Philips TDA1519 User Manual

INTEGRATED CIRCUITS  
DATA SHEET  
TDA1519  
2 x 6 W stereo car radio power  
amplifier  
May 1992  
Product specification  
File under Integrated Circuits, IC01  
Philips Semiconductors  
Product specification  
2 x 6 W stereo car radio power amplifier  
TDA1519  
Fig.1 Block diagram.  
May 1992  
3
Philips Semiconductors  
Product specification  
2 x 6 W stereo car radio power amplifier  
TDA1519  
PINNING  
1
2
3
4
5
6
7
8
9
INV1  
non-inverting input 1  
ground (signal)  
GND1  
SVRR  
OUT1  
GND2  
OUT2  
supply voltage ripple rejection  
output 1  
ground (substrate)  
output 2  
V
supply voltage  
P
M/SS  
mute/stand-by switch  
non-inverting input 2  
INV2  
FUNCTIONAL DESCRIPTION  
The TDA1519 contains two identical amplifiers with differential input stages. The gain of each amplifier is fixed at 40 dB.  
A special feature of this device is the mute/stand-by switch which has the following features:  
low stand-by current (< 100 µA)  
low mute/stand-by switching current (low cost supply switch)  
mute condition.  
RATINGS  
Limiting values in accordance with the Absolute Maximum System (IEC 134)  
PARAMETER  
Supply voltage  
CONDITIONS  
SYMBOL  
MIN.  
MAX.  
UNIT  
operating  
V
18  
30  
V
V
P
P
non-operating  
load dump protected  
V
during 50 ms;  
t 2,5 ms  
V
V
V
45  
18  
6
V
r
P
AC and DC short-circuit-safe voltage  
Reverse polarity  
V
PSC  
PR  
V
Energy handling capability at outputs  
Non-repetitive peak output current  
Repetitive peak output current  
Total power dissipation  
V = 0 V  
200  
4
mJ  
A
P
I
OSM  
ORM  
I
2,5  
15  
A
see Fig.2  
P
T
W
°C  
°C  
tot  
Crystal temperature  
150  
+ 150  
c
Storage temperature range  
T
55  
stg  
May 1992  
4
Philips Semiconductors  
Product specification  
2 x 6 W stereo car radio power amplifier  
TDA1519  
Fig.2 Power derating curve.  
DC CHARACTERISTICS (note 1)  
V = 14,4 V; T = 25 °C; unless otherwise specified  
P
amb  
PARAMETER  
CONDITIONS  
SYMBOL  
MIN.  
TYP.  
MAX.  
UNIT  
Supply  
Supply voltage range  
Quiescent current  
DC output voltage  
note 2  
V
6,0  
14,4  
18,0  
V
P
I
40  
80  
mA  
V
P
note 3  
V
6,95  
O
Mute/stand-by switch  
Switch-on voltage level  
Mute condition  
see Fig.3  
V
V
8,5  
3,3  
V
V
ON  
6,4  
mute  
Output signal in mute position  
V = 1 V (max.);  
I
f = 20 Hz to  
15 kHz  
V
V
I
0
20  
2
mV  
V
O
Stand-by condition  
sb  
DC current in stand-by condition  
Switch-on current  
100  
40  
µA  
µA  
sb  
I
12  
sw  
May 1992  
5
Philips Semiconductors  
Product specification  
2 x 6 W stereo car radio power amplifier  
TDA1519  
AC CHARACTERISTICS (note 1)  
V = 14,4 V; R = 4 ; f = 1 kHz; T  
= 25 °C; unless otherwise specified  
P
L
amb  
PARAMETER  
CONDITIONS  
note 4;  
SYMBOL  
MIN.  
TYP.  
MAX.  
UNIT  
Output power  
THD = 0,5%  
THD = 10%  
P
4
5
W
W
%
o
o
P
5,5  
6,0  
0,1  
Total harmonic distortion  
Low frequency roll-off  
P = 1 W  
THD  
o
note 5;  
3 dB  
1 dB  
f
45  
Hz  
L
High frequency roll-off  
f
20  
39  
kHz  
dB  
H
Closed loop voltage gain  
G
40  
41  
v
Supply voltage ripple rejection  
note 6  
ON  
f = 100 Hz  
SVRR  
40  
48  
48  
80  
50  
dB  
dB  
dB  
dB  
kΩ  
ON  
f = 10 Hz to 10 kHz SVRR  
mute  
SVRR  
SVRR  
stand-by  
Input impedance  
Noise output voltage  
ON  
|Z |  
60  
75  
i
note 7;  
R = 0 Ω  
V
V
V
α
150  
250  
120  
µV  
µV  
µV  
dB  
dB  
S
no(rms)  
no(rms)  
no(rms)  
ON  
R = 10 kΩ  
500  
S
mute  
note 8  
Channel separation  
Channel balance  
R = 10 kΩ  
40  
S
|G |  
0,1  
1
v
Notes to the characteristics  
1. All characteristics are measured using the circuit shown in Fig.4.  
2. The circuit is DC adjusted at V = 6 V to 18 V and AC operating at V = 8,5 V to 18 V.  
P
P
3. At 18 V < V < 30 V the DC output voltage V /2.  
P
P
4. Output power is measured directly at the output pins of the IC.  
5. Frequency response externally fixed.  
6. Ripple rejection measured at the output with a source impedance of 0 (maximum ripple amplitude of 2 V) and a  
frequency between 100 Hz and 10 kHz.  
7. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz.  
8. Noise output voltage independent of R (V = 0 V).  
S
I
May 1992  
6
Philips Semiconductors  
Product specification  
2 x 6 W stereo car radio power amplifier  
TDA1519  
Fig.3 Stand-by, mute and ON conditions.  
May 1992  
7
Philips Semiconductors  
Product specification  
2 x 6 W stereo car radio power amplifier  
TDA1519  
APPLICATION INFORMATION  
Fig.4 Application circuit diagram.  
May 1992  
8
Philips Semiconductors  
Product specification  
2 x 6 W stereo car radio power amplifier  
TDA1519  
PACKAGE OUTLINE  
SIL9MPF: plastic single in-line medium power package with fin; 9 leads  
SOT110-1  
D
D
1
q
A
2
P
P
1
A
3
q
2
q
1
A
A
4
E
pin 1 index  
c
L
1
9
b
Q
e
Z
b
w
M
2
b
1
0
5
10 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
(1)  
Z
max.  
A
max.  
2
(1)  
(1)  
E
UNIT  
A
A
b
b
b
c
D
D
e
L
P
P
Q
q
q
q
2
w
A
3
4
1
2
1
1
1
18.5  
17.8  
8.7 15.8 1.40 0.67 1.40 0.48 21.8 21.4 6.48  
8.0 15.4 1.14 0.50 1.14 0.38 21.4 20.7 6.20  
3.9 2.75 3.4 1.75 15.1  
3.4 2.50 3.2 1.55 14.9  
4.4  
4.2  
5.9  
5.7  
2.54  
mm  
3.7  
0.25 1.0  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
92-11-17  
95-02-25  
SOT110-1  
May 1992  
9
Philips Semiconductors  
Product specification  
2 x 6 W stereo car radio power amplifier  
TDA1519  
The device may be mounted up to the seating plane, but  
the temperature of the plastic body must not exceed the  
SOLDERING  
Introduction  
specified maximum storage temperature (T  
). If the  
stg max  
printed-circuit board has been pre-heated, forced cooling  
may be necessary immediately after soldering to keep the  
temperature within the permissible limit.  
There is no soldering method that is ideal for all IC  
packages. Wave soldering is often preferred when  
through-hole and surface mounted components are mixed  
on one printed-circuit board. However, wave soldering is  
not always suitable for surface mounted ICs, or for  
printed-circuits with high population densities. In these  
situations reflow soldering is often used.  
Repairing soldered joints  
Apply a low voltage soldering iron (less than 24 V) to the  
lead(s) of the package, below the seating plane or not  
more than 2 mm above it. If the temperature of the  
soldering iron bit is less than 300 °C it may remain in  
contact for up to 10 seconds. If the bit temperature is  
between 300 and 400 °C, contact may be up to 5 seconds.  
This text gives a very brief insight to a complex technology.  
A more in-depth account of soldering ICs can be found in  
our “IC Package Databook” (order code 9398 652 90011).  
Soldering by dipping or by wave  
The maximum permissible temperature of the solder is  
260 °C; solder at this temperature must not be in contact  
with the joint for more than 5 seconds. The total contact  
time of successive solder waves must not exceed  
5 seconds.  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
May 1992  
10  

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