Intel Doll P3700 User Manual

Intel® Solid-State Drive DC P3700 Series  
Product Specification  
Capacities: 400GB, 800GB, 1.6TB, 2TB  
Components  
Power  
2.5-inch: 3.3V and 12V Supply Rail  
AIC: 3.3V and 12V Supply Rail  
Enhanced power-loss data protection  
Active/Idle (TYP): Up to 25W/4W (TYP)  
Intel® 20nm MLC NAND Flash Memory  
Form Factors  
2.5-inch Form Factor  
15mm Z-height  
Endurance Rating  
8639-compatible connector  
Up to 62.05 PBW (Petabytes Written)5  
Up to 17 Drive Writes/day (JESD219 workload)  
AIC Form Factor  
Half-height, Half-length  
Single slot x4 connector  
Temperature Specification  
Operating:  
PCIe* Gen3 X4  
AIC: 0 to 55° C ambient with  
specified airflow  
Performance1,2  
Seq R/W: Up to 2800/2000MB/s3  
2.5-inch: 0 to 35° C ambient,  
0 to 70° C case with specified airflow  
IOPS Rnd 4KB4 70/30 R/W: Up to 265K  
IOPS Rnd 4KB4 R/W: Up to 460/175K  
Seq Latency (typ) R/W: 20/20µs  
Non-Operating6: -55 to 95° C  
Temperature monitoring (In-band and by  
way of SMBUS)  
Operating System Support:  
Thermal throttling when approaching  
maximum operating temperature  
Windows* Server 2012 R2, 2012,  
2008 R2 x64  
Airflow  
Windows* 7, Windows* 8,  
Windows* 8.1, 10 (32/64bit)  
RHEL* 6.5, 6.6, 6.7,7.0, 7.1  
SLES11 SP3*, SP4, SLES12  
Citrix* XenServer* 6.5  
VMWare* ESXi 5.5  
AIC (55° C airflow towards IO bracket7)  
400GB: 200 LFM  
800GB, 1.6TB, 2.0TB: 300 LFM  
2.5-inch (Airflow towards the connector)  
400GB: 250/300 LFM (25/35° C)  
800GB: 350/500 LFM (25/35° C)  
1.6TB, 2TB: 450/600 LFM (25/35° C)  
CentOS* 6.5  
UEFI 2.3.1*  
Reliability  
Weight  
Uncorrectable Bit Error Rate (UBER):  
AIC: 400/800GB up to 185gm  
1.6TB, 2TB up to 195gm  
2.5-inch: 400/800GB up to 115gm  
1.6TB, 2TB up to 125gm  
1 sector per 1017 bits read  
Mean Time Before Failure (MTBF):  
2 million hours  
T10 DIF protection  
Variable Sector Size: 512, 520, 528, 4096,  
4104, 4160, 4224 Bytes  
Shock  
2.5-inch: 1,000 G/0.5msec  
AIC: 50 G Trapezoidal, 170 in/s  
Compliance  
Vibration  
NVM Express* 1.0  
Operating: 2.17 GRMS (5-700Hz)  
Non-Operating: 3.13 GRMS (5-800Hz)  
Altitude (Simulated)  
Operating: -1,000 to 10,000 ft  
Non-Operating: -1,000 to 40,000 ft  
Product Ecological Compliance  
RoHS  
PCI Express* Base Specification Rev 3.0  
Enterprise SSD Form Factor Version 1.0a  
PCI Express Card Electro-Mechanical (CEM)  
Specification Rev 2.0  
Certifications and Declarations  
UL*, CE*, C-Tick*, BSMI*, KCC*, Microsoft*  
WHQL*, VCCI*  
Performance values vary by capacity and form factor  
1.  
2. Performance specifications apply to both compressible and incompressible data  
3. MB/s = 1,000,000 bytes/second  
4. 4KB = 4,096 bytes; 8KB = 8,192 bytes  
5. 1PB = 1015 Bytes  
6. Please contact your Intel representative for details on the non-operating temperature range  
7. Airflow out of server through PCIe Card Slot  
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Intel® Solid-State Drive DC P3700 Series  
Contents  
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Intel® Solid-State Drive DC P3700 Series  
Figures  
Figure 3-1: Intel SSD DC P3700 Series SFF Dimensions...................................................................................................................... 18  
Figure 3-2: Intel SSD DC P3700 Series PCIe Dimensions.................................................................................................................... 19  
Figure A-1: LED Location..................................................................................................................................................................................... 47  
Tables  
Table 1:  
Standard Information referenced in this document .........................................................................................................8  
Glossary of Terms and Acronyms..............................................................................................................................................9  
User Addressable Sectors........................................................................................................................................................... 10  
Random Read/Write Input/Output Operations Per Second (IOPS) ........................................................................ 10  
Random Read/Write IOPS Consistency................................................................................................................................ 11  
Sequential Read and Write Bandwidth................................................................................................................................. 11  
Latency ................................................................................................................................................................................................ 11  
Quality of Service............................................................................................................................................................................ 12  
Operating Voltage .......................................................................................................................................................................... 12  
Power Consumption...................................................................................................................................................................... 13  
Temperature, Shock, Vibration ................................................................................................................................................ 14  
Airflow Requirements for Intel SSD DC P3700 Series (Add-In Card) ..................................................................... 14  
Airflow Requirements for Intel SSD DC P3700 Series (2.5-inch Form Factor)................................................... 15  
Product Regulatory Compliance Specifications............................................................................................................... 15  
Reliability Specifications.............................................................................................................................................................. 16  
Pin Definition for 2.5-inch Form Factor (8639 connector specification) .............................................................. 20  
Pin Definition for Add-In Card (Half Height Half Length) Form Factor .................................................................. 22  
SMART Attributes (Log Identifier 02h).................................................................................................................................. 24  
Additional SMART Attributes (Log Identifier CAh) .......................................................................................................... 26  
Temperature Statistics (Log Identifier C5h) ....................................................................................................................... 27  
Drive Marketing Name Log (Log Identifier DDh)............................................................................................................... 28  
Read/Write Command Latency Log (Log Identifier C1h/C2h) ................................................................................... 28  
Set Max LBA Setting - Command Dword 11 and Command Dword 12................................................................ 29  
Status Code - Set Max LBA Command Specific Status Values .................................................................................. 29  
C6h - Set/ Get Power (Typical) Governor Setting Command Dword 11............................................................ 29  
Status Codes - Power Governor Setting Command Specific Status Values........................................................ 29  
D5h Reset Timed Workload Counters Command Dword 11 .............................................................................. 29  
E2h Set/Get Enable Latency Tracking ............................................................................................................................... 29  
NVMe Driver Support.................................................................................................................................................................... 30  
Device Certifications and Declarations................................................................................................................................. 31  
Identify Controller .......................................................................................................................................................................... 32  
Power State Descriptor................................................................................................................................................................ 36  
Identify Namespace....................................................................................................................................................................... 37  
LBA Format Data Structure ........................................................................................................................................................ 39  
Vital Product Data Structure (VPD)......................................................................................................................................... 40  
Capability List Pointer (Out of Band Temperature Sensor)......................................................................................... 40  
Register 0x05 read out format.................................................................................................................................................. 41  
Command Response on 0x6A (NVMe Workgroup Defined)....................................................................................... 42  
Command Response on 0x6A (Intel Specific) ................................................................................................................... 44  
PCIe ID.................................................................................................................................................................................................. 45  
LED Functionality............................................................................................................................................................................ 47  
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Product Specification  
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Intel® Solid-State Drive DC P3700 Series  
Revision History  
Revision  
Number  
Description  
Revision Date  
001  
June 2014  
Initial release  
Driver and temperature updates  
Updated performance information  
002  
July 2014  
Updated power number for 400GB  
Update driver/OS support list  
003  
004  
September 2014  
September 2014  
Endurance rating corrected  
Added clarification in SMART critical warning  
Corrected error is QoS percentile  
005  
006  
October 2014  
January 2015  
Modified power governor setting target for 01 and 02  
Updated Endurance Specifications  
Updated Log Identifier 0xCA and Identify Data Structure  
SMBUS footnote  
Added RHEL 6.6 Operating System Support  
Updated Quality of Service values  
Modified C7 (CRC Error Count) Description  
Modified Table 16 footnote  
007  
008  
March 2015  
March 2015  
Updated Power on to Ready specification  
Updated IDENTIFY Data Structure  
Updated OS support list  
Added additional log page supports (05h,C1h,C2h)  
Updated CAh log page with NAND Bytes and Host Bytes Written  
attributes  
009  
May 2015  
Updated SMBUS management features  
Clarified slew rate requirement  
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Intel® Solid-State Drive DC P3700 Series  
1
Overview  
This document describes the specifications and capabilities of the Intel® Solid-State Drive (SSD)  
Data Center P3700 Series.  
P3700 Series is a PCIe Gen3 SSD architected with the new high performance controller interface NVMe  
(Non-Volatile Memory express) delivering leading performance, low latency and Quality of Service. Matching  
the performance with world-class reliability and endurance, P3700 Series offers a range of capacity 400GB,  
800GB, 1.6TB and 2TB in both Add-In card and 2.5-inch form factor.  
With PCIe Gen3 support and NVMe queuing interface, the P3700 Series delivers excellent sequential read  
performance of up to 2.8GB/s and sequential write speeds of up to 2.0GB/s. P3700 Series delivers very high  
random read IOPS of 460K and random write IOPS of 175K for 4KB operations. Taking advantage of the direct path  
from the storage to the CPU by means of NVMe, P3700 Series exhibits low latency of less than 20 μs for sequential  
access to the SSD.  
P3700 Series also includes High Endurance Technology (HET), which combines NAND silicon enhancements and  
SSD NAND management techniques to extend SSD write endurance up to 17 drive writes per day for 5 years.  
The 2.5-inch P3700 Series takes advantage of the 8639 connector and provides  
hot-pluggable removal and insertion providing in-service replacement options.  
P3700 Series includes these key features:  
Consistently High IOPS and throughput  
Sustained low latency  
High Endurance Technology (HET)  
Variable Sector Size and End-to-End data-path protection  
Enhanced power-loss data protection  
Power loss protection capacitor self-test  
Out of band management  
Thermal throttling and monitoring  
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Intel® Solid-State Drive DC P3700 Series  
1.1 References  
Table 1: Standard Information referenced in this document  
Date  
Title  
Location  
Jan 2013  
Enterprise SSD Form Factor Version 1.0a  
Feb 2012  
Nov 2010  
July 2012  
Sept 2010  
NVMe Revision 1.0c  
PCIe Base Specification Revision 3.0  
Solid-State Drive (SSD) Requirements and Endurance Test  
Method (JESD219)  
Solid-State Drive (SSD) Requirements and Endurance Test  
Method (JESD218)  
Dec 2008  
VCCI  
Click Search MDDS Database and  
search for material description  
datasheet  
June 2009  
RoHS  
International Electrotechnical Commission EN 61000  
4-2 (Electrostatic discharge immunity test)  
4-3 (Radiated, radio-frequency, electromagnetic field immunity  
test)  
4-4 (Electrical fast transient/burst immunity test)  
4-5 (Surge immunity test)  
1995  
1996  
1995  
1995  
1997  
4-6 (Immunity to conducted disturbances, induced by radio-  
frequency fields)  
4-11 (Voltage Variations, voltage dips, short interruptions and  
voltage variations immunity tests)  
1994  
ENV 50204  
1995  
(Radiated electromagnetic field from digital radio telephones)  
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Intel® Solid-State Drive DC P3700 Series  
1.2 Terms and Acronyms  
Table 2: Glossary of Terms and Acronyms  
Term  
Definition  
Advanced Technology Attachment  
Cyclic Redundancy Check  
Device Activity Signal  
ATA  
CRC  
DAS  
Direct Memory Access  
DMA  
Error Correction Code  
ECC  
Electrically Erasable Programmable Read Only Memory  
Extended  
EEPROM  
EXT  
First Party Direct Memory Access  
FPDMA  
Gigabyte  
GB  
Note: The total usable capacity of the SSD may be less than the total physical capacity because a  
small portion of the capacity is used for NAND flash management and maintenance purposes.  
Gigabit  
Gb  
HDD  
HET  
KB  
Hard Disk Drive  
High Endurance Technology  
Kilobyte  
Input/Output  
I/O  
Input/Output Operations Per Second  
International Standards Organization  
Logical Block Address  
Megabyte (1,000,000 bytes)  
Multi-level Cell  
IOPS  
ISO  
LBA  
MB  
MLC  
MTBF  
NOP  
NVMe  
PB  
Mean Time Between Failures  
No Operation  
Non-Volatile Memory Express  
Petabyte  
Printed Circuit Board  
Reliability Demonstration Test  
Root Mean Square  
Solid-State Drive  
PCB  
RDT  
RMS  
SSD  
TB  
Terabyte  
Typical  
TYP  
UBER  
VPD  
Uncorrectable Bit Error Rate  
Vital Product Data  
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2
Product Specifications  
2.1 Capacity  
Table 3: User Addressable Sectors  
Unformatted Capacity  
(Total User Addressable Sectors in LBA Mode)  
Intel SSD DC P3700 Series  
400GB  
800GB  
1.6TB  
2TB  
781,422,768  
1,562,824,368  
3,125,627,568  
3,907,029,168  
NOTES:  
1 GB = 1,000,000,000 bytes; 1 sector = 512 bytes or 520 bytes or 528 bytes.  
LBA count shown represents total user storage capacity and will remain the same throughout the life  
of the drive.  
The total usable capacity of the SSD may be less than the total physical capacity because a small portion  
of the capacity is used for NAND media management and maintenance. IDEMA or JEDEC standard is used.  
2.2 Performance  
Table 4: Random Read/Write Input/Output Operations Per Second (IOPS)  
Intel SSD DC P3700 Series  
Specification1  
Unit  
400GB  
800GB  
1.6TB  
2TB  
Random 4KB 70/30 Read/Write  
(up to) 2  
IOPS  
IOPS  
150,000  
200,000  
240,000  
265,000  
Random 8KB 70/30 Read/Write  
(up to) 3  
75,000  
100,000  
140,000  
150,000  
Random 4KB Read(up to)2  
Random 4KB Write (up to)  
Random 8KB Read(up to)3  
Random 8KB Write (up to)  
IOPS  
IOPS  
IOPS  
IOPS  
450,000  
75,000  
275,000  
32,000  
460,000  
90,000  
285,000  
45,000  
450,000  
150,000  
290,000  
75,000  
450,000  
175,000  
295,000  
90,000  
NOTES:  
1.  
Performance measured using IOMeter* on Windows* Server 2012 R2 driver with Queue Depth 32 and 4 workers.  
Measurements are performed on a full Logical Block Address (LBA) span of the drive. Power mode set at 25W.  
4KB = 4,096 bytes  
8KB = 8,192 bytes  
2.  
3.  
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Table 5: Random Read/Write IOPS Consistency  
Intel SSD DC P3700 Series  
Specification1  
Unit  
400GB  
800GB  
1.6TB  
2TB  
%
%
%
%
Random 4KB Read (up to)2  
Random 4KB Write (up to)  
Random 8KB Read (up to)3  
90  
90  
90  
90  
90  
90  
90  
90  
90  
90  
90  
90  
90  
90  
90  
90  
Random 8KB Write (up to)  
NOTES:  
1.  
Performance consistency measured using IOMeter* based on Random 4KB with total queue depth of 128, measured as  
(IOPS in the 99.9th percentile slowest 1-second interval)/(average IOPS during the test). Measurements are performed  
on a full Logical Block Address (LBA) span of the drive once the workload has reached steady state but including all  
background activities required for normal operation and data reliability  
2.  
3.  
4KB = 4,096 bytes  
8KB = 8,192 bytes  
Table 6: Sequential Read and Write Bandwidth  
Intel SSD DC P3700 Series  
Specification  
Unit  
400GB  
800GB  
1.6TB  
2TB  
Sequential Read (up to)1  
Sequential Write (up to)1  
NOTES:  
MB/s  
MB/s  
2,700  
2,800  
2,800  
2,800  
1,080  
1,900  
1,900  
2,000  
1.  
Performance measured using IOMeter* with 128 KB (131,072 bytes) of transfer size with Queue  
Depth 128. Power mode set at 25W.  
Table 7: Latency  
Specification  
Intel SSD DC P3700 Series  
Latency1 (TYP)  
20/115 µs  
20/25 µs  
2.0 sec (TYP)  
10.0 sec (TYP)  
Read Sequential/Random  
Write Sequential/Random  
Power On to PCIe Config Ready2Power On to  
Controller Ready3  
NOTES:  
1.  
Latency measured using 4 KB (4,096 bytes) transfer size with Queue Depth equal to 1 on a sequential workload using  
Windows Server 2012 R2 driver. Power mode set at 25W.  
2.  
3.  
Power On To Ready time measured from de-assertion of PCIe* reset to PCIe Config Ready state.  
Power On to Controller ready signifies when drive can begin receiving PCIe commands from host based on a single  
#PERESET. For power on from unsafe shutdown, power on to controller ready can take up to 20 seconds.  
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Table 8: Quality of Service  
Intel SSD DC P3700 Series  
Specification  
Unit  
QD = 1  
QD = 128  
Quality of Service1,2 (99%)  
Reads  
ms  
0.120  
0.090  
0.750  
11  
Writes  
ms  
Quality of Service1,2 (99.99%)  
Reads  
Writes  
ms  
ms  
4
5
0.500 (400GB)  
0.250 (800GB, 1.6TB, 2.0TB)  
25  
NOTES:  
1.  
Device measured using IOMeter. Quality of Service measured using 4KB (4,096 bytes) transfer size on a random  
workload on a full Logical Block Address (LBA) span of the drive once the workload has reached steady state but  
including all background activities required for normal operation and data reliability.  
2.  
Based on Random 4KB QD=1,128 workloads, measured as the time taken for 99.0 (or 99.99) percentile of commands  
to finish the round-trip from host to drive and back to host.  
2.3 Electrical Characteristics  
Table 9: Operating Voltage  
Electrical Characteristics  
Intel SSD DC P3700 Series  
3.3V Operating Characteristics: (Add-in Card only)  
Operating Voltage range  
3.3 V (±10%)  
66/3300 V/s  
0.66/3300 V/s  
300 mV pp 10Hz 100 KHz  
50 mV pp 100KHz 20 MHz  
3 seconds  
Rise Slew Rate (Min/Max)  
Fall Slew Rate (Min/Max)1  
Noise level  
Min Off time2  
Inrush Current (Typical Peak) 3  
Max Average Current  
1.5 A  
3.0 A  
12V Operating Characteristics:  
Operating Voltage range  
Rise Slew Rate (Min/Max)  
Fall Slew Rate (Min/Max)1  
Noise level  
12 V (+10%/-20%)  
240/12000 V/s  
2.4/12000 V/s  
1000 mV pp 10Hz 100 KHz  
100 mV pp 100KHz 20 MHz  
3 seconds  
Min Off time2  
Inrush Current (Typical Peak) 3  
Max Average Current  
1.5 A  
2.1 A/ 2.45 A (Add-in Card/ 2.5-inch FF)  
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Electrical Characteristics  
Intel SSD DC P3700 Series  
3.3Vaux Operating Characteristics:  
Operating Voltage range  
Rise Slew Rate (Min/Max)  
Fall Slew Rate (Min/Max)1  
Noise level  
3.3 V (±9%)  
66/3300 V/s  
0.66/3300 V/s  
300 mV pp 10Hz 100 KHz  
50 mV pp 100KHz 20 MHz  
20mA/1mA (AIC/2.5-inch FF)  
Max Current  
Notes:  
1.  
Fall time needs to be equal or better than minimum in order to guarantee full functionality of enhanced power  
loss management.  
2.  
3.  
The drive must be powered off for at least 3 seconds before powering on.  
Measured during initial power supply application. Typically this will be seen within 2 seconds of initial power up.  
Inrush specified for 12V and 3.3V supply, not the 3.3Vaux.  
4.  
3.3Vaux is optional, not needed for power up or functionality. 3.3Vaux is needed for accessing VPD page by means  
of SMBUS for both form factors.  
Table 10: Power Consumption  
Intel SSD DC P3700 Series  
Specification  
Unit  
400GB  
800GB  
1.6TB  
22  
2TB  
25  
11  
4
Active Write - Average1  
Active Read - Average2  
Idle  
W
W
W
12  
9
18  
9
10  
4
4
4
Notes:  
1.  
The workload equates 128KB (131,072 bytes) Queue Depth equal to 128 sequential writes. Average power is  
measured using scope trigger over a 100 ms sample period.  
2.  
The workload equates 128KB (131,072 bytes) Queue Depth equal to 128 sequential reads.  
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Intel® Solid-State Drive DC P3700 Series  
2.4 Environmental Conditions  
Table 11: Temperature, Shock, Vibration  
Temperature  
Add-In card form factor  
2.5-inch form factor  
Temperature  
Operating1  
Ambient: 0 55o C / 0 -40o C2  
-5595o C  
Ambient: 035o C, Case: 0-70o C  
Non-operating3  
Temperature Gradient4  
Operating  
30o C/hr (Typical)  
30o C/hr (Typical)  
30o C/hr (Typical)  
30o C/hr (Typical)  
Non-operating  
Humidity  
Operating  
Non-operating  
595%  
595%  
595%  
595%  
Shock and Vibration  
Range  
Shock5  
Operating  
Non-operating  
50 G Trapezoidal, 170 in/s  
50 G Trapezoidal, 170 in/s  
1,000 G (Max) at 0.5 msec  
1,000 G (Max) at 0.5 msec  
Vibration6  
Operating  
Non-operating  
2.17 GRMS (5-700 Hz) Max  
3.13 GRMS (5-800 Hz) Max  
2.17 GRMS (5-700 Hz) Max  
3.13 GRMS (5-800 Hz) Max  
Notes:  
1.  
Operating temperature implies ambient air temperature under defined airflow in Tables 12 and 13.  
0-55° C is for airflow from the server towards the card and 0-40° C is for airflow into the server.  
Please contact your Intel representative for details on the non-operating temperature range.  
Temperature gradient measured without condensation.  
2.  
3.  
4.  
5.  
Shock specifications assume the SSD is mounted securely with the input vibration applied to the  
drive-mounting screws. Stimulus may be applied in the X, Y or Z axis. Shock specification is measured  
using Root Mean Squared (RMS) value.  
6.  
Vibration specifications assume the SSD is mounted securely with the input vibration applied to the  
drive-mounting screws. Stimulus may be applied in the X, Y or Z axis. Vibration specification is measured  
using RMS value.  
Table 12: Airflow Requirements for Intel SSD DC P3700 Series (Add-In Card)  
Intel SSD DC P3700 Series  
Airflow  
Direction  
Ambient  
Temperature  
Unit  
2TB  
400GB  
800GB  
1.6TB  
Towards  
the server  
LFM  
LFM  
40o C  
55o C  
200  
300  
300  
300  
Out of the  
server  
200  
300  
300  
300  
NOTE: For Add-In cards airflow can be for both the directions. Airflow specified is based on approach velocity.  
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Intel® Solid-State Drive DC P3700 Series  
Table 13: Airflow Requirements for Intel SSD DC P3700 Series (2.5-inch Form Factor)  
Intel SSD DC P3700 Series  
Airflow  
Definition  
Ambient  
Temperature  
Unit  
400GB  
300  
250  
70  
800GB  
500  
350  
120  
85  
1.6TB  
650  
450  
155  
110  
2TB  
650  
450  
155  
110  
LFM  
LFM  
LFM  
LFM  
35o C  
25o C  
35o C  
25o C  
Airflow Along  
Drive1  
Approach  
Airflow2  
60  
Notes:  
1.  
It is recommended that airflow for 2.5-inch form factor should be towards the server, from the non-connector  
side to the connector side. Airflow is specified across the surface of the drive. Spacing between two SSDs is  
assumed to be 3mm.  
2.  
The approach velocity of the airflow will be less than the airflow along the surface. Approach area  
of 1.35 ft2 is assumed.  
2.5 Product Regulatory Compliance  
Intel SSD DC P3700 Series meets or exceeds the following regulatory or certification requirements.  
Table 14: Product Regulatory Compliance Specifications  
Region For Which  
Conformity Declared  
Title  
Description  
FCC Part 15B Class A  
TITLE 47-Telecommunications CHAPTER 1 –  
FEDERAL COMMUNMICATIONS COMMISSION PART  
15 RADIO FREQUENCY DEVICES  
ICES*-003, Issue 4 Interference-Causing Equipment  
Standard Digital Apparatus  
USA  
CA/CSA-CEI/IEC CISPR 22:10. This is  
CISPR 22:2008 with Canadian  
Modifications  
Canada  
IEC* 55024 Information Technology Equipment –  
Immunity characteristics Limits and methods of  
measurement CISPR24:2010  
EN-55024: 2010 and its amendments  
EN-55022: 2010 and its amendments  
European Union  
IEC 55022 Information Technology Equipment –  
Radio disturbance Characteristics Limits and  
methods of measurement CISPR24:2008 (Modified)  
European Union  
USA/Canada  
Information Technology Equipment –  
Safety Part 1: General Requirements  
EN-60950-1 2nd Edition  
Information Technology Equipment –  
Safety Part 1: General Requirements  
UL/CSA EN-60950-1 2nd Edition  
USA/Canada  
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Intel® Solid-State Drive DC P3700 Series  
2.6 Reliability Specifications  
Intel SSD DC P3700 Series meets or exceeds SSD endurance and data retention requirements as specified in the  
JESD218 standard. Reliability specifications are listed in the following table.  
Table 15: Reliability Specifications  
Parameter  
Value  
Uncorrectable Bit Error Rate (UBER)  
Uncorrectable bit error rate will not exceed one sector in the  
specified number of bits read. In the unlikely event of a non-  
recoverable read error, the SSD will report it as a read failure to the  
host; the sector in error is considered corrupt and is not returned to  
the host.  
< 1 sector per 1017 bits read  
Mean Time Between Failures (MTBF)  
Mean Time Between Failures is estimated based on Telcordia*  
methodology and demonstrated through Reliability Demonstration  
Test (RDT).  
2 million hours  
Data Retention  
3 months power-off retention once SSD  
reaches rated write endurance at 40° C  
The time period for retaining data in the NAND at maximum  
rated endurance.  
400GB: 7.3 PBW  
800GB: 14.6 PBW  
(10 drive writes/day*)  
1.6TB: 43.8 PBW  
(15 drive writes/day*)  
2.0TB: 62.05 PBW  
(17 drive writes/day*)  
Endurance Rating  
The number of drive writes such that the SSD meets the  
requirements according to the JESD218 standard. Endurance rating  
verification is defined to establish UBER <1E-16 at 60% upper  
confidence limit.  
Note: Petabytes Written (PBW). Refer to JESD218 standard table 1 for UBER, FFR and other Enterprise SSD  
requirements.  
2.7 Temperature Sensor  
P3700 Series has an internal temperature sensor with an accuracy of +/-2° C over a range of -10° C to +85° C which  
can be monitored using NVMe Health Log.  
For more information on sensor reading see SMART attributes section. In addition, drive will provide out of band  
access to temperature by means of SMBUS. The sensor has an accuracy of +/- 3° C over a range of -20° C to 125° C.  
SMBUS temperature sensor will not be reported in NVMe Health Log.  
2.8 Power Loss Capacitor Test  
P3700 Series supports testing of the power loss capacitor, which can be monitored using SMART attribute critical  
warning in log page identifier 02h, byte 0, bit 4.  
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Intel® Solid-State Drive DC P3700 Series  
2.9 Hot Plug Support  
2.5-inch form factor will support surprise hot plug feature in capable platforms and OSs. P3700 Series supports  
hot insertion and removal and surprise hot insertion by means of presence detect and link-up detect. On surprise  
hot removal during IOs, P3700 Series will ensure the integrity of already committed data on the media and commit  
acknowledged writes to the media.  
2.10 Out of Band Management (SMBUS)  
Intel SSD DC P3700 Series provides out of band management by means of SMBUS interface. This requires 3.3V  
Auxiliary voltage. SMBUS accesses a VPD page as listed in Appendix B through address 0X53/0XA6 (7bit/8bit).  
Temperature sensor is accessed through address 0x1B/0x36(7bit/8bit). For temperature sensor access,  
temperature can be read by the BMC (base) using Read Temperature Data Register (0x05) by means of SMBUS  
0x1B. Bits [11:0] return raw ambient temperature.  
Intel SSD DC P3700 provides additional drive information via address 0x6/0xD4(7bit/8bit) as outlined in the NVMe  
Appendix B, C and D have details on the Out of Band Management data structure.  
NOTES:  
1. In certain tools the address for the VPD and temperature sensor will appear as 0xA6 and 0x36  
respectively, due to bit shift.  
2. BMC should not access the SMBUS address within 100msec of device power up, it may experience  
some glitch on the bus.  
2.11 Variable Sector Size Support  
P3700 Series supports 512, 520, 528, 4096, 4104, 4160 and 4224 byte sector sizes. P3700 Series will also support  
DIF as specified in NVMe 1.0 specification. Host sector sizes supporting DIF are 512 bytes and 4096 bytes with a PI  
(Protection Information) of 8 bytes.  
In terms of protection information action (PRACT), bit 29 of DWORD12 in READ/WRITE command should not be  
equal to 1. Device only supports PRACT=0 implying protection information is passed to the SSD and checked by  
the SSD.  
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Intel® Solid-State Drive DC P3700 Series  
3
Mechanical Information  
Figures 3-1 and 3-2 show the physical package information for the IntelSSD DC P3700 Series in the 2.5-inch form  
factors. All dimensions are in millimeters.  
Figure 3-1:  
Intel SSD DC P3700 Series SFF Dimensions  
X Length  
100.45 Max  
Y - Width  
Z - Height  
69.85 +/- 0.25  
15.0 +0/-0.5  
Note: Length does not include 0.3 connector protrusion  
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Intel® Solid-State Drive DC P3700 Series  
Figure 3-2:  
Intel SSD DC P3700 Series PCIe Dimensions  
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Intel® Solid-State Drive DC P3700 Series  
4
Pin and Signal Descriptions  
4.2 Pin Signal Definitions  
Table 16: Pin Definition for 2.5-inch Form Factor (8639 connector specification)  
Pin  
S1  
Name  
GND  
Description  
Pin  
E7  
Name  
Description  
Ground  
REFCLK0+  
REFCLK0-  
GND  
Reference clock port 0  
Reference clock port 0  
Ground  
S2  
S3  
S4  
S5  
S6  
S7  
Not used (SATA/SAS)  
Not used (SATA/SAS)  
Ground  
E8  
E9  
GND  
E10  
E11  
E12  
E13  
PETp0  
PETn0  
GND  
Transmitter differential pair, Lane 0  
Transmitter differential pair, Lane 0  
Ground  
Not used (SATA/SAS)  
Not used (SATA/SAS)  
Ground  
GND  
PERn0  
Receiver differential pair, Lane 0  
Reference clock port 1  
(not used)  
E1  
REFCLK1+  
E14  
PERp0  
Receiver differential pair, Lane 0  
Reference clock port 1  
(not used)  
E2  
E3  
E4  
REFCLK1-  
3.3Vaux  
E15  
E16  
S8  
GND  
RSVD  
GND  
Ground  
Reserved  
Ground  
3.3V auxiliary power  
Fundamental reset port 1  
(not used)  
PERST1#  
E5  
E6  
P1  
P2  
P3  
P4  
P5  
P6  
P7  
P8  
P9  
PERST0#  
RSVD  
Fundamental reset port 0  
Reserved  
S9  
Not used (SATAe/SAS)  
Not used (SATAe/SAS)  
Ground  
S10  
S11  
S12  
S13  
S14  
S15  
S16  
S17  
S18  
S19  
Not used (SATAe/SAS)  
Not used (SATAe/SAS)  
Not used (SATAe)  
Interface detect (drive type)  
Ground  
GND  
Not used (SATAe/SAS)  
Not used (SATAe/SAS)  
Ground  
IfDet_N  
GND  
GND  
RSVD  
GND  
Reserved  
GND  
Ground  
Ground  
Not used (SATA/SAS)  
Not used (SATA/SAS)  
Not used (SATA/SAS)  
PETp1  
PETn1  
GND  
Transmitter differential pair, Lane 1  
Transmitter differential pair, Lane 1  
Ground  
Presence detect  
(also used for drive type)  
P10  
PRSNT_N  
S20  
PERn1  
Receiver differential pair, Lane 1  
P11  
P12  
P13  
P14  
P15  
Activity  
Hot-Plug  
+12V_pre  
+12V  
Activity signal from the drive  
Ground  
S21  
S22  
S23  
S24  
S25  
S26  
S27  
S28  
PERp1  
GND  
Receiver differential pair, Lane 1  
Ground  
12V power  
PETp2  
PETn2  
GND  
Transmitter differential pair, Lane 2  
Transmitter differential pair, Lane 2  
Ground  
12V power  
+12V  
12V power  
PERn2  
PERp2  
GND  
Receiver differential pair, Lane 2  
Receiver differential pair, Lane 2  
Ground  
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Intel® Solid-State Drive DC P3700 Series  
Pin  
Name  
Description  
Pin  
Name  
PETp3  
Description  
E17  
E18  
E19  
E20  
E21  
E22  
E23  
E24  
E25  
Transmitter differential pair, Lane 3  
Transmitter differential pair, Lane 3  
Ground  
PETn3  
GND  
PERn3  
PERp3  
GND  
Receiver differential pair, Lane 3  
Receiver differential pair, Lane 3  
Ground  
SMCLK  
SMDAT  
DualPortEn_N  
SMBus clock  
SMBus data  
Dual port enable  
NOTES:  
SMCLK and SMDAT routes to an internal EEPROM which contains Vital Product Data (VPD).  
PRSNT_N is kept open by the P3700 Series.  
IfDet_N is grounded by P3700 Series.  
DualPortEn_N pin should be left un-connected or un-driven by the system to enable single port operation with  
all 4 lanes. If un-connected, P3700 Series will pull it high. However, if the pin is asserted by the system (driven  
low by storage backplane), then P3700 Series will be configured as x2 lanes  
Transmit differential pair lanes have 220 nF of AC coupling capacitance.  
P11 is used for activity. When idle, logic level is low (LED Solid On). During IO activity and formatting,  
pin toggles 250msec high, 250msec low signal.  
P3700 Series only uses REFCLK0+ and REFCLK0- as reference clock pair.  
P3700 Series only uses PERST0# as a fundamental reset.  
3.3Vaux is only needed during SMBUS access to the VPDROM.  
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Intel® Solid-State Drive DC P3700 Series  
Table 17: Pin Definition for Add-In Card (Half Height Half Length) Form Factor  
Side B  
Description  
Side A  
Description  
Pin  
Name  
+12V  
Name  
1
2
3
4
12V power  
12V power  
12V power  
Ground  
PRSNT1#  
+12V  
Hot-Plug presence detect  
12V power  
+12V  
+12V  
GND  
+12V  
12V power  
GND  
Ground  
TCK (Test Clock), clock input for JTAG  
interface  
5
SMCLK  
SMBus(System Management Bus) clock  
JTAG2  
6
7
8
9
SMDAT  
GND  
SMBus (System Management Bus) data  
Ground / UART_HOST  
3.3V power  
JTAG3  
JTAG4  
JTAG5  
TDI (Test Data Input)  
TDO (Test Data Output)  
TMS (Test Mode Select)  
3.3V power  
+3.3V  
JTAG1  
3.3Vaux  
WAKE#  
TRST# (Test Reset) resets the JTAG interface +3.3V  
10  
11  
3.3V auxiliary power  
+3.3V  
3.3V power  
Signal for Link reactivation  
PERST#  
Fundamental reset  
Mechanical Key  
12  
13  
14  
15  
16  
17  
18  
RSVD  
GND  
Reserved  
GND  
Ground  
Ground  
REFCLK+  
REFCLK-  
GND  
Reference clock (differential pair)  
Reference clock (differential pair)  
Ground  
PETp0  
PETn0  
GND  
Transmitter differential pair, Lane 0  
Transmitter differential pair, Lane 0  
Ground  
PERp0  
PERn0  
GND  
Receiver differential pair, Lane 0  
Receiver differential pair, Lane 0  
Ground  
PRSNT2# Hot-Plug presence detect  
GND Ground  
End of the x1 Connector  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
PETp1  
PETn1  
GND  
Transmitter differential pair, Lane 1  
Transmitter differential pair, Lane 1  
Ground  
RSVD  
GND  
Reserved  
Ground  
PERp1  
PERn1  
GND  
Receiver differential pair, Lane 1  
Receiver differential pair, Lane 1  
Ground  
GND  
Ground  
PETp2  
PETn2  
GND  
Transmitter differential pair, Lane 2  
Transmitter differential pair, Lane 2  
Ground  
GND  
Ground  
PERp2  
PERn2  
GND  
Receiver differential pair, Lane 2  
Receiver differential pair, Lane 2  
Ground  
GND  
Ground  
PETp3  
PETn3  
GND  
Transmitter differential pair, Lane 3  
Transmitter differential pair, Lane 3  
Ground  
GND  
Ground  
PERp3  
PERn3  
GND  
Receiver differential pair, Lane 3  
Receiver differential pair, Lane 3  
Ground  
RSVD  
Reserved  
PRSNT2# Hot-Plug presence detect  
GND Ground  
RSVD  
Reserved  
End of the x4 Connector  
NOTES:  
All pins are numbered in ascending order from the left to the right, with side A on the top of the centerline and  
side B on the bottom of the centerline, use the reference drawing in Fig2, with the logo visible.  
The PCI Express interface pins PETpx, PETnx, PERpx, and PERnx are named with the following convention: “PE”  
stands for PCI Express high speed, “T” for Transmitter, “R” for Receiver, “p” for positive (+) and “n” for negative (-).  
The sequential mating for Hot-Plug is accomplished by staggering the edge fingers on the add-in card.  
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Intel® Solid-State Drive DC P3700 Series  
5
Supported Command Sets  
Intel SSD DC P3700 Series supports all mandatory Admin and I/O commands defined in NVMe  
(Non-Volatile Memory Express) revision 1.0.  
5.1 NVMe Admin Command Set  
P3700 Series supports all mandatory NVMe commands, which consists of:  
Delete I/O Submission Queue  
Delete I/O Completion Queue  
Create I/O Submission Queue  
Create I/O Completion Queue  
Get Log Page  
Identify  
Abort  
SET Features  
GET Features  
Asynchronous Event Notification  
P3700 Series also supports the following optional I/O commands defined in NVMe revision 1.0:  
Firmware Activate  
Firmware Image Download  
Format NVM  
Note:  
See Appendix A, “Identify Controller Data Structure” for details on commands  
and capabilities.  
5.2 NVMe I/O Command Set  
P3700 Series supports all the mandatory NVMe I/O command set defined in NVMe 1.0  
specification, which consists of:  
Flush  
Write  
Read  
Additionally, the following optional commands are supported:  
Write Uncorrectable  
Dataset Management (De-allocate only)  
Note: See Appendix G, “SCSI Command Translation Table” for details on SCSI supported commands and  
capabilities.  
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Intel® Solid-State Drive DC P3700 Series  
5.3 Log Page Support  
Intel SSD DC P3700 Series supports the following mandatory log pages defined in NVMe 1.0  
specification:  
Error Information (Log Identifier 01h)  
SMART/ Health Information (Log Identifier 02h)  
Firmware Slot Information (Log Identifier 03h)  
Command Effects Log (Log Identifier 05h)  
Note: See NVMe 1.0 version of the specification for the log page content. Additionally, P3700 Series will support  
the following vendor unique log pages:  
Log Page Directory (Log Identifier C0h)  
Read Command Latency Statistics Log (Log Identifier C1h)  
Write Command Latency Statistics Log (Log Identifier C2h)  
Temperature Statistics (Log Identifier C5h)  
Vendor Unique SMART Log (Log Identifier CAh)  
5.4 SMART Attributes  
The following table lists the SMART attributes supported by the P3700 Series in accordance with  
NVMe 1.0 specification.  
Table 18: SMART Attributes (Log Identifier 02h)  
# of  
Bytes  
Byte  
Attribute  
Description  
Critical Warning: These bits if set, flag various  
warning sources.  
Bit 0: Available Spare is below Threshold  
Bit 1: Temperature has exceeded Threshold  
Any of the critical warning can be tied to  
asynchronous event notification. Drive  
Health Indicator defined under bytes 3095-  
3076 of Identify Controller may still indicate  
“healthy” status when the critical warning  
flag is set.  
Bit 2: Reliability is degraded due to excessive media  
0
1
or internal errors  
Bit 3: Media is placed in Read- Only Mode  
Bit 4: Volatile Memory Backup System has failed  
(e.g., enhanced power loss capacitor test failure)  
Bits 5-7: Reserved  
For AIC, this reports the NAND temperature,  
for 2.5-inch FF, this reports the case  
temperature,  
Temperature: Overall Device current temperature in  
Kelvin.  
1
2
Available Spare: Contains a normalized percentage  
(0 to 100%) of the remaining spare capacity  
available  
3
4
1
1
Starts from 100 and decrements.  
Available Spare Threshold  
Threshold is set to 10%.  
A value of 100 indicates that the estimated  
endurance of the device has been  
consumed, but may not indicate a device  
failure. The value is allowed to exceed 100.  
Percentages greater than 254 shall be  
represented as 255. This value shall be  
updated once per power-on hour (when the  
controller is not in a sleep state).  
Percentage Used Estimate (Value allowed to exceed  
100%)  
5
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# of  
Byte  
Attribute  
Description  
Bytes  
Contains the number of 512 byte data units  
the host has read from the controller; this  
value does not include metadata. This value  
is reported in thousands (i.e., a value of 1  
corresponds to 1000 units of 512 bytes  
read) and is rounded up. When the LBA size  
is a value other than 512 bytes, the  
32  
16  
Data Units Read (in LBAs)  
controller shall convert the amount of data  
read to 512 byte units.  
Contains the number of 512 byte data units  
the host has written to the controller; this  
value does not include metadata. This value  
is reported in thousands (i.e., a value of 1  
corresponds to 1000 units of 512 bytes  
written) and is rounded up. When the LBA  
size is a value other than 512 bytes, the  
controller shall convert the amount of data  
written to 512 byte units. For the NVM*  
command set, logical blocks written as part  
of Write operations shall be included in this  
value. Write Uncorrectable commands shall  
not impact this value.  
48  
16  
Data Units Write (in LBAs)  
Contains the number of read commands  
issued to the controller.  
64  
80  
16  
16  
Host Read Commands  
Host Write Commands  
Contains the number of write commands  
issued to the controller.  
Contains the amount of time the controller is  
busy with I/O commands. The controller is  
busy when there is a command outstanding  
to an I/O Queue (specifically, a command  
was issued by way of an I/O Submission  
Queue Tail doorbell write and the  
96  
16  
Controller Busy Time (in minutes)  
corresponding completion queue entry has  
not been posted yet to the associated I/O  
Completion Queue). This value is reported in  
minutes.  
112  
128  
16  
16  
Power Cycles  
Contains the number of power cycles.  
Contains the number of power-on hours.  
This does not include time that the  
controller was powered and in a low power  
state condition.  
Power On Hours  
Contains the number of unsafe shutdowns.  
This count is incremented when a shutdown  
notification (CC.SHN) is not received prior to  
loss of power.  
144  
16  
Unsafe shutdowns  
Contains the number of occurrences where  
the controller detected an unrecovered data  
integrity error. Errors such as uncorrectable  
ECC, CRC checksum failure, or LBA tag  
mismatch are included in this field.  
160  
176  
16  
16  
Media Errors  
Contains the number of Error Information  
log entries over the life of the controller.  
Number of Error Information Log Entries  
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Table 19: Additional SMART Attributes (Log Identifier CAh)  
Byte  
# of Bytes  
Attribute  
AB (Program Fail Count)  
Description  
0
1
1
6
1
1
6
1
1
Raw value: shows total count of program fails.  
Normalized value: beginning at 100, shows the  
percent remaining of allowable program fails.  
3
Normalized Value  
Current Raw Value  
AC (Erase Fail Count)  
Normalized Value  
Current Raw Value  
AD (Wear Leveling Count)  
Normalized Value  
5
12  
15  
17  
24  
27  
Raw value: shows total count of erase fails.  
Normalized value: beginning at 100, shows the  
percent remaining of allowable erase fails.  
Raw value:  
Bytes 1-0: Min. erase cycle  
Bytes 3-2: Max. erase cycle  
Bytes 5-4: Avg. erase cycles  
Normalized value: decrements from 100 to 0.  
29  
6
Current Raw Value  
36  
39  
41  
48  
51  
1
1
6
1
1
B8 (End to End Error Detection Count)  
Normalized Value  
Raw value: reports number of End-to-End  
detected and corrected errors by hardware.  
Normalized value: always 100.  
Current Raw Value  
C7 (CRC Error Count)  
Normalized Value  
Raw value: total number of PCIe Interface CRC  
errors encountered, as specified in PCIe Link  
Performance Counter Parameter for “Bad TLP”.  
Normalized value: always 100.  
53  
6
Current Raw Value  
60  
63  
1
1
E2 (Timed Workload, Media Wear)  
Normalized Value  
Raw value: measures the wear seen by the SSD  
(since reset of the workload timer, attribute E4h),  
as a percentage of the maximum rated cycles.  
Divide the raw value by 1024 to derive the  
percentage with 3 decimal points.  
65  
6
Current Raw Value  
Normalized value: always 100.  
72  
75  
1
1
E3 (Timed Workload, Host Reads %)  
Normalized Value  
Raw value: shows the percentage of I/O  
operations that are read operations (since reset  
of the workload timer, attribute E4h). Reported  
as integer percentage from 0 to 100.  
Normalized value: always 100.  
77  
6
Current Raw Value  
84  
87  
89  
96  
99  
1
1
6
1
1
E4 (Timed Workload, Timer)  
Normalized Value  
Raw value: measures the elapsed time (number  
of minutes since starting this workload timer).  
Normalized value: always 100.  
Current Raw Value  
EA (Thermal Throttle Status)  
Normalized Value  
Raw value: reports Percent Throttle Status and  
Count of events  
Byte 0: Throttle status reported as integer  
percentage.  
Bytes 1-4: Throttling event count. Number of  
times thermal throttle has activated. Preserved  
over power cycles.  
101  
6
Current Raw Value  
Byte 5: Reserved.  
Normalized value: always 100.  
108  
1
F0 (Retry Buffer Overflow Counter)  
Raw Value: Counter to indicate the number of  
times Retry Buffer has overflown  
111  
113  
1
6
Normalized Value  
Current Raw Value  
Normalized Value is always 100  
120  
123  
125  
1
1
6
F3 (PLL Lock Loss Count)  
Normalized Value  
Raw Value: Counter to indicate the number of  
times PCIe Refclock PLL has unlocked  
Normalized Value is always 100  
Current Raw Value  
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Byte  
# of Bytes  
Attribute  
Description  
Nand sectors written divided by 65536  
(1 count = 32 MiB)  
132  
135  
137  
144  
147  
149  
1
1
6
1
6
6
F4 (NAND Bytes Written)  
Normalized Value  
Current Value  
Normalized value always 100  
Host sectors written divided by 65536  
(1 count = 32 MiB)  
F5 (Host Bytes Written)  
Normalized Value  
Current Value  
Normalized value always 100  
5.5 Temperature Statistics  
Table 20: Temperature Statistics (Log Identifier C5h)  
Byte  
0
# of Bytes  
Description  
8
8
8
8
8
8
8
8
Current Temperature  
Overtemp shutdown Flag for last critical component temperature  
Overtemp shutdown Flag for life critical component temperature  
Highest temperature  
8
16  
24  
32  
80  
96  
104  
Lowest temperature  
Specified Maximum Operating Temperature  
Specified Minimum Operating Temperature  
Estimated offset  
Note: For 2.5-inch form factor, case temperature is reported.  
For Add-in Card, NAND temperature is reported.  
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5.6 Drive Marketing Name Log  
Table 21: Drive Marketing Name Log (Log Identifier DDh)  
Byte  
0
# of Bytes  
Log Page Content  
8
1
Intel  
Space  
SSD  
8
9
3
12  
1
Space  
DC  
13  
2
15  
1
Space  
P3700  
Space  
Series  
Reserved  
16  
5
21  
1
22  
6
28-511  
484  
5.7 IO Command Latency Statistics  
Table 22: Read/Write Command Latency Log (Log Identifier C1h/C2h)  
Byte  
0
# of Bytes  
Log Page Content  
Major Revision  
Minor Revision  
2
2
2
First group of buckets: range 0-1ms, step 32us, each bucket size is 4 bytes, total 32  
buckets  
4
128  
124  
124  
Second group of buckets: range 1-32ms, step 1ms, each bucket size is 4 bytes, total 31  
buckets  
132  
256  
Third group of buckets: range 32ms-1s, step 32ms, each bucket size is 4 bytes, total 31  
buckets  
5.8 SET Feature Identifiers  
In addition to the SMART attribute structure, features pertaining to the operation and health of the Intel SSD DC  
P3700 Series can be reported to the host on request through the Get Features command. P3700 Series can change  
settings using SET Features on the following items as defined in NVMe 1.0 specification.  
Arbitration (Feature Identifier 01h)  
Power Management (Feature Identifier 02h)  
Temperature Threshold (Feature Identifier 04h)  
Error Recovery (Feature Identifier 05h)  
Volatile Write Cache (Feature Identifier 06h)  
Number of Queues (Feature Identifier 07h)  
Interrupt Coalescing (Feature Identifier 08h)  
Interrupt Vector Configuration (Feature Identifier 09h)  
Write Atomicity (Feature Identifier 0Ah)  
Asynchronous Event Configuration (Feature Identifier 0Bh)  
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Intel® Solid-State Drive DC P3700 Series  
Intel SSD DC P3700 Series will also support the following vendor unique SET Features.  
Set/Get Max LBA (Feature Identifier C1h)  
Get Native Max LBA (Feature Identifier C2h)  
Power Governor Setting (Feature Identifier C6h)  
Reset Timed Workload Counters (Feature Identifier D5h)  
Set/Get Enable Latency Tracking (Feature Identifier E2h)  
Table 23: Set Max LBA Setting - Command Dword 11 and Command Dword 12  
Bit  
Description  
Maximum User LBA: Write Usage: This field sets the 64-bit maximum LBA addressable by  
the Drive.  
Read Usage: This field contains the 64-bit maximum LBA addressable by the Drive.  
Command Dword 11 contains bits 31:00; Command Dword 12 contains bits 63: 32.  
63:00  
Table 24: Status Code - Set Max LBA Command Specific Status Values  
Value  
Description  
Requested MAX LBA exceeds Available capacity  
C0h  
C1h  
C2h  
Requested MAX LBA smaller than minimum allowable limit.  
Requested MAX LBA is smaller than allocated Namespace requirements  
Table 25: C6h - Set/ Get Power (Typical) Governor Setting Command Dword 11  
Bit  
Description  
31:08  
07:00  
Reserved (TBD)  
Power Governor Setting: 00h = 25W , 01h = 20W , 02h = 10W  
Table 26: Status Codes - Power Governor Setting Command Specific Status Values  
Value  
Description  
C0h  
Invalid Setting  
Table 27: D5h Reset Timed Workload Counters Command Dword 11  
Bit  
Description  
31:01  
Reserved  
Timed Workload Reset Settings: Write Usage: 00 = NOP, 1 = Reset E2, E3,E4 counters; Read  
Usage: Not Supported  
00  
Note: Get Features will not work for “Reset Timed Workload Counters” and status code is same as Table 25.  
Table 28: E2h Set/Get Enable Latency Tracking  
Bit  
Description  
31:01  
Write Usage: 00h = Disable Latency Tracking (Default) 01h = Enable Latency Tracking  
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Intel® Solid-State Drive DC P3700 Series  
6
NVMe Driver Support  
The following table describes the NVMe Driver Support for Intel SSD DC P3700 Series. The support includes  
releasing and validating NVMe drivers for certain operating systems and validating functionality for open source  
drive, inbox or native drivers for select operating systems.  
Table 29: NVMe Driver Support  
Support Level  
Intel Provided1  
Operating System Description  
Windows Server 2012 R2, 2012, 2008 R2 x64, Windows 7(32bit/64bit),  
Windows 8 (32bit/64bit), Windows 8.1, Windows 10, (32bit/64Bit), VMWare  
ESXi 5.5  
RHEL 6.5, RHEL 6.6, RHEL 6.7, RHEL 7.0, RHEL 7.1, SLES11 SP3, SP4, SLES12,  
CentOS 6.5, Citrix XenServer 6.5, Windows Server 2012 R2, Windows 8.1  
In-box Driver2  
NOTES:  
1.  
2.  
With Intel provided driver, full product specification is guaranteed, booting is only supported for 64bit OS  
With open source non-Intel driver, compatibility and functionality is validated  
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Intel® Solid-State Drive DC P3700 Series  
7
Certifications and Declarations  
Table 30: Device Certifications and Declarations  
Certification  
Description  
European Economic Area (EEA): Compliance with the essential requirements of EC Council  
Directives Low Voltage Directive (LVD) 2006/95/EC, EMC Directive 2004/108/EC and Directive  
2011/65/EU.  
CE* Compliant  
UL* Recognized  
Certified Underwriters Laboratories, Inc. Bi-National Component Recognition; UL 60950-1, 2nd  
Edition, 2007-03-27 (Information Technology Equipment - Safety - Part 1: General  
Requirements)  
CSA C22.2 No. 60950-1-07, 2nd Edition, 2007-03 (Information Technology Equipment - Safety  
- Part 1: General Requirements)  
Compliance with the Australia/New Zealand Standard AS/NZS3548 and Electromagnetic  
Compatibility (EMC) Framework requirements of the Australian Communication Authority (ACA).  
C-Tick* Compliant  
BSMI* Compliant  
Compliance to the Taiwan EMC standard CNS 13438: Information technology equipment -  
Radio disturbance Characteristics - limits and methods of measurement, as amended on June 1,  
2006, is harmonized with CISPR 22: 2005.04.  
Compliance with paragraph 1 of Article 11 of the Electromagnetic Compatibility Control  
Regulation and meets the Electromagnetic Compatibility (EMC) Framework requirements of the  
Radio Research Laboratory (RRL) Ministry of Information and Communication Republic of Korea.  
KCC*  
Voluntary Control Council for Interface to cope with disturbance problems caused by personal  
computers or facsimile.  
VCCI*  
Microsoft* WHCK  
RoHS* Compliant  
WEEE*  
Microsoft Windows Hardware Certification Kit  
Restriction of Hazardous Substance Directive  
Directive on Waste Electrical and Electronic Equipment  
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Intel® Solid-State Drive DC P3700 Series  
Appendix A IDENTIFY Data Structure  
Table 31: Identify Controller  
F = Fixed  
V = Variable  
X = Both  
Default  
Value  
Bytes  
Interpretation  
Description  
Contains the company vendor  
identifier that is assigned by the  
PCI SIG  
1-0  
3-2  
F
8086h  
PCI Vendor ID (VID)  
Contains the company vendor  
identifier that is assigned by the  
PCI SIG for subsystem  
F
V
V
8086h  
varies  
varies  
PCI Subsystem Vendor ID (SSVID)  
Serial Number (SN)  
Contains the serial number for the  
NVM subsystem  
23-4  
Contains the serial number for the  
NVM subsystem that is assigned by Model Number (MN)  
the vendor as an ASCII string  
63-24  
Contains the currently active  
firmware revision for the NVM  
subsystem  
71-64  
72  
V
F
F
varies  
0h  
Firmware Revision (FR)  
Recommended Arbitration Burst  
size equals 1  
Recommended Arbitration Burst (RAB)  
IEEE OUI Identifier (IEEE)  
Contains the Organization Unique  
Identifier (OUI) for the controller  
vendor  
75-73  
5CD2E4h  
No of multiple PCI Express  
interfaces connected to the host,  
bit 0 determines multiple interface  
76  
X
F
0h  
Multi-Interface Capabilities (MIC)  
77  
05h  
Supports MDTS of 128K  
Maximum Data Transfer Size (MDTS)  
Reserved  
255:78  
Supports Security Send/Receive,  
Format NVM and Firmware  
Activate/Download  
Optional Admin Command Support  
(OACS)  
257-256  
258  
F
F
F
06h  
03h  
03h  
Supports up to 3 concurrently  
outstanding abort commands  
Abort Command Limit (ACL)  
Supports up to 3 concurrently  
outstanding asynchronous event  
requests  
Asynchronous Event Request Limit  
(AERL)  
259  
Single slot  
Read/write capable  
260  
261  
X
X
02h  
0h  
Firmware Updates (FRMW)  
Log Page Attributes (LPA)  
Error Log Page Entries (ELPE)  
SMART/Health Log Support per  
drive not per namespace  
Number of Error Information log  
entries equals 64  
262  
263  
264  
F
F
F
3Fh  
0h  
Number of NVM Express power  
states equal 1  
Number of Power States Support (NPSS)  
Admin Vendor Specific Command  
Configuration settings for Admin  
Vendor Specific command handling Configuration (AVSCC)  
0h  
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F = Fixed  
Default  
Bytes  
V = Variable  
X = Both  
Interpretation  
Description  
Value  
511-265  
512  
Reserved  
Required and max submission  
queue entry size is 64 Byte  
F
F
66h  
Submission Queue Entry Size (SQES)  
Completion Queue Entry Size (CQES)  
Required and max submission  
queue entry size is 16 Byte  
513  
44h  
515-514  
519-516  
Reserved  
F
F
F
01h  
06h  
0h  
Supports single namespace  
Number of Namespaces (NN)  
Supports Dataset Management and  
Write Uncorrectable optional NVMe  
commands.  
Optional NVMe Command Support  
(ONCS)  
521-520  
523-522  
Fused commands not supported  
Fused Operation Support (FUSES)  
Supports Crypto Erase and format  
of entire drive, not per namespace  
524  
F
F
F
07h  
0h  
Format NVM Attributes (FNA):  
Volatile Write Cache (VWC)  
525  
Volatile write cache is not present  
Atomic write size for controller  
during normal equals to 512B  
527-526  
0h  
Atomic Write Unit Normal (AWUN)  
Indicates the atomic write size for  
the controller during a power fail  
condition equals 512B  
529-528  
530  
F
0h  
0h  
Atomic Write Unit Power Fail (AWUPF)  
NVM Vendor Specific Command  
Configuration (NVSCC)  
X
Not Supported  
703-531  
Reserved  
Reserved  
2047-704  
Indicates the characteristics of  
power state 0  
2079-2048  
2111-2080  
2143-2112  
2175-2144  
2207-2176  
2239-2208  
2271-2240  
2303-2272  
2335-2304  
V
V
V
V
V
V
V
V
V
Power State 0 Descriptor (PSD0)  
Power State 1 Descriptor (PSD1)  
Power State 2 Descriptor (PSD2)  
Power State 3 Descriptor (PSD3)  
Power State 4 Descriptor (PSD4)  
Power State 5 Descriptor (PSD5)  
Power State 6 Descriptor (PSD6)  
Power State 7 Descriptor (PSD7)  
Power State 8 Descriptor (PSD8)  
Indicates the characteristics of  
power state 1  
Indicates the characteristics of  
power state 2  
Indicates the characteristics of  
power state 3  
Indicates the characteristics of  
power state 4  
Indicates the characteristics of  
power state 5  
Indicates the characteristics of  
power state 6  
Indicates the characteristics of  
power state 7  
Indicates the characteristics of  
power state 8  
Indicates the characteristics of  
power state 9  
2367-2336  
2399-2368  
2431-2400  
V
V
V
Power State 9 Descriptor (PSD9)  
Power State 10 Descriptor (PSD10)  
Power State 11 Descriptor (PSD11)  
Indicates the characteristics of  
power state 10  
Indicates the characteristics of  
power state 11  
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F = Fixed  
V = Variable  
X = Both  
Default  
Value  
Bytes  
Interpretation  
Description  
Indicates the characteristics of  
power state 12  
2463-2432  
V
Power State 12 Descriptor (PSD12)  
Indicates the characteristics of  
power state 13  
2495-2464  
2527-2496  
2559-2528  
2591-2560  
2623-2592  
2655-2624  
2687-2656  
2719-2688  
2751-2720  
2783-2752  
V
V
V
V
V
V
V
V
V
V
Power State 13 Descriptor (PSD13)  
Power State 14 Descriptor (PSD14)  
Power State 15 Descriptor (PSD15)  
Power State 16 Descriptor (PSD16)  
Power State 17 Descriptor (PSD17)  
Power State 18 Descriptor (PSD18)  
Power State 19 Descriptor (PSD19)  
Power State 20 Descriptor (PSD20)  
Power State 21 Descriptor (PSD21)  
Power State 22 Descriptor (PSD22)  
Indicates the characteristics of  
power state 14  
Indicates the characteristics of  
power state 15  
Indicates the characteristics of  
power state 16  
Indicates the characteristics of  
power state 17  
Indicates the characteristics of  
power state 18  
Indicates the characteristics of  
power state 19  
Indicates the characteristics of  
power state 20  
Indicates the characteristics of  
power state 21  
Indicates the characteristics of  
power state 22  
Indicates the characteristics of  
power state 23  
2815-2784  
2847-2816  
2879-2848  
2911-2880  
2943-2912  
2975-2944  
3007-2976  
3039-3008  
3071-3040  
V
V
V
V
V
V
V
V
V
Power State 23 Descriptor (PSD23)  
Power State 24 Descriptor (PSD24)  
Power State 25 Descriptor (PSD25)  
Power State 26 Descriptor (PSD26)  
Power State 27 Descriptor (PSD27)  
Power State 28 Descriptor (PSD28)  
Power State 29 Descriptor (PSD29)  
Power State 30 Descriptor (PSD30)  
Power State 31 Descriptor (PSD31)  
Indicates the characteristics of  
power state 24  
Indicates the characteristics of  
power state 25  
Indicates the characteristics of  
power state 26  
Indicates the characteristics of  
power state 27  
Indicates the characteristics of  
power state 28  
Indicates the characteristics of  
power state 29  
Indicates the characteristics of  
power state 30  
Indicates the characteristics of  
power state 31  
Data striped at 128 KB, value  
shown is reported as 2^  
(CAP.MPSMIN)  
3075  
F
V
V
05h  
Internal stripe size  
Health indicator  
3095-3076  
3096  
Varies  
Varies  
Shows healthy status or error code  
Reads current negotiated PCIe link  
speed, as reported by PXLS register Current PCIe Link Speed field (CLS)  
(PXCAP + 12h), bits[3:0]  
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F = Fixed  
Default  
Bytes  
V = Variable  
X = Both  
Interpretation  
Description  
Value  
Reads current negotiated PCIe Link  
Width as reported by PXLS register Negotiated Link Width (NLW)  
(PXCAP + 12h), bits[9:4]  
3097  
V
Varies  
3107-3100  
3109-3108  
V
F
Varies  
Bootloader Version  
Bootloader Version reported by the drive  
0x8086  
Company Vendor Identifier  
Vendor identifier assigned by PCI-SIG  
(Intel)  
3111-3110  
4095-3112  
0x0953  
NA  
Device Identifier  
Device identifier assigned by PCI-SIG  
(Intel)  
F
Range of bytes is allocated for  
vendor specific usage  
Vendor Specific (VS)  
V
NOTES:  
F = Fixed. The content of the word is fixed and does not change. For removable media devices, these values may change  
when media is removed or changed.  
V = Variable. The state of at least one bit in a word is variable and may change depending on the state of the device or the  
commands executed by the device.  
X = F or V. The content of the word may be fixed or variable.  
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Table 32: Power State Descriptor  
F = Fixed  
Default  
Bytes  
V = Variable  
X = Both  
Interpretation  
Description  
Value  
255-125  
124-120  
119-117  
Reserved  
Indicates the relative write latency  
associated with this power state  
F
F
F
0h  
Relative Write Latency (RWL)  
Reserved  
Indicates the relative write  
throughput associated with this  
power state  
116-112  
0h  
0h  
Relative Write Throughput (RWT)  
111-109  
108-104  
103-101  
Reserved  
Indicates the relative read latency  
associated with this power state  
Relative Read Latency (RRL)  
Reserved  
Indicates the relative read  
throughput associated with this  
power state.  
100-96  
95-64  
F
F
0h  
0h  
Relative Read Throughput (RRT)  
Exit Latency (EXLAT)  
Indicates the maximum exit latency  
in microseconds associated with  
exiting this power state.  
Indicates the maximum entry  
latency in microseconds  
associated with entering this power  
state  
63-32  
31-16  
F
F
0h  
Entry Latency (ENLAT)  
Reserved  
Indicates the maximum power  
consumed by the NVM subsystem  
in this power state. The power in  
Watts is equal to the value in this  
field multiplied by 0.01  
15-00  
09C4h  
Maximum Power (MP)  
NOTES:  
F = Fixed. The content of the word is fixed and does not change. For removable media devices, these values may change when  
media is removed or changed.  
V = Variable. The state of at least one bit in a word is variable and may change depending on the state of the device or the  
commands executed by the device.  
X = F or V. The content of the word may be fixed or variable.  
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Table 33: Identify Namespace  
F = Fixed  
Default  
Bytes  
V = Variable  
X = Both  
Interpretation  
Description  
Value  
Indicates the total size of the  
namespace in logical blocks.  
7-0  
V
V
varies  
Namespace Size (NSZE)  
Indicates the maximum number  
of logical blocks that may be  
allocated in the namespace at any  
point in time  
15-8  
varies  
Namespace Capacity (NCAP)  
Indicates the current number of  
logical blocks allocated in the  
namespace  
23-16  
24  
V
F
varies  
00h  
Namespace Utilization (NUSE)  
Namespace Features (NSFEAT)  
Indicates thin provisioning is not  
supported  
Defines the number of supported  
LBA size and metadata size  
combinations supported by the  
namespace  
25  
26  
27  
28  
F
V
F
06h  
00h  
03h  
Number of LBA Formats (NLBAF)  
Formatted LBA Size (FLBAS)  
Metadata Capabilities (MC)  
Indicates metadata transferred  
with the extended data LBA or in  
separate buffer  
Indicates support for metadata  
transferred with the extended  
data LBA and in separate buffer –  
both are supported  
Indicates PI supports Type 1,2,3  
with PI transferred as the first 8  
bytes  
End-to-end Data Protection Capabilities  
(DPC)  
V
X
11h  
00h  
Indicates type settings for the  
namespace  
End-to-end Data Protection Type Settings  
(DPS)  
29  
127-30  
Reserved  
MS:0,  
LBADS:9,  
RP:2  
Indicates the LBA format 0 that is  
supported by the controller  
131-128  
V
LBA Format 0 Support (LBAF0)  
MS:8,  
Indicates the LBA format 1 that is  
supported by the controller  
LBADS:9,  
RP:2  
135-132  
139-136  
143-140  
147-144  
V
V
V
V
V
LBA Format 1 Support (LBAF1)  
LBA Format 2 Support (LBAF2)  
LBA Format 3 Support (LBAF3)  
LBA Format 4 Support (LBAF4)  
LBA Format 5 Support (LBAF5)  
MS:16,  
LBADS:9,  
RP:2  
Indicates the LBA format 2 that is  
supported by the controller  
MS:0,  
LBADS:12,  
RP:0  
Indicates the LBA format 3 that is  
supported by the controller  
MS:8,  
LBADS:12,  
RP:0  
Indicates the LBA format 4 that is  
supported by the controller  
MS:64,  
LBADS:12,  
RP:0  
Indicates the LBA format 5 that is  
supported by the controller  
151-148  
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F = Fixed  
V = Variable  
X = Both  
Default  
Value  
Bytes  
Interpretation  
Description  
MS:128,  
LBADS:12,  
RP:0  
Indicates the LBA format 6 that is  
supported by the controller  
155-152  
V
LBA Format 6 Support (LBAF6)  
Not  
Indicates the LBA format 7 that is  
supported by the controller  
159-156  
163-160  
167-164  
171-168  
175-172  
179-176  
183-180  
187-184  
191-188  
383-192  
LBA Format 7 Support (LBAF7)  
LBA Format 8 Support (LBAF8)  
LBA Format 9 Support (LBAF9)  
LBA Format 10 Support (LBAF10)  
LBA Format 11 Support (LBAF11)  
LBA Format 12 Support (LBAF12)  
LBA Format 13 Support (LBAF13)  
LBA Format 14 Support (LBAF14)  
LBA Format 15 Support (LBAF15)  
Reserved  
supported  
Not  
supported  
Indicates the LBA format 8 that is  
supported by the controller  
Not  
supported  
Indicates the LBA format 9 that is  
supported by the controller  
Not  
supported  
Indicates the LBA format 10 that  
is supported by the controller  
Not  
supported  
Indicates the LBA format 11 that  
is supported by the controller  
Not  
supported  
Indicates the LBA format 12 that  
is supported by the controller  
Not  
supported  
Indicates the LBA format 13 that  
is supported by the controller  
Not  
supported  
Indicates the LBA format 14 that  
is supported by the controller  
Not  
supported  
Indicates the LBA format 15 that  
is supported by the controller  
Not  
supported  
Not  
supported  
Range of bytes is allocated for  
vendor specific usage  
4095-384  
Vendor Specific (VS)  
NOTES:  
F = Fixed. The content of the word is fixed and does not change. For removable media devices, these values may change when  
media is removed or changed.  
V = Variable. The state of at least one bit in a word is variable and may change depending on the state of the device or the  
commands executed by the device.  
X = F or V. The content of the word may be fixed or variable  
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Table 34: LBA Format Data Structure  
F = Fixed  
V = Variable  
X = Both  
Bytes  
Default Value  
Interpretation  
Description  
31-26  
25-24  
Reserved  
Relative Performance ranging  
Relative Performance (RP)  
V
V
Varies (2,0)  
from “best” to “degraded”  
Indicates the LBA data size  
supported. The value is reported  
in terms of a power of two (2^n)  
LBA Data Size (LBADS)  
Varies  
(9 and 12)  
23-16  
Indicates the number of metadata Metadata Size (MS)  
bytes provided per LBA based on  
the LBA Data Size indicated.  
Varies  
(0, 8, 16,64, 128)  
15-00  
V
NOTES:  
F = Fixed. The content of the word is fixed and does not change. For removable media devices, these values may change when  
media is removed or changed.  
V = Variable. The state of at least one bit in a word is variable and may change depending on the state of the device or the  
commands executed by the device.  
X = F or V. The content of the word may be fixed or variable.  
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Appendix B Vital Data Structure  
Table 35: Vital Product Data Structure (VPD)  
Programming  
Value  
Address  
# Bytes  
Function  
Byte  
Description  
02h  
08h  
01h  
86h  
80h  
0
1
2
3
4
0
3
Class Code  
Device type and Programming Interface  
3
5
2
PCI-SIG Vendor ID  
Serial Number  
ID  
20  
Varies  
5-24  
25  
65  
66  
67  
68  
40  
1
Varies  
03h  
25-64  
65  
Model Number  
Maximum Link Speed  
Maximum Link Width  
Maximum Link Speed  
Maximum Link Width  
PCIe Port0  
Capabilities  
1
04h  
66  
1
03h  
67  
PCIe Port1  
Capabilities  
1
04h  
68  
Initial Power  
12V Power rail initial power requirement  
(W)  
69  
70  
1
2
0Ah  
00h  
69  
Requirements  
Reserved  
70-71  
Maximum  
Power  
Requirements  
12V Power rail maximum power  
requirement (W)  
72  
1
19h  
72  
73  
75  
2
2
Reserved  
00h  
50h  
73-74  
75  
Capability List  
Pointer  
16b address pointer to start of  
capability list  
Table 36: Capability List Pointer (Out of Band Temperature Sensor)  
Addr  
(Hex)  
00  
01  
02  
03  
04  
05  
06  
07  
08  
09  
A
B
50  
A2  
00  
00  
00  
00  
36  
00  
00  
varies  
varies  
varies  
Over  
varies  
Description Capability ID  
(temp)  
Next Capability  
(none)  
Sensor SMBUS  
Type  
Reserved  
Warning  
Threshold  
address  
Temperature  
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Appendix C Out of Band Temperature Sensor  
Read Out  
Register 0x05 on address 0x1B contains the temperature information for the latest readout. Measured temperature  
is captured by bit 12 to bit 0. Data format is two’s complement. Bit12 represents sign value, bit11 presents 128° C  
and bit0 represents 0.0625° C. Following table gives an example of the read out.  
Table 37: Register 0x05 read out format  
Binary  
Hex  
Temperature  
1 1100 1001 0000  
1 1100 1110 0000  
1 1110 0111 0000  
1 1111 1111 1111  
0 0000 0000 0000  
0 0000 0000 0001  
0 0001 1001 0000  
0 0011 0010 0000  
0 0111 1101 0000  
1C90  
1CE0  
1E70  
1FFFF  
000  
-55° C  
-50° C  
-25° C  
-0.0625° C  
0° C  
001  
0.0625° C  
25° C  
190  
320  
50° C  
7D0  
55° C  
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Appendix D SMBUS Command Response on  
0x6A (NVMe Workgroup Defined)  
Table 38: Command Response on 0x6A (NVMe Workgroup Defined)  
Command  
Code  
Offset  
(byte)  
Description  
Length of Status: Indicates number of additional bytes to read before encountering PEC.  
This value should always be 6 (06h) in implementations of this version of the spec.  
00  
Status Flags (SFLGS): This field indicates the status of the NVM subsystem.  
SMBus Arbitration – Bit 7 is set ‘1’ after a SMBus block read is completed all the way  
to the stop bit without bus contention and cleared to ‘0’ if a SMBus Send Byte FFh is  
received on this SMBus slave address.  
Drive Not Ready – Bit 6 is set to ‘1’ when the subsystem cannot process NVMe  
management commands, and the rest of the transmission may be invalid. If cleared  
to ‘0’, then the NVM subsystem is fully powered and ready to respond to management  
commands. This logic level intentionally identifies and prioritizes powered up and ready  
drives over their powered off neighbors on the same SMBus segment.  
Drive Functional – Bit 5 is set to ‘1’ to indicate an NVM subsystem is functional. If  
cleared to ‘0’, then there is an unrecoverable failure in the NVM subsystem and the  
rest of the transmission may be invalid.  
01  
Reset Not Required - Bit 4 is set to ‘1’ to indicate the NVM subsystem does not need  
a reset to resume normal operation. If cleared to ‘0’ then the NVM subsystem has  
experienced an error that prevents continued normal operation. A controller reset  
is required to resume normal operation.  
Port 0 PCIe Link Active - Bit 3 is set to ‘1’ to indicate the first port’s PCIe link is up  
(i.e., the Data Link Control and Management State Machine is in the DL_Active state).  
If cleared to ‘0’, then the PCIe link is down.  
0
Port 1 PCIe Link Active - Bit 2 is set to ‘1’ to indicate the second port’s PCIe link is up.  
If cleared to ‘0’, then the second port’s PCIe link is down or not present.  
Bits 1-0 shall be set to ‘1’.  
SMART Warnings: This field shall contain the Critical Warning field (byte 0) of the NVMe  
SMART / Health Information log. Each bit in this field shall be inverted from the NVMe  
definition (i.e., the management interface shall indicate a ‘0’ value while the  
corresponding bit is ‘1’ in the log page). Refer to the NVMe specification for bit  
definitions.  
If there are multiple controllers in the NVM subsystem, the management endpoint shall  
combine the Critical Warning field from every controller such that a bit in this field is:  
02  
03  
Cleared to ‘0’ if any controller in the subsystem indicates a critical warning for that  
corresponding bit.  
Set to ‘1’ if all controllers in the NVM subsystem do not indicate a critical warning for the  
corresponding bit.  
Composite Temperature (CTemp): This field indicates the current temperature in  
degrees Celsius. If a temperature value is reported, it should be the same temperature as  
the Composite Temperature from the SMART log of hottest controller in the NVM  
subsystem. The reported temperature range is vendor specific, and shall not exceed the  
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Command  
Code  
Offset  
(byte)  
Description  
range -60 to +127°C. The 8 bit format of the data is shown below.  
This field should not report a temperature when that is older than 5 seconds. If recent  
data is not available, the NVMe management endpoint should indicate a value of 80h for  
this field.  
Value  
00h-7Eh  
7Fh  
Description  
Temperature is measured in degrees Celsius (0° to 126° C)  
127° C or higher  
80h  
No temperature data or temperature data is more than  
5 seconds old.  
81h  
Temperature sensor failure  
Reserved  
82h-C3h  
C4  
Temperature is -60° C or lower  
C5-FFh  
Temperature measured in degrees Celsius is represented in  
twos complement (-1° to -59° C)  
Percentage Drive Life Used (PDLU): Contains a vendor specific estimate of the  
percentage of NVM subsystem NVM life used based on the actual usage and the  
manufacturer’s prediction of NVM life. If an NVM subsystem has multiple controllers the  
highest value is returned. A value of 100 indicates that the estimated endurance of the  
NVM in the NVM subsystem has been consumed, but may not indicate an NVM  
subsystem failure. The value is allowed to exceed 100. Percentages greater than 254  
shall be represented as 255. This value should be updated once per power-on hour and  
equal the Percentage Used value in the NVMe SMART Health Log Page.  
04  
06:05  
07  
Reserved: Shall be set to 0000h  
PEC: An 8 bit CRC calculated over the slave address, command code, second slave  
address and returned data. Algorithm is in SMBus Specifications.  
Length of identification: Indicates number of additional bytes to read before  
encountering PEC. This value should always be 22 (16h) in implementations of this  
version of the spec.  
08  
Vendor ID: The 2 byte vendor ID, assigned by the PCI SIG. Should match VID in the  
Identify Controller command response. MSB is transmitted first.  
10:09  
30:11  
31  
8
Serial Number: 20 characters that match the serial number in the NVMe Identify  
Controller command response. First character is transmitted first  
PEC: An 8 bit CRC calculated over the slave address, command code, second slave  
address and returned data. Algorithm is in SMBus Specifications.  
Vendor Specific This data structure shall not exceed the maximum read length of 255  
specified in the SMBus version 3 specification. Preferably length is not greater than 32 for  
compatibility with SMBus 2.0, additional blocks shall be on 8 byte boundaries.  
255:32  
32+  
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Appendix E SMBUS Command Response on  
0x6A (Intel Specific)  
Table 39: Command Response on 0x6A (Intel Specific)  
Command  
Code  
Offset  
(byte)  
Description  
32  
33  
Length of Intel Corporation’s Block: shall be 22 until this spec is updated  
Reserved: Currently cleared to zero. Anticipated future use will be several bits for  
version number, a bit if there are additional Intel blocks, and some other less thought  
out ideas at this point  
34  
Reserved: Value = 0xff  
35  
Reserved: Value = 0x80  
32  
38:36  
46:39  
54:47  
Reserved: Value = 0x000000  
Firmware Version: 8 characters, ASCII representation  
Bootloader Version: 8 characters, ASCII representation  
PEC: An 8 bit CRC calculated over the slave address, command code, second slave  
address and returned data. Algorithm is in SMBus Specifications.  
55  
255:56  
56+  
Reserved: all bytes cleared to zero, no PEC  
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Appendix F PCIe* ID  
Table 40: PCIe ID  
Identify  
Controller  
Location  
Add-in  
Card  
PCIe Register  
Location  
Vital Product Data  
Location  
ID name  
Description  
2.5” FF  
PCI Header  
Offset 00h  
(bits 15:00)  
Vendor ID assigned  
by PCI-SIG  
Vendor ID (VID)  
Device ID (DID)  
0x8086 0x8086  
0x0953 0x0953  
0x8086 0x8086  
0x3702 0x3703  
§
Bytes 01:00h Address 3, (size 2B)  
PCI Header  
Offset 00h  
(bits 31:16)  
Device ID assigned  
by vendor  
NA  
Bytes 03:02h  
NA  
NA  
NA  
NA  
PCI Header  
Offset 2Ch  
(bits 15:00)  
Subsystem  
Vendor ID  
Indicates Sub-  
system vendor ID  
PCI Header  
Offset 2Ch  
(bits 31:16)  
Sub-system  
identifier  
Subsystem ID  
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Appendix G SCSI Command Translation  
Following SCSI commands are supported:  
Read 6,10,12,16  
Inquiry  
Mode Sense 6,10  
Mode Select 6.10  
Log Sense  
Read Capacity 10,16  
Report LUNs  
Request Sense  
Start Stop Unit  
Test Unit Ready  
Write Buffer  
Unmap  
Note:  
Refer to NVM Express*: SCSI translation reference doc under nvmexpress.org.  
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Appendix H Add-in Card LED Decoder  
Table 41: LED Functionality  
LED  
Description  
Blink Behavior  
Blinks at the rate of  
250msec high, 250msec  
low with IO activity  
LED 1 ( Amber)  
Shows IO activity  
Solid red if drive is in  
disabled logical mode  
LED 2 (Red)  
Drive fail indicator  
Solid yellow if any of the  
critical warnings in log  
page 0x02 is triggered  
LED 3 (Yellow)  
Drive pre-fail indicator  
Drive health indicator  
Solid green when drive is  
healthy  
LED 4 (Green)  
Figure A-1: LED Location  
Note: 2.5-inch Form factor does not contain LEDs  
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