Compaq Network Card Extension User Manual

ꢀ COM Express™ Extension

ꢀ Specification

Rev. 013

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Table of Contents

User Information......................................................................................................................... 5

1.1

1.2

1.3

1.4

About This Document...................................................................................................... 5

Copyright Notice ............................................................................................................. 5

Technical Support............................................................................................................ 5

Disclaimer........................................................................................................................ 5

Introduction................................................................................................................................. 6

2.1

2.2

2.3

2.4

COM Express™ Extension Specification......................................................................... 6

COM Express™ Design Guide......................................................................................... 6

COM Express™ Computer-On-Module ........................................................................... 6

Objective.......................................................................................................................... 8

COM Express™ Module sizes ..................................................................................................... 9

3.1 Overview - Module Size.................................................................................................. 9

3.1.1 Figure - Overview – three module sizes........................................................................ 10

3.1.2 Small Form Factor nano, COM Express™ Type 1........................................................ 10

Figure 3 – Small Form Factor nano ............................................................................................. 11

Signal Description ..................................................................................................................... 12

4.1 Graphic Signal Description............................................................................................ 12

4.1.1 Table – Graphic Signal Description - Row C for Pin-out Type 2 ................................. 12

4.1.2 Table – Graphic Signal Description - Row D for Pin-out Type 2 ................................. 13

Hardware extensions................................................................................................................. 15

5.1

5.1.1 Wide Range Input Power for nano SFF......................................................................... 15

5.2 GPIO General Purpose I/O Recommended Use............................................................ 16

5.2.1 Alternative GPIO use for SDIO Interface...................................................................... 17

Wide Range Input Power............................................................................................... 15

SDIO Pin description....................................................................................................................... 17

5.3 Thermal Control............................................................................................................. 18

Software extensions................................................................................................................... 19

6.1

6.2

6.3

6.4

TPM support.................................................................................................................. 19

Smart Battery BIOS support.......................................................................................... 19

Legacy Super I/O support in BIOS................................................................................ 20

CMOS backup in BIOS ................................................................................................. 20

6.4.1 Console redirection in BIOS.......................................................................................... 20

Specification Rev 012

iii

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Table of Contents

6.4.2 User editor for default settings....................................................................................... 20

Apendix A: PC Architecture Information .............................................................................. 21

7.1

Buses.............................................................................................................................. 21

7.1.1 ISA, Standard PS/2 – Connectors.................................................................................. 21

7.1.2 PCI21

7.2

7.3

General PC Architecture................................................................................................ 21

Ports............................................................................................................................... 22

7.3.1 RS-232 Serial................................................................................................................. 22

7.3.2 Serial ATA..................................................................................................................... 22

7.3.3 USB ............................................................................................................................... 22

7.4

Programming ................................................................................................................. 23

APPENDIX B: DOCUMENT-REVISION HISTORY.......................................................... 24

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1 User Information

User Information

1.1

About This Document

This document provides information about products from Kontron Embedded Modules GmbH, and/or

its subsidiaries. No warranty of suitability, purpose, or fitness is implied. While every attempt has

been made to ensure that the information in this document is accurate, the information contained

within is supplied “as-is” and is subject to change without notice.

For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents

or other rights of third parties are concerned.

1.2

Kontron Embedded Modules GmbH and Advantech Co., Ltd. are founding members of the COM

Industrial Group the purpose of which is the definition, marketing and promotion of the COM

Technologies.

Kontron Embedded Modules GmbH and Advantech Co., Ltd. Have significantly contributed to the

development and promotion of the COM Industrial Standard and administrates the COM Industrial

Group’s website (http://www.com-ig.org/).

retrieval system, or translated into any language or computer language, in any form or by any means

(electronic, mechanical, photocopying, recording, or otherwise), without the express written

permission of COM Industrial Group founding Members.

1.3

Technical Support

Technicians and engineers from COM Industrial Group Members are available for technical support.

We are committed to making our product easy to use and will help you use our products in your

systems.

http://www.comexpress-extension.org/members/members.php

Before contacting COM Industrial Group Members technical support, please consult our web site at

http://www.comexpress-extension.org for the latest product documentation, utilities, and drivers. If the

information does not help solve the problem, contact us by email.

http://www.comexpress-extension.org/contact/contact.php

1.4

Disclaimer

Although the information presented in this document was carefully reviewed and is believed to be

accurate, it is not guaranteed. The reader assumes all liability for the use of the information herein.

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2 Introduction

Introduction

2.1

COM Express™ Extension Specification

The COM Express™ Extension Specification builds on the COM Express™ (COM.0) standard as

defined by the PCI Industrial Computer Manufacturers’ Group (PICMG®) which is an industry

standard adopted for Computer-On-Modules. The COM Express™ Extension Specification is focused

with its intellectual properties on the deep embedded market and is intended to be an add-on to the

PICMG’s COM Express™ COM.0 Specification. It is the intention of the authors of this specification

to propose the information contained here within to PICMG® as a means of updating the current

COM Express™ standard to ensure continued saleability and compatibility of all COM Express™

solutions.

2.2

COM Express™ Extension Design Guide

The COM Express™ Design Guide, a separate document from both the PICMG® COM Express™

Specification and this COM Express™ Extension Specification, is available to COM Express™ module

customers upon request. For download the COM Express™ Extension Design guide please visit our

web page:

http://www.comexpress-extension.com/specs/specs.php

The COM Express™ Design Guide explores the requirements of the COM Express™ Extension

Specification and provides recommendations on designing COM Express™ baseboards to support

various features of COM Express™ compliant modules.

The COM Express™ Design Guide, based upon the COM Express™ Extension Specification and

PICMG® COM Express™ Specification, discusses capabilities in the specification with schematic

examples where applicable and offers ideas to consider for maximum flexibility in designing

baseboards.

2.3

COM Express™ Computer-On-Module

A COM Express™ Computer-On-Module (COM) is a module with all components necessary for a

bootable host computer, packaged as a super component. COMs require a carrier board in order to

bring out I/O and to power up the CPU module.

COMs are used to build single board computer solutions and offer OEMs fast time-to-market with

reduced development cost.

Like integrated circuits, they provide OEMs with significant freedom when working to meet form-fit-

function requirements. For all of these reasons, COM methodology has gained significant popularity

with OEMs in the embedded industry. The COM Express™ standard is designed to be future proof

and to provide a smooth transition path from legacy parallel interfaces to LVDS (Low Voltage

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2 Introduction

Differential Signalling) interfaces. These include the PCI bus and parallel ATA on the one hand and

PCI Express and Serial ATA on the other hand.

Key features include:

ꢀ Rich complement of contemporary high bandwidth serial interfaces, including PCI

Express, Serial ATA, USB 2.0, and Gigabit Ethernet

ꢀ 32-bit PCI, LPC and Parallel ATA options preserved for easy interface to a range of

peripherals

ꢀ Extended power-management capabilities

ꢀ Robust thermal and mechanical concept

Cost-effective design

ꢀ Legacy-free design (no Super I/O, PS2 keyboard or mouse)

ꢀ COM Express™ module size with two currently defined footprint options (“Basic”

and “Extended”) to satisfy a range of performance requirements. The option for

future more compact footprints like microETXexpress and nanoETXexpress are

present.

ꢀ High-performance mezzanine connector with several defined pin-out types to

satisfy a range of application requirements

The COM Express™ Extension specification has been created to support to a range of vertical

embedded markets. It has been formulated to be applicable to a broad range of system types, from

floor-installed and bench-top to mobile handheld.

Markets and applications include but are not limited to:

ꢀ Healthcare - clinical diagnostic imaging systems, patient bedside monitors, etc.

ꢀ Retail & advertising - electronic shopping carts, billboards, kiosks, POS/POI

systems, etc.

ꢀ Gaming & entertainment - simulators, slot machines, etc.

ꢀ Test & measurement - scientific and industrial test and measurement instruments

ꢀ Industrial automation - industrial robots, vision systems, etc.

ꢀ Security - digital CCTV, luggage scanners, intrusion detectors, etc.

ꢀ Defence & government - unmanned vehicles, rugged laptops, wearable computers,

etc.

Systems developed according to the COM Express™ Extension Specification require the

implementation of an application-specific carrier board that accepts the module. The carrier board is

typically a 4- to 8-layer PCB. User-specific features such as external connector choices and locations

and peripheral circuits can be tailored to suit the application. The OEM can focus on application-

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2 Introduction

specific features rather than caring for a CPU board design. The OEM also benefits from a wide

choice of modules providing a scalable range of price and performance upgrade options.

2.4

Objective

Consistent with the objective of the PICMG® COM Express™ Specification, the COM Express™

Extension specification defines COM Express™ compliant modules at a level of detail sufficient to

allow interoperability between independent vendor modules and carrier boards.

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3 COM Express™ Module sizes

COM Express™ Module sizes

3.1

Overview - Module Size

The primary difference between the current basic module and the extended module as well as future

compact footprints like microETXexpress and nanoETXexpress is the over-all physical size and the

performance envelope supported by each. The extended module offers larger real estate and can

accommodate larger processor, chips and memory solutions which are not possible on the basic

module.

The extended module and the basic module use the same connectors and pin-outs and utilize several

common mounting hole positions. This level of compatibility allows that a carrier board designed to

accommodate an extended module can also support a basic module, microETXexpress or

nanoETXexpress modules. This holds true for any future defined compact modules as they too will

utilize the same connectors and pin-outs

Up to 440 pins of connectivity are available between COM Express™ modules and the carrier board.

Legacy buses such as PCI, parallel ATA, LPC, AC'97 can be supported as well as new high speed

serial interconnects such as PCI Express, Serial ATA or SAS and Gigabit Ethernet. To enhance

interoperability between COM Express™ modules and carrier boards, five common signalling

configurations (Pin-out Types) have been defined to ease system integration. Some Pin-out Types

definitions require only a single 220-pin connector, like nanoETXexpress and others require both 220-

pin connectors to supply all the defined signalling.

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3 COM Express™ Module sizes

Figure - Overview – three module sizes

All coordinates in mm. top view ( X1 is on bottom side, seen through pcb)

3.1.1

Small Form Factor nano, COM Express™ Type 1

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3 COM Express™ Module sizes

The PCB size for the nano module is defined as 55mm x 84mm.

The holes shown in this drawing are intended for mounting the module / heat-spreader combination to

the carrier board. An independent, implementation specific set of holes and spacers shall be used to

attach the heat-spreader to the module.

Figure - Small Form Factor nano

COM Express™ Type 1

Holes Compatible to COM Express™

All dimensions are shown in millimetres. Tolerances should be ± 0.25mm [±0.010"], unless noted

otherwise. The tolerances on the module connector locating peg holes (dimensions [16.50, 6.00])

should be ± 0.10mm [±0.004"].

The 220 pin connector shall be mounted on the backside of the PCB and is seen “through” the board in

this view. The X mounting holes shown should use 6mm diameter pads and should have 2.7mm plated

holes, for use with 2.5mm hardware. The pads should be tied to the PCB ground plane.

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4 Signal Description

Signal Description

4.1

Graphic Signal Description

Based on the different available graphic interfaces offered by the different chipsets from silicon

vendors including Intel, ATI, VIA, etc., there is a need for optional assignment in addition to the ones

already defined by PICMG in the COM.0 specification. These will allow for ease when integrating

upcoming new graphic interfaces while still assuring compatibility of COM Express™ compliant

modules and carrier boards.

Graphic signals are defined on Row C and Row D.

The following table describes the signal uses up on the required graphic interface.

4.1.1

Table – Graphic Signal Description - Row C for Pin-out Type 2

Row C

PCIE x 16

Pin Name

PEG_RX0+

PEG_RX0-

TYPE0#

SDVO

TMDS(DVI)/HDMI/DVO

Display Port

TYPE0#

Definition

Pin No.

C52

C53

C54

C55

C56

C57

C58

C59

C60

C61

C62

C63

C64

C65

C66

C67

C68

C69

C70

C71

C72

C73

C74

C75

C76

C77

SDVO_TVCLK+

SDVO_TVCLK-

TYPE0#

HDMI_TVCLKIN

HDMI_TVCLKIN#

TYPE0#

PEG_RX1+

PEG_RX1-

TYPE1#

SDVOB_INT+

SDVOB_INT-

TYPE1#

PEG_RX2+

PEG_RX2-

GND (FIXED)

PEG_RX3+

PEG_RX3-

RSVD

SDVO_FLDSTALL+

SDVO_FLDSTALL-

GND (FIXED)

TMDS_DDC_DAT

TMDS_DDC_CLK

GND (FIXED)

TMDS_HPD

DPB_AUX

DPB_AUXB

GND (FIXED)

DPB_HPD

RSVD

PEG_RX4+

PEG_RX4-

RSVD

PEG_RX5+

PEG_RX5-

GND (FIXED)

PEG_RX6+

PEG_RX6-

SDVO_DATA

PEG_RX7+

PEG_RX7-

GND

SDVOC_INT+

SDVOC_INT-

GND (FIXED)

DPC_AUX

TMDS_2_DDC_DAT

TMDS_2_DDC_CLK

DPC_AUXB

SDVO_DATA

TMDS_2_HPD

DPC_HPD

GND

RSVD

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4 Signal Description

C78

PEG_RX8+

PEG_RX8-

GND (FIXED)

PEG_RX9+

PEG_RX9-

RSVD

DVO D11

DVO D10

GND (FIXED)

DVO D9

DVO D8

RSVD

C79

C80

GND (FIXED)

C81

C82

C83

RSVD

C84

GND

C85

PEG_RX10+

PEG_RX10-

GND

DVO D7

DVO D6

GND

DPD_AUX

DPD_AUXB

GND

C86

C87

C88

PEG_RX11+

PEG_RX11-

GND (FIXED)

PEG_RX12+

PEG_RX12-

GND

DVO CLK+

DVO D5

GND (FIXED)

DVO D4

DVO D3

GND

DPD_HPD

C89

C90

GND (FIXED)

GND

C91

C92

C93

C94

PEG_RX13+

PEG_RX13-

GND

DVO D2

DVO D1

GND

C95

C96

GND

C97

RSVD

C98

PEG_RX14+

PEG_RX14-

GND (FIXED)

PEG_RX15+

PEG_RX15-

GND

DVO D0

DVO DE

GND (FIXED)

DVO HS

DVO VS

GND

C99

C100

C101

C102

C103

C104

C105

C106

C107

C108

C109

C110

GND (FIXED)

GND

VCC_12V

GND (FIXED)

VCC_12V

GND (FIXED)

VCC_12V

GND (FIXED)

4.1.2

Table – Graphic Signal Description - Row D for Pin-out Type 2

Row D

PCIE x 16

SDVO

TMDS(DVI)/HDMI/DVO

Display Port

Definition

Pin No.

D52

Pin Name

PEG_TX0+

PEG_TX0-

PEG_LANE_RV#

PEG_TX1+

PEG_TX1-

TYPE2#

SDVOB_RED+

SDVOB_RED-

PEG_LANE_RV#

SDVOB_GRE+

SDVOB_GRE-

TYPE2#

TMDS DATA 2+

TMDS DATA 2-

PEG_LANE_RV#

TMDS DATA 1+

TMDS DATA 1-

TYPE2#

DPB_LANE0

DPB_LANE0#

PEG_LANE_RV#

DPB_LANE1

DPB_LANE1#

TYPE2#

D53

D54

D55

D56

D57

D58

PEG_TX2+

PEG_TX2-

GND (FIXED)

SDVOB_BLU+

SDVOB_BLU-

GND (FIXED)

TMDS DATA 0+

TMDS DATA 0-

GND (FIXED)

DPB_LANE2

DPB_LANE2#

GND (FIXED)

D59

D60

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4 Signal Description

D61

D62

D63

D64

D65

D66

D67

D68

D69

D70

D71

D72

D73

D74

D75

D76

D77

D78

D79

D80

D81

D82

D83

D84

D85

D86

D87

D88

D89

D90

D91

D92

D93

D94

D95

D96

D97

D98

D99

D100

D101

D102

D103

D104

D105

D106

D107

D108

D109

D110

PEG_TX3+

PEG_TX3-

RSVD

SDVOB_CLK+

SDVOB_CLK-

RSVD

TMDS Clock +

TMDS Clock -

RSVD

DPB_LANE3

DPB_LANE3#

RSVD

PEG_TX4+

PEG_TX4-

GND

SDVOC_RED+

SDVOC_RED-

GND

TMDS DATA 5+

TMDS DATA 5-

GND

DPC_LANE0

DPC_LANE0#

GND

PEG_TX5+

PEG_TX5-

GND (FIXED)

PEG_TX6+

PEG_TX6-

SDVO_CLK

PEG_TX7+

PEG_TX7-

GND

SDVOC_GRE+

SDVOC_GRE-

GND (FIXED)

SDVOC_BLU+

SDVOC_BLU-

SDVO_CLK

SDVOC_CLK+

SDVOC_CLK-

TMDS DATA 4+

TMDS DATA 4-

GND (FIXED)

TMDS DATA 3+

TMDS DATA 3-

DPC_LANE1

DPC_LANE1#

GND (FIXED)

DPC_LANE2

DPC_LANE2#

TMDS_2_CLK +

TMDS_2_CLK -

GND

DPC_LANE3

DPC_LANE3#

GND

IDE_CBLID#

PEG_TX8+

PEG_TX8-

GND (FIXED)

PEG_TX9+

PEG_TX9-

RSVD

IDE_CBLID#

DVO_SDA

IDE_CBLID#

DPD_LANE0

DPD_LANE0#

GND (FIXED)

DPD_LANE1

DPD_LANE1#

RSVD

DVO_SCL

GND (FIXED)

DVO_HPD

RSVD

GND

PEG_TX10+

PEG_TX10-

GND

DPD_LANE2

DPD_LANE2#

GND

PEG_TX11+

PEG_TX11-

GND (FIXED)

PEG_TX12+

PEG_TX12-

GND

DVO CLK-

DPD_LANE3

DPD_LANE3#

GND (FIXED)

GND

PEG_TX13+

PEG_TX13-

GND

PEG_ENABLE#

PEG_TX14+

PEG_TX14-

GND (FIXED)

PEG_TX15+

PEG_TX15-

GND

PEG_ENABLE#

GND (FIXED)

GND

VCC_12V

GND (FIXED)

VCC_12V

GND (FIXED)

VCC_12V

GND (FIXED)

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5 Hardware extensions

Hardware extensions

Wide Range Input Power for basic, extended and micro form factor

Wide range input power: +8.5VDC to +18VDC

It allows direct operation from 108 nominal 3 cell lithium ion battery pack to 4-cell lithium-ion battery

packs (16,8 V fully charged)

Additionally, Smart Battery Support offers a great base for a mobile application. See Software section

for more details

5.1.1

Wide Range Input Power for nano SmallFormFactor (SFF)

The nano modules should use a single main power rail with a wide range power supply of 5V

to +14V+/-5% (4,75V to 14,7V)

Two additional rails are specified, a +5V standby power rail and a +3V battery input to power

the module real-time clock (RTC) circuit in the absence of other power sources. The +5V

standby rail could be left unconnected on the carrier board if the standby functions are not

required by the application. Likewise, the +3V battery input may be left open if the

application does not require the RTC to keep time in the absence of the main and standby

sources. There may be module specific concerns regarding storage of system setup parameters

that may be affected by the absence of the +5V standby and / or the +3V battery.

The rationale for this power-delivery scheme is:

•

Module pins are scarce. It is more pin-efficient to bring power in on a higher

voltage rail.

•

Single supply operation is attractive to many users.

Lithium ion battery packs for mobile systems are most prevalent with a +14.4V

output. This is well suited for the +12V main power rail.

•

Contemporary chipsets have no power requirements for +5V other than to provide a

reference voltage for +5V tolerant inputs. No COM Express™ module pins are

allocated to accept +5V except for the +5V standby pins. In the case of an ATX

supply, the switched (non standby) +5V line would not be used for the COM

Express™ module, but it might be used elsewhere on the carrier board.

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5 Hardware extensions

5.2

GPIO General Purpose I/O Recommended Use

In general, GPIOs are defined for specific customers. Any generic GPIOs should be be set as well in

order to assure compatibility of various COM Express™ compliant modules and carrier boards.

Pin Description

Recomended Use

LID Button

Function

Comment

GPI0

GPI1

GPI2

GPI3

GPO0

GPO1

GPO2

GPO3

General Purpose Input

General Purpose Output

Power Management Event

Please see Board Specification

Fan Control

TTL output for external fan Please see Board Specification

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5 Hardware extensions

5.2.1

Alternative GPIO use for SDIO Interface

Pin GPIO SDIO Pin GPIO SDIO

A54 GPI0 DATA0 B54 GPO1 CMD

A63 GPI1 DATA1 B57 GPO2 WP

A67 GPI2 DATA2 B63 GPO3 CD#

A85 GPI3 DATA3

A93 GPO0 CLK

SDIO Pin description

Signal

SD_DATA[3:0] I/O

CMOS3.3

Type

Description

SDIO Controller 0/1/2 Data: These signals operate

in push-pull mode. The SD card includes internal pull-

up resistors for all data lines. By default, after power-

up, only SDn_DATA0 is used for data transfer. Wider

data bus widths can be configured for data transfer.

SDIO Controller 0/1/2 Command: This signal is

used for card initialization and transfer of commands.

It has two operating modes: open-drain for

initialization mode, and push-pull for fast command

transfer.

SD_CMD

SD1_CLK

I/O

CMOS3.3

SDIO Controller 0/1/2 Clock: With each cycle of this

signal a one-bit ransfer on the command and each

data line occurs.

CMOS3.3

This signal is generated by Intel SCH at a maximum

frequency of:

24 Mhz for SD and SDIO.

48 Mhz for MMC.

SD0_WP

SD1_CD#

SDIO Controller 0/1/2 Write Protect: These signals

denote the state of the write-protect tab on SD cards.

SDIO Controller 0/1/2 Card Detect: Indicates when

a card is present in an external slot.

CMOS3.3

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5 Hardware extensions

5.3

Thermal Control

A three-pin fan header is stuffed onboard the module to support thermal control through the use of a

fan. Through BIOS-settings, it is possible to control the fan depending on the Active Trip Point

temperature. The fan switches on/off depending on the adjusted Active Trip Point temperature. In

order for this feature to function properly, an ACPI compliant OS is necessary. (Except for

nanoETXexpress modules)

- Part number (Molex):

- Mates with:

53261-0390

51021-0300

50079-8100

- Crimp terminals:

Electrical characteristics:

- Vcc = 5 V

- Imax (continuous) = 0,68 A

- Imax (pulsed) = 2 A

- Sense (Tacho-pulse) = 4 Pulses per turn

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6 Software extensions

Software extensions

6.1

TPM support

Trusted Computing is a technology developed and promoted by the Trusted Computing Group (TCG).

The term is taken from the field of trusted systems and has a specialized meaning. "Trusted

computing" means that the computer will consistently behave in specific ways and those behaviors

will be enforced by hardware and software.

Trusted computing encompasses five key technology concepts, of which all are required for a fully

trusted system.

ꢀ Endorsement Key

ꢀ Secure Input and Output

ꢀ Memory curtaining / Protected execution

ꢀ Sealed storage

ꢀ Remote attestation

COM Express™ Extension COMs are designed to support basic TPM features.

(more information: TBD)

COM Express™ Extension COMs are compliant to TCG 1.2. That includes efficient processing of hash

and RSA algorithms with key length up to 2048bit and random generator.

This technology is necessary for all security -sensitive applications such as those for the gaming and e-

commerce industries.

6.2

Smart Battery BIOS support

The BIOS supports smart battery to monitor the actual battery state on your system.

MARS is a Smart Battery reference System that is able to control up to two Smart batteries. The

reference system will be implemented on a customized carrier board. The core of the SBS MARS is a

dual Smart Battery System Manager. Additionally, the system contains a buck-boost converter at the

input side, a dual buck converter and a buck-boost converter at the output side. There is also a CPLD

used in MARS to get the functionality of an ATX power supply and for additional tasks.

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6 Software extensions

MARS = Mobile Application platform for Rechargeable Systems

Please following the link listed below to the document where you can find more information regarding

a Smart Battery reference system:

http://emea.kontron.com/products/computeronmodules/etx/mars.html

6.3

Legacy Super I/O support in BIOS

Although COM Express™ is meant for legacy free systems there still often is the need for legacy

interfaces like serial port, parallel port, floppy, etc.

To make an adaption of these ports possible the BIOS of COM Express™ modules has integrated

support for LPC SUPER I/O chips. For detailed description, please see the COM Express™ Design

Guide.

More information:

http://www.comexpress-extension.com/datasheet/COM_Express_Design_Guide_Rev_14.pdf

6.4

CMOS backup in BIOS

CMOS backup is supported by the BIOS.

Customer settings are saved in spite of battery remove in the EEPROM.

6.4.1

Console redirection in BIOS

(More information: TBD)

6.4.2

User editor for default settings

(More information: TBD)

Specification Rev 013

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7 Apendix A: PC Architecture Information

Apendix A: PC Architecture Information

The following sources of information can help you better understand PC architecture.

7.1

Buses

7.1.1

ISA, Standard PS/2 – Connectors

ꢀ AT Bus Design: Eight and Sixteen-Bit ISA, E-ISA and EISA Design, Edward

Solari, Annabooks, 1990, ISBN 0-929392-08-6

ꢀ AT IBM Technical Reference Vol. 1 & 2, 1985

ꢀ ISA & EISA Theory and Operation, Edward Solari, Annabooks, 1992, ISBN

0929392159

ꢀ ISA Bus Specifications and Application Notes, Jan. 30, 1990, Intel

ꢀ ISA System Architecture, Third Edition, Tom Shanley and Don Anderson,

Addison-Wesley Publishing Company, 1995, ISBN 0-201-40996-8

ꢀ Personal Computer Bus Standard P996, Draft D2.00, Jan. 18, 1990, IEEE Inc

ꢀ Technical Reference Guide, Extended Industry Standard Architecture Expansion

Bus, Compaq 1989

7.1.2

PCI

ꢀ PCI SIG

The PCI-SIG provides a forum for its ~900 member companies, who develop PCI

products based on the specifications that are created by the PCI-SIG. You can

search for information about the SIG on the Web.

ꢀ PCI & PCI-X Hardware and Software Architecture & Design, Fifth Edition,

Edward Solari and George Willse, Annabooks, 2001, ISBN 0-929392-63-9.

ꢀ PCI System Architecture, Tom Shanley and Don Anderson, Addison-Wesley, 2000,

ISBN 0-201-30974-2.

7.2

General PC Architecture

ꢀ Embedded PCs, Markt & Technik GmbH, ISBN 3-8272-5314-4 (German)

ꢀ Hardware Bible, Winn L. Rosch, SAMS, 1997, 0-672-30954-8

ꢀ Interfacing to the IBM Personal Computer, Second Edition, Lewis C. Eggebrecht,

SAMS, 1990, ISBN 0-672-22722-3

ꢀ The Indispensable PC Hardware Book, Hans-Peter Messmer, Addison-Wesley,

1994, ISBN 0-201-62424-9

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7 Apendix A: PC Architecture Information

ꢀ The PC Handbook: For Engineers, Programmers, and Other Serious PC Users,

Sixth Edition, John P. Choisser and John O. Foster, Annabooks, 1997, ISBN 0-

929392-36-1

7.3

Ports

7.3.1

RS-232 Serial

ꢀ EIA-232-E standard

The EIA-232-E standard specifies the interface between (for example) a modem

and a computer so that they can exchange data. The computer can then send data to

the modem, which then sends the data over a telephone line. The data that the

modem receives from the telephone line can then be sent to the computer. You can

search for information about the standard on the Web.

ꢀ RS-232 Made Easy: Connecting Computers, Printers, Terminals, and Modems,

Martin D. Seyer, Prentice Hall, 1991, ISBN 0-13-749854-3

ꢀ National Semiconductor

The Interface Data Book includes application notes. Type “232” as search criteria

to obtain a list of application notes. You can search for information about the data

book on National Semiconductor’s Web site.

7.3.2

Serial ATA

ꢀ Serial AT Attachment (ATA) Working Group.

ꢀ This X3T10 standard defines an integrated bus interface between disk drives and

host processors. It provides a common point of attachment for systems

manufacturers and the system. You can search for information about the working

group on the Web. We recommend you also search the Web for information on 4.2

I/O cable, if you use hard disks in a DMA3 or PIO4 mode.

7.3.3

USB

ꢀ USB Specification.

ꢀ USB Implementers Forum, Inc. is a non-profit corporation founded by the group

of companies that developed the Universal Serial Bus specification. The USB-IF

was formed to provide a support organization and forum for the advancement and

adoption of Universal Serial Bus technology. You can search for information

about the standard on the Web.

Specification Rev 013

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7 Apendix A: PC Architecture Information

7.4

Programming

ꢀ C Programmer’s Guide to Serial Communications, Second Edition, Joe Campbell,

SAMS, 1987, ISBN 0-672-22584-0

ꢀ Programmer’s Guide to the EGA, VGA, and Super VGA Cards, Third Edition,

Richard Ferraro, Addison-Wesley, 1990, ISBN 0-201-57025-4

ꢀ The Programmer’s PC Sourcebook, Second Edition, Thom Hogan, Microsoft

Press, 1991, ISBN 1-55615-321-X

ꢀ Undocumented PC, A Programmer’s Guide to I/O, CPUs, and Fixed Memory

Areas, Frank van Gilluwe, Second Edition, Addison-Wesley, 1997, ISBN 0-201-

47950-8

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8 APPENDIX B: DOCUMENT-REVISION

HISTORY

APPENDIX B: DOCUMENT-REVISION

HISTORY

Revision Date

Edited by

Changes

0.1

02.06.06

05.10.06

Z. Loncaric Created preliminary specification.

0.2

Z. Loncaric Index updates:

- no microETXexpress inputs anymore, now a separate specification

- new hardware, software and mechanical issues

0.3

0.4

02.04.07

Z. Loncaric Defined new chapter, 4.0 Signal Description, 4.1 Graphic signal description

Z. Loncaric Neutral document format. Update by comments of Aaron Su.

/ Aaron Su

0.5

15.05.07

Z. Loncaric Brand COM Express Extension, Updates for chapters: 4.1 Grafic signal description,

/ P. Müller 5.2 General GPIOs, 5.3 Thermal Control, 6.1 TPM Support, 6.3 Legacy SuperI/O

Support

0.6

0.7

16.05.07

24.07.07

C. Van De Minor message and grammar edits

Graaf

M. Ciolacu/ New neutral layout

Feuerecker

1.1

31.05.08

VGG

Add 3.1.2 new small form factor nano, add 5.2.1alternative GPIO use for SDIO

interface, add 5.1.1 wide Range for SFF

1.1

1.2

1.3

02.06.08

11.06.08

G.Szczuka Minor changes and grammar edits

VGG Minor changes, enter reverence to micro and nano

12.12.2008 G.Szczuka Correction of revision numbers 0.11 to 1.1 / 0.12 to 1.2

Specification Rev 013

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