HP Hewlett Packard Server 721546 001 User Manual

HP ProLiant ML310e Gen8 Server  
Maintenance and Service Guide  
Abstract  
This document is for an experienced service technician. It is helpful if you are qualified in the servicing of computer equipment and trained in  
recognizing hazards in products with hazardous energy levels and are familiar with weight and stability precautions for rack installations.  
Part Number: 682265-002  
March 2013  
Edition: 2  
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Contents  
Contents  
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Contents  
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Customer self repair  
HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for  
greater flexibility in performing defective parts replacement. If during the diagnosis period HP (or HP service  
providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will  
ship that part directly to you for replacement. There are two categories of CSR parts:  
Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts,  
you will be charged for the travel and labor costs of this service.  
Optional—Parts for which customer self repair is optional. These parts are also designed for customer  
self repair. If, however, you require that HP replace them for you, there may or may not be additional  
charges, depending on the type of warranty service designated for your product.  
NOTE: Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty,  
HP requires that an authorized service provider replace the part. These parts are identified as "No" in the  
Illustrated Parts Catalog.  
Based on availability and where geography permits, CSR parts will be shipped for next business day  
delivery. Same day or four-hour delivery may be offered at an additional charge where geography permits.  
If assistance is required, you can call the HP Technical Support Center and a technician will help you over the  
telephone. HP specifies in the materials shipped with a replacement CSR part whether a defective part must  
be returned to HP. In cases where it is required to return the defective part to HP, you must ship the defective  
part back to HP within a defined period of time, normally five (5) business days. The defective part must be  
returned with the associated documentation in the provided shipping material. Failure to return the defective  
part may result in HP billing you for the replacement. With a customer self repair, HP will pay all shipping  
and part return costs and determine the courier/carrier to be used.  
For more information about HP's Customer Self Repair program, contact your local service provider. For the  
North American program, refer to the HP website (http://www.hp.com/go/selfrepair).  
Parts only warranty service  
Your HP Limited Warranty may include a parts only warranty service. Under the terms of parts only warranty  
service, HP will provide replacement parts free of charge.  
For parts only warranty service, CSR part replacement is mandatory. If you request HP to replace these parts,  
you will be charged for the travel and labor costs of this service.  
Réparation par le client (CSR)  
Les produits HP comportent de nombreuses pièces CSR (Customer Self Repair = réparation par le client) afin  
de minimiser les délais de réparation et faciliter le remplacement des pièces défectueuses. Si pendant la  
période de diagnostic, HP (ou ses partenaires ou mainteneurs agréés) détermine que la réparation peut être  
effectuée à l'aide d'une pièce CSR, HP vous l'envoie directement. Il existe deux catégories de pièces CSR:  
Customer self repair  
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Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de  
remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.  
Facultatif - Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également  
conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de  
remplacer ces pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à  
votre produit.  
REMARQUE: Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la  
réparation. Pour que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit effectué  
par un Mainteneur Agréé. Ces pièces sont identifiées par la mention "Non" dans le Catalogue illustré.  
Les pièces CSR sont livrées le jour ouvré suivant, dans la limite des stocks disponibles et selon votre situation  
géographique. Si votre situation géographique le permet et que vous demandez une livraison le jour même  
ou dans les 4 heures, celle-ci vous sera facturée. Pour bénéficier d'une assistance téléphonique, appelez le  
Centre d'assistance technique HP. Dans les documents envoyés avec la pièce de rechange CSR, HP précise  
s'il est nécessaire de lui retourner la pièce défectueuse. Si c'est le cas, vous devez le faire dans le délai  
indiqué, généralement cinq (5) jours ouvrés. La pièce et sa documentation doivent être retournées dans  
l'emballage fourni. Si vous ne retournez pas la pièce défectueuse, HP se réserve le droit de vous facturer les  
coûts de remplacement. Dans le cas d'une pièce CSR, HP supporte l'ensemble des frais d'expédition et de  
retour, et détermine la société de courses ou le transporteur à utiliser.  
Pour plus d'informations sur le programme CSR de HP, contactez votre Mainteneur Agrée local. Pour plus  
d'informations sur ce programme en Amérique du Nord, consultez le site Web HP  
Service de garantie "pièces seules"  
Votre garantie limitée HP peut inclure un service de garantie "pièces seules". Dans ce cas, les pièces de  
rechange fournies par HP ne sont pas facturées.  
Dans le cadre de ce service, la réparation des pièces CSR par le client est obligatoire. Si vous demandez à  
HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.  
Riparazione da parte del cliente  
Per abbreviare i tempi di riparazione e garantire una maggiore flessibilità nella sostituzione di parti  
difettose, i prodotti HP sono realizzati con numerosi componenti che possono essere riparati direttamente  
dal cliente (CSR, Customer Self Repair). Se in fase di diagnostica HP (o un centro di servizi o di assistenza  
HP) identifica il guasto come riparabile mediante un ricambio CSR, HP lo spedirà direttamente al cliente per  
la sostituzione. Vi sono due categorie di parti CSR:  
Obbligatorie – Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la  
riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio.  
Opzionali – Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti  
progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere  
spese addizionali a seconda del tipo di garanzia previsto per il prodotto.  
NOTA: alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la  
garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono  
identificate da un "No" nel Catalogo illustrato dei componenti.  
Customer self repair  
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In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il  
giorno lavorativo seguente. La consegna nel giorno stesso o entro quattro ore è offerta con un supplemento  
di costo solo in alcune zone. In caso di necessità si può richiedere l'assistenza telefonica di un addetto del  
centro di supporto tecnico HP. Nel materiale fornito con una parte di ricambio CSR, HP specifica se il cliente  
deve restituire dei componenti. Qualora sia richiesta la resa ad HP del componente difettoso, lo si deve  
spedire ad HP entro un determinato periodo di tempo, generalmente cinque (5) giorni lavorativi. Il  
componente difettoso deve essere restituito con la documentazione associata nell'imballo di spedizione  
fornito. La mancata restituzione del componente può comportare la fatturazione del ricambio da parte di HP.  
Nel caso di riparazione da parte del cliente, HP sostiene tutte le spese di spedizione e resa e sceglie il  
corriere/vettore da utilizzare.  
Per ulteriori informazioni sul programma CSR di HP contattare il centro di assistenza di zona. Per il  
programma in Nord America fare riferimento al sito Web HP (http://www.hp.com/go/selfrepair).  
Servizio di garanzia per i soli componenti  
La garanzia limitata HP può includere un servizio di garanzia per i soli componenti. Nei termini di garanzia  
del servizio per i soli componenti, HP fornirà gratuitamente le parti di ricambio.  
Per il servizio di garanzia per i soli componenti è obbligatoria la formula CSR che prevede la riparazione da  
parte del cliente. Se il cliente invece richiede la sostituzione ad HP, dovrà sostenere le spese di spedizione  
e di manodopera per il servizio.  
Customer Self Repair  
HP Produkte enthalten viele CSR-Teile (Customer Self Repair), um Reparaturzeiten zu minimieren und höhere  
Flexibilität beim Austausch defekter Bauteile zu ermöglichen. Wenn HP (oder ein HP Servicepartner) bei der  
Diagnose feststellt, dass das Produkt mithilfe eines CSR-Teils repariert werden kann, sendet Ihnen HP dieses  
Bauteil zum Austausch direkt zu. CSR-Teile werden in zwei Kategorien unterteilt:  
Zwingend – Teile, für die das Customer Self Repair-Verfahren zwingend vorgegeben ist. Wenn Sie den  
Austausch dieser Teile von HP vornehmen lassen, werden Ihnen die Anfahrt- und Arbeitskosten für diesen  
Service berechnet.  
Optional – Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für Customer  
Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten,  
können bei diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche  
Kosten anfallen.  
HINWEIS: Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des  
Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog  
sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet.  
CSR-Teile werden abhängig von der Verfügbarkeit und vom Lieferziel am folgenden Geschäftstag geliefert.  
Für bestimmte Standorte ist eine Lieferung am selben Tag oder innerhalb von vier Stunden gegen einen  
Aufpreis verfügbar. Wenn Sie Hilfe benötigen, können Sie das HP technische Support Center anrufen und  
sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien, die mit einem CSR-Ersatzteil geliefert  
werden, können Sie entnehmen, ob das defekte Teil an HP zurückgeschickt werden muss. Wenn es  
erforderlich ist, das defekte Teil an HP zurückzuschicken, müssen Sie dies innerhalb eines vorgegebenen  
Zeitraums tun, in der Regel innerhalb von fünf (5) Geschäftstagen. Das defekte Teil muss mit der zugehörigen  
Dokumentation in der Verpackung zurückgeschickt werden, die im Lieferumfang enthalten ist. Wenn Sie das  
Customer self repair  
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defekte Teil nicht zurückschicken, kann HP Ihnen das Ersatzteil in Rechnung stellen. Im Falle von Customer  
Self Repair kommt HP für alle Kosten für die Lieferung und Rücksendung auf und bestimmt den  
Kurier-/Frachtdienst.  
Weitere Informationen über das HP Customer Self Repair Programm erhalten Sie von Ihrem Servicepartner  
vor Ort. Informationen über das CSR-Programm in Nordamerika finden Sie auf der HP Website unter  
Parts-only Warranty Service (Garantieservice  
ausschließlich für Teile)  
Ihre HP Garantie umfasst möglicherweise einen Parts-only Warranty Service (Garantieservice ausschließlich  
für Teile). Gemäß den Bestimmungen des Parts-only Warranty Service stellt HP Ersatzteile kostenlos zur  
Verfügung.  
Für den Parts-only Warranty Service ist das CSR-Verfahren zwingend vorgegeben. Wenn Sie den Austausch  
dieser Teile von HP vornehmen lassen, werden Ihnen die Anfahrt- und Arbeitskosten für diesen Service  
berechnet.  
Reparaciones del propio cliente  
Los productos de HP incluyen muchos componentes que el propio usuario puede reemplazar (Customer Self  
Repair, CSR) para minimizar el tiempo de reparación y ofrecer una mayor flexibilidad a la hora de realizar  
sustituciones de componentes defectuosos. Si, durante la fase de diagnóstico, HP (o los proveedores o socios  
de servicio de HP) identifica que una reparación puede llevarse a cabo mediante el uso de un componente  
CSR, HP le enviará dicho componente directamente para que realice su sustitución. Los componentes CSR se  
clasifican en dos categorías:  
Obligatorio: componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a  
HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de  
desplazamiento y de mano de obra de dicho servicio.  
Opcional: componentes para los que la reparación por parte del usuario es opcional. Estos  
componentes también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si  
precisa que HP realice su sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de  
servicio de garantía correspondiente al producto.  
NOTA: Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que  
el usuario haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado  
realice la sustitución de estos componentes. Dichos componentes se identifican con la palabra "No" en el  
catálogo ilustrado de componentes.  
Según la disponibilidad y la situación geográfica, los componentes CSR se enviarán para que lleguen a su  
destino al siguiente día laborable. Si la situación geográfica lo permite, se puede solicitar la entrega en el  
mismo día o en cuatro horas con un coste adicional. Si precisa asistencia técnica, puede llamar al Centro de  
asistencia técnica de HP y recibirá ayuda telefónica por parte de un técnico. Con el envío de materiales  
para la sustitución de componentes CSR, HP especificará si los componentes defectuosos deberán  
devolverse a HP. En aquellos casos en los que sea necesario devolver algún componente a HP, deberá  
hacerlo en el periodo de tiempo especificado, normalmente cinco días laborables. Los componentes  
defectuosos deberán devolverse con toda la documentación relacionada y con el embalaje de envío. Si no  
Customer self repair  
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enviara el componente defectuoso requerido, HP podrá cobrarle por el de sustitución. En el caso de todas  
sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de  
componentes y escogerá la empresa de transporte que se utilice para dicho servicio.  
Para obtener más información acerca del programa de Reparaciones del propio cliente de HP, póngase en  
contacto con su proveedor de servicios local. Si está interesado en el programa para Norteamérica, visite  
la página web de HP siguiente (http://www.hp.com/go/selfrepair).  
Servicio de garantía exclusivo de componentes  
La garantía limitada de HP puede que incluya un servicio de garantía exclusivo de componentes. Según las  
condiciones de este servicio exclusivo de componentes, HP le facilitará los componentes de repuesto sin  
cargo adicional alguno.  
Para este servicio de garantía exclusivo de componentes, es obligatoria la sustitución de componentes por  
parte del usuario (CSR). Si solicita a HP que realice la sustitución de estos componentes, tendrá que hacerse  
cargo de los gastos de desplazamiento y de mano de obra de dicho servicio.  
Customer Self Repair  
Veel onderdelen in HP producten zijn door de klant zelf te repareren, waardoor de reparatieduur tot een  
minimum beperkt kan blijven en de flexibiliteit in het vervangen van defecte onderdelen groter is. Deze  
onderdelen worden CSR-onderdelen (Customer Self Repair) genoemd. Als HP (of een HP Service Partner) bij  
de diagnose vaststelt dat de reparatie kan worden uitgevoerd met een CSR-onderdeel, verzendt HP dat  
onderdeel rechtstreeks naar u, zodat u het defecte onderdeel daarmee kunt vervangen. Er zijn twee  
categorieën CSR-onderdelen:  
Verplicht: Onderdelen waarvoor reparatie door de klant verplicht is. Als u HP verzoekt deze onderdelen  
voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon in rekening gebracht.  
Optioneel: Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn ontworpen  
voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen  
daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het  
product.  
OPMERKING: Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met  
de garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen.  
Deze onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".  
Afhankelijk van de leverbaarheid en de locatie worden CSR-onderdelen verzonden voor levering op de  
eerstvolgende werkdag. Levering op dezelfde dag of binnen vier uur kan tegen meerkosten worden  
aangeboden, indien dit mogelijk is gezien de locatie. Indien assistentie gewenst is, belt u een HP Service  
Partner om via de telefoon technische ondersteuning te ontvangen. HP vermeldt in de documentatie bij het  
vervangende CSR-onderdeel of het defecte onderdeel aan HP moet worden geretourneerd. Als het defecte  
onderdeel aan HP moet worden teruggezonden, moet u het defecte onderdeel binnen een bepaalde  
periode, gewoonlijk vijf (5) werkdagen, retourneren aan HP. Het defecte onderdeel moet met de  
bijbehorende documentatie worden geretourneerd in het meegeleverde verpakkingsmateriaal. Als u het  
defecte onderdeel niet terugzendt, kan HP u voor het vervangende onderdeel kosten in rekening brengen. Bij  
reparatie door de klant betaalt HP alle verzendkosten voor het vervangende en geretourneerde onderdeel en  
kiest HP zelf welke koerier/transportonderneming hiervoor wordt gebruikt.  
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Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programma  
van HP. Informatie over Service Partners vindt u op de HP website (http://www.hp.com/go/selfrepair).  
Garantieservice "Parts Only"  
Het is mogelijk dat de HP garantie alleen de garantieservice "Parts Only" omvat. Volgens de bepalingen van  
de Parts Only garantieservice zal HP kosteloos vervangende onderdelen ter beschikking stellen.  
Voor de Parts Only garantieservice is vervanging door CSR-onderdelen verplicht. Als u HP verzoekt deze  
onderdelen voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon in rekening  
gebracht.  
Reparo feito pelo cliente  
Os produtos da HP são projetados com muitas peças para reparo feito pelo cliente (CSR) de modo a  
minimizar o tempo de reparo e permitir maior flexibilidade na substituição de peças com defeito. Se,  
durante o período de diagnóstico, a HP (ou fornecedores/parceiros de serviço da HP) concluir que o reparo  
pode ser efetuado pelo uso de uma peça CSR, a peça de reposição será enviada diretamente ao cliente.  
Existem duas categorias de peças CSR:  
Obrigatória – Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças,  
serão cobradas as despesas de transporte e mão-de-obra do serviço.  
Opcional – Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o  
reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de  
taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.  
OBSERVAÇÃO: Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de  
cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão  
identificadas com a marca "No" (Não), no catálogo de peças ilustrado.  
Conforme a disponibilidade e o local geográfico, as peças CSR serão enviadas no primeiro dia útil após o  
pedido. Onde as condições geográficas permitirem, a entrega no mesmo dia ou em quatro horas pode ser  
feita mediante uma taxa adicional. Se precisar de auxílio, entre em contato com o Centro de suporte técnico  
da HP para que um técnico o ajude por telefone. A HP especifica nos materiais fornecidos com a peça CSR  
de reposição se a peça com defeito deve ser devolvida à HP. Nos casos em que isso for necessário, é  
preciso enviar a peça com defeito à HP dentro do período determinado, normalmente cinco (5) dias úteis.  
A peça com defeito deve ser enviada com a documentação correspondente no material de transporte  
fornecido. Caso não o faça, a HP poderá cobrar a reposição. Para as peças de reparo feito pelo cliente, a  
HP paga todas as despesas de transporte e de devolução da peça e determina a transportadora/serviço  
postal a ser utilizado.  
Para obter mais informações sobre o programa de reparo feito pelo cliente da HP, entre em contato com o  
fornecedor de serviços local. Para o programa norte-americano, visite o site da HP  
Serviço de garantia apenas para peças  
A garantia limitada da HP pode incluir um serviço de garantia apenas para peças. Segundo os termos do  
serviço de garantia apenas para peças, a HP fornece as peças de reposição sem cobrar nenhuma taxa.  
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No caso desse serviço, a substituição de peças CSR é obrigatória. Se desejar que a HP substitua essas  
peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.  
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Illustrated parts catalog  
Mechanical components  
Item Description  
Spare part number  
Customer self repair  
(on page 6)  
Access panel  
1
686751-001  
686665-001  
686745-001  
670033-001  
675039-001  
686752-001  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
RPS cage  
2
Four-bay LFF drive cage  
3
SFF drive blank  
4
LFF drive blank  
5
Air baffle  
6
1Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be  
charged for the travel and labor costs of this service.  
2Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If,  
however, you require that HP replace them for you, there may or may not be additional charges, depending on the type  
of warranty service designated for your product.  
3No—Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty, HP requires that  
an authorized service provider replace the part. These parts are identified as "No" in the Illustrated Parts Catalog.  
1Mandatory: Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de  
remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.  
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2Optional: Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également  
conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de remplacer ces  
pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à votre produit.  
3No: Non—Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la réparation. Pour  
que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit effectué par un Mainteneur Agréé. Ces  
pièces sont identifiées par la mention “Non” dans le Catalogue illustré.  
1Mandatory: Obbligatorie—Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la  
riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio.  
2Optional: Opzionali—Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti  
progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere spese  
addizionali a seconda del tipo di garanzia previsto per il prodotto.  
3No: Non CSR—Alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la  
garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate  
da un “No” nel Catalogo illustrato dei componenti.  
1Mandatory: Zwingend—Teile, die im Rahmen des Customer Self Repair Programms ersetzt werden müssen. Wenn Sie  
diese Teile von HP ersetzen lassen, werden Ihnen die Versand- und Arbeitskosten für diesen Service berechnet.  
2Optional: Optional—Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für Customer  
Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten, können bei  
diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche Kosten anfallen.  
3No: Kein—Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen,  
muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw.  
„Nein“ gekennzeichnet.  
1Mandatory: Obligatorio—componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a HP  
que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de mano  
de obra de dicho servicio.  
2Optional: Opcional— componentes para los que la reparación por parte del usuario es opcional. Estos componentes  
también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si precisa que HP realice su  
sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de servicio de garantía correspondiente al  
producto.  
3No: No—Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que el usuario  
haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado realice la sustitución de estos  
componentes. Dichos componentes se identifican con la palabra “No” en el catálogo ilustrado de componentes.  
1Mandatory: Verplicht—Onderdelen waarvoor Customer Self Repair verplicht is. Als u HP verzoekt deze onderdelen te  
vervangen, komen de reiskosten en het arbeidsloon voor uw rekening.  
2Optional: Optioneel—Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn  
ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen  
daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het product.  
3No: Nee—Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met de  
garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen. Deze  
onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".  
1Mandatory: Obrigatória—Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças,  
serão cobradas as despesas de transporte e mão-de-obra do serviço.  
2Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o  
reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa  
adicional, dependendo do tipo de serviço de garantia destinado ao produto.  
3No: Nenhuma—Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia  
do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão identificadas com a marca “No”  
(Não), no catálogo de peças ilustrado.  
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System components  
Item Description  
Spare part  
number  
Customer self repair  
(on page 6)  
Optical drives  
7
a) SATA DVD-ROM drive  
624591-001  
Mandatory1  
b) SATA DVD-RW drive*  
624592-001  
Mandatory1  
Front I/O module  
691939-001  
686753-001  
686759-001  
686756-001  
686746-001  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
8
Eight-bay SFF hot-plug drive cage assembly  
Eight-bay SFF hot-plug drive backplane  
Four-bay LFF hot-plug drive backplane  
Four-bay LFF non-hot-plug drive bracket  
Storage drives  
9
10  
11  
12  
13  
LFF drives (8.89 cm, 3.5 in)  
Non-hot-plug drives, SATA  
a) 500 GB, 6G hard drive  
b) 1 TB, 6G hard drive*  
c) 2 TB, 6G hard drive*  
659571-001  
659569-001  
659570-001  
Mandatory1  
Mandatory1  
Mandatory1  
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Item Description  
Spare part  
number  
628183-001  
Customer self repair  
(on page 6)  
Mandatory1  
d) 3 TB, 6G hard drive*  
Non-hot-plug drives, SAS  
a) 450 GB, 6G hard drive*  
b) 600 GB, 6G hard drive*  
Hot-plug drives, SATA  
517353-001  
517355-001  
Mandatory1  
Mandatory1  
a) 100 GB, 3G MLC solid state drive*  
b) 200 GB, 3G MLC solid state drive*  
c) 400 GB, 3G MLC solid state drive*  
d) 500 GB, 6G hard drive*  
e) 1 TB, 6G hard drive*  
653968-001  
653969-001  
653970-001  
658103-001  
657739-001  
658102-001  
628182-001  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
f) 2 TB, 6G hard drive*  
g) 3 TB, 6G hard drive*  
Hot-plug drives, SAS  
a) 450 GB, 6G hard drive*  
b) 600 GB, 6G hard drive*  
c) 1 TB, 6G hard drive*  
653951-001  
653952-001  
653947-001  
653948-001  
653959-001  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
d) 2 TB, 6G hard drive*  
e) 3 TB, 6G hard drive*  
SFF drives (6.35 cm, 2.5 in)  
Hot-plug drives, SATA  
a) 100 GB, 3G MLC solid state drive*  
b) 200 GB, 3G MLC solid state drive*  
c) 400 GB, 3G MLC solid state drive*  
d) 500 GB, 6G hard drive*  
e) 1 TB, 6G hard drive*  
653965-001  
653966-001  
653967-001  
656107-001  
656108-001  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Hot-plug drives, SAS  
a) 146 GB, 6G hard drive*  
b) 200 GB, 6G SLC solid state drive*  
c) 300 GB, 6G hard drive*  
d) 300 GB, 6G hard drive*  
e) 400 GB, 6G SLC solid state drive*  
f) 450 GB, 6G hard drive*  
g) 500 GB, 6G hard drive*  
h) 600 GB, 6G hard drive*  
i) 800 GB, 6G MLC solid state drive*  
653950-001  
653961-001  
653955-001  
653960-001  
653962-001  
653956-001  
653953-001  
653957-001  
653964-001  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Illustrated parts catalog 20  
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Item Description  
Spare part  
number  
653971-001  
653954-001  
686749-001  
Customer self repair  
(on page 6)  
j) 900 GB, 6G hard drive*  
Mandatory1  
Mandatory1  
k) 1 TB, 6G hard drive*  
Front system fan (80 x 38 mm)  
Mandatory1  
Optional2  
14  
15  
System board assembly (includes alcohol pad 686757-001  
and thermal compound)  
Processors (includes alcohol pad and thermal —  
compound)  
a) 2.3-GHz Intel Xeon E3-1220LV2 processor, 686687-001  
2C, 3 MB, 17 W  
16  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
b) 2.5-GHz Intel Celeron G540 processor,  
2C, 2 MB, 65 W*  
665119-001  
c) 2.6-GHz Intel Celeron G1610 processor, 715893-001  
2C 2 MB 55 W*  
d) 2.7-GHz Intel Celeron G1620 processor, 715894-001  
2C 2 MB 55 W*  
e) 3.1-GHz Intel Pentium G2020 processor,  
2C 3 MB 55 W*  
715897-001  
f) 3.1-GHz Intel Pentium G2120 processor,  
2C, 3 MB, 65 W*  
703516-001  
g) 3.1-GHz Intel Xeon E3-1220V2 processor, 686686-001  
4C, 8 MB, 69 W*  
h) 3.2-GHz Intel Pentium G2130 processor,  
2C 3 MB 55 W*  
715898-001  
i) 3.3-GHz Intel Xeon i3-3220 processor, 2C, 701538-001  
3 MB, 55 W*  
j) 3.3-GHz Intel Xeon E3-1230V2 processor, 686685-001  
4C, 8 MB, 69 W*  
k) 3.4-GHz Intel Xeon i3-3240 processor, 2C, 701537-001  
3 MB, 55 W*  
l) 3.4-GHz Intel Xeon E3-1240V2 processor, 686684-001  
4C, 8 MB, 69 W*  
m) 3.5-GHz Intel Xeon E3-1270V2 processor, 686683-001  
4C, 8 MB, 69 W*  
n) 3.6-GHz Intel Xeon E3-1280V2 processor, 686682-001  
4C, 8 MB, 69 W*  
Heatsink  
686741-001  
Optional2  
17  
18  
DIMMs  
a) 2 GB, single-rank x8 PC3-12800E-11  
b) 2 GB, single-rank x8 PC3L-10600E-9*  
c) 4 GB, dual-rank x8 PC3-12800E-11*  
d) 4 GB, dual-rank x8 PC3L-10600E-9*  
e) 8 GB, dual-rank x8 PC3-12800E-11*  
f) 8 GB, dual-rank x8 PC3L-10600E-9*  
664633-001  
664694-001  
664034-001  
664695-001  
684035-001  
664696-001  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Rear system fan (92 x 32 mm)  
686748-001  
686742-001  
686761-001  
Mandatory1  
Mandatory1  
Mandatory1  
19  
20  
21  
Dedicated iLO management port module  
HP 350 W 4U Integrated Power Supply Kit  
Illustrated parts catalog 21  
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Item Description  
Spare part  
number  
Customer self repair  
(on page 6)  
HP 460 W CS Gold Hot Plug Power Supply Kit 511777-001  
(92% efficiency)  
RPS backplane module  
Mandatory1  
22  
23  
686744-001  
Mandatory1  
Cables  
8-pin to 4-pin power adapter cable*  
500-mm Mini-SAS cable*  
686755-001  
647756-001  
686747-001  
Mandatory1  
Mandatory1  
Mandatory1  
24  
25  
26  
Mini-SAS to SATA cable assembly (for LFF  
drive cage)*  
* Not shown  
1Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be  
charged for the travel and labor costs of this service.  
2Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If,  
however, you require that HP replace them for you, there may or may not be additional charges, depending on the type  
of warranty service designated for your product.  
3No—Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty, HP requires that  
an authorized service provider replace the part. These parts are identified as "No" in the Illustrated Parts Catalog.  
1Mandatory: Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de  
remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.  
2Optional: Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également  
conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de remplacer ces  
pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à votre produit.  
3No: Non—Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la réparation. Pour  
que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit effectué par un Mainteneur Agréé. Ces  
pièces sont identifiées par la mention “Non” dans le Catalogue illustré.  
1Mandatory: Obbligatorie—Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la  
riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio.  
2Optional: Opzionali—Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti  
progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere spese  
addizionali a seconda del tipo di garanzia previsto per il prodotto.  
3No: Non CSR—Alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la  
garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate  
da un “No” nel Catalogo illustrato dei componenti.  
1Mandatory: Zwingend—Teile, die im Rahmen des Customer Self Repair Programms ersetzt werden müssen. Wenn Sie  
diese Teile von HP ersetzen lassen, werden Ihnen die Versand- und Arbeitskosten für diesen Service berechnet.  
2Optional: Optional—Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für Customer  
Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten, können bei  
diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche Kosten anfallen.  
3No: Kein—Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen,  
muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw.  
„Nein“ gekennzeichnet.  
1Mandatory: Obligatorio—componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a HP  
que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de mano  
de obra de dicho servicio.  
2Optional: Opcional— componentes para los que la reparación por parte del usuario es opcional. Estos componentes  
también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si precisa que HP realice su  
Illustrated parts catalog 22  
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sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de servicio de garantía correspondiente al  
producto.  
3No: No—Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que el usuario  
haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado realice la sustitución de estos  
componentes. Dichos componentes se identifican con la palabra “No” en el catálogo ilustrado de componentes.  
1Mandatory: Verplicht—Onderdelen waarvoor Customer Self Repair verplicht is. Als u HP verzoekt deze onderdelen te  
vervangen, komen de reiskosten en het arbeidsloon voor uw rekening.  
2Optional: Optioneel—Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn  
ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen  
daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het product.  
3No: Nee—Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met de  
garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen. Deze  
onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".  
1Mandatory: Obrigatória—Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças,  
serão cobradas as despesas de transporte e mão-de-obra do serviço.  
2Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o  
reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa  
adicional, dependendo do tipo de serviço de garantia destinado ao produto.  
3No: Nenhuma—Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia  
do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão identificadas com a marca “No”  
(Não), no catálogo de peças ilustrado.  
Illustrated parts catalog 23  
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Removal and replacement procedures  
Required tools  
You need the following items for some procedures:  
T-10/T-15 Torx screwdriver (on page 75)  
Flathead screwdriver  
HP Insight Diagnostics (on page 62)  
Safety considerations  
Before performing service procedures, review all the safety information.  
Preventing electrostatic discharge  
To prevent damaging the system, be aware of the precautions you need to follow when setting up the system  
or handling parts. A discharge of static electricity from a finger or other conductor may damage system  
boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the device.  
To prevent electrostatic damage:  
Avoid hand contact by transporting and storing products in static-safe containers.  
Keep electrostatic-sensitive parts in their containers until they arrive at static-free workstations.  
Place parts on a grounded surface before removing them from their containers.  
Avoid touching pins, leads, or circuitry.  
Always be properly grounded when touching a static-sensitive component or assembly.  
Symbols on equipment  
The following symbols may be placed on equipment to indicate the presence of potentially hazardous  
conditions.  
This symbol indicates the presence of hazardous energy circuits or electric shock  
hazards. Refer all servicing to qualified personnel.  
WARNING: To reduce the risk of injury from electric shock hazards, do not open this  
enclosure. Refer all maintenance, upgrades, and servicing to qualified personnel.  
This symbol indicates the presence of electric shock hazards. The area contains no user  
or field serviceable parts. Do not open for any reason.  
WARNING: To reduce the risk of injury from electric shock hazards, do not open this  
enclosure.  
Removal and replacement procedures 24  
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This symbol on an RJ-45 receptacle indicates a network interface connection.  
WARNING: To reduce the risk of electric shock, fire, or damage to the equipment, do  
not plug telephone or telecommunications connectors into this receptacle.  
This symbol indicates the presence of a hot surface or hot component. If this surface is  
contacted, the potential for injury exists.  
WARNING: To reduce the risk of injury from a hot component, allow the surface to cool  
before touching.  
This symbol indicates that the component exceeds the recommended weight for one  
individual to handle safely.  
WARNING: To reduce the risk of personal injury or damage to the equipment, observe  
local occupational health and safety requirements and guidelines for manual material  
handling.  
These symbols, on power supplies or systems, indicate that the equipment is supplied  
by multiple sources of power.  
WARNING: To reduce the risk of injury from electric shock, remove all power cords to  
completely disconnect power from the system.  
Server warnings and cautions  
WARNING: This server is very heavy. To reduce the risk of personal injury or damage to the  
equipment:  
Observe local occupational health and safety requirements and guidelines for manual  
material handling.  
Get help to lift and stabilize the product during installation or removal, especially when the  
product is not fastened to the rails. HP recommends that a minimum of two people are required  
for all rack server installations. A third person may be required to help align the server if the  
server is installed higher than chest level.  
Use caution when installing the server in or removing the server from the rack; it is unstable  
when not fastened to the rails.  
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the  
internal system components to cool before touching them.  
WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment,  
remove the power cord to remove power from the server. The front panel Power On/Standby  
button does not completely shut off system power. Portions of the power supply and some internal  
circuitry remain active until AC power is removed.  
CAUTION: Protect the server from power fluctuations and temporary interruptions with a  
regulating uninterruptible power supply. This device protects the hardware from damage caused  
by power surges and voltage spikes and keeps the system in operation during a power failure.  
CAUTION: Do not operate the server for long periods with the access panel open or removed.  
Operating the server in this manner results in improper airflow and improper cooling that can  
lead to thermal damage.  
Removal and replacement procedures 25  
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Preparation procedures  
To access some components and perform certain service procedures, perform one or more of the following  
procedures:  
Unlock the tower bezel.  
Remove the tower bezel (on page 26).  
Power down the server (on page 26).  
Before removing the server from a rack or a non-hot-plug component from the server, power down the  
server.  
Remove the access panel ("Access panel" on page 31).  
Remove the tower bezel  
1.  
2.  
Unlock and open the tower bezel.  
Pull the bezel away from the front chassis.  
Power down the server  
Before powering down the server for any upgrade or maintenance procedures, perform a backup of critical  
server data and programs.  
WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment,  
remove the power cord to remove power from the server. The front panel Power On/Standby  
button does not completely shut off system power. Portions of the power supply and some internal  
circuitry remain active until AC power is removed.  
IMPORTANT: When the server is in standby mode, auxiliary power is still being provided to the  
system.  
Removal and replacement procedures 26  
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To power down the server, use one of the following methods:  
Press and release the Power On/Standby button.  
This method initiates a controlled shutdown of applications and the OS before the server enters standby  
mode.  
Press and hold the Power On/Standby button for more than 4 seconds to force the server to enter  
standby mode.  
This method forces the server to enter standby mode without properly exiting applications and the OS.  
If an application stops responding, you can use this method to force a shutdown.  
Use a virtual power button selection through iLO.  
This method initiates a controlled remote shutdown of applications and the OS before the server enters  
standby mode.  
Before proceeding, verify the server is in standby mode by observing that the system power LED is amber.  
Drive blank or carrier  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all bays are populated with either a component or a blank.  
To remove the component:  
1.  
2.  
Unlock and open the tower bezel.  
Do one of the following:  
o
In a non-hot-plug drive configuration, remove the drive carrier.  
To replace the drive carrier, slide the component into the bay until it clicks.  
Removal and replacement procedures 27  
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o
In a hot-plug drive configuration, remove the drive blank.  
To replace the LFF drive blank, slide the component into the bay until it clicks.  
To replace the SFF drive blank, while pressing the release latch, slide the component into the bay  
until it is fully seated.  
Storage drive  
Non-hot-plug drive  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all bays are populated with either a component or a blank.  
To remove the component:  
1.  
2.  
3.  
Back up all server data on the drive.  
Power down the server (on page 26).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Unlock and open the tower bezel.  
4.  
Removal and replacement procedures 28  
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5.  
Remove the drive.  
6.  
Remove the drive from the carrier.  
To replace the component, reverse the removal procedure.  
Hot-plug drive  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all bays are populated with either a component or a blank.  
To remove the component:  
1.  
2.  
Back up all server data on the drive.  
Determine the status of the drive from the drive LED definitions ("Hot-plug drive LED definitions" on page  
3.  
Unlock and open the tower bezel.  
Removal and replacement procedures 29  
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4.  
Remove the drive.  
To replace the component, reverse the removal procedure.  
Hot-plug power supply  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all bays are populated with either a component or a blank.  
To remove the component:  
1.  
2.  
Power down the server (on page 26).  
WARNING: To reduce the risk of personal injury from hot surfaces, allow the power supply or  
power supply blank to cool before touching it.  
Remove the power supply.  
Power redundancy requires the presence of two power supply modules in the system.  
Removal and replacement procedures 30  
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CAUTION: The default and redundant power supplies in the server must have the same output  
power capacity. Verify that all power supplies have the same part number and label color. The  
system becomes unstable and might shut down when it detects mismatched power supplies.  
To replace the component, reverse the removal procedure.  
Access panel  
To remove the component:  
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the  
internal system components to cool before touching them.  
CAUTION: For proper cooling, do not operate the server without the access panel, baffles,  
expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize  
the amount of time the access panel is open.  
1.  
2.  
Power down the server (on page 26).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Unlock the tower bezel.  
3.  
4.  
5.  
Place the server on its side.  
Remove the access panel:  
a. Loosen the access panel thumbscrew.  
b. Slide the access panel back.  
c. Lift the access panel away from the chassis.  
To replace the component, reverse the removal procedure.  
Removal and replacement procedures 31  
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Air baffle  
To remove the component:  
CAUTION: For proper cooling, do not operate the server without the access panel, baffles,  
expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize  
the amount of time the access panel is open.  
1.  
2.  
Power down the server (on page 26).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Unlock the tower bezel.  
3.  
4.  
5.  
Remove the access panel ("Access panel" on page 31).  
Remove the air baffle.  
To replace the component, reverse the removal procedure.  
Optical drive  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all bays are populated with either a component or a blank.  
To remove the component:  
1.  
2.  
Power down the server (on page 26).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Unlock and open the tower bezel.  
3.  
4.  
Remove the access panel ("Access panel" on page 31).  
Removal and replacement procedures 32  
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5.  
6.  
Disconnect the SATA and power cables from the optical drive.  
Remove the optical drive.  
To replace the component, reverse the removal procedure.  
Drive cage  
To remove the component:  
1.  
2.  
Power down the server (on page 26).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Remove the tower bezel (on page 26).  
3.  
4.  
5.  
6.  
7.  
Remove the access panel ("Access panel" on page 31).  
If the drives are connected to a storage controller card, remove the air baffle.  
Remove all installed drives ("Storage drive" on page 28).  
Disconnect the drive cage cables:  
a. Disconnect the Mini-SAS cable from the system board or from the storage controller option.  
b. Disconnect the drive power cable from the 10-pin power supply connector.  
Remove the drive cage:  
8.  
Removal and replacement procedures 33  
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o
Four-bay LFF drive cage  
o
Eight-bay SFF drive cage  
To replace the component, reverse the removal procedure.  
To convert the four-bay non-hot-plug drive cage to a hot-plug model, remove the cage bracket, and then  
install the hot-plug backplane option before installing the cage back to the server ("Drive cage bracket or  
Drive cage bracket or backplane  
To remove the component:  
1.  
2.  
Power down the server (on page 26).  
Remove all power:  
a. Disconnect each power cord from the power source.  
Removal and replacement procedures 34  
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b. Disconnect each power cord from the server.  
3.  
4.  
5.  
6.  
Remove the tower bezel (on page 26).  
Remove the access panel ("Access panel" on page 31).  
Remove all installed drives ("Storage drive" on page 28).  
Disconnect the drive cage cables:  
a. Disconnect the Mini-SAS cable from the system board or from the storage controller option.  
b. Disconnect the drive power cable from the 10-pin power supply connector.  
Remove the LFF drive cage assembly.  
7.  
8.  
Do one of the following:  
For image clarity, the Mini-SAS and power cables attached to the drive cage are not shown in the  
following figures.  
o
For a non-hot-plug drive cage, loosen the bracket thumbscrew, and then remove the bracket  
assembly from the drive cage.  
Removal and replacement procedures 35  
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o
For a hot-plug drive cage, loosen the backplane thumbscrew, and then remove the backplane  
assembly from the drive cage.  
To replace the component, reverse the removal procedure.  
Front I/O module  
To remove the component:  
1.  
2.  
Power down the server (on page 26).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Unlock and open the tower bezel.  
3.  
4.  
5.  
6.  
Remove the access panel ("Access panel" on page 31).  
Remove the air baffle ("Air baffle" on page 32).  
Disconnect the front USB and LED cables from the system board ("Front panel cabling" on page 76).  
Removal and replacement procedures 36  
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7.  
Remove the front I/O module.  
To replace the component, reverse the removal procedure.  
Front system fan  
To remove the component:  
1.  
2.  
Power down the server (on page 26).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Unlock the tower bezel.  
3.  
4.  
5.  
6.  
Remove the access panel ("Access panel" on page 31).  
Remove the air baffle ("Air baffle" on page 32).  
Disconnect the fan cable.  
Removal and replacement procedures 37  
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7.  
Press the release latch, and then remove the fan module.  
To replace the component, reverse the removal procedure.  
DIMMs  
General DIMM slot population guidelines  
The server has four memory slots.  
The server supports two channels with two DIMM slots per channel.  
o
o
Memory channel 1 consists of the two DIMMs that are closest to the processor.  
Memory channel 2 consists of the two DIMMs that are farthest from the processor.  
White DIMM slot indicates the first slot of a channel (2-A, 4-B).  
Memory speed support depends on the type of processor installed. See the technical specification of the  
installed processor for more information.  
The server supports up to 1600 MT/s ECC UDIMMs.  
The server supports up to 32 GB (4x8 GB) UDIMMs.  
The server does not support:  
o
o
o
RDIMMs  
Non-ECC UDIMMs  
Elpida DIMMs  
When installing DIMMs:  
o
o
Populate the DIMM slots in this sequence: 2-A, 4-B, 1-C, 3-D.  
Use HP-qualified UDIMMs.  
Removal and replacement procedures 38  
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Removing a DIMM  
1.  
2.  
Power down the server (on page 26).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Unlock the tower bezel.  
3.  
4.  
5.  
6.  
7.  
Remove the access panel ("Access panel" on page 31).  
Remove the air baffle ("Air baffle" on page 32).  
Open the DIMM slot latches.  
Remove the DIMM.  
To replace the component, reverse the removal procedure.  
Heatsink  
To remove the component:  
1.  
2.  
Power down the server (on page 26).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Unlock the tower bezel.  
3.  
4.  
5.  
6.  
Remove the access panel ("Access panel" on page 31).  
Remove the air baffle ("Air baffle" on page 32).  
Remove the heatsink:  
a. Loosen one pair of diagonally opposite screws halfway, and then loosen the other pair of screws.  
b. Completely loosen all screws in the same sequence.  
Removal and replacement procedures 39  
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c. Remove the heatsink from the processor backplate.  
To replace the component:  
1.  
Clean the old thermal grease from the processor with the alcohol swab. Allow the alcohol to evaporate  
before continuing.  
2.  
Remove the thermal interface protective cover from the heatsink.  
CAUTION: Do not overtighten the screws as this might damage the board, connectors, or screws  
and voids the warranty of the board.  
3.  
Install the heatsink:  
a. Position the heatsink using the guide pin on the processor backplate.  
b. Tighten one pair of diagonally opposite screws halfway, and then tighten the other pair of screws.  
Removal and replacement procedures 40  
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c. Finish the installation by completely tightening the screws in the same sequence.  
4.  
5.  
6.  
7.  
8.  
9.  
Install the air baffle ("Air baffle" on page 32).  
Install the access panel.  
Lock the tower bezel.  
Connect each power cord to the server.  
Connect each power cord to the power source.  
Press the Power On/Standby button.  
The server exits standby mode and applies full power to the system. The system power LED changes  
from amber to green.  
Processor  
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the  
internal system components to cool before touching them.  
CAUTION: To avoid damage to the processor and system board, only authorized personnel  
should attempt to replace or install the processor in this server.  
IMPORTANT: If installing a processor with a faster speed, update the system ROM before  
installing the processor.  
To remove the component:  
1.  
2.  
Power down the server (on page 26).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Unlock the tower bezel.  
3.  
4.  
Remove the access panel ("Access panel" on page 31).  
Removal and replacement procedures 41  
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5.  
6.  
Remove the air baffle ("Air baffle" on page 32).  
Remove the heatsink ("Heatsink" on page 39).  
CAUTION: To avoid damage to the processor, do not touch the bottom of the processor,  
especially the contact area.  
CAUTION: The pins on the processor socket are very fragile. Any damage to them may require  
replacing the system board.  
7.  
8.  
Open the processor locking lever, and then open the processor retaining bracket.  
Grasp the processor by the edges, and then lift it out of the socket.  
To replace the component:  
CAUTION: Failure to completely open the processor locking lever prevents the processor from  
seating during installation, leading to hardware damage.  
CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To  
avoid damage to the system board:  
Do not touch the processor socket contacts.  
Do not tilt or slide the processor when lowering the processor into the socket.  
Removal and replacement procedures 42  
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1.  
Install the processor. Use the notches on both sides of the processor to properly align it into the socket.  
CAUTION: Be sure to close the processor socket retaining bracket before closing the processor  
locking lever. The lever should close without resistance. Forcing the lever closed can damage the  
processor and socket, requiring system board replacement.  
2.  
Close the processor retaining bracket, and then secure the processor locking lever.  
3.  
4.  
Clean the old thermal grease from the heatsink with the alcohol swab. Allow the alcohol to evaporate  
before continuing.  
Apply all the grease to the top of the processor in the following pattern to ensure even distribution.  
Removal and replacement procedures 43  
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CAUTION: Do not overtighten the screws as this might damage the board, connectors, or screws  
and voids the warranty of the board.  
5.  
Install the heatsink:  
a. Position the heatsink using the guide pin on the processor backplate.  
b. Tighten one pair of diagonally opposite screws halfway, and then tighten the other pair of screws.  
c. Finish the installation by completely tightening the screws in the same sequence.  
6.  
7.  
8.  
9.  
Install the air baffle.  
Install the access panel.  
Lock the tower bezel.  
Connect each power cord to the server.  
10. Connect each power cord to the power source.  
11. Press the Power On/Standby button.  
The server exits standby mode and applies full power to the system. The system power LED changes  
from amber to green.  
Expansion board  
To remove the component:  
1.  
2.  
Power down the server (on page 26).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Unlock the tower bezel.  
3.  
4.  
5.  
6.  
Remove the access panel ("Access panel" on page 31).  
Remove the air baffle ("Air baffle" on page 32).  
Disconnect all cables connected to the expansion board.  
Removal and replacement procedures 44  
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7.  
8.  
9.  
Remove the expansion slot cover retainer.  
If removing a full-length expansion board, remove the board retainer securing it.  
Remove the expansion board.  
To replace the component, reverse the removal procedure.  
Flash-backed write cache procedures  
The following types of procedures are provided for the FBWC option:  
Removal and replacement of failed components:  
o
o
Removing the cache module ("FBWC module" on page 45)  
Removing the capacitor pack ("Capacitor pack" on page 46)  
Recovery of cached data from a failed server ("Recovering data from the flash-backed write cache" on  
page 48)  
CAUTION: Do not detach the cable that connects the battery pack or capacitor pack to the cache  
module. Detaching the cable causes any unsaved data in the cache module to be lost.  
FBWC module  
CAUTION: The cache module connector does not use the industry-standard DDR3 mini-DIMMs.  
Do not use the controller with cache modules designed for other controller models, because the  
controller can malfunction and you can lose data. Also, do not transfer this cache module to an  
unsupported controller model, because you can lose data.  
CAUTION: In systems that use external data storage, be sure that the server is the first unit to be  
powered down and the last to be powered back up. Taking this precaution ensures that the system  
does not erroneously mark the drives as failed when the server is powered up.  
To remove the component:  
Power down the server (on page 26).  
1.  
Removal and replacement procedures 45  
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2.  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Unlock and open the tower bezel.  
3.  
4.  
5.  
Remove the access panel ("Access panel" on page 31).  
Remove the air baffle ("Air baffle" on page 32).  
CAUTION: When connecting or disconnecting the capacitor pack cable, the connectors on the  
cache module and cable are susceptible to damage. Avoid excessive force and use caution to  
avoid damage to these connectors.  
6.  
Disconnect the capacitor pack cable from the cache module.  
7.  
Remove the cache module.  
To replace the component, reverse the removal procedure.  
Capacitor pack  
Removal and replacement procedures 46  
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CAUTION: In systems that use external data storage, be sure that the server is the first unit to be  
powered down and the last to be powered back up. Taking this precaution ensures that the system  
does not erroneously mark the drives as failed when the server is powered up.  
To remove the component:  
1.  
2.  
Power down the server (on page 26).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Unlock the tower bezel.  
3.  
4.  
5.  
6.  
Remove the access panel ("Access panel" on page 31).  
Remove the air baffle ("Air baffle" on page 32).  
If the existing cache module is connected to a capacitor pack, observe the FBWC module LEDs:  
o
o
If a backup is in progress, wait for the backup to complete.  
If the backup is complete, or if the cache has failed, remove the controller from the server, and then  
continue with the next step.  
7.  
Disconnect the capacitor pack cable from the cache module.  
Removal and replacement procedures 47  
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8.  
Remove the capacitor pack.  
To replace the component, reverse the removal procedure.  
Recovering data from the flash-backed write cache  
If the server fails, use the following procedure to recover data temporarily stored in the FBWC.  
CAUTION: Before starting this procedure, read the information about protecting against  
electrostatic discharge ("Preventing electrostatic discharge" on page 24).  
1.  
Perform one of the following:  
o
Set up a recovery server using an identical server model. Do not install any internal drives or FBWC  
in this server. (HP recommends this option.)  
o
Find a server that has enough empty drive bays to accommodate all the drives from the failed server  
and that meets all the other requirements for drive and array migration.  
2.  
3.  
4.  
Power down the failed server ("Power down the server" on page 26).  
Transfer the drives from the failed server to the recovery server.  
Perform one of the following:  
o
If the array controller has failed, remove the cache module and capacitor pack from the failed array  
controller, and install the cache module and capacitor pack on an identical array controller model  
in the recovery server.  
o
If the server has failed, remove the controller, cache module, and capacitor pack from the failed  
server, and install the controller, cache module, and capacitor pack in the recovery server.  
5.  
Power up the recovery server. If there was data in the cache at the time of the controller or server failure,  
a 1792 POST message appears, stating that valid data was flushed from the cache. This data is now  
stored on the drives in the recovery server. You can now transfer the drives (and controller, if one is  
used) to another server.  
If the drives are migrated to different drive positions or there are volumes present in the recovery server,  
a 1724 POST message appears, stating that logical drive configuration has been updated  
automatically.  
Removal and replacement procedures 48  
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System battery  
If the server no longer automatically displays the correct date and time, then replace the battery that provides  
power to the real-time clock. Under normal use, battery life is 5 to 10 years.  
WARNING: The computer contains an internal lithium manganese dioxide, a vanadium  
pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not  
properly handled. To reduce the risk of personal injury:  
Do not attempt to recharge the battery.  
Do not expose the battery to temperatures higher than 60°C (140°F).  
Do not disassemble, crush, puncture, short external contacts, or dispose of in fire or water.  
Replace only with the spare designated for this product.  
To remove the component:  
1.  
2.  
Power down the server (on page 26).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Unlock the tower bezel.  
3.  
4.  
5.  
6.  
Remove the access panel ("Access panel" on page 31).  
Locate the battery on the system board ("System board components" on page 69).  
Remove the battery.  
IMPORTANT: Replacing the system board battery resets the system ROM to its default  
configuration. After replacing the battery, reconfigure the system through RBSU.  
To replace the component, reverse the removal procedure.  
For more information about battery replacement or proper disposal, contact an authorized reseller or an  
authorized service provider.  
Removal and replacement procedures 49  
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Rear system fan  
To remove the component:  
1.  
2.  
Power down the server (on page 26).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Unlock the tower bezel.  
3.  
4.  
5.  
6.  
7.  
8.  
Remove the access panel ("Access panel" on page 31).  
Remove the air baffle ("Air baffle" on page 32).  
Remove any existing expansion board that blocks access to the rear system fan connector.  
Disconnect the fan cable.  
Press and hold the fan latch, and then remove the fan.  
To replace the component, reverse the removal procedure.  
Dedicated iLO management port  
To remove the component:  
1.  
2.  
Power down the server (on page 26).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Unlock the tower bezel.  
3.  
4.  
5.  
6.  
Remove the access panel ("Access panel" on page 31).  
Remove the air baffle ("Air baffle" on page 32).  
Remove the rear system fan ("Rear system fan" on page 50).  
Removal and replacement procedures 50  
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7.  
Remove the iLO module from the chassis.  
To replace the component, reverse the removal procedure.  
Enabling the dedicated iLO management port  
The onboard NIC 1/shared iLO connector is set as the default system iLO port.  
To enable the installed dedicated iLO module:  
1.  
2.  
3.  
4.  
5.  
6.  
7.  
During the server startup sequence after module installation, to access iLO RBSU, press the F8 key.  
Select the Network menu.  
Click the Network Interface Adapter field.  
To change the setting to ON, press the spacebar.  
To save the new settings, press the F10 key.  
Select the File menu, and then to close iLO RBSU, click Exit.  
To confirm exiting iLO RBSU, click OK. The server automatically reboots.  
IMPORTANT: If the iLO RBSU settings are reset to the default values, access to the machine will be  
lost. Access the physical machine, and then set the Network Interface Adapter field to ON.  
Non-hot-plug power supply  
To remove the component:  
1.  
2.  
Power down the server (on page 26).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Unlock the tower bezel.  
3.  
4.  
Remove the access panel ("Access panel" on page 31).  
Removal and replacement procedures 51  
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WARNING: To reduce the risk of personal injury from hot surfaces, allow the power supply or  
power supply blank to cool before touching it.  
5.  
6.  
Disconnect the power supply cables from the drive cage and the system board.  
Remove the power supply.  
To replace the component, reverse the removal procedure.  
RPS backplane module  
To remove the component:  
1.  
2.  
Power down the server (on page 26).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Unlock and open the tower bezel.  
3.  
4.  
5.  
6.  
7.  
Remove the access panel ("Access panel" on page 31).  
Remove the EMI shield from the lower media bay.  
Remove the optical drive from the upper media bay ("Optical drive" on page 32).  
Disconnect the power supply cables from the drive cage and the system board.  
Removal and replacement procedures 52  
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8.  
Remove the RPS backplane module.  
To replace the component, reverse the removal procedure.  
RPS cage  
To remove the component:  
1.  
2.  
Power down the server (on page 26).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Unlock the tower bezel.  
3.  
4.  
5.  
6.  
7.  
8.  
9.  
Remove the access panel ("Access panel" on page 31).  
Remove the air baffle ("Air baffle" on page 32).  
Disconnect the power supply cables from the system board and the drives.  
Remove the EMI shield from the lower media bay.  
Remove the optical drive from the upper media bay ("Optical drive" on page 32).  
Remove the hot-plug power supplies ("Hot-plug power supply" on page 30).  
10. Remove the RPS backplane module ("RPS backplane module" on page 52).  
Removal and replacement procedures 53  
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11. Remove the power supply cage.  
To replace the component, reverse the removal procedure.  
System board  
CAUTION: To avoid ESD damage, when removing electrostatic-sensitive components from the  
failed system board, place the components on a static-dissipating work surface or inside separate  
antistatic bags.  
To remove the system board:  
1.  
2.  
Power down the server (on page 26).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
Unlock the tower bezel.  
3.  
4.  
5.  
6.  
7.  
8.  
Remove the access panel ("Access panel" on page 31).  
Remove the air baffle ("Air baffle" on page 32).  
Remove the rear system fan ("Rear system fan" on page 50).  
Remove the capacitor pack ("Capacitor pack" on page 46).  
Remove the heatsink:  
a. Loosen one pair of diagonally opposite screws halfway, and then loosen the other pair of screws.  
b. Completely loosen all screws in the same sequence.  
Removal and replacement procedures 54  
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c. Remove the heatsink from the processor backplate.  
CAUTION: To avoid damage to the processor, do not touch the bottom of the processor,  
especially the contact area.  
9.  
Open the processor locking lever, and then open the processor retaining bracket.  
10. Grasp the processor by the edges, and then lift it out of the socket.  
11. Remove all DIMMs ("Removing a DIMM" on page 39).  
12. Remove all expansion boards ("Expansion board" on page 44).  
13. If installed, remove the dedicated iLO module ("Dedicated iLO management port" on page 50).  
14. Disconnect all cables connected to the system board.  
15. Remove the system board:  
a. Remove the system board screws.  
Removal and replacement procedures 55  
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b. Lift the system board out of the chassis.  
To replace the system board:  
1.  
Install the system board.  
2.  
3.  
4.  
5.  
Connect all cables disconnected from the failed system board.  
Install the DIMMs.  
If removed, install the dedicated iLO management port.  
Install the expansion boards.  
CAUTION: Failure to completely open the processor locking lever prevents the processor from  
seating during installation, leading to hardware damage.  
CAUTION: To avoid damage to the processor, do not touch the bottom of the processor,  
especially the contact area.  
Removal and replacement procedures 56  
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6.  
Open the processor locking lever, and then open the processor retaining bracket.  
7.  
Remove the processor socket cover.  
CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To  
avoid damage to the system board:  
Do not touch the processor socket contacts.  
Do not tilt or slide the processor when lowering the processor into the socket.  
Removal and replacement procedures 57  
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8.  
Install the processor. Use the notches on both sides of the processor to properly align it into the socket.  
CAUTION: Be sure to close the processor socket retaining bracket before closing the processor  
locking lever. The lever should close without resistance. Forcing the lever closed can damage the  
processor and socket, requiring system board replacement.  
9.  
Close the processor retaining bracket, and then secure the processor locking lever.  
10. Clean the old thermal grease from the heatsink and the top of the processor with the alcohol swab.  
Allow the alcohol to evaporate before continuing.  
11. Apply all the grease to the top of the processor in the following pattern to ensure even distribution.  
Removal and replacement procedures 58  
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CAUTION: Do not overtighten the screws as this might damage the board, connectors, or screws  
and voids the warranty of the board.  
12. Install the heatsink:  
a. Position the heatsink using the guide pin on the processor backplate.  
b. Tighten one pair of diagonally opposite screws halfway, and then tighten the other pair of screws.  
c. Finish the installation by completely tightening the screws in the same sequence.  
CAUTION: When returning a damaged system board to HP, always install all processor socket  
covers to prevent damage to the processor sockets and system board.  
13. Install the processor socket cover on the failed system board.  
14. Connect all cables disconnected from the failed system board.  
15. Install the capacitor pack.  
16. Install the rear system fan.  
17. Install the air baffle.  
18. Install the access panel.  
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19. Lock the tower bezel.  
20. Connect each power cord to the server.  
21. Connect each power cord to the power source.  
22. Press the Power On/Standby button.  
The server exits standby mode and applies full power to the system. The system power LED changes  
from amber to green.  
After you replace the system board, you must re-enter the server serial number and the product ID.  
1.  
2.  
3.  
4.  
During the server startup sequence, press the F9 key to access RBSU.  
Select the Advanced Options menu.  
Select Service Options.  
Select Serial Number. The following warning appears:  
Warning: The serial number should ONLY be modified by qualified service  
personnel. This value should always match the serial number located on the  
chassis.  
5.  
6.  
7.  
Press the Enter key to clear the warning.  
Enter the serial number and press the Enter key.  
Select Product ID. The following warning appears:  
Warning: The Product ID should ONLY be modified by qualified service  
personnel. This value should always match the Product ID located on the  
chassis.  
8.  
9.  
Enter the product ID and press the Enter key.  
Press the Esc key to close the menu.  
10. Press the Esc key to exit RBSU.  
11. Press the F10 key to confirm exiting RBSU. The server automatically reboots.  
HP Trusted Platform Module  
The TPM is not a customer-removable part.  
CAUTION: Any attempt to remove an installed TPM from the system board breaks or disfigures  
the TPM security rivet. Upon locating a broken or disfigured rivet on an installed TPM,  
administrators should consider the system compromised and take appropriate measures to ensure  
the integrity of the system data.  
If you suspect a TPM board failure, leave the TPM installed and remove the system board. Contact an HP  
authorized service provider for a replacement system board and TPM board.  
Removal and replacement procedures 60  
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Troubleshooting  
Troubleshooting resources  
The HP ProLiant Gen8 Troubleshooting Guide, Volume I: Troubleshooting provides procedures for resolving  
common problems and comprehensive courses of action for fault isolation and identification, issue resolution,  
and software maintenance on ProLiant servers and server blades. To view the guide, select a language:  
The HP ProLiant Gen8 Troubleshooting Guide, Volume II: Error Messages provides a list of error messages  
and information to assist with interpreting and resolving error messages on ProLiant servers and server  
blades. To view the guide, select a language:  
Troubleshooting 61  
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Diagnostic tools  
HP Insight Diagnostics  
HP Insight Diagnostics is a proactive server management tool, available in both offline and online versions,  
that provides diagnostics and troubleshooting capabilities to assist IT administrators who verify server  
installations, troubleshoot problems, and perform repair validation.  
HP Insight Diagnostics Offline Edition performs various in-depth system and component testing while the OS  
is not running. To run this utility, boot the server using Intelligent Provisioning.  
HP Insight Diagnostics Online Edition is a web-based application that captures system configuration and  
other related data needed for effective server management. Available in Microsoft Windows and Linux  
versions, the utility helps to ensure proper system operation.  
For more information or to download the utility, see the HP website (http://www.hp.com/servers/diags). HP  
Insight Diagnostics Online Edition is also available in the SPP. For more information, see the HP website  
HP Insight Diagnostics survey functionality  
HP Insight Diagnostics (on page 62) provides survey functionality that gathers critical hardware and software  
information on ProLiant servers.  
This functionality supports operating systems that are supported by the server. For operating systems  
supported by the server, see the HP website (http://www.hp.com/go/supportos).  
If a significant change occurs between data-gathering intervals, the survey function marks the previous  
information and overwrites the survey data files to reflect the latest changes in the configuration.  
Survey functionality is installed with every Intelligent Provisioning-assisted HP Insight Diagnostics installation,  
or it can be installed through the SPP.  
HP Insight Remote Support software  
HP strongly recommends that you install HP Insight Remote Support software to complete the installation or  
upgrade of your product and to enable enhanced delivery of your HP Warranty, HP Care Pack Service, or  
HP contractual support agreement. HP Insight Remote Support supplements your monitoring continuously to  
ensure maximum system availability by providing intelligent event diagnosis, and automatic, secure  
submission of hardware event notifications to HP, which will initiate a fast and accurate resolution, based on  
your product’s service level. Notifications may be sent to your authorized HP Channel Partner for onsite  
service, if configured and available in your country.  
The HP Insight Remote Support software extends the HP enterprise remote support portfolio for customers with  
small and medium size IT environments. The software is available in two variants:  
HP Insight Remote Support 7.x software is optimized to support up to 500 managed systems and can  
be installed on a Windows ProLiant hosting device or a Windows ESXi Virtual Machine. It can be  
integrated easily to work with a supported version of HP Systems Insight Manager. HP Insight Remote  
Diagnostic tools 62  
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Support 7.x provides anytime, anywhere personalized access to your IT environment through HP Insight  
Online, and is also the recommended version for HP Proactive Care Service.  
HP Insight Remote Support Advanced supports medium-sized to large environments with up to 3,500  
devices. It can be installed on a Windows ProLiant hosting device or a Windows ESXi Virtual Machine  
and requires HP Systems Insight Manager. Optionally, customers using HP Operations Manager or SAP  
Solution Manager to manage their environment can integrate these platforms easily to create a single  
view. This software is also optimized to deliver Mission Critical Services through additional features.  
For more information about the Insight Remote Support Advanced software, see the HP website  
The HP Insight Remote Support Release Notes detail the prerequisites, supported hardware, and associated  
operating systems. The release notes are available on the HP website  
(http://www.hp.com/go/insightremotesupport/docs). HP Insight Remote Support is included as part of HP  
Warranty, HP Care Pack Service, or HP contractual support agreement.  
HP ROM-Based Setup Utility  
RBSU is a configuration utility embedded in HP ProLiant servers that performs a wide range of configuration  
activities that can include the following:  
Configuring system devices and installed options  
Enabling and disabling system features  
Displaying system information  
Selecting the primary boot controller  
Configuring memory options  
Language selection  
For more information on RBSU, see the HP ROM-Based Setup Utility User Guide on the Documentation CD or  
Integrated Management Log  
The IML records hundreds of events and stores them in an easy-to-view form. The IML timestamps each event  
with 1-minute granularity.  
You can view recorded events in the IML in several ways, including the following:  
From within HP SIM  
From within operating system-specific IML viewers  
o
o
For Windows: IML Viewer  
For Linux: IML Viewer Application  
From within the iLO user interface  
From within HP Insight Diagnostics (on page 62)  
Diagnostic tools 63  
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USB support and functionality  
USB support  
HP provides both standard USB 2.0 support and legacy USB 2.0 support. Standard support is provided by  
the OS through the appropriate USB device drivers. Before the OS loads, HP provides support for USB  
devices through legacy USB support, which is enabled by default in the system ROM.  
Legacy USB support provides USB functionality in environments where USB support is not available normally.  
Specifically, HP provides legacy USB functionality for the following:  
POST  
RBSU  
Diagnostics  
DOS  
Operating environments which do not provide native USB support  
Internal USB functionality  
An internal USB connector is available for use with security key devices and USB drive keys. This solution  
provides for use of a permanent USB key installed in the internal connector, avoiding issues of clearance on  
the front of the rack and physical access to secure data.  
External USB functionality  
HP provides external USB support to enable local connection of USB devices for server administration,  
configuration, and diagnostic procedures.  
For additional security, external USB functionality can be disabled through RBSU.  
Automatic Server Recovery  
ASR is a feature that causes the system to restart when a catastrophic operating system error occurs, such as  
a blue screen, ABEND (does not apply to HP ProLiant DL980 Servers), or panic. A system fail-safe timer, the  
ASR timer, starts when the System Management driver, also known as the Health Driver, is loaded. When the  
operating system is functioning properly, the system periodically resets the timer. However, when the  
operating system fails, the timer expires and restarts the server.  
ASR increases server availability by restarting the server within a specified time after a system hang. At the  
same time, the HP SIM console notifies you by sending a message to a designated pager number that ASR  
has restarted the system. You can disable ASR from the System Management Homepage or through RBSU.  
Diagnostic tools 64  
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Component identification  
Front panel components  
Item  
Description  
Optical drive (optional)  
Media drive bay  
1
2
3
4
5
USB connectors  
Power On/Standby button and system power LED  
Drive bays (inside)  
Component identification 65  
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Front panel LEDs and buttons  
Item  
Description  
Status  
UID button/LED  
Solid blue = Activated  
1
Flashing blue (1 Hz/cycle per sec) = Remote management or  
firmware upgrade in progress  
Off = Deactivated  
Health LED  
Solid green = Normal  
Flashing amber = System degraded  
Flashing red (1 Hz/cycle per sec) = System critical  
Fast-flashing red (4 Hz/cycles per sec) = Power fault*  
2
3
4
NIC status LED  
Solid green = Link to network  
Flashing green (1 Hz/cycle per sec) = Network active  
Off = No network activity  
Power On/Standby button  
and system power LED  
Solid green = System on  
Flashing green (1 Hz/cycle per sec) = Performing power on sequence  
Solid amber = System in standby  
Off = No power present**  
*To identify components in a degraded or critical state, see the Systems Insight Display LEDs, check iLO/BIOS logs, and  
reference the server troubleshooting guide.  
**Facility power is not present, power cord is not attached, no power supplies are installed, power supply failure has  
occurred, or the power button cable is disconnected.  
Component identification 66  
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Rear panel components  
Item Description  
Non-hot-plug power supply  
Slot 4 PCIe x16 (8, 4, 1)*  
Slot 3 PCIe x8 (8, 4, 1)*  
Slot 2 PCIe x8 (4, 1)*  
Slot 1 PCIe x4 (1)*  
1
2
3
4
5
6
7
8
Expansion slot cover retainer  
Serial connector  
Video connector  
Dedicated iLO management port (optional)  
NIC 1/shared iLO management connector  
NIC connector 2  
9
10  
11  
12  
USB connectors  
* For more information on the expansion slot specifications, see "PCIe expansion slot definitions (on page  
70)."  
Component identification 67  
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Rear panel LEDs and buttons  
Item Description  
Status  
NIC link LED  
Green = Link exists  
Off = No link exists  
1
NIC status LED  
Green = Activity exists  
Flashing green = Activity exists  
Off = No activity exists  
2
UID LED button  
Blue = Identification is activated  
Flashing blue = System is being  
managed remotely  
3
4
Off = Identification is deactivated  
Power supply LED (for hot-plug HP Green = Normal  
CS power supplies only)* Off = One or more of the following  
conditions exists:  
Power is unavailable  
Power supply failed  
Power supply is in standby mode  
Power supply error  
*Not shown  
Component identification 68  
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System board components  
Item  
Description  
RPS connector  
1
Processor socket  
2
System battery  
3
24-pin power supply connector  
Mini-SAS connector  
SATA connectors  
4
5
6
Internal USB cable connector  
Internal USB connector  
SD card slot  
7
8
9
Front USB connector 2  
Front USB connector 1  
Front panel LED connector  
Fan connector 2  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
Reserved  
Ambient thermal sensor connector  
NMI header  
System maintenance switch  
Slot 1 PCIe x4 (1)*  
Slot 2 PCIe x8 (4, 1)*  
Slot 3 PCIe x8 (8, 4, 1)*  
Slot 4 PCIe x16 (8, 4, 1)*  
Fan connector 1  
TPM connector  
4-pin power supply connector  
Dedicated iLO module connector  
DIMM slots  
Component identification 69  
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* For more information on the expansion slot specifications, see "PCIe expansion slot definitions (on page  
70)."  
DIMM slot locations  
DIMM slots are numbered sequentially (1 through 4) for the processor. The supported AMP modes use the  
letter assignments for population guidelines.  
PCIe expansion slot definitions  
The transfer rate of the PCIe expansion slots 3 and 4 depends on the processor model installed. The slots can  
either run in PCIe2 (5 GT/s) or PCIe3 (8 GT/s) rate.  
Intel Xeon Processor E3-xxxx Series, Intel Core i3 Processor Series, Intel Pentium G2120, and Intel  
Celeron G540  
Slot number  
Type  
Length  
Half  
Full  
Height Connector link width Negotiable link width  
PCIe2  
PCIe2  
PCIe2  
Full  
Full  
Full  
x4  
x8  
x8  
x1  
x4  
x8  
1
2
3
Full  
PCIe2  
Full  
Full  
x16  
x8  
4
Intel Xeon Processor E3-xxxxV2 Series  
Slot number  
Type  
Length  
Half  
Full  
Height Connector link width Negotiable link width  
PCIe2  
PCIe2  
PCIe3  
Full  
Full  
Full  
x4  
x8  
x8  
x1  
x4  
x8  
1
2
3
Full  
PCIe3  
Full  
Full  
x16  
x8  
4
System maintenance switch  
Position  
Default  
Function  
Off  
Off = iLO security is enabled.  
On = iLO security is disabled.  
S1  
Component identification 70  
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Position  
Default  
Function  
Off  
Off = System configuration can be  
changed.  
S2  
On = System configuration is locked.  
Off  
Off  
Off  
Reserved  
Reserved  
S3  
S4  
S5  
Off = Power-on password is enabled.  
On = Power-on password is disabled.  
Off  
Off = No function  
On = ROM reads system configuration  
as invalid.  
S6  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
S7  
S8  
S9  
S10  
S11  
S12  
To access redundant ROM, set S1, S5, and S6 to on.  
When the system maintenance switch position 6 is set to the On position, the system is prepared to erase all  
system configuration settings from both CMOS and NVRAM.  
CAUTION: Clearing CMOS and/or NVRAM deletes configuration information. Be sure to  
properly configure the server or data loss could occur.  
NMI functionality  
An NMI crash dump creates a crash dump log before resetting a system which is not responding.  
Crash dump log analysis is an essential part of diagnosing reliability problems, such as failures of operating  
systems, device drivers, and applications. Many crashes freeze a system, and the only available action for  
administrators is to restart the system. Resetting the system erases any information which could support  
problem analysis, but the NMI feature preserves that information by performing a memory dump before a  
system reset.  
To force the system to invoke the NMI handler and generate a crash dump log, do one of the following:  
Use the iLO Virtual NMI feature.  
Short the NMI header ("System board components" on page 69).  
For more information, see the HP website  
Component identification 71  
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Drive numbering  
Four-bay LFF drive model  
Eight-bay SFF drive model  
Component identification 72  
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Hot-plug drive LED definitions  
Item LED  
Status  
Definition  
Locate  
Solid blue  
Flashing blue  
The drive is being identified by a host application.  
The drive carrier firmware is being updated or requires an update.  
1
2
3
Activity ring  
Rotating green  
Off  
Drive activity  
No drive activity  
Do not remove  
Solid white  
Do not remove the drive. Removing the drive causes one or more of  
the logical drives to fail.  
Off  
Removing the drive does not cause a logical drive to fail.  
Drive status  
Solid green  
The drive is a member of one or more logical drives.  
4
Flashing green  
The drive is rebuilding or performing a RAID migration, stripe size  
migration, capacity expansion, or logical drive extension, or is  
erasing.  
Flashing  
amber/green  
The drive is a member of one or more logical drives and predicts  
the drive will fail.  
Flashing amber The drive is not configured and predicts the drive will fail.  
Solid amber  
Off  
The drive has failed.  
The drive is not configured by a RAID controller.  
Component identification 73  
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FBWC module LED definitions  
The FBWC module has three single-color LEDs (one amber and two green). The LEDs are duplicated on the  
reverse side of the cache module to facilitate status viewing.  
1 - Amber  
2 - Green  
3 - Green  
Interpretation  
Off  
Off  
The cache module is not powered.  
Off  
Off  
Flashing 0.5 Hz Flashing 0.5 Hz The cache microcontroller is executing from within its  
boot loader and receiving new flash code from the host  
controller.  
Flashing 1 Hz  
Flashing 1 Hz  
Flashing 1 Hz  
On  
The cache module is powering up, and the capacitor  
pack is charging.  
Off  
Off  
Off  
Off  
Off  
Off  
On  
The cache module is idle, and the capacitor pack is  
charging.  
The cache module is idle, and the capacitor pack is  
charged.  
On  
The cache module is idle, the capacitor pack is charged,  
and the cache contains data that has not yet been  
written to the drives.  
Flashing 1 Hz  
On  
Off  
Off  
Off  
On  
A backup is in progress.  
Off  
The current backup is complete with no errors.  
The current backup failed, and data has been lost.  
Off  
Flashing 1 Hz  
Flashing 1 Hz  
Flashing 1 Hz  
Flashing 1 Hz  
A power error occurred during the previous or current  
boot. Data may be corrupt.  
On  
Off  
Off  
On  
An overtemperature condition exists.  
The capacitor pack is not attached.  
Flashing 1 Hz  
Flashing 2 Hz  
Flashing 2 Hz  
Flashing 2 Hz  
Flashing 2 Hz  
The capacitor has been charging for 10 minutes, but  
has not reached sufficient charge to perform a full  
backup.  
On  
On  
Off  
On  
The current backup is complete, but power fluctuations  
occurred during the backup.  
On  
On  
The cache module microcontroller has failed.  
Component identification 74  
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Fan locations  
Item  
Description  
Rear system fan (fan 1, for processor cooling)  
1
2
Front system fan (fan 2, for expansion board cooling)  
T-10/T-15 Torx screwdriver  
The server includes a T-10/T-15 Torx screwdriver located on the side of the media drive cage. Use the  
screwdriver to loosen screws during hardware configuration procedures.  
Component identification 75  
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Cabling  
Cabling overview  
This section provides guidelines that help you make informed decisions about cabling the server and  
hardware options to optimize performance.  
For information on cabling peripheral components, refer to the white paper on high-density deployment at  
CAUTION: When routing cables, always be sure that the cables are not in a position where they  
can be pinched or crimped.  
Front panel cabling  
Item Description  
Front USB 2 cable  
Front USB 1 cable  
Front panel LED cable  
1
2
3
Cabling 76  
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System fan cabling  
Item Description  
Rear system fan cable  
Front system fan cable  
1
2
Storage cabling  
Four-bay LFF drive cabling  
Non-hot-plug, SATA drive support only  
Cabling 77  
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Item Description  
Power cable  
Data cable  
1
2
Non-hot-plug, SATA and SAS drive support  
Item Description  
Power cable  
Data cable  
1
2
Hot-plug, SATA drive support  
Item  
Description  
Power cable  
1
Cabling 78  
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Item  
Description  
Mini-SAS cable  
2
Hot-plug, SATA and SAS drive support  
Item Description  
Power cable  
1
2
Mini-SAS cable  
Eight-bay SFF drive cabling  
This drive configuration supports hot-plug SATA and SAS drives.  
Item Description  
Power cable  
1
Cabling 79  
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Item Description  
Mini-SAS cable  
Mini-SAS cable  
2
3
Media drive cabling  
Media drives in a nonredundant power configuration  
Item  
Description  
Upper media drive power cable  
Lower media drive SATA cable  
Upper media drive SATA cable  
Lower media drive power cable  
1
2
3
4
Cabling 80  
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Media drive in a redundant power configuration  
Item  
Description  
Upper media drive SATA cable  
Upper media drive power cable  
1
2
Power supply cabling  
Nonredundant power supply cabling  
Item  
Description  
24-pin power supply cable  
4-pin power supply cable  
1
2
Cabling 81  
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Redundant power supply cabling  
Item  
Description  
24-pin power supply cable  
26-pin RPS cable  
1
2
3
4-pin power supply cable (with the 8-pin to 4-pin adapter  
cable connected)  
Capacitor pack cabling  
Cabling 82  
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Specifications  
Environmental specifications  
Specification  
Value  
Temperature range*  
Operating  
10°C to 35°C (50°F to 95°F)  
-30°C to 60°C (-22°F to 140°F)  
Nonoperating  
Relative humidity  
(noncondensing)  
10% to 90%  
5% to 95%  
Operating, maximum wet bulb  
temperature of 28°C (82.4°F)  
Nonoperating, maximum wet  
bulb temperature of 38.7°C  
(101.7°F)  
* All temperature ratings shown are for sea level. An altitude derating of 1°C per 304.8 m (1.8°F per 1,000 ft) to 3048  
m (10,000 ft) is applicable. No direct sunlight allowed.  
Server specifications  
Specification  
Tower model  
Rack model  
36.82 cm (14.50 in)  
47.52 cm (18.71 in)  
17.50 cm (6.89 in)  
11.00 kg (24.22 lb)  
17.50 cm (6.89 in)  
47.52 cm (18.71 in)  
36.82 cm (14.50 in)  
11.00 kg (24.22 lb)  
Height  
Depth  
Width  
Weight, minimum for SFF drive cage  
17.00 kg (37.44 lb)  
11.90 kg (26.21 lb)  
17.00 kg (37.44 lb)  
11.90 kg (26.21 lb)  
Weight, maximum for SFF drive cage  
Weight, minimum for LFF drive cage  
19.00 kg (41.85 lb)  
19.00 kg (41.85 lb)  
Weight, maximum for LFF drive cage  
Power supply specifications  
Depending on installed options, the server is configured with one of the following power supplies:  
HP 350 W 4U Integrated Power Supply  
HP 460 W CS Gold Hot-plug Power Supply (92% efficiency)  
CAUTION: Check the system and power supply input ratings before powering up the server.  
Specifications 83  
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HP 350 W 4U Integrated Power Supply  
Specification  
Value  
Input requirements  
Rated input voltage  
Rated input frequency  
Rated input current  
Rated input power  
100 V AC to 240 V AC  
47 Hz to 63 Hz  
6 A  
440 W at 100 V AC input  
440 W at 200 V AC input  
No less than 82% at 100% load  
No less than 85% at 50% load  
No less than 82% at 20% load  
Efficiency  
Power supply output  
350 W at 100 V AC input  
350 W at 200 V AC input  
Rated steady-state power  
400 W at 100 V AC input  
400 W at 200 V AC input  
Maximum peak power  
Rated output power  
350 W  
HP 460 W CS Gold Hot-plug Power Supply (92% efficiency)  
Specification  
Value  
Input requirements  
Rated input voltage  
Rated input frequency  
Rated input current  
Rated input power  
100 V AC to 240 V AC  
50 Hz to 60 Hz  
6 A to 3 A  
526 W at 115 V AC input  
523 W at 230 V AC input  
Power supply output  
Not less than 87.5% at 100% load  
Not less than 89.5% at 50% load  
Not less than 87.5% at 20% load  
Efficiency  
460 W at 100 V to 120 V AC  
input  
460 W at 200 V to 240 V AC  
input  
Rated steady-state power  
Maximum peak power  
460 W at 100 V to 120 V AC  
input  
460 W at 200 V to 240 V AC  
input  
Hot-plug power supply calculations  
For hot-plug power supply specifications and calculators to determine electrical and heat loading for the  
server, see the HP Power Advisor website (http://www.hp.com/go/hppoweradvisor).  
Specifications 84  
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Support and other resources  
Before you contact HP  
Be sure to have the following information available before you call HP:  
Active Health System log (HP ProLiant Gen8 or later products)  
Download and have available an Active Health System log for 3 days before the failure was detected.  
For more information, see the HP iLO 4 User Guide or HP Intelligent Provisioning User Guide on the HP  
Onboard Administrator SHOW ALL report (for HP BladeSystem products only)  
For more information on obtaining the Onboard Administrator SHOW ALL report, see the HP website  
Technical support registration number (if applicable)  
Product serial number  
Product model name and number  
Product identification number  
Applicable error messages  
Add-on boards or hardware  
Third-party hardware or software  
Operating system type and revision level  
HP contact information  
For United States and worldwide contact information, see the Contact HP website  
In the United States:  
To contact HP by phone, call 1-800-334-5144. For continuous quality improvement, calls may be  
recorded or monitored.  
If you have purchased a Care Pack (service upgrade), see the Support & Drivers website  
(http://www8.hp.com/us/en/support-drivers.html). If the problem cannot be resolved at the website,  
call 1-800-633-3600. For more information about Care Packs, see the HP website  
Support and other resources 85  
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Acronyms and abbreviations  
ABEND  
abnormal end  
AMP  
Advanced Memory Protection  
ASR  
Automatic Server Recovery  
CSR  
Customer Self Repair  
DDR  
double data rate  
FBWC  
flash-backed write cache  
HP CS  
HP Common Slot (power supply)  
HP SIM  
HP Systems Insight Manager  
iLO  
Integrated Lights-Out  
IML  
Integrated Management Log  
LFF  
large form factor  
MLC  
multilevel cell  
Acronyms and abbreviations 86  
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NMI  
nonmaskable interrupt  
NVRAM  
nonvolatile memory  
PCIe  
peripheral component interconnect express  
POST  
Power-On Self Test  
RBSU  
ROM-Based Setup Utility  
RDIMM  
registered dual in-line memory module  
RPS  
redundant power supply  
SAS  
serial attached SCSI  
SATA  
serial ATA  
SD  
Secure Digital  
SFF  
small form factor  
SLC  
single-level cell  
SPP  
HP Service Pack for ProLiant  
TPM  
Trusted Platform Module  
Acronyms and abbreviations 87  
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UDIMM  
unregistered dual in-line memory module  
UID  
unit identification  
USB  
universal serial bus  
Acronyms and abbreviations 88  
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Documentation feedback  
HP is committed to providing documentation that meets your needs. To help us improve the documentation,  
send any errors, suggestions, or comments to Documentation Feedback (mailto:docsfeedback@hp.com).  
Include the document title and part number, version number, or the URL when submitting your feedback.  
Documentation feedback 89  
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Index  
error messages 61  
A
F
access panel 31  
air baffle 32  
ASR (Automatic Server Recovery) 64  
authorized reseller 85  
fan module locations 75  
FBWC cabling 77, 82  
FBWC module LEDs 74  
features 65  
Automatic Server Recovery (ASR) 64  
flash-backed write cache procedures 45, 48  
front I/O module 36  
front panel cabling 76  
front panel components 65  
B
bezel, tower 26  
blanks 27  
board components 69  
G
C
guidelines, troubleshooting 61  
cables 76  
cache module 45, 74  
H
cache module, removing 45  
capacitor pack 45, 46, 82  
components 16, 65  
components, identification 16, 65  
components, system board 69  
connectors 65  
hard drive LEDs 73  
hard drives, determining status of 73  
health driver 64  
heatsink 39  
help resources 85  
HP Insight Diagnostics 62  
HP Insight Remote Support software 62  
HP technical support 85  
contacting HP 85  
crash dump analysis 71  
CSR (customer self repair) 6  
customer self repair (CSR) 6, 85  
I
illustrated parts catalog 16  
D
iLO (Integrated Lights-Out) 50, 51, 63  
IML (Integrated Management Log) 63  
Insight Diagnostics 62  
diagnostic tools 62, 63, 64  
diagnostics utility 62  
DIMMs 38, 39  
Integrated Management Log (IML) 63  
drive blank 27  
drive cabling 76, 77, 79  
drive cage, removing 33, 34  
drive LEDs 73  
L
LEDs 73  
LEDs, front panel 73  
LEDs, hard drive 73  
LEDs, rear panel 68  
LEDs, SAS hard drive 73  
LEDs, troubleshooting 61  
E
electrostatic discharge 24  
environmental specifications 83  
Index 90  
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static electricity 24  
support 85  
symbols on equipment 24  
system battery 49  
system board components 69  
system board replacement 54, 69  
system components 19, 65  
system fans 50, 77  
M
management tools 62  
mechanical components 16  
media drive bay cabling 80  
N
NMI functionality 71  
system maintenance switch 70  
O
T
optical drive 32, 65  
technical support 85  
telephone numbers 85  
tools 24  
Torx screwdriver 75  
tower bezel, removing 26  
troubleshooting 61  
P
part numbers 16  
PCI expansion slots 70  
phone numbers 85  
power down procedure 26  
power supply 30, 51, 53  
power supply cabling 81, 82  
power supply specifications 83, 84  
powering down 26  
problem diagnosis 61  
processors 41  
Trusted Platform Module (TPM) 60  
U
USB support 64  
utilities 62  
utilities, deployment 63  
V
R
video connector 69  
RBSU (ROM-Based Setup Utility) 63  
rear components 67  
rear panel buttons 68  
rear panel components 67  
rear panel LEDs 68  
removal and replacement procedures 24  
required tools 24  
W
warnings 25  
website, HP 85  
weight 83  
resources 85  
RPS cabling 52, 53  
S
safety considerations 24  
SAS and SATA device numbers 72  
SAS cabling 78, 79  
SATA cabling 77, 78  
server, real panel LEDs 68  
server, rear panel components 67  
spare part numbers 16  
specifications 83, 84  
specifications, environmental 83  
specifications, mechanical 83  
specifications, power 83  
specifications, server 83  
Index 91  
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