Huawei Sewing Machine EM820W User Manual

HUAWEI EM820W HSPA+ PC Embedded Module

Hardware Guide

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Date

2010-12-31

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HUAWEI EM820W HSPA+ PC Embedded Module

Hardware Guide

About This Document

History

Version Date

01 2010-12-31

Chapter Descriptions

Creation

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Hardware Guide

Contents

1 Introduction ......................................................................................................................................1

1.1 Overview ........................................................................................................................................ 1

2 Overall Description ..........................................................................................................................2

2.1 About This Chapter ....................................................................................................................... 2

2.2 Function Overvie w ........................................................................................................................ 2

2.3 Circuit Block Diagram ................................................................................................................... 3

2.4 Application Block Diagram ........................................................................................................... 4

3 Description of the Application Interfaces ......................................................................................5

3.1 About This Chapter ....................................................................................................................... 5

3.2 Mini PCI Express Interface .......................................................................................................... 5

3.3 Power Sources and Grounds ...................................................................................................... 8

3.4 Power Supply Time Sequence .................................................................................................... 8

3.5 USB Signals ................................................................................................................................... 9

3.6 USIM Signals ............................................................................................................................... 10

3.6.1 USIM Interface Schematic Referenc e ............................................................................ 10

3.6.2 Design Guide .......................................................................................................................11

3.6.3 Certification T e st ................................................................................................................ 13

3.7 W_DISABLE# Signal .................................................................................................................. 14

3.8 LED_WWAN# Signal .................................................................................................................. 14

3.9 WAKE_NB_N Signal .................................................................................................................. 16

3.10 NC Pin s ...................................................................................................................................... 16

4 RF Specifications ............................................................................................................................1 7

4.1 Operating Frequencies .............................................................................................................. 17

4.2 Conducted RF Measurement .................................................................................................... 17

4.2.1 T e st Environmen t ............................................................................................................... 17

4.2.2 T e st Standards .................................................................................................................... 18

4.3 Conducted Rx Sensitivity and Tx Powe r ................................................................................. 18

4.3.1 Conducted Receive Sensitivit y ........................................................................................ 18

4.3.2 Conducted Transmit Power .............................................................................................. 19

4.4 Antenna Design Requirement s ................................................................................................. 20

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Contents

4.4.1 Antenna Design Indicators ............................................................................................... 20

4.4.2 Interference ......................................................................................................................... 23

4.4.3 GSM/WCDMA Antenna Requirements ........................................................................... 23

4.4.4 Radio T e st Environment .................................................................................................... 24

4.5 Design Recommendations ........................................................................................................ 25

4.5.1 Recommendations for Designing the Module Antennas ............................................. 25

4.6 ESD Protection for the Antenna Interfac e ............................................................................... 26

5 Electrical and Reliability Features ................................................................................................2 8

5.1 About This Chapter ..................................................................................................................... 28

5.2 Extreme Working Conditions .................................................................................................... 28

5.3 Working and Storage T e mperatures and Humidit y ................................................................ 28

5.4 Electrical Criteria of Application Interfaces ............................................................................. 29

5.5 Power Supply Features ............................................................................................................. 30

5.5.1 Power Supply ..................................................................................................................... 30

5.5.2 Power Consumptio n .......................................................................................................... 30

5.6 Reliability Feature s ..................................................................................................................... 33

5.7 EMC and ESD Feature s ............................................................................................................ 35

6 Mechanical Specification s .............................................................................................................3 6

6.1 Dimensions and Interfaces ........................................................................................................ 36

6.1.1 Dimensions and Interfaces of EM820W ......................................................................... 36

6.2 Dimensions of the Mini PCI Express Connector .................................................................... 36

6.3 Specification Selection for Fasteners ...................................................................................... 37

6.3.1 Installing the EM820W on the Main Board of PC ......................................................... 37

6.3.2 Romoving the EM820W from the Main Board of PC .................................................... 39

7 Appendix A Circuits of Typical Interface s ...................................................................................4 0

8 Appendix B Acronyms and Abbreviations ...................................................................................4 1

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Tables

Table 2-1 Feature ................................................................................................................................ 2

Table 3-1 Pin definitions of the Mini PCI-E Interface ..................................................................... 5

Table 3-2 Power and ground specification s .................................................................................... 8

Table 3-3 USB pins ............................................................................................................................. 9

Table 3-4 USB signal DC characteristics ........................................................................................ 9

Table 3-5 USIM pin s ......................................................................................................................... 10

Table 3-6 SIM RST requirement s ................................................................................................... 12

Table 3-7 SIM CLK requirements ................................................................................................... 12

Table 3-8 SIM IO requirements ....................................................................................................... 13

Table 3-9 W_DISABLE_N signa l .................................................................................................... 14

Table 3-10 Radio operational states .............................................................................................. 14

Table 3-11 LED_WWAN signa l ....................................................................................................... 15

Table 4-1 RF bands .......................................................................................................................... 17

Table 4-2 EM820W conducted Rx sensitivity ............................................................................... 18

Table 4-3 EM820W conducted Tx powe r ...................................................................................... 19

Table 4-4 Isolation between the master antenna and the Wi-Fi antenna ................................. 21

Table 4-5 GSM/WCDMA antenna requirements .......................................................................... 23

Table 5-1 Working and storage temperatures and humidity for the EM820W module .......... 29

Table 5-2 Electrical features of application interfaces ................................................................. 29

Table 5-3 Power requirement s ........................................................................................................ 30

Table 5-4 DC power consumption (HSPA/WCDMA) ................................................................... 30

Table 5-5 DC power consumption (GSM/GPRS/EDGE) ............................................................ 31

Table 5-6 DC power consumption(Idle and Suspend) ................................................................ 33

Table 5-7 Test conditions and results of the mechanical reliability of the EM820W module. 33

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Figures

Figure 2-1 Circuit block diagram of the EM820W module ........................................................... 4

Figure 2-2 Application block diagram of the EM820W module ................................................... 4

Figure 3-1 HUAWEI EM820W power supply time sequence. ..................................................... 9

Figure 3-2 USIM interface schematic on PC.................................................................................11

Figure 3-3 Pin definition of the SIM card Socket..........................................................................11

Figure 3-4 LED_WWAN# signal reference circuit diagram........................................................ 15

Figure 3-5 LED typical electro-optical characteristics curves.................................................... 16

Figure 4-1 SATIMO microwave testing chamber......................................................................... 25

Figure 4-2 Recommended antenna positions.............................................................................. 26

Figure 4-3 ESD protection circuit recommended for the antenna interface ............................ 27

Figure 6-1 Dimensions of the EM820W........................................................................................ 36

Figure 6-2 Dimensions of the Mini PCI Express connector ....................................................... 37

Figure 7-1 Circuits of typical interfaces in the EM820W module .............................................. 40

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Introduction

1.1 Overview

This document describes the hardware application interfaces and air interfaces that

are provided when the Huawei EM820W HSPA+ PC Embedded module (hereinafter

referred to as the EM820W module) is used.

This document helps you to understand the interface specifications, electrical

features, and related product information of the EM820W module. To facilitate its use

in different fields, relevant development guides document are also provided with the

module, which can be obtained through Huawei website.

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Overall Description

2.1 About This Chapter

This chapter gives a general description of the EM820W module and provides:

Function Overview

Circuit Block Diagram

Application Block Diagram

2.2 Function Overview

Table 2-1 Feature

Feature

Description

GSM/GPRS/EDGE 850/900/1800/1900 (MHz)

Working bands

HSPA+/HSUPA/HSDPA/WCDMA 2100/1900/900/850 (MHz)

Normal working temperature: –10°C to +55°C

Working

Extreme working temperatures: –20°C to –10°C and +55°C to

+70°C

temperature

Ambient

–40°C to 85°C

temperature for

storage

Power voltage

AT commands

Application

3.3 V±9 %(3.3 V is recommended)

See the HUAWEI EM820W HSPA+ PC Embedded Module

Software Guide Specification.

One standard Subscriber Identity Module (SIM) card interface (3

interface (52pin V or 1.8 V)

Mini PCI-E

interface)

USB 2.0 (high speed)

WAKE#: Wake up signal

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Overall Description

Feature

Description

W_Disable#: for turning on/off the RF signal.

LED_WWAN#: Active-low LED signal indicating the state of the

card

Power Interface

New message alert, receiving and sending text messages

Management of text messages: read messages, delete

messages, storage status, and message list

SMS

Support for the protocol data unit (PDU) mode

GSM CS: 9.6/14.4 kbps

GPRS/EDGE: Multi-slot Class 12, Class B

WCDMA CS: UL 64kbps/DL 64kbps

Data services

WCDMA/HSDPA PS: UL384kbps/DL3.6Mbps, HSDPA Category

6, 8, 9, 10, 12, 14

HSPA+ Rel7

Dimensions (L × W × H): 50.95 mm × 30 mm × 4.5 mm

Weight: < 15 g

Physical

features

Restriction of the use of certain Hazardous Substances (RoHS),

European Conformity (CE), Federal Communications

Commission (FCC)

Certification

information

2.3 Circuit Block Diagram

Figure 2-1 shows the circuit block diagram of the EM820W module. The application

block diagram and major functional units of the EM820W module contain the

following parts:

Mobile data modem

Power management

Multi-chip package (MCP) memory

Radio frequency (RF) transceiver

RF front-end modules

Receive filter

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Overall Description

Figure 2-1 Circuit block diagram of the EM820W module

2.4 Application Block Diagram

Figure 2-2 Application block diagram of the EM820W module

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Description of the Application Interfaces

3.1 About This Chapter

This chapter mainly describes the external application interfaces of the EM820W

module, including:

Mini PCI Express Interface

Power Sources and Grounds

Power Supply Time Sequence

USB Signals

USIM Signals

W_DISABLE# Signal

LED_WWAN# Signal

WAKE_NB_N Signal

NC Pins

3.2 Mini PCI Express Interface

The EM820W has a standard Mini PCI Express interface, which consists of several

major signals, as shown in the following table.

Table 3-1 Pin definitions of the Mini PCI-E Interface

Definition of the EM820W Mini PCI Express pins

No.

Mini PCI

Express

HUAWEI Pin

Description

Additional

Description

Direction to

Module

Standard

Description

WAKE#

WAKE_NB_N

Open collector active

low signal. This signal

is used to wake up the

host.

Output

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Definition of the EM820W Mini PCI Express pins

No.

Mini PCI

Express

HUAWEI Pin

Description

Additional

Description

Direction to

Module

Standard

Description

3.3Vaux

VCC_3V3

3.3 V DC supply rails

from the PC side.

Input

COEX1

GND

Not connected.

Mini Card ground.

Not connected.

GND

COEX2

1.5 V

CLKREQ#

UIM_PWR

Power source for the

external UIM/SIM

card.

Output

GND

Mini Card ground.

UIM_DATA

External UIM/SIM

data signal.

Input/output

REFCLK-

UIM_CLK

Not connected.

UIM_CLK

External UIM/SIM

clock signal.

Output

REFCLK+

Not connected.

UIM_RESET

External UIM/SIM

reset signal.

Output

GND

Mini Card ground.

Not connected.

Mini Card ground.

Not connected.

UIM_Vpp

Reserved

GND

Reserved

W_DISABLE#

W_DISABLE_N For ending the

wireless

Input

communications.

GND

Mini Card ground.

Not connected.

PERST#

PERn0

3.3Vaux

3.3V DC supply rail

from the PC side.

Input

VCC_3V3

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Definition of the EM820W Mini PCI Express pins

No.

Mini PCI

Express

HUAWEI Pin

Description

Additional

Description

Direction to

Module

Standard

Description

Not connected.

Mini Card ground.

Not connected.

Mini Card ground.

Not connected.

Mini Card ground.

USB signal D-.

PERp0

GND

1.5 V

GND

SMB_CLK

PETn0

SMB_DATA

PETp0

GND

USB_D-

GND

USB_D+

VCC_3V3

GND

Input/output

USB_D-

GND

Mini Card ground.

USB signal D+.

Input/output

Input

USB_D+

3.3Vaux

3.3V DC supply rail

from the PC side.

Mini Card ground.

GND

3.3V DC supply rail

from the PC side.

Input

3.3Vaux

VCC_3V3

Active-low LED signal Output

indicating the state of

the card.

LED_WWAN# LED_WWAN

Mini Card ground.

Not connected.

GND

LED_WLAN#

Reserved

LED_WPAN# NC

Reserved

1.5 V

Reserved

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Definition of the EM820W Mini PCI Express pins

No.

Mini PCI

Express

HUAWEI Pin

Description

Additional

Description

Direction to

Module

Standard

Description

GND

Mini Card Ground.

Not connected.

Reserved

3.3Vaux

VCC_3V3

3.3V DC supply rail

from the PC side.

Input

3.3 Power Sources and Grounds

The PCI Express Mini Card provides two power sources: one is 3.3 Vaux (+3.3 Vaux)

and the other is 1.5 V (+ 1.5 V). For the EM820W, however, +3.3 Vaux is the only

voltage supply that is available. The input voltage is 3.3 V±9%, as specified by PCI

Express Mini CEM Specifications 1.2.

Table 3-2 Power and ground specifications

Name

Pins

Minimum Type

Maximum

VCC

2, 24,39, 41, and 52

3.0 V

0 V

3.3 V

3.6 V

GND

4, 9, 15, 18, 21, 26, 27, 29, 34,

35, 37, 40, 43, and 50

To minimize the RF radiation through the power lines, it is suggested to add ceramic capacitors

of 10pF and 100nF in the ground beside the Mini PCI Express connector on the host side.

3.4 Power Supply Time Sequence

Figure 3-1 shows the PCIE with 3.3 V voltage and USB D+ power supply time

sequence.

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Description of the Application Interfaces

Figure 3-1 HUAWEI EM820W power supply time sequence.

Parameter Remarks

Time(Nominal value)

3.24

Unit

Tpd

Power Valid to USB D+ high

sec

3.5 USB Signals

The EM820W is compliant with USB 2.0 specification. It supports full-speed (12

Mbit/s) and high-speed (480 Mbit/s) modes when acting as a peripheral and supports

low-speed, full-speed, and high-speed modes when acting as a host. The USB 2.0

specifications allow peripherals to support any one or more of these speeds. To

ensure best performance, the PC USB host controller should support high-speed

mode when using the EM820W USB high-speed mode.

Table 3-3 USB pins

Name

Description

Direction to Module

Input/output

USB D-

USB D+

USB data signal D-

USB data signal D+

Input/output

To minimize the RF radiation through the PCI-E interface, you can add a 33 pF ceramic

capacitor in the ground on every pin of the PCI-E on the host side except USB D+/D-.

The USB interface is powered directly from the 3.3 V supply. The USB input/output

lines are compatible with the USB2.0 3.3 V signal specifications.

Table 3-4 USB signal DC characteristics

VOHmin VOLmax

2.8 V 0.3 V

VIHmin

VILmax

2 V

0.8 V

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The high-speed signal characteristics are in accordance with the Eye Pattern

Templates of the USB2.0 signal specification.

3.6 USIM Signals

The USIM is a smart card for UMTS/GSM cellular applications. The USIM provides

the required subscription information to allow mobile equipment to attach to a GSM or

UMTS network. The USIM also provides the subscriber's verification procedures as

well as authentication methods for network authentication during the process of

attaching to a network.

Table 3-5 USIM pins

Pin Name

Description

Direction to Module

UIM_PWR

Power source for the external

UIM/SIM.

Output

UIM_DATA

UIM_CLK

External UIM/SIM data signal.

External UIM/SIM clock signal.

Input/output

Output

UIM_RESET External UIM/SIM reset signal.

Output

It is recommended that the SIM card is inserted only after the power supply of the module is

disconnected; otherwise the SIM card may get destroyed.

3.6.1 USIM Interface Schematic Reference

There is no SIM card interface circuit in the EM820W module, and users need to add

the USIM interface circuit. Figure 3-2 shows the definition of interface signals and the

typical USIM interface schematic.

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Description of the Application Interfaces

Figure 3-2 USIM interface schematic on PC

Figure 3-3 Pin definition of the SIM card Socket

pin1:

pin2:

pin3:

SIM_VCC

SIM_RESET

SIM_CLK

pin4:

GND

pin5:

pin6:

NULL

SIM_DATA

3.6.2 Design Guide

The USIM signals are connected to the Mini PCI Express card connector (the card

edge connector) and pass through an EMI filtering and ESD protection circuit on the

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Description of the Application Interfaces

module board before entering the EM820W processor. There is also an EMI filtering

and ESD protection circuit between the SIM card interface and the Mini PCI interface

on the user’s board.

Power supply

The SIM card interface is powered by an internal LDO regulator of EM820W.

The default value of this regulator is 2.85 V. The power of the regulator is

programmable in the range of 1.5 V to 3.05 V and is expected to be set to 3.0 V

or 1.8 V.

Modem signals

After a power-on or reset, the USIM signals are activated to detect if a SIM card

is present and to initialize it if it exists. Once a SIM card has been detected and

initialized, the interface is always on. However, the clock signal is only activated

when data is actually being transmitted. The USIM signals from the module are

connected to the level translators, and then to the Mini Card host connector.

−

The UIM_DETECT pin is optional, depending on whether this function is

required.

−

For UIM_DATA, it does not need to add a pull-up resistor, because it has

been pulled up to UIM_PWR with a 15 kΩ resistor on the module, in

compliance with the ISO/IEC 7816-3.

−

For UIM_PWR, it is recommended to add an additional decoupling capacitor

ranging from 1uF to 10uF, and to place a 10pF capacitor on each of the

signals such as UIM_RST, UIM_CLK and UIM_DATA.

These levels exceed those required in ISO/IEC 7816-3.

SIM signals

The following data is taken from the ETSI standard Specification of the 3 Volt

Subscriber Identity Module - Mobile Equipment (SIM-ME) interface (GSM 11.12

version 4.3.1).

Table 3-6 SIM RST requirements

RST

V_IL

Minimum

Maximum

0.2Vcc

Vcc

V_IH

0.7Vcc

Table 3-7 SIM CLK requirements

CLK

V_IL

Minimum

Maximum

0.2Vcc

Vcc

V_IH

0.7Vcc

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Table 3-8 SIM IO requirements

Minimum

Maximum

0.4

V_IL

V_IH

V_OL

V_OH

0.7Vcc

–0.3

Vcc

0.2 Vcc

Vcc+0.3

0.7 Vcc

The V_OLmax of 0.45 V for the output is specified at an output current of 3 mA whereas the

V_ILmax of 0.4 V for the SIM IO input is specified at an input current of 1 mA. With the smaller

current drive, the output voltage would be driven lower than the stated maximum value.

ESD protection

Since the SIM is a CMOS device, ESD protection devices should be placed near

the SIM connector to provide protection before connecting to the module. In

addition, all the SIM interface signals should be bypassed with a 10 pF capacitor.

The used ESD device (PESD3V3L5UY, NXP) in Figure 3-2 is a low capacitance

5-fold ESD protection diode arrays in SOT363 package.

Clock frequency

The SIM must support clock frequencies between 1 MHz and 4 MHz. (The Mini

Card can be programmed to generate a clock of 1.625 MHz, 2.6 MHz, or 3.25

MHz.)

Routing recommendations

The SIM interface signals consist of four signals that are UIM_PWR, UIM_RST,

UIM_CLK, and UIM_DATA (UIM_Vpp is neither connected nor used in many

applications). Due to the relatively low clock frequencies involved, the concern is

not the degradation of the SIM signals but that of routing of the SIM interface

signals through areas considered to be of high risk for RF noise coupling

(crosstalk and RF contamination), which can desensitize the radio circuitry. The

general guidelines that should be followed are listed as follows:

−

It is recommended that these signals should be routed over a continuous

ground plane.

−

SIM interface signals should not be routed near high transient signals (power

supply chokes and DC/DC switching FETs).

−

Prevent routing of these signals near output connectors.

Keep SIM interface signals isolated from other signals. 2x width spacing (1.5x

min) between SIM interface signals and all other signal routing is

recommended.

3.6.3 Certification Test

Using test equipment simulates a (U)SIM card to test U(SIM) protocol in GCF or

PTCRB test, If some test. If you encounter some issues during SIM/USIM test,

please contact Huawei for more details.

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Description of the Application Interfaces

3.7 W_DISABLE# Signal

The W_DISABLE# signal is provided to allow users to disable wireless

communications add-in cards. When the W_DISABLE# signal is asserted, all radios

should be disabled. When the W_DISABLE# signal is not asserted, the radio may

transmit signals if it is not disabled by other means such as software.

The W_DISABLE# signal is an active low signal with internal 100 kΩ pull-up resistor

that disables radio operation when being asserted (driven low) by the system.

The combination of the software state and W_DISABLE# assertion state must be

determined before the normal operation is resumed. Table 3-10 lists this requirement

for W_DISABLE# and the software control setting. For example, the radio RF

operation remains disabled unless both the hardware and software are set to enable

the RF features of the card.

Table 3-9 W_DISABLE_N signal

Pins Name

Description

Direction to Module

20 W_DISABLE_N Close wireless communications Input

Table 3-10 Radio operational states

W_DISABLE# SW Control Setting*

Radio Operation

Enabled

High

Low

Enabled

Disabled

Enabled

Disabled

* This control setting is implementation specific; this column represents the collective intention of

the host software to manage radio operation.

If you do not turn off the radio manually, the radio will be on when the module is powered

on.

End users need to turn off the radio in some situations such as when being on an airplane.

According to Mini-PCIE specification, the radio must be turned off through hardware or

software. Nearly all PC companies comply with this specification.

3.8 LED_WWAN# Signal

The LED_WWAN signal of the EM820W can allow the voltage of 3.3 V and absorb

the current from 5 mA to 40 mA. According to the given circuit, in order to reduce the

current of the LED, a resistance of 1 kΩ must be placed in series with the LED.

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Table 3-11 LED_WWAN signal

Pins Name

Description

Additional

Description

Direction to

Module

LED_WWAN Active-low LED signal

indicating the status of

the module.

L: Light on

H: Light off

Output

This signal is used to display the state of WWAN. The reference circuit diagram is

shown in the following figure.

Figure 3-4 LED_WWAN# signal reference circuit diagram

Normally, when the HUAWEI module is enabled, the LED is on, and when disabled, the LED is

off. The wink mode of the LED can be customized according to the requirement of the client.

For resistance of R placed on PC, choose the value that satisfies the following

equation:

IF*R+VF+IF*100 =VCC

VF: Forward Voltage

IF: Forward current

Take the LED 19-213/GVC-AMNB/3T as an example (its manufacturer is Everlight

Electronics., Ltd. and the website is http://www.everlight.com). Figure 3-5 shows its

I_F-V_Fcurves. If VCC is 3.3 V and the desired current through the LED I_Fis 3 mA, then

the voltage of the LED V_Fis 1.5 V. According to I_F-V_Fcurves, the corresponding value

for resistance of R is (3.3 - 0.003 x 100 - 1.5) / 0.003 = 500 Ω.

The brightness of the LED depends on the current value, and for most of the

indicator lights the current between 2 mA to 5 mA is adequate.

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Figure 3-5 LED typical electro-optical characteristics curves

3.9 WAKE_NB_N Signal

WAKE_NB_N (signal that the module uses to activate the PC)

Support software controls the signal (WAKE_NB_N) that the module uses to activate

the PC. This signal is used for 3G module to wake up the host. It’s designed as a

OC gate, so it should be pulled up by the host and it’s active-low.

3.10 NC Pins

The NC pins are not internally connected in the EM820W.

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4.1 Operating Frequencies

Table 4-1 shows the RF bands supported by EM820W.

Table 4-1 RF bands

Operating Band

UMTS 2100 (Band I)

UMTS 1900 (Band II)

UMTS 900 (Band VIII)

UMTS 850(Band V)

GSM 850

1920–1980 MHz

1850–1910 MHz

880–915 MHz

824–849MHz

824–849 MHz

880–915 MHz

1710–1785 MHz

1850–1910 MHz

2110–2170 MHz

1930–1990 MHz

925–960 MHz

869–894 MHz

925–960 MHz

1805–1880 MHz

1930–1990 MHz

GSM 900

GSM 1800(DCS)

GSM 1900(PCS)

4.2 Conducted RF Measurement

4.2.1 Test Environment

Test instrument: R&S CMU200

Power supply: KEITHLEY 2306

RF cable for testing:

L08-C014-350 of DRAKA COMTEQ or Rosenberger

Cable length: 29 cm

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Compensation for WCDMA 850 MHz or 900 MHz: 0.6 dB

Compensation for WCDMA 2100 MHz or WCDMA 1900 MHz: 0.8 dB

The compensation for different frequency bands relates to the cable and the test environment.

The instrument compensation needs to be set according to the actual cable conditions.

4.2.2 Test Standards

Huawei modules meet all 3GPP test standards relating to both 2G and 3G. Each

module has passed stringent tests in the factory, thus the quality of the modules is

guaranteed.

4.3 Conducted Rx Sensitivity and Tx Power

4.3.1 Conducted Receive Sensitivity

The conducted receive sensitivity is a key parameter that indicates the receiver

performance of EM820W. The conducted receive sensitivity means the weakest

signal that the module at the antenna port can receive. The BER must meet the

3GPP protocol requirements in the case of the minimum signal.

The 3GPP Protocol Claim column in Table 4-2 lists the required minimum values,

and the Test Value column lists the tested values of EM820W.

Table 4-2 EM820W conducted Rx sensitivity

Item

3GPP Protocol EM820W Test Value (dBm)

Claim (dBm)

Min

Type

Max

-107

-101

GSM850

GMSK(BER <2.43%) < -102

-109

8PSK(MCS5,

BLER<10%)

< -98

-103.5

GSM900

GMSK(BER <2.43%) < -102

-109

-107

-101

8PSK(MCS5,

BLER<10%)

< -98

-103.5

GSM1800 GMSK(BER <2.43%) < -102

-109

-107

-100

8PSK(MCS5,

BLER<10%)

< -98

-102.5

GSM1900 GMSK(BER <2.43%) < -102

-109

-107

-100

8PSK(MCS5,

BLER<10%)

< -98

-102.5

BandI (BER<0.1%)

< -106.7

-110

-108

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Item

3GPP Protocol EM820W Test Value (dBm)

Claim (dBm)

Min

Type

-110

Max

-108

BandII (BER<0.1%)

Band VIII (BER<0.1%)

Band V (BER<0.1%)

< -104.7

< -103.7

< -104.7

The test values are the average of some test samples.

4.3.2 Conducted Transmit Power

The conducted transmit power is another indicator that measures the performance of

EM820W. The conducted transmit power means the maximum power that the module

tested at the antenna port can transmit. According to the 3GPP protocol, the required

transmit power varies with the power class.

Table 4-3 lists the required ranges of the conducted transmit power of EM820W. The

tested values listed in the Test Value column must be within the range from the

minimum power to the maximum power.

Table 4-3 EM820W conducted Tx power

Item

3GPP Protocol

Claim (dBm)

EM820W Test Value (dBm)

Min

31.5

Type

32.5

Max

33.5

GSM850

GSM900

GSM1800

GSM1900

GMSK(1Tx Slot) 31~35

8PSK(1Tx Slot) 24~30

GMSK(1Tx Slot) 31~35

8PSK(1Tx Slot) 24~30

GMSK(1Tx Slot) 28~32

8PSK(1Tx Slot) 23~29

GMSK(1Tx Slot) 28~32

31.5

32.5

33.5

28.5

29.5

30.5

28.5

29.5

30.5

8PSK(1Tx Slot)

23~29

21~25

Band I(W2100)

Band II(W1900)

Band VIII(W900)

Band V(W850)

22.5

23.5

24.5

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4.4 Antenna Design Requirements

4.4.1 Antenna Design Indicators

Antenna Efficiency

Antenna efficiency is the ratio of the input power to the radiated or received power of

an antenna. The radiated power of an antenna is always lower than the input power

due to the following losses: return loss, material loss, and coupling loss. The

efficiency of an antenna relates to its electrical dimensions. To be specific, the

antenna efficiency increases with the electrical dimensions. In addition, the

transmission cable from the antenna port of the EM820W to the antenna is also part

of the antenna. The cable loss increases with the cable length and the frequency. It is

recommended that the cable loss should be as low as possible, for example, U.FL-

LP-088 made by HRS.

The following antenna efficiency (free space) is recommended for the EM820W on a

laptop to ensure high radio performance of the EM820W:

Efficiency of the master antenna > 40% (-4 dB)

Efficiency of the slave antenna > 40% (-4 dB)

Efficiency of the GPS antenna > 50% (-3 dB)

Efficiency of the Wi-Fi antenna > 40% (-4 dB)

Isolation

For a wireless device with multiple antennas, the power of different antennas is

coupled with each other. Antenna isolation is used to measure the power coupling.

The power radiated by an antenna might be received by an adjacent antenna, which

decreases the antenna radiation efficiency and affects the running of other devices.

To avoid this problem, evaluate the antenna isolation as sufficiently as possible at the

early stage of antenna design.

Antenna isolation depends on the following factors:

Distance between antennas

Antenna type

Antenna direction

The master antenna must be placed as near as possible to the EM820W to minimize

the cable length. The slave antenna needs to be installed perpendicularly to the

master antenna. The slave antenna can be placed farther away from the EM820W.

Antenna isolation can be measured with a two-port vector network analyzer.

The following antenna isolation is recommended for the antennas on laptops:

Isolation between master and slave antennas < -12 dB

Isolation between the master antenna and the GPS antenna < -15 dB

Isolation between the slave antenna and the Wi-Fi antenna < -15 dB

If a Wi-Fi module is installed on the laptop, the following measures must be taken to

reduce mutual influence between the data card module and the Wi-Fi module:

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Adding a bandpass filter to the Wi-Fi channel to filter the WCDMA, GSM850,

GSM900, DCS, and PCS signals

Ensuring sufficient isolation between the master antenna of the data card

module and the Wi-Fi antenna

Table 4-4 lists the requirements for the isolation between the master antenna and the

Wi-Fi antenna in different frequency bands according to the interference suppression

supported by the filter in different frequency bands.

Table 4-4 Isolation between the master antenna and the Wi-Fi antenna

Frequency

Band

Transmit

Frequency

Conducted

Transmit

Power (dBm)

Ant

Isolator

(dB)

Wi-Fi Front End

Filter Attenuation

(dB)

UMTS2100 1920–1980 MHz 24

UMTS1900 1850–1910 MHz 24

UMTS850

UMTS900

GSM850

GSM900

DCS

824–849 MHz

880–915 MHz

824–849 MHz

880–915 MHz

1710–1785 MHz 30

1850–1910 MHz 30

PCS

S11 or VSWR

S11 (return loss) indicates the degree to which the input impedance of an antenna

matches the reference impedance (50 ohm). S11 shows the resonance feature and

impedance bandwidth of an antenna. Voltage standing wave ratio (VSWR) is another

expression of S11. S11 relates to the antenna efficiency. S11 can be measured with a

vector analyzer.

The following S11 values are recommended for the antennas on laptops:

S11 of the master antenna < -6 dB

S11 of the slave antenna < -6 dB

S11 of the GSP antenna < -10 dB

S11 of the Wi-Fi antenna < -10 dB

Polarization

The polarization of an antenna is the orientation of the electric field vector that rotates

with time in the direction of maximum radiation.

The linear polarization is recommended for the antennas on laptops.

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Envelope Correlation Coefficient

The envelope correlation coefficient indicates the correlation between different

antennas in a multi-antenna system (master antenna, diversity antenna, and MIMO

antenna). The correlation coefficient shows the similarity of radiation patterns, that is,

amplitude and phase, of the antennas. The ideal correlation coefficient of a diversity

antenna system or a MIMO antenna system is 0. A small value of the envelope

correlation coefficient between the master antenna and the slave antenna indicates a

high diversity gain. The envelope correlation coefficient depends on the following

factors:

Distance between antennas

Antenna type

Antenna direction

The antenna correlation coefficient differs from the antenna isolation. Sufficient

antenna isolation does not represent a satisfactory correlation coefficient. For this

reason, the two indicators need to be evaluated separately.

For the antennas on laptops, the recommended envelope correlation coefficient

between the master antenna and the diversity antenna is smaller than 0.5.

Radiation Pattern

The radiation pattern of an antenna reflects the radiation features of the antenna in

the remote field region. The radiation pattern of an antenna describes the power or

field strength of the radiated electromagnetic waves in various directions from the

antenna. The power or field strength varies with the angular coordinates (θ and φ),

but is independent of the radial coordinates.

The radiation pattern of half wave dipole antennas is the best option for wireless

terminals. The radiation pattern of half wave dipole antennas is omnidirectional in the

horizontal plane, and the incident waves of base stations are often in the horizontal

plane. For this reason, the reception is optimal.

To improve the performance of diversity antennas, it is recommended that the

radiation pattern of the slave antenna be complementary with that of the master

antenna.

The following radiation patterns are recommended for the antennas on laptops:

Master antenna: omnidirectional

Slave antenna: complementary with the radiation pattern of the master slave

GPS antenna: omnidirectional

Wi-Fi antenna: omnidirectional

Gain and Directivity

The radiation pattern of an antenna represents the field strength of the radiated

electromagnetic waves in all directions, but not the power density that the antenna

radiates in the specific direction. The directivity of an antenna, however, measures

the power density that the antenna radiates.

Gain, as another important parameter of antennas, correlates closely to the directivity.

The gain of an antenna takes both the directivity and the efficiency of the antenna

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into account. The appropriate antenna gain prolongs the service life of relevant

batteries.

The following antenna gain is recommended for antennas on laptops:

Gain of the master antenna ≤ 3 dBi

Gain of the slave antenna ≤ 3 dBi

The antenna on a laptop consists of the antenna body and the relevant RF transmission

cable. Take the RF transmission cable inside the laptop into account when measuring any

of the preceding antenna indicators.

Huawei cooperates with various antenna suppliers who are able to make suggestions on

antenna design, for example, Amphenol, Skycross, Pulse etc.

4.4.2 Interference

Besides the antenna performance, the interference on the user board also affects the

radio performance (especially the TIS) of the module. To guarantee high performance

of the module, the interference sources on the user board must be properly controlled.

On the user board, there are various interference sources, such as the LCD, CPU,

audio circuits, and power supply. All the interference sources emit interference

signals that affect the normal operation of the module. For example, the module

sensitivity can be decreased due to interference signals. Therefore, during the design,

you need to consider how to lessen the effects of interference sources on the module.

To lessen the effects of interference sources on the module, you can use an LCD

with optimized performance, shield the LCD interference signals, shield the signal

cable of the board, or design filter circuits.

Huawei is capable of making technical suggestions on radio performance

improvement of the module.

4.4.3 GSM/WCDMA Antenna Requirements

The antenna for EM820W must fulfill the following requirements:

Table 4-5 GSM/WCDMA antenna requirements

GSM/WCDMA Antenna Requirements

Frequency range

Depending on the frequency band(s) provided by the

network operator, the customer must use the most

suitable antenna for that/those band(s)

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GSM/WCDMA Antenna Requirements

Bandwidth

70 MHz in GSM850

80 MHz in GSM900

170 MHz in DCS

140 MHz PCS

70 MHZ in WCDMA850

80 MHz in WCDMA900

140 MHz in WCDMA1900

250 MHz in WCDMA2100 band

Gain

Gain < 3dBi

50 Ohm

Impedance

Input power

> 33dBm(2 W) peak power in GSM

> 24dBm Average power in WCDMA

VSWR absolute max

VSWR recommended

<= 10:1

<= 2:1

Furthermore, if the device is developed for US and/or Canada market, it must comply

with the FCC and/or IC approval requirements:

This device is to be used only for mobile and fixed application. The antenna(s) used

for this transmitter must be installed to provide a separation distance of at least 20

cm from all persons and must not be co-located or operating in conjunction with any

other antenna or transmitter. End-Users must be provided with transmitter operation

conditions for satisfying RF exposure compliance. OEM integrators must ensure that

the end user has no manual instructions to remove or install the UC864-E/G/WD

/WDU module. Antennas used for this OEM module must not exceed 3dBi gain for

mobile and fixed operating configurations.

4.4.4 Radio Test Environment

The antenna efficiency, antenna gain, radiation pattern, total radiated power (TRP),

and TIS can be tested in a microwave testing chamber.

Huawei has a complete set of OTA test environment (SATIMO microwave testing

chambers and ETS microwave testing chambers). The testing chambers are certified

by professional organizations and are applicable to testing at frequencies ranging

from 380 MHz to 6 GHz. The test items are described as follows:

Passive Tests

Antenna efficiency

Gain

Pattern shape

Envelope correlation coefficient

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Active Tests

TRP: GSM, WCDMA, CDMA, TD-SCDMA, and LTE systems

TIS: GSM, WCDMA, CDMA, TD-SCDMA, and LTE systems

Figure 4-1 shows the SATIMO microwave testing chamber.

Figure 4-1 SATIMO microwave testing chamber

4.5 Design Recommendations

4.5.1 Recommendations for Designing the Module Antennas

The design recommendations are as follows:

It is recommended that the module antennas are designed at the upper edge,

left edge, or right edge of the laptop screen. Designing the antenna at the upper

edge is better.

Take the isolation and envelope correlation between the master antenna and

the slave antenna into account when designing the antennas. Keep the slave

antenna away from the master antenna as far as possible. Install the slave

antenna perpendicularly to the master slave. See Figure 4-2, Install the master

and slave antennas in positions 1 and 3 or 2 and 4 but not in positions 1 and 2 or

3 and 4.

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Figure 4-2 Recommended antenna positions

It is recommended that the antenna pattern be designed based on the horizontal

polarized omnidirectional pattern that facilitates the reception of strong signals

especially in outdoor environments.

Besides the module antennas, a laptop has other internal antennas, such as the

WLAN antenna. Therefore, when designing the module antennas, the

requirement on the isolation between module antennas and other laptop

antennas should be considered. Ensure that proper distance is maintained

between antennas if possible. To reduce the interference between antennas, it is

recommended that an antenna is not designed close to another one.

Carefully design the metallic components (such as the external frame of the

metallic shell) in and near the antenna area by considering the effects on the

antenna performance (such as whether the frequency offset of the antenna

occurs and whether the antenna pattern is deformed).

4.6 ESD Protection for the Antenna Interface

In practical application, pay attention to the ESD protection for the antenna interface

of the EM820W module. Incorrect operation may result in permanent damage to the

RF components.

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Figure 4-3 shows the ESD protection circuit recommended for the antenna interface.

Figure 4-3 ESD protection circuit recommended for the antenna interface

It is recommended that you pay attention to the junction capacitance of the TVS

diode when you choose the model of the TVS diode. Ensure that the junction

capacitance of the TVS diode is lower than 1 pF.

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5.1 About This Chapter

This chapter describes the electrical and reliability features of the interfaces in the

EM820W module, including:

Extreme Working Conditions

Working and Storage Temperatures and Humidity

Electrical Criteria of Application Interfaces

Power Supply Features

Reliability Features

EMC and ESD Features

5.2 Extreme Working Conditions

Table 5-1 lists the extreme working conditions for the EM820W module. Using the

EM820W module beyond these conditions may result in permanent damage to the

module.

5.3 Working and Storage Temperatures and Humidity

Table 5-1 lists the working and storage temperatures and humidity for the EM820W

module.

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Table 5-1 Working and storage temperatures and humidity for the EM820W module

Specification

Minimum Value

Maximum Value

Unit

Normal working

temperatures [1]

–10

+55

°C

Extreme working

temperatures [2]

–20 to –10

+55 to +70

+85

°C

Ambient temperature for

storage

–40

Moisture

[1]: When the EM820W module works at this temperature, all its RF indexes comply with the

3GPP TS 45.005 specifications.

[2]: When the EM820W module works at this temperature, certain RF indexes do not comply

with the 3GPP TS 45.005 specifications.

5.4 Electrical Criteria of Application Interfaces

Table 5-2 lists electrical features (typical values)

Table 5-2 Electrical features of application interfaces

Parameter Description

Minimum Value

Maximum Value Unit

V_IH

High-level input 0.65*V_{DD_PX}

V_{DD_PX}+0.3

voltage

V_IL

Low-level input

voltage

–0.3

0.35* V_{DD_PX}

I_leak

V_OH

V_OL

I_OH

I_OL

Input leakage

current

–0.2

0.2

High-level

output voltage

V_{DD_PX}–0.45

V_{DD_PX}

0.45

Low-level

output voltage

High-level

output current

1.5

Low-level

–1.5

output current

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5.5 Power Supply Features

5.5.1 Power Supply

The EM820W receives its power supply from a 3.3 V power source, which must

satisfy all requirements of PCI Express Mini CEM specifications, such as voltage

tolerance and peak and normal current. The detailed requirements are listed in Table

5-3.

Table 5-3 Power requirements

Power

Voltage Tolerance

Peak (Maximum)

Normal (Maximum)

3.3 V

±9%

2750 mA

1100 mA

In burst transmit mode of GSM/GPRS/EDGE, the instantaneous current of the module will

exceed 2.75 A, which will pull down the power voltage transitorily and perhaps result in the

reset of the module or host. In order to prevent this situation, you can add a large bulk

capacitor beside the module on the host side (at least two 330uF capacitors).

5.5.2 Power Consumption

The power consumptions of the EM820W in different scenarios are listed in Table 5-4,

Table 5-5 and Table 5-6 respectively.

Table 5-4 DC power consumption (HSPA/WCDMA)

Description Band

Test Value

284

Units

Power (dBm)

WCDMA

Band I

Band II

Band V

1 dBm Tx Power

10 dBm Tx Power

24 dBm Tx Power

1 dBm Tx Power

10 dBm Tx Power

24 dBm Tx Power

1 dBm Tx Power

336

544

289

340

606

293

317

501

291

310

517

10 dBm Tx Power

24 dBm Tx Power

1 dBm Tx Power

10 dBm Tx Power

24 dBm Tx Power

Band VIII

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Description Band

Test Value

Units

Power (dBm)

HSDPA

Band I

348

395

585

350

409

646

361

380

552

343

365

560

378

424

610

357

407

643

363

381

524

361

382

531

1 dBm Tx Power

10 dBm Tx Power

24 dBm Tx Power

1 dBm Tx Power

10 dBm Tx Power

24 dBm Tx Power

1 dBm Tx Power

10 dBm Tx Power

24 dBm Tx Power

1d Bm Tx Power

10 dBm Tx Power

24 dBm Tx Power

1 dBm Tx Power

10 dBm Tx Power

24 dBm Tx Power

1 dBm Tx Power

10 dBm Tx Power

24 dBm Tx Power

1 dBm Tx Power

10 dBm Tx Power

24 dBm Tx Power

1d Bm Tx Power

10 dBm Tx Power

24 dBm Tx Power

Band II

Band V

Band VIII

Band I

HSUPA

Band II

Band V

Band VIII

Table 5-5 DC power consumption (GSM/GPRS/EDGE)

Description

Test Value

346

Units

PCL

Configuration

1 Up/1 Down

2 Up/1 Down

1 Up/1 Down

GPRS850

513

160

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Description

Test Value

225

345

514

143

195

236

355

128

166

217

318

131

167

250

351

488

165

217

293

229

329

468

142

193

270

192

265

362

128

165

210

Units

PCL

Configuration

2 Up/1 Down

1 Up/1 Down

2 Up/1 Down

1 Up/1 Down

2 Up/1 Down

1 Up/1 Down

2 Up/1 Down

1 Up/1 Down

2 Up/1 Down

1 Up/1 Down

2 Up/1 Down

1 Up/1 Down

2 Up/1 Down

1 Up/1 Down

2 Up/1 Down

4 Up/1 Down

1 Up/1 Down

2 Up/1 Down

4 Up/1 Down

1 Up/1 Down

2 Up/1 Down

4 Up/1 Down

1 Up/1 Down

2 Up/1 Down

4 Up/1 Down

1 Up/1 Down

2 Up/1 Down

4 Up/1 Down

1 Up/1 Down

2 Up/1 Down

4 Up/1 Down

GPRS900

GPRS1800

GPRS1900

EDGE850

EDGE900

EDGE1800

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Description

Test Value

194

Units

PCL

Configuration

1 Up/1 Down

2 Up/1 Down

4 Up/1 Down

1 Up/1 Down

2 Up/1 Down

4 Up/1 Down

EDGE1900

257

341

142

177

218

Table 5-6 DC power consumption(Idle and Suspend)

Scenario

Idle

Suspend

Unit

Offline

Enabled

Disabled

Enabled

Disabled

WCDMA 2100MHz 66.3

DRX = 8 (2.56 s)

72.7

73.1

4.1

5.8

GSM 900MHz

70.6

7.8

MFRM = 5 (1.18 s)

In idle mode, the module is registered to the network, USB bus is active, and no voice or

data call connection is ongoing.

The above values are the average of some test samples.

5.6 Reliability Features

Table 5-7 lists the test conditions and results of the mechanical reliability of the

EM820W module.

Table 5-7 Test conditions and results of the mechanical reliability of the EM820W module

Item

Test Condition

Standard

Low-temperature

storage

Temperature: –40±2ºC

Test duration: 24 h

IEC60068

High-temperature

storage

Temperature: 85±2ºC

Test duration: 24 h

IEC60068

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Electrical and Reliability Features

Item

Test Condition

Standard

Low-temperature

working

Temperature: –30±2ºC

Test duration: 24 h

IEC60068

High-temperature

working

Temperature: 75±2ºC

Test duration: 24 h

IEC60068

Damp heat cycling

High temperature: 55±2ºC

Low temperature: 25±2ºC

Humidity: 95%

Repetition times: 4

Test duration: 12 h + 12 h

Temperature shock

Low temperature: –40±2ºC

High temperature: 85±2ºC

IEC60068

Temperature change interval: < 30s

Test duration: 15 min

Repetition times: 100

Salty fog test

Sine vibration

Shock test

Temperature: 35°C

IEC60068

Density of the NaCl solution: 5±1%

Spraying interval: 8 h

Duration of exposing the module to

the temperature of 35°C: 16 h

Frequency range: 5 Hz to 200 Hz

Acceleration: 10 m/s2

Frequency scan rate: 1 oct/min

Test period: 3 axial directions. Five

circles for each axial direction.

Half-sine wave shock

Peak acceleration: 300 m/s2

Shock duration: 11 ms

Test period: 6 axial directions. One

shock for each axial direction.

Clash test

Half-sine wave

Peak acceleration: 180 m/s2

Pulse duration: 6 ms

Repetition time: 6 directions. 1000

times for each direction.

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HUAWEI EM820W HSPA+ PC Embedded Module

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Electrical and Reliability Features

Item

Test Condition

Standard

Drop test

First case: 0.3 m in height. Drop the

EM820W module on the marble

terrace with one surface facing

downwards twice. Six surfaces

should be tested.

IEC60068

Second case: 0.8 m in height. Drop

the EM820W module on the marble

terrace with one surface facing

downwards twice. Six surfaces

should be tested.

5.7 EMC and ESD Features

EMC tests have to be performed on the application as soon as possible to detect any

potential problems.

When designing, special attention should be paid to:

Possible spurious emissions radiated by the application to the RF receiver in the

receiver band.

ESD protection that is mandatory on all signals which are externally accessible

Typically, ESD protection is mandatory for the:

− SIM (if accessible from outside)

− Serial link

Length of the SIM interface lines (preferably <10cm).

EMC protection on audio input/output (filters against 900MHz emissions).

Biasing of the microphone inputs.

Ground plane: HUAWEI Wireless recommends a common ground plane for

analog/digital/RF grounds.

A metallic case or plastic casing with conductive paint is recommended,

except for areas around the antenna.

The HUAWEI EM820W Embedded Module does not include any protection against high

voltage.

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Mechanical Specifications

6.1 Dimensions and Interfaces

6.1.1 Dimensions and Interfaces of EM820W

The dimensions of EM820W are 50.95 mm (length) × 30 mm (width) × 4.5 mm

(height). Figure 6-1 shows the dimensions of EM820W in detail.

Figure 6-1 shows the appearance of the interfaces on the EM820W.

Figure 6-1 Dimensions of the EM820W

6.2 Dimensions of the Mini PCI Express Connector

The EM820W adopts a standard Mini PCI Express connector that has 52 pins and

complies with the PCI Express Mini Card Electromechanical Specification Revision

1.2.

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Mechanical Specifications

Figure 6-2 shows a 52-pin Mini PCI Express connector (take the Molex 67910002 as

an example).

Figure 6-2 Dimensions of the Mini PCI Express connector

6.3 Specification Selection for Fasteners

6.3.1 Installing the EM820W on the Main Board of PC

To install the EM820W on the main board of the PC, do the following:

Step 1 Insert the Mini PCI Express connector of the EM820W into the WWAN Mini PCI

Express interface on the main board of PC.

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Hardware Guide

Mechanical Specifications

Step 2 Press downwards to fix the EM820W in the module slot.

Step 3 Use a screwdriver to fix the EM820W on the main board of the PC with two screws

provided in the EM820W packing box.

Step 4 Insert the connector of the main antenna into the MAIN antenna interface (M) of the

EM820W according to the indication on the label of the EM820W. Insert the

connector of the auxiliary antenna into the AUX antenna interface (A) of the c

EM820W in the same way.

Insert the antenna connectors vertically into the antenna interfaces of the EM820W.

Do not press or squeeze the antenna cable or damage the connectors. Otherwise, the

wireless performance of the EM820W may be reduced or the EM820W cannot work

normally.

Ensure that the antenna cables are routed through the channel in the frame of the PC and

do not lay the cables across the raised edges of the frame.

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Mechanical Specifications

6.3.2 Romoving the EM820W from the Main Board of PC

Step 1 Disconnect the antenna cables from the EM820W. You can lift the connectors using

a small screwdriver.

Step 2 Remove the two screws with the screwdriver.

Step 3 Slide backwards the two clips to release the EM820W from the slot. Then, lift up the

EM820W.

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HUAWEI EM820W HSPA+ PC Embedded Module

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Appendix A Circuits of Typical Interfaces

Figure 7-1 Circuits of typical interfaces in the EM820W module

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Appendix B Acronyms and

Abbreviations

Appendix B Acronyms and Abbreviations

Acronym or Abbreviation

Expansion

Baseband

European Conformity

Coding Scheme

CSD

Circuit Switched Data

direct current

DCE

DMA

DTE

EIA

data circuit-terminating equipment

direct memory access

data terminal equipment

Electronic Industries Association

electromagnetic compatibility

electrostatic discharge

European Conformity

Federal Commnications Commission

EMC

ESD

FCC

FDD-TDMA

frequency division duplexing–time division

multiple access

GMSK

GPRS

ISO

Gaussian minimum shift keying

general packet radio service

International Standards Organization

liquid crystal polyester

low-dropout

LCP

LDO

LED

light-emitting diode

MCP

multi-chip package

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HUAWEI EM820W HSPA+ PC Embedded Module

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Appendix B Acronyms and

Abbreviations

Acronym or Abbreviation

Expansion

negative temperature coefficient

NTC

PBCCH

PCB

Packet Broadcast Control Channel

printed circuit board

protocol data unit

PDU

PMU

Power manage Unit

radio frequency

RoHS

Restriction of the use of certain Hazardous

Substances

RTC

SIM

real-time clock

Subscriber Identity Module

transistor-transistor logic

transient voltage suppressor

voltage standing wave ratio

TTL

TVS

VSWR

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