INTEGRATED CIRCUITS
DATA SHEET
TDA6111Q
Video output amplifier
1995 Feb 07
Preliminary specification
Supersedes data of February 1992
File under Integrated Circuits, IC02
Philips Semiconductors
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Philips Semiconductors
Preliminary specification
Video output amplifier
TDA6111Q
BLOCK DIAGRAM
supply voltage
input HIGH
feedback
output
6
9
7 V
MIRROR
MIRROR
FOLLOWERS
cathode
transient
7
V
bias
output
C
par
8
5
cathode
DC output
inverting
3
input
DIFFERENTIAL
1
STAGE
TDA6111Q
non-inverting
input
black current
measurement
output
CURRENT
SOURCE
MIRROR
MIRROR
4
2
MGA058
ground
(substrate)
supply voltage
input LOW
Fig.1 Block diagram.
1995 Feb 07
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Philips Semiconductors
Preliminary specification
Video output amplifier
TDA6111Q
PINNING
SYMBOL
Vip
PIN
DESCRIPTION
1
2
3
4
5
non-inverting voltage input
supply voltage LOW
inverting voltage input
ground, substrate
VDDL
Vin
andbook, halfpage
V
1
2
3
4
5
6
7
8
9
ip
V
DDL
GND
Iom
V
black current measurement
output
in
GND
VDDH
Vcn
6
7
8
9
supply voltage HIGH
I
TDA6111Q
om
cathode transient voltage output
cathode DC voltage output
feedback voltage output
V
DDH
Voc
V
cn
Vfb
V
oc
V
fb
MGA057
Fig.2 Pin configuration.
1995 Feb 07
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Philips Semiconductors
Preliminary specification
Video output amplifier
TDA6111Q
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134). Voltages measured with respect to GND (pin 4);
currents as specified in Fig.1; unless otherwise specified.
SYMBOL
VDDH
PARAMETER
CONDITIONS
MIN.
MAX.
250
UNIT
high level supply voltage
low level supply voltage
input voltage
0
0
0
V
V
V
V
VDDL
VI
14
VDDL
+6
VIdm
Vom
Voc
differential mode input voltage
measurement output voltage
cathode output voltage
feedback output voltage
input current
−6
0
VDDL
VDDH
VDDH
1
VDDL
VDDL
0
V
V
Vfb
Iin,Iip
IocsmL
mA
A
low non-repetitive peak cathode
output current
flashover discharge = 100 µC
0
5
IocsmH
high non-repetitive peak cathode
output current
flashover discharge = 100 nC
0
10
A
Ptot
Tstg
Tj
total power dissipation
storage temperature
junction temperature
electrostatic handling
human body model (HBM)
machine model (MM)
0
4
W
−55
−20
+150
+150
°C
°C
Ves
−
−
> 1500
> 400
V
V
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling MOS devices (see “Handling MOS Devices”).
QUALITY SPECIFICATION
Quality specification “SNW-FQ-611 part E” is applicable, except for ESD Human body model see Chapter “Limiting
values”, and can be found in the “Quality reference handbook” (ordering number 9398 510 63011).
THERMAL CHARACTERISTICS
SYMBOL
Rth j-c
Note
1. External heatsink is required.
PARAMETER
VALUE
UNIT
thermal resistance from junction to case (note 1)
12
K/W
1995 Feb 07
5
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Philips Semiconductors
Preliminary specification
Video output amplifier
TDA6111Q
CHARACTERISTICS
Operating range: Tamb = −20 to 65 °C; VDDH = 180 to 210 V; VDDL = 10.8 to 13.2 V; Vip = 2.6 to 5 V;
Vom = 1.4 V to VDDL
.
Test conditions (unless otherwise specified): Tamb = 25 °C; VDDH = 200 V; VDDL = 12 V; Vip = 5 V; Vom = 6 V; CL = 10 pF
(CL consists of parasitic and cathode capacitance); Rth-heatsink = 10 K/W; measured in test circuit Fig.3.
SYMBOL
PARAMETER
CONDITIONS
MIN.
7.0
TYP. MAX. UNIT
IDDH
IDDL
Ibias
quiescent HIGH voltage supply current Voc = 0.5VDDH
quiescent LOW voltage supply current Voc = 0.5VDDH
9.0
6.8
−
11.0
8.0
40
mA
mA
µA
µA
µA
5.0
0
input bias current
input offset current
Voc = 0.5VDDH
Voc = 0.5VDDH
Ioffset
−6
−10
−
+6
Iom(offset) offset current of measurement output
Ioc = 0 µA;
0
+10
−1.0 V < V1−3 < 1.0 V;
1.4 V < Vom < VDDL
linearity of current transfer
−10 µA < Ioc < 3 mA;
−1.0 V < V1−3 < 1.0 V;
1.4 V < Vom < VDDL
0.9
1.0
1.1
∆Iom
∆Ioc
------------
Voffset
Voc(min)
Voc(max)
GB
input offset voltage
Voc = 0.5VDDH
−50
−
VDDH − 12
−
−
−
−
1.6
+50
20
−
mV
V
minimum output voltage
maximum output voltage
V1−3 = −1 V
V1−3 = −1 V
V
gain-bandwidth product of open-loop
gain: Vfb / Vi, dm
f = 500 kHz; VocDC = 100 V
−
GHz
BS
BL
tpd
small signal bandwidth
VocAC = 60 V (p-p);
VocDC = 100 V
13
10
17
16
13
23
−
MHz
MHz
ns
large signal bandwidth
VocAC = 100 V (p-p);
VocDC = 100 V
−
cathode output propagation delay time VocAC = 100 V (p-p);
50% input to 50% output ocDC = 100 V square
29
V
wave; f < 1 MHz;
tr = tf = 22 ns;
see Figs 4 and 5
tr
tf
cathode output rise time 10% output to Voc = 50 to 150 V square
23
23
−
30
30
−
36
ns
ns
ns
90% output
wave; f < 1 MHz; tf = 22 ns;
see Fig.4
cathode output fall time 90% output to Voc = 150 to 50 V square
36
10% output
wave; f < 1 MHz; tr = 22 ns;
see Fig.5
ts
settling time 50% input to
(99% < output < 101%)
VocAC = 100 V (p-p);
VocDC = 100 V square
wave; f < 1 MHz;
tr = tf = 22 ns;
350
see Figs 4 and 5
SR
slew rate between 50 V to 150 V
V
1−3 = 2 V (p-p) square
−
3000
−
V/µs
wave; f < 1 MHz;
tr = tf = 22 ns
1995 Feb 07
6
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Philips Semiconductors
Preliminary specification
Video output amplifier
TDA6111Q
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP. MAX. UNIT
Ov
cathode output voltage overshoot
VocAC = 100 V (p-p);
VocDC = 100 V square
wave; f < 1 MHz;
−
9
−
%
tr = tf = 22 ns;
see Figs 4 and 5; note 1
SVRRH
SVRRL
high supply voltage rejection ratio
low supply voltage rejection ratio
f < 50 kHz; note 2
f < 50 kHz; note 2
−
−
85
70
−
−
dB
dB
Notes
1. If the difference between VDDL and Vip is less than 7 V, overshoot cannot be specified.
2. SVRR: The ratio of the change in supply voltage to the change in input voltage when there is no change in output
voltage.
VDDH to GND must be decoupled:
Cathode output
1. With a capacitor >20 nF with good HF behaviour
(e.g. foil). This capacitance must be placed as close
as possible to pins 6 and 4, but definitely within 5 mm.
The cathode output is protected against peak currents
(caused by positive voltage peaks during high-resistance
flash) of 5 A maximum with a charge content of 100 µC.
2. With a capacitor >10 µF on the picture tube base print
The cathode is also protected against peak currents
(caused by positive voltage peaks during low-resistance
flash) of 10 A maximum with a charge content of 100 nC.
(common for three output stages).
VDDL to GND must be decoupled:
1. With a capacitor >20 nF with good HF behaviour
(e.g. ceramic). This capacitance must be placed as
close as possible to pins 2 and 4, but definitely within
10 mm.
Flashover protection
The TDA6111Q incorporates protection diodes against
CRT flashover discharges that clamp the cathode output
pin to the VDDH pin. The DC supply voltage at the VDDH pin
has to be within the operating range of 180 to 210 V to
ensure that the Absolute Maximum Rating for VDDH of
250 V will not be exceeded during flashover. To limit the
diode current, an external 680 Ω carbon high-voltage
resistor in series with the cathode output and a 2 kV spark
gap are needed (for this resistor-value, the CRT has to be
connected to the main PCB). This addition produces an
increase in the rise and fall times of approximately 5 ns
and a decrease in the overshoot of approximately 4%.
Switch-off behaviour
The switch-off behaviour of the TDA6111Q is defined:
when the bias current becomes zero, at VDDL (pin 2) lower
than approximately 5 V, all the output pins
(pins 7, 8 and 9) will be high.
1995 Feb 07
7
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Philips Semiconductors
Preliminary specification
Video output amplifier
TDA6111Q
12 V
200 V
C
C1
C3
par
22 nF
3.9 pF
C5
22 nF
C6
100 nF
C7 10 µF
7
C4
10 µF
V
i
R10
68.1 kΩ
R9
820 Ω
C2
22 µF
3
1
9
2
6
8
R1
50 Ω
1.4 mA
TDA6111Q
C
n
4
5
560 pF
A
C8
R3
6.8 pF
20 MΩ
5 V
C7
3.2 pF
probe
V
om
6 V
C9
R2
C10
136 pF
1 MΩ
100 nF
MGA059 - 1
Cpar = 150 fF.
Fig.3 Test circuit with feedback factor 1⁄83.
1995 Feb 07
8
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Philips Semiconductors
Preliminary specification
Video output amplifier
TDA6111Q
x
V
i
0
x
t
t
s
overshoot (in %)
151
149
150
140
V
oc
100
60
50
t
t
r
MGA974
t
pd
Fig.4 Output voltage (pin 8) rising edge as a function of the AC input signal.
1995 Feb 07
9
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Philips Semiconductors
Preliminary specification
Video output amplifier
TDA6111Q
x
V
i
0
x
t
t
s
150
140
oc
V
100
overshoot (in %)
51
60
50
49
t
t
f
MGA975
t
pd
Fig.5 Output voltage (pins 8) falling edge as a function of the AC input signal.
1995 Feb 07
10
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Philips Semiconductors
Preliminary specification
Video output amplifier
TDA6111Q
The dynamic dissipation equals:
dyn = VDDH × (CL + Cfb + Cint) × fi × Vo(p-p) ×δ
TEST AND APPLICATION INFORMATION
Dissipation
P
CL = load capacitance.
Regarding dissipation, distinction must first be made
between static dissipation (independent of frequency) and
dynamic dissipation (proportional to frequency).
Cfb = feedback capacitance (≈ 150 fF).
Cint = internal load capacitance (≈ 4 pF).
fi = input frequency.
The static dissipation of the TDA6111Q is due to high and
low voltage supply currents and load currents in the
feedback network and CRT.
Vo(p-p) = output voltage (peak-to-peak value).
δ = non-blanking duty-cycle (≈ 0.8).
The static dissipation equals:
With CL = 10 pF, Cfb = 0, Cint = 4 pF, fi = 8 MHz
(simulation of worst-case noise), Vo(p-p) = 100 V and
δ = 80% then Pdyn = 1.8 W
Pstat = VDDL ×IDDL + VDDH ×IDDH
Vfb
+ Voc ×Ioc – Vfb
×
--------
The IC must be mounted on the picture tube base print to
minimize the load capacitance (CL).
Rfb
Rfb = value of feedback resistor.
Ioc = DC value of cathode current.
The total power dissipation, Ptot = Pstat + Pdyn thus
amounts to 3.6 W under given conditions.
From Tj = Tamb + Ptot × Rth j-a < Tj(max) = 150 °C, Rth j-a of
the package and heatsink together must be < 24 K/W.
With Vfb = Voc = 100 V, Rfb = 68 kΩ, Ioc = 0.6 mA and
other typical conditions as mentioned in Chapter
“Characteristics”, the static dissipation Pstat = 2.0 W.
1995 Feb 07
11
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Philips Semiconductors
Preliminary specification
Video output amplifier
TDA6111Q
PACKAGE OUTLINE
DBS9MPF: plastic DIL-bent-SIL medium power package with fin; 9 leads
SOT111-1
D
D
1
A
2
q
P
P
1
Q
A
3
q
2
q
1
A
A
4
E
pin 1 index
c
L
1
9
e
2
b
e
Z
b
w
M
2
θ
b
1
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
Z
A
max.
2
(1)
(1)
UNIT
A
A
A
b
b
b
c
D
D
E
e
e
L
P
P
Q
q
q
q
2
w
θ
3
4
1
2
1
2
1
1
max.
o
o
18.5
17.8
8.7 15.5 1.40 0.67 1.40 0.48 21.8 21.4 6.48
8.0 15.1 1.14 0.50 1.14 0.38 21.4 20.7 6.20
3.9 2.75 3.4 1.75 15.1
3.4 2.50 3.2 1.55 14.9
65
55
4.4 5.9
4.2 5.7
2.54 2.54
mm
3.7
0.25 1.0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-03-11
SOT111-1
1995 Feb 07
12
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Philips Semiconductors
Preliminary specification
Video output amplifier
TDA6111Q
SOLDERING
REPAIRING SOLDERED JOINTS
Apply the soldering iron below the seating plane (or not
more than 2 mm above it). If its temperature is below
300 °C, it must not be in contact for more than 10 s; if
between 300 and 400 °C, for not more than 5 s.
Plastic single in-line packages
BY DIP OR WAVE
The maximum permissible temperature of the solder is
260 °C; this temperature must not be in contact with the
joint for more than 5 s. The total contact time of successive
solder waves must not exceed 5 s.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified storage maximum. If the printed-circuit board has
been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within
the permissible limit.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1995 Feb 07
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Philips Semiconductors
Preliminary specification
Video output amplifier
TDA6111Q
NOTES
1995 Feb 07
14
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Philips Semiconductors
Preliminary specification
Video output amplifier
TDA6111Q
NOTES
1995 Feb 07
15
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Date of release: 1995 Feb 07
9397 747 60011
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