Philips Tea1104 User Manual

INTEGRATED CIRCUITS  
DATA SHEET  
TEA1104; TEA1104T  
Cost effective battery monitor and  
fast charge IC for NiCd and NiMH  
chargers  
1996 Feb 26  
Objective specification  
File under Integrated Circuits, IC03  
Philips Semiconductors  
Objective specification  
Cost effective battery monitor and fast  
charge IC for NiCd and NiMH chargers  
TEA1104; TEA1104T  
BLOCK DIAGRAM  
R
V
ref  
S
5
3
6
V
P
SUPPLY  
POR  
battery high  
protection  
OR  
8
fast  
LED  
trickle  
FILTER  
MODE  
LATCH  
CONTROL  
4
1
V
bat  
GND  
BATTERY  
FULL  
DETECTOR  
SAMPLE-  
AND-HOLD  
battery low  
protection  
TO  
trickle  
OR  
T
max  
TIMER  
T
TEA1104  
TEA1104T  
min  
T
OSCILLATOR  
cut-off  
2
7
MGE354  
NTC  
OSC  
Fig.1 Block diagram.  
3
1996 Feb 26  
Philips Semiconductors  
Objective specification  
Cost effective battery monitor and fast  
charge IC for NiCd and NiMH chargers  
TEA1104; TEA1104T  
PINNING  
SYMBOL  
PIN  
DESCRIPTION  
GND  
NTC  
1
2
ground  
handbook, halfpage  
GND  
NTC  
1
2
3
4
8
7
6
5
LED  
negative temperature coefficient  
resistor input  
OSC  
TEA1104  
VS  
3
4
5
6
7
8
stabilized supply voltage  
battery voltage sensing  
reference resistor  
positive supply voltage  
oscillator input  
V
P
V
s
Vbat  
Rref  
VP  
R
V
ref  
bat  
MGE353  
OSC  
LED  
Fig.2 Pin configuration.  
LED output  
Trickle charge is active if:  
– battery full is detected  
INTRODUCTION  
The operation of the TEA1104; TEA1104T is explained  
with the aid of the application diagram illustrated in Fig.7.  
– maximum time is exceeded  
– maximum cut-off temperature is exceeded after the  
initial phase.  
An application note (AN95085) is available describing the  
versatility of the TEA1104; TEA1104T.  
An external power current source charges the batteries via  
an electronic switch which is controlled by the TEA1104.  
The TEA1104 monitors the battery voltage. Fully charged  
batteries are detected when the battery voltage peaks. In  
fact, a voltage drop of 0.25% with respect to the top value  
is detected. Fast charging is initiated at ‘power on’ or at  
‘replaced batteries’. The switch is continuously on,  
providing that all protection levels are met. At battery full  
detection, the charge current is duty cycled to reduce the  
average charge current to a lower level, keeping the  
batteries fully charged but at he same time assuring long  
battery life. In Fig.3 the battery voltage during fast charge  
is plotted.  
Supply block  
For correct start-up, the IC supply current is limited to  
35 µA (typ.) until the start-up voltage of 6.4 V is reached  
(standby mode). Thereafter, the operating supply voltage  
VP has to be within the window of 5.45 to 11.5 V, meaning  
that there is no need for an external voltage regulator to  
supply the IC.  
The supply block delivers the following outputs:  
With the help of an external resistor (pin Rref), a  
reference current is obtained which defines the  
accuracy of all IC timing characteristics  
Externally available 4.25 V stabilized voltage source  
(Vsource). This source is used internally to supply a large  
part of the circuit and can be used to set the NTC biasing  
and to supply other external circuitry with a maximum  
current of 1 mA. Protection information is provided via  
VS, to design a dual LED indicator  
FUNCTIONAL DESCRIPTION  
A block diagram of the TEA1104; TEA1104T is illustrated  
in Fig.1  
Mode latch  
Power-on reset pulse resets all digital circuitry after a  
start or restart, due to an interrupted VS.  
The Mode latch determines if the system is in the fast or in  
the slow charge mode.  
Fast charge is active at:  
– power switch-on and battery connected  
– temperature between minimum and maximum value  
– battery insert  
1996 Feb 26  
4
Philips Semiconductors  
Objective specification  
Cost effective battery monitor and fast  
charge IC for NiCd and NiMH chargers  
TEA1104; TEA1104T  
The battery voltage is sensed each ‘cycle time’. The  
cycle time is defined as:  
Open battery protection  
When the rechargeable battery is removed, the output  
voltage Vbat will rise to a high level. The ‘open battery  
protection’ block will detect this voltage and the charge  
current will be switched off. A digital filter prevents false  
open battery protection. The open battery signal  
(Vbat > 3.6 V) must be present for a duration of at least  
4 clock pulses.  
– Tcycle = 2 exp16 × tosc  
The ‘inhibit time’ is the time that the charger current is  
disabled, after which the battery voltage is sensed in a  
currentless way.  
– tinhibit = 10 ×tosc  
Battery sampling takes one oscillator period for each  
cycle interval.  
Battery monitor  
– tsample = tosc  
One or two cell packs can be connected directly to Vbat  
(battery connection) without an external resistor divider. At  
larger cell packs the battery voltage must be scaled down  
to a voltage range of 0.81 to 3.6 V. It is also possible to  
take a tap on the chain of batteries. Battery full is  
recognized by voltage peak detection (Vpeak), meaning a  
decrease of 0.25% (typ.) with respect to the top value.  
Keeping in mind a battery voltage range of 0.81 to 3.6 V  
and an accuracy of 10% at Vbat = 2.4 V for battery full  
detection, means that the internal ADC has to be 13 bits.  
Several filters are included to prevent false full detection.  
The series resistance of the battery and battery connection  
can cause battery voltage fluctuations and therefore it is  
necessary to stop the charging before sensing; this is  
called the ‘inhibit time’. This will be performed  
The ‘disable time’ is present to correct start-up with flat  
or polarized batteries. During the disable time, the  
battery full detection is not active.  
– tdisable = 2 exp 5 × time-out  
The timer is reset by battery full detection, but is on hold  
during the temperature and battery-low protection modes.  
Temperature protection block  
Temperature sensing is achieved by using a cheap  
thermistor. Two temperature windows are built in:  
If the temperature at power-on reset is above the  
maximum temperature protection level, the trickle  
charge current is active. The same applies for  
temperatures below the minimum temperature. Fast  
charging starts when the temperature is in between the  
minimum and the maximum temperature levels.  
automatically via the regulation output pin LED. The  
charging is stopped for ten oscillator periods at the end of  
which sampling is performed. The battery voltage will now  
be sensed in a currentless way.  
If the temperature is between the maximum and  
minimum temperature at power-on reset, the fast charge  
current level is active. If the temperature sinks below the  
minimum temperature level, again the trickle charge  
level is active. At rising temperature, the fast charge  
current is latched off at the ‘cut off’ temperature level.  
Timer/oscillator  
The oscillator has a sawtooth shape.  
The period time is defined by: tosc = K ×Rref × Cosc  
The oscillator frequency is used in the timer block. In this  
block several important signals are created.  
To avoid switching on and off with temperature, a  
hysteresis is built in for low temperature level. If the  
temperature protection is not necessary, pin ‘Negative  
Temperature Coefficient resistor’ (NTC) must be  
connected to pin Rref.  
Time-out for protecting the fast charge process in time.  
Time-out is normally chosen to be 25% longer than the  
associated fast charge time. So for a one hour charge  
time, time-out = 1.25 hours. The relationship with the  
oscillator period time is:  
Battery low protections  
– Time-out = 2 exp28 × tosc  
When the battery voltage is less than 0.81 V, the circuit  
assumes that there are short circuited batteries and the  
charge current is reduced to the trickle charge level. If the  
batteries are flat, the trickle charge current is able to raise  
the battery voltage within an acceptable period of time,  
after which fast charging starts.  
The duty factor in the trickle charge mode: The duty  
factor is fixed to 140, meaning that the average:  
– Itrickle = 140 × Ifast  
– ton = 34 × 2 exp9 × tosc  
– toff = 2 exp14 × tosc  
.
1996 Feb 26  
5
Philips Semiconductors  
Objective specification  
Cost effective battery monitor and fast  
charge IC for NiCd and NiMH chargers  
TEA1104; TEA1104T  
In non mains isolated systems, the current source can be  
switched via the auxiliary winding (see Fig.6) using the  
TEA140X power plugs.  
Output drivers  
Several output drive possibilities are supported by the  
TEA1104, to limit the fast charge current and to indicate  
the mode that the charge is in.  
In the application section, an example is shown driving two  
LEDs that are indicating fast charging, protection during  
fast charging, full status and removed batteries. It is also  
possible to output the same information via one LED only.  
In mains isolated systems, output drive current is available  
for a bipolar or MOS switching device. Moreover, current  
regulators can be driven (see Fig.4).  
MGE355  
V
bat  
full  
detection  
t
I
charge  
fast charge (I  
)
trickle charge (I  
/40)  
fast  
fast  
Fig.3 NiCd battery characteristics during a 1.25C charge cycle.  
output  
output  
output  
LM317  
LED  
LED  
LED  
TEA1104  
TEA1104  
TEA1104  
MGE356  
Fig.4 Output drivers.  
1996 Feb 26  
6
Philips Semiconductors  
Objective specification  
Cost effective battery monitor and fast  
charge IC for NiCd and NiMH chargers  
TEA1104; TEA1104T  
START  
no  
no  
V
> 11.5 V  
6.2 V < V < 11.5 V  
V
s
< 5.25 V  
s
s
yes  
yes  
yes  
total reset logic  
clamp at 11.5 V  
circuit non-active  
45 µA  
set TIME OUT (e.g. 111 min)  
I
= 25 mA  
DDmax  
I
o
DD  
set T  
T
(e.g. 48 C)  
o
max  
circuit active  
(e.g. 20 C)  
min  
circuit active  
V
< 0.81 V  
bat  
or T  
no  
< T  
bat  
bat  
min  
or T  
> T  
max  
(note 1)  
yes  
trickle charge  
I
/ 40  
fast  
yes  
FAST  
dual LED  
indication  
(note 2)  
no  
blinks  
yes  
FULL  
OFF  
FAST  
blinks  
0.81 V < V  
< 3.6 V  
no  
bat  
(note 3)  
and  
< T  
T
< T  
max  
min  
bat  
(note 5)  
yes  
FAST charge  
stop charge  
total reset  
open battery  
o
set T  
(e.g. 55 C)  
cut-off  
yes  
FAST  
ON  
FAST  
no  
no  
dual LED  
indication  
dual LED  
indication  
OFF  
yes  
yes  
FULL  
FAST  
FULL  
OFF  
FAST  
ON  
OFF  
OFF  
-V  
0.25%  
and  
> 3% TO  
o
C
bat  
no  
no  
no  
T
55  
TIME OUT > 111 min  
bat  
(TCO)  
(TO)  
t
dis  
MGE359  
battery is FULL  
trickle charge  
I
/ 40  
fast  
(note 4)  
(1) Vbat < 0.81 V due to empty or flat battery.  
yes  
(2) For single LED application see Fig.7, for dual LED  
application see Fig.6.  
FAST  
no  
dual LED  
indication  
(3) Vbat > 3.6 V due to system occurrence or an external  
blinks  
inhibit via pin Vbat  
.
yes  
(4) Release via reset.  
FULL  
ON  
FAST  
(5) Tmin = VNTC 2 V; Tmax = VNTC 1 V;  
OFF  
Tcut-off = VNTC 0.81 V.  
Fig.5 Flow chart of the TEA1104.  
7
1996 Feb 26  
Philips Semiconductors  
Objective specification  
Cost effective battery monitor and fast  
charge IC for NiCd and NiMH chargers  
TEA1104; TEA1104T  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 134); note 1.  
SYMBOL  
VP  
PARAMETER  
supply voltage  
CONDITIONS  
MIN.  
0.5  
0.5  
MAX.  
+13.2  
UNIT  
V
V
V
VoLED  
ViNTC  
LED output voltage (pin 8)  
VP  
+5  
negative temperature coefficient resistor  
input voltage (pin 2)  
0.5  
Vi(OSC)  
Vi(bat)  
VRref  
Isource  
IoLED  
IRref  
oscillator input voltage (pin 7)  
battery input voltage (pin 4)  
reference resistor voltage (pin 5)  
output source current  
LED output current  
0.5  
0.5  
0.5  
3  
1  
+5  
V
+5  
V
+5  
V
+0.01  
25  
mA  
mA  
mA  
mA  
mA  
reference resistor current  
battery current  
+0.01  
+1  
Ibat  
1  
VP  
supply current  
25  
Ptot  
total power dissipation  
Tamb = 70 °C  
TEA1104  
0.5  
W
TEA1104T  
20  
0.35  
+70  
W
Tamb  
Tj(max)  
Tstg  
operating ambient temperature  
maximum operating junction temperature  
storage temperature  
°C  
°C  
°C  
+150  
+150  
55  
Note  
1. All voltages are measured with respect to ground; positive currents flow into the IC. The voltage ratings are valid  
provided that other ratings are not violated; current ratings are valid provided that the power rating is not violated.  
QUALITY SPECIFICATION  
In accordance with “SNW-FQ-611 part E”. The numbers of the quality specification can be found in the “Quality  
Reference Handbook”. The handbook can be ordered using the code 9397 750 00192.  
1996 Feb 26  
8
Philips Semiconductors  
Objective specification  
Cost effective battery monitor and fast  
charge IC for NiCd and NiMH chargers  
TEA1104; TEA1104T  
CHARACTERISTICS  
VP = 10 V; Tamb = 25 °C; Rref = 33 k; COSC = 1 nF; unless otherwise specified.  
SYMBOL  
Supply  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
VP  
supply voltage  
5.45  
6.4  
5.05  
11.5  
V
VP/t  
Vclamp  
Vstart  
Vpd  
supply voltage start rate  
clamping voltage  
start-up voltage  
0.5  
V/µs  
V
Iclamp = 25 mA  
11.5  
6.1  
4.65  
12.8  
6.7  
V
power-down voltage level  
supply current  
5.45  
3
V
IP  
outputs off  
VP = 4 V  
mA  
µA  
V
Istart  
VS  
start-up current  
45  
50  
stabilized voltage  
IS = 1 mA  
4.03  
1.18  
4.25  
1.25  
±60  
4.46  
1.31  
±120  
VRref  
TCVref  
voltage range at reference resistor IRref = 20 µA  
temperature coefficient of the  
reference voltage  
V
Tamb = 0 to 45 °C  
ppm/K  
IRref  
current range of the reference  
resistor  
10  
100  
µA  
Temperature related input; NTC  
Vi(co)  
input voltage level for detecting  
temperature cut-off  
0.75  
0.92  
1.85  
5  
0.81  
1.0  
2.0  
0.87  
1.08  
2.15  
+5  
V
Vi(co; max)  
Vi(co; min)  
INTC  
maximum input voltage level for  
detecting temperature cut-off  
V
minimum input voltage level for  
detecting temperature cut-off  
V
input current  
VNTC = 1.5 V  
µA  
Output drivers  
δLED  
VLED(sat)  
ILI(LED)  
LED pulse duty factor  
2.4  
2.5  
2.6  
600  
5
%
LED saturation voltage  
ILED(sat) = 15 mA  
VLED = 15 V  
mV  
µA  
LED input leakage current  
Battery monitor  
Ii(bat)  
input battery current  
voltage range for peak detection  
Vbat = 2.4 V  
0.81  
1
3.6  
nA  
V
Vbat  
0.25  
Vbat/Vbat  
peak detection level with respect to Vbat = 2 V  
top level  
%
Tj  
temperature range of peak  
detection  
0
50  
°C  
Protections; BAT  
Vbat(l)  
low level battery protection voltage  
3.5  
0.81  
3.6  
0.91  
4.5  
V
V
Vbat(h)  
high level battery protection voltage  
Oscillator  
k
correction factor  
frequency range  
0.84  
10  
0.93  
1.02  
100  
fosc  
kHz  
1996 Feb 26  
9
Philips Semiconductors  
Objective specification  
Cost effective battery monitor and fast  
charge IC for NiCd and NiMH chargers  
TEA1104; TEA1104T  
In the trickle charge mode the LED output will pulsate with  
APPLICATION INFORMATION  
a repetition time; ttrickle = 2 exp14 × tosc = 0.28 s.  
A guideline for the settings of TEA1104 and its external  
components selection is given based on an example of a  
1 hour charger for a 4 cell NiCd or NiMH battery pack. The  
basic application diagram as illustrated in Fig.6 which is  
based on the application diagram illustrated in Fig.7 with  
some additional components; a 2 LED charge status  
indication has been provided.  
The duty factor of the pulse is 2.5% of ttrickle. This duty  
factor also applies to the charge current as the charge  
current switch is driven by the LED output. Therefore, the  
average trickle charge current is Ifast /40. The Vbat input  
can be adapted to the battery voltage via the resistor  
dividers R1 and R2. When an NTC thermistor has been  
incorporated into the battery, the minimum, maximum and  
cut-off temperature levels can be set with the resistors R3  
and R4. For an NTC with a common sensitivity of 3965  
and adjustment resistor values R3 = 13 k, R4 = 20 kΩ  
the minimum, maximum and cut-off temperatures will be 5,  
42 and 50 °C respectively.  
For charging a battery within one hour the charge current  
rating should be as follows:  
Required minimum charge current = battery  
capacity × 1.2/charge time.  
Therefore, for a 1 Ah battery the external charge current  
supply has to deliver at least 1.2 A.  
The flow chart of the TEA1104; TEA1104A is given in  
Fig.5. The load state of the batteries can be displayed by  
one or two LEDs. The flow chart is not to be regarded as  
sequential. Each mode of operation is a purely separate  
continuous process.  
TEA1104 settings  
The fast charge back-up timer period, time-out, has to be  
set in relation to the expected maximum charge time.  
Normally, a safety back-up time is chosen approximately  
25% longer than the maximum expected fast charge time.  
For a one hour charger the time-out period can be set to  
1.25 h.  
Table 1 Dual LED indication  
CHARGER  
MODE  
VLED  
VS  
LED 1 LED 2  
Time-out relationship with the oscillator repetition time is  
as follows;  
Fast charging  
low  
high  
high  
on  
off  
off  
Fast charging  
protection  
low/high  
on/off  
t
osc = time-out (h) × 3600/2 exp28  
tosc = 17µs for time-out = 1.25 h  
Full  
low/high  
high  
low  
off  
off  
on  
off  
(trickle charging)  
tosc is set with the combination of Cosc and Rref;  
Battery open  
high  
where tosc = 0.93 × Rref × Cosc  
.
Rref can be chosen between 13 and 120 k, but a 27 kΩ  
resistor is recommended. The oscillator capacitor can be  
calculated which is 668 pF; the nearest higher practical  
value is 680 pF.  
1996 Feb 26  
10  
Philips Semiconductors  
Objective specification  
Cost effective battery monitor and fast  
charge IC for NiCd and NiMH chargers  
TEA1104; TEA1104T  
+
V
= 6.5 to 12 V  
P
+
+
BD434  
1.2  
kΩ  
5.1  
kΩ  
R1  
LED 2  
FULL  
LED1  
FAST  
270  
BAW62  
47  
kΩ  
100  
kΩ  
current  
supply  
4
cells  
LED  
V
V
V
bat  
P
s
BC548  
R3  
R2  
TEA1104  
BC548  
V
GND OSC  
C
ref  
NTC  
osc  
R
ref  
R4  
−θ  
MGE357  
Fig.6 Basic application diagram.  
6
1
8
7
4
3
2
TEA1104  
5
−θ  
MGE358  
Fig.7 Application diagram.  
11  
1996 Feb 26  
Philips Semiconductors  
Objective specification  
Cost effective battery monitor and fast  
charge IC for NiCd and NiMH chargers  
TEA1104; TEA1104T  
PACKAGE OUTLINES  
SO8: plastic small outline package; 8 leads; body width 3.9 mm  
SOT96-1  
D
E
A
X
c
y
H
v
M
A
E
Z
5
8
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
1
4
e
w
M
detail X  
b
p
0
2.5  
5 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
A
(1)  
(1)  
(2)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.  
0.25  
0.10  
1.45  
1.25  
0.49  
0.36  
0.25  
0.19  
5.0  
4.8  
4.0  
3.8  
6.2  
5.8  
1.0  
0.4  
0.7  
0.6  
0.7  
0.3  
mm  
1.27  
0.050  
1.05  
0.041  
1.75  
0.25  
0.01  
0.25  
0.01  
0.25  
0.1  
8o  
0o  
0.010 0.057  
0.004 0.049  
0.019 0.0100 0.20  
0.014 0.0075 0.19  
0.16  
0.15  
0.244  
0.228  
0.039 0.028  
0.016 0.024  
0.028  
0.012  
inches 0.069  
0.01 0.004  
Notes  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
95-02-04  
97-05-22  
SOT96-1  
076E03S  
MS-012AA  
1996 Feb 26  
12  
Philips Semiconductors  
Objective specification  
Cost effective battery monitor and fast  
charge IC for NiCd and NiMH chargers  
TEA1104; TEA1104T  
DIP8: plastic dual in-line package; 8 leads (300 mil)  
SOT97-1  
D
M
E
A
2
A
A
1
L
c
w M  
Z
b
1
e
(e )  
1
M
H
b
b
2
8
5
pin 1 index  
E
1
4
0
5
10 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
(1)  
A
A
A
(1)  
(1)  
Z
1
2
w
UNIT  
mm  
b
b
b
c
D
E
e
e
L
M
M
H
1
2
1
E
max.  
min.  
max.  
max.  
1.73  
1.14  
0.53  
0.38  
1.07  
0.89  
0.36  
0.23  
9.8  
9.2  
6.48  
6.20  
3.60  
3.05  
8.25  
7.80  
10.0  
8.3  
4.2  
0.51  
3.2  
2.54  
0.10  
7.62  
0.30  
0.254  
0.01  
1.15  
0.068 0.021 0.042 0.014  
0.045 0.015 0.035 0.009  
0.39  
0.36  
0.26  
0.24  
0.14  
0.12  
0.32  
0.31  
0.39  
0.33  
inches  
0.17  
0.020  
0.13  
0.045  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
92-11-17  
95-02-04  
SOT97-1  
050G01  
MO-001AN  
1996 Feb 26  
13  
Philips Semiconductors  
Objective specification  
Cost effective battery monitor and fast  
charge IC for NiCd and NiMH chargers  
TEA1104; TEA1104T  
Several techniques exist for reflowing; for example,  
thermal conduction by heated belt. Dwell times vary  
between 50 and 300 seconds depending on heating  
method. Typical reflow temperatures range from  
215 to 250 °C.  
SOLDERING  
Introduction  
There is no soldering method that is ideal for all IC  
packages. Wave soldering is often preferred when  
through-hole and surface mounted components are mixed  
on one printed-circuit board. However, wave soldering is  
not always suitable for surface mounted ICs, or for  
printed-circuits with high population densities. In these  
situations reflow soldering is often used.  
Preheating is necessary to dry the paste and evaporate  
the binding agent. Preheating duration: 45 minutes at  
45 °C.  
WAVE SOLDERING  
This text gives a very brief insight to a complex technology.  
A more in-depth account of soldering ICs can be found in  
our “IC Package Databook” (order code 9398 652 90011).  
Wave soldering techniques can be used for all SO  
packages if the following conditions are observed:  
A double-wave (a turbulent wave with high upward  
pressure followed by a smooth laminar wave) soldering  
technique should be used.  
DIP  
SOLDERING BY DIPPING OR BY WAVE  
The longitudinal axis of the package footprint must be  
parallel to the solder flow.  
The maximum permissible temperature of the solder is  
260 °C; solder at this temperature must not be in contact  
with the joint for more than 5 seconds. The total contact  
time of successive solder waves must not exceed  
5 seconds.  
The package footprint must incorporate solder thieves at  
the downstream end.  
During placement and before soldering, the package must  
be fixed with a droplet of adhesive. The adhesive can be  
applied by screen printing, pin transfer or syringe  
dispensing. The package can be soldered after the  
adhesive is cured.  
The device may be mounted up to the seating plane, but  
the temperature of the plastic body must not exceed the  
specified maximum storage temperature (Tstg max). If the  
printed-circuit board has been pre-heated, forced cooling  
may be necessary immediately after soldering to keep the  
temperature within the permissible limit.  
Maximum permissible solder temperature is 260 °C, and  
maximum duration of package immersion in solder is  
10 seconds, if cooled to less than 150 °C within  
6 seconds. Typical dwell time is 4 seconds at 250 °C.  
REPAIRING SOLDERED JOINTS  
A mildly-activated flux will eliminate the need for removal  
of corrosive residues in most applications.  
Apply a low voltage soldering iron (less than 24 V) to the  
lead(s) of the package, below the seating plane or not  
more than 2 mm above it. If the temperature of the  
soldering iron bit is less than 300 °C it may remain in  
contact for up to 10 seconds. If the bit temperature is  
between 300 and 400 °C, contact may be up to 5 seconds.  
REPAIRING SOLDERED JOINTS  
Fix the component by first soldering two diagonally-  
opposite end leads. Use only a low voltage soldering iron  
(less than 24 V) applied to the flat part of the lead. Contact  
time must be limited to 10 seconds at up to 300 °C. When  
using a dedicated tool, all other leads can be soldered in  
one operation within 2 to 5 seconds between  
270 and 320 °C.  
SO  
REFLOW SOLDERING  
Reflow soldering techniques are suitable for all SO  
packages.  
Reflow soldering requires solder paste (a suspension of  
fine solder particles, flux and binding agent) to be applied  
to the printed-circuit board by screen printing, stencilling or  
pressure-syringe dispensing before package placement.  
1996 Feb 26  
14  
Philips Semiconductors  
Objective specification  
Cost effective battery monitor and fast  
charge IC for NiCd and NiMH chargers  
TEA1104; TEA1104T  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
1996 Feb 26  
15  
Philips Semiconductors – a worldwide company  
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Fax. (571)217 4549  
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Tel. (0212)279 27 70, Fax. (0212)282 67 07  
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COPENHAGEN S, Tel. (45)32 88 26 36, Fax. (45)31 57 19 49  
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252148 KIEV, Tel. 380-44-4760297, Fax. 380-44-4766991  
United Kingdom: Philips Semiconductors LTD.,  
276 Bath Road, Hayes, MIDDLESEX UB3 5BX,  
Tel. (0181)730-5000, Fax. (0181)754-8421  
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Greece: No. 15, 25th March Street, GR 17778 TAVROS,  
Tel. (01)4894 339/4894 911, Fax. (01)4814 240  
India: Philips INDIA Ltd, Shivsagar Estate, A Block,  
Dr. Annie Besant Rd. Worli, Bombay 400 018  
Tel. (022)4938 541, Fax. (022)4938 722  
Indonesia: Philips House, Jalan H.R. Rasuna Said Kav. 3-4,  
P.O. Box 4252, JAKARTA 12950,  
Tel. (02)70-4044, Fax. (02)92 0601  
Tel. (021)5201 122, Fax. (021)5205 189  
Ireland: Newstead, Clonskeagh, DUBLIN 14,  
Tel. (01)7640 000, Fax. (01)7640 200  
Italy: PHILIPS SEMICONDUCTORS S.r.l.,  
Piazza IV Novembre 3, 20124 MILANO,  
Tel. (0039)2 6752 2531, Fax. (0039)2 6752 2557  
Japan: Philips Bldg 13-37, Kohnan2-chome, Minato-ku, TOKYO 108,  
Tel. (03)3740 5130, Fax. (03)3740 5077  
Korea: Philips House, 260-199 Itaewon-dong,  
For all other countries apply to: Philips Semiconductors,  
International Marketing and Sales, Building BE-p,  
P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands,  
Telex 35000 phtcnl, Fax. +31-40-2724825  
Yongsan-ku, SEOUL, Tel. (02)709-1412, Fax. (02)709-1415  
SCDS47  
© Philips Electronics N.V. 1996  
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA,  
SELANGOR, Tel. (03)750 5214, Fax. (03)757 4880  
Mexico: 5900 Gateway East, Suite 200, EL PASO, TX 79905,  
Tel. 9-5(800)234-7381, Fax. (708)296-8556  
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,  
Tel. (040)2783749, Fax. (040)2788399  
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,  
All rights are reserved. Reproduction in whole or in part is prohibited without the  
prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation  
or contract, is believed to be accurate and reliable and may be changed without  
notice. No liability will be accepted by the publisher for any consequence of its  
use. Publication thereof does not convey nor imply any license under patent- or  
other industrial or intellectual property rights.  
Tel. (09)849-4160, Fax. (09)849-7811  
Norway: Box 1, Manglerud 0612, OSLO,  
Printed in The Netherlands  
Tel. (022)74 8000, Fax. (022)74 8341  
Pakistan: Philips Electrical Industries of Pakistan Ltd.,  
Exchange Bldg. ST-2/A, Block 9, KDA Scheme 5, Clifton,  
KARACHI 75600, Tel. (021)587 4641-49,  
Fax. (021)577035/5874546  
417021/1100/02/pp16  
Date of release: 1996 Feb 26  
9397 750 00692  
Document order number:  

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