IBM Computer Accessories 25CPC710 User Manual

PowerPCTM Applications  
IBM Microelectronics  
Research Triangle Park, NC  
IBM25CPC710 Bridge Chip:  
Enhancements and Changes in the  
DD3.x revisions  
November 8, 2001  
Version 1.0  
Abstract  
This Application Note describes the differences between the CPC710-100+ (DD2) and the  
CPC710 (DD3.x) versions of the PowerPC Dual PCI/Memory Controller companion chip. The  
purpose of this note is to provide designers with an overview of the changes and point out  
performance enhancements and potential programming changes. For  
a
detailed  
understanding of the operation of the CPC710-133, please refer to the User’s Manual. For a  
detailed understanding of the physical pin out and electrical specifications, please refer to the  
Data Sheet.  
Overview  
The IBM25CPC710 DD3.x is a host bridge that interfaces a PowerPC 60x bus with system  
memory (SDRAM) and two independent PCI interfaces. It provides arbitration for one to four  
processors and supports up to two levels of pipelining per processor with 64-byte buffers  
(maximum of 6 buffers). Use of external slave devices on the 60x bus is also supported and  
requires additional external logic. The CPC710 DD3.x supports 60x bus speeds of up to 133MHz  
at 2.5V. Of course, given signal quality issues with higher bus speeds it is not recommended that  
the CPU bus run at 133Mhz in configurations that include more than 2 CPUs.  
The bridge’s two way interleaved memory controller supports SDRAM at 100 or 133 MHz;  
both single bank and dual bank, PC100, PC133 and registered DIMMs are supported. The  
memory controller design requires the use of an external multiplexer and two physical DIMMs.  
The bridge contains two PCI host bus bridges: one provides an interface for a 32-bit, 33 MHz  
PCI bus for standard and native I/O. This bus supports either 3.3V or 5V logic level devices, and  
allows attachment of up to 2MB of boot ROM (and up to 256MB of extended boot ROM). The  
other PCI interface supports a 32- or 64-bit, 33 or 66 MHz PCI bus for high data throughput, but  
supports only 3.3V logic level devices. This is a change from the previous revision. Burst and  
non-burst data transfers to memory from the PCI (bridge acts as target on PCI bus) and from  
memory to the PCI (bridge acts as master on PCI bus) are supported; data transfers directly  
between PCI-32 and PCI-64 are not supported. This is a change from the previous revision.  
A single channel DMA controller provides support for large data transfers between  
memory and the PCI busses. DMA to and from the CPU bus to memory, or between PCI-32 and  
PCI-64 is not supported. This is a change from the previous revision.  
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Memory Interface:  
v Extended SDRAM Addressing  
Ø
The signal MADDR13 has been added to support the following additional SDRAM  
organizations:  
§
13-12-2, 14-9-2, 14-10-2, 14-11-2, 14-12-2  
§
Register SDRAM0_MCER [26:29] is used to select the SDRAM organization; refer to  
the CPC710-133 User’s Manual for more information.  
v Extended Memory Size  
Ø
The Memory controller has been modified to support up to six banks of dual DIMM  
interleaved 72-bit memory, for a total memory addressing range of 3.5GB. The memory  
controller now allows configuration of bank sizes up to 4GB per bank  
The choice of 4MB to 1GB (same as the CPC710-100+) or 4MB to 4GB is made with  
SDRAM0_MCCR [8].  
§
§
§
If SDRAM0_MCCR [8] = 1 bank size range is from 4MB to 1GB  
If SDRAM0_MCCR [8] = 0 bank size range is from 4MB to 4GB  
Refer to the CPC710-133 User’s Manual for more information.  
v Supported Memory Types  
Ø
Ø
Ø
Supports JEDEC standard PC100 and PC133 SDRAMs, both single bank and dual bank.  
EDO memory is no longer supported on the CPC710 with the DD3.x revision.  
All types of registered DIMMs are now supported on the CPC710 with the DD3 version.  
New programming bits are defined in register SDRAM0_MCCR0 to support registered  
DIMMS.  
§
§
§
§
Setting SDRAM0_MCCR [16] = 1 adds one additional clock cycle to the internal  
sequencer signals for read operations of registered DIMMs.  
Setting SDRAM0_MCCR [19] =1 shifts the following signals by one clock cycle:  
MUX_SEL, MUX_CLKEN1B_, MUX_CLKEN2B_  
Setting SDRAM0_MCCR [21] = 1 allows the data to be written to the memory to be  
held valid for an additional clock cycle.  
Setting SDRAM0_MCCR [22] = 1 shifts the following signals by one clock cycle:  
MUX_CLKENA2_, MUX_OEB_, SDRAS0_, SDRAS1_, SDCAS0_, SDCAS1_, WE0_,  
WE1_, MADDR0_ODD, MADDR0_EVEN, MADDR1-13, BS0 and BS1  
v Maximum Number of Memory Banks Decreased from 8 to 6  
Ø
CPC710 DD3.x revision does not support the use of registers MCER6 and  
MCER7.These registers were present in the CPC710-100+ DD2 version.  
Internal memory controller logic no longer generates SDCS12_ through SDCS15_. These  
signals were present in the CPC710-100+ DD2 version. The multiplexing capabilities  
defined in register SDRAM0_MCCR [11:15] have been modified from the usage in  
CPC710 DD2 revision. This multiplexing allows for support of SDRAM speeds up to 133  
MHz. The higher speed is attained by limiting the loading (number of SDRAM packages)  
on each SDCS signal.  
Ø
§
New encoding:  
·
·
·
·
If SDRAM0_MCCR [11] = 1 signals SDCS_[0:3] use I/O pins SDCS_[4:7]  
If SDRAM0_MCCR [12] = 1 signals SDCS_[0:3] use I/O pins SDCS_[8:11]  
SDRAM0_MCCR [13] is no longer used  
If SDRAM0_MCCR [14] = 1 signals SDQM use I/O pins SDRAS1_, SDCAS1_  
and WE1_  
·
If SDRAM0_MCCR [15] = 1 signals SDQM uses I/O pins PCG_ARB  
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v Extended Addressing of PCI Memory  
Ø
System memory addressing range increased from 2GB to 4GB. The standard addressing  
capability is 2GB; with the size defined by bits 24-31 of PCI local registers  
PCILx_PSSIZE. The address extension is implemented by setting bit 27 of chip control  
register CPC0_PGCHP. In this case, the FINE option for selection of less than1MB  
granularity (enabled in CPC710-100+ dd2 in the memory write protection register  
SDRAM0_MWPR) is not available.  
PCI Interfaces:  
v The PCI-64 Interface is no Longer 5 Volt Tolerant  
Ø The I/O drivers used on the CPC710 DD3.x PCI-64 interface no longer support 5V logic  
levels – users must attach only 3.3V devices to the PCI-64 bus. This is a change from the  
previous revision.  
v PCI-32 Interface Now Supports External Arbiter Usage  
Ø The PCI-32 interface now allows use of an external PCI bus arbiter. A method similar to  
that used for disabling the PCI-64 internal arbiter is used to for disabling the PCI-32  
internal arbiter.  
§
At power on, after activation of the POWERGOOD signal, the signal P_REQ2_ is  
sampled. This initial sampling is done while PLL_RESET is active, and is  
independent of activation of the PCI clock on the bus. If the signal level is 0, the  
internal arbiter for the PCI-32 bus is disabled. Bit 16 of chip control register  
CPC0_PGCHP can be read to determine the detected arbitration mode; a “0”  
indicates the internal arbiter is in use, and a “1” indicates an external arbiter.  
§
For the PCI-64 interface, the signal sampled after activation of the POWERGOOD  
signal is G_REQ2_. This initial sampling is done while PLL_RESET is active, and  
is independent of activation of the PCI clock on the bus. Bit 9 of chip control  
register CPC0_PGCHP can be read to determine the detected arbitration mode; a  
“0” indicates the internal arbiter is in use, and a “1” indicates an external arbiter.  
Ø
NOTE: Because the FLASH interface is present on the PCI-32 bus, configurations using  
an external PCI bus arbiter must prevent any external PCI-32 transactions from interfering  
or pre-empting FLASH transactions.  
Power and PLL:  
v New Supply Voltages  
Ø 60x bus voltage level now 2.5V. To support the I/O interfaces on the PPC750CX/CXe (as  
well as the PPC750L) the 60x bus interface logic is now 2.5V. This is a change from the  
previous revision.  
Ø VDD (core logic) is also 2.5V.  
Ø OVDD (I/O logic) for SDRAM and PCI interfaces is 3.3V.  
Ø The AVDD (PLL) is 2.5V.  
§
AVDD is the voltage supply pin to the analog circuits in the PLL. Noise on AVDD will  
cause phase jitter at the output of the PLL. To provide isolation from the noisy  
internal digital VDD signal, AVDD is brought to a package pin. If little noise is  
expected at the board level, then AVDD can be connected directly to the digital VDD  
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plane. In most circumstances, however, it is prudent to place a filter circuit on AVDD;  
refer to the CPC710 DD3.x User’s Manual for more information.  
Ø
The PLL is now set up and controlled by external signals PLL_RANGE [1:0] and 6  
external signals PLL_TUNE [5:0] instead of PLL133 and PLL_TUNE [1:0]. This is a  
change from the previous revision.  
Packaging Changes:  
v FC-PBGA Package instead of CBGA  
Ø The CPC710 DD3.x is offered in a 35mm 728 pin FC-PBGA (Flip Chip Plastic Ball Grid  
Array) package. This is a change from the previous revision – the DD3.x is not  
pin/package compatible with the DD2. Refer to the CPC710-133 PCI Bridge and Memory  
Controller Datasheet for more details on the physical packaging.  
v I/O Pinout Deletions:  
The following I/Os are no longer present on the DD3 revision:  
INTERFACE  
SIGNAL NAME  
IMPACT  
Memory  
Interface  
SDCS_12, SDCS_13, SDCS_14,  
SDCS_15  
SDRAS_2, SDRAS_3  
SDCAS_2, SDCAS_3  
WE_2, WE_3  
Changes to the memory interface.  
Refer to Chapter 6 Of User’s  
Manual for more details.  
PCI 32-bit  
Interface  
P_GNT_6, P_GNT_5, P_GNT_4,  
P_REQ_6, P_REQ_5, P_REQ_4  
Decreases number of PCI devices  
supported by the internal bus  
arbiter, unless multiplexed (see  
below).  
PCI 32-bit  
Interface  
P_ISA_MASTER  
P_CFG [0:2]  
PCI 32-bit  
Interface  
CFGA [13:11] no longer driven  
offchip (used for save loads on PCI  
bus)  
PCI 64-bit  
Interface  
G_CFG [0:2]  
CFGA [13:11] no longer driven  
offchip  
Clock Inputs  
PLL_133, PLN_RTC_CLOCK  
DD3 has new strapping options.  
Timers now controlled only by  
PCI32 clock.  
Test Signals  
CE1_A, CE1_B, CE1_C1, CE1_C2, DI1,  
DI2, CE0_IO, RI, SCAN_GATE,  
TESTIN, CE_TRST, TESTOUT  
Signals used only by manufacturing  
test.  
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v I/O Pin Additions:  
The following I/Os are new on the DD3 revision:  
INTERFACE  
SIGNAL NAME  
IMPACT  
60x bus Interface  
SYS_BG2_, SYS_BG3_, SYS_MCP2,  
SYS_MCP3, SYS_HRESET2,  
SYS_HRESET3, SYS_SRESET2,  
SYS_SRESET3  
New for 4-way CPU support  
60x bus Interface  
SYS_TA_HIT  
Memory Interface  
Clock Inputs  
MADDR13  
Used for newer memory sizes  
New; used for setup and control  
of PLL  
PLL_RANGE0, PLL_RANGE1,  
PLL_TUNE2, PLL_TUNE3, PLL_TUNE4,  
PLL_TUNE5  
v I/O Pins Multiplexed:  
The following I/Os are multiplexed on the DD3 revision:  
INTERFACE  
PIN FUNCTION OPTION  
REGISTER BIT TO USE  
TO SELECT FUNCTION  
SDRAM0_MCCR [14] = 1  
SDRAM0_MCCR [14] = 1  
SDRAM0_MCCR [14] = 1  
SDRAM0_MCCR [15] = 1  
CPC0_PGCHP [20] = 0  
CPC0_PGCHP [20] = 0  
CPC0_PGCHP [23] = 1  
CPC0_PGCHP [23] = 1  
CPC0_PGCHP [22] = 1  
CPC0_PGCHP [22] = 1  
CPC0_PGCHP [21] = 1  
CPC0_PGCHP [21] = 1  
Memory Interface  
Memory Interface  
Memory Interface  
Memory Interface  
60x bus Interface  
60x bus Interface  
PCI 64-bit Interface  
PCI 64-bit Interface  
PCI 64-bit Interface  
PCI 64-bit Interface  
PCI 64-bit Interface  
PCI 64-bit Interface  
SDRAS_1 becomes SDQM  
SDCAS_1 becomes SDQM  
WE_1  
becomes SDQM  
G_ARB becomes SDQM  
DRAMREQ_ becomes NODLK_  
DRAMGNT_ becomes DLK_  
G_REQ_7 becomes P_REQ_6  
G_GNT_7 becomes P_GNT_6  
G_REQ_6 becomes P_REQ_5  
G_GNT_6 becomes P_GNT_5  
G_REQ_5 becomes P_REQ_4  
G_GNT_5 becomes P_GNT_4  
Hardware ID Changes for DD3.0 revision:  
v PCI-32 revision ID in PCIC0_REVID = x’03  
v PCI-64 revision ID in PCIC1_REVID = x’03  
v EC Level in CPC0_UCTL [24:31] = x’a0  
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Performance Enhancements and Improvements:  
v
The CPC710 DD3.x revision has improvements to support PCI Long Burst Write operations  
and improvements in the deadlock prevention circuits. These enhancements can be selected  
by programming select bits in PCI local registers PCILx_PSWCR and PCILx_DLKCTRL.  
Ø
Crossing a 4K boundary during burst operations results in a stop on the PCI bus. By  
default operation, snooping is done on the current PCI master’s address. A new option is  
provided to allow for anticipation logic to snoop ahead to the next address. Set PCI local  
register PCILx_PSWCR [17] to “1” to enable the snoop ahead logic.  
Ø
There have been several changes to the deadlock avoidance logic. The CPC710 DD2  
errata #8 and #9, relating to defects in the deadlock circuitry, have been fixed in the  
CPC710 DD3.x revision. In addition, there are three improvements that can be selected  
by setting the appropriate bits.  
§
§
§
PCILx_DLKCTRL [27] – when set to “0” enables the erratum #8 correction logic to  
prevent potential deadlock in multiprocessor configurations when one CPU is  
attempting a PCI read. For more details on the erratum, please read the CPC710  
DD2 Errata List. Setting this bit to “1” disables the correction logic.  
PCILx_DLKCTRL [28] – when set to “0” enables the erratum #9 correction logic to  
function correctly when the programmed value in the PCI local register  
PCILx_DLKCTRL [8:15] is greater than 0x0F. Setting this bit to a “1” disables the  
correction logic.  
PCILx_DLKCTRL [29] - when set to “1” results in the following: When a read is  
already in progress to an address defined in the deadlock avoidance address range,  
an ARTRY will be generated for all accesses except the access to the main memory  
for that read. Setting this bit to a “0” disables this logic. The default state for this bit is  
recommended, as other methods of deadlock avoidance have proven to be flexible  
enough to resolve problems without use of this logic.  
§
§
PCILx_DLKCTRL [30] - when set to “0” results in the following: The processor ID is  
taken into account in the deadlock avoidance logic. Setting this bit to a “1” causes the  
deadlock logic to ignore the processor ID.  
PCILx_DLKCTRL [31] - when set to “0” results in the following: The deadlock  
avoidance logic using the signals MEMREQ/MEMACK and DLK/NODLK are masked.  
Setting this bit to a “1” causes the deadlock logic to generate these signals as usual.  
Please send questions or comments about this document to Embedded PowerPC  
Technical Support: [email protected]  
IBM Corporation  
PowerPC Embedded Processor Solutions  
Applications Engineering  
Research Triangle Park, NC 27709  
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(c) Copyright International Business Machines Corporation 2001  
All Rights Reserved  
Printed in the United States of America November 2001  
The following are trademarks of International Business Machines Corporation in the United States, or other countries, or  
both:  
IBM  
PowerPC  
IBM Logo  
Other company, product and service names may be trademarks or service marks of others.  
All information contained in this document is subject to change without notice. The products described in this document  
are NOT intended for use in implantation or other life support applications where malfunction may result in injury or death  
to persons. The information contained in this document does not affect or change IBM product specifications or  
warranties. Nothing in this document shall operate as an express or implied license or indemnity under the intellectual  
property rights of IBM or third parties. All information contained in this document was obtained in specific environments,  
and is presented as an illustration. The results obtained in other operating environments may vary.  
THE INFORMATION CONTAINED IN THIS DOCUMENT IS PROVIDED ON AN "AS IS" BASIS. In no event will IBM be  
liable for damages arising directly or indirectly from any use of the information contained in this document.  
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