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User’s Guide
2000
Mixed-Signal Products
SLOU085
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Preface
Read This First
Information About Cautions and Warnings
This book may contain cautions and warnings.
This is an example of a caution statement.
A caution statement describes a situation that could potentially
damage your software or equipment.
This is an example of a warning statement.
A warning statement describes a situation that could potentially
cause harm to you.
The information in a caution or a warning is provided for your protection.
Please read each caution and warning carefully.
Related Documentation From Texas Instruments
J
J
TI Plug-N-Play Audio Amplifier Evaluation Platform (literature
number SLOU011) provides detailed information on the evaluation
platform and its use with TI audio evaluation modules.
TPA6110A2 150-mW Stereo Audio Power Amplifier (literature
number SLOS314) This is the data sheet for the TPA6110A2 audio
amplifier integrated circuit.
iii
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Running Title—Attribute Reference
FCC Warning
This equipment is intended for use in a laboratory test environment only. It
generates, uses, and can radiate radio frequency energy and has not been
tested for compliance with the limits of computing devices pursuant to subpart
J of part 15 of FCC rules, which are designed to provide reasonable protection
against radio frequency interference. Operation of this equipment in other
environments may cause interference with radio communications, in which
case the user at his own expense will be required to take whatever measures
may be required to correct this interference.
iv
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Contents
1
2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1.1
1.2
1.3
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3
TPA6110A2 MSOP EVM Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3
Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
2.1
2.2
2.3
2.4
Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
Quick Start List for Platform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
Quick Start List for Stand-Alone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5
2.4.1 TPA6110A2 MSOP EVM Connected as a Stereo Headphone Amplifier . . . . . 2-5
2.4.2 TPA6110A2 MSOP EVM Schematic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5
2.4.3 TPA6110A2 MSOP Audio Power Amplifier Evaluation Module Parts List . . . . 2-6
2.4.4 TPA6110A2 EVM PCB Layers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6
Figures
1–1
2–1
2–2
2–3
2–4
2–5
2–6
2–7
2–8
The TI TPA6110A2 Audio Amplifier Evaluation Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3
Quick Start Platform Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
Quick Start Module Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4
TPA6110A2 MSOP EVM Connected as a Stereo Headphone Amplifier . . . . . . . . . . . . . . . 2-5
TPA6110A2 MSOP EVM Schematic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5
TPA6110A2 EVM PCB Layers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6
TPA6110A2 EVM Silkscreen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7
TPA6110A2 EVM PCB Top Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7
TPA6110A2 EVM PCB Bottom Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7
Tables
2–1
Typical TI Plug-N-Play Platform Jumper and Switch Settings for the
TPA6110A2 MSOP EVM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
2–2
2–3
Platform Jumper and Switch Settings for the TPA6110A2 MSOP EVM . . . . . . . . . . . . . . . 2-3
TPA6110A2 MSOP EVM Parts List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6
Contents
v
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vi
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Chapter 1
Introduction
This chapter provides an overview of the Texas Instruments (TI) TPA6110A2
MSOP audio amplifier evaluation module (SLOP338). It includes a list of EVM
features, a brief description of the module illustrated with a pictorial diagram,
and a list of EVM specifications.
Topic
Page
1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2
1.2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–3
1.3 TPA6110A2 MSOP EVM Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . 1–3
1-1
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Features
1.1 Features
The TI TPA6110A2 MSOP audio amplifier evaluation module and the TI
plug-n-play audio amplifier evaluation platform include the following features:
- TPA6110A2 MSOP Stereo Audio Power Amplifier Evaluation Module
J
J
J
J
Dual channel, single-ended operation
150-mW output power into 8 Ω at 5 V
2.5-V to 5.5-V operation
Very low distortion:
H
H
H
THD+N is less than 0.01% at 1 kHz and less than 0.03% from 20
Hz to 20 kHz into 10-kΩ loads
Lessthan0.02%at1kHzandlessthan0.4%from20Hzto20kHz
into 32-Ω loads
Lessthan0.05%at1kHzandlessthan0.8%from20Hzto20kHz
into 8-Ω loads
J
J
J
Extremely low current consumption in shutdown mode
Internal thermal and short-circuit protection
Internal pop reduction circuitry
- Quick and Easy Configuration With the TI Plug-N-Play Audio Amplifier
Evaluation Platform
J
Evaluation module is designed to simply plug into the platform,
automatically making all signal, control, and power connections
J
J
J
J
Platform provides flexible power options
Jumpers on the platform select power and module control options
Switches on the platform route signals
Platform provides quick and easy audio input and output connections
- Platform Power Options
J
J
J
J
J
Onboard 9-V battery
External 5-V–15-V (V ) supply inputs
CC
External regulated V
supply input
DD
Socket for on-board 5-V V
voltage regulator EVM
DD
Onboard overvoltage and reverse polarity power protection
- Platform Audio Input and Output Connections
J
J
J
J
J
Left and right RCA phono jack inputs
Miniature stereo phone jack input
Left and right RCA phono jack outputs
Left and right compression speaker terminal outputs
Miniature stereo headphone jack output
1-2
Introduction
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Description
1.2 Description
The TPA6110A2 MSOP audio power amplifier evaluation module is a
complete, low-power stereo audio power amplifier for high-fidelity line-level
output, headphone, and small speaker applications. It consists of the TI
TPA6110A2 150-mW stereo audio power amplifier IC in a very small MSOP
package, along with a small number of other parts mounted on a circuit board
that is approximately one and a quarter inches square (Figure 1–1).
Figure 1–1. The TI TPA6110A2 Audio Amplifier Evaluation Module
VDD GND
C5
Shutdown
S1
C3
IN1
GND
R2
R1
R5
Vo1
C1
GND
U1
C4
C2 R3 R4
TEXAS
INSTRUMENTS
GND
Vo2
IN2
SLOP338
GND
TPA6110A2 MSOP EVM
†
Due to the very small size of the MSOP IC package, the standard part number TPA6110A2 is
replaced with the code TIAIZ.
Single in-line header pins are mounted to the underside of the module circuit
board; these pins allow the EVM to be plugged into the TI plug-n-play audio
amplifier evaluation platform, or to be wired directly into existing circuits and
equipment when used stand-alone.
The platform has room for a single TPA6110A2 evaluation module and is a
convenient vehicle for demonstrating TI’s audio power amplifier and related
evaluation modules. The EVMs simply plug into the platform, which
automatically provides power to the modules, interconnects them correctly,
andconnectsthemtoaversatilearrayofstandardaudioinputandoutputjacks
and connectors. Easy-to-use configuration controls allow the platform and
EVMs to quickly model many possible end-equipment configurations.
There is nothing to build, nothing to solder, and nothing but the speakers
included with the platform to hook up.
1.3 TPA6110A2 MSOP EVM Specifications
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.5 V to 5.5 V
DD
Supply current, I
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160 mA, max
DD
Continuous output power, P : 8 Ω, V =5 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150 mW
O
DD
Audio input voltage, V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
+ 0.3 Vpp, max
I
DD
Minimum load impedance, R . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Ω
L
1-3
Introduction
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1-4
Introduction
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Chapter 2
Operation
Follow the steps in this chapter to quickly prepare the TPA6110A2 MSOP
audio amplifier EVM for use. The TPA6110A2 MSOP EVM and the TI
plug-n-play audio amplifier evaluation platform provide a quick and easy way
to connect power, signal and control inputs, and signal outputs to the EVM
using standard connectors. However, the audio amplifier evaluation module
can be used stand-alone by making connections directly to the module pins
and can be wired directly into existing circuits or equipment.
The platform switch and jumper settings shown in Table 2–1 are typical for the
TPA6110A2 MSOP EVM and will cause the TPA6110A2 IC to shutdown/mute
when a plug is removed from platform headphone jack J10.
Table 2–1. Typical TI Plug-N-Play Platform Jumper and Switch Settings for the
TPA6110A2 MSOP EVM
EVM
JP6
JP7
JP8
S2
S3
TPA6110A2
X
Lo
X
See Note 2
U5
Notes: 1) X = Don’t care
2) Set S2 to ON when signal conditioning board is installed in U1; set S2
to OFF when no signal conditioning board is installed.
Topic
Page
2.1 Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–2
2.2 Quick Start List for Platform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–3
2.3 Quick Start List for Stand-Alone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–4
2.4 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–5
2-1
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Precautions
2.1 Precautions
Power Supply Input Polarity and Maximum Voltage
Always ensure that the polarity and voltage of the external power
connected to V
power input connector J1, J2, and/or V
power
CC
DD
input connector J6 are correct. Overvoltage or reverse-polarity
power applied to these terminals can open onboard soldered-in
fuses and cause other damage to the platform, installed evaluation
modules, and/or the power source.
Inserting or Removing EVM Boards
Do not insert or remove EVM boards with power applied—damage
to the EVM board, the platform, or both may result.
Figure 2–1. Quick Start Platform Map
7b
6b
1
10
6b
ICC
JP4
C1+
F1
VR1
DC
Power
In/Out
6a
Power
Input
6b
R2
R1
Audio
Power
Amps
Signal Conditioning
Audio
Input
8
Speaker
Output
Mode
Mute
Polarity
Lo
****CAUTION****
Do not insert or remove
EVM boards with power
applied
Hi
Stereo
Headphone
Output
9
Plug-N-Play Audio Amplifier
Evaluation Platform
SLOP097 Rev. C.1
HP Out
R3
R4
R5
3
2
4
5
2-2
Operation
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Quick Start List for Platform
2.2 Quick Start List for Platform
Follow these steps when using the TPA6110A2 MSOP EVM with the TI
plug-n-play audio amplifier evaluation platform (see the platform user’s guide,
SLOU011, for additional details). Numbered callouts for selected steps are
shown in Figure 2–1.
- Platform preparations
1) Ensure that all external power sources are set to off and that the platform
power switch S1 is set to off.
2) Install a TPA6110A2 MSOP module in platform socket U5, taking care to
align the module pins correctly.
3) Use switch S2 to select or bypass the signal conditioning EVM (U1)
4) Set control signal polarity jumper JP7 to Lo.
5) Set HP source switch S3 to U5 to route the output signal to the headphone
jack (J10).
Table 2–2. Platform Jumper and Switch Settings for the TPA6110A2 MSOP EVM
EVM
JP6
JP7
JP8
S2
S3
TPA6110A2
X
Lo
X
See Note 2
U5
Notes: 1) X = Don’t care
2) Set S2 to ON when signal conditioning board is installed in U1; set S2 to OFF when
no signal conditioning board is installed.
- Power supply
6) Select and connect the power supply:
a) Connect an external regulated power supply set to a voltage between
2.5 V and 5.5 V to platform V power input connector J6, taking care
DD
to observe marked polarity, or
b) Install 3-V to 5-V voltage regulator EVM (SLVP097 or equiv.) in plat-
form socket U6. Install a 9-V battery in B1 or connect a 7 V – 12 V pow-
er source to a platform V
propriate power input (see platform user’s guide).
power input J1 or J2 and jumper the ap-
CC
- Inputs and outputs
7) Ensure that signal source level is set to minimum.
8) Connect the audio source to left and right RCA phono jacks J3 and J5 or
stereo miniature phone jack J4.
9) Connect 32-Ω headphones to headphone jack J10.
- Power-up
10) Verify correct voltage and input polarity and set the external power supply
to ON. If V and an onboard regulator EVM are used to provide V , set
CC
DD
platform power switch S1 to ON.
Platform LED2 lights indicating the presence of V , and the evaluation
DD
modules installed on the platform begin operation.
11) Adjust the signal source level as needed.
2-3
Operation
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Quick Start List for Stand-Alone
2.3 Quick Start List for Stand-Alone
Follow these steps to use the TPA6110A2 MSOP EVM stand-alone or when
connecting it to existing circuits or equipment. Connections to the TPA6110A2
MSOP module header pins can be made via individual sockets,
wire-wrapping, or soldering to the pins, either on the top or the bottom of the
module circuit board. Numbered callouts for selected steps are shown in
Figure 2–2 and details appear in Chapter 3.
Figure 2–2. Quick Start Module Map
2
VDD GND
Shutdown
R1
S1
C3
C5
5
4
IN1
GND
R2
R5
Vo1
C1
6
6
GND
U1
C4
C2 R3 R4
TEXAS
INSTRUMENTS
GND
Vo2
IN2
SLOP338
TPA6110A2 MSOP EVM
4
GND
†
Due to the very small size of the MSOP IC package, the standard part number TPA6110A2 is
replaced with the code TIAIZ.
- Power supply
1) Ensure that all external power sources are set to off.
2) Connect an external regulated power supply set to 5 V to the module V
and GND pins, taking care to observe marked polarity.
DD
- Inputs and outputs
3) Ensure that the signal source level is set to minimum.
4) Connect the audio source to the module IN1, IN2, and GND pins, taking
care to observe marked polarity.
5) Connect the shutdown (S1) pin to V
through a normally open switch.
DD
6) Connect 32-Ω headphones to the module V , and V pins through 33
O1
O2
µF to 1000 µF output-coupling capacitors (see Figure 2–3) and return to
the GND pin, or
7) For line output, connections to the V
and V
pins must be made
O2
O1
through 33 µF to 1000 µF output-coupling capacitors and returned to
GND.
- Power-up
8) Verify correct voltage and input polarity and set the external power supply
to ON.
The EVM should begin operation.
9) Adjust the signal source level as needed.
2-4
Operation
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References
2.4 References
2.4.1 TPA6110A2 MSOP EVM Connected as a Stereo Headphone Amplifier
Figure 2–3. TPA6110A2 MSOP EVM Connected as a Stereo Headphone Amplifier
5 VDC
VDD
R2
GND
C5
Shutdown
R1
Shutdown
Audio Input
NO
S1
C3
IN1
GND
(Right)
R5
Vo1
C1
+
+
GND
U1
33 µF – 1000 µF
C4
C2 R3 R4
TEXAS
33 µF – 1000 µF
INSTRUMENTS
GND
Vo2
Audio Input
(Left)
IN2
SLOP338
GND
TPA6110A2 MSOP EVM
†
Due to the very small size of the MSOP IC package, the standard part number TPA6110A2 is replaced with the code TIAIZ.
2.4.2 TPA6110A2 MSOP EVM Schematic Diagram
Figure 2–4. TPA6110A2 MSOP EVM Schematic Diagram
Audio Input 1
R2
C3
1 µF
8
7
1
20 kΩ
Bypass
IN 1
Vo1
C1
R5
82 kΩ
1 µF
S1
Vo1
2
3
GND
TPA6110A2
MSOP
V
DD
V
DD
SHUTDOWN
R1
Shutdown
(V to
Shutdown)
2 to 5.5 V
6
5
C5
10 µF
+
C4
1 µF
Shutdown
IN 2
V
DD
DD
GND
Vo2
82 kΩ
4
C2
1 µF
R3
Vo2
20 kΩ
Audio Input 2
R4, 82 kΩ
2-5
Operation
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TPA6110A2 MSOP Audio Power Amplifier Evaluation Module Parts List
2.4.3 TPA6110A2 MSOP Audio Power Amplifier Evaluation Module Parts List
Table 2–3.TPA6110A2 MSOP EVM Parts List
Manufacturer/
Part Number
Ref.
R2, R3
Description
Size
Qty.
Vendor/Number
Digi-Key
Resistor, 20 kΩ, 1/16
W, 5%, SMD
0603
3
Panasonic
ERJ-3GSYJ203
P20PGCT–ND
R1, R4, R5
C1–C4
Resistor, 82 kΩ, 1/16
0603
0603
2
4
Panasonic
ERJ-3GSYJ823
Digi-Key
P82KGCT–ND
W, 5%, SMD
Capacitor, 1 µF,
+20/–80%,
Murata
GRM39-Y5V105Z10
Newark
Non-polarized, SMD
C5
S1
Capacitor, 10 µF, 6.3 V,
A
1
1
Panasonic
ECS-TOJY106R
Digi-Key
PCS1106CT-ND
SMD
Switch, momentary
Panasonic
Digi-Key
(SHUTDOWN) SMD
P8048SCT-ND
P8048SCT-ND
U1
IC, TPA6110A2, APA,
MSOP-8
1
TI
150 mW, 2 channel
TPA6110A2DGN
PNP Pins
Terminal post headers
11
Sullins
Digi-Key
S1022-36-ND
The following illustrations depict the TPA6110A2 EVM PCB layers and silks-
creen. These drawings are not to scale. Gerber plots can be obtained from any
TI sales office.
2.4.4 TPA6110A2 EVM PCB Layers
Figure 2–5. TPA6110A2 EVM PCB Layers
2-6
Operation
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TPA6110A2 EVM PCB Layers
Figure 2–6. TPA6110A2 EVM Silkscreen
Figure 2–7. TPA6110A2 EVM PCB Top Layer
Figure 2–8. TPA6110A2 EVM PCB Bottom Layer
2-7
Operation
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2-8
Operation
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