Intel® 945G/945GZ/945GC/
945P/945PL Express Chipset
Family
Thermal and Mechanical Design Guidelines (TMDG)
- For the Intel® 82945G/82945GZ/82945GC Graphics Memory
Controller Hub (GMCH) and Intel® 82945P/82945PL Memory
Controller Hub (MCH)
February 2008
Document Number: 307504-004
Contents
Introduction.....................................................................................................7
Thermal Metrology..........................................................................................15
Mechanical Drawings.......................................................................................27
Thermal and Mechanical Design Guidelines
3
Figures
Figure 1. (G)MCH Non-Grid Array......................................................................12
Figure 3. 0° Angle Attach Heatsink Modifications (generic heatsink side and bottom
view shown, not to scale)...........................................................................16
Figure 5. Processor Heatsink Orientation to Provide Airflow to (G)MCH Heatsink on an
ATX Platform............................................................................................20
Figure 6. Processor Heatsink Orientation to Provide Airflow to (G)MCH Heatsink on a
Figure 9. (G)MCH Package Drawing ...................................................................28
Figure 11. (G)MCH Component Keep-Out Restrictions for Balanced Technology
Extended (BTX) Platforms ..........................................................................30
Figure 18. (G)MCH Reference Heatsink for Balanced Technology Extended (BTX)
Platforms.................................................................................................37
Figure 19. (G)MCH Reference Heatsink for Balanced Technology Extended (BTX)
Platforms – Clip........................................................................................38
Figure 20. (G)MCH Reference Heatsink for Balanced Technology Extended (BTX)
Platforms – Heatsink Assembly ...................................................................39
Tables
Table 1. (G)MCH Loading Specifications..............................................................12
Table 6. (G)MCH Balanced Technology Extended (BTX) Intel Reference Heatsink
Enabled Suppliers .....................................................................................26
4
Thermal and Mechanical Design Guidelines
Revision History
Revision
Number
Description
Date
-001
-002
-003
• Initial Release
May 2005
• Added Intel® 82945PL specifications
October 2005
• Added Intel® 82945GZ specifications
December
2005
-004
• Added Intel® 82945GC specifications
February 2008
§
Thermal and Mechanical Design Guidelines
5
6
Thermal and Mechanical Design Guidelines
Introduction
1 Introduction
As the complexity of computer systems increases, so do power dissipation
requirements. The additional power of next generation systems must be properly
dissipated. Heat can be dissipated using improved system cooling, selective use of
ducting, and/or active/passive heatsinks.
The objective of thermal management is to ensure that the temperatures of all
components in a system are maintained within functional limits. The functional
temperature limit is the range within which the electrical circuits can be expected to
meet specified performance requirements. Operation outside the functional limit can
degrade system performance, cause logic errors, or cause component and/or system
damage. Temperatures exceeding the maximum operating limits may result in
irreversible changes in the operating characteristics of the component. The goal of this
document is to provide an understanding of the operating limits of the Intel®
82945G/82945GZ/82945GC Graphics and Memory Controller Hub (GMCH) and Intel®
82945P/82945PL Memory Controller Hub (MCH), and discuss a reference thermal
solution.
The simplest and most cost-effective method to improve the inherent system cooling
characteristics of the (G)MCH is through careful design and placement of fans, vents,
and ducts. When additional cooling is required, component thermal solutions may be
implemented in conjunction with system thermal solutions. The size of the fan or
heatsink can be varied to balance size and space constraints with acoustic noise.
This document presents the conditions and requirements to properly design a cooling
solution for systems that implement the 82945G/82945GZ/82945GC GMCH or
82945P/82945PL MCH. Properly designed solutions provide adequate cooling to
maintain the (G)MCH case temperature at or below thermal specifications. This is
accomplished by providing a low local-ambient temperature, ensuring adequate local
airflow, and minimizing the case to local-ambient thermal resistance. By maintaining
the (G)MCH case temperature at or below those recommended in this document, a
system designer can ensure the proper functionality, performance, and reliability of
these components.
Note: Unless otherwise specified, the information in this document applies to the Intel®
82945G/82945GZ/82945GC Graphics and Memory Controller Hub (GMCH) and the
Intel® 82945P/82945PL Memory Controller Hub (MCH). The term (G)MCH refers to the
82945G GMCH, 82945GZ GMCH, 82945GC GMCH, 82945P MCH, and 82945PL MCH.
Note: Unless otherwise specified, ICH7 refers to the Intel® 82801GB ICH7 and 82801GR
ICH7R I/O Controller Hub 7 components.
Thermal and Mechanical Design Guidelines
7
Introduction
1.1
Terminology
Term
Description
BGA
Ball Grid Array. A package type defined by a resin-fiber substrate where a die is
mounted and bonded. The primary electrical interface is an array of solder balls
attached to the substrate opposite the die and molding compound.
FC-BGA
Flip Chip Ball Grid Array. A package type defined by a plastic substrate where a
die is mounted using an underfill C4 (Controlled Collapse Chip Connection)
attach style. The primary electrical interface is an array of solder balls attached
to the substrate opposite the die. Note that the device arrives at the customer
with solder balls attached.
Intel® ICH7
GMCH
MCH
Intel® I/O Controller Hub 7. The chipset component that contains the primary
PCI interface, LPC interface, USB, ATA, and/or other legacy functions.
Graphic Memory Controller Hub. The chipset component that contains the
processor and memory interface and integrated graphics device.
Memory Controller Hub. The chipset component that contains the processor
and memory interface. It does not contain an integrated graphics device.
TA
The measured ambient temperature locally to the component of interest. The
ambient temperature should be measured just upstream of airflow for a
passive heatsink or at the fan inlet for an active heatsink.
TC
The measured case temperature of a component. For processors, TC is
measured at the geometric center of the integrated heat spreader (IHS). For
other component types, it is generally measured at the geometric center of the
die or case.
TC-MAX
TC-MIN
TDP
The maximum case/die temperature with an attached heatsink. This
temperature is measured at the geometric center of the top of the package
case/die.
The minimum case/die temperature with an attached heatsink. This
temperature is measured at the geometric center of the top of the package
case/die.
Thermal Design Power. TDP is specified as the highest sustainable power level
of most or all of the real applications expected to be run on the given product,
based on extrapolations in both hardware and software technology over the life
of the component. Thermal solutions should be designed to dissipate this target
power level.
TIM
Thermal Interface Material. TIM is the thermally conductive material installed
between two surfaces to improve heat transfer and reduce interface contact
resistance.
lfm
Linear Feet per Minute. Unit of airflow speed.
ΨCA
Case-to-ambient thermal characterization parameter (Psi). This is a measure of
thermal solution performance using total package power. It is defined as (TC –
TA) / Total Package Power. Heat source size should always be specified for Ψ
measurements.
8
Thermal and Mechanical Design Guidelines
Introduction
1.2
Reference Documents
Document
Comments
Intel® 945G/945GZ/945P/945PL Express Chipset Family
Datasheet
Intel® I/O Controller Hub 7 (ICH7) Datasheet
Intel® I/O Controller Hub 7 (ICH7) Thermal Design Guidelines
Intel® Pentium® 4 Processor Extreme Edition Datasheet
Intel® Pentium®4 Processors 570/571, 560/561,
550/551,540/541, 530/531 and 520/521 Supporting Hyper-
Threading Technology Datasheet
Intel® Pentium® D Processor 840, 830 and 820 Datasheet
Intel® Pentium® 4 Processor on 90 nm Process in the 775–
Land LGA Package Thermal and Mechanical Design Guidelines
Intel® Pentium® D® Processor and Intel® Pentium® Processor
LGA775 Socket Mechanical Design Guide
Various System Thermal Design Suggestions
§
Thermal and Mechanical Design Guidelines
9
Introduction
10
Thermal and Mechanical Design Guidelines
Product Specifications
2 Product Specifications
This chapter provides the package description and loading specifications. The chapter
also provides component thermal specifications and thermal design power descriptions
for the (G)MCH.
2.1
Package Description
The (G)MCH is available in a 34 mm [1.34 in] x 34 mm [1.34 in] Flip Chip Ball Grid
Array (FC-BGA) package with 1202 solder balls. The die size is currently 9.6 mm
[0.378in] x 10.6 mm [0.417in]. A mechanical drawing of the package is shown in
2.1.1
Non-Grid Array Package Ball Placement
The (G)MCH package uses a “balls anywhere” concept. The minimum ball pitch is
0.8 mm [0.031 in], but ball ordering does not follow a 0.8-mm grid. Board designers
should ensure correct ball placement when designing for the non-grid array pattern.
For exact ball locations relative to the package, contact your Field Sales
Representative.
Thermal and Mechanical Design Guidelines
11
Product Specifications
Figure 1. (G)MCH Non-Grid Array
2.2
Package Loading Specifications
Table 1 provides static load specifications for the chipset package. This mechanical
maximum load limit should not be exceeded during heatsink assembly, shipping
conditions, or standard use conditions. Also, any mechanical system or component
testing should not exceed the maximum limit. The chipset package substrate should
not be used as a mechanical reference or load-bearing surface for the thermal and
mechanical solution.
Table 1. (G)MCH Loading Specifications
Parameter
Static
Maximum
15 lbf
Notes
1,2,3
NOTES:
1. These specifications apply to uniform compressive loading in a direction normal to the
(G)MCH package.
2. This is the maximum force that can be applied by a heatsink retention clip. The clip must
also provide the minimum specified load on the (G)MCH package.
3. These specifications are based on limited testing for design characterization. Loading limits
are for the package only.
12
Thermal and Mechanical Design Guidelines
Product Specifications
2.3
Thermal Specifications
To ensure proper operation and reliability of the (G)MCH, the temperature must be at
thermal enhancements are required to dissipate the heat generated and maintain the
case temperature measurements.
The (G)MCH must also operate above the minimum case temperature specification
listed in Table 2.
Table 2. (G)MCH Case Temperature Specifications
Parameter
Value
82945G/82945GZ/82945GC GMCH: 99 °C
82945P/82945PL MCH : 103°C
0 °C
TC-MAX
TC-MIN
NOTE: Thermal specifications assume an attached heatsink is present.
2.4
Thermal Design Power (TDP)
Thermal design power (TDP) is the estimated power dissipation of the (G)MCH based
on normal operating conditions including VCC and TC-MAX while executing real worst-
case power intensive applications. This value is based on expected worst-case data
traffic patterns and usage of the (G)MCH and does not represent a specific software
application. TDP attempts to account for expected increases in power due to variation
in (G)MCH current consumption due to silicon process variation, processor speed,
DRAM capacitive bus loading and temperature. However, since these variations are
subject to change, the TDP cannot ensure that all applications will not exceed the TDP
value.
The system designer must design a thermal solution for the (G)MCH such that it
maintains TC below TC-MAX for a sustained power level equal to TDP. Note that the TC-
specification is a requirement for a sustained power level equal to TDP, and that
MAX
the case temperature must be maintained at temperatures less than TC-MAX when
operating at power levels less than TDP. This temperature compliance is to ensure
(G)MCH reliability over its useful life. The TDP value can be used for thermal design if
the (G)MCH thermal protection mechanisms are enabled. Intel chipsets incorporate a
hardware-based fail-safe mechanism to help keep the product temperature within
specifications in the event of unusually strenuous usage above the TDP power limit.
Thermal and Mechanical Design Guidelines
13
Product Specifications
2.4.1
Methodology
Pre-Silicon
2.4.1.1
To determine TDP for pre-silicon products in development, it is necessary to make
estimates based on analytical models. These models rely on extensive knowledge of
the past chipset power dissipation behavior along with knowledge of planned
architectural and process changes that may affect TDP. Knowledge of applications
available today and their ability to stress various components of the chipset is also
included in the model. Since the number of applications available today is beyond
what Intel can test, only real world high-power applications are tested to predict TDP.
The values determined are used to set specific data transfer rates. The projection for
TDP assumes (G)MCH operation at TC-MAX. The TDP estimate also includes a margin to
account for process variation.
2.4.1.2
2.4.2
Post-Silicon
Once the product silicon is available, post-silicon validation is performed to assess the
validity of pre-silicon projections. Testing is performed on both commercially available
and synthetic high power applications and power data is compared to pre-silicon
estimates. Post-silicon validation may result in a small adjustment to pre-silicon TDP
estimates.
Application Power
Designing to the TDP can ensure that a particular thermal solution meets the cooling
needs of future applications. Testing with currently available commercial applications
has shown that the components may dissipate power levels below the published TDP
design to the published TDP specification to develop a robust thermal solution that will
meet the needs of current and future applications.
2.4.3
Specifications
The (G)MCH is estimated to dissipate the Thermal Design Power values provided in
Table 3 when using two DIMMs of 667 MHz (553 MHz for the 82945PL/82945GZ) dual
channel DDR2 with a 1066 MHz (800 MHz for the 82945PL/82945GZ/82945GC)
processor system bus speed. For the 82945G/82945GZ/82945GC GMCH, the graphics
core is assumed to run at 400 MHz. FC-BGA packages have limited heat transfer
capability into the board and have minimal thermal capability without thermal
solutions. Intel requires that system designers plan for an attached heatsink when
using the (G)MCH.
Table 3. (G)MCH Thermal Design Power Specifications
Component
System Bus Speed
Memory Frequency
TDP Value
1066 MHz
800 MHz
800 MHz
1066 MHz
800 MHz
§
667 MHz
533 MHz
667 MHz
667 MHz
533 MHz
82945G GMCH
82945GZ GMCH
82945GC GMCH
82945P MCH
22.2 W
22.2 W
22.2 W
15.2 W
15.2 W
82945PL MCH
14
Thermal and Mechanical Design Guidelines
Thermal Metrology
3 Thermal Metrology
The system designer must measure temperatures to accurately determine the thermal
performance of the system. Intel has established guidelines for proper techniques of
measuring (G)MCH component case temperatures.
3.1
Case Temperature Measurements
To ensure functionality and reliability, the (G)MCH is specified for proper operation
surface temperature at the geometric center of the die corresponds to TC. Measuring
TC requires special care to ensure an accurate temperature reading.
Temperature differences between the temperature of a surface and the surrounding
local ambient air can introduce error in the measurements. The measurement errors
could be due to a poor thermal contact between the thermocouple junction and the
surface of the package, heat loss by radiation and/or convection, conduction through
thermocouple leads, or contact between the thermocouple cement and the heatsink
base (if a heatsink is used). To minimize these measurement errors a thermocouple
attach with a zero-degree methodology is recommended.
3.1.1
Thermocouple Attach Methodology
1. Mill a 3.3 mm [0.13 in] diameter hole centered on bottom of the heatsink base.
The milled hole should be approximately 1.5 mm [0.06 in] deep.
2. Mill a 1.3 mm [0.05 in] wide slot, 0.5 mm [0.02 in] deep, from the centered hole
to one edge of the heatsink. The slot should be in the direction parallel to the
heatsink fins (see Figure 3).
3. Attach thermal interface material (TIM) to the bottom of the heatsink base.
4. Cut out portions of the TIM to make room for the thermocouple wire and bead.
The cutouts should match the slot and hole milled into the heatsink base.
5. Attach a 36 gauge or smaller calibrated K-type thermocouple bead or junction to
the center of the top surface of the die using a high thermal conductivity cement.
During this step, make sure no contact is present between the thermocouple
cement and the heatsink base because any contact will affect the thermocouple
reading. It is critical that the thermocouple bead makes contact with the
6. Attach heatsink assembly to the (G)MCH and route thermocouple wires out
through the milled slot.
Thermal and Mechanical Design Guidelines
15
Thermal Metrology
Figure 2. 0° Angle Attach Methodology (top view, not to scale)
Figure 3. 0° Angle Attach Heatsink Modifications (generic heatsink side and bottom
view shown, not to scale)
3.2
Airflow Characterization
Figure 4 describes the recommended location for air temperature measurements
measured relative to the component. For a more accurate measurement of the
average approach air temperature, Intel recommends averaging temperatures
recorded from two thermocouples spaced about 25 mm [1.0 in] apart. Locations for
both a single thermocouple and a pair of thermocouples are presented.
16
Thermal and Mechanical Design Guidelines
Thermal Metrology
Figure 4. Airflow Temperature Measurement Locations
Airflow velocity should be measured using industry standard air velocity sensors.
Typical airflow sensor technology may include hot wire anemometers. Figure 4
provides guidance for airflow velocity measurement locations. These locations are for
a typical JEDEC test setup and may not be compatible with chassis layouts due to the
proximity of the processor to the (G)MCH. The user may have to adjust the locations
for a specific chassis. Be aware that sensors may need to be aligned perpendicular to
the airflow velocity vector or an inaccurate measurement may result. Measurements
should be taken with the chassis fully sealed in its operational configuration to achieve
a representative airflow profile within the chassis.
§
Thermal and Mechanical Design Guidelines
17
Thermal Metrology
18
Thermal and Mechanical Design Guidelines
Reference Thermal Solution
4 Reference Thermal Solution
The reference component thermal solution for the (G)MCH for ATX platforms uses two
ramp retainers, a wire preload clip, and four custom MB anchors. The Intel Balanced
Technology Extended (BTX) reference design uses a Z-clip attach for the (G)MCH
heatsink. This chapter provides detailed information on operating environment
assumptions, heatsink manufacturing, and mechanical reliability requirements for the
(G)MCH.
4.1
Operating Environment
The operating environment of the (G)MCH will differ depending on system
configuration and motherboard layout. This section defines operating environment
boundary conditions that are typical for ATX and BTX form factors. The system
designer should perform analysis on the platform operating environment to assess any
impact to thermal solution selection.
4.1.1
ATX Form Factor Operating Environment
In ATX platforms, an airflow speed of 0.76 m/s [150 lfm] is assumed to be present
25 mm [1 in] in front of the heatsink air inlet side of the attached reference thermal
solution. The system integrator should note that board layout may be such that there
will not be 25mm [1in] between the processor heatsink and the (G)MCH. The potential
for increased airflow speeds may be realized by ensuring that airflow from the
processor heatsink fan exhausts in the direction of the (G)MCH heatsink. This can be
achieved by using a heatsink providing omni directional airflow, such as a radial fin or
“X” pattern heatsink. Such heatsinks can deliver airflow to both the (G)MCH and other
placement should ensure that the (G)MCH heatsink is within the air exhaust area of
the processor heatsink.
Note that heatsink orientation alone does not ensure that 0.76 m/s [150 lfm]
airflow speed will be achieved. The system integrator should use analytical or
experimental means to determine whether a system design provides adequate airflow
speed for a particular (G)MCH heatsink.
The local ambient air temperature, TA, at the (G)MCH heatsink in an ATX platform is
assumed to be 47 °C. The thermal designer must carefully select the location to
measure airflow to get a representative sampling. These environmental assumptions
are based on a 35 °C system external temperature measured at sea level.
Thermal and Mechanical Design Guidelines
19
Reference Thermal Solution
Figure 5. Processor Heatsink Orientation to Provide Airflow to (G)MCH Heatsink on an
ATX Platform
Airflow Direction
Airflow Direction
(G)MCH Heatsink
Omi Directional Flow
Processor Heatsink
(Fan Not Shown)
TOP VIEW
Proc_HS_Orient_ATX
Other methods exist for providing airflow to the (G)MCH heatsink, including the use of
system fans and/or ducting, or the use of an attached fan (active heatsink).
4.1.2
Balanced Technology Extended (BTX) Form Factor
Operating Environment
The operating environment for the (G)MCH in typical BTX systems has not been
profiled. This section provides operating environment conditions based on what has
been exhibited on the Intel micro-BTX reference design. On a BTX platform, the
(G)MCH obtains in-line airflow directly from the processor thermal module. Since the
processor thermal module provides lower inlet temperature airflow to the processor,
reduced inlet ambient temperatures are also often seen at the (G)MCH as compared to
ATX. An example of how airflow is delivered to the (G)MCH on a BTX platform is
shown in Figure 6.
The local ambient air temperature, TA, at the (G)MCH heatsink in the Intel micro-BTX
reference design is predicted to be ~45 °C. The thermal designer must carefully select
the location to measure airflow to get a representative sampling. These environmental
assumptions are based on a 35 °C system external temperature measured at sea
level.
Note: The local ambient air temperature is a projection based on anticipated power
increases on a 2005 platform and may be subject to change in future revisions of this
document.
20
Thermal and Mechanical Design Guidelines
Reference Thermal Solution
Figure 6. Processor Heatsink Orientation to Provide Airflow to (G)MCH Heatsink on a
Balanced Technology Extended (BTX) Platform
Balanced Technology
Extended (BTX) Thermal
Module Assembly Over
Airflow Direction
Processor
(G)MCH
Top View
Proc_HS_Orient
4.2
4.3
Mechanical Design Envelope
The motherboard component keep-out restrictions for the (G)MCH on an ATX platform
restrictions for the (G)MCH on a BTX platform are included in Figure 11.
System integrators should ensure no board or chassis components would intrude into
the volume occupied by the (G)MCH thermal solution.
Thermal Solution Assembly
The reference thermal solution for the (G)MCH for an ATX platform is shown in
retainers, a wire preload clip, and four custom motherboard anchors. The heatsink is
attached to the motherboard by assembling the anchors into the board, placing the
heatsink over the (G)MCH and anchors at each of the corners, and securing the plastic
ramp retainers through the anchor loops before snapping each retainer into the fin
gap. The assembly is then sent through the wave process. Post wave, the wire preload
clip is assembled using the hooks on each of the ramp retainers. The clip provides the
mechanical preload to the package. A thermal interface material (Chomerics* T710) is
pre-applied to the heatsink bottom over an area that contacts the package die.
The reference thermal solution for the (G)MCH for a BTX platform is shown in
Figure 8. The heatsink is aluminum extruded and uses a Z-clip for attach. The clip is
secured to the system motherboard via two solder-down anchors around the (G)MCH.
The clip helps to provide a mechanical preload to the package via the heatsink. A
thermal interface material (Chomerics* T710) is pre-applied to the heatsink bottom
over an area in contact with the package die.
The ATX reference thermal solution differs from the BTX reference solution because a
BTX platform requires a Support and Retention Mechanism (SRM) that helps to meet
the mechanical requirements listed in Table 4.
Thermal and Mechanical Design Guidelines
21
Reference Thermal Solution
4.4
Environmental Reliability Requirements
The environmental reliability requirements for the reference thermal solution are
plans should be defined by the user based on anticipated use conditions and resulting
reliability requirements.
Table 4. Reference Thermal Solution Environmental Reliability Requirements
Test1
Requirement
Pass/Fail
Criteria2
Mechanical
Shock
• 3 drops for + and - directions in each of 3
perpendicular axes (i.e., total 18 drops).
Visual\Electrical
Check
• Profile: 50 G trapezoidal waveform, 11 ms duration,
4.3 m/s [170 in/s] minimum velocity change.
• Setup: Mount sample board on test fixture. Include
550 g processor heatsink.
Random
Vibration
• Duration: 10 min/axis, 3 axes
Visual/Electrical
Check
• Frequency Range: 5 Hz to 500 Hz
• Power Spectral Density (PSD) Profile: 3.13 g RMS
• -40 °C to +85 °C, 900 cycles
Thermal
Cycling
Thermal
Performance
Unbiased
Humidity
• 85 % relative humidity / 55 °C, 500 hours
Visual Check
NOTES:
1. The above tests should be performed on a sample size of at least 12 assemblies from 3
different lots of material.
2. Additional Pass/Fail Criteria may be added at the discretion of the user.
§
24
Thermal and Mechanical Design Guidelines
Enabled Suppliers
Appendix AEnabled Suppliers
Current suppliers for the Intel® 945G/945GZ/945GC/945P/945PL Express chipset
Table 5. (G)MCH ATX Intel Reference Heatsink Enabled Suppliers
Supplier
Intel Part
Number
Vendor Part
Number
Contact Information
C85366-001
(heatsink)
00C863501A
334C863501A
334C863502A
Monica Chih - +886 (-2) -
29952666
C85370-001
(ramp
retainer)
CCI (Chaun Choung
Technology Corp)
Harry Lin - (714) 739-5797
C85373-001
(wire clip)
C85376-001
(anchor)
G2100C888-143
Rick Lin - +886 (-2) -
26471896 ext.6342
WiesonElectronic Co.
C85366-001
(heatsink)
Jack Chen – (714) 626-1233
2Z802-016
C85370-001
(ramp
retainer)
3EE77-002
3KS02-066
Foxconn/HonHai
Precision
C85373-001
(wire clip)
C85376-001
(anchor)
2Z802-015
Jack Chen – (714) 626-1233
Foxconn/HonHai
Precision
Note: These vendors and devices are listed by Intel as a convenience to Intel's general
customer base, but Intel does not make any representations or warranties whatsoever
regarding quality, availability, reliability, functionality, or compatibility of these
devices. This list and/or these devices may be subject to change without notice.
Thermal and Mechanical Design Guidelines
25
Enabled Suppliers
Table 6. (G)MCH Balanced Technology Extended (BTX) Intel Reference Heatsink
Enabled Suppliers
Supplier
Intel Part
Number
Vendor Part
Number
Contact Information
C57359-001
00C863401A
Monica Chih - +886 (-2) -
29952666
CCI (Chaun
Choung
Technology
Corp.)
Harry Lin - (714) 739-5797
C57359-001
C57359-001
S909700001
2Z802-010
David Chao - +886 (-2) -2299-
6930 x619
AVC (Asia Vital
Components)
Jack Chen – (714) 626-1233
Foxconn/HonHai
Precision
§
26
Thermal and Mechanical Design Guidelines
Mechanical Drawings
Appendix BMechanical Drawings
The following table lists the mechanical drawings available in this document.
Drawing Name
Page
Number
NOTE: Unless otherwise specified, all figures in this appendix are dimensioned in millimeters.
Dimensions shown in brackets are in inches.
Thermal and Mechanical Design Guidelines
27
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