the gate voltage to the high side MOS will  
decrease and the RDS will increase. This may result in high power dissipation in the  
high side MOS, and consequently destroy it.  
Refer with IR2101S datasheets for detailed information about the bootstrap circuit.  
4.2.2 Test points  
Each half bridge has several testpoints to allow for measurements. MOS gate  
voltages for high (VGh) and low-side (VGl) and bootstrap voltage (Vboot) are  
available. Both sides of the shunt resistors (- and +) can also be measured.  
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8124C-AVR-10/08  
4.3 Shunts  
The board is shipped with a common shunt resistor (ShCom - R62) of 0,050 ohm and  
the four phase shunt resistors are zero ohm resistors, shown in Figure 4-3. This  
allows for measurement of the total current going to ground via all half bridges.  
Figure 4-3. Shunt resistor network.  
If current measurements of separate phases are required, the common shunt should  
be changed to a zero ohm resistor and the zero ohm resistors on each phase (ShU -  
R27, ShV - R38, ShW - R49 and ShX - R64) should be replaced with appropriate  
shunt resistors.  
4.3.1 Shunt feedback filters  
The voltages over the shunt resistors (ShCom/ShU/V/W/X) are fed to a filter/damping  
block, ShU as shown in Figure 4-4. The board is shipped with a filter that consists of a  
10k ohm resistor in series with a 10nF capacitor, resulting in a low pass filter with a  
1,6kHz cutoff frequency. The signal from the filters (ShCom’/ShU’/V’/W’/X’) are  
available on the device board interface.  
Figure 4-4. Filter/damping block for shunt feedback.  
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4.4 Back-EMF  
For sensorless applications, the driving logic uses back EMF from the motor’s phases  
to keep track of the motor position. To observe the back EMF from a phase, the  
phase is left floating, i.e. with the high or low side MOS not powered, and the voltage  
on the phase is read. For motors with center tap, Vn (V neutral) provides feedback to  
device board.  
4.4.1 Back-EMF feedback filters  
Each phase (U/V/W/X) and the center tap (Vn) are fed via a filter/damping block to  
the device board interface. The block for phase U is shown in Figure 4-5. The board  
is shipped with a zero ohm resistor, so it has no damping/filter function. The signals  
are named U’, V’, W’, X’ and Vn’ after going through the filter blocks.  
Vmotor (Vm) is also fed thru a filter/damping block, and is available on the device  
board interface as Vm’.  
Figure 4-5. Filter/damping block for back-EMF feedback.  
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8124C-AVR-10/08  
4.5 Upgrading the MC300  
As the board is shipped, its limitations are Vmmax=40V and Immax=6A. These limits can  
be increased by replacing the relevant components (not included).  
4.5.1 Voltage limitations  
If a Vmmax higher than 40V is required, then some components must be changed on  
the board. Components limiting Vm, listed with lowest voltage ratings first, are shown  
in Table 4-1.  
Table 4-1. Components influenced by Vm.  
Component designator(s)  
Component name  
IRFR3504  
100nF  
Limiting parameter  
VDSS = 40V  
Q3, Q4, Q5, Q6, Q7, Q8, Q9 & Q10  
C10, C19, C26 & C33  
Vmax = 50V  
Q2  
2N7002  
VDSmax = 60V  
C14  
47uF/63V  
BAS16  
Vmax = 63V  
D8, D12, D13 & D14  
VRRM = 85V  
D9  
10MQ100N  
12CWQ10FN  
10nF  
VRRM = 100V  
D11  
C7  
VRRM = 100V  
Vmax = 100V [2]  
Pmax = 0.1W -> Vm = 108V  
R7  
100kOhm  
The integrated bridge drivers (IR2101S) can handle up to 600V, but the layout of the  
PCB (spacing between tracks) should be considered before operation at high  
voltages.  
If filters/dividers for Vm, U, V, W, or X have been mounted, verify that they can handle  
Vm.  
4.5.2 Current limitations  
For an Im > 5A, use power connector J3 and not DC-Jack J5. If an Immax larger than  
6A is required, components listed in Table 4-2 are affected.  
Table 4-2. Components conducting Im.  
Component designator(s)  
Component name  
50mOhm 2W  
Limiting parameter  
Imax = sqrt(P/R) = 6,0A (1)  
Imax = 8A  
R62  
J3 & J7  
MC1,5/x-G-3,81  
IRFR3504  
Q3, Q4, Q5, Q6, Q7, Q8, Q9 & Q10  
ID = 30A  
Notes: 1. The pad/track area around R62 is not 300mm2 as required by datasheet for  
handling 2W. Reducing P to 1,8W gives Imax = sqrt(P/R) = 6,0A.  
4.5.3 Additional decoupling capacitors on Vm  
The board has provision for some extra decoupling capacitors on Vm. They are found  
close to the MOS bridges (C11, C12, C20, C21, C27, C28, C34 and C35), and one  
close to the power input (C13).  
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D
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8124C-AVR-10/08  

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