LG Electronics Cell Phone U250 User Manual
Service Manual  
U250/KU250  
Date: June, 2007 / Issue 1.0  
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Table Of Contents  
4.16 Receiver Path ....................................107  
1. INTRODUCTION .............................. 5  
4.17 Headset path......................................109  
4.18 Speaker phone path...........................111  
4.19 Main microphone ...............................113  
4.20 Headset microphone..........................115  
4.21 Vibrator ..............................................117  
1.1 Purpose................................................... 5  
1.2 Regulatory Information............................ 5  
2. PERFORMANCE...............................7  
2.1 System Overview.....................................7  
2.2 Usable environment.................................8  
2.3 Radio Performance..................................8  
2.4 Current Consumption.............................14  
2.5 RSSI BAR ..............................................14  
2.6 Battery BAR ...........................................15  
2.7 Sound Pressure Level............................16  
2.8 Charging ................................................16  
5. DOWNLOAD..................................119  
5.1 U250/KU250 DOWNLOAD ..................119  
5.1.1 Introduction...................................119  
5.1.2 Downloading Procedure ...............119  
5.1.3 Troubleshooting Download Errors 129  
5.1.4 Caution .........................................133  
6. BLOCK DIAGRAM........................134  
3. TECHNICAL BRIEF ........................17  
6.1 GSM & UMTS RF Block.......................134  
6.2 Interface Diagram ................................136  
3.1 General Description ...............................17  
3.2 GSM Mode.............................................19  
3.3 UMTS Mode...........................................23  
3.4 LO generation and distribution circuits...25  
3.5 Off-chip RF Components .......................25  
3.6 Digital Baseband(DBB/MSM6245).........34  
3.7 Block Diagram(MSM6245).....................36  
3.8 Subsystem(MSM6245) ..........................37  
3.9 Power Block...........................................45  
3.10 External memory interface...................50  
3.11 H/W Sub System..................................52  
3.12 Main Features......................................68  
7. Circuit Diagram ............................143  
8. pcb layout.....................................147  
9. Calibration & RF Auto Test  
Program (Hot Kimchi)..................149  
9.1 Configuration of HOT KIMCHI .............149  
9.2 How to use HOT KIMCHI.....................152  
10. Factory Test Mode .....................154  
4. TROUBLE SHOOTING ...................73  
10.1. Test Program Setting........................154  
10.2. WCDMA Test Mode..........................155  
10.3. GSM Test Mode................................156  
4.1 RF Component.......................................73  
4.2 SIGNAL PATH_UMTS RF .....................75  
4.3 SIGNAL PATH_GSM RF .......................76  
4.4 Checking VC-TCXO Block.....................77  
4.5 Checking Front-End Module Block ........79  
4.6 Checking UMTS Block...........................81  
4.7 Checking GSM Block.............................86  
4.8 Checking Bluetooth Block......................92  
4.9 Power ON Troubleshooting....................94  
4.10 Charger Troubleshooting .....................96  
4.11 USB Troubleshooting...........................99  
4.12 SIM Detect Troubleshooting ..............100  
4.13 Camera Troubleshooting ...................102  
4.14 Keypad Backlight Troubleshooting ....105  
4.15 Main LCD Troubleshooting ................106  
11. EXPLODED VIEW &  
REPLACEMENT PART LIST ..... 157  
11.1 EXPLODED VIEW ............................ 157  
11.2 Replacement Parts  
<Mechanic component>.................... 159  
<Main component> ........................... 161  
11.3 Accessory ......................................... 174  
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1. INTRODUCTION  
1. INTRODUCTION  
1.1 Purpose  
This manual provides the information necessary to repair, calibration, description and download the  
features of this model.  
1.2 Regulatory Information  
A. Security  
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,  
persons other than your company’s employees, agents, subcontractors, or person working on your  
company’s behalf) can result in substantial additional charges for your telecommunications services.  
System users are responsible for the security of own system. There are may be risks of toll fraud  
associated with your telecommunications system. System users are responsible for programming and  
configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this  
product is immune from the above case but will prevent unauthorized use of commoncarrier  
telecommunication service of facilities accessed through or connected to it. The manufacturer will not  
be responsible for any charges that resultfrom such unauthorized use.  
B. Incidence of Harm  
If a telephone company determines that the equipment provided to customer is faulty and possibly  
causing harm or interruption in service to the telephone network, it should disconnect telephone  
service until repair can be done. A telephone company may temporarily disconnect service as long as  
repair is not done.  
C. Changes in Service  
A local telephone company may make changes in its communications facilities or procedure. If these  
changes could reasonably be expected to affect the use of the phones or compatibility with the net  
work, the telephone company is required to give advanced written notice to the user, allowing the user  
to take appropriate steps to maintain telephone service.  
D. Maintenance Limitations  
Maintenance limitations on the phones must be performed only by the manufacturer or its authorized  
agent. The user may not make any changes and/or repairs expect as specifically noted in this manual.  
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system  
and may void any remaining warranty.  
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1. INTRODUCTION  
E. Notice of Radiated Emissions  
This model complies with rules regarding radiation and radio frequency emission as defined by local  
regulatory agencies. In accordance with these agencies, you may be required to provide information  
such as the following to the end user.  
F. Pictures  
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly  
different.  
G. Interference and Attenuation  
A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from  
unsuppressed engines or electric motors may cause problems.  
H. Electrostatic Sensitive Devices  
ATTENTION  
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the  
Following information is ESD handling:  
sign.  
• Service personnel should ground themselves by using a wrist strap when exchange system boards.  
• When repairs are made to a system board, they should spread the floor with anti-static mat which is  
also grounded.  
• Use a suitable, grounded soldering iron.  
• Keep sensitive parts in these protective packages until these are used.  
• When returning system boards or parts like EEPROM to the factory, use the protective package as  
described.  
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2. PERFORMANCE  
2. PERFORMANCE  
2.1 System Overview  
Item  
Specification  
Shape  
Size  
GSM900/1800/1900 and WCDMA2100 - Bar type Handset  
110.9 X 46.7 X 15.6 mm  
Under 83 g (with 950mAh Battery)  
3.7 V normal, 950 mAh Li-Ion  
Over 200 min (WCDMA, Tx=12 dBm, Voice)  
Over 180 min (GSM, Max Tx Power, Voice)  
Over 350 Hrs (WCDMA, DRX=1.28)  
Over 450 Hrs (GSM, Paging period=9)  
Internal type  
Weight  
Power  
Talk Time  
(with 950mAh)  
Standby Time  
(with 950mAh)  
Antenna  
LCD  
Main 1.76” TFT, QCIF, 262K  
White LED Back Light  
LCD Backlight  
Camera  
1.3 Mega pixel + VGA Video Call Camera  
Yes ( Cylinder Type)  
Vibrator  
LED Indicator  
MIC  
No  
Yes  
Receiver  
Yes  
Earphone Jack  
Connectivity  
External Memory  
I/O Connect  
Yes (18 pin)  
Bluetooth, USB  
Yes(Micro SD)  
18 Pin  
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2. PERFORMANCE  
2.2 Usable environment  
1) Environment  
Item  
Specification  
Voltage  
Operation Temp  
Storage Temp  
Humidity  
3.7 V(Typ), 3.2 V(Min), [Shut Down : 3.2 V]  
-20 ~ +60°C  
-20 ~ +70°C  
85 % (Max)  
2) Environment (Accessory)  
Reference  
TA Power  
Spec.  
Available power  
Min  
Typ.  
Max  
Unit  
100  
220  
240  
Vac  
* CLA : 12 ~ 24 V(DC)  
2.3 Radio Performance  
1) Transmitter - GSM Mode  
No  
Item  
GSM  
DCS & PCS  
9k ~ 1GHz  
-39dBm  
-33dBm  
-39dBm  
-33dBm  
-60dBm  
-62dBm  
-60dBm  
-50dBm  
-56dBm  
-50dBm  
100k~1GHz  
-39dBm  
-33dBm  
MS allocated  
1G~[A]MHz  
Channel  
[A]M~[B]MHz  
[B]M~12.75GHz  
1G~12.75GHz  
Conducted  
Spurious  
Emission  
1
100k~880MHz  
880M~915MHz  
915M~1GHz  
1G~[A]MHz  
-60dBm 100k~880MHz  
-62dBm 880M~915MHz  
-60dBm 915M~1GHz  
-50dBm 1G~[A]MHz  
-56dBm [A]M~[B]MHz  
-50dBm [B]M~12.5GHz  
Idle Mode  
[A]M~[B]MHz  
[B]M~12.5GHz  
* In case of DCS : [A] -> 1710, [B] -> 1785  
* In case of PCS : [A] -> 1850, [B] -> 1910  
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2. PERFORMANCE  
No  
Item  
GSM  
DCS & PCS  
30M~1GHz  
-36dBm  
-30dBm  
-36dBm  
-30dBm  
-57dBm  
-59dBm  
-57dBm  
-47dBm  
-53dBm  
-47dBm  
30M ~ 1GHz  
1G ~ 4GHz  
-36dBm  
-30dBm  
MS allocated  
1G~[A]MHz  
[A]M~[B]MHz  
[B]M~4GHz  
Channel  
Radiated  
Spurious  
Emission  
2
30M ~ 880MHz  
880M ~ 915MHz  
915M~1GHz  
1G~[A]MHz  
[A]M~[B]MHz  
[B]M~4GHz  
0.1ppm  
-57dBm 30M~880MHz  
-59dBm 880M~915MHz  
-57dBm 915M~1GHz  
-47dBm 1G~[A]MHz  
-53dBm [A]M~[B]MHz  
-47dBm [B]M~4GHz  
0.1ppm  
Idle Mode  
3
4
Frequency Error  
5(RMS)  
5(RMS)  
Phase Error  
20(PEAK)  
20(PEAK)  
3dB below reference sensitivity 3dB below reference sensitivity  
Frequency Error  
Under Multipath and  
Interference Condition  
RA250 : 200Hz  
HT100 : 100Hz  
TU50 : 100Hz  
TU3 : 150Hz  
0 ~ 100kHz  
200kHz  
RA250: 250Hz  
HT100: 250Hz  
TU50: 150Hz  
TU1.5: 200Hz  
5
+0.5dB 0 ~ 100kHz  
+0.5dB  
-30dB  
-33dB  
-60dB  
-60dB  
-65dB  
-73dB  
-30dB  
-33dB  
-60dB  
-66dB  
-69dB  
-71dB  
-77dB  
-19dB  
-21dB  
-21dB  
-24dB  
200kHz  
250kHz  
250kHz  
Due to  
400kHz  
400kHz  
modulation  
Output RF  
600 ~ 1800kHz  
1800 ~ 3000kHz  
3000 ~ 6000kHz  
≥6000kHz  
600 ~ 1800kHz  
1800 ~ 6000kHz  
≥6000kHz  
6
Spectrum  
400kHz  
400kHz  
600kHz  
1200kHz  
1800kHz  
-22dB  
-24dB  
-24dB  
-27dB  
Due to  
Switching  
transient  
600kHz  
1200kHz  
1800kHz  
* In case of DCS : [A] -> 1710, [B] -> 1785  
* In case of PCS : [A] -> 1850, [B] -> 1910  
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2. PERFORMANCE  
No  
Item  
GSM  
DCS & PCS  
Frequency offset  
800kHz  
Intermodulation product should  
be Less than 55dB below the  
level of Wanted signal  
7
Intermodulation attenuation  
–
Power control Power Tolerance Power control Power Tolerance  
Level  
5
(dBm)  
33  
31  
29  
27  
25  
23  
21  
19  
17  
15  
13  
11  
9
(dB)  
3
Level  
0
(dBm)  
(dB)  
3
30  
28  
26  
24  
22  
20  
18  
16  
14  
12  
10  
8
6
3
1
3
7
3
2
3
8
3
3
3
9
3
4
3
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
3
5
3
8
Transmitter Output Power  
3
6
3
3
7
3
3
8
3
3
9
4
3
10  
11  
12  
13  
14  
15  
4
5
4
5
6
4
7
5
4
4
5
5
2
5
0
5
9
Burst timing  
Mask IN  
Mask IN  
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2. PERFORMANCE  
2) Transmitter - WCDMA Mode  
No  
Item  
Maximum Output Power  
Specification  
1
2
3
Class 3 : +24dBm(+1/-3dB)  
Frequency Error  
0.1ppm  
Open Loop Power control in uplink  
9dB@normal, 12dB@extreme  
Adjust output(TPC command)  
cmd  
+1  
0
1dB  
2dB  
3dB  
+0.5/1.5  
+1/3  
+1.5/4.5  
4
Inner Loop Power control in uplink  
Minimum Output Power  
-0.5/+0.5 -0.5/+0.5 -0.5/+0.5  
-0.5/-1.5 -1/-3 -1.5/-4.5  
-1  
Group (10 equel command group)  
+1 +8/+12 +16/+24  
-50dBm(3.84MHz)  
Qin/Qout : PCCH quality levels  
5
6
Out-of-synchronization handling of output power Toff@DPCCH/Ior : -22 -> -28dB  
Ton@DPCCH/Ior : -24 -> -18dB  
7
8
Transmit OFF Power  
-56dBm(3.84MHz)  
25us  
Transmit ON/OFF Time Mask  
PRACH,CPCH,uplinlk compressed mode  
25us  
Power varies according to the data rate  
DTX : DPCH off  
9
Change of TFC  
(minimize interference between UE)  
3dB(after 14slots transmission gap)  
5MHz(99%)  
10 Power setting in uplink compressed  
11 Occupied Bandwidth(OBW)  
-35-15*(∆f-2.5)dBc@∆f=2.5~3.5MHz,30k  
-35-1*(∆f-3.5)dBc@∆f=3.5~7.5MHz,1M  
-39-10*(∆f-7.5)dBc@∆f=7.5~8.5MHz,1M  
-49dBc@∆f=8.5~12.5MHz,1M  
12 Spectrum emission Mask  
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2. PERFORMANCE  
No  
Item  
Specification  
33dB@5MHz, ACP>-50dBm  
13 Adjacent Channel Leakage Ratio(ACLR)  
43dB@10MHz, ACP>-50dBm  
-36dBm@f=9~150KHz, 1K BW  
-36dBm@f=50KHz~30MHz, 10K BW  
-36dBm@f=30MHz~1000MHz, 100K BW  
-30dBm@f=1~12.5GHz, 1M BW  
(*)-41dBm@f=1893.5~1919.6MHz, 300K  
(*)-67dBm@f=925~935MHz, 100K BW  
(*)-79dBm@f=935~960MHz, 100K BW  
(*)-71dBm@f=1805~1880MHz, 100K BW  
-31dBc@5MHz,Interferer -40dBc  
-41dBc@10MHz, Interferer -40dBc  
17.5%(>-20dBm)  
Spurious Emissions  
14  
(*: additional requirement)  
15 Transmit Intermodulation  
16 Error Vector Magnitude (EVM)  
17 Transmit OFF Power  
(@12.2K, 1DPDCH+1DPCCH)  
-15dB@SF=4.768Kbps, Multi-code  
transmission  
3)Receiver - GSM Mode  
No  
Item  
GSM  
DCS & PCS  
1
Sensitivity (TCH/FS Class II)  
Co-Channel Rejection  
-105dBm  
-105dBm  
2
3
C/Ic=7dB  
Storage -30 ~ +85  
(TCH/FS Class II, RBER, TU high/FH)  
Adjacent Channel  
Rejection  
200kHz  
400kHz  
C/Ia1=-12dB  
C/Ia2=-44dB  
C/Ia1=-12dB  
C/Ia2=-44dB  
Wanted Signal :-98dBm 1st  
interferer:-44dBm 2nd  
interferer:-45dBm  
Wanted Signal :-96dBm 1st  
interferer:-44dBm 2nd  
interferer:-44dBm  
4
5
Intermodulation Rejection  
Blocking Response  
Wanted Signal :-101dBm  
Wanted Signal :-101dBm  
(TCH/FS Class II, RBER)  
Unwanted : Depend on Frequency Unwanted : Depend on Frequency  
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2. PERFORMANCE  
4) Receiver - WCDMA Mode  
No  
Item  
Specification  
1
Reference Sensitivity Level  
-106.7 dBm(3.84 MHz)  
-25dBm(3.84MHz)  
2
Maximum Input Level  
-44dBm/3.84MHz(DPCH_Ec)  
UE@+20dBm output power(Class3)  
33dB  
3
4
Adjacent Channel Selectivity (ACS)  
In-band Blocking  
UE@+20dBm output power(Class3)  
-56dBm/3.84MHz@10MHz  
UE@+20dBm output power(Class3)  
-44dBm/3.84MHz@15MHz  
UE@+20dBm output power(Class3)  
-44dBm/3.84MHz@f=2050~2095 and  
2185~2230MHz  
UE@+20dBm output power(Class3)  
-30dBm/3.84MHz@f=2025~2050 and  
2230~2255MHz  
5
Out-band Blocking  
UE@+20dBm output power(Class3)  
-15dBm/3.84MHz@f=1~2025 and  
2255~12500MHz  
UE@+20dBm output power(Class3)  
-44dBm CW  
6
7
Spurious Response  
UE@+20dBm output power(Class3)  
-46dBm CW@10MHz  
Intermodulation Characteristic  
-46dBm/3.84MHz@20MHz  
UE@+20dBm output power(Class3)  
-57dBm@f=9KHz~1GHz, 100K BW  
-47dBm@f=1~12.5GHz, 1M BW  
-60dBm@f=1920MHz~1980MHz, 3.84M BW  
-60dBm@f=2110MHz~2170MHz, 3.84M BW  
8
Spurious Emissions  
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2. PERFORMANCE  
2.4 Current Consumption  
1) U250/KU250 Current Consumption  
Stand by  
Voice Call  
VT  
Under 2.80 mA  
Under 290 mA  
(Tx=12dBm)  
Under 320 mA  
(Max Tx Power)  
Under 410mA  
(Tx=12dBm)  
WCDMA  
(DRX=1.28)  
Under 2.12 mA  
GSM  
Paging=9 period  
(Stand by and Voice Call Test Condition : Bluetooth off, LCD backlight off,Neighbor Cell off) (VT Test  
Condition : Speaker off, LCD backlight On)  
2.5 RSSI BAR  
Level Change  
BAR 4 → 3  
BAR 3 → 2  
BAR 2 → 1  
BAR 1 → 0  
WCDMA  
GSM  
-85 2 dBm  
-95 2 dBm  
-106 2 dBm  
-111 2 dBm  
-90 2 dBm  
-95 2 dBm  
-100 2 dBm  
-106 2 dBm  
- 14 -  
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2. PERFORMANCE  
2.6 Battery BAR  
Indication  
Standby  
Bar 4  
Bar 4 → 3  
Over 3.83 0.05V  
3.82 0.05V  
Bar 3 → 2  
3.73 0.05V  
Bar 2 → 1  
3.68 0.05V  
Bar 1 → Empty  
Low Voltage,  
Warning message+ Blinking  
Power Off  
3.58 0.05V  
3.58 0.05V (Stand-by) / 3.58 0.05V (Talk)  
[Interval : 3min(Stand-by) / 1min(Talk)]  
3.20 0.05V  
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2. PERFORMANCE  
2.7 Sound Pressure Level  
No  
Test Item  
Specification  
8 3 dB  
1
Sending Loudness Rating (SLR)  
Nor  
Max  
Min  
Min  
Max  
Nor  
Max  
-4 3 dB  
-15 3 dB  
17 dB  
2
Receiving Loudness Rating (RLR)  
3
4
5
Side Tone Masking Rating (STMR)  
Echo Loss (EL)  
Idle Noise-Sending (INS)  
MS  
40 dB  
-64 dBm0p  
Under -47 dBPA  
Under -36 dBPA  
8 3dB  
6
7
8
Idle Noise-Receiving (INR)  
Sending Loudness Rating (SLR)  
Receiving Loudness Rating (RLR)  
Nor  
Max  
Min  
Min  
Max  
Nor  
Max  
-1 3 dB  
-12 3 dB  
25 dB  
9
10  
11  
Side Tone Masking Rating (STMR)  
Echo Loss (EL)  
Idle Noise-Sending (INS)  
Headset  
40 dB  
-55 dBm0p  
Under -45 dBPA  
Under -40 dBPA  
12  
Idle Noise-Receiving (INR)  
TDMA Noise  
-. GSM : Power Level : 5  
DCS/PCS : Power Level : 0  
(Cell Power : -90 ~ -105 dBm)  
MS and  
Headset  
Under -62 dBm  
Max  
13  
-. Acoustic (Max Vol.)  
MS/Headset SLR : 8 3dB  
MS/Headset RLR : -15 3dB/-12  
(SLR/RLR : Mid-value setting)  
2.8 Charging  
• Charging Method : CC & CV (Constant Current and Constant Voltage)  
• Maximum Charging Voltage : 4.2 V  
• Maximum Charging Current : 700 mA  
• Normal Battery Capacity : 950 mAh  
• Charging Time : Max 3 hours (except for trickle charging time)  
• Full charging indication current (charging icon stop current) : 80 mA  
• Cut-off voltage : 3.20 V  
- 16 -  
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3. TECHNICAL BRIEF  
3. TECHNICAL BRIEF  
3.1 General Description  
The U250/KU250 supports UMTS-2100, GSM-900, DCS-1800, and PCS-1900 based  
1
GSM/GPRS/UMTS. All receivers and the UMTS transmitter use the radio One Zero-IF architecture to  
eliminate intermediate frequencies, directly converting signals between RF and baseband. The quad-  
band GSM transmitters use a baseband-to-IF upconversion followed by an offset phase-locked loop  
that translates the GMSK-modulated signal to RF.  
UMTS (2100)  
GSM (900, 1800, 1900)  
Bluetooth  
1. RTR6275 for GSM Tx  
and WCDMA Tx  
2. RTR6275 for GSM Rx  
and WCDMA Rx  
3. Bluetooth RF module  
4. PM6650 for power  
management  
[Fig 1.1] Block diagram of RF part  
1
QUALCOMM’s branded chipset that implements a Zero-IF radio architecture.  
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3. TECHNICAL BRIEF  
A generic, high-level functional block diagram of U250/KU250 is shown in Figure 1-1. One antenna  
collects base station forward link signals and radiates handset reverse link signals. The antenna  
connects with receive and transmit paths through a FEM(Front End Module).  
The UMTS receive path each include a LNA, a RF band-pass filter, and a downconverter that translate  
the signal directly from RF-to-baseband using radioOne ZIF technique. The RFIC Rx analog baseband  
outputs, for the receive chains, connect to the MSM IC. The UMTS and GSM Rx baseband outputs  
share the same inputs to the MSM IC.  
For the transmit chains, the RTR6275 IC directly translates the Tx baseband signals (from the MSM  
device) to an RF signal using an internal LO generated by integrated on-chip PLL and VCO. The  
RTR6275 IC outputs deliver fairly high-level RF signals that are first filtered by Tx SAWs and then  
amplified by their respective UMTS PA. The high- and low-band UMTS RF transmit signals emerge  
from the RTR6275 transceiver.  
In the GSM receive paths, the received RF signals are applied through their band-pass filters and  
down-converted directly to baseband in the RTR6275 transceiver IC. These baseband outputs are  
shared with the UMTS receiver and routed to the MSM IC for further signal processing.  
The GSM transmit paths employ one stage of up-conversion and, in order to improve efficiency.  
1. The on-chip quadrature up-converter translates the GMSK-modulated signal to a constant envelope  
phase signal at RF;  
2. The amplitude-modulated (AM) component is applied to the ramping control pin of power amplifier  
from a DAC within the MSM  
U250/KU250 power supply voltages are managed and regulated by the PM6650 Power Management  
IC. This versatile device integrates all wireless handset power management, general housekeeping,  
and user interface support functions into a single mixed signal IC. It monitors and controls the external  
power source and coordinates battery recharging while maintaining the handset supply voltages using  
low dropout, programmable regulators.  
The device’s general housekeeping functions include an ADC and analog multiplexer circuit for  
monitoring on-chip voltage sources, charging status, and current flow, as well as userdefined off-chip  
variables such as temperature, RF output power, and battery ID. Various oscillator, clock, and counter  
circuits support IC and higher-level handset functions. Key parameters such as under-voltage lockout  
and crystal oscillator signal presence are monitored to protect against detrimental conditions.  
- 18 -  
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3. TECHNICAL BRIEF  
3.2 GSM Mode  
3.2.1 GSM Receiver  
The Dual-mode U250/KU250’s receiver functions are split among the three RFIC’s as follows:  
• GSM-900, DCS-1800, and PCS-1900 UMTS-2100 modes use the RTR6275 IC only. Each mode has  
independent front-end circuits and down-converters, but they share common baseband circuits (with  
2
only one mode active at a time). All receiver control functions are beginning with SBI -controlled  
parameters.  
RF Front end consists of antenna, antenna switch module(D5011) which includes three RX saw  
filters(GSM900, DCS and PCS). The antenna switch module allows multiple operating bands and  
modes to share the same antenna. In U250/KU250, a common antenna connects to one of six paths:  
1) UMTS-2100 Rx/Tx, 2) GSM-900 Rx, 3) GSM-900 Tx, 4) DCS-1800 Rx, and 5) DCS-1800 Tx, PCS-  
1900 Tx(High Band Tx’s share the same path), 6) PCS-1900 Rx. UMTS operation requires  
simultaneous reception and transmission, so the UMTS Rx/Tx connection is routed to a duplexer that  
separates receive and transmit signals. The GSM900, DCS, and PCS operation is time division  
duplexed, so only the receiver or transmitter is active at any time and a frequency duplexer is not  
required.  
GSM 1800 / GSM1900 RX  
GSM 900 RX  
GSM 900 TX / WCDMA  
GSM 1800 / GSM 1900 TX  
[Table 1.1] Antenna Switch Module Control logic  
2
The RFIC operating modes and circuit parameters are MSM-controlled through the proprietary 3-line Serial Bus Interface (SBI). The Application  
Programming Interface (API) is used to implement SBI commands. The API is documented in AMSS Software - please see applicable AMSS  
Software documentation for details.  
- 19 -  
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3. TECHNICAL BRIEF  
The GSM900, DCS, and PCS receiver inputs of RTR6275 are connected directly to the transceiver  
front-end circuits(filters and antenna switch module). The GSM900, DCS, and PCS receiver inputs use  
differential configurations to improve common-mode rejection and second-order non-linearity  
performance. The balance between the complementary signals is critical and must be maintained from  
the RF filter outputs all the way into the IC pins  
Since GSM900, DCS, and PCS signals are time-division duplex (the handset can only receive or  
transmit at one time), switches are used to separate Rx and Tx signals in place of frequency duplexers -  
this is accomplished in the switch module.  
The GSM900, DCS, and PCS receive signals are routed to the RTR6275 through band selection filters  
and matching networks that transform single-ended 50-Ω sources to differential impedances optimized  
for gain and noise figure. The RTR input uses a differential configuration to improve second-order inter-  
modulation and common mode rejection performance. The RTR6275 input stages include MSM-  
controlled gain adjustments that maximize receiver dynamic range.  
The amplifier outputs drive the RF ports of the quadrature RF-to-baseband downconverters.  
The downconverted baseband outputs are multiplexed and routed to lowpass filters (one I and one Q)  
having passband and stopband characteristics suitable for GMSK processing. These filter circuits  
include DC offset corrections. The filter outputs are buffered and passed on to the MSM6245 IC for  
further processing (an interface shared with the RFR6275 UMTS receiver outputs).  
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3. TECHNICAL BRIEF  
[Fig 1.2] RTR6275 RX feature  
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3. TECHNICAL BRIEF  
3.2.2 GSM Transmitter  
The RTR6275 transmitter outputs(DA_HB2_OUT and DA_LB1_OUT)include on-chip output matching  
inductors. The 50ohm output impedance is achieved by adding a series capacitor at the output pins.  
The capacitor value may be optimized for specific applications and PCB characteristics based on pass-  
band symmetry about the band center frequency, the suggested starting value is shown in Figure1.3.  
6pF  
51  
39  
Ω
Ω
91  
91  
Ω
Ω
12pF  
Ω
100  
100  
Ω
[Fig 1.3] GSM Transmitter matching  
The RTR6275 IC is able to support GSM 900 and GSM 1800/1900 mode transmitting. This design  
guideline shows a tri-band GSM application.  
Both high-band and low band outputs are followed by resistive pads to ensure that the load presented  
to the outputs remains close to 50ohm. The low-band GSM Tx path also includes a Tx-band SAW filter  
to remove noise-spurious components and noise that would be amplified by the PA and appear in the  
GSM Rx band  
- 22 -  
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3. TECHNICAL BRIEF  
3.3 UMTS Mode  
3.3.1 Receiver  
The UMTS duplexer receiver output is routed to LNA circuits within the RTR6275 device. The UMTS Rx  
input is provided with an on-chip LNA that amplifies the signal before a second stage filter that provides  
differential downconverter. This second stage input is configured differentially to optimize second-order  
intermodulation and common mode rejection performance. The gain of the UMTS frontend amplifier and  
the UMTS second stage differential amplifier are adjustable, under MSM control, to extend the dynamic  
range of the receivers. The second stage UMTS Rx amplifiers drive the RF ports of the quadrature RF-  
tobaseband downconverters. The downconverted UMTS Rx baseband outputs are routed to lowpass  
filters having passband and stopband characteristics suitable for UMTS Rx processing. These filter  
circuits allow DC offset corrections, and their differential outputs are buffered to interface shared with  
GSM Rx to the MSM IC. The UMTS baseband outputs are turned off when the RTR6275 is  
downconverting GSM signals and on when the UMTS is operating.  
3.3.2 Transmitter  
The UMTS Tx path begins with differential baseband signals (I and Q) from the MSM device. These  
analog input signals are amplified, filtered, and applied to the quadrature up-converter mixers. The up-  
converter output is amplified by multiple variable gain stages that provide transmit AGC control. The  
AGC output is filtered and applied to the driver amplifier; this output stage includes an integrated  
matching inductor that simplifies the external matching network to a single series capacitor to achieve  
the desired 50-Ω interface.  
The RTR6275 UMTS output is routed to its power amplifier through a bandpass filter, and delivers fairly  
high-level signals that are filtered and applied to the PA. Transmit power is delivered from the duplexer  
to the antenna through the switch module. The transceiver LO synthesizer is contained within the  
RTR6275 IC with the exception of the off-chip loop filter components and the VC-TCXO. This provides  
a simplified design for multimode applications. The PLL circuits include a reference divider, phase  
detector, charge pump, feedback divider, and digital logic generator.  
UMTS Tx using PLL1, the LO generation and distribution circuits create the necessary LO signals for  
different frequency converters. The UMTS transmitter also employs the ZIF architecture to translate the  
LO  
RF  
signal directly from baseband to RF. This requires F to equal F , and the RTR6275 IC design  
achieves this without allowing F to equal F .  
VCO  
RF  
The RTR6275 IC is able to support UMTS 2100/1900 and UMTS 850 mode transmitting. This design  
guideline shows only UMTS 2100 applications.  
- 23 -  
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3. TECHNICAL BRIEF  
WCDMA_2100_TX  
WCDMA_2100_RX  
[Figure 1.4] RTR6275 IC functional block diagram  
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3. TECHNICAL BRIEF  
3.4 LO generation and distribution circuits  
The integrated LO generation and distribution circuits are driven by internal VCOs to support various  
modes to yield highly flexible quadrature LO outputs that drive all GSM and UMTS band upconverters  
and downconverters; with the help of these LO generation and distribution circuits, zero-IF architecture  
is employed in all GSM and UMTS band receivers and transmitters to translate the signal directly from  
RF to baseband and from baseband to RF.  
Two fully functional fractional-N synthesizers, including VCOs and loop filters, are integrated within the  
RTR6275 IC. The first synthesizer (PLL1) creates the transceiver LOs that support the UMTS  
2100/1900/1800 transmitter, and all four GSM band receivers and transmitters including: GSM 850,  
GSM 900, GSM 1800, and GSM 1900. The second synthesizer (PLL2) provides the LO for the UMTS  
2100/1900/1800 receiver. An external TCXO input signal is required to provide the synthesizer  
frequency reference to which the PLL is phase and frequency locked. The RTR6275 IC integrates  
most of PLL loop filter components on-chip except two off-chip loop filter series capacitors, and  
significantly reduces off-chip component requirement. With the integrated fractional-N PLL  
synthesizers, the RTR6275 has the advantages of more flexible loop bandwidth control, fast lock time,  
and low-integrated phase error  
3.5 Off-chip RF Components  
3.5.1 WCDMA PAM (U103: WS2512-TR1G)  
The UMTS PA output power is monitored by l power detector circuits(U100 : RTR6275) .  
This detector voltage can be used for transmitter calibration and monitor to meet RF system  
Rev_1.0  
WCDMA  
C154  
1.5p  
Rev.D  
+VPWR  
+VPWR  
FL102  
EFCH1950TDF1  
4
5
C155  
4.7u  
C158  
15p  
C159  
15p  
O1 G3  
1
L122  
NA  
C157  
10nH  
IN  
L404  
1.8nH  
G2 G1  
3
2
WS2512_TR1G  
VCC2  
U103  
VCC1  
10  
1
2
3
4
5
9
FL104  
PGND  
ANT  
L123  
1nH  
GND4  
RFIN  
GND1  
4
3
1
2
Rev_1.0  
RX  
TX  
C162  
3.3p  
8
RFOUT  
ACMD-7602  
7
GND3  
6
VCONT  
VREF  
PA_R0  
C164  
0.5p  
C165  
1p  
GND2  
11  
0.5p  
L125  
BGND  
TR100  
KRX102U  
20dB  
U102  
PA_ON  
CP0402A1950DNTR  
Rev.B  
VREG_TCXO_2.85V  
PWR_DET  
R120  
47  
7dB  
C192  
100p  
C170  
0.1u  
R121  
130  
R122  
130  
[Figure 1.5] WCDMA PAM, Duplexer, Coupler  
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3. TECHNICAL BRIEF  
3.5.2 VCTCXO (X100 : DSA321SCE-19.2M)  
The Voltage Controlled Temperature Compensated Crystal Oscillator (VCTCXO) provides the  
reference frequency for all RFIC synthesizers as well as clock generation functions within the  
MSM6245 IC. The oscillator frequency is controlled by the MSM6245 IC.  
TRK_LO_ADJ pulse density modulated signal in the same manner as the transmit gain control  
TX_AGC_ADJ. A two-pole RC lowpass filter is recommended on this control line.  
The PM6650 IC controls the handset power-up sequence, including a special VCTCXO warm-up  
interval before other circuits are turned on. This warm-up interval (as well as other TCXO controller  
functions) is enabled by the MSM TCXO_EN line . The PM6650 IC VREG_TCXO regulated output  
voltage is used to power the VCTCXO and is enabled before most other regulated outputs.  
Any GSM mode power control circuits within the MSM6245 IC require a reference voltage for proper  
operation and sufficient accuracy. Connecting the PM6650 IC REF_OUT directly to the MSM6245 IC  
GSM_PA_PWR_CTL_REF provides this reference. This sensitive analog signal needs a 0.1 •ÏF low  
frequency filter near to MSM side, and isolate from digital logic and clock traces with ground on both  
sides, plus ground above and below if routed on internal layers.  
3.5.3 Front-End Module (U500 : D5011)  
This equipment uses a single antenna to support all handset operating modes, with an antenna switch  
module select the operating frequency and band. UMTS operation requires simultaneous reception  
and transmission, so the UMTS Rx/Tx connection is routed to a duplexer that separates receive and  
transmit signals. The active connection is MSM-selected by three control lines (GPIO[9], GPIO[10]).  
Two GPIO are programmed to be ANT_SEL0_N, ANT_SEL1_N) respectively.  
GSM 1800 / GSM1900 RX  
GSM 900 RX  
GSM 900 TX / WCDMA  
GSM 1800 / GSM 1900 TX  
[Table 1.2] Front End Module control logic  
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3. TECHNICAL BRIEF  
3.5.4 PMIC Functional Block Diagram (U300 : PM6650-2M)  
• Input power management  
- Valid external supply attachment and removal detection  
- Supports unregulated (closed-loop) external charger supplies and USB supplies as input power  
sources  
- Supports lithium-ion main batteries  
- Trickle, constant current, constant voltage, and pulsed charging of the main battery  
- Supports coin cell backup battery (including charging)  
- Battery voltage detectors with programmable thresholds  
- VDD collapse protection  
- Charger current regulation and real-time monitoring for over-current protection  
- Charger transistor protection by power limit control  
- Control drivers for two external pass transistors and one external battery MOSFET - MOSFET is  
optional  
- Voltage, current, and power control loops  
- Automated recovery from sudden momentary power loss  
• Output voltage regulation  
- One boost (step-up) switched-mode power supply (SMPS) for driving white LEDs and hosting  
USBOTG  
- Three buck (step-down) switched-mode power supplies that efficiently generate MSMC, MSME,  
and PA (or second MSMC) supply voltages  
- Supports dynamic voltage scaling (DVS) for MSMC and PA  
- Eleven low dropout regulator circuits with programmable output voltages, implemented using three  
different current ratings: 300 mA (two), 150 mA (six), and 50 mA (three). These can be used to  
power MSMA, MSMP, RFRX1, RFRX2, RFTX, SYNT, TCXO, WLAN, MMC, USB, and RUIM  
circuits.  
- All regulators can be individually enabled/disabled for power savings  
- Low power mode available on MSMA and MSMP regulators  
- All regulated outputs are derived from a common bandgap reference-close tracking  
• Integrated handset-level housekeeping functions reduces external parts count, size, cost  
- Analog multiplexer selects from 8 internal and up to 18 external inputs  
- Multiplexer output’s offset and gain are adjusted, increasing the effective ADC resolution  
- Adjusted multiplexer output is buffered and routed to an MSM device ADC  
- Dual oscillators - 32.768 kHz off-chip crystal and on-chip RC assures MSM device sleep clock  
- Crystal oscillator detector and automated switch-over upon lost oscillation  
- Real time clock for tracking time and generating associated alarms  
- On-chip adjustments minimize crystal oscillator frequency errors  
- Circuits control TCXO warm-up and synchronize, deglitch, and buffer the TCXO signal  
- TCXO buffer control for optimal QPH/catnap timing  
- Three-stage over-temperature protection (smart thermal control)  
- 27 -  
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3. TECHNICAL BRIEF  
• Integrated handset-level user interfaces  
- Four programmable current sinks recommended as keypad backlight, LCD backlight, camera flash,  
and general-purpose drivers  
- Vibration motor driver programmable from 1.2 to 3.1V in 100 mV increments  
- Speaker driver with programmable gain, turn-on time, and muting; differential operation (drives  
external 8 Ω speakers with volume controlled 500 mW)  
• IC-level interfaces  
- MSM device-compatible 3-line SBI for efficient initialization, status, and control  
- Supports the MSM device’s interrupt processing with an internal interrupt manager  
- Many functions monitored and reported through real-time and interrupt status signals  
- Dedicated circuits for controlled power-on sequencing, including the MSM device’s reset signal  
- Several events continuously monitored for triggering power-on/power-off sequences  
- Supports and orchestrates soft resets  
- USB-OTG transceiver for full-speed (12 Mb/s) and low speed (1.5 Mb/s) interfacing of the MSM  
device to computers as a USB peripheral, or connecting the MSM device to other peripherals -  
RUIM level translators enable MSM device interfacing with external modules  
• Twelve multi-purpose pins that can be configured as digital or analog I/Os, bi-directional I/Os, or  
current sinks. Default functions support the RUIM level translators, power-on circuits, analog  
multiplexer inputs, an LED driver, and a reference voltage buffer.  
• Highly integrated functionality in a small package - 84-pin BCCS with a large center slug for electrical  
ground, mechanical stability, and thermal relief  
[Figure 1.6] MSM6245 Interface  
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3. TECHNICAL BRIEF  
[Figure1.7] PM6650 Block Diagram  
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3. TECHNICAL BRIEF  
3.5.5 GSM PAM (U101 : SKY77318)  
The SKY77318 is an extremely small (6 x 6 mm), GSM PAM for handset applications. This module  
has been optimized for excellent efficiency and Pout while maintaining high GSM/GPRS efficiency.  
The small size and high performance is achieved with high-reliability GaAs HBT technology.  
With 50Ω and output, no external matching or bias components are required. The module incorporates  
two highly-integrated GaAs power amplifier die with a BiCMOS controller.  
Each amplifier has three gain stages with on-die inter-stage matching implemented with a high Q  
passives technology for optimal performance. The CMOS controller implements a fully integrated  
power control within the module for GSM operations, and serves as the GPRS operations. This  
eliminates the need for any external couplers, power detectors, current sensing etc., to assure the  
output power level. The module has Tx enable and band select inputs. Module construction is a low-  
profile overmolded land-grid array on laminate.  
L111  
5.6nH  
NA  
EGSM  
+VPWR  
Rev.D  
C123  
0.01u  
C121  
33u  
L406  
2.7nH  
C124  
100p  
L403  
1.5nH  
L116  
10nH  
L115  
18nH  
C134  
0.01u  
C441  
5.6p  
C438  
100p  
8.86dB Rev.1.0  
R108  
C136  
0.01u  
C137  
NA  
C138  
NA  
C139  
68p  
DCS_PCS_TX  
51  
FL101  
15  
3
7.5dB  
R112  
DCS_PCS_OUT  
EGSM_OUT  
DCS_PCS_IN  
EGSM_IN  
ENABLE  
4
5
O1 G3  
IN  
G2 G1  
1
11  
19  
21  
4
GSM_TX  
U101  
39  
R113 100ohm  
3
2
18  
1
RSVD_GND  
P_GND  
GSM_PA_EN  
C149  
15p  
SKY77318  
BS  
EFCH897MTDB1  
R117 100ohm  
GSM_PA_BAND  
GSM_PA_BAND  
LOW  
MODE  
C153  
15p  
GSM  
DCS/PCS  
HIGH  
[Figure 1. 8] GSM PAM Schematic  
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3. TECHNICAL BRIEF  
3.5.6 UMTS Duplexer(FL104:ACMD-7602)  
A UMTS duplexer splits a single operating band into receive and transmit paths. Important  
performance requirements include;  
• Insertion loss. this component is also in the receive and transmit paths ; In the U250/KU250 typical  
losses : UMTS2100_ Tx = 1.2 dB, UMTS2100_ Rx = 1.4 dB  
• Out-of-band rejection or attenuation. the duplexer provides input selectivity for the receiver, output  
filtering for the transmitter, and isolation between the two. Rejection levels for both paths are  
specified over a number of frequency ranges. Two Tx-to-Rx isolation levels are critical to receiver  
performance:  
• Rx-band isolation. the transmitter is specified for out-of-band noise falling into the Rx band. This  
noise leaks from the transmit path into the receive path, and must be limited to avoid degrading  
receiver sensitivity. The required Rx-band isolation depends on the PA out of-band noise levels and  
Rx-band losses between the PA and LNA. Minimum duplexer Rx band isolation value is about 51 dB.  
• Tx-band isolation. the transmit channel power also leaks into the receiver. In this case, the leakage is  
outside the receiver passband but at a relatively high level. It combines with Rx band jammers to  
create cross-modulation products that fall in-band to desensitize the receiver. The required Tx-band  
isolation depends on the PA channel power and Tx-band losses between the PA and LNA. Minimum  
duplexer Tx-band isolation value is about 58dB.  
• Passband ripple. the loss of this fairly narrowband device is not flat across its passband. Passband  
ripple increases the receive or transmit insertion loss at specific frequencies, creating performance  
variations across the band.s channels, and should be controlled.  
• Return loss. minimize mismatch losses with typical return losses of 10 dB or more (VSWR <2:1).  
• Power handling. high power levels in the transmit path must be accommodated without degraded  
performance. The specified level depends on the operating band class and mobile station class (per  
the applicable standard), as well as circuit losses and antenna EIRP. Several duplexer characteristics  
depend upon its source and load impedances. QUALCOMM strongly recommends an isolator be  
used between the UMTS PA and duplexer to assure proper performance.  
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3. TECHNICAL BRIEF  
3.5.7 UMTS Rx RF filter (FL103 : EFCH2140TDE1)  
• Frequency range : 2110 ~ 2170MHz  
An RF filter is located between the UMTS LNA and mixer. Insertion loss is important, but not as  
critical as losses before the LNA. The most important parameters of this component include:  
• Out-of-band rejection or attenuation levels, usually specified to meet these conditions:  
- FFar out-of-band signals - ranging from DC up to the first band of particular concern and from the  
last band of particular concern to beyond three times the highest passband frequency.  
- Tx-band leakage - the transmitter channel power, although attenuated by the duplexer, still  
presents a cross-modulation threat in combination with Rx-band jammers. The RF filter must  
provide rejection of this Tx-band leakage.  
- Other frequencies of particular concern . bands known to include other wireless transmitters that  
may deliver significant power levels to the receiver input.  
Table 1.3 WCDMA Rx SAW Filter Specification  
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3. TECHNICAL BRIEF  
3.5.8 Bluetooth (M100 : LBRQ-2B43A)  
The MSM6245 includes BT baseband embedded BT 1.1 compliant baseband core, so the other  
bluetooth components are an bluetooth RF module and Antenna. Figure1.9 shows the bluetooth  
system architecture in the U250/KU250.  
MSM6245  
Bluetooth  
baseband  
[Figure1.9] Bluetooth system architecture  
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3. TECHNICAL BRIEF  
3. BB Technical Description  
3.6 Digital Baseband(DBB/MSM6245)  
3.6.1 General Description  
A. Features(MSM6245)  
• Support for multimode operation - tri-band WCDMA (UMTS), quad-band GSM/GPRS/EDGE  
• Support for WCDMA (UMTS) uplink data rate up to 384 kbps  
• High-performance ARM926EJ-S running at up to 225 MHz  
• ARM Jazelle Java hardware acceleration for faster Java-based games and other applets  
• QDSP4000 high-performance DSP cores  
• Integrated Bluetooth 1.2 baseband processor for wireless connectivity to peripherals  
• Qcamera™ with 30 fps QCIF viewfinder resolution, and support for 2 MP camera sensors  
• Direct interface to digital camera module with video front end (VFE) image processing  
• True 3D graphics for advanced wireless gaming  
• SecureMSM v2.0 includes support for Open Mobile Alliance (OMA) DRM v2.0, SIM-lock and IMEI  
integrity. Support for Q-fuse. Only trusted boot is supported  
• Audio that is on par with portable music players  
• Vocoder support (AMR, FR, EFR, HR)  
• Advanced 14 x 14 mm, 0.5 mm pitch, 409-pin lead-free CSP packaging technology  
• SD/SDIO hardware support  
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3. TECHNICAL BRIEF  
USB  
PM6650  
-2M  
Bluetooth  
RF Module  
SPK/RCV  
VCTCXO  
GSM Block  
MIC  
GSM900 Tx  
GSM  
TX SAW  
GSM  
PAM  
GSM1800/1900 Tx  
GSM  
VCO  
MAIN LCD  
1.3M CAM  
GSM900 Rx  
GSM1800 Rx  
GSM1900 Rx  
MSM6245  
WCDMA Block  
VGA CAM  
Front  
End  
RTR6275  
Module  
WCDMA  
COUPLER  
WCDMA  
TX SAW  
PAM  
U-SIM  
HDET  
WCDMA2100 Tx  
WCDMA2100 Rx  
NAND, SDRAM  
FLASH  
WCDMA  
VCO  
Duplexer  
WCDMA  
RX SAW  
KEYPAD  
AntSW Logic  
Figure 1.10 Simplified Block Diagram  
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3. TECHNICAL BRIEF  
3.7 Block Diagram(MSM6245)  
SDRAM  
NAND Flash  
512Mbit  
LCD  
512Mbit  
(1.76inch)  
EBI 1  
EBI 2  
GSM/GPRS/EDGE  
processor  
CAMERA  
PROCESSING  
(Default 8bit  
Interface)  
DUAL MEMORY BUS  
Camera 1.3M  
VGA camera  
UMTS, WCDMA  
MSM6245  
GRAPHICS  
Modem QDSP 4000  
BT 1.2  
Open GL ES  
3D, 2D  
processor  
PLL  
VIDEO  
ARM 926ejs  
QDSP 4000  
With Jazelle  
MPEG-4  
H.263, H.264  
GPIO  
CONNECTIVITY  
RF SBI  
Rx ADC  
Tx DAC  
AUDIO  
MP3, AAC,  
EVRC, QCELP  
AMR, CMX, MIDI  
USIM  
PM6650  
US  
B
Figure 1.11 Simplified Block Diagram of MSM6245  
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3. TECHNICAL BRIEF  
3.8 Subsystem(MSM6245)  
3.8.1. ARM Microprocessor Subsystem  
The MSM6245 device uses an embedded ARM926EJ-S microprocessor. This microprocessor,  
through the system software, controls most of the functionality for the MSM, including control of the  
external peripherals such as the keypad, LCD, RAM, ROM, and EEPROM devices. Through a Generic  
single-wire serial bus interface (SSBI) the ARM926EJ-S configures and controls the functionality of the  
RTR6275, RFR6275 and PM6650 devices.  
3.8.2. WCDMA R99 features  
The MSM6245 device supports release 99 June 2004 of the W-CDMA FDD standard, including the  
following features:  
■ All modes and data rates for W-CDMA frequency division duplex (FDD), with the following  
restrictions:  
❏ The downlink supports the following specifications:  
- Up to four physical channels, including the broadcast channel (BCH), if present  
- Up to three dedicated physical channels (DPCHs)  
- Spreading factor (SF) range support from 4 to 256  
- The following transmit diversity modes are supported:  
❏ Space time transmit diversity (STTD)  
❏ Time-switched transmit diversity (TSTD)  
❏ Closed-loop feedback transmit diversity (CLTD)  
■ The uplink supports the following specifications:  
❏ The uplink provides the following UE support:  
- One physical channel, eight TrCH, and 16 TrBks starting at any frame boundary  
- A maximum data rate of 384 kbps  
❏ Full SF range support from 4 to 256  
■ SMS (CS and PS)  
■ PS data rate - 384 kbps DL / 384 kbps UL  
■ CS data rate - 64 kbps DL / 64 kbps UL  
■ AMR (all rates)  
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3. TECHNICAL BRIEF  
3.8.3. GSM features  
The following GSM modes and data rates are supported by the MSM6245 device hardware. Support  
modes conform to release '99 specifications of the sub-feature.  
■ Voice features  
❏ FR  
❏ EFR  
❏ AMR  
❏ HR  
❏ A5/1, A5/2, and A5/3 ciphering  
■ Circuit-switched data features  
❏ 9.6k  
❏ 14.4k  
❏ Fax  
❏ Transparent and non-transparent modes for CS data and fax  
❏ No sub-rates are supported.  
3.8.4. GPRS features  
■ Packet switched data (GPRS)  
❏ DTM (Simple Class A) operation  
❏ Multi-slot class 12 data services  
❏ CS schemes: CS1, CS2, CS3, and CS4  
❏ GEA1, GEA2, and GEA3 ciphering  
■ Maximum of four Rx timeslots per frame  
3.8.5. EDGE features  
■ EDGE E2 power class for 8 PSK  
■ DTM (simple Class A), multi-slot class 12  
■ Downlink coding schemes - CS 1-4, MCS 1-9  
■ Uplink coding schemes - CS 1-4, MCS 1-9  
■ BEP reporting  
■ SRB loopback and test mode B  
■ 8-bit, 11-bit RACH  
■ PBCCH support  
■ 1 phase/2 phase access procedures  
■ Link adaptation and IR  
■ NACC, extended UL TBF.  
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3. TECHNICAL BRIEF  
3.8.6. MSM6245 device audio processing features  
■ Integrated wideband stereo CODEC  
❏ 16-bit DAC with typical 88 dB dynamic range  
❏ Supports sampling rates up to 48 kHz on the speaker path and 16 kHz on the microphone path  
■ VR- Voice mail + voice memo  
■ Acoustic echo cancellation  
■ Audio AGC  
■ Audio Codecs: AMR-NB, AAC, AAC Plus, Enhanced AAC Plus, Windows Audio v9, Real Audio 8  
(G2)  
■ Internal vocoder supporting AMR, FR, EFR, and HR  
3.8.7. MSM6245 microprocessor subsystem  
■ Industry standard ARM926EJ-S embedded microprocessor subsystem  
❏ 16 kB instruction and 16 kB data cache  
❏ Instruction set compatible with ARM7TDMI®  
❏ ARM version 5TEJ instructions  
❏ Higher performance 5 stage pipeline, Harvard cached architecture  
❏ Higher internal CPU clock rate with on-chip cache  
■ Java hardware acceleration  
■ Enhanced memory support  
❏ 75 MHz and 90 MHz bus clock for SDRAM  
❏ 32-bit SDRAM  
❏ Dual memory buses separating the high-speed memory subsystem (EBI1) from low-speed  
peripherals (EBI2) such as LCD panels  
❏ 1.8 memory interface support for EBI1 and 1.8 V or 2.6 V memory interface support EBI2  
❏ NAND FLASH memory interface  
- 8/16-bit data I/O width NAND flash support  
- 1- or 4-bit ECC  
- 512-byte/2KB page-size support  
- 2 chip selects supported for NAND Flash  
❏ Boot from NAND  
❏ Low-power SDRAM (LP-SDRAM) interface  
■ Internal watchdog and sleep timers  
3.8.8. Supported interface features  
■ USB On-the-Go core supports both slave and host functionality  
■ Three universal asynchronous receiver transmitter (UART) serial ports  
■ USIM controller (via UART)  
■ Integrated 4-bit secure digital (SD) controller for SD and Mini SD cards  
■ Parallel LCD interface  
■ General-purpose I/O pins  
■ External keypad interface  
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3. TECHNICAL BRIEF  
3.8.9. Supported multimedia features  
■ Provide additional general purpose MIPS by using:  
❏ Two QDSP4000s  
❏ Dedicated hardware accelerators and compression engines  
■ Improve Java, BREW, and game performance  
❏ Integrated Java and 2D/3D graphics accelerator with Sprite engine  
■ Enable various accessories via USB host connectivity.  
❏ Integrated USB host controller functionality  
■ Enable compelling visual and audio applications.  
TM  
Qcamera  
■ High-quality digital camera processing, supporting CCD or CMOS image sensors up to 2MP  
■ 30 fps QCIF viewfinder  
TM  
Qtv  
■ Audio and video decoder that supports VOD, MOD and Broadcast multimedia services.  
■ Audio codecs supported: AMR-NB, AMR-WB, AMR-WB+, AAC, AAC Plus, Enhanced AAC Plus,  
Windows® Media Audio v9, RealAudio® v8  
■ Integrated stereo wideband codec for music/digital clips  
■ CMX  
■ Video codecs supported: MPEG-4, H.263, H.264, Windows Media® v9 and RealNetworks® v10  
TM  
Video telephony services: Qvideophone  
■ A two-way mobile video conferencing solution that delivers 15 fps @ QCIF, 64kbps  
■ Video codecs supported: MPEG-4 and H.263  
■ Audio codecs supported: AMR-NB.  
TM  
Qcamcorder  
■ Real time mobile video encoder  
■ Video codecs supported: MPEG-4, H.263.H.264  
■ Audio codecs supported: AMR-NB  
■ Recording performance: 15 fps @ QCIF, 192 kbps  
TM  
CMX (MIDI and still image, animation, text, LED/vibrate support)  
■ 72 simultaneous polyphonic tones  
■ 44 kHz sampling rate  
■ 512 kB wave table  
■ Support of universal file formats  
❏ Standard MIDI Format (SMF)  
❏ SP-MIDI  
❏ SMAF Audio playback (MA-2, MA-3, MA-5)  
❏ XMF/OLS  
❏ MFi (requires Docomo license)  
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■ PNG decoder  
■ Pitch bend range support  
■ LED/vibrate support  
■ Scalable Vector Graphics (SVG- Tiny 1.1 + SVG Tiny 1.2)  
■ MLZ decoder  
■ Integrated PNG/SAF A.T.  
Table 1-1 Summary of MSM6245 device features  
Note:  
1. At this time, only 32-bit SDRAM is supported on the MSM6245 device. There are potential MIPS  
issues when running Bluetooth and video telephony concurrently with any other memory configuration.  
16-bit SDRAM and NOR FLASH are currently being evaluated and documentation will be updated  
accrdingly in the next revision.  
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3. TECHNICAL BRIEF  
Table 1-2 Description of RF configurations  
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3. TECHNICAL BRIEF  
3.8.10. Stereo Wideband CODEC  
The MSM6245 device integrates a wideband voice/audio CODEC into the mobile station modem  
(MSM). The CODEC supports two differential microphone inputs, one differential earphone output, one  
single-ended earphone output, and a differential analog auxiliary interface.  
The CODEC integrates the microphone and earphone amplifiers into the MSM6245 device, reducing  
the external component count to just a few passive components.  
The microphone (Tx) audio path consists of a two-stage amplifier with the gain of the second stage set  
externally. The Rx/Tx paths are designed to meet the ITU-G.712 requirements for digital transmission  
systems.  
3.8.11. Vocoder Subsystem  
The MSM6245 device’s QDSP4000 supports AMR,FR,EFR and HR. In addition, the QDSP4000 has  
modules to support DTMF tone generation, DTMF tone detection, Tx/Rx volume controls, Tx/Rx  
automatic gain control (AGC), Rx Automatic Volume Control (AVC), ear seal echo canceller (ESEC),  
Acoustic Echo Canceller (AEC), Noise Suppression (NS), and programmable, 13-tap, Type-I, FIR,  
Tx/Rx compensation filters. The MSM6245 device’s integrated ARM9TDMI processor downloads the  
firmware into the QDSP4000 and configures QDSP4000 to support the desired functionality.  
3.8.12. ARM Microprocessor subsystem  
The MSM6245 device uses an embedded ARM926EJ-S microprocessor. This microprocessor,  
through the system software, controls most of the functionality for the MSM device, including control of  
the external peripherals such as the keypad, LCD, RAM, ROM, and EEPROM devices. Through a  
generic single serial bus interface (SSBI) the ARM926EJ-S configures and controls the functionality of  
the RFR6275, RTR6275, and PM6650 devices.  
3.8.13. Mode Select and JTAG Interfaces  
The mode pins to the MSM6245 device determine the overall operating mode of the ASIC. The options  
under the control of the mode inputs are Native mode, which is the normal subscriber unit operation,  
ETM mode, which enables the built-in trace mode, and test mode for factory testing. The MSM6245  
device meets the intent of the ANSI/IEEE 1149.1A-1993 feature list. The JTAG interface can be used  
to test digital interconnects between devices within the mobile station during manufacture.  
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3. TECHNICAL BRIEF  
3.8.14. General-Purpose Input/Output Interface  
The MSM62450 device has general-purpose bidirectional input/output pins. Some of the GPIO pins  
have alternate functions supported on them. The alternate functions include USB interface, additional  
RAM, ROM, general-purpose chip selects, parallel LCD interface, and a UART interface. The function  
of these pins is documented in the various software releases.  
3.8.15. UART  
The MSM6245 device employs three UARTs. UART1 has dedicated pins while UART2 and UART3  
share multiplexed pins.  
3.8.16. USB  
The MSM6245 device integrates a universal serial bus (USB) controller that supports both  
unidirectional and bidirectional transceiver interfaces. The USB controller acts as a USB peripheral  
communicating with the USB host. MSM6245 supports the 3-wire functionality.  
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3. TECHNICAL BRIEF  
3.9 Power Block  
3.9.1. General  
MSM6245, included RF, is fully covered by PM6650(Qualcomm PMIC). PM6650 cover the power of  
MSM6245, MSM memory, RF block, Bluetooth, USIM and TCXO. Major power components are :  
3.9.2. PM6650  
The PM6650 device (Figure 1-1) integrates all wireless handset power management. The power  
management portion accepts power from all the most common sources - battery, external charger,  
adapter, coin cell back-up - and generates all the regulated voltages needed to power the appropriate  
handset electronics. It monitors and controls the power sources, detecting which sources are applied,  
verifying that they are within acceptable operational limits, and coordinates battery and coin cell  
recharging while maintaining the handset electronics supply voltages.  
Eight programmable output voltages are generated using low dropout voltage regulators, all derived  
from a common trimmed voltage reference. A dedicated controller manages the TCXO warm-up and  
signal buffering, and key parameters (under-voltage lockout and crystal oscillator signal presence) are  
monitored to protect against detrimental conditions.  
MSM device controls and statuses the PM6650 IC using Single Serial Bus Interface (SSBI)  
supplemented by an Interrupt Manager for time-critical information. Another dedicated IC Interface  
circuit monitors multiple trigger events and controls the power-on sequence.  
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3. TECHNICAL BRIEF  
Figure 1.12 PM6650 Functional Block Diagram  
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3. TECHNICAL BRIEF  
3.9.3. Charging control  
A programmable charging block in PM6650 is used for battery charging. It is possible to set limits for  
the charging current. The external supply typically connects directly to pin (VCHG). The voltage on this  
pin (VCHG) is monitored by detection circuitry to ascertain whether a valid external supply is applied or  
not. For additional accuracy or to capture variations over time, this voltage is routed internally to the  
housekeeping ADC via the analog multiplexer. PM6650 circuits monitor voltages at VCHARGER and  
ICHARGE pins to determine which supply should be used and when to switch between the two  
supplies. These pins are connected to the Source (or emitter) and Drain (or collector) contacts of the  
pass transistor respectively.  
3.58V~3.20V  
2~0 (%)  
3.73V~3.69V  
44~20 (%)  
3.68V~3.59V  
19~3 (%)  
4.2V~3.82V  
100~70 (%)  
3.81V~3.74V  
69~45 (%)  
Figure 1.13 U250/KU250 Battery Bar Display(Stand By Condition)  
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3. TECHNICAL BRIEF  
Trickle Charging  
DD  
Trickle Charging of the main battery, enabled through SBI control and powered from V , is provided  
by the PM6650 IC, The trickle charger is on-chip programmable current source that supplies current  
DD  
from V to pin (VBAT). Trickle charging can be used for lithium-ion and nickelbased batteries, with its  
performance specified below (3.2V). The charging current is set to 80mA.  
Parameter  
Min  
Typ  
Max  
Unit  
Trickle Current  
60  
80  
100  
mA  
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3. TECHNICAL BRIEF  
Constant Current Charging  
The PM6650 IC supports constant current charging of the main battery by controlling the charger pass  
transistor and the battery transistor. The constant current charging continues until the battery reaches  
its target voltage, 4.2V.  
Constant Voltage Charging  
Constant voltage charging begins when the battery voltage reaches a target voltage, 4.2V. The end of  
constant voltage charging is commonly detected 10% of the full charging current.  
•
•
•
•
•
•
•
•
•
•
Charging Method : CC & CV (Constant Current & Constant Voltage)  
Maximum Charging Voltage : 4.2V  
Maximum Charging Current : 600mA  
Nominal Battery Capacity : 950mAh  
Charger Voltage : 5.1V  
Charging time : Max 3h (Except time trickle charging)  
Full charge indication current (icon stop current) : 100mA  
Low battery POP UP : Idle - 3.58V, Dedicated(GSM/WCDMA) - 3.58V  
Low battery alarm interval : Idle - 3 min, Dedicated - 1min  
Cut-off voltage : 3.20V  
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3. TECHNICAL BRIEF  
3.10 External memory interface  
The MSM6245 device was designed to provide two distinct memory interfaces. EBI1 was targeted for  
supporting high speed synchronous memory devices. EBI2 was targeted towards supporting slower  
asynchronous devices such as LCD, NAND flash, SDRAM, etc.  
•
EBI1 Features  
- 16 bit static and dynamic memory interface  
- 32 bit dynamic memory interface  
- 24 bits of address for static memory devices which can support up to 32MBytes on each chip select  
- Synchronous burst memories supported (burst NOR, burst PSRAM)  
- Synchronous DRAM memories supported  
- Byte addressable memory supporting 8 bit, 16 bit and 32 bit accesses  
- Pseudo SRAM (PSRAM) memory support  
•
EBI2 Features  
- Support for asynchronous FLASH and SRAM(16bit & 8bit).  
- Interface support for byte addressable 16bit devices (UB_N & LB_N signals).  
- Support for 8 bit/16bit wide NAND flash.  
- Support for parallel LCD interfaces, port mapped of memory mapped(18 or 16 bit).  
•
512Mb NAND(8bit) flash memory + 512Mb SDRAM (32bit)  
Interface Spec  
Device  
FLASH  
SDRAM  
Part Name  
Maker  
hynix  
hynix  
Read Access Time  
Write Access Time  
HYC0UEH0MF3P  
HYC0UEH0MF3P  
60 ns  
7 ns  
60 ns  
7 ns  
Table#1. External memory interface  
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EBI1  
EBI2  
ADDRESS[14:  
DATA[31:0]  
0]  
NAND_CS*  
NAND_RE*  
NAND_WE*  
WE*  
CS*  
NAND  
NAND_CLE  
SDRAM  
512Mb  
512Mb  
(64MB)  
NAND_WP*  
NAND_ALE  
NAND_READY  
DATA[7:0]  
CAS*  
RAS*  
CLK_EN  
CLK  
DQM[3:0]  
MSM6245  
Figure 1.14 Simplified Block Diagram of Memory Interface  
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3. TECHNICAL BRIEF  
3.11 H/W Sub System  
3.11.1. RF Interface  
A. RTR6275(WCDMA_Tx, GSM_Tx/Rx)  
MSM6245 controls RF part(RTR6275) using these signals.  
•
•
•
•
•
SBST : SSBI I/F signals for control Sub-chipset  
PA_ON1 : Power AMP on RF part  
RX0_I/Q_M/P,TX_I/Q_M/P : I/Q for T/Rx of RF  
TX_AGC_ADJ : control the gain of the Tx signal prior to the power amplifier  
DAC_REF : Reference input to the MSM Tx data DACs  
XMEM1_CS_N3_SDRAM1_CS_N1_GPIO77  
L25  
UART3_RFR_N_GPIO87  
H6  
F18  
H18  
UART2_DP_RX_DATA_GPIO89  
SYNTH0_GP_PDM0_GPIO92  
SBST1_GPIO93  
RCV_EN_N  
Close to MSM  
LCD_IF_MODE_1  
H13  
L13  
F19  
F17  
TX_AGC_ADJ  
TRK_LO_ADJ  
TCXO_EN_GPIO94  
PA_ON0  
TX_AGC_ADJ  
TRK_LO_ADJ  
2K  
R213  
TCXO_EN  
PA_ON  
A12  
B12  
A13  
B13  
F12  
Q_OUT_N  
Q_OUT  
I_OUT_N  
I_OUT  
DAC_REF  
TX_QM  
TX_QP  
TX_IM  
TX_IP  
DAC_REF  
W23  
V23  
V25  
W25  
AA25  
Y25  
AB25  
AC25  
Q_IM_CH1  
Q_IP_CH1  
I_IM_CH1  
I_IP_CH1  
Q_IM_CH0  
Q_IP_CH0  
I_IM_CH0  
I_IP_CH0  
RF  
RX_QM  
RX_QP  
RX_IM  
RX_IP  
D17  
H17  
GP_PDM2_PA_RAN_GE1  
GP_PDM1_PA_RAN_GE0  
PA_R0  
H15  
D16  
F15  
D15  
A17  
H16  
TRST_N  
TCK  
TMS  
TDI  
TDO  
RTCK  
K19  
N21  
G4  
J8  
H12  
AUX_PCM_CLK_GRFC14_GPIO80  
AUX_PCM_DIN_GRFC13_GPIO14  
AUX_PCM_DOUT_GRFC12_GPIO103  
AUX_PCM_SYNC_GRFC11_GPIO102  
TX_ON_GRFC10  
SPK_AMP_EN  
TX_ON  
B4  
GRFC8_GPIO11  
GRFC7_GPIO10  
T23  
T19  
D11  
H10  
F10  
D9  
ANT_SEL1  
ANT_SEL0  
GRFX6_GPIO9  
GRFC5_AUX_SBST_GPIO8  
GRFC4_AUX_SBCK_GPIO7  
GRFC3_GPIO6  
GRFC2_GPIO5  
GRFC1_AUX_SBDT_GPIO4  
GRFC0_GPIO3  
GSM_PA_BAND  
GSM_PA_EN  
A8  
B8  
G23  
F23  
E26  
E25  
H21  
R19  
BT_CLK_GPIO25  
BT_SBST_GPIO24  
BT_SBCK_GPIO23  
BT_SBDT_GPIO22  
BT_TX_RX_N_GPIO21  
BT_DATA_GPIO20  
BT_CLK  
BT_SBST  
BT_SBCK  
BT_SBDT  
BT_TX_RX_N  
BT_DATA  
Figure 1.15 Schematic of RF Interface of MSM6245  
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3. TECHNICAL BRIEF  
B. the others  
•
•
•
•
•
•
TRK_LO_ADJ : TCXO(19.2M) Control  
PA_ON : WCDMA(2100) TX Power Amp Enable  
ANT_SEL[0-2] : Ant Switch Module Mode Selection(WCDMA,GSM Tx/Rx,DCS-PCS Tx/Rx)  
GSM_PA_BAND : GSM/DCS-PCS Band Selection of Power Amp  
GSM_PA_RAMP : Power Amp Gain Control of APC_IC  
GSM_PA_EN : Power Amp Gain Control Enable of APC_IC  
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3. TECHNICAL BRIEF  
3.11.2. MSM Sub System  
3.11.2.1. USIM Interface  
SIM interface scheme is shown in Figure.  
And, there control signals are followed  
•
•
•
USIM_CLK : USIM Clock  
USIM_Reset : USIM Reset  
USIM_Data : USIM Data T/Rx  
VREG_UIM 2.85V  
USIM CLK  
USIM CLK  
USIM Reset  
USIM Data  
USIM  
USIM Reset  
USIM Data  
PM6650  
MSM6245  
Figure 1.16 SIM Interface  
3.11.2.2. UART Interface  
UART signals are connected to MSM GPIO through IO connector with 115200 bps speed.  
GPIO_Map  
GPIO_96  
GPIO_95  
Name  
Note  
UART_RXD  
UART_TXD  
Data_Rx  
Data_Tx  
Table. UART Interface  
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3. TECHNICAL BRIEF  
3.11.2.3. USB  
The MSM6245 device contains a Universal Serial Bus (USB) interface to provide an efficient  
interconnect between the mobile phone and a personal computer (PC). The USB interface of the  
MSM6245 was designed to comply with the definition of a peripheral as specified in USB Specification,  
Revision 1.1. Therefore, by definition, the USB interface is also compliant as a peripheral with the USB  
Specification, Revision 2.0. The USB Specification Revision 1.1 defines two speeds of operation,  
namely low-speed (1.5 Mbps) and full-speed (12 Mbps), both of which are supported by the  
MSM6245.  
Name  
Note  
USB_DAT  
USB_SE0  
USB_OE_N  
USB_VBUS  
USB_D+  
USB_D-  
Data to/from MSM  
Data to/from MSM  
Out-Put Enable of Transceiver  
USB_Power From Host(PC)  
USB Data+ to Host  
USB Data- to Host  
Table. USB Signal Interface  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
VREG_5V  
USB_OE_N  
VSW_5V  
USB_CTL_N  
USB_VBUS  
USB_DAT  
USB_D_P  
USB_SE0  
USB_OE_N  
USB_CTL_N  
USB_VBUS  
USB_DAT  
USB_D+  
USB_SE0  
USB_D-  
USB_D_M  
GP1_DRV_N(  
R309  
C336  
2.2K  
4.7u  
1608  
Figure 1.17 Schematic of USB block(MSM6245 Side & PM6650 Side)  
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3. TECHNICAL BRIEF  
3.11.3 HKADC(House Keeping ADC)  
The MSM6245 device has an on-chip 8-bit analog-to-digital converter (HKADC) which is tended to  
digitize DC signals corresponding to analog parameters such as battery voltage, temperature, and RF  
power levels. The MSM6245 device has six analog input pins which are multiplexed to the input of the  
internal HKADC.  
Figure 1.18 MSM6245 HKADC Block diagram  
Channel  
HKADC0  
HKADC1  
HKADC2  
HKADC3  
HKADC4  
HKADC5  
Signal  
Note  
AMUX_OUT  
VBATT_SENSE  
NC  
RF PAM Temperature Check  
Battery voltage level  
NC  
NC  
NC  
PCB_Rev_ADC  
Battery_THERM  
PCB Version Check  
Battery Temperature Check  
Table. HKADC channel table  
- 56 -  
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3. TECHNICAL BRIEF  
3.11.4. Key Pad  
There are 23 main key buttons in Figure.  
Shows the Keypad circuit. ‘END’ Key is connected to PMIC(PM6650).  
COL0  
COL1  
COL2  
COL3  
CLR  
COL4  
MENU  
UP  
ROW(0)  
ROW(1)  
ROW(2)  
ROW(3)  
ROW(4)  
-
1
4
7
*
2
5
8
0
3
6
9
#
LEFT  
OK  
RIGHT  
SEARCH  
BACK  
SEND  
DOWN  
Table. Key Matrix Mapping Table  
VREG_MSMP_2.7V  
KEY MAP  
CLR  
LEFT  
OK  
MENU  
UP  
KEY_ROW(0)  
400  
1
401  
2
402  
3
KEY_ROW(1)  
KEY_ROW(2)  
KEY_ROW(3)  
403  
4
404  
5
405  
6
RIGHT  
SEARCH  
BACK  
406  
7
407  
8
408  
9
SND  
DN  
HOT400  
HOT4  
409  
0
HOT401  
HOT3  
KEY_ROW(4)  
KEY_COL(0)  
KEY_COL(1)  
KEY_COL(2)  
KEY_COL(3)  
KEY_COL(4)  
Figure 1.19 Main Keypad Circuit  
END  
PM_ON_SW_N  
END  
Figure 1.20 END Keypad Circuit  
- 57 -  
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3. TECHNICAL BRIEF  
3.11.5 Camera Interface  
U250/KU250 Installed a 1.3M Pixel and 0.3Mega Camera. Below figure shows the camera socket type  
connector and camera I/F signal.  
CAMERA  
MEGA CAMERA CONNECTOR  
REV_1.0  
R436  
0
22  
23  
24  
1
20  
19  
18  
12  
11  
10  
9
CAM_DATA_OUT(0)  
CAM_DATA_OUT(1)  
CAM_DATA_OUT(2)  
CAM_DATA_OUT(3)  
CAM_DATA_OUT(4)  
CAM_DATA_OUT(5)  
CAM_DATA_OUT(6)  
CAM_DATA_OUT(7)  
D0  
D1  
D2  
D3  
D4  
D5  
D6  
D7  
PCLK  
VSYNC  
HSYNC  
STANDBY  
SCK  
CAM_PCLK  
CAM_VSYNC_OUT  
CAM_HSYNC_OUT  
CN403  
MEGA_CAM_PWR_DOWN  
2
I2C_SCL  
I2C_SDA  
MEGA_CAM_RESET_N  
CAM_MCLK  
3
SDA  
4
RESETB  
MCLK  
5
7
R437 20  
VREG_CAM_AVDD_2.8V  
VREG_CAM_DVDD_1.8V  
REV_1.0  
COMMON_CAM_MCLK  
ICVE21184E150R500FR  
ICVE21184E150R500FR  
1
2
3
4
9
8
1
2
3
4
9
8
INOUT_A1 INOUT_B1  
INOUT_A2 INOUT_B2  
INOUT_A1 INOUT_B1  
INOUT_A2 INOUT_B2  
CAM_DATA(0)  
CAM_DATA(1)  
CAM_DATA(2)  
CAM_DATA_OUT(0)  
CAM_DATA_OUT(1)  
CAM_DATA_OUT(2)  
CAM_DATA(3)  
CAM_DATA(4)  
CAM_DATA(5)  
CAM_DATA_OUT(3)  
CAM_DATA_OUT(4)  
CAM_DATA_OUT(5)  
7
INOUT_A3 INOUT_B3  
6
7
INOUT_A3 INOUT_B3  
6
INOUT_A4 INOUT_B4  
INOUT_A4 INOUT_B4  
FL406  
FL407  
ICVE21184E150R500FR  
1
2
3
4
9
INOUT_A1 INOUT_B1  
CAM_DATA(6)  
CAM_DATA_OUT(6)  
CAM_DATA_OUT(7)  
CAM_VSYNC_OUT  
CAM_HSYNC_OUT  
8
7
6
INOUT_A2 INOUT_B2  
INOUT_A3 INOUT_B3  
INOUT_A4 INOUT_B4  
CAM_DATA(7)  
CAM_VSYNC  
CAM_HSYNC  
FL408  
VT_CAMERA_CONNECTOR  
VGA_CAM_RESET_N  
I2C_SCL  
I2C_SDA  
VREG_CAM_AVDD_2.8V  
GND6  
GND5  
1
2
3
4
5
VREG_CAM_DVDD_1.5V  
COMMON_CAM_MCLK  
P1  
P2  
P3  
P4  
P5  
15  
14  
13  
12  
11  
REV_1.0  
CN404  
P15  
P14  
P13  
P12  
P11  
CAM_PCLK  
CAM_DATA_OUT(0)  
CAM_HSYNC_OUT  
CAM_VSYNC_OUT  
CAM_DATA_OUT(7)  
CAM_DATA_OUT(6)  
GND1  
GND2  
CAM_DATA_OUT(1)  
CAM_DATA_OUT(2)  
CAM_DATA_OUT(3)  
CAM_DATA_OUT(4)  
CAM_DATA_OUT(5)  
Figure 1.21 Camera Socket Type Connector  
- 58 -  
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3. TECHNICAL BRIEF  
The MEGA Camera module is connected to socket type connector with 24 pin (F95M08). Its interface  
is dedicated camera interface port in MSM6245. The camera port supply 24.576MHz master clock to  
camera module and receive 49.152MHz pixel clock (15fps), vertical sync signal, horizontal sync signal,  
reset signal and 8bits data from camera module. The camera module is controlled by I2C port from  
MSM6245.  
No  
1
2
3
4
Name  
Port  
O
O
O
O
O
GND  
Note  
Data  
Data  
Data  
Data  
Data  
GND  
CAM_DATA_OUT(3)  
CAM_DATA_OUT(4)  
CAM_DATA_OUT(5)  
CAM_DATA_OUT(6)  
CAM_DATA_OUT(7)  
GND  
5
6
Master Clock(24.576M)  
I
7
MCLK  
8
GND  
GND  
GND  
9
MEGA_CAM_RESET_N  
I2C_SDA  
I2C_SCL  
MEGA_CAM_PWR_DN  
VREG_CAM_DVDD_1.8V  
VREG_CAM_AVDD_2.8V  
I
O
O
Camera reset signal  
I2C Data  
I2C Clock  
Camera power down  
DVDD  
VDDIO  
GND  
AVDD  
GND  
Horizontal Sync  
Vertical Sync  
Pixel Clock (49.152M)  
GND  
Data  
Data  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
I
I
I
GND  
GND  
I
GND  
O
O
O
GND  
O
O
VREG_CAM_AVDD_2.8V  
GND  
CAM_HSYNC_OUT  
CAM_VSYNC_OUT  
CAM_PCLK  
GND  
CAM_DATA_OUT(0)  
CAM_DATA_OUT(1)  
CAM_DATA_OUT(2)  
O
Data  
Table. Interface between MEGA Camera Module and MAIN PCB (in camera module)  
- 59 -  
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3. TECHNICAL BRIEF  
The VGA Camera module is connected to socket type connector with 20 pin (CLE9120-2761E). Its  
interface is dedicated camera interface port in MSM6245. The camera port supply 24.576MHz master  
clock to camera module and receive 12.288MHz pixel clock (15fps), vertical sync signal, horizontal  
sync signal, reset signal and 8bits data from camera module.  
The camera module is controlled by I2C port from MSM6245.  
No  
1
Name  
Port  
Note  
VREG_CAM_DVDD_1.8V  
I
I
DVDD  
2
CAM_MCLK  
GND  
Master Clock(24.576M)  
3
GND GND  
4
CAM_PCLK  
O
O
O
O
O
O
O
O
O
O
O
Clock for Camera Data Out(12.288M)  
5
CAM_DATA(0)  
CAM_DATA(1)  
CAM_DATA(2)  
CAM_DATA(3)  
CAM_DATA(4)  
CAM_DATA(5)  
CAM_DATA(6)  
CAM_DATA(7)  
CAM_VSYNC  
CAM_HSYNC  
GND  
Data  
6
Data  
7
Data  
8
Data  
9
Data  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
Data  
Data  
Data  
Vertical Sync  
Horizontal Sync  
GND GND  
I2C_SDA  
I
I
I
I
I
I2C Data  
I2C_SCL  
I2C Clock  
VGA_CAM_RESET_N  
VREG_AVDD_2.8V  
VREG_AVDD_2.8V  
Camera reset signal  
Camera I/O Power  
Camera I/O Power  
Table. Interface between VGA Camera Module and MAIN PCB (in camera module)  
- 60 -  
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3. TECHNICAL BRIEF  
3.11.6 Keypad Light  
There are 8 Blue LEDs in Main key backlight circuit, which are driven by KYDB_BACKLIGHT line from  
PM6650.  
KEY_BACK_LIGHT LED(8EA)  
+VPWR  
LD400 LEBB-S14H  
LD403 LEBB-S14H  
LD406 LEBB-S14H  
LD402  
LD405  
LEBB-S14H  
LEBB-S14H  
LEBB-S14H  
R411  
100ohm  
R414  
100ohm  
R417  
100ohm  
R413 100ohm  
R416 100ohm  
R419 100ohm  
LD404 LEBB-S14H  
LD407 LEBB-S14H  
R415  
100ohm  
LD408  
R418  
100ohm  
REV_B : EDLH0013501 --> EDLH0006001  
KYBD_BACKLIGHT  
Figure 1.22 Schematic of KEY back light circuit (KEY side)  
- 61 -  
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3. TECHNICAL BRIEF  
3.11.7. LCD Module (NM176CN1 : Tovis)  
- The NM176CN1 model is a Color TFT Main supplied by Tovis. This LCD Module has a 1.76 inch  
diagonally measured active display area with 176(RGB)X220 resolution. each pixel is divided into  
Red, Green and Blue sub-pixels and dots which are arranged in vertical stripes.  
* Features  
- Display mode(Main LCD) : Normally White, Transmissive TN mode 265K colors.  
- LCD Driver IC: NT3916 (NOVATEK).  
- 16 bit CPU interface Parallel  
3.11.8. Display & LCD FPC Interface  
LCD module is connected to LCD KEY FPCB with 35 pin (XF2B-3545-31A / OMROM) The LCD  
module is controlled by 16-bit EBI2 in MSM6245.  
LCD CONNECTOR  
CN400  
ICVE21184E150R500FR  
9
1
2
3
4
INOUT_B1 INOUT_A1  
INOUT_B2 INOUT_A2  
INOUT_B3 INOUT_A3  
INOUT_B4 INOUT_A4  
EBI2_DATA(0)  
EBI2_DATA(1)  
EBI2_DATA(2)  
EBI2_DATA(3)  
ICVE21184E150R500FR  
INOUT_A1 INOUT_B1  
INOUT_A2 INOUT_B2  
INOUT_A3 INOUT_B3  
INOUT_A4 INOUT_B4  
8
7
6
35  
33  
31  
29  
27  
25  
23  
21  
19  
17  
15  
13  
11  
9
LCD_RESET_N  
LCD_IF_MODE_0  
LCD_IF_MODE_1  
LCD_VSYNC  
34  
32  
30  
28  
26  
24  
22  
20  
18  
16  
14  
12  
10  
8
LCD_CS_N  
LCD_ADS  
EBI2_WE_N  
EBI2_OE_N  
1
2
3
4
9
8
7
6
FL400  
ICVE21184E150R500FR  
FL401  
9
8
7
6
1
2
3
4
INOUT_B1 INOUT_A1  
INOUT_B2 INOUT_A2  
INOUT_B3 INOUT_A3  
INOUT_B4 INOUT_A4  
EBI2_DATA(4)  
EBI2_DATA(5)  
EBI2_DATA(6)  
EBI2_DATA(7)  
FL402  
ICVE21184E150R500FR  
INOUT_A1 INOUT_B1  
INOUT_A2 INOUT_B2  
INOUT_A3 INOUT_B3  
INOUT_A4 INOUT_B4  
EBI2_DATA(8)  
EBI2_DATA(9)  
EBI2_DATA(10)  
EBI2_DATA(11)  
1
2
3
4
9
8
7
6FL403  
ICVE21184E150R500FR  
INOUT_A1 INOUT_B1  
INOUT_A2 INOUT_B2  
INOUT_A3 INOUT_B3  
INOUT_A4 INOUT_B4  
EBI2_DATA(12)  
EBI2_DATA(13)  
EBI2_DATA(14)  
EBI2_DATA(15)  
1
2
3
4
9
8
7
6
7
6
5
4
3
2
FL405  
1
LCD_MAKER_ID  
VREG_LCD_2.8V  
WLED_1  
WLED_2  
WLED_3  
WLED_PWR  
Figure 1.23 Interface between LCD Module and MAIN PCB.  
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3. TECHNICAL BRIEF  
3.11.8.1. Audio Signal Processing & Interface  
Audio signal processing is divided uplink path and downlink path. The uplink path amplifies the audio  
signal from MIC and converts this analog signal to digital signal and then transmits it to DBB Chip  
(MSM6245). This transmitted signal is reformed to fit in GSM & WCDMA frame format and delivered to  
RF Chipset. The downlink path amplifies the signal from DBB chip (MSM6245) and outputs it to  
receiver (or speaker).  
The receive path can be directed to either one of two earphone amplifiers or the auxiliary output. The  
outputs earphone1 (EAR1OP, EAR1ON) and auxiliary out (LINE_P, LINE_N) are differential outputs.  
Earphone2 (HPH_L, HPH_R) is a single-ended output stage designed to drive a headset speaker.  
The microphone interface consists of two differential microphone inputs, one differential auxiliary input  
and a two-stage audio amplifier.  
Figure 1.24 Audio Interface Detailed Diagram(MSM6245)  
- 63 -  
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3. TECHNICAL BRIEF  
MSM6245 CODEC pins  
AUDIO  
Near to MSM  
C200 47p  
C201 47p  
C204  
10p  
Place near  
MSM pin W18  
C212  
0.1u  
10%  
(CODEC VSS)  
F25  
M25  
M26  
SDCC_DAT1_GPIO99  
SDCC_DAT2_GPIO100  
Figure 1.25 Audio part schematics  
2.2K  
VREG_MSMP_2.7V  
I/O CONNECTOR  
MICBIAS  
R400  
R401  
5.1K  
C400  
0.1u  
R403  
51K  
VREG_MSMP_2.7V  
CN401  
HSEJ-18S04-25R  
10K  
5
VIN-  
4
3
VCC  
GND  
1
R404  
HOOK_KEY  
21  
OUT  
VIN+  
19  
2
1
MIC2N  
MIC2P  
2
3
4
5
6
7
8
9
U400  
NCS2200SQ2T2G  
C401  
33u  
33u  
R406 100ohm  
HPH_L  
HPH_R  
USB_D+  
USB_D-  
C402  
R407 100ohm  
EAR_SENSE_N  
Figure 1.26 Audio part schematics  
- 64 -  
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3. TECHNICAL BRIEF  
AUDIO  
SELECT_SPK&RCV  
U401  
NLAS5223BMNR2G  
1
2
3
4
5
10  
VCC  
NO1  
COM1  
IN1  
NO2  
COM2  
IN2  
+VPWR  
SPK+  
9
C410  
0.01u  
SPK-  
SPK_RCV+  
RCV_EN_N  
8
SPK_RCV-  
7
10  
R421  
NC2  
RCV+  
6
R422  
10  
NC1  
GND  
RCV-  
REV_B  
MIC  
MICBIAS  
C416  
10u  
C417  
47p  
REV_B : SUMY0010301 --> SUMY0003802  
R424  
2.2K  
MIC400  
OB4-15L42-C33L  
C418 0.1u  
C419 0.1u  
1
2
MIC1P  
MIC1N  
REV_B : EDTY0008606 --> EDTY0008601  
Figure 1.27 Audio part schematics  
- 65 -  
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3. TECHNICAL BRIEF  
Audio AMP  
NCP2890DMR2  
1
2
8
SPK_AMP_EN  
_SD  
OUTB  
SPK-  
R426  
20K  
REV_C : 20K --> 3K  
7
6
BYPASSU402 VM  
VP  
+VPWR  
SPK+  
C422  
C423  
0.1u  
0.1u  
R4285.6K  
R4305.6K  
R427  
R429  
1K  
1K  
3
4
LINE_N  
LINE_P  
INP  
INM  
5
OUTA  
C428  
1u  
R431  
20K  
C425  
10u  
C431  
NA  
L401  
L402  
100nH  
100nH  
RCVN  
RCVP  
SPK_RCV-  
SPK_RCV+  
REV_E : For Antenna Radiation  
Audio part schematics  
- 66 -  
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3. TECHNICAL BRIEF  
3.11.8.2. Audio Mode  
There are three audio modes (Voice call, speaker phone, MIDI/MP3).  
MODE  
Device  
Description  
Receiver Mode  
Loud Mode  
Headset  
Receiver Voice Call  
Speaker Phone  
Headset Voice Call  
Speaker Phone  
Speaker MIDI Bell  
Headset MIDI Bell  
Speaker MP3  
Voice Call  
Speaker phone  
MIDI  
Loud Mode  
Loud Mode  
Headset  
Loud Mode  
Headset  
MP3  
Headset MP3  
Table. Audio Mode  
Audio & Sound Main Component  
There are 6 main components in U250/KU250.  
Component  
MSM6245  
Design No.  
U201  
Maker Part No.  
MSM6245  
Note  
1
2
3
Base-Band Modem  
1W Audio Amp  
Audio amp  
U402  
NCP2890DMR2  
NLAS5223BMNR2G  
Analog Switch  
U401  
Dual Analog Switch  
4
5
6
Speaker/Receiver  
MIC  
EMS1810TP  
Speaker/Receiver  
-42 dB microphone  
Ear jack  
MIC400  
OB4-15L42-C33L  
RMBLGG080STSB  
Ear jack  
Table. Audio main component list  
- 67 -  
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3. TECHNICAL BRIEF  
3.12 Main Features  
1. LG-U250/KU250 Main features  
- Bar Type  
- WCDMA(2100) + GSM Tri-Band (900/1800/1900)  
- Color LCD (Main:262K TFT, 1.76”)  
- Dual Camera (1.3Mega + VGA(0.3M))  
- 1810 speaker/receiver  
- Stereo Headset  
- Speaker phone (in GSM and WCDMA)  
- MP3/AAC decoder and play  
- MPEG4 encoder/decoder and play/save  
- JPEG en/decoder  
- Supports Bluetooth, USB  
- 950 mAh (Li-Ion)  
- 68 -  
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3. TECHNICAL BRIEF  
2. U250/KU250 Main Component  
Logic  
/Audio  
RF  
Bluetoot  
h
Logic  
Main board (Bottom)  
Main board (Top)  
- 69 -  
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3. TECHNICAL BRIEF  
RF  
SW100  
U101  
U500  
FL101  
U100  
X100  
FL104  
U103  
Reference  
SW100  
Description  
Reference  
FL104  
Description  
Ant. Switch module  
W2100 Duplex  
U500  
U101  
FL101  
U100  
Front End module  
GSM PAM  
U103  
X100  
WCDMA PAM  
VCTCXO  
GSM SAW  
BT module  
RTR6275  
- 70 -  
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3. TECHNICAL BRIEF  
Logic / Audio  
BAT300  
U303  
CN403  
CN401  
U402  
Reference  
BAT300  
U303  
Description  
Backup Battery  
1.3M Cam. LDO  
Audio AMP  
Reference  
CN401  
Description  
MMI connector (18pin)  
1.3M Cam. Connector  
CN403  
U402  
- 71 -  
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3. TECHNICAL BRIEF  
Logic  
CN400  
U201  
U300  
U301  
J300  
S300  
Reference  
U201  
Description  
Reference  
U300  
Description  
MSM6245_A  
Memory MCP  
PMIC  
U301  
J300  
U-SIM socket  
T-FLASH socket  
CN400  
Main To LCD Connector  
S300  
- 72 -  
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4. TROUBLE SHOOTING  
4. TROUBLE SHOOTING  
4.1 RF Component  
- 73 -  
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4. TROUBLE SHOOTING  
Block  
Diagram  
Block  
Ref. Name  
Part Name  
Function  
Comment  
UMTS  
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4. TROUBLE SHOOTING  
4.2 SIGNAL PATH_UMTS RF  
Common Tx/Rx  
UMTX 2100 Tx/Rx  
UMTX 2100 Tx  
UMTX 2100 Rx  
Tx I/Q  
LO  
RX I/Q  
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4. TROUBLE SHOOTING  
4.3 SIGNAL PATH_GSM RF  
Common Tx/Rx  
GSM900 Tx  
DCS/PCS Tx  
EGSM900 RX  
PCS Rx  
DCS RX  
Tx I/Q  
LO  
RX I/Q  
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4. TROUBLE SHOOTING  
4.4 Checking VC-TCXO Block  
The reference frequency (19.2MHz) from X100 (VC-TCXO) is used in UMTS  
TX part, GSM part and BB part.  
TCXO  
X100  
DSA321SCE-19.2M  
NC3  
NC4  
NC2  
NC1  
7
8
6
5
VREG_TCXO_2.85V  
OUTPUT GND  
3
4
2
100ohm  
R124  
TP1  
VCC  
VCONT  
TRK_LO_ADJ  
1
19.2MHz  
TP2  
TP4  
R128 100K  
C185 100p  
C186  
1000p  
TCXO_PM  
VCC  
5
C187  
1000p  
C188  
0.01u  
2
4
RTR6275_TCXO  
TCXO_BT  
3
U104  
GND  
TC7SH04FU  
TP3  
Schematic of the VC-TCXO Block  
TP3  
TP4  
TP2  
TP1  
Test Point of the VC-TCXO Block  
- 77 -  
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4. TROUBLE SHOOTING  
T
Check C312 of PMIC (U300)  
Check R213 of MSM (U201)  
- 78 -  
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4. TROUBLE SHOOTING  
4.5 Checking Front-End Module Block  
TP1  
Rev.C  
U500  
Rev.D  
L108  
19  
5
6
1
2
3
4
9
VDD  
GSM900_RX1  
GSM900_RX2  
GSM1800_RX1  
GSM1800_RX2  
GSM1900_RX1  
GSM1900_RX2  
WCDMA2100  
VREG_RF_SMPS  
15nH  
C117  
10p  
Rev.B  
7
8
GND1  
GND2  
GND3  
GND4  
GND5  
GND6  
GND7  
GND8  
GND9  
GND10  
10  
12  
13  
15  
17  
20  
21  
23  
1K  
1K  
R100  
R101  
18  
22  
D5011  
CTRL1  
CTRL2  
ANT_SEL0  
ANT_SEL1  
16  
14  
GSM900_TX  
GSM18001900_TX  
C110  
33p  
C109  
33p  
Schematic of the Front-End Module Block  
TP1  
ANT_SEL0  
ANT_SEL1  
Test Point of the Front-End Module Block  
- 79 -  
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4. TROUBLE SHOOTING  
Logic Table of the FEM  
GSM 1800 / GSM1900 RX  
GSM 900 RX  
GSM 900 TX / WCDMA  
GSM 1800 / GSM 1900 TX  
TP1 VREG RF SMPS  
- 80 -  
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4. TROUBLE SHOOTING  
4.6 Checking UMTS Block  
4.6.1 Checking Tx level  
TP1  
TP2  
TP3  
TP4  
ANT101 ANT102  
TP1  
C450  
22p  
C101  
56p  
SW100  
G2  
ANT  
RF  
G1  
KMS-507  
1p  
C437  
C102  
NA  
L101  
NA  
L102  
100nH  
TP2  
U500  
Rev.D  
Rev_1.0  
WCDMA  
C154  
1.5p  
Rev.D  
+VPWR  
+VPWR  
FL102  
EFCH1950TDF1  
4
5
C155  
4.7u  
C158  
C159  
15p  
O1 G3  
1
L122  
NA  
C157  
10nH  
IN  
15p  
L404  
1.8nH  
G2 G1  
TP3  
3
2
WS2512_TR1G  
VCC2  
U103  
VCC1  
10  
1
2
3
4
5
9
FL104  
PGND  
ANT  
L123  
1nH  
GND4  
RFOUT  
RFIN  
GND1  
4
3
1
2
Rev_1.0  
RX  
TX  
C162  
3.3p  
8
ACMD-7602  
7
6
11  
GND3  
GND2  
BGND  
VCONT  
VREF  
PA_R0  
C164  
0.5p  
C165  
1p  
0.5p  
L125  
TP4  
TR100  
KRX102U  
20dB  
U102  
PA_ON  
VREG_TCXO_2.85V  
CP0402A1950DNTR  
Rev.B  
PWR_DET  
R120  
47  
7dB  
C192  
100p  
C170  
0.1u  
R121  
130  
R122  
130  
For testing, Max power of UMT 2100 is needed.  
- 81 -  
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4. TROUBLE SHOOTING  
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4. TROUBLE SHOOTING  
4.6.2 Checking UMTS PAM Control Block  
• PAM control signal  
1. PWR_DET : UMTS Tx Power Detected value (Check R120)  
2. TX_AGC_ADJ : UMTS RTR6275 Tx Amp Gain Control  
3. VREG_TCXO_2.85V : UMTS PAM enable (C170) (about 2.85V)  
4. +VPWR : UMTS PAM Main Voltage ( 3V < +VPWR < 4.2V)  
5. PA_ON : Turns the PA on and off  
6. PA_R0 : Control signals that step the active PA mode and bias  
+VPWR  
VREG_TCXO_2.85  
PWR_DET  
- 83 -  
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4. TROUBLE SHOOTING  
4.6.3 Checking RF Rx Level  
TP1  
TP2  
TP4  
Vbias  
TP3  
ANT101 ANT102  
TP1  
C450  
22p  
C101  
56p  
SW100  
RF  
G2  
G1  
ANT  
KMS-507  
1p  
C437  
C102  
NA  
L101  
NA  
L102  
100nH  
U500  
Vbias  
TP2  
TP4  
Rev_1.0  
WCDMA  
VDD_RX  
C154  
1.5p  
Rev.D  
C156  
100p  
L121  
1nH  
+VPWR  
+VPWR  
FL102  
EFCH1950TDF1  
4
5
C155  
4.7u  
C158  
15p  
C159  
15p  
O1 G3  
1
L122  
NA  
C157  
10nH  
IN  
L404  
1.8nH  
G2 G1  
3
2
WS2512_TR1G  
VCC2  
U103  
VCC1  
Rev.D  
Rev.D  
10  
1
9
2
L409  
4.7nH  
C444  
2.2p  
FL104  
L123  
1nH  
GND4  
RFIN  
C161  
2.2p  
4
3
1
2
Rev_1.0  
PGND  
ANT  
RX  
TX  
C162  
3.3p  
8
3
RFOUT  
GND1  
ACMD-7602  
7
4
GND3  
6
VCONT  
PA_R0  
C164  
0.5p  
C165  
1p  
GND2  
11  
5
5
4
0.5p  
L125  
BGND  
VREF  
G2 O2  
L411  
4.7nH  
1
FL103  
EFCH2140TDE1  
IN  
G1 O1  
TR100  
KRX102U  
TP3  
20dB  
2
3
C445  
2.2p  
L410  
L408  
10nH  
U102  
CP0402A1950DNTR  
4.7nH  
PA_ON  
Rev.B  
VREG_TCXO_2.85V  
PWR_DET  
R120  
47  
7dB  
C192  
100p  
C170  
0.1u  
R121  
130  
R122  
130  
L128  
1.8nH  
C174  
10p  
Rev.D  
L407  
2.7nH  
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4. TROUBLE SHOOTING  
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4. TROUBLE SHOOTING  
4.7 Checking GSM Block  
1
2
3
- 86 -  
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4. TROUBLE SHOOTING  
4.7.1 Checking RF Tx level  
TP1  
TP3  
TP2  
4.7.2 Schematic of RF Tx level  
C101  
SW100  
56p  
G2  
ANT  
RF  
G1  
KMS-507  
C102  
NA  
L102  
100nH  
TP1  
Rev.C  
U500  
Rev.D  
L108  
15nH  
19  
5
6
1
2
3
4
9
VDD  
GSM900_RX1  
GSM900_RX2  
GSM1800_RX1  
GSM1800_RX2  
GSM1900_RX1  
GSM1900_RX2  
WCDMA2100  
C117  
10p  
7
8
GND1  
GND2  
GND3  
GND4  
GND5  
GND6  
GND7  
GND8  
GND9  
GND10  
10  
12  
13  
15  
17  
20  
21  
23  
1K  
1K  
R100  
R101  
18  
22  
D5011  
CTRL1  
CTRL2  
ANT_SEL0  
ANT_SEL1  
16  
14  
GSM900_TX  
GSM18001900_TX  
C110  
33p  
C109  
33p  
Rev.D  
C123  
0.01u  
C121  
33u  
C124  
100p  
L403  
1.5nH  
L116  
10nH  
L115  
18nH  
C134  
0.01u  
C441  
5.6p  
C438  
100p  
C137  
NA  
C138  
NA  
C139  
68p  
15  
3
DCS_PCS_OUT  
EGSM_OUT  
DCS_PCS_IN  
TP2  
11  
19  
21  
4
EGSM_IN  
ENABLE  
BS  
U101  
18  
1
RSVD_GND  
P_GND  
SKY77318  
TP3  
- 87 -  
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4. TROUBLE SHOOTING  
4.7.3 Checking RF Tx level  
- 88 -  
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4. TROUBLE SHOOTING  
4.7.4 Checking PAM Block  
TP1. GSM_PA_RAMP : Power Amp Gain Control. typically, 0.2V < Vramp < 1.6V  
TP2. GSM_PA_EN : Power Amp Enable  
(Power ON : higher than 1.25V , Power OFF : lower than 0.4V)  
TP3. GSM_PA_BAND : Power Amp Band Selection Control  
(GSM Mode : -0.2V < VBS < 0.4V , DCS/PCS Mode : 1.25V < VBS < 3.0V)  
TP4. +VPWR : PAM Supply Voltage Vcc higher than 3.0V  
TP1  
TP4  
TP2  
TP3  
TP4  
EGSM  
+VPWR  
Rev.D  
C123  
0.01u  
C121  
33u  
4
p
L403  
1.5nH  
L116  
10nH  
TP1  
C134  
0.01u  
C438  
100p  
C136  
0.01u  
TP3  
C138  
NA  
C139  
68p  
FL1  
15  
3
DCS_PCS_OUT  
EGSM_OUT  
DCS_PCS_IN  
EGSM_IN  
ENABLE  
11  
19  
21  
4
U101  
R113 100ohm  
18  
1
RSVD_GND  
P_GND  
GSM_PA_EN  
EFC  
C149  
15p  
SKY77318  
BS  
R117 100ohm  
GSM_PA_BAND  
C153  
15p  
TP2  
Schematic of GSM PAM Block  
- 89 -  
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4. TROUBLE SHOOTING  
4.7.5 Checking RF Rx Block  
TP1. DCS RX INPUT  
TP2. PCS RX INPUT  
TP3. GSM RX INPUT  
TP1  
TP3  
TP2  
L102  
100nH  
Rev.C  
Rev.C  
C439  
C440  
5p  
5p  
U500  
19  
5
6
1
2
3
4
9
VDD  
GSM900_RX1  
GSM900_RX2  
GSM1800_RX1  
GSM1800_RX2  
GSM1900_RX1  
GSM1900_RX2  
WCDMA2100  
C105  
NA  
TP1  
0.5p  
C190  
DCS  
7
8
GND1  
GND2  
GND3  
GND4  
GND5  
GND6  
GND7  
GND8  
GND9  
GND10  
10  
12  
13  
15  
17  
20  
21  
23  
C442 5.6p  
C443 5.6p  
1K  
1K  
R100  
R101  
18  
22  
D5011  
CTRL1  
CTRL2  
ANT_SEL0  
ANT_SEL1  
C116  
NA  
NA  
C191  
TP2  
PCS  
16  
14  
GSM900_TX  
GSM18001900_TX  
C110  
33p  
C109  
33p  
L405 2.7nH  
C120  
NA  
TP3  
L111  
5.6nH  
EGSM  
+VPWR  
Rev.D  
C123  
0.01u  
C121  
33u  
L406  
2.7nH  
C124  
100p  
L403  
1.5nH  
L116  
10nH  
L115  
18nH  
Schematic of GSM900/DCS/PCS Rx Block  
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4. TROUBLE SHOOTING  
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4. TROUBLE SHOOTING  
4.8 Checking Bluetooth Block  
Test Point of the Bluetooth Block  
TP2  
TP1. VREG_BT_2.85V  
TP2. VREG_MSMP_2.7V  
TP3. TCXO_BT  
TP1  
TP3  
TP4. BT ANT Output  
TP4  
Test Point of the Bluetooth Block  
TP4  
BLUETOOTH  
ACS2450HBAXX  
NC1  
NC2  
R118  
FEED  
0
L126  
NA  
ANT103  
TP2  
M100  
LBRQ-2B43A  
C171  
1000p  
9
3
4
11  
12  
BT_CLK  
CLK_REF  
VCC_OUT  
SBST  
SBCK  
SBDT  
BT_SBST  
BT_SBCK  
BT_SBDT  
C172  
C173  
1u  
2.2u  
2
5
VDD_INT  
VDD_MSM  
VDD_BAT  
SYNC_DET_TX_EN  
RX_BB_TX_BB  
XTAL_IN  
BT_TX_RX_N  
BT_DATA  
R123  
0
10  
14  
13  
7
VREG_MSMP_2.7V  
VREG_BT_2.85V  
TCXO_BT  
1000p C176  
TP3  
TP1  
Schematic of the Bluetooth Block  
- 92 -  
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4. TROUBLE SHOOTING  
Start  
NO  
TP1,TP2  
Change the Main board  
Signals exits?  
YES  
NO  
TP3  
Change the X100  
Change the M100  
Is clock ok? 19.2M  
YES  
NO  
TP4  
Signals exits?  
YES  
Change the Main board  
- 93 -  
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4. TROUBLE SHOOTING  
4.9 Power ON Troubleshooting  
Power On sequence of U250/KU250 is :  
PWR key press → PM_ON_SW_N go to low, PM6650 KPDPWR_N (pin24) → PM6650 Power Up →  
VREG_MSMC_1.2V, VREG_MSME_1.8V, VREG_MSMP_2.7V, VREG_MSMA_2.6V,  
VREG_TCXO_2.85V power up and system reset assert to MSM6245 → Phone booting and  
PS_HOLD assert to PMIC  
Start  
NO  
Change or charging the  
Battery voltage. higher  
Battery  
than 3.20V?  
YES  
NO  
Check the Key Dome  
Key press?  
YES  
NO  
VREG_MSMC_1.2V,VREG_MSMP_2.7V,  
VREG_MSME_1.8V, VREG_TCXO_2.85V,  
VREG_MSMA_2.6V power up?  
Change the Main board  
Check the TXCO  
YES  
NO  
Is clock ok?  
R306 : 19.2M  
X300 : 32.768Khz  
YES  
Change the Main board  
- 94 -  
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4. TROUBLE SHOOTING  
VREG_MSMC  
VREG_MSME  
VREG_MSMP  
X300 : 32.768Khz  
R306 : 19.2Mhz  
VREG_MSMA  
[U250/KU250 Main PCB BOTTOM]  
- 95 -  
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4. TROUBLE SHOOTING  
4.10 Charger Troubleshooting  
CHARGER  
ICHARGEOUT  
+VPWR  
R313  
USB_VBUS  
0.1  
6
1
5
2
4
Q300  
QST4  
VBATT  
B
3
C1  
C2  
USB_CTL_N  
+5V_PWR  
BATT_FET_N  
6
1
5
2
4
Q302  
QST4  
B
3
C1  
C2  
CHG_CTL_N  
ICHARGE  
Differential lines, route as equal length as possible !! --> ICHARGE , ICHARGEOUT  
Charging Procedure  
- Connect TA or USB Cable  
- Control the charging current by PM6650 IC  
- Charging current flows into the battery  
Troubleshooting Setup  
- Connect TA and battery to the phone  
Check Point  
- Connection of TA or USB Cable  
- Charging current path  
- Battery  
Troubleshooting Procedure  
- Check the charger (TA or USB Cable) connector  
- Check the charging current Path  
- Check the battery  
- 96 -  
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4. TROUBLE SHOOTING  
Start  
Check the pin and battery  
Connect terminals of I/O  
connector  
NO  
Connection OK?  
Yes  
Change I/O connector  
NO  
Change TA  
Is the TA (or USB Cable)  
voltage 5.1V (or 5.0V)?  
(or USB Cable)  
Yes  
Yes  
Is it charging properly  
After turning on Q301(or Q302)  
, Q302?  
END  
NO  
Change the board  
[ Charger Troubleshooting Flow ]  
- 97 -  
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4. TROUBLE SHOOTING  
Q302  
Q300  
R313  
Q301  
[ Charging part ( Main PCB Front ) ]  
- 98 -  
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4. TROUBLE SHOOTING  
4. BB Trouble Shooting  
4.11 USB Troubleshooting  
USB Initial sequence of U250/KU250 is :  
USB connected to U250/KU250 power on → USB_VBUS(Q300) go to 5V → USB_D+ go to 3.3V →  
USB_DAT is triggered → USB work.  
Start  
NO  
Power is on?  
YES  
Go to power on trouble shooting  
Insert cable  
NO  
NO  
NO  
Cable is inserted?  
YES  
Q400 pin 4 is 5V?  
Check Q300 (pin 4)  
Check VA401  
YES  
USB_D+ is 3.3V?  
YES  
Change the Main board  
- 99 -  
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4. TROUBLE SHOOTING  
4.12 SIM Detect Troubleshooting  
USIM Initial sequence of U250/KU250 is :  
USIM_CLK,USIM_RST,USIM_DATA triggered → VREG_UIM_2.85V go to 2.8V → USIM IF work  
Start  
Re-insert the SIM card  
Yes  
End  
Work well?  
No  
NO  
VREG_UIM_2.85V is 2.85V?  
USIM_P_CLK is run?  
Check J300  
YES  
Change SIM card  
Yes  
End  
Work well?  
No  
Change the Main board  
- 100 -  
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4. TROUBLE SHOOTING  
7
5
6
2
VREG_USIM_2.85V  
USIM_P_RST_N  
1
2
3
7
USIM_P_CLK  
USIM_P_DATA  
3
1
15K  
R317  
J300  
USIM  
HSSC-8P-18  
1
5
6
GND1  
VPP  
IO  
VCC  
RST  
CLK  
VREG_USIM_2.85V  
USIM_P_RST_N  
USIM_P_CLK  
2
7
3
USIM_P_DATA  
8
9
4
11  
12  
RSV2 RSV1  
GND2 GND5  
GND3 GND4  
10  
L302  
56nH  
Figure. USIM part schematics  
- 101 -  
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4. TROUBLE SHOOTING  
4.13 Camera Troubleshooting  
Camera control signals are generated by MSM6245.  
4.13.1 MEGA CAMERA  
Start  
Check the camera connector and  
reconnect the camera  
Yes  
Camera is OK?  
NO  
END  
NO  
NO  
Change the Main board  
Yes  
Check the CAM_MCLK  
Change the Main board  
Yes  
Change the camera  
Yes  
Camera is OK  
END  
NO  
Change the Main board  
- 102 -  
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4. TROUBLE SHOOTING  
4.13.2 VGA CAMERA  
Start  
Check the camera connector and  
reconnect the camera  
Yes  
NO  
NO  
Camera is OK?  
NO  
END  
Change the Main board  
Yes  
Check the CAM_MCLK  
Change the Main board  
Yes  
Change the camera  
Yes  
Camera is OK  
END  
NO  
Change the Main board  
- 103 -  
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4. TROUBLE SHOOTING  
C350  
C447  
C347  
U501  
C348  
U303  
C349  
CAMERA LDO  
U303 RT9011-MGPQW  
1
2
3
4
8
7
6
5
+VPWR  
CAM_LDO_EN  
VIN  
VOUT1  
VOUT2  
NC2  
VREG_CAM_AVDD_2.8V  
VREG_CAM_DVDD_1.8V  
EN1  
EN2  
NC1  
C347  
1u  
GND  
C348  
1u  
C349  
1u  
+VPWR  
CAM_LDO_EN  
VIN  
VOUT  
VREG_CAM_DVDD_1.5V  
3
2
1
4
6
5
GND BGND  
STBY  
U501  
BH15LB1WHFV  
NC  
C350  
1u  
C447  
1u  
REV_D  
- 104 -  
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4. TROUBLE SHOOTING  
4.14 Keypad Backlight Troubleshooting  
Key Pad Back Light is on as below :  
Key pressing → KYBD_BACKLIGHT go to 0V → MAIN Key Backlight LED On  
Start  
Key press  
NO  
+VPWR is above 3.2V?  
Check battery  
Yes  
Yes  
NO  
KYBD_BACKLIGHT is 0V ?  
Change the Main board  
Yes  
YES  
END  
Backlight LED ON?  
No  
Change the Main board  
+VPWR  
KEY_BACK_LIGHT LED(8EA)  
+VPWR  
LD400 LEBB-S14H  
LD402  
LD405  
LEBB-S14H  
LEBB-S14H  
LEBB-S14H  
R411  
100ohm  
R414  
100ohm  
R417  
R413 100ohm  
R416 100ohm  
R419 100ohm  
LD403 LEBB-S14H  
LD406 LEBB-S14H  
LD404 LEBB-S14H  
LD407 LEBB-S14H  
R415  
100ohm  
LD408  
R418  
100ohm  
100ohm  
REV_B : EDLH0013501 --> EDLH0006001  
KYBD_BACKLIGHT  
Figure.Keypad backlight LED part  
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4. TROUBLE SHOOTING  
4.15 Main LCD Troubleshooting  
Main LCD control signals are generated by MSM6245. The signal path is :  
MSM6245 → CN400 → LCD Module  
Start  
Press END key  
NO  
Key LED is on?  
Yes  
GO to power on trouble shooting  
Disconnect and reconnect  
The LCD connector  
Yes  
LCD display OK?  
END  
END  
No  
Change the LCD module  
Yes  
LCD display OK?  
No  
Change the Main board  
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4. TROUBLE SHOOTING  
4.16 Receiver Path  
MSM6245 EAR1ON/EAR1OP → R421,R422 → Analog Switch(U401) → Receiver  
Start  
Connect the phone to network  
Equipment and setup call  
Setup 1KHz tone out  
YES  
Can you hear the tone?  
END  
NO  
YES  
The sine wave appears at  
L401, L402?  
Change receiver  
NO  
YES  
The sine wave appears at  
R421, R422?  
Check the analog switch  
NO  
Change the Main board  
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4. TROUBLE SHOOTING  
R421  
R422  
U401  
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4. TROUBLE SHOOTING  
4.17 Headset path  
MSM6245 HPH_R, HPH_L → C402/C401 → R407/R406 → CN401 (MMI Connector)  
Start  
Connect the phone to network  
equipment and setup call.  
Setup 1KHz tone out  
and insert headset.  
YES  
END  
Can you hear the tone?  
NO  
YES  
Sine wave appears at  
R407/R406?  
Change the Headset  
NO  
Change the Main board  
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4. TROUBLE SHOOTING  
CN401  
R406  
C401  
C402  
C407  
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4. TROUBLE SHOOTING  
4.18 Speaker phone path  
MSM6245 LINE_P,LINE_N → R429/R427, C423/C422, R431/R426 → Audio AMP(U402) → Analog  
Switch(U401) → Speaker  
Start  
Connect the phone to network  
equipment and setup call  
Setup 1KHz tone out  
YES  
END  
Can you hear the tone?  
NO  
Sine wave appears at  
R429/R427 and C423/C422  
And R431/R426 ?  
NO  
NO  
Change the Main board  
YES  
Change the Main board  
2.6V?  
SPK_AMP_EN is  
YES  
NO  
The sine wave appears at  
SPK+, SPK- ?  
Change the Audio Amp  
Change speaker  
YES  
YES  
The sine wave appears at  
SPK_RCV-,SPK_RCV+?  
NO  
Change the Main board  
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4. TROUBLE SHOOTING  
Analog Switch  
SPK+  
Audio Amp  
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4. TROUBLE SHOOTING  
4.19 Main microphone  
MIC400 → MIC1P, MIC1N (MSM6245)  
Start  
Make a call  
NO  
MIC_BIAS(C416)  
is 1.8V  
Change main board  
YES  
Make sound to MIC  
NO  
NO  
Sine wave appears at  
C418/C419?  
Change the MIC  
Work well?  
YES  
YES  
Change the Main board  
END  
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4. TROUBLE SHOOTING  
R424  
C417  
MIC400  
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4. TROUBLE SHOOTING  
4.20 Headset microphone  
Headset → C210/C211 → MIC2P, MIC2N (MSM6245)  
Start  
Make a call  
OK  
Change the headset and retry  
END  
YES  
NO  
NO  
Change the MAIN board  
HOOK_KEY is detected?  
Yes  
NO  
MICBIAS is biased  
Change the MAIN board  
by 1.8V?  
Yes  
NO  
Sine wave appears at  
Change the headset or  
Main board and retry.  
C210/C211 ?  
Yes  
Change the Main board  
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4. TROUBLE SHOOTING  
Ear_Sense_N  
MIC Input  
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4. TROUBLE SHOOTING  
4.21 Vibrator  
The Vibrator is connected between +VPWR and VIB_DRV_N (PM6650 25 pin).  
The Vibrator motor driver is an SBI-programmable voltage out that is reference to +VPWR.  
Start  
Operate the Vibrator  
Yes  
Work well?  
NO  
End  
Change vibrator  
or PM6650  
+VPWR  
TP400  
TP401  
L400  
56nH  
MOTOR_PWR-  
D400  
RB521S-30  
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4. TROUBLE SHOOTING  
MOTOR_PWR-  
+VPWR  
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5. DOWNLOAD  
5. DOWNLOAD  
5.1 U250/KU250 DOWNLOAD  
5.1.1 Introduction  
LGMDP is a LGE application that allow users to download images from PC to handset. LGMDP is a  
download tool with capabilities to upload image files to the handset. LGMDP is designed to be simple  
to use and easy enough for the beginner to upload executable images to the handset. LGMDP  
supports Windows 2000/XP where the LG (Ver 4.6 or later) USB modem driver is installed.  
Additionally, LGMDP allows multi downloading up to 9 handsets at the same time.  
5.1.2 Downloading Procedure  
• Connect the phone to your desktop PC using the USB cable and run the LGMDP application.  
Before getting started, set up LGMDP preferences from the Preferences of the file menu the way  
you want. Click on the File menu and select Preferences.  
➢ Play a success sound  
It will be played a .wav file when the download has been completed. To enable this simply check  
the box.  
➢ Always on Top  
Check if LGMDP always appears at the top of the window so that user can monitor it all the time.  
➢ Automatically run Select Port When LGMDP starts  
When LGMDP starts, it will automatically select Select Port button to download new image file.  
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5. DOWNLOAD  
5.1.2.1 Connecting to PC  
• Click on the Select Port and then Select Port window will be pop up. Check if state shows Enable  
for the port to be connected for downloading images. Then click on the Connect button. (The port  
number(COM7) shall be different from that of the port number in the snapshot.)  
• The status Ready is displayed when the application is ready for downloading. While the images are  
transmitted from PC to the handset, a progressive bar (Red box) indicating the degree of  
transmission of data is displayed.  
U250/KU250  
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5. DOWNLOAD  
1) Image Folder indicates loot path where all image files are placed. To change location of the default  
image path, select Browse… button. The edit box shows the file path where images are located.  
Please note that all images should be located in a selected folder.  
2) Click on the Browse… button to select image files to be downloaded on the handset.  
3) NV Backup/Restore: NV Backup/Restore always have to be done, and it is default selected option.  
Backup the NV data and restore the backed up NV data automatically.  
U250/KU250  
1)  
2)  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
3)  
5)  
4)  
6)  
7)  
4) Reset database & Contents:  
User related data including the setting data on the EFS is reset in the handset. The user contents in  
the handset will be erased. If you want to reset all the user data back to the way they were before  
you started downloading new images, check the option.  
Erase_EFS:  
The calibration data, user contents, media, and module are erased. Only calibration data is kept  
when NV backup/restore is checked. The user contents and file system physically are wiped out.  
Keep All Contents  
Maintain user data including WAP, AD, DRM, E-mail, Play lists, and images when downloading a  
new S/W images. User data stated above are maintained if this option is selected.  
5) Additional Options:  
Display Information is defaultly not selected and user cannot choose. Override partition table is also  
also defaultly not selected and user cannot choose.  
6) Clear: Clearing all directory paths of images in the dialog.  
7) Start: Starting downloading the selected individual image.  
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5. DOWNLOAD  
5.1.2.2 Choosing image files  
• Select the image folder, where all the image files are located, by clicking on the Browse…. (The  
folder name shall be different from that of the folder name in the snapshot. The folder name  
indicates the path where the image files are located.)  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
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5. DOWNLOAD  
• Select the path on the Image Folder by clicking on the Browse..., then the LGMDP will automatically  
load images accordingly. Also you can select images by manually. For instance, select the path of  
AMSS Modem Image file by clicking on the Browse… button. The selected AMSS image will be  
downloaded to the handset from the path directory in the PC. Make sure that you have chosen  
correct file. In case of wrong AMSS Modem file is file is selected, the phone may not work.  
(The file name shall be different from that of the file name in the snapshot.)  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
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5. DOWNLOAD  
• If NV restore is failed, then the NV Data(*.nv2) is erased permanently. In this case, choose the  
desired NV file to be downloaded on the handset. To enable this simply check the box or select the  
NV file from the LGMDP installation directory by clicking on the Browse… button.  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
• Click on the START button to start downloading. A summary of the selected images and option  
information window will be displayed. Click on the No button if this is not the setting you are  
downloading for. Otherwise click on the Yes button to continue downloading selected image file  
with options.  
Yes  
No  
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5. DOWNLOAD  
5.1.2.3 Downloading  
• This message box informs that a new file for  
NV backup will be created in the displayed  
file name in the LGMDP installation  
directory.  
NV_U250/KU250  
• Backing up NV data and backed up NV data  
will be stored in the LGMDP installation  
directory.  
U250/KU250  
• Erasing the existing directories and files  
before the Module image is downloaded.  
U250/KU250  
• Downloading the AMSS modem image  
U250/KU250  
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5. DOWNLOAD  
• Rebooting the handset and re-establishing  
the connection  
• Restoring NV data which backed up in the  
Backing up process. User can also restore  
NV data using NV Default image selection.  
U250/KU250  
• Rebooting the handset and re-establishing  
the connection  
• Erasing the existing directories and files  
before downloading the selected Media  
image  
U250/KU250  
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5. DOWNLOAD  
• Downloading Media image in progress  
U250/KU250  
• Downloading Module image in progress  
U250/KU250  
• Downloading process has completed  
successfully  
U250/KU250  
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5. DOWNLOAD  
5.1.2.4 Tools  
• Device Manager allows to monitor current hardware that is installed on your PC. Device Manager is  
designed to monitor USB connectivity and check where the COM has been installed . Select Device  
Manager from the Tools of the file menu.  
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5. DOWNLOAD  
5.1.3 Troubleshooting Download Errors  
1) When the phone does not work after downloading has been completed.  
2) Media Erasing Error  
3) NV Restore Error  
5.1.3.1 When the phone does not work  
• Reboot the phone in the emergency mode (Simultaneously press 2, 5, and PWR red keys) and  
then try to download all the images up to AMSS. In the emergency mode, you can not download  
media or module image.  
The phone supports a special mode called emergency mode. In this mode, minimum units for  
downloading is running so that users can download the images again in case of emergency  
situation. (AMSS modem, Media, and Module images can not be running in this mode.)  
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5. DOWNLOAD  
• The below dialog shows parameters of Select Port when phone is booted in Emergency mode.  
Click on the Connect button to continue.  
U250/KU250  
• Choose Image file after clicking on the Browse… button. Make sure that you have chosen the right  
image file. After choosing valid images, then click on the Start button to start downloading selected  
images. The selected image will be downloaded to the handset from the path directory in the PC.  
After downloading images successfully, it will boot to normal mode.  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
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5. DOWNLOAD  
5.1.3.2 NV Restore Error  
• Snapshot showing the NV Restore error. Next slide shows the remedial procedure to adopt.  
U250/KU250  
• Connect the handset and Press the Connect button in the Select Port window. (Enable state in the  
window indicates that the Phone has been detected and is ready to download.)  
U250/KU250  
U250/KU250  
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5. DOWNLOAD  
• Click on Browse… . Select the LGMDP installation directory and a list of NV Backup files(*.nv2) will  
be shown. These nv files were saved every time NV Backup option was selected, and the name of  
the nv file is determined based on the time when NV Backup was done. Choose the desired NV file  
to be downloaded on the handset, and click on Start.  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
U250/KU250  
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5. DOWNLOAD  
5.1.4 Caution  
1) Multi-downloading using the USB hub is not recommendable.  
2) If you see the message ‘cal mode’ after ‘completing download’, you must do NV restore  
and image (media and module) download.  
3) The NV data saved at LGMDP folder as following format.  
D:\LGMDP\004400-01-429926\_COM14_  
LGMDP folder name  
Port number  
IMEI number  
4) Recommended that the Module and Media Image have to be downloaded at the same  
time.  
5) Erase EFS option will erase everything (media, module, nv items, and user data) in the  
EFS area.  
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6. BLOCK DIAGRAM  
6. BLOCK DIAGRAM  
6.1 GSM & UMTS RF Block  
[Fig 2.1] U250/KU250 RF Functional Block Diagram  
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6. BLOCK DIAGRAM  
[Table 2.1] RF Block Component  
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6. BLOCK DIAGRAM  
6.2 Interface Diagram  
6.2.1 RTR6275 & MSM6245 Interface Diagram  
[Fig 2.2] RTR6275 & MSM6245 Interface Diagram  
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6. BLOCK DIAGRAM  
6.2.2 Memory Interface  
ADDRESS[14:0]  
[Fig 2.3] Memory Interface Diagram  
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6. BLOCK DIAGRAM  
6.2.3 USB,UART,SIM,JTAG Interface  
[Fig 2.4] USB, UART, SIM, JTAG Interface  
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6. BLOCK DIAGRAM  
Main RF signal  
Control signal  
Control signal  
UMTS PA_CTL signal  
PA_R0  
Description  
Comment  
UMTS Tx High/Low Power Control  
GSM PA_CTL signal  
GSM_PA_BAND  
GSM_PA_EN  
DCS or PCS /GSM Mode Selection  
Power Amp Gain Control Enable  
Power Amp Gain Control  
GSM_PA_RAMP  
UMTS,  
GSM900Tx/Rx,  
DCS Tx/Rx,  
PCS Tx/Rx  
ANT_SEL 0,1  
Ant Switch Module Mode Selection  
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6. BLOCK DIAGRAM  
6.2.4 Placement  
*Top Side  
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6. BLOCK DIAGRAM  
*Bottom Side  
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7. CIRCUIT DIAGRAM  
1
2
3
4
5
14  
15  
16  
ANT_SEL0 ANT_SEL1  
ANT101 ANT102  
GSM 1800/GSM 1900 RX  
GSM 850/ GSM 900 RX  
LOW  
HIGH  
LOW  
LOW  
C450  
22p  
C101  
56p  
SW100  
G2  
A
B
C
D
E
F
GSM 850/GSM 900 TX/ WCDMA  
GSM 1800/GSM 1900 TX  
LOW  
HIGH  
HIGH  
HIGH  
A
B
C
D
E
F
ANT  
RF  
G1  
KMS-507  
1p  
C437  
C102  
NA  
L101  
NA  
L102  
100nH  
TX_IP  
C103  
180p  
Rev.C  
C104  
180p  
Rev.C  
C439  
C440  
5p  
5p  
U500  
Rev.D  
TX_IM  
L108  
15nH  
Rev.C  
C106 8.2p  
19  
5
6
1
2
3
4
9
55  
2
1
VDD  
GSM900_RX1  
C105  
NA  
ENV_OUT  
ENV_LNP  
ENV_LNN  
TX_QP  
VREG_RF_SMPS  
0.5p  
C190  
GSM900_RX2  
GSM1800_RX1  
GSM1800_RX2  
GSM1900_RX1  
GSM1900_RX2  
WCDMA2100  
C108  
180p  
DCS  
46  
44  
C117  
10p  
HB_RF_OUT1  
HB_RF_OUT2  
Rev.B  
51  
50  
53  
52  
TX_IP  
TX_IN  
TX_QP  
TX_QN  
DCS_PCS_TX  
GSM_TX  
C107  
C112  
6p  
7
8
C113  
180p  
GND1  
GND2  
GND3  
GND4  
GND5  
GND6  
GND7  
GND8  
GND9  
GND10  
43  
42  
LB_RF_OUT1  
LB_RF_OUT2  
12p  
10  
12  
13  
15  
17  
20  
21  
23  
TX_QM  
C442 5.6p  
C443 5.6p  
1K  
R100  
R101  
18  
22  
24  
56  
54  
14  
7
D5011  
CTRL1  
CTRL2  
TX_ON  
RF_ON  
TCXO  
RTR6275_TCXO  
ANT_SEL0  
ANT_SEL1  
1K  
C114 3300p  
5
18  
C116  
NA  
TX_AGC_ADJ  
VCONTROL  
DAC_REF  
SBDT  
VTUNE1  
VTUNE2  
C115 1000p  
NA  
C191  
PCS  
16  
14  
VTUNE-Connected directly to GND  
GSM900_TX  
GSM18001900_TX  
DAC_REF  
12  
13  
C110  
33p  
C109  
33p  
C118  
12p  
RX_IP  
RX_IN  
RX_IP  
RX_IM  
U100  
RTR6275  
(1%)  
R103 12K  
3
27  
10  
11  
R_BIAS1  
R_BIAS2  
RX_QP  
RX_QN  
RX_QP  
RX_QM  
L405 2.7nH  
C120  
NA  
(1%)  
22p  
R104 680  
C119  
SSBDT_RTR  
40  
21  
PWD_DET_IN  
TEST  
PWR_DET  
Rev.D  
L111  
31  
30  
Rev.B  
GCELL_INP  
GCELL_INN  
EGSM  
5.6nH  
R105  
5.1  
+VPWR  
Rev.D  
4
R433  
R434  
2.7  
VDDA1  
VDDA2  
VDDA3  
VDDA4  
VDDA5  
VDDA6  
VDDA7  
VDDA8  
VDDA9  
VDDA10  
VDDA11  
VDDA12  
VDDA13  
VDDA14  
32  
33  
6
C123  
0.01u  
C121  
33u  
EGSM_INP  
EGSM_INN  
VREG_RF_SMPS  
8
2.7  
5.1  
L406  
2.7nH  
C124  
100p  
L403  
9
R106  
1.5nH  
L116  
10nH  
38  
39  
15  
16  
19  
20  
28  
41  
45  
47  
48  
49  
L115  
18nH  
C122  
22u  
DCS_INP  
DCS_INN  
L114  
47nH  
36  
37  
GPCS_INP  
GPCS_INN  
C189  
22p  
Rev.C  
C134  
0.01u  
C441  
5.6p  
C438  
100p  
22  
23  
8.86dB Rev.1.0  
R108  
CAL_INP  
CAL_INN  
C136  
0.01u  
L119  
47nH  
C137  
NA  
C138  
NA  
C139  
68p  
DCS_PCS_TX  
VREG_SYNTH_2.6V  
26  
51  
WLNA_IN  
VDD_RX  
FL101  
R109 10  
L120  
47nH  
15  
3
7.5dB  
R112  
DCS_PCS_OUT  
EGSM_OUT  
DCS_PCS_IN  
VREG_RF_SMPS  
4
5
O1 G3  
IN  
G2 G1  
1
11  
19  
21  
4
EGSM_IN  
ENABLE  
BS  
GSM_TX  
U101  
39  
R113 100ohm  
3
2
18  
1
RSVD_GND  
P_GND  
GSM_PA_EN  
C149  
15p  
SKY77318  
Rev.D  
EFCH897MTDB1  
R116  
100ohm  
Rev.D  
VREG_MSMP_2.7V  
R117 100ohm  
C150  
1000p  
C151  
22p  
C152  
0.01u  
GSM_PA_BAND  
GSM_PA_BAND  
LOW  
MODE  
C153  
15p  
GSM  
DCS/PCS  
HIGH  
GSM/EDGE  
WCDMA  
Rev_1.0  
VDD_RX  
C154  
1.5p  
Rev.D  
C156  
100p  
L121  
1nH  
+VPWR  
+VPWR  
FL102  
EFCH1950TDF1  
4
5
C155  
C158  
15p  
C159  
15p  
O1 G3  
1
4.7u  
L122  
NA  
C157  
10nH  
IN  
L404  
1.8nH  
G2 G1  
3
2
WS2512_TR1G  
U103  
VCC1  
Rev.D  
Rev.D  
10  
1
2
3
4
5
VCC2  
9
L409  
4.7nH  
C444  
2.2p  
FL104  
L123  
1nH  
GND4  
RFIN  
GND1  
C161  
2.2p  
4
3
1
2
Rev_1.0  
PGND  
ANT  
RX  
TX  
C162  
3.3p  
8
RFOUT  
ACMD-7602  
7
GND3  
6
VCONT  
VREF  
PA_R0  
C164  
0.5p  
C165  
1p  
GND2  
11  
5
4
0.5p  
L125  
BLUETOOTH  
BGND  
G2 O2  
L411  
4.7nH  
1
FL103  
EFCH2140TDE1  
IN  
G1 O1  
TR100  
20dB  
2
3
ACS2450HBAXX  
NC1  
KRX102U  
C
D
E
F
C
D
E
C445  
L410  
L408  
10nH  
R118  
2.2p  
U102  
CP0402A1950DNTR  
4.7nH  
FEED  
NC2  
0
PA_ON  
L126  
NA  
ANT103  
Rev.B  
VREG_TCXO_2.85V  
M100  
LBRQ-2B43A  
PWR_DET  
R120  
47  
7dB  
C192  
100p  
C170  
0.1u  
R121  
130  
R122  
130  
C171  
1000p  
9
4
BT_CLK  
CLK_REF  
SBST  
SBCK  
SBDT  
BT_SBST  
BT_SBCK  
BT_SBDT  
11  
12  
C172  
C173  
1u  
3
VCC_OUT  
2.2u  
2
5
L128  
1.8nH  
C174  
10p  
VDD_INT  
VDD_MSM  
VDD_BAT  
SYNC_DET_TX_EN  
RX_BB_TX_BB  
XTAL_IN  
BT_TX_RX_N  
BT_DATA  
R123  
10  
14  
13  
7
VREG_MSMP_2.7V  
VREG_BT_2.85V  
0
Rev.D  
TCXO_BT  
1000p C176  
L407  
2.7nH  
TCXO  
X100  
DSA321SCE-19.2M  
NC3  
NC4  
NC2  
NC1  
7
8
6
5
VREG_TCXO_2.85V  
OUTPUT GND  
3
4
2
100ohm  
R124  
VCC  
VCONT  
TRK_LO_ADJ  
1
19.2MHz  
Section  
Date  
Sign & Name  
Sheet/  
Sheets  
MODEL  
U25  
0
/K  
U
250  
MAR. 07. 2007  
Designer  
KANG. H. S  
1/4  
R128 100K  
C185 100p  
C186  
1000p  
TCXO_PM  
VCC  
Checked  
Approved  
5
C187  
1000p  
C188  
0.01u  
2
4
RTR6275_TCXO  
TCXO_BT  
DRAWING  
3
U104  
TC7SH04FU  
RF  
GND  
DRAWING  
NO.  
REV_1.2  
LG Electronics Inc.  
1
2
4
5
6
7
8
9
LG(42)-A-5505-10:01  
LG Electronics Inc.  
LGMC  
- 143 -  
Download from Www.Somanuals.com. All Manuals Search And Download.  
7. CIRCUIT DIAGRAM  
1
2
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
16  
MODE  
MODE2 MODE1 MODE0  
HKADC(4):PCB_Rev_ADC  
ADC  
(
Default Pull-Down)  
150K  
150K  
150K  
150K  
150K  
150K  
150K  
150K  
150K  
:
:
:
:
:
:
:
:
:
10K  
47K  
68K  
100K  
150K  
300K  
470K  
680K  
750K  
:
:
:
:
:
:
:
:
:
0.016V  
0.62V  
0.81V  
1.04V  
1.30V  
1.73V  
1.97V  
2.13V  
2.17V  
0
0
0
Native, ARM JTAG  
HKADC[0]  
HKADC[1]  
HKADC[2]  
HKADC[3]  
HKADC[4]  
HKADC[5]  
-
AMUX_OUT  
VBATT_SENSE  
HDET1  
TTY_ADC_DET  
PCB_Rev_ADC  
VBATT_TEMP  
-
-
-
-
-
BOOT_MODE3 BOOT_MODE2 BOOT_MODE1  
A
B
C
D
E
F
A
B
C
D
E
F
0
0
1
0
1
0
1
1
1
8-bit, NAND, Normal  
16-bit, NAND, Normal  
8-bit, NAND, Trusted  
16-bit, NAND, Trusted  
HKADC  
PMIC_AUXIN[1]  
PMIC_AUXIN[2]  
1%  
RESET  
VREG_MSME_1.8V  
1
1
1
-
PA_THERM  
AUDIO  
Near to MSM  
1%R435  
C200 47p  
C201 47p  
SDRAM CLOCK  
1005 0.1uF 16V +80/-20%  
REV_B  
300K  
2012 10uF 6.3V +80/-20% Ceramic  
VREG_MSMC_1.25V  
VREG_MSME_1.8V  
VREG_MSMP_2.7V  
VREG_MSMA_2.6V  
(CAD : 10uF=>Input MSMA_2.6V)  
SDRAM_ADDR(0:14)  
C204  
10p  
C205  
4.7u  
C206  
10u  
C209  
0.1uF  
Place near  
MSM pin W18  
C212  
0.1u  
10%  
(CODEC VSS)  
C213  
C214  
C215  
0.01u  
C216  
0.1uF  
0.01u 0.01u  
C217  
C218  
0.01u 0.01u  
C219  
C220  
C221  
0.1uF 0.1uF 0.1uF  
SDRAM_DATA(0:31)  
F25  
SDCC_DAT1_GPIO99  
SDCC_DAT2_GPIO100  
SDCC_DAT3_GPIO101  
REV_B  
SDRAM_DATA(31)  
SDRAM_DATA(30)  
SDRAM_DATA(29)  
SDRAM_DATA(28)  
SDRAM_DATA(27)  
SDRAM_DATA(26)  
SDRAM_DATA(25)  
SDRAM_DATA(24)  
SDRAM_DATA(23)  
SDRAM_DATA(22)  
SDRAM_DATA(21)  
SDRAM_DATA(20)  
SDRAM_DATA(19)  
SDRAM_DATA(18)  
SDRAM_DATA(17)  
SDRAM_DATA(16)  
SDRAM_DATA(15)  
SDRAM_DATA(14)  
SDRAM_DATA(13)  
SDRAM_DATA(12)  
SDRAM_DATA(11)  
SDRAM_DATA(10)  
SDRAM_DATA(9)  
SDRAM_DATA(8)  
SDRAM_DATA(7)  
SDRAM_DATA(6)  
SDRAM_DATA(5)  
SDRAM_DATA(4)  
SDRAM_DATA(3)  
SDRAM_DATA(2)  
SDRAM_DATA(1)  
SDRAM_DATA(0)  
T8  
T6  
T4  
R8  
T2  
T1  
R6  
R4  
W4  
V6  
Y2  
Y1  
E1  
R11  
V4  
U6  
L6  
L8  
K4  
J1  
K6  
J2  
J4  
P4  
H4  
G2  
J6  
AB4  
D1  
AB2  
D2  
E2  
M25  
M26  
AE3  
AD2  
A1_22  
Change 32 bit  
A1_21  
C222  
C223  
C225  
0.01u  
C226  
0.01u  
C227  
0.01u  
C228  
0.01u  
C229  
C230  
A1_20  
MDP_VSYNC_SECONDA_GPIO104  
MDP_VSYNC_PRIMARY_GPIO105  
LCD_MAKER_ID  
LCD_VSYNC  
1000p 1000p  
0.1uF 0.1uF  
A1_19  
2200p cap => place between  
D12(VDDA1) and F12(DAC_REF)  
A1_18  
H25  
F26  
H11  
D5  
J21  
A6  
N19  
W15  
AA15  
AE13  
H9  
B6  
F8  
AA1  
Y6  
L25  
H6  
TP200  
WDOG monitoring  
A1_17  
WDOG_STB_SBCK1_GPIO0  
SBDT1_GPIO1  
A1_16  
A1_15  
PA_ON1_GPIO2  
GRFC9_GPIO12  
C231  
2200p  
GPIO_74  
DAC_REF  
GPIO_73  
CAMCLK_PO_GP_MN_GPIO13  
GPIO28  
USB_RX_DATA_GPIO29  
XMEM2_CS_N2_GPIO35  
XMEM2_CS_N3_GPIO36  
LCD_EN_GPIO37  
GPIO43  
SYNTH2_GPIO65  
GPIO66  
XMEM1_CS_N1_GPIO76  
CAM_MCLK  
LCD_IF_MODE_0  
GPIO_72  
C232  
C233  
C234  
C235  
C236  
0.01u  
C237  
C238  
C239  
1000p  
C240  
0.1uF 0.1uF  
C242  
GPIO_71  
1000p 1000p 1000p 1000p  
1000p 1000p  
GPIO_70  
VGA_CAM_RESET_N  
GPIO_69  
GPIO_68  
LCD_LDO_EN  
LCD_RESET_N  
HOOK_KEY  
Near to B18 (VDD_PLL)  
VREG_MSMA_2.6V  
GPIO_67  
GPIOs  
SDRAM1_D15  
SDRAM1_D14  
SDRAM1_D13  
SDRAM1_D12  
SDRAM1_D11  
SDRAM1_D10  
SDRAM1_D9  
SDRAM1_D8  
SDRAM1_D7  
SDRAM1_D6  
SDRAM1_D5  
SDRAM1_D4  
SDRAM1_D3  
SDRAM1_D2  
SDRAM1_D1  
SDRAM1_D0  
R211  
SDRAM  
XMEM1_CS_N3_SDRAM1_CS_N1_GPIO77  
UART3_RFR_N_GPIO87  
0
C244  
0.01u  
C243  
0.1u  
UART2_DP_RX_DATA_GPIO89  
SYNTH0_GP_PDM0_GPIO92  
SBST1_GPIO93  
RCV_EN_N  
F18  
H18  
Close to MSM  
LCD_IF_MODE_1  
10%  
H13  
L13  
F19  
F17  
TX_AGC_ADJ  
TRK_LO_ADJ  
TCXO_EN_GPIO94  
PA_ON0  
TX_AGC_ADJ  
TRK_LO_ADJ  
2K  
R213  
TCXO_EN  
PA_ON  
C26  
RESERVED  
A12  
B12  
A13  
B13  
F12  
F1  
K1  
M1  
R1  
U1  
Q_OUT_N  
Q_OUT  
I_OUT_N  
I_OUT  
DAC_REF  
TX_QM  
TX_QP  
TX_IM  
TX_IP  
DAC_REF  
VSS_PAD1_0  
VSS_PAD1_1  
VSS_PAD1_2  
VSS_PAD1_3  
VSS_PAD1_4  
(PLLOUT_TEST)  
C1  
VSS_DIG_0  
VSS_DIG_1  
VSS_DIG_2  
VSS_DIG_3  
VSS_DIG_4  
VSS_DIG_5  
VSS_DIG_6  
VSS_DIG_7  
VSS_DIG_8  
VSS_DIG_9  
VSS_DIG_10  
VSS_DIG_11  
VSS_DIG_12  
VSS_DIG  
H1  
W1  
AC15  
AF14  
XMEM2_CS_N1  
LCD_CS_N_GPIO38  
AC1  
AF8  
AF16  
T26  
G26  
D26  
A24  
A14  
A11  
A5  
LCD_CS_N  
W23  
V23  
V25  
W25  
AA25  
Y25  
AB25  
AC25  
AF6  
AF11  
AF15  
Q_IM_CH1  
Q_IP_CH1  
I_IM_CH1  
I_IP_CH1  
Q_IM_CH0  
Q_IP_CH0  
I_IM_CH0  
I_IP_CH0  
VSS_PAD2_0  
VSS_PAD2_1  
VSS_PAD2_2  
AF10  
W14  
AF7  
AF4  
AE10  
T14  
NAND_CLE  
NAND_CS_N  
EBI2_OE_N  
EBI2_WE_N  
NAND_ALE  
NAND_READY  
UB2_N  
XMEM2_CS_N0  
OE2_N  
WE2_N  
LB2_N_A2_0  
NAND2_FLASH_READY_GPIO33  
RF  
U201-1  
MSM6245_A  
R26  
B17  
A15  
A9  
RX_QM  
RX_QP  
RX_IM  
RX_IP  
VSS_PAD3_0  
VSS_PAD3_1  
VSS_PAD3_2  
VSS_PAD3_3  
EBI2_DATA(0:15)  
U201-2  
MSM6245_B  
EBI2_DATA(15)  
AA10  
AC9  
W10  
AA9  
AE7  
AC8  
W9  
AA8  
AC7  
AF5  
AA7  
AE5  
AC6  
AE4  
AF3  
AC5  
A18  
A21  
D13  
D19  
P26  
AC23  
D2_15  
D2_14  
D2_13  
D2_12  
D2_11  
D2_10  
D2_9  
D2_8  
D2_7  
D2_6  
D2_5  
D2_4  
D2_3  
D2_2  
D2_1  
D2_0  
VSSA1  
VSSA2  
VSSA3  
VSSA4  
VSSA5  
VSSA6  
VSSA7  
VSSA8  
VSSA9  
VSSA10  
VSSA11  
VSSA12  
VSSA13  
VSSA14  
VSSA15  
VSSA16  
EBI2_DATA(14)  
EBI2_DATA(13)  
EBI2_DATA(12)  
EBI2_DATA(11)  
EBI2_DATA(10)  
EBI2_DATA(9)  
EBI2_DATA(8)  
EBI2_DATA(7)  
EBI2_DATA(6)  
EBI2_DATA(5)  
EBI2_DATA(4)  
EBI2_DATA(3)  
EBI2_DATA(2)  
EBI2_DATA(1)  
EBI2_DATA(0)  
D17  
H17  
GP_PDM2_PA_RAN_GE1  
GP_PDM1_PA_RAN_GE0  
PA_R0  
H15  
D16  
F15  
D15  
A17  
H16  
AA21  
TRST_N  
TCK  
NC  
MSM6280 Reference Rev.B  
:
AA21 -> NC  
U19  
V26  
AC23: VSS_DIG  
AA6  
AC4  
AE1  
TMS  
VSS39  
VSS41  
VSS43  
VSS44  
VSS45  
VSS46  
VSS47  
VSS48  
VSS49  
VSS50  
W16  
W18  
W26  
AB26  
AC16  
AC26  
AD25  
AF23  
AF24  
TDI  
w18 (Analog VSS guard ring for CODEC)  
TDO  
AE2  
RTCK  
AE25  
AE26  
AF1  
AF2  
AF25  
AF26  
K19  
N21  
G4  
J8  
H12  
AUX_PCM_CLK_GRFC14_GPIO80  
AUX_PCM_DIN_GRFC13_GPIO14  
AUX_PCM_DOUT_GRFC12_GPIO103  
AUX_PCM_SYNC_GRFC11_GPIO102  
TX_ON_GRFC10  
SPK_AMP_EN  
TX_ON  
NAND & LCD  
B4  
C
D
E
F
GRFC8_GPIO11  
GRFC7_GPIO10  
C
D
E
AF13  
AA14  
T13  
AC14  
AE14  
W13  
AC13  
AA13  
AF12  
AE12  
AC12  
AA12  
W12  
T23  
T19  
D11  
H10  
F10  
D9  
(ADS signal for LCD)  
LCD_ADS  
A2_20_GPIO34  
A2_19  
A2_18  
A2_17  
A2_16  
A2_15  
A2_14  
A2_13  
A2_12  
A2_11  
A2_10  
A2_9  
ANT_SEL1  
ANT_SEL0  
GRFX6_GPIO9  
GRFC5_AUX_SBST_GPIO8  
GRFC4_AUX_SBCK_GPIO7  
GRFC3_GPIO6  
GRFC2_GPIO5  
GRFC1_AUX_SBDT_GPIO4  
GRFC0_GPIO3  
GSM_PA_BAND  
GSM_PA_EN  
A8  
B8  
G23  
F23  
E26  
E25  
H21  
R19  
BT_CLK_GPIO25  
BT_SBST_GPIO24  
BT_SBCK_GPIO23  
BT_SBDT_GPIO22  
BT_TX_RX_N_GPIO21  
BT_DATA_GPIO20  
BT_CLK  
for VSS_THERMAL  
BT_SBST  
BT_SBCK  
BT_SBDT  
BT_TX_RX_N  
BT_DATA  
A2_8  
T12  
A2_7  
AC11  
AA11  
AC10  
W11  
AF9  
AE9  
A2_6  
A2_5  
A22  
A23  
B22  
B23  
A2_4  
MDDIC_DATP  
MDDIC_DATN  
MDDIC_STBP  
MDDIC_STBN  
A2_3  
A2_2  
A2_1  
Section  
Date  
Sign & Name  
Sheet/  
Sheets  
C247  
0.1u  
10%  
Place near  
MSM pin AD26  
MODEL  
CTS  
U250/KU250  
MAR.07.2007  
Jaykay  
Designer  
12  
11  
10  
9
RTS  
DSR  
NC4  
NC3  
NC2  
VBAT  
ON_SWON_SW  
NC1  
TX  
2/4  
UTXD  
USB_D+  
USB_D-  
URXD  
PWR  
8
USB_VBUS  
VBATT  
CAMERA  
2.2K  
Checked  
Approved  
TP402  
TP403  
7
VBAT  
6
REMOTE_PWR_ON  
KEYPAD  
USIM PMIC  
USB MicroSD  
R214  
R215  
5
DRAWING  
NAME  
UFLS  
TX  
RX  
GND  
TP404  
TP405  
TP406  
4
UART  
UART_TXD  
UART_RXD  
2.2K  
3
MSM  
VREG_CAM_AVDD_2.8V  
RX  
GND  
2
(Check CAM_DATA PINOUT !!!!)  
1
2.5G  
3G  
UART  
DRAWING  
NO.  
REV_1.0  
LG Electronics Inc.  
1
2
3
4
5
6
7
8
9
LG(42)-A-5505-10:01  
LG Electronics Inc.  
LGMC  
- 144 -  
Download from Www.Somanuals.com. All Manuals Search And Download.  
7. CIRCUIT DIAGRAM  
1
2
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
16  
PMIC VPWR BYPASS  
A
B
C
D
E
F
A
B
C
D
E
F
VDD_MSMC  
VDD_MSME  
:
:
4.7uF  
4.7uF  
VDD_MSM  
:
0.1uF  
0.1uF  
VDD_ANA  
:
VDD_RUIM 0.1uF  
:
VDD_RF  
:
0.1uF  
0.1uF  
U301  
HYC0UEH0MF3P-6SS0E  
VDD_WLAN  
:
REV_B  
X16 SDRAM --> X32 SDRAM  
VDD_MAIN  
VDD_SPKR  
:
0.1uF  
0.1uF  
J2  
K1  
G2  
H2  
C5  
VSSN0  
P6  
:
_CS  
SDRAM_CS_N(0)  
SDRAM_WE_N  
SDRAM_RAS_N  
SDRAM_CAS_N  
_WED  
_RAS  
_CAS  
VSSN1  
+VPWR  
VREG_MSMP_2.7V  
J9  
VSSQ0  
K10  
REV_B  
G8  
E3  
B6  
CK  
CKE  
_CE  
VSSQ1  
L10  
C446  
33u  
SDRAM_CLK  
VSSQ2  
M9  
SDRAM_CLK_EN  
VSSQ3  
N10  
NAND_CS_N  
VSSQ4  
C10  
B7  
C6  
C4  
B4  
B3  
C3  
_WEN  
R_B  
ALE  
CLE  
_RE  
VSSQ5  
D9  
EBI2_WE_N  
VSSQ6  
E10  
NAND_READY  
VSSQ7  
F9  
NAND_ALE  
NAND_CLE  
EBI2_OE_N  
VSSQ8  
G10  
VSSQ9  
_WP  
RESOUT_N  
J3  
K2  
J10  
VDDQ0  
K9  
BA0  
BA1  
SDRAM_ADDR(13)  
SDRAM_ADDR(14)  
EBI2_DATA(0:7)  
VREG_MSME_1.8V  
VDDQ1  
L9  
1608  
VDDQ2  
M10  
EBI2_DATA(0)  
EBI2_DATA(1)  
EBI2_DATA(2)  
EBI2_DATA(3)  
EBI2_DATA(4)  
EBI2_DATA(5)  
EBI2_DATA(6)  
EBI2_DATA(7)  
N1  
N2  
N3  
M5  
P7  
M6  
N6  
M8  
IO0  
IO1  
IO2  
IO3  
IO4  
IO5  
IO6  
IO7  
VDDQ3  
N9  
VDDQ4  
C9  
REMOTE_PWR_ON  
Check if it is LOW enable.  
VDDQ5  
D10  
VDDQ6  
E9  
VDDQ7  
F10  
VDDQ8  
G9  
VDDQ9  
0.1u  
C322  
1
2
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
63  
ADC_BYP  
VCHG  
ISNS_P  
CHG_CTL_N  
ISNS_M  
VBAT  
BAT_FET_N  
FLSH_DRV_N  
PON_RESET_N  
VREG_USB  
USB_ID  
VREG_5V  
USB_OE_N  
VSW_5V  
USB_CTL_N  
USB_VBUS  
USB_DAT  
USB_D_P  
USB_SE0  
REF_BYP  
REF_GND  
REF_ISET  
VCOIN  
MSM_INT_N  
TCXO_IN  
PS_HOLD  
VREG_MSMA  
TCXO_EN  
VDD_ANA  
TCXO_OUT  
VDD_MSM  
SBST  
VREG_MSMP  
SBCK  
VBACKUP  
SBDT  
XTAL_OUT  
SLEEP_CLK  
XTAL_IN  
SDRAM_ADDR(0:12)  
SDRAM_ADDR(0)  
SDRAM_ADDR(1)  
SDRAM_ADDR(2)  
SDRAM_ADDR(3)  
SDRAM_ADDR(4)  
SDRAM_ADDR(5)  
SDRAM_ADDR(6)  
SDRAM_ADDR(7)  
SDRAM_ADDR(8)  
SDRAM_ADDR(9)  
SDRAM_ADDR(10)  
SDRAM_ADDR(11)  
SDRAM_ADDR(12)  
K4  
L1  
L2  
L3  
C2  
D2  
E1  
D3  
E2  
D4  
K3  
F2  
F1  
B9  
VSS0  
C1  
62  
A0  
A1  
+5V_PWR  
NBL414R-F9J  
61  
60  
R303  
121K  
1%  
BAT300  
1u C323  
VSS1  
H9  
ICHARGE  
CHG_CTL_N  
ICHARGEOUT  
VBATT  
A2  
VSS2  
J1  
470K  
R304  
59  
58  
57  
56  
55  
54  
R305  
A3  
VSS3  
P9  
PM_INT_N  
TCXO_PM  
A4  
VSS4  
M2  
10K  
A5  
VSS5  
BATT_FET_N  
PS_HOLD  
VREG_MSMA_2.6V  
A6  
1005  
A7  
RESIN_N  
1u  
TCXO_EN  
+VPWR  
TCXO_MSM  
+VPWR  
VREG_MSMP_2.7V  
U300  
PM6650-2M  
B8  
VDD0  
D1  
C326  
4.7u  
A8  
VREG_MSME_1.8V  
VREG_MSMP_2.7V  
C327  
53 51  
52  
R306  
A9  
VDD1  
H1  
A10  
A11  
A12  
VDD2  
H10  
51  
50  
49 51K  
51K  
R307  
R308  
VDD3  
P8  
USB_OE_N  
VDD4  
M1  
VREG_MSMP_2.7V  
VDD5  
USB_CTL_N  
USB_VBUS  
USB_DAT  
USB_D+  
USB_SE0  
USB_D-  
48  
47  
46  
45  
44  
43  
J8  
G6  
F8  
E7  
DQM0  
DQM1  
DQM2  
DQM3  
X300  
SDRAM_DQM(0)  
SDRAM_DQM(1)  
SDRAM_DQM(2)  
SDRAM_DQM(3)  
SSBDT_PM  
SLEEP_CLK  
3
B5  
VCC0  
N5  
4
1
TP308  
VCC1  
2
USB_D_M  
GP1_DRV_N(MPP7)  
SDRAM_DATA(0:31)  
SDRAM_DATA(0)  
SDRAM_DATA(1)  
SDRAM_DATA(2)  
SDRAM_DATA(3)  
SDRAM_DATA(4)  
SDRAM_DATA(5)  
SDRAM_DATA(6)  
SDRAM_DATA(7)  
SDRAM_DATA(8)  
SDRAM_DATA(9)  
SDRAM_DATA(10)  
SDRAM_DATA(11)  
SDRAM_DATA(12)  
SDRAM_DATA(13)  
SDRAM_DATA(14)  
SDRAM_DATA(15)  
SDRAM_DATA(16)  
SDRAM_DATA(17)  
SDRAM_DATA(18)  
SDRAM_DATA(19)  
SDRAM_DATA(20)  
SDRAM_DATA(21)  
SDRAM_DATA(22)  
SDRAM_DATA(23)  
SDRAM_DATA(24)  
SDRAM_DATA(25)  
SDRAM_DATA(26)  
SDRAM_DATA(27)  
SDRAM_DATA(28)  
SDRAM_DATA(29)  
SDRAM_DATA(30)  
SDRAM_DATA(31)  
L4  
L5  
L6  
L7  
K8  
L8  
K7  
K5  
K6  
G7  
J6  
RUIM_RST(MPP6)  
USIM_P_RST_N  
DQ0  
J7  
NC0  
H7  
MC-146_7pF  
32.768KHz  
DQ1  
R309  
C336  
2.2K  
4.7u  
DQ2  
NC1  
H8  
DQ3  
NC2  
B1  
DQ4  
NC3  
B2  
1608  
REV_D  
DQ5  
NC4  
B10  
NC5  
E5  
DQ6  
DQ7  
NC6  
F3  
KYBD_BACKLIGHT  
PM_ON_SW_N  
MOTOR_PWR-  
USIM_P_DATA  
+VPWR  
DQ8  
NC7  
G1  
USIM_RST_N  
USIM_P_CLK  
USIM_CLK  
DQ9  
NC8  
G5  
DQ10  
DQ11  
DQ12  
DQ13  
DQ14  
DQ15  
DQ16  
DQ17  
DQ18  
DQ19  
DQ20  
DQ21  
DQ22  
DQ23  
DQ24  
DQ25  
DQ26  
DQ27  
DQ28  
DQ29  
DQ30  
DQ31  
NC9  
M3  
J5  
NC10  
M4  
USIM_DATA  
VREG_USIM_2.85V  
VREG_MMC_3.0V  
H6  
H5  
J4  
NC11  
M7  
NC12  
N4  
NC13  
N7  
G3  
G4  
F4  
E4  
F5  
H3  
H4  
E6  
F7  
F6  
D5  
E8  
D6  
D8  
D7  
C8  
C7  
C339  
2.2u  
NC14  
N8  
C340  
2.2u  
C358  
22u  
NC15  
P1  
REV_B  
NC16  
P2  
L305  
4.7uH  
NC17  
P3  
REV_E  
NC18  
P4  
NC19  
P5  
NC20  
P10  
NC21  
VREG_RF_SMPS  
Power Line --> Route carefully!!!!!  
Draw the Artwork_line thickly !!!!!  
C435 C436  
C433  
0.1u  
C434  
1000p  
22u  
10u  
A2  
DNU0  
A9  
--->> USB_VBUS  
,
FLASH_DRV_N  
,
KPD_DRV_N  
,
KEY_ON_SW_N MOT_PWR-  
,
DNU1  
A10  
DNU2  
R1  
DNU3  
R2  
DNU4  
R9  
DNU5  
R10  
LCD LDO  
Artwork --> Place resistor and capacitor close to PM6650 !!  
DNU6  
U302 R1114D281D-TR-F  
VDD VOUT  
1
3
MCP(512Mb NAND + 512Mb 1 piece SDRAM)  
MEMORY  
+VPWR  
VREG_LCD_2.8V  
4
6
2
5
NC  
CE  
GND1  
GND2  
C345  
1u  
LCD_LDO_EN  
C346  
1u  
C
D
E
F
C
D
E
CAMERA LDO  
CHARGER  
U303 RT9011-MGPQW  
ICHARGEOUT  
+VPWR  
1
2
3
4
8
7
6
5
+VPWR  
VIN  
VOUT1  
VOUT2  
NC2  
VREG_CAM_AVDD_2.8V  
VREG_CAM_DVDD_1.8V  
R313  
CAM_LDO_EN  
EN1  
EN2  
NC1  
USB_VBUS  
0.1  
6
1
5
2
4
C347  
1u  
GND  
C348  
1u  
C349  
1u  
Q300  
QST4  
T-FLASH  
VBATT  
B
3
C1  
C2  
R314  
0
VREG_MMC_3.0V  
USB_CTL_N  
+5V_PWR  
15K  
R317  
J300  
USIM  
+VPWR  
VIN  
VOUT  
VREG_CAM_DVDD_1.5V  
S300  
3
2
1
4
6
5
GND BGND  
SCHA1A0100  
HSSC-8P-18  
1
CAM_LDO_EN  
STBY  
U501  
BH15LB1WHFV  
NC  
BATT_FET_N  
GND  
5
6
6
1
5
2
4
GND1  
VPP  
IO  
VCC  
RST  
CLK  
VREG_USIM_2.85V  
USIM_P_RST_N  
USIM_P_CLK  
C350  
1u  
Q302  
QST4  
DAT2_RSV  
CD_DAT3_CS  
CMD_DI  
VDD  
CLK_SCLK  
VSS  
2
C447  
1u  
7
3
MMC_CD  
USIM_P_DATA  
8
9
4
11  
12  
RSV2 RSV1  
GND2 GND5  
GND3 GND4  
MMC_CMD  
REV_D  
B
3
10  
C1  
C2  
MMC_CLK  
CHG_CTL_N  
ICHARGE  
DAT0_DO  
DAT1_RSV  
MMC_DATA  
C351  
0.1u  
GND  
LCD BACKLIGHT  
L302  
56nH  
Differential lines, route as equal length as possible !! --> ICHARGE  
Sign & Name  
,
ICHARGEOUT  
U305  
IN  
AAT3157ITP-T1  
C1+  
5
10  
+VPWR  
REV_B  
C354  
C355  
1u  
Section  
Date  
Sheet/  
Sheets  
9
C1-  
1u  
7
C2+  
8
WLED_PWR  
CP  
C356  
1u  
U250/KU250  
MODEL  
MAR.07.2007  
Jaykay  
Designer  
6
C2-  
11  
3/4  
LCD_BL_CTRL  
REV_C  
EN_SET  
1
D1  
2
WLED_1  
WLED_2  
WLED_3  
REV_B  
C357  
1u  
D2  
3
D3  
12  
Checked  
Approved  
4
GND  
NC  
DRAWING  
NAME  
MEM & POWER  
OJ300 OJ301  
OJ302 OJ303  
DRAWING  
NO.  
LG Electronics Inc.  
REV_1.0  
1
2
3
4
5
6
7
8
9
LG(42)-A-5505-10:01  
LG Electronics Inc.  
LGMC  
- 145 -  
Download from Www.Somanuals.com. All Manuals Search And Download.  
7. CIRCUIT DIAGRAM  
1
2
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
16  
LCD CONNECTOR  
2.2K  
VREG_MSMP_2.7V  
I/O CONNECTOR  
MICBIAS  
R400  
CN400  
R401  
5.1K  
ICVE21184E150R500FR  
9
1
2
3
4
INOUT_B1 INOUT_A1  
INOUT_B2 INOUT_A2  
INOUT_B3 INOUT_A3  
INOUT_B4 INOUT_A4  
A
B
C
D
E
F
EBI2_DATA(0)  
EBI2_DATA(1)  
EBI2_DATA(2)  
EBI2_DATA(3)  
A
B
C
D
E
F
ICVE21184E150R500FR  
INOUT_A1 INOUT_B1  
8
7
6
35  
33  
31  
29  
27  
25  
23  
21  
19  
17  
15  
13  
11  
9
LCD_RESET_N  
LCD_IF_MODE_0  
LCD_IF_MODE_1  
LCD_VSYNC  
C400  
0.1u  
34  
32  
30  
28  
26  
24  
22  
20  
18  
16  
14  
12  
10  
8
LCD_CS_N  
LCD_ADS  
EBI2_WE_N  
EBI2_OE_N  
R403  
51K  
1
2
3
4
9
8
7
6
INOUT_A2 INOUT_B2  
INOUT_A3 INOUT_B3  
INOUT_A4 INOUT_B4  
VREG_MSMP_2.7V  
CN401  
+VPWR  
HSEJ-18S04-25R  
TP400  
TP401  
10K  
L400  
56nH  
5
VIN-  
4
3
FL400  
ICVE21184E150R500FR  
VCC  
GND  
1
R404  
MOTOR_PWR-  
HOOK_KEY  
21  
OUT  
VIN+  
19  
1
FL401  
9
8
7
6
1
2
3
4
2
INOUT_B1 INOUT_A1  
INOUT_B2 INOUT_A2  
INOUT_B3 INOUT_A3  
INOUT_B4 INOUT_A4  
EBI2_DATA(4)  
EBI2_DATA(5)  
EBI2_DATA(6)  
EBI2_DATA(7)  
D400  
MIC2N  
MIC2P  
2
U400  
3
NCS2200SQ2T2G  
C401  
33u  
33u  
R406 100ohm  
RB521S-30  
4
HPH_L  
HPH_R  
USB_D+  
USB_D-  
C402  
R407 100ohm  
5
6
7
FL402  
8
EAR_SENSE_N  
ICVE21184E150R500FR  
9
VBATT  
R408  
10  
11  
12  
13  
14  
15  
16  
17  
18  
INOUT_A1 INOUT_B1  
INOUT_A2 INOUT_B2  
INOUT_A3 INOUT_B3  
INOUT_A4 INOUT_B4  
EBI2_DATA(8)  
EBI2_DATA(9)  
EBI2_DATA(10)  
EBI2_DATA(11)  
VBAT_SENSE  
REV_B  
1
1
2
3
4
9
8
7
FL404  
OUT  
470K REMOTE_PWR_ON  
+5V_PWR  
2
4
IN  
6FL403  
3
G2  
G1  
USB_VBUS  
UART_TXD  
UART_RXD  
NTS104B  
ICVE21184E150R500FR  
CN402  
REV_B Change Pin Description  
:
20  
22  
1
2
3
4
VBAT  
INOUT_A1 INOUT_B1  
INOUT_A2 INOUT_B2  
INOUT_A3 INOUT_B3  
INOUT_A4 INOUT_B4  
EBI2_DATA(12)  
EBI2_DATA(13)  
EBI2_DATA(14)  
EBI2_DATA(15)  
1
2
3
4
9
8
7
6
7
VBAT_TEMP  
6
5
4
3
R410  
80.6K  
2
VREG_MSMP_2.7V  
FL405  
1
LCD_MAKER_ID  
VREG_LCD_2.8V  
WLED_1  
WLED_2  
REV_1.0  
VBAT_GND  
WLED_3  
WLED_PWR  
KEY_BACK_LIGHT LED(8EA)  
+VPWR  
LD400 LEBB-S14H  
LD403 LEBB-S14H  
LD406 LEBB-S14H  
LD402  
LD405  
LEBB-S14H  
LEBB-S14H  
LEBB-S14H  
R411  
100ohm  
R414  
100ohm  
R417  
100ohm  
R413 100ohm  
R416 100ohm  
R419 100ohm  
LD404 LEBB-S14H  
LD407 LEBB-S14H  
R415  
100ohm  
LD408  
R418  
100ohm  
REV_B  
:
EDLH0013501 --> EDLH0006001  
KYBD_BACKLIGHT  
CAMERA  
AUDIO  
SELECT_SPK&RCV  
MEGA CAMERA CONNECTOR  
U401  
NLAS5223BMNR2G  
1
2
3
4
5
10  
VCC  
NO1  
COM1  
IN1  
NO2  
COM2  
IN2  
+VPWR  
SPK+  
REV_1.0  
9
C410  
0.01u  
SPK-  
SPK_RCV+  
RCV_EN_N  
RCV+  
R436  
0
22  
23  
24  
1
20  
19  
18  
12  
11  
10  
9
CAM_DATA_OUT(0)  
CAM_DATA_OUT(1)  
CAM_DATA_OUT(2)  
CAM_DATA_OUT(3)  
CAM_DATA_OUT(4)  
CAM_DATA_OUT(5)  
CAM_DATA_OUT(6)  
CAM_DATA_OUT(7)  
D0  
D1  
D2  
D3  
D4  
D5  
D6  
D7  
PCLK  
VSYNC  
HSYNC  
STANDBY  
SCK  
CAM_PCLK  
8
END  
END  
CAM_VSYNC_OUT  
CAM_HSYNC_OUT  
SPK_RCV-  
VREG_MSMP_2.7V  
7
CN403  
10  
R421  
MEGA_CAM_PWR_DOWN  
NC2  
PM_ON_SW_N  
2
I2C_SCL  
I2C_SDA  
MEGA_CAM_RESET_N  
CAM_MCLK  
KEY MAP  
6
3
R422  
10  
NC1  
GND  
SDA  
RCV-  
4
RESETB  
MCLK  
5
7
R437 20  
CLR  
LEFT  
OK  
MENU  
REV_B  
VREG_CAM_AVDD_2.8V  
VREG_CAM_DVDD_1.8V  
KEY_ROW(0)  
400  
1
401  
2
402  
UP  
3
KEY_ROW(1)  
KEY_ROW(2)  
KEY_ROW(3)  
MIC  
403  
4
404  
5
405  
6
RIGHT  
SEARCH  
BACK  
MICBIAS  
C416  
10u  
C417  
47p  
C
D
E
REV_B SUMY0010301 --> SUMY0003802  
:
REV_1.0  
R424  
2.2K  
406  
7
407  
8
408  
9
SND  
DN  
COMMON_CAM_MCLK  
MIC400  
OB4-15L42-C33L  
C418 0.1u  
C419 0.1u  
1
2
MIC1P  
MIC1N  
ICVE21184E150R500FR  
ICVE21184E150R500FR  
HOT400  
HOT4  
409  
0
HOT401  
HOT3  
1
2
3
4
9
8
1
2
3
4
9
8
INOUT_A1 INOUT_B1  
INOUT_A2 INOUT_B2  
INOUT_A1 INOUT_B1  
INOUT_A2 INOUT_B2  
CAM_DATA(0)  
CAM_DATA(1)  
CAM_DATA(2)  
CAM_DATA_OUT(0)  
CAM_DATA_OUT(1)  
CAM_DATA_OUT(2)  
CAM_DATA(3)  
CAM_DATA(4)  
CAM_DATA(5)  
CAM_DATA_OUT(3)  
CAM_DATA_OUT(4)  
CAM_DATA_OUT(5)  
7
INOUT_A3 INOUT_B3  
6
7
INOUT_A3 INOUT_B3  
6
KEY_ROW(4)  
KEY_COL(0)  
KEY_COL(1)  
KEY_COL(2)  
KEY_COL(3)  
KEY_COL(4)  
INOUT_A4 INOUT_B4  
INOUT_A4 INOUT_B4  
FL406  
FL407  
D
E
F
ICVE21184E150R500FR  
1
2
3
4
9
INOUT_A1 INOUT_B1  
CAM_DATA(6)  
CAM_DATA_OUT(6)  
CAM_DATA_OUT(7)  
CAM_VSYNC_OUT  
CAM_HSYNC_OUT  
8
7
6
INOUT_A2 INOUT_B2  
INOUT_A3 INOUT_B3  
INOUT_A4 INOUT_B4  
CAM_DATA(7)  
CAM_VSYNC  
CAM_HSYNC  
REV_B EDTY0008606 --> EDTY0008601  
:
Audio AMP  
KEYS  
FL408  
NCP2890DMR2  
1
2
8
SPK_AMP_EN  
_SD  
OUTB  
SPK-  
R426  
20K  
REV_C  
:
20K --> 3K  
R4285.6K  
7
6
VT_CAMERA_CONNECTOR  
BYPASSU402 VM  
VGA_CAM_RESET_N  
I2C_SCL  
I2C_SDA  
VP  
+VPWR  
SPK+  
C422  
C423  
0.1u  
0.1u  
R427  
R429  
1K  
1K  
3
4
VREG_CAM_AVDD_2.8V  
LINE_N  
LINE_P  
INP  
INM  
5
OUTA  
R4305.6K  
C428  
1u  
R431  
20K  
Section  
Date  
MAR.07.2007  
Sign & Name  
Sheet/  
Sheets  
GND6  
GND5  
1
2
3
4
5
C425  
10u  
C431  
NA  
VREG_CAM_DVDD_1.5V  
COMMON_CAM_MCLK  
P1  
P2  
P3  
P4  
P5  
U250/KU250  
MODEL  
Jaykay  
Designer  
15  
14  
13  
12  
11  
REV_1.0  
CN404  
P15  
P14  
P13  
P12  
P11  
CAM_PCLK  
CAM_DATA_OUT(0)  
CAM_HSYNC_OUT  
CAM_VSYNC_OUT  
CAM_DATA_OUT(7)  
CAM_DATA_OUT(6)  
4/4  
GND1  
GND2  
Checked  
Approved  
DRAWING  
NAME  
KEY / MMI  
LCD/CAMERA  
L401  
L402  
100nH  
100nH  
RCVN  
RCVP  
CAM_DATA_OUT(1)  
CAM_DATA_OUT(2)  
CAM_DATA_OUT(3)  
CAM_DATA_OUT(4)  
SPK_RCV-  
SPK_RCV+  
CAM_DATA_OUT(5)  
REV_E : For Antenna Radiation  
DRAWING  
NO.  
LG Electronics Inc.  
REV_1.2  
1
2
3
4
5
6
7
8
9
LG(42)-A-5505-10:01  
LG Electronics Inc.  
LGMC  
- 146 -  
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8. PCB LAYOUT  
LGMC  
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8. PCB LAYOUT  
LGMC  
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9. Calibration & RF Auto Test Program (Hot Kimchi)  
9. Calibration & RF Auto Test Program (Hot Kimchi)  
9.1 Configuration of HOT KIMCHI  
9.1.1 Configuration of directory  
C:  
Cm_Grut  
Common  
dll_serialat  
Log  
LG_CL_009.dll  
At_Serial_Cmd.xml  
Diag_NV6250_RevB.dll  
Diag_NV6275.dll  
Diag_NV.dll  
DLL_E5515CD.DLL  
DLL_PwrControlD.dll  
Dll_SerialATD.dll  
LG_CL_011.dll  
PwrSupply_Cmd.xml  
KU250  
KU250  
Debug  
Auto  
Cal  
CalAuto  
KU250  
: Directory  
: File  
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9. Calibration & RF Auto Test Program (Hot Kimchi)  
Hot_Kimchi  
Debug  
image  
Log  
ComLMPLib_11.dll  
Dll_EzLooksMQ_004.dll  
GuiTk115d.dll  
HK_25.exe  
ijl11.dll  
SBCmd.xml  
ShieldBox_DllD.dll  
Model  
KU250  
Log  
LG_RfTest_E5515C_211.dll  
QMSL_MSVC6R.dll  
AutoSetup_110.xml  
Cal_Setup_Test.xml  
Ezlooks.xml  
LG_RfCal_Q3G6280N_Polar_006.dll  
Procedure_KU250_103.xml  
script_auto_001.xml  
script_cal_003.xml  
: Directory  
: File  
Spec_3GPP_030.xml  
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9. Calibration & RF Auto Test Program (Hot Kimchi)  
dll,ocx  
(Win98)MFCD DLL COPY.bat  
(Win2000)MFCD DLL COPY.bat  
(WinXP)MFCD DLL COPY.bat  
MFC42D.DLL  
MFCD42D.DLL  
MFCN42D.DLL  
MFCO42D.DLL  
MSVCP60D.DLL  
MSVCRTD.DLL  
Vsflex7L.ocx  
vsflex7l_ocx_regist.bat  
Auto  
Result  
UI  
KU250  
KU250  
KU250  
Cal  
CalAuto  
image  
result.bmp  
LG_UI_Ad6500_002.dll  
LG_UI_EmKU250_001.dll  
LG_UI_Qu6250_003.dll  
LG_UI_Qu6275_004.dll  
: Directory  
: File  
1.  
_New_HK_0808.reg  
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9. Calibration & RF Auto Test Program (Hot Kimchi)  
9.2 How to use HOT KIMCHI  
➀
➁
➂
* Procedure  
1. Click “Logic Operation” of “SETTING” menu bar  
2. Select “UART Port” that PC can communicate with the phone  
3. Select “LOGIC MODE” that you want  
- Logic Mode -> 1: Calibration Only  
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9. Calibration & RF Auto Test Program (Hot Kimchi)  
KU250  
Click "Start"  
➄
Select "U250/KU250"  
➃
* Procedure  
4. Select the model name “U250/KU250”  
5. Click “Start” button  
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10. Factory Test Mode  
10. Factory Test Mode  
10.1. Test Program Setting  
1) Open “LG FTM GUI”  
2) Click “Options >> Port Settings”  
3) Select Com Port and click “OK”  
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10. Factory Test Mode  
10.2. WCDMA Test Mode  
1) Click “Tools >> FTM GUI WCDMA”  
2) Select “FTM” Mode  
3) Select RF Frequencies, insert “9750” in “Uplink chan” and push “Enter”. Then “2140” is  
written at Rx UHF automatically.  
4) For Deciding to “TX AGC”, insert 380 as a maximum value . And then WCDMA Power is  
decided.  
5) To set PA Range, select ON in R1 for High power mode or select ON in R0 for Low power  
mode.  
6) Depending on a situation, Click “Tx On” or “Tx Off”.  
Channel Select  
Tx Control  
Rx Control  
7) Set Rx mode. Click LNA Range, 0~4.  
8) Click “Get IM2” and “Get Rx AGC”. Confirm the value.  
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10. Factory Test Mode  
10.3. GSM Test Mode  
1) To switch GSM Mode, Select Mode -> GSM mode at menu commands  
2) Select RF Mode, Click “GSM” or “GSM1800” or “GSM1900”  
3) Write wanted channel. We usually set “1”  
4) For Deciding to “PA DAC Value”, insert 14300 as a maximum value  
5) Click “Tx On” or “Tx Off”.  
6) SET RX mode. Click LNA Range, 0~4.  
7) Click “RX ON”  
Tx Power Control  
Channel Control  
Rx Gain Control  
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11. EXPLODED VIEW & REPLACEMENT PART LIST  
11.1 EXPLODED VIEW  
32  
35  
31  
30  
29  
28  
22  
20  
19  
18  
17  
15  
16  
36  
13  
12  
34  
8
7
5
6
4
3
33  
2
1
27  
26  
25  
24  
23  
37  
14  
10  
11  
9
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11. EXPLODED VIEW & REPLACEMENT PART LIST  
Note: This Chapter is used for reference, Part order  
11.2 Replacement Parts  
<Mechanic component>  
is ordered by SBOM standard on GCSC  
Location  
No.  
Level  
1
Description  
IMT,BAR/FLIP  
Part Number  
TIMT0000614  
AAAY0219401  
Spec  
Color  
Black  
Remark  
2
AAAY00 ADDITION  
Black  
3
MCJA00 COVER,BATTERY  
APAY00 PACKAGE  
MCJA0040601 MOLD, PC LUPOY SC-1004A, , , , ,  
APAY0095904 U250 HIT Packing(P/Label66-Angle-9501)  
BSEA0003901 PACKING-LIST ENVELOPE  
APEY0394202  
Without Color  
Without Color  
36  
2
3
BSEA00 SUPPLEMENTARY PART  
APEY00 PHONE  
2
Black  
3
ACGK00 COVER ASSY,FRONT  
MCCC00 CAP,EARPHONE JACK  
MCCG00 CAP,MULTIMEDIA CARD  
MCJK00 COVER,FRONT  
MICE00 INSERT,NUT  
ACGK0085601  
Without Color  
Without Color  
Without Color  
Without Color  
Without Color  
Without Color  
Without Color  
Without Color  
Black  
4
MCCC0043601 COMPLEX, (empty), , , , ,  
MCCG0007601 COMPLEX, (empty), , , , ,  
MCJK0069301 MOLD, PC LUPOY SC-1004A, , , , ,  
MICE0000601 COMPLEX, (empty), , , , ,  
MICE0000701 COMPLEX, (empty), , , , ,  
MFBC0029401 COMPLEX, (empty), , , , ,  
MFBZ0002801 COMPLEX, (empty), , , , ,  
MHGJ0001701 COMPLEX, (empty), , , , ,  
MKAZ0035901 COMPLEX, (empty), , , , ,  
MPBG0058301 COMPLEX, (empty), 1.2, , , ,  
MPBT0039101 COMPLEX, (empty), 1.2, , , ,  
MTAB0160501 COMPLEX, (empty), , , , ,  
MTAB0160601 COMPLEX, (empty), , , , ,  
MTAD0065801 COMPLEX, (empty), 0.2, , , ,  
MWAC0077201 COMPLEX, (empty), 1.0, , , ,  
ACGM0087501  
10  
4
4
4
5
5
5
MICE01 INSERT,NUT  
4
MFBC00 FILTER,SPEAKER  
MFBZ00 FILTER  
6
9
4
4
MHGJ00 HOLDER,SPEAKER  
MKAZ00 KEYPAD  
7
4
Without Color  
Without Color  
Without Color  
Without Color  
Without Color  
Without Color  
Without Color  
Without Color  
11  
12  
8
4
MPBG00 PAD,LCD  
4
MPBT00 PAD,CAMERA  
MTAB00 TAPE,PROTECTION  
MTAB01 TAPE,PROTECTION  
MTAD00 TAPE,WINDOW  
MWAC00 WINDOW,LCD  
ACGM00 COVER ASSY,REAR  
ENZY00 CONNECTOR,ETC  
MCCF00 CAP,MOBILE SWITCH  
MCJN00 COVER,REAR  
MHGZ00 HOLDER  
4
1
4
13  
3
4
4
2
3
4
ENZY0019701 4 PIN,3.0 mm,ETC , ,H=5.8  
MCCF0042501 COMPLEX, (empty), , , , ,  
MCJN0065501 MOLD, PC LUPOY SC-1004A, , , , ,  
MHGZ0028701 COMPLEX, (empty), , , , ,  
MLAB0001102 C2000 USASV DIA 4.0  
MLAN0000603 White,95C  
24  
29  
28  
22  
27  
4
Black  
Without Color  
Black  
4
4
4
MLAB00 LABEL,A/S  
White  
4
MLAN00 LABEL,QUALCOMM  
MPBH00 PAD,MIKE  
Transparent  
Black  
4
MPBH0029101 COMPLEX, (empty), , , , ,  
MPBN0039001 CUTTING, NS, , , , ,  
26  
18  
19  
25  
4
MPBN00 PAD,SPEAKER  
MPBZ00 PAD  
Black  
4
MPBZ0186001 COMPLEX, (empty), , , , ,  
MPBZ0186801 COMPLEX, (empty), , , , ,  
Without Color  
Without Color  
4
MPBZ01 PAD  
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11. EXPLODED VIEW & REPLACEMENT PART LIST  
Location  
Level  
Description  
Part Number  
Spec  
Color  
Remark  
32  
No.  
4
4
4
MTAB01 TAPE,PROTECTION  
MTAB0178301 COMPLEX, (empty), , , , ,  
Without Color  
Without Color  
Without Color  
MTAD00 TAPE,WINDOW  
MTAD0065901 COMPLEX, (empty), 0.2, , , ,  
MWAE0024501 COMPLEX, (empty), 1.0, , , ,  
30  
MWAE00 WINDOW,CAMERA  
31  
4
4
SJMY00 VIBRATOR,MOTOR  
SJMY0007903 3 V,0.85 A,4*8 ,Height 5.8T Cylinder ,; ,3V , , ,11000 , , , ,  
23  
3.0 ,-2 dBd, ,EGSM+DCS+PCS+W-BAND I, INTERNAL ,;  
,QUAD ,-2.0 ,50 ,3.0  
SNGF00 ANTENNA,GSM,FIXED  
SNGF0023102  
20  
34  
3
6
6
5
5
5
MLAA00 LABEL,APPROVAL  
MCBA00 CAN,SHIELD  
MPBZ00 PAD  
MLAA0042001 COMPLEX, (empty), , , , ,  
MCBA0017101 COMPLEX, (empty), , , , ,  
MPBZ0179301 COMPLEX, (empty), 0.6t, , , ,  
ADCA0064001  
Without Color  
Without Color  
Without Color  
Without Color  
Without Color  
Without Color  
16  
14  
ADCA00 DOME ASSY,METAL  
MTAZ00 TAPE  
MTAZ0186301 COMPLEX, (empty), 0.1, , , ,  
MLAZ0038301 PID Label 4 Array  
MLAZ00 LABEL  
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11. EXPLODED VIEW & REPLACEMENT PART LIST  
Note: This Chapter is used for reference, Part order  
11.2 Replacement Parts  
<Main component>  
is ordered by SBOM standard on GCSC  
Location  
No.  
Level  
Description  
Part Number  
Spec  
Color  
Remark  
33  
3
3
4
5
5
GMEY00 SCREW MACHINE,BIND  
GMEY0011201 1.4 mm,3 mm,MSWR3(BK) ,N ,+ ,NYLOK  
Without Color  
SAFY00 PCB ASSY,MAIN  
SAFY0196602  
15  
SAFB00 PCB ASSY,MAIN,INSERT  
ACKA00 CAN ASSY,SHIELD  
SUMY00 MICROPHONE  
SAFB0072901  
ACKA0002101  
Without Color  
17  
SUMY0010301 FPCB ,-42 dB,4*1.5T ,Standard Holder  
ASSY ,8 ohm,88 dB, mm,wire 15mm ,; , , , , , ,18*10*3T  
5
SUSY00 SPEAKER  
SUSY0026801  
,WIRE  
CMOS ,MEGA ,1.3M, Magnachip(1/4"), 8x8x5t, Socket  
5
5
5
4
5
SVCY00 CAMERA  
SVCY0014401  
Type  
SVCY01 CAMERA  
SVCY0014301 CMOS ,VGA ,Socket type  
MAIN ,176*220 (1.76") ,34*46.7*2.5(T) ,262k ,TFT ,TM  
SVLM0025001  
SVLM00 LCD MODULE  
SAFF00 PCB ASSY,MAIN,SMT  
,NT3916(Novatek) ,NTSC:60%  
SAFF0117802  
SAFC0088501  
PCB ASSY,MAIN,SMT  
BOTTOM  
SAFC00  
3.0 ,-2.0 dBd, ,Bluetooth, SMD, 8.0*2.0*1.2 ,; ,SINGLE ,-  
6
6
ANT103 ANTENNA,GSM,FIXED  
BAT300 BATTERY,CELL,LITHIUM  
SNGF0026001  
2.0 ,50 ,3.0  
2 V,0.5 mAh,CYLINDER ,Reflow type BB, Max T 1.67,  
phi 4.8, Pb-Free  
SBCL0001701  
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
C101  
C103  
C104  
C106  
C107  
C108  
C109  
C110  
C112  
C113  
C114  
C115  
C117  
C118  
C119  
CAP,CHIP,MAKER  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CHIP,MAKER  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CHIP,MAKER  
CAP,CHIP,MAKER  
CAP,CHIP,MAKER  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CHIP,MAKER  
CAP,CERAMIC,CHIP  
ECZH0000841 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP  
ECCH0001002 180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP  
ECCH0001002 180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP  
ECZH0000846 8.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP  
ECCH0000107 6 pF,50V,D,NP0,TC,1005,R/TP  
ECCH0001002 180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP  
ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP  
ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP  
ECZH0000816 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP  
ECCH0001002 180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP  
ECCH0000149 3.3 nF,50V,K,X7R,HD,1005,R/TP  
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP  
ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP  
ECZH0000816 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP  
ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP  
33 uF,10V ,M ,L_ESR ,2125 ,R/TP ,; , ,[empty] ,[empty] ,  
ECTZ0005603  
6
6
C121  
C122  
CAP,TANTAL,CHIP,MAKER  
CAP,CERAMIC,CHIP  
,[empty] , ,[empty] ,[empty] ,[empty] ,[empty]  
ECCH0000393 22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP  
- 161 -  
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11. EXPLODED VIEW & REPLACEMENT PART LIST  
Location  
Level  
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Description  
CAP,CERAMIC,CHIP  
CAP,CHIP,MAKER  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CHIP,MAKER  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CHIP,MAKER  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CHIP,MAKER  
CAP,TANTAL,CHIP  
CAP,CHIP,MAKER  
INDUCTOR,CHIP  
Part Number  
Spec  
Color  
Remark  
No.  
C123  
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP  
ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP  
ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP  
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP  
ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP  
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP  
ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP  
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP  
ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP  
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP  
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP  
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP  
ECZH0000844 68 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP  
ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP  
ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP  
ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP  
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP  
ECCH0000393 22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP  
ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP  
ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP  
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP  
ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP  
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP  
ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP  
ECZH0000802 1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP  
ECTH0002202 4.7 uF,10V ,M ,STD ,1608 ,R/TP  
ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP  
ELCH0001427 2.2 nH,S ,1005 ,R/TP ,Pb Free  
ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP  
ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP  
ECCH0000901 2.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP  
ECCH0000180 3.3 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP  
ECCH0000101 .5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP  
ECCH0000101 .5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP  
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP  
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP  
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP  
C124  
C126  
C127  
C128  
C129  
C130  
C131  
C132  
C134  
C135  
C136  
C139  
C140  
C141  
C142  
C143  
C144  
C147  
C149  
C150  
C151  
C152  
C153  
C154  
C155  
C156  
C157  
C158  
C159  
C161  
C162  
C164  
C165  
C170  
C171  
C172  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
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11. EXPLODED VIEW & REPLACEMENT PART LIST  
Location  
No.  
Level  
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Description  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CHIP,MAKER  
CAP,CHIP,MAKER  
CAP,CHIP,MAKER  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CHIP,MAKER  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CHIP,MAKER  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CHIP,MAKER  
CAP,CHIP,MAKER  
CAP,CERAMIC,CHIP  
CAP,TANTAL,CHIP,MAKER  
CAP,TANTAL,CHIP  
CAP,CHIP,MAKER  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CHIP,MAKER  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CHIP,MAKER  
CAP,CHIP,MAKER  
CAP,CHIP,MAKER  
Part Number  
Spec  
Color  
Remark  
C173  
C174  
C176  
C177  
C178  
C179  
C180  
C181  
C182  
C183  
C185  
C186  
C187  
C188  
C189  
C190  
C192  
C200  
C201  
C202  
C203  
C204  
C205  
C206  
C209  
C210  
C211  
C212  
C213  
C214  
C215  
C216  
C217  
C218  
C219  
C220  
C221  
ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP  
ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP  
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP  
ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP  
ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP  
ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP  
ECCH0005602 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP  
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP  
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP  
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP  
ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP  
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP  
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP  
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP  
ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP  
ECCH0000101 .5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP  
ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP  
ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP  
ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP  
ECZH0001211 220 nF,10V ,Z ,Y5V ,HD ,1005 ,R/TP  
ECZH0001211 220 nF,10V ,Z ,Y5V ,HD ,1005 ,R/TP  
ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP  
ECTZ0004701 4.7 uF,6.3V ,M ,STD ,1608 ,R/TP  
ECTH0003701 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP  
ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP  
ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP  
ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP  
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP  
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP  
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP  
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP  
ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP  
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP  
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP  
ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP  
ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP  
ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP  
- 163 -  
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11. EXPLODED VIEW & REPLACEMENT PART LIST  
Location  
Level  
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Description  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CHIP,MAKER  
Part Number  
Spec  
Color  
Remark  
No.  
C222  
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP  
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP  
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP  
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP  
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP  
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP  
ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP  
ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP  
ECCH0000147 2.2 nF,50V,K,X7R,HD,1005,R/TP  
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP  
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP  
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP  
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP  
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP  
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP  
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP  
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP  
ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP  
ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP  
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP  
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP  
ECCH0000161 33 nF,16V,K,X7R,HD,1005,R/TP  
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP  
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP  
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP  
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP  
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP  
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP  
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP  
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP  
ECCH0007801 4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP  
ECCH0007801 4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP  
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP  
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP  
ECCH0005602 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP  
ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP  
ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP  
C223  
C225  
C226  
C227  
C228  
C229  
C230  
C231  
C232  
C233  
C234  
C235  
C236  
C237  
C238  
C239  
C240  
C242  
C243  
C244  
C246  
C247  
C301  
C302  
C303  
C304  
C305  
C306  
C307  
C308  
C310  
C311  
C312  
C316  
C317  
C318  
CAP,CHIP,MAKER  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CHIP,MAKER  
CAP,CHIP,MAKER  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CHIP,MAKER  
CAP,CHIP,MAKER  
- 164 -  
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11. EXPLODED VIEW & REPLACEMENT PART LIST  
Location  
No.  
Level  
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Description  
CAP,CHIP,MAKER  
CAP,CHIP,MAKER  
CAP,CHIP,MAKER  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CHIP,MAKER  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CHIP,MAKER  
CAP,CHIP,MAKER  
CAP,CHIP,MAKER  
CAP,CHIP,MAKER  
CAP,CHIP,MAKER  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CHIP,MAKER  
CAP,CHIP,MAKER  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CHIP,MAKER  
CAP,CHIP,MAKER  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CHIP,MAKER  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CHIP,MAKER  
CAP,CERAMIC,CHIP  
Part Number  
Spec  
Color  
Remark  
C319  
C320  
C321  
C322  
C323  
C324  
C325  
C326  
C327  
C328  
C329  
C330  
C331  
C332  
C333  
C334  
C335  
C336  
C337  
C338  
C339  
C340  
C341  
C343  
C344  
C345  
C346  
C347  
C348  
C349  
C350  
C351  
C352  
C353  
C354  
C355  
C356  
ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP  
ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP  
ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP  
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP  
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP  
ECZH0000816 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP  
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP  
ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP  
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP  
ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP  
ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP  
ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP  
ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP  
ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP  
ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP  
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP  
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP  
ECCH0007801 4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP  
ECZH0000816 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP  
ECZH0000816 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP  
ECCH0005602 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP  
ECCH0005602 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP  
ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP  
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP  
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP  
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP  
ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP  
ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP  
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP  
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP  
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP  
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP  
ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP  
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP  
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP  
ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP  
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP  
- 165 -  
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11. EXPLODED VIEW & REPLACEMENT PART LIST  
Location  
Level  
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Description  
CAP,CHIP,MAKER  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,TANTAL,CHIP  
CAP,TANTAL,CHIP  
CAP,CERAMIC,CHIP  
CAP,CHIP,MAKER  
CAP,CERAMIC,CHIP  
CAP,CHIP,MAKER  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CHIP,MAKER  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,TANTAL,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,TANTAL,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CHIP,MAKER  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CHIP,MAKER  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,TANTAL,CHIP  
Part Number  
Spec  
Color  
Remark  
No.  
C357  
ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP  
ECCH0000393 22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP  
ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP  
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP  
ECTH0004402 33 uF,6.3V ,M ,L_ESR ,2012 ,R/TP  
ECTH0004402 33 uF,6.3V ,M ,L_ESR ,2012 ,R/TP  
ECCH0002002 47000 pF,10V ,K ,B ,HD ,1005 ,R/TP  
ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP  
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP  
ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP  
ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP  
ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP  
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP  
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP  
ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP  
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP  
ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP  
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP  
ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP  
ECTH0003701 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP  
ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP  
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP  
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP  
ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP  
ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP  
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP  
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP  
ECTH0001902 10 uF,10V ,M ,L_ESR ,1608 ,R/TP  
ECCH0000152 5.6 nF,25V,K,X7R,HD,1005,R/TP  
ECCH0000152 5.6 nF,25V,K,X7R,HD,1005,R/TP  
ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP  
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP  
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP  
ECZH0001121 470 pF,50V ,K ,X7R ,HD ,1005 ,R/TP  
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP  
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP  
ECTH0001903 22 uF,6.3V ,M ,L_ESR ,1608 ,R/TP  
C358  
C389  
C400  
C401  
C402  
C403  
C404  
C405  
C406  
C407  
C408  
C409  
C410  
C411  
C412  
C413  
C414  
C415  
C416  
C417  
C418  
C419  
C420  
C421  
C422  
C423  
C425  
C426  
C427  
C428  
C429  
C430  
C432  
C433  
C434  
C435  
- 166 -  
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11. EXPLODED VIEW & REPLACEMENT PART LIST  
Location  
No.  
Level  
Description  
CAP,CERAMIC,CHIP  
CAP,CHIP,MAKER  
CAP,CHIP,MAKER  
CAP,CHIP,MAKER  
CAP,CHIP,MAKER  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
CAP,CERAMIC,CHIP  
Part Number  
Spec  
Color  
Remark  
6
6
6
6
6
6
6
6
6
6
C436  
C437  
C438  
C439  
C440  
C441  
C442  
C443  
C444  
C445  
ECCH0005604 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP  
ECZH0000802 1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP  
ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP  
ECZH0000806 5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP  
ECZH0000806 5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP  
ECCH0000185 5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP  
ECCH0000185 5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP  
ECCH0000185 5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP  
ECCH0000901 2.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP  
ECCH0000901 2.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP  
33 uF,10V ,M ,L_ESR ,2125 ,R/TP ,; , ,[empty] ,[empty] ,  
,[empty] , ,[empty] ,[empty] ,[empty] ,[empty]  
6
C446  
CAP,TANTAL,CHIP,MAKER  
ECTZ0005603  
6
6
6
6
6
C447  
C450  
CAP,CHIP,MAKER  
CAP,CERAMIC,CHIP  
CONNECTOR,FFC/FPC  
CONNECTOR,I/O  
ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP  
ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP  
ENQY0010901 35 PIN,0.3 mm,ETC , ,H=1.2  
ENRY0006401 18 PIN,0.4 mm,ANGLE , ,H=2.5, Reverse Type  
ENSY0020101 24 PIN,ETC , ,0.9 mm,  
CN400  
CN401  
CN403  
CONN,SOCKET  
EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) ,  
IR=30uA(VR=10V)  
6
D400  
DIODE,SWITCHING  
EDSY0011901  
6
6
6
6
D401  
D402  
D403  
D404  
DIODE,TVS  
DIODE,TVS  
DIODE,TVS  
DIODE,TVS  
EDTY0007401 SMD ,12 V,350 W,R/TP ,  
EDTY0008610 SOD-523 ,5 V,250 W,R/TP ,PB-FREE  
EDTY0008601 SOD-323 ,6 V,400 W,R/TP ,PB-FREE  
EDTY0008601 SOD-323 ,6 V,400 W,R/TP ,PB-FREE  
897.5 MHz,1.4*1.1*0.6 ,SMD ,Pb-  
SFSY0030201  
6
6
FL101  
FL102  
FILTER,SAW  
FILTER,SAW  
free_SAW_GSM900_Tx  
1950 MHz,1.4*1.1*0.62 ,SMD ,RF Filter for WCDMA  
SFSY0031101  
2Ghz ,; ,1950 ,1.4*1.1*0.62 ,SMD ,P/TR  
2140 MHz,1.4*1.1*0.62 ,SMD ,2110M~2170M, IL 2.0,  
SFSY0031201 5pin, U-B, 50-100_10, WCDMA BAND I Rx ,; ,2140  
,1.4*1.1*0.62 ,SMD ,R/TP  
6
6
FL103  
FL104  
FILTER,SAW  
1950 MHz,2140 MHz,1.6 dB,2.0 dB,53 dB,44  
SDMY0001301 dB,3.0*2.5*1.2 ,SMD ,FBAR, WCDMA duplexer ,; ,2140  
,44 ,1950 ,53 ,2.0 ,1.6 ,3.0X2.5X1.2 ,DUAL ,SMD ,R/TP  
DUPLEXER,IMT  
SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF),  
6
6
6
FL400  
FL401  
FL402  
FILTER,EMI/POWER  
FILTER,EMI/POWER  
FILTER,EMI/POWER  
SFEY0007103  
Pb-free  
SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF),  
SFEY0007103  
Pb-free  
SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF),  
SFEY0007103  
Pb-free  
SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF),  
6
6
FL403  
FL404  
FILTER,EMI/POWER  
FILTER,EMI/POWER  
SFEY0007103  
Pb-free  
SFEY0006001 SMD ,  
- 167 -  
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11. EXPLODED VIEW & REPLACEMENT PART LIST  
Location  
No.  
Level  
Description  
Part Number  
Spec  
Color  
Remark  
SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF),  
Pb-free  
6
FL405  
FILTER,EMI/POWER  
SFEY0007103  
SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF),  
Pb-free  
6
6
6
FL406  
FL407  
FL408  
FILTER,EMI/POWER  
FILTER,EMI/POWER  
FILTER,EMI/POWER  
SFEY0007103  
SFEY0007103  
SFEY0007103  
SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF),  
Pb-free  
SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF),  
Pb-free  
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
J300  
L102  
L108  
L111  
L114  
L115  
L116  
L119  
L120  
L121  
L123  
L125  
L128  
L300  
L301  
L302  
L305  
L400  
L401  
L402  
L403  
L404  
L405  
L406  
L407  
L408  
L409  
L410  
L411  
M100  
Q300  
CONN,SOCKET  
ENSY0019201 8 PIN,ETC ,8Pin ,2.54 mm,Korean 8Pin Stopper UIM  
ELCH0005009 100 nH,J ,1005 ,R/TP ,  
INDUCTOR,CHIP  
INDUCTOR,CHIP  
INDUCTOR,CHIP  
INDUCTOR,CHIP  
INDUCTOR,CHIP  
INDUCTOR,CHIP  
INDUCTOR,CHIP  
INDUCTOR,CHIP  
INDUCTOR,CHIP  
INDUCTOR,CHIP  
INDUCTOR,CHIP  
INDUCTOR,CHIP  
INDUCTOR,SMD,POWER  
INDUCTOR,SMD,POWER  
INDUCTOR,CHIP  
INDUCTOR,SMD,POWER  
INDUCTOR,CHIP  
INDUCTOR,CHIP  
INDUCTOR,CHIP  
INDUCTOR,CHIP  
INDUCTOR,CHIP  
INDUCTOR,CHIP  
INDUCTOR,CHIP  
INDUCTOR,CHIP  
INDUCTOR,CHIP  
INDUCTOR,CHIP  
INDUCTOR,CHIP  
INDUCTOR,CHIP  
MODULE,ETC  
ELCH0001031 15 nH,J ,1005 ,R/TP ,PBFREE  
ELCH0004718 5.6 nH,S ,1005 ,R/TP ,  
ELCH0003813 47 nH,J ,1005 ,R/TP ,COIL TYPE  
ELCH0001032 18 nH,J ,1005 ,R/TP ,PBFREE  
ELCH0001041 10 nH,S ,1005 ,R/TP ,PBFREE  
ELCH0003813 47 nH,J ,1005 ,R/TP ,COIL TYPE  
ELCH0003813 47 nH,J ,1005 ,R/TP ,COIL TYPE  
ELCH0005020 1 nH,S ,1005 ,R/TP ,  
ELCH0005020 1 nH,S ,1005 ,R/TP ,  
ELCH0001410 12 nH,J ,1005 ,R/TP ,Pb Free  
ELCH0005010 1.8 nH,S ,1005 ,R/TP ,  
ELCP0008001 4.7 uH,M ,2.5*2.0*1.0 ,R/TP ,  
ELCP0008001 4.7 uH,M ,2.5*2.0*1.0 ,R/TP ,  
ELCH0001550 56 nH,J ,1608 ,R/TP ,  
ELCP0008001 4.7 uH,M ,2.5*2.0*1.0 ,R/TP ,  
ELCH0003825 56 nH,J ,1005 ,R/TP ,chip inductor,PBFREE  
ELCH0005009 100 nH,J ,1005 ,R/TP ,  
ELCH0005009 100 nH,J ,1005 ,R/TP ,  
ELCH0001033 1.5 nH,S ,1005 ,R/TP ,PBFREE  
ELCH0005010 1.8 nH,S ,1005 ,R/TP ,  
ELCH0005002 2.7 nH,S ,1005 ,R/TP ,  
ELCH0005002 2.7 nH,S ,1005 ,R/TP ,  
ELCH0005002 2.7 nH,S ,1005 ,R/TP ,  
ELCH0001041 10 nH,S ,1005 ,R/TP ,PBFREE  
ELCH0001035 4.7 nH,S ,1005 ,R/TP ,PBFREE  
ELCH0001035 4.7 nH,S ,1005 ,R/TP ,PBFREE  
ELCH0001035 4.7 nH,S ,1005 ,R/TP ,PBFREE  
SMZY0012601 4.5x3.2x1.2 Bluetooth RF Module  
EQBP0009901 TSMT6 ,0.5 W,R/TP ,Vceo=-12V, Ic=-3A, hFE=270~680  
TR,BJT,PNP  
- 168 -  
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11. EXPLODED VIEW & REPLACEMENT PART LIST  
Location  
No.  
Level  
Description  
Part Number  
Spec  
Color  
Remark  
TSOP6 ,1.5 W,20 V,-5 A,R/TP ,P-CHANNEL 20-V(D-S)  
MOSFET, Pb free  
6
Q301  
TR,FET,P-CHANNEL  
EQFP0004701  
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Q302  
R100  
R101  
R103  
R104  
R105  
R106  
R107  
R108  
R109  
R110  
R111  
R112  
R113  
R114  
R115  
R116  
R117  
R118  
R119  
R120  
R121  
R122  
R123  
R124  
R128  
R201  
R202  
R204  
R205  
R207  
R208  
R209  
R211  
R213  
TR,BJT,PNP  
EQBP0009901 TSMT6 ,0.5 W,R/TP ,Vceo=-12V, Ic=-3A, hFE=270~680  
ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000212 12 Kohm,1/16W ,F ,1005 ,R/TP  
ERHZ0000310 680 ohm,1/16W ,F ,1005 ,R/TP  
ERHZ0003801 5.1 ohm,1/16W ,J ,1005 ,R/TP  
ERHZ0003801 5.1 ohm,1/16W ,J ,1005 ,R/TP  
ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000517 91 ohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000517 91 ohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000473 39 ohm,1/16W ,J ,1005 ,R/TP  
ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP  
ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP  
ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP  
ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP  
ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000415 130 ohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000415 130 ohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP  
ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000222 150 Kohm,1/16W ,F ,1005 ,R/TP  
ERHZ0000469 36 ohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000437 2 Kohm,1/16W ,J ,1005 ,R/TP  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP  
RES,CHIP  
RES,CHIP  
RES,CHIP  
RES,CHIP  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
- 169 -  
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11. EXPLODED VIEW & REPLACEMENT PART LIST  
Location  
Level  
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Description  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP  
Part Number  
Spec  
Color  
Remark  
No.  
R214  
ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP  
ERHZ0004201 121000 ohm,1/16W ,F ,1005 ,R/TP  
ERHZ0000487 470 Kohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP  
ERHY0008602 0.1 ohm,1/4W ,J ,2012 ,R/TP  
ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000422 15 Kohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000487 470 Kohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000530 5.1 Kohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000407 1000 Kohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP  
ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP  
ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000288 470 Kohm,1/16W ,F ,1005 ,R/TP  
ERHZ0000537 680000 ohm,1/16W ,F ,1005 ,R/TP  
ERHZ0000318 80.6 Kohm,1/16W ,F ,1005 ,R/TP  
ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000438 20 Kohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000499 5600 ohm,1/16W ,J ,1005 ,R/TP  
R215  
R300  
R301  
R302  
R303  
R304  
R305  
R306  
R307  
R308  
R309  
R313  
R314  
R315  
R316  
R317  
R318  
R380  
R400  
R401  
R402  
R403  
R404  
R405  
R406  
R407  
R408  
R409  
R410  
R421  
R422  
R424  
R425  
R426  
R427  
R428  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP  
RES,CHIP  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
- 170 -  
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11. EXPLODED VIEW & REPLACEMENT PART LIST  
Location  
No.  
Level  
Description  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP  
Part Number  
Spec  
Color  
Remark  
6
6
6
6
6
6
6
6
6
R429  
R430  
R431  
R433  
R434  
R435  
R436  
R437  
RA400  
ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000499 5600 ohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000438 20 Kohm,1/16W ,J ,1005 ,R/TP  
ERHY0013101 2.7 ohm,1/16W ,J ,1005 ,R/TP  
ERHY0013101 2.7 ohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000487 470 Kohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000435 20 ohm,1/16W ,J ,1005 ,R/TP  
ERNR0000404 100 Kohm,100 Kohm,8 PIN,J ,1/16W ,SMD ,R/TP  
RES,CHIP  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,CHIP,MAKER  
RES,ARRAY,R  
8 PIN,ETC ,PUSH-PUSH TYPE / RECTANGULAR ,1.1  
ENSY0013501 mm,TRANS FLASH SOCKET / EXTERNAL MEMORY  
CARD SOCKET  
6
S300  
CONN,SOCKET  
6
6
SW100 CONN,RF SWITCH  
ENWY0003301 ,SMD ,0.4 dB,  
TR100  
U100  
TR,BJT,ARRAY  
IC  
EQBA0000601 UMT5 ,.2 W,R/TP ,  
QFN ,56 PIN,R/TP ,GSM, WCDMA Single RF  
EUSY0300501  
6
Transceiver, 8X8X0.9  
QFN ,56 PIN,R/TP ,chartered,GSM, WCDMA Single RF  
EUSY0300502  
IC  
Transceiver, 8X8X0.9 ,; ,IC,Tx/Rx  
6
6
U101  
U102  
PAM  
SMPY0014001 35.5 dBm,56 %, A, dBc, dB,6x6x1.15 ,SMD ,Tri Band  
COUPLER,RF  
DIRECTIONAL  
-18 dB,-.25 dB,-33 dB,1.0*0.58*0.35 ,SMD ,1920M ~  
SCDY0003403  
1980M, 4pin, Pb Free , ,[empty] , , ,SMD ,R/TP  
6
6
6
6
U103  
U104  
U201  
U300  
PAM  
IC  
SMPY0014201 28 dBm,40 %,465 mA,-44 dBc,26.5 dB,4x4x1.1 ,SMD ,  
EUSY0073401 SSOP5-P-0.65A ,5 PIN,R/TP ,INVERTER, Pb Free  
EUSY0318401 CSP ,409 PIN,R/TP ,WEDGE Baseband Platform  
EUSY0306302 BCCS ,84 PIN,R/TP ,7x7, MSMC(1.2V), pbfree  
IC  
IC  
FBGA ,137 PIN,ETC ,512M(64Mx8)  
EUSY0332001  
6
6
6
U301  
U302  
U303  
IC  
IC  
IC  
NAND+512M(16Mx32) SDRAM , ,IC,MCP  
EUSY0232812 SON1612-6 ,6 PIN,R/TP ,2.8V, 150mA LDO  
WDFN-8L ,8 PIN,R/TP ,300mA/300mA 2.8V/1.8V Dual  
EUSY0319001  
LDO  
TSOPJW-12 ,12 PIN,R/TP ,3PORT Charge  
EUSY0238702  
6
6
U305  
U400  
IC  
IC  
Pump(AAT2154 Low cost version)  
SC70 ,5 PIN,R/TP ,Comparator, pin compatible to  
EUSY0250501  
EUSY0077701  
WQFN ,10 PIN,R/TP ,Small package Dual SPDT analog  
6
6
6
U401  
U402  
U500  
IC  
EUSY0300101  
Switch, PB-Free  
IC  
EUSY0176401 MICRO8 ,8 PIN,R/TP ,1W AUDIO AMPLIFIER  
900.1800 ,1900.2100 , dB, dB, dB, dB,ETC ,1800GSM  
SFAY0007402  
FILTER,SEPERATOR  
Quad, WCDMA2100 FEM, 5.4X4.0X1.2, Improved D5006  
HVSOF5 ,5 PIN,R/TP ,150mA CMOS LDO WITH  
EUSY0223001  
6
U501  
IC  
OUTPUT CONTROL / 1.5V  
6
6
VA300  
VA301  
VARISTOR  
VARISTOR  
SEVY0004001 18 V, ,SMD ,3pF, 1005  
SEVY0004201 14 V, ,SMD ,120pF, 1005  
- 171 -  
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11. EXPLODED VIEW & REPLACEMENT PART LIST  
Location  
Level  
Description  
VARISTOR  
Part Number  
Spec  
Color  
Remark  
No.  
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
VA302  
SEVY0004001 18 V, ,SMD ,3pF, 1005  
SEVY0004001 18 V, ,SMD ,3pF, 1005  
SEVY0004001 18 V, ,SMD ,3pF, 1005  
SEVY0004001 18 V, ,SMD ,3pF, 1005  
SEVY0004001 18 V, ,SMD ,3pF, 1005  
SEVY0004001 18 V, ,SMD ,3pF, 1005  
SEVY0004001 18 V, ,SMD ,3pF, 1005  
SEVY0004201 14 V, ,SMD ,120pF, 1005  
SEVY0004201 14 V, ,SMD ,120pF, 1005  
SEVY0004201 14 V, ,SMD ,120pF, 1005  
SEVY0004201 14 V, ,SMD ,120pF, 1005  
SEVY0004201 14 V, ,SMD ,120pF, 1005  
SEVY0004201 14 V, ,SMD ,120pF, 1005  
SEVY0004201 14 V, ,SMD ,120pF, 1005  
SEVY0004201 14 V, ,SMD ,120pF, 1005  
SEVY0004201 14 V, ,SMD ,120pF, 1005  
SEVY0004201 14 V, ,SMD ,120pF, 1005  
SEVY0004201 14 V, ,SMD ,120pF, 1005  
SEVY0004201 14 V, ,SMD ,120pF, 1005  
VA303  
VA304  
VA305  
VA306  
VA400  
VA401  
VA402  
VA403  
VA404  
VA405  
VA407  
VA408  
VA409  
VA410  
VA412  
VA414  
VA430  
VA490  
VARISTOR  
VARISTOR  
VARISTOR  
VARISTOR  
VARISTOR  
VARISTOR  
VARISTOR  
VARISTOR  
VARISTOR  
VARISTOR  
VARISTOR  
VARISTOR  
VARISTOR  
VARISTOR  
VARISTOR  
VARISTOR  
VARISTOR  
VARISTOR  
19.2 MHz,1.5 PPM,40 pF,SMD ,3.2*2.5*0.9 , ,; , ,1.5PPM  
,2.8V ,3.2 ,2.5 ,0.9 , ,SMD ,P/TP  
6
6
X100  
X300  
VCTCXO  
X-TAL  
EXSK0005703  
EXXY0004601  
.032768 MHz,20 PPM,7 pF,65000 ohm,SMD ,6.9*1.4*1.3  
,
5
6
6
6
6
6
6
6
6
6
6
6
6
6
6
SAFD00 PCB ASSY,MAIN,SMT TOP  
SAFD0087801  
ENSY0020001  
CN404  
LD400  
LD402  
LD403  
LD404  
LD405  
LD406  
LD407  
LD408  
R411  
CONN,SOCKET  
DIODE,LED,CHIP  
DIODE,LED,CHIP  
DIODE,LED,CHIP  
DIODE,LED,CHIP  
DIODE,LED,CHIP  
DIODE,LED,CHIP  
DIODE,LED,CHIP  
DIODE,LED,CHIP  
RES,CHIP  
EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED  
EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED  
EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED  
EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED  
EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED  
EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED  
EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED  
EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED  
ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP  
ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP  
ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP  
ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP  
ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP  
R413  
RES,CHIP  
R414  
RES,CHIP  
R415  
RES,CHIP  
R416  
RES,CHIP  
- 172 -  
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11. EXPLODED VIEW & REPLACEMENT PART LIST  
Location  
No.  
Level  
Description  
RES,CHIP  
Part Number  
Spec  
Color  
Remark  
6
6
6
6
6
R417  
R418  
R419  
R423  
ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP  
ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP  
ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP  
ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP  
SPFY0147601 FR-4 ,1.0 mm,BUILD-UP 8 ,  
RES,CHIP  
RES,CHIP  
RES,CHIP,MAKER  
SPFY00 PCB,MAIN  
- 173 -  
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11. EXPLODED VIEW & REPLACEMENT PART LIST  
Note: This Chapter is used for reference, Part order  
is ordered by SBOM standard on GCSC  
11.3 Accessory  
Location  
No.  
Level  
Description  
Part Number  
Spec  
Color  
Remark  
3.7 V,950 mAh,1 CELL,PRISMATIC ,KU250 Europe  
BATT, IP, Pb-Free ,; ,3.7 ,950 ,0.2C ,PRISMATIC  
,50x34x55 , ,BLACK ,Innerpack ,Europe Label  
BATTERY PACK,LI-ION  
3
3
SBPL00  
Black  
35  
SBPL0090501  
100-240V ,5060 Hz,5.1 V,.7 A,CE ,AC-DC ADAPTOR ,;  
,85Vac~264Vac ,5.1V +0.15V, -0.2V ,700mA ,5060 ,  
,WALL 2P ,I/O CONNECTOR ,  
ADAPTOR,AC-DC  
ADAPTOR,AC-DC  
ADAPTOR,AC-DC  
ADAPTOR,AC-DC  
SSAD00  
SSAD0024501  
100-240V ,5060 Hz,5.1 V,0.7 A,CE ,AC-DC ADAPTOR ,;  
,5.1V +0.15V, -0.2V ,5.1V ,700mA ,5060 , ,WALL 2P ,I/O  
CONNECTOR ,  
SSAD0024502  
SSAD0024503  
100-240V ,5060 Hz,5.2 V,0.7 A,CE ,AC-DC ADAPTOR ,;  
,85Vac~264Vac ,5.2 0.3V ,700mA ,5060 , ,WALL 2P ,I/O  
CONNECTOR ,  
100-240V ,5060 Hz,5.1 V,.7 A,CE ,AC-DC ADAPTOR ,;  
SSAD0024504 ,85Vac~264Vac ,5.1V(+0.15V, -0.2V) ,700mA ,5060 ,  
,WALL 2P ,I/O CONNECTOR ,  
- 174 -  
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Note  
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Note  
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