Texas Instruments Network Card UCC2891 User Manual

48-V to 3.3-V Forward Converter with  
Active Clamp Reset Using the  
UCC2891 Active Clamp Current Mode  
PWM Controller  
User's Guide  
December 2006  
Power Supply MAN  
SLUU178A  
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User's Guide  
SLUU178ANovember 2003Revised December 2006  
Using the UCC2891 Active Clamp Current Mode PWM  
Controller  
1
Introduction  
The UCC2891EVM evaluation module (EVM) is a forward converter providing a 3.3-V regulated output at  
30 A of load current, operating from a 48-V input. The EVM operates over the full 36 V to 72 V telecom  
input range, and is able to fully regulate down to zero load current. The module uses the UCC2891 current  
mode active clamp PWM controller for effectively demonstrating the active clamp transformer reset  
technique.  
Benefits of the active clamp include a control driven transformer reset scheme allowing zero voltage  
switching (ZVS) to increase overall efficiency, lower drain-to-source voltage stress, extended duty cycle  
beyond 50% and reduced electromagnetic radiated emissions. Combined with synchronous rectification,  
this EVM is configured to operate at 300 kHz and exhibits a peak efficiency of just over 92%, with a full  
load efficiency of 89%. The EVM displays many features that might be typical of a more complex design,  
yet its compact board layout and low component count make it elegantly simple.  
2
Description  
The UCC2891 controller family provides advanced active clamp control features such as programmable  
maximum duty cycle clamp, programmable dead time between the two primary switches and the ability to  
drive either a P-channel, or N-channel MOSFET in either a high-side or low-side active clamp  
configuration. The UCC2891 also allows the ability to start-up directly from the 48-V telecom bus voltage,  
eliminating the need for external start-up circuitry. It includes programmable soft start, internal slope  
compensation for peak current mode control, internal low-line voltage sensing, internal syncronizable clock  
input, cycle-by-cycle current limiting, and a robust 2-A sink/source TrueDrive™ internal gate drive circuit.  
The result is a highly efficient design loaded with features, requiring very few external components.  
The TrueDrive™ hybrid output architecture used in the UCC2891 uses TI's unique TrueDrive™  
Bipolar/CMOS output. To the user, this simply means ultra-fast rise and fall times by providing the highest  
possible drive current where it is needed most, at the MOSFET Miller plateau region.  
The UCC2891/2/3/4 is available in either a 16-pin SOIC or 16-pin TSSOP package for applications where  
absolute minimal board space is required.  
The UCC2891EVM highlights the many benefits of using the UCC2891 active clamp current mode PWM  
controller. This user's guide provides the schematic, component list, assembly drawing, artwork and test  
set up necessary to evaluate the UCC2891 in a typical telecom application. More detailed design  
information can be found listed in the References section.  
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Description  
2.1 Applications  
The UCC2891 is suited for use in isolated telecom 48-V input systems requiring high-efficiency and  
high-power density for very low-output voltage, high-current converter applications, including:  
Server Systems  
Datacom  
Telecom  
DSP's, ASIC's, FPGA's  
2.2 Features  
The UCC2891EVM features include:  
ZVS transformer reset using active clamp technique in forward converter  
All surface mount components, double sided half brick (2.2 × 2.28 × 0.5) inches  
Complementary auxilliary drive for active clamp with programmable dead time for ZVS  
Current mode control with synchronization function  
Internal PWM slope compensation  
Start-up directly from telecom input voltage  
Synchronous rectifier output stage allows high-efficiency operation  
Programmable soft-start  
Up to 30-A dc output current  
Regulation to zero load current  
Non-latching, output overcurrent and short circuit protection  
Non-latching, Input undervoltage protection  
1500-V isolation primary to secondary  
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UCC2891EVM Electrical Performance Specifications  
3
UCC2891EVM Electrical Performance Specifications  
The UCC2891EVM electrical performance specifications are listed in Table 1.  
Table 1. UCC2891EVM Performance Summary  
PARAMETER  
Input Characteristics  
Input voltage range  
No load intput current  
Maximum input current  
Input voltage ripple  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
36  
48  
72  
V
mA  
A
VIN = 36 V, IOUT = 0 A  
75  
3.00  
1.50  
100  
3.25  
1.75  
VIN = 36 V, IOUT = 30 A  
VIN = 72 V, IOUT = 30 A  
VP-P  
Input voltage ripple  
Output voltage  
36 V VIN 72 V, 0 A IOUT 30 A  
Line regulation (36 V VIN 72 V, IOUT = 0 A)  
Load regulation (0 A IOUT 30 A, VIN = 48 V)  
VIN = 48 V, IOUT = 30 A  
3.25  
3.30  
0.003%  
0.060%  
30  
3.35  
V
Output voltage regulation  
Output voltage ripple  
Output load current  
Output current limit  
Output current limit  
Switching frequency  
Control loop bandwidth  
Control loop bandwidth  
Peak efficiency  
35 mVP-P  
VIN = 48 V, IOUT = 30 A  
0
30  
A
36 V VIN72 V  
32  
275  
5
325  
kHz  
36 V VIN 72 V, IOUT = 10 A  
8
36 V VIN 72 V, 2 A IOUT 30 A  
30  
50  
°C  
92%  
89%  
Full load efficiency  
VIN = 48 V, IOUT = 30 A  
4
Schematic  
A schematic of the UCC2891EVM is shown in Figure 1. Terminal block J1 is the 48-V input voltage source  
connector and J8 is the output and return for the 3.3-V output voltage.  
On the primary side, U1 is the UCC2891 shown with the necessary discrete circuitry for configuring the  
controller to operate at 300 kHz with the maximum duty clamp set for 0.65. The EVM is programmed to  
start at VIN=36 V, as determined by R11 and R12. To minimize power dissipation in the current sense, a  
current sense transformer, T1 is used, as opposed to simply using a sense resistor between the source of  
Q2 and power ground. Q2 is the primary switching MOSFET and is selected based upon VDS and low  
RDS(on). Q1 is the AUX (active reset) MOSFET and is selected based upon preferred package only, with  
only minor consideration given for RDS(on) and Qg. Since the active clamp used in this design is low-side  
referenced, Q1 must be a P-channel type MOSFET. The reason for this is further explained in application  
note SLUA299[2]. C9 is the clamp capacitor used to maintain a constant dc voltage. The input voltage is  
subtracted from the clamp voltage to allow transformer reset during the active clamp period.  
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Schematic  
Figure 1. UCC2891EVM Schematic  
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EVM Test Setup  
High efficiency is achieved using self-driven synchronous rectification on the secondary side. Q3 and Q4  
are placed in parallel and make up the forward synchronous rectifier (SR), while the reverse SR is made  
up of the parallel combination of Q5, Q7 and Q8. If the duty cycle were limited to 50% then the reverse SR  
could be reduced to only two parallel MOSFETs, but since these devices are operating near 60% duty  
cycle during the freewheel mode, they carry a higher average current than seen by Q3 and Q4. The  
output inductor L1 has a coupled secondary, referenced to the primary side, used to provide bootstrapping  
voltage to U1. A stable bias for the optocoupler, U2 is provided by the series pass regulator made up of  
D6, Q6 and some associated filtering.  
Scope jacks J2 and J3 allow the user to measure the gate-to-source and drain-to-source signals for Q2,  
the primary MOSFET. J4 and J5 allow convenient access to the gate drive signals of each SR on the  
secondary side. J6 and J7 are available allowing the option of using a network analyzer to non-invasively  
measure the control to output loop gain and phase.  
5
EVM Test Setup  
Figure 2 shows the basic test set up recommended to evaluate the UCC2891EVM.  
V2  
-
+
+VOUT  
J10  
-Vout  
J9  
+Vout  
+VIN  
-VIN  
-
LOAD1  
J8  
+
+
3.3V/30A  
J1  
+
-
+
V1  
VIN  
V-Clamp  
-VOUT  
SR-QF Gate  
J4  
J3  
A1  
J5  
Q2 Gate  
J2  
SR-QR Gate  
J6 Loop+  
J7 Loop-  
Texas Instruments  
HPA034  
UCC2891 Active Clamp Converter  
DANGER HIGH VOLTAGE  
FAN  
Figure 2. Recommended EVM Test Configuration  
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EVM Test Setup  
5.1 Output Load (LOAD1)  
For the output load to VOUT, a programmable electronic load set to constant current mode and capable of  
sinking between 0ADC and 30ADC, is used. Using a dc voltmeter, V2, it is also advised to make all output  
voltage measurements directly at J9 and J10 pins. Unless the load has remote sense capability,  
measuring VOUT at LOAD1 results in some voltage measurement error, especially at higher load current,  
due to finite voltage drops across the wires between J8 and the electronic load.  
5.2 DC Input Source (VIN)  
The input voltage is a variable DC source capable of supplying between 0 VDC and 72 VDC at no less than  
3.5 ADC, and connected to J1 and A1 as shown in Figure 2. For fault protection to the EVM, good common  
practice is to limit the source current to no more than 4 ADC for a 36 V input. A dc ammeter, A1 should  
also be inserted between VIN and J1 as shown in Figure 2.  
5.3 Network Analyzer  
A network analyzer can be connected directly to J6 and J7. The UCC2891EVM provides a 51.1-resistor  
(R25) between the output and the voltage feedback to allow easy non-invasive measurement of the  
control to output loop response.  
5.4 Recommended Wire Guage  
The connection between the source voltage, VIN and J1 of the EVM can carry as much as 3.25ADC. The  
minimum recommended wire size is AWG #20 with the total length of wire less than 8 feet (4 feet input, 4  
feet return). The connection between J8 of the EVM and LOAD1 can carry as much as 30ADC. The  
minimum recommended wire size is AWG #16, with the total length of wire less than 8 feet (4 feet output,  
4 feet return).  
5.5 Fan  
Most power converters include components that can be hot to the touch when approaching temperatures  
of 605C. Because this EVM is not enclosed to allow probing of circuit nodes, a small fan capable of  
200-400 LFM is recommended to reduce component temperatures when operating at or above 50%  
maximum rated load current.  
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Power Up/Down Test Procedures  
6
Power Up/Down Test Procedures  
The following test procedure is recommended primarily for power up and shutting down the EVM.  
Whenever the EVM is running above an output load of 15 ADC, the fan should be turned on. Also, never  
walk away from a powered EVM for extended periods of time.  
1. Working at an ESD workstation, make sure that any wrist straps, bootstraps or mats are connected  
referencing the user to earth ground before power is applied to the EVM. Electrostatic smock and  
safety glasses should also be worn.  
2. Prior to connecting the DC input source, VIN, it is advisable to limit the source current from VIN to  
3.5-A maximum. Make sure VIN is initially set to 0 V and connected to J1 as shown in Figure 2.  
3. Connect the ammeter A1 (0A to10A range) between VIN and J1 as shown in Figure 2.  
4. Connect voltmeter (can optionally use voltmeter from VIN source if available), V1 across VIN as shown  
in Figure 2.  
5. Connect LOAD1 to J8 as shown in Figure 2. Set LOAD1 to constant current mode to sink 0 ADC before  
VIN is applied.  
6. Connect voltmeter, V2 across J9 and J10 as shown in Figure 2.  
7. Increase VIN from 0 V to 36 VDC  
.
8. Observe that VOUT is regulating when VIN is at 36 V.  
9. Increase VIN to 48 V.  
10. Increase LOAD1 from 0 A to 15 ADC  
.
11. Turn on fan making sure to blow air directly on the EVM.  
12. Increase LOAD1 from 15 ADC to 30 ADC  
.
13. Decrease LOAD1 to 0 A.  
14. Decrease VIN from 48 VDC to 0 V.  
15. Shut down VIN.  
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Power Up/Down Test Procedures  
7
Power Up/Down Test Procedures  
OVERALL EFFICIENCY  
vs  
OUTPUT CURRENT  
93  
V
= 48 V  
IN  
91  
89  
V
= 72 V  
IN  
V
= 36 V  
IN  
87  
85  
83  
81  
V
= 3.3 V  
OUT  
f
= 300 kHz  
S
79  
2
6
10  
I
14  
18  
22  
26  
- Output Current - A  
OUT  
Figure 3.  
POWER LOSS  
vs  
OUTPUT CURRENT  
GAIN AND PHASE  
vs  
FREQUENCY  
12  
10  
60  
40  
180  
120  
V
= 3.3 V  
OUT  
Phase  
f
= 300 kHz  
S
20  
60  
8
6
Gain  
0
0
-20  
-40  
-60  
-60  
-120  
V
= 72 V  
IN  
V
= 36 V  
IN  
I
= 10 A  
OUT  
V
= 48 V  
IN  
g
= -8 dB  
4
M
F
= 50°  
M
-180  
10  
100  
1 k  
10 k  
100 k  
V
= 36 V  
18  
IN  
2
f - Frequency - Hz  
2
6
10  
I
14  
22  
26  
30  
- Output Current - A  
OUT  
Figure 5.  
Figure 4.  
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Power Up/Down Test Procedures  
Input Ripple Voltage  
GAIN AND PHASE  
vs  
FREQUENCY  
60  
40  
180  
120  
V
= 36 V  
= 30 A  
IN  
I
OUT  
Phase  
500 mV/div  
1 V peak-to-peak  
20  
60  
0
0
Gain  
-20  
-60  
-120  
-180  
V
= 48 V  
IN  
I
= 10 A  
-40  
-60  
OUT  
g
= -10 dB  
M
F
= 50°  
M
10  
100  
1 k  
10 k  
100 k  
t − Time − 2.5 µs/div  
f - Frequency - Hz  
Figure 8.  
Figure 6.  
Output Ripple Voltage  
GAIN AND PHASE  
vs  
FREQUENCY  
V
= 72 V  
= 30 A  
IN  
60  
40  
180  
120  
I
OUT  
Phase  
50 mV/div  
36 mV peak-to-peak  
20  
60  
0
0
Gain  
-20  
-40  
-60  
-60  
-120  
-180  
V
= 72 V  
IN  
I
= 10 A  
OUT  
g
= -9 dB  
M
F
= 50°  
M
10  
100  
1 k  
10 k  
100 k  
t − Time − 2.5 µs/div  
f - Frequency - Hz  
Figure 9.  
Figure 7.  
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Power Up/Down Test Procedures  
Output Ripple Voltage  
SR Gate Drive  
V
IN  
= 36 V  
V
OUT  
= 36 V  
= 30 A  
IN  
I
6.3 V, QF Gate (J5)  
(5 V/div)  
50 mV/div  
23 mV peak-to-peak  
8.4 V, QR Gate (J6)  
(5 V/div)  
t − Time − 1 µs/div  
t − Time − 2.5 µs/div  
Figure 12.  
Figure 10.  
SR Gate Drive  
Transformer Primary  
V
IN  
= 48 V  
I
= 10 A  
OUT  
V
PRI  
(40 V/div)  
I
PRI  
(0.5 A/div)  
t − Time − 1 µs/div  
t − Time − 2.5 µs/div  
Figure 13.  
Figure 11.  
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EVM Assembly Drawing and Layout  
8
EVM Assembly Drawing and Layout  
Figure 14 through Figure 20 show the top-side and bottom-side component placement for the EVM, as  
well as device pin numbers where necessary. A four layer PCB was designed using the top and bottom  
layers for signal traces and component placement along with an internal ground plane. The PCB  
dimensions are 3.6" x 2.7" with a design goal of fitting all components within the industry standard  
half-brick format, as outlined by the box dimensions 2.28" x 2.20" shown in Figure 15. All components are  
standard OTS surface mount components placed on the both sides of the PCB. The copper-etch for each  
layer is also shown.  
Figure 14. Top Side Component Assembly  
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EVM Assembly Drawing and Layout  
Figure 15. Top Side Silk Screen  
Figure 16. Top Signal Trace Layer  
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EVM Assembly Drawing and Layout  
Figure 17. Internal Split Ground Plane  
Figure 18. Internal Signal Trace Layer  
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EVM Assembly Drawing and Layout  
Figure 19. Bottom Signal Trace Layer  
Figure 20. Bottom Side Component Assembly  
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List of Materials  
9
List of Materials  
The following table lists the UCC2891EVM components corresponding to the schematic shown in  
Figure 1.  
Table 2. List of Materials  
QT  
REF  
C1, C2, C4  
DESCRIPTION  
MFR  
PART NUMBER  
C4532X7R2A225M  
Y
3
3
1
2
1
1
2
2
1
1
1
2
5
1
1
1
1
4
4
1
1
1
Capacitor, ceramic, 2.2 µF, 100 V, X7R, 20%, 1812  
Capacitor, ceramic, 0.1 µF, 50 V, X7R, 20%, 805  
Capacitor, ceramic, 100 pF, 50 V, NPO, 10%, 805  
Capacitor, ceramic, 0.22 µF, 50 V, X7R, 20%, 805  
Capacitor, ceramic, 10 nF, 50 V, X7R, 20%, 805  
Capacitor, ceramic, 33 nF, 250 V, X7R, 10%, 1206  
Capacitor, tantalum chip, 47 µF, 16 V, C  
TDK  
C3, C14, C17  
Vishay  
Vishay  
TDK  
VJ0805Y104MXAA  
VJ0805A101KXAA  
C2012X7R1H224M  
VJ0805Y103MXAA  
GRM31CR72E333KW03L  
595D476X9016C2T  
C3216X5R1C106M  
C2012X5R1A155M  
VJ0805Y823KXAA  
VJ0805A221KXAA  
6TPD330M  
C5  
C6, C7  
C8  
Vishay  
MuRata  
Vishay  
TDK  
C9  
C10, C11  
C12, C18  
Capacitor, ceramic, 10 µF, 16 V, X5R, 20%, 1206  
Capacitor, ceramic, 1.5 µF, 10 V, X5R, 20%, 805  
Capacitor, ceramic, 82 nF, 50 V, X7R, 10%, 805  
Capacitor, ceramic, 220 pF, 50 V, NPO, 10%, 805  
Capacitor, POSCAP, 330 µF, 6.3 V, 20%, 7343 (D)  
Diode, schottky, 200 mA, 30 V, SOT23  
C13  
TDK  
C15  
Vishay  
Vishay  
Sanyo  
Vishay  
Philips/NXP  
Vishay  
TI  
C16  
C19, C20  
D1, D2, D3, D4, D5  
BAT54  
D8  
Diode, switching, 200 mA, 200 V, SOT23  
BAS21  
D6  
Diode, zener, 5.1 V, 350 mW, SOT23  
BZX84C5V1  
D7  
Adjustable precision shunt regulator, 0.5%, SOT23  
Terminal block, 2 pin, 15 A, 5.1 mm, 0.40 × 0.35  
TLV431BCDBZ  
ED500/2DS  
J1  
OST  
J2, J3, J4, J5  
Adaptor, 3.5 mm probe clip (or 131-5031-00), 3.5 mm Tektronix  
131 4244 00  
J6, J7, J9, J10  
Printed circuit pin, 0.043 hole, 0.3 length, 0.043  
Terminal block, 4 pin, 15 A, 5.1mm, 0.80 × 0.35  
Inductor, 2 µH, 1 pri, 1 sec, 0.920 × 0.780  
Mill Max  
OST  
3103-1-00-15-00-00-0X-0  
ED500/4DS  
J8  
L1  
Q1  
Pulse  
IR  
PA0373  
MOSFET, P-channel, 150 V, 2.2 A, 240 m, SO-8  
IRF6216  
MOSFET, N-channel, 150 V, 6.7 A, 50 m,  
PowerPak SO-8  
Q2  
1
Vishay  
Si7846DP  
Q3, Q4, Q5, Q7, Q8  
Q6  
5
1
MOSFET, N-channel, 30 V, 55 A, 2.5 m, LFPAK  
Renesas  
Vishay  
HAT2165H  
Bipolar, NPN, 40 V, 600 mA, 225 mW, SOT23  
MMBT2222A  
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References  
Table 2. List of Materials (continued)  
QT  
Y
REF  
DESCRIPTION  
MFR  
PART NUMBER  
R1  
R2  
R3  
1
1
1
Resistor, chip, 8.45 k, 1/10 W, 1%, 805  
Resistor, chip, 57.6 k, 1/10 W, 1%, 805  
Resistor, chip, 76.8 k, 1/10 W, 1%, 805  
Vishay  
Vishay  
Vishay  
CRCW0805-8451-F  
CRCW0805-5762-F  
CRCW0805-7682-F  
R4, R10, R15, R16,  
R20, R23, R24  
7
Resistor, chip, 2.21 , 1/10 W, 1%, 805  
Vishay  
CRCW0805-2R21-F  
R5  
1
1
3
1
1
1
1
2
1
2
1
1
1
1
1
1
Resistor, chip, 158 k, 1/10 W, 1%, 805  
Resistor, chip, 1.82 k, 1/10 W, 1%, 805  
Resistor, chip, 1 k, 1/10 W, 1%, 805  
Resistor, chip, 11.8 , 1/10 W, 1%, 805  
Resistor, chip, 26.7 k, 1/10 W, 1%, 805  
Resistor, chip, 2 k, 1/10 W, 1%, 805  
Resistor, chip, 10 , 1/10 W, 1%, 805  
Resistor, chip, 499 , 1/10 W, 1%, 805  
Resistor, chip, 665 , 1/10 W, 1%, 805  
Resistor, chip, 10 k, 1/10 W, 1%, 805  
Resistor, chip, 51.1 , 1/10 W, 1%, 805  
Resistor, chip, 28.7 k, 1/10 W, 1%, 805  
Resistor, chip, 12.1 k, 1/10 W, 1%, 805  
Resistor, chip, 4.99 k, 1/10 W, 1%, 805  
Transformer, current sense, 10-A, 1:100, SMD  
Transformer, high-frequency planar, planar  
Vishay  
Vishay  
Vishay  
Vishay  
Vishay  
Vishay  
Vishay  
Vishay  
Vishay  
Vishay  
Vishay  
Vishay  
Vishay  
Vishay  
Pulse  
CRCW0805-1583-F  
CRCW0805-1821-F  
CRCW0805-1001-F  
CRCW0805-11R8-F  
CRCW0805-2672-F  
CRCW0805-2001-F  
CRCW0805-10R0-F  
CRCW0805-4990-F  
CRCW0805-6650-F  
CRCW0805-1002-F  
CRCW0805-51R1-F  
CRCW0805-2872-F  
CRCW0805-1212-F  
CRCW0805-4991-F  
P8208  
R6  
R7, R8, R12  
R9  
R11  
R13  
R14  
R17, R18  
R19  
R21, R22  
R25  
R26  
R27  
R28  
T1  
T2  
Pulse  
PA0810  
IC, current mode active clamp PWM controller,  
SO-16  
U1  
U2  
1
1
TI  
UCC2891D  
SFH690BT  
IC, phototransistor, CTR 100%-300%, SOP-4  
Vishay  
10  
References  
1. UCC2891 Current Mode Active Clamp PWM Controller, Datasheet, (SLUS542)  
2. Designing for High Efficiency with the UCC2891 Active Clamp PWM Controller, by Steve Mappus,  
Application Note (SLUA299)  
18  
Using the UCC2891 Active Clamp Current Mode PWM Controller  
SLUU178ANovember 2003Revised December 2006  
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EVM IMPORTANT NOTICE  
Texas Instruments (TI) provides the enclosed product(s) under the following conditions:  
This evaluation kit being sold by TI is intended for use for ENGINEERING DEVELOPMENT OR  
EVALUATION PURPOSES ONLY and is not considered by TI tobe fitfor commercialuse. Assuch,  
the goods being provided may not be complete in terms of required design-, marketing-, and/or  
manufacturing-related protective considerations, including product safety measures typically  
found in the end product incorporating the goods. As a prototype, this product does not fall within  
the scope of the European Union directive on electromagnetic compatibility and therefore may not  
meet the technical requirements of the directive.  
Should this evaluation kit not meet the specifications indicated in the EVM User’s Guide,the kitmay  
be returned within 30 days from the date of delivery for a full refund. THE FOREGOING  
WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYER AND IS IN LIEU  
OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY  
WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE.  
The user assumes all responsibility and liability for proper and safe handling of the goods. Further,  
the user indemnifies TI from all claims arising from the handling or use of the goods. Please be  
aware that the products received may not be regulatory compliant or agency certified (FCC, UL,  
CE, etc.). Due to the open construction of the product, it is the user’s responsibility to take any and  
all appropriate precautions with regard to electrostatic discharge.  
EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL  
BE LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR  
CONSEQUENTIAL DAMAGES.  
TI currently deals with a variety of customers for products, and therefore our arrangement with the  
user is not exclusive.  
TI assumes no liability for applications assistance, customer product design, software  
performance, or infringement of patents or services described herein.  
Please read the EVM User’s Guide and, specifically, the EVM Warnings and Restrictions notice  
in the EVM User’s Guide prior to handling the product. This notice contains important safety  
information about temperatures and voltages. For further safety concerns, please contact the TI  
application engineer.  
Persons handling the product must have electronics training and observe good laboratory practice  
standards.  
No license is granted under any patent right or other intellectual property right of TI covering or  
relating to any machine, process, or combination in which such TI products or services might be  
or are used.  
Mailing Address:  
Texas Instruments  
Post Office Box 655303  
Dallas, Texas 75265  
Copyright © 2003--2006, Texas Instruments Incorporated  
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DYNAMIC WARNINGS AND RESTRICTIONS  
It is important to operate this EVM within the input voltage range of 0 Vdc to 72 Vdc.  
Exceeding the specified input range may cause unexpected operation and/or irreversible damage  
to the EVM. If there are questions concerning the input range, please contact a TI field  
representative prior to connecting the input power.  
Applying loads outside of the specified output range may result in unintended operation and/or  
possible permanent damage to the EVM. Please consult the EVM User’s Guide prior to connecting  
any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI  
field representative.  
During normal operation, some circuit components may have case temperatures greater than  
50°C. The EVM is designed to operate properly with certain components above 50°C as long as  
the input and output ranges are maintained. These components include but are not limited to linear  
regulators, switching transistors, pass transistors, and current sense resistors. These types of  
devices can be identified using the EVM schematic located in the EVM User’s Guide. Whenplacing  
measurement probes near these devices during operation, please be aware that these devices  
may be very warm to the touch.  
Mailing Address:  
Texas Instruments  
Post Office Box 655303  
Dallas, Texas 75265  
Copyright © 2003--2006, Texas Instruments Incorporated  
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