™
Sun Netra CP3000 Advanced
Mezzanine Card PCIe
Hard Drive and SAS Controller
User’s Guide
for the AMC.1-HDD SAS Disk
Sun Microsystems, Inc.
Part No. 820-7175-11
March 2010, Revision A
Submit comments about this document at: http://www.sun.com/hwdocs/feedback
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1. Getting Started 1–1
1.5
1.6
Removing and Installing AMCs 1–8
1.6.1
1.6.2
1.6.3
Removing an AMC 1–8
Removing a Blade Server and AMC 1–12
Installing an AMC 1–13
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1.7
▼
To Enable AMC Port 2 (Driven by Port 1 of SAS Controller) 18
2. Overview 2–1
2.1
2.2
Features 2–2
Key Components 2–3
2.2.1
2.2.2
2.2.3
2.2.4
2.2.5
2.2.6
2.2.7
Hard Drive Disk 2–3
Power Regulator 2–3
SAS Controller 2–4
Flash 2–4
Module Management Controller (MMC) 2–4
Port Connectors 2–5
LEDs 2–5
2.3
2.4
Faceplate and LEDs 2–5
Functional Diagram 2–7
3. Managing the AMC 3–1
3.1
3.2
3.3
3.4
3.5
Monitoring and Control Functions 3–2
IPMI Controller 3–2
FRU Information 3–4
Sensors 3–5
Firmware and Software Upgrades 3–6
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4. Configuring the AMC 4–1
4.2.2
Launching the Boot BIOS Utility 4–3
A. Connectors and Ports A–1
A.1 Connector Locations and Assignments A–2
B. Environment Specifications B–1
B.1
Electrical and Environmental B–2
B.1.1 Electrical B–2
B.1.2 Environmental B–2
B.1.3 Absolute Maximum Ratings B–4
B.1.4 Normal Operating Ranges B–4
C. Agency Certifications C–1
C.1
C.2
C.3
C.4
CE Certification C–2
NEBS/ETSI C–2
Safety C–3
Emissions Test Regulations C–4
Contents
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C.4.2 EN 55024 Immunity C–4
C.5
C.5.1 FCC (USA) C–5
C.5.2 Industry Canada (Canada) C–5
Index Index–1
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Preface
The Netra™ CP3000 Advanced Mezzanine Card PCIe Hard Drive and SAS Controller
User’s Guide describes the installation and configuration of the Sun Netra CP3000
AMC.1-HDD SAS disk. This guide also includes information about software,
environment specifications, connectors, and certifications.
Typographic Conventions
Typeface
Meaning
Examples
AaBbCc123
The names of commands, files,
and directories; on-screen
computer output
Edit your.login file.
Use ls -a to list all files.
% You have mail.
AaBbCc123
What you type, when contrasted % su
with on-screen computer output
Password:
Book titles, new words or terms, Read Chapter 6 in the User’s Guide.
AaBbCc123
words to be emphasized.
Replace command-line variables
with real names or values.
These are called class options.
You must be superuser to do this.
To delete a file, type rm filename.
Note – Characters display differently depending on browser settings. If characters
do not display correctly, change the character encoding in your browser to Unicode
UTF-8.
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Related Documentation
The following table lists the documentation for the AMC.1-HDD SAS disk. The
online documentation is available at:
Application
Title
Part Number
Format
Location
Latest
information
Sun Netra CP3000 Advanced Mezzanine Card PCIe
Hard Drive and SAS Controller Product Notes
820-7174-xx PDF
820-7177-xx Printed
820-7175-xx PDF
Online
Pointer doc
Sun Netra CP3000 Advanced Mezzanine Card PCIe
Hard Drive and SAS Controller Getting Started Guide
Shipping Kit
Online
Installation
(this
Sun Netra CP3000 Advanced Mezzanine Card PCIe
Hard Drive and SAS Controller User’s Guide
document)
Safety
Important Safety Information for Sun Hardware Systems 816-7190-xx Printed
Shipping Kit
Third-Party Web Sites
Sun is not responsible for the availability of third-party web sites mentioned in this
document. Sun does not endorse and is not responsible or liable for any content,
advertising, products, or other materials that are available on or through such sites
or resources. Sun will not be responsible or liable for any actual or alleged damage
or loss caused by or in connection with the use of or reliance on any such content,
goods, or services that are available on or through such sites or resources.
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Sun Welcomes Your Comments
Sun is interested in improving its documentation and welcomes your comments and
suggestions. You can submit your comments by going to:
Please include the title and part number of your document with your feedback:
Sun Netra CP3000 Advanced Mezzanine Card PCIe Hard Drive and SAS Controller User’s
Guide, part number 820-7175-11.
Preface
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CHAPTER
1
Getting Started
This chapter provides information and procedures needed to install and make the
Sun Netra CP3000 AMC.1-HDD SAS disk operational. This chapter should be read
before unpacking and installing the AMC.
In addition to this chapter, refer to the following safety document:
Important Safety Information for Sun Hardware Systems (816-7190)
Caution – When the system is plugged in, energy hazards are present on the
midplane. Do not reach into the enclosure while the power is on.
replacing hot-swappable components.
This chapter contains the following topics:
■
■
■
■
■
■
■
Section 1.1, “System Requirements” on page 1-2
Section 1.2, “Unpacking” on page 1-3
Section 1.3, “Handling AMCs” on page 1-4
Section 1.4, “AMC Faceplate” on page 1-5
Section 1.5, “AMC LEDs” on page 1-6
Section 1.6, “Removing and Installing AMCs” on page 1-8
Section 1.7, “Enabling and Disabling SAS Ports” on page 1-18
1-1
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1.1
System Requirements
The following sections briefly describe the minimum system requirements and the
configurable features. Links are provided to other chapters and appendixes
containing more detailed information.
1.1.1
Operating Systems Compatibility
The following operating systems are compatible with the AMC.1-HDD SAS disk.
■
■
■
■
Solaris™ 10
Solaris x86 10
Windows Server 2003
Red Hat Enterprise Linux (RHEL) 5
1.1.2
1.1.3
Chassis Compatibility
Before using this AMC.1-HDD SAS disk, review the specifications of the chassis and
backplane that will house the module to determine the presence of, and any
limitations of, chassis, IPMI bus, and user-defined pin-outs. For example, some
chassis backplanes route certain I/O pins to internal resources such as alarm cards
and drive resources. The AMC.1-HDD SAS disk is intended for an AdvancedTCA
AMC carrier card site that is AMC.1 compliant. It is your responsibility to verify
system compatibility. Failure to do so could result in improper operation or
equipment damage.
Blade Server Compatibility
The AMC.1-HDD SAS disk modules plug into ATCA carrier boards that support a
combination of AMC.1 (PCI Express) and AMC.3 (SAS) storage signaling.
At the time of publication of this document, the AMC.1-HDD SAS disk is qualified
and supported on the following Sun blade servers:
■
■
■
Sun Netra CP3060 blade server
Sun Netra CP3220 blade server
Sun Netra CP3250 blade server
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1.1.4
Electrical and Environmental
See Appendix B for electrical and environmental requirements.
Caution – None of the integrated chips junction temperature should exceed 125˚C.
The AMC requires air flow to meet this requirement. Testing should be done in the
shelf to find the quantity of air flow needed. The recommended minimum air flow is
50 LFM.
1.2
Unpacking
Check the shipping carton for damage. If the shipping carton or contents are
damaged, notify the carrier and Sun. Retain the shipping carton and packing
material for inspection by the carrier. Obtain authorization before returning any
product to Sun. Refer to the Netra CP3000 Advanced Mezzanine Card PCIe SAS
Controller and Hard Drive Getting Started Guide (820-7177) for return instructions.
Caution – This board must be protected from static discharge and physical shock.
Never remove any of the socketed parts except at a static-free workstation. Use the
antistatic bag shipped with the product to handle the board. Wear a wrist strap
grounded through one of the system's ESD ground jacks when installing or servicing
system components.
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1-3
1.3
Handling AMCs
Caution – The system is sensitive to static electricity. To prevent damage to the
assembly, always connect an antistatic wrist strap between you and the system.
Avoid touching areas of integrated circuitry. Static discharge can damage these
circuits.
An antistatic wrist strap and a conductive foam pad is strongly recommend for
handling AMCs when installing or upgrading a system. Electronic components, such
as disk drives, computer boards, and memory modules can be extremely sensitive to
electrostatic discharge (ESD). After removing the component from its protective
wrapper or from the system, place the component flat on a grounded, static-free
surface (and, in the case of a board, component side up). Do not slide the component
over any surface.
If an ESD station is not available, you can avoid damage resulting from ESD by
wearing an antistatic wrist strap (available in the shipkit and at electronics stores)
that is attached to an active electrical ground. Note that a system chassis might not
be grounded if it is unplugged.
Caution – Dangerous voltages, capable of causing injury or death, are present in
this equipment. Use extreme caution when handling, testing, and adjusting within a
system.
Caution – Do not flex the AMCs; the surface-mounted components can break if the
AMC is bent.
Our suppliers take significant steps to ensure that there are no bent pins on the
backplane or connector damage to the AMCs prior to leaving the factory. Bent pins
caused by improper installation or by AMCs with damaged connectors could void
the warranty for the backplane or boards.
To minimize the amount of AMC flexing, observe the following precautions:
■
■
■
When removing an AMC from an electrostatic discharge bag, keep the AMC
vertical until you place it on the electrostatic discharge mat.
Do not place an AMC on a hard surface. Use a cushioned antistatic mat. The
AMC connectors and components have very thin pins that bend easily.
Be careful of small parts located on the component side of an AMC.
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■
■
Do not use an oscilloscope probe on the components. The soldered pins are easily
damaged or shorted by the probe point.
Transport an AMC in an antistatic bag.
1.4
AMC Faceplate
The following shows the faceplate of the Sun Netra CP3000 AMC.1-HDD SAS disk.
FIGURE 1-1 AMC.1-HDD SAS Disk Faceplate
Note – The AMC is available in different capacities (in gigabytes). The illustration
shows a generic faceplate. For your product’s faceplate, the xxx denotes the capacity.
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1-5
1.5
AMC LEDs
The following tables give status information for all of the LEDs on the AMC.
TABLE 1-1 describes the LEDs defined by ATCA to monitor board status.
TABLE 1-1
LED
AMC Status LEDs
Color
State
Description
Hot-swap Blue
On
Management power is available to the AMC, and
the AMC can safely be extracted.
Off
The AMC is operational and is unsafe for
extraction.
Long blink
Short blink
Off
Delay before AMC is activated.
Delay before AMC is deactivated.
AMC is in service.
OOS
OK
On
Light is on when AMC is Out Of Service.
The AMC is booted and switching.
12V payload power is not detected.
Green
On
Off
TABLE 1-2 describes in detail the different hot-swap BLUE LED states.
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TABLE 1-2
Hot-Swap BLUE LED States
Order
Visible State
State
Description
1
Solid
M1 FRU Inactive The Intelligent Platform
Management Interface (IPMI)
microcontroller is booted, but the
payload is not. The bottom latch is
not fully closed or the activation
lock bit set is keeping AMC from
activating.
2
Blinking (from solid)
M2 Activation
Request
The bottom latch is closed or
activation lock bit has been cleared.
The IPMI microcontroller has
requested permission to boot the
payload from the shelf
management controller.
3
4
Off
M3-M4 Active
The IPMI microcontroller has
received permission to activate the
payload, and has done so. This
should be the state under normal
operation.
Blinking (from off)
M5-M6
Deactivation
Request
The IPMI microcontroller has
requested permission to deactivate.
Opening the bottom latch or
resetting the deactivation lock bit
activates this state.
Note – An AMC should be hot-swapped only when the LED is solid blue.
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1.6
Removing and Installing AMCs
This section describes how to remove and install AMCs.
The AMC.1-HDD SAS disk can be installed into an ATCA shelf (chassis) with sites
that support AMC.1 PCI Express signaling. The site height must properly match the
panel height fitted to the AMC.
At the time of publication of this document, the AMC.1-HDD SAS disk is qualified
and supported on the following Sun blade servers:
■
■
■
Sun Netra CP3060 blade server
Sun Netra CP3220 blade server
Sun Netra CP3250 blade server
1.6.1
If you want to remove only an AMC from a blade server, use the following
instructions.
If you want to remove the blade server with the AMC installed, see the next section
Section 1.6.2, “Removing a Blade Server and AMC” on page 1-12.
Caution – Before removing an AMC, read all cautions, warnings, and instructions
presented earlier in this chapter.
1. Shut down the payload OS.
Removing a board before powering down the operating system might cause an
OS panic, which could corrupt data or file systems.
2. At the front of the blade server, locate the AMC you want to remove.
Depending on the blade server’s AMC site location, you might have to remove
the blade server from the chassis. Some blade servers have compartments for
AMCs that can only be accessed when the blade server is removed from the
chassis.
3. If the blade server must be removed to access the AMC, go to Section 1.6.2,
“Removing a Blade Server and AMC” on page 1-12.
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Note – Depending on how the Shelf controls deactivation, the Shelf might not
initiate deactivation when you disengage the ejector latch. If so, either configure the
Shelf to allow deactivation via latch opening or deactivate by other methods.
4. For the AMC, initiate the hot-swap deactivation sequence by pulling the
The Hot-Swap LED starts blinking.
5. Wait until the Hot-Swap LED is solid blue.
6. When the Hot-Swap LED is solid blue, pull the injector/ejector latch out
completely (FIGURE 1-2).
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1-9
FIGURE 1-2 Deactivating the AMC
Figure Legend
1
2
3
Fully In (IN) When IN, the module communicates to the shelf manager that the module is not in the
hot-swap state, and the shelf manager communicates with the MMC. This position is for normal
operation.
Half Way (HW) When in the HW position, the hot-swap sequence is initiated. The MMC sends a
hot-swap event to the shelf manager.
Out (OUT) When OUT, the latching mechanism is released and the module can be extracted. Wait
for the Hot-Swap LED to stop blinking before pulling the latch all the way out.
1-10
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7. Remove the AMC.
FIGURE 1-3 Removing the AMC
8. Replace the AMC with another AMC (FIGURE 1-7) or install a filler panel.
Note – Be sure to follow handling instructions. See Section 1.3, “Handling AMCs”
on page 1-4.
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Caution – Failure to fill all slots with AMCs or cover with filler panels can
negatively impact the cooling of the system.
1.6.2
Removing a Blade Server and AMC
Following are the instructions for removing a blade server and installed AMC. For
additional information, refer to your blade server documentation.
Caution – Before removing a blade server and AMC, read all cautions, warnings,
and instructions presented earlier in this chapter.
1. Move the front cable management bracket to the lower position (FIGURE 1-4).
FIGURE 1-4 Front Cable Management Bracket in Lower Position
2. Disengage the injector/ejector mechanisms at the top and bottom of the blade
server to notify software that the board is about to be removed. Wait for the
Hot-Swap LED to light.
1-12
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Note – Depending on how the Shelf controls deactivation, the Shelf might not
initiate deactivation when you disengage the ejector latch. If so, either configure the
Shelf to allow deactivation via latch opening or deactivate by other methods.
3. Disconnect all cables connected to the switch.
4. Loosen the two board retention screws that fasten the board to the enclosure.
5. Open the ejectors fully, rotating the handles outward until the board
disengages from the midplane.
6. Slide the board evenly out of the enclosure.
7. Determine if you are going to replace the blade server.
■
■
If you are going to replace the blade server, refer to your blade server
documentation for procedures.
If you are not going to replace the blade server, install a filler panel to maintain
the enclosures shielding and cooling performance.
Caution – Failure to cover all open slots with filler panels can negatively impact the
cooling of the system.
1.6.3
Installing an AMC
Following are the instructions for installing an AMC.
Caution – Before installing an AMC, read all cautions, warnings, and instructions
presented earlier in this chapter.
1. At the blade server, locate the AMC site where you want to install the AMC.
Depending on the blade server’s AMC site location, you might have to remove
the blade server from the chassis. Some blade servers have compartments for
AMCs that can only be accessed when the blade server is removed from the
chassis.
Prevent possible damage to module components by verifying the proper site
usage for your configuration. In most cases, electronic keying (e-Keying) prevents
power on of a board into an incompatible site. However, as an extra precaution,
know the site purpose.
2. Remove the filler panel, if necessary.
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3. Obtain the AMC card from the ship kit.
Note – Be sure to follow unpacking and handling instructions. See Section 1.2,
“Unpacking” on page 1-3 and Section 1.3, “Handling AMCs” on page 1-4.
FIGURE 1-5 Sample Top View
Note – The illustration shows a sample of the top view for a 146GB AMC. If your
AMC has a different capacity, the label shows it.
4. Perform any card-specific hardware procedures, if necessary.
5. Prepare the AMC by fully opening its injector/ejector latches to the OUT
position.
1-14
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FIGURE 1-6 Opening the Injector/Ejector Latch
Figure Legend
1
2
3
Fully In (IN) When IN, the module communicates to the shelf manager that the module is not in the
hot-swap state, and the shelf manager communicates with the MMC. This position is for normal
operation.
Half Way (HW) When in the HW position, the hot-swap sequence is initiated. The MMC sends a
hot-swap event to the shelf manager.
Out (OUT) When OUT, the latching mechanism is released and the module can be extracted. Wait
for the Hot-Swap LED to stop blinking before pulling the latch all the way out.
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6. Carefully align the edges of the AMC with the guides in the appropriate site.
It might be helpful to look into the enclosure to verify correct alignment of the
rails in the guides.
Caution – Do not force the AMC into the site. If it does not fit properly, check to
ensure that you have the correct matching AMC for the switch.
7. Keeping the AMC aligned in the guides, slide it in by pressing on the AMC
faceplate until the AMC faceplate is flush with the blade server faceplate.
1-16
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FIGURE 1-7 Inserting the AMC Into a Blade Server
8. Push the ejector latch in fully.
If system power is on and AMC is installed properly, the AMC board Hot-Swap
LED lights up. The Hot-Swap LED blinks for several seconds, then goes off.
If the Hot-Swap LED does not go off after several seconds, push firmly on the
injector/ejector handles to ensure that they are pushed in all the way.
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Caution – Failure to fill all slots with AMCs or cover with filler panels can
negatively impact the cooling of the system.
9. Power on the system, if necessary.
Refer to your system manual for instructions on correctly powering on the
system. After power is applied to the chassis, the internal MMC controller runs a
self-test that runs for approximately 10 seconds. Upon a successful power up
self-test, the blue Hot-Swap LED will blink and then turn off, indicating that the
module has been placed in operation.
1.7
Enabling and Disabling SAS Ports
As shipped from the factory, the AMC.1-HDD SAS disk will not drive AMC channel
ports, unless specifically enabled. You can individually enable or disable the ports
using lsiutil, a command-line utility supplied by LSI Corporation, and
distributed as part of the software driver distribution. Changes are stored in 32K x
8-bit NVSRAM, located on the module.
▼ To Enable AMC Port 2 (Driven by Port 1 of SAS
Controller)
lsiutil –p 1 –a 13,,,,1,1,,,,,,,,,0,0
▼ To Enable AMC Port 3 (Driven by Port 2 of SAS
Controller)
lsiutil –p 1 –a 13,,,,2,1,,,,,,,,,0,0
The “-p 1” selects the controller chip. If the AMC.1-HDD SAS disk is the only LSI
controller chip present in the system then the default is controller 1. If there are other
LSI controller chips present in the system, then the user has to determine the proper
controller number.
1-18
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Note – This utility has many other uses and adjustable values. Parameter
adjustments are permanently committed to flash memory, and affect future behavior
of the AMC. Only advanced users who fully understand the technical implications
should modify parameters. A full description of parameters and functions is in
LSIUtil Configuration Utility User’s Guide, published by LSI.
▼ To Disable AMC Port 2 (Driven by Port 1 of SAS
Controller)
lsiutil –p 1 –a 13,,,,1,0,,,,,,,,,0,0
▼ To Disable AMC Port 3 (Driven by Port 2 of SAS
Controller)
lsiutil –p 1 –a 13,,,,2,0,,,,,,,,,0,0
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CHAPTER
2
Overview
brief descriptions. This chapter can be used to compare the features of the AMC
against the needs of a specific application.
This chapter contains the following topics:
■
■
■
■
■
Section 2.1, “Features” on page 2-2
Section 2.2, “Key Components” on page 2-3
Section 2.4, “Functional Diagram” on page 2-7
Section 2.5, “Technical Support and Warranty” on page 2-7
Section 2.6, “Part Number, Serial Number, and Revision Number Identification”
on page 2-8
■
Section 2.7, “Disposal” on page 2-10
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2.1
Features
Part of Sun’s ATCA platform, the Sun Netra CP3000 AMC.1-HDD SAS disk complies
with PICMG 3.0 AdvancedTCA Specification R2.0 ECN002 and the following
specifications:
■
■
■
PICMG AMC.0 Rev. 2.0
AMC.1 Revision 1, PCI Express option
AMC.3 Revision 1, storage signaling option
The AMC.1-HDD SAS disk is an Advanced Mezzanine Card (AMC) that integrates
both an SAS hard drive disk and a x4 PCIe SAS controller. Occupying only one AMC
site, the highly integrated combination provides embedded systems designers the
ability to add an Enterprise SAS Hard Disk Drive (HDD) to a system that does not
have native SAS connectivity. The AMC.1-HDD SAS disk is offered as a single-width
AMC, with options for mid- or full-height panels. The hard drive is Form-Factor 2.5”
to provide the greatest spindle density for ATCA applications.
The AMC.1-HDD SAS disk plugs into ATCA carrier blades that support a
combination of AMC.1 (PCI Express) and AMC.3 (SAS) storage signaling.
The AMC.1-HDD SAS disk includes a modular management controller (MMC).
This AMC is designed for use in a wide variety of next-generation and
wireless-networking equipment. Designed for high performance and reliability, the
AMC.1-HDD SAS disk is ideal for telecommunications equipment manufacturers
(TEMs) and OEMs. TEMs can add SAS connectivity to networking equipment that
uses the ATCA platform specification. OEMs can design to the MicroTCA
specification for high-performance embedded systems.
The following briefly outlines the features of the AMC.1-HDD SAS disk:
■
Advanced Mezzanine Card (single-width, mid- or full-height); PICMG AMC.0
compliant
■
■
■
■
■
■
■
Hot-swappable
PCI Express interface (auto configure x1 or x4 lanes at 2.5 Gigabits per second
One Integrated 2.5” SAS hard drive (primary port)
Additional disk via AMC.3 storage signaling (drives adjacent site AMC port 2)
Additional disk via AMC.3 storage signaling (drives adjacent site AMC port 3)
All SAS links at 3 Gigabits per second maximum
Support for SSP, STP, and SMP, as defined in the Serial Attached SCSI (SAS)
Specification, version 1.0
■
Drive over-current protection
2-2
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■
Support for SATA, as defined in the Serial ATA Specification, version 1.0a.
2.2
Key Components
The following figure and sections describe key components of the Sun Netra CP3000
AMC.1-HDD SAS disk.
FIGURE 2-1 Top-Level AMC Layout
2.2.1
2.2.2
Hard Drive Disk
The Sun Netra CP3000 AMC.1-HDD SAS disk provides a single SAS hard drive,
with various capacity options available. When you order the product, choose the
part number corresponding to the capacity (in gigabytes) that you want.
Power Regulator
The power regulator is the part of the module that generates the required power
from the payload power (+12V) that is delivered to the module through the AMC
connector. This power is current-limited by the onboard regulator.
Chapter 2 Overview
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2.2.3
SAS Controller
The AMC.1-HDD SAS disk incorporates a PCIe-to-SAS host controller manufactured
by LSI Corporation, device model LSI-SAS1064E. The controller provides host access
to SAS and SATA disks. The controller features four lanes of PCI Express (2.5
gigabits per second each), and four lanes of SAS (3.0 gigabits per second each).
The SAS firmware for the LSI SAS supports the following:
■
■
■
■
■
■
■
3 gigabits per second SAS and SATA transfers
Device discovery
Both 3.0 gigabit and 1.5 gigabit SATA devices
x1 or x4 PCI Express bus
Mixed SAS and SATA disk operation
SATA tape drive
SAS expander compatibility
2.2.4
2.2.5
Flash
A flash device is preloaded with firmware that manages the protocols necessary to
communicate with SAS and SATA target devices. The flash device contains BIOS and
F-code to support boot from disk operations.
Module Management Controller (MMC)
The IPMI subsystem provides management control for the board, based on an Atmel
microcontroller. The MMC is the first system component to be brought up and must
negotiate with the carrier board over IPMI before the card payload is enabled.
The MMC monitors board voltages and temperature, controls the hot-swap and
failures status LEDs, controls e-Keying, and stores FRU information. For more
information about the MMC and management functions, see Chapter 3.
The MMC provides an Intelligent Platform Management Interface (IPMI) that
communicates with AdvancedTCA shelf managers. This MMC controls and
monitors the following:
■
■
■
Hot-swap communication with the shelf manager
Inlet air temperature
Voltage monitoring
2-4
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■
■
■
e-Keying as described in the AMC.0 specification
FRU information
LED indicators for hot-swap and OOS (out of service)
2.2.6
2.2.7
Port Connectors
The AMC includes connectors to communicate with the host board and take its
interfaces outside the ATCA chassis. Refer to Appendix A for complete connector
descriptions and pin-outs.
LEDs
The AMC.1-HDD SAS disk has three LEDs. See the next section for a detailed
description of the LEDs.
2.3
Faceplate and LEDs
The faceplate of the AMC.1-HDD SAS disk has three LED indicators, which are
described in the table following the faceplate illustration.
Note – The AMC is available in different capacities (in gigabytes). The illustration
shows a generic faceplate. For your product’s faceplate, the xxx denotes the capacity.
FIGURE 2-2 Faceplate
Chapter 2 Overview
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Figure Legend
Indicator Color
State
Description and Function
OOS
Red
On
Out of Service: fault set by shelf manager, or 12V payload power not detected.
1
Off
On
No module fault. 12V payload power is being supplied to board.
Module in service. 12V payload power is being supplied to board.
OK
Green
2
Off
On
12V payload power is not detected.
Hot Swap Blue
Management power available to the module; AMC can be safely extracted.
3
Off
The module is operational and is unsafe for extraction.
Delay before module is activated.
Long blink
Short blink Delay before module is deactivated.
2-6
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2.4
Functional Diagram
FIGURE 2-3 AMC SAS-HDD Functional Block Diagram
2.5
Technical Support and Warranty
If you have any technical questions or support issues that are not addressed in the
Sun Netra CP3000 Advanced Mezzanine Card PCIe Hard Drive and SAS Controller
documentation set or on the web site, contact your local Sun Services representative.
This hardware carries a one-year return-to-depot warranty.
For customers in the US or Canada, call 1-800-USA-4SUN (1-800-872-4786).
For customers in the rest of the world, find the World Wide Solution Center nearest
you by visiting our web site:
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When you call Sun Services, indicate if the Sun Netra CP3000 AMC.1-HDD SAS disk
was purchased separately and is not associated with a system. Have the proper
AMC identification information ready. Be prepared to give the representative the
AMC part number, serial number, and date code (FIGURE 2-4).
2.6
Part Number, Serial Number, and
Revision Number Identification
The Sun Netra CP3000 AMC.1-HDD SAS disk part number, serial number, and
revision can be found on labels located on the card (FIGURE 2-4). The Sun barcode
labels provide the following information:
■
SunSN – Sun serial number (for example, 1005LCB-0626WM001M)
■
SunPN – Sun part number and dash number (for example, 501-7658-01), -01 is the
dash number
■
Rev – Revision number of the part (for example, Rev 06)
The Media Access Control (MAC) address label contains the MAC address for the
blade server in printed and barcode form.
2-8
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FIGURE 2-4 Sun Netra CP3000 AMC.1-HDD SAS disk Barcode Labeling
Figure Legend
Final Assembly Number:
1
• Assembly process label, where xxx denotes disk drive capacity
• Rzz = Assembly Revision (Refer to Bill Of Material) where zz is a numeric revision
Sub-Assembly Number:
2
• P/N = sub assembly Part Number 600-05101x
3
Serial Number:
• S/N Format:AAA = Assembly Number (051)
• L =Location of manufacturer (S)
• Y = Calendar year of manufacturer (2008 = 8)
• MM = Calendar month of manufacturer (March = 03)
• SSSS = Sequence number (reset each month) (1234)
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Figure Legend
4
Sun Product Label:
• SUN S/N Format
• Sun Part Number
5
6
SAS WWN = SAS World Wide Name
Safety label
2.7
Disposal
The AMC might contain materials that require regulation upon disposal. Please
dispose of this product in accordance with local rules and regulations. For disposal
or recycling information, please contact your local authorities or the Electronic
2-10
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CHAPTER
3
Managing the AMC
This chapter describes the AMC management software.
The Sun Netra CP3000 AMC.1-HDD SAS disk includes an IPMI-based Module
Management Controller (MMC) that meets all requirements set out in the PICMG
controllers on the carrier board and system level. Board voltages, temperature, and
This chapter contains the following topics:
■
■
■
■
■
Section 3.1, “Monitoring and Control Functions” on page 3-2
Section 3.2, “IPMI Controller” on page 3-2
Section 3.3, “FRU Information” on page 3-4
Section 3.4, “Sensors” on page 3-5
Section 3.5, “Firmware and Software Upgrades” on page 3-6
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3.1
3.2
Monitoring and Control Functions
The MMC is responsible for communicating module status information to the carrier
board, and also has some control at the module level. The 10GbE local PHY is held
in reset until the AMC Carrier IPMI uses e-Keying to turn on the interface (to ensure
that the interface is compatible). The MMC has the ability to reset the PHY through
the IPMI FRU Control command.
IPMI Controller
The IPMI controller consists of a 16-bit microcontroller, flash, and SRAM. The
microcontroller uses I2C interface (IPMB-L) to collect data from various sensors
located on the AMC. The host ATCA blade server might read data collected by the
IPMI controller, and transmit it to the shelf management controller (ShMC) through
the IPMB-0.
The IPMB is routed through the AMC connector to the host carrier blade and
backplane. The IPMB allows the AMC MMC to be discovered by and communicate
with the carrier blade and system-level management. It is always active.
The MMC communicates with the carrier controller through the local IPMB-L bus of
the carrier and responds to all mandatory commands for AMC MMC (as defined in
the AMC Specification), as well as some optional commands.
TABLE 3-1
Supported IPMI Commands
IPMI/PICMG/AMC
Command
Specification
NetFn
CMD
MMC Req
IPM Device Global Commands
Get Device ID
17.1
17.9
App
App
01h
01h
Mandatory
Mandatory
Broadcast Get Device ID
Messaging Commands
Send Message
18.7
23.3
29.2
App
S/E
S/E
34h
02h
20h
Optional
Event Commands
Platform Event
Mandatory
Mandatory
Sensor Device Commands
Get Device SDR Info
3-2
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TABLE 3-1
Supported IPMI Commands (Continued)
Get Device SDR
29.3
29.4
S/E
S/E
21h
22h
Mandatory
Mandatory
Reserve Device SDR
Repository
Get Sensor Reading Factors 29.5
S/E
S/E
S/E
S/E
S/E
S/E
S/E
S/E
S/E
S/E
23h
24h
25h
26h
27h
28h
29h
2Ah
2Bh
2Dh
Optional
Optional
Optional
Optional
Optional
Optional
Optional
Optional
Optional
Mandatory
Set Sensor Hysteresis
Get Sensor Hysteresis
Set Sensor Threshold
Get Sensor Threshold
Set Sensor Event Enable
Get Sensor Event Enable
Rearm Sensor Events
Get Sensor Event Status
Get Sensor Reading
29.6
29.7
29.8
29.9
29.10
29.11
29.12
29.13
29.14
FRU Device Commands
Get FRU Inventory Area Info 28.1
Storage
Storage
Storage
10h
11h
12h
Mandatory
Mandatory
Mandatory
Read FRU Data
28.2
28.3
Write FRU Data
AdvancedTCA™ Commands
Get PICMG Properties
FRU Control
3-9
PICMG
PICMG
PICMG
PICMG
PICMG
PICMG
PICMG
00h
04h
05h
06h
07h
08h
0Dh
Mandatory
Mandatory
Mandatory
Mandatory
Mandatory
Mandatory
Mandatory
3-22
3-24
Get FRU LED Properties
Get LED Color Capabilities 3-25
Set FRU LED State
Get FRU LED State
3-26
3-27
3-29
Get Device Locator Record
ID
AMC® Commands
Set AMC Port State
Get AMC Port State
3-27
3-28
PICMG
PICMG
19h
Mandatory
Mandatory
1Ah
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3-3
3.3
FRU Information
Board information such as serial number, date of manufacture, OEM name, part
number, and so on is retrievable from the FRU EEPROM integrated into the MMC.
FRU information stored onboard the AMC.1-HDD SAS disk complies with the
PICMG 2.9 specification.
The AMC.1-HDD SAS disk includes the standard FRU data records per the IPMI
Platform Management FRU Information Storage Definition, Board Info Area. The
AMC.1-HDD SAS disk includes additional FRU records as defined in the PICMG 2.9
specification.
TABLE 3-2
Standard FRU Data Records
Product Information
Version
AMC.1-HDD SAS Disk
1
Language Code
MFG date.time
Manufacturer Name
Product Name
0 (EN-English)
See note 1
Sun Microsystems, Inc.
SAS AMC.1 xxxGB disk, where xxx denotes
disk capacity
Product Serial Number
Product Part / Model#
2009NAT-YYWWNTSSSS (See note 2)
375-mmmm-01 or 376-mmmm-01, where
mmmm denotes product model based on disk
capacity
Product Version
50
1 Manufacturing time is defined as 'minutes since January 1, 1996 in the IPMI FRU specification.
2 Serial Number format:
2009NAT = vendor and factory code
YY = year (4 = 2004, 0 = 2010)
NT = multiuse code
WW = work week
SSSS = sequence number (0-9999)
3-4
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3.4
Sensors
The AMC.1-HDD SAS disk module management is connected to sensors monitoring
key board voltages and temperatures. Data records from the following sensors are
accessible using IPMI commands:
■
■
■
■
■
■
Hot-swap
+12V payload power
+3.3V management power
Board and inlet temperature
+1.2V onboard voltage (generated from payload)
+3.3V onboard voltage (generated from payload)
Note – The sensor index number is dynamically created by the shelf manager and
might not always start at index zero (0).
TABLE 3-3
Threshold Sensors
Lower
Upper
Thresholds
Minor
Non-
Thresholds
Non-
recoverable
Sensor Name
Type
Description Units
Critical
recoverable Minor
Critical
0
1
Hot-
swap
Hot-
swap
Hot-swap
sensor
M
states
N/A
3.162
N/A
N/A
3.005
1.059
N/A
3.462
N/A
N/A
3.605
1.353
+3.3V
STBY
Voltage Voltage
Volts
3.105
1.088
3.505
1.324
2
3
4
+1.2V
+12V
Voltage Voltage
Voltage Voltage
Volts
Volts
1.118
1.294
10.853
10.248 10.027
13.218
65.450
13.822 14.043
76.440 85.860
Board
temp
Temp
Temp
Celsius N/A
N/A
N/A
5
Inlet
Temp
Temp
Celsius N/A
N/A
N/A
65
75
85
temp
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3-5
3.5
Firmware and Software Upgrades
For up-to-date instructions on upgrading the firmware and software, refer to the
following documentation:
■
Sun Netra CP3000 Advanced Mezzanine Card PCIe Hard Drive and SAS Controller
Product Notes (820-7174)
■
README files within the download package
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CHAPTER
4
Configuring the AMC
Configuration Utility, the OpenBoot™ BIOS, and the Extensible Firmware Interface
(EFI) Boot Services Driver.
This chapter contains the following topics:
■
■
■
■
■
Section 4.1, “Configuration Tools” on page 4-2
Section 4.2, “Boot BIOS Utility” on page 4-2
Section 4.3, “OpenBoot BIOS” on page 4-5
Section 4.4, “Extensible Firmware Interface (EFI) BIOS” on page 4-6
Section 4.5, “Enabling and Disabling Channel Ports” on page 4-6
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4.1
Configuration Tools
The configuration tools are preloaded on a flash ROM device embedded on the
AMC. A MicroTCA or host carrier CPU can read the code to facilitate booting from
SAS drives. The BIOS contains an embedded configuration manager, which you use
to configure RAID or other adapter options prior to OS boot. The BIOS integrates
with a standard system BIOS, extending the standard disk-service routine provided
through INT13h.
Three types of BIOS are available for the AMC.1-HDD SAS disk:
■
■
■
Boot BIOS for Intel- and AMD-based platforms
OpenBoot BIOS for Solaris SPARC® platforms.
Extensible Firmware Interface (EFI) BIOS for EFI-compliant systems
All of these BIOS images are stored on the flash device located on the AMC.
4.2
Boot BIOS Utility
The Boot BIOS utility allows you to change the default (factory) configuration of the
AMC. The utility is stored in a flash device located on the AMC module. The
sections that follow provide a summary of the BIOS configuration capabilities. A full
description of capabilities is published in User’s Guide, Integrated RAID for SAS,
available from LSI Corporation, which writes the BIOS used on the AMC.
Note – The Boot BIOS utility is disabled by default on all AMCs. To use it, enable
the utility per the instructions in this chapter.
When Boot is enabled, the Boot BIOS scans for SAS hard drive disks (HDDs)
connected to the AMC. It sorts which HDDs might be participating in RAID volume
definitions. All discovered disks and RAID volumes are enumerated with drive
letters and appended to a master list of devices discovered on the host. Upon scan
completion, the host serially inspects the master list of devices beginning with drive
letter A, and attempts to boot from the first device it finds with a boot record.
4-2
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4.2.1
4.2.2
Features and Configurations
The Boot BIOS supports the following:
■
■
■
■
■
■
Using multiple AMC.1 SAS modules
Applying global properties stored in flash
Selecting and configure up to 256 adapters
Automatic INT13 drive mapping for SAS drives
SAS topology discovery, including expander traversal
Applying PHY transceiver properties
Launching the Boot BIOS Utility
Note – Not all devices detected by the utility can be controlled by the BIOS. Devices
such as tape drives and scanners require loading a device driver specific to that
peripheral device.
1. Initiate loading of the BIOS, and watch for the following message.
Press Ctrl-C to start LSI Configuration Utility...
This message remains on your screen for about five seconds, giving you time to
start the utility.
2. Press CTRL C.
Please wait, invoking LSI Configuration Utility...
After a brief pause, the Boot BIOS Main menu is displayed, as shown in the
following figure.
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4-3
FIGURE 4-1 Boot BIOS Main Menu
The menu displays a scrolling list of all the AMC SAS modules visible in the system,
with PCI Express (PCIe) identification information.
3. Use the arrow keys to highlight the AMC module you want to configure.
4. Press ENTER to display the next screen.
The Adaptor Properties menu is displayed, where you can view and modify AMC
parameters.
This menu provides the top-level view of AMC status and configurable
parameters.
4-4
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FIGURE 4-2 Adapter Properties Menu
5. Using the arrow keys, select the item of interest.
6. Press ENTER to display the next screen.
4.3
OpenBoot BIOS
For information about the OpenBoot BIOS, refer to the Sun Solaris OS and SPARC
documentation. The documentation is available at the following site:
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4-5
4.4
4.5
Extensible Firmware Interface (EFI)
BIOS
The AMC.1-HDD SAS disk includes an EFI boot services driver for use with ATCA
blades that feature Intel® IA64 processors. Additional information is available at
Enabling and Disabling Channel Ports
As shipped from the factory, the AMC.1-HDD SAS disk will not drive AMC channel
ports, due to the default “disable” setting. You can enable these ports using
lsiutil, a command line utility. For instructions, see Section 1.7, “Enabling and
Disabling SAS Ports” on page 1-18.
4-6
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APPENDIX
A
Connectors and Ports
the host board and application-specific devices. A brief description of each connector
This appendix contains the following topics:
■
■
■
Section A.1, “Connector Locations and Assignments” on page A-2
Section A.2, “Connector Pinouts” on page A-2
Section A.3, “SAS Controller Ports” on page A-4
A-1
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A.1
Connector Locations and Assignments
This module is AMC.1 and AMC.3 compliant and can use ports 2 and 3, as defined
in the AMC.3 specification.
Callout
Port
2
Function
1
2
3
4
5
6
AMC.3 Serial Storage Port 2
AMC.3 Serial Storage Port 3
AMC.1 PCI Express lane 0
AMC.1 PCI Express lane 1
AMC.1 PCI Express lane 2
AMC.1 PCI Express lane 3
3
4
5
6
7
A.2
Connector Pinouts
The AMC.1-HDD SAS disk includes an AMC connector, which conforms to the
single-slot B+ extended connector, with 170 signal contacts.
The AMC.1-HDD SAS disk communicates with the carrier board through the AMC
connectors. Connector usage for the AMC.1-HDD SAS disk is listed in the following
table.
TABLE A-1 Pin Assignments
Pin# Signal Name
Pin#
46
47
48
49
50
51
52
53
Signal Name
Pin#
91
92
93
94
95
96
97
98
Signal Name
No Connect
GND
Pin#
136
137
138
139
140
141
142
143
Signal Name
No Connect
GND
1
2
3
4
5
6
7
8
GND
GND
12V
'PORT4_PCIe_RX0_P'
'PORT4_PCIe_RX0_N'
GND
'PRSNT1_L'
'AMC_VCC3'
GA0
No Connect
No Connect
GND
No Connect
No Connect
GND
'PCIe_TX1_P'
'PCIe_TX1_N'
GND
No Connect
GND
No Connect
No Connect
GND
No Connect
No Connect
GND
No Connect
'PCIe_RX1_P'
A-2
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TABLE A-1 Pin Assignments (Continued)
9
12V
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
'PCIe_RX1_N'
GND
99
No Connect
No Connect
GND
144
145
146
147
148
149
150
151
152
153
154
155
156
157
158
159
160
161
162
163
164
165
166
167
168
169
170
No Connect
No Connect
GND
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
GND
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
129
No Connect
No Connect
GND
'IPMI_SCL_L'
12V
No Connect
No Connect
GND
No Connect
No Connect
GND
GND
No Connect
No Connect
GND
'PCIe_TX2_P'
'PCIe_TX2_N'
GND
No Connect
No Connect
GND
No Connect
No Connect
GND
GA1
'PCIe_RX2_P'
'PCIe_RX2_N'
GND
12V
No Connect
No Connect
GND
No Connect
No Connect
GND
GND
'PORT1_PTX0_P'
'PORT1_PTX0_N'
GND
'PCIe_TX3_P'
'PCIe_TX3_N'
GND
No Connect
No Connect
GND
No Connect
No Connect
GND
'PORT1_PRX0_P'
'PORT1_PRX0_N'
GND
'PCIe_RX3_P'
'PCIe_RX3_N'
GND
No Connect
No Connect
GND
No Connect
No Connect
GND
GA2
'IPMI_SDA_L'
12V
12V
No Connect
No Connect
GND
No Connect
No Connect
GND
GND
GND
'TX_SAS_2+'
'TX_SAS_2-'
GND
No Connect
No Connect
GND
No Connect
No Connect
GND
No Connect
No Connect
No Connect
No Connect
No Connect
GND
'RX_SAS_2+'
'RX_SAS_2-'
GND
No Connect
No Connect
GND
No Connect
No Connect
GND
'TX_SAS_3+'
'TX_SAS_3-'
GND
PREFCLKP
PREFCLKN
GND
No Connect
No Connect
GND
'RX_SAS_3+'
'RX_SAS_3-'
'PRSNT0_L'
12V
No Connect
Appendix A Connectors and Ports
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A-3
TABLE A-1 Pin Assignments (Continued)
40
41
42
43
44
45
GND
85
GND
130
131
132
133
134
135
No Connect
GND
'AMC_ENABLE_L' 86
GND
12V
87
88
89
90
No Connect
No Connect
GND
No Connect
No Connect
GND
GND
'PCIe_TX0_P'
'PCIe_TX0_N'
No Connect
No Connect
A.3
SAS Controller Ports
The AMC.1-HDD SAS disk incorporates four dedicated SAS controller ports as
follows.
TABLE A-2
SAS Controller Port
Dedicated Function
0
Routes to the onboard SAS disk drive, primary port A
Routes to AMC channel 2 (connects to SAS or SATA disk)
Routes to AMC channel 3 (connects to SAS or SATA disk)
No Connect
1 (See Note)
2(See Note)
3
These SAS ports are shipped with PHY’s disabled and are not driving AMC ports 2 and 3. This default configura-
tion avoids incompatibilities with systems that have other initiators driving these AMC ports.
A-4
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A.4
e-Keying Ports
The AMC.1-HDD SAS disk connects up to two SAS ports on the AMC connector.
These ports are defined by the AMC.3 specification for serial storage. The module
designates four PCI Express ports, per AMC.1 specification. The link type and link
type extension are defined in the following table.
TABLE 0-1
AMC e-Keying Port Assignments
Port # Port Name
Link Type
AMC Port Map Region
0
1
2
Unused
Unused
Channel 0
Link type 7 = AMC.3
storage,
Common options
Link type extension = 2
(SAS and SATA)
AMC asymmetric match =
00b (SAS)
3
Channel 1
Link type 7 = AMC.3
storage,
Link type extension = 2
(SAS and SATA)
AMC asymmetric match =
00b (SAS)
Common options
Common options
4-7
Channel 2
Channel 3
Link type 2 = AMC.1 PCI
Express typ e = 4
4
Like type 2 = AMC.1 PCI
Express type 1
8-20 Unused
Appendix A Connectors and Ports
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A-5
A-6
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APPENDIX
B
Environment Specifications
This appendix describes the electrical, environmental, and mechanical specifications.
It includes illustrations of the board dimensions.
This appendix contains the following topics:
■
■
■
Section B.1, “Electrical and Environmental” on page B-2
Section B.2, “Reliability” on page B-4
Section B.3, “Mechanical” on page B-5
B-1
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B.1
Electrical and Environmental
The following sections provide tables and illustrations showing the electrical and
environmental specifications.
B.1.1
Electrical
The AMC.1-HDD SAS disk shall consume no more than the following from the
system supplies under normal operating conditions.
TABLE B-1 Electrical Specifications
SUPPLY
SAS (Max
Management power
+12V (spin up less than 8 secs)
+12V normal operating
+12V (idle)
Less than 100 mA
1.5A (18W)
1.0A (12W)
0.75A (9W)
Off State
Less than 0.4W
1.5A during spin-up
Max current draw
B.1.2
Environmental
The environmental values are listed in the following table.
TABLE B-2 Environmental Specifications
Specification
Enterprise SAS
Temperature
Operating (ambient)
Disk enclosure surface
Nonoperating
5ºC to 55ºC
5ºC to 60ºC (operating)
–40ºC to 70ºC
Gradient
3 ºC/min – (20ºC/hour)
5% to 95%
Relative humidity
Operating
Nonoperating
5% to 95%
Maximum wet bulb
29ºC (operating)
B-2
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TABLE B-2 Environmental Specifications (Continued)
Vibration
Operating
Nonoperating
Operating
Nonoperating
Operating
Nonoperating
RPM
1 G (20 to 300 Hz)
5 G (20 to 300 Hz)
Shock
100 G/1ms duration
400 G/1ms duration
–1,000 to +10,000 feet
–1,000 to +40,000 feet
10,025 rpm
Altitude
Performance
Seek time avg
Seek time max
Interface
Read/write 4.5 m/s (typical)
Read/write 9.0m/s (typical)
SAS 3.0 Gb
MTBF
See the following table.
TABLE B-3 MTBF Values by Temperature
Temperature
0ºC
MTBF
1234247.92
1104059.81
977994.82
858417.32
747143.26
645377.07
553731.31
472305.36
400796
5ºC
10ºC
15ºC
20ºC
25ºC
30ºC
35ºC
40ºC
45ºC
50ºC
55ºC
60ºC
65ºC
70ºC
338615.02
284997.04
239088.16
200012.91
166920.57
139014.35
Appendix B Environment Specifications
B-3
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B.1.3
Absolute Maximum Ratings
The following values are stress ratings only. Do not operate at these maximums. See
Section B.1.4, “Normal Operating Ranges” on page B-4 for normal operating
conditions.
Payload voltage, +12V
0 VDC to +13.2 VDC
Management voltage, +3.3V
3.135 VDC to +3.465
VDC
Storage temperature
–40 to +70˚ Celsius
Noncondensing relative humidity
5% to 95% at 29˚ Celsius
B.1.4
Normal Operating Ranges
Description
Range
Nominal operating voltage
+10.8 to +13.2 VDC payload power
3.135 VDC to +3.465 VDC management
power
Operating temperatures*:
• 60m below sea level up to 1800m above sea
level
–5˚ to +55˚C
• from 1800m up to 4000m above sea level
–5˚ to +40˚C
Operating humidity
Less than 85% at 29˚C
Idle power consumption (without links)
Maximum power consumption
9W
12W
*The MTBF will be significantly reduced if operated above 30˚C for more than 96 consecutive hours.
B.2
Reliability
Reliability prediction was done using Telcordia document SR-332, Issue 1. The
prediction assumed 25˚ Celsius operating temperature with 100 percent duty cycle,
in a ground-benign, controlled environment.
■
MTBF: 630,000 hours
■
One year limited warranty
B-4
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B.3
Mechanical
This section includes the mechanical specifications for dimensions and weight. The
AMC.1-HDD SAS disk meets the PICMG 3.0 AdvancedTCA Specification R2.0
ECN002 and AMC.0 R2.0 for all mechanical parameters.
B.3.1
Board Dimensions and Weight
The AMC.1-HDD SAS disk is 181.5 mm by 73.5mm and conforms to the component
height requirements of a mid-size module and can be configured as a full-size
module. PCI Express x4 connections are made through the AMC edge fingers.
The AMC.1-HDD SAS disk conforms to the PICMG AMC.0 single-width, mid-height
AMC Form Factor for all mechanical parameters. Mechanical dimensions are shown
in the illustration and are outlined in the following table.
Item
Dimensions or Weight
PCB
181.5 mm x 73.5 mm x 1.6 mm
AMC.0 R2.0 single-width, full-height form factor
181.4g
Board
Weight
FIGURE B-1 AMC.1-HDD SAS disk PCB Dimensions
Appendix B Environment Specifications
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B-5
B-6
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APPENDIX
C
Agency Certifications
This appendix lists standards agencies and the certifications related to the Sun Netra
CP3000 AMC.1-HDD SAS disk.
This product was tested in an EMC-compliant chassis and meets the requirements
for EN55022 Class A equipment. Compliance was achieved under the following
conditions:
■
Conductive chassis rails connected to earth ground, providing the path for
connecting shields to earth ground
■
Front panel screws properly tightened
Failure to do so could compromise the EMC compliance of the equipment containing
the module.
This appendix contains the following topics:
■
■
■
■
■
Section C.1, “CE Certification” on page C-2
Section C.2, “NEBS/ETSI” on page C-2
Section C.3, “Safety” on page C-3
Section C.4, “Emissions Test Regulations” on page C-4
Section C.5, “Regulatory Information” on page C-5
C-1
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C.1
C.2
CE Certification
The Sun Netra CP3000 AMC.1-HDD SAS disk meets the intent of Directive
89/336/EEC for Electromagnetic Compatibility [EN55024:1998, EN55022:2006] and
Low-Voltage Directive 73/23/EEC for Product Safety [EN60950-1:2001]. A certificate
of incorporation is available upon request. The final system configuration must be
reconsidered as a whole per these directives.
NEBS/ETSI
The Sun Netra CP3000 AMC.1-HDD SAS disk has been designed to meet or exceed:
■
Telcordia specification SR-3580 Issue 3, June 2007
■
Telcordia GR-63, Issue 3, March 2006, Network Equipment-Building System
(NEBS) Requirements—Physical Protection
■
Telcordia GR-1089, Issue 4, June 2006, Electromagnetic Compatibility And
Electrical Safety Generic Criteria For Network Telecommunication Equipment
■
ETSI EN 300 019-2-1 V2.1.2 (2000-09), -2-2 V2.1.1 (1999-09), -2-3 V2.2.2 (2003-04),
Environmental conditions and environmental tests for telecommunication
equipment; Part 2
■
■
ETSI EN 300 119-5, V1.2.2 (2004-12), Part 4: Engineering requirements for subracks
in miscellaneous racks and cabinets
ETSI EN 300 132-2, September 1996, Equipment Engineering Power Supply
Interface At The Input To Telecommunications Equipment; Part 2: Operated by
direct current (DC
■
ETSI EN 300 753, October 1997, Acoustic Noise Emitted By Telecommunications
Equipment
Certification is dependent on your configuration.
C-2
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C.3
Safety
■
UL/cUL 60950--1 Safety for Information Technology Equipment (UL File
#E138926)
ST
■
EN/IEC 60950-1:2001, 1 ED CB/CCA –scheme, Safety for Information
Technology Equipment (TUV CB certificate and report)
The following group and/or national deviations were considered:
■
■
■
■
■
■
■
■
■
■
■
■
■
CENELEC Common Modifications, Annex ZA
AU (Australia and New Zealand)
CH (Switzerland)
DE (Germany)
DK (Denmark)
ES (Spain)
FI (Finland)
GB (United Kingdom)
IE (Ireland)
KR (Korea)
NO (Norway)
SE (Sweden)
rd
China (deviations to IEC 60950 3 Ed. considered):
■
Telcordia GR-63-CORE Network Equipment-Building System (NEBS)
Requirements Issue 3 Mar 2006—Physical Protection (Designed to meet section
4)
■
Telcordia GR-1089-CORE Safety for Network Telecommunication Equipment
Issue 4 Jun 2006 (meets Section 7)
Appendix C Agency Certifications
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C-3
C.4
Emissions Test Regulations
■
■
■
■
■
FCC Part 15, Subpart B Class A Commercial Equipment
Industry Canada ICES-003:2004 Class A Commercial Equipment
CISPR 22/EN 55022:2006 Class A Radiated, Power line Conducted
VCCI, Japanese V-3/2007.04 Class A
Telcordia GR-1089-CORE EMC For Network Telecommunication Equipment Issue
4 Jun 2006 (Designed to meet Sections 2 and 3)
C.4.1
EN 55022 Emissions
■
■
■
■
Telcordia GR-1089-CORE EMC For Network Telecommunication Equipment Issue
4 Jun 2006 (designed to meet 3.2)
EN55022:2005 Limits and Methods of Measurement of Radio Interference
+A1:2000+A2:2003 Characteristics of Information Technology Equipment
IEC CISPR22:2006 Limits and Methods of Measurement of Radio Interference
Characteristics of Information Technology Equipment
AS/NZS CISPR 22:2006 Limits and Methods of Measurement of Radio
Disturbance Characteristics of Information Technology Equipment
C.4.2
EN 55024 Immunity
■
■
■
Telcordia GR-1089-CORE EMC For Network Telecommunication Equipment Issue
4 Jun 2006 (Sections 2.1 (ESD), designed to meet 2.2 (EFT), 3.3)
EN 55024:1998 Information Technology Equipment – Immunity
+A1:2001+A2:2003 characteristics limits and methods of measurements
IEC 61000-4-2:2001 EMC - Part 4: Testing and measurement techniques - Section
4.2 Electrostatic discharge immunity test - Basic EMC Publication. (+/- 4KV
contact and +/-8KV air discharge)
■
■
■
■
IEC 61000-4-3:2003 EMC - Part 4. Testing and measurement techniques - Section 3:
Radiated, radio-frequency, electromagnetic field immunity test
IEC 61000-4-4:2004 EMC - Part 4: Testing and measurement techniques - Section 4:
Electrical fast transient/burst immunity test - Basic EMC Publication
IEC 61000-4-5:2001 EMC - Part 4: Testing and measurement techniques - Section 5:
Surge immunity test
IEC 61000-4-6:1996 EMC - Part 4: Testing and measurement techniques - Section 6:
+A1:2001 Immunity to conducted disturbances induced by radio frequency fields
C-4
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C.5
Regulatory Information
Caution – If you make any modification to the AMC not expressly approved by
Sun, you could void your warranty and/or regulatory authority to operate the
component.
C.5.1
FCC (USA)
This product has been tested and found to comply with the limits for a Class A
digital device pursuant to Part 15 of the FCC rules. These limits are designed to
provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment.
This product generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful
interference to radio communications. Operation of this equipment in a residential
area is likely to cause harmful interference in which case the user will be required to
correct the interference at the user’s own expense.
This AMC complies with Part 15 of the FCC Rules. Operation is subject to the
following two conditions:
1. This device may not cause harmful interference.
2. This device must accept any interference received, including interference that
may cause undesired operation.
C.5.2
Industry Canada (Canada)
This Class A digital apparatus meets all requirements of the Canadian Interference
Causing Equipment Regulations. Operation is subject to the following two
conditions:
1. This device may not cause harmful interference.
2. This device must accept any interference received, including interference that
may cause undesired operation.
Cet appareillage numérique de la classe A répond à toutes les exigences de
l'interférence canadienne causant des règlements d'équipement. L'opération est
sujette aux deux conditions suivantes:
Appendix C Agency Certifications
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C-5
1. Ce dispositif peut ne pas causer l'interférence nocive.
2. Ce dispositif doit accepter n'importe quelle interférence reçue, y compris
l'interférence qui peut causer l'opération peu désirée.
C-6
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Index
10GbE local PHY, 3-2
A
features, 2-2
AMC flexing, preventing, 1-4
antistatic bag, 1-3
filler panels, 1-12
B
C
cable management bracket
lowering, 1-12
H
D
disposal, 2-10
labels, 2-8
E
MAC address, 2-8
part number, 2-8
serial number, 2-8
EEC for Electromagnetic Compatibility, C-2
electrical and environmental, 1-3
LEDs, 1-6
electrical, environmental, and mechanical
specifications, B-1
Index-1
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M
system requirements, 1-2
MAC address
label, 2-8
temperature, monitoring, 2-4
N
unpacking, 1-3
warranty, 2-7
wrist strap, 1-3
O
OK LED, 1-6
P
part number, 2-8
pinouts, A-2
R
reliability, B-4
removing a switch and installed AMC, 1-12
S
sensors, 3-5
serial number, 2-8
software, upgrading, 3-6
static electricity, 1-1
storage temperature, B-4
Sun Services, 2-7
Index-2
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