CY8C24094, CY8C24794
CY8C24894, CY8C24994
®
PSoC Programmable System-on-Chip™
■ Full Speed USB (12 Mbps)
❐ Four Uni-Directional Endpoints
❐ One Bi-Directional Control Endpoint
❐ USB 2.0 Compliant
1. Features
■ XRES Pin to Support In-System Serial Programming (ISSP)
and External Reset Control in CY8C24894
❐ Dedicated 256 Byte Buffer
❐ No External Crystal Required
■ Powerful Harvard Architecture Processor
❐ M8C Processor Speeds to 24 MHz
❐ Two 8x8 Multiply, 32-Bit Accumulate
❐ Low Power at High Speed
❐ 3V to 5.25V Operating Voltage
❐ Industrial Temperature Range: -40°C to +85°C
❐ USB Temperature Range: -10°C to +85°C
■ Flexible On-Chip Memory
❐ 16K Flash Program Storage 50,000 Erase and Write Cycles
❐ 1K SRAM Data Storage
❐ In-System Serial Programming (ISSP)
❐ Partial Flash Updates
❐ Flexible Protection Modes
®
■ Advanced Peripherals (PSoC Blocks)
❐ EEPROM Emulation in Flash
❐ 6 Rail-to-Rail Analog PSoC Blocks Provide:
• Up to 14-Bit ADCs
■ Programmable Pin Configurations
• Up to 9-Bit DACs
❐ 25 mA Sink, 10 mA Drive on all GPI/O
• Programmable Gain Amplifiers
• Programmable Filters and Comparators
❐ 4 Digital PSoC Blocks Provide:
• 8 to 32-Bit Timers, Counters, and PWMs
• CRC and PRS Modules
❐ Pull Up, Pull Down, High Z, Strong, or Open Drain Drive
Modes on all GPI/O
❐ Up to 48 Analog Inputs on GPI/O
❐ Two 33 mA Analog Outputs on GPI/O
❐ Configurable Interrupt on all GPI/O
■ Precision, Programmable Clocking
• Full-Duplex UART
❐ Internal ±4% 24 and 48 MHz Oscillator
❐ Internal Oscillator for Watchdog and Sleep
❐ 0.25% Accuracy for USB with no External Components
• Multiple SPI™ Masters or Slaves
• Connectable to all GPI/O Pins
❐ Complex Peripherals by Combining Blocks
❐ Capacitive Sensing Application Capability
■ Additional System Resources
2
❐ I C Slave, Master, and Multi-Master to 400 kHz
❐ Watchdog and Sleep Timers
❐ User Configurable Low Voltage Detection
A n a lo g
P o r t
5
P o r t
4
P o r t
3
P o r t
2
P o r t
1
P o r t
0
P o r t
7
D
r iv e r s
2. Logic Block Diagram
G lo b a l D ig ita l In te r c o n n e c t
G lo b a l A n a lo g In te r c o n n e c t
P S o C C O R E
S R A M
1 K
S R O M
F la s h 1 6 K
S le e p a n d
a tc h d o g
C P U C o r e ( M 8 C )
W
In te r r u p t
C o n tr o lle r
C lo c k S o u r c e s
( In c lu d e s I M O a n d IL O )
D IG IT A L S Y S T E M
A N A L O G S Y S T E M
A n a lo g
R e f.
D i g i t a l
B lo c k
A r r a y
A n a lo g
B l o c k
A r r a y
In te r n a l
V o lta g e
R e f.
A n a lo g
In p u t
D ig ita l
C lo c k s
2
D e c im a to r
T y p e
P O R a n d L V D
S y s te m R e s e ts
I 2 C
U S B
M
A C s
2
M
u x in g
S Y S T E M R E S O U R C E S
Cypress Semiconductor Corporation
Document Number: 38-12018 Rev. *M
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised February 10, 2009
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CY8C24894, CY8C24994
Figure 3-2. Analog System Block Diagram
3.1 The Analog System
A ll IO
(E x c e p t P o rt 7 )
The Analog System is composed of 6 configurable blocks, each
comprised of an opamp circuit allowing the creation of complex
analog signal flows. Analog peripherals are very flexible and can
be customized to support specific application requirements.
Some of the more common PSoC analog functions (most
available as user modules) are listed below.
P 0 [7 ]
P 0 [5 ]
P 0 [6 ]
P 0 [4 ]
P 0 [3 ]
P 0 [1 ]
P 0 [2 ]
P 0 [0 ]
■ Analog-to-digital converters (up to 2, with 6 to 14-bit resolution,
selectable as Incremental, Delta Sigma, and SAR)
P 2 [6 ]
P 2 [4 ]
P 2 [3 ]
P 2 [1 ]
■ Filters (2 and 4 pole band-pass, low-pass, and notch)
■ Amplifiers (up to 2, with selectable gain to 48x)
■ Instrumentation amplifiers (1 with selectable gain to 93x)
■ Comparators (up to 2, with 16 selectable thresholds)
■ DACs (up to 2, with 6- to 9-bit resolution)
P 2 [2 ]
P 2 [0 ]
■ Multiplying DACs (up to 2, with 6- to 9-bit resolution)
A C I0 [1 :0 ]
A rra y In p u t
A C I1 [1 :0 ]
■ High current output drivers (two with 30 mA drive as a PSoC
Core Resource)
C o n fig u ra tio n
■ 1.3V reference (as a System Resource)
■ DTMF Dialer
B lo c k
A rray
A C B 0 0
A S C 1 0
A S D 2 0
A C B 0 1
■ Modulators
A S D 1 1
A S C 2 1
■ Correlators
■ Peak Detectors
A n a lo g R e fe re n c e
■ Many other topologies possible
In te rfa c e to
D ig ita l S y s te m
R e fe re n c e
G e n e ra to rs
Analog blocks are arranged in a column of three, which includes
one CT (Continuous Time) and two SC (Switched Capacitor)
blocks, as shown in Figure 3-2.
R e fH i
R e fL o
A G N D
A G N D In
R e fIn
B a n d g a p
M 8 C In te rfa c e (A d d re s s B u s , D a ta B u s , E tc .)
3.0.1 The Analog Multiplexer System
The Analog Mux Bus can connect to every GPI/O pin in ports 0-5.
Pins are connected to the bus individually or in any combination.
The bus also connects to the analog system for analysis with
comparators and analog-to-digital converters. It is split into two
sections for simultaneous dual-channel processing. An
additional 8:1 analog input multiplexer provides a second path to
bring Port 0 pins to the analog array.
Switch control logic enables selected pins to precharge continu-
ously under hardware control. This enables capacitive
measurement for applications such as touch sensing. Other
multiplexer applications include:
■ Track pad, finger sensing.
■ Chip-wide mux that allows analog input from up to 48 I/O pins.
■ Crosspoint connection between any I/O pin combinations.
Resources > Application Notes. In general, and unless otherwise
noted in the relevant Application Notes, the minimum
signal-to-noise ratio (SNR) for CapSense applications is 5:1.
Document Number: 38-12018 Rev. *M
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3.1 Additional System Resources
4. Getting Started
System Resources, provide additional capability useful to
complete systems. Additional resources include a multiplier,
decimator, low voltage detection, and power on reset. Brief state-
ments describing the merits of each resource follow.
The quickest way to understand PSoC silicon is to read this data
sheet and then use the PSoC Designer Integrated Development
Environment (IDE). This data sheet is an overview of the PSoC
integrated circuit and presents specific pin, register, and
electrical specifications.
■ Full-Speed USB (12 Mbps) with 5 configurable endpoints and
256 bytes of RAM. No external components required except
two series resistors. Wider than commercial temperature USB
operation (-10°C to +85°C).
For in depth information, along with detailed programming
details, see the PSoC® Programmable System-on-Chip
Technical Reference Manual for CY8C28xxx PSoC devices.
■ Digital clock dividers provide three customizable clock
frequencies for use in applications. The clocks can be routed
to both the digital and analog systems. Additional clocks are
generated using digital PSoC blocks as clock dividers.
4.1 Application Notes
■ Two multiply accumulates (MACs) provide fast 8-bit multipliers
with 32-bit accumulate, to assist in both general math and
digital filters.
www.cypress.com/psoc. Select Application Notes under the
Documentation tab.
■ Decimator provides a custom hardware filter for digital signal
processing applications including creation of Delta Sigma
ADCs.
4.2 Development Kits
■ TheI2Cmoduleprovides100and400kHzcommunicationover
two wires. Slave, master, multi-master are supported.
www.cypress.com/shop and through a growing number of
regional and global distributors, which include Arrow, Avnet,
Digi-Key, Farnell, Future Electronics, and Newark.
■ Low Voltage Detection (LVD) interrupts signal the application
of falling voltage levels, while the advanced POR (Power On
Reset) circuit eliminates the need for a system supervisor.
4.3 Training
■ An internal 1.3V reference provides an absolute reference for
the analog system, including ADCs and DACs.
training covers a wide variety of topics and skill levels to assist
you in your designs.
■ Versatile analog multiplexer system.
3.2 PSoC Device Characteristics
4.4 CyPros Consultants
Depending on your PSoC device characteristics, the digital and
analog systems can have 16, 8, or 4 digital blocks and 12, 6, or
4 analog blocks. The following table lists the resources available
for specific PSoC device groups. The device covered by this data
sheet is shown in the highlighted row of the table
4.5 Solutions Library
www.cypress.com/solutions. Here you can find various appli-
cation designs that include firmware and hardware design files
that enable you to complete your designs quickly.
Table 3-1. PSoC Device Characteristics
PSoC Part
Number
4.6 Technical Support
CY8C29x66
CY8C27x43
up to
64
4
2
16
8
12
12
4
4
4
4
12
12
2K
32K
16K
find an answer to your question, call technical support at
1-800-541-4736.
up to
44
256
Bytes
CY8C24x94
56
1
1
4
4
48
12
2
2
2
2
6
6
1K
16K
4K
CY8C24x23A
up to
24
256
Bytes
[1]
CY8C21x34
CY8C21x23
CY8C20x34
up to
28
1
1
0
4
4
0
28
8
0
0
0
2
2
0
4
4
3
512
8K
4K
8K
Bytes
[1]
[2]
16
256
Bytes
up to
28
28
512
Bytes
Document Number: 38-12018 Rev. *M
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5.1.4 Code Generation Tools
5. Development Tools
PSoC Designer supports multiple third party C compilers and
assemblers. The code generation tools work seamlessly within
the PSoC Designer interface and have been tested with a full
range of debugging tools. The choice is yours.
PSoC Designer is a Microsoft® Windows-based, integrated
development
environment
for
the
Programmable
System-on-Chip (PSoC) devices. The PSoC Designer IDE runs
on Windows XP or Windows Vista.
This system provides design database management by project,
an integrated debugger with In-Circuit Emulator, in-system
programming support, and built-in support for third-party
assemblers and C compilers.
Assemblers. The assemblers allow assembly code to merge
seamlessly with C code. Link libraries automatically use absolute
addressing or are compiled in relative mode, and linked with
other software modules to get absolute addressing.
PSoC Designer also supports C language compilers developed
specifically for the devices in the PSoC family.
C Language Compilers. C language compilers are available
that support the PSoC family of devices. The products allow you
to create complete C programs for the PSoC family devices.
5.1 PSoC Designer Software Subsystems
The optimizing C compilers provide all the features of C tailored
to the PSoC architecture. They come complete with embedded
libraries providing port and bus operations, standard keypad and
display support, and extended math functionality.
5.1.1 System-Level View
A drag-and-drop visual embedded system design environment
based on PSoC Express. In the system level view you create a
model of your system inputs, outputs, and communication inter-
faces. You define when and how an output device changes state
based upon any or all other system devices. Based upon the
design, PSoC Designer automatically selects one or more PSoC
Mixed-Signal Controllers that match your system requirements.
5.1.5 Debugger
The PSoC Designer Debugger subsystem provides hardware
in-circuit emulation, allowing you to test the program in a physical
system while providing an internal view of the PSoC device.
Debugger commands allow the designer to read and program
and read and write data memory, read and write I/O registers,
read and write CPU registers, set and clear breakpoints, and
provide program run, halt, and step control. The debugger also
allows the designer to create a trace buffer of registers and
memory locations of interest.
PSoC Designer generates all embedded code, then compiles
and links it into a programming file for a specific PSoC device.
5.1.2 Chip-Level View
The chip-level view is a more traditional integrated development
environment (IDE) based on PSoC Designer 4.4. Choose a base
device to work with and then select different onboard analog and
digital components called user modules that use the PSoC
blocks. Examples of user modules are ADCs, DACs, Amplifiers,
and Filters. Configure the user modules for your chosen
application and connect them to each other and to the proper
pins. Then generate your project. This prepopulates your project
with APIs and libraries that you can use to program your
application.
5.1.6 Online Help System
The online help system displays online, context-sensitive help
for the user. Designed for procedural and quick reference, each
functional subsystem has its own context-sensitive help. This
system also provides tutorials and links to FAQs and an Online
Support Forum to aid the designer in getting started.
5.2 In-Circuit Emulator
The device editor also supports easy development of multiple
configurations and dynamic reconfiguration. Dynamic
configuration allows for changing configurations at run time.
A low cost, high functionality ICE (In-Circuit Emulator) is
available for development support. This hardware has the
capability to program single devices.
5.1.3 Hybrid Designs
The emulator consists of a base unit that connects to the PC by
way of a USB port. The base unit is universal and operates with
all PSoC devices. Emulation pods for each device family are
available separately. The emulation pod takes the place of the
PSoC device in the target board and performs full speed (24
MHz) operation.
You can begin in the system-level view, allow it to choose and
configure your user modules, routing, and generate code, then
switch to the chip-level view to gain complete control over
on-chip resources. All views of the project share a common code
editor, builder, and common debug, emulation, and programming
tools.
Document Number: 38-12018 Rev. *M
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6.3 Organize and Connect
6. Designing with PSoC Designer
You can build signal chains at the chip level by interconnecting
user modules to each other and the I/O pins, or connect system
level inputs, outputs, and communication interfaces to each
other with valuator functions.
The development process for the PSoC device differs from that
of a traditional fixed function microprocessor. The configurable
analog and digital hardware blocks give the PSoC architecture a
unique flexibility that pays dividends in managing specification
change during development and by lowering inventory costs.
These configurable resources, called PSoC Blocks, have the
ability to implement a wide variety of user-selectable functions.
In the system-level view, selecting a potentiometer driver to
control a variable speed fan driver and setting up the valuators
to control the fan speed based on input from the pot selects,
places, routes, and configures a programmable gain amplifier
(PGA) to buffer the input from the potentiometer, an analog to
digital converter (ADC) to convert the potentiometer’s output to
a digital signal, and a PWM to control the fan.
The PSoC development process can be summarized in the
following four steps:
1. Select components
2. Configure components
3. Organize and Connect
4. Generate, Verify, and Debug
In the chip-level view, perform the selection, configuration, and
routing so that you have complete control over the use of all
on-chip resources.
6.4 Generate, Verify, and Debug
6.1 Select Components
When you are ready to test the hardware configuration or move
on to developing code for the project, perform the “Generate
Application” step. This causes PSoC Designer to generate
source code that automatically configures the device to your
specification and provides the software for the system.
Both the system-level and chip-level views provide a library of
prebuilt, pretested hardware peripheral components. In the
system-level view, these components are called “drivers” and
correspond to inputs (a thermistor, for example), outputs (a
brushless DC fan, for example), communication interfaces
(I C-bus, for example), and the logic to control how they interact
with one another (called valuators).
2
Both system-level and chip-level designs generate software
based on your design. The chip-level design provides application
programming interfaces (APIs) with high level functions to
control and respond to hardware events at run-time and interrupt
service routines that you can adapt as needed. The system-level
design also generates a C main() program that completely
controls the chosen application and contains placeholders for
custom code at strategic positions allowing you to further refine
the software without disrupting the generated code.
In the chip-level view, the components are called “user modules”.
User modules make selecting and implementing peripheral
devices simple, and come in analog, digital, and mixed signal
varieties.
6.2 Configure Components
Each of the components you select establishes the basic register
settings that implement the selected function. They also provide
parameters and properties that allow you to tailor their precise
configuration to your particular application. For example, a Pulse
Width Modulator (PWM) User Module configures one or more
digital PSoC blocks, one for each 8 bits of resolution. The user
module parameters permit you to establish the pulse width and
duty cycle. Configure the parameters and properties to
correspond to your chosen application. Enter values directly or
by selecting values from drop-down menus.
A complete code development environment allows you to
develop and customize your applications in C, assembly
language, or both.
The last step in the development process takes place inside the
PSoC Designer’s Debugger subsystem. The Debugger
downloads the HEX image to the In-Circuit Emulator (ICE) where
it runs at full speed. Debugger capabilities rival those of systems
costing many times more. In addition to traditional single-step,
run-to-breakpoint and watch-variable features, the Debugger
provides a large trace buffer and allows you define complex
breakpoint events that include monitoring address and data bus
values, memory locations and external signals.
Both the system-level drivers and chip-level user modules are
documented in data sheets that are viewed directly in the PSoC
Designer. These data sheets explain the internal operation of the
component and provide performance specifications. Each data
sheet describes the use of each user module parameter or driver
property, and other information you may need to successfully
implement your design.
Document Number: 38-12018 Rev. *M
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7.2 Units of Measure
7. Document Conventions
A units of measure table is located in the Electrical Specifications
measure the PSoC devices.
7.1 Acronyms Used
The following table lists the acronyms that are used in this
document.
7.3 Numeric Naming
Acronym
AC
Description
alternating current
Hexadecimal numbers are represented with all letters in
uppercase with an appended lowercase ‘h’ (for example, ‘14h’ or
‘3Ah’). Hexadecimal numbers may also be represented by a ‘0x’
prefix, the C coding convention. Binary numbers have an
appended lowercase ‘b’ (e.g., 01010100b’ or ‘01000011b’).
Numbers not indicated by an ‘h’ or ‘b’ are decimal.
ADC
API
analog-to-digital converter
application programming interface
central processing unit
continuous time
CPU
CT
DAC
DC
digital-to-analog converter
direct current
ECO
external crystal oscillator
EEPROM electrically erasable programmable read-only
memory
FSR
GPI/O
GUI
full scale range
general purpose I/O
graphical user interface
human body model
in-circuit emulator
HBM
ICE
ILO
internal low speed oscillator
internal main oscillator
input/output
IMO
I/O
IPOR
LSb
imprecise power on reset
least-significant bit
LVD
low voltage detect
MSb
PC
most-significant bit
program counter
PLL
phase-locked loop
POR
PPOR
PSoC®
PWM
SC
power on reset
precision power on reset
Programmable System-on-Chip™
pulse width modulator
switched capacitor
SRAM
static random access memory
Document Number: 38-12018 Rev. *M
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8. Pin Information
This section describes, lists, and illustrates the CY8C24x94 PSoC device family pins and pinout configuration.
The CY8C24x94 PSoC devices are available in the following packages, all of which are shown on the following pages. Every port pin
(labeled with a “P”) is capable of Digital I/O. However, Vss, Vdd, and XRES are not capable of Digital I/O.
8.1 56-Pin Part Pinout
Type
Digital Analog
Pin
No.
Figure 8-1. CY8C24794 56-Pin PSoC Device
Name
Description
1
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I, M
I, M
M
P2[3] Direct switched capacitor block input.
2
3
4
P2[1] Direct switched capacitor block input.
P4[7]
P4[5]
M
5
6
7
M
M
M
P4[3]
P4[1]
P3[7]
A,I, M,P2[3]
A,I, M,P2[1]
M,P4[7]
1
2
P2[2], A, I,M
P2[0], A, I,M
P4[6],M
P4[4],M
P4[2],M
P4[0],M
P3[6],M
P3[4],M
P3[2],M
P3[0],M
P5[6],M
P5[4],M
P5[2],M
P5[0],M
42
41
3
4
5
6
40
39
8
9
M
M
M
P3[5]
P3[3]
P3[1]
M,P4[5]
M,P4[3]
M,P4[1]
38
37
36
35
34
33
32
31
30
29
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
M,P3[7]
7
8
9
10
11
12
13
14
M
M
M
P5[7]
P5[5]
P5[3]
QFN
(Top View )
M,P3[5]
M,P3[3]
M,P3[1]
M
M
M
P5[1]
M,P5[7]
M,P5[5]
M,P5[3]
M,P5[1]
P1[7] I2C Serial Clock (SCL).
P1[5] I2C Serial Data (SDA).
P1[3]
M
M
P1[1] I2C Serial Clock (SCL), ISSP SCLK
.
Power
Vss Ground connection.
USB
USB
D+
D-
Power
Vdd Supply voltage.
I/O
I/O
I/O
I/O
I/O
I/O
I/O
P7[7]
P7[0]
M
M
M
M
M
P1[0] I2C Serial Data (SDA), ISSP SDATA
P1[2]
.
P1[4] Optional External Clock Input (EXTCLK).
P1[6]
P5[0]
Type
Pin
No.
Name
Description
30
31
32
33
34
35
36
37
38
39
40
41
42
43
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
M
M
M
M
M
M
M
M
M
M
M
P5[2]
Digital Analog
P5[4]
44
45
46
47
48
49
50
51
52
53
54
55
56
I/O
I/O
I/O
I/O
I/O
M
P2[6] External Voltage Reference (VREF) input.
P0[0] Analog column mux input.
P0[2] Analog column mux input.
P0[4] Analog column mux input VREF.
P0[6] Analog column mux input.
Vdd Supply voltage.
P5[6]
I, M
I, M
I, M
I, M
P3[0]
P3[2]
P3[4]
P3[6]
Power
Power
I, M
P4[0]
Vss Ground connectI/On.
P4[2]
I/O
I/O
I/O
I/O
I/O
I/O
P0[7] Analog column mux input,.
P4[4]
I/O, M P0[5] Analog column mux input and column output.
I/O, M P0[3] Analog column mux input and column output.
P4[6]
I, M
I, M
M
P2[0] Direct switched capacitor block input.
P2[2] Direct switched capacitor block input.
P2[4] External Analog Ground (AGND) input.
I, M
M
P0[1] Analog column mux input.
P2[7]
P2[5]
M
Document Number: 38-12018 Rev. *M
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8.1 56-Pin Part Pinout (with XRES)
Type
Pin
Figure 8-2. CY8C24894 56-Pin PSoC Device
Name
Description
No.
Digital Analog
1
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I, M
I, M
M
P2[3] Direct switched capacitor block input.
2
3
4
P2[1] Direct switched capacitor block input.
P4[7]
P4[5]
M
5
6
7
M
M
M
P4[3]
P4[1]
P3[7]
A, I, M, P2[3]
A, I, M, P2[1]
1
2
P2[2], A, I, M
P2[0], A, I, M
42
41
40
39
38
37
8
9
M
M
M
P3[5]
P3[3]
P3[1]
M, P4[7]
M, P4[5]
M, P4[3]
M, P4[1]
M, P3[7]
3
4
5
6
P4[6], M
P4[4], M
P4[2], M
P4[0], M
XRES
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
M
M
M
P5[7]
P5[5]
P5[3]
7
8
QFN
(Top View)
36
35
34
33
M, P3[5]
M, P3[3]
M, P3[1]
P3[4], M
P3[2], M
P3[0], M
9
M
M
M
P5[1]
10
P1[7] I2C Serial Clock (SCL).
P1[5] I2C Serial Data (SDA).
P1[3]
M, P5[7]
M, P5[5]
M, P5[3]
M, P5[1]
11
12
13
14
P5[6], M
P5[4], M
P5[2], M
P5[0], M
32
31
30
29
M
M
P1[1] I2C Serial Clock (SCL), ISSP SCLK
Power
Vss Ground connection.
USB
USB
D+
D-
Power
Vdd Supply voltage.
I/O
I/O
I/O
I/O
I/O
I/O
P7[7]
P7[0]
M
M
M
M
P1[0] I2C Serial Data (SDA), ISSP SDATA
P1[2]
.
P1[4] Optional External Clock Input (EXTCLK).
P1[6]
29
30
31
32
33
34
35
36
I/O
I/O
I/O
I/O
I/O
I/O
I/O
M
M
M
M
M
M
M
P5[0]
P5[2]
P5[4]
P5[6]
P3[0]
P3[2]
P3[4]
Type
Pin
No.
Name
Description
Digital Analog
44
45
46
47
48
49
I/O
I/O
I/O
I/O
I/O
M
P2[6] External Voltage Reference (VREF) input.
P0[0] Analog column mux input.
P0[2] Analog column mux input.
P0[4] Analog column mux input VREF.
P0[6] Analog column mux input.
Vdd Supply voltage.
I, M
I, M
I, M
I, M
Input
XRES Active high external reset with internal
pull down.
Power
37
38
39
40
41
42
43
I/O
I/O
I/O
I/O
I/O
I/O
I/O
M
M
M
M
P4[0]
50
51
52
53
54
55
56
Power
I, M
Vss Ground connection.
P4[2]
I/O
I/O
I/O
I/O
I/O
I/O
P0[7] Analog column mux input,.
P4[4]
I/O, M P0[5] Analog column mux input and column output.
I/O, M P0[3] Analog column mux input and column output.
P4[6]
I, M
I, M
M
P2[0] Direct switched capacitor block input.
P2[2] Direct switched capacitor block input.
P2[4] External Analog Ground (AGND) input.
I, M
M
P0[1] Analog column mux input.
P2[7]
P2[5]
M
LEGEND A = Analog, I = Input, O = Output, and M = Analog Mux Input.
Notes
1. These are the ISSP pins, which are not High Z at POR. See the PSoC Programmable System-on-Chip Technical Reference Manual for details.
2. The center pad on the QFN package should be connected to ground (Vss) for best mechanical, thermal, and electrical performance. If not connected to ground, it
should be electrically floated and not connected to any other signal.
Document Number: 38-12018 Rev. *M
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CY8C24094, CY8C24794
CY8C24894, CY8C24994
8.1 68-Pin Part Pinout
The 68-pin QFN part table and drawing below is for the CY8C24994 PSoC device.
Type
Figure 8-3. CY8C24994 68-Pin PSoC Device
Pin
No.
Name
Description
Digital Analog
1
I/O
I/O
I/O
I/O
M
M
M
M
P4[7]
P4[5]
P4[3]
P4[1]
NC
2
3
4
5
6
7
8
9
No connection.
No connection.
NC
Power
I/O
Vss
Ground connection.
M, P4[7]
M, P4[5]
M, P4[3]
P2[0], M, AI
51
1
2
M
M
M
M
M
M
M
M
M
M
M
M
P3[7]
P3[5]
P3[3]
P3[1]
P5[7]
P5[5]
P5[3]
P5[1]
P1[7]
P1[5]
P1[3]
P1[1]
Vss
50
P4[6], M
P4[4], M
P4[2], M
I/O
3
4
49
48
47
46
M, P4[1]
NC
10 I/O
11 I/O
5
6
P4[0], M
XRES
NC
NC
12 I/O
13 I/O
14 I/O
15 I/O
16 I/O
17 I/O
18 I/O
19 I/O
20 Power
21 USB
22 USB
23 Power
24 I/O
25 I/O
26 I/O
27 I/O
28 I/O
29 I/O
30 I/O
31 I/O
32 I/O
33 I/O
34 I/O
35 I/O
36 I/O
37 I/O
38 I/O
39 I/O
40 I/O
41 I/O
42 I/O
43 I/O
Vss
M, P3[7]
M, P3[5]
45
7
8
9
NC
P3[6], M
P3[4], M
44
43
42
QFN
(Top View)
10
M, P3[3]
M, P3[1]
M, P5[7]
P3[2], M
P3[0], M
11
12
13
14
15
41
I2C Serial Clock (SCL).
I2C Serial Data (SDA).
40
39
M, P5[5]
P5[6], M
P5[4], M
M, P5[3]
M, P5[1]
I2C SCL, M, P1[7]
I2C SDA, M, P1[5]
38
37
36
35
P5[2], M
P5[0], M
[1]
I2C Serial Clock (SCL) ISSP SCLK
Ground connection.
.
16
17
P1[6], M
D+
D-
Vdd
Supply voltage.
P7[7]
P7[6]
P7[5]
P7[4]
P7[3]
P7[2]
P7[1]
P7[0]
P1[0]
P1[2]
P1[4]
P1[6]
P5[0]
P5[2]
P5[4]
P5[6]
P3[0]
P3[2]
P3[4]
P3[6]
Type
Pin
No.
Name
Description
Digital Analog
50 I/O
51 I/O
52 I/O
M
P4[6]
M
M
M
M
M
M
M
M
M
M
M
M
I2C Serial Data (SDA), ISSP SDATA
.
I,M
I,M
M
P2[0] Direct switched capacitor block input.
P2[2] Direct switched capacitor block input.
P2[4] External Analog Ground (AGND) input.
P2[6] External Voltage Reference (VREF) input.
P0[0] Analog column mux input.
Optional External Clock Input (EXTCLK). 53 I/O
54 I/O
55 I/O
56 I/O
57 I/O
58 I/O
M
I,M
I,M
I,M
I,M
P0[2] Analog column mux input and column output.
P0[4] Analog column mux input and column output.
P0[6] Analog column mux input.
59 Power
Vdd
Vss
Supply voltage.
60 Power
61 I/O
Ground connection.
I,M
P0[7] Analog column mux input, integration input #1
62 I/O
I/O,M
P0[5] Analog column mux input and column output, integration
input #2.
44
NC
NC
No connection.
No connection.
63 I/O
64 I/O
65 I/O
I/O,M
I,M
P0[3] Analog column mux input and column output.
P0[1] Analog column mux input.
P2[7]
45
46 Input
XRES Active high pin reset with internal pull
down.
M
47 I/O
48 I/O
49 I/O
M
M
M
P4[0]
P4[2]
P4[4]
66 I/O
67 I/O
68 I/O
M
P2[5]
I,M
I,M
P2[3] Direct switched capacitor block input.
P2[1] Direct switched capacitor block input.
LEGENDA = Analog, I = Input, O = Output, NC = No Connection, M = Analog Mux Input.
Document Number: 38-12018 Rev. *M
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CY8C24094, CY8C24794
CY8C24894, CY8C24994
8.1 68-Pin Part Pinout (On-Chip Debug)
The 68-pin QFN part table and drawing below is for the CY8C24094 On-Chip Debug (OCD) PSoC device.
Note This part is only used for in-circuit debugging. It is NOT available for production.
Type
Pin
No.
Figure 8-4. CY8C24094 68-Pin OCD PSoC Device
Name
Description
Digital Analog
1
I/O
I/O
I/O
I/O
M
M
M
M
P4[7]
P4[5]
P4[3]
P4[1]
2
3
4
5
6
7
8
9
OCDE OCD even data I/O.
OCDO OCD odd data output.
Power
I/O
Vss
Ground connection.
M, P4[7]
M, P4[5]
M, P4[3]
P2[0], M, AI
P4[6], M
1
2
3
4
5
6
7
8
9
51
50
M
M
M
M
M
M
M
M
M
M
M
M
P3[7]
P3[5]
P3[3]
P3[1]
P5[7]
P5[5]
P5[3]
P5[1]
P1[7]
P1[5]
P1[3]
P1[1]
Vss
P4[4], M
P4[2], M
49
48
47
I/O
M, P4[1]
OCDE
OCDO
10 I/O
11 I/O
P4[0], M
XRES
CCLK
46
45
Vss
M, P3[7]
M, P3[5]
12 I/O
13 I/O
14 I/O
15 I/O
16 I/O
17 I/O
18 I/O
19 I/O
20 Power
21 USB
22 USB
23 Power
24 I/O
25 I/O
26 I/O
27 I/O
28 I/O
29 I/O
30 I/O
31 I/O
32 I/O
33 I/O
34 I/O
35 I/O
36 I/O
37 I/O
38 I/O
39 I/O
40 I/O
41 I/O
42 I/O
43 I/O
HCLK
P3[6], M
P3[4], M
44
43
42
QFN
(Top View)
10
M, P3[3]
M, P3[1]
M, P5[7]
M, P5[5]
P3[2], M
P3[0], M
11
12
13
14
15
16
17
41
40
39
38
37
36
35
I2C Serial Clock (SCL).
I2C Serial Data (SDA).
P5[6], M
P5[4], M
M, P5[3]
M, P5[1]
I2C SCL, M, P1[7]
I2C SDA, M, P1[5]
P5[2], M
P5[0], M
P1[6], M
I2C Serial Clock (SCL), ISSP SCLK
Ground connection.
.
D+
D-
Vdd
Supply voltage.
P7[7]
P7[6]
P7[5]
P7[4]
P7[3]
P7[2]
P7[1]
P7[0]
P1[0]
P1[2]
P1[4]
P1[6]
P5[0]
P5[2]
P5[4]
P5[6]
P3[0]
P3[2]
P3[4]
P3[6]
Type
Digital Analog
Pin
No.
Name
Description
50 I/O
51 I/O
52 I/O
M
P4[6]
M
M
M
M
M
M
M
M
M
M
M
M
I2C Serial Data (SDA), ISSP SDATA
.
I,M
I,M
M
P2[0] Direct switched capacitor block input.
P2[2] Direct switched capacitor block input.
Optional External Clock Input (EXTCLK). 53 I/O
P2[4] External Analog Ground (AGND) input.
P2[6] External Voltage Reference (VREF) input.
P0[0] Analog column mux input.
54 I/O
55 I/O
56 I/O
57 I/O
58 I/O
M
I,M
I,M
I,M
I,M
P0[2] Analog column mux input and column output.
P0[4] Analog column mux input and column output.
P0[6] Analog column mux input.
59 Power
Vdd
Vss
Supply voltage.
60 Power
61 I/O
Ground connection.
I,M
P0[7] Analog column mux input, integration input #1
62 I/O
I/O,M
P0[5] Analog column mux input and column output,
integration input #2.
44
HCLK OCD high-speed clock output.
CCLK OCD CPU clock output.
63 I/O
64 I/O
65 I/O
I/O,M
I,M
P0[3] Analog column mux input and column output.
P0[1] Analog column mux input.
P2[7]
45
46 Input
XRES Active high pin reset with internal pull
down.
M
47 I/O
48 I/O
49 I/O
M
M
M
P4[0]
P4[2]
P4[4]
66 I/O
67 I/O
68 I/O
M
P2[5]
I,M
I,M
P2[3] Direct switched capacitor block input.
P2[1] Direct switched capacitor block input.
LEGENDA = Analog, I = Input, O = Output, M = Analog Mux Input, OCD = On-Chip Debugger.
Document Number: 38-12018 Rev. *M
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CY8C24094, CY8C24794
CY8C24894, CY8C24994
8.1 100-Ball VFBGA Part Pinout
The 100-ball VFBGA part is for the CY8C24994 PSoC device.
Table 8-5. 100-Ball Part Pinout (VFBGA)
Pin
No.
Pin
No.
Name
Description
Name
Description
A1 Power
A2 Power
A3
Vss
Vss
NC
NC
NC
Vdd
NC
NC
Vss
Vss
Vss
Vss
Ground connection.
F1
NC
No connection.
Ground connection.
No connection.
F2 I/O
F3 I/O
F4 I/O
M
M
M
P5[7]
P3[5]
P5[1]
Vss
A4
No connection.
A5
No connection.
F5 Power
F6 Power
Ground connection.
Ground connection.
A6 Power
A7
Supply voltage.
Vss
No connection.
F7 I/O
F8 I/O
F9
M
P5[0]
P3[0]
A8
No connection.
M
A9 Power
A10 Power
B1 Power
B2 Power
B3 I/O I,M
B4 I/O I,M
B5 I/O I,M
B6 Power
B7 I/O I,M
B8 I/O I,M
B9 Power
B10 Power
C1
Ground connection.
Ground connection.
Ground connection.
Ground connection.
XRES Active high pin reset with internal pull down.
P7[1]
F10 I/O
G1
NC
No connection.
G2 I/O
G3 I/O
G4 I/O
G5 I/O
G6 I/O
G7 I/O
G8 I/O
G9 I/O
G10 I/O
H1
M
M
M
M
M
M
M
M
P5[5]
P3[3]
P2[1] Direct switched capacitor block input.
P0[1] Analog column mux input.
P1[7] I2C Serial Clock (SCL).
P0[7] Analog column mux input.
P1[1] I2C Serial Clock (SCL), ISSP SCLK
.
Vdd
Supply voltage.
P1[0] I2C Serial Data (SDA), ISSP SDATA
.
P0[2] Analog column mux input.
P1[6]
P3[4]
P5[6]
P7[2]
P2[2] Direct switched capacitor block input.
Vss
Ground connection.
Ground connection.
No connection.
Vss
NC
NC
No connection.
C2 I/O
C3 I/O
C4 I/O
M
M
M
P4[1]
P4[7]
P2[7]
H2 I/O
H3 I/O
H4 I/O
M
M
M
M
M
M
M
M
P5[3]
P3[1]
P1[5] I2C Serial Data (SDA).
C5 I/O I/O,M P0[5] Analog column mux input and column output. H5 I/O
P1[3]
P1[2]
C6 I/O I,M
C7 I/O I,M
C8 I/O I,M
P0[6] Analog column mux input.
P0[0] Analog column mux input.
P2[0] Direct switched capacitor block input.
P4[2]
H6 I/O
H7 I/O
H8 I/O
H9 I/O
H10 I/O
P1[4] Optional External Clock Input (EXTCLK).
P3[2]
P5[4]
P7[3]
C9 I/O
C10
M
NC
No connection.
No connection.
D1
NC
J1
J2
J3
J4
Power
Power
Vss
Vss
D+
Ground connection.
Ground connection.
D2 I/O
D3 I/O
D4 I/O
M
M
M
P3[7]
P4[5]
P2[5]
USB
USB
Power
I/O
D-
D5 I/O I/O,M P0[3] Analog column mux input and column output. J5
Vdd
P7[7]
P7[0]
P5[2]
Vss
Vss
Vss
Vss
NC
Supply voltage.
D6 I/O I,M
P0[4] Analog column mux input.
J6
J7
J8
J9
D7 I/O
D8 I/O
D9 I/O
D10
M
M
M
P2[6] External Voltage Reference (VREF) input.
I/O
P4[6]
P4[0]
I/O
M
Power
Ground connection.
Ground connection.
Ground connection.
Ground connection.
No connection.
NC
No connection.
No connection.
No connection.
J10 Power
K1 Power
K2 Power
K3
E1
NC
E2
NC
E3 I/O
M
P4[3]
E4 I/O I,M
E5 Power
E6 Power
P2[3] Direct switched capacitor block input.
K4
NC
No connection.
Vss
Vss
Ground connection.
Ground connection.
K5 Power
K6 I/O
K7 I/O
K8 I/O
K9 Power
K10 Power
Vdd
P7[6]
P7[5]
P7[4]
Vss
Vss
Supply voltage.
E7 I/O
E8 I/O
E9 I/O
E10
M
M
M
P2[4] External Analog Ground (AGND) input.
P4[4]
P3[6]
Ground connection.
Ground connection.
NC
No connection.
LEGENDA = Analog, I = Input, O = Output, M = Analog Mux Input, NC = No Connection.
Document Number: 38-12018 Rev. *M
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CY8C24094, CY8C24794
CY8C24894, CY8C24994
Figure 8-5. CY8C24094 OCD (Not for Production)
1
2
3
4
5
6
7
8
9
10
Vss
Vss
NC
NC
NC
NC
NC
NC
Vss
Vss
Vss
NC
NC
NC
Vdd
NC
NC
Vss
Vss
Vss
NC
NC
NC
A
B
C
D
E
F
Vss P2[1] P0[1] P0[7] Vdd P0[2] P2[2] Vss
P4[1] P4[7] P2[7] P0[5] P0[6] P0[0] P2[0] P4[2]
P3[7] P4[5] P2[5] P0[3] P0[4] P2[6] P4[6] P4[0]
NC P4[3] P2[3] Vss
P5[7] P3[5] P5[1] Vss
Vss P2[4] P4[4] P3[6]
Vss P5[0] P3[0] XRES P7[1]
P5[5] P3[3] P1[7] P1[1] P1[0] P1[6] P3[4] P5[6] P7[2]
P5[3] P3[1] P1[5] P1[3] P1[2] P1[4] P3[2] P5[4] P7[3]
G
H
J
Vss
Vss
D +
NC
D -
Vdd P7[7] P7[0] P5[2] Vss
Vdd P7[6] P7[5] P7[4] Vss
Vss
Vss
NC
K
BGA (Top View)
8.1 100-Ball VFBGA Part Pinout (On-Chip Debug)
The 100-pin VFBGA part table and drawing below is for the CY8C24094 On-Chip Debug (OCD) PSoC device.
Note This part is only used for in-circuit debugging. It is NOT available for production.
Table 8-6. 100-Ball Part Pinout (VFBGA)
Pin
No.
Pin
No.
Name
Description
Name
Description
A1 Power
A2 Power
A3
Vss
Vss
NC
NC
NC
Vdd
NC
NC
Vss
Vss
Vss
Vss
Ground connection.
F1
OCDE OCD even data I/O.
Ground connection.
No connection.
F2 I/O
F3 I/O
F4 I/O
M
M
M
P5[7]
P3[5]
P5[1]
A4
No connection.
A5
No connection.
F5 Power
F6 Power
Vss
Ground connection.
Ground connection.
A6 Power
A7
Supply voltage.
Vss
No connection.
F7 I/O
F8 I/O
F9
M
P5[0]
P3[0]
A8
No connection.
M
A9 Power
A10 Power
B1 Power
B2 Power
Ground connection.
Ground connection.
Ground connection.
Ground connection.
XRES Active high pin reset with internal pull down.
F10 I/O
G1
P7[1]
OCDO OCD odd data output.
G2 I/O
G3 I/O
G4 I/O
G5 I/O
G6 I/O
G7 I/O
G8 I/O
G9 I/O
G10 I/O
H1
M
M
M
M
M
M
M
M
P5[5]
P3[3]
B3 I/O I,M P2[1] Direct switched capacitor block input.
B4 I/O I,M P0[1] Analog column mux input.
B5 I/O I,M P0[7] Analog column mux input.
P1[7] I2C Serial Clock (SCL).
P1[1] I2C Serial Clock (SCL), ISSP SCLK
.
B6 Power
Vdd
Supply voltage.
P1[0] I2C Serial Data (SDA), ISSP SDATA
.
B7 I/O I,M P0[2] Analog column mux input.
P1[6]
P3[4]
P5[6]
P7[2]
B8 I/O I,M P2[2] Direct switched capacitor block input.
B9 Power
B10 Power
C1
Vss
Ground connection.
Ground connection.
No connection.
Vss
NC
NC
No connection.
C2 I/O
C3 I/O
C4 I/O
M
P4[1]
P4[7]
P2[7]
H2 I/O
H3 I/O
H4 I/O
M
M
M
M
P5[3]
P3[1]
M
M
P1[5] I2C Serial Data (SDA).
P1[3]
C5 I/O I/O, P0[5] Analog column mux input and column output. H5 I/O
M
C6 I/O I,M P0[6] Analog column mux input.
C7 I/O I,M P0[0] Analog column mux input.
H6 I/O
H7 I/O
M
M
P1[2]
P1[4] Optional External Clock Input (EXTCLK).
Document Number: 38-12018 Rev. *M
Page 13 of 47
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CY8C24894, CY8C24994
Table 8-6. 100-Ball Part Pinout (VFBGA) (continued)
C8 I/O I,M P2[0] Direct switched capacitor block input.
H8 I/O
H9 I/O
H10 I/O
M
M
P3[2]
P5[4]
P7[3]
Vss
Vss
D+
C9 I/O
C10
M
P4[2]
NC
No connection.
No connection.
D1
NC
J1
J2
J3
J4
Power
Power
Ground connection.
D2 I/O
D3 I/O
D4 I/O
M
M
M
P3[7]
P4[5]
P2[5]
Ground connection.
USB
USB
D-
D5 I/O I/O, P0[3] Analog column mux input and column output. J5
M
Power
Vdd
Supply voltage.
D6 I/O I,M P0[4] Analog column mux input.
J6
J7
J8
J9
I/O
I/O
P7[7]
P7[0]
P5[2]
Vss
D7 I/O
D8 I/O
D9 I/O
D10
M
M
M
P2[6] External Voltage Reference (VREF) input.
P4[6]
I/O
M
P4[0]
Power
Ground connection.
Ground connection.
Ground connection.
Ground connection.
No connection.
CCLK OCD CPU clock output.
J10 Power
K1 Power
K2 Power
K3
Vss
E1
NC
No connection.
No connection.
Vss
E2
NC
Vss
E3 I/O
M
P4[3]
NC
E4 I/O I,M P2[3] Direct switched capacitor block input.
K4
NC
No connection.
E5 Power
E6 Power
Vss
Vss
Ground connection.
Ground connection.
K5 Power
K6 I/O
K7 I/O
K8 I/O
K9 Power
K10 Power
Vdd
P7[6]
P7[5]
P7[4]
Vss
Supply voltage.
E7 I/O
E8 I/O
E9 I/O
E10
M
P2[4] External Analog Ground (AGND) input.
M
M
P4[4]
P3[6]
Ground connection.
Ground connection.
HCLK OCD high-speed clock output.
Vss
LEGENDA = Analog, I = Input, O = Output, M = Analog Mux Input, NC = No Connection, OCD = On-Chip Debugger.
Figure 8-6. CY8C24094 OCD (Not for Production)
1
2
3
4
5
6
7
8
9
10
Vss
Vss
NC
NC
NC
Vss
NC
NC
NC
Vdd
NC
NC
Vss
Vss
Vss
NC
A
B
C
D
E
F
Vss P2[1] P0[1] P0[7] Vdd P0[2] P2[2] Vss
P4[1] P4[7] P2[7] P0[5] P0[6] P0[0] P2[0] P4[2]
P3[7] P4[5] P2[5] P0[3] P0[4] P2[6] P4[6] P4[0] CClk
NC P4[3] P2[3] Vss
Vss P2[4] P4[4] P3[6] HClk
Vss P5[0] P3[0] XRES P7[1]
ocde P5[7] P3[5] P5[1] Vss
ocdo P5[5] P3[3] P1[7] P1[1] P1[0] P1[6] P3[4] P5[6] P7[2]
G
H
J
NC
Vss
Vss
P5[3] P3[1] P1[5] P1[3] P1[2] P1[4] P3[2] P5[4] P7[3]
Vss
Vss
D +
NC
D -
Vdd P7[7] P7[0] P5[2] Vss
Vdd P7[6] P7[5] P7[4] Vss
Vss
Vss
NC
K
BGA (Top View)
Document Number: 38-12018 Rev. *M
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CY8C24894, CY8C24994
8.1 100-Pin Part Pinout (On-Chip Debug)
The 100-pin TQFP part is for the CY8C24094 On-Chip Debug (OCD) PSoC device.
Note This part is only used for in-circuit debugging. It is NOT available for production.
Table 8-7. 100-Pin Part Pinout (TQFP)
Pin
No.
Pin
No.
Name
Description
Name
Description
1
NC
NC
No connection.
No connection.
51 I/O
52 I/O
53 I/O
54 I/O
55 I/O
56 I/O
57 I/O
58 I/O
59 I/O
60
M
M
M
M
M
M
M
M
M
P1[6]
P5[0]
P5[2]
P5[4]
P5[6]
P3[0]
P3[2]
P3[4]
P3[6]
2
3
4
5
6
7
8
9
I/O I, M P0[1] Analog column mux input.
I/O
I/O
M
M
P2[7]
P2[5]
I/O I, M P2[3] Direct switched capacitor block input.
I/O I, M P2[1] Direct switched capacitor block input.
I/O
I/O
M
M
M
M
P4[7]
P4[5]
10 I/O
P4[3]
HCLK OCD high-speed clock output.
11
12
13
14
I/O
P4[1]
61
CCLK OCD CPU clock output.
OCDE OCD even data I/O.
OCDO OCD odd data output.
62 Input
63 I/O
64 I/O
XRES Active high pin reset with internal pull down.
M
M
P4[0]
P4[2]
NC
No connection.
15 Power
Vss
Ground connection.
65 Power
Vss
Ground connection.
16 I/O
17 I/O
18 I/O
19 I/O
20 I/O
21 I/O
22 I/O
23 I/O
24 I/O
25
M
P3[7]
P3[5]
P3[3]
P3[1]
P5[7]
P5[5]
P5[3]
P5[1]
66 I/O
67 I/O
M
P4[4]
P4[6]
M
M
M
M
M
M
M
M
M
68 I/O I, M P2[0] Direct switched capacitor block input.
69 I/O I, M P2[2] Direct switched capacitor block input.
70 I/O
71
P2[4] External Analog Ground (AGND) input.
NC No connection.
P2[6] External Voltage Reference (VREF) input.
NC No connection.
P0[0] Analog column mux input.
72 I/O
73
P1[7] I2C Serial Clock (SCL).
74 I/O
75
I
NC
NC
NC
No connection.
No connection.
No connection.
NC
NC
No connection.
No connection.
26
76
27
77 I/O I, M P0[2] Analog column mux input and column output.
78 NC No connection.
79 I/O I, M P0[4] Analog column mux input and column output.
80 NC No connection.
28 I/O
29 I/O
30 I/O
P1[5] I2C Serial Data (SDA)
P1[3]
ISSP SCLK
.
31
NC
No connection.
81 I/O I, M P0[6] Analog column mux input.
32 Power
33 USB
34 USB
35 Power
36 I/O
37 I/O
38 I/O
39 I/O
40 I/O
41 I/O
42 I/O
43 I/O
44
Vss
Ground connection.
82 Power
Vdd
NC
Vss
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
Supply voltage.
No connection.
Ground connection.
No connection.
No connection.
No connection.
No connection.
No connection.
No connection.
No connection.
No connection.
No connection.
No connection.
D+
83
D-
84 Power
Vdd
P7[7]
P7[6]
P7[5]
P7[4]
P7[3]
P7[2]
P7[1]
P7[0]
NC
Supply voltage.
85
86
87
88
89
90
91
92
93
94
No connection.
No connection.
No connection.
No connection.
45
NC
95 I/O I, M P0[7] Analog column mux input.
96 NC No connection.
46
NC
47
NC
97 I/O I/O, P0[5] Analog column mux input and column output.
M
48 I/O
49 I/O
50 I/O
98
NC
No connection.
ISSP SDATA
.
P1[2]
99 I/O I/O, P0[3] Analog column mux input and column output.
M
P1[4] Optional External Clock Input (EXTCLK).
100
NC
No connection.
Document Number: 38-12018 Rev. *M
Page 15 of 47
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CY8C24894, CY8C24994
Table 8-7. 100-Pin Part Pinout (TQFP) (continued)
LEGENDA = Analog, I = Input, O = Output, NC = No Connection, M = Analog Mux Input, OCD = On-Chip Debugger.
Figure 8-7. CY8C24094 OCD (Not for Production)
NC
NC
NC
1
2
3
4
75
74
P0[0],M,AI
AI, M,P0[1]
M,P2[7]
M,P2[5]
AI, M,P2[3]
AI, M,P2[1]
M,P4[7]
M,P4[5]
M,P4[3]
M,P4[1]
OCDE
NC
73
72
71
P2[6],M,External VREF
NC
P2[4],M,External AGND
5
6
70
69
7
8
9
P2[2],M,AI
P2[0],M,AI
P4[6],M
68
67
P4[4],M
10
11
12
13
14
15
16
17
18
19
20
21
22
66
65
64
63
62
61
60
59
Vss
P4[2],M
OCDO
TQFP
P4[0],M
XRES
NC
Vss
M,P3[7]
M,P3[5]
CCLK
HCLK
P3[6],M
P3[4],M
P3[2],M
P3[0],M
P5[6],M
M,P3[3]
58
57
56
55
M,P3[1]
M,P5[7]
M,P5[5]
P5[4],M
P5[2],M
P5[0],M
M,P5[3]
M,P5[1]
54
53
52
51
23
24
25
I2C SCL,P1[7]
NC
P1[6],M
Document Number: 38-12018 Rev. *M
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CY8C24894, CY8C24994
9. Register Reference
This section lists the registers of the CY8C24x94 PSoC device family. For detailed register information, reference the
PSoC Programmable System-on-Chip Technical Reference Manual.
9.1 Register Conventions
9.2 Register Mapping Tables
The register conventions specific to this section are listed in the
following table.
The PSoC device has a total register address space of 512
bytes. The register space is referred to as I/O space and is
divided into two banks. The XOI bit in the Flag register (CPU_F)
determines which bank the user is currently in. When the XOI bit
is set the user is in Bank 1.
Convention
Description
Read register or bit(s)
R
W
L
Note In the following register mapping tables, blank fields are
Reserved and should not be accessed.
Write register or bit(s)
Logical register or bit(s)
Clearable register or bit(s)
Access is bit specific
C
#
Document Number: 38-12018 Rev. *M
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9.3 Register Map Bank 0 Table: User Space
Name
PRT0DR
Addr (0,Hex) Access
Name
Addr (0,Hex) Access
Name
ASC10CR0
Addr (0,Hex) Access
Name
Addr (0,Hex)
C0
Access
00
01
02
03
04
05
06
07
08
09
0A
0B
0C
0D
0E
0F
10
11
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
PMA0_DR
40
41
42
43
44
45
46
47
48
49
4A
4B
4C
4D
4E
4F
50
51
52
53
54
55
56
57
58
59
5A
5B
5C
5D
5E
5F
60
61
62
63
64
65
66
67
68
69
6A
6B
6C
6D
6E
6F
70
71
72
73
74
75
76
77
78
79
7A
7B
7C
7D
7E
7F
RW
RW
RW
RW
RW
RW
RW
RW
R
80
81
82
83
84
85
86
87
88
89
8A
8B
8C
8D
8E
8F
90
91
92
93
94
95
96
97
98
99
9A
9B
9C
9D
9E
9F
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
AA
AB
AC
AD
AE
AF
B0
B1
B2
B3
B4
B5
B6
B7
B8
B9
BA
BB
BC
BD
BE
BF
RW
RW
RW
RW
RW
RW
RW
RW
PRT0IE
PMA1_DR
PMA2_DR
PMA3_DR
PMA4_DR
PMA5_DR
PMA6_DR
PMA7_DR
USB_SOF0
USB_SOF1
USB_CR0
USBI/O_CR0
USBI/O_CR1
ASC10CR1
ASC10CR2
ASC10CR3
ASD11CR0
ASD11CR1
ASD11CR2
ASD11CR3
C1
C2
C3
C4
C5
C6
C7
C8
C9
CA
CB
CC
CD
CE
CF
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
DA
DB
DC
DD
DE
DF
E0
E1
E2
E3
E4
E5
E6
E7
E8
E9
EA
EB
EC
ED
EE
EF
F0
F1
F2
F3
F4
F5
F6
F7
F8
F9
FA
FB
FC
FD
FE
FF
PRT0GS
PRT0DM2
PRT1DR
PRT1IE
PRT1GS
PRT1DM2
PRT2DR
PRT2IE
R
PRT2GS
PRT2DM2
PRT3DR
PRT3IE
RW
#
RW
PRT3GS
PRT3DM2
PRT4DR
PRT4IE
EP1_CNT1
EP1_CNT
EP2_CNT1
EP2_CNT
EP3_CNT1
EP3_CNT
EP4_CNT1
EP4_CNT
EP0_CR
#
RW
#
ASD20CR0
ASD20CR1
ASD20CR2
ASD20CR3
ASC21CR0
ASC21CR1
ASC21CR2
ASC21CR3
RW
RW
RW
RW
RW
RW
RW
RW
CUR_PP
RW
RW
#
STK_PP
RW
PRT4GS
PRT4DM2
PRT5DR
PRT5IE
12
13
14
15
16
17
18
19
1A
1B
1C
1D
1E
1F
20
21
22
23
24
25
26
27
28
29
2A
2B
2C
2D
2E
2F
30
31
32
33
34
35
36
37
38
39
3A
3B
3C
3D
3E
3F
RW
#
IDX_PP
RW
RW
RW
RW
#
MVR_PP
RW
#
MVW_PP
I2C_CFG
I2C_SCR
I2C_DR
PRT5GS
PRT5DM2
EP0_CNT
EP0_DR0
EP0_DR1
EP0_DR2
EP0_DR3
EP0_DR4
EP0_DR5
EP0_DR6
EP0_DR7
AMX_IN
#
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
#
I2C_MSCR
INT_CLR0
INT_CLR1
INT_CLR2
INT_CLR3
INT_MSK3
INT_MSK2
INT_MSK0
INT_MSK1
INT_VC
RW
RW
RW
RW
RW
RW
RW
RW
RC
W
PRT7DR
RW
RW
RW
RW
#
PRT7IE
PRT7GS
PRT7DM2
DBB00DR0
DBB00DR1
DBB00DR2
DBB00CR0
DBB01DR0
DBB01DR1
DBB01DR2
DBB01CR0
DCB02DR0
DCB02DR1
DCB02DR2
DCB02CR0
DCB03DR0
DCB03DR1
DCB03DR2
DCB03CR0
W
AMUXCFG
RW
#
ARF_CR
CMP_CR0
ASY_CR
CMP_CR1
RW
#
RES_WDT
DEC_DH
#
RC
RC
RW
RW
W
W
#
DEC_DL
RW
#
RW
DEC_CR0
DEC_CR1
MUL0_X
#
MUL1_X
W
W
MUL1_Y
W
MUL0_Y
W
RW
#
MUL1_DH
MUL1_DL
ACC1_DR1
ACC1_DR0
ACC1_DR3
ACC1_DR2
RDI0RI
R
MUL0_DH
MUL0_DL
ACC0_DR1
ACC0_DR0
ACC0_DR3
ACC0_DR2
R
R
R
#
TMP_DR0
TMP_DR1
TMP_DR2
TMP_DR3
ACB00CR3
ACB00CR0
ACB00CR1
ACB00CR2
ACB01CR3
ACB01CR0
ACB01CR1
ACB01CR2
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
W
RW
#
RDI0SYN
RDI0IS
RDI0LT0
RDI0LT1
RDI0RO0
RDI0RO1
CPU_F
RL
DAC_D
RW
#
CPU_SCR1
CPU_SCR0
#
Blank fields are Reserved and should not be accessed.
# Access is bit specific.
Document Number: 38-12018 Rev. *M
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9.4 Register Map Bank 1 Table: Configuration Space
Name
PRT0DM0
PRT0DM1
PRT0IC0
PRT0IC1
PRT1DM0
PRT1DM1
PRT1IC0
PRT1IC1
PRT2DM0
PRT2DM1
PRT2IC0
PRT2IC1
PRT3DM0
PRT3DM1
PRT3IC0
PRT3IC1
PRT4DM0
PRT4DM1
PRT4IC0
PRT4IC1
PRT5DM0
PRT5DM1
PRT5IC0
PRT5IC1
Addr (1,Hex) Access
Name
Addr (1,Hex) Access
Name
ASC10CR0
ASC10CR1
ASC10CR2
ASC10CR3
ASD11CR0
ASD11CR1
ASD11CR2
ASD11CR3
Addr (1,Hex) Access
Name
USBI/O_CR2
USB_CR1
Addr(1,Hex) Access
00
01
02
03
04
05
06
07
08
09
0A
0B
0C
0D
0E
0F
10
11
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
PMA0_WA
40
41
42
43
44
45
46
47
48
49
4A
4B
4C
4D
4E
4F
50
51
52
53
54
55
56
57
58
59
5A
5B
5C
5D
5E
5F
60
61
62
63
64
65
66
67
68
69
6A
6B
6C
6D
6E
6F
70
71
72
73
74
75
76
77
78
79
7A
7B
7C
7D
7E
7F
RW
RW
RW
RW
RW
RW
RW
RW
80
RW
RW
RW
RW
RW
RW
RW
RW
C0
C1
RW
#
PMA1_WA
PMA2_WA
PMA3_WA
PMA4_WA
PMA5_WA
PMA6_WA
PMA7_WA
81
82
83
84
85
86
87
88
89
8A
8B
8C
8D
8E
8F
90
91
92
93
94
95
96
97
98
99
9A
9B
9C
9D
9E
9F
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
AA
AB
AC
AD
AE
AF
B0
B1
B2
B3
B4
B5
B6
B7
B8
B9
BA
BB
BC
BD
BE
BF
EP1_CR0
EP2_CR0
EP3_CR0
EP4_CR0
C4
C5
C6
C7
C8
C9
CA
CB
CC
CD
CE
CF
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
DA
DB
DC
DD
DE
DF
E0
E1
E2
E3
E4
E5
E6
E7
E8
E9
EA
EB
EC
ED
EE
EF
F0
F1
F2
F3
F4
F5
F6
F7
F8
F9
FA
FB
FC
FD
FE
FF
#
#
#
#
PMA0_RA
PMA1_RA
PMA2_RA
PMA3_RA
PMA4_RA
PMA5_RA
PMA6_RA
PMA7_RA
RW
RW
RW
RW
RW
RW
RW
RW
GDI_O_IN
GDI_E_IN
GDI_O_OU
GDI_E_OU
RW
RW
RW
RW
ASD20CR1
ASD20CR2
ASD20CR3
ASC21CR0
ASC21CR1
ASC21CR2
ASC21CR3
RW
RW
RW
RW
RW
RW
RW
12
13
14
15
16
17
18
19
1A
1B
1C
1D
1E
1F
20
21
22
23
24
25
26
27
28
29
2A
2B
2C
2D
2E
2F
30
31
32
33
34
35
36
37
38
39
3A
3B
3C
3D
3E
3F
MUX_CR0
MUX_CR1
MUX_CR2
MUX_CR3
RW
RW
RW
RW
PRT7DM0
PRT7DM1
PRT7IC0
PRT7IC1
DBB00FN
DBB00IN
DBB00OU
RW
RW
RW
RW
RW
RW
RW
OSC_GO_EN
OSC_CR4
OSC_CR3
OSC_CR0
OSC_CR1
OSC_CR2
VLT_CR
RW
RW
RW
RW
RW
RW
RW
R
CLK_CR0
CLK_CR1
ABF_CR0
AMD_CR0
CMP_GO_EN
RW
RW
RW
RW
RW
DBB01FN
DBB01IN
DBB01OU
RW
RW
RW
VLT_CMP
AMD_CR1
ALT_CR0
RW
RW
DCB02FN
DCB02IN
DCB02OU
RW
RW
RW
IMO_TR
W
ILO_TR
W
BDG_TR
ECO_TR
MUX_CR4
MUX_CR5
RW
W
DCB03FN
DCB03IN
DCB03OU
RW
RW
RW
TMP_DR0
TMP_DR1
TMP_DR2
TMP_DR3
ACB00CR3
ACB00CR0
ACB00CR1
ACB00CR2
ACB01CR3
ACB01CR0
ACB01CR1
ACB01CR2
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RDI0RI
RW
RW
RW
RW
RW
RW
RW
RDI0SYN
RDI0IS
RDI0LT0
RDI0LT1
RDI0RO0
RDI0RO1
CPU_F
RL
DAC_CR
RW
#
CPU_SCR1
CPU_SCR0
#
Blank fields are Reserved and should not be accessed.
# Access is bit specific.
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10. Electrical Specifications
This section presents the DC and AC electrical specifications of the CY8C24x94 PSoC device family. For the most up to date electrical
specifications, confirm that you have the most recent data sheet by going to the web at http://www.cypress.com/psoc.
o
o
o
Specifications are valid for -40 C ≤ T ≤ 85 C and T ≤ 100 C, except where noted. Specifications for devices running at greater than
A
J
o
o
o
12 MHz are valid for -40 C ≤ T ≤ 70 C and T ≤ 82 C.
A
J
Figure 10-1. Voltage versus CPU Frequency
5.25
4.75
3.00
93 kHz
12 MHz
24 MHz
CPU Frequency
The following table lists the units of measure that are used in this chapter.
Table 10-1. Units of Measure
Symbol
Unit of Measure
degree Celsius
Symbol
μW
Unit of Measure
microwatts
o
C
dB
decibels
mA
ms
mV
nA
ns
milli-ampere
milli-second
milli-volts
fF
femto farad
hertz
Hz
KB
Kbit
kHz
kΩ
1024 bytes
1024 bits
nanoampere
nanosecond
nanovolts
kilohertz
nV
W
kilohm
ohm
MHz
MΩ
μA
μF
μH
μs
μV
μVrms
megahertz
megaohm
pA
pF
pp
ppm
ps
picoampere
picofarad
microampere
microfarad
microhenry
microsecond
microvolts
peak-to-peak
parts per million
picosecond
sps
s
samples per second
sigma: one standard deviation
volts
microvolts root-mean-square
V
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10.1 Absolute Maximum Ratings
Table 10-2. Absolute Maximum Ratings
Symbol
Description
Storage Temperature
Min
-55
Typ
25
Max
+100
Units
Notes
o
T
C
Higher storage temperatures
STG
reduces data retention time. Recom-
mended storage temperature is
o
o
+25 C ± 25 C. Extended duration
o
storage temperatures above 65 C
degrades reliability.
o
T
Ambient Temperature with Power Applied
Supply Voltage on Vdd Relative to Vss
DC Input Voltage
-40
–
–
–
+85
C
A
Vdd
-0.5
+6.0
V
V
V
Vss -
0.5
Vdd +
0.5
I/O
V
DC Voltage Applied to Tri-state
Vss -
0.5
–
Vdd +
0.5
V
I/O2
I
I
Maximum Current into any Port Pin
-25
-50
–
–
+50
+50
mA
mA
MI/O
Maximum Current into any Port Pin
Configured as Analog Driver
MAI/O
ESD
LU
Electro Static Discharge Voltage
Latch-up Current
2000
–
–
–
–
V
Human Body Model ESD.
200
mA
10.2 Operating Temperature
Table 10-3. Operating Temperature
Symbol
Description
Ambient Temperature
Min
-40
Typ
Max
+85
Units
Notes
o
o
o
T
–
C
C
C
A
T
Ambient Temperature using USB
Junction Temperature
-10
–
–
+85
AUSB
T
-40
+100
The temperature rise from ambient to
junction is package specific. See
user must limit the power
J
consumption to comply with this
requirement.
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10.3 DC Electrical Characteristics
10.3.1 DC Chip Level Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ T ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ T ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
A
A
are for design guidance only.
Table 10-4. DC Chip-Level Specifications
Symbol
Vdd
Description
Min
3.0
Typ
Max
5.25
Units
V
Notes
Supply Voltage
–
See DC POR and LVD specifications,
Conditions are Vdd = 5.0V, T = 25 C,
o
I
I
Supply Current, IMO = 24 MHz (5V)
Supply Current, IMO = 24 MHz (3.3V)
–
14
27
mA
DD5
DD3
A
CPU = 3 MHz, SYSCLK doubler
disabled, VC1 = 1.5 MHz, VC2 = 93.75
kHz, VC3 = 93.75 kHz, analog power =
off.
o
–
8
14
mA
Conditions are Vdd = 3.3V, T = 25 C,
A
CPU = 3 MHz, SYSCLK doubler
disabled, VC1 = 1.5 MHz, VC2 = 93.75
kHz, VC3 = 0.367 kHz, analog power =
off.
I
I
Timer, and WDT.
3
4
6.5
25
μA
μA
Conditions are with internal slow speed
SB
[3]
o
oscillator, Vdd = 3.3V, -40 C ≤ T ≤ 55
A
o
C, analog power = off.
Conditions are with internal slow speed
SBH
[3]
o
Timer, and WDT at high temperature.
oscillator, Vdd = 3.3V, 55 C < T ≤ 85
A
o
C, analog power = off.
10.3.2 DC General Purpose I/O Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ T ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ T ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
A
A
are for design guidance only.
Table 10-5. DC GPI/O Specifications
Symbol
Description
Pull-Up Resistor
Pull-Down Resistor
High Output Level
Min
Typ
5.6
5.6
–
Max
Units
kΩ
kΩ
Notes
R
4
4
8
8
–
PU
R
PD
V
Vdd -
1.0
V
I/OH = 10 mA, Vdd = 4.75 to 5.25V (8
total loads, 4 on even port pins (for
example, P0[2], P1[4]), 4 on odd port
pins (for example, P0[3], P1[5])). 80
mA maximum combined I/OH budget.
OH
V
Low Output Level
–
–
0.75
0.8
V
I/OL = 25 mA, Vdd = 4.75 to 5.25V (8
total loads, 4 on even port pins (for
example, P0[2], P1[4]), 4 on odd port
pins (for example, P0[3], P1[5])). 200
mA maximum combined I/OL budget.
Vdd = 3.0 to 5.25.
Vdd = 3.0 to 5.25.
OL
V
V
V
I
Input Low Level
Input High Level
Input Hysterisis
Input Leakage (Absolute Value)
Capacitive Load on Pins as Input
–
2.1
–
–
–
–
–
60
1
3.5
V
V
mV
nA
pF
IL
IH
H
–
–
10
Gross tested to 1 μA.
IL
C
Package and pin dependent.
IN
o
Temp = 25 C.
C
Capacitive Load on Pins as Output
–
3.5
10
pF
Package and pin dependent.
Temp = 25 C.
OUT
o
Note
3. Standby current includes all functions (POR, LVD, WDT, Sleep Time) needed for reliable system operation. This should be compared with devices that have similar
functions enabled.
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10.3.3 DC Full-Speed USB Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -10°C ≤ T ≤ 85°C, or 3.0V to 3.6V and -10°C ≤ T ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
A
A
are for design guidance only.
Table 10-6. DC Full-Speed (12 Mbps) USB Specifications
Symbol
Description
Min
Typ
Max
Units
Notes
USB Interface
V
V
V
Differential Input Sensitivity
0.2
–
–
–
–
–
–
–
–
V
| (D+) - (D-) |
DI
Differential Input Common Mode Range
Single Ended Receiver Threshold
Transceiver Capacitance
0.8
0.8
–
2.5
2.0
20
V
CM
SE
V
C
I
pF
μA
W
V
IN
High-Z State Data Line Leakage
External USB Series Resistor
Static Output High, Driven
-10
23
2.8
10
0V < V < 3.3V.
I/O
IN
R
25
In series with each USB pin.
EXT
V
V
V
3.6
15 kΩ ± 5% to Ground. Internal pull-up
enabled.
UOH
Static Output High, Idle
Static Output Low
2.7
–
–
–
3.6
0.3
V
V
15 kΩ ± 5% to Ground. Internal pull-up
enabled.
UOHI
UOL
O
15 kΩ ± 5% to Ground. Internal pull-up
enabled.
Z
USB Driver Output Impedance
D+/D- Crossover Voltage
28
–
–
44
W
V
Including R
Resistor.
EXT
V
1.3
2.0
CRS
10.3.4 DC Operational Amplifier Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ T ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ T ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
A
A
are for design guidance only.
The Operational Amplifier is a component of both the Analog Continuous Time PSoC blocks and the Analog Switched Capacitor PSoC
blocks. The guaranteed specifications are measured in the Analog Continuous Time PSoC block.
Table 10-7. 5V DC Operational Amplifier Specifications
Symbol
Description
Min
Typ
1.6
1.3
1.2
Max
10
8
7.5
Units
mV
mV
mV
Notes
V
Input Offset Voltage (absolute value)
Power = Low, Opamp Bias = High
Power = Medium, Opamp Bias = High
Power = High, Opamp Bias = High
OSOA
–
–
–
–
–
–
o
TCV
Average Input Offset Voltage Drift
7.0
20
35.0
–
μV/ C
pA
OSOA
I
Input Leakage Current (Port 0 Analog Pins)
Input Capacitance (Port 0 Analog Pins)
Gross tested to 1 μA.
Package and pin dependent. Temp =
EBOA
C
4.5
9.5
pF
INOA
o
25 C.
V
Common Mode Voltage Range
Common Mode Voltage Range (high power
or high opamp bias)
0.0
0.5
–
–
Vdd
Vdd -
0.5
V
The common-mode input voltage
range is measured through an analog
output buffer. The specification
includes the limitations imposed by
the characteristics of the analog
output buffer.
CMOA
G
Open Loop Gain
–
–
dB
OLOA
Power = Low, Opamp Bias = High
Power = Medium, Opamp Bias = High
Power = High, Opamp Bias = High
60
60
80
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Table 10-7. 5V DC Operational Amplifier Specifications (continued)
Symbol
Description
Min
Typ
Max
Units
Notes
V
High Output Voltage Swing (internal signals)
Power = Low, Opamp Bias = High
Power = Medium, Opamp Bias = High
Power = High, Opamp Bias = High
OHIGHO
Vdd -
0.2
Vdd -
–
–
–
–
–
–
V
V
V
A
0.2
Vdd -
0.5
V
Low Output Voltage Swing (internal signals)
Power = Low, Opamp Bias = High
Power = Medium, Opamp Bias = High
OLOWOA
–
–
–
–
–
–
0.2
0.2
0.5
V
V
V
Power = High, Opamp Bias = High
I
Supply Current (including associated AGND
buffer)
SOA
–
–
–
–
–
–
400
500
800
1200
2400
4600
800
900
1000
1600
3200
6400
μA
μA
μA
μA
μA
μA
Power = Low, Opamp Bias = Low
Power = Low, Opamp Bias = High
Power = Medium, Opamp Bias = Low
Power = Medium, Opamp Bias = High
Power = High, Opamp Bias = Low
Power = High, Opamp Bias = High
PSRR
Supply Voltage Rejection Ratio
65
80
–
dB
Vss ≤ VIN ≤ (Vdd - 2.25) or (Vdd -
1.25V) ≤ VIN ≤ Vdd.
OA
10.3.5 DC Low Power Comparator Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ T ≤ 85°C, 3.0V to 3.6V and -40°C ≤ T ≤ 85°C, or 2.4V to 3.0V and -40°C ≤ T ≤ 85°C, respectively. Typical parameters
A
A
A
apply to 5V at 25°C and are for design guidance only.
Table 10-8. DC Low Power Comparator Specifications
Symbol
Description
Min
0.2
Typ
Max
Units
Notes
V
Low power comparator (LPC) reference
voltage range
–
Vdd - 1 V
REFLPC
I
LPC supply current
LPC voltage offset
–
–
10
40
30
μA
mV
SLPC
V
2.5
OSLPC
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10.3.6 DC Analog Output Buffer Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ T ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ T ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
A
A
are for design guidance only.
Table 10-9. 5V DC Analog Output Buffer Specifications
Symbol
Description
Min
Typ
Max
Units
mV
Notes
V
Input Offset Voltage (Absolute Value)
Average Input Offset Voltage Drift
–
–
3
12
–
OSOB
TCV
+6
μV/°C
OSO
B
V
Common-Mode Input Voltage Range
0.5
–
Vdd - 1.0
V
CMOB
R
Output Resistance
Power = Low
Power = High
OUTOB
–
–
0.6
0.6
–
–
W
W
V
High Output Voltage Swing (Load = 32 ohms
to Vdd/2)
Power = Low
Power = High
OHIGHO
0.5 x Vdd +
1.1
0.5 x Vdd +
1.1
–
–
–
–
V
V
B
V
Low Output Voltage Swing (Load = 32 ohms
to Vdd/2)
Power = Low
OLOWOB
–
–
–
–
0.5 x Vdd -
1.3
V
V
Power = High
0.5 x Vdd -
1.3
I
Supply Current Including Bias Cell (No Load)
Power = Low
Power = High
SOB
–
–
1.1
2.6
5.1
8.8
mA
mA
PSRR
Supply Voltage Rejection Ratio
53
64
–
dB
(0.5 x Vdd - 1.3) ≤ V
(Vdd - 2.3).
≤
OB
OUT
Table 10-10. 3.3V DC Analog Output Buffer Specifications
Symbol
Description
Min
Typ
Max
Units
mV
Notes
V
Input Offset Voltage (Absolute Value)
Average Input Offset Voltage Drift
Common-Mode Input Voltage Range
–
3
12
OSOB
TCV
–
+6
-
–
μV/°C
V
OSOB
V
0.5
Vdd - 1.0
CMOB
R
Output Resistance
Power = Low
Power = High
OUTOB
–
–
1
1
–
–
W
W
V
High Output Voltage Swing (Load = 1K ohms
to Vdd/2)
Power = Low
Power = High
OHIGHO
OLOWOB
SOB
0.5 x Vdd +
1.0
0.5 x Vdd +
1.0
–
–
–
–
V
V
B
V
Low Output Voltage Swing (Load = 1K ohms
to Vdd/2)
Power = Low
Power = High
–
–
–
–
0.5 x Vdd -
1.0
0.5 x Vdd -
1.0
V
V
I
Supply Current Including Bias Cell (No Load)
Power = Low
Power = High
0.8
2.0
2.0
4.3
mA
mA
–
PSRR
Supply Voltage Rejection Ratio
34
64
–
dB
(0.5 x Vdd - 1.0) ≤ V
(0.5 x Vdd + 0.9).
≤
OB
OUT
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10.3.7 DC Analog Reference Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ T ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ T ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
A
A
are for design guidance only.
The guaranteed specifications are measured through the Analog Continuous Time PSoC blocks. The power levels for AGND refer to
the power of the Analog Continuous Time PSoC block. The power levels for RefHi and RefLo refer to the Analog Reference Control
register. The limits stated for AGND include the offset error of the AGND buffer local to the Analog Continuous Time PSoC block.
Reference control power is high.
Table 10-11. 5V DC Analog Reference Specifications
Symbol
Description
Min
Typ
Max
Units
BG
–
Bandgap Voltage Reference
1.28
1.30
1.32
V
AGND = Vdd/2
Vdd/2 - 0.04
2 x BG - 0.048
P2[4] - 0.011
BG - 0.009
Vdd/2 - 0.01
2 x BG - 0.030
P2[4]
Vdd/2 + 0.007
2 x BG + 0.024
P2[4] + 0.011
BG + 0.016
V
V
V
V
V
V
V
V
V
–
AGND = 2 x BandGap
–
AGND = P2[4] (P2[4] = Vdd/2)
–
AGND = BandGap
BG + 0.008
1.6 x BG - 0.010
0.000
–
AGND = 1.6 x BandGap
1.6 x BG - 0.022
-0.034
1.6 x BG + 0.018
0.034
–
AGND Block to Block Variation (AGND = Vdd/2)
RefHi = Vdd/2 + BandGap
–
Vdd/2 + BG - 0.10 Vdd/2 + BG
Vdd/2 + BG + 0.10
3 x BG + 0.06
–
RefHi = 3 x BandGap
3 x BG - 0.06
3 x BG
–
RefHi = 2 x BandGap + P2[6] (P2[6] = 1.3V)
2 x BG + P2[6] -
0.113
2 x BG + P2[6] -
0.018
2 x BG + P2[6] +
0.077
–
–
RefHi = P2[4] + BandGap (P2[4] = Vdd/2)
P2[4] + BG - 0.130 P2[4] + BG - 0.016 P2[4] + BG + 0.098 V
RefHi = P2[4] + P2[6] (P2[4] = Vdd/2, P2[6] = 1.3V) P2[4] + P2[6] -
0.133
P2[4] + P2[6] -
0.016
P2[4] + P2[6]+
0.100
V
–
–
–
–
RefHi = 3.2 x BandGap
3.2 x BG - 0.112
3.2 x BG
3.2 x BG + 0.076
V
V
V
V
RefLo = Vdd/2 – BandGap
RefLo = BandGap
Vdd/2 - BG - 0.04 Vdd/2 - BG + 0.024 Vdd/2 - BG + 0.04
BG - 0.06
BG
BG + 0.06
RefLo = 2 x BandGap - P2[6] (P2[6] = 1.3V)
2 x BG - P2[6] -
0.084
2 x BG - P2[6] +
0.025
2 x BG - P2[6] +
0.134
–
–
RefLo = P2[4] – BandGap (P2[4] = Vdd/2)
P2[4] - BG - 0.056 P2[4] - BG + 0.026 P2[4] - BG + 0.107 V
RefLo = P2[4]-P2[6] (P2[4] = Vdd/2, P2[6] = 1.3V) P2[4] - P2[6] -
0.057
P2[4] - P2[6] +
0.026
P2[4] - P2[6] +
0.110
V
Table 10-12. 3.3V DC Analog Reference Specifications
Symbol
Description
Bandgap Voltage Reference
Min
Typ
1.30
Max
1.32
Units
BG
–
1.28
V
V
AGND = Vdd/2
AGND = 2 x BandGap
Vdd/2 - 0.03
Not Allowed
P2[4] - 0.008
BG - 0.009
1.6 x BG - 0.027
-0.034
Vdd/2 - 0.01
Vdd/2 + 0.005
–
–
AGND = P2[4] (P2[4] = Vdd/2)
P2[4] + 0.001
BG + 0.005
1.6 x BG - 0.010
0.000
P2[4] + 0.009
BG + 0.015
1.6 x BG + 0.018
0.034
V
V
V
V
–
AGND = BandGap
–
AGND = 1.6 x BandGap
–
AGND Column to Column Variation (AGND =
Vdd/2)
–
–
–
–
–
RefHi = Vdd/2 + BandGap
Not Allowed
Not Allowed
Not Allowed
Not Allowed
RefHi = 3 x BandGap
RefHi = 2 x BandGap + P2[6] (P2[6] = 0.5V)
RefHi = P2[4] + BandGap (P2[4] = Vdd/2)
RefHi = P2[4] + P2[6] (P2[4] = Vdd/2, P2[6] = 0.5V) P2[4] + P2[6] -
0.075
P2[4] + P2[6] -
0.009
P2[4] + P2[6] +
0.057
V
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Table 10-12. 3.3V DC Analog Reference Specifications (continued)
Symbol
Description
RefHi = 3.2 x BandGap
Min
Not Allowed
Not Allowed
Not Allowed
Not Allowed
Not Allowed
Typ
Max
Units
–
–
–
–
–
–
RefLo = Vdd/2 - BandGap
RefLo = BandGap
RefLo = 2 x BandGap - P2[6] (P2[6] = 0.5V)
RefLo = P2[4] – BandGap (P2[4] = Vdd/2)
RefLo = P2[4]-P2[6] (P2[4] = Vdd/2, P2[6] = 0.5V) P2[4] - P2[6] -
0.048
P2[4]- P2[6] +
0.022
P2[4] - P2[6] +
0.092
V
10.3.8 DC Analog PSoC Block Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ T ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ T ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
A
A
are for design guidance only.
Table 10-13. DC Analog PSoC Block Specifications
Symbol
Description
Min
Typ
12.2
80
Max
Units
kΩ
fF
Notes
R
Resistor Unit Value (Continuous Time)
Capacitor Unit Value (Switched Capacitor)
–
–
–
–
CT
SC
C
Note
4. AGND tolerance includes the offsets of the local buffer in the PSoC block. Bandgap voltage is 1.3V ± 0.02V.
5. Avoid using P2[4] for digital signaling when using an analog resource that depends on the Analog Reference. Some coupling of the digital signal may appear on the
AGND.
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10.3.9 DC POR and LVD Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ T ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ T ≤ 85°C, respectively. Typical parameters apply to 5V or 3.3V at 25°C and are
A
A
for design guidance only.
Note The bits PORLEV and VM in the table below refer to bits in the VLT_CR register. See the PSoC Programmable System-on-Chip
Technical Reference Manual for more information on the VLT_CR register.
Table 10-14. DC POR and LVD Specifications
Symbol
Description
Min
Typ
2.91
4.39
4.55
Max
Units
Notes
Vdd Value for PPOR Trip (positive ramp)
PORLEV[1:0] = 00b
PORLEV[1:0] = 01b
V
V
V
V
V
V
PPOR0R
PPOR1R
PPOR2R
–
–
–
–
PORLEV[1:0] = 10b
Vdd Value for PPOR Trip (negative ramp)
PORLEV[1:0] = 00b
PORLEV[1:0] = 01b
V
V
V
2.82
4.39
4.55
V
V
V
PPOR0
PPOR1
PPOR2
PORLEV[1:0] = 10b
PPOR Hysteresis
PORLEV[1:0] = 00b
PORLEV[1:0] = 01b
PORLEV[1:0] = 10b
V
V
V
–
–
–
92
0
0
–
–
–
mV
mV
mV
PH0
PH1
PH2
Vdd Value for LVD Trip
VM[2:0] = 000b
VM[2:0] = 001b
VM[2:0] = 010b
VM[2:0] = 011b
VM[2:0] = 100b
VM[2:0] = 101b
VM[2:0] = 110b
VM[2:0] = 111b
[6]
[7]
V
V
V
V
V
V
V
V
2.86
2.96
3.07
3.92
4.39
4.55
4.63
4.72
2.92
3.02
3.13
4.00
4.48
4.64
4.73
4.81
2.98
3.08
3.20
4.08
4.57
4.74
4.82
4.91
V
V
V
V
V
V
V
V
V
LVD0
LVD1
LVD2
LVD3
LVD4
LVD5
LVD6
LVD7
Notes
6. Always greater than 50 mV above PPOR (PORLEV = 00) for falling supply.
7. Always greater than 50 mV above PPOR (PORLEV = 10) for falling supply.
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10.3.10 DC Programming Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ T ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ T ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
A
A
are for design guidance only.
Table 10-15. DC Programming Specifications
Symbol
Description
Min
Typ
15
Max
30
Units
mA
Notes
I
Supply Current During Programming or Verify
–
–
DDP
V
Input Low Voltage During Programming or
Verify
–
–
–
–
–
0.8
V
ILP
V
Input High Voltage During Programming or
Verify
2.1
–
–
V
IHP
I
I
Input Current when Applying Vilp to P1[0] or
P1[1] During Programming or Verify
0.2
1.5
mA
mA
V
Driving internal pull-down
resistor.
ILP
Input Current when Applying Vihp to P1[0] or
P1[1] During Programming or Verify
–
Driving internal pull-down
resistor.
IHP
V
V
Output Low Voltage During Programming or
Verify
–
Vss +
0.75
OLV
Output High Voltage During Programming or Vdd- 1.0 –
Verify
Vdd
V
OHV
Flash
Flash Endurance (per block)
50,000
–
–
–
–
–
Erase/write cycles per block.
Erase/write cycles.
ENP
ENT
DR
B
Flash
Flash Endurance (total)
1,800,0
00
–
–
Flash
Flash Data Retention
10
–
Years
Note
8. A maximum of 36 x 50,000 block endurance cycles is allowed. This may be balanced between operations on 36x1 blocks of 50,000 maximum cycles each, 36x2 blocks
of 25,000 maximum cycles each, or 36x4 blocks of 12,500 maximum cycles each (to limit the total number of cycles to 36x50,000 and that no single block ever sees
more than 50,000 cycles).
For the full industrial range, the user must employ a temperature sensor user module (FlashTemp) and feed the result to the temperature argument before writing.
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10.4 AC Electrical Characteristics
10.4.1 AC Chip-Level Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ T ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ T ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
A
A
are for design guidance only.
Table 10-16. AC Chip-Level Specifications
Symbol
Description
Min
Typ
Max
Units
Notes
F
Internal Main Oscillator Frequency for 24 MHz 23.04 24
(5V)
24.96
MHz
Trimmed for 5V operation
using factory trim values.
IMO245V
IMO243V
IMOUSB5
F
Internal Main Oscillator Frequency for 24 MHz 22.08 24
(3.3V)
25.92
24.06
MHz
MHz
Trimmed for 3.3V operation
using factory trim values.
F
Internal Main Oscillator Frequency with USB 23.94 24
-10°C ≤ T ≤ 85°C
4.35 ≤ Vdd ≤ 5.15
A
(5V)
V
Frequency locking enabled and USB traffic
present.
F
Internal Main Oscillator Frequency with USB 23.94 24
24.06
MHz
-0°C ≤ T ≤ 70°C
3.15 ≤ Vdd ≤ 3.45
IMOUSB3
A
(3.3V)
V
Frequency locking enabled and USB traffic
present.
F
F
F
CPU Frequency (5V Nominal)
0.93
0.93
0
24
12
48
24.96
12.96
49.92
MHz
MHz
MHz
CPU1
CPU2
BLK5
CPU Frequency (3.3V Nominal)
Digital PSoC Block Frequency (5V Nominal)
Refer to the AC Digital Block
Specifications.
F
F
Digital PSoC Block Frequency (3.3V Nominal) 0
Internal Low Speed Oscillator Frequency 15
24
25.92
64
MHz
kHz
ns
BLK3
32K1
32
Jitter32k 32 kHz Period Jitter
–
–
100
50
Step24M 24 MHz Trim Step Size
Fout48M 48 MHz Output Frequency
–
kHz
MHz
46.08 48.0
49.92
Trimmed. Utilizing factory
trim values.
Jitter24M 24 MHz Period Jitter (IMO) Peak-to-Peak
1
–
–
0
300
–
ps
F
Maximum frequency of signal on row input or
row output.
12.96
–
MHz
μs
MAX
T
Supply Ramp Time
–
RAMP
Figure 10-2. 24 MHz Period Jitter (IMO) Timing Diagram
Jitter24M1
F24M
Notes
9. 4.75V < Vdd < 5.25V.
10. Accuracy derived from Internal Main Oscillator with appropriate trim for Vdd range.
11. 3.0V < Vdd < 3.6V. See Application Note AN2012 “Adjusting PSoC Microcontroller Trims for Dual Voltage-Range Operation” for information on trimming for operation
at 3.3V.
12. See the individual user module data sheets for information on maximum frequencies for user modules
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10.0.1 AC General Purpose I/O Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ T ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ T ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
A
A
are for design guidance only.
Table 10-17. AC GPI/O Specifications
Symbol
Description
Min
Typ
Max
12
Units
MHz
ns
Notes
F
GPI/O Operating Frequency
0
–
–
–
Normal Strong Mode
GPI/O
TRiseF
Rise Time, Normal Strong Mode, Cload = 50 pF 3
Fall Time, Normal Strong Mode, Cload = 50 pF 2
18
18
–
Vdd = 4.5 to 5.25V, 10% - 90%
Vdd = 4.5 to 5.25V, 10% - 90%
Vdd = 3 to 5.25V, 10% - 90%
Vdd = 3 to 5.25V, 10% - 90%
TFallF
TRiseS
TFallS
ns
Rise Time, Slow Strong Mode, Cload = 50 pF 10
Fall Time, Slow Strong Mode, Cload = 50 pF 10
27
22
ns
–
ns
Figure 10-3. GPI/O Timing Diagram
90%
GPIO
Pin
Output
Voltage
10%
TRiseF
TRiseS
TFallF
TFallS
10.0.1 AC Full-Speed USB Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -10°C ≤ T ≤ 85°C, or 3.0V to 3.6V and -10°C ≤ T ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
A
A
are for design guidance only.
Table 10-18. AC Full-Speed (12 Mbps) USB Specifications
Symbol Description Min
Transition Rise Time
Transition Fall Time
Rise/Fall Time Matching: (T /T )
Typ
Max
20
Units
ns
Notes
For 50 pF load.
T
4
–
–
–
RFS
T
T
T
4
20
ns
For 50 pF load.
For 50 pF load.
FSS
90
111
%
RFMFS
DRATEFS
R
F
Full-Speed Data Rate
12 -
12
12 +
Mbps
0.25%
0.25%
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10.0.2 AC Operational Amplifier Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ T ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ T ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
A
A
are for design guidance only.
Settling times, slew rates, and gain bandwidth are based on the Analog Continuous Time PSoC block.
Power = High and Opamp Bias = High is not supported at 3.3V.
Table 10-19. 5V AC Operational Amplifier Specifications
Symbol
Description
Min
Typ
Max
Units
T
Rising Settling Time from 80% of ΔV to 0.1% of ΔV (10
pF load, Unity Gain)
ROA
Power = Low, Opamp Bias = Low
Power = Medium, Opamp Bias = High
Power = High, Opamp Bias = High
–
–
–
–
–
–
3.9
0.72
0.62
μs
μs
μs
T
Falling Settling Time from 20% of ΔV to 0.1% of ΔV (10
pF load, Unity Gain)
SOA
Power = Low, Opamp Bias = Low
Power = Medium, Opamp Bias = High
Power = High, Opamp Bias = High
–
–
–
–
–
–
5.9
0.92
0.72
μs
μs
μs
SR
SR
Rising Slew Rate (20% to 80%)(10 pF load, Unity
Gain)
Power = Low, Opamp Bias = Low
Power = Medium, Opamp Bias = High
Power = High, Opamp Bias = High
ROA
0.15
1.7
6.5
–
–
–
–
–
–
V/μs
V/μs
V/μs
Falling Slew Rate (20% to 80%)(10 pF load, Unity
Gain)
Power = Low, Opamp Bias = Low
Power = Medium, Opamp Bias = High
Power = High, Opamp Bias = High
FOA
0.01
0.5
4.0
–
–
–
–
–
–
V/μs
V/μs
V/μs
BW
Gain Bandwidth Product
OA
Power = Low, Opamp Bias = Low
Power = Medium, Opamp Bias = High
Power = High, Opamp Bias = High
0.75
3.1
5.4
–
–
–
–
–
–
MHz
MHz
MHz
E
Noise at 1 kHz (Power = Medium, Opamp Bias = High) –
100
–
nV/rt-Hz
NOA
Table 10-20. 3.3V AC Operational Amplifier Specifications
Symbol
Description
Min
Typ
Max
Units
T
Rising Settling Time from 80% of ΔV to 0.1% of ΔV (10
pF load, Unity Gain)
ROA
Power = Low, Opamp Bias = Low
Power = Medium, Opamp Bias = High
–
–
–
–
3.92
0.72
μs
μs
T
Falling Settling Time from 20% of ΔV to 0.1% of ΔV (10
pF load, Unity Gain)
SOA
Power = Low, Opamp Bias = Low
Power = Medium, Opamp Bias = High
–
–
–
–
5.41
0.72
μs
μs
SR
SR
Rising Slew Rate (20% to 80%)(10 pF load, Unity Gain)
Power = Low, Opamp Bias = Low
Power = Medium, Opamp Bias = High
ROA
0.31
2.7
–
–
–
–
V/μs
V/μs
Falling Slew Rate (20% to 80%)(10 pF load, Unity
Gain)
Power = Low, Opamp Bias = Low
FOA
0.24
1.8
–
–
–
–
V/μs
V/μs
Power = Medium, Opamp Bias = High
BW
Gain Bandwidth Product
Power = Low, Opamp Bias = Low
Power = Medium, Opamp Bias = High
OA
0.67
2.8
–
–
–
–
MHz
MHz
E
Noise at 1 kHz (Power = Medium, Opamp Bias = High) –
100
–
nV/rt-Hz
NOA
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When bypassed by a capacitor on P2[4], the noise of the analog ground signal distributed to each block is reduced by a factor of up
to 5 (14 dB). This is at frequencies above the corner frequency defined by the on-chip 8.1k resistance and the external capacitor.
Figure 10-4. Typical AGND Noise with P2[4] Bypass
dBV/rtHz
10000
0
0.01
0.1
1.0
10
1000
100
0.001
0.01
0.1 Freq (kHz)
1
10
100
At low frequencies, the opamp noise is proportional to 1/f, power independent, and determined by device geometry. At high
frequencies, increased power level reduces the noise spectrum level.
Figure 10-5. Typical Opamp Noise
nV/rtHz
10000
PH_BH
PH_BL
PM_BL
PL_BL
1000
100
10
0.001
0.01
0.1
1
10
100
Freq (kHz)
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10.0.1 AC Low Power Comparator Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ T ≤ 85°C, 3.0V to 3.6V and -40°C ≤ T ≤ 85°C, or 2.4V to 3.0V and -40°C ≤ T ≤ 85°C, respectively. Typical parameters
A
A
A
apply to 5V at 25°C and are for design guidance only.
Table 10-21. AC Low Power Comparator Specifications
Symbol
Description
LPC response time
Min
Typ
Max
50
Units
Notes
T
–
–
μs
≥ 50 mV overdrive comparator
reference set within V
RLPC
.
REFLPC
10.0.2 AC Digital Block Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ T ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ T ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
A
A
are for design guidance only.
Table 10-22. AC Digital Block Specifications
Function
Description
Capture Pulse Width
Min
Typ
Max
Units
ns
Notes
Timer
50
–
–
–
–
–
–
–
Maximum Frequency, No Capture
Maximum Frequency, With Capture
–
49.92 MHz
25.92 MHz
4.75V < Vdd < 5.25V.
–
Counter Enable Pulse Width
Maximum Frequency, No Enable Input
50
–
–
ns
49.92 MHz
25.92 MHz
4.75V < Vdd < 5.25V.
Maximum Frequency, Enable Input
Kill Pulse Width:
–
Dead
Band
Asynchronous Restart Mode
Synchronous Restart Mode
Disable Mode
20
50
50
–
–
–
–
–
–
–
–
–
ns
ns
ns
Maximum Frequency
49.92 MHz
49.92 MHz
4.75V < Vdd < 5.25V.
4.75V < Vdd < 5.25V.
CRCPRS Maximum Input Clock Frequency
–
(PRS
Mode)
CRCPRS Maximum Input Clock Frequency
(CRC
Mode)
–
–
–
24.6
8.2
MHz
MHz
SPIM
Maximum Input Clock Frequency
Maximum Input Clock Frequency
–
–
Maximum data rate at 4.1 MHz due
to 2 x over clocking.
SPIS
–
–
–
4.1
–
MHz
ns
Width of SS_ Negated Between Transmissions 50
Trans-
mitter
Maximum Input Clock Frequency
–
24.6
MHz
Maximum data rate at 3.08 MHz
due to 8 x over clocking.
Receiver Maximum Input Clock Frequency
–
–
24.6
MHz
Maximum data rate at 3.08 MHz
due to 8 x over clocking.
Note
13. 50 ns minimum input pulse width is based on the input synchronizers running at 24 MHz (42 ns nominal period).
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10.0.3 AC External Clock Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ T ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ T ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
A
A
are for design guidance only.
Table 10-23. AC External Clock Specifications
Symbol
Description
Frequency for USB Applications
Duty Cycle
Min
23.94
47
Typ
24
Max
24.06
53
Units
MHz
%
Notes
F
OSCEXT
–
–
50
–
Power up to IMO Switch
150
–
μs
10.0.4 AC Analog Output Buffer Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ T ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ T ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
A
A
are for design guidance only.
Table 10-24. 5V AC Analog Output Buffer Specifications
Symbol
Description
Min
Typ
Max
2.5
Units
Notes
T
Rising Settling Time to 0.1%, 1V Step, 100pF
ROB
Load
Power = Low
Power = High
–
–
–
–
μs
μs
2.5
T
Falling Settling Time to 0.1%, 1V Step, 100pF
Load
Power = Low
Power = High
SOB
–
–
–
–
2.2
2.2
μs
μs
SR
SR
Rising Slew Rate (20% to 80%), 1V Step, 100
pF Load
Power = Low
Power = High
ROB
0.65
0.65
–
–
–
–
V/μs
V/μs
Falling Slew Rate (80% to 20%), 1V Step, 100
pF Load
Power = Low
Power = High
FOB
0.65
0.65
–
–
–
–
V/μs
V/μs
BW
BW
Small Signal Bandwidth, 20mV , 3dB BW,
OBSS
OBLS
pp
100 pF Load
Power = Low
Power = High
0.8
0.8
–
–
–
–
MHz
MHz
Large Signal Bandwidth, 1V , 3dB BW, 100
pp
pF Load
300
300
–
–
–
–
kHz
kHz
Power = Low
Power = High
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Table 10-25. 3.3V AC Analog Output Buffer Specifications
Symbol
Description
Min
Typ
Max
3.8
Units
Notes
T
Rising Settling Time to 0.1%, 1V Step, 100 pF
ROB
Load
Power = Low
Power = High
–
–
–
–
μs
μs
3.8
T
Falling Settling Time to 0.1%, 1V Step, 100 pF
Load
Power = Low
Power = High
SOB
–
–
–
–
2.6
2.6
μs
μs
SR
SR
Rising Slew Rate (20% to 80%), 1V Step, 100
pF Load
Power = Low
Power = High
ROB
0.5
0.5
–
–
–
–
V/μs
V/μs
Falling Slew Rate (80% to 20%), 1V Step, 100
pF Load
Power = Low
Power = High
FOB
0.5
0.5
–
–
–
–
V/μs
V/μs
BW
BW
Small Signal Bandwidth, 20mV , 3dB BW,
OBSS
OBLS
pp
100 pF Load
Power = Low
Power = High
0.7
0.7
–
–
–
–
MHz
MHz
Large Signal Bandwidth, 1V , 3dB BW, 100
pp
pF Load
200
200
–
–
–
–
kHz
kHz
Power = Low
Power = High
10.0.5 AC Programming Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ T ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ T ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
A
A
are for design guidance only.
Table 10-26. AC Programming Specifications
Symbol
Description
Rise Time of SCLK
Min
Typ
Max
20
Units
ns
Notes
T
1
1
–
–
–
–
–
RSCLK
FSCLK
SSCLK
HSCLK
SCLK
T
T
T
F
T
T
T
T
Fall Time of SCLK
20
–
ns
Data Set up Time to Falling Edge of SCLK
40
ns
Data Hold Time from Falling Edge of SCLK 40
–
ns
Frequency of SCLK
0
–
–
–
–
8
MHz
ms
ms
ns
Flash Erase Time (Block)
10
30
–
–
ERASEB
WRITE
DSCLK
DSCLK3
Flash Block Write Time
–
Data Out Delay from Falling Edge of SCLK
Data Out Delay from Falling Edge of SCLK
45
50
Vdd > 3.6
3.0 ≤ Vdd ≤ 3.6
–
ns
Document Number: 38-12018 Rev. *M
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2
10.0.6 AC I C Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ T ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ T ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and
A
A
are for design guidance only.
2
Table 10-27. AC Characteristics of the I C SDA and SCL Pins for Vdd
Standard Mode
Fast Mode
Min Max
Symbol
Description
Units
kHz
Notes
Min
Max
100
F
SCL Clock Frequency
0
0
400
–
SCLI2C
T
Hold Time (repeated) START Condition. After 4.0
this period, the first clock pulse is generated.
–
0.6
μs
HDSTAI2
C
T
LOW Period of the SCL Clock
HIGH Period of the SCL Clock
4.7
4.0
–
–
–
1.3
0.6
0.6
–
–
–
μs
μs
μs
LOWI2C
HIGHI2C
SUSTAI2
T
T
Set-up Time for a Repeated START Condition 4.7
C
T
Data Hold Time
0
–
–
–
–
–
0
–
μs
ns
μs
μs
ns
HDDATI2
SUDATI2
SUSTOI2
BUFI2C
SPI2C
C
T
Data Set-up Time
250
4.0
100
0.6
1.3
0
–
C
T
Set-up Time for STOP Condition
–
C
T
Bus Free Time Between a STOP and START 4.7
Condition
–
T
Pulse Width of spikes are suppressed by the
input filter.
–
50
2
Figure 10-6. Definition for Timing for Fast/Standard Mode on the I C Bus
SDA
SCL
TSPI2C
TLOWI2C
TSUDATI2C
THDSTAI2C
TBUFI2C
TSUSTOI2C
TSUSTAI2C
THDDATI2C
THDSTAI2C
THIGHI2C
S
Sr
P
S
Note
14. A Fast-Mode I2C-bus device can be used in a Standard-Mode I2C-bus system, but the requirement t
Š 250 ns must then be met. This automatically is the case
SU;DAT
if the device does not stretch the LOW period of the SCL signal. If such device does stretch the LOW period of the SCL signal, it must output the next data bit to the
SDA line t + t = 1000 + 250 = 1250 ns (according to the Standard-Mode I2C-bus specification) before the SCL line is released.
rmax
SU;DAT
Document Number: 38-12018 Rev. *M
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11. Packaging Dimensions
This section illustrates the package specification for the CY8C24x94 PSoC devices, along with the thermal impedance for the package
and solder reflow peak temperatures.
Important Note Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of
the emulation tools’ dimensions, refer to the document titled PSoC Emulator Pod Dimensions at
Figure 11-1. 56-Pin (8x8 mm) QFN
001-12921 **
Document Number: 38-12018 Rev. *M
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Figure 11-2. 68-Pin (8x8 mm x 0.89 mm) QFN
51-85214 *C
Important Note
■ For information on the preferred dimensions for mounting QFN packages, see the following Application Note at
■ Pinned vias for thermal conduction are not required for the low-power PSoC device.
Figure 11-3. 68-Pin SAWN QFN (8X8 mm X 0.90 mm)
001-09618 *A
Document Number: 38-12018 Rev. *M
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Figure 11-4. 100-Ball (6x6 mm) VFBGA
51-85209 *B
Figure 11-5. 100-Pin (14x14 x 1.4 mm) TQFP
51-85048 *C
Document Number: 38-12018 Rev. *M
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11.1 Thermal Impedance
Table 11-1. Thermal Impedance for the Package
Package
Typical θ
JA
o
56 QFN
68 QFN
12.93 C/W
o
13.05 C/W
o
100 VFBGA
100 TQFP
65 C/W
o
51 C/W
11.2 Solder Reflow Peak Temperature
Following is the minimum solder reflow peak temperature to achieve good solderability.
Table 11-2. Solder Reflow Peak Temperature
Package
Minimum Peak Temperature
Maximum Peak Temperature
o
o
56 QFN
68 QFN
240 C
260 C
o
o
240 C
260 C
o
o
100 VFBGA
240 C
260 C
Notes
15. T = T + POWER x θ
J
A
JA
16. To achieve the thermal impedance specified for the QFN package, the center thermal pad should be soldered to the PCB ground plane.
o
o
17. Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5 C with Sn-Pb or 245 ± 5 C with Sn-Ag-Cu paste.
Refer to the solder manufacturer specifications
Document Number: 38-12018 Rev. *M
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12. Development Tool Selection
12.1 Software
■ iMAGEcraft C Compiler (Registration Required)
■ ISSP Cable
12.1.1 PSoC Designer™
■ USB 2.0 Cable and Blue Cat-5 Cable
■ 2 CY8C29466-24PXI 28-PDIP Chip Samples
At the core of the PSoC development software suite is PSoC
Designer. Used by thousands of PSoC developers, this robust
software has been facilitating PSoC designs for half a decade.
PSoC Designer is available free of charge at
http://www.cypress.com under DESIGN RESOURCES >>
Software and Drivers.
12.2.2 CY3210-ExpressDK PSoC Express Development Kit
The CY3210-ExpressDK is for advanced prototyping and devel-
opment with PSoC Express (may be used with ICE-Cube
2
In-Circuit Emulator). It provides access to I C buses, voltage
12.1.2 PSoC Programmer
reference, switches, upgradeable modules and more. The kit
includes:
Flexible enough to be used on the bench in development, yet
suitable for factory programming, PSoC Programmer works
either as a standalone programming application or it can operate
directly from PSoC Designer or PSoC Express. PSoC
Programmer software is compatible with both PSoC ICE-Cube
In-Circuit Emulator and PSoC MiniProg. PSoC programmer is
available free of charge at http://www.cypress.com/psocpro-
grammer.
■ PSoC Express Software CD
■ Express Development Board
■ 4 Fan Modules
■ 2 Proto Modules
■ MiniProg In-System Serial Programmer
■ MiniEval PCB Evaluation Board
■ Jumper Wire Kit
12.1.3 C Compilers
PSoC Designer comes with a free HI-TECH C Lite C compiler.
The HI-TECH C Lite compiler is free, supports all PSoC devices,
integrates fully with PSoC Designer and PSoC Express, and
runs on Windows versions up to 32-bit Vista. Compilers with
additional features are available at additional cost from their
manufactures.
■ USB 2.0 Cable
■ Serial Cable (DB9)
■ 110 ~ 240V Power Supply, Euro-Plug Adapter
■ 2 CY8C24423A-24PXI 28-PDIP Chip Samples
■ 2 CY8C27443-24PXI 28-PDIP Chip Samples
■ 2 CY8C29466-24PXI 28-PDIP Chip Samples
■ HI-TECH C PRO for the PSoC is available from
12.2 Development Kits
12.3 Evaluation Tools
All development kits can be purchased from the Cypress Online
Store.
All evaluation tools can be purchased from the Cypress Online
Store.
12.2.1 CY3215-DK Basic Development Kit
12.3.1 CY3210-MiniProg1
The CY3215-DK is for prototyping and development with PSoC
Designer. This kit supports in-circuit emulation and the software
interface allows users to run, halt, and single step the processor
and view the content of specific memory locations. Advance
emulation features also supported through PSoC Designer. The
kit includes:
The CY3210-MiniProg1 kit allows a user to program PSoC
devices via the MiniProg1 programming unit. The MiniProg is a
small, compact prototyping programmer that connects to the PC
via a provided USB 2.0 cable. The kit includes:
■ MiniProg Programming Unit
■ PSoC Designer Software CD
■ ICE-Cube In-Circuit Emulator
■ ICE Flex-Pod for CY8C29x66 Family
■ Cat-5 Adapter
■ MiniEval Socket Programming and Evaluation Board
■ 28-Pin CY8C29466-24PXI PDIP PSoC Device Sample
■ 28-Pin CY8C27443-24PXI PDIP PSoC Device Sample
■ PSoC Designer Software CD
■ Mini-Eval Programming Board
■ 110 ~ 240V Power Supply, Euro-Plug Adapter
■ Getting Started Guide
■ USB 2.0 Cable
Document Number: 38-12018 Rev. *M
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12.3.2 CY3210-PSoCEval1
12.4 Device Programmers
The CY3210-PSoCEval1 kit features an evaluation board and
the MiniProg1 programming unit. The evaluation board includes
an LCD module, potentiometer, LEDs, and plenty of bread-
boarding space to meet all of your evaluation needs. The kit
includes:
All device programmers can be purchased from the Cypress
Online Store.
12.4.1 CY3216 Modular Programmer
The CY3216 Modular Programmer kit features a modular
programmer and the MiniProg1 programming unit. The modular
programmer includes three programming module cards and
supports multiple Cypress products. The kit includes:
■ Evaluation Board with LCD Module
■ MiniProg Programming Unit
■ 28-Pin CY8C29466-24PXI PDIP PSoC Device Sample (2)
■ PSoC Designer Software CD
■ Getting Started Guide
■ Modular Programmer Base
■ 3 Programming Module Cards
■ MiniProg Programming Unit
■ PSoC Designer Software CD
■ Getting Started Guide
■ USB 2.0 Cable
12.3.3 CY3214-PSoCEvalUSB
The CY3214-PSoCEvalUSB evaluation kit features a devel-
opment board for the CY8C24794-24LFXI PSoC device. Special
features of the board include both USB and capacitive sensing
development and debugging support. This evaluation board also
includes an LCD module, potentiometer, LEDs, an enunciator
and plenty of bread boarding space to meet all of your evaluation
needs. The kit includes:
■ USB 2.0 Cable
12.4.2 CY3207ISSP In-System Serial Programmer (ISSP)
The CY3207ISSP is a production programmer. It includes
protection circuitry and an industrial case that is more robust than
the MiniProg in a production-programming environment.
Note: CY3207ISSP needs special software and is not
■ PSoCEvalUSB Board
■ LCD Module
compatible with PSoC Programmer. The kit includes:
■ CY3207 Programmer Unit
■ PSoC ISSP Software CD
■ MIniProg Programming Unit
■ Mini USB Cable
■ 110 ~ 240V Power Supply, Euro-Plug Adapter
■ USB 2.0 Cable
■ PSoC Designer and Example Projects CD
■ Getting Started Guide
■ Wire Pack
12.5 Accessories (Emulation and Programming)
Table 12-1. Emulation and Programming Accessories
Part #
Pin Package
56 QFN
56 QFN
Flex-Pod Kit
Foot Kit
Adapter
CY8C24794-24LFXI
CY8C24894-24LFXI
CY3250-24X94QFN
CY3250-24X94QFN
CY3250-56QFN-FK
CY3250-56QFN-FK
AS-56-28
AS-28-28-02SS-6ENG-GANG
12.5.1 3rd-Party Tools
12.5.2 Build a PSoC Emulator into Your Board
Several tools have been specially designed by the following
3rd-party vendors to accompany PSoC devices during devel-
opment and production. Specific details for each of these tools
Evaluation Boards.
For details on how to emulate your circuit before going to volume
production using an on-chip debug (OCD) non-production PSoC
device, see Application Note “Debugging - Build a PSoC
Emulator
into
Your
Board
-
AN2323”
at
Notes
18. Flex-Pod kit includes a practice flex-pod and a practice PCB, in addition to two flex-pods.
19. Foot kit includes surface mount feet that are soldered to the target PCB.
20. Programming adapter converts non-DIP package to DIP footprint. Specific details and ordering information for each of the adapters are found at
Document Number: 38-12018 Rev. *M
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13. Ordering Information
Table 13-1. CY8C24x94 PSoC Device’s Key Features and Ordering Information
56 Pin (8x8 mm) QFN
CY8C24794-24LFXI
CY8C24794-24LFXIT
16K 1K
16K 1K
-40°C to +85°C
-40°C to +85°C
4
4
6
6
50
50
48
48
2
2
No
No
56 Pin (8x8 mm) QFN
(Tape and Reel)
56 Pin (8x8 mm) QFN
CY8C24894-24LFXI
CY8C24894-24LFXIT
16K 1K
16K 1K
-40°C to +85°C
-40°C to +85°C
4
4
6
6
49
49
47
47
2
2
Yes
Yes
56 Pin (8x8 mm) QFN
(Tape and Reel)
68 Pin OCD (8x8 mm) QFN
68 Pin (8x8 mm) QFN
CY8C24094-24LFXI
CY8C24994-24LFXI
CY8C24994-24LFXIT
16K 1K
16K 1K
16K 1K
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
4
4
4
6
6
6
56
56
56
48
48
48
2
2
2
Yes
Yes
Yes
68 Pin (8x8 mm) QFN
(Tape and Reel)
68-Pin QFN (Sawn)
68-Pin QFN (Sawn)
CY8C24994-24LTXI
CY8C24994-24LTXIT
CY8C24094-24BVXI
16K 1K
16K 1K
16K 1K
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
4
4
4
6
6
6
56
56
56
48
48
48
2
2
2
Yes
Yes
Yes
VFBGA
100 Ball (6x6 mm) VFBGA
CY8C24994-24BVXI
CY8C24094-24AXI
CY8C24094-24LTXI
CY8C24094-24LTXIT
16K 1K
16K 1K
16K 1K
16K 1K
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
4
4
4
4
6
6
6
6
56
56
56
56
48
48
48
48
2
2
2
2
Yes
Yes
Yes
Yes
100 Pin OCD TQFP
68-Pin QFN (Sawn)
68-Pin QFN (Sawn)
Note For Die sales information, contact a local Cypress sales office or Field Applications Engineer (FAE).
Document Number: 38-12018 Rev. *M
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13.1 Ordering Code Definitions
CY 8 C 24 XXX-SP XX
Package Type:
Thermal Rating:
C = Commercial
I = Industrial
PX = PDIP Pb-Free
SX = SOIC Pb-Free
PVX = SSOP Pb-Free
LFX/LKX/LTX = QFN Pb-Free
AX = TQFP Pb-Free
E = Extended
BVX = VFBGA Pb-Free
Speed: 24 MHz
Part Number
Family Code
Technology Code: C = CMOS
Marketing Code: 8 = Cypress PSoC
Company ID: CY = Cypress
Note
21. This part may be used for in-circuit debugging. It is NOT available for production.
Document Number: 38-12018 Rev. *M
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14. Document History Page
Document Title: CY8C24094, CY8C24794, CY8C24894 and CY8C24994 PSoC® Programmable System-on-Chip™
Document Number: 38-12018
Submission
Date
Orig. of
Change
Rev. ECN No.
Description of Change
**
133189 01.27.2004
251672 See ECN
NWJ
New silicon and new document – Advance Data Sheet.
*A
SFV
First Preliminary Data Sheet. Changed title to encompass only the CY8C24794
because the CY8C24494 and CY8C24694 are not being offered by Cypress.
*B
*C
289742 See ECN
335236 See ECN
HMT
Add standard DS items from SFV memo. Add Analog Input Mux on pinouts. 2
MACs. Change 512 bytes of SRAM to 1K. Add dimension key to package. Remove
HAPI. Update diagrams, registers and specs.
HMT
Add CY logo. Update CY copyright. Update new CY.com URLs. Re-add ISSP
programming pinout notation. Add Reflow Temp. table. Update features (MAC,
Oscillator, and voltage range), registers (INT_CLR2/MSK2, second MAC), and
specs. (Rext, IMO, analog output buffer...).
*D
344318 See ECN
HMT
Add new color and logo. Expand analog arch. diagram. Fix I/O #. Update Electrical
Specifications.
*E
*F
346774 See ECN
349566 See ECN
HMT
HMT
Add USB temperature specifications. Make data sheet Final.
Remove USB logo. Add URL to preferred dimensions for mounting MLF
packages.
*G
*H
393164 See ECN
469243 See ECN
HMT
HMT
Add new device, CY8C24894 56-pin MLF with XRES pin. Add Fimousb3v char. to
specs. Upgrade to CY Perform logo and update corporate address and copyright.
Add ISSP note to pinout tables. Update typical and recommended Storage
Temperature per industrial specs. Update Low Output Level maximum I/OL
budget. Add FLS_PR1 to Register Map Bank 1 for users to specify which Flash
bank should be used for SROM operations. Add two new devices for a 68-pin QFN
and 100-ball VFBGA under RPNs: CY8C24094 and CY8C24994. Add two
packages for 68-pin QFN. Add OCD non-production pinouts and package
diagrams. Update CY branding and QFN convention. Add new Dev. Tool section.
Update copyright and trademarks.
*I
561158
See ECN
HMT
Add Low Power Comparator (LPC) AC/DC electrical spec. tables. Add
CY8C20x34 to PSoC Device Characteristics table. Add detailed dimensions to
56-pin QFN package diagram and update revision. Secure one package
diagram/manufacturing per QFN. Update emulation pod/feet kit part numbers. Fix
pinout type-o per TestTrack.
*J
728238 See ECN
2552459 08/14/08
HMT
Add CapSense SNR requirement reference. Update figure standards. Update
Technical Training paragraphs. Add QFN package clarifications and dimensions.
Update ECN-ed Amkor dimensioned QFN package diagram revisions. Reword
SNR reference. Add new 56-pin QFN spec.
*K
AZIE/PYRS
Add footnote on AGND descriptions to avoid using P2[4] for digital signaling as it
may add noise to AGND. Remove reference to CMP_GO_EN1 in Map Bank 1
Table on Address 65; this register has no functionality on 24xxx. Add footnote on
die sales. Add description 'Optional External Clock Input’ on P1[4] to match
description of P1[4].
*L
2616550 12/05/08
2657956 02/11/09
OGNE/PYRS Updated Programmable Pin Configuration detail.
Changed title from PSoC® Mixed-Signal Array to PSoC® Programmable
System-on-Chip™
*M
DPT/PYRS
Added package diagram 001-09618 and updated Ordering Information table
Document Number: 38-12018 Rev. *M
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Sales, Solutions, and Legal Information
Worldwide Sales and Design Support
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office
closest to you, visit us at cypress.com/sales.
Products
PSoC
PSoC Solutions
General
Clocks & Buffers
Wireless
Low Power/Low Voltage
Precision Analog
LCD Drive
Memories
Image Sensors
CAN 2.0b
USB
© Cypress Semiconductor Corporation, 2004-2009. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of
any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for
medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as
critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems
application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without
the express written permission of Cypress.
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
Document Number: 38-12018 Rev. *M
Revised February 10, 2009
Page 47 of 47
PSoC Designer™ and Programmable System-on-Chip™ are trademarks and PSoC® is a registered trademark of Cypress Semiconductor Corp. All other trademarks or registered trademarks referenced
herein are property of the respective corporations.
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