IBM C1C 112 35 inch Small FF 38 pin Unitized User Manual

OEM FUNCTIONAL SPECIFICATION  
ULTRASTAR XP (DFHC) SSA MODELS  
1.12/2.25 GB - 1.0" HIGH  
4.51 GB - 1.6" HIGH  
3.5 FORM FACTOR DISK DRIVE  
VERSION 5.0  
August 15, 1995  
Publication number 3304  
IBM Corporation  
Source filename=STSSHEXT  
IBM Corporation  
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OEM FUNCTIONAL SPECIFICATION ULTRASTAR XP (DFHC) SSA MODELS 1.12/2.25 GB - 1.0" HIGH  
Preface  
This document details the product hardware specification for the Ultrastar XP SSA family of Direct Access  
Storage Devices. The capacity model offerings are 1.12, 2.25, and 4.51 GBytes (see 2.1.1, “Capacity  
Equations” on page 13 for exact capacities based on model and block size). The form factor offerings are  
'Brick On Sled' carrier and 3.5-inch small form factor (refer to 4.1.1, “Weight and Dimensions” on page 51  
for exact dimensions).  
This document, in conjunction with the Ultrastar XP (DFHC) SSA Models Interface Specification, make  
up the Functional Specification for the Ultrastar XP SSA (DFHC) product.  
The product description and other data found in this document represent IBM's design objectives and is  
provided for information and comparative purposes. Actual results may vary based on a variety of factors  
and the information herein is subject to change. THIS PRODUCT DATA DOES NOT CONSTITUTE A  
WARRANTY, EXPRESS OR IMPLIED. Questions regarding IBM's warranty terms or the methodology  
used to derive the data should be referred to your IBM customer representative.  
Note: Not all models described in this document are in plan. Contact your IBM customer representative  
for actual product plans.  
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OEM FUNCTIONAL SPECIFICATION ULTRASTAR XP (DFHC) SSA MODELS 1.12/2.25 GB - 1.0" HIGH  
Contents  
1.0 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
1.1.1 General Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
9
9
9
9
9
1.1.2 Performance Summary  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
1.1.3 Interface Controller Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
1.1.4 Reliability Features  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
1.2 Models  
2.0 Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
2.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
2.1.1 Capacity Equations  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
2.2 Power Requirements by Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
2.2.1 C1x Models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
2.2.2 C2x Models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21  
2.2.3 C4x Models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27  
2.2.4 CxB Models  
2.2.5 Power Supply Ripple  
2.2.6 Grounding Requirements of the Disk Enclosure . . . . . . . . . . . . . . . . . . . . . . . . . . . 34  
2.2.7 Hot plug/unplug support  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34  
2.2.8 Bring-up Sequence (and Stop) Times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36  
3.0 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39  
3.1 Environment Definition  
3.2 Workload Definition  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39  
3.2.1 Sequential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40  
3.2.2 Random . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40  
3.3 Command Execution Time  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40  
3.3.1 Basic Component Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42  
3.3.2 Comments  
3.4 Approximating Performance for Different Environments . . . . . . . . . . . . . . . . . . . . . . . . . 43  
3.4.1 For Different Transfer Sizes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44  
3.4.2 When Read Caching is Enabled  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44  
3.4.3 When Write Caching is Enabled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44  
3.4.4 When Adaptive Caching is Enabled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44  
3.4.5 When Read-ahead is Enabled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44  
3.4.6 When No Seek is Required . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45  
3.4.7 For Queued Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45  
3.4.8 Out of Order Transfers  
3.5 Skew  
3.5.1 Cylinder to Cylinder Skew  
3.5.2 Track to Track Skew  
3.6 Idle Time Functions  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47  
3.6.1 Servo Run Out Measurements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48  
3.6.2 Servo Bias Measurements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48  
3.6.3 Predictive Failure Analysis  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48  
3.6.4 Channel Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48  
3.6.5 Save Logs and Pointers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49  
3.6.6 Disk Sweep . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49  
3.6.7 Summary  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49  
3.7 Command Timeout Limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49  
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4.0 Mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51  
4.1 Small Form Factor Models (CxC)  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51  
4.1.1 Weight and Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51  
4.1.2 Clearances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51  
4.1.3 Mounting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51  
4.1.4 Unitized Connector Locations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55  
4.2 Carrier Models (CxB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57  
4.2.1 Weight and Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57  
4.2.2 Clearances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57  
4.2.3 Mounting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57  
4.2.4 Auto-docking Assembly Side Rails  
4.2.5 Electrical Connector and Indicator Locations  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . 62  
5.0 Electrical Interface  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63  
5.1 SSA Unitized Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63  
5.2 Carrier Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64  
5.3 SSA Link Cable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66  
5.4 SSA Link Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66  
5.5 Option Pins and Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66  
5.5.1 - Manufacturing Test Mode (Option Port Pin 1)  
. . . . . . . . . . . . . . . . . . . . . . . . . . 66  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66  
5.5.2 - Auto Start Pin (Option Port Pin 2)  
5.5.3 - Sync Pin (Option Port Pin 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66  
5.5.4 - Write Protect (Option Port Pin 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67  
5.5.5 - Ground long (Option Port Pin 5)  
5.5.6 - Device Activity Pin/Indicator (Option Port Pin 6) . . . . . . . . . . . . . . . . . . . . . . . . . 67  
5.5.7 + 5V (Option Port Pin 7)  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67  
5.5.8 - Device Fault Pin/Indicator (Option Port Pin 8) . . . . . . . . . . . . . . . . . . . . . . . . . . 67  
5.5.9 Programmable pin 1 (Option Port Pin 9) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68  
5.5.10 Programmable pin 2 (Option Port Pin 10)  
5.5.11 - Early Power Off Warning or Power Fail (Power Port Pin 11)  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68  
. . . . . . . . . . . . . . . . . 68  
5.5.12 12V Charge and 5V Charge (Power Port pin 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . 68  
5.6 Front Jumper Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68  
5.7 Spindle Synchronization  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69  
5.7.1 Synchronization overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69  
5.7.2 Synchronization Mode  
5.7.3 Synchronization time  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69  
5.7.4 Synchronization with Offset  
5.7.5 Synchronization Route  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69  
6.0 Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73  
6.1 Error Detection  
6.2 Data Reliability  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73  
6.3 Seek Error Rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73  
6.4 Power On Hours Examples: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73  
6.5 Power on/off cycles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74  
6.6 Useful Life . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74  
6.7 *Mean Time Between Failure (*MTBF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75  
6.7.1 Sample Failure Rate Projections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75  
6.8 SPQL (Shipped product quality level)  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75  
6.9 Install Defect Free . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75  
6.10 Periodic Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76  
6.11 ESD Protection  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76  
6.12 Connector Insertion Cycles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76  
7.0 Operating Limits  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77  
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7.1 Environmental . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77  
7.1.1 Temperature Measurement Points . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77  
7.2 Vibration and Shock  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79  
7.2.1 Drive Mounting Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80  
7.2.2 Output Vibration Limits  
7.2.3 Operating Vibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80  
7.2.4 Operating Shock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82  
7.2.5 Nonoperating Shock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82  
7.3 Contaminants  
7.4 Acoustic Levels  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83  
8.0 Standards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85  
8.1 Safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85  
8.2 Electromagnetic Compatibility (EMC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85  
Bibliography . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87  
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1.0 Description  
1.1 Features  
1.1.1 General Features  
1.12/2.25/4.51 gigabytes formatted capacity (512 bytes/sector)  
Serial Storage Architecture (SSA) attachment (dual port)  
Brick On Sled carrier and 3.5" small form factor models  
Rotary voice coil motor actuator  
Closed-loop digital actuator servo (embedded sector servo)  
Magnetoresistive (MR) heads  
(0,8,6,infinity) 8/9 rate encoding  
Partial Response Maximum Likelihood (PRML) data channel with digital filter  
All mounting orientations supported  
Jumperable auto spindle motor start  
Jumperable write protection  
Spindle synchronization  
Two LED drivers  
Bezel (optional)  
1.1.2 Performance Summary  
Average read seek time (1.12 GB): 6.9 milliseconds  
Average read seek time (2.25 GB): 7.5 milliseconds  
Average read seek time (4.51GB): 8.0 milliseconds  
Average Latency: 4.17 milliseconds  
Split read/write control  
Media data transfer rate: 9.59 to 12.58 MegaBytes/second (10 bands)  
SSA data transfer rate: 20 Megabytes/second  
1.1.3 Interface Controller Features  
Multiple initiator support  
Supports blocksizes from 256 to 5952 bytes  
512K byte, multi-segmented, dual port data buffer  
Read-ahead caching  
Adaptive caching algorithms  
Write Cache supported (write back & write thru)  
Tagged command queuing  
Command reordering  
Back-to-back writes (merged writes)  
Split reads and writes  
Nearly contiguous read/write  
Link error recovery procedure exit  
Disable registration  
Duplicate tags  
Two byte ULP message codes  
SCSI response  
Move data transfer messages  
Multiple ULP's  
Automatic retry and data correction on read errors  
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Automatic sector reallocation  
In-line alternate sector assignment for high-performance  
Improved technique for down-loadable SSA firmware  
1.1.4 Reliability Features  
Self-diagnostics on power up  
Dedicated head landing zone  
Automatic actuator latch  
Embedded Sector Servo for improving on-track positioning capability  
Buffer memory parity  
Longitudinal Redundancy Check (LRC) on Customer Data  
ECC on the fly  
Error logging and analysis  
Data Recovery Procedures (DRP)  
Predictive Failure Analysis  
(PFA &tm)  
No preventative maintenance required  
Two Field Replaceable Units (FRU's): Electronics Card and Head Disk Assembly (HDA)  
Probability of not recovering data: 10 in 1015 bits read  
1.2 Models  
The Ultrastar XP SSA disk drive is available in various models as shown below.  
The Ultrastar XP SSA data storage capacities vary as a function of model and user block size. The  
emerging industry trend is capacity points in multiples of 1.08GB (i.e. 1.08/2.16/4.32) at a block size of 512  
bytes. Future IBM products will plan to provide capacities that are consistent with this trend. Users that  
choose to make full use of the Ultrastar XP SSA drive capacity above the standard capacity points may not  
find equivalent capacity breakpoints in future products.  
128-pin HPC  
1.12  
1.12  
2.25  
2.25  
4.51  
4.51  
Brick On Sled Carrier  
3.5-inch Small FF  
Brick On Sled carrier  
3.5-inch Small FF  
Brick On Sled carrier  
3.5-inch Small FF  
38-pin Unitized  
128-pin HPC  
38-pin Unitized  
128-pin HPC  
38-pin Unitized  
Note: CxB models (C1B, C2B, and C4B) include a DC/DC converter, activity and check indicators.  
Note: Please refer to section 2.1.1, “Capacity Equations” on page 13 for exact capacities based on user block size.  
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2.0 Specifications  
All specifications are nominal values unless otherwise noted.  
The Ultrastar XP SSA data storage capacities vary as a function of model and user block size. The  
emerging Industry trend is capacity points in 1.08GB (i.e. 1.08/2.16/4.32) at a block size of 512 bytes. This  
and future products will always plan to provide capacities that are consistent with this trend. Users that  
choose to make full use of the Ultrastar XP SSA drive capacity above the standard capacity points may not  
find equivalent capacity breakpoints in future products.  
2.1 General  
Note: The recording band located nearest the disk outer diameter (OD) is referred to as 'Notch #1'. While  
the recording band located nearest the inner diameter (ID) is called 'Notch #10'. 'Average' values are  
weighted with respect to the number of LBAs per notch when the drive is formatted with 512 byte blocks.  
Data transfer rates  
Notch #1  
12.58  
Notch #10 Average  
9.59 12.07  
Buffer to/from media  
Host to/from buffer  
MB/s (instantaneous)  
up to 20.0 MB/s (synchronous) (sustained)  
Data Buffer Size (bytes)  
Rotational speed (RPM)  
Average latency (milliseconds)  
Track Density (TPI)  
512 K (See 3.0, “Performance” on page 39 for user data capacity.)  
7202.7  
4.17  
4352  
Minimum  
96,567  
Maximum  
Recording density (BPI)  
124,970  
Areal density (Megabits/square inch) 420.3  
543.9  
(model numbers - > )  
Disks  
C4x  
8
C2x  
4
C1x  
2
User Data Heads (trk/cyl)  
Seek times (in milliseconds)  
Single cylinder (Read)  
(Write)  
16  
8
4
0.5  
2.0  
8.0  
9.5  
0.5  
0.5  
2.0  
6.9  
8.5  
2.0  
Average (weighted) (Read)  
(Write)  
7.5  
9.0  
Full stroke (Read)  
(Write)  
16.5  
18.0  
15.0  
16.5  
14.0  
15.5  
Note: Times are typical for a drive population under nominal voltages  
and casting temperature of 25˚C. Weighted seeks are seeks to the cylin-  
ders of random logical block addresses (LBAs).  
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Total Cylinders (tcyl)  
& User Cylinders (ucyl)  
All models C4x Models C2x Models C1x Models  
tcyl ucyl ucyl ucyl  
Notch #1  
Notch #2  
Notch #3  
Notch #4  
Notch #5  
Notch #6  
Notch #7  
Notch #8  
Notch #9  
Notch #10  
1893 1879 1877 1872  
956  
49  
955  
48  
955  
48  
955  
48  
310  
349  
116  
214  
190  
131  
208  
309  
348  
115  
213  
189  
130  
206  
309  
348  
115  
213  
189  
130  
206  
309  
348  
115  
213  
189  
130  
206  
Sum of all Notches  
4416  
4392  
4390  
4385  
Spares Sectors/cylinder (spr/cyl)  
C4x Models C2x Models C1x Models  
Notch #1  
Notch #2  
Notch #3  
Notch #4  
Notch #5  
Notch #6  
Notch #7  
Notch #8  
Notch #9  
Notch #10  
40  
40  
38  
37  
36  
34  
33  
32  
31  
30  
20  
20  
19  
19  
18  
17  
17  
16  
16  
15  
10  
10  
10  
9
9
9
8
8
8
7
Last cylinder extra spares (lcspr)  
60  
30  
14  
User bytes/sector (ub/sct)  
256 - 744 (even number of bytes only)  
1-8  
Sectors/logical block (sct/lba)  
The lowest sct/lba that satisfies the following rules is used...  
1. Block Length is evenly divisible by a number 2-8.  
2. Quotient of previous equation is evenly divisible by 2.  
3. Quotient must be 256 and 744.  
User bytes/logical block (ub/lba)  
Sectors/track (sct/trk)  
256 - 5952 (See rules for determining sct/lba above for determining sup-  
ported ub/lba values.)  
(See Table 1 on page 13 or contact an IBM Customer Representative  
for other block lengths.)  
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Notch #  
User bytes /  
logical block  
1
2
3
4
5
6
7
8
9
10  
256  
512  
520  
522  
524  
528  
600  
688  
744  
216  
135  
128  
128  
128  
128  
115  
102  
96  
216  
135  
128  
128  
128  
128  
115  
102  
96  
216  
130  
128  
128  
128  
126  
115  
102  
96  
202  
126  
123  
122  
120  
120  
110  
98  
195  
120  
115  
115  
115  
112  
102  
90  
180  
115  
112  
112  
112  
112  
101  
90  
180  
112  
108  
108  
108  
108  
97  
180  
108  
105  
105  
105  
105  
90  
180  
105  
102  
102  
102  
101  
90  
162  
100  
99  
90  
90  
90  
90  
90  
90  
81  
78  
90  
90  
90  
81  
78  
77  
73  
Table 1. Gross sectors per track for several block lengths  
C4x Models  
C2x Models  
formatted  
capacity  
(bytes)  
C1x Models  
User bytes /  
logical block  
formatted  
capacity  
(bytes)  
logical  
blocks /  
drive  
logical  
blocks /  
drive  
formatted  
capacity  
(bytes)  
logical  
blocks /  
drive  
256  
512  
520  
522  
524  
528  
600  
688  
744  
3,654,540,800  
4,512,701,440  
4,375,536,880  
4,374,300,492  
4,385,878,952  
4,408,629,984  
4,512,402,000  
4,604,578,976  
4,675,830,192  
14,275,550  
8,813,870  
8,414,494  
8,379,886  
8,369,998  
8,349,678  
7,520,670  
6,692,702  
6,284,718  
1,826,312,448  
2,255,098,368  
2,186,554,760  
2,185,931,898  
2,191,716,460  
2,203,082,640  
2,254,925,400  
2,300,969,904  
2,336,559,528  
7,134,033  
4,404,489  
4,204,913  
4,187,609  
4,182,665  
4,172,505  
3,758,209  
3,344,433  
3,140,537  
912,135,680  
1,126,337,536  
1,092,119,600  
1,091,803,716  
1,094,691,544  
1,100,365,728  
1,126,282,800  
1,149,310,880  
1,167,099,408  
3,563,030  
2,199,878  
2,100,230  
2,091,578  
2,089,106  
2,084,026  
1,877,138  
1,670,510  
1,568,682  
Table 2. User capacity for several block lengths  
2.1.1 Capacity Equations  
2.1.1.1 For Each Notch  
The next group of equations must be calculated separately for each notch.  
ub/lba  
user bytes/sector (ub/sct) =  
sct/lba  
user sectors/cyl (us/cyl) = (sct/trk)(trk/cyl) - spr/cyl  
spares/notch (spr/nch) = (spr/cyl)(ucyl)  
Note: Add lcspr to the equation above for the notch closest to the inner diameter (#10).  
user sectors/notch (us/nch) = (us/cyl)(ucyl)  
Note: Subtract lcspr from the equation above for the notch closest to the inner diameter (#10).  
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2.1.1.2 For Entire Drive  
10  
spares/drive (spr/drv) =  
spr/nch  
notch = 1  
10  
user sectors/drive (us/drv) =  
us/nch  
notch = 1  
us/drv  
logical blocks/drive (lba/drv) = INT  
[sct/lba ]  
user capacity (fcap) = (lba/drv)(ub/lba)  
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2.2 Power Requirements by Model  
2.2.1 C1x Models  
The following voltage specifications apply at the drive power connector. There is no special power on/off  
sequencing required. The extra power needed for Brick On Sled models and the +38V power option are  
described in 2.2.4, “CxB Models” on page 33.  
Input Voltage  
+ 5 Volts Supply  
+ 1 2 Volts Supply  
5V (± 5% during run and spin-up)  
12V (± 5% during run) ( + 5 % / -7% during spin-up)  
The following current values are the combination measured values of SCSI models and SSA Cx4 model. The  
differences between SCSI and SSA is + 5 V currents. Because of different interface electronics and speed, SSA  
electronics card requires more + 5 V current than SCSI. Read/Write Base Line is 290 ma higher. Idle  
Average is 500 ma higher. (290ma and 500ma differences were found by measuring SSA Cx4 model). SSA  
+ 5 V current numbers are derived from SCSI + 5 V current numbers by adding 290ma and 500ma accord-  
ingly.  
Population  
Mean  
Population  
Stand. Dev.  
Power Supply Current  
+5VDC (power-up)  
+5VDC (idle avg)  
Notes  
Minimum voltage slew rate = 4.5 V/sec  
1.23 Amps  
1.25 Amps1  
.36 Amps  
0.02 Amps  
+5VDC (R/W baseline)  
+5VDC (R/W pulse)  
0.05 Amps  
0.06 Amps  
Base-to-peak  
+12VDC (power-up)  
+12VDC (idle avg)  
Minimum voltage slew rate = 7.4 V/sec  
0.28 Amps  
0.02 Amps  
+12VDC (seek avg)  
+12VDC (seek peak)  
+12VDC (spin-up)  
1 op/sec  
0.0027 Amps  
1.20 Amps2  
1.5 Amps3  
0.002 Amps  
0.02 Amps  
0.1 Amps  
3.0 sec max  
Drive power  
Avg idle power  
Avg R/W power  
9.51 Watts  
.35 Watts  
.35 Watts  
30 ops/sec  
10.58 Watts  
1
See Figure 1 on page 18 for a plot of how the read/write baseline and read/write pulse sum together.  
2
The idle average and seek peek should be added together to determine the total 12 volt peak current. See Figure 2  
on page 19 for a typical buildup of these currents. Refer to examples on the following page to see how to combine  
these values.  
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2.2.1.1 Power Calculation Examples  
Note: The following formulas assume all system ops as a 1 block read or write transfer from a random  
cylinder while at nominal voltage condition.  
Example 1. Calculate the mean 12 volt average current.  
If we assume a case of 30 operations/second then to compute the sum of the 12 volt mean currents the  
following is done.  
mean  
+12VDC (idle average)  
0.28 amps  
+12VDC (seek average) 0.027 * 30 =  
0.081 amps  
TOTAL  
0.361 amps  
Example 2. Calculate the mean plus 3 sigma 12 volt average current.  
To compute the sum of the 12 volt mean current's 1 sigma value assume all the distributions are normal.  
Therefore the square root of the sum of the squares calculation applies.  
operations/second.  
Assume a case of 30  
sigma  
+12VDC (idle average)  
0.02 amps  
+12VDC (seek average) sqrt(30*((0.0002)**2))=  
0.001 amps  
TOTAL  
sqrt((0.02)**2+(.001)**2))=0.02 amps  
So the mean plus 3 sigma mean current is 0.361 + 3*0.02 = 0.42 amps  
Example 3. Power Calculation.  
Nominal idle drive power = (1.23 Amps * 5 Volts) + (0.28 Amps * 12 Volts) = 9.51 Watts  
Nominal R/W drive power at 30 ops/sec = (1.25 Amps * 5 Volts) + (0.361 Amps * 12 Volts) = 10.58  
Watts  
Mean plus 3 sigma drive power for 30 random R/W operations/second. Assume that the 5 volt and 12 volt  
distributions are independent therefore the square root of the sum of the squares applies.  
+5VDC (1 sigma power) 0.05 * 5  
+12VDC (1 sigma power) 0.02 * 12  
= 0.25 watts  
= 0.24 watts  
Total (1 sigma power) sqrt((0.25)**2+(0.24)**2)  
= 0.347 watts  
= 10.2 watts  
Total power  
9.13 + 3 * 0.347  
3
The current at start is the total 12 volt current required (ie. the motor start current, module current and voice coil  
retract current). See Figure 3 on page 20 for typical 12 volt current during spindle motor start.  
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Example 4. Calculate the 12 volt peak current.  
To compute the sum of the 12 volt peak currents the following is done.  
mean  
+12VDC (idle avg)  
+12VDC (seek peak)  
0.28 amps  
1.2 amps  
TOTAL  
1.48 amps  
Example 5. Calculate the mean plus 3 sigma 12 volt peak current.  
To compute the sum of the 12 volt peak current's 1 sigma value assume all distributions are normal. There-  
fore the square root of the sum of the squares calculation applies.  
sigma  
+12VDC (idle avg)  
+12VDC (seek peak)  
0.02 amps  
0.02 amps  
TOTAL sqrt((0.02)**2+(0.02)**2)=0.028 amps  
So the mean plus 3 sigma peak current is 1.48 + 3*0.028 = 1.56 amps  
Things to check when measuring 12 V supply current:  
Null the current probe frequently. Be sure to let it warm up.  
Adjust the power supply to 12.00 V at the drive terminals.  
Use a proper window width, covering an integral number of spindle revolutions.  
Measure values at 25 degree C casting temperature.  
Get a reliable trigger for Seek Peak readings.  
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Figure 1. 5 volt current during read/write operations —C1x Models  
1. Read/write baseline voltage.  
2. Read/write pulse. The width of the pulse is proportional to the number of consecutive blocks read or  
written. The 5 volt supply must be able to provide the required current during this event.  
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Figure 2. Typical 12 volt current —C1x Models  
1. Maximum slew rate is 7 amps/millisecond.  
2. Maximum slew rate is 100 amps/millisecond.  
3. Maximum slew rate is 7 amps/millisecond.  
4. Maximum slew rate is 3 amps/millisecond.  
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Figure 3. Typical 12 volt spin-up current —C1x Models  
1. Maximum slew rate is 20 amps/millisecond.  
2. Current drops off as motor comes up to speed.  
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2.2.2 C2x Models  
The following voltage specifications apply at the drive power connector. There is no special power on/off  
sequencing required. The extra power needed for Brick On Sled models and the +38V power option are  
described in 2.2.4, “CxB Models” on page 33.  
Input Voltage  
+ 5 Volts Supply  
+ 1 2 Volts Supply  
5V (± 5% during run and spin-up)  
12V (± 5% during run) ( + 5 % / -7% during spin-up)  
The following current values are the combination measured values of SCSI models and SSA Cx4 model. The  
differences between SCSI and SSA is + 5 V currents. Because of different interface electronics and speed, SSA  
electronics card requires more + 5 V current than SCSI. Read/Write Base Line is 290 ma higher. Idle  
Average is 500 ma higher. (290ma and 500ma differences were found by measuring SSA Cx4 model). SSA  
+ 5 V current numbers are derived from SCSI + 5 V current numbers by adding 290ma and 500ma accord-  
ingly.  
Population  
Mean  
Population  
Stand. Dev.  
Power Supply Current  
+5VDC (power-up)  
+5VDC (idle avg)  
Notes  
Minimum voltage slew rate = 4.5 V/sec  
1.23 Amps  
1.25 Amps4  
.36 Amps  
0.02 Amps  
+5VDC (R/W baseline)  
+5VDC (R/W pulse)  
0.05 Amps  
0.06 Amps  
Base-to-peak  
+12VDC (power-up)  
+12VDC (idle avg)  
Minimum voltage slew rate = 7.4 V/sec  
0.41 Amps  
0.02 Amps  
+12VDC (seek avg)  
+12VDC (seek peak)  
+12VDC (spin-up)  
1 op/sec  
0.0031 Amps  
1.20 Amps5  
1.5 Amps6  
0.0002 Amps  
0.02 Amps  
0.1 Amps  
4.2 sec max  
Drive power  
Avg idle power  
Avg R/W power  
11.07 Watts  
12.25 Watts  
.35 Watts  
.35 Watts  
30 ops/sec  
4
See Figure 4 on page 24 for a plot of how the read/write baseline and read/write pulse sum together.  
5
The idle average and seek peek should be added together to determine the total 12 volt peak current. See Figure 5  
on page 25 for a typical buildup of these currents. Refer to examples on the following page to see how to combine  
these values.  
6
The current at start is the total 12 volt current required (ie. the motor start current, module current and voice coil  
retract current). See Figure 6 on page 26 for typical 12 volt current during spindle motor start.  
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2.2.2.1 Power Calculation Examples  
Note: The following formulas assume all system ops as a 1 block read or write transfer from a random  
cylinder while at nominal voltage condition.  
Example 1. Calculate the mean 12 volt average current.  
If we assume a case of 30 operations/second then to compute the sum of the 12 volt mean currents the  
following is done.  
mean  
+12VDC (idle average)  
0.41 amps  
+12VDC (seek average) 0.0031 * 30 = 0.09 amps  
TOTAL  
0.50 amps  
Example 2. Calculate the mean plus 3 sigma 12 volt average current.  
To compute the sum of the 12 volt mean current's 1 sigma value assume all the distributions are normal.  
Therefore the square root of the sum of the squares calculation applies.  
operations/second.  
Assume a case of 30  
sigma  
+12VDC (idle average)  
0.02 amps  
+12VDC (seek average) sqrt(30*((0.0002)**2))=  
0.001 amps  
TOTAL  
sqrt((0.02)**2+(.001)**2))=0.02 amps  
So the mean plus 3 sigma mean current is 0.50 + 3*0.02 = 0.56 amps  
Example 3. Power Calculation.  
Nominal idle drive power = (1.23 Amps * 5 Volts) + (0.41 Amps * 12 Volts) = 11.07 Watts  
Nominal R/W drive power at 30 ops/sec = (1.25 Amps * 5 Volts) + (0.50 Amps * 12 Volts) = 12.25  
Watts  
Mean plus 3 sigma drive power for 30 random R/W operations/second. Assume that the 5 volt and 12 volt  
distributions are independent therefore the square root of the sum of the squares applies.  
+5VDC (1 sigma power) 0.05 * 5  
+12VDC (1 sigma power) 0.02 * 12  
= 0.25 watts  
= 0.24 watts  
Total (1 sigma power) sqrt((0.25)**2+(0.24)**2)  
= 0.35 watts  
= 11.9 watts  
Total power  
10.8 + 3 * 0.35  
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Example 4. Calculate the 12 volt peak current.  
To compute the sum of the 12 volt peak currents the following is done.  
mean  
+12VDC (idle avg)  
+12VDC (seek peak)  
0.41 amps  
1.20 amps  
TOTAL  
1.61 amps  
Example 5. Calculate the mean plus 3 sigma 12 volt peak current.  
To compute the sum of the 12 volt peak current's 1 sigma value assume all distributions are normal. There-  
fore the square root of the sum of the squares calculation applies.  
sigma  
+12VDC (idle avg)  
+12VDC (seek peak)  
0.03 amps  
0.02 amps  
TOTAL sqrt((0.03)**2+(0.02)**2)=0.036 amps  
So the mean plus 3 sigma peak current is 1.61 + 3*0.036= 1.72 amps  
Things to check when measuring 12 V supply current:  
Null the current probe frequently. Be sure to let it warm up.  
Adjust the power supply to 12.00 V at the drive terminals.  
Use a proper window width, covering an integral number of spindle revolutions.  
Measure values at 25 degree C casting temperature.  
Get a reliable trigger for Seek Peak readings.  
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Figure 4. 5 volt current during read/write operations —C2x Models  
1. Read/write baseline voltage.  
2. Read/write pulse. The width of the pulse is proportional to the number of consecutive blocks read or  
written. The 5 volt supply must be able to provide the required current during this event.  
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Figure 5. Typical 12 volt current —C2x Models  
1. Maximum slew rate is 7 amps/millisecond.  
2. Maximum slew rate is 100 amps/millisecond.  
3. Maximum slew rate is 7 amps/millisecond.  
4. Maximum slew rate is 3 amps/millisecond.  
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Figure 6. Typical 12 volt spin-up current —C2x Models  
1. Maximum slew rate is 20 amps/millisecond.  
2. Current drops off as motor comes up to speed.  
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2.2.3 C4x Models  
The following voltage specifications apply at the drive power connector. There is no special power on/off  
sequencing required. The extra power needed for Brick On Sled models and the +38V power option are  
described in 2.2.4, “CxB Models” on page 33.  
Input Voltage  
+ 5 Volts Supply  
+ 1 2 Volts Supply  
5V (± 5% during run and spin-up)  
12V (± 5% during run) ( + 5 % / -7% during spin-up)  
The following current values are the combination measured values of SCSI models and SSA Cx4 model. The  
differences between SCSI and SSA is + 5 V currents. Because of different interface electronics and speed, SSA  
electronics card requires more + 5 V current than SCSI. Read/Write Base Line is 290 ma higher. Idle  
Average is 500 ma higher. (290ma and 500ma differences were found by measuring SSA Cx4 model). SSA  
+ 5 V current numbers are derived from SCSI + 5 V current numbers by adding 290ma and 500ma accord-  
ingly.  
Population  
Mean  
Population  
Stand. Dev.  
Power Supply Current  
+5VDC (power-up)  
+5VDC (idle avg)  
Notes  
Minimum voltage slew rate = 4.5 V/sec  
1.26 Amps  
1.27 Amps7  
.36 Amps  
0.02 Amps  
+5VDC (R/W baseline)  
+5VDC (R/W pulse)  
0.05 Amps  
0.06 Amps  
Base-to-peak  
+12VDC (power-up)  
+12VDC (idle avg)  
Minimum voltage slew rate = 7.4 V/sec  
0.77 Amps  
0.03 Amps  
+12VDC (seek avg)  
+12VDC (seek peak)  
+12VDC (spin-up)  
1 op/sec  
0.0036 Amps  
1.3 Amps8  
2.2 Amps9  
0.0002 Amps  
0.02 Amps  
0.1 Amps  
8.5 sec max  
Drive power  
Avg idle power  
Avg R/W power  
15.54 Watts  
16.91 Watts  
.44 Watts  
.44 Watts  
30 ops/sec  
7
See Figure 7 on page 30 for a plot of how the read/write baseline and read/write pulse sum together.  
8
The idle average and seek peek should be added together to determine the total 12 volt peak current. See Figure 8  
on page 31 for a typical buildup of these currents. Refer to examples on the following page to see how to combine  
these values.  
9
The current at start is the total 12 volt current required (ie. the motor start current, module current and voice coil  
retract current). See Figure 9 on page 32 for typical 12 volt current during spindle motor start.  
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2.2.3.1 Power Calculation Examples  
Note: The following formulas assume all system ops as a 1 block read or write transfer from a random  
cylinder while at nominal voltage condition.  
Example 1. Calculate the mean 12 volt average current.  
If we assume a case of 30 operations/second then to compute the sum of the 12 volt mean currents the  
following is done.  
mean  
+12VDC (idle average)  
0.77 amps  
+12VDC (seek average) 0.0036 * 30 = 0.11 amps  
TOTAL  
0.88 amps  
Example 2. Calculate the mean plus 3 sigma 12 volt average current.  
To compute the sum of the 12 volt mean current's 1 sigma value assume all the distributions are normal.  
Therefore the square root of the sum of the squares calculation applies.  
operations/second.  
Assume a case of 30  
sigma  
+12VDC (idle average)  
0.02 amps  
+12VDC (seek average) sqrt(30*((0.0002)**2))=  
0.001 amps  
TOTAL  
sqrt((0.02)**2+(.001)**2))=0.02 amps  
So the mean plus 3 sigma mean current is 0.88 + 3*0.02 = 0.94 amps  
Example 3. Power Calculation.  
Nominal idle drive power = (1.26 Amps * 5 Volts) + (0.77 Amps * 12 Volts) = 15.54 Watts  
Nominal R/W drive power at 30 ops/sec = (1.27 Amps * 5 Volts) + (0.88 Amps * 12 Volts) = 16.91  
Watts  
Mean plus 3 sigma drive power for 30 random R/W operations/second. Assume that the 5 volt and 12 volt  
distributions are independent therefore the square root of the sum of the squares applies.  
+5VDC (1 sigma power) 0.05 * 5  
+12VDC (1 sigma power) 0.03 * 12  
= 0.25 watts  
= 0.36 watts  
Total (1 sigma power) sqrt((0.25)**2+(0.36)**2)  
= 0.44 watts  
= 16.8 watts  
Total power  
15.46 + 3 * 0.44  
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Example 4. Calculate the 12 volt peak current.  
To compute the sum of the 12 volt peak currents the following is done.  
mean  
+12VDC (idle avg)  
+12VDC (seek peak)  
0.77 amps  
1.3 amps  
TOTAL  
2.07 amps  
Example 5. Calculate the mean plus 3 sigma 12 volt peak current.  
To compute the sum of the 12 volt peak current's 1 sigma value assume all distributions are normal. There-  
fore the square root of the sum of the squares calculation applies.  
sigma  
+12VDC (idle avg)  
+12VDC (seek peak)  
0.02 amps  
0.02 amps  
TOTAL sqrt((0.02)**2+(0.02)**2)=0.028 amps  
So the mean plus 3 sigma peak current is 2.07 + 3*0.028= 2.1 amps  
Things to check when measuring 12 V supply current:  
Null the current probe frequently. Be sure to let it warm up.  
Adjust the power supply to 12.00 V at the drive terminals.  
Use a proper window width, covering an integral number of spindle revolutions.  
Measure values at 25 degree C casting temperature.  
Get a reliable trigger for Seek Peak readings.  
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Figure 7. 5 volt current during read/write operations —C4x Models  
1. Read/write baseline voltage.  
2. Read/write pulse. The width of the pulse is proportional to the number of consecutive blocks read or  
written. The 5 volt supply must be able to provide the required current during this event.  
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Figure 8. Typical 12 volt current —C4x Models  
1. Maximum slew rate is 7 amps/millisecond.  
2. Maximum slew rate is 100 amps/millisecond.  
3. Maximum slew rate is 7 amps/millisecond.  
4. Maximum slew rate is 3 amps/millisecond.  
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Figure 9. Typical 12 volt spin-up current —C4x Models  
1. Maximum slew rate is 20 amps/millisecond.  
2. Current drops off as motor comes up to speed.  
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2.2.4 CxB Models  
The carrier models include a DC/DC power converter, device activity and fault/service indicators. There is  
no additional current required for + 5 V or +12V.  
2.2.4.1 Power supply methods  
When +38V is applied to the interface connector pins +38V Source A, +38V Source B, and Ground, the  
+ 38V supply is input to a DC/DC converter that provides +12V and + 5 V to the drive electronics.  
2.2.4.2 DC/DC Converter  
Typical efficiency of this converter is 80% at maximum output load with input voltage at 38V.  
There are two independent +38V power supply inputs on the interface connector which supply two inde-  
pendent inputs to the DC/DC converter, +38V Source A and +38V Source B (refer to Table 12 on  
page 65). The DC/DC converter will operate while one input voltage is in the range of +34V to +40V and  
the other input voltage is in the range of 0 to + 4 0 volts. Input voltage ripple must be less than 1.0 volts  
peak-to-peak at the fundamental frequency of 420 Hz maximum, less than 500mv at the frequency from  
421hz to 1 khz, less than 100mv at the frequency greater than 1 khz. The converter output is + 5 volts at  
0.3 amps to 2.6 amps and + 1 2 volts at 0.3 amps to 1.4 amps continuous current. The +12v output can  
handle a surge current of 2.2 amps in 9 seconds.  
The total input current to the converter is 1.6A amps when the highest input voltage on the power supply  
input pins is + 3 4 volts and the converter outputs are operating at full load. The input current ripple, due to  
converter switching is no more than 100 milliamps peak-to-peak at 1 MHz Maximum inrush current is  
limited to 3 amps during turn on except for a maximum period of 2 microseconds (during hot plugging)  
where the current can exceed 3 amps but is less than 8 amps.  
A DC/DC converter output enable is provided on the interface connector. This signal, +DC/DC Enable, is  
pulled up within the converter. To enable the DC outputs, this line must be at or above 2.4 volts. To  
disable the DC outputs, the signal must be at or below 1.4 volts.  
The DC/DC converter has over-current, over-voltage, and over-temperature detection. Any of these condi-  
tions will latch off the converter. The latch is reset by insuring that both input voltages fall below + 5 volts  
for a period greater than or equal to 10 milliseconds.  
Refer to 5.5, “Option Pins and Indicators” on page 66 for descriptions of the Early Power Off Warning and  
Loss of Redundancy fault signals associated with the +38V supply inputs.  
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2.2.5 Power Supply Ripple  
Externally Generated Ripple10  
as seen at drive power connector  
Maximum  
Notes  
+5VDC  
150 mV  
0-20 MHz  
peak-to-peak  
+12VDC  
150 mV  
0-20 MHz  
peak-to-peak  
During drive start up and seeking, 12 volt ripple is generated by the drive (referred to as dynamic loading). If  
several drives have their power daisy chained together then the power supply ripple plus other drive's  
dynamic loading must remain within the regulation tolerance window of + / - 5%. A common supply with  
separate power leads to each drive is a more desirable method of power distribution.  
2.2.6 Grounding Requirements of the Disk Enclosure  
The disk enclosure is at Power Supply ground potential. It is allowable for the user mounting scheme to  
common the Disk Enclosure to Frame Ground potential or to leave it isolated from Frame Ground.  
From a Electro-Magnetic Compatibility (EMC) standpoint it will, in most cases be preferable to common  
the Disk Enclosure to the system's mounting frame. With this in mind, it is important that the Disk Enclo-  
sure not become an excessive return current path from the system frame to power supply. The drive's  
mounting frame must be within ± 150 millivolts of the drive's power supply ground. At no time should  
more than 35 milliamps of current (0 to 100Mhz) be injected into the disk enclosure.  
Please contact your IBM Customer Representative if you have questions on how to integrate this drive in  
your system.  
2.2.7 Hot plug/unplug support  
Power supply and SSA link hot plug and un-plug is allowed for all SSA models.  
For Form Factor models, there is no special sequence required for connecting 5 volt, 12 volt, or ground.  
During a hot plug-in event the drive being plugged will draw a large amount of current at the instant of  
plug-in. This current spike is due to charging the bypass capacitors on the drive. This current pulse may  
cause the power supply to go out of regulation. If this supply is shared by other drives then a low voltage  
power on reset may be initiated on those drives. Therefore the recommendation for hot plugging is to have  
one supply for each drive. Never daisy chain the power leads if hot plugging is planned. Hot plugging  
should be minimized to prevent wear on the power connector.  
The carrier models may be hot plugged ONLY IF the ground pins (longer pin) make contact first (before  
other pins which are shorter). Vice versa, the carrier may be hot unplugged ONLY IF the ground pins  
(longer pins) are the last to remove (after other pins which are shorter). DAMAGE TO THE FILE ELEC-  
TRONICS AND THE ADAPTER ELECTRONICS COULD RESULT IF THE ABOVE CONDITIONS  
ARE NOT MET. The mating HPC connector MUST HAVE PROGRAMMABLE PIN LENGTH. GND  
PINS MUST BE LONGER THAN SIGNAL AND POWER PINS. THE GUIDE PINS MUST BE TIED  
TO THE DOKING ASSEMBLY FRAME GND  
10  
This ripple must not cause the power supply to the drive to go outside of the ± 5% regulation tolerance.  
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Hot plugging the SSA link will be recognized by the next node which will cause a configuration process to  
be started by the Initiators.  
During hot plugging, the supplies must not go over the upper voltage limit. This means that proper ESD  
protection must be used during the plugging event.  
During hot un-plugging if the operating shock limit specification can be exceeded then the drive should be  
issued a Start/Stop Unit command (spin down) that is allowed to complete before un-plugging.  
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2.2.8 Bring-up Sequence (and Stop) Times  
Figure 10. Start Time Diagram  
Note: BATS is the abbreviation for Basic Assurance Tests. Start-up sequence spins up the spindle motor,  
initializes the servo subsystem, up-loads code, performs BATS2 (verifies read/write hardware), resumes  
"Reassign in Progress" operations, and more. For more information on the start-up sequence, refer to the  
Ultrastar XP (DFHC) SSA Models Interface Specification.  
Note: If a RESET is issued before the drive comes ready, the power on sequence will start again. In all  
other cases when a RESET is issued the present state of the motor is not altered.  
Note: Reference “Start/Stop Unit Time” on page 49 for additional details.  
Note: See 5.7, “Spindle Synchronization” on page 69 for details about Start-up time increases when the  
device is requested via Mode Parameters to synchronize the spindle motor to another device.  
Event  
Nominal  
1.5 sec  
12.4 sec  
8.2 sec  
6.0 sec  
Maximum  
2.0 sec  
Notes  
Power-up  
Start-up  
Spin-up  
*see Figure 10  
*see Figure 10  
*see Figure 10  
45 sec.  
29.2 sec  
12.0 sec  
Spindle Stop  
Table 3. Bring-up Sequence Times and Stop Time for C1x Models  
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Event  
Nominal  
1.5 sec  
Maximum  
2.0 sec  
Notes  
Power-up  
Start-up  
Spin-up  
*see Figure 10  
*see Figure 10  
*see Figure 10  
17.6 sec  
13.2 sec  
9.0 sec  
45 sec.  
29.2 sec  
12.0 sec  
Spindle Stop  
Table 4. Bring-up Sequence Times and Stop Time for C2x Models  
Event  
Nominal  
1.5 sec  
Maximum  
2.0 sec  
Notes  
Power-up  
Start-up  
Spin-up  
*see Figure 10 on page 36  
*see Figure 10 on page 36  
*see Figure 10 on page 36  
16.5 sec  
11.17 sec  
8.0 sec  
45 sec.  
30.9 sec  
12.0 sec  
Spindle Stop  
Table 5. Bring-up Sequence Times and Stop Time for C4x Models  
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3.0 Performance  
Drive performance characteristics are dependent upon the workloads run and the environments in which  
they are run.  
All times listed in this chapter are typical values provided for information only, so that the performance for  
environments and workloads other than those shown as examples can be approximated. Actual minimum  
and maximum values will vary depending upon factors such as workload, logical and physical operating envi-  
ronments.  
3.1 Environment Definition  
Drive performance criteria is based on the following operating environment. Deviations from this environ-  
ment may cause deviations from values listed in this specification.  
Block lengths are formatted at 512 bytes per block.  
The number of data buffer cache segments is 8. The total data buffer length is 512k bytes. Each  
segment is of equal length. Therefore, each cache segment is 64k bytes.  
The number of blocks of customer data that can fit into one segment is reduced because 2 bytes of LRC  
information is also stored in the segment for each block of customer data stored in the segment. There-  
fore, use the following equation to determine how many blocks can fit into one segment.  
512KB  
# of segments  
(
)
ub/lba + 2  
Ten byte Read and Write commands are used.  
SSA environment consists of a single initiator and single target with no SSA link contention.  
The Initiator delay in responding to messages from the Target is assumed to be zero.  
All performance enhancing functions are disabled, except where noted. More specifically,  
Commands are not queued  
Caching is disabled (RCD=1, WCE=0)  
Out of order transfers are not allowed (OOTM=0, OOTI=0)  
The media is formatted with the skew definition that optimizes the disk data transfer rate for un-  
synchronized spindle operation.  
All Current Mode Parameters are set to their Default values except where noted.  
Averages are based on a sample size of 10,000 operations.  
3.2 Workload Definition  
The drive's performance criteria is based on the following command workloads. Deviations from these  
workloads may cause deviations from this specification.  
Operations are either all Reads or all Writes. The specifications for Command Execution Time with  
Read Ahead describe exceptions to this restriction. For that scenario all commands are preceded by a  
Read command, except for sequential write commands.  
The Data Transfer size is set to 64 Blocks.  
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The time between the end of an operation, and when the next operation is issued is 50 msec, + / - a  
random value of 0 to 50 msec, unless otherwise noted.  
3.2.1 Sequential  
No Seeks. The target LBA for all operations is the previous LBA + 64.  
3.2.2 Random  
All operations are to random LBAs. The average seek is an average weighted seek.  
3.3 Command Execution Time  
Command execution, or service, times are the sum of several Basic Components:  
1. Seek  
2. Latency  
3. Command Execution Overhead  
4. Data Transfer to/from Disk  
5. Data Transfer to/from SSA Link  
The impact or contribution of those Basic Components to Command Execution Time is a function of the  
workload being sent to the drive and the environment in which the drive is being operated.  
3.3.1 Basic Component Descriptions  
Seek  
The average time from the initiation of the seek, to the acknowledgement that the R/W head is  
on the track that contains the first requested LBA. Values are population averages, and vary as  
a function of operating conditions. The values used to determine Command Execution Times  
for sequential commands is 0 milliseconds and the values for random commands are shown in  
section 2.0, “Specifications” on page 11.  
Latency  
The average time required from the activation of the read/write hardware until the target sector  
has rotated to the head and the read/write begins. This time is 1/2 of a revolution of the disk, or  
4.17 milliseconds.  
Command Execution Overhead  
The average time added to the Command Execution Time due to the processing of the  
command. It includes all time the drive spends not doing a disk operation or SSA link data  
transfer.  
The following values are used when calculating the Command Execution Times.  
Workload  
Command Execution  
Sequential Read  
Sequential Write  
Random Read  
Random Write  
.65 ms  
1.00 ms  
.25 ms  
.30 ms  
Table 6. Overhead Values  
A number of Initiator controlled factors affect Command Execution Overhead. These are exam-  
ined separately in 3.4, “Approximating Performance for Different Environments” on page 43.  
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The Post Command Processing time of .26 ms is defined as the average time required for process  
cleanup after the command has completed. If a re-instruct period faster than this time is used, the  
difference is added to the Command Execution Overhead of the next operation.  
Data Transfer to/from Disk  
The average time used to transfer the data between the media and the drive's internal data buffer.  
This is calculated from:  
(Data Transferred)/(Media Transfer Rate).  
There are four interpretations of Media Transfer Rate. How it is to be used helps decide which  
interpretation is appropriate to use.  
1. Instantaneous Data Transfer Rate  
The same for a given notch formatted at any of the supported logical block lengths. It varies  
by notch only and does not include any overhead.  
2. Track Data Sector Transfer Rate  
Varies depending upon the formatted logical block length and varies from notch to notch. It  
includes the overhead associated with each individual sector. This is calculated from:  
(user bytes/sector)/(individual sector time)  
(Contact an IBM Customer Representative for individual sector times of the various for-  
matted block lengths.)  
3. Theoretical Data Sector Transfer Rate  
Also includes time required for track and cylinder skew and overhead associated with each  
track. (See 3.3.2.1, “Theoretical Data Sector Transfer Rate” on page 43 for a description on  
how to calculate it.)  
4. Typical Data Sector Transfer Rates  
Also includes the effects of defective sectors and skipped revolutions due to error recovery.  
See Appendix B of the Ultrastar XP (DFHC) SSA Models Interface Specification for a  
description of error recovery procedures.  
Rates for drives formatted at 512 bytes/block are located in Table 7 on page 42.  
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Model Type  
Notch #  
All  
C4x  
C2x  
C1x  
Instant.  
Track  
Theoretical  
Typical  
Theoretical  
Typical  
Theoretical  
Typical  
Average  
12.07  
12.58  
12.58  
12.51  
11.96  
11.26  
11.05  
10.64  
10.29  
10.01  
9.59  
7.91  
8.30  
8.30  
7.99  
7.74  
7.38  
7.07  
6.88  
6.64  
6.45  
6.15  
7.17  
7.52  
7.52  
7.22  
7.02  
6.66  
6.41  
6.23  
6.03  
5.85  
5.55  
7.13  
7.48  
7.48  
7.18  
6.99  
6.63  
6.38  
6.20  
6.00  
5.83  
5.53  
7.13  
7.48  
7.48  
7.18  
6.99  
6.63  
6.38  
6.19  
6.00  
5.83  
5.53  
7.10  
7.44  
7.44  
7.15  
6.95  
6.60  
6.35  
6.16  
5.97  
5.80  
5.50  
7.06  
7.40  
7.40  
7.11  
6.92  
6.57  
6.31  
6.13  
5.94  
5.77  
5.48  
7.03  
7.37  
7.37  
7.08  
6.89  
6.54  
6.28  
6.10  
5.91  
5.74  
5.45  
1
2
3
4
5
6
7
8
9
10  
9
Note: The values for Typical Data Sector Transfer Rates assume a typically worst case value of 3.16 errors in 10 bits read at  
nominal conditions for soft error rate.  
Note: Contact an IBM Customer Representative for values when formatted at other block lengths.  
Note: "Average" values are sums of the individual notch values weighted by the number of LBAs in the associated notches.  
Table 7. Data Sector Transfer Rates. (All rates are in MB/sec)  
Data Transfer to/from SSA Link  
The time required to transfer data between the SSA link and the drive's internal data buffer, that  
is not overlapped with the time for the Seek, Latency or Data Transfer to/from Disk.  
When the drive is reading, data is transferred from the medium to its data buffer and from the  
buffer across the SSA link simultaneously. However, data transfer to the link from the data  
buffer buffer lags transfer from the medium to the buffer by one block. At the end of the transfer  
from the medium, one block still has to be transferred across the link.  
For a write operation, the data is normally transferred to the data buffer during the seek and  
latency time. In the rare case that these are both zero, the write cannot begin until one sector is  
transferred, and the time to do this becomes part of the overhead.  
Each block of data is transferred as one or more frames on the SSA Link. Each frame requires  
10 bytes of overhead and may contain up to 128 bytes of data. The time to transfer one block  
depends on the number of frames required. For example, a 744 byte block needs 6 frames (5 x  
128 byte, 1 x 104). This adds 60 bytes of overhead making 804 bytes total. At an instantaneous  
transfer rate of 20MB/s, that is 40 microseconds per block (17.7MB/s sustained).  
3.3.2 Comments  
Overlap has been removed from the Command Execution Time calculations. The components of the  
Command Execution Times are truly additive times to the entire operation. For example,  
The Post Command Processing times are not components of the Command Execution time therefore  
they are not included in the calculation of environments where the re-instruct period exceeds the Post  
Command Processing time.  
The effects of idle time functions are not included in the above examples. The 3.2.1, “Sequential” on  
page 40 and 3.2.2, “Random” on page 40 both define environments where the effects due to increased  
command overhead of Idle Time Functions upon Command Execution time are less than 0.15%.  
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3.3.2.1 Theoretical Data Sector Transfer Rate  
This Rate does not account for time required for error recovery or defective sectors (the Typical Data Sector  
Transfer Rate described in 3.3.1, “Basic Component Descriptions” on page 40 does include those effects).  
Each group of cylinders with a different number of gross sectors per track is called a notch. The following  
shows values for notch #1 of C4x models. The "Average" values used in this specification are sums of the  
individual notch values weighted by the number of LBAs in the associated notches. For the other notches  
and block lengths use values that correspond to those notches and block lengths.  
Data Sector Transfer Rate  
=
Bytes/cylinder  
time for 1 cyl + track skews + 1 cyl skew  
Bytes/cylinder  
= {(tracks/cyl)(gross sectors/track) - spares/cyl}(user bytes/sector)  
= {(16)(135) - 40}(512)  
= 1,085,440 Bytes/cyl  
time for 1 cyl of data = {(tracks/cyl)(gross sectors/track) - spares/cyl}(avg. sector time)  
= {(16)(135) - 40}(.061705)  
= 130.815 msec/cyl  
time for track skews  
time for 1 cyl skew  
= (tracks/cyl - 1)(track skew)(avg. sector time)  
= (16-1)(13)(.061700)  
= 12.032 msec/cyl  
= (cylinder skew)(avg. sector time)  
= (25)(.061705)  
= 1.543 msec/cyl  
Data Sector Transfer Rate  
=
1,085,440 Bytes  
130.815 msec + 12.032 msec + 1.543 msec  
= 7.517 MB/sec (Notch #1)  
Note: See 2.0, “Specifications” on page 11 for the descriptions of  
tracks/cyl (trk/cyl)  
gross sectors/track (gs/trk)  
spares/cyl (b1spr/cyl and b2spr/cyl)  
user bytes/sector (ub/sct)  
gross bytes/sector (gb/sct)  
See 3.5, “Skew” on page 46 for the descriptions of  
track skew (tss)  
cylinder skew (css)  
Average sector times per notch can be calculated as follows:  
average sector time (ast) =  
1 sec  
120.045 × gs/trk  
3.4 Approximating Performance for Different Environments  
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3.4.1 For Different Transfer Sizes  
The primary performance change due to a change of transfer size is the Data Transfer to/from Disk param-  
eter. See 3.3.1, “Basic Component Descriptions” on page 40 for an explanation of the calculation of this  
parameter.  
The Command Execution Overhead may also change if the transfer size is reduced to the point where certain  
internal control functions can no longer be overlapped with either the SSA Link or Disk data transfer.  
For example, a short read may incur up to .65ms extra overhead if the Data Ready/Reply exchange does not  
overlap the disk transfer.  
3.4.2 When Read Caching is Enabled  
For read commands with Read Caching Enabled Command Execution time can be approximated by  
deleting Seek, Latency, and Data Transfer to/from Disk components if all of the requested data is available  
in a cache segment (cache hit). Command Execution Overhead increases by approximately .1ms in this case  
as there is no overlap with seek/latency.  
When some, but not all, of the requested data is available in a cache segment (partial cache hit) Data  
Transfer to/from Disk will be reduced but not eliminated. Seek and Latency may or may not be reduced  
depending upon the location of requested data not in the cache and location of the read/write heads at the  
time the command was received.  
The contribution of the Data Transfer to/from SSA link to the Command Execution time may increase since  
a larger, or entire, portion of the transfer may no longer be overlapped with the components that were  
reduced.  
3.4.3 When Write Caching is Enabled  
For write commands with the Write Caching Enabled (WCE) Mode parameter bit set, Command Execution  
time can be approximated by deleting Seek, Latency, and Data Transfer to/from Disk components. The  
contribution of the Data Transfer to/from SSA link to the Command Execution time may increase since a  
larger, or entire, portion of the transfer may no longer be overlapped with the components that were  
reduced. The reduced times effectively are added to the Post Command Processing Time.  
Command completion status is returned when data is completely stored in the buffer. The time to transfer  
this group of data to the disk will be added to the performance of any next command that was in the queue.  
3.4.4 When Adaptive Caching is Enabled  
The Adaptive Caching feature attempts to increase Read Cache hit ratios by monitoring workload and  
adjusting cache control parameters, normally determined by the using system via the Mode Parameters, with  
algorithms using the collected workload information.  
3.4.5 When Read-ahead is Enabled  
If read-ahead is active, the service time is affected in several ways:  
If the data requested by a read command is all in the data buffer already, the command can be serviced  
very quickly.  
If the beginning of the requested data is in the buffer, and the read-ahead is still in progress, data transfer  
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for the command can start immediately. This effectively avoids latency time for read operations sequen-  
tial on a previous read.  
If the data requested by a read operation is not in the read-ahead buffers, there is an increase in the  
command overhead time due to the time spent searching the buffers. This time depends on the number  
of buffer segments selected by the Mode Select command.  
If read-ahead is still in progress when the next command is received and the data requested is not  
sequential, the drive aborts read-ahead and starts the command. The time to perform this abort  
increases the Command Execution Overhead by .23ms.  
3.4.6 When No Seek is Required  
For a Read command, the additional Command Execution Overhead when no seek is required is approxi-  
mately .50ms. For a Write, it is approximately .70ms.  
3.4.7 For Queued Commands  
If commands are sent to the drive when it is busy performing a previous command, they can be queued. In  
this case, some of the command processing is performed during the previous command and the overhead for  
the queued command is reduced by approximately .20 milliseconds.  
3.4.7.1 Reordered Commands  
If the Queue Algorithm Modifier Mode Parameter field is set to allow it, commands in the device command  
queue may be executed in a different order than they were received. Commands are reordered so that the  
seek portion of Command Execution time is minimized. The amount of reduction is a function of the  
location of the 1st requested block per command and the rate at which the commands are sent to the drive.  
A Queue Algorithm Modifier Mode Parameter value of 9 enables an algorithm that gives the using system  
the ability to place new commands into the drive command queue execution order relative to the out-  
standing commands in the queue. For example, if a request is sent to the drive that the using system prior-  
itizes such that it's completion time is more important than one or more of the outstanding commands, the  
using system can increase the likelihood that command is executed before those others by using a tag value  
greater than those outstanding commands.  
3.4.7.2 Back-To-Back Commands  
If consecutive read/write commands access contiguous data, they can be serviced without incurring disk  
latency between commands.  
Note: There is a minimum transfer length for a given environment where continuous access to the disk can  
not be maintained without missing a motor revolution. For Write commands with Write Caching enabled  
the likelihood is increased that shorter transfers can fulfill the requirements needed to maintain continuous  
writing to the disk.  
Back-to-back Read is only enabled if Read-ahead is disabled.  
3.4.8 Out of Order Transfers  
Two bits in the SCSI Command message control out of order transfers. OOTM applies to transfers to/from  
the media and OOTI applies to transfers to/from the interface (SSA Link).  
The benefit from setting OOTM increases as the transfer length approaches one disk revolution. This affects  
both reads and writes and is due to the reduction in latency.  
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The full benefit of out of order transfers in only achieved if OOTI is also set. Read data is transferred on the  
interface in the same order as it was read from the media.  
3.5 Skew  
3.5.1 Cylinder to Cylinder Skew  
Cylinder skew is the sum of the sectors required for physically moving the heads (csms), which is a function  
of the formatted block length and recording density (notch #), and reassign allowance sectors (ras = 3) used  
to maintain optimum performance over the normal life of the drive.  
Note: The values in the Mode Page 3 'Cylinder Skew Factor' are notch specific non-synchronized spindle  
mode values. The value for notch 1 is returned when the Active Notch is set to 0.  
Notch #  
User bytes / logical  
block  
1
2
3
4
5
6
7
8
9
10  
256  
512  
520  
522  
524  
528  
600  
688  
744  
42  
28  
26  
26  
26  
26  
24  
22  
21  
42  
28  
26  
26  
26  
26  
24  
22  
21  
42  
27  
26  
26  
26  
26  
24  
22  
21  
40  
26  
26  
25  
25  
25  
23  
21  
20  
38  
25  
24  
24  
24  
24  
22  
20  
20  
36  
24  
24  
24  
24  
24  
22  
20  
20  
36  
24  
23  
23  
23  
23  
21  
20  
18  
36  
23  
22  
22  
22  
22  
20  
20  
18  
36  
22  
22  
22  
22  
22  
20  
18  
17  
32  
21  
21  
20  
20  
20  
20  
18  
17  
Note: Contact an IBM Customer Representative for values at other formatted block lengths.  
Table 8. Optimal Cylinder Skew for several block lengths  
In order to increase the likelihood that equivalent LBA's on two or more devices are located at the same  
relative physical position when the devices are used in a synchronized spindle mode, cylinder skew is calcu-  
lated differently. The cylinder skew calculations do not take into account known defective sites. To prohibit  
revolutions from being missed on cylinder crossings by drives formatted while in a synchronized spindle  
mode, an extra allowance for 6 defects is added that is not added when optimally formatted in a non-  
synchronized mode.  
3.5.2 Track to Track Skew  
Note: The values in the SCSI Mode Page 3 'Track Skew Factor' are notch specific values. The value for  
notch 1 is returned when the Active Notch is set to 0.  
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Notch #  
User bytes / logical  
block  
1
2
3
4
5
6
7
8
9
10  
256  
512  
520  
522  
524  
528  
600  
688  
744  
20  
13  
12  
12  
12  
12  
11  
10  
9
20  
13  
12  
12  
12  
12  
11  
10  
9
20  
13  
12  
12  
12  
12  
11  
10  
9
19  
12  
12  
12  
12  
12  
11  
10  
9
19  
12  
11  
11  
11  
11  
10  
9
17  
11  
11  
11  
11  
11  
10  
9
17  
11  
10  
10  
10  
10  
10  
9
17  
10  
10  
10  
10  
10  
9
17  
10  
10  
10  
10  
10  
9
15  
10  
10  
9
9
9
9
9
8
8
9
9
8
8
8
7
Note: Contact an IBM Customer Representative for values at other formatted block lengths.  
Table 9. Track (or Head) Skew for several block lengths  
3.6 Idle Time Functions  
The execution of various functions by the drive during idle times may result in delays of commands  
requested by initiators. ‘Idle time’ is defined as time spent by the drive not executing a command requested  
by a initiator. The functions performed during idle time are:  
1. Servo Run Out Measurements  
2. Servo Bias Measurements  
3. Predictive Failure Analysis (PFA)  
4. Channel Calibration  
5. Save Logs and Pointers  
6. Disk Sweep  
The command execution time for commands received while performing idle time activities may be increased  
by the amount of time it takes to complete the idle time activity. The messages and data exchanged across  
the SSA link are not affected by idle time activities.  
Note: Command Timeout Limits do not change due to idle time functions.  
All Idle Time Functions have mechanisms to lessen performance impacts for critical response time periods of  
operation. And in some cases virtually eliminate those impacts from an Initiator's point of view. All Idle  
Time Functions will only be started if the drive has not received a SCSI command for at least 5 seconds (40  
seconds for Sweep). This means that multiple SCSI commands are accepted and executed without delay if  
the commands are received by the drive within 5 seconds after the completion of a previous SCSI command.  
This mechanism has the benefit of not requiring special system software (such as issuing SCSI Rezero Unit  
commands at known & fixed time intervals) in order to control if and when this function executes.  
Note: Applications which can only accommodate Idle Time Function delays at certain times, but can not  
guarantee a 5 second re-instruction period, may consider synchronizing idle activities to the system needs  
through use of the LITF bit in Mode Select Page 0, and the Rezero Unit command. Refer to the Ultrastar  
XP (DFHC) SSA Models Interface Specification for more details  
Following are descriptions of the various types of idle functions, how often they execute and their duration.  
Duration is defined to be the maximum amount of time the activity can add to a command when no errors  
occur. No more than one idle function will be interleaved with each command.  
Following the descriptions is a summary of the possible impacts to performance.  
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3.6.1 Servo Run Out Measurements  
The drive periodically measures servo run out, the amount of wobble on each disk, to track follow more  
precisely.  
Servo run out for all heads is measured every 60 minutes, therefore the frequency of run out measurements is  
dependent on the number of heads a particular model has. The drive attempts to spread the measurements  
evenly in time and each measurement takes 100 milliseconds. For example, a model C4x with 8 heads per-  
forms one run out measurement every 7 1/2 minutes (60 / 8).  
3.6.2 Servo Bias Measurements  
The drive periodically measures servo bias, the amount of resistance to head movement as a function of disk  
radius. It also helps prevent disk lubrication migration by moving the heads over the entire disk surface.  
Servo bias is measured every 12 minutes during the first hour after a power cycle, and every 60 minutes after  
that. The measurement takes 200 milliseconds.  
3.6.3 Predictive Failure Analysis  
Predictive Failure Analysis measures drive parameters and can predict if a drive failure is imminent.  
Eight different PFA measurements are taken for each head. All measurements for all heads are taken over a  
period of 4 hours, therefore the frequency of PFA is dependent on the number of heads a particular model  
has. The drive attempts to spread the measurements evenly in time and each measurement takes about 80  
milliseconds. For example, a C4x model with 8 heads will perform one PFA measurement every 3.7  
minutes (240 / 8 × 8). For the last head tested for a particular measurement type (once every 1/2 hour), the  
data is analyzed and stored. The extra execution time for those occurrences is approximately 40 millisec-  
onds.  
This measurement/analysis feature can be disabled for critical response time periods of operation by setting  
the Page 0h Mode Parameter LITF = 1. The using system also has the option of forcing execution at  
known times by issuing the Rezero Unit command if the Page 0h Mode Parameter TCC = 1. All tests for  
all heads occur at those times.  
Note: Refer to the Ultrastar XP (DFHC) SSA Models Interface Specification for more details about PFA,  
LITF, and TCC.  
3.6.4 Channel Calibration  
The drive periodically calibrates the channel to insure that the read and write circuits function optimally,  
thus reducing the likelihood of soft errors.  
Channel calibration is done once every 4 hours and typically completes in 20 milliseconds, but may take up  
to 64 milliseconds per measurement.  
The measurement will only be started if the drive has not received a command for at least 5 seconds. This  
means that multiple commands are accepted and executed without delay if the commands are received by the  
drive within 5 seconds after the completion of a previous command. This function also makes use of the  
mechanism to alter the idle detection period to limit execution for critical response time periods of operation,  
if needed.  
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3.6.5 Save Logs and Pointers  
The drive periodically saves data in logs in the reserved area of the disks. The information is used by the  
drive to support various commands and for the purpose of failure analysis.  
Logs are saved every 35 minutes. The amount of time it takes to update the logs varies depending on the  
number of errors since the last update. In most cases, updating those logs and the pointers to those logs will  
occur in less than 30 milliseconds.  
3.6.6 Disk Sweep  
The heads are moved to another area of the disk if the drive has not received a command for at least 40  
seconds. After flying in the same spot for 9 minutes, the heads are moved to another position. Execution  
time is less than 1 full stroke seek.  
3.6.7 Summary  
Idle Time Function Type  
Max. Frequency of Occurrence  
(minutes)  
Duration (ms)  
Mechanism to Delay/Disable  
Servo Run Out  
60/(trk/cyl)  
100  
200  
200  
80  
Re-instruction Period  
Re-instruction Period  
Re-instruction Period  
Re-instruction Period / LITF  
Re-instruction Period  
Re-instruction Period  
Servo Bias ( < 1st hour)  
Servo Bias ( > 1st hour)  
PFA  
12  
60  
30/(trk/cyl)  
Channel Calibration  
Save Logs & Pointers  
240  
35  
64  
30  
Note: "Re-instruction Period" is the time between consecutive SCSI command requests.  
Table 10. Summary of Idle Time Function Performance Impacts  
3.7 Command Timeout Limits  
The 'Command Timeout Limit' is defined as the time period from when the SCSI_command message is  
received by the drive until the corresponding SCSI_status message is transmitted by the drive.  
The following times are for environments where Automatic Reallocation is disabled and there are no queued  
commands.  
Reassignment Time: The drive should be allowed a minimum of 45 seconds to complete a "Reassign  
Blocks" command.  
Format Time: The time to complete a "Format Unit" command (with Immed bit = 0) varies by model:  
C4x 45 minutes  
C2x 25 minutes  
C1x 15 minutes  
Initiators should also use this time to allow format sequences initiated by "Format Unit" commands (with  
Immed bit = 1) to compete and place the drive in a "ready for use" state.  
Start/Stop Unit Time: The drive should be allowed a minimum of 30 seconds to complete a "Start/Stop  
Unit" command (with Immed bit = 0).  
Initiators should also use this time to allow start-up sequences initiated by auto start ups and "Start/Stop  
Unit" commands (with Immed bit = 1) to complete and place the drive in a "ready for use" state.  
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Note: A timeout of one minute or more is recommended but NOT required. The larger system timeout  
limit allows the system to take advantage of the extensive ERP/DRP that the drive may attempt in order to  
successfully complete the start-up sequence.  
Note: A 60 second minimum is required if electronics card replacement is required as a service practice.  
Please contact an IBM Customer Representative for more details if required.  
Medium Access Command Time: The timeout limit for medium access commands that transfer user data  
and/or non-user data should be a minimum of 30 seconds. These commands are:  
Log Select  
Log Sense  
Mode Select  
Mode Sense  
Pre-Fetch  
Read  
Read Defect Data  
Read Long  
Receive Diagnostic Results  
Release  
Reserve  
Rezero Unit  
Seek  
Send Diagnostic  
Verify  
Write  
Write and Verify  
Write Buffer  
Write Long  
Write Same  
Read Capacity  
Note: The 30 sec limit assumes the absence of SSA link contention and user data transfers of 64 blocks or  
less. This time should be adjusted for anticipated SSA link contention and if longer user data transfers are  
requested.  
Timeout limits for other commands: The drive should be allowed a minimum of 5 seconds to complete  
these commands:  
Format Unit (with Immed bit = 1)  
Inquiry  
Read Buffer  
Request Sense  
Start/Stop Unit (with Immed bit = 1)  
Synchronize Cache  
Read Memory  
Test Unit Ready  
When Automatic Reallocation is enabled add 45 seconds to the timeout of the following commands: Read  
(6), Read (10), Write (6), Write (10), Write and Verify, and Write Same.  
The command timeout for a command that is not located at the head of the command queue should be  
increased by the sum of command timeouts for all of the commands that are performed before it is.  
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4.0 Mechanical  
4.1 Small Form Factor Models (CxC)  
4.1.1 Weight and Dimensions  
C1C & C2C Models  
C4C Models  
U.S.  
S.I. Metric  
U.S.  
S.I. Metric  
Weight  
Height  
Width  
Depth  
1.00 pounds  
1.00 inches  
4.00 inches  
5.75 inches  
0.46 kilograms  
25.4 millimeters  
101.6 millimeters  
146.0 millimeters  
1.80 pounds  
1.63 inches  
4.00 inches  
5.75 inches  
0.82 kilograms  
41.3 millimeters  
101.6 millimeters  
146.0 millimeters  
4.1.2 Clearances  
A minimum of 2 mm clearance should be given to the bottom surface except for a 10 mm maximum diam-  
eter area around the bottom mounting holes. Figure 11 and Figure 12 show the clearance requirements  
(Note 1). For proper cooling it is suggested that a clearance of 6 mm be provided under the drive and on  
top of the drive.  
There should be 7 mm of clearance between drive's that are mounted with their top sides (see Figure 22 on  
page 78 for top view of drive) facing each other.  
4.1.3 Mounting  
The drive can be mounted with any surface facing down.  
The drive is available with both side and bottom mounting holes. Refer to Figure 11 to Figure 13 for the  
location of these mounting holes for each configuration.  
The maximum allowable penetration of the mounting screws is 3.8 mm.  
The torque applied to the mounting screws must be 0.8 Newton-meters ± 0.1 Newton-meters.  
The recommended torque to be applied to the mounting screw is 0.8 Newton-meter ± 0.4 Newton-meter.  
IBM will provide technical support to users that wish to investigate higher mounting torques in their appli-  
cation.  
WARNING: The drive may be sensitive to user mounting implementation due to frame distortion effects.  
IBM will provide technical support to assist users to overcome mounting sensitivity.  
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notes: 1) Bottom clearance required by 4.1.2, “Clearances.”  
2) Dimensions are in millimeters.  
Figure 11. Location of Side Mounting Holes of C1C & C2C Models  
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notes: 1) Bottom clearance required by 4.1.2, “Clearances” on page 51.  
2) Dimensions are in millimeters.  
Figure 12. Location of Side Mounting Holes of C4C Models  
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notes:  
1) The purpose of this drawing is to show the bottom hole pattern.  
2) Dimensions are in millimeters.  
Figure 13. Location of Bottom Mounting Holes of CxC Models  
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4.1.4 Unitized Connector Locations  
The Unitized connector is located on the left side of the top view (bottom drawing) as shown in Figure 14  
on page 56. The jumper connector is located on the right side of the top view (bottom drawing) as shown  
in Figure 14 on page 56. This jumper connector is referred to as Front Jumper because of its front  
location. It is reserved for IBM Engineering used only.  
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Figure 14. Electrical connectors (rear and top view) -- CxC Models.  
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4.2 Carrier Models (CxB)  
The carrier model assemblies include the disk drive, drawer mounting hardware (rails, latching mechanism,  
and connector), and DC/DC power converter.  
4.2.1 Weight and Dimensions  
C1B & C2B Models  
C4B Models  
U.S.  
S.I. Metric  
U.S.  
S.I. Metric  
Weight  
Height  
Width  
Depth  
2.00 pounds  
1.75 inches  
4.26 inches  
10.72 inches  
0.92 kilograms  
44.5 millimeters  
108.3 millimeters  
272.3 millimeters  
2.80 pounds  
1.75 inches  
4.26 inches  
10.72 inches  
1.288 kilograms  
44.5 millimeters  
108.3 millimeters  
272.3 millimeters  
Refer to Figure 15 on page 58 for detailed dimensions.  
4.2.2 Clearances  
For proper cooling, a clearance of 6 millimeters should be provided above and below the carrier surfaces.  
Adequate airflow is needed in order to meet the operating specifications. Maximum temperatures are speci-  
fied for critical drive components in Table 15 on page 78.  
4.2.3 Mounting  
The drive can be mounted with any surface facing down.  
The carrier is designed to be plugged into an auto-docking assembly. The auto-docking assembly contains  
an electrical receptacle that provides connections for DC power, SSA interface signals, and fault sensing and  
reporting signals (see 5.2, “Carrier Connector” on page 64). The carrier design allows for positive retention  
of the carrier in all axes when plugged into the auto-docking assembly. In addition, the carrier retention  
provides a force to bottom out the carrier auto-docking connector into the auto-docking assembly and main-  
tain a force of 5 pounds minimum, 40 pounds maximum.  
The mating connector should contain two guide pins to align the carrier receptacle during seating. These  
guide pins are BERG part number 77693-014 (IBM part number 72G0343) or AMP equivalent part number  
1-532808-1 (IBM part number 19G6789). The guide pin length should be 26.04 millimeters while the thread  
depth depends upon the thickness of the circuit board the connector is mounted to. The guide pins should  
be tied to the docking assembly frame ground.  
Note: The connector pins must be lubricated to insure seating of the carrier into the auto-docking assembly.  
The type of lubricant recommended is Stauffer CL-920 or equivalent.  
WARNING: The drive may be sensitive to user mounting implementation due to frame distortion effects.  
IBM will provide technical support to assist users to overcome mounting sensitivity.  
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Note: Dimensions are in millimeters.  
Figure 15. Dimensions —CxB Models  
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Figure 16. Handle Docking and Ejection System  
The handle on the carrier is used for insertion into and extraction from the drawer. It also provides enough  
force to ensure seating of the carrier electrical receptacle with the mating connector. Referring to Figure 16,  
with the handle in the STOP or open position, a carrier inserted into the auto-docking assembly will have  
the connector guide pins inserted into the carrier receptacle but the connector pins will not be making  
contact with the carrier receptacle. Moving the carrier handle to the CAM IN position and eventually to the  
LOCKED position sets the auto-docking connector with the carrier receptacle and holds the carrier in all the  
mounting positions listed above. Moving the handle from the LOCKED position to the EJECT position  
provides leverage via the cam surface on the handle acting against the side rails to separate the connector  
pins from the receptacle.  
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4.2.4 Auto-docking Assembly Side Rails  
IBM supplied side rails that can be used for the auto-docking assembly are shown in Figure 17 on page 61  
along with mounting location information. Refer to the figure for the following notes:  
Note 1: With the side rails mounted within the given tolerances, there will be a nominal 1.5 millimeter  
interference between the handle and side rail to provide positive retention of the carrier and the  
handle.  
Note 2: The IBM part number of the auto-docking side rails is 36G6422.  
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Figure 17. Side Rail Positioning  
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4.2.5 Electrical Connector and Indicator Locations  
The HPC electrical connectors are located as shown in Figure 15 on page 58. The indicators (LEDs) are  
located as shown in Figure 18 on page 62.  
Figure 18. LED Locations (front view) —CxB Models.  
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5.0 Electrical Interface  
5.1 SSA Unitized Connector  
Electrical connections for CxC models are provided by a single connector mounted on the rear of the drive  
(see Figure 14 on page 56). Connections are provided for two SSA ports, fault sensors and indicators,  
option customization, and power. Refer to Figure 19 and Table 11 on page 64 for contact assignments.  
Figure 19. Unitized Connector (looking in the file at the connector end)  
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Pin  
SSA PORT  
SSA PORT  
OPTION PORT  
POWER PORT  
1
+ Line Out  
+ Line Out  
- MTM  
+ 12V Charge  
(long)  
2
- Line Out  
Gnd (long)  
Gnd (long)  
- Line In  
+ Line In  
N/A  
- Line Out  
Gnd (long)  
Gnd (long)  
- Line In  
+ Line In  
N/A  
- Auto Start  
- Sync  
+ 5V Charge (long)  
Gnd (long)  
+ 12V  
3
4
- Write Protect  
Gnd (long)  
- Device Activity  
+ 5V  
5
+ 12V  
6
+ 12V  
7
Gnd (long)  
Gnd (long)  
+ 5V  
8
N/A  
N/A  
- Device Fault  
Programmable 1  
Programmable 2  
N/A  
9
N/A  
N/A  
10  
11  
12  
13  
14  
15  
16  
N/A  
N/A  
+ 5V  
N/A  
N/A  
- Power Fail  
GND (long)  
+ 3.3V  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
+ 3.3V  
N/A  
N/A  
N/A  
Gnd (long)  
Gnd (long)  
N/A  
N/A  
N/A  
Table 11. Electrical Connector Contact Assignments —CxC Models  
5.2 Carrier Connector  
Electrical connections for CxB models are provided by a single 128 pin connector mounted on the rear of  
the drive (see Figure 15 on page 58 for location). Connections are provided for two SSA ports, fault  
sensors and indicators, and power. The receptacle used is a 4×32, female contact, BERG HPC connector,  
IBM part number 99F9429. Refer to Figure 20 and Table 12 on page 65 for contact assignments.  
Figure 20. Carrier Interface Receptacle  
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Row  
1
A
B
C
D
n/c  
n/c  
n/c  
n/c  
2
n/c  
n/c  
n/c  
n/c  
3
n/c  
n/c  
n/c  
n/c  
4
n/c  
n/c  
n/c  
n/c  
5
n/c  
n/c  
n/c  
n/c  
6
n/c  
n/c  
n/c  
n/c  
7
n/c  
n/c  
n/c  
Device Fault (*)  
8
+38V Source A  
+38V Source A  
+38V Source A  
+38V Source A  
9
+38V Source A  
+38V Source A  
+38V Source A  
+38V Source A  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
Note:  
Ground  
Ground  
Ground  
Ground  
Ground  
Ground  
Ground  
Ground  
+38V Source B  
+38V Source B  
+38V Source B  
+38V Source B  
+38V Source B  
n/c  
+38V Source B  
n/c  
+38V Source B  
n/c  
+38V Source B  
n/c  
n/c  
n/c  
n/c  
n/c  
n/c  
n/c  
n/c  
n/c  
Shield  
+ Out 1  
Out 1  
Shield  
+ In 1  
In 1  
Shield  
n/c  
Shield  
+ Out 1  
Out 1  
Shield  
+ In 1  
In 1  
Shield  
n/c  
Shield  
+ In 2  
In 2  
Shield  
+ Out 2  
Out 2  
Shield  
n/c  
Shield  
+ In 2  
In 2  
Shield  
+ Out 2  
Out 2  
Shield  
n/c  
n/c  
n/c  
n/c  
n/c  
n/c  
n/c  
n/c  
n/c  
n/c  
n/c  
n/c  
n/c  
n/c  
n/c  
n/c  
n/c  
n/c  
n/c  
n/c  
n/c  
n/c  
n/c  
n/c  
n/c  
n/c  
n/c  
n/c  
n/c  
n/c  
n/c  
n/c  
n/c  
"n/c" means "no connection" (not used).  
(*) means pin is reserved for this function but model CxB does not provide connection to support it.  
Table 12. Electrical Connector Contact Assignments —CxB Models  
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5.3 SSA Link Cable  
The SSA link cable must meet the specifications described in the Electrical Specifications section of Serial  
Storage Architecture SSA-PH (Transport Layer), X3T10.1/94-015 rev 01.  
5.4 SSA Link Electrical Characteristics  
The drive SSA link line driver, line receiver, and line receiver termination are fully compliant with the specifi-  
cations described in the Electrical Specifications section of Serial Storage Architecture SSA-PH (Transport  
Layer), X3T10.1/94-015 rev 01.  
5.5 Option Pins and Indicators  
Ultrastar XP SSA drives contain option pins and/or indicators used to sense and report fault conditions, and  
to enable certain features of the drive. The electrical characteristics and requirements of these pins are fully  
compliant with the specifications described in the Electrical Specification section of Serial Storage Architec-  
ture SSA-PH (Transport Layer), X3T10.1/989D rev 01. The existence and definition of these pins are model  
dependent. Refer to Figure 14 on page 56 and Figure 18 on page 62 for locations of pins and LEDs on  
the front of the drive. Refer to Table 11 on page 64 and Table 12 on page 65 for locations of pins on the  
rear of the drive.  
5.5.1 - Manufacturing Test Mode (Option Port Pin 1)  
A low active input pin, that when active (pulled below .8V) makes pins 2, 3, 4, 6, 8 ,9 and 10 available to  
be redefined. Pins 5 and 7 must remain Ground and + 5 V respectively. One possible purpose for this pin is  
to allow a manufacturing tester to redefine the option pins to whatever functions it desires, while allowing  
the shipped product to return to the standard definitions in the customers environment. All models (CxC  
and CxB) reserve this pin but it is not connected to any internal logic.  
5.5.2 - Auto Start Pin (Option Port Pin 2)  
A low active input pin, that when active (pulled below 0.8 V) on CxC model causes the drive motor to spin  
up and become ready for media access operations after power is applied without the need to receive a  
Start/Stop Unit command. When inactive (pulled above 2.0 V), the drive motor shall not spin up until after  
the receipt of a Start/Stop Unit command. The signal is to be sampled by the device at power on, or hard  
reset or soft reset conditions. Refer to the "Option Pins" section of the Ultrastar XP (DFHC) SSA Models  
Interface Specification for a detailed functional description of operations associated with this pin.  
This pin is not accessible on CxB models.  
5.5.3 - Sync Pin (Option Port Pin 3)  
The Sync input/output pin on CxC model can be used for synchronizing among devices. The synchroniza-  
tion is achieved by having one device uses this pin as output to transmit one sync character once per its  
spindle revolution. The other node may use this pin as an input and synchronize their spindle revolution  
position to match the Sync signal. The SSA network provide Sync character over SSA link, but this option  
pin allows synchronization across multiple SSA networks, or allow tighter latency of the Sync pulse. Refer to  
Figure 21 on page 70 for examples of Synchronization connection.  
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The width, period, and tolerance of the negative active Sync pulse is manufacturer dependent, and thus syn-  
chronization across different manufacturers or even different product lines of the same manufacturer is not  
guaranteed. The Sync pin usage is controlled by mode pages within the mode select command.  
This pin is not accessible on CxB model.  
5.5.4 - Write Protect (Option Port Pin 4)  
a low active input pin, that when active (pulled below 0.8 V), the drive will prohibit commands that alter the  
customer data area portion of the the media from being performed. The state of this pin is monitored on a  
per command basis. Refer to "Option pins" section of the Ultrastar XP (DFHC) SSA Models Interface  
Specification for a detailed functional description of this pin.  
This pin is not accessible on CxB models.  
5.5.5 - Ground long (Option Port Pin 5)  
The Ground long output pin on CxC and CxB models shall be capable of syncing 1.0 Amp of current. This  
pin is longer than any others in the option block to allow for the ground to mate first or last in a hot-plug or  
hot-unplug situation.  
5.5.6 - Device Activity Pin/Indicator (Option Port Pin 6)  
A low active LED output pin on CxC models can be used to drive an external Light Emitting Diode. CxB  
models have an integrated Green LED. Refer to the "Option Pins" section of the Ultrastar XP (DFHC)  
SSA Models Interface Specification for a detailed functional description of this pin/LED.  
CxC models provide up to 24 mA of TTL level LED sink current capability. Current limiting for the LED  
is provided on the electronics card. The anode may be tied to the + 5 V power source (provided on the the  
unitized connector). The LED Cathode is then connected to the Device Activity pin to complete the circuit.  
5.5.7 + 5V (Option Port Pin 7)  
The + 5V output pin on CxC and CxB models shall supply up to 1.0 Amp of current limited + 5 V ( + / -  
10%), as long as power is supplied to the device.  
5.5.8 - Device Fault Pin/Indicator (Option Port Pin 8)  
The Device Fault pin on CxC models can be used to drive an external Light Emitting Diode. CxB models  
have an integrated Amber LED. Refer to the "Option Pins" section of the Ultrastar XP (DFHC) SSA  
Models Interface Specification for a detailed functional description of this pin/LED.  
CxC models provide up to 24 mA of TTL level LED sink current capability. Current limiting for the LED  
is provided on the electronics card. The anode may be tied to the + 5 V power source (provided on the the  
unitized connector). The LED Cathode is then connected to the Device Fault pin to complete the circuit.  
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5.5.9 Programmable pin 1 (Option Port Pin 9)  
This pin can be used by a manufacturer for what ever purposes it desires within the specified definition,  
electrical characteristic and the availability of microcode. This pin is completely controlled by microcode.  
Refer to the "Option Pins" section of the Ultrastar XP (DFHC) SSA Models Interface Specification for a  
detailed functional description of this pin.  
This pins is not accessible externally on CxB models.  
5.5.10 Programmable pin 2 (Option Port Pin 10)  
This pin is reserved and it is not connected to any internal logic.  
This pins is not accessible externally on CxB models.  
5.5.11 - Early Power Off Warning or Power Fail (Power Port Pin 11)  
The Early Power Off Warning input pin on CxC models can be used to indicate to the drive that a power  
loss will occur by pulling this signal to ground. The input must provide a minimum of 6 milliseconds  
warning before power falls below operating specifications in order for the drive to stop its activities and  
handle the fault. Refer to the "Option Pins" section of the Ultrastar XP (DFHC) SSA Models Interface  
Specification for a detailed functional description of the fault handling associated with this pin..  
This pin is not accessible on CxB models.  
5.5.12 12V Charge and 5V Charge (Power Port pin 1 and 2)  
These pins are longer than the others. They help to reduce current spikes during hot plug. Each pin require a  
resistor (not in the drive) in series between the power source and the drive connector. This allows for more  
controlled current draw as prior to other voltage pins. It is up to the subsystem to determine the proper  
resistance to add to these pins to meet the + / - 10% voltage drop limitations and the current draw limitation  
of the connector.  
These pins are not accessible on CxB models  
5.6 Front Jumper Connector  
All models contain a jumper block (refer to Figure 14 on page 56) that is reserved for IBM Engineering use  
only.  
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5.7 Spindle Synchronization  
5.7.1 Synchronization overview  
Spindle synchronization of drives is achieved by one node transmitting a special Sync character or a Sync  
pulse once per every revolution of its drive. The transmitting is done either on SSA Link (sending Sync  
character) or on a hard-wire (Sending Sync pulse) that connects all the drives via the SSA Option Port  
'Sync' pin. The synchronization mode is controlled by the RPL field of the Mode Select Page 04h parameter  
(see Ultrastar XP (DFHC) SSA Models Interface Specification for more details). The drive can operate in  
one of three modes:  
5.7.2 Synchronization Mode  
Mode  
Operation  
No Sync  
Slave Sync  
Spindle synchronization is disabled.  
Spindle synchronization is attempted by synchronizing the spindle motor to the Sync  
special character on SSA link (or the Sync pulse on Sync hard-wire) that is driven by  
another node.  
Master Sync  
Spindle synchronization is not attempted by this device. It generates a Sync special  
character via SSA link (or a Sync pulse via a hard-wire) once per its spindle revo-  
lution.  
Master Sync Control Master Sync Control is not supported.  
5.7.3 Synchronization time  
It will take 6 seconds to synchronize the Slave drive to the Master drive. While the Slave drive is synchro-  
nizing to these characters, it is not able to read or write data. Once synchronized the drive will maintain ±  
20 microseconds synchronization tolerance.  
When operating in Slave Sync mode, the drive must receive the Spindle Sync special characters at a period of  
8.333 milliseconds with a tolerance of ± .025% (2.08 microseconds).  
5.7.4 Synchronization with Offset  
The Rotational Offset value is the amount of rotational skew that the Target uses when synchronized. The  
rotational skew is applied in the retarded direction (lagging the synchronized spindle master control). The  
value in the field is the numerator of a fractional multiplier that has 256 as its denominator (e.g., a value of  
128 indicates a one-half revolution skew). A value of 00h indicates that rotational offset is not used. The  
rotational offset is only used when the Drive is running in the Slave Sync RPL mode.  
5.7.5 Synchronization Route  
5.7.5.1 Over SSA Link  
Spindle Sync special characters are forwarded from one SSA link to the other with a delay of 350  
nanoseconds with a tolerance of ± 50 nanoseconds. This delay can be increased by 50 nanoseconds when  
the drive is sending the second of a double character sequence (RR or ACK) and by 50 nanoseconds when  
sending a SAT or SAT' character.  
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The spindle synchronization timing requirements are met in a string composed of Ultrastar XP SSA drives  
when there are no more than seventeen drives between the one operating in Master Sync mode and the  
furthest drive operating in Slave Sync mode.  
5.7.5.2 Over Sync Hard-wire  
There will be a single wire that connects all the drives together throught the SSA Option Port pin 3 (- Sync  
pin). One of these drives will be a Master drive. Two potential configurations of this hard-wire connection  
are shown in the following figures:  
Figure 21. Two examples of Daisy-Chain Connection of Synchronization  
.
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Termination  
Bus termination of the - SYNC signals is internal to the drive. This signal has a 5.1K ohm pulled-up to  
the + 5 volt supply. A maximum of 30 drives can have their - SYNC line daisy chained together. Vio-  
lating this could damage the Master drive line driver on the - SYNC line  
It is the using system's responsibility to provide the cable to connect the - SYNC line where needed, of  
the synchronized drives.  
Bus Characteristics  
maximum Bus length = 6 meters  
2 micro-second negative active pulse (when sourced by drive)  
minimum of 1 micro-second negative active pulse when externally sourced  
0.8 volts = valid low input  
2.2 volts = valid high input  
0.4 volts = low output  
Vcc volts = High output  
30 milli-amps = maximum output low level sink current  
The driver used for these two signal lines is a Open Drain buffer.  
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6.0 Reliability  
Note: The reliability projections are based on the conditions stated below. All of the SSA models will meet  
the projections as long as reliability operating conditions are not exceeded.  
6.1 Error Detection  
Error reporting 99%  
All detected errors excluding interface and BATs #1 (Basic Assur-  
ance Test) errors  
Error detection 99%  
FRU isolation = 100%  
To the device when the "Recommended Initiator Error Recovery  
Procedures" in the Ultrastar XP (DFHC) SSA Models Interface  
Specification are followed.  
No isolation to sub-assemblies within the device are specified.  
6.2 Data Reliability  
Probability of not recovering data  
10 in 1015 bits read  
Recoverable read errors  
10 in 1013 bits read (measured at nominal DC conditions and room  
environment with default error recovery —QPE**)  
Probability of miscorrecting unrecoverable data  
Note: Eighteen bytes of ECC and two bytes of LRC are provided for each data block.  
6.3 Seek Error Rate  
The drives are designed to have less than 10 errors in 10,000,000 seeks. In the field, a seek error rate of 40 in  
100, 000 seeks will trip PFA (Predictive Failure Analysis) error.  
The drives are designed to achieve Soft Seek Error rate of 1 error in 100,000,000 seeks.  
6.4 Power On Hours Examples:  
Maximum power on hours (with minimum power on/off cycles)  
43,800 hours for life based on:  
- 5 Power on/off cycles per month  
- 730 power on hours per month  
Nominal power on hours (with nominal power on/off cycles)  
30,000 hours for life based on:  
**  
Refer to Ultrastar XP (DFHC) SSA Models Interface Specification for the definition of QPE (Qualify Post Error).  
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- 25 Power on/off cycles per month  
- 500 power on hours per month  
6.5 Power on/off cycles  
Maximum on/off cycles  
1080/ year  
5 Years  
6.6 Useful Life  
Product Life  
Useful life is the length of time prior to the point at which product degradation begins to occur. The specifi-  
cation for the useful life calculation is the same as that for the *MTBF specification.  
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6.7 *Mean Time Between Failure (*MTBF)  
The mean time to failure target is 1,000,000 device hours per fail (3.0% CDF) based on the following  
assumptions:  
6000 power on hours per year (500 power on hours per month times 12 months)  
300 average on/off cycles per year (25 power cycles per month times 12 months)  
Seeking/Reading/Writing is assumed to be 20% of power on hours (Approximately 10 read/write oper-  
ations per second)  
Operating at or below the Reliability temperature specifications (See Table 15 on page 78) and nominal  
voltages (See 2.2, “Power Requirements by Model” on page 15)  
Note: *MTBF - is a measure of the failure characteristics over total product life. *MTBF includes normal  
integration induced, installation, early life (latent), and intrinsic failures. *MTBF is predicated on supplier  
qualification, product design verification test, and field performance data.  
6.7.1 Sample Failure Rate Projections  
The following tables are for reference only. The tables contain failure rate projections for a given set of user  
conditions. Similar projections will be provided, upon request, for each user specific power on hour and  
power cycles per month condition. Contact your IBM customer representative for a customized projection.  
Application  
Electronics only - (RA/MM)  
500POH/MM  
730POH/MM  
0.00120  
0.00160  
0.0010  
0.00096  
0.00125  
0.00036  
0.00047  
2.1%  
2.8%  
0.00140  
Table 13. Projected failure rates for the electronics only.  
Application  
Electronics and HDA - (RA/MM)  
500POH/MM  
730POH/MM  
0.00150  
0.00200  
0.00130  
0.00170  
0.00120  
0.00160  
0.00050  
0.00070  
3.0%  
4.1%  
Table 14. Projected failure rates for the entire drive. (Electronics and HDA).  
6.8 SPQL (Shipped product quality level)  
LA vintage  
.25%  
Ultimate (13th month)  
.10%  
Targets  
6.9 Install Defect Free  
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Install Defect Free percentage  
99.99 percent  
6.10 Periodic Maintenance  
None required  
6.11 ESD Protection  
The Ultrastar XP SSA disk drives contain electrical components sensitive to damage due to electrostatic  
discharge (ESD). Proper ESD procedures must be followed during handling, installation, and removal. This  
includes the use of ESD wrist straps and ESD protective shipping containers.  
6.12 Connector Insertion Cycles  
Live insertion and removal of the electrical connector causes pitting on the connector terminals. Because of  
this the number of live insertion and removal cycles must be limited.  
Maximum Insertion/Removal Cycles (for hot and normal insertion) 25  
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7.0 Operating Limits  
The IBM Corporate specifications and bulletins, such as C-S 1-9700-000 in the contaminants section, that  
are referenced in this document are available for review. (Please contact your IBM Customer)  
7.1 Environmental  
Temperature  
Operating Ambient  
Operating Casting Temperature  
Storage  
41 to 131˚F (5 to 55˚C)  
41 to 158˚F (5 to 70˚C)  
34 to 149˚F (1 to 65˚C) See Note  
-40 to 149˚F (-40 to 65˚C)  
Shipping  
Temperature Gradient  
Operating  
Shipping and storage  
36˚F (20˚C) per hour  
below condensation  
Humidity  
Operating  
Storage  
Shipping  
5% to 90% noncondensing  
5% to 95% noncondensing  
5% to 100% (Applies at the packaged level)  
Wet Bulb Temperature  
Operating  
Shipping and Storage  
80˚F (26.7˚C) maximum  
85˚F (29.4˚C) maximum  
Elevation  
Operating and Storage  
Shipping  
-1000 to 10,000 feet (-304.8 to 3048 meters)  
-1000 to 40,000 feet (-304.8 to 12,192 meters)  
Note: Guidelines for storage below 1˚C are given in IBM Technical Report TR 07.2112.  
7.1.1 Temperature Measurement Points  
The following is a list of measurement points and their temperatures (maximum and reliability). Maximum  
temperatures must not be exceeded at the worst case drive and system operating conditions with the drive  
randomly seeking, reading and writing. Reliability temperatures must not be exceeded at the nominal drive  
and system operating conditions with the drive randomly seeking, reading, and writing.  
There must be significant air flow through the drive so that the casting and module temperature limits define  
in Table 15 are not exceeded. Figure 22 on page 78 defines where measurements should be made to deter-  
mine the top casting temperature during drive operation. Figure 23 on page 79 identify the module  
locations on the bottom side of the card and the measurement location on the bottom of the casting.  
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Table 15. Maximum and Reliability Operating Temperature Limits  
Maximum  
Reliability  
Disk Enclosure Top  
Disk Enclosure Bottom  
PRDF Prime Module  
WD 61C40 Module  
SIC Module  
158˚F (70˚C)  
158˚F (70˚C)  
203˚F (95˚C)  
185˚F (85˚C)  
203˚F (95˚C)  
194˚F (90˚C)  
194˚F (90˚C)  
185˚F (85˚C)  
194˚F (90˚C)  
131˚F (55˚C)  
131˚F (55˚C)  
176˚F (80˚C)  
167˚F (75˚c)  
176˚F (80˚C)  
167˚F (75˚C)  
167˚F (75˚C)  
167˚F (75˚C)  
167˚F (75˚C)  
Microprocessor Module  
VCM FET  
DC/DC Converter (CxB only)  
SMP FET  
Note 1: Module temperature measurements should be taken from the top surface of the module.  
Note 2: If copper tape is used to attach temperature sensors, it should be no larger than 6 square milli-  
meters.  
notes: 1) dimensions are in millimeters.  
Figure 22. Temperature Measurement Points for All Models (top view of DE)  
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Notes:  
1) Center thermocouple on the top surface of the module.  
2) If copper tape is used to attach temperature sensors, it should be no  
larger than 6 mm square.  
3) Dimensions are in millimeters.  
4) The connector (on the left edge) does not represent SSA connector.  
Figure 23. Temperature Measurement Points for all Models (bottom view)  
7.2 Vibration and Shock  
The operating vibration and shock limits in this specification are verified in two mount configurations for  
CxC models:  
1. By mounting with the 6-32 bottom holes with the drive on 2 mm clearance as required by 4.1.2,  
“Clearances” on page 51  
2. By mounting on any two opposing pairs of the 6-32 side mount holes.  
CxB models are mounted rigidly to the test fixture using the carrier guides, connector, and latch mechanism.  
The test fixture is then mounted to the vibration table (the test fixture must not have any resonance within  
the frequencies tested).  
Other mount configurations may result in different operating vibration and shock performance.  
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7.2.1 Drive Mounting Guidelines  
The following guidelines may be helpful as drive mounting systems are being designed.  
1. Mount the drive to its carrier/rack using the four extreme side holes to ensure that the drive's center of  
gravity is as close as possible to the center of stiffness of the mounting.  
2. Do not permit any metal-to-metal impacts or chattering between the carrier/rack and the drive or  
between the carrier/rack and anything else. Metal-to-metal impacts create complex shock waveforms  
with short periods; such waveforms can excite high frequency modes of the components inside the drive.  
3. The carrier/rack should not allow the drive to rotate in the plane of the disk and the carrier/rack itself  
should be mounted so that it does not rotate in the plane of the disk when the drive is running. Even  
though the drive uses a balanced rotatory actuator, its position can still be influenced by rotational accel-  
eration.  
4. Keep the rigid body resonances of the drive away from harmonics of the spindle speed. Consider not  
only the drive as mounted on its carrier but also when the drive is mounted to a carrier and then the  
carrier is mounted in a rack, the resonances of the drive in the entire system must be considered.  
7200 RPM Harmonics: 120 hz, 240 hz, 360 hz, 480 hz, .....  
5. When the entire system/rack is vibration tested, the vibration amplitude of the drive as measured in all  
axis should decrease significantly for frequencies above 300 hz.  
6. Consider the use of plastics or rubber in the rack/carrier design. Unlike metal, these materials can  
dampen vibration energy from other drives or fans located elsewhere in the rack.  
7. Rather that creating a weak carrier/rack that flexes to fit the drive/carrier, hold the mounting gap to  
tighter tolerances. A flexible carrier/rack may contain resonances that cause operational vibration and/or  
shock problems.  
7.2.2 Output Vibration Limits  
spindle imbalance  
1.0 gram-millimeters maximum for C1x, C2x models  
1.5 gram-millimeters maximum for C4x model  
7.2.3 Operating Vibration  
The vibration is applied in each of the three mutually perpendicular axis, one axis at a time. Referring to  
Figure 24 on page 81, the x-axis is defined as a line normal to the front/rear faces, the y-axis is defined as a  
line normal to the left side/right side faces, and the z-axis is normal to the x-y plane.  
WARNING: The Ultrastar XP SSA drives are sensitive to rotary vibration. Mounting within using  
systems should minimize the rotational input to the drive mounting points due to external vibration.  
IBM will provide technical support to assist users to overcome problems due to vibration.  
Random Vibration  
For excitation in the x-direction and the y-direction, the drive meets the required throughput specifications  
when subjected to vibration levels not exceeding the V4 vibration level defined below.  
For excitation in the z-direction, the drive meets the required throughput specifications when subjected to  
vibration levels not exceeding the V4S vibration level defined below.  
Note: The RMS value in the table below is obtained by taking the square root of the area defined by the  
g²/hz spectrum from 5 to 500 hz.  
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Table 16. Random Vibration Levels  
Class 5 hz  
17 hz  
45 hz  
48 hz  
62 hz  
65 hz  
150 hz  
1.0E-3  
1.0E-3  
200 hz  
8.0E-5  
4.0E-5  
500 hz  
8.0E-5  
4.0E-5  
RMS  
0.56  
0.55  
g
V4  
2.0E-5 1.1E-3  
2.0E-5 1.1E-3  
1.1E-3  
1.1E-3  
8.0E-3  
8.0E-3  
8.0E-3  
8.0E-3  
1.0E-3  
1.0E-3  
V4S  
units  
g2/hz  
Swept Sine Vibration  
The drive will operate without hard errors when subjected to the swept sine vibration of 1.0 G peak from 5  
to 300 hz in the x- and y direction. For input in the z-direction, an input of 1.0 G peak amplitude can be  
applied from 5 hz to 250 hz, the amplitude at 300 hz is 0.5 G peak. Linear interpolation is used to deter-  
mine the acceleration levels between 250 hz and 300 hz.  
The test will consist of a sweep from 5 to 300 hz and back to 5 hz. The sweep rate will be one hz per  
second.  
Note: 1.0 G acceleration at 5 hz requires 0.78 inch double amplitude displacement.  
(The connector on the right edge does not represent SSA connector)  
Figure 24. Ultrastar XP SSA Drive Small Form Factor Assembly —CxC Models  
7.2.3.1 Nonoperating Vibration  
No damage will occur as long as vibration at the un-packaged drive in all three directions defined above does  
not exceed the levels defined in the table below. The test will consist of a sweep from 5 hz to 200 hz and  
back to 5 hz at a sweep rate of eight decades per hour.  
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Table 17. Non-operating Vibration Levels  
Frequency  
Amplitude  
5 hz to 7 hz  
0.8 inch DA  
7 hz to 200 hz  
2.0 G peak  
7.2.4 Operating Shock  
No permanent damage will occur to the drive when subjected to a 10 G half sine wave shock pulse of  
11 milliseconds duration.  
No permanent damage will occur to the drive when subjected to a 10 G half sine wave shock pulse of  
2 millisecond duration.  
The shock pulses are applied in either direction in each of three mutually perpendicular axis, one axis at a  
time.  
7.2.5 Nonoperating Shock  
Translational Shock  
No damage will occur if the un-packaged drive is not subjected to a square wave shock greater than a  
"faired" value of 35 Gs applied to all three axis for a period of 20 milliseconds, one direction at a time.  
No damage will occur if the un-packaged drive is not subjected to an 11 millisecond half sine wave shock  
greater than 70 Gs applied to all three axis, one direction at a time.  
No damage will occur if the un-packaged drive is not subjected to a 2 millisecond half sine wave shock  
greater than 125 Gs applied to all three axis, one direction at a time.  
Rotational Shock  
No damage will occur if the un-packaged drive is not subjected to an 11 millisecond half sine wave shock  
greater than 7,000 radians per second squared applied to all three axis, one direction at a time.  
No damage will occur if the unpackaged drive is not subjected to a 2 millisecond half sine wave shock  
greater than 15,000 radians per second squared applied to all three axis, one direction at a time.  
7.3 Contaminants  
The corrosive gas concentration expected to be typically encountered is Subclass G1; the particulate environ-  
ment is expected to be P1 of C-S 1-9700-000 (1/89).  
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7.4 Acoustic Levels  
Upper Limit Sound Power Requirements (Bels) for C1x & C2x Models  
Octave Band Center Frequency (Hz)  
A-weighted (see notes)  
125  
4.5  
4.5  
250  
3.5  
4.0  
500  
3.3  
3.6  
1K  
3.5  
4.1  
2K  
4.5  
4.8  
4K  
4.5  
4.8  
8K  
4.5  
4.5  
Maximum  
5.00  
Mean  
4.7  
Idle  
Operating  
5.25  
5.0  
Additionally, the population average of the sound pressure measured one meter above the center of the drive  
in idle mode will not exceed 36 dB.  
Upper Limit Sound Power Requirements (Bels) for C4x Models  
Octave Band Center Frequency (Hz)  
A-weighted (see notes)  
125  
4.6  
4.6  
250  
3.5  
4.0  
500  
3.3  
3.6  
1K  
3.5  
4.1  
2K  
4.5  
5.1  
4K  
4.8  
4.8  
8K  
4.8  
4.8  
Maximum  
Mean  
4.7  
Idle  
5.0  
5.3  
Operating  
5.0  
Additionally, the population average of the sound pressure measured one meter above the center of the drive  
in idle mode will not exceed 41 dBA.  
Notes:  
1. The above octave band and maximum sound power levels are statistical upper limits of the sound  
power levels. See C-B 1-1710-027 and C-S 1-1710-006 for further explanation.  
2. The drive's are tested after a minimum of 20 minutes warm-up in idle mode.  
3. The operating mode is simulated by seeking at a rate between 28 and 32 seeks per second.  
4. The mean of a sample size of 10 or greater will be less than or equal to the stated mean with  
95% confidence.  
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8.0 Standards  
8.1 Safety  
UNDERWRITERS LABORATORY (UL) APPROVAL:  
The product is approved as a Recognized Component for use in Information Technology Equipment  
according to UL 1950 (without any Code 3 deviations). The UL Recognized Component marking is  
located on the product.  
CANADIAN STANDARDS ASSOCIATION (CSA) APPROVAL:  
The product is certified to CAN/CSA-C22.2 No. 950-M89 (without any D3 deviations). The CSA  
certification mark is located on the product.  
INTERNATIONAL ELECTROTECHNICAL COMMISSION (IEC) STANDARDS  
The product is certified to comply to EN60950 (IEC 950 with European additions) by TUV Rheinland.  
The TUV Rheinland Bauart mark is located on the product.  
SAFE HANDLING:  
The product is conditioned for safe handling in regards to sharp edges and corners.  
ENVIRONMENT:  
IBM will not knowingly or intentionally ship any units which during normal intended use or foreseeable  
misuse, would expose the user to toxic, carcinogenic, or otherwise hazardous substances at levels above  
the limitations identified in the current publications of the organizations listed below.  
International Agency for Research on Cancer (IARC)  
National Toxicology Program (NTP)  
Occupational Safety and Health Administration (OSHA)  
American Conference of Governmental Industrial Hygienists (ACGIH)  
California Governor's List of Chemical Restricted under California Safe Drinking Water and Toxic  
Enforcement Act 1986 (also known as California Proposition 65)  
SECONDARY CIRCUIT PROTECTION REQUIRED IN USING SYSTEMS  
IBM has exercised care not to use any unprotected components or constructions that are particularly  
likely to cause fire. However, adequate secondary overcurrent protection is the responsibility of the user  
of the product. Additional protection against the possibility of sustained combustion due to circuit or  
component failure may need to be implemented by the user with circuitry external to the product. Over-  
current limit to the drive of 10 Amps or less should provide sufficient protection.  
8.2 Electromagnetic Compatibility (EMC)  
FCC Requirements  
Pertaining to the disk drive, IBM will provide technical support to assist users in complying with the  
United States Federal Communications Commission (FCC) Rules and Regulations, Part 15, Subpart J  
Computing Devices “Class A and B Limits”. Tests for conformance to this requirement are performed  
with the disk drive mounted in the using system.  
VDE Requirements  
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Pertaining to the disk drive, IBM will provide technical support to assist users in complying with the  
requirements of the German Vereingung Deutcher Elektriker (VDE) 0871/6.78, both the Individual  
Operation Permit (IOP) and the General Operation Permit (GOP) Limits.  
CSPR Requirements  
Pertaining to the disk drive, IBM will provide technical support to assist users in complying with the  
Comite International Special des Perturbations Radio Electriques (International Special Committee on  
Radio Interference) CISPR 22 “Class A and B Limits”.  
European Declaration of Conformity  
Pertaining to the disk drive, IBM will provide technical support to assist users in complying with the  
European Council Directive 89/336/ECC so the final product can thereby bear the “CE” Mark of Con-  
formity.  
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Bibliography  
1. Serial Storage Architecture SSA-PH (Transport  
Layer), X3T10.1/989-D_rev_01, January 19th,  
1994, Editor: John Scheible.  
4. Serial Storage Architecture SSA-SCSI-2 Protocol,  
UIG/95SP-9508_Revision_1, May 25th, 1995,  
Editor: Norman Apperley.  
2. Serial Storage Architecture SSA-SCSI (SCSI-2  
Mapping), SSA-UIG/93-036_rev_01, January 20th,  
1994, Editor: John Scheible.  
5. Ultrastar XP (DFHC) SSA Models Interface Spec-  
ification, AZ09-0100-04E, February 20th, 1995.  
6. Ultrastar XP (DFHC) SSA Models Produc Hard-  
3. Serial Storage Architecture SSA-PH (Transport  
Layer), UIG95PH-9509_Revision_1, June 19th,  
1995, Editor: Adge Hawes.  
ware Specification, RZ09-0104-04E, Jan 1 st 1994.  
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DSMAFP709E PAGE SEGMENT CADC3 EXCEEDS RIGHT PAGE BOUNDARY ON PA  
GE 58.  
DSMAFP709E PAGE SEGMENT CADC2 EXCEEDS RIGHT PAGE BOUNDARY ON PA  
GE 61.  

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