Texas Instruments Switch HPL D SLLU064A User Manual

4x4 Crosspoint Switch EVM  
User's Guide  
January 2004  
HPL-D  
SLLU064A  
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EVM IMPORTANT NOTICE  
Texas Instruments (TI) provides the enclosed product(s) under the following conditions:  
This evaluation kit being sold by TI is intended for use for ENGINEERING DEVELOPMENT OR  
EVALUATION PURPOSES ONLY and is not considered by TI to be fit for commercial use. As such, the  
goods being provided may not be complete in terms of required design–, marketing–, and/or manufacturing–  
related protective considerations, including product safety measures typically found in the end product  
incorporating the goods. As a prototype, this product does not fall within the scope of the European Union  
directive on electromagnetic compatibility and therefore may not meet the technical requirements of the  
directive.  
Should this evaluation kit not meet the specifications indicated in the EVM User’s Guide, the kit may be  
returned within 30 days from the date of delivery for a full refund. THE FOREGOING WARRANTY IS THE  
EXCLUSIVE WARRANTY MADE BY SELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES,  
EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF MERCHANTABILITY OR  
FITNESS FOR ANY PARTICULAR PURPOSE.  
The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user  
indemnifies TI from all claims arising from the handling or use of the goods. Please be aware that the  
products received may not be regulatory compliant or agency certified (FCC, UL, CE, etc.). Due to the open  
construction of the product, it is the user’s responsibility to take any and all appropriate precautions with  
regard to electrostatic discharge.  
EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE  
LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL  
DAMAGES.  
TI currently deals with a variety of customers for products, and therefore our arrangement with the user is  
not exclusive.  
TI assumes no liability for applications assistance, customer product design, software performance,  
or infringement of patents or services described herein.  
Please read the EVM User’s Guide and, specifically, the EVM Warnings and Restrictions notice in the EVM  
User’s Guide prior to handling the product. This notice contains important safety information about  
temperatures and voltages. For further safety concerns, please contact the TI application engineer.  
Persons handling the product must have electronics training and observe good laboratory practice standards.  
No license is granted under any patent right or other intellectual property right of TI covering or relating to any  
machine, process, or combination in which such TI products or services might be or are used.  
Mailing Address:  
Texas Instruments  
Post Office Box 655303  
Dallas, Texas 75265  
Copyright 2003 - 2004, Texas Instruments Incorporated  
3
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EVM WARNINGS AND RESTRICTIONS  
It is important to operate this EVM within the input voltage range of -0.7 V to 4 V and the output voltage range  
of -0.5 V to 4 V.  
Exceeding the specified input range may cause unexpected operation and/or irreversible damage to the  
EVM. If there are questions concerning the input range, please contact a TI field representative prior to  
connecting the input power.  
Applying loads outside of the specified output range may result in unintended operation and/or possible  
permanent damage to the EVM. Please consult the EVM User’s Guide prior to connecting any load to the  
EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.  
During normal operation, some circuit components may have case temperatures greater than 60°C. The  
EVM is designed to operate properly with certain components above 60°C as long as the input and output  
ranges are maintained. These components include but are not limited to linear regulators, switching  
transistors, pass transistors, and current sense resistors. These types of devices can be identified using the  
EVM schematic located in the EVM User’s Guide. When placing measurement probes near these devices  
during operation, please be aware that these devices may be very warm to the touch.  
Mailing Address:  
Texas Instruments  
Post Office Box 655303  
Dallas, Texas 75265  
Copyright 2003 - 2004, Texas Instruments Incorporated  
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Preface  
Read This First  
About This Manual  
This evaluation module (EVM) user’s guide describes the hardware, theory  
of operation, and use of the EVM for evaluating the high-speed  
performance and functionality of either the SN65LVDS125A or  
SN65LVDS250 4x4 crosspoint switches.  
How to Use This Manual  
Chapter 1 provides an overview of the functional configurations and signal  
paths. Typical hardware setup and results are discussed in Chapter 2.  
Chapter 3 provides schematics, the board layout, the board layers,  
fabrication notes, and bill of materials  
Related Documentation from Texas Instruments  
SN65LVDS125A, 4x4 1.5 Gbps LVDS Crosspoint Switch Data Sheet  
(SLLS595).  
SN65LVDS250, 4x4 2.5 Gbps LVDS Crosspoint Switch Data Sheet  
(SLLS594).  
If You Need Assistance  
E-mail technical support http://www-  
k.ext.ti.com/sc/technical_support/email_tech_support.asp  
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iii  
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FCC Warning  
This equipment is intended for use in a laboratory test environment only. It  
generates, uses, and can radiate radio frequency energy and has not been  
tested for compliance with the limits of computing devices pursuant to  
subpart J of part 15 of FCC rules, which are designed to provide  
reasonable protection against radio frequency interference. Operation of  
this equipment in other environments may cause interference with radio  
communications, in which case the user at his expense will be required to  
take whatever measures may be required to correct this interference.  
If your book does not discuss a product that creates radio frequency  
interference, delete this section from your preface. If your book does  
discuss a product that creates radio frequency interference, you must  
include this warning as it appears above.  
iv  
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Contents  
Read This First ................................................................................................................iii  
About This Manual..................................................................................................... iii  
How to Use This Manual ........................................................................................... iii  
Related Documentation from Texas Instruments....................................................... iii  
If You Need Assistance ............................................................................................. iii  
FCC Warning............................................................................................................. iv  
Contents ...........................................................................................................................v  
Figures..............................................................................................................................v  
Tables ..............................................................................................................................vi  
1 Overview....................................................................................................................1-1  
1.1 Sample Functional Configurations ...................................................................1-2  
1.2 Signal Paths ....................................................................................................1-4  
2 Setup and Required Equipment ...............................................................................2-1  
2.1 Applying an Input.............................................................................................2-1  
2.2 Observing an Output........................................................................................2-4  
2.3 Typical Test Results ........................................................................................2-4  
3 EVM Construction.....................................................................................................3-1  
3.1 Schematic........................................................................................................3-2  
3.2 Board Layout Patterns.....................................................................................3-3  
3.3 PCB Fabrication Requirements and Stack Up .................................................3-8  
3.4 Bill of Materials ................................................................................................3-9  
Figures  
Figure 1-1. Sample Functional Configurations of the 4x4 Crosspoint Switch..........1-2  
Figure 1-2. 4x4 Crosspoint Switch EVM ......................................................................1-3  
Figure 1-3. 4x4 Crosspoint Switch Signal Paths.........................................................1-4  
Figure 2-1. EVM Power Connections for Either SN65LVDS125A or SN65LVDS250  
Evaluation..............................................................................................................2-2  
Figure 2-2. Termination for Interfacing LVDS, CML, or LVPECL Drivers ..................2-3  
Figure 2-3. Typical Test Results...................................................................................2-5  
Figure 3-1. 4x4 Crosspoint Switch EVM Schematic....................................................3-2  
Figure 3-2. 4x4 Crosspoint Switch EVM Board Layout...............................................3-3  
Figure 3-3. Layer 1–Signal Plane .................................................................................3-4  
Figure 3-4. GND Plane...................................................................................................3-5  
Figure 3-5. Layer 3–Vcc ................................................................................................3-5  
v
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Tables  
Figure 3-6. Layer 4–Vcc01 Plane..................................................................................3-6  
Figure 3-7. Layer 5–GND Plane ....................................................................................3-6  
Figure 3-8. Layer 6–GND/Signal Plane.........................................................................3-7  
Tables  
Table 2-1 Crosspoint Function Table...........................................................................2-3  
Table 3-2. Bill of Materials for the SN65LVDS125A / SN65LVDS250..........................3-9  
vi  
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Chapter 1  
1 Overview  
This chapter provides a high-level description of the 4x4 crosspoint switch  
EVM mounted with either a SN65LVDS125A, 4x4 1.5-Gbps or a  
SN65LVDS250, 4x4 2.5-Gbps crosspoint switch.  
Topic  
Page  
1-2  
1.1 Sample Functional Configurations  
1.2 Signal Paths  
1-4  
1-1  
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1 Overview  
1.1 Sample Functional Configurations  
The 4x4 crosspoint switch is a fully non-blocking switch that provides  
flexibility in switch configuration for the desired application.  
A sample of various functions for which the EVMs can be configured is  
shown in Figure 1-1.  
C onfigura tion E x a m ple s  
S 1 0  
0
S 1 1  
0
S 2 0  
0
S 2 1  
1
S 1 0  
0
S 1 1  
0
S 2 0  
0
S 2 1  
0
S 3 0  
1
S 3 1  
0
S 4 0  
1
S 4 1  
1
S 3 0  
0
S 3 1  
0
S 4 0  
0
S 4 1  
0
1Y  
1Z  
1 Y  
1 Z  
1 A  
1 B  
1 A  
1 B  
2 Y  
2 Z  
2Y  
2Z  
2 A  
2 B  
3 Y  
3 Z  
3Y  
3Z  
3 A  
3 B  
4Y  
4Z  
4 Y  
4 Z  
4A  
4B  
S 1 0  
0
S 3 0  
1
S 1 1  
0
S 3 1  
0
S 2 0  
0
S 2 1  
0
S 4 1  
0
S 1 0  
S 1 1  
S 2 0  
1
S 2 1  
1
S 3 0  
0
1
S 3 1  
0
1
S 4 1  
0
S 4 0  
1
S 4 0  
0
1Y  
1Z  
1A  
1B  
1 Y  
1 Z  
1A  
1B  
2 Y  
2 Z  
2Y  
2Z  
3 Y  
3 Z  
3Y  
3Z  
3 A  
3 B  
4 Y  
4 Z  
4 Y  
4 Z  
4A  
4B  
Figure 1-1. Sample Functional Configurations of the 4x4 Crosspoint Switch  
1-2  
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1 Overview  
Figure 1-2 shows the 4x4 crosspoint switch EVM (part number  
SN65LVDS125A or SN65LVDS250). The EVM comes with either the  
SN65LVDS125A or SN65LVDS250 installed and a copy of the data sheet.  
The latest version of the data sheet is also available from www.ti.com.  
A/W # 6456526  
SN65LVDS125A  
SN65LVDS250  
4X4 Crosspoint Switch EVM  
Figure 1-2. 4x4 Crosspoint Switch EVM  
1-3  
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1 Overview  
1.2 Signal Paths  
The signal paths on this EVM (see Figure 1-3) include:  
Sixteen edge-launch SMA connectors (J1–J16) for high-speed data transmission  
Eight jumpers (W1– W8) for active switch logic control  
Four jumpers (W9–W12) for enabling and disabling the outputs  
Three banana jacks (J17, J18, J19) for power and ground connections. Banana jack J20 is  
used for non-LVDS type configurations.  
J11  
J14  
J13  
J12  
VCC  
3DE  
J10  
VCC  
1DE  
VCC  
2DE  
J15  
J19  
W10  
W12  
W11  
VCC  
4DE  
VCC01  
J9  
J16  
W9  
J18  
J20  
U1  
1
GND  
W1  
VTERM  
W2  
W7  
W8  
J1  
VCC  
VCC  
S11  
VCC  
S40  
VCC  
S10  
J17  
S41  
J8  
J7  
W3  
W4  
W5  
W6  
VCC  
VCC  
S20  
VCC  
S21  
VCC  
S30  
VCC  
S31  
J2  
J3  
J4  
J5  
J6  
`
Figure 1-3. 4x4 Crosspoint Switch Signal Paths  
1-4  
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Chapter 2  
2 Setup and Required Equipment  
Both the SN65LVDS125A and the SN65LVDS250 LVDS driver output  
characteristics are compliant with the requirements of the TIA/EIA-644  
standard. LVDS drivers nominally provide a 350-mV differential signal, with  
a 1.2-V offset from ground. These levels are attained when driving a 100-  
differential line-termination test load. This requirement includes the effects  
of up to 32 standard receivers with their ground references offset up to ±1 V  
from that of the driver. This common-mode loading limitation of LVDS  
drivers affects how the driver’s characteristics are observed with this EVM,  
and the test setup that follows in this manual.  
By using three power jacks (J17, J18, and J19) and by optionally installing  
termination resistors, different methods of probing can be used to evaluate  
the device output characteristics. The typical setup for the 4x4 crosspoint  
switch EVM is shown in Figure 2-1.  
2.1 Applying an Input  
While the use of a split power plane allows the EVM to be terminated within  
the oscilloscope, offsetting the EVM ground requires the inputs to the  
device to also be offset. Figure 2-1 shows how to offset the EVM and the  
inputs to the device. Setting power supply 1 to 3.3 V and power supply 2 to  
1.2 V causes the voltage swing of the LVDS outputs to be within the limits  
of -200 mV to 200 mV instead of the typical 1 V to 1.4 V. This requires the  
inputs of the 4x4 crosspoint switch EVM to also be offset by 1.2 V, resulting  
in a voltage swing of -200 mV to 200 mV. VTERM, banana jack J20, is  
provided for non-LVDS input terminations such as LVPECL, which requires  
a termination voltage. When applying an LVDS input, VTERM can be left  
open or connected to GND, which is the common-mode voltage when using  
the aforementioned –200-mV to 200-mV input swing.  
2-1  
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2 Setup and Required Equipment  
+
3.3V  
-
Power Supply #1  
Power Supply #2  
+
1.2V  
-
SCOPE  
(internally  
terminated  
50  
to GND)  
DATA, DATA  
Amplitude: 400 mV  
Offset: 0.0 V  
DATA, DATA  
Amplitude: 400 mV  
Offset: 0.0 V  
Figure 2-1. EVM Power Connections for Either SN65LVDS125A or SN65LVDS250  
Evaluation.  
Many possible configurations for the 4x4 crosspoint switches are made  
available. Table 2-1 provides a description of the different functions and  
the required selector settings.  
2-2  
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2 Setup and Required Equipment  
Table 2-1 Crosspoint Function Table  
Output Channel 1  
Output Channel 2  
Output Channel 3  
Output Channel 4  
Control  
Pins  
Input  
Selected  
Control  
Pins  
Input  
Selected  
Control  
Pins  
Input  
Selected  
Control  
Pins  
Input  
Selected  
S10 S11 1Y/1Z  
S20 S21 2Y/2Z  
S30 S31 3Y/3Z  
S40 S41 4Y/4Z  
0
0
1
1
0
1
0
1
1A/1B  
2A/2B  
3A/3B  
4A/4B  
0
0
1
1
0
1
0
1
1A/1B  
2A/2B  
3A/3B  
4A/4B  
0
0
1
1
0
1
0
1
1A/1B  
2A/2B  
3A/3B  
4A/4B  
0
0
1
1
0
1
0
1
1A/1B  
2A/2B  
3A/3B  
4A/4B  
Apply inputs to the SMA connectors J1–J8. The EVM comes with 50-Ω  
resistors installed to VTERM, providing a termination scheme easily  
adjusted to accommodate LVDS, LVPECL, or CML output structures. (See  
Figure 2-2).  
Vterm  
50  
LVDS,  
LVPECL,  
A
or CML  
SN65LVDS125 Input  
Channels 1-4  
B
50 Ω  
Vterm  
Figure 2-2. Termination for Interfacing LVDS, CML, or LVPECL Drivers  
2-3  
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2 Setup and Required Equipment  
2.2 Observing an Output  
In order to minimize the parasitic capacitance in high-speed measurements  
(probe capacitance), the 4x4 crosspoint switch EVM provides an offset  
power plane (layer 5). This power plane allows the user to offset the device  
so that the common-mode output is compatible with the 50 ohms to ground  
termination within the scope. Terminating the EVM within the scope  
eliminates any bandwidth limitations introduced by a probe.  
Direct connection to an oscilloscope with 50-internal terminations to  
ground is accomplished without requiring installation of resistors R5 – R16  
on the EVM. The outputs are available at J9–J16 for direct connection to  
oscilloscope inputs. All cabling used to source and measure signals must  
be electrically matched in length to prevent any skew between conductors  
of the differential inputs.  
Referring back to 2-1, power supply 1 is used to provide the required 3.3 V  
to the EVM. Power supply 2 is used to offset the EVM ground relative to the  
device under test (DUT) ground. With this power scheme, the common-  
mode voltage seen by either the SN65LVDS125A or the SN65LVDS250 is  
approximately equal to that of the oscilloscope, thus preventing significant  
common-mode current flow. Using dual supplies and offsetting the EVM  
ground relative to the DUT ground are simply steps required for the test and  
evaluation of devices. Actual designs include high-impedance receivers,  
which do not require the setup steps outlined above. If the EVM outputs are  
to be evaluated with a high-impedance probe, direct probing on the EVM is  
supported via installation of a 100-resistor across the solder pads (R5,  
R8, R11, and R14).  
Note: Power Supply 2  
.Power supply 2 must be able to sink current.  
2.3 Typical Test Results  
Figure 2-3 is a typical result obtained with the EVM setup shown in Figure  
2-1. The inputs (J1–J8) were stimulated with a 223–1 PRBS signal at  
1.5 Gbps. The input levels for both clock and data were a differential  
voltage of 400 mV, with a common-mode voltage of 0 V (referenced to the  
ground of the pattern generator).  
2-4  
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2 Setup and Required Equipment  
Figure 2-3. Typical Test Results.  
2-5  
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2 Setup and Required Equipment  
2-6  
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EVM Construction  
Chapter 3  
3 EVM Construction  
This chapter presents the schematics, board layouts, fabrication  
information, and the bill of materials.  
Topic  
Page  
3-2  
3.1 Schematic  
3.2 Board Layout Patterns  
3.3 PCB Fabrication Requirements and Stack Up  
3.4 Bill of Materials  
3-3  
3-8  
3-9  
3-1  
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3.1 Schematic  
Figure 3-1. 4x4 Crosspoint Switch EVM Schematic  
3-2  
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3 EVM Construction  
3.2 Board Layout Patterns  
A/W # 6456526  
SN65LVDS125A  
SN65LVDS250  
4X4 Crosspoint Switch EVM  
Figure 3-2. 4x4 Crosspoint Switch EVM Board Layout  
3-3  
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Figure 3-3. Layer 1–Signal Plane  
3-4  
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3 EVM Construction  
Figure 3-4. GND Plane  
Figure 3-5. Layer 3–Vcc  
3-5  
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Figure 3-6. Layer 4–Vcc01 Plane  
Figure 3-7. Layer 5–GND Plane  
3-6  
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3 EVM Construction  
Figure 3-8. Layer 6–GND/Signal Plane  
3-7  
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3.3 PCB Fabrication Requirements and Stack Up  
Notes:  
1. PWB TO BE FABRICATED TO MEET OR EXCEED IPC-6012,  
CLASS 3 STANDARDS AND WORKMANSHIP SHALL  
CONFORM TO IPC-A-600, CLASS 3 CURRENT REVISIONS  
2. BOARD MATERIAL AND CONSTRUCTION TO BE UL  
APPROVED AND MARKED ON THE FINISHED BOARD.  
3. LAMINATE MATERIAL:COPPER-CLAD NELCO N4000-13 (DO NOT USE -13SI)  
4. COPPER WEIGHT: 1oz FINISHED  
Stackup  
Signal: Layer 1  
5. FINISHED THICKNESS: 0.062" +/- 0.010"  
6. MIN PLATING THICKNESS IN THROUGH HOLES: .001"  
7. SMOBC / HASL  
0.0075"  
GND: Layer 2  
0.0075"  
8. LPI SOLDERMASK BOTH SIDES USING APPROPRIATE  
LAYER ARTWORK: COLOR = GREEN  
VCC Power: Layer 3  
0.062"  
9. LPI SILKSCREEN AS REQUIRED: COLOR = WHITE  
VCCO1 Power: Layer 4  
GND: Layer 5  
10. VENDOR INFORMATION TO BE INCORPORATED ON BACK SIDE  
WHENEVER POSSIBLE  
0.0075"  
11. MINIMUM COPPER CONDUCTOR WIDTH IS: 0.009"  
MINIMUM CONDUCTOR SPACING IS: 0.006"  
0.0075"  
SIGNAL/GND: Layer 6  
12. NUMBER OF FINISHED LAYERS: 6  
13. ALL 8 MIL HOLES TO BE PLUGGED AND COPLANAR TO  
SURFACE  
14. SPACING BETWEEN LAYERS 1 AND 2 SHOULD BE 0.0075"  
SPACING BETWEEN LAYERS 2 AND 3 SHOULD BE 0.0075"  
SPACING BETWEEN LAYERS 4 AND 5 SHOULD BE 0.0075"  
SPACING BETWEEN LAYERS 5 AND 6 SHOULD BE 0.0075"  
3-8  
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3 EVM Construction  
3.4 Bill of Materials  
Table 3-2. Bill of Materials for SN65LVDS125A / SN65LVDS250 EVM  
Item  
6456526-1  
Qty  
6456526-2  
Qty  
6456526-3 Description  
Qty  
Pattern  
Reference  
Designator  
1
9
9
9
0.001 µF  
402  
C2, C3, C4, C5, C6,  
C7, C8, C9, C10  
2
3
4
5
6
7
8
2
1
2
4
2
1
2
2
1
2
4
2
1
2
2
1
2
4
2
1
2
0.01 µF  
0.1 µF  
603  
C13, C18  
C21  
603  
0.1 µF  
1206  
402  
C14, C19  
R5, R8, R11, R14  
C11, C16  
C22  
100 (uninstalled)  
10 µF  
7343  
603  
1 µF  
1 µF  
1206  
C15, C20  
W1, W2, W3, W4,  
W5, W6, W7, W8,  
W9, W10, W11, W12  
9
12  
8
12  
8
12  
8
3 pos jumper  
49.9 (uninstalled)  
49.9 Ω  
10  
11  
402  
R6, R7, R9, R10,  
R12, R13, R15, R16  
8
8
8
402  
R1, R2, R3, R4, R17,  
R18, R19, R20  
12  
13  
2
4
2
4
2
4
68 µF  
Cap 592D R  
C12, C17  
Banana jack  
J17, J18, J19, J20  
SMA END  
J1, J2, J3, J4, J5, J6,  
J7, J8, J9, J10, J11,  
J12, J13, J14, J15,  
J16  
14  
16  
16  
16  
SMA PCB MT MOD  
50 Ω  
15  
16  
17  
1
0
0
0
1
0
0
0
1
SN65LVDS125A  
SN65LVDS250  
Special  
38-TSSOP  
(DBT)  
U1  
U1  
U1  
38-TSSOP  
(DBT)  
38-TSSOP  
(DBT)  
18  
19  
4
1
4
1
4
1
Rubber feet  
PWB  
3/8”  
6456526  
PWB  
3-9  
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