Hayes Microcomputer Products Network Card RCV56HCF User Manual
RCV56HCF  
PCI/CardBus Modem Designer's Guide  
(Preliminary)  
ROCKWELL PROPRIETARY INFORMATION.  
DISSEMINATION OR USE OF THIS INFORMATION IS NOT PERMITTED WITHOUT THE  
WRITTEN PERMISSION OF ROCKWELL INTERNATIONAL.  
Order No. 1129  
Rev. 1, August 19, 1997  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
Table of Contents  
1. INTRODUCTION .............................................................................................................................................1-1  
1.1 SUMMARY.................................................................................................................................................1-1  
1.2 FEATURES ................................................................................................................................................1-1  
1.3 TECHNICAL OVERVIEW ...........................................................................................................................1-7  
1.3.1 General Description ..........................................................................................................................1-7  
1.3.2 Operating Modes..............................................................................................................................1-7  
Data/Fax Modes..............................................................................................................................1-7  
AudioSpan Modes...........................................................................................................................1-7  
Host-Controlled DSVD Mode (ISDN and SP Models) .......................................................................1-7  
Voice/Audio Mode (V Models)..........................................................................................................1-7  
Speakerphone Mode (ISDN and SP Models) ...................................................................................1-8  
Synchronous Access Mode (SAM)...................................................................................................1-8  
1.3.3 Host-Controlled Modem Software......................................................................................................1-8  
1.3.4 Downloadable Modem Data Pump Firmware.....................................................................................1-8  
1.3.5 Hardware Interfaces .........................................................................................................................1-8  
2. TECHNICAL SPECIFICATIONS ......................................................................................................................2-1  
2.1 ESTABLISHING DATA MODEM CONNECTIONS.......................................................................................2-1  
Dialing.............................................................................................................................................2-1  
Modem Handshaking Protocol.........................................................................................................2-1  
Call Progress Tone Detection ..........................................................................................................2-1  
Answer Tone Detection ...................................................................................................................2-1  
Ring Detection.................................................................................................................................2-1  
Billing Protection..............................................................................................................................2-1  
Connection Speeds .........................................................................................................................2-1  
Automode .......................................................................................................................................2-1  
2.2 DATA MODE..............................................................................................................................................2-1  
Speed Buffering (Normal Mode) ......................................................................................................2-1  
DTE-to-Modem Flow Control ...........................................................................................................2-1  
Escape Sequence Detection............................................................................................................2-1  
GSTN Cleardown (K56flex, V.34, V.32 bis, V.32).............................................................................2-1  
Fall Forward/Fallback (K56flex, V.34/V.32 bis/V.32).........................................................................2-2  
Retrain............................................................................................................................................2-2  
2.3 ERROR CORRECTION AND DATA COMPRESSION.................................................................................2-2  
V.42 Error Correction ......................................................................................................................2-2  
MNP 2-4 Error Correction................................................................................................................2-2  
V.42 bis Data Compression .............................................................................................................2-2  
MNP 5 Data Compression...............................................................................................................2-2  
2.4 MNP 10EC™ ENHANCED CELLULAR CONNECTION...............................................................................2-2  
2.5 FAX CLASS 1 OPERATION .......................................................................................................................2-2  
2.6 VOICE/AUDIO MODE ................................................................................................................................2-2  
2.6.1 Online Voice Command Mode...........................................................................................................2-3  
2.6.2 Voice Receive Mode .........................................................................................................................2-3  
2.6.3 Voice Transmit Mode........................................................................................................................2-3  
2.6.4 Tone Detectors.................................................................................................................................2-3  
2.6.5 Speakerphone Modes.......................................................................................................................2-3  
SIMULTANEOUS AUDIO/VOICE AND DATA (AUDIOSPAN)..........................................................................2-3  
2.7  
2.8 HOST-BASED DSVD MODE ......................................................................................................................2-3  
2.9 FULL-DUPLEX SPEAKERPHONE (FDSP) MODE......................................................................................2-3  
2.10 VOICEVIEW.............................................................................................................................................2-3  
2.11 CALLER ID...............................................................................................................................................2-4  
2.12 WORLD CLASS COUNTRY SUPPORT....................................................................................................2-4  
2.12.1 Programmable Parameters .............................................................................................................2-4  
2.12.2 Blacklist Parameters .......................................................................................................................2-4  
2.13 DIAGNOSTICS.........................................................................................................................................2-4  
1129  
ROCKWELL PROPRIETARY INFORMATION  
iii  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
2.13.1 Commanded Tests..........................................................................................................................2-4  
2.13.2 Power On Reset Tests....................................................................................................................2-4  
2.14 LOW POWER SLEEP MODE ...................................................................................................................2-4  
3. HARDWARE INTERFACE...............................................................................................................................3-1  
3.1 HARDWARE SIGNAL PINS AND DEFINITIONS.........................................................................................3-1  
3.2 ELECTRICAL,SWITCHING,AND ENVIRONMENTAL CHARACTERISTICS...............................................3-18  
3.2.1 Power and Maximum Ratings..........................................................................................................3-18  
3.2.2 PCI Bus..........................................................................................................................................3-19  
3.2.3 MDP...............................................................................................................................................3-20  
3.3 INTERFACE TIMING AND WAVEFORMS................................................................................................3-22  
3.3.1 PCI Bus Timing...............................................................................................................................3-22  
3.3.2 Serial EEPROM Timing...................................................................................................................3-22  
3.3.3 External Device Bus Timing ............................................................................................................3-23  
3.3.4 IOM-2 Interface ..............................................................................................................................3-25  
4. DESIGN CONSIDERATIONS ..........................................................................................................................4-1  
4.1 PC BOARD LAYOUT GUIDELINES............................................................................................................4-1  
4.1.1 General Principles.............................................................................................................................4-1  
4.1.2 Component Placement......................................................................................................................4-1  
4.1.3 Signal Routing ..................................................................................................................................4-2  
4.1.4 Power...............................................................................................................................................4-3  
4.1.5 Ground Planes..................................................................................................................................4-4  
4.1.6 Crystal Circuit ...................................................................................................................................4-4  
4.1.7 VC_L1 and VREF Circuit...................................................................................................................4-4  
4.1.8 Telephone and Local Handset Interface ............................................................................................4-5  
4.1.9 Optional Configurations.....................................................................................................................4-5  
4.1.10 MDP Specific..................................................................................................................................4-5  
4.2 CRYSTAL/OSCILLATOR SPECIFICATIONS ..............................................................................................4-5  
4.3 OTHER CONSIDERATIONS ......................................................................................................................4-5  
4.4 PACKAGE DIMENSIONS...........................................................................................................................4-8  
5. SOFTWARE INTERFACE................................................................................................................................5-1  
ONFIGURATION REGISTERS ....................................................................................................................5-1  
5.1 PCI C  
5.1.1 Vendor ID Field.................................................................................................................................5-1  
5.1.2 Device ID Field .................................................................................................................................5-1  
5.1.3 Command Register...........................................................................................................................5-2  
5.1.4 Status Register.................................................................................................................................5-2  
5.1.5 Revision ID Field...............................................................................................................................5-3  
5.1.6 Class Code Field...............................................................................................................................5-3  
5.1.7 Latency Timer Register.....................................................................................................................5-3  
5.1.8 Header Type Field ............................................................................................................................5-3  
5.1.9 CIS Pointer Register .........................................................................................................................5-3  
5.1.10 Subsystem Vendor ID and Subsystem ID Registers ........................................................................5-3  
5.1.11 Interrupt Line Register ....................................................................................................................5-3  
5.1.12 Interrupt Pin Register......................................................................................................................5-3  
5.1.13 Min Grant and Max Latency Registers.............................................................................................5-3  
5.2 BASE ADDRESS REGISTER .....................................................................................................................5-3  
5.3 SERIAL EEPROM INTERFACE..................................................................................................................5-4  
6. COMMAND SET..............................................................................................................................................6-1  
iv  
ROCKWELL PROPRIETARY INFORMATION  
1129  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
List of Figures  
Figure 1-1. RCV56HCF System Overview..........................................................................................................................1-4  
Figure 1-2. RCV56HCF Hardware Configuration Block Diagram.........................................................................................1-5  
Figure 1-3. Typical Audio Signal Interface (U.S.)..............................................................................................................1-10  
Figure 3-1. RCV56HCF Interface Signals...........................................................................................................................3-2  
Figure 3-2. Bus Interface 176-Pin TQFP Hardware Interface Signals .................................................................................3-3  
Figure 3-3. Bus Interface 176-Pin TQFP Pin Signals..........................................................................................................3-4  
Figure 3-4. MDP 144-Pin TQFP Hardware Interface Signals ............................................................................................3-11  
Figure 3-5. MDP 144-Pin TQFP Pin Signals.....................................................................................................................3-12  
Figure 3-6. Waveforms - Serial EEPROM Interface..........................................................................................................3-22  
Figure 3-7. Waveforms - External Device Bus Interface ...................................................................................................3-24  
Figure 3-8. Waveforms - IOM-2 Interface.........................................................................................................................3-25  
Figure 4-1. Package Dimensions - 144-Pin TQFP..............................................................................................................4-8  
Figure 4-2. Package Dimensions - 176-Pin TQFP..............................................................................................................4-9  
1129  
ROCKWELL PROPRIETARY INFORMATION  
v
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
List of Tables  
Table 1-1. Modem Models and Functions ..........................................................................................................................1-3  
Table 1-2. Typical Signal Routing - Voice Mode ...............................................................................................................1-11  
Table 1-3. Relay Positions - VoiceView Mode ..................................................................................................................1-11  
Table 3-1. Bus Interface 176-Pin TQFP Pin Signals ...........................................................................................................3-5  
Table 3-2. Bus Interface Pin Signal Definitions...................................................................................................................3-7  
Table 3-3. MDP Pin Signals - 144-Pin TQFP....................................................................................................................3-13  
Table 3-4. MDP Pin Signal Definitions..............................................................................................................................3-15  
Table 3-5. Current and Power Requirements ...................................................................................................................3-18  
Table 3-6. Maximum Ratings...........................................................................................................................................3-18  
Table 3-7. PCI Bus DC Specifications for 3.3V Signaling..................................................................................................3-19  
Table 3-8. PCI Bus AC Specifications for 3.3V Signaling..................................................................................................3-19  
Table 3-9. MDP Digital Electrical Characteristics..............................................................................................................3-20  
Table 3-10. Analog Electrical Characteristics ...................................................................................................................3-21  
Table 3-11. Timing - Serial EEPROM Interface ................................................................................................................3-22  
Table 3-12. Timing - External Device Bus Interface............................................................................. .............................3-23  
Table 3-13. Timing - IOM-2 Interface...............................................................................................................................3-25  
Table 4-1. Modem Pin Noise Characteristics......................................................................................................................4-3  
Table 4-2. Crystal Specifications - Surface Mount..............................................................................................................4-6  
Table 4-3. Crystal Specifications - Through Hole................................................................................................................4-7  
Table 5-1. PCI Configuration Registers..............................................................................................................................5-1  
Table 5-2. Command Register...........................................................................................................................................5-2  
Table 5-3. Status Register.................................................................................................................................................5-2  
Table 5-4. BIF Address Map..............................................................................................................................................5-3  
Table 5-5. EEPROM Configuration Data............................................................................................................................5-4  
Table 6-1. Command Set Summary - Functional Use Sort .................................................................................................6-1  
Table 6-2. Command Set Summary - Alphanumeric Sort ...................................................................................................6-4  
vi  
ROCKWELL PROPRIETARY INFORMATION  
1129  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
1. INTRODUCTION  
1.1 SUMMARY  
The Rockwell RCV56HCF-PCI Host-Controlled Modem Device Family supports high speed analog data, high speed fax,  
ISDN, DSVD, AudioSpan, speakerphone, audio/voice, and VoiceView operation. It operates with PSTN or ISDN telephone  
lines in the U.S. and world-wide and is offered in several device models (see Table 1-1).  
The modem device set consists of PC PCI bus interface (BIF) and modem data pump (MDP) hardware available in two thin  
quad flat packs (TQFPs). Host-controlled modem software is also provided.  
Operating with +3.3V power, this device set supports 32-bit host applications in such designs as embedded motherboards,  
PCI half cards, and CardBus cards.  
Figure 1-1 illustrates the general structure of the RCV56HCF software and the interface to the RCV56HCF hardware. Figure  
1-2 illustrates the major hardware interfaces supported by each model.  
The RCV56HCF employs a downloadable architecture so that the user can update MDP executable code.  
Using K56flex technology, the RCV56HCF can receive data at speeds up to 56 kbps from a digitally connected K56flex-  
compatible central site modem, such as a Rockwell RC56CSM modem. K56flex modems take advantage of the PSTN which  
is primarily digital except for the client modem to central office local loop and are ideal for applications such as remote  
access to an Internet service provider (ISP), on-line service, or corporate site. The RCV56HCF can send data at speeds up  
to V.34 rates.  
In V.34 data mode, the modem operates at line speeds up to 33600 bps. Error correction (V.42/MNP 2-4) and data  
compression (V.42 bis/MNP 5) maximize data transfer integrity and boost average data throughput. Non-error-correcting  
mode is also supported.  
AudioSpan (analog simultaneous audio/voice and data) operation supports a data rate with audio of 4.8 kbps.  
SP models support position independent, full-duplex speakerphone (FDSP), as well as digital simultaneous voice and data  
(DSVD) with speech coding per ITU-T G.729 Annex A with interoperable G.729 Annex B, and SIG DigiTalk DSVD.  
The modem supports fax Group 3 send and receive rates up to 28800 bps and T.30 protocol.  
V.80 and Rockwell Video Ready compatible synchronous access modes support host-controlled communication protocols, e.  
g., H.324 video conferencing.  
In voice/audio mode, PCM coding and decoding at 8000 Hz sample rate allows efficient digital storage of voice/audio. This  
mode supports digital telephone answering machine, voice annotation, and audio recording/playback applications.  
AccelerATor kits and reference designs are available to minimize application design time and costs.  
This designer's guide describes the modem hardware capabilities and identifies the supporting commands. Commands and  
parameters are defined in the RCVHCF Command Reference Manual (Order No. 1118).  
1.2 FEATURES  
• Data modem  
− K56flex, 33.6 kbps, 31.2 kbps, V.34, V.32 bis, V.32, V.22 bis, V.22A/B, V.23, and V.21; Bell 212A and 103  
− V.42 LAPM and MNP 2-4 error correction  
− V.42 bis and MNP 5 data compression  
− V.25 ter (Annex A) and EIA 602 command set  
• Fax modem send and receive rates up to 28800 bps  
− ITU-T V.34 fax*, V.17, V.29, V.27 ter, and V.21 ch 2  
− EIA/TIA 578 Class 1, Class 1.0 (T.31) fax  
• ISDN BRI support (option)*  
− PC Bus support 2B+D channels  
− IOM-2 interface to external U or S/T transceiver  
− Simultaneous transfer of B1, B2, D channels (144 kbps; 64 kbps x 2, 16 kbps)  
− V.34, DSVD, FDSP, audio functions over B channel  
1129  
ROCKWELL PROPRIETARY INFORMATION  
1-1  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
• AudioSpan (simultaneous audio/voice and data)*  
− ITU-T V.61 modulation (4.8 kbps data plus audio)  
− Handset, headset, or half-duplex speakerphone  
• ITU-T V.70 DSVD (option)  
− ITU-T G.729 Annex A with interoperable G.729 Annex B  
− SIG (special interest group) DigiTalk DSVD  
− Voice/silence detection and handset echo cancellation  
− Handset, headset, or half-duplex speakerphone  
• Full-duplex speakerphone (FDSP) mode  
− Over PSTN or ISDN B channel (option)  
− Switching to/from data, fax, DSVD and VoiceView  
− Microphone gain and muting  
− Speaker volume control and muting  
− Adaptive line and acoustic echo cancellation  
− Loop gain control, transmit and receive path AGC  
− Acoustic echo cancellation concurrent with DSVD  
− Noise suppression  
− Room monitor  
• V.80 and Rockwell Video Ready synchronous access modes support host-controlled communication protocols  
− H.324 interface support  
• V.8/V.8bis and supporting AT commands (V.25 ter with Annex A)  
• Data/Fax/VoiceView/Voice call discrimination  
• Voice, telephony, audio, VoiceView  
− Voice (8-bit µ-Law compression/decompression)  
− TIA-695 command set  
− VoiceView alternating voice and data (option)  
− 8-bit linear and 8-bit µ-Law record/playback  
− 8.0 kHz, 11.025 kHz, 22.050 kHz and 44.1 kHz (down sampled to 11.025)  
− Handset, acoustic, line echo cancellation  
− Music on hold from host or analog hardware input  
− TAM support with concurrent DTMF detect, ring detect and caller ID  
• World-class operation (option)  
− Call progress, blacklisting, multiple country support  
• Integrated internal hybrid  
• Caller ID and distinctive ring detect  
• Modem and audio paths concurrent across PCI bus  
• Single profile stored in host  
• System compatibilities  
− Windows 95 and Windows NT operating systems  
− Microsoft's PC 97 Design Initiative compliant  
− Unimodem/V compliant  
• 32-bit PCI Local Bus interface  
− Conforms to the PCI Local Bus Specification, Production Version, Revision 2.1  
− PCI Bus Mastering interface to the MDP  
− CardBus support with 512-byte RAM for CIS  
−
33 MHz PCI clock support  
• Device packages:  
− Bus Interface in 176-pin TQFP  
− MDP in 144-pin TQFP  
• +3.3V operation  
* See Note 6 in Table 1-1.  
1-2  
ROCKWELL PROPRIETARY INFORMATION  
1129  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
Table 1-1. Modem Models and Functions  
Supported Functions  
Marketing  
K56flex,  
Voice/Audio/  
VoiceView/  
5,6  
ISDN  
Full-duplex  
Speakerphone  
(FDSP)  
W-Class  
1
6
Model Number  
V.34 Fax  
6
AudioSpan  
and DSVD  
RCV56HCF/ISDN  
RCV56HCFW/ISDN  
RCV56HCF/SP  
RCV56HCFW/SP  
RC56HCF  
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
–
Y
Y
–
–
–
–
Y
Y
Y
Y
–
–
Y
–
Y
–
RC56HCFW  
–
–
Y
Notes:  
1.  
2.  
3.  
The two-device set manufacturing part numbers are:  
PCI Bus Interface in 176-pin TQFP: 11229-XX.  
MDP in 144-pin TQFP: R6776-XX.  
Legend:  
Y = Function supported.  
– = Function not supported.  
Model options:  
SP  
V
Speakerphone and DSVD.  
Voice, audio, and VoiceView.  
World-class (W-class).  
W
4.  
Supported functions (Y = Supported; – = Not supported):  
FDSP  
Full-duplex speakerphone.  
DSVD  
Digital simultaneous voice and data.  
Voice and audio functions.  
Voice/Audio  
VoiceView  
W-Class  
VoiceView alternating voice and data.  
World-class functions supporting multiple country requirements.  
5.  
6.  
Provides ISDN functionality with the addition of a U or S/T transceiver device.  
Initial production does not include support for ISDN, V.34 fax, and AudioSpan.  
1129  
ROCKWELL PROPRIETARY INFORMATION  
1-3  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
PC Software  
Win32-based  
communications  
application  
MS-DOS  
application  
(MS-DOS Box)  
Win32  
NDIS  
application  
Win16-based  
communications  
application  
Win95  
Communications Stack  
RC56HCF  
Serial Port Driver*  
RC56HCF  
WAN Miniport Driver*  
RCV56HCF  
Modem Device Set Hardware  
Modem Hardware  
on Motherboard  
or Plug-in Module  
Bus  
Interface  
(BIF)*  
Modem  
Data Pump  
(MDP)*  
* Rockwell supplied  
1123F1 SO  
Figure 1-1. RCV56HCF System Overview  
1-4  
ROCKWELL PROPRIETARY INFORMATION  
1129  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
RC56HCF MODEM DEVICE SET  
DAA AND TELEPHONE  
HANDSET INTERFACE  
VOICE*  
TXA  
TELEPHONE  
LINE  
RXA  
CID*  
OH  
TELEPHONE  
HANDSET*  
HOST  
INTERFACE  
MODEM  
DATA PUMP  
(MDP)  
RING  
BUS  
INTERFACE  
(BIF)  
* OPTIONAL USE (SUPPORTED BY MODEL HARDWARE AND SOFTWARE).  
a. Data/Fax - PSTN Configuration (RC56HCF and RC56HCFW)  
DAA AND TELEPHONE  
HANDSET INTERFACE  
RCV56HCF MODEM DEVICE SET  
TXA  
RXA  
CID*  
OH  
TELEPHONE  
LINE  
TELEPHONE  
HANDSET  
(OPTIONAL)  
DC  
FEED  
RING  
LCS*  
HOST  
INTERFACE  
MODEM  
DATA PUMP  
VOICE*  
BUS  
INTERFACE  
(BIF)  
(MDP)  
SPKR  
MIC  
SPEAKER  
AUDIO  
INTERFACE  
MICROPHONE  
* OPTIONAL USE (SUPPORTED BY MODEL HARDWARE AND SOFTWARE).  
b. Data/Fax/Voice/Speakerphone, SVD - PSTN Configuration (RCV56HCF/SP and RCV56HCFW/SP)  
Figure 1-2. RCV56HCF Hardware Configuration Block Diagram  
1129  
ROCKWELL PROPRIETARY INFORMATION  
1-5  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
DAA AND TELEPHONE  
RCV56HCF MODEM DEVICE SET  
HANDSET INTERFACE  
TXA  
RXA  
CID*  
TELEPHONE  
LINE  
TELEPHONE  
HANDSET  
(OPTIONAL)  
OH  
DC  
FEED  
RING  
LCS*  
HOST  
INTERFACE  
MODEM  
DATA PUMP  
(MDP)  
VOICE*  
BUS  
INTERFACE  
(BIF)  
SPKR*  
MIC*  
AUDIO  
INTERFACE  
(OPTIONAL)  
SPEAKER*  
MICROPHONE*  
ISDN  
U OR S/T  
INTERFACE  
ISDN LINE  
* OPTIONAL USE (SUPPORTED BY MODEL HARDWARE AND SOFTWARE).  
c. Data/Fax/Voice/Speakerphone, SVD/ISDN - PSTN and ISDN Configuration (RCV56HCF/ISDN and RCV56HCFW/ISDN)  
RCV56HCF MODEM DEVICE SET  
TELEPHONE  
HANDSET INTERFACE  
(OPTIONAL)  
RING*  
LCS  
TELEPHONE  
HANDSET 1  
DC  
FEED  
RING*  
LCS*  
HOST  
INTERFACE  
TELEPHONE  
HANDSET 2  
DC  
FEED  
MODEM  
DATA PUMP  
BUS  
INTERFACE  
(BIF)  
(MDP)  
ISDN  
U OR S/T  
INTERFACE  
ISDN LINE  
* OPTIONAL USE (SUPPORTED BY MODEL HARDWARE AND SOFTWARE).  
d. Data/Fax/Voice/Speakerphone, SVD/ISDN - ISDN Only Configuration (RCV56HCF/ISDN and RCV56HCFW/ISDN)  
MD189F1 CONF  
Figure 1-2. RCV56HCF Hardware Configuration Block Diagram (Continued)  
1-6  
ROCKWELL PROPRIETARY INFORMATION  
1129  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
1.3 TECHNICAL OVERVIEW  
1.3.1 General Description  
The RCV56HCF Device Set provides the processing core for a complete system design featuring data/fax modem, DSVD,  
AudioSpan, speakerphone, voice/audio, and VoiceView depending on specific model (Table 1-1). Note: RCV56HCF Device  
Set refers to the family of single device modem models listed in Table 1-1.  
The modem is the full-featured, self-contained data modem/fax modem/DSVD/voice/audio/speakerphone solution. Dialing,  
call progress, telephone line interface, AudioSpan, DSVD, speakerphone, voice/audio, and VoiceView functions are  
supported and controlled through the command set.  
The modem hardware connects to the host PC via a PCI bus interface. The OEM adds a crystal circuit, telephone line  
interface, telephone interface (optional), audio interface (optional), and ISDN interface (optional) to complete the system.  
1.3.2 Operating Modes  
Data/Fax Modes  
In K56flex mode, the modem can receive data from a digital source using a K56flex -compatible central site modem (e.  
g., Rockwell RC56CSM) over the digital telephone network portion of the PSTN at line speeds up to 56 kbps. Asymmetrical  
data transmission supports sending data at V.34 rates. This mode can fall back to full-duplex V.34 mode, and to slower rates  
as supported by line conditions.  
In V.34 data modem mode, the modem can also operate in 2-wire, full-duplex, asynchronous modes at line rates up to  
33600 bps. Data modem modes perform complete handshake and data rate negotiations. Using V.34 modulation to optimize  
modem configuration for line conditions, the modem can connect at the highest data rate that the channel can support from  
33600 bps to 2400 bps with automatic fallback. Automode operation in V.34 is provided in accordance with PN3320 and in  
V.32 bis in accordance with PN2330. All tone and pattern detection functions required by the applicable ITU or Bell standard  
are supported.  
In fax modem modes, the modem fully supports Group 3 facsimile send and receive speeds of 28800, 14400, 12000, 9600,  
7200, 4800, or 2400 bps. Fax modes support Group 3 fax requirements. Fax data transmission and reception performed by  
the modem are controlled and monitored through the fax EIA-578 Class 1 command interface. Full HDLC formatting, zero  
insertion/deletion, and CRC generation/checking are provided.  
Both transmit and receive fax data are buffered within the modem. Data transfer to and from the DTE is flow controlled by  
XON/XOFF and RTS/CTS.  
AudioSpan Modes  
AudioSpan provides full-duplex analog simultaneous audio/voice and data over a single telephone line at a data rate with  
audio of 4800 bps using V.61 modulation. AudioSpan can send any type of audio waveform, including music. Data can be  
sent with or without error correction. The audio/voice interface can be in the form of a headset, handset, or microphone and  
speaker (half-duplex speakerphone). Handset echo cancellation is provided.  
Host-Controlled DSVD Mode (ISDN and SP Models)  
ISDN and SP models support host-controlled DSVD. A microphone and a speaker are required.  
ITU-T interoperable G.729 and G.729 Annex A with interoperable G.729 Annex B Operation. Voice activity detection  
supports speech coding at an average bit rate significantly lower than 8.0 kbps.  
SIG DigiTalk. Speech coding is performed at 8.5 kbps.  
Voice/Audio Mode (V Models)  
Voice/Audio Mode features include 8-bit linear and 8-bit µ-Law coding/decoding, tone detection/generation and call  
discrimination, concurrent DTMF detection, and 8-bit monophonic audio data encoding at 11.025 kHz or 8000 Hz.  
Voice/Audio Mode is supported by three submodes:  
1. Online Voice Command Mode supports connection to the telephone line or a voice/audio I/O device (e.g., microphone,  
speaker, or handset).  
2. Voice Receive Mode supports recording voice or audio data input at the MIC_M pin, typically from a  
microphone/handset or the telephone line.  
3. Voice Transmit Mode supports playback of voice or audio data to the TXA1_L1/TXA2_L1 output, typically to a  
speaker/handset or to the telephone line.  
1129  
ROCKWELL PROPRIETARY INFORMATION  
1-7  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
Speakerphone Mode (ISDN and SP Models)  
The speakerphone mode features an advanced proprietary speakerphone algorithm which supports full-duplex voice  
conversation with both acoustic and line echo cancellation. Parameters are constantly adjusted to maintain stability with  
automatic fallback from full-duplex to pseudo-duplex operation. The speakerphone algorithm allows position independent  
placement of microphone and speaker.  
The speakerphone mode provides hands-free full-duplex telephone operation under host control. The host can separately  
control volume, muting, and AGC in microphone and speaker channels.  
Synchronous Access Mode (SAM)  
V.80 and Rockwell Video Ready synchronous access modes between the modem and the host/DTE are provided for host-  
controlled communication protocols, e.g., H.324 video conferencing applications.  
Voice-call-first (VCF) before switching to a videophone call is also supported.  
1.3.3 Host-Controlled Modem Software  
Host-controlled modem software performs processing of general modem control, command sets, fax Class 1, AudioSpan,  
DSVD, speakerphone, voice/audio/TAM, error correction, data compression, and operating system interface functions.  
Configurations of the modem software are provided to support modem models listed in Table 1-1.  
Binary executable modem software is provided for the OEM.  
1.3.4 Downloadable Modem Data Pump Firmware  
Binary executable code controlling MDP operation is downloaded as required during operation.  
1.3.5 Hardware Interfaces  
1.3.5.1 PCI Bus Host Interface  
The Bus Interface conforms to the PCI Local Bus Specification, Production Version, Revision 2.1, June 1, 1995. It is a  
memory slave (burst transactions) and a bus master for PC host memory accesses (burst transactions). Configuration is by  
PCI configuration protocol.  
The following interface signals are supported:  
• Address and data  
− 32 bidirectional Address/Data (AD[31-0]; bidirectional  
− Four Bus Command and Byte Enable (CBE [3:0]), bidirectional  
− Bidirectional Parity (PAR); bidirectional  
• Interface control  
− Cycle Frame (FRAME#); bidirectional  
− Initiator Ready (IRDY#); bidirectional  
− Target Ready (TRDY#); bidirectional  
− Stop (STOP#); bidirectional  
− Initialization Device Select (IDSEL); input  
− Device Select (DEVSEL#); bidirectional  
• Arbitration  
− Request (REQ#); output  
− Grant (GRANT#); input  
• Error reporting  
− Parity Error ((PERR#); bidirectional  
− System Error ; bidirectional  
• Interrupt  
− Interrupt A (INTA#); output  
• System  
− Clock (PCICLK); input  
− Reset (PCIRST#); input  
− Clock Running (CLKRUN#); input  
1-8  
ROCKWELL PROPRIETARY INFORMATION  
1129  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
1.3.5.2 Serial EEPROM Interface  
A serial EEPROM is required to store the Maximum Latency, Minimum Grant, Device ID, Vendor ID, Subsystem ID, and  
The serial EEPROM interface connects to an  
Subsystem Vendor ID parameters for the PCI Configuration Space Header.  
or equivalent 256 x 16 serial EEPROM. The interface signals are: a serial data input  
Microchip 93LC66B, Atmel AT93C66,  
line from the EEPROM (SROMIN), a serial data output line to the EEPROM (SROMOUT), Clock to the EEPROM  
(SROMCLK), and chip select to the EEPROM (SROMCS).  
The EEPROM is programmable by the PC via the BIF.  
1.3.5.3 Audio Interface  
One Speaker output (SPKROUT_M) is provided for an optional OEM-supplied speaker circuit. Two microphone inputs are  
supported: one for Voice Microphone input (MIC_V) and one for Music Microphone input (MIC_M), e.g., music-on-hold.  
The MIC_V and SPKROUT_M lines connect to the handset and speaker to support functions such as AudioSpan headset  
and speakerphone modes, FDSP, telephone emulation, microphone voice record, speaker voice playback, and call progress  
monitor.  
The MIC_M input can accept an external audio signal to support the music-on-hold function and routes it to the telephone  
line. If music-on-hold function is not required, the microphone signal can be connected to the MIC_M input to support  
telephone emulation mode.  
The Speaker output (SPKROUT_M) carries the normal speakerphone audio or reflects the received analog signals in the  
modem.  
1.3.5.4 Telephone Line/Telephone/Audio Interface  
The Telephone Line/Telephone/Audio Signal Interface can support a 3-relay telephone line interface (Figure 1-3). Signal  
routing for Voice mode is shown in Table 1-2. Relay positions for VoiceView are shown in Table 1-3.  
The following signals are supported:  
• A single-ended Receive Analog input (RXA_L1) and a differential Transmit Analog output (TXA1_L1 and TXA2_L1) to the  
telephone line.  
• Off-hook (OH_L1#), Caller ID (CID_L1#), and Voice (VOICE_L1#) relay control outputs.  
• A Ring Indicate (IRING_L1) input.  
• A Loop Current Sense (LCS) input.  
• An input from the telephone microphone (TELIN_L1) and an output to the telephone speaker (TELOUT_L1 ) are supported  
in AudioSpan modes. These lines connect voice record/playback and AudioSpan audio to the local handset.  
1129  
ROCKWELL PROPRIETARY INFORMATION  
1-9  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
LCS_L1#  
IRING_L1#  
VOICE#  
OH_L1#  
CID_L1#  
VC_L1  
TXA1_L1  
HYBRD  
&
XFRMR  
TXA2_L1  
RXA_L1  
SSI  
&
BRDGE  
SURG  
PROT  
TEL LINE  
OH  
RELAY  
CALLID  
RELAY  
CUR  
SRC  
TELOUT_L1  
TELIN_L1  
HANDSET  
HYBRID  
RCV56HCF  
MODEM  
DEVICE  
RNG  
DET  
TEL HANDSET  
VOICE  
RELAY  
LCS  
TELEPHONE LINE/TELEPHONE HANDSET  
INTERFACE CIRCUIT  
MIC_M  
MIC_V  
MICROPHONE  
HEADPHONE  
BIAS  
AMP/  
SOUNDUCER  
(OPTIONAL)  
SPKROUT_M  
AUDIO/HEADPHONE  
INTERFACE CIRCUIT  
1123F1-3 AIF 3R-US  
Figure 1-3. Typical Audio Signal Interface (U.S.)  
1-10  
ROCKWELL PROPRIETARY INFORMATION  
1129  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
Table 1-2. Typical Signal Routing - Voice Mode  
+VLS=  
Command  
Description  
Input Selected  
Output Selected  
OH_L1#  
Output  
VOICE# CID_L1#  
Output Output  
Activated Activated Activated  
0
Modem on hook. Phone connected to Line  
Modem connected to Line.  
.
.
No  
No  
Yes  
No  
1
RXA_L1  
TELIN_L1  
RXA_L1  
TXA1/2_L1  
TELOUT_L1  
TXA  
Yes  
No  
Yes  
Yes  
No  
2
Modem connected to Handset  
Yes  
No  
3
Modem connected to Line and Handset  
Modem connected to Speaker  
Yes  
No  
4
SPKROUT_M  
No  
Yes  
No  
5
Modem connected to Line and Speaker  
Modem connected to Microphone  
RXA_L1  
MIC_V  
TXA1/2_L1, SPKROUT_M Yes  
No  
Yes  
No  
6
.
Yes  
No  
7
Speaker and Mic. routed to Line via Modem RXA_L1, MIC_M TXA1/2_L1, SPKROUT_M Yes  
Yes  
No  
8
Modem connected to Speaker  
.
SPKROUT_M  
No  
Yes  
No  
9
Modem connected to Line and Speaker  
RXA_L1  
TXA1/2_L1, SPKROUT_M Yes  
Yes  
Yes  
No  
10  
11  
12  
13  
14  
15  
Speaker and Mic. routed to Line via Modem RXA_L1, MIC_M TXA1/2_L1, SPKROUT_M Yes  
Modem connected to Microphone MIC_V No  
No  
.
Yes  
No  
Speaker and Mic. routed to Line via Modem RXA_L1, MIC_M TXA1/2_L1, SPKROUT_M Yes  
Speaker and Mic. routed to Line via Modem RXA_L1, MIC_M TXA1/2_L1, SPKROUT_M Yes  
Yes  
Yes  
No  
No  
Modem connected to Headset  
MIC_V  
SPKROUT_M  
No  
Yes  
No  
Speaker and Mic. routed to Line via Modem  
Yes  
Yes  
RXA_L1, MIC_M TXA1/2_L1, SPKROUT_M  
Table 1-3. Relay Positions - VoiceView Mode  
2-Relay DAA  
Off-Hook Relay (OH_L1)  
Activated  
Voice Relay (VOICE#)  
Activated  
Stage  
Function  
1
2a  
2b  
3
On-hook  
No  
No  
No  
No  
Detected tone - on-hook  
Detected tone - off-hook for handset and speakerphone  
Off-hook  
Yes  
Yes  
No  
Yes  
1129  
ROCKWELL PROPRIETARY INFORMATION  
1-11  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
This page is intentionally blank.  
1-12  
ROCKWELL PROPRIETARY INFORMATION  
1129  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
2. TECHNICAL SPECIFICATIONS  
2.1 ESTABLISHING DATA MODEM CONNECTIONS  
Dialing  
DTMF Dialing. DTMF dialing using DTMF tone pairs is supported in accordance with ITU-T Q.23. The transmit tone level  
complies with Bell Publication 47001.  
Pulse Dialing. Pulse dialing is supported in accordance with EIA/TIA-496-A.  
Blind Dialing. The modem can blind dial in the absence of a dial tone if enabled by the X0, X1, or X3 command.  
Modem Handshaking Protocol  
If a tone is not detected within the time specified in the S7 register after the last digit is dialed, the modem aborts the call  
attempt.  
Call Progress Tone Detection  
Ringback, equipment busy, and progress tones can be detected in accordance with the applicable standard.  
Answer Tone Detection  
Answer tone can be detected over the frequency range of 2100 ± 40 Hz in ITU-T modes and 2225 ± 40 Hz in Bell modes.  
Ring Detection  
A ring signal can be detected from a TTL-compatible square wave input (frequency is country-dependent).  
Billing Protection  
When the modem goes off-hook to answer an incoming call, both transmission and reception of data are prevented for a  
period of time determined by country requirement to allow transmission of the billing signal.  
Connection Speeds  
Data modem line connection can be selected using the +MS command in accordance with V.25 ter. The +MS command  
selects modulation, enables/disables automode, and selects transmit and receive minimum and maximum line speeds.  
Automode  
Automode detection can be enabled by the +MS command to allow the modem to connect to a remote modem in  
accordance with V.25 ter.  
2.2 DATA MODE  
Data mode exists when a telephone line connection has been established between modems and all handshaking has been  
completed.  
Speed Buffering (Normal Mode)  
Speed buffering allows a DTE to send data to, and receive data from, a modem at a speed different than the line speed. The  
modem supports speed buffering at all line speeds.  
DTE-to-Modem Flow Control  
If the modem-to-line speed is less than the DTE-to-modem speed, the modem supports XOFF/XON or RTS/CTS flow control  
with the DTE to ensure data integrity.  
Escape Sequence Detection  
The “+++” escape sequence can be used to return control to the command mode from the data mode. Escape sequence  
detection is disabled by an S2 Register value greater than 127.  
GSTN Cleardown (K56flex, V.34, V.32 bis, V.32)  
Upon receiving GSTN Cleardown from the remote modem in a non-error correcting mode, the modem cleanly terminates the  
call.  
1129  
ROCKWELL PROPRIETARY INFORMATION  
2-1  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
Fall Forward/Fallback (K56flex, V.34/V.32 bis/V.32)  
During initial handshake, the modem will fallback to the optimal line connection within K56flex/V.34/V.32 bis/V.32 mode  
depending upon signal quality if automode is enabled by the +MS command.  
When connected in K56flex/V.34/V.32 bis/V.32 mode, the modem will fall forward or fallback to the optimal line speed within  
the current modulation depending upon signal quality if fall forward/fallback is enabled by the %E1 command.  
Retrain  
The modem may lose synchronization with the received line signal under poor line conditions. If this occurs, retraining may  
be initiated to attempt recovery depending on the type of connection.  
The modem initiates a retrain if line quality becomes unacceptable if enabled by the %E command. The modem continues to  
retrain until an acceptable connection is achieved, or until 30 seconds elapse resulting in line disconnect.  
2.3 ERROR CORRECTION AND DATA COMPRESSION  
V.42 Error Correction  
V.42 supports two methods of error correction: LAPM and, as a fallback, MNP 4. The modem provides a detection and  
negotiation technique for determining and establishing the best method of error correction between two modems.  
MNP 2-4 Error Correction  
MNP 2-4 is a data link protocol that uses error correction algorithms to ensure data integrity. Supporting stream mode, the  
modem sends data frames in varying lengths depending on the amount of time between characters coming from the DTE.  
V.42 bis Data Compression  
V.42 bis data compression mode operates when a LAPM or MNP connection is established.  
The V.42 bis data compression employs a “string learning” algorithm in which a string of characters from the DTE is encoded  
as a fixed length codeword. Two dictionaries, dynamically updated during normal operation, are used to store the strings.  
MNP 5 Data Compression  
MNP 5 data compression mode operates during an MNP connection.  
In MNP 5, the modem increases its throughput by compressing data into tokens before transmitting it to the remote modem,  
and by decompressing encoded received data before sending it to the DTE.  
2.4 MNP 10EC™ ENHANCED CELLULAR CONNECTION  
A traditional landline modem, when used for high-speed cellular data transmission, typically encounters frequent signal  
interference and degradation in the connection due to the characteristics of the analog cellular network. In this case, cellular-  
specific network impairments, such as non-linear distortion, fading, hand-offs, and high signal-to-noise ratio, contribute to an  
unreliable connection and lower data transfer performance. Implementations relying solely on protocol layer methods, such  
as MNP 10, generally cannot compensate for the landline modem's degraded cellular channel performance.  
The modem achieves higher cellular performance by implementing enhanced cellular connection techniques at both the  
physical and protocol layers, depending on modem model. The modem enhances the physical layer within the modulation by  
optimizing its responses to sudden changes in the cellular connection. The MNP 10EC protocol layer implemented in the  
modem software improves data error identification/correction and maximizes data throughput by dynamically adjusting speed  
and packet size based on signal quality and data error performance.  
2.5 FAX CLASS 1 OPERATION  
Facsimile functions operate in response to fax class 1 commands when +FCLASS=1.  
In the fax mode, the on-line behavior of the modem is different from the data (non-fax) mode. After dialing, modem operation  
is controlled by fax commands. Some AT commands are still valid but may operate differently than in data modem mode.  
Calling tone is generated in accordance with T.30.  
2.6 VOICE/AUDIO MODE  
Voice and audio functions are supported by the Voice Mode. Voice Mode includes three submodes: Online Voice Command  
Mode, Voice Receive Mode, and Voice Transmit Mode.  
2-2  
ROCKWELL PROPRIETARY INFORMATION  
1129  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
2.6.1 Online Voice Command Mode  
This mode results from the connection to the telephone line or a voice/audio I/O device (e.g., microphone, speaker, or  
handset) through the use of the +FCLASS=8 and +VLS commands. After mode entry, AT commands can be entered without  
aborting the connection.  
2.6.2 Voice Receive Mode  
This mode is entered when the +VRX command is active in order to record voice or audio data input at the RXA_L1 pin,  
typically from a microphone/handset or the telephone line.  
Received analog voice samples are converted to digital form and compressed for reading by the host. AT commands control  
the codec bits-per-sample rate.  
Received analog mono audio samples are converted to digital form and formatted into 8-bit unsigned linear or µ-Law PCM  
format for reading by the host. AT commands control the bit length and sampling rate. Concurrent DTMF/tone detection is  
available.  
2.6.3 Voice Transmit Mode  
This mode is entered when the +VTX command is active in order to playback voice or audio data to the TXA1_L1 output,  
typically to a speaker/handset or to the telephone line. Digitized audio data is converted to analog form then output to the  
TXA1_L1 output.  
2.6.4 Tone Detectors  
The tone detector signal path is separate from the main received signal path thus enabling tone detection to be independent  
of the configuration status. In Tone Mode, all three tone detectors are operational.  
2.6.5 Speakerphone Modes  
Speakerphone modes are selected in voice mode with the following commands:  
Speakerphone ON/OFF (+VSP). This command turns the Speakerphone function ON (+VSP = 1) or OFF (+VSP = 0).  
Microphone Gain (+VGM)=<gain>. This command sets the microphone gain of the Speakerphone function. <gain> is an  
unsigned octet where values greater than 128 indicate a gain larger than nominal and values smaller than 128 indicate a  
gain smaller than nominal.  
Speaker Gain (+VGS=<gain>). This command sets the speaker gain of the Speakerphone function. <gain> is an unsigned  
octet where values greater than 128 indicate a gain larger than nominal and values smaller than 128 indicate a gain smaller  
than normal.  
2.7 SIMULTANEOUS AUDIO/VOICE AND DATA (AudioSpan)  
The modem can operate in AudioSpan Mode if the remote modem is also configured for AudioSpan Mode operation.  
AT commands are used to select the AudioSpan Mode, to enable automatic AudioSpan modulation selection or select a  
specific AudioSpan modulation, and to enable AudioSpan data burst operation.  
V.61 modulation supports 4800 bps data speed with audio, and a data-only speed of 4800 bps.  
The AudioSpan audio interface defaults to the local handset connected to the modem and can be configured to interface  
through the modem microphone and speaker pins to support use of a headset or a speakerphone.  
2.8 HOST-BASED DSVD MODE  
Host-based DSVD operation is enabled by the -SSE or -SMS command. In Host-based DSVD Mode, the modem supports  
the transfer of data and voice occurs simultaneously during a data connection.  
2.9 FULL-DUPLEX SPEAKERPHONE (FDSP) MODE  
The modem operates in FDSP mode when +FCLASS=8 and +VSP=1 (see 2.6.5).  
In FDSP Mode, speech from a microphone or handset is converted to digital form, shaped, and output to the telephone line  
through the line interface circuit. Speech received from the telephone line is shaped, converted to analog form, and output to  
the speaker or handset. Shaping includes both acoustic and line echo cancellation.  
2.10 VOICEVIEW  
Voice and data can be alternately sent and received in a time-multiplexed fashion over the telephone line whenever the  
+FCLASS=80 command is active. This command and other VoiceView commands embedded in host communications  
1129  
ROCKWELL PROPRIETARY INFORMATION  
2-3  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
software control modem operation. Most VoiceView commands use an extended syntax starting with the characters "-S",  
which signifies the capability to switch between voice and data.  
2.11 CALLER ID  
Caller ID can be enabled/disabled using the +VCID command. When enabled, caller ID information (date, time, caller code,  
and name) can be passed to the DTE in formatted or unformatted form. Inquiry support allows the current caller ID mode  
and mode capabilities of the modem to be retrieved from the modem.  
2.12 WORLD CLASS COUNTRY SUPPORT  
The W-class models include functions which support modem operation in multiple countries. The following capabilities are  
provided in addition to the data modem functions previously described. Country dependent parameters are included in the  
.INF file for customization by the OEM.  
2.12.1 Programmable Parameters  
The following parameters are programmable:  
• Dial tone detection levels and frequency ranges.  
• DTMF dialing transmit output level, DTMF signal duration, and DTMF interdigit interval parameters.  
• Pulse dialing parameters such as make/break times, set/clear times, and dial codes.  
• Ring detection frequency range.  
• Blind dialing disable/enable.  
• The maximum, minimum, and default carrier transmit level values.  
• Calling tone, generated in accordance with V.25, may also be disabled.  
• Call progress frequency and tone cadence for busy, ringback, congested, dial tone 1, and dial tone 2.  
• Answer tone detection period.  
• On-hook/off-hook, make/break, and set/clear relay control parameters.  
2.12.2 Blacklist Parameters  
The modem can operate in accordance with requirements of individual countries to prevent misuse of the network by limiting  
repeated calls to the same number when previous call attempts have failed. Call failure can be detected for reasons such as  
no dial tone, number busy, no answer, no ringback detected, voice (rather than modem) detected, and key abort (dial  
attempt aborted by user). Actions resulting from such failures can include specification of minimum inter-call delay, extended  
delay between calls, and maximum numbers of retries before the number is permanently forbidden ("blacklisted"). Up to 20  
such numbers may be tabulated. The blacklist parameters are programmable.  
2.13 DIAGNOSTICS  
2.13.1 Commanded Tests  
Diagnostics are performed in response to &T commands per V.54.  
Analog Loopback (&T1 Command). Data from the local DTE is sent to the modem, which loops the data back to the local  
DTE.  
Analog Loopback with Self Test (&T8 Command). An internally generated test pattern of alternating 1s and 0s (reversals)  
is sent to the modem. An error detector within the modem checks for errors in the string of reversals.  
Remote Digital Loopback (RDL) (&T6 Command). Data from the local DTE is sent to the remote modem which loops the  
data back to the local DTE.  
Remote Digital Loopback with Self Test (&T7 Command). An internally generated pattern is sent from the local modem  
to the remote modem, which loops the data back to the local modem.  
Local Digital Loopback (&T3 Command). When local digital loop is requested by the local DTE, two data paths are set up  
in the local modem. Data from the local DTE is looped back to the local DTE (path 1) and data received from the remote  
modem is looped back to the remote modem (path 2).  
2.13.2 Power On Reset Tests  
Upon power on, an MDP test is performed. If the MDP is not operational, an error indication is generated.  
2.14 LOW POWER SLEEP MODE  
When not being used, the MDP is placed in a low power state.  
2-4  
ROCKWELL PROPRIETARY INFORMATION  
1129  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
3. HARDWARE INTERFACE  
3.1 HARDWARE SIGNAL PINS AND DEFINITIONS  
The RCV56HCF (PCI) functional interface signals are shown in Figure 3-1.  
The Bus Interface hardware interface signals are shown by major interface in Figure 3-2.  
The Bus Interface pin assignments for the 176-pin TQFP are shown Figure 3-3 and are listed Table 3-1.  
The Bus Interface hardware interface signals are defined in Table 3-2.  
The MDP hardware interface signals are shown by major interface in Figure 3-4.  
The MDP pin assignments for the 144-pin TQFP are shown in Figure 3-5 and are listed in Table 3-3.  
The MDP hardware interface signals are defined in Table 3-4.  
1129  
ROCKWELL PROPRIETARY INFORMATION  
3-1  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
AD[31:0]  
OH_L1#  
CID_L1#  
VOICE#  
CBE0#  
CBE1#  
CBE2#  
CBE3#  
PCICLK  
PCIRST#  
FRAME#  
IDSEL  
MUTE_L1#  
IRING_L1#  
LCS_L1#  
RH_L1#  
USED_L1  
LCS_H1#  
ORING_H1  
LCS_H2#  
ORING_H2  
PCI  
BUS  
UNIVERSAL  
DAA AND  
DEVSEL#  
IRDY#  
TELEPHONE  
INTERFACE  
TRDY#  
PAR  
REQ#  
I/O[4:0]  
GNT#  
INTA#  
STOP#  
PERR#  
SERR#  
TELIN_L1  
TELOUT_L1  
RXA_L1  
TXA1_L1  
TXA2_L1  
VC_L1  
RCV56HCF  
BUS INTERFACE  
(176-TQFP)  
[11229]  
XIN  
XOUT  
28.224 MHZ  
CRYSTAL  
CIRCUIT  
AND  
RCV56HCF  
MDP  
SPKROUT_M  
MIC_M  
MIC_V  
AUDIO  
INTERFACE  
(144-PIN TQFP)  
[R6776]  
SROMCLK  
SROMCS  
SROMIN  
256 x 16  
PCI  
SERIAL  
EEPROM  
SROMOUT  
IOM_FRAME  
IOM_CLK  
IOM_DD  
VDD  
AVDD_IA  
IOM_DU  
VDD  
AVDD  
DA[4:0]  
DD[7:0]  
ISDN  
U OR S/T  
INTERFACE  
(OPTIONAL)  
GND  
GND_IA  
AGND  
AGND_V1  
AGND_M1  
GND  
GND  
AGND  
AGND  
AGND  
DRD#  
DWR#  
ISDN_CS#  
ISDN_INT#  
DRESET  
DRESET#  
MD189F2 ISF  
Figure 3-1. RCV56HCF Interface Signals  
3-2  
ROCKWELL PROPRIETARY INFORMATION  
1129  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
27pF  
5%  
132  
131  
113  
135  
106  
105  
108  
136  
107  
103  
102  
100  
101  
147  
130  
144  
145  
143  
148  
146  
141  
140  
142  
138  
139  
167  
166  
165  
164  
170  
171  
161  
173  
172  
163  
174  
162  
158  
157  
156  
155  
154  
118  
117  
116  
115  
114  
128  
127  
126  
125  
124  
123  
122  
121  
111  
112  
104  
137  
16  
XIN  
MODEM_CS#  
MODEM_IRQ  
M_TXCLK  
M_TX  
M_RXCLK  
M_RX  
WKRES#  
SI_FRAME  
SI_CLK  
28.224 MHz  
1M  
XOUT  
27pF  
5%  
27  
25  
62  
46  
66  
63  
64  
86  
73  
61  
43  
98  
97  
96  
95  
92  
91  
90  
89  
85  
84  
81  
80  
79  
78  
75  
74  
59  
58  
57  
56  
53  
52  
51  
50  
42  
41  
40  
37  
36  
35  
34  
32  
72  
30  
29  
24  
67  
68  
69  
13  
10  
11  
12  
19  
20  
21  
22  
23  
2
PCICLK  
PCIRST#  
FRAME#  
IDSEL  
DEVSEL#  
IRDY#  
TRDY#  
CBE0#  
CBE1#  
CBE2#  
CBE3#  
AD0  
AD1  
AD2  
AD3  
AD4  
AD5  
AD6  
AD7  
AD8  
AD9  
AD10  
AD11  
AD12  
AD13  
AD14  
AD15  
AD16  
AD17  
AD18  
AD19  
AD20  
AD21  
AD22  
AD23  
AD24  
SI_DD  
SI_DU  
M_CLK  
MDP  
L85CLK  
M_RXOUT  
M_SCLK  
M_STROBE  
M_CTRL  
M_TXSIN  
V_RXOUT  
V_SCLK  
V_STROBE  
V_CTRL  
V_TXSIN  
OH_L1#  
CID_L1#  
VOICE#  
MUTE_L1#  
IRING_L1#  
LCS_L1#  
RH_L1#  
USED_L1  
LCS_H1#  
ORING_H1  
LCS_H2#  
ORING_H2  
I/O0  
PCI  
BUS  
DAA  
I/O1  
I/O2  
I/O3  
I/O4  
DA0  
DA1  
DA2  
DA3  
DA4  
PCI BUS INTERFACE  
AD25  
AD26  
AD27  
AD28  
AD29  
AD30  
AD31  
PAR  
176-TQFP  
[11229]  
DD0  
DD1  
DD2  
DD3  
DD4  
DD5  
DD6  
DD7  
MDP AND  
ISDN U OR S/T  
INTERFACE  
REQ#  
GNT#  
INTA#  
DRD#  
DWR#  
DRESET#  
DRESET  
ISDN_CS#  
ISDN_INT#  
STOP#  
PERR#  
SERR#  
SROMCLK  
SROMCS  
SROMIN  
SROMOUT  
NC  
NC  
NC  
NC  
NC  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
ISDN U OR S/T  
INTERFACE  
17  
EEPROM  
44  
47  
5
26  
38  
49  
55  
70  
76  
VIO1  
VIO2  
VDD  
VDD  
VDD  
VDD  
VDD  
VDD  
VDD  
VDD  
VDD  
VDD  
VDD  
VDD  
VDD  
VDD  
VDD  
VDD  
VGG1  
3
6
7
8
3.3 V  
88  
94  
NC  
14  
15  
45  
151  
152  
153  
160  
162  
174  
175  
110  
119  
149  
168  
83  
1
133  
134  
VDD  
4
18  
176  
28  
33  
39  
48  
54  
60  
65  
71  
77  
82  
87  
93  
99  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
1K  
1K  
31  
9
CLKRUN#  
GND  
VDD  
CARDBUS#  
GND  
109  
120  
129  
150  
159  
169  
MD189F3 11221HS-176TQFP  
Figure 3-2. Bus Interface 176-Pin TQFP Hardware Interface Signals  
1129  
ROCKWELL PROPRIETARY INFORMATION  
3-3  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
XIN  
VDD  
RESERVED  
RESERVED  
GND  
1
2
132  
131  
130  
129  
128  
127  
126  
125  
124  
123  
122  
121  
120  
119  
118  
117  
116  
115  
114  
113  
112  
111  
110  
109  
108  
107  
106  
105  
104  
103  
102  
101  
100  
99  
XOUT  
MODEM_CLK  
GND  
3
4
DD0  
VDD  
5
DD1  
RESERVED  
RESERVED  
RESERVED  
CARDBUS#  
SROMCS  
SROMIN  
SROMOUT  
SROMCLK  
RESERVED  
RESERVED  
ISDN_CS#  
ISDN_INT#  
GND  
6
DD2  
7
DD3  
8
DD4  
9
DD5  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
41  
42  
43  
44  
DD6  
DD7  
GND  
VDD  
DA0  
DA1  
DA2  
DA3  
DA4  
NC  
MODEM_CS#  
DWR#  
DRD#  
VDD  
NC  
NC  
NC  
NC  
GND  
INTA#  
M_RXCLK  
WKRES#  
M_TXCLK  
M_TX  
DRESET#  
SI_FRAME  
SI_CLK  
SI_DU  
SI_DD  
GND  
PCIRST#  
VDD  
PCICLK  
GND  
GNT#  
REQ#  
CLKRUN#  
AD31  
GND  
AD30  
98  
AD0  
AD29  
97  
AD1  
AD28  
96  
AD2  
AD27  
95  
AD3  
VDD  
94  
VDD  
GND  
93  
GND  
AD26  
92  
AD4  
AD25  
91  
AD5  
AD24  
90  
AD6  
CBE3#  
VIO1  
89  
AD7  
MS189F4-BIF-PO-176TQFP  
Figure 3-3. Bus Interface 176-Pin TQFP Pin Signals  
3-4  
ROCKWELL PROPRIETARY INFORMATION  
1129  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
Table 3-1. Bus Interface 176-Pin TQFP Pin Signals  
1
1
Pin  
Signal Label  
I/O  
Interface  
Pin  
Signal Label  
I/O  
Interface  
PCI Bus: AD7  
I/O Type  
PWR  
It  
I/O Type  
I/Opts  
I/Opts  
I/Opts  
I/Opts  
GND  
PWR  
I/Opts  
I/Opts  
I/Opts  
I/Opts  
GND  
It  
1
2
3
4
5
6
7
8
9
VDD  
P
I
To 3.3V  
To GND  
To GND  
Ground  
To 3.3V  
NC  
89  
AD7  
I/O  
RESERVED  
RESERVED  
GND  
90  
AD6  
I/O  
I/O  
I/O  
G
P
PCI Bus: AD6  
PCI Bus: AD5  
PCI Bus: AD4  
Ground  
I
It  
91  
AD5  
G
P
GND  
PWR  
Ot2  
92  
AD4  
VDD  
93  
GND  
RESERVED  
RESERVED  
RESERVED  
CARDBUS#  
SROMCS  
SROMOUT  
SROMIN  
SROMCLK  
RESERVED  
RESERVED  
ISDN_CS#  
ISDN_INT#  
GND  
O
O
O
I
94  
VDD  
To 3.3V  
Ot2  
NC  
95  
AD3  
I/O  
I/O  
I/O  
I/O  
G
I
PCI Bus: AD3  
PCI Bus: AD2  
PCI Bus: AD1  
PCI Bus: AD0  
Ground  
Ot2  
NC  
96  
AD2  
Ω
PWR  
Ot2  
VCC through 10K for PCI  
SROM Chip Select  
SROM Data Out  
SROM Data In  
SROM Clock  
NC  
97  
AD1  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
41  
42  
43  
44  
45  
46  
47  
48  
49  
50  
51  
52  
53  
54  
55  
56  
57  
58  
59  
60  
61  
62  
63  
64  
O
O
I
98  
AD0  
Ot2  
99  
GND  
It  
100  
101  
102  
103  
104  
105  
106  
107  
108  
109  
110  
111  
112  
113  
114  
115  
116  
117  
118  
119  
120  
121  
122  
123  
124  
125  
126  
127  
128  
129  
130  
131  
132  
133  
134  
135  
136  
137  
138  
139  
140  
141  
142  
143  
144  
145  
146  
147  
148  
149  
150  
151  
152  
SI_DD  
MDP: SI Data Downstream  
MDP: SI Data Upstream  
MDP: SI Clock  
MDP: SI Frame  
DB: DRESET#  
MDP: M_TX  
MDP: M_RXCLK  
Wakeup Reset  
MDP: M_RXCLK  
Ground  
O
O
I
Ot2  
SI_DU  
O
I/O  
I/O  
O
O
I
Ot2  
Ot2  
SI_CLK  
SI_FRAME  
DRESET#  
M_TX  
It/Ot  
It/Ot  
Ot2  
It  
To GND  
O
I
Ot2  
ISDN: CS# or NC  
ISDN: IRQ or to GND  
Ground  
It  
Ot2  
G
I
GND  
Itpd  
M_TXCLK  
WKRES#  
M_RXCLK  
GND  
It  
NC  
NC  
O
I
Ot12  
It  
NC  
I
It  
NC  
NC  
I
It  
NC  
G
P
GND  
PWR  
Ot2  
NC  
O
I
Ot4ts  
It  
NC  
VDD  
To 3.3V  
NC  
NC  
DRD#  
O
O
O
O
O
O
O
O
P
DB: DRD#  
DB: DWR#  
MDP: CS#  
DB: DA4  
INTA#  
O
I
Opod  
Ip  
PCI Bus: INTA#  
PCI Bus: PCIRST#  
To 3.3V  
DWR#  
Ot2  
PCIRST#  
VDD  
MODEM_CS#  
DA4  
Ot2  
P
PWR  
Ip  
Ot2  
PCICLK  
GND  
I
PCI Bus: PCICLK  
Ground  
DA3  
Ot2  
DB: DA3  
G
I
GND  
Ipts  
DA2  
Ot2  
DB: DA2  
GNT#  
PCI Bus: GNT#  
PCI Bus: REQ#  
GND through 1K  
PCI Bus: AD31  
Ground  
DA1  
Ot2  
DB: DA1  
REQ#  
O
I
Opts  
It  
DA0  
Ot2  
DB: DA0  
CLKRUN#  
AD31  
VDD  
PWR  
GND  
It/Ot2  
It/Ot2  
It/Ot2  
It/Ot2  
It/Ot2  
It/Ot2  
It/Ot2  
It/Ot2  
GND  
Ot2  
To 3.3V  
I/O  
G
I/O  
I/O  
I/O  
I/O  
P
I/Opts  
GND  
I/Opts  
I/Opts  
I/Opts  
I/Opts  
PWR  
GND  
I/Opts  
I/Opts  
I/Opts  
I/Opts  
PWR  
Itpd  
GND  
G
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
G
O
O
I
Ground  
GND  
DD7  
DB: DD7  
AD30  
PCI Bus: AD30  
PCI Bus: AD29  
PCI Bus: AD28  
PCI Bus: AD27  
To 3.3V  
DD6  
DB: DD6  
AD29  
DD5  
DB: DD5  
AD28  
DD4  
DB: DD4  
AD27  
DD3  
DB: DD3  
VDD  
DD2  
DB: DD2  
GND  
G
I/O  
I/O  
I/O  
I/O  
P
Ground  
DD1  
DB: DD1  
AD26  
PCI Bus: AD26  
PCI Bus: AD25  
PCI Bus: AD24  
PCI Bus: CBE3#  
To VIO  
DD0  
DB: DD0  
AD25  
GND  
Ground  
AD24  
MODEM_CLK  
XOUT  
MDP:XTLI  
Crystal Output  
Crystal Input  
To 3.3V  
CBE3#  
VIO1  
Ot2  
XIN  
It  
RESERVED  
IDSEL  
VIO2  
I
NC  
VDD  
P
PWR  
PWR  
It  
I
Ip  
PCI Bus: IDSEL  
To VIO  
VGG1  
P
To VDD or 3.3V  
MDP: IRQ#  
MDP: M_RX  
NC  
P
PWR  
GND  
PWR  
I/Opts  
I/Opts  
I/Opts  
I/Opts  
GND  
PWR  
I/Opts  
I/Opts  
I/Opts  
I/Opts  
GND  
I/Opts  
I/Opsts  
I/Opsts  
I/Opsts  
MODEM_IRQ  
M_RX  
I
GND  
G
P
Ground  
I
It  
VDD  
To 3.3V  
MSWRESET  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
VDD  
O
O
O
I
Ot2  
AD23  
I/O  
I/O  
I/O  
I/O  
G
P
PCI Bus: AD23  
PCI Bus: AD22  
PCI Bus: AD21  
PCI Bus: AD20  
Ground  
Ot2  
NC  
AD22  
Ot  
NC  
AD21  
It  
To GND  
AD20  
I
It2  
To GND  
GND  
I
It  
To GND  
VDD  
To 3.3V  
I
It  
To GND  
AD19  
I/O  
I/O  
I/O  
I/O  
G
I/O  
I/O  
I/O  
I/O  
PCI Bus: AD19  
PCI Bus: AD18  
PCI Bus: AD17  
PCI Bus: AD16  
Ground  
I
It2  
To GND  
AD18  
I
It  
To GND  
AD17  
O
O
O
P
Ot2  
NC  
AD16  
Ot2  
NC  
GND  
Ot2  
NC  
CBE2#  
FRAME#  
IRDY#  
TRDY#  
PCI Bus: CBE2#  
PCI Bus: FRAME#  
PCI Bus: IRDY#  
PCI Bus: TRDY#  
PWR  
GND  
Itpd  
To 3.3V  
GND  
G
I
Ground  
RESERVED  
RESERVED  
NC  
I/O  
It/Ot12  
To 3.3V through 47K  
1129  
ROCKWELL PROPRIETARY INFORMATION  
3-5  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
Table 3-1. Bus Interface 176-Pin TQFP Pin Signals  
1
1
Pin  
65  
Signal Label  
I/O  
Interface  
Pin  
Signal Label  
I/O  
Interface  
I/O Type  
GND  
I/O Type  
It/Ot12  
It/Ot12  
It/Ot12  
It/Ot12  
It/Ot12  
It/Ot12  
GND  
It/Ot12  
Ot12  
Ot12  
Ot12  
Ot12  
Ot12  
Ot12  
Ot12  
PWR  
GND  
It  
GND  
G
Ground  
153  
RESERVED  
I/O4  
I/O  
To 3.3V through 47K  
DAA: Reserved  
DAA: Reserved  
DAA: Reserved  
DAA: Reserved  
DAA: Reserved  
Ground  
66  
67  
68  
69  
70  
71  
72  
73  
74  
75  
76  
77  
78  
79  
80  
81  
82  
83  
84  
DEVSEL#  
STOP#  
PERR#  
SERR#  
VDD  
I/O  
I/O  
I/O  
I/O  
P
I/Opsts  
I/Opsts  
I/Osts  
I/Opod  
PWR  
PCI Bus: DEVSEL#  
PCI Bus: STOP#  
PCI Bus: PERR#  
PCI Bus: SERR#  
To 3.3V  
154  
155  
156  
157  
158  
159  
160  
161  
162  
163  
164  
165  
166  
167  
168  
169  
170  
171  
172  
I/O  
I/O  
I/O  
I/O  
I/O  
G
I/O3  
I/O2  
I/O1  
I/O0  
GND  
G
GND  
Ground  
GND  
PAR  
I/O  
I/O  
I/O  
I/O  
P
I/Opts  
I/Opts  
I/Opts  
I/Opts  
PWR  
PCI Bus: PAR  
PCI Bus: CBE1#  
PCI Bus: AD15  
PCI Bus: AD14  
To 3.3V  
RESERVED  
RH_L1#  
ORING_H2  
ORING_H1  
MUTE_L1#  
VOICE#  
CID_L1#  
OH_L1#  
VDD  
I/O  
O
To 3.3V through 47K  
HS: RH  
CBE1#  
AD15  
AD14  
VDD  
O
O
Ring Output Handset  
DAA: Mute Relay  
DAA: Voice Relay  
DAA: Caller ID Relay  
DAA: Off-Hook Relay  
To 3.3V  
O
GND  
G
GND  
Ground  
O
AD13  
AD12  
AD11  
AD10  
GND  
I/O  
I/O  
I/O  
I/O  
G
I/Opts  
I/Opts  
I/Opts  
I/Opts  
GND  
PCI Bus: AD13  
PCI Bus: AD12  
PCI Bus: AD11  
PCI Bus: AD10  
Ground  
O
O
P
GND  
G
Ground  
IRING_L1#  
LCS_L1#  
LCS_H1#  
I
DAA: Ring Indicate  
DAA: Line Current Sense  
VDD  
P
PWR  
To 3.3V  
I
It  
AD9  
I/O  
I/Opts  
PCI Bus: AD9  
I
It  
HS: Line Current Sense  
Handset  
85  
AD8  
I/O  
I/O  
G
I/Opts  
I/Opts  
GND  
PCI Bus: AD8  
PCI Bus: CBE0#  
Ground  
173  
174  
175  
176  
USED_L1  
LCS_H2#  
RESERVED  
GND  
I
It  
86  
CBE0#  
GND  
VDD  
I
It  
DAA: Line Current Sense  
To 3.3V through 47K  
Ground  
87  
I
It  
88  
P
PWR  
To 3.3V  
G
GND  
Notes:  
1. I/O types:  
I/Opod  
Input/Output, PCI, open drain (PCI type =o/d)  
Input/Output, PCI, sustained tristate (PCI type = s/t/s)  
Input/Output, PCI, tristate (PCI type = t/s)  
Input, PCI, totem pole (PCI type = in)  
Input, PCI (PCI type = t/s)  
I/Opsts  
I/Opts  
Ip  
Ipts  
It  
Input, TTL  
It2  
Input, TTL, 2 mA  
Itpd  
Input, TTL, internal pull-down  
Input, TTL/Output, TTL  
Input, TTL/Output, TTL, 12 mA  
Output, PCI, open drain (PCI type =o/d)  
Output, PCI, tristate (PCI type = t/s)  
Output, TTL  
It/Ot  
It/Ot12  
Opod  
Opts  
Ot  
Ot2  
Output, TTL, 2 mA  
Ot4  
Output, TTL, 4 mA  
Ot12  
Output, TTL, 12 mA  
2. NC = No external connection allowed (may have internal connection).  
3. Interface Legend:  
MDP = Modem Data Pump  
3-6  
ROCKWELL PROPRIETARY INFORMATION  
1129  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
Table 3-2. Bus Interface Pin Signal Definitions  
Label  
I/O Type  
Signal Name/Description  
SYSTEM  
XIN,  
It  
Crystal In and Crystal Out. Connect XIN and XOUT to a 28.224 MHz external crystal circuit.  
XOUT  
Ot2  
PWR  
GND  
It  
VDD  
GND  
Digital Supply Voltage. Connect to 3.3V.  
Digital Ground. Connect to digital ground.  
CARDBUS#  
CardBus Interface Select. Selects CardBus (low) or PCI Bus (high) drive strength. For PCI Bus, connect to  
VCC through 1K ohm.  
VGG1  
VIO  
PWR  
PWR  
I/O Voltage Tolerance Reference. Connect to VCC.  
I/O Signaling Voltage Source. Connect to 3.3V.  
PCI BUS INTERFACE  
PCICLK  
Ip  
PCI Bus Clock. The PCICLK (PCI Bus CLK signal) input provides timing for all transactions on PCI.  
(in)  
CLKRUN#  
Ip,  
Clock Running. CLKRUN# is an input used to determine the status of CLK and an open drain output used  
to request starting or speeding up CLK. Connect to GND through 1KΩ for PCI designs.  
(in, o/d,  
s/t/s)  
PCIRST#  
AD[31:0]  
CBE[3:0]#  
Ip  
PCI Bus Reset. PCIRST# (PCI Bus RST# signal) is used to bring PCI-specific registers, sequencers, and  
(in)  
signals to a consistent state.  
I/Opts  
(t/s)  
Multiplexed Address and Data. Address and Data are multiplexed on the same PCI pins.  
I/Opts  
(t/s)  
Bus Command and Bus Enable. Bus Command and Byte Enables are multiplexed on the same PCI pins.  
During the address phase of a transaction, C/BE[3:0]# define the bus command. During the data phase,  
C/BE[3:0]# are used as Byte Enables.  
PAR  
I/Opts  
(t/s)  
Parity. Parity is even parity across AD[31::00] and C/BE[3::0]#. The master drives PAR for address and  
write data phases; the Bus Interface drives PAR for read data phases.  
FRAME#  
IRDY#  
I/Opsts  
(s/t/s)  
Cycle Frame. FRAME# is driven by the current master to indicate the beginning and duration of an access.  
I/Opsts  
(s/t/s)  
Initiator Ready. IRDY# is used to indicate the initiating agent’s (bus master’s) ability to complete the current  
data phase of the transaction. IRDY# is used in conjunction with TRDY#.  
TRDY#  
STOP#  
IDSEL  
I/Opsts  
(s/t/s)  
Target Ready. TRDY# is used to indicate s the Bus Interface’s ability to complete the current data phase of  
the transaction. TRDY# is used in conjunction with IRDY#.  
I/Opsts  
(s/t/s)  
Stop. STOP# is asserted to indicate the Bus Interface is requesting the master to stop the current  
transaction.  
Ip  
Initialization Device. IDSEL input is used as a chip select during configuration read and write transactions.  
(in)  
DEVSEL#  
I/Opsts  
(s/t/s)  
Device Select. When actively driven, DEVSEL# indicates the driving device has decoded its address as the  
target of the current access. As an input, DEVSEL# indicates whether any device on the bus has been  
selected.  
TRDY#  
GNT#  
I/Opts  
(t/s)  
Request. TRDY# is used to indicate to the arbiter that this agent desires use of the bus.  
I/Opts  
(t/s)  
Grant. GNT# is used to indicate to the agent that access to the bus has been granted.  
1129  
ROCKWELL PROPRIETARY INFORMATION  
3-7  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
Table 3-2. Bus Interface Pin Signal Definitions (Cont’d)  
Label  
I/O Type  
Signal Name/Description  
PCI BUS INTERFACE (CONTINUED)  
PERR#  
I/Opsts  
(s/t/s)  
Parity Error. PERR# is used for the reporting of data parity errors.  
SERR#  
INTA#  
Ood  
(o/d)  
System Error. SERR# is an open drain output asserted to report address parity errors, data parity errors on  
the Special Cycle command, or any other system error where the result will be catastrophic.  
Ood  
(o/d)  
Interrupt A. INTA# is an open drain output asserted to request an interrupt.  
SERIAL EEPROM INTERFACE (NMC93C56 OR EQUIVALENT)  
Serial ROM Shift Clock. Connect to SROM SK input.  
SROMCLK  
SROMCS  
SROMIN  
Ot2  
Ot2  
It  
Serial ROM Chip Select. Connect to SROM CS input.  
Serial ROM Instruction, Address, and Data In. Connect to SROM DO output.  
SROMOUT  
Ot2  
Serial ROM Device Status and Data Out. Connect to SROM DI input.  
DAA INTERFACE  
OH_L1#  
Ot12  
Ot12  
Ot12  
Ot12  
It  
Off-Hook Relay Control. Output (typically active low) used to control the normally open off-hook relay. The  
polarity of this output is configurable.  
CID_L1#  
VOICE#  
Caller ID Relay Control. Output (typically active low) used to control the normally open Caller ID relay. The  
polarity of this output is configurable.  
Voice Relay Control. Output (typically active low) used to control the normally open. The polarity of this  
output is configurable.  
MUTE_L1#  
IRING_L1#  
Mute Relay Control. Output (typically active low) used to control the normally open mute relay. The polarity  
of this output is configurable.  
Ring Indicate. A high-going edge used to initiate presence of a ring frequency. Typically connected to the  
output of an optoisolator or equivalent. The idle state (no ringing) output of the ring detect circuit should be  
low.  
LCS_L1#  
RH_L1#  
It  
It  
Line Current Sense. Active low input used to indicate handset off-hook status.  
Remote Hangup. Active low input used to indicate hangup of the remote modem or telephone, i.e. the  
remote modem/telephone has released the line (gone on-hook).  
USED_L1  
Ot12  
Extension Offhook. Active high input used to indicate the telephone line is in use by the local handset or an  
extension phone.  
LCS_H1#  
ORING_H1  
LCS_H2#  
ORING_H2  
I/O0-I/O4  
It  
Line Current Sense Handset 1. Active low input used to indicate off-hook status from handset 1.  
Ring Output Handset 1. Active high output used to indicate ring signal to handset 1.  
Line Current Sense Handset 2. Active low input used to indicate off-hook status from handset 2.  
Ring Output Handset 2. Active high output used to indicate ring signal to handset 2.  
Reserved.  
Ot12  
It  
Ot12  
It/Ot12  
3-8  
ROCKWELL PROPRIETARY INFORMATION  
1129  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
Table 3-2. Bus Interface Pin Signal Definitions (Cont’d)  
Label  
I/O Type  
Signal Name/Description  
MDP INTERFACE  
DA0-DA4  
Ot2  
It/Ot12  
Ot2  
Ot2  
Ot2  
Ot12  
Ot2  
It  
Device Bus Address Lines 0-4. Connect to the MDP RS0-RA4 pins, respectively.  
Device Bus Data Line 0-7. Connect to the MDP D0-D7 pins, respectively.  
Device Bus Read Enable. Connect to the MDP READ# pin.  
DD0-DD7  
DRD#  
DWR#  
Device Bus Write Enable. Connect to the MDP WRITE# pin.  
DRESET#  
WKRES#  
MODEM_CS#  
MODEM_IRQ  
External Device Active Low Reset. Connect to the MDP RESET1# and RESET2# pins.  
Wakeup Reset. Active low wake input. Connect to the MDP WKRES# pin.  
MDP Data Pump Chip Select. MODEM_CS# output low selects the MDP. Connect to the MDP CS# pin.  
MDP Interrupt Request. MODEM_IRQ is the active low interrupt request from the MDP. Connect to the  
MDP IRQ pin.  
MODEM_CLK  
M_TXCLK  
M_TX  
Ot2  
It  
Modem Clock. Output clock for MDP. Connect to MDP XTLI pin.  
Modem Transmit Clock. Connect to MDP M_TXCLK pin.  
Modem Transmit Data. Connect to MDP M_TX pin.  
Modem Receive Clock. Connect to MDP M_RXCLK pin.  
Modem Receive Data. Connect to MDP M_RX pin.  
SI Frame. 8 kHz frame sync; rising edge starts frame. Connect to MDP SI_FRAME pin.  
SI Clock. Connect to MDP SI_CLK pin.  
Ot2  
It  
M_RXCLK  
M_RX  
It  
SI_FRAME  
SI_CLK  
It/Ot  
It/Ot  
It  
SI_DD  
SI Data Downstream. Connect to MDP SI_DD pin.  
SI_DU  
Ot2  
SI Data Upstream. Connect to MDP SI_DU pin.  
1129  
ROCKWELL PROPRIETARY INFORMATION  
3-9  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
Table 3-2. Bus Interface Pin Signal Definitions (Cont’d)  
Label  
I/O Type  
Signal Name/Description  
ISDN INTERFACE (NON-ISDN MODELS)  
DA0-DA3  
Ot2  
It/Ot12  
Ot2  
Ot2  
Ot2  
It  
Device Bus Address Lines 0-3. Connect to the MDP only  
Device Bus Data Line 0-7. Connect to the MDP only  
Read Enable. Connect to the MDP only  
DD0-DD7  
DRD#  
DWR#  
Write Enable. Connect to the MDP only  
ISDN_CS#  
ISDN_INT  
DRESET#  
ISDN Chip Select. Leave open.  
ISDN Interrupt Request. Connect to GND.  
Ot2  
External Device Active Low Reset. Leave open.  
ISDN INTERFACE (ISDN MODELS)  
DA0-DA3  
DD0-DD7  
DRD#  
Ot2  
It/Ot12  
Ot2  
Ot2  
Ot2  
It  
Device Bus Address Lines 0-3. Connect to the ISDN interface device A0-A3 pins, respectively.  
Device Bus Data Line 0-7. Connect to the ISDN interface device D0-D7 pins, respectively.  
Read Enable. Connect to the ISDN interface device RD# pin.  
DWR#  
Write Enable. Connect to the ISDN interface device WR# pin.  
ISDN_CS#  
ISDN_INT  
DRESET#  
ISDN Chip Select. Connect to the ISDN interface device CS# pin.  
ISDN Interrupt Request. Connect to the ISDN interface device INT# pin.  
External Device Active Low Reset. Connect to the ISDN interface device RESET# pin.  
Ot2  
Notes:  
1. I/O types:  
I/Opod  
Input/Output, PCI, open drain (PCI type =o/d)  
Input/Output, PCI, sustained tristate (PCI type = s/t/s)  
Input/Output, PCI, tristate (PCI type = t/s)  
Input, PCI, totem pole (PCI type = in)  
Input, PCI (PCI type = t/s)  
I/Opsts  
I/Opts  
Ip  
Ipts  
It  
Input, TTL  
It2  
Input, TTL, 2 mA  
Itpd  
Input, TTL, internal pull-down  
Input, TTL/Output, TTL  
Input, TTL/Output, TTL, 12 mA  
Output, PCI, open drain (PCI type =o/d)  
Output, PCI, tristate (PCI type = t/s)  
Output, TTL  
It/Ot  
It/Ot12  
Opod  
Opts  
Ot  
Ot2  
Output, TTL, 2 mA  
Ot4  
Output, TTL, 4 mA  
Ot12  
Output, TTL, 12 mA  
2. NC = No external connection allowed (may have internal connection).  
3. Interface Legend:  
MDP = Modem Data Pump  
3-10  
ROCKWELL PROPRIETARY INFORMATION  
1129  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
33  
MODEM_CLK  
141  
143  
128  
127  
78  
XTLI  
XTLO  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
NC  
MODEM_CS#  
MODEM_IRQ  
DA0  
DA1  
DA2  
DA3  
DA4  
DD0  
DD1  
DD2  
DD3  
DD4  
DD5  
DD6  
DD7  
DRD#  
DWR#  
67  
130  
11  
12  
64  
65  
66  
144  
1
3
4
6
8
112  
CS#  
IRQ  
20  
24  
22  
30  
25  
26  
28  
27  
RS0  
RS1  
RS2  
RS3  
RS4  
D0  
D1  
D2  
D3  
D4  
D5  
D6  
D7  
READ#  
WRITE#  
RESET2#  
RESET1#  
TELIN_L1  
SPKROUT_M  
TELOUT_L1  
RXA_L1  
DAA  
TXA1_L1  
TXA2_L1  
VC_L1  
VREF  
0.1 CER  
10  
10  
9
0.1 CER  
FERRITE BEAD  
BIF  
10  
69  
68  
32  
86  
13  
61  
PLLVDD  
PLLGND  
VAA  
0.1  
DRESET#  
WKRES#  
33  
29  
34  
MIC_M  
MIC_V  
MICBIAS  
72  
WKRES#  
AUDIO CIRCUIT  
SI_FRAME  
SI_CLK  
SI_DD  
97  
98  
100  
99  
SI_FRAME  
SI_CLK  
SI_DD  
43  
44  
46  
47  
45  
42  
106  
94  
93  
89  
87  
91  
88  
90  
103  
73  
104  
58  
55  
53  
54  
56  
57  
MCLKIN  
MTXSIN  
MRXOUT  
MSTROBE  
MSCLK  
SI_DU  
SI_DU  
M_TX  
77  
76  
71  
M_TX  
M_TXCLK  
M_RXCLK  
M_RX  
M_TXCLK  
M_RXCLK  
M_RX  
MCNTRLSIN  
SR1IO  
111  
MODEM  
DATA PUMP  
(MDP)  
144-TQFP  
[R6776]  
IA1CLK  
SA1CLK  
SR4IN  
SR4OUT  
CLKOUT  
SR3OUT  
SR3IN  
SA2CLK  
SR2CLK  
SR2IO  
VCNTRLSIN  
VSCLK  
VSTROBE  
VRXOUT  
VTXSIN  
79  
107  
137  
138  
74  
VDD  
VDD  
VDD  
VDD  
RESERVED  
NC  
VDD  
NC  
140  
50  
23  
37  
AVDD  
AVAA  
AVDD  
VAA  
52  
60  
84  
109  
121  
132  
51  
GND  
GND  
GND  
GND  
GND  
GND  
VSUB  
VCLKIN  
GND  
113  
59  
SLEEPO  
IASLEEP  
95  
96  
62  
IOM_FRAME  
IOM_CLK  
IOM_DD  
ISDN  
U OR S/T  
INTERFACE  
14  
18  
19  
21  
31  
49  
AGND  
AGND  
AGND  
AGNDV  
AGNDM  
AGND  
124  
IOM_DU  
AGND  
85  
133  
MK5  
MK4  
NC  
GND  
15  
16  
17  
41  
70  
40  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
SET3V#  
GND  
134  
108  
5
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
81  
83  
2
129  
125  
82  
105  
142  
101  
110  
114  
115  
116  
117  
118  
119  
120  
126  
131  
135  
136  
NC  
63  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
122  
123  
7
102  
92  
75  
80  
36  
48  
35  
38  
39  
139  
NC  
NC  
MD189F5 MDPHI  
Figure 3-4. MDP 144-Pin TQFP Hardware Interface Signals  
ROCKWELL PROPRIETARY INFORMATION  
1129  
3-11  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
108  
RESERVED  
VDD  
D1  
RESERVED  
D2  
1
2
107  
106  
105  
104  
103  
102  
101  
100  
99  
SR1IO  
3
NC  
D3  
4
SR2IO  
RESERVED  
D4  
5
SA2CLK  
RESERVED  
RESERVED  
SI_DD  
6
RESERVED  
D5  
7
8
D6  
9
SI_DU  
D7  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
98  
SI_CLK  
RS0  
97  
SI_FRAME  
IOM_CLK  
IOM_FRAME  
IA1CLK  
RS1  
96  
PLLVDD  
AGND  
95  
94  
NC  
93  
SA1CLK  
RESERVED  
CLKOUT  
SR3IN  
NC  
92  
NC  
91  
AGND  
90  
AGND  
89  
SR4IN  
TELIN_L1  
AGNDV  
TELOUT_L1  
AVAA  
88  
SR3OUT  
SR4OUT  
RESET1#  
MK5  
87  
86  
85  
SPKROUT_M  
TXA1_L1  
TXA2_L1  
VREF  
84  
GND  
83  
NC  
82  
RESERVED  
NC  
81  
VC_L1  
MIC_V  
RXA_L1  
AGNDM  
RESET2#  
MIC_M  
MICBIAS  
RESERVED  
SPKMD  
80  
RESERVED  
VDD  
79  
78  
RESERVED  
M_TX  
77  
76  
M_TXCLK  
RESERVED  
RESERVED  
SR2CLK  
75  
74  
73  
MS181F6 PO-MDP144T  
Figure 3-5. MDP 144-Pin TQFP Pin Signals  
3-12  
ROCKWELL PROPRIETARY INFORMATION  
1129  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
Table 3-3. MDP Pin Signals - 144-Pin TQFP  
3
Pin  
Signal Label  
I/O  
Pin  
Signal Label  
I/O  
Interface  
Interface  
1
1
Type  
Type  
1
D1  
IA/OB  
BIF: DD1  
NC  
73  
74  
75  
76  
77  
78  
79  
80  
81  
82  
83  
84  
85  
SR2CLK  
DI  
To VSCLK (55)  
2
RESERVED  
D2  
RESERVED  
RESERVED  
M_TXCLK  
M_TX  
NC  
3
IA/OB  
IA/OB  
BIF: DD2  
BIF: DD3  
NC  
NC  
4
D3  
OA  
IA  
BIF: M_TXCLK  
5
RESERVED  
D4  
BIF: M_TX  
6
IA/OB  
OA  
BIF: DD4  
Controller  
BIF: DD5  
BIF: DD6  
BIF: DD7  
BIF: DA0  
BIF: DA0  
RESERVED  
VDD  
NC  
7
SYCLK  
D5  
PWR  
VCC  
8
IA/OB  
IA/OB  
IA/OB  
IA  
RESERVED  
NC  
NC  
9
D6  
NC  
10  
11  
12  
13  
D7  
RESERVED  
NC  
NC  
RS0  
NC  
RS1  
IA  
GND  
GND  
IA  
DGND  
PLLVDD  
PLL  
To VAA and to AGND  
MK5  
PLL Circuit Strap Option; NC  
µ
F
through 0.1  
AGND  
NC  
14  
15  
16  
17  
18  
19  
AGND  
NC  
GND  
86  
87  
88  
89  
90  
91  
RESET1#  
SR4OUT  
SR3OUT  
SR4IN  
IA  
DI  
DI  
DI  
DI  
DI  
BIF: DRESET#  
To MTXSIN (44)  
NC  
NC  
To VTXSIN (56)  
NC  
NC  
To MRXOUT (46)  
AGND  
AGND  
GND  
GND  
AGND  
AGND  
SR3IN  
To VRXOUT (54)  
CLKOUT  
To MCLKIN (43) & VCLKIN  
(57)  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
41  
42  
43  
44  
45  
46  
47  
48  
49  
50  
51  
52  
53  
54  
55  
56  
57  
58  
59  
60  
TELIN_L1  
AGNDV  
I(DA)  
GND  
DAA  
AGND  
DAA  
VAA  
92  
93  
94  
95  
96  
97  
98  
99  
RESERVED  
SA1CLK  
NC  
DI  
To MSTROBE (47)  
TELOUT_L1  
AVAA  
O(DD)  
PWR  
O(DF)  
O(DD)  
O(DD)  
REF  
IA1CLK  
DI  
To MSCLK (45)  
IOM_FRAME  
IOM_CLK  
SI_FRAME  
SI_CLK  
IA/OB  
IA/OB  
IA/OB  
IA/OB  
IA  
ISDN: FSC  
SPKROUT_M  
TXA1_L1  
TXA2_L1  
VREF  
Audio Circuit  
DAA  
ISDN: DCL  
BIF: SI_FRAME  
DAA  
BIF: SI_CLK  
VC_L1 through capacitors  
AGND through capacitors  
Audio Circuit  
DAA  
SI_DU  
BIF: SI_DU  
VC_L1  
REF  
100  
101  
102  
103  
104  
105  
106  
107  
108  
109  
110  
111  
112  
113  
114  
115  
116  
117  
118  
119  
120  
121  
122  
123  
124  
125  
126  
127  
128  
129  
130  
131  
132  
SI_DD  
OA  
BIF: SI_DD  
MIC_V  
I(DA)  
I(DA)  
GND  
IA  
RESERVED  
RESERVED  
SA2CLK  
NC  
RXA_L1  
AGNDM  
RESET2#  
MIC_M  
NC  
AGND  
DI  
DI  
To VSTROBE (53)  
BIF: DRESET#  
Audio Circuit  
Audio Circuit  
NC  
SR2IO  
To VCNTRLSIN (58)  
I(DA)  
NC  
NC  
MICBIAS  
RESERVED  
SPKMD  
SR1IO  
DI  
To MCNTRLSIN (42)  
VDD  
PWR  
VCC  
OA  
Sounducer  
VCC  
RESERVED  
GND  
NC  
AVDD  
PWR  
GND  
OA  
DI  
DGND  
RESERVED  
RESERVED  
SET3V#  
NC  
NC  
RESERVED  
M_RX  
NC  
NC  
BIF: M_RX  
IA  
To GND  
RESERVED  
SLEEPO  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
GND  
NC  
NC  
To IASLEEP (59)  
MCNTRLSIN  
MCLKIN  
MTXSIN  
MSCLK  
DI  
DI  
DI  
DI  
DI  
DI  
To SR1IO (106)  
To CLKOUT (91)  
To SR4OUT (87)  
To IA1CLK (94)  
To SR4IN (89)  
To SA1CLK (93)  
NC  
NC  
NC  
NC  
NC  
MRXOUT  
MSTROBE  
RESERVED  
AGND  
NC  
NC  
NC  
GND  
PWR  
GND  
GND  
DI  
AGND  
GND  
OA  
DGND  
AVDD  
VCC  
YCLK  
NC  
VSUB  
AGND  
XCLK  
OA  
NC  
GND  
DGND  
IOM_DU  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
IRQ  
OA  
ISDN: DIN  
VSTROBE  
VRXOUT  
VSCLK  
To SA2CLK (103)  
To SR3IN (90)  
To SR2CLK (73)  
To SR3OUT (88)  
To CLKOUT (91)  
To SR2IO (104)  
To SLEEPO (113)  
DGND  
NC  
DI  
NC  
DI  
NC  
VTXSIN  
VCLKIN  
VCNTRLSIN  
IASLEEP  
GND  
DI  
NC  
DI  
NC  
DI  
IA  
BIF: MODEM_IRQ  
DI  
RESERVED  
GND  
NC  
GND  
GND  
DGND  
1129  
ROCKWELL PROPRIETARY INFORMATION  
3-13  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
Table 3-3. MDP Pin Signals - 144-Pin TQFP (Continued)  
Pin  
Signal Label  
I/O  
Interface3  
Pin  
Signal Label  
I/O  
Interface  
1
1
Type  
Type  
61  
PLLGND  
PLL  
To AGND  
133  
MK4  
IA  
PLL Circuit Strap Option;  
GND  
NC  
62  
63  
64  
65  
66  
67  
68  
69  
70  
71  
72  
IOM_DD  
RESERVED  
RS2  
IA  
ISDN: DOUT  
NC  
136  
135  
136  
137  
138  
139  
140  
141  
142  
143  
144  
RESERVED  
RESERVED  
RESERVED  
VDD  
NC  
IA  
IA  
IA  
IA  
IA  
IA  
BIF: DA02  
BIF: DA03  
BIF: DA04  
BIF: MODEM_CS#  
BIF: DRD#  
BIF: DWR#  
NC  
NC  
RS3  
PWR  
PWR  
VCC  
VCC  
NC  
RS4  
VDD  
~CS  
RESERVED  
VTH2  
Ω
DWR#  
DRD#  
IA  
I
VDD through 10K  
BIF: L85CLK  
NC  
XTLI  
NC  
NC  
M_RXCLK  
WKRES#  
OA  
OA  
BIF: M_RXCLK  
BIF: WKRES#  
XTLO  
O
NC  
D0  
IA/OB  
BIF: DD0  
Notes:  
1.  
I/O types:  
IA, IB = Digital input; OA, OB = Digital output (see Table 3-9).  
I(DA) = Analog input; O(DD), O(DF) = Analog output (see Table 3-10).  
DI = Device interconnect.  
2.  
3.  
NC = No external connection allowed (may have internal connection).  
Interface Legend:  
MDP = Modem Data Pump  
BIF = Bus Interface Device  
ISDN = ISDN U or S/T interface device.  
3-14  
ROCKWELL PROPRIETARY INFORMATION  
1129  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
Table 3-4. MDP Pin Signal Definitions  
Label  
I/O Type  
Signal/Definition  
OVERHEAD SIGNALS  
XTLI  
I
Crystal Int. Connect the BIF MODEMCLK pin through a 33 Ω resistor.  
Crystal Out. Leave open.  
XTLO  
O
VDD,  
PWR  
Digital Power Supply. To +3.3V and digital circuits power supply filter.  
AVDD  
AVAA  
GND  
PWR  
GND  
GND  
IA  
Analog Power Supply. To +3.3V and analog circuits power supply filter.  
Digital Ground. Connect to digital ground.  
AGND  
Analog Ground. Connect to analog ground.  
SET3V#  
Set 3.3V Analog Reference. Connect to digital ground.  
BIF TO MDP INTERFACE  
RS0–RS4  
D0-D7  
IA  
Address Lines 0-4. Connect to the BIF DA0–DA4 pins, respectively.  
Data Line 0-7. Connect to the BIF DD0-DD7 pins, respectively.  
Read Enable. Connect to BIF DRD# pin.  
IA/OA  
IA  
READ#  
WRITE#  
IA  
Write Enable. Connect to BIF DWR# pin.  
RESET1#,  
RESET2#  
IA  
External Device Active Low Reset. Connect to the BIF DRESET# pin.  
WKRES#  
CS#  
OA  
IA  
Wakeup Reset. Active low wake-up output. Connect to the BIF WKRES# pin.  
Chip Select. CS# output low selects the MDP. Connect to the BIIF MODEM_CS# pin.  
IRQ  
OA  
Interrupt Request. MODEM_IRQ is the active low interrupt request from the MDP. Connect to the BIF  
MODEM_IRQ pin.  
M_TXCLK  
M_TX  
OA  
Modem Transmit Clock. Connect to BIF M_TXCLK pin.  
Modem Transmit Data. Connect to BIF M_TX pin.  
IA  
M_RXCLK  
M_RX  
OA  
Modem Receive Clock. Connect to BIF M_RXCLK pin.  
Modem Receive Data. Connect to BIF M_RX pin.  
OA  
SI_FRAME  
SI_CLK  
SI_DD  
IA/OB  
IA/OB  
OA  
ISDN Frame. 8 kHz frame sync; rising edge starts frame. Connect to BIF SI_FRAME pin.  
ISDN Clock. 1.536 MHz clock. Connect to BIF SI_CLK pin.  
ISDN Data Downstream. Connect to BIF SI_DD pin.  
SI_DU  
IA  
ISDN Data Upstream. Connect to BIF SI_DU pin.  
MDP TO SIEMENS PSB2186 S/T INTERFACE  
IOM_FRAME  
IA/OB  
ISDN Frame Synchronization Clock. 8 kHz frame sync; rising edge starts frame. The start of the B1  
channel in time-slot 0 is marked. Connect to the ISDN device FSC pin.  
IOM_CLK  
IOM_DD  
IOM_DU  
IA/OB  
IA  
ISDN Clock. 1.536 MHz clock. Connect to the ISDN device DCL pin.  
ISDN Data Downstream. IOM data input synchronous to IOM_CLK. Connect to the ISDN device DOUT pin.  
OA  
ISDN Data Upstream. IOM data output synchronous to IOM_CLK. Connect to the ISDN device DIN pin.  
MDP TO SIEMENS PSB21910 U INTERFACE  
IOM_FRAME  
IA/OB  
ISDN Frame Synchronization Clock. 8 kHz frame sync; rising edge starts frame. The start of the B1  
channel in time-slot 0 is marked. Connect to the ISDN device FSC pin.  
IOM_CLK  
IOM_DD  
IOM_DU  
IA/OB  
IA  
ISDN Clock. 1.536 MHz clock. Connect to the ISDN device DCL pin.  
ISDN Data Downstream. IOM data input synchronous to IOM_CLK. Connect to the ISDN device DOUT pin.  
ISDN Data Upstream. IOM data output synchronous to IOM_CLK. Connect to the ISDN device DIN pin.  
OA  
1129  
ROCKWELL PROPRIETARY INFORMATION  
3-15  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
Table 3-4. MDP Signal Definitions (Cont'd)  
Label  
I/O Type  
Signal Name/Description  
TELEPHONE LINE/TELEPHONE/AUDIO INTERFACE SIGNALS AND REFERENCE VOLTAGE  
TXA1_L1  
O(DF)  
I(DA)  
O(DF)  
I(DA)  
Transmit Analog 1 and 2. The TXA1_L1 and TXA2_L1 outputs are differential outputs 180 degrees out of  
phase with each other. Each output can drive a 300 Ω load.  
TXA2_L1  
RXA_L1  
Receive Analog. RXA_L1 is a single-ended receive data input from the telephone line interface or an optional  
external hybrid circuit. The input impedance is > 70k Ω.  
TELOUT_L1  
TELIN_L1  
Telephone Handset Analog Output. TELOUT_L1 is a single-ended analog output to the telephone handset  
speaker interface circuit. TELOUT_L1 can drive a 300 Ω load.  
Telephone Handset Analog Input. TELIN_L1 is a single-ended analog input from the telephone handset  
microphone interface circuit. The input impedance is > 70k Ω.  
MIC_M  
I(DA)  
I(DA)  
O(DF)  
Modem Microphone Input. MIC_M is a single-ended microphone input. The input impedance is > 70k Ω.  
Voice Microphone Input. MIC_V is a single-ended microphone input. The input impedance is > 70k Ω.  
MIC_V  
SPKROUT_M  
Modem Speaker Analog Output. The SPKROUT_M analog output reflects the received analog input signal.  
The SPKROUT_M on/off and three levels of attenuation are controlled by bits in DSP RAM. When the speaker  
is turned off, the SPKROUT_M output is clamped to the voltage at the VC_L1 pin. The SPKROUT_M output  
can drive an impedance as low as 300 ohms. In a typical application, the SPKROUT_M output is an input to  
an external LM386 audio power amplifier.  
VREF  
REF  
REF  
High Voltage Reference. Connect to VC_L1 through 10 µF (polarized, + terminal to VREF) and 0.1 µF  
(ceramic) in parallel.  
VC_L1  
Low Voltage Reference. Connect to analog ground through 10 µF (polarized, + terminal to VC_L1) and  
0.1 µF (ceramic) in parallel.  
PLLVDD  
PLLGND  
MK4, MK5  
PLL  
PLL  
IA  
PLLVDD Connection. Connect to VAA and to AGND through 0.1 µF.  
PLLGND Connection. Connect to AGND.  
PLL Circuit Strap Option. Connect MK4 to digital ground and leave MK5 open in order to enable the internal  
PLL circuit.  
SPKMD  
OA  
Modem Speaker Digital Output. The SPKMD digital output reflects the received analog input signal digitized  
to TTL high or low level by an internal comparator to create a PC Card (PCMCIA)-compatible signal.  
3-16  
ROCKWELL PROPRIETARY INFORMATION  
1129  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
Table 3-4. MDP Signal Definitions (Cont'd)  
Label  
I/O Type  
Signal Name/Description  
MODEM INTERCONNECT/NO CONNECT  
GPO0  
DI  
DI  
DI  
DI  
DI  
DI  
DI  
DI  
DI  
DI  
DI  
DI  
DI  
DI  
DI  
DI  
DI  
DI  
DI  
DI  
DI  
DI  
DI  
DI  
DI  
DI  
To M_RXCLK  
To IASLEEP  
To SLEEPO  
To IA1CLK  
SLEEPO  
IASLEEP  
MSCLK  
CLKOUT  
SR1IO  
To MCLKIN & VCLKIN  
To MCTRLSIN  
To MRXOUT  
To MSCLK  
SR3IN  
IA1CLK  
SA1CLK  
SR4OUT  
MCLKIN  
VCLKIN  
MSTROBE  
VSTROBE  
MCTRLSIN  
VSCLK  
To MSTROBE  
To MTXSIN  
To CLKOUT  
To CLKOUT  
To SA1CLK  
To SA2CLK  
To SR1IO  
To SR2CLK  
To SR2IO  
VCTRLSIN  
MRXOUT  
VTXSIN  
VRXOUT  
MTXSIN  
SR2IO  
To SR3IN  
To SR3OUT  
To SR4IN  
To SR4OUT  
To VCTRLSIN  
To VRXOUT  
To VSCLK  
SR4IN  
SR2CLK  
SA2CLK  
SR3OUT  
RESERVED  
To VSTROBE  
To VTXSIN  
Reserved Function. May be connected to internal circuit. Leave open.  
1129  
ROCKWELL PROPRIETARY INFORMATION  
3-17  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
3.2 ELECTRICAL,SWITCHING,AND ENVIRONMENTAL CHARACTERISTICS  
3.2.1 Power and Maximum Ratings  
The current and power requirements are listed in Table 3-5.  
The absolute maximum ratings are listed in Table 3-6.  
Table 3-5. Current and Power Requirements  
Current  
Power  
Typical  
Maximum  
Typical  
Maximum  
Mode  
Current (mA)  
Current (mA)  
Power (mW)  
Power (mW)  
Notes  
Bus Interface (11229)  
f
f
= 28.224 MHz  
IN  
Operating  
145  
186  
479  
670  
Modem Data Pump (R6776)  
= 28.224 MHz  
IN  
Operating  
Sleep  
58  
68  
—
191  
5.9  
245  
—
1.8  
Total  
MDP Operating  
MDP Sleep  
203  
147  
254  
—
670  
485  
915  
—
Notes:  
Operating voltage: VDD = 3.3V ± 0.3V.  
Test conditions: VDD = 3.3 VDC for typical values; VDD = 3.6 VDC for maximum values.  
Table 3-6. Maximum Ratings  
Parameter  
Symbol  
Limits  
Units  
Supply Voltage  
Input Voltage  
V
-0.5 to +4.6  
-0.5 to (VCC +0.5)  
-0 to +70  
V
DD  
V
V
°C  
°C  
V
IN  
Operating Temperature Range  
Storage Temperature Range  
Analog Inputs  
T
A
T
-55 to +125  
-0.3 to (VAA+ 0.3)  
-0.5 to (VCC + 0.5)  
±20  
STG  
V
IN  
Voltage Applied to Outputs in High Impedance (Off) State  
DC Input Clamp Current  
V
V
HZ  
I
mA  
mA  
V
IK  
DC Output Clamp Current  
I
±20  
OK  
Static Discharge Voltage (25°C)  
Latch-up Current (25°C)  
V
±2500  
ESD  
I
±400  
mA  
TRIG  
3-18  
ROCKWELL PROPRIETARY INFORMATION  
1129  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
3.2.2 PCI Bus  
Table 3-7 summarizes the PCI DC specifications for 3.3V signaling.  
Table 3-8 summarizes the PCI AC specifications for 3.3V signaling.  
Table 3-7. PCI Bus DC Specifications for 3.3V Signaling  
Symbol  
Vcc  
Parameter  
Supply Voltage  
Condition  
Min  
Max  
Units  
Notes  
3.0  
3.6  
V
Vih  
Input High Voltage  
0.5Vcc  
-0.5  
Vcc +0.5  
0.3Vcc  
V
Vil  
Input Low Voltage  
V
Vipu  
Iil  
Input Pull-up Voltage  
Input Low Leakage Current  
Output High Voltage  
Output Low Voltage  
Input Pin Capacitance  
CLK Pin Capacitance  
IDSEL Pin Capacitance  
Pin Inductance  
0.7VCC  
V
0<Vin <2Vcc  
Iout = -0.5 mA  
Iout = 1.5 mA  
±10  
µA  
V
Voh  
Vol  
0.9Vcc  
5
0.1Vcc  
10  
V
Cin  
pF  
pF  
pF  
nH  
Cclk  
CIDSEL  
Lpin  
12  
8
20  
Table 3-8. PCI Bus AC Specifications for 3.3V Signaling  
Symbol  
Parameter  
Condition  
0<Vout <0.3Vcc  
Min  
Max  
Units  
mA  
Notes  
IOH(AC)  
Switching Current High  
-12Vcc  
0.3Vcc<Vout <0.9Vcc  
0.7Vcc<Vout <Vcc  
Vout = 0.7Vcc  
-17.1(Vout -Vout)  
mA  
Equation C  
-32Vcc  
(Test Point)  
mA  
mA  
mA  
IOL(AC)  
Switching Current Low  
Vout > Vout>0.6Vcc  
0.6Vcc>Vout> 0.1Vcc  
0.18Vcc>Vout >0  
Vout = 0.18Vcc  
16Vcc  
Vout /0.023  
Equation D  
38Vcc  
(Test Point)  
mA  
Icl  
Low Clamp Current  
High Clamp Current  
Output Rise Slew Rate  
Output Fall Slew Rate  
-3 < Vin ≤−1  
-25+(Vin +1)/0.015  
mA  
Ich  
Vcc+4 > Vin > Vcc+1  
0.2Vcc - 0.6Vcc load  
0.6Vcc - 0.2Vcc load  
25+(Vin -Vcc +1)/0.015  
mA  
slew r  
slew f  
Notes:  
1
1
5
5
V / ns  
V / ns  
Equation C: Ioh = (0.98/Vcc) * (Vout - Vcc) * (Vout + 0.4Vcc) for Vcc > Vout > 0.7Vcc.  
Equation D: Iol = (256/Vcc) * Vout * (Vcc - Vout) for 0V < Vout < 0.18Vcc.  
See PCI Bus Specification for complete details.  
1129  
ROCKWELL PROPRIETARY INFORMATION  
3-19  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
3.2.3 MDP  
The MDP digital electrical characteristics for the hardware interface signals are listed in Table 3-9.  
The MDP analog electrical characteristics for the hardware interface signals are listed in Table 3-10.  
Table 3-9. MDP Digital Electrical Characteristics  
Parameter  
Symbol  
Min.  
Typ.  
Max.  
Units  
VDC  
1
Test Conditions  
Input High Voltage  
V
I
IH  
Type IA  
Type IE  
Input High Current  
2.0  
–
–
4.0  
VCC + 0.3  
–
Note 2.  
= 3.6 V, V  
µA  
V
= 3.6 V  
IN  
IH  
CC  
Type IB  
–
–
40  
Input Low Voltage  
V
VDC  
IL  
Type IA  
Type IE  
Input Low Current  
–0.3  
–
–
–
1.0  
–
0.8  
–
-40  
Note 2.  
I
µA  
IL  
Input Leakage Current  
Output High Voltage  
Type OA  
I
±2.5  
µADC  
VDC  
V
= 0 to 3.3V, V  
= 3.6 V  
IN  
IN  
CC  
V
V
I
OH  
2.4  
2.4  
–
–
–
–
I
= – 100 µA  
= 0 mA  
LOAD  
LOAD  
Type OB  
I
Output Low Voltage  
Type OA  
VDC  
OL  
–
–
–
–
0.4  
0.4  
±10  
I
= 1.6 mA  
= 0.8 mA  
LOAD  
Type OB  
I
LOAD  
Three-State (Off) Current  
Capacitive Load  
µADC  
pF  
V
= 0 V to VCC  
TSI  
IN  
C
L
Types IA and ID  
Type IB  
–
–
10  
20  
Capacitive Drive  
C
pF  
D
Types OA and OB  
Circuit Type  
Type IA  
–
10  
TTL  
Type IB  
Type ID  
TTL with pull-up  
~RES  
Types OA and OB  
TTL with 3-state  
Notes:  
1. Test Conditions: VCC = 3.3V ±0.3V, TA = 0°C to 70°C, (unless otherwise stated).  
Output loads: Data bus (D0-D7), address bus (A0-A15), chip selects,  
DRD#, and DWR# loads = 70 pF + one TTL load.  
Other = 50 pF + one TTL load.  
2. Type IE inputs are centered approximately 2.5 V and swing 1.5 V  
in each direction.  
PEAK  
3. Type OE outputs provide oscillator feedback when operating with an external crystal.  
3-20  
ROCKWELL PROPRIETARY INFORMATION  
1129  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
Table 3-10. Analog Electrical Characteristics  
Characteristic  
Name  
RXA_L1,  
Type  
I (DA)  
Value  
Input Impedance  
> 70K Ω  
1.1 VP-P**  
+2.5 VDC  
300 Ω  
TELIN_L1  
AC Input Voltage Range  
Reference Voltage  
Minimum Load  
TXA1_L1  
O (DD)  
TXA2_L1  
Maximum Capacitive Load  
Output Impedance  
0 µF  
TELOUT_L1  
10 Ω  
AC Output Voltage Range  
Reference Voltage  
DC Offset Voltage  
2.2 VP-P  
+2.5 VDC  
± 200 mV  
> 70K Ω  
1.7 VP-P  
+2.5 VDC  
300 Ω  
MIC_M  
MIC_V  
I (DA)  
Input Impedance  
Maximum AC Input Voltage  
Reference Voltage*  
Minimum Load  
SPKROUT_M  
O (DF)  
Maximum Capacitive Load  
Output Impedance  
0.01 µF  
10 Ω  
AC Output Voltage Range  
Reference Voltage  
DC Offset Voltage  
1.1 VP-P  
+2.5 VDC  
± 20 mV  
* Reference Voltage provided internal to the device.  
** Corresponds to 2.2 VP-P at Tip and Ring.  
1129  
ROCKWELL PROPRIETARY INFORMATION  
3-21  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
3.3 INTERFACE TIMING AND WAVEFORMS  
3.3.1 PCI Bus Timing  
The PCI interface timing conforms to the PCI Local Bus Specification, Production Version, Revision 2.1, June 1, 1995.  
3.3.2 Serial EEPROM Timing  
The serial EEPROM interface timing is listed in Table 3-11 and is shown in Figure 3-6.  
Table 3-11. Timing - Serial EEPROM Interface  
Symbol  
Parameter  
Chip select setup  
Min  
Typ.  
Max  
Units  
Test Condition  
t
t
t
t
t
t
t
t
t
t
400  
500  
–
ns  
CSS  
Chip select hold  
Data output setup  
Data output hold  
Data input delay  
Data input delay  
Data input disable time  
Status valid  
400  
400  
400  
–
500  
500  
500  
–
–
–
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
CSH  
DOS  
DOH  
PD0  
PD1  
DF  
–
400  
400  
100  
100  
–
–
–
–
–
–
–
SV  
Clock high  
500  
500  
–
SKH  
SKL  
Clock low  
–
–
SROMCS (CS)  
SROMCLK (SK)  
SROMOUT (DI)  
t
t
CSS  
CSH  
t
t
SKL  
SKH  
t
t
t
DOH  
PD0  
DOS  
t
t
DF  
PD1  
SROMIN (DO) (READ)  
t
DF  
t
SV  
SROMIN (DO) (PROGRAM)  
1123F3-7 EEPROM  
Figure 3-6. Waveforms - Serial EEPROM Interface  
3-22  
ROCKWELL PROPRIETARY INFORMATION  
1129  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
3.3.3 External Device Bus Timing  
The external Device Bus timing is listed in Table 3-12 and illustrated in Figure 3-7.  
Table 3-12. Timing - External Device Bus Interface  
Symbol  
Description  
Min.  
Typ.  
Read  
Max.  
Units  
Test Conditions  
t
t
t
t
t
t
t
40  
10  
40  
108  
150  
–
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Address setup  
–
–
–
–
–
–
–
–
–
AS  
Address hold  
AH  
Chip select setup  
Chip select hold  
Read pulse width  
Read data access  
Read data hold  
–
CSS  
CSH  
RW  
144  
–
36  
–
RDA  
RDH  
0
Write  
t
t
t
t
t
t
t
40  
10  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Address setup  
Address hold  
–
–
–
–
–
–
–
–
–
AS  
AH  
40  
Chip select setup  
Chip select hold  
Write pulse width  
Write data setup  
Write data hold  
–
CSS  
CSH  
WW  
WDS  
RDH  
108  
150  
36  
144  
–
–
36  
72  
1129  
ROCKWELL PROPRIETARY INFORMATION  
3-23  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
t
t
AH  
AS  
DA0 - DA4  
ISDN_CS#  
t
t
CSS  
CSH  
t
RW  
DRD#  
t
RDH  
t
RDA  
DD0-DD7  
Read data valid  
a. Read  
t
t
AH  
AS  
DA0 - DA4  
ISDN_CS#  
t
t
CSS  
CSH  
t
WW  
DWR#  
t
t
WDH  
WDS  
DD0-DD7  
Write data valid  
a. Write  
1123F3-8 EB  
Figure 3-7. Waveforms - External Device Bus Interface  
3-24  
ROCKWELL PROPRIETARY INFORMATION  
1129  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
3.3.4 IOM-2 Interface  
The interface timing is listed in Table 3-13 and shown in Figure 3-8.  
Table 3-13. Timing - IOM-2 Interface  
Symbol  
Parameter  
Min  
Typ.  
Max  
Units  
Test Condition  
= 25 pF  
t
t
Data clock (DCL) and frame  
sync (FSC) rise/fall  
–
–
30  
ns  
C
C
r, f  
L
t
t
Data clock period (note 1)  
565  
200  
651  
310  
735  
420  
ns  
ns  
= 25 pF  
DCL  
L
t
Data clock pulse width high/low  
(note 1)  
wH, wL  
t
t
t
t
t
t
Data setup  
32  
32  
0
–
–
–
–
ns  
ns  
ns  
ns  
ns  
ns  
sD  
Data hold  
hD  
Frame advance  
Frame hold  
65  
–
130  
–
C
C
C
C
= 25 pF  
= 25 pF  
= 150 pF  
= 150 pF  
dF  
L
L
L
L
20  
–
hF  
Data delay clock  
Data delay frame  
20  
–
100  
150  
dDC  
dDF  
–
Notes:  
1. 768 bps.  
IOM_CLK (DCL)  
IOM_FRAME (FSC)  
IOM_DD (DD)  
IOM_DU (DU)  
Bit N  
Bit 0  
Bit 1  
Bit 2  
Detail a  
t
DCL  
t
t
r
f
IOM_CLK (DCL)  
t
t
wL  
wH  
t
t
t
dF  
hF  
IOM_FRAME (FSC)  
dDC  
t
dDF  
IOM_DU (DU)  
IOM_DD (DD)  
Bit 0  
t
sD  
t
hD  
Detail a  
1123F3-9  
Figure 3-8. Waveforms - IOM-2 Interface  
1129  
ROCKWELL PROPRIETARY INFORMATION  
3-25  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
This page is intentionally blank.  
3-26  
ROCKWELL PROPRIETARY INFORMATION  
1129  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
4. DESIGN CONSIDERATIONS  
Good engineering practices must be followed when designing a printed circuit board (PCB) containing the modem device.  
This is especially important considering the high data bit rate, high fax rate, record/play of analog speech and music audio,  
and full-duplex speakerphone operation. Suppression of noise is essential to the proper operation and performance of the  
modem and interfacing audio and DAA circuits.  
Two aspects of noise in an OEM board design containing the modem device set must be considered: on-board/off-board  
generated noise that can affect analog signal levels and analog-to-digital conversion (ADC)/digital-to-analog conversion  
(DAC), and on-board generated noise that can radiate off-board. Both on-board and off-board generated noise that is  
coupled on-board can affect interfacing signal levels and quality, especially in low level analog signals. Of particular concern  
is noise in frequency ranges affecting modem and audio circuit performance.  
On-board generated electromagnetic interference (EMI) noise that can be radiated or conducted off-board is a separate, but  
equally important, concern. This noise can affect the operation of surrounding equipment. Most local governing agencies  
have stringent certification requirements that must be met for use in specific environments. In order to minimize the  
contribution of the circuit design and PCB layout to EMI, the designer must understand the major sources of EMI and how to  
reduce them to acceptable levels.  
Proper PC board layout (component placement and orientation, signal routing, trace thickness and geometry, etc.),  
component selection (composition, value, and tolerance), interface connections, and shielding are required for the board  
design to achieve desired modem performance and to attain EMI certification. In addition, design layout should meet  
requirements stated in the PCI Bus Specification, Section 4.4, Expansion Board Specification, as well as other applicable  
sections.  
All the aspects of proper engineering practices are beyond the scope of this designer's guide. The designer should consult  
noise suppression techniques described in technical publications and journals, electronics and electrical engineering text  
books, and component supplier application notes. Seminars addressing noise suppression techniques are often offered by  
technical and professional associations as well as component suppliers.  
The following guidelines are offered to specifically help achieve stated modem performance, minimize audible noise for audio  
circuit use, and to minimize EMI generation.  
4.1 PC BOARD LAYOUT GUIDELINES  
4.1.1 General Principles  
1. Provide separate digital, analog, and DAA sections on the board.  
2. Keep digital and analog components and their corresponding traces as separate as possible and confined to defined  
sections.  
3. Keep high speed digital traces as short as possible.  
4. Keep sensitive analog traces as short as possible.  
5. Provide proper power supply distribution, grounding, and decoupling.  
6. Provide separate digital ground, analog ground, and chassis ground (if appropriate) planes.  
7. Provide wide traces for power and critical signals.  
8. Position digital circuits near the host bus connection and position the DAA circuits near the telephone line connections.  
4.1.2 Component Placement  
1. From the system circuit schematic,  
a) Identify the digital, analog, and DAA circuits and their components, as well as external signal and power  
connections.  
b) Identify the digital, analog, mixed digital/analog components within their respective circuits.  
c) Note the location of power and signals pins for each device (IC).  
2. Roughly position digital, analog, and DAA circuits on separate sections of the board. Keep the digital and analog  
components and their corresponding traces as separate as possible and confined to their respective sections on the  
board. Typically, the digital circuits will cover one-half of the board, analog circuits will cover one-fourth of the board, and  
the DAA will cover one-fourth of the board. NOTE: While the DAA is primarily analog in nature, it also has many control  
and status signals routed through it. A DAA section is also governed by local government regulations covering subjects  
such as component spacing, high voltage suppression, and current limiting.  
1129  
ROCKWELL PROPRIETARY INFORMATION  
4-1  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
3. Once sections have been roughly defined, place the components starting with the connectors and jacks.  
a) Allow sufficient clearance around connectors and jacks for mating connectors and plugs.  
b) Allow sufficient clearance around components for power and ground traces.  
c) Allow sufficient clearance around sockets to allow the use of component extractors.  
4. First, place the mixed analog/digital components (e.g., modem device, A/D converter, and D/A converter).  
a) Orient the components so pins carrying digital signals extend onto the digital section and pins carrying analog  
signals extend onto the analog section as much as possible.  
b) Position the components to straddle the border between analog and digital sections.  
5. Place all analog components.  
a) Place the analog circuitry, including the DAA, on the same area of the PCB.  
b) Place the analog components close to and on the side of board containing the TXA1_L1, TXA2_L1, RXA_L1,  
VC_L1, and VREF signals.  
c) Avoid placing noisy components and traces near TXA1_L1, TXA2_L1, RXA_L1, VC_L1, and VREF lines.  
6. Place active digital components/circuits and decoupling capacitors.  
a) Place digital components close together in order to minimize signal trace length.  
b) Place 0.1 µF decoupling (bypass) capacitors close to the pins (usually power and ground) of the IC they are  
decoupling. Make the smallest loop area possible between the capacitor and power/ground pins to reduce EMI.  
c) Place host bus interface components close to the edge connector in accordance with the applicable bus interface  
standard, e.g., the PCI Bus Specification.  
d) Place crystal circuits as close as possible to the devices they drive.  
7. Provide a “connector” component, usually a zero ohm resistor or a ferrite bead at one or more points on the PCB to  
connect one section’s ground to another.  
4.1.3 Signal Routing  
1. Route the modem signals to provide maximum isolation between noise sources and noise sensitive inputs. When layout  
requirements necessitate routing these signals together, they should be separated by neutral signals. The noise source,  
neutral, and noise sensitive pins are listed in Table 4-1.  
2. Keep digital signals within the digital section and analog signals within the analog section. (Previous placement of  
isolation traces should prevent these traces from straying outside their respective sections.) Route the digital traces  
perpendicular to the analog traces to minimize signal cross coupling.  
3. Provide isolation traces (usually ground traces) to ensure that analog signals are confined to the analog section and  
digital traces remain out of the analog section. A trace may have to be narrowed to route it though a mixed analog/digital  
IC, but try to keep the trace continuous.  
a) Route an analog isolation ground trace, at least 50 mil to 100 mil wide, around the border of the analog section; put  
on both sides of the PCB.  
b) Route a digital isolation ground trace, at least 50 mil to 100 mil wide, and 200 mil wide on one side of the PCB  
edge, around the border of the digital section.  
4. Keep host interface signals (e.g., AEN, IOR#, IOW#, HRESET) traces at least 10 mil thick (preferably 12 - 15 mil).  
5. Keep analog signal (e.g., the TXA1_L1, TXA2_L1, RXA_L1, TELIN_L1, TELOUT_L1 , MIC_M, MIC_V, and  
SPKROUT_M) traces at least 10 mil thick (preferably 12 - 15 mil).  
6. Keep all other signal traces as wide as possible, at least 5 mil (preferably 10 mil).Route the signals between  
components by the shortest possible path (the components should have been previously placed to allow this).  
7. Route the traces between bypass capacitors to IC pins, at least 25 mil wide; avoid vias if possible.  
8. Gather signals that pass between sections (typically low speed control and status signals) together and route them  
between sections through a path in the isolation ground traces at one (preferred) or two points only. If the path is made  
on one side only, then the isolation trace can be kept contiguous by briefly passing it to the other side of the PCB to  
jump over the signal traces.  
9. Avoid right angle (90 degree) turns on high frequency traces. Use smoothed radiuses or 45 degree corners.  
4-2  
ROCKWELL PROPRIETARY INFORMATION  
1129  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
10. Minimize the number of through-hole connections (feedthroughs/vias) on traces carrying high frequency signals.  
11. Keep all signal traces away from crystal circuits.  
12. Distribute high frequency signals continuously on a single trace rather than several traces radiating from one point.  
13. Provide adequate clearance (e.g., 60 mil minimum) around feedthroughs in any internal planes in the DAA circuit.  
14. Eliminate ground loops, which are unexpected current return paths to the power source.  
4.1.4 Power  
1. Identify digital power (VDD) and analog power (AVDD) supply connections.  
2. Place a 10 µF electrolytic or tantalum capacitor in parallel with a ceramic 0.1 µF capacitor between power and ground at  
one or more points in the digital section. Place one set nearest to where power enters the PCB (edge connector or  
power connector) and place another set at the furthest distance from where power enters the PCB. These capacitors  
help to supply current surge demands by the digital circuits and prevent those surges from generating noise on the  
power lines that may affect other circuits.  
3. For 2-layer boards, route a 200-mil wide power trace on two edges of the same side of the PCB around the border of  
the circuits using the power. (Note that a digital ground trace should likewise be routed on the other side of the board.)  
4. Generally, route all power traces before signal traces.  
Table 4-1. Modem Pin Noise Characteristics  
Device  
MDP  
144-Pin TQFP  
Function  
VDD, VAA  
Noise Source  
Neutral  
13, 27, 40, 49, 63, 85-86  
16, 39, 48, 81, 99  
Noise Sensitive  
GND, DGND, AGND  
Crystal  
87-88  
Control  
17, 35, 56, 68  
Line Interface  
31-32, 37, 47, 78  
25-26, 29-30, 33-34,  
36  
Speaker Interface  
Serial/LED Interface  
Host Interface  
38  
28  
7, 10-11, 64, 66, 82  
1-6, 89-98  
9, 12, 67, 75, 77, 79  
80  
MDP Interconnect  
Reserved or NC  
8, 18-24, 41-46, 50-55, 59-60, 62  
14-15, 57-58, 61, 65, 69-74, 76, 83-  
84, 100  
1129  
ROCKWELL PROPRIETARY INFORMATION  
4-3  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
4.1.5 Ground Planes  
1. In a 2-layer design, provide digital and analog ground plane areas in all unused space around and under digital and  
analog circuit components (exclusive of the DAA), respective, on both sides of the board, and connect them such a  
manner as to avoid small islands. Connect each ground plane area to like ground plane areas on the same side at  
several points and to like ground plane areas on the opposite side through the board at several points. Connect all  
modem DGND pins to the digital ground plane area and AGND pins to the analog ground plane area. Typically,  
separate the collective digital ground plane area from the collective analog ground plane area by a fairly straight gap.  
There should be no inroads of digital ground plane area extending into the analog ground plane area or visa versa.  
2. In a 4-layer design, provide separate digital and analog ground planes covering the corresponding digital and analog  
circuits (exclusive of the DAA), respectively. Connect all modem DGND pins to the digital ground plane and AGND pins  
to the analog ground plane. Typically, separate the digital ground plane from the analog ground plane by a fairly straight  
gap.  
3. In a design which needs EMI filtering, define an additional “chassis” section adjacent to the bracket end of a plug-in  
card. Most EMI components (usually ferrite beads/capacitor combinations) can be positioned in this section. Fill the  
unused space with a chassis ground plane, and connect it to the metal card bracket and any connector shields/grounds.  
4. Keep the current paths of separate board functions isolated, thereby reducing the current's travel distance. Separate  
board functions are: host interface, display, digital (SRAM, EPROM, modem), and DAA. Power and ground for each of  
these functions should be separate islands connected together at the power and ground source points only.  
5. Connect grounds together at only one point, if possible, using a ferrite bead. Allow other points for grounds to be  
connected together if necessary for EMI suppression.  
6. Keep all ground traces as wide as possible, at least 25 mil to 50 mil.  
7. Keep the traces connecting all decoupling capacitors to power and ground at their respective ICs as short and as direct  
(i.e., not going through vias) as possible.  
4.1.6 Crystal Circuit  
1. Keep all traces and component leads connected to crystal input and output pins (i.e., XTLI and XTLO) short in order to  
reduce induced noise levels and minimize any stray capacitance that could affect the crystal oscillator. Keep the XTLO  
trace extremely short with no bends greater than 45 degrees and containing no vias since the XTLO pin is connected to  
a fast rise time, high current driver.  
2. Where a ground plane is not available, such as in a 2-layer design, tie the crystal capacitors ground paths using  
separate short traces (as wide as possible) with minimum angles and vias directly to the corresponding device digital  
ground pin nearest the crystal pins.  
3. Connect crystal cases(s) to ground (if applicable).  
4. Place a 100-ohm (typical) resistor between the XTLO pin and the crystal/capacitor node.  
5. Connect crystal capacitor ground connections directly to GND pin on the modem device. Do not use common ground  
plane or ground trace to route the capacitor GND pin to the corresponding modem GND pin.  
4.1.7 VC_L1 and VREF Circuit  
1. Provide extremely short, independent paths for VC_L1 and VREF capacitor connections.  
a) Route the connection from the plus terminal of the 10 µF VC_L1 capacitor and one terminal of the 0.1 µF VC_L1  
capacitor to the modem device VC_L1 pin (pin 24) using a single trace isolated from the trace to the VC_L1 pin  
from the VREF capacitors (see step d).  
b) Route the connection from the negative terminal of the 10 µF VC_L1 capacitor and the other terminal of a the 0.1  
µF VC_L1 capacitor to a ferrite bead. The bead should typically have characteristics such as: impedance = 70 Ω at  
a frequency of 100 MHz , rated current = 200 mA, and maximum resistance = 0.5 Ω. Connect the other bead  
terminal to the AGND pin (pin 34) with a single trace.  
c) Route the connection from the plus terminal of the 10 µF VREF capacitor and one terminal of the 0.1 µF VREF  
capacitor to the modem device VREF pin (pin 25) with a single trace.  
d) Route the connection from the negative terminal of 10 µF VREF capacitor and the other terminal of the 0.1 µF  
VREF capacitor to the modem device VC_L1 pin (pin 24) with a single trace isolated from the trace to the VC_L1  
pin from the VC_L1 capacitors (see step a).  
4-4  
ROCKWELL PROPRIETARY INFORMATION  
1129  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
4.1.8 Telephone and Local Handset Interface  
1. Place common mode chokes in series with Tip and Ring for each connector.  
2. Decouple the telephone line cables at the telephone line jacks. Typically, use a combination of series inductors, common  
mode chokes, and shunt capacitors. Methods to decouple telephone lines are similar to decoupling power lines,  
however, telephone line decoupling may be more difficult and deserves additional attention. A commonly used design  
aid is to place footprints for these components and populate as necessary during performance/EMI testing and  
certification.  
3. Place high voltage filter capacitors (.001 µF @1KV) from Tip and Ring to digital ground.  
4.1.9 Optional Configurations  
Because fixed requirements of a design may alter EMI performance, guidelines that work in one case may deliver little or no  
performance enhancement in another. Initial board design should, therefore, include flexibility to allow evaluation of optional  
configurations. These optional configurations may include:  
1. Chokes in Tip and Ring lines replaced with jumper wires as a cost reduction if the design has sufficient EMI margin.  
2. Various grounding areas connected by tie points (these tie points can be short jumper wires, solder bridges between  
close traces, etc.).  
3. Develop two designs in parallel; one based on a 2-layer board and the other based on a 4-layer board. During the  
evaluation phase, better performance of one design over another may result in quicker time to market.  
4.1.10 MDP Specific  
1. Locate the MDP device and all supporting analog circuitry, including the data access arrangement, on the same area of  
the PCB.  
2. Locate the analog components close to and on the side of board containing the TXA1_L1, TXA2_L1, RXA_L1,  
TELIN_L1, TELOUT_L1 , MIC_M, MIC_V, and SPKROUT_M signals.  
3. Avoid placing noisy components and traces near the TXA1_L1, TXA2_L1, RXA_L1, TELIN_L1, TELOUT_L1 , MIC_M,  
MIC_V, and SPKROUT_M lines.  
4. Route MDP modem interconnect signals by the shortest possible route avoiding all analog components.  
5. Provide an RC network on the AVAA supply in the immediate proximity of the AVAA pin to filter out high frequency noise  
above 115 kHz. A tantalum capacitor is recommended (especially in a 2-layer board design) for improved noise  
immunity with a current limiting series resistor or inductor to the VCC supply which meets the RC filter frequency  
requirements.  
6. Provide a 0.1 µF ceramic decoupling capacitor to ground between the high frequency filter and the VAA pin.  
7. Provide a 0.1 µF ceramic decoupling capacitor to ground between the VCC supply and the AVDD pin.  
4.2 CRYSTAL/OSCILLATOR SPECIFICATIONS  
Recommended surface-mount crystal specifications are listed in Table 4-2.  
Recommended through-hole crystal specifications are listed in Table 4-3.  
4.3 OTHER CONSIDERATIONS  
The DAA design described in this designer's guide is a wet DAA, i.e., it requires line current to be present to pass the signal.  
Therefore, if the modem is to be connected back-to-back by cable directly to another modem, the modems will not be able to  
connect. The DAAs must be modified to operate dry, i.e., without line current, when used in this environment.  
A complete schematic is available for the RCV56HCF Data/Fax Modem PCI Half Card Reference Design (TR04-D380).  
1129  
ROCKWELL PROPRIETARY INFORMATION  
4-5  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
Table 4-2. Crystal Specifications - Surface Mount  
Characteristic  
Value  
Rockwell Part No.  
Electrical  
5333R02-020  
Frequency  
28.224 MHz nom.  
Frequency Tolerance  
±50 ppm (C = 16.5 and 19.5 pF)  
L
Frequency Stability  
vs. Temperature  
vs. Aging  
±35 ppm (0°C to 70°C)  
±15 ppm/4 years  
Fundamental  
Oscillation Mode  
Calibration Mode  
Load Capacitance, C  
Parallel resonant  
18 pF nom.  
L
Shunt Capacitance, C  
7 pF max.  
O
Series Resistance, R  
60 Ω max. @20 nW drive level  
1
Drive Level  
100µW correlation; 300µW max.  
0°C to 70°C  
Operating Temperature  
Storage Temperature  
Mechanical  
–40°C to 85°C  
Dimensions (L x W x H)  
Mounting  
7.5 x 5.2 x 1.3 mm max.  
SMT  
Holder Type  
None  
Suggested Suppliers  
KDS America  
ILSI America  
Vectron Technologies, Inc.  
Notes  
1. Characteristics @ 25°C unless otherwise noted.  
2. Supplier Information:  
KDS America  
Fountain Valley, CA 92626  
(714) 557-7833  
ILSI America  
Kirkland, WA 98033  
(206) 828 - 4886  
Vectron Technologies, Inc.  
Lowell, NH 03051  
(603) 598-0074  
Toyocom U.S.A., Inc.  
Costa Mesa, CA  
(714) 668-9081  
4-6  
ROCKWELL PROPRIETARY INFORMATION  
1129  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
Table 4-3. Crystal Specifications - Through Hole  
Characteristic  
Value  
Rockwell Part No.  
Electrical  
333R44-011  
Frequency  
28.224 MHz nom.  
Frequency Tolerance  
±50 ppm (C = 16.5 and 19.5 pF)  
L
Frequency Stability  
vs. Temperature  
vs. Aging  
±30 ppm (0°C to 70°C)  
±20 ppm/5 years  
Fundamental  
Oscillation Mode  
Calibration Mode  
Load Capacitance, C  
Parallel resonant  
18 pF nom.  
L
Shunt Capacitance, C  
7 pF max.  
O
Series Resistance, R  
35 Ω max. @20 nW drive level  
1
Drive Level  
100µW correlation; 500µW max.  
0°C to 70°C  
Operating Temperature  
Storage Temperature  
Mechanical  
–40°C to 85°C  
Dimensions (L x W x H)  
Mounting  
11.05 x 4.65 x 13.46 mm max.  
Through Hole  
Holder Type  
HC-49/U  
Suggested Suppliers  
KDS America  
ILSI America  
Vectron Technologies, Inc.  
Notes  
1. Characteristics @ 25°C unless otherwise noted.  
2. Supplier Information:  
KDS America  
Fountain Valley, CA 92626  
(714) 557-7833  
ILSI America  
Kirkland, WA 98033  
(206) 828 - 4886  
Vectron Technologies, Inc.  
Lowell, NH 03051  
(603) 598-0074  
Toyocom U.S.A., Inc.  
Costa Mesa, CA  
(714) 668-9081  
1129  
ROCKWELL PROPRIETARY INFORMATION  
4-7  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
4.4 PACKAGE DIMENSIONS  
The package dimensions are shown in Figure 4-1 (144-pin TQFP) and Figure 4-2 (176-pin TQFP) .  
D
D1  
D2  
PIN 1  
REF  
D1  
D
D1  
D2  
e
b
DETAIL A  
Millimeters  
Min.  
Max.  
1.6 MAX  
Inches*  
Min.  
Max.  
Dim.  
A
0.0630 MAX  
0.0020 0.0059  
0.0551 REF  
A1  
0.05  
0.15  
D1  
A2  
1.4 REF  
D
21.75  
22.25  
0.8563 0.8760  
0.7874 REF  
D1  
20.0 REF  
17.5 REF  
0.5  
0.75  
1.0 REF  
0.50 BSC  
D2  
0.6890 REF  
L
0.0197 0.0295  
0.0394 REF  
L1  
e
0.0197 BSC  
b
0.17  
0.11  
0.27  
0.17  
0.0067 0.0106  
0.0043 0.0067  
0.0031 MAX  
A2  
A
c
Coplanarity  
0.08 MAX  
Ref: 144-PIN TQFP (GP00-D252)  
c
* Metric values (millimeters) should be used for  
PCB layout. English values (inches) are  
converted from metric values and may include  
round-off errors.  
A1  
L
L1  
DETAIL A  
PD-TQFP-144 (040395)  
Figure 4-1. Package Dimensions - 144-Pin TQFP  
4-8  
ROCKWELL PROPRIETARY INFORMATION  
1129  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
Figure 4-2. Package Dimensions - 176-Pin TQFP  
1129  
ROCKWELL PROPRIETARY INFORMATION  
4-9  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
This page is intentionally blank.  
4-10  
ROCKWELL PROPRIETARY INFORMATION  
1129  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
5. SOFTWARE INTERFACE  
5.1 PCI Configuration Registers  
The PCI Configuration registers are located in the BIF. Table 5-1 identifies the configuration register contents that are  
supported in the BIF device:  
Table 5-1. PCI Configuration Registers  
Bit  
Offset  
(Hex)  
31:24  
23:16  
15:8  
7:0  
0
4
Device ID  
Status  
Vendor ID  
Command  
8
Class Code  
Revision ID  
C
Not Implemented  
Header Type  
Latency Timer  
Not Implemented  
10  
14  
18  
1C  
20  
24  
28  
2C  
30  
34  
38  
3C  
Base Address 0 - Memory (BIF)  
Unused Base Address Register  
Unused Base Address Register  
Unused Base Address Register  
Unused Base Address Register  
Unused Base Address Register  
CIS Pointer  
Subsystem ID  
Subsystem Vendor ID  
Not Implemented  
Reserved  
Reserved  
Max Latency  
Min Grant  
Interrupt Pin  
Interrupt Line  
5.1.1 Vendor ID Field  
This field is read-only and is loaded from the serial EEPROM after reset events. The default value for the Vendor ID is 127a.  
5.1.2 Device ID Field  
This field is read-only and is loaded from the serial EEPROM after reset events.  
1129  
ROCKWELL PROPRIETARY INFORMATION  
5-1  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
5.1.3 Command Register  
The Command Register bits are described in Table 5-2.  
Table 5-2. Command Register  
Bit  
Description  
0
Controls a device’s response to I/O Space accesses. A value of 0 disables the device response. A value of  
1 allows the device to respond to I/O Space accesses. State after RST# is 0.  
1
2
Controls a device’s response to Memory Space accesses. A value of 0 disables the device response. A  
value of 1 allows the device to respond to Memory Space accesses. State after RST# is 0.  
Controls a device’s ability to act as a master on the PCI bus. A value of 0 disables the device from  
generating PCI accesses. A value of 1 allows the device to behave as a bus master. State after RST# is 0.  
3
4
5
6
Not Implemented.  
Not Implemented.  
Not Implemented.  
This bit controls the device’s response to parity errors. When the bit is set, the device must take its normal  
action when a parity error is detected. When the bit is 0, the device must ignore any parity errors that it  
detects and continue normal operation. This bit’s state after RST# is 0.  
7
8
9
This bit is used to control whether or not a device does address/data stepping. This bit is read only from the  
PCI interface. It is loaded from the serial EEPROM after RST#.  
This bit is an enable bit for the SERR# driver. A value of 0 disables the SERR# driver. A value of 1 enables  
the SERR# driver. This bit’s state after RST# is 0.  
This bit controls whether or not a master can do fast back-to-back transactions to different devices. A value  
of 1 means the master is allowed to generate fast back-to-back transactions to different agents as described  
in Section 3.4.2 of the PCI 2.1 specification. A value of 0 means fast back-to-back transactions are only  
allowed to the same agent. This bit’s state after RST# is 0.  
10-15  
Reserved  
5.1.4 Status Register  
The Status Register bits are described in Table 5-3.  
Status register bits may be cleared by writing a ‘1’ in the bit position corresponding to the bit position to be cleared. It is not  
possible to set a status register bit by writing from the PCI Bus. Writing a ‘0’ has no effect in any bit position.  
Table 5-3. Status Register  
Bit  
0-4  
5
Description  
Reserved  
Not Implemented.  
Not Implemented.  
Not Implemented.  
6
7
8
This bit is only implemented by bus masters. It is set when three conditions are met: 1) the bus agent  
asserted PERR# itself or observed PERR# asserted; 2) the agent setting the bit acted as the bus master for  
the operation in which the error occurred; and 3) the Parity Error Response bit (Command Register) is set.  
9-10  
These bits encode the timing of DEVSEL#. These are encoded as 00 for fast, 01 for medium, and 10 for slow  
(11 is reserved.) These bits are read-only and must indicate the slowest time that a device asserts DEVSEL#  
for any bus command except Configuration Read and Configuration Write.  
11  
12  
Not Implemented.  
This bit must be set by a master device whenever its transaction is terminated with Target-Abort. All master  
devices must implement this bit.  
13  
14  
15  
This bit must be set by a master device whenever its transaction (except for Special Cycle) is terminated with  
Master-Abort. All master devices must implement this bit.  
This bit must be set whenever the device asserts SERR#. Devices which will never assert SERR# do not  
need to implement this bit.  
This bit must be set by the device whenever it detects a parity error, even if parity error handling is disabled  
(as controlled by bit 6 in the Command register).  
5-2  
ROCKWELL PROPRIETARY INFORMATION  
1129  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
5.1.5 Revision ID Field  
Initial part hardwired to 00.  
5.1.6 Class Code Field  
Hardwired to 0x078000 to indicate communications controller.  
5.1.7 Latency Timer Register  
The Latency Timer register specifies, in units of PCI bus clocks, the value of the Latency Timer for this PCI bus master. This  
register has 5 read/write bits (MSBs) plus 3 bits of hardwired zero (LSBs). The Latency Timer Register is loaded into the PCI  
Latency counter each time FRAME# is asserted to determine how long the master is allowed to retain control of the PCI bus.  
This register is loaded by system software. The default value for Latency Timer is 00.  
5.1.8 Header Type Field  
Hardwired to 00.  
5.1.9 CIS Pointer Register  
This register points to the CIS memory located in the BIF’s memory space.  
5.1.10 Subsystem Vendor ID and Subsystem ID Registers  
Subsystem Vendor ID and Subsystem ID are optional registers that are implemented in this design. Both registers are  
loaded from the serial EEPROM after RST#.  
5.1.11 Interrupt Line Register  
The Interrupt Line register is an eight bit register that is read/write. POST software will write the value of this register as it  
initializes and configures the system. The value in this register indicates which of the system interrupt controllers the device’s  
interrupt pin is connected to.  
5.1.12 Interrupt Pin Register  
The Interrupt Pin register tells which interrupt pin the device uses. The value of this register will be 0x01, indicating that  
INTA# will be used.  
5.1.13 Min Grant and Max Latency Registers  
The Min Grant and Max Latency registers are used to specify the devices desired settings for Latency Timer values. For  
both registers, the value specifies a period of time in units of ¼ microsecond. Min Grant is used for specifying the desired  
burst period assuming a 33 MHz clock. Min Latency specifies how often the device needs to gain access to the PCI bus.  
These registers are loaded from the serial EEPROM after RST#.  
5.2 BASE ADDRESS REGISTER  
BIF provides a single Base Address Register. The Base Address Register is a 32 bit register that is used to access the BIF  
register set. Bits 3:0 are hard-wired to 0 to indicate memory space. Bits 15-4 will be hard-wired to 0. The remaining bits (31 -  
16) will be read/write. This specifies that this device requires a 64k byte address space. After reset, the Base Address  
Register contains 0x00000000.  
The 64k byte address space used by the BIF is divided into 4k byte regions. Each 4k byte region is used as Table 5-4.  
Table 5-4. BIF Address Map  
Address  
[15:12]  
Address  
[11:0]  
Region Name  
Description  
0x0  
0x0-0xfff  
0x0-0xfff  
0x0-0xfff  
0x0-0xfff  
0x0-0xfff  
0x0-0xfff  
BASIC2 Registers  
CIS Memory  
DSP Scratch Pad  
Reserved  
Buffers, control, and status registers  
0x1  
Data loaded from Serial EEPROM for Card Bus applications  
Access to DSP scratch page registers  
0x2  
0x3  
0x4  
Reserved  
0x5-0xf  
Reserved.  
1129  
ROCKWELL PROPRIETARY INFORMATION  
5-3  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
5.3 SERIAL EEPROM INTERFACE  
The serial EEPROM interface is used to load PCI configuration parameters and CIS information (required for Card Bus  
operation) after a reset occurs. The PCI configuration information to be loaded requires 10 bytes of data. The CIS  
information requires 384 bytes of data. The minimum serial EEPROM size is 512 bytes (4096 bits). After the PCI reset signal  
is negated, the configuration data is read from the serial EEPROM and stored in the PCI configuration registers as required,  
then the CIS information is read from the serial EEPROM and stored in the internal RAM of the BIF. While the serial  
EEPROM data is being read and is being loaded in the configuration registers and the CIS RAM, any PCI access that occurs  
will receive a RETRY signal from the BIF device. After completion of the serial EEPROM reads, the BIF device will accept  
PCI transactions.  
The data stored in the serial EEPROM is in 16 bit word format. The configuration data to be read from the serial EEPROM is  
shown in Table 5-5.  
Table 5-5. EEPROM Configuration Data  
EEPROM Address  
0x0  
Copied to  
Configuration Register Device ID  
0x1  
Configuration Register Vendor ID  
Configuration Register Subsystem Device ID  
Configuration Register Subsystem Vendor ID  
Configuration Register Min Grant  
Configuration Register Max Latency  
CIS RAM  
0x2  
0x3  
0x4 (LSBs)  
0x4 (MSBs)  
Beyond 0x4  
5-4  
ROCKWELL PROPRIETARY INFORMATION  
1129  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
6. COMMAND SET  
The commands for the different models are listed by functional use in Table 6-1and alphanumerically in Table 6-2.  
Table 6-1. Command Set Summary - Functional Use Sort  
Configuration  
Command  
Description  
Data/Fax  
Data/Fax/Voice Data/Fax/Voice/ Data/Fax/Voice/  
Speakerphone Speakerphone/  
ISDN  
Generic Modem Control  
Reset to Default Configuration  
Z
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
+FCLASS  
&F  
Select Active Service Class  
Set to Factory-Defined Configuration  
Request Identification Information  
Request Manufacturer Identification  
Request Model Identification  
I
+GMI  
+GMM  
+GMR  
+GSN  
+GOI  
+GCAP  
Request Revision Identification  
Request Product Serial Number Identification  
Request Global Object Identification  
Request Complete Capabilities List  
DTE-Modem Interface  
Command Echo  
E
Q
V
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Result Code Suppression  
Modem Response Format  
Result Code Selection and Call Progress  
Monitoring Control  
&C  
RLSD Behavior  
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
&D  
DTR Behavior  
+IFC  
+ILRR  
+H  
DTE-Modem Local Flow Control  
DTE-Modem Local Rate Reporting  
Enable/Disable Video Ready Mode  
Dial Control  
Dial  
D
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
T
Select Tone Dial  
P
Select Pulse Dial  
A
Answer  
H
Hook Control  
O
Return to Online Data State  
Monitor Speaker Loudness  
Monitor Speaker Mode  
Select Guard Tone  
L
M
&G  
&P  
&V  
&W  
Select Pulse Dial Make/Break Ratio  
Display Current Configuration  
Store Current Configuration  
Modulation Control  
Modulation Selection  
+MS  
+MR  
X
X
X
X
X
X
X
X
Modulation Reporting Control  
Error Control  
Error Control and Synchronous Mode Selection  
Break Handling in Error Control operation  
Selective Repeat  
+ES  
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
+EB  
+ESR  
+EFCS  
+ER  
32-bit Frame Check Sequence  
Error Control Reporting  
+ETBM  
Call Termination Buffer Management  
1129  
ROCKWELL PROPRIETARY INFORMATION  
6-1  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
Table 5-1. Command Set Summary - Functional Use Sort (Cont’d)  
Configuration  
Command  
Description  
Data/Fax  
Data/Fax/Voice Data/Fax/Voice/ Data/Fax/Voice/  
Speakerphone Speakerphone/  
ISDN  
Data Compression  
+DS  
Data Compression  
X
X
X
X
X
X
X
X
X
X
X
X
+DR  
%E  
Data Compression Reporting  
Enable/Disable Line Quality Monitor and Auto-  
Retrain  
%L  
Line Signal Level  
Line Signal Quality  
X
X
X
X
X
X
X
X
%Q  
V.8 and V.8 bis  
V.8 and V.8bis Operation Control  
Send V.8 Menu Signals  
+A8E  
+A8M  
+A8T  
X
X
X
X
X
X
X
X
X
X
X
X
Send V.8bis Signal and/or Message(s)  
Synchronous Mode Access  
Synchronous Access Mode Configuration  
Transmit Flow Control Thresholds  
+ESA  
+ITF  
X
X
X
X
X
X
X
X
World-Class  
Display Blacklisted Numbers  
Display Delayed Numbers  
Country of Installation  
*B  
X
X
X
X
X
X
X
X
X
X
X
X
*D  
+GCI  
DSVD Control  
-SSE  
Enable/Disable DSVD  
X
X
X
X
Fax Commands  
Data/fax Auto Answer  
+FAE  
+FTS  
+FRS  
+FTM  
+FRM  
+FTH  
+FRH  
+FAR  
+FCL  
+FDD  
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Stop Transmission and Pause  
Wait for Silence  
Transmit Data with <MOD> Carrier  
Receive Data with <MOD> Carrier  
Transmit HDLC Data with <MOD> Carrier  
Receive HDLC Data with <MOD> Carrier  
Adaptive Reception Control  
Carrier Loss Timeout  
Double Escape Character Replacement  
Control  
+FIT  
DTE Inactivity Timeout  
Local DTE-Modem Serial Port Rate  
Manufacturer Identification  
Product Identification  
X
X
X
X
+FPR  
+FMI  
+FMM  
+FMR  
+FLO  
-
-
-
-
X
X
X
X
X
X
X
X
X
X
X
X
Version, Revision, etc.  
Flow Control  
S-Parameters  
Automatic Answer  
S0  
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
S1  
Ring Counter  
S2  
Escape Character  
S3  
Command Line Termination Character  
Response Formatting Character  
Command Line Editing Character  
Pause Before Blind Dialing  
Connection Completion Timeout  
Comma Dial Modifier Time  
Automatic Disconnect Delay  
DTMF Tone Duration  
S4  
S5  
S6  
S7  
S8  
S10  
S11  
S12  
S29  
Escape Prompt Delay (EPD)  
Flash Dial Modifier Time  
6-2  
ROCKWELL PROPRIETARY INFORMATION  
1129  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
Table 5-1. Command Set Summary - Functional Use Sort (Cont’d)  
Configuration  
Command  
Description  
Data/Fax  
Data/Fax/Voice Data/Fax/Voice/ Data/Fax/Voice/  
Speakerphone Speakerphone/  
ISDN  
Voice Commands  
+VCID  
Caller ID (CID)  
DID Feature  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
+VDID  
+VNH  
+VIP  
Automatic Hang-up Control  
Voice Initialize All Parameters  
Start Modem Receive (Record)  
Voice Tone Send  
+VRX  
+VTS  
+VTX  
+VGR  
+VGT  
+VIT  
Start Modem Transmit (Playback)  
Voice Gain Receive (Record Gain)  
Voice Gain Transmit (Playback Volume)  
Voice Inactivity Timer (DTE/modem)  
Analog Source/Destination Selection  
Ringback Goes Away Timer  
Ringback Never Appeared Timer  
Silence Detection (QUIET & SILENCE)  
Compression Method Selection  
Beep Tone Duration Timer  
+VLS0-15  
+VRA  
+VRN  
+VSD  
+VSM  
+VTD  
+VDR  
+VDT  
+VBT  
+VPR  
Distinctive Ring  
Control Tone Cadence Reporting  
Buffer Threshold Setting  
Select DTE/Modem Interface Rate  
Speakerphone Commands  
Speakerphone ON/OFF  
Speakerphone Duplex Mode  
Speakerphone Signal Control  
Microphone Gain  
+VSP  
-
-
-
-
-
-
X
X
X
X
X
X
+VDX  
+VLS16-19  
+VGM  
+VGS  
Speaker Gain  
-
-
X
X
1129  
ROCKWELL PROPRIETARY INFORMATION  
6-3  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
Table 6-2. Command Set Summary - Alphanumeric Sort  
Configuration  
Command  
Description  
Data/Fax  
Data/Fax/Voice Data/Fax/Voice/ Data/Fax/Voice/  
Speakerphone Speakerphone/  
ISDN  
%E  
Enable/Disable Line Quality Monitor and Auto-  
Retrain  
X
X
X
X
%L  
%Q  
&C  
&D  
&F  
&G  
&P  
&V  
&W  
*B  
Line Signal Level  
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Line Signal Quality  
RLSD Behavior  
DTR Behavior  
Set to Factory-Defined Configuration  
Select Guard Tone  
Select Pulse Dial Make/Break Ratio  
Display Current Configuration  
Store Current Configuration  
Display Blacklisted Numbers  
Display Delayed Numbers  
V.8 and V.8bis Operation Control  
Send V.8 Menu Signals  
*D  
+A8E  
+A8M  
+A8T  
+DR  
Send V.8bis Signal and/or Message(s)  
Data Compression Reporting  
Data Compression  
+DS  
+EB  
Break Handling in Error Control operation  
32-bit Frame Check Sequence  
Error Control Reporting  
+EFCS  
+ER  
+ES  
Error Control and Synchronous Mode Selection  
Synchronous Access Mode Configuration  
Selective Repeat  
+ESA  
+ESR  
+ETBM  
+FAE  
+FAR  
+FCL  
+FCLASS  
+FDD  
Call Termination Buffer Management  
Data/fax Auto Answer  
Adaptive Reception Control  
Carrier Loss Timeout  
Select Active Service Class  
Double Escape Character Replacement  
Control  
+FIT  
DTE Inactivity Timeout  
X
-
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
+FLO  
+FMI  
Flow Control  
Manufacturer Identification  
-
+FMM  
+FMR  
+FPR  
+FRH  
+FRM  
+FRS  
+FTH  
+FTM  
+FTS  
+GCAP  
+GCI  
+GMI  
+GMM  
+GMR  
+GOI  
+GSN  
+H  
Product Identification  
-
Version, Revision, etc.  
-
Local DTE-Modem Serial Port Rate  
Receive HDLC data with <MOD> carrier  
Receive Data with <MOD> carrier  
Wait for Silence  
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Transmit HDLC data with <MOD> carrier  
Transmit Data with <MOD> carrier  
Stop Transmission and Pause  
Request Complete Capabilities List  
Country of Installation  
Request Manufacturer Identification  
Request Model Identification  
Request Revision Identification  
Request Global Object Identification  
Request Product Serial Number Identification  
Enable/Disable Video Ready Mode  
6-4  
ROCKWELL PROPRIETARY INFORMATION  
1129  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
Table 5-2. Command Set Summary - Alphanumeric Sort (Cont’d)  
Configuration  
Command  
Description  
Data/Fax  
Data/Fax/Voice Data/Fax/Voice/ Data/Fax/Voice/  
Speakerphone Speakerphone/  
ISDN  
+IFC  
DTE-Modem Local Flow Control  
DTE-Modem Local Rate Reporting  
Transmit Flow Control Thresholds  
Modulation Reporting Control  
Modulation Selection  
X
X
X
X
X
-
X
X
X
X
X
X
X
X
X
X
-
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
+ILRR  
+ITF  
+MR  
+MS  
+VBT  
+VCID  
+VDID  
+VDR  
+VDT  
+VDX  
+VGM  
+VGR  
+VGS  
+VGT  
+VIP  
+VIT  
+VLS  
+VNH  
+VPR  
+VRA  
+VRN  
+VRX  
+VSD  
+VSM  
+VSP  
+VTD  
+VTS  
+VTX  
-SSE  
A
Buffer Threshold Setting  
Caller ID (CID)  
-
DID Feature  
-
Distinctive Ring  
-
Control Tone Cadence Reporting  
Speakerphone Duplex Mode  
Microphone Gain  
-
-
-
-
Voice Gain Receive (Record Gain)  
Speaker Gain  
-
X
-
-
Voice Gain Transmit (Playback Volume)  
Voice Initialize All Parameters  
Voice Inactivity Timer (DTE/modem)  
Analog Source/Destination Selection  
Automatic Hang-up control  
Select DTE/Modem Interface Rate  
Ringback Goes Away Timer  
Ringback Never Appeared Timer  
Start Modem Receive (Record)  
Silence Detection (QUIET & SILENCE)  
Compression Method Selection  
Speakerphone ON/OFF  
Beep Tone Duration Timer  
Voice Tone Send  
-
X
X
X
X
X
X
X
X
X
X
X
-
-
-
-
-
-
-
-
-
-
-
-
-
X
X
X
X
X
X
X
X
X
X
X
X
X
X
-
Start Modem Transmit (Playback)  
Enable/Disable DSVD  
-
X
X
X
X
X
X
X
X
X
X
X
Answer  
D
Dial  
E
Command Echo  
H
Hook Control  
I
Request Identification Information  
Monitor Speaker Loudness  
Monitor Speaker Mode  
L
M
O
Return to Online Data State  
Select Pulse Dial  
P
Q
Result Code Suppression  
1129  
ROCKWELL PROPRIETARY INFORMATION  
6-5  
Download from Www.Somanuals.com. All Manuals Search And Download.  
RCV56HCF PCI/CardBus Modem Designer’s Guide  
Table 5-2. Command Set Summary - Alphanumeric Sort (Cont’d)  
Configuration  
Command  
Description  
Number of Rings to Automatic Answer  
Ring Counter  
1- Data/Fax  
2- Plus Voice  
3- Plus SP  
5- Plus ISDN  
S0  
S1  
S2  
S3  
S4  
S5  
S6  
S7  
S8  
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Escape Character  
Line Termination Character  
Response Formatting Character  
Command Line Editing Character  
Pause Before Blind Dialing  
Connection Completion Timeout  
Comma Dial Modifier Time  
Automatic Disconnect Delay  
DTMF Tone Duration  
S10  
S11  
S12  
S29  
T
Escape Prompt Delay (EPD)  
Flash Dial Modifier Time  
Select Tone Dial  
V
Modem Response Format  
X
Result Code Selection and Call Progress  
Monitoring Control  
Z
Reset To Default Configuration  
X
X
X
X
6-6  
ROCKWELL PROPRIETARY INFORMATION  
1129  
Download from Www.Somanuals.com. All Manuals Search And Download.  
NOTES  
(Inside Back Cover)  
Download from Www.Somanuals.com. All Manuals Search And Download.  
REGIONAL SALES OFFICES  
US Northwest Office  
Rockwell Semiconductor Systems  
US Northwest Office  
Europe North  
Japan  
Rockwell Semiconductor Systems, Ltd. Rockwell Int'l Japan Co., Ltd.  
Berkshire Court  
Western Road  
Bracknell  
Shimomoto Bldg  
1-46-3 Hatsudai, Shibuya-ku  
Tokyo, 151  
Headquarters  
US Southwest Office  
Rockwell Semiconductor Systems  
5000 Birch Street  
3600 Pruneridge Avenue  
Suite 100  
Rockwell Semiconductor Systems  
4311 Jamboree Road,  
P.O. Box C  
Santa Clara, CA 95051  
Phone: (408) 249-9696  
Berkshire RG12 1RE  
England  
Japan  
Suite 400  
Phone: (81-3) 5371 1520  
Newport Beach, CA 92658-8902  
Phone: (714) 221-4600  
Newport Beach, CA 92660  
Phone: (714) 222-9119  
Fax:  
(408) 249-7113  
Phone: +44 1344 486 444  
Fax:  
(81-3) 5371 1501  
Fax:  
+44 1344 486 555  
Fax:  
(714) 221-6375  
Fax:  
(714) 222-0620  
US North Central Office  
Rockwell Semiconductor Systems  
Two Pierce Place  
Korea  
Rockwell-Collins Int'l, Inc.  
Room No. 1508  
Europe South  
US Southwest Satellite Office  
Rockwell Semiconductor Systems  
1000 Business Center Circle  
Suite 215  
Rockwell Semiconductor Systems  
S.A.R.L.  
European Headquarters  
Rockwell Semiconductor Systems  
S.A.R.L.  
Chancellory Park  
Korea Textile Centre Building  
944-31, Daechi-3dong  
Kangnam P.O. Box 2037  
Kangnam-ku  
Suite 810  
Tour GAN  
Cedex 13  
Itasca, IL 60143  
Les Taissounieres B1  
Route des Dolines  
Sophia Antipolis Cedex  
06905 Valbonne  
Thousand Oaks, CA 91320  
Phone: (805) 376-0559  
Phone: (630) 773-3454  
92082 Paris La Defense 2  
France  
Fax:  
(630) 773-3907  
Seoul  
Korea  
Fax:  
(805) 376-8180  
Phone: (33-1) 49-06-3980  
US Northeast Office  
Rockwell Semiconductor Systems  
239 Littleton Road  
Fax:  
(33-1) 49-06-3990  
Phone: (82-2) 565-2880  
France  
US South Central Office  
Rockwell Semiconductor Systems  
2001 North Collins Blvd  
Suite 103  
Fax:  
(82-2) 565-1440  
Phone: (33) 93 00 33 35  
Germany  
Fax:  
(33) 93 00 33 03  
Suite 4A  
Rockwell Semiconductor Systems  
Rockwell Int'l GmbH Germany  
Paul-Gerhardt-Allee 50 a  
81245 Munchen  
Singapore  
Rockwell Semiconductor Systems  
Singapore Branch  
1 Kim Seng Promenade  
#09-01 Great World City East Tower  
Singapore 237994  
Phone: (65) 737-7355  
Fax:  
Westford, MA 01886  
Phone: (508) 692-7660  
Richardson, TX 75080  
Phone: (214) 379-9310  
Fax:  
(508) 692-8185  
Fax:  
(214) 479-9317  
Germany  
For more information:  
Call 1-800-854-8099  
International information:  
Call 1-714-833-6996  
Australia  
Phone: (49-89) 829-1320  
US Southeast Office  
Rockwell Semiconductor Systems  
900 Ashwood Parkway  
Suite 400  
Rockwell Semiconductor Systems  
Rockwell Australia Pty Limited  
Suite 603, 51 Rawson Street  
Epping, NSW 2121  
Fax:  
(49-89) 834-2734  
(65) 737-9077  
Hong Kong  
Rockwell Int'l (Asia Pacific) Ltd.  
13th Floor, Suites 8-10,  
Harbour Centre  
Taiwan  
Atlanta, GA 30338  
Australia  
Rockwell Int'l Taiwan Company, Ltd.  
Room 2808 International Trade Bldg.  
333, Keelung Road, Section I  
Taipei,  
URL Address:  
Phone: (770) 393-1830  
Phone: (61-2) 9869 4088  
http://www.nb.rockwell.com  
E-Mail Address:  
Fax:  
(770) 395-1419  
Fax:  
(61-2) 9869 4077  
25 Harbour Road  
Wanchai,  
literature@nb.rockwell.com  
US Southeast Satellite Office  
Rockwell Semiconductor Systems  
One Prestige Place  
Europe Mediterranean  
Rockwell Semiconductor Systems  
c/o Rockwell Automation S.r.l.  
Via Di Vittorio, 1  
Hong Kong  
Taiwan  
10548 ROC  
Phone: (852) 2 827-0181  
Fax:  
(852) 2 827-6488  
Phone: (886-2) 720-0282  
2600 McCormick Drive  
Suite 350  
Fax:  
(886-2) 757-6760  
20017 Mazzo Di Rho (MI)  
Italy  
Clearwater, FL 34619  
Phone: (813) 799-8406  
Phone: (39 2) 93179911  
SOUD071697  
Fax:  
(813) 799-8306  
Fax  
(39 2) 93179913  
©1997, Rockwell International Corporation  
Printed in U.S.A.  
All Rights Reserved  
Download from Www.Somanuals.com. All Manuals Search And Download.  

Graco Car Seat PD238261A User Manual
Greenheck Fan Smoke Alarm SSFSDR 511 User Manual
Haier Freezer HCF150 User Manual
Hasbro Games 02014 User Manual
Hasbro Games 07148 User Manual
Hasbro Games 59663 User Manual
Honeywell Burner EC7820A User Manual
Hotpoint Cooktop GE75DX User Manual
Husqvarna Lawn Mower YTH2042 TWIN User Manual
Igloo Refrigerator FR102UK PINK User Manual