HP Hewlett Packard Server 646676001 User Manual

HP ProLiant ML350p Gen8 Server  
Maintenance and Service Guide  
Abstract  
This document is for the person who installs, administers, and troubleshoots servers and storage systems. This document is intended for experienced  
IT professionals or end-users with no or prior hardware setup experience. HP assumes you are qualified in the servicing of computer equipment and  
trained in recognizing hazards in products with hazardous energy levels.  
Part Number: 661081-005  
March 2013  
Edition: 5  
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Contents  
Contents  
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Contents  
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Customer self repair  
HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for  
greater flexibility in performing defective parts replacement. If during the diagnosis period HP (or HP service  
providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will  
ship that part directly to you for replacement. There are two categories of CSR parts:  
Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts,  
you will be charged for the travel and labor costs of this service.  
Optional—Parts for which customer self repair is optional. These parts are also designed for customer  
self repair. If, however, you require that HP replace them for you, there may or may not be additional  
charges, depending on the type of warranty service designated for your product.  
NOTE: Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty,  
HP requires that an authorized service provider replace the part. These parts are identified as "No" in the  
Illustrated Parts Catalog.  
Based on availability and where geography permits, CSR parts will be shipped for next business day  
delivery. Same day or four-hour delivery may be offered at an additional charge where geography permits.  
If assistance is required, you can call the HP Technical Support Center and a technician will help you over the  
telephone. HP specifies in the materials shipped with a replacement CSR part whether a defective part must  
be returned to HP. In cases where it is required to return the defective part to HP, you must ship the defective  
part back to HP within a defined period of time, normally five (5) business days. The defective part must be  
returned with the associated documentation in the provided shipping material. Failure to return the defective  
part may result in HP billing you for the replacement. With a customer self repair, HP will pay all shipping  
and part return costs and determine the courier/carrier to be used.  
For more information about HP's Customer Self Repair program, contact your local service provider. For the  
North American program, refer to the HP website (http://www.hp.com/go/selfrepair).  
Parts only warranty service  
Your HP Limited Warranty may include a parts only warranty service. Under the terms of parts only warranty  
service, HP will provide replacement parts free of charge.  
For parts only warranty service, CSR part replacement is mandatory. If you request HP to replace these parts,  
you will be charged for the travel and labor costs of this service.  
Réparation par le client (CSR)  
Les produits HP comportent de nombreuses pièces CSR (Customer Self Repair = réparation par le client) afin  
de minimiser les délais de réparation et faciliter le remplacement des pièces défectueuses. Si pendant la  
période de diagnostic, HP (ou ses partenaires ou mainteneurs agréés) détermine que la réparation peut être  
effectuée à l'aide d'une pièce CSR, HP vous l'envoie directement. Il existe deux catégories de pièces CSR:  
Customer self repair  
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Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de  
remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.  
Facultatif - Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également  
conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de  
remplacer ces pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à  
votre produit.  
REMARQUE: Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la  
réparation. Pour que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit effectué  
par un Mainteneur Agréé. Ces pièces sont identifiées par la mention "Non" dans le Catalogue illustré.  
Les pièces CSR sont livrées le jour ouvré suivant, dans la limite des stocks disponibles et selon votre situation  
géographique. Si votre situation géographique le permet et que vous demandez une livraison le jour même  
ou dans les 4 heures, celle-ci vous sera facturée. Pour bénéficier d'une assistance téléphonique, appelez le  
Centre d'assistance technique HP. Dans les documents envoyés avec la pièce de rechange CSR, HP précise  
s'il est nécessaire de lui retourner la pièce défectueuse. Si c'est le cas, vous devez le faire dans le délai  
indiqué, généralement cinq (5) jours ouvrés. La pièce et sa documentation doivent être retournées dans  
l'emballage fourni. Si vous ne retournez pas la pièce défectueuse, HP se réserve le droit de vous facturer les  
coûts de remplacement. Dans le cas d'une pièce CSR, HP supporte l'ensemble des frais d'expédition et de  
retour, et détermine la société de courses ou le transporteur à utiliser.  
Pour plus d'informations sur le programme CSR de HP, contactez votre Mainteneur Agrée local. Pour plus  
d'informations sur ce programme en Amérique du Nord, consultez le site Web HP  
Service de garantie "pièces seules"  
Votre garantie limitée HP peut inclure un service de garantie "pièces seules". Dans ce cas, les pièces de  
rechange fournies par HP ne sont pas facturées.  
Dans le cadre de ce service, la réparation des pièces CSR par le client est obligatoire. Si vous demandez à  
HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.  
Riparazione da parte del cliente  
Per abbreviare i tempi di riparazione e garantire una maggiore flessibilità nella sostituzione di parti  
difettose, i prodotti HP sono realizzati con numerosi componenti che possono essere riparati direttamente  
dal cliente (CSR, Customer Self Repair). Se in fase di diagnostica HP (o un centro di servizi o di assistenza  
HP) identifica il guasto come riparabile mediante un ricambio CSR, HP lo spedirà direttamente al cliente per  
la sostituzione. Vi sono due categorie di parti CSR:  
Obbligatorie – Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la  
riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio.  
Opzionali – Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti  
progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere  
spese addizionali a seconda del tipo di garanzia previsto per il prodotto.  
NOTA: alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la  
garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono  
identificate da un "No" nel Catalogo illustrato dei componenti.  
Customer self repair  
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In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il  
giorno lavorativo seguente. La consegna nel giorno stesso o entro quattro ore è offerta con un supplemento  
di costo solo in alcune zone. In caso di necessità si può richiedere l'assistenza telefonica di un addetto del  
centro di supporto tecnico HP. Nel materiale fornito con una parte di ricambio CSR, HP specifica se il cliente  
deve restituire dei componenti. Qualora sia richiesta la resa ad HP del componente difettoso, lo si deve  
spedire ad HP entro un determinato periodo di tempo, generalmente cinque (5) giorni lavorativi. Il  
componente difettoso deve essere restituito con la documentazione associata nell'imballo di spedizione  
fornito. La mancata restituzione del componente può comportare la fatturazione del ricambio da parte di HP.  
Nel caso di riparazione da parte del cliente, HP sostiene tutte le spese di spedizione e resa e sceglie il  
corriere/vettore da utilizzare.  
Per ulteriori informazioni sul programma CSR di HP contattare il centro di assistenza di zona. Per il  
programma in Nord America fare riferimento al sito Web HP (http://www.hp.com/go/selfrepair).  
Servizio di garanzia per i soli componenti  
La garanzia limitata HP può includere un servizio di garanzia per i soli componenti. Nei termini di garanzia  
del servizio per i soli componenti, HP fornirà gratuitamente le parti di ricambio.  
Per il servizio di garanzia per i soli componenti è obbligatoria la formula CSR che prevede la riparazione da  
parte del cliente. Se il cliente invece richiede la sostituzione ad HP, dovrà sostenere le spese di spedizione  
e di manodopera per il servizio.  
Customer Self Repair  
HP Produkte enthalten viele CSR-Teile (Customer Self Repair), um Reparaturzeiten zu minimieren und höhere  
Flexibilität beim Austausch defekter Bauteile zu ermöglichen. Wenn HP (oder ein HP Servicepartner) bei der  
Diagnose feststellt, dass das Produkt mithilfe eines CSR-Teils repariert werden kann, sendet Ihnen HP dieses  
Bauteil zum Austausch direkt zu. CSR-Teile werden in zwei Kategorien unterteilt:  
Zwingend – Teile, für die das Customer Self Repair-Verfahren zwingend vorgegeben ist. Wenn Sie den  
Austausch dieser Teile von HP vornehmen lassen, werden Ihnen die Anfahrt- und Arbeitskosten für diesen  
Service berechnet.  
Optional – Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für Customer  
Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten,  
können bei diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche  
Kosten anfallen.  
HINWEIS: Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des  
Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog  
sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet.  
CSR-Teile werden abhängig von der Verfügbarkeit und vom Lieferziel am folgenden Geschäftstag geliefert.  
Für bestimmte Standorte ist eine Lieferung am selben Tag oder innerhalb von vier Stunden gegen einen  
Aufpreis verfügbar. Wenn Sie Hilfe benötigen, können Sie das HP technische Support Center anrufen und  
sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien, die mit einem CSR-Ersatzteil geliefert  
werden, können Sie entnehmen, ob das defekte Teil an HP zurückgeschickt werden muss. Wenn es  
erforderlich ist, das defekte Teil an HP zurückzuschicken, müssen Sie dies innerhalb eines vorgegebenen  
Zeitraums tun, in der Regel innerhalb von fünf (5) Geschäftstagen. Das defekte Teil muss mit der zugehörigen  
Dokumentation in der Verpackung zurückgeschickt werden, die im Lieferumfang enthalten ist. Wenn Sie das  
Customer self repair  
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defekte Teil nicht zurückschicken, kann HP Ihnen das Ersatzteil in Rechnung stellen. Im Falle von Customer  
Self Repair kommt HP für alle Kosten für die Lieferung und Rücksendung auf und bestimmt den  
Kurier-/Frachtdienst.  
Weitere Informationen über das HP Customer Self Repair Programm erhalten Sie von Ihrem Servicepartner  
vor Ort. Informationen über das CSR-Programm in Nordamerika finden Sie auf der HP Website unter  
Parts-only Warranty Service (Garantieservice  
ausschließlich für Teile)  
Ihre HP Garantie umfasst möglicherweise einen Parts-only Warranty Service (Garantieservice ausschließlich  
für Teile). Gemäß den Bestimmungen des Parts-only Warranty Service stellt HP Ersatzteile kostenlos zur  
Verfügung.  
Für den Parts-only Warranty Service ist das CSR-Verfahren zwingend vorgegeben. Wenn Sie den Austausch  
dieser Teile von HP vornehmen lassen, werden Ihnen die Anfahrt- und Arbeitskosten für diesen Service  
berechnet.  
Reparaciones del propio cliente  
Los productos de HP incluyen muchos componentes que el propio usuario puede reemplazar (Customer Self  
Repair, CSR) para minimizar el tiempo de reparación y ofrecer una mayor flexibilidad a la hora de realizar  
sustituciones de componentes defectuosos. Si, durante la fase de diagnóstico, HP (o los proveedores o socios  
de servicio de HP) identifica que una reparación puede llevarse a cabo mediante el uso de un componente  
CSR, HP le enviará dicho componente directamente para que realice su sustitución. Los componentes CSR se  
clasifican en dos categorías:  
Obligatorio: componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a  
HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de  
desplazamiento y de mano de obra de dicho servicio.  
Opcional: componentes para los que la reparación por parte del usuario es opcional. Estos  
componentes también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si  
precisa que HP realice su sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de  
servicio de garantía correspondiente al producto.  
NOTA: Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que  
el usuario haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado  
realice la sustitución de estos componentes. Dichos componentes se identifican con la palabra "No" en el  
catálogo ilustrado de componentes.  
Según la disponibilidad y la situación geográfica, los componentes CSR se enviarán para que lleguen a su  
destino al siguiente día laborable. Si la situación geográfica lo permite, se puede solicitar la entrega en el  
mismo día o en cuatro horas con un coste adicional. Si precisa asistencia técnica, puede llamar al Centro de  
asistencia técnica de HP y recibirá ayuda telefónica por parte de un técnico. Con el envío de materiales  
para la sustitución de componentes CSR, HP especificará si los componentes defectuosos deberán  
devolverse a HP. En aquellos casos en los que sea necesario devolver algún componente a HP, deberá  
hacerlo en el periodo de tiempo especificado, normalmente cinco días laborables. Los componentes  
defectuosos deberán devolverse con toda la documentación relacionada y con el embalaje de envío. Si no  
Customer self repair  
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enviara el componente defectuoso requerido, HP podrá cobrarle por el de sustitución. En el caso de todas  
sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de  
componentes y escogerá la empresa de transporte que se utilice para dicho servicio.  
Para obtener más información acerca del programa de Reparaciones del propio cliente de HP, póngase en  
contacto con su proveedor de servicios local. Si está interesado en el programa para Norteamérica, visite  
la página web de HP siguiente (http://www.hp.com/go/selfrepair).  
Servicio de garantía exclusivo de componentes  
La garantía limitada de HP puede que incluya un servicio de garantía exclusivo de componentes. Según las  
condiciones de este servicio exclusivo de componentes, HP le facilitará los componentes de repuesto sin  
cargo adicional alguno.  
Para este servicio de garantía exclusivo de componentes, es obligatoria la sustitución de componentes por  
parte del usuario (CSR). Si solicita a HP que realice la sustitución de estos componentes, tendrá que hacerse  
cargo de los gastos de desplazamiento y de mano de obra de dicho servicio.  
Customer Self Repair  
Veel onderdelen in HP producten zijn door de klant zelf te repareren, waardoor de reparatieduur tot een  
minimum beperkt kan blijven en de flexibiliteit in het vervangen van defecte onderdelen groter is. Deze  
onderdelen worden CSR-onderdelen (Customer Self Repair) genoemd. Als HP (of een HP Service Partner) bij  
de diagnose vaststelt dat de reparatie kan worden uitgevoerd met een CSR-onderdeel, verzendt HP dat  
onderdeel rechtstreeks naar u, zodat u het defecte onderdeel daarmee kunt vervangen. Er zijn twee  
categorieën CSR-onderdelen:  
Verplicht: Onderdelen waarvoor reparatie door de klant verplicht is. Als u HP verzoekt deze onderdelen  
voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon in rekening gebracht.  
Optioneel: Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn ontworpen  
voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen  
daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het  
product.  
OPMERKING: Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met  
de garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen.  
Deze onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".  
Afhankelijk van de leverbaarheid en de locatie worden CSR-onderdelen verzonden voor levering op de  
eerstvolgende werkdag. Levering op dezelfde dag of binnen vier uur kan tegen meerkosten worden  
aangeboden, indien dit mogelijk is gezien de locatie. Indien assistentie gewenst is, belt u een HP Service  
Partner om via de telefoon technische ondersteuning te ontvangen. HP vermeldt in de documentatie bij het  
vervangende CSR-onderdeel of het defecte onderdeel aan HP moet worden geretourneerd. Als het defecte  
onderdeel aan HP moet worden teruggezonden, moet u het defecte onderdeel binnen een bepaalde  
periode, gewoonlijk vijf (5) werkdagen, retourneren aan HP. Het defecte onderdeel moet met de  
bijbehorende documentatie worden geretourneerd in het meegeleverde verpakkingsmateriaal. Als u het  
defecte onderdeel niet terugzendt, kan HP u voor het vervangende onderdeel kosten in rekening brengen. Bij  
reparatie door de klant betaalt HP alle verzendkosten voor het vervangende en geretourneerde onderdeel en  
kiest HP zelf welke koerier/transportonderneming hiervoor wordt gebruikt.  
Customer self repair  
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Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programma  
van HP. Informatie over Service Partners vindt u op de HP website (http://www.hp.com/go/selfrepair).  
Garantieservice "Parts Only"  
Het is mogelijk dat de HP garantie alleen de garantieservice "Parts Only" omvat. Volgens de bepalingen van  
de Parts Only garantieservice zal HP kosteloos vervangende onderdelen ter beschikking stellen.  
Voor de Parts Only garantieservice is vervanging door CSR-onderdelen verplicht. Als u HP verzoekt deze  
onderdelen voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon in rekening  
gebracht.  
Reparo feito pelo cliente  
Os produtos da HP são projetados com muitas peças para reparo feito pelo cliente (CSR) de modo a  
minimizar o tempo de reparo e permitir maior flexibilidade na substituição de peças com defeito. Se,  
durante o período de diagnóstico, a HP (ou fornecedores/parceiros de serviço da HP) concluir que o reparo  
pode ser efetuado pelo uso de uma peça CSR, a peça de reposição será enviada diretamente ao cliente.  
Existem duas categorias de peças CSR:  
Obrigatória – Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças,  
serão cobradas as despesas de transporte e mão-de-obra do serviço.  
Opcional – Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o  
reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de  
taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.  
OBSERVAÇÃO: Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de  
cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão  
identificadas com a marca "No" (Não), no catálogo de peças ilustrado.  
Conforme a disponibilidade e o local geográfico, as peças CSR serão enviadas no primeiro dia útil após o  
pedido. Onde as condições geográficas permitirem, a entrega no mesmo dia ou em quatro horas pode ser  
feita mediante uma taxa adicional. Se precisar de auxílio, entre em contato com o Centro de suporte técnico  
da HP para que um técnico o ajude por telefone. A HP especifica nos materiais fornecidos com a peça CSR  
de reposição se a peça com defeito deve ser devolvida à HP. Nos casos em que isso for necessário, é  
preciso enviar a peça com defeito à HP dentro do período determinado, normalmente cinco (5) dias úteis.  
A peça com defeito deve ser enviada com a documentação correspondente no material de transporte  
fornecido. Caso não o faça, a HP poderá cobrar a reposição. Para as peças de reparo feito pelo cliente, a  
HP paga todas as despesas de transporte e de devolução da peça e determina a transportadora/serviço  
postal a ser utilizado.  
Para obter mais informações sobre o programa de reparo feito pelo cliente da HP, entre em contato com o  
fornecedor de serviços local. Para o programa norte-americano, visite o site da HP  
Serviço de garantia apenas para peças  
A garantia limitada da HP pode incluir um serviço de garantia apenas para peças. Segundo os termos do  
serviço de garantia apenas para peças, a HP fornece as peças de reposição sem cobrar nenhuma taxa.  
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No caso desse serviço, a substituição de peças CSR é obrigatória. Se desejar que a HP substitua essas  
peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.  
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Illustrated parts catalog  
Mechanical components  
Item Description  
Spare part number  
Customer self repair (on  
page 5)  
Front bezel  
1
667267-001  
670612-001  
667255-001  
667262-001  
667258-001  
667280-001  
667256-001  
667274-001  
Mandatory1  
Optional2  
Second optical drive cage  
2
Fan cage  
3
Optional2  
Mandatory1  
Optional2  
Mandatory1  
Mandatory1  
Mandatory1  
Fan blank  
4
Fan louver  
5
PCI air baffles (2)  
6
System air baffle  
7
Bezel ear kit  
8
a) Bezel ear, right  
b) Bezel ear, left*  
Illustrated parts catalog 15  
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Item Description  
Spare part number  
Customer self repair (on  
page 5)  
c) T-10 screws (4)*  
d) T-15 screws (4)*  
e) Discovery service cable*  
f) Server baseblank covers (2)*  
Tower feet  
667264-001  
667279-001  
667276-001  
667261-001  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
9
LFF drive blank  
SFF drive blank  
Drive cage blank*  
10  
11  
12  
*Not shown  
1Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be  
charged for the travel and labor costs of this service.  
2Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If,  
however, you require that HP replace them for you, there may or may not be additional charges, depending on the type  
of warranty service designated for your product.  
3No—Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty, HP requires that  
an authorized service provider replace the part. These parts are identified as "No" in the Illustrated Parts Catalog.  
1Mandatory: Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de  
remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.  
2Optional: Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également  
conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de remplacer ces  
pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à votre produit.  
3No: Non—Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la réparation. Pour  
que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit effectué par un Mainteneur Agréé. Ces  
pièces sont identifiées par la mention “Non” dans le Catalogue illustré.  
1Mandatory: Obbligatorie—Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la  
riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio.  
2Optional: Opzionali—Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti  
progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere spese  
addizionali a seconda del tipo di garanzia previsto per il prodotto.  
3No: Non CSR—Alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la  
garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate  
da un “No” nel Catalogo illustrato dei componenti.  
1Mandatory: Zwingend—Teile, die im Rahmen des Customer Self Repair Programms ersetzt werden müssen. Wenn Sie  
diese Teile von HP ersetzen lassen, werden Ihnen die Versand- und Arbeitskosten für diesen Service berechnet.  
2Optional: Optional—Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für Customer  
Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten, können bei  
diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche Kosten anfallen.  
3No: Kein—Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen,  
muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw.  
„Nein“ gekennzeichnet.  
1Mandatory: Obligatorio—componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a HP  
que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de mano  
de obra de dicho servicio.  
2Optional: Opcional— componentes para los que la reparación por parte del usuario es opcional. Estos componentes  
también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si precisa que HP realice su  
Illustrated parts catalog 16  
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sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de servicio de garantía correspondiente al  
producto.  
3No: No—Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que el usuario  
haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado realice la sustitución de estos  
componentes. Dichos componentes se identifican con la palabra “No” en el catálogo ilustrado de componentes.  
1Mandatory: Verplicht—Onderdelen waarvoor Customer Self Repair verplicht is. Als u HP verzoekt deze onderdelen te  
vervangen, komen de reiskosten en het arbeidsloon voor uw rekening.  
2Optional: Optioneel—Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn  
ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen  
daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het product.  
3No: Nee—Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met de  
garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen. Deze  
onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".  
1Mandatory: Obrigatória—Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças,  
serão cobradas as despesas de transporte e mão-de-obra do serviço.  
2Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o  
reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa  
adicional, dependendo do tipo de serviço de garantia destinado ao produto.  
3No: Nenhuma—Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia  
do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão identificadas com a marca “No”  
(Não), no catálogo de peças ilustrado.  
Illustrated parts catalog 17  
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System components  
Item  
Description  
Spare part number  
Customer self repair (on  
page 5)  
Power supplies  
13  
a) HP 460W CS Gold (92% efficiency)  
511777-001  
Mandatory1  
b) HP 460 W CS Platinum Plus (94%  
efficiency)*  
c) HP 750 W CS Gold (92% efficiency)* 511778-001  
660184-001  
Mandatory1  
Mandatory1  
Mandatory1  
d) HP 750 W CS Platinum Plus (94%  
efficiency)*  
f) HP 1200 W CS Platinum Plus (94%  
efficiency)*  
660183-001  
660185-001  
Mandatory1  
Heatsink  
667268-001  
Optional2  
14  
15  
Processors**  
a) 3.0 GHz Intel Xeon E5-2637 processor, 670539-001  
Optional2  
2C, 80W  
b) 1.8 GHz Intel Xeon E5-2603 processor, 670533-001  
4C, 80W*  
c) 2.4 GHz Intel Xeon E5-2609 processor, 670530-001  
4C, 80W*  
d) 3.3 GHz Intel Xeon E5-2643 processor, 670538-001  
4C, 130W*  
e) 2.0 GHz Intel Xeon E5-2630L processor, 670535-001  
6C, 60W*  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
f) 2.0 GHz Intel Xeon E5-2620 processor, 670529-001  
6C, 95W*  
Illustrated parts catalog 18  
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Item  
Description  
Spare part number  
Customer self repair (on  
page 5)  
g) 2.3GHz Intel Xeon E5-2630 processor, 670528-001  
6C, 95W*  
h) 2.5 GHz Intel Xeon E5-2640 processor, 670527-001  
6C, 95W*  
i) 2.9 GHz Intel Xeon E5-2667 processor, 670537-001  
6C, 130W*  
j) 1.8 GHz Intel Xeon E5-2650L processor, 670534-001  
8C, 70W*  
k) 2.0 GHz Intel Xeon E5-2650 processor, 670526-001  
8C, 95W*  
l) 2.2 GHz Intel Xeon E5-2660 processor, 670525-001  
8C, 95W*  
m) 2.4 GHz Intel Xeon E5-2665 processor, 670524-001  
8C, 115W*  
n) 2.6 GHz Intel Xeon E5-2670 processor, 670523-001  
8C, 115W*  
o) 2.7 GHz Intel Xeon E5-2680 processor, 670522-001  
8C, 130W*  
p) 2.9 GHz Intel Xeon E5-2690 processor, 670521-001  
8C, 135W*  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
DIMMs  
16  
a) 2 GB, PC3L-10600E-9, single-rank x8 664694-001  
b) 4 GB, PC3L-10600R-9, single-rank x4* 664688-001  
c) 4 GB, PC3-12800R-11, single-rank x4* 664689-001  
d) 4 GB, PC3L-10600E-9, dual-rank x8* 664695-001  
e) 8 GB, PC3-12800R-11, single-rank x4* 664691-001  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
f) 8GB, PC3L-10600R, dual-rank x4*  
g) 8GB, PC3L-10600E, dual-rank x8*  
664690-001  
664696-001  
i) 16 GB, PC3L-10600R-9, dual-rank x4* 664692-001  
j) 16 GB, PC3-12800R-11, dual-rank x4* 684031-001  
k) 32GB, PC3L-10600L, quad-rank x4*  
664693-001  
System board assembly  
SFF drive backplane  
667253-001  
667275-001  
667278-001  
667260-001  
667271-001  
667266-001  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Mandatory1  
17  
18  
19  
20  
21  
22  
LFF drive backplane  
Front I/O module assembly*  
SID module assembly*  
Miscellaneous cable kit  
a) Mini-SAS to Mini-SAS, 12.75-in*  
b) Drive backplane power cable*  
c) Graphic support cable, 2x4*  
Mini-SAS cables  
23  
a) Mini-SAS cable, 35 in*  
667277-001  
Mandatory1  
b) Mini-SAS cable, 25.5 in*  
498424-001  
Mandatory1  
Illustrated parts catalog 19  
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Item  
Description  
Spare part number  
Customer self repair (on  
page 5)  
Power cable*  
667259-001  
667265-001  
693610-001  
693611-001  
667254-001  
667263-001  
Optional2  
Mandatory1  
Optional2  
Optional2  
Mandatory1  
Mandatory1  
24  
25  
26  
27  
28  
29  
SATA cable*  
SFF drive backplane with expander*  
LFF drive backplane with expander*  
Fan module*  
Bracket support holder*  
a) Right holder  
b) Left holder  
Two-bay power supply backplane board* 667269-001  
Four-bay power supply backplane board* 667281-001  
Optional2  
Optional2  
Mandatory1  
30  
31  
32  
Two-bay power supply blank*  
667270-001  
Rail kit*  
667272-001  
667273-001  
Mandatory1  
Mandatory1  
33  
34  
Rack bezel*  
Power supply air baffle*  
667257-001  
Optional2  
35  
*Not shown  
**All processors in this HP ProLiant server must have the same cache size, speed, number of cores, and rated maximum  
power consumption.  
1Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be  
charged for the travel and labor costs of this service.  
2Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If,  
however, you require that HP replace them for you, there may or may not be additional charges, depending on the type  
of warranty service designated for your product.  
3No—Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty, HP requires that  
an authorized service provider replace the part. These parts are identified as "No" in the Illustrated Parts Catalog.  
1Mandatory: Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de  
remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.  
2Optional: Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également  
conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de remplacer ces  
pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à votre produit.  
3No: Non—Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la réparation. Pour  
que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit effectué par un Mainteneur Agréé. Ces  
pièces sont identifiées par la mention “Non” dans le Catalogue illustré.  
1Mandatory: Obbligatorie—Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la  
riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio.  
2Optional: Opzionali—Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti  
progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere spese  
addizionali a seconda del tipo di garanzia previsto per il prodotto.  
3No: Non CSR—Alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la  
garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate  
da un “No” nel Catalogo illustrato dei componenti.  
1Mandatory: Zwingend—Teile, die im Rahmen des Customer Self Repair Programms ersetzt werden müssen. Wenn Sie  
diese Teile von HP ersetzen lassen, werden Ihnen die Versand- und Arbeitskosten für diesen Service berechnet.  
Illustrated parts catalog 20  
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2Optional: Optional—Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für Customer  
Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten, können bei  
diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche Kosten anfallen.  
3No: Kein—Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen,  
muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw.  
„Nein“ gekennzeichnet.  
1Mandatory: Obligatorio—componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a HP  
que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de mano  
de obra de dicho servicio.  
2Optional: Opcional— componentes para los que la reparación por parte del usuario es opcional. Estos componentes  
también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si precisa que HP realice su  
sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de servicio de garantía correspondiente al  
producto.  
3No: No—Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que el usuario  
haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado realice la sustitución de estos  
componentes. Dichos componentes se identifican con la palabra “No” en el catálogo ilustrado de componentes.  
1Mandatory: Verplicht—Onderdelen waarvoor Customer Self Repair verplicht is. Als u HP verzoekt deze onderdelen te  
vervangen, komen de reiskosten en het arbeidsloon voor uw rekening.  
2Optional: Optioneel—Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn  
ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen  
daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het product.  
3No: Nee—Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met de  
garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen. Deze  
onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".  
1Mandatory: Obrigatória—Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças,  
serão cobradas as despesas de transporte e mão-de-obra do serviço.  
2Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o  
reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa  
adicional, dependendo do tipo de serviço de garantia destinado ao produto.  
3No: Nenhuma—Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia  
do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão identificadas com a marca “No”  
(Não), no catálogo de peças ilustrado.  
Illustrated parts catalog 21  
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Removal and replacement procedures  
Required tools  
You need the following items for some procedures:  
T-10 Torx screwdriver  
T-15 Torx screwdriver  
HP Insight Diagnostics software ("HP Insight Diagnostics" on page 73)  
Safety considerations  
Before performing service procedures, review all the safety information.  
Preventing electrostatic discharge  
To prevent damaging the system, be aware of the precautions you need to follow when setting up the system  
or handling parts. A discharge of static electricity from a finger or other conductor may damage system  
boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the device.  
To prevent electrostatic damage:  
Avoid hand contact by transporting and storing products in static-safe containers.  
Keep electrostatic-sensitive parts in their containers until they arrive at static-free workstations.  
Place parts on a grounded surface before removing them from their containers.  
Avoid touching pins, leads, or circuitry.  
Always be properly grounded when touching a static-sensitive component or assembly.  
Symbols on equipment  
The following symbols may be placed on equipment to indicate the presence of potentially hazardous  
conditions.  
This symbol indicates the presence of hazardous energy circuits or electric shock  
hazards. Refer all servicing to qualified personnel.  
WARNING: To reduce the risk of injury from electric shock hazards, do not open this  
enclosure. Refer all maintenance, upgrades, and servicing to qualified personnel.  
This symbol indicates the presence of electric shock hazards. The area contains no user  
or field serviceable parts. Do not open for any reason.  
WARNING: To reduce the risk of injury from electric shock hazards, do not open this  
enclosure.  
Removal and replacement procedures 23  
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This symbol on an RJ-45 receptacle indicates a network interface connection.  
WARNING: To reduce the risk of electric shock, fire, or damage to the equipment, do  
not plug telephone or telecommunications connectors into this receptacle.  
This symbol indicates the presence of a hot surface or hot component. If this surface is  
contacted, the potential for injury exists.  
WARNING: To reduce the risk of injury from a hot component, allow the surface to cool  
before touching.  
This symbol indicates that the component exceeds the recommended weight for one  
individual to handle safely.  
WARNING: To reduce the risk of personal injury or damage to the equipment, observe  
local occupational health and safety requirements and guidelines for manual material  
handling.  
These symbols, on power supplies or systems, indicate that the equipment is supplied  
by multiple sources of power.  
WARNING: To reduce the risk of injury from electric shock, remove all power cords to  
completely disconnect power from the system.  
Rack warnings  
WARNING: To reduce the risk of personal injury or damage to the equipment, be sure that:  
The leveling jacks are extended to the floor.  
The full weight of the rack rests on the leveling jacks.  
The stabilizing feet are attached to the rack if it is a single-rack installation.  
The racks are coupled together in multiple-rack installations.  
Only one component is extended at a time. A rack may become unstable if more than one  
component is extended for any reason.  
WARNING: To reduce the risk of personal injury or equipment damage when unloading a rack:  
At least two people are needed to safely unload the rack from the pallet. An empty 42U rack  
can weigh as much as 115 kg (253 lb), can stand more than 2.1 m (7 ft) tall, and might  
become unstable when being moved on its casters.  
Never stand in front of the rack when it is rolling down the ramp from the pallet. Always handle  
the rack from both sides.  
WARNING: To reduce the risk of personal injury or damage to the equipment, adequately  
stabilize the rack before extending a component outside the rack. Extend only one component at  
a time. A rack may become unstable if more than one component is extended.  
WARNING: When installing a server in a telco rack, be sure that the rack frame is adequately  
secured at the top and bottom to the building structure.  
Preparation procedures  
To access some components and perform certain service procedures, you must perform one or more of the  
following procedures:  
Removal and replacement procedures 24  
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Power down the server (on page 25).  
If you must remove a server from a rack or a non-hot-plug component from a server, power down the  
server.  
Remove the tower bezel (on page 26).  
Remove the rack bezel.  
Extend the server from the rack (on page 27).  
If you are performing service procedures in an HP, Compaq branded, telco, or third-party rack cabinet,  
you can use the locking feature of the rack rails to support the server and gain access to internal  
components.  
For more information about telco rack solutions, refer to the RackSolutions.com website  
Power up the server  
To power up the server:  
1.  
2.  
3.  
Connect each power cord to the server.  
Connect each power cord to the power source.  
Press the Power On/Standby button.  
The server exits standby mode and applies full power to the system. The system power LED changes  
from amber to green.  
Power down the server  
Before powering down the server for any upgrade or maintenance procedures, perform a backup of critical  
server data and programs.  
IMPORTANT: When the server is in standby mode, auxiliary power is still being provided to the  
system.  
To power down the server, use one of the following methods:  
Press and release the Power On/Standby button.  
This method initiates a controlled shutdown of applications and the OS before the server enters standby  
mode.  
Press and hold the Power On/Standby button for more than 4 seconds to force the server to enter  
standby mode.  
This method forces the server to enter standby mode without properly exiting applications and the OS.  
If an application stops responding, you can use this method to force a shutdown.  
Use a virtual power button selection through iLO 4.  
This method initiates a controlled remote shutdown of applications and the OS before the server enters  
standby mode.  
Before proceeding, verify the server is in standby mode by observing that the system power LED is amber.  
Removal and replacement procedures 25  
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Remove the security bezel  
Unlock the security bezel, press the latch on the security bezel, and then remove the security bezel.  
Remove the tower bezel  
This server has a removable bezel that must be unlocked and opened before accessing the hard drives. The  
bezel must be kept closed during normal server operations.  
1.  
2.  
Using the key provided with the server, unlock the bezel with a clockwise turn.  
Remove the tower bezel.  
Remove the rack bezel  
1.  
2.  
If installed, remove the security bezel (on page 26).  
Power down the server (on page 25).  
Removal and replacement procedures 26  
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3.  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Extend the server from the rack (on page 27).  
Remove the access panel ("Access panel" on page 28).  
Loosen the rack bezel thumbscrews located inside the chassis.  
Remove the rack bezel.  
4.  
5.  
6.  
7.  
Extend the server from the rack  
IMPORTANT: If the server is installed in a telco rack, remove the server from the rack to access  
internal components.  
1.  
2.  
Pull down the quick release levers on each side of the server.  
Extend the server from the rack.  
WARNING: To reduce the risk of personal injury or equipment damage, be sure that the rack is  
adequately stabilized before extending a component from the rack.  
WARNING: To reduce the risk of personal injury, be careful when pressing the server rail-release  
latches and sliding the server into the rack. The sliding rails could pinch your fingers.  
Removal and replacement procedures 27  
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3.  
After performing the installation or maintenance procedure, slide the server back into the rack, and then  
press the server firmly into the rack to secure it in place.  
WARNING: To reduce the risk of personal injury, be careful when pressing the server rail-release  
latches and sliding the server into the rack. The sliding rails could pinch your fingers.  
Access panel  
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the  
internal system components to cool before touching them.  
CAUTION: Do not operate the server for long periods with the access panel open or removed.  
Operating the server in this manner results in improper airflow and improper cooling that can  
lead to thermal damage.  
To remove the component:  
1.  
Do one of the following:  
o
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 26).  
For rack models, if installed, remove the security bezel (on page 26).  
2.  
3.  
Power down the server (on page 25).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Do one of the following:  
4.  
5.  
o
o
For tower models, place the server on a flat, level surface with the access panel facing up.  
For rack models, extend the server from the rack (on page 27).  
Open the locking latch, slide the access panel to the rear of the chassis, and then remove the access  
panel.  
If the locking latch is locked, use a T-15 Torx screwdriver to unlock it.  
Removal and replacement procedures 28  
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To replace the component, reverse the removal procedure.  
Air baffle  
To remove the component:  
1.  
Do one of the following:  
o
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 26).  
For rack models, if installed, remove the security bezel (on page 26).  
2.  
3.  
Power down the server (on page 25).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Do one of the following:  
4.  
o
o
For tower models, place the server on a flat, level surface with the access panel facing up.  
For rack models, extend the server from the rack (on page 27).  
5.  
6.  
Remove the access panel ("Access panel" on page 28).  
Remove the air baffle.  
To replace the component, reverse the removal procedure.  
PCI air baffles  
To remove the component:  
1.  
Do one of the following:  
o
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 26).  
For rack models, if installed, remove the security bezel (on page 26).  
2.  
Power down the server (on page 25).  
Removal and replacement procedures 29  
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3.  
4.  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Do one of the following:  
o
o
For tower models, place the server on a flat, level surface with the access panel facing up.  
For rack models, extend the server from the rack (on page 27).  
5.  
6.  
Remove the access panel ("Access panel" on page 28).  
Remove the PCI air baffles.  
To replace the component, reverse the removal procedure.  
Fan blank  
To remove the component:  
1.  
Do one of the following:  
o
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 26).  
For rack models, if installed, remove the security bezel (on page 26).  
2.  
3.  
Power down the server (on page 25).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Do one of the following:  
4.  
5.  
o
o
For tower models, place the server on a flat, level surface with the access panel facing up.  
For rack models, extend the server from the rack (on page 27).  
Remove the access panel ("Access panel" on page 28).  
Removal and replacement procedures 30  
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6.  
Remove the fan blank.  
To replace the component, reverse the removal procedure.  
To remove the component:  
Fan  
1.  
Do one of the following:  
o
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 26).  
For rack models, if installed, remove the security bezel (on page 26).  
2.  
3.  
Power down the server (on page 25).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Do one of the following:  
4.  
5.  
o
o
For tower models, place the server on a flat, level surface with the access panel facing up.  
For rack models, extend the server from the rack (on page 27).  
Remove the access panel ("Access panel" on page 28).  
Removal and replacement procedures 31  
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6.  
Remove the fan.  
To replace the component, reverse the removal procedure.  
Fan cage  
IMPORTANT: When installing or replacing server components, one or more fans might need to  
be removed. To prevent an orderly or immediate server shutdown, HP highly recommends  
powering down the server during these procedures. To determine if powering down is required,  
see the specific procedure.  
To remove the component:  
1.  
Do one of the following:  
o
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 26).  
For rack models, if installed, remove the security bezel (on page 26).  
2.  
3.  
Power down the server (on page 25).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Do one of the following:  
4.  
o
o
For tower models, place the server on a flat, level surface with the access panel facing up.  
For rack models, extend the server from the rack (on page 27).  
5.  
6.  
Remove the access panel ("Access panel" on page 28).  
Remove the air baffle ("Air baffle" on page 29).  
Removal and replacement procedures 32  
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7.  
Remove the fan cage.  
To replace the component, reverse the removal procedure.  
Tower feet  
NOTE: This procedure applies to tower servers only.  
To remove the component:  
1.  
2.  
3.  
Open and remove the bezel ("Remove the tower bezel" on page 26).  
Power down the server (on page 25).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Removal and replacement procedures 33  
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4.  
Place the server on the side.  
5.  
Remove the tower feet.  
To replace the component, reverse the removal procedure.  
Component box blank  
To remove the component:  
1.  
2.  
For tower models, open and remove the bezel ("Remove the tower bezel" on page 26).  
For rack models, do the following:  
a. If installed, remove the security bezel (on page 26).  
b. Power down the server (on page 25).  
c. Remove all power:  
i. Disconnect each power cord from the power source.  
Removal and replacement procedures 34  
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ii. Disconnect each power cord from the server  
d. Remove the access panel ("Access panel" on page 28).  
e. Remove the rack bezel.  
3.  
Remove the component box blank.  
To replace the component, reverse the removal procedure.  
Drive blank  
To remove the component:  
1.  
Do one of the following:  
o
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 26).  
For rack models, if install, remove the security bezel (on page 26).  
2.  
Remove the drive blank.  
To replace the component, reverse the removal procedure.  
Drive  
Removal and replacement procedures 35  
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WARNING: To reduce the risk of injury from electric shock, do not remove more than one drive  
carrier at a time.  
To remove the component:  
1.  
Do one of the following:  
o
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 26).  
For rack models, if installed, remove the security bezel (on page 26).  
2.  
Remove the drive.  
To replace the component, reverse the removal procedure.  
Optical drive cage  
To remove the component:  
1.  
Do one of the following:  
o
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 26).  
For rack models, if installed, remove the security bezel (on page 26).  
2.  
3.  
Power down the server (on page 25).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
For tower models, do the following:  
4.  
5.  
a. Place the server on a flat, level surface with the access panel facing up.  
b. Remove the access panel ("Access panel" on page 28).  
For rack models, do the following:  
a. Extend the server from the rack (on page 27).  
b. Remove the access panel ("Access panel" on page 28).  
o
Release thumbscrews and remove the rack bezel.  
6.  
7.  
8.  
Remove the air baffle ("Air baffle" on page 29).  
Remove the fan cage ("Fan cage" on page 32).  
Disconnect the data cable and the power cable from the rear of the optical drive cage.  
Removal and replacement procedures 36  
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9.  
Using the T-15 screwdriver, loosen T-15 screws securing the optical drive cage.  
10. Remove the optical drive cage.  
To replace the component, reverse the removal procedure.  
Optical drive  
To remove the component:  
1.  
Do one of the following:  
o
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 26).  
For rack models, if installed, remove the security bezel (on page 26).  
2.  
3.  
Power down the server (on page 25).  
Remove all power:  
a. Disconnect each power cord from the power source.  
Removal and replacement procedures 37  
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b. Disconnect each power cord from the server.  
For tower models, do the following:  
4.  
5.  
a. Place the server on a flat, level surface with the access panel facing up.  
b. Remove the access panel ("Access panel" on page 28).  
For rack models, do the following:  
a. Extend the server from the rack (on page 27).  
b. Remove the access panel ("Access panel" on page 28).  
c. Release thumbscrews and remove the rack bezel.  
Remove the air baffle ("Air baffle" on page 29).  
Remove the fan cage ("Fan cage" on page 32).  
Disconnect and remove the optical drive power and data cables.  
Remove the optical drive.  
6.  
7.  
8.  
9.  
To replace the component, reverse the removal procedure.  
Front I/O assembly  
To remove the component:  
1.  
Do one of the following:  
o
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 26).  
For rack models, if installed, remove the security bezel (on page 26).  
2.  
3.  
Power down the server (on page 25).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
For tower models, do the following:  
4.  
a. Place the server on a flat, level surface with the access panel facing up.  
Removal and replacement procedures 38  
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b. Remove the access panel ("Access panel" on page 28).  
For rack models, do the following:  
5.  
a. Extend the server from the rack (on page 27).  
b. Remove the access panel ("Access panel" on page 28).  
c. Release thumbscrews and remove the rack bezel.  
Remove the air baffle ("Air baffle" on page 29).  
Remove the fan cage ("Fan cage" on page 32).  
Remove the front I/O module assembly.  
6.  
7.  
8.  
To replace the component, reverse the removal procedure.  
Power supply blank  
Remove the blank.  
To replace the component, reverse the removal procedure.  
Removal and replacement procedures 39  
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Power supply module  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all bays are populated with either a component or a blank.  
To remove the component:  
1.  
Do one of the following:  
o
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 26).  
For rack models, if installed, remove the security bezel (on page 26).  
2.  
3.  
Power down the server (on page 25).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Access the product rear panel.  
4.  
5.  
6.  
If removing a DC power supply, first remove the grounding wire.  
Remove the power supply.  
WARNING: To reduce the risk of personal injury from hot surfaces, allow the power supply or  
power supply blank to cool before touching it.  
To replace the component, reverse the removal procedure.  
Power supply backplane  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all bays are populated with either a component or a blank.  
To remove the component:  
Do one of the following:  
1.  
o
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 26).  
For rack models, if installed, remove the security bezel (on page 26).  
Removal and replacement procedures 40  
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2.  
3.  
Power down the server (on page 25).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Do one of the following:  
4.  
o
o
For tower models, place the server on a flat, level surface with the access panel facing up.  
For rack models, extend the server from the rack (on page 27).  
5.  
6.  
Access the product rear panel.  
Remove all power supply modules from the power supply cage ("Power supply module" on page 40).  
WARNING: To reduce the risk of personal injury from hot surfaces, allow the power supply or  
power supply blank to cool before touching it.  
7.  
Remove the screws, and slide the power supply cage out of the server:  
o
Two-bay power supply configuration  
Removal and replacement procedures 41  
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o
Four-bay power supply configuration  
8.  
Loosen the two thumbscrews, and remove the power supply backplane from the cage:  
Two-bay power supply backplane board  
o
Removal and replacement procedures 42  
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o
Four-bay power supply backplane board  
To replace the component, reverse the removal procedure.  
Expansion board  
1.  
Do one of the following:  
o
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 26).  
For rack models, if installed, remove the security bezel (on page 26).  
2.  
3.  
Power down the server (on page 25).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Do one of the following:  
4.  
o
o
For tower models, place the server on a flat, level surface with the access panel facing up.  
For rack models, extend the server from the rack (on page 27).  
5.  
6.  
Remove the access panel ("Access panel" on page 28).  
Remove the air baffle ("Air baffle" on page 29).  
Removal and replacement procedures 43  
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7.  
Open the PCI retainer latch.  
8.  
Remove the expansion board.  
NOTE: If removing an expansion board from slots 3, 6 or 8, first release the retaining lever on  
the system board and then remove the card from the system.  
To replace the component, reverse the removal procedure.  
Graphic card adapter  
To remove the component:  
1.  
Do one of the following:  
o
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 26).  
For rack models, if installed, remove the security bezel (on page 26).  
Removal and replacement procedures 44  
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2.  
3.  
Power down the server (on page 25).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Do one of the following:  
4.  
o
o
For tower models, place the server on a flat, level surface with the access panel facing up.  
For rack models, extend the server from the rack (on page 27).  
5.  
6.  
7.  
Remove the access panel ("Access panel" on page 28).  
Remove the air baffle ("Air baffle" on page 29).  
Loosen the screws, and then remove the graphic card bracket.  
8.  
Open the PCI retainer latch.  
Removal and replacement procedures 45  
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9.  
Disconnect the cables from the graphic card.  
10. Remove the graphic card.  
To replace the component, reverse the removal procedure.  
Cache module  
CAUTION: In systems that use external data storage, be sure that the server is the first unit to be  
powered down and the last to be powered back up. Taking this precaution ensures that the system  
does not erroneously mark the drives as failed when the server is powered up.  
To remove the component:  
Do one of the following:  
1.  
o
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 26).  
For rack models, if installed, remove the security bezel (on page 26).  
Removal and replacement procedures 46  
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2.  
3.  
Power down the server (on page 25).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Do one of the following:  
4.  
o
o
For tower models, place the server on a flat, level surface with the access panel facing up.  
For rack models, extend the server from the rack (on page 27).  
5.  
6.  
7.  
Remove the access panel ("Access panel" on page 28).  
Remove the air baffle ("Air baffle" on page 29).  
Disconnect the capacitor pack cable from the cache module.  
8.  
Remove the cache module.  
To replace the component, reverse the removal procedure.  
FBWC capacitor pack  
Removal and replacement procedures 47  
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CAUTION: To prevent a server malfunction or damage to the equipment, do not add or remove  
the battery pack while an array capacity expansion, RAID level migration, or stripe size migration  
is in progress.  
CAUTION: After the server is powered down, wait for 30 seconds and then check the amber LED  
before disconnecting the cable from the cache module. If the amber LED flashes after 30 seconds,  
do not disconnect the cable from the cache module. The cache module is backing up data, and  
data will be lost if the cable is disconnected while the amber LED is still flashing.  
To remove the component:  
1.  
Do one of the following:  
o
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 26).  
For rack models, if installed, remove the security bezel (on page 26).  
2.  
3.  
Power down the server (on page 25).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Do one of the following:  
4.  
o
o
For tower models, place the server on a flat, level surface with the access panel facing up.  
For rack models, extend the server from the rack (on page 27).  
5.  
6.  
7.  
8.  
Remove the access panel ("Access panel" on page 28).  
Remove the air baffle ("Air baffle" on page 29).  
Remove the fan cage ("Fan cage" on page 32).  
Disconnect the cable from the cache module only if the capacitor pack is not being used to recover data  
from the server or transfer data to another server.  
9.  
Remove the capacitor pack.  
To replace the component, reverse the removal procedure.  
Removal and replacement procedures 48  
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SFF drive backplane  
To remove the component:  
1.  
Do one of the following:  
o
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 26).  
For rack models, if installed, remove the security bezel (on page 26).  
2.  
3.  
Power down the server (on page 25).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
For tower models, do the following:  
4.  
5.  
a. Place the server on a flat, level surface with the access panel facing up.  
b. Remove the access panel ("Access panel" on page 28).  
For rack models, do the following:  
a. Extend the server from the rack (on page 27).  
b. Remove the access panel ("Access panel" on page 28).  
c. Release thumbscrews and remove the rack bezel.  
Disconnect all cables from the drive backplane.  
Using a T-15 screwdriver, remove the screws that secure the SFF drive cage to the server.  
6.  
7.  
Removal and replacement procedures 49  
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8.  
Remove the SFF drive cage.  
9.  
Remove all drives from the drive cage ("Drive" on page 35).  
10. Loosen the thumbscrew on the drive backplane and remove it from the cage.  
To replace the component, reverse the removal procedure.  
LFF drive backplane  
To remove the component:  
1.  
Do one of the following:  
o
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 26).  
For rack models, if installed, remove the security bezel (on page 26).  
2.  
3.  
Power down the server (on page 25).  
Remove all power:  
Removal and replacement procedures 50  
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a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
4.  
5.  
For tower models, do the following:  
a. Place the server on a flat, level surface with the access panel facing up.  
b. Remove the access panel ("Access panel" on page 28).  
For rack models, do the following:  
a. Extend the server from the rack (on page 27).  
b. Remove the access panel ("Access panel" on page 28).  
c. Release thumbscrews and remove the rack bezel.  
Disconnect all cables from the drive backplane.  
6.  
7.  
Using a T-15 screwdriver, remove the screws that secure the LFF drive cage to the server.  
8.  
Remove the LFF drive cage.  
Removal and replacement procedures 51  
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9.  
Remove all drives from the drive cage ("Drive" on page 35).  
10. Loosen the thumbscrew on the drive backplane and remove it from the cage.  
To replace the component, reverse the removal procedure.  
Systems Insight Display assembly  
CAUTION: When routing cables, always be sure that the cables are not in a position where they  
can be pinched or crimped.  
To remove the component:  
1.  
Do one of the following:  
o
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 26).  
For rack models, if installed, remove the security bezel (on page 26).  
2.  
3.  
Power down the server (on page 25).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
For tower models, do the following:  
4.  
5.  
a. Place the server on a flat, level surface with the access panel facing up.  
b. Remove the access panel ("Access panel" on page 28).  
For rack models, do the following:  
a. Extend the server from the rack (on page 27).  
b. Remove the access panel ("Access panel" on page 28).  
c. Release thumbscrews and remove the rack bezel.  
Disconnect the cable that connects the Systems Insight Display assembly to the system board.  
Remove the thumbscrews securing the Systems Insight Display assembly.  
6.  
7.  
Removal and replacement procedures 52  
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8.  
Remove the Systems Insight Display assembly.  
To replace the component, reverse the removal procedure.  
Heatsink  
To remove the component:  
1.  
Do one of the following:  
o
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 26).  
For rack models, if installed, remove the security bezel (on page 26).  
2.  
3.  
Power down the server (on page 25).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Do one of the following:  
4.  
o
o
For tower models, place the server on a flat, level surface with the access panel facing up.  
For rack models, extend the server from the rack (on page 27).  
5.  
6.  
Remove the access panel ("Access panel" on page 28).  
Remove the air baffle ("Air baffle" on page 29).  
Removal and replacement procedures 53  
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7.  
Open the heatsink retaining levers.  
8.  
Remove the heatsink.  
To replace the heatsink:  
1.  
Use the alcohol swab to remove all the existing thermal grease from the processor. Allow the alcohol to  
evaporate before continuing.  
Removal and replacement procedures 54  
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2.  
Remove the heatsink protective cover.  
3.  
Install the heatsink, and then close the heatsink retaining levers.  
4.  
5.  
6.  
Install the air baffle.  
Install the access panel.  
Do one of the following:  
o
o
For tower models, return the server to an upright position, and then install the bezel.  
For rack models, slide the server back into the rack.  
7.  
8.  
9.  
Connect each power cord to the server.  
Connect each power cord to the power source.  
Press the Power On/Standby button.  
The server exits standby mode and applies full power to the system. The system power LED changes  
from amber to green.  
Removal and replacement procedures 55  
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Processor  
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the  
internal system components to cool before touching them.  
CAUTION: To prevent possible server malfunction and damage to the equipment, multiprocessor  
configurations must contain processors with the same part number.  
CAUTION: The heatsink thermal interface media is not reusable and must be replaced if the  
heatsink is removed from the processor after it has been installed.  
CAUTION: To prevent possible server overheating, always populate processor socket 2 with a  
processor and a heatsink or a processor socket cover and a heatsink blank.  
IMPORTANT: Processor socket 1 must be populated at all times or the server does not function.  
To remove the component:  
1.  
Do one of the following:  
o
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 26).  
For rack models, if installed, remove the security bezel (on page 26).  
2.  
3.  
Power down the server (on page 25).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Do one of the following:  
4.  
o
o
For tower models, place the server on a flat, level surface with the access panel facing up.  
For rack models, extend the server from the rack (on page 27).  
5.  
6.  
Remove the access panel ("Access panel" on page 28).  
Remove the air baffle ("Air baffle" on page 29).  
Removal and replacement procedures 56  
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7.  
Open the heatsink retaining levers.  
8.  
Remove the heatsink.  
Removal and replacement procedures 57  
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9.  
Open each of the processor locking levers in the order indicated, and then open the processor retaining  
bracket.  
10. Remove the processor from the processor retaining bracket.  
CAUTION: To avoid damage to the processor, do not touch the bottom of the processor,  
especially the contact area.  
Removal and replacement procedures 58  
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To install a processor:  
1.  
Install the processor. Verify that the processor is fully seated in the processor retaining bracket by  
visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE  
SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.  
CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To  
avoid damage to the system board, do not touch the processor or the processor socket contacts.  
2.  
Close the processor retaining bracket. When the processor is installed properly inside the processor  
retaining bracket, the processor retaining bracket clears the flange on the front of the socket.  
CAUTION: Do not press down on the processor. Pressing down on the processor may cause  
damage to the processor socket and the system board. Press only in the area indicated on the  
processor retaining bracket.  
Removal and replacement procedures 59  
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3.  
Press and hold the processor retaining bracket in place, and then close each processor locking lever.  
Press only in the area indicated on the processor retaining bracket.  
4.  
5.  
Use the alcohol swab to remove all the existing thermal grease from the heatsink. Allow the alcohol to  
evaporate before continuing.  
Apply the thermal grease to the top of the processor in the following pattern.  
Removal and replacement procedures 60  
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6.  
Install the heatsink, and then close the heatsink retaining levers.  
7.  
8.  
9.  
Install the air baffle.  
Install the access panel.  
Do one of the following:  
o
o
For tower models, return the server to an upright position.  
For rack models, slide the server back into the rack.  
10. Connect each power cord to the server.  
11. Connect each power cord to the power source.  
12. Press the Power On/Standby button.  
The server exits standby mode and applies full power to the system. The system power LED changes  
from amber to green.  
13. Do one of the following:  
o
o
For tower models, install the bezel.  
For rack models, if removed, install the security bezel.  
DIMMs  
CAUTION: To avoid damage to the hard drives, memory, and other system components, the air  
baffle, drive blanks, and access panel must be installed when the server is powered up.  
To remove the component:  
1.  
Do one of the following:  
o
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 26).  
For rack models, if installed, remove the security bezel (on page 26).  
2.  
3.  
Power down the server (on page 25).  
Remove all power:  
a. Disconnect each power cord from the power source.  
Removal and replacement procedures 61  
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b. Disconnect each power cord from the server.  
4.  
Do one of the following:  
o
o
For tower models, place the server on a flat, level surface with the access panel facing up.  
For rack models, extend the server from the rack (on page 27).  
5.  
6.  
7.  
8.  
Remove the access panel ("Access panel" on page 28).  
Remove the air baffle ("Air baffle" on page 29).  
Open the DIMM slot latches..  
Remove the DIMM.  
To replace the component, reverse the removal procedure.  
System board  
IMPORTANT: If replacing the system board or clearing NVRAM, you must re-enter the server  
serial number through RBSU.  
To remove the component:  
1.  
Do one of the following:  
o
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 26).  
For rack models, if installed, remove the security bezel (on page 26).  
2.  
3.  
Power down the server (on page 25).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Do one of the following:  
4.  
5.  
o
o
For tower models, place the server on a flat, level surface with the access panel facing up.  
For rack models, extend the server from the rack (on page 27).  
Remove the access panel ("Access panel" on page 28).  
Removal and replacement procedures 62  
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6.  
7.  
8.  
9.  
Remove the air baffle ("Air baffle" on page 29).  
Remove the fan cage ("Fan cage" on page 32).  
Remove all DIMMs ("DIMMs" on page 61).  
Remove any installed PCI cards.  
10. Remove the PCI card support bracket on both sides.  
11. Disconnect all cables connected to the system board.  
12. Open the heatsink retaining levers.  
Removal and replacement procedures 63  
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13. Remove the heatsink.  
14. Open each of the processor locking levers in the order indicated, and then open the processor retaining  
bracket.  
Removal and replacement procedures 64  
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15. Remove the processor from the processor retaining bracket.  
CAUTION: To avoid damage to the processor, do not touch the bottom of the processor,  
especially the contact area.  
CAUTION: To avoid damage to the system board:  
Do not touch the processor socket contacts.  
Always install the processor socket cover after removing the processor from the socket.  
Do not tilt or slide the processor when lowering the processor into the socket.  
CAUTION: Removal of the processor or heatsink renders the thermal layer between the  
processor and heatsink useless. Clean the component with the provided alcohol swab, then add  
thermal grease.  
16. Loosen the four system board thumbscrews.  
17. Using the system board tray handles, slide the tray forward, and then remove the failed system board.  
Removal and replacement procedures 65  
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To replace the system board:  
1.  
Install the spare system board.  
2.  
Open each of the processor locking levers in the order indicated, and then open the processor retaining  
bracket.  
Removal and replacement procedures 66  
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3.  
Remove the clear processor socket cover. Retain the processor socket cover for future use.  
4.  
Install the processor. Verify that the processor is fully seated in the processor retaining bracket by  
visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE  
SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.  
CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To  
avoid damage to the system board, do not touch the processor or the processor socket contacts.  
5.  
Close the processor retaining bracket. When the processor is installed properly inside the processor  
retaining bracket, the processor retaining bracket clears the flange on the front of the socket.  
Removal and replacement procedures 67  
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CAUTION: Do not press down on the processor. Pressing down on the processor may cause  
damage to the processor socket and the system board. Press only in the area indicated on the  
processor retaining bracket.  
6.  
Press and hold the processor retaining bracket in place, and then close each processor locking lever.  
Press only in the area indicated on the processor retaining bracket.  
7.  
8.  
Install the processor socket cover onto the processor socket of the failed system board.  
Clean the old thermal grease from the heatsink and the top of the processor with the alcohol swab.  
Allow the alcohol to evaporate before continuing.  
9.  
Apply all the grease to the top of the processor in the following pattern to ensure even distribution.  
Removal and replacement procedures 68  
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10. Install the heatsink, and then close the heatsink retaining levers.  
11. Install the processor socket cover onto the processor socket of the failed system board.  
IMPORTANT: Install all components with the same configuration that was used on the failed  
system board.  
12. Install all components removed from the failed system board.  
13. Install the access panel.  
14. Do one of the following:  
o
o
For tower models, return the server to an upright position.  
For rack models, slide the server back into the rack.  
15. Connect each power cord to the server.  
16. Connect each power cord to the power source.  
17. Press the Power On/Standby button.  
The server exits standby mode and applies full power to the system. The system power LED changes  
from amber to green.  
18. Do one of the following:  
o
o
For tower models, install the bezel.  
For rack models, if removed, install the security bezel.  
After you replace the system board, you must re-enter the server serial number and the product ID.  
1.  
2.  
3.  
4.  
During the server startup sequence, press the F9 key to access RBSU.  
Select the Advanced Options menu.  
Select Service Options.  
Select Serial Number. The following warnings appear:  
WARNING! WARNING! WARNING! The serial number is loaded into the system during  
the manufacturing process and should NOT be modified. This option should only  
be used by qualified service personnel. This value should always match the  
serial number sticker located on the chassis.  
Removal and replacement procedures 69  
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Warning: The serial number should ONLY be modified by qualified personnel.  
This value should always match the serial number located on the chassis.  
5.  
6.  
7.  
Press the Enter key to clear the warning.  
Enter the serial number and press the Enter key.  
Select Product ID. The following warning appears:  
Warning: The Product ID should ONLY be modified by qualified personnel. This  
value should always match the Product ID on the chassis.  
8.  
9.  
Enter the product ID and press the Enter key.  
Press the Esc key to close the menu.  
10. Press the Esc key to exit RBSU.  
11. Press the F10 key to confirm exiting RBSU. The server automatically reboots.  
System battery  
If the server no longer automatically displays the correct date and time, you might have to replace the battery  
that provides power to the real-time clock. Under normal use, battery life is 5 to 10 years.  
WARNING: The computer contains an internal lithium manganese dioxide, a vanadium  
pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not  
properly handled. To reduce the risk of personal injury:  
Do not attempt to recharge the battery.  
Do not expose the battery to temperatures higher than 60°C (140°F).  
Do not disassemble, crush, puncture, short external contacts, or dispose of in fire or water.  
Replace only with the spare designated for this product.  
To remove the component:  
1.  
Do one of the following:  
o
o
For tower models, open and remove the bezel ("Remove the tower bezel" on page 26).  
For rack models, if installed, remove the security bezel (on page 26).  
2.  
3.  
Power down the server (on page 25).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
For tower models, do the following:  
4.  
5.  
a. Place the server on a flat, level surface with the access panel facing up.  
b. Remove the access panel ("Access panel" on page 28).  
For rack models, do the following:  
a. Extend the server from the rack (on page 27).  
b. Remove the access panel ("Access panel" on page 28).  
c. Release thumbscrews and remove the rack bezel.  
Remove the air baffle ("Air baffle" on page 29).  
6.  
Removal and replacement procedures 70  
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7.  
Remove the battery.  
IMPORTANT: Replacing the system board battery resets the system ROM to its default  
configuration. After replacing the battery, reconfigure the system through RBSU.  
For more information about battery replacement or proper disposal, contact an authorized reseller or an  
authorized service provider.  
HP Trusted Platform Module  
The TPM is not a customer-removable part.  
CAUTION: Any attempt to remove an installed TPM from the system board breaks or disfigures  
the TPM security rivet. Upon locating a broken or disfigured rivet on an installed TPM,  
administrators should consider the system compromised and take appropriate measures to ensure  
the integrity of the system data.  
If you suspect a TPM board failure, leave the TPM installed and remove the system board. Contact an HP  
authorized service provider for a replacement system board and TPM board.  
Removal and replacement procedures 71  
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Troubleshooting  
Troubleshooting resources  
The HP ProLiant Gen8 Troubleshooting Guide, Volume I: Troubleshooting provides procedures for resolving  
common problems and comprehensive courses of action for fault isolation and identification, issue resolution,  
and software maintenance on ProLiant servers and server blades. To view the guide, select a language:  
The HP ProLiant Gen8 Troubleshooting Guide, Volume II: Error Messages provides a list of error messages  
and information to assist with interpreting and resolving error messages on ProLiant servers and server  
blades. To view the guide, select a language:  
Troubleshooting 72  
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Diagnostic tools  
HP Insight Diagnostics  
HP Insight Diagnostics is a proactive server management tool, available in both offline and online versions,  
that provides diagnostics and troubleshooting capabilities to assist IT administrators who verify server  
installations, troubleshoot problems, and perform repair validation.  
HP Insight Diagnostics Offline Edition performs various in-depth system and component testing while the OS  
is not running. To run this utility, launch the SmartStart CD.  
HP Insight Diagnostics Online Edition is a web-based application that captures system configuration and  
other related data needed for effective server management. Available in Microsoft® Windows® and Linux  
versions, the utility helps to ensure proper system operation.  
For more information or to download the utility, refer to the HP website (http://www.hp.com/servers/diags).  
HP Insight Diagnostics survey functionality  
HP Insight Diagnostics (on page 73) provides survey functionality that gathers critical hardware and software  
information on ProLiant servers.  
This functionality supports operating systems that may not be supported by the server. For operating systems  
supported by the server, see the HP website (http://www.hp.com/go/supportos).  
If a significant change occurs between data-gathering intervals, the survey function marks the previous  
information and overwrites the survey data files to reflect the latest changes in the configuration.  
Survey functionality is installed with every SmartStart-assisted HP Insight Diagnostics installation, or it can be  
installed through the HP PSP.  
NOTE: The current version of SmartStart provides the memory spare part numbers for the server.  
To download the latest version, see the HP website (http://www.hp.com/support).  
Integrated Management Log  
The IML records hundreds of events and stores them in an easy-to-view form. The IML timestamps each event  
with 1-minute granularity.  
You can view recorded events in the IML in several ways, including the following:  
From within HP SIM  
From within Survey Utility  
From within operating system-specific IML viewers  
o
o
o
For NetWare: IML Viewer (does not apply to HP ProLiant DL980 Servers)  
For Windows®: IML Viewer  
For Linux: IML Viewer Application  
Diagnostic tools 73  
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From within the iLO 4 user interface  
From within HP Insight Diagnostics (on page 73)  
For more information, see the Management CD or DVD in the HP Insight Foundation suite for ProLiant.  
HP Insight Remote Support software  
HP strongly recommends that you install HP Insight Remote Support software to complete the installation or  
upgrade of your product and to enable enhanced delivery of your HP Warranty, HP Care Pack Service, or  
HP contractual support agreement. HP Insight Remote Support supplements your monitoring 24 x 7 to ensure  
maximum system availability by providing intelligent event diagnosis, and automatic, secure submission of  
hardware event notifications to HP, which will initiate a fast and accurate resolution, based on your product’s  
service level. Notifications may be sent to your authorized HP Channel Partner for on-site service, if  
configured and available in your country. The software is available in two variants:  
HP Insight Remote Support Standard: This software supports server and storage devices and is  
optimized for environments with 1–50 servers. Ideal for customers who can benefit from proactive  
notification but do not need proactive service delivery and integration with a management platform.  
HP Insight Remote Support Advanced: This software provides comprehensive remote monitoring and  
proactive service support for nearly all HP servers, storage, network, and SAN environments, plus  
selected non-HP servers that have a support obligation with HP. It is integrated with HP Systems Insight  
Manager. A dedicated server is recommended to host both HP Systems Insight Manager and HP Insight  
Remote Support Advanced.  
Details for both versions are available on the HP website (http://www.hp.com/go/insightremotesupport).  
To download the software, go to Software Depot (http://www.software.hp.com).  
Select Insight Remote Support from the menu on the right.  
USB support  
HP provides both standard USB 2.0 support and legacy USB 2.0 support. Standard support is provided by  
the OS through the appropriate USB device drivers. Before the OS loads, HP provides support for USB  
devices through legacy USB support, which is enabled by default in the system ROM.  
Legacy USB support provides USB functionality in environments where USB support is not available normally.  
Specifically, HP provides legacy USB functionality for the following:  
POST  
RBSU  
Diagnostics  
DOS  
Operating environments which do not provide native USB support  
Diagnostic tools 74  
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Component identification  
Front panel components  
SFF  
Item  
Description  
Media/Drive cage bay  
SAS/SATA drives (8)  
1
2
3
4
Serial number/iLO information pull tab*  
Optical drive  
USB connectors (4)  
5
*The serial number/iLO information pull tab is double-sided. The top side shows the server serial number, and the reverse  
side shows the default iLO account information. The same information is printed on a label attached to the chassis.  
Component identification 75  
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LFF  
Item  
Description  
Media/Drive cage bay  
SAS/SATA drive (6)  
1
2
3
Serial number/iLO information pull tab*  
Optical drive  
4
5
USB connectors (4)  
*The serial number/iLO information pull tab is double-sided. The top side shows the server serial number, and the reverse  
side shows the default iLO account information. The same information is printed on a label attached to the chassis.  
Front panel LEDs and buttons  
Component identification 76  
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Item  
Description  
Status  
Power On/Standby button  
and system power LED  
Solid green = System on  
Flashing green (1 Hz/cycle per sec) = Performing power on sequence  
Solid amber = System in standby  
1
Off = No power present*  
NIC status LED  
Health LED  
Solid green = Link to network  
Flashing green (1 Hz/cycle per sec) = Network active  
Off = No network activity  
2
3
Solid green = Normal  
Flashing amber = System degraded  
Flashing red (1 Hz/cycle per sec) = System critical  
Fast-flashing red (4 Hz/cycles per sec) = Power fault**  
UID button/LED  
Solid blue = Activated  
4
Flashing blue (1 Hz/cycle per sec) = Remote management or  
firmware upgrade in progress  
Off = Deactivated  
*Facility power is not present, power cord is not attached, no power supplies are installed, power supply failure has  
occurred, or the power button cable is disconnected.  
**To identify components in a degraded or critical state, see the Systems Insight Display LEDs ("Systems Insight Display  
assembly" on page 52), check iLO/BIOS logs, and reference the server troubleshooting guide.  
Systems Insight Display LEDs  
The HP Systems Insight Display LEDs represent the system board layout.  
Item  
Description  
Status  
Power cap  
To determine Power cap status, see  
"Systems Insight Display LED combinations  
(on page 78)."  
1
AMP Status  
Green = AMP mode enabled  
Amber = Failover  
2
Off = AMP mode disabled  
Component identification 77  
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Item  
Description  
Status  
DIMM LEDs  
Amber = DIMM error  
Off = Normal  
3
All other LEDs  
Amber = Failure  
Off = Normal  
IMPORTANT: If more than one DIMM slot LED is illuminated, further troubleshooting is required.  
Test each bank of DIMMs by removing all other DIMMs. Isolate the failed DIMM by replacing  
each DIMM in a bank with a known working DIMM.  
Systems Insight Display LED combinations  
When the health LED on the front panel illuminates either amber or red, the server is experiencing a health  
event. Combinations of illuminated Systems Insight Display LEDs, the system power LED, and the health LED  
indicate system status.  
Systems Insight Display Health LED  
LED and color  
System power  
LED  
Status  
Red  
Amber  
One or more of the following conditions  
might exist:  
Processor (amber)  
Processor in socket X has failed.  
Processor X is not installed in the socket.  
Processor X is unsupported.  
ROM detects a failed processor during  
POST  
Amber  
Green  
Processor in socket X is in a pre-failure  
condition.  
Processor (amber)  
Red  
Green  
Green  
Green  
One or more DIMMs have failed.  
DIMM (amber)  
Amber  
Amber  
DIMM in slot X is in a pre-failure condition.  
DIMM (amber)  
The Health Driver has detected a cautionary  
temperature level.  
Overtemperature (amber)  
Red  
Amber  
Green  
Green  
Amber  
The server has detected a hardware critical  
temperature level.  
Overtemperature (amber)  
Fan (amber)  
Amber  
Red  
Fan has failed or is missing, but still meets the  
minimum fan requirements.  
Fan has failed or is missing and no longer  
meets the minimum fan requirements.  
Fan (amber)  
Red  
Power supply (amber)  
Only one power supply installed and in  
standby mode.  
Power supply fault  
System board fault  
Amber  
Green  
Amber  
Power supply (amber)  
Redundant power supply is installed and  
only one power supply is functional.  
AC power cord is not plugged into  
redundant power supply.  
Redundant power supply fault  
Power supply mismatch at POST or  
through hot-plug addition.  
Standby  
Power cap (off)  
Component identification 78  
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Systems Insight Display Health LED  
LED and color  
System power  
LED  
Status  
Flashing green  
Amber  
Waiting for power  
Power cap (green)  
Power cap has been exceeded  
Power cap (flashing  
amber)  
Green  
Power is available  
Power cap (green)  
IMPORTANT: If more than one DIMM slot LED is illuminated, further troubleshooting is required.  
Test each bank of DIMMs by removing all other DIMMs. Isolate the failed DIMM by replacing  
each DIMM in a bank with a known working DIMM.  
Rear panel components  
Item  
Description  
Power supply 4  
Power supply 3  
Power supply 2  
Power supply 1  
PCIe slot 1 (Processor 1)  
1
2
3
4
5
PCIe slot 2 (Processor 1)  
PCIe slot 3 (Processor 1)  
PCIe slot 4 (Processor 1)  
UID button/LED  
6
7
8
9
Kensington security lock  
Serial connector  
10  
11  
12  
13  
14  
15  
iLO connector  
NIC connector 3  
NIC connector 4  
NIC connector 2  
Component identification 79  
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Item  
Description  
NIC connector 1  
16  
17  
18  
19  
20  
21  
22  
23  
USB connectors (4)  
Video connector  
PCIe slot 5 (Processor 2)  
PCIe slot 6 (Processor 2)  
PCIe slot 7 (Processor 2)  
PCIe slot 8 (Processor 2)  
PCIe slot 9 (Processor 2)  
Rear panel LEDs  
Item  
Description  
Status  
NIC activity LED  
Green = Linked to network  
Off = No network connection  
1
NIC link LED  
Green or flashing green = Network activity  
Off = No network activity  
2
3
Power supply LED  
Green = Normal  
Off = One or more of the following conditions exists:  
Power is unavailable.  
Power supply failed.  
Power supply is in standby mode.  
Power supply exceeded current limit.  
UID LED  
Blue = Activated  
Flashing blue = System is being managed remotely  
Off = Deactivated  
4
iLO 4 link LED  
Green or flashing green = Network activity  
Off = No network activity  
5
6
iLO 4 activity LED  
Green = Linked to network  
Off = No network connection  
Component identification 80  
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System board components  
Item  
Description  
Slot 1 PCIe3 x16 (8, 4, 1)  
Slot 2 PCIe3 x8 (4, 1)  
Slot 3 PCIe3 x16 (16, 8, 4, 1)  
Slot 4 PCIe3 x8 (4, 1)  
Processor 1 DIMM slots  
Smart Array P420i memory cache module  
Mini-SAS connectors (2)  
Processor 2 DIMM slots  
Processor socket 2  
1
2
3
4
5
6
7
8
9
SD card slot  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
Front panel connectors (2)  
Fan cage connector  
Internal USB tape connector  
Discovery service cable connector  
System battery  
SATA connectors  
Internal USB connector  
Processor 2 DIMM slots  
TPM connector  
NMI header  
Slot 9 PCIe3 x8 (4, 1)  
21  
Slot 8 PCIe3 x16 ( 16, 8, 4, 1)  
Slot 7 PCIe3 x8 (4, 1)  
22  
23  
24  
25  
26  
Slot 6 PCIe3 x16 (16, 8, 4, 1)  
Slot 5 PCIe2 x8 (4, 1)  
Processor 1 DIMM slots  
Component identification 81  
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Item  
Description  
Processor socket 1 (populated)  
27  
System maintenance switch  
Position  
Default  
Function  
Off  
Off = iLO 4 security is enabled.  
On = iLO 4 security is disabled.  
S1  
Off  
Off = System configuration can be  
changed.  
S2  
On = System configuration is locked.  
Off  
Off  
Off  
Reserved  
Reserved  
S3  
S4  
S5  
Off = Power-on password is enabled.  
On = Power-on password is disabled.  
Off  
Off = No function  
On = ROM reads system configuration  
as invalid.  
S6  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
S7  
S8  
S9  
S10  
S11  
S12  
To access redundant ROM, set S1, S5, and S6 to on.  
When the system maintenance switch position 6 is set to the On position, the system is prepared to erase all  
system configuration settings from both CMOS and NVRAM.  
CAUTION: Clearing CMOS and/or NVRAM deletes configuration information. Be sure to  
properly configure the server or data loss could occur.  
NMI functionality  
An NMI crash dump creates a crash dump log before resetting a system which is not responding.  
Crash dump log analysis is an essential part of diagnosing reliability problems, such as failures of operating  
systems, device drivers, and applications. Many crashes freeze a system, and the only available action for  
administrators is to restart the system. Resetting the system erases any information which could support  
problem analysis, but the NMI feature preserves that information by performing a memory dump before a  
system reset.  
To force the system to invoke the NMI handler and generate a crash dump log, do one of the following:  
Use the iLO Virtual NMI feature  
Short the NMI header ("System board components" on page 81)  
For more information, see the HP website  
Component identification 82  
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SAS and SATA device numbers  
With optional drive cages installed, the server supports up to 24 SFF drives or up to 18 LFF drives. The server  
does not support mixing SFF and LFF drives.  
HP recommends that you populate drive bays starting with the lowest SAS or SATA device number. Drives  
are numbered from left to right in each component box. Component boxes are numbered 1 through 3, from  
bottom to top.  
SFF drives  
LFF drives  
Component identification 83  
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Drive LED definitions  
Item LED  
Status  
Definition  
Locate  
Solid blue  
Flashing blue  
The drive is being identified by a host application.  
The drive carrier firmware is being updated or requires an update.  
1
2
3
Activity ring  
Rotating green  
Off  
Drive activity  
No drive activity  
Do not remove  
Solid white  
Do not remove the drive. Removing the drive causes one or more of  
the logical drives to fail.  
Off  
Removing the drive does not cause a logical drive to fail.  
Drive status  
Solid green  
The drive is a member of one or more logical drives.  
4
Flashing green  
The drive is rebuilding or performing a RAID migration, stripe size  
migration, capacity expansion, or logical drive extension, or is  
erasing.  
Flashing  
amber/green  
The drive is a member of one or more logical drives and predicts  
the drive will fail.  
Flashing amber The drive is not configured and predicts the drive will fail.  
Solid amber  
Off  
The drive has failed.  
The drive is not configured by a RAID controller.  
Fans  
IMPORTANT: Fan louvers must be present for the redundant configuration. Without the louvers,  
all four fans are nonredundant.  
Component identification 84  
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Item  
Description  
Configuration  
Fan 1  
Redundant (primary fan  
when processor 2 is  
installed)  
1
Fan 2  
Fan 3  
Fan 4  
Primary  
Primary  
Primary  
2
3
4
FBWC module LEDs (P222, P420, P420i, P421,  
P822)  
The FBWC module has three single-color LEDs (one amber and two green). The LEDs on the cache module  
installed on a storage controller are duplicated on the reverse side of the module to facilitate status viewing.  
1 - Amber  
2 - Green  
3 - Green  
Interpretation  
Off  
Off  
The cache module is not powered.  
Off  
Component identification 85  
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1 - Amber  
2 - Green  
3 - Green  
Interpretation  
Flashing 0.5 Hz Flashing 0.5 Hz The cache microcontroller is executing from within its  
boot loader and receiving new flash code from the host  
controller.  
Off  
Flashing 1 Hz  
Flashing 1 Hz  
Flashing 1 Hz  
On  
The cache module is powering up, and the capacitor  
pack is charging.  
Off  
Off  
Off  
Off  
Off  
Off  
On  
The cache module is idle, and the capacitor pack is  
charging.  
The cache module is idle, and the capacitor pack is  
charged.  
On  
The cache module is idle, the capacitor pack is charged,  
and the cache contains data that has not yet been  
written to the drives.  
Flashing 1 Hz  
On  
Off  
Off  
Off  
On  
A backup is in progress.  
Off  
The current backup is complete with no errors.  
The current backup failed, and data has been lost.  
Off  
Flashing 1 Hz  
Flashing 1 Hz  
Flashing 1 Hz  
Flashing 1 Hz  
A power error occurred during the previous or current  
boot. Data might be corrupt.  
On  
Off  
Off  
On  
An overtemperature condition exists.  
The capacitor pack is not attached.  
Flashing 1 Hz  
Flashing 2 Hz  
Flashing 2 Hz  
Flashing 2 Hz  
Flashing 2 Hz  
The capacitor has been charging for 10 minutes, but  
has not reached sufficient charge to perform a full  
backup.  
On  
On  
Off  
On  
The current backup is complete, but power fluctuations  
occurred during the backup.  
On  
On  
The cache module microcontroller has failed.  
RPS riser board connectors  
Item  
Connector  
Description  
J7  
Graphic card power connector  
1
Component identification 86  
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Item  
Connector  
Description  
J9  
Drive backplane bay 1/optical drive power connector  
2
J5  
J6  
J8  
Drive backplane bay 2 power connector  
Drive backplane bay 3 power connector  
Graphic card power connector  
3
4
5
Component identification 87  
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Cabling  
Server data cabling  
Item  
Description  
Optical drive connector  
Drive cage 1, SAS connector 2  
Drive cage 1, SAS connector 1  
SATA connector  
1
2
3
4
5
6
SAS connector  
SAS connector  
Cabling 88  
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Media device data cabling  
Item  
Description  
Optical drive connector  
Optical drive connector  
Optical drive connector  
SATA connector  
1
2
3
4
5
6
SATA connector  
SATA connector  
Optical drive cabling  
Cabling 89  
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Specifications  
Environmental specifications  
Specification  
Value  
Temperature range*  
Operating  
10°C to 35°C (50°F to 95°F)  
-30°C to 60°C (-22°F to 140°F)  
Nonoperating  
Relative humidity  
(noncondensing)  
10% to 90%  
5% to 95%  
Operating, maximum wet bulb  
temperature of 28°C (82.4°F)  
Nonoperating, maximum wet  
bulb temperature of 38.7°C  
(101.7°F)  
* All temperature ratings shown are for sea level. An altitude derating of 1°C per 304.8 m (1.8°F per 1,000 ft) to 3048  
m (10,000 ft) is applicable. No direct sunlight allowed.  
Server specifications  
Specification  
Value  
Dimensions  
Rack model  
Height  
21.8 cm (8.58 in)  
73.22 cm (28.83 in)  
48.26 cm (19.00 in)  
Depth  
Width  
Tower model  
Height  
46.2 cm (18.19 in)  
74.00 cm (29.13 in)  
21.8 cm (8.58 in)  
Depth  
Width  
Weight  
Rack model  
Maximum  
50.06 kg (110.36 lbs)  
27.63 kg (60.91 lbs)  
Minimum  
Tower model  
Maximum  
Minimum  
52.09 kg (144.84 lbs)  
31.09 kg (70.33 lbs)  
Power supply specifications  
Depending on installed options, the server is configured with one of the following power supplies:  
Specifications 90  
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HP 460 W Gold Power Supply (92% efficiency)  
HP 460 W Platinum Plus Power Supply (94% efficiency)  
HP 750 W Gold Power Supply (92% efficiency)  
HP 750 W Platinum Plus Power Supply (94% efficiency)  
HP 1200 W Platinum Plus Power Supply (94% efficiency)  
HP 460 W Gold Power Supply (92% efficiency)  
Specification  
Value  
Input requirements  
100 to 120 VAC, 200 to  
240 VAC  
Rated input voltage  
50 Hz to 60 Hz  
Rated input frequency  
Rated input current  
5.5 A at 100 VAC  
2.6 A at 200 VAC  
526 W at 100V AC input  
505 W at 200V AC input  
Rated input power  
Btus per hour  
1794 at 100V AC input  
1725 at 200V AC input  
Power supply output  
460 W at 100V to 120V AC input  
460 W at 200V to 240V AC input  
Rated steady-state power  
460 W at 100V to 120V AC input  
460 W at 200V to 240V AC input  
Maximum peak power  
HP 460 W Platinum Plus Power Supply (94% efficiency)  
Specification  
Value  
Input requirements  
100 to 120 VAC, 200 to  
240 VAC  
Rated input voltage  
50 Hz to 60 Hz  
Rated input frequency  
Rated input current  
5.2 A at 100 VAC  
2.5 A at 200 VAC  
509 W at 115V AC input  
495 W at 230V AC input  
Rated input power  
Btus per hour  
1764 at 100V AC input  
1736 at 115V AC input  
1694 at 200V AC input  
1687 at 230V AC input  
Power supply output  
460 W at 100V to 120V AC input  
460 W at 200V to 240V AC input  
Rated steady-state power  
460 W at 100V to 120V AC input  
460 W at 200V to 240V AC input  
Maximum peak power  
Specifications 91  
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HP 750 W Gold Power Supply (92% efficiency)  
Specification  
Value  
Input requirements  
100 to 120 VAC, 200 to  
240 VAC  
Rated input voltage  
50 Hz to 60 Hz  
Rated input frequency  
Rated input current  
8.9 A at 100 VAC  
4.3 A at 200 VAC  
857 W at 100V AC input  
824 W at 200V AC input  
Rated input power  
Btus per hour  
2925 at 100V AC input  
2812 at 200V AC input  
Power supply output  
750 W at 100V to 120V AC input  
750 W at 200V to 240V AC input  
Rated steady-state power  
750 W at 100V to 120V AC input  
750 W at 200V to 240V AC input  
Maximum peak power  
HP 750 W Platinum Plus Power Supply (94% efficiency)  
Specification  
Value  
Input requirements  
100 to 120 VAC, 200 to  
240 VAC  
Rated input voltage  
50 Hz to 60 Hz  
Rated input frequency  
Rated input current  
8.5 A at 100 VAC  
4.1 A at 200 VAC  
831 W at 115V AC input  
808 W at 230V AC input  
Rated input power  
Btus per hour  
2878 at 100V AC input  
2834 at 115V AC input  
2769 at 200V AC input  
2758 at 230V AC input  
Power supply output  
750 W at 100V to 120V AC input  
750 W at 200V to 240V AC input  
Rated steady-state power  
750 W at 100V to 120V AC input  
750 W at 200V to 240V AC input  
Maximum peak power  
HP 1200 W Platinum Plus Power Supply (94% efficiency)  
Specification  
Value  
Input requirements  
100 to 120 VAC, 200 to  
240 VAC  
Rated input voltage  
50 Hz to 60 Hz  
Rated input frequency  
Specifications 92  
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10 A at 100 VAC  
6.7 A at 200 VAC  
Rated input current  
Rated input power  
Btus per hour  
990 W at 115V AC input  
1315 W at 230V AC input  
3060 at 100V AC input  
3380 at 115V AC input  
4503 at 200V AC input  
4485 at 230V AC input  
Power supply output  
800 W at 100V AC input  
900 W at 120V AC input  
1200 W at 200V to 240V AC  
input  
Rated steady-state power  
800 W at 100V AC input  
900 W at 120V AC input  
1200 W at 200V to 240V AC  
input  
Maximum peak power  
Specifications 93  
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Acronyms and abbreviations  
AMP  
Advanced Memory Protection  
CS HE  
HP Common Slot High-Efficiency (power supply)  
CSR  
Customer Self Repair  
FBWC  
flash-backed write cache  
iLO  
Integrated Lights-Out  
IML  
Integrated Management Log  
LFF  
large form factor  
LRDIMM  
load reduced dual in-line memory module  
NMI  
nonmaskable interrupt  
NVRAM  
nonvolatile memory  
ORCA  
Option ROM Configuration for Arrays  
PCIe  
peripheral component interconnect express  
Acronyms and abbreviations 94  
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POST  
Power-On Self Test  
PSP  
HP ProLiant Support Pack  
RBSU  
ROM-Based Setup Utility  
RPS  
redundant power supply  
SAS  
serial attached SCSI  
SATA  
serial ATA  
SFF  
small form factor  
SID  
Systems Insight Display  
SIM  
Systems Insight Manager  
TPM  
Trusted Platform Module  
UID  
unit identification  
USB  
universal serial bus  
Acronyms and abbreviations 95  
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Documentation feedback  
HP is committed to providing documentation that meets your needs. To help us improve the documentation,  
send any errors, suggestions, or comments to Documentation Feedback (mailto:[email protected]).  
Include the document title and part number, version number, or the URL when submitting your feedback.  
Documentation feedback 96  
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Index  
front panel components 75  
front panel LEDs 76  
A
access panel 28  
air baffle 29  
G
graphics card option 44  
B
H
battery 70  
buttons 75  
hard drive blanks 35  
hard drive LEDs 84  
hard drives, determining status of 84  
heatsink 53  
HP iLO 75  
HP Insight Diagnostics 73  
HP Insight Diagnostics survey functionality 73  
HP Insight Remote Support software 74  
C
cables 88  
cabling 88, 89  
cache module 46  
components 15, 75  
connectors 75  
crash dump analysis 82  
I
identifying components 75  
IML (Integrated Management Log) 73  
Insight Diagnostics 73  
D
data cabling 88  
device bay blank 34  
device numbers 83  
diagnosing problems 72  
diagnostic tools 73  
diagnostics utility 73  
DIMMs 61  
L
LEDs, hard drive 84  
M
drive LEDs 84  
drives, removing 35  
media device data cabling 89  
N
E
NIC connectors 79  
electrostatic discharge 23  
error messages 72  
expansion board 43  
O
extending server from rack 27  
optical device 37  
optical drive cage 36  
F
P
fan cage 32  
FBWC capacitor pack 47  
features 75  
firmware upgrade utility, troubleshooting 72  
front I/O assembly 38  
PCI air baffle 29  
PCI expansion slots 81  
power LEDs, system 76  
power supply backplane 40  
power supply blank 39  
Index 97  
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power supply specifications 90, 91, 92  
powering down 25  
powering up 25  
problem diagnosis 72  
processors 56  
R
rack bezel 25, 26  
rear panel components 79  
rear panel LEDs 80  
S
safety considerations 23  
safety information 23  
SATA connectors 81  
security bezel 26  
server specifications 90  
specifications, server 90  
static electricity 23  
symbols on equipment 23  
system board battery 70  
system board components 81, 86  
system board replacement 62  
system components 18, 75  
system configuration settings 82  
system maintenance switch 82  
Systems Insight Display 52  
Systems Insight Display LEDs 77  
T
tower bezel, removing 26  
tower feet 33  
TPM (Trusted Platform Module) 71  
troubleshooting 72  
troubleshooting, firmware upgrade utility 72  
Trusted Platform Module (TPM) 71  
U
USB support 74  
utilities 73  
W
warnings 24  
Index 98  
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