Intel Chipper 945PL User Manual

Intel® 945G/945GZ/945GC/  
945P/945PL Express Chipset  
Family  
Thermal and Mechanical Design Guidelines (TMDG)  
- For the Intel® 82945G/82945GZ/82945GC Graphics Memory  
Controller Hub (GMCH) and Intel® 82945P/82945PL Memory  
Controller Hub (MCH)  
February 2008  
Document Number: 307504-004  
Contents  
Thermal and Mechanical Design Guidelines  
3
Figures  
Figure 1. (G)MCH Non-Grid Array......................................................................12  
Figure 2. 0° Angle Attach Methodology (top view, not to scale)..............................16  
Figure 3. 0° Angle Attach Heatsink Modifications (generic heatsink side and bottom  
view shown, not to scale)...........................................................................16  
Figure 4. Airflow Temperature Measurement Locations .........................................17  
Figure 5. Processor Heatsink Orientation to Provide Airflow to (G)MCH Heatsink on an  
ATX Platform............................................................................................20  
Figure 6. Processor Heatsink Orientation to Provide Airflow to (G)MCH Heatsink on a  
Balanced Technology Extended (BTX) Platform..............................................21  
Figure 7. ATX GMCH Heatsink Installed on Board.................................................22  
Figure 8. Balanced Technology Extended (BTX) GMCH Heatsink Installed on Board...23  
Figure 9. (G)MCH Package Drawing ...................................................................28  
Figure 10. (G)MCH Component Keep-Out Restrictions for ATX Platforms .................29  
Figure 11. (G)MCH Component Keep-Out Restrictions for Balanced Technology  
Extended (BTX) Platforms ..........................................................................30  
Figure 12. (G)MCH Reference Heatsink for ATX Platforms – Sheet 1 .......................31  
Figure 13. (G)MCH Reference Heatsink for ATX Platforms – Sheet 2 .......................32  
Figure 14. (G)MCH Reference Heatsink for ATX Platforms – Anchor ........................33  
Figure 15. (G)MCH Reference Heatsink for ATX Platforms – Ramp Retainer Sheet 1..34  
Figure 16. (G)MCH Reference Heatsink for ATX Platforms – Ramp Retainer Sheet 2..35  
Figure 17. (G)MCH Reference Heatsink for ATX Platforms – Wire Preload Clip ..........36  
Figure 18. (G)MCH Reference Heatsink for Balanced Technology Extended (BTX)  
Platforms.................................................................................................37  
Figure 19. (G)MCH Reference Heatsink for Balanced Technology Extended (BTX)  
Platforms – Clip........................................................................................38  
Figure 20. (G)MCH Reference Heatsink for Balanced Technology Extended (BTX)  
Platforms – Heatsink Assembly ...................................................................39  
Tables  
Table 1. (G)MCH Loading Specifications..............................................................12  
Table 2. (G)MCH Case Temperature Specifications .............................................13  
Table 3. (G)MCH Thermal Design Power Specifications........................................14  
Table 4. Reference Thermal Solution Environmental Reliability Requirements.........24  
Table 5. (G)MCH ATX Intel Reference Heatsink Enabled Suppliers.........................25  
Table 6. (G)MCH Balanced Technology Extended (BTX) Intel Reference Heatsink  
Enabled Suppliers .....................................................................................26  
4
Thermal and Mechanical Design Guidelines  
Revision History  
Revision  
Number  
Description  
Date  
-001  
-002  
-003  
Initial Release  
May 2005  
Added Intel® 82945PL specifications  
October 2005  
Added Intel® 82945GZ specifications  
December  
2005  
-004  
Added Intel® 82945GC specifications  
February 2008  
§
Thermal and Mechanical Design Guidelines  
5
6
Thermal and Mechanical Design Guidelines  
Introduction  
1 Introduction  
As the complexity of computer systems increases, so do power dissipation  
requirements. The additional power of next generation systems must be properly  
dissipated. Heat can be dissipated using improved system cooling, selective use of  
ducting, and/or active/passive heatsinks.  
The objective of thermal management is to ensure that the temperatures of all  
components in a system are maintained within functional limits. The functional  
temperature limit is the range within which the electrical circuits can be expected to  
meet specified performance requirements. Operation outside the functional limit can  
degrade system performance, cause logic errors, or cause component and/or system  
damage. Temperatures exceeding the maximum operating limits may result in  
irreversible changes in the operating characteristics of the component. The goal of this  
document is to provide an understanding of the operating limits of the Intel®  
82945G/82945GZ/82945GC Graphics and Memory Controller Hub (GMCH) and Intel®  
82945P/82945PL Memory Controller Hub (MCH), and discuss a reference thermal  
solution.  
The simplest and most cost-effective method to improve the inherent system cooling  
characteristics of the (G)MCH is through careful design and placement of fans, vents,  
and ducts. When additional cooling is required, component thermal solutions may be  
implemented in conjunction with system thermal solutions. The size of the fan or  
heatsink can be varied to balance size and space constraints with acoustic noise.  
This document presents the conditions and requirements to properly design a cooling  
solution for systems that implement the 82945G/82945GZ/82945GC GMCH or  
82945P/82945PL MCH. Properly designed solutions provide adequate cooling to  
maintain the (G)MCH case temperature at or below thermal specifications. This is  
accomplished by providing a low local-ambient temperature, ensuring adequate local  
airflow, and minimizing the case to local-ambient thermal resistance. By maintaining  
the (G)MCH case temperature at or below those recommended in this document, a  
system designer can ensure the proper functionality, performance, and reliability of  
these components.  
Note: Unless otherwise specified, the information in this document applies to the Intel®  
82945G/82945GZ/82945GC Graphics and Memory Controller Hub (GMCH) and the  
Intel® 82945P/82945PL Memory Controller Hub (MCH). The term (G)MCH refers to the  
82945G GMCH, 82945GZ GMCH, 82945GC GMCH, 82945P MCH, and 82945PL MCH.  
Note: Unless otherwise specified, ICH7 refers to the Intel® 82801GB ICH7 and 82801GR  
ICH7R I/O Controller Hub 7 components.  
Thermal and Mechanical Design Guidelines  
7
 
Introduction  
1.1  
Terminology  
Term  
Description  
BGA  
Ball Grid Array. A package type defined by a resin-fiber substrate where a die is  
mounted and bonded. The primary electrical interface is an array of solder balls  
attached to the substrate opposite the die and molding compound.  
FC-BGA  
Flip Chip Ball Grid Array. A package type defined by a plastic substrate where a  
die is mounted using an underfill C4 (Controlled Collapse Chip Connection)  
attach style. The primary electrical interface is an array of solder balls attached  
to the substrate opposite the die. Note that the device arrives at the customer  
with solder balls attached.  
Intel® ICH7  
GMCH  
MCH  
Intel® I/O Controller Hub 7. The chipset component that contains the primary  
PCI interface, LPC interface, USB, ATA, and/or other legacy functions.  
Graphic Memory Controller Hub. The chipset component that contains the  
processor and memory interface and integrated graphics device.  
Memory Controller Hub. The chipset component that contains the processor  
and memory interface. It does not contain an integrated graphics device.  
TA  
The measured ambient temperature locally to the component of interest. The  
ambient temperature should be measured just upstream of airflow for a  
passive heatsink or at the fan inlet for an active heatsink.  
TC  
The measured case temperature of a component. For processors, TC is  
measured at the geometric center of the integrated heat spreader (IHS). For  
other component types, it is generally measured at the geometric center of the  
die or case.  
TC-MAX  
TC-MIN  
TDP  
The maximum case/die temperature with an attached heatsink. This  
temperature is measured at the geometric center of the top of the package  
case/die.  
The minimum case/die temperature with an attached heatsink. This  
temperature is measured at the geometric center of the top of the package  
case/die.  
Thermal Design Power. TDP is specified as the highest sustainable power level  
of most or all of the real applications expected to be run on the given product,  
based on extrapolations in both hardware and software technology over the life  
of the component. Thermal solutions should be designed to dissipate this target  
power level.  
TIM  
Thermal Interface Material. TIM is the thermally conductive material installed  
between two surfaces to improve heat transfer and reduce interface contact  
resistance.  
lfm  
Linear Feet per Minute. Unit of airflow speed.  
ΨCA  
Case-to-ambient thermal characterization parameter (Psi). This is a measure of  
thermal solution performance using total package power. It is defined as (TC –  
TA) / Total Package Power. Heat source size should always be specified for Ψ  
measurements.  
8
Thermal and Mechanical Design Guidelines  
 
Introduction  
1.2  
Reference Documents  
Document  
Comments  
Intel® 945G/945GZ/945P/945PL Express Chipset Family  
Datasheet  
Intel® I/O Controller Hub 7 (ICH7) Datasheet  
Intel® I/O Controller Hub 7 (ICH7) Thermal Design Guidelines  
Intel® Pentium® 4 Processor 670, 660, 650, 640, and 630 and http://developer.intel.com  
Intel® Pentium® 4 Processor Extreme Edition Datasheet  
Intel® Pentium®4 Processors 570/571, 560/561,  
550/551,540/541, 530/531 and 520/521 Supporting Hyper-  
Threading Technology Datasheet  
Intel® Pentium® D Processor 840, 830 and 820 Datasheet  
Intel® Pentium® 4 Processor on 90 nm Process in the 775–  
Land LGA Package Thermal and Mechanical Design Guidelines  
Intel® Pentium® D® Processor and Intel® Pentium® Processor  
Extreme Edition 830 Thermal and Mechanical Design Guidelines design/pentiumXE/designe  
LGA775 Socket Mechanical Design Guide  
Various System Thermal Design Suggestions  
§
Thermal and Mechanical Design Guidelines  
9
 
Introduction  
10  
Thermal and Mechanical Design Guidelines  
Product Specifications  
2 Product Specifications  
This chapter provides the package description and loading specifications. The chapter  
also provides component thermal specifications and thermal design power descriptions  
for the (G)MCH.  
2.1  
Package Description  
The (G)MCH is available in a 34 mm [1.34 in] x 34 mm [1.34 in] Flip Chip Ball Grid  
Array (FC-BGA) package with 1202 solder balls. The die size is currently 9.6 mm  
[0.378in] x 10.6 mm [0.417in]. A mechanical drawing of the package is shown in  
2.1.1  
Non-Grid Array Package Ball Placement  
The (G)MCH package uses a “balls anywhere” concept. The minimum ball pitch is  
0.8 mm [0.031 in], but ball ordering does not follow a 0.8-mm grid. Board designers  
should ensure correct ball placement when designing for the non-grid array pattern.  
For exact ball locations relative to the package, contact your Field Sales  
Representative.  
Thermal and Mechanical Design Guidelines  
11  
 
Product Specifications  
Figure 1. (G)MCH Non-Grid Array  
2.2  
Package Loading Specifications  
Table 1 provides static load specifications for the chipset package. This mechanical  
maximum load limit should not be exceeded during heatsink assembly, shipping  
conditions, or standard use conditions. Also, any mechanical system or component  
testing should not exceed the maximum limit. The chipset package substrate should  
not be used as a mechanical reference or load-bearing surface for the thermal and  
mechanical solution.  
Table 1. (G)MCH Loading Specifications  
Parameter  
Static  
Maximum  
15 lbf  
Notes  
1,2,3  
NOTES:  
1. These specifications apply to uniform compressive loading in a direction normal to the  
(G)MCH package.  
2. This is the maximum force that can be applied by a heatsink retention clip. The clip must  
also provide the minimum specified load on the (G)MCH package.  
3. These specifications are based on limited testing for design characterization. Loading limits  
are for the package only.  
12  
Thermal and Mechanical Design Guidelines  
 
Product Specifications  
2.3  
Thermal Specifications  
To ensure proper operation and reliability of the (G)MCH, the temperature must be at  
or below the maximum value specified in Table 2. System and component level  
thermal enhancements are required to dissipate the heat generated and maintain the  
(G)MCH within specifications. Chapter 3 provides the thermal metrology guidelines for  
case temperature measurements.  
The (G)MCH must also operate above the minimum case temperature specification  
listed in Table 2.  
Table 2. (G)MCH Case Temperature Specifications  
Parameter  
Value  
82945G/82945GZ/82945GC GMCH: 99 °C  
82945P/82945PL MCH : 103°C  
0 °C  
TC-MAX  
TC-MIN  
NOTE: Thermal specifications assume an attached heatsink is present.  
2.4  
Thermal Design Power (TDP)  
Thermal design power (TDP) is the estimated power dissipation of the (G)MCH based  
on normal operating conditions including VCC and TC-MAX while executing real worst-  
case power intensive applications. This value is based on expected worst-case data  
traffic patterns and usage of the (G)MCH and does not represent a specific software  
application. TDP attempts to account for expected increases in power due to variation  
in (G)MCH current consumption due to silicon process variation, processor speed,  
DRAM capacitive bus loading and temperature. However, since these variations are  
subject to change, the TDP cannot ensure that all applications will not exceed the TDP  
value.  
The system designer must design a thermal solution for the (G)MCH such that it  
maintains TC below TC-MAX for a sustained power level equal to TDP. Note that the TC-  
specification is a requirement for a sustained power level equal to TDP, and that  
MAX  
the case temperature must be maintained at temperatures less than TC-MAX when  
operating at power levels less than TDP. This temperature compliance is to ensure  
(G)MCH reliability over its useful life. The TDP value can be used for thermal design if  
the (G)MCH thermal protection mechanisms are enabled. Intel chipsets incorporate a  
hardware-based fail-safe mechanism to help keep the product temperature within  
specifications in the event of unusually strenuous usage above the TDP power limit.  
Thermal and Mechanical Design Guidelines  
13  
 
Product Specifications  
2.4.1  
Methodology  
Pre-Silicon  
2.4.1.1  
To determine TDP for pre-silicon products in development, it is necessary to make  
estimates based on analytical models. These models rely on extensive knowledge of  
the past chipset power dissipation behavior along with knowledge of planned  
architectural and process changes that may affect TDP. Knowledge of applications  
available today and their ability to stress various components of the chipset is also  
included in the model. Since the number of applications available today is beyond  
what Intel can test, only real world high-power applications are tested to predict TDP.  
The values determined are used to set specific data transfer rates. The projection for  
TDP assumes (G)MCH operation at TC-MAX. The TDP estimate also includes a margin to  
account for process variation.  
2.4.1.2  
2.4.2  
Post-Silicon  
Once the product silicon is available, post-silicon validation is performed to assess the  
validity of pre-silicon projections. Testing is performed on both commercially available  
and synthetic high power applications and power data is compared to pre-silicon  
estimates. Post-silicon validation may result in a small adjustment to pre-silicon TDP  
estimates.  
Application Power  
Designing to the TDP can ensure that a particular thermal solution meets the cooling  
needs of future applications. Testing with currently available commercial applications  
has shown that the components may dissipate power levels below the published TDP  
specification in Section 2.4.3. Intel strongly recommends that thermal engineers  
design to the published TDP specification to develop a robust thermal solution that will  
meet the needs of current and future applications.  
2.4.3  
Specifications  
The (G)MCH is estimated to dissipate the Thermal Design Power values provided in  
Table 3 when using two DIMMs of 667 MHz (553 MHz for the 82945PL/82945GZ) dual  
channel DDR2 with a 1066 MHz (800 MHz for the 82945PL/82945GZ/82945GC)  
processor system bus speed. For the 82945G/82945GZ/82945GC GMCH, the graphics  
core is assumed to run at 400 MHz. FC-BGA packages have limited heat transfer  
capability into the board and have minimal thermal capability without thermal  
solutions. Intel requires that system designers plan for an attached heatsink when  
using the (G)MCH.  
Table 3. (G)MCH Thermal Design Power Specifications  
Component  
System Bus Speed  
Memory Frequency  
TDP Value  
1066 MHz  
800 MHz  
800 MHz  
1066 MHz  
800 MHz  
§
667 MHz  
533 MHz  
667 MHz  
667 MHz  
533 MHz  
82945G GMCH  
82945GZ GMCH  
82945GC GMCH  
82945P MCH  
22.2 W  
22.2 W  
22.2 W  
15.2 W  
15.2 W  
82945PL MCH  
14  
Thermal and Mechanical Design Guidelines  
 
Thermal Metrology  
3 Thermal Metrology  
The system designer must measure temperatures to accurately determine the thermal  
performance of the system. Intel has established guidelines for proper techniques of  
measuring (G)MCH component case temperatures.  
3.1  
Case Temperature Measurements  
To ensure functionality and reliability, the (G)MCH is specified for proper operation  
when TC is maintained at or below the maximum temperature listed in Table 2. The  
surface temperature at the geometric center of the die corresponds to TC. Measuring  
TC requires special care to ensure an accurate temperature reading.  
Temperature differences between the temperature of a surface and the surrounding  
local ambient air can introduce error in the measurements. The measurement errors  
could be due to a poor thermal contact between the thermocouple junction and the  
surface of the package, heat loss by radiation and/or convection, conduction through  
thermocouple leads, or contact between the thermocouple cement and the heatsink  
base (if a heatsink is used). To minimize these measurement errors a thermocouple  
attach with a zero-degree methodology is recommended.  
3.1.1  
Thermocouple Attach Methodology  
1. Mill a 3.3 mm [0.13 in] diameter hole centered on bottom of the heatsink base.  
The milled hole should be approximately 1.5 mm [0.06 in] deep.  
2. Mill a 1.3 mm [0.05 in] wide slot, 0.5 mm [0.02 in] deep, from the centered hole  
to one edge of the heatsink. The slot should be in the direction parallel to the  
heatsink fins (see Figure 3).  
3. Attach thermal interface material (TIM) to the bottom of the heatsink base.  
4. Cut out portions of the TIM to make room for the thermocouple wire and bead.  
The cutouts should match the slot and hole milled into the heatsink base.  
5. Attach a 36 gauge or smaller calibrated K-type thermocouple bead or junction to  
the center of the top surface of the die using a high thermal conductivity cement.  
During this step, make sure no contact is present between the thermocouple  
cement and the heatsink base because any contact will affect the thermocouple  
reading. It is critical that the thermocouple bead makes contact with the  
die (see Figure 2).  
6. Attach heatsink assembly to the (G)MCH and route thermocouple wires out  
through the milled slot.  
Thermal and Mechanical Design Guidelines  
15  
 
Thermal Metrology  
Figure 2. 0° Angle Attach Methodology (top view, not to scale)  
Figure 3. 0° Angle Attach Heatsink Modifications (generic heatsink side and bottom  
view shown, not to scale)  
3.2  
Airflow Characterization  
Figure 4 describes the recommended location for air temperature measurements  
measured relative to the component. For a more accurate measurement of the  
average approach air temperature, Intel recommends averaging temperatures  
recorded from two thermocouples spaced about 25 mm [1.0 in] apart. Locations for  
both a single thermocouple and a pair of thermocouples are presented.  
16  
Thermal and Mechanical Design Guidelines  
 
Thermal Metrology  
Figure 4. Airflow Temperature Measurement Locations  
Airflow velocity should be measured using industry standard air velocity sensors.  
Typical airflow sensor technology may include hot wire anemometers. Figure 4  
provides guidance for airflow velocity measurement locations. These locations are for  
a typical JEDEC test setup and may not be compatible with chassis layouts due to the  
proximity of the processor to the (G)MCH. The user may have to adjust the locations  
for a specific chassis. Be aware that sensors may need to be aligned perpendicular to  
the airflow velocity vector or an inaccurate measurement may result. Measurements  
should be taken with the chassis fully sealed in its operational configuration to achieve  
a representative airflow profile within the chassis.  
§
Thermal and Mechanical Design Guidelines  
17  
 
Thermal Metrology  
18  
Thermal and Mechanical Design Guidelines  
Reference Thermal Solution  
4 Reference Thermal Solution  
The reference component thermal solution for the (G)MCH for ATX platforms uses two  
ramp retainers, a wire preload clip, and four custom MB anchors. The Intel Balanced  
Technology Extended (BTX) reference design uses a Z-clip attach for the (G)MCH  
heatsink. This chapter provides detailed information on operating environment  
assumptions, heatsink manufacturing, and mechanical reliability requirements for the  
(G)MCH.  
4.1  
Operating Environment  
The operating environment of the (G)MCH will differ depending on system  
configuration and motherboard layout. This section defines operating environment  
boundary conditions that are typical for ATX and BTX form factors. The system  
designer should perform analysis on the platform operating environment to assess any  
impact to thermal solution selection.  
4.1.1  
ATX Form Factor Operating Environment  
In ATX platforms, an airflow speed of 0.76 m/s [150 lfm] is assumed to be present  
25 mm [1 in] in front of the heatsink air inlet side of the attached reference thermal  
solution. The system integrator should note that board layout may be such that there  
will not be 25mm [1in] between the processor heatsink and the (G)MCH. The potential  
for increased airflow speeds may be realized by ensuring that airflow from the  
processor heatsink fan exhausts in the direction of the (G)MCH heatsink. This can be  
achieved by using a heatsink providing omni directional airflow, such as a radial fin or  
“X” pattern heatsink. Such heatsinks can deliver airflow to both the (G)MCH and other  
areas like the voltage regulator, as shown in Figure 5. In addition, the (G)MCH board  
placement should ensure that the (G)MCH heatsink is within the air exhaust area of  
the processor heatsink.  
Note that heatsink orientation alone does not ensure that 0.76 m/s [150 lfm]  
airflow speed will be achieved. The system integrator should use analytical or  
experimental means to determine whether a system design provides adequate airflow  
speed for a particular (G)MCH heatsink.  
The local ambient air temperature, TA, at the (G)MCH heatsink in an ATX platform is  
assumed to be 47 °C. The thermal designer must carefully select the location to  
measure airflow to get a representative sampling. These environmental assumptions  
are based on a 35 °C system external temperature measured at sea level.  
Thermal and Mechanical Design Guidelines  
19  
 
Reference Thermal Solution  
Figure 5. Processor Heatsink Orientation to Provide Airflow to (G)MCH Heatsink on an  
ATX Platform  
Airflow Direction  
Airflow Direction  
(G)MCH Heatsink  
Omi Directional Flow  
Processor Heatsink  
(Fan Not Shown)  
TOP VIEW  
Proc_HS_Orient_ATX  
Other methods exist for providing airflow to the (G)MCH heatsink, including the use of  
system fans and/or ducting, or the use of an attached fan (active heatsink).  
4.1.2  
Balanced Technology Extended (BTX) Form Factor  
Operating Environment  
The operating environment for the (G)MCH in typical BTX systems has not been  
profiled. This section provides operating environment conditions based on what has  
been exhibited on the Intel micro-BTX reference design. On a BTX platform, the  
(G)MCH obtains in-line airflow directly from the processor thermal module. Since the  
processor thermal module provides lower inlet temperature airflow to the processor,  
reduced inlet ambient temperatures are also often seen at the (G)MCH as compared to  
ATX. An example of how airflow is delivered to the (G)MCH on a BTX platform is  
shown in Figure 6.  
The local ambient air temperature, TA, at the (G)MCH heatsink in the Intel micro-BTX  
reference design is predicted to be ~45 °C. The thermal designer must carefully select  
the location to measure airflow to get a representative sampling. These environmental  
assumptions are based on a 35 °C system external temperature measured at sea  
level.  
Note: The local ambient air temperature is a projection based on anticipated power  
increases on a 2005 platform and may be subject to change in future revisions of this  
document.  
20  
Thermal and Mechanical Design Guidelines  
 
Reference Thermal Solution  
Figure 6. Processor Heatsink Orientation to Provide Airflow to (G)MCH Heatsink on a  
Balanced Technology Extended (BTX) Platform  
Balanced Technology  
Extended (BTX) Thermal  
Module Assembly Over  
Airflow Direction  
Processor  
(G)MCH  
Top View  
Proc_HS_Orient  
4.2  
4.3  
Mechanical Design Envelope  
The motherboard component keep-out restrictions for the (G)MCH on an ATX platform  
are included in Appendix B, Figure 10. The motherboard component keep-out  
restrictions for the (G)MCH on a BTX platform are included in Figure 11.  
System integrators should ensure no board or chassis components would intrude into  
the volume occupied by the (G)MCH thermal solution.  
Thermal Solution Assembly  
The reference thermal solution for the (G)MCH for an ATX platform is shown in  
Figure 7 and Appendix B and is an aluminum extruded heatsink that uses two ramp  
retainers, a wire preload clip, and four custom motherboard anchors. The heatsink is  
attached to the motherboard by assembling the anchors into the board, placing the  
heatsink over the (G)MCH and anchors at each of the corners, and securing the plastic  
ramp retainers through the anchor loops before snapping each retainer into the fin  
gap. The assembly is then sent through the wave process. Post wave, the wire preload  
clip is assembled using the hooks on each of the ramp retainers. The clip provides the  
mechanical preload to the package. A thermal interface material (Chomerics* T710) is  
pre-applied to the heatsink bottom over an area that contacts the package die.  
The reference thermal solution for the (G)MCH for a BTX platform is shown in  
Figure 8. The heatsink is aluminum extruded and uses a Z-clip for attach. The clip is  
secured to the system motherboard via two solder-down anchors around the (G)MCH.  
The clip helps to provide a mechanical preload to the package via the heatsink. A  
thermal interface material (Chomerics* T710) is pre-applied to the heatsink bottom  
over an area in contact with the package die.  
The ATX reference thermal solution differs from the BTX reference solution because a  
BTX platform requires a Support and Retention Mechanism (SRM) that helps to meet  
the mechanical requirements listed in Table 4.  
Thermal and Mechanical Design Guidelines  
21  
 
Reference Thermal Solution  
Figure 7. ATX GMCH Heatsink Installed on Board  
22  
Thermal and Mechanical Design Guidelines  
 
Reference Thermal Solution  
Figure 8. Balanced Technology Extended (BTX) GMCH Heatsink Installed on Board  
Thermal and Mechanical Design Guidelines  
23  
 
Reference Thermal Solution  
4.4  
Environmental Reliability Requirements  
The environmental reliability requirements for the reference thermal solution are  
shown in Table 4. These should be considered as general guidelines. Validation test  
plans should be defined by the user based on anticipated use conditions and resulting  
reliability requirements.  
Table 4. Reference Thermal Solution Environmental Reliability Requirements  
Test1  
Requirement  
Pass/Fail  
Criteria2  
Mechanical  
Shock  
3 drops for + and - directions in each of 3  
perpendicular axes (i.e., total 18 drops).  
Visual\Electrical  
Check  
Profile: 50 G trapezoidal waveform, 11 ms duration,  
4.3 m/s [170 in/s] minimum velocity change.  
Setup: Mount sample board on test fixture. Include  
550 g processor heatsink.  
Random  
Vibration  
Duration: 10 min/axis, 3 axes  
Visual/Electrical  
Check  
Frequency Range: 5 Hz to 500 Hz  
Power Spectral Density (PSD) Profile: 3.13 g RMS  
-40 °C to +85 °C, 900 cycles  
Thermal  
Cycling  
Thermal  
Performance  
Unbiased  
Humidity  
85 % relative humidity / 55 °C, 500 hours  
Visual Check  
NOTES:  
1. The above tests should be performed on a sample size of at least 12 assemblies from 3  
different lots of material.  
2. Additional Pass/Fail Criteria may be added at the discretion of the user.  
§
24  
Thermal and Mechanical Design Guidelines  
 
Enabled Suppliers  
Appendix AEnabled Suppliers  
Current suppliers for the Intel® 945G/945GZ/945GC/945P/945PL Express chipset  
(G)MCH reference thermal solution are listed in Table 5 and Table 6.  
Table 5. (G)MCH ATX Intel Reference Heatsink Enabled Suppliers  
Supplier  
Intel Part  
Number  
Vendor Part  
Number  
Contact Information  
C85366-001  
(heatsink)  
00C863501A  
334C863501A  
334C863502A  
Monica Chih - +886 (-2) -  
29952666  
C85370-001  
(ramp  
retainer)  
CCI (Chaun Choung  
Technology Corp)  
Harry Lin - (714) 739-5797  
C85373-001  
(wire clip)  
C85376-001  
(anchor)  
G2100C888-143  
Rick Lin - +886 (-2) -  
26471896 ext.6342  
WiesonElectronic Co.  
C85366-001  
(heatsink)  
Jack Chen – (714) 626-1233  
2Z802-016  
C85370-001  
(ramp  
retainer)  
3EE77-002  
3KS02-066  
Foxconn/HonHai  
Precision  
C85373-001  
(wire clip)  
C85376-001  
(anchor)  
2Z802-015  
Jack Chen – (714) 626-1233  
Foxconn/HonHai  
Precision  
Note: These vendors and devices are listed by Intel as a convenience to Intel's general  
customer base, but Intel does not make any representations or warranties whatsoever  
regarding quality, availability, reliability, functionality, or compatibility of these  
devices. This list and/or these devices may be subject to change without notice.  
Thermal and Mechanical Design Guidelines  
25  
 
Enabled Suppliers  
Table 6. (G)MCH Balanced Technology Extended (BTX) Intel Reference Heatsink  
Enabled Suppliers  
Supplier  
Intel Part  
Number  
Vendor Part  
Number  
Contact Information  
C57359-001  
00C863401A  
Monica Chih - +886 (-2) -  
29952666  
CCI (Chaun  
Choung  
Technology  
Corp.)  
Harry Lin - (714) 739-5797  
C57359-001  
C57359-001  
S909700001  
2Z802-010  
David Chao - +886 (-2) -2299-  
6930 x619  
AVC (Asia Vital  
Components)  
Jack Chen – (714) 626-1233  
Foxconn/HonHai  
Precision  
§
26  
Thermal and Mechanical Design Guidelines  
 
 
 
 
 
 
 
 
 
 
 
 
 

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