®
Intel E8500/E8501 Chipset North
Bridge (NB) and eXternal Memory
Bridge (XMB)
Thermal/Mechanical Design Guide
May 2006
Document Number 306749-002
Contents
1
Introduction.........................................................................................................................7
1.1
1.2
1.3
Definition of Terms...............................................................................................................8
2
3
Packaging Technology.....................................................................................................11
2.1 Package Mechanical Requirements ..................................................................................14
Thermal Specifications.....................................................................................................15
3.1
3.2
Thermal Design Power (TDP)............................................................................................15
4
5
Thermal Simulation ..........................................................................................................17
Thermal Metrology ...........................................................................................................19
5.2
Die Case Temperature Measurements..............................................................................19
Power Simulation Software................................................................................................21
6
7
8
NB Reference Thermal Solution #1..................................................................................23
6.1
6.2
Operating Environment......................................................................................................23
Board-Level Components Keepout Dimensions................................................................25
Heatsink Orientation............................................................................................27
6.6
NB Reference Thermal Solution #2..................................................................................31
7.1
7.2
Operating Environment......................................................................................................31
Board-Level Components Keepout Dimensions................................................................33
Heatsink Orientation............................................................................................34
7.6
XMB Reference Thermal Solution....................................................................................37
8.1
8.2
Operating Environment......................................................................................................37
Board-Level Components Keepout Dimensions................................................................38
®
Intel E8500/E8501 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
3
Mechanical Interface Material............................................................................. 40
Thermal Interface Material.................................................................................. 40
Reliability Guidelines......................................................................................................... 41
A
B
Thermal Solution Component Suppliers ..........................................................................43
Mechanical Drawings.......................................................................................................47
Figures
6-1
Thermal Design Process..................................................................................................... 8
NB Package Dimensions (Top View)................................................................................ 11
NB Package Dimensions (Bottom View)........................................................................... 12
XMB Package Dimensions (Bottom View)........................................................................ 14
First NB Reference Heatsink Measured Thermal Performance vs.
Approach Velocity ............................................................................................................. 24
First NB Heatsink Extrusion Profile................................................................................... 28
Second NB Reference Heatsink Measured Thermal Performance vs.
7-1
Approach Velocity ............................................................................................................. 32
XMB Reference Heatsink Volumetric Envelope................................................................ 38
XMB Heatsink Board Component Keepout....................................................................... 39
XMB Heatsink Assembly................................................................................................... 39
NB Heatsink #1 Drawing................................................................................................... 49
NB Heatsink #2 Drawing................................................................................................... 51
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4
Intel E8500/8501 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
Tables
A-1
A-2
A-3
Intel E8500 Chipset NB Thermal Specifications ..............................................................15
Intel E8501 Chipset NB Thermal Specifications ..............................................................16
Intel E8500 Chipset XMB Thermal Specifications ...........................................................16
Intel E8501 Chipset XMB Thermal Specifications ...........................................................16
NB Heatsink Thermal Solution #1......................................................................................43
NB Heatsink Thermal Solution #2......................................................................................44
Mechanical Drawing List....................................................................................................47
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Intel E8500/E8501 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
5
Revision History
Document
Number
Revision
Number
Description
Date
306749
306749
001
002
•
Initial release of this document
March 2005
May 2006
•
•
Added Intel® E8501 chipset specific information and re-titled document
Added updated Intel® E8500 Chipset eXternal Memory Bridge (XMB)
thermal specification in Section 3.2
§
®
6
Intel E8500/8501 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
1 Introduction
As the complexity of computer systems increases, so do the power dissipation requirements. Care
must be taken to ensure that the additional power is properly dissipated. Typical methods to
improve heat dissipation include selective use of ducting, and/or passive heatsinks.
The goals of this document are to:
• Outline the thermal and mechanical operating limits and specifications for the
®
®
Intel E8500/E8501 chipset North Bridge (NB) component and the Intel E8500/E8501
chipset eXternal Memory Bridge (XMB) component.
• Describe two reference thermal solutions that meet the specification of the E8500/E8501
chipset NB component.
• Describe a reference thermal solution that meets the specification of the E8500/E8501 chipset
XMB component.
Properly designed thermal solutions provide adequate cooling to maintain the E8500/E8501
chipset die temperatures at or below thermal specifications. This is accomplished by providing a
low local-ambient temperature, ensuring adequate local airflow, and minimizing the die to local-
ambient thermal resistance. By maintaining the E8500/E8501 chipset die temperature at or below
the specified limits, a system designer can ensure the proper functionality, performance, and
reliability of the chipset. Operation outside the functional limits can degrade system performance
and may cause permanent changes in the operating characteristics of the component.
The simplest and most cost effective method to improve the inherent system cooling characteristics
is through careful chassis design and placement of fans, vents, and ducts. When additional cooling
is required, component thermal solutions may be implemented in conjunction with system thermal
solutions. The size of the fan or heatsink can be varied to balance size and space constraints with
acoustic noise.
This document addresses thermal design and specifications for the E8500/E8501 chipset NB and
XMB components only. For thermal design information on other chipset components, refer to the
®
respective component datasheet. For the Intel 6700PXH 64-bit PCI Hub, refer to the
®
Intel 6700PXH 64-bit PCI Hub Thermal Design Guidelines. For the ICH5, refer to the
®
®
Intel 82801EB I/O Controller Hub 5 (ICH5) and Intel 82801ER I/O Controller Hub 5 R
(ICH5R) Thermal Design Guide.
1.1
Design Flow
To develop a reliable, cost-effective thermal solution, several tools have been provided to the
appropriate for each step.
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Intel E8500 /E8501Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
7
Introduction
Figure 1-1. Thermal Design Process
001239
1.2
Definition of Terms
BGA
Ball grid array. A package type, defined by a resin-fiber substrate, onto which a
die is mounted, bonded and encapsulated in molding compound. The primary
electrical interface is an array of solder balls attached to the substrate opposite
the die and molding compound.
BLT
ICH5
IHS
Bond line thickness. Final settled thickness of the thermal interface material
after installation of heatsink.
I/O controller hub. The chipset component that contains the primary PCI
interface, LPC interface, USB, S-ATA, and other legacy functions.
Integrated Heat Spreader, Integral part of the NB package. It enhances
dissipation of heat generated by the NB die and provides interface surface
between NB die and cooling solution.
IMI
Independent memory Interfaces. Port connecting the NB to the XMB
®
Intel 6700PXH The chipset component that performs PCI bridging functions between the PCI
64-bit PCI Hub
Express* interface and the PCI Bus. It contains two PCI bus interfaces that can
be independently configured to operate in PCI (33 or 66 MHz) or PCI-X*
mode 1 (66, 100 or 133 MHz), for either 32- or 64-bit PCI devices.
T
Maximum die temperature allowed. This temperature is measured at the
geometric center of the top of the package die.
case_max
T
Minimum die temperature allowed. This temperature is measured at the
geometric center of the top of the package die.
case_min
TDP
Thermal design power. Thermal solutions should be designed to dissipate this
target power level. TDP is not the maximum power that the chipset can
dissipate.
TIM
NB
Thermal interface material. Thermally conductive material installed between
two surfaces to improve heat transfer and reduce interface contact resistance.
®
Intel E8500/E8501 chipset North Bridge Component. The chipset component
that provides the interconnect to the processors, XMBs and various I/O
components.
®
8
Intel E8500/E8501 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
Introduction
®
XMB
Intel E8500/E8501 chipset eXternal Memory Bridge Component. The chipset
component that bridges the IMI and DDR interfaces.
1.3
Reference Documents
The reader of this specification should also be familiar with material and concepts presented in the
following documents:
®
®
• Intel 82801EB I/O Controller Hub 5 (ICH5) and Intel 82801ER I/O Controller Hub 5 R
(ICH5R) Thermal Design Guide
®
®
• Intel 82801EB I/O Controller Hub 5 (ICH5) and Intel 82801ER I/O Controller Hub 5 R
(ICH5R) Datasheet
®
• Intel 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines
®
®
• Intel 6700PXH 64-bit PCI Hub and Intel 6702PXH 64-bit PCI Datasheet
®
• Intel E8501 Chipset North Bridge (NB) Datasheet
®
• Intel E8501 Chipset North Bridge (NB) Specification Update
®
• Intel E8501 Chipset eXternal Memory Bridge (XMB) Datasheet
®
• Intel E8501 Chipset eXternal Memory Bridge (XMB) Specification Update
®
• Intel E8500 Chipset North Bridge (NB) Datasheet
®
• Intel E8500 Chipset North Bridge (NB) Specification Update
®
• Intel E8500 Chipset eXternal Memory Bridge (XMB) Datasheet
®
• Intel E8500 Chipset eXternal Memory Bridge (XMB) Specification Update
®
®
• Dual-Core Intel Xeon Processor 7000 Sequence Datasheet
®
• 64-bit Intel Xeon™ Processor MP with up to 8MB L3 Cache Datasheet
®
• 64-bit Intel Xeon™ Processor MP with up to 8MB L3 Cache Thermal/Mechanical Design
Guidelines
®
• 64-bit Intel Xeon™ Processor MP with 1MB L2 Cache Datasheet
®
• 64-bit Intel Xeon™ Processor MP with 1MB L2 Cache Thermal/Mechanical Design
Guidelines
• BGA/OLGA Assembly Development Guide
• Various system thermal design suggestions (http://www.formfactors.org)
Note: Unless otherwise specified, these documents are available through your Intel field sales
representative. Some documents may not be available at this time.
§
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Intel E8500/E8501 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
9
Introduction
®
10
Intel E8500/E8501 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
2 Packaging Technology
The E8500/E8501 chipsets consist of four individual components: the NB, the XMB, the
®
Intel 6700PXH 64-bit PCI Hub and the I/O controller hub (ICH5R). The E8500/E8501 chipset
NB component use a 42.5 mm squared, 12-layer flip chip ball grid array (FC-BGA) package (see
®
Intel 6700PXH 64-bit PCI Hub package, refer to the Intel 6700PXH 64-bit PCI Hub
Thermal/Mechanical Design Guide. For information on the ICH5 package, refer to the
®
®
Intel 82801EB I/O Controller Hub 5 (ICH5) and Intel 82801ER I/O Controller Hub 5 R
(ICH5R) Thermal Design Guide.
Figure 2-1. NB Package Dimensions (Top View)
Handling
Exclusion
Area
38.5 mm
NB
38.5 mm
42.5 mm
IHS
42.5 mm
Figure 2-2. NB Package Dimensions (Side View)
4.23 ± 0.146 mm
IHS
3.79 ± 0.144 mm
2.44 ± 0.071 mm
Substrate
0.20
See Note 4
0.20 –C–
See Note 1
Seating Plane
0.435 ± 0.025 mm
See Note 3
Notes:
1. Primary datum -C- and seating plan are defined by the spherical crowns of the solder balls (shown before motherboard attach)
2. All dimensions and tolerances conform to ANSI Y14.5M-1994
3. BGA has a pre-SMT height of 0.5mm and post-SMT height of 0.41-0.46mm
4. Shown before motherboard attach; FCBGA has a convex (dome shaped) orientation before reflow and is expected to have a slightly concave (bowl shaped)
orientation after reflow
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Intel E8500/E8501 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
11
Packaging Technology
Figure 2-3. NB Package Dimensions (Bottom View)
AV
A
U
A
AT
R
A
AP
N
AM
AL
AK
AJ
A
H
AG
AF
AE
A
A
C
D
AB
AA
W
U
R
N
L
Y
V
T
42.5 + 0.05
P
M
K
H
F
20.202
J
G
E
37X 1.092
D
B
C
A
2
4
6
8
10 12 14 16 18 20 22 24 26 28 30 32 34 36 38
11 13 15 17 19 21 23 25 27 29 31 33 35 37
1
3
5
7
9
A
37X 1.092
20.202
B
42.5 + 0.05
0.2
C
A
NOTES:
1. All dimensions are in millimeters.
2. All dimensions and tolerances conform to ANSI Y14.5M-1994.
®
12
Intel E8500/E8501 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
Packaging Technology
Figure 2-4. XMB Package Dimensions (Top View)
Die
Handling
Exclusion
Area
Keepout
Area
14.02mm.
8.88mm.
XMB
Die
11.73mm. 6.65mm.
23.50mm. 27.50mm. 37.50mm.
23.50mm.
27.50mm.
37.50mm.
Figure 2-5. XMB Package Dimensions (Side View)
Substrate
Decoup
2.535 ± 0.123 mm
Die
Cap
2.100 ± 0.121 mm
0.84 ± 0.05 mm
0.7 mm Max
0.20
See Note 4
0.20 –C–
Seating Plane
0.435 ± 0.025 mm
See Note 3
See Note 1
Notes:
1. Primary datum -C- and seating plan are defined by the spherical crowns of the solder balls (shown before motherboard attach)
2. All dimensions and tolerances conform to ANSI Y14.5M-1994
3. BGA has a pre-SMT height of 0.5mm and post-SMT height of 0.41-0.46mm
4. Shown before motherboard attach; FCBGA has a convex (dome shaped) orientation before reflow and is expected to have a slightly concave
(bowl shaped) orientation after reflow
®
Intel E8500/E8501 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
13
Packaging Technology
Figure 2-6. XMB Package Dimensions (Bottom View)
AV
A
U
A
AT
R
A
AP
N
AM
AL
AK
AJ
A
H
AG
AF
AE
A
A
C
D
AB
AA
W
U
R
N
L
Y
V
T
42.5 + 0.05
P
M
K
H
F
20.202
J
G
E
37X 1.092
D
B
C
A
2
4
6
8
10 12 14 16 18 20 22 24 26 28 30 32 34 36 38
11 13 15 17 19 21 23 25 27 29 31 33 35 37
1
3
5
7
9
A
37X 1.092
20.202
B
42.5 + 0.05
0.2
C
A
2.1
Package Mechanical Requirements
The E8500/E8501c chipset NB package has an IHS and the XMB package has an exposed bare die
which is capable of sustaining a maximum static normal load of 15-lbf. The package is NOT
capable of sustaining a dynamic or static compressive load applied to any edge of the bare die.
These mechanical load limits must not be exceeded during heatsink installation, mechanical stress
testing, standard shipping conditions and/or any other use condition.
Notes:
1. The heatsink attach solutions must not include continuous stress onto the chipset package with
the exception of a uniform load to maintain the heatsink-to-package thermal interface.
2. These specifications apply to uniform compressive loading in a direction perpendicular to the
bare die/IHS top surface.
3. These specifications are based on limited testing for design characterization. Loading limits
are for the package only
§
®
14
Intel E8500/E8501 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
3 Thermal Specifications
3.1
Thermal Design Power (TDP)
Analysis indicates that real applications are unlikely to cause the E8500/E8501 chipset NB/XMB
components to consume maximum power dissipation for sustained time periods. Therefore, in
order to arrive at a more realistic power level for thermal design purposes, Intel characterizes
power consumption based on known platform benchmark applications. The resulting power
consumption is referred to as the Thermal Design Power (TDP). TDP is the target power level that
the thermal solutions should be designed to. TDP is not the maximum power that the chipset can
dissipate.
the E85001 chipset XMB component FC-BGA packages have poor heat transfer capability into the
board and have minimal thermal capability without a thermal solution. Intel recommends that
system designers plan for one or more heatsinks when using the E8500/E8501 chipsets NB/XMB
components.
3.2
Die Case Temperature Specifications
To ensure proper operation and reliability of the E8500/E8501 chipset NB/XMB components, the
die temperatures must be at or between the maximum/minimum operating temperature ranges as
guidelines on accurately measuring package die temperatures.
®
Table 3-1. Intel E8500 Chipset NB Thermal Specifications
Parameter
Value
Notes
Tcase_max
104°C
5°C
Tcase_min
TDPwith 1 XMB attached
TDPwith 2 XMBs attached
TDPwith 3 XMBs attached
TDPwith 4 XMBs attached
17.9W
19.8W
22.4W
24.5W
NOTE:
1. These specifications are based on silicon characterization, however, they may be updated as further data
becomes available.
®
Intel E8500/E8501 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
15
Thermal Specifications
®
Table 3-2. Intel E8501 Chipset NB Thermal Specifications
Parameter
Value
Notes
Tcase_max
104°C
5°C
Tcase_min
TDPwith 1 XMB attached
TDPwith 2 XMBs attached
TDPwith 3 XMBs attached
TDPwith 4 XMBs attached
26.0 W
28.2 W
30.4 W
32.6 W
®
Table 3-3. Intel E8500 Chipset XMB Thermal Specifications
Parameter
Value
Notes
Tcase_max
Tcase_min
105°C
5°C
TDPdual channel
11.1 W
DDR2-400
NOTE:
1. These specifications are based on silicon characterization, however, they may be updated as further data
becomes available.
®
Table 3-4. Intel E8501 Chipset XMB Thermal Specifications
Parameter
Value
Notes
Tcase_max
Tcase_min
105°C
5°C
TDPdual channel
12.1W
DDR2-400
§
®
16
Intel E8500/E8501 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
4 Thermal Simulation
Intel provides thermal simulation models of the E8500/E8501 chipset NB/XMB components and
associated user's guides to aid system designers in simulating, analyzing, and optimizing their
thermal solutions in an integrated, system-level environment. The models are for use with the
commercially available Computational Fluid Dynamics (CFD)-based thermal analysis tool
FLOTHERM* (version 3.1 or higher) by Flomerics, Inc. These models are also available in
ICEPAK* format. Contact your Intel field sales representative to order the thermal models and
user's guides.
§
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Intel E8500/E8501 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
17
Thermal Simulation
®
18
Intel E8500/E8501 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
5 Thermal Metrology
The system designer must make temperature measurements to accurately determine the thermal
performance of the system. Intel has established guidelines for proper techniques to measure the
useful guidelines for thermal performance and evaluation.
5.1
Die Case Temperature Measurements
To ensure functionality and reliability, the T
of the NB/XMB must be maintained at or between
case
Table 3-3. The surface temperature at the geometric center of the die corresponds to T
.
case
Measuring T
requires special care to ensure an accurate temperature measurement.
case
Temperature differences between the temperature of a surface and the surrounding local ambient
air can introduce errors in the measurements. The measurement errors could be due to a poor
thermal contact between the thermocouple junction and the surface of the package, heat loss by
radiation and/or convection, conduction through thermocouple leads, and/or contact between the
thermocouple cement and the heatsink base (if a heatsink is used). For maximize measurement
accuracy, only the 0° thermocouple attach approach is recommended.
Zero Degree Angle Attach Methodology
1. Mill a 3.3 mm (0.13 in.) diameter and 1.5 mm (0.06 in.) deep hole centered on the bottom of
the heatsink base.
2. Mill a 1.3 mm (0.05 in.) wide and 0.5 mm (0.02 in.) deep slot from the centered hole to one
3. Attach thermal interface material (TIM) to the bottom of the heatsink base.
4. Cut out portions of the TIM to make room for the thermocouple wire and bead. The cutouts
should match the slot and hole milled into the heatsink base.
5. Attach a 36 gauge or smaller calibrated K-type thermocouple bead or junction to the center of
the top surface of the die using a high thermal conductivity cement. During this step, ensure no
contact is present between the thermocouple cement and the heatsink base because any contact
will affect the thermocouple reading. It is critical that the thermocouple bead makes
6. Attach heatsink assembly to the NB/XMB and route thermocouple wires out through the
milled slot.
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Intel E8500/E8501 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
19
Thermal Metrology
Figure 5-1. Thermal Solution Decision Flowchart
001240
Figure 5-2. Zero Degree Angle Attach Heatsink Modifications
NOTE: Not to scale.
Figure 5-3. Zero Degree Angle Attach Methodology (Top View)
Die
Thermocouple
Wire
Cement +
Thermocouple Bead
Substrate
001321
NOTE: Not to scale.
®
20
Intel E8500/E8501 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
Thermal Metrology
5.2
Power Simulation Software
The power simulation software is a utility designed to dissipate the thermal design power on an
E8500/E8501 chipset NB component or XMB component when used in conjunction with the
®
®
®
®
64-bit Intel Xeon processor MP or Dual-Core Intel Xeon processor 7000 sequence. The
combination of the above mentioned processor and the higher bandwidth capability of the
E8500/E8501 chipsets enable higher levels of system performance. To assess the thermal
performance of the chipset thermal solution under “worst-case realistic application” conditions,
Intel is developing a software utility that operates the chipset at near worst-case thermal power
dissipation.
The power simulation software being developed should only be used to test thermal solutions at or
solution needs. Real world applications may exceed the thermal design power limit for transient
time periods. For power supply current requirements under these transient conditions, please refer
to each component's datasheet for the ICC (Max Power Supply Current) specification. Contact
your Intel field sales representative to order the power utility software and user's guide.
§
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Intel E8500/E8501 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
21
Thermal Metrology
®
22
Intel E8500/E8501 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
6 NB Reference Thermal Solution #1
Intel has developed two different reference thermal solutions designed to meet the cooling needs of
the E8500/E8501 chipset NB component under operating environments and specifications defined
st
in this document. This chapter describes the overall requirements for the 1 NB reference thermal
solution including critical-to-function dimensions, operating environment, and validation criteria.
Other chipset components may or may not need attached thermal solutions, depending on your
®
specific system local-ambient operating conditions. For information on the Intel 6700PXH 64-bit
®
PCI Hub, refer to thermal specification in the Intel 6700PXH 64-bit PCI Hub
Thermal/Mechanical Design Guide. For information on the ICH5, refer to thermal specification in
®
®
the Intel 82801EB I/O Controller Hub 5 (ICH5) and Intel 82801ER I/O Controller Hub 5 R
(ICH5R) Thermal Design Guide.
6.1
Operating Environment
The reference thermal solution was designed assuming a maximum local-ambient temperature of
52°C. The minimum recommended airflow velocity through the cross section of the heatsink fins is
400 linear feet per minute (lfm). The approaching airflow temperature is assumed to be equal to the
local-ambient temperature. The thermal designer must carefully select the location to measure
airflow to obtain an accurate estimate. These local-ambient conditions are based on a 35°C
external-ambient temperature at sea level. (External-ambient refers to the environment external to
the system.)
The fasteners associated for this reference thermal solution is intended to be used on 0.062”
thickness motherboard
6.2
Heatsink Performance
st
versus approach air velocity. Since this data was measured at sea level, a correction factor would be
required to estimate thermal performance at other altitudes.
®
Intel E8500/E8501 Chipset North Bridge (NB) and eXternal Memory
23
Bridge (XMB) Thermal/Mechanical Design Guide
NB Reference Thermal Solution #1
Figure 6-1. First NB Reference Heatsink Measured Thermal Performance vs.
Approach Velocity
Ȍ
1.50
1.40
1.30
1.20
1.10
1.00
0.90
0.80
100
200
300
400
500
600
700
Flow Rate (LFM)
6.3
Mechanical Design Envelope
While each design may have unique mechanical volume and height restrictions or implementation
requirements, the height, width, and depth constraints typically placed on the E8500/E8501 chipset
When using heatsinks that extend beyond the NB reference heatsink envelope shown in
Figure 6-2, any motherboard components placed between the heatsink and motherboard cannot
exceed 4.14 mm (0.16 in.) in height.
®
24
Intel E8500/E8501 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
NB Reference Thermal Solution #1
Figure 6-2. First NB Reference Heatsink Volumetric Envelope
Heatsink
Fin
Heatsink Base
IHS + TIM2
FCBGA + Solder Balls
Motherboard
64.52 mm.
42.50 mm.
TNB
Heatsink
Heatsink
Fin
Heatsink Base
6.4
Board-Level Components Keepout Dimensions
The location of hole pattern and keepout zones for the reference thermal solution are shown in
®
Intel E8500/E8501 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
25
NB Reference Thermal Solution #1
6.5
First NB Heatsink Thermal Solution Assembly
The reference thermal solution for the chipset NB component is a passive extruded heatsink with
thermal interface. It is attached to the board by using four retaining Tuflok* fasteners. Figure 6-4
shows the reference thermal solution assembly and associated components.
Full mechanical drawings of the thermal solution assembly and the heatsink are provided in
Figure 6-3. First NB Heatsink Board Component Keepout
64.500mm.
55.245mm.
42.500mm.
42.500mm. 55.245mm. 64.500mm.
NB Location
4X Ø 5.5mm
4X Ø 2.95 ± 0.0254mm
No Component Keep Out Area
4.14mm Max Component Height
Heatsink Mounting Hole
NOTE: All dimensions are in millimeters.
®
26
Intel E8500/E8501 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
NB Reference Thermal Solution #1
6.5.1
Heatsink Orientation
Since this solution is based on a unidirectional heatsink, mean airflow direction must be aligned
with the direction of the heatsink fins.
Figure 6-4. First NB Heatsink Assembly
6.5.2
Extruded Heatsink Profiles
The reference NB thermal solution uses an extruded heatsink for cooling the chipset NB.
Figure 6-5 shows the heatsink profile. Appendix A lists a supplier for this extruded heatsink. Other
heatsinks with similar dimensions and increased thermal performance may be available. Full
6.5.3
6.5.4
Mechanical Interface Material
There is no mechanical interface material associated with this reference solution.
Thermal Interface Material
A TIM provides improved conductivity between the die and heatsink. The reference thermal
solution uses Chomerics THERMFLOW* T710, 0.127 mm (0.005 in.) thick, 38.5 mm x 38.5 mm
(1.5 in. x 1.5 in.) square.
Note: Unflowed or “dry” Chomerics THERMFLOW T710 has a material thickness of 0.005 inch. The
flowed or “wet” Chomerics THERMFLOW T710 has a material thickness of ~0.0025 inch after it
reaches its phase change temperature.
6.5.4.1
Effect of Pressure on TIM Performance
As mechanical pressure increases on the TIM, the thermal resistance of the TIM decreases. This
phenomenon is due to the decrease of the bond line thickness (BLT). BLT is the final settled
thickness of the thermal interface material after installation of heatsink. The effect of pressure on
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NB Reference Thermal Solution #1
heatsink clip provides enough pressure for the TIM to achieve a thermal conductivity of
2
0.17°C inch /W.
Table 6-1. Chomerics THERMFLOW* T710 TIM Performance as a Function of Attach Pressure
Pressure (psi)
Thermal Resistance (°C × in2)/W
5
0.37
0.30
0.21
0.17
10
20
30
NOTE:
1. All measured at 50°C.
6.5.5
Heatsink Retaining Fastener
The reference solution uses four heatsink retaining Tufloks. The fasteners attach the heatsink to the
motherboard by expanding its Tuflok prong to snap into each of the four heatsink mounting holes.
These fasteners are intended to be used on a 0.062” thickness motherboard with either of the two
Figure 6-5. First NB Heatsink Extrusion Profile
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6.6
Reliability Guidelines
Each motherboard, heatsink and attach combination may vary the mechanical loading of the
component. Based on the end user environment, the user should define the appropriate reliability
test criteria and carefully evaluate the completed assembly prior to use in high volume. Some
Table 6-2. Reliability Guidelines
Test (1)
Requirement
Pass/Fail Criteria (2)
Mechanical
Shock
50 g, board level, 11 msec, 3 shocks/axis
Visual Check and Electrical Functional
Test
Random
Vibration
7.3 g, board level, 45 min/axis, 50 Hz to
2000 Hz
Visual Check and Electrical Functional
Test
Temperature Life 85°C, 2000 hours total, checkpoints at 168,
500, 1000, and 2000 hours
Visual Check
Thermal Cycling
Humidity
–5°C to +70°C, 500 cycles
Visual Check
Visual Check
85% relative humidity, 55°C, 1000 hours
NOTES:
1. It is recommended that the above tests be performed on a sample size of at least twelve assemblies from
three lots of material.
2. Additional pass/fail criteria may be added at the discretion of the user.
§
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NB Reference Thermal Solution #1
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7 NB Reference Thermal Solution #2
Intel has developed two different reference thermal solutions designed to meet the cooling needs of
the E8500/E8501 chipset NB component under operating environments and specifications defined
in this document. This chapter describes the overall requirements for the 2nd NB reference thermal
solution including critical-to-function dimensions, operating environment, and validation criteria.
Other chipset components may or may not need attached thermal solutions, depending on your
®
specific system local-ambient operating conditions. For information on the Intel 6700PXH 64-bit
®
PCI Hub, refer to thermal specification in the Intel 6700PXH 64-bit PCI Hub
Thermal/Mechanical Design Guidelines. For information on the ICH5, refer to thermal
®
®
specification in the Intel 82801EB I/O Controller Hub 5 (ICH5) and Intel 82801ER I/O
Controller Hub 5 R (ICH5R) Thermal Design Guide.
7.1
Operating Environment
The reference thermal solution was designed assuming a maximum local-ambient temperature of
52°C. The minimum recommended airflow velocity through the cross section of the heatsink fins is
400 linear feet per minutes (lfm). The approaching airflow temperature is assumed to be equal to
the local-ambient temperature. The thermal designer must carefully select the location to measure
airflow to obtain an accurate estimate. These local-ambient conditions are based on a 35°C
external-ambient temperature at sea level. (External-ambient refers to the environmental external
to the system.)
The fastener for this reference thermal solution is intended to be used on motherboard with
thickness between 0.085” and 0.093”.
7.2
Heatsink Performance
nd
versus approach air velocity. Since this data was measured at sea level, a correction factor would be
required to estimate thermal performance at other altitudes.
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NB Reference Thermal Solution #2
Figure 7-1. Second NB Reference Heatsink Measured Thermal Performance vs.
Approach Velocity
2.3
2
1.7
1.4
1.1
0.8
0.5
0
100
200
300
400
500
600
Flow Rate (LFM)
7.3
Mechanical Design Envelope
While each design may have unique mechanical volume and height restrictions or implementation
requirements, the height, width, and depth constraints typically placed on the E8500/E8501 chipset
any motherboard components placed between the heatsink and motherboard cannot exceed
4.14 mm (0.16 in.) in height.
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NB Reference Thermal Solution #2
Figure 7-2. Second NB Reference Heatsink Volumetric Envelope
Heatsink
Fin
Heatsink Base
IHS + TIM2
FCBGA
Motherboard
64.52 mm.
42.50 mm.
Heatsink Base
Heatsink
Fin
7.4
7.5
Board-Level Components Keepout Dimensions
Second NB Heatsink Thermal Solution Assembly
The reference thermal solution for the chipset NB component is a passive extruded heatsink with
thermal interlace. It is attached to the board by using four retaining Tuflok fasteners. Figure 7-3
shows the reference thermal solution assembly and associated components.
Full mechanical drawings of the thermal solution assembly and the heatsink are provided in
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NB Reference Thermal Solution #2
Figure 7-3. Second NB Heatsink Assembly
7.5.1
Heatsink Orientation
Since this solution is based on a unidirectional heatsink, mean airflow direction must be aligned
with the direction of the heatsink fins.
7.5.2
7.5.3
Extruded Heatsink Profiles
Mechanical Interface Material
There is no mechanical interface material associated with this reference solution.
7.5.4
Thermal Interface Material
7.5.4.1
Effect of Pressure on TIM Performance
7.5.5
Heatsink Retaining Fastener
The reference solution uses four heatsink retaining Tufloks. The fasteners attached the heatsink to
the motherboard by expanding its Tuflok prong to snap into each of the four heatsink mounting
holes. These fasteners are intended to be used on 0.085” to 0.093” thickness motherboard with
fastener.
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NB Reference Thermal Solution #2
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8 XMB Reference Thermal Solution
Intel has developed one different reference thermal solution designed to meet the cooling needs of
the E8500/E8501 chipset XMB component under operating environments and specifications
defined in this document. This chapter describes the overall requirements for the XMB reference
thermal solution including critical-to-function dimensions, operating environment, and validation
criteria. Other chipset components may or may not need attached thermal solutions, depending on
®
your specific system local-ambient operating conditions. For information on the Intel 6700PXH
®
64-bit PCI Hub, refer to thermal specification in the Intel 6700PXH 64-bit PCI Hub
Thermal/Mechanical Design Guide. For information on the ICH5, refer to thermal specification in
®
®
the Intel 82801EB I/O Controller Hub 5 (ICH5) and Intel 82801ER I/O Controller Hub 5 R
(ICH5R) Thermal Design Guide.
8.1
Operating Environment
The reference thermal solution was designed assuming a maximum local-ambient temperature of
57°C. The minimum recommended airflow velocity through the cross section of the heatsink fins is
300 linear feet per minute (lfm). The approaching airflow temperature is assumed to be equal to the
local-ambient temperature. The thermal designer must carefully select the location to measure
airflow to obtain an accurate estimate. These local-ambient conditions are based on a 35°C
external-ambient temperature at sea level. (External-ambient refers to the environment external to
the system.)
The fasteners associated for this reference thermal solution is intended to be used on 0.062”
thickness motherboard.
8.2
Heatsink Performance
Figure 8-1 depicts the measured thermal performance of the XMB reference thermal solution
versus approach air velocity. Since this data was measured at sea level, a correction factor would be
required to estimate thermal performance at other altitudes.
Figure 8-1. XMB Reference Heatsink Measured Thermal Performance vs. Approach Velocity
5.5
5
4.5
4
3.5
3
2.5
0
100
200
300
400
500
600
Flow Rate (LFM)
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XMB Reference Thermal Solution
8.3
Mechanical Design Envelope
While each design may have unique mechanical volume and height restrictions or implementation
requirements, the height, width and depth constraints typically placed on the E8500/E8501 chipset
When using heatsinks that extend beyond the XMB reference heatsink envelope shown in
Figure 8-2, any motherboard components placed between the heatsink and motherboard cannot
exceed 2.48 mm (0.10 in.) in height.
Figure 8-2. XMB Reference Heatsink Volumetric Envelope
Heatsink Fin
Heatsink Base
Motherboard
Die + TIM
FCBGA + Solder Balls
63.50mm.
Heatsink Fin
45.50mm.
8.4
8.5
Board-Level Components Keepout Dimensions
The locations of holes pattern and keepout zones for the reference thermal solution are shown in
XMB Heatsink Thermal Solution Assembly
The reference thermal solution for the chipset XMB component is a passive extruded heatsink with
thermal interface. It is attached to the board by using four retaining Tuflok fasteners. Figure 8-4
shows the reference thermal solution assembly and associated components.
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XMB Reference Thermal Solution
Full mechanical drawings of the thermal solution assembly and the heatsink are provided in
Figure 8-3. XMB Heatsink Board Component Keepout
63.500mm.
55.250mm.
37.500mm.
37.5mm
38.097mm. 48.260mm.
XMB Location
4X Ø 5.5mm
4X Ø 2.95 ± 0.0254mm
No Component Keep Out Area
2.48mm Max Component Height
Heatsink Mounting Hole
8.5.1
Heatsink Orientation
Since this solution is based on a unidirectional heatsink, mean airflow direction must be aligned
with the direction of the heatsink fins.
Figure 8-4. XMB Heatsink Assembly
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XMB Reference Thermal Solution
8.5.2
Extruded Heatsink Profiles
The reference XMB thermal solution uses an extruded heatsink for cooling the chipset XMB.
Figure 8-5 shows the heatsink profile. Appendix A lists a supplier for this extruded heatsink. Other
heatsinks with similar dimensions and increased thermal performance may be available. A full
8.5.3
8.5.4
Mechanical Interface Material
There is no mechanical interface material associated with this reference solution.
Thermal Interface Material
A TIM provides improved conductivity between the die and the heatsink. The reference thermal
solution uses Chomerics THERMFLOW T710, 0.127 mm (0.005 in.) thick, 17.8 mm x 17.8 mm
(0.7 in. x 0.7 in.) square.
Note: Unflowed or “dry” Chomerics THERMFLOW T710 has a material thickness of 0.005 inch.
The flowed or “wet” Chomerics THERMFLOW T710 has a material thickness of ~0.0025 inch
after it reaches its phase change temperature.
8.5.4.1
Effect of Pressure on TIM Performance
8.5.5
Heatsink Retaining Fastener
The reference solution uses four heatsink retaining Tufloks. The fasteners attached the heatsink to
the motherboard by expanding its Tuflok prong to snap into each of the four heatsink mounting
hole. These fasteners are intended to be used on a 0.062” thickness motherboard. See Appendix B
for a mechanical drawing of the fastener.
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A Thermal Solution Component
Suppliers
Table A-1.
NB Heatsink Thermal Solution #1
Supplier
(Part Number)
Part
Intel Part Number
Contact Information
Harry Lin (USA)
Heatsink Assembly includes:
C23120-001
CCI/ACK
•
•
•
Unidirectional Fin Heatsink
Thermal Interface Material
Retaining Fastener
714-739-5797
Monica Chih (Taiwan)
866-2-29952666, x131
Unidirectional Fin Heatsink
(64.52 x 64.52 x 50.8 mm)
C19221-001
CCI/ACK
Harry Lin (USA)
714-739-5797
Monica Chih (Taiwan)
866-2-29952666, x131
Thermal Interface
(T710)
689850-001
-
Chomerics
Todd Sousa (USA)
(69-12-21937-T710)
360-606-8171
Retaining Fastener
ITW Fastex*
Ron Schmidt (USA)
847-299-2222
(8034-00-9909)
Henry Lu (Taiwan)
(886) 7-811-9206 Ext. 10
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Thermal Solution Component Suppliers
Table A-2.
NB Heatsink Thermal Solution #2
Intel Part Number
Contact Information
Supplier
(Part Number)
Part
Heatsink Assembly includes:
C44148-001
CCI/ACK
Harry Lin (USA)
•
•
•
Unidirectional Fin Heatsink
Thermal Interface Material
Retaining Fastener
714-739-5797
Monica Chih (Taiwan)
866-2-29952666, x131
Unidirectional Fin Heatsink
(64.52 x 64.52 x 50.8 mm)
C44147-001
CCI/ACK
Harry Lin (USA)
714-739-5797
Monica Chih (Taiwan)
866-2-29952666, x131
Thermal Interface
(T710)
689850-001
-
Chomerics
Todd Sousa (USA)
(69-12-21937-T710)
360-606-8171
Retaining Fastener
ITW Fastex*
Ron Schmidt (USA)
847-299-2222
(8047-00-9909)
Henry Lu (Taiwan)
(886) 7-811-9206 Ext. 10
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Thermal Solution Component Suppliers
Table A-3.
XMB Heatsink Thermal Solution
Supplier
(Part Number)
Part
Intel Part Number
Contact Information
Heatsink Assembly includes:
C23124-001
CCI/ACK
Harry Lin (USA)
•
•
•
Unidirectional Fin Heatsink
Thermal Interface Material
Retaining Fastener
714-739-5797
Monica Chih (Taiwan)
866-2-29952666, x131
Unidirectional Fin Heatsink
(64.52 x 64.52 x 50.8 mm)
C19222-001
CCI/ACK
Harry Lin (USA)
714-739-5797
Monica Chih (Taiwan)
866-2-29952666, x131
Thermal Interface
(T-710)
689850-001
-
Chomerics
Todd Sousa (USA)
(69-12-22000-T710)
360-606-8171
Retaining Fastener
ITW Fastex*
Ron Schmidt (USA)
847-299-2222
(8034-00-9909)
Henry Lu (Taiwan)
(886) 7-811-9206 Ext. 10
NOTE: The enabled components may not be currently available from all suppliers. Contact the supplier directly to verify time of
component availability.
§
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B Mechanical Drawings
Table B-1. Mechanical Drawing List
Drawing Description
Figure Number
NB Heatsink #1 Assembly Drawing
NB Heatsink #1 Drawing
NB Heatsink #2 Assembly Drawing
NB Heatsink #2 Drawing
XMB Heatsink Assembly Drawing
XMB Heatsink Drawing
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Mechanical Drawings
§
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