HP Hewlett Packard Server 633407 001 User Manual

HP ProLiant DL380 G7 Server  
Maintenance and Service Guide  
Abstract  
This guide describes identification and maintenance procedures, diagnostic tools, specifications and requirements for hardware components and  
software. This guide is for an experienced service technician. HP assumes you are qualified in the servicing of computer equipment, trained in  
recognizing hazards in products, and are familiar with weight and stability precautions.  
Part Number: 594659-006  
December 2012  
Edition: 6  
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Contents  
Contents  
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Contents  
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Customer self repair  
HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for  
greater flexibility in performing defective parts replacement. If during the diagnosis period HP (or HP service  
providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will  
ship that part directly to you for replacement. There are two categories of CSR parts:  
Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts,  
you will be charged for the travel and labor costs of this service.  
Optional—Parts for which customer self repair is optional. These parts are also designed for customer  
self repair. If, however, you require that HP replace them for you, there may or may not be additional  
charges, depending on the type of warranty service designated for your product.  
NOTE: Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty,  
HP requires that an authorized service provider replace the part. These parts are identified as "No" in the  
Illustrated Parts Catalog.  
Based on availability and where geography permits, CSR parts will be shipped for next business day  
delivery. Same day or four-hour delivery may be offered at an additional charge where geography permits.  
If assistance is required, you can call the HP Technical Support Center and a technician will help you over the  
telephone. HP specifies in the materials shipped with a replacement CSR part whether a defective part must  
be returned to HP. In cases where it is required to return the defective part to HP, you must ship the defective  
part back to HP within a defined period of time, normally five (5) business days. The defective part must be  
returned with the associated documentation in the provided shipping material. Failure to return the defective  
part may result in HP billing you for the replacement. With a customer self repair, HP will pay all shipping  
and part return costs and determine the courier/carrier to be used.  
For more information about HP's Customer Self Repair program, contact your local service provider. For the  
North American program, refer to the HP website (http://www.hp.com/go/selfrepair).  
Parts only warranty service  
Your HP Limited Warranty may include a parts only warranty service. Under the terms of parts only warranty  
service, HP will provide replacement parts free of charge.  
For parts only warranty service, CSR part replacement is mandatory. If you request HP to replace these parts,  
you will be charged for the travel and labor costs of this service.  
Réparation par le client (CSR)  
Les produits HP comportent de nombreuses pièces CSR (Customer Self Repair = réparation par le client) afin  
de minimiser les délais de réparation et faciliter le remplacement des pièces défectueuses. Si pendant la  
période de diagnostic, HP (ou ses partenaires ou mainteneurs agréés) détermine que la réparation peut être  
effectuée à l'aide d'une pièce CSR, HP vous l'envoie directement. Il existe deux catégories de pièces CSR:  
Customer self repair  
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Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de  
remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.  
Facultatif - Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également  
conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de  
remplacer ces pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à  
votre produit.  
REMARQUE: Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la  
réparation. Pour que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit effectué  
par un Mainteneur Agréé. Ces pièces sont identifiées par la mention "Non" dans le Catalogue illustré.  
Les pièces CSR sont livrées le jour ouvré suivant, dans la limite des stocks disponibles et selon votre situation  
géographique. Si votre situation géographique le permet et que vous demandez une livraison le jour même  
ou dans les 4 heures, celle-ci vous sera facturée. Pour bénéficier d'une assistance téléphonique, appelez le  
Centre d'assistance technique HP. Dans les documents envoyés avec la pièce de rechange CSR, HP précise  
s'il est nécessaire de lui retourner la pièce défectueuse. Si c'est le cas, vous devez le faire dans le délai  
indiqué, généralement cinq (5) jours ouvrés. La pièce et sa documentation doivent être retournées dans  
l'emballage fourni. Si vous ne retournez pas la pièce défectueuse, HP se réserve le droit de vous facturer les  
coûts de remplacement. Dans le cas d'une pièce CSR, HP supporte l'ensemble des frais d'expédition et de  
retour, et détermine la société de courses ou le transporteur à utiliser.  
Pour plus d'informations sur le programme CSR de HP, contactez votre Mainteneur Agrée local. Pour plus  
d'informations sur ce programme en Amérique du Nord, consultez le site Web HP  
Service de garantie "pièces seules"  
Votre garantie limitée HP peut inclure un service de garantie "pièces seules". Dans ce cas, les pièces de  
rechange fournies par HP ne sont pas facturées.  
Dans le cadre de ce service, la réparation des pièces CSR par le client est obligatoire. Si vous demandez à  
HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.  
Riparazione da parte del cliente  
Per abbreviare i tempi di riparazione e garantire una maggiore flessibilità nella sostituzione di parti  
difettose, i prodotti HP sono realizzati con numerosi componenti che possono essere riparati direttamente  
dal cliente (CSR, Customer Self Repair). Se in fase di diagnostica HP (o un centro di servizi o di assistenza  
HP) identifica il guasto come riparabile mediante un ricambio CSR, HP lo spedirà direttamente al cliente per  
la sostituzione. Vi sono due categorie di parti CSR:  
Obbligatorie – Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la  
riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio.  
Opzionali – Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti  
progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere  
spese addizionali a seconda del tipo di garanzia previsto per il prodotto.  
NOTA: alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la  
garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono  
identificate da un "No" nel Catalogo illustrato dei componenti.  
Customer self repair  
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In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il  
giorno lavorativo seguente. La consegna nel giorno stesso o entro quattro ore è offerta con un supplemento  
di costo solo in alcune zone. In caso di necessità si può richiedere l'assistenza telefonica di un addetto del  
centro di supporto tecnico HP. Nel materiale fornito con una parte di ricambio CSR, HP specifica se il cliente  
deve restituire dei componenti. Qualora sia richiesta la resa ad HP del componente difettoso, lo si deve  
spedire ad HP entro un determinato periodo di tempo, generalmente cinque (5) giorni lavorativi. Il  
componente difettoso deve essere restituito con la documentazione associata nell'imballo di spedizione  
fornito. La mancata restituzione del componente può comportare la fatturazione del ricambio da parte di HP.  
Nel caso di riparazione da parte del cliente, HP sostiene tutte le spese di spedizione e resa e sceglie il  
corriere/vettore da utilizzare.  
Per ulteriori informazioni sul programma CSR di HP contattare il centro di assistenza di zona. Per il  
programma in Nord America fare riferimento al sito Web HP (http://www.hp.com/go/selfrepair).  
Servizio di garanzia per i soli componenti  
La garanzia limitata HP può includere un servizio di garanzia per i soli componenti. Nei termini di garanzia  
del servizio per i soli componenti, HP fornirà gratuitamente le parti di ricambio.  
Per il servizio di garanzia per i soli componenti è obbligatoria la formula CSR che prevede la riparazione da  
parte del cliente. Se il cliente invece richiede la sostituzione ad HP, dovrà sostenere le spese di spedizione  
e di manodopera per il servizio.  
Customer Self Repair  
HP Produkte enthalten viele CSR-Teile (Customer Self Repair), um Reparaturzeiten zu minimieren und höhere  
Flexibilität beim Austausch defekter Bauteile zu ermöglichen. Wenn HP (oder ein HP Servicepartner) bei der  
Diagnose feststellt, dass das Produkt mithilfe eines CSR-Teils repariert werden kann, sendet Ihnen HP dieses  
Bauteil zum Austausch direkt zu. CSR-Teile werden in zwei Kategorien unterteilt:  
Zwingend – Teile, für die das Customer Self Repair-Verfahren zwingend vorgegeben ist. Wenn Sie den  
Austausch dieser Teile von HP vornehmen lassen, werden Ihnen die Anfahrt- und Arbeitskosten für diesen  
Service berechnet.  
Optional – Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für Customer  
Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten,  
können bei diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche  
Kosten anfallen.  
HINWEIS: Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des  
Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog  
sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet.  
CSR-Teile werden abhängig von der Verfügbarkeit und vom Lieferziel am folgenden Geschäftstag geliefert.  
Für bestimmte Standorte ist eine Lieferung am selben Tag oder innerhalb von vier Stunden gegen einen  
Aufpreis verfügbar. Wenn Sie Hilfe benötigen, können Sie das HP technische Support Center anrufen und  
sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien, die mit einem CSR-Ersatzteil geliefert  
werden, können Sie entnehmen, ob das defekte Teil an HP zurückgeschickt werden muss. Wenn es  
erforderlich ist, das defekte Teil an HP zurückzuschicken, müssen Sie dies innerhalb eines vorgegebenen  
Zeitraums tun, in der Regel innerhalb von fünf (5) Geschäftstagen. Das defekte Teil muss mit der zugehörigen  
Dokumentation in der Verpackung zurückgeschickt werden, die im Lieferumfang enthalten ist. Wenn Sie das  
Customer self repair  
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defekte Teil nicht zurückschicken, kann HP Ihnen das Ersatzteil in Rechnung stellen. Im Falle von Customer  
Self Repair kommt HP für alle Kosten für die Lieferung und Rücksendung auf und bestimmt den  
Kurier-/Frachtdienst.  
Weitere Informationen über das HP Customer Self Repair Programm erhalten Sie von Ihrem Servicepartner  
vor Ort. Informationen über das CSR-Programm in Nordamerika finden Sie auf der HP Website unter  
Parts-only Warranty Service (Garantieservice  
ausschließlich für Teile)  
Ihre HP Garantie umfasst möglicherweise einen Parts-only Warranty Service (Garantieservice ausschließlich  
für Teile). Gemäß den Bestimmungen des Parts-only Warranty Service stellt HP Ersatzteile kostenlos zur  
Verfügung.  
Für den Parts-only Warranty Service ist das CSR-Verfahren zwingend vorgegeben. Wenn Sie den Austausch  
dieser Teile von HP vornehmen lassen, werden Ihnen die Anfahrt- und Arbeitskosten für diesen Service  
berechnet.  
Reparaciones del propio cliente  
Los productos de HP incluyen muchos componentes que el propio usuario puede reemplazar (Customer Self  
Repair, CSR) para minimizar el tiempo de reparación y ofrecer una mayor flexibilidad a la hora de realizar  
sustituciones de componentes defectuosos. Si, durante la fase de diagnóstico, HP (o los proveedores o socios  
de servicio de HP) identifica que una reparación puede llevarse a cabo mediante el uso de un componente  
CSR, HP le enviará dicho componente directamente para que realice su sustitución. Los componentes CSR se  
clasifican en dos categorías:  
Obligatorio: componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a  
HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de  
desplazamiento y de mano de obra de dicho servicio.  
Opcional: componentes para los que la reparación por parte del usuario es opcional. Estos  
componentes también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si  
precisa que HP realice su sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de  
servicio de garantía correspondiente al producto.  
NOTA: Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que  
el usuario haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado  
realice la sustitución de estos componentes. Dichos componentes se identifican con la palabra "No" en el  
catálogo ilustrado de componentes.  
Según la disponibilidad y la situación geográfica, los componentes CSR se enviarán para que lleguen a su  
destino al siguiente día laborable. Si la situación geográfica lo permite, se puede solicitar la entrega en el  
mismo día o en cuatro horas con un coste adicional. Si precisa asistencia técnica, puede llamar al Centro de  
asistencia técnica de HP y recibirá ayuda telefónica por parte de un técnico. Con el envío de materiales  
para la sustitución de componentes CSR, HP especificará si los componentes defectuosos deberán  
devolverse a HP. En aquellos casos en los que sea necesario devolver algún componente a HP, deberá  
hacerlo en el periodo de tiempo especificado, normalmente cinco días laborables. Los componentes  
defectuosos deberán devolverse con toda la documentación relacionada y con el embalaje de envío. Si no  
Customer self repair  
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enviara el componente defectuoso requerido, HP podrá cobrarle por el de sustitución. En el caso de todas  
sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de  
componentes y escogerá la empresa de transporte que se utilice para dicho servicio.  
Para obtener más información acerca del programa de Reparaciones del propio cliente de HP, póngase en  
contacto con su proveedor de servicios local. Si está interesado en el programa para Norteamérica, visite  
la página web de HP siguiente (http://www.hp.com/go/selfrepair).  
Servicio de garantía exclusivo de componentes  
La garantía limitada de HP puede que incluya un servicio de garantía exclusivo de componentes. Según las  
condiciones de este servicio exclusivo de componentes, HP le facilitará los componentes de repuesto sin  
cargo adicional alguno.  
Para este servicio de garantía exclusivo de componentes, es obligatoria la sustitución de componentes por  
parte del usuario (CSR). Si solicita a HP que realice la sustitución de estos componentes, tendrá que hacerse  
cargo de los gastos de desplazamiento y de mano de obra de dicho servicio.  
Customer Self Repair  
Veel onderdelen in HP producten zijn door de klant zelf te repareren, waardoor de reparatieduur tot een  
minimum beperkt kan blijven en de flexibiliteit in het vervangen van defecte onderdelen groter is. Deze  
onderdelen worden CSR-onderdelen (Customer Self Repair) genoemd. Als HP (of een HP Service Partner) bij  
de diagnose vaststelt dat de reparatie kan worden uitgevoerd met een CSR-onderdeel, verzendt HP dat  
onderdeel rechtstreeks naar u, zodat u het defecte onderdeel daarmee kunt vervangen. Er zijn twee  
categorieën CSR-onderdelen:  
Verplicht: Onderdelen waarvoor reparatie door de klant verplicht is. Als u HP verzoekt deze onderdelen  
voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon in rekening gebracht.  
Optioneel: Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn ontworpen  
voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen  
daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het  
product.  
OPMERKING: Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met  
de garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen.  
Deze onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".  
Afhankelijk van de leverbaarheid en de locatie worden CSR-onderdelen verzonden voor levering op de  
eerstvolgende werkdag. Levering op dezelfde dag of binnen vier uur kan tegen meerkosten worden  
aangeboden, indien dit mogelijk is gezien de locatie. Indien assistentie gewenst is, belt u een HP Service  
Partner om via de telefoon technische ondersteuning te ontvangen. HP vermeldt in de documentatie bij het  
vervangende CSR-onderdeel of het defecte onderdeel aan HP moet worden geretourneerd. Als het defecte  
onderdeel aan HP moet worden teruggezonden, moet u het defecte onderdeel binnen een bepaalde  
periode, gewoonlijk vijf (5) werkdagen, retourneren aan HP. Het defecte onderdeel moet met de  
bijbehorende documentatie worden geretourneerd in het meegeleverde verpakkingsmateriaal. Als u het  
defecte onderdeel niet terugzendt, kan HP u voor het vervangende onderdeel kosten in rekening brengen. Bij  
reparatie door de klant betaalt HP alle verzendkosten voor het vervangende en geretourneerde onderdeel en  
kiest HP zelf welke koerier/transportonderneming hiervoor wordt gebruikt.  
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Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programma  
van HP. Informatie over Service Partners vindt u op de HP website (http://www.hp.com/go/selfrepair).  
Garantieservice "Parts Only"  
Het is mogelijk dat de HP garantie alleen de garantieservice "Parts Only" omvat. Volgens de bepalingen van  
de Parts Only garantieservice zal HP kosteloos vervangende onderdelen ter beschikking stellen.  
Voor de Parts Only garantieservice is vervanging door CSR-onderdelen verplicht. Als u HP verzoekt deze  
onderdelen voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon in rekening  
gebracht.  
Reparo feito pelo cliente  
Os produtos da HP são projetados com muitas peças para reparo feito pelo cliente (CSR) de modo a  
minimizar o tempo de reparo e permitir maior flexibilidade na substituição de peças com defeito. Se,  
durante o período de diagnóstico, a HP (ou fornecedores/parceiros de serviço da HP) concluir que o reparo  
pode ser efetuado pelo uso de uma peça CSR, a peça de reposição será enviada diretamente ao cliente.  
Existem duas categorias de peças CSR:  
Obrigatória – Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças,  
serão cobradas as despesas de transporte e mão-de-obra do serviço.  
Opcional – Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o  
reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de  
taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.  
OBSERVAÇÃO: Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de  
cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão  
identificadas com a marca "No" (Não), no catálogo de peças ilustrado.  
Conforme a disponibilidade e o local geográfico, as peças CSR serão enviadas no primeiro dia útil após o  
pedido. Onde as condições geográficas permitirem, a entrega no mesmo dia ou em quatro horas pode ser  
feita mediante uma taxa adicional. Se precisar de auxílio, entre em contato com o Centro de suporte técnico  
da HP para que um técnico o ajude por telefone. A HP especifica nos materiais fornecidos com a peça CSR  
de reposição se a peça com defeito deve ser devolvida à HP. Nos casos em que isso for necessário, é  
preciso enviar a peça com defeito à HP dentro do período determinado, normalmente cinco (5) dias úteis.  
A peça com defeito deve ser enviada com a documentação correspondente no material de transporte  
fornecido. Caso não o faça, a HP poderá cobrar a reposição. Para as peças de reparo feito pelo cliente, a  
HP paga todas as despesas de transporte e de devolução da peça e determina a transportadora/serviço  
postal a ser utilizado.  
Para obter mais informações sobre o programa de reparo feito pelo cliente da HP, entre em contato com o  
fornecedor de serviços local. Para o programa norte-americano, visite o site da HP  
Serviço de garantia apenas para peças  
A garantia limitada da HP pode incluir um serviço de garantia apenas para peças. Segundo os termos do  
serviço de garantia apenas para peças, a HP fornece as peças de reposição sem cobrar nenhuma taxa.  
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No caso desse serviço, a substituição de peças CSR é obrigatória. Se desejar que a HP substitua essas  
peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.  
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Illustrated parts catalog  
Mechanical components  
Item Description  
Spare part number  
Customer self repair  
(on page 6)  
Mandatory1  
Access panel  
1
610525-001  
Power supply cage  
2
496063-001  
496067-001  
496076-001  
496074-001  
614778-001  
599039-001  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Fan cage  
3
Optical drive cage  
4
SFF drive cage  
5
PCI riser cage  
6
Air baffle  
7
Bezels  
8
a) Right bezel  
507689-001  
496080-001  
Mandatory1  
b) Left bezel  
Mandatory1  
LFF drive cage*  
Drive blank*  
496075-001  
392613-001  
409417-002  
Mandatory1  
Mandatory1  
Mandatory1  
9
10  
11  
12  
Power supply blank*  
Heatsink*  
a) Processor heatsink kit  
496064-001  
Optional2  
b) Thermal kit (cleaning pad and thermal  
468290-001  
Optional2  
Illustrated parts catalog 16  
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Item Description  
Spare part number  
Customer self repair  
(on page 6)  
grease)  
Hardware kit*  
496058-001  
Mandatory1  
13  
a) Optical device blank  
b) Fan blank  
c) Full-length expansion slot cover  
d) Low-profile expansion slot cover  
e) PCI retainer  
f) PCI top retainer  
g) PCI end retainer  
h) PCI removable retainer  
* Not shown  
1Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be  
charged for the travel and labor costs of this service.  
2Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If,  
however, you require that HP replace them for you, there may or may not be additional charges, depending on the type  
of warranty service designated for your product.  
3No—Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty, HP requires that  
an authorized service provider replace the part. These parts are identified as "No" in the Illustrated Parts Catalog.  
1Mandatory: Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de  
remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.  
2Optional: Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également  
conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de remplacer ces  
pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à votre produit.  
3No: Non—Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la réparation. Pour  
que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit effectué par un Mainteneur Agréé. Ces  
pièces sont identifiées par la mention “Non” dans le Catalogue illustré.  
1Mandatory: Obbligatorie—Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la  
riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio.  
2Optional: Opzionali—Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti  
progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere spese  
addizionali a seconda del tipo di garanzia previsto per il prodotto.  
3No: Non CSR—Alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la  
garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate  
da un “No” nel Catalogo illustrato dei componenti.  
1Mandatory: Zwingend—Teile, die im Rahmen des Customer Self Repair Programms ersetzt werden müssen. Wenn Sie  
diese Teile von HP ersetzen lassen, werden Ihnen die Versand- und Arbeitskosten für diesen Service berechnet.  
2Optional: Optional—Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für Customer  
Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten, können bei  
diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche Kosten anfallen.  
3No: Kein—Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen,  
muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw.  
„Nein“ gekennzeichnet.  
1Mandatory: Obligatorio—componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a HP  
que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de mano  
de obra de dicho servicio.  
Illustrated parts catalog 17  
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2Optional: Opcional— componentes para los que la reparación por parte del usuario es opcional. Estos componentes  
también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si precisa que HP realice su  
sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de servicio de garantía correspondiente al  
producto.  
3No: No—Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que el usuario  
haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado realice la sustitución de estos  
componentes. Dichos componentes se identifican con la palabra “No” en el catálogo ilustrado de componentes.  
1Mandatory: Verplicht—Onderdelen waarvoor Customer Self Repair verplicht is. Als u HP verzoekt deze onderdelen te  
vervangen, komen de reiskosten en het arbeidsloon voor uw rekening.  
2Optional: Optioneel—Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn  
ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen  
daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het product.  
3No: Nee—Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met de  
garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen. Deze  
onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".  
1Mandatory: Obrigatória—Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças,  
serão cobradas as despesas de transporte e mão-de-obra do serviço.  
2Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o  
reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa  
adicional, dependendo do tipo de serviço de garantia destinado ao produto.  
3No: Nenhuma—Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia  
do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão identificadas com a marca “No”  
(Não), no catálogo de peças ilustrado.  
Illustrated parts catalog 18  
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System components  
Item Description  
System components  
Spare part number  
Customer self repair (on  
page 6)  
Hot-plug fan, 60-mm  
14  
496066-001  
Mandatory1  
Mandatory1  
Power supplies, hot-plug  
a) 460-W, AC  
15  
511777-001  
b) 750-W, AC*  
511778-001  
451816-001  
599381-001  
599383-001  
579229-001  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
c) 1200-W, -48VDC*  
d) 450-W HE 94%*  
e) 750-W HE 94%*  
f) 1200-W HE 94%*  
Boards  
System board assembly  
Riser boards  
599038-001  
Optional2  
Optional2  
16  
17  
a) PCI riser board  
496057-001  
b) PCI-X riser board*  
c) PCIe riser board*  
496077-001  
496078-001  
Optional2  
Optional2  
Power supply backplane  
Systems Insight Display subassembly  
HP Trusted Platform Module  
SFF SAS backplane  
496062-001  
496073-001  
505836-001  
507690-001  
496079-001  
462919-001  
462975-001  
Mandatory1  
Optional2  
No3  
Optional2  
Optional2  
Mandatory1  
Mandatory1  
18  
19  
20  
21  
22  
23  
24  
LFF SAS backplane*  
SAS controller board*  
HP Smart Array P410i cache module*  
Memory  
RDIMM*  
25  
Illustrated parts catalog 19  
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Item Description  
Spare part number  
Customer self repair (on  
page 6)  
a) PC3-8500 (DDR3-1066), 4-GB (RoHS) 4R kit 501535-001  
b) PC3-8500 (DDR3-1066), 8-GB (RoHS) 4R kit 519201-001  
c) PC3-8500 (DDR3-1066), 8-GB (RoHS) 2R kit 501537-001  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
d) PC3-10600 (DDR3-1333), 2-GB (RoHS) 2R kit 501533-001  
e) PC3-10600 (DDR3-1333), 4-GB (RoHS) 2R kit 501534-001  
f) PC3-10600R (DDR3-1333), 4-GB (RoHS) 9R kit 595424-001  
g) PC3 10600R (DDR3-1333), 8-GB (RoHS)  
501536-001  
UDIMM*  
26  
27  
a) PC3-10600 (DDR3-1333), 1-GB (RoHS)  
501539-001  
Mandatory1  
b) PC3-10600 (DDR3-1333), 2-GB (RoHS)  
c) PC3-10600E (DDR3-1333), 4-GB (RoHS)  
501540-001  
501541-001  
Mandatory1  
Mandatory1  
LV DIMM* **  
a) PC3L-8500R, 4-GB  
595422-001  
Mandatory1  
b) PC3L-8500R, 8-GB  
c) PC3L-10600R, 4-GB  
d) PC3L-10600R, 8-GB  
595423-001  
606426-001  
606427-001  
Mandatory1  
Mandatory1  
Mandatory1  
Processors* †  
28  
a) 2.13-GHz Intel Xeon processor L5630  
594891-001  
Optional2  
b) 2.13-GHz Intel Xeon processor E5506  
c) 2.26-GHz Intel Xeon processor L5640  
d) 2.40-GHz Intel Xeon processor E5620  
e) 2.53-GHz Intel Xeon processor E5630  
f) 2.66-GHz Intel Xeon processor E5640  
g) 2.66-GHz Intel Xeon processor X5650  
h) 2.80-GHz Intel Xeon processor X5660  
i) 2.93-GHz Intel Xeon processor X5670  
j) 3.33-GHz Intel Xeon processor X5680  
k) 3.46-GHz Intel Xeon processor X5677  
l) 2.00-GHz Intel Xeon processor E5503  
m) 3.60-GHz Intel Xeon processor X5687  
n) 3.46-GHz Intel Xeon processor X5690  
o) 3.06-GHz Intel Xeon processor X5675  
p) 3.20-GHz Intel Xeon processor X5672  
q) 2.53-GHz Intel Xeon processor E5649  
r) 2.40-GHz Intel Xeon processor E5645  
506013-001  
594890-001  
594887-001  
594886-001  
594885-001  
594884-001  
594883-001  
594882-001  
614739-001  
594881-001  
594889-001  
638137-001  
638136-001  
638134-001  
638135-001  
628695-001  
628696-001  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Optional2  
Illustrated parts catalog 20  
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Item Description  
Spare part number  
Customer self repair (on  
page 6)  
Optional2  
Optional2  
s) 2.13-GHz Intel Xeon processor E5606  
628699-001  
628700-001  
t) 1.60-GHz Intel Xeon processor E5603  
Drives  
Hot-plug SFF SAS*  
29  
a) 36-GB, 15,000-rpm, dual-port  
418397-001  
Mandatory1  
b) 72-GB, 10,000-rpm, dual-port  
c) 72-GB, 15,000-rpm, dual-port  
d) 146-GB, 10,000-rpm, dual-port, 6G  
e) 146-GB, 10,000-rpm, dual-port  
f) 146-GB, 15,000-rpm, dual-port  
g) 300-GB, 10,000-rpm, dual-port, 6G  
h) 300-GB, 10,000-rpm, dual-port  
389346-001  
418398-001  
507283-001  
418399-001  
504334-001  
507284-001  
493083-001  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Hot-plug SFF SATA*  
30  
31  
a) 120-GB, 5,400-rpm, 1-year warranty  
459322-001  
Mandatory1  
b) 250-GB, 5,400-rpm, 1-year warranty  
460426-001  
Mandatory1  
Hot-plug LFF SAS*  
a) 72-GB, 15,000-rpm, dual-port  
389343-001  
Mandatory1  
b) 146-GB, 15,000-rpm, dual-port  
c) 300-GB, 15,000-rpm, dual-port, enterprise  
d) 400-GB, 10,000-rpm, dual-port  
e) 450-GB,15,000-rpm, dual-port  
488058-001  
488060-001  
456896-001  
454274-001  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
f) 750-GB, 7200-rpm, dual-port, 1-year warranty 461288-001  
g) 1-TB, 7200-rpm, dual-port, 1-year warranty  
461289-001  
Hot-plug LFF SATA*  
32  
a) 160-GB, 7200-rpm, 1-year warranty  
483095-001  
Mandatory1  
b) 250-GB, 7,200-rpm, 3G  
459318-001  
459319-001  
459320-001  
454273-001  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
c) 500-GB, 7,200-rpm, 1-year warranty  
d) 750-GB, 7,200-rpm, 1-year warranty  
e) 1-TB, 7200-rpm, 1-year warranty  
Optical drives  
Slimline CD-ROM drive*  
399401-001  
397928-001  
399959-001  
399402-001  
Mandatory1  
Mandatory1  
Mandatory1  
Mandatory1  
33  
34  
35  
36  
Slimline 8x/24x DVD-ROM drive*  
Slimline 24x CD-RW/DVD-ROM drive*  
Slimline 8x DVD+R/RW drive*  
Cables  
SAS backplane cable*  
496070-001  
Mandatory1  
37  
Illustrated parts catalog 21  
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Item Description  
Spare part number  
Customer self repair (on  
page 6)  
Mandatory1  
Optical drive data and power cable*  
496071-001  
38  
AC power cord*  
142258-001  
488137-001  
Mandatory1  
Mandatory1  
39  
40  
HP Smart Array P410i cache module battery  
cable*  
Battery cable, 24 in.*  
488138-001  
626597-001  
Mandatory1  
Mandatory1  
41  
42  
SATA to Mini-SAS cable, 24 in.*  
Batteries  
System battery, 3.3-V, lithium*  
153099-001  
Mandatory1  
Optional2  
43  
44  
Smart Array P410i cache module battery pack* 462976-001  
Capacitor pack*  
587324-001  
Optional2  
45  
46  
47  
48  
49  
Rack Mounting Hardware Kit  
a) LFF*  
b) SFF*  
574898-001  
574765-001  
Optional2  
Optional2  
Full-length expansion board shipping bracket*  
618597-001  
496064-001  
505908-001  
Mandatory1  
Heatsink  
Processor heatsink  
Optional2  
Controller option  
FBWC module, with 1-GB cable  
Mandatory1  
*Not shown  
**If LVDIMMs are mixed with standard DDR3 DIMMs on the same server, the LVDIMMs operate at 1.5V. LVDIMMs are  
only supported for use with the Intel® Xeon® 5600 series of processors.  
†All processors in this HP ProLiant server must have the same cache size, speed, number of cores, and rated maximum  
power consumption.  
1Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be  
charged for the travel and labor costs of this service.  
2Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If,  
however, you require that HP replace them for you, there may or may not be additional charges, depending on the type  
of warranty service designated for your product.  
3No—Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty, HP requires that  
an authorized service provider replace the part. These parts are identified as "No" in the Illustrated Parts Catalog.  
1Mandatory: Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de  
remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.  
2Optional: Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également  
conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de remplacer ces  
pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à votre produit.  
3No: Non—Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la réparation. Pour  
que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit effectué par un Mainteneur Agréé. Ces  
pièces sont identifiées par la mention “Non” dans le Catalogue illustré.  
1Mandatory: Obbligatorie—Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la  
riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio.  
2Optional: Opzionali—Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti  
progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere spese  
addizionali a seconda del tipo di garanzia previsto per il prodotto.  
Illustrated parts catalog 22  
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3No: Non CSR—Alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la  
garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate  
da un “No” nel Catalogo illustrato dei componenti.  
1Mandatory: Zwingend—Teile, die im Rahmen des Customer Self Repair Programms ersetzt werden müssen. Wenn Sie  
diese Teile von HP ersetzen lassen, werden Ihnen die Versand- und Arbeitskosten für diesen Service berechnet.  
2Optional: Optional—Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für Customer  
Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten, können bei  
diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche Kosten anfallen.  
3No: Kein—Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen,  
muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw.  
„Nein“ gekennzeichnet.  
1Mandatory: Obligatorio—componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a HP  
que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de mano  
de obra de dicho servicio.  
2Optional: Opcional— componentes para los que la reparación por parte del usuario es opcional. Estos componentes  
también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si precisa que HP realice su  
sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de servicio de garantía correspondiente al  
producto.  
3No: No—Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que el usuario  
haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado realice la sustitución de estos  
componentes. Dichos componentes se identifican con la palabra “No” en el catálogo ilustrado de componentes.  
1Mandatory: Verplicht—Onderdelen waarvoor Customer Self Repair verplicht is. Als u HP verzoekt deze onderdelen te  
vervangen, komen de reiskosten en het arbeidsloon voor uw rekening.  
2Optional: Optioneel—Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn  
ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen  
daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het product.  
3No: Nee—Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met de  
garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen. Deze  
onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".  
1Mandatory: Obrigatória—Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças,  
serão cobradas as despesas de transporte e mão-de-obra do serviço.  
2Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o  
reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa  
adicional, dependendo do tipo de serviço de garantia destinado ao produto.  
3No: Nenhuma—Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia  
do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão identificadas com a marca “No”  
(Não), no catálogo de peças ilustrado.  
Illustrated parts catalog 23  
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Illustrated parts catalog 24  
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Removal and replacement procedures  
Required tools  
You need the following items for some procedures:  
T-10/T-15 Torx screwdriver (included with the server)  
HP Insight Diagnostics software ("HP Insight Diagnostics" on page 82)  
Preparation procedures  
To access some components and perform certain service procedures, you must perform one or more of the  
following procedures:  
Extend the server from the rack (on page 26).  
If you are performing service procedures in an HP, Compaq branded, telco, or third-party rack cabinet,  
you can use the locking feature of the rack rails to support the server and gain access to internal  
components.  
For more information about telco rack solutions, refer to the RackSolutions.com website  
Power down the server (on page 25).  
If you must remove a server from a rack or a non-hot-plug component from a server, power down the  
server.  
Remove the server from the rack (on page 27).  
If the rack environment, cabling configuration, or the server location in the rack creates awkward  
conditions, remove the server from the rack.  
Access the product rear panel (on page 27).  
If you are performing certain service procedures, access the product rear panel.  
Power down the server  
WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment,  
remove the power cord to remove power from the server. The front panel Power On/Standby  
button does not completely shut off system power. Portions of the power supply and some internal  
circuitry remain active until AC power is removed.  
IMPORTANT: If installing a hot-plug device, it is not necessary to power down the server.  
1.  
2.  
Back up the server data.  
Shut down the operating system as directed by the operating system documentation.  
Removal and replacement procedures 25  
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NOTE: If the operating system automatically places the server in Standby mode, omit the next  
step.  
3.  
4.  
Press the Power On/Standby button to place the server in Standby mode. When the server activates  
Standby power mode, the system power LED changes to amber.  
IMPORTANT: Pressing the UID button illuminates the blue UID LEDs on the front and rear panels.  
In a rack environment, this feature facilitates locating a server when moving between the front and  
rear of the rack.  
Disconnect the power cords.  
The system is now without power.  
Extend the server from the rack  
1.  
2.  
Pull down the quick release levers on each side of the server.  
Extend the server from the rack.  
WARNING: To reduce the risk of personal injury or equipment damage, be sure that the rack is  
adequately stabilized before extending a component from the rack.  
3.  
After performing the installation or maintenance procedure, slide the server back into the rack, and then  
press the server firmly into the rack to secure it in place.  
WARNING: To reduce the risk of personal injury, be careful when pressing the server rail-release  
latches and sliding the server into the rack. The sliding rails could pinch your fingers.  
Removal and replacement procedures 26  
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Remove the server from the rack  
To remove the server from an HP, Compaq branded, telco, or third-party rack:  
1.  
2.  
3.  
Power down the server (on page 25).  
Extend the server from the rack (on page 26).  
Disconnect the cabling and remove the server from the rack. For more information, refer to the  
documentation that ships with the rack mounting option.  
4.  
Place the server on a sturdy, level surface.  
Access the product rear panel  
Cable management arm with left-hand swing  
To access the server rear panel:  
Removal and replacement procedures 27  
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1.  
Remove the cable arm retainer.  
2.  
Open the cable management arm.  
Cable management arm with right-hand swing  
NOTE: To access some components, you may need to remove the cable management arm.  
To access the product rear panel components, open the cable management arm:  
1.  
2.  
3.  
Power down the server (on page 25).  
Swing open the cable management arm.  
Remove the cables from the cable trough.  
Removal and replacement procedures 28  
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4.  
Remove the cable management arm.  
Safety considerations  
Before performing service procedures, review all the safety information.  
Preventing electrostatic discharge  
To prevent damaging the system, be aware of the precautions you need to follow when setting up the system  
or handling parts. A discharge of static electricity from a finger or other conductor may damage system  
boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the device.  
To prevent electrostatic damage:  
Avoid hand contact by transporting and storing products in static-safe containers.  
Keep electrostatic-sensitive parts in their containers until they arrive at static-free workstations.  
Place parts on a grounded surface before removing them from their containers.  
Avoid touching pins, leads, or circuitry.  
Always be properly grounded when touching a static-sensitive component or assembly.  
Server warnings and cautions  
Before installing a server, be sure that you understand the following warnings and cautions.  
Removal and replacement procedures 29  
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WARNING: To reduce the risk of electric shock or damage to the equipment:  
Do not disable the power cord grounding plug. The grounding plug is an important safety  
feature.  
Plug the power cord into a grounded (earthed) electrical outlet that is easily accessible at all  
times.  
Unplug the power cord from the power supply to disconnect power to the equipment.  
Do not route the power cord where it can be walked on or pinched by items placed against it.  
Pay particular attention to the plug, electrical outlet, and the point where the cord extends from  
the server.  
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the  
internal system components to cool before touching them.  
CAUTION: Do not operate the server for long periods with the access panel open or removed.  
Operating the server in this manner results in improper airflow and improper cooling that can  
lead to thermal damage.  
HP Trusted Platform Module  
The TPM is not a customer-removable part.  
CAUTION: Any attempt to remove an installed TPM from the system board breaks or disfigures  
the TPM security rivet. Upon locating a broken or disfigured rivet on an installed TPM,  
administrators should consider the system compromised and take appropriate measures to ensure  
the integrity of the system data.  
If you suspect a TPM board failure, leave the TPM installed and remove the system board. Contact an HP  
authorized service provider for a replacement system board and TPM board.  
Access panel  
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the  
internal system components to cool before touching them.  
CAUTION: For proper cooling, do not operate the server without the access panel, baffles,  
expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize  
the amount of time the access panel is open.  
To remove the component:  
1.  
Power down the server if performing a non-hot-plug installation or maintenance procedure ("Power  
2.  
3.  
Extend the server from the rack (on page 26).  
Use the T-15 Torx screwdriver attached to the rear of the server to loosen the security screw on the hood  
latch.  
4.  
Lift up on the hood latch handle, and then remove the access panel.  
To replace the component, reverse the removal procedure.  
Removal and replacement procedures 30  
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Air baffle  
To remove the component:  
CAUTION: For proper cooling, do not operate the server without the access panel, baffles,  
expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize  
the amount of time the access panel is open.  
1.  
2.  
Power down the server (on page 25).  
Extend or remove the server from the rack ("Remove the server from the rack" on page 27, "Extend the  
3.  
Remove the access panel ("Access panel" on page 30).  
CAUTION: Do not detach the cable that connects the battery pack to the cache module.  
Detaching the cable causes any unsaved data in the cache module to be lost.  
4.  
5.  
Remove the battery pack from the air baffle ("Removing the battery pack" on page 49).  
Remove the air baffle.  
To replace the component, reverse the removal procedure.  
Full-length expansion board shipping bracket  
To remove the component:  
CAUTION: To prevent damage to the server or expansion boards, power down the server and  
remove all AC power cords before removing or installing the PCI riser cage.  
1.  
2.  
3.  
4.  
Power down the server (on page 25).  
Extend the server from the rack (on page 26).  
Remove the access panel ("Access panel" on page 30).  
Remove the full-length expansion board retainer:  
Removal and replacement procedures 31  
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o
If no full-length expansion boards are installed, remove the full-length expansion board shipping  
bracket as indicated.  
o
If full-length expansion boards are installed, remove the full-length expansion board shipping  
bracket as indicated.  
To replace the component, reverse the removal procedure.  
PCI riser cage  
To remove the component:  
CAUTION: To prevent damage to the server or expansion boards, power down the server and  
remove all AC power cords before removing or installing the PCI riser cage.  
Power down the server (on page 25).  
1.  
Removal and replacement procedures 32  
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2.  
3.  
4.  
Extend or remove the server from the rack ("Extend the server from the rack" on page 26).  
Remove the access panel ("Access panel" on page 30).  
If any full-length expansion boards are installed, remove the full-length expansion board shipping  
5.  
Remove the PCI riser cage.  
To replace the component, reverse the removal procedure.  
SAS hard drive blank  
CAUTION: For proper cooling, do not operate the server without the access panel, baffles,  
expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize  
the amount of time the access panel is open.  
Remove the component as indicated.  
To replace the blank, slide the blank into the bay until it locks into place.  
Hot-plug SAS hard drive  
To remove the component:  
Removal and replacement procedures 33  
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CAUTION: For proper cooling, do not operate the server without the access panel, baffles,  
expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize  
the amount of time the access panel is open.  
1.  
Determine the status of the drive from the hot-plug SAS hard drive LED combinations ("SAS and SATA  
2.  
3.  
Back up all server data on the hard drive.  
Remove the hard drive.  
To replace the component, reverse the removal procedure.  
Power supply blank  
To remove the component:  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all bays are populated with either a component or a blank.  
1.  
2.  
Access the product rear panel (on page 27).  
Remove the power supply blank.  
WARNING: To reduce the risk of personal injury from hot surfaces, allow the power supply or  
power supply blank to cool before touching it.  
Removal and replacement procedures 34  
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To replace the component, reverse the removal procedure.  
Hot-plug power supply  
WARNING: To reduce the risk of personal injury from hot surfaces, allow the power supply or  
power supply blank to cool before touching it.  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all bays are populated with either a component or a blank.  
To remove the component:  
1.  
Determine how many hot-plug power supplies are installed:  
o
o
If only one hot-plug power supply is installed, power down the server (on page 25).  
If more than one hot-plug power supply is installed, continue with the next step.  
2.  
3.  
4.  
5.  
Disconnect the power cord from the source.  
Access the product rear panel (on page 27).  
Remove the power cord from the server.  
Remove the hot-plug power supply.  
WARNING: To reduce the risk of electric shock or damage to the equipment, do not connect the  
power cord to the power supply until the power supply is installed.  
To replace the component:  
1.  
2.  
3.  
4.  
Slide the hot-plug power supply into the power supply bay.  
Connect the power cord to the power supply.  
Install the cable management arm, if removed ("Access the product rear panel" on page 27).  
Route the power cord through the cable management arm or power cord anchor.  
Removal and replacement procedures 35  
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NOTE: If using the power cord anchor, be sure to leave enough slack in the power cord so that  
the redundant power supply can be removed without disconnecting the power cord from the  
primary power supply.  
5.  
6.  
7.  
8.  
Close the cable management arm.  
Connect the power cord to the power source.  
Be sure that the power supply LED is green ("Rear panel LEDs and buttons" on page 90).  
Be sure that the power supply LED on the SID is green ("Systems Insight Display LEDs" on page 87).  
Optical drive  
To remove the component:  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all bays are populated with either a component or a blank.  
1.  
2.  
3.  
4.  
Power down the server (on page 25).  
Extend or remove the server from the rack ("Extend the server from the rack" on page 26).  
Remove the access panel ("Access panel" on page 30).  
Disconnect the cable from the optical drive.  
Removal and replacement procedures 36  
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5.  
Remove the optical drive.  
To replace the component, reverse the removal procedure.  
Optical drive cage  
To remove the component:  
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless  
all bays are populated with either a component or a blank.  
1.  
2.  
3.  
4.  
Power down the server (on page 25).  
Extend or remove the server from the rack ("Extend the server from the rack" on page 26).  
Remove the access panel ("Access panel" on page 30).  
Disconnect the cable from the optical drive.  
5.  
Remove the optical drive ("Optical drive" on page 36).  
Removal and replacement procedures 37  
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6.  
Remove the optical drive cage.  
To replace the component, reverse the removal procedure.  
Power supply backplane  
To remove the component:  
1.  
2.  
3.  
Power down the server (on page 25).  
Remove all power supplies ("Hot-plug power supply" on page 35).  
Extend or remove the server from the rack ("Remove the server from the rack" on page 27, "Extend the  
4.  
5.  
Remove the access panel ("Access panel" on page 30).  
Remove the power supply backplane.  
To replace the component, reverse the removal procedure.  
Removal and replacement procedures 38  
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Hot-plug fan  
The server supports variable fan speeds. The fans operate at minimum speed until a temperature change  
requires a fan speed increase to cool the server.  
The server shuts down in the following temperature-related scenarios:  
At POST:  
o
The BIOS suspends the server for 5 minutes if it detects a cautionary temperature level. If the  
cautionary temperature level is still detected after 5 minutes, the BIOS performs an orderly shutdown  
and enters Standby mode.  
o
o
The BIOS performs an orderly shutdown if two or more fans have failed.  
The server performs an immediate shutdown if it detects a critical temperature level.  
IMPORTANT: An immediate shutdown is a hardware-controlled function and it overrides any  
firmware or software actions.  
In the operating system:  
o
The Health Driver performs an orderly shutdown if it detects a cautionary temperature level. If the  
server detects a critical temperature level before the orderly shutdown occurs, the server performs an  
immediate shutdown. Additionally, the Health Driver performs an orderly shutdown if more than  
one fan is failed or removed.  
o
When Thermal Shutdown is disabled in RBSU, the server performs an immediate shutdown if it  
detects a critical temperature level.  
IMPORTANT: An immediate shutdown is a hardware-controlled function and it overrides any  
firmware or software actions.  
To remove the component:  
1.  
Extend or remove the server from the rack ("Remove the server from the rack" on page 27, "Extend the  
2.  
Remove the access panel ("Access panel" on page 30).  
Removal and replacement procedures 39  
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3.  
Remove the fan.  
CAUTION: Do not operate the server for long periods with the access panel open or removed.  
Operating the server in this manner results in improper airflow and improper cooling that can  
lead to thermal damage.  
To replace the component, reverse the removal procedure.  
SFF hard drive backplane  
To remove the component:  
1.  
2.  
3.  
4.  
Power down the server (on page 25).  
Extend or remove the server from the rack ("Extend the server from the rack" on page 26).  
Remove the access panel ("Access panel" on page 30).  
Remove all hot-plug hard drives ("Hot-plug SAS hard drive" on page 33).  
Removal and replacement procedures 40  
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5.  
Disconnect all cables from the hard drive backplane.  
6.  
Remove the hard drive backplane.  
To replace the component, reverse the removal procedure.  
SFF hard drive cage  
To remove the component:  
1.  
2.  
3.  
4.  
5.  
6.  
Power down the server (on page 25).  
Extend or remove the server from the rack ("Extend the server from the rack" on page 26).  
Remove the access panel ("Access panel" on page 30).  
Remove all hot-plug hard drives ("Hot-plug SAS hard drive" on page 33).  
Disconnect all cables from the hard drive backplane.  
Remove the hard drive backplane ("SFF hard drive backplane" on page 40).  
Removal and replacement procedures 41  
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7.  
Remove the hard drive cage.  
To replace the component, reverse the removal procedure.  
LFF hard drive backplane  
To remove the component:  
1.  
2.  
3.  
4.  
5.  
Power down the server (on page 25).  
Extend or remove the server from the rack ("Extend the server from the rack" on page 26).  
Remove the access panel ("Access panel" on page 30).  
Remove all hot-plug hard drives ("Hot-plug SAS hard drive" on page 33).  
Disconnect all cables from the hard drive backplane.  
Removal and replacement procedures 42  
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6.  
Remove the hard drive backplane.  
To replace the component, reverse the removal procedure.  
LFF hard drive cage  
To remove the component:  
1.  
2.  
3.  
4.  
5.  
6.  
7.  
Power down the server (on page 25).  
Extend or remove the server from the rack ("Extend the server from the rack" on page 26).  
Remove the access panel ("Access panel" on page 30).  
Remove all hot-plug hard drives ("Hot-plug SAS hard drive" on page 33).  
Disconnect all cables from the hard drive backplane.  
Remove the hard drive backplane ("LFF hard drive backplane" on page 42).  
Remove the hard drive cage.  
Removal and replacement procedures 43  
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To replace the component, reverse the removal procedure.  
Systems Insight Display  
To remove the component:  
1.  
2.  
3.  
4.  
5.  
6.  
7.  
Power down the server (on page 25).  
Extend the server from the rack (on page 26).  
Remove the access panel ("Access panel" on page 30).  
Remove the PCI riser cage ("PCI riser cage" on page 32).  
Remove the air baffle ("Air baffle" on page 31).  
Disconnect the Systems Insight Display cable.  
Remove the Systems Insight Display.  
To replace the component, reverse the removal procedure.  
Front left bezel  
To remove the component:  
1.  
2.  
Power down the server (on page 25).  
Extend or remove the server from the rack ("Remove the server from the rack" on page 27, "Extend the  
3.  
4.  
5.  
6.  
Remove the access panel ("Access panel" on page 30).  
Remove the PCI riser cage ("PCI riser cage" on page 32).  
Remove the air baffle ("Air baffle" on page 31).  
Extend or remove the Systems Insight Display ("Systems Insight Display" on page 44).  
Removal and replacement procedures 44  
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7.  
Remove the three T-10 Torx screws, and then detach the front bezel.  
To replace the component, reverse the removal procedure.  
Front right bezel  
To remove the component:  
1.  
Extend or remove the server from the rack ("Remove the server from the rack" on page 27, "Extend the  
2.  
Remove the three T-10 Torx screws, and then detach the front bezel.  
To replace the component, reverse the removal procedure.  
Removal and replacement procedures 45  
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Fan cage  
To remove the component:  
1.  
2.  
Power down the server (on page 25).  
Extend or remove the server from the rack ("Remove the server from the rack" on page 27, "Extend the  
3.  
4.  
5.  
6.  
Remove the access panel ("Access panel" on page 30).  
Remove the PCI riser cage ("PCI riser cage" on page 32).  
Remove the air baffle ("Air baffle" on page 31).  
Remove the fan blanks.  
7.  
8.  
Remove the fans ("Hot-plug fan" on page 39).  
Remove the fan cage.  
Removal and replacement procedures 46  
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To replace the component, reverse the removal steps. When re-installing the fans, press down on the top of  
each fan to be sure it is seated properly.  
Expansion slot covers  
CAUTION: To prevent damage to the server or expansion boards, power down the server and  
remove all AC power cords before removing or installing the PCI riser cage.  
CAUTION: For proper cooling, do not operate the server without the access panel, baffles,  
expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize  
the amount of time the access panel is open.  
1.  
2.  
3.  
4.  
5.  
Power down the server (on page 25).  
Extend the server from the rack (on page 26).  
Remove the access panel ("Access panel" on page 30).  
Remove the PCI riser cage ("PCI riser cage" on page 32).  
Remove the expansion slot cover:  
o
To remove slot cover 1 or 4, push in on the retainer to release it, and then slide out the cover.  
Removal and replacement procedures 47  
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o
To remove slot covers 2 and 3, lift up on the latch, remove the latch, and then remove the cover.  
o
To remove slot covers 5 and 6, push down on the latch, rotate the latch down, and then remove the  
cover.  
Battery-backed write cache procedures  
Two types of procedures are provided for the BBWC option:  
Removal and replacement of failed components:  
o
o
Removing the cache module (on page 49)  
Removing the battery pack (on page 49)  
Recovery of cached data from a failed server ("Recovering data from the battery-backed write cache"  
on page 50)  
Removal and replacement procedures 48  
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CAUTION: Do not detach the cable that connects the battery pack to the cache module.  
Detaching the cable causes any unsaved data in the cache module to be lost.  
Removing the cache module  
To remove the component:  
1.  
2.  
Power down the server (on page 25).  
Extend or remove the server from the rack ("Remove the server from the rack" on page 27, "Extend the  
3.  
4.  
5.  
6.  
Remove the access panel ("Access panel" on page 30).  
Remove the PCI riser cage ("PCI riser cage" on page 32).  
Remove the air baffle ("Air baffle" on page 31).  
Remove the cache module.  
To replace the component, reverse the removal procedure.  
CAUTION: To prevent damage to the cache module during installation, be sure the cache  
module is fully inserted before pressing down.  
Removing the battery pack  
To remove the component:  
1.  
2.  
3.  
4.  
Power down the server (on page 25).  
Extend or remove the server from the rack ("Extend the server from the rack" on page 26).  
Remove the access panel ("Access panel" on page 30).  
Remove the PCI riser cage ("PCI riser cage" on page 32).  
Removal and replacement procedures 49  
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5.  
Disconnect the cable, and then remove the battery pack.  
To replace the component, reverse the removal procedure.  
Recovering data from the battery-backed write cache  
If the server fails, use the following procedure to recover data temporarily stored in the BBWC.  
CAUTION: Before starting this procedure, read the information about protecting against  
electrostatic discharge ("Preventing electrostatic discharge" on page 29).  
1.  
2.  
Perform one of the following:  
o
Set up a recovery server station using an identical server model. Do not install any internal drives or  
BBWC in this server. (HP recommends this option.)  
o
Find a server that has enough empty drive bays to accommodate all the drives from the failed server  
and that meets all the other requirements for drive and array migration.  
Power down the failed server ("Power down the server" on page 25). If any data is stored in the cache  
module, a green LED on the module flashes every 2 seconds.  
CAUTION: Do not detach the cable that connects the battery pack to the cache module.  
Detaching the cable causes any unsaved data in the cache module to be lost.  
3.  
4.  
Transfer the hard drives from the failed server to the recovery server station.  
Perform one of the following:  
o
If the array controller has failed, remove the cache module ("Removing the cache module" on page  
49) and battery pack ("Removing the battery pack" on page 49) from the failed array controller,  
and install the cache module and battery pack on an array controller in the recovery server.  
o
If the server has failed, remove the controller ("Half-length expansion board" on page 55,  
49), and battery pack ("Removing the battery pack" on page 49) from the failed server, and install  
the controller, cache module, and battery pack in the recovery server.  
Removal and replacement procedures 50  
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5.  
Power up the recovery server. A 1759 POST message is displayed, stating that valid data was flushed  
from the cache. This data is now stored on the drives in the recovery server. You can now transfer the  
drives (and controller, if one was used) to another server.  
Flash-backed write cache procedures  
Two types of procedures are provided for the FBWC option:  
Removal and replacement of failed components:  
o
o
Removing the cache module ("Flash-backed write cache module" on page 51)  
Removing the capacitor pack ("Flash-backed write cache capacitor pack" on page 52)  
Recovery of cached data from a failed server ("Recovering data from the battery-backed write cache"  
on page 50)  
CAUTION: Do not detach the cable that connects the battery pack or capacitor pack to the cache  
module. Detaching the cable causes any unsaved data in the cache module to be lost.  
Flash-backed write cache module  
To remove the component:  
CAUTION: The cache module connector does not use the industry-standard DDR3 mini-DIMM  
pinout. Do not use the controller with cache modules designed for other controller models,  
because the controller can malfunction and you can lose data. Also, do not transfer this cache  
module to an unsupported controller model, because you can lose data.  
1.  
2.  
3.  
Back up all data.  
Close all applications.  
Power down the server (on page 25).  
CAUTION: In systems that use external data storage, be sure that the server is the first unit to be  
powered down and the last to be powered back up. Taking this precaution ensures that the system  
does not erroneously mark the drives as failed when the server is powered up.  
4.  
5.  
6.  
7.  
Extend the server from the rack (on page 26).  
Remove the access panel ("Access panel" on page 30).  
Remove the PCI riser cage ("PCI riser cage" on page 32)  
If the existing cache module is connected to a capacitor pack, observe the FBWC module LEDs (on  
o
If the amber LED is flashing, data is trapped in the cache. Restore system power, and restart this  
procedure from step 1.  
o
If the amber LED is not illuminated, remove the controller from the server, and then continue with the  
next step.  
Removal and replacement procedures 51  
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8.  
Open the ejector latches on each side of the cache module connector. Normally, the cache module is  
ejected from the cache module connector. If the module is not ejected automatically, remove the cache  
module.  
9.  
If the cache module is connected to a capacitor pack, disconnect the capacitor pack cable from the  
connector on the top of the cache module.  
To replace the component, reverse the removal procedure.  
CAUTION: To prevent damage to the cache module during installation, be sure the cache  
module is fully inserted before pressing down.  
Flash-backed write cache capacitor pack  
To remove the component:  
1.  
2.  
3.  
Back up all data.  
Close all applications.  
Power down the server (on page 25).  
Removal and replacement procedures 52  
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CAUTION: In systems that use external data storage, be sure that the server is the first unit to be  
powered down and the last to be powered back up. Taking this precaution ensures that the system  
does not erroneously mark the drives as failed when the server is powered up.  
4.  
5.  
6.  
7.  
Extend the server from the rack (on page 26).  
Remove the access panel ("Access panel" on page 30).  
Remove the PCI riser cage ("PCI riser cage" on page 32).  
If the capacitor pack is connected to the cache module, disconnect the capacitor pack cable from the  
connector on the top of the cache module.  
8.  
Disconnect the capacitor pack from the air baffle.  
To replace the component, reverse the removal procedure.  
Expansion slot covers  
CAUTION: To prevent damage to the server or expansion boards, power down the server and  
remove all AC power cords before removing or installing the PCI riser cage.  
Removal and replacement procedures 53  
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CAUTION: For proper cooling, do not operate the server without the access panel, baffles,  
expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize  
the amount of time the access panel is open.  
1.  
2.  
3.  
4.  
Power down the server (on page 25).  
Extend or remove the server from the rack ("Extend the server from the rack" on page 26).  
Remove the access panel ("Access panel" on page 30).  
If any full-length expansion boards are installed, remove the full-length expansion board shipping  
5.  
6.  
Remove the PCI riser cage ("PCI riser cage" on page 32).  
Remove the expansion slot cover:  
o
To remove slot cover 1 or 4, push in on the retainer to release it, and then slide out the cover.  
o
To remove slot covers 2 and 3, lift up on the latch, remove the latch, and then remove the cover.  
Removal and replacement procedures 54  
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o
To remove slot covers 5 and 6, push down on the latch, rotate the latch down, and then remove the  
cover.  
Expansion boards  
Half-length expansion board  
To remove the component:  
1.  
2.  
3.  
4.  
5.  
6.  
Power down the server (on page 25).  
Extend the server from the rack (on page 26).  
Remove the access panel ("Access panel" on page 30).  
Disconnect any external cables that are connected to the expansion board.  
Remove the PCI riser cage ("PCI riser cage" on page 32).  
Disconnect any internal cables that are connected to the expansion board.  
Removal and replacement procedures 55  
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7.  
Remove the expansion board.  
To replace the component, reverse the removal procedure.  
Full-length expansion board  
To remove the component:  
1.  
2.  
3.  
4.  
5.  
6.  
7.  
Power down the server (on page 25).  
Extend the server from the rack (on page 26).  
Remove the access panel ("Access panel" on page 30).  
Disconnect any external cables that are connected to the expansion board.  
Remove the PCI riser cage ("PCI riser cage" on page 32).  
Disconnect any internal cables that are connected to the expansion board.  
Remove the expansion board.  
Removal and replacement procedures 56  
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To replace the component, reverse the removal procedure.  
Heatsink  
To remove the heatsink:  
1.  
2.  
3.  
4.  
5.  
6.  
Power down the server (on page 25).  
Extend the server from the rack (on page 26).  
Remove the access panel ("Access panel" on page 30).  
If full-length expansion boards are installed, remove the PCI riser cage ("PCI riser cage" on page 32).  
Remove the air baffle ("Air baffle" on page 31).  
Open the heatsink retaining bracket.  
7.  
Remove the heatsink.  
Removal and replacement procedures 57  
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To replace the heatsink:  
1.  
Clean the old thermal grease from the processor with the alcohol swab. Allow the alcohol to evaporate  
before continuing.  
2.  
Apply all the grease to the top of the processor in the following pattern to ensure even distribution.  
3.  
Install the heatsink.  
Removal and replacement procedures 58  
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4.  
Close and lock the heatsink retaining latches.  
5.  
6.  
7.  
8.  
9.  
Install the air baffle ("Air baffle" on page 31).  
If the PCI riser cage was removed, install the PCI riser cage ("PCI riser cage" on page 32).  
Install the access panel ("Access panel" on page 30).  
Install the server into the rack.  
Power up the server.  
Power supply cage assembly  
To remove the component:  
1.  
2.  
3.  
4.  
5.  
6.  
7.  
8.  
9.  
Power down the server (on page 25).  
Access the product rear panel (on page 27).  
Remove all power supplies ("Hot-plug power supply" on page 35).  
Remove the server from the rack (on page 27).  
Remove the access panel ("Access panel" on page 30).  
Remove the PCI riser cage ("PCI riser cage" on page 32).  
Remove the air baffle ("Air baffle" on page 31).  
Remove the power supply backplane ("Power supply backplane" on page 38).  
Loosen the system board thumbscrews, and then slide the system board assembly forward.  
Removal and replacement procedures 59  
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10. Remove the power supply cage assembly.  
To replace the component, reverse the removal procedure.  
Processor  
CAUTION: To avoid damage to the processor and system board, only authorized personnel  
should attempt to replace or install the processor in this server.  
CAUTION: To prevent possible server malfunction and damage to the equipment, multiprocessor  
configurations must contain processors with the same part number.  
IMPORTANT: Processor socket 1 must always be populated. If processor socket 1 is empty, the  
server does not power up.  
To remove a processor:  
1.  
2.  
3.  
4.  
5.  
Power down the server (on page 25).  
Extend the server from the rack (on page 26).  
Remove the access panel ("Access panel" on page 30).  
If full-length expansion boards are installed, remove the PCI riser cage ("PCI riser cage" on page 32).  
Remove the air baffle ("Air baffle" on page 31).  
Removal and replacement procedures 60  
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6.  
Open the heatsink retaining bracket.  
7.  
Remove the heatsink.  
Removal and replacement procedures 61  
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8.  
Open the processor locking lever and the processor socket retaining bracket.  
9.  
Using the processor tool, remove the processor from the system board:  
a. Line up the processor tool, ensuring the locking lever graphic on the tool is oriented correctly.  
b. Press in on the plastic tabs, and then place the tool on the processor.  
c. Release the tabs, and then carefully lift the processor and tool straight up.  
Removal and replacement procedures 62  
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10. Carefully rotate the tool, and then push in and release the tabs to secure the processor in the tool.  
CAUTION: To avoid damage to the processor, do not touch the bottom of the processor,  
especially the contact area.  
CAUTION: To avoid damage to the system board:  
Do not touch the processor socket contacts.  
Always install the processor socket cover after removing the processor from the socket.  
Do not tilt or slide the processor when lowering the processor into the socket.  
Removal and replacement procedures 63  
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To replace the processor:  
1.  
Carefully insert the processor into the processor installation tool. Handle the processor by the edges  
only, and do not touch the bottom of the processor, especially the contact area.  
Removal and replacement procedures 64  
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2.  
Be sure the tool is oriented correctly. Align the processor installation tool with the socket, and then install  
the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.  
CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To  
avoid damage to the system board:  
Never install or remove a processor without using the processor installation tool.  
Do not touch the processor socket contacts.  
Do not tilt or slide the processor when lowering the processor into the socket.  
Removal and replacement procedures 65  
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3.  
Press and hold the tabs on the processor installation tool to separate it from the processor, and then  
remove the tool.  
4.  
Close the processor socket retaining bracket and the processor locking lever.  
CAUTION: Be sure to close the processor socket retaining bracket before closing the processor  
locking lever. The lever should close without resistance. Forcing the lever closed can damage the  
processor and socket, requiring system board replacement.  
5.  
Clean the old thermal grease from the heatsink and the top of the processor with the alcohol swab.  
Allow the alcohol to evaporate before continuing.  
Removal and replacement procedures 66  
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6.  
Apply all the grease to the top of the processor in the following pattern to ensure even distribution.  
7.  
Install the heatsink.  
Removal and replacement procedures 67  
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8.  
Close and lock the heatsink retaining latches.  
9.  
Install the air baffle ("Air baffle" on page 31).  
10. If the PCI riser cage was removed, install the PCI riser cage ("PCI riser cage" on page 32).  
11. Install the access panel ("Access panel" on page 30).  
12. Install the server into the rack.  
13. Power up the server.  
DIMMs  
IMPORTANT: This server does not support mixing RDIMMs and UDIMMs. Attempting to mix  
these two types causes the server to halt during BIOS initialization.  
To identify the DIMMs installed in the server, see "DIMM slot locations ("DIMM identification" on page 95)."  
To remove the component:  
1.  
2.  
Power down the server (on page 25).  
Remove all power:  
a. Disconnect each power cord from the power source.  
b. Disconnect each power cord from the server.  
3.  
page 27) the server from the rack.  
4.  
5.  
Remove the access panel ("Access panel" on page 30).  
Remove the air baffle ("Air baffle" on page 31).  
Removal and replacement procedures 68  
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6.  
Remove the DIMM.  
To replace the component, reverse the removal procedure.  
For DIMM configuration information, see the server user guide.  
Battery replacement  
If the server no longer automatically displays the correct date and time, you may need to replace the battery  
that provides power to the real-time clock.  
WARNING: The computer contains an internal lithium manganese dioxide, a vanadium  
pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not  
properly handled. To reduce the risk of personal injury:  
Do not attempt to recharge the battery.  
Do not expose the battery to temperatures higher than 60°C (140°F).  
Do not disassemble, crush, puncture, short external contacts, or dispose of in fire or water.  
Replace only with the spare designated for this product.  
To remove the component:  
1.  
2.  
3.  
4.  
Power down the server (on page 25).  
Extend or remove the server from the rack ("Extend the server from the rack" on page 26).  
Remove the access panel ("Access panel" on page 30).  
If any full-length expansion boards are installed, remove the full-length expansion board shipping  
5.  
6.  
Remove the PCI riser cage ("PCI riser cage" on page 32).  
Remove the air baffle ("Air baffle" on page 31).  
Removal and replacement procedures 69  
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7.  
Remove the battery.  
To replace the component, reverse the removal procedure.  
For more information about battery replacement or proper disposal, contact an authorized reseller or an  
authorized service provider.  
System maintenance switch  
Position  
Default  
Function  
Off  
Off = iLO 2 security is enabled.  
On = iLO 2 security is disabled.  
S1  
Off  
Off = System configuration can be modified.  
On = System configuration is locked and cannot be modified.  
S2  
Off  
Off  
Off  
Reserved  
Reserved  
S3  
S4  
S5  
Off = Power-on password is enabled.  
On = Power-on password is disabled.  
Off  
Off = Normal  
On = ROM treats system configuration as invalid.  
S6  
Off  
Off  
Reserved  
Reserved  
S7  
S8  
When the system maintenance switch position 6 is set to the On position, the system is prepared to erase all  
system configuration settings from both CMOS and NVRAM.  
CAUTION: Clearing CMOS and/or NVRAM deletes configuration information. Be sure to  
properly configure the server or data loss could occur.  
Removal and replacement procedures 70  
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System board  
To remove the component:  
1.  
2.  
Power down the server (on page 25).  
Extend or remove the server from the rack ("Remove the server from the rack" on page 27, "Extend the  
3.  
4.  
5.  
6.  
7.  
8.  
9.  
Remove all power supplies ("Hot-plug power supply" on page 35).  
Remove the access panel ("Access panel" on page 30).  
Remove the PCI riser cage ("PCI riser cage" on page 32).  
Remove the battery pack ("Removing the battery pack" on page 49).  
Remove the air baffle ("Air baffle" on page 31).  
Remove all DIMMs ("DIMMs" on page 68).  
Remove the hot-plug fans ("Hot-plug fan" on page 39).  
10. Remove the fan cage ("Fan cage" on page 46).  
11. Remove the power supply backplane ("Power supply backplane" on page 38).  
12. Disconnect all cables connected to the system board.  
13. Open the heatsink retainer bracket.  
Removal and replacement procedures 71  
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14. Remove the heatsink.  
15. Open the processor locking lever and the processor socket retaining bracket.  
16. Using the processor tool, remove the processor from the system board:  
a. Line up the processor tool, ensuring the locking lever graphic on the tool is oriented correctly.  
b. Press in on the plastic tabs, and then place the tool on the processor.  
Removal and replacement procedures 72  
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c. Release the tabs, and then carefully lift the processor and tool straight up.  
17. Carefully rotate the tool, and then push in and release the tabs to secure the processor in the tool.  
CAUTION: To avoid damage to the processor, do not touch the bottom of the processor,  
especially the contact area.  
18. Loosen the system board thumbscrew.  
19. Remove the power supply cage.  
Removal and replacement procedures 73  
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20. Remove the system board.  
To replace the component:  
1.  
Install the spare system board.  
CAUTION: Failure to completely open the processor locking lever prevents the processor from  
seating during installation, leading to hardware damage.  
Removal and replacement procedures 74  
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2.  
Open the processor locking lever and the processor socket retaining bracket. Do not remove the  
processor socket cover.  
IMPORTANT: Be sure the processor remains inside the processor installation tool.  
3.  
If the processor has separated from the installation tool, carefully re-insert the processor in the tool.  
Handle the processor by the edges only, and do not touch the bottom of the processor, especially the  
contact area.  
Removal and replacement procedures 75  
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4.  
Align the processor installation tool with the socket, and then install the processor. THE PINS ON THE  
SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.  
CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To  
avoid damage to the system board:  
Never install or remove a processor without using the processor installation tool.  
Do not touch the processor socket contacts.  
Do not tilt or slide the processor when lowering the processor into the socket.  
Removal and replacement procedures 76  
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5.  
Press the tabs on the processor installation tool to separate it from the processor, and then remove the  
tool.  
6.  
Close the processor socket retaining bracket and the processor locking lever. The processor socket  
cover is automatically ejected. Remove the cover.  
CAUTION: Be sure to close the processor socket retaining bracket before closing the processor  
locking lever. The lever should close without resistance. Forcing the lever closed can damage the  
processor and socket, requiring system board replacement.  
7.  
8.  
Install the processor socket cover onto the processor socket of the failed system board.  
Clean the old thermal grease from the heatsink and the top of the processor with the alcohol swab.  
Allow the alcohol to evaporate before continuing.  
Removal and replacement procedures 77  
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9.  
Apply all the grease to the top of the processor in the following pattern to ensure even distribution.  
10. Install the heatsink.  
IMPORTANT: Install all components with the same configuration that was used on the failed  
system board.  
11. Install all components removed from the failed system board.  
12. Install the access panel ("Access panel" on page 30).  
13. Install the power supplies ("Hot-plug power supply" on page 35).  
14. Power up the server.  
After you replace the system board, you must re-enter the server serial number and the product ID.  
1.  
2.  
3.  
4.  
During the server startup sequence, press the F9 key to access RBSU.  
Select the Advanced Options menu.  
Select Service Options.  
Select Serial Number. The following warnings appear:  
Removal and replacement procedures 78  
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WARNING! WARNING! WARNING! The serial number is loaded into the system during  
the manufacturing process and should NOT be modified. This option should only  
be used by qualified service personnel. This value should always match the  
serial number sticker located on the chassis.  
Warning: The serial number should ONLY be modified by qualified personnel.  
This value should always match the serial number located on the chassis.  
5.  
6.  
7.  
Press the Enter key to clear the warning.  
Enter the serial number and press the Enter key.  
Select Product ID. The following warning appears:  
Warning: The Product ID should ONLY be modified by qualified personnel. This  
value should always match the Product ID on the chassis.  
8.  
9.  
Enter the product ID and press the Enter key.  
Press the Esc key to close the menu.  
10. Press the Esc key to exit RBSU.  
11. Press the F10 key to confirm exiting RBSU. The server automatically reboots.  
Removal and replacement procedures 79  
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Cabling  
SAS hard drive cabling  
Optical drive cabling  
Cabling 80  
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BBWC battery cabling  
FBWC capacitor pack cabling  
Cabling 81  
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Diagnostic tools  
Troubleshooting resources  
The HP ProLiant Servers Troubleshooting Guide provides procedures for resolving common problems and  
comprehensive courses of action for fault isolation and identification, error message interpretation, issue  
resolution, and software maintenance on ProLiant servers and server blades. This guide includes  
problem-specific flowcharts to help you navigate complex troubleshooting processes. To view the guide,  
select a language:  
HP Insight Diagnostics  
HP Insight Diagnostics is a proactive server management tool, available in both offline and online versions,  
that provides diagnostics and troubleshooting capabilities to assist IT administrators who verify server  
installations, troubleshoot problems, and perform repair validation.  
HP Insight Diagnostics Offline Edition performs various in-depth system and component testing while the OS  
is not running. To run this utility, launch the SmartStart CD.  
HP Insight Diagnostics Online Edition is a web-based application that captures system configuration and  
other related data needed for effective server management. Available in Microsoft® Windows® and Linux  
versions, the utility helps to ensure proper system operation.  
For more information or to download the utility, refer to the HP website (http://www.hp.com/servers/diags).  
HP Insight Diagnostics survey functionality  
HP Insight Diagnostics (on page 82) provides survey functionality that gathers critical hardware and software  
information on ProLiant servers.  
This functionality supports operating systems that may not be supported by the server. For operating systems  
supported by the server, see the HP website (http://www.hp.com/go/supportos).  
If a significant change occurs between data-gathering intervals, the survey function marks the previous  
information and overwrites the survey data files to reflect the latest changes in the configuration.  
Diagnostic tools 82  
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Survey functionality is installed with every SmartStart-assisted HP Insight Diagnostics installation, or it can be  
installed through the HP PSP.  
NOTE: The current version of SmartStart provides the memory spare part numbers for the server.  
To download the latest version, see the HP website (http://www.hp.com/support).  
Integrated Management Log  
The IML records hundreds of events and stores them in an easy-to-view form. The IML timestamps each event  
with 1-minute granularity.  
You can view recorded events in the IML in several ways, including the following:  
From within HP SIM  
From within Survey Utility  
From within operating system-specific IML viewers  
o
o
o
For NetWare: IML Viewer (does not apply to HP ProLiant DL980 Servers)  
For Windows®: IML Viewer  
For Linux: IML Viewer Application  
From within the iLO 3 user interface  
From within HP Insight Diagnostics (on page 82)  
For more information, see the Management CD or DVD in the HP Insight Foundation suite for ProLiant.  
HP Insight Remote Support software  
HP strongly recommends that you install HP Insight Remote Support software to complete the installation or  
upgrade of your product and to enable enhanced delivery of your HP Warranty, HP Care Pack Service, or  
HP contractual support agreement. HP Insight Remote Support supplements your monitoring 24 x 7 to ensure  
maximum system availability by providing intelligent event diagnosis, and automatic, secure submission of  
hardware event notifications to HP, which will initiate a fast and accurate resolution, based on your product’s  
service level. Notifications may be sent to your authorized HP Channel Partner for on-site service, if  
configured and available in your country. The software is available in two variants:  
HP Insight Remote Support Standard: This software supports server and storage devices and is  
optimized for environments with 1–50 servers. Ideal for customers who can benefit from proactive  
notification but do not need proactive service delivery and integration with a management platform.  
HP Insight Remote Support Advanced: This software provides comprehensive remote monitoring and  
proactive service support for nearly all HP servers, storage, network, and SAN environments, plus  
selected non-HP servers that have a support obligation with HP. It is integrated with HP Systems Insight  
Manager. A dedicated server is recommended to host both HP Systems Insight Manager and HP Insight  
Remote Support Advanced.  
Details for both versions are available on the HP website (http://www.hp.com/go/insightremotesupport).  
To download the software, go to Software Depot (http://www.software.hp.com).  
Select Insight Remote Support from the menu on the right.  
Diagnostic tools 83  
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USB support  
HP provides both standard USB 2.0 support and legacy USB 2.0 support. Standard support is provided by  
the OS through the appropriate USB device drivers. Before the OS loads, HP provides support for USB  
devices through legacy USB support, which is enabled by default in the system ROM.  
Legacy USB support provides USB functionality in environments where USB support is not available normally.  
Specifically, HP provides legacy USB functionality for the following:  
POST  
RBSU  
Diagnostics  
DOS  
Operating environments which do not provide native USB support  
Diagnostic tools 84  
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Component identification  
Front panel components  
SFF model  
Item  
Description  
Quick release levers (2)  
Systems Insight Display  
Hard drive bays  
1
2
3
4
5
6
SATA optical drive bay  
Video connector  
USB connectors (2)  
SFF model with optional hard drive cage  
Item  
Description  
Quick release levers (2)  
Systems Insight Display  
Hard drive bays  
1
2
3
4
5
Hard drive bays (optional)  
Video connector  
Component identification 85  
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Item  
Description  
USB connectors (2)  
6
LFF model  
Item  
Description  
Quick release levers (2)  
Systems Insight Display  
Hard drive bays  
1
2
3
4
5
USB connectors (2)  
Video connector  
Front panel LEDs and buttons  
Item  
Description  
Status  
UID LED and button  
Blue = Activated  
Flashing blue = System being remotely managed  
Off = Deactivated  
1
Component identification 86  
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Item  
Description  
Status  
System health LED  
Green = Normal  
Amber = System degraded.  
2
Red = System critical.  
To identify components in degraded or critical state, see "Systems  
Insight Display LEDs (on page 87)."  
Power On/Standby button  
and system power LED  
Green = System on  
Amber = System in standby, but power is still applied  
Off = Power cord not attached or power supply failure  
3
Systems Insight Display LEDs  
The HP Systems Insight Display LEDs represent the system board layout. The display enables diagnosis with  
the access panel installed.  
Component identification 87  
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Item  
Description  
Status  
NIC link/activity LED  
Green = Network link  
1
Flashing green = Network link and activity  
Off = No link to network. If the power is off,  
view the rear panel RJ-45 LEDs for status  
Power cap  
AMP status  
To determine Power cap status, see  
"Systems Insight Display LED combinations  
(on page 88)."  
2
3
Green = AMP mode enabled  
Amber = Failover  
Flashing amber = invalid configuration  
Off = AMP modes disabled  
All other LEDs  
Off = Normal  
Amber = Failure  
For detailed information on the activation  
of these LEDs, see "Systems Insight Display  
LED combinations (on page 88)."  
Systems Insight Display LED combinations  
When the health LED on the front panel illuminates either amber or red, the server is experiencing a health  
event. Combinations of illuminated Systems Insight Display LEDs, the system power LED, and the health LED  
indicate system status.  
Systems Insight Display Health LED  
LED and color  
System power  
LED  
Status  
Red  
Amber  
One or more of the following conditions may  
exist:  
Processor (amber)  
Processor in socket X has failed.  
Processor X is not installed in the socket.  
Processor X is unsupported.  
ROM detects a failed processor during  
POST  
Amber  
Green  
Processor in socket X is in a pre-failure  
condition.  
Processor (amber)  
Red  
Green  
Green  
Green  
One or more DIMMs have failed.  
DIMM (amber)  
Amber  
Amber  
DIMM in slot X is in a pre-failure condition.  
DIMM (amber)  
The Health Driver has detected a cautionary  
temperature level.  
Overtemperature (amber)  
Red  
Amber  
The server has detected a hardware critical  
temperature level.  
Overtemperature (amber)  
Amber  
Red  
Green  
Green  
One fan has failed or has been removed.  
Fan (amber)  
Fan (amber)  
Two or more fans have failed or been  
removed.  
Component identification 88  
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Systems Insight Display Health LED  
LED and color  
System power  
LED  
Status  
Red  
Amber  
Power supply (amber)  
Only one power supply is installed and  
that power supply is in standby.  
Power supply fault  
System board fault  
Amber  
Green  
Power supply (amber)  
Redundant power supply is installed and  
only one power supply is functional.  
AC power cord is not plugged into  
redundant power supply.  
Redundant power supply fault  
Power supply mismatch at POST or  
power supply mismatch through hot-plug  
addition.  
Amber  
Standby  
Power cap (off)  
Flashing green  
Amber  
Waiting for power  
Power cap has been exceeded  
Power cap (green)  
Power cap (flashing  
amber)  
Green  
Power is available  
Power cap (green)  
IMPORTANT: If more than one DIMM slot LED is illuminated, further troubleshooting is required.  
Test each bank of DIMMs by removing all other DIMMs. Isolate the failed DIMM by replacing  
each DIMM in a bank with a known working DIMM.  
Rear panel components  
Item Description  
PCI slot 5  
1
2
3
4
5
6
7
8
9
PCI slot 6  
PCI slot 4  
PCI slot 2  
PCI slot 3  
PCI slot 1  
Power supply bay 2  
Power supply bay 1 (populated)  
USB connectors (2)  
Component identification 89  
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Video connector  
NIC 1 connector  
NIC 2 connector  
Mouse connector  
Keyboard connector  
10  
11  
12  
13  
14  
Serial connector  
iLO 3 connector  
NIC 3 connector  
NIC 4 connector  
15  
16  
17  
18  
Rear panel LEDs and buttons  
Item Description  
Status  
Power supply LED Green = Normal  
Off = System is off or power supply has failed.  
Blue = Activated  
1
UID LED/button  
2
Flashing blue = System being managed remotely  
Off = Deactivated  
NIC/iLO 3 activity Green = Network activity  
3
4
LED  
Flashing green = Network activity  
Off = No network activity  
NIC/iLO 3 link LED Green = Network link  
Off = No network link  
Non-hot-plug PCI riser board slot definitions  
Component identification 90  
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Secondary  
(slot - form factor) (slot - form factor)  
Primary  
PCIe2 riser  
slot description slot description  
PCIe2 x16 riser  
PCIe2/PCI-X riser  
slot description  
1 - FL/FH  
PCIe2 x16 (8,4,1) PCIe2 x16  
(16,8,4,1)  
PCI-X 64 bit/133 MHz  
4 - FL/FH  
2 - HL/FH  
3 - HL/FH  
PCIe2 x8 (4,1)  
PCIe2 x16 (8,4,1)  
PCIe2 x8 (4,1)  
5 - LP  
6 - LP  
PCIe2 x8 (4,1)  
Notes:  
"Primary" denotes the risers are installed in the primary riser connector.  
"Secondary" denotes the risers are installed in the secondary riser connector.  
Installing the risers listed in the table above in either the primary or secondary riser connectors  
determines the form factor of the PCI cards supported by those risers.  
FL/FH denotes full-length, full-height. HL/FH denotes half-length, full-height. LP denotes low profile.  
The PCIe2 x16 riser supports a maximum power of 150 W with an HP power cable. This cable must be  
used for PCIe card wattages greater than 75 W.  
Component identification 91  
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System board  
System board components  
Item  
1
Description  
Processor 2 DIMM slots  
SAS power connector A  
SAS power connector B  
Front I/O connector  
SATA optical drive connector  
Internal USB connector  
System battery  
2
3
4
5
6
7
Power supply backplane connector  
NMI jumper  
8
9
System maintenance switch  
Processor socket 2  
10  
11  
12  
13  
14  
15  
Primary riser connector  
SD card slot  
TPM connector  
Processor socket 1 (populated)  
Component identification 92  
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Item  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
Description  
Processor 1 DIMM slots  
Secondary riser connector  
SAS connector A  
SAS connector B  
Cache module connector  
Fan connector 1  
Fan connector 2  
Fan connector 3  
Fan connector 4  
Fan connector 5  
Fan connector 6  
System maintenance switch  
Position  
Default  
Function  
Off  
Off = iLO 3 security is enabled.  
On = iLO 3 security is disabled.  
S1  
Off  
Off = System configuration can be  
changed.  
S2  
On = System configuration is locked.  
Off  
Off  
Off  
Reserved  
Reserved  
S3  
S4  
S5  
Off = Power-on password is enabled.  
On = Power-on password is disabled.  
Off  
Off = No function  
On = Clear NVRAM  
S6  
Reserved  
Reserved  
Reserved  
Reserved  
S7  
S8  
S9  
S10  
When the system maintenance switch position 6 is set to the On position, the system is prepared to erase all  
system configuration settings from both CMOS and NVRAM.  
CAUTION: Clearing CMOS and/or NVRAM deletes configuration information. Be sure to  
properly configure the server or data loss could occur.  
NMI functionality  
An NMI crash dump enables administrators to create crash dump files when a system is hung and not  
responding to traditional debug mechanisms.  
Component identification 93  
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Crash dump log analysis is an essential part of diagnosing reliability problems, such as hangs in operating  
systems, device drivers, and applications. Many crashes freeze a system, and the only available action for  
administrators is to cycle the system power. Resetting the system erases any information that could support  
problem analysis, but the NMI feature preserves that information by performing a memory dump before a  
hard reset.  
To force the OS to invoke the NMI handler and generate a crash dump log, the administrator can use the iLO  
Virtual NMI feature.  
For more information, see the white paper on the HP website  
DIMM slot locations  
DIMM slots are numbered sequentially (1 through 9) for each processor. The supported AMP modes use the  
letter assignments for population guidelines.  
Component identification 94  
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DIMM identification  
To determine DIMM characteristics, use the label attached to the DIMM and the following illustration and  
table.  
Item Description  
Definition  
Size  
1
2
Rank  
1R = Single-rank  
2R = Dual-rank  
4R = Quad-rank  
Data width  
x4 = 4-bit  
x8 = 8-bit  
3
4
Voltage rating  
L = Low voltage (1.35v)  
Blank or omitted = Standard  
Memory speed  
DIMM type  
10600 = 1333-MHz  
8500 = 1066-MHz  
5
6
R = RDIMM (registered)  
E = UDIMM (unbuffered with ECC)  
For the latest supported memory information, see the QuickSpecs on the HP website (http://www.hp.com).  
Component identification 95  
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SAS and SATA device numbers  
SFF device bay numbering  
Optional SFF device bay numbering  
LFF device bay numbering  
Component identification 96  
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SAS and SATA drive LEDs  
Item  
1
Description  
Fault/UID LED (amber/blue)  
Online LED (green)  
2
SAS and SATA drive LED combinations  
Online/activity Fault/UID LED  
Interpretation  
LED (green)  
(amber/blue)  
Alternating amber and The drive has failed, or a predictive failure alert has been  
On, off, or  
flashing  
blue  
received for this drive; it also has been selected by a management  
application.  
Steadily blue  
The drive is operating normally, and it has been selected by a  
management application.  
On, off, or  
flashing  
Amber, flashing  
regularly (1 Hz)  
A predictive failure alert has been received for this drive.  
Replace the drive as soon as possible.  
On  
Off  
The drive is online, but it is not active currently.  
On  
Amber, flashing  
regularly (1 Hz)  
Do not remove the drive. Removing a drive may terminate the  
current operation and cause data loss.  
The drive is part of an array that is undergoing capacity  
expansion or stripe migration, but a predictive failure alert has  
been received for this drive. To minimize the risk of data loss, do  
not replace the drive until the expansion or migration is complete.  
Flashing regularly  
(1 Hz)  
Off  
Do not remove the drive. Removing a drive may terminate the  
current operation and cause data loss.  
The drive is rebuilding, or it is part of an array that is undergoing  
capacity expansion or stripe migration.  
Flashing regularly  
(1 Hz)  
Amber, flashing  
regularly (1 Hz)  
The drive is active, but a predictive failure alert has been received  
for this drive. Replace the drive as soon as possible.  
Flashing  
irregularly  
Off  
The drive is active, and it is operating normally.  
Flashing  
irregularly  
Component identification 97  
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Online/activity Fault/UID LED  
Interpretation  
LED (green)  
(amber/blue)  
Steadily amber  
A critical fault condition has been identified for this drive, and the  
controller has placed it offline. Replace the drive as soon as  
possible.  
Off  
Amber, flashing  
regularly (1 Hz)  
A predictive failure alert has been received for this drive. Replace  
the drive as soon as possible.  
Off  
Off  
Off  
The drive is offline, a spare, or not configured as part of an array.  
PCI riser cage LEDs  
CAUTION: To prevent damage to the server or expansion boards, power down the server and  
remove all AC power cords before removing or installing the PCI riser cage.  
Status  
On = AC power is connected.  
Off = AC power is disconnected.  
Missing = Riser is not installed, or power might not be connected.  
Component identification 98  
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Battery pack LEDs  
Item  
Color  
Description  
Green  
System Power LED. This LED is on when the system is  
powered up and 12 V system power is available. This  
power supply is used to maintain the battery charge and  
provide supplementary power to the cache microcontroller.  
1
Green  
Auxiliary Power LED. This LED is on when 3.3V auxiliary  
voltage is detected. The auxiliary voltage is used to  
preserve BBWC data and is available any time that the  
system power cords are connected to a power supply.  
2
Amber  
Green  
Battery Health LED. To interpret the illumination patterns of  
this LED, see the following table.  
3
4
BBWC Status LED. To interpret the illumination patterns of  
this LED, see the following table.  
LED3 pattern  
LED4 pattern  
Interpretation  
Flashing (2 Hz)  
The system is powered down, and the cache contains data that has not  
yet been written to the drives. Restore system power as soon as  
possible to prevent data loss.  
Off  
Data preservation time is extended any time that 3.3 V auxiliary  
power is available, as indicated by LED 2. In the absence of auxiliary  
power, battery power alone preserves the data. A fully-charged  
battery can normally preserve data for at least 2 days.  
The battery lifetime also depends on the cache module size. For more  
information, see the controller QuickSpecs on the HP website  
Double flash, then The cache microcontroller is waiting for the host controller to  
pause communicate.  
Off  
Component identification 99  
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LED3 pattern  
LED4 pattern  
Interpretation  
Flashing (1 Hz)  
The battery pack is below the minimum charge level and is being  
charged. Features that require a battery (such as write cache, capacity  
expansion, stripe size migration, and RAID migration) are unavailable  
temporarily until charging is complete. The recharge process takes  
between 15 minutes and 2 hours, depending on the initial capacity of  
the battery.  
Off  
On  
The battery pack is fully charged, and posted write data is stored in the  
cache.  
Off  
Off  
The battery pack is fully charged, and no posted write data exists in  
the cache.  
Off  
Flashing (1 Hz)  
An alternating green and amber flashing pattern indicates that the  
cache microcontroller is executing from within its boot loader and  
receiving new flash code from the host controller.  
Flashing (1 Hz)  
A short circuit exists across the battery terminals or within the battery  
pack. BBWC features are disabled until the battery pack is replaced.  
The life expectancy of a battery pack is typically more than 3 years.  
On  
An open circuit exists across the battery terminals or within the battery  
pack. BBWC features are disabled until the battery pack is replaced.  
The life expectancy of a battery pack is typically more than 3 years.  
Flashing (1 Hz)  
FBWC module LEDs  
The FBWC module has two single-color LEDs (green and amber). The LEDs are duplicated on the reverse side  
of the cache module to facilitate status viewing.  
1 Green LED  
2 Amber LED  
Interpretation  
On  
On  
Off  
Off  
A backup is in progress.  
Off  
A restore is in progress.  
Flashing (1 Hz)  
Flashing (1 Hz)  
On  
The capacitor pack is charging.  
The capacitor pack has completed charging.  
One of the following conditions exists:  
Flashing (2 Hz)  
Alternating with  
green LED  
Flashing (2 Hz)  
Alternating with  
amber LED  
The charging process has timed out.  
The capacitor pack is not connected.  
On  
The flash code image failed to load.  
On  
Component identification 100  
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1 Green LED  
2 Amber LED  
Interpretation  
Off  
The flash code is corrupt.  
Off  
Hot-plug fans  
CAUTION: To avoid damage to server components, fan blanks must be installed in fan bays 5  
and 6 in a single-processor configuration.  
The only two valid fan configurations are listed in the following table.  
Configuration  
Fan bay 1 Fan bay 2 Fan bay 3 Fan bay 4 Fan bay 5 Fan bay 6  
Fan  
Fan  
Fan  
Fan  
Fan  
Fan  
Fan  
Fan  
Fan blank  
Fan  
Fan blank  
Fan  
1 processor  
2 processors  
For a single-processor configuration, four fans and two blanks are required in specific fan bays for  
redundancy. A fan failure or missing fan causes all fans to spin at high speed. A second fan failure or missing  
fan causes an orderly shutdown of the server.  
Installing more than the required number of fans in a single-processor configuration is not a supported  
configuration.  
For a dual-processor configuration, six fans are required for redundancy. A fan failure or missing fan causes  
all fans to spin at high speed. A second fan failure or missing fan causes an orderly shutdown of the server.  
The server supports variable fan speeds. The fans operate at minimum speed until a temperature change  
requires a fan speed increase to cool the server. The server shuts down during the following  
temperature-related scenarios:  
At POST and in the OS, iLO 3 performs an orderly shutdown if a cautionary temperature level is  
detected. If the server hardware detects a critical temperature level before an orderly shutdown occurs,  
the server performs an immediate shutdown.  
When the Thermal Shutdown feature is disabled in RBSU, iLO 3 does not perform an orderly shutdown  
when a cautionary temperature level is detected. Disabling this feature does not disable the server  
hardware from performing an immediate shutdown when a critical temperature level is detected.  
Component identification 101  
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CAUTION: A thermal event can damage server components when the Thermal Shutdown feature  
is disabled in RBSU.  
Component identification 102  
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Specifications  
Environmental specifications  
Specification  
Value  
Temperature range*  
Operating  
10°C to 35°C (50°F to 95°F)  
-30°C to 50°C (-22°F to 122°F)  
-30°C to 60°C (-22°F to 140°F)  
28°C (82.4°F)  
Shipping  
Storage  
Maximum wet bulb  
temperature  
Relative humidity  
(noncondensing)**  
10% to 90%  
5% to 95%  
Operating  
Non-operating  
* All temperature ratings shown are for sea level. An altitude derating of 1°C per 300 m (1.8°F per 1,000 ft) to 3048  
m (10,000 ft) is applicable. No direct sunlight allowed.  
** Storage maximum humidity of 95% is based on a maximum temperature of 45°C (113°F). Altitude maximum for  
storage corresponds to a pressure minimum of 70 KPa.  
Mechanical specifications  
Specification  
Dimensions  
Value  
8.59 cm (3.38 in)  
66.07 cm (26.01 in)  
44.54 cm (17.54 in)  
27.2 kg (60.0 lb)  
20.4 kg (47.2 lb)  
Height  
Depth  
Width  
Weight (maximum)  
Weight (no drives installed)  
Power supply specifications  
Depending on installed options, the server is configured with one of the following power supplies:  
HP ProLiant 1200 W Power Supply  
Specification  
Value  
Input requirements  
100 to 120 VAC, 200 to  
240 VAC  
Rated input voltage  
50 Hz to 60 Hz  
Rated input frequency  
Specifications 103  
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10 A at 100 VAC  
4.9 A at 200 VAC  
Rated input current  
Rated input power  
BTUs per hour  
930 W at 100V AC input  
1348 W at 200V AC input  
3530 at 120V AC input  
4600 at 200V to 240V AC input  
Power supply output  
800 W at 100V AC input  
900 W at 120V AC input  
1200 W at 200V to 240V AC  
input  
Rated steady-state power  
800 W at 100V AC input  
900 W at 120V AC input  
1200 W at 200V to 240V AC  
input  
Maximum peak power  
HP ProLiant 750 W Power Supply  
Specification  
Value  
Input requirements  
100 to 120 VAC, 200 to  
240 VAC  
Rated input voltage  
50 Hz to 60 Hz  
Rated input frequency  
Rated input current  
8.9 A at 100 VAC  
4.3 A at 200 VAC  
857 W at 100V AC input  
824 W at 200V AC input  
Rated input power  
BTUs per hour  
2925 at 100V AC input  
2812 at 200V AC input  
Power supply output  
750 W at 100V to 120V AC input  
750 W at 200V to 240V AC input  
Rated steady-state power  
750 W at 100V to 120V AC input  
750 W at 200V to 240V AC input  
Maximum peak power  
HP ProLiant 460 W Power Supply  
Specification  
Value  
Input requirements  
100 to 120 VAC, 200 to  
240 VAC  
Rated input voltage  
50 Hz to 60 Hz  
Rated input frequency  
Rated input current  
5.5 A at 100 VAC  
2.6 A at 200 VAC  
526 W at 100V AC input  
505 W at 200V AC input  
Rated input power  
BTUs per hour  
1794 at 100V AC input  
1725 at 200V AC input  
Power supply output  
Specifications 104  
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460 W at 100V to 120V AC input  
460 W at 200V to 240V AC input  
Rated steady-state power  
Maximum peak power  
460 W at 100V to 120V AC input  
460 W at 200V to 240V AC input  
Hot-plug power supply calculations  
For hot-plug power supply specifications and calculators to determine electrical and heat loading for the  
server, refer to the HP Enterprise Configurator website (http://h30099.www3.hp.com/configurator/).  
Specifications 105  
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Acronyms and abbreviations  
ASR  
Automatic Server Recovery  
BBWC  
battery-backed write cache  
DDR  
double data rate  
FBWC  
flash-backed write cache  
iLO  
Integrated Lights-Out  
IML  
Integrated Management Log  
NMI  
nonmaskable interrupt  
NVRAM  
nonvolatile memory  
PCIe  
peripheral component interconnect express  
PCI-X  
peripheral component interconnect extended  
POST  
Power-On Self Test  
RBSU  
ROM-Based Setup Utility  
Acronyms and abbreviations 106  
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SAS  
serial attached SCSI  
SATA  
serial ATA  
TPM  
Trusted Platform Module  
UID  
unit identification  
USB  
universal serial bus  
Acronyms and abbreviations 107  
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Documentation feedback  
HP is committed to providing documentation that meets your needs. To help us improve the documentation,  
send any errors, suggestions, or comments to Documentation Feedback (mailto:[email protected]).  
Include the document title and part number, version number, or the URL when submitting your feedback.  
Documentation feedback 108  
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Index  
environmental specifications 103  
expansion boards 55  
expansion slot covers 47, 53  
expansion slot covers, removing 47, 53  
expansion slots 53  
A
access panel 30  
air baffle 31  
extending server from rack 26  
B
F
battery 69  
battery cabling for BBWC 81  
battery pack LEDs 99  
battery-backed write cache (BBWC) 48, 50, 99  
battery-backed write cache battery pack 48  
BBWC cabling 81  
bezel, front 44, 45  
blue screen event 93  
fan cage 46  
fans 39  
FBWC cabling 81  
FBWC capacitor cabling 81  
FBWC module LEDs 100  
features 85  
flash-backed write cache capacitor pack 52  
flash-backed write cache module 51  
flash-backed write cache procedures 51  
front panel buttons 86  
buttons 85  
C
front panel components 85  
full-length expansion board 56  
cable management arm 27, 28  
cables 80  
cabling 80  
cabling, BBWC 81  
cache module 49  
H
half-length expansion board 55  
hard drive backplane 40, 42  
hard drive bays 85  
hard drive blanks 33  
hard drive cage 41, 43  
hard drive LEDs 97  
hard drives, determining status of 97  
health LEDs 86  
heatsink 57  
HP Insight Diagnostics 82  
HP Insight Remote Support software 83  
cache module, removing 49  
cautions 29  
components 16, 25, 85  
components, identification 16, 85  
components, system board 93  
connectors 85  
crash dump analysis 93  
CSR (customer self repair) 6  
customer self repair (CSR) 6  
D
I
diagnostic tools 82  
diagnostics utility 82  
DIMMs 68, 94  
drive LEDs 97  
illustrated parts catalog 16  
IML (Integrated Management Log) 83  
Insight Diagnostics 82  
Integrated Management Log (IML) 83  
drives 33, 97  
E
L
electrostatic discharge 29  
Index 109  
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LEDs, battery pack 99  
LEDs, hard drive 97  
LEDs, SAS hard drive 97  
S
safety considerations 29  
SAS and SATA device numbers 96  
SAS drive numbers 97  
LEDs, troubleshooting 98  
SAS hard drive LEDs 97  
SD card slot 92  
spare part numbers 16  
M
management tools 82  
mechanical components 16  
mechanical specifications 103  
memory 95  
specifications 103  
specifications, environmental 103  
specifications, mechanical 103  
specifications, power 103  
specifications, server 103  
static electricity 29  
status lights, battery pack 99  
switches 70, 93  
memory dump 93  
N
NIC connectors 89  
NMI header 93  
system battery 69  
system board components 92  
system board replacement 71, 92  
system components 85  
system maintenance switch 70, 93  
system power LED 86, 99  
Systems Insight Display LEDs 87, 88  
O
operating system crash 93  
optical drive 36, 85  
optical drive cage 37  
P
T
part numbers 16  
telco racks 27  
PCI expansion slots 90  
tool, processor 57, 60, 71  
tools 25  
troubleshooting 82  
Trusted Platform Module (TPM) 30  
PCI riser cage 32  
power LEDs, system 99  
power requirements 105  
power supply 35, 105  
power supply backplane 38  
power supply blank 34  
power supply cage assembly 59  
power supply LEDs 90  
power supply specifications 103  
powering down 25  
U
UID LED 93  
USB connectors 85  
USB support 84  
utilities 82  
preparation procedures 25  
processor tool 57, 60, 71  
processors 60  
V
video connector 85  
R
W
rear panel buttons 90  
rear panel components 89  
rear panel LEDs 90  
warnings 29  
rear panel, accessing 27  
removal and replacement procedures 25  
removing server from rack 27  
removing the access panel 30  
removing the battery pack 49  
Index 110  
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