Cypress CY7C1257V18 User Manual

CY7C1246V18, CY7C1257V18  
CY7C1248V18, CY7C1250V18  
36-Mbit DDR-II+ SRAM 2-Word  
Burst Architecture (2.0 Cycle Read Latency)  
Features  
Functional Description  
36-Mbit density (4M x 8, 4M x 9, 2M x 18, 1M x 36)  
300 MHz to 375 MHz clock for high bandwidth  
2-Word burst for reducing address bus frequency  
The CY7C1246V18, CY7C1257V18, CY7C1248V18, and  
CY7C1250V18 are 1.8V Synchronous Pipelined SRAM  
equipped with DDR-II+ architecture. The DDR-II+ consists of an  
SRAM core with advanced synchronous peripheral circuitry.  
Addresses for read and write are latched on alternate rising  
edges of the input (K) clock. Write data is registered on the rising  
edges of both K and K. Read data is driven on the rising edges  
of both K and K. Each address location is associated with two  
8-bit words (CY7C1246V18), 9-bit words (CY7C1257V18),  
18-bit words (CY7C1248V18), or 36-bit words (CY7C1250V18)  
that burst sequentially into or out of the device.  
Double Data Rate (DDR) interfaces  
(data transferred at 750 MHz) at 375 MHz  
Read latency of 2.0 clock cycles  
Two input clocks (K and K) for precise DDR timing  
SRAM uses rising edges only  
Asynchronous inputs include output impedance matching input  
Echo clocks (CQ and CQ) simplify data capture in high speed  
systems  
(ZQ). Synchronous data outputs (Q, which share the same  
physical pins with the data inputs, D) are tightly matched to the  
two output echo clocks CQ/CQ, eliminating the need to capture  
data separately from individual DDR SRAMs in the system  
design.  
Data valid pin (QVLD) to indicate valid data on the output  
Synchronous internally self-timed writes  
Core V = 1.8V ± 0.1V; IO V  
= 1.4V to V  
DD  
DD  
DDQ  
All synchronous inputs pass through input registers controlled by  
the K or K input clocks. All data outputs pass through output  
registers controlled by the K or K input clocks. Writes are  
conducted with on-chip synchronous self-timed write circuitry.  
HSTL inputs and variable drive HSTL output buffers  
Available in 165-ball FBGA package (15 x 17 x 1.4 mm)  
Offered in both in Pb-free and non Pb-free packages  
JTAG 1149.1 compatible test access port  
Delay Lock Loop (DLL) for accurate data placement  
Configurations  
With Read Cycle Latency of 2.0 cycles:  
CY7C1246V18 – 4M x 8  
CY7C1257V18 – 4M x 9  
CY7C1248V18 – 2M x 18  
CY7C1250V18 – 1M x 36  
Selection Guide  
Description  
Maximum Operating Frequency  
Maximum Operating Current  
375 MHz  
375  
333 MHz  
333  
300 MHz  
300  
Unit  
MHz  
mA  
1210  
1080  
1000  
Note  
1. The QDR consortium specification for V  
is 1.5V + 0.1V. The Cypress QDR devices exceed the QDR consortium specification and are capable of supporting  
DDQ  
V
= 1.4V to V  
.
DDQ  
DD  
Cypress Semiconductor Corporation  
Document Number: 001-06348 Rev. *D  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised March 11, 2008  
 
CY7C1246V18, CY7C1257V18  
CY7C1248V18, CY7C1250V18  
Logic Block Diagram (CY7C1248V18)  
Write  
Reg  
Write  
Reg  
20  
A
(19:0)  
Address  
Register  
LD  
18  
K
K
Output  
Logic  
Control  
CLK  
Gen.  
R/W  
DOFF  
Read Data Reg.  
36  
CQ  
CQ  
V
18  
REF  
18  
18  
Reg.  
Reg.  
Reg.  
Control  
Logic  
R/W  
DQ  
[17:0]  
18  
BWS  
18  
[1:0]  
QVLD  
Logic Block Diagram (CY7C1250V18)  
Write  
Reg  
Write  
Reg  
19  
A
(18:0)  
Address  
Register  
LD  
36  
K
K
Output  
Logic  
Control  
CLK  
Gen.  
R/W  
DOFF  
Read Data Reg.  
72  
36  
CQ  
CQ  
V
REF  
36  
36  
Reg.  
Reg.  
Reg.  
Control  
Logic  
R/W  
DQ  
[35:0]  
36  
BWS  
36  
[3:0]  
QVLD  
Document Number: 001-06348 Rev. *D  
Page 3 of 27  
CY7C1246V18, CY7C1257V18  
CY7C1248V18, CY7C1250V18  
Pin Configurations  
165-Ball FBGA (15 x 17 x 1.4 mm) Pinout  
CY7C1246V18 (4M x 8)  
1
2
3
A
4
5
NWS1  
NC/288M  
A
6
K
7
8
9
A
10  
A
11  
CQ  
DQ3  
NC  
NC/72M  
NC/144M  
A
B
C
D
CQ  
NC  
NC  
NC  
NC  
NC  
NC  
R/W  
A
LD  
A
NC  
NC  
NC  
NC  
NC  
NC  
K
NC  
NC  
NC  
NC  
NC  
NC  
NWS0  
A
VSS  
VSS  
A
VSS  
VSS  
VSS  
VSS  
VSS  
NC  
NC  
NC  
DQ4  
NC  
VDDQ  
VDDQ  
VDDQ  
VDDQ  
VDDQ  
VDDQ  
VDDQ  
VSS  
VDD  
VDD  
VDD  
VDD  
VDD  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VDDQ  
VDDQ  
VDDQ  
VDDQ  
VDDQ  
VDDQ  
VDDQ  
NC  
NC  
NC  
NC  
DQ2  
E
F
VDD  
VDD  
VDD  
VDD  
VDD  
VSS  
NC  
NC  
ZQ  
NC  
DQ5  
VDDQ  
NC  
NC  
NC  
G
H
J
VREF  
NC  
VDDQ  
NC  
VREF  
DQ1  
NC  
DOFF  
NC  
NC  
NC  
DQ0  
NC  
NC  
NC  
NC  
NC  
K
L
DQ6  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
VSS  
VSS  
VSS  
A
VSS  
A
VSS  
A
VSS  
VSS  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
M
N
P
DQ7  
A
QVLD  
A
A
A
A
A
A
A
TDO  
TCK  
A
NC  
A
TMS  
TDI  
R
CY7C1257V18 (4M x 9)  
1
2
3
A
4
5
NC  
6
7
8
9
A
10  
A
11  
CQ  
DQ3  
NC  
NC/72M  
NC/144M  
A
B
C
D
CQ  
NC  
NC  
NC  
R/W  
A
K
K
LD  
A
NC  
NC  
NC  
NC  
NC  
NC  
NC/288M  
NC  
NC  
NC  
NC  
NC  
NC  
BWS0  
A
VSS  
VSS  
A
A
VSS  
VSS  
VSS  
VSS  
VSS  
NC  
NC  
NC  
NC  
NC  
NC  
DQ4  
NC  
VDDQ  
VDDQ  
VDDQ  
VDDQ  
VDDQ  
VDDQ  
VDDQ  
VSS  
VDD  
VDD  
VDD  
VDD  
VDD  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VDDQ  
VDDQ  
VDDQ  
VDDQ  
VDDQ  
VDDQ  
VDDQ  
NC  
NC  
NC  
NC  
DQ2  
E
F
VDD  
VDD  
VDD  
VDD  
VDD  
VSS  
NC  
NC  
ZQ  
NC  
DQ5  
VDDQ  
NC  
NC  
NC  
G
H
J
VREF  
NC  
VDDQ  
NC  
VREF  
DQ1  
NC  
DOFF  
NC  
NC  
NC  
DQ0  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
K
L
DQ6  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
VSS  
VSS  
VSS  
A
VSS  
A
VSS  
A
VSS  
VSS  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
M
N
P
DQ7  
A
QVLD  
A
DQ8  
A
A
A
A
A
A
TDO  
TCK  
A
A
TMS  
TDI  
R
NC  
Document Number: 001-06348 Rev. *D  
Page 4 of 27  
CY7C1246V18, CY7C1257V18  
CY7C1248V18, CY7C1250V18  
Pin Configurations (continued)  
165-Ball FBGA (15 x 17 x 1.4 mm) Pinout  
CY7C1248V18 (2M x 18)  
1
2
3
A
4
5
6
7
8
9
A
10  
A
11  
CQ  
DQ8  
NC  
NC/72M  
NC/144M  
A
B
C
D
CQ  
NC  
NC  
NC  
R/W  
A
BWS1  
NC/288M  
A
K
K
LD  
A
DQ9  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
DQ7  
NC  
BWS0  
A
VSS  
VSS  
NC  
VSS  
VSS  
VSS  
NC  
DQ10  
VSS  
VSS  
NC  
NC  
NC  
NC  
NC  
DQ12  
NC  
DQ11  
NC  
VDDQ  
VDDQ  
VDDQ  
VDDQ  
VDDQ  
VDDQ  
VDDQ  
VSS  
VDD  
VDD  
VDD  
VDD  
VDD  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VDDQ  
VDDQ  
VDDQ  
VDDQ  
VDDQ  
VDDQ  
VDDQ  
NC  
NC  
NC  
NC  
DQ6  
E
F
VDD  
VDD  
VDD  
VDD  
VDD  
VSS  
DQ5  
NC  
DQ13  
VDDQ  
NC  
NC  
NC  
G
H
J
VREF  
NC  
VDDQ  
NC  
VREF  
DQ4  
NC  
ZQ  
DOFF  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
DQ14  
NC  
NC  
DQ3  
DQ2  
K
L
DQ15  
NC  
NC  
NC  
NC  
NC  
NC  
VSS  
VSS  
VSS  
A
VSS  
A
VSS  
A
VSS  
VSS  
NC  
NC  
NC  
DQ1  
NC  
NC  
NC  
M
N
P
DQ16  
DQ17  
A
QVLD  
A
NC  
DQ0  
A
A
A
A
A
A
TDO  
TCK  
A
A
TMS  
TDI  
R
NC  
CY7C1250V18 (1M x 36)  
1
2
3
A
4
5
6
7
8
9
A
10  
NC/72M  
11  
CQ  
NC/144M  
A
B
C
D
R/W  
A
BWS2  
BWS3  
A
K
K
LD  
A
CQ  
NC  
BWS1  
BWS0  
A
DQ27  
NC  
DQ18  
DQ28  
DQ19  
NC  
NC  
NC  
NC  
DQ17  
NC  
DQ8  
DQ7  
DQ16  
NC  
NC  
NC  
NC  
NC  
VSS  
VSS  
NC  
VSS  
VSS  
VSS  
DQ29  
VSS  
VSS  
NC  
DQ30  
DQ31  
VREF  
NC  
DQ20  
DQ21  
DQ22  
VDDQ  
DQ32  
DQ23  
DQ24  
VDDQ  
VDDQ  
VDDQ  
VDDQ  
VDDQ  
VDDQ  
VDDQ  
VSS  
VDD  
VDD  
VDD  
VDD  
VDD  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VDDQ  
VDDQ  
VDDQ  
VDDQ  
VDDQ  
VDDQ  
VDDQ  
NC  
NC  
DQ15  
NC  
DQ6  
E
F
VDD  
VDD  
VDD  
VDD  
VDD  
VSS  
DQ5  
DQ14  
ZQ  
NC  
NC  
G
H
J
VDDQ  
NC  
VREF  
DQ13  
DQ12  
NC  
DOFF  
NC  
DQ4  
DQ3  
DQ2  
NC  
NC  
NC  
NC  
K
L
DQ33  
NC  
NC  
NC  
NC  
NC  
DQ35  
NC  
DQ34  
DQ25  
DQ26  
VSS  
VSS  
VSS  
A
VSS  
A
VSS  
A
VSS  
VSS  
NC  
NC  
NC  
DQ11  
NC  
DQ1  
DQ10  
DQ0  
M
N
P
A
QVLD  
A
DQ9  
A
A
A
A
A
A
TDO  
TCK  
A
A
TMS  
TDI  
R
NC  
Document Number: 001-06348 Rev. *D  
Page 5 of 27  
CY7C1246V18, CY7C1257V18  
CY7C1248V18, CY7C1250V18  
Pin Definitions  
Pin Name  
IO  
Pin Description  
Data Input/Output Signals. Inputs are sampled on the rising edge of K and K clocks during  
valid write operations. These pins drive out the requested data during a read operation. Valid  
data is driven out on the rising edge of both the K and K clocks during read operations. When  
DQ  
Input/Output-  
Synchronous  
[x:0]  
read access is deselected, Q  
are automatically tri-stated.  
[x:0]  
CY7C1246V18 DQ  
[7:0]  
CY7C1257V18 DQ  
[8:0]  
CY7C1248V18 DQ  
[17:0]  
CY7C1250V18 DQ  
[35:0]  
LD  
Input-  
Synchronous Load. This input is brought LOW when a bus cycle sequence is to be defined.  
Synchronous This definition includes address and read/write direction. All transactions operate on a burst of  
2 data. LD must meet the setup and hold times around edge of K.  
NWS , NWS Input-  
Nibble Write Select 0, 1, Active LOW (CY7C1246V18 only). Sampled on the rising edge of  
Synchronous the K and K clocks during write operations. Used to select which nibble is written into the device  
during the current portion of the write operations. Nibbles not written remain unaltered.  
0
1
NWS controls D  
and NWS controls D  
.
0
[3:0]  
1
[7:4]  
All the Nibble Write Selects are sampled on the same edge as the data. Deselecting a Nibble  
Write Select ignores the corresponding nibble of data and not written into the device.  
BWS BWS  
Input-  
Byte Write Select 0, 1, 2, and 3, Active LOW. Sampled on the rising edge of the K and K clocks  
,
,
0
1
3
Synchronous during write operations. Used to select which byte is written into the device during the current  
portion of the write operations. Bytes not written remain unaltered.  
CY7C1257V18 BWS controls D  
BWS , BWS  
2
0
[8:0]  
[8:0]  
CY7C1248V18 BWS controls D  
and BWS controls D  
0
1
[17:9].  
, BWS controls D  
CY7C1250V18 BWS controls D  
, BWS controls D  
and BWS  
0
[8:0]  
1
[17:9]  
2
[26:18] 3  
controls D  
.
[35:27]  
All the Byte Write Selects are sampled on the same edge as the data. Deselecting a Byte Write  
Select ignores the corresponding byte of data and not written into the device.  
A
Input-  
Address Inputs. Sampled on the rising edge of the K clock during active read and write opera-  
Synchronous tions. These address inputs are multiplexed for both read and write operations. Internally, the  
device is organized as 4M x 8 (2 arrays each of 2M x 8) for CY7C1246V18, 4M x 9 (2 arrays  
each of 2M x 9) for CY7C1257V18, 2M x 18 (2 arrays each of 1M x 18) for CY7C1248V18, and  
1M x 36 (2 arrays each of 512K x 36) for CY7C1250V18.  
R/W  
Input-  
Synchronous Read/Write Input. When LD is LOW, this input designates the access type (read  
Synchronous when R/W is HIGH, write when R/W is LOW) for loaded address. R/W must meet the setup and  
hold times around edge of K.  
QVLD  
K
Valid output Valid Output Indicator. The Q Valid indicates valid output data. QVLD is edge aligned with CQ  
indicator  
and CQ.  
Input-  
Clock  
Positive Input Clock Input. The rising edge of K is used to capture synchronous inputs to the  
device and to drive out data through Q  
on the rising edge of K.  
when in single clock mode. All accesses are initiated  
[x:0]  
K
Input-  
Clock  
Negative Input Clock Input. K is used to capture synchronous data being presented to the  
device and to drive out data through Q when in single clock mode.  
[x:0]  
CQ  
Clock Output Synchronous Echo Clock Outputs. This is a free running clock and is synchronized to the  
input clock (K) of the DDR-II+. The timing for the echo clocks is shown in “Switching Character-  
CQ  
Synchronous Echo Clock Outputs. This is a free running clock and is synchronized to the  
Clock Output  
Document Number: 001-06348 Rev. *D  
Page 6 of 27  
CY7C1246V18, CY7C1257V18  
CY7C1248V18, CY7C1250V18  
Pin Definitions (continued)  
Pin Name  
ZQ  
IO  
Pin Description  
Input  
Output Impedance Matching Input. This input is used to tune the device outputs to the system  
data bus impedance. CQ, CQ, and Q output impedance are set to 0.2 x RQ, where RQ is a  
[x:0]  
resistor connected between ZQ and ground. Alternatively, this pin can be connected directly to  
V
, which enables the minimum impedance mode. This pin cannot be connected directly to  
DDQ  
GND or left unconnected.  
DOFF  
Input  
DLL Turn Off, Active LOW. Connecting this pin to ground turns off the DLL inside the device.  
The timing in the DLL turned off operation is different from that listed in this data sheet. For  
normal operation, this pin can be connected to a pull up through a 10 Kohm or less pull up  
resistor. The device behaves in DDR-I mode when the DLL is turned off. In this mode, the device  
can be operated at a frequency of up to 167 MHz with DDR-I timing.  
TDO  
Output  
Input  
Input  
Input  
N/A  
TDO for JTAG.  
TCK  
TCK Pin for JTAG.  
TDI  
TDI Pin for JTAG.  
TMS  
TMS Pin for JTAG.  
NC  
Not Connected to the Die. Can be tied to any voltage level.  
Not Connected to the Die. Can be tied to any voltage level.  
Not Connected to the Die. Can be tied to any voltage level.  
Not Connected to the Die. Can be tied to any voltage level.  
Reference Voltage Input. Static input used to set the reference level for HSTL inputs, outputs,  
NC/72M  
NC/144M  
NC/288M  
N/A  
N/A  
N/A  
V
Input-  
REF  
Reference and AC measurement points.  
V
V
V
Power Supply Power Supply Inputs to the Core of the Device.  
DD  
Ground  
Ground for the Device.  
SS  
Power Supply Power Supply Inputs for the Outputs of the Device.  
DDQ  
Document Number: 001-06348 Rev. *D  
Page 7 of 27  
CY7C1246V18, CY7C1257V18  
CY7C1248V18, CY7C1250V18  
When write access is deselected, the device ignores all inputs  
after the pending write operations are completed.  
Functional Overview  
The CY7C1246V18, CY7C1257V18, CY7C1248V18, and  
CY7C1250V18 are synchronous pipelined Burst SRAMs  
equipped with a DDR interface.  
Byte Write Operations  
Byte write operations are supported by the CY7C1248V18. A  
write operation is initiated as described in the Write Operations  
section. The bytes that are written are determined by BWS and  
Accesses for both ports are initiated on the Positive Input Clock  
(K). All synchronous input and output timing refer to the rising  
edge of the input clocks (K and K).  
0
BWS , which are sampled with each set of 18-bit data words.  
1
Asserting the appropriate Byte Write Select input during the data  
portion of a write latches the data being presented and written  
into the device. Deasserting the Byte Write Select input during  
the data portion of a write enables the data stored in the device  
for that byte to remain unaltered. This feature can be used to  
simplify read/modify/write operations to a byte write operation.  
All synchronous data inputs (D  
) pass through input registers  
[x:0]  
controlled by the rising edge of the input clocks (K and K). All  
synchronous data outputs (Q ) pass through output registers  
[x:0]  
controlled by the rising edge of the input clocks (K and K).  
All synchronous control (R/W, LD, BWS ) inputs pass through  
input registers controlled by the rising edge of the input clock  
(K\K).  
[0:X]  
Double Data Rate Operation  
The CY7C1248V18 enables high-performance operation  
through high clock frequencies (achieved through pipelining) and  
DDR mode of operation. The CY7C1248V18 requires two No  
Operation (NOP) cycles when transitioning from a read to a write  
cycle. At higher frequencies, some applications may require a  
third NOP cycle to avoid contention.  
CY7C1248V18 is described in the following sections. The same  
basic descriptions apply to CY7C1246V18, CY7C1257V18, and  
CY7C1250V18.  
Read Operations  
The CY7C1248V18 is organized internally as a single array of  
2M x 18. Accesses are completed in a burst of two sequential  
18-bit data words. Read operations are initiated by asserting  
R/W HIGH and LD LOW at the rising edge of the positive input  
clock (K). Following the next two K clock rising edges, the corre-  
sponding 18-bit word of data from this address location is driven  
If a read occurs after a write cycle, address and data for the write  
are stored in registers. The write information must be stored  
because the SRAM cannot perform the last word write to the  
array without conflicting with the read. The data stays in this  
register until the next write cycle occurs. On the first write cycle  
after the read(s), the stored data from the earlier write is written  
into the SRAM array. This is called a Posted Write.  
onto the Q  
using K as the output timing reference. On the  
[17:0]  
subsequent rising edge of K the next 18-bit data word is driven  
onto the Q . The requested data is valid 0.45 ns from the  
[17:0]  
If a read is performed on the same address on which a write is  
performed in the previous cycle, the SRAM reads out the most  
current data. The SRAM does this by bypassing the memory  
array and reading the data from the registers.  
rising edge of the input clock (K and K). To maintain the internal  
logic, each read access must be allowed to complete. Read  
accesses can be initiated on every rising edge of the positive  
input clock (K).  
Depth Expansion  
When read access is deselected, the CY7C1248V18 completes  
the pending read transactions. Synchronous internal circuitry  
automatically tri-states the outputs following the next rising edge  
of the positive input clock (K). This enables a seamless transition  
between devices without the insertion of wait states in a depth  
expanded memory.  
Depth expansion requires replicating the LD control signal for  
each bank. All other control signals can be common between  
banks as appropriate.  
Programmable Impedance  
An external resistor, RQ, must be connected between the ZQ pin  
Write Operations  
on the SRAM and V to enable the SRAM to adjust its output  
SS  
Write operations are initiated by asserting R/W LOW and LD  
LOW at the rising edge of the positive input clock (K). The  
address presented to Address inputs is stored in the Write  
Address register. On the following K clock rise, the data  
driver impedance. The value of RQ must be 5x the value of the  
intended line impedance driven by the SRAM. The allowable  
range of RQ to guarantee impedance matching with a tolerance  
of ±15%, is between 175Ω and 350Ω, with V  
= 1.5V. The  
DDQ  
presented to D  
is latched and stored into the 18-bit Write  
[17:0]  
output impedance is adjusted every 1024 cycles upon power up  
to account for drifts in supply voltage and temperature.  
Data register, provided BWS  
subsequent rising edge of the Negative Input Clock (K), the infor-  
mation presented to D is also stored into the Write Data  
are both asserted active. On the  
[1:0]  
Echo Clocks  
[17:0]  
register, provided BWS  
are both asserted active. The 36 bits  
[1:0]  
Echo clocks are provided on the DDR-II+ to simplify data capture  
on high speed systems. Two echo clocks are generated by the  
DDR-II+. CQ is referenced with respect to K and CQ is refer-  
enced with respect to K. These are free-running clocks and are  
synchronized to the input clock of the DDR-II+. The timing for the  
echo clocks is shown in “Switching Characteristics” on page 22.  
of data are then written into the memory array at the specified  
location. Write accesses can be initiated on every rising edge of  
the positive input clock (K). Doing so pipelines the data flow such  
that 18 bits of data can be transferred into the device on every  
rising edge of the input clocks (K and K).  
Document Number: 001-06348 Rev. *D  
Page 8 of 27  
 
CY7C1246V18, CY7C1257V18  
CY7C1248V18, CY7C1250V18  
be disabled by applying ground to the DOFF pin. When the DLL  
is turned off, the device behaves in DDR-I mode (with 1.0 cycle  
latency and a longer access time). For more information, refer to  
Valid Data Indicator (QVLD)  
QVLD is provided on the DDR-II+ to simplify data capture on high  
speed systems. The QVLD is generated by the DDR-II+ device  
along with data output. This signal is also edge aligned with the  
echo clock and follows the timing of any data pin. This signal is  
asserted half a cycle before valid data arrives.  
the  
application  
note,  
DLL  
Considerations  
in  
QDRII/DDRII/QDRII+/DDRII+. The DLL can also be reset by  
slowing or stopping the input clocks K and K for a minimum of 30  
ns. However, it is not necessary for the DLL to be reset to lock to  
the desired frequency. During power up, when the DOFF is tied  
HIGH, the DLL gets locked after 2048 cycles of stable clock.  
Delay Lock Loop (DLL)  
These chips use a DLL that is designed to function between 120  
MHz and the specified maximum clock frequency. The DLL may  
Application Example  
Figure 1 shows the use of two DDR-II+ in an application.  
Figure 1. Application Example  
ZQ  
CQ/CQ  
K
K
ZQ  
CQ/CQ  
K
K
SRAM#1  
LD R/W  
SRAM#2  
DQ  
A
DQ  
A
R = 250ohms  
R = 250ohms  
LD R/W  
DQ  
Addresses  
Cycle Start  
R/W  
Source CLK  
Source CLK  
BUS  
MASTER  
(CPU or ASIC)  
Echo Clock1/Echo Clock1  
Echo Clock2/Echo Clock2  
Truth Table  
The truth table for the CY7C1246V18, CY7C1257V18, CY7C1248V18, and CY7C1250V18 follows.  
Operation  
K
LD R/W  
DQ  
DQ  
Write Cycle:  
L-H  
L
L
L
D(A) at K(t + 1) ↑  
D(A + 1) at K(t + 1) ↑  
Load address; wait one cycle; input write data on consecutive  
K and K rising edges.  
Read Cycle: (2.0 cycle Latency)  
Load address; wait two cycle; read data on consecutive K and  
L-H  
H
Q(A) at K(t + 2) ↑  
Q(A + 1) at K(t + 2) ↑  
K rising edges.  
NOP: No Operation  
L-H  
H
X
X
X
High-Z  
High-Z  
Standby: Clock Stopped  
Stopped  
Previous State  
Previous State  
Notes  
2. X = “Don’t Care,” H = Logic HIGH, L = Logic LOW, represents rising edge.  
3. Device powers up deselected with the outputs in a tri-state condition.  
4. “A” represents address location latched by the devices when transaction was initiated. A + 1 represents the address sequence in the burst.  
5. “t” represents the cycle at which a read/write operation is started. t + 1 and t + 2 are the first and second clock cycles succeeding the “t” clock cycle.  
6. Data inputs are registered at K and K rising edges. Data outputs are delivered on K and K rising edges.  
7. Cypress recommends that K = K = HIGH when clock is stopped. This is not essential, but permits most rapid restart by overcoming transmission line charging  
symmetrically.  
Document Number: 001-06348 Rev. *D  
Page 9 of 27  
             
CY7C1246V18, CY7C1257V18  
CY7C1248V18, CY7C1250V18  
Write Cycle Descriptions  
The write cycle descriptions table for CY7C1246V18 and CY7C1248V18 follows.  
BWS / BWS /  
0
1
K
Comments  
K
NWS  
NWS  
1
0
L
L
L
L
L–H  
During the data portion of a write sequence:  
CY7C1246V18 both nibbles (D  
) are written into the device.  
[7:0]  
CY7C1248V18 both bytes (D  
) are written into the device.  
[17:0]  
L–H  
L-H During the data portion of a write sequence:  
CY7C1246V18 both nibbles (D  
) are written into the device.  
) are written into the device.  
[7:0]  
CY7C1248V18 both bytes (D  
[17:0]  
L
H
H
L
During the data portion of a write sequence:  
CY7C1246V18 only the lower nibble (D  
) is written into the device, D  
) is written into the device, D  
remains unaltered.  
remains unaltered.  
[3:0]  
[7:4]  
[17:9]  
CY7C1248V18 only the lower byte (D  
[8:0]  
L
L–H During the data portion of a write sequence:  
CY7C1246V18 only the lower nibble (D  
) is written into the device, D  
remains unaltered.  
remains unaltered.  
[3:0]  
[7:4]  
CY7C1248V18 only the lower byte (D  
) is written into the device, D  
[8:0]  
[17:9]  
H
H
L–H  
During the data portion of a write sequence:  
CY7C1246V18 only the upper nibble (D  
) is written into the device, D  
) is written into the device, D  
remains unaltered.  
remains unaltered.  
[7:4]  
[3:0]  
[8:0]  
CY7C1248V18 only the upper byte (D  
[17:9]  
L
L–H During the data portion of a write sequence:  
CY7C1246V18 only the upper nibble (D  
) is written into the device, D  
) is written into the device, D  
remains unaltered.  
remains unaltered.  
[7:4]  
[3:0]  
[8:0]  
CY7C1248V18 only the upper byte (D  
[17:9]  
H
H
H
H
L–H  
No data is written into the devices during this portion of a write operation.  
L–H No data is written into the devices during this portion of a write operation.  
Write Cycle Descriptions  
The write cycle descriptions table for CY7C1257V18 follows.  
BWS  
K
L-H  
K
Comments  
During the data portion of a write sequence, the single byte (D  
0
L
L
) is written into the device.  
) is written into the device.  
[8:0]  
[8:0]  
L-H During the data portion of a write sequence, the single byte (D  
H
H
L-H  
No data is written into the device during this portion of a write operation.  
L-H No data is written into the device during this portion of a write operation.  
Note  
8. Assumes a write cycle was initiated per the Write Cycle Descriptions table. NWS , NWS , BWS , BWS , BWS , and BWS can be altered on different portions  
0
1
0
1
2
3
of a write cycle, as long as the setup and hold requirements are met.  
Document Number: 001-06348 Rev. *D  
Page 10 of 27  
   
CY7C1246V18, CY7C1257V18  
CY7C1248V18, CY7C1250V18  
Write Cycle Descriptions  
The write cycle descriptions table for CY7C1250V18 follows.  
BWS  
BWS  
BWS  
BWS  
3
K
K
Comments  
0
1
2
L
L
L
L
L-H  
During the data portion of a write sequence, all four bytes (D  
into the device.  
) are written  
) are written  
[35:0]  
L
L
L
H
H
L
L
H
H
H
H
L
L
H
H
H
H
H
H
L
L-H  
L-H During the data portion of a write sequence, all four bytes (D  
into the device.  
[35:0]  
During the data portion of a write sequence, only the lower byte (D  
) is  
) is  
[8:0]  
written into the device. D  
remains unaltered.  
[35:9]  
L
L-H During the data portion of a write sequence, only the lower byte (D  
written into the device. D remains unaltered.  
[8:0]  
[35:9]  
H
H
H
H
H
H
L-H  
During the data portion of a write sequence, only the byte (D  
) is written  
[17:9]  
into the device. D  
and D  
remain unaltered.  
[8:0]  
[35:18]  
L
L-H During the data portion of a write sequence, only the byte (D  
into the device. D and D remain unaltered.  
) is written  
[17:9]  
[8:0]  
[35:18]  
H
H
H
H
L-H  
During the data portion of a write sequence, only the byte (D  
) is written  
) is written  
) is written  
) is written  
[26:18]  
[26:18]  
[35:27]  
[35:27]  
into the device. D  
and D  
remain unaltered.  
[17:0]  
[35:27]  
L
L-H During the data portion of a write sequence, only the byte (D  
into the device. D and D remain unaltered.  
[17:0]  
[35:27]  
H
H
L-H  
During the data portion of a write sequence, only the byte (D  
into the device. D remains unaltered.  
[26:0]  
L
L-H During the data portion of a write sequence, only the byte (D  
into the device. D remains unaltered.  
[26:0]  
H
H
H
H
H
H
H
H
L-H  
No data is written into the device during this portion of a write operation.  
L-H No data is written into the device during this portion of a write operation.  
Document Number: 001-06348 Rev. *D  
Page 11 of 27  
CY7C1246V18, CY7C1257V18  
CY7C1248V18, CY7C1250V18  
Instruction Register  
IEEE 1149.1 Serial Boundary Scan (JTAG)  
Three-bit instructions can be serially loaded into the instruction  
register. This register is loaded when it is placed between the TDI  
page 15. Upon power up, the instruction register is loaded with  
the IDCODE instruction. It is also loaded with the IDCODE  
instruction if the controller is placed in a reset state as described  
in the previous section.  
These SRAMs incorporate a serial boundary scan test access  
port (TAP) in the FBGA package. This part is fully compliant with  
IEEE Standard #1149.1-2001. The TAP operates using JEDEC  
standard 1.8V IO logic levels.  
Disabling the JTAG Feature  
It is possible to operate the SRAM without using the JTAG  
When the TAP controller is in the Capture-IR state, the two least  
significant bits are loaded with a binary ‘01’ pattern to enable fault  
isolation of the board level serial test path.  
feature. To disable the TAP controller, tie TCK LOW (V ) to  
SS  
prevent device clocking. TDI and TMS are internally pulled up  
and may be unconnected. They may alternately be connected to  
V
through a pull up resistor. TDO must be left unconnected.  
Bypass Register  
DD  
Upon power up, the device comes up in a reset state which does  
not interfere with the operation of the device.  
To save time when serially shifting data through registers, it is  
sometimes advantageous to skip certain chips. The bypass  
register is a single-bit register that can be placed between TDI  
and TDO pins. This shifts data through the SRAM with minimal  
delay. The bypass register is set LOW (V ) when the BYPASS  
instruction is executed.  
Test Access Port – Test Clock  
The test clock is used only with the TAP controller. All inputs are  
captured on the rising edge of TCK. All outputs are driven from  
the falling edge of TCK.  
SS  
Boundary Scan Register  
Test Mode Select  
The boundary scan register is connected to all of the input and  
output pins on the SRAM. Several no connect (NC) pins are also  
included in the scan register to reserve pins for higher density  
devices.  
The TMS input is used to give commands to the TAP controller  
and is sampled on the rising edge of TCK. You can leave this pin  
unconnected if the TAP is not used. The pin is pulled up inter-  
nally, resulting in a logic HIGH level.  
The boundary scan register is loaded with the contents of the  
RAM input and output ring when the TAP controller is in the  
Capture-DR state and is then placed between the TDI and TDO  
pins when the controller is moved to the Shift-DR state. The  
EXTEST, SAMPLE/PRELOAD, and SAMPLE Z instructions can  
be used to capture the contents of the input and output ring.  
Test Data-In (TDI)  
The TDI pin is used to serially input information into the registers  
and can be connected to the input of any of the registers. The  
register between TDI and TDO is chosen by the instruction that  
is loaded into the TAP instruction register. For information about  
loading the instruction register, see “TAP Controller State  
Diagram” on page 14. TDI is internally pulled up and can be  
unconnected if the TAP is unused in an application. TDI is  
connected to the most significant bit (MSB) on any register.  
“Boundary Scan Order” on page 18 shows the order in which the  
bits are connected. Each bit corresponds to one of the bumps on  
the SRAM package. The MSB of the register is connected to TDI,  
and the LSB is connected to TDO.  
Identification (ID) Register  
Test Data-Out (TDO)  
The ID register is loaded with a vendor-specific, 32-bit code  
during the Capture-DR state when the IDCODE command is  
loaded in the instruction register. The IDCODE is hardwired into  
the SRAM and can be shifted out when the TAP controller is in  
the Shift-DR state. The ID register has a vendor code and other  
The TDO output pin is used to serially clock data-out from the  
registers. Whether the output is active depends on the current  
state of the TAP state machine (see “Instruction Codes” on  
page 17). The output changes on the falling edge of TCK. TDO  
is connected to the least significant bit (LSB) of any register.  
Performing a TAP Reset  
A reset is performed by forcing TMS HIGH (V ) for five rising  
TAP Instruction Set  
DD  
edges of TCK. This RESET does not affect the operation of the  
SRAM and may be performed while the SRAM is operating. At  
power up, the TAP is reset internally to ensure that TDO comes  
up in a High-Z state.  
Eight different instructions are possible with the three-bit  
instruction register. All combinations are listed in “Instruction  
Codes” on page 17. Three of these instructions are listed as  
RESERVED and must not be used. The other five instructions  
are described in this section in detail.  
TAP Registers  
Instructions are loaded into the TAP controller during the Shift-IR  
state when the instruction register is placed between TDI and  
TDO. During this state, instructions are shifted through the  
instruction register through the TDI and TDO pins. To execute  
the instruction after it is shifted in, the TAP controller must be  
moved into the Update-IR state.  
Registers are connected between the TDI and TDO pins and  
scans data into and out of the SRAM test circuitry. Only one  
register can be selected at a time through the instruction  
registers. Data is serially loaded into the TDI pin on the rising  
edge of TCK. Data is output on the TDO pin on the falling edge  
of TCK.  
Document Number: 001-06348 Rev. *D  
Page 12 of 27  
CY7C1246V18, CY7C1257V18  
CY7C1248V18, CY7C1250V18  
IDCODE  
PRELOAD places an initial data pattern at the latched parallel  
outputs of the boundary scan register cells before the selection  
of another boundary scan test operation.  
The IDCODE instruction loads a vendor-specific, 32-bit code into  
the instruction register. It also places the instruction register  
between the TDI and TDO pins and shifts the IDCODE out of the  
device when the TAP controller enters the Shift-DR state. The  
IDCODE instruction is loaded into the instruction register upon  
power up or whenever the TAP controller is in a Test-Logic-Reset  
state.  
The shifting of data for the SAMPLE and PRELOAD phases can  
occur concurrently when required — that is, while data captured  
is shifted out, the preloaded data can be shifted in.  
BYPASS  
When the BYPASS instruction is loaded in the instruction register  
and the TAP is placed in a Shift-DR state, the bypass register is  
placed between the TDI and TDO pins. The advantage of the  
BYPASS instruction is that it shortens the boundary scan path  
when multiple devices are connected together on a board.  
SAMPLE Z  
The SAMPLE Z instruction connects the boundary scan register  
between the TDI and TDO pins when the TAP controller is in a  
Shift-DR state. The SAMPLE Z command puts the output bus  
into a High-Z state until the next command is issued during the  
Update-IR state.  
EXTEST  
The EXTEST instruction drives the preloaded data out through  
the system output pins. This instruction also connects the  
boundary scan register for serial access between the TDI and  
TDO in the Shift-DR controller state.  
SAMPLE/PRELOAD  
SAMPLE/PRELOAD is a 1149.1 mandatory instruction. When  
the SAMPLE/PRELOAD instructions are loaded into the  
instruction register and the TAP controller is in the Capture-DR  
state, a snapshot of data on the inputs and output pins is  
captured in the boundary scan register.  
EXTEST Output Bus Tri-State  
IEEE Standard 1149.1 mandates that the TAP controller be able  
to put the output bus into a tri-state mode.  
Be aware that the TAP controller clock can only operate at a  
frequency up to 20 MHz, while the SRAM clock operates more  
than an order of magnitude faster. Because there is a large  
difference in the clock frequencies, it is possible that during the  
Capture-DR state, an input or output may undergo a transition.  
The TAP may then try to capture a signal while in transition  
(metastable state). This does not harm the device, but there is  
no guarantee as to the value that is captured. Repeatable results  
may not be possible.  
The boundary scan register has a special bit located at bit #108.  
When this scan cell, called the “extest output bus tri-state,” is  
latched into the preload register during the Update-DR state in  
the TAP controller, it directly controls the state of the output  
(Q-bus) pins, when the EXTEST is entered as the current  
instruction. When HIGH, it enables the output buffers to drive the  
output bus. When LOW, this bit places the output bus into a  
High-Z condition.  
To guarantee that the boundary scan register captures the  
correct value of a signal, the SRAM signal must be stabilized  
long enough to meet the TAP controller's capture setup plus hold  
times (t and t ). The SRAM clock input might not be captured  
correctly if there is no way in a design to stop (or slow) the clock  
during a SAMPLE/PRELOAD instruction. If this is an issue, it is  
still possible to capture all other signals and simply ignore the  
value of the CK and CK captured in the boundary scan register.  
This bit can be set by entering the SAMPLE/PRELOAD or  
EXTEST command, and then shifting the desired bit into that cell,  
during the Shift-DR state. During Update-DR, the value loaded  
into that shift-register cell latches into the preload register. When  
the EXTEST instruction is entered, this bit directly controls the  
output Q-bus pins. Note that this bit is preset HIGH to enable the  
output when the device is powered-up, and also when the TAP  
controller is in the Test-Logic-Reset state.  
CS  
CH  
After the data is captured, it is possible to shift out the data by  
putting the TAP into the Shift-DR state. This places the boundary  
scan register between the TDI and TDO pins.  
Reserved  
These instructions are not implemented but are reserved for  
future use. Do not use these instructions.  
Document Number: 001-06348 Rev. *D  
Page 13 of 27  
CY7C1246V18, CY7C1257V18  
CY7C1248V18, CY7C1250V18  
TAP Controller State Diagram  
The state diagram for the TAP controller follows.  
[9]  
TEST-LOGIC  
1
RESET  
0
1
1
1
TEST-LOGIC/  
IDLE  
SELECT  
DR-SCAN  
SELECT  
IR-SCAN  
0
0
0
1
1
CAPTURE-DR  
CAPTURE-IR  
0
0
SHIFT-DR  
0
SHIFT-IR  
0
1
1
EXIT1-DR  
0
1
EXIT1-IR  
0
1
0
0
PAUSE-DR  
1
PAUSE-IR  
1
0
0
EXIT2-DR  
1
EXIT2-IR  
1
UPDATE-DR  
UPDATE-IR  
1
1
0
0
Note  
9. The 0/1 next to each state represents the value at TMS at the rising edge of TCK.  
Document Number: 001-06348 Rev. *D  
Page 14 of 27  
   
CY7C1246V18, CY7C1257V18  
CY7C1248V18, CY7C1250V18  
TAP Controller Block Diagram  
0
Bypass Register  
Selection  
Circuitry  
Selection  
Circuitry  
2
1
1
0
TDO  
TDI  
Instruction Register  
29  
31 30  
.
.
2
0
0
Identification Register  
.
.
.
.
2
1
108  
Boundary Scan Register  
TCK  
TMS  
TAP Controller  
TAP Electrical Characteristics  
Over the Operating Range  
Parameter  
Description  
Test Conditions  
= 2.0 mA  
Min  
1.4  
1.6  
Max  
Unit  
V
V
V
V
V
V
V
I
Output HIGH Voltage  
Output HIGH Voltage  
Output LOW Voltage  
Output LOW Voltage  
Input HIGH Voltage  
I
I
I
I
OH1  
OH2  
OL1  
OL2  
IH  
OH  
OH  
OL  
OL  
= 100 μA  
= 2.0 mA  
V
0.4  
0.2  
V
= 100 μA  
V
0.65V  
V
+ 0.3  
V
DD  
DD  
Input LOW Voltage  
–0.3  
0.35V  
5
V
IL  
DD  
Input and Output Load Current  
GND V V  
DD  
5  
μA  
X
I
Notes  
10. These characteristics apply to the TAP inputs (TMS, TCK, TDI and TDO). Parallel load levels are specified in “Electrical Characteristics” on page 20.  
11. Overshoot: V (AC) < V + 0.3V (pulse width less than t /2).  
/2). Undershoot: V (AC) > 0.3V (pulse width less than t  
IH  
DDQ  
CYC  
IL  
CYC  
12. All voltage refers to ground.  
Document Number: 001-06348 Rev. *D  
Page 15 of 27  
       
CY7C1246V18, CY7C1257V18  
CY7C1248V18, CY7C1250V18  
TAP AC Switching Characteristics  
Over the Operating Range  
Parameter  
Description  
Min  
Max  
Unit  
ns  
t
t
t
t
TCK Clock Cycle Time  
TCK Clock Frequency  
TCK Clock HIGH  
50  
TCYC  
TF  
20  
MHz  
ns  
20  
20  
TH  
TCK Clock LOW  
ns  
TL  
Setup Times  
t
t
t
TMS Setup to TCK Clock Rise  
TDI Setup to TCK Clock Rise  
Capture Setup to TCK Rise  
5
5
5
ns  
ns  
ns  
TMSS  
TDIS  
CS  
Hold Times  
t
t
t
TMS Hold after TCK Clock Rise  
TDI Hold after Clock Rise  
5
5
5
ns  
ns  
ns  
TMSH  
TDIH  
CH  
Capture Hold after Clock Rise  
Output Times  
t
t
TCK Clock LOW to TDO Valid  
TCK Clock LOW to TDO Invalid  
10  
ns  
ns  
TDOV  
TDOX  
0
TAP Timing and Test Conditions  
Figure 2 shows the TAP timing and test conditions.  
Figure 2. TAP Timing and Test Conditions  
0.9V  
ALL INPUT PULSES  
0.9V  
50Ω  
1.8V  
TDO  
0V  
Z = 50Ω  
0
C = 20 pF  
L
t
t
TL  
TH  
GND  
(a)  
Test Clock  
TCK  
t
TCYC  
t
TMSH  
t
TMSS  
Test Mode Select  
TMS  
t
TDIS  
t
TDIH  
Test Data In  
TDI  
Test Data Out  
TDO  
t
TDOV  
t
TDOX  
Notes  
13. t and t refer to the setup and hold time requirements of latching data from the boundary scan register.  
CS  
CH  
14. Test conditions are specified using the load in TAP AC Test Conditions. t /t = 1 ns.  
R
F
Document Number: 001-06348 Rev. *D  
Page 16 of 27  
     
CY7C1246V18, CY7C1257V18  
CY7C1248V18, CY7C1250V18  
Identification Register Definitions  
Value  
Instruction  
Field  
Description  
CY7C1246V18  
CY7C1257V18  
000  
CY7C1248V18  
CY7C1250V18  
Revision  
000  
000  
000  
Version number.  
Number (31:29)  
Cypress Device 11010111100000111 11010111100001111 11010111100010111 11010111100100111 Defines the type  
ID (28:12)  
of SRAM.  
Cypress JEDEC  
ID (11:1)  
00000110100  
1
00000110100  
1
00000110100  
1
00000110100  
1
Enables unique  
identification of  
SRAM vendor.  
ID Register  
Presence (0)  
Indicates the  
presence of an  
ID register.  
Scan Register Sizes  
Register Name  
Bit Size  
Instruction  
Bypass  
3
1
ID  
32  
109  
Boundary Scan  
Instruction Codes  
Instruction  
EXTEST  
Code  
000  
Description  
Captures the input/output ring contents.  
IDCODE  
001  
Loads the ID register with the vendor ID code and places the register between  
TDI and TDO. This operation does not affect SRAM operation.  
SAMPLE Z  
010  
Captures the input/output contents. Places the boundary scan register between  
TDI and TDO. Forces all SRAM output drivers to a High-Z state.  
RESERVED  
011  
100  
Do Not Use: This instruction is reserved for future use.  
SAMPLE/PRELOAD  
Captures the input/output ring contents. Places the boundary scan register  
between TDI and TDO. Does not affect the SRAM operation.  
RESERVED  
RESERVED  
BYPASS  
101  
110  
111  
Do Not Use: This instruction is reserved for future use.  
Do Not Use: This instruction is reserved for future use.  
Places the bypass register between TDI and TDO. This operation does not affect  
SRAM operation.  
Document Number: 001-06348 Rev. *D  
Page 17 of 27  
   
CY7C1246V18, CY7C1257V18  
CY7C1248V18, CY7C1250V18  
Boundary Scan Order  
Bit #  
0
Bump ID  
6R  
Bit #  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
41  
42  
43  
44  
45  
46  
47  
48  
49  
50  
51  
52  
53  
54  
55  
Bump ID  
10G  
9G  
Bit #  
56  
57  
58  
59  
60  
61  
62  
63  
64  
65  
66  
67  
68  
69  
70  
71  
72  
73  
74  
75  
76  
77  
78  
79  
80  
81  
82  
83  
Bump ID  
6A  
5B  
5A  
4A  
5C  
4B  
3A  
2A  
1A  
2B  
3B  
1C  
1B  
3D  
3C  
1D  
2C  
3E  
2D  
2E  
1E  
2F  
Bit #  
84  
Bump ID  
1J  
1
6P  
85  
2J  
2
6N  
11F  
11G  
9F  
86  
3K  
3
7P  
87  
3J  
4
7N  
88  
2K  
5
7R  
10F  
11E  
10E  
10D  
9E  
89  
1K  
6
8R  
90  
2L  
7
8P  
91  
3L  
8
9R  
92  
1M  
1L  
9
11P  
10P  
10N  
9P  
93  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
10C  
11D  
9C  
94  
3N  
95  
3M  
1N  
96  
10M  
11N  
9M  
9D  
97  
2M  
3P  
11B  
11C  
9B  
98  
99  
2N  
9N  
100  
101  
102  
103  
104  
105  
106  
107  
108  
2P  
11L  
11M  
9L  
10B  
11A  
10A  
9A  
1P  
3R  
4R  
10L  
11K  
10K  
9J  
4P  
8B  
5P  
7C  
3F  
5N  
6C  
1G  
1F  
5R  
9K  
8A  
Internal  
10J  
11J  
11H  
7A  
3G  
2G  
1H  
7B  
6B  
Document Number: 001-06348 Rev. *D  
Page 18 of 27  
 
CY7C1246V18, CY7C1257V18  
CY7C1248V18, CY7C1250V18  
DLL Constraints  
Power Up Sequence in DDR-II+ SRAM  
DDR-II+ SRAMs must be powered up and initialized in a  
predefined manner to prevent undefined operations. During  
power up, when the DOFF is tied HIGH, the DLL is locked after  
2048 cycles of stable clock.  
DLL uses K clock as its synchronizing input. The input must  
have low phase jitter, which is specified as t  
.
KC Var  
The DLL functions at frequencies down to 120 MHz.  
If the input clock is unstable and the DLL is enabled, then the  
DLL may lock onto an incorrect frequency, causing unstable  
SRAM behavior. Toavoid this, provide 2048 cycles stable clock  
to relock to the desired clock frequency.  
Power Up Sequence  
ApplypowerwithDOFFtiedHIGH(allotherinputscanbeHIGH  
or LOW)  
Apply V before V  
DD  
DDQ  
Apply V  
before V  
or at the same time as V  
DDQ  
REF REF  
Provide stable power and clock (K, K) for 2048 cycles to lock  
the DLL  
Power Up Waveforms  
Figure 3. Power Up Waveforms  
K
K
Start Normal  
Operation  
Unstable Clock  
> 2048 Stable Clock  
Clock Start (Clock Starts after V /V  
DD DDQ  
is Stable)  
V
/V  
+
V
/V Stable (< 0.1V DC per 50 ns)  
DD DDQ  
DD DDQ  
Fix HIGH (tie to V  
DDQ  
)
DOFF  
Document Number: 001-06348 Rev. *D  
Page 19 of 27  
CY7C1246V18, CY7C1257V18  
CY7C1248V18, CY7C1250V18  
Current into Outputs (LOW)......................................... 20 mA  
Static Discharge Voltage (MIL-STD-883, M 3015).... >2001V  
Latch up Current..................................................... >200 mA  
Maximum Ratings  
Exceeding maximum ratings may impair the useful life of the  
device. These user guidelines are not tested.  
Storage Temperature ................................ –65°C to + 150°C  
Ambient Temperature with Power Applied. –55°C to + 125°C  
Operating Range  
Ambient  
DD  
V
DDQ  
Range  
Com’l  
Ind’l  
Temperature  
0°C to +70°C  
–40°C to +85°C  
V
Supply Voltage on V Relative to GND .......–0.5V to + 2.9V  
DD  
1.8 ± 0.1V  
1.4V to V  
DD  
Supply Voltage on V  
Relative to GND..... –0.5V to + V  
DD  
DDQ  
DC Applied to Outputs in High-Z .........0.5V to V  
+ 0.3V  
DDQ  
DC Input Voltage ............................... –0.5V to V + 0.3V  
DD  
Electrical Characteristics  
Over the Operating Range  
DC Electrical Characteristics  
Parameter  
Description  
Power Supply Voltage  
IO Supply Voltage  
Test Conditions  
Min  
1.7  
1.4  
Typ  
Max  
Unit  
V
1.8  
1.5  
1.9  
V
V
V
V
V
V
V
V
DD  
V
V
V
V
V
V
V
I
V
DD  
DDQ  
OH  
Output HIGH Voltage  
Output LOW Voltage  
Output HIGH Voltage  
Output LOW Voltage  
Input HIGH Voltage  
Input LOW Voltage  
V
V
/2 – 0.12  
V
V
/2 + 0.12  
/2 + 0.12  
DDQ  
DDQ  
DDQ  
/2 – 0.12  
OL  
DDQ  
I
I
= –0.1 mA, Nominal Impedance  
= 0.1 mA, Nominal Impedance  
V
– 0.2  
V
DDQ  
OH(LOW)  
OL(LOW)  
IH  
OH  
OL  
DDQ  
V
0.2  
SS  
V
+ 0.1  
V
+ 0.15  
REF  
DDQ  
–0.15  
V
– 0.1  
IL  
REF  
Input Leakage Current  
Output Leakage Current  
Input Reference Voltage  
GND V V  
–2  
–2  
2
μA  
μA  
V
X
I
DDQ  
I
GND V V  
Output Disabled  
2
OZ  
I
DDQ,  
V
Typical Value = 0.75V  
0.68  
0.75  
0.95  
1000  
1080  
1210  
290  
REF  
I
V
Operating Supply  
V
= Max., I  
= 0 mA, 300 MHz  
333 MHz  
mA  
mA  
mA  
mA  
mA  
mA  
DD  
DD  
DD  
OUT  
CYC  
f = f  
= 1/t  
MAX  
375 MHz  
I
Automatic Power Down  
Current  
Max. V  
,
300 MHz  
SB1  
DD  
Both Ports Deselected,  
333 MHz  
375 MHz  
300  
V
V or V V  
IN  
IH  
IN  
IL  
f = f  
= 1/t  
,
320  
MAX  
CYC  
Inputs Static  
AC Input Requirements  
Over the Operating Range  
Parameter Description  
Test Conditions  
Min  
Typ.  
Max  
Unit  
V
V
Input HIGH Voltage  
Input LOW Voltage  
V
+ 0.2  
V
+ 0.24  
DDQ  
IH  
REF  
V
–0.24  
V
– 0.2  
V
IL  
REF  
Notes  
15. Power up: assumes a linear ramp from 0V to V (min) within 200 ms. During this time V < V and V  
< V .  
DD  
DD  
IH  
DD  
DDQ  
16. Outputs are impedance controlled. I = –(V  
/2)/(RQ/5) for values of 175Ω < RQ < 350Ω.  
OH  
DDQ  
17. Outputs are impedance controlled. I = (V  
/2)/(RQ/5) for values of 175Ω < RQ < 350Ω.  
OL  
DDQ  
18. V  
(min) = 0.68V or 0.46V  
, whichever is larger. V  
(max) = 0.95V or 0.54V  
, whichever is smaller.  
DDQ  
REF  
DDQ  
REF  
19. The operation current is calculated with 50% read cycle and 50% write cycle.  
Document Number: 001-06348 Rev. *D  
Page 20 of 27  
           
CY7C1246V18, CY7C1257V18  
CY7C1248V18, CY7C1250V18  
\
Capacitance  
Tested initially and after any design or process change that may affect these parameters.  
Parameter  
Description  
Input Capacitance  
Test Conditions  
T = 25°C, f = 1 MHz,  
Max  
Unit  
pF  
C
5
4
5
IN  
A
V
= 1.8V  
DD  
V
C
C
Clock Input Capacitance  
Output Capacitance  
pF  
CLK  
O
= 1.5V  
DDQ  
pF  
Thermal Resistance  
Tested initially and after any design or process change that may affect these parameters.  
165 FBGA  
Package  
Parameter  
Description  
Test Conditions  
Unit  
Θ
Thermal Resistance  
(Junction to Ambient)  
Test conditions follow standard test methods and  
procedures for measuring thermal impedance, per  
EIA/JESD51.  
16.25  
°C/W  
JA  
Θ
Thermal Resistance  
(Junction to Case)  
2.91  
°C/W  
JC  
AC Test Loads and Waveforms  
Figure 4. AC Test Loads and Waveforms  
VREF = 0.75V  
0.75V  
VREF  
VREF  
0.75V  
R = 50Ω  
OUTPUT  
[20]  
ALL INPUT PULSES  
1.25V  
Z = 50Ω  
0
OUTPUT  
Device  
Under  
Test  
R = 50Ω  
L
0.75V  
Device  
Under  
0.25V  
5 pF  
VREF = 0.75V  
Slew Rate = 2 V/ns  
ZQ  
Test  
ZQ  
RQ =  
RQ =  
250Ω  
250Ω  
INCLUDING  
JIG AND  
SCOPE  
(a)  
(b)  
Note  
20. Unless otherwise noted, test conditions assume signal transition time of 2V/ns, timing reference levels of 0.75V, V  
= 0.75V, RQ = 250Ω, V  
= 1.5V, input  
REF  
DDQ  
pulse levels of 0.25V to 1.25V, and output loading of the specified I /I and load capacitance shown in (a) of AC Test Loads and Waveforms.  
OL OH  
Document Number: 001-06348 Rev. *D  
Page 21 of 27  
   
CY7C1246V18, CY7C1257V18  
CY7C1248V18, CY7C1250V18  
Switching Characteristics  
Over the Operating Range  
375 MHz  
333 MHz  
300 MHz  
Cypress Consortium  
Parameter Parameter  
Description  
Unit  
Min Max Min Max Min Max  
t
t
t
t
t
V
(Typical) to the first Access  
1
1
1
ms  
ns  
POWER  
CYC  
KH  
DD  
t
t
t
t
K Clock Cycle Time  
2.66 8.4 3.0 8.4 3.3 8.4  
KHKH  
KHKL  
KLKH  
KHKH  
Input Clock (K/K) HIGH  
Input Clock (K/K) LOW  
0.4  
0.4  
0.4  
0.4  
0.4  
0.4  
t
t
CYC  
KL  
CYC  
K Clock Rise to K Clock Rise (rising edge to rising edge) 1.13  
1.28  
1.40  
ns  
KHKH  
Setup Times  
t
t
t
t
t
t
Address Setup to K Clock Rise  
0.4  
0.4  
0.4  
0.4  
0.4  
0.4  
ns  
ns  
ns  
SA  
AVKH  
IVKH  
IVKH  
Control Setup to K Clock Rise (LD, R/W)  
SC  
Double Data Rate Control Setup to Clock (K, K) Rise  
0.28  
0.28  
0.28  
SCDDR  
(BWS , BWS , BWS , BWS )  
0
1
2
3
t
t
D Setup to Clock (K/K) Rise  
[X:0]  
0.28  
0.28  
0.28  
ns  
SD  
DVKH  
Hold Times  
t
t
t
t
t
t
0.4  
0.4  
0.4  
0.4  
0.4  
0.4  
ns  
ns  
ns  
Address Hold after K Clock Rise  
HA  
KHAX  
KHIX  
KHIX  
Control Hold after K Clock Rise (LD, R/W)  
HC  
Double Data Rate Control Hold after Clock (K/K) Rise  
0.28  
0.28  
0.28  
HCDDR  
(BWS , BWS , BWS , BWS )  
0
1
2
3
t
t
D Hold after Clock (K/K) Rise  
[X:0]  
0.28  
0.28  
0.28  
ns  
HD  
KHDX  
Output Times  
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
K/K Clock Rise to Data Valid  
0.45  
–0.45  
0.45  
–0.45  
0.45  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
CO  
CHQV  
Data Output Hold after K/K Clock Rise (Active to Active) –0.45  
DOH  
CHQX  
0.45  
0.45  
0.45  
K/K Clock Rise to Echo Clock Valid  
Echo Clock Hold after K/K Clock Rise  
Echo Clock High to Data Valid  
CCQO  
CQOH  
CQD  
CHCQV  
CHCQX  
CQHQV  
CQHQX  
CQHCQL  
CQHCQH  
–0.45  
–0.45  
–0.45  
0.2  
0.2  
0.2  
Echo Clock High to Data Invalid  
–0.2  
0.88  
0.88  
–0.2  
1.03  
1.03  
–0.2  
1.15  
1.15  
CQDOH  
CQH  
Output Clock (CQ/CQ) HIGH  
CQ Clock Rise to CQ Clock Rise  
CQHCQH  
(rising edge to rising edge)  
t
t
t
t
t
t
Clock (K/K) Rise to High-Z (Active to High-Z)  
0.45  
0.45  
0.45  
ns  
ns  
ns  
CHZ  
CLZ  
CHQZ  
Clock (K/K) Rise to Low-Z  
–0.45  
–0.45  
–0.45  
CHQX1  
CQHQVLD  
Echo Clock High to QVLD Valid  
–0.20 0.20 –0.20 0.20 –0.20 0.20  
QVLD  
DLL Timing  
t
t
t
t
t
t
Clock Phase Jitter  
DLL Lock Time (K)  
0.20  
0.20  
0.20  
ns  
KC Var  
KC Var  
2048  
30  
2048  
30  
2048  
30  
Cycles  
ns  
KC lock  
KC Reset  
KC lock  
KC Reset  
K Static to DLL Reset  
Notes  
21. When a part with a maximum frequency above 300 MHz is operating at a lower clock frequency, it requires the input timing of the frequency range in which it is  
being operated and outputs data with the output timing of that frequency range.  
22. This part has an internal voltage regulator; t  
be initiated.  
is the time that the power must be supplied above V minimum initially before a read or write operation can  
DD  
POWER  
23. These parameters are extrapolated from the input timing parameters (t  
- 250 ps, where 250 ps is the internal jitter. An input jitter of 200 ps (t  
) is already  
KHKH  
KC Var  
included in the t  
). These parameters are only guaranteed by design and are not tested in production.  
KHKH  
24. t  
, t  
, are specified with a load capacitance of 5 pF as in (b) of “AC Test Loads and Waveforms” on page 21. Transition is measured ±100 mV from steady-state  
CHZ CLZ  
voltage.  
25. At any voltage and temperature t  
is less than t  
and t  
less than t  
.
CHZ  
CLZ  
CHZ  
CO  
26. t  
spec is applicable for both rising and falling edges of QVLD signal.  
QVLD  
27. Hold to >V or <V .  
IH  
IL  
Document Number: 001-06348 Rev. *D  
Page 22 of 27  
               
CY7C1246V18, CY7C1257V18  
CY7C1248V18, CY7C1250V18  
Switching Waveforms  
Read/Write/Deselect Sequence[28, 29, 30]  
Figure 5. Waveform for 2.0 Cycle Read Latency  
WRITE  
7
READ  
9
NOP  
11  
NOP  
1
READ  
2
READ  
3
NOP  
4
NOP  
5
NOP  
6
WRITE  
8
NOP  
10  
12  
K
t
t
t
t
KH  
KL  
CYC  
KHKH  
K
LD  
t
t
HC  
SC  
R/W  
A
A1  
A2  
A3  
A4  
A0  
t
QVLD  
t
t
t
SA HA  
QVLD  
t
QVLD  
QVLD  
t
t
HD  
HD  
SD  
t
SD  
D21 D30 D31  
t
Q00 Q01 Q10 Q11  
D20  
Q40 Q41  
DQ  
t
t
t
CHZ  
CLZ  
DOH  
t
t
CO  
CQD  
(Read Latency = 2.0 Cycles)  
t
t
CQDOH  
t
CCQO  
t
CQOH  
CQ  
CQ  
t
t
CQH  
CQHCQH  
CCQO  
t
CQOH  
DON’T CARE  
UNDEFINED  
Notes  
28. Q00 refers to output from address A0. Q01 refers to output from the next internal burst address following A0, that is, A0 + 1.  
29. Outputs are disabled (High-Z) one clock cycle after a NOP.  
30. The third NOP cycle between read to write transition is not necessary for correct device operation when Read Latency = 2.0 cycles; however at high frequency  
operation, it may be required to avoid bus contention.  
Document Number: 001-06348 Rev. *D  
Page 23 of 27  
     
CY7C1246V18, CY7C1257V18  
CY7C1248V18, CY7C1250V18  
Ordering Information  
Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or visit  
www.cypress.com for actual products offered.  
Speed  
(MHz)  
Package  
Diagram  
Operating  
Range  
Ordering Code  
Package Type  
375 CY7C1246V18-375BZC  
CY7C1257V18-375BZC  
CY7C1248V18-375BZC  
CY7C1250V18-375BZC  
CY7C1246V18-375BZXC  
CY7C1257V18-375BZXC  
CY7C1248V18-375BZXC  
CY7C1250V18-375BZXC  
CY7C1246V18-375BZI  
CY7C1257V18-375BZI  
CY7C1248V18-375BZI  
CY7C1250V18-375BZI  
CY7C1246V18-375BZXI  
CY7C1257V18-375BZXI  
CY7C1248V18-375BZXI  
CY7C1250V18-375BZXI  
333 CY7C1246V18-333BZC  
CY7C1257V18-333BZC  
CY7C1248V18-333BZC  
CY7C1250V18-333BZC  
CY7C1246V18-333BZXC  
CY7C1257V18-333BZXC  
CY7C1248V18-333BZXC  
CY7C1250V18-333BZXC  
CY7C1246V18-333BZI  
CY7C1257V18-333BZI  
CY7C1248V18-333BZI  
CY7C1250V18-333BZI  
CY7C1246V18-333BZXI  
CY7C1257V18-333BZXI  
CY7C1248V18-333BZXI  
CY7C1250V18-333BZXI  
51-85195 165-ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm)  
51-85195 165-ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm) Pb-Free  
51-85195 165-ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm)  
51-85195 165-ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm) Pb-Free  
51-85195 165-ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm)  
51-85195 165-ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm) Pb-Free  
51-85195 165-ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm)  
51-85195 165-ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm) Pb-Free  
Commercial  
Industrial  
Commercial  
Industrial  
Document Number: 001-06348 Rev. *D  
Page 24 of 27  
CY7C1246V18, CY7C1257V18  
CY7C1248V18, CY7C1250V18  
Ordering Information (continued)  
Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or visit  
www.cypress.com for actual products offered.  
Speed  
(MHz)  
Package  
Diagram  
Operating  
Range  
Ordering Code  
Package Type  
300 CY7C1246V18-300BZC  
CY7C1257V18-300BZC  
CY7C1248V18-300BZC  
CY7C1250V18-300BZC  
CY7C1246V18-300BZXC  
CY7C1257V18-300BZXC  
CY7C1248V18-300BZXC  
CY7C1250V18-300BZXC  
CY7C1246V18-300BZI  
CY7C1257V18-300BZI  
CY7C1248V18-300BZI  
CY7C1250V18-300BZI  
CY7C1246V18-300BZXI  
CY7C1257V18-300BZXI  
CY7C1248V18-300BZXI  
CY7C1250V18-300BZXI  
51-85195 165-ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm)  
51-85195 165-ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm) Pb-Free  
51-85195 165-ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm)  
51-85195 165-ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm) Pb-Free  
Commercial  
Industrial  
Document Number: 001-06348 Rev. *D  
Page 25 of 27  
CY7C1246V18, CY7C1257V18  
CY7C1248V18, CY7C1250V18  
Package Diagram  
Figure 6. 165-ball FBGA (15 x 17 x 1.40 mm), 51-85195  
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51-85195-*A  
Document Number: 001-06348 Rev. *D  
Page 26 of 27  
CY7C1246V18, CY7C1257V18  
CY7C1248V18, CY7C1250V18  
Document History Page  
Document Title: CY7C1246V18/CY7C1257V18/CY7C1248V18/CY7C1250V18, 36-Mbit DDR-II+ SRAM 2-Word Burst Ar-  
chitecture (2.0 Cycle Read Latency)  
Document Number: 001-06348  
Orig. of  
Change  
REV.  
ECN No.  
Issue Date  
Description of Change  
**  
425689  
461639  
See ECN  
See ECN  
NXR  
New Data Sheet  
*A  
NXR  
Revised the MPNs from  
CY7C1257AV18 to CY7C1257V18  
CY7C1248AV18 to CY7C1248V18  
CY7C1250AV18 to CY7C1250V18  
Changed t and t from 40 ns to 20 ns, changed t  
, t  
, t , t  
,
TH  
TL  
TMSS TDIS CS TMSH  
t
, t from 10 ns to 5 ns and changed t  
from 20 ns to 10 ns in TAP  
TDIH CH  
TDOV  
AC Switching Characteristics table  
Modified Power-Up waveform  
*B  
497628  
See ECN  
NXR  
Changed the V  
operating voltage to 1.4V to V in the Features section,  
DDQ DD  
in Operating Range table and in the DC Electrical Characteristics table  
Added foot note in page# 1  
Changed the Maximum rating of Ambient Temperature with Power Applied  
from –10°C to +85°C to –55°C to +125°C  
Changed V  
(Max.) spec from 0.85V to 0.95V in the DC Electrical  
REF  
Characteristics table and in the note below the table  
Updated foot note #17 to specify Overshoot and Undershoot Spec  
Updated Θ and Θ values  
JA  
JC  
Removed x9 part and its related information  
Updated footnote #24  
*C  
1093183  
See ECN  
VKN  
Converted from preliminary to final  
Added x8 and x9 parts  
Updated logic block diagram for x18 and x36 parts  
Changed I values from 925 mA to 1210 mA for 375 MHz, 800 mA to 1080  
DD  
mA for 333 MHz, 725 mA to 1000 mA for 300 MHz  
Changed I values from 290 mA to 320 mA for 375 MHz, 270 mA to 300  
SB  
mA for 333 MHz, 250 mA to 290 mA for 300 MHz  
Changed Θ value from 12.43 °C/W to 16.25 °C/W  
JA  
Changed t  
max spec to 8.4 ns for all speed bins  
CYC  
Updated Ordering Information table  
*D  
2198506  
See ECN VKN/AESA Added footnote# 19 related to I  
DD  
© Cypress Semiconductor Corporation, 2006-2008. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of  
any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for  
medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as  
critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems  
application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.  
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),  
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,  
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress  
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without  
the express written permission of Cypress.  
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES  
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not  
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where  
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer  
assumes all risk of such use and in doing so indemnifies Cypress against all charges.  
Use may be limited by and subject to the applicable Cypress software license agreement.  
Document Number: 001-06348 Rev. *D  
Revised March 11, 2008  
Page 27 of 27  
All product and company names mentioned in this document are the trademarks of their respective holders.  

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