HP Hewlett Packard Server 686210 S01 User Manual

HP ProLiant DL360e Gen8 Server  
User Guide  
Abstract  
This document is for the person who installs, administers, and troubleshoots servers and storage systems. HP assumes you are qualified in the  
servicing of computer equipment and trained in recognizing hazards in products with hazardous energy levels.  
Part Number: 675786-001  
July 2012  
Edition: 1  
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Contents  
Contents  
3
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Installing a hot-plug fan module if the server is installed in a ball-bearing rail system with the cable management  
Contents  
4
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Contents  
5
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Contents  
6
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Component identification  
Front panel components  
Four-bay LFF drive model  
Item  
Description  
Optical drive (optional)  
Serial number pull tab  
1
2
3
Front video connector (front video adapter, part number  
655915-B21 required)  
USB connectors  
4
5
LFF drives  
Eight-bay SFF drive model  
Item  
Description  
Optical drive (optional)  
1
2
Front video connector (front video adapter, part number  
655915-B21 required)  
USB connectors  
Serial number pull tab  
SFF drives  
3
4
5
Component identification  
7
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Front panel LEDs and buttons  
Item  
Description  
Status  
UID LED/button  
Blue = Identification is activated.  
Flashing blue = System is being managed remotely.  
Off = Identification is deactivated.  
1
Power On/Standby button  
and system power LED  
Green = System is on.  
Flashing green = Waiting for power.  
Amber = System is in standby, but power is still applied.  
Off = Power cord is not attached or power supply failed.  
2
3
Health LED  
Green = System is on and system health is normal.  
Flashing amber = System health is degraded.  
Flashing red = System health is critical.  
Off = System is off.  
NIC status LED  
Green = Linked to network  
Flashing green = Network activity  
Off = No network link  
4
Rear panel components  
Item  
Description  
Slot 1 PCIe3 x16 (16, 8, 4, 1)  
Slot 2 PCIe2 x8 (4,1)  
Power supply 2  
1
2
3
4
Power supply 1  
Component identification  
8
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Item  
Description  
NIC connectors (4 to 1)  
Serial connector  
Video connector  
USB connectors  
iLO connector  
5
6
7
8
9
Rear panel LEDs and buttons  
Item  
Description  
Status  
NIC status LED  
Green = Activity exists  
Flashing green = Activity exists  
Off = No activity exists  
1
NIC link LED  
Green = Link exists  
Off = No link exists  
2
3
UID LED/button  
Blue = Activated  
Flashing blue = System being remotely managed  
Off = Deactivated  
Power supply LED  
Green = Normal  
4
Off = One or more of the following conditions  
exists:  
Power is unavailable  
Power supply failed  
Power supply is in standby mode  
Power supply error  
PCIe riser board slot definitions  
Slot  
Riser board  
Type  
Length  
Height Connector Negotiable  
link width link width  
number option  
For riser board  
PCIe3 250 mm Full  
x16  
x16  
1
2
options with and  
without SAS  
support  
PCIe2 Half  
Half  
x8  
x4  
Component identification  
9
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System board components  
Item  
Description  
PCI riser connectors  
Cache module connector  
TPM connector  
1
2
3
Mini-SAS connector  
System battery  
4
5
SATA drive connector  
SATA optical/storage drive connector  
Front panel connectors  
Processor socket 1  
GPU power connector  
Fan connector 8  
6
7
8
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
Fan connector 7  
Fan connector 6  
Fan connector 5  
Fan connector 4  
Internal USB connector  
Fan connector 3  
Fan connector 2  
Fan connector 1  
Processor 2 DIMM slots  
Component identification 10  
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Item  
Description  
Not applicable  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
Drive backplane power connector  
Processor socket 2  
Not applicable  
Power supply connector 1  
Drive sideband signal connector  
Power supply connector 2  
Processor 1 DIMM slots  
SD card slot  
NMI header  
System maintenance switch  
DIMM slot locations  
DIMM slots are numbered sequentially (1 through 6) for each processor. The supported AMP modes use the  
letter assignments for population guidelines.  
System maintenance switch  
Switch  
Default  
Function  
Off  
Off = No function  
On = iLO security is disabled  
1
Off  
Off = System configuration can be  
changed  
2
On = System configuration is locked  
Off  
Off  
Off = Power-on password is enabled  
On = Power-on password is disabled  
5
6
Off = No function  
On = ROM reads configuration as  
invalid  
Component identification 11  
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Switch  
Default  
Function  
Reserved  
3, 4, 7, 8, 9,  
10, 11, 12  
When the system maintenance switch position 6 is set to the On position, the system is prepared to erase all  
system configuration settings from both CMOS and NVRAM.  
CAUTION: Clearing CMOS and/or NVRAM deletes configuration information. Be sure to  
properly configure the server or data loss could occur.  
NMI header  
The NMI header enables administrators to perform a memory dump before performing a hard reset. Crash  
dump analysis is an essential part of eliminating potential reliability issues, such as hangs or crashes in  
operating systems, device drivers, and applications. Many crashes can freeze a system, requiring you to  
perform a hard reset. Resetting the system erases any information that supports root cause analysis.  
Systems running Microsoft® Windows® experience a blue-screen trap when the OS crashes. When this  
happens, Microsoft® recommends that system administrators perform an NMI event by temporarily shorting  
the NMI header with a jumper. The NMI event enables a hung system to become responsive again.  
For additional information, see the HP website  
Drive numbering  
Four-bay LFF drive model  
Eight-bay SFF drive model  
When the two-port SATA cable is installed in the eight-bay drive cage ("Two-port SATA cable option"  
on page 32), the server supports the six-drive SATA configuration. In this configuration, drive bays 1  
through 6 are populated, while drive bays 7 and 8 contain drive blanks.  
Component identification 12  
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Drive LED definitions  
Item LED  
Status  
Definition  
Locate  
Solid blue  
Flashing blue  
The drive is being identified by a host application.  
The drive carrier firmware is being updated or requires an update.  
1
2
3
Activity ring  
Rotating green  
Off  
Drive activity  
No drive activity  
Do not remove  
Solid white  
Do not remove the drive. Removing the drive causes one or more of  
the logical drives to fail.  
Off  
Removing the drive does not cause a logical drive to fail.  
Drive status  
Solid green  
The drive is a member of one or more logical drives.  
4
Flashing green  
The drive is rebuilding or performing a RAID migration, stripe size  
migration, capacity expansion, or logical drive extension, or is  
erasing.  
Flashing  
amber/green  
The drive is a member of one or more logical drives and predicts  
the drive will fail.  
Flashing amber The drive is not configured and predicts the drive will fail.  
Solid amber  
Off  
The drive has failed.  
The drive is not configured by a RAID controller.  
FBWC module LED definitions  
The FBWC module has three single-color LEDs (one amber and two green). The LEDs on the cache module  
installed on a storage controller are duplicated on the reverse side of the module to facilitate status viewing.  
Component identification 13  
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Cache module installed on a storage controller  
Cache module installed on the system board  
1 - Amber  
2 - Green  
3 - Green  
Interpretation  
Off  
Off  
The cache module is not powered.  
Off  
Off  
Flashing 0.5 Hz Flashing 0.5 Hz The cache microcontroller is executing from within its  
boot loader and receiving new flash code from the host  
controller.  
Flashing 1 Hz  
Flashing 1 Hz  
Flashing 1 Hz  
On  
The cache module is powering up, and the capacitor  
pack is charging.  
Off  
Off  
Off  
Off  
Off  
Off  
On  
The cache module is idle, and the capacitor pack is  
charging.  
The cache module is idle, and the capacitor pack is  
charged.  
On  
The cache module is idle, the capacitor pack is charged,  
and the cache contains data that has not yet been  
written to the drives.  
Flashing 1 Hz  
On  
Off  
Off  
Off  
On  
A backup is in progress.  
Off  
The current backup is complete with no errors.  
The current backup failed, and data has been lost.  
Off  
Flashing 1 Hz  
Flashing 1 Hz  
Flashing 1 Hz  
Flashing 1 Hz  
A power error occurred during the previous or current  
boot. Data might be corrupt.  
On  
Off  
An overtemperature condition exists.  
Flashing 1 Hz  
Component identification 14  
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1 - Amber  
2 - Green  
Flashing 2 Hz  
Flashing 2 Hz  
3 - Green  
Off  
Interpretation  
The capacitor pack is not attached.  
Flashing 2 Hz  
Flashing 2 Hz  
On  
The capacitor has been charging for 10 minutes, but  
has not reached sufficient charge to perform a full  
backup.  
On  
On  
Off  
On  
The current backup is complete, but power fluctuations  
occurred during the backup.  
On  
On  
The cache module microcontroller has failed.  
Fan locations  
T-10/T-15 Torx screwdriver  
The server includes a T-10/T-15 Torx screwdriver located behind the power supply cage. Use the screwdriver  
to loosen screws during hardware configuration procedures.  
Component identification 15  
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Operations  
Power up the server  
1.  
2.  
3.  
Connect each power cord to the server.  
Connect each power cord to the power source.  
Press the Power On/Standby button.  
The server exits standby mode and applies full power to the system. The system power LED changes  
from amber to green.  
Power down the server  
Before powering down the server for any upgrade or maintenance procedures, perform a backup of critical  
server data and programs.  
WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment,  
remove the power cord to remove power from the server. The front panel Power On/Standby  
button does not completely shut off system power. Portions of the power supply and some internal  
circuitry remain active until AC/DC power is removed.  
IMPORTANT: When the server is in standby mode, auxiliary power is still being provided to the  
system.  
To power down the server, use one of the following methods:  
Press and release the Power On/Standby button.  
This method initiates a controlled shutdown of applications and the OS before the server enters standby  
mode.  
Press and hold the Power On/Standby button for more than 4 seconds to force the server to enter  
standby mode.  
This method forces the server to enter standby mode without properly exiting applications and the OS.  
If an application stops responding, you can use this method to force a shutdown.  
Use a virtual power button selection through iLO.  
This method initiates a controlled remote shutdown of applications and the OS before the server enters  
standby mode.  
Before proceeding, verify the server is in standby mode by observing that the system power LED is amber.  
Extend the server from the rack  
Operations 16  
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IMPORTANT: The requirement of extending or removing the server from the rack when  
performing installation and maintenance procedures depends on the rail system used:  
If using a ball-bearing rail system, you can perform most installations and maintenance by  
simply extending the server from the rack.  
If using a friction rail system, to perform installations or maintenance that requires access panel  
removal, remove the server from the rack.  
To extend the server from an HP, Compaq-branded, Telco, or third-party rack:  
1.  
2.  
Power down the server (on page 16).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Disconnect all peripheral cables.  
3.  
WARNING: To reduce the risk of personal injury or equipment damage, be sure that the rack is  
adequately stabilized before extending a component from the rack.  
WARNING: To reduce the risk of personal injury, be careful when pressing the server rail-release  
latches and sliding the server into the rack. The sliding rails could pinch your fingers.  
4.  
5.  
Pull down the quick release levers on each side of the server.  
Extend the server on the rack rails until the server rail-release latches engage.  
If the server does not extend from the rack, use a T-25 Torx screwdriver to loosen the screws located  
within the lever housing.  
6.  
After performing the installation or maintenance procedure, slide the server into the rack. For more  
information, see the documentation that ships with the rack-mounting option.  
7.  
8.  
9.  
Connect the peripheral cables.  
Connect each power cord to the server.  
Connect each power cord to the power source.  
Remove the server from the rack  
WARNING: This server is very heavy. To reduce the risk of personal injury or damage to the  
equipment:  
Observe local occupational health and safety requirements and guidelines for manual  
material handling.  
Get help to lift and stabilize the product during installation or removal, especially when the  
product is not fastened to the rails. HP recommends that a minimum of two people are required  
for all rack server installations. A third person may be required to help align the server if the  
server is installed higher than chest level.  
Use caution when installing the server in or removing the server from the rack; it is unstable  
when not fastened to the rails.  
Operations 17  
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IMPORTANT: The requirement of extending or removing the server from the rack when  
performing installation and maintenance procedures depends on the rail system used:  
If using a ball-bearing rail system, you can perform most installations and maintenance by  
simply extending the server from the rack.  
If using a friction rail system, to perform installations or maintenance that requires access panel  
removal, remove the server from the rack.  
To remove the server from an HP, Compaq-branded, Telco, or third-party rack:  
1.  
2.  
3.  
4.  
Power down the server (on page 16).  
Disconnect all peripheral cables and power cords from the server rear panel.  
Extend the server from the rack (on page 16).  
Remove the server from the rack. For more information, see the documentation that ships with the rack  
mounting option.  
5.  
Place the server on a sturdy, level surface.  
Remove the security bezel (optional)  
To access the front panel components, unlock and then remove the security bezel.  
Remove the access panel  
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the  
internal system components to cool before touching them.  
CAUTION: Do not operate the server for long periods with the access panel open or removed.  
Operating the server in this manner results in improper airflow and improper cooling that can  
lead to thermal damage.  
1.  
2.  
Power down the server (on page 16).  
Remove all power:  
Operations 18  
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a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Do one of the following:  
3.  
4.  
o
o
Extend the server from the rack (on page 16).  
Remove the server from the rack (on page 17).  
Open the locking latch, slide the access panel to the rear of the chassis, and then remove the access  
panel.  
If the latch is locked, use a T-15 Torx screwdriver to unlock the latch.  
Install the access panel  
1.  
Place the access panel on top of the server with the locking latch open. Allow the panel to extend past  
the rear of the server by approximately 1.25 cm (0.5 inch).  
2.  
3.  
Press the locking latch. The access panel slides to a closed position.  
Use a T-15 Torx screwdriver to tighten the security screw on the locking latch.  
Remove the PCI riser cage  
CAUTION: To prevent damage to the server or expansion boards, power down the server, and  
disconnect all power cords before removing or installing the PCI riser cage.  
1.  
2.  
Power down the server (on page 16).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Do one of the following:  
3.  
o
o
Extend the server from the rack (on page 16).  
Remove the server from the rack (on page 17).  
4.  
5.  
6.  
Remove the access panel (on page 18).  
Disconnect all cables connected to any existing expansion board.  
Lift the release tabs, and then rotate them 180° counterclockwise.  
Operations 19  
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7.  
Lift the PCI riser cage to unseat the riser boards.  
Install the PCI riser cage  
CAUTION: To prevent damage to the server or expansion boards, power down the server, and  
disconnect all power cords before removing or installing the PCI riser cage.  
1.  
2.  
Align the riser boards with the corresponding connectors on the system board, and then press down the  
PCI riser cage.  
Push down the release tabs, and then rotate them 180° clockwise.  
3.  
4.  
5.  
Install the access panel (on page 19).  
Install the server into the rack.  
Power up the server (on page 16).  
Operations 20  
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Setup  
Optional installation services  
Delivered by experienced, certified engineers, HP Care Pack services help you keep your servers up and  
running with support packages tailored specifically for HP ProLiant systems. HP Care Packs let you integrate  
both hardware and software support into a single package. A number of service level options are available  
to meet your needs.  
HP Care Pack Services offer upgraded service levels to expand your standard product warranty with  
easy-to-buy, easy-to-use support packages that help you make the most of your server investments. Some of  
the Care Pack services are:  
Hardware support  
o
o
o
6-Hour Call-to-Repair  
4-Hour 24x7 Same Day  
4-Hour Same Business Day  
Software support  
o
o
o
o
Microsoft®  
Linux  
HP ProLiant Essentials (HP SIM and RDP)  
VMWare  
Integrated hardware and software support  
o
o
o
o
Critical Service  
Proactive 24  
Support Plus  
Support Plus 24  
Startup and implementation services for both hardware and software  
For more information on HP Care Pack Services, see the HP website  
Rack planning resources  
The rack resource kit ships with all HP branded or Compaq branded 9000, 10000, and H9 series racks. For  
more information on the content of each resource, see the rack resource kit documentation.  
Optimum environment  
When installing the server in a rack, select a location that meets the environmental standards described in  
this section.  
Setup 21  
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Space and airflow requirements  
To allow for servicing and adequate airflow, observe the following space and airflow requirements when  
deciding where to install a rack:  
Leave a minimum clearance of 63.5 cm (25 inches) in front of the rack.  
Leave a minimum clearance of 76.2 cm (30 inches) behind the rack.  
Leave a minimum clearance of 121.9 cm (48 inches) from the back of the rack to the back of another  
rack or row of racks.  
HP servers draw in cool air through the front and expel warm air through the rear. Therefore, the front and  
rear rack doors must be adequately ventilated to allow ambient room air to enter the cabinet, and the rear  
door must be adequately ventilated to allow the warm air to escape from the cabinet.  
CAUTION: To prevent improper cooling and damage to the equipment, do not block the  
ventilation openings.  
When vertical space in the rack is not filled by a server or rack component, the gaps between the  
components might cause changes in airflow through the rack and across the servers. To maintain airflow  
cover all gaps with blanking panels.  
CAUTION: Always use blanking panels to fill empty vertical spaces in the rack. This arrangement  
ensures proper airflow. Using a rack without blanking panels results in improper cooling that can  
lead to thermal damage.  
The 9000 and 10000 series racks provide proper server cooling from flow-through perforations in the front  
and rear doors that provide 64% open area for ventilation.  
CAUTION: When using a Compaq branded 7000 series rack, install the high airflow rack door  
insert (PN 327281-B21 for 42U rack, PN 157847-B21 for 22U rack) to provide proper  
front-to-back airflow and cooling.  
CAUTION: If a third-party rack is used, observe the following additional requirements to ensure  
adequate airflow and to prevent damage to the equipment:  
Front and rear doors—If the 42U rack includes closing front and rear doors, you must allow  
5,350 sq cm (830 sq in) of holes evenly distributed from top to bottom to permit adequate  
airflow (equivalent to the required 64 percent open area for ventilation).  
Side—The clearance between the installed rack component and the side panels of the rack  
must be a minimum of 7 cm (2.75 in).  
Temperature requirements  
To ensure continued safe and reliable equipment operation, install or position the system in a well-ventilated,  
climate-controlled environment.  
The maximum recommended ambient operating temperature (TMRA) for most server products is 35°C  
(95°F). The temperature in the room where the rack is located must not exceed 35°C (95°F).  
CAUTION: To reduce the risk of damage to the equipment when installing third-party options:  
Do not permit optional equipment to impede airflow around the server or to increase the  
internal rack temperature beyond the maximum allowable limits.  
Do not exceed the manufacturer’s TMRA.  
Setup 22  
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Power requirements  
Installation of this equipment must comply with local and regional electrical regulations governing the  
installation of information technology equipment by licensed electricians. This equipment is designed to  
operate in installations covered by NFPA 70, 1999 Edition (National Electric Code) and NFPA-75, 1992  
(code for Protection of Electronic Computer/Data Processing Equipment). For electrical power ratings on  
options, refer to the product rating label or the user documentation supplied with that option.  
WARNING: To reduce the risk of personal injury, fire, or damage to the equipment, do not  
overload the AC supply branch circuit that provides power to the rack. Consult the electrical  
authority having jurisdiction over wiring and installation requirements of your facility.  
CAUTION: Protect the server from power fluctuations and temporary interruptions with a  
regulating uninterruptible power supply. This device protects the hardware from damage caused  
by power surges and voltage spikes and keeps the system in operation during a power failure.  
When installing more than one server, you might need to use additional power distribution devices to safely  
provide power to all devices. Observe the following guidelines:  
Balance the server power load between available AC supply branch circuits.  
Do not allow the overall system AC current load to exceed 80 percent of the branch circuit AC current  
rating.  
Do not use common power outlet strips for this equipment.  
Provide a separate electrical circuit for the server.  
For more information on the hot-plug power supply and calculators to determine server power consumption  
in various system configurations, refer to the HP Enterprise Configurator website  
Electrical grounding requirements  
The server must be grounded properly for proper operation and safety. In the United States, you must install  
the equipment in accordance with NFPA 70, 1999 Edition (National Electric Code), Article 250, as well as  
any local and regional building codes. In Canada, you must install the equipment in accordance with  
Canadian Standards Association, CSA C22.1, Canadian Electrical Code. In all other countries, you must  
install the equipment in accordance with any regional or national electrical wiring codes, such as the  
International Electrotechnical Commission (IEC) Code 364, parts 1 through 7. Furthermore, you must be sure  
that all power distribution devices used in the installation, such as branch wiring and receptacles, are listed  
or certified grounding-type devices.  
Because of the high ground-leakage currents associated with multiple servers connected to the same power  
source, HP recommends the use of a PDU that is either permanently wired to the building’s branch circuit or  
includes a nondetachable cord that is wired to an industrial-style plug. NEMA locking-style plugs or those  
complying with IEC 60309 are considered suitable for this purpose. Using common power outlet strips for  
the server is not recommended.  
Connecting a DC power cable to a DC power source  
Setup 23  
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WARNING: To reduce the risk of electric shock or energy hazards:  
This equipment must be installed by trained service personnel, as defined by the NEC and IEC  
60950-1, Second Edition, the standard for Safety of Information Technology Equipment.  
Connect the equipment to a reliably grounded SELV source. An SELV source is a secondary  
circuit that is designed so normal and single fault conditions do not cause the voltages to  
exceed a safe level (60 V direct current).  
The branch circuit overcurrent protection must be rated 20A.  
WARNING: When installing a DC power supply, the ground wire must be connected before the  
positive or negative leads.  
WARNING: Remove power from the power supply before performing any installation steps or  
maintenance on the power supply.  
CAUTION: The server equipment connects the earthed conductor of the DC supply circuit to the  
earthing conductor at the equipment. For more information, see the HP 750W Common Slot -48V  
DC Input Hot-Plug Power Supply Kit Installation Instructions.  
CAUTION: If the DC connection exists between the earthed conductor of the DC supply circuit and  
the earthing conductor at the server equipment, the following conditions must be met:  
This equipment must be connected directly to the DC supply system earthing electrode  
conductor or to a bonding jumper from an earthing terminal bar or bus to which the DC supply  
system earthing electrode conductor is connected.  
This equipment should be located in the same immediate area (such as adjacent cabinets) as  
any other equipment that has a connection between the earthed conductor of the same DC  
supply circuit and the earthing conductor, and also the point of earthing of the DC system. The  
DC system should be earthed elsewhere.  
The DC supply source is to be located within the same premises as the equipment.  
Switching or disconnecting devices should not be in the earthed circuit conductor between the  
DC source and the point of connection of the earthing electrode conductor.  
To connect a DC power cable to a DC power source:  
1.  
2.  
Cut the DC power cord ends no shorter than 150 cm (59.06 in).  
If the power source requires ring tongues, use a crimping tool to install the ring tongues on the power  
cord wires.  
IMPORTANT: The ring tongues must be UL approved and accommodate 12 gauge wires.  
IMPORTANT: The minimum nominal thread diameter of a pillar or stud type terminal must be 3.5  
mm (0.138 in); the diameter of a screw type terminal must be 4.0 mm (0.157 in).  
3.  
Stack each same-colored pair of wires and then attach them to the same power source. The power cord  
consists of three wires (black, red, and green).  
For more information, see the HP 750W Common Slot -48V DC Input Hot-Plug Power Supply Installation  
Instructions.  
Server warnings and cautions  
Setup 24  
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WARNING: This server is very heavy. To reduce the risk of personal injury or damage to the  
equipment:  
Observe local occupational health and safety requirements and guidelines for manual  
material handling.  
Get help to lift and stabilize the product during installation or removal, especially when the  
product is not fastened to the rails. HP recommends that a minimum of two people are required  
for all rack server installations. A third person may be required to help align the server if the  
server is installed higher than chest level.  
Use caution when installing the server in or removing the server from the rack; it is unstable  
when not fastened to the rails.  
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the  
internal system components to cool before touching them.  
WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment,  
remove the power cord to remove power from the server. The front panel Power On/Standby  
button does not completely shut off system power. Portions of the power supply and some internal  
circuitry remain active until AC/DC power is removed.  
CAUTION: Protect the server from power fluctuations and temporary interruptions with a  
regulating uninterruptible power supply. This device protects the hardware from damage caused  
by power surges and voltage spikes and keeps the system in operation during a power failure.  
CAUTION: Do not operate the server for long periods with the access panel open or removed.  
Operating the server in this manner results in improper airflow and improper cooling that can  
lead to thermal damage.  
Rack warnings  
WARNING: To reduce the risk of personal injury or damage to the equipment, be sure that:  
The leveling jacks are extended to the floor.  
The full weight of the rack rests on the leveling jacks.  
The stabilizing feet are attached to the rack if it is a single-rack installation.  
The racks are coupled together in multiple-rack installations.  
Only one component is extended at a time. A rack may become unstable if more than one  
component is extended for any reason.  
WARNING: To reduce the risk of personal injury or equipment damage when unloading a rack:  
At least two people are needed to safely unload the rack from the pallet. An empty 42U rack  
can weigh as much as 115 kg (253 lb), can stand more than 2.1 m (7 ft) tall, and might  
become unstable when being moved on its casters.  
Never stand in front of the rack when it is rolling down the ramp from the pallet. Always handle  
the rack from both sides.  
WARNING: To reduce the risk of personal injury or damage to the equipment, adequately  
stabilize the rack before extending a component outside the rack. Extend only one component at  
a time. A rack may become unstable if more than one component is extended.  
Setup 25  
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WARNING: When installing a server in a telco rack, be sure that the rack frame is adequately  
secured at the top and bottom to the building structure.  
Identifying the contents of the server shipping carton  
Unpack the server shipping carton and locate the materials and documentation necessary for installing the  
server. All the rack mounting hardware necessary for installing the server into the rack is included with the  
rack or the server.  
The contents of the server shipping carton include:  
Server  
Power cord  
Printed setup documentation, documentation CD, and software products  
Rack mounting hardware kit and documentation (optional)  
In addition to these supplied items, you might need:  
T-10/T-15 Torx screwdriver  
T-25 Torx screwdriver (for the screws located inside the server quick-release levers)  
Hardware options  
Operating system or application software  
Installing hardware options  
Install any hardware options before initializing the server. For options installation information, see the option  
documentation. For server-specific information, see "Hardware options installation (on page 29)."  
Installing the server into the rack  
To install the server into a rack with square, round, or threaded holes, refer to the instructions that ship with  
the rack hardware kit.  
If you are installing the server into a telco rack, order the appropriate option kit at the RackSolutions.com  
website (http://www.racksolutions.com/hp). Follow the server-specific instructions on the website to install  
the rack brackets.  
WARNING: This server is very heavy. To reduce the risk of personal injury or damage to the  
equipment:  
Observe local occupational health and safety requirements and guidelines for manual  
material handling.  
Get help to lift and stabilize the product during installation or removal, especially when the  
product is not fastened to the rails. HP recommends that a minimum of two people are required  
for all rack server installations. A third person may be required to help align the server if the  
server is installed higher than chest level.  
Use caution when installing the server in or removing the server from the rack; it is unstable  
when not fastened to the rails.  
Setup 26  
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CAUTION: Always plan the rack installation so that the heaviest item is on the bottom of the rack.  
Install the heaviest item first, and continue to populate the rack from the bottom to the top.  
To install the server in an HP, Compaq-branded, Telco, or third party rack:  
1.  
Install the server and cable management arm option into the rack. See the documentation that ships with  
the Quick Deploy Rail System.  
2.  
Connect the peripheral devices to the server. For information on identifying connectors, see "Rear panel  
components (on page 8)."  
WARNING: To reduce the risk of electric shock, fire, or damage to the equipment, do not plug  
telephone or telecommunications connectors into RJ-45 connectors.  
3.  
4.  
Connect the power cord to the server.  
Use the strain relief clip from the server hardware kit to secure the power cord.  
5.  
Connect the power cord to the power source.  
WARNING: To reduce the risk of electric shock or damage to the equipment:  
Do not disable the power cord grounding plug. The grounding plug is an important safety  
feature.  
Plug the power cord into a grounded (earthed) electrical outlet that is easily accessible at all  
times.  
Unplug the power cord from the power supply to disconnect power to the equipment.  
Do not route the power cord where it can be walked on or pinched by items placed against it.  
Pay particular attention to the plug, electrical outlet, and the point where the cord extends from  
the server.  
Installing the operating system  
This ProLiant server does not ship with provisioning media. Everything needed to manage and install the  
system software and firmware is preloaded on the server.  
Setup 27  
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To operate properly, the server must have a supported operating system. For the latest information on  
operating system support, see the HP website (http://www.hp.com/go/supportos).  
To install an operating system on the server, use one of the following methods:  
Intelligent Provisioning—The iLO Management Engine is a new feature on ProLiant servers that contains  
Intelligent Provisioning for embedded deployment, updating, and provisioning capabilities. Intelligent  
Provisioning can configure the server and install an operating system, eliminating the need for  
SmartStart CDs and Smart Update Firmware DVDs.  
To install an operating system on the server with Intelligent Provisioning (local or remote):  
a. Connect the Ethernet cable, and then power on the server.  
b. During server POST, press the F10 key.  
c. Complete the initial Preferences and Registration portion of Intelligent Provisioning (on page 79).  
d. At the 1 Start screen, click the Configure and Install button.  
e. To finish the installation, follow the onscreen prompts. An Internet connection is required to update  
the firmware and systems software.  
Remote deployment installation—To remotely deploy an operating system, use Insight Control server  
deployment for an automated solution.  
For additional system software and firmware updates, download the HP Service Pack for ProLiant from the HP  
website (http://www.hp.com/go/spp/download). Software and firmware must be updated before using  
the server for the first time, unless any installed software or components require an older version. For more  
information, see "Keeping the system current (on page 87)."  
The Smart Update Firmware DVD ISO is also available at the download tab on the HP website  
For more information on using these installation methods, see the HP website (http://www.hp.com/go/ilo).  
Powering on and selecting boot options  
1.  
2.  
Connect the Ethernet cable and press the Power On/Standby button.  
During the initial boot:  
o
o
To modify the server configuration ROM default settings, press F9 when prompted from the start up  
sequence to enter the RBSU. By default, RBSU runs in the English language.  
If you do not need to modify the server configuration and are ready to install the system software,  
press F10 to access Intelligent Provisioning.  
NOTE: If an HP Smart Array controller has been added or is embedded in the system, the  
controller defaults to a RAID configuration based on the size and number of hard drives installed.  
For more information on modifying the controller default settings, see the documentation on the  
Documentation CD.  
For more information on automatic configuration, see the HP ROM-Based Setup Utility User Guide on the  
Documentation CD or the iLO Management Engine Information Library  
Registering the server  
To register the server, refer to the HP Registration website (http://register.hp.com).  
Setup 28  
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Hardware options installation  
Introduction  
If more than one option is being installed, read the installation instructions for all the hardware options and  
identify similar steps to streamline the installation process.  
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the  
internal system components to cool before touching them.  
CAUTION: To prevent damage to electrical components, properly ground the server before  
beginning any installation procedure. Improper grounding can cause electrostatic discharge.  
Security bezel option  
The security bezel helps prevent unauthorized physical access to the front panel components.  
Install the security bezel, and then lock it with the key provided with the kit.  
Front video adapter option  
Depending on the model purchased, the server may look different than shown.  
To install the component:  
1.  
Connect the front video adapter to the front video connector.  
CAUTION: Be sure to connect the video adapter to the video connector, and not to the USB  
connector.  
Hardware options installation 29  
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2.  
Connect the front video adapter to the video device.  
To remove the front video adapter, squeeze the top and bottom together to release the locking mechanism.  
Drive options  
The embedded storage controller supports SATA drive installation. For SAS drive installation, install the  
storage controller card and Mini-SAS cable option kits. The storage controller card option supports both  
SATA and SAS drives.  
Drive installation guidelines  
When adding hard drives to the server, observe the following general guidelines:  
The system automatically sets all drive numbers.  
Hardware options installation 30  
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Populate drive bays, based on the drive numbering sequence. Start from the drive bay with the lowest  
device number ("Drive numbering" on page 12).  
When drives are grouped together into the same drive array, they must be of the same capacity to  
provide the greatest storage space efficiency.  
Installing a hot-plug drive  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all bays are populated with either a component or a blank.  
To install the component:  
Remove the hot-plug drive blank.  
1.  
2.  
Prepare the drive.  
3.  
Install the drive.  
Hardware options installation 31  
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4.  
Determine the status of the drive from the drive LED definitions (on page 13).  
Drive cable options  
Two-port SATA cable option  
When this cable option is installed in the eight-bay drive cage, the server supports the six-drive SATA  
configuration. In this configuration, drive bays 1 through 6 are populated, while drive bays 7 and 8 contain  
drive blanks.  
To connect the cable option:  
1.  
2.  
Power down the server (on page 16).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Do one of the following:  
3.  
o
o
Extend the server from the rack (on page 16).  
Remove the server from the rack (on page 17).  
4.  
5.  
6.  
Remove the access panel (on page 18).  
Remove the PCI riser cage (on page 19).  
Attach the cable clip on top of the square silkscreen marker near the processor 1 DIMM slots.  
7.  
Connect the two-port SATA cable:  
a. Connect the cable to the drive sideband signal connector.  
b. Secure the cable in the cable clip.  
c. Connect the cable to the SATA storage and optical drive connectors.  
Hardware options installation 32  
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d. Route the cable along the side of the system board towards the front chassis, and then connect the  
cable to the drive backplane.  
8.  
9.  
Connect the rest of the drive cables required in this drive configuration. For more information, see  
"Storage cabling (on page 70)."  
Install the PCI riser cage (on page 20).  
10. Install the access panel (on page 19).  
11. Install the server into the rack ("Installing the server into the rack" on page 26).  
12. Install the drives ("Drive options" on page 30).  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all bays are populated with either a component or a blank.  
13. Power up the server (on page 16).  
Mini-SAS cable option  
To connect the cable option:  
1.  
2.  
Power down the server (on page 16).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Do one of the following:  
3.  
o
o
Extend the server from the rack (on page 16).  
Remove the server from the rack (on page 17).  
4.  
5.  
Remove the access panel (on page 18).  
Remove the PCI riser cage (on page 19).  
Hardware options installation 33  
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6.  
Connect the Mini-SAS cable to the storage controller.  
7.  
8.  
Install the storage controller ("Installing a storage controller" on page 37).  
In the four-bay LFF drive cage configuration, route the Mini-SAS cable along the side of the system  
board towards the front chassis, and then connect the cable to the drive backplane:  
o
Four-bay LFF drive cage with Mini-SAS cable connected to the full-height slot  
Hardware options installation 34  
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o
Four-bay LFF drive cage with Mini-SAS cable connected to the low-profile slot  
9.  
In the four-bay LFF drive cage configuration, HP recommends securing the excess length of the 890 mm  
Mini-SAS cable by using the cable clip that came with the kit:  
a. Use the two vertical dash marks in front of the fan cage to position the clip correctly, and then attach  
the cable clip.  
b. Secure the excess length of the 890 mm Mini-SAS cable in the cable clip.  
10. In the eight-bay SFF drive cage configuration, route the Mini-SAS cable along the side of the system  
board towards the front chassis, and then connect the cable to the drive backplane.  
Hardware options installation 35  
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o
Eight-bay SFF drive cage with Mini-SAS cables connected to the full-height slot  
o
Eight-bay SFF drive cage with Mini-SAS cables connected to the low-profile slot  
11. Connect the rest of the drive cables required in this drive configuration. For more information, see  
"Storage cabling (on page 70)."  
12. Install the access panel (on page 19).  
13. Install the server into the rack ("Installing the server into the rack" on page 26).  
14. Install the drives ("Drive options" on page 30).  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all bays are populated with either a component or a blank.  
15. Power up the server (on page 16).  
Hardware options installation 36  
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Controller options  
The server ships with an embedded Smart Array B120i controller. For more information about the controller  
and its features, see the HP Dynamic Smart Array RAID Controller User Guide on the HP website  
To configure arrays, see the Configuring Arrays on HP Smart Array Controllers Reference Guide on the HP  
Upgrade options exist for the integrated array controller. For a list of supported options, see the QuickSpecs  
The server supports FBWC. FBWC consists of a cache module and a capacitor pack. The DDR cache module  
buffers and stores data being written by the controller. When the system is powered on, the capacitor pack  
fully charges in approximately 5 minutes. If a system power failure occurs, a fully charged capacitor pack  
provides power for up to 80 seconds. During that interval, the controller transfers the cached data from DDR  
memory to flash memory, where the data remains indefinitely or until a controller retrieves the data.  
The data protection and the time limit also apply if a power outage occurs. When power is restored to the  
system, an initialization process writes the preserved data to the storage drives.  
CAUTION: The cache module connector does not use the industry-standard DDR3 mini-DIMM  
pinout. Do not use this controller with cache modules designed for other controller models,  
because the controller can malfunction and you can lose data. Also, do not transfer this cache  
module to an unsupported controller model, because you can lose data.  
CAUTION: To prevent a server malfunction or damage to the equipment, do not add or remove  
the capacitor pack while an array capacity expansion, RAID level migration, or stripe size  
migration is in progress.  
CAUTION: After the server is powered down, wait for 30 seconds, and then check the amber LED  
before unplugging the cable from the cache module. If the amber LED flashes after 30 seconds,  
do not remove the cable from the cache module. The cache module is backing up data. Data will  
be lost if the cable is detached when the amber LED is still flashing.  
IMPORTANT: The capacitor pack might have a low charge when installed. If the pack does have  
low charge a POST error message appears when the server is powered up, indicating that the  
capacitor pack is temporarily disabled. No action is necessary. The internal circuitry  
automatically recharges the capacitors and enables the capacitor pack. This process might take  
up to 4 hours. During this time, the cache module functions properly but without the performance  
advantage of the capacitor pack.  
Installing a storage controller  
HP recommends installing the storage controller option in a full-height expansion slot for better cable routing.  
IMPORTANT: For additional installation and configuration information, refer to the  
documentation that ships with the option.  
To install the component:  
1.  
2.  
Power down the server (on page 16).  
Remove all power:  
Hardware options installation 37  
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a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Do one of the following:  
3.  
o
o
Extend the server from the rack (on page 16).  
Remove the server from the rack (on page 17).  
4.  
5.  
6.  
Remove the access panel (on page 18).  
Install the storage controller ("Expansion board options" on page 60).  
Connect all necessary internal and external cabling to the storage controller. For more information on  
these cabling requirements, see the document the ships with the option. For internal cable routing  
information in different drive configurations, see "Storage cabling (on page 70)."  
7.  
8.  
9.  
Install the access panel (on page 19).  
Install the server into the rack ("Installing the server into the rack" on page 26).  
Install the drives ("Drive options" on page 30).  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all bays are populated with either a component or a blank.  
10. Power up the server (on page 16).  
To configure arrays, see the Configuring Arrays on HP Smart Array Controllers Reference Guide on the HP  
Upgrade options exist for the integrated array controller. For a list of supported options, see the QuickSpecs  
Installing the FBWC module and capacitor pack  
CAUTION: In systems that use external data storage, be sure that the server is the first unit to be  
powered down and the last to be powered back up. Taking this precaution ensures that the system  
does not erroneously mark the drives as failed when the server is powered up.  
To install the component:  
1.  
2.  
Power down the server (on page 16).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Do one of the following:  
3.  
o
o
Extend the server from the rack (on page 16).  
Remove the server from the rack (on page 17).  
4.  
5.  
Remove the access panel (on page 18).  
Remove the PCI riser cage (on page 19).  
CAUTION: When connecting or disconnecting the capacitor pack cable, the connectors on the  
cache module and cable are susceptible to damage. Avoid excessive force and use caution to  
avoid damage to these connectors.  
Hardware options installation 38  
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6.  
Connect the capacitor pack cable to the cache module.  
7.  
Do one of the following:  
o
When using the embedded array controller, install the cache module on the system board, and then  
install the PCI riser cage ("Install the PCI riser cage" on page 20).  
o
When using an integrated array controller, install the cache module on the storage controller, and  
then install the controller in the PCI riser cage ("Install the PCI riser cage" on page 20).  
Hardware options installation 39  
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8.  
9.  
Route the capacitor pack cable towards the front chassis.  
For more information on capacitor pack cabling in different drive configurations, see "Storage cabling  
(on page 70)."  
Install the capacitor pack:  
a. Insert the cable end of the capacitor pack in the holder.  
b. Press the opposite end of the capacitor pack in the holder.  
10. Install the access panel (on page 19).  
11. Install the server into the rack ("Installing the server into the rack" on page 26).  
12. Power up the server (on page 16).  
Optical drive option  
To install the component:  
1.  
2.  
Power down the server (on page 16).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Do one of the following:  
3.  
4.  
o
o
Extend the server from the rack (on page 16).  
Remove the server from the rack (on page 17).  
Remove the optical drive blank:  
Hardware options installation 40  
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o
Four-bay LFF drive model  
o
Eight-bay SFF drive model  
5.  
6.  
7.  
Remove the access panel (on page 18).  
Remove the PCI riser cage (on page 19).  
If you are installing the optical drive in an LFF drive model, do the following:  
Hardware options installation 41  
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a. Thread the optical drive cable through the optical drive bay.  
b. Connect the cable to the optical drive.  
8.  
Install the optical drive into the bay, and then secure it with the screw:  
o
Four-bay LFF drive model  
Hardware options installation 42  
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o
Eight-bay SFF drive model  
9.  
If you are installing the optical drive in an SFF drive model, connect the optical drive cable to the optical  
drive.  
10. Route the optical drive cable along the side of the system board, and then connect the cable to the  
system board:  
o
Four-bay LFF drive model  
Hardware options installation 43  
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o
Eight-bay SFF drive model  
11. Install the PCI riser cage (on page 20).  
12. Install the access panel (on page 19).  
13. Install the server into the rack ("Installing the server into the rack" on page 26).  
14. Power up the server (on page 16).  
Hot-plug fan module option  
To provide sufficient airflow to the system if a fan rotor fails, the server supports redundant fans.  
Fan population guidelines  
In a single-processor, nonredundant configuration, fans 5, 6, 7, and 8 cool the server. To enable a  
redundant fan mode, install a new fan in the fan bay 1.  
In a dual-processor configuration, nonrendundant fan mode is not supported; all eight fans are required.  
Hardware options installation 44  
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In a redundant fan mode:  
If one fan rotor fails, the system continues to operate without redundancy. This condition is indicated by  
a flashing amber Health LED.  
If two fan rotors fail, the system shuts down.  
Installing a hot-plug fan module if the server is installed in a  
ball-bearing rail system with the cable management arm  
CAUTION: To prevent the potential for thermal damage and system shutdown, ensure that a  
functioning server has all feature bays populated with the required component or blank and the  
access panel is installed within 60 seconds of being serviced.  
1.  
2.  
Pull down the quick release levers on each side of the server.  
WARNING: To reduce the risk of personal injury or equipment damage, be sure that the rack is  
adequately stabilized before extending a component from the rack.  
Extend the server on the rack rails until the server rail-release latches engage.  
If the server does not extend from the rack, use a T-25 Torx screwdriver to loosen the screws in the lever  
housing.  
3.  
4.  
Open the latch, slide the access panel to the rear of the chassis, and then remove the access panel.  
If the latch is locked, use a T-15 Torx screwdriver to unlock the latch.  
Do one of the following:  
o
Remove the fan blank in a nonredundant configuration.  
Hardware options installation 45  
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o
Remove the defective fan in a failed redundant fan configuration.  
5.  
Install the fan module into the fan bay.  
6.  
7.  
8.  
Install the access panel (on page 19).  
Slide the server back into the rack.  
If the fan installation was made to upgrade the server from a nonredundant to a redundant fan mode,  
reboot the server.  
Installing a hot-plug fan module if the server is installed in a friction  
rail system  
1.  
Press the Power On/Standby button.  
The server exits standby mode and applies full power to the system. The system power LED changes  
from amber to green.  
2.  
Remove all power:  
Hardware options installation 46  
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a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Remove the server from the rack (on page 17).  
Remove the access panel (on page 18).  
Do one of the following:  
3.  
4.  
5.  
o
Remove the fan blank in a nonredundant configuration.  
o
Remove the defective fan in a failed redundant configuration.  
Hardware options installation 47  
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6.  
Install the fan module into the fan bay.  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all bays are populated with either a component or a blank.  
7.  
8.  
9.  
Install the access panel (on page 19).  
Install the server into the rack ("Installing the server into the rack" on page 26).  
Connect each power cord to the server.  
10. Connect each power cord to the power source.  
11. Press the Power On/Standby button.  
The server powers down and enters standby mode. The system power LED changes from green to  
amber. Power is still applied to the server.  
Memory options  
IMPORTANT: This server does not support mixing LRDIMMs, RDIMMs, or UDIMMs. Attempting  
to mix any combination of these DIMMs can cause the server to halt during BIOS initialization.  
The memory subsystem in this server can support LRDIMMs, RDIMMs, or UDIMMs.  
UDIMMs represent the basic type of memory module and offer lower latency and (relatively) low power  
consumption, but are limited in capacity.  
RDIMMs offer larger capacities than UDIMMs and include address parity protection.  
LRDIMMs support higher densities than single-rank and dual-rank RDIMMs. This support enables you to  
install more high capacity DIMMs, resulting in higher system capacities and higher bandwidth.  
All types are referred to as DIMMs when the information applies to all types. When specified as LRDIMM,  
RDIMM, or UDIMM, the information applies to that type only. All memory installed in the server must be of  
the same type.  
The server supports the following DIMM speeds:  
Single-rank and dual-rank PC3-10600 (DDR-1333) UDIMMs operating at up to 1333 MT/s  
Hardware options installation 48  
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Single-rank and dual-rank PC3-10600 (DDR-1333) RDIMMs operating at up to 1333 MT/s  
Single-rank and dual-rank PC3-12800 (DDR-1600) RDIMMs operating at up to 1600 MT/s  
Quad-rank PC3L-10600 (DDR3L-1333) LRDIMMs operating at up to 1333 MT/s  
Depending on the processor model, the number of DIMMs installed, and whether LRDIMMs, UDIMMs, or  
RDIMMs are installed, the memory clock speed can be reduced to 1333 or 1066 MT/s. Clock speed can  
also be reduced when using low-voltage DIMMs.  
Supported DIMM specifications  
Type  
Rank  
Single  
Dual  
Capacity  
4 GB, 8 GB  
8 GB,16 GB  
Native speed  
1600 MT/s  
1600 MT/s  
Voltage  
STD  
RDIMM  
RDIMM  
STD  
Single  
Dual  
4 GB  
1333 MT/s  
1333 MT/s  
1333 MT/s  
1333 MT/s  
1600 MT/s  
1333 MT/s  
1600 MT/s  
LV  
RDIMM  
RDIMM  
LRDIMM  
UDIMM  
UDIMM  
UDIMM  
UDIMM  
8 GB, 16 GB  
32 GB  
LV  
Quad  
Single  
Single  
Dual  
LV  
2 GB  
LV  
2 GB  
STD  
LV  
4 GB, 8 GB  
4 GB  
Dual  
STD  
Populated DIMM speed (MT/s)  
Type  
Rank  
1 DIMM per channel  
1600 MT/s  
2 DIMMs per channel  
1600 MT/s  
Single (8 GB)  
Dual (8 GB)  
Dual (16 GB)  
Quad (32 GB)  
Dual (8 GB)  
RDIMM  
RDIMM  
RDIMM  
LRDIMM  
UDIMM  
1600 MT/s  
1600 MT/s  
1600 MT/s  
1600 MT/s  
1333 MT/s**  
1600 MT/s  
1333 MT/s**  
1600 MT/s  
** LRDIMM enables 2 DPC. HP SmartMemory supports up to 2 DPC at 1333 MT/s at 1.35 V. Third-party memory  
supports only 1.5 V.  
HP SmartMemory  
HP SmartMemory, introduced for Gen8 servers, authenticates and unlocks certain features available only on  
HP Qualified memory and verifies whether installed memory has passed HP qualification and test processes.  
Qualified memory is performance-tuned for HP ProLiant and BladeSystem servers and provides future  
enhanced support through HP Active Health and manageability software.  
Certain performance features are unique with HP SmartMemory. HP SmartMemory 1.35V DDR3-1333  
Registered memory is engineered to achieve the same performance level as 1.5V memory. For example,  
while the industry supports DDR3-1333 RDIMM at 1.5V, this Gen8 server supports DDR3-1333 RDIMM up  
to 3 DIMMs per channel at 1066 MT/s running at 1.35V. This equates to up to 20% less power at the DIMM  
level with no performance penalty. In addition, the industry supports UDIMM at 2 DIMMs per channel at  
1066 MT/s. HP SmartMemory supports 2 DIMMs per channel at 1333 MT/s, or 25% greater bandwidth.  
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DIMM identification  
To determine DIMM characteristics, use the label attached to the DIMM and the following illustration and  
table.  
Item Aspect  
Definition  
Size  
1
2
Rank  
1R = Single rank  
2R = Dual rank  
4R = Quad rank  
Data width  
x4 = 4 bit  
x8 = 8 bit  
3
4
Voltage rating  
L = Low voltage (1.35 V)  
U = Ultra low voltage (1.25 V)  
Blank or omitted = Standard  
Memory speed  
DIMM type  
12800 = 1600 MT/s  
10600 = 1333 MT/s  
8500 = 1066 MT/s  
5
6
R = RDIMM (registered)  
E = UDIMM (unbuffered with ECC)  
L = LRDIMM (load reduced)  
For the latest supported memory information, see the QuickSpecs on the HP website (http://www.hp.com).  
Single-rank and dual-rank DIMMs  
DIMM configuration requirements are based on these classifications:  
Single-rank DIMM—One set of memory chips that is accessed while writing to or reading from the  
memory.  
Dual-rank DIMM—Two single-rank DIMMs on the same module, with only one rank accessible at a time.  
The server memory control subsystem selects the proper rank within the DIMM when writing to or reading  
from the DIMM.  
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Dual-rank DIMMs provide the greatest capacity with the existing memory technology. For example, if current  
DRAM technology supports 2-GB single-rank DIMMs, a dual-rank DIMM would be 4 GB.  
Memory subsystem architecture  
The memory subsystem in this server is divided into channels. Each processor supports three channels, and  
each channel supports two DIMM slots.  
Channel  
Population order  
Slot number  
A
D
1
2
1
B
E
3
4
2
3
C
F
5
6
DIMM slots in this server are identified by number and by letter. Letters identify the population order. Slot  
numbers are reported by ROM messages during boot and for error reporting. For more information, see  
"DIMM slot locations (on page 11)."  
Memory protection modes  
To optimize server availability, the server supports the following AMP modes:  
Advanced ECC—Provides up to 4-bit error correction and enhanced performance over Lockstep  
memory mode. This mode is the default option for the server.  
Online Spare Memory—Provides protection against failing or degraded DIMMs. Certain memory is  
reserved as spare, and automatic failover to spare memory occurs when the system detects a DIMM that  
is degrading. This enables DIMMs that have a higher probability of receiving an uncorrectable memory  
error (which results in system downtime) to be removed from operation.  
The server also can operate in independent channel mode or combined channel mode (Lockstep Memory  
mode). When running in Lockstep Memory mode, you gain reliability in one of two ways:  
If running with UDIMMs (built with x8 DRAM devices), the system can survive a complete DRAM failure  
(SDDC). In independent channel mode, this failure would be an uncorrectable error.  
If running with RDIMM (built with x4 DRAM devices), the system can survive the complete failure of two  
DRAM devices (DDDC). Running in independent mode, the server can only survive the complete failure  
of a single DRAM device (SDDC).  
Advanced Memory Protection options are configured in RBSU. If the requested AMP mode is not supported  
by the installed DIMM configuration, the server boots in Advanced ECC mode. For more information, see  
"HP ROM-Based Setup Utility (on page 82)."  
Advanced ECC  
Advanced ECC memory is the default memory protection mode for the server. Standard ECC can correct  
single-bit memory errors and detect multibit memory errors. When multibit errors are detected using Standard  
ECC, the error is signaled to the server and causes the server to halt.  
Advanced ECC protects the server against some multibit memory errors. Advanced ECC can correct both  
single-bit memory errors and 4-bit memory errors if all failed bits are on the same DRAM device on the DIMM.  
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Advanced ECC provides additional protection over Standard ECC because it is possible to correct certain  
memory errors that would otherwise be uncorrected and result in a server failure. Using HP Advanced  
Memory Error Detection technology, the server provides notification when a DIMM is degrading and has a  
higher probability of uncorrectable memory error.  
Online Spare memory  
Online Spare memory mode provides protection against degraded DIMMs by reducing the likelihood of  
uncorrected memory errors. This protection is available without any operating system support.  
Online Spare memory protection dedicates one rank of each memory channel for use as spare memory. The  
remaining ranks are available for OS and application use. If correctable memory errors occur at a rate  
higher than a specific threshold on any of the non-spare ranks, the server automatically copies the memory  
contents of the degraded rank to the online spare rank. The server then deactivates the failing rank and  
automatically switches over to the online spare rank.  
Lockstep Memory mode  
Lockstep memory mode provides protection against multibit memory errors that occur on the same DRAM  
device. Lockstep memory mode can correct any single DRAM device failure on x4 and x8 DIMM types. The  
DIMMs in each channel must have identical HP part numbers.  
Lockstep memory mode uses channel 1 and channel 2. Channel 3 is not populated. Because channel 3  
cannot be populated when using Lockstep memory mode, the maximum memory capacity is lower than  
Advanced ECC mode. Memory performance with Advanced ECC is also slightly higher.  
Maximum capacity  
Type  
Rank  
Single  
Dual  
Single processor  
48 GB  
Dual processors  
96 GB  
RDIMM  
RDIMM  
LRDIMM  
UDIMM  
UDIMM  
96 GB  
192 GB  
Quad  
Single  
Dual  
192 GB  
12 GB  
384 GB  
24 GB  
48 GB  
96 GB  
For the latest memory configuration information, see the QuickSpecs on the HP website  
Memory population guidelines  
General DIMM slot population guidelines  
Observe the following guidelines for all AMP modes:  
Install DIMMs only if the corresponding processor is installed.  
Do not mix LRDIMMs, UDIMMs, or RDIMMs.  
White DIMM slots denote the first slot of a channel (1-A, 2-B, 3-C).  
When two processors are installed, balance the DIMMs across the two processors.  
When two processors are installed, install the DIMMs in sequential alphabetical order balanced  
between the two processors: P1-A, P2-A, P1-B, P2-B, P1-C, P2-C, and so forth.  
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For detailed memory configuration rules and guidelines, use the Online DDR3 Memory Configuration Tool  
Advanced ECC population guidelines  
For Advanced ECC mode configurations, observe the following guidelines:  
Observe the general DIMM slot population guidelines.  
DIMMs may be installed individually.  
Population order  
For memory configurations with a single processor or multiple processors, populate the DIMM slots  
sequentially in alphabetical order (A through F).  
For Advanced ECC mode configurations with multiple processors, populate the DIMM slots sequentially in  
alphabetical order (P1-A, P2-A, P1-B, P2-B and so forth)  
After installing the DIMMs, use RBSU ("HP ROM-Based Setup Utility" on page 82) to configure the memory  
protection modes.  
Lockstep Memory mode population guidelines  
For Lockstep memory mode configurations, observe the following guidelines:  
Observe the general DIMM slot population guidelines.  
Always install DIMMs in channel 1 and 2 for each installed processor.  
Do not install DIMMs in channel 3 for any processor.  
DIMM configuration on channel 1 and channel 2 of a processor must be identical.  
In multiprocessor configurations, each processor must have a valid Lockstep memory mode  
configuration.  
In multiprocessor configurations, each processor may have a different valid Lockstep memory mode  
configuration.  
Population order  
For Lockstep memory mode configurations with a single processor or multiple processors, populate the DIMM  
slots in the following order:  
First: A and B  
Last: D and E  
Do not populate the DIMM slots C and F.  
After installing the DIMMs, use RBSU ("HP ROM-Based Setup Utility" on page 82) to configure the memory  
protection modes.  
Online Spare population guidelines  
For Online Spare memory mode configurations, observe the following guidelines:  
Observe the general DIMM slot population guidelines.  
Each channel must have a valid online spare configuration.  
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Each channel can have a different valid online spare configuration.  
Each populated channel must have a spare rank:  
o
o
A single dual-rank DIMM is not a valid configuration.  
LRDIMMs are treated as dual-rank DIMMs.  
Population order  
For Online Spare memory mode configurations with a single processor or multiple processors, populate the  
DIMM slots sequentially in alphabetical order (A through D).  
For Online Spare memory mode configurations with multiple processors, populate the DIMM slots  
sequentially in alphabetical order (P1-A, P2-A, P1-B, P2-B and so forth).  
After installing the DIMMs, use RBSU ("HP ROM-Based Setup Utility" on page 82) to configure the memory  
protection modes.  
Installing a DIMM  
1.  
2.  
Power down the server (on page 16).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Do one of the following:  
3.  
o
o
Extend the server from the rack (on page 16).  
Remove the server from the rack (on page 17).  
4.  
5.  
6.  
Remove the access panel (on page 18).  
Open the DIMM slot latches.  
Install the DIMM.  
7.  
8.  
9.  
Install the access panel (on page 19).  
Install the server into the rack ("Installing the server into the rack" on page 26).  
Power up the server (on page 16).  
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After installing the DIMMs, use RBSU ("HP ROM-Based Setup Utility" on page 82) to configure the memory  
protection mode.  
Processor option  
The server supports single-processor and dual-processor operations.  
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the  
internal system components to cool before touching them.  
CAUTION: To avoid damage to the processor and system board, only authorized personnel  
should attempt to replace or install the processor in this server.  
CAUTION: To prevent possible server malfunction and damage to the equipment, multiprocessor  
configurations must contain processors with the same part number.  
CAUTION: To prevent possible server overheating, always populate processor socket 2 with a  
processor and a heatsink or a processor socket cover and a heatsink blank.  
IMPORTANT: If installing a processor with a faster speed, update the system ROM before  
installing the processor.  
IMPORTANT: Processor socket 1 must be populated at all times or the server does not function.  
In a multiprocessor configuration, to optimize system performance, HP recommends balancing the total  
capacity of the DIMMs across the processors.  
To install the component:  
1.  
2.  
Power down the server (on page 16).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Do one of the following:  
3.  
4.  
o
o
Extend the server from the rack (on page 16).  
Remove the server from the rack (on page 17).  
Remove the access panel (on page 18).  
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5.  
Remove the heatsink blank.  
CAUTION: The pins on the processor socket are very fragile. Any damage to them may require  
replacing the system board.  
6.  
Open each of the processor locking levers in the order indicated, and then open the processor retaining  
bracket.  
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7.  
Remove the clear processor socket cover. Retain the processor socket cover for future use.  
8.  
Install the processor. Verify that the processor is fully seated in the processor retaining bracket by  
visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE  
SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.  
CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To  
avoid damage to the system board, do not touch the processor or the processor socket contacts.  
9.  
Close the processor retaining bracket. When the processor is installed properly inside the processor  
retaining bracket, the processor retaining bracket clears the flange on the front of the socket.  
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CAUTION: Do not press down on the processor. Pressing down on the processor may cause  
damage to the processor socket and the system board. Press only in the area indicated on the  
processor retaining bracket.  
10. Press and hold the processor retaining bracket in place, and then close each processor locking lever.  
Press only in the area indicated on the processor retaining bracket.  
11. Remove the thermal interface protective cover from the heatsink.  
12. Install the heatsink:  
a. Position the heatsink using the guide pin on the processor back plate.  
b. Tighten one pair of diagonally opposite screws halfway, and then tighten the other pair of screws.  
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c. Finish the installation by completely tightening the screws in the same sequence.  
13. Locate the fan bays 1, 2, 3, and 4.  
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14. Remove the fan blanks, if necessary.  
15. Install the additional fans included in the processor option kit.  
NOTE: A dual-processor configuration requires all eight fans. Some single-processor  
configurations might already have five fans populated. Store any unused fans as spares.  
16. Install the access panel (on page 19).  
17. Install the server into the rack ("Installing the server into the rack" on page 26).  
18. Power up the server (on page 16).  
Expansion board options  
The server has both full-height and low-profile expansion slots for controller option installation ("PCIe riser  
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CAUTION: To prevent damage to the server or expansion boards, power down the server, and  
disconnect all power cords before removing or installing the PCI riser cage.  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all expansion slots have either an expansion slot cover or an expansion board installed.  
To install the component:  
1.  
2.  
Power down the server (on page 16).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Do one of the following:  
3.  
o
o
Extend the server from the rack (on page 16).  
Remove the server from the rack (on page 17).  
4.  
5.  
6.  
Remove the access panel (on page 18).  
Remove the PCI riser cage (on page 19).  
Identify the expansion slot compatible with the new option, and then remove the cover opposite that  
slot.  
7.  
Install the expansion board into the riser board slot.  
8.  
9.  
Install the PCI riser cage (on page 20).  
IMPORTANT: The server does not power up if the PCI riser cage is not seated properly.  
Connect all necessary internal and external cabling to the expansion board.  
For more information on these cabling requirement, see the documentation that ships with the option.  
10. Install the access panel (on page 19).  
11. Install the server into the rack ("Installing the server into the rack" on page 26).  
12. Power up the server (on page 16).  
Graphics card power cable option  
Connect the graphics card power cable option to support high-power graphics cards.  
Before installing a high-power graphics card in the server, be sure that the power supplies support the  
installation of the card. Because of the high power requirements for the card, a 750-W or higher power  
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supply might be required. For more information, see the HP Enterprise Configurator website  
(http://h30099.www3.hp.com/configurator/). For more information on estimation of power consumption  
and proper selection of components, see the HP Power Advisor website  
To connect the cable option:  
1.  
2.  
Power down the server (on page 16).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Do one of the following:  
3.  
o
o
Extend the server from the rack (on page 16).  
Remove the server from the rack (on page 17).  
4.  
5.  
6.  
Remove the access panel.  
Remove the PCI riser cage (on page 19).  
Remove the extension bracket from the graphics card.  
7.  
Install the graphics card in the PCI riser cage. For more information, see the documentation that ships  
with the graphics card option.  
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8.  
Install the graphics card retaining bracket.  
9.  
Connect the graphics card power cable to the graphics card.  
10. Install the PCI riser cage (on page 20).  
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11. Connect the other end of the graphics card power cable to the system board.  
12. Install the access panel (on page 19).  
13. Install the server into the rack ("Installing the server into the rack" on page 26).  
14. Power up the server (on page 16).  
HP Trusted Platform Module option  
Use these instructions to install and enable a TPM on a supported server. This procedure includes three  
sections:  
1.  
2.  
3.  
Installing the Trusted Platform Module board.  
Retaining the recovery key/password (on page 66).  
Enabling the Trusted Platform Module (on page 67).  
Enabling the TPM requires accessing RBSU ("HP ROM-Based Setup Utility" on page 82). For more  
information about RBSU, see the HP website (http://www.hp.com/go/ilomgmtengine/docs).  
TPM installation requires the use of drive encryption technology, such as the Microsoft Windows BitLocker  
Drive Encryption feature. For more information on BitLocker, see the Microsoft website  
CAUTION: Always observe the guidelines in this document. Failure to follow these guidelines  
can cause hardware damage or halt data access.  
When installing or replacing a TPM, observe the following guidelines:  
Do not remove an installed TPM. Once installed, the TPM becomes a permanent part of the system  
board.  
When installing or replacing hardware, HP service providers cannot enable the TPM or the encryption  
technology. For security reasons, only the customer can enable these features.  
When returning a system board for service replacement, do not remove the TPM from the system board.  
When requested, HP Service provides a TPM with the spare system board.  
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Any attempt to remove an installed TPM from the system board breaks or disfigures the TPM security  
rivet. Upon locating a broken or disfigured rivet on an installed TPM, administrators should consider the  
system compromised and take appropriate measures to ensure the integrity of the system data.  
When using BitLocker, always retain the recovery key/password. The recovery key/password is  
required to enter Recovery Mode after BitLocker detects a possible compromise of system integrity.  
HP is not liable for blocked data access caused by improper TPM use. For operating instructions, see the  
encryption technology feature documentation provided by the operating system.  
Installing the Trusted Platform Module board  
WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment,  
remove the power cord to remove power from the server. The front panel Power On/Standby  
button does not completely shut off system power. Portions of the power supply and some internal  
circuitry remain active until AC power is removed.  
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the  
internal system components to cool before touching them.  
To install the component:  
1.  
2.  
Power down the server (on page 16).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Do one of the following:  
3.  
o
o
Extend the server from the rack (on page 16).  
Remove the server from the rack (on page 17).  
4.  
5.  
Remove the access panel (on page 18).  
Remove the PCI riser cage (on page 19).  
CAUTION: Any attempt to remove an installed TPM from the system board breaks or disfigures  
the TPM security rivet. Upon locating a broken or disfigured rivet on an installed TPM,  
administrators should consider the system compromised and take appropriate measures to ensure  
the integrity of the system data.  
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6.  
Install the TPM board. Press down on the connector to seat the board ("System board components" on  
page 10).  
7.  
Install the TPM security rivet by pressing the rivet firmly into the system board.  
8.  
9.  
Install the PCI riser cage (on page 20).  
Install the access panel (on page 19).  
10. Install the server into the rack ("Installing the server into the rack" on page 26).  
11. Power up the server (on page 16).  
Retaining the recovery key/password  
The recovery key/password is generated during BitLocker™ setup, and can be saved and printed after  
BitLocker™ is enabled. When using BitLocker™, always retain the recovery key/password. The recovery  
key/password is required to enter Recovery Mode after BitLocker™ detects a possible compromise of system  
integrity.  
To help ensure maximum security, observe the following guidelines when retaining the recovery  
key/password:  
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Always store the recovery key/password in multiple locations.  
Always store copies of the recovery key/password away from the server.  
Do not save the recovery key/password on the encrypted hard drive.  
Enabling the Trusted Platform Module  
1.  
2.  
3.  
4.  
5.  
6.  
7.  
8.  
When prompted during the start-up sequence, access RBSU by pressing the F9 key.  
From the Main Menu, select Server Security.  
From the Server Security Menu, select Trusted Platform Module.  
From the Trusted Platform Module Menu, select TPM Functionality.  
Select Enable, and then press the Enter key to modify the TPM Functionality setting.  
Press the Esc key to exit the current menu, or press the F10 key to exit RBSU.  
Reboot the server.  
Enable the TPM in the OS. For OS-specific instructions, see the OS documentation.  
CAUTION: When a TPM is installed and enabled on the server, data access is locked if you fail  
to follow the proper procedures for updating the system or option firmware, replacing the system  
board, replacing a hard drive, or modifying OS application TPM settings.  
For more information on firmware updates and hardware procedures, see the HP Trusted Platform Module  
Best Practices White Paper on the HP website (http://www.hp.com/support).  
For more information on adjusting TPM usage in BitLocker™, see the Microsoft website  
Redundant hot-plug power supply option  
Power redundancy requires the presence of two power supply modules in the system.  
CAUTION: The default and redundant power supplies in the server must have the same output  
power capacity. Verify that all power supplies have the same part number and label color. The  
system becomes unstable and might shut down when it detects mismatched power supplies.  
IMPORTANT: The DC power supply unit must only be installed by a qualified technician.  
The 14 AWG green or yellow wire must be fastened to the metal enclosure with a screw and  
a spring or star washer.  
When installing the DC power supply unit, the ground wire must be connected before the  
positive or negative leads.  
Label color  
Output  
460 W  
Blue  
750 W  
Orange  
Green  
White  
1200 W  
1200 W -48 Vdc  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all bays are populated with either a component or a blank.  
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To install the component:  
1.  
2.  
Unfasten the cable management solution to access the power supply bays.  
Remove the EMI shield from the power supply bay 2.  
3.  
Remove the protective cover from the connector pins on the power supply.  
WARNING: To reduce the risk of electric shock or damage to the equipment, do not connect the  
power cord to the power supply until the power supply is installed.  
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4.  
Install the redundant power supply into the bay until it clicks.  
5.  
6.  
Connect the power cord to the power supply.  
Use the strain relief clip from the server hardware kit to secure the power cord.  
7.  
8.  
Route the power cord through the cable management solution.  
Connect the power cord to the power source.  
Be sure that the power supply LED is green.  
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Cabling  
Cabling overview  
This section provides guidelines that help you make informed decisions about cabling the server and  
hardware options to optimize performance.  
For information on cabling peripheral components, refer to the white paper on high-density deployment at  
CAUTION: When routing cables, always be sure that the cables are not in a position where they  
can be pinched or crimped.  
Storage cabling  
The FBWC capacitor pack cabling is shown in the following images. The FBWC solution is a separately  
purchased option. This server supports FBWC module installation in the system board or in a storage  
controller.  
Four-bay LFF drive cabling  
Four-bay LFF drive cage connected to the system board  
Item  
Description  
Power cable  
1
2
3
Capacitor pack cable  
560 mm Mini-SAS cable  
Cabling 70  
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Four-bay LFF drive cage connected to the SAS-enabled riser board  
Item  
Description  
Power cable  
1
2
3
Capacitor pack cabling  
560 mm Mini-SAS cable  
Four-bay LFF drive cage connected to a controller in the full-height expansion slot  
Item  
Description  
Power cable  
1
2
3
Capacitor pack cable  
890 mm Mini-SAS cable  
Cabling 71  
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Four-bay LFF drive cage connected to a controller in the low-profile expansion slot  
Item  
Description  
Power cable  
1
2
2
Capacitor pack cable  
890 mm Mini-SAS cable  
Eight-bay SFF drive cabling  
Six-drive SFF SATA configuration  
Item  
Description  
Power cable  
1
2
3
4
Capacitor pack cable  
Two-port SATA cable  
700 mm Mini-SAS cable  
Cabling 72  
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Eight-bay SFF drive cage connected to the SAS-enabled riser board  
Item  
Description  
Power cable  
1
2
3
4
Capacitor pack cable  
560 mm Mini-SAS cable  
700 mm Mini-SAS cable  
Eight-bay SFF drive cage connected to the P822 controller in the full-height expansion slot  
Item  
Description  
Power cable  
1
2
3
4
Capacitor pack cable  
615 mm Mini-SAS cable  
800 mm Mini-SAS cable  
Cabling 73  
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Eight-bay SFF drive cage connected to the P420 controller in the full-height expansion slot  
Item  
Description  
Power cable  
1
2
3
Capacitor pack cable  
560 mm Mini-SAS cable  
700 mm Mini-SAS cable  
4
Eight-bay SFF drive cage connected to the P420 controller in low-profile expansion slot  
Item  
Description  
Power cable  
1
2
3
Capacitor pack cable  
615 mm Mini-SAS cable  
800 mm Mini-SAS cable  
4
Cabling 74  
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Optical drive cabling  
Optical drive cabling in the four-bay LFF drive cage  
Optical drive cabling in the eight-bay SFF drive cage  
Cabling 75  
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GPU power cabling  
Graphics card connection  
System board connection  
Cabling 76  
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Software and configuration utilities  
Server mode  
The software and configuration utilities presented in this section operate in online mode, offline mode, or in  
both modes.  
Software or configuration utility  
Server mode  
Online and Offline  
HP iLO (on page 77)  
Online and Offline  
Online and Offline  
Offline  
Active Health System (on page 78)  
Integrated Management Log (on page 79)  
Intelligent Provisioning (on page 79)  
Online and Offline  
Online  
HP Insight Diagnostics (on page 80)  
HP Insight Remote Support software (on page 81)  
Erase Utility (on page 80)  
Offline  
Online  
Scripting Toolkit (on page 81)  
Online and Offline  
Online and Offline  
Offline  
HP Service Pack for ProLiant (on page 82)  
HP Smart Update Manager (on page 82)  
HP ROM-Based Setup Utility (on page 82)  
Array Configuration Utility (on page 85)  
Option ROM Configuration for Arrays (on page 86)  
ROMPaq utility (on page 86)  
Online and Offline  
Offline  
Offline  
Server QuickSpecs  
For more information about product features, specifications, options, configurations, and compatibility, see  
the QuickSpecs on the HP website (http://www.hp.com/go/productbulletin). At the website, choose the  
geographic region, and then locate the product by name or product category.  
HP iLO Management Engine  
The HP iLO Management Engine is a set of embedded management features supporting the complete  
lifecycle of the server, from initial deployment through ongoing management.  
HP iLO  
The iLO subsystem is a standard component of selected HP ProLiant servers that simplifies initial server setup,  
server health monitoring, power and thermal optimization, and remote server administration. The iLO  
subsystem includes an intelligent microprocessor, secure memory, and a dedicated network interface. This  
design makes iLO independent of the host server and its operating system.  
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iLO enables and manages the Active Health System (on page 78) and also features Agentless Management.  
All key internal subsystems are monitored by iLO. SNMP alerts are sent directly by iLO regardless of the host  
operating system or even if no host operating system is installed.  
HP Insight Remote Support software (on page 81) is also available in HP iLO with no operating system  
software, drivers, or agents.  
Using iLO, you can do the following:  
Access a high-performance and secure Remote Console to the server from anywhere in the world.  
Use the shared iLO Remote Console to collaborate with up to six server administrators.  
Remotely mount high-performance Virtual Media devices to the server.  
Securely and remotely control the power state of the managed server.  
Have true Agentless Management with SNMP alerts from iLO regardless of the state of the host server.  
Access Active Health System troubleshooting features through the iLO interface.  
Subscribe to HP Insight Remote Support software without installing any drivers or agents.  
For more information about iLO features (which may require an iLO Advanced Pack or iLO Advanced for  
BladeSystem license), see the iLO documentation on the Documentation CD or on the HP website  
Active Health System  
HP Active Health System provides the following features:  
Combined diagnostics tools/scanners  
Always on, continuous monitoring for increased stability and shorter downtimes  
Rich configuration history  
Health and service alerts  
Easy export and upload to Service and Support  
The HP Active Health System monitors and records changes in the server hardware and system configuration.  
The Active Health System assists in diagnosing problems and delivering rapid resolution when server failures  
occur.  
The Active Health System collects the following types of data:  
Server model  
Serial number  
Processor model and speed  
Storage capacity and speed  
Memory capacity and speed  
Firmware/BIOS  
HP Active Health System does not collect information about Active Health System users' operations, finances,  
customers, employees, partners, or data center, such as IP addresses, host names, user names, and  
passwords. HP Active Health System does not parse or change operating system data from third-party error  
event log activities, such as content created or passed through by the operating system.  
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The data that is collected is managed according to the HP Data Privacy policy. For more information see the  
The Active Health System log, in conjunction with the system monitoring provided by Agentless Management  
or SNMP Pass-thru, provides continuous monitoring of hardware and configuration changes, system status,  
and service alerts for various server components.  
The Agentless Management Service is available in the SPP, which is a disk image (.iso) that you can  
download from the HP website (http://www.hp.com/go/spp/download). The Active Health System log can  
be downloaded manually from iLO or HP Intelligent Provisioning and sent to HP. For more information, see  
the HP iLO User Guide or HP Intelligent Provisioning User Guide on the HP website  
Integrated Management Log  
The IML records hundreds of events and stores them in an easy-to-view form. The IML timestamps each event  
with 1-minute granularity.  
You can view recorded events in the IML in several ways, including the following:  
From within HP SIM  
From within operating system-specific IML viewers  
o
o
For Windows: IML Viewer  
For Linux: IML Viewer Application  
From within the iLO user interface  
From within HP Insight Diagnostics (on page 80)  
Intelligent Provisioning  
Several packaging changes have taken place with HP ProLiant Gen8 servers: SmartStart CDs and the Smart  
Update Firmware DVD will no longer ship with these new servers. Instead, the deployment capability is  
embedded in the server as part of HP iLO Management Engine’s Intelligent Provisioning.  
Intelligent Provisioning is an essential single-server deployment tool embedded in HP ProLiant Gen8 servers  
that simplifies HP ProLiant server setup, providing a reliable and consistent way to deploy HP ProLiant server  
configurations.  
Intelligent Provisioning assists with the OS installation process by preparing the system for installing  
"off-the-shelf" versions of leading operating system software and automatically integrating optimized  
HP ProLiant server support software from SPP. SPP is the installation package for operating  
system-specific bundles of HP ProLiant optimized drivers, utilities, management agents, and system  
firmware.  
Intelligent Provisioning provides maintenance-related tasks through Perform Maintenance features.  
Intelligent Provisioning provides installation help for Microsoft Windows, Red Hat and SUSE Linux, and  
VMware. For specific OS support, see the HP Intelligent Provisioning Release Notes.  
For more information on Intelligent Provisioning software, see the HP website (http://www.hp.com/go/ilo).  
For more information about Intelligent Provisioning drivers, firmware, and SPP, see the HP website  
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HP Insight Diagnostics  
HP Insight Diagnostics is a proactive server management tool, available in both offline and online versions,  
that provides diagnostics and troubleshooting capabilities to assist IT administrators who verify server  
installations, troubleshoot problems, and perform repair validation.  
HP Insight Diagnostics Offline Edition performs various in-depth system and component testing while the OS  
is not running. To run this utility, boot the server using Intelligent Provisioning (on page 79).  
HP Insight Diagnostics Online Edition is a web-based application that captures system configuration and  
other related data needed for effective server management. Available in Microsoft Windows and Linux  
versions, the utility helps to ensure proper system operation.  
For more information or to download the utility, see the HP website (http://www.hp.com/servers/diags). HP  
Insight Diagnostics Online Edition is also available in the SPP. For more information, see the HP website  
HP Insight Diagnostics survey functionality  
HP Insight Diagnostics (on page 80) provides survey functionality that gathers critical hardware and software  
information on ProLiant servers.  
This functionality supports operating systems that are supported by the server. For operating systems  
supported by the server, see the HP website (http://www.hp.com/go/supportos).  
If a significant change occurs between data-gathering intervals, the survey function marks the previous  
information and overwrites the survey data files to reflect the latest changes in the configuration.  
Survey functionality is installed with every Intelligent Provisioning-assisted HP Insight Diagnostics installation,  
or it can be installed through the SPP ("HP Service Pack for ProLiant" on page 82).  
Erase Utility  
CAUTION: Perform a backup before running the System Erase Utility. The utility sets the system  
to its original factory state, deletes the current hardware configuration information, including  
array setup and disk partitioning, and erases all connected hard drives completely. Refer to the  
instructions for using this utility.  
The Erase utility enables you to erase system CMOS, NVRAM, and hard drives. Run the Erase Utility if you  
must erase the system for the following reasons:  
You want to install a new operating system on a server with an existing operating system.  
You encounter an error when completing the steps of a factory-installed operating system installation.  
To access the Erase Utility, click the Perform Maintenance icon from the Intelligent Provisioning home screen  
and then select Erase.  
Run the Erase utility to:  
Reset all settings — erases all drives, NVRAM, and RBSU  
Reset all disks — erases all drives  
Reset RBSU — erases current RBSU settings  
After selecting the appropriate option, click Erase System. Click Exit to reboot the server after the erase task  
is completed. Click Cancel Erase to exit the utility without erasing.  
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HP Insight Remote Support software  
HP strongly recommends that you install HP Insight Remote Support software to complete the installation or  
upgrade of your product and to enable enhanced delivery of your HP Warranty, HP Care Pack Service, or  
HP contractual support agreement. HP Insight Remote Support supplements your monitoring 24 x 7 to ensure  
maximum system availability by providing intelligent event diagnosis, and automatic, secure submission of  
hardware event notifications to HP, which will initiate a fast and accurate resolution, based on your product’s  
service level. Notifications may be sent to your authorized HP Channel Partner for on-site service, if  
configured and available in your country. The software is available in two variants:  
HP Insight Remote Support Standard: This software supports server and storage devices and is  
optimized for environments with 1–50 servers. Ideal for customers who can benefit from proactive  
notification but do not need proactive service delivery and integration with a management platform.  
HP Insight Remote Support Advanced: For customers with mid-size to large environments with over 500  
devices who require HP Proactive Services, or customers currently using HP Operations Manager or  
SAP Solution Manager to manage their environment, HP recommends installing the latest HP Insight  
Remote Support Advanced software. This software provides comprehensive remote monitoring and  
proactive service support for nearly all HP servers, storage, network, and SAN environments, plus  
selected non-HP servers that have a support obligation with HP. It is integrated with HP Systems Insight  
Manager. A dedicated server is recommended to host both HP Systems Insight Manager and HP Insight  
Remote Support Advanced.  
Details for both versions are available on the HP website (http://www.hp.com/go/insightremotesupport).  
To download the software, go to Software Depot (http://www.software.hp.com).  
Select Insight Remote Support from the menu on the right.  
The HP Insight Remote Support software release notes detail the specific prerequisites, supported hardware,  
and associated operating systems. For more information:  
See the HP Insight Remote Support Standard Release Notes on the HP website  
See the HP Insight Remote Support Advanced Release Notes on the HP website  
Scripting Toolkit  
The Scripting Toolkit is a server deployment product that enables you to build an unattended automated  
installation for high-volume server deployments. The Scripting Toolkit is designed to support ProLiant BL, ML,  
DL, and SL servers. The toolkit includes a modular set of utilities and important documentation that describes  
how to apply these tools to build an automated server deployment process.  
The Scripting Toolkit provides a flexible way to create standard server configuration scripts. These scripts are  
used to automate many of the manual steps in the server configuration process. This automated server  
configuration process cuts time from each deployment, making it possible to scale rapid, high-volume server  
deployments.  
For more information, and to download the Scripting Toolkit, see the HP website  
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HP Service Pack for ProLiant  
SPP is a release set that contains a comprehensive collection of firmware and system software components,  
all tested together as a single solution stack for HP ProLiant servers, their options, BladeSystem enclosures,  
and limited HP external storage.  
SPP has several key features for updating HP ProLiant servers. Using HP SUM as the deployment tool, SPP can  
be used in an online mode on a Windows or Linux hosted operating system, or in an offline mode where the  
server is booted to the ISO so that the server can be updated automatically with no user interaction or  
updated in interactive mode.  
For more information or to download SPP, see the HP website (http://www.hp.com/go/spp).  
HP Smart Update Manager  
The HP SUM provides intelligent and flexible firmware and software deployment. This technology assists in  
reducing the complexity of provisioning and updating HP ProLiant Servers, options, and Blades within the  
data center. HP SUM is used to deploy firmware and software in SPP.  
HP SUM enables system administrators to upgrade ROM images efficiently across a wide range of servers  
and options. This tool has the following features:  
Enables GUI and a command-line, scriptable interface  
Provides scriptable, command-line deployment  
Requires no agent for remote installations  
Enables dependency checking, which ensures appropriate install order and dependency checking  
between components  
Deploys software and firmware on Windows and Linux operating systems  
Performs local or remote (one-to-many) online deployment  
Deploys firmware and software together  
Supports offline and online deployment  
Deploys necessary component updates only  
Downloads the latest components from Web  
Enables direct update of BMC firmware (HP iLO)  
For more information about HP SUM and to access the HP Smart Update Manager User Guide, see the HP  
HP ROM-Based Setup Utility  
RBSU is a configuration utility embedded in ProLiant servers that performs a wide range of configuration  
activities that can include the following:  
Configuring system devices and installed options  
Enabling and disabling system features  
Displaying system information  
Selecting the primary boot controller  
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Configuring memory options  
Language selection  
For more information on RBSU, see the HP ROM-Based Setup Utility User Guide on the Documentation CD or  
Using RBSU  
To use RBSU, use the following keys:  
To access RBSU, press the F9 key during power-up when prompted.  
To navigate the menu system, use the arrow keys.  
To make selections, press the Enter key.  
To access Help for a highlighted configuration option, press the F1 key.  
IMPORTANT: RBSU automatically saves settings when you press the Enter key. The utility does  
not prompt you for confirmation of settings before you exit the utility. To change a selected setting,  
you must select a different setting and press the Enter key.  
Default configuration settings are applied to the server at one of the following times:  
Upon the first system power-up  
After defaults have been restored  
Default configuration settings are sufficient for proper typical server operation, but configuration settings can  
be modified using RBSU. The system will prompt you for access to RBSU with each power-up.  
Auto-configuration process  
The auto-configuration process automatically runs when you boot the server for the first time. During the  
power-up sequence, the system ROM automatically configures the entire system without needing any  
intervention. During this process, the ORCA utility, in most cases, automatically configures the array to a  
default setting based on the number of drives connected to the server.  
NOTE: If the boot drive is not empty or has been written to in the past, ORCA does not  
automatically configure the array. You must run ORCA to configure the array settings.  
NOTE: The server may not support all the following examples.  
Drives installed  
Drives used  
1
RAID level  
RAID 0  
RAID 1  
RAID 5  
None  
1
2
2
3, 4, 5, or 6  
0
3, 4, 5, or 6  
More than 6  
To change any ORCA default settings and override the auto-configuration process, press the F8 key when  
prompted.  
For more information on RBSU, see the HP ROM-Based Setup Utility User Guide on the Documentation CD or  
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Boot options  
Near the end of the boot process, the boot options screen is displayed. This screen is visible for several  
seconds before the system attempts to boot from a supported boot device. During this time, you can do the  
following:  
Access RBSU by pressing the F9 key.  
Access Intelligent Provisioning Maintenance Menu by pressing the F10 key.  
Access the boot menu by pressing the F11 key.  
Force a PXE Network boot by pressing the F12 key.  
Configuring AMP modes  
Not all ProLiant servers support all AMP modes. RBSU provides menu options only for the modes supported  
by the server. Advanced memory protection within RBSU enables the following advanced memory modes:  
Advanced ECC Mode—Provides memory protection beyond Standard ECC. All single-bit failures and  
some multi-bit failures can be corrected without resulting in system downtime.  
Online Spare Mode—Provides protection against failing or degraded DIMMs. Certain memory is set  
aside as spare, and automatic failover to spare memory occurs when the system detects a degraded  
DIMM. DIMMs that are likely to receive a fatal or uncorrectable memory error are removed from  
operation automatically, resulting in less system downtime.  
For DIMM population requirements, see the server-specific user guide.  
Re-entering the server serial number and product ID  
After you replace the system board, you must re-enter the server serial number and the product ID.  
1.  
2.  
3.  
4.  
During the server startup sequence, press the F9 key to access RBSU.  
Select the Advanced Options menu.  
Select Service Options.  
Select Serial Number. The following warning appears:  
Warning: The serial number should ONLY be modified by qualified service  
personnel. This value should always match the serial number located on the  
chassis.  
5.  
6.  
7.  
Press the Enter key to clear the warning.  
Enter the serial number and press the Enter key.  
Select Product ID. The following warning appears:  
Warning: The Product ID should ONLY be modified by qualified service  
personnel. This value should always match the Product ID located on the  
chassis.  
8.  
9.  
Enter the product ID and press the Enter key.  
Press the Esc key to close the menu.  
10. Press the Esc key to exit RBSU.  
11. Press the F10 key to confirm exiting RBSU. The server automatically reboots.  
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Utilities and features  
Array Configuration Utility  
ACU is a utility with the following features:  
Runs as a local application or remote service accessed through the HP System Management Homepage  
Supports online array capacity expansion, logical drive extension, assignment of online spares, and  
RAID or stripe size migration  
Suggests the optimum configuration for an unconfigured system  
For supported controllers, provides access to licensed features, including:  
o
o
o
o
o
o
o
Moving and deleting individual logical volumes  
Advanced Capacity Expansion (SATA to SAS and SAS to SATA)  
Offline Split Mirror  
RAID 6 and RAID 60  
RAID 1 (ADM) and RAID 10 (ADM)  
HP Drive Erase  
Video-On-Demand Advanced Controller Settings  
Provides different operating modes, enabling faster configuration or greater control over the  
configuration options  
Remains available any time that the server is on  
Displays on-screen tips for individual steps of a configuration procedure  
Provides context-sensitive searchable help content  
Provides diagnostic and SmartSSD Wear Gauge functionality on the Diagnostics tab  
ACU is now available as an embedded utility, starting with HP ProLiant Gen8 servers. To access ACU, use  
one of the following methods:  
If an optional controller is not installed, press F10 during boot.  
If an optional controller is installed, when the system recognizes the controller during POST, press F5.  
For optimum performance, the minimum display settings are 1024 × 768 resolution and 16-bit color. Servers  
running Microsoft® operating systems require one of the following supported browsers:  
Internet Explorer 6.0 or later  
Mozilla Firefox 2.0 or later  
For Linux servers, see the README.TXT file for additional browser and support information.  
For more information about the controller and its features, see the HP Smart Array Controllers for HP ProLiant  
Servers User Guide on the HP website (http://www.hp.com/support/SAC_UG_ProLiantServers_en). To  
configure arrays, see the Configuring Arrays on HP Smart Array Controllers Reference Guide on the HP  
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Option ROM Configuration for Arrays  
Before installing an operating system, you can use the ORCA utility to create the first logical drive, assign  
RAID levels, and establish online spare configurations.  
The utility also provides support for the following functions:  
Reconfiguring one or more logical drives  
Viewing the current logical drive configuration  
Deleting a logical drive configuration  
Setting the controller to be the boot controller  
Selecting the boot volume  
If you do not use the utility, ORCA will default to the standard configuration.  
For more information regarding the default configurations that ORCA uses, see the HP ROM-Based Setup  
Utility User Guide on the Documentation CD or the HP website (http://www.hp.com/support/rbsu).  
For more information about the controller and its features, see the HP Smart Array Controllers for HP ProLiant  
Servers User Guide on the HP website (http://www.hp.com/support/SAC_UG_ProLiantServers_en). To  
configure arrays, see the Configuring Arrays on HP Smart Array Controllers Reference Guide on the HP  
ROMPaq utility  
The ROMPaq utility enables you to upgrade the system firmware (BIOS). To upgrade the firmware, insert a  
ROMPaq USB Key into an available USB port and boot the system. In addition to ROMPaq, Online Flash  
Components for Windows and Linux operating systems are available for updating the system firmware.  
The ROMPaq utility checks the system and provides a choice (if more than one exists) of available firmware  
revisions.  
For more information, go to the HP website (http://www.hp.com/go/hpsc) and click on Drivers, Software  
& Firmware. Then, enter your product name in the Find an HP product field and click Go.  
Automatic Server Recovery  
ASR is a feature that causes the system to restart when a catastrophic operating system error occurs, such as  
a blue screen, ABEND (does not apply to HP ProLiant DL980 Servers), or panic. A system fail-safe timer, the  
ASR timer, starts when the System Management driver, also known as the Health Driver, is loaded. When the  
operating system is functioning properly, the system periodically resets the timer. However, when the  
operating system fails, the timer expires and restarts the server.  
ASR increases server availability by restarting the server within a specified time after a system hang. At the  
same time, the HP SIM console notifies you by sending a message to a designated pager number that ASR  
has restarted the system. You can disable ASR from the System Management Homepage or through RBSU.  
USB support  
HP provides both standard USB 2.0 support and legacy USB 2.0 support. Standard support is provided by  
the OS through the appropriate USB device drivers. Before the OS loads, HP provides support for USB  
devices through legacy USB support, which is enabled by default in the system ROM.  
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Legacy USB support provides USB functionality in environments where USB support is not available normally.  
Specifically, HP provides legacy USB functionality for the following:  
POST  
RBSU  
Diagnostics  
DOS  
Operating environments which do not provide native USB support  
Redundant ROM support  
The server enables you to upgrade or configure the ROM safely with redundant ROM support. The server has  
a single ROM that acts as two separate ROM images. In the standard implementation, one side of the ROM  
contains the current ROM program version, while the other side of the ROM contains a backup version.  
NOTE: The server ships with the same version programmed on each side of the ROM.  
Safety and security benefits  
When you flash the system ROM, ROMPaq writes over the backup ROM and saves the current ROM as a  
backup, enabling you to switch easily to the alternate ROM version if the new ROM becomes corrupted for  
any reason. This feature protects the existing ROM version, even if you experience a power failure while  
flashing the ROM.  
Keeping the system current  
Drivers  
IMPORTANT: Always perform a backup before installing or updating device drivers.  
The server includes new hardware that may not have driver support on all OS installation media.  
If you are installing an Intelligent Provisioning-supported OS, use Intelligent Provisioning (on page 79) and its  
Configure and Install feature to install the OS and latest supported drivers.  
If you do not use Intelligent Provisioning to install an OS, drivers for some of the new hardware are required.  
These drivers, as well as other option drivers, ROM images, and value-add software can be downloaded as  
part of an SPP.  
If you are installing drivers from SPP, be sure that you are using the latest SPP version that your server  
supports. To verify that your server is using the latest supported version and for more information about SPP,  
To locate the drivers for a particular server, go to the HP website (http://www.hp.com/go/hpsc) and click  
on Drivers, Software & Firmware. Then, enter your product name in the Find an HP product field and click  
Go.  
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Software and firmware  
Software and firmware should be updated before using the server for the first time, unless any installed  
software or components require an older version. For system software and firmware updates, download the  
Version control  
The VCRM and VCA are web-enabled Insight Management Agents tools that HP SIM uses to schedule  
software update tasks to the entire enterprise.  
VCRM manages the repository for SPP. Administrators can view the SPP contents or configure VCRM to  
automatically update the repository with internet downloads of the latest software and firmware from  
HP.  
VCA compares installed software versions on the node with updates available in the VCRM managed  
repository. Administrators configure VCA to point to a repository managed by VCRM.  
For more information about version control tools, see the HP Systems Insight Manager User Guide, the HP  
Version Control Agent User Guide, and the HP Version Control Repository User Guide on the HP website  
HP Operating Systems and Virtualization Software Support for  
ProLiant Servers  
For information about specific versions of a supported operating system, see the HP website  
Change control and proactive notification  
HP offers Change Control and Proactive Notification to notify customers 30 to 60 days in advance of  
upcoming hardware and software changes on HP commercial products.  
For more information, refer to the HP website (http://www.hp.com/go/pcn).  
Software and configuration utilities 88  
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Troubleshooting  
Troubleshooting resources  
The HP ProLiant Gen8 Troubleshooting Guide, Volume I: Troubleshooting provides procedures for resolving  
common problems and comprehensive courses of action for fault isolation and identification, issue resolution,  
and software maintenance on ProLiant servers and server blades. To view the guide, select a language:  
The HP ProLiant Gen8 Troubleshooting Guide, Volume II: Error Messages provides a list of error messages  
and information to assist with interpreting and resolving error messages on ProLiant servers and server  
blades. To view the guide, select a language:  
Troubleshooting 89  
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System battery replacement  
If the server no longer automatically displays the correct date and time, you might have to replace the battery  
that provides power to the real-time clock. Under normal use, battery life is 5 to 10 years.  
WARNING: The computer contains an internal lithium manganese dioxide, a vanadium  
pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not  
properly handled. To reduce the risk of personal injury:  
Do not attempt to recharge the battery.  
Do not expose the battery to temperatures higher than 60°C (140°F).  
Do not disassemble, crush, puncture, short external contacts, or dispose of in fire or water.  
Replace only with the spare designated for this product.  
To remove the component:  
1.  
2.  
Power down the server (on page 16).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Do one of the following:  
3.  
o
o
Extend the server from the rack (on page 16).  
Remove the server from the rack (on page 17).  
4.  
5.  
6.  
7.  
Remove the access panel (on page 18).  
Remove the PCI riser cage (on page 19).  
Locate the battery on the system board ("System board components" on page 10).  
Remove the battery.  
System battery replacement 90  
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IMPORTANT: Replacing the system board battery resets the system ROM to its default  
configuration. After replacing the battery, reconfigure the system through RBSU.  
To replace the component, reverse the removal procedure.  
For more information about battery replacement or proper disposal, contact an authorized reseller or an  
authorized service provider.  
System battery replacement 91  
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Regulatory compliance notices  
Regulatory compliance identification numbers  
For the purpose of regulatory compliance certifications and identification, this product has been assigned a  
unique regulatory model number. The regulatory model number can be found on the product nameplate  
label, along with all required approval markings and information. When requesting compliance information  
for this product, always refer to this regulatory model number. The regulatory model number is not the  
marketing name or model number of the product.  
Federal Communications Commission notice  
Part 15 of the Federal Communications Commission (FCC) Rules and Regulations has established Radio  
Frequency (RF) emission limits to provide an interference-free radio frequency spectrum. Many electronic  
devices, including computers, generate RF energy incidental to their intended function and are, therefore,  
covered by these rules. These rules place computers and related peripheral devices into two classes, A and  
B, depending upon their intended installation. Class A devices are those that may reasonably be expected  
to be installed in a business or commercial environment. Class B devices are those that may reasonably be  
expected to be installed in a residential environment (for example, personal computers). The FCC requires  
devices in both classes to bear a label indicating the interference potential of the device as well as additional  
operating instructions for the user.  
FCC rating label  
The FCC rating label on the device shows the classification (A or B) of the equipment. Class B devices have  
an FCC logo or ID on the label. Class A devices do not have an FCC logo or ID on the label. After you  
determine the class of the device, refer to the corresponding statement.  
FCC Notice, Class A Equipment  
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to  
Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful  
interference when the equipment is operated in a commercial environment. This equipment generates, uses,  
and can radiate radio frequency energy and, if not installed and used in accordance with the instructions,  
may cause harmful interference to radio communications. Operation of this equipment in a residential area  
is likely to cause harmful interference, in which case the user will be required to correct the interference at  
personal expense.  
FCC Notice, Class B Equipment  
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to  
Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful  
interference in a residential installation. This equipment generates, uses, and can radiate radio frequency  
energy and, if not installed and used in accordance with the instructions, may cause harmful interference to  
Regulatory compliance notices 92  
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radio communications. However, there is no guarantee that interference will not occur in a particular  
installation. If this equipment does cause harmful interference to radio or television reception, which can be  
determined by turning the equipment off and on, the user is encouraged to try to correct the interference by  
one or more of the following measures:  
Reorient or relocate the receiving antenna.  
Increase the separation between the equipment and receiver.  
Connect the equipment into an outlet on a circuit that is different from that to which the receiver is  
connected.  
Consult the dealer or an experienced radio or television technician for help.  
Declaration of conformity for products marked with  
the FCC logo, United States only  
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1)  
this device may not cause harmful interference, and (2) this device must accept any interference received,  
including interference that may cause undesired operation.  
For questions regarding this product, contact us by mail or telephone:  
Hewlett-Packard Company  
P. O. Box 692000, Mail Stop 530113  
Houston, Texas 77269-2000  
1-800-HP-INVENT (1-800-474-6836). (For continuous quality improvement, calls may be recorded or  
monitored.)  
For questions regarding this FCC declaration, contact us by mail or telephone:  
Hewlett-Packard Company  
P. O. Box 692000, Mail Stop 510101  
Houston, Texas 77269-2000  
1-281-514-3333  
To identify this product, refer to the part, series, or model number found on the product.  
Modifications  
The FCC requires the user to be notified that any changes or modifications made to this device that are not  
expressly approved by Hewlett-Packard Company may void the user’s authority to operate the equipment.  
Cables  
Connections to this device must be made with shielded cables with metallic RFI/EMI connector hoods in  
order to maintain compliance with FCC Rules and Regulations.  
Canadian notice (Avis Canadien)  
Class A equipment  
Regulatory compliance notices 93  
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This Class A digital apparatus meets all requirements of the Canadian Interference-Causing Equipment  
Regulations.  
Cet appareil numérique de la classe A respecte toutes les exigences du Règlement sur le matériel brouilleur  
du Canada.  
Class B equipment  
This Class B digital apparatus meets all requirements of the Canadian Interference-Causing Equipment  
Regulations.  
Cet appareil numérique de la classe B respecte toutes les exigences du Règlement sur le matériel brouilleur  
du Canada.  
European Union regulatory notice  
Products bearing the CE marking comply with the following EU Directives:  
Low Voltage Directive 2006/95/EC  
EMC Directive 2004/108/EC  
Ecodesign Directive 2009/125/EC, where applicable  
CE compliance of this product is valid if powered with the correct CE-marked AC adapter provided by HP.  
Compliance with these directives implies conformity to applicable harmonized European standards  
(European Norms) that are listed in the EU Declaration of Conformity issued by HP for this product or product  
family and available (in English only) either within the product documentation or at the following HP website  
(http://www.hp.eu/certificates) (type the product number in the search field).  
The compliance is indicated by one of the following conformity markings placed on the product:  
For non-telecommunications products and for EU harmonized telecommunications products, such as  
Bluetooth® within power class below 10mW.  
For EU non-harmonized telecommunications products (If applicable, a 4-digit notified body number is  
inserted between CE and !).  
Please refer to the regulatory label provided on the product.  
The point of contact for regulatory matters is Hewlett-Packard GmbH, Dept./MS: HQ-TRE, Herrenberger  
Strasse 140, 71034 Boeblingen, GERMANY.  
Disposal of waste equipment by users in private  
households in the European Union  
Regulatory compliance notices 94  
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This symbol on the product or on its packaging indicates that this product must not be disposed of  
with your other household waste. Instead, it is your responsibility to dispose of your waste  
equipment by handing it over to a designated collection point for the recycling of waste electrical  
and electronic equipment. The separate collection and recycling of your waste equipment at the  
time of disposal will help to conserve natural resources and ensure that it is recycled in a manner  
that protects human health and the environment. For more information about where you can drop  
off your waste equipment for recycling, please contact your local city office, your household  
waste disposal service or the shop where you purchased the product.  
Japanese notice  
BSMI notice  
Regulatory compliance notices 95  
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Korean notice  
Class A equipment  
Class B equipment  
Chinese notice  
Class A equipment  
Vietnam compliance marking notice  
This marking is for applicable products only.  
Ukraine notice  
Regulatory compliance notices 96  
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Laser compliance  
This product may be provided with an optical storage device (that is, CD or DVD drive) and/or fiber optic  
transceiver. Each of these devices contains a laser that is classified as a Class 1 Laser Product in accordance  
with US FDA regulations and the IEC 60825-1. The product does not emit hazardous laser radiation.  
Each laser product complies with 21 CFR 1040.10 and 1040.11 except for deviations pursuant to Laser  
Notice No. 50, dated June 24, 2007; and with IEC 60825-1:2007.  
WARNING: Use of controls or adjustments or performance of procedures other than those  
specified herein or in the laser product's installation guide may result in hazardous radiation  
exposure. To reduce the risk of exposure to hazardous radiation:  
Do not try to open the module enclosure. There are no user-serviceable components inside.  
Do not operate controls, make adjustments, or perform procedures to the laser device other  
than those specified herein.  
Allow only HP Authorized Service technicians to repair the unit.  
The Center for Devices and Radiological Health (CDRH) of the U.S. Food and Drug Administration  
implemented regulations for laser products on August 2, 1976. These regulations apply to laser products  
manufactured from August 1, 1976. Compliance is mandatory for products marketed in the United States.  
Battery replacement notice  
WARNING: The computer contains an internal lithium manganese dioxide, a vanadium  
pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not  
properly handled. To reduce the risk of personal injury:  
Do not attempt to recharge the battery.  
Do not expose the battery to temperatures higher than 60°C (140°F).  
Do not disassemble, crush, puncture, short external contacts, or dispose of in fire or water.  
Batteries, battery packs, and accumulators should not be disposed of together with the general  
household waste. To forward them to recycling or proper disposal, use the public collection system or  
return them to HP, an authorized HP Partner, or their agents.  
For more information about battery replacement or proper disposal, contact an authorized reseller or an  
authorized service provider.  
Taiwan battery recycling notice  
The Taiwan EPA requires dry battery manufacturing or importing firms in accordance with Article 15 of the  
Waste Disposal Act to indicate the recovery marks on the batteries used in sales, giveaway or promotion.  
Contact a qualified Taiwanese recycler for proper battery disposal.  
Regulatory compliance notices 97  
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Power cord statement for Japan  
Acoustics statement for Germany (Geräuschemission)  
Schalldruckpegel LpA < 70 dB(A)  
Zuschauerpositionen (bystander positions), Normaler Betrieb (normal operation)  
Nach ISO 7779:1999 (Typprüfung)  
Regulatory compliance notices 98  
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Electrostatic discharge  
Preventing electrostatic discharge  
To prevent damaging the system, be aware of the precautions you need to follow when setting up the system  
or handling parts. A discharge of static electricity from a finger or other conductor may damage system  
boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the device.  
To prevent electrostatic damage:  
Avoid hand contact by transporting and storing products in static-safe containers.  
Keep electrostatic-sensitive parts in their containers until they arrive at static-free workstations.  
Place parts on a grounded surface before removing them from their containers.  
Avoid touching pins, leads, or circuitry.  
Always be properly grounded when touching a static-sensitive component or assembly.  
Grounding methods to prevent electrostatic discharge  
Several methods are used for grounding. Use one or more of the following methods when handling or  
installing electrostatic-sensitive parts:  
Use a wrist strap connected by a ground cord to a grounded workstation or computer chassis. Wrist  
straps are flexible straps with a minimum of 1 megohm ±10 percent resistance in the ground cords. To  
provide proper ground, wear the strap snug against the skin.  
Use heel straps, toe straps, or boot straps at standing workstations. Wear the straps on both feet when  
standing on conductive floors or dissipating floor mats.  
Use conductive field service tools.  
Use a portable field service kit with a folding static-dissipating work mat.  
If you do not have any of the suggested equipment for proper grounding, have an authorized reseller install  
the part.  
For more information on static electricity or assistance with product installation, contact an authorized  
reseller.  
Electrostatic discharge 99  
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Specifications  
Environmental specifications  
Specification  
Value  
Temperature range*  
Operating  
10°C to 35°C (50°F to 95°F)  
-30°C to 60°C (-22°F to 140°F)  
Nonoperating  
Relative humidity  
(noncondensing)  
10% to 90%  
5% to 95%  
Operating, maximum wet bulb  
temperature of 28°C (82.4°F)  
Nonoperating, maximum wet  
bulb temperature of 38.7°C  
(101.7°F)  
* All temperature ratings shown are for sea level. An altitude derating of 1°C per 304.8 m (1.8°F per 1,000 ft) to 3048  
m (10,000 ft) is applicable. No direct sunlight allowed.  
Mechanical specifications  
Specification  
Value  
4.32 cm (1.70 in)  
Height  
75.00 cm (29.50 in)  
Depth for models with LFF drive cage  
Depth for models with SFF drive cage  
Width  
69.90 cm (27.50 in)  
43.46 cm (17.11 in)  
13.00 kg to 18.00 kg (28.60 lb to 39.60 lb)  
Weight (approximate range)  
Power supply specifications  
Depending on the installed options, the server is configured with one of the following power supplies:  
HP 460 W CS power supply (92% efficiency)  
HP 460 W CS HE power supply (94% efficiency)  
HP 750 W CS power supply (92% efficiency)  
HP 750 W CS HE power supply (94% efficiency)  
HP 750 W DC CS HE power supply (94% efficiency)  
HP 1200 W CS HE power supply (94% efficiency)  
CAUTION: Check the system and power supply input ratings before powering up the server.  
Specifications 100  
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HP 460 W CS power supply (92% efficiency)  
Specification  
Value  
Input requirements  
Rated input voltage  
Rated input frequency  
Rated input current  
Rated input power  
100 V AC–240 V AC  
50 Hz or 60 Hz  
6 A–3 A  
526 W at 100 V AC input  
505 W at 200 V AC input  
1794 at 100 V AC input  
1725 at 200 V AC input  
Btus per hour  
Power supply output  
460 W at 100 V to 120 V AC  
input  
Rated steady-state power  
460 W at 200 V to 240 V AC  
input  
460 W at 100 V to 120 V AC  
input  
Maximum peak power  
460 W at 200 V to 240 V AC  
input  
HP 460 W CS HE power supply (94% efficiency)  
Specification  
Value  
Input requirements  
100 V AC–240 V AC  
50 Hz or 60 Hz  
6 A–3 A  
Rated input voltage  
Rated input frequency  
Rated input current  
Rated input power  
509 W at 115 V AC input  
495 W at 230 V AC input  
1764 at 100 V AC input  
1736 at 115 V AC input  
1694 at 200 V AC input  
1687 at 230 V AC input  
Btus per hour  
Power supply output  
460 W at 100 V to 120 V AC input  
460 W at 200 V to 240 V AC input  
Rated steady-state power  
460 W at 100 V to 120 V AC input  
460 W at 200 V to 240 V AC input  
Maximum peak power  
HP 750 W CS power supply (92% efficiency)  
Specification  
Value  
Input requirements  
Rated input voltage  
Rated input frequency  
100 V AC–240 V AC  
50 Hz–60 Hz  
Specifications 101  
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9 A–4.5 A  
Rated input current  
Rated input power  
857 W at 100 V AC input  
824 W at 200 V AC input  
2925 at 100 V AC input  
2812 at 200 V AC input  
Btus per hour  
Power supply output  
750 W at 100 V to 120 V AC  
input  
Rated steady-state power  
750 W at 200 V to 240 V AC  
input  
750 W at 100 V to 120 V AC  
input  
Maximum peak power  
750 W at 200 V to 240 V AC  
input  
HP 750 W CS HE power supply (94% efficiency)  
Specification  
Value  
Input requirements  
100 V AC–240 V AC  
50 Hz–60 Hz  
Rated input voltage  
Rated input frequency  
Rated input current  
9 A–4.5 A  
831 W at 115 V AC input  
808 W at 230 V AC input  
Maximum rated input power  
2878 at 100 V AC input  
2834 at 115 V AC input  
2769 at 200 V AC input  
2758 at 230 V AC input  
Btus per hour  
Power supply output  
750 W at 100 V to 120 V AC input  
750 W at 200 V to 240 V AC input  
Rated steady-state power  
750 W at 100 V to 120 V AC input  
750 W at 200 V to 240 V AC input  
Maximum peak power  
HP 750 W DC CS HE power supply (94% efficiency)  
Specification  
Value  
Input requirements  
-36 V DC to -72 V DC  
-48 V DC nominal input  
Rated input voltage  
Rated input current  
23 A at -36 V DC input  
17 A at -48 V DC input, nominal  
input  
11 A at -72 V DC input  
815 W at -36 V DC input  
805 W at -48 V DC input, nominal  
input  
Rated input power (W)  
795 W at -72 V DC input  
Specifications 102  
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2780 at -36 V DC input  
2740 at -48 V DC input, nominal  
input  
Rated input power (Btus per  
hour)  
2720 at -72 V DC input  
Power supply output  
750 W  
750 W  
Rated steady-state power (W)  
Maximum peak power (W)  
CAUTION: This equipment is designed to permit the connection of the earthed conductor of the  
DC supply circuit to the earthing conductor at the equipment.  
If this connection is made, all of the following must be met:  
This equipment must be connected directly to the DC supply system earthing electrode  
conductor or to a bonding jumper from an earthing terminal bar or bus to which the DC supply  
system earthing electrode conductor is connected.  
This equipment must be located in the same immediate area (such as adjacent cabinets) as any  
other equipment that has a connection between the earthed conductor of the same DC supply  
circuit and the earthing conductor, and also the point of earthing of the DC system. The DC  
system must be earthed elsewhere.  
The DC supply source is to be located within the same premises as the equipment.  
Switching or disconnecting devices must not be in the earthed circuit conductor between the  
DC source and the point of connection of the earthing electrode conductor.  
CAUTION: To reduce the risk of electric shock or energy hazards:  
This equipment must be installed by trained service personnel, as defined by the NEC and IEC  
60950-1, Second Edition, the standard for Safety of Information Technology Equipment.  
Connect the equipment to a reliably grounded SELV source. An SELV source is a secondary  
circuit that is designed so normal and single fault conditions do not cause the voltages to  
exceed a safe level (60 V DC).  
The branch circuit overcurrent protection must be rated 24 A.  
HP 1200 W CS HE power supply (94% efficiency)  
Specification  
Value  
Input requirements  
100 V AC  
Rated input voltage  
110 V AC–120 V AC  
200 V AC–240 V AC  
50 Hz–60 Hz  
Rated input frequency  
Rated input current  
9.1 A at 100 V AC  
8.6 A at 110 V AC  
6.7 A at 200 V AC  
897 W at 100 V AC input  
1321 W at 200 V AC input  
Maximum rated input power  
Btus per hour  
3061 at 100 V AC input  
4506 at 200 V AC input  
Power supply output  
800 W at 100 V AC input  
900 W at 120 V AC input  
1200 W at 200 V to 240 V AC  
Rated steady-state power  
Specifications 103  
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input  
800 W at 100 V AC input  
900 W at 120 V AC input  
1200 W at 200 V to 240 V AC  
input  
Maximum peak power  
Hot-plug power supply calculations  
For hot-plug power supply specifications and calculators to determine electrical and heat loading for the  
server, refer to the HP Enterprise Configurator website (http://h30099.www3.hp.com/configurator/).  
Specifications 104  
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Support and other resources  
Before you contact HP  
Be sure to have the following information available before you call HP:  
Active Health System log  
Download and have available an Active Health System log for 3 days before the failure was detected.  
For more information, see the HP iLO 4 User Guide or HP Intelligent Provisioning User Guide on the HP  
Onboard Administrator SHOW ALL report (for HP BladeSystem products only)  
For more information on obtaining the Onboard Administrator SHOW ALL report, see the HP website  
Technical support registration number (if applicable)  
Product serial number  
Product model name and number  
Product identification number  
Applicable error messages  
Add-on boards or hardware  
Third-party hardware or software  
Operating system type and revision level  
HP contact information  
For United States and worldwide contact information, see the Contact HP website  
In the United States:  
To contact HP by phone, call 1-800-334-5144. For continuous quality improvement, calls may be  
recorded or monitored.  
If you have purchased a Care Pack (service upgrade), see the Support & Drivers website  
(http://www8.hp.com/us/en/support-drivers.html). If the problem cannot be resolved at the website,  
call 1-800-633-3600. For more information about Care Packs, see the HP website  
Customer Self Repair  
HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for  
greater flexibility in performing defective parts replacement. If during the diagnosis period HP (or HP service  
Support and other resources 105  
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providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will  
ship that part directly to you for replacement. There are two categories of CSR parts:  
Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts,  
you will be charged for the travel and labor costs of this service.  
Optional—Parts for which customer self repair is optional. These parts are also designed for customer  
self repair. If, however, you require that HP replace them for you, there may or may not be additional  
charges, depending on the type of warranty service designated for your product.  
NOTE: Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty,  
HP requires that an authorized service provider replace the part. These parts are identified as "No" in the  
Illustrated Parts Catalog.  
Based on availability and where geography permits, CSR parts will be shipped for next business day  
delivery. Same day or four-hour delivery may be offered at an additional charge where geography permits.  
If assistance is required, you can call the HP Technical Support Center and a technician will help you over the  
telephone. HP specifies in the materials shipped with a replacement CSR part whether a defective part must  
be returned to HP. In cases where it is required to return the defective part to HP, you must ship the defective  
part back to HP within a defined period of time, normally five (5) business days. The defective part must be  
returned with the associated documentation in the provided shipping material. Failure to return the defective  
part may result in HP billing you for the replacement. With a customer self repair, HP will pay all shipping  
and part return costs and determine the courier/carrier to be used.  
For more information about HP's Customer Self Repair program, contact your local service provider. For the  
North American program, refer to the HP website (http://www.hp.com/go/selfrepair).  
Réparation par le client (CSR)  
Les produits HP comportent de nombreuses pièces CSR (Customer Self Repair = réparation par le client) afin  
de minimiser les délais de réparation et faciliter le remplacement des pièces défectueuses. Si pendant la  
période de diagnostic, HP (ou ses partenaires ou mainteneurs agréés) détermine que la réparation peut être  
effectuée à l'aide d'une pièce CSR, HP vous l'envoie directement. Il existe deux catégories de pièces CSR:  
Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de  
remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.  
Facultatif - Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également  
conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de  
remplacer ces pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à  
votre produit.  
REMARQUE: Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la  
réparation. Pour que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit effectué  
par un Mainteneur Agréé. Ces pièces sont identifiées par la mention "Non" dans le Catalogue illustré.  
Les pièces CSR sont livrées le jour ouvré suivant, dans la limite des stocks disponibles et selon votre situation  
géographique. Si votre situation géographique le permet et que vous demandez une livraison le jour même  
ou dans les 4 heures, celle-ci vous sera facturée. Pour bénéficier d'une assistance téléphonique, appelez le  
Centre d'assistance technique HP. Dans les documents envoyés avec la pièce de rechange CSR, HP précise  
s'il est nécessaire de lui retourner la pièce défectueuse. Si c'est le cas, vous devez le faire dans le délai  
indiqué, généralement cinq (5) jours ouvrés. La pièce et sa documentation doivent être retournées dans  
l'emballage fourni. Si vous ne retournez pas la pièce défectueuse, HP se réserve le droit de vous facturer les  
coûts de remplacement. Dans le cas d'une pièce CSR, HP supporte l'ensemble des frais d'expédition et de  
retour, et détermine la société de courses ou le transporteur à utiliser.  
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Pour plus d'informations sur le programme CSR de HP, contactez votre Mainteneur Agrée local. Pour plus  
d'informations sur ce programme en Amérique du Nord, consultez le site Web HP  
Riparazione da parte del cliente  
Per abbreviare i tempi di riparazione e garantire una maggiore flessibilità nella sostituzione di parti  
difettose, i prodotti HP sono realizzati con numerosi componenti che possono essere riparati direttamente  
dal cliente (CSR, Customer Self Repair). Se in fase di diagnostica HP (o un centro di servizi o di assistenza  
HP) identifica il guasto come riparabile mediante un ricambio CSR, HP lo spedirà direttamente al cliente per  
la sostituzione. Vi sono due categorie di parti CSR:  
Obbligatorie – Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la  
riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio.  
Opzionali – Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti  
progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere  
spese addizionali a seconda del tipo di garanzia previsto per il prodotto.  
NOTA: alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la  
garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono  
identificate da un "No" nel Catalogo illustrato dei componenti.  
In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il  
giorno lavorativo seguente. La consegna nel giorno stesso o entro quattro ore è offerta con un supplemento  
di costo solo in alcune zone. In caso di necessità si può richiedere l'assistenza telefonica di un addetto del  
centro di supporto tecnico HP. Nel materiale fornito con una parte di ricambio CSR, HP specifica se il cliente  
deve restituire dei componenti. Qualora sia richiesta la resa ad HP del componente difettoso, lo si deve  
spedire ad HP entro un determinato periodo di tempo, generalmente cinque (5) giorni lavorativi. Il  
componente difettoso deve essere restituito con la documentazione associata nell'imballo di spedizione  
fornito. La mancata restituzione del componente può comportare la fatturazione del ricambio da parte di HP.  
Nel caso di riparazione da parte del cliente, HP sostiene tutte le spese di spedizione e resa e sceglie il  
corriere/vettore da utilizzare.  
Per ulteriori informazioni sul programma CSR di HP contattare il centro di assistenza di zona. Per il  
programma in Nord America fare riferimento al sito Web HP (http://www.hp.com/go/selfrepair).  
Customer Self Repair  
HP Produkte enthalten viele CSR-Teile (Customer Self Repair), um Reparaturzeiten zu minimieren und höhere  
Flexibilität beim Austausch defekter Bauteile zu ermöglichen. Wenn HP (oder ein HP Servicepartner) bei der  
Diagnose feststellt, dass das Produkt mithilfe eines CSR-Teils repariert werden kann, sendet Ihnen HP dieses  
Bauteil zum Austausch direkt zu. CSR-Teile werden in zwei Kategorien unterteilt:  
Zwingend – Teile, für die das Customer Self Repair-Verfahren zwingend vorgegeben ist. Wenn Sie den  
Austausch dieser Teile von HP vornehmen lassen, werden Ihnen die Anfahrt- und Arbeitskosten für diesen  
Service berechnet.  
Optional – Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für Customer  
Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten,  
können bei diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche  
Kosten anfallen.  
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HINWEIS: Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des  
Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog  
sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet.  
CSR-Teile werden abhängig von der Verfügbarkeit und vom Lieferziel am folgenden Geschäftstag geliefert.  
Für bestimmte Standorte ist eine Lieferung am selben Tag oder innerhalb von vier Stunden gegen einen  
Aufpreis verfügbar. Wenn Sie Hilfe benötigen, können Sie das HP technische Support Center anrufen und  
sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien, die mit einem CSR-Ersatzteil geliefert  
werden, können Sie entnehmen, ob das defekte Teil an HP zurückgeschickt werden muss. Wenn es  
erforderlich ist, das defekte Teil an HP zurückzuschicken, müssen Sie dies innerhalb eines vorgegebenen  
Zeitraums tun, in der Regel innerhalb von fünf (5) Geschäftstagen. Das defekte Teil muss mit der zugehörigen  
Dokumentation in der Verpackung zurückgeschickt werden, die im Lieferumfang enthalten ist. Wenn Sie das  
defekte Teil nicht zurückschicken, kann HP Ihnen das Ersatzteil in Rechnung stellen. Im Falle von Customer  
Self Repair kommt HP für alle Kosten für die Lieferung und Rücksendung auf und bestimmt den  
Kurier-/Frachtdienst.  
Weitere Informationen über das HP Customer Self Repair Programm erhalten Sie von Ihrem Servicepartner  
vor Ort. Informationen über das CSR-Programm in Nordamerika finden Sie auf der HP Website unter  
Reparaciones del propio cliente  
Los productos de HP incluyen muchos componentes que el propio usuario puede reemplazar (Customer Self  
Repair, CSR) para minimizar el tiempo de reparación y ofrecer una mayor flexibilidad a la hora de realizar  
sustituciones de componentes defectuosos. Si, durante la fase de diagnóstico, HP (o los proveedores o socios  
de servicio de HP) identifica que una reparación puede llevarse a cabo mediante el uso de un componente  
CSR, HP le enviará dicho componente directamente para que realice su sustitución. Los componentes CSR se  
clasifican en dos categorías:  
Obligatorio: componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a  
HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de  
desplazamiento y de mano de obra de dicho servicio.  
Opcional: componentes para los que la reparación por parte del usuario es opcional. Estos  
componentes también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si  
precisa que HP realice su sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de  
servicio de garantía correspondiente al producto.  
NOTA: Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que  
el usuario haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado  
realice la sustitución de estos componentes. Dichos componentes se identifican con la palabra "No" en el  
catálogo ilustrado de componentes.  
Según la disponibilidad y la situación geográfica, los componentes CSR se enviarán para que lleguen a su  
destino al siguiente día laborable. Si la situación geográfica lo permite, se puede solicitar la entrega en el  
mismo día o en cuatro horas con un coste adicional. Si precisa asistencia técnica, puede llamar al Centro de  
asistencia técnica de HP y recibirá ayuda telefónica por parte de un técnico. Con el envío de materiales  
para la sustitución de componentes CSR, HP especificará si los componentes defectuosos deberán  
devolverse a HP. En aquellos casos en los que sea necesario devolver algún componente a HP, deberá  
hacerlo en el periodo de tiempo especificado, normalmente cinco días laborables. Los componentes  
defectuosos deberán devolverse con toda la documentación relacionada y con el embalaje de envío. Si no  
enviara el componente defectuoso requerido, HP podrá cobrarle por el de sustitución. En el caso de todas  
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sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de  
componentes y escogerá la empresa de transporte que se utilice para dicho servicio.  
Para obtener más información acerca del programa de Reparaciones del propio cliente de HP, póngase en  
contacto con su proveedor de servicios local. Si está interesado en el programa para Norteamérica, visite  
la página web de HP siguiente (http://www.hp.com/go/selfrepair).  
Customer Self Repair  
Veel onderdelen in HP producten zijn door de klant zelf te repareren, waardoor de reparatieduur tot een  
minimum beperkt kan blijven en de flexibiliteit in het vervangen van defecte onderdelen groter is. Deze  
onderdelen worden CSR-onderdelen (Customer Self Repair) genoemd. Als HP (of een HP Service Partner) bij  
de diagnose vaststelt dat de reparatie kan worden uitgevoerd met een CSR-onderdeel, verzendt HP dat  
onderdeel rechtstreeks naar u, zodat u het defecte onderdeel daarmee kunt vervangen. Er zijn twee  
categorieën CSR-onderdelen:  
Verplicht: Onderdelen waarvoor reparatie door de klant verplicht is. Als u HP verzoekt deze onderdelen  
voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon in rekening gebracht.  
Optioneel: Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn ontworpen  
voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen  
daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het  
product.  
OPMERKING: Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met  
de garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen.  
Deze onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".  
Afhankelijk van de leverbaarheid en de locatie worden CSR-onderdelen verzonden voor levering op de  
eerstvolgende werkdag. Levering op dezelfde dag of binnen vier uur kan tegen meerkosten worden  
aangeboden, indien dit mogelijk is gezien de locatie. Indien assistentie gewenst is, belt u een HP Service  
Partner om via de telefoon technische ondersteuning te ontvangen. HP vermeldt in de documentatie bij het  
vervangende CSR-onderdeel of het defecte onderdeel aan HP moet worden geretourneerd. Als het defecte  
onderdeel aan HP moet worden teruggezonden, moet u het defecte onderdeel binnen een bepaalde  
periode, gewoonlijk vijf (5) werkdagen, retourneren aan HP. Het defecte onderdeel moet met de  
bijbehorende documentatie worden geretourneerd in het meegeleverde verpakkingsmateriaal. Als u het  
defecte onderdeel niet terugzendt, kan HP u voor het vervangende onderdeel kosten in rekening brengen. Bij  
reparatie door de klant betaalt HP alle verzendkosten voor het vervangende en geretourneerde onderdeel en  
kiest HP zelf welke koerier/transportonderneming hiervoor wordt gebruikt.  
Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programma  
van HP. Informatie over Service Partners vindt u op de HP website (http://www.hp.com/go/selfrepair).  
Reparo feito pelo cliente  
Os produtos da HP são projetados com muitas peças para reparo feito pelo cliente (CSR) de modo a  
minimizar o tempo de reparo e permitir maior flexibilidade na substituição de peças com defeito. Se,  
durante o período de diagnóstico, a HP (ou fornecedores/parceiros de serviço da HP) concluir que o reparo  
pode ser efetuado pelo uso de uma peça CSR, a peça de reposição será enviada diretamente ao cliente.  
Existem duas categorias de peças CSR:  
Obrigatória – Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças,  
serão cobradas as despesas de transporte e mão-de-obra do serviço.  
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Opcional – Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o  
reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de  
taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.  
OBSERVAÇÃO: Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de  
cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão  
identificadas com a marca "No" (Não), no catálogo de peças ilustrado.  
Conforme a disponibilidade e o local geográfico, as peças CSR serão enviadas no primeiro dia útil após o  
pedido. Onde as condições geográficas permitirem, a entrega no mesmo dia ou em quatro horas pode ser  
feita mediante uma taxa adicional. Se precisar de auxílio, entre em contato com o Centro de suporte técnico  
da HP para que um técnico o ajude por telefone. A HP especifica nos materiais fornecidos com a peça CSR  
de reposição se a peça com defeito deve ser devolvida à HP. Nos casos em que isso for necessário, é  
preciso enviar a peça com defeito à HP dentro do período determinado, normalmente cinco (5) dias úteis.  
A peça com defeito deve ser enviada com a documentação correspondente no material de transporte  
fornecido. Caso não o faça, a HP poderá cobrar a reposição. Para as peças de reparo feito pelo cliente, a  
HP paga todas as despesas de transporte e de devolução da peça e determina a transportadora/serviço  
postal a ser utilizado.  
Para obter mais informações sobre o programa de reparo feito pelo cliente da HP, entre em contato com o  
fornecedor de serviços local. Para o programa norte-americano, visite o site da HP  
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Acronyms and abbreviations  
ABEND  
abnormal end  
ACU  
Array Configuration Utility  
AMP  
Advanced Memory Protection  
ASR  
Automatic Server Recovery  
BMC  
baseboard management controller  
BSMI  
Bureau of Standards, Metrology and Inspection  
CE  
Conformité Européenne (European Conformity)  
CS HE  
HP Common Slot High-Efficiency (power supply)  
CSA  
Canadian Standards Association  
CSR  
Customer Self Repair  
DDDC  
Double Device Data Correction  
DDR  
double data rate  
Acronyms and abbreviations 113  
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DPC  
DIMMs per channel  
EMI  
electromagnetic interference  
FBWC  
flash-backed write cache  
FCC  
Federal Communications Commission  
GPU  
graphics processing unit  
HP SIM  
HP Systems Insight Manager  
HP SUM  
HP Smart Update Manager  
IEC  
International Electrotechnical Commission  
iLO  
Integrated Lights-Out  
IML  
Integrated Management Log  
ISO  
International Organization for Standardization  
LFF  
large form factor  
LRDIMM  
load reduced dual in-line memory module  
LV  
low voltage (DIMM voltage)  
Acronyms and abbreviations 114  
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NMI  
nonmaskable interrupt  
NVRAM  
nonvolatile memory  
ORCA  
Option ROM Configuration for Arrays  
PCIe  
peripheral component interconnect express  
PDU  
power distribution unit  
POST  
Power-On Self Test  
PXE  
preboot execution environment  
RBSU  
ROM-Based Setup Utility  
RDIMM  
registered dual in-line memory module  
RDP  
Rapid Deployment Pack  
RF  
radio frequency  
RFI  
radio frequency interference  
SAS  
serial attached SCSI  
SATA  
serial ATA  
Acronyms and abbreviations 115  
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SD  
Secure Digital  
SDDC  
Single Device Data Correction  
SELV  
separated extra low voltage  
SFF  
small form factor  
SPP  
HP Service Pack for ProLiant  
STD  
standard (DIMM voltage)  
TMRA  
recommended ambient operating temperature  
TPM  
Trusted Platform Module  
UDIMM  
unregistered dual in-line memory module  
UID  
unit identification  
USB  
universal serial bus  
VCA  
Version Control Agent  
VCRM  
Version Control Repository Manager  
Acronyms and abbreviations 116  
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Documentation feedback  
HP is committed to providing documentation that meets your needs. To help us improve the documentation,  
send any errors, suggestions, or comments to Documentation Feedback (mailto:[email protected]).  
Include the document title and part number, version number, or the URL when submitting your feedback.  
Documentation feedback 117  
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Index  
Declaration of Conformity 93  
diagnosing problems 89  
diagnostic tools 77, 80, 86  
diagnostics utility 80  
DIMM slot locations 11  
DIMM slots 11  
A
AC power supply 101, 102, 103  
access panel 18, 19  
acoustics statement for Germany 98  
ACU (Array Configuration Utility) 77, 85  
Advanced ECC memory 53, 84  
airflow requirements 21, 22  
AMP (Advanced Memory Protection) 84  
AMP modes 84  
Array Configuration Utility (ACU) 85  
ASR (Automatic Server Recovery) 86  
authorized reseller 105  
DIMMs 50  
DIMMs, installation 54  
DIMMs, single- and dual-rank 50  
disposal, waste 94  
downloading files 105  
drive cabling 32, 70, 72, 75  
drive numbering 12  
drivers 87  
auto-configuration process 83  
Automatic Server Recovery (ASR) 86  
drives 13, 30  
E
B
electrical grounding requirements 23  
electrostatic discharge 99  
environmental requirements 21, 23  
Erase Utility 77, 80  
Basic Input/Output System (BIOS) 77, 86  
battery 90, 97  
BIOS (Basic Input/Output System) 77, 86  
BIOS upgrade 77, 86  
boot options 28, 84  
error messages 89  
European Union notice 94  
European Union regulatory notice 94  
expansion boards 60  
buttons 7  
C
extending server from rack 16  
cabling 70  
F
cache module installation 38  
Canadian notice 93  
Care Pack 21  
Change Control 88  
Chinese notice 96  
compliance 92  
fan module locations 15  
fan rules 44  
FBWC cabling 70  
FBWC module 38  
FBWC module LEDs 13  
FCC (Federal Communications Commission)  
notice 92, 93  
FCC rating label 92  
features 7, 85  
Federal Communications Commission (FCC)  
notice 92, 93  
firmware upgrade utility, troubleshooting 89  
front panel buttons 8  
front panel components 7  
front panel LEDs 8  
components 7  
configuration of system 28, 77  
configuring AMP modes 84  
connectors 7  
contacting HP 105  
controller 37  
D
DC power supply 23  
Index 118  
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front video adapter 29  
L
laser devices 97  
G
graphics card cabling 61  
grounding methods 99  
grounding requirements 23  
LEDs, hard drive 13  
LEDs, troubleshooting 89  
LFF drive cage 70  
lockstep memory 52, 53  
H
M
hard drive LEDs 13  
hard drives, determining status of 13  
hard drives, installing 29, 30  
hardware options 26, 29  
hardware options installation 29  
health driver 86  
help resources 105  
hot-plug drive, installing 31  
hot-plug fans 44, 45, 46  
maintenance guidelines 87  
memory 48  
memory module population guidelines 52  
memory options 29, 48  
Memory Protection option 51  
memory subsystem architecture 51  
memory, Advanced ECC 51, 84  
memory, lockstep 52  
hot-plug power supply calculations 104  
HP contact information 105  
HP Enterprise Configurator 104  
HP Insight Diagnostics 80  
HP Insight Diagnostics survey functionality 80  
HP Insight Remote Support software 81  
HP Smart memory 49  
memory, online spare 52, 84  
multi-processor Advanced ECC population order 53  
N
NMI header 12  
O
HP Smart Update Manager overview 77, 82  
HP website 105  
online spare memory 52, 84  
online spare population guidelines 53  
online spare population order, multi-processor 54  
operating systems 27, 88  
optical drive 40  
optical drive cable 75  
optimum environment 21  
Option ROM Configuration for Arrays (ORCA) 77,  
options installation 26, 29, 37  
ORCA (Option ROM Configuration for Arrays) 77,  
I
identification number 92  
identifying components 7  
iLO (Integrated Lights-Out) 77, 78, 79  
IML (Integrated Management Log) 77, 79  
Insight Diagnostics 80, 87  
installation services 21  
installation, server options 26, 29  
installing hardware 29  
installing server 26  
installing server options 29  
Integrated Lights-Out (iLO) 77  
Integrated Management Log (IML) 79  
internal cables 70  
P
PCI riser board expansion slot definitions 9  
PCI riser cage 19, 20  
PDU (power distribution unit) 23  
phone numbers 105  
J
population order, memory 51, 52, 53, 54  
power cabling 76  
Japanese notice 95  
power calculator 104  
power cord 98  
power distribution unit (PDU) 23  
Power On button 28  
K
Korean notices 96  
Index 119  
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power requirements 104  
power supplies 101, 102, 103, 104  
power supply 104  
shipping carton contents 26  
site requirements 22  
Smart Update Manager 77, 82  
power supply output 104  
power supply specifications 101, 102, 103, 104  
powering down 16  
powering up 16, 83  
preparation procedures 16  
problem diagnosis 89  
space requirements 22  
specifications, power 100, 101, 102, 103  
specifications, server 100, 104  
standards 92  
static electricity 99  
processors 55  
storage controller 37  
support 105  
supported operating systems 88  
supported targets 89  
system battery 90  
system board battery 97  
system board components 10  
system components 7  
system configuration settings 87  
System Erase Utility 80  
system maintenance switch 11  
system, keeping current 87  
R
rack installation 21  
rack resources 21  
rack warnings 25  
RBSU (ROM-Based Setup Utility) 77, 82, 83, 84  
RBSU configuration 83  
rear panel buttons 9  
rear panel components 8  
rear panel LEDs 9  
recommended ambient operating temperature  
(TMRA) 22  
T
recovery key 66  
redundant power supply configurations 67  
redundant ROM 87  
registering the server 28  
T-10/T-15 Torx screwdriver 15  
Taiwan battery recycling notice 97  
technical support 105  
regulatory compliance notices 92, 94  
removing server from rack 17  
required information 105  
requirements, electrical grounding 23  
requirements, environmental 21  
requirements, power 23, 104  
requirements, site 22  
telephone numbers 105  
temperature requirements 22  
TMRA (recommended ambient operating  
temperature) 22  
TPM (Trusted Platform Module) 64, 66, 67  
troubleshooting 89  
troubleshooting resources 89  
troubleshooting, firmware upgrade utility 89  
Trusted Platform Module (TPM) 64, 65, 66, 67  
requirements, temperature 22  
ROM redundancy 87  
ROM-Based Setup Utility (RBSU) 67, 82  
ROMPaq utility 77, 86, 87  
U
updating the system ROM 87  
USB (universal serial bus) 86  
USB support 86  
utilities 77, 85  
utilities, deployment 77, 81, 82  
S
safety considerations 87  
safety information 87  
scripted installation 81  
security bezel 29  
security bezel, removing 18  
serial number 84  
series number 92  
server features and options 29  
server options, installing 29  
server specifications 104  
V
ventilation 21  
Version Control Agent (VCA) 88  
Version Control Repository Manager (VCRM) 88  
Index 120  
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W
warnings 25  
website, HP 105  
Index 121  
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