Cypress CY62148E User Manual

CY62148E MoBL®  
4-Mbit (512K x 8) Static RAM  
Features  
Functional Description [1]  
• Very high speed: 45 ns  
The CY62148E is a high performance CMOS static RAM  
organized as 512K words by 8 bits. This device features  
advanced circuit design to provide ultra low active current.  
• Voltage range: 4.5V–5.5V  
• Pin compatible with CY62148B  
• Ultra low standby power  
®
This is ideal for providing More Battery Life™ (MoBL ) in  
portable applications such as cellular telephones. The device  
also has an automatic power down feature that significantly  
reduces power consumption when addresses are not toggling.  
Placing the device into standby mode reduces power  
consumption by more than 99% when deselected (CE HIGH).  
— Typical standby current: 1 µA  
— Maximum standby current: 7 µA (Industrial)  
• Ultra low active power  
— Typical active current: 2.0 mA @ f = 1 MHz  
• Easy memory expansion with CE, and OE features  
• Automatic power down when deselected  
• CMOS for optimum speed and power  
The eight input and output pins (IO through IO ) are placed  
in a high impedance state when:  
0
7
• Deselected (CE HIGH)  
• Outputs are disabled (OE HIGH)  
• Write operation is active (CE LOW and WE LOW)  
• Available in Pb-free 32-pin TSOP II and 32-pin SOIC  
packages  
To write to the device, take Chip Enable (CE) and Write Enable  
(WE) inputs LOW. Data on the eight IO pins (IO through IO )  
0
7
is then written into the location specified on the address pins  
(A through A ).  
0
18  
To read from the device, take Chip Enable (CE) and Output  
Enable (OE) LOW while forcing Write Enable (WE) HIGH.  
Under these conditions, the contents of the memory location  
specified by the address pins appear on the IO pins.  
Product Portfolio  
Power Dissipation  
Speed  
Product  
Range  
V
Range (V)  
Operating I (mA)  
CC  
CC  
(ns)  
Standby I  
(µA)  
SB2  
f = 1MHz  
f = f  
max  
[3]  
[3]  
Min  
4.5  
4.5  
Typ  
Max  
Typ  
Max Typ  
Max Typ  
Max  
CY62148ELL TSOP II  
CY62148ELL SOIC  
Ind’l  
5.0  
5.0  
5.5  
5.5  
45  
55  
2
2
2.5  
2.5  
15  
15  
20  
20  
1
1
7
7
Ind’l/Auto-A  
Notes  
1. For best practice recommendations, refer to the Cypress application note “System Design Guidelines” at http://www.cypress.com.  
2. SOIC package is available only in 55 ns speed bin.  
3. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at V = V  
, T = 25°C.  
CC  
CC(typ)  
A
Cypress Semiconductor Corporation  
Document #: 38-05442 Rev. *F  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised March 28, 2007  
     
CY62148E MoBL®  
DC Input Voltage  
............ –0.5V to 6.0V (V  
+ 0.5V)  
Maximum Ratings  
CCmax  
Output Current into Outputs (LOW)............................. 20 mA  
Exceeding maximum ratings may impair the useful life of the  
device. These user guidelines are not tested.  
Static Discharge Voltage........................................... > 2001V  
(per MIL-STD-883, Method 3015)  
Storage Temperature ................................65°C to + 150°C  
Latch-up Current ......................................................>200mA  
Ambient Temperature with  
Power Applied............................................55°C to + 125°C  
Operating Range  
Supply Voltage to Ground  
Ambient  
[7]  
Device  
Range  
V
CC  
Potential.................................–0.5V to 6.0V (V  
+ 0.5V)  
+ 0.5V)  
CCmax  
Temperature  
DC Voltage Applied to Outputs  
CY62148E Ind’l/Auto-A –40°C to +85°C 4.5V to 5.5V  
in High-Z State  
................–0.5V to 6.0V (V  
CCmax  
Electrical Characteristics (Over the Operating Range)  
45 ns  
55 ns  
Parameter  
Description  
Test Conditions  
= –1 mA  
OH  
Unit  
[3]  
Min Typ  
Max  
Min Typ  
2.4  
Max  
V
Output HIGH  
Voltage  
I
2.4  
V
OH  
V
V
V
Output LOW Voltage I = 2.1 mA  
0.4  
0.4  
V
V
V
OL  
IH  
IL  
OL  
Input HIGH Voltage  
Input LOW voltage  
V
V
= 4.5V to 5.5V  
2.2  
V
+ 0.5 2.2  
V
+ 0.5  
CC  
CC  
CC  
CC  
= 4.5V to 5.5V For TSOPII  
package  
–0.5  
0.8  
[8]  
For SOIC  
package  
–0.5  
–1  
0.6  
I
Input Leakage  
Current  
GND < V < V  
CC  
–1  
–1  
+1  
+1  
µA  
µA  
IX  
I
I
I
Output Leakage  
Current  
GND < V < V , Output Disabled  
+1  
–1  
+1  
OZ  
O
CC  
V
Operating  
f = f  
= 1/t  
V
= V  
CC(max)  
= 0 mA  
15  
2
20  
15  
2
20  
mA  
CC  
CC  
max  
RC  
CC  
Supply Current  
I
OUT  
f = 1 MHz  
2.5  
2.5  
CMOS levels  
[9]  
I
AutomaticCEPower CE > V – 0.2V  
1
7
1
7
µA  
SB2  
CC  
CC  
down Current —  
CMOS Inputs  
V
IN  
> V – 0.2V or V < 0.2V,  
IN  
f = 0, V = V  
CC  
CC(max)  
Capacitance (For All Packages)  
Parameter  
Description  
Input Capacitance  
Output Capacitance  
Test Conditions  
Max  
10  
Unit  
C
C
T = 25°C, f = 1 MHz,  
pF  
pF  
IN  
OUT  
A
V
= V  
CC  
CC(typ)  
10  
Notes  
5.  
V
= –2.0V for pulse durations less than 20 ns for I < 30 mA.  
IL(min)  
6.  
V
= V +0.75V for pulse durations less than 20 ns.  
IH(max)  
CC  
7. Full device AC operation assumes a minimum of 100 µs ramp time from 0 to V (min) and 200 µs wait time after V stabilization.  
CC  
CC  
8. Under DC conditions the device meets a V of 0.8V. However, in dynamic conditions Input LOW Voltage applied to the device must not be higher than 0.6V. This  
IL  
is applicable to SOIC package only. Refer to AN13470 for details.  
9. Only chip enable (CE) must be HIGH at CMOS level to meet the I  
spec. Other inputs can be left floating.  
SB2  
10. Tested initially and after any design or process changes that may affect these parameters.  
Document #: 38-05442 Rev. *F  
Page 3 of 10  
           
CY62148E MoBL®  
Thermal Resistance [10]  
SOIC  
TSOP II  
Parameter  
Description  
Test Conditions  
Unit  
Package Package  
Θ
Thermal Resistance  
(Junction to Ambient)  
Still Air, soldered on a 3 × 4.5 inch,  
two-layer printed circuit board  
75  
10  
77  
13  
°C/W  
JA  
Θ
Thermal Resistance  
(Junction to Case)  
°C/W  
JC  
AC Test Loads and Waveforms  
R1  
ALL INPUT PULSES  
V
CC  
3.0V  
OUTPUT  
90%  
10%  
90%  
10%  
R2  
GND  
Rise Time = 1 V/ns  
30 pF  
Fall Time = 1 V/ns  
INCLUDING  
JIG AND  
SCOPE  
Equivalent to:  
THEVENIN EQUIVALENT  
R
TH  
OUTPUT  
V
Parameters  
5.0V  
1800  
990  
Unit  
R1  
R2  
R
639  
TH  
TH  
V
1.77  
V
Data Retention Characteristics (Over the Operating Range)  
Parameter  
Description  
Conditions  
Min Typ  
Max Unit  
V
V
for Data Retention  
2
V
DR  
CC  
I
Data Retention Current  
V
V
= V , CE > V – 0.2V,  
Ind’l/Auto-A  
1
7
µA  
CCDR  
CC  
DR  
CC  
> V – 0.2V or V < 0.2V  
IN  
CC  
IN  
t
t
Chip Deselect to Data Retention Time  
Operation Recovery Time  
0
ns  
ns  
CDR  
R
t
RC  
Data Retention Waveform  
DATA RETENTION MODE  
> 2.0V  
V
V
CC(min)  
V
CC(min)  
VCC  
CE  
DR  
t
t
R
CDR  
Note  
11. Full device operation requires linear V ramp from V to V  
> 100 µs or stable at V  
> 100 µs.  
CC(min)  
CC  
DR  
CC(min)  
Document #: 38-05442 Rev. *F  
Page 4 of 10  
   
CY62148E MoBL®  
Switching Characteristics (Over the Operating Range)  
[2]  
45 ns  
55 ns  
Parameter  
Read Cycle  
Description  
Unit  
Min  
Max  
Min  
Max  
t
t
t
t
t
t
t
t
t
t
t
Read Cycle Time  
45  
10  
55  
10  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
RC  
Address to Data Valid  
45  
55  
AA  
Data Hold from Address Change  
OHA  
ACE  
DOE  
LZOE  
HZOE  
LZCE  
HZCE  
PU  
45  
22  
55  
25  
CE LOW to Data Valid  
OE LOW to Data Valid  
5
10  
0
5
10  
0
OE LOW to LOW Z  
18  
18  
45  
20  
20  
55  
OE HIGH to High Z  
CE LOW to Low Z  
CE HIGH to High Z  
CE LOW to Power up  
CE HIGH to Power down  
PD  
Write Cycle  
t
t
t
t
t
t
t
t
t
t
Write Cycle Time  
45  
35  
35  
0
55  
40  
40  
0
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
WC  
CE LOW to Write End  
SCE  
AW  
Address Setup to Write End  
Address Hold from Write End  
Address Setup to Write Start  
HA  
0
0
SA  
35  
25  
0
40  
25  
0
WE Pulse Width  
PWE  
SD  
Data Setup to Write End  
Data Hold from Write End  
HD  
18  
20  
WE LOW to High-Z  
HZWE  
LZWE  
10  
10  
WE HIGH to Low-Z  
Notes  
12. Test conditions for all parameters other than tri-state parameters assume signal transition time of 3 ns or less, timing reference levels of 1.5V, input pulse levels  
of 0 to 3V, and output loading of the specified I /I as shown in the “AC Test Loads and Waveforms” on page 4.  
OL OH  
13. At any given temperature and voltage condition, t  
is less than t  
, t  
is less than t  
, and t  
is less than t  
for any given device.  
HZCE  
LZCE HZOE  
LZOE  
HZWE  
LZWE  
14. t  
, t  
, and t  
transitions are measured when the outputs enter a high impedance state.  
HZOE HZCE  
HZWE  
15. The internal write time of the memory is defined by the overlap of WE, CE = V . All signals must be ACTIVE to initiate a write and any of these signals can  
IL  
terminate a write by going INACTIVE. The data input setup and hold timing should be referenced to the edge of the signal that terminates the write.  
Document #: 38-05442 Rev. *F  
Page 5 of 10  
       
CY62148E MoBL®  
Switching Waveforms  
Read Cycle No. 1 (Address Transition Controlled)  
tRC  
ADDRESS  
t
AA  
t
OHA  
DATA OUT  
PREVIOUS DATA VALID  
DATA VALID  
Read Cycle No. 2 (OE Controlled)  
ADDRESS  
CE  
t
RC  
t
ACE  
OE  
t
HZOE  
t
DOE  
t
HZCE  
t
LZOE  
HIGH  
IMPEDANCE  
HIGH IMPEDANCE  
DATA VALID  
DATA OUT  
t
LZCE  
t
PD  
ICC  
t
V
CC  
PU  
50%  
SUPPLY  
CURRENT  
50%  
ISB  
Write Cycle No. 1 (WE Controlled, OE HIGH During Write)  
t
WC  
ADDRESS  
t
SCE  
CE  
t
t
HA  
AW  
t
SA  
t
PWE  
WE  
OE  
t
t
SD  
HD  
DATA IO  
NOTE  
DATA VALID  
t
HZOE  
Notes:  
16. Device is continuously selected. OE, CE = V .  
IL  
17. WE is HIGH for read cycles.  
18. Address valid before or similar to CE transition LOW.  
19. Data IO is high impedance if OE = V  
.
IH  
20. If CE goes HIGH simultaneously with WE HIGH, the output remains in high impedance state.  
21. During this period, the IOs are in output state and input signals must not be applied.  
Document #: 38-05442 Rev. *F  
Page 6 of 10  
           
CY62148E MoBL®  
Switching Waveforms (continued)  
Write Cycle No. 2 (CE Controlled)  
t
WC  
ADDRESS  
CE  
t
SCE  
t
SA  
t
t
HA  
AW  
t
PWE  
WE  
t
t
HD  
SD  
DATA IO  
DATA VALID  
Write Cycle No. 3 (WE Controlled, OE LOW)  
t
WC  
ADDRESS  
CE  
t
SCE  
t
t
HA  
AW  
t
SA  
t
PWE  
WE  
t
t
HD  
SD  
NOTE  
DATA VALID  
DATA IO  
t
t
LZWE  
HZWE  
Truth Table  
CE  
H
L
WE  
OE  
X
IO’s  
Mode  
Power  
X
H
L
High Z  
Deselect/Power down  
Standby (I  
)
SB  
L
Data Out  
Data In  
High Z  
Read  
Write  
Active (I  
Active (I  
Active (I  
)
)
)
CC  
CC  
CC  
L
X
L
H
H
Selected, Outputs Disabled  
Document #: 38-05442 Rev. *F  
Page 7 of 10  
CY62148E MoBL®  
Ordering Information  
Speed  
(ns)  
Package  
Diagram  
Operating  
Range  
Ordering Code  
Package Type  
45  
CY62148ELL-45ZSXI  
CY62148ELL-55SXI  
CY62148ELL-55SXA  
51-85095 32-pin Thin Small Outline Package II (Pb-free)  
51-85081 32-pin Small Outline Integrated Circuit (Pb-free)  
51-85081 32-pin Small Outline Integrated Circuit (Pb-free)  
Industrial  
Industrial  
55  
55  
Automotive-A  
Contact your local Cypress sales representative for availability of these parts.  
Package Diagrams  
Figure 1. 32-pin TSOP II, 51-85095  
51-85095-**  
Document #: 38-05442 Rev. *F  
Page 8 of 10  
CY62148E MoBL®  
Package Diagrams (continued)  
Figure 2. 32-pin (450 MIL) Molded SOIC, 51-85081  
16  
1
0.546[13.868]  
0.566[14.376]  
0.440[11.176]  
0.450[11.430]  
17  
32  
0.793[20.142]  
0.817[20.751]  
0.006[0.152]  
0.012[0.304]  
0.101[2.565]  
0.111[2.819]  
0.118[2.997]  
MAX.  
0.004[0.102]  
0.047[1.193]  
0.063[1.600]  
0.004[0.102]  
0.050[1.270]  
0.023[0.584]  
0.039[0.990]  
MIN.  
BSC.  
0.014[0.355]  
0.020[0.508]  
SEATING PLANE  
51-85081-*B  
MoBL is a registered trademark, and More Battery Life is a trademark of Cypress Semiconductor. All product and company names  
mentioned in this document are the trademarks of their respective holders.  
Document #: 38-05442 Rev. *F  
Page 9 of 10  
© Cypress Semiconductor Corporation, 2006-2007. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for  
the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended  
to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize  
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress  
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.  
CY62148E MoBL®  
Document History Page  
®
Document Title: CY62148E MoBL , 4-Mbit (512K x 8) Static RAM  
Document Number: 38-05442  
Issue  
Date  
Orig. of  
Change  
REV.  
ECN NO.  
Description of Change  
**  
201580 01/08/04  
249276 See ECN  
AJU  
SYT  
New Data Sheet  
*A  
Changed from Advance Information to Preliminary  
Moved Product Portfolio to Page 2  
Added RTSOP II and Removed FBGA Package  
Changed V stabilization time in footnote #7 from 100 µs to 200 µs  
CC  
Changed I  
from 2.0 µA to 2.5 µA  
CCDR  
Changed typo in Data Retention Characteristics(t ) from 100 µs to t ns  
R
RC  
Changed t  
Changed t  
from 6 ns to 10 ns for both 35 ns and 45 ns Speed Bin  
OHA  
, t  
from 12 to 15 ns for 35 ns Speed Bin and 15 to 18 ns for 45  
HZOE HZWE  
ns Speed Bin  
Changed t  
Bin  
from 25 to 30 ns for 35 ns Speed Bin and 40 to 35 ns for 45 ns Speed  
SCE  
Changed t  
Speed Bin  
from 12 to18 ns for 35 ns Speed Bin and 15 to 22 ns for 45 ns  
HZCE  
Changed t from 15 to 18 ns for 35 ns Speed Bin and 20 to 22 ns for  
SD  
45 ns Speed Bin  
Changed t  
from 15 to 18 ns for 35 ns Speed Bin  
DOE  
Corrected typo in Package Name  
Changed Ordering Information to include Pb-Free Packages  
*B  
414820 See ECN  
ZSD  
Changed from Preliminary to Final  
Changed the address of Cypress Semiconductor Corporation on Page #1 from  
“3901 North First Street” to “198 Champion Court”  
Removed 35ns Speed Bin  
Removed “L” version of CY62148E  
Changed I (Typ) value from 1.5 mA to 2 mA at f=1 MHz  
CC  
Changed I (Max) value from 2 mA to 2.5 mA at f=1 MHz  
CC  
Changed I (Typ) value from 12 mA to 15 mA at f=f  
CC  
max  
Removed I  
Changed I  
Modified footnote #4 to include current limit  
spec from the Electrical characteristics table  
Typ values from 0.7 µA to 1 µA and Max values from 2.5 µA to 7 µA  
SB1  
SB2  
Removed redundant footnote on DNU pins  
Changed the AC testload capacitance from 100 pF to 30 pF on page #4  
Changed test load parameters R1, R2, R and V from 1838 , 994 ,  
TH  
TH  
645 and 1.75V to 1800 , 990 , 639 and 1.77V  
Changed I from 2.5 µA to 7 µA  
CCDR  
Added I  
typical value  
CCDR  
Changed t  
Changed t  
Changed t  
Changed t  
from 3 ns to 5 ns  
LZOE  
LZCE  
HZCE  
PWE  
and t  
from 6 ns to 10 ns  
LZWE  
from 22 ns to 18 ns  
from 30 ns to 35 ns  
Changed t from 22 ns to 25 ns  
SD  
Updated the ordering information table and replaced Package Name column with  
Package Diagram  
*C  
464503 See ECN  
NXR  
Included Automotive Range in product offering  
Updated the Ordering Information  
*D  
*E  
485639 See ECN  
833080 See ECN  
VKN  
VKN  
Corrected the operating range to 4.5V - 5.5V on page# 3  
Added footnote #8  
Added V spec for SOIC package  
IL  
*F  
890962 See ECN  
VKN  
Added Automotive-A part and its related information  
Removed Automotive-E part and its related information  
Added footnote #2 related to SOIC package  
Added footnote #9 related to I  
SB2  
Added AC values for 55 ns Industrial-SOIC range  
Updated Ordering Information table  
Document #: 38-05442 Rev. *F  
Page 10 of 10  

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