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Intel 6300ESB I/O Controller
Hub
Thermal and Mechanical Design Guide
February 2004
Order Number: 300682-001
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Contents
Contents
1.0 Introduction....................................................................................................................................5
Definition of Terms................................................................................................................5
2.0 Packaging Technology .................................................................................................................7
3.0 Thermal Specifications .................................................................................................................9
Case Temperature and Thermal Design Power ...................................................................9
Case Temperature Metrology...............................................................................................9
4.0 Reference Thermal Solution.......................................................................................................11
4.1 Reliability Requirements.....................................................................................................11
Mechanical Drawings ..................................................................................................................13
Figures
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Intel 6300ESB I/O Controller Hub Package Dimensions..........................................................14
Tables
Reference Documents..................................................................................................................6
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Intel 6300ESB I/O Controller Hub Thermal Specifications .........................................................9
Reliability Requirements.............................................................................................................11
Revision History
Date
Revision
Description
Initial release of this document.
February 2004
1.0
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Contents
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Introduction
1.0
Introduction
As the complexity of computer systems increases, so do the power dissipation requirements. Care
must be taken to ensure that the additional power is properly dissipated. Heat may be dissipated
using improved system cooling and/or attaching passive heatsinks.
The objective of thermal management is to ensure that the temperatures of all components in a
system are maintained within functional limits. The functional temperature limit is the range within
which the electrical circuits may be expected to meet specified performance requirements.
Operation outside the functional limit may degrade system performance, cause logic errors, or
cause component and/or system damage. Temperatures exceeding the maximum operating limits
may result in irreversible changes in the operating characteristics of the component. The goal of
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this document is to provide an understanding of the operating limits of the Intel 6300ESB I/O
Controller Hub (ICH).
The simplest and most cost effective method is to improve the inherent system cooling
characteristics through careful design and placement of fans, vents, and ducts. When additional
cooling is required, component thermal solutions may be implemented in conjunction with system
thermal solutions. The size of the fan or heatsink may be varied to balance size and space
constraints with acoustic noise.
This document presents the conditions and requirements to properly design a cooling solution for
systems using the Intel 6300ESB ICH. Properly designed solutions should provide adequate
cooling to maintain the Intel 6300ESB ICH case temperatures at or below thermal specifications.
This is accomplished by providing a low local-ambient temperature, ensuring adequate local
airflow, and minimizing the case to local-ambient thermal resistance. By maintaining the case
temperatures of the Intel 6300ESB ICH at or below those recommended in this document, a system
designer may ensure the proper functionality, performance, and reliability of these components.
1.1
Definition of Terms
Table 1. Definition of Terms
Term
Definition
Ball Grid Array. A package type defined by a resin-fiber substrate, onto which a die is
mounted, bonded and encapsulated in molding compound. The primary electrical interface is
an array of solder balls attached to the substrate opposite the die and molding compound.
BGA
The maximum package case temperature without any package thermal solution. This
temperature is measured at the geometric center of the top of the package case.
Tcase-nhs
Tj-max
TDP
The maximum component temperature specification measured at the hottest point in the
processor die.
Thermal Design Power. Thermal solutions should be designed to dissipate this target power
level.
Linear Feet Per Minute. A measure of airflow emitted from a forced convection device, such
as an axial fan or blower.
LFM
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Introduction
1.2
Reference Documents
Table 2. Reference Documents
Document
Document Number / Location
Intel® 6300ESB I/O Controller Hub Datasheet
300641
Thermal Design Suggestions for Various Form Factors
NOTE: Unless otherwise noted, these documents are available through your Intel Field Sales representative
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Packaging Technology
2.0
Packaging Technology
The Intel 6300ESB ICH component is available in a 37.5 mm square package as shown in
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I/O Controller Hub Datasheet.
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Packaging Technology
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Thermal Specifications
3.0
Thermal Specifications
3.1
Case Temperature and Thermal Design Power
To ensure proper operation and reliability of the Intel 6300ESB ICH component, the case and
component level thermal solutions are required to maintain the case temperature below the
maximum temperature specification while dissipating the thermal design power (TDP) listed in
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Table 3. Intel 6300ESB I/O Controller Hub Thermal Specifications
Parameter
Maximum
Notes
Tcase-nhs
Tj-max
TDP
105 °C
115 °C
3.9 W
NOTES:
1. Tcase-nhs is defined as the maximum package case temperature without a
thermal solution attached.
2. Tj-max is defined as the maximum component temperature specification
measured at the hottest point in the processor die.
3.2
Case Temperature Metrology
The component case temperature should be measured by attaching a thermocouple to the geometric
dimensions.
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Thermal Specifications
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Reference Thermal Solution
4.0
Reference Thermal Solution
Based on a component local operating environment of natural convection (zero LFM of airflow)
with a maximum local-ambient temperature of 55° C, the Intel 6300ESB ICH component does not
require an attached heatsink to meet thermal specifications. For systems where the local-ambient
temperature is severe (greater than 55° C, natural convection), a component level thermal solution
or system thermal solution improvement may be required. Attaching a heatsink to the package case
and/or improving airflow at the component may be potential solutions.
4.1
Reliability Requirements
If an attached heatsink is implemented due to a severe component local operating environment, the
combination may vary the mechanical loading of the component. It is recommended that the user
carefully evaluate the reliability of the completed assembly prior to use in high volume.
Table 4. Reliability Requirements
Test1
Requirement
Pass/Fail Criteria2
Mechanical Shock
Random Vibration
50g, board level, 11 msec, 3 shocks/axis
Visual check and electrical functional test
7.3g, board level, 45 min/axis, 50 Hz to
2000 Hz
Visual check and electrical functional test
Visual check
85° C, 2000 hours total, checkpoints at
168, 500, 1000, and 2000 hours
Temperature Life
Thermal Cycling
-5° C to +70° C, 500 cycles, ° C/min rise
and fall
Visual check
Visual check
Humidity
85% relative humidity, 55° C, 1000 hours
NOTES:
1. The above tests should be performed on a sample size of at least 12 assemblies from 3 lots of material.
2. Additional pass/fail criteria may be added at the discretion of the user.
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Reference Thermal Solution
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Mechanical Drawings
Appendix A Mechanical Drawings
Figure 1 shows the package dimensions for the Intel 6300ESB ICH. Unless otherwise specified,
the units in the figure are in millimeters.
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