Panasonic Network Card MAZQxxx Series User Manual

This product complies with the RoHS Directive (EU 2002/95/EC).  
Zener Diodes  
MAZQxxx Series  
Silicon planar type  
For constant voltage, constant current, waveform clipper and surge  
absorption circuit  
Package  
Features  
Code  
Optimum for high-density mounting  
Low noise type  
USSMini2-F1  
Pin Name  
1:Anode  
2: Cathode  
Absolute Maximum Ratings Ta = 25°C  
Parameter  
Repetitive peak forward current  
Total power dissipation *  
Junction temperature  
Symbol  
IFRM  
PT  
Rating  
200  
Unit  
mA  
mW  
°C  
Marking Symbol  
Refer to the list of the electrical characteristics  
within part numbers  
120  
Tj  
150  
Storage temperature  
T
stg  
-55 to +150  
°C  
Note) : P = 120 mW achieved with a printed circuit board.  
*
T
Electrical Characteristics Ta = 25°C±3°C  
Parameter  
Symbol  
VF  
Conditions  
Min  
Typ  
Max  
Unit  
V
Forward current  
IF = 10 mA  
0.9  
1.0  
Zener voltage *  
VZ  
IZ  
Specied value  
Specied value  
Specied value  
V
Refer to the list of the  
Zene operating resistance  
Reverse current  
RZ  
IZ  
electrical characteristics  
within part numbers  
W
IR  
VR  
mA  
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes.  
2. Absolute frequency of input and output is 5 MHz.  
3. The temperature must be controlled 25°C for VZ mesurement. VZ value measured at other temperature must be adjusted to VZ (25°C)  
4. : V guaranted 20 ms after current ow.  
*
Z
Electrical Characteristics within Part Numbers Ta = 25°C±3°C  
Zener  
operating  
resistance  
RZ (W)  
Zener voltage  
Reverse current  
VZ (V)  
IR ( mA)  
Part number  
Marking symbol  
IZ  
IZ  
VR  
Min  
Typ  
Max  
Max  
Max  
(V)  
(mA)  
(mA)  
MAZQ062  
MAZQ068  
MAZQ100  
MAZQ200  
MAZQ300  
5.8  
6.4  
6.2  
6.6  
5
5
5
5
2
30  
20  
5
5
5
5
2
0.2  
0.1  
4.0  
4.0  
7
E
F
6.8  
7.2  
9.40  
18.80  
28.00  
10.00  
20.00  
30.00  
10.60  
21.20  
32.00  
30  
0.05  
0.05  
0.05  
L
V
Y
80  
15.0  
23.0  
160  
Publication date: January 2009  
SKE00030CED  
1
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This product complies with the RoHS Directive (EU 2002/95/EC).  
MAZQxxx Series  
RZ IZ  
Ct VR  
103  
102  
10  
30  
Ta = 25°C  
Ta = 25°C  
25  
20  
15  
10  
1
5
0
101  
101  
4
8
12  
102  
0
1
10  
Reverse voltage VR (V)  
Zener current IZ (mA)  
Characteristics charts of MAZQ200  
IZ VZ  
IF VF  
IR VR  
102  
103  
102  
10  
1
Ta = 25°C  
Ta = 25°C  
Ta = 25°C  
101  
10  
1
102  
103  
104  
1
101  
102  
103  
101  
102  
0
16  
0.4  
0.8  
1.2  
18  
20  
22  
24  
26  
5
10  
15  
20  
Forward voltage VF (V)  
Zener voltage VZ (V)  
Reverse voltage VR (V)  
RZ IZ  
Ct VR  
103  
30  
25  
20  
15  
10  
Ta = 25°C  
Ta = 25°C  
102  
10  
1
5
0
101  
101  
0
1
10  
102  
5
10  
15  
20  
Zener current IZ (mA)  
Reverse voltage VR (V)  
SKE00030CED  
3
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This product complies with the RoHS Directive (EU 2002/95/EC).  
MAZQxxx Series  
Characteristics charts of MAZQ300  
IZ VZ  
IR VR  
RZ IZ  
103  
104  
103  
102  
10  
102  
Ta = 25°C  
Ta = 25°C  
Ta = 25°C  
10  
1
105  
106  
107  
101  
1
101  
102  
101  
1
10  
102  
0
10  
20  
30  
20  
25  
30  
35  
40  
45  
50  
Zener current IZ (mA)  
Reverse voltage VR (V)  
Zener voltage VZ (V)  
Ct VR  
10  
9
Ta = 25°C  
8
7
6
5
4
3
2
1
0
0
10  
20  
30  
40  
Reverse voltage VR (V)  
4
SKE00030CED  
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This product complies with the RoHS Directive (EU 2002/95/EC).  
MAZQxxx Series  
USSMini2-F1  
Unit: mm  
0.13 +00..0025  
0.60 ±0.05  
2
1
0.20 +00..0025  
5°  
SKE00030CED  
5
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Request for your special attention and precautions in using the technical information and  
semiconductors described in this book  
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and  
regulations of the exporting country, especially, those with regard to security export control, must be observed.  
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples  
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any  
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any  
other company which may arise as a result of the use of technical information described in this book.  
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office  
equipment, communications equipment, measuring instruments and household appliances).  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support  
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-  
ucts may directly jeopardize life or harm the human body.  
Any applications other than the standard applications intended.  
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-  
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product  
Standards in advance to make sure that the latest specifications satisfy your requirements.  
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions  
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute  
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any  
defect which may arise later in your equipment.  
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure  
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire  
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.  
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,  
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which  
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.  
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.  
20080805  
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