Freescale Semiconductor Microscope Magnifier MC9S12XDP512 User Manual |
MC9S12XDP512
Data Sheet
HCS12X
Microcontrollers
MC9S12XDP512
Rev. 2.11
5/2005
freescale.com
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MC9S12XDP512 Data Sheet
covers
MC9S12XDT384 & MC9S12XA512
MC9S12XDP512V2
Rev. 2.11
7/2005
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To provide the most up-to-date information, the revision of our documents on the World Wide Web will be
the most current. Your printed copy may be an earlier revision. To verify you have the latest information
available, refer to:
http://freescale.com/
The following revision history table summarizes changes contained in this document.
Revision History
Revision
Date
Description
Level
02.07
02.08
April, 2005
May, 2005
New Book
Minor corrections
removed ESD Machine Model from electrical characteristics
added thermal characteristics
added more details to run current measurement configurations
VDDA supply voltage range 3.15V - 3.6V fot ATD Operating Characteristics
I/O Chararcteristics for alll pins except EXTAL, XTAL ....
corrected VREG electrical spec
May, 2005
02.09
IDD wait max 95mA
May 2005
July 2005
02.10
02.11
Improvements to NVM reliabity spec, added part numbers
Added ROM parts to App.
Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc.
This product incorporates SuperFlash® technology licensed from SST.
© Freescale Semiconductor, Inc., 2005. All rights reserved.
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Contents
Chapter 13 Inter-Integrated Circuit (MC9S12XDP512) Block Description . .
Chapter 14 Freescale’s Scalable Controller Area Network (S12MSCANV3).
Chapter 22 External Bus Interface (S12XEBIV2) . . . . . . . . . . . . . . . . . . .861
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Appendix D Derivative Differences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .974
Appendix E Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .981
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Contents
Section Number
Title
Page
Chapter 1
1.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
1.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
1.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
1.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
1.1.4 Device Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
1.1.5 Address Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
1.1.6 Detailed Register Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
1.1.7 Part ID Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
1.2 Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
1.2.1 Device Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
1.2.2 Signal Properties Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
1.2.3 Detailed Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
1.2.4 Power Supply Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
1.3 System Clock Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
1.4 Chip Configuration Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
1.5 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
1.5.1 User Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
1.5.2 Low-Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
1.5.3 Freeze Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
1.6 Resets and Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
1.6.1 Vectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
1.6.2 Effects of Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
1.7 COP Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
1.8 ATD0 External Trigger Input Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
1.9 ATD1 External Trigger Input Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
Chapter 2
2.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
2.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
2.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
2.1.3 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
2.1.4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
2.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
2.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
2.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
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2.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
2.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
2.4.1 Flash Command Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
2.4.2 Flash Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
2.4.3 Illegal Flash Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140
2.5 Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
2.5.1 Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
2.5.2 Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
2.5.3 Background Debug Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
2.6 Flash Module Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
2.6.1 Unsecuring the MCU using Backdoor Key Access . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142
2.6.2 Unsecuring the MCU in Special Single Chip Mode using BDM . . . . . . . . . . . . . . . . . 143
2.7 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143
2.7.1 Flash Reset Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143
2.7.2 Reset While Flash Command Active . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143
2.8 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143
2.8.1 Description of Flash Interrupt Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144
Chapter 3
3.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145
3.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145
3.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145
3.1.3 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145
3.1.4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146
3.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146
3.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146
3.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146
3.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148
3.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156
3.4.1 EEPROM Command Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156
3.4.2 EEPROM Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159
3.4.3 Illegal EEPROM Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173
3.5 Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174
3.5.1 Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174
3.5.2 Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174
3.5.3 Background Debug Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174
3.6 EEPROM Module Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174
3.6.1 Unsecuring the MCU in Special Single Chip Mode using BDM . . . . . . . . . . . . . . . . . 175
3.7 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175
3.7.1 EEPROM Reset Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175
3.7.2 Reset While EEPROM Command Active . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175
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3.8 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175
3.8.1 Description of EEPROM Interrupt Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 176
Chapter 4
4.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177
4.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 178
4.1.2 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 178
4.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180
4.2.1 Signal Properties . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180
4.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 187
4.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 187
4.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 190
4.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260
4.4.1 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260
4.4.2 Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 262
4.4.3 Pin Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 266
4.4.4 Expanded Bus Pin Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 267
4.4.5 Low-Power Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 268
4.5 Initialization and Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 268
Chapter 5
5.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 271
5.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 271
5.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 272
5.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 273
5.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 274
5.2.1 V
and V
— Operating and Ground Voltage Pins . . . . . . . . . . . . . . . . . . . . 274
DDPLL
SSPLL
5.2.2 XFC — External Loop Filter Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 274
5.2.3 RESET — Reset Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 274
5.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 274
5.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 275
5.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 276
5.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 290
5.4.1 Functional Blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 290
5.4.2 Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 295
5.4.3 Low Power Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 296
5.5 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 305
5.5.1 Description of Reset Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 305
5.5.2 Clock Monitor Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 307
5.5.3 Computer Operating Properly Watchdog (COP) Reset . . . . . . . . . . . . . . . . . . . . . . . . . 307
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5.5.4 Power On Reset, Low Voltage Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 307
5.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 308
5.6.1 Real Time Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 308
5.6.2 PLL Lock Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 309
5.6.3 Self Clock Mode Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 309
Chapter 6
6.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 311
6.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 311
6.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 311
6.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 312
6.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 312
6.2.2 EXTAL and XTAL — Input and Output Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 312
6.2.3 XCLKS — Input Signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 314
6.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 314
6.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 314
6.4.1 Gain Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 314
6.4.2 Clock Monitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 314
6.4.3 Wait Mode Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 315
6.4.4 Stop Mode Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 315
Chapter 7
7.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 317
7.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 317
7.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 317
7.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 317
7.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 319
7.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 319
7.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 319
7.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 321
7.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 342
7.4.1 Analog Sub-block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 342
7.4.2 Digital Sub-Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 343
7.4.3 Operation in Low Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 344
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7.5 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 345
7.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 345
Chapter 8
8.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 347
8.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 347
8.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 347
8.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 348
8.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 348
8.2.1 ANx (x = 7, 6, 5, 4, 3, 2, 1, 0) — Analog Input Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . 348
8.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 350
8.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 350
8.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 350
8.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 369
8.4.1 Analog Sub-Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 369
8.4.2 Digital Sub-Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 370
8.5 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 372
8.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 372
Chapter 9
9.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 373
9.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 373
9.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 374
9.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 374
9.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 374
9.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 375
9.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 375
9.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 376
9.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 392
9.4.1 XGATE RISC Core . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 392
9.4.2 Programmer’s Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 393
9.4.3 Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 393
9.4.4 Semaphores . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 394
9.4.5 Software Error Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 396
9.5 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 397
9.5.1 Incoming Interrupt Requests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 397
9.5.2 Outgoing Interrupt Requests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 397
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9.6 Debug Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 397
9.6.1 Debug Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 397
9.6.2 Entering Debug Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 398
9.6.3 Leaving Debug Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 399
9.7 Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 399
9.8 Instruction Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 399
9.8.1 Addressing Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 399
9.8.2 Instruction Summary and Usage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 403
9.8.3 Cycle Notation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 406
9.8.4 Thread Execution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 406
9.8.5 Instruction Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 406
9.8.6 Instruction Coding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 479
9.9 Initialization and Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 482
9.9.1 Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 482
9.9.2 Code Example (Transmit "Hello World!" on SCI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 482
Chapter 10
10.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 499
10.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 499
10.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500
10.1.3 Securing the Microcontroller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500
10.1.4 Operation of the Secured Microcontroller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 501
10.1.5 Unsecuring the Microcontroller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 503
10.1.6 Reprogramming the Security Bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 504
10.1.7 Complete Memory Erase (Special Modes) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 504
Chapter 11
11.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 507
11.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 507
11.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 507
11.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 508
11.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 509
11.2.1 IOC7 — Input Capture and Output Compare Channel 7 . . . . . . . . . . . . . . . . . . . . . . . . 509
11.2.2 IOC6 — Input Capture and Output Compare Channel 6 . . . . . . . . . . . . . . . . . . . . . . . . 509
11.2.3 IOC5 — Input Capture and Output Compare Channel 5 . . . . . . . . . . . . . . . . . . . . . . . . 509
11.2.4 IOC4 — Input Capture and Output Compare Channel 4 . . . . . . . . . . . . . . . . . . . . . . . . 509
11.2.5 IOC3 — Input Capture and Output Compare Channel 3 . . . . . . . . . . . . . . . . . . . . . . . . 509
11.2.6 IOC2 — Input Capture and Output Compare Channel 2 . . . . . . . . . . . . . . . . . . . . . . . . 509
11.2.7 IOC1 — Input Capture and Output Compare Channel 1 . . . . . . . . . . . . . . . . . . . . . . . . 509
11.2.8 IOC0 — Input Capture and Output Compare Channel 0 . . . . . . . . . . . . . . . . . . . . . . . . 509
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11.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 510
11.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 510
11.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 512
11.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 548
11.4.1 Enhanced Capture Timer Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 555
11.4.2 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 558
11.4.3 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 559
Chapter 12
12.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 561
12.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 561
12.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 561
12.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 562
12.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 562
12.2.1 PWM7 — PWM Channel 7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 562
12.2.2 PWM6 — PWM Channel 6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 562
12.2.3 PWM5 — PWM Channel 5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 563
12.2.4 PWM4 — PWM Channel 4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 563
12.2.5 PWM3 — PWM Channel 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 563
12.2.6 PWM3 — PWM Channel 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 563
12.2.7 PWM3 — PWM Channel 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 563
12.2.8 PWM3 — PWM Channel 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 563
12.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 563
12.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 563
12.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 564
12.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 579
12.4.1 PWM Clock Select . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 579
12.4.2 PWM Channel Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 582
12.5 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 590
12.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 591
Chapter 13
13.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 593
13.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 593
13.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 594
13.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 594
13.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 595
13.2.1 IIC_SCL — Serial Clock Line Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 595
13.2.2 IIC_SDA — Serial Data Line Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 595
13.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 595
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13.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 595
13.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 596
13.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 607
13.4.1 I-Bus Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 607
13.4.2 Operation in Run Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 611
13.4.3 Operation in Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 611
13.4.4 Operation in Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 611
13.5 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 611
13.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 611
13.7 Initialization/Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 612
13.7.1 IIC Programming Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 612
Chapter 14
14.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 617
14.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 617
14.1.2 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 618
14.1.3 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 618
14.1.4 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 619
14.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 619
14.2.1 RXCAN — CAN Receiver Input Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 619
14.2.2 TXCAN — CAN Transmitter Output Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 619
14.2.3 CAN System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 619
14.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 620
14.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 620
14.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 622
14.3.3 Programmer’s Model of Message Storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 644
14.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 653
14.4.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 653
14.4.2 Message Storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 654
14.4.3 Identifier Acceptance Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 657
14.4.4 Timer Link . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 663
14.4.5 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 664
14.4.6 Low-Power Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 664
14.4.7 Reset Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 669
14.4.8 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 669
14.5 Initialization/Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 671
14.5.1 MSCAN initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 671
14.5.2 Bus-Off Recovery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 672
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Section Number
Title
Page
Chapter 15
15.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 673
15.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 673
15.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 674
15.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 674
15.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 675
15.2.1 TXD — Transmit Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 675
15.2.2 RXD — Receive Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 675
15.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 675
15.3.1 Module Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 675
15.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 676
15.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 688
15.4.1 Infrared Interface Submodule . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 689
15.4.2 LIN Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 689
15.4.3 Data Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 690
15.4.4 Baud Rate Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 691
15.4.5 Transmitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 692
15.4.6 Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 697
15.4.7 Single-Wire Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 705
15.4.8 Loop Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 706
15.5 Initialization/Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 706
15.5.1 Reset Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 706
15.5.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 706
15.5.3 Interrupt Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 707
15.5.4 Recovery from Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 709
15.5.5 Recovery from Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 709
Chapter 16
16.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 711
16.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 711
16.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 711
16.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 712
16.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 713
16.2.1 MOSI — Master Out/Slave In Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 713
16.2.2 MISO — Master In/Slave Out Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 713
16.2.3 SS — Slave Select Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 713
16.2.4 SCK — Serial Clock Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 713
16.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 713
16.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 713
16.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 714
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16.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 723
16.4.1 Master Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 724
16.4.2 Slave Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 725
16.4.3 Transmission Formats . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 726
16.4.4 SPI Baud Rate Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 730
16.4.5 Special Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 730
16.4.6 Error Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 732
16.4.7 Low Power Mode Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 732
Chapter 17
17.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 735
17.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 735
17.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 735
17.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 736
17.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 737
17.2.1 VDDR — Regulator Power Input Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 737
17.2.2 VDDA, VSSA — Regulator Reference Supply Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . 737
17.2.3 VDD, VSS — Regulator Output1 (Core Logic) Pins . . . . . . . . . . . . . . . . . . . . . . . . . . 737
17.2.4 VDDPLL, VSSPLL — Regulator Output2 (PLL) Pins . . . . . . . . . . . . . . . . . . . . . . . . . 738
Optional Regulator Enable Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 738
17.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 738
17.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 738
17.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 739
17.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 744
17.4.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 744
17.4.2 Regulator Core (REG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 744
17.4.3 Low-Voltage Detect (LVD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 745
17.4.4 Power-On Reset (POR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 745
17.4.5 Low-Voltage Reset (LVR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 745
17.4.6 Regulator Control (CTRL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 745
17.4.7 Autonomous Periodical Interrupt (API) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 745
17.4.8 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 746
17.4.9 Description of Reset Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 746
17.4.10Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 746
Chapter 18
18.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 749
18.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 749
18.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 749
18.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 750
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18.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 750
18.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 751
18.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 751
18.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 752
18.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 761
18.4.1 Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 761
18.4.2 Interrupt Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 762
18.4.3 Hardware Trigger . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 763
18.5 Initialization/Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 763
18.5.1 Startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 763
18.5.2 Shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 763
18.5.3 Flag Clearing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 763
Chapter 19
19.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 765
19.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 765
19.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 766
19.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 767
19.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 768
19.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 768
19.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 768
19.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 769
19.3.3 Family ID Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 773
19.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 774
19.4.1 Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 774
19.4.2 Enabling and Activating BDM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 774
19.4.3 BDM Hardware Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 775
19.4.4 Standard BDM Firmware Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 776
19.4.5 BDM Command Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 778
19.4.6 BDM Serial Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 780
19.4.7 Serial Interface Hardware Handshake Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 782
19.4.8 Hardware Handshake Abort Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 784
19.4.9 SYNC — Request Timed Reference Pulse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 787
19.4.10Instruction Tracing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 788
19.4.11Serial Communication Time Out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 789
Chapter 20
20.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 791
20.1.1 Glossary of Terms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 791
20.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 792
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20.1.3 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 792
20.1.4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 793
20.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 793
20.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 795
20.3.1 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 795
20.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 812
20.4.1 DBG Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 812
20.4.2 Comparator Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 813
20.4.3 Trigger Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 816
20.4.4 State Sequence Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 818
20.4.5 Trace Buffer Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 819
20.4.6 Tagging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 826
20.4.7 Breakpoints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 827
Chapter 21
21.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 843
21.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 844
21.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 844
21.1.3 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 844
21.1.4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 846
21.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 847
21.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 847
21.3.1 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 848
21.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 855
21.4.1 S12X Exception Requests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 855
21.4.2 Interrupt Prioritization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 855
21.4.3 XGATE Requests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 856
21.4.4 Priority Decoders . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 856
21.4.5 Reset Exception Requests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 857
21.4.6 Exception Priority . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 857
21.5 Initialization/Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 858
21.5.1 Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 858
21.5.2 Interrupt Nesting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 858
21.5.3 Wake Up from Stop or Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 859
Chapter 22
22.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 861
22.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 861
22.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 861
22.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 862
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22.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 862
22.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 864
22.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 864
22.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 864
22.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 868
22.4.1 Operating Modes and External Bus Properties . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 868
22.4.2 Internal Visibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 869
22.4.3 Accesses to Port Replacement Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 872
22.4.4 Stretched External Bus Accesses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 872
22.4.5 Data Select and Data Direction Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 873
22.4.6 Low-Power Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 875
22.5 Initialization/Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 875
22.5.1 Normal Expanded Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 876
22.5.2 Emulation Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 877
Chapter 23
23.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 881
23.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 881
23.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 881
23.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 882
23.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 882
23.3 Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 884
23.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 884
23.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 885
23.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 898
23.4.1 MCU Operating Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 898
23.4.2 Memory Map Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 899
23.4.3 Chip Access Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 908
23.4.4 Chip Bus Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 910
23.4.5 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 911
23.5 Initialization/Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 911
23.5.1 CALL and RTC Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 911
23.5.2 Port Replacement Registers (PRRs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 912
23.5.3 On-Chip ROM Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 914
Appendix A
A.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 919
A.1.2 Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 919
A.1.3 Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 920
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A.1.6 ESD Protection and Latch-up Immunity. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 922
A.1.7 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 923
A.2 ATD Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 932
A.2.1 ATD Operating Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 932
A.2.3 ATD Accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 935
A.3 NVM, Flash, and EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 938
A.4 Voltage Regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 943
A.5 Reset, Oscillator, and PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 944
A.6 MSCAN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 950
A.7 SPI Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 950
A.8 External Bus Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 954
A.8.2 Normal Expanded Mode (External Wait Feature Enabled) . . . . . . . . . . . . . . . . . . . . . . . 956
A.8.4 Emulation Expanded Mode (With Optional Access Stretching) . . . . . . . . . . . . . . . . . . . 961
A.8.5 External Tag Trigger Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 964
Appendix B
B.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 965
B.2 144-Pin LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 966
B.3 112-Pin LQFP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 967
B.4 80-Pin QFP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 968
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Section Number
Title
Page
Appendix C
Recommended PCB Layout
Appendix D
D.1 Memory Sizes and Package Options S12XD - Family . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 974
D.2 Memory Sizes and Package Options S12XA - Family . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 976
D.3 MC9S12XD-Family Flash Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 977
D.4 Peripheral Sets S12XD - Family . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 978
D.5 Peripheral Sets S12XA - Family . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 979
D.6 Pinout explanations: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 980
Ordering Information
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
21
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Section Number
Title
Page
MC9S12XDP512 Data Sheet, Rev. 2.11
22
Freescale Semiconductor
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Chapter 1
Device Overview (MC9S12XDP512V2)
1.1
Introduction
The MC9S12XD family will retain the low cost, power consumption, EMC and code-size efficiency
advantages currently enjoyed by users of Freescale's existing 16-Bit MC9S12 MCU Family.
Based around an enhanced S12 core, the MC9S12XD-Family will deliver 2 to 5 times the performance of
a 25-MHz S12 whilst retaining a high degree of pin and code compatibility with the S12.
The MC9S12XD-Family introduces the performance boosting XGATE module. Using enhanced DMA
functionality, this parallel processing module offloads the CPU by providing high-speed data processing
and transfer between peripheral modules, RAM, and I/O ports. Providing up to 80 MIPS of performance
additional to the CPU, the XGATE can access all peripherals and the RAM block.
The MC9S12XDP512 is composed of standard on-chip peripherals including 512 Kbytes of Flash
EEPROM, 32 Kbytes of RAM, 4 Kbytes of EEPROM, six asynchronous serial communications interfaces
(SCI), three serial peripheral interfaces (SPI), an 8-channel IC/OC enhanced capture timer, an 8-channel,
10-bit analog-to-digital converter, a 16-channel, 10-bit analog-to-digital converter, an 8-channel
pulse-width modulator (PWM), five CAN 2.0 A, B software compatible modules (MSCAN12), two
inter-IC bus blocks, and a periodic interrupt timer. The MC9S12XDP512 has full 16-bit data paths
throughout. The non-multiplexed expanded bus interface available on the 144-pin versions allows an easy
interface to external memories.
The inclusion of a PLL circuit allows power consumption and performance to be adjusted to suit
operational requirements. System power consumption can be further improved with the new “fast exit from
stop mode” feature.
In addition to the I/O ports available in each module, up to 25 further I/O ports are available with interrupt
capability allowing wake-up from stop or wait mode.
The MC9S12XDP512 will be available in 144-pin LQFP with external bus interface and in 112-pin LQFP
or 80-pin QFP package without external bus interface.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
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Chapter 1 Device Overview (MC9S12XDP512V2)
1.1.1
Features
•
HCS12X Core
— 16-bit HCS12X CPU
– Upward compatible with MC9S12 instruction set
– Interrupt stacking and programmer’s model identical to MC9S12
– Instruction queue
– Enhanced indexed addressing
– Enhanced instruction set
— EBI (external bus interface)
— MMC (module mapping control)
— INT (interrupt controller)
— DBG (debug module to monitor HCS12X CPU and XGATE bus activity)
— BDM (background debug mode)
XGATE (peripheral coprocessor)
•
— Parallel processing module off loads the CPU by providing high-speed data processing and
transfer
— Data transfer between Flash EEPROM, RAM, peripheral modules, and I/O ports
PIT (periodic interrupt timer)
•
•
— Four timers with independent time-out periods
24
— Time-out periods selectable between 1 and 2 bus clock cycles
CRG (clock and reset generator)
— Low noise/low power Pierce oscillator
— PLL
— COP watchdog
— Real time interrupt
— Clock monitor
— Fast wake-up from stop mode
8-bit ports with interrupt functionality
— Digital filtering
— Programmable rising or falling edge trigger
Memory
•
•
— 512-Kbyte Flash EEPROM
— 4-Kbyte EEPROM
— 32-Kbyte RAM
•
One 8-channel and one 16-channel ADC (analog-to-digital converter)
— 10-bit resolution
— External conversion trigger capability
MC9S12XDP512 Data Sheet, Rev. 2.11
24
Freescale Semiconductor
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Chapter 1 Device Overview (MC9S12XDP512V2)
•
Five 1 M bit per second, CAN 2.0 A, B software compatible modules
— Five receive and three transmit buffers
— Flexible identifier filter programmable as 2 x 32 bit, 4 x 16 bit, or 8 x 8 bit
— Four separate interrupt channels for Rx, Tx, error, and wake-up
— Low-pass filter wake-up function
— Loop-back for self-test operation
•
•
ECT (enhanced capture timer)
— 16-bit main counter with 7-bit prescaler
— 8 programmable input capture or output compare channels
— Four 8-bit or two 16-bit pulse accumulators
8 PWM (pulse-width modulator) channels
— Programmable period and duty cycle
— 8-bit 8-channel or 16-bit 4-channel
— Separate control for each pulse width and duty cycle
— Center-aligned or left-aligned outputs
— Programmable clock select logic with a wide range of frequencies
— Fast emergency shutdown input
— Usable as interrupt inputs
•
•
Serial interfaces
— Six asynchronous serial communication interfaces (SCI) with additional LIN support and
selectable IrDA 1.4 return-to-zero-inverted (RZI) format with programmable pulse width
— Three Synchronous Serial Peripheral Interfaces (SPI)
Two IIC (Inter-IC bus) Modules
— Compatible with IIC bus standard
— Multi-master operation
— Software programmable for one of 256 different serial clock frequencies
On-Chip Voltage Regulator
— Two parallel, linear voltage regulators with bandgap reference
— Low-voltage detect (LVD) with low-voltage interrupt (LVI)
— Power-on reset (POR) circuit
— 3.3-V–5.5-V operation
— Low-voltage reset (LVR)
— Ultra low-power wake-up timer
•
•
144 -pin LQFP, 112-pin LQFP, and 80-pin QFP packages
— I/O lines with 5-V input and drive capability
— Input threshold on external bus interface inputs switchable for 3.3-V or 5-V operation
— 5-V A/D converter inputs
— Operation at 80 MHz equivalent to 40-MHz bus speed
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
25
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Chapter 1 Device Overview (MC9S12XDP512V2)
•
Development support
— Single-wire background debug™ mode (BDM)
— Four on-chip hardware breakpoints
1.1.2
Modes of Operation
User modes:
•
Normal and emulation operating modes
— Normal single-chip mode
— Normal expanded mode
— Emulation of single-chip mode
— Emulation of expanded mode
•
Special Operating Modes
— Special single-chip mode with active background debug mode
— Special test mode (Freescale use only)
Low-power modes:
•
System stop modes
— Pseudo stop mode
— Full stop mode
System wait mode
•
1.1.3
Block Diagram
Figure 1-1 shows a block diagram of the MC9S12XDP512 device.
MC9S12XDP512 Data Sheet, Rev. 2.11
26
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Chapter 1 Device Overview (MC9S12XDP512V2)
V
V
V
V
V
DDA
V
V
V
V
RH
RH
RH
512/384/256/128/64-Kbyte Flash
32/20/16/14/10/8/4-Kbyte RAM
4/2/1-Kbyte EEPROM
ATD0
ATD1
AN8
AN9
AN10
AN11
AN12
AN13
AN14
AN15
AN16
AN17
AN18
AN19
AN20
AN21
AN22
AN23
RL
RL
RL
V
DDA
DDA
SSA
V
V
SSA
SSA
AN0
AN1
AN2
AN3
AN4
AN5
AN6
AN7
PAD00
PAD01
PAD02
PAD03
PAD04
PAD05
PAD06
PAD08
PAD09
PAD10
PAD11
PAD12
PAD13
PAD14
PAD15
PAD16
PAD17
PAD18
PAD19
PAD20
PAD21
PAD22
PAD23
PT0
V
DDR
V
SSR
V
Voltage Regulator
REGEN
V
DD1,2
V
SS1,2
Single-Wire
Background
Debug Module
PAD07
BKGD
CPU12X
XFC
Enhanced Multilevel
Interrupt Module
V
DDPLL
Clock
PLL
Periodic Interrupt
COP Watchdog
Clock Monitor
Breakpoints
V
and Reset
Generation
Module
SSPLL
EXTAL
XGATE
Peripheral Co-Processor
XTAL
RESET
TEST
IOC0
PE0
PE1
PE2
PE3
PE4
PE5
PE6
PE7
PK0
XIRQ
IRQ
R/W/WE
LSTRB/LDS/EROMCTL
ECLK
MODA/RE/TAGLO
MODB/TAGHI
ECLKX2/XCLKS
IQSTAT0
IOC1
IOC2
IOC3
IOC4
IOC5
IOC6
IOC7
RXD
TXD
PT1
PT2
PT3
PT4
PT5
Enhanced Capture
Timer
PT6
PT7
PS0
PS1
PS2
PS3
PS4
PS5
PS6
PS7
PM0
PM1
PM2
PM3
PM4
PM5
PM6
PM7
SCI0
SCI1
ADDR16
PK1
PK2
PK3
PK4
PK5
IQSTAT1
IQSTAT2
ADDR17
ADDR18
ADDR19
ADDR20
ADDR21
RXD
TXD
IQSTAT3
8-Bit PPAGE
MISO
MOSI
SCK
ACC0
ACC1
ACC2
Allows 4-MByte
Program space
SPI0
ADDR22 PK6
EWAIT PK7
ADDR15 PA7
ADDR14 PA6
ADDR13 PA5
ADDR12 PA4
ADDR11 PA3
ADDR10 PA2
ADDR9 PA1
ADDR8 PA0
ADDR7 PB7
ADDR6 PB6
ADDR5 PB5
ADDR4 PB4
ADDR3 PB3
ADDR2 PB2
ADDR1 PB1
ADDR0 PB0
DATA15 PC7
DATA14 PC6
DATA13 PC5
DATA12 PC4
DATA11 PC3
DATA10 PC2
DATA9 PC1
DATA8 PC0
DATA7 PD7
DATA6 PD6
DATA5 PD5
DATA4 PD4
DATA3 PD3
DATA2 PD2
DATA1 PD1
DATA0 PD0
SS
ROMCTL/EWAIT
RXCAN
TXCAN
RXCAN
TXCAN
RXCAN
TXCAN
RXCAN
TXCAN
CAN0
Timer
4-Channel
16-Bit with Prescaler
for Internal Timebases
CAN1
CAN2
RXD
SCI3
CAN3
TXD
RXCAN
TXCAN
Digital Supply 2.5 V
CAN4
V
DD1,2
RXD
TXD
KWJ0
KWJ1
KWJ2
KWJ4
KWJ5
KWJ6
KWJ7
KWP0
KWP1
KWP2
KWP3
KWP4
KWP5
KWP6
KWP7
KWH0
KWH1
KWH2
KWH3
KWH4
KWH5
KWH6
KWH7
PJ0 CS3
PJ1
PJ2 CS1
PJ4 CS0
PJ5 CS2
PJ6
PJ7
PP0
PP1
PP2
PP3
PP4
PP5
PP6
PP7
PH0
PH1
PH2
PH3
PH4
PH5
PH6
PH7
V
SCI2
SS1,2
SDA
SCL
SDA
SCL
PWM0
PWM1
PWM2
PWM3
PWM4
PWM5
PWM6
PWM7
MISO
MOSI
SCK
SS
MISO
MOSI
SCK
IIC1
PLL Supply 2.5 V
V
DDPLL
UDS
IIC0
V
SSPLL
Analog Supply 3-5 V
VDDA
VSSA
PWM
I/O Supply 3-5 V
V
DDX1,2
V
SSX1,2
Voltage Regulator 3-5 V
V
DDR1,2
SPI1
V
SSR1,2
RXD
TXD
RXD
TXD
SCI4
SCI5
SPI2
SS
Figure 1-1. MC9S12XD-Family Block Diagram
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
27
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Chapter 1 Device Overview (MC9S12XDP512V2)
1.1.4
Device Memory Map
Table 1-1shows the device register memory map of the MC9S12XDP512.
Table 1-1. Device Register Memory Map
Size
(Bytes)
Address
Module
0x0000–0x0009
0x000A–0x000B
0x000C–0x000D
0x000E–0x000F
0x0010–0x0017
0x0018–0x0019
0x001A–0x001B
0x001C–0x001F
0x0020–0x002F
0x0030–0x0031
0x0032–0x0033
0x0034–0x003F
0x0040–0x007F
0x0080–0x00AF
0x00B0–0x00B7
0x00B8–0x00BF
0x00C0–0x00C7
0x00C8–0x00CF
0x00D0–0x00D7
0x00D8–0x00DF
0x00E0–0x00E7
0x00E8–0x00EF
0x00F0–0x00F7
0x00F8–0x00FF
0x0100–0x010F
0x0110–0x011B
0x011C–0x011F
0x0120–0x012F
0x0130–0x0137
0x0138–0x013F
0x0140–0x017F
PIM (port integration module)
MMC (memory map control)
PIM (port integration module)
EBI (external bus interface)
MMC (memory map control)
Reserved
10
2
2
2
8
2
Device ID register
2
PIM (port integration module)
DBG (debug module)
4
16
2
MMC (memory map control)
PIM (port integration module)
CRG (clock and reset generator)
ECT (enhanced capture timer 16-bit 8-channel)s
ATD1 (analog-to-digital converter 10-bit 16-channel)
IIC1 (inter IC bus)
2
12
64
48
8
SCI2 (serial communications interface)
SCI3 (serial communications interface)
SCI0 (serial communications interface)
SCI1 (serial communications interface)
SPI0 (serial peripheral interface)
IIC0 (inter IC bus)
8
8
8
8
8
8
Reserved
8
SPI1 (serial peripheral interface)
SPI2 (serial peripheral interface)
Flash control register
8
8
16
12
4
EEPROM control register
MMC (memory map control)
INT (interrupt module)
16
8
SCI4 (serial communications interface)
SCI5 (serial communications interface)
CAN0 (scalable CAN)
8
64
MC9S12XDP512 Data Sheet, Rev. 2.11
28
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Chapter 1 Device Overview (MC9S12XDP512V2)
Table 1-1. Device Register Memory Map (continued)
Size
(Bytes)
Address
Module
0x0180–0x01BF
0x01C0–0x01FF
0x0200–0x023F
0x0240–0x027F
0x0280–0x02BF
0x02C0–0x02DF
0x02E0–0x02EF
0x02F0–0x02F7
0x02F8–0x02FF
0x0300–0x0327
0x0328–0x033F
0x0340–0x0367
0x0368–0x037F
0x0380–0x03BF
0x03C0–0x03FF
0x0400–0x07FF
CAN1 (scalable CAN)
CAN2 (scalable CAN)
CAN3 (scalable CAN)
64
64
64
64
64
32
16
8
PIM (port integration module)
CAN4 (scalable CAN)
ATD0 (analog-to-digital converter 10 bit 8-channel)
Reserved
Voltage regulator
Reserved
8
PWM (pulse-width modulator 8 channels)
40
24
40
24
64
64
1024
Reserved
Periodic interrupt timer
Reserved
XGATE
Reserved
Reserved
NOTE
Reserved register space shown in Table 1-1 is not allocated to any module.
This register space is reserved for future use. Writing to these locations have
no effect. Read access to these locations returns zero.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
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Chapter 1 Device Overview (MC9S12XDP512V2)
1.1.5
Address Mapping
1.1.5.1
Local-to-Global Address Mapping
$00_0000
$00_0800
2K Registers
$0000
2K Registers
$0F_8000
RAM
6*4K paged
$0800
$0F_DFFF
$0F_E000
EEPROM
1K paged
8K RAM
$0C00
$1000
$0F_FFFF
$10_0000
EPAGE
RPAGE
1K EEPROM
RAM
4K paged
$13_F000
EEPROM
3*1K paged
$2000
$4000
$8000
$13_FC00
$14_0000
1K EEPROM
8K RAM
Unpaged Flash
PPAGE
Flash
16K paged
PPAGE = $E0
$78_0000
PPAGES
29 * 16K
$C000
$FFFF
Unpaged Flash
Vectors
PPAGE = $FD
$7F_4000
$7F_8000
Unpaged 16K
or PPAGE $FD
PPAGE = $FE
PPAGE = $FF
Unpaged 16K
or PPAGE $FE
$7F_C000
$7F_FFFF
Unpaged 16K
or PPAGE $FF
Figure 1-2. Local-to-Global Address Mapping S12X_CPU/S12X_BDM
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 1 Device Overview (MC9S12XDP512V2)
Device Global Memory Map
XGATE
Local Memory Map
$00_0000
2K Registers
$00_0800
$00_1000
$0000
2K Registers
$0F_8000
$0800
RAM
$0F_FFFF
$10_0000
FLASH
$7FFF
$8000
RAM
$78_0800
30KB FLASH
$FFFF
$78_7FFF
$78_8000
Not Used by XGATE
$7F_FFFF
Figure 1-3. Local-to-Global Address Mapping XGATE
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
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Chapter 1 Device Overview (MC9S12XDP512V2)
1.1.5.2
Logical Address Map
$0000 2-K Register Space
$07FF
$0000
$0800
$0C00
$0800 4-Kbytes EEPROM
four * 1K pages accessible through $0800–$0BFF
$0FFF
$1000
$1000
$2000
32-Kbytes RAM
eight * 4K pages accessible
through $1000–$1FFF
$3FFF
$4000
$4000
$8000
$C000
16-K Fixed Flash EEPROM
$7FFF
$8000
16-K Page Window
thirtytwo * 16-K Flash EEPROM Pages
EXT
$BFFF
$BF00
BDM visible on PPAGE = $FF
(If Active)
$BFFF
$C000
16-K Fixed Flash EEPROM
2-K, 4-K, 8-K, or 16-K Protected Boot Sector
$FFFF
$FF00
BDM
(If Active, except for specific BDM hardware
command, for details refer to BDM BlockGuide)
$FF00
$FFFF
Vectors
Vectors
Vectors
$FFFF
Normal
Expanded
Special
Single Chip
Single Chip
Figure 1-4. Memory Map
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 1 Device Overview (MC9S12XDP512V2)
1.1.6
Detailed Register Map
The following tables show the detailed register map of the MC9S12XDP512.
0x0000–0x0009 Port Integration Module (PIM) Map 1 of 5
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
0x0000
PORTA
PA7
PA6
PA5
PA4
PA3
PA2
PA1
PA 0
0x0001
0x0002
0x0003
0x0004
0x0005
0x0006
0x0007
0x0008
0x0009
PORTB
DDRA
PB7
DDRA7
DDRB7
PC7
PB6
DDRA6
DDRB6
PC6
PB5
DDRA5
DDRB5
PC5
PB4
DDRA4
DDRB4
PC4
PB3
DDRA3
DDRB3
PC3
PB2
DDRA2
DDRB2
PC2
PB1
DDRA1
DDRB1
PC1
PB0
DDRA0
DDRB0
PC0
W
R
W
R
DDRB
W
R
PORTC
PORTD
DDRC
DDRD
PORTE
DDRE
W
R
PD7
PD6
PD5
PD4
PD3
PD2
PD1
PD0
W
R
DDRC7
DDRD7
PE7
DDRC6
DDRD6
PE6
DDRC5
DDRD5
PE5
DDRC4
DDRD4
PE4
DDRC3
DDRD3
PE3
DDRC2
DDRD2
PE2
DDRC1
DDRC0
W
R
DDRD1
PE1
DDRD0
PE0
W
R
W
R
0
0
DDRE7
DDRE6
DDRE5
DDRE4
DDRE3
DDRE2
W
0x000A–0x000B Module Mapping Control (S12XMMC) Map 1 of 4
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
0
0
0
0
0
0x000A
MMCCTL0
CS2E
0
CS1E
0
CS0E
0
0
0
0x000B
MODE
MODC
MODB
MODA
W
0x000C–0x000D Port Integration Module (PIM) Map 2 of 5
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
0
0x000C
PUCR
PUPKE
BKPUE
0
PUPEE
PUPDE
PUPCE
PUPBE
PUPAE
0
0x000D
RDRIV
RDPK
RDPE
RDPD
RDPC
RDPB
RDPA
W
0x000E–0x000F External Bus Interface (S12XEBI) Map
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
0
0x000E
EBICTL0
ITHRS
HDBE
0
ASIZ4
0
ASIZ3
0
ASIZ2
ASIZ1
ASIZ0
0
0x000F
EBICTL1
EWAITE
EXSTR2
EXSTR1
EXSTR0
W
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
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Chapter 1 Device Overview (MC9S12XDP512V2)
0x0010–0x0017 Module Mapping Control (S12XMMC) Map 2 of 4
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
0
0x0010
GPAGE
GP6
GP5
GP4
GP3
GP2
GP1
GP0
0x0011
0x0012
0x0013
0x0014
0x0015
0x0016
0x0017
DIRECT
Reserved
MMCCTL1
Reserved
Reserved
RPAGE
DP15
0
DP14
0
DP13
0
DP12
0
DP11
0
DP10
0
DP9
0
DP8
0
W
R
W
R
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
EROMON ROMHM
ROMON
0
W
R
0
0
0
0
W
R
0
W
R
RP7
EP7
RP6
EP6
RP5
EP5
RP4
EP4
RP3
EP3
RP2
EP2
RP1
EP1
RP0
EP0
W
R
EPAGE
W
0x0018–0x001B Miscellaneous Peripheral
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
0
0
0
0
0
0
0
0
0x0018
Reserved
0
1
0
0
1
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0x0019
0x001A
0x001B
Reserved
PARTIDH
PARTIDL
W
R
W
R
W
0x001C–0x001F Port Integration Module (PIM) Map 3 of 5
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
0
0
0
0
0x001C
ECLKCTL
NECLK
0
NCLKX2
0
EDIV1
0
EDIV0
0
0
0
0
0
0
0
0
0
0
0
0
0
0x001D
0x001E
0x001F
Reserved
IRQCR
W
R
0
0
0
0
IRQE
0
IRQEN
0
W
R
Reserved
W
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 1 Device Overview (MC9S12XDP512V2)
0x0020–0x0027 Debug Module (S12XDBG) Map
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
0
0x0020
DBGC1
ARM
TBF
XGSBPE
0
BDM
0
DBGBRK
COMRV
TRIG
EXTF
0
SSF2
SSF1
SSF0
0x0021
0x0022
0x0023
0x0024
0x0025
0x0026
0x0027
DBGSR
DBGTCR
DBGC2
W
R
TSOURCE
TRANGE
TRCMOD
CDCM
TALIGN
ABCM
W
R
0
Bit 15
Bit 7
0
0
0
0
W
R
Bit 14
Bit 6
Bit 13
Bit 5
Bit 12
Bit 4
Bit 11
Bit 3
Bit 10
Bit 2
Bit 9
Bit 1
Bit 8
Bit 0
DBGTBH
DBGTBL
DBGCNT
DBGSCRX
W
R
W
R
CNT
W
R
0
0
0
0
SC3
RW
RW
19
11
3
SC2
RWE
RWE
18
SC1
SRC
SRC
17
9
SC0
W
R
0
DBGXCTL
(COMPA/C)
1
0x0028
NDB
SZ
Bit 22
14
TAG
TAG
21
13
5
BRK
BRK
20
12
4
COMPE
COMPE
Bit 16
Bit 8
W
R
DBGXCTL
(COMPB/D)
2
0x0028
SZE
0
W
R
0x0029
0x002A
0x002B
0x002C
0x002D
0x002E
0x002F
DBGXAH
DBGXAM
DBGXAL
W
R
Bit 15
Bit 7
10
W
R
6
2
1
Bit 0
W
R
DBGXDH
DBGXDL
DBGXDHM
DBGXDLM
Bit 15
Bit 7
14
13
5
12
4
11
3
10
9
Bit 8
W
R
6
2
1
Bit 0
W
R
Bit 15
Bit 7
14
13
5
12
4
11
3
10
9
Bit 8
W
R
6
2
1
Bit 0
W
1
This represents the contents if the Comparator A or C control register is blended into this address
This represents the contents if the Comparator B or D control register is blended into this address
2
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
35
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Chapter 1 Device Overview (MC9S12XDP512V2)
0x0030–0x0031 Module Mapping Control (S12XMMC) Map 3 of 4
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
0x0030
PPAGE
PIX7
0
PIX6
0
PIX5
0
PIX4
0
PIX3
0
PIX2
0
PIX1
0
PIX0
0
0x0031
Reserved
W
0x0032–0x0033 Port Integration Module (PIM) Map 4 of 5
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
0x0032
PORTK
PK7
PK6
PK5
PK4
PK3
PK2
PK1
PK0
0x0033
DDRK
DDRK7
DDRK6
DDRK5
DDRK4
DDRK3
DDRK2
DDRK1
DDRK0
W
0x0034–0x003F Clock and Reset Generator (CRG) Map
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
0
0
0x0034
SYNR
SYN5
SYN4
SYN3
SYN2
SYN1
SYN0
0
0
0
0
0x0035
0x0036
0x0037
0x0038
0x0039
0x003A
0x003B
0x003C
0x003D
0x003E
0x003F
REFDV
CTFLG
REFDV5
0
REFDV4
0
REFDV3
0
REFDV2
0
REFDV1
0
REFDV0
0
W
R
W
R
Reserved For Factory Test
LOCK
TRACK
SCM
0
CRGFLG
CRGINT
CLKSEL
PLLCTL
RTICTL
COPCTL
FORBYP
CTCTL
RTIF
RTIE
PORF
ILAF
LVRF
0
LOCKIF
SCMIF
SCMIE
RTIWAI
PCE
W
R
0
0
0
LOCKIE
W
R
0
0
PLLSEL
CME
PSTP
PLLON
RTR6
PLLWAI
COPWAI
SCME
RTR0
W
R
AUTO
ACQ
FSTWKP
PRE
W
R
RTDEC
RTR5
0
RTR4
0
RTR3
0
RTR2
RTR1
W
R
WCOP
0
RSBCK
0
CR2
0
CR1
0
CR0
0
W
R
0
0
0
0
W
R
Reserved For Factory Test
0
0
0
0
0
0
W
R
Reserved For Factory Test
0
0
6
0
5
0
4
0
3
0
2
0
1
0
ARMCOP
W
Bit 7
Bit 0
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 1 Device Overview (MC9S12XDP512V2)
0x0040–0x007F Enhanced Capture Timer 16-Bit 8-Channels (ECT) Map (Sheet 1 of 3)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
0x0040
TIOS
IOS7
IOS6
IOS5
IOS4
IOS3
IOS2
IOS1
IOS0
0
0
0
0
0
0
0
0
0x0041
0x0042
0x0043
0x0044
0x0045
0x0046
0x0047
0x0048
0x0049
0x004A
0x004B
0x004C
0x004D
0x004E
0x004F
0x0050
0x0051
0x0052
0x0053
0x0054
0x0055
CFORC
OC7M
W
R
FOC7
FOC6
FOC5
FOC4
FOC3
FOC2
FOC1
FOC0
OC7M7
OC7M6
OC7M5
OC7M4
OC7M3
OC7M2
OC7M1
OC7M0
W
R
OC7D
OC7D7
Bit 15
OC7D6
14
OC7D5
13
OC7D4
12
OC7D3
11
OC7D2
10
OC7D1
9
OC7D0
Bit 8
W
R
TCNT (hi)
TCNT (lo)
TSCR1
TTOV
W
R
Bit 7
6
5
4
3
2
0
1
0
Bit 0
0
W
R
TEN
TOV7
OM7
OM3
EDG7B
EDG3B
C7I
TSWAI
TOV6
OL7
TSFRZ
TOV5
TFFCA
TOV4
OL6
PRNT
TOV3
OM5
W
R
TOV2
OL5
TOV1
OM4
TOV0
OL4
W
R
TCTL1
TCTL2
TCTL3
TCTL4
TIE
OM6
W
R
OL3
OM2
OL2
OM1
OL1
OM0
OL0
W
R
EDG7A
EDG3A
EDG6B
EDG2B
EDG6A
EDG2A
EDG5B
EDG1B
C3I
EDG5A
EDG1A
C2I
EDG4B
EDG0B
C1I
EDG4A
EDG0A
C0I
W
R
W
R
C6I
0
C5I
0
C4I
0
W
R
TSCR2
TFLG1
TFLG2
TC0 (hi)
TC0 (lo)
TC1 (hi)
TC1 (lo)
TC2 (hi)
TC2 (lo)
TOI
TCRE
PR2
PR1
PR0
W
R
C7F
C6F
0
C5F
0
C4F
0
C3F
0
C2F
0
C1F
0
C0F
0
W
R
TOF
W
R
Bit 15
Bit 7
14
6
13
5
12
4
11
3
10
2
9
1
9
1
9
1
Bit 8
Bit 0
Bit 8
Bit 0
Bit 8
Bit 0
W
R
W
R
Bit 15
Bit 7
14
6
13
5
12
4
11
3
10
2
W
R
W
R
Bit 15
Bit 7
14
6
13
5
12
4
11
3
10
2
W
R
W
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
37
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Chapter 1 Device Overview (MC9S12XDP512V2)
0x0040–0x007F Enhanced Capture Timer 16-Bit 8-Channels (ECT) Map (Sheet 2 of 3)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
0x0056
TC3 (hi)
Bit 15
14
13
12
11
10
9
Bit 8
0x0057
0x0058
0x0059
0x005A
0x005B
0x005C
0x005D
0x005E
0x005F
0x0060
0x0061
0x0062
0x0063
0x0064
0x0065
0x0066
0x0067
0x0068
0x0069
0x006A
0x006B
0x006C
TC3 (lo)
TC4 (hi)
TC4 (lo)
TC5 (hi)
TC5 (lo)
TC6 (hi)
TC6 (lo)
TC7 (hi)
TC7 (lo)
PACTL
Bit 7
Bit 15
Bit 7
6
14
6
5
13
5
4
12
4
3
11
3
2
10
2
1
Bit 0
Bit 8
Bit 0
Bit 8
Bit 0
Bit 8
Bit 0
Bit 8
Bit 0
PAI
W
R
9
W
R
1
W
R
Bit 15
Bit 7
14
6
13
5
12
4
11
3
10
2
9
W
R
1
W
R
Bit 15
Bit 7
14
6
13
5
12
4
11
3
10
2
9
W
R
1
W
R
Bit 15
14
6
13
5
12
4
11
3
10
2
9
W
R
Bit 7
0
1
W
R
PAEN
0
PAMOD
0
PEDGE
0
CLK1
0
CLK0
0
PAOVI
W
R
0
PAFLG
PAOVF
PAIF
Bit 0
Bit 0
Bit 0
Bit 0
W
R
PACN3 (hi)
PACN2 (lo)
PACN1 (hi)
PACN0 (lo)
MCCTL
MCFLG
ICPAR
Bit 7
Bit 7
Bit 7
Bit 7
MCZI
6
6
6
6
5
5
5
5
4
4
4
4
3
3
3
3
2
2
2
2
1
1
1
1
W
R
W
R
W
R
W
R
0
ICLAT
0
0
MODMC
0
RDMCL
0
MCEN
POLF2
MCPR1
POLF1
MCPR0
POLF0
W
R
FLMC
POLF3
MCZF
0
W
R
0
0
0
PA3EN
DLY3
PA2EN
DLY2
PA1EN
DLY1
PA0EN
DLY0
W
R
DLYCT
DLY7
DLY6
DLY5
DLY4
W
R
ICOVW
NOVW7
NOVW6
NOVW5
NOVW4
NOVW3
NOVW2
NOVW1
NOVW0
W
R
ICSYS
SH37
0
SH26
0
SH15
0
SH04
0
TFMOD
0
PACMX
0
BUFEN
0
LATQ
0
W
R
Reserved
W
MC9S12XDP512 Data Sheet, Rev. 2.11
38
Freescale Semiconductor
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Chapter 1 Device Overview (MC9S12XDP512V2)
0x0040–0x007F Enhanced Capture Timer 16-Bit 8-Channels (ECT) Map (Sheet 3 of 3)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
0
0
0
0
0
0
0
0
0x006D
TIMTST
Reserved For Factory Test
0x006E
0x006F
0x0070
0x0071
0x0072
0x0073
0x0074
0x0075
0x0076
0x0077
0x0078
0x0079
0x007A
0x007B
0x007C
0x007D
0x007E
0x007F
PTPSR
PTMCPSR
PBCTL
PTPS7
PTPS6
PTPS5
PTPS4 PTPS3
PTPS2
PTPS1
PTPS0
W
R
PTMPS7 PTMPS6 PTMPS5 PTMPS4 PTMPS3 PTMPS2 PTMPS1 PTMPS0
W
R
0
0
0
0
0
0
PBEN
0
PBOVI
W
R
0
0
0
0
0
0
PBFLG
PBOVF
PA3H1
W
R
PA3H7
PA2H7
PA1H7
PA0H7
PA3H6
PA2H6
PA1H6
PA0H6
PA3H5
PA2H5
PA1H5
PA0H5
PA3H4
PA2H4
PA1H4
PA0H4
PA3H3
PA2H3
PA1H3
PA0H3
PA3H2
PA2H2
PA1H2
PA0H2
PA3H0
PA2H0
PA1H 0
PA0H0
PA3H
W
R
PA2H1
PA1H1
PA0H1
PA2H
W
R
PA1H
W
R
PA0H
W
R
MCCNT (hi)
MCCNT (lo)
TC0H (hi)
TC0H (lo)
TC1H (hi)
TC1H (lo)
TC2H (hi)
TC2H (lo)
TC3H (hi)
TC3H (lo)
Bit 15
14
13
12
11
10
9
Bit 8
W
R
Bit 7
6
5
4
3
2
1
9
Bit 0
Bit 8
W
R
Bit 15
14
13
12
11
10
W
R
Bit 7
Bit 15
Bit 7
6
14
6
5
13
5
4
12
4
3
11
3
2
10
2
1
9
1
9
1
9
1
Bit 0
Bit 8
Bit 0
Bit 8
Bit 0
Bit 8
Bit 0
W
R
W
R
W
R
Bit 15
Bit 7
14
6
13
5
12
4
11
3
10
2
W
R
W
R
Bit 15
Bit 7
14
6
13
5
12
4
11
3
10
2
W
R
W
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
39
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Chapter 1 Device Overview (MC9S12XDP512V2)
0x0080–0x00AF Analog-to-Digital Converter 10-bit 16-Channels (ATD1) Map (Sheet 1 of
3)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
0
0
0
0
0x0080
ATD1CTL0
WRAP3
WRAP2
WRAP1
WRAP0
0
0
0
ETRIG
SEL
ETRIG
CH3
ETRIG
CH2
ETRIG
CH1
ETRIG
CH0
0x0081
0x0082
0x0083
0x0084
0x0085
0x0086
0x0087
ATD1CTL1
ATD1CTL2
ATD1CTL3
ATD1CTL4
ATD1CTL5
ATD1STAT0
Reserved
W
R
ASCIF
ADPU
0
AFFC
S8C
AWAI
S4C
ETRIGLE ETRIGP
ETRIGE
FIFO
ASCIE
FRZ1
PRS1
W
R
S2C
PRS4
MULT
S1C
FRZ0
PRS0
W
R
SRES8
DJM
SMP1
SMP0
SCAN
PRS3
PRS2
W
R
DSGN
0
CD
CC
CB
CA
W
R
CC3
CC2
CC1
CC0
SCF
0
ETORF
0
FIFOR
0
W
R
0
U
0
0
U
0
U
0
U
W
R
U
0
U
0
U
U
0x0088 ATD1TEST0
0x0089 ATD1TEST1
0x008A ATD1STAT2
0x008B ATD1STAT1
0x008C ATD1DIEN0
W
R
Reserved For Factory Test
0
0
0
0
0
0
W
R
Reserved For Factory Test
CCF15
CCF7
CCF14
CCF6
CCF13
CCF5
CCF12
CCF11
CCF10
CCF2
CCF9
CCF1
CCF8
CCF0
W
R
CCF4
CCF3
W
R
IEN15
IEN14
IEN13
IEN12
IEN11
IEN10
IEN9
IEN8
W
R
0x008D
ATD1DIEN
IEN7
IEN6
IEN5
IEN4
IEN3
IEN2
IEN1
IEN0
W
R
PTAD15
PTAD14
PTAD13
PTAD12
PTAD11
PTAD10
PTAD9
PTAD8
0x008E ATD1PTAD0
0x008F ATD1PTAD1
W
R
PTAD7
Bit15
Bit7
PTAD6
14
PTAD5
PTAD4
PTAD3
PTAD2
PTAD1
PTAD0
Bit8
0
W
R
13
0
12
0
11
0
10
0
9
0
9
0
9
0
0x0090
0x0091
0x0092
0x0093
0x0094
0x0095
ATD1DR0H
ATD1DR0L
ATD1DR1H
ATD1DR1L
ATD1DR2H
ATD1DR2L
W
R
Bit6
14
W
R
Bit15
Bit7
13
0
12
0
11
0
10
0
Bit8
0
W
R
Bit6
14
W
R
Bit15
Bit7
13
0
12
0
11
0
10
0
Bit8
0
W
R
Bit6
W
MC9S12XDP512 Data Sheet, Rev. 2.11
40
Freescale Semiconductor
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Chapter 1 Device Overview (MC9S12XDP512V2)
0x0080–0x00AF Analog-to-Digital Converter 10-bit 16-Channels (ATD1) Map (Sheet 2 of
3)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
Bit15
14
13
12
11
10
9
Bit8
0x0096
ATD1DR3H
Bit7
Bit15
Bit7
Bit6
14
0
13
0
0
12
0
0
11
0
0
10
0
0
9
0
9
0
9
0
9
0
9
0
9
0
9
0
9
0
9
0
9
0
0
Bit8
0
0x0097
0x0098
0x0099
0x009A
0x009B
0x009C
0x009D
0x009E
0x009F
0x00A0
0x00A1
0x00A2
0x00A3
ATD1DR3L
ATD1DR4H
ATD1DR4L
ATD1DR5H
ATD1DR5L
ATD1DR6H
ATD1DR6L
ATD1DR7H
ATD1DR7L
ATD1DR8H
ATD1DR8L
ATD1DR9H
ATD1DR9L
W
R
W
R
Bit6
14
W
R
Bit15
Bit7
13
0
12
0
11
0
10
0
Bit8
0
W
R
Bit6
14
W
R
Bit15
Bit7
13
0
12
0
11
0
10
0
Bit8
0
W
R
Bit6
14
W
R
Bit15
Bit7
13
0
12
0
11
0
10
0
Bit8
0
W
R
Bit6
14
W
R
Bit15
Bit7
13
0
12
0
11
0
10
0
Bit8
0
W
R
Bit6
14
W
R
Bit15
Bit7
13
0
12
0
11
0
10
0
Bit8
0
W
R
Bit6
14
W
R
Bit15
Bit7
13
0
12
0
11
0
10
0
Bit8
0
0x00A4 ATD1DR10H
0x00A5 ATD1DR10L
0x00A6 ATD1DR11H
0x00A7 ATD1DR11L
0x00A8 ATD1DR12H
0x00A9 ATD1DR12L
0x00AA ATD1DR13H
0x00AB ATD1DR13L
W
R
Bit6
14
W
R
Bit15
Bit7
13
0
12
0
11
0
10
0
Bit8
0
W
R
Bit6
14
W
R
Bit15
Bit7
13
0
12
0
11
0
10
0
Bit8
0
W
R
Bit6
14
W
R
Bit15
Bit7
13
0
12
0
11
0
10
0
Bit8
0
W
R
Bit6
W
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 1 Device Overview (MC9S12XDP512V2)
0x0080–0x00AF Analog-to-Digital Converter 10-bit 16-Channels (ATD1) Map (Sheet 3 of
3)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
Bit15
14
13
12
11
10
9
Bit8
0x00AC ATD1DR14H
0x00AD ATD1DR14L
0x00AE ATD1DR15H
0x00AF ATD1DR15L
Bit7
Bit15
Bit7
Bit6
14
0
13
0
0
12
0
0
11
0
0
10
0
0
9
0
0
Bit8
0
W
R
W
R
Bit6
W
0x00B0–0x00B7 Inter IC Bus (IIC1) Map
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
0
0x00B0
IBAD
ADR7
ADR6
ADR5
ADR4
ADR3
ADR2
ADR1
0x00B1
0x00B2
0x00B3
0x00B4
0x00B5
0x00B6
0x00B7
IBFD
IBCR
IBC7
IBC6
IBC5
IBC4
TX/RX
IBAL
IBC3
IBC2
IBC1
0
IBC0
W
R
0
IBEN
TCF
IBIE
MS/SL
IBB
TXAK
0
IBSWAI
RXAK
W
R
RSTA
SRW
IAAS
IBSR
IBIF
W
R
IBDR
D7
0
D6
0
D5
0
D4
0
D3
0
D2
0
D1
0
D 0
0
W
R
Reserved
Reserved
Reserved
W
R
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
W
R
W
0x00B8–0x00BF Asynchronous Serial Interface (SCI2) Map
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
1
0x00B8
SCI2BDH
IREN
TNP1
TNP0
SBR12
SBR11
SBR10
SBR9
SBR8
1
0x00B9
0x00BA
SCI2BDL
SBR7
LOOPS
SBR6
SBR5
SBR4
SBR3
SBR2
ILT
SBR1
PE
SBR0
PT
W
R
1
SCI2CR1
SCISWAI
0
RSRC
0
M
0
WAKE
0
W
R
2
2
2
0x00B8 SCI2ASR1
0x00B9 SCI2ACR1
0x00BA SCI2ACR2
RXEDGIF
BERRV
0
BERRIF
BERRIE
BKDIF
BKDIE
BKDFE
W
R
0
0
0
0
0
0
0
0
RXEDGIE
0
W
R
BERRM1 BERRM0
W
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 1 Device Overview (MC9S12XDP512V2)
0x00B8–0x00BF Asynchronous Serial Interface (SCI2) Map (continued)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
0x00BB
SCI2CR2
TIE
TCIE
TC
RIE
ILIE
TE
RE
NF
RWU
FE
SBK
PF
TDRE
RDRF
IDLE
OR
0x00BC
0x00BD
0x00BE
0x00BF
SCI2SR1
SCI2SR2
SCI2DRH
SCI2DRL
W
R
0
0
0
RAF
0
AMAP
R8
TXPOL
0
RXPOL
0
BRK13
0
TXDIR
0
W
R
T8
W
R
R7
T7
R6
T6
R5
T5
R4
T4
R3
T3
R2
T2
R1
T1
R0
T0
W
1
Those registers are accessible if the AMAP bit in the SCI2SR2 register is set to zero
Those registers are accessible if the AMAP bit in the SCI2SR2 register is set to one
2
0x00C0–0x00C7 Asynchronous Serial Interface (SCI3) Map
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
1
0x00C0
SCI3BDH
IREN
TNP1
TNP0
SBR12
SBR11
SBR10
SBR9
SBR8
1
0x00C1
0x00C2
SCI3BDL
SBR7
LOOPS
SBR6
SBR5
SBR4
SBR3
SBR2
ILT
SBR1
PE
SBR0
PT
W
R
1
SCI3CR1
SCISWAI
0
RSRC
0
M
0
WAKE
0
W
R
2
2
2
0x00C0 SCI3ASR1
0x00C1 SCI3ACR1
0x00C2 SCI3ACR2
RXEDGIF
BERRV
0
BERRIF
BERRIE
BKDIF
BKDIE
BKDFE
W
R
0
0
0
0
0
0
0
0
RXEDGIE
0
W
R
BERRM1 BERRM0
W
R
0x00C3
0x00C4
0x00C5
0x00C6
0x00C7
SCI3CR2
SCI3SR1
SCI3SR2
SCI3DRH
SCI3DRL
TIE
TCIE
TC
RIE
ILIE
TE
RE
NF
RWU
FE
SBK
PF
W
R
TDRE
RDRF
IDLE
OR
W
R
0
0
0
RAF
0
AMAP
R8
TXPOL
0
RXPOL
0
BRK13
0
TXDIR
0
W
R
T8
W
R
R7
T7
R6
T6
R5
T5
R4
T4
R3
T3
R2
T2
R1
T1
R0
T0
W
1
2
Those registers are accessible if the AMAP bit in the SCI3SR2 register is set to zero
Those registers are accessible if the AMAP bit in the SCI3SR2 register is set to one
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 1 Device Overview (MC9S12XDP512V2)
0x00C8–0x00CF Asynchronous Serial Interface (SCI0) Map
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
1
0x00C8
SCI0BDH
IREN
TNP1
TNP0
SBR12
SBR11
SBR10
SBR9
SBR8
1
0x00C9
0x00CA
SCI0BDL
SBR7
LOOPS
SBR6
SBR5
SBR4
SBR3
SBR2
ILT
SBR1
PE
SBR0
PT
W
R
1
SCI0CR1
SCISWAI
0
RSRC
0
M
0
WAKE
0
W
R
2
2
2
0x00C8 SCI0ASR1
0x00C9 SCI0ACR1
0x00CA SCI0ACR2
RXEDGIF
BERRV
0
BERRIF
BERRIE
BKDIF
BKDIE
BKDFE
W
R
0
0
0
0
0
0
0
0
RXEDGIE
0
W
R
BERRM1 BERRM0
W
R
0x00CB
0x00CC
0x00CD
0x00CE
0x00CF
SCI0CR2
SCI0SR1
SCI0SR2
SCI0DRH
SCI0DRL
TIE
TCIE
TC
RIE
ILIE
TE
RE
NF
RWU
FE
SBK
PF
W
R
TDRE
RDRF
IDLE
OR
W
R
0
0
0
RAF
0
AMAP
R8
TXPOL
0
RXPOL
0
BRK13
0
TXDIR
0
W
R
T8
W
R
R7
T7
R6
T6
R5
T5
R4
T4
R3
T3
R2
T2
R1
T1
R0
T0
W
1
2
Those registers are accessible if the AMAP bit in the SCI0SR2 register is set to zero
Those registers are accessible if the AMAP bit in the SCI0SR2 register is set to one
0x00D0–0x00D7 Asynchronous Serial Interface (SCI1) Map
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
1
0x00D0
SCI1BDH
IREN
TNP1
TNP0
SBR12
SBR11
SBR10
SBR9
SBR8
1
0x00D1
0x00D2
SCI1BDL
SBR7
LOOPS
SBR6
SBR5
SBR4
SBR3
SBR2
ILT
SBR1
PE
SBR0
PT
W
R
1
SCI1CR1
SCISWAI
0
RSRC
0
M
0
WAKE
0
W
R
2
2
2
0x00D0 SCI1ASR1
0x00D1 SCI1ACR1
0x00D2 SCI1ACR2
RXEDGIF
BERRV
0
BERRIF
BERRIE
BKDIF
BKDIE
BKDFE
W
R
0
0
0
0
0
0
0
0
RXEDGIE
0
W
R
BERRM1 BERRM0
W
R
0x00D3
0x00D4
SCI1CR2
SCI1SR1
TIE
TCIE
TC
RIE
ILIE
TE
RE
NF
RWU
FE
SBK
PF
W
R
TDRE
RDRF
IDLE
OR
W
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Chapter 1 Device Overview (MC9S12XDP512V2)
0x00D0–0x00D7 Asynchronous Serial Interface (SCI1) Map (continued)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
0
0
RAF
0x00D5
SCI1SR2
AMAP
R8
TXPOL
0
RXPOL
0
BRK13
0
TXDIR
0
0
0
0x00D6
0x00D7
SCI1DRH
SCI1DRL
T8
W
R
R7
T7
R6
T6
R5
T5
R4
T4
R3
T3
R2
T2
R1
T1
R0
T0
W
1
Those registers are accessible if the AMAP bit in the SCI1SR2 register is set to zero
Those registers are accessible if the AMAP bit in the SCI1SR2 register is set to one
2
0x00D8–0x00DF Serial Peripheral Interface (SPI0) Map
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
0x00D8
SPI0CR1
SPIE
0
SPE
0
SPTIE
0
MSTR
CPOL
CPHA
0
SSOE
LSBFE
0x00D9
0x00DA
0x00DB
0x00DC
0x00DD
0x00DE
0x00DF
SPI0CR2
SPI0BR
MODFEN BIDIROE
SPISWAI
SPC0
W
R
0
SPIF
0
0
SPPR2
0
SPPR1
SPTEF
SPPR0
SPR2
0
SPR1
0
SPR0
0
W
R
MODF
0
0
0
SPI0SR
W
R
0
0
0
0
0
Reserved
SPI0DR
Reserved
Reserved
W
R
Bit7
0
6
0
5
0
4
0
3
0
2
0
1
0
Bit0
0
W
R
W
R
0
0
0
0
0
0
0
0
W
0x00E0–0x00E7 Inter IC Bus (IIC0) Map
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
0
0x00E0
IBAD
ADR7
ADR6
ADR5
ADR4
ADR3
ADR2
ADR1
0x00E1
0x00E2
0x00E3
0x00E4
IBFD
IBCR
IBSR
IBDR
IBC7
IBC6
IBC5
IBC4
TX/RX
IBAL
D4
IBC3
IBC2
IBC1
0
IBC0
W
R
0
IBEN
TCF
IBIE
MS/SL
IBB
TXAK
0
IBSWAI
RXAK
W
R
RSTA
SRW
IAAS
IBIF
D1
W
R
D7
D6
D5
D3
D2
D 0
W
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 1 Device Overview (MC9S12XDP512V2)
0x00E0–0x00E7 Inter IC Bus (IIC0) Map (continued)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
0
0
0
0
0
0
0
0
0x00E5
Reserved
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0x00E6
0x00E7
Reserved
Reserved
W
R
W
0x00E8–0x00EF Reserved
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
0
0
0
0
0
0
0
0
0x00E8
Reserved
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0x00E9
0x00EA
0x00EB
0x00EC
0x00ED
0x00EE
0x00EF
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
W
R
W
R
W
R
W
R
W
R
W
R
W
0x00F0–0x00F7 Serial Peripheral Interface (SPI1) Map
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
0x00F0
SPI1CR1
SPIE
0
SPE
0
SPTIE
0
MSTR
CPOL
CPHA
0
SSOE
LSBFE
0x00F1
0x00F2
0x00F3
0x00F4
0x00F5
0x00F6
0x00F7
SPI1CR2
SPI1BR
MODFEN BIDIROE
SPISWAI
SPC0
W
R
0
SPIF
0
0
SPPR2
0
SPPR1
SPTEF
SPPR0
SPR2
0
SPR1
0
SPR0
0
W
R
MODF
0
0
0
SPI1SR
W
R
0
0
0
0
0
Reserved
SPI1DR
Reserved
Reserved
W
R
Bit7
0
6
0
5
0
4
0
3
0
2
0
1
0
Bit0
0
W
R
W
R
0
0
0
0
0
0
0
0
W
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 1 Device Overview (MC9S12XDP512V2)
0x00F8–0x00FF Serial Peripheral Interface (SPI2) Map
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
0x00F8
SPI2CR1
SPIE
0
SPE
0
SPTIE
0
MSTR
CPOL
CPHA
0
SSOE
LSBFE
0x00F9
0x00FA
0x00FB
0x00FC
0x00FD
0x00FE
0x00FF
SPI2CR2
SPI2BR
MODFEN BIDIROE
SPISWAI
SPC0
W
R
0
SPIF
0
0
SPPR2
0
SPPR1
SPTEF
SPPR0
SPR2
0
SPR1
0
SPR0
0
W
R
MODF
0
0
0
SPI2SR
W
R
0
0
0
0
0
Reserved
SPI2DR
Reserved
Reserved
W
R
Bit7
0
6
0
5
0
4
0
3
0
2
0
1
0
Bit0
0
W
R
W
R
0
0
0
0
0
0
0
0
W
0x0100–0x010F Flash Control Register (FTX512K4) Map
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
FDIVLD
0x0100
FCLKDIV
PRDIV8
FDIV5
RNV5
FDIV4
RNV4
FDIV3
RNV3
FDIV2
RNV2
FDIV1
SEC1
FDIV0
SEC0
KEYEN1 KEYEN0
0x0101
0x0102
0x0103
0x0104
0x0105
0x0106
0x0107
0x0108
0x0109
0x010A
0x010B
FSEC
FTSTMOD
FCNFG
FPROT
W
R
0
0
0
0
0
0
0
0
0
MRDS
WRALL
0
W
R
CBEIE
CCIE
KEYACC
FPHDIS
PVIOL
W
R
RNV6
FPOPEN
FPHS1
FPHS0
0
FPLDIS
BLANK
FPLS1
0
FPLS0
0
W
R
CCIF
NV6
FSTAT
CBEIF
0
ACCERR
W
R
FCMD
CMDB[6:0]
NV3
W
R
NV7
NV5
NV4
NV2
NV1
NV0
FCTL
W
R
FADDRHI
FADDRHI
FADDRLO
FDATAHI
FDATALO
W
R
FADDRLO
FDATAHI
FDATALO
W
R
W
R
W
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 1 Device Overview (MC9S12XDP512V2)
0x0100–0x010F Flash Control Register (FTX512K4) Map (continued)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
0
0
0
0
0
0
0
0
0x010C
Reserved
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0x010D
0x010E
0x010F
Reserved
Reserved
Reserved
W
R
W
R
W
0x0110–0x011B EEPROM Control Register (EETX4K) Map
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
EDIVLD
0x0110
ECLKDIV
PRDIV8
0
EDIV5
0
EDIV4
0
EDIV3
0
EDIV2
0
EDIV1
0
EDIV0
0
0
0
0x0111
0x0112
0x0113
0x0114
0x0115
0x0116
0x0117
0x0118
0x0119
0x011A
0x011B
Reserved
Reserved
ECNFG
W
R
0
0
0
0
0
0
0
0
0
0
0
0
0
W
R
CBEIE
CCIE
W
R
RNV6
RNV5
RNV4
EPROT
EPOPEN
EPDIS
0
EPS2
EPS1
0
EPS0
0
W
R
CCIF
BLANK
ESTAT
CBEIF
0
PVIOL
ACCERR
W
R
ECMD
CMDB[6:0]
0
W
R
0
0
0
0
0
0
0
0
0
0
0
Reserved
EADDRHI
EADDRLO
EDATAHI
EDATALO
W
R
0
EABHI
W
R
EABLO
W
R
EDHI
W
R
EDLO
W
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Chapter 1 Device Overview (MC9S12XDP512V2)
0x011C–0x011F Memory Map Control (S12XMMC) Map 4 of 4
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
0
0
0
0
0
0x011C
RAMWPC
RPWE
1
AVIE
AVIF
0x011D
0x011E
0x011F
RAMXGU
RAMSHL
RAMSHU
XGU6
SHL6
SHU6
XGU5
SHL5
SHU5
XGU4
SHL4
SHU4
XGU3
SHL3
SHU3
XGU2
SHL2
SHU2
XGU1
SHL1
SHU1
XGU0
SHL0
SHU0
W
R
1
1
W
R
W
0x0120–0x012F Interrupt Module (S12XINT) Map
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
0
0
0
0
0
0
0
0
0x0120
Reserved
0x0121
0x0122
0x0123
0x0124
0x0125
IVBR
IVB_ADDR[7:0]
W
R
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Reserved
Reserved
Reserved
Reserved
W
R
W
R
W
R
W
R
0x0126 INT_XGPRIO
0x0127 INT_CFADDR
0x0128 INT_CFDATA0
0x0129 INT_CFDATA1
0x012A INT_CFDATA2
0x012B INT_CFDATA3
0x012C INT_CFDATA4
0x012D INT_CFDATA5
0x012E INT_CFDATA6
0x012F INT_CFDATA7
XILVL[2:0]
0
W
R
0
0
INT_CFADDR[7:4]
W
R
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
RQST
RQST
RQST
RQST
RQST
RQST
RQST
RQST
PRIOLVL[2:0]
PRIOLVL[2:0]
PRIOLVL[2:0]
PRIOLVL[2:0]
PRIOLVL[2:0]
PRIOLVL[2:0]
PRIOLVL[2:0]
PRIOLVL[2:0]
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
49
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Chapter 1 Device Overview (MC9S12XDP512V2)
0x00130–0x0137 Asynchronous Serial Interface (SCI4) Map
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
1
0x0130
SCI4BDH
IREN
TNP1
TNP0
SBR12
SBR11
SBR10
SBR9
SBR8
1
0x0131
0x0132
0x0130
0x0131
0x0132
0x0133
0x0134
0x0135
0x0136
0x0137
SCI4BDL
SBR7
LOOPS
SBR6
SBR5
SBR4
SBR3
SBR2
ILT
SBR1
PE
SBR0
PT
W
R
1
SCI4CR1
SCI4ASR1
SCI4ACR1
SCI4ACR2
SCI4CR2
SCI4SR1
SCI4SR2
SCI4DRH
SCI4DRL
SCISWAI
0
RSRC
0
M
0
WAKE
0
W
R
2
2
2
RXEDGIF
BERRV
0
BERRIF
BERRIE
BKDIF
BKDIE
BKDFE
W
R
0
0
0
0
0
0
0
0
RXEDGIE
0
W
R
BERRM1 BERRM0
W
R
TIE
TCIE
TC
RIE
ILIE
TE
RE
NF
RWU
FE
SBK
PF
W
R
TDRE
RDRF
IDLE
OR
W
R
0
0
0
RAF
0
AMAP
R8
TXPOL
0
RXPOL
0
BRK13
0
TXDIR
0
W
R
T8
W
R
R7
T7
R6
T6
R5
T5
R4
T4
R3
T3
R2
T2
R1
T1
R0
T0
W
1
Those registers are accessible if the AMAP bit in the SCI4SR2 register is set to zero
Those registers are accessible if the AMAP bit in the SCI4SR2 register is set to one
2
0x0138–0x013F Asynchronous Serial Interface (SCI5) Map
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
1
0x0138
SCI5BDH
IREN
TNP1
TNP0
SBR12
SBR11
SBR10
SBR9
SBR8
1
1
0x0139
0x013A
0x0138
0x0139
SCI5BDL
SBR7
LOOPS
SBR6
SBR5
SBR4
SBR3
SBR2
ILT
SBR1
PE
SBR0
PT
W
R
SCI5CR1
SCI5ASR1
SCI5ACR1
SCISWAI
0
RSRC
0
M
0
WAKE
0
W
R
2
2
2
RXEDGIF
BERRV
0
BERRIF
BERRIE
BKDIF
BKDIE
BKDFE
W
R
0
0
0
0
0
0
0
0
RXEDGIE
0
W
R
0x013A SCI5ACR2
BERRM1 BERRM0
W
R
0x013B
0x013C
SCI5CR2
SCI5SR1
TIE
TCIE
TC
RIE
ILIE
TE
RE
NF
RWU
FE
SBK
PF
W
R
TDRE
RDRF
IDLE
OR
W
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 1 Device Overview (MC9S12XDP512V2)
0x0138–0x013F Asynchronous Serial Interface (SCI5) Map (continued)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
0
0
RAF
0x013D
SCI5SR2
AMAP
R8
TXPOL
0
RXPOL
0
BRK13
0
TXDIR
0
0
0
0x013E
0x013F
SCI5DRH
SCI5DRL
T8
W
R
R7
T7
R6
T6
R5
T5
R4
T4
R3
T3
R2
T2
R1
T1
R0
T0
W
1
Those registers are accessible if the AMAP bit in the SCI5SR2 register is set to zero
Those registers are accessible if the AMAP bit in the SCI5SR2 register is set to one
2
0x0140–0x017F Freescale Scalable CAN — MSCAN (CAN0) Map
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
RXACT
SYNCH
0x0140
CAN0CTL0
RXFRM
CSWAI
TIME
WUPE
SLPRQ
SLPAK
INITRQ
INITAK
0x0141
0x0142
0x0143
0x0144
0x0145
0x0146
0x0147
0x0148
0x0149
CAN0CTL1
CAN0BTR0
CAN0BTR1
CAN0RFLG
CAN0RIER
CAN0TFLG
CAN0TIER
CAN0TARQ
CAN0TAAK
CANE
SJW1
SAMP
WUPIF
CLKSRC
SJW0
LOOPB
BRP5
LISTEN
BRP4
BORM
BRP3
WUPM
BRP2
W
R
BRP1
TSEG11
OVRIF
OVRIE
TXE1
BRP0
TSEG10
RXF
W
R
TSEG22
CSCIF
TSEG21
RSTAT1
TSEG20
RSTAT0
TSEG13
TSTAT1
TSEG12
TSTAT0
W
R
W
R
WUPIE
0
CSCIE
0
RSTATE1 RSTATE0 TSTATE1 TSTATE0
RXFIE
TXE0
W
R
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
TXE2
W
R
0
0
0
0
0
0
0
0
0
0
0
0
0
0
TXEIE2
TXEIE1
TXEIE0
W
R
ABTRQ2 ABTRQ1 ABTRQ0
W
R
ABTAK2
ABTAK1
ABTAK0
W
R
0x014A CAN0TBSEL
TX2
TX1
TX0
W
R
IDHIT2
IDHIT1
IDHIT0
0x014B
0x014C
0x014D
CAN0IDAC
Reserved
IDAM1
0
IDAM0
0
W
R
0
0
0
0
0
W
R
0
0
CAN0MISC
BOHOLD
W
R
RXERR7 RXERR6 RXERR5 RXERR4 RXERR3 RXERR2 RXERR1 RXERR0
TXERR7 TXERR6 TXERR5 TXERR4 TXERR3 TXERR2 TXERR1 TXERR0
0x014E CAN0RXERR
0x014F CAN0TXERR
W
R
W
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
51
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Chapter 1 Device Overview (MC9S12XDP512V2)
0x0140–0x017F Freescale Scalable CAN — MSCAN (CAN0) Map (continued)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
0x0150– CAN0IDAR0–
0x0153 CAN0IDAR3
AC7
AC6
AC5
AC4
AC3
AC2
AC1
AC0
0x0154– CAN0IDMR0–
0x0157 CAN0IDMR3
AM7
AC7
AM6
AC6
AM5
AC5
AM4
AC4
AM3
AC3
AM2
AC2
AM1
AC1
AM0
AC0
W
R
0x0158– CAN0IDAR4–
0x015B CAN0IDAR7
W
R
0x015C
CAN0IDMR4–
–
AM7
AM6
AM5
AM4
AM3
AM2
AM1
AM0
W
CAN0IDMR7
0x015F
R
FOREGROUND RECEIVE BUFFER
(See Detailed MSCAN Foreground Receive and Transmit Buffer Layout)
0x0160–
CAN0RXFG
0x016F
W
R
0x0170–
CAN0TXFG
0x017F
FOREGROUND TRANSMIT BUFFER
(See Detailed MSCAN Foreground Receive and Transmit Buffer Layout)
W
Detailed MSCAN Foreground Receive and Transmit Buffer Layout
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Extended ID
R
R
ID28
ID10
ID27
ID9
ID26
ID8
ID25
ID7
ID24
ID6
ID23
ID5
ID22
ID4
ID21
ID3
0xXXX0 Standard ID
CANxRIDR0
W
R
Extended ID
ID20
ID2
ID19
ID1
ID18
ID0
SRR=1
RTR
IDE=1
IDE=0
ID17
ID9
ID16
ID8
ID15
ID7
0xXXX1 Standard ID
CANxRIDR1
R
W
R
Extended ID
ID14
ID6
ID13
ID5
ID12
ID4
ID11
ID3
ID10
ID2
0xXXX2 Standard ID
CANxRIDR2
R
W
R
Extended ID
ID1
ID0
RTR
0xXXX3 Standard ID
CANxRIDR3
R
W
R
0xXXX4
DB7
DB6
DB5
DB4
DB3
DB2
DB1
DB0
CANxRDSR0–
–
W
CANxRDSR7
0xXXXB
R
W
R
DLC3
DLC2
DLC1
DLC0
0xXXXC CANRxDLR
0xXXXD
Reserved
W
R
TSR15
TSR7
TSR14
TSR6
TSR13
TSR5
TSR12
TSR4
TSR11
TSR3
TSR10
TSR2
TSR9
TSR1
TSR8
TSR0
0xXXXE CANxRTSRH
W
R
0xXXXF CANxRTSRL
Extended ID
W
R
ID28
ID10
ID27
ID9
ID26
ID8
ID25
ID7
ID24
ID6
ID23
ID5
ID22
ID4
ID21
ID3
CANxTIDR0
0xXX10
W
R
Standard ID
W
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 1 Device Overview (MC9S12XDP512V2)
Detailed MSCAN Foreground Receive and Transmit Buffer Layout (continued)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Extended ID
CANxTIDR1
Standard ID
R
W
R
ID20
ID19
ID18
SRR=1
IDE=1
ID17
ID16
ID15
0xXX0x
XX10
ID2
ID1
ID0
RTR
ID11
IDE=0
ID10
W
R
Extended ID
CANxTIDR2
Standard ID
ID14
ID13
ID12
ID9
ID1
ID8
ID0
ID7
W
R
0xXX12
0xXX13
W
R
Extended ID
CANxTIDR3
Standard ID
ID6
ID5
ID4
ID3
ID2
RTR
W
R
W
R
0xXX14
–
0xXX1B
CANxTDSR0–
CANxTDSR7
DB7
DB6
DB5
DB4
DB3
DB2
DB1
DB0
W
R
W
R
0xXX1C CANxTDLR
0xXX1D CANxTTBPR
0xXX1E CANxTTSRH
0xXX1F CANxTTSRL
DLC3
DLC2
DLC1
DLC0
PRIO7
TSR15
PRIO6
TSR14
PRIO5
TSR13
PRIO4
TSR12
PRIO3
TSR11
PRIO2
TSR10
PRIO1
TSR9
PRIO0
TSR8
W
R
W
R
TSR7
TSR6
TSR5
TSR4
TSR3
TSR2
TSR1
TSR0
W
0x0180–0x01BF Freescale Scalable CAN — MSCAN (CAN1) Map (Sheet 1 of 3)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
RXACT
SYNCH
0x0180
CAN1CTL0
RXFRM
CSWAI
TIME
WUPE
SLPRQ
SLPAK
INITRQ
INITAK
0x0181
0x0182
0x0183
0x0184
0x0185
0x0186
0x0187
0x0188
CAN1CTL1
CAN1BTR0
CAN1BTR1
CAN1RFLG
CAN1RIER
CAN1TFLG
CAN1TIER
CAN1TARQ
CANE
SJW1
SAMP
WUPIF
CLKSRC
SJW0
LOOPB
BRP5
LISTEN
BRP4
BORM
BRP3
WUPM
BRP2
W
R
BRP1
TSEG11
OVRIF
OVRIE
TXE1
BRP0
TSEG10
RXF
W
R
TSEG22
CSCIF
TSEG21
RSTAT1
TSEG20
RSTAT0
TSEG13
TSTAT1
TSEG12
TSTAT0
W
R
W
R
WUPIE
0
CSCIE
0
RSTATE1 RSTATE0 TSTATE1 TSTATE0
RXFIE
TXE0
W
R
0
0
0
0
0
0
0
0
0
TXE2
W
R
0
0
0
0
TXEIE2
TXEIE1
TXEIE0
W
R
ABTRQ2 ABTRQ1 ABTRQ0
W
MC9S12XDP512 Data Sheet, Rev. 2.11
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53
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Chapter 1 Device Overview (MC9S12XDP512V2)
0x0180–0x01BF Freescale Scalable CAN — MSCAN (CAN1) Map (Sheet 2 of 3)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
0
0
0
0
0
ABTAK2
ABTAK1
ABTAK0
0x0189
CAN1TAAK
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0x018A CAN1TBSEL
TX2
TX1
TX0
W
R
IDHIT2
IDHIT1
IDHIT0
0x018B
0x018C
0x018D
CAN1IDAC
Reserved
IDAM1
0
IDAM0
0
W
R
0
0
0
0
0
W
R
0
0
CAN1MISC
BOHOLD
W
R
RXERR7 RXERR6 RXERR5 RXERR4 RXERR3 RXERR2 RXERR1 RXERR0
TXERR7 TXERR6 TXERR5 TXERR4 TXERR3 TXERR2 TXERR1 TXERR0
0x018E CAN1RXERR
0x018F CAN1TXERR
0x0190 CAN1IDAR0
0x0191 CAN1IDAR1
0x0192 CAN1IDAR2
0x0193 CAN1IDAR3
0x0194 CAN1IDMR0
0x0195 CAN1IDMR1
0x0196 CAN1IDMR2
0x0197 CAN1IDMR3
0x0198 CAN1IDAR4
0x0199 CAN1IDAR5
0x019A CAN1IDAR6
0x019B CAN1IDAR7
0x019C CAN1IDMR4
0x019D CAN1IDMR5
0x019E CAN1IDMR6
W
R
W
R
AC7
AC7
AC7
AC7
AM7
AM7
AM7
AM7
AC7
AC7
AC7
AC7
AM7
AM7
AM7
AC6
AC6
AC6
AC6
AM6
AM6
AM6
AM6
AC6
AC6
AC6
AC6
AM6
AM6
AM6
AC5
AC5
AC5
AC5
AM5
AM5
AM5
AM5
AC5
AC5
AC5
AC5
AM5
AM5
AM5
AC4
AC4
AC4
AC4
AM4
AM4
AM4
AM4
AC4
AC4
AC4
AC4
AM4
AM4
AM4
AC3
AC3
AC3
AC3
AM3
AM3
AM3
AM3
AC3
AC3
AC3
AC3
AM3
AM3
AM3
AC2
AC2
AC2
AC2
AM2
AM2
AM2
AM2
AC2
AC2
AC2
AC2
AM2
AM2
AM2
AC1
AC1
AC1
AC1
AM1
AM1
AM1
AM1
AC1
AC1
AC1
AC1
AM1
AM1
AM1
AC0
AC0
AC0
AC0
AM0
AM0
AM0
AM0
AC0
AC0
AC0
AC0
AM0
AM0
AM0
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 1 Device Overview (MC9S12XDP512V2)
0x0180–0x01BF Freescale Scalable CAN — MSCAN (CAN1) Map (Sheet 3 of 3)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
0x019F CAN1IDMR7
AM7
AM6
AM5
AM4
AM3
AM2
AM1
AM0
FOREGROUND RECEIVE BUFFER
0x01A0–
CAN1RXFG
0x01AF
(See Detailed MSCAN Foreground Receive and Transmit Buffer Layout)
W
R
0x01B0–
CAN1TXFG
0x01BF
FOREGROUND TRANSMIT BUFFER
(See Detailed MSCAN Foreground Receive and Transmit Buffer Layout)
W
0x01C0–0x01FF Freescale Scalable CAN — MSCAN (CAN2) Map
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
RXACT
SYNCH
0x01C0
CAN2CTL0
RXFRM
CSWAI
TIME
WUPE
SLPRQ
SLPAK
INITRQ
INITAK
0x01C1
CAN2CTL1
CANE
SJW1
SAMP
WUPIF
CLKSRC
SJW0
LOOPB
BRP5
LISTEN
BRP4
BORM
BRP3
WUPM
BRP2
W
R
0x01C2 CAN2BTR0
0x01C3 CAN2BTR1
0x01C4 CAN2RFLG
BRP1
TSEG11
OVRIF
OVRIE
TXE1
BRP0
TSEG10
RXF
W
R
TSEG22
CSCIF
TSEG21
RSTAT1
TSEG20
RSTAT0
TSEG13
TSTAT1
TSEG12
TSTAT0
W
R
W
R
0x01C5
0x01C6 CAN2TFLG
0x01C7 CAN2TIER
0x01C8 CAN2TARQ
0x01C9 CAN2TAAK
0x01CA CAN2TBSEL
CAN2RIER
WUPIE
0
CSCIE
0
RSTATE1 RSTATE0 TSTATE1 TSTATE0
RXFIE
TXE0
W
R
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
TXE2
W
R
0
0
0
0
0
0
0
0
0
0
0
0
0
0
TXEIE2
TXEIE1
TXEIE0
W
R
ABTRQ2 ABTRQ1 ABTRQ0
W
R
ABTAK2
ABTAK1
ABTAK0
W
R
TX2
TX1
TX0
W
R
IDHIT2
IDHIT1
IDHIT0
0x01CB
0x01CC
CAN2IDAC
Reserved
IDAM1
0
IDAM0
0
W
R
0
0
0
0
0
W
R
0
0
0x01CD CAN2MISC
0x01CE CAN2RXERR
0x01CF CAN2TXERR
0x01D0 CAN2IDAR0
BOHOLD
W
R
RXERR7 RXERR6 RXERR5 RXERR4 RXERR3 RXERR2 RXERR1 RXERR0
TXERR7 TXERR6 TXERR5 TXERR4 TXERR3 TXERR2 TXERR1 TXERR0
W
R
W
R
AC7
AC6
AC5
AC4
AC3
AC2
AC1
AC0
W
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 1 Device Overview (MC9S12XDP512V2)
0x01C0–0x01FF Freescale Scalable CAN — MSCAN (CAN2) Map (continued)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
0x01D1 CAN2IDAR1
0x01D2 CAN2IDAR2
0x01D3 CAN2IDAR3
0x01D4 CAN2IDMR0
0x01D5 CAN2IDMR1
0x01D6 CAN2IDMR2
0x01D7 CAN2IDMR3
0x01D8 CAN2IDAR4
0x01D9 CAN2IDAR5
0x01DA CAN2IDAR6
0x01DB CAN2IDAR7
0x01DC CAN2IDMR4
0x01DD CAN2IDMR5
0x01DE CAN2IDMR6
0x01DF CAN2IDMR7
AC7
AC6
AC5
AC4
AC3
AC2
AC1
AC0
AC7
AC7
AM7
AM7
AM7
AM7
AC7
AC7
AC7
AC7
AM7
AM7
AM7
AM7
AC6
AC6
AM6
AM6
AM6
AM6
AC6
AC6
AC6
AC6
AM6
AM6
AM6
AM6
AC5
AC5
AM5
AM5
AM5
AM5
AC5
AC5
AC5
AC5
AM5
AM5
AM5
AM5
AC4
AC4
AM4
AM4
AM4
AM4
AC4
AC4
AC4
AC4
AM4
AM4
AM4
AM4
AC3
AC3
AM3
AM3
AM3
AM3
AC3
AC3
AC3
AC3
AM3
AM3
AM3
AM3
AC2
AC2
AM2
AM2
AM2
AM2
AC2
AC2
AC2
AC2
AM2
AM2
AM2
AM2
AC1
AC1
AM1
AM1
AM1
AM1
AC1
AC1
AC1
AC1
AM1
AM1
AM1
AM1
AC0
AC0
AM0
AM0
AM0
AM0
AC0
AC0
AC0
AC0
AM0
AM0
AM0
AM0
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
FOREGROUND RECEIVE BUFFER
0x01E0–
CAN2RXFG
0x01EF
(See Detailed MSCAN Foreground Receive and Transmit Buffer Layout)
W
R
0x01F0–
CAN2TXFG
0x01FF
FOREGROUND TRANSMIT BUFFER
(See Detailed MSCAN Foreground Receive and Transmit Buffer Layout)
W
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 1 Device Overview (MC9S12XDP512V2)
0x0200–0x023F Freescale Scalable CAN — MSCAN (CAN3)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
RXACT
SYNCH
0x0200
CAN3CTL0
RXFRM
CSWAI
TIME
WUPE
SLPRQ
SLPAK
INITRQ
INITAK
0x0201
0x0202
0x0203
0x0204
0x0205
0x0206
0x0207
0x0208
0x0209
CAN3CTL1
CAN3BTR0
CAN3BTR1
CAN3RFLG
CAN3RIER
CAN3TFLG
CAN3TIER
CAN3TARQ
CAN3TAAK
CANE
SJW1
SAMP
WUPIF
CLKSRC
SJW0
LOOPB
BRP5
LISTEN
BRP4
BORM
BRP3
WUPM
BRP2
W
R
BRP1
TSEG11
OVRIF
OVRIE
TXE1
BRP0
TSEG10
RXF
W
R
TSEG22
CSCIF
TSEG21
RSTAT1
TSEG20
RSTAT0
TSEG13
TSTAT1
TSEG12
TSTAT0
W
R
W
R
WUPIE
0
CSCIE
0
RSTATE1 RSTATE0 TSTATE1 TSTATE0
RXFIE
TXE0
W
R
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
TXE2
W
R
0
0
0
0
0
0
0
0
0
0
0
0
0
0
TXEIE2
TXEIE1
TXEIE0
W
R
ABTRQ2 ABTRQ1 ABTRQ0
W
R
ABTAK2
ABTAK1
ABTAK0
W
R
0x020A CAN3TBSEL
TX2
TX1
TX0
W
R
IDHIT2
IDHIT1
IDHIT0
0x020B
0x020C
0x020D
CAN3IDAC
Reserved
Reserved
IDAM1
0
IDAM0
0
W
R
0
0
0
0
0
W
R
0
0
BOHOLD
W
R
RXERR7 RXERR6 RXERR5 RXERR4 RXERR3 RXERR2 RXERR1 RXERR0
TXERR7 TXERR6 TXERR5 TXERR4 TXERR3 TXERR2 TXERR1 TXERR0
0x020E CAN3RXERR
0x020F CAN3TXERR
0x0210 CAN3IDAR0
0x0211 CAN3IDAR1
0x0212 CAN3IDAR2
0x0213 CAN3IDAR3
0x0214 CAN3IDMR0
0x0215 CAN3IDMR1
W
R
W
R
AC7
AC7
AC7
AC7
AM7
AM7
AC6
AC6
AC6
AC6
AM6
AM6
AC5
AC5
AC5
AC5
AM5
AM5
AC4
AC4
AC4
AC4
AM4
AM4
AC3
AC3
AC3
AC3
AM3
AM3
AC2
AC2
AC2
AC2
AM2
AM2
AC1
AC1
AC1
AC1
AM1
AM1
AC0
AC0
AC0
AC0
AM0
AM0
W
R
W
R
W
R
W
R
W
R
W
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
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Chapter 1 Device Overview (MC9S12XDP512V2)
0x0200–0x023F Freescale Scalable CAN — MSCAN (CAN3) (continued)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
0x0216 CAN3IDMR2
0x0217 CAN3IDMR3
0x0218 CAN3IDAR4
0x0219 CAN3IDAR5
0x021A CAN3IDAR6
0x021B CAN3IDAR7
0x021C CAN3IDMR4
0x021D CAN3IDMR5
0x021E CAN3IDMR6
0x021F CAN3IDMR7
AM7
AM6
AM5
AM4
AM3
AM2
AM1
AM0
AM7
AC7
AC7
AC7
AC7
AM7
AM7
AM7
AM7
AM6
AC6
AC6
AC6
AC6
AM6
AM6
AM6
AM6
AM5
AC5
AC5
AC5
AC5
AM5
AM5
AM5
AM5
AM4
AC4
AC4
AC4
AC4
AM4
AM4
AM4
AM4
AM3
AC3
AC3
AC3
AC3
AM3
AM3
AM3
AM3
AM2
AC2
AC2
AC2
AC2
AM2
AM2
AM2
AM2
AM1
AC1
AC1
AC1
AC1
AM1
AM1
AM1
AM1
AM0
AC0
AC0
AC0
AC0
AM0
AM0
AM0
AM0
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
FOREGROUND RECEIVE BUFFER
0x0220–
CAN3RXFG
0x022F
(See Detailed MSCAN Foreground Receive and Transmit Buffer Layout)
W
R
0x0230–
CAN3TXFG
0x023F
FOREGROUND TRANSMIT BUFFER
(See Detailed MSCAN Foreground Receive and Transmit Buffer Layout)
W
0x0240–0x027F Port Integration Module PIM_9DX (PIM) Map (Sheet 1 of 4)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
0x0240
PTT
PTT7
PTT6
PTT5
PTT4
PTT3
PTT2
PTT1
PTT0
PTIT7
PTIT6
PTIT5
PTIT4
PTIT3
PTIT2
PTIT1
PTIT0
0x0241
0x0242
0x0243
0x0244
0x0245
0x0246
0x0247
PTIT
DDRT
DDRT7
RDRT7
PERT7
DDRT7
RDRT6
PERT6
DDRT5
RDRT5
PERT5
DDRT4
RDRT4
PERT4
DDRT3
RDRT3
PERT3
DDRT2
RDRT2
PERT2
DDRT1
RDRT1
PERT1
DDRT0
RDRT0
PERT0
RDRT
PERT
PPST
PPST7
0
PPST6
0
PPST5
0
PPST4
0
PPST3
0
PPST2
0
PPST1
0
PPST0
0
Reserved
Reserved
0
0
0
0
0
0
0
0
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 1 Device Overview (MC9S12XDP512V2)
0x0240–0x027F Port Integration Module PIM_9DX (PIM) Map (Sheet 2 of 4)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
0x0248
PTS
PTS7
PTS6
PTS5
PTS4
PTS3
PTS2
PTS1
PTS0
PTIS7
PTIS6
PTIS5
PTIS4
PTIS3
PTIS2
PTIS1
PTIS0
0x0249
0x024A
0x024B
0x024C
0x024D
0x024E
0x024F
0x0250
0x0251
0x0252
0x0253
0x0254
0x0255
0x0256
0x0257
0x0258
0x0259
0x025A
0x025B
0x025C
0x025D
0x025E
0x025F
PTIS
DDRS
RDRS
PERS
PPSS
WOMS
Reserved
PTM
DDRS7
RDRS7
PERS7
PPSS7
DDRS7
RDRS6
PERS6
PPSS6
DDRS5
RDRS5
PERS5
PPSS5
DDRS4
RDRS4
PERS4
PPSS4
DDRS3
RDRS3
PERS3
PPSS3
DDRS2
RDRS2
PERS2
PPSS2
DDRS1
RDRS1
PERS1
PPSS1
DDRS0
RDRS0
PERS0
PPSS0
WOMS7
0
WOMS6
0
WOMS5
0
WOMS4
0
WOMS3
0
WOMS2
0
WOMS1
0
WOMS0
0
PTM7
PTM6
PTM5
PTM4
PTM3
PTM2
PTM1
PTM0
PTIM7
PTIM6
PTIM5
PTIM4
PTIM3
PTIM2
PTIM1
PTIM0
PTIM
DDRM
RDRM
PERM
PPSM
WOMM
MODRR
PTP
DDRM7
RDRM7
PERM7
PPSM7
DDRM7
RDRM6
PERM6
PPSM6
DDRM5
RDRM5
PERM5
PPSM5
DDRM4
RDRM4
PERM4
PPSM4
DDRM3
RDRM3
PERM3
PPSM3
DDRM2
RDRM2
PERM2
PPSM2
DDRM1
RDRM1
PERM1
PPSM1
DDRM0
RDRM0
PERM0
PPSM0
WOMM7 WOMM6 WOMM5 WOMM4 WOMM3 WOMM2 WOMM1 WOMM0
0
MODRR6 MODRR5 MODRR4 MODRR3 MODRR2 MODRR1 MODRR0
PTP7
PTP6
PTP5
PTP4
PTP3
PTP2
PTP1
PTP0
PTIP7
PTIP6
PTIP5
PTIP4
PTIP3
PTIP2
PTIP1
PTIP0
PTIP
DDRP
RDRP
PERP
PPSP
PIEP
DDRP7
RDRP7
PERP7
PPSP7
PIEP7
DDRP7
RDRP6
PERP6
PPSP6
PIEP6
DDRP5
RDRP5
PERP5
PPSP5
PIEP5
DDRP4
RDRP4
PERP4
PPSP4
PIEP4
DDRP3
RDRP3
PERP3
PPSP3
PIEP3
DDRP2
RDRP2
PERP2
PPSP2
PIEP2
DDRP1
RDRP1
PERP1
PPSP1
PIEP1
DDRP0
RDRP0
PERP0
PPSS0
PIEP0
PIFP
PIFP7
PIFP6
PIFP5
PIFP4
PIFP3
PIFP2
PIFP1
PIFP0
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 1 Device Overview (MC9S12XDP512V2)
0x0240–0x027F Port Integration Module PIM_9DX (PIM) Map (Sheet 3 of 4)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
0x0260
PTH
PTH7
PTH6
PTH5
PTH4
PTH3
PTH2
PTH1
PTH0
PTIH7
PTIH6
PTIH5
PTIH4
PTIH3
PTIH2
PTIH1
PTIH0
0x0261
0x0262
0x0263
0x0264
0x0265
0x0266
0x0267
0x0268
0x0269
0x026A
0x026B
0x026C
0x026D
0x026E
0x026F
0x0270
0x0271
0x0272
0x0273
0x0274
0x0275
0x0276
0x0277
PTIH
DDRH
RDRH
PERH
DDRH7
RDRH7
PERH7
PPSH7
PIEH7
DDRH7
RDRH6
PERH6
PPSH6
PIEH6
DDRH5
RDRH5
PERH5
PPSH5
PIEH5
DDRH4
RDRH4
PERH4
PPSH4
PIEH4
DDRH3
RDRH3
PERH3
PPSH3
PIEH3
DDRH2
RDRH2
PERH2
PPSH2
PIEH2
DDRH1
RDRH1
PERH1
PPSH1
PIEH1
DDRH0
RDRH0
PERH0
PPSH0
PIEH0
PPSH
PIEH
PIFH
PIFH7
PIFH6
PIFH5
PIFH4
PIFH3
0
PIFH2
PIFH1
PIFH0
PTJ
PTJ7
PTJ6
PTJ5
PTJ4
PTJ2
PTJ1
PTJ0
PTIJ7
PTIJ6
PTIJ5
PTIJ4
0
0
0
0
0
0
0
0
PTIJ2
PTIJ1
PTIJ0
PTIJ
DDRJ
DDRJ7
RDRJ7
PERJ7
PPSJ7
PIEJ7
DDRJ7
RDRJ6
PERJ6
PPSJ6
PIEJ6
DDRJ5
RDRJ5
PERJ5
PPSJ5
PIEJ5
DDRJ4
RDRJ4
PERJ4
PPSJ4
PIEJ4
DDRJ2
RDRJ2
PERJ2
PPSJ2
PIEJ2
DDRJ1
RDRJ1
PERJ1
PPSJ1
PIEJ1
DDRJ0
RDRJ0
PERJ0
PPSJ0
PIEJ0
RDRJ
PERJ
PPSJ
PIEJ
PIFJ
PIFJ7
0
PIFJ6
0
PIFJ5
0
PIFJ4
0
PIFJ2
0
PIFJ1
0
PIFJ0
0
Reserved
PT1AD0
Reserved
DDR1AD0
Reserved
RDR1AD0
Reserved
PER1AD0
PT1AD07 PT1AD06 PT1AD05 PT1AD04 PT1AD03 PT1AD02 PT1AD01 PT1AD00
0
0
0
0
0
0
0
0
DDR1AD0 DDR1AD0 DDR1AD0 DDR1AD0 DDR1AD0 DDR1AD0 DDR1AD0 DDR1AD0
7
6
5
4
3
2
1
1
0
0
0
0
0
0
0
0
RDR1AD0 RDR1AD0 RDR1AD0 RDR1AD0 RDR1AD0 RDR1AD0 RDR1AD0 RDR1AD0
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
0
PER1AD0 PER1AD0 PER1AD0 PER1AD0 PER1AD0 PER1AD0 PER1AD0 PER1AD0
7
6
5
4
3
2
1
0
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 1 Device Overview (MC9S12XDP512V2)
0x0240–0x027F Port Integration Module PIM_9DX (PIM) Map (Sheet 4 of 4)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
PT0AD1
23
PT0AD1
22
PT0AD1
21
PT0AD1
20
PT0AD1
19
PT0AD1
18
PT0AD1
17
PT0AD1
16
0x0278
PT0AD1
PT1AD1
15
PT1AD1
14
PT1AD1
13
PT1AD1
12
PT1AD1
11
PT1AD1
10
PT1AD1
9
PT1AD1
8
0x0279
0x027A
0x027B
0x027C
0x027D
0x027E
0x027F
PT1AD1
DDR0AD1
DDR1AD1
RDR0AD1
RDR1AD1
PER0AD1
PER1AD1
DDR0AD1 DDR0AD1 DDR0AD1 DDR0AD1 DDR0AD1 DDR0AD1 DDR0AD1 DDR0AD1
23 22 21 20 19 18 17 16
DDR1AD1 DDR1AD1 DDR1AD1 DDR1AD1 DDR1AD1 DDR1AD1 DDR1AD1 DDR1AD1
15 14 13 12 11 10
RDR0AD1 RDR0AD1 RDR0AD1 RDR0AD1 RDR0AD1 RDR0AD1 RDR0AD1 RDR0AD1
23 22 21 20 19 18 17 16
RDR1AD1 RDR1AD1 RDR1AD1 RDR1AD1 RDR1AD1 RDR1AD1 RDR1AD1 RDR1AD1
15 14 13 12 11 10
PER0AD1 PER0AD1 PER0AD1 PER0AD1 PER0AD1 PER0AD1 PER0AD1 PER0AD1
23 22 21 20 19 18 17 16
PER1AD1 PER1AD1 PER1AD1 PER1AD1 PER1AD1 PER1A1D PER1AD1 PER1AD1
9
8
9
8
15
14
13
12
11
10
9
8
0x0280–0x02BF Freescale Scalable CAN — MSCAN (CAN4) Map
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
RXACT
SYNCH
0x0280
CAN4CTL0
RXFRM
CSWAI
TIME
WUPE
SLPRQ
SLPAK
INITRQ
INITAK
0x0281
0x0282
0x0283
0x0284
0x0285
0x0286
0x0287
0x0288
0x0289
CAN4CTL1
CAN4BTR0
CAN4BTR1
CAN4RFLG
CAN4RIER
CAN4TFLG
CAN4TIER
CAN4TARQ
CAN4TAAK
CANE
SJW1
SAMP
WUPIF
CLKSRC
SJW0
LOOPB
BRP5
LISTEN
BRP4
BORM
BRP3
WUPM
BRP2
W
R
BRP1
TSEG11
OVRIF
OVRIE
TXE1
BRP0
TSEG10
RXF
W
R
TSEG22
CSCIF
TSEG21
RSTAT1
TSEG20
RSTAT0
TSEG13
TSTAT1
TSEG12
TSTAT0
W
R
W
R
WUPIE
0
CSCIE
0
RSTATE1 RSTATE0 TSTATE1 TSTATE0
RXFIE
TXE0
W
R
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
TXE2
W
R
0
0
0
0
0
0
0
0
0
0
0
0
TXEIE2
TXEIE1
TXEIE0
W
R
ABTRQ2 ABTRQ1 ABTRQ0
W
R
ABTAK2
ABTAK1
ABTAK0
W
R
0x028A CAN4TBSEL
TX2
TX1
TX0
W
R
IDHIT2
IDHIT1
IDHIT0
0x028B
0x028C
CAN4IDAC
Reserved
IDAM1
0
IDAM0
0
W
R
0
0
0
W
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 1 Device Overview (MC9S12XDP512V2)
0x0280–0x02BF Freescale Scalable CAN — MSCAN (CAN4) Map (continued)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
0
0
0
0
0
0
0
0x028D
CAN4MISC
BOHOLD
RXERR7 RXERR6 RXERR5 RXERR4 RXERR3 RXERR2 RXERR1 RXERR0
TXERR7 TXERR6 TXERR5 TXERR4 TXERR3 TXERR2 TXERR1 TXERR0
0x028E CAN4RXERR
0x028F CAN4TXERR
0x0290 CAN4IDAR0
0x0291 CAN4IDAR1
0x0292 CAN4IDAR2
0x0293 CAN4IDAR3
0x0294 CAN4IDMR0
0x0295 CAN4IDMR1
0x0296 CAN4IDMR2
0x0297 CAN4IDMR3
0x0298 CAN4IDAR4
0x0299 CAN4IDAR5
0x029A CAN4IDAR6
0x029B CAN4IDAR7
0x029C CAN4IDMR4
0x029D CAN4IDMR5
0x029E CAN4IDMR6
0x029F CAN4IDMR7
W
R
W
R
AC7
AC7
AC7
AC7
AM7
AM7
AM7
AM7
AC7
AC7
AC7
AC7
AM7
AM7
AM7
AM7
AC6
AC6
AC6
AC6
AM6
AM6
AM6
AM6
AC6
AC6
AC6
AC6
AM6
AM6
AM6
AM6
AC5
AC5
AC5
AC5
AM5
AM5
AM5
AM5
AC5
AC5
AC5
AC5
AM5
AM5
AM5
AM5
AC4
AC4
AC4
AC4
AM4
AM4
AM4
AM4
AC4
AC4
AC4
AC4
AM4
AM4
AM4
AM4
AC3
AC3
AC3
AC3
AM3
AM3
AM3
AM3
AC3
AC3
AC3
AC3
AM3
AM3
AM3
AM3
AC2
AC2
AC2
AC2
AM2
AM2
AM2
AM2
AC2
AC2
AC2
AC2
AM2
AM2
AM2
AM2
AC1
AC1
AC1
AC1
AM1
AM1
AM1
AM1
AC1
AC1
AC1
AC1
AM1
AM1
AM1
AM1
AC0
AC0
AC0
AC0
AM0
AM0
AM0
AM0
AC0
AC0
AC0
AC0
AM0
AM0
AM0
AM0
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
FOREGROUND RECEIVE BUFFER
0x02A0–
CAN4RXFG
0x02AF
(See Detailed MSCAN Foreground Receive and Transmit Buffer Layout)
W
R
0x02B0–
CAN4TXFG
0x02BF
FOREGROUND TRANSMIT BUFFER
(See Detailed MSCAN Foreground Receive and Transmit Buffer Layout)
W
MC9S12XDP512 Data Sheet, Rev. 2.11
62
Freescale Semiconductor
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Chapter 1 Device Overview (MC9S12XDP512V2)
0x02C0–0x02DF Analog-to-Digital Converter 10-Bit 8-Channel (ATD0) Map
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
0
0
0
0
0
0x02C0
ATD0CTL0
WRAP2
WRAP1
WRAP0
0
0
0
0
ETRIG
SEL
ETRIG
CH2
ETRIG
CH1
ETRIG
CH0
0x02C1
0x02C2
0x02C3
0x02C4
0x02C5
ATD0CTL1
ATD0CTL2
ATD0CTL3
ATD0CTL4
ATD0CTL5
W
R
ASCIF
ADPU
0
AFFC
S8C
AWAI
S4C
ETRIGLE ETRIGP
ETRIGE
FIFO
ASCIE
FRZ1
PRS1
W
R
S2C
PRS4
MULT
S1C
FRZ0
PRS0
W
R
SRES8
DJM
SMP1
SMP0
SCAN
PRS3
0
PRS2
W
R
DSGN
0
CC
CB
CA
W
R
0
CC2
CC1
CC0
0x02C6 ATD0STAT0
0x02C7 Reserved
SCF
U
ETORF
U
FIFOR
U
W
R
U
U
U
U
U
U
W
R
U
U
U
U
U
U
U
0x02C8 ATD0TEST0
0x02C9 ATD0TEST1
W
R
U
0
U
0
0
0
0
0
0
0
0
0
0
0
SC
0
W
R
0x02CA
Reserved
W
R
CCF7
0
CCF6
0
CCF5
0
CCF4
0
CCF3
0
CCF2
0
CCF1
0
CCF0
0
0x02CB ATD0STAT1
W
R
0x02CC
0x02CD
0x02CE
Reserved
ATD0DIEN
Reserved
W
R
IEN7
0
IEN6
0
IEN5
0
IEN4
0
IEN3
0
IEN2
0
IEN1
0
IEN0
0
W
R
W
R
Bit7
Bit15
Bit7
6
5
13
0
4
12
0
3
11
0
2
10
0
1
9
0
9
0
9
0
BIT 0
Bit8
0
0x02CF ATD0PTAD0
W
R
14
0x02D0
0x02D1
0x02D2
0x02D3
0x02D4
0x02D5
ATD0DR0H
ATD0DR0L
ATD0DR1H
ATD0DR1L
ATD0DR2H
ATD0DR2L
W
R
Bit6
14
W
R
Bit15
Bit7
13
0
12
0
11
0
10
0
Bit8
0
W
R
Bit6
14
W
R
Bit15
Bit7
13
0
12
0
11
0
10
0
Bit8
0
W
R
Bit6
W
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
63
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Chapter 1 Device Overview (MC9S12XDP512V2)
0x02C0–0x02DF Analog-to-Digital Converter 10-Bit 8-Channel (ATD0) Map (continued)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
Bit15
14
13
12
11
10
9
Bit8
0x02D6
ATD0DR3H
Bit7
Bit15
Bit7
Bit6
14
0
13
0
0
12
0
0
11
0
0
10
0
0
9
0
9
0
9
0
9
0
0
Bit8
0
0x02D7
0x02D8
0x02D9
ATD0DR3L
ATD0DR4H
ATD0DR4L
W
R
W
R
Bit6
14
W
R
Bit15
Bit7
13
0
12
0
11
0
10
0
Bit8
0
0x02DA ATD0DR5H
0x02DB ATD0DR5L
0x02DC ATD0DR6H
0x02DD ATD0DR6L
0x02DE ATD0DR7H
0x02DF ATD0DR7L
W
R
Bit6
14
W
R
Bit15
Bit7
13
0
12
0
11
0
10
0
Bit8
0
W
R
Bit6
14
W
R
Bit15
Bit7
13
0
12
0
11
0
10
0
Bit8
0
W
R
Bit6
W
0x02E0–0x02EF Reserved
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
0
0
0
0
0
0
0
0
0x02E0–
0x02EF
Reserved
0x02F0–0x02F7 Voltage Regulator (VREG_3V3) Map
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
0x02F0 VREGHTCL
0x02F1 VREGCTRL
0x02F2 VREGAPICL
0x02F3 VREGAPITR
0x02F4 VREGAPIRH
0x02F5 VREGAPIRL
Reserved for Factory Test
0
0
0
0
0
0
0
0
0
LVDS
LVIE
LVIF
APICLK
APIFE
APITR0
APIR10
APIE
0
APIF
0
APITR5
0
APITR4
0
APITR3
0
APITR2
0
APITR1
APIR11
APIR9
APIR8
APIR7
0
APIR6
0
APIR5
0
APIR4
0
APIR3
0
APIR2
0
APIR1
0
APIR0
0
0x02F6
0x02F7
Reserved
Reserved
0
0
0
0
0
0
0
0
MC9S12XDP512 Data Sheet, Rev. 2.11
64
Freescale Semiconductor
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Chapter 1 Device Overview (MC9S12XDP512V2)
0x02F8–0x02FF Reserved
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
0
0
0
0
0
0
0
0
0x02F8–
0x02FF
Reserved
W
0x0300–0x0327 Pulse Width Modulator 8-Bit 8-Channel (PWM) Map
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
0x0300
PWME
PWME7
PWME6
PWME5
PWME4
PWME3
PWME2
PWME1
PWME0
0x0301
0x0302
PWMPOL
PWMCLK
PPOL7
PPOL6
PCLK6
PCKB2
CAE6
PPOL5
PCLK5
PCKB1
CAE5
PPOL4
PCLK4
PCKB0
CAE4
PPOL3
PPOL2
PCLK2
PCKA2
CAE2
PPOL1
PCLK1
PCKA1
PPOL0
PCLK0
PCKA0
W
R
PCLK7
0
PCLK3
0
W
R
0x0303 PWMPRCLK
W
R
0x0304
0x0305
0x0306
0x0307
0x0308
0x0309
PWMCAE
PWMCTL
CAE7
CAE3
CAE1
0
CAE0
0
W
R
CON67
0
CON45
0
CON23
0
CON01
0
PSWAI
0
PFRZ
0
W
R
0
0
0
0
PWMTST
Test Only
W
R
0
0
6
0
5
0
4
0
3
0
2
PWMPRSC
PWMSCLA
PWMSCLB
W
R
Bit 7
1
Bit 0
W
R
Bit 7
0
6
0
5
0
4
0
3
0
2
0
1
0
Bit 0
0
W
R
0x030A PWMSCNTA
0x030B PWMSCNTB
W
R
0
0
0
0
0
0
0
0
W
R
Bit 7
0
6
0
6
0
6
0
6
0
6
0
6
0
6
0
6
0
5
0
5
0
5
0
5
0
5
0
5
0
5
0
5
0
4
0
4
0
4
0
4
0
4
0
4
0
4
0
4
0
3
0
3
0
3
0
3
0
3
0
3
0
3
0
3
0
2
0
2
0
2
0
2
0
2
0
2
0
2
0
2
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
Bit 0
0
0x030C
0x030D
0x030E
0x030F
0x0310
0x0311
0x0312
0x0313
PWMCNT0
PWMCNT1
PWMCNT2
PWMCNT3
PWMCNT4
PWMCNT5
PWMCNT6
PWMCNT7
W
R
Bit 7
0
Bit 0
0
W
R
Bit 7
0
Bit 0
0
W
R
Bit 7
0
Bit 0
0
W
R
Bit 7
0
Bit 0
0
W
R
Bit 7
0
Bit 0
0
W
R
Bit 7
0
Bit 0
0
W
R
Bit 7
0
Bit 0
0
W
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
65
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Chapter 1 Device Overview (MC9S12XDP512V2)
0x0300–0x0327 Pulse Width Modulator 8-Bit 8-Channel (PWM) Map
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
0x0314
PWMPER0
Bit 7
6
5
4
3
2
1
Bit 0
0x0315
0x0316
0x0317
0x0318
0x0319
0x031A
0x031B
0x031C
0x031D
0x031E
0x031F
0x0320
0x0321
0x0322
0x0323
PWMPER1
PWMPER2
PWMPER3
PWMPER4
PWMPER5
PWMPER6
PWMPER7
PWMDTY0
PWMDTY1
PWMDTY2
PWMDTY3
PWMDTY4
PWMDTY5
PWMDTY6
PWMDTY7
Bit 7
Bit 7
Bit 7
Bit 7
Bit 7
Bit 7
Bit 7
Bit 7
Bit 7
Bit 7
Bit 7
Bit 7
Bit 7
Bit 7
Bit 7
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
5
5
5
5
5
5
5
5
5
5
5
5
5
5
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
3
3
3
3
3
3
3
3
3
3
3
3
3
3
2
2
2
2
2
2
2
2
2
2
2
2
2
2
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Bit 0
Bit 0
Bit 0
Bit 0
Bit 0
Bit 0
Bit 0
Bit 0
Bit 0
Bit 0
Bit 0
Bit 0
Bit 0
Bit 0
Bit 0
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
5
0
3
0
2
W
R
PWM7IN
PWM7
ENA
0x0324
PWMSDN
PWMIF
PWMIE
PWMLVL
PWM7INL
W
PWM
RSTRT
R
W
R
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0x0325
0x0326
0x0327
Reserved
Reserved
Reserved
W
R
W
MC9S12XDP512 Data Sheet, Rev. 2.11
66
Freescale Semiconductor
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Chapter 1 Device Overview (MC9S12XDP512V2)
0x0328–0x033F Reserved
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
0
0
0
0
0
0
0
0
0x0328–
0x033F
Reserved
W
0x0340–0x0367 Periodic Interrupt Timer (PIT) Map
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
0
0
0
0
PFLMT1
0
0
PFLMT0
0
0x0340
PITCFLMT
PITE
0
PITSWAI
0
PITFRZ
0
0
0
0
0
0
0x0341
0x0342
0x0343
0x0344
0x0345
0x0346
0x0347
0x0348
0x0349
PITFLT
PITCE
W
R
PFLT3
PFLT2
PFLT1
PFLT0
0
0
0
0
0
0
0
0
0
0
0
0
PCE3
PMUX3
PINTE3
PTF3
PCE2
PMUX2
PINTE2
PTF2
PCE1
PMUX1
PINTE1
PTF1
PCE0
PMUX0
PINTE0
PTF0
W
R
PITMUX
PITINTE
PITTF
W
R
W
R
0
W
R
PITMTLD0
PITMTLD1
PITLD0 (hi)
PITLD0 (lo)
PMTLD7 PMTLD6 PMTLD5 PMTLD4 PMTLD3 PMTLD2 PMTLD1 PMTLD0
PMTLD7 PMTLD6 PMTLD5 PMTLD4 PMTLD3 PMTLD2 PMTLD1 PMTLD0
W
R
W
R
PLD15
PLD7
PLD14
PLD6
PLD13
PLD5
PLD12
PLD4
PLD11
PLD3
PLD10
PLD2
PLD9
PLD1
PLD8
PLD0
W
R
W
R
0x034A PITCNT0 (hi)
0x034B PITCNT0 (lo)
PCNT15
PCNT7
PLD15
PLD7
PCNT14
PCNT6
PLD14
PLD6
PCNT13
PCNT5
PLD13
PLD5
PCNT12
PCNT4
PLD12
PLD4
PCNT11
PCNT3
PLD11
PLD3
PCNT10
PCNT2
PLD10
PLD2
PCNT9
PCNT1
PLD9
PCNT8
PCNT0
PLD8
W
R
W
R
0x034C
0x034D
PITLD1 (hi)
PITLD1 (lo)
W
R
PLD1
PLD0
W
R
0x034E PITCNT1 (hi)
0x034F PITCNT1 (lo)
PCNT15
PCNT7
PLD15
PLD7
PCNT14
PCNT6
PLD14
PLD6
PCNT13
PCNT5
PLD13
PLD5
PCNT12
PCNT4
PLD12
PLD4
PCNT11
PCNT3
PLD11
PLD3
PCNT10
PCNT2
PLD10
PLD2
PCNT9
PCNT1
PLD9
PCNT8
PCNT0
PLD8
W
R
W
R
0x0350
0x0351
PITLD2 (hi)
PITLD2 (lo)
W
R
PLD1
PLD0
W
R
0x0352 PITCNT2 (hi)
0x0353 PITCNT2 (lo)
PCNT15
PCNT7
PCNT14
PCNT6
PCNT13
PCNT5
PCNT12
PCNT4
PCNT11
PCNT3
PCNT10
PCNT2
PCNT9
PCNT1
PCNT8
PCNT0
W
R
W
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
67
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Chapter 1 Device Overview (MC9S12XDP512V2)
0x0340–0x0367 Periodic Interrupt Timer (PIT) Map (continued)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
0x0354
PITLD3 (hi)
PLD15
PLD14
PLD13
PLD12
PLD11
PLD10
PLD9
PLD8
0x0355
PITLD3 (lo)
PLD7
PLD6
PLD5
PLD4
PLD3
PLD2
PLD1
PLD0
W
R
0x0356 PITCNT3 (hi)
0x0357 PITCNT3 (lo)
PCNT15
PCNT14
PCNT13
PCNT12
PCNT11
PCNT10
PCNT9
PCNT8
W
R
PCNT7
0
PCNT6
0
PCNT5
0
PCNT4
0
PCNT3
0
PCNT2
0
PCNT1
0
PCNT0
0
W
R
0x0358–
Reserved
0x0367
W
0x0368–0x037F Reserved
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
0
0
0
0
0
0
0
0
0x0368–
0x037F
Reserved
W
0x0380–0x03BF XGATE Map (Sheet 1 of 3)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
0
0
0
0
0
0
0
0x0380
XGMCTL
XGIEM
W
XGS
WEIFM
XGEM
XGFRZM XGDBGM XGSSM XGFACTM
R
W
R
0
0x0381
0x0382
0x0383
0x0384
0x0385
0x0386
0x0387
0x0388
0x0389
0x038A
0x023B
0x023C
XGMCTL
XGCHID
Reserved
XGVBR
XGVBR
XGVBR
XGVBR
XGIF
XGE
0
XGFRZ
XGDBG
XGSS
XGFACT
XGSWEIF
XGIE
XGCHID[6:0]
W
R
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
W
R
W
R
00
W
R
XGVBR[15:8]
W
R
0
XGVBR[7:1]
0
W
R
0
0
0
0
0
0
XGIF_78
W
R
XGIF
XGIF_77 XGIF_76 XGIF_75 XGIF_74 XGIF_73 XGIF_72 XGIF_71 XGIF_70
XGIF_6F XGIF_6E XGIF_6D XGIF_6C XGIF_6B XGIF_6A XGIF_69 XGIF_68
XGIF_67 XGIF_66 XGIF_65 XGIF_64 XGIF_63 XGIF_62 XGIF_61 XGIF_60
XGIF_5F XGIF_5E XGIF_5D XGIF_5C XGIF_5B XGIF_5A XGIF_59 XGIF_58
W
R
XGIF
W
R
XGIF
W
R
XGIF
W
MC9S12XDP512 Data Sheet, Rev. 2.11
68
Freescale Semiconductor
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Chapter 1 Device Overview (MC9S12XDP512V2)
0x0380–0x03BF XGATE Map (Sheet 2 of 3)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
0x038D
XGIF
XGIF_57 XGIF_56 XGIF_55 XGIF_54 XGIF_53 XGIF_52 XGIF_51 XGIF_50
XGIF_4F XGIF_4E XGIF_4D XGIF_4C XGIF_4B XGIF_4A XGIF_49 XGIF_48
XGIF_47 XGIF_46 XGIF_45 XGIF_44 XGIF_43 XGIF_42 XGIF_41 XGIF_40
XGIF_3F XGIF_3E XGIF_3D XGIF_3C XGIF_3B XGIF_3A XGIF_39 XGIF_38
XGIF_37 XGIF_36 XGIF_35 XGIF_34 XGIF_33 XGIF_32 XGIF_31 XGIF_30
XGIF_2F XGIF_2E XGIF_2D XGIF_2C XGIF_2B XGIF_2A XGIF_29 XGIF_28
XGIF_27 XGIF_26 XGIF_25 XGIF_24 XGIF_23 XGIF_22 XGIF_21 XGIF_20
XGIF_1F XGIF_1E XGIF_1D XGIF_1C XGIF_1B XGIF_1A XGIF_19 XGIF_18
XGIF_17 XGIF_16 XGIF_15 XGIF_14 XGIF_13 XGIF_12 XGIF_11 XGIF_10
0x038E
0x038F
0x0390
0x0391
0x0392
0x0393
0x0394
0x0395
0x0396
0x0397
XGIF
XGIF
XGIF
XGIF
XGIF
XGIF
XGIF
XGIF
XGIF
XGIF
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
0
XGIF_0F XGIF_0E XGIF_0D XGIF_0C XGIF_0B XGIF_0A XGIF_09
W
R
0
0
0
0
0
0
0
0
0
0
0
0
0
0
W
R
0
0
0x0398 XGSWT (hi)
0x0399 XGSWT (lo)
0x039A XGSEM (hi)
0x039B XGSEM (lo)
W
R
XGSWTM[7:0]
XGSWT[7:0]
W
R
0
0
0
0
0
0
0
0
W
R
XGSEMM[7:0]
XGSEM[7:0]
W
R
0
0
0
0
0
0
0
0
0
0
0
0
0x039C
0x039D
0x039E
0x039F
0x03A0
0x03A1
0x03A2
0x03A3
Reserved
XGCCR
W
R
XGN
XGZ
XGV
XGC
W
R
XGPC (hi)
XGPC (lo)
Reserved
Reserved
XGR1 (hi)
XGR1 (lo)
XGPC[15:8]
XGPC[7:0]
W
R
W
R
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
W
R
W
R
XGR1[15:8]
XGR1[7:0]
W
R
W
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
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Chapter 1 Device Overview (MC9S12XDP512V2)
0x0380–0x03BF XGATE Map (Sheet 3 of 3)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
W
R
0x03A4
XGR2 (hi)
XGR2[15:8]
0x03A5
0x03A6
0x03A7
0x03A8
0x03A9
0x03AA
0x03AB
0x03AC
0x03AD
0x03AE
0x03AF
XGR2 (lo)
XGR3 (hi)
XGR3 (lo)
XGR4 (hi)
XGR4 (lo)
XGR5 (hi)
XGR5(lo)
XGR6 (hi)
XGR6 (lo)
XGR7 (hi)
XGR7 (lo)
Reserved
XGR2[7:0]
XGR3[15:8]
XGR3[7:0]
XGR4[15:8]
XGR4[7:0]
XGR5[15:8]
XGR5[7:0]
XGR6[15:8]
XGR6[7:0]
XGR7[15:8]
XGR7[7:0]
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
R
0
0
0
0
0
0
0
0
0x03B0–
0x03BF
W
0x03C0–0x07FF Reserved
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R
0
0
0
0
0
0
0
0
0x03C0
–0x07FF
Reserved
W
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 1 Device Overview (MC9S12XDP512V2)
1.1.7
Part ID Assignments
The part ID is located in two 8-bit registers PARTIDH and PARTIDL (addresses 0x001A and 0x001B).
The read-only value is a unique part ID for each revision of the chip. Table 1-2 shows the assigned part ID
number and Mask Set number.
Table 1-2. Assigned Part ID Numbers
1
Device
Mask Set Number
Part ID
MC9S12XDP512
MC9S12XDT384
L15Y
L15Y
0xC410
0xC410
1
The coding is as follows:
Bit 15-12: Major family identifier
Bit 11-8: Minor family identifier
Bit 7-4: Major mask set revision number including FAB transfers
Bit 3-0: Minor — non full — mask set revision
1.2
Signal Description
This section describes signals that connect off-chip. It includes a pinout diagram, a table of signal
properties, and detailed discussion of signals. It is built from the signal description sections of the Block
User Guides of the individual IP blocks on the device.
1.2.1
Device Pinout
The XD-Family of devices offers pin-compatible packaged devices to assist with system development and
accommodate expansion of the application.
The MC9S12XD-Family and MC9S12XA-Family devices are offered in the following package options:
•
•
•
144-pin LQFP package with an external bus interface (address/data bus)
112-pin LQFP without external bus interface
80-pin QFP without external bus interface
Most pins perform two or more functions, as described in more detail in Section 1.2.2, “Signal Properties
Summary”. Figure 1-5, Figure 1-6, and Figure 1-7 show the pin assignments for the various packages.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
71
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Chapter 1 Device Overview (MC9S12XDP512V2)
1
2
3
4
5
6
7
8
108
107
106
105
104
103
102
101
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
SS1/PWM3/KWP3/PP3
SCK1/PWM2/KWP2/PP2
MOSI1/PWM1/KWP1/PP1
MISO1/PWM0/KWP0/PP0
CS1/KWJ2/PJ2
ACC2/ADDR22/PK6
IQSTAT3/ADDR19/PK3
IQSTAT2/ADDR18/PK2
IQSTAT1/ADDR17/PK1
IQSTAT0/ADDR16/PK0
IOC0/PT0
VRH
VDDA
PAD17/AN17
PAD16/AN16
PAD15/AN15
PAD07/AN07
PAD14/AN14
PAD06/AN06
PAD13/AN13
PAD05/AN05
PAD12/AN12
PAD04/AN04
PAD11/AN11
PAD03/AN03
PAD10/AN10
PAD02/AN02
PAD09/AN09
PAD01/AN01
PAD08/AN08
PAD00/AN00
VSS2
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
IOC1/PT1
IOC2/PT2
IOC3/PT3
VDD1
VSS1
IOC4/PT4
MC9S12XD-Family
144-Pin LQFP
IOC5/PT5
IOC6/PT6
IOC7/PT7
ACC1/ADDR21/PK5
ACC0/ADDR20/PK4
TXD2/KWJ1/PJ1
CS3/RXD2/KWJ0/PJ0
MODC/BKGD
VDD2
PD7/DATA7
PD6/DATA6
PD5/DATA5
PD4/DATA4
VDDR2
VDDX2
VSSX2
Pins shown in BOLD-ITALICS are not available on the
DATA8/PC0
VSSR2
112-Pin LQFP or the 80-Pin QFP package option
DATA9/PC1
PA7/ADDR15
PA6/ADDR14
PA5/ADDR13
PA4/ADDR12
PA3/ADDR11
PA2/ADDR10
PA1/ADDR9
PA0/ADDR8
DATA10/PC2
DATA11/PC3
Pins shown in BOLD are not available on the
UDS/ADDR0/PB0
ADDR1/PB1
80-Pin QFP package option
ADDR2/PB2
74
73
ADDR3/PB3
ADDR4/PB4
Figure 1-5. MC9S12XD-Family Pin Assignment 144-Pin LQFP Package
MC9S12XDP512 Data Sheet, Rev. 2.11
72
Freescale Semiconductor
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Chapter 1 Device Overview (MC9S12XDP512V2)
SS1/PWM3/KWP3/PP3
SCK1/PWM2/KWP2/PP2
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
1
V
V
RH
2
DDA
MOSI1/PWM1/KWP1/PP1
MISO1/PWM0/KWP0/PP0
3
PAD15/AN15
PAD07/AN07
PAD14/AN14
PAD06/AN06
PAD13/AN13
PAD05/AN05
PAD12/AN12
PAD04/AN04
PAD11/AN11
PAD03/AN03
PAD10/AN10
PAD02/AN02
PAD09/AN09
PAD01/AN01
PAD08/AN08
PAD00/AN00
4
PK3
PK2
PK1
PK0
5
6
7
8
IOC0/PT0
IOC1/PT1
IOC2/PT2
IOC3/PT3
VDD1
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
MC9S12XD-Family
112-Pin LQFP
VSS1
IOC4/PT4
IOC5/PT5
IOC6/PT6
IOC7/PT7
PK5
Pins shown in BOLD are not available on the
80-Pin QFP package option
V
SS2
PK4
V
DD2
TXD2/KWJ1/PJ1
CS3/RXD2/KWJ0/PJ0
MODC/BKGD
PB0
PA7
PA6
PA5
PA4
PA3
PA2
PA1
PA0
PB1
PB2
PB3
PB4
Figure 1-6. MC9S12XD-Family Pin Assignments 112-Pin LQFP Package
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
73
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Chapter 1 Device Overview (MC9S12XDP512V2)
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
SS1/PWM3/KWP3/PP3
SCK1/PWM2/KWP2/PP2
MOSI1/PWM1/KWP1/PP1
MISO1/PWM0/KWP0/PP0
IOC0/PT0
1
V
V
RH
2
DDA
3
PAD07/AN07
PAD06/AN06
PAD05/AN05
PAD04/AN04
PAD03/AN03
PAD02/AN02
PAD01/AN01
PAD00/AN00
4
5
IOC1/PT1
IOC2/PT2
6
7
IOC3/PT3
V
8
9
DD1
V
10
11
12
13
14
15
16
17
18
19
20
SS1
MC9S12XD-Family
80-Pin QFP
IOC4/PT4
IOC5/PT5
IOC6/PT6
IOC7/PT7
MODC/BKGD
PB0
V
SS2
V
DD2
PA7
PA6
PA5
PA4
PA3
PA2
PA1
PA0
PB1
PB2
PB3
PB4
Figure 1-7. MC9S12XD-Family Pin Assignments 80-Pin QFP Package
MC9S12XDP512 Data Sheet, Rev. 2.11
74
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Chapter 1 Device Overview (MC9S12XDP512V2)
Signal Properties Summary
Table 1-3 summarizes the pin functionality.
Table 1-3. Signal Properties Summary (Sheet 1 of 4)
Internal Pull
Resistor
Pin
Name
Pin
Name
Pin
Name
Pin
Name
Pin
Name
Power
Supply
Description
Reset
Function 1 Function 2 Function 3 Function 4 Function 5
CTRL
State
EXTAL
XTAL
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
V
V
NA
NA
NA
NA
Oscillator pins
DDPLL
DDPLL
RESET
TEST
V
PULLUP
External reset
DDR
N.A.
RESET pin DOWN Test input
V
V
PUCR
Up
Voltage regulator enable
Input
REGEN
DDX
XFC
—
—
—
—
—
—
—
—
—
—
V
NA
NA
Up
PLL loop filter
DDPLL
BKGD
MODC
V
Always on
Background debug
DDR
PAD[23:08] AN[23:8]
V
PER0
AD1/
PER1
AD1
Disabled Port AD inputs of ATD1,
analog inputs of ATD1
DDA
PAD[07:00]
AN[7:0]
—
—
—
—
—
—
—
V
PER1
AD0
Disabled Port AD inputs of ATD0,
analog inputs of ATD0
DDA
DDR
DDR
DDR
PA[7:0] ADDR[15:8] IVD[15:8]
V
V
V
PUCR
PUCR
PUCR
Disabled Port A I/O, address bus,
internal visibility data
PB[7:1]
PB0
ADDR[7:1]
ADDR0
IVD[7:0]
UDS
Disabled Port B I/O, address bus,
internal visibility data
Disabled Port B I/O, address bus,
upper data strobe
PC[7:0]
PD[7:0]
PE7
DATA[15:8]
DATA[7:0]
ECLKX2
—
—
—
—
—
—
—
—
V
V
V
PUCR
PUCR
PUCR
Disabled Port C I/O, data bus
Disabled Port D I/O, data bus
DDR
DDR
DDR
XCLKS
Up
Port E I/O, system clock
output, clock select
PE6
PE5
TAGHI
RE
MODB
MODA
—
—
—
V
V
While RESET
pin is low: down
Port E I/O, tag high, mode
input
DDR
DDR
TAGLO
While RESET
pin is low: down
Port E I/O, read enable,
mode input, tag low input
PE4
PE3
ECLK
—
—
—
—
V
V
PUCR
PUCR
Up
Port E I/O, bus clock output
DDR
LSTRB
LDS
EROMCTL
Up
Port E I/O, low byte data
strobe, EROMON control
DDR
PE2
PE1
R/W
IRQ
WE
—
—
—
—
—
V
V
PUCR
PUCR
Up
Up
Port E I/O, read/write
DDR
DDR
Port E Input, maskable
interrupt
PE0
XIRQ
—
—
—
V
PUCR
Up
Port E input, non-maskable
interrupt
DDR
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
75
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Chapter 1 Device Overview (MC9S12XDP512V2)
Table 1-3. Signal Properties Summary (Sheet 2 of 4)
Internal Pull
Resistor
Pin
Name
Pin
Name
Pin
Name
Pin
Name
Pin
Name
Power
Supply
Description
Reset
State
Function 1 Function 2 Function 3 Function 4 Function 5
CTRL
PH7
PH6
PH5
PH4
PH3
PH2
PH1
PH0
PJ7
KWH7
KWH6
KWH5
KWH4
KWH3
KWH2
KWH1
KWH0
KWJ7
SS2
SCK2
TXD5
RXD5
TXD4
RXD4
—
—
V
V
V
V
V
V
V
V
V
PERH/PPSH Disabled Port H I/O, interrupt, SS of
SPI2, TXD of SCI5
DDR
DDR
DDR
DDR
DDR
DDR
DDR
DDR
DDX
—
PERH/
PPSH
Disabled Port H I/O, interrupt, SCK of
SPI2, RXD of SCI5
MOSI2
MISO2
SS1
—
PERH/
PPSH
Disabled Port H I/O, interrupt, MOSI
of SPI2, TXD of SCI4
—
—
PERH/PPSH Disabled Port H I/O, interrupt, MISO
of SPI2, RXD of SCI4
PERH/PPSH Disabled Port H I/O, interrupt, SS of
SPI1
SCK1
—
—
PERH/PPSH Disabled Port H I/O, interrupt, SCK of
SPI1
MOSI1
MISO1
TXCAN4
—
—
PERH/PPSH Disabled Port H I/O, interrupt, MOSI
of SPI1
—
—
PERH/PPSH Disabled Port H I/O, interrupt, MISO
of SPI1
SCL0
TXCAN0
PERJ/
PPSJ
Up
Port J I/O, interrupt, TX of
CAN4, SCL of IIC0, TX of
CAN0
PJ6
KWJ6
RXCAN4
SDA0
RXCAN0
V
PERJ/
PPSJ
Up
Port J I/O, interrupt, RX of
CAN4, SDA of IIC0, RX of
CAN0
DDX
PJ5
PJ4
KWJ5
KWJ4
KWJ2
KWJ1
KWJ0
EWAIT
SCL1
SDA1
CS2
CS0
—
—
—
—
—
—
—
—
V
V
V
V
V
V
V
PERJ/
PPSJ
Up
Up
Up
Up
Up
Up
Up
Port J I/O, interrupt, SCL of
IIC1, chip select 2
DDX
DDX
DDX
DDX
DDX
DDX
DDX
PERJ/
PPSJ
Port J I/O, interrupt, SDA of
IIC1, chip select 0
PJ2
CS1
PERJ/
PPSJ
Port J I/O, interrupt, chip
select 1
PJ1
TXD2
—
PERJ/
PPSJ
Port J I/O, interrupt, TXD of
SCI2
PJ0
RXD2
CS3
—
PERJ/
PPSJ
Port J I/O, interrupt, RXD of
SCI2
PK7
ROMCTL
ACC[2:0]
PUCR
Port K I/O, EWAIT input,
ROM on control
PK[6:4]
ADDR
[22:20]
—
PUCR
Port K I/O, extended
addresses, access source
for external access
PK3
PK2
PK1
ADDR19
ADDR18
ADDR17
IQSTAT3
IQSTAT2
IQSTAT1
—
—
—
—
—
—
V
V
V
PUCR
PUCR
PUCR
Up
Up
Up
Extended address, PIPE
status
DDX
DDX
DDX
Extended address, PIPE
status
Extended address, PIPE
status
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 1 Device Overview (MC9S12XDP512V2)
Table 1-3. Signal Properties Summary (Sheet 3 of 4)
Internal Pull
Resistor
Pin
Name
Pin
Name
Pin
Name
Pin
Name
Pin
Name
Power
Supply
Description
Reset
Function 1 Function 2 Function 3 Function 4 Function 5
CTRL
State
PK0
PM7
PM6
PM5
PM4
PM3
PM2
ADDR16
TXCAN3
RXCAN3
TXCAN2
RXCAN2
TXCAN1
RXCAN1
IQSTAT0
TXD3
—
—
—
V
V
V
V
V
V
V
PUCR
Up
Extended address, PIPE
status
DDX
DDX
DDX
DDX
DDX
DDX
DDX
TXCAN4
RXCAN4
TXCAN4
RXCAN4
—
PERM/
PPSM
Disabled Port M I/O, TX of CAN3 and
CAN4, TXD of SCI3
RXD3
—
PERM/PPSM Disabled Port M I/O RX of CAN3 and
CAN4, RXD of SCI3
TXCAN0
RXCAN0
TXCAN0
RXCAN0
SCK0
MOSI0
SS0
PERM/PPSM Disabled Port M I/OCAN0, CAN2,
CAN4, SCK of SPI0
PERM/PPSM Disabled Port M I/O, CAN0, CAN2,
CAN4, MOSI of SPI0
PERM/PPSM Disabled Port M I/O TX of CAN1,
CAN0, SS of SPI0
—
MISO0
PERM/PPSM Disabled Port M I/O, RX of CAN1,
CAN0, MISO of SPI0
PM1
PM0
PP7
TXCAN0
RXCAN0
KWP7
—
—
—
—
—
V
V
V
PERM/PPSM Disabled Port M I/O, TX of CAN0
PERM/PPSM Disabled Port M I/O, RX of CAN0
DDX
DDX
DDX
PWM7
SCK2
PERP/
PPSP
Disabled Port P I/O, interrupt, channel
7
of PWM, SCK of SPI2
PP6
PP5
PP4
PP3
PP2
PP1
PP0
PS7
PS6
PS5
PS4
KWP6
KWP5
KWP4
KWP3
KWP2
KWP1
KWP0
SS0
PWM6
PWM5
PWM4
PWM3
PWM2
PWM1
PWM0
—
SS2
MOSI2
MISO2
SS1
—
—
—
—
—
—
—
—
—
—
—
V
V
V
V
V
V
V
V
V
V
V
PERP/
PPSP
Disabled Port P I/O, interrupt, channel
6 of PWM, SS of SPI2
DDX
DDX
DDX
DDX
DDX
DDX
DDX
DDX
DDX
DDX
DDX
PERP/
PPSP
Disabled Port P I/O, interrupt, channel
5 of PWM, MOSI of SPI2
PERP/
PPSP
Disabled Port P I/O, interrupt, channel
4 of PWM, MISO2 of SPI2
PERP/
PPSP
Disabled Port P I/O, interrupt, channel
3 of PWM, SS of SPI1
SCK1
MOSI1
MISO1
—
PERP/
PPSP
Disabled Port P I/O, interrupt, channel
2 of PWM, SCK of SPI1
PERP/
PPSP
Disabled Port P I/O, interrupt, channel
1 of PWM, MOSI of SPI1
PERP/
PPSP
Disabled Port P I/O, interrupt, channel
0 of PWM, MISO2 of SPI1
PERS/
PPSS
Up
Up
Up
Up
Port S I/O, SS of SPI0
Port S I/O, SCK of SPI0
Port S I/O, MOSI of SPI0
Port S I/O, MISO of SPI0
SCK0
MOSI0
MISO0
—
—
PERS/
PPSS
—
—
PERS/
PPSS
—
—
PERS/
PPSS
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
77
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Table 1-3. Signal Properties Summary (Sheet 4 of 4)
Internal Pull
Resistor
Pin
Name
Pin
Name
Pin
Name
Pin
Name
Pin
Name
Power
Supply
Description
Reset
Function 1 Function 2 Function 3 Function 4 Function 5
CTRL
State
PS3
PS2
TXD1
RXD1
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
V
V
V
V
V
PERS/
PPSS
Up
Port S I/O, TXD of SCI1
Port S I/O, RXD of SCI1
Port S I/O, TXD of SCI0
Port S I/O, RXD of SCI0
DDX
DDX
DDX
DDX
DDX
PERS/
PPSS
Up
Up
Up
PS1
TXD0
PERS/
PPSS
PS0
RXD0
PERS/
PPSS
PT[7:0]
IOC[7:0]
PERT/
PPST
Disabled Port T I/O, timer channels
NOTE
pins should be configured as outputs after reset in order to avoid current
drawn from floating inputs. Refer to Table 1-3 for affected pins.
1.2.3
Detailed Signal Descriptions
EXTAL, XTAL — Oscillator Pins
1.2.3.1
EXTAL and XTAL are the crystal driver and external clock pins. On reset all the device clocks are derived
from the EXTAL input frequency. XTAL is the crystal output.
1.2.3.2
RESET — External Reset Pin
The RESET pin is an active low bidirectional control signal. It acts as an input to initialize the MCU to a
known start-up state, and an output when an internal MCU function causes a reset.The RESET pin has an
internal pullup device.
1.2.3.3
TEST — Test Pin
This input only pin is reserved for test. This pin has a pulldown device.
NOTE
The TEST pin must be tied to V in all applications.
SS
1.2.3.4
V
— Voltage Regulator Enable Pin
REGEN
This input only pin enables or disables the on-chip voltage regulator. The input has a pullup device.
MC9S12XDP512 Data Sheet, Rev. 2.11
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1.2.3.5
XFC — PLL Loop Filter Pin
Please ask your Freescale representative for the interactive application note to compute PLL loop filter
elements. Any current leakage on this pin must be avoided.
V
V
DDPLL
DDPLL
C
S
MCU
C
P
R
0
XFC
Figure 1-8. PLL Loop Filter Connections
1.2.3.6
BKGD / MODC — Background Debug and Mode Pin
The BKGD/MODC pin is used as a pseudo-open-drain pin for the background debug communication. It
is used as a MCU operating mode select pin during reset. The state of this pin is latched to the MODC bit
at the rising edge of RESET. The BKGD pin has a pullup device.
1.2.3.7
PAD[23:8] / AN[23:8] — Port AD Input Pins of ATD1
PAD[23:8] are general-purpose input or output pins and analog inputs AN[23:8] of the analog-to-digital
converter ATD1.
1.2.3.8
PAD[7:0] / AN[7:0] — Port AD Input Pins of ATD0
PAD[7:0] are general-purpose input or output pins and analog inputs AN[7:0] of the analog-to-digital
converter ATD0.
1.2.3.9
PA[7:0] / ADDR[15:8] / IVD[15:8] — Port A I/O Pins
PA[7:0] are general-purpose input or output pins. In MCU expanded modes of operation, these pins are
used for the external address bus. In MCU emulation modes of operation, these pins are used for external
address bus and internal visibility read data.
1.2.3.10 PB[7:1] / ADDR[7:1] / IVD[7:1] — Port B I/O Pins
PB[7:1] are general-purpose input or output pins. In MCU expanded modes of operation, these pins are
used for the external address bus. In MCU emulation modes of operation, these pins are used for external
address bus and internal visibility read data.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
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1.2.3.11 PB0 / ADDR0 / UDS / IVD[0] — Port B I/O Pin 0
PB0 is a general-purpose input or output pin. In MCU expanded modes of operation, this pin is used for
the external address bus ADDR0 or as upper data strobe signal. In MCU emulation modes of operation,
this pin is used for external address bus ADDR0 and internal visibility read data IVD0.
1.2.3.12 PC[7:0] / DATA [15:8] — Port C I/O Pins
PC[7:0] are general-purpose input or output pins. In MCU expanded modes of operation, these pins are
used for the external data bus.
The input voltage thresholds for PC[7:0] can be configured to reduced levels, to allow data from an external
3.3-V peripheral to be read by the MCU operating at 5.0 V. The input voltage thresholds for PC[7:0] are
configured to reduced levels out of reset in expanded and emulation modes. The input voltage thresholds
for PC[7:0] are configured to 5-V levels out of reset in normal modes.
1.2.3.13 PD[7:0] / DATA [7:0] — Port D I/O Pins
PD[7:0] are general-purpose input or output pins. In MCU expanded modes of operation, these pins are
used for the external data bus.
The input voltage thresholds for PD[7:0] can be configured to reduced levels, to allow data from an
external 3.3-V peripheral to be read by the MCU operating at 5.0 V. The input voltage thresholds for
PD[7:0] are configured to reduced levels out of reset in expanded and emulation modes. The input voltage
thresholds for PC[7:0] are configured to 5-V levels out of reset in normal modes.
1.2.3.14 PE7 / ECLKX2 / XCLKS — Port E I/O Pin 7
PE7 is a general-purpose input or output pin. The XCLKS is an input signal which controls whether a
crystal in combination with the internal loop controlled (low power) Pierce oscillator is used or whether
full swing Pierce oscillator/external clock circuitry is used.
The XCLKS signal selects the oscillator configuration during reset low phase while a clock quality check
is ongoing. This is the case for:
•
•
•
Power on reset or low-voltage reset
Clock monitor reset
Any reset while in self-clock mode or full stop mode
The selected oscillator configuration is frozen with the rising edge of reset.
The pin can be configured to drive the internal system clock ECLKX2.
MC9S12XDP512 Data Sheet, Rev. 2.11
80
Freescale Semiconductor
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EXTAL
MCU
C
1
Crystal or
Ceramic Resonator
XTAL
C
2
V
SSPLL
Figure 1-9. Loop Controlled Pierce Oscillator Connections (PE7 = 1)
EXTAL
C
1
MCU
Crystal or
Ceramic Resonator
R
B
R
S
XTAL
C
2
V
SSPLL
Figure 1-10. Full Swing Pierce Oscillator Connections (PE7 = 0)
CMOS-Compatible
External Oscillator
EXTAL
MCU
XTAL
Not Connected
Figure 1-11. External Clock Connections (PE7 = 0)
1.2.3.15 PE6 / MODB / TAGHI — Port E I/O Pin 6
PE6 is a general-purpose input or output pin. It is used as a MCU operating mode select pin during reset.
The state of this pin is latched to the MODB bit at the rising edge of RESET. This pin is an input with a
pull-down device which is only active when RESET is low. TAGHI is used to tag the high half of the
instruction word being read into the instruction queue.
The input voltage threshold for PE6 can be configured to reduced levels, to allow data from an external
3.3-V peripheral to be read by the MCU operating at 5.0 V. The input voltage threshold for PE6 is
configured to reduced levels out of reset in expanded and emulation modes.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
81
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1.2.3.16 PE5 / MODA / TAGLO / RE — Port E I/O Pin 5
PE5 is a general-purpose input or output pin. It is used as a MCU operating mode select pin during reset.
The state of this pin is latched to the MODA bit at the rising edge of RESET. This pin is shared with the
read enable RE output. This pin is an input with a pull-down device which is only active when RESET is
low. TAGLO is used to tag the low half of the instruction word being read into the instruction queue.
The input voltage threshold for PE5 can be configured to reduced levels, to allow data from an external
3.3-V peripheral to be read by the MCU operating at 5.0 V. The input voltage threshold for PE5 is
configured to reduced levels out of reset in expanded and emulation modes.
1.2.3.17 PE4 / ECLK — Port E I/O Pin 4
PE4 is a general-purpose input or output pin. It can be configured to drive the internal bus clock ECLK.
ECLK can be used as a timing reference.
1.2.3.18 PE3 / LSTRB / LDS / EROMCTL— Port E I/O Pin 3
PE3 is a general-purpose input or output pin. In MCU expanded modes of operation, LSTRB or LDS can
be used for the low byte strobe function to indicate the type of bus access. At the rising edge of RESET
the state of this pin is latched to the EROMON bit.
1.2.3.19 PE2 / R/W / WE— Port E I/O Pin 2
PE2 is a general-purpose input or output pin. In MCU expanded modes of operations, this pin drives the
read/write output signal or write enable output signal for the external bus. It indicates the direction of data
on the external bus.
1.2.3.20 PE1 / IRQ — Port E Input Pin 1
PE1 is a general-purpose input pin and the maskable interrupt request input that provides a means of
applying asynchronous interrupt requests. This will wake up the MCU from stop or wait mode.
1.2.3.21 PE0 / XIRQ — Port E Input Pin 0
PE0 is a general-purpose input pin and the non-maskable interrupt request input that provides a means of
applying asynchronous interrupt requests. This will wake up the MCU from stop or wait mode.
1.2.3.22 PH7 / KWH7 / SS2 / TXD5 — Port H I/O Pin 7
PH7 is a general-purpose input or output pin. It can be configured to generate an interrupt causing the
MCU to exit stop or wait mode. It can be configured as slave select pin SS of the serial peripheral
interface 2 (SPI2). It can be configured as the transmit pin TXD of serial communication interface 5
(SCI5).
MC9S12XDP512 Data Sheet, Rev. 2.11
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1.2.3.23 PH6 / KWH6 / SCK2 / RXD5 — Port H I/O Pin 6
PH6 is a general-purpose input or output pin. It can be configured to generate an interrupt causing the
MCU to exit stop or wait mode. It can be configured as serial clock pin SCK of the serial peripheral
interface 2 (SPI2). It can be configured as the receive pin (RXD) of serial communication interface 5
(SCI5).
1.2.3.24 PH5 / KWH5 / MOSI2 / TXD4 — Port H I/O Pin 5
PH5 is a general-purpose input or output pin. It can be configured to generate an interrupt causing the
MCU to exit stop or wait mode. It can be configured as master output (during master mode) or slave input
pin (during slave mode) MOSI of the serial peripheral interface 2 (SPI2). It can be configured as the
transmit pin TXD of serial communication interface 4 (SCI4).
1.2.3.25 PH4 / KWH4 / MISO2 / RXD4 — Port H I/O Pin 4
PH4 is a general-purpose input or output pin. It can be configured to generate an interrupt causing the
MCU to exit stop or wait mode. It can be configured as master input (during master mode) or slave output
(during slave mode) pin MISO of the serial peripheral interface 2 (SPI2). It can be configured as the receive
pin RXD of serial communication interface 4 (SCI4).
1.2.3.26 PH3 / KWH3 / SS1 — Port H I/O Pin 3
PH3 is a general-purpose input or output pin. It can be configured to generate an interrupt causing the
MCU to exit stop or wait mode. It can be configured as slave select pin SS of the serial peripheral
interface 1 (SPI1).
1.2.3.27 PH2 / KWH2 / SCK1 — Port H I/O Pin 2
PH2 is a general-purpose input or output pin. It can be configured to generate an interrupt causing the
MCU to exit stop or wait mode. It can be configured as serial clock pin SCK of the serial peripheral
interface 1 (SPI1).
1.2.3.28 PH1 / KWH1 / MOSI1 — Port H I/O Pin 1
PH1 is a general-purpose input or output pin. It can be configured to generate an interrupt causing the
MCU to exit stop or wait mode. It can be configured as master output (during master mode) or slave input
pin (during slave mode) MOSI of the serial peripheral interface 1 (SPI1).
1.2.3.29 PH0 / KWH0 / MISO1 — Port H I/O Pin 0
PH0 is a general-purpose input or output pin. It can be configured to generate an interrupt causing the
MCU to exit stop or wait mode. It can be configured as master input (during master mode) or slave output
(during slave mode) pin MISO of the serial peripheral interface 1 (SPI1).
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
83
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1.2.3.30 PJ7 / KWJ7 / TXCAN4 / SCL0 / TXCAN0— PORT J I/O Pin 7
PJ7 is a general-purpose input or output pin. It can be configured to generate an interrupt causing the MCU
to exit stop or wait mode. It can be configured as the transmit pin TXCAN for the scalable controller area
network controller 0 or 4 (CAN0 or CAN4) or as the serial clock pin SCL of the IIC0 module.
1.2.3.31 PJ6 / KWJ6 / RXCAN4 / SDA0 / RXCAN0 — PORT J I/O Pin 6
PJ6 is a general-purpose input or output pin. It can be configured to generate an interrupt causing the MCU
to exit stop or wait mode. It can be configured as the receive pin RXCAN for the scalable controller area
network controller 0 or 4 (CAN0 or CAN4) or as the serial data pin SDA of the IIC0 module.
1.2.3.32 PJ5 / KWJ5 / SCL1 / CS2 — PORT J I/O Pin 5
PJ5 is a general-purpose input or output pin. It can be configured to generate an interrupt causing the MCU
to exit stop or wait mode. It can be configured as the serial clock pin SCL of the IIC1 module. It can be
configured to provide a chip-select output.
1.2.3.33 PJ4 / KWJ4 / SDA1 / CS0 — PORT J I/O Pin 4
PJ4 is a general-purpose input or output pin. It can be configured to generate an interrupt causing the MCU
to exit stop or wait mode. It can be configured as the serial data pin SDA of the IIC1 module. It can be
configured to provide a chip-select output.
1.2.3.34 PJ2 / KWJ2 / CS1 — PORT J I/O Pin 2
PJ2 is a general-purpose input or output pins. It can be configured to generate an interrupt causing the
MCU to exit stop or wait mode. It can be configured to provide a chip-select output.
1.2.3.35 PJ1 / KWJ1 / TXD2 — PORT J I/O Pin 1
PJ1 is a general-purpose input or output pin. It can be configured to generate an interrupt causing the MCU
to exit stop or wait mode. It can be configured as the transmit pin TXD of the serial communication
interface 2 (SCI2).
1.2.3.36 PJ0 / KWJ0 / RXD2 / CS3 — PORT J I/O Pin 0
PJ0 is a general-purpose input or output pin. It can be configured to generate an interrupt causing the MCU
to exit stop or wait mode. It can be configured as the receive pin RXD of the serial communication interface
2 (SCI2).It can be configured to provide a chip-select output.
1.2.3.37 PK7 / EWAIT / ROMCTL — Port K I/O Pin 7
PK7 is a general-purpose input or output pin. During MCU emulation modes and normal expanded modes
of operation, this pin is used to enable the Flash EEPROM memory in the memory map (ROMCTL). At
the rising edge of RESET, the state of this pin is latched to the ROMON bit. The EWAIT input signal
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maintains the external bus access until the external device is ready to capture data (write) or provide data
(read).
The input voltage threshold for PK7 can be configured to reduced levels, to allow data from an external
3.3-V peripheral to be read by the MCU operating at 5.0 V. The input voltage threshold for PK7 is
configured to reduced levels out of reset in expanded and emulation modes.
1.2.3.38 PK[6:4] / ADDR[22:20] / ACC[2:0] — Port K I/O Pin [6:4]
PK[6:4] are general-purpose input or output pins. During MCU expanded modes of operation, the
ACC[2:0] signals are used to indicate the access source of the bus cycle. This pins also provide the
expanded addresses ADDR[22:20] for the external bus. In Emulation modes ACC[2:0] is available and is
time multiplexed with the high addresses
1.2.3.39 PK[3:0] / ADDR[19:16] / IQSTAT[3:0] — Port K I/O Pins [3:0]
PK3-PK0 are general-purpose input or output pins. In MCU expanded modes of operation, these pins
provide the expanded address ADDR[19:16] for the external bus and carry instruction pipe information.
1.2.3.40 PM7 / TXCAN3 / TXCAN4 / TXD3 — Port M I/O Pin 7
PM7 is a general-purpose input or output pin. It can be configured as the transmit pin TXCAN of the
scalable controller area network controller 3 or 4 (CAN3 or CAN4). PM7 can be configured as the transmit
pin TXD3 of the serial communication interface 3 (SCI3).
1.2.3.41 PM6 / RXCAN3 / RXCAN4 / RXD3 — Port M I/O Pin 6
PM6 is a general-purpose input or output pin. It can be configured as the receive pin RXCAN of the
scalable controller area network controller 3 or 4 (CAN3 or CAN4). PM6 can be configured as the receive
pin RXD3 of the serial communication interface 3 (SCI3).
1.2.3.42 PM5 / TXCAN0 / TXCAN2 / TXCAN4 / SCK0 — Port M I/O Pin 5
PM5 is a general-purpose input or output pin. It can be configured as the transmit pin TXCAN of the
scalable controller area network controllers 0, 2 or 4 (CAN0, CAN2, or CAN4). It can be configured as
the serial clock pin SCK of the serial peripheral interface 0 (SPI0).
1.2.3.43 PM4 / RXCAN0 / RXCAN2 / RXCAN4 / MOSI0 — Port M I/O Pin 4
PM4 is a general-purpose input or output pin. It can be configured as the receive pin RXCAN of the
scalable controller area network controllers 0, 2, or 4 (CAN0, CAN2, or CAN4). It can be configured as
the master output (during master mode) or slave input pin (during slave mode) MOSI for the serial
peripheral interface 0 (SPI0).
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
85
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1.2.3.44 PM3 / TXCAN1 / TXCAN0 / SS0 — Port M I/O Pin 3
PM3 is a general-purpose input or output pin. It can be configured as the transmit pin TXCAN of the
scalable controller area network controllers 1 or 0 (CAN1 or CAN0). It can be configured as the slave
select pin SS of the serial peripheral interface 0 (SPI0).
1.2.3.45 PM2 / RXCAN1 / RXCAN0 / MISO0 — Port M I/O Pin 2
PM2 is a general-purpose input or output pin. It can be configured as the receive pin RXCAN of the
scalable controller area network controllers 1 or 0 (CAN1 or CAN0). It can be configured as the master
input (during master mode) or slave output pin (during slave mode) MISO for the serial peripheral
interface 0 (SPI0).
1.2.3.46 PM1 / TXCAN0 — Port M I/O Pin 1
PM1 is a general-purpose input or output pin. It can be configured as the transmit pin TXCAN of the
scalable controller area network controller 0 (CAN0).
1.2.3.47 PM0 / RXCAN0 — Port M I/O Pin 0
PM0 is a general-purpose input or output pin. It can be configured as the receive pin RXCAN of the
scalable controller area network controller 0 (CAN0).
1.2.3.48 PP7 / KWP7 / PWM7 / SCK2 — Port P I/O Pin 7
PP7 is a general-purpose input or output pin. It can be configured to generate an interrupt causing the MCU
to exit stop or wait mode. It can be configured as pulse width modulator (PWM) channel 7 output. It can
be configured as serial clock pin SCK of the serial peripheral interface 2 (SPI2).
1.2.3.49 PP6 / KWP6 / PWM6 / SS2 — Port P I/O Pin 6
PP6 is a general-purpose input or output pin. It can be configured to generate an interrupt causing the MCU
to exit stop or wait mode. It can be configured as pulse width modulator (PWM) channel 6 output. It can
be configured as slave select pin SS of the serial peripheral interface 2 (SPI2).
1.2.3.50 PP5 / KWP5 / PWM5 / MOSI2 — Port P I/O Pin 5
PP5 is a general-purpose input or output pin. It can be configured to generate an interrupt causing the MCU
to exit stop or wait mode. It can be configured as pulse width modulator (PWM) channel 5 output. It can
be configured as master output (during master mode) or slave input pin (during slave mode) MOSI of the
serial peripheral interface 2 (SPI2).
1.2.3.51 PP4 / KWP4 / PWM4 / MISO2 — Port P I/O Pin 4
PP4 is a general-purpose input or output pin. It can be configured to generate an interrupt causing the MCU
to exit stop or wait mode. It can be configured as pulse width modulator (PWM) channel 4 output. It can
MC9S12XDP512 Data Sheet, Rev. 2.11
86
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be configured as master input (during master mode) or slave output (during slave mode) pin MISO of the
serial peripheral interface 2 (SPI2).
1.2.3.52 PP3 / KWP3 / PWM3 / SS1 — Port P I/O Pin 3
PP3 is a general-purpose input or output pin. It can be configured to generate an interrupt causing the MCU
to exit stop or wait mode. It can be configured as pulse width modulator (PWM) channel 3 output. It can
be configured as slave select pin SS of the serial peripheral interface 1 (SPI1).
1.2.3.53 PP2 / KWP2 / PWM2 / SCK1 — Port P I/O Pin 2
PP2 is a general-purpose input or output pin. It can be configured to generate an interrupt causing the MCU
to exit stop or wait mode. It can be configured as pulse width modulator (PWM) channel 2 output. It can
be configured as serial clock pin SCK of the serial peripheral interface 1 (SPI1).
1.2.3.54 PP1 / KWP1 / PWM1 / MOSI1 — Port P I/O Pin 1
PP1 is a general-purpose input or output pin. It can be configured to generate an interrupt causing the MCU
to exit stop or wait mode. It can be configured as pulse width modulator (PWM) channel 1 output. It can
be configured as master output (during master mode) or slave input pin (during slave mode) MOSI of the
serial peripheral interface 1 (SPI1).
1.2.3.55 PP0 / KWP0 / PWM0 / MISO1 — Port P I/O Pin 0
PP0 is a general-purpose input or output pin. It can be configured to generate an interrupt causing the MCU
to exit stop or wait mode. It can be configured as pulse width modulator (PWM) channel 0 output. It can
be configured as master input (during master mode) or slave output (during slave mode) pin MISO of the
serial peripheral interface 1 (SPI1).
1.2.3.56 PS7 / SS0 — Port S I/O Pin 7
PS7 is a general-purpose input or output pin. It can be configured as the slave select pin SS of the serial
peripheral interface 0 (SPI0).
1.2.3.57 PS6 / SCK0 — Port S I/O Pin 6
PS6 is a general-purpose input or output pin. It can be configured as the serial clock pin SCK of the serial
peripheral interface 0 (SPI0).
1.2.3.58 PS5 / MOSI0 — Port S I/O Pin 5
PS5 is a general-purpose input or output pin. It can be configured as master output (during master mode)
or slave input pin (during slave mode) MOSI of the serial peripheral interface 0 (SPI0).
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
87
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Chapter 1 Device Overview (MC9S12XDP512V2)
1.2.3.59 PS4 / MISO0 — Port S I/O Pin 4
PS4 is a general-purpose input or output pin. It can be configured as master input (during master mode) or
slave output pin (during slave mode) MOSI of the serial peripheral interface 0 (SPI0).
1.2.3.60 PS3 / TXD1 — Port S I/O Pin 3
PS3 is a general-purpose input or output pin. It can be configured as the transmit pin TXD of serial
communication interface 1 (SCI1).
1.2.3.61 PS2 / RXD1 — Port S I/O Pin 2
PS2 is a general-purpose input or output pin. It can be configured as the receive pin RXD of serial
communication interface 1 (SCI1).
1.2.3.62 PS1 / TXD0 — Port S I/O Pin 1
PS1 is a general-purpose input or output pin. It can be configured as the transmit pin TXD of serial
communication interface 0 (SCI0).
1.2.3.63 PS0 / RXD0 — Port S I/O Pin 0
PS0 is a general-purpose input or output pin. It can be configured as the receive pin RXD of serial
communication interface 0 (SCI0).
1.2.3.64 PT[7:0] / IOC[7:0] — Port T I/O Pins [7:0]
PT[7:0] are general-purpose input or output pins. They can be configured as input capture or output
compare pins IOC[7:0] of the enhanced capture timer (ECT).
1.2.4
Power Supply Pins
MC9S12XDP512 power and ground pins are described below.
NOTE
All V pins must be connected together in the application.
SS
1.2.4.1
V
, V
, V
,V
— Power and Ground Pins for I/O Drivers
DDX1
DDX2
SSX1 SSX2
External power and ground for I/O drivers. Because fast signal transitions place high, short-duration
current demands on the power supply, use bypass capacitors with high-frequency characteristics and place
them as close to the MCU as possible. Bypass requirements depend on how heavily the MCU pins are
loaded.
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 1 Device Overview (MC9S12XDP512V2)
1.2.4.2
V
, V
, V
, V — Power and Ground Pins for I/O Drivers
SSR2
DDR1
DDR2
SSR1
and for Internal Voltage Regulator
External power and ground for I/O drivers and input to the internal voltage regulator. Because fast signal
transitions place high, short-duration current demands on the power supply, use bypass capacitors with
high-frequency characteristics and place them as close to the MCU as possible. Bypass requirements
depend on how heavily the MCU pins are loaded.
1.2.4.3
V
, V
, V
, V
— Core Power Pins
SS2
DD1
DD2
SS1
Power is supplied to the MCU through V and V . Because fast signal transitions place high,
DD
SS
short-duration current demands on the power supply, use bypass capacitors with high-frequency
characteristics and place them as close to the MCU as possible. This 2.5-V supply is derived from the
internal voltage regulator. There is no static load on those pins allowed. The internal voltage regulator is
turned off, if V
is tied to ground.
REGEN
NOTE
No load allowed except for bypass capacitors.
1.2.4.4
V
, V
— Power Supply Pins for ATD and V
SSA REG
DDA
V
, V
are the power supply and ground input pins for the voltage regulator and the analog-to-digital
DDA SSA
converters.
1.2.4.5
V , V — ATD Reference Voltage Input Pins
RH RL
V
and V are the reference voltage input pins for the analog-to-digital converter.
RL
RH
1.2.4.6
V
, V
— Power Supply Pins for PLL
SSPLL
DDPLL
Provides operating voltage and ground for the oscillator and the phased-locked loop. This allows the
supply voltage to the oscillator and PLL to be bypassed independently. This 2.5-V voltage is generated by
the internal voltage regulator.
NOTE
No load allowed except for bypass capacitors.
1.2.4.7
V
— On--Chip Voltage Regulator Enable
REGEN
Enables the internal 5 V to 2.5 V voltage regulator. If this pin is tied low, V
supplied externally.
and V
must be
DD1,2
DDPLL
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
89
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Table 1-4. MC9S12XDP512 Power and Ground Connection Summary
Pin Number
Nominal
Voltage
Mnemonic
Description
144-Pin
LQFP
112-Pin
LQFP
80-Pin
QFP
V
15, 87
16, 88
53
13, 65
14, 66
41
9, 49
10, 50
29
2.5 V
0V
Internal power and ground generated by
internal regulator
DD1, 2
V
SS1, 2
V
5.0 V
0 V
External power and ground, supply to pin
drivers and internal voltage regulator
DDR1
V
52
40
28
SSR1
DDX1
V
139
138
26
107
106
N.A.
N.A.
N.A.
N.A.
83
77
5.0 V
0 V
External power and ground, supply to pin
drivers
V
76
SSX1
V
N.A.
N.A.
N.A.
N.A.
59
5.0 V
0 V
External power and ground, supply to pin
drivers
DDX2
V
27
SSX2
DDR2
V
82
5.0 V
0 V
External power and ground, supply to pin
drivers
V
81
SSR2
V
107
110
5.0 V
0 V
Operating voltage and ground for the
analog-to-digital converters and the
reference for the internal voltage regulator,
allows the supply voltage to the A/D to be
bypassed independently.
DDA
SSA
V
86
62
V
109
108
55
85
84
43
45
61
60
31
33
0 V
5.0 V
2.5 V
0 V
Reference voltages for the analog-to-digital
converter.
RL
V
RH
V
Provides operating voltage and ground for
the phased-locked loop. This allows the
supply voltage to the PLL to be bypassed
independently. Internal power and ground
generated by internal regulator.
DDPLL
V
57
SSPLL
V
127
97
N.A.
5V
Internal voltage regulator enable/disable
REGEN
MC9S12XDP512 Data Sheet, Rev. 2.11
90
Freescale Semiconductor
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Chapter 1 Device Overview (MC9S12XDP512V2)
1.3
System Clock Description
The clock and reset generator module (CRG) provides the internal clock signals for the core and all
peripheral modules. Figure 1-12 shows the clock connections from the CRG to all modules.
Consult the CRG Block User Guide for details on clock generation.
SCI0 . . SCI 5
CAN0 . . CAN4
SPI0 . . SPI2
IIC0 & IIC1
ATD0 & ATD1
Bus Clock
PIT
EXTAL
Oscillator Clock
ECT
CRG
PIM
XTAL
Core Clock
RAM
S12X
XGATE
FLASH
EEPROM
Figure 1-12. Clock Connections
The MCU’s system clock can be supplied in several ways enabling a range of system operating frequencies
to be supported:
•
•
•
The on-chip phase locked loop (PLL)
the PLL self clocking
the oscillator
The clock generated by the PLL or oscillator provides the main system clock frequencies core clock and
bus clock. As shown in Figure 1-12, this system clocks are used throughout the MCU to drive the core, the
memories, and the peripherals.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
91
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Chapter 1 Device Overview (MC9S12XDP512V2)
The program Flash memory and the EEPROM are supplied by the bus clock and the oscillator clock.The
oscillator clock is used as a time base to derive the program and erase times for the NVM’s. Consult the
FTX512k4 Block Guide and the EETX4K Block Guide for more details on the operation of the NVM’s.
The CAN modules may be configured to have their clock sources derived either from the bus clock or
directly from the oscillator clock. This allows the user to select its clock based on the required jitter
performance. Consult MSCAN block description for more details on the operation and configuration of
the CAN blocks.
In order to ensure the presence of the clock the MCU includes an on-chip clock monitor connected to the
output of the oscillator. The clock monitor can be configured to invoke the PLL self-clocking mode or to
generate a system reset if it is allowed to time out as a result of no oscillator clock being present.
In addition to the clock monitor, the MCU also provides a clock quality checker which performs a more
accurate check of the clock. The clock quality checker counts a predetermined number of clock edges
within a defined time window to insure that the clock is running. The checker can be invoked following
specific events such as on wake-up or clock monitor failure.
1.4
Chip Configuration Summary
The MCU can operate in six different modes. The different modes, the state of ROMCTL and EROMCTL
signal on rising edge of RESET, and the security state of the MCU affects the following device
characteristics:
•
•
•
External bus interface configuration
Flash in memory map, or not
Debug features enabled or disabled
The operating mode out of reset is determined by the states of the MODC, MODB, and MODA signals
during reset (see Table 1-5). The MODC, MODB, and MODA bits in the MODE register show the current
operating mode and provide limited mode switching during operation. The states of the MODC, MODB,
and MODA signals are latched into these bits on the rising edge of RESET.
In normal expanded mode and in emulation modes the ROMON bit and the EROMON bit in the
MMCCTL1 register defines if the on chip flash memory is the memory map, or not. (See Table 1-5.) For
a detailed description of the ROMON and EROMON bits refer to the S12X_MMC Block Guide.
The state of the ROMCTL signal is latched into the ROMON bit in the MMCCTL1 register on the rising
edge of RESET. The state of the EROMCTL signal is latched into the EROMON bit in the MISC register
on the rising edge of RESET.
MC9S12XDP512 Data Sheet, Rev. 2.11
92
Freescale Semiconductor
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Chapter 1 Device Overview (MC9S12XDP512V2)
Table 1-5. Chip Modes and Data Sources
BKGD =
MODC
PE6 =
MODB
PE5 =
MODA
PK7 =
ROMCTL
PE3 =
EROMCTL
1
Chip Modes
Data Source
Normal single chip
Special single chip
Emulation single chip
1
0
0
0
0
0
0
0
1
X
X
Internal
X
X
0
1
0
1
1
0
1
0
1
Emulation memory
Internal Flash
Normal expanded
1
0
0
1
1
1
X
X
X
0
External application
Internal Flash
Emulation expanded
External application
Emulation memory
Internal Flash
1
Special test
0
1
0
X
X
External application
Internal Flash
1
Internal means resources inside the MCU are read/written.
Internal Flash means Flash resources inside the MCU are read/written.
Emulation memory means resources inside the emulator are read/written (PRU registers, Flash replacement, RAM, EEPROM,
and register space are always considered internal).
External application means resources residing outside the MCU are read/written.
The configuration of the oscillator can be selected using the XCLKS signal (see Table 1-6). For a detailed
description please refer to the CRG Block Guide.
Table 1-6. Clock Selection Based on PE7
PE7 = XCLKS
Description
0
1
Full swing Pierce oscillator or external clock source selected
Loop controlled Pierce oscillator selected
The logic level on the voltage regulator enable pin V
regulator is enabled or disabled (see Table 1-7).
determines whether the on-chip voltage
REGEN
Table 1-7. Voltage Regulator VREGEN
V
Description
REGEN
1
0
Internal voltage regulator enabled
Internal voltage regulator disabled, V
supplied externally
and V
must be
DDPLL
DD1,2
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
93
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Chapter 1 Device Overview (MC9S12XDP512V2)
1.5
Modes of Operation
1.5.1
User Modes
1.5.1.1
Normal Expanded Mode
Ports K, A, and B are configured as a 23-bit address bus, ports C and D are configured as a 16-bit data bus,
and port E provides bus control and status signals. This mode allows 16-bit external memory and
peripheral devices to be interfaced to the system. The fastest external bus rate is divide by 2 from the
internal bus rate.
1.5.1.2
Normal Single-Chip Mode
There is no external bus in this mode. The processor program is executed from internal memory. Ports A,
B,C,D, K, and most pins of port E are available as general-purpose I/O.
1.5.1.3
Special Single-Chip Mode
This mode is used for debugging single-chip operation, boot-strapping, or security related operations. The
background debug module BDM is active in this mode. The CPU executes a monitor program located in
an on-chip ROM. BDM firmware is waiting for additional serial commands through the BKGD pin. There
is no external bus after reset in this mode.
1.5.1.4
Emulation of Expanded Mode
Developers use this mode for emulation systems in which the users target application is normal expanded
mode. Code is executed from external memory or from internal memory depending on the state of
ROMON and EROMON bit. In this mode the internal operation is visible on external bus interface.
1.5.1.5
Emulation of Single-Chip Mode
Developers use this mode for emulation systems in which the user’s target application is normal
single-chip mode. Code is executed from external memory or from internal memory depending on the state
of ROMON and EROMON bit. In this mode the internal operation is visible on external bus interface.
1.5.1.6
Special Test Mode
Freescale internal use only.
1.5.2
Low-Power Modes
The microcontroller features two main low-power modes. Consult the respective Block Guide for
information on the module behavior in system stop, system pseudo stop, and system wait mode. An
important source of information about the clock system is the Clock and Reset Generator Block Guide
(CRG).
MC9S12XDP512 Data Sheet, Rev. 2.11
94
Freescale Semiconductor
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Chapter 1 Device Overview (MC9S12XDP512V2)
1.5.2.1
System Stop Modes
The system stop modes are entered if the CPU executes the STOP instruction and the XGATE doesn’t
execute a thread and the XGFACT bit in the XGMCTL register is cleared. Depending on the state of the
PSTP bit in the CLKSEL register the MCU goes into pseudo stop mode or full stop mode. Please refer to
CRG Block Guide. Asserting RESET, XIRQ, IRQ or any other interrupt ends the system stop modes.
1.5.2.2
Pseudo Stop Mode
In this mode the clocks are stopped but the oscillator is still running and the real time interrupt (RTI) or
watchdog (COP) submodule can stay active. Other peripherals are turned off. This mode consumes more
current than the system stop mode, but the wake up time from this mode is significantly shorter.
1.5.2.3
Full Stop Mode
The oscillator is stopped in this mode. All clocks are switched off. All counters and dividers remain frozen.
1.5.2.4
System Wait Mode
This mode is entered when the CPU executes the WAI instruction. In this mode the CPU will not execute
instructions. The internal CPU clock is switched off. All peripherals and the XGATE can be active in
system wait mode. For further power consumption the peripherals can individually turn off their local
clocks. Asserting RESET, XIRQ, IRQ or any other interrupt that has not been masked ends system wait
mode.
1.5.3
Freeze Mode
The enhanced capture timer, pulse width modulator, analog-to-digital converters, the periodic interrupt
timer and the XGATE module provide a software programmable option to freeze the module status during
the background debug module is active. This is useful when debugging application software. For detailed
description of the behavior of the ATD0, ATD1, ECT, PWM, XGATE and PIT when the background debug
module is active consult the corresponding Block Guides.
1.6
Resets and Interrupts
Consult the S12XCPU Block Guide for information on exception processing.
Vectors
Table 1-8 lists all interrupt sources and vectors in the default order of priority. The interrupt module
(S12XINT) provides an interrupt vector base register (IVBR) to relocate the vectors. Associated with each
I-bit maskable service request is a configuration register. It selects if the service request is enabled, the
service request priority level and whether the service request is handled either by the S12X CPU or by the
XGATE module.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
95
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Chapter 1 Device Overview (MC9S12XDP512V2)
Table 1-8. Interrupt Vector Locations (Sheet 1 of 3)
XGATE
Channel ID
CCR
Mask
1
Vector Address
Interrupt Source
Local Enable
2
$FFFE
$FFFC
$FFFA
—
—
System reset or illegal access reset
Clock monitor reset
None
None
None
None
None
X Bit
I bit
None
PLLCTL (CME, SCME)
COP rate select
None
—
COP watchdog reset
Vector base + $F8
Vector base+ $F6
Vector base+ $F4
Vector base+ $F2
Vector base+ $F0
Vector base+ $EE
Vector base + $EC
Vector base+ $EA
Vector base+ $E8
Vector base+ $E6
Vector base+ $E4
Vector base + $E2
Vector base+ $E0
Vector base+ $DE
Vector base+ $DC
Vector base + $DA
Vector base + $D8
Vector base+ $D6
—
Unimplemented instruction trap
SWI
—
None
—
XIRQ
None
—
IRQ
IRQCR (IRQEN)
CRGINT (RTIE)
TIE (C0I)
$78
$77
$76
$75
$74
$73
$72
$71
$70
$6F
$6E
$6D
$6C
$6B
Real time interrupt
I bit
Enhanced capture timer channel 0
Enhanced capture timer channel 1
Enhanced capture timer channel 2
Enhanced capture timer channel 3
Enhanced capture timer channel 4
Enhanced capture timer channel 5
Enhanced capture timer channel 6
Enhanced capture timer channel 7
Enhanced capture timer overflow
Pulse accumulator A overflow
Pulse accumulator input edge
SPI0
I bit
I bit
TIE (C1I)
I bit
TIE (C2I)
I bit
TIE (C3I)
I bit
TIE (C4I)
I bit
TIE (C5I)
I bit
TIE (C6I)
I bit
TIE (C7I)
I bit
TSRC2 (TOF)
PACTL (PAOVI)
PACTL (PAI)
SPI0CR1 (SPIE, SPTIE)
I bit
I bit
I bit
SCI0
I bit
SCI0CR2
(TIE, TCIE, RIE, ILIE)
Vector base + $D4
$6A
SCI1
I bit
SCI1CR2
(TIE, TCIE, RIE, ILIE)
Vector base + $D2
Vector base + $D0
Vector base + $CE
Vector base + $CC
Vector base + $CA
Vector base + $C8
Vector base + $C6
Vector base + $C4
Vector base + $C2
Vector base + $C0
Vector base + $BE
$69
$68
$67
$66
$65
$64
$63
$62
$61
$60
$5F
ATD0
ATD1
I bit
I bit
I bit
I bit
I bit
I bit
I bit
I bit
ATD0CTL2 (ASCIE)
ATD1CTL2 (ASCIE)
PIEJ (PIEJ7-PIEJ0)
PIEH (PIEH7-PIEH0)
MCCTL(MCZI)
Port J
Port H
Modulus down counter underflow
Pulse accumulator B overflow
CRG PLL lock
PBCTL(PBOVI)
CRGINT(LOCKIE)
CRGINT (SCMIE)
CRG self-clock mode
Reserved
IIC0 bus
SPI1
I bit
I bit
IBCR0 (IBIE)
SPI1CR1 (SPIE, SPTIE)
MC9S12XDP512 Data Sheet, Rev. 2.11
96
Freescale Semiconductor
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Chapter 1 Device Overview (MC9S12XDP512V2)
Table 1-8. Interrupt Vector Locations (Sheet 2 of 3)
XGATE
Channel ID
CCR
Mask
1
Vector Address
Interrupt Source
Local Enable
2
Vector base + $BC
Vector base + $BA
Vector base + $B8
Vector base + $B6
Vector base + $B4
Vector base + $B2
Vector base + $B0
Vector base + $AE
Vector base + $AC
Vector base + $AA
Vector base + $A8
Vector base + $A6
Vector base + $A4
Vector base + $A2
Vector base + $A0
Vector base + $9E
Vector base+ $9C
Vector base+ $9A
Vector base + $98
Vector base + $96
Vector base + $94
Vector base + $92
Vector base + $90
Vector base + $8E
Vector base+ $8C
Vector base + $8A
$5E
$5D
$5C
$5B
$5A
$59
$58
$57
$56
$55
$54
$53
$52
$51
$50
$4F
$4E
$4D
$4C
$4B
$4A
$49
$48
$47
$46
$45
SPI2
EEPROM
I bit
I bit
I bit
I bit
I bit
I bit
I bit
I bit
I bit
I bit
I bit
I bit
I bit
I bit
I bit
I bit
I bit
I bit
I bit
I bit
I bit
I bit
I bit
I bit
I bit
I bit
SPI2CR1 (SPIE, SPTIE)
ECNFG (CCIE, CBEIE)
FCNFG (CCIE, CBEIE)
CAN0RIER (WUPIE)
FLASH
CAN0 wake-up
CAN0 errors
CAN0RIER (CSCIE, OVRIE)
CAN0RIER (RXFIE)
CAN0 receive
CAN0 transmit
CAN1 wake-up
CAN1 errors
CAN0TIER (TXEIE[2:0])
CAN1RIER (WUPIE)
CAN1RIER (CSCIE, OVRIE)
CAN1RIER (RXFIE)
CAN1 receive
CAN1 transmit
CAN2 wake-up
CAN2 errors
CAN1TIER (TXEIE[2:0])
CAN2RIER (WUPIE)
CAN2RIER (CSCIE, OVRIE)
CAN2RIER (RXFIE)
CAN2 receive
CAN2 transmit
CAN3 wake-up
CAN3 errors
CAN2TIER (TXEIE[2:0])
CAN3RIER (WUPIE)
CAN3RIER (CSCIE, OVRIE)
CAN3RIER (RXFIE)
CAN3 receive
CAN3 transmit
CAN4 wake-up
CAN4 errors
CAN3TIER (TXEIE[2:0])
CAN4RIER (WUPIE)
CAN4RIER (CSCIE, OVRIE)
CAN4RIER (RXFIE)
CAN4 receive
CAN4 transmit
Port P Interrupt
PWM emergency shutdown
SCI2
CAN4TIER (TXEIE[2:0])
PIEP (PIEP7-PIEP0)
PWMSDN (PWMIE)
SCI2CR2
(TIE, TCIE, RIE, ILIE)
Vector base + $88
Vector base + $86
Vector base + $84
$44
$43
$42
SCI3
SCI4
SCI5
I bit
I bit
I bit
SCI3CR2
(TIE, TCIE, RIE, ILIE)
SCI4CR2
(TIE, TCIE, RIE, ILIE)
SCI5CR2
(TIE, TCIE, RIE, ILIE)
Vector base + $82
Vector base + $80
$41
$40
IIC1 Bus
I bit
I bit
IBCR (IBIE)
Low-voltage interrupt (LVI)
VREGCTRL (LVIE)
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
97
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Chapter 1 Device Overview (MC9S12XDP512V2)
Table 1-8. Interrupt Vector Locations (Sheet 3 of 3)
XGATE
Channel ID
CCR
Mask
1
Vector Address
Interrupt Source
Local Enable
2
Vector base + $7E
Vector base + $7C
Vector base + $7A
Vector base + $78
Vector base + $76
Vector base + $74
Vector base + $72
Vector base + $70
Vector base + $6E
Vector base + $6C
Vector base + $6A
Vector base + $68
Vector base + $66
Vector base + $64
Vector base + $62
Vector base + $60
$3F
$3E
$3D
$3C
$3B
$3A
$39
$38
$37
$36
$35
$34
$33
$32
—
Autonomous periodical interrupt (API)
I bit
VREGAPICTRL (APIE)
Reserved
Periodic interrupt timer channel 0
Periodic interrupt timer channel 1
Periodic interrupt timer channel 2
Periodic interrupt timer channel 3
XGATE software trigger 0
XGATE software trigger 1
XGATE software trigger 2
XGATE software trigger 3
XGATE software trigger 4
XGATE software trigger 5
XGATE software trigger 6
XGATE software trigger 7
XGATE software error interrupt
S12XCPU RAM access violation
Reserved
I bit
I bit
I bit
I bit
I bit
I bit
I bit
I bit
I bit
I bit
I bit
I bit
I bit
I bit
PITINTE (PINTE0)
PITINTE (PINTE1)
PITINTE (PINTE2)
PITINTE (PINTE3)
XGMCTL (XGIE)
XGMCTL (XGIE)
XGMCTL (XGIE)
XGMCTL (XGIE)
XGMCTL (XGIE)
XGMCTL (XGIE)
XGMCTL (XGIE)
XGMCTL (XGIE)
XGMCTL (XGIE)
RAMWPC (AVIE)
—
Vector base+ $12
to
Vector base + $5E
Vector base + $10
—
Spurious interrupt
—
None
1
2
16 bits vector address based
For detailed description of XGATE channel ID refer to XGATE Block Guide
1.6.2
Effects of Reset
When a reset occurs, MCU registers and control bits are changed to known start-up states. Refer to the
respective module Block Guides for register reset states.
1.6.2.1
I/O Pins
Refer to the PIM Block Guide for reset configurations of all peripheral module ports.
1.6.2.2
Memory
The RAM array is not initialized out of reset.
MC9S12XDP512 Data Sheet, Rev. 2.11
98
Freescale Semiconductor
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Chapter 1 Device Overview (MC9S12XDP512V2)
1.7
COP Configuration
The COP timeout rate bits CR[2:0] and the WCOP bit in the COPCTL register are loaded on rising edge
of RESET from the Flash control register FCTL ($0107) located in the Flash EEPROM block. See
Table 1-9 and Table 1-10 for coding. The FCTL register is loaded from the Flash configuration field byte
at global address $7FFF0E during the reset sequence
NOTE
If the MCU is secured the COP timeout rate is always set to the longest
period (CR[2:0] = 111) after COP reset.
Table 1-9. Initial COP Rate Configuration
NV[2:0] in
CR[2:0] in
FCTL Register
COPCTL Register
000
001
010
011
100
101
110
111
111
110
101
100
011
010
001
000
Table 1-10. Initial WCOP Configuration
NV[3] in
WCOP in
FCTL Register
COPCTL Register
1
0
0
1
1.8
ATD0 External Trigger Input Connection
The ATD_10B8C module includes four external trigger inputs ETRIG0, ETRIG1, ETRIG, and ETRIG3.
The external trigger allows the user to synchronize ATD conversion to external trigger events. Table 1-11
shows the connection of the external trigger inputs on MC9S12XDP512.
Table 1-11. ATD0 External Trigger Sources
External Trigger
Connectivity
Input
ETRIG0
ETRIG1
ETRIG2
ETRIG3
Pulse width modulator channel 1
Pulse width modulator channel 3
Periodic interrupt timer hardware trigger 0
Periodic interrupt timer hardware trigger 1
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
99
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Chapter 1 Device Overview (MC9S12XDP512V2)
Consult the ATD_10B8C Block Guide for information about the analog-to-digital converter module.
When the ATD_10B8C Block Guide refers to freeze mode this is equivalent to active BDM mode.
1.9
ATD1 External Trigger Input Connection
The external trigger feature allows the user to synchronize ATD conversion to external trigger events.
Table 1-12 shows the connection of the external trigger inputs on MC9S12XDP512.
Table 1-12. ATD1 External Trigger Sources
External Trigger
Connectivity
Input
ETRIG0
ETRIG1
ETRIG2
ETRIG3
Pulse width modulator channel 1
Pulse width modulator channel 3
Periodic interrupt timer hardware trigger 0
Periodic interrupt timer hardware trigger 1
Consult the ATD_10B16C Block Guide for information about the analog-to-digital converter module.
When the ATD_10B16C Block Guide refers to freeze mode this is equivalent to active BDM mode.
MC9S12XDP512 Data Sheet, Rev. 2.11
100
Freescale Semiconductor
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Chapter 2
512 Kbyte Flash Module (S12XFTX512K4V2)
2.1
Introduction
This document describes the FTX512K4 module that includes a 512K Kbyte Flash (nonvolatile) memory.
The Flash memory may be read as either bytes, aligned words or misaligned words. Read access time is
one bus cycle for bytes and aligned words, and two bus cycles for misaligned words.
The Flash memory is ideal for program and data storage for single-supply applications allowing for field
reprogramming without requiring external voltage sources for program or erase. Program and erase
functions are controlled by a command driven interface. The Flash module supports both block erase and
sector erase. An erased bit reads 1 and a programmed bit reads 0. The high voltage required to program
and erase the Flash memory is generated internally. It is not possible to read from a Flash block while it is
being erased or programmed.
CAUTION
A Flash word must be in the erased state before being programmed.
Cumulative programming of bits within a Flash word is not allowed.
2.1.1
Glossary
Command Write Sequence — A three-step MCU instruction sequence to execute built-in algorithms
(including program and erase) on the Flash memory.
Multiple-Input Signature Register (MISR) — A Multiple-Input Signature Register is an output
response analyzer implemented using a linear feedback shift-register (LFSR). A 16-bit MISR is used to
compress data and generate a signature that is particular to the data read from a Flash block.
2.1.2
Features
•
512 Kbytes of Flash memory comprised of four 128 Kbyte blocks with each block divided into
128 sectors of 1024 bytes
•
•
•
•
•
•
•
Automated program and erase algorithm
Interrupts on Flash command completion, command buffer empty
Fast sector erase and word program operation
2-stage command pipeline for faster multi-word program times
Sector erase abort feature for critical interrupt response
Flexible protection scheme to prevent accidental program or erase
Single power supply for all Flash operations including program and erase
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512 Kbyte Flash Module (S12XFTX512K4V2)
•
•
Security feature to prevent unauthorized access to the Flash memory
Code integrity check using built-in data compression
2.1.3
Modes of Operation
Program, erase, erase verify, and data compress operations (please refer to Section 2.4.1, “Flash Command
Operations” for details).
2.1.4
Block Diagram
A block diagram of the Flash module is shown in Figure 2-1.
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512 Kbyte Flash Module (S12XFTX512K4V2)
FTX512K4
Flash Block 0
64K * 16 Bits
sector 0
sector 1
Flash
Interface
Command Pipeline
sector 127
Command
Interrupt
Request
Flash Block 1
64K * 16 Bits
cmd1
cmd2
addr1
addr2
data1_0
data1_1
data1_2
data1_3
data2_0
data2_1
data2_2
data2_3
sector 0
sector 1
Registers
sector 127
Flash Block 2
64K * 16 Bits
Protection
Security
sector 0
sector 1
sector 127
Oscillator
Clock
Clock
Divider
Flash Block 3
64K * 16 Bits
FCLK
sector 0
sector 1
sector 127
Figure 2-1. FTX512K4 Block Diagram
2.2
External Signal Description
The Flash module contains no signals that connect off-chip.
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512 Kbyte Flash Module (S12XFTX512K4V2)
2.3
Memory Map and Register Definition
This section describes the memory map and registers for the Flash module.
2.3.1
Module Memory Map
addresses between global addresses 0x78_0000 and 0x7F_FFFF. The FPROT register, described in
Section 2.3.2.5, “Flash Protection Register (FPROT)”, can be set to protect regions in the Flash memory
from accidental program or erase. Three separate memory regions, one growing upward from global
address 0x7F_8000 in the Flash memory (called the lower region), one growing downward from global
address 0x7F_FFFF in the Flash memory (called the higher region), and the remaining addresses in the
Flash memory, can be activated for protection. The Flash memory addresses covered by these protectable
regions are shown in the Flash memory map. The higher address region is mainly targeted to hold the boot
loader code since it covers the vector space. The lower address region can be used for EEPROM emulation
in an MCU without an EEPROM module since it can be left unprotected while the remaining addresses
are protected from program or erase. Default protection settings as well as security information that allows
the MCU to restrict access to the Flash module are stored in the Flash configuration field as described in
Table 2-1.
Table 2-1. Flash Configuration Field
Size
(Bytes)
Global Address
Description
0x7F_FF00 – 0x7F_FF07
8
Backdoor Comparison Key
Refer to Section 2.6.1, “Unsecuring the MCU using Backdoor Key Access”
0x7F_FF08 – 0x7F_FF0C
0x7F_FF0D
5
1
Reserved
Flash Protection byte
0x7F_FF0E
0x7F_FF0F
1
1
Flash Nonvolatile byte
Flash Security byte
Refer to Section 2.3.2.2, “Flash Security Register (FSEC)”
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512 Kbyte Flash Module (S12XFTX512K4V2)
MODULE BASE + 0x0000
Flash Registers
16 bytes
MODULE BASE + 0x000F
FLASH START = 0x78_0000
Flash Protected/Unprotected Region
480 Kbytes
0x7F_8000
0x7F_8400
0x7F_8800
Flash Protected/Unprotected Lower Region
1, 2, 4, 8 Kbytes
0x7F_9000
0x7F_A000
Flash Protected/Unprotected Region
8 Kbytes (up to 29 Kbytes)
0x7F_C000
Flash Protected/Unprotected Higher Region
2, 4, 8, 16 Kbytes
0x7F_E000
0x7F_F000
0x7F_F800
Flash Configuration Field
16 bytes (0x7F_FF00 - 0x7F_FF0F)
FLASH END = 0x7F_FFFF
Figure 2-2. Flash Memory Map
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512 Kbyte Flash Module (S12XFTX512K4V2)
The Flash module also contains a set of 16 control and status registers located between module base +
0x0000 and 0x000F. A summary of the Flash module registers is given in Table 2-2 while their
accessibility is detailed in Section 2.3.2, “Register Descriptions”.
Table 2-2. Flash Register Map
Module
Base +
Normal Mode
Access
Register Name
0x0000
0x0001
0x0002
0x0003
0x0004
0x0005
0x0006
0x0007
0x0008
0x0009
0x000A
0x000B
0x000C
0x000D
0x000E
0x000F
Flash Clock Divider Register (FCLKDIV)
Flash Security Register (FSEC)
R/W
R
Flash Test Mode Register (FTSTMOD)
Flash Configuration Register (FCNFG)
Flash Protection Register (FPROT)
Flash Status Register (FSTAT)
R/W
R/W
R/W
R/W
R/W
R
Flash Command Register (FCMD)
Flash Control Register (FCTL)
1
Flash High Address Register (FADDRHI)
Flash Low Address Register (FADDRLO)
Flash High Data Register (FDATAHI)
Flash Low Data Register (FDATALO)
R
1
R
R
R
1
RESERVED1
R
1
RESERVED2
R
1
RESERVED3
R
1
RESERVED4
R
1 Intended for factory test purposes only.
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512 Kbyte Flash Module (S12XFTX512K4V2)
2.3.2
Register Descriptions
Register
Name
Bit 7
6
5
4
3
2
1
Bit 0
0x0000
FCLKDIV
R
FDIVLD
PRDIV8
FDIV5
RNV5
FDIV4
RNV4
FDIV3
RNV3
FDIV2
RNV2
FDIV1
FDIV0
W
0x0001
FSEC
R
KEYEN
SEC
W
0x0002
FTSTMOD
R
0
0
0
0
0
0
0
0
0
0
0
MRDS
W
0x0003
FCNFG
R
CBEIE
CCIE
KEYACC
FPHDIS
PVIOL
W
0x0004
FPROT
R
RNV6
FPOPEN
FPHS
FPLDIS
BLANK
FPLS
W
0x0005
FSTAT
R
CCIF
NV6
0
0
0
CBEIF
0
ACCERR
W
0x0006
FCMD
R
CMDB
NV3
W
0x0007
FCTL
R
NV7
NV5
NV4
NV2
NV1
NV0
W
0x0008
R
FADDRHI
FADDRHI
W
0x0009
FADDRLO
R
FADDRLO
FDATAHI
FDATALO
W
0x000A
FDATAHI
R
W
0x000B
R
FDATALO
W
0x000C
R
0
0
0
0
0
0
0
0
RESERVED1
W
Figure 2-3. FTX512K4 Register Summary
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512 Kbyte Flash Module (S12XFTX512K4V2)
Register
Bit 7
6
5
4
3
2
1
Bit 0
Name
0x000D
R
0
0
0
0
0
0
0
0
RESERVED2
W
0x000E
RESERVED3
R
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
W
0x000F
R
RESERVED4
W
Figure 2-3. FTX512K4 Register Summary (continued)
2.3.2.1
Flash Clock Divider Register (FCLKDIV)
The FCLKDIV register is used to control timed events in program and erase algorithms.
Module Base + 0x0000
7
6
5
4
3
2
1
0
R
W
FDIVLD
PRDIV8
FDIV5
FDIV4
FDIV3
FDIV2
FDIV1
FDIV0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 2-4. Flash Clock Divider Register (FCLKDIV)
All bits in the FCLKDIV register are readable, bits 6-0 are write once and bit 7 is not writable.
Table 2-3. FCLKDIV Field Descriptions
Field
Description
7
Clock Divider Loaded.
FDIVLD
0 Register has not been written.
1 Register has been written to since the last reset.
6
Enable Prescalar by 8.
PRDIV8
0 The oscillator clock is directly fed into the clock divider.
1 The oscillator clock is divided by 8 before feeding into the clock divider.
5-0
Clock Divider Bits — The combination of PRDIV8 and FDIV[5:0] must divide the oscillator clock down to a
FDIV[5:0] frequency of 150 kHz–200 kHz. The maximum divide ratio is 512. Please refer to Section 2.4.1.1, “Writing the
FCLKDIV Register” for more information.
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512 Kbyte Flash Module (S12XFTX512K4V2)
2.3.2.2
Flash Security Register (FSEC)
The FSEC register holds all bits associated with the security of the MCU and Flash module.
Module Base + 0x0001
7
6
5
4
3
2
1
0
R
W
KEYEN
RNV5
RNV4
RNV3
RNV2
SEC
Reset
F
F
F
F
F
F
F
F
= Unimplemented or Reserved
Figure 2-5. Flash Security Register (FSEC)
All bits in the FSEC register are readable but are not writable.
The FSEC register is loaded from the Flash Configuration Field at address 0x7F_FF0F during the reset
sequence, indicated by F in Figure 2-5.
Table 2-4. FSEC Field Descriptions
Field
Description
7-6
Backdoor Key Security Enable Bits — The KEYEN[1:0] bits define the enabling of backdoor key access to the
KEYEN[1:0] Flash module as shown in Table 2-5.
5-2
Reserved Nonvolatile Bits — The RNV[5:2] bits should remain in the erased state for future enhancements.
RNV[5:2]
1-0
Flash Security Bits — The SEC[1:0] bits define the security state of the MCU as shown in Table 2-6. If the Flash
SEC[1:0]
module is unsecured using backdoor key access, the SEC[1:0] bits are forced to 1:0.
Table 2-5. Flash KEYEN States
KEYEN[1:0]
Status of Backdoor Key Access
00
DISABLED
DISABLED
ENABLED
DISABLED
1
01
10
11
1 Preferred KEYEN state to disable Backdoor Key Access.
Table 2-6. Flash Security States
SEC[1:0]
Status of Security
00
SECURED
SECURED
1
01
10
11
UNSECURED
SECURED
The security function in the Flash module is described in Section 2.6, “Flash Module Security”.
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512 Kbyte Flash Module (S12XFTX512K4V2)
2.3.2.3
Flash Test Mode Register (FTSTMOD)
The FTSTMOD register is used to control Flash test features.
Module Base + 0x0002
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
MRDS
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 2-6. Flash Test Mode Register (FTSTMOD —Normal Mode)
Module Base + 0x0002
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
MRDS
WRALL
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 2-7. Flash Test Mode Register (FTSTMOD — Special Mode)
MRDS bits are readable and writable while all remaining bits read 0 and are not writable in normal mode.
The WRALL bit is writable only in special mode to simplify mass erase and erase verify operations. When
writing to the FTSTMOD register in special mode, all unimplemented/reserved bits must be written to 0.
Table 2-7. FTSTMOD Field Descriptions
Field
Description
6–5
Margin Read Setting — The MRDS[1:0] bits are used to set the sense-amp margin level for reads of the Flash
MRDS[1:0] array as shown in Table 2-8.
4
Write to all Register Banks — If the WRALL bit is set, all banked FDATA registers sharing the same register
WRALL
address will be written simultaneously during a register write.
0 Write only to the FDATA register bank selected using BKSEL.
1 Write to all FDATA register banks.
Table 2-8. FTSTMOD Margin Read Settings
MRDS[1:0]
Margin Read Setting
00
01
10
11
Normal
1
Program Margin
2
Erase Margin
Normal
1 Flash array reads will be sensitive to program margin.
2 Flash array reads will be sensitive to erase margin.
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512 Kbyte Flash Module (S12XFTX512K4V2)
2.3.2.4
Flash Configuration Register (FCNFG)
The FCNFG register enables the Flash interrupts and gates the security backdoor writes.
Module Base + 0x0003
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
CBEIE
CCIE
KEYACC
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 2-8. Flash Configuration Register (FCNFG — Normal Mode)
Module Base + 0x0003
7
6
5
4
3
2
1
0
R
0
0
0
CBEIE
W
CCIE
KEYACC
BKSEL
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 2-9. Flash Configuration Register (FCNFG — Special Mode)
writable in normal mode. KEYACC is only writable if KEYEN (see Section 2.3.2.2, “Flash Security
Register (FSEC)” is set to the enabled state. BKSEL is readable and writable in special mode to simplify
mass erase and erase verify operations. When writing to the FCNFG register in special mode, all
unimplemented/ reserved bits must be written to 0.
Table 2-9. FCNFG Field Descriptions
Field
Description
7
Command Buffer Empty Interrupt Enable — The CBEIE bit enables an interrupt in case of an empty command
CBEIE
buffer in the Flash module.
0 Command buffer empty interrupt disabled.
1 An interrupt will be requested whenever the CBEIF flag (see Section 2.3.2.6, “Flash Status Register (FSTAT)”)
is set.
6
Command Complete Interrupt Enable — The CCIE bit enables an interrupt in case all commands have been
CCIE
completed in the Flash module.
0 Command complete interrupt disabled.
1 An interrupt will be requested whenever the CCIF flag (see Section 2.3.2.6, “Flash Status Register (FSTAT)”)
is set.
5
Enable Security Key Writing
KEYACC
0 Flash writes are interpreted as the start of a command write sequence.
1 Writes to Flash array are interpreted as keys to open the backdoor. Reads of the Flash array return invalid
data.
1–0
Block Select — The BKSEL[1:0] bits indicates which register bank is active according to Table 2-10.
BKSEL[1:0]
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512 Kbyte Flash Module (S12XFTX512K4V2)
Table 2-10. Flash Register Bank Selects
BKSEL[1:0]
Selected Block
00
01
10
11
Flash Block 0
Flash Block 1
Flash Block 2
Flash Block 3
2.3.2.5
Flash Protection Register (FPROT)
The FPROT register defines which Flash sectors are protected against program or erase operations.
Module Base + 0x0004
7
6
5
4
3
2
1
0
R
W
RNV6
FPOPEN
FPHDIS
FPHS
FPLDIS
FPLS
Reset
F
F
F
F
F
F
F
F
= Unimplemented or Reserved
Figure 2-10. Flash Protection Register (FPROT)
All bits in the FPROT register are readable and writable with restrictions (see Section 2.3.2.5.1, “Flash
Protection Restrictions”) except for RNV[6] which is only readable.
During the reset sequence, the FPROT register is loaded from the Flash Configuration Field at global
address 0x7F_FF0D. To change the Flash protection that will be loaded during the reset sequence, the
upper sector of the Flash memory must be unprotected, then the Flash Protect/Security byte located as
described in Table 2-1 must be reprogrammed.
Trying to alter data in any protected area in the Flash memory will result in a protection violation error and
the PVIOL flag will be set in the FSTAT register. The mass erase of a Flash block is not possible if any of
the Flash sectors contained in the Flash block are protected.
Table 2-11. FPROT Field Descriptions
Field
Description
7
Flash Protection Open — The FPOPEN bit determines the protection function for program or erase as shown
FPOPEN in Table 2-12.
0 The FPHDIS and FPLDIS bits define unprotected address ranges as specified by the corresponding
FPHS[1:0] and FPLS[1:0] bits. For an MCU without an EEPROM module, the FPOPEN clear state allows the
main part of the Flash block to be protected while a small address range can remain unprotected for EEPROM
emulation.
1 The FPHDIS and FPLDIS bits enable protection for the address range specified by the corresponding
FPHS[1:0] and FPLS[1:0] bits.
6
Reserved Nonvolatile Bit — The RNV[6] bit should remain in the erased state for future enhancements.
RNV6
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512 Kbyte Flash Module (S12XFTX512K4V2)
Table 2-11. FPROT Field Descriptions (continued)
Field
Description
5
Flash Protection Higher Address Range Disable — The FPHDIS bit determines whether there is a
protected/unprotected area in a specific region of the Flash memory ending with global address 0x7F_FFFF.
0 Protection/Unprotection enabled.
FPHDIS
1 Protection/Unprotection disabled.
4–3
Flash Protection Higher Address Size — The FPHS[1:0] bits determine the size of the protected/unprotected
FPHS[1:0] area as shown inTable 2-13. The FPHS[1:0] bits can only be written to while the FPHDIS bit is set.
2
Flash Protection Lower Address Range Disable — The FPLDIS bit determines whether there is a
protected/unprotected area in a specific region of the Flash memory beginning with global address 0x7F_8000.
0 Protection/Unprotection enabled.
FPLDIS
1 Protection/Unprotection disabled.
1–0
Flash Protection Lower Address Size — The FPLS[1:0] bits determine the size of the protected/unprotected
FPLS[1:0] area as shown in Table 2-14. The FPLS[1:0] bits can only be written to while the FPLDIS bit is set.
Table 2-12. Flash Protection Function
1
FPOPEN
FPHDIS
FPLDIS
Function
1
1
1
1
0
0
0
0
1
1
0
0
1
1
0
0
1
0
1
0
1
0
1
0
No Protection
Protected Low Range
Protected High Range
Protected High and Low Ranges
Full Flash memory Protected
Unprotected Low Range
Unprotected High Range
Unprotected High and Low Ranges
1 For range sizes, refer to Table 2-13 and Table 2-14.
Table 2-13. Flash Protection Higher Address Range
Global
FPHS[1:0]
Protected Size
Address Range
00
01
10
11
0x7F_F800–0x7F_FFFF
0x7F_F000–0x7F_FFFF
0x7F_E000–0x7F_FFFF
0x7F_C000–0x7F_FFFF
2 Kbytes
4 Kbytes
8 Kbytes
16 Kbytes
Table 2-14. Flash Protection Lower Address Range
Global
FPLS[1:0]
Protected Size
Address Range
00
01
10
11
0x7F_8000–0x7F_83FF
0x7F_8000–0x7F_87FF
0x7F_8000–0x7F_8FFF
0x7F_8000–0x7F_9FFF
1 Kbytes
2 Kbytes
4 Kbytes
8 Kbytes
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512 Kbyte Flash Module (S12XFTX512K4V2)
All possible Flash protection scenarios are shown in Figure 2-11. Although the protection scheme is
loaded from the Flash array at global address 0x7F_FF0D during the reset sequence, it can be changed by
the user. This protection scheme can be used by applications requiring re-programming in single chip
mode while providing as much protection as possible if re-programming is not required.
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512 Kbyte Flash Module (S12XFTX512K4V2)
FPHDIS=1
FPLDIS=1
FPHDIS=1
FPLDIS=0
FPHDIS=0
FPLDIS=1
FPHDIS=0
FPLDIS=0
7
6
5
4
Scenario
0x78_0000
0x7F_8000
FPLS[1:0]
FPOPEN=1
FPHS[1:0]
0x7F_FFFF
0x78_0000
Scenario
3
2
1
0
0x7F_8000
FPLS[1:0]
FPOPEN=0
FPHS[1:0]
0x7F_FFFF
Protected region with size
Unprotected region
Protected region
defined by FPLS
Protected region with size
defined by FPHS
not defined by FPLS, FPHS
Figure 2-11. Flash Protection Scenarios
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512 Kbyte Flash Module (S12XFTX512K4V2)
2.3.2.5.1
Flash Protection Restrictions
The general guideline is that Flash protection can only be added and not removed. Table 2-15 specifies all
valid transitions between Flash protection scenarios. Any attempt to write an invalid scenario to the
FPROT register will be ignored and the FPROT register will remain unchanged. The contents of the
FPROT register reflect the active protection scenario. See the FPHS and FPLS descriptions for additional
restrictions.
Table 2-15. Flash Protection Scenario Transitions
1
To Protection Scenario
From
Protection Scenario
0
1
X
X
2
3
X
X
X
X
X
X
X
X
4
5
6
7
0
1
2
3
4
5
6
7
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
1 Allowed transitions marked with X.
2.3.2.6
Flash Status Register (FSTAT)
The FSTAT register defines the operational status of the module.
Module Base + 0x0005
7
6
5
4
3
2
1
0
R
W
CCIF
0
BLANK
0
0
CBEIF
PVIOL
ACCERR
Reset
1
1
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 2-12. Flash Status Register (FSTAT — Normal Mode)
Module Base + 0x0005
7
6
5
4
3
2
1
0
R
CCIF
0
BLANK
0
CBEIF
W
PVIOL
ACCERR
FAIL
0
Reset
1
1
0
0
0
0
0
= Unimplemented or Reserved
Figure 2-13. Flash Status Register (FSTAT — Special Mode)
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512 Kbyte Flash Module (S12XFTX512K4V2)
CBEIF, PVIOL, and ACCERR are readable and writable, CCIF and BLANK are readable and not writable,
remaining bits read 0 and are not writable in normal mode. FAIL is readable and writable in special mode.
FAIL must be clear in special mode when starting a command write sequence.
Table 2-16. FSTAT Field Descriptions
Field
Description
7
Command Buffer Empty Interrupt Flag — The CBEIF flag indicates that the address, data and command
buffers are empty so that a new command write sequence can be started. Writing a 0 to the CBEIF flag has no
effect on CBEIF. Writing a 0 to CBEIF after writing an aligned word to the Flash address space, but before CBEIF
is cleared, will abort a command write sequence and cause the ACCERR flag to be set. Writing a 0 to CBEIF
outside of a command write sequence will not set the ACCERR flag. The CBEIF flag is cleared by writing a 1 to
CBEIF. The CBEIF flag is used together with the CBEIE bit in the FCNFG register to generate an interrupt
request (see Figure 2-32).
CBEIF
0 Command buffers are full.
1 Command buffers are ready to accept a new command.
6
Command Complete Interrupt Flag — The CCIF flag indicates that there are no more commands pending. The
CCIF flag is cleared when CBEIF is cleared and sets automatically upon completion of all active and pending
commands. The CCIF flag does not set when an active commands completes and a pending command is
fetched from the command buffer. Writing to the CCIF flag has no effect on CCIF. The CCIF flag is used together
with the CCIE bit in the FCNFG register to generate an interrupt request (see Figure 2-32).
0 Command in progress.
CCIF
1 All commands are completed.
5
Protection Violation Flag —The PVIOL flag indicates an attempt was made to program or erase an address in
a protected area of the Flash memory during a command write sequence. Writing a 0 to the PVIOL flag has no
effect on PVIOL. The PVIOL flag is cleared by writing a 1 to PVIOL. While PVIOL is set, it is not possible to launch
a command or start a command write sequence.
PVIOL
0 No protection violation detected.
1 Protection violation has occurred.
4
Access Error Flag — The ACCERR flag indicates an illegal access has occurred to the Flash memory caused
ACCERR by either a violation of the command write sequence (see Section 2.4.1.2, “Command Write Sequence”), issuing
an illegal Flash command (see Table 2-18), launching the sector erase abort command terminating a sector
erase operation early (see Section 2.4.2.6, “Sector Erase Abort Command”) or the execution of a CPU STOP
instruction while a command is executing (CCIF = 0). Writing a 0 to the ACCERR flag has no effect on ACCERR.
The ACCERR flag is cleared by writing a 1 to ACCERR.While ACCERR is set, it is not possible to launch a
command or start a command write sequence. If ACCERR is set by an erase verify operation or a data compress
operation, any buffered command will not launch.
0 No access error detected.
1 Access error has occurred.
2
Flag Indicating the Erase Verify Operation Status — When the CCIF flag is set after completion of an erase
verify command, the BLANK flag indicates the result of the erase verify operation. The BLANK flag is cleared by
the Flash module when CBEIF is cleared as part of a new valid command write sequence. Writing to the BLANK
flag has no effect on BLANK.
BLANK
0 Flash block verified as not erased.
1 Flash block verified as erased.
1
Flag Indicating a Failed Flash Operation — The FAIL flag will set if the erase verify operation fails (selected
FAIL
Flash block verified as not erased). Writing a 0 to the FAIL flag has no effect on FAIL. The FAIL flag is cleared by
writing a 1 to FAIL.
0 Flash operation completed without error.
1 Flash operation failed.
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512 Kbyte Flash Module (S12XFTX512K4V2)
2.3.2.7
Flash Command Register (FCMD)
The FCMD register is the Flash command register.
Module Base + 0x0006
7
6
5
4
3
2
1
0
R
W
0
CMDB
Reset
1
1
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 2-14. Flash Command Register (FCMD)
All CMDB bits are readable and writable during a command write sequence while bit 7 reads 0 and is not
writable.
Table 2-17. FCMD Field Descriptions
Field
6-0
Flash Command — Valid Flash commands are shown in Table 2-18. Writing any command other than those
CMDB[6:0] listed in Table 2-18 sets the ACCERR flag in the FSTAT register.
Table 2-18. Valid Flash Command List
CMDB[6:0]
NVM Command
0x05
0x06
0x20
0x40
0x41
0x47
Erase Verify
Data Compress
Word Program
Sector Erase
Mass Erase
Sector Erase Abort
2.3.2.8
Flash Control Register (FCTL)
The FCTL register is the Flash control register.
Module Base + 0x0007
7
6
5
4
3
2
1
0
R
W
NV7
NV6
NV5
NV4
NV3
NV2
NV1
NV0
Reset
F
F
F
F
F
F
F
F
= Unimplemented or Reserved
Figure 2-15. Flash Control Register (FCTL)
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All bits in the FCTL register are readable but are not writable.
The FCTL register is loaded from the Flash Configuration Field byte at global address 0x7F_FF0E during
the reset sequence, indicated by F in Figure 2-15.
Table 2-19. FCTL Field Descriptions
Field
Description
7-0
Non volatile Bits — The NV[7:0] bits are available as nonvolatile bits. Refer to the Device User Guide for proper
NV[7:0]
use of the NV bits.
2.3.2.9
Flash Address Registers (FADDR)
The FADDRHI and FADDRLO registers are the Flash address registers.
Module Base + 0x0008
7
6
5
4
3
2
1
0
R
W
FADDRHI
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 2-16. Flash Address High Register (FADDRHI)
Module Base + 0x0009
7
6
5
4
3
2
1
0
R
FADDRLO
W
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 2-17. Flash Address Low Register (FADDRLO)
All FADDRHI and FADDRLO bits are readable but are not writable. After an array write as part of a
command write sequence, the FADDR registers will contain the mapped MCU address written.
2.3.2.10 Flash Data Registers (FDATA)
The FDATAHI and FDATALO registers are the Flash data registers.
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512 Kbyte Flash Module (S12XFTX512K4V2)
Module Base + 0x000A
7
6
5
4
3
2
1
0
R
W
FDATAHI
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 2-18. Flash Data High Register (FDATAHI)
Module Base + 0x000B
7
6
5
4
3
2
1
0
R
FDATALO
W
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 2-19. Flash Data Low Register (FDATALO)
All FDATAHI and FDATALO bits are readable but are not writable. At the completion of a data compress
operation, the resulting 16-bit signature is stored in the FDATA registers. The data compression signature
is readable in the FDATA registers until a new command write sequence is started.
2.3.2.11 RESERVED1
This register is reserved for factory testing and is not accessible.
Module Base + 0x000C
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 2-20. RESERVED1
All bits read 0 and are not writable.
2.3.2.12 RESERVED2
This register is reserved for factory testing and is not accessible.
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512 Kbyte Flash Module (S12XFTX512K4V2)
Module Base + 0x000D
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 2-21. RESERVED2
All bits read 0 and are not writable.
2.3.2.13 RESERVED3
This register is reserved for factory testing and is not accessible.
Module Base + 0x000E
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 2-22. RESERVED3
All bits read 0 and are not writable.
2.3.2.14 RESERVED4
This register is reserved for factory testing and is not accessible.
Module Base + 0x000F
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 2-23. RESERVED4
All bits read 0 and are not writable.
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512 Kbyte Flash Module (S12XFTX512K4V2)
2.4
Functional Description
2.4.1
Flash Command Operations
Write operations are used to execute program, erase, erase verify, erase abort, and data compress
algorithms described in this section. The program and erase algorithms are controlled by a state machine
whose timebase, FCLK, is derived from the oscillator clock via a programmable divider. The command
register, as well as the associated address and data registers, operate as a buffer and a register (2-stage
FIFO) so that a second command along with the necessary data and address can be stored to the buffer
while the first command is still in progress. This pipelined operation allows a time optimization when
programming more than one word on a specific row in the Flash block as the high voltage generation can
be kept active in between two programming commands. The pipelined operation also allows a
simplification of command launching. Buffer empty as well as command completion are signalled by flags
in the Flash status register with corresponding interrupts generated, if enabled.
The next sections describe:
1. How to write the FCLKDIV register
2. Command write sequences to program, erase, erase verify, erase abort, and data compress
operations on the Flash memory
3. Valid Flash commands
4. Effects resulting from illegal Flash command write sequences or aborting Flash operations
2.4.1.1
Writing the FCLKDIV Register
Prior to issuing any Flash command after a reset, the user is required to write the FCLKDIV register to
divide the oscillator clock down to within the 150 kHz to 200 kHz range. Since the program and erase
timings are also a function of the bus clock, the FCLKDIV determination must take this information into
account.
If we define:
•
•
•
FCLK as the clock of the Flash timing control block
Tbus as the period of the bus clock
INT(x) as taking the integer part of x (e.g. INT(4.323) = 4)
then FCLKDIV register bits PRDIV8 and FDIV[5:0] are to be set as described in Figure 2-24.
For example, if the oscillator clock frequency is 950kHz and the bus clock frequency is 10MHz,
FCLKDIV bits FDIV[5:0] should be set to 0x04 (000100) and bit PRDIV8 set to 0. The resulting FCLK
frequency is then 190kHz. As a result, the Flash program and erase algorithm timings are increased over
the optimum target by:
(200 – 190) ⁄ 200 × 100 = 5%
If the oscillator clock frequency is 16MHz and the bus clock frequency is 40MHz, FCLKDIV bits
FDIV[5:0] should be set to 0x0A (001010) and bit PRDIV8 set to 1. The resulting FCLK frequency is then
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512 Kbyte Flash Module (S12XFTX512K4V2)
182kHz. In this case, the Flash program and erase algorithm timings are increased over the optimum target
by:
(200 – 182) ⁄ 200 × 100 = 9%
CAUTION
Program and erase command execution time will increase proportionally
with the period of FCLK. Because of the impact of clock synchronization
on the accuracy of the functional timings, programming or erasing the Flash
memory cannot be performed if the bus clock runs at less than 1 MHz.
Programming or erasing the Flash memory with FCLK < 150 kHz should
be avoided. Setting FCLKDIV to a value such that FCLK < 150 kHz can
destroy the Flash memory due to overstress. Setting FCLKDIV to a value
such that (1/FCLK+Tbus) < 5µs can result in incomplete programming or
erasure of the Flash memory cells.
If the FCLKDIV register is written, the FDIVLD bit is set automatically. If the FDIVLD bit is 0, the
FCLKDIV register has not been written since the last reset. If the FCLKDIV register has not been written
to, the Flash command loaded during a command write sequence will not execute and the ACCERR flag
in the FSTAT register will set.
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512 Kbyte Flash Module (S12XFTX512K4V2)
START
no
Tbus < 1µs?
ALL COMMANDS IMPOSSIBLE
yes
PRDIV8=0 (reset)
no
oscillator_clock
12.8MHz?
yes
PRDIV8=1
PRDCLK=oscillator_clock/8
PRDCLK=oscillator_clock
no
PRDCLK[MHz]*(5+Tbus[µs])
an integer?
FDIV[5:0]=INT(PRDCLK[MHz]*(5+Tbus[µs]))
yes
FDIV[5:0]=PRDCLK[MHz]*(5+Tbus[µs])-1
TRY TO DECREASE Tbus
FCLK=(PRDCLK)/(1+FDIV[5:0])
yes
1/FCLK[MHz] + Tbus[µs] > 5
END
AND
FCLK > 0.15MHz
?
no
yes
FDIV[5:0] > 4?
no
ALL COMMANDS IMPOSSIBLE
Figure 2-24. Determination Procedure for PRDIV8 and FDIV Bits
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512 Kbyte Flash Module (S12XFTX512K4V2)
2.4.1.2
Command Write Sequence
The Flash command controller is used to supervise the command write sequence to execute program,
erase, erase verify, erase abort, and data compress algorithms.
Before starting a command write sequence, the ACCERR and PVIOL flags in the FSTAT register must be
clear (see Section 2.3.2.6, “Flash Status Register (FSTAT)”) and the CBEIF flag should be tested to
determine the state of the address, data and command buffers. If the CBEIF flag is set, indicating the
buffers are empty, a new command write sequence can be started. If the CBEIF flag is clear, indicating the
buffers are not available, a new command write sequence will overwrite the contents of the address, data
and command buffers.
A command write sequence consists of three steps which must be strictly adhered to with writes to the
Flash module not permitted between the steps. However, Flash register and array reads are allowed during
a command write sequence. The basic command write sequence is as follows:
1. Write to a valid address in the Flash memory. Addresses in multiple Flash blocks can be written to
as long as the location is at the same relative address in each available Flash block. Multiple
addresses must be written in Flash block order starting with the lower Flash block.
2. Write a valid command to the FCMD register.
3. Clear the CBEIF flag in the FSTAT register by writing a 1 to CBEIF to launch the command.
The address written in step 1 will be stored in the FADDR registers and the data will be stored in the
FDATA registers. If the CBEIF flag in the FSTAT register is clear when the first Flash array write occurs,
the contents of the address and data buffers will be overwritten and the CBEIF flag will be set. When the
CBEIF flag is cleared, the CCIF flag is cleared on the same bus cycle by the Flash command controller
indicating that the command was successfully launched. For all command write sequences except data
compress and sector erase abort, the CBEIF flag will set four bus cycles after the CCIF flag is cleared
indicating that the address, data, and command buffers are ready for a new command write sequence to
begin. For data compress and sector erase abort operations, the CBEIF flag will remain clear until the
operation completes. Except for the sector erase abort command, a buffered command will wait for the
active operation to be completed before being launched. The sector erase abort command is launched when
the CBEIF flag is cleared as part of a sector erase abort command write sequence. Once a command is
launched, the completion of the command operation is indicated by the setting of the CCIF flag in the
FSTAT register. The CCIF flag will set upon completion of all active and buffered commands.
2.4.2
Flash Commands
Table 2-20 summarizes the valid Flash commands along with the effects of the commands on the Flash
block.
Table 2-20. Flash Command Description
NVM
Command
FCMDB
Function on Flash Memory
0x05
Erase
Verify
Verify all memory bytes in the Flash block are erased.
If the Flash block is erased, the BLANK flag in the FSTAT register will set upon command
completion.
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512 Kbyte Flash Module (S12XFTX512K4V2)
Table 2-20. Flash Command Description
NVM
Command
FCMDB
Function on Flash Memory
0x06
Data
Compress
Compress data from a selected portion of the Flash block.
The resulting signature is stored in the FDATA register.
0x20
0x40
Program
Program a word (two bytes) in the Flash block.
Sector
Erase
Erase all memory bytes in a sector of the Flash block.
0x41
0x47
Mass
Erase
Erase all memory bytes in the Flash block.
A mass erase of the full Flash block is only possible when FPLDIS, FPHDIS and
FPOPEN bits in the FPROT register are set prior to launching the command.
Sector
Erase
Abort
Abort the sector erase operation.
The sector erase operation will terminate according to a set procedure. The Flash sector
should not be considered erased if the ACCERR flag is set upon command completion.
CAUTION
A Flash word must be in the erased state before being programmed.
Cumulative programming of bits within a Flash word is not allowed.
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512 Kbyte Flash Module (S12XFTX512K4V2)
2.4.2.1
Erase Verify Command
The erase verify operation will verify that a Flash block is erased.
An example flow to execute the erase verify operation is shown in Figure 2-25. The erase verify command
write sequence is as follows:
1. Write to a Flash block address to start the command write sequence for the erase verify command.
The address and data written will be ignored. Multiple Flash blocks can be simultaneously erase
verified by writing to the same relative address in each Flash block.
2. Write the erase verify command, 0x05, to the FCMD register.
3. Clear the CBEIF flag in the FSTAT register by writing a 1 to CBEIF to launch the erase verify
command.
After launching the erase verify command, the CCIF flag in the FSTAT register will set after the operation
has completed unless a new command write sequence has been buffered. The number of bus cycles
required to execute the erase verify operation is equal to the number of addresses in a Flash block plus 14
bus cycles as measured from the time the CBEIF flag is cleared until the CCIF flag is set. Upon completion
of the erase verify operation, the BLANK flag in the FSTAT register will be set if all addresses in the
selected Flash blocks are verified to be erased. If any address in a selected Flash block is not erased, the
erase verify operation will terminate and the BLANK flag in the FSTAT register will remain clear. The
MRDS bits in the FTSTMOD register will determine the sense-amp margin setting during the erase verify
operation.
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512 Kbyte Flash Module (S12XFTX512K4V2)
START
Read: FCLKDIV register
Clock Register
Written
NOTE: FCLKDIV needs to
be set once after each reset.
FDIVLD
Set?
no
Check
yes
Write: FCLKDIV register
Read: FSTAT register
Address, Data,
Command
Buffer Empty Check
CBEIF
Set?
no
yes
ACCERR/
PVIOL
Set?
yes
Access Error and
Protection Violation
Check
Write: FSTAT register
Clear ACCERR/PVIOL 0x30
no
Write: Flash Block Address
and Dummy Data
1.
Simultaneous
Multiple Flash Block
Decision
Next
Flash
Block?
yes
Decrement Global Address
by 128K
no
Write: FCMD register
2.
3.
Erase Verify Command 0x05
Write: FSTAT register
Clear CBEIF 0x80
Read: FSTAT register
Bit Polling for
Command Completion
Check
no
CCIF
Set?
yes
Erase Verify
Status
no
BLANK
Set?
yes
Flash Block
Erased
Flash Block
EXIT
EXIT
Not Erased
Figure 2-25. Example Erase Verify Command Flow
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512 Kbyte Flash Module (S12XFTX512K4V2)
2.4.2.2
Data Compress Command
The data compress operation will check Flash code integrity by compressing data from a selected portion
of the Flash memory into a signature analyzer.
An example flow to execute the data compress operation is shown in Figure 2-26. The data compress
command write sequence is as follows:
1. Write to a Flash block address to start the command write sequence for the data compress
command. The address written determines the starting address for the data compress operation and
the data written determines the number of consecutive words to compress. If the data value written
is 0x0000, 64K addresses or 128 Kbytes will be compressed. Multiple Flash blocks can be
simultaneously compressed by writing to the same relative address in each Flash block. If more
than one Flash block is written to in this step, the first data written will determine the number of
consecutive words to compress in each selected Flash block.
2. Write the data compress command, 0x06, to the FCMD register.
3. Clear the CBEIF flag in the FSTAT register by writing a 1 to CBEIF to launch the data compress
command.
After launching the data compress command, the CCIF flag in the FSTAT register will set after the data
compress operation has completed. The number of bus cycles required to execute the data compress
operation is equal to two times the number of consecutive words to compress plus the number of Flash
blocks simultaneously compressed plus 18 bus cycles as measured from the time the CBEIF flag is cleared
until the CCIF flag is set. Once the CCIF flag is set, the signature generated by the data compress operation
is available in the FDATA registers. The signature in the FDATA registers can be compared to the expected
signature to determine the integrity of the selected data stored in the selected Flash memory. If the last
address of a Flash block is reached during the data compress operation, data compression will continue
with the starting address of the same Flash block. The MRDS bits in the FTSTMOD register will determine
the sense-amp margin setting during the data compress operation.
NOTE
Since the FDATA registers (or data buffer) are written to as part of the data
compress operation, a command write sequence is not allowed to be
buffered behind a data compress command write sequence. The CBEIF flag
will not set after launching the data compress command to indicate that a
command should not be buffered behind it. If an attempt is made to start a
new command write sequence with a data compress operation active, the
ACCERR flag in the FSTAT register will be set. A new command write
sequence should only be started after reading the signature stored in the
FDATA registers.
In order to take corrective action, it is recommended that the data compress command be executed on a
Flash sector or subset of a Flash sector. If the data compress operation on a Flash sector returns an invalid
signature, the Flash sector should be erased using the sector erase command and then reprogrammed using
the program command.
The data compress command can be used to verify that a sector or sequential set of sectors are erased.
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512 Kbyte Flash Module (S12XFTX512K4V2)
START
Read: FCLKDIV register
Clock Register
Written
NOTE: FCLKDIV needs to
be set once after each reset.
FDIVLD
Set?
no
Check
yes
Write: FCLKDIV register
Read: FSTAT register
Address, Data,
Command
Buffer Empty Check
CBEIF
Set?
no
yes
ACCERR/
PVIOL
Set?
yes
Access Error and
Protection Violation
Check
Write: FSTAT register
Clear ACCERR/PVIOL 0x30
no
Write: Flash Address to start
compression and number of word
addresses to compress
1.
NOTE: address used to select
Flash block; data ignored.
Simultaneous
Multiple Flash Block
Decision
Next
Flash
Block?
yes
Decrement Global Address
by 128K
no
Write: FCMD register
2.
3.
Data Compress Command 0x06
Write: FSTAT register
Clear CBEIF 0x80
Read: FSTAT register
Bit Polling for
Command Completion
Check
no
no
CCIF
Set?
yes
Read: FDATA registers
Data Compress Signature
Signature
Valid?
Erase and Reprogram
Flash Sector(s) Compressed
yes
EXIT
Figure 2-26. Example Data Compress Command Flow
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512 Kbyte Flash Module (S12XFTX512K4V2)
2.4.2.2.1
Data Compress Operation
The Flash module contains a 16-bit multiple-input signature register (MISR) for each Flash block to
generate a 16-bit signature based on selected Flash array data. If multiple Flash blocks are selected for
simultaneous compression, then the signature from each Flash block is further compressed to generate a
single 16-bit signature. The final 16-bit signature, found in the FDATA registers after the data compress
operation has completed, is based on the following logic equation which is executed on every data
compression cycle during the operation:
MISR[15:0] = {MISR[14:0], ^MISR[15,4,2,1]} ^ DATA[15:0]
Eqn. 2-1
where MISR is the content of the internal signature register associated with each Flash block and DATA
is the data to be compressed as shown in Figure 2-27.
DATA[0]
DATA[1]
DATA[2]
DATA[3]
DATA[4]
DATA[5]
DATA[15]
...
+
+
+
+
+
+
+
D Q
M0
>
D Q
M1
>
D Q
M2
>
D Q
M3
>
D Q
M4
>
D Q
M5
>
D Q
M15
>
+
+
+
+
= Exclusive-OR
MISR[15:0] = Q[15:0]
Figure 2-27. 16-Bit MISR Diagram
During the data compress operation, the following steps are executed:
1. MISR for each Flash block is reset to 0xFFFF.
2. Initialized DATA equal to 0xFFFF is compressed into the MISR for each selected Flash block
which results in the MISR containing 0x0001.
3. DATA equal to the selected Flash array data range is read and compressed into the MISR for each
selected Flash block with addresses incrementing.
4. DATA equal to the selected Flash array data range is read and compressed into the MISR for each
selected Flash block with addresses decrementing.
5. If Flash block 0 is selected for compression, DATA equal to the contents of the MISR for Flash
block 0 is compressed into the MISR for Flash block 0. If data in Flash block 0 was not selected
for compression, the MISR for Flash block 0 contains 0xFFFF.
6. If Flash block 1 is selected for compression, DATA equal to the contents of the MISR for Flash
block 1 is compressed into the MISR for Flash block 0.
7. If Flash block 2 is selected for compression, DATA equal to the contents of the MISR for Flash
block 2 is compressed into the MISR for Flash block 0.
8. If Flash block 3 is selected for compression, DATA equal to the contents of the MISR for Flash
block 3 is compressed into the MISR for Flash block 0.
9. The contents of the MISR for Flash block 0 are written to the FDATA registers.
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2.4.2.3
Program Command
The program operation will program a previously erased word in the Flash memory using an embedded
algorithm.
An example flow to execute the program operation is shown in Figure 2-28. The program command write
sequence is as follows:
1. Write to a Flash block address to start the command write sequence for the program command. The
data written will be programmed to the address written. Multiple Flash blocks can be
simultaneously programmed by writing to the same relative address in each Flash block.
2. Write the program command, 0x20, to the FCMD register.
3. Clear the CBEIF flag in the FSTAT register by writing a 1 to CBEIF to launch the program
command.
If a word to be programmed is in a protected area of the Flash block, the PVIOL flag in the FSTAT register
will set and the program command will not launch. Once the program command has successfully launched,
the CCIF flag in the FSTAT register will set after the program operation has completed unless a new
command write sequence has been buffered. By executing a new program command write sequence on
sequential words after the CBEIF flag in the FSTAT register has been set, up to 55% faster programming
time per word can be effectively achieved than by waiting for the CCIF flag to set after each program
operation.
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512 Kbyte Flash Module (S12XFTX512K4V2)
START
Read: FCLKDIV register
Clock Register
NOTE: FCLKDIV needs to
FDIVLD
Set?
no
Written
Check
be set once after each reset.
yes
Write: FCLKDIV register
Read: FSTAT register
Address, Data,
Command
Buffer Empty Check
CBEIF
Set?
no
yes
ACCERR/
PVIOL
Set?
yes
Access Error and
Protection Violation
Check
Write: FSTAT register
Clear ACCERR/PVIOL 0x30
no
Write: Flash Address
and program Data
1.
Simultaneous
Multiple Flash Block
Decision
Next
Flash
Block?
yes
Decrement Global Address
by 128K
no
Write: FCMD register
2.
3.
Program Command 0x20
Write: FSTAT register
Clear CBEIF 0x80
Read: FSTAT register
Bit Polling for
Buffer Empty
Check
no
CBEIF
Set?
yes
Sequential
Programming
Decision
yes
Next
Word?
no
Read: FSTAT register
Bit Polling for
Command Completion
Check
no
CCIF
Set?
yes
EXIT
Figure 2-28. Example Program Command Flow
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512 Kbyte Flash Module (S12XFTX512K4V2)
2.4.2.4
Sector Erase Command
The sector erase operation will erase all addresses in a 1 Kbyte sector of Flash memory using an embedded
algorithm.
An example flow to execute the sector erase operation is shown in Figure 2-29. The sector erase command
write sequence is as follows:
1. Write to a Flash block address to start the command write sequence for the sector erase command.
The Flash address written determines the sector to be erased while global address bits [9:0] and the
data written are ignored. Multiple Flash sectors can be simultaneously erased by writing to the
same relative address in each Flash block.
2. Write the sector erase command, 0x40, to the FCMD register.
3. Clear the CBEIF flag in the FSTAT register by writing a 1 to CBEIF to launch the sector erase
command.
If a Flash sector to be erased is in a protected area of the Flash block, the PVIOL flag in the FSTAT register
will set and the sector erase command will not launch. Once the sector erase command has successfully
launched, the CCIF flag in the FSTAT register will set after the sector erase operation has completed unless
a new command write sequence has been buffered.
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512 Kbyte Flash Module (S12XFTX512K4V2)
START
Read: FCLKDIV register
Clock Register
NOTE: FCLKDIV needs to
FDIVLD
Set?
no
Written
Check
be set once after each reset.
yes
Write: FCLKDIV register
Read: FSTAT register
Address, Data,
Command
Buffer Empty Check
CBEIF
Set?
no
yes
ACCERR/
PVIOL
Set?
yes
Access Error and
Protection Violation
Check
Write: FSTAT register
Clear ACCERR/PVIOL 0x30
no
Write: Flash Sector Address
and Dummy Data
1.
Simultaneous
Multiple Flash Block
Decision
Next
Flash
yes
Decrement Global Address
by 128K
Block?
no
Write: FCMD register
2.
3.
Sector Erase Command 0x40
Write: FSTAT register
Clear CBEIF 0x80
Read: FSTAT register
Bit Polling for
Command Completion
Check
no
CCIF
Set?
yes
EXIT
Figure 2-29. Example Sector Erase Command Flow
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512 Kbyte Flash Module (S12XFTX512K4V2)
2.4.2.5
Mass Erase Command
An example flow to execute the mass erase operation is shown in Figure 2-30. The mass erase command
write sequence is as follows:
1. Write to a Flash block address to start the command write sequence for the mass erase command.
The address and data written will be ignored. Multiple Flash blocks can be simultaneously mass
erased by writing to the same relative address in each Flash block.
2. Write the mass erase command, 0x41, to the FCMD register.
3. Clear the CBEIF flag in the FSTAT register by writing a 1 to CBEIF to launch the mass erase
command.
If a Flash block to be erased contains any protected area, the PVIOL flag in the FSTAT register will set and
the mass erase command will not launch. Once the mass erase command has successfully launched, the
CCIF flag in the FSTAT register will set after the mass erase operation has completed unless a new
command write sequence has been buffered.
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512 Kbyte Flash Module (S12XFTX512K4V2)
START
Read: FCLKDIV register
Clock Register
NOTE: FCLKDIV needs to
FDIVLD
Set?
no
Written
Check
be set once after each reset.
yes
Write: FCLKDIV register
Read: FSTAT register
Address, Data,
Command
Buffer Empty Check
CBEIF
Set?
no
yes
ACCERR/
PVIOL
Set?
yes
Access Error and
Protection Violation
Check
Write: FSTAT register
Clear ACCERR/PVIOL 0x30
no
Write: Flash Block Address
and Dummy Data
1.
Simultaneous
Multiple Flash Block
Decision
Next
Flash
Block?
yes
Decrement Global Address
by 128K
no
Write: FCMD register
2.
3.
Mass Erase Command 0x41
Write: FSTAT register
Clear CBEIF 0x80
Read: FSTAT register
Bit Polling for
Command Completion
Check
no
CCIF
Set?
yes
EXIT
Figure 2-30. Example Mass Erase Command Flow
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512 Kbyte Flash Module (S12XFTX512K4V2)
2.4.2.6
Sector Erase Abort Command
The sector erase abort operation will terminate the active sector erase operation so that other sectors in a
Flash block are available for read and program operations without waiting for the sector erase operation to
complete.
An example flow to execute the sector erase abort operation is shown in Figure 2-31. The sector erase abort
command write sequence is as follows:
1. Write to any Flash block address to start the command write sequence for the sector erase abort
command. The address and data written are ignored.
2. Write the sector erase abort command, 0x47, to the FCMD register.
3. Clear the CBEIF flag in the FSTAT register by writing a 1 to CBEIF to launch the sector erase abort
command.
If the sector erase abort command is launched resulting in the early termination of an active sector erase
operation, the ACCERR flag will set once the operation completes as indicated by the CCIF flag being set.
The ACCERR flag sets to inform the user that the Flash sector may not be fully erased and a new sector
erase command must be launched before programming any location in that specific sector. If the sector
erase abort command is launched but the active sector erase operation completes normally, the ACCERR
flag will not set upon completion of the operation as indicated by the CCIF flag being set. Therefore, if the
ACCERR flag is not set after the sector erase abort command has completed, a Flash sector being erased
when the abort command was launched will be fully erased. The maximum number of cycles required to
abort a sector erase operation is equal to four FCLK periods (see Section 2.4.1.1, “Writing the FCLKDIV
Register”) plus five bus cycles as measured from the time the CBEIF flag is cleared until the CCIF flag is
set. If sectors in multiple Flash blocks are being simultaneously erased, the sector erase abort operation
will be applied to all active Flash blocks without writing to each Flash block in the sector erase abort
command write sequence.
NOTE
Since the ACCERR bit in the FSTAT register may be set at the completion
of the sector erase abort operation, a command write sequence is not
allowed to be buffered behind a sector erase abort command write sequence.
The CBEIF flag will not set after launching the sector erase abort command
to indicate that a command should not be buffered behind it. If an attempt is
made to start a new command write sequence with a sector erase abort
operation active, the ACCERR flag in the FSTAT register will be set. A new
command write sequence may be started after clearing the ACCERR flag, if
set.
NOTE
The sector erase abort command should be used sparingly since a sector
erase operation that is aborted counts as a complete program/erase cycle.
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512 Kbyte Flash Module (S12XFTX512K4V2)
Execute Sector Erase Command Flow
Read: FSTAT register
Erase
Abort
Needed?
Bit Polling for
Command
Completion Check
CCIF
Set?
no
no
yes
yes
Sector Erase
Completed
EXIT
Write: Dummy Flash Address
and Dummy Data
1.
2.
3.
Write: FCMD register
Sector Erase Abort Cmd 0x47
Write: FSTAT register
Clear CBEIF 0x80
Read: FSTAT register
no
Bit Polling for
Command
Completion Check
CCIF
Set?
yes
yes
ACCERR
Set?
Access
Error Check
Write: FSTAT register
Clear ACCERR 0x10
no
Sector Erase
Completed
Sector Erase
Aborted
EXIT
EXIT
Figure 2-31. Example Sector Erase Abort Command Flow
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512 Kbyte Flash Module (S12XFTX512K4V2)
2.4.3
Illegal Flash Operations
The ACCERR flag will be set during the command write sequence if any of the following illegal steps are
performed, causing the command write sequence to immediately abort:
1. Writing to a Flash address before initializing the FCLKDIV register.
2. Writing a byte or misaligned word to a valid Flash address.
3. Starting a command write sequence while a data compress operation is active.
4. Starting a command write sequence while a sector erase abort operation is active.
5. Writing a Flash address in step 1 of a command write sequence that is not the same relative address
as the first one written in the same command write sequence.
6. Writing to any Flash register other than FCMD after writing to a Flash address.
7. Writing a second command to the FCMD register in the same command write sequence.
8. Writing an invalid command to the FCMD register.
9. When security is enabled, writing a command other than mass erase to the FCMD register when
the write originates from a non-secure memory location or from the Background Debug Mode.
10. Writing to a Flash address after writing to the FCMD register.
11. Writing to any Flash register other than FSTAT (to clear CBEIF) after writing to the FCMD
register.
12. Writing a 0 to the CBEIF flag in the FSTAT register to abort a command write sequence.
The ACCERR flag will not be set if any Flash register is read during a valid command write sequence.
The ACCERR flag will also be set if any of the following events occur:
1. Launching the sector erase abort command while a sector erase operation is active which results in
the early termination of the sector erase operation (see Section 2.4.2.6, “Sector Erase Abort
Command”).
2. The MCU enters stop mode and a program or erase operation is in progress. The operation is
aborted immediately and any pending command is purged (see Section 2.5.2, “Stop Mode”).
If the Flash memory is read during execution of an algorithm (CCIF = 0), the read operation will return
invalid data and the ACCERR flag will not be set.
If the ACCERR flag is set in the FSTAT register, the user must clear the ACCERR flag before starting
another command write sequence (see Section 2.3.2.6, “Flash Status Register (FSTAT)”).
The PVIOL flag will be set after the command is written to the FCMD register during a command write
sequence if any of the following illegal operations are attempted, causing the command write sequence to
immediately abort:
1. Writing the program command if an address written in the command write sequence was in a
protected area of the Flash memory
2. Writing the sector erase command if an address written in the command write sequence was in a
protected area of the Flash memory
3. Writing the mass erase command to a Flash block while any Flash protection is enabled in the
block
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512 Kbyte Flash Module (S12XFTX512K4V2)
If the PVIOL flag is set in the FSTAT register, the user must clear the PVIOL flag before starting another
command write sequence (see Section 2.3.2.6, “Flash Status Register (FSTAT)”).
2.5
Operating Modes
Wait Mode
2.5.1
If a command is active (CCIF = 0) when the MCU enters wait mode, the active command and any buffered
command will be completed.
The Flash module can recover the MCU from wait mode if the CBEIF and CCIF interrupts are enabled
(see Section 2.8, “Interrupts”).
2.5.2
Stop Mode
If a command is active (CCIF = 0) when the MCU enters stop mode, the operation will be aborted and, if
the operation is program or erase, the Flash array data being programmed or erased may be corrupted and
the CCIF and ACCERR flags will be set. If active, the high voltage circuitry to the Flash memory will
immediately be switched off when entering stop mode. Upon exit from stop mode, the CBEIF flag is set
and any buffered command will not be launched. The ACCERR flag must be cleared before starting a
command write sequence (see Section 2.4.1.2, “Command Write Sequence”).
NOTE
As active commands are immediately aborted when the MCU enters stop
mode, it is strongly recommended that the user does not use the STOP
instruction during program or erase operations.
2.5.3
Background Debug Mode
In background debug mode (BDM), the FPROT register is writable. If the MCU is unsecured, then all
Flash commands listed in Table 2-20 can be executed. If the MCU is secured and is in special single chip
mode, only mass erase can be executed.
2.6
Flash Module Security
The Flash module provides the necessary security information to the MCU. After each reset, the Flash
module determines the security state of the MCU as defined in Section 2.3.2.2, “Flash Security Register
(FSEC)”.
The contents of the Flash security byte at 0x7F_FF0F in the Flash Configuration Field must be changed
directly by programming 0x7F_FF0F when the MCU is unsecured and the higher address sector is
unprotected. If the Flash security byte is left in a secured state, any reset will cause the MCU to initialize
to a secure operating mode.
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512 Kbyte Flash Module (S12XFTX512K4V2)
2.6.1
Unsecuring the MCU using Backdoor Key Access
contents of the backdoor keys (four 16-bit words programmed at addresses 0x7F_FF00–0x7F_FF07). If
the KEYEN[1:0] bits are in the enabled state (see Section 2.3.2.2, “Flash Security Register (FSEC)”) and
the KEYACC bit is set, a write to a backdoor key address in the Flash memory triggers a comparison
between the written data and the backdoor key data stored in the Flash memory. If all four words of data
are written to the correct addresses in the correct order and the data matches the backdoor keys stored in
the Flash memory, the MCU will be unsecured. The data must be written to the backdoor keys sequentially
starting with 0x7F_FF00–1 and ending with 0x7F_FF06–7. 0x0000 and 0xFFFF are not permitted as
backdoor keys. While the KEYACC bit is set, reads of the Flash memory will return invalid data.
The user code stored in the Flash memory must have a method of receiving the backdoor keys from an
external stimulus. This external stimulus would typically be through one of the on-chip serial ports.
If the KEYEN[1:0] bits are in the enabled state (see Section 2.3.2.2, “Flash Security Register (FSEC)”),
the MCU can be unsecured by the backdoor key access sequence described below:
1. Set the KEYACC bit in the Flash Configuration Register (FCNFG).
2. Write the correct four 16-bit words to Flash addresses 0xFF00–0xFF07 sequentially starting with
0x7F_FF00.
3. Clear the KEYACC bit. Depending on the user code used to write the backdoor keys, a wait cycle
(NOP) may be required before clearing the KEYACC bit.
4. If all four 16-bit words match the backdoor keys stored in Flash addresses
0x7F_FF00–0x7F_FF07, the MCU is unsecured and the SEC[1:0] bits in the FSEC register are
forced to the unsecure state of 1:0.
The backdoor key access sequence is monitored by an internal security state machine. An illegal operation
during the backdoor key access sequence will cause the security state machine to lock, leaving the MCU
in the secured state. A reset of the MCU will cause the security state machine to exit the lock state and
allow a new backdoor key access sequence to be attempted. The following operations during the backdoor
key access sequence will lock the security state machine:
1. If any of the four 16-bit words does not match the backdoor keys programmed in the Flash array.
2. If the four 16-bit words are written in the wrong sequence.
3. If more than four 16-bit words are written.
4. If any of the four 16-bit words written are 0x0000 or 0xFFFF.
5. If the KEYACC bit does not remain set while the four 16-bit words are written.
6. If any two of the four 16-bit words are written on successive MCU clock cycles.
After the backdoor keys have been correctly matched, the MCU will be unsecured. Once the MCU is
unsecured, the Flash security byte can be programmed to the unsecure state, if desired.
In the unsecure state, the user has full control of the contents of the backdoor keys by programming
addresses 0x7F_FF00–0x7F_FF07 in the Flash Configuration Field.
The security as defined in the Flash security byte (0x7F_FF0F) is not changed by using the backdoor key
access sequence to unsecure. The backdoor keys stored in addresses 0x7F_FF00–0x7F_FF07 are
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unaffected by the backdoor key access sequence. After the next reset of the MCU, the security state of the
Flash module is determined by the Flash security byte (0x7F_FF0F). The backdoor key access sequence
has no effect on the program and erase protections defined in the Flash protection register.
It is not possible to unsecure the MCU in special single chip mode by using the backdoor key access
sequence in background debug mode (BDM).
2.6.2
Unsecuring the MCU in Special Single Chip Mode using BDM
The MCU can be unsecured in special single chip mode by erasing the Flash module by the following
method:
•
Reset the MCU into special single chip mode, delay while the erase test is performed by the BDM
secure ROM, send BDM commands to disable protection in the Flash module, and execute a mass
erase command write sequence to erase the Flash memory.
After the CCIF flag sets to indicate that the mass operation has completed, reset the MCU into special
single chip mode. The BDM secure ROM will verify that the Flash memory is erased and will assert the
UNSEC bit in the BDM status register. This BDM action will cause the MCU to override the Flash security
state and the MCU will be unsecured. All BDM commands will be enabled and the Flash security byte
may be programmed to the unsecure state by the following method:
•
Send BDM commands to execute a word program sequence to program the Flash security byte to
the unsecured state and reset the MCU.
2.7
Resets
2.7.1
Flash Reset Sequence
On each reset, the Flash module executes a reset sequence to hold CPU activity while loading the following
•
•
•
FSEC — Flash Security Register (see Section 2.3.2.2).
2.7.2
Reset While Flash Command Active
If a reset occurs while any Flash command is in progress, that command will be immediately aborted. The
state of the word being programmed or the sector/block being erased is not guaranteed.
2.8
Interrupts
The Flash module can generate an interrupt when all Flash command operations have completed, when the
Flash address, data and command buffers are empty.
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512 Kbyte Flash Module (S12XFTX512K4V2)
Table 2-21. Flash Interrupt Sources
Interrupt Source
Interrupt Flag
Local Enable
Global (CCR) Mask
Flash Address, Data and Command Buffers empty
CBEIF
CBEIE
I Bit
(FSTAT register)
(FCNFG register)
All Flash commands completed
CCIF
CCIE
I Bit
(FSTAT register)
(FCNFG register)
NOTE
Vector addresses and their relative interrupt priority are determined at the
MCU level.
2.8.1
The logic used for generating interrupts is shown in Figure 2-32.
The Flash module uses the CBEIF and CCIF flags in combination with the CBIE and CCIE enable bits to
generate the Flash command interrupt request.
CBEIF
CBEIE
Flash Command Interrupt Request
CCIF
CCIE
For a detailed description of the register bits, refer to Section 2.3.2.4, “Flash Configuration Register
(FCNFG)” and Section 2.3.2.6, “Flash Status Register (FSTAT)” .
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Chapter 3
4 Kbyte EEPROM Module (S12XEETX4KV2)
3.1
Introduction
This document describes the module which includes a Kbyte EEPROM (nonvolatile) memory. The
EEPROM memory may be read as either bytes, aligned words, or misaligned words. Read access time is
one bus cycle for bytes and aligned words, and two bus cycles for misaligned words.
The EEPROM memory is ideal for data storage for single-supply applications allowing for field
reprogramming without requiring external voltage sources for program or erase. Program and erase
functions are controlled by a command driven interface. The EEPROM module supports both block erase
(all memory bytes) and sector erase (4 memory bytes). An erased bit reads 1 and a programmed bit reads
0. The high voltage required to program and erase the EEPROM memory is generated internally. It is not
possible to read from the EEPROM block while it is being erased or programmed.
CAUTION
An EEPROM word (2 bytes) must be in the erased state before being
programmed. Cumulative programming of bits within a word is not allowed.
3.1.1
Glossary
Command Write Sequence — A three-step MCU instruction sequence to execute built-in algorithms
(including program and erase) on the EEPROM memory.
3.1.2
Features
•
•
•
•
•
•
•
Automated program and erase algorithm
Interrupts on EEPROM command completion and command buffer empty
Fast sector erase and word program operation
2-stage command pipeline
Sector erase abort feature for critical interrupt response
Flexible protection scheme to prevent accidental program or erase
Single power supply for all EEPROM operations including program and erase
3.1.3
Modes of Operation
Program, erase and erase verify operations (please refer to Section 3.4.1, “EEPROM Command
Operations” for details).
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Chapter 3 4 Kbyte EEPROM Module (S12XEETX4KV2)
3.1.4
Block Diagram
A block diagram of the EEPROM module is shown in .
3.2
External Signal Description
The EEPROM module contains no signals that connect off-chip.
3.3
Memory Map and Register Definition
This section describes the memory map and registers for the EEPROM module.
3.3.1
Module Memory Map
The EEPROM memory map is shown in . The HCS12X architecture places the EEPROM memory
addresses between global addresses . The EPROT register, described in Section 3.3.2.5, “EEPROM
Protection Register (EPROT)”, can be set to protect the upper region in the EEPROM memory from
accidental program or erase. The EEPROM addresses covered by this protectable region are shown in the
EEPROM memory map. The default protection setting is stored in the EEPROM configuration field as
described in Table 3-1.
Table 3-1. EEPROM Configuration Field
Size
(bytes)
Global Address
Description
0x13_FFFC
0x13_FFFD
1
1
EEPROM Protection byte
Refer to Section 3.3.2.5, “EEPROM Protection Register (EPROT)”
0x13_FFFE – 0x13_FFFF
2
Reserved
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module base + 0x0000 and 0x000B. A summary of the EEPROM module registers is given in Table 3-2
while their accessibility is detailed in Section 3.3.2, “Register Descriptions”.
Table 3-2. EEPROM Register Map
Module
Base +
Normal Mode
Access
Register Name
0x0000
0x0001
0x0002
0x0003
0x0004
0x0005
0x0006
0x0007
0x0008
0x0009
0x000A
0x000B
EEPROM Clock Divider Register (ECLKDIV)
R/W
R
1
RESERVED1
1
RESERVED2
R
EEPROM Configuration Register (ECNFG)
EEPROM Protection Register (EPROT)
EEPROM Status Register (ESTAT)
R/W
R/W
R/W
R/W
R
EEPROM Command Register (ECMD)
1
RESERVED3
1
EEPROM High Address Register (EADDRHI)
R
1
EEPROM Low Address Register (EADDRLO)
R
1
EEPROM High Data Register (EDATAHI)
R
1
EEPROM Low Data Register (EDATALO)
R
1
Intended for factory test purposes only.
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Chapter 3 4 Kbyte EEPROM Module (S12XEETX4KV2)
3.3.2
Register Descriptions
Register
Name
Bit 7
6
PRDIV8
0
5
EDIV5
0
4
EDIV4
0
3
EDIV3
0
2
EDIV2
0
1
EDIV1
0
Bit 0
EDIV0
0
0x0000
ECLKDIV
R
EDIVLD
W
0x0001
RESERVED1
R
0
0
W
0x0002
RESERVED2
R
0
0
0
0
0
0
0
0
0
0
0
0
0
W
0x0003
ECNFG
R
CBEIE
CCIE
W
0x0004
EPROT
R
RNV6
RNV5
RNV4
EPOPEN
EPDIS
0
EPS2
EPS1
0
EPS0
0
W
0x0005
ESTAT
R
CCIF
BLANK
CBEIF
0
PVIOL
ACCERR
W
0x0006
ECMD
R
CMDB
0
W
0x0007
R
0
0
0
0
0
0
0
RESERVED3
W
0x0009
R
EABLO
EADDRLO
W
0x000A
R
EDHI
EDATAHI
W
0x000B
R
EDLO
EDATALO
W
= Unimplemented or Reserved
Figure 3-1. MC9S12XDP512 Register Summary
3.3.2.1
EEPROM Clock Divider Register (ECLKDIV)
The ECLKDIV register is used to control timed events in program and erase algorithms.
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 3 4 Kbyte EEPROM Module (S12XEETX4KV2)
Module Base + 0x0000
7
6
5
4
3
2
1
0
R
W
EDIVLD
PRDIV8
EDIV5
EDIV4
EDIV3
EDIV2
EDIV1
EDIV0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 3-2. EEPROM Clock Divider Register (ECLKDIV)
All bits in the ECLKDIV register are readable, bits 6–0 are write once and bit 7 is not writable.
Table 3-3. ECLKDIV Field Descriptions
Field
Description
7
Clock Divider Loaded
EDIVLD
0 Register has not been written.
1 Register has been written to since the last reset.
6
Enable Prescalar by 8
PRDIV8
0 The oscillator clock is directly fed into the ECLKDIV divider.
1 Enables a Prescalar by 8, to divide the oscillator clock before feeding into the clock divider.
5–0
Clock Divider Bits — The combination of PRDIV8 and EDIV[5:0] effectively divides the EEPROM module input
EDIV[5:0] oscillator clock down to a frequency of 150 kHz – 200 kHz. The maximum divide ratio is 512. Please refer to
Section 3.4.1.1, “Writing the ECLKDIV Register” for more information.
3.3.2.2
RESERVED1
This register is reserved for factory testing and is not accessible.
Module Base + 0x0001
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 3-3. RESERVED1
All bits read 0 and are not writable.
3.3.2.3
RESERVED2
This register is reserved for factory testing and is not accessible.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
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Chapter 3 4 Kbyte EEPROM Module (S12XEETX4KV2)
Module Base + 0x0002
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 3-4. RESERVED2
All bits read 0 and are not writable.
3.3.2.4
EEPROM Configuration Register (ECNFG)
The ECNFG register enables the EEPROM interrupts.
Module Base + 0x0003
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
CBEIE
CCIE
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 3-5. EEPROM Configuration Register (ECNFG)
CBEIE and CCIE bits are readable and writable while all remaining bits read 0 and are not writable.
Table 3-4. ECNFG Field Descriptions
Field
Description
7
Command Buffer Empty Interrupt Enable — The CBEIE bit enables an interrupt in case of an empty command
buffer in the EEPROM module.
CBEIE
1 An interrupt will be requested whenever the CBEIF flag (see Section 3.3.2.6, “EEPROM Status Register
(ESTAT)”) is set.
6
Command Complete Interrupt Enable — The CCIE bit enables an interrupt in case all commands have been
completed in the EEPROM module.
CCIE
1 An interrupt will be requested whenever the CCIF flag (see Section 3.3.2.6, “EEPROM Status Register
(ESTAT)”) is set.
MC9S12XDP512 Data Sheet, Rev. 2.11
150
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Chapter 3 4 Kbyte EEPROM Module (S12XEETX4KV2)
3.3.2.5
EEPROM Protection Register (EPROT)
The EPROT register defines which EEPROM sectors are protected against program or erase operations.
Module Base + 0x0004
7
6
5
4
3
2
1
0
R
W
RNV6
RNV5
RNV4
EPOPEN
EPDIS
EPS2
EPS1
EPS0
Reset
F
F
F
F
F
F
F
F
= Unimplemented or Reserved
Figure 3-6. EEPROM Protection Register (EPROT)
During the reset sequence, the EPROT register is loaded from the EEPROM Protection byte at address
offset 0x0FFD (see Table 3-1).All bits in the EPROT register are readable and writable except for
RNV[6:4] which are only readable. The EPOPEN and EPDIS bits can only be written to the protected
state. The EPS bits can be written anytime until bit EPDIS is cleared. If the EPOPEN bit is cleared, the
state of the EPDIS and EPS bits is irrelevant.
To change the EEPROM protection that will be loaded during the reset sequence, the EEPROM memory
must be unprotected, then the EEPROM Protection byte must be reprogrammed. Trying to alter data in any
protected area in the EEPROM memory will result in a protection violation error and the PVIOL flag will
be set in the ESTAT register. The mass erase of an EEPROM block is possible only when protection is
fully disabled by setting the EPOPEN and EPDIS bits.
Table 3-5. EPROT Field Descriptions
Field
Description
7
Opens the EEPROM for Program or Erase
EPOPEN 0 The entire EEPROM memory is protected from program and erase.
1 The EEPROM sectors not protected are enabled for program or erase.
6–4
Reserved Nonvolatile Bits — The RNV[6:4] bits should remain in the erased state “1” for future enhancements.
RNV[6:4]
3
EEPROM Protection Address Range Disable — The EPDIS bit determines whether there is a protected area
in a specific region of the EEPROM memory ending with address offset 0x0FFF.
0 Protection enabled.
EPDIS
1 Protection disabled.
2–0
EEPROM Protection Address Size — The EPS[2:0] bits determine the size of the protected area as shown
EPS[2:0]
inTable 3-6. The EPS bits can only be written to while the EPDIS bit is set.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
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Chapter 3 4 Kbyte EEPROM Module (S12XEETX4KV2)
Table 3-6. EEPROM Protection Address Range
EPS[2:0]
Address Offset Range
Protected Size
000
001
010
011
100
101
110
111
0x0FC0 – 0x0FFF
0x0F80 – 0x0FFF
0x0F40 – 0x0FFF
0x0F00 – 0x0FFF
0x0EC0 – 0x0FFF
0x0E80 – 0x0FFF
0x0E40 – 0x0FFF
0x0E00 – 0x0FFF
64 bytes
128 bytes
192 bytes
256 bytes
320 bytes
384 bytes
448 bytes
512 bytes
3.3.2.6
EEPROM Status Register (ESTAT)
The ESTAT register defines the operational status of the module.
Module Base + 0x0005
7
6
5
4
3
2
1
0
R
W
CCIF
0
BLANK
0
0
CBEIF
PVIOL
ACCERR
Reset
1
1
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 3-7. EEPROM Status Register (ESTAT — Normal Mode)
Module Base + 0x0005
7
6
5
4
3
2
1
0
R
CCIF
0
BLANK
0
CBEIF
W
PVIOL
ACCERR
FAIL
Reset
1
1
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 3-8. EEPROM Status Register (ESTAT — Special Mode)
CBEIF, PVIOL, and ACCERR are readable and writable, CCIF and BLANK are readable and not writable,
remaining bits read 0 and are not writable in normal mode. FAIL is readable and writable in special mode.
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 3 4 Kbyte EEPROM Module (S12XEETX4KV2)
Table 3-7. ESTAT Field Descriptions
Field
Description
7
Command Buffer Empty Interrupt Flag — The CBEIF flag indicates that the address, data, and command
buffers are empty so that a new command write sequence can be started. The CBEIF flag is cleared by writing
a 1 to CBEIF. Writing a 0 to the CBEIF flag has no effect on CBEIF. Writing a 0 to CBEIF after writing an aligned
word to the EEPROM address space but before CBEIF is cleared will abort a command write sequence and
cause the ACCERR flag to be set. Writing a 0 to CBEIF outside of a command write sequence will not set the
ACCERR flag. The CBEIF flag is used together with the CBEIE bit in the ECNFG register to generate an interrupt
request (see Figure 3-21).
CBEIF
0 Buffers are full.
1 Buffers are ready to accept a new command.
6
Command Complete Interrupt Flag — The CCIF flag indicates that there are no more commands pending. The
CCIF flag is cleared when CBEIF is clear and sets automatically upon completion of all active and pending
commands. The CCIF flag does not set when an active commands completes and a pending command is
fetched from the command buffer. Writing to the CCIF flag has no effect on CCIF. The CCIF flag is used together
with the CCIE bit in the ECNFG register to generate an interrupt request (see Figure 3-21).
0 Command in progress.
CCIF
1 All commands are completed.
5
Protection Violation Flag — The PVIOL flag indicates an attempt was made to program or erase an address
in a protected area of the EEPROM memory during a command write sequence. The PVIOL flag is cleared by
writing a 1 to PVIOL. Writing a 0 to the PVIOL flag has no effect on PVIOL. While PVIOL is set, it is not possible
to launch a command or start a command write sequence.
PVIOL
0 No failure.
1 A protection violation has occurred.
4
ACCERR caused by either a violation of the command write sequence (see Section 3.4.1.2, “Command Write Sequence”),
issuing an illegal EEPROM command (see Table 3-9), launching the sector erase abort command terminating a
sector erase operation early (see Section 3.4.2.5, “Sector Erase Abort Command”) or the execution of a CPU
STOP instruction while a command is executing (CCIF = 0). The ACCERR flag is cleared by writing a 1 to
ACCERR. Writing a 0 to the ACCERR flag has no effect on ACCERR. While ACCERR is set, it is not possible to
launch a command or start a command write sequence. If ACCERR is set by an erase verify operation, any
buffered command will not launch.
0 No access error detected.
1 Access error has occurred.
2
Flag Indicating the Erase Verify Operation Status — When the CCIF flag is set after completion of an erase
verify command, the BLANK flag indicates the result of the erase verify operation. The BLANK flag is cleared by
the EEPROM module when CBEIF is cleared as part of a new valid command write sequence. Writing to the
BLANK flag has no effect on BLANK.
BLANK
0 EEPROM block verified as not erased.
1 EEPROM block verified as erased.
1
FAIL
Flag Indicating a Failed EEPROM Operation — The FAIL flag will set if the erase verify operation fails
(EEPROM block verified as not erased). The FAIL flag is cleared by writing a 1 to FAIL. Writing a 0 to the FAIL
flag has no effect on FAIL.
0 EEPROM operation completed without error.
1 EEPROM operation failed.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
153
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Chapter 3 4 Kbyte EEPROM Module (S12XEETX4KV2)
3.3.2.7
EEPROM Command Register (ECMD)
The ECMD register is the EEPROM command register.
Module Base + 0x0006
7
6
5
4
3
2
1
0
R
W
0
CMDB
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 3-9. EEPROM Command Register (ECMD)
All CMDB bits are readable and writable during a command write sequence while bit 7 reads 0 and is not
writable.
Table 3-8. ECMD Field Descriptions
Field
Description
6–0
EEPROM Command Bits — Valid EEPROM commands are shown in Table 3-9. Writing any command other
CMDB[6:0] than those listed in Table 3-9 sets the ACCERR flag in the ESTAT register.
Table 3-9. Valid EEPROM Command List
CMDB[6:0]
Command
0x05
0x20
0x40
0x41
0x47
0x60
Erase Verify
Word Program
Sector Erase
Mass Erase
Sector Erase Abort
Sector Modify
3.3.2.8
RESERVED3
This register is reserved for factory testing and is not accessible.
Module Base + 0x0007
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 3-10. RESERVED3
MC9S12XDP512 Data Sheet, Rev. 2.11
154
Freescale Semiconductor
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Chapter 3 4 Kbyte EEPROM Module (S12XEETX4KV2)
All bits read 0 and are not writable.
EEPROM Address Registers (EADDR)
The EADDRHI and EADDRLO registers are the EEPROM address registers.
Module Base + 0x0009
7
6
5
4
3
2
1
0
R
W
EABLO
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 3-11. EEPROM Address Low Register (EADDRLO)
All EABHI and EABLO bits read 0 and are not writable in normal modes.
All EABHI and EABLO bits are readable and writable in special modes.
The MCU address bit AB0 is not stored in the EADDR registers since the EEPROM block is not byte
addressable.
3.3.2.9
EEPROM Data Registers (EDATA)
The EDATAHI and EDATALO registers are the EEPROM data registers.
Module Base + 0x000A
7
6
5
4
3
2
1
0
R
W
EDHI
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 3-12. EEPROM Data High Register (EDATAHI)
Module Base + 0x000B
7
6
5
4
3
2
1
0
R
EDLO
W
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 3-13. EEPROM Data Low Register (EDATALO)
All EDHI and EDLO bits read 0 and are not writable in normal modes.
All EDHI and EDLO bits are readable and writable in special modes.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
155
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Chapter 3 4 Kbyte EEPROM Module (S12XEETX4KV2)
3.4
Functional Description
3.4.1
EEPROM Command Operations
Write operations are used to execute program, erase, erase verify, sector erase abort, and sector modify
algorithms described in this section. The program, erase, and sector modify algorithms are controlled by
a state machine whose timebase, EECLK, is derived from the oscillator clock via a programmable divider.
The command register as well as the associated address and data registers operate as a buffer and a register
(2-stage FIFO) so that a second command along with the necessary data and address can be stored to the
buffer while the first command is still in progress. Buffer empty as well as command completion are
signalled by flags in the EEPROM status register with interrupts generated, if enabled.
The next sections describe:
1. How to write the ECLKDIV register
2. Command write sequences to program, erase, erase verify, sector erase abort, and sector modify
operations on the EEPROM memory
3. Valid EEPROM commands
4. Effects resulting from illegal EEPROM command write sequences or aborting EEPROM
operations
3.4.1.1
Writing the ECLKDIV Register
Prior to issuing any EEPROM command after a reset, the user is required to write the ECLKDIV register
to divide the oscillator clock down to within the 150 kHz to 200 kHz range. Since the program and erase
timings are also a function of the bus clock, the ECLKDIV determination must take this information into
account.
If we define:
•
•
•
ECLK as the clock of the EEPROM timing control block
Tbus as the period of the bus clock
INT(x) as taking the integer part of x (e.g., INT(4.323)=4)
then ECLKDIV register bits PRDIV8 and EDIV[5:0] are to be set as described in Figure 3-14.
For example, if the oscillator clock frequency is 4 MHz and the bus clock frequency is 40 MHz, ECLKDIV
bits EDIV[5:0] should be set to 0x14 (010100) and bit PRDIV8 set to 0. The resulting EECLK frequency
is then 190 kHz. As a result, the EEPROM program and erase algorithm timings are increased over the
optimum target by:
(200 – 190) ⁄ 200 × 100 = 5%
If the oscillator clock frequency is 16 MHz and the bus clock frequency is 40 MHz, ECLKDIV bits
EDIV[5:0] should be set to 0x0A (001010) and bit PRDIV8 set to 1. The resulting EECLK frequency is
then 182 kHz. In this case, the EEPROM program and erase algorithm timings are increased over the
optimum target by:
(200 – 182) ⁄ 200 × 100 = 9%
MC9S12XDP512 Data Sheet, Rev. 2.11
156
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Chapter 3 4 Kbyte EEPROM Module (S12XEETX4KV2)
CAUTION
Program and erase command execution time will increase proportionally
with the period of EECLK. Because of the impact of clock synchronization
on the accuracy of the functional timings, programming or erasing the
EEPROM memory cannot be performed if the bus clock runs at less than 1
MHz. Programming or erasing the EEPROM memory with EECLK < 150
kHz should be avoided. Setting ECLKDIV to a value such that EECLK <
150 kHz can destroy the EEPROM memory due to overstress. Setting
ECLKDIV to a value such that (1/EECLK+Tbus) < 5 µs can result in
incomplete programming or erasure of the EEPROM memory cells.
If the ECLKDIV register is written, the EDIVLD bit is set automatically. If the EDIVLD bit is 0, the
ECLKDIV register has not been written since the last reset. If the ECLKDIV register has not been written
to, the EEPROM command loaded during a command write sequence will not execute and the ACCERR
flag in the ESTAT register will set.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
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Chapter 3 4 Kbyte EEPROM Module (S12XEETX4KV2)
START
no
Tbus < 1µs?
ALL COMMANDS IMPOSSIBLE
yes
PRDIV8 = 0 (reset)
no
oscillator_clock
>12.8 MHz?
yes
PRDIV8 = 1
PRDCLK = oscillator_clock/8
PRDCLK = oscillator_clock
no
PRDCLK[MHz]*(5+Tbus[µs])
an integer?
EDIV[5:0]=INT(PRDCLK[MHz]*(5+Tbus[µs]))
yes
EDIV[5:0]=PRDCLK[MHz]*(5+Tbus[µs])–1
TRY TO DECREASE Tbus EECLK = (PRDCLK)/(1+EDIV[5:0])
yes
1/EECLK[MHz] + Tbus[ms] > 5
END
AND
EECLK > 0.15 MHz
?
no
yes
EDIV[5:0] > 4?
no
ALL COMMANDS IMPOSSIBLE
Figure 3-14. Determination Procedure for PRDIV8 and EDIV Bits
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 3 4 Kbyte EEPROM Module (S12XEETX4KV2)
3.4.1.2
Command Write Sequence
The EEPROM command controller is used to supervise the command write sequence to execute program,
erase, erase verify, sector erase abort, and sector modify algorithms.
Before starting a command write sequence, the ACCERR and PVIOL flags in the ESTAT register must be
clear (see Section 3.3.2.6, “EEPROM Status Register (ESTAT)”) and the CBEIF flag should be tested to
determine the state of the address, data and command buffers. If the CBEIF flag is set, indicating the
buffers are empty, a new command write sequence can be started. If the CBEIF flag is clear, indicating the
buffers are not available, a new command write sequence will overwrite the contents of the address, data
and command buffers.
A command write sequence consists of three steps which must be strictly adhered to with writes to the
EEPROM module not permitted between the steps. However, EEPROM register and array reads are
allowed during a command write sequence. The basic command write sequence is as follows:
1. Write to one address in the EEPROM memory.
2. Write a valid command to the ECMD register.
3. Clear the CBEIF flag in the ESTAT register by writing a 1 to CBEIF to launch the command.
The address written in step 1 will be stored in the EADDR registers and the data will be stored in the
EDATA registers. If the CBEIF flag in the ESTAT register is clear when the first EEPROM array write
occurs, the contents of the address and data buffers will be overwritten and the CBEIF flag will be set.
When the CBEIF flag is cleared, the CCIF flag is cleared on the same bus cycle by the EEPROM command
controller indicating that the command was successfully launched. For all command write sequences
except sector erase abort, the CBEIF flag will set four bus cycles after the CCIF flag is cleared indicating
that the address, data, and command buffers are ready for a new command write sequence to begin. For
sector erase abort operations, the CBEIF flag will remain clear until the operation completes. Except for
the sector erase abort command, a buffered command will wait for the active operation to be completed
before being launched. The sector erase abort command is launched when the CBEIF flag is cleared as part
of a sector erase abort command write sequence. Once a command is launched, the completion of the
command operation is indicated by the setting of the CCIF flag in the ESTAT register. The CCIF flag will
set upon completion of all active and buffered commands.
3.4.2
EEPROM Commands
Table 3-10 summarizes the valid EEPROM commands along with the effects of the commands on the
EEPROM block.
Table 3-10. EEPROM Command Description
ECMDB
Command
Function on EEPROM Memory
0x05
Erase
Verify
Verify all memory bytes in the EEPROM block are erased. If the EEPROM block is erased, the
BLANK flag in the ESTAT register will set upon command completion.
0x20
0x40
Program
Program a word (two bytes) in the EEPROM block.
Sector
Erase
Erase all four memory bytes in a sector of the EEPROM block.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
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Chapter 3 4 Kbyte EEPROM Module (S12XEETX4KV2)
Table 3-10. EEPROM Command Description
ECMDB
Command
Function on EEPROM Memory
0x41
Mass
Erase
Erase all memory bytes in the EEPROM block. A mass erase of the full EEPROM block is only
possible when EPOPEN and EPDIS bits in the EPROT register are set prior to launching the
command.
0x47
0x60
Sector Erase
Abort
Abort the sector erase operation. The sector erase operation will terminate according to a set
procedure. The EEPROM sector should not be considered erased if the ACCERR flag is set
upon command completion.
Sector
Modify
Erase all four memory bytes in a sector of the EEPROM block and reprogram the addressed
word.
CAUTION
An EEPROM word (2 bytes) must be in the erased state before being
programmed. Cumulative programming of bits within a word is not allowed.
MC9S12XDP512 Data Sheet, Rev. 2.11
160
Freescale Semiconductor
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Chapter 3 4 Kbyte EEPROM Module (S12XEETX4KV2)
3.4.2.1
Erase Verify Command
The erase verify operation will verify that the EEPROM memory is erased.
An example flow to execute the erase verify operation is shown in Figure 3-15. The erase verify command
write sequence is as follows:
1. Write to an EEPROM address to start the command write sequence for the erase verify command.
The address and data written will be ignored.
2. Write the erase verify command, 0x05, to the ECMD register.
3. Clear the CBEIF flag in the ESTAT register by writing a 1 to CBEIF to launch the erase verify
command.
After launching the erase verify command, the CCIF flag in the ESTAT register will set after the operation
has completed unless a new command write sequence has been buffered. The number of bus cycles
required to execute the erase verify operation is equal to the number of words in the EEPROM memory
plus 14 bus cycles as measured from the time the CBEIF flag is cleared until the CCIF flag is set. Upon
completion of the erase verify operation, the BLANK flag in the ESTAT register will be set if all addresses
in the EEPROM memory are verified to be erased. If any address in the EEPROM memory is not erased,
the erase verify operation will terminate and the BLANK flag in the ESTAT register will remain clear.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
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Chapter 3 4 Kbyte EEPROM Module (S12XEETX4KV2)
START
Read: ECLKDIV register
Clock Register
EDIVLD
Written
NOTE: ECLKDIV needs to
be set once after each reset.
no
Set?
Check
yes
Write: ECLKDIV register
Read: ESTAT register
Address, Data,
Command
Buffer Empty Check
CBEIF
Set?
no
yes
ACCERR/
PVIOL
Set?
yes
Access Error and
Protection Violation
Check
Write: ESTAT register
Clear ACCERR/PVIOL 0x30
no
Write: EEPROM Address
and Dummy Data
1.
2.
3.
NOTE: command write sequence
aborted by writing 0x00 to
ESTAT register.
Write: ECMD register
Erase Verify Command 0x05
NOTE: command write sequence
aborted by writing 0x00 to
ESTAT register.
Write: ESTAT register
Clear CBEIF 0x80
Read: ESTAT register
Bit Polling for
Command Completion
Check
no
CCIF
Set?
yes
Erase Verify
Status
no
BLANK
Set?
yes
EEPROM Memory
Erased
EEPROM Memory
Not Erased
EXIT
EXIT
Figure 3-15. Example Erase Verify Command Flow
MC9S12XDP512 Data Sheet, Rev. 2.11
162
Freescale Semiconductor
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Chapter 3 4 Kbyte EEPROM Module (S12XEETX4KV2)
3.4.2.2
Program Command
The program operation will program a previously erased word in the EEPROM memory using an
embedded algorithm.
An example flow to execute the program operation is shown in Figure 3-16. The program command write
sequence is as follows:
1. Write to an EEPROM block address to start the command write sequence for the program
command. The data written will be programmed to the address written.
2. Write the program command, 0x20, to the ECMD register.
3. Clear the CBEIF flag in the ESTAT register by writing a 1 to CBEIF to launch the program
command.
If a word to be programmed is in a protected area of the EEPROM memory, the PVIOL flag in the ESTAT
register will set and the program command will not launch. Once the program command has successfully
launched, the CCIF flag in the ESTAT register will set after the program operation has completed unless a
new command write sequence has been buffered.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
163
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Chapter 3 4 Kbyte EEPROM Module (S12XEETX4KV2)
START
Read: ECLKDIV register
Clock Register
EDIVLD
Written
NOTE: ECLKDIV needs to
be set once after each reset.
no
Set?
Check
yes
Write: ECLKDIV register
Read: ESTAT register
Address, Data,
Command
Buffer Empty Check
CBEIF
Set?
no
yes
ACCERR/
PVIOL
Set?
yes
Access Error and
Protection Violation
Check
Write: ESTAT register
Clear ACCERR/PVIOL 0x30
no
Write: EEPROM Address
and program Data
1.
2.
3.
NOTE: command write sequence
aborted by writing 0x00 to
ESTAT register.
Write: ECMD register
Program Command 0x20
NOTE: command write sequence
aborted by writing 0x00 to
ESTAT register.
Write: ESTAT register
Clear CBEIF 0x80
Read: ESTAT register
Bit Polling for
Buffer Empty
Check
no
CBEIF
Set?
yes
Sequential
Programming
Decision
yes
Next
Word?
no
Read: ESTAT register
Bit Polling for
Command Completion
Check
no
CCIF
Set?
yes
EXIT
Figure 3-16. Example Program Command Flow
MC9S12XDP512 Data Sheet, Rev. 2.11
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Freescale Semiconductor
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Chapter 3 4 Kbyte EEPROM Module (S12XEETX4KV2)
3.4.2.3
Sector Erase Command
The sector erase operation will erase both words in a sector of EEPROM memory using an embedded
algorithm.
An example flow to execute the sector erase operation is shown in Figure 3-17. The sector erase command
write sequence is as follows:
1. Write to an EEPROM memory address to start the command write sequence for the sector erase
command. The EEPROM address written determines the sector to be erased while global address
bits [1:0] and the data written are ignored.
2. Write the sector erase command, 0x40, to the ECMD register.
3. Clear the CBEIF flag in the ESTAT register by writing a 1 to CBEIF to launch the sector erase
command.
If an EEPROM sector to be erased is in a protected area of the EEPROM memory, the PVIOL flag in the
ESTAT register will set and the sector erase command will not launch. Once the sector erase command has
successfully launched, the CCIF flag in the ESTAT register will set after the sector erase operation has
completed unless a new command write sequence has been buffered.
MC9S12XDP512 Data Sheet, Rev. 2.11
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165
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Chapter 3 4 Kbyte EEPROM Module (S12XEETX4KV2)
START
Read: ECLKDIV register
Clock Register
EDIVLD
Written
NOTE: ECLKDIV needs to
be set once after each reset.
no
Set?
Check
yes
Write: ECLKDIV register
Read: ESTAT register
Address, Data,
Command
Buffer Empty Check
CBEIF
Set?
no
yes
ACCERR/
PVIOL
Set?
yes
Access Error and
Protection Violation
Check
Write: ESTAT register
Clear ACCERR/PVIOL 0x30
no
Write: EEPROM Sector Address
and Dummy Data
1.
2.
3.
NOTE: command write sequence
aborted by writing 0x00 to
ESTAT register.
Write: ECMD register
Sector Erase Command 0x40
NOTE: command write sequence
aborted by writing 0x00 to
ESTAT register.
Write: ESTAT register
Clear CBEIF 0x80
Read: ESTAT register
Bit Polling for
Command Completion
Check
no
CCIF
Set?
yes
EXIT
Figure 3-17. Example Sector Erase Command Flow
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 3 4 Kbyte EEPROM Module (S12XEETX4KV2)
3.4.2.4
Mass Erase Command
The mass erase operation will erase all addresses in an EEPROM block using an embedded algorithm.
An example flow to execute the mass erase operation is shown in Figure 3-18. The mass erase command
write sequence is as follows:
1. Write to an EEPROM memory address to start the command write sequence for the mass erase
command. The address and data written will be ignored.
2. Write the mass erase command, 0x41, to the ECMD register.
3. Clear the CBEIF flag in the ESTAT register by writing a 1 to CBEIF to launch the mass erase
command.
If the EEPROM memory to be erased contains any protected area, the PVIOL flag in the ESTAT register
will set and the mass erase command will not launch. Once the mass erase command has successfully
launched, the CCIF flag in the ESTAT register will set after the mass erase operation has completed unless
a new command write sequence has been buffered.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
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Chapter 3 4 Kbyte EEPROM Module (S12XEETX4KV2)
START
Read: ECLKDIV register
Clock Register
EDIVLD
Written
NOTE: ECLKDIV needs to
be set once after each reset.
no
Set?
Check
yes
Write: ECLKDIV register
Read: ESTAT register
Address, Data,
Command
Buffer Empty Check
CBEIF
Set?
no
yes
ACCERR/
PVIOL
Set?
yes
Access Error and
Protection Violation
Check
Write: ESTAT register
Clear ACCERR/PVIOL 0x30
no
Write: EEPROM Address
and Dummy Data
1.
2.
3.
NOTE: command write sequence
aborted by writing 0x00 to
ESTAT register.
Write: ECMD register
Mass Erase Command 0x41
NOTE: command write sequence
aborted by writing 0x00 to
ESTAT register.
Write: ESTAT register
Clear CBEIF 0x80
Read: ESTAT register
Bit Polling for
Command Completion
Check
no
CCIF
Set?
yes
EXIT
Figure 3-18. Example Mass Erase Command Flow
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 3 4 Kbyte EEPROM Module (S12XEETX4KV2)
3.4.2.5
Sector Erase Abort Command
The sector erase abort operation will terminate the active sector erase or sector modify operation so that
other sectors in an EEPROM block are available for read and program operations without waiting for the
sector erase or sector modify operation to complete.
An example flow to execute the sector erase abort operation is shown in Figure 3-19. The sector erase abort
command write sequence is as follows:
1. Write to any EEPROM memory address to start the command write sequence for the sector erase
abort command. The address and data written are ignored.
2. Write the sector erase abort command, 0x47, to the ECMD register.
3. Clear the CBEIF flag in the ESTAT register by writing a 1 to CBEIF to launch the sector erase abort
command.
If the sector erase abort command is launched resulting in the early termination of an active sector erase
or sector modify operation, the ACCERR flag will set once the operation completes as indicated by the
CCIF flag being set. The ACCERR flag sets to inform the user that the EEPROM sector may not be fully
erased and a new sector erase or sector modify command must be launched before programming any
location in that specific sector. If the sector erase abort command is launched but the active sector erase or
sector modify operation completes normally, the ACCERR flag will not set upon completion of the
operation as indicated by the CCIF flag being set. If the sector erase abort command is launched after the
sector modify operation has completed the sector erase step, the program step will be allowed to complete.
The maximum number of cycles required to abort a sector erase or sector modify operation is equal to four
EECLK periods (see Section 3.4.1.1, “Writing the ECLKDIV Register”) plus five bus cycles as measured
from the time the CBEIF flag is cleared until the CCIF flag is set.
NOTE
Since the ACCERR bit in the ESTAT register may be set at the completion
of the sector erase abort operation, a command write sequence is not
allowed to be buffered behind a sector erase abort command write sequence.
The CBEIF flag will not set after launching the sector erase abort command
to indicate that a command should not be buffered behind it. If an attempt is
made to start a new command write sequence with a sector erase abort
operation active, the ACCERR flag in the ESTAT register will be set. A new
command write sequence may be started after clearing the ACCERR flag, if
set.
NOTE
The sector erase abort command should be used sparingly since a sector
erase operation that is aborted counts as a complete program/erase cycle.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
169
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Chapter 3 4 Kbyte EEPROM Module (S12XEETX4KV2)
Execute Sector Erase/Modify Command Flow
Read: ESTAT register
Erase
Abort
Needed?
Bit Polling for
Command
Completion Check
CCIF
Set?
no
no
yes
yes
Sector Erase
Completed
EXIT
Write: Dummy EEPROM Address
and Dummy Data
1.
2.
3.
NOTE: command write sequence
aborted by writing 0x00 to
ESTAT register.
Write: ECMD register
Sector Erase Abort Cmd 0x47
NOTE: command write sequence
aborted by writing 0x00 to
ESTAT register.
Write: ESTAT register
Clear CBEIF 0x80
Read: ESTAT register
no
Bit Polling for
Command
Completion Check
CCIF
Set?
yes
yes
ACCERR
Set?
Access
Error Check
Write: ESTAT register
Clear ACCERR 0x10
no
Sector Erase
Sector Erase
or Modify
Aborted
EXIT
EXIT
or Modify
Completed
Figure 3-19. Example Sector Erase Abort Command Flow
MC9S12XDP512 Data Sheet, Rev. 2.11
170
Freescale Semiconductor
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Chapter 3 4 Kbyte EEPROM Module (S12XEETX4KV2)
3.4.2.6
Sector Modify Command
The sector modify operation will erase both words in a sector of EEPROM memory followed by a
reprogram of the addressed word using an embedded algorithm.
An example flow to execute the sector modify operation is shown in Figure 3-20. The sector modify
command write sequence is as follows:
1. Write to an EEPROM memory address to start the command write sequence for the sector modify
command. The EEPROM address written determines the sector to be erased and word to be
reprogrammed while byte address bit 0 is ignored.
2. Write the sector modify command, 0x60, to the ECMD register.
3. Clear the CBEIF flag in the ESTAT register by writing a 1 to CBEIF to launch the sector erase
command.
If an EEPROM sector to be modified is in a protected area of the EEPROM memory, the PVIOL flag in
the ESTAT register will set and the sector modify command will not launch. Once the sector modify
command has successfully launched, the CCIF flag in the ESTAT register will set after the sector modify
operation has completed unless a new command write sequence has been buffered.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
171
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Chapter 3 4 Kbyte EEPROM Module (S12XEETX4KV2)
START
Read: ECLKDIV register
Clock Register
EDIVLD
Written
NOTE: ECLKDIV needs to
be set once after each reset.
no
Set?
Check
yes
Write: ECLKDIV register
Read: ESTAT register
Address, Data,
Command
Buffer Empty Check
CBEIF
Set?
no
yes
ACCERR/
PVIOL
Set?
yes
Access Error and
Protection Violation
Check
Write: ESTAT register
Clear ACCERR/PVIOL 0x30
no
Write: EEPROM Word Address
and program Data
1.
2.
3.
NOTE: command write sequence
aborted by writing 0x00 to
ESTAT register.
Write: ECMD register
Sector Modify Command 0x60
NOTE: command write sequence
aborted by writing 0x00 to
ESTAT register.
Write: ESTAT register
Clear CBEIF 0x80
Read: ESTAT register
Bit Polling for
Command Completion
Check
no
CCIF
Set?
yes
EXIT
Figure 3-20. Example Sector Modify Command Flow
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 3 4 Kbyte EEPROM Module (S12XEETX4KV2)
3.4.3
Illegal EEPROM Operations
The ACCERR flag will be set during the command write sequence if any of the following illegal steps are
performed, causing the command write sequence to immediately abort:
1. Writing to an EEPROM address before initializing the ECLKDIV register.
2. Writing a byte or misaligned word to a valid EEPROM address.
3. Starting a command write sequence while a sector erase abort operation is active.
4. Writing to any EEPROM register other than ECMD after writing to an EEPROM address.
5. Writing a second command to the ECMD register in the same command write sequence.
6. Writing an invalid command to the ECMD register.
7. Writing to an EEPROM address after writing to the ECMD register.
8. Writing to any EEPROM register other than ESTAT (to clear CBEIF) after writing to the ECMD
register.
9. Writing a 0 to the CBEIF flag in the ESTAT register to abort a command write sequence.
The ACCERR flag will not be set if any EEPROM register is read during a valid command write sequence.
The ACCERR flag will also be set if any of the following events occur:
1. Launching the sector erase abort command while a sector erase or sector modify operation is active
which results in the early termination of the sector erase or sector modify operation (see
Section 3.4.2.5, “Sector Erase Abort Command”).
2. The MCU enters stop mode and a command operation is in progress. The operation is aborted
immediately and any pending command is purged (see Section 3.5.2, “Stop Mode”).
If the EEPROM memory is read during execution of an algorithm (CCIF = 0), the read operation will
return invalid data and the ACCERR flag will not be set.
If the ACCERR flag is set in the ESTAT register, the user must clear the ACCERR flag before starting
another command write sequence (see Section 3.3.2.6, “EEPROM Status Register (ESTAT)”).
The PVIOL flag will be set after the command is written to the ECMD register during a command write
sequence if any of the following illegal operations are attempted, causing the command write sequence to
immediately abort:
1. Writing the program command if the address written in the command write sequence was in a
protected area of the EEPROM memory.
2. Writing the sector erase command if the address written in the command write sequence was in a
protected area of the EEPROM memory.
3. Writing the mass erase command to the EEPROM memory while any EEPROM protection is
enabled.
4. Writing the sector modify command if the address written in the command write sequence was in
a protected area of the EEPROM memory.
If the PVIOL flag is set in the ESTAT register, the user must clear the PVIOL flag before starting another
command write sequence (see Section 3.3.2.6, “EEPROM Status Register (ESTAT)”).
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
173
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Chapter 3 4 Kbyte EEPROM Module (S12XEETX4KV2)
3.5
Operating Modes
Wait Mode
3.5.1
If a command is active (CCIF = 0) when the MCU enters the wait mode, the active command and any
buffered command will be completed.
The EEPROM module can recover the MCU from wait mode if the CBEIF and CCIF interrupts are enabled
(see Section 3.8, “Interrupts”).
3.5.2
Stop Mode
If a command is active (CCIF = 0) when the MCU enters the stop mode, the operation will be aborted and,
if the operation is program, sector erase, mass erase, or sector modify, the EEPROM array data being
programmed or erased may be corrupted and the CCIF and ACCERR flags will be set. If active, the high
voltage circuitry to the EEPROM memory will immediately be switched off when entering stop mode.
Upon exit from stop mode, the CBEIF flag is set and any buffered command will not be launched. The
ACCERR flag must be cleared before starting a command write sequence (see Section 3.4.1.2, “Command
Write Sequence”).
NOTE
As active commands are immediately aborted when the MCU enters stop
mode, it is strongly recommended that the user does not use the STOP
instruction during program, sector erase, mass erase, or sector modify
operations.
3.5.3
Background Debug Mode
In background debug mode (BDM), the EPROT register is writable. If the MCU is unsecured, then all
EEPROM commands listed in Table 3-10 can be executed. If the MCU is secured and is in special single
chip mode, the only command available to execute is mass erase.
3.6
EEPROM Module Security
The EEPROM module does not provide any security information to the MCU. After each reset, the
security state of the MCU is a function of information provided by the Flash module (see the specific FTX
Block Guide).
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 3 4 Kbyte EEPROM Module (S12XEETX4KV2)
3.6.1
Unsecuring the MCU in Special Single Chip Mode using BDM
Before the MCU can be unsecured in special single chip mode, the EEPROM memory must be erased
using the following method :
•
Reset the MCU into special single chip mode, delay while the erase test is performed by the BDM
secure ROM, send BDM commands to disable protection in the EEPROM module, and execute a
mass erase command write sequence to erase the EEPROM memory.
After the CCIF flag sets to indicate that the EEPROM mass operation has completed and assuming that the
Flash memory has also been erased, reset the MCU into special single chip mode. The BDM secure ROM
will verify that the Flash and EEPROM memory are erased and will assert the UNSEC bit in the BDM
status register. This BDM action will cause the MCU to override the Flash security state and the MCU will
be unsecured. Once the MCU is unsecured, BDM commands will be enabled and the Flash security byte
may be programmed to the unsecure state.
3.7
Resets
3.7.1
EEPROM Reset Sequence
On each reset, the EEPROM module executes a reset sequence to hold CPU activity while loading the
EPROT register from the EEPROM memory according to Table 3-1.
3.7.2
Reset While EEPROM Command Active
If a reset occurs while any EEPROM command is in progress, that command will be immediately aborted.
The state of a word being programmed or the sector / block being erased is not guaranteed.
3.8
Interrupts
The EEPROM module can generate an interrupt when all EEPROM command operations have completed,
when the EEPROM address, data, and command buffers are empty.
Table 3-11. EEPROM Interrupt Sources
Interrupt Source
Interrupt Flag
Local Enable
Global (CCR) Mask
EEPROM address, data, and command buffers empty
CBEIF
CBEIE
I Bit
(ESTAT register)
(ECNFG register)
All EEPROM commands completed
CCIF
CCIE
I Bit
(ESTAT register)
(ECNFG register)
NOTE
Vector addresses and their relative interrupt priority are determined at the
MCU level.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
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Chapter 3 4 Kbyte EEPROM Module (S12XEETX4KV2)
3.8.1
Description of EEPROM Interrupt Operation
The logic used for generating interrupts is shown in Figure 3-21.
The EEPROM module uses the CBEIF and CCIF flags in combination with the CBIE and CCIE enable
bits to generate the EEPROM command interrupt request.
CBEIF
CBEIE
EEPROM Command Interrupt Request
CCIF
CCIE
Figure 3-21. EEPROM Interrupt Implementation
For a detailed description of the register bits, refer to Section 3.3.2.4, “EEPROM Configuration Register
(ECNFG)” and Section 3.3.2.6, “EEPROM Status Register (ESTAT)” .
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 4
Port Integration Module (S12XDP512PIMV2)
4.1
Introduction
The S12XD family port integration module (below referred to as PIM) establishes the interface between
the peripheral modules including the non-multiplexed external bus interface module (S12X_EBI) and the
I/O pins for all ports. It controls the electrical pin properties as well as the signal prioritization and
multiplexing on shared pins.
This document covers the description of:
•
•
•
•
•
•
•
•
Port A, B used as address output of the S12X_EBI
Port C, D used as data I/O of the S12X_EBI
Port E associated with the S12X_EBI control signals and the IRQ, XIRQ interrupt inputs
Port K associated with address output and control signals of the S12X_EBI
Port T connected to the Enhanced Capture Timer (ECT) module
Port S associated with 2 SCI and 1 SPI modules
Port M associated with 4 MSCAN modules and 1 SCI module
Port P connected to the PWM and 2 SPI modules — inputs can be used as an external interrupt
source
•
•
Port H associated with 2 SCI modules — inputs can be used as an external interrupt source
Port J associated with 1 MSCAN, 1 SCI, and 2 IIC modules — inputs can be used as an external
interrupt source
•
Port AD0 and AD1 associated with one 8-channel and one 16-channel ATD module
Most I/O pins can be configured by register bits to select data direction and drive strength, to enable and
select pull-up or pull-down devices. Interrupts can be enabled on specific pins resulting in status flags.
The I/O’s of 2 MSCAN and all 3 SPI modules can be routed from their default location to alternative port
pins.
NOTE
The implementation of the PIM is device dependent. Therefore some
functions are not available on certain derivatives or 112-pin and 80-pin
package options.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.1.1
Features
A full-featured PIM module includes these distinctive registers:
•
Data and data direction registers for Ports A, B, C, D, E, K, T, S, M, P, H, J, AD0, and AD1 when
used as general-purpose I/O
•
Control registers to enable/disable pull-device and select pull-ups/pull-downs on Ports T, S, M, P,
H, and J on per-pin basis
•
•
Control registers to enable/disable pull-up devices on Ports AD0, and AD1 on per-pin basis
Single control register to enable/disable pull-ups on Ports A, B, C, D, E, and K on per-port basis
and on BKGD pin
•
•
Control registers to enable/disable reduced output drive on Ports T, S, M, P, H, J, AD0, and AD1
on per-pin basis
Single control register to enable/disable reduced output drive on Ports A, B, C, D, E, and K on
per-port basis
•
•
•
•
•
Control registers to enable/disable open-drain (wired-OR) mode on Ports S and M
Control registers to enable/disable pin interrupts on Ports P, H, and J
Interrupt flag register for pin interrupts on Ports P, H, and J
Control register to configure IRQ pin operation
Free-running clock outputs
A standard port pin has the following minimum features:
•
•
•
•
Input/output selection
5V output drive with two selectable drive strengths
5V digital and analog input
Input with selectable pull-up or pull-down device
Optional features:
•
•
•
Open drain for wired-OR connections
Interrupt inputs with glitch filtering
Reduced input threshold to support low voltage applications
Block Diagram
Figure 4-1 is a block diagram of the MC9S12XDP512.
•
•
•
Signals shown in Bold are not available in 80-pin packages.
Signals shown in Bold-Italics are neither available in 112-pin nor in 80-pin packages.
Shaded labels denote alternative module routing ports.
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
Port Integration Module
PAD23
PAD21
PAD19
PAD17
PAD15
PAD13
PAD11
PAD09
AN15,14
PAD22
PAD20
PAD18
PAD16
PAD14
PAD12
PAD10
PAD08
TXD
RXD
TXD
RXD
PH7
PH6
PH5
PH4
PH3
PH2
PH1
PH0
AN13,12
AN11,10
AN9,8
AN7,6
AN5,4
AN3,2
AN1,0
SCI5
SCI4
AN7
AN6
AN5
AN4
AN3
AN2
AN1
AN0
PAD07
PAD06
PAD05
PAD04
PAD03
PAD02
PAD01
PAD00
TXCAN
RXCAN
SCL
SDA
SCL
PJ7
PJ6
CAN4
IIC0
PJ5
PJ4
PJ2
PJ1
PJ0
IIC1
SDA
TXD
RXD
SCI2
IOC7
IOC6
IOC5
IOC4
IOC3
IOC2
IOC1
IOC0
PT7
PT6
PT5
PT4
PT3
PT2
PT1
PT0
PM7
PM6
PM5
PM4
PM3
PM2
PM1
PM0
TXCAN
RXCAN
TXCAN
RXCAN
TXCAN
RXCAN
TXCAN
RXCAN
TXD
RXD
CAN3
CAN2
CAN1
CAN0
SCI3
PWM7
SCK
PP7
PP6
PP5
PP4
PP3
PP2
PP1
PP0
SPI2
PWM6
PWM5
PWM4
PWM3
PWM2
PWM1
PWM0
SS
MOSI
MISO
SS
SCK
MOSI
MISO
PA7
PA6
PA5
PA4
PA3
PA2
PA1
PA0
ADDR15
ADDR14
ADDR13
ADDR12
ADDR11
ADDR10
ADDR9
SPI1
SS
PS7
PS6
PS5
PS4
PS3
PS2
PS1
PS0
SPI0
ADDR8
SCK
MOSI
MISO
TXD
RXD
TXD
RXD
PB7
PB6
PB5
PB4
PB3
PB2
PB1
PB0
ADDR7
ADDR6
ADDR5
ADDR4
ADDR3
ADDR2
ADDR1
ADDR0/UDS
SCI1
SCI0
BKGD/MODC
ECLKX2/XCLKS
TAGHI/MODB
TAGLO/RE/MODA
ECLK
BKGD
PE7
PE6
PE5
PE4
PE3
PE2
PE1
PE0
PC7
PC6
PC5
PC4
PC3
PC2
PC1
PC0
DATA15
DATA14
DATA13
DATA12
DATA11
DATA10
DATA9
S12X_EBI
S12X_BDM
S12X_DBG
S12X_INT
LDS/LSTRB
WE/R/W
IRQ
XIRQ
DATA8
PK7
PK6
PK5
PK4
PK3
PK2
PK1
PK0
EWAIT/ROMCTL
NOACC/ADDR22
PD7
PD6
PD5
PD4
PD3
PD2
PD1
PD0
DATA7
DATA6
DATA5
DATA4
DATA3
DATA2
DATA1
DATA0
ADDR21
ADRR20
ADDR19
ADDR18
ADDR17
ADDR16
Figure 4-1. MC9S12XDP512 Block Diagram
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
179
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.2
External Signal Description
This section lists and describes the signals that do connect off-chip.
4.2.1
Signal Properties
Table 4-1 shows all the pins and their functions that are controlled by the MC9S12XDP512. Refer to
Section 4.4, “Functional Description” for the availability of the individual pins in the different package
options.
NOTE
If there is more than one function associated with a pin, the priority is
indicated by the position in the table from top (highest priority) to bottom
(lowest priority).
Table 4-1. Pin Functions and Priorities (Sheet 1 of 7)
Pin Function
and Priority
Pin Function
after Reset
Port
Pin Name
I/O
Description
MODC input during RESET
1
—
BKGD
MODC
I
BKGD
BKGD
I/O S12X_BDM communication pin
A
B
PA[7:0]
PB[7:1]
PB[0]
ADDR[15:8]
mux
IVD[15:8]
O
High-order external bus address output
(multiplexed with IVIS data)
Mode
dependent
3
2
GPIO
I/O General-purpose I/O
ADDR[7:1]
mux
O
Low-order external bus address output
(multiplexed with IVIS data)
Mode
dependent
3
2
IVD[7:1]
GPIO
I/O General-purpose I/O
ADDR[0]
mux
O
Low-order external bus address output
(multiplexed with IVIS data)
2
IVD0
UDS
GPIO
O
Upper data strobe
I/O General-purpose I/O
C
D
PC[7:0]
PD[7:0]
DATA[15:8]
I/O High-order bidirectional data input/output
Configurable for reduced input threshold
Mode
dependent
3
GPIO
I/O General-purpose I/O
DATA[7:0]
I/O Low-order bidirectional data input/output
Configurable for reduced input threshold
Mode
dependent
3
GPIO
I/O General-purpose I/O
MC9S12XDP512 Data Sheet, Rev. 2.11
180
Freescale Semiconductor
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
Table 4-1. Pin Functions and Priorities (Sheet 2 of 7)
Pin Function
and Priority
Pin Function
after Reset
Port
Pin Name
I/O
Description
1
I
I
External clock selection input during RESET
XCLKS
PE[7]
ECLKX2
GPIO
Free-running clock output at Core Clock rate (ECLK x 2)
I/O General-purpose I/O
1
I
I
MODB input during RESET
MODB
Instruction tagging low pin
Configurable for reduced input threshold
PE[6]
PE[5]
TAGHI
GPIO
I/O General-purpose I/O
1
I
MODA input during RESET
Read enable signal
MODA
RE
O
Instruction tagging low pin
Configurable for reduced input threshold
TAGLO
GPIO
ECLK
GPIO
I
I/O General-purpose I/O
Free-running clock output at the Bus Clock rate or
programmable divided in normal modes
Mode
O
E
3
PE[4]
PE[3]
dependent
I/O General-purpose I/O
1
I
EROMON bit control input during RESET
Low strobe bar output
EROMCTL
LSTRB
LDS
O
O
Lower data strobe
GPIO
R/W
I/O General-purpose I/O
O
O
Read/write output for external bus
Write enable signal
PE[2]
WE
GPIO
IRQ
I/O General-purpose I/O
Maskable level- or falling edge-sensitive interrupt input
I/O General-purpose I/O
Non-maskable level-sensitive interrupt input
I
PE[1]
PE[0]
GPIO
XIRQ
GPIO
I
I/O General-purpose I/O
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
181
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
Table 4-1. Pin Functions and Priorities (Sheet 3 of 7)
Pin Function
and Priority
Pin Function
after Reset
Port
Pin Name
I/O
Description
1
I
I
ROMON bit control input during RESET
ROMCTL
External Wait signal
Configurable for reduced input threshold
PK[7]
EWAIT
GPIO
I/O General-purpose I/O
ADDR[22:20]
mux
Extended external bus address output
(multiplexed with access master output)
Mode
O
K
PK[6:4]
PK[3:0]
2
3
ACC[2:0]
dependent
GPIO
I/O General-purpose I/O
ADDR[19:16]
mux
Extended external bus address output
(multiplexed with instruction pipe status bits)
O
2
IQSTAT[3:0]
GPIO
IOC[7:0]
GPIO
I/O General-purpose I/O
I/O Enhanced Capture Timer Channels 7–0 input/output
I/O General-purpose I/O
T
PT[7:0]
PS7
GPIO
Serial Peripheral Interface 0 slave select output in master
mode, input in slave mode or master mode.
SS0
I/O
GPIO
SCK0
GPIO
MOSI0
GPIO
MISO0
GPIO
TXD1
GPIO
RXD1
GPIO
TXD0
GPIO
RXD0
GPIO
I/O General-purpose I/O
I/O Serial Peripheral Interface 0 serial clock pin
I/O General-purpose I/O
PS6
PS5
PS4
PS3
PS2
PS1
PS0
I/O Serial Peripheral Interface 0 master out/slave in pin
I/O General-purpose I/O
I/O Serial Peripheral Interface 0 master in/slave out pin
I/O General-purpose I/O
S
GPIO
O
Serial Communication Interface 1 transmit pin
I/O General-purpose I/O
Serial Communication Interface 1 receive pin
I/O General-purpose I/O
Serial Communication Interface 0 transmit pin
I/O General-purpose I/O
Serial Communication Interface 0 receive pin
I
O
I
I/O General-purpose I/O
MC9S12XDP512 Data Sheet, Rev. 2.11
182
Freescale Semiconductor
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
Table 4-1. Pin Functions and Priorities (Sheet 4 of 7)
Pin Function
and Priority
Pin Function
after Reset
Port
Pin Name
I/O
Description
TXCAN3
TXCAN4
TXD3
O
O
O
MSCAN3 transmit pin
MSCAN4 transmit pin
PM7
Serial Communication Interface 3 transmit pin
GPIO
I/O General-purpose I/O
RXCAN3
RXCAN4
RXD3
I
I
I
MSCAN3 receive pin
MSCAN4 receive pin
PM6
PM5
Serial Communication Interface 3 receive pin
GPIO
I/O General-purpose I/O
TXCAN2
TXCAN0
TXCAN4
O
O
O
MSCAN2 transmit pin
MSCAN0 transmit pin
MSCAN4 transmit pin
Serial Peripheral Interface 0 serial clock pin
SCK0
I/O If CAN0 is routed to PM[3:2] the SPI0 can still be used in
bidirectional master mode.
GPIO
I/O General-purpose I/O
RXCAN2
RXCAN0
RXCAN4
I
I
I
MSCAN2 receive pin
MSCAN0 receive pin
M
GPIO
MSCAN4 receive pin
PM4
Serial Peripheral Interface 0 master out/slave in pin
MOSI0
I/O If CAN0 is routed to PM[3:2] the SPI0 can still be used in
bidirectional master mode.
GPIO
I/O General-purpose I/O
TXCAN1
TXCAN0
O
O
MSCAN1 transmit pin
MSCAN0 transmit pin
PM3
PM2
Serial Peripheral Interface 0 slave select output in master
mode, input for slave mode or master mode.
SS0
I/O
GPIO
RXCAN1
RXCAN0
MISO0
GPIO
I/O General-purpose I/O
I
I
MSCAN1 receive pin
MSCAN0 receive pin
I/O Serial Peripheral Interface 0 master in/slave out pin
I/O General-purpose I/O
TXCAN0
GPIO
O
MSCAN0 transmit pin
I/O General-purpose I/O
MSCAN0 receive pin
PM1
PM0
RXCAN0
GPIO
I
I/O General-purpose I/O
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
183
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
Table 4-1. Pin Functions and Priorities (Sheet 5 of 7)
Pin Function
and Priority
Pin Function
after Reset
Port
Pin Name
I/O
Description
PWM7
SCK2
I/O Pulse Width Modulator input/output channel 7
I/O Serial Peripheral Interface 2 serial clock pin
I/O General-purpose I/O with interrupt
PP7
GPIO/KWP7
PWM6
O
Pulse Width Modulator output channel 6
Serial Peripheral Interface 2 slave select output in master
mode, input for slave mode or master mode.
PP6
SS2
I/O
GPIO/KWP6
PWM5
I/O General-purpose I/O with interrupt
Pulse Width Modulator output channel 5
O
PP5
PP4
MOSI2
I/O Serial Peripheral Interface 2 master out/slave in pin
I/O General-purpose I/O with interrupt
GPIO/KWP5
PWM4
O
Pulse Width Modulator output channel 4
MISO2
I/O Serial Peripheral Interface 2 master in/slave out pin
I/O General-purpose I/O with interrupt
GPIO/KWP4
PWM3
P
GPIO
O
Pulse Width Modulator output channel 3
Serial Peripheral Interface 1 slave select output in master
mode, input for slave mode or master mode.
PP3
SS1
I/O
GPIO/KWP3
PWM2
I/O General-purpose I/O with interrupt
Pulse Width Modulator output channel 2
O
PP2
PP1
PP0
SCK1
I/O Serial Peripheral Interface 1 serial clock pin
I/O General-purpose I/O with interrupt
GPIO/KWP2
PWM1
O
Pulse Width Modulator output channel 1
MOSI1
I/O Serial Peripheral Interface 1 master out/slave in pin
I/O General-purpose I/O with interrupt
GPIO/KWP1
PWM0
O
Pulse Width Modulator output channel 0
MISO1
I/O Serial Peripheral Interface 1 master in/slave out pin
I/O General-purpose I/O with interrupt
GPIO/KWP0
MC9S12XDP512 Data Sheet, Rev. 2.11
184
Freescale Semiconductor
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
Table 4-1. Pin Functions and Priorities (Sheet 6 of 7)
Pin Function
and Priority
Pin Function
after Reset
Port
Pin Name
I/O
Description
Serial Peripheral Interface 2 slave select output in master
mode, input for slave mode or master mode
SS2
I/O
O
PH7
TXD5
GPIO/KWH7
SCK2
Serial Communication Interface 5 transmit pin
I/O General-purpose I/O with interrupt
I/O Serial Peripheral Interface 2 serial clock pin
PH6
PH5
RXD5
I
Serial Communication Interface 5 receive pin
GPIO/KWH6
MOSI2
I/O General-purpose I/O with interrupt
I/O Serial Peripheral Interface 2 master out/slave in pin
TXD4
O
Serial Communication Interface 4 transmit pin
GPIO/KWH5
MISO2
I/O General-purpose I/O with interrupt
I/O Serial Peripheral Interface 2 master in/slave out pin
H
GPIO
PH4
PH3
RXD4
I
Serial Communication Interface 4 receive pin
GPIO/KWH4
I/O General-purpose I/O with interrupt
Serial Peripheral Interface 1 slave select output in master
mode, input for slave mode or master mode.
SS1
I/O
GPIO/KWH3
SCK1
I/O General-purpose I/O with interrupt
I/O Serial Peripheral Interface 1 serial clock pin
I/O General-purpose I/O with interrupt
PH2
PH1
PH0
GPIO/KWH2
MOSI1
I/O Serial Peripheral Interface 1 master out/slave in pin
I/O General-purpose I/O with interrupt
GPIO/KWH1
MISO1
I/O Serial Peripheral Interface 1 master in/slave out pin
I/O General-purpose I/O with interrupt
GPIO/KWH0
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
185
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
Table 4-1. Pin Functions and Priorities (Sheet 7 of 7)
Pin Function
and Priority
Pin Function
after Reset
Port
Pin Name
I/O
Description
TXCAN4
SCL0
O
O
O
MSCAN4 transmit pin
Inter Integrated Circuit 0 serial clock line
MSCAN0 transmit pin
PJ7
TXCAN0
GPIO/KWJ7
RXCAN4
SDA0
I/O General-purpose I/O with interrupt
MSCAN4 receive pin
I/O Inter Integrated Circuit 0 serial data line
MSCAN0 receive pin
I/O General-purpose I/O with interrupt
I
PJ6
RXCAN0
GPIO/KWJ6
SCL1
I
O
O
Inter Integrated Circuit 1 serial clock line
Chip select 2
PJ5
PJ4
CS2
J
GPIO/KWJ7
SDA1
I/O General-purpose I/O with interrupt
GPIO
I/O Inter Integrated Circuit 1 serial data line
CS0
O
Chip select 0
I/O General-purpose I/O with interrupt
Chip select 1
I/O General-purpose I/O with interrupt
Serial Communication Interface 2 transmit pin
I/O General-purpose I/O with interrupt
GPIO/KWJ6
CS1
O
PJ2
PJ1
GPIO/KWJ2
TXD2
O
GPIO/KWJ1
RXD2
I
Serial Communication Interface 2 receive pin
Chip select 3
PJ0
CS3
O
GPIO/KWJ0
GPIO
I/O General-purpose I/O with interrupt
I/O General-purpose I/O
AD0
AD1
PAD[07:00]
PAD[23:08]
GPIO
GPIO
AN[7:0]
GPIO
I
ATD0 analog inputs
I/O General-purpose I/O
ATD1 analog inputs
AN[15:0]
I
1
2
3
Function active when RESET asserted.
Only available in emulation modes or in Special Test Mode with IVIS on.
Refer also to Table 4-70 and S12X_EBI section.
MC9S12XDP512 Data Sheet, Rev. 2.11
186
Freescale Semiconductor
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3
Memory Map and Register Definition
This section provides a detailed description of all MC9S12XDP512 registers.
Module Memory Map
Table 4-2 shows the register map of the port integration module.
Table 4-2. PIM Memory Map (Sheet 1 of 3)
Address
Use
Port A Data Register (PORTA)
Access
0x0000
0x0001
0x0002
0x0003
0x0004
0x0005
0x0006
0x0007
0x0008
0x0009
Read / Write
Read / Write
Read / Write
Read / Write
Read / Write
Read / Write
Read / Write
Read / Write
Port B Data Register (PORTB)
Port A Data Direction Register (DDRA)
Port B Data Direction Register (DDRB)
Port C Data Register (PORTC)
Port D Data Register (PORTD)
Port C Data Direction Register (DDRC)
Port D Data Direction Register (DDRD)
Port E Data Register (PORTE)
1
Read / Write
Read / Write
—
1
Port E Data Direction Register (DDRE)
Non-PIM Address Range
0x000A
:
0x000B
1
1
0x000C
0x000D
Pull-up Up Control Register (PUCR)
Reduced Drive Register (RDRIV)
Non-PIM Address Range
Read / Write
Read / Write
—
0x000E
:
0x001B
1
1
0x001C
0x001D
0x001E
0x001F
ECLK Control Register (ECLKCTL)
PIM Reserved
Read / Write
—
IRQ Control Register (IRQCR)
PIM Reserved
Read / Write
—
—
0x0020
:
Non-PIM Address Range
0x0031
0x0032
0x0033
Port K Data Register (PORTK)
Port K Data Direction Register (DDRK)
Non-PIM Address Range
Read / Write
Read / Write
—
0x0034
:
0x023F
0x0240
Port T Data Register (PTT)
Read / Write
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
187
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
Table 4-2. PIM Memory Map (Sheet 2 of 3)
Address
Use
Access
0x0241
0x0242
0x0243
0x0244
0x0245
0x0246
0x0247
0x0248
0x0249
0x024A
0x024B
0x024C
0x024D
0x024E
0x024F
0x0250
0x0251
0x0252
0x0253
0x0254
0x0255
0x0256
0x0257
0x0258
0x0259
0x025A
0x025B
0x025C
0x025D
0x025E
0x025F
0x0260
0x0261
0x0262
0x0263
Port T Input Register (PTIT)
Read
Port T Data Direction Register (DDRT)
Port T Reduced Drive Register (RDRT)
Port T Pull Device Enable Register (PERT)
Port T Polarity Select Register (PPST)
Reserved
Read / Write
Read / Write
Read / Write
Read / Write
—
Reserved
—
Port S Data Register (PTS)
Read / Write
Read
Port S Input Register (PTIS)
Port S Data Direction Register (DDRS)
Port S Reduced Drive Register (RDRS)
Port S Pull Device Enable Register (PERS)
Port S Polarity Select Register (PPSS)
Port S Wired-OR Mode Register (WOMS)
Reserved
Read / Write
Read / Write
Read / Write
Read / Write
Read / Write
—
Port M Data Register (PTM)
Read / Write
Read
Port M Input Register (PTIM)
Port M Data Direction Register (DDRM)
Port M Reduced Drive Register (RDRM)
Port M Pull Device Enable Register (PERM)
Port M Polarity Select Register (PPSM)
Port M Wired-OR Mode Register (WOMM)
Module Routing Register (MODRR)
Port P Data Register (PTP)
Read / Write
Read / Write
Read / Write
Read / Write
Read / Write
Read / Write
Read / Write
Read
Port P Input Register (PTIP)
Port P Data Direction Register (DDRP)
Port P Reduced Drive Register (RDRP)
Port P Pull Device Enable Register (PERP)
Port P Polarity Select Register (PPSP)
Port P Interrupt Enable Register (PIEP)
Port P Interrupt Flag Register (PIFP)
Port H Data Register (PTH)
Read / Write
Read / Write
Read / Write
Read / Write
Read / Write
Read / Write
Read / Write
Read
Port H Input Register (PTIH)
Port H Data Direction Register (DDRH)
Port H Reduced Drive Register (RDRH)
Read / Write
Read / Write
MC9S12XDP512 Data Sheet, Rev. 2.11
188
Freescale Semiconductor
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
Table 4-2. PIM Memory Map (Sheet 3 of 3)
Address
Use
Access
0x0264
0x0265
0x0266
0x0267
0x0268
0x0269
0x026A
0x026B
0x026C
0x026D
0x026E
0x026F
0x0270
0x0271
0x0272
0x0273
0x0274
0x0275
0x0276
0x0277
0x0278
0x0279
0x027A
0x027B
0x027C
0x027D
0x027E
Port H Pull Device Enable Register (PERH)
Port H Polarity Select Register (PPSH)
Port H Interrupt Enable Register (PIEH)
Port H Interrupt Flag Register (PIFH)
Port J Data Register (PTJ)
Read / Write
Read / Write
Read / Write
Read / Write
1
Read / Write
Read
Port J Input Register (PTIJ)
1
1
1
1
1
1
Port J Data Direction Register (DDRJ)
Port J Reduced Drive Register (RDRJ)
Port J Pull Device Enable Register (PERJ)
Port J Polarity Select Register (PPSJ)
Port J Interrupt Enable Register (PIEJ)
Port J Interrupt Flag Register (PIFJ)
Reserved
Read / Write
Read / Write
Read / Write
Read / Write
Read / Write
Read / Write
—
Port AD0 Data Register 1 (PT1AD0)
Reserved
Read / Write
—
Port AD0 Data Direction Register 1 (DDR1AD0)
Reserved
Read / Write
—
Port AD0 Reduced Drive Register 1 (RDR1AD0)
Reserved
Read / Write
—
Port AD0 Pull Up Enable Register 1 (PER1AD0)
Port AD1 Data Register 0 (PT0AD1)
Port AD1 Data Register 1 (PT1AD1)
Port AD1 Data Direction Register 0 (DDR0AD1)
Port AD1 Data Direction Register 1 (DDR1AD1)
Port AD1 Reduced Drive Register 0 (RDR0AD1)
Port AD1 Reduced Drive Register 1 (RDR1AD1)
Port AD1 Pull Up Enable Register 0 (PER0AD1)
Port AD1 Pull Up Enable Register 1 (PER1AD1)
Read / Write
Read / Write
Read / Write
Read / Write
Read / Write
Read / Write
Read / Write
Read / Write
Read / Write
1
Write access not applicable for one or more register bits. Refer to Section 4.3.2, “Register
Descriptions”.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
189
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
Register Descriptions
Table 4-3 summarizes the effect on the various configuration bits, data direction (DDR), output level (IO),
reduced drive (RDR), pull enable (PE), pull select (PS), and interrupt enable (IE) for the ports.
The configuration bit PS is used for two purposes:
1. Configure the sensitive interrupt edge (rising or falling), if interrupt is enabled.
2. Select either a pull-up or pull-down device if PE is active.
Table 4-3. Pin Configuration Summary
1
2
DDR
IO
RDR
PE
PS
IE
Function
Pull Device
Interrupt
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
x
x
x
x
x
x
x
0
1
0
1
0
1
0
1
x
x
x
x
x
x
x
0
0
1
1
0
0
1
1
0
1
1
0
0
1
1
x
x
x
x
x
x
x
x
x
0
1
0
1
0
1
x
x
x
x
0
1
0
1
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
Input
Input
Input
Input
Input
Input
Input
Disabled
Pull Up
Disabled
Disabled
Pull Down
Disabled
Disabled
Pull Up
Disabled
Falling edge
Rising edge
Falling edge
Rising edge
Disabled
Pull Down
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Output, full drive to 0
Output, full drive to 1
Disabled
Output, reduced drive to 0
Output, reduced drive to 1
Output, full drive to 0
Disabled
Disabled
Falling edge
Rising edge
Falling edge
Rising edge
Output, full drive to 1
Output, reduced drive to 0
Output, reduced drive to 1
1
2
Always “0” on Port A, B, C, D, E, K, AD0, and AD1.
Applicable only on Port P, H, and J.
NOTE
All register bits in this module are completely synchronous to internal
clocks during a register read.
MC9S12XDP512 Data Sheet, Rev. 2.11
190
Freescale Semiconductor
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
Register
Name
Bit 7
6
5
4
3
2
1
Bit 0
0x0000
PORTA
R
PA7
PA6
PA5
PA4
PA3
PA2
PA1
PA0
W
0x0001
PORTB
R
PB7
DDRA7
DDRB7
PC7
PB6
DDRA6
DDRB6
PC6
PB5
DDRA5
DDRB5
PC5
PB4
DDRA4
DDRB4
PC4
PB3
DDRA3
DDRB3
PC3
PB2
DDRA2
DDRB2
PC2
PB1
DDRA1
DDRB1
PC1
PB0
DDRA0
DDRB0
PC0
W
0x0002
DDRA
R
W
0x0003
DDRB
R
W
0x0004
PORTC
R
W
0x0005
PORTD
R
PD7
PD6
PD5
PD4
PD3
PD2
PD1
PD0
W
0x0006
DDRC
R
DDRC7
DDRD7
PE7
DDRC6
DDRD6
PE6
DDRC5
DDRD5
PE5
DDRC4
DDRD4
PE4
DDRC3
DDRD3
PE3
DDRC2
DDRD2
PE2
DDRC1
DDRC0
W
0x0007
DDRD
R
DDRD1
PE1
DDRD0
PE0
W
0x0008
PORTE
R
W
0x0009
DDRE
R
0
0
DDRE7
DDRE6
DDRE5
DDRE4
DDRE3
DDRE2
W
0x000A
0x000B
Non-PIM
Address
Range
R
W
Non-PIM Address Range
0x000C
PUCR
R
0
0
PUPKE
RDPK
BKPUE
0
PUPEE
RDPE
PUPDE
RDPD
PUPCE
RDPC
PUPBE
RDPB
PUPAE
RDPA
W
0x000D
RDRIV
R
W
= Unimplemented or Reserved
Figure 4-2. PIM Register Summary (Sheet 1 of 6)
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
191
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
Register
Bit 7
6
5
4
3
2
1
Bit 0
Name
0x000E–
0x001B
Non-PIM
Address
Range
R
W
Non-PIM Address Range
0x001C
ECLKCTL
R
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
NECLK
0
NCLKX2
0
EDIV1
0
EDIV0
0
W
0x001D
Reserved
R
W
0x001E
IRQCR
R
0
0
0
0
IRQE
0
IRQEN
0
W
0x001F
R
Reserved
W
0x0020–
0x0031
Non-PIM
Address
Range
R
W
Non-PIM Address Range
0x0032
PORTK
R
PK7
PK6
PK5
PK4
PK3
PK2
PK1
PK0
W
0x0033
DDRK
R
DDRK7
DDRK6
DDRK5
DDRK4
DDRK3
DDRK2
DDRK1
DDRK0
W
0x0034–
9x023F
Non-PIM
Address
Range
R
W
Non-PIM Address Range
0x0240
PTT
R
PTT7
PTT6
PTT5
PTT4
PTT3
PTT2
PTT1
PTT0
W
0x0241
PTIT
R
PTIT7
PTIT6
PTIT5
PTIT4
PTIT3
PTIT2
PTIT1
PTIT0
W
0x0242
DDRT
R
DDRT7
RDRT7
DDRT6
RDRT6
DDRT5
RDRT5
DDRT4
RDRT4
DDRT3
RDRT3
DDRT2
RDRT2
DDRT1
RDRT1
DDRT0
RDRT0
W
0x0243
RDRT
R
W
= Unimplemented or Reserved
Figure 4-2. PIM Register Summary (Sheet 2 of 6)
MC9S12XDP512 Data Sheet, Rev. 2.11
192
Freescale Semiconductor
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
Register
Name
Bit 7
6
5
4
3
2
1
Bit 0
0x0244
PERT
R
PERT7
PERT6
PERT5
PERT4
PERT3
PERT2
PERT1
PERT0
W
0x0245
PPST
R
PPST7
0
PPST6
0
PPST5
0
PPST4
0
PPST3
0
PPST2
0
PPST1
0
PPST0
0
W
0x0246
R
Reserved
W
0x0247
R
0
0
0
0
0
0
0
0
Reserved
W
0x0248
PTS
R
PTS7
PTS6
PTS5
PTS4
PTS3
PTS2
PTS1
PTS0
W
0x0249
PTIS
R
PTIS7
PTIS6
PTIS5
PTIS4
PTIS3
PTIS2
PTIS1
PTIS0
W
0x024A
DDRS
R
DDRS7
RDRS7
PERS7
PPSS7
DDRS6
RDRS6
PERS6
PPSS6
DDRS5
RDRS5
PERS5
PPSS5
DDRS4
RDRS4
PERS4
PPSS4
DDRS3
RDRS3
PERS3
PPSS3
DDRS2
RDRS2
PERS2
PPSS2
DDRS1
RDRS1
PERS1
PPSS1
DDRS0
RDRS0
PERS0
PPSS0
W
0x024B
RDRS
R
W
0x024C
PERS
R
W
0x024D
PPSS
R
W
0x024E
WOMS
R
WOMS7
0
WOMS6
0
WOMS5
0
WOMS4
0
WOMS3
0
WOMS2
0
WOMS1
0
WOMS0
0
W
0x024F
R
Reserved
W
0x0250
PTM
R
PTM7
PTM6
PTM5
PTM4
PTM3
PTM2
PTM1
PTM0
W
0x0251
PTIM
R
PTIM7
PTIM6
PTIM5
PTIM4
PTIM3
PTIM2
PTIM1
PTIM0
W
0x0252
DDRM
R
DDRM7
DDRM6
DDRM5
DDRM4
DDRM3
DDRM2
DDRM1
DDRM0
W
= Unimplemented or Reserved
Figure 4-2. PIM Register Summary (Sheet 3 of 6)
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
193
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
Register
Bit 7
6
5
4
3
2
1
Bit 0
Name
0x0253
RDRM
R
RDRM7
PERM7
PPSM7
RDRM6
PERM6
PPSM6
WOMM6
MODRR6
RDRM5
PERM5
PPSM5
WOMM5
MODRR5
RDRM4
PERM4
PPSM4
WOMM4
MODRR4
RDRM3
PERM3
PPSM3
WOMM3
MODRR3
RDRM2
PERM2
PPSM2
WOMM2
MODRR2
RDRM1
PERM1
PPSM1
WOMM1
MODRR1
RDRM0
PERM0
PPSM0
WOMM0
MODRR0
W
0x0254
PERM
R
W
0x0255
PPSM
R
W
0x0256
WOMM
R
WOMM7
0
W
0x0257
MODRR
R
W
0x0258
PTP
R
PTP7
PTP6
PTP5
PTP4
PTP3
PTP2
PTP1
PTP0
W
0x0259
PTIP
R
PTIP7
PTIP6
PTIP5
PTIP4
PTIP3
PTIP2
PTIP1
PTIP0
W
0x025A
DDRP
R
DDRP7
RDRP7
PERP7
PPSP7
PIEP7
DDRP6
RDRP6
PERP6
PPSP6
PIEP6
DDRP5
RDRP5
PERP5
PPSP5
PIEP5
DDRP4
RDRP4
PERP4
PPSP4
PIEP4
DDRP3
RDRP3
PERP3
PPSP3
PIEP3
DDRP2
RDRP2
PERP2
PPSP2
PIEP2
DDRP1
RDRP1
PERP1
PPSP1
PIEP1
DDRP0
RDRP0
PERP0
PPSP0
PIEP0
W
0x025B
RDRP
R
W
0x025C
PERP
R
W
0x025D
PPSP
R
W
0x025E
PIEP
R
W
0x025F
PIFP
R
PIFP7
PIFP6
PIFP5
PIFP4
PIFP3
PIFP2
PIFP1
PIFP0
W
0x0260
PTH
R
PTH7
PTH6
PTH5
PTH4
PTH3
PTH2
PTH1
PTH0
W
0x0261
PTIH
R
PTIH7
PTIH6
PTIH5
PTIH4
PTIH3
PTIH2
PTIH1
PTIH0
W
= Unimplemented or Reserved
Figure 4-2. PIM Register Summary (Sheet 4 of 6)
MC9S12XDP512 Data Sheet, Rev. 2.11
194
Freescale Semiconductor
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
Register
Name
Bit 7
6
5
4
3
2
1
Bit 0
0x0262
DDRH
R
DDRH7
DDRH6
DDRH5
DDRH4
DDRH3
DDRH2
DDRH1
DDRH0
W
0x0263
RDRH
R
RDRH7
PERH7
PPSH7
PIEH7
PIFH7
RDRH6
PERH6
PPSH6
PIEH6
PIFH6
RDRH5
PERH5
PPSH5
PIEH5
PIFH5
RDRH4
PERH4
PPSH4
PIEH4
PIFH4
RDRH3
PERH3
PPSH3
PIEH3
RDRH2
PERH2
PPSH2
PIEH2
PIFH2
RDRH1
PERH1
PPSH1
PIEH1
PIFH1
RDRH0
PERH0
PPSH0
PIEH0
PIFH0
W
0x0264
PERH
R
W
0x0265
PPSH
R
W
0x0266
PIEH
R
W
0x0267
PIFH
R
PIFH3
0
W
0x0268
PTJ
R
PTJ7
PTJ6
PTJ5
PTJ4
PTJ2
PTJ1
PTJ0
W
0x0269
PTIJ
R
PTIJ7
PTIJ6
PTIJ5
PTIJ4
0
0
0
0
0
0
0
0
PTIJ2
PTIJ1
PTIJ0
W
0x026A
DDRJ
R
DDRJ7
RDRJ7
PERJ7
PPSJ7
PIEJ7
DDRJ6
RDRJ6
PERJ6
PPSJ6
PIEJ6
DDRJ5
RDRJ5
PERJ5
PPSJ5
PIEJ5
DDRJ4
RDRJ4
PERJ4
PPSJ4
PIEJ4
DDRJ2
RDRJ2
PERJ2
PPSJ2
PIEJ2
DDRJ1
RDRJ1
PERJ1
PPSJ1
PIEJ1
DDRJ0
RDRJ0
PERJ0
PPSJ0
PIEJ0
W
0x026B
RDRJ
R
W
0x026C
PERJ
R
W
0x026D
PPSJ
R
W
0x026E
PIEJ
R
W
0x026F
PIFJ
R
PPSJ7
0
PPSJ6
0
PPSJ5
0
PPSJ4
0
PPSJ2
0
PPSJ1
0
PPSJ0
0
W
0x0270
R
Reserved
W
= Unimplemented or Reserved
Figure 4-2. PIM Register Summary (Sheet 5 of 6)
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
195
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
Register
Bit 7
PT1AD07
0
6
PT1AD06
0
5
PT1AD05
0
4
PT1AD04
0
3
PT1AD03
0
2
PT1AD02
0
1
PT1AD01
0
Bit 0
PT1AD00
0
Name
0x0271
R
PT1AD0
W
0x0272
R
Reserved
W
0x0273
Name
R
DDR1AD07 DDR1AD06 DDR1AD05 DDR1AD04 DDR1AD03 DDR1AD02 DDR1AD01 DDR1AD00
W
0x0274
R
0
0
0
0
0
0
0
0
Reserved
W
0x0275
RDR1AD0
R
RDR1AD07 RDR1AD06 RDR1AD05 RDR1AD04 RDR1AD03 RDR1AD02 RDR1AD01 RDR1AD00
W
0x0276
R
0
0
0
0
0
0
0
0
Reserved
W
0x0277
PER1AD0
R
PER1AD07 PER1AD06 PER1AD05 PER1AD04 PER1AD03 PER1AD02 PER1AD01 PER1AD00
PT0AD123 PT0AD122 PT0AD121 PT0AD120 PT0AD119 PT0AD118 PT0AD117 PT0AD116
W
0x0278
PT0AD1
R
W
0x0279
PT1AD1
R
PT1AD115 PT1AD114 PT1AD113 PT1AD112 PT1AD111 PT1AD110
PT1AD19
PT1AD18
W
0x027A
DDR0AD1
R
DDR0AD123 DDR0AD122 DDR0AD121 DDR0AD120 DDR0AD119 DDR0AD118 DDR0AD117 DDR0AD116
DDR1AD115 DDR1AD114 DDR1AD113 DDR1AD112 DDR1AD111 DDR1AD110 DDR1AD19 DDR1AD18
RDR0AD123 RDR0AD122 RDR0AD121 RDR0AD120 RDR0AD119 RDR0AD118 RDR0AD117 RDR0AD116
RDR1AD115 RDR1AD114 RDR1AD113 RDR1AD112 RDR1AD111 RDR1AD110 RDR1AD19 RDR1AD18
PER0AD123 PER0AD122 PER0AD121 PER0AD120 PER0AD119 PER0AD118 PER0AD117 PER0AD116
PER1AD115 PER1AD114 PER1AD113 PER1AD112 PER1AD111 PER1AD110 PER1AD19 PER1AD18
W
0x027B
DDR1AD1
R
W
0x027C
RDR0AD1
R
W
0x027D
RDR1AD1
R
W
0x027E
PER0AD1
R
W
0x027F
PER1AD1
R
W
= Unimplemented or Reserved
Figure 4-2. PIM Register Summary (Sheet 6 of 6)
MC9S12XDP512 Data Sheet, Rev. 2.11
196
Freescale Semiconductor
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.1
Port A Data Register (PORTA)
0x0000 (PRR)
7
6
5
4
3
2
1
0
R
PA7
PA6
PA5
PA4
PA3
PA2
PA1
PA0
W
Alt. ADDR15
ADDR14
mux
ADDR13
mux
ADDR12
mux
ADDR11
mux
ADDR10
mux
ADDR9
mux
ADDR8
mux
Function
mux
IVD15
IVD14
IVD13
IVD12
IVD11
IVD10
IVD9
IVD8
Reset
0
0
0
0
0
0
0
0
Figure 4-3. Port A Data Register (PORTA)
Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other
modes the data source is depending on the data direction value.
Write: Anytime. In emulation modes, write operations will also be directed to the external bus.
Table 4-4. PORTA Field Descriptions
Field
Description
7–0
PA[7:0]
Port A — Port A pins 7–0 are associated with address outputs ADDR15 through ADDR8 respectively in
expanded modes. When this port is not used for external addresses, these pins can be used as general purpose
I/O. If the data direction bits of the associated I/O pins are set to logic level “1”, a read returns the value of the
port register, otherwise the buffered pin input state is read.
4.3.2.2
Port B Data Register (PORTB)
0x0001 (PRR)
7
6
5
4
3
2
1
0
R
W
PB7
PB6
PB5
PB4
PB3
PB2
PB1
PB0
Alt.
Function
ADDR0
mux
IVD0
or
ADDR7
mux
IVD7
ADDR6
mux
IVD6
ADDR5
mux
IVD5
ADDR4
mux
IVD4
ADDR3
mux
IVD3
ADDR2
mux
IVD2
ADDR1
mux
IVD1
UDS
Reset
0
0
0
0
0
0
0
0
Figure 4-4. Port B Data Register (PORTB)
Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other
modes the data source is depending on the data direction value.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
197
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
Write: Anytime. In emulation modes, write operations will also be directed to the external bus.
Table 4-5. PORTB Field Descriptions
Field
Description
7–0
PB[7:0]
Port B — Port B pins 7–0 are associated with address outputs ADDR7 through ADDR1 respectively in expanded
modes. Pin 0 is associated with output ADDR0 in emulation modes and special test mode and with Upper Data
Select (UDS) in normal expanded mode. When this port is not used for external addresses, these pins can be
used as general purpose I/O. If the data direction bits of the associated I/O pins are set to logic level “1”, a read
returns the value of the port register, otherwise the buffered pin input state is read.
MC9S12XDP512 Data Sheet, Rev. 2.11
198
Freescale Semiconductor
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.3
Port A Data Direction Register (DDRA)
0x0002 (PRR)
7
6
5
4
3
2
1
0
R
DDRA7
0
DDRA6
DDRA5
DDRA4
DDRA3
DDRA2
DDRA1
DDRA0
W
Reset
0
0
0
0
0
0
0
Figure 4-5. Port A Data Direction Register (DDRA)
Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other
modes the data are read from this register.
Write: Anytime. In emulation modes, write operations will also be directed to the external bus.
Table 4-6. DDRA Field Descriptions
Field
Description
7–0
Data Direction Port A — This register controls the data direction for port A. When Port A is operating as a general
DDRA[7:0] purpose I/O port, DDRA determines whether each pin is an input or output. A logic level “1” causes the
associated port pin to be an output and a logic level “0” causes the associated pin to be a high-impedance input.
0 Associated pin is configured as input.
1 Associated pin is configured as output.
Note: Due to internal synchronization circuits, it can take up to 2 bus clock cycles until the correct value is read
on PORTA after changing the DDRA register.
4.3.2.4
Port B Data Direction Register (DDRB)
0x0003 (PRR)
7
6
5
4
3
2
1
0
R
DDRB7
0
DDRB6
DDRB5
DDRB4
DDRB3
DDRB2
DDRB1
DDRB0
W
Reset
0
0
0
0
0
0
0
Figure 4-6. Port B Data Direction Register (DDRB)
Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other
modes the data are read from this register.
Write: Anytime. In emulation modes, write operations will also be directed to the external bus.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
199
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
Table 4-7. DDRB Field Descriptions
Field
Description
7–0
Data Direction Port B — This register controls the data direction for port B. When Port B is operating as a general
DDRB[7:0] purpose I/O port, DDRB determines whether each pin is an input or output. A logic level “1” causes the
associated port pin to be an output and a logic level “0” causes the associated pin to be a high-impedance input.
0 Associated pin is configured as input.
1 Associated pin is configured as output.
Note: Due to internal synchronization circuits, it can take up to 2 bus clock cycles until the correct value is read
on PORTB after changing the DDRB register.
MC9S12XDP512 Data Sheet, Rev. 2.11
200
Freescale Semiconductor
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.5
Port C Data Register (PORTC)
0x0004 (PRR)
7
6
5
4
3
2
1
0
R
PC7
PC6
PC5
PC4
PC3
PC2
PC1
PC0
W
Exp.:
DATA15
0
DATA14
0
DATA13
0
DATA12
0
DATA11
0
DATA10
0
DATA9
0
DATA8
0
Reset
Figure 4-7. Port C Data Register (PORTC)
Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other
modes the data source is depending on the data direction value.
Write: Anytime. In emulation modes, write operations will also be directed to the external bus.
Table 4-8. PORTC Field Descriptions
Field
Description
7–0
PC[7:0]
Port C — Port C pins 7–0 are associated with data I/O lines DATA15 through DATA8 respectively in expanded
modes. When this port is not used for external data, these pins can be used as general purpose I/O. If the data
direction bits of the associated I/O pins are set to logic level “1”, a read returns the value of the port register,
otherwise the buffered pin input state is read.
4.3.2.6
Port D Data Register (PORTD)
0x0005 (PRR)
7
6
5
4
3
2
1
0
R
PD7
PD6
PD5
PD4
PD3
PD2
PD1
PD0
W
Exp.:
DATA7
0
DATA6
0
DATA5
0
DATA4
0
DATA3
0
DATA2
0
DATA1
0
DATA0
0
Reset
Figure 4-8. Port D Data Register (PORTD)
Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other
modes the data source is depending on the data direction value.
Write: Anytime. In emulation modes, write operations will also be directed to the external bus.
Table 4-9. PORTD Field Descriptions
Field
Description
7–0
PD[7:0]
Port D — Port D pins 7–0 are associated with data I/O lines DATA7 through DATA0 respectively in expanded
modes. When this port is not used for external data, these pins can be used as general purpose I/O. — If the
data direction bits of the associated I/O pins are set to logic level “1”, a read returns the value of the port register,
otherwise the buffered pin input state is read.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
201
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.7
Port C Data Direction Register (DDRC)
0x0006 (PRR)
7
6
5
4
3
2
1
0
R
DDRC7
0
DDRC6
DDRC5
DDRC4
DDRC3
DDRC2
DDRC1
DDRC0
W
Reset
0
0
0
0
0
0
0
Figure 4-9. Port C Data Direction Register (DDRC)
Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other
modes the data are read from this register.
Write: Anytime. In emulation modes, write operations will also be directed to the external bus.
Table 4-10. DDRC Field Descriptions
Field
Description
7–0
Data Direction Port C — This register controls the data direction for port C. When Port C is operating as a general
DDRC[7:0] purpose I/O port, DDRC determines whether each pin is an input or output. A logic level “1” causes the
associated port pin to be an output and a logic level “0” causes the associated pin to be a high-impedance input.
0 Associated pin is configured as input.
1 Associated pin is configured as output.
Note: Due to internal synchronization circuits, it can take up to 2 bus clock cycles until the correct value is read
on PORTC after changing the DDRC register.
4.3.2.8
Port D Data Direction Register (DDRD)
0x0007 (PRR)
7
6
5
4
3
2
1
0
R
DDRD7
0
DDRD6
DDRD5
DDRD4
DDRD3
DDRD2
DDRD1
DDRD0
W
Reset
0
0
0
0
0
0
0
Figure 4-10. Port D Data Direction Register (DDRD)
Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other
modes the data are read from this register.
Write: Anytime. In emulation modes, write operations will also be directed to the external bus.
MC9S12XDP512 Data Sheet, Rev. 2.11
202
Freescale Semiconductor
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
Table 4-11. DDRD Field Descriptions
Field
Description
7–0
Data Direction Port D — This register controls the data direction for port D. When Port D is operating as a general
DDRD[7:0] purpose I/O port, DDRD determines whether each pin is an input or output. A logic level “1” causes the
associated port pin to be an output and a logic level “0” causes the associated pin to be a high-impedance input.
0 Associated pin is configured as input.
1 Associated pin is configured as output.
Note: Due to internal synchronization circuits, it can take up to 2 bus clock cycles until the correct value is read
on PORTD after changing the DDRD register.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
203
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.9
Port E Data Register (PORTE)
0x0008 (PRR)
7
6
5
4
3
2
1
0
R
PE1
PE0
PE7
PE6
PE5
PE4
PE3
PE2
W
MODA
or
RE
or
TAGLO
EROMCTL
or
LSTRB
or
XCLKS
or
ECLKX2
MODB
or
TAGHI
R/W
or
WE
Alt.
Func.
ECLK
0
IRQ
XIRQ
LDS
1
1
Reset
0
0
0
0
0
—
—
= Unimplemented or Reserved
Figure 4-11. Port E Data Register (PORTE)
1
These registers are reset to zero. Two bus clock cycles after reset release the register values are updated with the associated
pin values.
Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other
modes the data source is depending on the data direction value.
Write: Anytime. In emulation modes, write operations will also be directed to the external bus.
Table 4-12. PORTE Field Descriptions
Field
Description
7–0
PE[7:0]
Port E — Port E bits 7–0 are associated with external bus control signals and interrupt inputs. These include
mode select (MODB, MODA), E clock, double frequency E clock, Instruction Tagging High and Low (TAGHI,
TAGLO), Read/Write (R/W), Read Enable and Write Enable (RE, WE), Lower Data Select (LDS), IRQ, and XIRQ.
When not used for any of these specific functions, Port E pins 7–2 can be used as general purpose I/O and
pins 1–0 can be used as general purpose inputs.
If the data direction bits of the associated I/O pins are set to logic level “1”, a read returns the value of the port
register, otherwise the buffered pin input state is read.
Pins 6 and 5 are inputs with enabled pull-down devices while RESET pin is low.
Pins 7 and 3 are inputs with enabled pull-up devices while RESET pin is low.
MC9S12XDP512 Data Sheet, Rev. 2.11
204
Freescale Semiconductor
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.10 Port E Data Direction Register (DDRE)
0x0009 (PRR)
7
6
5
4
3
2
1
0
R
W
0
0
DDRE7
DDRE6
DDRE5
DDRE4
DDRE3
DDRE2
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 4-12. Port E Data Direction Register (DDRE)
Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other
modes the data are read from this register.
Write: Anytime. In emulation modes, write operations will also be directed to the external bus.
Table 4-13. DDRE Field Descriptions
Field
Description
7–0
Data Direction Port E — his register controls the data direction for port E. When Port E is operating as a general
DDRE[7:2] purpose I/O port, DDRE determines whether each pin is an input or output. A logic level “1” causes the
associated port pin to be an output and a logic level “0” causes the associated pin to be a high-impedance input.
Port E bit 1 (associated with IRQ) and bit 0 (associated with XIRQ) cannot be configured as outputs. Port E, bits
1 and 0, can be read regardless of whether the alternate interrupt function is enabled.
0 Associated pin is configured as input.
1 Associated pin is configured as output.
Note: Due to internal synchronization circuits, it can take up to 2 bus clock cycles until the correct value is read
on PORTE after changing the DDRE register.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
205
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.11 S12X_EBI Ports, BKGD, VREGEN Pin Pull-up Control Register (PUCR)
0x000C (PRR)
7
6
5
4
3
2
1
0
R
W
0
PUPKE
BKPUE
PUPEE
PUPDE
PUPCE
PUPBE
PUPAE
Reset
1
1
0
1
0
0
0
0
= Unimplemented or Reserved
Figure 4-13. S12X_EBI Ports, BKGD, VREGEN Pin Pull-up Control Register (PUCR)
Read: Anytime in single-chip modes.
Write: Anytime, except BKPUE which is writable in special test mode only.
This register is used to enable pull-up devices for the associated ports A, B, C, D, E, and K. Pull-up devices
are assigned on a per-port basis and apply to any pin in the corresponding port that is currently configured
as an input.
Table 4-14. PUCR Field Descriptions
Field
Description
7
Pull-up Port K Enable
PUPKE
0 Port K pull-up devices are disabled.
1 Enable pull-up devices for Port K input pins.
6
BKGD and VREGEN Pin Pull-up Enable
BKPUE
0 BKGD and V
pull-up devices are disabled.
REGEN
1 Enable pull-up devices on BKGD and V
pins.
REGEN
4
Pull-up Port E Enable
PUPEE
0 Port E pull-up devices on bit 7, 4–0 are disabled.
1 Enable pull-up devices for Port E input pins bits 7, 4–0.
Note: Bits 5 and 6 of Port E have pull-down devices which are only enabled during reset. This bit has no effect
on these pins.
3
Pull-up Port D Enable
PUPDE
0 Port D pull-up devices are disabled.
1 Enable pull-up devices for all Port D input pins.
2
Pull-up Port C Enable
PUPCE
0 Port C pull-up devices are disabled.
1 Enable pull-up devices for all Port C input pins.
1
Pull-up Port B Enable
PUPBE
0 Port B pull-up devices are disabled.
1 Enable pull-up devices for all Port B input pins.
0
Pull-up Port A Enable
PUPAE
0 Port A pull-up devices are disabled.
1 Enable pull-up devices for all Port A input pins.
MC9S12XDP512 Data Sheet, Rev. 2.11
206
Freescale Semiconductor
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.12 S12X_EBI Ports Reduced Drive Register (RDRIV)
0x000D (PRR)
7
6
5
4
3
2
1
0
R
0
0
RDPK
0
RDPE
RDPD
RDPC
RDPB
RDPA
W
Reset
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 4-14. S12X_EBI Ports Reduced Drive Register (RDRIV)
Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other
modes the data are read from this register.
Write: Anytime. In emulation modes, write operations will also be directed to the external bus.
This register is used to select reduced drive for the pins associated with the S12X_EBI ports A, B, C, D,
E, and K. If enabled, the pins drive at about 1/6 of the full drive strength. The reduced drive function is
independent of which function is being used on a particular pin.
The reduced drive functionality does not take effect on the pins in emulation modes.
Table 4-15. RDRIV Field Descriptions
Field
Description
7
Reduced Drive of Port K
RDPK
0 All port K output pins have full drive enabled.
1 All port K output pins have reduced drive enabled.
4
Reduced Drive of Port E
RDPE
0 All port E output pins have full drive enabled.
1 All port E output pins have reduced drive enabled.
3
Reduced Drive of Port D
RDPD
0 All port D output pins have full drive enabled.
1 All port D output pins have reduced drive enabled.
2
Reduced Drive of Port C
RDPC
0 All port C output pins have full drive enabled.
1 All port C output pins have reduced drive enabled.
1
Reduced Drive of Port B
RDPB
0 All port B output pins have full drive enabled.
1 All port B output pins have reduced drive enabled.
0
Reduced Drive of Ports A
RDPA
0 All Port A output pins have full drive enabled.
1 All port A output pins have reduced drive enabled.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
207
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.13 ECLK Control Register (ECLKCTL)
0x001C (PRR)
7
6
5
4
3
2
1
0
R
0
0
0
0
NECLK
NCLKX2
EDIV1
EDIV0
W
1
Reset
Mode
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Mode
Dependent
SS
ES
ST
EX
NS
NX
Special
Single-Chip
0
1
0
0
1
0
Emulation
Single-Chip
Special
Test
Emulation
Expanded
Normal
Single-Chip
Normal
Expanded
= Unimplemented or Reserved
Figure 4-15. ECLK Control Register (ECLKCTL)
1
Reset values in emulation modes are identical to those of the target mode.
Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other
modes the data are read from this register.
Write: Anytime. In emulation modes, write operations will also be directed to the external bus.
The ECLKCTL register is used to control the availability of the free-running clocks and the free-running
clock divider.
Table 4-16. ECLKCTL Field Descriptions
Field
Description
7
No ECLK — This bit controls the availability of a free-running clock on the ECLK pin. Clock output is always
NECLK
active in emulation modes and if enabled in all other operating modes.
0 ECLK enabled
1 ECLK disabled
MC9S12XDP512 Data Sheet, Rev. 2.11
208
Freescale Semiconductor
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
Table 4-16. ECLKCTL Field Descriptions (continued)
Field
Description
6
No ECLKX2 — This bit controls the availability of a free-running clock on the ECLKX2 pin. This clock has a fixed
NCLKX2
rate of twice the internal bus clock. Clock output is always active in emulation modes and if enabled in all other
operating modes.
0 ECLKX2 is enabled
1 ECLKX2 is disabled
1–0
Free-Running ECLK Divider — These bits determine the rate of the free-running clock on the ECLK pin. The
EDIV[1:0] usage of the bits is shown in Table 4-17. Divider is always disabled in emulation modes and active as
programmed in all other operating modes.
Table 4-17. Free-Running ECLK Clock Rate
EDIV[1:0]
Rate of Free-Running ECLK
ECLK = Bus clock rate
00
01
10
11
ECLK = Bus clock rate divided by 2
ECLK = Bus clock rate divided by 3
ECLK = Bus clock rate divided by 4
4.3.2.14 IRQ Control Register (IRQCR)
0x001E
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
IRQE
IRQEN
Reset
0
1
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 4-16. IRQ Control Register (IRQCR)
Read: See individual bit descriptions below.
Write: See individual bit descriptions below.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
209
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
Table 4-18. IRQCR Field Descriptions
Field
Description
7
IRQ Select Edge Sensitive Only
IRQE
Special modes: Read or write anytime.
Normal and emulation modes: Read anytime, write once.
0 IRQ configured for low level recognition.
1 IRQ configured to respond only to falling edges. Falling edges on the IRQ pin will be detected anytime
IRQE = 1 and will be cleared only upon a reset or the servicing of the IRQ interrupt.
6
External IRQ Enable
IRQEN
Read or write anytime.
0 External IRQ pin is disconnected from interrupt logic.
1 External IRQ pin is connected to interrupt logic.
MC9S12XDP512 Data Sheet, Rev. 2.11
210
Freescale Semiconductor
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.15 Port K Data Register (PORTK)
0x0032 (PRR)
7
6
5
4
3
2
1
0
R
PK7
PK6
PK5
PK4
PK3
PK2
PK1
PK0
W
ROMCTL
or
EWAIT
ADDR22
mux
NOACC
ADDR19
mux
IQSTAT3
ADDR18
mux
IQSTAT2
ADDR17
mux
IQSTAT1
ADDR16
mux
IQSTAT0
Alt.
Func.
ADDR21
0
ADDR20
0
Reset
0
0
0
0
0
0
Figure 4-17. Port K Data Register (PORTK)
Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other
modes the data source is depending on the data direction value.
Write: Anytime. In emulation modes, write operations will also be directed to the external bus.
Table 4-19. PORTK Field Descriptions
Field
Description
7–0
PK[7:0]
Port K — Port K pins 7–0 are associated with external bus control signals and internal memory expansion
emulation pins. These include ADDR22-ADDR16, No-Access (NOACC), External Wait (EWAIT) and instruction
pipe signals IQSTAT3-IQSTAT0. Bits 6-0 carry the external addresses in all expanded modes. In emulation or
special test mode with internal visibility enabled the address is multiplexed with the alternate functions NOACC
and IQSTAT on the respective pins. In single-chip modes the port pins can be used as general-purpose I/O. If
the data direction bits of the associated I/O pins are set to logic level “1”, a read returns the value of the port
register, otherwise the buffered pin input state is read.
4.3.2.16 Port K Data Direction Register (DDRK)
0x0033 (PRR)
7
6
5
4
3
2
1
0
R
W
DDRK7
DDRK6
DDRK5
DDRK4
DDRK3
DDRK2
DDRK1
DDRK0
Reset
0
0
0
0
0
0
0
0
Figure 4-18. Port K Data Direction Register (DDRK)
Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other
modes the data are read from this register.
Write: Anytime. In emulation modes, write operations will also be directed to the external bus.
This register controls the data direction for port K. When Port K is operating as a general purpose I/O port,
DDRK determines whether each pin is an input or output. A logic level “1” causes the associated port pin
to be an output and a logic level “0” causes the associated pin to be a high-impedance input.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
211
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
Table 4-20. DDRK Field Descriptions
Field
Description
7–0
Data Direction Port K
DDRK[7:0] 0 Associated pin is configured as input.
1 Associated pin is configured as output.
Note: Due to internal synchronization circuits, it can take up to 2 bus clock cycles until the correct value is read
on PORTK after changing the DDRK register.
MC9S12XDP512 Data Sheet, Rev. 2.11
212
Freescale Semiconductor
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.17 Port T Data Register (PTT)
0x0240
7
6
5
4
3
2
1
0
R
W
PTT7
PTT6
PTT5
PTT4
PTT3
PTT2
PTT1
PTT0
ECT
Reset
IOC7
0
IOC6
0
IOC5
0
IOC4
0
IOC3
0
IOC2
0
IOC1
0
IOC0
0
Figure 4-19. Port T Data Register (PTT)
Read: Anytime.
Write: Anytime.
Table 4-21. PTT Field Descriptions
Description
Field
7–0
Port T — Port T bits 7–0 are associated with ECT channels IOC7–IOC0 (refer to ECT section). When not used
PTT[7:0]
with the ECT, these pins can be used as general purpose I/O.
If the data direction bits of the associated I/O pins are set to logic level “1”, a read returns the value of the port
register, otherwise the buffered pin input state is read.
4.3.2.18 Port T Input Register (PTIT)
0x0241
7
6
5
4
3
2
1
0
R
PTIT7
PTIT6
PTIT5
PTIT4
PTIT3
PTIT2
PTIT1
PTIT0
W
1
Reset
—
—
—
—
—
—
—
—
= Unimplemented or Reserved
Figure 4-20. Port T Input Register (PTIT)
1
These registers are reset to zero. Two bus clock cycles after reset release the register values are updated with the associated
pin values.
Read: Anytime.
Write: Never, writes to this register have no effect.
Table 4-22. PTIT Field Descriptions
Field
Description
7–0
Port T Input — This register always reads back the buffered state of the associated pins. This can also be used
PTIT[7:0] to detect overload or short circuit conditions on output pins.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
213
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.19 Port T Data Direction Register (DDRT)
0x0242
7
6
5
4
3
2
1
0
R
W
DDRT7
DDRT6
DDRT5
DDRT4
DDRT3
DDRT2
DDRT1
DDRT0
Reset
0
0
0
0
0
0
0
0
Figure 4-21. Port T Data Direction Register (DDRT)
Read: Anytime.
Write: Anytime.
This register configures each port T pin as either input or output.
The ECT forces the I/O state to be an output for each timer port associated with an enabled output compare.
In this case the data direction bits will not change.
The DDRT bits revert to controlling the I/O direction of a pin when the associated timer output compare
is disabled.
The timer input capture always monitors the state of the pin.
Table 4-23. DDRT Field Descriptions
Field
Description
7–0
Data Direction Port T
DDRT[7:0] 0 Associated pin is configured as input.
1 Associated pin is configured as output.
Note: Due to internal synchronization circuits, it can take up to 2 bus clock cycles until the correct value is read
on PTT or PTIT registers, when changing the DDRT register.
MC9S12XDP512 Data Sheet, Rev. 2.11
214
Freescale Semiconductor
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.20 Port T Reduced Drive Register (RDRT)
0x0243
7
6
5
4
3
2
1
0
R
W
RDRT7
RDRT6
RDRT5
RDRT4
RDRT3
RDRT2
RDRT1
RDRT0
Reset
0
0
0
0
0
0
0
0
Figure 4-22. Port T Reduced Drive Register (RDRT)
Read: Anytime.
Write: Anytime.
This register configures the drive strength of each port T output pin as either full or reduced. If the port is
used as input this bit is ignored.
Table 4-24. RDRT Field Descriptions
Field
Description
7–0
Reduced Drive Port T
RDRT[7:0] 0 Full drive strength at output.
1 Associated pin drives at about 1/6 of the full drive strength.
4.3.2.21 Port T Pull Device Enable Register (PERT)
0x0244
7
6
5
4
3
2
1
0
R
W
PERT7
PERT6
PERT5
PERT4
PERT3
PERT2
PERT1
PERT0
Reset
0
0
0
0
0
0
0
0
Figure 4-23. Port T Pull Device Enable Register (PERT)
Read: Anytime.
Write: Anytime.
This register configures whether a pull-up or a pull-down device is activated, if the port is used as input.
This bit has no effect if the port is used as output. Out of reset no pull device is enabled.
Table 4-25. PERT Field Descriptions
Field
Description
7–0
Pull Device Enable Port T
PERT[7:0] 0 Pull-up or pull-down device is disabled.
1 Either a pull-up or pull-down device is enabled.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
215
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.22 Port T Polarity Select Register (PPST)
0x0245
7
6
5
4
3
2
1
0
R
W
PPST7
PPST6
PPST5
PPST4
PPST3
PPST2
PPST1
PPST0
Reset
0
0
0
0
0
0
0
0
Figure 4-24. Port T Polarity Select Register (PPST)
Read: Anytime.
Write: Anytime.
This register selects whether a pull-down or a pull-up device is connected to the pin.
Table 4-26. PPST Field Descriptions
Field
Description
7–0
Pull Select Port T
PPST[7:0] 0 A pull-up device is connected to the associated port T pin, if enabled by the associated bit in register PERT
and if the port is used as input.
1 A pull-down device is connected to the associated port T pin, if enabled by the associated bit in register PERT
and if the port is used as input.
4.3.2.23 Port S Data Register (PTS)
0x0248
7
6
5
4
3
2
1
0
R
W
PTS7
PTS6
PTS5
PTS4
PTS3
PTS2
PTS1
PTS0
SCI/SPI
Reset
SS0
0
SCK0
0
MOSI0
0
MISO0
0
TXD1
0
RXD1
0
TXD0
0
RXD0
0
Figure 4-25. Port S Data Register (PTS)
Read: Anytime.
Write: Anytime.
Port S pins 7–4 are associated with the SPI0. The SPI0 pin configuration is determined by several status
bits in the SPI0 module. Refer to SPI section for details. When not used with the SPI0, these pins can be
used as general purpose I/O.
Port S bits 3–0 are associated with the SCI1 and SCI0. The SCI ports associated with transmit pins 3 and
1 are configured as outputs if the transmitter is enabled. The SCI ports associated with receive pins 2 and
0 are configured as inputs if the receiver is enabled. Refer to SCI section for details. When not used with
the SCI, these pins can be used as general purpose I/O.
MC9S12XDP512 Data Sheet, Rev. 2.11
216
Freescale Semiconductor
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
If the data direction bits of the associated I/O pins are set to logic level “1”, a read returns the value of the
port register, otherwise the buffered pin input state is read.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
217
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.24 Port S Input Register (PTIS)
0x0249
7
6
5
4
3
2
1
0
R
PTIS7
PTIS6
PTIS5
PTIS4
PTIS3
PTIS2
PTIS1
PTIS0
W
1
Reset
—
—
—
—
—
—
—
—
= Unimplemented or Reserved
Figure 4-26. Port S Input Register (PTIS)
1
These registers are reset to zero. Two bus clock cycles after reset release the register values are updated with the associated
pin values.
Read: Anytime.
Write: Never, writes to this register have no effect.
This register always reads back the buffered state of the associated pins. This also can be used to detect
overload or short circuit conditions on output pins.
MC9S12XDP512 Data Sheet, Rev. 2.11
218
Freescale Semiconductor
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.25 Port S Data Direction Register (DDRS)
0x024A
7
6
5
4
3
2
1
0
R
W
DDRS7
DDRS6
DDRS5
DDRS4
DDRS3
DDRS2
DDRS1
DDRS0
Reset
0
0
0
0
0
0
0
0
Figure 4-27. Port S Data Direction Register (DDRS)
Read: Anytime.
Write: Anytime.
This register configures each port S pin as either input or output.
If SPI0 is enabled, the SPI0 determines the pin direction. Refer to SPI section for details.
If the associated SCI transmit or receive channel is enabled this register has no effect on the pins. The pin
is forced to be an output if a SCI transmit channel is enabled, it is forced to be an input if the SCI receive
channel is enabled.
The DDRS bits revert to controlling the I/O direction of a pin when the associated channel is disabled.
Table 4-27. DDRS Field Descriptions
Field
Description
7–0
Data Direction Port S
DDRS[7:0] 0 Associated pin is configured as input.
1 Associated pin is configured as output.
Note: Due to internal synchronization circuits, it can take up to 2 bus clock cycles until the correct value is read
on PTS or PTIS registers, when changing the DDRS register.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
219
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.26 Port S Reduced Drive Register (RDRS)
0x024B
7
6
5
4
3
2
1
0
R
W
RDRS7
RDRS6
RDRS5
RDRS4
RDRS3
RDRS2
RDRS1
RDRS0
Reset
0
0
0
0
0
0
0
0
Figure 4-28. Port S Reduced Drive Register (RDRS)
Read: Anytime.
Write: Anytime.
This register configures the drive strength of each port S output pin as either full or reduced. If the port is
used as input this bit is ignored.
Table 4-28. RDRS Field Descriptions
Field
Description
7–0
Reduced Drive Port S
RDRS[7:0] 0 Full drive strength at output.
1 Associated pin drives at about 1/6 of the full drive strength.
4.3.2.27 Port S Pull Device Enable Register (PERS)
0x024C
7
6
5
4
3
2
1
0
R
W
PERS7
PERS6
PERS5
PERS4
PERS3
PERS2
PERS1
PERS0
Reset
1
1
1
1
1
1
1
1
Figure 4-29. Port S Pull Device Enable Register (PERS)
Read: Anytime.
Write: Anytime.
This register configures whether a pull-up or a pull-down device is activated, if the port is used as input or
as output in wired-OR (open drain) mode. This bit has no effect if the port is used as push-pull output. Out
of reset a pull-up device is enabled.
Table 4-29. PERS Field Descriptions
Field
Description
7–0
Pull Device Enable Port S
PERS[7:0] 0 Pull-up or pull-down device is disabled.
1 Either a pull-up or pull-down device is enabled.
MC9S12XDP512 Data Sheet, Rev. 2.11
220
Freescale Semiconductor
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.28 Port S Polarity Select Register (PPSS)
0x024D
7
6
5
4
3
2
1
0
R
W
PPSS7
PPSS6
PPSS5
PPSS4
PPSS3
PPSS2
PPSS1
PPSS0
Reset
0
0
0
0
0
0
0
0
Figure 4-30. Port S Polarity Select Register (PPSS)
Read: Anytime.
Write: Anytime.
This register selects whether a pull-down or a pull-up device is connected to the pin.
Table 4-30. PPSS Field Descriptions
Field
Description
7–0
Pull Select Port S
PPSS[7:0] 0 A pull-up device is connected to the associated port S pin, if enabled by the associated bit in register PERS
and if the port is used as input or as wired-OR output.
1 A pull-down device is connected to the associated port S pin, if enabled by the associated bit in register PERS
and if the port is used as input.
4.3.2.29 Port S Wired-OR Mode Register (WOMS)
0x024E
7
6
5
4
3
2
1
0
R
W
WOMS7
WOMS6
WOMS5
WOMS4
WOMS3
WOMS2
WOMS1
WOMS0
Reset
0
0
0
0
0
0
0
0
Figure 4-31. Port S Wired-OR Mode Register (WOMS)
Read: Anytime.
Write: Anytime.
This register configures the output pins as wired-OR. If enabled the output is driven active low only
(open-drain). A logic level of “1” is not driven. It applies also to the SPI and SCI outputs and allows a
multipoint connection of several serial modules. These bits have no influence on pins used as inputs.
Table 4-31. WOMS Field Descriptions
Field
Description
7–0
Wired-OR Mode Port S
WOMS[7:0] 0 Output buffers operate as push-pull outputs.
1 Output buffers operate as open-drain outputs.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
221
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.30 Port M Data Register (PTM)
0x0250
7
6
5
4
3
2
1
0
R
PTM7
PTM6
PTM5
PTM4
PTM3
PTM2
PTM1
PTM0
W
CAN TXCAN3
RXCAN3
RXCAN4
0
TXCAN2
TXCAN0
RXCAN2
RXCAN0
TXCAN1
TXCAN0
RXCAN1
RXCAN0
TXCAN0
RXCAN0
Routed
CAN0
Routed
CAN4
TXCAN4
TXCAN4
RXCAN4
Routed
SPIO
SCK0
0
MOSI0
0
SS0
0
MISO0
0
Reset
0
0
0
Figure 4-32. Port M Data Register (PTM)
Read: Anytime.
Write: Anytime.
Port M pins 75–0 are associated with the CAN0, CAN1, CAN2, CAN3, SCI3, as well as the routed CAN0,
CAN4, and SPI0 modules. When not used with any of the peripherals, these pins can be used as general
purpose I/O.
If the data direction bits of the associated I/O pins are set to logic level “1”, a read returns the value of the
port register, otherwise the buffered pin input state is read.
Table 4-32. PTM Field Descriptions
Field
Description
7–6
PTM[7:6]
The CAN3 function (TXCAN3 and RXCAN3) takes precedence over the CAN4, SCI3 and the general purpose
I/O function if the CAN3 module is enabled. Refer to MSCAN section for details.
The CAN4 function (TXCAN4 and RXCAN4) takes precedence over the SCI3 and the general purpose I/O
function if the CAN4 module is enabled. Refer to MSCAN section for details.
The SCI3 function (TXD3 and RXD3) takes precedence over the general purpose I/O function if the SCI3 module
is enabled. Refer to SCI section for details.
5–4
PTM[5:4]
The CAN2 function (TXCAN2 and RXCAN2) takes precedence over the routed CAN0, routed CAN4, the routed
SPI0 and the general purpose I/O function if the CAN2 module is enabled{pim_9xd_prio.m}.
The routed CAN0 function (TXCAN0 and RXCAN0) takes precedence over the routed CAN4, the routed SPI0
and the general purpose I/O function if the routed CAN0 module is enabled.
The routed CAN4 function (TXCAN4 and RXCAN4) takes precedence over the routed SPI0 and general purpose
I/O function if the routed CAN4 module is enabled. Refer to MSCAN section for details.
The routed SPI0 function (SCK0 and MOSI0) takes precedence of the general purpose I/O function if the routed
SPI0 is enabled. Refer to SPI section for details.
MC9S12XDP512 Data Sheet, Rev. 2.11
222
Freescale Semiconductor
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
Table 4-32. PTM Field Descriptions (continued)
Field
Description
3–2
PTM[3:2]
The CAN1 function (TXCAN1 and RXCAN1) takes precedence over the routed CAN0, the routed SPI0 and the
general purpose I/O function if the CAN1 module is enabled.
The routed CAN0 function (TXCAN0 and RXCAN0) takes precedence over the routed SPI0 and the general
purpose I/O function if the routed CAN0 module is enabled. Refer to MSCAN section for details.
The routed SPI0 function (SS0 and MISO0) takes precedence of the general purpose I/O function if the routed
SPI0 is enabled and not in bidirectional mode. Refer to SPI section for details.
1–0
The CAN0 function (TXCAN0 and RXCAN0) takes precedence over the general purpose I/O function if the CAN0
PTM[1:0]
module is enabled. Refer to MSCAN section for details.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
223
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.31 Port M Input Register (PTIM)
0x0251
7
6
5
4
3
2
1
0
R
PTIM7
PTIM6
PTIM5
PTIM4
PTIM3
PTIM2
PTIM1
PTIM0
W
1
Reset
—
—
—
—
—
—
—
—
= Unimplemented or Reserved
Figure 4-33. Port M Input Register (PTIM)
1
These registers are reset to zero. Two bus clock cycles after reset release the register values are updated with the associated
pin values.
Read: Anytime.
Write: Never, writes to this register have no effect.
This register always reads back the buffered state of the associated pins. This can also be used to detect
overload or short circuit conditions on output pins.
MC9S12XDP512 Data Sheet, Rev. 2.11
224
Freescale Semiconductor
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.32 Port M Data Direction Register (DDRM)
0x0252
7
6
5
4
3
2
1
0
R
W
DDRM7
DDRM6
DDRM5
DDRM4
DDRM3
DDRM2
DDRM1
DDRM0
Reset
0
0
0
0
0
0
0
0
Figure 4-34. Port M Data Direction Register (DDRM)
Read: Anytime.
Write: Anytime.
This register configures each port M pin as either input or output.
The CAN/SCI3 forces the I/O state to be an output for each port line associated with an enabled output
(TXCAN[3:0], TXD3). TheyAlso forces the I/O state to be an input for each port line associated with an
enabled input (RXCAN[3:0], RXD3). In those cases the data direction bits will not change.
The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is
disabled.
Table 4-33. DDRM Field Descriptions
Field
Description
7–0
Data Direction Port M
DDRM[7:0] 0 Associated pin is configured as input.
1 Associated pin is configured as output.
Note: Due to internal synchronization circuits, it can take up to 2 bus clock cycles until the correct value is read
on PTM or PTIM registers, when changing the DDRM register.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
225
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.33 Port M Reduced Drive Register (RDRM)
0x0253
7
6
5
4
3
2
1
0
R
W
RDRM7
RDRM6
RDRM5
RDRM4
RDRM3
RDRM2
RDRM1
RDRM0
Reset
0
0
0
0
0
0
0
0
Figure 4-35. Port M Reduced Drive Register (RDRM)
Read: Anytime.
Write: Anytime.
This register configures the drive strength of each Port M output pin as either full or reduced. If the port
is used as input this bit is ignored.
Table 4-34. RDRM Field Descriptions
Field
Description
7–0
Reduced Drive Port M
RDRM[7:0] 0 Full drive strength at output.
1 Associated pin drives at about 1/6 of the full drive strength.
4.3.2.34 Port M Pull Device Enable Register (PERM)
0x0254
7
6
5
4
3
2
1
0
R
W
PERM7
PERM6
PERM5
PERM4
PERM3
PERM2
PERM1
PERM0
Reset
0
0
0
0
0
0
0
0
Figure 4-36. Port M Pull Device Enable Register (PERM)
Read: Anytime.
Write: Anytime.
This register configures whether a pull-up or a pull-down device is activated, if the port is used as input or
wired-OR output. This bit has no effect if the port is used as push-pull output. Out of reset no pull device
is enabled.
Table 4-35. PERM Field Descriptions
Field
Description
7–0
Pull Device Enable Port M
PERM[7:0] 0 Pull-up or pull-down device is disabled.
1 Either a pull-up or pull-down device is enabled.
MC9S12XDP512 Data Sheet, Rev. 2.11
226
Freescale Semiconductor
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.35 Port M Polarity Select Register (PPSM)
0x0255
7
6
5
4
3
2
1
0
R
W
PPSM7
PPSM6
PPSM5
PPSM4
PPSM3
PPSM2
PPSM1
PPSM0
Reset
0
0
0
0
0
0
0
0
Figure 4-37. Port M Polarity Select Register (PPSM)
Read: Anytime.
Write: Anytime.
This register selects whether a pull-down or a pull-up device is connected to the pin. If CAN is active a
pull-up device can be activated on the RXCAN[3:0] inputs, but not a pull-down.
Table 4-36. PPSM Field Descriptions
Field
Description
7–0
Pull Select Port M
PPSM[7:0] 0 A pull-up device is connected to the associated port M pin, if enabled by the associated bit in register PERM
and if the port is used as general purpose or RXCAN input.
1 A pull-down device is connected to the associated port M pin, if enabled by the associated bit in register PERM
and if the port is used as a general purpose but not as RXCAN.
4.3.2.36 Port M Wired-OR Mode Register (WOMM)
0x0256
7
6
5
4
3
2
1
0
R
W
WOMM7
WOMM6
WOMM5
WOMM4
WOMM3
WOMM2
WOMM1
WOMM0
Reset
0
0
0
0
0
0
0
0
Figure 4-38. Port M Wired-OR Mode Register (WOMM)
Read: Anytime.
Write: Anytime.
This register configures the output pins as wired-OR. If enabled the output is driven active low only
(open-drain). A logic level of “1” is not driven. It applies also to the CAN outputs and allows a multipoint
connection of several serial modules. This bit has no influence on pins used as inputs.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
227
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
Table 4-37. WOMM Field Descriptions
Field
Description
7–0
Wired-OR Mode Port M
WOMM[7:0] 0 Output buffers operate as push-pull outputs.
1 Output buffers operate as open-drain outputs.
MC9S12XDP512 Data Sheet, Rev. 2.11
228
Freescale Semiconductor
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.37 Module Routing Register (MODRR)
0x0257
7
6
5
4
3
2
1
0
R
W
0
MODRR6
MODRR5
MODRR4
MODRR3
MODRR2
MODRR1
MODRR0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 4-39. Module Routing Register (MODRR)
Read: Anytime.
Write: Anytime.
This register configures the re-routing of CAN0, CAN4, SPI0, SPI1, and SPI2 on alternative ports.
Table 4-38. Module Routing Summary
MODRR
3
Related Pins
Module
CAN0
6
5
4
2
1
0
RXCAN
TXCAN
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
0
0
1
1
x
x
x
x
0
1
0
1
0
0
1
1
x
x
x
x
0
1
0
1
x
x
x
x
PM0
PM2
PM4
PJ6
PM1
PM3
PM5
PJ7
PJ6
PJ7
PM4
PM6
PM5
PM7
CAN4
Reserved
MISO
MOSI
SCK
SS
x
x
x
x
0
1
x
x
0
1
x
x
0
1
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
PS4
PM2
PP0
PH0
PP4
PH4
PS5
PM4
PP1
PH1
PP5
PH5
PS6
PM5
PP2
PH2
PP7
PH6
PS7
PM3
PP3
PH3
PP6
PH7
SPI0
SPI1
SPI2
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
229
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.38 Port P Data Register (PTP)
0x0258
7
6
5
4
3
2
1
0
R
W
PTP7
PTP6
PTP5
PTP4
PTP3
PTP2
PTP1
PTP0
PWM
SPI
PWM7
SCK2
0
PWM6
SS2
0
PWM5
MOSI2
0
PWM4
MISO2
0
PWM3
SS1
0
PWM2
SCK1
0
PWM1
MOSI1
0
PWM0
MISO1
0
Reset
Figure 4-40. Port P Data Register (PTP)
Read: Anytime.
Write: Anytime.
Port P pins 7, and 5–0 are associated with the PWM as well as the SPI1 and SPI2 modules. These pins can
be used as general purpose I/O when not used with any of the peripherals.
If the data direction bits of the associated I/O pins are set to logic level “1”, a read returns the value of the
port register, otherwise the buffered pin input state is read.
The PWM function takes precedence over the general purpose I/O and the SPI2 or SPI1 function if the
associated PWM channel is enabled. While channels 6 and 5-0 are output only if the respective channel is
enabled, channel 7 can be PWM output or input if the shutdown feature is enabled. Refer to PWM section
for details.
The SPI2 function takes precedence over the general purpose I/O function if enabled. Refer to SPI section
for details.
The SPI1 function takes precedence over the general purpose I/O function if enabled. Refer to SPI section
for details.
MC9S12XDP512 Data Sheet, Rev. 2.11
230
Freescale Semiconductor
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.39 Port P Input Register (PTIP)
0x0259
7
6
5
4
3
2
1
0
R
PTIP7
PTIP6
PTIP5
PTIP4
PTIP3
PTIP2
PTIP1
PTIP0
W
1
Reset
—
—
—
—
—
—
—
—
= Unimplemented or Reserved
Figure 4-41. Port P Input Register (PTIP)
1
These registers are reset to zero. Two bus clock cycles after reset release the register values are updated with the associated
pin values.
Read: Anytime.
Write: Never, writes to this register have no effect.
This register always reads back the buffered state of the associated pins. This can also be used to detect
overload or short circuit conditions on output pins.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
231
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.40 Port P Data Direction Register (DDRP)
0x025A
7
6
5
4
3
2
1
0
R
W
DDRP7
DDRP6
DDRP5
DDRP4
DDRP3
DDRP2
DDRP1
DDRP0
Reset
0
0
0
0
0
0
0
0
Figure 4-42. Port P Data Direction Register (DDRP)
Read: Anytime.
Write: Anytime.
This register configures each port P pin as either input or output.
If the associated PWM channel or SPI module is enabled this register has no effect on the pins.
The PWM forces the I/O state to be an output for each port line associated with an enabled PWM7–0
channel. Channel 7 can force the pin to input if the shutdown feature is enabled. Refer to PWM section for
details.
If a SPI module is enabled, the SPI determines the pin direction. Refer to SPI section for details.
The DDRP bits revert to controlling the I/O direction of a pin when the associated peripherals are disabled.
Table 4-39. DDRP Field Descriptions
Field
Description
7–0
Data Direction Port P
DDRP[7:0] 0 Associated pin is configured as input.
1 Associated pin is configured as output.
Note: Due to internal synchronization circuits, it can take up to 2 bus clock cycles until the correct value is read
on PTP or PTIP registers, when changing the DDRP register.
MC9S12XDP512 Data Sheet, Rev. 2.11
232
Freescale Semiconductor
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.41 Port P Reduced Drive Register (RDRP)
0x025B
7
6
5
4
3
2
1
0
R
W
RDRP7
RDRP6
RDRP5
RDRP4
RDRP3
RDRP2
RDRP1
RDRP0
Reset
0
0
0
0
0
0
0
0
Figure 4-43. Port P Reduced Drive Register (RDRP)
Read: Anytime.
Write: Anytime.
This register configures the drive strength of each port P output pin as either full or reduced. If the port is
used as input this bit is ignored.
Table 4-40. RDRP Field Descriptions
Field
Description
7–0
Reduced Drive Port P
RDRP[7:0] 0 Full drive strength at output.
1 Associated pin drives at about 1/6 of the full drive strength.
4.3.2.42 Port P Pull Device Enable Register (PERP)
0x025C
7
6
5
4
3
2
1
0
R
W
PERP7
PERP6
PERP5
PERP4
PERP3
PERP2
PERP1
PERP0
Reset
0
0
0
0
0
0
0
0
Figure 4-44. Port P Pull Device Enable Register (PERP)
Read: Anytime.
Write: Anytime.
This register configures whether a pull-up or a pull-down device is activated, if the port is used as input.
This bit has no effect if the port is used as output. Out of reset no pull device is enabled.
Table 4-41. PERP Field Descriptions
Field
Description
7–0
Pull Device Enable Port P
PERP[7:0] 0 Pull-up or pull-down device is disabled.
1 Either a pull-up or pull-down device is enabled.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
233
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.43 Port P Polarity Select Register (PPSP)
0x025D
7
6
5
4
3
2
1
0
R
W
PPSP7
PPSP6
PPSP5
PPSP4
PPSP3
PPSP2
PPSP1
PPSP0
Reset
0
0
0
0
0
0
0
0
Figure 4-45. Port P Polarity Select Register (PPSP)
Read: Anytime.
Write: Anytime.
This register serves a dual purpose by selecting the polarity of the active interrupt edge as well as selecting
a pull-up or pull-down device if enabled.
Table 4-42. PPSP Field Descriptions
Field
Description
7–0
Polarity Select Port P
PPSP[7:0] 0 Falling edge on the associated port P pin sets the associated flag bit in the PIFP register.A pull-up device is
connected to the associated port P pin, if enabled by the associated bit in register PERP and if the port is used
as input.
1 Rising edge on the associated port P pin sets the associated flag bit in the PIFP register.A pull-down device
is connected to the associated port P pin, if enabled by the associated bit in register PERP and if the port is
used as input.
4.3.2.44 Port P Interrupt Enable Register (PIEP)
0x025E
7
6
5
4
3
2
1
0
R
W
PIEP7
PIEP6
PIEP5
PIEP4
PIEP3
PIEP2
PIEP1
PIEP0
Reset
0
0
0
0
0
0
0
0
Figure 4-46. Port P Interrupt Enable Register (PIEP)
Read: Anytime.
Write: Anytime.
This register disables or enables on a per-pin basis the edge sensitive external interrupt associated with
Port P.
MC9S12XDP512 Data Sheet, Rev. 2.11
234
Freescale Semiconductor
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
Table 4-43. PIEP Field Descriptions
Field
Description
7–0
Interrupt Enable Port P
PIEP[7:0] 0 Interrupt is disabled (interrupt flag masked).
1 Interrupt is enabled.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
235
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.45 Port P Interrupt Flag Register (PIFP)
0x025F
7
6
5
4
3
2
1
0
R
W
PIFP7
PIFP6
PIFP5
PIFP4
PIFP3
PIFP2
PIFP1
PIFP0
Reset
0
0
0
0
0
0
0
0
Figure 4-47. Port P Interrupt Flag Register (PIFP)
Read: Anytime.
Write: Anytime.
Each flag is set by an active edge on the associated input pin. This could be a rising or a falling edge based
on the state of the PPSP register. To clear this flag, write logic level “1” to the corresponding bit in the
PIFP register. Writing a “0” has no effect.
Table 4-44. PIFP Field Descriptions
Field
Description
7–0
Interrupt Flags Port P
PIFP[7:0] 0 No active edge pending. Writing a “0” has no effect.
1 Active edge on the associated bit has occurred (an interrupt will occur if the associated enable bit is set).
Writing a logic level “1” clears the associated flag.
MC9S12XDP512 Data Sheet, Rev. 2.11
236
Freescale Semiconductor
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.46 Port H Data Register (PTH)
0x0260
7
6
5
4
3
2
1
0
R
PTH7
PTH6
PTH5
PTH4
PTH3
PTH2
PTH1
PTH0
W
Routed
SPI
SS2
0
SCK2
0
MOSI2
0
MISO2
0
SS1
0
SCK1
0
MOSI1
0
MISO1
0
Reset
Figure 4-48. Port H Data Register (PTH)
Read: Anytime.
Write: Anytime.
Port H pins 7–0 are associated with the SCI4 and SCI5 as well as the routed SPI1 and SPI2 modules.
These pins can be used as general purpose I/O when not used with any of the peripherals.
If the data direction bits of the associated I/O pins are set to logic level “1”, a read returns the value of the
port register, otherwise the buffered pin input state is read.
The routed SPI2 function takes precedence over the SCI4 and SCI5 and the general purpose I/O function
if the routed SPI2 module is enabled. Refer to SPI section for details.
The routed SPI1 function takes precedence over the general purpose I/O function if the routed SPI1 is
enabled. Refer to SPI section for details.
The SCI4 and SCI5 function takes precedence over the general purpose I/O function if the SCI4 or SCI5
is enabled. Refer to SCI section for details.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
237
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.47 Port H Input Register (PTIH)
0x0261
7
6
5
4
3
2
1
0
R
PTIH7
PTIH6
PTIH5
PTIH4
PTIH3
PTIH2
PTIH1
PTIH0
W
1
Reset
—
—
—
—
—
—
—
—
= Unimplemented or Reserved
Figure 4-49. Port H Input Register (PTIH)
1
These registers are reset to zero. Two bus clock cycles after reset release the register values are updated with the associated
pin values.
Read: Anytime.
Write: Never, writes to this register have no effect.
This register always reads back the buffered state of the associated pins. This can also be used to detect
overload or short circuit conditions on output pins.
MC9S12XDP512 Data Sheet, Rev. 2.11
238
Freescale Semiconductor
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.48 Port H Data Direction Register (DDRH)
0x0262
7
6
5
4
3
2
1
0
R
W
DDRH7
DDRH6
DDRH5
DDRH4
DDRH3
DDRH2
DDRH1
DDRH0
Reset
0
0
0
0
0
0
0
0
Figure 4-50. Port H Data Direction Register (DDRH)
Read: Anytime.
Write: Anytime.
This register configures each port H pin as either input or output.
If the associated SCI channel or routed SPI module is enabled this register has no effect on the pins.
The SCI forces the I/O state to be an output for each port line associated with an enabled output (TXD5,
TXD4). It also forces the I/O state to be an input for each port line associated with an enabled input (RXD5,
RXD4). In those cases the data direction bits will not change.
If a SPI module is enabled, the SPI determines the pin direction. Refer to SPI section for details.
The DDRH bits revert to controlling the I/O direction of a pin when the associated peripheral modules are
disabled.
Table 4-45. DDRH Field Descriptions
Field
Description
7–0
Data Direction Port H
DDRH[7:0] 0 Associated pin is configured as input.
1 Associated pin is configured as output.
Note: Due to internal synchronization circuits, it can take up to 2 bus clock cycles until the correct value is read
on PTH or PTIH registers, when changing the DDRH register.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
239
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.49 Port H Reduced Drive Register (RDRH)
0x0263
7
6
5
4
3
2
1
0
R
W
RDRH7
RDRH6
RDRH5
RDRH4
RDRH3
RDRH2
RDRH1
RDRH0
Reset
0
0
0
0
0
0
0
0
Figure 4-51. Port H Reduced Drive Register (RDRH)
Read: Anytime.
Write: Anytime.
This register configures the drive strength of each Port H output pin as either full or reduced. If the port is
used as input this bit is ignored.
Table 4-46. RDRH Field Descriptions
Field
Description
7–0
Reduced Drive Port H
RDRH[7:0] 0 Full drive strength at output.
1 Associated pin drives at about 1/6 of the full drive strength.
4.3.2.50 Port H Pull Device Enable Register (PERH)
0x0264
7
6
5
4
3
2
1
0
R
W
PERH7
PERH6
PERH5
PERH4
PERH3
PERH2
PERH1
PERH0
Reset
0
0
0
0
0
0
0
0
Figure 4-52. Port H Pull Device Enable Register (PERH)
Read: Anytime.
Write: Anytime.
This register configures whether a pull-up or a pull-down device is activated, if the port is used as input.
This bit has no effect if the port is used as output. Out of reset no pull device is enabled.
Table 4-47. PERH Field Descriptions
Field
Description
7–0
Pull Device Enable Port H
PERH[7:0] 0 Pull-up or pull-down device is disabled.
1 Either a pull-up or pull-down device is enabled.
MC9S12XDP512 Data Sheet, Rev. 2.11
240
Freescale Semiconductor
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.51 Port H Polarity Select Register (PPSH)
0x0265
7
6
5
4
3
2
1
0
R
W
PPSH7
PPSH6
PPSH5
PPSH4
PPSH3
PPSH2
PPSH1
PPSH0
Reset
0
0
0
0
0
0
0
0
Figure 4-53. Port H Polarity Select Register (PPSH)
Read: Anytime.
Write: Anytime.
This register serves a dual purpose by selecting the polarity of the active interrupt edge as well as selecting
a pull-up or pull-down device if enabled.
Table 4-48. PPSH Field Descriptions
Field
Description
7–0
Polarity Select Port H
PPSH[7:0] 0 Falling edge on the associated port H pin sets the associated flag bit in the PIFH register.
A pull-up device is connected to the associated port H pin, if enabled by the associated bit in register PERH
and if the port is used as input.
1 Rising edge on the associated port H pin sets the associated flag bit in the PIFH register.
A pull-down device is connected to the associated port H pin, if enabled by the associated bit in register PERH
and if the port is used as input.
4.3.2.52 Port H Interrupt Enable Register (PIEH)
0x0266
7
6
5
4
3
2
1
0
R
W
PIEH7
PIEH6
PIEH5
PIEH4
PIEH3
PIEH2
PIEH1
PIEH0
Reset
0
0
0
0
0
0
0
0
Figure 4-54. Port H Interrupt Enable Register (PIEH)
Read: Anytime.
Write: Anytime.
This register disables or enables on a per-pin basis the edge sensitive external interrupt associated with
Port H.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
241
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
Table 4-49. PIEH Field Descriptions
Field
Description
7–0
Interrupt Enable Port H
PIEH[7:0] 0 Interrupt is disabled (interrupt flag masked).
1 Interrupt is enabled.
MC9S12XDP512 Data Sheet, Rev. 2.11
242
Freescale Semiconductor
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.53 Port H Interrupt Flag Register (PIFH)
0x0267
7
6
5
4
3
2
1
0
R
W
PIFH7
PIFH6
PIFH5
PIFH4
PIFH3
PIFH2
PIFH1
PIFH0
Reset
0
0
0
0
0
0
0
0
Figure 4-55. Port H Interrupt Flag Register (PIFH)
Read: Anytime.
Write: Anytime.
Each flag is set by an active edge on the associated input pin. This could be a rising or a falling edge based
on the state of the PPSH register. To clear this flag, write logic level “1” to the corresponding bit in the
PIFH register. Writing a “0” has no effect.
Table 4-50. PIFH Field Descriptions
Field
Description
7–0
Interrupt Flags Port H
PIFH[7:0] 0 No active edge pending. Writing a “0” has no effect.
1 Active edge on the associated bit has occurred (an interrupt will occur if the associated enable bit is set).
Writing a logic level “1” clears the associated flag.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
243
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.54 Port J Data Register (PTJ)
0x0268
7
6
5
4
3
2
1
0
R
0
PTJ7
PTJ6
PTJ5
PTJ4
PTJ2
PTJ1
PTJ0
W
CAN4/
SCI2
TXCAN4
SCL0
RXCAN4
SDA0
TXD2
RXD2
IICO
IIC1
SCL1
SDA1
Routed
CAN0
TXCAN0
RXCAN0
Alt.
Function
CS2
0
CS0
0
CS1
0
CS3
0
Reset
0
0
0
0
= Unimplemented or Reserved
Figure 4-56. Port J Data Register (PTJ)
Read: Anytime.
Write: Anytime.
Port J pins 7–4 and 2–0 are associated with the CAN4, SCI2, IIC0 and IIC1, the routed CAN0 modules
and chip select signals (CS0, CS1, CS2, CS3). These pins can be used as general purpose I/O when not
used with any of the peripherals.
If the data direction bits of the associated I/O pins are set to logic level “1”, a read returns the value of the
port register, otherwise the buffered pin input state is read.
Table 4-51. PTJ Field Descriptions
Field
Description
7–6
PJ[7:0]
The CAN4 function (TXCAN4 and RXCAN4) takes precedence over the IIC0, the routed CAN0 and the general
purpose I/O function if the CAN4 module is enabled.
The IIC0 function (SCL0 and SDA0) takes precedence over the routed CAN0 and the general purpose I/O
function if the IIC0 is enabled. If the IIC0 module takes precedence the SDA0 and SCL0 outputs are configured
as open drain outputs. Refer to IIC section for details.
The routed CAN0 function (TXCAN0 and RXCAN0) takes precedence over the general purpose I/O function if
the routed CAN0 module is enabled. Refer to MSCAN section for details.
5-4
PJ[5:4]
The IIC1 function (SCL1 and SDA1) takes precedence over the chip select (CS0, CS2) and general purpose I/O
function if the IIC1 is enabled. The chip selects (CS0, CS2) take precedence over the general purpose I/O. If the
IIC1 module takes precedence the SDA1 and SCL1 outputs are configured as open drain outputs. Refer to IIC
section for details.
2
The chip select function (CS1) takes precedence over the general purpose I/O.
PJ2
MC9S12XDP512 Data Sheet, Rev. 2.11
244
Freescale Semiconductor
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
Table 4-51. PTJ Field Descriptions (continued)
Field
Description
1
The SCI2 function takes precedence over the general purpose I/O function if the SCI2 module is enabled. Refer
PJ1
to SCI section for details.
0
PJ0
The SCI2 function takes precedence over the chip select (CS3) and the general purpose I/O function if the SCI2
module is enabled. The chip select (CS3) takes precedence over the general purpose I/O function. Refer to SCI
section for details.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
245
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.55 Port J Input Register (PTIJ)
0x0269
7
6
5
4
3
2
1
0
R
PTIJ7
PTIJ6
PTIJ5
PTIJ4
0
PTIJ2
PTIJ1
PTIJ0
W
1
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 4-57. Port J Input Register (PTIJ)
1
These registers are reset to zero. Two bus clock cycles after reset release the register values are updated with the associated
pin values.
Read: Anytime.
Write: Never, writes to this register have no effect.
This register always reads back the buffered state of the associated pins. This can be used to detect
overload or short circuit conditions on output pins.
MC9S12XDP512 Data Sheet, Rev. 2.11
246
Freescale Semiconductor
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.56 Port J Data Direction Register (DDRJ)
0x026A
7
6
5
4
3
2
1
0
R
W
0
DDRJ7
DDRJ6
DDRJ5
DDRJ4
DDRJ2
DDRJ1
DDRJ0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 4-58. Port J Data Direction Register (DDRJ)
Read: Anytime.
Write: Anytime.
This register configures each port J pin as either input or output.
The CAN forces the I/O state to be an output on PJ7 (TXCAN4) and an input on pin PJ6 (RXCAN4). The
IIC takes control of the I/O if enabled. In these cases the data direction bits will not change.
The SCI2 forces the I/O state to be an output for each port line associated with an enabled output (TXD2).
It also forces the I/O state to be an input for each port line associated with an enabled input (RXD2). In
these cases the data direction bits will not change.
The DDRJ bits revert to controlling the I/O direction of a pin when the associated peripheral module is
disabled.
Table 4-52. DDRJ Field Descriptions
Field
Description
7–0
Data Direction Port J
DDRJ[7:4] 0 Associated pin is configured as input.
DDRJ[2:0] 1 Associated pin is configured as output.
Note: Due to internal synchronization circuits, it can take up to 2 bus clock cycles until the correct value is read
on PTJ or PTIJ registers, when changing the DDRJ register.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
247
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.57 Port J Reduced Drive Register (RDRJ)
0x026B
7
6
5
4
3
2
1
0
R
W
0
RDRJ7
RDRJ6
RDRJ5
RDRJ4
RDRJ2
RDRJ1
RDRJ0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 4-59. Port J Reduced Drive Register (RDRJ)
Read: Anytime.
Write: Anytime.
This register configures the drive strength of each port J output pin as either full or reduced. If the port is
used as input this bit is ignored.
Table 4-53. RDRJ Field Descriptions
Field
Description
7–0
Reduced Drive Port J
RDRJ[7:4] 0 Full drive strength at output.
RDRJ[2:0] 1 Associated pin drives at about 1/6 of the full drive strength.
4.3.2.58 Port J Pull Device Enable Register (PERJ)
0x026C
7
6
5
4
3
2
1
0
R
W
0
PERJ7
PERJ6
PERJ5
PERJ4
PERJ2
PERJ1
PERJ0
Reset
1
1
1
1
0
1
1
1
= Unimplemented or Reserved
Figure 4-60. Port J Pull Device Enable Register (PERJ)
Read: Anytime.
Write: Anytime.
This register configures whether a pull-up or a pull-down device is activated, if the port is used as input or
as wired-OR output. This bit has no effect if the port is used as push-pull output. Out of reset a pull-up
device is enabled.
MC9S12XDP512 Data Sheet, Rev. 2.11
248
Freescale Semiconductor
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
Table 4-54. PERJ Field Descriptions
Field
Description
7–0
Pull Device Enable Port J
PERJ[7:4] 0 Pull-up or pull-down device is disabled.
PERJ[2:0] 1 Either a pull-up or pull-down device is enabled.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
249
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.59 Port J Polarity Select Register (PPSJ)
0x026D
7
6
5
4
3
2
1
0
R
W
0
PPSJ7
PPSJ6
PPSJ5
PPSJ4
PPSJ2
PPSJ1
PPSJ0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 4-61. Port J Polarity Select Register (PPSJ)
Read: Anytime.
Write: Anytime.
This register serves a dual purpose by selecting the polarity of the active interrupt edge as well as selecting
a pull-up or pull-down device if enabled.
Table 4-55. PPSJ Field Descriptions
Field
Description
7–0
Polarity Select Port J
PPSJ[7:4]
PPSJ[2:0]
0
Falling edge on the associated port J pin sets the associated flag bit in the PIFJ register.
A pull-up device is connected to the associated port J pin, if enabled by the associated bit in register PERJ
and if the port is used as general purpose input or as IIC port.
1
Rising edge on the associated port J pin sets the associated flag bit in the PIFJ register.
A pull-down device is connected to the associated port J pin, if enabled by the associated bit in register PERJ
and if the port is used as input.
4.3.2.60 Port J Interrupt Enable Register (PIEJ)
0x026E
7
6
5
4
3
2
1
0
R
W
0
PIEJ7
PIEJ6
PIEJ5
PIEJ4
PIEJ2
PIEJ1
PIEJ0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 4-62. Port J Interrupt Enable Register (PIEJ)
This register disables or enables on a per-pin basis the edge sensitive external interrupt associated with
Port J.
MC9S12XDP512 Data Sheet, Rev. 2.11
250
Freescale Semiconductor
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
Table 4-56. PIEJ Field Descriptions
Field
Description
7–0
Interrupt Enable Port J
PIEJ[7:4]
PIEJ[2:0]
0 Interrupt is disabled (interrupt flag masked).
1 Interrupt is enabled.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
251
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.61 Port J Interrupt Flag Register (PIFJ)
0x026F
7
6
5
4
3
2
1
0
R
W
0
PIFJ7
PIFJ6
PIFJ5
PIFJ4
PIFJ2
PIFJ1
PIFJ0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 4-63. Port J Interrupt Flag Register (PIFJ)
Read: Anytime.
Write: Anytime.
Each flag is set by an active edge on the associated input pin. This could be a rising or a falling edge based
on the state of the PPSJ register. To clear this flag, write logic level “1” to the corresponding bit in the PIFJ
register. Writing a “0” has no effect.
Table 4-57. PIEJ Field Descriptions
Field
Description
7–0
Interrupt Flags Port J
PIFJ[7:4]
PIFJ[2:0]
0 No active edge pending. Writing a “0” has no effect.
1 Active edge on the associated bit has occurred (an interrupt will occur if the associated enable bit is set).
Writing a logic level “1” clears the associated flag.
4.3.2.62 Port AD0 Data Register 1 (PT1AD0)
0x0271
7
6
5
4
3
2
1
0
R
W
PT1AD07
PT1AD06
PT1AD05
PT1AD04
PT1AD03
PT1AD02
PT1AD01
PT1AD00
Reset
0
0
0
0
0
0
0
0
Figure 4-64. Port AD0 Data Register 1 (PT1AD0)
Read: Anytime.
Write: Anytime.
This register is associated with AD0 pins PAD[23:10]. These pins can also be used as general purpose I/O.
If the data direction bits of the associated I/O pins are set to 1, a read returns the value of the port register,
otherwise the value at the pins is read.
MC9S12XDP512 Data Sheet, Rev. 2.11
252
Freescale Semiconductor
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.63 Port AD0 Data Direction Register 1 (DDR1AD0)
0x0273
7
6
5
4
3
2
1
0
R
DDR1AD07 DDR1AD06 DDR1AD05 DDR1AD04 DDR1AD03 DDR1AD02 DDR1AD01 DDR1AD00
W
Reset
0
0
0
0
0
0
0
0
Figure 4-65. Port AD0 Data Direction Register 1 (DDR1AD0)
Read: Anytime.
Write: Anytime.
This register configures pins PAD[07:00] as either input or output.
Table 4-58. DDR1AD0 Field Descriptions
Field
Description
7–0
Data Direction Port AD0 Register 1
DDR1AD0[7:0] 0 Associated pin is configured as input.
1 Associated pin is configured as output.
Note: Due to internal synchronization circuits, it can take up to 2 bus clock cycles until the correct value is
read on PTAD01 register, when changing the DDR1AD0 register.
Note: To use the digital input function on port AD0 the ATD0 digital input enable register (ATD0DIEN) has to
be set to logic level “1”.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
253
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.64 Port AD0 Reduced Drive Register 1 (RDR1AD0)
0x0275
7
6
5
4
3
2
1
0
R
W
RDR1AD07 RDR1AD06 RDR1AD05 RDR1AD04 RDR1AD03 RDR1AD02 RDR1AD01 RDR1AD00
Reset
0
0
0
0
0
0
0
0
Figure 4-66. Port AD0 Reduced Drive Register 1 (RDR1AD0)
Read: Anytime.
Write: Anytime.
This register configures the drive strength of each output pin PAD[07:00] as either full or reduced. If the
port is used as input this bit is ignored.
Table 4-59. RDR1AD0 Field Descriptions
Field
Description
7–0
Reduced Drive Port AD0 Register 1
RDR1AD0[7:0] 0 Full drive strength at output.
1 Associated pin drives at about 1/6 of the full drive strength.
4.3.2.65 Port AD0 Pull Up Enable Register 1 (PER1AD0)
0x0277
7
6
5
4
3
2
1
0
R
W
PER1AD07 PER1AD06 PER1AD05 PER1AD04 PER1AD03 PER1AD02 PER1AD01 PER1AD00
Reset
0
0
0
0
0
0
0
0
Figure 4-67. Port AD0 Pull Up Enable Register 1 (PER1AD0)
Read: Anytime.
Write: Anytime.
This register activates a pull-up device on the respective pin PAD[07:00] if the port is used as input. This
bit has no effect if the port is used as output. Out of reset no pull device is enabled.
Table 4-60. PER1AD0 Field Descriptions
Field
Description
7–0
Pull Device Enable Port AD0 Register 1
PER1AD0[7:0] 0 Pull-up device is disabled.
1 Pull-up device is enabled.
MC9S12XDP512 Data Sheet, Rev. 2.11
254
Freescale Semiconductor
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.66 Port AD1 Data Register 0 (PT0AD1)
0x0278
7
6
5
4
3
2
1
0
R
W
PT0AD123
PT0AD122
PT0AD121
PT0AD120
PT0AD119
PT0AD118
PT0AD117
PT0AD116
Reset
0
0
0
0
0
0
0
0
Figure 4-68. Port AD1 Data Register 0 (PT0AD1)
Read: Anytime.
Write: Anytime.
This register is associated with AD1 pins PAD[23:16]. These pins can also be used as general purpose I/O.
If the data direction bits of the associated I/O pins are set to 1, a read returns the value of the port register,
otherwise the value at the pins is read.
4.3.2.67 Port AD1 Data Register 1 (PT1AD1)
0x0279
7
6
5
4
3
2
1
0
R
W
PT1AD115
PT1AD114
PT1AD113
PT1AD112
PT1AD111
PT1AD110
PT1AD19
PT1AD18
Reset
0
0
0
0
0
0
0
0
Figure 4-69. Port AD1 Data Register 1 (PT1AD1)
Read: Anytime.
Write: Anytime.
This register is associated with AD1 pins PAD[15:08]. These pins can also be used as general purpose I/O.
If the data direction bits of the associated I/O pins are set to 1, a read returns the value of the port register,
otherwise the value at the pins is read.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
255
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.68 Port AD1 Data Direction Register 0 (DDR0AD1)
0x027A
7
6
5
4
3
2
1
0
R
W
DDR0AD123 DDR0AD122 DDR0AD121 DDR0AD120 DDR0AD119 DDR0AD118 DDR0AD117 DDR0AD116
Reset
0
0
0
0
0
0
0
0
Figure 4-70. Port AD1 Data Direction Register 0 (DDR0AD1)
Read: Anytime.
Write: Anytime.
This register configures pin PAD[23:16] as either input or output.
Table 4-61. DDR0AD1 Field Descriptions
Field
Description
7–0
Data Direction Port AD1 Register 0
DDR0AD1[23:16] 0 Associated pin is configured as input.
1 Associated pin is configured as output.
Note: Due to internal synchronization circuits, it can take up to 2 bus clock cycles until the correct value is
read on PTAD10 register, when changing the DDR0AD1 register.
Note: To use the digital input function on Port AD1 the ATD1 digital input enable register (ATD1DIEN0) has
to be set to logic level “1”.
MC9S12XDP512 Data Sheet, Rev. 2.11
256
Freescale Semiconductor
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.69 Port AD1 Data Direction Register 1 (DDR1AD1)
0x027B
7
6
5
4
3
2
1
0
R
DDR1AD115 DDR1AD114 DDR1AD113 DDR1AD112 DDR1AD111 DDR1AD110 DDR1AD19 DDR1AD18
W
Reset
0
0
0
0
0
0
0
0
Figure 4-71. Port AD1 Data Direction Register 1 (DDR1AD1)
Read: Anytime.
Write: Anytime.
This register configures pins PAD[15:08] as either input or output.
Table 4-62. DDR1AD1 Field Descriptions
Field
Description
7–0
Data Direction Port AD1 Register 1
DDR1AD1[15:8] 0 Associated pin is configured as input.
1 Associated pin is configured as output.
Note: Due to internal synchronization circuits, it can take up to 2 bus clock cycles until the correct value is
read on PTAD11 register, when changing the DDR1AD1 register.
Note: To use the digital input function on port AD1 the ATD1 digital input enable register (ATD1DIEN1) has
to be set to logic level “1”.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
257
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.70 Port AD1 Reduced Drive Register 0 (RDR0AD1)
0x027C
7
6
5
4
3
2
1
0
R
W
RDR0AD123 RDR0AD122 RDR0AD121 RDR0AD120 RDR0AD119 RDR0AD118 RDR0AD117 RDR0AD116
Reset
0
0
0
0
0
0
0
0
Figure 4-72. Port AD1 Reduced Drive Register 0 (RDR0AD1)
Read: Anytime.
Write: Anytime.
This register configures the drive strength of each PAD[23:16] output pin as either full or reduced. If the
port is used as input this bit is ignored.
Table 4-63. RDR0AD1 Field Descriptions
Field
Description
7–0
Reduced Drive Port AD1 Register 0
RDR0AD1[23:16] 0 Full drive strength at output.
1 Associated pin drives at about 1/6 of the full drive strength.
4.3.2.71 Port AD1 Reduced Drive Register 1 (RDR1AD1)
0x027D
7
6
5
4
3
2
1
0
R
W
RDR1AD115 RDR1AD114 RDR1AD113 RDR1AD112 RDR1AD111 RDR1AD110 RDR1AD19 RDR1AD18
Reset
0
0
0
0
0
0
0
0
Figure 4-73. Port AD1 Reduced Drive Register 1 (RDR1AD1)
Read: Anytime.
Write: Anytime.
This register configures the drive strength of each PAD[15:08] output pin as either full or reduced. If the
port is used as input this bit is ignored.
Table 4-64. RDR1AD1 Field Descriptions
Field
Description
7–0
Reduced Drive Port AD1 Register 1
RDR1AD1[15:8] 0 Full drive strength at output.
1 Associated pin drives at about 1/6 of the full drive strength.
MC9S12XDP512 Data Sheet, Rev. 2.11
258
Freescale Semiconductor
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.3.2.72 Port AD1 Pull Up Enable Register 0 (PER0AD1)
0x027E
7
6
5
4
3
2
1
0
R
PER0AD123 PER0AD122 PER0AD121 PER0AD120 PER0AD119 PER0AD118 PER0AD117 PER0AD116
W
Reset
0
0
0
0
0
0
0
0
Figure 4-74. Port AD1 Pull Up Enable Register 0 (PER0AD1)
Read: Anytime.
Write: Anytime.
This register activates a pull-up device on the respective PAD[23:16] pin if the port is used as input. This
bit has no effect if the port is used as output. Out of reset no pull-up device is enabled.
Table 4-65. PER0AD1 Field Descriptions
Field
Description
7–0
Pull Device Enable Port AD1 Register 0
PER0AD1[23:16] 0 Pull-up device is disabled.
1 Pull-up device is enabled.
4.3.2.73 Port AD1 Pull Up Enable Register 1 (PER1AD1)
0x027F
7
6
5
4
3
2
1
0
R
W
PER1AD115 PER1AD114 PER1AD113 PER1AD112 PER1AD111 PER1AD110 PER1AD19 PER1AD18
Reset
0
0
0
0
0
0
0
0
Figure 4-75. Port AD1 Pull Up Enable Register 1 (PER1AD1)
Read: Anytime.
Write: Anytime.
This register activates a pull-up device on the respective PAD[15:08] pin if the port is used as input. This
bit has no effect if the port is used as output. Out of reset no pull-up device is enabled.
Table 4-66. PER1AD1 Field Descriptions
Field
Description
7–0
Pull Device Enable Port AD1 Register 1
PER1AD1[15:8] 0 Pull-up device is disabled.
1 Pull-up device is enabled.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
259
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.4
Functional Description
Each pin except PE0, PE1, and BKGD can act as general purpose I/O. In addition each pin can act as an
output from the external bus interface module or a peripheral module or an input to the external bus
interface module or a peripheral module.
A set of configuration registers is common to all ports with exceptions in the expanded bus interface and
ATD ports (Table 4-67). All registers can be written at any time; however a specific configuration might
not become active.
Example: Selecting a pull-up device
This device does not become active while the port is used as a push-pull output.
1
Table 4-67. Register Availability per Port
Data
Direction
Reduced
Drive
Pull
Enable
Polarity
Select
Wired-OR Interrupt
Interrupt
Flag
Port
Data
Input
Mode
Enable
A
B
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
—
—
yes
yes
—
—
—
—
—
—
—
—
—
yes
yes
—
—
—
—
—
—
—
—
—
C
—
—
—
—
D
—
—
—
—
E
—
—
—
—
K
—
—
—
—
T
yes
yes
yes
yes
yes
yes
—
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
—
—
—
S
yes
yes
yes
yes
yes
—
—
—
M
P
—
—
yes
yes
yes
—
yes
yes
yes
—
H
J
AD0
AD1
—
—
—
—
1
Each cell represents one register with individual configuration bits
4.4.1
Registers
4.4.1.1
Data Register
This register holds the value driven out to the pin if the pin is used as a general purpose I/O.
Writing to this register has only an effect on the pin if the pin is used as general purpose output. When
reading this address, the buffered state of the pin is returned if the associated data direction register bit is
set to “0”.
If the data direction register bits are set to logic level “1”, the contents of the data register is returned. This
is independent of any other configuration (Figure 4-76).
MC9S12XDP512 Data Sheet, Rev. 2.11
260
Freescale Semiconductor
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.4.1.2
Input Register
This is a read-only register and always returns the buffered state of the pin (Figure 4-76).
4.4.1.3
Data Direction Register
This register defines whether the pin is used as an input or an output.
If a peripheral module controls the pin the contents of the data direction register is ignored (Figure 4-76).
PTI
0
1
PIN
0
PT
1
0
DDR
1
data out
Module
output enable
module enable
Figure 4-76. Illustration of I/O Pin Functionality
4.4.1.4
Reduced Drive Register
If the pin is used as an output this register allows the configuration of the drive strength.
4.4.1.5
Pull Device Enable Register
This register turns on a pull-up or pull-down device. It becomes active only if the pin is used as an input
or as a wired-OR output.
4.4.1.6
Polarity Select Register
This register selects either a pull-up or pull-down device if enabled. It becomes active only if the pin is
used as an input. A pull-up device can be activated if the pin is used as a wired-OR output. If the pin is
used as an interrupt input this register selects the active interrupt edge.
4.4.1.7
Wired-OR Mode Register
If the pin is used as an output this register turns off the active high drive. This allows wired-OR type
connections of outputs.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
261
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.4.1.8
Interrupt Enable Register
If the pin is used as an interrupt input this register serves as a mask to the interrupt flag to enable/disable
the interrupt.
4.4.1.9
Interrupt Flag Register
If the pin is used as an interrupt input this register holds the interrupt flag after a valid pin event.
4.4.1.10 Module Routing Register
This register supports the re-routing of the CAN0, CAN4, SPI0, SPI1, and SPI2 pins to alternative ports.
This allows a software re-configuration of the pinouts of the different package options with respect to
above peripherals.
NOTE
The purpose of the module routing register is to provide maximum
flexibility for derivatives with a lower number of MSCAN and SPI modules.
Table 4-68. Module Implementations on Derivatives
MSCAN Modules
SPI Modules
SPI1
Number
of Modules
CAN0
CAN1
CAN2
CAN3
CAN4
SPI0
SPI2
5
4
3
2
1
yes
yes
yes
yes
yes
yes
yes
yes
—
yes
yes
—
yes
—
yes
yes
yes
yes
—
—
—
—
—
—
—
—
yes
yes
yes
yes
yes
—
yes
—
—
—
—
—
—
—
4.4.2
Ports
4.4.2.1
BKGD Pin
The BKGD pin is associated with the S12X_BDM and S12X_EBI modules. During reset, the BKGD pin
is used as MODC input.
4.4.2.2
Port A and B
Port A pins PA[7:0] and Port B pins PB[7:0] can be used for either general-purpose I/O, or, in 144-pin
packages, also with the external bus interface. In this case port A and port B are associated with the
external address bus outputs ADDR15–ADDR8 and ADDR7–ADDR0, respectively. PB0 is the ADDR0
or UDS output.
MC9S12XDP512 Data Sheet, Rev. 2.11
262
Freescale Semiconductor
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.4.2.3
Port C and D
Port C pins PC[7:0] and port D pins PD[7:0] can be used for either general-purpose I/O, or, in 144-pin
packages, also with the external bus interface. In this case port C and port D are associated with the
external data bus inputs/outputs DATA15–DATA8 and DATA7–DATA0, respectively.
These pins are configured for reduced input threshold in certain operating modes (refer to S12X_EBI
section).
NOTE
Port C and D are neither available in 112-pin nor in 80-pin packages.
4.4.2.4
Port E
Port E is associated with the external bus control outputs R/W, LSTRB, LDS and RE, the free-running
clock outputs ECLK and ECLK2X, as well as with the TAGHI, TAGLO, MODA and MODB and
interrupt inputs IRQ and XIRQ.
Port E pins PE[7:2] can be used for either general-purpose I/O or with the alternative functions.
Port E pin PE[7] an be used for either general-purpose I/O or as the free-running clock ECLKX2 output
running at the core clock rate. The clock output is always enabled in emulation modes.
Port E pin PE[4] an be used for either general-purpose I/O or as the free-running clock ECLK output
running at the bus clock rate or at the programmed divided clock rate. The clock output is always enabled
in emulation modes.
Port E pin PE[1] can be used for either general-purpose input or as the level- or falling edge-sensitive IRQ
interrupt input. IRQ will be enabled by setting the IRQEN configuration bit (Section 4.3.2.14, “IRQ
Control Register (IRQCR)”) and clearing the I-bit in the CPU’s condition code register. It is inhibited at
reset so this pin is initially configured as a simple input with a pull-up.
Port E pin PE[0] can be used for either general-purpose input or as the level-sensitive XIRQ interrupt
input. XIRQ can be enabled by clearing the X-bit in the CPU’s condition code register. It is inhibited at
reset so this pin is initially configured as a high-impedance input with a pull-up.
Port E pins PE[5] and PE[6] are configured for reduced input threshold in certain modes (refer to
S12X_EBI section).
4.4.2.5
Port K
Port K pins PK[7:0] can be used for either general-purpose I/O, or, in 144-pin packages, also with the
external bus interface. In this case port K pins PK[6:0] are associated with the external address bus outputs
ADDR22–ADDR16 and PK7 is associated to the EWAIT input.
Port K pin PE[7] is configured for reduced input threshold in certain modes (refer to S12X_EBI section).
NOTE
Port K is not available in 80-pin packages. PK[6] is not available in 112-pin
packages.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
263
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.4.2.6
Port T
This port is associated with the ECT module. Port T pins PT[7:0] can be used for either general-purpose
I/O, or with the channels of the enhanced capture timer.
4.4.2.7
Port S
This port is associated with SCI0, SCI1 and SPI0. Port S pins PS[7:0] can be used either for general-
The SPI0 pins can be re-routed. Refer to Section 4.3.2.37, “Module Routing Register (MODRR)”.
NOTE
PS[7:4] are not available in 80-pin packages.
4.4.2.8
Port M
This port is associated with the SCI3, CAN4–0 and SPI0. Port M pins PM[7:0] can be used for either
The CAN0, CAN4 and SPI0 pins can be re-routed. Refer to Section 4.3.2.37, “Module Routing Register
(MODRR)”.
NOTE
PM[7:6] are not available in 80-pin packages.
4.4.2.9
Port P
This port is associated with the PWM, SPI1 and SPI2. Port P pins PP[7:0] can be used for either general
purpose I/O, or with the PWM and SPI subsystems.
The pins are shared between the PWM channels and the SPI1 and SPI2 modules. If the PWM is enabled
the pins become PWM output channels with the exception of pin 7 which can be PWM input or output. If
SPI1 or SPI2 are enabled and PWM is disabled, the respective pin configuration is determined by status
bits in the SPI modules.
The SPI1 and SPI2 pins can be re-routed. Refer to Section 4.3.2.37, “Module Routing Register
(MODRR)”.
Port P offers 8 I/O pins with edge triggered interrupt capability in wired-OR fashion (Section 4.4.3, “Pin
Interrupts”).
NOTE
PP[6] is not available in 80-pin packages.
MC9S12XDP512 Data Sheet, Rev. 2.11
264
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.4.2.10 Port H
general purpose I/O, or with the SPI and SCI subsystems. Port H pins can be used with the routed SPI1
Port H offers 8 I/O pins with edge triggered interrupt capability (Section 4.4.3, “Pin Interrupts”).
NOTE
Port H is not available in 80-pin packages.
4.4.2.11 Port J
This port is associated with the chip selects CS0, CS1, CS2 and CS3 as well as with CAN4, CAN0, IIC1,
CAN, IIC, or SCI subsystems. If IIC takes precedence the associated pins become IIC open-drain output
Port J pins can be used with the routed CAN0 modules. Refer to Section 4.3.2.37, “Module Routing
Register (MODRR)”.
Port J offers 7 I/O pins with edge triggered interrupt capability (Section 4.4.3, “Pin Interrupts”).
NOTE
PJ[5,4,2] are not available in 112-pin packages. PJ[5,4,2,1,0] are not
available in 80-pin packages.
4.4.2.12 Port AD0
This port is associated with the ATD0. Port AD0 pins PAD07–PAD00 can be used for either general
purpose I/O, or with the ATD0 subsystem.
4.4.2.13 Port AD1
This port is associated with the ATD1. Port AD1 pins PAD23–PAD08 can be used for either general
purpose I/O, or with the ATD1 subsystem.
NOTE
PAD[23:16] are not available in 112-pin packages. PAD[23:08] are not
available in 80-pin packages.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
265
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
4.4.3
Pin Interrupts
Ports P, H and J offer pin interrupt capability. The interrupt enable as well as the sensitivity to rising or
falling edges can be individually configured on per-pin basis. All bits/pins in a port share the same
interrupt vector. Interrupts can be used with the pins configured as inputs or outputs.
An interrupt is generated when a bit in the port interrupt flag register and its corresponding port interrupt
enable bit are both set. The pin interrupt feature is also capable to wake up the CPU when it is in STOP or
WAIT mode.
A digital filter on each pin prevents pulses (Figure 4-78) shorter than a specified time from generating an
interrupt. The minimum time varies over process conditions, temperature and voltage (Figure 4-77 and
Table 4-69).
Glitch, filtered out, no interrupt flag set
Valid pulse, interrupt flag set
uncertain
t
pign
t
pval
Figure 4-77. Interrupt Glitch Filter on Port P, H, and J (PPS = 0)
Table 4-69. Pulse Detection Criteria
Mode
Pulse
1
STOP
≤ 3
Unit
STOP
Ignored
Uncertain
Valid
t
Bus clocks
Bus clocks
Bus clocks
t
≤ t
pulse
pulse
pign
3 < t
t
< 4
t
< t
< t
pval
pulse
pign
pulse
≥ 4
t
≥ t
pulse
pulse
pval
1
These values include the spread of the oscillator frequency over temperature,
voltage and process.
t
pulse
Figure 4-78. Pulse Illustration
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
A valid edge on an input is detected if 4 consecutive samples of a passive level are followed by
4 consecutive samples of an active level directly or indirectly.
The filters are continuously clocked by the bus clock in run and wait mode. In stop mode, the clock is
generated by an RC-oscillator in the port integration module. To maximize current saving the RC
oscillator runs only if the following condition is true on any pin individually:
Sample count <= 4 and interrupt enabled (PIE = 1) and interrupt flag not set (PIF = 0).
4.4.4
Expanded Bus Pin Functions
All peripheral ports T, S, M, P, H, J, AD0, and AD1 start up as general purpose inputs after reset.
Depending on the external mode pin condition, the external bus interface related ports A, B, C, D, E, and
K start up as general purpose inputs on reset or are configured for their alternate functions.
Table 4-70 lists the pin functions in relationship with the different operating modes. If two entries per pin
are displayed, a ‘mux’ indicates time-multiplexing between the two functions and an ‘or’ means that a
configuration bit exists which can be altered after reset to select the respective function (displayed in
italics). Refer to S12X_EBI section for details.
Table 4-70. Expanded Bus Pin Functions versus Operating Modes
Single-Chip Modes
Expanded Modes
Pin
Normal
Single-Chip
Special
Single-Chip
Normal
Expanded
Emulation
Single-Chip
Emulation
Expanded
Special
Test
PK7
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
or
EWAIT
GPIO
GPIO
or
EWAIT
GPIO
PK[6:4]
PK[3:0]
PA[7:0]
PB[7:1]
PB0
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
ADDR[22:20]
ADDR[22:20]
mux
ACC[2:0]
ADDR[22:20]
mux
ACC[2:0]
ADDR[22:20]
ADDR[19:16]
ADDR[15:8]
ADDR[7:1]
ADDR0
or
GPIO
ADDR[19:16]
ADDR[19:16]
mux
IQSTAT[3:0]
ADDR[19:16]
mux
IQSTAT[3:0]
or
GPIO
ADDR[15:8]
or
ADDR[15:8]
mux
IVD[15:8]
ADDR[15:8]
mux
IVD[15:8]
GPIO
ADDR[7:1]
or
ADDR[7:1]
mux
IVD[7:1]
ADDR[7:1]
mux
IVD[7:1]
GPIO
UDS
or
GPIO
ADDR0
mux
IVD0
ADDR0
mux
IVD0
PC[7:0]
DATA[15:8]
or
DATA[15:8]
DATA[15:8]
DATA[15:8]
or
GPIO
GPIO
PD[7:0]
PE7
DATA[7:0]
DATA[7:0]
ECLKX2
DATA[7:0]
ECLKX2
DATA[7:0]
GPIO
or
GPIO
or
GPIO
or
GPIO
or
ECLKX2
ECLKX2
ECLKX2
ECLKX2
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
267
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
Table 4-70. Expanded Bus Pin Functions versus Operating Modes (continued)
Single-Chip Modes
Expanded Modes
Pin
Normal
Single-Chip
Special
Single-Chip
Normal
Expanded
Emulation
Single-Chip
Emulation
Expanded
Special
Test
PE6
PE5
PE4
GPIO
GPIO
GPIO
GPIO
GPIO
RE
TAGHI
TAGLO
ECLK
TAGHI
TAGLO
ECLK
GPIO
GPIO
GPIO
or
ECLK
or
ECLK
or
ECLK
or
ECLK
GPIO
GPIO
GPIO
PE3
GPIO
GPIO
LDS
or
GPIO
LSTRB
LSTRB
R/W
LSTRB
PE2
PJ5
GPIO
GPIO
GPIO
GPIO
WE
R/W
R/W
GPIO
or
GPIO
GPIO
or
GPIO
or
CS2
CS2
CS2
PJ4
PJ2
PJ0
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
or
CS0
or
CS0
or
CS0
(1)
(1)
GPIO
or
CS1
GPIO
or
CS1
GPIO
or
CS1
GPIO
or
GPIO
or
GPIO
or
CS3
CS3
CS3
1
Depending on ROMON bit. Refer to Device Guide, S12X_EBI section and S12X_MMC section for details.
4.4.5
Low-Power Options
Run Mode
4.4.5.1
No low-power options exist for this module in run mode.
4.4.5.2
Wait Mode
No low-power options exist for this module in wait mode.
4.4.5.3
Stop Mode
All clocks are stopped. There are asynchronous paths to generate interrupts from stop on port P, H, and J.
4.5
Initialization and Application Information
•
It is not recommended to write PORTx and DDRx in a word access. When changing the register
pins from inputs to outputs, the data may have extra transitions during the write access. Initialize
the port data register before enabling the outputs.
MC9S12XDP512 Data Sheet, Rev. 2.11
268
Freescale Semiconductor
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
•
Power consumption will increase the more the voltages on general purpose input pins deviate from
the supply voltages towards mid-range because the digital input buffers operate in the linear region.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
269
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Chapter 4 Port Integration Module (S12XDP512PIMV2)
MC9S12XDP512 Data Sheet, Rev. 2.11
270
Freescale Semiconductor
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Chapter 5
Clocks and Reset Generator (S12CRGV6)
5.1
Introduction
This specification describes the function of the clocks and reset generator (MC9S12XDP512).
5.1.1
Features
The main features of this block are:
•
•
Phase locked loop (PLL) frequency multiplier
— Reference divider
— Automatic bandwidth control mode for low-jitter operation
— Automatic frequency lock detector
— Interrupt request on entry or exit from locked condition
— Self clock mode in absence of reference clock
System clock generator
— Clock quality check
— User selectable fast wake-up from Stop in self-clock mode for power saving and immediate
program execution
— Clock switch for either oscillator or PLL based system clocks
Computer operating properly (COP) watchdog timer with time-out clear window
System reset generation from the following possible sources:
— Power on reset
•
•
— Low voltage reset
— Illegal address reset
— COP reset
— Loss of clock reset
— External pin reset
•
Real-time interrupt (RTI)
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
271
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Chapter 5 Clocks and Reset Generator (S12CRGV6)
5.1.2
Modes of Operation
This subsection lists and briefly describes all operating modes supported by the CRG.
•
Run mode
All functional parts of the CRG are running during normal run mode. If RTI or COP functionality
is required, the individual bits of the associated rate select registers (COPCTL, RTICTL) have to
be set to a nonzero value.
•
•
Wait mode
In this mode, the PLL can be disabled automatically depending on the PLLSEL bit in the CLKSEL
register.
Stop mode
Depending on the setting of the PSTP bit, stop mode can be differentiated between full stop mode
(PSTP = 0) and pseudo stop mode (PSTP = 1).
— Full stop mode
The oscillator is disabled and thus all system and core clocks are stopped. The COP and the
RTI remain frozen.
— Pseudo stop mode
The oscillator continues to run and most of the system and core clocks are stopped. If the
respective enable bits are set, the COP and RTI will continue to run, or else they remain frozen.
•
Self clock mode
Self clock mode will be entered if the clock monitor enable bit (CME) and the self clock mode
enable bit (SCME) are both asserted and the clock monitor in the oscillator block detects a loss of
clock. As soon as self clock mode is entered, the MC9S12XDP512 starts to perform a clock quality
check. Self clock mode remains active until the clock quality check indicates that the required
quality of the incoming clock signal is met (frequency and amplitude). Self clock mode should be
used for safety purposes only. It provides reduced functionality to the MCU in case a loss of clock
is causing severe system conditions.
MC9S12XDP512 Data Sheet, Rev. 2.11
272
Freescale Semiconductor
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Chapter 5 Clocks and Reset Generator (S12CRGV6)
5.1.3
Block Diagram
Figure 5-1 shows a block diagram of the MC9S12XDP512.
Illegal Address Reset
S12X_MMC
Power on Reset
Voltage
Regulator
Low Voltage Reset
CRG
CM fail
RESET
Reset
Generator
System Reset
Clock
Monitor
XCLKS
Clock Quality
Checker
OSCCLK
Oscillator
EXTAL
XTAL
Bus Clock
Core Clock
COP
RTI
Oscillator Clock
Registers
XFC
PLLCLK
Real Time Interrupt
PLL Lock Interrupt
V
DDPLL
Clock and Reset
Control
PLL
V
SSPLL
Self Clock Mode
Interrupt
Figure 5-1. CRG Block Diagram
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
273
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Chapter 5 Clocks and Reset Generator (S12CRGV6)
5.2
External Signal Description
This section lists and describes the signals that connect off chip.
5.2.1
V
and V
— Operating and Ground Voltage Pins
SSPLL
DDPLL
These pins provide operating voltage (V
) and ground (V
) for the PLL circuitry. This allows
DDPLL
SSPLL
the supply voltage to the PLL to be independently bypassed. Even if PLL usage is not required, V
DDPLL
and V
must be connected to properly.
SSPLL
5.2.2
XFC — External Loop Filter Pin
A passive external loop filter must be placed on the XFC pin. The filter is a second-order, low-pass filter
that eliminates the VCO input ripple. The value of the external filter network and the reference frequency
determines the speed of the corrections and the stability of the PLL. Refer to the device specification for
calculation of PLL Loop Filter (XFC) components. If PLL usage is not required, the XFC pin must be tied
to V
.
DDPLL
V
DDPLL
C
C
P
S
MCU
R
S
XFC
Figure 5-2. PLL Loop Filter Connections
5.2.3
RESET — Reset Pin
RESET is an active low bidirectional reset pin. As an input. it initializes the MCU asynchronously to a
known start-up state. As an open-drain output, it indicates that a system reset (internal to the MCU) has
been triggered.
5.3
Memory Map and Register Definition
This section provides a detailed description of all registers accessible in the MC9S12XDP512.
MC9S12XDP512 Data Sheet, Rev. 2.11
274
Freescale Semiconductor
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Chapter 5 Clocks and Reset Generator (S12CRGV6)
5.3.1
Module Memory Map
Table 5-1 gives an overview on all MC9S12XDP512 registers.
Table 5-1. MC9S12XDP512 Memory Map
Address
Offset
Use
Access
0x_00
0x_01
0x_02
0x_03
0x_04
0x_05
0x_06
0x_07
0x_08
0x_09
0x_0A
0x_0B
CRG Synthesizer Register (SYNR)
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
CRG Reference Divider Register (REFDV)
1
CRG Test Flags Register (CTFLG)
CRG Flags Register (CRGFLG)
CRG Interrupt Enable Register (CRGINT)
CRG Clock Select Register (CLKSEL)
CRG PLL Control Register (PLLCTL)
CRG RTI Control Register (RTICTL)
CRG COP Control Register (COPCTL)
2
CRG Force and Bypass Test Register (FORBYP)
3
CRG Test Control Register (CTCTL)
CRG COP Arm/Timer Reset (ARMCOP)
1
2
3
CTFLG is intended for factory test purposes only.
FORBYP is intended for factory test purposes only.
CTCTL is intended for factory test purposes only.
NOTE
Register Address = Base Address + Address Offset, where the Base Address
is defined at the MCU level and the Address Offset is defined at the module
level.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
275
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Chapter 5 Clocks and Reset Generator (S12CRGV6)
5.3.2
Register Descriptions
This section describes in address order all the MC9S12XDP512 registers and their individual bits.
Register
Name
Bit 7
6
5
4
3
2
1
Bit 0
0x_00
SYNR
R
0
0
SYN5
SYN4
SYN3
SYN2
SYN1
SYN0
W
0x_01
REFDV
R
0
0
0
0
REFDV5
0
REFDV4
0
REFDV3
0
REFDV2
0
REFDV1
0
REFDV0
0
W
0x_02
R
CTFLG
W
0x_03
CRGFLG
R
LOCK
0
TRACK
SCM
0
RTIF
RTIE
PORF
ILAF
LVRF
0
LOCKIF
SCMIF
SCMIE
RTIWAI
PCE
W
0x_04
CRGINT
R
0
0
LOCKIE
0
W
0x_05
CLKSEL
R
0
PLLSEL
CME
PSTP
PLLON
RTR6
PLLWAI
COPWAI
SCME
RTR0
W
0x_06
PLLCTL
R
AUTO
RTR5
ACQ
FSTWKP
PRE
W
0x_07
RTICTL
R
RTDEC
RTR4
0
RTR3
0
RTR2
RTR1
W
0x_08
COPCTL
R
0
WCOP
0
RSBCK
0
CR2
0
CR1
0
CR0
0
W
WRTMASK
0x_09
FORBYP
R
0
0
0
0
0
W
0x_0A
R
1
0
0
0
0
0
CTCTL
W
0x_0B
R
0
0
0
0
0
0
0
0
ARMCOP
W
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
= Unimplemented or Reserved
Figure 5-3. S12CRGV6 Register Summary
MC9S12XDP512 Data Sheet, Rev. 2.11
276
Freescale Semiconductor
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Chapter 5 Clocks and Reset Generator (S12CRGV6)
5.3.2.1
CRG Synthesizer Register (SYNR)
The SYNR register controls the multiplication factor of the PLL. If the PLL is on, the count in the loop
divider (SYNR) register effectively multiplies up the PLL clock (PLLCLK) from the reference frequency
by 2 x (SYNR + 1). PLLCLK will not be below the minimum VCO frequency (f
).
SCM
(SYNR + 1)
PLLCLK = 2xOSCCLKx-----------------------------------
(REFDV + 1)
NOTE
If PLL is selected (PLLSEL=1), Bus Clock = PLLCLK / 2
Bus Clock must not exceed the maximum operating system frequency.
Module Base +0x_00
7
6
5
4
3
2
1
0
R
W
0
0
SYN5
SYN4
SYN3
SYN2
SYN1
SYN0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 5-4. CRG Synthesizer Register (SYNR)
Read: Anytime
Write: Anytime except if PLLSEL = 1
NOTE
Write to this register initializes the lock detector bit and the track detector
bit.
5.3.2.2
CRG Reference Divider Register (REFDV)
The REFDV register provides a finer granularity for the PLL multiplier steps. The count in the reference
divider divides OSCCLK frequency by REFDV + 1.
Module Base +0x_01
7
6
5
4
3
2
1
0
R
W
0
0
REFDV5
REFDV4
REFDV3
REFDV2
REFDV1
REFDV0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 5-5. CRG Reference Divider Register (REFDV)
Read: Anytime
Write: Anytime except when PLLSEL = 1
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
277
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Chapter 5 Clocks and Reset Generator (S12CRGV6)
NOTE
Write to this register initializes the lock detector bit and the track detector
bit.
5.3.2.3
Reserved Register (CTFLG)
This register is reserved for factory testing of the MC9S12XDP512 module and is not available in normal
modes.
Module Base +0x_02
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 5-6. Reserved Register (CTFLG)
Read: Always reads 0x_00 in normal modes
Write: Unimplemented in normal modes
NOTE
Writing to this register when in special mode can alter the MC9S12XDP512
fucntionality.
5.3.2.4
CRG Flags Register (CRGFLG)
This register provides CRG status bits and flags.
Module Base +0x_03
7
6
5
4
3
2
1
0
R
W
LOCK
TRACK
SCM
RTIF
PORF
LVRF
LOCKIF
SCMIF
1
2
Reset
0
0
0
0
0
0
1. PORF is set to 1 when a power on reset occurs. Unaffected by system reset.
2. LVRF is set to 1 when a low-voltage reset occurs. Unaffected by system reset.
= Unimplemented or Reserved
Figure 5-7. CRG Flags Register (CRGFLG)
Read: Anytime
Write: Refer to each bit for individual write conditions
MC9S12XDP512 Data Sheet, Rev. 2.11
278
Freescale Semiconductor
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Chapter 5 Clocks and Reset Generator (S12CRGV6)
Table 5-2. CRGFLG Field Descriptions
Field
Description
7
RTIF
Real Time Interrupt Flag — RTIF is set to 1 at the end of the RTI period. This flag can only be cleared by writing
a 1. Writing a 0 has no effect. If enabled (RTIE = 1), RTIF causes an interrupt request.
0 RTI time-out has not yet occurred.
1 RTI time-out has occurred.
6
Power on Reset Flag — PORF is set to 1 when a power on reset occurs. This flag can only be cleared by writing
a 1. Writing a 0 has no effect.
PORF
0 Power on reset has not occurred.
1 Power on reset has occurred.
5
Low Voltage Reset Flag — If low voltage reset feature is not available (see device specification) LVRF always
reads 0. LVRF is set to 1 when a low voltage reset occurs. This flag can only be cleared by writing a 1. Writing
a 0 has no effect.
LVRF
0 Low voltage reset has not occurred.
1 Low voltage reset has occurred.
4
PLL Lock Interrupt Flag — LOCKIF is set to 1 when LOCK status bit changes. This flag can only be cleared
by writing a 1. Writing a 0 has no effect.If enabled (LOCKIE = 1), LOCKIF causes an interrupt request.
0 No change in LOCK bit.
LOCKIF
1 LOCK bit has changed.
3
Lock Status Bit — LOCK reflects the current state of PLL lock condition. This bit is cleared in self clock mode.
Writes have no effect.
LOCK
0 PLL VCO is not within the desired tolerance of the target frequency.
1 PLL VCO is within the desired tolerance of the target frequency.
2
Track Status Bit — TRACK reflects the current state of PLL track condition. This bit is cleared in self clock
TRACK
mode. Writes have no effect.
0 Acquisition mode status.
1Tracking mode status.
1
Self Clock Mode Interrupt Flag — SCMIF is set to 1 when SCM status bit changes. This flag can only be
cleared by writing a 1. Writing a 0 has no effect. If enabled (SCMIE = 1), SCMIF causes an interrupt request.
0 No change in SCM bit.
SCMIF
1 SCM bit has changed.
0
SCM
Self Clock Mode Status Bit — SCM reflects the current clocking mode. Writes have no effect.
0 MCU is operating normally with OSCCLK available.
1 MCU is operating in self clock mode with OSCCLK in an unknown state. All clocks are derived from PLLCLK
running at its minimum frequency f
.
SCM
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
279
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Chapter 5 Clocks and Reset Generator (S12CRGV6)
5.3.2.5
CRG Interrupt Enable Register (CRGINT)
This register enables CRG interrupt requests.
Module Base +0x_04
7
6
5
4
3
2
1
0
R
W
0
0
0
0
RTIE
ILAF
LOCKIE
SCMIE
1
Reset
0
0
0
0
0
0
0
1. ILAF is set to 1 when an illegal address reset occurs. Unaffected by system reset. Cleared by power on or low
voltage reset.
= Unimplemented or Reserved
Figure 5-8. CRG Interrupt Enable Register (CRGINT)
Read: Anytime
Write: Anytime
Table 5-3. CRGINT Field Descriptions
Description
Field
7
Real Time Interrupt Enable Bit
0 Interrupt requests from RTI are disabled.
RTIE
1 Interrupt will be requested whenever RTIF is set.
6
ILAF
Illegal Address Reset Flag — ILAF is set to 1 when an illegal address reset occurs. Refer to S12XMMC Block
Guide for details. This flag can only be cleared by writing a 1. Writing a 0 has no effect.
0 Illegal address reset has not occurred.
1 Illegal address reset has occurred.
4
Lock Interrupt Enable Bit
LOCKIE
0 LOCK interrupt requests are disabled.
1 Interrupt will be requested whenever LOCKIF is set.
1
Self ClockMmode Interrupt Enable Bit
0 SCM interrupt requests are disabled.
SCMIE
1 Interrupt will be requested whenever SCMIF is set.
MC9S12XDP512 Data Sheet, Rev. 2.11
280
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Chapter 5 Clocks and Reset Generator (S12CRGV6)
5.3.2.6
CRG Clock Select Register (CLKSEL)
This register controls CRG clock selection. Refer to Figure 5-17 for more details on the effect of each bit.
Module Base +0x_05
7
6
5
4
3
2
1
0
R
W
0
0
0
PLLSEL
PSTP
PLLWAI
RTIWAI
COPWAI
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 5-9. CRG Clock Select Register (CLKSEL)
Read: Anytime
Write: Refer to each bit for individual write conditions
Table 5-4. CLKSEL Field Descriptions
Field
Description
7
PLL Select Bit — Write anytime. Writing a1 when LOCK = 0 and AUTO = 1, or TRACK = 0 and AUTO = 0 has
no effect This prevents the selection of an unstable PLLCLK as SYSCLK. PLLSEL bit is cleared when the MCU
enters self clock mode, Stop mode or wait mode with PLLWAI bit set.
PLLSEL
0 System clocks are derived from OSCCLK (Bus Clock = OSCCLK / 2).
1 System clocks are derived from PLLCLK (Bus Clock = PLLCLK / 2).
6
Pseudo Stop Bit
PSTP
Write: Anytime
This bit controls the functionality of the oscillator during stop mode.
0 Oscillator is disabled in stop mode.
1 Oscillator continues to run in stop mode (pseudo stop).
Note: Pseudo stop mode allows for faster STOP recovery and reduces the mechanical stress and aging of the
resonator in case of frequent STOP conditions at the expense of a slightly increased power consumption.
3
PLL Stops in Wait Mode Bit
PLLWAI
Write: Anytime
If PLLWAI is set, the MC9S12XDP512 will clear the PLLSEL bit before entering wait mode. The PLLON bit
remains set during wait mode, but the PLL is powered down. Upon exiting wait mode, the PLLSEL bit has to be
set manually if PLL clock is required.
While the PLLWAI bit is set, the AUTO bit is set to 1 in order to allow the PLL to automatically lock on the selected
target frequency after exiting wait mode.
0 PLL keeps running in wait mode.
1 PLL stops in wait mode.
1
RTI Stops in Wait Mode Bit
RTIWAI
Write: Anytime
0 RTI keeps running in wait mode.
1 RTI stops and initializes the RTI dividers whenever the part goes into wait mode.
0
COP Stops in Wait Mode Bit
COPWAI
Normal modes: Write once
Special modes: Write anytime
0 COP keeps running in wait mode.
1 COP stops and initializes the COP counter whenever the part goes into wait mode.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
281
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Chapter 5 Clocks and Reset Generator (S12CRGV6)
5.3.2.7
CRG PLL Control Register (PLLCTL)
This register controls the PLL functionality.
Module Base +0x_06
7
6
5
4
3
2
1
0
R
W
CME
PLLON
AUTO
ACQ
FSTWKP
PRE
PCE
SCME
Reset
1
1
1
1
0
0
0
1
Figure 5-10. CRG PLL Control Register (PLLCTL)
Read: Anytime
Write: Refer to each bit for individual write conditions
Table 5-5. PLLCTL Field Descriptions
Field
Description
7
Clock Monitor Enable Bit — CME enables the clock monitor. Write anytime except when SCM = 1.
CME
0 Clock monitor is disabled.
1 Clock monitor is enabled. Slow or stopped clocks will cause a clock monitor reset sequence or self clock
mode.
Note: Operating with CME = 0 will not detect any loss of clock. In case of poor clock quality, this could cause
unpredictable operation of the MCU!
Note: In stop mode (PSTP = 0) the clock monitor is disabled independently of the CME bit setting and any loss
of external clock will not be detected. Also after wake-up from stop mode (PSTP = 0) with fast wake-up
enabled (FSTWKP = 1) the clock monitor is disabled independently of the CME bit setting and any loss
of external clock will not be detected.
6
Phase Lock Loop On Bit — PLLON turns on the PLL circuitry. In self clock mode, the PLL is turned on, but the
PLLON bit reads the last latched value. Write anytime except when PLLSEL = 1.
0 PLL is turned off.
PLLON
1 PLL is turned on. If AUTO bit is set, the PLL will lock automatically.
5
Automatic Bandwidth Control Bit — AUTO selects either the high bandwidth (acquisition) mode or the low
bandwidth (tracking) mode depending on how close to the desired frequency the VCO is running. Write anytime
except when PLLWAI = 1, because PLLWAI sets the AUTO bit to 1.
AUTO
0 Automatic mode control is disabled and the PLL is under software control, using ACQ bit.
1 Automatic mode control is enabled and ACQ bit has no effect.
4
Acquisition Bit
ACQ
Write anytime. If AUTO=1 this bit has no effect.
0 Low bandwidth filter is selected.
1 High bandwidth filter is selected.
3
Fast Wake-up from Full Stop Bit — FSTWKP enables fast wake-up from full stop mode. Write anytime. If
self-clock mode is disabled (SCME = 0) this bit has no effect.
FSTWKP
0 Fast wake-up from full stop mode is disabled.
When waking up from full stop mode the system will immediately resume operation in self-clock mode (see
Section 5.4.1.4, “Clock Quality Checker”). The SCMIF flag will not be set. The system will remain in self-clock
mode with oscillator and clock monitor disabled until FSTWKP bit is cleared. The clearing of FSTWKP will
start the oscillator, the clock monitor and the clock quality check. If the clock quality check is successful, the
CRG will switch all system clocks to OSCCLK. The SCMIF flag will be set. See application examples in
Figure 5-23 and Figure 5-24.
MC9S12XDP512 Data Sheet, Rev. 2.11
282
Freescale Semiconductor
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Chapter 5 Clocks and Reset Generator (S12CRGV6)
Table 5-5. PLLCTL Field Descriptions (continued)
Field
Description
2
PRE
RTI Enable during Pseudo Stop Bit — PRE enables the RTI during pseudo stop mode. Write anytime.
0 RTI stops running during pseudo stop mode.
1 RTI continues running during pseudo stop mode.
Note: If the PRE bit is cleared the RTI dividers will go static while pseudo stop mode is active. The RTI dividers
will not initialize like in wait mode with RTIWAI bit set.
1
PCE
COP Enable during Pseudo Stop Bit — PCE enables the COP during pseudo stop mode. Write anytime.
0 COP stops running during pseudo stop mode
1 COP continues running during pseudo stop mode
Note: If the PCE bit is cleared, the COP dividers will go static while pseudo stop mode is active. The COP
dividers will not initialize like in wait mode with COPWAI bit set.
0
Self Clock Mode Enable Bit
SCME
Normal modes: Write once
Special modes: Write anytime
SCME can not be cleared while operating in self clock mode (SCM = 1).
0 Detection of crystal clock failure causes clock monitor reset (see Section 5.5.2, “Clock Monitor Reset”).
1 Detection of crystal clock failure forces the MCU in self clock mode (see Section 5.4.2.2, “Self Clock Mode”).
5.3.2.8
CRG RTI Control Register (RTICTL)
This register selects the timeout period for the real time interrupt.
Module Base +0x_07
7
6
5
4
3
2
1
0
R
W
RTDEC
RTR6
RTR5
RTR4
RTR3
RTR2
RTR1
RTR0
Reset
0
0
0
0
0
0
0
0
Figure 5-11. CRG RTI Control Register (RTICTL)
Read: Anytime
Write: Anytime
NOTE
A write to this register initializes the RTI counter.
Table 5-6. RTICTL Field Descriptions
Description
Field
7
0 Binary based divider value. See Table 5-7
RTDEC
6–4
Real Time Interrupt Prescale Rate Select Bits — These bits select the prescale rate for the RTI. See Table 5-7
RTR[6:4]
and Table 5-8.
3–0
RTR[3:0]
Real Time Interrupt Modulus Counter Select Bits — These bits select the modulus counter target value to
provide additional granularity.Table 5-7 and Table 5-8 show all possible divide values selectable by the RTICTL
register. The source clock for the RTI is OSCCLK.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
283
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Chapter 5 Clocks and Reset Generator (S12CRGV6)
Table 5-7. RTI Frequency Divide Rates for RTDEC = 0
RTR[6:4] =
RTR[3:0]
000
(OFF)
001
010
011
100
101
110
111
10
11
12
13
14
15
16
(2
)
(2
)
(2
)
(2
)
(2
)
(2
)
(2
)
10
11
12
13
14
15
16
0000 (÷1)
0001 (÷2)
0010 (÷3)
0011 (÷4)
0100 (÷5)
0101 (÷6)
0110 (÷7)
0111 (÷8)
1000 (÷9)
1001 (÷10)
1010 (÷11)
1011 (÷12)
1100 (÷13)
1101 (÷14)
1110 (÷15)
1111 (÷16)
OFF*
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
2
2
2
2
2
2
2
10
10
10
10
10
10
10
10
11
11
11
11
11
11
11
11
12
12
12
12
12
12
12
12
13
13
13
13
13
13
13
13
14
14
14
14
14
14
14
14
15
15
15
15
15
15
15
15
16
16
16
16
16
16
16
16
2x2
3x2
4x2
5x2
6x2
7x2
8x2
9x2
2x2
3x2
4x2
5x2
6x2
7x2
8x2
9x2
2x2
3x2
4x2
5x2
6x2
7x2
8x2
9x2
2x2
3x2
4x2
5x2
6x2
7x2
8x2
9x2
2x2
3x2
4x2
5x2
6x2
7x2
8x2
9x2
2x2
3x2
4x2
5x2
6x2
7x2
8x2
9x2
2x2
3x2
4x2
5x2
6x2
7x2
8x2
9x2
10
10
10
10
10
10
10
11
11
11
11
11
11
11
12
12
12
12
12
12
12
13
13
13
13
13
13
13
14
14
14
14
14
14
14
15
15
15
15
15
15
15
16
16
16
16
16
16
16
10x2
11x2
12x2
13x2
14x2
15x2
16x2
10x2
11x2
12x2
13x2
14x2
15x2
16x2
10x2
11x2
12x2
13x2
14x2
15x2
16x2
10x2
11x2
12x2
13x2
14x2
15x2
16x2
10x2
11x2
12x2
13x2
14x2
15x2
16x2
10x2
11x2
12x2
13x2
14x2
15x2
16x2
10x2
11x2
12x2
13x2
14x2
15x2
16x2
* Denotes the default value out of reset.This value should be used to disable the RTI to ensure future backwards compatibility.
MC9S12XDP512 Data Sheet, Rev. 2.11
284
Freescale Semiconductor
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Chapter 5 Clocks and Reset Generator (S12CRGV6)
Table 5-8. RTI Frequency Divide Rates for RTDEC = 1
RTR[6:4] =
100
RTR[3:0]
000
(1x10 )
001
(2x10 )
010
(5x10 )
011
(10x10 )
101
(50x10 )
110
(100x10 )
111
(200x10 )
3
3
3
3
3
3
3
3
(20x10 )
3
3
3
3
3
3
3
3
0000 (÷1)
0001 (÷2)
0010 (÷3)
0011 (÷4)
0100 (÷5)
0101 (÷6)
0110 (÷7)
0111 (÷8)
1000 (÷9)
1001 (÷10)
1010 (÷11)
1011 (÷12)
1100 (÷13)
1101 (÷14)
1110 (÷15)
1111 (÷16)
1x10
2x10
5x10
10x10
20x10
50x10
100x10
200x10
3
3
3
3
3
3
3
3
2x10
4x10
10x10
20x10
40x10
100x10
200x10
400x10
3
3
3
3
3
3
3
3
3x10
6x10
15x10
30x10
60x10
150x10
300x10
600x10
3
3
3
3
3
3
3
3
4x10
8x10
20x10
40x10
80x10
200x10
400x10
800x10
3
3
3
3
3
3
3
6
5x10
10x10
25x10
50x10
100x10
250x10
500x10
1x10
3
3
3
3
3
3
3
6
6x10
12x10
30x10
60x10
120x10
300x10
600x10
1.2x10
3
3
3
3
3
3
3
6
7x10
14x10
35x10
70x10
140x10
350x10
700x10
1.4x10
3
3
3
3
3
3
3
6
8x10
16x10
40x10
80x10
160x10
400x10
800x10
1.6x10
3
3
3
3
3
3
3
6
9x10
18x10
45x10
90x10
180x10
450x10
900x10
1.8x10
3
3
3
3
3
3
6
6
10 x10
20x10
50x10
100x10
200x10
500x10
1x10
2x10
3
3
3
3
3
3
6
6
11 x10
22x10
55x10
110x10
220x10
550x10
1.1x10
2.2x10
3
3
3
3
3
3
6
6
12x10
24x10
60x10
120x10
240x10
600x10
1.2x10
2.4x10
3
3
3
3
3
3
6
6
13x10
26x10
65x10
130x10
260x10
650x10
1.3x10
2.6x10
3
3
3
3
3
3
6
6
14x10
28x10
70x10
140x10
280x10
700x10
1.4x10
2.8x10
3
3
3
3
3
3
6
6
15x10
30x10
75x10
150x10
300x10
750x10
1.5x10
3x10
3
3
3
3
3
3
6
6
16x10
32x10
80x10
160x10
320x10
800x10
1.6x10
3.2x10
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
285
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Chapter 5 Clocks and Reset Generator (S12CRGV6)
5.3.2.9
CRG COP Control Register (COPCTL)
This register controls the COP (computer operating properly) watchdog.
Module Base +0x_08
7
6
5
4
3
2
1
0
R
0
0
0
WCOP
RSBCK
CR2
CR1
CR0
W
WRTMASK
0
1
Reset
0
0
0
1. Refer to Device User Guide (Section: CRG) for reset values of WCOP, CR2, CR1, and CR0.
= Unimplemented or Reserved
Figure 5-12. CRG COP Control Register (COPCTL)
Read: Anytime
Write:
1. RSBCK: Anytime in special modes; write to “1” but not to “0” in all other modes
2. WCOP, CR2, CR1, CR0:
— Anytime in special modes
— Write once in all other modes
Writing CR[2:0] to “000” has no effect, but counts for the “write once” condition.
Writing WCOP to “0” has no effect, but counts for the “write once” condition.
The COP time-out period is restarted if one these two conditions is true:
1. Writing a nonzero value to CR[2:0] (anytime in special modes, once in all other modes) with
WRTMASK = 0.
or
2. Changing RSBCK bit from “0” to “1”.
Table 5-9. COPCTL Field Descriptions
Field
Description
7
Window COP Mode Bit — When set, a write to the ARMCOP register must occur in the last 25% of the selected
period. A write during the first 75% of the selected period will reset the part. As long as all writes occur during
this window, 0x_55 can be written as often as desired. Once 0x_AA is written after the 0x_55, the time-out logic
restarts and the user must wait until the next window before writing to ARMCOP. Table 5-10 shows the duration
of this window for the seven available COP rates.
WCOP
0 Normal COP operation
1 Window COP operation
6
COP and RTI Stop in Active BDM Mode Bit
RSBCK
0 Allows the COP and RTI to keep running in active BDM mode.
1 Stops the COP and RTI counters whenever the part is in active BDM mode.
MC9S12XDP512 Data Sheet, Rev. 2.11
286
Freescale Semiconductor
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Chapter 5 Clocks and Reset Generator (S12CRGV6)
Table 5-9. COPCTL Field Descriptions (continued)
Field
Description
5
Write Mask for WCOP and CR[2:0] Bit — This write-only bit serves as a mask for the WCOP and CR[2:0] bits
WRTMASK while writing the COPCTL register. It is intended for BDM writing the RSBCK without touching the contents of
WCOP and CR[2:0].
0 Write of WCOP and CR[2:0] has an effect with this write of COPCTL
1 Write of WCOP and CR[2:0] has no effect with this write of COPCTL. (Does not count for “write once”.)
2–0
CR[1:0]
COP Watchdog Timer Rate Select — These bits select the COP time-out rate (see Table 5-10). The COP
time-out period is OSCCLK period divided by CR[2:0] value. Writing a nonzero value to CR[2:0] enables the
COP counter and starts the time-out period. A COP counter time-out causes a system reset. This can be
avoided by periodically (before time-out) reinitializing the COP counter via the ARMCOP register.
While all of the following three conditions are true the CR[2:0], WCOP bits are ignored and the COP operates
24
at highest time-out period (2
cycles) in normal COP mode (Window COP mode disabled):
1) COP is enabled (CR[2:0] is not 000)
2) BDM mode active
3) RSBCK = 0
4) Operation in emulation or special modes
1
Table 5-10. COP Watchdog Rates
OSCCLK
Cycles to Time-out
CR2
CR1
CR0
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
COP disabled
14
2
16
2
18
2
20
2
22
2
23
2
24
2
1
OSCCLK cycles are referenced from the previous COP time-out reset
(writing 0x_55/0x_AA to the ARMCOP register)
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
287
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Chapter 5 Clocks and Reset Generator (S12CRGV6)
5.3.2.10 Reserved Register (FORBYP)
NOTE
This reserved register is designed for factory test purposes only, and is not
intended for general user access. Writing to this register when in special
modes can alter the CRG’s functionality.
Module Base +0x_09
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 5-13. Reserved Register (FORBYP)
Read: Always read 0x_00 except in special modes
Write: Only in special modes
5.3.2.11 Reserved Register (CTCTL)
NOTE
This reserved register is designed for factory test purposes only, and is not
intended for general user access. Writing to this register when in special test
modes can alter the CRG’s functionality.
Module Base +0x_0A
7
6
5
4
3
2
1
0
R
W
1
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 5-14. Reserved Register (CTCTL)
Read: always read 0x_80 except in special modes
Write: only in special modes
MC9S12XDP512 Data Sheet, Rev. 2.11
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Freescale Semiconductor
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Chapter 5 Clocks and Reset Generator (S12CRGV6)
5.3.2.12 CRG COP Timer Arm/Reset Register (ARMCOP)
This register is used to restart the COP time-out period.
Module Base +0x_0B
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Bit 7
0
Bit 6
0
Bit 5
0
Bit 4
0
Bit 3
0
Bit 2
0
Bit 1
0
Bit 0
0
Reset
Figure 5-15. ARMCOP Register Diagram
Read: Always reads 0x_00
Write: Anytime
When the COP is disabled (CR[2:0] = “000”) writing to this register has no effect.
When the COP is enabled by setting CR[2:0] nonzero, the following applies:
Writing any value other than 0x_55 or 0x_AA causes a COP reset. To restart the COP time-out
period you must write 0x_55 followed by a write of 0x_AA. Other instructions may be executed
between these writes but the sequence (0x_55, 0x_AA) must be completed prior to COP end of
time-out period to avoid a COP reset. Sequences of 0x_55 writes or sequences of 0x_AA writes
are allowed. When the WCOP bit is set, 0x_55 and 0x_AA writes must be done in the last 25% of
the selected time-out period; writing any value in the first 75% of the selected period will cause a
COP reset.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
289
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Chapter 5 Clocks and Reset Generator (S12CRGV6)
5.4
Functional Description
5.4.1
Functional Blocks
5.4.1.1
Phase Locked Loop (PLL)
The PLL is used to run the MCU from a different time base than the incoming OSCCLK. For increased
flexibility, OSCCLK can be divided in a range of 1 to 16 to generate the reference frequency. This offers
a finer multiplication granularity. The PLL can multiply this reference clock by a multiple of 2, 4, 6,...
126,128 based on the SYNR register.
[SYNR + 1]
PLLCLK = 2 × OSCCLK ×
-----------------------------------
[REFDV + 1]
CAUTION
Although it is possible to set the two dividers to command a very high clock
frequency, do not exceed the specified bus frequency limit for the MCU.
If (PLLSEL = 1), Bus Clock = PLLCLK / 2
The PLL is a frequency generator that operates in either acquisition mode or tracking mode, depending on
the difference between the output frequency and the target frequency. The PLL can change between
acquisition and tracking modes either automatically or manually.
The VCO has a minimum operating frequency, which corresponds to the self clock mode frequency f
.
SCM
REFERENCE
LOCK
LOCK
DETECTOR
REFDV <5:0>
FEEDBACK
EXTAL
XTAL
REDUCED
CONSUMPTION
OSCILLATOR
OSCCLK
REFERENCE
PROGRAMMABLE
DIVIDER
V
/V
DDPLL SSPLL
UP
PDET
PHASE
DETECTOR
CPUMP
VCO
DOWN
CRYSTAL
MONITOR
V
DDPLL
LOOP
PROGRAMMABLE
DIVIDER
LOOP
FILTER
XFC
PIN
supplied by:
SYN <5:0>
V
/V
DDPLL SSPLL
PLLCLK
V
/V
DD SS
Figure 5-16. PLL Functional Diagram
MC9S12XDP512 Data Sheet, Rev. 2.11
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Freescale Semiconductor
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Chapter 5 Clocks and Reset Generator (S12CRGV6)
5.4.1.1.1
PLL Operation
The oscillator output clock signal (OSCCLK) is fed through the reference programmable divider and is
divided in a range of 1 to 64 (REFDV + 1) to output the REFERENCE clock. The VCO output clock,
(PLLCLK) is fed back through the programmable loop divider and is divided in a range of 2 to 128 in
increments of [2 x (SYNR + 1)] to output the FEEDBACK clock. Figure 5-16.
The phase detector then compares the FEEDBACK clock, with the REFERENCE clock. Correction pulses
are generated based on the phase difference between the two signals. The loop filter then slightly alters the
DC voltage on the external filter capacitor connected to XFC pin, based on the width and direction of the
correction pulse. The filter can make fast or slow corrections depending on its mode, as described in the
next subsection. The values of the external filter network and the reference frequency determine the speed
of the corrections and the stability of the PLL.
The minimum VCO frequency is reached with the XFC pin forced to V
frequency.
. This is the self clock mode
DDPLL
5.4.1.1.2
Acquisition and Tracking Modes
The lock detector compares the frequencies of the FEEDBACK clock, and the REFERENCE clock.
Therefore, the speed of the lock detector is directly proportional to the final reference frequency. The
circuit determines the mode of the PLL and the lock condition based on this comparison.
The PLL filter can be manually or automatically configured into one of two possible operating modes:
•
Acquisition mode
In acquisition mode, the filter can make large frequency corrections to the VCO. This mode is used
at PLL start-up or when the PLL has suffered a severe noise hit and the VCO frequency is far off
the desired frequency. When in acquisition mode, the TRACK status bit is cleared in the CRGFLG
register.
•
Tracking mode
In tracking mode, the filter makes only small corrections to the frequency of the VCO. PLL jitter
is much lower in tracking mode, but the response to noise is also slower. The PLL enters tracking
mode when the VCO frequency is nearly correct and the TRACK bit is set in the CRGFLG register.
The PLL can change the bandwidth or operational mode of the loop filter manually or automatically.
In automatic bandwidth control mode (AUTO = 1), the lock detector automatically switches between
acquisition and tracking modes. Automatic bandwidth control mode also is used to determine when the
PLL clock (PLLCLK) is safe to use as the source for the system and core clocks. If PLL LOCK interrupt
requests are enabled, the software can wait for an interrupt request and then check the LOCK bit. If
interrupt requests are disabled, software can poll the LOCK bit continuously (during PLL start-up, usually)
or at periodic intervals. In either case, only when the LOCK bit is set, is the PLLCLK clock safe to use as
the source for the system and core clocks. If the PLL is selected as the source for the system and core
clocks and the LOCK bit is clear, the PLL has suffered a severe noise hit and the software must take
appropriate action, depending on the application.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
291
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Chapter 5 Clocks and Reset Generator (S12CRGV6)
The following conditions apply when the PLL is in automatic bandwidth control mode (AUTO = 1):
•
•
The TRACK bit is a read-only indicator of the mode of the filter.
The TRACK bit is set when the VCO frequency is within a certain tolerance, ∆ , and is clear when
trk
the VCO frequency is out of a certain tolerance, ∆ .
unt
•
•
The LOCK bit is a read-only indicator of the locked state of the PLL.
The LOCK bit is set when the VCO frequency is within a certain tolerance, ∆
, and is cleared
Lock
when the VCO frequency is out of a certain tolerance, ∆ .
unl
•
Interrupt requests can occur if enabled (LOCKIE = 1) when the lock condition changes, toggling
the LOCK bit.
The PLL can also operate in manual mode (AUTO = 0). Manual mode is used by systems that do not
require an indicator of the lock condition for proper operation. Such systems typically operate well below
the maximum system frequency (f ) and require fast start-up. The following conditions apply when in
sys
manual mode:
•
•
•
ACQ is a writable control bit that controls the mode of the filter. Before turning on the PLL in
manual mode, the ACQ bit should be asserted to configure the filter in acquisition mode.
After turning on the PLL by setting the PLLON bit software must wait a given time (t ) before
acq
entering tracking mode (ACQ = 0).
After entering tracking mode software must wait a given time (t ) before selecting the PLLCLK
al
as the source for system and core clocks (PLLSEL = 1).
5.4.1.2
System Clocks Generator
PLLSEL or SCM
STOP
PHASE
LOCK
LOOP
PLLCLK
1
0
SYSCLK
CORE CLOCK
BUS CLOCK
÷2
CLOCK PHASE
GENERATOR
SCM
WAIT(RTIWAI),
STOP(PSTP,PRE),
RTI ENABLE
EXTAL
XTAL
1
RTI
OSCCLK
OSCILLATOR
0
WAIT(COPWAI),
STOP(PSTP,PCE),
COP ENABLE
COP
CLOCK
MONITOR
STOP
GATING
CONDITION
OSCILLATOR
CLOCK
= CLOCK GATE
Figure 5-17. System Clocks Generator
MC9S12XDP512 Data Sheet, Rev. 2.11
292
Freescale Semiconductor
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Chapter 5 Clocks and Reset Generator (S12CRGV6)
The clock generator creates the clocks used in the MCU (see Figure 5-17). The gating condition placed on
top of the individual clock gates indicates the dependencies of different modes (STOP, WAIT) and the
setting of the respective configuration bits.
The peripheral modules use the bus clock. Some peripheral modules also use the oscillator clock. The
memory blocks use the bus clock. If the MCU enters self clock mode (see Section 5.4.2.2, “Self Clock
Mode”) oscillator clock source is switched to PLLCLK running at its minimum frequency f
. The bus
SCM
clock is used to generate the clock visible at the ECLK pin. The core clock signal is the clock for the CPU.
The core clock is twice the bus clock as shown in Figure 5-18. But note that a CPU cycle corresponds to
one bus clock.
PLL clock mode is selected with PLLSEL bit in the CLKSEL registerr. When selected, the PLL output
clock drives SYSCLK for the main system including the CPU and peripherals. The PLL cannot be turned
off by clearing the PLLON bit, if the PLL clock is selected. When PLLSEL is changed, it takes a maximum
of 4 OSCCLK plus 4 PLLCLK cycles to make the transition. During the transition, all clocks freeze and
CPU activity ceases.
CORE CLOCK
BUS CLOCK / ECLK
Figure 5-18. Core Clock and Bus Clock Relationship
5.4.1.3
Clock Monitor (CM)
If no OSCCLK edges are detected within a certain time, the clock monitor within the oscillator block
generates a clock monitor fail event. The MC9S12XDP512 then asserts self clock mode or generates a
system reset depending on the state of SCME bit. If the clock monitor is disabled or the presence of clocks
is detected no failure is indicated by the oscillator block.The clock monitor function is enabled/disabled
by the CME control bit.
5.4.1.4
Clock Quality Checker
The clock monitor performs a coarse check on the incoming clock signal. The clock quality checker
provides a more accurate check in addition to the clock monitor.
A clock quality check is triggered by any of the following events:
•
•
•
•
Power on reset (POR)
Low voltage reset (LVR)
Wake-up from full stop mode (exit full stop)
Clock monitor fail indication (CM fail)
1
A time window of 50,000 VCO clock cycles is called check window.
1. VCO clock cycles are generated by the PLL when running at minimum frequency f
.
SCM
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A number greater equal than 4096 rising OSCCLK edges within a check window is called osc ok. Note that
osc ok immediately terminates the current check window. See Figure 5-19 as an example.
check window
3
1
2
49999
50000
VCO
Clock
1
2
3
4
5
4096
OSCCLK
4095
osc ok
Figure 5-19. Check Window Example
The sequence for clock quality check is shown in Figure 5-20.
CM fail
Clock OK
no
exit full stop
POR
yes
SCME = 1 &
FSTWKP = 1
?
FSTWKP = 0
?
num = 0
Enter SCM
LVR
yes
no
Clock Monitor Reset
Enter SCM
num = 0
num = 50
no
yes
SCM
active?
check window
num=num–1
yes
yes
no
no
no
osc ok
?
SCME=1
?
num > 0
?
yes
yes
SCM
active?
Switch to OSCCLK
Exit SCM
no
Figure 5-20. Sequence for Clock Quality Check
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 5 Clocks and Reset Generator (S12CRGV6)
NOTE
Remember that in parallel to additional actions caused by self clock mode
1
or clock monitor reset handling the clock quality checker continues to
check the OSCCLK signal.
The clock quality checker enables the PLL and the voltage regulator
(VREG) anytime a clock check has to be performed. An ongoing clock
quality check could also cause a running PLL (f
during pseudo stop mode or wait mode.
) and an active VREG
SCM
5.4.1.5
Computer Operating Properly Watchdog (COP)
The COP (free running watchdog timer) enables the user to check that a program is running and
timing out. If the COP times out it is an indication that the software is no longer being executed in the
intended sequence; thus a system reset is initiated (see Section 5.4.1.5, “Computer Operating Properly
Watchdog (COP)”). The COP runs with a gated OSCCLK. Three control bits in the COPCTL register
allow selection of seven COP time-out periods.
When COP is enabled, the program must write 0x_55 and 0x_AA (in this order) to the ARMCOP register
during the selected time-out period. Once this is done, the COP time-out period is restarted. If the program
fails to do this and the COP times out, the part will reset. Also, if any value other than 0x_55 or 0x_AA is
written, the part is immediately reset.
Windowed COP operation is enabled by setting WCOP in the COPCTL register. In this mode, writes to
the ARMCOP register to clear the COP timer must occur in the last 25% of the selected time-out period.
A premature write will immediately reset the part.
If PCE bit is set, the COP will continue to run in pseudo stop mode.
5.4.1.6
Real Time Interrupt (RTI)
The RTI can be used to generate a hardware interrupt at a fixed periodic rate. If enabled (by setting
RTIE = 1), this interrupt will occur at the rate selected by the RTICTL register. The RTI runs with a gated
OSCCLK. At the end of the RTI time-out period the RTIF flag is set to 1 and a new RTI time-out period
starts immediately.
A write to the RTICTL register restarts the RTI time-out period.
If the PRE bit is set, the RTI will continue to run in pseudo stop mode.
5.4.2
Operating Modes
Normal Mode
5.4.2.1
The MC9S12XDP512 block behaves as described within this specification in all normal modes.
1. A Clock Monitor Reset will always set the SCME bit to logical 1.
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 5 Clocks and Reset Generator (S12CRGV6)
5.4.2.2
Self Clock Mode
The VCO has a minimum operating frequency, f
. If the external clock frequency is not available due
SCM
to a failure or due to long crystal start-up time, the bus clock and the core clock are derived from the VCO
running at minimum operating frequency; this mode of operation is called self clock mode. This requires
CME = 1 and SCME = 1. If the MCU was clocked by the PLL clock prior to entering self clock mode, the
PLLSEL bit will be cleared. If the external clock signal has stabilized again, the CRG will automatically
select OSCCLK to be the system clock and return to normal mode. Section 5.4.1.4, “Clock Quality
Checker” for more information on entering and leaving self clock mode.
NOTE
In order to detect a potential clock loss the CME bit should be always
enabled (CME = 1)!
If CME bit is disabled and the MCU is configured to run on PLL clock
(PLLCLK), a loss of external clock (OSCCLK) will not be detected and will
cause the system clock to drift towards the VCO’s minimum frequency
f
. As soon as the external clock is available again the system clock
SCM
ramps up to its PLL target frequency. If the MCU is running on external
clock any loss of clock will cause the system to go static.
5.4.3
Low Power Options
This section summarizes the low power options available in the MC9S12XDP512.
5.4.3.1
Run Mode
The RTI can be stopped by setting the associated rate select bits to 0.
The COP can be stopped by setting the associated rate select bits to 0.
5.4.3.2
Wait Mode
the individual bits in the CLKSEL register. All individual wait mode configuration bits can be superposed.
This provides enhanced granularity in reducing the level of power consumption during wait mode.
Table 5-11 lists the individual configuration bits and the parts of the MCU that are affected in wait mode
.
Table 5-11. MCU Configuration During Wait Mode
PLLWAI
RTIWAI
COPWAI
PLL
RTI
Stopped
—
Stopped
—
—
—
—
—
COP
Stopped
After executing the WAI instruction the core requests the CRG to switch MCU into wait mode. The CRG
then checks whether the PLLWAI bit is asserted (Figure 5-21). Depending on the configuration, the CRG
switches the system and core clocks to OSCCLK by clearing the PLLSEL bit and disables the PLL. As
soon as all clocks are switched off wait mode is active.
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Chapter 5 Clocks and Reset Generator (S12CRGV6)
CPU Req’s
Wait Mode.
No
PLLWAI=1
?
Yes
Clear PLLSEL,
Disable PLL
No
Enter
Wait Mode
No
CME=1
INT
?
?
Wait Mode left
due to external reset
Yes
Yes
Exit Wait w.
ext.RESET
No
CM Fail
?
Yes
No
Exit Wait w.
CMRESET
SCME=1
?
Yes
Exit
Wait Mode
No
SCMIE=1
?
Yes
Generate
SCM Interrupt
No
SCM=1
?
(Wakeup from Wait)
Exit
Wait Mode
Yes
Enter
SCM
Enter
SCM
Continue w.
Normal OP
Figure 5-21. Wait Mode Entry/Exit Sequence
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 5 Clocks and Reset Generator (S12CRGV6)
There are four different scenarios for the CRG to restart the MCU from wait mode:
•
•
•
•
External reset
Clock monitor reset
COP reset
Any interrupt
If the MCU gets an external reset or COP reset during wait mode active, the CRG asynchronously restores
all configuration bits in the register space to its default settings and starts the reset generator. After
completing the reset sequence processing begins by fetching the normal or COP reset vector. Wait mode
is left and the MCU is in run mode again.
If the clock monitor is enabled (CME = 1) the MCU is able to leave wait mode when loss of
oscillator/external clock is detected by a clock monitor fail. If the SCME bit is not asserted the CRG
generates a clock monitor fail reset (CMRESET). The CRG’s behavior for CMRESET is the same
compared to external reset, but another reset vector is fetched after completion of the reset sequence. If the
interrupt the CRG enters self-clock mode and starts the clock quality checker (Section 5.4.1.4, “Clock
Quality Checker”). Then the MCU continues with normal operation.If the SCM interrupt is blocked by
SCMIE = 0, the SCMIF flag will be asserted and clock quality checks will be performed but the MCU will
not wake-up from wait-mode.
If any other interrupt source (e.g., RTI) triggers exit from wait mode, the MCU immediately continues with
normal operation. If the PLL has been powered-down during wait mode, the PLLSEL bit is cleared and
the MCU runs on OSCCLK after leaving wait mode. The software must manually set the PLLSEL bit
again, in order to switch system and core clocks to the PLLCLK.
If wait mode is entered from self-clock mode the CRG will continue to check the clock quality until clock
check is successful. The PLL and voltage regulator (VREG) will remain enabled.
Table 5-12 summarizes the outcome of a clock loss while in wait mode.
5.4.3.3
System Stop Mode
All clocks are stopped in STOP mode, dependent of the setting of the PCE, PRE, and PSTP bit. The
oscillator is disabled in STOP mode unless the PSTP bit is set. All counters and dividers remain frozen but
do not initialize. If the PRE or PCE bits are set, the RTI or COP continues to run in pseudo stop mode. In
addition to disabling system and core clocks the CRG requests other functional units of the MCU (e.g.,
voltage-regulator) to enter their individual power saving modes (if available). This is the main difference
between pseudo stop mode and wait mode.
If the PLLSEL bit is still set when entering stop mode, the CRG will switch the system and core clocks to
OSCCLK by clearing the PLLSEL bit. Then the CRG disables the PLL, disables the core clock and finally
disables the remaining system clocks. As soon as all clocks are switched off, stop mode is active.
If pseudo stop mode (PSTP = 1) is entered from self-clock mode, the CRG will continue to check the clock
quality until clock check is successful. The PLL and the voltage regulator (VREG) will remain enabled. If
full stop mode (PSTP = 0) is entered from self-clock mode, an ongoing clock quality check will be
stopped. A complete timeout window check will be started when stop mode is left again.
Wake-up from stop mode also depends on the setting of the PSTP bit.
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Chapter 5 Clocks and Reset Generator (S12CRGV6)
Table 5-12. Outcome of Clock Loss in Wait Mode
CME
SCME
SCMIE
CRG Actions
Clock failure -->
0
X
X
No action, clock loss not detected.
Clock failure -->
1
0
X
CRG performs Clock Monitor Reset immediately
Clock failure -->
Scenario 1: OSCCLK recovers prior to exiting wait mode.
– MCU remains in wait mode,
– VREG enabled,
– PLL enabled,
– SCM activated,
– Start clock quality check,
– Set SCMIF interrupt flag.
Some time later OSCCLK recovers.
– CM no longer indicates a failure,
– 4096 OSCCLK cycles later clock quality check indicates clock o.k.,
– SCM deactivated,
– PLL disabled depending on PLLWAI,
– VREG remains enabled (never gets disabled in wait mode).
– MCU remains in wait mode.
Some time later either a wakeup interrupt occurs (no SCM interrupt)
– Exit wait mode using OSCCLK as system clock (SYSCLK),
– Continue normal operation.
1
1
0
or an External Reset is applied.
– Exit wait mode using OSCCLK as system clock,
– Start reset sequence.
Scenario 2: OSCCLK does not recover prior to exiting wait mode.
– MCU remains in wait mode,
– VREG enabled,
– PLL enabled,
– SCM activated,
– Start clock quality check,
– Set SCMIF interrupt flag,
– Keep performing clock quality checks (could continue infinitely) while in wait mode.
Some time later either a wakeup interrupt occurs (no SCM interrupt)
– Exit wait mode in SCM using PLL clock (f
) as system clock,
SCM
– Continue to perform additional clock quality checks until OSCCLK is o.k. again.
or an External RESET is applied.
– Exit wait mode in SCM using PLL clock (f
– Start reset sequence,
) as system clock,
SCM
– Continue to perform additional clock quality checks until OSCCLKis o.k.again.
Clock failure -->
– VREG enabled,
– PLL enabled,
– SCM activated,
1
1
1
– Start clock quality check,
– SCMIF set.
SCMIF generates self clock mode wakeup interrupt.
– Exit wait mode in SCM using PLL clock (f
) as system clock,
SCM
– Continue to perform a additional clock quality checks until OSCCLK is o.k. again.
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 5 Clocks and Reset Generator (S12CRGV6)
Core req’s
Stop Mode.
Clear PLLSEL,
Disable PLL
Stop Mode left
due to external reset
Enter
Stop Mode
Exit Stop w.
ext.RESET
No
No
No
Yes
No
No
CME=1
?
INT
?
INT
?
Yes
PSTP=1
?
Yes
Yes
Yes
SCME=1 &
FSTWKP=1
?
CM fail
?
No
Yes
No
no
Clock
OK
?
Exit Stop w.
CMRESET
SCME=1
?
No
Yes
Exit Stop w.
CMRESET
SCME=1
?
Yes
Exit
Stop Mode
Yes
No
Exit
Stop Mode
SCMIE=1
?
Yes
Generate
SCM Interrupt
(Wakeup from Stop)
No
Exit
Stop Mode
Exit
Stop Mode
Exit
Stop Mode
SCM=1
?
Yes
Enter SCM
SCMIF not
set!
Enter
SCM
Enter
SCM
Enter
SCM
Continue w.
normal OP
Figure 5-22. Stop Mode Entry/Exit Sequence
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Chapter 5 Clocks and Reset Generator (S12CRGV6)
5.4.3.3.1
Wake-up from Pseudo Stop Mode (PSTP=1)
Wake-up from pseudo stop mode is the same as wake-up from wait mode. There are also four different
scenarios for the CRG to restart the MCU from pseudo stop mode:
•
•
•
•
External reset
Clock monitor fail
COP reset
Wake-up interrupt
If the MCU gets an external reset or COP reset during pseudo stop mode active, the CRG asynchronously
restores all configuration bits in the register space to its default settings and starts the reset generator. After
completing the reset sequence processing begins by fetching the normal or COP reset vector. pseudo stop
mode is left and the MCU is in run mode again.
If the clock monitor is enabled (CME = 1), the MCU is able to leave pseudo stop mode when loss of
oscillator/external clock is detected by a clock monitor fail. If the SCME bit is not asserted the CRG
generates a clock monitor fail reset (CMRESET). The CRG’s behavior for CMRESET is the same
compared to external reset, but another reset vector is fetched after completion of the reset sequence. If the
interrupt the CRG enters self-clock mode and starts the clock quality checker (Section 5.4.1.4, “Clock
Quality Checker”). Then the MCU continues with normal operation. If the SCM interrupt is blocked by
SCMIE=0, the SCMIF flag will be asserted but the CRG will not wake-up from pseudo stop mode.
If any other interrupt source (e.g., RTI) triggers exit from pseudo stop mode, the MCU immediately
continues with normal operation. Because the PLL has been powered-down during stop mode, the
PLLSEL bit is cleared and the MCU runs on OSCCLK after leaving stop mode. The software must set the
PLLSEL bit again, in order to switch system and core clocks to the PLLCLK.
Table 5-13 summarizes the outcome of a clock loss while in pseudo stop mode.
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 5 Clocks and Reset Generator (S12CRGV6)
Table 5-13. Outcome of Clock Loss in Pseudo Stop Mode
CME
SCME
SCMIE
CRG Actions
Clock failure -->
0
X
X
No action, clock loss not detected.
Clock failure -->
1
0
X
CRG performs Clock Monitor Reset immediately
Clock Monitor failure -->
Scenario 1: OSCCLK recovers prior to exiting pseudo stop mode.
– MCU remains in pseudo stop mode,
– VREG enabled,
– PLL enabled,
– SCM activated,
– Start clock quality check,
– Set SCMIF interrupt flag.
Some time later OSCCLK recovers.
– CM no longer indicates a failure,
– 4096 OSCCLK cycles later clock quality check indicates clock o.k.,
– SCM deactivated,
– PLL disabled,
– VREG disabled.
– MCU remains in pseudo stop mode.
Some time later either a wakeup interrupt occurs (no SCM interrupt)
– Exit pseudo stop mode using OSCCLK as system clock (SYSCLK),
– Continue normal operation.
1
1
0
or an External Reset is applied.
– Exit pseudo stop mode using OSCCLK as system clock,
– Start reset sequence.
Scenario 2: OSCCLK does not recover prior to exiting pseudo stop mode.
– MCU remains in pseudo stop mode,
– VREG enabled,
– PLL enabled,
– SCM activated,
– Start clock quality check,
– Set SCMIF interrupt flag,
– Keep performing clock quality checks (could continue infinitely) while
in pseudo stop mode.
Some time later either a wakeup interrupt occurs (no SCM interrupt)
– Exit pseudo stop mode in SCM using PLL clock (f
) as system clock
SCM
– Continue to perform additional clock quality checks until OSCCLK is o.k. again.
or an External RESET is applied.
– Exit pseudo stop mode in SCM using PLL clock (f
– Start reset sequence,
) as system clock
SCM
– Continue to perform additional clock quality checks until OSCCLK is o.k.again.
Clock failure -->
– VREG enabled,
– PLL enabled,
– SCM activated,
1
1
1
– Start clock quality check,
– SCMIF set.
SCMIF generates self clock mode wakeup interrupt.
– Exit pseudo stop mode in SCM using PLL clock (f
) as system clock,
SCM
– Continue to perform a additional clock quality checks until OSCCLK is o.k. again.
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 5 Clocks and Reset Generator (S12CRGV6)
5.4.3.3.2
Wake-up from Full Stop (PSTP = 0)
The MCU requires an external interrupt or an external reset in order to wake-up from stop-mode.
If the MCU gets an external reset during full stop mode active, the CRG asynchronously restores all
configuration bits in the register space to its default settings and will perform a maximum of 50 clock
check_windows (see Section 5.4.1.4, “Clock Quality Checker”). After completing the clock quality check
the CRG starts the reset generator. After completing the reset sequence processing begins by fetching the
normal reset vector. Full stop-mode is left and the MCU is in run mode again.
If the MCU is woken-up by an interrupt and the fast wake-up feature is disabled (FSTWKP = 0 or
SCME = 0), the CRG will also perform a maximum of 50 clock check_windows (see Section 5.4.1.4,
“Clock Quality Checker”). If the clock quality check is successful, the CRG will release all system and
core clocks and will continue with normal operation. If all clock checks within the Timeout-Window are
failing, the CRG will switch to self-clock mode or generate a clock monitor reset (CMRESET) depending
on the setting of the SCME bit.
If the MCU is woken-up by an interrupt and the fast wake-up feature is enabled (FSTWKP = 1 and
SCME = 1), the system will immediately resume operation in self-clock mode (see Section 5.4.1.4, “Clock
Quality Checker”). The SCMIF flag will not be set. The system will remain in self-clock mode with
oscillator disabled until FSTWKP bit is cleared. The clearing of FSTWKP will start the oscillator and the
clock quality check. If the clock quality check is successful, the CRG will switch all system clocks to
oscillator clock. The SCMIF flag will be set. See application examples in Figure 5-23 and Figure 5-24.
Because the PLL has been powered-down during stop-mode the PLLSEL bit is cleared and the MCU runs
on OSCCLK after leaving stop-mode. The software must manually set the PLLSEL bit again, in order to
switch system and core clocks to the PLLCLK.
NOTE
In full stop mode or self-clock mode caused by the fast wake-up feature, the
clock monitor and the oscillator are disabled.
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CPU resumes program execution immediately
Instruction
IRQ Service
IRQ Service
Interrupt
IRQ Service
STOP
FSTWKP=1
STOP
STOP
SCME=1
Interrupt
Interrupt
Power Saving
Oscillator Clock
Oscillator Disabled
PLL Clock
Core Clock
Self-Clock Mode
Figure 5-23. Fast Wake-up from Full Stop Mode: Example 1
.
CPU resumes program execution immediately
Instruction
Freq. Critical
Instr. Possible
Freq. Uncritical
Instructions
FSTWKP=1
SCME=1
IRQ Service
FSTWKP=0
STOP
SCMIE=1
IRQ Interrupt
SCM Interrupt
Clock Quality Check
Oscillator Clock
Oscillator Disabled
OSC Startup
PLL Clock
Core Clock
Self-Clock Mode
Figure 5-24. Fast Wake-up from Full Stop Mode: Example 2
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 5 Clocks and Reset Generator (S12CRGV6)
5.5
Resets
This section describes how to reset the MC9S12XDP512, and how the MC9S12XDP512 itself controls the
reset of the MCU. It explains all special reset requirements. Since the reset generator for the MCU is part
of the CRG, this section also describes all automatic actions that occur during or as a result of individual
reset conditions. The reset values of registers and signals are provided in Section 5.3, “Memory Map and
Register Definition”. All reset sources are listed in Table 5-14. Refer to MCU specification for related
vector addresses and priorities.
Table 5-14. Reset Summary
Reset Source
Local Enable
Power on Reset
Low Voltage Reset
External Reset
None
None
None
Illegal Address Reset
Clock Monitor Reset
COP Watchdog Reset
None
PLLCTL (CME = 1, SCME = 0)
COPCTL (CR[2:0] nonzero)
5.5.1
Description of Reset Operation
The reset sequence is initiated by any of the following events:
•
•
•
•
•
•
Low level is detected at the RESET pin (external reset)
Power on is detected
Low voltage is detected
Illegal Address Reset is detected (see S12XMMC Block Guide for details)
COP watchdog times out
Clock monitor failure is detected and self-clock mode was disabled (SCME=0)
Upon detection of any reset event, an internal circuit drives the RESET pin low for 128 SYSCLK cycles
(see Figure 5-25). Since entry into reset is asynchronous, it does not require a running SYSCLK. However,
the internal reset circuit of the MC9S12XDP512 cannot sequence out of current reset condition without a
running SYSCLK. The number of 128 SYSCLK cycles might be increased by n = 3 to 6 additional
SYSCLK cycles depending on the internal synchronization latency. After 128 + n SYSCLK cycles the
RESET pin is released. The reset generator of the MC9S12XDP512 waits for additional 64 SYSCLK
cycles and then samples the RESET pin to determine the originating source. Table 5-15 shows which
vector will be fetched.
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 5 Clocks and Reset Generator (S12CRGV6)
Table 5-15. Reset Vector Selection
Sampled RESET Pin
(64 cycles
Clock Monitor
Reset Pending
COP
Reset Pending
Vector Fetch
after release)
1
1
1
0
0
1
0
X
0
X
1
POR / LVR / Illegal Address Reset / External Reset
Clock Monitor Reset
COP Reset
X
POR / LVR / Illegal Address Reset / External Reset
with rise of RESET pin
NOTE
External circuitry connected to the RESET pin should not include a large
capacitance that would interfere with the ability of this signal to rise to a
valid logic 1 within 64 SYSCLK cycles after the low drive is released.
The internal reset of the MCU remains asserted while the reset generator completes the 192 SYSCLK long
reset sequence. The reset generator circuitry always makes sure the internal reset is deasserted
synchronously after completion of the 192 SYSCLK cycles. In case the RESET pin is externally driven
low for more than these 192 SYSCLK cycles (external reset), the internal reset remains asserted too.
RESET
) (
) (
CRG drives RESET pin low
RESET pin
released
)
(
)
)
(
SYSCLK
(
128 + n cycles
64 cycles
With n being
Possibly
Possibly
RESET
min 3 / max 6
cycles depending
on internal
synchronization
delay
SYSCLK
not
running
driven low
externally
Figure 5-25. RESET Timing
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Chapter 5 Clocks and Reset Generator (S12CRGV6)
5.5.2
Clock Monitor Reset
The MC9S12XDP512 generates a clock monitor reset in case all of the following conditions are true:
•
•
•
Clock monitor is enabled (CME = 1)
Loss of clock is detected
Self-clock mode is disabled (SCME = 0).
The reset event asynchronously forces the configuration registers to their default settings (see Section 5.3,
“Memory Map and Register Definition”). In detail the CME and the SCME are reset to logical ‘1’ (which
doesn’t change the state of the CME bit, because it has already been set). As a consequence the CRG
immediately enters self clock mode and starts its internal reset sequence. In parallel the clock quality check
starts. As soon as clock quality check indicates a valid oscillator clock the CRG switches to OSCCLK and
leaves self clock mode. Since the clock quality checker is running in parallel to the reset generator, the
CRG may leave self clock mode while still completing the internal reset sequence. When the reset
sequence is finished, the CRG checks the internally latched state of the clock monitor fail circuit. If a clock
monitor fail is indicated, processing begins by fetching the clock monitor reset vector.
5.5.3
Computer Operating Properly Watchdog (COP) Reset
When COP is enabled, the CRG expects sequential write of 0x_55 and 0x_AA (in this order) to the
ARMCOP register during the selected time-out period. Once this is done, the COP time-out period restarts.
If the program fails to do this the CRG will generate a reset. Also, if any value other than 0x_55 or 0x_AA
is written, the CRG immediately generates a reset. In case windowed COP operation is enabled writes
(0x_55 or 0x_AA) to the ARMCOP register must occur in the last 25% of the selected time-out period. A
premature write the CRG will immediately generate a reset.
As soon as the reset sequence is completed the reset generator checks the reset condition. If no clock
monitor failure is indicated and the latched state of the COP timeout is true, processing begins by fetching
the COP vector.
5.5.4
Power On Reset, Low Voltage Reset
The on-chip voltage regulator detects when V to the MCU has reached a certain level and asserts power
DD
on reset or low voltage reset or both. As soon as a power on reset or low voltage reset is triggered the CRG
performs a quality check on the incoming clock signal. As soon as clock quality check indicates a valid
oscillator clock signal, the reset sequence starts using the oscillator clock. If after 50 check windows the
clock quality check indicated a non-valid oscillator clock, the reset sequence starts using self-clock mode.
Figure 5-26 and Figure 5-27 show the power-up sequence for cases when the RESET pin is tied to V
and when the RESET pin is held low.
DD
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
307
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Chapter 5 Clocks and Reset Generator (S12CRGV6)
Clock Quality Check
(no Self-Clock Mode)
RESET
) (
Internal POR
) (
128 SYSCLK
Internal RESET
64 SYSCLK
) (
Figure 5-26. RESET Pin Tied to V (by a pull-up resistor)
DD
Clock Quality Check
(no Self Clock Mode)
RESET
) (
Internal POR
) (
128 SYSCLK
64 SYSCLK
Internal RESET
) (
Figure 5-27. RESET Pin Held Low Externally
5.6
Interrupts
The interrupts/reset vectors requested by the CRG are listed in Table 5-16. Refer to MCU specification for
related vector addresses and priorities.
Table 5-16. CRG Interrupt Vectors
CCR
Mask
Interrupt Source
Local Enable
Real time interrupt
LOCK interrupt
SCM interrupt
I bit
I bit
I bit
CRGINT (RTIE)
CRGINT (LOCKIE)
CRGINT (SCMIE)
5.6.1
Real Time Interrupt
The MC9S12XDP512 generates a real time interrupt when the selected interrupt time period elapses. RTI
interrupts are locally disabled by setting the RTIE bit to 0. The real time interrupt flag (RTIF) is set to1
when a timeout occurs, and is cleared to 0 by writing a 1 to the RTIF bit.
The RTI continues to run during pseudo stop mode if the PRE bit is set to 1. This feature can be used for
periodic wakeup from pseudo stop if the RTI interrupt is enabled.
MC9S12XDP512 Data Sheet, Rev. 2.11
308
Freescale Semiconductor
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Chapter 5 Clocks and Reset Generator (S12CRGV6)
5.6.2
PLL Lock Interrupt
The MC9S12XDP512 generates a PLL Lock interrupt when the LOCK condition of the PLL has changed,
either from a locked state to an unlocked state or vice versa. Lock interrupts are locally disabled by setting
the LOCKIE bit to 0. The PLL Lock interrupt flag (LOCKIF) is set to1 when the LOCK condition has
changed, and is cleared to 0 by writing a 1 to the LOCKIF bit.
5.6.3
Self Clock Mode Interrupt
The MC9S12XDP512 generates a self clock mode interrupt when the SCM condition of the system has
changed, either entered or exited self clock mode. SCM conditions can only change if the self clock mode
enable bit (SCME) is set to 1. SCM conditions are caused by a failing clock quality check after power on
reset (POR) or low voltage reset (LVR) or recovery from full stop mode (PSTP = 0) or clock monitor
failure. For details on the clock quality check refer to Section 5.4.1.4, “Clock Quality Checker”. If the
clock monitor is enabled (CME = 1) a loss of external clock will also cause a SCM condition (SCME = 1).
SCM interrupts are locally disabled by setting the SCMIE bit to 0. The SCM interrupt flag (SCMIF) is set
to1 when the SCM condition has changed, and is cleared to 0 by writing a 1 to the SCMIF bit.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
309
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Chapter 5 Clocks and Reset Generator (S12CRGV6)
MC9S12XDP512 Data Sheet, Rev. 2.11
310
Freescale Semiconductor
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Chapter 6
Pierce Oscillator (S12XOSCLCPV1)
6.1
Introduction
The Pierce oscillator (XOSC) module provides a robust, low-noise and low-power clock source. The
module will be operated from the V supply rail (2.5 V nominal) and require the minimum number
DDPLL
of external components. It is designed for optimal start-up margin with typical crystal oscillators.
6.1.1
Features
The XOSC will contain circuitry to dynamically control current gain in the output amplitude. This ensures
a signal with low harmonic distortion, low power and good noise immunity.
•
•
•
•
•
•
High noise immunity due to input hysteresis
Low RF emissions with peak-to-peak swing limited dynamically
Transconductance (gm) sized for optimum start-up margin for typical oscillators
Dynamic gain control eliminates the need for external current limiting resistor
Integrated resistor eliminates the need for external bias resistor
Low power consumption:
— Operates from 2.5 V (nominal) supply
— Amplitude control limits power
•
Clock monitor
6.1.2
Modes of Operation
Two modes of operation exist:
1. Loop controlled Pierce oscillator
2. External square wave mode featuring also full swing Pierce without internal feedback resistor
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
311
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Chapter 6 Pierce Oscillator (S12XOSCLCPV1)
6.1.3
Block Diagram
Figure 6-1 shows a block diagram of the XOSC.
Monitor_Failure
OSCCLK
Clock
Monitor
Peak
Detector
Gain Control
V
= 2.5 V
DDPLL
Rf
XTAL
EXTAL
Figure 6-1. XOSC Block Diagram
6.2
External Signal Description
This section lists and describes the signals that connect off chip
6.2.1
V
and V
— Operating and Ground Voltage Pins
SSPLL
DDPLL
Theses pins provides operating voltage (V
) and ground (V
) for the XOSC circuitry. This
DDPLL
SSPLL
allows the supply voltage to the XOSC to be independently bypassed.
6.2.2
EXTAL and XTAL — Input and Output Pins
These pins provide the interface for either a crystal or a CMOS compatible clock to control the internal
clock generator circuitry. EXTAL is the external clock input or the input to the crystal oscillator amplifier.
XTAL is the output of the crystal oscillator amplifier. The MCU internal system clock is derived from the
MC9S12XDP512 Data Sheet, Rev. 2.11
312
Freescale Semiconductor
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Chapter 6 Pierce Oscillator (S12XOSCLCPV1)
EXTAL input frequency. In full stop mode (PSTP = 0), the EXTAL pin is pulled down by an internal
resistor of typical 200 kΩ.
NOTE
Freescale recommends an evaluation of the application board and chosen
resonator or crystal by the resonator or crystal supplier.
Loop controlled circuit is not suited for overtone resonators and crystals.
EXTAL
C1
MCU
Crystal or
Ceramic Resonator
XTAL
C2
V
SSPLL
Figure 6-2. Loop Controlled Pierce Oscillator Connections (XCLKS = 0)
NOTE
Full swing Pierce circuit is not suited for overtone resonators and crystals
without a careful component selection.
EXTAL
C1
MCU
RB
Crystal or
Ceramic Resonator
RS*
XTAL
C2
V
SSPLL
* R can be zero (shorted) when use with higher frequency crystals.
s
Refer to manufacturer’s data.
Figure 6-3. Full Swing Pierce Oscillator Connections (XCLKS = 1)
CMOS Compatible
External Oscillator
EXTAL
MCU
(V
Level)
DDPLL
XTAL
Not Connected
Figure 6-4. External Clock Connections (XCLKS = 1)
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
313
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Chapter 6 Pierce Oscillator (S12XOSCLCPV1)
6.2.3
XCLKS — Input Signal
The XCLKS is an input signal which controls whether a crystal in combination with the internal loop
controlled (low power) Pierce oscillator is used or whether full swing Pierce oscillator/external clock
circuitry is used. Refer to the Device Overview chapter for polarity and sampling conditions of the XCLKS
pin. Table 6-1 lists the state coding of the sampled XCLKS signal.
.
Table 6-1. Clock Selection Based on XCLKS
XCLKS
Description
0
1
Loop controlled Pierce oscillator selected
Full swing Pierce oscillator/external clock selected
6.3
Memory Map and Register Definition
The CRG contains the registers and associated bits for controlling and monitoring the oscillator module.
6.4
Functional Description
The XOSC module has control circuitry to maintain the crystal oscillator circuit voltage level to an optimal
level which is determined by the amount of hysteresis being used and the maximum oscillation range.
The oscillator block has two external pins, EXTAL and XTAL. The oscillator input pin, EXTAL, is
intended to be connected to either a crystal or an external clock source. The selection of loop controlled
Pierce oscillator or full swing Pierce oscillator/external clock depends on the XCLKS signal which is
sampled during reset. The XTAL pin is an output signal that provides crystal circuit feedback.
A buffered EXTAL signal becomes the internal clock. To improve noise immunity, the oscillator is
powered by the V
and V
power supply pins.
DDPLL
SSPLL
6.4.1
Gain Control
A closed loop control system will be utilized whereby the amplifier is modulated to keep the output
waveform sinusoidal and to limit the oscillation amplitude. The output peak to peak voltage will be kept
above twice the maximum hysteresis level of the input buffer. Electrical specification details are provided
in the Electrical Characteristics appendix.
6.4.2
Clock Monitor
The clock monitor circuit is based on an internal RC time delay so that it can operate without any MCU
clocks. If no OSCCLK edges are detected within this RC time delay, the clock monitor indicates failure
which asserts self-clock mode or generates a system reset depending on the state of SCME bit. If the clock
monitor is disabled or the presence of clocks is detected no failure is indicated.The clock monitor function
is enabled/disabled by the CME control bit, described in the CRG block description chapter.
MC9S12XDP512 Data Sheet, Rev. 2.11
314
Freescale Semiconductor
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Chapter 6 Pierce Oscillator (S12XOSCLCPV1)
6.4.3
Wait Mode Operation
During wait mode, XOSC is not impacted.
6.4.4
Stop Mode Operation
XOSC is placed in a static state when the part is in stop mode except when pseudo-stop mode is enabled.
During pseudo-stop mode, XOSC is not impacted.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
315
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Chapter 6 Pierce Oscillator (S12XOSCLCPV1)
MC9S12XDP512 Data Sheet, Rev. 2.11
316
Freescale Semiconductor
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Chapter 7
Analog-to-Digital Converter (ATD10B16CV4)
7.1
Introduction
The ATD10B16C is a 16-channel, 10-bit, multiplexed input successive approximation analog-to-digital
converter. Refer to the Electrical Specifications chapter for ATD accuracy.
7.1.1
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
8-/10-bit resolution
7 µs, 10-bit single conversion time
Sample buffer amplifier
Programmable sample time
Left/right justified, signed/unsigned result data
External trigger control
Conversion completion interrupt generation
Analog input multiplexer for 16 analog input channels
Analog/digital input pin multiplexing
1 to 16 conversion sequence lengths
Continuous conversion mode
Multiple channel scans
Configurable external trigger functionality on any AD channel or any of four additional trigger
inputs. The four additional trigger inputs can be chip external or internal. Refer to device
specification for availability and connectivity
•
Configurable location for channel wrap around (when converting multiple channels in a sequence)
7.1.2
Modes of Operation
There is software programmable selection between performing single or continuous conversion on a
single channel or multiple channels.
7.1.3
Block Diagram
Refer to Figure 7-1 for a block diagram of the ATD0B16C block.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
317
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Chapter 7 Analog-to-Digital Converter (ATD10B16CV4)
Bus Clock
Clock
ATD clock
ATD10B16C
Prescaler
Trigger
Mux
ETRIG0
ETRIG1
ETRIG2
Sequence Complete
Interrupt
Mode and
Timing Control
ETRIG3
(see Device Overview
chapter for availability
and connectivity)
ATDDIEN
ATDCTL1
Results
ATD 0
ATD 1
ATD 2
ATD 3
ATD 4
ATD 5
ATD 6
ATD 7
ATD 8
ATD 9
ATD 10
ATD 11
ATD 12
ATD 13
ATD 14
ATD 15
PORTAD
V
DDA
V
SSA
Successive
V
RH
Approximation
Register (SAR)
and DAC
V
RL
AN15
AN14
AN13
AN12
AN11
AN10
AN9
+
Sample & Hold
1
-
1
AN8
Comparator
Analog
MUX
AN7
AN6
AN5
AN4
AN3
AN2
AN1
AN0
Figure 7-1. ATD10B16C Block Diagram
MC9S12XDP512 Data Sheet, Rev. 2.11
318
Freescale Semiconductor
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Chapter 7 Analog-to-Digital Converter (ATD10B16CV4)
7.2
External Signal Description
This section lists all inputs to the ATD10B16C block.
7.2.1
ANx (x = 15, 14, 13, 12, 11, 10, 9, 8, 7, 6, 5, 4, 3, 2, 1, 0) — Analog Input
Channel x Pins
This pin serves as the analog input channel x. It can also be configured as general-purpose digital input
and/or external trigger for the ATD conversion.
7.2.2
ETRIG3, ETRIG2, ETRIG1, ETRIG0 — External Trigger Pins
These inputs can be configured to serve as an external trigger for the ATD conversion.
Refer to the Device Overview chapter for availability and connectivity of these inputs.
7.2.3
V , V — High Reference Voltage Pin, Low Reference Voltage Pin
RL
RH
is the high reference voltage, V is the low reference voltage for ATD conversion.
V
RH
RL
7.2.4
V
, V
— Analog Circuitry Power Supply Pins
DDA
These pins are the power supplies for the analog circuitry of the MC9S12XDP512 block.
SSA
7.3
Memory Map and Register Definition
This section provides a detailed description of all registers accessible in the ATD10B16C.
Module Memory Map
Table 7-1 gives an overview of all ATD10B16C registers
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
319
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Chapter 7 Analog-to-Digital Converter (ATD10B16CV4)
.
Table 7-1. MC9S12XDP512 Memory Map
Address Offset
Use
Access
0x0000
0x0001
ATD Control Register 0 (ATDCTL0)
ATD Control Register 1 (ATDCTL1)
ATD Control Register 2 (ATDCTL2)
ATD Control Register 3 (ATDCTL3)
ATD Control Register 4 (ATDCTL4)
ATD Control Register 5 (ATDCTL5)
ATD Status Register 0 (ATDSTAT0)
Unimplemented
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0x0002
0x0003
0x0004
0x0005
0x0006
0x0007
1
0x0008
ATD Test Register 0 (ATDTEST0)
R
0x0009
ATD Test Register 1 (ATDTEST1)
ATD Status Register 2 (ATDSTAT2)
R/W
R
0x000A
0x000B
ATD Status Register 1 (ATDSTAT1)
R
0x000C
ATD Input Enable Register 0 (ATDDIEN0)
ATD Input Enable Register 1 (ATDDIEN1)
Port Data Register 0 (PORTAD0)
R/W
R/W
R
0x000D
0x000E
0x000F
Port Data Register 1 (PORTAD1)
R
0x0010, 0x0011
0x0012, 0x0013
0x0014, 0x0015
0x0016, 0x0017
0x0018, 0x0019
0x001A, 0x001B
0x001C, 0x001D
0x001E, 0x001F
0x0020, 0x0021
0x0022, 0x0023
0x0024, 0x0025
0x0026, 0x0027
0x0028, 0x0029
0x002A, 0x002B
0x002C, 0x002D
0x002E, 0x002F
ATD Result Register 0 (ATDDR0H, ATDDR0L)
ATD Result Register 1 (ATDDR1H, ATDDR1L)
ATD Result Register 2 (ATDDR2H, ATDDR2L)
ATD Result Register 3 (ATDDR3H, ATDDR3L)
ATD Result Register 4 (ATDDR4H, ATDDR4L)
ATD Result Register 5 (ATDDR5H, ATDDR5L)
ATD Result Register 6 (ATDDR6H, ATDDR6L)
ATD Result Register 7 (ATDDR7H, ATDDR7L)
ATD Result Register 8 (ATDDR8H, ATDDR8L)
ATD Result Register 9 (ATDDR9H, ATDDR9L)
ATD Result Register 10 (ATDDR10H, ATDDR10L)
ATD Result Register 11 (ATDDR11H, ATDDR11L)
ATD Result Register 12 (ATDDR12H, ATDDR12L)
ATD Result Register 13 (ATDDR13H, ATDDR13L)
ATD Result Register 14 (ATDDR14H, ATDDR14L)
ATD Result Register 15 (ATDDR15H, ATDDR15L)
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
1
ATDTEST0 is intended for factory test purposes only.
NOTE
Register Address = Base Address + Address Offset, where the Base Address
is defined at the MCU level and the Address Offset is defined at the module
level.
MC9S12XDP512 Data Sheet, Rev. 2.11
320
Freescale Semiconductor
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Chapter 7 Analog-to-Digital Converter (ATD10B16CV4)
7.3.2
Register Descriptions
This section describes in address order all the ATD10B16C registers and their individual bits.
Register
Name
Bit 7
6
5
4
3
2
1
Bit 0
0x0000
ATDCTL0
R
0
0
0
0
WRAP3
WRAP2
WRAP1
WRAP0
W
0x0001
ATDCTL1
R
0
0
0
ETRIGSEL
ETRIGCH3 ETRIGCH2 ETRIGCH1 ETRIGCH0
ASCIF
W
0x0002
ATDCTL2
R
ADPU
0
AFFC
S8C
AWAI
S4C
ETRIGLE
S2C
ETRIGP
ETRIGE
ASCIE
FRZ1
PRS1
W
0x0003
ATDCTL3
R
S1C
FIFO
FRZ0
PRS0
W
0x0004
ATDCTL4
R
SRES8
DJM
SMP1
SMP0
SCAN
ETORF
PRS4
PRS3
PRS2
W
0x0005
ATDCTL5
R
DSGN
0
MULT
CD
CC
CB
CA
W
0x0006
ATDSTAT0
R
CC3
CC2
CC1
CC0
SCF
FIFOR
W
0x0007
R
Unimplemented
W
0x0008
R
Unimplemented
ATDTEST0
W
0x0009
ATDTEST1
R
Unimplemented
CCF12
SC
W
0x000A
ATDSTAT2
R
CCF15
CCF7
CCF14
CCF6
CCF13
CCF5
CCF11
CCF3
CCF10
CCF2
CCF9
CCF1
CCF8
W
0x000B
ATDSTAT1
R
CCF4
CCF0
IEN8
W
0x000C
ATDDIEN0
R
IEN15
IEN14
IEN13
IEN12
IEN11
IEN10
IEN9
W
= Unimplemented or Reserved
u = Unaffected
Figure 7-2. ATD Register Summary
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
321
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Chapter 7 Analog-to-Digital Converter (ATD10B16CV4)
Register
Bit 7
6
5
4
3
2
1
Bit 0
IEN0
Name
0x000D
ATDDIEN1
R
IEN7
IEN6
IEN5
IEN4
IEN3
IEN2
IEN1
PTAD9
W
0x000E
R
PTAD15
PTAD14
PTAD13
PTAD12
PTAD11
PTAD10
PTAD8
PORTAD0
W
0x000F
R
PTAD7
PTAD6
PTAD5
PTAD4
PTAD3
PTAD2
PTAD1
PTAD0
PORTAD1
W
R BIT 9 MSB
BIT 7 MSB
BIT 8
BIT 6
BIT 7
BIT 5
BIT 6
BIT 4
BIT 5
BIT 3
BIT 4
BIT 2
BIT 3
BIT 1
BIT 2
BIT 0
0x0010–0x002F
ATDDRxH–
ATDDRxL
W
R
BIT 1
u
BIT 0
u
0
0
0
0
0
0
0
0
0
0
0
0
W
= Unimplemented or Reserved
u = Unaffected
Figure 7-2. ATD Register Summary (continued)
7.3.2.1
ATD Control Register 0 (ATDCTL0)
Writes to this register will abort current conversion sequence but will not start a new sequence.
Module Base + 0x0000
7
6
5
4
3
2
1
0
R
W
0
0
0
0
WRAP3
WRAP2
WRAP1
WRAP0
Reset
0
0
0
0
1
1
1
1
= Unimplemented or Reserved
Figure 7-3. ATD Control Register 0 (ATDCTL0)
Read: Anytime
Write: Anytime
Table 7-2. ATDCTL0 Field Descriptions
Description
Field
3:0
Wrap Around Channel Select Bits — These bits determine the channel for wrap around when doing
WRAP[3:0] multi-channel conversions. The coding is summarized in Table 7-3.
MC9S12XDP512 Data Sheet, Rev. 2.11
322
Freescale Semiconductor
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Chapter 7 Analog-to-Digital Converter (ATD10B16CV4)
Table 7-3. Multi-Channel Wrap Around Coding
Multiple Channel Conversions
(MULT = 1) Wrap Around to AN0
after Converting
WRAP3
WRAP2
WRAP1
WRAP0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
Reserved
AN1
AN2
AN3
AN4
AN5
AN6
AN7
AN8
AN9
AN10
AN11
AN12
AN13
AN14
AN15
7.3.2.2
ATD Control Register 1 (ATDCTL1)
Writes to this register will abort current conversion sequence but will not start a new sequence.
Module Base + 0x0001
7
6
5
4
3
2
1
0
R
W
0
0
0
ETRIGSEL
ETRIGCH3 ETRIGCH2 ETRIGCH1 ETRIGCH0
Reset
0
0
0
0
1
1
1
1
= Unimplemented or Reserved
Figure 7-4. ATD Control Register 1 (ATDCTL1)
Read: Anytime
Write: Anytime
Table 7-4. ATDCTL1 Field Descriptions
Description
Field
7
External Trigger Source Select — This bit selects the external trigger source to be either one of the AD
ETRIGSEL channels or one of the ETRIG[3:0] inputs. See device specification for availability and connectivity of
ETRIG[3:0] inputs. If ETRIG[3:0] input option is not available, writing a 1 to ETRISEL only sets the bit but has
no effect, that means one of the AD channels (selected by ETRIGCH[3:0]) remains the source for external
trigger. The coding is summarized in Table 7-5.
3:0
External Trigger Channel Select — These bits select one of the AD channels or one of the ETRIG[3:0] inputs
ETRIGCH[3:0] as source for the external trigger. The coding is summarized in Table 7-5.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
323
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Chapter 7 Analog-to-Digital Converter (ATD10B16CV4)
Table 7-5. External Trigger Channel Select Coding
ETRIGSEL ETRIGCH3 ETRIGCH2 ETRIGCH1 ETRIGCH0
External Trigger Source
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
X
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
X
X
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
X
X
AN0
AN1
AN2
AN3
AN4
AN5
AN6
AN7
AN8
AN9
AN10
AN11
AN12
AN13
AN14
AN15
1
ETRIG0
1
ETRIG1
1
ETRIG2
1
ETRIG3
Reserved
Reserved
1
Only if ETRIG[3:0] input option is available (see device specification), else ETRISEL is ignored, that means
external trigger source remains on one of the AD channels selected by ETRIGCH[3:0]
7.3.2.3
ATD Control Register 2 (ATDCTL2)
This register controls power down, interrupt and external trigger. Writes to this register will abort current
conversion sequence but will not start a new sequence.
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Chapter 7 Analog-to-Digital Converter (ATD10B16CV4)
Module Base + 0x0002
7
6
5
4
3
2
1
0
R
ASCIF
ADPU
W
AFFC
AWAI
ETRIGLE
ETRIGP
ETRIGE
ASCIE
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 7-5. ATD Control Register 2 (ATDCTL2)
Read: Anytime
Write: Anytime
Table 7-6. ATDCTL2 Field Descriptions
Description
Field
7
ATD Power Down — This bit provides on/off control over the ATD10B16C block allowing reduced MCU power
ADPU
consumption. Because analog electronic is turned off when powered down, the ATD requires a recovery time
period after ADPU bit is enabled.
0 Power down ATD
1 Normal ATD functionality
6
ATD Fast Flag Clear All
AFFC
0 ATD flag clearing operates normally (read the status register ATDSTAT1 before reading the result register
to clear the associate CCF flag).
1 Changes all ATD conversion complete flags to a fast clear sequence. Any access to a result register will
cause the associate CCF flag to clear automatically.
5
ATD Power Down in Wait Mode — When entering Wait Mode this bit provides on/off control over the
ATD10B16C block allowing reduced MCU power. Because analog electronic is turned off when powered down,
the ATD requires a recovery time period after exit from Wait mode.
AWAI
0 ATD continues to run in Wait mode
1 Halt conversion and power down ATD during Wait mode
After exiting Wait mode with an interrupt conversion will resume. But due to the recovery time the result of
this conversion should be ignored.
4
External Trigger Level/Edge Control — This bit controls the sensitivity of the external trigger signal. See
ETRIGLE
Table 7-7 for details.
3
External Trigger Polarity — This bit controls the polarity of the external trigger signal. See Table 7-7 for
ETRIGP
details.
2
External Trigger Mode Enable — This bit enables the external trigger on one of the AD channels or one of
ETRIGE
the ETRIG[3:0] inputs as described in Table 7-5. If external trigger source is one of the AD channels, the digital
input buffer of this channel is enabled. The external trigger allows to synchronize the start of conversion with
external events.
0 Disable external trigger
1 Enable external trigger
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 7 Analog-to-Digital Converter (ATD10B16CV4)
Table 7-6. ATDCTL2 Field Descriptions (continued)
Field
Description
1
ATD Sequence Complete Interrupt Enable
ASCIE
0 ATD Sequence Complete interrupt requests are disabled.
0
ATD Sequence Complete Interrupt Flag — If ASCIE = 1 the ASCIF flag equals the SCF flag (see
Section 7.3.2.7, “ATD Status Register 0 (ATDSTAT0)”), else ASCIF reads zero. Writes have no effect.
0 No ATD interrupt occurred
ASCIF
1 ATD sequence complete interrupt pending
Table 7-7. External Trigger Configurations
ETRIGLE
ETRIGP
External Trigger Sensitivity
0
0
1
1
0
1
0
1
Falling Edge
Ring Edge
Low Level
High Level
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Chapter 7 Analog-to-Digital Converter (ATD10B16CV4)
7.3.2.4
ATD Control Register 3 (ATDCTL3)
This register controls the conversion sequence length, FIFO for results registers and behavior in Freeze
Mode. Writes to this register will abort current conversion sequence but will not start a new sequence.
Module Base + 0x0003
7
6
5
4
3
2
1
0
R
W
0
S8C
S4C
S2C
S1C
FIFO
FRZ1
FRZ0
Reset
0
0
1
0
0
0
0
0
= Unimplemented or Reserved
Figure 7-6. ATD Control Register 3 (ATDCTL3)
Read: Anytime
Write: Anytime
Table 7-8. ATDCTL3 Field Descriptions
Description
Field
6
S8C
Conversion Sequence Length — This bit controls the number of conversions per sequence. Table 7-9 shows
all combinations. At reset, S4C is set to 1 (sequence length is 4). This is to maintain software continuity to HC12
Family.
5
S4C
Conversion Sequence Length — This bit controls the number of conversions per sequence. Table 7-9 shows
all combinations. At reset, S4C is set to 1 (sequence length is 4). This is to maintain software continuity to HC12
Family.
4
S2C
Conversion Sequence Length — This bit controls the number of conversions per sequence. Table 7-9 shows
all combinations. At reset, S4C is set to 1 (sequence length is 4). This is to maintain software continuity to HC12
Family.
3
S1C
Conversion Sequence Length — This bit controls the number of conversions per sequence. Table 7-9 shows
all combinations. At reset, S4C is set to 1 (sequence length is 4). This is to maintain software continuity to HC12
Family.
2
Result Register FIFO Mode —If this bit is zero (non-FIFO mode), the A/D conversion results map into the
result registers based on the conversion sequence; the result of the first conversion appears in the first result
register, the second result in the second result register, and so on.
FIFO
If this bit is one (FIFO mode) the conversion counter is not reset at the beginning or ending of a conversion
sequence; conversion results are placed in consecutive result registers between sequences. The result
register counter wraps around when it reaches the end of the result register file. The conversion counter value
in ATDSTAT0 can be used to determine where in the result register file, the current conversion result will be
placed.
Finally, which result registers hold valid data can be tracked using the conversion complete flags. Fast flag clear
mode may or may not be useful in a particular application to track valid data.
0 Conversion results are placed in the corresponding result register up to the selected sequence length.
1 Conversion results are placed in consecutive result registers (wrap around at end).
1:0
FRZ[1:0]
Background Debug Freeze Enable — When debugging an application, it is useful in many cases to have the
ATD pause when a breakpoint (Freeze Mode) is encountered. These 2 bits determine how the ATD will respond
to a breakpoint as shown in Table 7-10. Leakage onto the storage node and comparator reference capacitors
may compromise the accuracy of an immediately frozen conversion depending on the length of the freeze
period.
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 7 Analog-to-Digital Converter (ATD10B16CV4)
Table 7-9. Conversion Sequence Length Coding
Number of Conversions
per Sequence
S8C
S4C
S2C
S1C
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
16
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
Table 7-10. ATD Behavior in Freeze Mode (Breakpoint)
FRZ1
FRZ0
Behavior in Freeze Mode
0
0
1
1
0
1
0
1
Continue conversion
Reserved
Finish current conversion, then freeze
Freeze Immediately
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Chapter 7 Analog-to-Digital Converter (ATD10B16CV4)
7.3.2.5
ATD Control Register 4 (ATDCTL4)
This register selects the conversion clock frequency, the length of the second phase of the sample time and
the resolution of the A/D conversion (i.e., 8-bits or 10-bits). Writes to this register will abort current
conversion sequence but will not start a new sequence.
Module Base + 0x0004
7
6
5
4
3
2
1
0
R
W
SRES8
SMP1
SMP0
PRS4
PRS3
PRS2
PRS1
PRS0
Reset
0
0
0
0
0
1
0
1
Figure 7-7. ATD Control Register 4 (ATDCTL4)
Read: Anytime
Write: Anytime
Table 7-11. ATDCTL4 Field Descriptions
Description
Field
7
A/D Resolution Select — This bit selects the resolution of A/D conversion results as either 8 or 10 bits. The
SRES8
A/D converter has an accuracy of 10 bits. However, if low resolution is required, the conversion can be speeded
up by selecting 8-bit resolution.
0 10 bit resolution
1 8 bit resolution
6:5
SMP[1:0]
Sample Time Select —These two bits select the length of the second phase of the sample time in units of ATD
conversion clock cycles. Note that the ATD conversion clock period is itself a function of the prescaler value
(bits PRS4-0). The sample time consists of two phases. The first phase is two ATD conversion clock cycles
long and transfers the sample quickly (via the buffer amplifier) onto the A/D machine’s storage node. The
second phase attaches the external analog signal directly to the storage node for final charging and high
accuracy. Table 7-12 lists the lengths available for the second sample phase.
4:0
ATD Clock Prescaler — These 5 bits are the binary value prescaler value PRS. The ATD conversion clock
PRS[4:0]
frequency is calculated as follows:
[BusClock]
ATDclock =
× 0.5
--------------------------------
[PRS + 1]
Note: The maximum ATD conversion clock frequency is half the bus clock. The default (after reset) prescaler
value is 5 which results in a default ATD conversion clock frequency that is bus clock divided by 12.
Table 7-13 illustrates the divide-by operation and the appropriate range of the bus clock.
Table 7-12. Sample Time Select
SMP1
SMP0
Length of 2nd Phase of Sample Time
0
0
1
1
0
1
0
1
2 A/D conversion clock periods
4 A/D conversion clock periods
8 A/D conversion clock periods
16 A/D conversion clock periods
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 7 Analog-to-Digital Converter (ATD10B16CV4)
Table 7-13. Clock Prescaler Values
Total Divisor
Value
1
2
Prescale Value
Max. Bus Clock
Min. Bus Clock
00000
00001
00010
00011
00100
00101
00110
00111
01000
01001
01010
01011
01100
01101
01110
01111
10000
10001
10010
10011
10100
10101
10110
10111
11000
11001
11010
11011
11100
11101
11110
11111
Divide by 2
Divide by 4
4 MHz
8 MHz
1 MHz
2 MHz
Divide by 6
12 MHz
16 MHz
20 MHz
24 MHz
28 MHz
32 MHz
36 MHz
40 MHz
44 MHz
48 MHz
52 MHz
56 MHz
60 MHz
64 MHz
68 MHz
72 MHz
76 MHz
80 MHz
84 MHz
88 MHz
92 MHz
96 MHz
100 MHz
104 MHz
108 MHz
112 MHz
116 MHz
120 MHz
124 MHz
128 MHz
3 MHz
Divide by 8
4 MHz
Divide by 10
Divide by 12
Divide by 14
Divide by 16
Divide by 18
Divide by 20
Divide by 22
Divide by 24
Divide by 26
Divide by 28
Divide by 30
Divide by 32
Divide by 34
Divide by 36
Divide by 38
Divide by 40
Divide by 42
Divide by 44
Divide by 46
Divide by 48
Divide by 50
Divide by 52
Divide by 54
Divide by 56
Divide by 58
Divide by 60
Divide by 62
Divide by 64
5 MHz
6 MHz
7 MHz
8 MHz
9 MHz
10 MHz
11 MHz
12 MHz
13 MHz
14 MHz
15 MHz
16 MHz
17 MHz
18 MHz
19 MHz
20 MHz
21 MHz
22 MHz
23 MHz
24 MHz
25 MHz
26 MHz
27 MHz
28 MHz
29 MHz
30 MHz
31 MHz
32 MHz
1
2
Maximum ATD conversion clock frequency is 2 MHz. The maximum allowed bus clock frequency is
shown in this column.
Minimum ATD conversion clock frequency is 500 kHz. The minimum allowed bus clock frequency is
shown in this column.
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Chapter 7 Analog-to-Digital Converter (ATD10B16CV4)
7.3.2.6
ATD Control Register 5 (ATDCTL5)
This register selects the type of conversion sequence and the analog input channels sampled. Writes to this
register will abort current conversion sequence and start a new conversion sequence. If external trigger is
enabled (ETRIGE = 1) an initial write to ATDCTL5 is required to allow starting of a conversion sequence
which will then occur on each trigger event. Start of conversion means the beginning of the sampling
phase.
Module Base + 0x0005
7
6
5
4
3
2
1
0
R
W
DJM
DSGN
SCAN
MULT
CD
CC
CB
CA
Reset
0
0
0
0
0
0
0
0
Figure 7-8. ATD Control Register 5 (ATDCTL5)
Read: Anytime
Write: Anytime
Table 7-14. ATDCTL5 Field Descriptions
Description
Field
7
DJM
Result Register Data Justification — This bit controls justification of conversion data in the result registers.
See Section 7.3.2.16, “ATD Conversion Result Registers (ATDDRx)” for details.
0 Left justified data in the result registers.
1 Right justified data in the result registers.
6
Result Register Data Signed or Unsigned Representation — This bit selects between signed and unsigned
conversion data representation in the result registers. Signed data is represented as 2’s complement. Signed
data is not available in right justification. See <st-bold>7.3.2.16 ATD Conversion Result Registers (ATDDRx)
for details.
DSGN
1 Signed data representation in the result registers.
Table 7-15 summarizes the result data formats available and how they are set up using the control bits.
Table 7-16 illustrates the difference between the signed and unsigned, left justified output codes for an input
signal range between 0 and 5.12 Volts.
5
Continuous Conversion Sequence Mode — This bit selects whether conversion sequences are performed
continuously or only once. If external trigger is enabled (ETRIGE=1) setting this bit has no effect, that means
each trigger event starts a single conversion sequence.
SCAN
0 Single conversion sequence
1 Continuous conversion sequences (scan mode)
4
Multi-Channel Sample Mode — When MULT is 0, the ATD sequence controller samples only from the
specified analog input channel for an entire conversion sequence. The analog channel is selected by channel
selection code (control bits CD/CC/CB/CA located in ATDCTL5). When MULT is 1, the ATD sequence controller
samples across channels. The number of channels sampled is determined by the sequence length value (S8C,
S4C, S2C, S1C). The first analog channel examined is determined by channel selection code (CC, CB, CA
control bits); subsequent channels sampled in the sequence are determined by incrementing the channel
selection code or wrapping around to AN0 (channel 0.
MULT
0 Sample only one channel
1 Sample across several channels
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 7 Analog-to-Digital Converter (ATD10B16CV4)
Table 7-14. ATDCTL5 Field Descriptions (continued)
Field
Description
3:0
C[D:A}
Analog Input Channel Select Code — These bits select the analog input channel(s) whose signals are
sampled and converted to digital codes. Table 7-17 lists the coding used to select the various analog input
channels.
In the case of single channel conversions (MULT = 0), this selection code specified the channel to be examined.
In the case of multiple channel conversions (MULT = 1), this selection code represents the first channel to be
examined in the conversion sequence. Subsequent channels are determined by incrementing the channel
selection code or wrapping around to AN0 (after converting the channel defined by the Wrap Around Channel
Select Bits WRAP[3:0] in ATDCTL0). In case starting with a channel number higher than the one defined by
WRAP[3:0] the first wrap around will be AN15 to AN0.
Table 7-15. Available Result Data Formats.
Result Data Formats
Description and Bus Bit Mapping
SRES8
DJM
DSGN
1
1
1
0
0
0
0
0
1
0
0
1
0
1
X
0
1
X
8-bit / left justified / unsigned — bits 15:8
8-bit / left justified / signed — bits 15:8
8-bit / right justified / unsigned — bits 7:0
10-bit / left justified / unsigned — bits 15:6
10-bit / left justified / signed -— bits 15:6
10-bit / right justified / unsigned — bits 9:0
Table 7-16. Left Justified, Signed and Unsigned ATD Output Codes.
Input Signal
Signed
8-Bit Codes
Unsigned
8-Bit Codes
Signed
10-Bit Codes
Unsigned
10-Bit Codes
V
= 0 Volts
RL
V
= 5.12 Volts
RH
5.120 Volts
5.100
7F
7F
7E
FF
FF
FE
7FC0
7F00
7E00
FFC0
FF00
FE00
5.080
2.580
2.560
2.540
01
00
FF
81
80
7F
0100
0000
FF00
8100
8000
7F00
0.020
0.000
81
80
01
00
8100
8000
0100
0000
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Chapter 7 Analog-to-Digital Converter (ATD10B16CV4)
Table 7-17. Analog Input Channel Select Coding
Analog Input
Channel
CD
CC
CB
CA
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
AN0
AN1
AN2
AN3
AN4
AN5
AN6
AN7
AN8
AN9
AN10
AN11
AN12
AN13
AN14
AN15
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Chapter 7 Analog-to-Digital Converter (ATD10B16CV4)
7.3.2.7
ATD Status Register 0 (ATDSTAT0)
This read-only register contains the Sequence Complete Flag, overrun flags for external trigger and FIFO
mode, and the conversion counter.
Module Base + 0x0006
7
6
5
4
3
2
1
0
R
W
0
CC3
CC2
CC1
CC0
SCF
ETORF
FIFOR
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 7-9. ATD Status Register 0 (ATDSTAT0)
Read: Anytime
Write: Anytime (No effect on CC[3:0])
Table 7-18. ATDSTAT0 Field Descriptions
Field
Description
7
SCF
Sequence Complete Flag — This flag is set upon completion of a conversion sequence. If conversion
sequences are continuously performed (SCAN = 1), the flag is set after each one is completed. This flag is
cleared when one of the following occurs:
• Write “1” to SCF
• Write to ATDCTL5 (a new conversion sequence is started)
• If AFFC = 1 and read of a result register
0 Conversion sequence not completed
1 Conversion sequence has completed
5
External Trigger Overrun Flag —While in edge trigger mode (ETRIGLE = 0), if additional active edges are
detected while a conversion sequence is in process the overrun flag is set. This flag is cleared when one of the
following occurs:
ETORF
• Write “1” to ETORF
• Write to ATDCTL0,1,2,3,4 (a conversion sequence is aborted)
• Write to ATDCTL5 (a new conversion sequence is started)
0 No External trigger over run error has occurred
1 External trigger over run error has occurred
4
FIFO Over Run Flag — This bit indicates that a result register has been written to before its associated
conversion complete flag (CCF) has been cleared. This flag is most useful when using the FIFO mode because
the flag potentially indicates that result registers are out of sync with the input channels. However, it is also
practical for non-FIFO modes, and indicates that a result register has been over written before it has been read
(i.e., the old data has been lost). This flag is cleared when one of the following occurs:
• Write “1” to FIFOR
FIFOR
• Start a new conversion sequence (write to ATDCTL5 or external trigger)
0 No over run has occurred
1 Overrun condition exists (result register has been written while associated CCFx flag remained set)
3:0
CC[3:0}
Conversion Counter — These 4 read-only bits are the binary value of the conversion counter. The conversion
counter points to the result register that will receive the result of the current conversion. For example, CC3 = 0,
CC2 = 1, CC1 = 1, CC0 = 0 indicates that the result of the current conversion will be in ATD Result Register 6.
If in non-FIFO mode (FIFO = 0) the conversion counter is initialized to zero at the begin and end of the
conversion sequence. If in FIFO mode (FIFO = 1) the register counter is not initialized. The conversion
counters wraps around when its maximum value is reached.
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Chapter 7 Analog-to-Digital Converter (ATD10B16CV4)
7.3.2.8
Reserved Register 0 (ATDTEST0)
Module Base + 0x0008
7
6
5
4
3
2
1
0
R
W
u
1
u
u
u
u
u
u
u
Reset
0
0
0
0
0
0
0
= Unimplemented or Reserved
u = Unaffected
Figure 7-10. Reserved Register 0 (ATDTEST0)
Read: Anytime, returns unpredictable values
Write: Anytime in special modes, unimplemented in normal modes
NOTE
Writing to this register when in special modes can alter functionality.
7.3.2.9
ATD Test Register 1 (ATDTEST1)
This register contains the SC bit used to enable special channel conversions.
Module Base + 0x0009
7
6
5
4
3
2
1
0
R
W
u
u
u
u
u
u
u
SC
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
u = Unaffected
Figure 7-11. Reserved Register 1 (ATDTEST1)
Read: Anytime, returns unpredictable values for bit 7 and bit 6
Write: Anytime
NOTE
Writing to this register when in special modes can alter functionality.
Table 7-19. ATDTEST1 Field Descriptions
Description
Field
0
SC
Special Channel Conversion Bit — If this bit is set, then special channel conversion can be selected using
CC, CB, and CA of ATDCTL5. Table 7-20 lists the coding.
0 Special channel conversions disabled
1 Special channel conversions enabled
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 7 Analog-to-Digital Converter (ATD10B16CV4)
Table 7-20. Special Channel Select Coding
SC
CD
CC
CB
CA
Analog Input Channel
1
1
1
1
1
1
0
0
0
0
0
1
0
1
1
1
1
X
X
0
0
1
1
X
X
0
1
0
1
X
Reserved
V
RH
V
RL
(V +V ) / 2
RH
RL
Reserved
Reserved
7.3.2.10 ATD Status Register 2 (ATDSTAT2)
This read-only register contains the Conversion Complete Flags CCF15 to CCF8.
Module Base + 0x000A
7
6
5
4
3
2
1
0
R
W
CCF15
CCF14
CCF13
CCF12
CCF11
CCF10
CCF9
CCF8
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 7-12. ATD Status Register 2 (ATDSTAT2)
Read: Anytime
Write: Anytime, no effect
Table 7-21. ATDSTAT2 Field Descriptions
Description
Field
7:0
CCF[15:8]
Conversion Complete Flag Bits — A conversion complete flag is set at the end of each conversion in a
conversion sequence. The flags are associated with the conversion position in a sequence (and also the result
register number). Therefore, CCF8 is set when the ninth conversion in a sequence is complete and the result
is available in result register ATDDR8; CCF9 is set when the tenth conversion in a sequence is complete and
the result is available in ATDDR9, and so forth. A flag CCFx (x = 15, 14, 13, 12, 11, 10, 9, 8) is cleared when
one of the following occurs:
• Write to ATDCTL5 (a new conversion sequence is started)
• If AFFC = 0 and read of ATDSTAT2 followed by read of result register ATDDRx
• If AFFC = 1 and read of result register ATDDRx
In case of a concurrent set and clear on CCFx: The clearing by method A) will overwrite the set. The clearing
by methods B) or C) will be overwritten by the set.
0 Conversion number x not completed
1 Conversion number x has completed, result ready in ATDDRx
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Chapter 7 Analog-to-Digital Converter (ATD10B16CV4)
7.3.2.11 ATD Status Register 1 (ATDSTAT1)
This read-only register contains the Conversion Complete Flags CCF7 to CCF0
Module Base + 0x000B
7
6
5
4
3
2
1
0
R
W
CCF7
CCF6
CCF5
CCF4
CCF3
CCF2
CCF1
CCF0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 7-13. ATD Status Register 1 (ATDSTAT1)
Read: Anytime
Write: Anytime, no effect
Table 7-22. ATDSTAT1 Field Descriptions
Description
Field
7:0
CCF[7:0]
Conversion Complete Flag Bits — A conversion complete flag is set at the end of each conversion in a
conversion sequence. The flags are associated with the conversion position in a sequence (and also the result
register number). Therefore, CCF0 is set when the first conversion in a sequence is complete and the result is
available in result register ATDDR0; CCF1 is set when the second conversion in a sequence is complete and
the result is available in ATDDR1, and so forth. A CCF flag is cleared when one of the following occurs:
• Write to ATDCTL5 (a new conversion sequence is started)
• If AFFC = 0 and read of ATDSTAT1 followed by read of result register ATDDRx
• If AFFC = 1 and read of result register ATDDRx
In case of a concurrent set and clear on CCFx: The clearing by method A) will overwrite the set. The clearing
by methods B) or C) will be overwritten by the set.
Conversion number x not completed
Conversion number x has completed, result ready in ATDDRx
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Chapter 7 Analog-to-Digital Converter (ATD10B16CV4)
7.3.2.12 ATD Input Enable Register 0 (ATDDIEN0)
Module Base + 0x000C
7
6
5
4
3
2
1
0
R
W
IEN15
IEN14
IEN13
IEN12
IEN11
IEN10
IEN9
IEN8
Reset
0
0
0
0
0
0
0
0
Figure 7-14. ATD Input Enable Register 0 (ATDDIEN0)
Read: Anytime
Write: anytime
Table 7-23. ATDDIEN0 Field Descriptions
Description
Field
7:0
IEN[15:8]
ATD Digital Input Enable on Channel Bits — This bit controls the digital input buffer from the analog input
pin (ANx) to PTADx data register.
0 Disable digital input buffer to PTADx
1 Enable digital input buffer to PTADx.
Note: Setting this bit will enable the corresponding digital input buffer continuously. If this bit is set while
simultaneously using it as an analog port, there is potentially increased power consumption because the
digital input buffer maybe in the linear region.
7.3.2.13 ATD Input Enable Register 1 (ATDDIEN1)
Module Base + 0x000D
7
6
5
4
3
2
1
0
R
W
IEN7
IEN6
IEN5
IEN4
IEN3
IEN2
IEN1
IEN0
Reset
0
0
0
0
0
0
0
0
Figure 7-15. ATD Input Enable Register 1 (ATDDIEN1)
Read: Anytime
Write: Anytime
Table 7-24. ATDDIEN1 Field Descriptions
Description
Field
7:0
IEN[7:0]
ATD Digital Input Enable on Channel Bits — This bit controls the digital input buffer from the analog input
pin (ANx) to PTADx data register.
0 Disable digital input buffer to PTADx
1 Enable digital input buffer to PTADx.
Note: Setting this bit will enable the corresponding digital input buffer continuously. If this bit is set while
simultaneously using it as an analog port, there is potentially increased power consumption because the
digital input buffer maybe in the linear region.
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Chapter 7 Analog-to-Digital Converter (ATD10B16CV4)
7.3.2.14 Port Data Register 0 (PORTAD0)
The data port associated with the ATD is input-only. The port pins are shared with the analog A/D inputs
AN[15:8].
Module Base + 0x000E
7
6
5
4
3
2
1
0
R
W
PTAD15
PTAD14
PTAD13
PTAD12
PTAD11
PTAD10
PTAD9
PTAD8
Reset
1
1
1
1
1
1
1
1
Pin
Function
AN15
AN14
AN13
AN12
AN11
AN10
AN9
AN8
= Unimplemented or Reserved
Figure 7-16. Port Data Register 0 (PORTAD0)
Read: Anytime
Write: Anytime, no effect
The A/D input channels may be used for general-purpose digital input.
Table 7-25. PORTAD0 Field Descriptions
Field
Description
A/D Channel x (ANx) Digital Input Bits— If the digital input buffer on the ANx pin is enabled (IENx = 1) or
7:0
PTAD[15:8] channel x is enabled as external trigger (ETRIGE = 1, ETRIGCH[3-0] = x, ETRIGSEL = 0) read returns the
logic level on ANx pin (signal potentials not meeting V or V specifications will have an indeterminate value)).
IL
IH
If the digital input buffers are disabled (IENx = 0) and channel x is not enabled as external trigger, read returns
a “1”.
Reset sets all PORTAD0 bits to “1”.
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Chapter 7 Analog-to-Digital Converter (ATD10B16CV4)
7.3.2.15 Port Data Register 1 (PORTAD1)
The data port associated with the ATD is input-only. The port pins are shared with the analog A/D inputs
AN7-0.
Module Base + 0x000F
7
6
5
4
3
2
1
0
R
W
PTAD7
PTAD6
PTAD5
PTAD4
PTAD3
PTAD2
PTAD1
PTAD0
Reset
1
1
1
1
1
1
1
1
Pin
Function
AN 7
AN6
AN5
AN4
AN3
AN2
AN1
AN0
= Unimplemented or Reserved
Figure 7-17. Port Data Register 1 (PORTAD1)
Read: Anytime
Write: Anytime, no effect
The A/D input channels may be used for general-purpose digital input.
Table 7-26. PORTAD1 Field Descriptions
Field
Description
7:0
A/D Channel x (ANx) Digital Input Bits — If the digital input buffer on the ANx pin is enabled (IENx=1) or
PTAD[7:8]
channel x is enabled as external trigger (ETRIGE = 1, ETRIGCH[3-0] = x, ETRIGSEL = 0) read returns the
logic level on ANx pin (signal potentials not meeting V or V specifications will have an indeterminate value)).
IL
IH
If the digital input buffers are disabled (IENx = 0) and channel x is not enabled as external trigger, read returns
a “1”.
Reset sets all PORTAD1 bits to “1”.
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Chapter 7 Analog-to-Digital Converter (ATD10B16CV4)
7.3.2.16 ATD Conversion Result Registers (ATDDRx)
The A/D conversion results are stored in 16 read-only result registers. The result data is formatted in the
result registers bases on two criteria. First there is left and right justification; this selection is made using
the DJM control bit in ATDCTL5. Second there is signed and unsigned data; this selection is made using
the DSGN control bit in ATDCTL5. Signed data is stored in 2’s complement format and only exists in left
justified format. Signed data selected for right justified format is ignored.
Read: Anytime
Write: Anytime in special mode, unimplemented in normal modes
7.3.2.16.1
Left Justified Result Data
Module Base + 0x0010 = ATDDR0H
0x0012 = ATDDR1H
0x0018 = ATDDR4H
0x001A = ATDDR5H
0x001C = ATDDR6H
0x001E = ATDDR7H
0x0020 = ATDDR8H
0x0022 = ATDDR9H
0x0024 = ATDDR10H
0x0026 = ATDDR11H
0x0028 = ATDDR12H
0x002A = ATDDR13H
0x002C = ATDDR14H
0x002E = ATDDR15H
0x0014 = ATDDR2H
0x0016 = ATDDR3H
7
6
5
4
3
2
1
0
R (10-BIT) BIT 9 MSB
R (8-BIT) BIT 7 MSB
BIT 8
BIT 6
BIT 7
BIT 5
BIT 6
BIT 4
BIT 5
BIT 3
BIT 4
BIT 2
BIT 3
BIT 1
BIT 2
BIT 0
W
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 7-18. Left Justified, ATD Conversion Result Register x, High Byte (ATDDRxH)
Module Base + 0x0011 = ATDDR0L
0x0013 = ATDDR1L
0x0019 = ATDDR4L
0x001B = ATDDR5L
0x001D = ATDDR6L
0x001F = ATDDR7L
0x0021 = ATDDR8L
0x0023 = ATDDR9L
0x0025 = ATDDR10L
0x0027 = ATDDR11L
0x0029 = ATDDR12L
0x002B = ATDDR13L
0x002D = ATDDR14L
0x002F = ATDDR15L
0x0015 = ATDDR2L
0x0017 = ATDDR3L
7
6
5
4
3
2
1
0
R (10-BIT)
R (8-BIT)
BIT 1
u
BIT 0
u
0
0
0
0
0
0
0
0
0
0
0
0
W
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
u = Unaffected
Figure 7-19. Left Justified, ATD Conversion Result Register x, Low Byte (ATDDRxL)
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Chapter 7 Analog-to-Digital Converter (ATD10B16CV4)
7.3.2.16.2
Right Justified Result Data
Module Base + 0x0010 = ATDDR0H,
0x0012 = ATDDR1H,
0x0018 = ATDDR4H,
0x001A = ATDDR5H,
0x001C = ATDDR6H,
0x001E = ATDDR7H
0x0020 = ATDDR8H,
0x0022 = ATDDR9H,
0x0024 = ATDDR10H,
0x0026 = ATDDR11H
0x0028 = ATDDR12H,
0x002A = ATDDR13H,
0x002C = ATDDR14H,
0x002E = ATDDR15H
0x0014 = ATDDR2H,
0x0016 = ATDDR3H
7
6
5
4
3
2
1
0
R (10-BIT)
R (8-BIT)
0
0
0
0
0
0
0
0
0
0
0
0
BIT 9 MSB
0
BIT 8
0
W
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 7-20. Right Justified, ATD Conversion Result Register x, High Byte (ATDDRxH)
Module Base + 0x0011 = ATDDR0L,
0x0013 = ATDDR1L,
0x0019 = ATDDR4L,
0x001B = ATDDR5L,
0x001D = ATDDR6L,
0x001F = ATDDR7L
0x0021 = ATDDR8L,
0x0023 = ATDDR9L,
0x0025 = ATDDR10L,
0x0027 = ATDDR11L
0x0029 = ATDDR12L,
0x002B = ATDDR13L,
0x002D = ATDDR14L,
0x002F = ATDDR15L
0x0015 = ATDDR2L,
0x0017 = ATDDR3L
7
6
5
4
3
2
1
0
R (10-BIT)
R (8-BIT) BIT 7 MSB
BIT 7
BIT 6
BIT 6
BIT 5
BIT 5
BIT 4
BIT 4
BIT 3
BIT 3
BIT 2
BIT 2
BIT 1
BIT 1
BIT 0
BIT 0
W
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 7-21. Right Justified, ATD Conversion Result Register x, Low Byte (ATDDRxL)
7.4
Functional Description
The ATD10B16C is structured in an analog and a digital sub-block.
7.4.1
Analog Sub-block
The analog sub-block contains all analog electronics required to perform a single conversion. Separate
power supplies V and V allow to isolate noise of other MCU circuitry from the analog sub-block.
DDA
SSA
7.4.1.1
Sample and Hold Machine
The sample and hold (S/H) machine accepts analog signals from the external world and stores them as
capacitor charge on a storage node.
The sample process uses a two stage approach. During the first stage, the sample amplifier is used to
quickly charge the storage node.The second stage connects the input directly to the storage node to
complete the sample for high accuracy.
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When not sampling, the sample and hold machine disables its own clocks. The analog electronics continue
drawing their quiescent current. The power down (ADPU) bit must be set to disable both the digital clocks
and the analog power consumption.
The input analog signals are unipolar and must fall within the potential range of V
to VDDA.
SSA
7.4.1.2
Analog Input Multiplexer
The analog input multiplexer connects one of the 16 external analog input channels to the sample and hold
machine.
7.4.1.3
Sample Buffer Amplifier
The sample amplifier is used to buffer the input analog signal so that the storage node can be quickly
charged to the sample potential.
7.4.1.4
Analog-to-Digital (A/D) Machine
The A/D machine performs analog to digital conversions. The resolution is program selectable at either 8
or 10 bits. The A/D machine uses a successive approximation architecture. It functions by comparing the
stored analog sample potential with a series of digitally generated analog potentials. By following a binary
search algorithm, the A/D machine locates the approximating potential that is nearest to the sampled
potential.
When not converting the A/D machine disables its own clocks. The analog electronics continue drawing
quiescent current. The power down (ADPU) bit must be set to disable both the digital clocks and the analog
power consumption.
Only analog input signals within the potential range of V to V (A/D reference potentials) will result
RL
RH
in a non-railed digital output codes.
7.4.2
Digital Sub-Block
This subsection explains some of the digital features in more detail. See register descriptions for all details.
7.4.2.1
External Trigger Input
The external trigger feature allows the user to synchronize ATD conversions to the external environment
events rather than relying on software to signal the ATD module when ATD conversions are to take place.
The external trigger signal (out of reset ATD channel 15, configurable in ATDCTL1) is programmable to
be edge or level sensitive with polarity control. Table 7-27 gives a brief description of the different
combinations of control bits and their effect on the external trigger function.
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Chapter 7 Analog-to-Digital Converter (ATD10B16CV4)
Table 7-27. External Trigger Control Bits
ETRIGLE ETRIGP ETRIGE SCAN
Description
X
X
0
0
1
1
X
X
0
1
0
1
0
0
1
1
1
1
0
1
Ignores external trigger. Performs one conversion sequence and stops.
Ignores external trigger. Performs continuous conversion sequences.
Falling edge triggered. Performs one conversion sequence per trigger.
Rising edge triggered. Performs one conversion sequence per trigger.
Trigger active low. Performs continuous conversions while trigger is active.
Trigger active high. Performs continuous conversions while trigger is active.
X
X
X
X
During a conversion, if additional active edges are detected the overrun error flag ETORF is set.
In either level or edge triggered modes, the first conversion begins when the trigger is received. In both
cases, the maximum latency time is one bus clock cycle plus any skew or delay introduced by the trigger
circuitry.
After ETRIGE is enabled, conversions cannot be started by a write to ATDCTL5, but rather must be
triggered externally.
If the level mode is active and the external trigger both de-asserts and re-asserts itself during a conversion
sequence, this does not constitute an overrun. Therefore, the flag is not set. If the trigger remains asserted
in level mode while a sequence is completing, another sequence will be triggered immediately.
7.4.2.2
General-Purpose Digital Input Port Operation
The input channel pins can be multiplexed between analog and digital data. As analog inputs, they are
multiplexed and sampled to supply signals to the A/D converter. As digital inputs, they supply external
input data that can be accessed through the digital port registers (PORTAD0 & PORTAD1) (input-only).
The analog/digital multiplex operation is performed in the input pads. The input pad is always connected
to the analog inputs of the ATD10B16C. The input pad signal is buffered to the digital port registers. This
buffer can be turned on or off with the ATDDIEN0 & ATDDIEN1 register. This is important so that the
buffer does not draw excess current when analog potentials are presented at its input.
7.4.3
Operation in Low Power Modes
The ATD10B16C can be configured for lower MCU power consumption in three different ways:
•
Stop Mode
Stop Mode: This halts A/D conversion. Exit from Stop mode will resume A/D conversion, But due
to the recovery time the result of this conversion should be ignored.
Entering stop mode causes all clocks to halt and thus the system is placed in a minimum power
standby mode. This halts any conversion sequence in progress. During recovery from stop mode,
there must be a minimum delay for the stop recovery time t before initiating a new ATD
SR
conversion sequence.
•
Wait Mode
Wait Mode with AWAI = 1: This halts A/D conversion. Exit from Wait mode will resume A/D
conversion, but due to the recovery time the result of this conversion should be ignored.
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Chapter 7 Analog-to-Digital Converter (ATD10B16CV4)
Entering wait mode, the ATD conversion either continues or halts for low power depending on the
logical value of the AWAIT bit.
•
Freeze Mode
Writing ADPU = 0 (Note that all ATD registers remain accessible.): This aborts any A/D
conversion in progress.
In freeze mode, the ATD10B16C will behave according to the logical values of the FRZ1 and FRZ0
bits. This is useful for debugging and emulation.
NOTE
The reset value for the ADPU bit is zero. Therefore, when this module is
reset, it is reset into the power down state.
7.5
Resets
At reset the ATD10B16C is in a power down state. The reset state of each individual bit is listed within
Section 7.3, “Memory Map and Register Definition,” which details the registers and their bit fields.
7.6
Interrupts
The interrupt requested by the ATD10B16C is listed in Table 7-28. Refer to MCU specification for related
vector address and priority.
Table 7-28. ATD Interrupt Vectors
Interrupt Source
CCR Mask
Local Enable
Sequence Complete Interrupt
I bit
ASCIE in ATDCTL2
See Section 7.3.2, “Register Descriptions,” for further details.
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Chapter 8
Analog-to-Digital Converter (ATD10B8CV3)
8.1
Introduction
The ATD10B8C is an 8-channel, 10-bit, multiplexed input successive approximation analog-to-digital
converter. Refer to device electrical specifications for ATD accuracy.
8.1.1
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
8/10-bit resolution
7 µsec, 10-bit single conversion time
Sample buffer amplifier
Programmable sample time
Left/right justified, signed/unsigned result data
External trigger control
Conversion completion interrupt generation
Analog input multiplexer for 8 analog input channels
Analog/digital input pin multiplexing
1-to-8 conversion sequence lengths
Continuous conversion mode
Multiple channel scans
Configurable external trigger functionality on any AD channel or any of four additional external
trigger inputs. The four additional trigger inputs can be chip external or internal. Refer to the device
overview chapter for availability and connectivity.
•
Configurable location for channel wrap around (when converting multiple channels in a sequence).
8.1.2
Modes of Operation
8.1.2.1
Conversion Modes
There is software programmable selection between performing single or continuous conversion on a single
channel or multiple channels.
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Chapter 8 Analog-to-Digital Converter (ATD10B8CV3)
8.1.2.2
MCU Operating Modes
•
Stop mode
Entering stop mode causes all clocks to halt and thus the system is placed in a minimum power
standby mode. This aborts any conversion sequence in progress. During recovery from stop mode,
there must be a minimum delay for the stop recovery time t before initiating a new ATD
SR
conversion sequence.
•
•
Wait mode
Entering wait mode the ATD conversion either continues or aborts for low power depending on the
logical value of the AWAIT bit.
Freeze mode
In freeze mode the ATD will behave according to the logical values of the FRZ1 and FRZ0 bits.
This is useful for debugging and emulation.
8.1.3
Block Diagram
Figure 8-1 shows a block diagram of the ATD.
8.2
External Signal Description
This section lists all inputs to the ATD block.
8.2.1
ANx (x = 7, 6, 5, 4, 3, 2, 1, 0) — Analog Input Pin
This pin serves as the analog input channel x. It can also be configured as general purpose digital port pin
and/or external trigger for the ATD conversion.
8.2.2
ETRIG3, ETRIG2, ETRIG1, and ETRIG0 — External Trigger Pins
These inputs can be configured to serve as an external trigger for the ATD conversion.
Refer to the device overview chapter for availability and connectivity of these inputs.
8.2.3
V
and V — High and Low Reference Voltage Pins
RL
RH
is the high reference voltage and V is the low reference voltage for ATD conversion.
V
RH
RL
8.2.4
V
and V
— Power Supply Pins
DDA
SSA
These pins are the power supplies for the analog circuitry of the ATD block.
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Bus Clock
ATD clock
Clock
Prescaler
ATD10B8C
Trigger
Mux
ETRIG0
Sequence Complete
Mode and
Timing Control
ETRIG1
ETRIG2
ETRIG3
Interrupt
(See Device Overview
chapter for availability
and connectivity)
ATDDIEN
ATDCTL1
PORTAD
Results
ATD 0
V
DDA
V
SSA
ATD 1
ATD 2
ATD 3
ATD 4
ATD 5
ATD 6
ATD 7
Successive
V
RH
Approximation
Register (SAR)
and DAC
V
RL
AN7
AN6
AN5
AN4
AN3
+
–
Sample & Hold
1
1
Comparator
Analog
MUX
AN2
AN1
AN0
Figure 8-1. ATD Block Diagram
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Chapter 8 Analog-to-Digital Converter (ATD10B8CV3)
8.3
Memory Map and Register Definition
This section provides a detailed description of all registers accessible in the ATD.
Module Memory Map
Figure 8-2 gives an overview of all ATD registers.
NOTE
Register Address = Base Address + Address Offset, where the Base Address
is defined at the MCU level and the Address Offset is defined at the module
level.
8.3.2
Register Descriptions
This section describes in address order all the ATD registers and their individual bits.
Register
Name
Bit 7
6
5
4
3
2
1
Bit 0
0x0000
ATDCTL0
R
0
0
0
0
0
WRAP2
WRAP1
WRAP0
W
0x0001
ATDCTL1
R
0
0
0
0
ETRIGSEL
ETRIGCH2 ETRIGCH1 ETRIGCH0
ASCIF
W
0x0002
ATDCTL2
R
ADPU
0
AFFC
S8C
AWAI
S4C
ETRIGLE
S2C
ETRIGP
S1C
ETRIGE
ASCIE
FRZ1
PRS1
W
0x0003
ATDCTL3
R
FIFO
FRZ0
PRS0
W
0x0004
ATDCTL4
R
SRES8
DJM
SMP1
SMP0
SCAN
ETORF
PRS4
PRS3
0
PRS2
W
0x0005
ATDCTL5
R
DSGN
0
MULT
CC
CB
CA
W
0x0006
ATDSTAT0
R
0
CC2
CC1
CC0
SCF
FIFOR
W
0x0007
Unimplemente
d
R
W
0x0008
ATDTEST0
R
U
U
U
U
U
0
U
0
U
0
U
0
U
0
U
W
0x0009
ATDTEST1
R
SC
W
= Unimplemented or Reserved
Figure 8-2. ATD Register Summary (Sheet 1 of 5)
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 8 Analog-to-Digital Converter (ATD10B8CV3)
Register
Name
Bit 7
6
5
4
3
2
1
Bit 0
0x000A
Unimplemente
d
R
W
0x000B
R
CCF7
CCF6
CCF5
CCF4
CCF3
CCF2
CCF1
CCF0
ATDSTAT1
W
0x000C
Unimplemente
d
R
W
0x000D
ATDDIEN
R
IEN7
IEN6
IEN5
IEN4
IEN3
IEN2
IEN1
IEN0
W
0x000E
Unimplemente
d
R
W
0x000F
R
PTAD7
PTAD6
PTAD5
PTAD4
PTAD3
PTAD2
PTAD1
PTAD0
PORTAD
W
Left Justified Result Data
Note: The read portion of the left justified result data registers has been divided to show the bit position when reading 10-bit and
8-bit conversion data. For more detailed information refer to Section 8.3.2.13, “ATD Conversion Result Registers
(ATDDRx)”.
0x0010
ATDDR0H
10-BIT
8-BIT
W
BIT 9 MSB
BIT 7 MSB
BIT 8
BIT 6
BIT 7
BIT 5
BIT 6
BIT 4
BIT 5
BIT 3
BIT 4
BIT 2
BIT 3
BIT 1
BIT 2
BIT 0
0x0011
ATDDR0L
10-BIT
8-BIT
W
BIT 1
U
BIT 0
U
0
0
0
0
0
0
0
0
0
0
0
0
0x0012
ATDDR1H
10-BIT
8-BIT
W
BIT 9 MSB
BIT 7 MSB
BIT 8
BIT 6
BIT 7
BIT 5
BIT 6
BIT 4
BIT 5
BIT 3
BIT 4
BIT 2
BIT 3
BIT 1
BIT 2
BIT 0
0x0013
ATDDR1L
10-BIT
8-BIT
W
BIT 1
U
BIT 0
U
0
0
0
0
0
0
0
0
0
0
0
0
0x0014
ATDDR2H
10-BIT
8-BIT
W
BIT 9 MSB
BIT 7 MSB
BIT 8
BIT 6
BIT 7
BIT 5
BIT 6
BIT 4
BIT 5
BIT 3
BIT 4
BIT 2
BIT 3
BIT 1
BIT 2
BIT 0
0x0015
ATDDR2L
10-BIT
8-BIT
W
BIT 1
U
BIT 0
U
0
0
0
0
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 8-2. ATD Register Summary (Sheet 2 of 5)
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
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Chapter 8 Analog-to-Digital Converter (ATD10B8CV3)
Register
Bit 7
6
5
4
3
2
1
Bit 0
Name
0x0016
ATDDR3H
10-BIT
8-BIT
W
BIT 9 MSB
BIT 7 MSB
BIT 8
BIT 6
BIT 7
BIT 5
BIT 6
BIT 4
BIT 5
BIT 3
BIT 4
BIT 2
BIT 3
BIT 1
BIT 2
BIT 0
0x0017
ATDDR3L
10-BIT
8-BIT
W
BIT 1
U
BIT 0
U
0
0
0
0
0
0
0
0
0
0
0
0
0x0018
ATDDR4H
10-BIT
8-BIT
W
BIT 9 MSB
BIT 7 MSB
BIT 8
BIT 6
BIT 7
BIT 5
BIT 6
BIT 4
BIT 5
BIT 3
BIT 4
BIT 2
BIT 3
BIT 1
BIT 2
BIT 0
0x0019
ATDDR4L
10-BIT
8-BIT
W
BIT 1
U
BIT 0
U
0
0
0
0
0
0
0
0
0
0
0
0
0x001A
ATDD45H
10-BIT
8-BIT
W
BIT 9 MSB
BIT 7 MSB
BIT 8
BIT 6
BIT 7
BIT 5
BIT 6
BIT 4
BIT 5
BIT 3
BIT 4
BIT 2
BIT 3
BIT 1
BIT 2
BIT 0
0x001B
ATDD45L
10-BIT
8-BIT
W
BIT 1
U
BIT 0
U
0
0
0
0
0
0
0
0
0
0
0
0
0x001C
ATDD46H
10-BIT
8-BIT
W
BIT 9 MSB
BIT 7 MSB
BIT 8
BIT 6
BIT 7
BIT 5
BIT 6
BIT 4
BIT 5
BIT 3
BIT 4
BIT 2
BIT 3
BIT 1
BIT 2
BIT 0
0x001D
ATDDR6L
10-BIT
8-BIT
W
BIT 1
U
BIT 0
U
0
0
0
0
0
0
0
0
0
0
0
0
0x001E
ATDD47H
10-BIT
8-BIT
W
BIT 9 MSB
BIT 7 MSB
BIT 8
BIT 6
BIT 7
BIT 5
BIT 6
BIT 4
BIT 5
BIT 3
BIT 4
BIT 2
BIT 3
BIT 1
BIT 2
BIT 0
0x001F
ATDD47L
10-BIT
8-BIT
W
BIT 1
U
BIT 0
U
0
0
0
0
0
0
0
0
0
0
0
0
Right Justified Result Data
Note: The read portion of the right justified result data registers has been divided to show the bit position when reading 10-bit
and 8-bit conversion data. For more detailed information refer to Section 8.3.2.13, “ATD Conversion Result Registers
(ATDDRx)”.
0x0010
ATDDR0H
10-BIT
8-BIT
W
0
0
0
0
0
0
0
0
0
0
0
0
BIT 9 MSB
0
BIT 8
0
= Unimplemented or Reserved
Figure 8-2. ATD Register Summary (Sheet 3 of 5)
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 8 Analog-to-Digital Converter (ATD10B8CV3)
Register
Name
Bit 7
6
5
4
3
2
1
Bit 0
0x0011
ATDDR0L
10-BIT
8-BIT
W
BIT 7
BIT 7 MSB
BIT 6
BIT 6
BIT 5
BIT 5
BIT 4
BIT 4
BIT 3
BIT 3
BIT 2
BIT 2
BIT 1
BIT 1
BIT 0
BIT 0
0x0012
ATDDR1H
10-BIT
8-BIT
W
0
0
0
0
0
0
0
0
0
0
0
0
BIT 9 MSB
0
BIT 8
0
0x0013
ATDDR1L
10-BIT
8-BIT
W
BIT 7
BIT 7 MSB
BIT 6
BIT 6
BIT 5
BIT 5
BIT 4
BIT 4
BIT 3
BIT 3
BIT 2
BIT 2
BIT 1
BIT 1
BIT 0
BIT 0
0x0014
ATDDR2H
10-BIT
8-BIT
W
0
0
0
0
0
0
0
0
0
0
0
0
BIT 9 MSB
0
BIT 8
0
0x0015
ATDDR2L
10-BIT
8-BIT
W
BIT 7
BIT 7 MSB
BIT 6
BIT 6
BIT 5
BIT 5
BIT 4
BIT 4
BIT 3
BIT 3
BIT 2
BIT 2
BIT 1
BIT 1
BIT 0
BIT 0
0x0016
ATDDR3H
10-BIT
8-BIT
W
0
0
0
0
0
0
0
0
0
0
0
0
BIT 9 MSB
0
BIT 8
0
0x0017
ATDDR3L
10-BIT
8-BIT
W
BIT 7
BIT 7 MSB
BIT 6
BIT 6
BIT 5
BIT 5
BIT 4
BIT 4
BIT 3
BIT 3
BIT 2
BIT 2
BIT 1
BIT 1
BIT 0
BIT 0
0x0018
ATDDR4H
10-BIT
8-BIT
W
0
0
0
0
0
0
0
0
0
0
0
0
BIT 9 MSB
0
BIT 8
0
0x0019
ATDDR4L
10-BIT
8-BIT
W
BIT 7
BIT 7 MSB
BIT 6
BIT 6
BIT 5
BIT 5
BIT 4
BIT 4
BIT 3
BIT 3
BIT 2
BIT 2
BIT 1
BIT 1
BIT 0
BIT 0
0x001A
ATDD45H
10-BIT
8-BIT
W
0
0
0
0
0
0
0
0
0
0
0
0
BIT 9 MSB
0
BIT 8
0
0x001B
ATDD45L
10-BIT
8-BIT
W
BIT 7
BIT 7 MSB
BIT 6
BIT 6
BIT 5
BIT 5
BIT 4
BIT 4
BIT 3
BIT 3
BIT 2
BIT 2
BIT 1
BIT 1
BIT 0
BIT 0
0x001C
ATDD46H
10-BIT
8-BIT
W
0
0
0
0
0
0
0
0
0
0
0
0
BIT 9 MSB
0
BIT 8
0
= Unimplemented or Reserved
Figure 8-2. ATD Register Summary (Sheet 4 of 5)
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
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Chapter 8 Analog-to-Digital Converter (ATD10B8CV3)
Register
Bit 7
6
5
4
3
2
1
Bit 0
Name
0x001D
ATDDR6L
10-BIT
8-BIT
W
BIT 7
BIT 7 MSB
BIT 6
BIT 6
BIT 5
BIT 5
BIT 4
BIT 4
BIT 3
BIT 3
BIT 2
BIT 2
BIT 1
BIT 1
BIT 0
BIT 0
0x001E
ATDD47H
10-BIT
8-BIT
W
0
0
0
0
0
0
0
0
0
0
0
0
BIT 9 MSB
0
BIT 8
0
0x001F
ATDD47L
10-BIT
8-BIT
BIT 7
BIT 7 MSB
BIT 6
BIT 6
BIT 5
BIT 5
BIT 4
BIT 4
BIT 3
BIT 3
BIT 2
BIT 2
BIT 1
BIT 1
BIT 0
BIT 0
= Unimplemented or Reserved
Figure 8-2. ATD Register Summary (Sheet 5 of 5)
8.3.2.1
ATD Control Register 0 (ATDCTL0)
Writes to this register will abort current conversion sequence but will not start a new sequence.
Module Base + 0x0000
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
WRAP2
WRAP1
WRAP0
Reset
0
0
0
0
0
1
1
1
= Unimplemented or Reserved
Figure 8-3. ATD Control Register 0 (ATDCTL0)
Read: Anytime
Write: Anytime
Table 8-1. ATDCTL0 Field Descriptions
Field
2–0
Wrap Around Channel Select Bits — These bits determine the channel for wrap around when doing
WRAP[2:0] multi-channel conversions. The coding is summarized in Table 8-2.
Table 8-2. Multi-Channel Wrap Around Coding
Multiple Channel Conversions (MULT = 1)
Wrap Around to AN0 after Converting
WRAP2
WRAP1
WRAP0
0
0
0
0
1
1
0
0
1
1
0
0
0
1
0
1
0
1
Reserved
AN1
AN2
AN3
AN4
AN5
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 8 Analog-to-Digital Converter (ATD10B8CV3)
Table 8-2. Multi-Channel Wrap Around Coding
Multiple Channel Conversions (MULT = 1)
Wrap Around to AN0 after Converting
WRAP2
WRAP1
WRAP0
1
1
1
1
0
1
AN6
AN7
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 8 Analog-to-Digital Converter (ATD10B8CV3)
8.3.2.2
ATD Control Register 1 (ATDCTL1)
Writes to this register will abort current conversion sequence but will not start a new sequence.
Module Base + 0x0001
7
6
5
4
3
2
1
0
R
W
0
0
0
0
ETRIGSEL
ETRIGCH2 ETRIGCH1 ETRIGCH0
Reset
0
0
0
0
0
1
1
1
= Unimplemented or Reserved
Figure 8-4. ATD Control Register 1 (ATDCTL1)
Read: Anytime
Write: Anytime
Table 8-3. ATDCTL1 Field Descriptions
Description
Field
7
External Trigger Source Select — This bit selects the external trigger source to be either one of the AD
ETRIGSEL channels or one of the ETRIG3–0 inputs. See the device overview chapter for availability and connectivity of
ETRIG3–0 inputs. If ETRIG3–0 input option is not available, writing a 1 to ETRISEL only sets the bit but has
not effect, that means still one of the AD channels (selected by ETRIGCH2–0) is the source for external trigger.
The coding is summarized in Table 8-4.
2–0
External Trigger Channel Select — These bits select one of the AD channels or one of the ETRIG3–0 inputs
ETRIGCH[2:0] as source for the external trigger. The coding is summarized in Table 8-4.
Table 8-4. External Trigger Channel Select Coding
ETRIGSEL ETRIGCH2 ETRIGCH1 ETRIGCH0
External trigger source is
0
0
0
0
0
0
0
0
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
0
0
1
1
0
0
1
1
0
0
1
1
X
0
1
0
1
0
1
0
1
0
1
0
1
X
AN0
AN1
AN2
AN3
AN4
AN5
AN6
AN7
1
1
1
1
ETRIG0
ETRIG1
ETRIG2
ETRIG3
Reserved
1
Only if ETRIG3–0 input option is available (see device overview chapter), else ETRISEL is
ignored, that means external trigger source is still on one of the AD channels selected by
ETRIGCH2–0
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 8 Analog-to-Digital Converter (ATD10B8CV3)
8.3.2.3
ATD Control Register 2 (ATDCTL2)
This register controls power down, interrupt and external trigger. Writes to this register will abort current
conversion sequence but will not start a new sequence.
Module Base + 0x0002
7
6
5
4
3
2
1
0
R
W
ASCIF
ADPU
AFFC
AWAI
ETRIGLE
ETRIGP
ETRIGE
ASCIE
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 8-5. ATD Control Register 2 (ATDCTL2)
Read: Anytime
Write: Anytime
Table 8-5. ATDCTL2 Field Descriptions
Description
Field
7
ATD Power Up — This bit provides on/off control over the ATD block allowing reduced MCU power
ADPU
consumption. Because analog electronic is turned off when powered down, the ATD requires a recovery time
period after ADPU bit is enabled.
0 Power down ATD
1 Normal ATD functionality
6
ATD Fast Flag Clear All
AFFC
0 ATD flag clearing operates normally (read the status register ATDSTAT1 before reading the result register to
clear the associate CCF flag).
1 Changes all ATD conversion complete flags to a fast clear sequence. Any access to a result register will
cause the associate CCF flag to clear automatically.
5
ATD Power Down in Wait Mode — When entering wait mode this bit provides on/off control over the ATD block
allowing reduced MCU power. Because analog electronic is turned off when powered down, the ATD requires
a recovery time period after exit from Wait mode.
AWAI
0 ATD continues to run in Wait mode
1 Halt conversion and power down ATD during wait mode
After exiting wait mode with an interrupt conversion will resume. But due to the recovery time the result of
this conversion should be ignored.
4
External Trigger Level/Edge Control — This bit controls the sensitivity of the external trigger signal. See
ETRIGLE
Table 8-6 for details.
3
External Trigger Polarity — This bit controls the polarity of the external trigger signal. See Table 8-6 for
ETRIGP
details.
2
External Trigger Mode Enable — This bit enables the external trigger on one of the AD channels or one of
the ETRIG3–0 inputs as described in Table 8-4. If external trigger source is one of the AD channels, the digital
input buffer of this channel is enabled. The external trigger allows to synchronize sample and ATD conversions
processes with external events.
ETRIGE
0 Disable external trigger
1 Enable external trigger
Note: If using one of the AD channel as external trigger (ETRIGSEL = 0) the conversion results for this channel
have no meaning while external trigger mode is enabled.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
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Chapter 8 Analog-to-Digital Converter (ATD10B8CV3)
Table 8-5. ATDCTL2 Field Descriptions (continued)
Field
Description
1
ATD Sequence Complete Interrupt Enable
ASCIE
0 ATD Sequence Complete interrupt requests are disabled.
0
ATD Sequence Complete Interrupt Flag — If ASCIE = 1 the ASCIF flag equals the SCF flag (see
Section 8.3.2.7, “ATD Status Register 0 (ATDSTAT0)”), else ASCIF reads zero. Writes have no effect.
0 No ATD interrupt occurred
ASCIF
1 ATD sequence complete interrupt pending
Table 8-6. External Trigger Configurations
ETRIGLE
ETRIGP
External Trigger Sensitivity
0
0
1
1
0
1
0
1
Falling edge
Rising edge
Low level
High level
8.3.2.4
ATD Control Register 3 (ATDCTL3)
This register controls the conversion sequence length, FIFO for results registers and behavior in freeze
mode. Writes to this register will abort current conversion sequence but will not start a new sequence.
Module Base + 0x0003
7
6
5
4
3
2
1
0
R
W
0
S8C
S4C
S2C
S1C
FIFO
FRZ1
FRZ0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 8-6. ATD Control Register 3 (ATDCTL3)
Read: Anytime
Write: Anytime
Table 8-7. ATDCTL3 Field Descriptions
Description
Field
6–3
Conversion Sequence Length — These bits control the number of conversions per sequence. Table 8-8 shows
S8C, S4C, all combinations. At reset, S4C is set to 1 (sequence length is 4). This is to maintain software continuity to HC12
S2C, S1C Family.
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 8 Analog-to-Digital Converter (ATD10B8CV3)
Table 8-7. ATDCTL3 Field Descriptions (continued)
Field
Description
2
Result Register FIFO Mode — If this bit is zero (non-FIFO mode), the A/D conversion results map into the result
registers based on the conversion sequence; the result of the first conversion appears in the first result register,
the second result in the second result register, and so on.
FIFO
If this bit is one (FIFO mode) the conversion counter is not reset at the beginning or end of a conversion
sequence; conversion results are placed in consecutive result registers between sequences. The result register
counter wraps around when it reaches the end of the result register file. The conversion counter value in
ATDSTAT0 can be used to determine where in the result register file, the current conversion result will be placed.
Finally, which result registers hold valid data can be tracked using the conversion complete flags. Fast flag clear
mode may or may not be useful in a particular application to track valid data.
0 Conversion results are placed in the corresponding result register up to the selected sequence length.
1 Conversion results are placed in consecutive result registers (wrap around at end).
1–0
FRZ[1:0]
Background Debug Freeze Enable — When debugging an application, it is useful in many cases to have the
ATD pause when a breakpoint (Freeze Mode) is encountered. These 2 bits determine how the ATD will respond
to a breakpoint as shown in Table 8-9. Leakage onto the storage node and comparator reference capacitors may
compromise the accuracy of an immediately frozen conversion depending on the length of the freeze period.
Table 8-8. Conversion Sequence Length Coding
Number of Conversions
S8C
S4C
S2C
S1C
per Sequence
0
0
0
0
0
0
0
0
1
0
0
0
0
1
1
1
1
X
0
0
1
1
0
0
1
1
X
0
1
0
1
0
1
0
1
X
8
1
2
3
4
5
6
7
8
Table 8-9. ATD Behavior in Freeze Mode (Breakpoint)
FRZ1
FRZ0
Behavior in Freeze Mode
0
0
1
1
0
1
0
1
Continue conversion
Reserved
Finish current conversion, then freeze
Freeze Immediately
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 8 Analog-to-Digital Converter (ATD10B8CV3)
8.3.2.5
ATD Control Register 4 (ATDCTL4)
This register selects the conversion clock frequency, the length of the second phase of the sample time and
the resolution of the A/D conversion (i.e.: 8-bits or 10-bits). Writes to this register will abort current
conversion sequence but will not start a new sequence.
Module Base + 0x0004
7
6
5
4
3
2
1
0
R
W
SRES8
SMP1
SMP0
PRS4
PRS3
PRS2
PRS1
PRS0
Reset
0
0
0
0
0
1
0
1
Figure 8-7. ATD Control Register 4 (ATDCTL4)
Read: Anytime
Write: Anytime
Table 8-10. ATDCTL4 Field Descriptions
Description
Field
7
A/D Resolution Select — This bit selects the resolution of A/D conversion results as either 8 or 10 bits. The
SRES8
A/D converter has an accuracy of 10 bits; however, if low resolution is required, the conversion can be speeded
up by selecting 8-bit resolution.
0 10-bit resolution
8-bit resolution
6–5
SMP[1:0]
Sample Time Select — These two bits select the length of the second phase of the sample time in units of
ATD conversion clock cycles. Note that the ATD conversion clock period is itself a function of the prescaler value
(bits PRS4–0). The sample time consists of two phases. The first phase is two ATD conversion clock cycles
long and transfers the sample quickly (via the buffer amplifier) onto the A/D machine’s storage node. The
second phase attaches the external analog signal directly to the storage node for final charging and high
accuracy. Table 8-11 lists the lengths available for the second sample phase.
4–0
ATD Clock Prescaler — These 5 bits are the binary value prescaler value PRS. The ATD conversion clock
PRS[4:0]
frequency is calculated as follows:
[BusClock]
ATDclock =
× 0.5
--------------------------------
[PRS + 1]
Note: The maximum ATD conversion clock frequency is half the bus clock. The default (after reset) prescaler
value is 5 which results in a default ATD conversion clock frequency that is bus clock divided by 12.
Table 8-12 illustrates the divide-by operation and the appropriate range of the bus clock.
Table 8-11. Sample Time Select
SMP1
SMP0
Length of 2nd Phase of Sample Time
0
0
1
1
0
1
0
1
2 A/D conversion clock periods
4 A/D conversion clock periods
8 A/D conversion clock periods
16 A/D conversion clock periods
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 8 Analog-to-Digital Converter (ATD10B8CV3)
Table 8-12. Clock Prescaler Values
Total Divisor
Value
1
2
Prescale Value
Max. Bus Clock
Min. Bus Clock
00000
00001
00010
00011
00100
00101
00110
00111
01000
01001
01010
01011
01100
01101
01110
01111
10000
10001
10010
10011
10100
10101
10110
10111
11000
11001
11010
11011
11100
11101
11110
11111
Divide by 2
Divide by 4
Divide by 6
4 MHz
8 MHz
1 MHz
2 MHz
3 MHz
4 MHz
5 MHz
6 MHz
7 MHz
8 MHz
9 MHz
12 MHz
16 MHz
20 MHz
24 MHz
28 MHz
32 MHz
36 MHz
40 MHz
44 MHz
48 MHz
52 MHz
56 MHz
60 MHz
64 MHz
68 MHz
72 MHz
76 MHz
80 MHz
84 MHz
88 MHz
92 MHz
96 MHz
100 MHz
104 MHz
108 MHz
112 MHz
116 MHz
120 MHz
124 MHz
128 MHz
Divide by 8
Divide by 10
Divide by 12
Divide by 14
Divide by 16
Divide by 18
Divide by 20
Divide by 22
Divide by 24
Divide by 26
Divide by 28
Divide by 30
Divide by 32
Divide by 34
Divide by 36
Divide by 38
Divide by 40
Divide by 42
Divide by 44
Divide by 46
Divide by 48
Divide by 50
Divide by 52
Divide by 54
Divide by 56
Divide by 58
Divide by 60
Divide by 62
Divide by 64
10 MHz
11 MHz
12 MHz
13 MHz
14 MHz
15 MHz
16 MHz
17 MHz
18 MHz
19 MHz
20 MHz
21 MHz
22 MHz
23 MHz
24 MHz
25 MHz
26 MHz
27 MHz
28 MHz
29 MHz
30 MHz
31 MHz
32 MHz
1
2
Maximum ATD conversion clock frequency is 2 MHz. The maximum allowed bus clock frequency is
shown in this column.
Minimum ATD conversion clock frequency is 500 kHz. The minimum allowed bus clock frequency is
shown in this column.
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 8 Analog-to-Digital Converter (ATD10B8CV3)
8.3.2.6
ATD Control Register 5 (ATDCTL5)
This register selects the type of conversion sequence and the analog input channels sampled. Writes to this
register will abort current conversion sequence and start a new conversion sequence.
Module Base + 0x0005
7
6
5
4
3
2
1
0
R
W
0
DJM
DSGN
SCAN
MULT
CC
CB
CA
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 8-8. ATD Control Register 5 (ATDCTL5)
Read: Anytime
Write: Anytime
Table 8-13. ATDCTL5 Field Descriptions
Description
Field
7
DJM
Result Register Data Justification — This bit controls justification of conversion data in the result registers.
See Section 8.3.2.13, “ATD Conversion Result Registers (ATDDRx),” for details.
0 Left justified data in the result registers
1 Right justified data in the result registers
6
Result Register Data Signed or Unsigned Representation — This bit selects between signed and unsigned
conversion data representation in the result registers. Signed data is represented as 2’s complement. Signed
data is not available in right justification. See Section 8.3.2.13, “ATD Conversion Result Registers (ATDDRx),”
for details.
DSGN
1 Signed data representation in the result registers
Table 8-14 summarizes the result data formats available and how they are set up using the control bits.
Table 8-15 illustrates the difference between the signed and unsigned, left justified output codes for an input
signal range between 0 and 5.12 Volts.
5
Continuous Conversion Sequence Mode — This bit selects whether conversion sequences are performed
continuously or only once.
SCAN
0 Single conversion sequence
1 Continuous conversion sequences (scan mode)
4
Multi-Channel Sample Mode — When MULT is 0, the ATD sequence controller samples only from the specified
analog input channel for an entire conversion sequence. The analog channel is selected by channel selection
code (control bits CC/CB/CA located in ATDCTL5). When MULT is 1, the ATD sequence controller samples
across channels. The number of channels sampled is determined by the sequence length value (S8C, S4C,
S2C, S1C). The first analog channel examined is determined by channel selection code (CC, CB, CA control
bits); subsequent channels sampled in the sequence are determined by incrementing the channel selection
code.
MULT
0 Sample only one channel
1 Sample across several channels
2–0
Analog Input Channel Select Code — These bits select the analog input channel(s) whose signals are
CC, CB, CA sampled and converted to digital codes. Table 8-16 lists the coding used to select the various analog input
channels. In the case of single channel scans (MULT = 0), this selection code specified the channel examined.
In the case of multi-channel scans (MULT = 1), this selection code represents the first channel to be examined
in the conversion sequence. Subsequent channels are determined by incrementing channel selection code;
selection codes that reach the maximum value wrap around to the minimum value.
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Chapter 8 Analog-to-Digital Converter (ATD10B8CV3)
Table 8-14. Available Result Data Formats
Result Data Formats
Description and Bus Bit Mapping
SRES8
DJM
DSGN
1
1
1
0
0
0
0
0
1
0
0
1
0
1
X
0
1
X
8-bit / left justified / unsigned — bits 8–15
8-bit / left justified / signed — bits 8–15
8-bit / right justified / unsigned — bits 0–7
10-bit / left justified / unsigned — bits 6–15
10-bit / left justified / signed — bits 6–15
10-bit / right justified / unsigned — bits 0–9
Table 8-15. Left Justified, Signed, and Unsigned ATD Output Codes
Input Signal
Signed
8-Bit
Unsigned
8-Bit
Signed
10-Bit
Unsigned
10-Bit
V
= 0 Volts
RL
V
= 5.12 Volts
Codes
Codes
Codes
Codes
RH
5.120 Volts
5.100
7F
7F
7E
FF
FF
FE
7FC0
7F00
7E00
FFC0
FF00
FE00
5.080
2.580
2.560
2.540
01
00
FF
81
80
7F
0100
0000
FF00
8100
8000
7F00
0.020
0.000
81
80
01
00
8100
8000
0100
0000
Table 8-16. Analog Input Channel Select Coding
Analog Input
CC
CB
CA
Channel
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
AN0
AN1
AN2
AN3
AN4
AN5
AN6
AN7
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Chapter 8 Analog-to-Digital Converter (ATD10B8CV3)
8.3.2.7
ATD Status Register 0 (ATDSTAT0)
This read-only register contains the sequence complete flag, overrun flags for external trigger and FIFO
mode, and the conversion counter.
Module Base + 0x0006
7
6
5
4
3
2
1
0
R
W
0
0
CC2
CC1
CC0
SCF
ETORF
FIFOR
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 8-9. ATD Status Register 0 (ATDSTAT0)
Read: Anytime
Write: Anytime (No effect on (CC2, CC1, CC0))
Table 8-17. ATDSTAT0 Field Descriptions
Field
Description
7
SCF
Sequence Complete Flag — This flag is set upon completion of a conversion sequence. If conversion
sequences are continuously performed (SCAN = 1), the flag is set after each one is completed. This flag is
cleared when one of the following occurs:
A) Write “1” to SCF
B) Write to ATDCTL5 (a new conversion sequence is started)
C) If AFFC=1 and read of a result register
0 Conversion sequence not completed
1 Conversion sequence has completed
5
External Trigger Overrun Flag — While in edge trigger mode (ETRIGLE = 0), if additional active edges are
detected while a conversion sequence is in process the overrun flag is set. This flag is cleared when one of the
following occurs:
ETORF
A) Write “1” to ETORF
B) Write to ATDCTL2, ATDCTL3 or ATDCTL4 (a conversion sequence is aborted)
C) Write to ATDCTL5 (a new conversion sequence is started)
0 No External trigger over run error has occurred
1 External trigger over run error has occurred
4
FIFO Over Run Flag — This bit indicates that a result register has been written to before its associated
conversion complete flag (CCF) has been cleared. This flag is most useful when using the FIFO mode because
the flag potentially indicates that result registers are out of sync with the input channels. However, it is also
practical for non-FIFO modes, and indicates that a result register has been over written before it has been read
(i.e., the old data has been lost). This flag is cleared when one of the following occurs:
A) Write “1” to FIFOR
FIFOR
B) Start a new conversion sequence (write to ATDCTL5 or external trigger)
0 No over run has occurred
1 An over run condition exists
2–0
CC[2:0]
Conversion Counter — These 3 read-only bits are the binary value of the conversion counter. The conversion
counter points to the result register that will receive the result of the current conversion. E.g. CC2 = 1, CC1 = 1,
CC0 = 0 indicates that the result of the current conversion will be in ATD result register 6. If in non-FIFO mode
(FIFO = 0) the conversion counter is initialized to zero at the begin and end of the conversion sequence. If in
FIFO mode (FIFO = 1) the register counter is not initialized. The conversion counters wraps around when its
maximum value is reached.
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Chapter 8 Analog-to-Digital Converter (ATD10B8CV3)
8.3.2.8
Reserved Register (ATDTEST0)
Module Base + 0x0008
7
6
5
4
3
2
1
0
R
W
U
1
U
U
U
U
U
U
U
Reset
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 8-10. Reserved Register (ATDTEST0)
Read: Anytime, returns unpredictable values
Write: Anytime in special modes, unimplemented in normal modes
NOTE
Writing to this register when in special modes can alter functionality.
8.3.2.9
ATD Test Register 1 (ATDTEST1)
This register contains the SC bit used to enable special channel conversions.
Module Base + 0x0009
7
6
5
4
3
2
1
0
R
W
U
U
0
0
0
0
0
SC
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 8-11. ATD Test Register 1 (ATDTEST1)
Read: Anytime, returns unpredictable values for Bit7 and Bit6
Write: Anytime
Table 8-18. ATDTEST1 Field Descriptions
Field
Description
0
SC
Special Channel Conversion Bit — If this bit is set, then special channel conversion can be selected using CC,
CB and CA of ATDCTL5. Table 8-19 lists the coding.
0 Special channel conversions disabled
1 Special channel conversions enabled
Note: Always write remaining bits of ATDTEST1 (Bit7 to Bit1) zero when writing SC bit. Not doing so might result
in unpredictable ATD behavior.
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Chapter 8 Analog-to-Digital Converter (ATD10B8CV3)
Table 8-19. Special Channel Select Coding
SC
CC
CB
CA
Analog Input Channel
1
1
1
1
1
0
1
1
1
1
X
0
0
1
1
X
0
1
0
1
Reserved
V
RH
V
RL
(V +V ) / 2
RH
RL
Reserved
8.3.2.10 ATD Status Register 1 (ATDSTAT1)
This read-only register contains the conversion complete flags.
Module Base + 0x000B
7
6
5
4
3
2
1
0
R
W
CCF7
CCF6
CCF5
CCF4
CCF3
CCF2
CCF1
CCF0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 8-12. ATD Status Register 1 (ATDSTAT1)
Read: Anytime
Write: Anytime, no effect
Table 8-20. ATDSTAT1 Field Descriptions
Description
Field
7–0
CCF[7:0]
Conversion Complete Flag x (x = 7, 6, 5, 4, 3, 2, 1, 0) — A conversion complete flag is set at the end of each
conversion in a conversion sequence. The flags are associated with the conversion position in a sequence (and
also the result register number). Therefore, CCF0 is set when the first conversion in a sequence is complete and
the result is available in result register ATDDR0; CCF1 is set when the second conversion in a sequence is
complete and the result is available in ATDDR1, and so forth. A flag CCFx (x = 7, 6, 5, 4, 3, 2,1, 70) is cleared
when one of the following occurs:
A) Write to ATDCTL5 (a new conversion sequence is started)
B) If AFFC=0 and read of ATDSTAT1 followed by read of result register ATDDRx
C) If AFFC=1 and read of result register ATDDRx
In case of a concurrent set and clear on CCFx: The clearing by method A) will overwrite the set. The clearing by
methods B) or C) will be overwritten by the set.
0 Conversion number x not completed
1 Conversion number x has completed, result ready in ATDDRx
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Chapter 8 Analog-to-Digital Converter (ATD10B8CV3)
8.3.2.11 ATD Input Enable Register (ATDDIEN)
Module Base + 0x000D
7
6
5
4
3
2
1
0
R
W
IEN7
IEN6
IEN5
IEN4
IEN3
IEN2
IEN1
IEN0
Reset
0
0
0
0
0
0
0
0
Figure 8-13. ATD Input Enable Register (ATDDIEN)
Read: Anytime
Write: Anytime
Table 8-21. ATDDIEN Field Descriptions
Description
Field
7–0
IEN[7:0]
ATD Digital Input Enable on channel x (x = 7, 6, 5, 4, 3, 2, 1, 0) — This bit controls the digital input buffer from
the analog input pin (ANx) to PTADx data register.
0 Disable digital input buffer to PTADx
1 Enable digital input buffer to PTADx.
Note: Setting this bit will enable the corresponding digital input buffer continuously. If this bit is set while
simultaneously using it as an analog port, there is potentially increased power consumption because the
digital input buffer maybe in the linear region.
8.3.2.12 Port Data Register (PORTAD)
The data port associated with the ATD can be configured as general-purpose I/O or input only, as specified
in the device overview. The port pins are shared with the analog A/D inputs AN7–0.
Module Base + 0x000F
7
6
5
4
3
2
1
0
R
W
PTAD7
PTAD6
PTAD5
PTAD4
PTAD3
PTAD2
PTAD1
PTAD0
Reset
1
1
1
1
1
1
1
1
Pin
Function
AN7
AN6
AN5
AN4
AN3
AN2
AN1
AN0
= Unimplemented or Reserved
Figure 8-14. Port Data Register (PORTAD)
Read: Anytime
Write: Anytime, no effect
The A/D input channels may be used for general purpose digital input.
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Chapter 8 Analog-to-Digital Converter (ATD10B8CV3)
Table 8-22. PORTAD Field Descriptions
Field
Description
7–0
A/D Channel x (ANx) Digital Input (x = 7, 6, 5, 4, 3, 2, 1, 0) — If the digital input buffer on the ANx pin is enabled
PTAD[7:0] (IENx = 1) or channel x is enabled as external trigger (ETRIGE = 1,ETRIGCH[2–0] = x,ETRIGSEL = 0) read
returns the logic level on ANx pin (signal potentials not meeting V or V specifications will have an
IL
IH
indeterminate value).
If the digital input buffers are disabled (IENx = 0) and channel x is not enabled as external trigger, read returns
a “1”.
Reset sets all PORTAD0 bits to “1”.
8.3.2.13 ATD Conversion Result Registers (ATDDRx)
The A/D conversion results are stored in 8 read-only result registers. The result data is formatted in the
result registers based on two criteria. First there is left and right justification; this selection is made using
the DJM control bit in ATDCTL5. Second there is signed and unsigned data; this selection is made using
the DSGN control bit in ATDCTL5. Signed data is stored in 2’s complement format and only exists in left
justified format. Signed data selected for right justified format is ignored.
Read: Anytime
Write: Anytime in special mode, unimplemented in normal modes
8.3.2.13.1 Left Justified Result Data
Module Base + 0x0010 = ATDDR0H, 0x0012 = ATDDR1H, 0x0014 = ATDDR2H, 0x0016 = ATDDR3H
Module Base + 0x0018 = ATDDR4H, 0x001A = ATDDR5H, 0x001C = ATDDR6H, 0x001E = ATDDR7H
7
6
5
4
3
2
1
0
R
R
BIT 9 MSB
BIT 7 MSB
BIT 8
BIT 6
BIT 7
BIT 5
BIT 6
BIT 4
BIT 5
BIT 3
BIT 4
BIT 2
BIT 3
BIT 1
BIT 2
BIT 0
10-bit data
8-bit data
W
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 8-15. Left Justified, ATD Conversion Result Register, High Byte (ATDDRxH)
Module Base + 0x0011 = ATDDR0L, 0x0013 = ATDDR1L, 0x0015 = ATDDR2L, 0x0017 = ATDDR3L
Module Base + 0x0019 = ATDDR4L, 0x001B = ATDDR5L, 0x001D = ATDDR6L, 0x001F = ATDDR7L
7
6
5
4
3
2
1
0
R
R
BIT 1
U
BIT 0
U
0
0
0
0
0
0
0
0
0
0
0
0
W
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 8-16. Left Justified, ATD Conversion Result Register, Low Byte (ATDDRxL)
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Chapter 8 Analog-to-Digital Converter (ATD10B8CV3)
8.3.2.13.2 Right Justified Result Data
Module Base + 0x0010 = ATDDR0H, 0x0012 = ATDDR1H, 0x0014 = ATDDR2H, 0x0016 = ATDDR3H
Module Base + 0x0018 = ATDDR4H, 0x001A = ATDDR5H, 0x001C = ATDDR6H, 0x001E = ATDDR7H
7
6
5
4
3
2
1
0
R
R
0
0
0
0
0
0
0
0
0
0
0
0
BIT 9 MSB
0
BIT 8
0
10-bit data
8-bit data
W
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 8-17. Right Justified, ATD Conversion Result Register, High Byte (ATDDRxH)
Module Base + 0x0011 = ATDDR0L, 0x0013 = ATDDR1L, 0x0015 = ATDDR2L, 0x0017 = ATDDR3L
Module Base + 0x0019 = ATDDR4L, 0x001B = ATDDR5L, 0x001D = ATDDR6L, 0x001F = ATDDR7L
7
6
5
4
3
2
1
0
R
R
BIT 7
BIT 7 MSB
BIT 6
BIT 6
BIT 5
BIT 5
BIT 4
BIT 4
BIT 3
BIT 3
BIT 2
BIT 2
BIT 1
BIT 1
BIT 0
BIT 0
10-bit data
8-bit data
W
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 8-18. Right Justified, ATD Conversion Result Register, Low Byte (ATDDRxL)
8.4
Functional Description
The ATD is structured in an analog and a digital sub-block.
8.4.1
Analog Sub-Block
The analog sub-block contains all analog electronics required to perform a single conversion. Separate
power supplies V and V allow to isolate noise of other MCU circuitry from the analog sub-block.
DDA
SSA
8.4.1.1
Sample and Hold Machine
The sample and hold (S/H) machine accepts analog signals from the external surroundings and stores them
as capacitor charge on a storage node.
The sample process uses a two stage approach. During the first stage, the sample amplifier is used to
quickly charge the storage node.The second stage connects the input directly to the storage node to
complete the sample for high accuracy.
When not sampling, the sample and hold machine disables its own clocks. The analog electronics still draw
their quiescent current. The power down (ADPU) bit must be set to disable both the digital clocks and the
analog power consumption.
The input analog signals are unipolar and must fall within the potential range of V
to V
.
SSA
DDA
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Chapter 8 Analog-to-Digital Converter (ATD10B8CV3)
8.4.1.2
Analog Input Multiplexer
The analog input multiplexer connects one of the 8 external analog input channels to the sample and hold
machine.
8.4.1.3
Sample Buffer Amplifier
The sample amplifier is used to buffer the input analog signal so that the storage node can be quickly
charged to the sample potential.
8.4.1.4
Analog-to-Digital (A/D) Machine
The A/D Machine performs analog to digital conversions. The resolution is program selectable at either 8
or 10 bits. The A/D machine uses a successive approximation architecture. It functions by comparing the
stored analog sample potential with a series of digitally generated analog potentials. By following a binary
search algorithm, the A/D machine locates the approximating potential that is nearest to the sampled
potential.
When not converting the A/D machine disables its own clocks. The analog electronics still draws quiescent
current. The power down (ADPU) bit must be set to disable both the digital clocks and the analog power
consumption.
Only analog input signals within the potential range of V to V (A/D reference potentials) will result
RL
RH
in a non-railed digital output codes.
8.4.2
Digital Sub-Block
This subsection explains some of the digital features in more detail. See register descriptions for all details.
8.4.2.1
External Trigger Input
The external trigger feature allows the user to synchronize ATD conversions to the external environment
events rather than relying on software to signal the ATD module when ATD conversions are to take place.
The external trigger signal (out of reset ATD channel 7, configurable in ATDCTL1) is programmable to
be edge or level sensitive with polarity control. Table 8-23 gives a brief description of the different
combinations of control bits and their effect on the external trigger function.
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Chapter 8 Analog-to-Digital Converter (ATD10B8CV3)
Table 8-23. External Trigger Control Bits
ETRIGLE
ETRIGP
ETRIGE
SCAN
Description
X
X
0
0
Ignores external trigger. Performs one
conversion sequence and stops.
X
0
0
1
X
0
1
0
0
1
1
1
1
X
X
X
Ignores external trigger. Performs
continuous conversion sequences.
Falling edge triggered. Performs one
conversion sequence per trigger.
Rising edge triggered. Performs one
conversion sequence per trigger.
Trigger active low. Performs
continuous conversions while trigger
is active.
1
1
1
X
Trigger active high. Performs
continuous conversions while trigger
is active.
During a conversion, if additional active edges are detected the overrun error flag ETORF is set.
In either level or edge triggered modes, the first conversion begins when the trigger is received. In both
cases, the maximum latency time is one bus clock cycle plus any skew or delay introduced by the trigger
circuitry.
NOTE
The conversion results for the external trigger ATD channel 7 have no
meaning while external trigger mode is enabled.
Once ETRIGE is enabled, conversions cannot be started by a write to ATDCTL5, but rather must be
triggered externally.
If the level mode is active and the external trigger both de-asserts and re-asserts itself during a conversion
sequence, this does not constitute an overrun; therefore, the flag is not set. If the trigger is left asserted in
level mode while a sequence is completing, another sequence will be triggered immediately.
8.4.2.2
General Purpose Digital Input Port Operation
The input channel pins can be multiplexed between analog and digital data. As analog inputs, they are
multiplexed and sampled to supply signals to the A/D converter. As digital inputs, they supply external
input data that can be accessed through the digital port register PORTAD (input-only).
The analog/digital multiplex operation is performed in the input pads. The input pad is always connected
to the analog inputs of the ATD. The input pad signal is buffered to the digital port registers. This buffer
can be turned on or off with the ATDDIEN register. This is important so that the buffer does not draw
excess current when analog potentials are presented at its input.
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Chapter 8 Analog-to-Digital Converter (ATD10B8CV3)
8.4.2.3
Low Power Modes
The ATD can be configured for lower MCU power consumption in 3 different ways:
1. Stop mode: This halts A/D conversion. Exit from stop mode will resume A/D conversion, but due
to the recovery time the result of this conversion should be ignored.
2. Wait mode with AWAI = 1: This halts A/D conversion. Exit from wait mode will resume A/D
conversion, but due to the recovery time the result of this conversion should be ignored.
3. Writing ADPU = 0 (Note that all ATD registers remain accessible.): This aborts any A/D
conversion in progress.
Note that the reset value for the ADPU bit is zero. Therefore, when this module is reset, it is reset into the
power down state.
8.5
Resets
At reset the ATD is in a power down state. The reset state of each individual bit is listed within the Register
Description section (see Section 8.3, “Memory Map and Register Definition”), which details the registers
and their bit-field.
8.6
Interrupts
The interrupt requested by the ATD is listed in Table 8-24. Refer to the device overview chapter for related
vector address and priority.
Table 8-24. ATD Interrupt Vectors
CCR
Mask
Interrupt Source
Local Enable
Sequence complete
interrupt
I bit
ASCIE in ATDCTL2
See register descriptions for further details.
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Chapter 9
XGATE (S12XGATEV2)
9.1
Introduction
The XGATE module is a peripheral co-processor that allows autonomous data transfers between the
MCU’s peripherals and the internal memories. It has a built in RISC core that is able to pre-process the
transferred data and perform complex communication protocols.
The XGATE module is intended to increase the MCU’s data throughput by lowering the S12X_CPU’s
Figure 9-1 gives an overview on the XGATE architecture.
•
•
•
•
•
•
•
XGATE registers (Section 9.3, “Memory Map and Register Definition”)
Hardware semaphores (Section 9.4.4, “Semaphores”)
Interrupt handling (Section 9.5, “Interrupts”)
Debug features (Section 9.6, “Debug Mode”)
Security (Section 9.7, “Security”)
Instruction set (Section 9.8, “Instruction Set”)
9.1.1
Features
The XGATE module includes these features:
•
•
•
Data movement between various targets (i.e Flash, RAM, and peripheral modules)
Data manipulation through built in RISC core
Provides up to 112 XGATE channels
— 104 hardware triggered channels
— 8 software triggered channels
•
•
•
Hardware semaphores which are shared between the S12X_CPU and the XGATE module
Able to trigger S12X_CPU interrupts upon completion of an XGATE transfer
Software error detection to catch erratic application code
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
373
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Chapter 9 XGATE (S12XGATEV2)
9.1.2
Modes of Operation
There are four run modes on S12X devices.
•
Run mode, wait mode, stop mode
The XGATE is able to operate in all of these three system modes. Clock activity will be
automatically stopped when the XGATE module is idle.
•
Freeze mode (BDM active)
In freeze mode all clocks of the XGATE module may be stopped, depending on the module
configuration (see Section 9.3.2.1, “XGATE Control Register (XGMCTL)”).
9.1.3
Block Diagram
Figure Figure 9-1 shows a block diagram of the XGATE.
Peripheral Interrupts
S12X_INT
XGATE
Interrupt Flags
Semaphores
Software
RISC Core
Triggers
Software Triggers
S12X_DBG
S12X_MMC
Peripherals
Figure 9-1. XGATE Block Diagram
9.2
External Signal Description
The XGATE module has no external pins.
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 9 XGATE (S12XGATEV2)
9.3
Memory Map and Register Definition
This section provides a detailed description of address space and registers used by the XGATE module.
The memory map for the XGATE module is given below in Table 9-1.The address listed for each register
is the sum of a base address and an address offset. The base address is defined at the SoC level and the
address offset is defined at the module level. Reserved registers read zero. Write accesses to the reserved
registers have no effect.
9.3.1
Module Memory Map
Table 9-1. Module Memory Map
Address Offset
Use
Access
1
0x0000, 0x0001
0x0002
XGATE Module Control Register (XGMCTL)
XGATE Channel ID Register (XGCHID)
Read/Write
1,2
Read/Write
0x0003
0x0004, 0x0005
Reserved
None
1
0x0006, 0x0007
XGATE Vector Base Address (XGVBR)
Read/Write
Read/Write
0x0008, 0x0009,
0x000A, 0x000B,
0x000C, 0x000D,
0x000E, 0x000F,
0x0010, 0x0011,
0x0012, 0x0013,
0x0014, 0x0015,
0x0016, 0x0017
1
XGATE Interrupt Flag Vector (XGIF)
0x0018, 0x0019
0x001A, 0x001B
0x001C
XGATE Software Trigger Register (XGSWT)
XGATE Semaphore Register (XGSEM)
Reserved
Read/Write
3
Read/Write
None
1,4
0x001D
XGATE Condition Code Register (XGCCR)
XGATE Program Counter (XGPC)
Reserved
Read/Write
Read/Write
None
4
0x001E, 0x001F
0x0020, 0x0021
0x0022, 0x0023
0x0024, 0x0025
0x0026, 0x0027
0x0028, 0x0029
0x002A,0x002B
0x002C, 0x002D
0x002E, 0x002F
4
4
4
4
4
4
4
XGATE Register 1 (XGR1)
XGATE Register 2 (XGR2)
XGATE Register 3 (XGR3)
XGATE Register 4 (XGR4)
XGATE Register 5 (XGR5)
XGATE Register 6 (XGR6)
XGATE Register 7 (XGR7)
Read/Write
Read/Write
Read/Write
Read/Write
Read/Write
Read/Write
Read/Write
0x0030, 0x0031,
0x0032, 0x0033,
0x0034, 0x0035,
0x0036, 0x0037,
0x0038, 0x0039
Reserved
None
1
2
3
4
Write only if in Debug Mode.
See Section 9.4.4, “Semaphores”
Read and Write only if in Debug Mode.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
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Chapter 9 XGATE (S12XGATEV2)
9.3.2
Register Descriptions
This section consists of register descriptions in address order. Each description includes a standard register
diagram with an associated figure number. Details of register bit and field function follow the register
diagrams, in bit order.
Register
Name
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
0x0000
XGMCTL
R
0
0
0
0
0
0
0
0
0
XG
FACT
XG
SWEIF
XGE XGFRZ XGDBG XGSS
XGIE
XG XG
FRZM DBGM
XG
FACTM
XG
SWEIFM
XGEM
XGSSM
XGIEM
W
0x0002
R
0
XGCHID[6:0]
XGMCHID
W
0x0003
R
Reserved
W
0x0004
R
Reserved
W
0x0005
R
Reserved
W
0x0006
XGVBR
R
0
XGVBR[15:1]
W
127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112
0x0008
XGIF
R
0
0
0
0
0
0
0
XGIF_78 XGF_77 XGIF_76 XGIF_75 XGIF_74 XGIF_73 XGIF_72 XGIF_71 XGIF_70
W
111 110 109 108 107 106 105 104 103 102 101 100
99
98
97
96
0x000A
XGIF
R
XGIF_6E XGIF_6D XGIF_6C XGIF_6B XGIF_6A XGIF_69 XGIF_68 XGF_67 XGIF_66 XGIF_65 XGIF_64 XGIF_63 XGIF_62 XGIF_61 XGIF_60
W XGIF_6F
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
0x000C
XGIF
R
XGIF_5E XGIF_5D XGIF_5C XGIF_5B XGIF_5A XGIF_59 XGIF_58 XGF_57 XGIF_56 XGIF_55 XGIF_54 XGIF_53 XGIF_52 XGIF_51 XGIF_50
W XGIF_5F
79
R
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
0x000E
XGIF
XGIF_4E XGIF_4D XGIF_4C XGIF_4B XGIF_4A XGIF_49 XGIF_48 XGF _47 XGIF_46 XGIF_45 XGIF_44 XGIF_43 XGIF_42 XGIF_41 XGIF_40
W XGIF_4F
= Unimplemented or Reserved
Figure 9-2. XGATE Register Summary (Sheet 1 of 3)
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 9 XGATE (S12XGATEV2)
Register
Name
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
0x0010
XGIF
R
XGIF_3E XGIF_3D XGIF_3C XGIF_3B XGIF_3A XGIF_39 XGIF_38 XGF _37 XGIF_36 XGIF_35 XGIF_34 XGIF_33 XGIF_32 XGIF_31 XGIF_30
W XGIF_3F
47
R
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
0x0012
XGIF
XGIF_2E XGIF_2D XGIF_2C XGIF_2B XGIF_2A XGIF_29 XGIF_28 XGF _27 XGIF_26 XGIF_25 XGIF_24 XGIF_23 XGIF_22 XGIF_21 XGIF_20
W XGIF_2F
31
R
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
0x0014
XGIF
XGIF_1E XGIF_1D XGIF_1C XGIF_1B XGIF_1A XGIF_19 XGIF_18 XGF _17 XGIF_16 XGIF_15 XGIF_14 XGIF_13 XGIF_12 XGIF_11 XGIF_10
W XGIF_1F
15
R
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
0x0016
XGIF
0
0
0
0
0
0
0
0
0
XGIF_0E XGIF_0D XGIF_0C XGIF_0B XGIF_0A XGIF_09
W XGIF_0F
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
0x0018
XGSWTM
R
0
0
0
0
0
0
0
0
XGSWT[7:0]
XGSEM[7:0]
W
XGSWTM[7:0]
0x001A
XGSEMM
R
0
0
0
0
0
0
0
0
W
XGSEMM[7:0]
0x001C
R
Reserved
W
0x001D
XGCCR
R
0
0
0
0
XGN XGZ XGV XGC
W
0x001E
XGPC
R
XGPC
W
0x0020
R
Reserved
W
0x0021
R
Reserved
W
0x0022
XGR1
R
XGR1
XGR2
W
0x0024
XGR2
R
W
= Unimplemented or Reserved
Figure 9-2. XGATE Register Summary (Sheet 2 of 3)
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
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Chapter 9 XGATE (S12XGATEV2)
Register
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Name
0x0026
XGR3
R
XGR3
W
0x0028
XGR4
R
XGR4
XGR5
XGR6
XGR7
W
0x002A
XGR5
R
W
0x002C
XGR6
R
W
0x002E
XGR7
R
W
= Unimplemented or Reserved
Figure 9-2. XGATE Register Summary (Sheet 3 of 3)
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 9 XGATE (S12XGATEV2)
9.3.2.1
XGATE Control Register (XGMCTL)
All module level switches and flags are located in the module control register Figure 9-3.
Module Base +0x00000
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
R
0
0
0
0
0
0
0
0
0
XG
SWEIF
XGE XGFRZ XGDBG XGSS XGFACT
XGIE
W
XG XG
FRZM DBGM SSM FACTM
XG
XG
XG
SWEIFM
XGEM
XGIEM
Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 9-3. XGATE Control Register (XGMCTL)
Read: Anytime
Write: Anytime
Table 9-2. XGMCTL Field Descriptions (Sheet 1 of 3)
Description
Field
15
XGE Mask — This bit controls the write access to the XGE bit. The XGE bit can only be set or cleared if a "1" is
XGEM
written to the XGEM bit in the same register access.
Read:
This bit will always read "0".
Write:
0 Disable write access to the XGE in the same bus cycle
1 Enable write access to the XGE in the same bus cycle
14
XGFRZ Mask — This bit controls the write access to the XGFRZ bit. The XGFRZ bit can only be set or cleared
XGFRZM if a "1" is written to the XGFRZM bit in the same register access.
Read:
This bit will always read "0".
Write:
0 Disable write access to the XGFRZ in the same bus cycle
1 Enable write access to the XGFRZ in the same bus cycle
13
XGDBG Mask — This bit controls the write access to the XGDBG bit. The XGDBG bit can only be set or cleared
XGDBGM if a "1" is written to the XGDBGM bit in the same register access.
Read:
This bit will always read "0".
Write:
0 Disable write access to the XGDBG in the same bus cycle
1 Enable write access to the XGDBG in the same bus cycle
12
XGSS Mask — This bit controls the write access to the XGSS bit. The XGSS bit can only be set or cleared if a
XGSSM
"1" is written to the XGSSM bit in the same register access.
Read:
This bit will always read "0".
Write:
0 Disable write access to the XGSS in the same bus cycle
1 Enable write access to the XGSS in the same bus cycle
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
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Chapter 9 XGATE (S12XGATEV2)
Table 9-2. XGMCTL Field Descriptions (Sheet 2 of 3)
Description
Field
11
XGFACT Mask — This bit controls the write access to the XGFACT bit. The XGFACT bit can only be set or
XGFACTM cleared if a "1" is written to the XGFACTM bit in the same register access.
Read:
This bit will always read "0".
Write:
0 Disable write access to the XGFACT in the same bus cycle
1 Enable write access to the XGFACT in the same bus cycle
9
XGSWEIF Mask — This bit controls the write access to the XGSWEIF bit. The XGSWEIF bit can only be cleared
XGSWEIFM if a "1" is written to the XGSWEIFM bit in the same register access.
Read:
This bit will always read "0".
Write:
0 Disable write access to the XGSWEIF in the same bus cycle
1 Enable write access to the XGSWEIF in the same bus cycle
8
XGIE Mask — This bit controls the write access to the XGIE bit. The XGIE bit can only be set or cleared if a "1"
XGIEM
is written to the XGIEM bit in the same register access.
Read:
This bit will always read "0".
Write:
0 Disable write access to the XGIE in the same bus cycle
1 Enable write access to the XGIE in the same bus cycle
7
XGATE Module Enable — This bit enables the XGATE module. If the XGATE module is disabled, pending
XGE
XGATE requests will be ignored. The thread that is executed by the RISC core while the XGE bit is cleared will
continue to run.
Read:
0 XGATE module is disabled
1 XGATE module is enabled
Write:
0 Disable XGATE module
1 Enable XGATE module
6
Halt XGATE in Freeze Mode — The XGFRZ bit controls the XGATE operation in Freeze Mode (BDM active).
XGFRZ
Read:
0 RISC core operates normally in Freeze (BDM active)
1 RISC core stops in Freeze Mode (BDM active)
Write:
0 Don’t stop RISC core in Freeze Mode (BDM active)
1 Stop RISC core in Freeze Mode (BDM active)
5
XGATE Debug Mode — This bit indicates that the XGATE is in Debug Mode (see Section 9.6, “Debug Mode”).
XGDBG
Debug Mode can be entered by Software Breakpoints (BRK instruction), Tagged or Forced Breakpoints (see
S12X_DBG Section), or by writing a "1" to this bit.
Read:
0 RISC core is not in Debug Mode
1 RISC core is in Debug Mode
Write:
0 Leave Debug Mode
1 Enter Debug Mode
Note: Freeze Mode and Software Error Interrupts have no effect on the XGDBG bit.
MC9S12XDP512 Data Sheet, Rev. 2.11
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Freescale Semiconductor
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Chapter 9 XGATE (S12XGATEV2)
Table 9-2. XGMCTL Field Descriptions (Sheet 3 of 3)
Description
Field
4
XGATE Single Step — This bit forces the execution of a single instruction if the XGATE is in DEBUG Mode and
XGSS
no software error has occurred (XGSWEIF cleared).
Read:
0 No single step in progress
1 Single step in progress
Write
0 No effect
1 Execute a single RISC instruction
Note: Invoking a Single Step will cause the XGATE to temporarily leave Debug Mode until the instruction has
been executed.
3
Fake XGATE Activity — This bit forces the XGATE to flag activity to the MCU even when it is idle. When it is set
XGFACT
the MCU will never enter system stop mode which assures that peripheral modules will be clocked during XGATE
idle periods
Read:
0 XGATE will only flag activity if it is not idle or in debug mode.
1 XGATE will always signal activity to the MCU.
Write:
0 Only flag activity if not idle or in debug mode.
1 Always signal XGATE activity.
1
XGATE Software Error Interrupt Flag — This bit signals a pending Software Error Interrupt. It is set if the RISC
XGSWEIF core detects an error condition (see Section 9.4.5, “Software Error Detection”). The RISC core is stopped while
this bit is set. Clearing this bit will terminate the current thread and cause the XGATE to become idle.
Read:
0 Software Error Interrupt is not pending
1 Software Error Interrupt is pending if XGIE is set
Write:
0 No effect
1 Clears the XGSWEIF bit
0
XGATE Interrupt Enable — This bit acts as a global interrupt enable for the XGATE module
XGIE
Read:
0 All XGATE interrupts disabled
1 All XGATE interrupts enabled
Write:
0 Disable all XGATE interrupts
1 Enable all XGATE interrupts
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
381
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Chapter 9 XGATE (S12XGATEV2)
9.3.2.2
The XGATE channel ID register (Figure 9-4) shows the identifier of the XGATE channel that is currently
active. This register will read “$00” if the XGATE module is idle. In debug mode this register can be used
to start and terminate threads (see Section 9.6.1, “Debug Features”).
Module Base +0x0002
7
6
5
4
3
2
1
0
R
W
0
XGCHID[6:0]
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 9-4. XGATE Channel ID Register (XGCHID)
Read: Anytime
Write: In Debug Mode
Table 9-3. XGCHID Field Descriptions
Description
Field
6–0
Request Identifier — ID of the currently active channel
XGCHID[6:0]
9.3.2.3
The vector base address register (Figure 9-5 and Figure 9-6) determines the location of the XGATE vector
block.
Module Base +0x0006
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
R
W
0
XGVBR[15:1]
Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 9-5. XGATE Vector Base Address Register (XGVBR)
Read: Anytime
Write: Only if the module is disabled (XGE = 0) and idle (XGCHID = $00))
Table 9-4. XGVBR Field Descriptions
Field
Description
Vector Base Address — The XGVBR register holds the start address of the vector block in the XGATE
15–1
XBVBR[15:1] memory map.
MC9S12XDP512 Data Sheet, Rev. 2.11
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Freescale Semiconductor
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Chapter 9 XGATE (S12XGATEV2)
9.3.2.4
The interrupt flag vector (Figure 9-6) provides access to the interrupt flags bits of each channel. Each flag
may be cleared by writing a "1" to its bit location.
Module Base +0x0008
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
R
W
0
0
0
0
0
0
0
XGIF_78 XGF_77 XGIF_76 XGIF_75 XGIF_74 XGIF_73 XGIF_72 XGIF_71 XGIF_70
Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
111
110
109
108
107
106
105
104
103
102
101
100
99
98
97
96
R
W
XGIF_6F XGIF_6E XGIF_6D XGIF_6C XGIF_6B XGIF_6A XGIF_69 XGIF_68 XGF_67 XGIF_66 XGIF_65 XGIF_64 XGIF_63 XGIF_62 XGIF_61 XGIF_60
Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
R
W
XGIF_5F XGIF_5E XGIF_5D XGIF_5C XGIF_5B XGIF_5A XGIF_59 XGIF_58 XGF_57 XGIF_56 XGIF_55 XGIF_54 XGIF_53 XGIF_52 XGIF_51 XGIF_50
Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
R
W
XGIF_4F XGIF_4E XGIF_4D XGIF_4C XGIF_4B XGIF_4A XGIF_49 XGIF_48 XGF _47 XGIF_46 XGIF_45 XGIF_44 XGIF_43 XGIF_42 XGIF_41 XGIF_40
Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
R
W
XGIF_3F XGIF_3E XGIF_3D XGIF_3C XGIF_3B XGIF_3A XGIF_39 XGIF_38 XGF _37 XGIF_36 XGIF_35 XGIF_34 XGIF_33 XGIF_32 XGIF_31 XGIF_30
Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
R
W
XGIF_2F XGIF_2E XGIF_2D XGIF_2C XGIF_2B XGIF_2A XGIF_29 XGIF_28 XGF _27 XGIF_26 XGIF_25 XGIF_24 XGIF_23 XGIF_22 XGIF_21 XGIF_20
Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
R
W
XGIF_1F XGIF_1E XGIF_1D XGIF_1C XGIF_1B XGIF_1A XGIF_19 XGIF_18 XGF _17 XGIF_16 XGIF_15 XGIF_14 XGIF_13 XGIF_12 XGIF_11 XGIF_10
Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
0
XGIF_0F XGIF_0E XGIF_0D XGIF_0C XGIF_0B XGIF_0A XGIF_09
Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 9-6. XGATE Channel Interrupt Flag Vector (XGIF)
Read: Anytime
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Chapter 9 XGATE (S12XGATEV2)
Write: Anytime
Table 9-5. XGIV Field Descriptions
Description
Field
127–9
Channel Interrupt Flags — These bits signal pending channel interrupts. They can only be set by the RISC
XGIF[78:9]
core. Each flag can be cleared by writing a "1" to its bit location. Unimplemented interrupt flags will always read
"0". Refer to Section “Interrupts” of the SoC Guide for a list of implemented Interrupts.
Read:
0 Channel interrupt is not pending
1 Channel interrupt is pending if XGIE is set
Write:
0 No effect
1 Clears the interrupt flag
NOTE
Suggested Mnemonics for accessing the interrupt flag vector on a word
basis are:
XGIF_7F_70 (XGIF[127:112]),
XGIF_6F_60 (XGIF[111:96]),
XGIF_5F_50 (XGIF[95:80]),
XGIF_4F_40 (XGIF[79:64]),
XGIF_3F_30 (XGIF[63:48]),
XGIF_2F_20 (XGIF[47:32]),
XGIF_1F_10 (XGIF[31:16]),
XGIF_0F_00 (XGIF[15:0])
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Chapter 9 XGATE (S12XGATEV2)
9.3.2.5
XGATE Software Trigger Register (XGSWT)
The eight software triggers of the XGATE module can be set and cleared through the XGATE software
trigger register (Figure 9-7). The upper byte of this register, the software trigger mask, controls the write
access to the lower byte, the software trigger bits. These bits can be set or cleared if a "1" is written to the
associated mask in the same bus cycle.
Module Base +0x00018
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
XGSWT[7:0]
XGSWTM[7:0]
Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Figure 9-7. XGATE Software Trigger Register (XGSWT)
Read: Anytime
Write: Anytime
Table 9-6. XGSWT Field Descriptions
Description
Field
15–8
Software Trigger Mask — These bits control the write access to the XGSWT bits. Each XGSWT bit can only
XGSWTM[7:0] be written if a "1" is written to the corresponding XGSWTM bit in the same access.
Read:
These bits will always read "0".
Write:
0 Disable write access to the XGSWT in the same bus cycle
1 Enable write access to the corresponding XGSWT bit in the same bus cycle
7–0
Software Trigger Bits — These bits act as interrupt flags that are able to trigger XGATE software channels.
XGSWT[7:0] They can only be set and cleared by software.
Read:
0 No software trigger pending
1 Software trigger pending if the XGIE bit is set
Write:
0 Clear Software Trigger
1 Set Software Trigger
NOTE
The XGATE channel IDs that are associated with the eight software triggers
are determined on chip integration level. (see Section “Interrupts” of the Soc
Guide)
XGATE software triggers work like any peripheral interrupt. They can be
used as XGATE requests as well as S12X_CPU interrupts. The target of the
software trigger must be selected in the S12X_INT module.
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Chapter 9 XGATE (S12XGATEV2)
9.3.2.6
XGATE Semaphore Register (XGSEM)
The XGATE provides a set of eight hardware semaphores that can be shared between the S12X_CPU and
the XGATE RISC core. Each semaphore can either be unlocked, locked by the S12X_CPU or locked by
instructions. The S12X_CPU has access to the semaphores through the XGATE semaphore register
(Figure 9-8). Refer to section Section 9.4.4, “Semaphores” for details.
Module Base +0x0001A
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
XGSEM[7:0]
XGSEMM[7:0]
Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Figure 9-8. XGATE Semaphore Register (XGSEM)
Read: Anytime
Write: Anytime (see Section 9.4.4, “Semaphores”)
Table 9-7. XGSEM Field Descriptions
Field
Description
15–8
Semaphore Mask — These bits control the write access to the XGSEM bits.
XGSEMM[7:0] Read:
These bits will always read "0".
Write:
0 Disable write access to the XGSEM in the same bus cycle
1 Enable write access to the XGSEM in the same bus cycle
7–0
Semaphore Bits — These bits indicate whether a semaphore is locked by the S12X_CPU. A semaphore can
XGSEM[7:0] be attempted to be set by writing a "1" to the XGSEM bit and to the corresponding XGSEMM bit in the same
write access. Only unlocked semaphores can be set. A semaphore can be cleared by writing a "0" to the
XGSEM bit and a "1" to the corresponding XGSEMM bit in the same write access.
Read:
0 Semaphore is unlocked or locked by the RISC core
1 Semaphore is locked by the S12X_CPU
Write:
0 Clear semaphore if it was locked by the S12X_CPU
1 Attempt to lock semaphore by the S12X_CPU
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Chapter 9 XGATE (S12XGATEV2)
9.3.2.7
The XGCCR register (Figure 9-9) provides access to the RISC core’s condition code register.
Module Base +0x001D
7
6
5
4
3
2
1
0
R
W
0
0
0
0
XGN
XGZ
XGV
XGC
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 9-9. XGATE Condition Code Register (XGCCR)
Read: In debug mode if unsecured
Write: In debug mode if unsecured
Table 9-8. XGCCR Field Descriptions
Field
Description
3
XGN
Sign Flag — The RISC core’s Sign flag
Zero Flag — The RISC core’s Zero flag
2
XGZ
1
XGV
Overflow Flag — The RISC core’s Overflow flag
Carry Flag — The RISC core’s Carry flag
0
XGC
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Chapter 9 XGATE (S12XGATEV2)
9.3.2.8
The XGPC register (Figure 9-10) provides access to the RISC core’s program counter.
Module Base +0x0001E
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
R
W
XGPC
Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Figure 9-10. XGATE Program Counter Register (XGPC)
Figure 9-11.
Read: In debug mode if unsecured
Write: In debug mode if unsecured
Table 9-9. XGPC Field Descriptions
Description
Field
15–0
Program Counter — The RISC core’s program counter
XGPC[15:0]
9.3.2.9
The XGR1 register (Figure 9-12) provides access to the RISC core’s register 1.
Module Base +0x00022
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
R
W
XGR1
Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Figure 9-12. XGATE Register 1 (XGR1)
Read: In debug mode if unsecured
Write: In debug mode if unsecured
Table 9-10. XGR1 Field Descriptions
Field
Description
15–0
XGATE Register 1 — The RISC core’s register 1
XGR1[15:0]
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Chapter 9 XGATE (S12XGATEV2)
9.3.2.10 XGATE Register 2 (XGR2)
The XGR2 register (Figure 9-13) provides access to the RISC core’s register 2.
Module Base +0x00024
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
R
W
XGR2
Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Figure 9-13. XGATE Register 2 (XGR2)
Read: In debug mode if unsecured
Write: In debug mode if unsecured
Table 9-11. XGR2 Field Descriptions
Field
Description
15–0
XGATE Register 2 — The RISC core’s register 2
XGR2[15:0]
9.3.2.11 XGATE Register 3 (XGR3)
The XGR3 register (Figure 9-14) provides access to the RISC core’s register 3.
Module Base +0x00026
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
R
W
XGR3
Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Figure 9-14. XGATE Register 3 (XGR3)
Read: In debug mode if unsecured
Write: In debug mode if unsecured
Table 9-12. XGR3 Field Descriptions
Field
Description
15–0
XGATE Register 3 — The RISC core’s register 3
XGR3[15:0]
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Chapter 9 XGATE (S12XGATEV2)
9.3.2.12 XGATE Register 4 (XGR4)
The XGR4 register (Figure 9-15) provides access to the RISC core’s register 4.
Module Base +0x00028
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
R
W
XGR4
Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Figure 9-15. XGATE Register 4 (XGR4)
Read: In debug mode if unsecured
Write: In debug mode if unsecured
Table 9-13. XGR4 Field Descriptions
Field
Description
15–0
XGATE Register 4 — The RISC core’s register 4
XGR4[15:0]
9.3.2.13 XGATE Register 5 (XGR5)
The XGR5 register (Figure 9-16) provides access to the RISC core’s register 5.
Module Base +0x0002A
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
R
W
XGR5
Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Figure 9-16. XGATE Register 5 (XGR5)
Read: In debug mode if unsecured
Write: In debug mode if unsecured
Table 9-14. XGR5 Field Descriptions
Field
Description
15–0
XGATE Register 5 — The RISC core’s register 5
XGR5[15:0]
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Chapter 9 XGATE (S12XGATEV2)
9.3.2.14 XGATE Register 6 (XGR6)
The XGR6 register (Figure 9-17) provides access to the RISC core’s register 6.
Module Base +0x0002C
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
R
W
XGR6
Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Figure 9-17. XGATE Register 6 (XGR6)
Read: In debug mode if unsecured
Write: In debug mode if unsecured
Table 9-15. XGR6 Field Descriptions
Field
Description
15–0
XGATE Register 6 — The RISC core’s register 6
XGR6[15:0]
9.3.2.15 XGATE Register 7 (XGR7)
The XGR7 register (Figure 9-18) provides access to the RISC core’s register 7.
Module Base +0x0002E
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
R
W
XGR7
Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Figure 9-18. XGATE Register 7 (XGR7)
Read: In debug mode if unsecured
Write: In debug mode if unsecured
Table 9-16. XGR7 Field Descriptions
Field
Description
15–0
XGATE Register 7 — The RISC core’s register 7
XGR7[15:0]
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Chapter 9 XGATE (S12XGATEV2)
9.4
Functional Description
The core of the XGATE module is a RISC processor which is able to access the MCU’s internal memories
and peripherals (see Figure 9-1). The RISC processor always remains in an idle state until it is triggered
by an XGATE request. Then it executes a code sequence that is associated with the request and optionally
triggers an interrupt to the S12X_CPU upon completion. Code sequences are not interruptible. A new
XGATE request can only be serviced when the previous sequence is finished and the RISC core becomes
idle.
The XGATE module also provides a set of hardware semaphores which are necessary to ensure data
consistency whenever RAM locations or peripherals are shared with the S12X_CPU.
The following sections describe the components of the XGATE module in further detail.
9.4.1
XGATE RISC Core
The RISC core is a 16-bit processor with an instruction set that is well suited for data transfers, bit
manipulations, and simple arithmetic operations (see Section 9.8, “Instruction Set”).
It is able to access the MCU’s internal memories and peripherals without blocking these resources from
1
the S12X_CPU . Whenever the S12X_CPU and the RISC core access the same resource, the RISC core
1
will be stalled until the resource becomes available again .
The XGATE offers a high access rate to the MCU’s internal RAM. Depending on the bus load, the RISC
core can perform up to two RAM accesses per S12X_CPU bus cycle. A minimum throughput of one RAM
access per S12X_CPU bus cycle is guaranteed.
Bus accesses to peripheral registers or flash are slower. A transfer rate of one bus access per S12X_CPU
cycle can not be exceeded.
The XGATE module is intended to execute short interrupt service routines that are triggered by peripheral
modules or by software.
1. With the exception of PRR registers (see Section “S12X_MMC”).
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Chapter 9 XGATE (S12XGATEV2)
9.4.2
Programmer’s Model
Register Block
Program Counter
PC
15
0
0
0
0
0
0
0
15
0
R7
15
R6
Condition
Code
15
R5
Register
15
N Z V C
R4
15
3
1
2
0
R3
15
R2
15
R1
(Variable Pointer)
0
15
R0 = 0
Figure 9-19. Programmer’s Model
The programmer’s model of the XGATE RISC core is shown in Figure 9-19. The processor offers a set of
seven general purpose registers (R1 - R7), which serve as accumulators and index registers. An additional
eighth register (R0) is tied to the value “$0000”. Register R1 has an additional functionality. It is preloaded
with the initial variable pointer of the channel’s service request vector (see Figure 9-20). The initial content
of the remaining general purpose registers is undefined.
The 16 bit program counter allows the addressing of a 64 kbyte address space.
The condition code register contains four bits: the sign bit (S), the zero flag (Z), the overflow flag (V), and
the carry bit (C). The initial content of the condition code register is undefined.
9.4.3
Memory Map
The XGATE’s RISC core is able to access an address space of 64K bytes. The allocation of memory blocks
within this address space is determined on chip level. Refer to the S12X_MMC Section for a detailed
information.
position in the XGATE memory map can be adjusted through the XGVBR register (see Section 9.3.2.3,
“XGATE Vector Base Address Register (XGVBR)”). Figure 9-20 shows the layout of the vector block.
Each vector consists of two 16-bit words. The first contains the start address of the service routine. This
value will be loaded into the program counter before a service routine is executed. The second word is a
pointer to the service routine’s variable space. This value will be loaded into register R1 before a service
routine is executed.
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Chapter 9 XGATE (S12XGATEV2)
XGVBR
+$0000
unused
Code
+$0024
Channel $09 Initial Program Counter
Channel $09 Initial Variable Pointer
Channel $0A Initial Program Counter
Channel $0A Initial Variable Pointer
Channel $0B Initial Program Counter
Channel $0B Initial Variable Pointer
Channel $0C Initial Program Counter
Channel $0C Initial Variable Pointer
+$0028
+$002C
+$0030
Variables
Code
+$01E0
Variables
Channel $78 Initial Program Counter
Channel $78 Initial Variable Pointer
Figure 9-20. XGATE Vector Block
9.4.4
Semaphores
The XGATE module offers a set of eight hardware semaphores. These semaphores provide a mechanism
to protect system resources that are shared between two concurrent threads of program execution; one
thread running on the S12X_CPU and one running on the XGATE RISC core.
Each semaphore can only be in one of the three states: “Unlocked”, “Locked by S12X_CPU”, and “Locked
by XGATE”. The S12X_CPU can check and change a semaphore’s state through the XGATE semaphore
register (XGSEM, see Section 9.3.2.6, “XGATE Semaphore Register (XGSEM)”). The RISC core does
this through its SSEM and CSEM instructions.
If the S12X_CPU and the RISC core attempt to lock an unlocked semaphore at the same time, it will be
Figure 9-21 illustrates the valid state transitions.
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Chapter 9 XGATE (S12XGATEV2)
%1 ⇒ XGSEM
%1 ⇒ XGSEM
%0 ⇒ XGSEM
SSEM Instruction
CSEM Instruction
SSEM Instruction
LOCKED BY
XGATE
LOCKED BY
S12X_CPU
UNLOCKED
%0 ⇒ XGSEM
CSEM Instruction
Figure 9-21. Semaphore State Transitions
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Chapter 9 XGATE (S12XGATEV2)
Figure 9-22 gives an example of the typical usage of the XGATE hardware semaphores.
Two concurrent threads are running on the system. One is running on the S12X_CPU and the other is
running on the RISC core. They both have a critical section of code that accesses the same system resource.
To guarantee that the system resource is only accessed by one thread at a time, the critical code sequence
must be embedded in a semaphore lock/release sequence as shown.
S12X_CPU
XGATE
.........
.........
%1 ⇒ XGSEMx
XGSEM ≡ %1?
SSEM
BCC?
critical
code
sequence
critical
code
sequence
XGSEM ⇒ %0
CSEM
.........
.........
Figure 9-22. Algorithm for Locking and Releasing Semaphores
9.4.5
Software Error Detection
The XGATE module will immediately terminate program execution after detecting an error condition
caused by erratic application code. There are three error conditions:
•
•
•
Execution of an illegal opcode
Illegal vector or opcode fetches
Illegal load or store accesses
All opcodes which are not listed in section Section 9.8, “Instruction Set” are illegal opcodes. Illegal vector
and opcode fetches as well as illegal load and store accesses are defined on chip level. Refer to the
S12X_MMC Section for a detailed information.
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Chapter 9 XGATE (S12XGATEV2)
9.5
Interrupts
9.5.1
Incoming Interrupt Requests
XGATE threads are triggered by interrupt requests which are routed to the XGATE module (see
S12X_INT Section). Only a subset of the MCU’s interrupt requests can be routed to the XGATE. Which
specific interrupt requests these are and which channel ID they are assigned to is documented in Section
“Interrupts” of the SoC Guide.
9.5.2
Outgoing Interrupt Requests
There are three types of interrupt requests which can be triggered by the XGATE module:
4. Channel interrupts
For each XGATE channel there is an associated interrupt flag in the XGATE interrupt flag vector
(XGIF, see Section 9.3.2.4, “XGATE Channel Interrupt Flag Vector (XGIF)”). These flags can be
set through the "SIF" instruction by the RISC core. They are typically used to flag an interrupt to
the S12X_CPU when the XGATE has completed one of its tasks.
5. Software triggers
Software triggers are interrupt flags, which can be set and cleared by software (see Section 9.3.2.5,
“XGATE Software Trigger Register (XGSWT)”). They are typically used to trigger XGATE tasks
by the S12X_CPU software. However these interrupts can also be routed to the S12X_CPU (see
S12X_INT Section) and triggered by the XGATE software.
6. Software error interrupt
The software error interrupt signals to the S12X_CPU the detection of an error condition in the
XGATE application code (see Section 9.4.5, “Software Error Detection”).
All XGATE interrupts can be disabled by the XGIE bit in the XGATE module control register (XGMCTL,
see Section 9.3.2.1, “XGATE Control Register (XGMCTL)”).
9.6
Debug Mode
The XGATE debug mode is a feature to allow debugging of application code.
9.6.1
Debug Features
In debug mode the RISC core will be halted and the following debug features will be enabled:
1
•
Read and Write accesses to RISC core registers (XGCCR, XGPC, XGR1–XGR7)
All RISC core registers can be modified. Leaving debug mode will cause the RISC core to continue
program execution with the modified register values.
1. Only possible if MCU is unsecured
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Chapter 9 XGATE (S12XGATEV2)
•
•
Single Stepping
Writing a "1" to the XGSS bit will call the RISC core to execute a single instruction. All RISC core
registers will be updated accordingly.
Write accesses to the XGCHID register
Three operations can be performed by writing to the XGCHID register:
– Change of channel ID
If a non-zero value is written to the XGCHID while a thread is active (XGCHID ≠ $00), then
the current channel ID will be changed without any influence on the program counter or the
other RISC core registers.
– Start of a thread
If a non-zero value is written to the XGCHID while the XGATE is idle (XGCHID = $00),
then the thread that is associated with the new channel ID will be executed upon leaving
debug mode.
– Termination of a thread
If zero is written to the XGCHID while a thread is active (XGCHID ≠ $00), then the current
thread will be terminated and the XGATE will become idle.
9.6.2
Entering Debug Mode
Debug mode can be entered in four ways:
1. Setting XGDBG to "1"
Writing a "1" to XGDBG and XGDBGM in the same write access causes the XGATE to enter
debug mode upon completion of the current instruction.
NOTE
After writing to the XGDBG bit the XGATE will not immediately enter
debug mode. Depending on the instruction that is executed at this time there
may be a delay of several clock cycles. The XGDBG will read "0" until
debug mode is entered.
2. Software breakpoints
XGATE programs which are stored in the internal RAM allow the use of software breakpoints. A
software breakpoint is set by replacing an instruction of the program code with the "BRK"
instruction.
As soon as the program execution reaches the "BRK" instruction, the XGATE enters debug mode.
Additionally a software breakpoint request is sent to the S12X_DBG module (see section 4.9 of
the S12X_DBG Section).
Upon entering debug mode, the program counter will point to the "BRK" instruction. The other
RISC core registers will hold the result of the previous instruction.
To resume program execution, the "BRK" instruction must be replaced by the original instruction
before leaving debug mode.
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Chapter 9 XGATE (S12XGATEV2)
3. Tagged Breakpoints
The S12X_DBG module is able to place tags on fetched opcodes. The XGATE is able to enter
debug mode right before a tagged opcode is executed (see section 4.9 of the S12X_DBG Section).
Upon entering debug mode, the program counter will point to the tagged instruction. The other
RISC core registers will hold the result of the previous instruction.
4. Forced Breakpoints
Forced breakpoints are triggered by the S12X_DBG module (see section 4.9 of the S12X_DBG
Section). When a forced breakpoint occurs, the XGATE will enter debug mode upon completion
of the current instruction.
9.6.3
Leaving Debug Mode
Debug mode can only be left by setting the XGDBG bit to "0". If a thread is active (XGCHID has not been
cleared in debug mode), program execution will resume at the value of XGPC.
9.7
Security
In order to protect XGATE application code on secured S12X devices, a few restrictions in the debug
features have been made. These are:
•
•
•
Registers XGCCR, XGPC, and XGR1–XGR7 will read zero on a secured device
Registers XGCCR, XGPC, and XGR1–XGR7 can not be written on a secured device
Single stepping is not possible on a secured device
9.8
Instruction Set
9.8.1
Addressing Modes
For the ease of implementation the architecture is a strict Load/Store RISC machine, which means all
operations must have one of the eight general purpose registers R0 … R7 as their source as well their
destination.
All word accesses must work with a word aligned address, that is A[0] = 0!
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Chapter 9 XGATE (S12XGATEV2)
9.8.1.1
Naming Conventions
RD
Destination register, allowed range is R0–R7
Low byte of the destination register, bits [7:0]
High byte of the destination register, bits [15:8]
Source register, allowed range is R0–R7
Low byte of the source register, bits [7:0]
High byte of the source register, bits[15:8]
RD.L
RD.H
RS, RS1, RS2
RS.L, RS1.L, RS2.L
RS.H, RS1.H, RS2.H
RB
Base register for indexed addressing modes, allowed
range is R0–R7
RI
Offset register for indexed addressing modes with
register offset, allowed range is R0–R7
RI+
Offset register for indexed addressing modes with
register offset and post-increment,
Allowed range is R0–R7 (R0+ is equivalent to R0)
–RI
Offset register for indexed addressing modes with
register offset and pre-decrement,
Allowed range is R0–R7 (–R0 is equivalent to R0)
NOTE
Even though register R1 is intended to be used as a pointer to the variable
segment, it may be used as a general purpose data register as well.
Selecting R0 as destination register will discard the result of the instruction.
Only the condition code register will be updated
9.8.1.2
Inherent Addressing Mode (INH)
Instructions that use this addressing mode either have no operands or all operands are in internal XGATE
registers:.
Examples
BRK
RTS
9.8.1.3
Immediate 3-Bit Wide (IMM3)
Operands for immediate mode instructions are included in the instruction stream and are fetched into the
instruction queue along with the rest of the 16 Bit instruction. The ’#’ symbol is used to indicate an
immediate addressing mode operand. This address mode is used for semaphore instructions.
Examples:
CSEM
SSEM
#1
#3
; Unlock semaphore 1
; Lock Semaphore 3
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Chapter 9 XGATE (S12XGATEV2)
9.8.1.4
Immediate 4-Bit Wide (IMM4)
The 4-bit wide immediate addressing mode is supported by all shift instructions.
RD = RD ∗ imm4
Examples:
LSL
LSR
R4,#1
R4,#3
; R4 = R4 << 1; shift register R4 by 1 bit to the left
; R4 = R4 >> 3; shift register R4 by 3 bits to the right
9.8.1.5
Immediate 8-Bit Wide (IMM8)
The 8-bit wide immediate addressing mode is supported by four major commands (ADD, SUB, LD,
CMP).
RD = RD ∗ imm8
Examples:
ADDL
SUBL
LDH
R1,#1
R2,#2
R3,#3
R4,#4
; adds an 8 Bit value to register R1
; subtracts an 8 Bit value from register R2
; loads an 8 bit immediate into the high byte of Register R3
; compares the low byte of register R4 with an immediate value
CMPL
9.8.1.6
Immediate 16-Bit Wide (IMM16)
The 16-bit wide immediate addressing mode is a construct to simplify assembler code. Instructions which
offer this mode are translated into two opcodes using the eight bit wide immediate addressing mode.
RD = RD ∗ imm16
Examples:
LDW
ADD
R4,#$1234
R4,#$5678
; translated to LDL R4,#$34; LDH R4,#$12
; translated to ADDL R4,#$78; ADDH R4,#$56
9.8.1.7
Monadic Addressing (MON)
In this addressing mode only one operand is explicitly given. This operand can either be the source (f(RD)),
the target (RD = f()), or both source and target of the operation (RD = f(RD)).
Examples:
JAL
SIF
R1
R2
; PC = R1, R1 = PC+2
; Trigger IRQ associated with the channel number in R2.L
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Chapter 9 XGATE (S12XGATEV2)
9.8.1.8
Dyadic Addressing (DYA)
In this mode the result of an operation between two registers is stored in one of the registers used as
operands.
RD = RD ∗ RS is the general register to register format, with register RD being the first operand and RS
the second. RD and RS can be any of the 8 general purpose registers R0 … R7. If R0 is used as the
destination register, only the condition code flags are updated. This addressing mode is used only for shift
operations with a variable shift value
Examples:
LSL
LSR
R4,R5
R4,R5
; R4 = R4 << R5
; R4 = R4 >> R5
9.8.1.9
Triadic Addressing (TRI)
In this mode the result of an operation between two or three registers is stored into a third one.
RD = RS1 ∗ RS2 is the general format used in the order RD, RS1, RS1. RD, RS1, RS2 can be any of the
8 general purpose registers R0 … R7. If R0 is used as the destination register RD, only the condition code
flags are updated. This addressing mode is used for all arithmetic and logical operations.
Examples:
ADC
SUB
R5,R6,R7
R5,R6,R7
; R5 = R6 + R7 + Carry
; R5 = R6 - R7
9.8.1.10 Relative Addressing 9-Bit Wide (REL9)
A 9-bit signed word address offset is included in the instruction word. This addressing mode is used for
conditional branch instructions.
Examples:
BCC
BEQ
REL9
REL9
; PC = PC + 2 + (REL9 << 1)
; PC = PC + 2 + (REL9 << 1)
9.8.1.11 Relative Addressing 10-Bit Wide (REL10)
An 11-bit signed word address offset is included in the instruction word. This addressing mode is used for
the unconditional branch instruction.
Examples:
BRA
REL10
; PC = PC + 2 + (REL10 << 1)
9.8.1.12 Index Register plus Immediate Offset (IDO5)
(RS, #offset5) provides an unsigned offset from the base register.
Examples:
LDB
STW
R4,(R1,#offset) ; loads a byte from R1+offset into R4
R4,(R1,#offset) ; stores R4 as a word to R1+offset
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Chapter 9 XGATE (S12XGATEV2)
9.8.1.13 Index Register plus Register Offset (IDR)
For load and store instructions (RS, RI) provides a variable offset in a register.
Examples:
LDB
STW
R4,(R1,R2)
R4,(R1,R2)
; loads a byte from R1+R2 into R4
; stores R4 as a word to R1+R2
9.8.1.14 Index Register plus Register Offset with Post-increment (IDR+)
[RS, RI+] provides a variable offset in a register, which is incremented after accessing the memory. In case
of a byte access the index register will be incremented by one. In case of a word access it will be
incremented by two.
Examples:
LDB
STW
R4,(R1,R2+)
R4,(R1,R2+)
; loads a byte from R1+R2 into R4, R2+=1
; stores R4 as a word to R1+R2, R2+=2
9.8.1.15 Index Register plus Register Offset with Pre-decrement (–IDR)
[RS, -RI] provides a variable offset in a register, which is decremented before accessing the memory. In
case of a byte access the index register will be decremented by one. In case of a word access it will be
decremented by two.
Examples:
LDB
STW
R4,(R1,-R2)
R4,(R1,-R2)
; R2 -=1, loads a byte from R1+R2 into R4
; R2 -=2, stores R4 as a word to R1+R2
9.8.2
Instruction Summary and Usage
Load & Store Instructions
9.8.2.1
Any register can be loaded either with an immediate or from the address space using indexed addressing
modes.
LDL
LDW
RD,#IMM8
RD,(RB,RI)
; loads an immediate 8 bit value to the lower byte of RD
; loads data using RB+RI as effective address
LDB
RD,(RB, RI+)
; loads data using RB+RI as effective address
; followed by an increment of RI depending on
; the size of the operation
The same set of modes is available for the store instructions
STB
RS,(RB, RI)
; stores data using RB+RI as effective address
STW
RS,(RB, RI+)
; stores data using RB+RI as effective address
; followed by an increment of RI depending on
; the size of the operation.
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Chapter 9 XGATE (S12XGATEV2)
9.8.2.2
Logic and Arithmetic Instructions
All logic and arithmetic instructions support the 8-bit immediate addressing mode (IMM8: RD = RD ∗
#IMM8) and the triadic addressing mode (TRI: RD = RS1 ∗ RS2).
All arithmetic is considered as signed, sign, overflow, zero and carry flag will be updated. The carry will
not be affected for logical operations.
ADDL
ANDH
R2,#1
R4,#$FE
; increment R2
; R4.H = R4.H & $FE, clear lower bit of higher byte
ADD
SUB
R3,R4,R5
R3,R4,R5
; R3 = R4 + R5
; R3 = R4 - R5
AND
OR
R3,R4,R5
R3,R4,R5
; R3 = R4 & R5 logical AND on the whole word
; R3 = R4 | R5
9.8.2.3
Register – Register Transfers
This group comprises transfers from and to some special registers
TFR
R3,CCR
; transfers the condition code register to the low byte of
; register R3
Branch Instructions
The branch offset is +255 words or -256 words counted from the beginning of the next instruction. Since
instructions have a fixed 16 bit width, the branch offsets are word aligned by shifting the offset value by 2.
BEQ
label
; if Z flag = 1 branch to label
An unconditional branch allows a +511 words or -512 words branch distance.
BRA
label
9.8.2.4
Shift Instructions
Shift operations allow the use of a 4 bit wide immediate value to identify a shift width within a 16 bit word.
For shift operations a value of 0 does not shift at all, while a value of 15 shifts the register RD by 15 bits.
In a second form the shift value is contained in the bits 3:0 of the register RS.
Examples:
LSL
LSR
ASR
R4,#1
R4,#3
R4,R2
; R4 = R4 << 1; shift register R4 by 1 bit to the left
; R4 = R4 >> 3; shift register R4 by 3 bits to the right
; R4 = R4 >> R2;arithmetic shift register R4 right by the amount
;
of bits contained in R2[3:0].
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Chapter 9 XGATE (S12XGATEV2)
9.8.2.5
Bit Field Operations
This addressing mode is used to identify the position and size of a bit field for insertion or extraction. The
width and offset are coded in the lower byte of the source register 2, RS2. The content of the upper byte is
ignored. An offset of 0 denotes the right most position and a width of 0 denotes 1 bit. These instructions
are very useful to extract, insert, clear, set or toggle portions of a 16 bit word.
W4
O4
RS2
RS1
15
15
5
2
0
W4=3, O4=2
Bit Field Extract
Bit Field Insert
3
0
RD
Figure 9-23. Bit Field Addressing
BFEXT
R3,R4,R5 ; R5: W4 bits offset O4, will be extracted from R4 into R3
9.8.2.6
Special Instructions for DMA Usage
The XGATE offers a number of additional instructions for flag manipulation, program flow control and
debugging:
1. SIF: Set a channel interrupt flag
2. SSEM: Test and set a hardware semaphore
3. CSEM: Clear a hardware semaphore
4. BRK: Software breakpoint
5. NOP: No Operation
6. RTS: Terminate the current thread
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Chapter 9 XGATE (S12XGATEV2)
Cycle Notation
Table 9-17 show the XGATE access detail notation. Each code letter equals one XGATE cycle. Each letter
implies additional wait cycles if memories or peripherals are not accessible. Memories or peripherals are
not accessible if they are blocked by the S12X_CPU. In addition to this Peripherals are only accessible
every other XGATE cycle. Uppercase letters denote 16-bit operations. Lowercase letters denote 8-bit
operations. The XGATE is able to perform two bus or wait cycles per S12X_CPU cycle.
Table 9-17. Access Detail Notation
V— Vector fetch: always an aligned word read, lasts for at least one RISC core cycle
P— Program word fetch: always an aligned word read, lasts for at least one RISC core cycle
r— 8-bit data read: lasts for at least one RISC core cycle
R— 16-bit data read: lasts for at least one RISC core cycle
w— 8-bit data write: lasts for at least one RISC core cycle
W— 16-bit data write: lasts for at least one RISC core cycle
A— Alignment cycle: no read or write, lasts for zero or one RISC core cycles
f— Free cycle: no read or write, lasts for one RISC core cycles
Special Cases
PP/P— Branch: PPif branch taken, Pif not
9.8.4
Thread Execution
When the RISC core is triggered by an interrupt request (see Figure 9-1) it first executes a vector fetch
sequence which performs three bus accesses:
1. A V-cycle to fetch the initial content of the program counter.
2. A V-cycle to fetch the initial content of the data segment pointer (R1).
3. A P-cycle to load the initial opcode.
Afterwards a sequence of instructions (thread) is executed which is terminated by an "RTS" instruction. If
further interrupt requests are pending after a thread has been terminated, a new vector fetch will be
performed. Otherwise the RISC core will idle until a new interrupt request is received. A thread can not be
interrupted by an interrupt request.
9.8.5
Instruction Glossary
This section describes the XGATE instruction set in alphabetical order.
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Chapter 9 XGATE (S12XGATEV2)
Add with Carry
ADC
ADC
Operation
RS1 + RS2 + C ⇒ RD
Adds the content of register RS1, the content of register RS2 and the value of the Carry bit using binary
addition and stores the result in the destination register RD. The Zero Flag is also carried forward from the
previous operation allowing 32 and more bit additions.
Example:
ADC
ADC
BCC
R6,R2,R2
R7,R3,R3 ; R7:R6 = R5:R4 + R3:R2
; conditional branch on 32 bit addition
CCR Effects
N
Z
V
C
∆
∆
∆
∆
N: Set if bit 15 of the result is set; cleared otherwise.
Z: Set if the result is $0000 and Z was set before this operation; cleared otherwise.
V: Set if a two´s complement overflow resulted from the operation; cleared otherwise.
RS1[15] & RS2[15] & RD[15]
| RS1[15] & RS2[15] & RD[15]
new
new
C: Set if there is a carry from bit 15 of the result; cleared otherwise.
RS1[15] & RS2[15] | RS1[15] & RD[15]
| RS2[15] & RD[15]
new
new
Code and CPU Cycles
Address
Mode
Source Form
ADC RD, RS1, RS2
Machine Code
RD RS1
Cycles
TRI
0
0
0
1
1
RS2
1
1
P
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Chapter 9 XGATE (S12XGATEV2)
Add without Carry
ADD
ADD
Operation
RS1 + RS2 ⇒ RDRD + IMM16 ⇒ RD (translates to ADDL RD, #IMM16[7:0]; ADDH RD, #[15:8])
Performs a 16-bit addition and stores the result in the destination register RD.
CCR Effects
N
Z
V
C
∆
∆
∆
∆
N: Set if bit 15 of the result is set; cleared otherwise.
Z: Set if the result is $0000; cleared otherwise.
V: Set if a two´s complement overflow resulted from the operation; cleared otherwise.
RS1[15] & RS2[15] & RD[15]
| RS1[15] & RS2[15] & RD[15]
new
new
RD[15] & IMM16[15] & RD[15]
| RD[15] & IMM16[15] & RD[15]
old new
old
new
C: Set if there is a carry from bit 15 of the result; cleared otherwise.
RS1[15] & RS2[15] | RS1[15] & RD[15]
| RS2[15] & RD[15]
new
new
RD[15] & IMM16[15] | RD[15] & RD[15]
| IMM16[15] & RD[15]
new
old
old
new
Code and CPU Cycles
Address
Mode
Source Form
Machine Code
Cycles
ADD RD, RS1, RS2
ADD RD, #IMM16
TRI
0
1
1
0
1
1
0
1
1
1
0
0
1
0
1
RD
RD
RD
RS1
RS2
1
0
P
P
P
IMM8
IMM8
IMM16[7:0]
IMM16[15:8]
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Chapter 9 XGATE (S12XGATEV2)
Add Immediate 8-Bit Constant
(High Byte)
ADDH
ADDH
Operation
RD + IMM8:$00 ⇒ RD
Adds the content of high byte of register RD and a signed immediate 8-Bit constant using binary addition
and stores the result in the high byte of the destination register RD. This instruction can be used after an
ADDL for a 16-bit immediate addition.
Example:
ADDL
ADDH
R2,#LOWBYTE
R2,#HIGHBYTE
; R2 = R2 + 16 Bit immediate
CCR Effects
N
Z
V
C
∆
∆
∆
∆
N: Set if bit 15 of the result is set; cleared otherwise.
Z: Set if the result is $0000; cleared otherwise.
V: Set if a two´s complement overflow resulted from the operation; cleared otherwise.
RD[15] & IMM8[7] & RD[15]
| RD[15] & IMM8[7] & RD[15]
old
new
old new
C: Set if there is a carry from the bit 15 of the result; cleared otherwise.
RD[15] & IMM8[7] | RD[15] & RD[15]
| IMM8[7] & RD[15]
old
old
new
new
Code and CPU Cycles
Address
Mode
Source Form
Machine Code
Cycles
ADDH RD, #IMM8
IMM8
1
1
1
0
1
RD
IMM8
P
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Chapter 9 XGATE (S12XGATEV2)
Add Immediate 8-Bit Constant
(Low Byte)
ADDL
ADDL
Operation
RD + $00:IMM8 ⇒ RD
Adds the content of register RD and an unsigned immediate 8-Bit constant using binary addition and stores
the result in the destination register RD. This instruction must be used first for a 16-bit immediate addition
in conjunction with the ADDH instruction.
CCR Effects
N
Z
V
C
∆
∆
∆
∆
N: Set if bit 15 of the result is set; cleared otherwise.
Z: Set if the result is $0000; cleared otherwise.
V: Set if a two´s complement overflow resulted from the 8-bit operation; cleared otherwise.
RD[15] & RD[15]
old
new
C: Set if there is a carry from bit 7 to bit 8 of the result; cleared otherwise.
RD[15] & RD[15]
old
new
Code and CPU Cycles
Address
Mode
Source Form
Machine Code
Cycles
ADDL RD, #IMM8
IMM8
1
1
1
0
0
RD
IMM8
P
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Chapter 9 XGATE (S12XGATEV2)
Logical AND
AND
AND
Operation
RS1 & RS2 ⇒ RDRD & IMM16 ⇒ RD (translates to ANDL RD, #IMM[7:0]; ANDH RD,
#IMM16[15:8])
Performs a bit wise logical AND of two 16-bit values and stores the result in the destination register RD.
Remark: There is no complement to the BITH and BITL functions. This can be imitated by using R0 as a
destination register. AND R0, RS1, RS2 performs a bit wise test without storing a result.
CCR Effects
N
Z
V
C
∆
∆
0
—
N: Set if bit 15 of the result is set; cleared otherwise.
Z: Set if the result is $0000; cleared otherwise.
V: 0; cleared.
C: Not affected.
Code and CPU Cycles
Address
Source Form
Mode
Machine Code
Cycles
AND RD, RS1, RS2
AND RD, #IMM16
TRI
0
1
1
0
0
0
0
0
0
1
0
0
0
0
1
RD
RD
RD
RS1
RS2
0
0
P
P
P
IMM8
IMM8
IMM16[7:0]
IMM16[15:8]
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Chapter 9 XGATE (S12XGATEV2)
Logical AND Immediate 8-Bit Constant
(High Byte)
ANDH
ANDH
Operation
RD.H & IMM8 ⇒ RD.H
Performs a bit wise logical AND between the high byte of register RD and an immediate 8-Bit constant
and stores the result in the destination register RD.H. The low byte of RD is not affected.
CCR Effects
N
Z
V
C
∆
∆
0
—
N: Set if bit 15 of the result is set; cleared otherwise.
Z: Set if the 8-bit result is $00; cleared otherwise.
V: 0; cleared.
C: Not affected.
Code and CPU Cycles
Address
Source Form
Mode
Machine Code
Cycles
ANDH RD, #IMM8
IMM8
1
0
0
0
1
RD
IMM8
P
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Chapter 9 XGATE (S12XGATEV2)
Logical AND Immediate 8-Bit Constant
(Low Byte)
ANDL
ANDL
Operation
RD.L & IMM8 ⇒ RD.L
Performs a bit wise logical AND between the low byte of register RD and an immediate 8-Bit constant and
stores the result in the destination register RD.L. The high byte of RD is not affected.
CCR Effects
N
Z
V
C
∆
∆
0
—
N: Set if bit 7 of the result is set; cleared otherwise.
Z: Set if the 8-Bit result is $00; cleared otherwise.
V: 0; cleared.
C: Not affected.
Code and CPU Cycles
Address
Source Form
Mode
Machine Code
Cycles
ANDL RD, #IMM8
IMM8
1
0
0
0
0
RD
IMM8
P
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Chapter 9 XGATE (S12XGATEV2)
Arithmetic Shift Right
ASR
ASR
Operation
n
b15
RD
C
n = RS or IMM4
Shifts the bits in register RD n positions to the right. The higher n bits of the register RD become filled
with the sign bit (RD[15]). The carry flag will be updated to the bit contained in RD[n-1] before the shift
for n > 0.
n can range from 0 to 16.
In immediate address mode, n is determined by the operand IMM4. n is considered to be 16 in IMM4 is
equal to 0.
In dyadic address mode, n is determined by the content of RS. n is considered to be 16 if the content of RS
is greater than 15.
CCR Effects
N
Z
V
C
∆
∆
0
∆
N: Set if bit 15 of the result is set; cleared otherwise.
Z: Set if the result is $0000; cleared otherwise.
V: Set if a two´s complement overflow resulted from the operation; cleared otherwise.
RD[15] ^ RD[15]
old
new
C: Set if n > 0 and RD[n-1] = 1; if n = 0 unaffected.
Code and CPU Cycles
Address
Source Form
Mode
Machine Code
Cycles
ASR RD, #IMM4
ASR RD, RS
IMM4
DYA
0
0
0
0
0
0
0
0
1
1
RD
RD
IMM4
RS
1
0
0
0
0
0
1
1
P
P
1
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Chapter 9 XGATE (S12XGATEV2)
Branch if Carry Cleared
(Same as BHS)
BCC
BCC
Operation
If C = 0, then PC + $0002 + (REL9 << 1) ⇒ PC
Tests the Carry flag and branches if C = 0.
CCR Effects
N
Z
V
C
—
—
—
—
N: Not affected.
Z: Not affected.
V: Not affected.
C: Not affected.
Code and CPU Cycles
Address
Mode
Source Form
Machine Code
Cycles
BCC REL9
REL9
0
0
1
0
0
0
0
REL9
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Chapter 9 XGATE (S12XGATEV2)
Branch if Carry Set
(Same as BLO)
BCS
BCS
Operation
If C = 1, then PC + $0002 + (REL9 << 1) ⇒ PC
Tests the Carry flag and branches if C = 1.
CCR Effects
N
Z
V
C
—
—
—
—
N: Not affected.
Z: Not affected.
V: Not affected.
C: Not affected.
Code and CPU Cycles
Address
Mode
Source Form
Machine Code
Cycles
BCS REL9
REL9
0
0
1
0
0
0
1
REL9
PP/P
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Chapter 9 XGATE (S12XGATEV2)
Branch if Equal
BEQ
BEQ
Operation
If Z = 1, then PC + $0002 + (REL9 << 1) ⇒ PC
Tests the Zero flag and branches if Z = 1.
CCR Effects
N
Z
V
C
—
—
—
—
N: Not affected.
Z: Not affected.
V: Not affected.
C: Not affected.
Code and CPU Cycles
Address
Mode
Source Form
Machine Code
Cycles
BEQ REL9
REL9
0
0
1
0
0
1
1
REL9
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Chapter 9 XGATE (S12XGATEV2)
Bit Field Extract
BFEXT
BFEXT
Operation
RS1[(o+w):o] ⇒ RD[w:0]; 0 ⇒ RD[15:(w+1)]
w = (RS2[7:4])
o = (RS2[3:0])
Extracts w+1 bits from register RS1 starting at position o and writes them right aligned into register RD.
The remaining bits in RD will be cleared. If (o+w) > 15 only bits [15:o] get extracted.
15
15
7
4
3
0
0
W4
O4
RS2
RS1
5
2
W4=3, O4=2
Bit Field Extract
15
3
0
0
RD
CCR Effects
N
0
Z
V
0
C
∆
∆
N: Set if bit 15 of the result is set; cleared otherwise.
Z: Set if the result is $0000; cleared otherwise.
V: 0; cleared.
C: Not affected.
Code and CPU Cycles
Address
Source Form
Mode
Machine Code
RD RS1
Cycles
BFEXT RD, RS1, RS2
TRI
0
1
1
0
0
RS2
1
1
P
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Chapter 9 XGATE (S12XGATEV2)
Bit Field Find First One
BFFO
BFFO
Operation
FirstOne (RS) ⇒ RD;
Searches the first “1” beginning from the MSB=15 down to LSB=0 in register RS and places the result into
the destination register RD. The upper bits of RD are cleared. In case the content of RS is equal to $0000,
RD will be cleared and the carry flag will be set. This is used to distinguish a “1” in position 0 versus no
“1” in the whole RS register at all.
CCR Effects
N
Z
V
C
0
∆
0
∆
N: 0; cleared.
Z: Set if the result is $0000; cleared otherwise.
V: 0; cleared.
1
C: Set if RS = $0000 ; cleared otherwise.
1
Before executing the instruction
Code and CPU Cycles
Address
Source Form
Mode
Machine Code
RD RS
Cycles
BFFO RD, RS
DYA
0
0
0
0
1
1
0
0
0
0
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Chapter 9 XGATE (S12XGATEV2)
Bit Field Insert
BFINS
BFINS
Operation
RS1[w:0] ⇒ RD[(w+o):o];
w = (RS2[7:4])
o = (RS2[3:0])
Extracts w+1 bits from register RS1 starting at position 0 and writes them into register RD at position o.
The remaining bits in RD are not affected. If (o+w) > 15 the upper bits are ignored. Using R0 as a RS1,
this command can be used to clear bits.
15
7
4
3
0
W4
O4
RS2
RS1
15
3
0
Bit Field Insert
15
5
2
0
W4=3, O4=2
RD
CCR Effects
N
Z
V
C
∆
∆
0
—
N: Set if bit 15 of the result is set; cleared otherwise.
Z: Set if the result is $0000; cleared otherwise.
V: 0; cleared.
C: Not affected.
Code and CPU Cycles
Address
Source Form
Mode
Machine Code
RD RS1
Cycles
BFINS RD, RS1, RS2
TRI
0
1
1
0
1
RS2
1
1
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Chapter 9 XGATE (S12XGATEV2)
Bit Field Insert and Invert
BFINSI
BFINSI
Operation
!RS1[w:0] ⇒ RD[w+o:o];
w = (RS2[7:4])
o = (RS2[3:0])
Extracts w+1 bits from register RS1 starting at position 0, inverts them and writes into register RD at
position o. The remaining bits in RD are not affected. If (o+w) > 15 the upper bits are ignored. Using R0
as a RS1, this command can be used to set bits.
15
7
4
3
0
W4
O4
RS2
RS1
15
3
0
Inverted Bit Field Insert
15
5
2
0
W4=3, O4=2
RD
CCR Effects
N
Z
V
C
∆
∆
0
—
N: Set if bit 15 of the result is set; cleared otherwise.
Z: Set if the result is $0000; cleared otherwise.
V: 0; cleared.
C: Not affected.
Code and CPU Cycles
Address
Source Form
Mode
Machine Code
RD RS1
Cycles
BFINSI RD, RS1, RS2
TRI
0
1
1
1
0
RS2
1
1
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Chapter 9 XGATE (S12XGATEV2)
Bit Field Insert and XNOR
BFINSX
BFINSX
Operation
!(RS1[w:0] ^ RD[w+o:o]) ⇒ RD[w+o:o];
w = (RS2[7:4])
o = (RS2[3:0])
Extracts w+1 bits from register RS1 starting at position 0, performs an XNOR with RD[w+o:o] and writes
the bits back. The remaining bits in RD are not affected. If (o+w) > 15 the upper bits are ignored. Using
R0 as a RS1, this command can be used to toggle bits.
15
7
4
3
0
W4
O4
RS2
RS1
15
3
0
Bit Field Insert XNOR
15
5
2
0
W4=3, O4=2
RD
CCR Effects
N
Z
V
C
∆
∆
0
—
N: Set if bit 15 of the result is set; cleared otherwise.
Z: Set if the result is $0000; cleared otherwise.
V: 0; cleared.
C: Not affected.
Code and CPU Cycles
Address
Source Form
Mode
Machine Code
RD RS1
Cycles
BFINSX RD, RS1, RS2
TRI
0
1
1
1
1
RS2
1
1
P
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Chapter 9 XGATE (S12XGATEV2)
Branch if Greater than or Equal to Zero
BGE
BGE
Operation
If N ^ V = 0, then PC + $0002 + (REL9 << 1) ⇒ PC
Branch instruction to compare signed numbers.
Branch if RS1 ≥ RS2:
SUB
R0,RS1,RS2
BGE
REL9
CCR Effects
N
Z
V
C
—
—
—
—
N: Not affected.
Z: Not affected.
V: Not affected.
C: Not affected.
Code and CPU Cycles
Address
Mode
Source Form
Machine Code
Cycles
BGE REL9
REL9
0
0
1
1
0
1
0
REL9
PP/P
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Chapter 9 XGATE (S12XGATEV2)
Branch if Greater than Zero
BGT
BGT
Operation
If Z | (N ^ V) = 0, then PC + $0002 + (REL9 << 1) ⇒ PC
Branch instruction to compare signed numbers.
Branch if RS1 > RS2:
SUB
R0,RS1,RS2
BGE
REL9
CCR Effects
N
Z
V
C
—
—
—
—
N: Not affected.
Z: Not affected.
V: Not affected.
C: Not affected.
Code and CPU Cycles
Address
Mode
Source Form
Machine Code
Cycles
BGT REL9
REL9
0
0
1
1
1
0
0
REL9
PP/P
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Chapter 9 XGATE (S12XGATEV2)
Branch if Higher
BHI
BHI
Operation
If C | Z = 0, then PC + $0002 + (REL9 << 1) ⇒ PC
Branch instruction to compare unsigned numbers.
Branch if RS1 > RS2:
SUB
R0,RS1,RS2
BHI
REL9
CCR Effects
N
Z
V
C
—
—
—
—
N: Not affected.
Z: Not affected.
V: Not affected.
C: Not affected.
Code and CPU Cycles
Address
Mode
Source Form
Machine Code
Cycles
BHI REL9
REL9
0
0
1
1
0
0
0
REL9
PP/P
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Chapter 9 XGATE (S12XGATEV2)
Branch if Higher or Same
(Same as BCC)
BHS
BHS
Operation
If C = 0, then PC + $0002 + (REL9 << 1) ⇒ PC
Branch instruction to compare unsigned numbers.
Branch if RS1 ≥ RS2:
SUB
R0,RS1,RS2
BHS
REL9
CCR Effects
N
Z
V
C
—
—
—
—
N: Not affected.
Z: Not affected.
V: Not affected.
C: Not affected.
Code and CPU Cycles
Address
Mode
Source Form
Machine Code
Cycles
BHS REL9
REL9
0
0
1
0
0
0
0
REL9
PP/P
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Chapter 9 XGATE (S12XGATEV2)
Bit Test Immediate 8-Bit Constant
(High Byte)
BITH
BITH
Operation
RD.H & IMM8 ⇒ NONE
Performs a bit wise logical AND between the high byte of register RD and an immediate 8-Bit constant.
Only the condition code flags get updated, but no result is written back
CCR Effects
N
Z
V
C
∆
∆
0
—
N: Set if bit 15 of the result is set; cleared otherwise.
Z: Set if the 8-bit result is $00; cleared otherwise.
V: 0; cleared.
C: Not affected.
Code and CPU Cycles
Address
Source Form
Mode
Machine Code
Cycles
BITH RD, #IMM8
IMM8
1
0
0
1
1
RD
IMM8
P
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Chapter 9 XGATE (S12XGATEV2)
Bit Test Immediate 8-Bit Constant
(Low Byte)
BITL
BITL
Operation
RD.L & IMM8 ⇒ NONE
Performs a bit wise logical AND between the low byte of register RD and an immediate 8-Bit constant.
Only the condition code flags get updated, but no result is written back.
CCR Effects
N
Z
V
C
∆
∆
0
—
N: Set if bit 7 of the result is set; cleared otherwise.
Z: Set if the 8-bit result is $00; cleared otherwise.
V: 0; cleared.
C: Not affected.
Code and CPU Cycles
Address
Source Form
Mode
Machine Code
Cycles
BITL RD, #IMM8
IMM8
1
0
0
1
0
RD
IMM8
P
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Chapter 9 XGATE (S12XGATEV2)
Branch if Less or Equal to Zero
BLE
BLE
Operation
If Z | (N ^ V) = 1, then PC + $0002 + (REL9 << 1) ⇒ PC
Branch instruction to compare signed numbers.
Branch if RS1 ≤ RS2:
SUB
R0,RS1,RS2
BLE
REL9
CCR Effects
N
Z
V
C
—
—
—
—
N: Not affected.
Z: Not affected.
V: Not affected.
C: Not affected.
Code and CPU Cycles
Address
Mode
Source Form
Machine Code
Cycles
BLE REL9
REL9
0
0
1
1
1
0
1
REL9
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Chapter 9 XGATE (S12XGATEV2)
Branch if Carry Set
(Same as BCS)
BLO
BLO
Operation
If C = 1, then PC + $0002 + (REL9 << 1) ⇒ PC
Branch instruction to compare unsigned numbers.
Branch if RS1 < RS2:
SUB
R0,RS1,RS2
BLO
REL9
CCR Effects
N
Z
V
C
—
—
—
—
N: Not affected.
Z: Not affected.
V: Not affected.
C: Not affected.
Code and CPU Cycles
Address
Mode
Source Form
Machine Code
Cycles
BLO REL9
REL9
0
0
1
0
0
0
1
REL9
PP/P
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Chapter 9 XGATE (S12XGATEV2)
Branch if Lower or Same
BLS
BLS
Operation
If C | Z = 1, then PC + $0002 + (REL9 << 1) ⇒ PC
Branch instruction to compare unsigned numbers.
Branch if RS1 ≤ RS2:
SUB
R0,RS1,RS2
BLS
REL9
CCR Effects
N
Z
V
C
—
—
—
—
N: Not affected.
Z: Not affected.
V: Not affected.
C: Not affected.
Code and CPU Cycles
Address
Mode
Source Form
Machine Code
Cycles
BLS REL9
REL9
0
0
1
1
0
0
1
REL9
PP/P
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Chapter 9 XGATE (S12XGATEV2)
Branch if Lower than Zero
BLT
BLT
Operation
If N ^ V = 1, then PC + $0002 + (REL9 << 1) ⇒ PC
Branch instruction to compare signed numbers.
Branch if RS1 < RS2:
SUB
R0,RS1,RS2
BLT
REL9
CCR Effects
N
Z
V
C
—
—
—
—
N: Not affected.
Z: Not affected.
V: Not affected.
C: Not affected.
Code and CPU Cycles
Address
Mode
Source Form
Machine Code
Cycles
BLT REL9
REL9
0
0
1
1
0
1
1
REL9
PP/P
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Chapter 9 XGATE (S12XGATEV2)
Branch if Minus
BMI
BMI
Operation
If N = 1, then PC + $0002 + (REL9 << 1) ⇒ PC
Tests the Sign flag and branches if N = 1.
CCR Effects
N
Z
V
C
—
—
—
—
N: Not affected.
Z: Not affected.
V: Not affected.
C: Not affected.
Code and CPU Cycles
Address
Mode
Source Form
Machine Code
Cycles
BMI REL9
REL9
0
0
1
0
1
0
1
REL9
PP/P
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Chapter 9 XGATE (S12XGATEV2)
Branch if Not Equal
BNE
BNE
Operation
If Z = 0, then PC + $0002 + (REL9 << 1) ⇒ PC
Tests the Zero flag and branches if Z = 0.
CCR Effects
N
Z
V
C
—
—
—
—
N: Not affected.
Z: Not affected.
V: Not affected.
C: Not affected.
Code and CPU Cycles
Address
Mode
Source Form
Machine Code
Cycles
BNE REL9
REL9
0
0
1
0
0
1
0
REL9
PP/P
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Chapter 9 XGATE (S12XGATEV2)
Branch if Plus
BPL
BPL
Operation
If N = 0, then PC + $0002 + (REL9 << 1) ⇒ PC
Tests the Sign flag and branches if N = 0.
CCR Effects
N
Z
V
C
—
—
—
—
N: Not affected.
Z: Not affected.
V: Not affected.
C: Not affected.
Code and CPU Cycles
Address
Mode
Source Form
Machine Code
Cycles
BPL REL9
REL9
0
0
1
0
1
0
0
REL9
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Chapter 9 XGATE (S12XGATEV2)
Branch Always
BRA
BRA
Operation
PC + $0002 + (REL10 << 1) ⇒ PC
Branches always
CCR Effects
N
Z
V
C
—
—
—
—
N: Not affected.
Z: Not affected.
V: Not affected.
C: Not affected.
Code and CPU Cycles
Address
Mode
Source Form
Machine Code
Cycles
BRA REL10
REL10
0
0
1
1
1
1
REL10
PP
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Chapter 9 XGATE (S12XGATEV2)
Break
BRK
BRK
Operation
Put XGATE into Debug Mode (see Section 9.6.2, “Entering Debug Mode”)and signals a Software
breakpoint to the S12X_DBG module (see section 4.9 of the S12X_DBG Section).
CCR Effects
N
Z
V
C
—
—
—
—
N: Not affected.
Z: Not affected.
V: Not affected.
C: Not affected.
Code and CPU Cycles
Address
Mode
Source Form
Machine Code
Cycles
BRK
INH
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
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Chapter 9 XGATE (S12XGATEV2)
Branch if Overflow Cleared
BVC
BVC
Operation
If V = 0, then PC + $0002 + (REL9 << 1) ⇒ PC
Tests the Overflow flag and branches if V = 0.
CCR Effects
N
Z
V
C
—
—
—
—
N: Not affected.
Z: Not affected.
V: Not affected.
C: Not affected.
Code and CPU Cycles
Address
Mode
Source Form
Machine Code
Cycles
BVC REL9
REL9
0
0
1
0
1
1
0
REL9
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Chapter 9 XGATE (S12XGATEV2)
Branch if Overflow Set
BVS
BVS
Operation
If V = 1, then PC + $0002 + (REL9 << 1) ⇒ PC
Tests the Overflow flag and branches if V = 1.
CCR Effects
N
Z
V
C
—
—
—
—
N: Not affected.
Z: Not affected.
V: Not affected.
C: Not affected.
Code and CPU Cycles
Address
Mode
Source Form
Machine Code
Cycles
BVS REL9
REL9
0
0
1
0
1
1
1
REL9
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Chapter 9 XGATE (S12XGATEV2)
Compare
CMP
CMP
Operation
RS2 – RS1 ⇒ NONE (translates to SUB R0, RS1, RS2)
RD – IMM16 ⇒ NONE (translates to CMPL RD, #IMM16[7:0]; CPCH RD, #IMM16[15:8])
Subtracts two 16-bit values and discards the result.
CCR Effects
N
Z
V
C
∆
∆
∆
∆
N: Set if bit 15 of the result is set; cleared otherwise.
Z: Set if the result is $0000; cleared otherwise.
V: Set if a two´s complement overflow resulted from the operation; cleared otherwise.
RS1[15] & RS2[15] & result[15] | RS1[15] & RS2[15] & result[15]
RD[15] & IMM16[15] & result[15] | RD[15] & IMM16[15] & result[15]
C: Set if there is a carry from the bit 15 of the result; cleared otherwise.
RS1[15] & RS2[15] | RS1[15] & result[15] | RS2[15] & result[15]
RD[15] & IMM16[15] | RD[15] & result[15] | IMM16[15] & result[15]
Code and CPU Cycles
Address
Mode
Source Form
Machine Code
Cycles
CMP RS1, RS2
CMP RS, #IMM16
TRI
0
1
1
0
1
1
0
0
0
1
1
1
1
0
1
0
0
0
RS1
RS2
0
0
P
P
P
IMM8
IMM8
RS
RS
IMM16[7:0]
IMM16[15:8]
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Chapter 9 XGATE (S12XGATEV2)
Compare Immediate 8-Bit Constant
(Low Byte)
CMPL
CMPL
Operation
RS.L – IMM8 ⇒ NONE, only condition code flags get updated
Subtracts the 8-Bit constant IMM8 contained in the instruction code from the low byte of the source
register RS.L using binary subtraction and updates the condition code register accordingly.
Remark: There is no equivalent operation using triadic addressing. Comparing the values of two registers
can be performed by using the subtract instruction with R0 as destination register.
CCR Effects
N
Z
V
C
∆
∆
∆
∆
N: Set if bit 7 of the result is set; cleared otherwise.
Z: Set if the 8-bit result is $00; cleared otherwise.
V: Set if a two´s complement overflow resulted from the 8-bit operation; cleared otherwise.
RS[7] & IMM8[7] & result[7] | RS[7] & IMM8[7] & result[7]
C: Set if there is a carry from the Bit 7 to Bit 8 of the result; cleared otherwise.
RS[7] & IMM8[7] | RS[7] & result[7] | IMM8[7] & result[7]
Code and CPU Cycles
Address
Mode
Source Form
CMPL RS, #IMM8
Machine Code
Cycles
IMM8
1
1
0
1
0
RS
IMM8
P
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Chapter 9 XGATE (S12XGATEV2)
One’s Complement
COM
COM
Operation
~RS ⇒ RD (translates to XNOR RD, R0, RS)
~RD ⇒ RD (translates to XNOR RD, R0, RD)
Performs a one’s complement on a general purpose register.
CCR Effects
N
Z
V
C
∆
∆
0
—
N: Set if bit 15 of the result is set; cleared otherwise.
Z: Set if the result is $0000; cleared otherwise.
V: 0; cleared.
C: Not affected.
Code and CPU Cycles
Address
Source Form
Mode
Machine Code
Cycles
COM RD, RS
COM RD
TRI
TRI
0
0
0
0
0
0
1
1
0
0
RD
RD
0
0
0
0
0
0
RS
RD
1
1
1
1
P
P
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Chapter 9 XGATE (S12XGATEV2)
Compare with Carry
CPC
CPC
Operation
RS2 – RS1 − Χ ⇒ NONE (translates to SBC R0, RS1, RS2)
Subtracts the carry bit and the content of register RS2 from the content of register RS1 using binary
subtraction and discards the result.
CCR Effects
N
Z
V
C
∆
∆
∆
∆
N: Set if bit 15 of the result is set; cleared otherwise.
Z: Set if the result is $0000; cleared otherwise.
V: Set if a two´s complement overflow resulted from the operation; cleared otherwise.
RS1[15] & RS2[15] & result[15] | RS1[15] & RS2[15] & result[15]
C: Set if there is a carry from the bit 15 of the result; cleared otherwise.
RS1[15] & RS2[15] | RS1[15] & result[15] | RS2[15] & result[15]
Code and CPU Cycles
Address
Mode
Source Form
CPC RS1, RS2
Machine Code
RS1
Cycles
TRI
0
0
0
1
1
0
0
0
RS2
0
1
P
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Chapter 9 XGATE (S12XGATEV2)
Compare Immediate 8-Bit Constant with
Carry (High Byte)
CPCH
CPCH
Operation
RS.H - IMM8 - C ⇒ NONE, only condition code flags get updated
Subtracts the carry bit and the 8-Bit constant IMM8 contained in the instruction code from the high byte
of the source register RD using binary subtraction and updates the condition code register accordingly. The
carry bit and Zero bits are taken into account to allow a 16-Bit compare in the form of
CMPL
CPCH
BCC
R2,#LOWBYTE
R2,#HIGHBYTE
; branch condition
Remark: There is no equivalent operation using triadic addressing. Comparing the values of two registers
can be performed by using the subtract instruction with R0 as destination register.
CCR Effects
N
Z
V
C
∆
∆
∆
∆
N: Set if bit 15 of the result is set; cleared otherwise.
Z: Set if the result is $00 and Z was set before this operation; cleared otherwise.
V: Set if a two´s complement overflow resulted from the operation; cleared otherwise.
RS[15] & IMM8[7] & result[15] | RS[15] & IMM8[7] & result[15]
C: Set if there is a carry from the bit 15 of the result; cleared otherwise.
RS[15] & IMM8[7] | RS[15] & result[15] | IMM8[7] & result[15]
Code and CPU Cycles
Address
Mode
Source Form
CPCH RD, #IMM8
Machine Code
Cycles
IMM8
1
1
0
1
1
RS
IMM8
P
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Chapter 9 XGATE (S12XGATEV2)
Clear Semaphore
CSEM
CSEM
Operation
Unlocks a semaphore that was locked by the RISC core.
In monadic address mode, bits RS[2:0] select the semaphore to be cleared.
CCR Effects
N
Z
V
C
—
—
—
—
N: Not affected.
Z: Not affected.
V: Not affected.
C: Not affected.
Code and CPU Cycles
Address
Mode
Source Form
Machine Code
Cycles
CSEM #IMM3
CSEM RS
IMM3
MON
0
0
0
0
0
0
0
0
0
0
IMM3
RS
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
1
PA
PA
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Chapter 9 XGATE (S12XGATEV2)
Logical Shift Left with Carry
CSL
CSL
Operation
n
C
RD
C
C
C
C
n bits
n = RS or IMM4
Shifts the bits in register RD n positions to the left. The lower n bits of the register RD become filled with
the carry flag. The carry flag will be updated to the bit contained in RD[16-n] before the shift for n > 0.
n can range from 0 to 16.
In immediate address mode, n is determined by the operand IMM4. n is considered to be 16 in IMM4 is
equal to 0.
In dyadic address mode, n is determined by the content of RS. n is considered to be 16 if the content of RS
is greater than 15.
CCR Effects
N
Z
V
C
∆
∆
∆
∆
N: Set if bit 15 of the result is set; cleared otherwise.
Z: Set if the result is $0000; cleared otherwise.
V: Set if a two´s complement overflow resulted from the operation; cleared otherwise.
RD[15] ^ RD[15]
old
new
C: Set if n > 0 and RD[16-n] = 1; if n = 0 unaffected.
Code and CPU Cycles
Address
Source Form
Mode
Machine Code
Cycles
CSL RD, #IMM4
CSL RD, RS
IMM4
DYA
0
0
0
0
0
0
0
0
1
1
RD
RD
IMM4
RS
1
0
0
0
1
1
0
0
P
P
1
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Chapter 9 XGATE (S12XGATEV2)
Logical Shift Right with Carry
CSR
CSR
Operation
n
C
C
C
C
RD
C
n bits
n = RS or IMM4
Shifts the bits in register RD n positions to the right. The higher n bits of the register RD become filled
with the carry flag. The carry flag will be updated to the bit contained in RD[n-1] before the shift for n > 0.
n can range from 0 to 16.
In immediate address mode, n is determined by the operand IMM4. n is considered to be 16 in IMM4 is
equal to 0.
In dyadic address mode, n is determined by the content of RS. n is considered to be 16 if the content of RS
is greater than 15.
CCR Effects
N
Z
V
C
∆
∆
∆
∆
N: Set if bit 15 of the result is set; cleared otherwise.
Z: Set if the result is $0000; cleared otherwise.
V: Set if a two´s complement overflow resulted from the operation; cleared otherwise.
RD[15] ^ RD[15]
old
new
C: Set if n > 0 and RD[n-1] = 1; if n = 0 unaffected.
Code and CPU Cycles
Address
Source Form
Mode
Machine Code
Cycles
CSR RD, #IMM4
CSR RD, RS
IMM4
DYA
0
0
0
0
0
0
0
0
1
1
RD
RD
IMM4
RS
1
0
0
0
1
1
1
1
P
P
1
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Chapter 9 XGATE (S12XGATEV2)
Jump and Link
JAL
JAL
Operation
PC + $0002 ⇒ RD; RD ⇒ PC
Jumps to the address stored in RD and saves the return address in RD.
CCR Effects
N
Z
V
C
—
—
—
—
N: Not affected.
Z: Not affected.
V: Not affected.
C: Not affected.
Code and CPU Cycles
Address
Mode
Source Form
Machine Code
RD
Cycles
JAL RD
MON
0
0
0
0
0
1
1
1
1
0
1
1
0
PP
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Chapter 9 XGATE (S12XGATEV2)
Load Byte from Memory
(Low Byte)
LDB
LDB
Operation
M[RB, #OFFS5] ⇒ RD.L; $00 ⇒ RD.H
M[RB, RI] ⇒ RD.L; $00 ⇒ RD.H
M[RB, RI] ⇒ RD.L; $00 ⇒ RD.H; RI+1 ⇒ RI;
RI-1 ⇒ RI; M[RS, RI] ⇒ RD.L; $00 ⇒ RD.H
1
Loads a byte from memory into the low byte of register RD. The high byte is cleared.
CCR Effects
N
Z
V
C
—
—
—
—
N: Not affected.
Z: Not affected.
V: Not affected.
C: Not affected.
Code and CPU Cycles
Address
Mode
Source Form
Machine Code
Cycles
LDB RD, (RB, #OFFS5)
LDB RD, (RS, RI)
IDO5
IDR
0
0
0
0
1
1
1
1
0
1
1
1
0
0
0
0
0
0
0
0
RD
RD
RD
RD
RB
RB
RB
RB
OFFS5
Pr
Pr
Pr
Pr
RI
0
0
1
0
1
0
LDB RD, (RS, RI+)
LDB RD, (RS, -RI)
IDR+
-IDR
RI
RI
1.If the same general purpose register is used as index (RI) and destination register (RD), the content of the register will not
be incremented after the data move: M[RB, RI] ⇒ RD.L; $00 ⇒ RD.H
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Chapter 9 XGATE (S12XGATEV2)
Load Immediate 8-Bit Constant
(High Byte)
LDH
LDH
Operation
IMM8 ⇒ RD.H;
Loads an eight bit immediate constant into the high byte of register RD. The low byte is not affected.
CCR Effects
N
Z
V
C
—
—
—
—
N: Not affected.
Z: Not affected.
V: Not affected.
C: Not affected.
Code and CPU Cycles
Address
Mode
Source Form
Machine Code
Cycles
LDH RD, #IMM8
IMM8
1
1
1
1
1
RD
IMM8
P
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Chapter 9 XGATE (S12XGATEV2)
Load Immediate 8-Bit Constant
(Low Byte)
LDL
LDL
Operation
IMM8 ⇒ RD.L; $00 ⇒ RD.H
Loads an eight bit immediate constant into the low byte of register RD. The high byte is cleared.
CCR Effects
N
Z
V
C
—
—
—
—
N: Not affected.
Z: Not affected.
V: Not affected.
C: Not affected.
Code and CPU Cycles
Address
Mode
Source Form
Machine Code
Cycles
LDL RD, #IMM8
IMM8
1
1
1
1
0
RD
IMM8
P
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Chapter 9 XGATE (S12XGATEV2)
Load Word from Memory
LDW
LDW
Operation
M[RB, #OFFS5] ⇒ RD
M[RB, RI] ⇒ RD
M[RB, RI] ⇒ RD; RI+2 ⇒ RI
RI-2 ⇒ RI; M[RS, RI] ⇒ RD
1
IMM16 ⇒RD (translates to LDL RD, #IMM16[7:0]; LDH RD, #IMM16[15:8])
Loads a 16-bit value into the register RD.
CCR Effects
N
Z
V
C
—
—
—
—
N: Not affected.
Z: Not affected.
V: Not affected.
C: Not affected.
Code and CPU Cycles
Address
Mode
Source Form
Machine Code
Cycles
LDW RD, (RB, #OFFS5)
LDW RD, (RB, RI)
LDW RD, (RB, RI+)
LDW RD, (RB, -RI)
LDW RD, #IMM16
IDO5
IDR
0
0
0
0
1
1
1
1
1
1
1
1
0
1
1
1
1
1
0
0
0
0
1
1
1
1
1
1
0
1
RD
RD
RD
RD
RD
RD
RB
RB
RB
RB
OFFS5
PR
PR
PR
PR
P
RI
RI
0
0
1
0
1
0
IDR+
-IDR
IMM8
IMM8
RI
IMM16[7:0]
IMM16[15:8]
P
1. If the same general purpose register is used as index (RI) and destination register (RD), the content of the register will not be
incremented after the data move: M[RB, RI] ⇒ RD
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Chapter 9 XGATE (S12XGATEV2)
Logical Shift Left
LSL
LSL
Operation
n
C
RD
0
0
0
0
n bits
n = RS or IMM4
Shifts the bits in register RD n positions to the left. The lower n bits of the register RD become filled with
zeros. The carry flag will be updated to the bit contained in RD[16-n] before the shift for n > 0.
n can range from 0 to 16.
In immediate address mode, n is determined by the operand IMM4. n is considered to be 16 in IMM4 is
equal to 0.
In dyadic address mode, n is determined by the content of RS. n is considered to be 16 if the content of RS
is greater than 15.
CCR Effects
N
Z
V
C
∆
∆
∆
∆
N: Set if bit 15 of the result is set; cleared otherwise.
Z: Set if the result is $0000; cleared otherwise.
V: Set if a two´s complement overflow resulted from the operation; cleared otherwise.
RD[15] ^ RD[15]
old
new
C: Set if n > 0 and RD[16-n] = 1; if n = 0 unaffected.
Code and CPU Cycles
Address
Source Form
Mode
Machine Code
Cycles
LSL RD, #IMM4
LSL RD, RS
IMM4
DYA
0
0
0
0
0
0
0
0
1
1
RD
RD
IMM4
RS
1
0
1
1
0
0
0
0
P
P
1
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Chapter 9 XGATE (S12XGATEV2)
Logical Shift Right
LSR
LSR
Operation
n
0
0
0
0
RD
C
n bits
n = RS or IMM4
Shifts the bits in register RD n positions to the right. The higher n bits of the register RD become filled
with zeros. The carry flag will be updated to the bit contained in RD[n-1] before the shift for n > 0.
n can range from 0 to 16.
In immediate address mode, n is determined by the operand IMM4. n is considered to be 16 in IMM4 is
equal to 0.
In dyadic address mode, n is determined by the content of RS. n is considered to be 16 if the content of RS
is greater than 15.
CCR Effects
N
Z
V
C
∆
∆
∆
∆
N: Set if bit 15 of the result is set; cleared otherwise.
Z: Set if the result is $0000; cleared otherwise.
V: Set if a two´s complement overflow resulted from the operation; cleared otherwise.
RD[15] ^ RD[15]
old
new
C: Set if n > 0 and RD[n-1] = 1; if n = 0 unaffected.
Code and CPU Cycles
Address
Source Form
Mode
Machine Code
Cycles
LSR RD, #IMM4
LSR RD, RS
IMM4
DYA
0
0
0
0
0
0
0
0
1
1
RD
RD
IMM4
RS
1
0
1
1
0
0
1
1
P
P
1
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Chapter 9 XGATE (S12XGATEV2)
Move Register Content
MOV
MOV
Operation
RS ⇒ RD (translates to OR RD, R0, RS)
Copies the content of RS to RD.
CCR Effects
N
Z
V
C
∆
∆
0
—
N: Set if bit 15 of the result is set; cleared otherwise.
Z: Set if the result is $0000; cleared otherwise.
V: 0; cleared.
C: Not affected.
Code and CPU Cycles
Address
Source Form
Mode
Machine Code
RD
Cycles
MOV RD, RS
TRI
0
0
0
1
0
0
0
0
RS
1
0
P
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Chapter 9 XGATE (S12XGATEV2)
Two’s Complement
NEG
NEG
Operation
–RS ⇒ RD (translates to SUB RD, R0, RS)
–RD ⇒ RD (translates to SUB RD, R0, RD)
Performs a two’s complement on a general purpose register.
CCR Effects
N
Z
V
C
∆
∆
∆
∆
N: Set if bit 15 of the result is set; cleared otherwise.
Z: Set if the result is $0000; cleared otherwise.
V: Set if a two´s complement overflow resulted from the operation; cleared otherwise.
RS[15] & RD[15]
new
C: Set if there is a carry from the bit 15 of the result; cleared otherwise
RS[15] | RD[15]
new
Code and CPU Cycles
Address
Mode
Source Form
Machine Code
Cycles
NEG RD, RS
NEG RD
TRI
TRI
0 0 0 1 1
0 0 0 1 1
RD
RD
0 0 0
0 0 0
RS
RD
0 0
0 0
P
P
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Chapter 9 XGATE (S12XGATEV2)
No Operation
NOP
NOP
Operation
No Operation for one cycle.
CCR Effects
N
Z
V
C
—
—
—
—
N: Not affected.
Z: Not affected.
V: Not affected.
C: Not affected.
Code and CPU Cycles
Address
Mode
Source Form
Machine Code
Cycles
NOP
INH
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
P
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Chapter 9 XGATE (S12XGATEV2)
Logical OR
OR
OR
Operation
RS1 | RS2 ⇒ RDRD | IMM16⇒ RD (translates to ORL RD, #IMM16[7:0]; ORH RD, #IMM16[15:8]
Performs a bit wise logical OR between two 16-bit values and stores the result in the destination
register RD.
CCR Effects
N
Z
V
C
∆
∆
0
—
N: Set if bit 15 of the result is set; cleared otherwise.
Z: Set if the result is $0000; cleared otherwise.
V: 0; cleared.
C: Not affected.
Code and CPU Cycles
Address
Source Form
Mode
Machine Code
Cycles
OR RD, RS1, RS2
OR RD, #IMM16
TRI
0
1
1
0
0
0
0
1
1
1
0
0
0
0
1
RD
RD
RD
RS1
RS2
1
0
P
P
P
IMM8
IMM8
IMM16[7:0]
IMM16[15:8]
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Chapter 9 XGATE (S12XGATEV2)
Logical OR Immediate 8-Bit Constant
(High Byte)
ORH
ORH
Operation
RD.H | IMM8 ⇒ RD.H
Performs a bit wise logical OR between the high byte of register RD and an immediate 8-Bit constant and
stores the result in the destination register RD.H. The low byte of RD is not affected.
CCR Effects
N
Z
V
C
∆
∆
0
—
N: Set if bit 15 of the result is set; cleared otherwise.
Z: Set if the 8-Bit result is $00; cleared otherwise.
V: 0; cleared.
C: Not affected.
Code and CPU Cycles
Address
Source Form
Mode
Machine Code
Cycles
ORH RD, #IMM8
IMM8
1
0
1
0
1
RD
IMM8
P
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Chapter 9 XGATE (S12XGATEV2)
Logical OR Immediate 8-Bit Constant
(Low Byte)
ORL
ORL
Operation
RD.L | IMM8 ⇒ RD.L
Performs a bit wise logical OR between the low byte of register RD and an immediate 8-Bit constant and
stores the result in the destination register RD.L. The high byte of RD is not affected.
CCR Effects
N
Z
V
C
∆
∆
0
—
N: Set if bit 7 of the result is set; cleared otherwise.
Z: Set if the 8-Bit result is $00; cleared otherwise.
V: 0; cleared.
C: Not affected.
Code and CPU Cycles
Address
Source Form
Mode
Machine Code
Cycles
ORL RD, #IMM8
IMM8
1
0
1
0
0
RD
IMM8
P
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Chapter 9 XGATE (S12XGATEV2)
Calculate Parity
PAR
PAR
Operation
Calculates the number of ones in the register RD. The Carry flag will be set if the number is odd, otherwise
it will be cleared.
CCR Effects
N
Z
V
C
0
∆
0
∆
N: 0; cleared.
Z: Set if RD is $0000; cleared otherwise.
V: 0; cleared.
C: Set if there the number of ones in the register RD is odd; cleared otherwise.
Code and CPU Cycles
Address
Mode
Source Form
Machine Code
RD
Cycles
PAR, RD
MON
0
0
0
0
0
1
1
1
1
0
1
0
1
P
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Chapter 9 XGATE (S12XGATEV2)
Rotate Left
ROL
ROL
Operation
RD
n bits
n = RS or IMM4
Rotates the bits in register RD n positions to the left. The lower n bits of the register RD are filled with the
upper n bits. Two source forms are available. In the first form, the parameter n is contained in the
instruction code as an immediate operand. In the second form, the parameter is contained in the lower bits
of the source register RS[3:0]. All other bits in RS are ignored. If n is zero, no shift will take place and the
register RD will be unaffected; however, the condition code flags will be updated.
CCR Effects
N
Z
V
C
∆
∆
0
—
N: Set if bit 15 of the result is set; cleared otherwise.
Z: Set if the result is $0000; cleared otherwise.
V: 0; cleared.
C: Not affected.
Code and CPU Cycles
Address
Source Form
Mode
Machine Code
Cycles
ROL RD, #IMM4
ROL RD, RS
IMM4
DYA
0
0
0
0
0
0
0
0
1
1
RD
RD
IMM4
RS
1
0
1
1
1
1
0
0
P
P
1
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Chapter 9 XGATE (S12XGATEV2)
Rotate Right
ROR
ROR
Operation
RD
n bits
n = RS or IMM4
Rotates the bits in register RD n positions to the right. The upper n bits of the register RD are filled with
the lower n bits. Two source forms are available. In the first form, the parameter n is contained in the
instruction code as an immediate operand. In the second form, the parameter is contained in the lower bits
of the source register RS[3:0]. All other bits in RS are ignored. If n is zero no shift will take place and the
register RD will be unaffected; however, the condition code flags will be updated.
CCR Effects
N
Z
V
C
∆
∆
0
—
N: Set if bit 15 of the result is set; cleared otherwise.
Z: Set if the result is $0000; cleared otherwise.
V: 0; cleared.
C: Not affected.
Code and CPU Cycles
Address
Source Form
Mode
Machine Code
Cycles
ROR RD, #IMM4
ROR RD, RS
IMM4
DYA
0
0
0
0
0
0
0
0
1
1
RD
RD
IMM4
RS
1
0
1
1
1
1
1
1
P
P
1
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Chapter 9 XGATE (S12XGATEV2)
Return to Scheduler
RTS
RTS
Operation
Terminates the current thread of program execution and remains idle until a new thread is started by the
hardware scheduler.
CCR Effects
N
Z
V
C
—
—
—
—
N: Not affected.
Z: Not affected.
V: Not affected.
C: Not affected.
Code and CPU Cycles
Address
Mode
Source Form
Machine Code
Cycles
RTS
INH
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
PA
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Chapter 9 XGATE (S12XGATEV2)
Subtract with Carry
SBC
SBC
Operation
RS1 - RS2 - C ⇒ RD
Subtracts the content of register RS2 and the value of the Carry bit from the content of register RS1 using
binary subtraction and stores the result in the destination register RD. Also the zero flag is carried forward
from the previous operation allowing 32 and more bit subtractions.
Example:
SUB
SBC
BCC
R6,R4,R2
R7,R5,R3
; R7:R6 = R5:R4 - R3:R2
; conditional branch on 32 bit subtraction
CCR Effects
N
Z
V
C
∆
∆
∆
∆
N: Set if bit 15 of the result is set; cleared otherwise.
Z: Set if the result is $0000 and Z was set before this operation; cleared otherwise.
V: Set if a two´s complement overflow resulted from the operation; cleared otherwise.
RS1[15] & RS2[15] & RD[15]
| RS1[15] & RS2[15] & RD[15]
new
new
C: Set if there is a carry from bit 15 of the result; cleared otherwise.
RS1[15] & RS2[15] | RS1[15] & RD[15]
| RS2[15] & RD[15]
new
new
Code and CPU Cycles
Address
Mode
Source Form
SBC RD, RS1, RS2
Machine Code
RD RS1
Cycles
TRI
0
0
0
1
1
RS2
0
1
P
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Chapter 9 XGATE (S12XGATEV2)
Set Semaphore
SSEM
SSEM
Operation
Attempts to set a semaphore. The state of the semaphore will be stored in the Carry-Flag:
1 = Semaphore is locked by the RISC core
0 = Semaphore is locked by the S12X_CPU
In monadic address mode, bits RS[2:0] select the semaphore to be set.
CCR Effects
N
Z
V
C
—
—
—
∆
N: Not affected.
Z: Not affected.
V: Not affected.
C: Set if semaphore is locked by the RISC core; cleared otherwise.
Code and CPU Cycles
Address
Source Form
Mode
Machine Code
Cycles
SSEM #IMM3
SSEM RS
IMM3
MON
0
0
0
0
0
0
0
0
0
0
IMM3
RS
1
1
1
1
1
1
1
1
0
0
0
0
1
1
0
1
PA
PA
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Chapter 9 XGATE (S12XGATEV2)
Sign Extend Byte to Word
SEX
SEX
Operation
The result in RD is the 16-bit sign extended representation of the original two’s complement number in the
low byte of RD.L.
CCR Effects
N
Z
V
C
∆
∆
0
—
N: Set if bit 15 of the result is set; cleared otherwise.
Z: Set if the result is $0000; cleared otherwise.
V: 0; cleared.
C: Not affected.
Code and CPU Cycles
Address
Source Form
Mode
Machine Code
RD
Cycles
SEX RD
MON
0
0
0
0
0
1
1
1
1
0
1
0
0
P
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Chapter 9 XGATE (S12XGATEV2)
Set Interrupt Flag
SIF
SIF
Operation
Sets the Interrupt Flag of an XGATE Channel. This instruction supports two source forms. If inherent
address mode is used, then the interrupt flag of the current channel (XGCHID) will be set. If the monadic
address form is used, the interrupt flag associated with the channel id number contained in RS[6:0] is set.
The content of RS[15:7] is ignored.
CCR Effects
N
Z
V
C
—
—
—
—
N: Not affected.
Z: Not affected.
V: Not affected.
C: Not affected.
Code and CPU Cycles
Address
Mode
Source Form
Machine Code
Cycles
SIF
INH
0
0
0
0
0
0
0
0
0
0
0
1
1
0
1
0
1
0
1
0
1
0
0
0
1
0
1
0
1
PA
PA
SIF RS
MON
RS
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Chapter 9 XGATE (S12XGATEV2)
Store Byte to Memory
(Low Byte)
STB
STB
Operation
RS.L⇒ M[RB, #OFFS5]
RS.L⇒ M[RB, RI]
RS.L⇒ M[RB, RI]; RI+1 ⇒ RI;
1
RI–1 ⇒ RI; RS.L ⇒ M[RB, RI]
Stores the low byte of register RD to memory.
CCR Effects
N
Z
V
C
—
—
—
—
N: Not affected.
Z: Not affected.
V: Not affected.
C: Not affected.
Code and CPU Cycles
Address
Mode
Source Form
Machine Code
Cycles
STB RS, (RB, #OFFS5),
STB RS, (RB, RI)
IDO5
IDR
0
0
0
0
1
1
1
1
0
1
1
1
1
1
1
1
0
0
0
0
RS
RS
RS
RS
RB
RB
RB
RB
OFFS5
Pw
Pw
Pw
Pw
RI
0
0
1
0
1
0
STB RS, (RB, RI+)
STB RS, (RB, -RI)
IDR+
-IDR
RI
RI
1. If the same general purpose register is used as index (RI) and source register (RS), the unmodified content of the source
register is written to the memory: RS.L ⇒ M[RB, RS-1]; RS-1 ⇒ RS
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Chapter 9 XGATE (S12XGATEV2)
Store Word to Memory
STW
STW
Operation
RS ⇒ M[RB, #OFFS5]
RS ⇒ M[RB, RI]
RS ⇒ M[RB, RI]; RI+2 ⇒ RI;
1
RI–2 ⇒ RI; RS ⇒ M[RB, RI]
Stores the content of register RS to memory.
CCR Effects
N
Z
V
C
—
—
—
—
N: Not affected.
Z: Not affected.
V: Not affected.
C: Not affected.
Code and CPU Cycles
Address
Mode
Source Form
Machine Code
Cycles
STW RS, (RB, #OFFS5)
STW RS, (RB, RI)
IDO5
IDR
0
0
0
0
1
1
1
1
0
1
1
1
1
1
1
1
1
1
1
1
RS
RS
RS
RS
RB
RB
RB
RB
OFFS5
PW
PW
PW
PW
RI
RI
RI
0
0
1
0
1
0
STW RS, (RB, RI+)
STW RS, (RB, -RI)
IDR+
-IDR
1. If the same general purpose register is used as index (RI) and source register (RS), the unmodified content of the source
register is written to the memory: RS ⇒ M[RB, RS–2]; RS–2 ⇒ RS
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Chapter 9 XGATE (S12XGATEV2)
Subtract without Carry
SUB
SUB
Operation
RS1 – RS2 ⇒ RDRD − IMM16 ⇒ RD (translates to SUBL RD, #IMM16[7:0]; SUBH RD, #IMM[15:8])
Subtracts two 16-bit values and stores the result in the destination register RD.
CCR Effects
N
Z
V
C
∆
∆
∆
∆
N: Set if bit 15 of the result is set; cleared otherwise.
Z: Set if the result is $0000; cleared otherwise.
V: Set if a two´s complement overflow resulted from the operation; cleared otherwise.
RS1[15] & RS2[15] & RD[15]
| RS1[15] & RS2[15] & RD[15]
new
new
C: Set if there is a carry from the bit 15 of the result; cleared otherwise.
RS1[15] & RS2[15] | RS1[15] & RD[15]
| RS2[15] & RD[15]
new
new
Code and CPU Cycles
Address
Mode
Source Form
Machine Code
RD RS1
Cycles
SUB RD, RS1, RS2
TRI
0
1
1
0
1
1
0
0
0
1
0
0
1
0
1
RS2
0
0
P
P
P
SUB RD, #IMM16
IMM8
IMM8
RD
RD
IMM16[7:0]
IMM16[15:8]
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Chapter 9 XGATE (S12XGATEV2)
Subtract Immediate 8-Bit Constant
(High Byte)
SUBH
SUBH
Operation
RD – IMM8:$00 ⇒ RD
Subtracts a signed immediate 8-Bit constant from the content of high byte of register RD and using binary
subtraction and stores the result in the high byte of destination register RD. This instruction can be used
after an SUBL for a 16-bit immediate subtraction.
Example:
SUBL
SUBH
R2,#LOWBYTE
R2,#HIGHBYTE
; R2 = R2 - 16 Bit immediate
CCR Effects
N
Z
V
C
∆
∆
∆
∆
N: Set if bit 15 of the result is set; cleared otherwise.
Z: Set if the result is $0000; cleared otherwise.
V: Set if a two´s complement overflow resulted from the operation; cleared otherwise.
RD[15] & IMM8[7] & RD[15]
| RD[15] & IMM8[7] & RD[15]
old
new
old new
C: Set if there is a carry from the bit 15 of the result; cleared otherwise.
RD[15] & IMM8[7] | RD[15] & RD[15]
| IMM8[7] & RD[15]
old
old
new
new
Code and CPU Cycles
Address
Mode
Source Form
Machine Code
Cycles
SUBH RD, #IMM8
IMM8
1
1
0
0
1
RD
IMM8
P
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Chapter 9 XGATE (S12XGATEV2)
Subtract Immediate 8-Bit Constant
(Low Byte)
SUBL
SUBL
Operation
RD – $00:IMM8 ⇒ RD
Subtracts an immediate 8 Bit constant from the content of register RD using binary subtraction and stores
the result in the destination register RD.
CCR Effects
N
Z
V
C
∆
∆
∆
∆
N: Set if bit 15 of the result is set; cleared otherwise.
Z: Set if the result is $0000; cleared otherwise.
V: Set if a two´s complement overflow resulted from the 8-bit operation; cleared otherwise.
RD[15] & RD[15]
old
new
C: Set if there is a carry from the bit 7 to bit 8 of the result; cleared otherwise.
RD[15] & RD[15]
old
new
Code and CPU Cycles
Address
Mode
Source Form
Machine Code
Cycles
SUBL RD, #IMM8
IMM8
1
1
0
0
0
RD
IMM8
P
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Chapter 9 XGATE (S12XGATEV2)
Transfer from and to Special Registers
TFR
TFR
Operation
TFR RD,CCR: CCR ⇒ RD[3:0], 0 ⇒ RD[15:4]
TFR CCR,RD: RD[3:0] ⇒ CCR
TFR RD,PC: PC+4 ⇒ RD
Transfers the content of one RISC core register to another.
The TFR RD,PC instruction can be used to implement relative subroutine calls.
Example:
TFR
BRA
R7,PC
SUBR
;Return address (RETADDR) is stored in R7
;Relative branch to subroutine (SUBR)
RETADDR ...
SUBR
...
JAL
R7
;Jump to return address (RETADDR)
CCR Effects
TFR RD,CCR, TFR RD,PC:
TFR CCR,RS:
N
Z
V
C
N
Z
V
C
—
—
—
—
∆
∆
∆
∆
N: Not affected.
Z: Not affected.
V: Not affected.
C: Not affected.
N: RS[3].
Z: RS[2].
V: RS[1].
C: RS[0].
Code and CPU Cycles
Address
Mode
Source Form
Machine Code
Cycles
TFR RD,CCR
TFR CCR,RS
TFR RD,PC
CCR ⇒ RD
RS ⇒ CCR
PC+4 ⇒ RD
MON
MON
MON
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
RD
RS
RD
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
1
0
1
0
P
P
P
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Chapter 9 XGATE (S12XGATEV2)
Test Register
TST
TST
Operation
RS – 0 ⇒ NONE (translates to SUB R0, RS, R0)
Subtracts zero from the content of register RS using binary subtraction and discards the result.
CCR Effects
N
Z
V
C
∆
∆
∆
∆
N: Set if bit 15 of the result is set; cleared otherwise.
Z: Set if the result is $0000; cleared otherwise.
V: Set if a two´s complement overflow resulted from the operation; cleared otherwise.
RS[15] & result[15]
C: Set if there is a carry from the bit 15 of the result; cleared otherwise.
RS1[15] & result[15]
Code and CPU Cycles
Address
Mode
Source Form
Machine Code
RS1
Cycles
TST RS
TRI
0
0
0
1
1
0
0
0
0
0
0
0
0
P
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Chapter 9 XGATE (S12XGATEV2)
Logical Exclusive NOR
XNOR
XNOR
Operation
~(RS1 ^ RS2) ⇒ RD~(RD ^ IMM16) ⇒ RD
(translates to XNOR RD, #IMM[15:8]; XNOR RD, #IMM16[7:0])
Performs a bit wise logical exclusive NOR between two 16-bit values and stores the result in the
destination register RD.
Remark: Using R0 as a source registers will calculate the one’s complement of the other source register.
Using R0 as both source operands will fill RD with $FFFF.
CCR Effects
N
Z
V
C
∆
∆
0
—
N: Set if bit 15 of the result is set; cleared otherwise.
Z: Set if the result is $0000; cleared otherwise.
V: 0; cleared.
C: Not affected.
Code and CPU Cycles
Address
Source Form
Mode
Machine Code
Cycles
XNOR RD, RS1, RS2
XNOR RD, #IMM16
TRI
0
1
1
0
0
0
0
1
1
1
1
1
0
0
1
RD
RD
RD
RS1
RS2
1
1
P
P
P
IMM8
IMM8
IMM16[7:0]
IMM16[15:8]
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Chapter 9 XGATE (S12XGATEV2)
Logical Exclusive NOR Immediate
8-Bit Constant (High Byte)
XNORH
XNORH
Operation
~(RD.H ^ IMM8) ⇒ RD.H
Performs a bit wise logical exclusive NOR between the high byte of register RD and an immediate 8-Bit
constant and stores the result in the destination register RD.H. The low byte of RD is not affected.
CCR Effects
N
Z
V
C
∆
∆
0
—
N: Set if bit 15 of the result is set; cleared otherwise.
Z: Set if the 8-bit result is $00; cleared otherwise.
V: 0; cleared.
C: Not affected.
Code and CPU Cycles
Address
Source Form
Mode
Machine Code
Cycles
XNORH RD, #IMM8
IMM8
1
0
1
1
1
RD
IMM8
P
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Chapter 9 XGATE (S12XGATEV2)
Logical Exclusive NOR Immediate
8-Bit Constant (Low Byte)
XNORL
XNORL
Operation
~(RD.L ^ IMM8) ⇒ RD.L
Performs a bit wise logical exclusive NOR between the low byte of register RD and an immediate 8-Bit
constant and stores the result in the destination register RD.L. The high byte of RD is not affected.
CCR Effects
N
Z
V
C
∆
∆
0
—
N: Set if bit 7 of the result is set; cleared otherwise.
Z: Set if the 8-bit result is $00; cleared otherwise.
V: 0; cleared.
C: Not affected.
Code and CPU Cycles
Address
Source Form
Mode
Machine Code
Cycles
XNORL RD, #IMM8
IMM8
1
0
1
1
0
RD
IMM8
P
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Chapter 9 XGATE (S12XGATEV2)
9.8.6
Instruction Coding
Table 9-18 summarizes all XGATE instructions in the order of their machine coding.
Table 9-18. Instruction Set Summary (Sheet 1 of 3)
Functionality
15 14 13 12 11 10
9
8
7
6
5
4
3
2
1
0
Return to Scheduler and Others
BRK
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
0
1
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
NOP
RTS
SIF
Semaphore Instructions
CSEM IMM3
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
IMM3
RS
IMM3
RS
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
1
1
0
1
0
1
CSEM RS
SSEM IMM3
SSEM RS
Single Register Instructions
SEX RD
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
RD
RD
RD
RS
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
1
0
1
PAR RD
JAL RD
SIF RS
Special Move instructions
TFR RD,CCR
TFR CCR,RS
TFR RD,PC
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
RD
RS
RD
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
1
0
1
0
Shift instructions Dyadic
BFFO RD, RS
ASR RD, RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
RD
RD
RD
RD
RD
RD
RD
RD
RS
RS
RS
RS
RS
RS
RS
RS
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
CSL RD, RS
CSR RD, RS
LSL RD, RS
LSR RD, RS
ROL RD, RS
ROR RD, RS
Shift instructions immediate
ASR RD, #IMM4
CSL RD, #IMM4
CSR RD, #IMM4
LSL RD, #IMM4
LSR RD, #IMM4
ROL RD, #IMM4
ROR RD, #IMM4
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
RD
RD
RD
RD
RD
RD
RD
IMM4
1
1
1
1
1
1
1
0
0
0
1
1
1
1
0
1
1
0
0
1
1
1
0
1
0
1
0
1
IMM4
IMM4
IMM4
IMM4
IMM4
IMM4
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Chapter 9 XGATE (S12XGATEV2)
Functionality
Table 9-18. Instruction Set Summary (Sheet 2 of 3)
15 14 13 12 11 10
9
8
7
6
5
4
3
2
1
0
Logical Triadic
AND RD, RS1, RS2
OR RD, RS1, RS2
XNOR RD, RS1, RS2
Arithmetic Triadic
SUB RD, RS1, RS2
SBC RD, RS1, RS2
ADD RD, RS1, RS2
ADC RD, RS1, RS2
Branches
0
0
0
0
0
0
0
0
0
1
1
1
0
0
0
RD
RD
RD
RS1
RS1
RS1
RS2
RS2
RS2
0
1
1
0
0
1
For compare use SUB R0,Rs1,Rs2
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
RD
RD
RD
RD
RS1
RS1
RS1
RS1
RS2
RS2
RS2
RS2
0
0
1
1
0
1
0
1
BCC REL9
BCS REL9
BNE REL9
BEQ REL9
BPL REL9
BMI REL9
BVC REL9
BVS REL9
BHI REL9
BLS REL9
BGE REL9
BLT REL9
BGT REL9
BLE REL9
BRA REL10
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
REL9
REL9
REL9
REL9
REL9
REL9
REL9
REL9
REL9
REL9
REL9
REL9
REL9
REL9
REL10
Load and Store Instructions
LDB RD, (RB, #OFFS5)
LDW RD, (RB, #OFFS5)
STB RS, (RB, #OFFS5)
STW RS, (RB, #OFFS5)
LDB RD, (RB, RI)
LDW RD, (RB, RI)
STB RS, (RB, RI)
STW RS, (RB, RI)
LDB RD, (RB, RI+)
LDW RD, (RB, RI+)
STB RS, (RB, RI+)
STW RS, (RB, RI+)
LDB RD, (RB, –RI)
LDW RD, (RB, –RI)
STB RS, (RB, –RI)
STW RS, (RB, –RI)
Bit Field Instructions
BFEXT RD, RS1, RS2
BFINS RD, RS1, RS2
BFINSI RD, RS1, RS2
BFINSX RD, RS1, RS2
Logic Immediate Instructions
ANDL RD, #IMM8
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
RD
RD
RS
RS
RD
RD
RS
RS
RD
RD
RS
RS
RD
RD
RS
RS
RB
RB
RB
RB
RB
RB
RB
RB
RB
RB
RB
RB
RB
RB
RB
RB
OFFS5
OFFS5
OFFS5
OFFS5
RI
RI
RI
RI
RI
RI
RI
RI
RI
RI
RI
RI
0
0
0
0
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
1
1
0
1
0
1
RD
RD
RD
RD
RS1
RS1
RS1
RS1
RS2
RS2
RS2
RS2
1
1
1
1
1
1
1
1
1
0
0
0
0
RD
IMM8
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Chapter 9 XGATE (S12XGATEV2)
Table 9-18. Instruction Set Summary (Sheet 3 of 3)
Functionality
ANDH RD, #IMM8
BITL RD, #IMM8
BITH RD, #IMM8
ORL RD, #IMM8
ORH RD, #IMM8
15 14 13 12 11 10
9
8
7
6
5
4
3
2
1
0
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
1
1
1
1
0
1
1
0
0
1
1
1
0
1
0
1
0
1
RD
RD
RD
RD
RD
RD
RD
IMM8
IMM8
IMM8
IMM8
IMM8
IMM8
IMM8
XNORL RD, #IMM8
XNORH RD, #IMM8
Arithmetic Immediate Instructions
SUBL RD, #IMM8
SUBH RD, #IMM8
CMPL RS, #IMM8
CPCH RS, #IMM8
ADDL RD, #IMM8
ADDH RD, #IMM8
LDL RD, #IMM8
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
RD
RD
RS
RS
RD
RD
RD
RD
IMM8
IMM8
IMM8
IMM8
IMM8
IMM8
IMM8
IMM8
LDH RD, #IMM8
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Chapter 9 XGATE (S12XGATEV2)
9.9
Initialization and Application Information
9.9.1
Initialization
The recommended initialization of the XGATE is as follows:
1. Clear the XGE bit to suppress any incoming service requests.
2. Make sure that no thread is running on the XGATE. This can be done in several ways:
a) Poll the XGCHID register until it reads $00. Also poll XGDBG and XGSWEIF to make sure
that the XGATE has not been stopped.
b) Enter Debug Mode by setting the XGDBG bit. Clear the XGCHID register. Clear the XGDBG
bit.
The recommended method is a).
3. Set the XGVBR register to the lowest address of the XGATE vector space.
4. Clear all Channel ID flags.
5. Copy XGATE vectors and code into the RAM.
6. Initialize the S12X_INT module.
7. Enable the XGATE by setting the XGE bit.
The following code example implements the XGATE initialization sequence.
9.9.2
Code Example (Transmit "Hello World!" on SCI)
CPU
;###########################################
;# SYMBOLS
;###########################################
S12
#
SCI_REGS
SCIBDH
SCICR2
SCISR1
SCIDRL
TIE
TE
RE
SCI_VEC
EQU
EQU
EQU
EQU
EQU
EQU
EQU
EQU
EQU
$00C8
;SCI register space
;SCI Baud Rate Register
;SCI Control Register 2
;SCI Status Register 1
;SCI Control Register 2
;TIE bit mask
;TE bit mask
;RE bit mask
;SCI vector number
SCI_REGS+$00
SCI_REGS+$03
SCI_REGS+$04
SCI_REGS+$07
$80
$08
$04
$D6
INT_REGS
INT_CFADDR
INT_CFDATA
RQST
EQU
EQU
EQU
EQU
$0120
;S12X_INT register space
INT_REGS+$07
INT_REGS+$08
$80
;Interrupt Configuration Address Register
;Interrupt Configuration Data Registers
;RQST bit mask
XGATE_REGS
XGMCTL
XGMCTL_CLEAR
XGEM
XGDBGM
XGE
EQU
EQU
EQU
EQU
EQU
EQU
EQU
EQU
$0380
;XGATE register space
XGATE_REGS+$00 ;XGATE Module Control Register
$F902
$8000
$2000
$0080
$0020
$0002
XGDBG
XGSWEIF
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Chapter 9 XGATE (S12XGATEV2)
XGCHID
XGVBR
XGIF
XGSWT
XGSEM
EQU
EQU
EQU
EQU
EQU
XGATE_REGS+$02 ;XGATE Channel ID Register
XGATE_REGS+$06 ;XGATE Vector Base Register
XGATE_REGS+$08 ;XGATE Interrupt Flag Vector
XGATE_REGS+$18 ;XGATE Software Trigger Register
XGATE_REGS+$1A ;XGATE Semaphore Register
RPAGE
EQU
$0016
RAM_SIZE
EQU
EQU
EQU
EQU
EQU
20*$400
;20k RAM
RAM_START_GLOBAL
RAM_START_XGATE
RAM_START_S12
RPAGE_VALUE
$10_0000-RAM_SIZE
$1_0000-RAM_SIZE
$1000
RAM_START_GLOBAL>>12
XGATE_VECTORS
XGATE_DATA
EQU
EQU
RAM_START_S12
RAM_START_S12+(4*128)
XGATE_OFFSET
BUS_FREQ_HZ
EQU
EQU
(RAM_START_XGATE+(4*128))-XGATE_DATA_BEGIN
40_000000
;###########################################
;# RESET VECTOR
;###########################################
#
ORG
DW
$FFFE
START_OF_CODE
ORG
$3000
START_OF_CODE
;###########################################
;# INITIALIZE SCI
;###########################################
#
INIT_SCI
MOVW
MOVB
#(BUS_FREQ_HZ/(16*9600)), SCIBDH
#(TIE|TE|RE), SCICR2 ;enable tx buffer empty interrupt
;set baud rate
;###########################################
;# INITIALIZE S12X_INT
#
;###########################################
SEI
INIT_INT
;disable interrupts
MOVB
MOVB
#(SCI_VEC&$F0), INT_CFADDR ;switch SCI interrupts to XGATE
#RQST|$01, INT_CFDATA+((SCI_VEC&$0F)>>1)
;###########################################
;# INITIALIZE XGATE
;###########################################
#
INIT_XGATE
MOVW
#XGMCTL_CLEAR, XGMCTL
;clear all XGMCTL bits
BRSET XGCHID, $FF, INIT_XGATE ;wait until current thread is done
MOVW
#$10000-RAM_SIZE, XGVBR ;set vector base register
LDX
LDD
STD
STD
STD
STD
STD
STD
#XGIF
#$FFFF
2,X+
2,X+
2,X+
2,X+
2,X+
2,X+
;clear all channel interrupt flags
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Chapter 9 XGATE (S12XGATEV2)
STD
STD
2,X+
2,X+
MOVW
#$FF00, XGSWT
;clear all software triggers
;###########################################
;# INITIALIZE XGATE VECTOR SPACE
;###########################################
#
INIT_XGATE_VECTOR_SPACE MOVB
#(RAM_START_GLOBAL>>12), RPAGE ;set all vectors to dummy
service routine
LDX
#128
LDY
LDD
#RAM_START_S12
#XGATE_DUMMY+XGATE_OFFSET
INIT_XGATE_VECTOR_SPACE_LOOP
STD
4,Y+
DBNE
X,INIT_XGATE_VECTOR_SPACE_LOOP
;set SCI INTERRUPT VECTOR
MOVW #XGATE_CODE_BEGIN+XGATE_OFFSET,RAM_START_S12+(2*SCI_VEC)
#XGATE_DATA_BEGIN+XGATE_OFFSET, RAM_START_S12+(2*SCI_VEC)+2
MOVW
;###########################################
;#
COPY XGATE CODE
#
;###########################################
COPY_XGATE_CODE
COPY_XGATE_CODE_LOOP
LDX
#XGATE_DATA_BEGIN
2,X+, 2,Y+
2,X+, 2,Y+
2,X+, 2,Y+
2,X+, 2,Y+
MOVW
MOVW
MOVW
MOVW
CPX
#XGATE_CODE_END
COPY_XGATE_CODE_LOOP
BLS
;###########################################
;# START XGATE
;###########################################
#
START_XGATE
MOVB
BRA
#(XGE|XGDBGM|XGSWEIF), XGMCTL ;enable XGATE
*
CPU
XGATE
;###########################################
;# XGATE DATA
#
;###########################################
ALIGN 1
XGATE_DATA_BEGIN
XGATE_DATA_SCI_PTR
XGATE_DATA_MSG_IDX
XGATE_DATA_MSG
DW
DB
FCC
DB
SCI_REGS
XGATE_DATA_MSG-XGATE_DATA_BEGIN
"Hello World!"
$0D
;pointer to SCI register space
;string pointer
;ASCII string
;CR
XGATE_DATA_END
;###########################################
;# XGATE CODE
#
;###########################################
ALIGN 1
XGATE_CODE_BEGIN
LDW
LDB
LDB
STB
LDB
R2,(R1,#(XGATE_DATA_SCI_PTR-XGATE_DATA_BEGIN));SCI -> R2
R3,(R1,#(XGATE_DATA_MSG_IDX-XGATE_DATA_BEGIN));msg -> R3
R4,(R1,R3+)
;curr. char -> R4
R3,(R1,#(XGATE_DATA_MSG_IDX-XGATE_DATA_BEGIN));R3 -> idx
R0,(R2,#(SCISR1-SCI_REGS))
;initiate SCI transmit
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Chapter 9 XGATE (S12XGATEV2)
STB
CMPL
BEQ
RTS
LDL
STB
LDL
STB
RTS
EQU
R4,(R2,#(SCIDRL-SCI_REGS))
R4,#$0D
XGATE_CODE_DONE
;initiate SCI transmit
XGATE_CODE_DONE
R4,#$00
R4,(R2,#(SCICR2-SCI_REGS))
R3,#(XGATE_DATA_MSG-XGATE_DATA_BEGIN);reset R3
R3,(R1,#(XGATE_DATA_MSG_IDX-XGATE_DATA_BEGIN))
;disable SCI interrupts
XGATE_CODE_END
XGATE_DUMMY
XGATE_CODE_END
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Chapter 10
Security (S12X9SECV2)
10.1 Introduction
This specification describes the function of the security mechanism in the S12X chip family
(MC9S12XDP512).
10.1.1 Features
The user must be reminded that part of the security must lie with the application code. An extreme example
would be application code that dumps the contents of the internal memory. This would defeat the purpose
of security. At the same time, the user may also wish to put a backdoor in the application program. An
example of this is the user downloads a security key through the SCI, which allows access to a
programming routine that updates parameters stored in another section of the Flash memory.
The security features of the S12X chip family (in secure mode) are:
•
•
•
•
•
Protect the contents of non-volatile memories (Flash, EEPROM)
Execution of NVM commands is restricted
Disable access to internal memory via background debug module (BDM)
Disable access to internal Flash/EEPROM in expanded modes
Disable debugging features for CPU and XGATE
Table 10-1 gives an overview over availability of security relevant features in unsecure and secure modes.
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Chapter 10 Security (S12X9SECV2)
Table 10-1. Features Availability in Unsecure and Secure Modes
Unsecure Mode
Secure Mode
NS
SS
NX
NS
SS
NX
ES
EX
ST
1
1
1
1
Flash Array Access
EEPROM Array Access
NVM Commands
BDM
✔
✔
✔
✔
✔
✔
✔
✔
—
—
✔
✔
✔
✔
✔
✔
✔
✔
—
—
—
—
—
—
—
—
✔
✔
✔
✔
✔
✔
✔
✔
✔
—
2
2
2
2
2
2
2
2
2
2
✔
✔
✔
✔
✔
✔
✔
✔
✔
✔
3
✔
✔
✔
—
—
✔
✔
✔
✔
—
✔
✔
✔
✔
✔
✔
✔
✔
✔
✔
—
—
—
—
—
✔
—
—
—
✔
—
—
—
✔
—
—
—
✔
—
—
—
✔
DBG Module Trace
XGATE Debugging
External Bus Interface
—
—
—
—
Internal status visible
multiplexed on
—
✔
✔
—
external bus
Internal accesses visible
on external bus
—
—
—
—
—
✔
—
—
—
—
—
✔
1
Availability of Flash arrays in the memory map depends on ROMCTL/EROMCTL pins and/or the state of
the ROMON/EROMON bits in the MMCCTL1 register. Please refer to the S12X_MMC block guide for
detailed information.
2
3
Restricted NVM command set only. Please refer to the FTX/EETX block guides for detailed information.
BDM hardware commands restricted to peripheral registers only.
10.1.2 Modes of Operation
10.1.3 Securing the Microcontroller
Once the user has programmed the Flash and EEPROM, the chip can be secured by programming the
security bits located in the options/security byte in the Flash memory array. These non-volatile bits will
keep the device secured through reset and power-down.
The options/security byte is located at address 0xFF0F (= global address 0x7F_FF0F) in the Flash memory
array. This byte can be erased and programmed like any other Flash location. Two bits of this byte are used
for security (SEC[1:0]). On devices which have a memory page window, the Flash options/security byte
is also available at address 0xBF0F by selecting page 0x3F with the PPAGE register. The contents of this
byte are copied into the Flash security register (FSEC) during a reset sequence.
7
6
5
4
3
2
1
0
0xFF0F KEYEN1 KEYEN0
NV5
NV4
NV3
NV2
SEC1
SEC0
Figure 10-1. Flash Options/Security Byte
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The meaning of the bits KEYEN[1:0] is shown in Table 10-2. Please refer to Section 10.1.5.1,
“Unsecuring the MCU Using the Backdoor Key Access” for more information.
Table 10-2. Backdoor Key Access Enable Bits
Backdoor Key
KEYEN[1:0]
Access Enabled
00
01
10
11
0 (disabled)
0 (disabled)
1 (enabled)
0 (disabled)
The meaning of the security bits SEC[1:0] is shown in Table 10-3. For security reasons, the state of device
security is controlled by two bits. To put the device in unsecured mode, these bits must be programmed to
SEC[1:0] = ‘10’. All other combinations put the device in a secured mode. The recommended value to put
the device in secured state is the inverse of the unsecured state, i.e. SEC[1:0] = ‘01’.
Table 10-3. Security Bits
SEC[1:0]
Security State
00
01
10
11
1 (secured)
1 (secured)
0 (unsecured)
1 (secured)
NOTE
Please refer to the Flash block guide (FTX) for actual security configuration
(in section “Flash Module Security”).
10.1.4 Operation of the Secured Microcontroller
By securing the device, unauthorized access to the EEPROM and Flash memory contents can be prevented.
However, it must be understood that the security of the EEPROM and Flash memory contents also depends
on the design of the application program. For example, if the application has the capability of downloading
code through a serial port and then executing that code (e.g. an application containing bootloader code),
then this capability could potentially be used to read the EEPROM and Flash memory contents even when
the microcontroller is in the secure state. In this example, the security of the application could be enhanced
by requiring a challenge/response authentication before any code can be downloaded.
Secured operation has the following effects on the microcontroller:
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Chapter 10 Security (S12X9SECV2)
10.1.4.1 Normal Single Chip Mode (NS)
•
•
Background debug module (BDM) operation is completely disabled.
Execution of Flash and EEPROM commands is restricted. Please refer to the NVM block guide
(FTX) for details.
•
•
Tracing code execution using the DBG module is disabled.
Debugging XGATE code (breakpoints, single-stepping) is disabled.
10.1.4.2 Special Single Chip Mode (SS)
•
•
•
BDM firmware commands are disabled.
BDM hardware commands are restricted to the register space.
Execution of Flash and EEPROM commands is restricted. Please refer to the NVM block guide
(FTX) for details.
•
•
Tracing code execution using the DBG module is disabled.
Debugging XGATE code (breakpoints, single-stepping) is disabled.
Special single chip mode means BDM is active after reset. The availability of BDM firmware commands
depends on the security state of the device. The BDM secure firmware first performs a blank check of both
the Flash memory and the EEPROM. If the blank check succeeds, security will be temporarily turned off
and the state of the security bits in the appropriate Flash memory location can be changed If the blank
check fails, security will remain active, only the BDM hardware commands will be enabled, and the
accessible memory space is restricted to the peripheral register area. This will allow the BDM to be used
to erase the EEPROM and Flash memory without giving access to their contents. After erasing both Flash
memory and EEPROM, another reset into special single chip mode will cause the blank check to succeed
and the options/security byte can be programmed to “unsecured” state via BDM.
While the BDM is executing the blank check, the BDM interface is completely blocked, which means that
all BDM commands are temporarily blocked.
10.1.4.3 Expanded Modes (NX, ES, EX, and ST)
•
•
•
BDM operation is completely disabled.
Internal Flash memory and EEPROM are disabled.
Execution of Flash and EEPROM commands is restricted. Please refer to the NVM block guide
(FTX) for details.
•
•
•
Tracing code execution using the DBG module is disabled.
Debugging XGATE code (breakpoints, single-stepping) is disabled.
MC9S12XDP512 Data Sheet, Rev. 2.11
502
Freescale Semiconductor
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Chapter 10 Security (S12X9SECV2)
10.1.5 Unsecuring the Microcontroller
Unsecuring the microcontroller can be done by three different methods:
1. Backdoor key access
2. Reprogramming the security bits
3. Complete memory erase (special modes)
10.1.5.1 Unsecuring the MCU Using the Backdoor Key Access
In normal modes (single chip and expanded), security can be temporarily disabled using the backdoor key
access method. This method requires that:
•
The backdoor key at 0xFF00–0xFF07 (= global addresses 0x7F_FF00–0x7F_FF07) has been
programmed to a valid value.
•
•
The KEYEN[1:0] bits within the Flash options/security byte select ‘enabled’.
In single chip mode, the application program programmed into the microcontroller must be
designed to have the capability to write to the backdoor key locations.
The backdoor key values themselves would not normally be stored within the application data, which
means the application program would have to be designed to receive the backdoor key values from an
external source (e.g. through a serial port). It is not possible to download the backdoor keys using
background debug mode.
The backdoor key access method allows debugging of a secured microcontroller without having to erase
the Flash. This is particularly useful for failure analysis.
NOTE
No word of the backdoor key is allowed to have the value 0x0000 or
0xFFFF.
10.1.5.2 Backdoor Key Access Sequence
These are the necessary steps for a successful backdoor key access sequence:
1. Set the KEYACC bit in the Flash configuration register FCNFG.
2. Write the first 16-bit word of the backdoor key to 0xFF00 (0x7F_FF00).
3. Write the second 16-bit word of the backdoor key to 0xFF02 (0x7F_FF02).
4. Write the third 16-bit word of the backdoor key to 0xFF04 (0x7F_FF04).
5. Write the fourth 16-bit word of the backdoor key to 0xFF06 (0x7F_FF06).
6. Clear the KEYACC bit in the Flash Configuration register FCNFG.
NOTE
Flash cannot be read while KEYACC is set. Therefore the code for the
backdoor key access sequence must execute from RAM.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
503
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Chapter 10 Security (S12X9SECV2)
If all four 16-bit words match the Flash contents at 0xFF00–0xFF07 (0x7F_FF00–0x7F_FF07), the
microcontroller will be unsecured and the security bits SEC[1:0] in the Flash Security register FSEC will
be forced to the unsecured state (‘10’). The contents of the Flash options/security byte are not changed by
this procedure, and so the microcontroller will revert to the secure state after the next reset unless further
action is taken as detailed below.
If any of the four 16-bit words does not match the Flash contents at 0xFF00–0xFF07
(0x7F_FF00–0x7F_FF07), the microcontroller will remain secured.
10.1.6 Reprogramming the Security Bits
In normal single chip mode (NS), security can also be disabled by erasing and reprogramming the security
bits within Flash options/security byte to the unsecured value. Because the erase operation will erase the
entire sector from 0xFE00–0xFFFF (0x7F_FE00–0x7F_FFFF), the backdoor key and the interrupt vectors
will also be erased; this method is not recommended for normal single chip mode. The application
software can only erase and program the Flash options/security byte if the Flash sector containing the Flash
options/security byte is not protected (see Flash protection). Thus Flash protection is a useful means of
preventing this method. The microcontroller will enter the unsecured state after the next reset following
the programming of the security bits to the unsecured value.
This method requires that:
•
The application software previously programmed into the microcontroller has been designed to
have the capability to erase and program the Flash options/security byte, or security is first disabled
using the backdoor key method, allowing BDM to be used to issue commands to erase and program
the Flash options/security byte.
•
The Flash sector containing the Flash options/security byte is not protected.
10.1.7 Complete Memory Erase (Special Modes)
The microcontroller can be unsecured in special modes by erasing the entire EEPROM and Flash memory
contents.
When a secure microcontroller is reset into special single chip mode (SS), the BDM firmware verifies
whether the EEPROM and Flash memory are erased. If any EEPROM or Flash memory address is not
erased, only BDM hardware commands are enabled. BDM hardware commands can then be used to write
to the EEPROM and Flash registers to mass erase the EEPROM and all Flash memory blocks.
When next reset into special single chip mode, the BDM firmware will again verify whether all EEPROM
and Flash memory are erased, and this being the case, will enable all BDM commands, allowing the Flash
options/security byte to be programmed to the unsecured value. The security bits SEC[1:0] in the Flash
security register will indicate the unsecure state following the next reset.
MC9S12XDP512 Data Sheet, Rev. 2.11
504
Freescale Semiconductor
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Chapter 10 Security (S12X9SECV2)
Special single chip erase and unsecure sequence:
1. Reset into special single chip mode.
2. Write an appropriate value to the ECLKDIV register for correct timing.
3. Write 0xFF to the EPROT register to disable protection.
4. Write 0x30 to the ESTAT register to clear the PVIOL and ACCERR bits.
5. Write 0x0000 to the EDATA register (0x011A–0x011B).
6. Write 0x0000 to the EADDR register (0x0118–0x0119).
7. Write 0x41 (mass erase) to the ECMD register.
8. Write 0x80 to the ESTAT register to clear CBEIF.
9. Write an appropriate value to the FCLKDIV register for correct timing.
10. Write 0x00 to the FCNFG register to select Flash block 0.
11. Write 0x10 to the FTSTMOD register (0x0102) to set the WRALL bit, so the following writes
affect all Flash blocks.
12. Write 0xFF to the FPROT register to disable protection.
13. Write 0x30 to the FSTAT register to clear the PVIOL and ACCERR bits.
14. Write 0x0000 to the FDATA register (0x010A–0x010B).
15. Write 0x0000 to the FADDR register (0x0108–0x0109).
16. Write 0x41 (mass erase) to the FCMD register.
17. Write 0x80 to the FSTAT register to clear CBEIF.
18. Wait until all CCIF flags are set.
19. Reset back into special single chip mode.
20. Write an appropriate value to the FCLKDIV register for correct timing.
21. Write 0x00 to the FCNFG register to select Flash block 0.
22. Write 0xFF to the FPROT register to disable protection.
23. Write 0xFFBE to Flash address 0xFF0E.
24. Write 0x20 (program) to the FCMD register.
25. Write 0x80 to the FSTAT register to clear CBEIF.
26. Wait until the CCIF flag in FSTAT is are set.
27. Reset into any mode.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
505
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Chapter 10 Security (S12X9SECV2)
MC9S12XDP512 Data Sheet, Rev. 2.11
506
Freescale Semiconductor
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Chapter 11
Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
11.1 Introduction
The HCS12 enhanced capture timer module has the features of the HCS12 standard timer module
enhanced by additional features in order to enlarge the field of applications, in particular for automotive
ABS applications.
This design specification describes the standard timer as well as the additional features.
The basic timer consists of a 16-bit, software-programmable counter driven by a prescaler. This timer can
be used for many purposes, including input waveform measurements while simultaneously generating an
output waveform. Pulse widths can vary from microseconds to many seconds.
A full access for the counter registers or the input capture/output compare registers will take place in one
clock cycle. Accessing high byte and low byte separately for all of these registers will not yield the same
result as accessing them in one word.
11.1.1 Features
•
•
16-bit buffer register for four input capture (IC) channels.
Four 8-bit pulse accumulators with 8-bit buffer registers associated with the four buffered IC
channels. Configurable also as two 16-bit pulse accumulators.
•
•
16-bit modulus down-counter with 8-bit prescaler.
Four user-selectable delay counters for input noise immunity increase.
11.1.2 Modes of Operation
•
•
Stop — Timer and modulus counter are off since clocks are stopped.
Freeze — Timer and modulus counter keep on running, unless the TSFRZ bit in the TSCR1 register
is set to one.
•
•
Wait — Counters keep on running, unless the TSWAI bit in the TSCR1 register is set to one.
Normal — Timer and modulus counter keep on running, unless the TEN bit in the TSCR1 register
or the MCEN bit in the MCCTL register are cleared.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
507
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
11.1.3 Block Diagram
Channel 0
Input Capture
Output Compare
Channel 1
Prescaler
Bus Clock
IOC0
IOC1
16-bit Counter
Input Capture
Modulus Counter
Output Compare
16-Bit Modulus Counter
Interrupt
Channel 2
Input Capture
Timer Overflow
Interrupt
Timer Channel 0
Interrupt
IOC2
IOC3
Output Compare
Channel 3
Input Capture
Output Compare
Registers
Channel 4
Input Capture
IOC4
IOC5
Output Compare
Channel 5
Input Capture
Output Compare
Timer Channel 7
Interrupt
Channel 6
Input Capture
PA Overflow
16-Bit
IOC6
IOC7
Interrupt
Output Compare
Pulse Accumulator A
PA Input
Interrupt
PB Overflow
Channel 7
Input Capture
16-Bit
Pulse Accumulator B
Interrupt
Output Compare
Figure 11-1. ECT Block Diagram
MC9S12XDP512 Data Sheet, Rev. 2.11
508
Freescale Semiconductor
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
11.2 External Signal Description
The ECT module has a total of eight external pins.
11.2.1 IOC7 — Input Capture and Output Compare Channel 7
This pin serves as input capture or output compare for channel 7.
11.2.2 IOC6 — Input Capture and Output Compare Channel 6
This pin serves as input capture or output compare for channel 6.
11.2.3 IOC5 — Input Capture and Output Compare Channel 5
This pin serves as input capture or output compare for channel 5.
11.2.4 IOC4 — Input Capture and Output Compare Channel 4
This pin serves as input capture or output compare for channel 4.
11.2.5 IOC3 — Input Capture and Output Compare Channel 3
This pin serves as input capture or output compare for channel 3.
11.2.6 IOC2 — Input Capture and Output Compare Channel 2
This pin serves as input capture or output compare for channel 2.
11.2.7 IOC1 — Input Capture and Output Compare Channel 1
This pin serves as input capture or output compare for channel 1.
11.2.8 IOC0 — Input Capture and Output Compare Channel 0
This pin serves as input capture or output compare for channel 0.
For the description of interrupts see Section 11.4.3, “Interrupts”.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
509
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
11.3 Memory Map and Register Definition
This section provides a detailed description of all memory and registers.
11.3.1 Module Memory Map
The memory map for the ECT module is given below in Table 11-1. The address listed for each register is
the address offset. The total address for each register is the sum of the base address for the ECT module
and the address offset for each register.
Table 11-1. MC9S12XDP512 Memory Map
Address
Offset
Register
Access
0x0000
0x0001
0x0002
0x0003
0x0004
0x0005
0x0006
0x0007
0x0008
0x0009
0x000A
0x000B
0x000C
0x000D
0x000E
0x000F
0x0010
0x0011
0x0012
0x0013
0x0014
0x0015
0x0016
0x0017
0x0018
0x0019
0x001A
0x001B
0x001C
0x001D
Timer Input Capture/Output Compare Select (TIOS)
Timer Compare Force Register (CFORC)
R/W
1
R/W
Output Compare 7 Mask Register (OC7M)
R/W
R/W
Output Compare 7 Data Register (OC7D)
2
Timer Count Register High (TCNT)
R/W
2
Timer Count Register Low (TCNT)
R/W
Timer System Control Register 1 (TSCR1)
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Timer Toggle Overflow Register (TTOV)
Timer Control Register 1 (TCTL1)
Timer Control Register 2 (TCTL2)
Timer Control Register 3 (TCTL3)
Timer Control Register 4 (TCTL4)
Timer Interrupt Enable Register (TIE)
Timer System Control Register 2 (TSCR2)
Main Timer Interrupt Flag 1 (TFLG1)
Main Timer Interrupt Flag 2 (TFLG2)
3
Timer Input Capture/Output Compare Register 0 High (TC0)
Timer Input Capture/Output Compare Register 0 Low (TC0)
Timer Input Capture/Output Compare Register 1 High (TC1)
Timer Input Capture/Output Compare Register 1 Low (TC1)
Timer Input Capture/Output Compare Register 2 High (TC2)
Timer Input Capture/Output Compare Register 2 Low (TC2)
Timer Input Capture/Output Compare Register 3 High (TC3)
Timer Input Capture/Output Compare Register 3 Low (TC3)
Timer Input Capture/Output Compare Register 4 High (TC4)
Timer Input Capture/Output Compare Register 4 Low (TC4)
Timer Input Capture/Output Compare Register 5 High (TC5)
Timer Input Capture/Output Compare Register 5 Low (TC5)
Timer Input Capture/Output Compare Register 6 High (TC6)
Timer Input Capture/Output Compare Register 6 Low (TC6)
R/W
3
R/W
3
R/W
3
R/W
3
R/W
3
R/W
3
R/W
3
R/W
3
R/W
3
R/W
3
R/W
3
R/W
3
R/W
3
R/W
MC9S12XDP512 Data Sheet, Rev. 2.11
510
Freescale Semiconductor
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
Table 11-1. MC9S12XDP512 Memory Map (continued)
Address
Offset
Register
Access
3
0x001E
0x001F
0x0020
0x0021
0x0022
0x0023
0x0024
0x0025
0x0026
0x0027
0x0028
0x0029
0x002A
0x002B
0x002C
0x002D
0x002E
0x002F
0x0030
0x0031
0x0032
0x0033
0x0034
0x0035
0x0036
0x0037
0x0038
0x0039
0x003A
0x003B
0x003C
0x003D
0x003E
0x003F
Timer Input Capture/Output Compare Register 7 High (TC7)
Timer Input Capture/Output Compare Register 7 Low (TC7)
16-Bit Pulse Accumulator A Control Register (PACTL)
Pulse Accumulator A Flag Register (PAFLG)
R/W
3
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Pulse Accumulator Count Register 3 (PACN3)
Pulse Accumulator Count Register 2 (PACN2)
Pulse Accumulator Count Register 1 (PACN1)
Pulse Accumulator Count Register 0 (PACN0)
16-Bit Modulus Down Counter Register (MCCTL)
16-Bit Modulus Down Counter Flag Register (MCFLG)
Input Control Pulse Accumulator Register (ICPAR)
Delay Counter Control Register (DLYCT)
Input Control Overwrite Register (ICOVW)
4
Input Control System Control Register (ICSYS)
Reserved
R/W
--
2
Timer Test Register (TIMTST)
R/W
Precision Timer Prescaler Select Register (PTPSR)
Precision Timer Modulus Counter Prescaler Select Register (PTMCPSR)
16-Bit Pulse Accumulator B Control Register (PBCTL)
16-Bit Pulse Accumulator B Flag Register (PBFLG)
8-Bit Pulse Accumulator Holding Register 3 (PA3H)
8-Bit Pulse Accumulator Holding Register 2 (PA2H)
8-Bit Pulse Accumulator Holding Register 1 (PA1H)
8-Bit Pulse Accumulator Holding Register 0 (PA0H)
Modulus Down-Counter Count Register High (MCCNT)
Modulus Down-Counter Count Register Low (MCCNT)
Timer Input Capture Holding Register 0 High (TC0H)
Timer Input Capture Holding Register 0 Low (TC0H)
Timer Input Capture Holding Register 1 High(TC1H)
Timer Input Capture Holding Register 1 Low (TC1H)
Timer Input Capture Holding Register 2 High (TC2H)
Timer Input Capture Holding Register 2 Low (TC2H)
Timer Input Capture Holding Register 3 High (TC3H)
Timer Input Capture Holding Register 3 Low (TC3H)
R/W
R/W
R/W
R/W
5
R/W
5
R/W
5
R/W
5
R/W
R/W
R/W
5
R/W
5
R/W
5
R/W
5
R/W
5
R/W
5
R/W
5
R/W
5
R/W
1
2
3
4
5
Always read 0x0000.
Only writable in special modes (test_mode = 1).
Writes to these registers have no meaning or effect during input capture.
May be written once when not in test00mode but writes are always permitted when test00mode is enabled.
Writes have no effect.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
511
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
11.3.2 Register Descriptions
This section consists of register descriptions in address order. Each description includes a standard register
diagram with an associated figure number. Details of register bit and field function follow the register
diagrams, in bit order.
Register
Name
Bit 7
6
5
4
3
2
1
Bit 0
0x0000
TIOS
R
IOS7
IOS6
IOS5
IOS4
IOS3
IOS2
IOS1
IOS0
W
0x0001
CFORC
R
0
0
0
0
0
0
0
0
W
FOC7
FOC6
FOC5
FOC4
FOC3
FOC2
FOC1
FOC0
0x0002
OC7M
R
OC7M7
OC7D7
TCNT15
TCNT7
TEN
OC7M6
OC7D6
TCNT14
TCNT6
TSWAI
TOV6
OC7M5
OC7D5
TCNT13
TCNT5
TSFRZ
TOV5
OC7M4
OC7D4
TCNT12
TCNT4
TFFCA
TOV4
OC7M3
OC7D3
TCNT11
TCNT3
PRNT
TOV3
OC7M2
OC7D2
TCNT10
OC7M1
OC7D1
TCNT9
OC7M0
OC7D0
TCNT8
W
0x0003
OC7D
R
W
0x0004
TCNT (High)
R
W
0x0005
TCNT (Low)
R
TCNT2
0
TCNT1
0
TCNT0
0
W
0x0006
TSCR1
R
W
0x0007
TTOF
R
TOV7
TOV2
OL5
TOV1
OM4
TOV0
OL4
W
0x0008
TCTL1
R
OM7
OL7
OM6
OL6
OM5
W
0x0009
TCTL2
R
OM3
OL3
OM2
OL2
OM1
OL1
OM0
OL0
W
0x000A
TCTL3
R
EDG7B
EDG3B
C7I
EDG7A
EDG3A
C6I
EDG6B
EDG2B
C5I
EDG6A
EDG2A
C4I
EDG5B
EDG1B
C3I
EDG5A
EDG1A
C2I
EDG4B
EDG0B
C1I
EDG4A
EDG0A
C0I
W
0x000B
TCTL4
R
W
0x000C
TIE
R
W
= Unimplemented or Reserved
Figure 11-2. ECT Register Summary (Sheet 1 of 5)
MC9S12XDP512 Data Sheet, Rev. 2.11
512
Freescale Semiconductor
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
Register
Name
Bit 7
6
5
4
3
2
1
Bit 0
0x000D
TSCR2
R
0
0
0
TOI
TCRE
PR2
PR1
PR0
W
0x000E
TFLG1
R
C7F
TOF
C6F
0
C5F
0
C4F
0
C3F
0
C2F
0
C1F
0
C0F
0
W
0x000F
TFLG2
R
W
0x0010
TC0 (High)
R
Bit 15
Bit 7
Bit 14
Bit 6
Bit 13
Bit 5
Bit 12
Bit 4
Bit 11
Bit 3
Bit 10
Bit 2
Bit 9
Bit 1
Bit 9
Bit 1
Bit 9
Bit 1
Bit 9
Bit 1
Bit 9
Bit 1
Bit 9
Bit 1
Bit 8
Bit 0
Bit 8
Bit 0
Bit 8
Bit 0
Bit 8
Bit 0
Bit 8
Bit 0
Bit 8
Bit 0
W
0x0011
TC0 (Low)
R
W
0x0012
TC1 (High)
R
Bit 15
Bit 7
Bit 14
Bit 6
Bit 13
Bit 5
Bit 12
Bit 4
Bit 11
Bit 3
Bit 10
Bit 2
W
0x0013
TC1 (Low)
R
W
0x0014
TC2 (High)
R
Bit 15
Bit 7
Bit 14
Bit 6
Bit 13
Bit 5
Bit 12
Bit 4
Bit 11
Bit 3
Bit 10
Bit 2
W
0x0015
TC2 (Low)
R
W
0x0016
TC3 (High)
R
Bit 15
Bit 7
Bit 14
Bit 6
Bit 13
Bit 5
Bit 12
Bit 4
Bit 11
Bit 3
Bit 10
Bit 2
W
0x0017
TC3 (Low)
R
W
0x0018
TC4 (High)
R
Bit 15
Bit 7
Bit 14
Bit 6
Bit 13
Bit 5
Bit 12
Bit 4
Bit 11
Bit 3
Bit 10
Bit 2
W
0x0019
TC4 (Low)
R
W
0x001A
TC5 (High)
R
Bit 15
Bit 7
Bit 14
Bit 6
Bit 13
Bit 5
Bit 12
Bit 4
Bit 11
Bit 3
Bit 10
Bit 2
W
0x001B
TC5 (Low)
R
W
= Unimplemented or Reserved
Figure 11-2. ECT Register Summary (Sheet 2 of 5)
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
513
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
Register
Bit 7
6
5
4
3
2
1
Bit 0
Name
0x001C
TC6 (High)
R
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
W
0x001D
TC6 (Low)
R
Bit 7
Bit 6
Bit 14
Bit 6
Bit 5
Bit 13
Bit 5
Bit 4
Bit 12
Bit 4
Bit 3
Bit 11
Bit 3
Bit 2
Bit 10
Bit 2
Bit 1
Bit 9
Bit 0
Bit 8
Bit 0
PAI
W
0x001E
TC7 (High)
R
Bit 15
W
0x001F
TC7 (Low)
R
Bit 7
0
Bit 1
W
0x0020
PACTL
R
PAEN
0
PAMOD
0
PEDGE
0
CLK1
0
CLK0
0
PA0VI
PA0VF
W
0x0021
PAFLG
R
0
PAIF
W
0x0022
PACN3
R
PACNT7(15) PACNT6(14) PACNT5(13) PACNT4(12) PACNT3(11) PACNT2(10) PACNT1(9) PACNT0(8)
W
0x0023
PACN2
R
PACNT7
PACNT6
PACNT5
PACNT4
PACNT3
PACNT2
PACNT1
PACNT0
W
0x0024
PACN1
R
PACNT7(15) PACNT6(14) PACNT5(13) PACNT4(12) PACNT3(11) PACNT2(10) PACNT1(9) PACNT0(8)
W
0x0025
PACN0
R
PACNT7
MCZI
PACNT6
PACNT5
PACNT4
PACNT3
PACNT2
PACNT1
PACNT0
W
0x0026
MCCTL
R
0
0
MODMC
0
RDMCL
0
MCEN
POLF2
MCPR1
POLF1
MCPR0
POLF0
W
ICLAT
FLMC
0x0027
MCFLG
R
0
0
POLF3
MCZF
0
W
0x0028
ICPAR
R
0
0
PA3EN
DLY3
PA2EN
DLY2
PA1EN
DLY1
PA0EN
DLY0
W
0x0029
DLYCT
R
DLY7
DLY6
DLY5
DLY4
W
0x002A
ICOVW
R
NOVW7
NOVW6
NOVW5
NOVW4
NOVW3
NOVW2
NOVW1
NOVW0
W
= Unimplemented or Reserved
Figure 11-2. ECT Register Summary (Sheet 3 of 5)
MC9S12XDP512 Data Sheet, Rev. 2.11
514
Freescale Semiconductor
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
Register
Name
Bit 7
6
5
4
3
2
1
Bit 0
0x002B
ICSYS
R
SH37
SH26
SH15
SH04
TFMOD
PACMX
BUFEN
LATQ
W
0x002C
Reserved
R
Reserved
W
0x002D
TIMTST
R
Timer Test Register
W
0x002E
PTPSR
R
PTPS7
PTPS6
PTPS5
PTPS4
PTPS3
PTPS2
PTPS1
PTMPS1
PBOVI
PTPS0
W
0x002F
PTMCPSR
R
PTMPS7
0
PTMPS6
PTMPS5
0
PTMPS4
0
PTMPS3
0
PTMPS2
0
PTMPS0
0
W
0x0030
PBCTL
R
PBEN
0
W
0x0031
PBFLG
R
0
0
0
0
0
0
PBOVF
PA3H1
W
0x0032
PA3H
R
PA3H7
PA2H7
PA1H7
PA0H7
PA3H6
PA2H6
PA1H6
PA0H6
PA3H5
PA2H5
PA1H5
PA0H5
PA3H4
PA2H4
PA1H4
PA0H4
PA3H3
PA2H3
PA1H3
PA0H3
PA3H2
PA2H2
PA1H2
PA0H2
PA3H0
PA2H0
PA1H0
PA0H0
W
0x0033
PA2H
R
PA2H1
PA1H1
PA0H1
W
0x0034
PA1H
R
W
0x0035
PA0H
R
W
0x0036
MCCNT
(High)
R
MCCNT15 MCCNT14 MCCNT13 MCCNT12 MCCNT11 MCCNT10
MCCNT9
MCCNT8
W
0x0037
MCCNT
(Low)
R
MCCNT7
TC15
MCCNT6
TC14
MCCNT5
TC13
MCCNT4
TC12
MCCNT3
TC11
MCCNT2
TC10
MCCNT1
TC9
MCCNT9
TC8
W
0x0038
R
TC0H (High)
W
0x0039
R
TC7
TC6
TC5
TC4
TC3
TC2
TC1
TC0
TC0H (Low)
= Unimplemented or Reserved
Figure 11-2. ECT Register Summary (Sheet 4 of 5)
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
515
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
Register
Bit 7
6
5
4
3
2
1
Bit 0
Name
0x003A
R
TC15
TC14
TC13
TC12
TC11
TC10
TC9
TC8
TC1H (High)
W
0x003B
TC1H (Low)
R
TC7
TC15
TC7
TC6
TC14
TC6
TC5
TC13
TC5
TC4
TC12
TC4
TC3
TC11
TC3
TC2
TC10
TC2
TC1
TC9
TC1
TC9
TC1
TC0
TC8
TC0
TC8
TC0
W
0x003C
TC2H (High)
R
W
0x003D
TC2H (Low)
R
W
0x003E
TC3H (High)
R
TC15
TC7
TC14
TC6
TC13
TC5
TC12
TC4
TC11
TC3
TC10
TC2
W
0x003F
R
TC3H (Low)
W
= Unimplemented or Reserved
Figure 11-2. ECT Register Summary (Sheet 5 of 5)
11.3.2.1 Timer Input Capture/Output Compare Select Register (TIOS)
Module Base + 0x0000
7
6
5
4
3
2
1
0
R
W
IOS7
IOS6
IOS5
IOS4
IOS3
IOS2
IOS1
IOS0
Reset
0
0
0
0
0
0
0
0
Figure 11-3. Timer Input Capture/Output Compare Register (TIOS)
Read or write: Anytime
All bits reset to zero.
Table 11-2. TIOS Field Descriptions
Description
Field
7:0
IOS[7:0]
Input Capture or Output Compare Channel Configuration
0 The corresponding channel acts as an input capture.
1 The corresponding channel acts as an output compare.
MC9S12XDP512 Data Sheet, Rev. 2.11
516
Freescale Semiconductor
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
11.3.2.2 Timer Compare Force Register (CFORC)
Module Base + 0x0001
7
6
5
4
3
2
1
0
R
W
0
FOC7
0
0
0
0
0
0
0
0
FOC6
0
FOC5
0
FOC4
0
FOC3
0
FOC2
0
FOC1
0
FOC0
0
Reset
Figure 11-4. Timer Compare Force Register (CFORC)
Read or write: Anytime but reads will always return 0x0000 (1 state is transient).
All bits reset to zero.
Table 11-3. CFORC Field Descriptions
Field
Description
7:0
FOC[7:0]
Force Output Compare Action for Channel 7:0 — A write to this register with the corresponding data bit(s) set
causes the action which is programmed for output compare “x” to occur immediately. The action taken is the
same as if a successful comparison had just taken place with the TCx register except the interrupt flag does not
get set.
Note: A successful channel 7 output compare overrides any channel 6:0 compares. If a forced output compare
on any channel occurs at the same time as the successful output compare, then the forced output compare
action will take precedence and the interrupt flag will not get set.
11.3.2.3 Output Compare 7 Mask Register (OC7M)
Module Base + 0x0002
7
6
5
4
3
2
1
0
R
W
OC7M7
OC7M6
OC7M5
OC7M4
OC7M3
OC7M2
OC7M1
OC7M0
Reset
0
0
0
0
0
0
0
0
Figure 11-5. Output Compare 7 Mask Register (OC7M)
Read or write: Anytime
All bits reset to zero.
Table 11-4. OC7M Field Descriptions
Description
Field
7:0
Output Compare Mask Action for Channel 7:0
OC7M[7:0] 0 The corresponding OC7Dx bit in the output compare 7 data register will not be transferred to the timer port on
a successful channel 7 output compare, even if the corresponding pin is setup for output compare.
1 The corresponding OC7Dx bit in the output compare 7 data register will be transferred to the timer port on a
successful channel 7 output compare.
Note: The corresponding channel must also be setup for output compare (IOSx = 1) for data to be transferred
from the output compare 7 data register to the timer port.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
517
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
11.3.2.4 Output Compare 7 Data Register (OC7D)
Module Base + 0x0003
7
6
5
4
3
2
1
0
R
W
OC7D7
OC7D6
OC7D5
OC7D4
OC7D3
OC7D2
OC7D1
OC7D0
Reset
0
0
0
0
0
0
0
0
Figure 11-6. Output Compare 7 Data Register (OC7D)
Read or write: Anytime
All bits reset to zero.
Table 11-5. OC7D Field Descriptions
Description
Field
7:0
Output Compare 7 Data Bits — A channel 7 output compare can cause bits in the output compare 7 data
OC7D[7:0] register to transfer to the timer port data register depending on the output compare 7 mask register.
MC9S12XDP512 Data Sheet, Rev. 2.11
518
Freescale Semiconductor
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
11.3.2.5 Timer Count Register (TCNT)
Module Base + 0x0004
15
14
13
12
11
10
9
8
R
W
TCNT15
TCNT14
TCNT13
TCNT12
TCNT11
TCNT10
TCNT9
TCNT8
Reset
0
0
0
0
0
0
0
0
Figure 11-7. Timer Count Register High (TCNT)
Module Base + 0x0005
7
6
5
4
3
2
1
0
R
TCNT7
W
TCNT6
TCNT5
TCNT4
TCNT3
TCNT2
TCNT1
TCNT0
Reset
0
0
0
0
0
0
0
0
Figure 11-8. Timer Count Register Low (TCNT)
Read: Anytime
Write: Has no meaning or effect
All bits reset to zero.
Table 11-6. TCNT Field Descriptions
Description
Field
15:0
Timer Counter Bits — The 16-bit main timer is an up counter. A read to this register will return the current value
TCNT[15:0] of the counter. Access to the counter register will take place in one clock cycle.
Note: A separate read/write for high byte and low byte in test mode will give a different result than accessing
them as a word. The period of the first count after a write to the TCNT registers may be a different size
because the write is not synchronized with the prescaler clock.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
519
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
11.3.2.6 Timer System Control Register 1 (TSCR1)
Module Base + 0x0006
7
6
5
4
3
2
1
0
R
W
0
0
0
TEN
TSWAI
TSFRZ
TFFCA
PRNT
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 11-9. Timer System Control Register 1 (TSCR1)
Read or write: Anytime except PRNT bit is write once
All bits reset to zero.
Table 11-7. TSCR1 Field Descriptions
Field
Description
7
Timer Enable
TEN
0 Disables the main timer, including the counter. Can be used for reducing power consumption.
1 Allows the timer to function normally.
Note: If for any reason the timer is not active, there is no ÷64 clock for the pulse accumulator since the ÷64 is
generated by the timer prescaler.
6
Timer Module Stops While in Wait
TSWAI
0 Allows the timer module to continue running during wait.
1 Disables the timer counter, pulse accumulators and modulus down counter when the MCU is in wait mode.
Timer interrupts cannot be used to get the MCU out of wait.
5
Timer and Modulus Counter Stop While in Freeze Mode
TSFRZ
0 Allows the timer and modulus counter to continue running while in freeze mode.
1 Disables the timer and modulus counter whenever the MCU is in freeze mode. This is useful for emulation.
The pulse accumulators do not stop in freeze mode.
4
Timer Fast Flag Clear All
TFFCA
0 Allows the timer flag clearing to function normally.
1 A read from an input capture or a write to the output compare channel registers causes the corresponding
channel flag, CxF, to be cleared in the TFLG1 register. Any access to the TCNT register clears the TOF flag
in the TFLG2 register. Any access to the PACN3 and PACN2 registers clears the PAOVF and PAIF flags in the
PAFLG register. Any access to the PACN1 and PACN0 registers clears the PBOVF flag in the PBFLG register.
Any access to the MCCNT register clears the MCZF flag in the MCFLG register. This has the advantage of
eliminating software overhead in a separate clear sequence. Extra care is required to avoid accidental flag
clearing due to unintended accesses.
Note: The flags cannot be cleared via the normal flag clearing mechanism (writing a one to the flag) when
TFFCA = 1.
3
Precision Timer
PRNT
0 Enables legacy timer. Only bits DLY0 and DLY1 of the DLYCT register are used for the delay selection of the
delay counter. PR0, PR1, and PR2 bits of the TSCR2 register are used for timer counter prescaler selection.
MCPR0 and MCPR1 bits of the MCCTL register are used for modulus down counter prescaler selection.
1 Enables precision timer. All bits in the DLYCT register are used for the delay selection, all bits of the PTPSR
register are used for Precision Timer Prescaler Selection, and all bits of PTMCPSR register are used for the
prescaler Precision Timer Modulus Counter Prescaler selection.
MC9S12XDP512 Data Sheet, Rev. 2.11
520
Freescale Semiconductor
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
11.3.2.7 Timer Toggle On Overflow Register 1 (TTOV)
Module Base + 0x0007
7
6
5
4
3
2
1
0
R
TOV7
W
TOV6
TOV5
TOV4
TOV3
TOV2
TOV1
TOV0
Reset
0
0
0
0
0
0
0
0
Figure 11-10. Timer Toggle On Overflow Register 1 (TTOV)
Read or write: Anytime
All bits reset to zero.
Table 11-8. TTOV Field Descriptions
Description
Field
7:0
TOV[7:0]
Toggle On Overflow Bits — TOV97:0] toggles output compare pin on timer counter overflow. This feature only
takes effect when in output compare mode. When set, it takes precedence over forced output compare but not
channel 7 override events.
0 Toggle output compare pin on overflow feature disabled.
1 Toggle output compare pin on overflow feature enabled.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
521
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
11.3.2.8 Timer Control Register 1/Timer Control Register 2 (TCTL1/TCTL2)
Module Base + 0x0008
7
6
5
4
3
2
1
0
R
W
OM7
OL7
OM6
OL6
OM5
OL5
OM4
OL4
Reset
0
0
0
0
0
0
0
0
Figure 11-11. Timer Control Register 1 (TCTL1)
Module Base + 0x0009
7
6
5
4
3
2
1
0
R
OM3
W
OL3
OM2
OL2
OM1
OL1
OM0
OL0
Reset
0
0
0
0
0
0
0
0
Figure 11-12. Timer Control Register 2 (TCTL2)
Read or write: Anytime
All bits reset to zero.
Table 11-9. TCTL1/TCTL2 Field Descriptions
Description
Field
OM[7:0]
7, 5, 3, 1
OMx — Output Mode
OLx — Output Level
These eight pairs of control bits are encoded to specify the output action to be taken as a result of a successful
OCx compare. When either OMx or OLx is one, the pin associated with OCx becomes an output tied to OCx.
See Table 11-10.
OL[7:0]
6, 4, 2, 0
Table 11-10. Compare Result Output Action
OMx
OLx
Action
0
0
1
1
0
1
0
1
Timer disconnected from output pin logic
Toggle OCx output line
Clear OCx output line to zero
Set OCx output line to one
NOTE
To enable output action by OMx and OLx bits on timer port, the
corresponding bit in OC7M should be cleared.
MC9S12XDP512 Data Sheet, Rev. 2.11
522
Freescale Semiconductor
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
11.3.2.9 Timer Control Register 3/Timer Control Register 4 (TCTL3/TCTL4)
Module Base + 0x000A
7
6
5
4
3
2
1
0
R
W
EDG7B
EDG7A
EDG6B
EDG6A
EDG5B
EDG5A
EDG4B
EDG4A
Reset
0
0
0
0
0
0
0
0
Figure 11-13. Timer Control Register 3 (TCTL3)
Module Base + 0x000B
7
6
5
4
3
2
1
0
R
EDG3B
W
EDG3A
EDG2B
EDG2A
EDG1B
EDG1A
EDG0B
EDG0A
Reset
0
0
0
0
0
0
0
0
Figure 11-14. Timer Control Register 4 (TCTL4)
Read or write: Anytime
All bits reset to zero.
Table 11-11. TCTL3/TCTL4 Field Descriptions
Description
Field
EDG[7:0]B Input Capture Edge Control — These eight pairs of control bits configure the input capture edge detector
7, 5, 3, 1
circuits for each input capture channel. The four pairs of control bits in TCTL4 also configure the input capture
edge control for the four 8-bit pulse accumulators PAC0–PAC3.EDG0B and EDG0A in TCTL4 also determine the
active edge for the 16-bit pulse accumulator PACB. See Table 11-12.
EDG[7:0]A
6, 4, 2, 0
Table 11-12. Edge Detector Circuit Configuration
EDGxB
EDGxA
Configuration
Capture disabled
0
0
1
1
0
1
0
1
Capture on rising edges only
Capture on falling edges only
Capture on any edge (rising or falling)
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
523
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
11.3.2.10 Timer Interrupt Enable Register (TIE)
Module Base + 0x000C
7
6
5
4
3
2
1
0
R
W
C7I
C6I
C5I
C4I
C3I
C2I
C1I
C0I
Reset
0
0
0
0
0
0
0
0
Figure 11-15. Timer Interrupt Enable Register (TIE)
Read or write: Anytime
All bits reset to zero.
The bits C7I–C0I correspond bit-for-bit with the flags in the TFLG1 status register.
Table 11-13. TIE Field Descriptions
Field
Description
Input Capture/Output Compare “x” Interrupt Enable
7:0
C[7:0]I
0 The corresponding flag is disabled from causing a hardware interrupt.
1 The corresponding flag is enabled to cause an interrupt.
MC9S12XDP512 Data Sheet, Rev. 2.11
524
Freescale Semiconductor
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
11.3.2.11 Timer System Control Register 2 (TSCR2)
Module Base + 0x000D
7
6
5
4
3
2
1
0
R
0
0
0
TOI
W
TCRE
PR2
PR1
PR0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 11-16. Timer System Control Register 2 (TSCR2)
Read or write: Anytime
All bits reset to zero.
Table 11-14. TSCR2 Field Descriptions
Description
Field
7
TOI
Timer Overflow Interrupt Enable
0 Timer overflow interrupt disabled.
1 Hardware interrupt requested when TOF flag set.
3
Timer Counter Reset Enable — This bit allows the timer counter to be reset by a successful channel 7 output
compare. This mode of operation is similar to an up-counting modulus counter.
0 Counter reset disabled and counter free runs.
TCRE
1 Counter reset by a successful output compare on channel 7.
Note: If register TC7 = 0x0000 and TCRE = 1, then the TCNT register will stay at 0x0000 continuously. If register
TC7 = 0xFFFF and TCRE = 1, the TOF flag will never be set when TCNT is reset from 0xFFFF to 0x0000.
2:0
PR[2:0]
Timer Prescaler Select — These three bits specify the division rate of the main Timer prescaler when the PRNT
bit of register TSCR1 is set to 0. The newly selected prescale factor will not take effect until the next synchronized
edge where all prescale counter stages equal zero. See Table 11-15.
Table 11-15. Prescaler Selection
PR2
PR1
PR0
Prescale Factor
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
1
2
4
8
16
32
64
128
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
525
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
11.3.2.12 Main Timer Interrupt Flag 1 (TFLG1)
Module Base + 0x000E
7
6
5
4
3
2
1
0
R
W
C7F
C6F
C5F
C4F
C3F
C2F
C1F
C0F
Reset
0
0
0
0
0
0
0
0
Figure 11-17. Main Timer Interrupt Flag 1 (TFLG1)
Read: Anytime
Write used in the flag clearing mechanism. Writing a one to the flag clears the flag. Writing a zero will not
affect the current status of the bit.
NOTE
mechanism (writing a one to the flag). Reference Section 11.3.2.6, “Timer
System Control Register 1 (TSCR1)”.
All bits reset to zero.
clearing mechanism (writing a one to the flag) or via the fast flag clearing mechanism (reference TFFCA
bit in Section 11.3.2.6, “Timer System Control Register 1 (TSCR1)”).
Use of the TFMOD bit in the ICSYS register in conjunction with the use of the ICOVW register allows a
timer interrupt to be generated after capturing two values in the capture and holding registers, instead of
generating an interrupt for every capture.
Table 11-16. TFLG1 Field Descriptions
Field
Description
7:0
C[7:0]F
Input Capture/Output Compare Channel “x” Flag — A CxF flag is set when a corresponding input capture or
output compare is detected. C0F can also be set by 16-bit Pulse Accumulator B (PACB). C3F–C0F can also be
set by 8-bit pulse accumulators PAC3–PAC0.
If the delay counter is enabled, the CxF flag will not be set until after the delay.
MC9S12XDP512 Data Sheet, Rev. 2.11
526
Freescale Semiconductor
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
11.3.2.13 Main Timer Interrupt Flag 2 (TFLG2)
Module Base + 0x000F
7
6
5
4
3
2
1
0
R
0
0
0
0
0
0
0
TOF
W
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 11-18. Main Timer Interrupt Flag 2 (TFLG2)
Read: Anytime
Write used in the flag clearing mechanism. Writing a one to the flag clears the flag. Writing a zero will not
affect the current status of the bit.
NOTE
mechanism (writing a one to the flag). Reference Section 11.3.2.6, “Timer
System Control Register 1 (TSCR1)”.
All bits reset to zero.
clearing mechanism (writing a one to the flag) or via the fast flag clearing mechanism (Reference TFFCA
bit in Section 11.3.2.6, “Timer System Control Register 1 (TSCR1)”).
Table 11-17. TFLG2 Field Descriptions
Field
Description
7
Timer Overflow Flag — Set when 16-bit free-running timer overflows from 0xFFFF to 0x0000.
TOF
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
527
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
11.3.2.14 Timer Input Capture/Output Compare Registers 0–7
Module Base + 0x0010
15
14
13
12
11
10
9
8
R
W
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Reset
0
0
0
0
0
0
0
0
Figure 11-19. Timer Input Capture/Output Compare Register 0 High (TC0)
Module Base + 0x0011
7
6
5
4
3
2
1
0
R
Bit 7
W
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset
0
0
0
0
0
0
0
0
Figure 11-20. Timer Input Capture/Output Compare Register 0 Low (TC0)
Module Base + 0x0012
15
14
13
12
11
10
9
8
R
Bit 15
W
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Reset
0
0
0
0
0
0
0
0
Figure 11-21. Timer Input Capture/Output Compare Register 1 High (TC1)
Module Base + 0x0013
7
6
5
4
3
2
1
0
R
Bit 7
W
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset
0
0
0
0
0
0
0
0
Figure 11-22. Timer Input Capture/Output Compare Register 1 Low (TC1)
Module Base + 0x0014
15
14
13
12
11
10
9
8
R
Bit 15
W
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Reset
0
0
0
0
0
0
0
0
Figure 11-23. Timer Input Capture/Output Compare Register 2 High (TC2)
Module Base + 0x0015
7
6
5
4
3
2
1
0
R
Bit 7
W
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset
0
0
0
0
0
0
0
0
Figure 11-24. Timer Input Capture/Output Compare Register 2 Low (TC2)
MC9S12XDP512 Data Sheet, Rev. 2.11
528
Freescale Semiconductor
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
Module Base + 0x0016
15
14
13
12
11
10
9
8
R
Bit 15
W
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Reset
0
0
0
0
0
0
0
0
Figure 11-25. Timer Input Capture/Output Compare Register 3 High (TC3)
Module Base + 0x0017
7
6
5
4
3
2
1
0
R
Bit 7
W
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset
0
0
0
0
0
0
0
0
Figure 11-26. Timer Input Capture/Output Compare Register 3 Low (TC3)
Module Base + 0x0018
15
14
13
12
11
10
9
8
R
Bit 15
W
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Reset
0
0
0
0
0
0
0
0
Figure 11-27. Timer Input Capture/Output Compare Register 4 High (TC4)
Module Base + 0x0019
7
6
5
4
3
2
1
0
R
Bit 7
W
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset
0
0
0
0
0
0
0
0
Figure 11-28. Timer Input Capture/Output Compare Register 4 Low (TC4)
Module Base + 0x001A
15
14
13
12
11
10
9
8
R
Bit 15
W
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Reset
0
0
0
0
0
0
0
0
Figure 11-29. Timer Input Capture/Output Compare Register 5 High (TC5)
Module Base + 0x001B
7
6
5
4
3
2
1
0
R
Bit 7
W
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset
0
0
0
0
0
0
0
0
Figure 11-30. Timer Input Capture/Output Compare Register 5 Low (TC5)
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
529
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
Module Base + 0x001C
15
14
13
12
11
10
9
8
R
W
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Reset
0
0
0
0
0
0
0
0
Figure 11-31. Timer Input Capture/Output Compare Register 6 High (TC6)
Module Base + 0x001D
7
6
5
4
3
2
1
0
R
Bit 7
W
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset
0
0
0
0
0
0
0
0
Figure 11-32. Timer Input Capture/Output Compare Register 6 Low (TC6)
Module Base + 0x001E
15
14
13
12
11
10
9
8
R
Bit 15
W
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Reset
0
0
0
0
0
0
0
0
Figure 11-33. Timer Input Capture/Output Compare Register 7 High (TC7)
Module Base + 0x001F
7
6
5
4
3
2
1
0
R
Bit 7
W
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset
0
0
0
0
0
0
0
0
Figure 11-34. Timer Input Capture/Output Compare Register 7 Low (TC7)
Read: Anytime
Write anytime for output compare function. Writes to these registers have no meaning or effect during
input capture.
All bits reset to zero.
Depending on the TIOS bit for the corresponding channel, these registers are used to latch the value of the
free-running counter when a defined transition is sensed by the corresponding input capture edge detector
or to trigger an output action for output compare.
MC9S12XDP512 Data Sheet, Rev. 2.11
530
Freescale Semiconductor
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
11.3.2.15 16-Bit Pulse Accumulator A Control Register (PACTL)
Module Base + 0x0020
7
6
5
4
3
2
1
0
R
W
0
0
PAEN
PAMOD
PEDGE
CLK1
CLK0
PAOVI
PAI
Reset
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 11-35. 16-Bit Pulse Accumulator Control Register (PACTL)
Read: Anytime
Write: Anytime
All bits reset to zero.
Table 11-18. PACTL Field Descriptions
Description
Field
6
Pulse Accumulator A System Enable — PAEN is independent from TEN. With timer disabled, the pulse
accumulator can still function unless pulse accumulator is disabled.
PAEN
0 16-Bit Pulse Accumulator A system disabled. 8-bit PAC3 and PAC2 can be enabled when their related enable
bits in ICPAR are set. Pulse Accumulator Input Edge Flag (PAIF) function is disabled.
1 16-Bit Pulse Accumulator A system enabled. The two 8-bit pulse accumulators PAC3 and PAC2 are cascaded
to form the PACA 16-bit pulse accumulator. When PACA in enabled, the PACN3 and PACN2 registers contents
are respectively the high and low byte of the PACA. PA3EN and PA2EN control bits in ICPAR have no effect.
Pulse Accumulator Input Edge Flag (PAIF) function is enabled. The PACA shares the input pin with IC7.
5
Pulse Accumulator Mode — This bit is active only when the Pulse Accumulator A is enabled (PAEN = 1).
PAMOD
0 Event counter mode
4
Pulse Accumulator Edge Control — This bit is active only when the Pulse Accumulator A is enabled
PEDGE
(PAEN = 1). Refer to Table 11-19.
For PAMOD bit = 0 (event counter mode).
0 Falling edges on PT7 pin cause the count to be incremented
1 Rising edges on PT7 pin cause the count to be incremented
For PAMOD bit = 1 (gated time accumulation mode).
0 PT7 input pin high enables bus clock divided by 64 to Pulse Accumulator and the trailing falling edge on PT7
sets the PAIF flag.
1 PT7 input pin low enables bus clock divided by 64 to Pulse Accumulator and the trailing rising edge on PT7
sets the PAIF flag.
If the timer is not active (TEN = 0 in TSCR1), there is no divide-by-64 since the ÷64 clock is generated by the
timer prescaler.
3:2
Clock Select Bits — For the description of PACLK please refer to Figure 11-70.
CLK[1:0]
If the pulse accumulator is disabled (PAEN = 0), the prescaler clock from the timer is always used as an input
clock to the timer counter. The change from one selected clock to the other happens immediately after these bits
are written. Refer to Table 11-20.
2
Pulse Accumulator A Overflow Interrupt Enable
0 Interrupt inhibited
PAOVI
1 Interrupt requested if PAOVF is set
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
531
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
Table 11-18. PACTL Field Descriptions (continued)
Field
Description
0
PAI
Pulse Accumulator Input Interrupt Enable
0 Interrupt inhibited
1 Interrupt requested if PAIF is set
.
Table 11-19. Pin Action
PAMOD
PEDGE
Pin Action
0
0
1
1
0
1
0
1
Falling edge
Rising edge
Divide by 64 clock enabled with pin high level
Divide by 64 clock enabled with pin low level
Table 11-20. Clock Selection
Clock Source
CLK1
CLK0
0
0
1
1
0
1
0
1
Use timer prescaler clock as timer counter clock
Use PACLK as input to timer counter clock
Use PACLK/256 as timer counter clock frequency
Use PACLK/65536 as timer counter clock frequency
11.3.2.16 Pulse Accumulator A Flag Register (PAFLG)
Module Base + 0x0021
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
PAOVF
PAIF
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 11-36. Pulse Accumulator A Flag Register (PAFLG)
Read: Anytime
Write used in the flag clearing mechanism. Writing a one to the flag clears the flag. Writing a zero will not
affect the current status of the bit.
NOTE
mechanism (writing a one to the flag). Reference Section 11.3.2.6, “Timer
System Control Register 1 (TSCR1)”.
All bits reset to zero.
MC9S12XDP512 Data Sheet, Rev. 2.11
532
Freescale Semiconductor
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
clearing mechanism (writing a one to the flag) or via the fast flag clearing mechanism (Reference TFFCA
bit in Section 11.3.2.6, “Timer System Control Register 1 (TSCR1)”).
Table 11-21. PAFLG Field Descriptions
Field
Description
1
Pulse Accumulator A Overflow Flag — Set when the 16-bit pulse accumulator A overflows from 0xFFFF to
PAOVF
0x0000, or when 8-bit pulse accumulator 3 (PAC3) overflows from 0x00FF to 0x0000.
When PACMX = 1, PAOVF bit can also be set if 8-bit pulse accumulator 3 (PAC3) reaches 0x00FF followed by
an active edge on PT3.
0
PAIF
Pulse Accumulator Input edge Flag — Set when the selected edge is detected at the PT7 input pin. In event
mode the event edge triggers PAIF and in gated time accumulation mode the trailing edge of the gate signal at
the PT7 input pin triggers PAIF.
11.3.2.17 Pulse Accumulators Count Registers (PACN3 and PACN2)
Module Base + 0x0022
7
6
5
4
3
2
1
0
R
W
PACNT7(15) PACNT6(14) PACNT5(13) PACNT4(12) PACNT3(11) PACNT2(10) PACNT1(9) PACNT0(8)
Reset
0
0
0
0
0
0
0
0
Figure 11-37. Pulse Accumulators Count Register 3 (PACN3)
Module Base + 0x0023
7
6
5
4
3
2
1
0
R
PACNT7
W
PACNT6
PACNT5
PACNT4
PACNT3
PACNT2
PACNT1
PACNT0
Reset
0
0
0
0
0
0
0
0
Figure 11-38. Pulse Accumulators Count Register 2 (PACN2)
Read: Anytime
Write: Anytime
All bits reset to zero.
The two 8-bit pulse accumulators PAC3 and PAC2 are cascaded to form the PACA 16-bit pulse
accumulator. When PACA in enabled (PAEN = 1 in PACTL), the PACN3 and PACN2 registers contents
are respectively the high and low byte of the PACA.
When PACN3 overflows from 0x00FF to 0x0000, the interrupt flag PAOVF in PAFLG is set.
Full count register access will take place in one clock cycle.
NOTE
A separate read/write for high byte and low byte will give a different result
than accessing them as a word.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
533
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
When clocking pulse and write to the registers occurs simultaneously, write
takes priority and the register is not incremented.
11.3.2.18 Pulse Accumulators Count Registers (PACN1 and PACN0)
Module Base + 0x0024
7
6
5
4
3
2
1
0
R
W
PACNT7(15) PACNT6(14) PACNT5(13) PACNT4(12) PACNT3(11) PACNT2(10) PACNT1(9) PACNT0(8)
Reset
0
0
0
0
0
0
0
0
Figure 11-39. Pulse Accumulators Count Register 1 (PACN1)
Module Base + 0x0025
7
6
5
4
3
2
1
0
R
PACNT7
W
PACNT6
PACNT5
PACNT4
PACNT3
PACNT2
PACNT1
PACNT0
Reset
0
0
0
0
0
0
0
0
Figure 11-40. Pulse Accumulators Count Register 0 (PACN0)
Read: Anytime
Write: Anytime
All bits reset to zero.
The two 8-bit pulse accumulators PAC1 and PAC0 are cascaded to form the PACB 16-bit pulse
accumulator. When PACB in enabled, (PBEN = 1 in PBCTL) the PACN1 and PACN0 registers contents
are respectively the high and low byte of the PACB.
When PACN1 overflows from 0x00FF to 0x0000, the interrupt flag PBOVF in PBFLG is set.
Full count register access will take place in one clock cycle.
NOTE
A separate read/write for high byte and low byte will give a different result
than accessing them as a word.
When clocking pulse and write to the registers occurs simultaneously, write
takes priority and the register is not incremented.
MC9S12XDP512 Data Sheet, Rev. 2.11
534
Freescale Semiconductor
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
11.3.2.19 16-Bit Modulus Down-Counter Control Register (MCCTL)
Module Base + 0x0026
7
6
5
4
3
2
1
0
R
0
0
MCZI
W
MODMC
RDMCL
MCEN
MCPR1
MCPR0
ICLAT
0
FLMC
0
Reset
0
0
0
0
0
0
Figure 11-41. 16-Bit Modulus Down-Counter Control Register (MCCTL)
Read: Anytime
Write: Anytime
All bits reset to zero.
Table 11-22. MCCTL Field Descriptions
Description
Field
7
Modulus Counter Underflow Interrupt Enable
0 Modulus counter interrupt is disabled.
MCZI
1 Modulus counter interrupt is enabled.
6
Modulus Mode Enable
MODMC
0 The modulus counter counts down from the value written to it and will stop at 0x0000.
1 Modulus mode is enabled. When the modulus counter reaches 0x0000, the counter is loaded with the latest
value written to the modulus count register.
Note: For proper operation, the MCEN bit should be cleared before modifying the MODMC bit in order to reset
the modulus counter to 0xFFFF.
5
Read Modulus Down-Counter Load
RDMCL
0 Reads of the modulus count register (MCCNT) will return the present value of the count register.
1 Reads of the modulus count register (MCCNT) will return the contents of the load register.
4
Input Capture Force Latch Action — When input capture latch mode is enabled (LATQ and BUFEN bit in
ICSYS are set), a write one to this bit immediately forces the contents of the input capture registers TC0 to TC3
and their corresponding 8-bit pulse accumulators to be latched into the associated holding registers. The pulse
accumulators will be automatically cleared when the latch action occurs.
ICLAT
Writing zero to this bit has no effect. Read of this bit will always return zero.
3
Force Load Register into the Modulus Counter Count Register — This bit is active only when the modulus
FLMC
down-counter is enabled (MCEN = 1).
A write one into this bit loads the load register into the modulus counter count register (MCCNT). This also resets
the modulus counter prescaler.
Write zero to this bit has no effect. Read of this bit will return always zero.
2
Modulus Down-Counter Enable
MCEN
0 Modulus counter disabled. The modulus counter (MCCNT) is preset to 0xFFFF. This will prevent an early
interrupt flag when the modulus down-counter is enabled.
1 Modulus counter is enabled.
1:0
Modulus Counter Prescaler Select — These two bits specify the division rate of the modulus counter prescaler
MCPR[1:0] when PRNT of TSCR1 is set to 0. The newly selected prescaler division rate will not be effective until a load of
the load register into the modulus counter count register occurs.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
535
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
Table 11-23. Modulus Counter Prescaler Select
MCPR1
MCPR0
Prescaler Division
0
0
1
1
0
1
0
1
1
4
8
16
11.3.2.20 16-Bit Modulus Down-Counter FLAG Register (MCFLG)
Module Base + 0x0027
7
6
5
4
3
2
1
0
R
W
0
0
0
POLF3
POLF2
POLF1
POLF0
MCZF
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 11-42. 16-Bit Modulus Down-Counter FLAG Register (MCFLG)
Read: Anytime
Write only used in the flag clearing mechanism for bit 7. Writing a one to bit 7 clears the flag. Writing a
zero will not affect the current status of the bit.
NOTE
mechanism (writing a one to the flag). Reference Section 11.3.2.6, “Timer
System Control Register 1 (TSCR1)”.
All bits reset to zero.
Table 11-24. MCFLG Field Descriptions
Field
Description
7
Modulus Counter Underflow Flag — The flag is set when the modulus down-counter reaches 0x0000.
MCZF
The flag indicates when interrupt conditions have occurred. The flag can be cleared via the normal flag clearing
mechanism (writing a one to the flag) or via the fast flag clearing mechanism (Reference TFFCA bit in
Section 11.3.2.6, “Timer System Control Register 1 (TSCR1)”).
3:0
First Input Capture Polarity Status — These are read only bits. Writes to these bits have no effect.
POLF[3:0]
Each status bit gives the polarity of the first edge which has caused an input capture to occur after capture latch
has been read.
Each POLFx corresponds to a timer PORTx input.
0 The first input capture has been caused by a falling edge.
1 The first input capture has been caused by a rising edge.
MC9S12XDP512 Data Sheet, Rev. 2.11
536
Freescale Semiconductor
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
11.3.2.21 ICPAR — Input Control Pulse Accumulators Register (ICPAR)
Module Base + 0x0028
7
6
5
4
3
2
1
0
R
W
0
0
0
0
PA3EN
PA2EN
PA1EN
PA0EN
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 11-43. Input Control Pulse Accumulators Register (ICPAR)
Read: Anytime
Write: Anytime.
All bits reset to zero.
The 8-bit pulse accumulators PAC3 and PAC2 can be enabled only if PAEN in PACTL is cleared. If PAEN
is set, PA3EN and PA2EN have no effect.
The 8-bit pulse accumulators PAC1 and PAC0 can be enabled only if PBEN in PBCTL is cleared. If PBEN
is set, PA1EN and PA0EN have no effect.
Table 11-25. ICPAR Field Descriptions
Field
Description
3:0
8-Bit Pulse Accumulator ‘x’ Enable
PA[3:0]EN 0 8-Bit Pulse Accumulator is disabled.
1 8-Bit Pulse Accumulator is enabled.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
537
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
11.3.2.22 Delay Counter Control Register (DLYCT)
Module Base + 0x0029
7
6
5
4
3
2
1
0
R
W
DLY7
DLY6
DLY5
DLY4
DLY3
DLY2
DLY1
DLY0
Reset
0
0
0
0
0
0
0
0
Figure 11-44. Delay Counter Control Register (DLYCT)
Read: Anytime
Write: Anytime
All bits reset to zero.
Table 11-26. DLYCT Field Descriptions
Description
Field
7:0
Delay Counter Select — When the PRNT bit of TSCR1 register is set to 0, only bits DLY0, DLY1 are used to
DLY[7:0]
calculate the delay.Table 11-27 shows the delay settings in this case.
When the PRNT bit of TSCR1 register is set to 1, all bits are used to set a more precise delay. Table 11-28 shows
the delay settings in this case. After detection of a valid edge on an input capture pin, the delay counter counts
the pre-selected number of [(dly_cnt + 1)*4]bus clock cycles, then it will generate a pulse on its output if the level
of input signal, after the preset delay, is the opposite of the level before the transition.This will avoid reaction to
narrow input pulses.
Delay between two active edges of the input signal period should be longer than the selected counter delay.
Note: It is recommended to not write to this register while the timer is enabled, that is when TEN is set in register
TSCR1.
Table 11-27. Delay Counter Select when PRNT = 0
DLY1
DLY0
Delay
0
0
1
1
0
1
0
1
Disabled
256 bus clock cycles
512 bus clock cycles
1024 bus clock cycles
Table 11-28. Delay Counter Select Examples when PRNT = 1
DLY7
DLY6
DLY5
DLY4
DLY3
DLY2
DLY1
DLY0
Delay
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
0
1
1
0
0
0
0
0
0
0
0
0
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
1
1
1
1
0
0
1
1
0
0
1
1
1
1
1
1
0
1
0
1
0
1
0
1
1
1
1
1
Disabled (bypassed)
8 bus clock cycles
12 bus clock cycles
16 bus clock cycles
20 bus clock cycles
24 bus clock cycles
28 bus clock cycles
32 bus clock cycles
64 bus clock cycles
128 bus clock cycles
256 bus clock cycles
512 bus clock cycles
MC9S12XDP512 Data Sheet, Rev. 2.11
538
Freescale Semiconductor
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
Table 11-28. Delay Counter Select Examples when PRNT = 1
DLY7
DLY6
DLY5
DLY4
DLY3
DLY2
DLY1
DLY0
Delay
1
1
1
1
1
1
1
1
1024 bus clock cycles
11.3.2.23 Input Control Overwrite Register (ICOVW)
Module Base + 0x002A
7
6
5
4
3
2
1
0
R
W
NOVW7
NOVW6
NOVW5
NOVW4
NOVW3
NOVW2
NOVW1
NOVW0
Reset
0
0
0
0
0
0
0
0
Figure 11-45. Input Control Overwrite Register (ICOVW)
Read: Anytime
Write: Anytime
All bits reset to zero.
Table 11-29. ICOVW Field Descriptions
Description
Field
7:0
No Input Capture Overwrite
NOVW[7:0] 0 The contents of the related capture register or holding register can be overwritten when a new input capture
1 The related capture register or holding register cannot be written by an event unless they are empty (see
Section 11.4.1.1, “IC Channels”). This will prevent the captured value being overwritten until it is read or
latched in the holding register.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
539
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
11.3.2.24 Input Control System Control Register (ICSYS)
Module Base + 0x002B
7
6
5
4
3
2
1
0
R
W
SH37
SH26
SH15
SH04
TFMOD
PACMX
BUFEN
LATQ
Reset
0
0
0
0
0
0
0
0
Figure 11-46. Input Control System Register (ICSYS)
Read: Anytime
Write: Once in normal modes
All bits reset to zero.
Table 11-30. ICSYS Field Descriptions
Description
Field
7:4
SHxy
Share Input action of Input Capture Channels x and y
0 Normal operation
1 The channel input ‘x’ causes the same action on the channel ‘y’. The port pin ‘x’ and the corresponding edge
detector is used to be active on the channel ‘y’.
3
Timer Flag Setting Mode — Use of the TFMOD bit in conjunction with the use of the ICOVW register allows a
timer interrupt to be generated after capturing two values in the capture and holding registers instead of
generating an interrupt for every capture.
TFMOD
By setting TFMOD in queue mode, when NOVWx bit is set and the corresponding capture and holding registers
are emptied, an input capture event will first update the related input capture register with the main timer
contents. At the next event, the TCx data is transferred to the TCxH register, the TCx is updated and the CxF
interrupt flag is set. In all other input capture cases the interrupt flag is set by a valid external event on PTx.
0 The timer flags C3F–C0F in TFLG1 are set when a valid input capture transition on the corresponding port pin
occurs.
1 If in queue mode (BUFEN = 1 and LATQ = 0), the timer flags C3F–C0F in TFLG1 are set only when a latch
on the corresponding holding register occurs. If the queue mode is not engaged, the timer flags C3F–C0F are
set the same way as for TFMOD = 0.
2
8-Bit Pulse Accumulators Maximum Count
PACMX
0 Normal operation. When the 8-bit pulse accumulator has reached the value 0x00FF, with the next active edge,
it will be incremented to 0x0000.
1 When the 8-bit pulse accumulator has reached the value 0x00FF, it will not be incremented further. The value
0x00FF indicates a count of 255 or more.
1
IC Buffer Enable
BUFFEN
0 Input capture and pulse accumulator holding registers are disabled.
1 Input capture and pulse accumulator holding registers are enabled. The latching mode is defined by LATQ
control bit.
MC9S12XDP512 Data Sheet, Rev. 2.11
540
Freescale Semiconductor
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
Table 11-30. ICSYS Field Descriptions (continued)
Field
Description
0
Input Control Latch or Queue Mode Enable — The BUFEN control bit should be set in order to enable the IC
LATQ
and pulse accumulators holding registers. Otherwise LATQ latching modes are disabled.
Write one into ICLAT bit in MCCTL, when LATQ and BUFEN are set will produce latching of input capture and
pulse accumulators registers into their holding registers.
0 Queue mode of Input Capture is enabled. The main timer value is memorized in the IC register by a valid input
pin transition. With a new occurrence of a capture, the value of the IC register will be transferred to its holding
register and the IC register memorizes the new timer value.
1 Latch mode is enabled. Latching function occurs when modulus down-counter reaches zero or a zero is
written into the count register MCCNT (see Section 11.4.1.1.2, “Buffered IC Channels”). With a latching event
the contents of IC registers and 8-bit pulse accumulators are transferred to their holding registers. 8-bit pulse
accumulators are cleared.
11.3.2.25 Precision Timer Prescaler Select Register (PTPSR)
Module Base + 0x002E
7
6
5
4
3
2
1
0
R
W
PTPS7
PTPS6
PTPS5
PTPS4
PTPS3
PTPS2
PTPS1
PTPS0
Reset
0
0
0
0
0
0
0
0
Figure 11-47. Precision Timer Prescaler Select Register (PTPSR)
Read: Anytime
Write: Anytime
All bits reset to zero.
Table 11-31. PTPSR Field Descriptions
Description
Field
7:0
Precision Timer Prescaler Select Bits — These eight bits specify the division rate of the main Timer prescaler.
PTPS[7:0] These are effective only when the PRNT bit of TSCR1 is set to 1. Table 11-32 shows some selection examples
in this case.
The newly selected prescale factor will not take effect until the next synchronized edge where all prescale counter
stages equal zero.
Table 11-32. Precision Timer Prescaler Selection Examples when PRNT = 1
Prescale
PTPS7
PTPS6
PTPS5
PTPS4
PTPS3
PTPS2
PTPS1
PTPS0
Factor
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
0
0
1
1
0
0
0
1
0
1
0
1
1
2
3
4
5
6
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
541
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
Table 11-32. Precision Timer Prescaler Selection Examples when PRNT = 1
Prescale
Factor
PTPS7
PTPS6
PTPS5
PTPS4
PTPS3
PTPS2
PTPS1
PTPS0
0
0
0
0
0
0
1
0
0
0
0
0
1
1
0
0
0
0
1
1
1
0
0
0
1
1
1
1
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
1
1
1
1
1
1
7
8
16
32
64
128
256
11.3.2.26 Precision Timer Modulus Counter Prescaler Select Register (PTMCPSR)
Module Base + 0x002F
7
6
5
4
3
2
1
0
R
W
PTMPS7
PTMPS6
PTMPS5
PTMPS4
PTMPS3
PTMPS2
PTMPS1
PTMPS0
Reset
0
0
0
0
0
0
0
0
Figure 11-48. Precision Timer Modulus Counter Prescaler Select Register (PTMCPSR)
Read: Anytime
Write: Anytime
All bits reset to zero.
Table 11-33. PTMCPSR Field Descriptions
Description
Field
7:0
Precision Timer Modulus Counter Prescaler Select Bits — These eight bits specify the division rate of the
PTMPS[7:0] modulus counter prescaler. These are effective only when the PRNT bit of TSCR1 is set to 1. Table 11-34 shows
some possible division rates.
The newly selected prescaler division rate will not be effective until a load of the load register into the modulus
counter count register occurs.
Table 11-34. Precision Timer Modulus Counter Prescaler Select Examples when PRNT = 1
Prescaler
PTMPS7
PTMPS6
PTMPS5
PTMPS4
PTMPS3
PTMPS2
PTMPS1
PTMPS0
Division
Rate
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
1
1
0
0
1
0
1
0
1
2
3
4
5
MC9S12XDP512 Data Sheet, Rev. 2.11
542
Freescale Semiconductor
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
Table 11-34. Precision Timer Modulus Counter Prescaler Select Examples when PRNT = 1 (continued)
Prescaler
PTMPS7
PTMPS6
PTMPS5
PTMPS4
PTMPS3
PTMPS2
PTMPS1
PTMPS0
Division
Rate
0
0
0
0
0
0
0
1
0
0
0
0
0
0
1
1
0
0
0
0
0
1
1
1
0
0
0
0
1
1
1
1
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
0
1
1
1
1
1
1
1
1
0
1
1
1
1
1
1
6
7
8
16
32
64
128
256
11.3.2.27 16-Bit Pulse Accumulator B Control Register (PBCTL)
Module Base + 0x0030
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
PBEN
PBOVI
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 11-49. 16-Bit Pulse Accumulator B Control Register (PBCTL)
Read: Anytime
Write: Anytime
All bits reset to zero.
Table 11-35. PBCTL Field Descriptions
Description
Field
6
Pulse Accumulator B System Enable — PBEN is independent from TEN. With timer disabled, the pulse
accumulator can still function unless pulse accumulator is disabled.
0 16-bit pulse accumulator system disabled. 8-bit PAC1 and PAC0 can be enabled when their related enable
bits in ICPAR are set.
PBEN
1 Pulse accumulator B system enabled. The two 8-bit pulse accumulators PAC1 and PAC0 are cascaded to form
the PACB 16-bit pulse accumulator B. When PACB is enabled, the PACN1 and PACN0 registers contents are
respectively the high and low byte of the PACB.
PA1EN and PA0EN control bits in ICPAR have no effect.
The PACB shares the input pin with IC0.
1
Pulse Accumulator B Overflow Interrupt Enable
0 Interrupt inhibited
PBOVI
1 Interrupt requested if PBOVF is set
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
543
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
11.3.2.28 Pulse Accumulator B Flag Register (PBFLG)
Module Base + 0x0031
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
PBOVF
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 11-50. Pulse Accumulator B Flag Register (PBFLG)
Read: Anytime
Write used in the flag clearing mechanism. Writing a one to the flag clears the flag. Writing a zero will not
affect the current status of the bit.
NOTE
mechanism (writing a one to the flag). Reference Section 11.3.2.6, “Timer
System Control Register 1 (TSCR1)”.
All bits reset to zero.
clearing mechanism (writing a one to the flag) or via the fast flag clearing mechanism (Reference TFFCA
bit in Section 11.3.2.6, “Timer System Control Register 1 (TSCR1)”).
Table 11-36. PBFLG Field Descriptions
Field
Description
1
Pulse Accumulator B Overflow Flag — This bit is set when the 16-bit pulse accumulator B overflows from
PBOVF
0xFFFF to 0x0000, or when 8-bit pulse accumulator 1 (PAC1) overflows from 0x00FF to 0x0000.
When PACMX = 1, PBOVF bit can also be set if 8-bit pulse accumulator 1 (PAC1) reaches 0x00FF and an active
edge follows on PT1.
MC9S12XDP512 Data Sheet, Rev. 2.11
544
Freescale Semiconductor
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
11.3.2.29 8-Bit Pulse Accumulators Holding Registers (PA3H–PA0H)
Module Base + 0x0032
7
6
5
4
3
2
1
0
R
W
PA3H7
0
PA3H6
PA3H5
PA3H4
PA3H3
PA3H2
PA3H1
PA3H0
Reset
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 11-51. 8-Bit Pulse Accumulators Holding Register 3 (PA3H)
Module Base + 0x0033
7
6
5
4
3
2
1
0
R
W
PA2H7
PA2H6
PA2H5
PA2H4
PA2H3
PA2H2
PA2H1
PA2H0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 11-52. 8-Bit Pulse Accumulators Holding Register 2 (PA2H)
Module Base + 0x0034
7
6
5
4
3
2
1
0
R
W
PA1H7
PA1H6
PA1H5
PA1H4
PA1H3
PA1H2
PA1H1
PA1H0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 11-53. 8-Bit Pulse Accumulators Holding Register 1 (PA1H)
Module Base + 0x0035
7
6
5
4
3
2
1
0
R
W
PA0H7
PA0H6
PA0H5
PA0H4
PA0H3
PA0H2
PA0H1
PA0H0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 11-54. 8-Bit Pulse Accumulators Holding Register 0 (PA0H)
Read: Anytime.
Write: Has no effect.
All bits reset to zero.
These registers are used to latch the value of the corresponding pulse accumulator when the related bits in
register ICPAR are enabled (see Section 11.4.1.3, “Pulse Accumulators”).
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
545
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
11.3.2.30 Modulus Down-Counter Count Register (MCCNT)
Module Base + 0x0036
15
14
13
12
11
10
9
8
R
W
MCCNT15
MCCNT14
MCCNT13
MCCNT12
MCCNT11
MCCNT10
MCCNT9
MCCNT8
Reset
1
1
1
1
1
1
1
1
Figure 11-55. Modulus Down-Counter Count Register High (MCCNT)
Module Base + 0x0037
7
6
5
4
3
2
1
0
R
MCCNT7
W
MCCNT6
MCCNT5
MCCNT4
MCCNT3
MCCNT2
MCCNT1
MCCNT9
Reset
1
1
1
1
1
1
1
1
Figure 11-56. Modulus Down-Counter Count Register Low (MCCNT)
Read: Anytime
Write: Anytime.
All bits reset to one.
A full access for the counter register will take place in one clock cycle.
NOTE
A separate read/write for high byte and low byte will give different results
than accessing them as a word.
If the RDMCL bit in MCCTL register is cleared, reads of the MCCNT register will return the present value
of the count register. If the RDMCL bit is set, reads of the MCCNT will return the contents of the load
register.
If a 0x0000 is written into MCCNT when LATQ and BUFEN in ICSYS register are set, the input capture
and pulse accumulator registers will be latched.
With a 0x0000 write to the MCCNT, the modulus counter will stay at zero and does not set the MCZF flag
in MCFLG register.
If the modulus down counter is enabled (MCEN = 1) and modulus mode is enabled (MODMC = 1), a write
to MCCNT will update the load register with the value written to it. The count register will not be updated
with the new value until the next counter underflow.
If modulus mode is not enabled (MODMC = 0), a write to MCCNT will clear the modulus prescaler and
will immediately update the counter register with the value written to it and down-counts to 0x0000 and
stops.
The FLMC bit in MCCTL can be used to immediately update the count register with the new value if an
immediate load is desired.
MC9S12XDP512 Data Sheet, Rev. 2.11
546
Freescale Semiconductor
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
11.3.2.31 Timer Input Capture Holding Registers 0–3 (TCxH)
Module Base + 0x0038
15
14
13
12
11
10
9
8
R
W
TC15
0
TC14
TC13
TC12
TC11
TC10
TC9
TC8
Reset
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 11-57. Timer Input Capture Holding Register 0 High (TC0H)
Module Base + 0x0039
7
6
5
4
3
2
1
0
R
W
TC7
TC6
TC5
TC4
TC3
TC2
TC1
TC0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 11-58. Timer Input Capture Holding Register 0 Low (TC0H)
Module Base + 0x003A
15
14
13
12
11
10
9
8
R
W
TC15
TC14
TC13
TC12
TC11
TC10
TC9
TC8
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 11-59. Timer Input Capture Holding Register 1 High (TC1H)
Module Base + 0x003B
7
6
5
4
3
2
1
0
R
W
TC7
TC6
TC5
TC4
TC3
TC2
TC1
TC0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 11-60. Timer Input Capture Holding Register 1 Low (TC1H)
Module Base + 0x003C
15
14
13
12
11
10
9
8
R
W
TC15
TC14
TC13
TC12
TC11
TC10
TC9
TC8
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 11-61. Timer Input Capture Holding Register 2 High (TC2H)
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
547
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
Module Base + 0x003D
7
6
5
4
3
2
1
0
R
W
TC7
TC6
TC5
TC4
TC3
TC2
TC1
TC0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 11-62. Timer Input Capture Holding Register 2 Low (TC2H)
Module Base + 0x003E
15
14
13
12
11
10
9
8
R
W
TC15
0
TC14
TC13
TC12
TC11
TC10
TC9
TC8
Reset
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 11-63. Timer Input Capture Holding Register 3 High (TC3H)
Module Base + 0x003F
7
6
5
4
3
2
1
0
R
W
TC7
TC6
TC5
TC4
TC3
TC2
TC1
TC0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 11-64. Timer Input Capture Holding Register 3 Low (TC3H)
Read: Anytime
Write: Has no effect.
All bits reset to zero.
These registers are used to latch the value of the input capture registers TC0–TC3. The corresponding
IOSx bits in TIOS should be cleared (see Section 11.4.1.1, “IC Channels”).
11.4 Functional Description
This section provides a complete functional description of the ECT block, detailing the operation of the
design from the end user perspective in a number of subsections.
MC9S12XDP512 Data Sheet, Rev. 2.11
548
Freescale Semiconductor
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
16-Bit Free-Running
16-Bit Load Register
÷ 1, 2, ..., 128
Main Timer
÷ 1, 4, 8, 16
16-Bit Modulus
Down Counter
Bus Clock
Modulus Prescaler
Bus Clock
P0
Timer Prescaler
RESET
0
Comparator
Pin Logic
Pin Logic
Pin Logic
Pin Logic
Pin Logic
Delay
Counter
TC0 Capture/Compare Reg.
PAC0
EDG0
EDG1
EDG2
EDG3
TC0H Hold Reg.
PA0H Hold Reg.
RESET
0
Comparator
P1
P2
P3
Delay
Counter
TC1 Capture/Compare Reg.
PAC1
TC1H Hold Reg.
PA1H Hold Reg.
RESET
0
Comparator
Delay
Counter
TC2 Capture/Compare Reg.
PAC2
TC2H Hold Reg.
PA2H Hold Reg.
RESET
0
Comparator
Delay
Counter
TC3 Capture/Compare Reg.
PAC3
TC3H Hold Reg.
PA3H Hold Reg.
Comparator
P4
P5
EDG4
TC4 Capture/Compare Reg.
MUX
MUX
ICLAT, LATQ, BUFEN
(Force Latch)
EDG0
SH04
Comparator
Pin Logic
Pin Logic
Pin Logic
EDG5
EDG1
TC5 Capture/Compare Reg.
Write 0x0000
to Modulus Counter
SH15
LATQ
(MDC Latch Enable)
Comparator
P6
P7
EDG6
TC6 Capture/Compare Reg.
MUX
MUX
EDG2
SH26
Comparator
EDG7
TC7 Capture/Compare Reg.
EDG3
SH37
Figure 11-65. Detailed Timer Block Diagram in Latch Mode when PRNT = 0
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
549
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
16-Bit Free-Running
16-Bit Load Register
÷ 1, 2,3, ..., 256
Main Timer
÷ 1, 2,3, ..., 256
16-Bit Modulus
Down Counter
Bus Clock
Modulus Prescaler
Bus Clock
P0
Timer Prescaler
RESET
0
Comparator
Pin Logic
Pin Logic
Pin Logic
Pin Logic
Pin Logic
Delay
Counter
TC0 Capture/Compare Reg.
PAC0
EDG0
8, 12, 16, ..., 1024
TC0H Hold Reg.
PA0H Hold Reg.
RESET
0
Comparator
P1
P2
P3
Delay
Counter
TC1 Capture/Compare Reg.
PAC1
EDG1
8, 12, 16, ..., 1024
TC1H Hold Reg.
PA1H Hold Reg.
RESET
0
Comparator
Delay
Counter
TC2 Capture/Compare Reg.
PAC2
EDG2
8, 12, 16, ..., 1024
TC2H Hold Reg.
PA2H Hold Reg.
RESET
0
Comparator
Delay
Counter
TC3 Capture/Compare Reg.
PAC3
EDG3
8, 12, 16, ..., 1024
TC3H Hold Reg.
PA3H Hold Reg.
Comparator
P4
P5
EDG4
MUX
TC4 Capture/Compare Reg.
ICLAT, LATQ, BUFEN
(Force Latch)
EDG0
SH04
Comparator
Pin Logic
Pin Logic
Pin Logic
EDG5
TC5 Capture/Compare Reg.
Write 0x0000
to Modulus Counter
MUX
MUX
MUX
EDG1
SH15
LATQ
(MDC Latch Enable)
Comparator
P6
P7
EDG6
TC6 Capture/Compare Reg.
EDG2
SH26
Comparator
EDG7
TC7 Capture/Compare Reg.
EDG3
SH37
Figure 11-66. Detailed Timer Block Diagram in Latch Mode when PRNT = 1
MC9S12XDP512 Data Sheet, Rev. 2.11
550
Freescale Semiconductor
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
÷1, 2, ..., 128
Timer
Prescaler
16-Bit Free-Running
16-Bit Load Register
Bus Clock
Main Timer
÷ 1, 4, 8, 16
16-Bit Modulus
Down Counter
Modulus
Prescaler
Bus Clock
RESET
0
Comparator
P0
Pin Logic
Pin Logic
Pin Logic
Pin Logic
Pin Logic
Delay
Counter
TC0 Capture/Compare Reg.
PAC0
EDG0
EDG1
EDG2
EDG3
TC0H Hold Reg.
PA0H Hold Reg.
RESET
0
Comparator
P1
P2
P3
Delay
Counter
TC1 Capture/Compare Reg.
PAC1
TC1H Hold Reg.
PA1H Hold Reg.
RESET
0
Comparator
Delay
Counter
TC2 Capture/Compare Reg.
PAC2
PA2H Hold Reg.
TC2H Hold Reg.
RESET
0
Comparator
Delay
Counter
TC3 Capture/Compare Reg.
PAC3
TC3H Hold Reg.
PA3H Hold Reg.
Comparator
LATQ, BUFEN
(Queue Mode)
P4
P5
EDG4
EDG0
TC4 Capture/Compare Reg.
MUX
SH04
EDG5
EDG1
Read TC3H
Hold Reg.
Comparator
Pin Logic
Pin Logic
Pin Logic
TC5 Capture/Compare Reg.
MUX
Read TC2H
Hold Reg.
SH15
Comparator
P6
P7
EDG6
EDG2
TC6 Capture/Compare Reg.
MUX
Read TC1H
Hold Reg.
SH26
Comparator
Read TC0H
Hold Reg.
EDG7
TC7 Capture/Compare Reg.
MUX
EDG3
SH37
Figure 11-67. Detailed Timer Block Diagram in Queue Mode when PRNT = 0
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
551
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
÷1, 2, 3, ... 256
16-Bit Free-Running
Timer
Prescaler
16-Bit Load Register
Bus Clock
÷ 1, 2, 3, ... 256
Main Timer
16-Bit Modulus
Down Counter
Modulus
Prescaler
Bus Clock
RESET
0
Comparator
P0
Pin Logic
Delay
Counter
TC0 Capture/Compare Reg.
PAC0
EDG0
8, 12, 16, ... 1024
TC0H Hold Reg.
PA0H Hold Reg.
RESET
0
Comparator
P1
P2
P3
Pin Logic
Pin Logic
Pin Logic
Delay
Counter
TC1 Capture/Compare Reg.
PAC1
EDG1
8, 12, 16, ... 1024
TC1H Hold Reg.
PA1H Hold Reg.
RESET
0
Comparator
Delay
Counter
TC2 Capture/Compare Reg.
PAC2
EDG2
8, 12, 16, ... 1024
PA2H Hold Reg.
TC2H Hold Reg.
RESET
0
Comparator
Delay
Counter
TC3 Capture/Compare Reg.
PAC3
EDG3
8, 12, 16, ... 1024
TC3H Hold Reg.
PA3H Hold Reg.
Comparator
LATQ, BUFEN
P4
P5
Pin Logic
Pin Logic
EDG4
MUX
TC4 Capture/Compare Reg.
(Queue Mode)
EDG0
SH04
EDG5
EDG1
Read TC3H
Hold Reg.
Comparator
TC5 Capture/Compare Reg.
MUX
Read TC2H
Hold Reg.
SH15
Comparator
Pin Logic
Pin Logic
P6
P7
EDG6
EDG2
TC6 Capture/Compare Reg.
MUX
Read TC1H
Hold Reg.
SH26
Comparator
Read TC0H
Hold Reg.
EDG7
TC7 Capture/Compare Reg.
MUX
EDG3
SH37
Figure 11-68. Detailed Timer Block Diagram in Queue Mode when PRNT = 1
MC9S12XDP512 Data Sheet, Rev. 2.11
552
Freescale Semiconductor
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
Load Holding Register and Reset Pulse Accumulator
0
0
0
0
8, 12,16, ..., 1024
Delay Counter
EDG0
8-Bit PAC0 (PACN0)
P0
P1
P2
P3
Edge Detector
Edge Detector
Edge Detector
Edge Detector
PA0H Holding
Register
Interrupt
8, 12,16, ..., 1024
Delay Counter
EDG1
8-Bit PAC1 (PACN1)
PA1H Holding
Register
8, 12,16, ..., 1024
Delay Counter
EDG2
8-Bit PAC2 (PACN2)
PA2H Holding
Register
Interrupt
8, 12,16, ..., 1024
Delay Counter
EDG3
8-Bit PAC3 (PACN3)
PA3H Holding
Register
Figure 11-69. 8-Bit Pulse Accumulators Block Diagram
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
553
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
TIMCLK (Timer Clock)
CLK1
4:1 MUX
CLK0
Clock Select
(PAMOD)
Prescaled Clock
(PCLK)
Edge Detector
P7
Interrupt
8-Bit PAC3
(PACN3)
8-Bit PAC2
(PACN2)
MUX
PACA
Divide by 64
Bus Clock
Interrupt
8-Bit PAC1
(PACN1)
8-Bit PAC0
(PACN0)
Delay Counter
Edge Detector
PACB
P0
Figure 11-70. 16-Bit Pulse Accumulators Block Diagram
16-Bit Main Timer
Edge
Detector
Delay
Counter
Px
Set CxF
Interrupt
TCx Input
Capture Register
TCxH I.C.
Holding Register
BUFEN • LATQ • TFMOD
Figure 11-71. Block Diagram for Port 7 with Output Compare/Pulse Accumulator A
MC9S12XDP512 Data Sheet, Rev. 2.11
554
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
11.4.1 Enhanced Capture Timer Modes of Operation
The enhanced capture timer has 8 input capture, output compare (IC/OC) channels, same as on the HC12
standard timer (timer channels TC0 to TC7). When channels are selected as input capture by selecting the
IOSx bit in TIOS register, they are called input capture (IC) channels.
Four IC channels (channels 7–4) are the same as on the standard timer with one capture register each that
memorizes the timer value captured by an action on the associated input pin.
Four other IC channels (channels 3–0), in addition to the capture register, also have one buffer each called
a holding register. This allows two different timer values to be saved without generating any interrupts.
Four 8-bit pulse accumulators are associated with the four buffered IC channels (channels 3–0). Each pulse
accumulator has a holding register to memorize their value by an action on its external input. Each pair of
pulse accumulators can be used as a 16-bit pulse accumulator.
The 16-bit modulus down-counter can control the transfer of the IC registers and the pulse accumulators
contents to the respective holding registers for a given period, every time the count reaches zero.
The modulus down-counter can also be used as a stand-alone time base with periodic interrupt capability.
11.4.1.1 IC Channels
The IC channels are composed of four standard IC registers and four buffered IC channels.
•
•
An IC register is empty when it has been read or latched into the holding register.
A holding register is empty when it has been read.
11.4.1.1.1
Non-Buffered IC Channels
The main timer value is memorized in the IC register by a valid input pin transition. If the corresponding
NOVWx bit of the ICOVW register is cleared, with a new occurrence of a capture, the contents of IC
register are overwritten by the new value. If the corresponding NOVWx bit of the ICOVW register is set,
the capture register cannot be written unless it is empty. This will prevent the captured value from being
overwritten until it is read.
11.4.1.1.2
Buffered IC Channels
There are two modes of operations for the buffered IC channels:
1. IC latch mode (LATQ = 1)
The main timer value is memorized in the IC register by a valid input pin transition (see
Figure 11-65 and Figure 11-66).
The value of the buffered IC register is latched to its holding register by the modulus counter for a
given period when the count reaches zero, by a write 0x0000 to the modulus counter or by a write
to ICLAT in the MCCTL register.
If the corresponding NOVWx bit of the ICOVW register is cleared, with a new occurrence of a
capture, the contents of IC register are overwritten by the new value. In case of latching, the
contents of its holding register are overwritten.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
555
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
If the corresponding NOVWx bit of the ICOVW register is set, the capture register or its holding
register cannot be written by an event unless they are empty (see Section 11.4.1.1, “IC Channels”).
This will prevent the captured value from being overwritten until it is read or latched in the holding
register.
2. IC Queue Mode (LATQ = 0)
The main timer value is memorized in the IC register by a valid input pin transition (see
Figure 11-67 and Figure 11-68).
If the corresponding NOVWx bit of the ICOVW register is cleared, with a new occurrence of a
capture, the value of the IC register will be transferred to its holding register and the IC register
memorizes the new timer value.
If the corresponding NOVWx bit of the ICOVW register is set, the capture register or its holding
register cannot be written by an event unless they are empty (see Section 11.4.1.1, “IC Channels”).
In queue mode, reads of the holding register will latch the corresponding pulse accumulator value
to its holding register.
11.4.1.1.3
Delayed IC Channels
There are four delay counters in this module associated with IC channels 0–3. The use of this feature is
explained in the diagram and notes below.
BUS CLOCK
0
1
2
3
253 254
255 256
DLY_CNT
INPUT ON
CH0–3
Rejected
Rejected
Accepted
Accepted
255 Cycles
255.5 Cycles
255.5 Cycles
INPUT ON
CH0–3
INPUT ON
CH0–3
INPUT ON
CH0–3
256 Cycles
Figure 11-72. Channel Input Validity with Delay Counter Feature
In Figure 11-72 a delay counter value of 256 bus cycles is considered.
1. Input pulses with a duration of (DLY_CNT – 1) cycles or shorter are rejected.
2. Input pulses with a duration between (DLY_CNT – 1) and DLY_CNT cycles may be rejected or
accepted, depending on their relative alignment with the sample points.
3. Input pulses with a duration between (DLY_CNT – 1) and DLY_CNT cycles may be rejected or
accepted, depending on their relative alignment with the sample points.
4. Input pulses with a duration of DLY_CNT or longer are accepted.
MC9S12XDP512 Data Sheet, Rev. 2.11
556
Freescale Semiconductor
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
11.4.1.2 OC Channel Initialization
Internal register whose output drives OCx when TIOS is set, can be force loaded with a desired data by
writing to CFORC register before OCx is configured for output compare action. This allows a glitch free
switch over of port from general purpose I/O to timer output once the output compare is enabled.
11.4.1.3 Pulse Accumulators
There are four 8-bit pulse accumulators with four 8-bit holding registers associated with the four IC
buffered channels 3–0. A pulse accumulator counts the number of active edges at the input of its channel.
The minimum pulse width for the PAI input is greater than two bus clocks.The maximum input frequency
on the pulse accumulator channel is one half the bus frequency or Eclk.
The user can prevent the 8-bit pulse accumulators from counting further than 0x00FF by utilizing the
PACMX control bit in the ICSYS register. In this case, a value of 0x00FF means that 255 counts or more
have occurred.
Each pair of pulse accumulators can be used as a 16-bit pulse accumulator (see Figure 11-70).
To operate the 16-bit pulse accumulators A and B (PACA and PACB) independently of input capture or
output compare 7 and 0 respectively, the user must set the corresponding bits: IOSx = 1, OMx = 0, and
OLx = 0. OC7M7 or OC7M0 in the OC7M register must also be cleared.
There are two modes of operation for the pulse accumulators:
•
Pulse accumulator latch mode
The value of the pulse accumulator is transferred to its holding register when the modulus
down-counter reaches zero, a write 0x0000 to the modulus counter or when the force latch control
bit ICLAT is written.
At the same time the pulse accumulator is cleared.
Pulse accumulator queue mode
•
When queue mode is enabled, reads of an input capture holding register will transfer the contents
of the associated pulse accumulator to its holding register.
At the same time the pulse accumulator is cleared.
11.4.1.4 Modulus Down-Counter
The modulus down-counter can be used as a time base to generate a periodic interrupt. It can also be used
to latch the values of the IC registers and the pulse accumulators to their holding registers.
The action of latching can be programmed to be periodic or only once.
11.4.1.5 Precision Timer
By enabling the PRNT bit of the TSCR1 register, the performance of the timer can be enhanced. In this
case, it is possible to set additional prescaler settings for the main timer counter and modulus down counter
and enhance delay counter settings compared to the settings in the present ECT timer.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
557
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
11.4.1.6 Flag Clearing Mechanisms
The flags in the ECT can be cleared one of two ways:
1. Normal flag clearing mechanism (TFFCA = 0)
Any of the ECT flags can be cleared by writing a one to the flag.
2. Fast flag clearing mechanism (TFFCA = 1)
With the timer fast flag clear all (TFFCA) enabled, the ECT flags can only be cleared by accessing
the various registers associated with the ECT modes of operation as described below. The flags
cannot be cleared via the normal flag clearing mechanism. This fast flag clearing mechanism has
the advantage of eliminating the software overhead required by a separate clear sequence. Extra
care must be taken to avoid accidental flag clearing due to unintended accesses.
— Input capture
A read from an input capture channel register causes the corresponding channel flag, CxF, to
be cleared in the TFLG1 register.
— Output compare
A write to the output compare channel register causes the corresponding channel flag, CxF, to
be cleared in the TFLG1 register.
— Timer counter
Any access to the TCNT register clears the TOF flag in the TFLG2 register.
— Pulse accumulator A
Any access to the PACN3 and PACN2 registers clears the PAOVF and PAIF flags in the
PAFLG register.
— Pulse accumulator B
Any access to the PACN1 and PACN0 registers clears the PBOVF flag in the PBFLG register.
— Modulus down counter
Any access to the MCCNT register clears the MCZF flag in the MCFLG register.
11.4.2 Reset
The reset state of each individual bit is listed within the register description section (Section 11.3,
“Memory Map and Register Definition”) which details the registers and their bit-fields.
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
11.4.3 Interrupts
This section describes interrupts originated by the ECT block. The MCU must service the interrupt
requests. Table 11-37 lists the interrupts generated by the ECT to communicate with the MCU.
Table 11-37. ECT Interrupts
Interrupt Source
Timer channel 7–0
Description
Active high timer channel interrupts 7–0
Active high modulus counter interrupt
Active high pulse accumulator B interrupt
Active high pulse accumulator A input interrupt
Pulse accumulator overflow interrupt
Timer 0verflow interrupt
Modulus counter underflow
Pulse accumulator B overflow
Pulse accumulator A input
Pulse accumulator A overflow
Timer overflow
The ECT only originates interrupt requests. The following is a description of how the module makes a
request and how the MCU should acknowledge that request. The interrupt vector offset and interrupt
number are chip dependent.
11.4.3.1 Channel [7:0] Interrupt
This active high output will be asserted by the module to request a timer channel 7–0 interrupt to be
serviced by the system controller.
11.4.3.2 Modulus Counter Interrupt
This active high output will be asserted by the module to request a modulus counter underflow interrupt to
be serviced by the system controller.
11.4.3.3 Pulse Accumulator B Overflow Interrupt
This active high output will be asserted by the module to request a timer pulse accumulator B overflow
interrupt to be serviced by the system controller.
11.4.3.4 Pulse Accumulator A Input Interrupt
This active high output will be asserted by the module to request a timer pulse accumulator A input
interrupt to be serviced by the system controller.
11.4.3.5 Pulse Accumulator A Overflow Interrupt
This active high output will be asserted by the module to request a timer pulse accumulator A overflow
interrupt to be serviced by the system controller.
11.4.3.6 Timer Overflow Interrupt
This active high output will be asserted by the module to request a timer overflow interrupt to be serviced
by the system controller.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
559
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Chapter 11 Enhanced Capture Timer (S12MC9S12XDP51216B8CV2)
MC9S12XDP512 Data Sheet, Rev. 2.11
560
Freescale Semiconductor
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Chapter 12
Pulse-Width Modulator (S12PWM8B8CV1)
12.1 Introduction
The PWM definition is based on the HC12 PWM definitions. It contains the basic features from the HC11
with some of the enhancements incorporated on the HC12: center aligned output mode and four available
clock sources.The PWM module has eight channels with independent control of left and center aligned
outputs on each channel.
Each of the eight channels has a programmable period and duty cycle as well as a dedicated counter. A
flexible clock select scheme allows a total of four different clock sources to be used with the counters. Each
of the modulators can create independent continuous waveforms with software-selectable duty rates from
0% to 100%. The PWM outputs can be programmed as left aligned outputs or center aligned outputs.
12.1.1 Features
The PWM block includes these distinctive features:
•
•
•
•
•
Eight independent PWM channels with programmable period and duty cycle
Dedicated counter for each PWM channel
Programmable PWM enable/disable for each channel
Software selection of PWM duty pulse polarity for each channel
Period and duty cycle are double buffered. Change takes effect when the end of the effective period
is reached (PWM counter reaches zero) or when the channel is disabled.
•
•
•
•
•
Programmable center or left aligned outputs on individual channels
Eight 8-bit channel or four 16-bit channel PWM resolution
Four clock sources (A, B, SA, and SB) provide for a wide range of frequencies
Programmable clock select logic
Emergency shutdown
12.1.2 Modes of Operation
There is a software programmable option for low power consumption in wait mode that disables the input
clock to the prescaler.
In freeze mode there is a software programmable option to disable the input clock to the prescaler. This is
useful for emulation.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
561
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Chapter 12 Pulse-Width Modulator (S12PWM8B8CV1)
12.1.3 Block Diagram
Figure 12-1 shows the block diagram for the 8-bit 8-channel PWM block.
PWM8B8C
PWM Channels
Channel 7
PWM7
PWM6
Period and Duty
Counter
Counter
Channel 6
Period and Duty
PWM Clock
Bus Clock
Clock Select
Control
Channel 5
PWM5
PWM4
PWM3
PWM2
Period and Duty
Counter
Counter
Counter
Counter
Channel 4
Period and Duty
Channel 3
Period and Duty
Enable
Channel 2
Polarity
Period and Duty
Alignment
Channel 1
PWM1
PWM0
Period and Duty
Counter
Counter
Channel 0
Period and Duty
Figure 12-1. PWM Block Diagram
12.2 External Signal Description
The PWM module has a total of 8 external pins.
12.2.1 PWM7 — PWM Channel 7
This pin serves as waveform output of PWM channel 7 and as an input for the emergency shutdown
feature.
12.2.2 PWM6 — PWM Channel 6
This pin serves as waveform output of PWM channel 6.
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 12 Pulse-Width Modulator (S12PWM8B8CV1)
12.2.3 PWM5 — PWM Channel 5
This pin serves as waveform output of PWM channel 5.
12.2.4 PWM4 — PWM Channel 4
This pin serves as waveform output of PWM channel 4.
12.2.5 PWM3 — PWM Channel 3
This pin serves as waveform output of PWM channel 3.
12.2.6 PWM3 — PWM Channel 2
This pin serves as waveform output of PWM channel 2.
12.2.7 PWM3 — PWM Channel 1
This pin serves as waveform output of PWM channel 1.
12.2.8 PWM3 — PWM Channel 0
This pin serves as waveform output of PWM channel 0.
12.3 Memory Map and Register Definition
This section describes in detail all the registers and register bits in the PWM module.
The special-purpose registers and register bit functions that are not normally available to device end users,
such as factory test control registers and reserved registers, are clearly identified by means of shading the
appropriate portions of address maps and register diagrams. Notes explaining the reasons for restricting
access to the registers and functions are also explained in the individual register descriptions.
12.3.1 Module Memory Map
This section describes the content of the registers in the PWM module. The base address of the PWM
module is determined at the MCU level when the MCU is defined. The register decode map is fixed and
begins at the first address of the module address offset. The figure below shows the registers associated
with the PWM and their relative offset from the base address. The register detail description follows the
order they appear in the register map.
Reserved bits within a register will always read as 0 and the write will be unimplemented. Unimplemented
functions are indicated by shading the bit. .
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
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Chapter 12 Pulse-Width Modulator (S12PWM8B8CV1)
NOTE
Register Address = Base Address + Address Offset, where the Base Address
is defined at the MCU level and the Address Offset is defined at the module
level.
12.3.2 Register Descriptions
This section describes in detail all the registers and register bits in the PWM module.
Register
Name
Bit 7
6
5
4
3
2
1
Bit 0
0x0000
PWME
R
PWME7
PWME6
PWME5
PWME4
PWME3
PWME2
PWME1
PWME0
W
0x0001
PWMPOL
R
PPOL7
PPOL6
PCLKL6
PCKB2
CAE6
PPOL5
PCLK5
PCKB1
CAE5
PPOL4
PCLK4
PCKB0
CAE4
PPOL3
PPOL2
PCLK2
PCKA2
CAE2
PPOL1
PCLK1
PCKA1
PPOL0
PCLK0
PCKA0
W
0x0002
PWMCLK
R
PCLK7
0
PCLK3
0
W
0x0003
PWMPRCLK
R
W
0x0004
PWMCAE
R
CAE7
CAE3
CAE1
0
CAE0
0
W
0x0005
PWMCTL
R
CON67
0
CON45
0
CON23
0
CON01
0
PSWAI
0
PFRZ
0
W
0x0006
PWMTST
R
0
0
0
0
1
W
0x0007
PWMPRSC
R
0
0
6
0
5
0
4
0
3
0
2
1
W
0x0008
PWMSCLA
R
Bit 7
1
Bit 0
W
0x0009
PWMSCLB
R
Bit 7
0
6
0
5
0
4
0
3
0
2
0
1
0
Bit 0
0
W
R
PWMSCNTA
W
1
= Unimplemented or Reserved
Figure 12-2. PWM Register Summary (Sheet 1 of 3)
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 12 Pulse-Width Modulator (S12PWM8B8CV1)
Register
Name
Bit 7
6
5
4
3
2
1
Bit 0
R
0
0
0
0
0
0
0
0
PWMSCNTB
W
1
0x000C
PWMCNT0
R
Bit 7
0
6
0
5
0
4
0
3
0
2
0
1
0
Bit 0
0
W
0x000D
PWMCNT1
R
Bit 7
0
6
0
5
0
4
0
3
0
2
0
1
0
Bit 0
0
W
0x000E
PWMCNT2
R
Bit 7
0
6
0
5
0
4
0
3
0
2
0
1
0
Bit 0
0
W
0x000F
PWMCNT3
R
Bit 7
0
6
0
5
0
4
0
3
0
2
0
1
0
Bit 0
0
W
0x0010
PWMCNT4
R
Bit 7
0
6
0
5
0
4
0
3
0
2
0
1
0
Bit 0
0
W
0x0011
PWMCNT5
R
Bit 7
0
6
0
5
0
4
0
3
0
2
0
1
0
Bit 0
0
W
0x0012
PWMCNT6
R
Bit 7
0
6
0
5
0
4
0
3
0
2
0
1
0
Bit 0
0
W
0x0013
PWMCNT7
R
Bit 7
0
6
0
5
0
4
0
3
0
2
0
1
0
Bit 0
0
W
0x0014
PWMPER0
R
Bit 7
Bit 7
Bit 7
Bit 7
Bit 7
Bit 7
6
6
6
6
6
6
5
5
5
5
5
5
4
4
4
4
4
4
3
3
3
3
3
3
2
2
2
2
2
2
1
1
1
1
1
1
Bit 0
Bit 0
Bit 0
Bit 0
Bit 0
Bit 0
W
0x0015
PWMPER1
R
W
0x0016
PWMPER2
R
W
0x0017
PWMPER3
R
W
0x0018
PWMPER4
R
W
0x0019
PWMPER5
R
W
= Unimplemented or Reserved
Figure 12-2. PWM Register Summary (Sheet 2 of 3)
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
565
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Chapter 12 Pulse-Width Modulator (S12PWM8B8CV1)
Register
Bit 7
6
5
4
3
2
1
Bit 0
Name
0x001A
PWMPER6
R
Bit 7
6
5
4
3
2
1
Bit 0
W
0x001B
PWMPER7
R
Bit 7
Bit 7
Bit 7
Bit 7
Bit 7
Bit 7
Bit 7
Bit 7
Bit 7
PWMIF
6
5
5
5
5
5
5
5
5
5
4
3
3
3
3
3
3
3
3
2
2
2
2
2
2
2
2
1
1
1
1
1
1
1
1
1
Bit 0
Bit 0
Bit 0
Bit 0
Bit 0
Bit 0
Bit 0
Bit 0
Bit 0
W
0x001C
PWMDTY0
R
6
4
W
0x001D
PWMDTY1
R
6
4
W
0x001E
PWMDTY2
R
6
4
W
0x001F
PWMDTY3
R
6
4
W
0x0010
PWMDTY4
R
6
4
W
0x0021
PWMDTY5
R
6
4
W
0x0022
PWMDTY6
R
6
6
4
4
W
0x0023
PWMDTY7
R
3
0
2
W
0x0024
PWMSDN
R
0
PWM7IN
PWMIE
PWMLVL
PWM7INL PWM7ENA
W
PWMRSTRT
= Unimplemented or Reserved
Figure 12-2. PWM Register Summary (Sheet 3 of 3)
1
Intended for factory test purposes only.
12.3.2.1 PWM Enable Register (PWME)
Each PWM channel has an enable bit (PWMEx) to start its waveform output. When any of the PWMEx
bits are set (PWMEx = 1), the associated PWM output is enabled immediately. However, the actual PWM
waveform is not available on the associated PWM output until its clock source begins its next cycle due to
the synchronization of PWMEx and the clock source.
NOTE
The first PWM cycle after enabling the channel can be irregular.
MC9S12XDP512 Data Sheet, Rev. 2.11
566
Freescale Semiconductor
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Chapter 12 Pulse-Width Modulator (S12PWM8B8CV1)
An exception to this is when channels are concatenated. Once concatenated mode is enabled (CONxx bits
set in PWMCTL register), enabling/disabling the corresponding 16-bit PWM channel is controlled by the
low order PWMEx bit.In this case, the high order bytes PWMEx bits have no effect and their
corresponding PWM output lines are disabled.
While in run mode, if all eight PWM channels are disabled (PWME7–0 = 0), the prescaler counter shuts
off for power savings.
Module Base + 0x0000
7
6
5
4
3
2
1
0
R
W
PWME7
PWME6
PWME5
PWME4
PWME3
PWME2
PWME1
PWME0
Reset
0
0
0
0
0
0
0
0
Figure 12-3. PWM Enable Register (PWME)
Read: Anytime
Write: Anytime
Table 12-1. PWME Field Descriptions
Description
Field
7
Pulse Width Channel 7 Enable
PWME7
0 Pulse width channel 7 is disabled.
1 Pulse width channel 7 is enabled. The pulse modulated signal becomes available at PWM output bit 7 when
its clock source begins its next cycle.
6
Pulse Width Channel 6 Enable
PWME6
0 Pulse width channel 6 is disabled.
1 Pulse width channel 6 is enabled. The pulse modulated signal becomes available at PWM output bit6 when
its clock source begins its next cycle. If CON67=1, then bit has no effect and PWM output line 6 is disabled.
5
Pulse Width Channel 5 Enable
PWME5
0 Pulse width channel 5 is disabled.
1 Pulse width channel 5 is enabled. The pulse modulated signal becomes available at PWM output bit 5 when
its clock source begins its next cycle.
4
Pulse Width Channel 4 Enable
PWME4
0 Pulse width channel 4 is disabled.
1 Pulse width channel 4 is enabled. The pulse modulated signal becomes available at PWM, output bit 4 when
its clock source begins its next cycle. If CON45 = 1, then bit has no effect and PWM output bit4 is disabled.
3
Pulse Width Channel 3 Enable
PWME3
0 Pulse width channel 3 is disabled.
1 Pulse width channel 3 is enabled. The pulse modulated signal becomes available at PWM, output bit 3 when
its clock source begins its next cycle.
2
Pulse Width Channel 2 Enable
PWME2
0 Pulse width channel 2 is disabled.
1 Pulse width channel 2 is enabled. The pulse modulated signal becomes available at PWM, output bit 2 when
its clock source begins its next cycle. If CON23 = 1, then bit has no effect and PWM output bit2 is disabled.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
567
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Chapter 12 Pulse-Width Modulator (S12PWM8B8CV1)
Table 12-1. PWME Field Descriptions (continued)
Field
Description
1
Pulse Width Channel 1 Enable
PWME1
0
Pulse width channel 1 is disabled.
1
Pulse width channel 1 is enabled. The pulse modulated signal becomes available at PWM, output bit 1 when
its clock source begins its next cycle.
0
Pulse Width Channel 0 Enable
PWME0
0 Pulse width channel 0 is disabled.
1 Pulse width channel 0 is enabled. The pulse modulated signal becomes available at PWM, output bit 0 when
its clock source begins its next cycle. If CON01 = 1, then bit has no effect and PWM output line0 is disabled.
12.3.2.2 PWM Polarity Register (PWMPOL)
The starting polarity of each PWM channel waveform is determined by the associated PPOLx bit in the
PWMPOL register. If the polarity bit is one, the PWM channel output is high at the beginning of the cycle
and then goes low when the duty count is reached. Conversely, if the polarity bit is zero, the output starts
low and then goes high when the duty count is reached.
Module Base + 0x0001
7
6
5
4
3
2
1
0
R
W
PPOL7
PPOL6
PPOL5
PPOL4
PPOL3
PPOL2
PPOL1
PPOL0
Reset
0
0
0
0
0
0
0
0
Figure 12-4. PWM Polarity Register (PWMPOL)
Read: Anytime
Write: Anytime
NOTE
PPOLx register bits can be written anytime. If the polarity is changed while
a PWM signal is being generated, a truncated or stretched pulse can occur
during the transition
Table 12-2. PWMPOL Field Descriptions
Description
Field
7–0
Pulse Width Channel 7–0 Polarity Bits
PPOL[7:0] 0 PWM channel 7–0 outputs are low at the beginning of the period, then go high when the duty count is
reached.
1 PWM channel 7–0 outputs are high at the beginning of the period, then go low when the duty count is
reached.
12.3.2.3 PWM Clock Select Register (PWMCLK)
Each PWM channel has a choice of two clocks to use as the clock source for that channel as described
below.
MC9S12XDP512 Data Sheet, Rev. 2.11
568
Freescale Semiconductor
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Chapter 12 Pulse-Width Modulator (S12PWM8B8CV1)
Module Base + 0x0002
7
6
5
4
3
2
1
0
R
PCLK7
W
PCLKL6
PCLK5
PCLK4
PCLK3
PCLK2
PCLK1
PCLK0
Reset
0
0
0
0
0
0
0
0
Figure 12-5. PWM Clock Select Register (PWMCLK)
Read: Anytime
Write: Anytime
NOTE
Register bits PCLK0 to PCLK7 can be written anytime. If a clock select is
changed while a PWM signal is being generated, a truncated or stretched
pulse can occur during the transition.
Table 12-3. PWMCLK Field Descriptions
Description
Field
7
Pulse Width Channel 7 Clock Select
PCLK7
0 Clock B is the clock source for PWM channel 7.
1 Clock SB is the clock source for PWM channel 7.
6
Pulse Width Channel 6 Clock Select
PCLK6
0 Clock B is the clock source for PWM channel 6.
1 Clock SB is the clock source for PWM channel 6.
5
Pulse Width Channel 5 Clock Select
PCLK5
0 Clock A is the clock source for PWM channel 5.
1 Clock SA is the clock source for PWM channel 5.
4
Pulse Width Channel 4 Clock Select
PCLK4
0 Clock A is the clock source for PWM channel 4.
1 Clock SA is the clock source for PWM channel 4.
3
Pulse Width Channel 3 Clock Select
PCLK3
0 Clock B is the clock source for PWM channel 3.
1 Clock SB is the clock source for PWM channel 3.
2
Pulse Width Channel 2 Clock Select
PCLK2
0 Clock B is the clock source for PWM channel 2.
1 Clock SB is the clock source for PWM channel 2.
1
Pulse Width Channel 1 Clock Select
PCLK1
0 Clock A is the clock source for PWM channel 1.
1 Clock SA is the clock source for PWM channel 1.
0
Pulse Width Channel 0 Clock Select
PCLK0
0 Clock A is the clock source for PWM channel 0.
1 Clock SA is the clock source for PWM channel 0.
12.3.2.4 PWM Prescale Clock Select Register (PWMPRCLK)
This register selects the prescale clock source for clocks A and B independently.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
569
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Chapter 12 Pulse-Width Modulator (S12PWM8B8CV1)
Module Base + 0x0003
7
6
5
4
3
2
1
0
R
W
0
0
PCKB2
PCKB1
PCKB0
PCKA2
PCKA1
PCKA0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 12-6. PWM Prescale Clock Select Register (PWMPRCLK)
Read: Anytime
Write: Anytime
NOTE
PCKB2–0 and PCKA2–0 register bits can be written anytime. If the clock
pre-scale is changed while a PWM signal is being generated, a truncated or
stretched pulse can occur during the transition.
Table 12-4. PWMPRCLK Field Descriptions
Description
Field
6–4
Prescaler Select for Clock B — Clock B is one of two clock sources which can be used for channels 2, 3, 6, or
2–0 Prescaler Select for Clock A — Clock A is one of two clock sources which can be used for channels 0, 1, 4 or
PCKA[2:0] 5. These three bits determine the rate of clock A, as shown in Table 12-6.
s
Table 12-5. Clock B Prescaler Selects
PCKB2
PCKB1
PCKB0
Value of Clock B
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
Bus clock
Bus clock / 2
Bus clock / 4
Bus clock / 8
Bus clock / 16
Bus clock / 32
Bus clock / 64
Bus clock / 128
Table 12-6. Clock A Prescaler Selects
PCKA2
PCKA1
PCKA0
Value of Clock A
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
Bus clock
Bus clock / 2
Bus clock / 4
Bus clock / 8
Bus clock / 16
Bus clock / 32
Bus clock / 64
Bus clock / 128
MC9S12XDP512 Data Sheet, Rev. 2.11
570
Freescale Semiconductor
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Chapter 12 Pulse-Width Modulator (S12PWM8B8CV1)
12.3.2.5 PWM Center Align Enable Register (PWMCAE)
The PWMCAE register contains eight control bits for the selection of center aligned outputs or left aligned
center aligned. If the CAEx bit is cleared, the corresponding PWM output will be left aligned. See
Section 12.4.2.5, “Left Aligned Outputs” and Section 12.4.2.6, “Center Aligned Outputs” for a more
detailed description of the PWM output modes.
Module Base + 0x0004
7
6
5
4
3
2
1
0
R
W
CAE7
CAE6
CAE5
CAE4
CAE3
CAE2
CAE1
CAE0
Reset
0
0
0
0
0
0
0
0
Figure 12-7. PWM Center Align Enable Register (PWMCAE)
Read: Anytime
Write: Anytime
NOTE
Write these bits only when the corresponding channel is disabled.
Table 12-7. PWMCAE Field Descriptions
Description
Field
7–0
CAE[7:0]
Center Aligned Output Modes on Channels 7–0
0 Channels 7–0 operate in left aligned output mode.
1 Channels 7–0 operate in center aligned output mode.
12.3.2.6 PWM Control Register (PWMCTL)
The PWMCTL register provides for various control of the PWM module.
Module Base + 0x0005
7
6
5
4
3
2
1
0
R
W
0
0
CON67
CON45
CON23
CON01
PSWAI
PFRZ
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 12-8. PWM Control Register (PWMCTL)
Read: Anytime
Write: Anytime
There are three control bits for concatenation, each of which is used to concatenate a pair of PWM
channels into one 16-bit channel. When channels 6 and 7are concatenated, channel 6 registers become the
high order bytes of the double byte channel. When channels 4 and 5 are concatenated, channel 4 registers
become the high order bytes of the double byte channel. When channels 2 and 3 are concatenated, channel
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
571
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Chapter 12 Pulse-Width Modulator (S12PWM8B8CV1)
2 registers become the high order bytes of the double byte channel. When channels 0 and 1 are
See Section 12.4.2.7, “PWM 16-Bit Functions” for a more detailed description of the concatenation PWM
Function.
NOTE
Change these bits only when both corresponding channels are disabled.
Table 12-8. PWMCTL Field Descriptions
Field
Description
7
Concatenate Channels 6 and 7
CON67
0 Channels 6 and 7 are separate 8-bit PWMs.
1 Channels 6 and 7 are concatenated to create one 16-bit PWM channel. Channel 6 becomes the high order
byte and channel 7 becomes the low order byte. Channel 7 output pin is used as the output for this 16-bit
PWM (bit 7 of port PWMP). Channel 7 clock select control-bit determines the clock source, channel 7 polarity
bit determines the polarity, channel 7 enable bit enables the output and channel 7 center aligned enable bit
determines the output mode.
6
Concatenate Channels 4 and 5
CON45
0 Channels 4 and 5 are separate 8-bit PWMs.
1 Channels 4 and 5 are concatenated to create one 16-bit PWM channel. Channel 4 becomes the high order
byte and channel 5 becomes the low order byte. Channel 5 output pin is used as the output for this 16-bit
PWM (bit 5 of port PWMP). Channel 5 clock select control-bit determines the clock source, channel 5 polarity
bit determines the polarity, channel 5 enable bit enables the output and channel 5 center aligned enable bit
determines the output mode.
5
Concatenate Channels 2 and 3
CON23
0 Channels 2 and 3 are separate 8-bit PWMs.
1 Channels 2 and 3 are concatenated to create one 16-bit PWM channel. Channel 2 becomes the high order
byte and channel 3 becomes the low order byte. Channel 3 output pin is used as the output for this 16-bit
PWM (bit 3 of port PWMP). Channel 3 clock select control-bit determines the clock source, channel 3 polarity
bit determines the polarity, channel 3 enable bit enables the output and channel 3 center aligned enable bit
determines the output mode.
4
Concatenate Channels 0 and 1
CON01
0 Channels 0 and 1 are separate 8-bit PWMs.
1 Channels 0 and 1 are concatenated to create one 16-bit PWM channel. Channel 0 becomes the high order
byte and channel 1 becomes the low order byte. Channel 1 output pin is used as the output for this 16-bit
PWM (bit 1 of port PWMP). Channel 1 clock select control-bit determines the clock source, channel 1 polarity
bit determines the polarity, channel 1 enable bit enables the output and channel 1 center aligned enable bit
determines the output mode.
3
PWM Stops in Wait Mode — Enabling this bit allows for lower power consumption in wait mode by disabling
the input clock to the prescaler.
PSWAI
0 Allow the clock to the prescaler to continue while in wait mode.
1 Stop the input clock to the prescaler whenever the MCU is in wait mode.
2
PWM Counters Stop in Freeze Mode — In freeze mode, there is an option to disable the input clock to the
prescaler by setting the PFRZ bit in the PWMCTL register. If this bit is set, whenever the MCU is in freeze mode,
the input clock to the prescaler is disabled. This feature is useful during emulation as it allows the PWM function
to be suspended. In this way, the counters of the PWM can be stopped while in freeze mode so that once normal
program flow is continued, the counters are re-enabled to simulate real-time operations. Since the registers can
still be accessed in this mode, to re-enable the prescaler clock, either disable the PFRZ bit or exit freeze mode.
0 Allow PWM to continue while in freeze mode.
PFREZ
1 Disable PWM input clock to the prescaler whenever the part is in freeze mode. This is useful for emulation.
MC9S12XDP512 Data Sheet, Rev. 2.11
572
Freescale Semiconductor
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Chapter 12 Pulse-Width Modulator (S12PWM8B8CV1)
12.3.2.7 Reserved Register (PWMTST)
This register is reserved for factory testing of the PWM module and is not available in normal modes.
Module Base + 0x0006
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 12-9. Reserved Register (PWMTST)
Read: Always read $00 in normal modes
Write: Unimplemented in normal modes
NOTE
Writing to this register when in special modes can alter the PWM
functionality.
12.3.2.8 Reserved Register (PWMPRSC)
This register is reserved for factory testing of the PWM module and is not available in normal modes.
Module Base + 0x0007
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 12-10. Reserved Register (PWMPRSC)
Read: Always read $00 in normal modes
Write: Unimplemented in normal modes
NOTE
Writing to this register when in special modes can alter the PWM
functionality.
12.3.2.9 PWM Scale A Register (PWMSCLA)
PWMSCLA is the programmable scale value used in scaling clock A to generate clock SA. Clock SA is
generated by taking clock A, dividing it by the value in the PWMSCLA register and dividing that by two.
Clock SA = Clock A / (2 * PWMSCLA)
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
573
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Chapter 12 Pulse-Width Modulator (S12PWM8B8CV1)
NOTE
When PWMSCLA = $00, PWMSCLA value is considered a full scale value
of 256. Clock A is thus divided by 512.
Any value written to this register will cause the scale counter to load the new scale value (PWMSCLA).
Module Base + 0x0008
7
6
5
4
3
2
1
0
R
W
Bit 7
6
5
4
3
2
1
Bit 0
Reset
0
0
0
0
0
0
0
0
Figure 12-11. PWM Scale A Register (PWMSCLA)
Read: Anytime
Write: Anytime (causes the scale counter to load the PWMSCLA value)
12.3.2.10 PWM Scale B Register (PWMSCLB)
PWMSCLB is the programmable scale value used in scaling clock B to generate clock SB. Clock SB is
generated by taking clock B, dividing it by the value in the PWMSCLB register and dividing that by two.
Clock SB = Clock B / (2 * PWMSCLB)
NOTE
When PWMSCLB = $00, PWMSCLB value is considered a full scale value
of 256. Clock B is thus divided by 512.
Any value written to this register will cause the scale counter to load the new scale value (PWMSCLB).
Module Base + 0x0009
7
6
5
4
3
2
1
0
R
W
Bit 7
6
5
4
3
2
1
Bit 0
Reset
0
0
0
0
0
0
0
0
Figure 12-12. PWM Scale B Register (PWMSCLB)
Read: Anytime
Write: Anytime (causes the scale counter to load the PWMSCLB value).
12.3.2.11 Reserved Registers (PWMSCNTx)
The registers PWMSCNTA and PWMSCNTB are reserved for factory testing of the PWM module and are
not available in normal modes.
MC9S12XDP512 Data Sheet, Rev. 2.11
574
Freescale Semiconductor
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Chapter 12 Pulse-Width Modulator (S12PWM8B8CV1)
Module Base + 0x000A, 0x000B
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 12-13. Reserved Registers (PWMSCNTx)
Read: Always read $00 in normal modes
Write: Unimplemented in normal modes
NOTE
Writing to these registers when in special modes can alter the PWM
functionality.
12.3.2.12 PWM Channel Counter Registers (PWMCNTx)
Each channel has a dedicated 8-bit up/down counter which runs at the rate of the selected clock source.
The counter can be read at any time without affecting the count or the operation of the PWM channel. In
left aligned output mode, the counter counts from 0 to the value in the period register - 1. In center aligned
output mode, the counter counts from 0 up to the value in the period register and then back down to 0.
Any value written to the counter causes the counter to reset to $00, the counter direction to be set to up,
the immediate load of both duty and period registers with values from the buffers, and the output to change
according to the polarity bit. The counter is also cleared at the end of the effective period (see
Section 12.4.2.5, “Left Aligned Outputs” and Section 12.4.2.6, “Center Aligned Outputs” for more
details). When the channel is disabled (PWMEx = 0), the PWMCNTx register does not count. When a
PWMCNTx register. For more detailed information on the operation of the counters, see Section 12.4.2.4,
“PWM Timer Counters”.
In concatenated mode, writes to the 16-bit counter by using a 16-bit access or writes to either the low or
high order byte of the counter will reset the 16-bit counter. Reads of the 16-bit counter must be made by
16-bit access to maintain data coherency.
NOTE
Writing to the counter while the channel is enabled can cause an irregular PWM cycle to occur.
Module Base + 0x000C = PWMCNT0, 0x000D = PWMCNT1, 0x000E = PWMCNT2, 0x000F = PWMCNT3
Module Base + 0x0010 = PWMCNT4, 0x0011 = PWMCNT5, 0x0012 = PWMCNT6, 0x0013 = PWMCNT7
7
6
5
4
3
2
1
0
R
W
Bit 7
6
5
4
3
2
1
Bit 0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Reset
Figure 12-14. PWM Channel Counter Registers (PWMCNTx)
Read: Anytime
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
575
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Chapter 12 Pulse-Width Modulator (S12PWM8B8CV1)
Write: Anytime (any value written causes PWM counter to be reset to $00).
12.3.2.13 PWM Channel Period Registers (PWMPERx)
There is a dedicated period register for each channel. The value in this register determines the period of
the associated PWM channel.
The period registers for each channel are double buffered so that if they change while the channel is
enabled, the change will NOT take effect until one of the following occurs:
•
•
•
The effective period ends
The counter is written (counter resets to $00)
The channel is disabled
In this way, the output of the PWM will always be either the old waveform or the new waveform, not some
variation in between. If the channel is not enabled, then writes to the period register will go directly to the
latches as well as the buffer.
NOTE
Reads of this register return the most recent value written. Reads do not
necessarily return the value of the currently active period due to the double
See Section 12.4.2.3, “PWM Period and Duty” for more information.
To calculate the output period, take the selected clock source period for the channel of interest (A, B, SA,
or SB) and multiply it by the value in the period register for that channel:
•
•
Left aligned output (CAEx = 0)
PWMxPeriod=ChannelClockPeriod*PWMPERxCenterAlignedOutput(CAEx=1)
For boundary case programming values, please refer to Section 12.4.2.8, “PWM Boundary Cases”.
Module Base + 0x0014 = PWMPER0, 0x0015 = PWMPER1, 0x0016 = PWMPER2, 0x0017 = PWMPER3
Module Base + 0x0018 = PWMPER4, 0x0019 = PWMPER5, 0x001A = PWMPER6, 0x001B = PWMPER7
7
6
5
4
3
2
1
0
R
W
Bit 7
6
5
4
3
2
1
Bit 0
Reset
1
1
1
1
1
1
1
1
Figure 12-15. PWM Channel Period Registers (PWMPERx)
Read: Anytime
Write: Anytime
MC9S12XDP512 Data Sheet, Rev. 2.11
576
Freescale Semiconductor
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Chapter 12 Pulse-Width Modulator (S12PWM8B8CV1)
12.3.2.14 PWM Channel Duty Registers (PWMDTYx)
There is a dedicated duty register for each channel. The value in this register determines the duty of the
associated PWM channel. The duty value is compared to the counter and if it is equal to the counter value
a match occurs and the output changes state.
The duty registers for each channel are double buffered so that if they change while the channel is enabled,
the change will NOT take effect until one of the following occurs:
•
•
•
The effective period ends
The counter is written (counter resets to $00)
The channel is disabled
In this way, the output of the PWM will always be either the old duty waveform or the new duty waveform,
not some variation in between. If the channel is not enabled, then writes to the duty register will go directly
to the latches as well as the buffer.
NOTE
Reads of this register return the most recent value written. Reads do not
necessarily return the value of the currently active duty due to the double
See Section 12.4.2.3, “PWM Period and Duty” for more information.
NOTE
Depending on the polarity bit, the duty registers will contain the count of
either the high time or the low time. If the polarity bit is one, the output starts
high and then goes low when the duty count is reached, so the duty registers
contain a count of the high time. If the polarity bit is zero, the output starts
low and then goes high when the duty count is reached, so the duty registers
contain a count of the low time.
To calculate the output duty cycle (high time as a% of period) for a particular channel:
•
Polarity = 0 (PPOL x =0)
Duty Cycle = [(PWMPERx-PWMDTYx)/PWMPERx] * 100%
Polarity = 1 (PPOLx = 1)
•
For boundary case programming values, please refer to Section 12.4.2.8, “PWM Boundary Cases”.
Module Base + 0x001C = PWMDTY0, 0x001D = PWMDTY1, 0x001E = PWMDTY2, 0x001F = PWMDTY3
Module Base + 0x0020 = PWMDTY4, 0x0021 = PWMDTY5, 0x0022 = PWMDTY6, 0x0023 = PWMDTY7
7
6
5
4
3
2
1
0
R
W
Bit 7
6
5
4
3
2
1
Bit 0
Reset
1
1
1
1
1
1
1
1
Figure 12-16. PWM Channel Duty Registers (PWMDTYx)
Read: Anytime
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
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Chapter 12 Pulse-Width Modulator (S12PWM8B8CV1)
Write: Anytime
12.3.2.15 PWM Shutdown Register (PWMSDN)
The PWMSDN register provides for the shutdown functionality of the PWM module in the emergency
cases. For proper operation, channel 7 must be driven to the active level for a minimum of two bus clocks.
Module Base + 0x0024
7
6
5
4
3
2
1
0
R
W
0
0
PWM7IN
PWMIF
PWMIE
PWMLVL
PWM7INL
PWM7ENA
PWMRSTRT
0
Reset
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 12-17. PWM Shutdown Register (PWMSDN)
Read: Anytime
Write: Anytime
Table 12-9. PWMSDN Field Descriptions
Description
Field
7
PWM Interrupt Flag — Any change from passive to asserted (active) state or from active to passive state will
be flagged by setting the PWMIF flag = 1. The flag is cleared by writing a logic 1 to it. Writing a 0 has no effect.
0 No change on PWM7IN input.
PWMIF
1 Change on PWM7IN input
6
PWM Interrupt Enable — If interrupt is enabled an interrupt to the CPU is asserted.
0 PWM interrupt is disabled.
PWMIE
1 PWM interrupt is enabled.
5
PWM Restart — The PWM can only be restarted if the PWM channel input 7 is de-asserted. After writing a logic
PWMRSTRT 1 to the PWMRSTRT bit (trigger event) the PWM channels start running after the corresponding counter passes
next “counter == 0” phase. Also, if the PWM7ENA bit is reset to 0, the PWM do not start before the counter
passes $00. The bit is always read as “0”.
4
PWM Shutdown Output Level If active level as defined by the PWM7IN input, gets asserted all enabled PWM
channels are immediately driven to the level defined by PWMLVL.
0 PWM outputs are forced to 0
PWMLVL
1 Outputs are forced to 1.
2
PWM Channel 7 Input Status — This reflects the current status of the PWM7 pin.
PWM7IN
1
PWM Shutdown Active Input Level for Channel 7 — If the emergency shutdown feature is enabled
PWM7INL (PWM7ENA = 1), this bit determines the active level of the PWM7channel.
0 Active level is low
1 Active level is high
0
PWM Emergency Shutdown Enable — If this bit is logic 1, the pin associated with channel 7 is forced to input
PWM7ENA and the emergency shutdown feature is enabled. All the other bits in this register are meaningful only if
PWM7ENA = 1.
0 PWM emergency feature disabled.
1 PWM emergency feature is enabled.
MC9S12XDP512 Data Sheet, Rev. 2.11
578
Freescale Semiconductor
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Chapter 12 Pulse-Width Modulator (S12PWM8B8CV1)
12.4 Functional Description
12.4.1 PWM Clock Select
There are four available clocks: clock A, clock B, clock SA (scaled A), and clock SB (scaled B). These
four clocks are based on the bus clock.
Clock A and B can be software selected to be 1, 1/2, 1/4, 1/8,..., 1/64, 1/128 times the bus clock. Clock SA
uses clock A as an input and divides it further with a reloadable counter. Similarly, clock SB uses clock B
as an input and divides it further with a reloadable counter. The rates available for clock SA are software
selectable to be clock A divided by 2, 4, 6, 8,..., or 512 in increments of divide by 2. Similar rates are
available for clock SB. Each PWM channel has the capability of selecting one of two clocks, either the
pre-scaled clock (clock A or B) or the scaled clock (clock SA or SB).
The block diagram in Figure 12-18 shows the four different clocks and how the scaled clocks are created.
12.4.1.1 Prescale
The input clock to the PWM prescaler is the bus clock. It can be disabled whenever the part is in freeze
mode by setting the PFRZ bit in the PWMCTL register. If this bit is set, whenever the MCU is in freeze
mode (freeze mode signal active) the input clock to the prescaler is disabled. This is useful for emulation
in order to freeze the PWM. The input clock can also be disabled when all eight PWM channels are
disabled (PWME7-0 = 0). This is useful for reducing power by disabling the prescale counter.
Clock A and clock B are scaled values of the input clock. The value is software selectable for both clock
A and clock B and has options of 1, 1/2, 1/4, 1/8, 1/16, 1/32, 1/64, or 1/128 times the bus clock. The value
selected for clock A is determined by the PCKA2, PCKA1, PCKA0 bits in the PWMPRCLK register. The
value selected for clock B is determined by the PCKB2, PCKB1, PCKB0 bits also in the PWMPRCLK
register.
12.4.1.2 Clock Scale
The scaled A clock uses clock A as an input and divides it further with a user programmable value and
then divides this by 2. The scaled B clock uses clock B as an input and divides it further with a user
programmable value and then divides this by 2. The rates available for clock SA are software selectable to
be clock A divided by 2, 4, 6, 8,..., or 512 in increments of divide by 2. Similar rates are available for clock
SB.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
579
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Chapter 12 Pulse-Width Modulator (S12PWM8B8CV1)
Clock A
M
U
X
Clock to
PWM Ch 0
Clock A/2, A/4, A/6,....A/512
PCLK0
Count = 1
Load
8-Bit Down
Counter
M
U
X
Clock to
PWM Ch 1
PCLK1
Clock SA
DIV 2
PWMSCLA
M
U
X
Clock to
PWM Ch 2
M
U
X
PCLK2
M
U
X
Clock to
PWM Ch 3
PCLK3
Clock B
M
U
X
Clock to
PWM Ch 4
Clock B/2, B/4, B/6,....B/512
PCLK4
M
U
X
Count = 1
8-Bit Down
Counter
M
U
X
Clock to
PWM Ch 5
Load
Clock SB
PCLK5
PWMSCLB
DIV 2
M
U
X
Clock to
PWM Ch 6
PCLK6
M
U
X
Clock to
PWM Ch 7
PCLK7
Prescale
Scale
Clock Select
Figure 12-18. PWM Clock Select Block Diagram
MC9S12XDP512 Data Sheet, Rev. 2.11
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Freescale Semiconductor
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Chapter 12 Pulse-Width Modulator (S12PWM8B8CV1)
Clock A is used as an input to an 8-bit down counter. This down counter loads a user programmable scale
value from the scale register (PWMSCLA). When the down counter reaches one, a pulse is output and the
8-bit counter is re-loaded. The output signal from this circuit is further divided by two. This gives a greater
range with only a slight reduction in granularity. Clock SA equals clock A divided by two times the value
in the PWMSCLA register.
NOTE
Clock SA = Clock A / (2 * PWMSCLA)
When PWMSCLA = $00, PWMSCLA value is considered a full scale value
of 256. Clock A is thus divided by 512.
Similarly, clock B is used as an input to an 8-bit down counter followed by a divide by two producing clock
SB. Thus, clock SB equals clock B divided by two times the value in the PWMSCLB register.
NOTE
Clock SB = Clock B / (2 * PWMSCLB)
When PWMSCLB = $00, PWMSCLB value is considered a full scale value
of 256. Clock B is thus divided by 512.
As an example, consider the case in which the user writes $FF into the PWMSCLA register. Clock A for
this case will be E divided by 4. A pulse will occur at a rate of once every 255x4 E cycles. Passing this
through the divide by two circuit produces a clock signal at an E divided by 2040 rate. Similarly, a value
of $01 in the PWMSCLA register when clock A is E divided by 4 will produce a clock at an E divided by
8 rate.
Writing to PWMSCLA or PWMSCLB causes the associated 8-bit down counter to be re-loaded.
Otherwise, when changing rates the counter would have to count down to $01 before counting at the proper
rate. Forcing the associated counter to re-load the scale register value every time PWMSCLA or
PWMSCLB is written prevents this.
NOTE
Writing to the scale registers while channels are operating can cause
irregularities in the PWM outputs.
12.4.1.3 Clock Select
Each PWM channel has the capability of selecting one of two clocks. For channels 0, 1, 4, and 5 the clock
choices are clock A or clock SA. For channels 2, 3, 6, and 7 the choices are clock B or clock SB. The clock
selection is done with the PCLKx control bits in the PWMCLK register.
NOTE
Changing clock control bits while channels are operating can cause
irregularities in the PWM outputs.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
581
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Chapter 12 Pulse-Width Modulator (S12PWM8B8CV1)
12.4.2 PWM Channel Timers
The main part of the PWM module are the actual timers. Each of the timer channels has a counter, a period
register and a duty register (each are 8-bit). The waveform output period is controlled by a match between
the period register and the value in the counter. The duty is controlled by a match between the duty register
and the counter value and causes the state of the output to change during the period. The starting polarity
of the output is also selectable on a per channel basis. Shown below in Figure 12-19 is the block diagram
for the PWM timer.
Clock Source
From Port PWMP
8-Bit Counter
Data Register
Gate
PWMCNTx
(Clock Edge
Sync)
Up/Down
Reset
8-bit Compare =
PWMDTYx
T
M
U
X
M
U
X
Q
Q
To Pin
Driver
R
8-bit Compare =
PWMPERx
PPOLx
T
Q
CAEx
Q
R
PWMEx
Figure 12-19. PWM Timer Channel Block Diagram
12.4.2.1 PWM Enable
Each PWM channel has an enable bit (PWMEx) to start its waveform output. When any of the PWMEx
bits are set (PWMEx = 1), the associated PWM output signal is enabled immediately. However, the actual
PWM waveform is not available on the associated PWM output until its clock source begins its next cycle
due to the synchronization of PWMEx and the clock source. An exception to this is when channels are
concatenated. Refer to Section 12.4.2.7, “PWM 16-Bit Functions” for more detail.
NOTE
The first PWM cycle after enabling the channel can be irregular.
MC9S12XDP512 Data Sheet, Rev. 2.11
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Freescale Semiconductor
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Chapter 12 Pulse-Width Modulator (S12PWM8B8CV1)
On the front end of the PWM timer, the clock is enabled to the PWM circuit by the PWMEx bit being high.
There is an edge-synchronizing circuit to guarantee that the clock will only be enabled or disabled at an
edge. When the channel is disabled (PWMEx = 0), the counter for the channel does not count.
12.4.2.2 PWM Polarity
Each channel has a polarity bit to allow starting a waveform cycle with a high or low signal. This is shown
on the block diagram as a mux select of either the Q output or the Q output of the PWM output flip flop.
When one of the bits in the PWMPOL register is set, the associated PWM channel output is high at the
beginning of the waveform, then goes low when the duty count is reached. Conversely, if the polarity bit
is zero, the output starts low and then goes high when the duty count is reached.
12.4.2.3 PWM Period and Duty
Dedicated period and duty registers exist for each channel and are double buffered so that if they change
while the channel is enabled, the change will NOT take effect until one of the following occurs:
•
•
•
The effective period ends
The counter is written (counter resets to $00)
The channel is disabled
In this way, the output of the PWM will always be either the old waveform or the new waveform, not some
variation in between. If the channel is not enabled, then writes to the period and duty registers will go
directly to the latches as well as the buffer.
A change in duty or period can be forced into effect “immediately” by writing the new value to the duty
and/or period registers and then writing to the counter. This forces the counter to reset and the new duty
and/or period values to be latched. In addition, since the counter is readable, it is possible to know where
the count is with respect to the duty value and software can be used to make adjustments
NOTE
When forcing a new period or duty into effect immediately, an irregular
PWM cycle can occur.
Depending on the polarity bit, the duty registers will contain the count of
either the high time or the low time.
12.4.2.4 PWM Timer Counters
Each channel has a dedicated 8-bit up/down counter which runs at the rate of the selected clock source (see
Section 12.4.1, “PWM Clock Select” for the available clock sources and rates). The counter compares to
two registers, a duty register and a period register as shown in Figure 12-19. When the PWM counter
matches the duty register, the output flip-flop changes state, causing the PWM waveform to also change
state. A match between the PWM counter and the period register behaves differently depending on what
output mode is selected as shown in Figure 12-19 and described in Section 12.4.2.5, “Left Aligned
Outputs” and Section 12.4.2.6, “Center Aligned Outputs”.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
583
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Chapter 12 Pulse-Width Modulator (S12PWM8B8CV1)
Each channel counter can be read at anytime without affecting the count or the operation of the PWM
channel.
Any value written to the counter causes the counter to reset to $00, the counter direction to be set to up,
the immediate load of both duty and period registers with values from the buffers, and the output to change
according to the polarity bit. When the channel is disabled (PWMEx = 0), the counter stops. When a
channel becomes enabled (PWMEx = 1), the associated PWM counter continues from the count in the
PWMCNTx register. This allows the waveform to continue where it left off when the channel is
re-enabled. When the channel is disabled, writing “0” to the period register will cause the counter to reset
on the next selected clock.
NOTE
If the user wants to start a new “clean” PWM waveform without any
“history” from the old waveform, the user must write to channel counter
(PWMCNTx) prior to enabling the PWM channel (PWMEx = 1).
Generally, writes to the counter are done prior to enabling a channel in order to start from a known state.
However, writing a counter can also be done while the PWM channel is enabled (counting). The effect is
similar to writing the counter when the channel is disabled, except that the new period is started
immediately with the output set according to the polarity bit.
NOTE
Writing to the counter while the channel is enabled can cause an irregular
PWM cycle to occur.
The counter is cleared at the end of the effective period (see Section 12.4.2.5, “Left Aligned Outputs” and
Section 12.4.2.6, “Center Aligned Outputs” for more details).
Table 12-10. PWM Timer Counter Conditions
Counter Clears ($00)
Counter Counts
Counter Stops
When PWMCNTx register written to
any value
When PWM channel is enabled
(PWMEx = 1). Counts from last value in
PWMCNTx.
When PWM channel is disabled
(PWMEx = 0)
Effective period ends
12.4.2.5 Left Aligned Outputs
The PWM timer provides the choice of two types of outputs, left aligned or center aligned. They are
selected with the CAEx bits in the PWMCAE register. If the CAEx bit is cleared (CAEx = 0), the
corresponding PWM output will be left aligned.
In left aligned output mode, the 8-bit counter is configured as an up counter only. It compares to two
registers, a duty register and a period register as shown in the block diagram in Figure 12-19. When the
PWM counter matches the duty register the output flip-flop changes state causing the PWM waveform to
output flip-flop, as shown in Figure 12-19, as well as performing a load from the double buffer period and
duty register to the associated registers, as described in Section 12.4.2.3, “PWM Period and Duty”. The
counter counts from 0 to the value in the period register – 1.
MC9S12XDP512 Data Sheet, Rev. 2.11
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Freescale Semiconductor
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Chapter 12 Pulse-Width Modulator (S12PWM8B8CV1)
NOTE
Changing the PWM output mode from left aligned to center aligned output
(or vice versa) while channels are operating can cause irregularities in the
PWM output. It is recommended to program the output mode before
enabling the PWM channel.
PPOLx = 0
PPOLx = 1
PWMDTYx
Period = PWMPERx
Figure 12-20. PWM Left Aligned Output Waveform
To calculate the output frequency in left aligned output mode for a particular channel, take the selected
clock source frequency for the channel (A, B, SA, or SB) and divide it by the value in the period register
for that channel.
•
•
PWMx Frequency = Clock (A, B, SA, or SB) / PWMPERx
PWMx Duty Cycle (high time as a% of period):
— Polarity = 0 (PPOLx = 0)
•
Duty Cycle = [(PWMPERx-PWMDTYx)/PWMPERx] * 100%
— Polarity = 1 (PPOLx = 1)
Duty Cycle = [PWMDTYx / PWMPERx] * 100%
As an example of a left aligned output, consider the following case:
Clock Source = E, where E = 10 MHz (100 ns period)
PPOLx = 0
PWMPERx = 4
PWMDTYx = 1
PWMx Frequency = 10 MHz/4 = 2.5 MHz
PWMx Period = 400 ns
The output waveform generated is shown in Figure 12-21.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
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Chapter 12 Pulse-Width Modulator (S12PWM8B8CV1)
E = 100 ns
Duty Cycle = 75%
Period = 400 ns
Figure 12-21. PWM Left Aligned Output Example Waveform
12.4.2.6 Center Aligned Outputs
For center aligned output mode selection, set the CAEx bit (CAEx = 1) in the PWMCAE register and the
corresponding PWM output will be center aligned.
The 8-bit counter operates as an up/down counter in this mode and is set to up whenever the counter is
equal to $00. The counter compares to two registers, a duty register and a period register as shown in the
block diagram in Figure 12-19. When the PWM counter matches the duty register, the output flip-flop
changes state, causing the PWM waveform to also change state. A match between the PWM counter and
the period register changes the counter direction from an up-count to a down-count. When the PWM
counter decrements and matches the duty register again, the output flip-flop changes state causing the
direction changes from a down-count back to an up-count and a load from the double buffer period and
duty registers to the associated registers is performed, as described in Section 12.4.2.3, “PWM Period and
Duty”. The counter counts from 0 up to the value in the period register and then back down to 0. Thus the
effective period is PWMPERx*2.
NOTE
Changing the PWM output mode from left aligned to center aligned output
(or vice versa) while channels are operating can cause irregularities in the
PWM output. It is recommended to program the output mode before
enabling the PWM channel.
PPOLx = 0
PPOLx = 1
PWMDTYx
PWMPERx
PWMDTYx
PWMPERx
Period = PWMPERx*2
Figure 12-22. PWM Center Aligned Output Waveform
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 12 Pulse-Width Modulator (S12PWM8B8CV1)
To calculate the output frequency in center aligned output mode for a particular channel, take the selected
clock source frequency for the channel (A, B, SA, or SB) and divide it by twice the value in the period
register for that channel.
•
•
PWMx Frequency = Clock (A, B, SA, or SB) / (2*PWMPERx)
PWMx Duty Cycle (high time as a% of period):
— Polarity = 0 (PPOLx = 0)
Duty Cycle = [(PWMPERx-PWMDTYx)/PWMPERx] * 100%
— Polarity = 1 (PPOLx = 1)
Duty Cycle = [PWMDTYx / PWMPERx] * 100%
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
587
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Chapter 12 Pulse-Width Modulator (S12PWM8B8CV1)
As an example of a center aligned output, consider the following case:
Clock Source = E, where E = 10 MHz (100 ns period)
PPOLx = 0
PWMPERx = 4
PWMDTYx = 1
PWMx Frequency = 10 MHz/8 = 1.25 MHz
PWMx Period = 800 ns
Shown in Figure 12-23 is the output waveform generated.
E = 100 ns
E = 100 ns
DUTY CYCLE = 75%
PERIOD = 800 ns
Figure 12-23. PWM Center Aligned Output Example Waveform
12.4.2.7 PWM 16-Bit Functions
The PWM timer also has the option of generating 8-channels of 8-bits or 4-channels of 16-bits for greater
PWM resolution. This 16-bit channel option is achieved through the concatenation of two 8-bit channels.
The PWMCTL register contains four control bits, each of which is used to concatenate a pair of PWM
channels into one 16-bit channel. Channels 6 and 7 are concatenated with the CON67 bit, channels 4 and
5 are concatenated with the CON45 bit, channels 2 and 3 are concatenated with the CON23 bit, and
channels 0 and 1 are concatenated with the CON01 bit.
NOTE
Change these bits only when both corresponding channels are disabled.
When channels 6 and 7 are concatenated, channel 6 registers become the high order bytes of the double
byte channel, as shown in Figure 12-24. Similarly, when channels 4 and 5 are concatenated, channel 4
registers become the high order bytes of the double byte channel. When channels 2 and 3 are concatenated,
channel 2 registers become the high order bytes of the double byte channel. When channels 0 and 1 are
concatenated, channel 0 registers become the high order bytes of the double byte channel.
When using the 16-bit concatenated mode, the clock source is determined by the low order 8-bit channel
clock select control bits. That is channel 7 when channels 6 and 7 are concatenated, channel 5 when
channels 4 and 5 are concatenated, channel 3 when channels 2 and 3 are concatenated, and channel 1 when
channels 0 and 1 are concatenated. The resulting PWM is output to the pins of the corresponding low order
8-bit channel as also shown in Figure 12-24. The polarity of the resulting PWM output is controlled by the
PPOLx bit of the corresponding low order 8-bit channel as well.
MC9S12XDP512 Data Sheet, Rev. 2.11
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Freescale Semiconductor
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Chapter 12 Pulse-Width Modulator (S12PWM8B8CV1)
Clock Source 7
High
Low
PWMCNT6
PWCNT7
PWM7
Period/Duty Compare
Clock Source 5
Clock Source 3
Clock Source 1
High
Low
PWMCNT4
PWCNT5
PWM5
PWM3
PWM1
Period/Duty Compare
High
Low
PWMCNT2
PWCNT3
Period/Duty Compare
High
Low
PWMCNT0
PWCNT1
Period/Duty Compare
Figure 12-24. PWM 16-Bit Mode
Once concatenated mode is enabled (CONxx bits set in PWMCTL register), enabling/disabling the
corresponding 16-bit PWM channel is controlled by the low order PWMEx bit. In this case, the high order
bytes PWMEx bits have no effect and their corresponding PWM output is disabled.
In concatenated mode, writes to the 16-bit counter by using a 16-bit access or writes to either the low or
high order byte of the counter will reset the 16-bit counter. Reads of the 16-bit counter must be made by
16-bit access to maintain data coherency.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
589
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Chapter 12 Pulse-Width Modulator (S12PWM8B8CV1)
Either left aligned or center aligned output mode can be used in concatenated mode and is controlled by
Table 12-11 is used to summarize which channels are used to set the various control bits when in 16-bit
mode.
Table 12-11. 16-bit Concatenation Mode Summary
PWMx
Output
CONxx
PWMEx
PPOLx
PCLKx
CAEx
CON67
CON45
CON23
CON01
PWME7
PWME5
PWME3
PWME1
PPOL7
PPOL5
PPOL3
PPOL1
PCLK7
PCLK5
PCLK3
PCLK1
CAE7
CAE5
CAE3
CAE1
PWM7
PWM5
PWM3
PWM1
12.4.2.8 PWM Boundary Cases
Table 12-12 summarizes the boundary conditions for the PWM regardless of the output mode (left aligned
or center aligned) and 8-bit (normal) or 16-bit (concatenation).
Table 12-12. PWM Boundary Cases
PWMDTYx
PWMPERx
PPOLx
PWMx Output
$00
>$00
1
Always low
(indicates no duty)
$00
>$00
0
1
0
Always high
Always high
Always low
(indicates no duty)
1
XX
$00
(indicates no period)
1
XX
$00
(indicates no period)
>= PWMPERx
>= PWMPERx
XX
XX
1
0
Always high
Always low
1
Counter = $00 and does not count.
12.5 Resets
The reset state of each individual bit is listed within the Section 12.3.2, “Register Descriptions” which
details the registers and their bit-fields. All special functions or modes which are initialized during or just
following reset are described within this section.
•
•
The 8-bit up/down counter is configured as an up counter out of reset.
All the channels are disabled and all the counters do not count.
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Chapter 12 Pulse-Width Modulator (S12PWM8B8CV1)
12.6 Interrupts
The PWM module has only one interrupt which is generated at the time of emergency shutdown, if the
corresponding enable bit (PWMIE) is set. This bit is the enable for the interrupt. The interrupt flag PWMIF
is set whenever the input level of the PWM7 channel changes while PWM7ENA = 1 or when PWMENA
is being asserted while the level at PWM7 is active.
In stop mode or wait mode (with the PSWAI bit set), the emergency shutdown feature will drive the PWM
outputs to their shutdown output levels but the PWMIF flag will not be set.
A description of the registers involved and affected due to this interrupt is explained in Section 12.3.2.15,
“PWM Shutdown Register (PWMSDN)”.
The PWM block only generates the interrupt and does not service it. The interrupt signal name is PWM
interrupt signal.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
591
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Chapter 12 Pulse-Width Modulator (S12PWM8B8CV1)
MC9S12XDP512 Data Sheet, Rev. 2.11
592
Freescale Semiconductor
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Chapter 13
Inter-Integrated Circuit (MC9S12XDP512) Block Description
13.1 Introduction
The inter-IC bus (IIC) is a two-wire, bidirectional serial bus that provides a simple, efficient method of data
exchange between devices. Being a two-wire device, the IIC bus minimizes the need for large numbers of
connections between devices, and eliminates the need for an address decoder.
This bus is suitable for applications requiring occasional communications over a short distance between a
number of devices. It also provides flexibility, allowing additional devices to be connected to the bus for
further expansion and system development.
The interface is designed to operate up to 100 kbps with maximum bus loading and timing. The device is
capable of operating at higher baud rates, up to a maximum of clock/20, with reduced bus loading. The
maximum communication length and the number of devices that can be connected are limited by a
maximum bus capacitance of 400 pF.
13.1.1 Features
The IIC module has the following key features:
•
•
•
•
•
•
•
•
•
•
•
Compatible with I2C bus standard
Multi-master operation
Software programmable for one of 256 different serial clock frequencies
Software selectable acknowledge bit
Interrupt driven byte-by-byte data transfer
Arbitration lost interrupt with automatic mode switching from master to slave
Calling address identification interrupt
Start and stop signal generation/detection
Repeated start signal generation
Acknowledge bit generation/detection
Bus busy detection
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
593
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Chapter 13 Inter-Integrated Circuit (MC9S12XDP512) Block Description
13.1.2 Modes of Operation
The IIC functions the same in normal, special, and emulation modes. It has two low power modes: wait
and stop modes.
13.1.3 Block Diagram
The block diagram of the IIC module is shown in Figure 13-1.
IIC
Start
Stop
Arbitration
Registers
Control
Interrupt
In/Out
Data
Shift
SCL
Clock
Control
bus_clock
SDA
Register
Address
Compare
Figure 13-1. IIC Block Diagram
MC9S12XDP512 Data Sheet, Rev. 2.11
594
Freescale Semiconductor
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Chapter 13 Inter-Integrated Circuit (MC9S12XDP512) Block Description
13.2 External Signal Description
The MC9S12XDP512 module has two external pins.
13.2.1 IIC_SCL — Serial Clock Line Pin
This is the bidirectional serial clock line (SCL) of the module, compatible to the IIC bus specification.
13.2.2 IIC_SDA — Serial Data Line Pin
This is the bidirectional serial data line (SDA) of the module, compatible to the IIC bus specification.
13.3 Memory Map and Register Definition
This section provides a detailed description of all memory and registers for the IIC module.
13.3.1 Module Memory Map
The memory map for the IIC module is given below in Table 13-1. The address listed for each register is
the address offset.The total address for each register is the sum of the base address for the IIC module and
the address offset for each register.
Table 13-1. IIC Memory Map
Address
Offset
Use
Access
0x0000
0x0001
0x0002
0x0003
0x0004
IIC-Bus Address Register (IBAD)
R/W
R/W
R/W
R/W
R/W
IIC-Bus Frequency Divider Register (IBFD)
IIC-Bus Control Register (IBCR)
IIC-Bus Status Register (IBSR)
IIC-Bus Data I/O Register (IBDR)
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
595
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Chapter 13 Inter-Integrated Circuit (MC9S12XDP512) Block Description
13.3.2 Register Descriptions
This section consists of register descriptions in address order. Each description includes a standard register
diagram with an associated figure number. Details of register bit and field function follow the register
diagrams, in bit order.
Register
Name
Bit 7
6
5
4
3
2
1
Bit 0
0x0000
IBAD
R
0
ADR7
ADR6
ADR5
ADR4
ADR3
ADR2
ADR1
W
0x0001
IBFD
R
IBC7
IBC6
IBC5
IBC4
Tx/Rx
IBAL
D4
IBC3
IBC2
IBC1
0
IBC0
W
0x0002
IBCR
R
0
IBEN
TCF
IBIE
MS/SL
IBB
TXAK
0
IBSWAI
RXAK
W
RSTA
0x0003
IBSR
R
IAAS
SRW
D2
IBIF
D1
W
0x0004
IBDR
R
D7
D6
D5
D3
D0
W
= Unimplemented or Reserved
Figure 13-2. IIC Register Summary
13.3.2.1 IIC Address Register (IBAD)
Offset Module Base +0x0000
7
6
5
4
3
2
1
0
R
W
0
ADR7
ADR6
ADR5
ADR4
ADR3
ADR2
ADR1
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 13-3. IIC Bus Address Register (IBAD)
Read and write anytime
This register contains the address the IIC bus will respond to when addressed as a slave; note that it is not
the address sent on the bus during the address transfer.
MC9S12XDP512 Data Sheet, Rev. 2.11
596
Freescale Semiconductor
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Chapter 13 Inter-Integrated Circuit (MC9S12XDP512) Block Description
Table 13-2. IBAD Field Descriptions
Field
Description
7:1
Slave Address — Bit 1 to bit 7 contain the specific slave address to be used by the IIC bus module.The default
ADR[7:1]
mode of IIC bus is slave mode for an address match on the bus.
0
Reserved — Bit 0 of the IBAD is reserved for future compatibility. This bit will always read 0.
Reserved
13.3.2.2 IIC Frequency Divider Register (IBFD)
Offset Module Base + 0x0001
7
6
5
4
3
2
1
0
R
W
IBC7
IBC6
IBC5
IBC4
IBC3
IBC2
IBC1
IBC0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 13-4. IIC Bus Frequency Divider Register (IBFD)
Read and write anytime
Table 13-3. IBFD Field Descriptions
Description
Field
7:0
IBC[7:0]
I Bus Clock Rate 7:0 — This field is used to prescale the clock for bit rate selection. The bit clock generator is
implemented as a prescale divider — IBC7:6, prescaled shift register — IBC5:3 select the prescaler divider and
IBC2-0 select the shift register tap point. The IBC bits are decoded to give the tap and prescale values as shown
in Table 13-4.
Table 13-4. I-Bus Tap and Prescale Values
IBC2-0
(bin)
SCL Tap
(clocks)
SDA Tap
(clocks)
000
001
010
011
100
101
110
111
5
6
1
1
2
2
3
3
4
4
7
8
9
10
12
15
IBC5-3
(bin)
scl2start
(clocks)
scl2stop
(clocks)
scl2tap
(clocks)
tap2tap
(clocks)
000
001
2
2
7
7
4
4
1
2
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
597
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Chapter 13 Inter-Integrated Circuit (MC9S12XDP512) Block Description
IBC5-3
(bin)
scl2start
(clocks)
scl2stop
(clocks)
scl2tap
(clocks)
tap2tap
(clocks)
010
011
100
101
110
111
2
6
9
9
6
6
4
8
14
30
62
126
17
33
65
129
14
30
62
126
16
32
64
128
Table 13-5. Multiplier Factor
IBC7-6
MUL
00
01
10
11
01
02
04
RESERVED
The number of clocks from the falling edge of SCL to the first tap (Tap[1]) is defined by the values shown
IBC5-3
in the scl2tap column of Table 13-4, all subsequent tap points are separated by 2
as shown in the
tap2tap column in Table 13-4. The SCL Tap is used to generated the SCL period and the SDA Tap is used
to determine the delay from the falling edge of SCL to SDA changing, the SDA hold time.
IBC7–6 defines the multiplier factor MUL. The values of MUL are shown in the Table 13-5.
SCL Divider
SCL
SDA Hold
SDA
MC9S12XDP512 Data Sheet, Rev. 2.11
598
Freescale Semiconductor
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Chapter 13 Inter-Integrated Circuit (MC9S12XDP512) Block Description
SDA
SCL
SCL Hold(stop)
SCL Hold(start)
START condition
STOP condition
Figure 13-5. SCL Divider and SDA Hold
The equation used to generate the divider values from the IBFD bits is:
SCL Divider = MUL x {2 x (scl2tap + [(SCL_Tap -1) x tap2tap] + 2)}
The SDA hold delay is equal to the CPU clock period multiplied by the SDA Hold value shown in
Table 13-6. The equation used to generate the SDA Hold value from the IBFD bits is:
SDA Hold = MUL x {scl2tap + [(SDA_Tap - 1) x tap2tap] + 3}
The equation for SCL Hold values to generate the start and stop conditions from the IBFD bits is:
SCL Hold(start) = MUL x [scl2start + (SCL_Tap - 1) x tap2tap]
SCL Hold(stop) = MUL x [scl2stop + (SCL_Tap - 1) x tap2tap]
Table 13-6. IIC Divider and Hold Values (Sheet 1 of 5)
IBC[7:0]
(hex)
SCL Divider
(clocks)
SDA Hold
(clocks)
SCL Hold
(start)
SCL Hold
(stop)
MUL=1
00
01
02
03
04
05
06
07
08
09
0A
0B
0C
0D
0E
0F
10
20
22
24
26
28
30
34
40
28
32
36
40
44
48
56
68
48
7
7
6
11
12
13
14
15
16
18
21
15
17
19
21
23
25
29
35
25
7
8
8
8
9
9
10
11
13
16
10
12
14
16
18
20
24
30
18
9
10
10
7
7
9
9
11
11
13
13
9
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
599
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Chapter 13 Inter-Integrated Circuit (MC9S12XDP512) Block Description
Table 13-6. IIC Divider and Hold Values (Sheet 2 of 5)
IBC[7:0]
(hex)
SCL Divider
(clocks)
SDA Hold
(clocks)
SCL Hold
(start)
SCL Hold
(stop)
11
12
13
14
15
16
17
18
19
1A
1B
1C
1D
1E
1F
20
21
22
23
24
25
26
27
28
29
2A
2B
2C
2D
2E
2F
30
31
32
33
34
35
36
37
38
39
3A
3B
3C
3D
56
64
9
22
26
29
33
13
72
13
30
37
80
17
34
41
88
17
38
45
104
128
80
21
46
53
21
58
65
9
38
41
96
9
46
49
112
128
144
160
192
240
160
192
224
256
288
320
384
480
320
384
448
512
576
640
768
960
640
768
896
1024
1152
1280
1536
1920
1280
1536
1792
2048
2304
2560
17
54
57
17
62
65
25
70
73
25
78
81
33
94
97
33
118
78
121
81
17
17
94
97
33
110
126
142
158
190
238
158
190
222
254
286
318
382
478
318
382
446
510
574
638
766
958
638
766
894
1022
1150
1278
113
129
145
161
193
241
161
193
225
257
289
321
385
481
321
385
449
513
577
641
769
961
641
769
897
1025
1153
1281
33
49
49
65
65
33
33
65
65
97
97
129
129
65
65
129
129
193
193
257
257
129
129
257
257
385
385
MC9S12XDP512 Data Sheet, Rev. 2.11
600
Freescale Semiconductor
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Chapter 13 Inter-Integrated Circuit (MC9S12XDP512) Block Description
Table 13-6. IIC Divider and Hold Values (Sheet 3 of 5)
IBC[7:0]
(hex)
SCL Divider
(clocks)
SDA Hold
(clocks)
SCL Hold
(start)
SCL Hold
(stop)
3E
3F
3072
3840
513
513
1534
1918
1537
1921
MUL=2
40
41
42
43
44
45
46
47
48
49
4A
4B
4C
4D
4E
4F
50
51
52
53
54
55
56
57
58
59
5A
5B
5C
5D
5E
5F
60
61
62
63
64
65
66
67
68
69
40
44
14
14
16
16
18
18
20
20
14
14
18
18
22
22
26
26
18
18
26
26
34
34
42
42
18
18
34
34
50
50
66
66
34
34
66
66
98
98
130
130
66
66
12
14
22
24
48
16
26
52
18
28
56
20
30
60
22
32
68
26
36
80
32
42
56
20
30
64
24
34
72
28
38
80
32
42
88
36
46
96
40
50
112
136
96
48
58
60
70
36
50
112
128
144
160
176
208
256
160
192
224
256
288
320
384
480
320
384
448
512
576
640
768
960
640
768
44
58
52
66
60
74
68
82
76
90
92
106
130
82
116
76
92
98
108
124
140
156
188
236
156
188
220
252
284
316
380
476
316
380
114
130
146
162
194
242
162
194
226
258
290
322
386
482
322
386
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
601
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Chapter 13 Inter-Integrated Circuit (MC9S12XDP512) Block Description
Table 13-6. IIC Divider and Hold Values (Sheet 4 of 5)
IBC[7:0]
(hex)
SCL Divider
(clocks)
SDA Hold
(clocks)
SCL Hold
(start)
SCL Hold
(stop)
6A
6B
6C
6D
6E
6F
70
71
72
73
74
75
76
77
78
79
7A
7B
7C
7D
7E
7F
896
130
130
194
194
258
258
130
130
258
258
386
386
514
514
258
258
514
514
770
770
1026
1026
444
508
450
514
1024
1152
1280
1536
1920
1280
1536
1792
2048
2304
2560
3072
3840
2560
3072
3584
4096
4608
5120
6144
7680
572
578
636
642
764
770
956
962
636
642
764
770
892
898
1020
1148
1276
1532
1916
1276
1532
1788
2044
2300
2556
3068
3836
1026
1154
1282
1538
1922
1282
1538
1794
2050
2306
2562
3074
3842
MUL=4
80
81
82
83
84
85
86
87
88
89
8A
8B
8C
8D
8E
8F
90
91
92
93
94
95
80
28
28
32
32
36
36
40
40
28
28
36
36
44
44
52
52
36
36
52
52
68
68
24
28
44
48
88
96
32
52
104
112
120
136
160
112
128
144
160
176
192
224
272
192
224
256
288
320
352
36
56
40
60
44
64
52
72
64
84
40
60
48
68
56
76
64
84
72
92
80
100
116
140
100
116
132
148
164
180
96
120
72
88
104
120
136
152
MC9S12XDP512 Data Sheet, Rev. 2.11
602
Freescale Semiconductor
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Chapter 13 Inter-Integrated Circuit (MC9S12XDP512) Block Description
Table 13-6. IIC Divider and Hold Values (Sheet 5 of 5)
IBC[7:0]
(hex)
SCL Divider
(clocks)
SDA Hold
(clocks)
SCL Hold
(start)
SCL Hold
(stop)
96
97
416
512
84
84
184
232
212
260
98
320
36
152
164
99
384
36
184
196
9A
9B
9C
9D
9E
9F
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
AA
AB
AC
AD
AE
AF
B0
B1
B2
B3
B4
B5
B6
B7
B8
B9
BA
BB
BC
BD
BE
BF
448
68
216
228
512
68
248
260
576
100
100
132
132
68
280
292
640
312
324
768
376
388
960
472
484
640
312
324
768
68
376
388
896
132
132
196
196
260
260
132
132
260
260
388
388
516
516
260
260
516
516
772
772
1028
1028
516
516
1028
1028
1540
1540
2052
2052
440
452
1024
1152
1280
1536
1920
1280
1536
1792
2048
2304
2560
3072
3840
2560
3072
3584
4096
4608
5120
6144
7680
5120
6144
7168
8192
9216
10240
12288
15360
504
516
568
580
632
644
760
772
952
964
632
644
760
772
888
900
1016
1144
1272
1528
1912
1272
1528
1784
2040
2296
2552
3064
3832
2552
3064
3576
4088
4600
5112
6136
7672
1028
1156
1284
1540
1924
1284
1540
1796
2052
2308
2564
3076
3844
2564
3076
3588
4100
4612
5124
6148
7684
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
603
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Chapter 13 Inter-Integrated Circuit (MC9S12XDP512) Block Description
13.3.2.3 IIC Control Register (IBCR)
Offset Module Base + 0x0002
7
6
5
4
3
2
1
0
R
W
0
0
IBEN
IBIE
MS/SL
Tx/Rx
TXAK
IBSWAI
RSTA
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 13-6. IIC Bus Control Register (IBCR)
Read and write anytime
Table 13-7. IBCR Field Descriptions
Description
Field
7
I-Bus Enable — This bit controls the software reset of the entire IIC bus module.
IBEN
0 The module is reset and disabled. This is the power-on reset situation. When low the interface is held in reset
but registers can be accessed
1 The IIC bus module is enabled.This bit must be set before any other IBCR bits have any effect
If the IIC bus module is enabled in the middle of a byte transfer the interface behaves as follows: slave mode
ignores the current transfer on the bus and starts operating whenever a subsequent start condition is detected.
Master mode will not be aware that the bus is busy, hence if a start cycle is initiated then the current bus cycle
may become corrupt. This would ultimately result in either the current bus master or the IIC bus module losing
arbitration, after which bus operation would return to normal.
6
I-Bus Interrupt Enable
IBIE
0
Interrupts from the IIC bus module are disabled. Note that this does not clear any currently pending interrupt
condition
1 Interrupts from the IIC bus module are enabled. An IIC bus interrupt occurs provided the IBIF bit in the status
register is also set.
5
Master/Slave Mode Select Bit — Upon reset, this bit is cleared. When this bit is changed from 0 to 1, a START
MS/SL
signal is generated on the bus, and the master mode is selected. When this bit is changed from 1 to 0, a STOP
signal is generated and the operation mode changes from master to slave.A STOP signal should only be
generated if the IBIF flag is set. MS/SL is cleared without generating a STOP signal when the master loses
arbitration.
0 Slave Mode
1 Master Mode
4
Transmit/Receive Mode Select Bit — This bit selects the direction of master and slave transfers. When
Tx/Rx
addressed as a slave this bit should be set by software according to the SRW bit in the status register. In master
mode this bit should be set according to the type of transfer required. Therefore, for address cycles, this bit will
always be high.
0 Receive
1 Transmit
3
Transmit Acknowledge Enable — This bit specifies the value driven onto SDA during data acknowledge cycles
for both master and slave receivers. The IIC module will always acknowledge address matches, provided it is
enabled, regardless of the value of TXAK. Note that values written to this bit are only used when the IIC bus is a
receiver, not a transmitter.
TXAK
0 An acknowledge signal will be sent out to the bus at the 9th clock bit after receiving one byte data
1 No acknowledge signal response is sent (i.e., acknowledge bit = 1)
MC9S12XDP512 Data Sheet, Rev. 2.11
604
Freescale Semiconductor
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Chapter 13 Inter-Integrated Circuit (MC9S12XDP512) Block Description
Table 13-7. IBCR Field Descriptions (continued)
Field
Description
2
Repeat Start — Writing a 1 to this bit will generate a repeated START condition on the bus, provided it is the
current bus master. This bit will always be read as a low. Attempting a repeated start at the wrong time, if the bus
is owned by another master, will result in loss of arbitration.
RSTA
1 Generate repeat start cycle
1
Reserved — Bit 1 of the IBCR is reserved for future compatibility. This bit will always read 0.
RESERVED
0
I Bus Interface Stop in Wait Mode
IBSWAI
0 IIC bus module clock operates normally
1 Halt IIC bus module clock generation in wait mode
Wait mode is entered via execution of a CPU WAI instruction. In the event that the IBSWAI bit is set, all
clocks internal to the IIC will be stopped and any transmission currently in progress will halt.If the CPU
were woken up by a source other than the IIC module, then clocks would restart and the IIC would resume
from where was during the previous transmission. It is not possible for the IIC to wake up the CPU when
its internal clocks are stopped.
If it were the case that the IBSWAI bit was cleared when the WAI instruction was executed, the IIC internal
clocks and interface would remain alive, continuing the operation which was currently underway. It is also
possible to configure the IIC such that it will wake up the CPU via an interrupt at the conclusion of the
current operation. See the discussion on the IBIF and IBIE bits in the IBSR and IBCR, respectively.
13.3.2.4 IIC Status Register (IBSR)
Offset Module Base + 0x0003
7
6
5
4
3
2
1
0
R
W
TCF
IAAS
IBB
0
SRW
RXAK
IBAL
IBIF
Reset
1
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 13-7. IIC Bus Status Register (IBSR)
This status register is read-only with exception of bit 1 (IBIF) and bit 4 (IBAL), which are software
clearable.
Table 13-8. IBSR Field Descriptions
Field
Description
7
Data Transferring Bit — While one byte of data is being transferred, this bit is cleared. It is set by the falling
TCF
edge of the 9th clock of a byte transfer. Note that this bit is only valid during or immediately following a transfer
to the IIC module or from the IIC module.
0 Transfer in progress
1 Transfer complete
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
605
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Chapter 13 Inter-Integrated Circuit (MC9S12XDP512) Block Description
Table 13-8. IBSR Field Descriptions (continued)
Field
Description
6
Addressed as a Slave Bit — When its own specific address (I-bus address register) is matched with the calling
address, this bit is set.The CPU is interrupted provided the IBIE is set.Then the CPU needs to check the SRW
bit and set its Tx/Rx mode accordingly.Writing to the I-bus control register clears this bit.
0 Not addressed
IAAS
1 Addressed as a slave
5
Bus Busy Bit
IBB
0 This bit indicates the status of the bus. When a START signal is detected, the IBB is set. If a STOP signal is
detected, IBB is cleared and the bus enters idle state.
1 Bus is busy
4
IBAL
Arbitration Lost — The arbitration lost bit (IBAL) is set by hardware when the arbitration procedure is lost.
Arbitration is lost in the following circumstances:
1. SDA sampled low when the master drives a high during an address or data transmit cycle.
2. SDA sampled low when the master drives a high during the acknowledge bit of a data receive cycle.
3. A start cycle is attempted when the bus is busy.
4. A repeated start cycle is requested in slave mode.
5. A stop condition is detected when the master did not request it.
This bit must be cleared by software, by writing a one to it. A write of 0 has no effect on this bit.
3
Reserved — Bit 3 of IBSR is reserved for future use. A read operation on this bit will return 0.
RESERVED
2
Slave Read/Write — When IAAS is set this bit indicates the value of the R/W command bit of the calling address
sent from the master
SRW
This bit is only valid when the I-bus is in slave mode, a complete address transfer has occurred with an address
match and no other transfers have been initiated.
Checking this bit, the CPU can select slave transmit/receive mode according to the command of the master.
0 Slave receive, master writing to slave
1 Slave transmit, master reading from slave
1
IBIF
I-Bus Interrupt — The IBIF bit is set when one of the following conditions occurs:
— Arbitration lost (IBAL bit set)
— Byte transfer complete (TCF bit set)
— Addressed as slave (IAAS bit set)
It will cause a processor interrupt request if the IBIE bit is set. This bit must be cleared by software, writing a one
to it. A write of 0 has no effect on this bit.
0
Received Acknowledge — The value of SDA during the acknowledge bit of a bus cycle. If the received
acknowledge bit (RXAK) is low, it indicates an acknowledge signal has been received after the completion of 8
bits data transmission on the bus. If RXAK is high, it means no acknowledge signal is detected at the 9th clock.
0 Acknowledge received
RXAK
1 No acknowledge received
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 13 Inter-Integrated Circuit (MC9S12XDP512) Block Description
13.3.2.5 IIC Data I/O Register (IBDR)
Offset Module Base + 0x0004
7
6
5
4
3
2
1
0
R
W
D7
D6
D5
D4
D3
D2
D1
D0
Reset
0
0
0
0
0
0
0
0
Figure 13-8. IIC Bus Data I/O Register (IBDR)
In master transmit mode, when data is written to the IBDR a data transfer is initiated. The most significant
bit is sent first. In master receive mode, reading this register initiates next byte data receiving. In slave
mode, the same functions are available after an address match has occurred.Note that the Tx/Rx bit in the
IBCR must correctly reflect the desired direction of transfer in master and slave modes for the transmission
to begin. For instance, if the IIC is configured for master transmit but a master receive is desired, then
reading the IBDR will not initiate the receive.
Reading the IBDR will return the last byte received while the IIC is configured in either master receive or
slave receive modes. The IBDR does not reflect every byte that is transmitted on the IIC bus, nor can
software verify that a byte has been written to the IBDR correctly by reading it back.
In master transmit mode, the first byte of data written to IBDR following assertion of MS/SL is used for
the address transfer and should com.prise of the calling address (in position D7:D1) concatenated with the
required R/W bit (in position D0).
13.4 Functional Description
This section provides a complete functional description of the MC9S12XDP512.
13.4.1
I-Bus Protocol
The IIC bus system uses a serial data line (SDA) and a serial clock line (SCL) for data transfer. All devices
connected to it must have open drain or open collector outputs. Logic AND function is exercised on both
lines with external pull-up resistors. The value of these resistors is system dependent.
Normally, a standard communication is composed of four parts: START signal, slave address transmission,
data transfer and STOP signal. They are described briefly in the following sections and illustrated in
Figure 13-9.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
607
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Chapter 13 Inter-Integrated Circuit (MC9S12XDP512) Block Description
MSB
1
LSB
8
MSB
1
LSB
8
SCL
SDA
2
3
4
5
6
7
9
2
3
4
5
6
7
9
AD7 AD6 AD5 AD4 AD3 AD2 AD1 R/W
XXX
D7 D6 D5 D4 D3 D2 D1 D0
Start
Signal
Calling Address
Read/ Ack
Bit
Data Byte
No Stop
Ack Signal
Bit
Write
MSB
1
LSB
MSB
LSB
8
SCL
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
9
SDA
AD7 AD6 AD5 AD4 AD3 AD2 AD1 R/W
XX
AD7 AD6 AD5 AD4 AD3 AD2 AD1 R/W
Start
Signal
Calling Address
Read/ Ack
Bit
Repeated
Start
Signal
New Calling Address
No Stop
Ack Signal
Bit
Read/
Write
Write
Figure 13-9. IIC-Bus Transmission Signals
13.4.1.1 START Signal
When the bus is free, i.e. no master device is engaging the bus (both SCL and SDA lines are at logical
high), a master may initiate communication by sending a START signal.As shown in Figure 13-9, a
START signal is defined as a high-to-low transition of SDA while SCL is high. This signal denotes the
beginning of a new data transfer (each data transfer may contain several bytes of data) and brings all slaves
out of their idle states.
SDA
SCL
START Condition
STOP Condition
Figure 13-10. Start and Stop Conditions
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 13 Inter-Integrated Circuit (MC9S12XDP512) Block Description
13.4.1.2 Slave Address Transmission
The first byte of data transfer immediately after the START signal is the slave address transmitted by the
master. This is a seven-bit calling address followed by a R/W bit. The R/W bit tells the slave the desired
direction of data transfer.
1 = Read transfer, the slave transmits data to the master.
0 = Write transfer, the master transmits data to the slave.
Only the slave with a calling address that matches the one transmitted by the master will respond by
sending back an acknowledge bit. This is done by pulling the SDA low at the 9th clock (see Figure 13-9).
No two slaves in the system may have the same address. If the IIC bus is master, it must not transmit an
address that is equal to its own slave address. The IIC bus cannot be master and slave at the same
time.However, if arbitration is lost during an address cycle the IIC bus will revert to slave mode and operate
correctly even if it is being addressed by another master.
13.4.1.3 Data Transfer
As soon as successful slave addressing is achieved, the data transfer can proceed byte-by-byte in a
direction specified by the R/W bit sent by the calling master
All transfers that come after an address cycle are referred to as data transfers, even if they carry sub-address
information for the slave device.
Each data byte is 8 bits long. Data may be changed only while SCL is low and must be held stable while
SCL is high as shown in Figure 13-9. There is one clock pulse on SCL for each data bit, the MSB being
transferred first. Each data byte has to be followed by an acknowledge bit, which is signalled from the
receiving device by pulling the SDA low at the ninth clock. So one complete data byte transfer needs nine
clock pulses.
If the slave receiver does not acknowledge the master, the SDA line must be left high by the slave. The
master can then generate a stop signal to abort the data transfer or a start signal (repeated start) to
commence a new calling.
If the master receiver does not acknowledge the slave transmitter after a byte transmission, it means 'end
of data' to the slave, so the slave releases the SDA line for the master to generate STOP or START signal.
13.4.1.4 STOP Signal
The master can terminate the communication by generating a STOP signal to free the bus. However, the
master may generate a START signal followed by a calling command without generating a STOP signal
first. This is called repeated START. A STOP signal is defined as a low-to-high transition of SDA while
SCL at logical 1 (see Figure 13-9).
The master can generate a STOP even if the slave has generated an acknowledge at which point the slave
must release the bus.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
609
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Chapter 13 Inter-Integrated Circuit (MC9S12XDP512) Block Description
13.4.1.5 Repeated START Signal
As shown in Figure 13-9, a repeated START signal is a START signal generated without first generating a
STOP signal to terminate the communication. This is used by the master to communicate with another
slave or with the same slave in different mode (transmit/receive mode) without releasing the bus.
13.4.1.6 Arbitration Procedure
The Inter-IC bus is a true multi-master bus that allows more than one master to be connected on it. If two
or more masters try to control the bus at the same time, a clock synchronization procedure determines the
bus clock, for which the low period is equal to the longest clock low period and the high is equal to the
shortest one among the masters. The relative priority of the contending masters is determined by a data
arbitration procedure, a bus master loses arbitration if it transmits logic 1 while another master transmits
logic 0. The losing masters immediately switch over to slave receive mode and stop driving SDA output.
In this case the transition from master to slave mode does not generate a STOP condition. Meanwhile, a
status bit is set by hardware to indicate loss of arbitration.
13.4.1.7 Clock Synchronization
Because wire-AND logic is performed on SCL line, a high-to-low transition on SCL line affects all the
devices connected on the bus. The devices start counting their low period and as soon as a device's clock
has gone low, it holds the SCL line low until the clock high state is reached.However, the change of low to
high in this device clock may not change the state of the SCL line if another device clock is within its low
period. Therefore, synchronized clock SCL is held low by the device with the longest low period. Devices
with shorter low periods enter a high wait state during this time (see Figure 13-10). When all devices
concerned have counted off their low period, the synchronized clock SCL line is released and pulled high.
There is then no difference between the device clocks and the state of the SCL line and all the devices start
counting their high periods.The first device to complete its high period pulls the SCL line low again.
Start Counting High Period
WAIT
SCL1
SCL2
SCL
Internal Counter Reset
Figure 13-11. IIC-Bus Clock Synchronization
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 13 Inter-Integrated Circuit (MC9S12XDP512) Block Description
13.4.1.8 Handshaking
The clock synchronization mechanism can be used as a handshake in data transfer. Slave devices may hold
the SCL low after completion of one byte transfer (9 bits). In such case, it halts the bus clock and forces
the master clock into wait states until the slave releases the SCL line.
13.4.1.9 Clock Stretching
The clock synchronization mechanism can be used by slaves to slow down the bit rate of a transfer. After
the master has driven SCL low the slave can drive SCL low for the required period and then release it.If
the slave SCL low period is greater than the master SCL low period then the resulting SCL bus signal low
period is stretched.
13.4.2 Operation in Run Mode
This is the basic mode of operation.
13.4.3 Operation in Wait Mode
IIC operation in wait mode can be configured. Depending on the state of internal bits, the IIC can operate
normally when the CPU is in wait mode or the IIC clock generation can be turned off and the IIC module
enters a power conservation state during wait mode. In the later case, any transmission or reception in
progress stops at wait mode entry.
13.4.4 Operation in Stop Mode
The IIC is inactive in stop mode for reduced power consumption. The STOP instruction does not affect IIC
register states.
13.5 Resets
The reset state of each individual bit is listed in Section 13.3, “Memory Map and Register Definition,”
which details the registers and their bit-fields.
13.6 Interrupts
MC9S12XDP512 uses only one interrupt vector.
Table 13-9. Interrupt Summary
Interrupt Offset
Vector
Priority
Source
Description
IIC
—
—
—
IBAL, TCF, IAAS When either of IBAL, TCF or IAAS bits is set
Interrupt
bits in IBSR
register
may cause an interrupt based on arbitration
lost, transfer complete or address detect
conditions
Internally there are three types of interrupts in IIC. The interrupt service routine can determine the interrupt
type by reading the status register.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
611
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Chapter 13 Inter-Integrated Circuit (MC9S12XDP512) Block Description
IIC Interrupt can be generated on
1. Arbitration lost condition (IBAL bit set)
2. Byte transfer condition (TCF bit set)
3. Address detect condition (IAAS bit set)
The IIC interrupt is enabled by the IBIE bit in the IIC control register. It must be cleared by writing 0 to
the IBF bit in the interrupt service routine.
13.7 Initialization/Application Information
13.7.1 IIC Programming Examples
13.7.1.1 Initialization Sequence
Reset will put the IIC bus control register to its default status. Before the interface can be used to transfer
serial data, an initialization procedure must be carried out, as follows:
1. Update the frequency divider register (IBFD) and select the required division ratio to obtain SCL
frequency from system clock.
2. Update the IIC bus address register (IBAD) to define its slave address.
3. Set the IBEN bit of the IIC bus control register (IBCR) to enable the IIC interface system.
4. Modify the bits of the IIC bus control register (IBCR) to select master/slave mode, transmit/receive
mode and interrupt enable or not.
13.7.1.2 Generation of START
After completion of the initialization procedure, serial data can be transmitted by selecting the 'master
transmitter' mode. If the device is connected to a multi-master bus system, the state of the IIC bus busy bit
(IBB) must be tested to check whether the serial bus is free.
If the bus is free (IBB=0), the start condition and the first byte (the slave address) can be sent. The data
written to the data register comprises the slave calling address and the LSB set to indicate the direction of
transfer required from the slave.
The bus free time (i.e., the time between a STOP condition and the following START condition) is built
into the hardware that generates the START cycle. Depending on the relative frequencies of the system
clock and the SCL period it may be necessary to wait until the IIC is busy after writing the calling address
to the IBDR before proceeding with the following instructions. This is illustrated in the following example.
An example of a program which generates the START signal and transmits the first byte of data (slave
address) is shown below:
CHFLAG
TXSTART
BRSET
BSET
IBSR,#$20,*
IBCR,#$30
;WAIT FOR IBB FLAG TO CLEAR
;SET TRANSMIT AND MASTER MODE;i.e. GENERATE START CONDITION
MOVB
CALLING,IBDR ;TRANSMIT THE CALLING ADDRESS, D0=R/W
IBFREE
BRCLR IBSR,#$20,*
;WAIT FOR IBB FLAG TO SET
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 13 Inter-Integrated Circuit (MC9S12XDP512) Block Description
13.7.1.3 Post-Transfer Software Response
Transmission or reception of a byte will set the data transferring bit (TCF) to 1, which indicates one byte
communication is finished. The IIC bus interrupt bit (IBIF) is set also; an interrupt will be generated if the
interrupt function is enabled during initialization by setting the IBIE bit. Software must clear the IBIF bit
in the interrupt routine first. The TCF bit will be cleared by reading from the IIC bus data I/O register
(IBDR) in receive mode or writing to IBDR in transmit mode.
Software may service the IIC I/O in the main program by monitoring the IBIF bit if the interrupt function
is disabled. Note that polling should monitor the IBIF bit rather than the TCF bit because their operation
is different when arbitration is lost.
Note that when an interrupt occurs at the end of the address cycle the master will always be in transmit
mode, i.e. the address is transmitted. If master receive mode is required, indicated by R/W bit in IBDR,
then the Tx/Rx bit should be toggled at this stage.
During slave mode address cycles (IAAS=1), the SRW bit in the status register is read to determine the
direction of the subsequent transfer and the Tx/Rx bit is programmed accordingly. For slave mode data
cycles (IAAS=0) the SRW bit is not valid, the Tx/Rx bit in the control register should be read to determine
the direction of the current transfer.
The following is an example of a software response by a 'master transmitter' in the interrupt routine.
ISR
BCLR
IBSR,#$02
;CLEAR THE IBIF FLAG
BRCLR
BRCLR
BRSET
MOVB
IBCR,#$20,SLAVE
IBCR,#$10,RECEIVE
IBSR,#$01,END
DATABUF,IBDR
;BRANCH IF IN SLAVE MODE
;BRANCH IF IN RECEIVE MODE
;IF NO ACK, END OF TRANSMISSION
;TRANSMIT NEXT BYTE OF DATA
TRANSMIT
13.7.1.4 Generation of STOP
A data transfer ends with a STOP signal generated by the 'master' device. A master transmitter can simply
generate a STOP signal after all the data has been transmitted. The following is an example showing how
a stop condition is generated by a master transmitter.
MASTX
TST
BEQ
TXCNT
END
;GET VALUE FROM THE TRANSMITING COUNTER
;END IF NO MORE DATA
BRSET
MOVB
DEC
IBSR,#$01,END
DATABUF,IBDR
TXCNT
;END IF NO ACK
;TRANSMIT NEXT BYTE OF DATA
;DECREASE THE TXCNT
;EXIT
BRA
EMASTX
END
EMASTX
BCLR
RTI
IBCR,#$20
;GENERATE A STOP CONDITION
;RETURN FROM INTERRUPT
If a master receiver wants to terminate a data transfer, it must inform the slave transmitter by not
acknowledging the last byte of data which can be done by setting the transmit acknowledge bit (TXAK)
before reading the 2nd last byte of data. Before reading the last byte of data, a STOP signal must be
generated first. The following is an example showing how a STOP signal is generated by a master receiver.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
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Chapter 13 Inter-Integrated Circuit (MC9S12XDP512) Block Description
MASR
DEC
BEQ
MOVB
DEC
BNE
RXCNT
ENMASR
RXCNT,D1
D1
NXMAR
IBCR,#$08
;DECREASE THE RXCNT
;LAST BYTE TO BE READ
;CHECK SECOND LAST BYTE
;TO BE READ
;NOT LAST OR SECOND LAST
;SECOND LAST, DISABLE ACK
;TRANSMITTING
LAMAR
BSET
BRA
NXMAR
ENMASR
NXMAR
BCLR
MOVB
RTI
IBCR,#$20
IBDR,RXBUF
;LAST ONE, GENERATE ‘STOP’ SIGNAL
;READ DATA AND STORE
13.7.1.5 Generation of Repeated START
At the end of data transfer, if the master continues to want to communicate on the bus, it can generate
another START signal followed by another slave address without first generating a STOP signal. A
program example is as shown.
RESTART
BSET
IBCR,#$04
;ANOTHER START (RESTART)
MOVB
CALLING,IBDR
;TRANSMIT THE CALLING ADDRESS;D0=R/W
13.7.1.6 Slave Mode
In the slave interrupt service routine, the module addressed as slave bit (IAAS) should be tested to check
if a calling of its own address has just been received. If IAAS is set, software should set the transmit/receive
mode select bit (Tx/Rx bit of IBCR) according to the R/W command bit (SRW). Writing to the IBCR
clears the IAAS automatically. Note that the only time IAAS is read as set is from the interrupt at the end
of the address cycle where an address match occurred, interrupts resulting from subsequent data transfers
will have IAAS cleared. A data transfer may now be initiated by writing information to IBDR, for slave
transmits, or dummy reading from IBDR, in slave receive mode. The slave will drive SCL low in-between
byte transfers, SCL is released when the IBDR is accessed in the required mode.
In slave transmitter routine, the received acknowledge bit (RXAK) must be tested before transmitting the
next byte of data. Setting RXAK means an 'end of data' signal from the master receiver, after which it must
be switched from transmitter mode to receiver mode by software. A dummy read then releases the SCL
line so that the master can generate a STOP signal.
13.7.1.7 Arbitration Lost
If several masters try to engage the bus simultaneously, only one master wins and the others lose
arbitration. The devices which lost arbitration are immediately switched to slave receive mode by the
hardware. Their data output to the SDA line is stopped, but SCL continues to be generated until the end of
the byte during which arbitration was lost. An interrupt occurs at the falling edge of the ninth clock of this
transfer with IBAL=1 and MS/SL=0. If one master attempts to start transmission while the bus is being
engaged by another master, the hardware will inhibit the transmission; switch the MS/SL bit from 1 to 0
without generating STOP condition; generate an interrupt to CPU and set the IBAL to indicate that the
attempt to engage the bus is failed. When considering these cases, the slave service routine should test the
IBAL first and the software should clear the IBAL bit if it is set.
MC9S12XDP512 Data Sheet, Rev. 2.11
614
Freescale Semiconductor
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Chapter 13 Inter-Integrated Circuit (MC9S12XDP512) Block Description
Clear
IBIF
Master
N
Mode
?
Y
Arbitration
Y
TX
RX
Tx/Rx
?
Lost
?
N
Last Byte
Transmitted
Clear IBAL
Y
N
?
N
Last
Byte To Be Read
?
Y
N
RXAK=0
?
IAAS=1
?
IAAS=1
?
Y
N
Y
Y
N
Data Transfer
Address Transfer
Y
(Read)
End Of
Addr Cycle
(Master Rx)
?
2nd Last
Byte To Be Read
?
Y
Y
SRW=1
?
TX/RX
?
RX
TX
(Write)
N
N
N
ACK From
Receiver
?
Y
Write Next
Byte To IBDR
Generate
Stop Signal
Set TX
Mode
Set TXAK =1
N
Read Data
From IBDR
And Store
Tx Next
Byte
Write Data
To IBDR
Switch To
Rx Mode
Set RX
Mode
Switch To
Rx Mode
Read Data
From IBDR
And Store
Dummy Read
From IBDR
Generate
Stop Signal
Dummy Read
From IBDR
Dummy Read
From IBDR
RTI
Figure 13-12. Flow-Chart of Typical IIC Interrupt Routine
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
615
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Chapter 13 Inter-Integrated Circuit (MC9S12XDP512) Block Description
MC9S12XDP512 Data Sheet, Rev. 2.11
616
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Chapter 14
Freescale’s Scalable Controller Area Network
(S12MSCANV3)
14.1 Introduction
Freescale’s scalable controller area network (S12MSCANV3) definition is based on the MSCAN12
definition, which is the specific implementation of the MSCAN concept targeted for the M68HC12
microcontroller family.
The module is a communication controller implementing the CAN 2.0A/B protocol as defined in the
Bosch specification dated September 1991. For users to fully understand the MSCAN specification, it is
recommended that the Bosch specification be read first to familiarize the reader with the terms and
concepts contained within this document.
Though not exclusively intended for automotive applications, CAN protocol is designed to meet the
specific requirements of a vehicle serial data bus: real-time processing, reliable operation in the EMI
environment of a vehicle, cost-effectiveness, and required bandwidth.
MSCAN uses an advanced buffer arrangement resulting in predictable real-time behavior and simplified
application software.
14.1.1 Glossary
ACK: Acknowledge of CAN message
CAN: Controller Area Network
CRC: Cyclic Redundancy Code
EOF: End of Frame
FIFO: First-In-First-Out Memory
IFS: Inter-Frame Sequence
SOF: Start of Frame
CPU bus: CPU related read/write data bus
CAN bus: CAN protocol related serial bus
oscillator clock: Direct clock from external oscillator
bus clock: CPU bus realated clock
CAN clock: CAN protocol related clock
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
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Chapter 14 Freescale’s Scalable Controller Area Network (S12MSCANV3)
14.1.2 Block Diagram
MSCAN
CANCLK
Oscillator Clock
Tq Clk
MUX
Presc.
Bus Clock
RXCAN
TXCAN
Receive/
Transmit
Engine
Transmit Interrupt Req.
Receive Interrupt Req.
Errors Interrupt Req.
Wake-Up Interrupt Req.
Message
Filtering
and
Control
and
Status
Buffering
Configuration
Registers
Wake-Up
Low Pass Filter
Figure 14-1. MSCAN Block Diagram
14.1.3 Features
The basic features of the MSCAN are as follows:
•
Implementation of the CAN protocol — Version 2.0A/B
— Standard and extended data frames
— Zero to eight bytes data length
1
— Programmable bit rate up to 1 Mbps
— Support for remote frames
•
•
•
Five receive buffers with FIFO storage scheme
Three transmit buffers with internal prioritization using a “local priority” concept
Flexible maskable identifier filter supports two full-size (32-bit) extended identifier filters, or four
16-bit filters, or eight 8-bit filters
•
•
•
•
•
Programmable wakeup functionality with integrated low-pass filter
Programmable loopback mode supports self-test operation
Programmable listen-only mode for monitoring of CAN bus
Programmable bus-off recovery functionality
Separate signalling and interrupt capabilities for all CAN receiver and transmitter error states
(warning, error passive, bus-off)
•
•
Programmable MSCAN clock source either bus clock or oscillator clock
Internal timer for time-stamping of received and transmitted messages
1. Depending on the actual bit timing and the clock jitter of the PLL.
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 14 Freescale’s Scalable Controller Area Network (S12MSCANV3)
•
•
Three low-power modes: sleep, power down, and MSCAN enable
Global initialization of configuration registers
14.1.4 Modes of Operation
The following modes of operation are specific to the MSCAN. See Section 14.4, “Functional Description,”
•
•
•
•
MSCAN Power Down Mode
14.2 External Signal Description
The MSCAN uses two external pins:
14.2.1 RXCAN — CAN Receiver Input Pin
RXCAN is the MSCAN receiver input pin.
14.2.2 TXCAN — CAN Transmitter Output Pin
TXCAN is the MSCAN transmitter output pin. The TXCAN output pin represents the logic level on the
CAN bus:
0 = Dominant state
1 = Recessive state
14.2.3 CAN System
A typical CAN system with MSCAN is shown in Figure 14-2. Each CAN station is connected physically
to the CAN bus lines through a transceiver device. The transceiver is capable of driving the large current
needed for the CAN bus and has current protection against defective CAN or defective stations.
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 14 Freescale’s Scalable Controller Area Network (S12MSCANV3)
CAN node 2
CAN node n
CAN node 1
MCU
CAN Controller
(MSCAN)
TXCAN
RXCAN
Transceiver
CAN_H
CAN_L
CAN Bus
Figure 14-2. CAN System
14.3 Memory Map and Register Definition
This section provides a detailed description of all registers accessible in the MSCAN.
14.3.1 Module Memory Map
Table 14-1 gives an overview on all registers and their individual bits in the MSCAN memory map. The
register address results from the addition of base address and address offset. The base address is
determined at the MCU level and can be found in the Memory block description chapter. The address offset
is defined at the module level.
The MSCAN occupies 64 bytes in the memory space. The base address of the MSCAN module is
determined at the MCU level when the MCU is defined. The register decode map is fixed and begins at the
first address of the module address offset.
Table 14-1 shows the individual registers associated with the MSCAN and their relative offset from the
base address. The detailed register descriptions follow in the order they appear in the register map.
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Chapter 14 Freescale’s Scalable Controller Area Network (S12MSCANV3)
Table 14-1. MSCAN Memory Map
Offset
Address
Access
1
0x0000
0x0001
0x0002
0x0003
0x0004
0x0005
0x0006
0x0007
0x0008
0x0009
0x000A
0x000B
0x000C
0x000D
0x000E
0x000F
0x0010
0x0011
0x0012
0x0013
0x0014
0x0015
0x0016
0x0017
0x0018
0x0019
0x001A
0x001B
0x001C
0x001D
0x001E
0x001F
R/W
1
R/W
R/W
R/W
1
R/W
MSCAN Transmit Buffer Selection Register (CANTBSEL)
R/W
1
R/W
1
R/W
1
R/W
R
1
R/W
1
R/W
1
R/W
MSCAN Receive Error Counter (CANRXERR)
MSCAN Transmit Error Counter (CANTXERR)
MSCAN Identifier Acceptance Register 0(CANIDAR0)
MSCAN Identifier Acceptance Register 1(CANIDAR1)
MSCAN Identifier Acceptance Register 2 (CANIDAR2)
MSCAN Identifier Acceptance Register 3 (CANIDAR3)
MSCAN Identifier Mask Register 0 (CANIDMR0)
MSCAN Identifier Mask Register 1 (CANIDMR1)
MSCAN Identifier Mask Register 2 (CANIDMR2)
MSCAN Identifier Mask Register 3 (CANIDMR3)
MSCAN Identifier Acceptance Register 4 (CANIDAR4)
MSCAN Identifier Acceptance Register 5 (CANIDAR5)
MSCAN Identifier Acceptance Register 6 (CANIDAR6)
MSCAN Identifier Acceptance Register 7 (CANIDAR7)
MSCAN Identifier Mask Register 4 (CANIDMR4)
MSCAN Identifier Mask Register 5 (CANIDMR5)
MSCAN Identifier Mask Register 6 (CANIDMR6)
MSCAN Identifier Mask Register 7 (CANIDMR7)
Foreground Receive Buffer (CANRXFG)
R
R
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
2
0x0020
R
-0x002F
2
0x0030
Foreground Transmit Buffer (CANTXFG)
R /W
-0x003F
1
2
Refer to detailed register description for write access restrictions on per bit basis.
Reserved bits and unused bits within the TX- and RX-buffers (CANTXFG, CANRXFG) will be read
as “x”, because of RAM-based implementation.
MC9S12XDP512 Data Sheet, Rev. 2.11
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14.3.2 Register Descriptions
This section describes in detail all the registers and register bits in the MSCAN module. Each description
includes a standard register diagram with an associated figure number. Details of register bit and field
function follow the register diagrams, in bit order. All bits of all registers in this module are completely
synchronous to internal clocks during a register read.
14.3.2.1 MSCAN Control Register 0 (CANCTL0)
The CANCTL0 register provides various control bits of the MSCAN module as described below.
Module Base + 0x0000
7
6
5
4
3
2
1
0
R
W
RXACT
SYNCH
RXFRM
CSWAI
TIME
WUPE
SLPRQ
INITRQ
Reset:
0
0
0
0
0
0
0
1
= Unimplemented
Figure 14-3. MSCAN Control Register 0 (CANCTL0)
NOTE
The CANCTL0 register, except WUPE, INITRQ, and SLPRQ, is held in the
reset state when the initialization mode is active (INITRQ = 1 and
INITAK = 1). This register is writable again as soon as the initialization
mode is exited (INITRQ = 0 and INITAK = 0).
Read: Anytime
Write: Anytime when out of initialization mode; exceptions are read-only RXACT and SYNCH, RXFRM
(which is set by the module only), and INITRQ (which is also writable in initialization mode).
Table 14-2. CANCTL0 Register Field Descriptions
Field
Description
7
Received Frame Flag — This bit is read and clear only. It is set when a receiver has received a valid message
correctly, independently of the filter configuration. After it is set, it remains set until cleared by software or reset.
Clearing is done by writing a 1. Writing a 0 is ignored. This bit is not valid in loopback mode.
0 No valid message was received since last clearing this flag
1
RXFRM
1 A valid message was received since last clearing of this flag
6
Receiver Active Status — This read-only flag indicates the MSCAN is receiving a message. The flag is
RXACT
controlled by the receiver front end. This bit is not valid in loopback mode.
2
0 MSCAN is transmitting or idle
2
1 MSCAN is receiving a message (including when arbitration is lost)
5
CAN Stops in Wait Mode — Enabling this bit allows for lower power consumption in wait mode by disabling all
the clocks at the CPU bus interface to the MSCAN module.
3
CSWAI
0 The module is not affected during wait mode
1 The module ceases to be clocked during wait mode
4
Synchronized Status — This read-only flag indicates whether the MSCAN is synchronized to the CAN bus and
able to participate in the communication process. It is set and cleared by the MSCAN.
0 MSCAN is not synchronized to the CAN bus
SYNCH
1 MSCAN is synchronized to the CAN bus
MC9S12XDP512 Data Sheet, Rev. 2.11
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Table 14-2. CANCTL0 Register Field Descriptions (continued)
Field
Description
3
Timer Enable — This bit activates an internal 16-bit wide free running timer which is clocked by the bit clock rate.
If the timer is enabled, a 16-bit time stamp will be assigned to each transmitted/received message within the
active TX/RX buffer. As soon as a message is acknowledged on the CAN bus, the time stamp will be written to
the highest bytes (0x000E, 0x000F) in the appropriate buffer (see Section 14.3.3, “Programmer’s Model of
Message Storage”). The internal timer is reset (all bits set to 0) when disabled. This bit is held low in initialization
mode.
TIME
0 Disable internal MSCAN timer
1 Enable internal MSCAN timer
2
Wake-Up Enable — This configuration bit allows the MSCAN to restart from sleep mode when traffic on CAN is
detected (see Section 14.4.6.4, “MSCAN Sleep Mode”).
4
WUPE
0 Wake-up disabled — The MSCAN ignores traffic on CAN
1
Sleep Mode Request — This bit requests the MSCAN to enter sleep mode, which is an internal power saving
mode (see Section 14.4.6.4, “MSCAN Sleep Mode”). The sleep mode request is serviced when the CAN bus is
idle, i.e., the module is not receiving a message and all transmit buffers are empty. The module indicates entry
to sleep mode by setting SLPAK = 1 (see Section 14.3.2.2, “MSCAN Control Register 1 (CANCTL1)”). Sleep
mode will be active until SLPRQ is cleared by the CPU or, depending on the setting of WUPE, the MSCAN
detects activity on the CAN bus and clears SLPRQ itself.
5
SLPRQ
0 Running — The MSCAN functions normally
0
Initialization Mode Request — When this bit is set by the CPU, the MSCAN skips to initialization mode (see
Section 14.4.6.5, “MSCAN Initialization Mode”). Any ongoing transmission or reception is aborted and
synchronization to the CAN bus is lost. The module indicates entry to initialization mode by setting INITAK = 1
(Section 14.3.2.2, “MSCAN Control Register 1 (CANCTL1)”).
6,7
INITRQ
8
9
The following registers enter their hard reset state and restore their default values: CANCTL0 , CANRFLG ,
10
CANRIER , CANTFLG, CANTIER, CANTARQ, CANTAAK, and CANTBSEL.
The registers CANCTL1, CANBTR0, CANBTR1, CANIDAC, CANIDAR0-7, and CANIDMR0-7 can only be
written by the CPU when the MSCAN is in initialization mode (INITRQ = 1 and INITAK = 1). The values of the
error counters are not affected by initialization mode.
When this bit is cleared by the CPU, the MSCAN restarts and then tries to synchronize to the CAN bus. If the
MSCAN is not in bus-off state, it synchronizes after 11 consecutive recessive bits on the CAN bus; if the MSCAN
is in bus-off state, it continues to wait for 128 occurrences of 11 consecutive recessive bits.
Writing to otherbits in CANCTL0, CANRFLG, CANRIER, CANTFLG, or CANTIER must be done only after
initialization mode is exited, which is INITRQ = 0 and INITAK = 0.
0 Normal operation
1 MSCAN in initialization mode
1
2
The MSCAN must be in normal mode for this bit to become set.
See the Bosch CAN 2.0A/B specification for a detailed definition of transmitter and receiver states.
In order to protect from accidentally violating the CAN protocol, the TXCAN pin is immediately forced to a recessive state when
the CPU enters wait (CSWAI = 1) or stop mode (see Section 14.4.6.2, “Operation in Wait Mode” and Section 14.4.6.3,
The CPU has to make sure that the WUPE register and the WUPIE wake-up interrupt enable register (see Section 14.3.2.6,
“MSCAN Receiver Interrupt Enable Register (CANRIER)) is enabled, if the recovery mechanism from stop or wait is required.
The CPU cannot clear SLPRQ before the MSCAN has entered sleep mode (SLPRQ = 1 and SLPAK = 1).
The CPU cannot clear INITRQ before the MSCAN has entered initialization mode (INITRQ = 1 and INITAK = 1).
In order to protect from accidentally violating the CAN protocol, the TXCAN pin is immediately forced to a recessive state when
the initialization mode is requested by the CPU. Thus, the recommended procedure is to bring the MSCAN into sleep mode
(SLPRQ = 1 and SLPAK = 1) before requesting initialization mode.
Not including WUPE, INITRQ, and SLPRQ.
TSTAT1 and TSTAT0 are not affected by initialization mode.
RSTAT1 and RSTAT0 are not affected by initialization mode.
4
5
6
7
8
9
10
MC9S12XDP512 Data Sheet, Rev. 2.11
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14.3.2.2 MSCAN Control Register 1 (CANCTL1)
The CANCTL1 register provides various control bits and handshake status information of the MSCAN
module as described below.
Module Base 0x0001
+
7
6
5
4
3
2
1
0
R
W
SLPAK
INITAK
CANE
CLKSRC
LOOPB
LISTEN
BORM
WUPM
Reset:
0
0
0
1
0
0
0
1
= Unimplemented
Figure 14-4. MSCAN Control Register 1 (CANCTL1)
Read: Anytime
Write: Anytime when INITRQ = 1 and INITAK = 1, except CANE which is write once in normal and
anytime in special system operation modes when the MSCAN is in initialization mode (INITRQ = 1 and
INITAK = 1).
Table 14-3. CANCTL1 Register Field Descriptions
Field
Description
7
MSCAN Enable
CANE
0 MSCAN module is disabled
1 MSCAN module is enabled
6
MSCAN Clock Source — This bit defines the clock source for the MSCAN module (only for systems with a clock
generation module; Section 14.4.3.2, “Clock System,” and Section Figure 14-42., “MSCAN Clocking Scheme,”).
0 MSCAN clock source is the oscillator clock
CLKSRC
1 MSCAN clock source is the bus clock
5
Loopback Self Test Mode — When this bit is set, the MSCAN performs an internal loopback which can be used
for self test operation. The bit stream output of the transmitter is fed back to the receiver internally. The RXCAN
input pin is ignored and the TXCAN output goes to the recessive state (logic 1). The MSCAN behaves as it does
normally when transmitting and treats its own transmitted message as a message received from a remote node.
In this state, the MSCAN ignores the bit sent during the ACK slot in the CAN frame acknowledge field to ensure
proper reception of its own message. Both transmit and receive interrupts are generated.
0 Loopback self test disabled
LOOPB
1 Loopback self test enabled
4
Listen Only Mode — This bit configures the MSCAN as a CAN bus monitor. When LISTEN is set, all valid CAN
messages with matching ID are received, but no acknowledgement or error frames are sent out (see
Section 14.4.5.4, “Listen-Only Mode”). In addition, the error counters are frozen. Listen only mode supports
applications which require “hot plugging” or throughput analysis. The MSCAN is unable to transmit any
messages when listen only mode is active.
LISTEN
0 Normal operation
1 Listen only mode activated
3
Bus-Off Recovery Mode — This bits configures the bus-off state recovery mode of the MSCAN. Refer to
Section 14.5.2, “Bus-Off Recovery,” for details.
BORM
0 Automatic bus-off recovery (see Bosch CAN 2.0A/B protocol specification)
1 Bus-off recovery upon user request
MC9S12XDP512 Data Sheet, Rev. 2.11
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Table 14-3. CANCTL1 Register Field Descriptions (continued)
Field
Description
2
Wake-Up Mode — If WUPE in CANCTL0 is enabled, this bit defines whether the integrated low-pass filter is
applied to protect the MSCAN from spurious wake-up (see Section 14.4.6.4, “MSCAN Sleep Mode”).
0 MSCAN wakes up the CPU after any recessive to dominant edge on the CAN bus
WUPM
1 MSCAN wakes up the CPU only in case of a dominant pulse on the CAN bus that has a length of T
wup
1
Sleep Mode Acknowledge — This flag indicates whether the MSCAN module has entered sleep mode (see
Section 14.4.6.4, “MSCAN Sleep Mode”). It is used as a handshake flag for the SLPRQ sleep mode request.
Sleep mode is active when SLPRQ = 1 and SLPAK = 1. Depending on the setting of WUPE, the MSCAN will
clear the flag if it detects activity on the CAN bus while in sleep mode.
SLPAK
0 Running — The MSCAN operates normally
1 Sleep mode active — The MSCAN has entered sleep mode
0
Initialization Mode Acknowledge — This flag indicates whether the MSCAN module is in initialization mode
(see Section 14.4.6.5, “MSCAN Initialization Mode”). It is used as a handshake flag for the INITRQ initialization
mode request. Initialization mode is active when INITRQ = 1 and INITAK = 1. The registers CANCTL1,
CANBTR0, CANBTR1, CANIDAC, CANIDAR0–CANIDAR7, and CANIDMR0–CANIDMR7 can be written only by
the CPU when the MSCAN is in initialization mode.
INITAK
0 Running — The MSCAN operates normally
1 Initialization mode active — The MSCAN has entered initialization mode
MC9S12XDP512 Data Sheet, Rev. 2.11
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14.3.2.3 MSCAN Bus Timing Register 0 (CANBTR0)
The CANBTR0 register configures various CAN bus timing parameters of the MSCAN module.
Module Base + 0x0002
7
6
5
4
3
2
1
0
R
W
SJW1
SJW0
BRP5
BRP4
BRP3
BRP2
BRP1
BRP0
Reset:
0
0
0
0
0
0
0
0
Figure 14-5. MSCAN Bus Timing Register 0 (CANBTR0)
Read: Anytime
Write: Anytime in initialization mode (INITRQ = 1 and INITAK = 1)
Table 14-4. CANBTR0 Register Field Descriptions
Field
Description
7:6
SJW[1:0]
Synchronization Jump Width — The synchronization jump width defines the maximum number of time quanta
(Tq) clock cycles a bit can be shortened or lengthened to achieve resynchronization to data transitions on the
CAN bus (see Table 14-5).
5:0
Baud Rate Prescaler — These bits determine the time quanta (Tq) clock which is used to build up the bit timing
BRP[5:0]
(see Table 14-6).
Table 14-5. Synchronization Jump Width
SJW1
SJW0
Synchronization Jump Width
0
0
1
1
0
1
0
1
1 Tq clock cycle
2 Tq clock cycles
3 Tq clock cycles
4 Tq clock cycles
Table 14-6. Baud Rate Prescaler
BRP5
BRP4
BRP3
BRP2
BRP1
BRP0
Prescaler value (P)
0
0
0
0
:
0
0
0
0
:
0
0
0
0
:
0
0
0
0
:
0
0
1
1
:
0
1
0
1
:
1
2
3
4
:
1
1
1
1
1
1
64
MC9S12XDP512 Data Sheet, Rev. 2.11
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14.3.2.4 MSCAN Bus Timing Register 1 (CANBTR1)
The CANBTR1 register configures various CAN bus timing parameters of the MSCAN module.
Module Base + 0x0003
7
6
5
4
3
2
1
0
R
W
SAMP
TSEG22
TSEG21
TSEG20
TSEG13
TSEG12
TSEG11
TSEG10
Reset:
0
0
0
0
0
0
0
0
Figure 14-6. MSCAN Bus Timing Register 1 (CANBTR1)
Read: Anytime
Write: Anytime in initialization mode (INITRQ = 1 and INITAK = 1)
Table 14-7. CANBTR1 Register Field Descriptions
Field
Description
7
Sampling — This bit determines the number of CAN bus samples taken per bit time.
SAMP
0 One sample per bit.
1 Three samples per bit .
1
If SAMP = 0, the resulting bit value is equal to the value of the single bit positioned at the sample point. If
SAMP = 1, the resulting bit value is determined by using majority rule on the three total samples. For higher bit
rates, it is recommended that only one sample is taken per bit time (SAMP = 0).
6:4
Time Segment 2 — Time segments within the bit time fix the number of clock cycles per bit time and the location
TSEG2[2:0] of the sample point (see Figure 14-43). Time segment 2 (TSEG2) values are programmable as shown in
Table 14-8.
3:0
Time Segment 1 — Time segments within the bit time fix the number of clock cycles per bit time and the location
TSEG1[3:0] of the sample point (see Figure 14-43). Time segment 1 (TSEG1) values are programmable as shown in
Table 14-9.
1
In this case, PHASE_SEG1 must be at least 2 time quanta (Tq).
Table 14-8. Time Segment 2 Values
TSEG22
TSEG21
TSEG20
Time Segment 2
1
0
0
:
0
0
:
0
1
:
1 Tq clock cycle
2 Tq clock cycles
:
1
1
1
1
0
1
7 Tq clock cycles
8 Tq clock cycles
1
This setting is not valid. Please refer to Table 14-36 for valid settings.
MC9S12XDP512 Data Sheet, Rev. 2.11
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Table 14-9. Time Segment 1 Values
TSEG13
TSEG12
TSEG11
TSEG10
Time segment 1
1
0
0
0
0
:
0
0
0
0
:
0
0
1
1
:
0
1
0
1
:
1 Tq clock cycle
1
2 Tq clock cycles
3 Tq clock cycles
1
4 Tq clock cycles
:
1
1
1
1
1
1
0
1
15 Tq clock cycles
16 Tq clock cycles
1
This setting is not valid. Please refer to Table 14-36 for valid settings.
The bit time is determined by the oscillator frequency, the baud rate prescaler, and the number of time
quanta (Tq) clock cycles per bit (as shown in Table 14-8 and Table 14-9).
Eqn. 14-1
(Prescaler value)
-----------------------------------------------------
f
Bit Time=
• (1 + TimeSegment1 + TimeSegment2)
CANCLK
14.3.2.5 MSCAN Receiver Flag Register (CANRFLG)
A flag can be cleared only by software (writing a 1 to the corresponding bit position) when the condition
which caused the setting is no longer valid. Every flag has an associated interrupt enable bit in the
CANRIER register.
Module Base + 0x0004
7
6
5
4
3
2
1
0
R
W
RSTAT1
RSTAT0
TSTAT1
TSTAT0
WUPIF
CSCIF
OVRIF
RXF
Reset:
0
0
0
0
0
0
0
0
= Unimplemented
Figure 14-7. MSCAN Receiver Flag Register (CANRFLG)
NOTE
1
The CANRFLG register is held in the reset state when the initialization
mode is active (INITRQ = 1 and INITAK = 1). This register is writable again
as soon as the initialization mode is exited (INITRQ = 0 and INITAK = 0).
Read: Anytime
Write: Anytime when out of initialization mode, except RSTAT[1:0] and TSTAT[1:0] flags which are
read-only; write of 1 clears flag; write of 0 is ignored.
1. The RSTAT[1:0], TSTAT[1:0] bits are not affected by initialization mode.
MC9S12XDP512 Data Sheet, Rev. 2.11
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Table 14-10. CANRFLG Register Field Descriptions
Field
7
Wake-Up Interrupt Flag — If the MSCAN detects CAN bus activity while in sleep mode (see Section 14.4.6.4,
“MSCAN Sleep Mode,”) and WUPE = 1 in CANTCTL0 (see Section 14.3.2.1, “MSCAN Control Register 0
(CANCTL0)”), the module will set WUPIF. If not masked, a wake-up interrupt is pending while this flag is set.
WUPIF
0
1
No wake-up activity observed while in sleep mode
MSCAN detected activity on the CAN bus and requested wake-up
6
CAN Status Change Interrupt Flag — This flag is set when the MSCAN changes its current CAN bus status
due to the actual value of the transmit error counter (TEC) and the receive error counter (REC). An additional
4-bit (RSTAT[1:0], TSTAT[1:0]) status register, which is split into separate sections for TEC/REC, informs the
system on the actual CAN bus status (see Section 14.3.2.6, “MSCAN Receiver Interrupt Enable Register
(CANRIER)”). If not masked, an error interrupt is pending while this flag is set. CSCIF provides a blocking
interrupt. That guarantees that the receiver/transmitter status bits (RSTAT/TSTAT) are only updated when no CAN
status change interrupt is pending. If the TECs/RECs change their current value after the CSCIF is asserted,
which would cause an additional state change in the RSTAT/TSTAT bits, these bits keep their status until the
current CSCIF interrupt is cleared again.
CSCIF
0
1
No change in CAN bus status occurred since last interrupt
MSCAN changed current CAN bus status
5:4
Receiver Status Bits — The values of the error counters control the actual CAN bus status of the MSCAN. As
RSTAT[1:0] soon as the status change interrupt flag (CSCIF) is set, these bits indicate the appropriate receiver related CAN
bus status of the MSCAN. The coding for the bits RSTAT1, RSTAT0 is:
00
01
10
11
RxOK: 0 ≤ receive error counter ≤ 96
RxWRN: 96 < receive error counter ≤ 127
RxERR: 127 < receive error counter
1
Bus-off : transmit error counter > 255
3:2
Transmitter Status Bits — The values of the error counters control the actual CAN bus status of the MSCAN.
TSTAT[1:0] As soon as the status change interrupt flag (CSCIF) is set, these bits indicate the appropriate transmitter related
CAN bus status of the MSCAN. The coding for the bits TSTAT1, TSTAT0 is:
00
01
10
11
TxOK: 0 ≤ transmit error counter ≤ 96
TxWRN: 96 < transmit error counter ≤ 127
TxERR: 127 < transmit error counter ≤ 255
Bus-Off: transmit error counter > 255
1
Overrun Interrupt Flag — This flag is set when a data overrun condition occurs. If not masked, an error interrupt
OVRIF
is pending while this flag is set.
0
1
No data overrun condition
A data overrun detected
0
RXF
Receive Buffer Full Flag — RXF is set by the MSCAN when a new message is shifted in the receiver FIFO. This
flag indicates whether the shifted buffer is loaded with a correctly received message (matching identifier,
matching cyclic redundancy code (CRC) and no other errors detected). After the CPU has read that message
from the RxFG buffer in the receiver FIFO, the RXF flag must be cleared to release the buffer. A set RXF flag
prohibits the shifting of the next FIFO entry into the foreground buffer (RxFG). If not masked, a receive interrupt
is pending while this flag is set.
2
0
1
No new message available within the RxFG
The receiver FIFO is not empty. A new message is available in the RxFG
1
2
Redundant Information for the most critical CAN bus status which is “bus-off”. This only occurs if the Tx error counter exceeds
a number of 255 errors. Bus-off affects the receiver state. As soon as the transmitter leaves its bus-off state the receiver state
skips to RxOK too. Refer also to TSTAT[1:0] coding in this register.
To ensure data integrity, do not read the receive buffer registers while the RXF flag is cleared. For MCUs with dual CPUs,
reading the receive buffer registers while the RXF flag is cleared may result in a CPU fault condition.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
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14.3.2.6 MSCAN Receiver Interrupt Enable Register (CANRIER)
This register contains the interrupt enable bits for the interrupt flags described in the CANRFLG register.
Module Base + 0x0005
7
6
5
4
3
2
1
0
R
W
WUPIE
CSCIE
RSTATE1
RSTATE0
TSTATE1
TSTATE0
OVRIE
RXFIE
Reset:
0
0
0
0
0
0
0
0
Figure 14-8. MSCAN Receiver Interrupt Enable Register (CANRIER)
NOTE
The CANRIER register is held in the reset state when the initialization mode
is active (INITRQ=1 and INITAK=1). This register is writable when not in
initialization mode (INITRQ=0 and INITAK=0).
The RSTATE[1:0], TSTATE[1:0] bits are not affected by initialization
mode.
Read: Anytime
Write: Anytime when not in initialization mode
Table 14-11. CANRIER Register Field Descriptions
Field
Description
7
Wake-Up Interrupt Enable
1
WUPIE
0
No interrupt request is generated from this event.
1
A wake-up event causes a Wake-Up interrupt request.
6
CAN Status Change Interrupt Enable
CSCIE
0
No interrupt request is generated from this event.
1
A CAN Status Change event causes an error interrupt request.
5:4
Receiver Status Change Enable — These RSTAT enable bits control the sensitivity level in which receiver state
RSTATE[1:0] changes are causing CSCIF interrupts. Independent of the chosen sensitivity level the RSTAT flags continue to
indicate the actual receiver state and are only updated if no CSCIF interrupt is pending.
00 Do not generate any CSCIF interrupt caused by receiver state changes.
01 Generate CSCIF interrupt only if the receiver enters or leaves “bus-off” state. Discard other receiver state
changes for generating CSCIF interrupt.
2
10 Generate CSCIF interrupt only if the receiver enters or leaves “RxErr” or “bus-off” state. Discard other
receiver state changes for generating CSCIF interrupt.
11 Generate CSCIF interrupt on all state changes.
3:2
Transmitter Status Change Enable — These TSTAT enable bits control the sensitivity level in which transmitter
TSTATE[1:0] state changes are causing CSCIF interrupts. Independent of the chosen sensitivity level, the TSTAT flags
continue to indicate the actual transmitter state and are only updated if no CSCIF interrupt is pending.
00 Do not generate any CSCIF interrupt caused by transmitter state changes.
01 Generate CSCIF interrupt only if the transmitter enters or leaves “bus-off” state. Discard other transmitter
state changes for generating CSCIF interrupt.
10 Generate CSCIF interrupt only if the transmitter enters or leaves “TxErr” or “bus-off” state. Discard other
transmitter state changes for generating CSCIF interrupt.
11 Generate CSCIF interrupt on all state changes.
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 14 Freescale’s Scalable Controller Area Network (S12MSCANV3)
Table 14-11. CANRIER Register Field Descriptions (continued)
Field
Description
1
Overrun Interrupt Enable
OVRIE
0
No interrupt request is generated from this event.
1
An overrun event causes an error interrupt request.
0
Receiver Full Interrupt Enable
RXFIE
0
1
A receive buffer full (successful message reception) event causes a receiver interrupt request.
1
2
WUPIE and WUPE (see Section 14.3.2.1, “MSCAN Control Register 0 (CANCTL0)”) must both be enabled if the recovery
mechanism from stop or wait is required.
Bus-off state is defined by the CAN standard (see Bosch CAN 2.0A/B protocol specification: for only transmitters. Because the
only possible state change for the transmitter from bus-off to TxOK also forces the receiver to skip its current state to RxOK,
the coding of the RXSTAT[1:0] flags define an additional bus-off state for the receiver (see Section 14.3.2.5, “MSCAN Receiver
Flag Register (CANRFLG)”).
14.3.2.7 MSCAN Transmitter Flag Register (CANTFLG)
The transmit buffer empty flags each have an associated interrupt enable bit in the CANTIER register.
Module Base + 0x0006
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
TXE2
TXE1
TXE0
Reset:
0
0
0
0
0
1
1
1
= Unimplemented
Figure 14-9. MSCAN Transmitter Flag Register (CANTFLG)
NOTE
The CANTFLG register is held in the reset state when the initialization
mode is active (INITRQ = 1 and INITAK = 1). This register is writable when
not in initialization mode (INITRQ = 0 and INITAK = 0).
Read: Anytime
Write: Anytime for TXEx flags when not in initialization mode; write of 1 clears flag, write of 0 is ignored
MC9S12XDP512 Data Sheet, Rev. 2.11
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Table 14-12. CANTFLG Register Field Descriptions
Field
Description
2:0
TXE[2:0]
Transmitter Buffer Empty — This flag indicates that the associated transmit message buffer is empty, and thus
not scheduled for transmission. The CPU must clear the flag after a message is set up in the transmit buffer and
is due for transmission. The MSCAN sets the flag after the message is sent successfully. The flag is also set by
the MSCAN when the transmission request is successfully aborted due to a pending abort request (see
Message Abort Acknowledge Register (CANTAAK)”). When a TXEx flag is set, the corresponding ABTRQx bit
is cleared (see Section 14.3.2.9, “MSCAN Transmitter Message Abort Request Register (CANTARQ)”).
When listen-mode is active (see Section 14.3.2.2, “MSCAN Control Register 1 (CANCTL1)”) the TXEx flags
cannot be cleared and no transmission is started.
Read and write accesses to the transmit buffer will be blocked, if the corresponding TXEx bit is cleared
(TXEx = 0) and the buffer is scheduled for transmission.
0 The associated message buffer is full (loaded with a message due for transmission)
1 The associated message buffer is empty (not scheduled)
14.3.2.8 MSCAN Transmitter Interrupt Enable Register (CANTIER)
This register contains the interrupt enable bits for the transmit buffer empty interrupt flags.
Module Base + 0x0007
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
TXEIE2
TXEIE1
TXEIE0
Reset:
0
0
0
0
0
0
0
0
= Unimplemented
Figure 14-10. MSCAN Transmitter Interrupt Enable Register (CANTIER)
NOTE
The CANTIER register is held in the reset state when the initialization mode
is active (INITRQ = 1 and INITAK = 1). This register is writable when not
in initialization mode (INITRQ = 0 and INITAK = 0).
Read: Anytime
Write: Anytime when not in initialization mode
Table 14-13. CANTIER Register Field Descriptions
Field
Description
2:0
Transmitter Empty Interrupt Enable
TXEIE[2:0] 0 No interrupt request is generated from this event.
1 A transmitter empty (transmit buffer available for transmission) event causes a transmitter empty interrupt
request.
MC9S12XDP512 Data Sheet, Rev. 2.11
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14.3.2.9 MSCAN Transmitter Message Abort Request Register (CANTARQ)
The CANTARQ register allows abort request of queued messages as described below.
Module Base + 0x0008
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
ABTRQ2
ABTRQ1
ABTRQ0
Reset:
0
0
0
0
0
0
0
0
= Unimplemented
Figure 14-11. MSCAN Transmitter Message Abort Request Register (CANTARQ)
NOTE
The CANTARQ register is held in the reset state when the initialization
mode is active (INITRQ = 1 and INITAK = 1). This register is writable when
not in initialization mode (INITRQ = 0 and INITAK = 0).
Read: Anytime
Write: Anytime when not in initialization mode
Table 14-14. CANTARQ Register Field Descriptions
Field
Description
Abort Request — The CPU sets the ABTRQx bit to request that a scheduled message buffer (TXEx = 0) be
2:0
ABTRQ[2:0] aborted. The MSCAN grants the request if the message has not already started transmission, or if the
Section 14.3.2.7, “MSCAN Transmitter Flag Register (CANTFLG)”) and abort acknowledge flags (ABTAK, see
Section 14.3.2.10, “MSCAN Transmitter Message Abort Acknowledge Register (CANTAAK)”) are set and a
transmit interrupt occurs if enabled. The CPU cannot reset ABTRQx. ABTRQx is reset whenever the associated
TXE flag is set.
0 No abort request
1 Abort request pending
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 14 Freescale’s Scalable Controller Area Network (S12MSCANV3)
14.3.2.10 MSCAN Transmitter Message Abort Acknowledge Register (CANTAAK)
The CANTAAK register indicates the successful abort of a queued message, if requested by the
appropriate bits in the CANTARQ register.
Module Base + 0x0009
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
ABTAK2
ABTAK1
ABTAK0
Reset:
0
0
0
0
0
0
0
0
= Unimplemented
Figure 14-12. MSCAN Transmitter Message Abort Acknowledge Register (CANTAAK)
NOTE
The CANTAAK register is held in the reset state when the initialization
mode is active (INITRQ = 1 and INITAK = 1).
Read: Anytime
Write: Unimplemented for ABTAKx flags
Table 14-15. CANTAAK Register Field Descriptions
Field
Description
Abort Acknowledge — This flag acknowledges that a message was aborted due to a pending abort request
2:0
ABTAK[2:0] from the CPU. After a particular message buffer is flagged empty, this flag can be used by the application
software to identify whether the message was aborted successfully or was sent anyway. The ABTAKx flag is
cleared whenever the corresponding TXE flag is cleared.
0 The message was not aborted.
1 The message was aborted.
MC9S12XDP512 Data Sheet, Rev. 2.11
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14.3.2.11 MSCAN Transmit Buffer Selection Register (CANTBSEL)
The CANTBSEL register allows the selection of the actual transmit message buffer, which then will be
accessible in the CANTXFG register space.
Module Base + 0x000A
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
TX2
TX1
TX0
Reset:
0
0
0
0
0
0
0
0
= Unimplemented
Figure 14-13. MSCAN Transmit Buffer Selection Register (CANTBSEL)
NOTE
The CANTBSEL register is held in the reset state when the initialization
mode is active (INITRQ = 1 and INITAK=1). This register is writable when
not in initialization mode (INITRQ = 0 and INITAK = 0).
Read: Find the lowest ordered bit set to 1, all other bits will be read as 0
Write: Anytime when not in initialization mode
Table 14-16. CANTBSEL Register Field Descriptions
Field
Description
2:0
TX[2:0]
Transmit Buffer Select — The lowest numbered bit places the respective transmit buffer in the CANTXFG
register space (e.g., TX1 = 1 and TX0 = 1 selects transmit buffer TX0; TX1 = 1 and TX0 = 0 selects transmit
buffer TX1). Read and write accesses to the selected transmit buffer will be blocked, if the corresponding TXEx
bit is cleared and the buffer is scheduled for transmission (see Section 14.3.2.7, “MSCAN Transmitter Flag
Register (CANTFLG)”).
0 The associated message buffer is deselected
1 The associated message buffer is selected, if lowest numbered bit
The following gives a short programming example of the usage of the CANTBSEL register:
To get the next available transmit buffer, application software must read the CANTFLG register and write
this value back into the CANTBSEL register. In this example Tx buffers TX1 and TX2 are available. The
value read from CANTFLG is therefore 0b0000_0110. When writing this value back to CANTBSEL, the
Tx buffer TX1 is selected in the CANTXFG because the lowest numbered bit set to 1 is at bit position 1.
Reading back this value out of CANTBSEL results in 0b0000_0010, because only the lowest numbered
bit position set to 1 is presented. This mechanism eases the application software the selection of the next
available Tx buffer.
•
•
•
LDD CANTFLG; value read is 0b0000_0110
STD CANTBSEL; value written is 0b0000_0110
LDD CANTBSEL; value read is 0b0000_0010
If all transmit message buffers are deselected, no accesses are allowed to the CANTXFG registers.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
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14.3.2.12 MSCAN Identifier Acceptance Control Register (CANIDAC)
The CANIDAC register is used for identifier acceptance control as described below.
Module Base + 0x000B
7
6
5
4
3
2
1
0
R
W
0
0
0
IDHIT2
IDHIT1
IDHIT0
IDAM1
IDAM0
Reset:
0
0
0
0
0
0
0
0
= Unimplemented
Figure 14-14. MSCAN Identifier Acceptance Control Register (CANIDAC)
Read: Anytime
Write: Anytime in initialization mode (INITRQ = 1 and INITAK = 1), except bits IDHITx, which are
read-only
Table 14-17. CANIDAC Register Field Descriptions
Field
Description
5:4
Identifier Acceptance Mode — The CPU sets these flags to define the identifier acceptance filter organization
IDAM[1:0] (see Section 14.4.3, “Identifier Acceptance Filter”). Table 14-18 summarizes the different settings. In filter closed
2:0
Identifier Acceptance Hit Indicator — The MSCAN sets these flags to indicate an identifier acceptance hit (see
IDHIT[2:0] Section 14.4.3, “Identifier Acceptance Filter”). Table 14-19 summarizes the different settings.
Table 14-18. Identifier Acceptance Mode Settings
IDAM1
IDAM0
Identifier Acceptance Mode
0
0
1
1
0
1
0
1
Two 32-bit acceptance filters
Four 16-bit acceptance filters
Eight 8-bit acceptance filters
Filter closed
Table 14-19. Identifier Acceptance Hit Indication
IDHIT2
IDHIT1
IDHIT0
Identifier Acceptance Hit
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
Filter 0 hit
Filter 1 hit
Filter 2 hit
Filter 3 hit
Filter 4 hit
Filter 5 hit
Filter 6 hit
Filter 7 hit
MC9S12XDP512 Data Sheet, Rev. 2.11
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The IDHITx indicators are always related to the message in the foreground buffer (RxFG). When a
message gets shifted into the foreground buffer of the receiver FIFO the indicators are updated as well.
14.3.2.13 MSCAN Reserved Register
This register is reserved for factory testing of the MSCAN module and is not available in normal system
operation modes.
Module Base + 0x000C
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset:
0
0
0
0
0
0
0
0
= Unimplemented
Figure 14-15. MSCAN Reserved Register
Read: Always read 0x0000 in normal system operation modes
Write: Unimplemented in normal system operation modes
NOTE
Writing to this register when in special modes can alter the MSCAN
functionality.
14.3.2.14 MSCAN Miscellaneous Register (CANMISC)
This register provides additional features.
Module Base + 0x000D
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
BOHOLD
Reset:
0
0
0
0
0
0
0
0
= Unimplemented
Figure 14-16. MSCAN Miscellaneous Register (CANMISC)
Read: Anytime
Write: Anytime; write of ‘1’ clears flag; write of ‘0’ ignored
MC9S12XDP512 Data Sheet, Rev. 2.11
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Table 14-20. CANMISC Register Field Descriptions
Field
Description
0
Bus-off State Hold Until User Request — If BORM is set in Section 14.3.2.2, “MSCAN Control Register 1
BOHOLD (CANCTL1), this bit indicates whether the module has entered the bus-off state. Clearing this bit requests the
recovery from bus-off. Refer to Section 14.5.2, “Bus-Off Recovery,” for details.
0 Module is not bus-off or recovery has been requested by user in bus-off state
1 Module is bus-off and holds this state until user request
14.3.2.15 MSCAN Receive Error Counter (CANRXERR)
This register reflects the status of the MSCAN receive error counter.
Module Base + 0x000E
7
6
5
4
3
2
1
0
R
W
RXERR7
RXERR6
RXERR5
RXERR4
RXERR3
RXERR2
RXERR1
RXERR0
Reset:
0
0
0
0
0
0
0
0
= Unimplemented
Figure 14-17. MSCAN Receive Error Counter (CANRXERR)
Read: Only when in sleep mode (SLPRQ = 1 and SLPAK = 1) or initialization mode (INITRQ = 1 and
INITAK = 1)
Write: Unimplemented
NOTE
Reading this register when in any other mode other than sleep or
initialization mode may return an incorrect value. For MCUs with dual
CPUs, this may result in a CPU fault condition.
Writing to this register when in special modes can alter the MSCAN
functionality.
MC9S12XDP512 Data Sheet, Rev. 2.11
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14.3.2.16 MSCAN Transmit Error Counter (CANTXERR)
This register reflects the status of the MSCAN transmit error counter.
Module Base + 0x000F
7
6
5
4
3
2
1
0
R
W
TXERR7
TXERR6
TXERR5
TXERR4
TXERR3
TXERR2
TXERR1
TXERR0
Reset:
0
0
0
0
0
0
0
0
= Unimplemented
Figure 14-18. MSCAN Transmit Error Counter (CANTXERR)
Read: Only when in sleep mode (SLPRQ = 1 and SLPAK = 1) or initialization mode (INITRQ = 1 and
INITAK = 1)
Write: Unimplemented
NOTE
Reading this register when in any other mode other than sleep or
initialization mode, may return an incorrect value. For MCUs with dual
CPUs, this may result in a CPU fault condition.
Writing to this register when in special modes can alter the MSCAN
functionality.
MC9S12XDP512 Data Sheet, Rev. 2.11
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14.3.2.17 MSCAN Identifier Acceptance Registers (CANIDAR0-7)
On reception, each message is written into the background receive buffer. The CPU is only signalled to
read the message if it passes the criteria in the identifier acceptance and identifier mask registers
(accepted); otherwise, the message is overwritten by the next message (dropped).
“Identifier Registers (IDR0–IDR3)”) of incoming messages in a bit by bit manner (see Section 14.4.3,
“Identifier Acceptance Filter”).
For extended identifiers, all four acceptance and mask registers are applied. For standard identifiers, only
the first two (CANIDAR0/1, CANIDMR0/1) are applied.
Module Base + 0x0010 (CANIDAR0)
0x0011 (CANIDAR1)
0x0012 (CANIDAR2)
0x0013 (CANIDAR3)
7
6
5
4
3
2
1
0
R
W
AC7
AC6
AC5
AC4
AC3
AC2
AC1
AC0
Reset
0
0
0
0
0
0
0
0
7
6
5
4
3
2
1
0
R
W
AC7
AC6
AC5
AC4
AC3
AC2
AC1
AC0
Reset
0
0
0
0
0
0
0
0
7
6
5
4
3
2
1
0
R
W
AC7
AC6
AC5
AC4
AC3
AC2
AC1
AC0
Reset
0
0
0
0
0
0
0
0
7
6
5
4
3
2
1
0
R
W
AC7
AC6
AC5
AC4
AC3
AC2
AC1
AC0
Reset
0
0
0
0
0
0
0
0
Figure 14-19. MSCAN Identifier Acceptance Registers (First Bank) — CANIDAR0–CANIDAR3
Read: Anytime
Write: Anytime in initialization mode (INITRQ = 1 and INITAK = 1)
Table 14-21. CANIDAR0–CANIDAR3 Register Field Descriptions
Field
Description
7:0
AC[7:0]
Acceptance Code Bits — AC[7:0] comprise a user-defined sequence of bits with which the corresponding bits
of the related identifier register (IDRn) of the receive message buffer are compared. The result of this comparison
is then masked with the corresponding identifier mask register.
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Module Base + 0x0018 (CANIDAR4)
0x0019 (CANIDAR5)
0x001A (CANIDAR6)
0x001B (CANIDAR7)
7
6
5
4
3
2
1
0
R
W
AC7
AC6
AC5
AC4
AC3
AC2
AC1
AC0
Reset
0
0
0
0
0
0
0
0
7
6
5
4
3
2
1
0
R
W
AC7
AC6
AC5
AC4
AC3
AC2
AC1
AC0
Reset
0
0
0
0
0
0
0
0
7
6
5
4
3
2
1
0
R
W
AC7
AC6
AC5
AC4
AC3
AC2
AC1
AC0
Reset
0
0
0
0
0
0
0
0
7
6
5
4
3
2
1
0
R
W
AC7
AC6
AC5
AC4
AC3
AC2
AC1
AC0
Reset
0
0
0
0
0
0
0
0
Figure 14-20. MSCAN Identifier Acceptance Registers (Second Bank) — CANIDAR4–CANIDAR7
Read: Anytime
Write: Anytime in initialization mode (INITRQ = 1 and INITAK = 1)
Table 14-22. CANIDAR4–CANIDAR7 Register Field Descriptions
Field
Description
7:0
AC[7:0]
Acceptance Code Bits — AC[7:0] comprise a user-defined sequence of bits with which the corresponding bits
of the related identifier register (IDRn) of the receive message buffer are compared. The result of this comparison
is then masked with the corresponding identifier mask register.
MC9S12XDP512 Data Sheet, Rev. 2.11
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14.3.2.18 MSCAN Identifier Mask Registers (CANIDMR0–CANIDMR7)
The identifier mask register specifies which of the corresponding bits in the identifier acceptance register
are relevant for acceptance filtering. To receive standard identifiers in 32 bit filter mode, it is required to
program the last three bits (AM[2:0]) in the mask registers CANIDMR1 and CANIDMR5 to “don’t care.”
To receive standard identifiers in 16 bit filter mode, it is required to program the last three bits (AM[2:0])
in the mask registers CANIDMR1, CANIDMR3, CANIDMR5, and CANIDMR7 to “don’t care.”
Module Base + 0x0014 (CANIDMR0)
0x0015 (CANIDMR1)
0x0016 (CANIDMR2)
0x0017 (CANIDMR3)
7
6
5
4
3
2
1
0
R
W
AM7
AM6
AM5
AM4
AM3
AM2
AM1
AM0
Reset
0
0
0
0
0
0
0
0
7
6
5
4
3
2
1
0
R
W
AM7
AM6
AM5
AM4
AM3
AM2
AM1
AM0
Reset
0
0
0
0
0
0
0
0
7
6
5
4
3
2
1
0
R
W
AM7
AM6
AM5
AM4
AM3
AM2
AM1
AM0
Reset
0
0
0
0
0
0
0
0
7
6
5
4
3
2
1
0
R
W
AM7
AM6
AM5
AM4
AM3
AM2
AM1
AM0
Reset
0
0
0
0
0
0
0
0
Figure 14-21. MSCAN Identifier Mask Registers (First Bank) — CANIDMR0–CANIDMR3
Read: Anytime
Write: Anytime in initialization mode (INITRQ = 1 and INITAK = 1)
Table 14-23. CANIDMR0–CANIDMR3 Register Field Descriptions
Field
Description
7:0
AM[7:0]
Acceptance Mask Bits — If a particular bit in this register is cleared, this indicates that the corresponding bit in
the identifier acceptance register must be the same as its identifier bit before a match is detected. The message
is accepted if all such bits match. If a bit is set, it indicates that the state of the corresponding bit in the identifier
acceptance register does not affect whether or not the message is accepted.
0 Match corresponding acceptance code register and identifier bits
1 Ignore corresponding acceptance code register bit
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Module Base + 0x001C (CANIDMR4)
0x001D (CANIDMR5)
0x001E (CANIDMR6)
0x001F (CANIDMR7)
7
6
5
4
3
2
1
0
R
W
AM7
AM6
AM5
AM4
AM3
AM2
AM1
AM0
Reset
0
0
0
0
0
0
0
0
7
6
5
4
3
2
1
0
R
W
AM7
AM6
AM5
AM4
AM3
AM2
AM1
AM0
Reset
0
0
0
0
0
0
0
0
7
6
5
4
3
2
1
0
R
W
AM7
AM6
AM5
AM4
AM3
AM2
AM1
AM0
Reset
0
0
0
0
0
0
0
0
7
6
5
4
3
2
1
0
R
W
AM7
AM6
AM5
AM4
AM3
AM2
AM1
AM0
Reset
0
0
0
0
0
0
0
0
Figure 14-22. MSCAN Identifier Mask Registers (Second Bank) — CANIDMR4–CANIDMR7
Read: Anytime
Write: Anytime in initialization mode (INITRQ = 1 and INITAK = 1)
Table 14-24. CANIDMR4–CANIDMR7 Register Field Descriptions
Field
Description
7:0
AM[7:0]
Acceptance Mask Bits — If a particular bit in this register is cleared, this indicates that the corresponding bit in
the identifier acceptance register must be the same as its identifier bit before a match is detected. The message
is accepted if all such bits match. If a bit is set, it indicates that the state of the corresponding bit in the identifier
acceptance register does not affect whether or not the message is accepted.
0 Match corresponding acceptance code register and identifier bits
1 Ignore corresponding acceptance code register bit
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Chapter 14 Freescale’s Scalable Controller Area Network (S12MSCANV3)
14.3.3 Programmer’s Model of Message Storage
The following section details the organization of the receive and transmit message buffers and the
associated control registers.
To simplify the programmer interface, the receive and transmit message buffers have the same outline.
Each message buffer allocates 16 bytes in the memory map containing a 13 byte data structure.
An additional transmit buffer priority register (TBPR) is defined for the transmit buffers. Within the last
two bytes of this memory map, the MSCAN stores a special 16-bit time stamp, which is sampled from an
internal timer after successful transmission or reception of a message. This feature is only available for
transmit and receiver buffers, if the TIME bit is set (see Section 14.3.2.1, “MSCAN Control Register 0
(CANCTL0)”).
The time stamp register is written by the MSCAN. The CPU can only read these registers.
Table 14-25. Message Buffer Organization
Offset
Address
Register
Access
0x00X0
0x00X1
0x00X2
0x00X3
0x00X4
0x00X5
0x00X6
0x00X7
0x00X8
0x00X9
0x00XA
0x00XB
0x00XC
0x00XD
0x00XE
0x00XF
Identifier Register 0
Identifier Register 1
Identifier Register 2
Identifier Register 3
Data Segment Register 0
Data Segment Register 1
Data Segment Register 2
Data Segment Register 3
Data Segment Register 4
Data Segment Register 5
Data Segment Register 6
Data Segment Register 7
Data Length Register
1
Transmit Buffer Priority Register
2
Time Stamp Register (High Byte)
3
Time Stamp Register (Low Byte)
1
2
Not applicable for receive buffers
Read-only for CPU
Read-only for CPU
Figure 14-23 shows the common 13-byte data structure of receive and transmit buffers for extended
identifiers. The mapping of standard identifiers into the IDR registers is shown in Figure 14-24.
1
All bits of the receive and transmit buffers are ‘x’ out of reset because of RAM-based implementation .
All reserved or unused bits of the receive and transmit buffers always read ‘x’.
1. Exception: The transmit priority registers are 0 out of reset.
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Register
Name
Bit 7
6
5
4
3
2
1
Bit0
R
0x00X0
IDR0
ID28
ID27
ID26
ID25
ID24
ID23
ID22
ID21
W
R
0x00X1
IDR1
ID20
ID14
ID6
ID19
ID13
ID5
ID18
ID12
ID4
SRR (=1)
ID11
ID3
IDE (=1)
ID10
ID2
ID17
ID9
ID16
ID8
ID15
ID7
W
R
0x00X2
IDR2
W
R
0x00X3
IDR3
ID1
ID0
RTR
DB0
DB0
DB0
DB0
DB0
DB0
DB0
DB0
DLC0
W
R
0x00X4
DSR0
DB7
DB7
DB7
DB7
DB7
DB7
DB7
DB7
DB6
DB6
DB6
DB6
DB6
DB6
DB6
DB6
DB5
DB5
DB5
DB5
DB5
DB5
DB5
DB5
DB4
DB4
DB4
DB4
DB4
DB4
DB4
DB4
DB3
DB3
DB3
DB3
DB3
DB3
DB3
DB3
DLC3
DB2
DB2
DB2
DB2
DB2
DB2
DB2
DB2
DLC2
DB1
DB1
DB1
DB1
DB1
DB1
DB1
DB1
DLC1
W
R
0x00X5
DSR1
W
R
0x00X6
DSR2
W
R
0x00X7
DSR3
W
R
0x00X8
DSR4
W
R
0x00X9
DSR5
W
R
0x00XA
DSR6
W
R
0x00XB
DSR7
W
R
0x00XC
DLR
W
= Unused, always read ‘x’
Figure 14-23. Receive/Transmit Message Buffer — Extended Identifier Mapping
Flag Register (CANTFLG)”) and the corresponding transmit buffer is selected in CANTBSEL (see
Section 14.3.2.11, “MSCAN Transmit Buffer Selection Register (CANTBSEL)”). For receive buffers,
only when RXF flag is set (see Section 14.3.2.5, “MSCAN Receiver Flag Register (CANRFLG)”).
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Chapter 14 Freescale’s Scalable Controller Area Network (S12MSCANV3)
Flag Register (CANTFLG)”) and the corresponding transmit buffer is selected in CANTBSEL (see
Section 14.3.2.11, “MSCAN Transmit Buffer Selection Register (CANTBSEL)”). Unimplemented for
receive buffers.
Reset: Undefined (0x00XX) because of RAM-based implementation
Register
Name
Bit 7
6
5
4
3
2
1
Bit 0
R
IDR0
0x00X0
ID10
ID9
ID8
ID7
ID6
ID5
ID4
ID3
W
R
IDR1
0x00X1
ID2
ID1
ID0
RTR
IDE (=0)
W
R
IDR2
0x00X2
W
R
IDR3
0x00X3
W
= Unused, always read ‘x’
Figure 14-24. Receive/Transmit Message Buffer — Standard Identifier Mapping
14.3.3.1 Identifier Registers (IDR0–IDR3)
The identifier registers for an extended format identifier consist of a total of 32 bits; ID[28:0], SRR, IDE,
and RTR bits. The identifier registers for a standard format identifier consist of a total of 13 bits; ID[10:0],
RTR, and IDE bits.
14.3.3.1.1
IDR0–IDR3 for Extended Identifier Mapping
Module Base + 0x00X1
7
6
5
4
3
2
1
0
R
ID28
W
ID27
ID26
ID25
ID24
ID23
ID22
ID21
Reset:
x
x
x
x
x
x
x
x
Figure 14-25. Identifier Register 0 (IDR0) — Extended Identifier Mapping
Table 14-26. IDR0 Register Field Descriptions — Extended
Description
Field
7:0
ID[28:21]
Extended Format Identifier — The identifiers consist of 29 bits (ID[28:0]) for the extended format. ID28 is the
most significant bit and is transmitted first on the CAN bus during the arbitration procedure. The priority of an
identifier is defined to be highest for the smallest binary number.
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Module Base + 0x00X1
7
6
5
4
3
2
1
0
R
ID20
W
ID19
ID18
SRR (=1)
IDE (=1)
ID17
ID16
ID15
Reset:
x
x
x
x
x
x
x
x
Figure 14-26. Identifier Register 1 (IDR1) — Extended Identifier Mapping
Table 14-27. IDR1 Register Field Descriptions — Extended
Description
Field
7:5
ID[20:18]
Extended Format Identifier — The identifiers consist of 29 bits (ID[28:0]) for the extended format. ID28 is the
most significant bit and is transmitted first on the CAN bus during the arbitration procedure. The priority of an
identifier is defined to be highest for the smallest binary number.
4
Substitute Remote Request — This fixed recessive bit is used only in extended format. It must be set to 1 by
SRR
the user for transmission buffers and is stored as received on the CAN bus for receive buffers.
3
IDE
ID Extended — This flag indicates whether the extended or standard identifier format is applied in this buffer. In
the case of a receive buffer, the flag is set as received and indicates to the CPU how to process the buffer
identifier registers. In the case of a transmit buffer, the flag indicates to the MSCAN what type of identifier to send.
0 Standard format (11 bit)
1 Extended format (29 bit)
2:0
ID[17:15]
Extended Format Identifier — The identifiers consist of 29 bits (ID[28:0]) for the extended format. ID28 is the
most significant bit and is transmitted first on the CAN bus during the arbitration procedure. The priority of an
identifier is defined to be highest for the smallest binary number.
Module Base + 0x00X2
7
6
5
4
3
2
1
0
R
ID14
W
ID13
ID12
ID11
ID10
ID9
ID8
ID7
Reset:
x
x
x
x
x
x
x
x
Figure 14-27. Identifier Register 2 (IDR2) — Extended Identifier Mapping
Table 14-28. IDR2 Register Field Descriptions — Extended
Description
Field
7:0
ID[14:7]
Extended Format Identifier — The identifiers consist of 29 bits (ID[28:0]) for the extended format. ID28 is the
most significant bit and is transmitted first on the CAN bus during the arbitration procedure. The priority of an
identifier is defined to be highest for the smallest binary number.
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Module Base + 0x00X3
7
6
5
4
3
2
1
0
R
W
ID6
ID5
ID4
ID3
ID2
ID1
ID0
RTR
Reset:
x
x
x
x
x
x
x
x
Figure 14-28. Identifier Register 3 (IDR3) — Extended Identifier Mapping
Table 14-29. IDR3 Register Field Descriptions — Extended
Description
Field
7:1
ID[6:0]
Extended Format Identifier — The identifiers consist of 29 bits (ID[28:0]) for the extended format. ID28 is the
most significant bit and is transmitted first on the CAN bus during the arbitration procedure. The priority of an
identifier is defined to be highest for the smallest binary number.
0
Remote Transmission Request — This flag reflects the status of the remote transmission request bit in the
RTR
CAN frame. In the case of a receive buffer, it indicates the status of the received frame and supports the
transmission of an answering frame in software. In the case of a transmit buffer, this flag defines the setting of
the RTR bit to be sent.
0 Data frame
1 Remote frame
14.3.3.1.2
IDR0–IDR3 for Standard Identifier Mapping
Module Base + 0x00X0
7
6
5
4
3
2
1
0
R
ID10
W
ID9
ID8
ID7
ID6
ID5
ID4
ID3
Reset:
x
x
x
x
x
x
x
x
Figure 14-29. Identifier Register 0 — Standard Mapping
Table 14-30. IDR0 Register Field Descriptions — Standard
Description
Field
7:0
ID[10:3]
Standard Format Identifier — The identifiers consist of 11 bits (ID[10:0]) for the standard format. ID10 is the
most significant bit and is transmitted first on the CAN bus during the arbitration procedure. The priority of an
identifier is defined to be highest for the smallest binary number. See also ID bits in Table 14-31.
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Module Base + 0x00X1
7
6
5
4
3
2
1
0
R
ID2
W
ID1
ID0
RTR
IDE (=0)
Reset:
x
x
x
x
x
x
x
x
= Unused; always read ‘x’
Figure 14-30. Identifier Register 1 — Standard Mapping
Table 14-31. IDR1 Register Field Descriptions
Description
Field
7:5
ID[2:0]
Standard Format Identifier — The identifiers consist of 11 bits (ID[10:0]) for the standard format. ID10 is the
most significant bit and is transmitted first on the CAN bus during the arbitration procedure. The priority of an
identifier is defined to be highest for the smallest binary number. See also ID bits in Table 14-30.
4
Remote Transmission Request — This flag reflects the status of the Remote Transmission Request bit in the
RTR
CAN frame. In the case of a receive buffer, it indicates the status of the received frame and supports the
transmission of an answering frame in software. In the case of a transmit buffer, this flag defines the setting of
the RTR bit to be sent.
0 Data frame
1 Remote frame
3
IDE
ID Extended — This flag indicates whether the extended or standard identifier format is applied in this buffer. In
the case of a receive buffer, the flag is set as received and indicates to the CPU how to process the buffer
identifier registers. In the case of a transmit buffer, the flag indicates to the MSCAN what type of identifier to send.
0 Standard format (11 bit)
1 Extended format (29 bit)
Module Base + 0x00X2
7
6
5
4
3
2
1
0
R
W
Reset:
x
x
x
x
x
x
x
x
= Unused; always read ‘x’
Figure 14-31. Identifier Register 2 — Standard Mapping
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Module Base + 0x00X3
7
6
5
4
3
2
1
0
R
W
Reset:
x
x
x
x
x
x
x
x
= Unused; always read ‘x’
Figure 14-32. Identifier Register 3 — Standard Mapping
14.3.3.2 Data Segment Registers (DSR0-7)
The eight data segment registers, each with bits DB[7:0], contain the data to be transmitted or received.
The number of bytes to be transmitted or received is determined by the data length code in the
corresponding DLR register.
Module Base + 0x0004 (DSR0)
0x0005 (DSR1)
0x0006 (DSR2)
0x0007 (DSR3)
0x0008 (DSR4)
0x0009 (DSR5)
0x000A (DSR6)
0x000B (DSR7)
7
6
5
4
3
2
1
0
R
W
DB7
DB6
DB5
DB4
DB3
DB2
DB1
DB0
Reset:
x
x
x
x
x
x
x
x
Figure 14-33. Data Segment Registers (DSR0–DSR7) — Extended Identifier Mapping
Table 14-32. DSR0–DSR7 Register Field Descriptions
Field
Description
7:0
Data bits 7:0
DB[7:0]
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14.3.3.3 Data Length Register (DLR)
This register keeps the data length field of the CAN frame.
Module Base + 0x00XB
7
6
5
4
3
2
1
0
R
W
DLC3
DLC2
DLC1
DLC0
Reset:
x
x
x
x
x
x
x
x
= Unused; always read “x”
Figure 14-34. Data Length Register (DLR) — Extended Identifier Mapping
Table 14-33. DLR Register Field Descriptions
Description
Field
3:0
DLC[3:0]
Data Length Code Bits — The data length code contains the number of bytes (data byte count) of the respective
message. During the transmission of a remote frame, the data length code is transmitted as programmed while
the number of transmitted data bytes is always 0. The data byte count ranges from 0 to 8 for a data frame.
Table 14-34 shows the effect of setting the DLC bits.
Table 14-34. Data Length Codes
Data Length Code
Data Byte
Count
DLC3
DLC2
DLC1
DLC0
0
0
0
0
0
0
0
0
1
0
0
0
0
1
1
1
1
0
0
0
1
1
0
0
1
1
0
0
1
0
1
0
1
0
1
0
0
1
2
3
4
5
6
7
8
14.3.3.4 Transmit Buffer Priority Register (TBPR)
This register defines the local priority of the associated message buffer. The local priority is used for the
internal prioritization process of the MSCAN and is defined to be highest for the smallest binary number.
The MSCAN implements the following internal prioritization mechanisms:
•
All transmission buffers with a cleared TXEx flag participate in the prioritization immediately
before the SOF (start of frame) is sent.
•
The transmission buffer with the lowest local priority field wins the prioritization.
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In cases of more than one buffer having the same lowest priority, the message buffer with the lower index
number wins.
Module Base + 0xXXXD
7
6
5
4
3
2
1
0
R
W
PRIO7
PRIO6
PRIO5
PRIO4
PRIO3
PRIO2
PRIO1
PRIO0
Reset:
0
0
0
0
0
0
0
0
Figure 14-35. Transmit Buffer Priority Register (TBPR)
(CANTFLG)”) and the corresponding transmit buffer is selected in CANTBSEL (see Section 14.3.2.11,
(CANTFLG)”) and the corresponding transmit buffer is selected in CANTBSEL (see Section 14.3.2.11,
“MSCAN Transmit Buffer Selection Register (CANTBSEL)”).
14.3.3.5 Time Stamp Register (TSRH–TSRL)
If the TIME bit is enabled, the MSCAN will write a special time stamp to the respective registers in the
active transmit or receive buffer as soon as a message has been acknowledged on the CAN bus (see
Section 14.3.2.1, “MSCAN Control Register 0 (CANCTL0)”). The time stamp is written on the bit sample
point for the recessive bit of the ACK delimiter in the CAN frame. In case of a transmission, the CPU can
only read the time stamp after the respective transmit buffer has been flagged empty.
The timer value, which is used for stamping, is taken from a free running internal CAN bit clock. A timer
overrun is not indicated by the MSCAN. The timer is reset (all bits set to 0) during initialization mode. The
CPU can only read the time stamp registers.
Module Base + 0xXXXE
7
6
5
4
3
2
1
0
R
W
TSR15
TSR14
TSR13
TSR12
TSR11
TSR10
TSR9
TSR8
Reset:
x
x
x
x
x
x
x
x
Figure 14-36. Time Stamp Register — High Byte (TSRH)
Module Base + 0xXXXF
7
6
5
4
3
2
1
0
R
W
TSR7
TSR6
TSR5
TSR4
TSR3
TSR2
TSR1
TSR0
Reset:
x
x
x
x
x
x
x
x
Figure 14-37. Time Stamp Register — Low Byte (TSRL)
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(CANTFLG)”) and the corresponding transmit buffer is selected in CANTBSEL (see Section 14.3.2.11,
“MSCAN Transmit Buffer Selection Register (CANTBSEL)”).
Write: Unimplemented
14.4 Functional Description
14.4.1 General
This section provides a complete functional description of the MSCAN. It describes each of the features
and modes listed in the introduction.
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Chapter 14 Freescale’s Scalable Controller Area Network (S12MSCANV3)
14.4.2 Message Storage
CAN
Receive / Transmit
Engine
CPU12
Memory Mapped
I/O
Rx0
Rx1
Rx2
MSCAN
Rx3
Rx4
RXF
CPU bus
Receiver
TXE0
Tx0
PRIO
TXE1
Tx1
CPU bus
MSCAN
PRIO
TXE2
Tx2
PRIO
Transmitter
Figure 14-38. User Model for Message Buffer Organization
MSCAN facilitates a sophisticated message storage system which addresses the requirements of a broad
range of network applications.
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14.4.2.1 Message Transmit Background
Modern application layer software is built upon two fundamental assumptions:
•
Any CAN node is able to send out a stream of scheduled messages without releasing the CAN bus
between the two messages. Such nodes arbitrate for the CAN bus immediately after sending the
previous message and only release the CAN bus in case of lost arbitration.
•
The internal message queue within any CAN node is organized such that the highest priority
message is sent out first, if more than one message is ready to be sent.
The behavior described in the bullets above cannot be achieved with a single transmit buffer. That buffer
must be reloaded immediately after the previous message is sent. This loading process lasts a finite amount
of time and must be completed within the inter-frame sequence (IFS) to be able to send an uninterrupted
stream of messages. Even if this is feasible for limited CAN bus speeds, it requires that the CPU reacts
with short latencies to the transmit interrupt.
A double buffer scheme de-couples the reloading of the transmit buffer from the actual message sending
and, therefore, reduces the reactiveness requirements of the CPU. Problems can arise if the sending of a
message is finished while the CPU re-loads the second buffer. No buffer would then be ready for
transmission, and the CAN bus would be released.
At least three transmit buffers are required to meet the first of the above requirements under all
circumstances. The MSCAN has three transmit buffers.
The second requirement calls for some sort of internal prioritization which the MSCAN implements with
the “local priority” concept described in Section 14.4.2.2, “Transmit Structures.”
14.4.2.2 Transmit Structures
The MSCAN triple transmit buffer scheme optimizes real-time performance by allowing multiple
messages to be set up in advance. The three buffers are arranged as shown in Figure 14-38.
“Transmit Buffer Priority Register (TBPR)”). The remaining two bytes are used for time stamping of a
message, if required (see Section 14.3.3.5, “Time Stamp Register (TSRH–TSRL)”).
To transmit a message, the CPU must identify an available transmit buffer, which is indicated by a set
(CANTFLG)”). If a transmit buffer is available, the CPU must set a pointer to this buffer by writing to the
(CANTBSEL)”). This makes the respective buffer accessible within the CANTXFG address space (see
Section 14.3.3, “Programmer’s Model of Message Storage”). The algorithmic feature associated with the
CANTBSEL register simplifies the transmit buffer selection. In addition, this scheme makes the handler
software simpler because only one address area is applicable for the transmit process, and the required
address space is minimized.
The CPU then stores the identifier, the control bits, and the data content into one of the transmit buffers.
Finally, the buffer is flagged as ready for transmission by clearing the associated TXE flag.
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The MSCAN then schedules the message for transmission and signals the successful transmission of the
buffer by setting the associated TXE flag. A transmit interrupt (see Section 14.4.8.2, “Transmit Interrupt”)
1
is generated when TXEx is set and can be used to drive the application software to re-load the buffer.
If more than one buffer is scheduled for transmission when the CAN bus becomes available for arbitration,
the MSCAN uses the local priority setting of the three buffers to determine the prioritization. For this
purpose, every transmit buffer has an 8-bit local priority field (PRIO). The application software programs
this field when the message is set up. The local priority reflects the priority of this particular message
relative to the set of messages being transmitted from this node. The lowest binary value of the PRIO field
is defined to be the highest priority. The internal scheduling process takes place whenever the MSCAN
arbitrates for the CAN bus. This is also the case after the occurrence of a transmission error.
When a high priority message is scheduled by the application software, it may become necessary to abort
transmission cannot be aborted, the user must request the abort by setting the corresponding abort request
bit (ABTRQ) (see Section 14.3.2.9, “MSCAN Transmitter Message Abort Request Register
(CANTARQ)”.) The MSCAN then grants the request, if possible, by:
1. Setting the corresponding abort acknowledge flag (ABTAK) in the CANTAAK register.
2. Setting the associated TXE flag to release the buffer.
3. Generating a transmit interrupt. The transmit interrupt handler software can determine from the
setting of the ABTAK flag whether the message was aborted (ABTAK = 1) or sent (ABTAK = 0).
14.4.2.3 Receive Structures
The received messages are stored in a five stage input FIFO. The five message buffers are alternately
exclusively associated with the MSCAN, but the foreground receive buffer (RxFG) is addressable by the
CPU (see Figure 14-38). This scheme simplifies the handler software because only one address area is
applicable for the receive process.
All receive buffers have a size of 15 bytes to store the CAN control bits, the identifier (standard or
extended), the data contents, and a time stamp, if enabled (see Section 14.3.3, “Programmer’s Model of
The receiver full flag (RXF) (see Section 14.3.2.5, “MSCAN Receiver Flag Register (CANRFLG)”)
signals the status of the foreground receive buffer. When the buffer contains a correctly received message
with a matching identifier, this flag is set.
On reception, each message is checked to see whether it passes the filter (see Section 14.4.3, “Identifier
Acceptance Filter”) and simultaneously is written into the active RxBG. After successful reception of a
2
valid message, the MSCAN shifts the content of RxBG into the receiver FIFO , sets the RXF flag, and
3
generates a receive interrupt (see Section 14.4.8.3, “Receive Interrupt”) to the CPU . The user’s receive
handler must read the received message from the RxFG and then reset the RXF flag to acknowledge the
interrupt and to release the foreground buffer. A new message, which can follow immediately after the IFS
1. The transmit interrupt occurs only if not masked. A polling scheme can be applied on TXEx also.
2. Only if the RXF flag is not set.
3. The receive interrupt occurs only if not masked. A polling scheme can be applied on RXF also.
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field of the CAN frame, is received into the next available RxBG. If the MSCAN receives an invalid
message in its RxBG (wrong identifier, transmission errors, etc.) the actual contents of the buffer will be
over-written by the next message. The buffer will then not be shifted into the FIFO.
When the MSCAN module is transmitting, the MSCAN receives its own transmitted messages into the
background receive buffer, RxBG, but does not shift it into the receiver FIFO, generate a receive interrupt,
or acknowledge its own messages on the CAN bus. The exception to this rule is in loopback mode (see
Section 14.3.2.2, “MSCAN Control Register 1 (CANCTL1)”) where the MSCAN treats its own messages
exactly like all other incoming messages. The MSCAN receives its own transmitted messages in the event
that it loses arbitration. If arbitration is lost, the MSCAN must be prepared to become a receiver.
An overrun condition occurs when all receive message buffers in the FIFO are filled with correctly
received messages with accepted identifiers and another message is correctly received from the CAN bus
with an accepted identifier. The latter message is discarded and an error interrupt with overrun indication
is generated if enabled (see Section 14.4.8.5, “Error Interrupt”). The MSCAN remains able to transmit
messages while the receiver FIFO being filled, but all incoming messages are discarded. As soon as a
receive buffer in the FIFO is available again, new valid messages will be accepted.
14.4.3 Identifier Acceptance Filter
The MSCAN identifier acceptance registers (see Section 14.3.2.12, “MSCAN Identifier Acceptance
(ID[10:0] or ID[28:0]). Any of these bits can be marked ‘don’t care’ in the MSCAN identifier mask
registers (see Section 14.3.2.18, “MSCAN Identifier Mask Registers (CANIDMR0–CANIDMR7)”).
A filter hit is indicated to the application software by a set receive buffer full flag (RXF = 1) and three bits
in the CANIDAC register (see Section 14.3.2.12, “MSCAN Identifier Acceptance Control Register
(CANIDAC)”). These identifier hit flags (IDHIT[2:0]) clearly identify the filter section that caused the
acceptance. They simplify the application software’s task to identify the cause of the receiver interrupt. If
more than one hit occurs (two or more filters match), the lower hit has priority.
A very flexible programmable generic identifier acceptance filter has been introduced to reduce the CPU
interrupt loading. The filter is programmable to operate in four different modes (see Bosch CAN 2.0A/B
protocol specification):
•
Two identifier acceptance filters, each to be applied to:
— The full 29 bits of the extended identifier and to the following bits of the CAN 2.0B frame:
– Remote transmission request (RTR)
– Identifier extension (IDE)
– Substitute remote request (SRR)
1
This mode implements two filters for a full length CAN 2.0B compliant extended identifier.
Figure 14-39 shows how the first 32-bit filter bank (CANIDAR0–CANIDAR3,
CANIDMR0–CANIDMR3) produces a filter 0 hit. Similarly, the second filter bank
(CANIDAR4–CANIDAR7, CANIDMR4–CANIDMR7) produces a filter 1 hit.
1.Although this mode can be used for standard identifiers, it is recommended to use the four or eight identifier acceptance
filters for standard identifiers
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•
Four identifier acceptance filters, each to be applied to
— a) the 14 most significant bits of the extended identifier plus the SRR and IDE bits of CAN 2.0B
messages or
— b) the 11 bits of the standard identifier, the RTR and IDE bits of CAN 2.0A/B messages.
Figure 14-40 shows how the first 32-bit filter bank (CANIDAR0–CANIDA3,
CANIDMR0–3CANIDMR) produces filter 0 and 1 hits. Similarly, the second filter bank
(CANIDAR4–CANIDAR7, CANIDMR4–CANIDMR7) produces filter 2 and 3 hits.
•
•
Eight identifier acceptance filters, each to be applied to the first 8 bits of the identifier. This mode
implements eight independent filters for the first 8 bits of a CAN 2.0A/B compliant standard
identifier or a CAN 2.0B compliant extended identifier. Figure 14-41 shows how the first 32-bit
filter bank (CANIDAR0–CANIDAR3, CANIDMR0–CANIDMR3) produces filter 0 to 3 hits.
Similarly, the second filter bank (CANIDAR4–CANIDAR7, CANIDMR4–CANIDMR7)
produces filter 4 to 7 hits.
Closed filter. No CAN message is copied into the foreground buffer RxFG, and the RXF flag is
never set.
CAN 2.0B
Extended Identifier
ID28
ID10
IDR0
IDR0
ID21 ID20
ID3 ID2
IDR1
IDR1
ID15 ID14
IDR2
ID7 ID6
IDR3
RTR
CAN 2.0A/B
Standard Identifier
IDE
AM7
AC7
CANIDMR0
CANIDAR0
AM0 AM7
AC0 AC7
CANIDMR1
CANIDAR1
AM0 AM7
AC0 AC7
CANIDMR2
CANIDAR2
AM0 AM7
AC0 AC7
CANIDMR3
CANIDAR3
AM0
AC0
ID Accepted (Filter 0 Hit)
Figure 14-39. 32-bit Maskable Identifier Acceptance Filter
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CAN 2.0B
Extended Identifier
ID28
ID10
IDR0
IDR0
ID21 ID20
ID3 ID2
IDR1
IDR1
ID15 ID14
IDE
IDR2
ID7 ID6
IDR3
RTR
CAN 2.0A/B
Standard Identifier
AM7
AC7
CANIDMR0
CANIDAR0
AM0 AM7
AC0 AC7
CANIDMR1
CANIDAR1
AM0
AC0
ID Accepted (Filter 0 Hit)
AM7
AC7
CANIDMR2
CANIDAR2
AM0 AM7
AC0 AC7
CANIDMR3
AM0
AC0
CANIDAR3
ID Accepted (Filter 1 Hit)
Figure 14-40. 16-bit Maskable Identifier Acceptance Filters
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CAN 2.0B
Extended Identifier ID28
IDR0
IDR0
ID21 ID20
ID3 ID2
IDR1
IDR1
ID15 ID14
IDE
IDR2
ID7 ID6
IDR3
RTR
CAN 2.0A/B
ID10
Standard Identifier
AM7
AC7
CIDMR0
CIDAR0
AM0
AC0
ID Accepted (Filter 0 Hit)
AM7
AC7
CIDMR1
AM0
AC0
CIDAR1
ID Accepted (Filter 1 Hit)
AM7
AC7
CIDMR2
AM0
AC0
CIDAR2
ID Accepted (Filter 2 Hit)
AM7
AC7
CIDMR3
AM0
AC0
CIDAR3
ID Accepted (Filter 3 Hit)
Figure 14-41. 8-bit Maskable Identifier Acceptance Filters
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14.4.3.1 Protocol Violation Protection
The MSCAN protects the user from accidentally violating the CAN protocol through programming errors.
The protection logic implements the following features:
•
•
The receive and transmit error counters cannot be written or otherwise manipulated.
All registers which control the configuration of the MSCAN cannot be modified while the MSCAN
handshake bits in the CANCTL0/CANCTL1 registers (see Section 14.3.2.1, “MSCAN Control
Register 0 (CANCTL0)”) serve as a lock to protect the following registers:
— MSCAN control 1 register (CANCTL1)
— MSCAN bus timing registers 0 and 1 (CANBTR0, CANBTR1)
— MSCAN identifier acceptance control register (CANIDAC)
— MSCAN identifier acceptance registers (CANIDAR0–CANIDAR7)
— MSCAN identifier mask registers (CANIDMR0–CANIDMR7)
•
The TXCAN pin is immediately forced to a recessive state when the MSCAN goes into the power
down mode or initialization mode (see Section 14.4.6.6, “MSCAN Power Down Mode,” and
Section 14.4.6.5, “MSCAN Initialization Mode”).
The MSCAN enable bit (CANE) is writable only once in normal system operation modes, which
provides further protection against inadvertently disabling the MSCAN.
14.4.3.2 Clock System
Figure 14-42 shows the structure of the MSCAN clock generation circuitry.
MSCAN
Bus Clock
Time quanta clock (Tq)
CANCLK
Prescaler
(1 .. 64)
CLKSRC
CLKSRC
Oscillator Clock
Figure 14-42. MSCAN Clocking Scheme
The clock source bit (CLKSRC) in the CANCTL1 register (14.3.2.2/14-624) defines whether the internal
CANCLK is connected to the output of a crystal oscillator (oscillator clock) or to the bus clock.
The clock source has to be chosen such that the tight oscillator tolerance requirements (up to 0.4%) of the
CAN protocol are met. Additionally, for high CAN bus rates (1 Mbps), a 45% to 55% duty cycle of the
clock is required.
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If the bus clock is generated from a PLL, it is recommended to select the oscillator clock rather than the
bus clock due to jitter considerations, especially at the faster CAN bus rates.
For microcontrollers without a clock and reset generator (CRG), CANCLK is driven from the crystal
oscillator (oscillator clock).
A programmable prescaler generates the time quanta (Tq) clock from CANCLK. A time quantum is the
atomic unit of time handled by the MSCAN.
Eqn. 14-2
f
CANCLK
= -----------------------------------------------------
Tq
(Prescaler value)
A bit time is subdivided into three segments as described in the Bosch CAN specification. (see
Figure 14-43):
•
•
•
SYNC_SEG: This segment has a fixed length of one time quantum. Signal edges are expected to
happen within this section.
Time Segment 1: This segment includes the PROP_SEG and the PHASE_SEG1 of the CAN
standard. It can be programmed by setting the parameter TSEG1 to consist of 4 to 16 time quanta.
Time Segment 2: This segment represents the PHASE_SEG2 of the CAN standard. It can be
programmed by setting the TSEG2 parameter to be 2 to 8 time quanta long.
Eqn. 14-3
f
Tq
Bit Rate= --------------------------------------------------------------------------------
(number of Time Quanta)
NRZ Signal
Time Segment 1
Time Segment 2
(PHASE_SEG2)
SYNC_SEG
1
(PROP_SEG + PHASE_SEG1)
4 ... 16
2 ... 8
8 ... 25 Time Quanta
= 1 Bit Time
Transmit Point
Sample Point
(single or triple sampling)
Figure 14-43. Segments within the Bit Time
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Table 14-35. Time Segment Syntax
Syntax
Description
System expects transitions to occur on the CAN bus during this
period.
SYNC_SEG
A node in transmit mode transfers a new value to the CAN bus at
this point.
Transmit Point
Sample Point
A node in receive mode samples the CAN bus at this point. If the
three samples per bit option is selected, then this point marks the
position of the third sample.
The synchronization jump width (see the Bosch CAN specification for details) can be programmed in a
range of 1 to 4 time quanta by setting the SJW parameter.
registers (CANBTR0, CANBTR1) (see Section 14.3.2.3, “MSCAN Bus Timing Register 0 (CANBTR0)”
Table 14-36 gives an overview of the CAN compliant segment settings and the related parameter values.
NOTE
It is the user’s responsibility to ensure the bit time settings are in compliance
with the CAN standard.
Table 14-36. CAN Standard Compliant Bit Time Segment Settings
Synchronization
Time Segment 1
TSEG1
Time Segment 2
TSEG2
SJW
Jump Width
5 .. 10
4 .. 11
5 .. 12
6 .. 13
7 .. 14
8 .. 15
9 .. 16
4 .. 9
3 .. 10
4 .. 11
5 .. 12
6 .. 13
7 .. 14
8 .. 15
2
3
4
5
6
7
8
1
2
3
4
5
6
7
1 .. 2
1 .. 3
1 .. 4
1 .. 4
1 .. 4
1 .. 4
1 .. 4
0 .. 1
0 .. 2
0 .. 3
0 .. 3
0 .. 3
0 .. 3
0 .. 3
14.4.4 Timer Link
The MSCAN generates an internal time stamp whenever a valid frame is received or transmitted and the
TIME bit is enabled. Because the CAN specification defines a frame to be valid if no errors occur before
the end of frame (EOF) field is transmitted successfully, the actual value of an internal timer is written at
EOF to the appropriate time stamp position within the transmit buffer. For receive frames, the time stamp
is written to the receive buffer.
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14.4.5 Modes of Operation
14.4.5.1 Normal Modes
The MSCAN module behaves as described within this specification in all normal system operation modes.
14.4.5.2 Special Modes
The MSCAN module behaves as described within this specification in all special system operation modes.
14.4.5.3 Emulation Modes
In all emulation modes, the MSCAN module behaves just like normal system operation modes as
described within this specification.
14.4.5.4 Listen-Only Mode
In an optional CAN bus monitoring mode (listen-only), the CAN node is able to receive valid data frames
and valid remote frames, but it sends only “recessive” bits on the CAN bus. In addition, it cannot start a
transmision. If the MAC sub-layer is required to send a “dominant” bit (ACK bit, overload flag, or active
error flag), the bit is rerouted internally so that the MAC sub-layer monitors this “dominant” bit, although
the CAN bus may remain in recessive state externally.
14.4.5.5 Security Modes
The MSCAN module has no security features.
14.4.6 Low-Power Options
If the MSCAN is disabled (CANE = 0), the MSCAN clocks are stopped for power saving.
If the MSCAN is enabled (CANE = 1), the MSCAN has two additional modes with reduced power
consumption, compared to normal mode: sleep and power down mode. In sleep mode, power consumption
is reduced by stopping all clocks except those to access the registers from the CPU side. In power down
mode, all clocks are stopped and no power is consumed.
Table 14-37 summarizes the combinations of MSCAN and CPU modes. A particular combination of
modes is entered by the given settings on the CSWAI and SLPRQ/SLPAK bits.
For all modes, an MSCAN wake-up interrupt can occur only if the MSCAN is in sleep mode (SLPRQ = 1
and SLPAK = 1), wake-up functionality is enabled (WUPE = 1), and the wake-up interrupt is enabled
(WUPIE = 1).
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Table 14-37. CPU vs. MSCAN Operating Modes
MSCAN Mode
Reduced Power Consumption
CPU Mode
Normal
Disabled
(CANE=0)
Sleep
Power Down
1
CSWAI = X
SLPRQ = 1
SLPAK = 1
CSWAI = X
SLPRQ = X
SLPAK = X
CSWAI = X
RUN
SLPRQ = 0
SLPAK = 0
CSWAI = 0
SLPRQ = 0
SLPAK = 0
CSWAI = 0
SLPRQ = 1
SLPAK = 1
CSWAI = 1
SLPRQ = X
SLPAK = X
CSWAI = X
SLPRQ = X
SLPAK = X
WAIT
CSWAI = X
SLPRQ = X
SLPAK = X
CSWAI = X
SLPRQ = X
SLPAK = X
STOP
1
‘X’ means don’t care.
14.4.6.1 Operation in Run Mode
As shown in Table 14-37, only MSCAN sleep mode is available as low power option when the CPU is in
run mode.
14.4.6.2 Operation in Wait Mode
The WAI instruction puts the MCU in a low power consumption stand-by mode. If the CSWAI bit is set,
additional power can be saved in power down mode because the CPU clocks are stopped. After leaving
this power down mode, the MSCAN restarts its internal controllers and enters normal mode again.
While the CPU is in wait mode, the MSCAN can be operated in normal mode and generate interrupts
(registers can be accessed via background debug mode). The MSCAN can also operate in any of the
low-power modes depending on the values of the SLPRQ/SLPAK and CSWAI bits as seen in Table 14-37.
14.4.6.3 Operation in Stop Mode
The STOP instruction puts the MCU in a low power consumption stand-by mode. In stop mode, the
MSCAN is set in power down mode regardless of the value of the SLPRQ/SLPAK and CSWAI bits
Table 14-37.
14.4.6.4 MSCAN Sleep Mode
The CPU can request the MSCAN to enter this low power mode by asserting the SLPRQ bit in the
CANCTL0 register. The time when the MSCAN enters sleep mode depends on a fixed synchronization
delay and its current activity:
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•
If there are one or more message buffers scheduled for transmission (TXEx = 0), the MSCAN will
continue to transmit until all transmit message buffers are empty (TXEx = 1, transmitted
successfully or aborted) and then goes into sleep mode.
•
•
If the MSCAN is receiving, it continues to receive and goes into sleep mode as soon as the CAN
bus next becomes idle.
If the MSCAN is neither transmitting nor receiving, it immediately goes into sleep mode.
Bus Clock Domain
CAN Clock Domain
SLPRQ
Flag
SYNC
SYNC
SLPRQ
sync.
SLPRQ
CPU
Sleep Request
SLPAK
Flag
sync.
SLPAK
SLPAK
MSCAN
in Sleep Mode
Figure 14-44. Sleep Request / Acknowledge Cycle
NOTE
The application software must avoid setting up a transmission (by clearing
one or more TXEx flag(s)) and immediately request sleep mode (by setting
SLPRQ). Whether the MSCAN starts transmitting or goes into sleep mode
directly depends on the exact sequence of operations.
If sleep mode is active, the SLPRQ and SLPAK bits are set (Figure 14-44). The application software must
use SLPAK as a handshake indication for the request (SLPRQ) to go into sleep mode.
When in sleep mode (SLPRQ = 1 and SLPAK = 1), the MSCAN stops its internal clocks. However, clocks
that allow register accesses from the CPU side continue to run.
If the MSCAN is in bus-off state, it stops counting the 128 occurrences of 11 consecutive recessive bits
due to the stopped clocks. The TXCAN pin remains in a recessive state. If RXF = 1, the message can be
read and RXF can be cleared. Shifting a new message into the foreground buffer of the receiver FIFO
(RxFG) does not take place while in sleep mode.
It is possible to access the transmit buffers and to clear the associated TXE flags. No message abort takes
place while in sleep mode.
RXCAN pin is therefore held internally in a recessive state. This locks the MSCAN in sleep mode
(Figure 14-45).
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The MSCAN is able to leave sleep mode (wake up) only when:
•
CAN bus activity occurs and WUPE = 1
or
•
the CPU clears the SLPRQ bit
NOTE
The CPU cannot clear the SLPRQ bit before sleep mode (SLPRQ = 1 and
SLPAK = 1) is active.
After wake-up, the MSCAN waits for 11 consecutive recessive bits to synchronize to the CAN bus. As a
consequence, if the MSCAN is woken-up by a CAN frame, this frame is not received.
The receive message buffers (RxFG and RxBG) contain messages if they were received before sleep mode
was entered. All pending actions will be executed upon wake-up; copying of RxBG into RxFG, message
aborts and message transmissions. If the MSCAN remains in bus-off state after sleep mode was exited, it
continues counting the 128 occurrences of 11 consecutive recessive bits.
CAN Activity
(CAN Activity & WUPE) | SLPRQ
Wait
StartUp
for Idle
CAN Activity
SLPRQ
CAN Activity &
SLPRQ
Sleep
Idle
(CAN Activity & WUPE) |
CAN Activity
CAN Activity &
SLPRQ
CAN Activity
Tx/Rx
Message
Active
CAN Activity
Figure 14-45. Simplified State Transitions for Entering/Leaving Sleep Mode
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14.4.6.5 MSCAN Initialization Mode
In initialization mode, any on-going transmission or reception is immediately aborted and synchronization
to the CAN bus is lost, potentially causing CAN protocol violations. To protect the CAN bus system from
fatal consequences of violations, the MSCAN immediately drives the TXCAN pin into a recessive state.
NOTE
The user is responsible for ensuring that the MSCAN is not active when
initialization mode is entered. The recommended procedure is to bring the
MSCAN into sleep mode (SLPRQ = 1 and SLPAK = 1) before setting the
INITRQ bit in the CANCTL0 register. Otherwise, the abort of an on-going
message can cause an error condition and can impact other CAN bus
devices.
In initialization mode, the MSCAN is stopped. However, interface registers remain accessible. This mode
is used to reset the CANCTL0, CANRFLG, CANRIER, CANTFLG, CANTIER, CANTARQ,
configuration of the CANBTR0, CANBTR1 bit timing registers; CANIDAC; and the CANIDAR,
CANIDMR message filters. See Section 14.3.2.1, “MSCAN Control Register 0 (CANCTL0),” for a
detailed description of the initialization mode.
Bus Clock Domain
CAN Clock Domain
INIT
Flag
SYNC
SYNC
INITRQ
sync.
INITRQ
CPU
Init Request
INITAK
Flag
sync.
INITAK
INITAK
Figure 14-46. Initialization Request/Acknowledge Cycle
Due to independent clock domains within the MSCAN, INITRQ must be synchronized to all domains by
using a special handshake mechanism. This handshake causes additional synchronization delay (see
Section Figure 14-46., “Initialization Request/Acknowledge Cycle”).
If there is no message transfer ongoing on the CAN bus, the minimum delay will be two additional bus
clocks and three additional CAN clocks. When all parts of the MSCAN are in initialization mode, the
INITAK flag is set. The application software must use INITAK as a handshake indication for the request
(INITRQ) to go into initialization mode.
NOTE
The CPU cannot clear INITRQ before initialization mode (INITRQ = 1 and
INITAK = 1) is active.
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The MSCAN is in power down mode (Table 14-37) when
•
CPU is in stop mode
or
•
CPU is in wait mode and the CSWAI bit is set
When entering the power down mode, the MSCAN immediately stops all ongoing transmissions and
receptions, potentially causing CAN protocol violations. To protect the CAN bus system from fatal
consequences of violations to the above rule, the MSCAN immediately drives the TXCAN pin into a
recessive state.
NOTE
The user is responsible for ensuring that the MSCAN is not active when
power down mode is entered. The recommended procedure is to bring the
MSCAN into Sleep mode before the STOP or WAI instruction (if CSWAI
is set) is executed. Otherwise, the abort of an ongoing message can cause an
error condition and impact other CAN bus devices.
In power down mode, all clocks are stopped and no registers can be accessed. If the MSCAN was not in
sleep mode before power down mode became active, the module performs an internal recovery cycle after
powering up. This causes some fixed delay before the module enters normal mode again.
14.4.6.7 Programmable Wake-Up Function
The MSCAN can be programmed to wake up the MSCAN as soon as CAN bus activity is detected (see
existing CAN bus action can be modified by applying a low-pass filter function to the RXCAN input line
while in sleep mode (see control bit WUPM in Section 14.3.2.2, “MSCAN Control Register 1
(CANCTL1)”).
This feature can be used to protect the MSCAN from wake-up due to short glitches on the CAN bus lines.
Such glitches can result from—for example—electromagnetic interference within noisy environments.
14.4.7 Reset Initialization
The reset state of each individual bit is listed in Section 14.3.2, “Register Descriptions,” which details all
the registers and their bit-fields.
14.4.8 Interrupts
This section describes all interrupts originated by the MSCAN. It documents the enable bits and generated
flags. Each interrupt is listed and described separately.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
669
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Chapter 14 Freescale’s Scalable Controller Area Network (S12MSCANV3)
14.4.8.1 Description of Interrupt Operation
The MSCAN supports four interrupt vectors (see Table 14-38), any of which can be individually masked
(for details see sections from Section 14.3.2.6, “MSCAN Receiver Interrupt Enable Register
(CANRIER),” to Section 14.3.2.8, “MSCAN Transmitter Interrupt Enable Register (CANTIER)”).
NOTE
The dedicated interrupt vector addresses are defined in the Resets and
Interrupts chapter.
Table 14-38. Interrupt Vectors
Interrupt Source
CCR Mask
Local Enable
CANRIER (WUPIE)
Wake-Up Interrupt (WUPIF)
Error Interrupts Interrupt (CSCIF, OVRIF)
Receive Interrupt (RXF)
I bit
I bit
I bit
I bit
CANRIER (CSCIE, OVRIE)
CANRIER (RXFIE)
Transmit Interrupts (TXE[2:0])
CANTIER (TXEIE[2:0])
14.4.8.2 Transmit Interrupt
At least one of the three transmit buffers is empty (not scheduled) and can be loaded to schedule a message
for transmission. The TXEx flag of the empty message buffer is set.
14.4.8.3 Receive Interrupt
A message is successfully received and shifted into the foreground buffer (RxFG) of the receiver FIFO.
This interrupt is generated immediately after receiving the EOF symbol. The RXF flag is set. If there are
multiple messages in the receiver FIFO, the RXF flag is set as soon as the next message is shifted to the
foreground buffer.
14.4.8.4 Wake-Up Interrupt
A wake-up interrupt is generated if activity on the CAN bus occurs during MSCN internal sleep mode.
WUPE (see Section 14.3.2.1, “MSCAN Control Register 0 (CANCTL0)”) must be enabled.
14.4.8.5 Error Interrupt
An error interrupt is generated if an overrun of the receiver FIFO, error, warning, or bus-off condition
occurrs. Section 14.3.2.5, “MSCAN Receiver Flag Register (CANRFLG) indicates one of the following
conditions:
•
Overrun — An overrun condition of the receiver FIFO as described in Section 14.4.2.3, “Receive
Structures,” occurred.
•
CAN Status Change — The actual value of the transmit and receive error counters control the
CAN bus state of the MSCAN. As soon as the error counters skip into a critical range
(Tx/Rx-warning, Tx/Rx-error, bus-off) the MSCAN flags an error condition. The status change,
which caused the error condition, is indicated by the TSTAT and RSTAT flags (see
MC9S12XDP512 Data Sheet, Rev. 2.11
670
Freescale Semiconductor
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Section 14.3.2.5, “MSCAN Receiver Flag Register (CANRFLG)” and Section 14.3.2.6, “MSCAN
Receiver Interrupt Enable Register (CANRIER)”).
14.4.8.6 Interrupt Acknowledge
Interrupts are directly associated with one or more status flags in either the Section 14.3.2.5, “MSCAN
Receiver Flag Register (CANRFLG)” or the Section 14.3.2.7, “MSCAN Transmitter Flag Register
(CANTFLG).” Interrupts are pending as long as one of the corresponding flags is set. The flags in
CANRFLG and CANTFLG must be reset within the interrupt handler to handshake the interrupt. The flags
are reset by writing a 1 to the corresponding bit position. A flag cannot be cleared if the respective
condition prevails.
NOTE
It must be guaranteed that the CPU clears only the bit causing the current
interrupt. For this reason, bit manipulation instructions (BSET) must not be
used to clear interrupt flags. These instructions may cause accidental
clearing of interrupt flags which are set after entering the current interrupt
service routine.
14.4.8.7 Recovery from Stop or Wait
The MSCAN can recover from stop or wait via the wake-up interrupt. This interrupt can only occur if the
MSCAN was in sleep mode (SLPRQ = 1 and SLPAK = 1) before entering power down mode, the wake-up
option is enabled (WUPE = 1), and the wake-up interrupt is enabled (WUPIE = 1).
14.5 Initialization/Application Information
14.5.1 MSCAN initialization
The procedure to initially start up the MSCAN module out of reset is as follows:
1. Assert CANE
2. Write to the configuration registers in initialization mode
3. Clear INITRQ to leave initialization mode and enter normal mode
If the configuration of registers which are writable in initialization mode needs to be changed only when
the MSCAN module is in normal mode:
1. Bring the module into sleep mode by setting SLPRQ and awaiting SLPAK to assert after the CAN
bus becomes idle.
2. Enter initialization mode: assert INITRQ and await INITAK
3. Write to the configuration registers in initialization mode
4. Clear INITRQ to leave initialization mode and continue in normal mode
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
671
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Chapter 14 Freescale’s Scalable Controller Area Network (S12MSCANV3)
14.5.2 Bus-Off Recovery
The bus-off recovery is user configurable. The bus-off state can either be left automatically or on user
request.
For reasons of backwards compatibility, the MSCAN defaults to automatic recovery after reset. In this
case, the MSCAN will become error active again after counting 128 occurrences of 11 consecutive
recessive bits on the CAN bus (See the Bosch CAN specification for details).
If the MSCAN is configured for user request (BORM set in Section 14.3.2.2, “MSCAN Control Register
1 (CANCTL1)”), the recovery from bus-off starts after both independent events have become true:
•
•
BOHOLD in Section 14.3.2.14, “MSCAN Miscellaneous Register (CANMISC) has been cleared
by the user
These two events may occur in any order.
MC9S12XDP512 Data Sheet, Rev. 2.11
672
Freescale Semiconductor
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Chapter 15
Serial Communication Interface (S12MC9S12XDP512V5)
15.1 Introduction
This block guide provides an overview of the serial communication interface (SCI) module.
The SCI allows asynchronous serial communications with peripheral devices and other CPUs.
15.1.1 Features
The SCI includes these distinctive features:
•
•
•
•
•
•
•
•
•
Full-duplex or single-wire operation
Standard mark/space non-return-to-zero (NRZ) format
Selectable IrDA 1.4 return-to-zero-inverted (RZI) format with programmable pulse widths
13-bit baud rate selection
Programmable 8-bit or 9-bit data format
Separately enabled transmitter and receiver
Programmable polarity for transmitter and receiver
Programmable transmitter output parity
Two receiver wakeup methods:
— Idle line wakeup
— Address mark wakeup
•
Interrupt-driven operation with eight flags:
— Transmitter empty
— Transmission complete
— Receiver full
— Idle receiver input
— Receiver overrun
— Noise error
— Framing error
— Parity error
— Receive wakeup on active edge
— Transmit collision detect supporting LIN
— Break Detect supporting LIN
Receiver framing error detection
•
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
673
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Chapter 15 Serial Communication Interface (S12MC9S12XDP512V5)
•
•
Hardware parity checking
1/16 bit-time noise detection
15.1.2 Modes of Operation
The SCI functions the same in normal, special, and emulation modes. It has two low power modes, wait
and stop modes.
•
•
•
Run mode
Wait mode
Stop mode
15.1.3 Block Diagram
Figure 15-1 is a high level block diagram of the SCI module, showing the interaction of various function
blocks.
SCI Data Register
RXD Data In
Infrared
Decoder
Receive Shift Register
IDLE
Receive
Interrupt
Generation
RDRF/OR
BRKD
Receive & Wakeup
Control
SCI
Interrupt
Request
RXEDG
Bus Clock
Baud Rate
Generator
BERR
Data Format Control
Transmit Control
Transmit
Interrupt
Generation
TDRE
TC
1/16
Infrared
Encoder
Data Out TXD
Transmit Shift Register
SCI Data Register
Figure 15-1. SCI Block Diagram
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 15 Serial Communication Interface (S12MC9S12XDP512V5)
15.2 External Signal Description
The SCI module has a total of two external pins.
15.2.1 TXD — Transmit Pin
The TXD pin transmits SCI (standard or infrared) data. It will idle high in either mode and is high
impedance anytime the transmitter is disabled.
15.2.2 RXD — Receive Pin
The RXD pin receives SCI (standard or infrared) data. An idle line is detected as a line high. This input is
ignored when the receiver is disabled and should be terminated to a known voltage.
15.3 Memory Map and Register Definition
This section provides a detailed description of all the SCI registers.
15.3.1 Module Memory Map and Register Definition
The memory map for the SCI module is given below in Table 1-1. The address listed for each register is
the address offset. The total address for each register is the sum of the base address for the SCI module and
the address offset for each register.
Table 15-1. MC9S12XDP512 Memory Map
Address
Offset
Name
Access
1
0x0000
0x0001
0x0002
0x000a
0x001a
0x002a
SCI Baud Rate Register High (SCIBDH)
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R
1
1
2
2
2
SCI Baud Rate Register Low (SCIBDL)
SCI Control Register1 (SCICR1)
SCI Alternative Status Register 1 (SCIASR1)
SCI Alternative Control Register 1 (SCIACR1)
SCI Alternative Control Register 2 (SCIACR2)
SCI Control Register 2 (SCICR2)
0x0003
0x0004
0x0005
0x0006
0x0007
SCI Status Register 1 (SCISR1)
SCI Status Register 2(SCISR2)
R/W
R/W
R/W
SCI Data Register High (SCIDRH)
SCI Data Register Low (SCIDRL)
1
2
Those registers are accessible if the AMAP bit in the SCISR2 register is set to zero
Those registers are accessible if the AMAP bit in the SCISR2 register is set to one
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
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Chapter 15 Serial Communication Interface (S12MC9S12XDP512V5)
15.3.2 Register Descriptions
This section consists of register descriptions in address order. Each description includes a standard register
diagram with an associated figure number. Writes to a reserved register locations do not have any effect
and reads of these locations return a zero. Details of register bit and field function follow the register
diagrams, in bit order.
Register
Name
Bit 7
6
5
4
3
2
1
Bit 0
0x0000
SCIBDH
R
1
IREN
TNP1
TNP0
SBR12
SBR11
SBR10
SBR9
SBR8
W
0x0001
SCIBDL
R
1
SBR7
LOOPS
SBR6
SBR5
SBR4
SBR3
SBR2
ILT
SBR1
PE
SBR0
PT
W
0x0002
R
1
SCISWAI
0
RSRC
0
M
0
WAKE
0
SCICR1
W
0x000a
SCIASR1
R
2
2
2
RXEDGIF
BERRV
0
BERRIF
BERRIE
BERRM0
BKDIF
BKDIE
BKDFE
W
0x001a
SCIACR1
R
0
0
0
0
0
0
0
0
RXEDGIE
0
W
0x002a
SCIACR2
R
BERRM1
W
0x0003
SCICR2
R
TIE
TCIE
TC
RIE
ILIE
TE
RE
NF
RWU
FE
SBK
PF
W
0x0004
R
TDRE
RDRF
IDLE
OR
SCISR1
W
0x0005
SCISR2
R
0
0
0
RAF
0
AMAP
R8
TXPOL
0
RXPOL
0
BRK13
0
TXDIR
0
W
0x0006
SCIDRH
R
T8
W
0x0007
SCIDRL
R
R7
T7
R6
T6
R5
T5
R4
T4
R3
T3
R2
T2
R1
T1
R0
T0
W
1.These registers are accessible if the AMAP bit in the SCISR2 register is set to zero.
2,These registers are accessible if the AMAP bit in the SCISR2 register is set to one.
= Unimplemented or Reserved
Figure 15-2. MC9S12XDP512 Register Summary
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 15 Serial Communication Interface (S12MC9S12XDP512V5)
15.3.2.1 SCI Baud Rate Registers (SCIBDH, SCIBDL)
Module Base + 0x0000
7
6
5
4
3
2
1
0
R
IREN
W
TNP1
TNP0
SBR12
SBR11
SBR10
SBR9
SBR8
Reset
0
0
0
0
0
0
0
0
Figure 15-3. SCI Baud Rate Register (SCIBDH)
Module Base + 0x0001
7
6
5
4
3
2
1
0
R
SBR7
W
SBR6
SBR5
SBR4
SBR3
SBR2
SBR1
SBR0
Reset
0
0
0
0
0
0
0
0
Figure 15-4. SCI Baud Rate Register (SCIBDL)
Read: Anytime, if AMAP = 0. If only SCIBDH is written to, a read will not return the correct data until
SCIBDL is written to as well, following a write to SCIBDH.
Write: Anytime, if AMAP = 0.
NOTE
Those two registers are only visible in the memory map if AMAP = 0 (reset
condition).
The SCI baud rate register is used by to determine the baud rate of the SCI, and to control the infrared
modulation/demodulation submodule.
Table 15-2. SCIBDH and SCIBDL Field Descriptions
Field
Description
7
Infrared Enable Bit — This bit enables/disables the infrared modulation/demodulation submodule.
IREN
0 IR disabled
6:5
Transmitter Narrow Pulse Bits — These bits enable whether the SCI transmits a 1/16, 3/16, 1/32 or 1/4 narrow
TNP[1:0]
pulse. See Table 15-3.
4:0
7:0
SCI Baud Rate Bits — The baud rate for the SCI is determined by the bits in this register. The baud rate is
calculated two different ways depending on the state of the IREN bit.
SBR[12:0] The formulas for calculating the baud rate are:
When IREN = 0 then,
SCI baud rate = SCI bus clock / (16 x SBR[12:0])
When IREN = 1 then,
SCI baud rate = SCI bus clock / (32 x SBR[12:1])
Note: The baud rate generator is disabled after reset and not started until the TE bit or the RE bit is set for the
first time. The baud rate generator is disabled when (SBR[12:0] = 0 and IREN = 0) or (SBR[12:1] = 0 and
IREN = 1).
Note: Writing to SCIBDH has no effect without writing to SCIBDL, because writing to SCIBDH puts the data in
a temporary location until SCIBDL is written to.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
677
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Chapter 15 Serial Communication Interface (S12MC9S12XDP512V5)
Table 15-3. IRSCI Transmit Pulse Width
TNP[1:0]
Narrow Pulse Width
11
10
01
00
1/4
1/32
1/16
3/16
15.3.2.2 SCI Control Register 1 (SCICR1)
Module Base + 0x0002
7
6
5
4
3
2
1
0
R
W
LOOPS
SCISWAI
RSRC
M
WAKE
ILT
PE
PT
Reset
0
0
0
0
0
0
0
0
Figure 15-5. SCI Control Register 1 (SCICR1)
Read: Anytime, if AMAP = 0.
Write: Anytime, if AMAP = 0.
NOTE
This register is only visible in the memory map if AMAP = 0 (reset
condition).
Table 15-4. SCICR1 Field Descriptions
Description
Field
7
Loop Select Bit — LOOPS enables loop operation. In loop operation, the RXD pin is disconnected from the SCI
and the transmitter output is internally connected to the receiver input. Both the transmitter and the receiver must
be enabled to use the loop function.
LOOPS
0 Normal operation enabled
1 Loop operation enabled
The receiver input is determined by the RSRC bit.
6
SCI Stop in Wait Mode Bit — SCISWAI disables the SCI in wait mode.
SCISWAI 0 SCI enabled in wait mode
1 SCI disabled in wait mode
5
Receiver Source Bit — When LOOPS = 1, the RSRC bit determines the source for the receiver shift register
RSRC
input. See Table 15-5.
0 Receiver input internally connected to transmitter output
1 Receiver input connected externally to transmitter
4
M
Data Format Mode Bit — MODE determines whether data characters are eight or nine bits long.
0 One start bit, eight data bits, one stop bit
1 One start bit, nine data bits, one stop bit
3
Wakeup Condition Bit — WAKE determines which condition wakes up the SCI: a logic 1 (address mark) in the
WAKE
most significant bit position of a received data character or an idle condition on the RXD pin.
0 Idle line wakeup
1 Address mark wakeup
MC9S12XDP512 Data Sheet, Rev. 2.11
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Freescale Semiconductor
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Chapter 15 Serial Communication Interface (S12MC9S12XDP512V5)
Table 15-4. SCICR1 Field Descriptions (continued)
Field
Description
2
ILT
Idle Line Type Bit — ILT determines when the receiver starts counting logic 1s as idle character bits. The
counting begins either after the start bit or after the stop bit. If the count begins after the start bit, then a string of
logic 1s preceding the stop bit may cause false recognition of an idle character. Beginning the count after the
stop bit avoids false idle character recognition, but requires properly synchronized transmissions.
0 Idle character bit count begins after start bit
1 Idle character bit count begins after stop bit
1
Parity Enable Bit — PE enables the parity function. When enabled, the parity function inserts a parity bit in the
PE
most significant bit position.
0 Parity function disabled
1 Parity function enabled
0
Parity Type Bit — PT determines whether the SCI generates and checks for even parity or odd parity. With even
PT
parity, an even number of 1s clears the parity bit and an odd number of 1s sets the parity bit. With odd parity, an
odd number of 1s clears the parity bit and an even number of 1s sets the parity bit.
1 Even parity
1 Odd parity
Table 15-5. Loop Functions
LOOPS
RSRC
Function
0
1
1
x
0
1
Normal operation
Loop mode with transmitter output internally connected to receiver input
Single-wire mode with TXD pin connected to receiver input
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 15 Serial Communication Interface (S12MC9S12XDP512V5)
15.3.2.3 SCI Alternative Status Register 1 (SCIASR1)
Module Base + 0x000a
7
6
5
4
3
2
1
0
R
W
0
0
0
0
BERRV
RXEDGIF
BERRIF
BKDIF
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 15-6. SCI Alternative Status Register 1 (SCIASR1)
Read: Anytime, if AMAP = 1
Write: Anytime, if AMAP = 1
Table 15-6. SCIASR1 Field Descriptions
Description
Field
7
Receive Input Active Edge Interrupt Flag — RXEDGIF is asserted, if an active edge (falling if RXPOL = 0,
RXEDGIF rising if RXPOL = 1) on the RXD input occurs. RXEDGIF bit is cleared by writing a “1” to it.
0 No active receive on the receive input has occurred
1 An active edge on the receive input has occurred
2
Bit Error Value — BERRV reflects the state of the RXD input when the bit error detect circuitry is enabled and
a mismatch to the expected value happened. The value is only meaningful, if BERRIF = 1.
0 A low input was sampled, when a high was expected
BERRV
1 A high input reassembled, when a low was expected
1
Bit Error Interrupt Flag — BERRIF is asserted, when the bit error detect circuitry is enabled and if the value
sampled at the RXD input does not match the transmitted value. If the BERRIE interrupt enable bit is set an
interrupt will be generated. The BERRIF bit is cleared by writing a “1” to it.
0 No mismatch detected
BERRIF
1 A mismatch has occurred
0
Break Detect Interrupt Flag — BKDIF is asserted, if the break detect circuitry is enabled and a break signal is
BKDIF
received. If the BKDIE interrupt enable bit is set an interrupt will be generated. The BKDIF bit is cleared by writing
a “1” to it.
0 No break signal was received
1 A break signal was received
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 15 Serial Communication Interface (S12MC9S12XDP512V5)
15.3.2.4 SCI Alternative Control Register 1 (SCIACR1)
Module Base + 0x001a
7
6
5
4
3
2
1
0
R
0
0
0
0
0
RXEDGIE
W
BERRIE
BKDIE
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 15-7. SCI Alternative Control Register 1 (SCIACR1)
Read: Anytime, if AMAP = 1
Write: Anytime, if AMAP = 1
Table 15-7. SCIACR1 Field Descriptions
Description
Field
7
Receive Input Active Edge Interrupt Enable — RXEDGIE enables the receive input active edge interrupt flag,
RSEDGIE RXEDGIF, to generate interrupt requests.
0 RXEDGIF interrupt requests disabled
1 RXEDGIF interrupt requests enabled
1
Bit Error Interrupt Enable — BERRIE enables the bit error interrupt flag, BERRIF, to generate interrupt
BERRIE
requests.
0 BERRIF interrupt requests disabled
1 BERRIF interrupt requests enabled
0
Break Detect Interrupt Enable — BKDIE enables the break detect interrupt flag, BKDIF, to generate interrupt
BKDIE
requests.
0 BKDIF interrupt requests disabled
1 BKDIF interrupt requests enabled
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
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Chapter 15 Serial Communication Interface (S12MC9S12XDP512V5)
15.3.2.5 SCI Alternative Control Register 2 (SCIACR2)
Module Base + 0x002a
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
BERRM1
BERRM0
BKDFE
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 15-8. SCI Alternative Control Register 2 (SCIACR2)
Read: Anytime, if AMAP = 1
Write: Anytime, if AMAP = 1
Table 15-8. SCIACR2 Field Descriptions
Description
Field
2:1
Bit Error Mode — Those two bits determines the functionality of the bit error detect feature. See Table 15-9.
BERRM[1:0]
0
Break Detect Feature Enable — BKDFE enables the break detect circuitry.
0 Break detect circuit disabled
BKDFE
1 Break detect circuit enabled
Table 15-9. Bit Error Mode Coding
BERRM1
BERRM0
Function
0
0
0
1
Bit error detect circuit is disabled
Receive input sampling occurs during the 9th time tick of a transmitted bit
(refer to Figure 15-19)
1
1
0
1
Receive input sampling occurs during the 13th time tick of a transmitted bit
(refer to Figure 15-19)
Reserved
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 15 Serial Communication Interface (S12MC9S12XDP512V5)
15.3.2.6 SCI Control Register 2 (SCICR2)
Module Base + 0x0003
7
6
5
4
3
2
1
0
R
TIE
W
TCIE
RIE
ILIE
TE
RE
RWU
SBK
Reset
0
0
0
0
0
0
0
0
Figure 15-9. SCI Control Register 2 (SCICR2)
Read: Anytime
Write: Anytime
Table 15-10. SCICR2 Field Descriptions
Description
Field
7
Transmitter Interrupt Enable Bit — TIE enables the transmit data register empty flag, TDRE, to generate
TIE
interrupt requests.
0 TDRE interrupt requests disabled
1 TDRE interrupt requests enabled
6
Transmission Complete Interrupt Enable Bit — TCIE enables the transmission complete flag, TC, to generate
TCIE
interrupt requests.
0 TC interrupt requests disabled
1 TC interrupt requests enabled
5
RIE
Receiver Full Interrupt Enable Bit — RIE enables the receive data register full flag, RDRF, or the overrun flag,
OR, to generate interrupt requests.
0 RDRF and OR interrupt requests disabled
1 RDRF and OR interrupt requests enabled
4
ILIE
Idle Line Interrupt Enable Bit — ILIE enables the idle line flag, IDLE, to generate interrupt requests.
0 IDLE interrupt requests disabled
1 IDLE interrupt requests enabled
3
Transmitter Enable Bit — TE enables the SCI transmitter and configures the TXD pin as being controlled by
TE
the SCI. The TE bit can be used to queue an idle preamble.
0 Transmitter disabled
1 Transmitter enabled
2
RE
Receiver Enable Bit — RE enables the SCI receiver.
0 Receiver disabled
1 Receiver enabled
1
Receiver Wakeup Bit — Standby state
RWU
0 Normal operation.
1 RWU enables the wakeup function and inhibits further receiver interrupt requests. Normally, hardware wakes
the receiver by automatically clearing RWU.
0
Send Break Bit — Toggling SBK sends one break character (10 or 11 logic 0s, respectively 13 or 14 logics 0s
SBK
if BRK13 is set). Toggling implies clearing the SBK bit before the break character has finished transmitting. As
long as SBK is set, the transmitter continues to send complete break characters (10 or 11 bits, respectively 13
or 14 bits).
0 No break characters
1 Transmit break characters
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
683
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Chapter 15 Serial Communication Interface (S12MC9S12XDP512V5)
15.3.2.7 SCI Status Register 1 (SCISR1)
The SCISR1 and SCISR2 registers provides inputs to the MCU for generation of SCI interrupts. Also,
these registers can be polled by the MCU to check the status of these bits. The flag-clearing procedures
require that the status register be read followed by a read or write to the SCI data register.It is permissible
to execute other instructions between the two steps as long as it does not compromise the handling of I/O,
but the order of operations is important for flag clearing.
Module Base + 0x0004
7
6
5
4
3
2
1
0
R
W
TDRE
TC
RDRF
IDLE
OR
NF
FE
PF
Reset
1
1
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 15-10. SCI Status Register 1 (SCISR1)
Read: Anytime
Write: Has no meaning or effect
Table 15-11. SCISR1 Field Descriptions
Description
Field
7
Transmit Data Register Empty Flag — TDRE is set when the transmit shift register receives a byte from the
SCI data register. When TDRE is 1, the transmit data register (SCIDRH/L) is empty and can receive a new value
to transmit.Clear TDRE by reading SCI status register 1 (SCISR1), with TDRE set and then writing to SCI data
register low (SCIDRL).
TDRE
0 No byte transferred to transmit shift register
1 Byte transferred to transmit shift register; transmit data register empty
6
TC
Transmit Complete Flag — TC is set low when there is a transmission in progress or when a preamble or break
character is loaded. TC is set high when the TDRE flag is set and no data, preamble, or break character is being
transmitted.When TC is set, the TXD pin becomes idle (logic 1). Clear TC by reading SCI status register 1
(SCISR1) with TC set and then writing to SCI data register low (SCIDRL). TC is cleared automatically when data,
preamble, or break is queued and ready to be sent. TC is cleared in the event of a simultaneous set and clear of
the TC flag (transmission not complete).
0 Transmission in progress
1 No transmission in progress
5
Receive Data Register Full Flag — RDRF is set when the data in the receive shift register transfers to the SCI
data register. Clear RDRF by reading SCI status register 1 (SCISR1) with RDRF set and then reading SCI data
register low (SCIDRL).
RDRF
0 Data not available in SCI data register
1 Received data available in SCI data register
4
IDLE
Idle Line Flag — IDLE is set when 10 consecutive logic 1s (if M = 0) or 11 consecutive logic 1s (if M =1) appear
on the receiver input. Once the IDLE flag is cleared, a valid frame must again set the RDRF flag before an idle
condition can set the IDLE flag.Clear IDLE by reading SCI status register 1 (SCISR1) with IDLE set and then
reading SCI data register low (SCIDRL).
0 Receiver input is either active now or has never become active since the IDLE flag was last cleared
1 Receiver input has become idle
Note: When the receiver wakeup bit (RWU) is set, an idle line condition does not set the IDLE flag.
MC9S12XDP512 Data Sheet, Rev. 2.11
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Freescale Semiconductor
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Chapter 15 Serial Communication Interface (S12MC9S12XDP512V5)
Table 15-11. SCISR1 Field Descriptions (continued)
Field
Description
3
Overrun Flag — OR is set when software fails to read the SCI data register before the receive shift register
OR
receives the next frame. The OR bit is set immediately after the stop bit has been completely received for the
second frame. The data in the shift register is lost, but the data already in the SCI data registers is not affected.
Clear OR by reading SCI status register 1 (SCISR1) with OR set and then reading SCI data register low
(SCIDRL).
0 No overrun
1 Overrun
Note: OR flag may read back as set when RDRF flag is clear. This may happen if the following sequence of
events occurs:
1. After the first frame is received, read status register SCISR1 (returns RDRF set and OR flag clear);
2. Receive second frame without reading the first frame in the data register (the second frame is not
received and OR flag is set);
3. Read data register SCIDRL (returns first frame and clears RDRF flag in the status register);
4. Read status register SCISR1 (returns RDRF clear and OR set).
Event 3 may be at exactly the same time as event 2 or any time after. When this happens, a dummy
SCIDRL read following event 4 will be required to clear the OR flag if further frames are to be received.
2
Noise Flag — NF is set when the SCI detects noise on the receiver input. NF bit is set during the same cycle as
NF
the RDRF flag but does not get set in the case of an overrun. Clear NF by reading SCI status register 1(SCISR1),
and then reading SCI data register low (SCIDRL).
0 No noise
1 Noise
1
Framing Error Flag — FE is set when a logic 0 is accepted as the stop bit. FE bit is set during the same cycle
FE
as the RDRF flag but does not get set in the case of an overrun. FE inhibits further data reception until it is
cleared. Clear FE by reading SCI status register 1 (SCISR1) with FE set and then reading the SCI data register
low (SCIDRL).
0 No framing error
1 Framing error
0
Parity Error Flag — PF is set when the parity enable bit (PE) is set and the parity of the received data does not
PF
match the parity type bit (PT). PF bit is set during the same cycle as the RDRF flag but does not get set in the
case of an overrun. Clear PF by reading SCI status register 1 (SCISR1), and then reading SCI data register low
(SCIDRL).
0 No parity error
1 Parity error
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
685
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Chapter 15 Serial Communication Interface (S12MC9S12XDP512V5)
15.3.2.8 SCI Status Register 2 (SCISR2)
Module Base + 0x0005
7
6
5
4
3
2
1
0
R
W
0
0
RAF
AMAP
TXPOL
RXPOL
BRK13
TXDIR
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 15-11. SCI Status Register 2 (SCISR2)
Read: Anytime
Write: Anytime
Table 15-12. SCISR2 Field Descriptions
Description
Field
7
Alternative Map — This bit controls which registers sharing the same address space are accessible. In the reset
condition the SCI behaves as previous versions. Setting AMAP=1 allows the access to another set of control and
status registers and hides the baud rate and SCI control Register 1.
AMAP
0 The registers labelled SCIBDH (0x000),SCIBDL (0x001), SCICR1 (0x0002) are accessible
1 The registers labelled SCIASR1 (0x000a),SCIACR1 (0x001a), SCIACR2 (0x0002a) are accessible
4
Transmit Polarity — This bit control the polarity of the transmitted data. In NRZ format, a one is represented by
a mark and a zero is represented by a space for normal polarity, and the opposite for inverted polarity. In IrDA
format, a zero is represented by short high pulse in the middle of a bit time remaining idle low for a one for normal
polarity, and a zero is represented by short low pulse in the middle of a bit time remaining idle high for a one for
inverted polarity.
TXPOL
0 Normal polarity
1 Inverted polarity
3
Receive Polarity — This bit control the polarity of the received data. In NRZ format, a one is represented by a
mark and a zero is represented by a space for normal polarity, and the opposite for inverted polarity. In IrDA
format, a zero is represented by short high pulse in the middle of a bit time remaining idle low for a one for normal
polarity, and a zero is represented by short low pulse in the middle of a bit time remaining idle high for a one for
inverted polarity.
RXPOL
0 Normal polarity
1 Inverted polarity
2
Break Transmit Character Length — This bit determines whether the transmit break character is 10 or 11 bit
respectively 13 or 14 bits long. The detection of a framing error is not affected by this bit.
0 Break character is 10 or 11 bit long
BRK13
1 Break character is 13 or 14 bit long
1
Transmitter Pin Data Direction in Single-Wire Mode — This bit determines whether the TXD pin is going to
be used as an input or output, in the single-wire mode of operation. This bit is only relevant in the single-wire
mode of operation.
TXDIR
0 TXD pin to be used as an input in single-wire mode
1 TXD pin to be used as an output in single-wire mode
0
RAF
Receiver Active Flag — RAF is set when the receiver detects a logic 0 during the RT1 time period of the start
bit search. RAF is cleared when the receiver detects an idle character.
0 No reception in progress
1 Reception in progress
MC9S12XDP512 Data Sheet, Rev. 2.11
686
Freescale Semiconductor
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Chapter 15 Serial Communication Interface (S12MC9S12XDP512V5)
15.3.2.9 SCI Data Registers (SCIDRH, SCIDRL)
Module Base + 0x0006
7
6
5
4
3
2
1
0
R
W
R8
0
0
0
0
0
0
0
T8
Reset
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 15-12. SCI Data Registers (SCIDRH)
Module Base + 0x0007
7
6
5
4
3
2
1
0
R
W
R7
T7
0
R6
R5
R4
R3
R2
R1
R0
T6
0
T5
0
T4
0
T3
0
T2
0
T1
0
T0
0
Reset
Figure 15-13. SCI Data Registers (SCIDRL)
Read: Anytime; reading accesses SCI receive data register
Write: Anytime; writing accesses SCI transmit data register; writing to R8 has no effect
Table 15-13. SCIDRH and SCIDRL Field Descriptions
Field
Description
SCIDRH
Received Bit 8 — R8 is the ninth data bit received when the SCI is configured for 9-bit data format (M = 1).
Transmit Bit 8 — T8 is the ninth data bit transmitted when the SCI is configured for 9-bit data format (M = 1).
7
R8
SCIDRH
6
T8
SCIDRL
7:0
R7:R0 — Received bits seven through zero for 9-bit or 8-bit data formats
T7:T0 — Transmit bits seven through zero for 9-bit or 8-bit formats
R[7:0]
T[7:0]
NOTE
If the value of T8 is the same as in the previous transmission, T8 does not
have to be rewritten.The same value is transmitted until T8 is rewritten
In 8-bit data format, only SCI data register low (SCIDRL) needs to be
accessed.
When transmitting in 9-bit data format and using 8-bit write instructions,
write first to SCI data register high (SCIDRH), then SCIDRL.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
687
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Chapter 15 Serial Communication Interface (S12MC9S12XDP512V5)
15.4 Functional Description
This section provides a complete functional description of the SCI block, detailing the operation of the
design from the end user perspective in a number of subsections.
Figure 15-14 shows the structure of the SCI module. The SCI allows full duplex, asynchronous, serial
communication between the CPU and remote devices, including other CPUs. The SCI transmitter and
receiver operate independently, although they use the same baud rate generator. The CPU monitors the
status of the SCI, writes the data to be transmitted, and processes received data.
R8
IREN
SCI Data
Register
NF
FE
Infrared
Receive
Decoder
Ir_RXD
RXD
SCRXD
Receive
Shift Register
PF
RAF
IDLE
RDRF
OR
IDLE
ILIE
RE
RWU
Receive
and Wakeup
Control
LOOPS
RSRC
RIE
TIE
M
WAKE
ILT
Bus
Clock
Baud Rate
Generator
Data Format
Control
TDRE
TC
TDRE
TC
PE
SCI
Interrupt
Request
SBR12:SBR0
PT
TCIE
TE
Transmit
Control
RXEDGIE
÷16
LOOPS
SBK
Active Edge
Detect
RXEDGIF
BKDIF
RSRC
Transmit
Shift Register
T8
Break Detect
RXD
BKDIE
SCI Data
Register
BKDFE
LIN Transmit
Collision
Detect
BERRIF
BERRIE
SCTXD
R16XCLK
R32XCLK
BERRM[1:0]
Infrared
Transmit
Encoder
Ir_TXD
TXD
TNP[1:0]
IREN
Figure 15-14. Detailed SCI Block Diagram
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 15 Serial Communication Interface (S12MC9S12XDP512V5)
15.4.1 Infrared Interface Submodule
This module provides the capability of transmitting narrow pulses to an IR LED and receiving narrow
pulses and transforming them to serial bits, which are sent to the SCI. The IrDA physical layer
specification defines a half-duplex infrared communication link for exchange data. The full standard
includes data rates up to 16 Mbits/s. This design covers only data rates between 2.4 Kbits/s and 115.2
Kbits/s.
The infrared submodule consists of two major blocks: the transmit encoder and the receive decoder. The
SCI transmits serial bits of data which are encoded by the infrared submodule to transmit a narrow pulse
for every zero bit. No pulse is transmitted for every one bit. When receiving data, the IR pulses should be
detected using an IR photo diode and transformed to CMOS levels by the IR receive decoder (external
from the MCU). The narrow pulses are then stretched by the infrared submodule to get back to a serial bit
stream to be received by the SCI.The polarity of transmitted pulses and expected receive pulses can be
inverted so that a direct connection can be made to external IrDA transceiver modules that uses active low
pulses.
The infrared submodule receives its clock sources from the SCI. One of these two clocks are selected in
the infrared submodule in order to generate either 3/16, 1/16, 1/32 or 1/4 narrow pulses during
transmission. The infrared block receives two clock sources from the SCI, R16XCLK and R32XCLK,
which are configured to generate the narrow pulse width during transmission. The R16XCLK and
R32XCLK are internal clocks with frequencies 16 and 32 times the baud rate respectively. Both
R16XCLK and R32XCLK clocks are used for transmitting data. The receive decoder uses only the
R16XCLK clock.
15.4.1.1 Infrared Transmit Encoder
The infrared transmit encoder converts serial bits of data from transmit shift register to the TXD pin. A
narrow pulse is transmitted for a zero bit and no pulse for a one bit. The narrow pulse is sent in the middle
of the bit with a duration of 1/32, 1/16, 3/16 or 1/4 of a bit time. A narrow high pulse is transmitted for a
zero bit when TXPOL is cleared, while a narrow low pulse is transmitted for a zero bit when TXPOL is set.
15.4.1.2 Infrared Receive Decoder
The infrared receive block converts data from the RXD pin to the receive shift register. A narrow pulse is
expected for each zero received and no pulse is expected for each one received. A narrow high pulse is
expected for a zero bit when RXPOL is cleared, while a narrow low pulse is expected for a zero bit when
RXPOL is set. This receive decoder meets the edge jitter requirement as defined by the IrDA serial infrared
physical layer specification.
15.4.2 LIN Support
This module provides some basic support for the LIN protocol. At first this is a break detect circuitry
making it easier for the LIN software to distinguish a break character from an incoming data stream. As a
further addition is supports a collision detection at the bit level as well as cancelling pending transmissions.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
689
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Chapter 15 Serial Communication Interface (S12MC9S12XDP512V5)
15.4.3 Data Format
The SCI uses the standard NRZ mark/space data format. When Infrared is enabled, the SCI uses RZI data
format where zeroes are represented by light pulses and ones remain low. See Figure 15-15 below.
8-Bit Data Format
(Bit M in SCICR1 Clear)
Possible
Parity
Next
Start
Bit
Bit
Start
Bit
Standard
SCI Data
STOP
Bit
Bit 0
Bit 1
Bit 2
Bit 3
Bit 4
Bit 5
Bit 6
Bit 7
Infrared
SCI Data
9-Bit Data Format
(Bit M in SCICR1 Set)
POSSIBLE
PARITY
Bit
NEXT
START
Bit
Start
Bit
Standard
SCI Data
Bit 0
Bit 1
Bit 2
Bit 3
Bit 4
Bit 5
Bit 6
Bit 7
Bit 8
STOP
Bit
Infrared
SCI Data
Figure 15-15. SCI Data Formats
Each data character is contained in a frame that includes a start bit, eight or nine data bits, and a stop bit.
Clearing the M bit in SCI control register 1 configures the SCI for 8-bit data characters. A frame with eight
data bits has a total of 10 bits. Setting the M bit configures the SCI for nine-bit data characters. A frame
with nine data bits has a total of 11 bits.
Table 15-14. Example of 8-Bit Data Formats
Start
Bit
Data
Bits
Address
Bits
Parity
Bits
Stop
Bit
1
1
1
8
7
7
0
0
0
1
1
1
1
1
The address bit identifies the frame as an address
character. See Section 15.4.6.6, “Receiver Wakeup”.
When the SCI is configured for 9-bit data characters, the ninth data bit is the T8 bit in SCI data register
high (SCIDRH). It remains unchanged after transmission and can be used repeatedly without rewriting it.
A frame with nine data bits has a total of 11 bits.
Table 15-15. Example of 9-Bit Data Formats
Start
Bit
Data
Bits
Address
Bits
Parity
Bits
Stop
Bit
1
1
1
9
8
8
0
0
0
1
1
1
1
1
The address bit identifies the frame as an address
character. See Section 15.4.6.6, “Receiver Wakeup”.
MC9S12XDP512 Data Sheet, Rev. 2.11
690
Freescale Semiconductor
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Chapter 15 Serial Communication Interface (S12MC9S12XDP512V5)
15.4.4 Baud Rate Generation
A 13-bit modulus counter in the baud rate generator derives the baud rate for both the receiver and the
transmitter. The value from 0 to 8191 written to the SBR12:SBR0 bits determines the bus clock divisor.
The SBR bits are in the SCI baud rate registers (SCIBDH and SCIBDL). The baud rate clock is
synchronized with the bus clock and drives the receiver. The baud rate clock divided by 16 drives the
transmitter. The receiver has an acquisition rate of 16 samples per bit time.
Baud rate generation is subject to one source of error:
•
Integer division of the bus clock may not give the exact target frequency.
Table 15-16 lists some examples of achieving target baud rates with a bus clock frequency of 25 MHz.
When IREN = 0 then,
SCI baud rate = SCI bus clock / (16 * SCIBR[12:0])
Table 15-16. Baud Rates (Example: Bus Clock = 25 MHz)
Bits
SBR[12:0]
Receiver
Clock (Hz)
Transmitter
Clock (Hz)
Target
Baud Rate
Error
(%)
41
81
609,756.1
308,642.0
153,374.2
76,687.1
38,402.5
19,201.2
9600.6
38,109.8
19,290.1
9585.9
4792.9
2400.2
1200.1
600.0
38,400
19,200
9,600
4,800
2,400
1,200
600
.76
.47
.16
.15
.01
.01
.00
.00
.00
.00
163
326
651
1302
2604
5208
10417
14204
4800.0
300.0
300
2400.0
150.0
150
1760.1
110.0
110
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
691
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Chapter 15 Serial Communication Interface (S12MC9S12XDP512V5)
15.4.5 Transmitter
Internal Bus
Bus
Clock
÷ 16
Baud Divider
SCI Data Registers
SBR12:SBR0
TXPOL
11-Bit Transmit Register
SCTXD
H
8
7
6
5
4
3
2
1
0
L
M
LOOP
CONTROL
To Receiver
T8
PE
PT
Parity
Generation
LOOPS
RSRC
TIE
TDRE IRQ
TC IRQ
TDRE
Transmitter Control
TC
TCIE
TE
SBK
BERRM[1:0]
SCTXD
SCRXD
BERRIF
TCIE
Transmit
Collision Detect
BER IRQ
(From Receiver)
Figure 15-16. Transmitter Block Diagram
15.4.5.1 Transmitter Character Length
The SCI transmitter can accommodate either 8-bit or 9-bit data characters. The state of the M bit in SCI
control register 1 (SCICR1) determines the length of data characters. When transmitting 9-bit data, bit T8
in SCI data register high (SCIDRH) is the ninth bit (bit 8).
15.4.5.2 Character Transmission
To transmit data, the MCU writes the data bits to the SCI data registers (SCIDRH/SCIDRL), which in turn
are transferred to the transmitter shift register. The transmit shift register then shifts a frame out through
the TXD pin, after it has prefaced them with a start bit and appended them with a stop bit. The SCI data
registers (SCIDRH and SCIDRL) are the write-only buffers between the internal data bus and the transmit
shift register.
MC9S12XDP512 Data Sheet, Rev. 2.11
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Freescale Semiconductor
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Chapter 15 Serial Communication Interface (S12MC9S12XDP512V5)
The SCI also sets a flag, the transmit data register empty flag (TDRE), every time it transfers data from the
buffer (SCIDRH/L) to the transmitter shift register.The transmit driver routine may respond to this flag by
writing another byte to the Transmitter buffer (SCIDRH/SCIDRL), while the shift register is still shifting
out the first byte.
To initiate an SCI transmission:
1. Configure the SCI:
a) Select a baud rate. Write this value to the SCI baud registers (SCIBDH/L) to begin the baud
rate generator. Remember that the baud rate generator is disabled when the baud rate is zero.
Writing to the SCIBDH has no effect without also writing to SCIBDL.
b) Write to SCICR1 to configure word length, parity, and other configuration bits
(LOOPS,RSRC,M,WAKE,ILT,PE,PT).
c) Enable the transmitter, interrupts, receive, and wake up as required, by writing to the SCICR2
register bits (TIE,TCIE,RIE,ILIE,TE,RE,RWU,SBK). A preamble or idle character will now
be shifted out of the transmitter shift register.
2. Transmit Procedure for each byte:
a) Poll the TDRE flag by reading the SCISR1 or responding to the TDRE interrupt. Keep in mind
that the TDRE bit resets to one.
b) If the TDRE flag is set, write the data to be transmitted to SCIDRH/L, where the ninth bit is
written to the T8 bit in SCIDRH if the SCI is in 9-bit data format. A new transmission will not
result until the TDRE flag has been cleared.
3. Repeat step 2 for each subsequent transmission.
NOTE
The TDRE flag is set when the shift register is loaded with the next data to
be transmitted from SCIDRH/L, which happens, generally speaking, a little
over half-way through the stop bit of the previous frame. Specifically, this
transfer occurs 9/16ths of a bit time AFTER the start of the stop bit of the
previous frame.
Writing the TE bit from 0 to a 1 automatically loads the transmit shift register with a preamble of 10 logic
1s (if M = 0) or 11 logic 1s (if M = 1). After the preamble shifts out, control logic transfers the data from
the SCI data register into the transmit shift register. A logic 0 start bit automatically goes into the least
significant bit position of the transmit shift register. A logic 1 stop bit goes into the most significant bit
position.
Hardware supports odd or even parity. When parity is enabled, the most significant bit (MSB) of the data
character is the parity bit.
The transmit data register empty flag, TDRE, in SCI status register 1 (SCISR1) becomes set when the SCI
data register transfers a byte to the transmit shift register. The TDRE flag indicates that the SCI data
register can accept new data from the internal data bus. If the transmit interrupt enable bit, TIE, in SCI
control register 2 (SCICR2) is also set, the TDRE flag generates a transmitter interrupt request.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
693
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Chapter 15 Serial Communication Interface (S12MC9S12XDP512V5)
When the transmit shift register is not transmitting a frame, the TXD pin goes to the idle condition, logic
1. If at any time software clears the TE bit in SCI control register 2 (SCICR2), the transmitter enable signal
goes low and the transmit signal goes idle.
If software clears TE while a transmission is in progress (TC = 0), the frame in the transmit shift register
continues to shift out. To avoid accidentally cutting off the last frame in a message, always wait for TDRE
to go high after the last frame before clearing TE.
To separate messages with preambles with minimum idle line time, use this sequence between messages:
1. Write the last byte of the first message to SCIDRH/L.
2. Wait for the TDRE flag to go high, indicating the transfer of the last frame to the transmit shift
register.
3. Queue a preamble by clearing and then setting the TE bit.
4. Write the first byte of the second message to SCIDRH/L.
15.4.5.3 Break Characters
Writing a logic 1 to the send break bit, SBK, in SCI control register 2 (SCICR2) loads the transmit shift
register with a break character. A break character contains all logic 0s and has no start, stop, or parity bit.
Break character length depends on the M bit in SCI control register 1 (SCICR1). As long as SBK is at logic
1, transmitter logic continuously loads break characters into the transmit shift register. After software
clears the SBK bit, the shift register finishes transmitting the last break character and then transmits at least
one logic 1. The automatic logic 1 at the end of a break character guarantees the recognition of the start bit
of the next frame.
The SCI recognizes a break character when there are 10 or 11(M = 0 or M = 1) consecutive zero received.
Depending if the break detect feature is enabled or not receiving a break character has these effects on SCI
registers.
If the break detect feature is disabled (BKDFE = 0):
•
•
•
•
Sets the framing error flag, FE
Sets the receive data register full flag, RDRF
Clears the SCI data registers (SCIDRH/L)
May set the overrun flag, OR, noise flag, NF, parity error flag, PE, or the receiver active flag, RAF
(see 3.4.4 and 3.4.5 SCI Status Register 1 and 2)
1
If the break detect feature is enabled (BKDFE = 1) there are two scenarios
The break is detected right from a start bit or is detected during a byte reception.
•
•
•
•
•
Sets the break detect interrupt flag, BLDIF
Does not change the data register full flag, RDRF or overrun flag OR
Does not change the framing error flag FE, parity error flag PE.
Does not clear the SCI data registers (SCIDRH/L)
May set noise flag NF, or receiver active flag RAF.
1. A Break character in this context are either 10 or 11 consecutive zero received bits
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Figure 15-17 shows two cases of break detect. In trace RXD_1 the break symbol starts with the start bit,
while in RXD_2 the break starts in the middle of a transmission. If BRKDFE = 1, in RXD_1 case there
will be no byte transferred to the receive buffer and the RDRF flag will not be modified. Also no framing
error or parity error will be flagged from this transfer. In RXD_2 case, however the break signal starts later
during the transmission. At the expected stop bit position the byte received so far will be transferred to the
receive buffer, the receive data register full flag will be set, a framing error and if enabled and appropriate
a parity error will be set. Once the break is detected the BRKDIF flag will be set.
Start Bit Position
Stop Bit Position
BRKDIF = 1
RXD_1
. . .
10
Zero Bit Counter
1
2
3
4
5
6
7
8
9
FE = 1
BRKDIF = 1
RXD_2
. . .
1
2
3
4
5
6
7
8
9
10
Zero Bit Counter
Figure 15-17. Break Detection if BRKDFE = 1 (M = 0)
15.4.5.4 Idle Characters
An idle character (or preamble) contains all logic 1s and has no start, stop, or parity bit. Idle character
length depends on the M bit in SCI control register 1 (SCICR1). The preamble is a synchronizing idle
character that begins the first transmission initiated after writing the TE bit from 0 to 1.
If the TE bit is cleared during a transmission, the TXD pin becomes idle after completion of the
transmission in progress. Clearing and then setting the TE bit during a transmission queues an idle
character to be sent after the frame currently being transmitted.
NOTE
When queueing an idle character, return the TE bit to logic 1 before the stop
bit of the current frame shifts out through the TXD pin. Setting TE after the
stop bit appears on TXD causes data previously written to the SCI data
register to be lost. Toggle the TE bit for a queued idle character while the
TDRE flag is set and immediately before writing the next byte to the SCI
data register.
If the TE bit is clear and the transmission is complete, the SCI is not the
master of the TXD pin
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15.4.5.5 LIN Transmit Collision Detection
This module allows to check for collisions on the LIN bus.
LIN Physical Interface
Synchronizer Stage
Receive Shift
Register
Compare
RXD Pin
Bit Error
LIN Bus
Bus Clock
Sample
Point
Transmit Shift
Register
TXD Pin
Figure 15-18. Collision Detect Principle
If the bit error circuit is enabled (BERRM[1:0] = 0:1 or = 1:0]), the error detect circuit will compare the
transmitted and the received data stream at a point in time and flag any mismatch. The timing checks run
when transmitter is active (not idle). As soon as a mismatch between the transmitted data and the received
data is detected the following happens:
•
•
•
•
•
The next bit transmitted will have a high level (TXPOL = 0) or low level (TXPOL = 1)
The transmission is aborted and the byte in transmit buffer is discarded.
the transmit data register empty and the transmission complete flag will be set
The bit error interrupt flag, BERRIF, will be set.
No further transmissions will take place until the BERRIF is cleared.
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15
0
Output Transmit
Shift Register
Input Receive
Shift Register
BERRM[1:0] = 0:1
BERRM[1:0] = 1:1
Compare Sample Points
Figure 15-19. Timing Diagram Bit Error Detection
If the bit error detect feature is disabled, the bit error interrupt flag is cleared.
NOTE
The RXPOL and TXPOL bit should be set the same when transmission
collision detect feature is enabled, otherwise the bit error interrupt flag may
be set incorrectly.
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Chapter 15 Serial Communication Interface (S12MC9S12XDP512V5)
15.4.6 Receiver
Internal Bus
SBR12:SBR0
SCI Data Register
Bus
Clock
Baud Divider
11-Bit Receive Shift Register
RXPOL
Data
Recovery
H
8
7
6
5
4
3
2
1
0
L
SCRXD
Loop
Control
From TXD Pin
or Transmitter
RE
RAF
FE
NF
PE
LOOPS
RSRC
M
WAKE
ILT
RWU
Wakeup
Logic
PE
PT
R8
Parity
Checking
Idle IRQ
IDLE
ILIE
RDRF/OR
IRQ
BRKDFE
RDRF
OR
RIE
Break
Detect Logic
BRKDIF
BRKDIE
Break IRQ
Active Edge
Detect Logic
RXEDGIF
RXEDGIE
RX Active Edge IRQ
Figure 15-20. SCI Receiver Block Diagram
15.4.6.1 Receiver Character Length
The SCI receiver can accommodate either 8-bit or 9-bit data characters. The state of the M bit in SCI
control register 1 (SCICR1) determines the length of data characters. When receiving 9-bit data, bit R8 in
SCI data register high (SCIDRH) is the ninth bit (bit 8).
15.4.6.2 Character Reception
During an SCI reception, the receive shift register shifts a frame in from the RXD pin. The SCI data register
is the read-only buffer between the internal data bus and the receive shift register.
After a complete frame shifts into the receive shift register, the data portion of the frame transfers to the
SCI data register. The receive data register full flag, RDRF, in SCI status register 1 (SCISR1) becomes set,
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indicating that the received byte can be read. If the receive interrupt enable bit, RIE, in SCI control
register 2 (SCICR2) is also set, the RDRF flag generates an RDRF interrupt request.
15.4.6.3 Data Sampling
The RT clock rate. The RT clock is an internal signal with a frequency 16 times the baud rate. To adjust
for baud rate mismatch, the RT clock (see Figure 15-21) is re-synchronized:
•
•
After every start bit
After the receiver detects a data bit change from logic 1 to logic 0 (after the majority of data bit
samples at RT8, RT9, and RT10 returns a valid logic 1 and the majority of the next RT8, RT9, and
RT10 samples returns a valid logic 0)
To locate the start bit, data recovery logic does an asynchronous search for a logic 0 preceded by three logic
1s.When the falling edge of a possible start bit occurs, the RT clock begins to count to 16.
Start Bit
LSB
RXD
Samples
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
Start Bit
Qualification
Start Bit
Verification
Data
Sampling
RT Clock
RT CLock Count
Reset RT Clock
Figure 15-21. Receiver Data Sampling
To verify the start bit and to detect noise, data recovery logic takes samples at RT3, RT5, and RT7.
Figure 15-17 summarizes the results of the start bit verification samples.
Table 15-17. Start Bit Verification
RT3, RT5, and RT7 Samples
Start Bit Verification
Noise Flag
000
001
010
011
100
101
110
111
Yes
Yes
Yes
No
0
1
1
0
1
0
0
0
Yes
No
No
No
If start bit verification is not successful, the RT clock is reset and a new search for a start bit begins.
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To determine the value of a data bit and to detect noise, recovery logic takes samples at RT8, RT9, and
RT10. Table 15-18 summarizes the results of the data bit samples.
Table 15-18. Data Bit Recovery
RT8, RT9, and RT10 Samples
Data Bit Determination
Noise Flag
000
001
010
011
100
101
110
111
0
0
0
1
0
1
1
1
0
1
1
1
1
1
1
0
NOTE
The RT8, RT9, and RT10 samples do not affect start bit verification. If any
or all of the RT8, RT9, and RT10 start bit samples are logic 1s following a
successful start bit verification, the noise flag (NF) is set and the receiver
assumes that the bit is a start bit (logic 0).
To verify a stop bit and to detect noise, recovery logic takes samples at RT8, RT9, and RT10. Table 15-19
summarizes the results of the stop bit samples.
Table 15-19. Stop Bit Recovery
RT8, RT9, and RT10 Samples
Framing Error Flag
Noise Flag
000
001
010
011
100
101
110
111
1
1
1
0
1
0
0
0
0
1
1
1
1
1
1
0
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In Figure 15-22 the verification samples RT3 and RT5 determine that the first low detected was noise and
not the beginning of a start bit. The RT clock is reset and the start bit search begins again. The noise flag
is not set because the noise occurred before the start bit was found.
Start Bit
LSB
RXD
Samples
1
1
1
0
1
1
1
0
0
0
0
0
0
0
RT Clock
RT Clock Count
Reset RT Clock
Figure 15-22. Start Bit Search Example 1
In Figure 15-23, verification sample at RT3 is high. The RT3 sample sets the noise flag. Although the
perceived bit time is misaligned, the data samples RT8, RT9, and RT10 are within the bit time and data
recovery is successful.
Perceived Start Bit
Actual Start Bit
LSB
RXD
Samples
1
1
1
1
1
0
1
0
0
0
0
0
RT Clock
RT Clock Count
Reset RT Clock
Figure 15-23. Start Bit Search Example 2
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In Figure 15-24, a large burst of noise is perceived as the beginning of a start bit, although the test sample
at RT5 is high. The RT5 sample sets the noise flag. Although this is a worst-case misalignment of perceived
bit time, the data samples RT8, RT9, and RT10 are within the bit time and data recovery is successful.
Perceived Start Bit
Actual Start Bit
LSB
RXD
Samples
1
1
1
0
0
1
0
0
0
0
RT Clock
RT Clock Count
Reset RT Clock
Figure 15-24. Start Bit Search Example 3
Figure 15-25 shows the effect of noise early in the start bit time. Although this noise does not affect proper
synchronization with the start bit time, it does set the noise flag.
Perceived and Actual Start Bit
LSB
RXD
Samples
1
1
1
1
1
1
1
1
1
0
1
0
RT Clock
RT Clock Count
Reset RT Clock
Figure 15-25. Start Bit Search Example 4
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Figure 15-26 shows a burst of noise near the beginning of the start bit that resets the RT clock. The sample
after the reset is low but is not preceded by three high samples that would qualify as a falling edge.
Depending on the timing of the start bit search and on the data, the frame may be missed entirely or it may
set the framing error flag.
Start Bit
LSB
No Start Bit Found
RXD
Samples
1
1
1
1
1
1
1
1
1
0
0
1
1
0
0
0
0
0
0
0
0
RT Clock
RT Clock Count
Reset RT Clock
Figure 15-26. Start Bit Search Example 5
In Figure 15-27, a noise burst makes the majority of data samples RT8, RT9, and RT10 high. This sets the
noise flag but does not reset the RT clock. In start bits only, the RT8, RT9, and RT10 data samples are
ignored.
Start Bit
LSB
RXD
Samples
1
1
1
1
1
1
1
1
1
0
0
0
0
1
0
1
RT Clock
RT Clock Count
Reset RT Clock
Figure 15-27. Start Bit Search Example 6
15.4.6.4 Framing Errors
If the data recovery logic does not detect a logic 1 where the stop bit should be in an incoming frame, it
sets the framing error flag, FE, in SCI status register 1 (SCISR1). A break character also sets the FE flag
because a break character has no stop bit. The FE flag is set at the same time that the RDRF flag is set.
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15.4.6.5 Baud Rate Tolerance
A transmitting device may be operating at a baud rate below or above the receiver baud rate. Accumulated
bit time misalignment can cause one of the three stop bit data samples (RT8, RT9, and RT10) to fall outside
the actual stop bit. A noise error will occur if the RT8, RT9, and RT10 samples are not all the same logical
values. A framing error will occur if the receiver clock is misaligned in such a way that the majority of the
RT8, RT9, and RT10 stop bit samples are a logic zero.
As the receiver samples an incoming frame, it re-synchronizes the RT clock on any valid falling edge
within the frame. Re synchronization within frames will correct a misalignment between transmitter bit
times and receiver bit times.
Slow Data Tolerance
Figure 15-28 shows how much a slow received frame can be misaligned without causing a noise error or
a framing error. The slow stop bit begins at RT8 instead of RT1 but arrives in time for the stop bit data
samples at RT8, RT9, and RT10.
MSB
Stop
Receiver
RT Clock
Data
Samples
Figure 15-28. Slow Data
Let’s take RTr as receiver RT clock and RTt as transmitter RT clock.
For an 8-bit data character, it takes the receiver 9 bit times x 16 RTr cycles +7 RTr cycles = 151 RTr cycles
to start data sampling of the stop bit.
With the misaligned character shown in Figure 15-28, the receiver counts 151 RTr cycles at the point when
the count of the transmitting device is 9 bit times x 16 RTt cycles = 144 RTt cycles.
The maximum percent difference between the receiver count and the transmitter count of a slow 8-bit data
character with no errors is:
((151 – 144) / 151) x 100 = 4.63%
For a 9-bit data character, it takes the receiver 10 bit times x 16 RTr cycles + 7 RTr cycles = 167 RTr cycles
to start data sampling of the stop bit.
With the misaligned character shown in Figure 15-28, the receiver counts 167 RTr cycles at the point when
the count of the transmitting device is 10 bit times x 16 RTt cycles = 160 RTt cycles.
The maximum percent difference between the receiver count and the transmitter count of a slow 9-bit
character with no errors is:
((167 – 160) / 167) X 100 = 4.19%
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Fast Data Tolerance
Figure 15-29 shows how much a fast received frame can be misaligned. The fast stop bit ends at RT10
instead of RT16 but is still sampled at RT8, RT9, and RT10.
Stop
Idle or Next Frame
Receiver
RT Clock
Data
Samples
Figure 15-29. Fast Data
For an 8-bit data character, it takes the receiver 9 bit times x 16 RTr cycles + 10 RTr cycles = 154 RTr cycles
to finish data sampling of the stop bit.
With the misaligned character shown in Figure 15-29, the receiver counts 154 RTr cycles at the point when
the count of the transmitting device is 10 bit times x 16 RTt cycles = 160 RTt cycles.
The maximum percent difference between the receiver count and the transmitter count of a fast 8-bit
character with no errors is:
((160 – 154) / 160) x 100 = 3.75%
For a 9-bit data character, it takes the receiver 10 bit times x 16 RTr cycles + 10 RTr cycles = 170 RTr cycles
to finish data sampling of the stop bit.
With the misaligned character shown in Figure 15-29, the receiver counts 170 RTr cycles at the point when
the count of the transmitting device is 11 bit times x 16 RTt cycles = 176 RTt cycles.
The maximum percent difference between the receiver count and the transmitter count of a fast 9-bit
character with no errors is:
((176 – 170) /176) x 100 = 3.40%
15.4.6.6 Receiver Wakeup
To enable the SCI to ignore transmissions intended only for other receivers in multiple-receiver systems,
the receiver can be put into a standby state. Setting the receiver wakeup bit, RWU, in SCI control register 2
(SCICR2) puts the receiver into standby state during which receiver interrupts are disabled.The SCI will
still load the receive data into the SCIDRH/L registers, but it will not set the RDRF flag.
The transmitting device can address messages to selected receivers by including addressing information in
the initial frame or frames of each message.
The WAKE bit in SCI control register 1 (SCICR1) determines how the SCI is brought out of the standby
state to process an incoming message. The WAKE bit enables either idle line wakeup or address mark
wakeup.
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15.4.6.6.1
Idle Input line Wakeup (WAKE = 0)
In this wakeup method, an idle condition on the RXD pin clears the RWU bit and wakes up the SCI. The
initial frame or frames of every message contain addressing information. All receivers evaluate the
addressing information, and receivers for which the message is addressed process the frames that follow.
Any receiver for which a message is not addressed can set its RWU bit and return to the standby state. The
RWU bit remains set and the receiver remains on standby until another idle character appears on the RXD
pin.
Idle line wakeup requires that messages be separated by at least one idle character and that no message
contains idle characters.
The idle character that wakes a receiver does not set the receiver idle bit, IDLE, or the receive data register
full flag, RDRF.
The idle line type bit, ILT, determines whether the receiver begins counting logic 1s as idle character bits
after the start bit or after the stop bit. ILT is in SCI control register 1 (SCICR1).
15.4.6.6.2
Address Mark Wakeup (WAKE = 1)
In this wakeup method, a logic 1 in the most significant bit (MSB) position of a frame clears the RWU bit
and wakes up the SCI. The logic 1 in the MSB position marks a frame as an address frame that contains
addressing information. All receivers evaluate the addressing information, and the receivers for which the
message is addressed process the frames that follow.Any receiver for which a message is not addressed can
set its RWU bit and return to the standby state. The RWU bit remains set and the receiver remains on
standby until another address frame appears on the RXD pin.
The logic 1 MSB of an address frame clears the receiver’s RWU bit before the stop bit is received and sets
the RDRF flag.
Address mark wakeup allows messages to contain idle characters but requires that the MSB be reserved
for use in address frames.
NOTE
With the WAKE bit clear, setting the RWU bit after the RXD pin has been
idle can cause the receiver to wake up immediately.
15.4.7 Single-Wire Operation
Normally, the SCI uses two pins for transmitting and receiving. In single-wire operation, the RXD pin is
disconnected from the SCI. The SCI uses the TXD pin for both receiving and transmitting.
Transmitter
TXD
Receiver
RXD
Figure 15-30. Single-Wire Operation (LOOPS = 1, RSRC = 1)
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Enable single-wire operation by setting the LOOPS bit and the receiver source bit, RSRC, in SCI control
register 1 (SCICR1). Setting the LOOPS bit disables the path from the RXD pin to the receiver. Setting
the RSRC bit connects the TXD pin to the receiver. Both the transmitter and receiver must be enabled
(TE = 1 and RE = 1).The TXDIR bit (SCISR2[1]) determines whether the TXD pin is going to be used as
an input (TXDIR = 0) or an output (TXDIR = 1) in this mode of operation.
NOTE
In single-wire operation data from the TXD pin is inverted if RXPOL is set.
15.4.8 Loop Operation
In loop operation the transmitter output goes to the receiver input. The RXD pin is disconnected from the
SCI.
Transmitter
TXD
Receiver
RXD
Figure 15-31. Loop Operation (LOOPS = 1, RSRC = 0)
Enable loop operation by setting the LOOPS bit and clearing the RSRC bit in SCI control register 1
(SCICR1). Setting the LOOPS bit disables the path from the RXD pin to the receiver. Clearing the RSRC
bit connects the transmitter output to the receiver input. Both the transmitter and receiver must be enabled
(TE = 1 and RE = 1).
NOTE
In loop operation data from the transmitter is not recognized by the receiver
if RXPOL and TXPOL are not the same.
15.5 Initialization/Application Information
See Section 15.3.2, “Register Descriptions”.
15.5.2 Modes of Operation
15.5.2.1 Run Mode
Normal mode of operation.
To initialize a SCI transmission, see Section 15.4.5.2, “Character Transmission”.
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15.5.2.2 Wait Mode
SCI operation in wait mode depends on the state of the SCISWAI bit in the SCI control register 1
(SCICR1).
•
•
If SCISWAI is clear, the SCI operates normally when the CPU is in wait mode.
If SCISWAI is set, SCI clock generation ceases and the SCI module enters a power-conservation
state when the CPU is in wait mode. Setting SCISWAI does not affect the state of the receiver
enable bit, RE, or the transmitter enable bit, TE.
If SCISWAI is set, any transmission or reception in progress stops at wait mode entry. The
transmission or reception resumes when either an internal or external interrupt brings the CPU out
of wait mode. Exiting wait mode by reset aborts any transmission or reception in progress and
resets the SCI.
15.5.2.3 Stop Mode
The SCI is inactive during stop mode for reduced power consumption. The STOP instruction does not
affect the SCI register states, but the SCI bus clock will be disabled. The SCI operation resumes from
where it left off after an external interrupt brings the CPU out of stop mode. Exiting stop mode by reset
aborts any transmission or reception in progress and resets the SCI.
The receive input active edge detect circuit is still active in stop mode. An active edge on the receive input
can be used to bring the CPU out of stop mode.
15.5.3 Interrupt Operation
This section describes the interrupt originated by the SCI block.The MCU must service the interrupt
requests. Table 15-20 lists the eight interrupt sources of the SCI.
Table 15-20. SCI Interrupt Sources
Interrupt
Source
Local Enable
Description
TDRE
SCISR1[7]
TIE
Active high level. Indicates that a byte was transferred from SCIDRH/L to the
transmit shift register.
TC
SCISR1[6]
SCISR1[5]
TCIE
RIE
Active high level. Indicates that a transmit is complete.
RDRF
Active high level. The RDRF interrupt indicates that received data is available
in the SCI data register.
OR
SCISR1[3]
SCISR1[4]
Active high level. This interrupt indicates that an overrun condition has occurred.
Active high level. Indicates that receiver input has become idle.
IDLE
ILIE
RXEDGIF SCIASR1[7]
RXEDGIE
Active high level. Indicates that an active edge (falling for RXPOL = 0, rising for
RXPOL = 1) was detected.
BERRIF SCIASR1[1]
BERRIE
BRKDIE
Active high level. Indicates that a mismatch between transmitted and received data
in a single wire application has happened.
BKDIF
SCIASR1[0]
Active high level. Indicates that a break character has been received.
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15.5.3.1 Description of Interrupt Operation
The SCI only originates interrupt requests. The following is a description of how the SCI makes a request
and how the MCU should acknowledge that request. The interrupt vector offset and interrupt number are
chip dependent. The SCI only has a single interrupt line (SCI Interrupt Signal, active high operation) and
all the following interrupts, when generated, are ORed together and issued through that port.
15.5.3.1.1
TDRE Description
The TDRE interrupt is set high by the SCI when the transmit shift register receives a byte from the SCI
data register. A TDRE interrupt indicates that the transmit data register (SCIDRH/L) is empty and that a
new byte can be written to the SCIDRH/L for transmission.Clear TDRE by reading SCI status register 1
with TDRE set and then writing to SCI data register low (SCIDRL).
15.5.3.1.2
TC Description
The TC interrupt is set by the SCI when a transmission has been completed. Transmission is completed
when all bits including the stop bit (if transmitted) have been shifted out and no data is queued to be
transmitted. No stop bit is transmitted when sending a break character and the TC flag is set (providing
there is no more data queued for transmission) when the break character has been shifted out. A TC
interrupt indicates that there is no transmission in progress. TC is set high when the TDRE flag is set and
no data, preamble, or break character is being transmitted. When TC is set, the TXD pin becomes idle
(logic 1). Clear TC by reading SCI status register 1 (SCISR1) with TC set and then writing to SCI data
register low (SCIDRL).TC is cleared automatically when data, preamble, or break is queued and ready to
be sent.
15.5.3.1.3
RDRF Description
The RDRF interrupt is set when the data in the receive shift register transfers to the SCI data register. A
RDRF interrupt indicates that the received data has been transferred to the SCI data register and that the
byte can now be read by the MCU. The RDRF interrupt is cleared by reading the SCI status register one
(SCISR1) and then reading SCI data register low (SCIDRL).
15.5.3.1.4
OR Description
The OR interrupt is set when software fails to read the SCI data register before the receive shift register
receives the next frame. The newly acquired data in the shift register will be lost in this case, but the data
already in the SCI data registers is not affected. The OR interrupt is cleared by reading the SCI status
register one (SCISR1) and then reading SCI data register low (SCIDRL).
15.5.3.1.5
IDLE Description
The IDLE interrupt is set when 10 consecutive logic 1s (if M = 0) or 11 consecutive logic 1s (if M = 1)
appear on the receiver input. Once the IDLE is cleared, a valid frame must again set the RDRF flag before
an idle condition can set the IDLE flag. Clear IDLE by reading SCI status register 1 (SCISR1) with IDLE
set and then reading SCI data register low (SCIDRL).
MC9S12XDP512 Data Sheet, Rev. 2.11
708
Freescale Semiconductor
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Chapter 15 Serial Communication Interface (S12MC9S12XDP512V5)
15.5.3.1.6
RXEDGIF Description
The RXEDGIF interrupt is set when an active edge (falling if RXPOL = 0, rising if RXPOL = 1) on the
RXD pin is detected. Clear RXEDGIF by writing a “1” to the SCIASR1 SCI alternative status register 1.
15.5.3.1.7
BERRIF Description
The BERRIF interrupt is set when a mismatch between the transmitted and the received data in a single
wire application like LIN was detected. Clear BERRIF by writing a “1” to the SCIASR1 SCI alternative
status register 1. This flag is also cleared if the bit error detect feature is disabled.
15.5.3.1.8
BKDIF Description
The BKDIF interrupt is set when a break signal was received. Clear BKDIF by writing a “1” to the
SCIASR1 SCI alternative status register 1. This flag is also cleared if break detect feature is disabled.
15.5.4 Recovery from Wait Mode
The SCI interrupt request can be used to bring the CPU out of wait mode.
15.5.5 Recovery from Stop Mode
An active edge on the receive input can be used to bring the CPU out of stop mode.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
709
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Chapter 15 Serial Communication Interface (S12MC9S12XDP512V5)
MC9S12XDP512 Data Sheet, Rev. 2.11
710
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Chapter 16
Serial Peripheral Interface (S12SPIV4)
16.1 Introduction
The SPI module allows a duplex, synchronous, serial communication between the MCU and peripheral
devices. Software can poll the SPI status flags or the SPI operation can be interrupt driven.
16.1.1 Features
The MC9S12XDP512 includes these distinctive features:
•
•
•
•
•
•
•
Master mode and slave mode
Bidirectional mode
Slave select output
Mode fault error flag with CPU interrupt capability
Double-buffered data register
Serial clock with programmable polarity and phase
Control of SPI operation during wait mode
16.1.2 Modes of Operation
The SPI functions in three modes: run, wait, and stop.
•
Run mode
This is the basic mode of operation.
Wait mode
•
SPI operation in wait mode is a configurable low power mode, controlled by the SPISWAI bit
located in the SPICR2 register. In wait mode, if the SPISWAI bit is clear, the SPI operates like in
run mode. If the SPISWAI bit is set, the SPI goes into a power conservative state, with the SPI clock
generation turned off. If the SPI is configured as a master, any transmission in progress stops, but
is resumed after CPU goes into run mode. If the SPI is configured as a slave, reception and
transmission of a byte continues, so that the slave stays synchronized to the master.
•
Stop mode
The SPI is inactive in stop mode for reduced power consumption. If the SPI is configured as a
master, any transmission in progress stops, but is resumed after CPU goes into run mode. If the SPI
is configured as a slave, reception and transmission of a byte continues, so that the slave stays
synchronized to the master.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
711
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Chapter 16 Serial Peripheral Interface (S12SPIV4)
This is a high level description only, detailed descriptions of operating modes are contained in
Section 16.4.7, “Low Power Mode Options”.
16.1.3 Block Diagram
Figure 16-1 gives an overview on the SPI architecture. The main parts of the SPI are status, control and
data registers, shifter logic, baud rate generator, master/slave control logic, and port control logic.
SPI
2
SPI Control Register 1
BIDIROE
2
SPI Control Register 2
SPC0
SPI Status Register
SPIF
Slave
Control
CPOL
CPHA
MOSI
MODF SPTEF
Phase +
Polarity
Control
SCK In
Interrupt Control
Slave Baud Rate
SPI
Interrupt
Request
Master Baud Rate
Phase +
Polarity
Control
SCK Out
Port
Control
Logic
SCK
SS
Baud Rate Generator
Counter
Master
Control
Bus Clock
Baud Rate
Prescaler
Clock Select
Shift
Clock
Sample
Clock
SPPR
3
3
SPR
Shifter
LSBFE=0
LSBFE=1
SPI Baud Rate Register
Data In
LSBFE=1
8
MSB
SPI Data Register
LSB
8
LSBFE=0
Data Out
LSBFE=0
LSBFE=1
Figure 16-1. SPI Block Diagram
MC9S12XDP512 Data Sheet, Rev. 2.11
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Freescale Semiconductor
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Chapter 16 Serial Peripheral Interface (S12SPIV4)
16.2 External Signal Description
This section lists the name and description of all ports including inputs and outputs that do, or may, connect
off chip. The MC9S12XDP512 module has a total of four external pins.
16.2.1 MOSI — Master Out/Slave In Pin
This pin is used to transmit data out of the SPI module when it is configured as a master and receive data
when it is configured as slave.
16.2.2 MISO — Master In/Slave Out Pin
This pin is used to transmit data out of the SPI module when it is configured as a slave and receive data
when it is configured as master.
16.2.3 SS — Slave Select Pin
This pin is used to output the select signal from the SPI module to another peripheral with which a data
transfer is to take place when it is configured as a master and it is used as an input to receive the slave select
signal when the SPI is configured as slave.
16.2.4 SCK — Serial Clock Pin
In master mode, this is the synchronous output clock. In slave mode, this is the synchronous input clock.
16.3 Memory Map and Register Definition
The memory map for the MC9S12XDP512 is given in Table 16-1. The address listed for each register is
the sum of a base address and an address offset. The base address is defined at the SoC level and the address
offset is defined at the module level. Reads from the reserved bits return zeros and writes to the reserved
bits have no effect.
16.3.1 Module Memory Map
Table 16-1. MC9S12XDP512V4 Memory Map
Address
Use
Access
0x___0
0x___1
0x___2
0x___3
0x___4
0x___5
0x___6
0x___7
SPI Control Register 1 (SPICR1)
SPI Control Register 2 (SPICR2)
SPI Baud Rate Register (SPIBR)
SPI Status Register (SPISR)
Reserved
Read / Write
1
Read / Write
Read / Write
1
2
Read
2 3
—
SPI Data Register (SPIDR)
Reserved
Read / Write
2 3
—
2 3
Reserved
—
1
2
Certain bits are non-writable.
Writes to this register are ignored.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
713
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Chapter 16 Serial Peripheral Interface (S12SPIV4)
3
Reading from this register returns all zeros.
16.3.2 Register Descriptions
This section consists of register descriptions in address order. Each description includes a standard register
diagram with an associated figure number. Details of register bit and field function follow the register
diagrams, in bit order.
Register
Name
Bit 7
SPIE
0
6
SPE
0
5
SPTIE
0
4
3
2
CPHA
0
1
Bit 0
0x___0
SPICR1
R
MSTR
CPOL
SSOE
LSBFE
W
0x___1
SPICR2
R
MODFEN
BIDIROE
0
SPISWAI
SPC0
W
0x___2
SPIBR
R
0
SPPR2
0
SPPR1
SPTEF
SPPR0
MODF
SPR2
0
SPR1
0
SPR0
0
W
0x___3
SPISR
R
SPIF
0
W
0x___4
R
Reserved
W
0x___5
SPIDR
R
Bit 7
6
5
4
3
2
1
Bit 0
W
0x___6
R
Reserved
W
0x___7
R
Reserved
W
= Unimplemented or Reserved
Figure 16-2. SPI Register Summary
MC9S12XDP512 Data Sheet, Rev. 2.11
714
Freescale Semiconductor
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Chapter 16 Serial Peripheral Interface (S12SPIV4)
16.3.2.1 SPI Control Register 1 (SPICR1)
Module Base +0x___0
7
6
5
4
3
2
1
0
R
W
SPIE
SPE
SPTIE
MSTR
CPOL
CPHA
SSOE
LSBFE
Reset
0
0
0
0
0
1
0
0
Figure 16-3. SPI Control Register 1 (SPICR1)
Read: Anytime
Write: Anytime
Table 16-2. SPICR1 Field Descriptions
Description
Field
7
SPI Interrupt Enable Bit — This bit enables SPI interrupt requests, if SPIF or MODF status flag is set.
SPIE
0 SPI interrupts disabled.
1 SPI interrupts enabled.
6
SPE
SPI System Enable Bit — This bit enables the SPI system and dedicates the SPI port pins to SPI system
functions. If SPE is cleared, SPI is disabled and forced into idle state, status bits in SPISR register are reset.
0 SPI disabled (lower power consumption).
1 SPI enabled, port pins are dedicated to SPI functions.
5
SPI Transmit Interrupt Enable — This bit enables SPI interrupt requests, if SPTEF flag is set.
0 SPTEF interrupt disabled.
SPTIE
1 SPTEF interrupt enabled.
4
SPI Master/Slave Mode Select Bit — This bit selects whether the SPI operates in master or slave mode.
Switching the SPI from master to slave or vice versa forces the SPI system into idle state.
0 SPI is in slave mode.
MSTR
1 SPI is in master mode.
3
SPI Clock Polarity Bit — This bit selects an inverted or non-inverted SPI clock. To transmit data between SPI
modules, the SPI modules must have identical CPOL values. In master mode, a change of this bit will abort a
transmission in progress and force the SPI system into idle state.
CPOL
0 Active-high clocks selected. In idle state SCK is low.
1 Active-low clocks selected. In idle state SCK is high.
2
SPI Clock Phase Bit — This bit is used to select the SPI clock format. In master mode, a change of this bit will
abort a transmission in progress and force the SPI system into idle state.
CPHA
0 Sampling of data occurs at odd edges (1,3,5,...,15) of the SCK clock.
1
Slave Select Output Enable — The SS output feature is enabled only in master mode, if MODFEN is set, by
asserting the SSOE as shown in Table 16-3. In master mode, a change of this bit will abort a transmission in
progress and force the SPI system into idle state.
SSOE
0
LSB-First Enable — This bit does not affect the position of the MSB and LSB in the data register. Reads and
writes of the data register always have the MSB in bit 7. In master mode, a change of this bit will abort a
transmission in progress and force the SPI system into idle state.
LSBFE
0 Data is transferred most significant bit first.
1 Data is transferred least significant bit first.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
715
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Chapter 16 Serial Peripheral Interface (S12SPIV4)
Table 16-3. SS Input / Output Selection
MODFEN
SSOE
Master Mode
Slave Mode
0
0
1
1
0
1
0
1
SS not used by SPI
SS not used by SPI
SS input
SS input
SS input
SS input
SS input with MODF feature
SS is slave select output
16.3.2.2 SPI Control Register 2 (SPICR2)
Module Base +0x___1
7
6
5
4
3
2
1
0
R
W
0
0
0
0
MODFEN
BIDIROE
SPISWAI
0
SPC0
Reset
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 16-4. SPI Control Register 2 (SPICR2)
Read: Anytime
Write: Anytime; writes to the reserved bits have no effect
Table 16-4. SPICR2 Field Descriptions
Field
Description
Mode Fault Enable Bit — This bit allows the MODF failure to be detected. If the SPI is in master mode and
4
MODFEN MODFEN is cleared, then the SS port pin is not used by the SPI. In slave mode, the SS is available only as an
input regardless of the value of MODFEN. For an overview on the impact of the MODFEN bit on the SS port pin
configuration, refer to Table 16-5. In master mode, a change of this bit will abort a transmission in progress and
force the SPI system into idle state.
0 SS port pin is not used by the SPI.
1 SS port pin with MODF feature.
3
Output Enable in the Bidirectional Mode of Operation — This bit controls the MOSI and MISO output buffer
of the SPI, when in bidirectional mode of operation (SPC0 is set). In master mode, this bit controls the output
buffer of the MOSI port, in slave mode it controls the output buffer of the MISO port. In master mode, with SPC0
set, a change of this bit will abort a transmission in progress and force the SPI into idle state.
0 Output buffer disabled.
BIDIROE
1 Output buffer enabled.
1
SPI Stop in Wait Mode Bit — This bit is used for power conservation while in wait mode.
0 SPI clock operates normally in wait mode.
SPISWAI
1 Stop SPI clock generation when in wait mode.
0
Serial Pin Control Bit 0 — This bit enables bidirectional pin configurations as shown in Table 16-5. In master
SPC0
mode, a change of this bit will abort a transmission in progress and force the SPI system into idle state.
MC9S12XDP512 Data Sheet, Rev. 2.11
716
Freescale Semiconductor
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Chapter 16 Serial Peripheral Interface (S12SPIV4)
Table 16-5. Bidirectional Pin Configurations
Pin Mode
SPC0
BIDIROE
MISO
MOSI
Master Mode of Operation
Normal
0
1
X
0
1
Master In
Master Out
Master In
Bidirectional
MISO not used by SPI
Master I/O
Slave Mode of Operation
Normal
0
1
X
0
1
Slave Out
Slave In
Slave In
Bidirectional
MOSI not used by SPI
Slave I/O
16.3.2.3 SPI Baud Rate Register (SPIBR)
Module Base +0x___2
7
6
5
4
3
2
1
0
R
W
0
0
SPPR2
SPPR1
SPPR0
SPR2
SPR1
SPR0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 16-5. SPI Baud Rate Register (SPIBR)
Read: Anytime
Write: Anytime; writes to the reserved bits have no effect
Table 16-6. SPIBR Field Descriptions
Field
Description
SPI Baud Rate Preselection Bits — These bits specify the SPI baud rates as shown in Table 16-7. In master
6–4
SPPR[2:0] mode, a change of these bits will abort a transmission in progress and force the SPI system into idle state.
2–0
SPI Baud Rate Selection Bits — These bits specify the SPI baud rates as shown in Table 16-7. In master mode,
SPR[2:0]
a change of these bits will abort a transmission in progress and force the SPI system into idle state.
The baud rate divisor equation is as follows:
(SPR + 1)
BaudRateDivisor = (SPPR + 1) • 2
Eqn. 16-1
Eqn. 16-2
The baud rate can be calculated with the following equation:
Baud Rate = BusClock / BaudRateDivisor
NOTE
For maximum allowed baud rates, please refer to the SPI Electrical
Specification in the Electricals chapter of this data sheet.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
717
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Chapter 16 Serial Peripheral Interface (S12SPIV4)
Table 16-7. Example SPI Baud Rate Selection (25 MHz Bus Clock)
Baud Rate
Divisor
SPPR2
SPPR1
SPPR0
SPR2
SPR1
SPR0
Baud Rate
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
2
4
12.5 MHz
6.25 MHz
8
3.125 MHz
1.5625 MHz
781.25 kHz
390.63 kHz
195.31 kHz
97.66 kHz
6.25 MHz
16
32
64
128
256
4
8
3.125 MHz
1.5625 MHz
781.25 kHz
390.63 kHz
195.31 kHz
97.66 kHz
48.83 kHz
4.16667 MHz
2.08333 MHz
1.04167 MHz
520.83 kHz
260.42 kHz
130.21 kHz
65.10 kHz
32.55 kHz
3.125 MHz
1.5625 MHz
781.25 kHz
390.63 kHz
195.31 kHz
97.66 kHz
48.83 kHz
24.41 kHz
2.5 MHz
16
32
64
128
256
512
6
12
24
48
96
192
384
768
8
16
32
64
128
256
512
1024
10
20
1.25 MHz
40
625 kHz
80
312.5 kHz
156.25 kHz
78.13 kHz
39.06 kHz
160
320
640
MC9S12XDP512 Data Sheet, Rev. 2.11
718
Freescale Semiconductor
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Chapter 16 Serial Peripheral Interface (S12SPIV4)
Table 16-7. Example SPI Baud Rate Selection (25 MHz Bus Clock) (continued)
Baud Rate
Divisor
SPPR2
SPPR1
SPPR0
SPR2
SPR1
SPR0
Baud Rate
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
1280
12
19.53 kHz
2.08333 MHz
1.04167 MHz
520.83 kHz
260.42 kHz
130.21 kHz
65.10 kHz
24
48
96
192
384
768
1536
14
32.55 kHz
16.28 kHz
1.78571 MHz
892.86 kHz
446.43 kHz
223.21 kHz
111.61 kHz
55.80 kHz
28
56
112
224
448
896
1792
16
27.90 kHz
13.95 kHz
1.5625 MHz
781.25 kHz
390.63 kHz
195.31 kHz
97.66 kHz
32
64
128
256
512
1024
2048
48.83 kHz
24.41 kHz
12.21 kHz
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
719
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Chapter 16 Serial Peripheral Interface (S12SPIV4)
16.3.2.4 SPI Status Register (SPISR)
Module Base +0x___3
7
6
5
4
3
2
1
0
R
W
SPIF
0
SPTEF
MODF
0
0
0
0
Reset
0
0
1
0
0
0
0
0
= Unimplemented or Reserved
Figure 16-6. SPI Status Register (SPISR)
Read: Anytime
Write: Has no effect
Table 16-8. SPISR Field Descriptions
Description
Field
7
SPIF Interrupt Flag — This bit is set after a received data byte has been transferred into the SPI data register.
SPIF
This bit is cleared by reading the SPISR register (with SPIF set) followed by a read access to the SPI data
register.
0 Transfer not yet complete.
1 New data copied to SPIDR.
5
SPI Transmit Empty Interrupt Flag — If set, this bit indicates that the transmit data register is empty. To clear
this bit and place data into the transmit data register, SPISR must be read with SPTEF = 1, followed by a write
to SPIDR. Any write to the SPI data register without reading SPTEF = 1, is effectively ignored.
0 SPI data register not empty.
SPTEF
1 SPI data register empty.
4
Mode Fault Flag — This bit is set if the SS input becomes low while the SPI is configured as a master and mode
fault detection is enabled, MODFEN bit of SPICR2 register is set. Refer to MODFEN bit description in
Section 16.3.2.2, “SPI Control Register 2 (SPICR2)”. The flag is cleared automatically by a read of the SPI status
register (with MODF set) followed by a write to the SPI control register 1.
0 Mode fault has not occurred.
MODF
1 Mode fault has occurred.
MC9S12XDP512 Data Sheet, Rev. 2.11
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Freescale Semiconductor
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Chapter 16 Serial Peripheral Interface (S12SPIV4)
16.3.2.5 SPI Data Register (SPIDR)
Module Base +0x___5
7
6
5
4
3
2
1
0
R
W
Bit 7
6
5
4
3
2
2
Bit 0
Reset
0
0
0
0
0
0
0
0
Figure 16-7. SPI Data Register (SPIDR)
Read: Anytime; normally read only when SPIF is set
Write: Anytime
The SPI data register is both the input and output register for SPI data. A write to this register
allows a data byte to be queued and transmitted. For an SPI configured as a master, a queued data
byte is transmitted immediately after the previous transmission has completed. The SPI transmitter
empty flag SPTEF in the SPISR register indicates when the SPI data register is ready to accept new
data.
Received data in the SPIDR is valid when SPIF is set.
If SPIF is cleared and a byte has been received, the received byte is transferred from the receive
shift register to the SPIDR and SPIF is set.
If SPIF is set and not serviced, and a second byte has been received, the second received byte is
kept as valid byte in the receive shift register until the start of another transmission. The byte in the
SPIDR does not change.
If SPIF is set and a valid byte is in the receive shift register, and SPIF is serviced before the start of
a third transmission, the byte in the receive shift register is transferred into the SPIDR and SPIF
remains set (see Figure 16-8).
If SPIF is set and a valid byte is in the receive shift register, and SPIF is serviced after the start of
a third transmission, the byte in the receive shift register has become invalid and is not transferred
into the SPIDR (see Figure 16-9).
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
721
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Chapter 16 Serial Peripheral Interface (S12SPIV4)
Data A Received
Data B Received
Data C Received
SPIF Serviced
Receive Shift Register
Data B
Data A
Data C
SPIF
Data C
SPI Data Register
Data B
Data A
= Unspecified
= Reception in progress
Figure 16-8. Reception with SPIF Serviced in Time
Data A Received
Data B Received
Data C Received
Data B Lost
SPIF Serviced
Receive Shift Register
SPIF
Data B
Data C
Data C
Data A
SPI Data Register
Data A
= Unspecified
= Reception in progress
Figure 16-9. Reception with SPIF Serviced too Late
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Chapter 16 Serial Peripheral Interface (S12SPIV4)
16.4 Functional Description
The SPI module allows a duplex, synchronous, serial communication between the MCU and peripheral
devices. Software can poll the SPI status flags or SPI operation can be interrupt driven.
The SPI system is enabled by setting the SPI enable (SPE) bit in SPI control register 1. While SPE is set,
the four associated SPI port pins are dedicated to the SPI function as:
•
•
•
•
Slave select (SS)
Serial clock (SCK)
Master out/slave in (MOSI)
Master in/slave out (MISO)
The main element of the SPI system is the SPI data register. The 8-bit data register in the master and the
8-bit data register in the slave are linked by the MOSI and MISO pins to form a distributed 16-bit register.
When a data transfer operation is performed, this 16-bit register is serially shifted eight bit positions by the
S-clock from the master, so data is exchanged between the master and the slave. Data written to the master
SPI data register becomes the output data for the slave, and data read from the master SPI data register after
a transfer operation is the input data from the slave.
A read of SPISR with SPTEF = 1 followed by a write to SPIDR puts data into the transmit data register.
When a transfer is complete and SPIF is cleared, received data is moved into the receive data register. This
8-bit data register acts as the SPI receive data register for reads and as the SPI transmit data register for
writes. A single SPI register address is used for reading data from the read data buffer and for writing data
to the transmit data register.
The clock phase control bit (CPHA) and a clock polarity control bit (CPOL) in the SPI control register 1
(SPICR1) select one of four possible clock formats to be used by the SPI system. The CPOL bit simply
different protocols by sampling data on odd numbered SCK edges or on even numbered SCK edges (see
Section 16.4.3, “Transmission Formats”).
The SPI can be configured to operate as a master or as a slave. When the MSTR bit in SPI control register1
is set, master mode is selected, when the MSTR bit is clear, slave mode is selected.
NOTE
A change of CPOL or MSTR bit while there is a received byte pending in
the receive shift register will destroy the received byte and must be avoided.
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Chapter 16 Serial Peripheral Interface (S12SPIV4)
16.4.1 Master Mode
The SPI operates in master mode when the MSTR bit is set. Only a master SPI module can initiate
transmissions. A transmission begins by writing to the master SPI data register. If the shift register is
empty, the byte immediately transfers to the shift register. The byte begins shifting out on the MOSI pin
under the control of the serial clock.
•
S-clock
The SPR2, SPR1, and SPR0 baud rate selection bits, in conjunction with the SPPR2, SPPR1, and
SPPR0 baud rate preselection bits in the SPI baud rate register, control the baud rate generator and
determine the speed of the transmission. The SCK pin is the SPI clock output. Through the SCK
pin, the baud rate generator of the master controls the shift register of the slave peripheral.
•
•
MOSI, MISO pin
In master mode, the function of the serial data output pin (MOSI) and the serial data input pin
(MISO) is determined by the SPC0 and BIDIROE control bits.
SS pin
If MODFEN and SSOE are set, the SS pin is configured as slave select output. The SS output
becomes low during each transmission and is high when the SPI is in idle state.
If MODFEN is set and SSOE is cleared, the SS pin is configured as input for detecting mode fault
error. If the SS input becomes low this indicates a mode fault error where another master tries to
drive the MOSI and SCK lines. In this case, the SPI immediately switches to slave mode, by
clearing the MSTR bit and also disables the slave output buffer MISO (or SISO in bidirectional
mode). So the result is that all outputs are disabled and SCK, MOSI, and MISO are inputs. If a
transmission is in progress when the mode fault occurs, the transmission is aborted and the SPI is
forced into idle state.
This mode fault error also sets the mode fault (MODF) flag in the SPI status register (SPISR). If
the SPI interrupt enable bit (SPIE) is set when the MODF flag becomes set, then an SPI interrupt
sequence is also requested.
When a write to the SPI data register in the master occurs, there is a half SCK-cycle delay. After
depending on the clock format specified by the SPI clock phase bit, CPHA, in SPI control register 1
(see Section 16.4.3, “Transmission Formats”).
NOTE
A change of the bits CPOL, CPHA, SSOE, LSBFE, MODFEN, SPC0, or
BIDIROE with SPC0 set, SPPR2-SPPR0 and SPR2-SPR0 in master mode
will abort a transmission in progress and force the SPI into idle state. The
remote slave cannot detect this, therefore the master must ensure that the
remote slave is returned to idle state.
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Chapter 16 Serial Peripheral Interface (S12SPIV4)
16.4.2 Slave Mode
The SPI operates in slave mode when the MSTR bit in SPI control register 1 is clear.
•
SCK clock
In slave mode, SCK is the SPI clock input from the master.
MISO, MOSI pin
•
In slave mode, the function of the serial data output pin (MISO) and serial data input pin (MOSI)
is determined by the SPC0 bit and BIDIROE bit in SPI control register 2.
•
SS pin
The SS pin is the slave select input. Before a data transmission occurs, the SS pin of the slave SPI
must be low. SS must remain low until the transmission is complete. If SS goes high, the SPI is
forced into idle state.
The SS input also controls the serial data output pin, if SS is high (not selected), the serial data
output pin is high impedance, and, if SS is low, the first bit in the SPI data register is driven out of
the serial data output pin. Also, if the slave is not selected (SS is high), then the SCK input is
ignored and no internal shifting of the SPI shift register occurs.
Although the SPI is capable of duplex operation, some SPI peripherals are capable of only
receiving SPI data in a slave mode. For these simpler devices, there is no serial data out pin.
NOTE
When peripherals with duplex capability are used, take care not to
simultaneously enable two receivers whose serial outputs drive the same
system slave’s serial data output line.
As long as no more than one slave device drives the system slave’s serial data output line, it is possible for
several slaves to receive the same transmission from a master, although the master would not receive return
information from all of the receiving slaves.
If the CPHA bit in SPI control register 1 is clear, odd numbered edges on the SCK input cause the data at
the serial data input pin to be latched. Even numbered edges cause the value previously latched from the
serial data input pin to shift into the LSB or MSB of the SPI shift register, depending on the LSBFE bit.
If the CPHA bit is set, even numbered edges on the SCK input cause the data at the serial data input pin to
be latched. Odd numbered edges cause the value previously latched from the serial data input pin to shift
into the LSB or MSB of the SPI shift register, depending on the LSBFE bit.
When CPHA is set, the first edge is used to get the first data bit onto the serial data output pin. When CPHA
is clear and the SS input is low (slave selected), the first bit of the SPI data is driven out of the serial data
output pin. After the eighth shift, the transfer is considered complete and the received data is transferred
into the SPI data register. To indicate transfer is complete, the SPIF flag in the SPI status register is set.
NOTE
A change of the bits CPOL, CPHA, SSOE, LSBFE, MODFEN, SPC0, or
BIDIROE with SPC0 set in slave mode will corrupt a transmission in
progress and must be avoided.
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Chapter 16 Serial Peripheral Interface (S12SPIV4)
16.4.3 Transmission Formats
During an SPI transmission, data is transmitted (shifted out serially) and received (shifted in serially)
simultaneously. The serial clock (SCK) synchronizes shifting and sampling of the information on the two
serial data lines. A slave select line allows selection of an individual slave SPI device; slave devices that
are not selected do not interfere with SPI bus activities. Optionally, on a master SPI device, the slave select
line can be used to indicate multiple-master bus contention.
MASTER SPI
SLAVE SPI
MISO
MOSI
MISO
MOSI
SHIFT REGISTER
SHIFT REGISTER
SCK
SS
SCK
SS
BAUD RATE
GENERATOR
V
DD
Figure 16-10. Master/Slave Transfer Block Diagram
16.4.3.1 Clock Phase and Polarity Controls
Using two bits in the SPI control register 1, software selects one of four combinations of serial clock phase
and polarity.
The CPOL clock polarity control bit specifies an active high or low clock and has no significant effect on
the transmission format.
The CPHA clock phase control bit selects one of two fundamentally different transmission formats.
Clock phase and polarity should be identical for the master SPI device and the communicating slave
device. In some cases, the phase and polarity are changed between transmissions to allow a master device
to communicate with peripheral slaves having different requirements.
16.4.3.2 CPHA = 0 Transfer Format
The first edge on the SCK line is used to clock the first data bit of the slave into the master and the first
data bit of the master into the slave. In some peripherals, the first bit of the slave’s data is available at the
slave’s data out pin as soon as the slave is selected. In this format, the first SCK edge is issued a half cycle
after SS has become low.
A half SCK cycle later, the second edge appears on the SCK line. When this second edge occurs, the value
previously latched from the serial data input pin is shifted into the LSB or MSB of the shift register,
depending on LSBFE bit.
After this second edge, the next bit of the SPI master data is transmitted out of the serial data output pin of
the master to the serial input pin on the slave. This process continues for a total of 16 edges on the SCK
line, with data being latched on odd numbered edges and shifted on even numbered edges.
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Chapter 16 Serial Peripheral Interface (S12SPIV4)
Data reception is double buffered. Data is shifted serially into the SPI shift register during the transfer and
is transferred to the parallel SPI data register after the last bit is shifted in.
After the 16th (last) SCK edge:
•
Data that was previously in the master SPI data register should now be in the slave data register and
the data that was in the slave data register should be in the master.
•
The SPIF flag in the SPI status register is set, indicating that the transfer is complete.
Figure 16-11 is a timing diagram of an SPI transfer where CPHA = 0. SCK waveforms are shown for
CPOL = 0 and CPOL = 1. The diagram may be interpreted as a master or slave timing diagram because
the SCK, MISO, and MOSI pins are connected directly between the master and the slave. The MISO signal
is the output from the slave and the MOSI signal is the output from the master. The SS pin of the master
must be either high or reconfigured as a general-purpose output not affecting the SPI.
End of Idle State
Begin of Idle State
Begin
3
End
Transfer
1
2
4
5
6
7
8
9
10 11 12 13 14 15 16
SCK Edge Number
SCK (CPOL = 0)
SCK (CPOL = 1)
SAMPLE I
MOSI/MISO
CHANGE O
MOSI pin
CHANGE O
MISO pin
SEL SS (O)
Master only
SEL SS (I)
t
t
t
t
L
L
T
I
MSB first (LSBFE = 0): MSB
LSB first (LSBFE = 1): LSB
Bit 6
Bit 1
Bit 5
Bit 2
Bit 4
Bit 3
Bit 3
Bit 4
Bit 2
Bit 5
Bit 1
Bit 6
LSB Minimum 1/2 SCK
for t , t , t
MSB
T
l
L
t = Minimum leading time before the first SCK edge
L
t = Minimum trailing time after the last SCK edge
T
t = Minimum idling time between transfers (minimum SS high time)
I
t , t , and t are guaranteed for the master mode and required for the slave mode.
L
T
I
Figure 16-11. SPI Clock Format 0 (CPHA = 0)
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Chapter 16 Serial Peripheral Interface (S12SPIV4)
In slave mode, if the SS line is not deasserted between the successive transmissions then the content of the
SPI data register is not transmitted; instead the last received byte is transmitted. If the SS line is deasserted
for at least minimum idle time (half SCK cycle) between successive transmissions, then the content of the
SPI data register is transmitted.
In master mode, with slave select output enabled the SS line is always deasserted and reasserted between
successive transfers for at least minimum idle time.
16.4.3.3 CPHA = 1 Transfer Format
Some peripherals require the first SCK edge before the first data bit becomes available at the data out pin,
the second edge clocks data into the system. In this format, the first SCK edge is issued by setting the
CPHA bit at the beginning of the 8-cycle transfer operation.
The first edge of SCK occurs immediately after the half SCK clock cycle synchronization delay. This first
edge commands the slave to transfer its first data bit to the serial data input pin of the master.
A half SCK cycle later, the second edge appears on the SCK pin. This is the latching edge for both the
master and slave.
When the third edge occurs, the value previously latched from the serial data input pin is shifted into the
LSB or MSB of the SPI shift register, depending on LSBFE bit. After this edge, the next bit of the master
data is coupled out of the serial data output pin of the master to the serial input pin on the slave.
This process continues for a total of 16 edges on the SCK line with data being latched on even numbered
edges and shifting taking place on odd numbered edges.
Data reception is double buffered, data is serially shifted into the SPI shift register during the transfer and
is transferred to the parallel SPI data register after the last bit is shifted in.
After the 16th SCK edge:
•
Data that was previously in the SPI data register of the master is now in the data register of the
slave, and data that was in the data register of the slave is in the master.
•
The SPIF flag bit in SPISR is set indicating that the transfer is complete.
Figure 16-12 shows two clocking variations for CPHA = 1. The diagram may be interpreted as a master or
slave timing diagram because the SCK, MISO, and MOSI pins are connected directly between the master
and the slave. The MISO signal is the output from the slave, and the MOSI signal is the output from the
master. The SS line is the slave select input to the slave. The SS pin of the master must be either high or
reconfigured as a general-purpose output not affecting the SPI.
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Chapter 16 Serial Peripheral Interface (S12SPIV4)
End of Idle State
SCK Edge Number
SCK (CPOL = 0)
Begin
4
End
Begin of Idle State
Transfer
1
2
3
5
6
7
8
9
10 11 12 13 14 15 16
SCK (CPOL = 1)
SAMPLE I
MOSI/MISO
CHANGE O
MOSI pin
CHANGE O
MISO pin
SEL SS (O)
Master only
SEL SS (I)
t
t
t
t
L
L
T
I
MSB first (LSBFE = 0): MSB
LSB first (LSBFE = 1): LSB
Bit 6
Bit 1
Bit 5
Bit 2
Bit 4
Bit 3
Bit 3
Bit 4
Bit 2
Bit 5
Bit 1
Bit 6
LSB Minimum 1/2 SCK
for t , t , t
MSB
T
l
L
t = Minimum leading time before the first SCK edge, not required for back-to-back transfers
L
t = Minimum trailing time after the last SCK edge
T
t = Minimum idling time between transfers (minimum SS high time), not required for back-to-back transfers
I
Figure 16-12. SPI Clock Format 1 (CPHA = 1)
The SS line can remain active low between successive transfers (can be tied low at all times). This format
is sometimes preferred in systems having a single fixed master and a single slave that drive the MISO data
line.
•
Back-to-back transfers in master mode
In master mode, if a transmission has completed and a new data byte is available in the SPI data
register, this byte is sent out immediately without a trailing and minimum idle time.
The SPI interrupt request flag (SPIF) is common to both the master and slave modes. SPIF gets set one
half SCK cycle after the last SCK edge.
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Chapter 16 Serial Peripheral Interface (S12SPIV4)
16.4.4 SPI Baud Rate Generation
Baud rate generation consists of a series of divider stages. Six bits in the SPI baud rate register (SPPR2,
SPPR1, SPPR0, SPR2, SPR1, and SPR0) determine the divisor to the SPI module clock which results in
the SPI baud rate.
The SPI clock rate is determined by the product of the value in the baud rate preselection bits
(SPPR2–SPPR0) and the value in the baud rate selection bits (SPR2–SPR0). The module clock divisor
equation is shown in Equation 16-3.
(SPR + 1)
BaudRateDivisor = (SPPR + 1) • 2
Eqn. 16-3
When all bits are clear (the default condition), the SPI module clock is divided by 2. When the selection
bits (SPR2–SPR0) are 001 and the preselection bits (SPPR2–SPPR0) are 000, the module clock divisor
becomes 4. When the selection bits are 010, the module clock divisor becomes 8, etc.
When the preselection bits are 001, the divisor determined by the selection bits is multiplied by 2. When
the preselection bits are 010, the divisor is multiplied by 3, etc. See Table 16-7 for baud rate calculations
for all bit conditions, based on a 25 MHz bus clock. The two sets of selects allows the clock to be divided
by a non-power of two to achieve other baud rates such as divide by 6, divide by 10, etc.
The baud rate generator is activated only when the SPI is in master mode and a serial transfer is taking
place. In the other cases, the divider is disabled to decrease I current.
DD
NOTE
For maximum allowed baud rates, please refer to the SPI Electrical
Specification in the Electricals chapter of this data sheet.
16.4.5 Special Features
16.4.5.1 SS Output
The SS output feature automatically drives the SS pin low during transmission to select external devices
and drives it high during idle to deselect external devices. When SS output is selected, the SS output pin
is connected to the SS input pin of the external device.
The SS output is available only in master mode during normal SPI operation by asserting SSOE and
MODFEN bit as shown in Table 16-3.
The mode fault feature is disabled while SS output is enabled.
NOTE
Care must be taken when using the SS output feature in a multimaster
system because the mode fault feature is not available for detecting system
errors between masters.
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Chapter 16 Serial Peripheral Interface (S12SPIV4)
16.4.5.2 Bidirectional Mode (MOMI or SISO)
The bidirectional mode is selected when the SPC0 bit is set in SPI control register 2 (see Table 16-9). In
this mode, the SPI uses only one serial data pin for the interface with external device(s). The MSTR bit
decides which pin to use. The MOSI pin becomes the serial data I/O (MOMI) pin for the master mode, and
the MISO pin becomes serial data I/O (SISO) pin for the slave mode. The MISO pin in master mode and
MOSI pin in slave mode are not used by the SPI.
Table 16-9. Normal Mode and Bidirectional Mode
When SPE = 1
Master Mode MSTR = 1
Slave Mode MSTR = 0
Serial Out
Serial In
MOSI
MISO
MOSI
MISO
Normal Mode
SPC0 = 0
SPI
SPI
Serial Out
Serial In
Serial In
SPI
Serial Out
MOMI
Bidirectional Mode
SPC0 = 1
BIDIROE
SPI
BIDIROE
Serial In
Serial Out
SISO
The direction of each serial I/O pin depends on the BIDIROE bit. If the pin is configured as an output,
serial data from the shift register is driven out on the pin. The same pin is also the serial input to the shift
register.
•
•
•
The SCK is output for the master mode and input for the slave mode.
The SS is the input or output for the master mode, and it is always the input for the slave mode.
The bidirectional mode does not affect SCK and SS functions.
NOTE
In bidirectional master mode, with mode fault enabled, both data pins MISO
and MOSI can be occupied by the SPI, though MOSI is normally used for
transmissions in bidirectional mode and MISO is not used by the SPI. If a
mode fault occurs, the SPI is automatically switched to slave mode. In this
case MISO becomes occupied by the SPI and MOSI is not used. This must
be considered, if the MISO pin is used for another purpose.
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Chapter 16 Serial Peripheral Interface (S12SPIV4)
16.4.6 Error Conditions
The SPI has one error condition:
•
Mode fault error
16.4.6.1 Mode Fault Error
If the SS input becomes low while the SPI is configured as a master, it indicates a system error where more
than one master may be trying to drive the MOSI and SCK lines simultaneously. This condition is not
permitted in normal operation, the MODF bit in the SPI status register is set automatically, provided the
MODFEN bit is set.
In the special case where the SPI is in master mode and MODFEN bit is cleared, the SS pin is not used by
the SPI. In this special case, the mode fault error function is inhibited and MODF remains cleared. In case
the SPI system is configured as a slave, the SS pin is a dedicated input pin. Mode fault error doesn’t occur
in slave mode.
If a mode fault error occurs, the SPI is switched to slave mode, with the exception that the slave output
buffer is disabled. So SCK, MISO, and MOSI pins are forced to be high impedance inputs to avoid any
possibility of conflict with another output driver. A transmission in progress is aborted and the SPI is
forced into idle state.
If the mode fault error occurs in the bidirectional mode for a SPI system configured in master mode, output
enable of the MOMI (MOSI in bidirectional mode) is cleared if it was set. No mode fault error occurs in
the bidirectional mode for SPI system configured in slave mode.
The mode fault flag is cleared automatically by a read of the SPI status register (with MODF set) followed
by a write to SPI control register 1. If the mode fault flag is cleared, the SPI becomes a normal master or
slave again.
NOTE
If a mode fault error occurs and a received data byte is pending in the receive
shift register, this data byte will be lost.
16.4.7 Low Power Mode Options
16.4.7.1 SPI in Run Mode
In run mode with the SPI system enable (SPE) bit in the SPI control register clear, the SPI system is in a
low-power, disabled state. SPI registers remain accessible, but clocks to the core of this module are
disabled.
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Chapter 16 Serial Peripheral Interface (S12SPIV4)
16.4.7.2 SPI in Wait Mode
SPI operation in wait mode depends upon the state of the SPISWAI bit in SPI control register 2.
•
•
If SPISWAI is clear, the SPI operates normally when the CPU is in wait mode
If SPISWAI is set, SPI clock generation ceases and the SPI module enters a power conservation
state when the CPU is in wait mode.
– If SPISWAI is set and the SPI is configured for master, any transmission and reception in
progress stops at wait mode entry. The transmission and reception resumes when the SPI exits
wait mode.
– If SPISWAI is set and the SPI is configured as a slave, any transmission and reception in
progress continues if the SCK continues to be driven from the master. This keeps the slave
synchronized to the master and the SCK.
If the master transmits several bytes while the slave is in wait mode, the slave will continue to
send out bytes consistent with the operation mode at the start of wait mode (i.e., if the slave is
currently sending its SPIDR to the master, it will continue to send the same byte. Else if the
slave is currently sending the last received byte from the master, it will continue to send each
previous master byte).
NOTE
Care must be taken when expecting data from a master while the slave is in
wait or stop mode. Even though the shift register will continue to operate,
the rest of the SPI is shut down (i.e., a SPIF interrupt will not be generated
until exiting stop or wait mode). Also, the byte from the shift register will
not be copied into the SPIDR register until after the slave SPI has exited wait
or stop mode. In slave mode, a received byte pending in the receive shift
register will be lost when entering wait or stop mode. An SPIF flag and
SPIDR copy is generated only if wait mode is entered or exited during a
tranmission. If the slave enters wait mode in idle mode and exits wait mode
in idle mode, neither a SPIF nor a SPIDR copy will occur.
16.4.7.3 SPI in Stop Mode
Stop mode is dependent on the system. The SPI enters stop mode when the module clock is disabled (held
high or low). If the SPI is in master mode and exchanging data when the CPU enters stop mode, the
transmission is frozen until the CPU exits stop mode. After stop, data to and from the external SPI is
exchanged correctly. In slave mode, the SPI will stay synchronized with the master.
The stop mode is not dependent on the SPISWAI bit.
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Chapter 16 Serial Peripheral Interface (S12SPIV4)
16.4.7.4 Reset
The reset values of registers and signals are described in Section 16.3, “Memory Map and Register
Definition”, which details the registers and their bit fields.
•
If a data transmission occurs in slave mode after reset without a write to SPIDR, it will transmit
garbage, or the byte last received from the master before the reset.
•
Reading from the SPIDR after reset will always read a byte of zeros.
16.4.7.5 Interrupts
The MC9S12XDP512 only originates interrupt requests when SPI is enabled (SPE bit in SPICR1 set). The
following is a description of how the MC9S12XDP512 makes a request and how the MCU should
acknowledge that request. The interrupt vector offset and interrupt priority are chip dependent.
The interrupt flags MODF, SPIF, and SPTEF are logically ORed to generate an interrupt request.
16.4.7.5.1
MODF
MODF occurs when the master detects an error on the SS pin. The master SPI must be configured for the
MODF feature (see Table 16-3). After MODF is set, the current transfer is aborted and the following bit is
changed:
•
MSTR = 0, The master bit in SPICR1 resets.
The MODF interrupt is reflected in the status register MODF flag. Clearing the flag will also clear the
interrupt. This interrupt will stay active while the MODF flag is set. MODF has an automatic clearing
process which is described in Section 16.3.2.4, “SPI Status Register (SPISR)”.
16.4.7.5.2
SPIF
SPIF occurs when new data has been received and copied to the SPI data register. After SPIF is set, it does
not clear until it is serviced. SPIF has an automatic clearing process, which is described in
Section 16.3.2.4, “SPI Status Register (SPISR)”.
16.4.7.5.3
SPTEF
SPTEF occurs when the SPI data register is ready to accept new data. After SPTEF is set, it does not clear
until it is serviced. SPTEF has an automatic clearing process, which is described in Section 16.3.2.4, “SPI
Status Register (SPISR)”.
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Chapter 17
Voltage Regulator (S12VREG3V3V5)
17.1 Introduction
Module VREG_3V3 is a dual output voltage regulator that provides two separate 2.5V (typical) supplies
differing in the amount of current that can be sourced. The regulator input voltage range is from 3.3V up
to 5V (typical).
17.1.1 Features
Module VREG_3V3 includes these distinctive features:
•
Two parallel, linear voltage regulators
— Bandgap reference
•
•
•
•
Low-voltage detect (LVD) with low-voltage interrupt (LVI)
Power-on reset (POR)
Low-voltage reset (LVR)
Autonomous periodical interrupt (API)
17.1.2 Modes of Operation
There are three modes VREG_3V3 can operate in:
1. Full performance mode (FPM) (MCU is not in stop mode)
The regulator is active, providing the nominal supply voltage of 2.5 V with full current sourcing
capability at both outputs. Features LVD (low-voltage detect), LVR (low-voltage reset), and POR
(power-on reset) are available. The API is available.
2. Reduced power mode (RPM) (MCU is in stop mode)
The purpose is to reduce power consumption of the device. The output voltage may degrade to a
lower value than in full performance mode, additionally the current sourcing capability is
substantially reduced. Only the POR is available in this mode, LVD and LVR are disabled. The API
is available.
3. Shutdown mode
Controlled by VREGEN (see device level specification for connectivity of VREGEN).
This mode is characterized by minimum power consumption. The regulator outputs are in a
high-impedance state, only the POR feature is available, LVD and LVR are disabled. The API
internal RC oscillator clock is not available.
This mode must be used to disable the chip internal regulator VREG_3V3, i.e., to bypass the
VREG_3V3 to use external supplies.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
735
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Chapter 17 Voltage Regulator (S12VREG3V3V5)
17.1.3 Block Diagram
Figure 17-1 shows the function principle of VREG_3V3 by means of a block diagram. The regulator core
REG consists of two parallel subblocks, REG1 and REG2, providing two independent output voltages.
V
V
DDPLL
SSPLL
REG2
REG1
V
DDR
VBG
V
DDA
V
DD
LVR
LVD
POR
LVR
POR
V
V
SS
SSA
V
REGEN
CTRL
LVI
API
Rate
Select
API
API
Bus Clock
LVD: Low-Voltage Detect
LVR: Low-Voltage Reset
POR: Power-On Reset
REG: Regulator Core
CTRL: Regulator Control
API: Auto. Periodical Interrupt
PIN
Figure 17-1. VREG_3V3 Block Diagram
MC9S12XDP512 Data Sheet, Rev. 2.11
736
Freescale Semiconductor
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Chapter 17 Voltage Regulator (S12VREG3V3V5)
17.2 External Signal Description
Due to the nature of VREG_3V3 being a voltage regulator providing the chip internal power supply
voltages, most signals are power supply signals connected to pads.
Table 17-1 shows all signals of VREG_3V3 associated with pins.
Table 17-1. Signal Properties
Name
Function
Reset State
Pull Up
V
Power input (positive supply)
Quiet input (positive supply)
Quiet input (ground)
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
DDR
V
V
DDA
SSA
V
Primary output (positive supply)
Primary output (ground)
DD
V
SS
V
Secondary output (positive supply)
Secondary output (ground)
Optional Regulator Enable
DDPLL
V
SSPLL
V
(optional)
REGEN
NOTE
Check device level specification for connectivity of the signals.
17.2.1 VDDR — Regulator Power Input Pins
Signal V
is the power input of VREG_3V3. All currents sourced into the regulator loads flow through
DDR
this pin. A chip external decoupling capacitor (100 nF...220 nF, X7R ceramic) between V
and V
DDR
SSR
(if V
is not available V ) can smooth ripple on V
.
SSR
SS
DDR
For entering Shutdown Mode, pin V
should also be tied to ground on devices without VREGEN pin.
DDR
17.2.2 VDDA, VSSA — Regulator Reference Supply Pins
Signals V
/V
which are supposed to be relatively quiet, are used to supply the analog parts of the
DDA SSA,
regulator. Internal precision reference circuits are supplied from these signals. A chip external decoupling
capacitor (100 nF...220 nF, X7R ceramic) between V
supply.
and V
can further improve the quality of this
DDA
SSA
17.2.3 VDD, VSS — Regulator Output1 (Core Logic) Pins
Signals V /V are the primary outputs of VREG_3V3 that provide the power supply for the core logic.
DD SS
These signals are connected to device pins to allow external decoupling capacitors (100 nF...220 nF, X7R
ceramic).
In Shutdown Mode an external supply driving V /V can replace the voltage regulator.
DD SS
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
737
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Chapter 17 Voltage Regulator (S12VREG3V3V5)
17.2.4 VDDPLL, VSSPLL — Regulator Output2 (PLL) Pins
Signals V
/V
are the secondary outputs of VREG_3V3 that provide the power supply for the
DDPLL SSPLL
PLL and oscillator. These signals are connected to device pins to allow external decoupling capacitors
(100 nF...220 nF, X7R ceramic).
In Shutdown Mode, an external supply driving V
/V
can replace the voltage regulator.
DDPLL SSPLL
17.2.5 V
Optional Regulator Enable Pin
REGEN —
This optional signal is used to shutdown VREG_3V3. In that case, V /V and V
/V must be
DDPLL SSPLL
DD SS
provided externally. Shutdown mode is entered with VREGEN being low. If VREGEN is high, the
VREG_3V3 is either in Full Performance Mode or in Reduced Power Mode.
For the connectivity of VREGEN, see device specification.
NOTE
Switching from FPM or RPM to shutdown of VREG_3V3 and vice versa
is not supported while MCU is powered.
17.3 Memory Map and Register Definition
This section provides a detailed description of all registers accessible in VREG_3V3.
If enabled in the system, the VREG_3V3 will abort all read and write accesses to reserved registers within
it’s memory slice.
17.3.1 Module Memory Map
Table 17-2 provides an overview of all used registers.
Table 17-2. Memory Map
Address
Offset
Use
Access
0x_00
0x_01
0x_02
0x_03
0x_04
0x_05
0x_06
0x_07
HT Control Register (VREGHTCL)
Control Register (VREGCTRL)
—
R/W
R/W
R/W
R/W
R/W
—
Autonomous Periodical Interrupt Control Register (VREGAPICL)
Autonomous Periodical Interrupt Trimming Register (VREGAPITR)
Autonomous Periodical Interrupt Period High (VREGAPIRH)
Autonomous Periodical Interrupt Period Low (VREGAPIRL)
Reserved 06
Reserved 07
—
MC9S12XDP512 Data Sheet, Rev. 2.11
738
Freescale Semiconductor
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Chapter 17 Voltage Regulator (S12VREG3V3V5)
17.3.2 Register Descriptions
This section describes all the VREG_3V3 registers and their individual bits.
17.3.2.1 HT Control Register (VREGHTCL)
The VREGHTCL is reserved for test purposes. This register should not be written.
Module Base + 0x_00
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 17-2. HT Control Register (VREGHTCL)
17.3.2.2 Control Register (VREGCTRL)
The VREGCTRL register allows the configuration of the VREG_3V3 low-voltage detect features.
Module Base + 0x_01
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
LVDS
LVIE
LVIF
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 17-3. Control Register (VREGCTRL)
Table 17-3. VREGCTRL Field Descriptions
Description
Field
2
Low-Voltage Detect Status Bit — This read-only status bit reflects the input voltage. Writes have no effect.
LVDS
0 Input voltage V
1 Input voltage V
is above level V
is below level V
or RPM or shutdown mode.
and FPM.
DDA
DDA
LVID
LVIA
1
Low-Voltage Interrupt Enable Bit
LVIE
0 Interrupt request is disabled.
1 Interrupt will be requested whenever LVIF is set.
0
LVIF
Low-Voltage Interrupt Flag — LVIF is set to 1 when LVDS status bit changes. This flag can only be cleared by
writing a 1. Writing a 0 has no effect. If enabled (LVIE = 1), LVIF causes an interrupt request.
0 No change in LVDS bit.
1 LVDS bit has changed.
Note: On entering the Reduced Power Mode the LVIF is not cleared by the VREG_3V3.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
739
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Chapter 17 Voltage Regulator (S12VREG3V3V5)
17.3.2.3 Autonomous Periodical Interrupt Control Register (VREGAPICL)
The VREGAPICL register allows the configuration of the VREG_3V3 autonomous periodical interrupt
features.
Module Base + 0x_02
7
6
5
4
3
2
1
0
R
W
0
0
0
0
APICLK
APIFE
APIE
APIF
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 17-4. Autonomous Periodical Interrupt Control Register (VREGAPICL)
Table 17-4. VREGAPICL Field Descriptions
Description
Field
7
Autonomous Periodical Interrupt Clock Select Bit — Selects the clock source for the API. Writable only if
APIFE = 0; APICLK cannot be changed if APIFE is set by the same write operation.
0 Autonomous periodical interrupt clock used as source.
APICLK
1 Bus clock used as source.
2
Autonomous Periodical Interrupt Feature Enable Bit — Enables the API feature and starts the API timer
when set.
APIFE
0 Autonomous periodical interrupt is disabled.
1 Autonomous periodical interrupt is enabled and timer starts running.
1
Autonomous Periodical Interrupt Enable Bit
0 API interrupt request is disabled.
APIE
1 API interrupt will be requested whenever APIF is set.
0
APIF
Autonomous Periodical Interrupt Flag — APIF is set to 1 when the in the API configured time has elapsed.
This flag can only be cleared by writing a 1 to it. Clearing of the flag has precedence over setting.
Writing a 0 has no effect. If enabled (APIE = 1), APIF causes an interrupt request.
0 API timeout has not yet occurred.
1 API timeout has occurred.
MC9S12XDP512 Data Sheet, Rev. 2.11
740
Freescale Semiconductor
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Chapter 17 Voltage Regulator (S12VREG3V3V5)
17.3.2.4 Autonomous Periodical Interrupt Trimming Register (VREGAPITR)
The VREGAPITR register allows to trim the API timeout period.
Module Base + 0x_03
7
6
5
4
3
2
1
0
R
W
0
0
APITR5
APITR4
APITR3
APITR2
APITR1
APITR0
1
1
1
1
1
1
Reset
0
0
0
0
0
0
0
0
1. Reset value is either 0 or preset by factory. See Device User Guide for details.
= Unimplemented or Reserved
Figure 17-5. Autonomous Periodical Interrupt Trimming Register (VREGAPITR)
Table 17-5. VREGAPITR Field Descriptions
Field
Description
7–2
Autonomous Periodical Interrupt Period Trimming Bits — See Table 17-6 for trimming effects.
APITR[5:0]
Table 17-6. Trimming Effect of APIT
Bit
Trimming Effect
APITR[5]
APITR[4]
APITR[3]
APITR[2]
APITR[1]
APITR[0]
Increases period
Decreases period less than APITR[5] increased it
Decreases period less than APITR[4]
Decreases period less than APITR[3]
Decreases period less than APITR[2]
Decreases period less than APITR[1]
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
741
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Chapter 17 Voltage Regulator (S12VREG3V3V5)
17.3.2.5 Autonomous Periodical Interrupt Rate High and Low Register
(VREGAPIRH / VREGAPIRL)
The VREGAPIRH and VREGAPIRL register allows the configuration of the VREG_3V3 autonomous
periodical interrupt rate.
Module Base + 0x_04
7
6
5
4
3
2
1
0
R
W
0
0
0
0
APIR11
APIR10
APIR9
APIR8
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 17-6. Autonomous Periodical Interrupt Rate High Register (VREGAPIRH)
Module Base + 0x_05
7
6
5
4
3
2
1
0
R
APIR7
W
APIR6
APIR5
APIR4
APIR3
APIR2
APIR1
APIR0
Reset
0
0
0
0
0
0
0
0
Figure 17-7. Autonomous Periodical Interrupt Rate Low Register (VREGAPIRL)
Table 17-7. VREGAPIRH / VREGAPIRL Field Descriptions
Description
Field
11-0
Autonomous Periodical Interrupt Rate Bits — These bits define the timeout period of the API. See Table 17-8
APIR[11:0] for details of the effect of the autonomous periodical interrupt rate bits. Writable only if APIFE = 0 of VREGAPICL
register.
MC9S12XDP512 Data Sheet, Rev. 2.11
742
Freescale Semiconductor
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Chapter 17 Voltage Regulator (S12VREG3V3V5)
Table 17-8. Selectable Autonomous Periodical Interrupt Periods
APICLK
APIR[11:0]
Selected Period
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
000
001
002
003
004
005
.....
0.2 ms
0.4 ms
0.6 ms
0.8 ms
1.0 ms
1.2 ms
.....
1
FFD
FFE
FFF
000
001
002
003
004
005
.....
818.8 ms
1
819 ms
1
819.2 ms
2 * bus clock period
4 * bus clock period
6 * bus clock period
8 * bus clock period
10 * bus clock period
12 * bus clock period
.....
FFD
FFE
FFF
8188 * bus clock period
8190 * bus clock period
8192 * bus clock period
1
When trimmed within specified accuracy. See electrical specifications for details.
You can calculate the selected period depending of APICLK as:
Period = 2*(APIR[11:0] + 1) * 0.1 ms or period = 2*(APIR[11:0] + 1) * bus clock period
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
743
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Chapter 17 Voltage Regulator (S12VREG3V3V5)
17.3.2.6 Reserved_06
The Reserved_06 is reserved for test purposes.
Module Base + 0x_06
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 17-8. Reserved_06
17.3.2.7 Reserved_07
The Reserved_07 is reserved for test purposes.
Module Base + 0x_07
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 17-9. Reserved_07
17.4 Functional Description
17.4.1 General
Module VREG_3V3 is a voltage regulator, as depicted in Figure 17-1. The regulator functional elements
are the regulator core (REG), a low-voltage detect module (LVD), a control block (CTRL), a power-on
reset module (POR), and a low-voltage reset module (LVR).
17.4.2 Regulator Core (REG)
Respectively its regulator core has two parallel, independent regulation loops (REG1 and REG2) that differ
only in the amount of current that can be delivered.
The regulator is a linear regulator with a bandgap reference when operated in Full Performance Mode. It
acts as a voltage clamp in Reduced Power Mode. All load currents flow from input V
to V or
DDR
SS
V
. The reference circuits are supplied by V
and V
.
SSPLL
DDA
SSA
17.4.2.1 Full Performance Mode
In Full Performance Mode, the output voltage is compared with a reference voltage by an operational
amplifier. The amplified input voltage difference drives the gate of an output transistor.
MC9S12XDP512 Data Sheet, Rev. 2.11
744
Freescale Semiconductor
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Chapter 17 Voltage Regulator (S12VREG3V3V5)
17.4.2.2 Reduced Power Mode
In Reduced Power Mode, the gate of the output transistor is connected directly to a reference voltage to
reduce power consumption.
17.4.3 Low-Voltage Detect (LVD)
Subblock LVD is responsible for generating the low-voltage interrupt (LVI). LVD monitors the input
voltage (V
–V ) and continuously updates the status flag LVDS. Interrupt flag LVIF is set whenever
DDA
SSA
status flag LVDS changes its value. The LVD is available in FPM and is inactive in Reduced Power Mode
or Shutdown Mode.
17.4.4 Power-On Reset (POR)
This functional block monitors V . If V is below V
, POR is asserted; if V exceeds V
,
DD
DD
PORD
DD
PORD
the POR is deasserted. POR asserted forces the MCU into Reset. POR Deasserted will trigger the power-on
sequence.
17.4.5 Low-Voltage Reset (LVR)
Block LVR monitors the primary output voltage V . If it drops below the assertion level (V
) signal,
LVRA
DD
LVR asserts; if V rises above the deassertion level (V
) signal, LVR deasserts. The LVR function
DD
LVRD
is available only in Full Performance Mode.
17.4.6 Regulator Control (CTRL)
This part contains the register block of VREG_3V3 and further digital functionality needed to control the
operating modes. CTRL also represents the interface to the digital core logic.
17.4.7 Autonomous Periodical Interrupt (API)
Subblock API can generate periodical interrupts independent of the clock source of the MCU. To enable
the timer, the bit APIFE needs to be set.
The API timer is either clocked by a trimmable internal RC oscillator or the bus clock. Timer operation
will freeze when MCU clock source is selected and bus clock is turned off. See CRG specification for
details. The clock source can be selected with bit APICLK. APICLK can only be written when APIFE is
not set.
The APIR[11:0] bits determine the interrupt period. APIR[11:0] can only be written when APIFE is
cleared. As soon as APIFE is set, the timer starts running for the period selected by APIR[11:0] bits. When
the configured time has elapsed, the flag APIF is set. An interrupt, indicated by flag APIF = 1, is triggered
if interrupt enable bit APIE = 1. The timer is started automatically again after it has set APIF.
The procedure to change APICLK or APIR[11:0] is first to clear APIFE, then write to APICLK or
APIR[11:0], and afterwards set APIFE.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
745
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Chapter 17 Voltage Regulator (S12VREG3V3V5)
The API Trimming bits APITR[5:0] must be set so the minimum period equals 0.2 ms if stable frequency
See Table 17-6 for the trimming effect of APITR.
NOTE
The first period after enabling the counter by APIFE might be reduced.
The API internal RC oscillator clock is not available if VREG_3V3 is in
Shutdown Mode.
17.4.8 Resets
This section describes how VREG_3V3 controls the reset of the MCU.The reset values of registers and
signals are provided in Section 17.3, “Memory Map and Register Definition”. Possible reset sources are
listed in Table 17-9.
Table 17-9. Reset Sources
Reset Source
Local Enable
Power-on reset
Always active
Low-voltage reset
Available only in Full Performance Mode
17.4.9 Description of Reset Operation
17.4.9.1 Power-On Reset (POR)
During chip power-up the digital core may not work if its supply voltage V is below the POR
DD
deassertion level (V
). Therefore, signal POR, which forces the other blocks of the device into reset,
PORD
is kept high until V exceeds V
. The MCU will run the start-up sequence after POR deassertion.
DD
PORD
The power-on reset is active in all operation modes of VREG_3V3.
For details on low-voltage reset, see Section 17.4.5, “Low-Voltage Reset (LVR)”.
17.4.10 Interrupts
The interrupt vectors requested by VREG_3V3 are listed in Table 17-10. Vector addresses and interrupt
priorities are defined at MCU level.
Table 17-10. Interrupt Vectors
Interrupt Source
Local Enable
Low-voltage interrupt (LVI)
LVIE = 1; available only in Full Performance
Mode
MC9S12XDP512 Data Sheet, Rev. 2.11
746
Freescale Semiconductor
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Chapter 17 Voltage Regulator (S12VREG3V3V5)
Table 17-10. Interrupt Vectors
Interrupt Source
Local Enable
APIE = 1
Autonomous periodical interrupt (API)
17.4.10.1 Low-Voltage Interrupt (LVI)
In FPM, VREG_3V3 monitors the input voltage V
. Whenever V
drops below level V
the
DDA
DDA
LVIA,
status bit LVDS is set to 1. On the other hand, LVDS is reset to 0 when V
rises above level V
. An
LVID
DDA
interrupt, indicated by flag LVIF = 1, is triggered by any change of the status bit LVDS if interrupt enable
bit LVIE = 1.
NOTE
On entering the Reduced Power Mode, the LVIF is not cleared by the
VREG_3V3.
17.4.10.2 Autonomous Periodical Interrupt (API)
As soon as the configured timeout period of the API has elapsed, the APIF bit is set. An interrupt, indicated
by flag APIF = 1, is triggered if interrupt enable bit APIE = 1.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
747
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Chapter 17 Voltage Regulator (S12VREG3V3V5)
MC9S12XDP512 Data Sheet, Rev. 2.11
748
Freescale Semiconductor
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Chapter 18
Periodic Interrupt Timer (S12PIT24B4CV1)
18.1 Introduction
The period interrupt timer (PIT) is an array of 24-bit timers that can be used to trigger peripheral modules
or raise periodic interrupts. Refer to Figure 18-1 for a simplified block diagram.
18.1.1 Features
The MC9S12XDP512 includes these features:
•
•
Four timers implemented as modulus down-counters with independent time-out periods.
24
Time-out periods selectable between 1 and 2 bus clock cycles. Time-out equals m*n bus clock
cycles with 1 <= m <= 256 and 1 <= n <= 65536.
•
•
•
•
Timers that can be enabled individually.
Four time-out interrupts.
Four time-out trigger output signals available to trigger peripheral modules.
Start of timer channels can be aligned to each other.
18.1.2 Modes of Operation
Refer to the SoC guide for a detailed explanation of the chip modes.
•
Run mode
This is the basic mode of operation.
Wait mode
•
PIT operation in wait mode is controlled by the PITSWAI bit located in the PITCFLMT register.
In wait mode, if the bus clock is globally enabled and if the PITSWAI bit is clear, the PIT operates
like in run mode. In wait mode, if the PITSWAI bit is set, the PIT module is stalled.
•
•
Stop mode
In full stop mode or pseudo stop mode, the PIT module is stalled.
Freeze mode
PIT operation in freeze mode is controlled by the PITFRZ bit located in the PITCFLMT register.
In freeze mode, if the PITFRZ bit is clear, the PIT operates like in run mode. In freeze mode, if the
PITFRZ bit is set, the PIT module is stalled.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
749
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Chapter 18 Periodic Interrupt Timer (S12PIT24B4CV1)
18.1.3 Block Diagram
Figure 18-1 shows a block diagram of the PIT.
Interrupt 0
Trigger 0
Micro Time
Base 0
Time-Out 0
Time-Out 1
Time-Out 2
Time-Out 3
16-Bit Timer 0
16-Bit Timer 1
16-Bit Timer 2
16-Bit Timer 3
Interface
Interface
Interface
Interface
8-Bit
Micro Timer 0
Bus Clock
Interrupt 1
Trigger 1
Micro
8-Bit
Interrupt 2
Trigger 2
Time
Micro Timer 1
Base 1
Interrupt 3
Trigger 3
Figure 18-1. MC9S12XDP512 Block Diagram
18.2 External Signal Description
The PIT module has no external pins.
MC9S12XDP512 Data Sheet, Rev. 2.11
750
Freescale Semiconductor
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Chapter 18 Periodic Interrupt Timer (S12PIT24B4CV1)
18.3 Memory Map and Register Definition
This section provides a detailed description of address space and registers used by the PIT.
18.3.1 Module Memory Map
The memory map for the MC9S12XDP512 is given below in Table 1-1. The address listed for each register
is the sum of a base address and an address offset. The base address is defined at the SoC level and the
address offset is defined at the module level. Reads from the reserved bits return zeros and writes to the
reserved bits have no effect.
Table 18-1. MC9S12XDP512 Memory Map
Address
Offset
Use
Access
1
0x0000
0x0001
PIT Control and Force Load Micro Timer Register (PITCFLMT)
PIT Force Load Timer Register (PITFLT)
PIT Channel Enable Register (PITCE)
PIT Multiplex Register (PITMUX)
R/W
1,2
R/W
1
0x0002
R/W
1
0x0003
R/W
1
0x0004
PIT Interrupt Enable Register (PITINTE)
PIT Time-Out Flag Register (PITTF)
PIT Micro Timer Load Register 0 (PITMTLD0)
PIT Micro Timer Load Register 1 (PITMTLD1)
PIT Load Register 0 (PITLD0)
R/W
1
0x0005
R/W
0x0006
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0x0007
0x0008, 0x0009
0x000A, 0x000B
0x000C, 0x000D
0x000E, 0x000F
0x0010, 0x0011
0x0012, 0x0013
0x0014, 0x0015
0x0016, 0x0017
0x0018 - 0x0027
PIT Count Register 0 (PITCNT0)
PIT Load Register 1 (PITLD1)
PIT Count Register 1 (PITCNT1)
PIT Load Register 2 (PITLD2)
PIT Count Register 2 (PITCNT2)
PIT Load Register 3 (PITLD3)
PIT Count Register 3 (PITCNT3)
3
Reserved Registers
1
2
3
Certain bits are non-writable.
Reading from this register returns all zeros.
Reading from these registers returns all zeros. Writing to these registers has no effect.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
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Chapter 18 Periodic Interrupt Timer (S12PIT24B4CV1)
18.3.2 Register Descriptions
This section consists of register descriptions in address order. Each description includes a standard register
diagram with an associated figure number. Details of register bit and field function follow the register
diagrams, in bit order.
Register
Name
Bit 7
PITE
0
6
PITSWAI
0
5
PITFRZ
0
4
3
2
1
Bit 0
0x0000
PITCFLMT
R
0
0
0
0
0
W
PFLMT1
PFLMT0
0x0001
PITFLT
R
0
0
0
0
0
0
0
0
0
W
PFLT3
PFLT2
PFLT1
PFLT0
0x0002
PITCE
R
0
0
0
0
0
0
0
0
0
0
0
0
PCE3
PMUX3
PINTE3
PTF3
PCE2
PMUX2
PINTE2
PTF2
PCE1
PMUX1
PINTE1
PTF1
PCE0
PMUX0
PINTE0
PTF0
W
0x0003
PITMUX
R
W
0x0004
PITINTE
R
W
0x0005
PITTF
R
W
0x0006
PITMTLD0
R
PMTLD7
PMTLD7
PLD15
PMTLD6
PMTLD6
PLD14
PMTLD5
PMTLD5
PLD13
PMTLD4
PMTLD4
PLD12
PMTLD3
PMTLD3
PLD11
PLD3
PMTLD2
PMTLD2
PLD10
PLD2
PMTLD1
PMTLD1
PLD9
PMTLD0
PMTLD0
PLD8
W
0x0007
PITMTLD1
R
W
0x0008
PITLD0 (High)
R
W
0x0009
PITLD0 (Low)
R
PLD7
PLD6
PLD5
PLD4
PLD1
PLD0
W
0x000A
PITCNT0 (High)
R
PCNT15
PCNT7
PLD15
PCNT14
PCNT6
PLD14
PCNT13
PCNT5
PLD13
PCNT12
PCNT4
PLD12
PCNT11
PCNT3
PLD11
PCNT10
PCNT2
PLD10
PCNT9
PCNT1
PLD9
PCNT8
PCNT0
PLD8
W
0x000B
PITCNT0 (Low)
R
W
0x000C
PITLD1 (High)
R
W
= Unimplemented or Reserved
Figure 18-2. PIT Register Summary (Sheet 1 of 2)
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 18 Periodic Interrupt Timer (S12PIT24B4CV1)
Register
Name
Bit 7
6
5
4
3
2
1
Bit 0
0x000D
PITLD1 (Low)
R
PLD7
PLD6
PLD5
PLD4
PLD3
PLD2
PLD1
PLD0
W
0x000E
PITCNT1 (High)
R
PCNT15
PCNT7
PLD15
PLD7
PCNT14
PCNT6
PLD14
PLD6
PCNT13
PCNT5
PLD13
PLD5
PCNT12
PCNT4
PLD12
PLD4
PCNT11
PCNT3
PLD11
PLD3
PCNT10
PCNT2
PLD10
PLD2
PCNT9
PCNT1
PLD9
PCNT8
PCNT0
PLD8
W
0x000F
PITCNT1 (Low)
R
W
0x0010
PITLD2 (High)
R
W
0x0011
PITLD2 (Low)
R
PLD1
PLD0
W
0x0012
PITCNT2 (High)
R
PCNT15
PCNT7
PLD15
PLD7
PCNT14
PCNT6
PLD14
PLD6
PCNT13
PCNT5
PLD13
PLD5
PCNT12
PCNT4
PLD12
PLD4
PCNT11
PCNT3
PLD11
PLD3
PCNT10
PCNT2
PLD10
PLD2
PCNT9
PCNT1
PLD9
PCNT8
PCNT0
PLD8
W
0x0013
PITCNT2 (Low)
R
W
0x0014
PITLD3 (High)
R
W
0x0015
PITLD3 (Low)
R
PLD1
PLD0
W
0x0016
PITCNT3 (High)
R
PCNT15
PCNT7
PCNT14
PCNT6
PCNT13
PCNT5
PCNT12
PCNT4
PCNT11
PCNT3
PCNT10
PCNT2
PCNT9
PCNT1
PCNT8
PCNT0
W
0x0017
PITCNT3 (Low)
R
W
= Unimplemented or Reserved
Figure 18-2. PIT Register Summary (Sheet 2 of 2)
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
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Chapter 18 Periodic Interrupt Timer (S12PIT24B4CV1)
18.3.2.1 PIT Control and Force Load Micro Timer Register (PITCFLMT)
Module Base + 0x0000
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
PITE
PITSWAI
PITFRZ
PFLMT1
0
PFLMT0
0
Reset
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 18-3. PIT Control and Force Load Micro Timer Register (PITCFLMT)
Read: Anytime
Write: Anytime; writes to the reserved bits have no effect
Table 18-2. PITCFLMT Field Descriptions
Field
Description
7
PITE
PIT Module Enable Bit — This bit enables the PIT module. If PITE is cleared, the PIT module is disabled and
flag bits in the PITTF register are cleared. When PITE is set, individually enabled timers (PCE set) start
down-counting with the corresponding load register values.
0 PIT disabled (lower power consumption).
1 PIT is enabled.
6
PIT Stop in Wait Mode Bit — This bit is used for power conservation while in wait mode.
0 PIT operates normally in wait mode
PITSWAI
1 PIT clock generation stops and freezes the PIT module when in wait mode
5
PIT Counter Freeze while in Freeze Mode Bit — When during debugging a breakpoint (freeze mode) is
encountered it is useful in many cases to freeze the PIT counters to avoid e.g. interrupt generation. The PITFRZ
bit controls the PIT operation while in freeze mode.
PITFRZ
0 PIT operates normally in freeze mode
1 PIT counters are stalled when in freeze mode
1:0
PIT Force Load Bits for Micro Timer 1:0 — These bits have only an effect if the corresponding micro timer is
PFLMT[1:0] active and if the PIT module is enabled (PITE set). Writing a one into a PFLMT bit loads the corresponding 8-bit
micro timer load register into the 8-bit micro timer down-counter. Writing a zero has no effect. Reading these bits
will always return zero.
Note: A micro timer force load affects all timer channels that use the corresponding micro time base.
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 18 Periodic Interrupt Timer (S12PIT24B4CV1)
18.3.2.2 PIT Force Load Timer Register (PITFLT)
Module Base + 0x0001
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
PFLT3
0
PFLT2
0
PFLT1
0
PFLT0
0
Reset
0
0
0
0
= Unimplemented or Reserved
Figure 18-4. PIT Force Load Timer Register (PITFLT)
Read: Anytime
Write: Anytime; writes to the reserved bits have no effect
Table 18-3. PITFLT Field Descriptions
Field
Description
PIT Force Load Bits for Timer 3-0 — These bits have only an effect if the corresponding timer channel (PCE
3:0
PFLT[3:0] set) is enabled and if the PIT module is enabled (PITE set). Writing a one into a PFLT bit loads the corresponding
16-bit timer load register into the 16-bit timer down-counter. Writing a zero has no effect. Reading these bits will
always return zero.
18.3.2.3 PIT Channel Enable Register (PITCE)
Module Base + 0x0002
7
6
5
4
3
2
1
0
R
W
0
0
0
0
PCE3
PCE2
PCE1
PCE0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 18-5. PIT Channel Enable Register (PITCE)
Read: Anytime
Write: Anytime; writes to the reserved bits have no effect
Table 18-4. PITCE Field Descriptions
Field
Description
3:0
PCE[3:0]
PIT Enable Bits for Timer Channel 3:0 — These bits enable the PIT channels 3-0. If PCE is cleared, the PIT
channel is disabled and the corresponding flag bit in the PITTF register is cleared. When PCE is set, and if the
PIT module is enabled (PITE = 1) the 16-bit timer counter is loaded with the start count value and starts
down-counting.
0 The corresponding PIT channel is disabled.
1 The corresponding PIT channel is enabled.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
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Chapter 18 Periodic Interrupt Timer (S12PIT24B4CV1)
18.3.2.4 PIT Multiplex Register (PITMUX)
Module Base + 0x0003
7
6
5
4
3
2
1
0
R
W
0
0
0
0
PMUX3
PMUX2
PMUX1
PMUX0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 18-6. PIT Multiplex Register (PITMUX)
Read: Anytime
Write: Anytime; writes to the reserved bits have no effect
Table 18-5. PITMUX Field Descriptions
Field
Description
PIT Multiplex Bits for Timer Channel 3:0 — These bits select if the corresponding 16-bit timer is connected to
3:0
PMUX[3:0] micro time base 1 or 0. If PMUX is modified, the corresponding 16-bit timer is immediately switched to the other
micro time base.
0 The corresponding 16-bit timer counts with micro time base 0.
1 The corresponding 16-bit timer counts with micro time base 1.
18.3.2.5 PIT Interrupt Enable Register (PITINTE)
Module Base + 0x0004
7
6
5
4
3
2
1
0
R
W
0
0
0
0
PINTE3
PINTE2
PINTE1
PINTE0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 18-7. PIT Interrupt Enable Register (PITINTE)
Read: Anytime
Write: Anytime; writes to the reserved bits have no effect
Table 18-6. PITINTE Field Descriptions
Field
Description
PIT Time-out Interrupt Enable Bits for Timer Channel 3:0 — These bits enable an interrupt service request
3:0
PINTE[3:0] whenever the time-out flag PTF of the corresponding PIT channel is set. When an interrupt is pending (PTF set)
enabling the interrupt will immediately cause an interrupt. To avoid this, the corresponding PTF flag has to be
cleared first.
0 Interrupt of the corresponding PIT channel is disabled.
1 Interrupt of the corresponding PIT channel is enabled.
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 18 Periodic Interrupt Timer (S12PIT24B4CV1)
18.3.2.6 PIT Time-Out Flag Register (PITTF)
Module Base + 0x0005
7
6
5
4
3
2
1
0
R
W
0
0
0
0
PTF3
PTF2
PTF1
PTF0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 18-8. PIT Time-Out Flag Register (PITTF)
Read: Anytime
Write: Anytime (write to clear); writes to the reserved bits have no effect
Table 18-7. PITTF Field Descriptions
Field
Description
3:0
PTF[3:0]
PIT Time-out Flag Bits for Timer Channel 3:0 — PTF is set when the corresponding 16-bit timer modulus
down-counter and the selected 8-bit micro timer modulus down-counter have counted to zero. The flag can be
cleared by writing a one to the flag bit. Writing a zero has no effect. If flag clearing by writing a one and flag setting
happen in the same bus clock cycle, the flag remains set. The flag bits are cleared if the PIT module is disabled
or if the corresponding timer channel is disabled.
0 Time-out of the corresponding PIT channel has not yet occurred.
1 Time-out of the corresponding PIT channel has occurred.
18.3.2.7 PIT Micro Timer Load Register 0 to 1 (PITMTLD0–1)
Module Base + 0x0006
7
6
5
4
3
2
1
0
R
W
PMTLD7
PMTLD6
PMTLD5
PMTLD4
PMTLD3
PMTLD2
PMTLD1
PMTLD0
Reset
0
0
0
0
0
0
0
0
Figure 18-9. PIT Micro Timer Load Register 0 (PITMTLD0)
Module Base + 0x0007
7
6
5
4
3
2
1
0
R
PMTLD7
W
PMTLD6
PMTLD5
PMTLD4
PMTLD3
PMTLD2
PMTLD1
PMTLD0
Reset
0
0
0
0
0
0
0
0
Figure 18-10. PIT Micro Timer Load Register 1 (PITMTLD1)
Read: Anytime
Write: Anytime
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
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Chapter 18 Periodic Interrupt Timer (S12PIT24B4CV1)
Table 18-8. PITMTLD0–1 Field Descriptions
Field
Description
7:0
PIT Micro Timer Load Bits 7:0 — These bits set the 8-bit modulus down-counter load value of the micro timers.
PMTLD[7:0] Writing a new value into the PITMTLD register will not restart the timer. When the micro timer has counted down
to zero, the PMTLD register value will be loaded. The PFLMT bits in the PITCFLMT register can be used to
immediately update the count register with the new value if an immediate load is desired.
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 18 Periodic Interrupt Timer (S12PIT24B4CV1)
18.3.2.8 PIT Load Register 0 to 3 (PITLD0–3)
Module Base + 0x0008, 0x0009
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
R
W
PLD15 PLD14 PLD13 PLD12 PLD11 PLD10 PLD9 PLD8 PLD7 PLD6 PLD5 PLD4 PLD3 PLD2 PLD1 PLD0
Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Figure 18-11. PIT Load Register 0 (PITLD0)
Module Base + 0x000C, 0x000D
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
R
W
PLD15 PLD14 PLD13 PLD12 PLD11 PLD10 PLD9 PLD8 PLD7 PLD6 PLD5 PLD4 PLD3 PLD2 PLD1 PLD0
Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Figure 18-12. PIT Load Register 1 (PITLD1)
Module Base + 0x0010, 0x0011
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
R
W
PLD15 PLD14 PLD13 PLD12 PLD11 PLD10 PLD9 PLD8 PLD7 PLD6 PLD5 PLD4 PLD3 PLD2 PLD1 PLD0
Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Figure 18-13. PIT Load Register 2 (PITLD2)
Module Base + 0x0014, 0x0015
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
R
W
PLD15 PLD14 PLD13 PLD12 PLD11 PLD10 PLD9 PLD8 PLD7 PLD6 PLD5 PLD4 PLD3 PLD2 PLD1 PLD0
Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Figure 18-14. PIT Load Register 3 (PITLD3)
Read: Anytime
Write: Anytime
Table 18-9. PITLD0–3 Field Descriptions
Description
Field
15:0
PIT Load Bits 15:0 — These bits set the 16-bit modulus down-counter load value. Writing a new value into the
PLD[15:0] PITLD register must be a 16-bit access, to ensure data consistency. It will not restart the timer. When the timer
has counted down to zero the PTF time-out flag will be set and the register value will be loaded. The PFLT bits
in the PITFLT register can be used to immediately update the count register with the new value if an immediate
load is desired.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
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Chapter 18 Periodic Interrupt Timer (S12PIT24B4CV1)
18.3.2.9 PIT Count Register 0 to 3 (PITCNT0–3)
Module Base + 0x000A, 0x000B
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
R
W
PCNT PCNT PCNT PCNT PCNT PCNT PCNT PCNT PCNT PCNT PCNT PCNT PCNT PCNT PCNT PCNT
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Figure 18-15. PIT Count Register 0 (PITCNT0)
Module Base + 0x000E, 0x000F
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
R
W
PCNT PCNT PCNT PCNT PCNT PCNT PCNT PCNT PCNT PCNT PCNT PCNT PCNT PCNT PCNT PCNT
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Figure 18-16. PIT Count Register 1 (PITCNT1)
Module Base + 0x0012, 0x0013
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
R
W
PCNT PCNT PCNT PCNT PCNT PCNT PCNT PCNT PCNT PCNT PCNT PCNT PCNT PCNT PCNT PCNT
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Figure 18-17. PIT Count Register 2 (PITCNT2)
Module Base + 0x0016, 0x0017
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
R
W
PCNT PCNT PCNT PCNT PCNT PCNT PCNT PCNT PCNT PCNT PCNT PCNT PCNT PCNT PCNT PCNT
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Figure 18-18. PIT Count Register 3 (PITCNT3)
Read: Anytime
Write: Has no meaning or effect
Table 18-10. PITCNT0–3 Field Descriptions
Field
Description
15:0
PIT Count Bits 15-0 — These bits represent the current 16-bit modulus down-counter value. The read access
PCNT[15:0] for the count register must take place in one clock cycle as a 16-bit access.
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 18 Periodic Interrupt Timer (S12PIT24B4CV1)
18.4 Functional Description
Figure 18-19 shows a detailed block diagram of the PIT module. The main parts of the PIT are status,
control and data registers, two 8-bit down-counters, four 16-bit down-counters and an interrupt/trigger
interface.
PIT_24B4C
4
PFLT0
PMUX0
PITFLT Register
PITMUX Register
Timer 0
PITLD0 Register
PITCNT0 Register
4
time-out 0
PFLT1
PITMLD0 Register
8-Bit Micro Timer 0
Timer 1
Bus
[1]
Interrupt /
time-
out 1
4
PITLD1 Register
Clock
Trigger Interface
[0]
PITCNT1 Register
Hardware
Trigger
PFLT2
[2]
PITTF Register
Timer 2
PITMLD1 Register
8-Bit Micro Timer 1
4
time-
out 2
PITLD2 Register
[1]
PITCNT2 Register
Interrupt
Request
PITINTE Register
PITCFLMT Register
PFLT3
PFLMT
Timer 3
PITLD3 Register
PMUX3
PITCNT3 Register
Time-Out 3
Figure 18-19. MC9S12XDP512 Detailed Block Diagram
18.4.1 Timer
As shown in Figure 18-1and Figure 18-19, the 24-bit timers are built in a two-stage architecture with four
16-bit modulus down-counters and two 8-bit modulus down-counters. The 16-bit timers are clocked with
two selectable micro time bases which are generated with 8-bit modulus down-counters. Each 16-bit timer
is connected to micro time base 0 or 1 via the PMUX[3:0] bit setting in the PIT Multiplex (PITMUX)
register.
A timer channel is enabled if the module enable bit PITE in the PIT control and force load micro timer
(PITCFLMT) register is set and if the corresponding PCE bit in the PIT channel enable (PITCE) register
is set. Two 8-bit modulus down-counters are used to generate two micro time bases. As soon as a micro
time base is selected for an enabled timer channel, the corresponding micro timer modulus down-counter
will load its start value as specified in the PITMTLD0 or PITMTLD1 register and will start down-counting.
Whenever the micro timer down-counter has counted to zero the PITMTLD register is reloaded and the
connected 16-bit modulus down-counters count one cycle.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
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Chapter 18 Periodic Interrupt Timer (S12PIT24B4CV1)
Whenever a 16-bit timer counter and the connected 8-bit micro timer counter have counted to zero, the
PITLD register is reloaded and the corresponding time-out flag PTF in the PIT time-out flag (PITTF)
register is set, as shown in Figure 18-20. The time-out period is a function of the timer load (PITLD) and
micro timer load (PITMTLD) registers and the bus clock f
:
BUS
time-out period = (PITMTLD + 1) * (PITLD + 1) / f
.
BUS
For example, for a 40 MHz bus clock, the maximum time-out period equals:
256 * 65536 * 25 ns = 419.43 ms.
The current 16-bit modulus down-counter value can be read via the PITCNT register. The micro timer
down-counter values cannot be read.
The 8-bit micro timers can individually be restarted by writing a one to the corresponding force load micro
timer PFLMT bits in the PIT control and force load micro timer (PITCFLMT) register. The 16-bit timers
can individually be restarted by writing a one to the corresponding force load timer PFLT bits in the PIT
forceload timer (PITFLT) register. If desired, any group of timers and micro timers can be restarted at the
same time by using one 16-bit write to the adjacent PITCFLMT and PITFLT registers with the relevant
bits set, as shown in Figure 18-20.
Bus Clock
8-Bit Micro
1
1
1
2
2
0
2
0
1
1
1
1
2
0
0
2
0
2
0
2
0
2
Timer Counter
00
0001
0000
0001
0000
0001
0000
0001
PITCNT Register
8-Bit Force Load
16-Bit Force Load
1
PTF Flag
PITTRIG
Time-Out Period
After Restart
Time-Out Period
Note 1. The PTF flag clearing depends on the software
Figure 18-20. PIT Trigger and Flag Signal Timing
18.4.2 Interrupt Interface
Each time-out event can be used to trigger an interrupt service request. For each timer channel, an
individual bit PINTE in the PIT interrupt enable (PITINTE) register exists to enable this feature. If PINTE
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Chapter 18 Periodic Interrupt Timer (S12PIT24B4CV1)
is set, an interrupt service is requested whenever the corresponding time-out flag PTF in the PIT time-out
flag (PITTF) register is set. The flag can be cleared by writing a one to the flag bit.
NOTE
Be careful when resetting the PITE, PINTE or PITCE bits in case of pending
PIT interrupt requests, to avoid spurious interrupt requests.
18.4.3 Hardware Trigger
The PIT module contains four hardware trigger signal lines PITTRIG[3:0], one for each timer channel.
These signals can be connected on SoC level to peripheral modules enabling e.g. periodic ATD conversion
(please refer to the SoC Guide for the mapping of PITTRIG[3:0] signals to peripheral modules).
Whenever a timer channel time-out is reached, the corresponding PTF flag is set and the corresponding
trigger signal PITTRIG triggers a rising edge. The trigger feature requires a minimum time-out period of
two bus clock cycles because the trigger is asserted high for at least one bus clock cycle. For load register
values PITLD = 0x0001 and PITMTLD = 0x0002 the flag setting, trigger timing and a restart with force
load is shown in Figure 18-20.
18.5 Initialization/Application Information
18.5.1 Startup
Set the configuration registers before the PITE bit in the PITCFLMT register is set. Before PITE is set, the
configuration registers can be written in arbitrary order.
18.5.2 Shutdown
When the PITCE register bits, the PITINTE register bits or the PITE bit in the PITCFLMT register are
cleared, the corresponding PIT interrupt flags are cleared. In case of a pending PIT interrupt request, a
spurious interrupt can be generated. Two strategies, which avoid spurious interrupts, are recommended:
1. Reset the PIT interrupt flags only in an ISR. When entering the ISR, the I mask bit in the CCR is
set automatically. The I mask bit must not be cleared before the PIT interrupt flags are cleared.
2. After setting the I mask bit with the SEI instruction, the PIT interrupt flags can be cleared. Then
clear the I mask bit with the CLI instruction to re-enable interrupts.
18.5.3 Flag Clearing
A flag is cleared by writing a one to the flag bit. Always use store or move instructions to write a one in
certain bit positions. Do not use the BSET instructions. Do not use any C-constructs that compile to BSET
instructions. “BSET flag_register, #mask” must not be used for flag clearing because BSET is a
read-modify-write instruction which writes back the “bit-wise or” of the flag_register and the mask into
the flag_register. BSET would clear all flag bits that were set, independent from the mask.
For example, to clear flag bit 0 use: MOVB #$01,PITTF.
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 18 Periodic Interrupt Timer (S12PIT24B4CV1)
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Chapter 19
Background Debug Module (S12XBDMV2)
19.1 Introduction
This section describes the functionality of the background debug module (BDM) sub-block of the
HCS12X core platform.
The background debug module (BDM) sub-block is a single-wire, background debug system implemented
in on-chip hardware for minimal CPU intervention. All interfacing with the BDM is done via the BKGD
pin.
The BDM has enhanced capability for maintaining synchronization between the target and host while
allowing more flexibility in clock rates. This includes a sync signal to determine the communication rate
and a handshake signal to indicate when an operation is complete. The system is backwards compatible to
the BDM of the S12 family with the following exceptions:
•
•
•
•
•
•
•
TAGGO command no longer supported by BDM
External instruction tagging feature now part of DBG module
BDM register map and register content extended/modified
Global page access functionality
Enabled but not active out of reset in emulation modes
CLKSW bit set out of reset in emulation mode.
Family ID readable from firmware ROM at global address 0x7FFF0F (value for HCS12X devices
is 0xC1)
19.1.1 Features
The BDM includes these distinctive features:
•
•
•
•
•
•
•
•
•
Single-wire communication with host development system
Enhanced capability for allowing more flexibility in clock rates
SYNC command to determine communication rate
GO_UNTIL command
Hardware handshake protocol to increase the performance of the serial communication
Active out of reset in special single chip mode
Nine hardware commands using free cycles, if available, for minimal CPU intervention
Hardware commands not requiring active BDM
14 firmware commands execute from the standard BDM firmware lookup table
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Chapter 19 Background Debug Module (S12XBDMV2)
•
•
•
•
•
•
Software control of BDM operation during wait mode
Software selectable clocks
Global page access functionality
Enabled but not active out of reset in emulation modes
CLKSW bit set out of reset in emulation mode.
When secured, hardware commands are allowed to access the register space in special single chip
mode, if the Flash and EEPROM erase tests fail.
•
•
Family ID readable from firmware ROM at global address 0x7FFF0F (value for HCS12X devices
is 0xC1)
BDM hardware commands are operational until system stop mode is entered (all bus masters are
in stop mode)
19.1.2 Modes of Operation
BDM is available in all operating modes but must be enabled before firmware commands are executed.
Some systems may have a control bit that allows suspending the function during background debug mode.
19.1.2.1 Regular Run Modes
All of these operations refer to the part in run mode and not being secured. The BDM does not provide
controls to conserve power during run mode.
•
Normal modes
General operation of the BDM is available and operates the same in all normal modes.
Special single chip mode
•
In special single chip mode, background operation is enabled and active out of reset. This allows
programming a system with blank memory.
•
Emulation modes
In emulation mode, background operation is enabled but not active out of reset. This allows
debugging and programming a system in this mode more easily.
19.1.2.2 Secure Mode Operation
If the device is in secure mode, the operation of the BDM is reduced to a small subset of its regular run
mode operation. Secure operation prevents access to Flash or EEPROM other than allowing erasure. For
more information please see Section 19.4.1, “Security”.
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 19 Background Debug Module (S12XBDMV2)
19.1.2.3 Low-Power Modes
The BDM can be used until all bus masters (e.g., CPU or XGATE) are in stop mode. When CPU is in a
low power mode (wait or stop mode) all BDM firmware commands as well as the hardware
BACKGROUND command can not be used respectively are ignored. In this case the CPU can not enter
BDM active mode, and only hardware read and write commands are available. Also the CPU can not enter
a low power mode during BDM active mode.
If all bus masters are in stop mode, the BDM clocks are stopped as well. When BDM clocks are disabled
and one of the bus masters exits from stop mode the BDM clocks will restart and BDM will have a soft
reset (clearing the instruction register, any command in progress and disable the ACK function). The BDM
is now ready to receive a new command.
19.1.3 Block Diagram
A block diagram of the BDM is shown in Figure 19-1.
Host
Serial
Interface
Data
System
16-Bit Shift Register
BKGD
Control
Register Block
Address
Data
Bus Interface
and
Control Logic
TRACE
Instruction Code
and
Control
Clocks
BDMACT
Execution
ENBDM
SDV
Standard BDM Firmware
LOOKUP TABLE
Secured BDM Firmware
LOOKUP TABLE
UNSEC
CLKSW
BDMSTS
Register
Figure 19-1. BDM Block Diagram
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 19 Background Debug Module (S12XBDMV2)
19.2 External Signal Description
A single-wire interface pin called the background debug interface (BKGD) pin is used to communicate
with the BDM system. During reset, this pin is a mode select input which selects between normal and
special modes of operation. After reset, this pin becomes the dedicated serial interface pin for the
background debug mode.
19.3 Memory Map and Register Definition
19.3.1 Module Memory Map
Table 19-1 shows the BDM memory map when BDM is active.
Table 19-1. BDM Memory Map
Size
Global Address
Module
(Bytes)
0x7FFF00–0x7FFF0B
0x7FFF0C–0x7FFF0E
0x7FFF0F
BDM registers
BDM firmware ROM
12
3
Family ID (part of BDM firmware ROM)
BDM firmware ROM
1
0x7FFF10–0x7FFFFF
240
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Chapter 19 Background Debug Module (S12XBDMV2)
19.3.2 Register Descriptions
A summary of the registers associated with the BDM is shown in Figure 19-2. Registers are accessed by
host-driven communications to the BDM hardware using READ_BD and WRITE_BD commands.
Global
Address
Register
Name
Bit 7
6
5
4
3
2
1
Bit 0
0x7FFF00 Reserved
R
X
X
X
X
X
X
0
0
W
0x7FFF01
BDMSTS
R
BDMACT
0
X
X
X
X
SDV
X
TRACE
UNSEC
0
X
X
X
X
ENBDM
X
CLKSW
X
W
0x7FFF02 Reserved
0x7FFF03 Reserved
0x7FFF04 Reserved
0x7FFF05 Reserved
0x7FFF06 BDMCCRL
R
X
X
X
X
X
X
X
X
X
X
X
X
W
R
X
X
X
X
X
X
X
W
R
X
W
R
X
W
R
CCR7
0
CCR6
0
CCR5
0
CCR4
0
CCR3
0
CCR2
CCR1
CCR9
CCR0
CCR8
W
0x7FFF07 BDMCCRH R
W
CCR10
0x7FFF08 BDMGPR
0x7FFF09 Reserved
0x7FFF0A Reserved
0x7FFF0B Reserved
R
BGAE
0
BGP6
0
BGP5
0
BGP4
0
BGP3
0
BGP2
0
BGP1
0
BGP0
0
W
R
W
R
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
W
R
W
= Unimplemented, Reserved
= Indeterminate
= Implemented (do not alter)
= Always read zero
X
0
Figure 19-2. BDM Register Summary
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 19 Background Debug Module (S12XBDMV2)
19.3.2.1 BDM Status Register (BDMSTS)
Register Global Address 0x7FFF01
7
6
5
4
3
2
1
0
R
W
BDMACT
0
SDV
TRACE
UNSEC
0
ENBDM
CLKSW
Reset
1
3
Special Single-Chip Mode
Emulation Modes
All Other Modes
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
2
1
0
1
0
0
0
= Unimplemented, Reserved
= Implemented (do not alter)
0
= Always read zero
1
ENBDM is read as 1 by a debugging environment in special single chip mode when the device is not secured or secured but
fully erased (Flash and EEPROM). This is because the ENBDM bit is set by the standard firmware before a BDM command
can be fully transmitted and executed.
2
3
CLKSW is read as 1 by a debugging environment in emulation modes when the device is not secured and read as 0 when
secured.
UNSEC is read as 1 by a debugging environment in special single chip mode when the device is secured and fully erased,
else it is 0 and can only be read if not secure (see also bit description).
Figure 19-3. BDM Status Register (BDMSTS)
Read: All modes through BDM operation when not secured
Write: All modes through BDM operation when not secured, but subject to the following:
— ENBDM should only be set via a BDM hardware command if the BDM firmware commands
are needed. (This does not apply in special single chip and emulation modes).
— BDMACT can only be set by BDM hardware upon entry into BDM. It can only be cleared by
the standard BDM firmware lookup table upon exit from BDM active mode.
— CLKSW can only be written via BDM hardware WRITE_BD commands.
— All other bits, while writable via BDM hardware or standard BDM firmware write commands,
should only be altered by the BDM hardware or standard firmware lookup table as part of BDM
command execution.
Table 19-2. BDMSTS Field Descriptions
Field
Description
7
Enable BDM — This bit controls whether the BDM is enabled or disabled. When enabled, BDM can be made
active to allow firmware commands to be executed. When disabled, BDM cannot be made active but BDM
hardware commands are still allowed.
ENBDM
0 BDM disabled
1 BDM enabled
Note: ENBDM is set by the firmware out of reset in special single chip mode and by hardware in emulation
modes. In special single chip mode with the device secured, this bit will not be set by the firmware until
after the EEPROM and Flash erase verify tests are complete. In emulation modes with the device
secured, the BDM operations are blocked.
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Chapter 19 Background Debug Module (S12XBDMV2)
Table 19-2. BDMSTS Field Descriptions (continued)
Field
Description
6
BDM Active Status — This bit becomes set upon entering BDM. The standard BDM firmware lookup table is
BDMACT
then enabled and put into the memory map. BDMACT is cleared by a carefully timed store instruction in the
standard BDM firmware as part of the exit sequence to return to user code and remove the BDM memory from
the map.
0 BDM not active
1 BDM active
4
SDV
Shift Data Valid — This bit is set and cleared by the BDM hardware. It is set after data has been transmitted as
part of a firmware or hardware read command or after data has been received as part of a firmware or hardware
write command. It is cleared when the next BDM command has been received or BDM is exited. SDV is used
by the standard BDM firmware to control program flow execution.
0 Data phase of command not complete
1 Data phase of command is complete
3
TRACE1 BDM Firmware Command is Being Executed — This bit gets set when a BDM TRACE1 firmware
command is first recognized. It will stay set until BDM firmware is exited by one of the following BDM commands:
GO or GO_UNTIL.
TRACE
0 TRACE1 command is not being executed
1 TRACE1 command is being executed
2
Clock Switch — The CLKSW bit controls which clock the BDM operates with. It is only writable from a hardware
BDM command. A minimum delay of 150 cycles at the clock speed that is active during the data portion of the
command send to change the clock source should occur before the next command can be send. The delay
should be obtained no matter which bit is modified to effectively change the clock source (either PLLSEL bit or
CLKSW bit). This guarantees that the start of the next BDM command uses the new clock for timing subsequent
BDM communications.
CLKSW
Table 19-3 shows the resulting BDM clock source based on the CLKSW and the PLLSEL (PLL select in the CRG
module, the bit is part of the CLKSEL register) bits.
Note: The BDM alternate clock source can only be selected when CLKSW = 0 and PLLSEL = 1. The BDM serial
interface is now fully synchronized to the alternate clock source, when enabled. This eliminates frequency
restriction on the alternate clock which was required on previous versions. Refer to the device
specification to determine which clock connects to the alternate clock source input.
Note: If the acknowledge function is turned on, changing the CLKSW bit will cause the ACK to be at the new
rate for the write command which changes it.
Note: In emulation mode, the CLKSW bit will be set out of RESET.
1
Unsecure — If the device is secured this bit is only writable in special single chip mode from the BDM secure
firmware. It is in a zero state as secure mode is entered so that the secure BDM firmware lookup table is enabled
and put into the memory map overlapping the standard BDM firmware lookup table.
UNSEC
The secure BDM firmware lookup table verifies that the on-chip EEPROM and Flash EEPROM are erased. This
being the case, the UNSEC bit is set and the BDM program jumps to the start of the standard BDM firmware
lookup table and the secure BDM firmware lookup table is turned off. If the erase test fails, the UNSEC bit will
not be asserted.
0 System is in a secured mode.
1 System is in a unsecured mode.
Note: When UNSEC is set, security is off and the user can change the state of the secure bits in the on-chip
Flash EEPROM. Note that if the user does not change the state of the bits to “unsecured” mode, the
system will be secured again when it is next taken out of reset.After reset this bit has no meaning or effect
when the security byte in the Flash EEPROM is configured for unsecure mode.
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 19 Background Debug Module (S12XBDMV2)
Table 19-3. BDM Clock Sources
PLLSEL CLKSW
BDMCLK
0
0
1
1
0
1
0
1
Bus clock dependent on oscillator
Bus clock dependent on oscillator
Alternate clock (refer to the device specification to determine the alternate clock source)
Bus clock dependent on the PLL
19.3.2.2 BDM CCR LOW Holding Register (BDMCCRL)
Register Global Address 0x7FFF06
7
6
5
4
3
2
1
0
R
CCR7
CCR6
CCR5
CCR4
CCR3
CCR2
CCR1
CCR0
W
Reset
Special Single-Chip Mode
All Other Modes
1
0
1
0
0
0
0
0
1
0
0
0
0
0
0
0
Figure 19-4. BDM CCR LOW Holding Register (BDMCCRL)
Read: All modes through BDM operation when not secured
Write: All modes through BDM operation when not secured
NOTE
When BDM is made active, the CPU stores the content of its CCR register
L
in the BDMCCRL register. However, out of special single-chip reset, the
BDMCCRL is set to 0xD8 and not 0xD0 which is the reset value of the
CCR register in this CPU mode. Out of reset in all other modes the
L
BDMCCRL register is read zero.
When entering background debug mode, the BDM CCR LOW holding register is used to save the low byte
of the condition code register of the user’s program. It is also used for temporary storage in the standard
BDM firmware mode. The BDM CCR LOW holding register can be written to modify the CCR value.
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Chapter 19 Background Debug Module (S12XBDMV2)
19.3.2.3 BDM CCR HIGH Holding Register (BDMCCRH)
Register Global Address 0x7FFF07
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
CCR10
CCR9
CCR8
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 19-5. BDM CCR HIGH Holding Register (BDMCCRH)
Read: All modes through BDM operation when not secured
Write: All modes through BDM operation when not secured
When entering background debug mode, the BDM CCR HIGH holding register is used to save the high
byte of the condition code register of the user’s program. The BDM CCR HIGH holding register can be
written to modify the CCR value.
19.3.2.4 BDM Global Page Index Register (BDMGPR)
Register Global Address 0x7FFF08
7
BGAE
0
6
BGP6
0
5
BGP5
0
4
BGP4
0
3
BGP3
0
2
BGP2
0
1
BGP1
0
0
BGP0
0
R
W
Reset
Figure 19-6. BDM Global Page Register (BDMGPR)
Read: All modes through BDM operation when not secured
Write: All modes through BDM operation when not secured
Table 19-4. BDMGPR Field Descriptions
Field
Description
7
BDM Global Page Access Enable Bit — BGAE enables global page access for BDM hardware and firmware
read/write instructions The BDM hardware commands used to access the BDM registers (READ_BD_ and
WRITE_BD_) can not be used for global accesses even if the BGAE bit is set.
0 BDM Global Access disabled
BGAE
1 BDM Global Access enabled
6–0
BDM Global Page Index Bits 6–0 — These bits define the extended address bits from 22 to 16. For more
BGP[6:0]
detailed information regarding the global page window scheme, please refer to the S12X_MMC Block Guide.
19.3.3 Family ID Assignment
The family ID is a 8-bit value located in the firmware ROM (at global address: 0x7FFF0F). The read-only
value is a unique family ID which is 0xC1 for S12X devices.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
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Chapter 19 Background Debug Module (S12XBDMV2)
19.4 Functional Description
The BDM receives and executes commands from a host via a single wire serial interface. There are two
types of BDM commands: hardware and firmware commands.
Hardware commands are used to read and write target system memory locations and to enter active
background debug mode, see Section 19.4.3, “BDM Hardware Commands”. Target system memory
includes all memory that is accessible by the CPU.
Firmware commands are used to read and write CPU resources and to exit from active background debug
mode, see Section 19.4.4, “Standard BDM Firmware Commands”. The CPU resources referred to are the
accumulator (D), X index register (X), Y index register (Y), stack pointer (SP), and program counter (PC).
Hardware commands can be executed at any time and in any mode excluding a few exceptions as
highlighted (see Section 19.4.3, “BDM Hardware Commands”) and in secure mode (see Section 19.4.1,
“Security”). Firmware commands can only be executed when the system is not secure and is in active
background debug mode (BDM).
19.4.1 Security
If the user resets into special single chip mode with the system secured, a secured mode BDM firmware
lookup table is brought into the map overlapping a portion of the standard BDM firmware lookup table.
The secure BDM firmware verifies that the on-chip EEPROM and Flash EEPROM are erased. This being
the case, the UNSEC and ENBDM bit will get set. The BDM program jumps to the start of the standard
BDM firmware and the secured mode BDM firmware is turned off and all BDM commands are allowed.
If the EEPROM or Flash do not verify as erased, the BDM firmware sets the ENBDM bit, without asserting
UNSEC, and the firmware enters a loop. This causes the BDM hardware commands to become enabled,
but does not enable the firmware commands. This allows the BDM hardware to be used to erase the
EEPROM and Flash.
BDM operation is not possible in any other mode than special single chip mode when the device is secured.
The device can only be unsecured via BDM serial interface in special single chip mode. For more
information regarding security, please see the S12X_9SEC Block Guide.
19.4.2 Enabling and Activating BDM
The system must be in active BDM to execute standard BDM firmware commands. BDM can be activated
only after being enabled. BDM is enabled by setting the ENBDM bit in the BDM status (BDMSTS)
register. The ENBDM bit is set by writing to the BDM status (BDMSTS) register, via the single-wire
interface, using a hardware command such as WRITE_BD_BYTE.
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 19 Background Debug Module (S12XBDMV2)
1
After being enabled, BDM is activated by one of the following :
•
•
•
•
Hardware BACKGROUND command
CPU BGND instruction
2
External instruction tagging mechanism
2
Breakpoint force or tag mechanism
When BDM is activated, the CPU finishes executing the current instruction and then begins executing the
firmware in the standard BDM firmware lookup table. When BDM is activated by a breakpoint, the type
of breakpoint used determines if BDM becomes active before or after execution of the next instruction.
NOTE
If an attempt is made to activate BDM before being enabled, the CPU
resumes normal instruction execution after a brief delay. If BDM is not
enabled, any hardware BACKGROUND commands issued are ignored by
the BDM and the CPU is not delayed.
In active BDM, the BDM registers and standard BDM firmware lookup table are mapped to addresses
0x7FFF00 to 0x7FFFFF. BDM registers are mapped to addresses 0x7FFF00 to 0x7FFF0B. The BDM uses
these registers which are readable anytime by the BDM. However, these registers are not readable by user
programs.
19.4.3 BDM Hardware Commands
Hardware commands are used to read and write target system memory locations and to enter active
background debug mode. Target system memory includes all memory that is accessible by the CPU such
as on-chip RAM, EEPROM, Flash EEPROM, I/O and control registers, and all external memory.
Hardware commands are executed with minimal or no CPU intervention and do not require the system to
be in active BDM for execution, although, they can still be executed in this mode. When executing a
hardware command, the BDM sub-block waits for a free bus cycle so that the background access does not
disturb the running application program. If a free cycle is not found within 128 clock cycles, the CPU is
momentarily frozen so that the BDM can steal a cycle. When the BDM finds a free cycle, the operation
does not intrude on normal CPU operation provided that it can be completed in a single cycle. However,
if an operation requires multiple cycles the CPU is frozen until the operation is complete, even though the
BDM found a free cycle.
The BDM hardware commands are listed in Table 19-5.
The READ_BD and WRITE_BD commands allow access to the BDM register locations. These locations
are not normally in the system memory map but share addresses with the application in memory. To
distinguish between physical memory locations that share the same address, BDM memory resources are
enabled just for the READ_BD and WRITE_BD access cycle. This allows the BDM to access BDM
locations unobtrusively, even if the addresses conflict with the application memory map.
1. BDM is enabled and active immediately out of special single-chip reset.
2. This method is provided by the S12X_DBG module.
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 19 Background Debug Module (S12XBDMV2)
Table 19-5. Hardware Commands
Opcode
(hex)
Command
Data
Description
BACKGROUND
90
None
Enter background mode if firmware is enabled. If enabled, an ACK will be
issued when the part enters active background mode.
ACK_ENABLE
ACK_DISABLE
READ_BD_BYTE
D5
D6
E4
None
None
Enable Handshake. Issues an ACK pulse after the command is executed.
Disable Handshake. This command does not issue an ACK pulse.
16-bit address Read from memory with standard BDM firmware lookup table in map.
16-bit data out Odd address data on low byte; even address data on high byte.
READ_BD_WORD
READ_BYTE
EC
E0
E8
C4
CC
C0
C8
16-bit address Read from memory with standard BDM firmware lookup table in map.
16-bit data out Must be aligned access.
16-bit address Read from memory with standard BDM firmware lookup table out of map.
16-bit data out Odd address data on low byte; even address data on high byte.
READ_WORD
WRITE_BD_BYTE
WRITE_BD_WORD
WRITE_BYTE
WRITE_WORD
NOTE:
16-bit address Read from memory with standard BDM firmware lookup table out of map.
16-bit data out Must be aligned access.
16-bit address Write to memory with standard BDM firmware lookup table in map.
16-bit data in Odd address data on low byte; even address data on high byte.
16-bit address Write to memory with standard BDM firmware lookup table in map.
16-bit data in Must be aligned access.
16-bit address Write to memory with standard BDM firmware lookup table out of map.
16-bit data in Odd address data on low byte; even address data on high byte.
16-bit address Write to memory with standard BDM firmware lookup table out of map.
16-bit data in Must be aligned access.
If enabled, ACK will occur when data is ready for transmission for all BDM READ commands and will occur after the write is
complete for all BDM WRITE commands.
19.4.4 Standard BDM Firmware Commands
Firmware commands are used to access and manipulate CPU resources. The system must be in active
BDM to execute standard BDM firmware commands, see Section 19.4.2, “Enabling and Activating
BDM”. Normal instruction execution is suspended while the CPU executes the firmware located in the
standard BDM firmware lookup table. The hardware command BACKGROUND is the usual way to
activate BDM.
As the system enters active BDM, the standard BDM firmware lookup table and BDM registers become
visible in the on-chip memory map at 0x7FFF00–0x7FFFFF, and the CPU begins executing the standard
BDM firmware. The standard BDM firmware watches for serial commands and executes them as they are
received.
The firmware commands are shown in Table 19-6.
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Chapter 19 Background Debug Module (S12XBDMV2)
Table 19-6. Firmware Commands
Opcode
(hex)
1
Command
Data
Description
2
READ_NEXT
62
63
64
65
66
67
42
16-bit data out Increment X index register by 2 (X = X + 2), then read word X points to.
16-bit data out Read program counter.
READ_PC
READ_D
READ_X
READ_Y
16-bit data out Read D accumulator.
16-bit data out Read X index register.
16-bit data out Read Y index register.
16-bit data out Read stack pointer.
vetica><st-superscri
pt>
16-bit data in Increment X index register by 2 (X = X + 2), then write word to location
pointed to by X.
WRITE_PC
WRITE_D
WRITE_X
WRITE_Y
WRITE_SP
GO
43
44
45
46
47
08
16-bit data in Write program counter.
16-bit data in Write D accumulator.
16-bit data in Write X index register.
16-bit data in Write Y index register.
16-bit data in Write stack pointer.
none
none
none
none
Go to user program. If enabled, ACK will occur when leaving active
background mode.
3
GO_UNTIL
0C
10
18
Go to user program. If enabled, ACK will occur upon returning to active
background mode.
TRACE1
Execute one user instruction then return to active BDM. If enabled,
ACK will occur upon returning to active background mode.
TAGGO -> GO
(Previous enable tagging and go to user program.)
This command will be deprecated and should not be used anymore.
Opcode will be executed as a GO command.
1
2
3
If enabled, ACK will occur when data is ready for transmission for all BDM READ commands and will occur after the write is
complete for all BDM WRITE commands.
When the firmware command READ_NEXT or WRITE_NEXT is used to access the BDM address space the BDM resources
are accessed rather than user code. Writing BDM firmware is not possible.
System stop disables the ACK function and ignored commands will not have an ACK-pulse (e.g., CPU in stop or wait mode).
The GO_UNTIL command will not get an Acknowledge if CPU executes the wait or stop instruction before the “UNTIL”
condition (BDM active again) is reached (see Section 19.4.7, “Serial Interface Hardware Handshake Protocol” last Note).
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Chapter 19 Background Debug Module (S12XBDMV2)
19.4.5 BDM Command Structure
Hardware and firmware BDM commands start with an 8-bit opcode followed by a 16-bit address and/or a
16-bit data word depending on the command. All the read commands return 16 bits of data despite the byte
or word implication in the command name.
8-bit reads return 16-bits of data, of which, only one byte will contain valid
data. If reading an even address, the valid data will appear in the MSB. If
reading an odd address, the valid data will appear in the LSB.
16-bit misaligned reads and writes are generally not allowed. If attempted
by BDM hardware command, the BDM will ignore the least significant bit
of the address and will assume an even address from the remaining bits.
The following cycle count information is only valid when the external wait
function is not used (see wait bit of EBI sub-block). During an external wait
the BDM can not steal a cycle. Hence be careful with the external wait
function if the BDM serial interface is much faster than the bus, because of
the BDM soft-reset after time-out (see Section 19.4.11, “Serial
Communication Time Out”).
For hardware data read commands, the external host must wait at least 150 bus clock cycles after sending
the address before attempting to obtain the read data. This is to be certain that valid data is available in the
BDM shift register, ready to be shifted out. For hardware write commands, the external host must wait
150 bus clock cycles after sending the data to be written before attempting to send a new command. This
is to avoid disturbing the BDM shift register before the write has been completed. The 150 bus clock cycle
delay in both cases includes the maximum 128 cycle delay that can be incurred as the BDM waits for a
free cycle before stealing a cycle.
For firmware read commands, the external host should wait at least 48 bus clock cycles after sending the
command opcode and before attempting to obtain the read data. This includes the potential of extra cycles
when the access is external and stretched (+1 to maximum +7 cycles) or to registers of the PRU (port
replacement unit) in emulation mode. The 48 cycle wait allows enough time for the requested data to be
made available in the BDM shift register, ready to be shifted out.
NOTE
This timing has increased from previous BDM modules due to the new
capability in which the BDM serial interface can potentially run faster than
the bus. On previous BDM modules this extra time could be hidden within
the serial time.
For firmware write commands, the external host must wait 36 bus clock cycles after sending the data to be
written before attempting to send a new command. This is to avoid disturbing the BDM shift register
before the write has been completed.
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The external host should wait at least for 76 bus clock cycles after a TRACE1 or GO command before
starting any new serial command. This is to allow the CPU to exit gracefully from the standard BDM
firmware lookup table and resume execution of the user code. Disturbing the BDM shift register
prematurely may adversely affect the exit from the standard BDM firmware lookup table.
NOTE
If the bus rate of the target processor is unknown or could be changing or the
external wait function is used, it is recommended that the ACK
(acknowledge function) is used to indicate when an operation is complete.
When using ACK, the delay times are automated.
Figure 19-7 represents the BDM command structure. The command blocks illustrate a series of eight bit
times starting with a falling edge. The bar across the top of the blocks indicates that the BKGD line idles
1
in the high state. The time for an 8-bit command is 8 × 16 target clock cycles.
8 Bits
AT ~16 TC/Bit
16 Bits
AT ~16 TC/Bit
150-BC
Delay
16 Bits
AT ~16 TC/Bit
Hardware
Read
Next
Command
Command
Command
Command
Command
Command
Address
Data
150-BC
Delay
Hardware
Write
Next
Command
Address
Data
48-BC
DELAY
Firmware
Read
Next
Command
Data
36-BC
DELAY
Firmware
Write
Next
Command
Data
76-BC
Delay
GO,
TRACE
Next
Command
BC = Bus Clock Cycles
TC = Target Clock Cycles
Figure 19-7. BDM Command Structure
1. Target clock cycles are cycles measured using the target MCU’s serial clock rate. See Section 19.4.6, “BDM Serial Interface”
and Section 19.3.2.1, “BDM Status Register (BDMSTS)” for information on how serial clock rate is selected.
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Chapter 19 Background Debug Module (S12XBDMV2)
19.4.6 BDM Serial Interface
The BDM communicates with external devices serially via the BKGD pin. During reset, this pin is a mode
select input which selects between normal and special modes of operation. After reset, this pin becomes
the dedicated serial interface pin for the BDM.
The BDM serial interface is timed using the clock selected by the CLKSW bit in the status register see
Section 19.3.2.1, “BDM Status Register (BDMSTS)”. This clock will be referred to as the target clock in
the following explanation.
The BDM serial interface uses a clocking scheme in which the external host generates a falling edge on
the BKGD pin to indicate the start of each bit time. This falling edge is sent for every bit whether data is
transmitted or received. Data is transferred most significant bit (MSB) first at 16 target clock cycles per
bit. The interface times out if 512 clock cycles occur between falling edges from the host.
The BKGD pin is a pseudo open-drain pin and has an weak on-chip active pull-up that is enabled at all
times. It is assumed that there is an external pull-up and that drivers connected to BKGD do not typically
drive the high level. Since R-C rise time could be unacceptably long, the target system and host provide
brief driven-high (speedup) pulses to drive BKGD to a logic 1. The source of this speedup pulse is the host
for transmit cases and the target for receive cases.
The timing for host-to-target is shown in Figure 19-8 and that of target-to-host in Figure 19-9 and
Figure 19-10. All four cases begin when the host drives the BKGD pin low to generate a falling edge. Since
the host and target are operating from separate clocks, it can take the target system up to one full clock
cycle to recognize this edge. The target measures delays from this perceived start of the bit time while the
host measures delays from the point it actually drove BKGD low to start the bit up to one target clock cycle
earlier. Synchronization between the host and target is established in this manner at the start of every bit
Figure 19-8 shows an external host transmitting a logic 1 and transmitting a logic 0 to the BKGD pin of a
target system. The host is asynchronous to the target, so there is up to a one clock-cycle delay from the
host-generated falling edge to where the target recognizes this edge as the beginning of the bit time. Ten
target clock cycles later, the target senses the bit level on the BKGD pin. Internal glitch detect logic
requires the pin be driven high no later that eight target clock cycles after the falling edge for a logic 1
transmission.
Since the host drives the high speedup pulses in these two cases, the rising edges look like digitally driven
signals.
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BDM Clock
(Target MCU)
Host
Transmit 1
Host
Transmit 0
Perceived
Target Senses Bit
Start of Bit Time
Earliest
Start of
Next Bit
10 Cycles
Synchronization
Uncertainty
The receive cases are more complicated. Figure 19-9 shows the host receiving a logic 1 from the target
system. Since the host is asynchronous to the target, there is up to one clock-cycle delay from the
host-generated falling edge on BKGD to the perceived start of the bit time in the target. The host holds the
BKGD pin low long enough for the target to recognize it (at least two target clock cycles). The host must
release the low drive before the target drives a brief high speedup pulse seven target clock cycles after the
perceived start of the bit time. The host should sample the bit level about 10 target clock cycles after it
started the bit time.
BDM Clock
(Target MCU)
Host
Drive to
High-Impedance
BKGD Pin
Target System
Speedup
Pulse
High-Impedance
High-Impedance
Perceived
Start of Bit Time
R-C Rise
BKGD Pin
10 Cycles
10 Cycles
Earliest
Start of
Next Bit
Host Samples
BKGD Pin
Figure 19-9. BDM Target-to-Host Serial Bit Timing (Logic 1)
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Chapter 19 Background Debug Module (S12XBDMV2)
Figure 19-10 shows the host receiving a logic 0 from the target. Since the host is asynchronous to the
target, there is up to a one clock-cycle delay from the host-generated falling edge on BKGD to the start of
the bit time as perceived by the target. The host initiates the bit time but the target finishes it. Since the
target wants the host to receive a logic 0, it drives the BKGD pin low for 13 target clock cycles then briefly
drives it high to speed up the rising edge. The host samples the bit level about 10 target clock cycles after
starting the bit time.
BDM Clock
(Target MCU)
Host
High-Impedance
Speedup Pulse
Drive to
BKGD Pin
Target System
Drive and
Speedup Pulse
Perceived
Start of Bit Time
BKGD Pin
10 Cycles
10 Cycles
Earliest
Start of
Next Bit
Host Samples
BKGD Pin
Figure 19-10. BDM Target-to-Host Serial Bit Timing (Logic 0)
19.4.7 Serial Interface Hardware Handshake Protocol
BDM commands that require CPU execution are ultimately treated at the MCU bus rate. Since the BDM
clock source can be asynchronously related to the bus frequency, when CLKSW = 0, it is very helpful to
provide a handshake protocol in which the host could determine when an issued command is executed by
the CPU. The alternative is to always wait the amount of time equal to the appropriate number of cycles at
the slowest possible rate the clock could be running. This sub-section will describe the hardware
handshake protocol.
The hardware handshake protocol signals to the host controller when an issued command was successfully
executed by the target. This protocol is implemented by a 16 serial clock cycle low pulse followed by a
brief speedup pulse in the BKGD pin. This pulse is generated by the target MCU when a command, issued
by the host, has been successfully executed (see Figure 19-11). This pulse is referred to as the ACK pulse.
After the ACK pulse has finished: the host can start the bit retrieval if the last issued command was a read
command, or start a new command if the last command was a write command or a control command
(BACKGROUND, GO, GO_UNTIL or TRACE1). The ACK pulse is not issued earlier than 32 serial clock
cycles after the BDM command was issued. The end of the BDM command is assumed to be the 16th tick
of the last bit. This minimum delay assures enough time for the host to perceive the ACK pulse. Note also
that, there is no upper limit for the delay between the command and the related ACK pulse, since the
command execution depends upon the CPU bus frequency, which in some cases could be very slow
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Chapter 19 Background Debug Module (S12XBDMV2)
compared to the serial communication rate. This protocol allows a great flexibility for the POD designers,
since it does not rely on any accurate time measurement or short response time to any event in the serial
communication.
BDM Clock
(Target MCU)
16 Cycles
Target
Transmits
ACK Pulse
High-Impedance
32 Cycles
High-Impedance
Speedup Pulse
Minimum Delay
From the BDM Command
BKGD Pin
Earliest
Start of
Next Bit
16th Tick of the
Last Command Bit
Figure 19-11. Target Acknowledge Pulse (ACK)
NOTE
If the ACK pulse was issued by the target, the host assumes the previous
command was executed. If the CPU enters wait or stop prior to executing a
hardware command, the ACK pulse will not be issued meaning that the
BDM command was not executed. After entering wait or stop mode, the
BDM command is no longer pending.
Figure 19-12 shows the ACK handshake protocol in a command level timing diagram. The READ_BYTE
instruction is used as an example. First, the 8-bit instruction opcode is sent by the host, followed by the
address of the memory location to be read. The target BDM decodes the instruction. A bus cycle is grabbed
(free or stolen) by the BDM and it executes the READ_BYTE operation. Having retrieved the data, the
BDM issues an ACK pulse to the host controller, indicating that the addressed byte is ready to be retrieved.
After detecting the ACK pulse, the host initiates the byte retrieval process. Note that data is sent in the form
of a word and the host needs to determine which is the appropriate byte based on whether the address was
odd or even.
Target
Host
(2) Bytes are
Retrieved
New BDM
Command
BKGD Pin
READ_BYTE
Host
Byte Address
Target
Host
Target
BDM Issues the
ACK Pulse (out of scale)
BDM Executes the
READ_BYTE Command
BDM Decodes
the Command
Figure 19-12. Handshake Protocol at Command Level
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Chapter 19 Background Debug Module (S12XBDMV2)
Differently from the normal bit transfer (where the host initiates the transmission), the serial interface ACK
handshake pulse is initiated by the target MCU by issuing a negative edge in the BKGD pin. The hardware
handshake protocol in Figure 19-11 specifies the timing when the BKGD pin is being driven, so the host
should follow this timing constraint in order to avoid the risk of an electrical conflict in the BKGD pin.
NOTE
The only place the BKGD pin can have an electrical conflict is when one
side is driving low and the other side is issuing a speedup pulse (high). Other
“highs” are pulled rather than driven. However, at low rates the time of the
speedup pulse can become lengthy and so the potential conflict time
becomes longer as well.
The ACK handshake protocol does not support nested ACK pulses. If a BDM command is not
acknowledge by an ACK pulse, the host needs to abort the pending command first in order to be able to
issue a new BDM command. When the CPU enters wait or stop while the host issues a hardware command
(e.g., WRITE_BYTE), the target discards the incoming command due to the wait or stop being detected.
Therefore, the command is not acknowledged by the target, which means that the ACK pulse will not be
issued in this case. After a certain time the host (not aware of stop or wait) should decide to abort any
possible pending ACK pulse in order to be sure a new command can be issued. Therefore, the protocol
provides a mechanism in which a command, and its corresponding ACK, can be aborted.
NOTE
The ACK pulse does not provide a time out. This means for the GO_UNTIL
command that it can not be distinguished if a stop or wait has been executed
(command discarded and ACK not issued) or if the “UNTIL” condition
(BDM active) is just not reached yet. Hence in any case where the ACK
aborted before issuing a new command. See the handshake abort procedure
described in Section 19.4.8, “Hardware Handshake Abort Procedure”.
19.4.8 Hardware Handshake Abort Procedure
The abort procedure is based on the SYNC command. In order to abort a command, which had not issued
the corresponding ACK pulse, the host controller should generate a low pulse in the BKGD pin by driving
it low for at least 128 serial clock cycles and then driving it high for one serial clock cycle, providing a
speedup pulse. By detecting this long low pulse in the BKGD pin, the target executes the SYNC protocol,
see Section 19.4.9, “SYNC — Request Timed Reference Pulse”, and assumes that the pending command
and therefore the related ACK pulse, are being aborted. Therefore, after the SYNC protocol has been
completed the host is free to issue new BDM commands. For Firmware READ or WRITE commands it
can not be guaranteed that the pending command is aborted when issuing a SYNC before the
corresponding ACK pulse. There is a short latency time from the time the READ or WRITE access begins
until it is finished and the corresponding ACK pulse is issued. The latency time depends on the firmware
READ or WRITE command that is issued and if the serial interface is running on a different clock rate
than the bus. When the SYNC command starts during this latency time the READ or WRITE command
will not be aborted, but the corresponding ACK pulse will be aborted. A pending GO, TRACE1 or
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GO_UNTIL command can not be aborted. Only the corresponding ACK pulse can be aborted by the
SYNC command.
Although it is not recommended, the host could abort a pending BDM command by issuing a low pulse in
the BKGD pin shorter than 128 serial clock cycles, which will not be interpreted as the SYNC command.
The ACK is actually aborted when a negative edge is perceived by the target in the BKGD pin. The short
abort pulse should have at least 4 clock cycles keeping the BKGD pin low, in order to allow the negative
edge to be detected by the target. In this case, the target will not execute the SYNC protocol but the pending
command will be aborted along with the ACK pulse. The potential problem with this abort procedure is
when there is a conflict between the ACK pulse and the short abort pulse. In this case, the target may not
perceive the abort pulse. The worst case is when the pending command is a read command (i.e.,
READ_BYTE). If the abort pulse is not perceived by the target the host will attempt to send a new
command after the abort pulse was issued, while the target expects the host to retrieve the accessed
memory byte. In this case, host and target will run out of synchronism. However, if the command to be
aborted is not a read command the short abort pulse could be used. After a command is aborted the target
assumes the next negative edge, after the abort pulse, is the first bit of a new BDM command.
NOTE
The details about the short abort pulse are being provided only as a reference
for the reader to better understand the BDM internal behavior. It is not
recommended that this procedure be used in a real application.
Since the host knows the target serial clock frequency, the SYNC command (used to abort a command)
does not need to consider the lower possible target frequency. In this case, the host could issue a SYNC
very close to the 128 serial clock cycles length. Providing a small overhead on the pulse length in order to
assure the SYNC pulse will not be misinterpreted by the target. See Section 19.4.9, “SYNC — Request
Figure 19-13 shows a SYNC command being issued after a READ_BYTE, which aborts the
READ_BYTE command. Note that, after the command is aborted a new command could be issued by the
host computer.
READ_BYTE CMD is Aborted
by the SYNC Request
(Out of Scale)
SYNC Response
From the Target
(Out of Scale)
BKGD Pin READ_BYTE
Host
Memory Address
Target
READ_STATUS
New BDM Command
Host Target
Host
Target
BDM Decode
New BDM Command
and Starts to Execute
the READ_BYTE Command
Figure 19-13. ACK Abort Procedure at the Command Level
NOTE
Figure 19-13 does not represent the signals in a true timing scale
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Figure 19-14 shows a conflict between the ACK pulse and the SYNC request pulse. This conflict could
occur if a POD device is connected to the target BKGD pin and the target is already in debug active mode.
Consider that the target CPU is executing a pending BDM command at the exact moment the POD is being
connected to the BKGD pin. In this case, an ACK pulse is issued along with the SYNC command. In this
case, there is an electrical conflict between the ACK speedup pulse and the SYNC pulse. Since this is not
a probable situation, the protocol does not prevent this conflict from happening.
At Least 128 Cycles
BDM Clock
(Target MCU)
ACK Pulse
Target MCU
High-Impedance
Electrical Conflict
Drives to
BKGD Pin
Speedup Pulse
Host and
Target Drive
to BKGD Pin
Host
Drives SYNC
To BKGD Pin
Host SYNC Request Pulse
BKGD Pin
16 Cycles
Figure 19-14. ACK Pulse and SYNC Request Conflict
NOTE
This information is being provided so that the MCU integrator will be aware
that such a conflict could eventually occur.
The hardware handshake protocol is enabled by the ACK_ENABLE and disabled by the ACK_DISABLE
BDM commands. This provides backwards compatibility with the existing POD devices which are not
able to execute the hardware handshake protocol. It also allows for new POD devices, that support the
hardware handshake protocol, to freely communicate with the target device. If desired, without the need
for waiting for the ACK pulse.
The commands are described as follows:
•
ACK_ENABLE — enables the hardware handshake protocol. The target will issue the ACK pulse
when a CPU command is executed by the CPU. The ACK_ENABLE command itself also has the
ACK pulse as a response.
•
ACK_DISABLE — disables the ACK pulse protocol. In this case, the host needs to use the worst
case delay time at the appropriate places in the protocol.
The default state of the BDM after reset is hardware handshake protocol disabled.
All the read commands will ACK (if enabled) when the data bus cycle has completed and the data is then
ready for reading out by the BKGD serial pin. All the write commands will ACK (if enabled) after the data
has been received by the BDM through the BKGD serial pin and when the data bus cycle is complete. See
Section 19.4.3, “BDM Hardware Commands” and Section 19.4.4, “Standard BDM Firmware Commands”
for more information on the BDM commands.
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The ACK_ENABLE sends an ACK pulse when the command has been completed. This feature could be
used by the host to evaluate if the target supports the hardware handshake protocol. If an ACK pulse is
issued in response to this command, the host knows that the target supports the hardware handshake
protocol. If the target does not support the hardware handshake protocol the ACK pulse is not issued. In
this case, the ACK_ENABLE command is ignored by the target since it is not recognized as a valid
command.
The BACKGROUND command will issue an ACK pulse when the CPU changes from normal to
background mode. The ACK pulse related to this command could be aborted using the SYNC command.
The GO command will issue an ACK pulse when the CPU exits from background mode. The ACK pulse
related to this command could be aborted using the SYNC command.
The GO_UNTIL command is equivalent to a GO command with exception that the ACK pulse, in this
case, is issued when the CPU enters into background mode. This command is an alternative to the GO
command and should be used when the host wants to trace if a breakpoint match occurs and causes the
CPU to enter active background mode. Note that the ACK is issued whenever the CPU enters BDM, which
could be caused by a breakpoint match or by a BGND instruction being executed. The ACK pulse related
to this command could be aborted using the SYNC command.
The TRACE1 command has the related ACK pulse issued when the CPU enters background active mode
after one instruction of the application program is executed. The ACK pulse related to this command could
be aborted using the SYNC command.
19.4.9 SYNC — Request Timed Reference Pulse
The SYNC command is unlike other BDM commands because the host does not necessarily know the
correct communication speed to use for BDM communications until after it has analyzed the response to
the SYNC command. To issue a SYNC command, the host should perform the following steps:
1. Drive the BKGD pin low for at least 128 cycles at the lowest possible BDM serial communication
frequency (the lowest serial communication frequency is determined by the crystal oscillator or the
clock chosen by CLKSW.)
2. Drive BKGD high for a brief speedup pulse to get a fast rise time (this speedup pulse is typically
one cycle of the host clock.)
3. Remove all drive to the BKGD pin so it reverts to high impedance.
4. Listen to the BKGD pin for the sync response pulse.
Upon detecting the SYNC request from the host, the target performs the following steps:
1. Discards any incomplete command received or bit retrieved.
2. Waits for BKGD to return to a logic one.
3. Delays 16 cycles to allow the host to stop driving the high speedup pulse.
4. Drives BKGD low for 128 cycles at the current BDM serial communication frequency.
5. Drives a one-cycle high speedup pulse to force a fast rise time on BKGD.
6. Removes all drive to the BKGD pin so it reverts to high impedance.
The host measures the low time of this 128 cycle SYNC response pulse and determines the correct speed
for subsequent BDM communications. Typically, the host can determine the correct communication speed
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Chapter 19 Background Debug Module (S12XBDMV2)
within a few percent of the actual target speed and the communication protocol can easily tolerate speed
errors of several percent.
As soon as the SYNC request is detected by the target, any partially received command or bit retrieved is
discarded. This is referred to as a soft-reset, equivalent to a time-out in the serial communication. After the
SYNC response, the target will consider the next negative edge (issued by the host) as the start of a new
BDM command or the start of new SYNC request.
Another use of the SYNC command pulse is to abort a pending ACK pulse. The behavior is exactly the
same as in a regular SYNC command. Note that one of the possible causes for a command to not be
acknowledged by the target is a host-target synchronization problem. In this case, the command may not
have been understood by the target and so an ACK response pulse will not be issued.
19.4.10 Instruction Tracing
When a TRACE1 command is issued to the BDM in active BDM, the CPU exits the standard BDM
firmware and executes a single instruction in the user code. Once this has occurred, the CPU is forced to
return to the standard BDM firmware and the BDM is active and ready to receive a new command. If the
TRACE1 command is issued again, the next user instruction will be executed. This facilitates stepping or
tracing through the user code one instruction at a time.
If an interrupt is pending when a TRACE1 command is issued, the interrupt stacking operation occurs but
no user instruction is executed. Once back in standard BDM firmware execution, the program counter
points to the first instruction in the interrupt service routine.
Be aware when tracing through the user code that the execution of the user code is done step by step but
all peripherals are free running. Hence possible timing relations between CPU code execution and
occurrence of events of other peripherals no longer exist.
When tracing through user code which contains stop or wait instructions the following will happen when
the stop or wait instruction is traced:
The CPU enters stop or wait mode and the TRACE1 command can not be finished before leaving
the low power mode. This is the case because BDM active mode can not be entered after CPU
executed the stop instruction. However all BDM hardware commands except the BACKGROUND
command are operational after tracing a stop or wait instruction and still being in stop or wait
mode. If system stop mode is entered (all bus masters are in stop mode) no BDM command is
operational.
As soon as stop or wait mode is exited the CPU enters BDM active mode and the saved PC value
points to the entry of the corresponding interrupt service routine.
In case the handshake feature is enabled the corresponding ACK pulse of the TRACE1 command
will be discarded when tracing a stop or wait instruction. Hence there is no ACK pulse when BDM
active mode is entered as part of the TRACE1 command after CPU exited from stop or wait mode.
All valid commands sent during CPU being in stop or wait mode or after CPU exited from stop or
wait mode will have an ACK pulse. The handshake feature becomes disabled only when system
stop mode has been reached. Hence after a system stop mode the handshake feature must be
enabled again by sending the ACK_ENABLE command.
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Chapter 19 Background Debug Module (S12XBDMV2)
19.4.11 Serial Communication Time Out
The host initiates a host-to-target serial transmission by generating a falling edge on the BKGD pin. If
BKGD is kept low for more than 128 target clock cycles, the target understands that a SYNC command
was issued. In this case, the target will keep waiting for a rising edge on BKGD in order to answer the
SYNC request pulse. If the rising edge is not detected, the target will keep waiting forever without any
time-out limit.
Consider now the case where the host returns BKGD to logic one before 128 cycles. This is interpreted as
a valid bit transmission, and not as a SYNC request. The target will keep waiting for another falling edge
marking the start of a new bit. If, however, a new falling edge is not detected by the target within 512 clock
cycles since the last falling edge, a time-out occurs and the current command is discarded without affecting
memory or the operating mode of the MCU. This is referred to as a soft-reset.
If a read command is issued but the data is not retrieved within 512 serial clock cycles, a soft-reset will
occur causing the command to be disregarded. The data is not available for retrieval after the time-out has
occurred. This is the expected behavior if the handshake protocol is not enabled. However, consider the
behavior where the BDM is running in a frequency much greater than the CPU frequency. In this case, the
command could time out before the data is ready to be retrieved. In order to allow the data to be retrieved
even with a large clock frequency mismatch (between BDM and CPU) when the hardware handshake
protocol is enabled, the time out between a read command and the data retrieval is disabled. Therefore, the
host could wait for more then 512 serial clock cycles and still be able to retrieve the data from an issued
read command. However, once the handshake pulse (ACK pulse) is issued, the time-out feature is
re-activated, meaning that the target will time out after 512 clock cycles. Therefore, the host needs to
retrieve the data within a 512 serial clock cycles time frame after the ACK pulse had been issued. After
that period, the read command is discarded and the data is no longer available for retrieval. Any negative
edge in the BKGD pin after the time-out period is considered to be a new command or a SYNC request.
Note that whenever a partially issued command, or partially retrieved data, has occurred the time out in the
serial communication is active. This means that if a time frame higher than 512 serial clock cycles is
observed between two consecutive negative edges and the command being issued or data being retrieved
is not complete, a soft-reset will occur causing the partially received command or data retrieved to be
disregarded. The next negative edge in the BKGD pin, after a soft-reset has occurred, is considered by the
target as the start of a new BDM command, or the start of a SYNC request pulse.
ff12
READ_BACK
equ
$ff12
;S12X read back value to solve MUCts02411
;never touch data at this address !!!!
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Chapter 19 Background Debug Module (S12XBDMV2)
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Chapter 20
Debug (S12XDBGV2)
20.1 Introduction
The DBG module provides an on-chip trace buffer with flexible triggering capability to allow non-intrusive
debug of application software. The DBG module is optimized for the HCS12X 16-bit architecture and
allows debugging of both CPU and XGATE module operations.
Typically the DBG module is used in conjunction with the BDM module, whereby the user configures the
DBG module for a debugging session over the BDM interface. Once configured the DBG module is armed
and the device leaves BDM mode returning control to the user program, which is then monitored by the
DBG module. Alternatively, the DBG module can be configured over a serial interface using SWI routines.
Comparators monitor the bus activity of the CPU and XGATE modules. When a match occurs, the control
logic can trigger the state sequencer to a new state or tag an opcode. A tag hit, which occurs when the
tagged opcode reaches the execution stage of the instruction queue, can also cause a state transition.
On a transition to the final state, bus tracing is triggered and/or a breakpoint can be generated. Independent
of comparator matches, a transition to final state with associated tracing and breakpoint can be triggered
by the external TAGHI and TAGLO signals. This is done by an XGATE module S/W breakpoint request
or by writing to the TRIG control bit.
The trace buffer is visible through a 2-byte window in the register address map and can be read out using
standard 16-bit word reads. Tracing is disabled when the MCU system is secured.
20.1.1 Glossary of Terms
COF: Change Of Flow. Change in the program flow due to a conditional branch, indexed jump or interrupt.
BDM : Background Debug Mode
DUG: Device User Guide, describing the features of the device into which the DBG is integrated.
WORD: 16 bit data entity
Data Line : 64 bit data entity
XGATE : S12X family programmable Direct Memory Access Module
CPU : S12X_CPU module
Tag : Tags can be attached to XGATE or CPU opcodes as they enter the instruction pipe. If the tagged
opcode reaches the execution stage a tag hit occurs.
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Chapter 20 Debug (S12XDBGV2)
20.1.2 Features
•
Four comparators (A, B, C, and D):
— Comparators A and C compare the full address and the full 16-bit data bus
— Comparators A and C feature a data bus mask register
— Comparators B and D compare the full address bus only
— Each comparator can be configured to monitor either CPU or XGATE busses
— Each comparator features control of R/W and byte/word access cycles
— Comparisons can be used as triggers for the state sequencer
Three comparator modes:
•
— Simple address/data comparator match mode
— Inside address range mode, Addmin ≤ Address ≤ Addmax
— Outside address range match mode, Address < Addmin or Address > Addmax
Two types of triggers:
•
•
— Tagged: triggers just before a specific instruction begins execution
— Force: triggers on the first instruction boundary after a match occurs.
Three types of breakpoints:
— CPU breakpoint entering BDM on breakpoint (BDM)
— CPU breakpoint executing SWI on breakpoint (SWI)
— XGATE breakpoint
•
•
Three trigger modes independent of comparators:
— External instruction tagging (associated with CPU instructions only)
— XGATE S/W breakpoint request
— TRIG bit immediate software trigger
Three trace modes:
— Normal: change of flow (COF) bus information is stored (see Section 20.4.5.2.1, “Normal
Mode”) for change of flow definition.
— Loop1: same as normal but inhibits consecutive duplicate source address entries
— Detail: address and data for all cycles except free cycles and opcode fetches are stored
4-stage state sequencer for trace buffer control:
•
— Tracing session trigger linked to final state of state sequencer
— Begin, end, and mid alignment of tracing to trigger
20.1.3 Modes of Operation
The DBG module can be used in all MCU functional modes.
During BDM hardware accesses and when the BDM module is active, CPU monitoring is disabled. Thus
breakpoints, comparators and bus tracing mapped to the CPU are disabled but accessing the DBG registers,
including comparator registers, is still possible. While in active BDM or during hardware BDM accesses,
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Chapter 20 Debug (S12XDBGV2)
XGATE activity can still be compared, traced and can be used to generate a breakpoint to the XGATE
module. When the CPU enters active BDM mode through a BACKGROUND command, with the DBG
module armed, the DBG remains armed.
The DBG module tracing is disabled if the MCU is secure. Breakpoints can however still be generated if
the MCU is secure.
Table 20-1. Mode Dependent Restriction Summary
BDM
Enable
BDM
Active
MCU
Secure
Comparator Matches
Enabled
Breakpoints
Possible
Tagging
Possible
Tracing
Possible
x
0
0
1
1
x
0
1
0
1
1
0
0
0
0
Yes
Yes
Yes
Yes
Yes
No
Only SWI
Yes
Active BDM not possible when not enabled
Yes
Yes
Yes
Yes
XGATE only
XGATE only
XGATE only
XGATE only
20.1.4 Block Diagram
Figure 20-1 shows a block diagram of the debug module.
TAGS
TAGHITS
EXTERNAL TAGHI / TAGLO
BREAKPOINT REQUESTS
CPU & XGATE
XGATE S/W BREAKPOINT REQUEST
SECURE
MATCH0
TAG &
TRIGGER
CONTROL
LOGIC
TRIGGER
COMPARATOR A
CPU BUS
MATCH1
STATE
COMPARATOR B
SEQUENCER
XGATE BUS
MATCH2
STATE
COMPARATOR C
MATCH3
COMPARATOR D
TRACE
CONTROL
TRIGGER
TRACE
BUFFER
READ TRACE DATA (DBG READ DATA BUS)
Figure 20-1. Debug Block Diagram
20.2 External Signal Description
The DBG sub-module features two external tag input signals (see Table 20-2). See Device User Guide
(DUG) for the mapping of these signals to device pins. These tag pins may be used for the external tagging
in emulation modes only
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Chapter 20 Debug (S12XDBGV2)
.
Table 20-2. External System Pins Associated With DBG
Pin Functions Description
Pin Name
TAGHI
(See DUG)
TAGHI
When instruction tagging is on, tags the high half of the instruction word being read
into the instruction queue.
TAGLO
(See DUG)
TAGLO
When instruction tagging is on, tags the low half of the instruction word being read
into the instruction queue.
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Chapter 20 Debug (S12XDBGV2)
20.3 Memory Map and Register Definition
A summary of the registers associated with the DBG sub-block is shown in Figure 20-2. Detailed
descriptions of the registers and bits are given in the subsections that follow.
20.3.1 Register Descriptions
This section consists of the DBG control and trace buffer register descriptions in address order. Each
comparator has a bank of registers that are visible through an 8-byte window between 0x0028 and 0x002F
in the DBG module register address map. When ARM is set in DBGC1, the only bits in the DBG module
registers that can be written are ARM, TRIG and COMRV[1:0]
Register
Name
Address
Bit 7
ARM
TBF
6
5
XGSBPE
0
4
BDM
0
3
2
1
Bit 0
0x0020
DBGC1
R
0
DBGBRK
COMRV
W
TRIG
0x0021
0x0022
0x0023
0x0024
0x0025
0x0026
0x0027
0x0028
0x0028
DBGSR
DBGTCR
DBGC2
R
EXTF
0
SSF2
SSF1
SSF0
W
R
TSOURCE
TRANGE
TRCMOD
TALIGN
W
R
0
Bit 15
Bit 7
0
0
14
6
0
13
5
0
12
4
CDCM
ABCM
W
DBGTBH
DBGTBL
DBGCNT
DBGSCRX
R
11
3
10
2
9
1
Bit 8
Bit 0
W
R
W
R
CNT
W
R
0
0
0
0
SC3
RW
RW
SC2
RWE
RWE
SC1
SRC
SRC
SC0
W
1
DBGXCTL
(COMPA/C)
R
0
NDB
SZ
TAG
TAG
BRK
BRK
COMPE
COMPE
W
2
DBGXCTL
(COMPB/D)
R
SZE
W
1. This represents the contents if the comparator A or C control register is blended into this address
2. This represents the contents if the comparator B or D control register is blended into this address
= Unimplemented or Reserved
Figure 20-2. DBG Register Summary
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Register
Address
Bit 7
6
5
4
3
2
1
Bit 0
Name
0x0029
0x002A
0x002B
0x002C
0x002D
0x002E
0x002F
DBGXAH
DBGXAM
DBGXAL
R
0
Bit 22
21
20
19
18
17
Bit 16
W
R
Bit 15
Bit 7
14
6
13
5
12
4
11
3
10
2
9
1
9
1
9
1
Bit 8
Bit 0
Bit 8
Bit 0
Bit 8
Bit 0
W
R
W
DBGXDH
DBGXDL
DBGXDHM
DBGXDLM
R
Bit 15
Bit 7
14
6
13
5
12
4
11
3
10
2
W
R
W
R
Bit 15
Bit 7
14
6
13
5
12
4
11
3
10
2
W
R
W
= Unimplemented or Reserved
Figure 20-2. DBG Register Summary (continued)
20.3.1.1 Debug Control Register 1 (DBGC1)
0x0020
7
6
5
4
3
2
1
0
R
W
0
ARM
XGSBPE
BDM
DBGBRK
COMRV
TRIG
0
Reset
0
0
0
0
0
0
0
Figure 20-3. Debug Control Register (DBGC1)
Read: Anytime
Write: Bits 7,1,0 anytime, Bit 6 can be written anytime but always reads back as 0.
Bits 5:2 anytime DBG is not armed.
NOTE
When disarming the DBG by clearing ARM with software, the contents of
bits[5:2] are not affected by the write, since up until the write operation,
ARM=1 preventing these bits from being written. These bits must be cleared
using a second write if required.
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Chapter 20 Debug (S12XDBGV2)
Table 20-3. DBGC1 Field Descriptions
Description
Field
7
ARM
Arm Bit — The ARM bit controls whether the DBG module is armed. This bit can be set and cleared by user
software and is automatically cleared on completion of a tracing session, or if a breakpoint is generated with
tracing not enabled. On setting this bit the state sequencer enters State1. When ARM is set, the only bits in the
DBG module registers that can be written are ARM and TRIG.
0 Debugger disarmed
1 Debugger armed
6
Immediate Trigger Request Bit — This bit when written to 1 requests an immediate trigger independent of
comparator or external tag signal status. When tracing is complete a forced breakpoint may be generated
depending upon DBGBRK and BDM bit settings. This bit always reads back a “0”. Writing a “0” to this bit has no
effect. If both TSOURCE bits are clear no tracing is carried out. If tracing has already commenced using BEGIN-
or mid-trigger alignment, it continues until the end of the tracing session as defined by the TALIGN bit settings,
thus TRIG has no affect. In secure mode tracing is disabled and writing to this bit has no effect.
0 Do not trigger until the state sequencer enters the final state.
TRIG
1 Enter final state immediately and issue forced breakpoint request when trace buffer is full.
5
XGATE S/W Breakpoint Enable — The XGSBPE bit controls whether an XGATE S/W breakpoint request is
passed to the CPU. The XGATE S/W breakpoint request is handled by the DBG module, which can request an
CPU breakpoint depending on the state of this bit.
XGSBPE
0 XGATE S/W breakpoint request is disabled
1 XGATE S/W breakpoint request is enabled
4
BDM
Background Debug Mode Enable — This bit determines if a CPU breakpoint causes the system to enter
background debug mode (BDM) or initiate a software interrupt (SWI). It has no affect on DBG functionality.
This bit must be set if the BDM is enabled by the ENBDM bit in the BDM module to map breakpoints to BDM
and must be cleared if the BDM module is disabled to map breakpoints to SWI.
0 Go to software interrupt on a breakpoint
1 Go to BDM on a breakpoint.
3–2
DBGBRK
DBG Breakpoint Enable Bits — The DBGBRK bits control whether the debugger will request a breakpoint to
either CPU, XGATE or both upon reaching the state sequencer final state. If tracing is enabled, the breakpoint
is generated on completion of the tracing session. If tracing is not enabled, the breakpoint is generated
immediately. Please refer to Section 20.4.7, “Breakpoints” for further details. XGATE generated breakpoints are
independent of the DBGBRK bits. XGATE generates a forced breakpoint to the CPU only. See Table 20-4.
1–0
COMRV
Comparator Register Visibility Bits — These bits determine which bank of comparator register is visible in the
8-byte window of the DBG module address map, located between 0x0028 to 0x002F. Furthermore these bits
determine which state control register is visible at the address 0x0027. See Table 20-5.
Table 20-4. DBGBRK Encoding
DBGBRK
Resource Halted by Breakpoint
00
01
10
11
No breakpoint generated
XGATE breakpoint generated
CPU breakpoint generated
Breakpoints generated for CPU and XGATE
Table 20-5. COMRV Encoding
COMRV
Visible Comparator
Comparator A
Visible State Control Register
00
DBGSCR1
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Chapter 20 Debug (S12XDBGV2)
Table 20-5. COMRV Encoding
COMRV
Visible Comparator
Visible State Control Register
01
10
11
Comparator B
Comparator C
Comparator D
DBGSCR2
DBGSCR3
DBGSCR3
20.3.1.2 Debug Status Register (DBGSR)
0x0021
7
6
5
4
3
2
1
0
R
W
TBF
EXTF
0
0
0
SSF2
SSF1
SSF0
Reset
POR
—
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Unimplemented or Reserved
Figure 20-4. Debug Status Register (DBGSR)
Read: Anytime
Write: Never
Table 20-6. DBGSR Field Descriptions
Description
Field
7
TBF
Trace Buffer Full — The TBF bit indicates that the trace buffer has stored 64 or more lines of data since it was
last armed. If this bit is set, then all 64 lines will be valid data, regardless of the value of DBGCNT bits CNT[6:0].
The TBF bit is cleared when ARM in DBGC1 is written to a 1. The TBF is cleared by the power on reset
initialization. Other system generated resets have no affect on this bit
6
External Tag Hit Flag — The EXTF bit indicates if a tag hit condition from an external TAGHI/TAGLO tag was
met since arming. This bit is cleared when ARM in DBGC1 is written to a 1.
0 External tag hit has not occurred
EXTF
1 External tag hit has occurred
2–0
SSF[2:0}
State Sequencer Flag Bits — The SSF bits indicate in which state the state sequencer is currently in. During
a debug session on each transition to a new state these bits are updated. If the debug session is ended by
software clearing the ARM bit, then these bits retain their value to reflect the last state of the state sequencer
before disarming. If a debug session is ended by a breakpoint, then the state sequencer returns to state0 and
these bits are cleared to indicate that state0 was entered during the session. On arming the module the state
sequencer enters state1 and these bits are forced to SSF[2:0] = 001. See Table 20-7.
Table 20-7. SSF[2:0] — State Sequence Flag Bit Encoding
SSF[2:0]
Current State
000
001
State0 (disarmed)
State1
010
State2
011
State3
100
Final State
Reserved
101,110,111
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Chapter 20 Debug (S12XDBGV2)
20.3.1.3 Debug Trace Control Register (DBGTCR)
0x0022
7
6
5
4
3
2
1
0
R
W
TSOURCE
TRANGE
TRCMOD
TALIGN
Reset
0
0
0
0
0
0
0
0
Figure 20-5. Debug Trace Control Register (DBGTCR)
Read: Anytime
Write: Bits 7:6 only when DBG is neither secure nor armed.
Bits 5:0 anytime the module is disarmed.
Table 20-8. DBGTCR Field Descriptions
Field
Description
Trace Source Control Bits — The TSOURCE bits select the data source for the tracing session. If the MCU
7–6
TSOURCE system is secured, these bits cannot be set and tracing is inhibited. See Table 20-9.
5–4 Trace Range Bits —The TRANGE bits allow filtering of trace information from a selected address range when
TRANGE[5:4] tracing from the CPU in detail mode. The XGATE tracing range cannot be narrowed using these bits. To use a
comparator for range filtering, the corresponding COMPE and SRC bits must remain cleared. If the COMPE bit
is not clear then the comparator will also be used to generate state sequence triggers or tags. If the SRC bit is
set the comparator is mapped to the XGATE busses, corrupting the trace. See Table 20-10.
3–2
Trace Mode Bits — See Section 20.4.5.2, “Trace Modes“ for detailed trace mode descriptions. In normal
TRCMOD[3:2] mode, change of flow information is stored. In loop1 mode, change of flow information is stored but redundant
entries into trace memory are inhibited. In detail mode, address and data for all memory and register accesses
1–0
Trigger Align Bits — These bits control whether the trigger is aligned to the beginning, end or the middle of a
TALIGN[1:0] tracing session. See Table 20-12.
Table 20-9. TSOURCE Trace Source Bit Encoding
TSOURCE
Tracing Source
00
01
No tracing requested
CPU
1
10
XGATE
1, 2
11
Both CPU and XGATE
1
2
No range limitations are allowed. Thus tracing operates as if TRANGE = 00.
No detail mode tracing supported. If TRCMOD =10, no information is stored.
Table 20-10. TRANGE Trace Range Encoding
TRANGE
Tracing Source
00
01
10
Trace from all addresses (No filter)
Trace only in address range from 0x0000 to comparator D
Trace only in address range from comparator C to 0x7FFFFF
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Chapter 20 Debug (S12XDBGV2)
Table 20-10. TRANGE Trace Range Encoding
TRANGE
Tracing Source
11
Trace only in range from comparator C to comparator D
Table 20-11. TRCMOD Trace Mode Bit Encoding
TRCMOD
Description
00
01
10
11
NORMAL
LOOP1
DETAIL
Reserved
Table 20-12. TALIGN Trace Alignment Encoding
Description
TALIGN
00
01
10
11
Trigger at end of stored data
Trigger before storing data
Trace buffer entries before and after trigger
Reserved
20.3.1.4 Debug Control Register2 (DBGC2)
0x0023
7
6
5
4
3
2
1
0
R
W
0
0
0
0
CDCM
ABCM
Reset
0
0
0
0
0
0
0
0
Unimplemented or Reserved
Figure 20-6. Debug Control Register2 (DBGC2)
Read: Anytime
Write: Anytime the module is disarmed.
This register configures the comparators for range matching.
Table 20-13. DBGC2 Field Descriptions
Field
Description
C and D Comparator Match Control — These bits determine the C and D comparator match mapping as
3–2
1–0
A and B Comparator Match Control — These bits determine the A and B comparator match mapping as
ABCM[1:0] described in Table 20-15.
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Chapter 20 Debug (S12XDBGV2)
Table 20-14. CDCM Encoding
Description
CDCM
00
01
10
11
Match2 mapped to comparator C match....... Match3 mapped to comparator D match.
Match2 mapped to comparator C/D inside range....... Match3 disabled.
Match2 mapped to comparator C/D outside range....... Match3 disabled.
Reserved
Table 20-15. ABCM Encoding
Description
ABCM
00
01
10
11
Match0 mapped to comparator A match....... Match1 mapped to comparator B match.
Match 0 mapped to comparator A/B inside range....... Match1 disabled.
Match 0 mapped to comparator A/B outside range....... Match1 disabled.
Reserved
20.3.1.5 Debug Trace Buffer Register (DBGTBH:DBGTBL)
0x0024
15
14
13
12
11
10
9
8
R
W
Bit 15
14
13
12
11
10
9
Bit 8
Reset
X
X
X
X
X
X
X
X
Figure 20-7. Debug Trace Buffer Register (DBGTBH)
0x0025
7
6
5
4
3
2
1
0
R
W
Bit 7
6
5
4
3
2
1
Bit 0
Reset
X
X
X
X
X
X
X
X
Figure 20-8. Debug Trace Buffer Register (DBGTBL)
Read: Anytime when unlocked and not secured and not armed.
Write: Aligned word writes when disarmed unlock the trace buffer for reading but do not affect trace buffer
contents
Table 20-16. DBGTB Field Descriptions
Field
Description
15–0
Bit[15:0]
Trace Buffer Data Bits — The trace buffer register is a window through which the 64-bit wide data lines of the
trace buffer may be read 16 bits at a time. Each valid read of DBGTB increments an internal trace buffer pointer
which points to the next address to be read. When the ARM bit is written to 1 the trace buffer is locked to prevent
reading. The trace buffer can only be unlocked for reading by writing to DBGTB with an aligned word write when
the module is disarmed. The DBGTB register can be read only as an aligned word, any byte reads or misaligned
access of these registers will return 0 and will not cause the trace buffer pointer to increment to the next trace
buffer address. The same is true for word reads while the debugger is armed. System resets do not affect the
trace buffer contents. The POR state is undefined.
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Chapter 20 Debug (S12XDBGV2)
20.3.1.6 Debug Count Register (DBGCNT)
0x0026
7
6
5
4
3
2
1
0
R
W
0
CNT
Reset
POR
0
0
—
0
—
0
—
0
—
0
—
0
—
0
—
0
Unimplemented or Reserved
Figure 20-9. Debug Count Register (DBGCNT)
Read: Anytime
Write: Never
Table 20-17. DBGCNT Field Descriptions
Description
Field
6–0
CNT[6:0]
Count Value — The CNT bits [6:0] indicate the number of valid data 64-bit data lines stored in the trace buffer.
Table 20-18 shows the correlation between the CNT bits and the number of valid data lines in the trace buffer.
When the CNT rolls over to 0, the TBF bit in DBGSR is set and incrementing of CNT will continue in end-trigger
or mid-trigger mode. The DBGCNT register is cleared when ARM in DBGC1 is written to a 1. The DBGCNT
register is cleared by power-on-reset initialization but is not cleared by other system resets. Thus should a reset
occur during a debug session, the DBGCNT register still indicates after the reset, the number of valid trace buffer
entries stored before the reset occurred. The DBGCNT register is not decremented when reading from the trace
buffer.
Table 20-18. CNT Decoding Table
TBF (DBGSR)
CNT[6:0]
Description
0
0
0
0
0000000
0000001
0000010
No data valid
1 line valid
1
1
0000011
0000100
0000110
..
1.5 lines valid
2 lines valid
3 lines valid
..
1111100
62 lines valid
0
1
1111110
0000000
63 lines valid
64 lines valid; if using begin-trigger alignment,
ARM bit will be cleared and the tracing session ends.
1
0000010
64 lines valid,
..
..
oldest data has been overwritten by most recent data
1111110
1
This applies to normal/loop1 modes when tracing from either CPU or XGATE only.
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Chapter 20 Debug (S12XDBGV2)
20.3.1.7 Debug State Control Registers
Each of the state sequencer states 1 to 3 features a dedicated control register to determine if transitions
from that state are allowed depending upon comparator matches or tag hits and to define the next state for
the state sequencer following a match. The 3 debug state control registers are located at the same address
in the register address map (0x0027). Each register can be accessed using the COMRV bits in DBGC1 to
blend in the required register (see Table 20-19).
Table 20-19. State Control Register Access Encoding
COMRV
Visible State Control Register
00
01
10
11
DBGSCR1
DBGSCR2
DBGSCR3
DBGSCR3
20.3.1.8 Debug State Control Register 1 (DBGSCR1)
0x0027
7
6
5
4
3
2
1
0
R
W
0
0
0
0
SC3
SC2
SC1
SC0
Reset
0
0
0
0
0
0
0
0
Unimplemented or Reserved
Figure 20-10. Debug State Control Register 1 (DBGSCR1)
Read: Anytime
Write: Anytime when DBG not armed.
This register is visible at 0x0027 only with COMRV[1:0] = 00. The state control register 1 selects the
targeted next state while in State1. The matches refer to the match channels of the comparator match
control logic as depicted in Figure 20-1 and described in Section 20.3.1.11.1, “Debug Comparator Control
Register (DBGXCTL)”. Comparators must be enabled by setting the comparator enable bit in the
associated DBGXCTL control register.
Table 20-20. DBGSCR1 Field Descriptions
Field
Description
3–0
State Control Bits — These bits select the targeted next state while in State1, based upon the match event.
SC[3:0}
See Table 20-21.
The trigger priorities described in Table 20-38 dictate that in the case of simultaneous matches, the match on
the lower channel number ([0,1,2,3) has priority. The SC[3:0] encoding ensures that a match leading to final
state has priority over all other matches.
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Chapter 20 Debug (S12XDBGV2)
Table 20-21. State1 Sequencer Next Sate Selection
Description
SC[3:0]
0000
0001
0010
0011
0100
0101
Any match triggers to state2
Any match triggers to state3
Any match triggers to final state
Match2 triggers to State2....... Other matches have no effect
Match2 triggers to State3....... Other matches have no effect
Match2 triggers to final state....... Other matches have no effect
0110
0111
1000
1001
1010
1011
1100
1101
1110
1111
Match0 triggers to State2....... Match1 triggers to State3....... Other matches have no effect
Match1 triggers to State3....... Match0 triggers final state....... Other matches have no effect
Match0 triggers to State2....... Match2 triggers to State3....... Other matches have no effect
Match2 triggers to State3....... Match0 triggers final state....... Other matches have no effect
Match1 triggers to State2....... Match3 triggers to State3....... Other matches have no effect
Match3 triggers to State3....... Match1 triggers to final state....... Other matches have no effect
Reserved
Reserved
Reserved
Reserved
20.3.1.9 Debug State Control Register 2 (DBGSCR2)
0x0027
7
6
5
4
3
2
1
0
R
W
0
0
0
0
SC3
SC2
SC1
SC0
Reset
0
0
0
0
0
0
0
0
Unimplemented or Reserved
Figure 20-11. Debug State Control Register 2 (DBGSCR2)
Read: Anytime
Write: Anytime when DBG not armed.
This register is visible at 0x0027 only with COMRV[1:0] = 01. The state control register 2 selects the
targeted next state while in State2. The matches refer to the match channels of the comparator match
control logic as depicted in Figure 20-1 and described in Section 20.3.1.11.1, “Debug Comparator Control
Register (DBGXCTL)”. Comparators must be enabled by setting the comparator enable bit in the
associated DBGXCTL control register.
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Chapter 20 Debug (S12XDBGV2)
Table 20-22. DBGSCR2 Field Descriptions
Description
Field
3–0
State Control Bits — These bits select the targeted next state while in State2, based upon the match event.
SC[3:0}
See Table 20-23.
The trigger priorities described in Table 20-38 dictate that in the case of simultaneous matches, the match on
the lower channel number ([0,1,2,3) has priority. The SC[3:0] encoding ensures that a match leading to final
state has priority over all other matches.
Table 20-23. State2 Sequencer Next State Selection
Description
SC[3:0]
0000
0001
0010
0011
0100
0101
0110
0111
1000
1001
1010
1011
1100
1101
1110
1111
Any match triggers to state1
Any match triggers to state3
Any match triggers to final state
Match3 triggers to State1....... Other matches have no effect
Match3 triggers to State3....... Other matches have no effect
Match3 triggers to final state....... Other matches have no effect
Match0 triggers to State1....... Match1 triggers to State3....... Other matches have no effect
Match1 triggers to State3....... Match0 triggers final state....... Other matches have no effect
Match0 triggers to State1....... Match2 triggers to State3....... Other matches have no effect
Match2 triggers to State3....... Match0 triggers final state....... Other matches have no effect
Match1 triggers to State1....... Match3 triggers to State3....... Other matches have no effect
Match3 triggers to State3....... Match1 triggers final state....... Other matches have no effect
Reserved
Reserved
Reserved
Reserved
20.3.1.10 Debug State Control Register 3 (DBGSCR3)
0x0027
7
6
5
4
3
2
1
0
R
W
0
0
0
0
SC3
SC2
SC1
SC0
Reset
0
0
0
0
0
0
0
0
Unimplemented or Reserved
Figure 20-12. Debug State Control Register 3 (DBGSCR3)
Read: Anytime
Write: Anytime when DBG not armed.
This register is visible at 0x0027 only with COMRV[1]=1. The state control register 3 selects the targeted
next state while in State3. The matches refer to the match channels of the comparator match control logic
as depicted in Figure 20-1 and described in Section 20.3.1.11.1, “Debug Comparator Control Register
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(DBGXCTL)”. Comparators must be enabled by setting the comparator enable bit in the associated
DBGXCTL control register.
Table 20-24. DBGSCR3 Field Descriptions
Field
Description
3–0
State Control Bits — These bits select the targeted next state while in State3, based upon the match event.
SC[3:0]
The trigger priorities described in Table 20-38 dictate that in the case of simultaneous matches, the match on
the lower channel number (0,1,2,3) has priority. The SC[3:0] encoding ensures that a match leading to final state
has priority over all other matches.
Table 20-25. State3 Sequencer Next State Selection
Description
SC[3:0]
0000
0001
0010
0011
0100
0101
0110
0111
1000
1001
1010
1011
1100
1101
1110
1111
Any match triggers to state1
Any match triggers to state2
Any match triggers to final state
Match0 triggers to State1....... Other matches have no effect
Match0 triggers to State2....... Other matches have no effect
Match0 triggers to final state....... Other matches have no effect
Match1 triggers to State1....... Other matches have no effect
Match1 triggers to State2....... Other matches have no effect
Match1 triggers to final state....... Other matches have no effect
Match2 triggers to State2....... Match0 triggers to final state....... Other matches have no effect
Match1 triggers to State1....... Match3 triggers to State2....... Other matches have no effect
Match3 triggers to State2....... Match1 triggers to final state....... Other matches have no effect
Match2 triggers to final state....... Other matches have no effect
Match3 triggers to final state....... Other matches have no effect
Reserved
Reserved
20.3.1.11 Comparator Register Descriptions
Each comparator has a bank of registers that are visible through an 8-byte window in the DBG module
register address map. Comparators A and C consist of 8 register bytes (3 address bus compare registers, 2
data bus compare registers, 2 data bus mask registers and a control register).
Comparators B and D consist of 4 register bytes (3 address bus compare registers and a control register).
Each set of comparator registers is accessible in the same 8-byte window of the register address map and
can be accessed using the COMRV bits in the DBGC1 register. If the Comparators B or D are accessed
through the 8-byte window, then only the address and control bytes are visible, the 4 bytes associated with
data bus and data bus masking read as 0 and cannot be written. Furthermore the control registers for
comparators B and D differ from those of comparators A and C.
Table 20-26. Comparator Register Layout
0x0028
CONTROL
Read/Write
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Chapter 20 Debug (S12XDBGV2)
Table 20-26. Comparator Register Layout
0x0029
0x002A
0x002B
0x002C
0x002D
0x002E
0x002F
ADDRESS HIGH
Read/Write
Read/Write
Read/Write
Read/Write
Read/Write
Read/Write
Read/Write
ADDRESS MEDIUM
ADDRESS LOW
DATA HIGH COMPARATOR
DATA LOW COMPARATOR
DATA HIGH MASK
Comparator A and C only
Comparator A and C only
Comparator A and C only
Comparator A and C only
DATA LOW MASK
20.3.1.11.1 Debug Comparator Control Register (DBGXCTL)
The contents of this register bits 7 and 6 differ depending upon which comparator registers are visible in
the 8-byte window of the DBG module register address map
0x0028
7
6
5
4
3
2
1
0
R
W
0
NDB
TAG
BRK
RW
RWE
SRC
COMPE
Reset
0
0
0
0
0
0
0
0
Unimplemented or Reserved
Figure 20-13. Debug Comparator Control Register (Comparators A and C)
0x0028
7
6
5
4
3
2
1
0
R
W
SZE
SZ
TAG
BRK
RW
RWE
SRC
COMPE
Reset
0
0
0
0
0
0
0
0
Figure 20-14. Debug Comparator Control Register (Comparators B and D)
Read: Anytime
Write: Anytime when DBG not armed.
Table 20-27. DBGXCTL Field Descriptions
Field
Description
Size Comparator Enable Bit — The SZE bit controls whether access size comparison is enabled for the
7
(COMPB/D) associated comparator. This bit is ignored if the TAG bit in the same register is set.
SZE
0 Word/Byte access size is not used in comparison
1 Word/Byte access size is used in comparison
6
Not Data Bus Compare — The NDB bit controls whether the match occurs when the data bus matches the
(COMPA/C) comparator register value or when the data bus differs from the register value. Furthermore database bits can
NDB
be individually masked using the comparator data mask registers. This bit is only available for comparators A
and C. This bit is ignored if the TAG bit in the same register is set. This bit position has an SZ functionality for
comparators B and D.
0 Match on data bus equivalence to comparator register contents
1 Match on data bus difference to comparator register contents
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Chapter 20 Debug (S12XDBGV2)
Table 20-27. DBGXCTL Field Descriptions (continued)
Description
Field
6
Size Comparator Value Bit — The SZ bit selects either word or byte access size in comparison for the
(COMP B/D) associated comparator. This bit is ignored if the SZE bit is cleared or if the TAG bit in the same register is set.
SZ
This bit position has NDB functionality for comparators A and C
0 Word access size will be compared
1 Byte access size will be compared
5
TAG
Tag Select — This bit controls whether the comparator match will cause a trigger or tag the opcode at the
matched address. Tagged opcodes trigger only if they reach the execution stage of the instruction queue.
0 Trigger immediately on match
1 On match, tag the opcode. If the opcode is about to be executed a trigger is generated
4
BRK
Break — This bit controls whether a comparator match can cause an immediate breakpoint independent of state
sequencer state. The module breakpoints must be enabled using the DBGC1 bits DBGBRK[1:0].
0 Breakpoints may only be generated from this channel when the state machine reaches final state.
1 A match on this channel generates an immediate breakpoint, tracing, if active, is terminated and the module
disarmed.
3
RW
Read/Write Comparator Value Bit — The RW bit controls whether read or write is used in compare for the
associated comparator. The RW bit is not used if RWE = 0.
0 Write cycle will be matched
1 Read cycle will be matched
2
Read/Write Enable Bit — The RWE bit controls whether read or write comparison is enabled for the associated
comparator. This bit is not useful for tagged operations.
1 Read/Write is used in comparison
RWE
0 Read/Write is not used in comparison
1
SRC
SRC — Determines mapping of comparator to CPU or XGATE
0 The comparator is mapped to CPU busses
1 The comparator is mapped to XGATE address and data busses
0
Comparator Enable Bit— Determines if comparator is enabled
0 The comparator is not enabled
COMPE
1 The comparator is enabled for state sequence triggers or tag generation
Table 20-28 shows the effect for RWE and RW on the comparison conditions. These bits are not useful for
tagged operations since the trigger occurs based on the tagged opcode reaching the execution stage of the
instruction queue. Thus, these bits are ignored if tagged triggering is selected.
Table 20-28. Read or Write Comparison Logic Table
RWE Bit
RW Bit
RW Signal
Comment
0
0
1
1
1
1
x
x
0
0
1
1
0
1
0
1
0
1
RW not used in comparison
RW not used in comparison
Write data bus
No match
No match
Read data bus
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Chapter 20 Debug (S12XDBGV2)
20.3.1.11.2 Debug Comparator Address High Register (DBGXAH)
0x0029
7
6
5
4
3
2
1
0
R
W
0
Bit 22
21
20
19
18
17
Bit 16
Reset
0
0
0
0
0
0
0
0
Unimplemented or Reserved
Figure 20-15. Debug Comparator Address High Register (DBGXAH)
Read: Anytime
Write: Anytime when DBG not armed.
Table 20-29. DBGXAH Field Descriptions
Field
Description
Comparator Address High Compare Bits — The comparator address high compare bits control whether the
6–0
Bits [22:16] selected comparator will compare the address bus bits [22:16] to a logic 1 or logic 0. This register byte is ignored
for XGATE compares.
0 Compare corresponding address bit to a logic 0
1 Compare corresponding address bit to a logic 1
20.3.1.11.3 Debug Comparator Address Mid Register (DBGXAM)
0x002A
7
6
5
4
3
2
1
0
R
W
Bit 15
14
13
12
11
10
9
Bit 8
Reset
0
0
0
0
0
0
0
0
Figure 20-16. Debug Comparator Address Mid Register (DBGXAM)
Read: Anytime
Write: Anytime when DBG not armed.
Table 20-30. DBGXAM Field Descriptions
Field
Description
Comparator Address Mid Compare Bits — The comparator address mid compare bits control whether the
7–0
Bits [15:8] selected comparator will compare the address bus bits [15:8] to a logic 1 or logic 0.
0 Compare corresponding address bit to a logic 0
1 Compare corresponding address bit to a logic 1
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Chapter 20 Debug (S12XDBGV2)
20.3.1.11.4 Debug Comparator Address Low Register (DBGXAL)
0x002B
7
6
5
4
3
2
1
0
R
W
Bit 7
6
5
4
3
2
1
Bit 0
Reset
0
0
0
0
0
0
0
0
Figure 20-17. Debug Comparator Address Low Register (DBGXAL)
Read: Anytime
Write: Anytime when DBG not armed.
Table 20-31. DBGXAL Field Descriptions
Field
Description
7–0
Bits [7:0]
Comparator Address Low Compare Bits — The comparator address low compare bits control whether the
selected comparator will compare the address bus bits [7:0] to a logic 1 or logic 0.
0 Compare corresponding address bit to a logic 0
1 Compare corresponding address bit to a logic 1
20.3.1.11.5 Debug Comparator Data High Register (DBGXDH)
0x002C
7
6
5
4
3
2
1
0
R
W
Bit 15
14
13
12
11
10
9
Bit 8
Reset
0
0
0
0
0
0
0
0
Figure 20-18. Debug Comparator Data High Register (DBGXDH)
Read: Anytime
Write: Anytime when DBG not armed.
Table 20-32. DBGXDH Field Descriptions
Field
Description
Comparator Data High Compare Bits — The comparator data high compare bits control whether the selected
7–0
Bits [15:8] comparator compares the data bus bits [15:8] to a logic 1 or logic 0. The comparator data compare bits are only
used in comparison if the corresponding data mask bit is logic 1. This register is available only for comparators
A and C.
0 Compare corresponding data bit to a logic 0
1 Compare corresponding data bit to a logic 1
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Chapter 20 Debug (S12XDBGV2)
20.3.1.11.6 Debug Comparator Data Low Register (DBGXDL)
0x002D
7
6
5
4
3
2
1
0
R
W
Bit 7
6
5
4
3
2
1
Bit 0
Reset
0
0
0
0
0
0
0
0
Figure 20-19. Debug Comparator Data Low Register (DBGXDL)
Read: Anytime
Write: Anytime when DBG not armed.
Table 20-33. DBGXDL Field Descriptions
Field
Description
7–0
Bits [7:0]
Comparator Data Low Compare Bits — The comparator data low compare bits control whether the selected
comparator compares the data bus bits [7:0] to a logic 1 or logic 0. The comparator data compare bits are only
used in comparison if the corresponding data mask bit is logic 1. This register is available only for comparators
A and C.
0 Compare corresponding data bit to a logic 0
1 Compare corresponding data bit to a logic 1
20.3.1.11.7 Debug Comparator Data High Mask Register (DBGXDHM)
0x002E
7
6
5
4
3
2
1
0
R
W
Bit 15
14
13
12
11
10
9
Bit 8
Reset
0
0
0
0
0
0
0
0
Figure 20-20. Debug Comparator Data High Mask Register (DBGXDHM)
Read: Anytime
Write: Anytime when DBG not armed.
Table 20-34. DBGXDHM Field Descriptions
Field
Description
Comparator Data High Mask Bits — The comparator data high mask bits control whether the selected
7–0
Bits [15:8] comparator compares the data bus bits [15:8] to the corresponding comparator data compare bits. This register
is available only for comparators A and C.
0 Do not compare corresponding data bit
1 Compare corresponding data bit
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Chapter 20 Debug (S12XDBGV2)
20.3.1.11.8 Debug Comparator Data Low Mask Register (DBGXDLM)
0x002F
7
6
5
4
3
2
1
0
R
W
Bit 7
6
5
4
3
2
1
Bit 0
Reset
0
0
0
0
0
0
0
0
Figure 20-21. Debug Comparator Data Low Mask Register (DBGXDLM)
Read: Anytime
Write: Anytime when DBG not armed.
Table 20-35. DBGXDLM Field Descriptions
Field
Description
7–0
Bits [7:0]
Comparator Data Low Mask Bits — The comparator data low mask bits control whether the selected
comparator compares the data bus bits [7:0] to the corresponding comparator data compare bits. This register
is available only for comparators A and C.
0 Do not compare corresponding data bit
1 Compare corresponding data bit
20.4 Functional Description
This section provides a complete functional description of the DBG module. If the part is in secure mode,
the DBG module can generate breakpoints but tracing is not possible.
20.4.1 DBG Operation
Arming the DBG module by setting ARM in DBGC1 allows triggering, and storing of data in the trace
buffer and can be used to cause breakpoints to the CPU or the XGATE module. The DBG module is made
up of 4 main blocks, the comparators, control logic, the state sequencer and the trace buffer.
The comparators monitor the bus activity of the CPU and XGATE modules. Comparators can be
configured to monitor address and databus. Comparators can also be configured to mask out individual
data bus bits during a compare and to use R/W and word/byte access qualification in the comparison. When
a match with a comparator register value occurs the associated control logic can trigger the state sequencer
to another state (Figure 20-23). Either forced or tagged triggers are possible. Using a forced trigger, the
trigger is generated immediately on a comparator match. Using a tagged trigger, at a comparator match,
the instruction opcode is tagged and only if the instruction reaches the execution stage of the instruction
queue is a trigger generated. In the case of a transition to final state, bus tracing is triggered and/or a
breakpoint can be generated. Tracing of both CPU and/or XGATE bus activity is possible.
Independent of the state sequencer, a breakpoint can be triggered by the external TAGHI / TAGLO signals,
by an XGATE S/W breakpoint request or by writing to the TRIG bit in the DBGC1 control register.
The trace buffer is visible through a 2-byte window in the register address map and can be read out using
standard 16-bit word reads.
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TAGS
TAGHITS
EXTERNAL TAGHI / TAGLO
BREAKPOINT REQUESTS
CPU & XGATE
XGATE S/W BREAKPOINT REQUEST
SECURE
MATCH0
MATCH1
MATCH2
MATCH3
TAG &
TRIGGER
CONTROL
LOGIC
TRIGGER
STATE
COMPARATOR A
CPU BUS
STATE
SEQUENCER
COMPARATOR B
COMPARATOR C
XGATE BUS
COMPARATOR D
TRACE
CONTROL
TRIGGER
TRACE
BUFFER
READ TRACE DATA (DBG READ DATA BUS)
Figure 20-22. DBG Overview
20.4.2 Comparator Modes
The DBG contains 4 comparators, A, B, C, and D. Each comparator can be configured to monitor either
CPU or XGATE busses using the SRC bit in the corresponding comparator control register. Each
comparator compares the selected address bus with the address stored in DBGXAH, DBGXAM and
DBGXAL. Furthermore comparators A and C also compare the data buses to the data stored in DBGXDH,
DBGXDL and allow masking of individual data bus bits.
All comparators are disabled in BDM and during BDM accesses.
The comparator match control logic (see Figure 20-22) configures comparators to monitor the busses for
an exact address or an address range, whereby either an access inside or outside the specified range
generates a match condition. The comparator configuration is controlled by the control register contents
and the range control by the DBGC2 contents.
On a match a trigger can initiate a transition to another state sequencer state (see Section 20.4.3, “Trigger
Modes”). The comparator control register also allows the type of access to be included in the comparison
through the use of the RWE,RW,SZE and SZ bits. The RWE bit controls whether read or write comparison
is enabled for the associated comparator and the RW bit selects either a read or write access for a valid
match. Similarly the SZE and SZ bits allows the size of access (word or byte) to be considered in the
compare. Only comparators B and D feature SZE and SZ.
The TAG bit in each comparator control register is used to determine the triggering condition. By setting
TAG, the comparator will qualify a match with the output of opcode tracking logic and a trigger occurs
before the tagged instruction executes (tagged-type trigger). Whilst tagging the RW, RWE, SZE and SZ
bits are ignored and the comparator register must be loaded with the exact opcode address.
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If the TAG bit is clear (forced type trigger) a comparator match is generated when the selected address
appears on the system address bus. If the selected address is an opcode address, the match is generated
when the opcode is fetched from the memory. This precedes the instruction execution by an indefinite
number of cycles due to instruction pipe lining. For a comparator match of an opcode at an odd address
when TAG = 0, the corresponding even address must be contained in the comparator register. Thus for an
opcode at odd address (n), the comparator register must contain address (n – 1).
Once a successful comparator match has occurred, the condition that caused the original match is not
verified again on subsequent matches. Thus if a particular data value is verified at a given address, this
address may not still contain that data value when a subsequent match occurs.
Comparators C and D can also be used to select an address range to trace from. This is determined by the
TRANGE bits in the DBGTCR register. The TRANGE encoding is shown in Table 20-10. If the TRANGE
bits select a range definition using comparator D, then comparator D is configured for trace range
definition and cannot be used for address bus comparisons. Similarly if the TRANGE bits select a range
definition using comparator C, then comparator C is configured for trace range definition and cannot be
used for address bus comparisons.
Match[0,1,2,3] map directly to comparators [A,B,C,D] respectively, except in range modes (see
Section 20.3.1.4, “Debug Control Register2 (DBGC2)”). Comparator priority rules are described in the
trigger priority (see Section 20.4.3.6, “Trigger Priorities”).
20.4.2.1 Exact Address Comparator Match (Comparators A and C)
With range comparisons disabled, the match condition is an exact equivalence of address/data bus with the
value stored in the comparator address/data registers. Further qualification of the type of access (R/W,
word/byte) is possible.
Comparators A and C do not feature SZE or SZ control bits, thus the access size is not compared. The exact
address is compared, thus with the comparator address register loaded with address (n) a misaligned word
access of address (n-1) also accesses (n) but does not cause a match Table 20-37 lists access considerations
without data bus compare. Table 20-36 lists access considerations with data bus comparison. To compare
byte accesses DBGXDH must be loaded with the data byte. The low byte must be masked out using the
DBGXDLM mask register. On word accesses data byte of the lower address is mapped to DBGXDH.
Table 20-36. Comparator A and C Data Bus Considerations
Access
Address
DBGxDH
DBGxDL
DBGxDHM
DBGxDLM
Example Valid Match
Word
Byte
ADDR[n]
ADDR[n]
ADDR[n]
ADDR[n]
Data[n]
Data[n]
Data[n]
x
Data[n+1]
0x_FF
0x_FF
0x_FF
0x_00
0x_FF
0x_00
0x_00
0x_FF
MOVW #$WORD ADDR[n]
MOVB #$BYTE ADDR[n]
MOVW #$WORD ADDR[n]
MOVW #$WORD ADDR[n]
x
x
Word
Word
Data[n+1]
Comparators A and C feature an NDB control bit to determine if a match occurs when the data bus differs
to comparator register contents or when the data bus is equivalent to the comparator register contents.
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20.4.2.2 Exact Address Comparator Match (Comparators B and D)
Comparators B and D feature SZ and SZE control bits. If SZE is clear, then the comparator address match
qualification functions the same as for comparators A and C.
If the SZE bit is set the access size (word or byte) is compared with the SZ bit value such that only the
specified type of access causes a match. Thus, if configured for a byte access of a particular address, a word
access covering the same address does not lead to match.
Table 20-37. Comparator Access Size Considerations
Comparator
Address
SZE SZ8
Condition For Valid Match
1
1
Comparators
A and C
ADDR[n]
-
-
Word and byte accesses of ADDR[n]
MOVB #$BYTE ADDR[n]
MOVW #$WORD ADDR[n]
Comparators
B and D
ADDR[n]
0
X
Word and byte accesses of ADDR[n]
MOVB #$BYTE ADDR[n]
MOVW #$WORD ADDR[n]
1
Comparators
B and D
ADDR[n]
ADDR[n]
1
1
0
1
Word accesses of ADDR[n]
MOVW #$WORD ADDR[n]
Comparators
B and D
Byte accesses of ADDR[n]
MOVB #$BYTE ADDR[n]
1
A word access of ADDR[n-1] also accesses ADDR[n] but does not generate a match.
The comparator address register must contain the exact address used in the code.
20.4.2.3 Range Comparisons
When using the AB comparator pair for a range comparison, the data bus can also be used for qualification
by using the comparator A data and data mask registers. Furthermore the DBGACTL RW and RWE bits
can be used to qualify the range comparison on either a read or a write access. The corresponding
DBGBCTL bits are ignored. Similarly when using the CD comparator pair for a range comparison, the
data bus can also be used for qualification by using the comparator C data and data mask registers.
Furthermore the DBGCCTL RW and RWE bits can be used to qualify the range comparison on either a
read or a write access if tagging is not selected. The corresponding DBGDCTL bits are ignored. The SZE
and SZ control bits are ignored in range mode. The comparator A and C TAG bits are used to tag range
comparisons for the AB and CD ranges respectively. The comparator B and D TAG bits are ignored in
range modes. In order for a range comparison using comparators A and B, both COMPEA and COMPEB
must be set; to disable range comparisons both must be cleared. Similarly for a range CD comparison, both
COMPEC and COMPED must be set. If a range mode is selected SRCA and SRCB must select the same
source (S12X or XGATE). Similarly SRCC and SRCD must select the same source. When configured for
range comparisons and tagging, the ranges are accurate only to word boundaries.
20.4.2.3.1
Inside Range (CompAC_Addr ≤ Address ≤ CompBD_Addr)
In the inside range comparator mode, either comparator pair A and B or comparator pair C and D can be
configured for range comparisons. This configuration depends upon the control register (DBGC2). The
match condition requires that a valid match for both comparators happens on the same bus cycle. A match
condition on only one comparator is not valid. An aligned word access which straddles the range boundary
will cause a trigger only if the aligned address is inside the range.
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20.4.2.3.2
Outside Range (Address < CompAC_Addr or Address > CompBD_Addr)
In the outside range comparator mode, either comparator pair A and B or comparator pair C and D can be
configured for range comparisons. A single match condition on either of the comparators is recognized as
valid. An aligned word access which straddles the range boundary will cause a trigger only if the aligned
address is outside the range.
Outside range mode in combination with tagged triggers can be used to detect if the opcode fetches are
from an unexpected range. In forced trigger modes the outside range trigger would typically be activated
at any interrupt vector fetch or register access. This can be avoided by setting the upper range limit to
0x7FFFFF or lower range limit to 0x000000 respectively.
When comparing the XGATE address bus in outside range mode, the initial vector fetch as determined by
the vector contained in the XGATE XGVBR register should be taken into consideration. The XGVBR
register and hence vector address can be modified.
20.4.3 Trigger Modes
Trigger modes are used as qualifiers for a state sequencer change of state. The control logic determines the
trigger mode and provides a trigger to the state sequencer. The individual trigger modes are described in
the following sections.
20.4.3.1 Trigger On Comparator Match
If a comparator match occurs, a trigger occurs to initiate a transition to another state sequencer state and
the corresponding flags in DBGSR are set. For a comparator match to trigger firstly the comparator must
be enabled by setting the COMPE bit in the corresponding comparator control register. Secondly the state
control register for the current state must enable the match for that state. The state control registers allow
for different matches to be enabled in each of the states 1 to 3.
20.4.3.2 Trigger On Comparator Related Taghit
If either a CPU or XGATE taghit occurs a transition to another state sequencer state is initiated and the
corresponding DBGSR flags are set. For a comparator related taghit to occur, the DBG must first generate
tags based on comparator matches. When the tagged instruction reaches the execution stage of the
instruction queue a taghit is generated by the CPU/XGATE.
20.4.3.3 External Tag Trigger
In external tagging trigger mode, the TAGLO and TAGHI pins (mapped to device pins) are used to tag an
instruction. This function can be used as another breakpoint source. When the tagged opcode reaches the
execution stage of the instruction queue a transition to the disarmed state0 occurs, ending the debug session
and generating a breakpoint, if breakpoints are enabled. External tagging is only possible in device
emulation modes.
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20.4.3.4 Trigger On XGATE S/W Breakpoint Request
The XGATE S/W breakpoint request issues a forced breakpoint request to the CPU immediately
independent of DBG settings. If the debug module is armed triggers the state sequencer into the disarmed
state. Active tracing sessions are terminated immediately, thus if tracing has not yet begun using begin-
trigger, no trace information is stored. XGATE generated breakpoints are independent of the DBGBRK
bits. The XGSBPE bit in DBGC1 determines if the XGATE S/W breakpoint function is enabled. The BDM
bit in DBGC1 determines if the XGATE requested breakpoint causes the system to enter BDM mode or
initiate a software interrupt (SWI).
20.4.3.5 Immediate Trigger
At any time independent of comparator matches or external tag signals it is possible to initiate a tracing
session and/or breakpoint by writing to the TRIG bit in DBGC1. This triggers the state sequencer into the
final state and issues a forced breakpoint request to both CPU and XGATE.
20.4.3.6 Trigger Priorities
In case of simultaneous triggers, the priority is resolved according to Table 20-38. The lower priority
trigger is suppressed. It is thus possible to miss a lower priority trigger if it occurs simultaneously with a
trigger of a higher priority. The trigger priorities described in Table 20-38 dictate that in the case of
simultaneous matches, the match on the lower channel number ([0,1,2,3) has priority. The SC[3:0]
encoding ensures that a match leading to final state has priority over all other matches independent of
current state sequencer state. When configured for range modes a simultaneous match of comparators A
and C generates an active match0 while match2 is suppressed.
Table 20-38. Trigger Priorities
Priority
Source
Action
Highest
XGATE
Immediate forced breakpoint......(Tracing terminated immediately).
Enter final state
TRIG
External TAGHI/TAGLO
Match0 (force or tag hit)
Match1 (force or tag hit)
Match2 (force or tag hit)
Match3 (force or tag hit)
Enter State0
Trigger to next state as defined by state control registers
Trigger to next state as defined by state control registers
Trigger to next state as defined by state control registers
Trigger to next state as defined by state control registers
Lowest
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20.4.4 State Sequence Control
ARM = 0
ARM = 1
ARM = 0
State 0
(Disarmed)
State1
State2
Session complete
(disarm)
State3
Final State
ARM=0
Figure 20-23. State Sequencer Diagram
The state sequence control allows a defined sequence of events to provide a trigger point for tracing of data
in the trace buffer. Once the DBG module has been armed by setting the ARM bit in the DBGC1 register,
then State1 of the state sequencer is entered. Further transitions between the states are then controlled by
the state control registers and depend upon a selected trigger mode condition being met. From final state
the only permitted transition is back to the disarmed state0. Transition between any of the states 1 to 3 is
not restricted. Each transition updates the SSF[2:0] flags in DBGSR accordingly to indicate the current
state.
Alternatively writing to the TRIG bit in DBGSC1, the final state is entered and tracing starts immediately
if the TSOURCE bits are configured for tracing.
A tag hit through TAGHI/TAGLO causes a breakpoint, if breakpoints are enabled, and ends tracing
immediately independent of the trigger alignment bits TALIGN[1:0].
Furthermore, each comparator channel can be individually configured to generate an immediate
breakpoint when a match occurs through the use of the BRK bits in the DBGxCTL registers independent
of the state sequencer state. Thus it is possible to generate an immediate breakpoint on selected channels,
while a state sequencer transition can be initiated by a match on other channels.
An XGATE S/W breakpoint request, if enabled causes a transition to the final state and generates a
breakpoint request to the CPU immediately.
If neither tracing nor breakpoints are enabled then, when a forced match triggers to final state, it can only
be returned to the disarmed state0 by clearing the ARM bit by software. This also applies to the case that
BDM breakpoints are enabled, but the BDM is disabled. Furthermore if neither tracing nor breakpoints are
enabled, forced triggers on channels with BRK set cause a transition to the state determined by the state
sequencer as if the BRK bit were not being used.
If neither tracing nor breakpoints are enabled then when a tagged match triggers to final state, the state
sequencer returns to the disarmed state0.
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Chapter 20 Debug (S12XDBGV2)
20.4.4.1 Final State
On entering final state a trigger may be issued to the trace buffer according to the trace position control as
defined by the TALIGN field (see Section 20.3.1.3, “Debug Trace Control Register (DBGTCR)”). If the
TSOURCE bits in the trace control register DBGTCR are cleared then the trace buffer is disabled and the
transition to final state can only generate a breakpoint request. In this case or upon completion of a tracing
session when tracing is enabled, the ARM bit in the DBGC1 register is cleared, returning the module to
the disarmed state0. If tracing is enabled a breakpoint request can occur at the end of the tracing session.
20.4.5 Trace Buffer Operation
The trace buffer is a 64 lines deep by 64-bits wide RAM array. The DBG module stores trace information
in the RAM array in a circular buffer format. The CPU accesses the RAM array through a register window
read via the CPU, an internal pointer into the RAM is incremented so that the next read will receive fresh
information. Data is stored in the format shown in Table 20-39. After each store the counter register bits
DBGCNT[6:0] are incremented. Tracing of CPU activity is disabled when the BDM is active but tracing
of XGATE activity is still possible. Reading the trace buffer while the BDM is active returns invalid data
and the trace buffer pointer is not incremented.
Using the TALIGN bits (see Section 20.3.1.3, “Debug Trace Control Register (DBGTCR)”) it is possible
to align the trigger with the end, the middle or the beginning of a tracing session.
If end or mid tracing is selected, tracing begins when the ARM bit in DBGC1 is set and State1 is entered.
The transition to final state if end is selected signals the end of the tracing session. The transition to final
state if mid is selected signals that another 32 lines will be traced before ending the tracing session. Tracing
with begin-trigger starts at the opcode of the trigger.
20.4.5.1.1
Storing with Begin-Trigger
Storing with begin-trigger, data is not stored in the trace buffer until the final state is entered. Once the
trigger condition is met the DBG module will remain armed until 64 lines are stored in the trace buffer. If
the trigger is at the address of the change-of-flow instruction the change of flow associated with the trigger
will be stored in the trace buffer. Using begin-trigger together with tagging, if the tagged instruction is
about to be executed then the trace is started. Upon completion of the tracing session the breakpoint is
generated, thus the breakpoint does not occur at the tagged instruction boundary.
20.4.5.1.2
Storing with Mid-Trigger
Storing with mid-trigger, data is stored in the trace buffer as soon as the DBG module is armed. When the
trigger condition is met, another 32 lines will be traced before ending the tracing session, irrespective of
the number of lines stored before the trigger occurred, then the DBG module is disarmed and no more data
is stored. If the trigger is at the address of a change of flow instruction the trigger event is not stored in the
trace buffer. Using mid-trigger with tagging, if the tagged instruction is about to be executed then the trace
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Chapter 20 Debug (S12XDBGV2)
is continued for another 32 lines. Upon tracing completion the breakpoint is generated, thus the breakpoint
does not occur at the tagged instruction boundary.
20.4.5.1.3
Storing with End-Trigger
Storing with end-trigger, data is stored in the trace buffer until the final state is entered, at which point the
DBG module will become disarmed and no more data will be stored. If the trigger is at the address of a
change of flow instruction the trigger event will not be stored in the trace buffer.
20.4.5.2 Trace Modes
The DBG module can operate in three trace modes. The mode is selected using the TRCMOD bits in the
trace is selected using the TSOURCE bits in the DBGTCR register. The modes are described in the
following subsections. The trace buffer organization is shown in Table 20-39.
20.4.5.2.1
Normal Mode
In normal mode, change of flow (COF) addresses will be stored.
COF addresses are defined as follows for the CPU:
•
•
•
•
Source address of taken conditional branches (long, short, bit-conditional, and loop primitives)
Destination address of indexed JMP, JSR and CALL instruction.
Destination address of RTI, RTS and RTC instructions
Vector address of interrupts, except for SWI and BDM vectors
LBRA, BRA, BSR, BGND as well as non-indexed JMP, JSR, and CALL instructions are not classified as
change of flow and are not stored in the trace buffer.
COF addresses are defined as follows for the XGATE:
•
•
•
Source address of taken conditional branches
Destination address of indexed JAL instructions.
First XGATE code address, determined by the vector contained in the XGATE XGVBR register
Change-of-flow addresses stored include the full 23-bit address bus in the case of CPU, the 16-bit address
bus for the XGATE module and an information byte, which contains a source/destination bit to indicate
whether the stored address was a source address or destination address.
20.4.5.2.2
Loop1 Mode
Loop1 mode, similarly to normal mode also stores only COF address information to the trace buffer, it
however allows the filtering out of redundant information.
The intent of loop1 mode is to prevent the trace buffer from being filled entirely with duplicate information
from a looping construct such as delays using the DBNE instruction or polling loops using
BRSET/BRCLR instructions. Immediately after address information is placed in the trace buffer, the DBG
module writes this value into a background register. This prevents consecutive duplicate address entries in
the trace buffer resulting from repeated branches.
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Loop1 mode only inhibits consecutive duplicate source address entries that would typically be stored in
most tight looping constructs. It does not inhibit repeated entries of destination addresses or vector
addresses, since repeated entries of these would most likely indicate a bug in the user’s code that the DBG
module is designed to help find.
NOTE
In certain very tight loops, the source address will have already been fetched
again before the background comparator is updated. This results in the
source address being stored twice before further duplicate entries are
suppressed. This condition occurs with branch-on-bit instructions when the
branch is fetched by the first P-cycle of the branch or with loop-construct
instructions in which the branch is fetched with the first or second P cycle.
See examples below:
LOOP
INX
BRCLR
;1-byte instruction fetched by 1st P-cycle of BRCLR
CMPTMP,#$0c,LOOP ;the BRCLR instruction also will be fetched by 1st P-cycle
;of BRCLR
LOOP2
BRN*
NOP
; 2-byte instruction fetched by 1st P-cycle of DBNE
; 1-byte instruction fetched by 2nd P-cycle of DBNE
DBNE
A,LOOP2
; this instruction also fetched by 2nd P-cycle of DBNE
20.4.5.2.3
Detail Mode
In detail mode, address and data for all memory and register accesses is stored in the trace buffer. In the
case of XGATE tracing this means that initialization of the R1 register during a vector fetch is not traced.
This mode is intended to supply additional information on indexed, indirect addressing modes where
storing only the destination address would not provide all information required for a user to determine
where the code is in error. This mode also features information byte storage to the trace buffer, for each
address byte storage. The information byte indicates the size of access (word or byte), the type of access
(read or write).
When tracing CPU activity in detail mode, all cycles are traced except those when the CPU is either in a
free or opcode fetch cycle. In this mode the XGATE program counter is also traced to provide a snapshot
of the XGATE activity. CXINF information byte bits indicate the type of XGATE activity occurring at the
time of the trace buffer entry. When tracing CPU activity alone in detail mode, the address range can be
limited to a range specified by the TRANGE bits in DBGTCR. This function uses comparators C and D
to define an address range inside which CPU activity should be traced (see Table 20-10). Thus, the traced
CPU activity can be restricted to register range accesses.
When tracing XGATE activity in detail mode, all cycles apart from opcode fetch and free cycles are stored
to the trace buffer. Additionally the CPU program counter is stored at the time of the XGATE trace buffer
entry to provide a snapshot of CPU activity.
20.4.5.3 Trace Buffer Organization
The buffer can be used to trace either from CPU, from XGATE or from both sources. An “X” prefix
denotes information from the XGATE module, a “C” prefix denotes information from the CPU.
ADRH,ADRM,ADRL denote address high, middle and low byte respectively. INF bytes contain control
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Chapter 20 Debug (S12XDBGV2)
information (R/W, S/D etc.). The numerical suffix indicates which tracing step. The information format
for loop1 mode is the same as that of normal mode. Whilst tracing from XGATE or CPU only, in normal
or loop1 modes each array line contains data from entries made at 2 separate times, thus in this case the
DBGCNT[0] is incremented after each separate entry. In all other modes, DBGCNT[0] remains cleared
while the other DBGCNT bits are incremented on each trace buffer entry.
XGATE and S12X_CPU COFs occur independently of each other and the profile of COFs for the 2 sources
is totally different. When both sources are being traced in Normal or Loop1 mode, for each single entry
from one source, there may be many entries from the other source and vice versa, depending on user code.
COF events could occur far from each other in the time domain, on consecutive cycles or simultaneously.
If a COF occurs in one source only in a particular cycle, then the trace buffer bytes that are mapped to the
other source are redundant. Info byte bit CDV/XDV indicates that no useful information is stored in these
coincide is a valid trace buffer entry for both made, corresponding to the first line for mode "Both
Normal/Loop1" in Table 20-39.
Single byte data accesses in detail mode are always stored to the low byte of the trace buffer (CDATAL or
XDATAL) and the high byte is cleared. When tracing word accesses, the byte at the lower address is always
stored to trace buffer byte3 and the byte at the higher address is stored to byte2
Table 20-39. Trace Buffer Organization
8-Byte Wide Word Buffer
Mode
7
6
5
4
3
2
1
0
XGATE DETAIL
CXINF1
CXINF2
CADRH1
CADRH2
CADRM1
CADRM2
CADRL1
CADRL2
XDATAH1
XDATAH2
XDATAL1
XDATAL2
XADRM1
XADRM2
XADRL1
XADRL2
CPU
DETAIL
CXINF1
CXINF2
CADRH1
CADRH2
CADRM1
CADRM2
CADRL1
CADRL2
CDATAH1
CDATAH2
CDATAL1
CDATAL2
XADRM1
XADRM2
XADRL1
XADRL2
Both
NORMAL
/ LOOP1
XINF0
XADRM0
XADRM2
XADRL0
XADRL2
CINF0
CINF1
CINF2
CADRH0
CADRH1
CADRM0
CADRM1
CADRL0
CADRL1
1
XINF1
2
XINF2
XGATE
NORMAL
/ LOOP1
XINF1
XINF3
XADRM1
XADRM3
XADRL1
XADRL3
XINF0
XINF2
XADRM0
XADRM2
XADRL0
XADRL2
CPU
NORMAL
/ LOOP1
CINF1
CINF3
CADRH1
CADRH3
CADRM1
CADRM3
CADRL1
CADRL3
CINF0
CINF2
CADRH0
CADRH2
CADRM0
CADRM2
CADRL0
CADRL2
1
2
COF in CPU only. XGATE trace buffer entries in this tracing step are invalid
COF in XGATE only. CPU trace buffer entries in this tracing step are invalid
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20.4.5.3.1
Information Byte Organization
The format of the control information byte for both CPU and XGATE modules is dependent upon the
active trace mode and tracing source as described below. In normal mode or loop1 mode, tracing of
XGATE activity XINF is used to store control information. In normal mode or loop1 mode, tracing of CPU
activity CINF is used to store control information. In detail mode, CXINF contains the control information.
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
XSD
0
0
XDV
0
0
0
0
Figure 20-24. XGATE Information Byte XINF
Table 20-40. XINF Field Descriptions
Description
Field
7
XSD
Source Destination Indicator — This bit indicates if the corresponding stored address is a source or
destination address. This is only used in normal and loop1 mode tracing.
0 Source Address
1 Destination Address
4
XDV
Data Invalid Indicator — This bit indicates if the trace buffer entry is invalid. It is only used when tracing from
both sources in normal and loop1 mode, to indicate that the XGATE trace buffer entry is valid.
0 Trace buffer entry is invalid
1 Trace buffer entry is valid
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
CSD
0
0
CDV
0
0
0
0
Figure 20-25. CPU Information Byte CINF
Table 20-41. CINF Field Descriptions
Description
Field
7
CSD
Source Destination Indicator — This bit indicates if the corresponding stored address is a source or
destination address. This is only used in normal and loop1 mode tracing.
0 Source Address
1 Destination Address
4
CDV
Data Invalid Indicator — This bit indicates if the trace buffer entry is invalid. It is only used when tracing from
both sources in normal and loop1 mode, to indicate that the CPU trace buffer entry is valid.
0 Trace buffer entry is invalid
1 Trace buffer entry is valid
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Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
CFREE
CSZ
CRW
COCF
XACK
XSZ
XRW
XOCF
Figure 20-26. Information Byte CXINF
This describes the format of the information byte used only when tracing from CPU or XGATE in detail
mode. When tracing from the CPU in detail mode, information is stored to the trace buffer on all cycles
except opcode fetch and free cycles. The XGATE entry stored on the same line is a snapshot of the
XGATE program counter. In this case the CSZ and CRW bits indicate the type of access being made by
the CPU, while the XACK and XOCF bits indicate if the simultaneous XGATE cycle is a free cycle (no
bus acknowledge) or opcode fetch cycle. Similarly when tracing from the XGATE in detail mode,
information is stored to the trace buffer on all cycles except opcode fetch and free cycles. The CPU entry
stored on the same line is a snapshot of the CPU program counter. In this case the XSZ and XRW bits
indicate the type of access being made by the XGATE, while the CFREE and COCF bits indicate if the
simultaneous CPU cycle is a free cycle or opcode fetch cycle.
Table 20-42. CXINF Field Descriptions
Field
Description
7
CPU Free Cycle Indicator — This bit indicates if the stored CPU address corresponds to a free cycle. This bit
only contains valid information when tracing the XGATE accesses in detail mode.
0 Stored information corresponds to free cycle
CREE
1 Stored information does not correspond to free cycle
6
Access Type Indicator — This bit indicates if the access was a byte or word size access.This bit only contains
CSZ
valid information when tracing CPU activity in detail mode.
0 Word Access
1 Byte Access
5
Read Write Indicator — This bit indicates if the corresponding stored address corresponds to a read or write
CRW
access. This bit only contains valid information when tracing CPU activity in detail mode.
0 Write Access
1 Read Access
4
CPU Opcode Fetch Indicator — This bit indicates if the stored address corresponds to an opcode fetch cycle.
This bit only contains valid information when tracing the XGATE accesses in detail mode.
0 Stored information does not correspond to opcode fetch cycle
COCF
1 Stored information corresponds to opcode fetch cycle
3
XGATE Access Indicator — This bit indicates if the stored XGATE address corresponds to a free cycle. This
bit only contains valid information when tracing the CPU accesses in detail mode.
0 Stored information corresponds to free cycle
XACK
1 Stored information does not correspond to free cycle
2
Access Type Indicator — This bit indicates if the access was a byte or word size access. This bit only contains
XSZ
valid information when tracing XGATE activity in detail mode.
0 Word Access
1 Byte Access
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Table 20-42. CXINF Field Descriptions (continued)
Description
Field
1
Read Write Indicator — This bit indicates if the corresponding stored address corresponds to a read or write
XRW
access. This bit only contains valid information when tracing XGATE activity in detail mode.
0 Read/Write Access
1 Access
0
XGATE Opcode Fetch Indicator — This bit indicates if the stored address corresponds to an opcode fetch
cycle.This bit only contains valid information when tracing the CPU accesses in detail mode.
0 Stored information does not correspond to opcode fetch cycle
XOCF
1 Stored information corresponds to opcode fetch cycle
20.4.5.3.2
Reading Data from Trace Buffer
The data stored in the trace buffer can be read using either the background debug module (BDM) module
or the CPU provided the DBG module is not armed, is configured for tracing (at least one TSOURCE bit
is set) and the system not secured. When the ARM bit is written to 1 the trace buffer is locked to prevent
reading. The trace buffer can only be unlocked for reading by a single aligned word write to DBGTB when
the module is disarmed. Multiple writes to the DBGTB are not allowed since they increment the pointer.
The trace buffer can only be read through the DBGTB register using aligned word reads, any byte or
misaligned reads return 0 and do not cause the trace buffer pointer to increment to the next trace buffer
address. The trace buffer data is read out first-in first-out. By reading CNT in DBGCNT the number of
valid 64-bit lines can be determined. DBGCNT will not decrement as data is read.
Whilst reading an internal pointer is used to determine the next line to be read. After a tracing session, the
pointer points to the oldest data entry, thus if no overflow has occurred, the pointer points to line0,
otherwise it points to the line with the oldest entry. The pointer is initialized by each aligned write to
DBGTBH to point to the oldest data again. This enables an interrupted trace buffer read sequence to be
easily restarted from the oldest data entry.
The least significant word of each 64-bit wide array line is read out first. This corresponds to the bytes 1
and 0 of Table 20-39. The bytes containing invalid information (shaded in Table 20-39) are also read out.
Reading the trace buffer while the DBG module is armed will return invalid data and no shifting of the
RAM pointer will occur. Reading the trace buffer is not possible if both TSOURCE bits are cleared.
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20.4.5.3.3
Trace Buffer Reset State
The trace buffer contents are not initialized by a system reset. Thus should a system reset occur, the trace
session information from immediately before the reset occurred can be read out. The DBGCNT bits are
not cleared by a system reset. Thus should a reset occur, the number of valid lines in the trace buffer is
indicated by DBGCNT. The internal pointer to the current trace buffer address is initialized by unlocking
the trace buffer thus points to the oldest valid data even if a reset occurred during the tracing session.
Generally debugging occurrences of system resets is best handled using mid or end-trigger alignment since
the reset may occur before the trace trigger, which in the begin-trigger alignment case means no
information would be stored in the trace buffer.
20.4.6
Tagging
A tag follows program information as it advances through the instruction queue. When a tagged instruction
reaches the head of the queue a tag hit occurs and triggers the state sequencer.
Each comparator control register features a TAG bit, which controls whether the comparator match will
cause a trigger immediately or tag the opcode at the matched address. If a comparator is enabled for tagged
comparisons, the address stored in the comparator match address registers must be an opcode address for
the trigger to occur.
Both CPU and XGATE opcodes can be tagged with the comparator register TAG bits.
Using a begin-aligned trigger together with tagging, if the tagged instruction is about to be executed then
the transition to the next state sequencer state occurs. If the transition is to the final state, tracing is started.
Only upon completion of the tracing session can a breakpoint be generated. Similarly using a mid-aligned
trigger with tagging, if the tagged instruction is about to be executed then the trace is continued for another
32 lines. Upon tracing completion the breakpoint is generated. Using an end-aligned trigger, when the
tagged instruction is about to be executed and the next transition is to final state then a breakpoint is
generated immediately, before the tagged instruction is carried out.
R/W monitoring is not useful for tagged operations since the trigger occurs based on the tagged opcode
reaching the execution stage of the instruction queue. Similarly access size (SZ) monitoring and data bus
monitoring is not useful if tagged triggering is selected, since the tag is attached to the opcode at the
matched address and is not dependent on the data bus nor on the size of access. Thus these bits are ignored
if tagged triggering is selected.
When configured for range comparisons and tagging, the ranges are accurate only to word boundaries.
CPU tagging is disabled when the BDM becomes active. Conversely, BDM firmware commands are not
processed while tagging is active. XGATE tagging is possible when the BDM is active.
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20.4.6.1 External Tagging using TAGHI and TAGLO
External tagging using the external TAGHI and TAGLO pins can only be used to tag CPU opcodes; tagging
of XGATE code using these pins is not possible. An external tag triggers the state sequencer into State0
when the tagged opcode reaches the execution stage of the instruction queue.
The pins operate independently, thus the state of one pin does not affect the function of the other. External
tagging is possible in emulation modes only. The presence of logic level 0 on either pin at the rising edge
of the external clock (ECLK) performs the function indicated in the Table 20-43. It is possible to tag both
bytes of an instruction word. If a taghit comes from the low or high byte, a breakpoint generated according
to the DBGBRK and BDM bits in DBGC1. Each time TAGHI or TAGLO are low on the rising edge of
ECLK, the old tag is replaced by a new one
Table 20-43. Tag Pin Function
TAGHI
TAGLO
Tag
1
1
0
0
1
0
1
0
No tag
Low byte
High byte
Both bytes
20.4.7 Breakpoints
It is possible to select breakpoints to the XGATE and let the CPU continue operation, setting DBGBRK[0],
or breakpoints to the CPU and let the XGATE continue operation setting, DBGBRK[1], or a breakpoint to
both CPU and XGATE, setting both bits DBGBRK[1:0].
There are several ways to generate breakpoints to the XGATE and CPU modules.
•
•
•
•
Through XGATE software breakpoint requests.
From comparator channel triggers to final state.
Using software to write to the TRIG bit in the DBGC1 register.
From taghits generated using the external TAGHI and TAGLO pins.
20.4.7.1 XGATE Software Breakpoints
The XGATE software breakpoint instruction BRK can request an CPU breakpoint, via the DBG module.
In this case, if the XGSBPE bit is set, the DBG module immediately generates a forced breakpoint request
to the CPU, the state sequencer is returned to state0 and tracing, if active, is terminated. If configured for
begin-trigger and tracing has not yet been triggered from another source, the trace buffer contains no new
information. Breakpoint requests from the XGATE module do not depend upon the state of the DBGBRK
or ARM bits in DBGC1. They depend solely on the state of the XGSBPE and BDM bits. Thus it is not
necessary to ARM the DBG module to use XGATE software breakpoints to generate breakpoints in the
CPU program flow, but it is necessary to set XGSBPE. Furthermore if a breakpoint to BDM is required,
the BDM bit must also be set. When the XGATE requests an CPU breakpoint, the XGATE program flow
stops by default, independent of the DBG module. The user can thus determine if an XGATE breakpoint
has occurred by reading out the XGATE program counter over the BDM interface.
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20.4.7.2
Breakpoints From Internal Comparator Channel Final State Triggers
Breakpoints can be generated when internal comparator channels trigger the state sequencer to the final
state. If configured for tagging, then the breakpoint is generated when the tagged opcode reaches the
execution stage of the instruction queue. If an end aligned trigger is selected or no tracing is enabled,
breakpoints can be generated immediately, depending on the state of the DBGBRK[n] bits.
If a begin or mid aligned tracing session is selected by the TSOURCE bits, breakpoints are requested when
the tracing session has completed, thus the breakpoint is requested only on completion of the subsequent
trace (see Table 20-44). If the BRK bit is set on the triggering channel, then the breakpoint is generated
immediately independent of tracing trigger alignment.
Table 20-44. Setup for Both XGATE and CPU Breakpoints
BRK
TALIGN
DBGBRK[n]
Type of Debug Session
0
00
0
Fill trace buffer until trigger
(no breakpoints — keep running)
0
0
00
01
1
0
Fill trace buffer until trigger, then a breakpoint request occurs
Start trace buffer at trigger
(no breakpoints — keep running)
0
0
01
10
1
0
Start trace buffer at trigger
A breakpoint request occurs when trace buffer is full
Start trace buffer at trigger
End tracing 32 line entries after trigger
(no breakpoints — keep running)
0
10
1
Start trace buffer at trigger
End tracing 32 line entries after trigger
Request breakpoint after the 32 further trace buffer entries
1
1
x
00,01,10
00,01,10
11
0
1
x
Terminate tracing immediately on trigger without breakpoint
Terminate tracing and generate breakpoint immediately on trigger
Reserved
20.4.7.3
Breakpoints Generated Via The TRIG Bit
If a TRIG triggers occur, the final state is entered. Tracing trigger alignment is defined by the TALIGN
bits. If a tracing session is selected by the TSOURCE bits, breakpoints are requested when the tracing
session has completed, thus if begin or mid aligned triggering is selected, the breakpoint is requested only
on completion of the subsequent trace. If no tracing session is selected, breakpoints are requested
immediately. TRIG breakpoints are possible even if the DBG module is disarmed. TRIG bit breakpoints
are enabled by setting DBGBRK[n].
20.4.7.4 Breakpoints via TAGHI Or TAGLO Pin Taghits
Tagging using the external TAGHI/TAGLO pins always ends the session immediately at the tag hit. It is
always end aligned, independent of internal channel trigger alignment configuration. External tag
breakpoints are always mapped to the CPU, are only possible in emulation modes and can be enabled by
setting DBGBRK[1].
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20.4.7.5 DBG Breakpoint Priorities
XGATE software breakpoints have the highest priority. Active tracing sessions are terminated
immediately.
If a TRIG triggers occur after begin or mid aligned tracing has already been triggered by a comparator
instigated transition to final state, then TRIG no longer has an effect. When the associated tracing session
is complete, the breakpoint occurs. Similarly if a TRIG is followed by a subsequent trigger from a
comparator channel whose BRK=0, it has no effect, since tracing has already started.
If a comparator tag hit occurs simultaneously with an external TAGHI/TAGLO hit, the state sequencer
enters State0. TAGHI/TAGLO triggers are always end aligned, to end tracing immediately, independent of
the tracing trigger alignment bits TALIGN[1:0].
20.4.7.5.1
DBG Breakpoint priorities, mapping and BDM interfacing
Breakpoint operation is dependent on the state of the BDM module. If the BDM module is active, the CPU
is executing out of BDM firmware and S12X breakpoints are disabled. In addition, while executing a BDM
TRACE command, tagging into BDM is disabled.
Table 20-45. Breakpoint Mapping Summary
DBGBRK[1]
(DBGC1[3])1
BDM bit
(DBGC1[4])
BDM
enabled
BDM active
Type of Debug Session
0
1
1
X
0
0
X
0
1
X
0
No Breakpoint
Breakpoint to SWI
2
X
Illegal Configuration. Do Not Use.
3
1
1
1
1
0
1
1
0
0
1
Illegal Configuration. Do Not Use.
Breakpoint to BDM
1
1
No Breakpoint
1
All sources except XGATE software BKP, which are independent of this bit.
2
The DBGC1[4] bit (BDM) must be set if using the BDM interface together with the DBG module. Failure to set this bit could
result in XGATE generated breakpoints to SWI during BDM firmware execution corrupting the S12X PC return address,
should the user have entered BDM via the BACKGROUND command or BGND instruction.
3
End aligned tagged Breakpoint to SWI. Begin, Mid aligned and Forced Breakpoints disabled
If BDM is not active, the breakpoint will give priority to BDM requests over SWI requests if the breakpoint
happens to coincide with a SWI instruction in the user’s code. On returning from BDM, the SWI from user
code gets executed.
BDM cannot be entered from a breakpoint unless the ENABLE bit is set in the BDM. If entry to BDM via
a BGND instruction is attempted and the ENABLE bit in the BDM is cleared, the CPU actually executes
the BDM firmware code. It checks the ENABLE and returns if ENABLE is not set. If not serviced by the
monitor then the breakpoint is re-asserted when the BDM returns to normal CPU flow.
If the comparator register contents coincide with the SWI/BDM vector address then an SWI in user code
and DBG breakpoint could occur simultaneously. The CPU ensures that BDM requests have a higher
priority than SWI requests. Returning from the BDM/SWI service routine care must be taken to avoid
re-triggering a breakpoint.
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When program control returns from a tagged breakpoint using an RTI or BDM GO command without
program counter modification it will return to the instruction whose tag generated the breakpoint. Thus
care must be taken to avoid re triggering a breakpoint at the same location. This can be done by
reconfiguring the DBG module in the SWI routine, (SWI configuration), or by executing a TRACE
command before the GO (BDM configuration) to increment the program flow past the tagged instruction.
Comparators should not be configured for the vector address range while tagging, since these addresses
are not opcode addresses
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Chapter 21
Interrupt (S12MC9S12XDP512V1)
21.1 Introduction
The XINT module decodes the priority of all system exception requests and provides the applicable vector
for processing the exception to either the CPU or the XGATE module. The XINT module supports:
•
•
•
•
•
I bit and X bit maskable interrupt requests
A non-maskable unimplemented opcode trap
A non-maskable software interrupt (SWI) or background debug mode request
A spurious interrupt vector request
Three system reset vector requests
Each of the I bit maskable interrupt requests can be assigned to one of seven priority levels supporting a
flexible priority scheme. For interrupt requests that are configured to be handled by the CPU, the priority
scheme can be used to implement nested interrupt capability where interrupts from a lower level are
automatically blocked if a higher level interrupt is being processed. Interrupt requests configured to be
handled by the XGATE module cannot be nested because the XGATE module cannot be interrupted while
processing.
NOTE
The HPRIO register and functionality of the XINT module is no longer
supported, since it is superseded by the 7-level interrupt request priority
scheme.
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21.1.1 Glossary
The following terms and abbreviations are used in the document.
Table 21-1. Terminology
Term
CCR
DMA
INT
Meaning
Condition Code Register (in the S12X CPU)
Direct Memory Access
Interrupt
Interrupt Processing Level
IPL
Interrupt Service Routine
ISR
Micro-Controller Unit
MCU
XGATE
IRQ
please refer to the "XGATE Block Guide"
refers to the interrupt request associated with the IRQ pin
refers to the interrupt request associated with the XIRQ pin
XIRQ
21.1.2 Features
•
•
•
•
Interrupt vector base register (IVBR)
1
One spurious interrupt vector (at address vector base + 0x0010).
2–113 I bit maskable interrupt vector requests (at addresses vector base + 0x0012–0x00F2).
Each I bit maskable interrupt request has a configurable priority level and can be configured to be
handled by either the CPU or the XGATE module .
2
•
•
•
I bit maskable interrupts can be nested, depending on their priority levels.
One X bit maskable interrupt vector request (at address vector base + 0x00F4).
One non-maskable software interrupt request (SWI) or background debug mode vector request (at
address vector base + 0x00F6).
•
•
•
One non-maskable unimplemented opcode trap (TRAP) vector (at address vector base + 0x00F8).
Three system reset vectors (at addresses 0xFFFA–0xFFFE).
Determines the highest priority DMA and interrupt vector requests, drives the vector to the XGATE
module or to the bus on CPU request, respectively.
•
•
Wakes up the system from stop or wait mode when an appropriate interrupt request occurs or
whenever XIRQ is asserted, even if X interrupt is masked.
XGATE can wake up and execute code, even with the CPU remaining in stop or wait mode.
21.1.3 Modes of Operation
•
Run mode
This is the basic mode of operation.
1. The vector base is a 16-bit address which is accumulated from the contents of the interrupt vector base register (IVBR, used
as upper byte) and 0x00 (used as lower byte).
2. The IRQ interrupt can only be handled by the CPU
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•
•
•
Wait mode
In wait mode, the XINT module is frozen. It is however capable of either waking up the CPU if an
interrupt occurs or waking up the XGATE if an XGATE request occurs. Please refer to
Section 21.5.3, “Wake Up from Stop or Wait Mode” for details.
Stop Mode
In stop mode, the XINT module is frozen. It is however capable of either waking up the CPU if an
interrupt occurs or waking up the XGATE if an XGATE request occurs. Please refer to
Section 21.5.3, “Wake Up from Stop or Wait Mode” for details.
Freeze mode (BDM active)
In freeze mode (BDM active), the interrupt vector base register is overridden internally. Please
refer to Section 21.3.1.1, “Interrupt Vector Base Register (IVBR)” for details.
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Chapter 21 Interrupt (S12MC9S12XDP512V1)
21.1.4 Block Diagram
Figure 21-1 shows a block diagram of the XINT module.
Peripheral
Wake Up
CPU
Interrupt Requests
Non I Bit Maskable
Channels
Vector
Address
IRQ Channel
IVBR
Interrupt
Requests
New
IPL
PRIOLVL2
PRIOLVL1
PRIOLVL0
Current
IPL
RQST
One Set Per Channel
(Up to 112 Channels)
INT_XGPRIO
XGATE
Requests
Priority
Decoder
Wake up
XGATE
Vector
ID
XGATE
Interrupts
RQST
PRIOLVLn
DMA Request Route,
Priority Level
To XGATE Module
= bits from the channel configuration
in the associated configuration register
INT_XGPRIO = XGATE Interrupt Priority
IVBR
IPL
= Interrupt Vector Base
= Interrupt Processing Level
Figure 21-1. XINT Block Diagram
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21.2 External Signal Description
The XINT module has no external signals.
21.3 Memory Map and Register Definition
This section provides a detailed description of all registers accessible in the XINT.
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Chapter 21 Interrupt (S12MC9S12XDP512V1)
21.3.1 Register Descriptions
This section describes in address order all the XINT registers and their individual bits.
Register
Name
Address
Bit 7
6
5
4
3
2
1
Bit 0
0x0121
IVBR
R
IVB_ADDR[7:0]
W
0x0126 INT_XGPRIO
0x0127 INT_CFADDR
0x0128 INT_CFDATA0
0x0129 INT_CFDATA1
0x012A INT_CFDATA2
0x012B INT_CFDATA3
0x012C INT_CFDATA4
0x012D INT_CFDATA5
0x012E INT_CFDATA6
0x012F INT_CFDATA7
R
0
0
0
0
0
0
0
0
0
0
0
0
0
0
XILVL[2:0]
0
W
R
0
0
INT_CFADDR[7:4]
W
R
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
RQST
RQST
RQST
RQST
RQST
RQST
RQST
RQST
PRIOLVL[2:0]
PRIOLVL[2:0]
PRIOLVL[2:0]
PRIOLVL[2:0]
PRIOLVL[2:0]
PRIOLVL[2:0]
PRIOLVL[2:0]
PRIOLVL[2:0]
W
R
W
R
W
R
W
R
W
R
W
R
W
R
W
= Unimplemented or Reserved
Figure 21-2. XINT Register Summary
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Chapter 21 Interrupt (S12MC9S12XDP512V1)
21.3.1.1 Interrupt Vector Base Register (IVBR)
Address: 0x0121
7
6
5
4
3
2
1
0
R
W
IVB_ADDR[7:0]
Reset
1
1
1
1
1
1
1
1
Figure 21-3. Interrupt Vector Base Register (IVBR)
Read: Anytime
Write: Anytime
Table 21-2. IVBR Field Descriptions
Description
Field
7–0
Interrupt Vector Base Address Bits — These bits represent the upper byte of all vector addresses. Out of
IVB_ADDR[7:0] reset these bits are set to 0xFF (i.e., vectors are located at 0xFF10–0xFFFE) to ensure compatibility to
HCS12.
Note: A system reset will initialize the interrupt vector base register with “0xFF” before it is used to determine
the reset vector address. Therefore, changing the IVBR has no effect on the location of the three reset
vectors (0xFFFA–0xFFFE).
Note: If the BDM is active (i.e., the CPU is in the process of executing BDM firmware code), the contents of
IVBR are ignored and the upper byte of the vector address is fixed as “0xFF”.
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21.3.1.2 XGATE Interrupt Priority Configuration Register (INT_XGPRIO)
Address: 0x0126
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
XILVL[2:0]
Reset
0
0
0
0
0
0
0
1
= Unimplemented or Reserved
Figure 21-4. XGATE Interrupt Priority Configuration Register (INT_XGPRIO)
Read: Anytime
Write: Anytime
Table 21-3. INT_XGPRIO Field Descriptions
Description
Field
2–0
XGATE Interrupt Priority Level — The XILVL[2:0] bits configure the shared interrupt level of the DMA interrupts
XILVL[2:0] coming from the XGATE module. Out of reset the priority is set to the lowest active level (“1”).
Table 21-4. XGATE Interrupt Priority Levels
Priority
XILVL2
XILVL1
XILVL0
Meaning
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
Interrupt request is disabled
Priority level 1
low
Priority level 2
Priority level 3
Priority level 4
Priority level 5
Priority level 6
high
Priority level 7
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Chapter 21 Interrupt (S12MC9S12XDP512V1)
21.3.1.3 Interrupt Request Configuration Address Register (INT_CFADDR)
Address: 0x0127
7
6
5
4
3
2
1
0
R
W
0
0
0
0
INT_CFADDR[7:4]
Reset
0
0
0
1
0
0
0
0
= Unimplemented or Reserved
Figure 21-5. Interrupt Configuration Address Register (INT_CFADDR)
Read: Anytime
Write: Anytime
Table 21-5. INT_CFADDR Field Descriptions
Description
Field
7–4
Interrupt Request Configuration Data Register Select Bits — These bits determine which of the 128
INT_CFADDR[7:4] configuration data registers are accessible in the 8 register window at INT_CFDATA0–7. The hexadecimal
value written to this register corresponds to the upper nibble of the lower byte of the interrupt vector, i.e.,
writing 0xE0 to this register selects the configuration data register block for the 8 interrupt vector requests
starting with vector (vector base + 0x00E0) to be accessible as INT_CFDATA0–7.
Note: Writing all 0s selects non-existing configuration registers. In this case write accesses to
INT_CFDATA0–7 will be ignored and read accesses will return all 0.
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Chapter 21 Interrupt (S12MC9S12XDP512V1)
21.3.1.4 Interrupt Request Configuration Data Registers (INT_CFDATA0–7)
The eight register window visible at addresses INT_CFDATA0–7 contains the configuration data for the
block of eight interrupt requests (out of 128) selected by the interrupt configuration address register
(INT_CFADDR) in ascending order. INT_CFDATA0 represents the interrupt configuration data register
of the vector with the lowest address in this block, while INT_CFDATA7 represents the interrupt
configuration data register of the vector with the highest address, respectively.
Address: 0x0128
7
6
5
4
3
2
1
0
R
W
0
0
0
0
RQST
PRIOLVL[2:0]
1
Reset
0
0
0
0
0
0
0
1
= Unimplemented or Reserved
Figure 21-6. Interrupt Request Configuration Data Register 0 (INT_CFDATA0)
1
Please refer to the notes following the PRIOLVL[2:0] description below.
Address: 0x0129
7
6
5
4
3
2
1
0
R
W
0
0
0
0
RQST
0
PRIOLVL[2:0]
1
Reset
0
0
0
0
0
0
1
= Unimplemented or Reserved
Figure 21-7. Interrupt Request Configuration Data Register 1 (INT_CFDATA1)
1
Please refer to the notes following the PRIOLVL[2:0] description below.
Address: 0x012A
7
6
5
4
3
2
1
0
R
0
0
0
0
RQST
PRIOLVL[2:0]
W
1
Reset
0
0
0
0
0
0
0
1
= Unimplemented or Reserved
Figure 21-8. Interrupt Request Configuration Data Register 2 (INT_CFDATA2)
1
Please refer to the notes following the PRIOLVL[2:0] description below.
Address: 0x012B
7
6
5
4
3
2
1
0
R
0
0
0
0
RQST
PRIOLVL[2:0]
W
1
Reset
0
0
0
0
0
0
0
1
= Unimplemented or Reserved
Figure 21-9. Interrupt Request Configuration Data Register 3 (INT_CFDATA3)
1
Please refer to the notes following the PRIOLVL[2:0] description below.
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Address: 0x012C
7
6
5
4
3
2
1
0
R
0
0
0
0
RQST
PRIOLVL[2:0]
W
1
Reset
0
0
0
0
0
0
0
1
= Unimplemented or Reserved
Figure 21-10. Interrupt Request Configuration Data Register 4 (INT_CFDATA4)
1
Please refer to the notes following the PRIOLVL[2:0] description below.
Address: 0x012D
7
6
5
4
3
2
1
0
R
0
0
0
0
RQST
PRIOLVL[2:0]
W
1
Reset
0
0
0
0
0
0
0
1
= Unimplemented or Reserved
Figure 21-11. Interrupt Request Configuration Data Register 5 (INT_CFDATA5)
1
Please refer to the notes following the PRIOLVL[2:0] description below.
Address: 0x012E
7
6
5
4
3
2
1
0
R
0
0
0
0
RQST
PRIOLVL[2:0]
W
1
Reset
0
0
0
0
0
0
0
1
= Unimplemented or Reserved
Figure 21-12. Interrupt Request Configuration Data Register 6 (INT_CFDATA6)
1
Please refer to the notes following the PRIOLVL[2:0] description below.
Address: 0x012F
7
6
5
4
3
2
1
0
R
W
0
0
0
0
RQST
0
PRIOLVL[2:0]
1
Reset
0
0
0
0
0
0
1
= Unimplemented or Reserved
Figure 21-13. Interrupt Request Configuration Data Register 7 (INT_CFDATA7)
1
Please refer to the notes following the PRIOLVL[2:0] description below.
Read: Anytime
Write: Anytime
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Chapter 21 Interrupt (S12MC9S12XDP512V1)
Table 21-6. INT_CFDATA0–7 Field Descriptions
Field
Description
7
XGATE Request Enable — This bit determines if the associated interrupt request is handled by the CPU or by
the XGATE module.
RQST
0 Interrupt request is handled by the CPU
1 Interrupt request is handled by the XGATE module
Note: The IRQ interrupt cannot be handled by the XGATE module. For this reason, the configuration register
for vector (vector base + 0x00F2) = IRQ vector address) does not contain a RQST bit. Writing a 1 to the
location of the RQST bit in this register will be ignored and a read access will return 0.
2–0
Interrupt Request Priority Level Bits — The PRIOLVL[2:0] bits configure the interrupt request priority level of
PRIOLVL[2:0] the associated interrupt request. Out of reset all interrupt requests are enabled at the lowest active level (“1”)
to provide backwards compatibility with previous HCS12 interrupt controllers. Please also refer to Table 21-7 for
available interrupt request priority levels.
Note: Write accesses to configuration data registers of unused interrupt channels will be ignored and read
accesses will return all 0. For information about what interrupt channels are used in a specific MCU,
please refer to the Device User Guide of that MCU.
Note: When vectors (vector base + 0x00F0–0x00FE) are selected by writing 0xF0 to INT_CFADDR, writes to
INT_CFDATA2–7 (0x00F4–0x00FE) will be ignored and read accesses will return all 0s. The
corresponding vectors do not have configuration data registers associated with them.
Note: Write accesses to the configuration register for the spurious interrupt vector request
(vector base + 0x0010) will be ignored and read accesses will return 0x07 (request is handled by the
CPU, PRIOLVL = 7).
Table 21-7. Interrupt Priority Levels
Priority
PRIOLVL2
PRIOLVL1
PRIOLVL0
Meaning
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
Interrupt request is disabled
Priority level 1
low
Priority level 2
Priority level 3
Priority level 4
Priority level 5
Priority level 6
high
Priority level 7
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Chapter 21 Interrupt (S12MC9S12XDP512V1)
21.4 Functional Description
The XINT module processes all exception requests to be serviced by the CPU module. These exceptions
include interrupt vector requests and reset vector requests. Each of these exception types and their overall
priority level is discussed in the subsections below.
21.4.1 S12X Exception Requests
The CPU handles both reset requests and interrupt requests. The XINT contains registers to configure the
priority level of each I bit maskable interrupt request which can be used to implement an interrupt priority
scheme. This also includes the possibility to nest interrupt requests. A priority decoder is used to evaluate
the priority of a pending interrupt request.
21.4.2 Interrupt Prioritization
After system reset all interrupt requests with a vector address lower than or equal to (vector base + 0x00F2)
are enabled, are set up to be handled by the CPU and have a pre-configured priority level of 1. The
exception to this rule is the spurious interrupt vector request at (vector base + 0x0010) which cannot be
disabled, is always handled by the CPU and has a fixed priority level of 7. A priority level of 0 effectively
disables the associated interrupt request.
If more than one interrupt request is configured to the same interrupt priority level the interrupt request
with the higher vector address wins the prioritization.
The following conditions must be met for an I bit maskable interrupt request to be processed.
1. The local interrupt enabled bit in the peripheral module must be set.
2. The setup in the configuration register associated with the interrupt request channel must meet the
following conditions:
a) The XGATE request enable bit must be 0 to have the CPU handle the interrupt request.
b) The priority level must be set to non zero.
c) The priority level must be greater than the current interrupt processing level in the condition
code register (CCR) of the CPU (PRIOLVL[2:0] > IPL[2:0]).
3. The I bit in the condition code register (CCR) of the CPU must be cleared.
4. There is no SWI, TRAP, or XIRQ request pending.
NOTE
All non I bit maskable interrupt requests always have higher priority than
I bit maskable interrupt requests. If an I bit maskable interrupt request is
interrupted by a non I bit maskable interrupt request, the currently active
interrupt processing level (IPL) remains unaffected. It is possible to nest
non I bit maskable interrupt requests, e.g., by nesting SWI or TRAP calls.
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Chapter 21 Interrupt (S12MC9S12XDP512V1)
21.4.2.1 Interrupt Priority Stack
The current interrupt processing level (IPL) is stored in the condition code register (CCR) of the CPU. This
way the current IPL is automatically pushed to the stack by the standard interrupt stacking procedure. The
new IPL is copied to the CCR from the priority level of the highest priority active interrupt request channel
which is configured to be handled by the CPU. The copying takes place when the interrupt vector is
fetched. The previous IPL is automatically restored by executing the RTI instruction.
21.4.3 XGATE Requests
The XINT module processes all exception requests to be serviced by the XGATE module. The overall
priority level of those exceptions is discussed in the subsections below.
21.4.3.1 XGATE Request Prioritization
associated configuration register is set to 1 (please refer to Section 21.3.1.4, “Interrupt Request
Configuration Data Registers (INT_CFDATA0–7)”). The priority level setting (PRIOLVL) for this channel
becomes the DMA priority which will be used to determine the highest priority DMA request to be
serviced next by the XGATE module. Additionally, DMA interrupts may be raised by the XGATE module
by setting one or more of the XGATE channel interrupt flags (using the SIF instruction). This will result
in an CPU interrupt with vector address vector base + (2 * channel ID number), where the channel ID
number corresponds to the highest set channel interrupt flag, if the XGIE and channel RQST bits are set.
The shared interrupt priority for the DMA interrupt requests is taken from the XGATE interrupt priority
configuration register (please refer to Section 21.3.1.2, “XGATE Interrupt Priority Configuration Register
(INT_XGPRIO)”). If more than one DMA interrupt request channel becomes active at the same time, the
channel with the highest vector address wins the prioritization.
21.4.4 Priority Decoders
The XINT module contains priority decoders to determine the priority for all interrupt requests pending
for the respective target.
There are two priority decoders, one for each interrupt request target (CPU, XGATE module). The function
of both priority decoders is basically the same with one exception: the priority decoder for the XGATE
module does not take the current interrupt processing level into account because XGATE requests cannot
be nested.
Because the vector is not supplied until the CPU requests it, it is possible that a higher priority interrupt
request could override the original exception that caused the CPU to request the vector. In this case, the
CPU will receive the highest priority vector and the system will process this exception instead of the
original request.
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Chapter 21 Interrupt (S12MC9S12XDP512V1)
If the interrupt source is unknown (for example, in the case where an interrupt request becomes inactive
after the interrupt has been recognized, but prior to the vector request), the vector address supplied to the
CPU will default to that of the spurious interrupt vector.
NOTE
Care must be taken to ensure that all exception requests remain active until
the system begins execution of the applicable service routine; otherwise, the
exception request may not get processed at all or the result may be a
spurious interrupt request (vector at address (vector base + 0x0010)).
21.4.5 Reset Exception Requests
The XINT supports three system reset exception request types (please refer to CRG for details):
1. Pin reset, power-on reset, low-voltage reset, or illegal address reset
2. Clock monitor reset request
3. COP watchdog reset request
21.4.6 Exception Priority
The priority (from highest to lowest) and address of all exception vectors issued by the XINT upon request
by the CPU is shown in Table 21-8.
Table 21-8. Exception Vector Map and Priority
1
Vector Address
Source
0xFFFE
Pin reset, power-on reset, low-voltage reset, illegal address reset
Clock monitor reset
0xFFFC
0xFFFA
COP watchdog reset
(Vector base + 0x00F8)
(Vector base + 0x00F6)
(Vector base + 0x00F4)
(Vector base + 0x00F2)
Unimplemented opcode trap
Software interrupt instruction (SWI) or BDM vector request
XIRQ interrupt request
IRQ interrupt request
(Vector base + 0x00F0–0x0012) Device specific I bit maskable interrupt sources (priority determined by the associated
configuration registers, in descending order)
(Vector base + 0x0010)
Spurious interrupt
1
16 bits vector address based
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Chapter 21 Interrupt (S12MC9S12XDP512V1)
21.5 Initialization/Application Information
21.5.1 Initialization
After system reset, software should:
•
Initialize the interrupt vector base register if the interrupt vector table is not located at the default
location (0xFF10–0xFFF9).
•
Initialize the interrupt processing level configuration data registers (INT_CFADDR,
INT_CFDATA0–7) for all interrupt vector requests with the desired priority levels and the request
target (CPU or XGATE module). It might be a good idea to disable unused interrupt requests.
•
If the XGATE module is used, setup the XGATE interrupt priority register (INT_XGPRIO) and
configure the XGATE module (please refer the XGATE Block Guide for details).
•
•
Enable I maskable interrupts by clearing the I bit in the CCR.
Enable the X maskable interrupt by clearing the X bit in the CCR (if required).
21.5.2 Interrupt Nesting
The interrupt request priority level scheme makes it possible to implement priority based interrupt request
nesting for the I bit maskable interrupt requests handled by the CPU.
•
I bit maskable interrupt requests can be interrupted by an interrupt request with a higher priority,
so that there can be up to seven nested I bit maskable interrupt requests at a time (refer to
Figure 21-14 for an example using up to three nested interrupt requests).
I bit maskable interrupt requests cannot be interrupted by other I bit maskable interrupt requests per
default. In order to make an interrupt service routine (ISR) interruptible, the ISR must explicitly clear the
I bit in the CCR (CLI). After clearing the I bit, I bit maskable interrupt requests with higher priority can
interrupt the current ISR.
An ISR of an interruptible I bit maskable interrupt request could basically look like this:
•
•
Service interrupt, e.g., clear interrupt flags, copy data, etc.
Clear I bit in the CCR by executing the instruction CLI (thus allowing interrupt requests with
higher priority)
•
•
Process data
Return from interrupt by executing the instruction RTI
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Chapter 21 Interrupt (S12MC9S12XDP512V1)
0
4
0
4
0
4
0
3
0
1
Stacked IPL
IPL in CCR
0
7
0
7
6
5
4
RTI
L7
RTI
Processing Levels
3
2
L3 (Pending)
RTI
L4
1
0
RTI
L1 (Pending)
Reset
Figure 21-14. Interrupt Processing Example
21.5.3 Wake Up from Stop or Wait Mode
21.5.3.1 CPU Wake Up from Stop or Wait Mode
Every I bit maskable interrupt request which is configured to be handled by the CPU is capable of waking
the MCU from stop or wait mode. To determine whether an I bit maskable interrupts is qualified to wake
up the CPU or not, the same settings as in normal run mode are applied during stop or wait mode:
•
•
If the I bit in the CCR is set, all I bit maskable interrupts are masked from waking up the MCU.
An I bit maskable interrupt is ignored if it is configured to a priority level below or equal to the
current IPL in CCR.
•
I bit maskable interrupt requests which are configured to be handled by the XGATE are not capable
of waking up the CPU.
An XIRQ request can wake up the MCU from stop or wait mode at anytime, even if the X bit in CCR is set.
21.5.3.2 XGATE Wake Up from Stop or Wait Mode
Interrupt request channels which are configured to be handled by the XGATE are capable of waking up the
XGATE. Interrupt request channels handled by the XGATE do not affect the state of the CPU.
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Chapter 22
External Bus Interface (S12XEBIV2)
22.1 Introduction
This document describes the functionality of the MC9S12XDP512 block controlling the external bus
interface.
The MC9S12XDP512 controls the functionality of a non-multiplexed external bus (a.k.a. ‘expansion bus’)
in relationship with the chip operation modes. Dependent on the mode, the external bus can be used for
data exchange with external memory, peripherals or PRU, and provide visibility to the internal bus
externally in combination with an emulator.
22.1.1 Features
The MC9S12XDP512 includes the following features:
•
•
•
Output of up to 23-bit address bus and control signals to be used with a non-muxed external bus
Bidirectional 16-bit external data bus with option to disable upper half
Visibility of internal bus activity
22.1.2 Modes of Operation
•
Single-chip modes
The external bus interface is not available in these modes.
Expanded modes
•
Address, data, and control signals are activated on the external bus in normal expanded mode and
special test mode.
•
Emulation modes
The external bus is activated to interface to an external tool for emulation of normal expanded mode
or normal single-chip mode applications.
Refer to the S12X_MMC section for a detailed description of the MCU operating modes.
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Chapter 22 External Bus Interface (S12XEBIV2)
22.1.3 Block Diagram
Figure 22-1 is a block diagram of the MC9S12XDP512 with all related I/O signals.
ADDR[22:0]
DATA[15:0]
IVD[15:0]
LSTRB
R/W
EWAIT
XEBI
UDS
LDS
RE
WE
ACC[2:0]
IQSTAT[3:0]
Figure 22-1. MC9S12XDP512 Block Diagram
22.2 External Signal Description
The user is advised to refer to the SoC section for port configuration and location of external bus signals.
NOTE
The following external bus related signals are described in other sections:
CS2, CS1, CS0 (chip selects) — S12X_MMC section
ECLK, ECLKX2 (free-running clocks) — PIM section
TAGHI, TAGLO (tag inputs) — PIM section, S12X_DBG section
Table 22-1 outlines the pin names and gives a brief description of their function. Refer to the SoC section
and PIM section for reset states of these pins and associated pull-ups or pull-downs.
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Chapter 22 External Bus Interface (S12XEBIV2)
Table 22-1. External System Signals Associated with MC9S12XDP512
EBI Signal
Multiplex
Available in Modes
1
Signal
I /O
Description
2
(T)ime
NS SS NX ES EX ST
3
(F)unction
RE
O
O
O
O
O
O
O
O
O
O
—
T
—
—
—
—
—
—
—
F
Read Enable, indicates external read access
External address
No No Yes No No No
No No Yes Yes Yes Yes
No No No Yes Yes Yes
No No Yes Yes Yes Yes
No No No Yes Yes Yes
No No Yes Yes Yes Yes
No No No Yes Yes Yes
No No No Yes Yes Yes
No No No Yes Yes Yes
No No Yes No No No
ADDR[22:20]
ACC[2:0]
ADDR[19:16]
IQSTAT[3:0]
ADDR[15:1]
IVD[15:1]
ADDR0
Access source
T
T
External address
Instruction Queue Status
External address
Internal visibility read data (IVIS = 1)
External address
T
IVD0
Internal visibility read data (IVIS = 1)
UDS
—
Upper Data Select, indicates external access
to the high byte DATA[15:8]
LSTRB
LDS
O
O
—
—
F
F
Low Strobe, indicates valid data on DATA[7:0]
No No No Yes Yes Yes
No No Yes No No No
Lower Data Select, indicates external access
to the low byte DATA[7:0]
R/W
O
—
Read/Write, indicates the direction of internal
data transfers
No No No Yes Yes Yes
WE
O
I/O
I/O
I
—
—
—
—
Write Enable, indicates external write access
Bidirectional data (even address)
No No Yes No No No
No No Yes Yes Yes Yes
No No Yes Yes Yes Yes
No No Yes No Yes No
DATA[15:8]
DATA[7:0]
EWAIT
—
—
—
Bidirectional data (odd address)
External control for external bus access
stretches (adding wait states)
1
2
All inputs are capable of reducing input threshold level
Time-multiplex means that the respective signals share the same pin on chip level and are active alternating in a dedicated
time slot (in modes where applicable).
3
Function-multiplex means that one of the respective signals sharing the same pin on chip level continuously uses the pin
depending on configuration and reset state.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
863
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Chapter 22 External Bus Interface (S12XEBIV2)
22.3 Memory Map and Register Definition
This section provides a detailed description of all registers accessible in the MC9S12XDP512.
22.3.1 Module Memory Map
The registers associated with the MC9S12XDP512 block are shown in Figure 22-2.
Register
Name
Bit 7
6
5
HDBE
0
4
ASIZ4
0
3
ASIZ3
0
2
1
Bit 0
0x0E
EBICTL0
R
0
ITHRS
ASIZ2
ASIZ1
ASIZ0
W
0x0F
EBICTL1
R
0
EWAITE
EXSTR2
EXSTR1
EXSTR0
W
= Unimplemented or Reserved
Figure 22-2. XEBI Register Summary
22.3.2 Register Descriptions
The following sub-sections provide a detailed description of each register and the individual register bits.
All control bits can be written anytime, but this may have no effect on the related function in certain
operating modes. This allows specific configurations to be set up before changing into the target operating
mode.
NOTE
Depending on the operating mode an available function may be enabled,
disabled or depend on the control register bit. Reading the register bits will
reflect the status of related function only if the current operating mode
allows user control. Please refer the individual bit descriptions.
MC9S12XDP512 Data Sheet, Rev. 2.11
864
Freescale Semiconductor
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Chapter 22 External Bus Interface (S12XEBIV2)
22.3.2.1 External Bus Interface Control Register 0 (EBICTL0)
Module Base +0x000E (PRR)
7
6
5
4
3
2
1
0
R
0
ITHRS
W
HDBE
ASIZ4
ASIZ3
ASIZ2
ASIZ1
ASIZ0
Reset
0
0
1
1
1
1
1
1
= Unimplemented or Reserved
Figure 22-3. External Bus Interface Control Register 0 (EBICTL0)
Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other
modes, the data are read from this register.
Write: Anytime. In emulation modes, write operations will also be directed to the external bus.
This register controls input pin threshold level and determines the external address and data bus sizes in
normal expanded mode. If not in use with the external bus interface, the related pins can be used for
alternative functions.
External bus is available as programmed in normal expanded mode and always full-sized in emulation
modes and special test mode; function not available in single-chip modes.
Table 22-2. EBICTL0 Field Descriptions
Field
Description
7
Reduced Input Threshold — This bit selects reduced input threshold on external data bus pins and specific
control input signals which are in use with the external bus interface in order to adapt to external devices with a
3.3 V, 5 V tolerant I/O.
ITHRS
The reduced input threshold level takes effect depending on ITHRS, the operating mode and the related enable
signals of the EBI pin function as summarized in Table 22-3.
0 Input threshold is at standard level on all pins
1 Reduced input threshold level enabled on pins in use with the external bus interface
5
High Data Byte Enable — This bit enables the higher half of the 16-bit data bus. If disabled, only the lower 8-bit
data bus can be used with the external bus interface. In this case the unused data pins and the data select
signals (UDS and LDS) are free to be used for alternative functions.
0 DATA[15:8], UDS, and LDS disabled
HDBE
1 DATA[15:8], UDS, and LDS enabled
4–0
ASIZ[4:0]
External Address Bus Size — These bits allow scalability of the external address bus. The programmed value
corresponds to the number of available low-aligned address lines (refer to Table 22-4). All address lines
ADDR[22:0] start up as outputs after reset in expanded modes. This needs to be taken into consideration when
using alternative functions on relevant pins in applications which utilize a reduced external address bus.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
865
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Chapter 22 External Bus Interface (S12XEBIV2)
Table 22-3. Input Threshold Levels on External Signals
ITHRS
External Signal
NS
SS
NX
ES
EX
ST
DATA[15:8]
TAGHI, TAGLO
Reduced
Standard
Reduced
Reduced
Standard
Reduced
0
Standard
Standard
Standard
Standard
DATA[7:0]
EWAIT
DATA[15:8]
TAGHI, TAGLO
Reduced
if HDBE = 1
Reduced
Standard
1
DATA[7:0]
Standard
Standard
Reduced
Reduced
if EWAITE = 1
Reduced
if EWAITE = 1
EWAIT
Standard
Table 22-4. External Address Bus Size
Available External Address Lines
ASIZ[4:0]
00000
00001
00010
00011
:
None
UDS
ADDR1, UDS
ADDR[2:1], UDS
:
10110
ADDR[21:1], UDS
ADDR[22:1], UDS
10111
:
11111
MC9S12XDP512 Data Sheet, Rev. 2.11
866
Freescale Semiconductor
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Chapter 22 External Bus Interface (S12XEBIV2)
22.3.2.2 External Bus Interface Control Register 1 (EBICTL1)
Module Base +0x000F (PRR)
7
6
5
4
3
2
1
0
R
0
0
0
0
EWAITE
W
EXSTR2
EXSTR1
EXSTR0
Reset
0
0
0
0
0
1
1
1
= Unimplemented or Reserved
Figure 22-4. External Bus Interface Control Register 1 (EBICTL1)
Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other
modes the data are read from this register.
Write: Anytime. In emulation modes, write operations will also be directed to the external bus.
This register is used to configure the external access stretch (wait) function.
Table 22-5. EBICTL1 Field Descriptions
Field
Description
7
External Wait Enable — This bit enables the external access stretch function using the external EWAIT input
EWAITE
pin. Enabling this feature may have effect on the minimum number of additional stretch cycles (refer to
Table 22-6).
External wait feature is only active if enabled in normal expanded mode and emulation expanded mode; function
not available in all other operating modes.
0 External wait is disabled
1 External wait is enabled
2–0
External Access Stretch Bits 2, 1, 0 — This three bit field determines the amount of additional clock stretch
EXSTR[2:0] cycles on every access to the external address space as shown in Table 22-6. The minimum number of stretch
cycles depends on the EWAITE setting.
Stretch cycles are added as programmed in normal expanded mode and emulation expanded mode; function
not available in all other operating modes.
Table 22-6. External Access Stretch Bit Definition
Number of Stretch Cycles
EXSTR[2:0]
EWAITE = 0
EWAITE = 1
000
001
010
011
100
101
110
111
1 cycle
2 cycles
3 cycles
4 cycles
5 cycles
6 cycles
7 cycles
8 cycles
>= 2 cycles
>= 2 cycles
>= 3 cycles
>= 4 cycles
>= 5 cycles
>= 6 cycles
>= 7 cycles
>= 8 cycles
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
867
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Chapter 22 External Bus Interface (S12XEBIV2)
22.4 Functional Description
This section describes the functions of the external bus interface. The availability of external signals and
functions in relation to the operating mode is initially summarized and described in more detail in separate
sub-sections.
22.4.1 Operating Modes and External Bus Properties
A summary of the external bus interface functions for each operating mode is shown in Table 22-7.
Table 22-7. Summary of Functions
Single-Chip Modes
Expanded Modes
Properties
(if Enabled)
Normal
Special
Normal
Expanded
Emulation
Emulation
Expanded
Special
Test
Single-Chip
Single-Chip
Single-Chip
Timing Properties
1
PRR access
2 cycles
2 cycles
2 cycles
2 cycles
2 cycles
2 cycles
read internal
write internal
read internal
write internal
read internal
write internal
read external
write int & ext
read external
write int & ext
read internal
write internal
Internal access
visible externally
—
—
1 cycle
1 cycle
1 cycle
—
External
address access
and
—
—
Max. of 2 to 9
programmed
cycles
1 cycle
Max. of 2 to 9
programmed
cycles
1 cycle
unimplemented area
or n cycles of
ext. wait
or n cycles of
ext. wait
2
3
3
access
Flash area
address access
—
—
—
—
1 cycle
1 cycle
1 cycle
4
Signal Properties
ADDR[22:1] ADDR[22:20]/A ADDR[22:20]/A ADDR[22:0]
Bus signals
—
DATA[15:0]
CC[2:0]
CC[2:0]
DATA[15:0]
ADDR[19:16]/ ADDR[19:16]/
IQSTAT[3:0]
ADDR[15:0]/
IVD[15:0]
IQSTAT[3:0]
ADDR[15:0]/
IVD[15:0]
DATA[15:0]
DATA[15:0]
Data select signals
(if 16-bit data bus)
—
—
—
—
—
—
—
—
UDS
LDS
ADDR0
LSTRB
ADDR0
LSTRB
ADDR0
LSTRB
Data direction signals
RE
WE
R/W
R/W
R/W
External wait
feature
EWAIT
—
EWAIT
—
Reduced input
threshold enabled on
Refer to
Table 22-3
DATA[15:0]
EWAIT
DATA[15:0]
EWAIT
Refer to
Table 22-3
1
2
3
4
Incl. S12X_EBI registers
Refer to S12X_MMC section.
If EWAITE = 1, the minimum number of external bus cycles is 3.
Available only if configured appropriately by ROMON and EROMON (refer to S12X_MMC section).
MC9S12XDP512 Data Sheet, Rev. 2.11
868
Freescale Semiconductor
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Chapter 22 External Bus Interface (S12XEBIV2)
22.4.2 Internal Visibility
Internal visibility allows the observation of the internal MCU address and data bus as well as the
determination of the access source and the CPU pipe (queue) status through the external bus interface.
Internal visibility is always enabled in emulation single chip mode and emulation expanded mode. Internal
CPU and BDM accesses are made visible on the external bus interface, except those to BDM firmware and
BDM registers.
Internal reads are made visible on ADDRx/IVDx (address and read data multiplexed, see Table 22-9 to
Table 22-11), internal writes on ADDRx and DATAx (see Table 22-12 to Table 22-14). R/W and LSTRB
show the type of access. External read data are also visible on IVDx.
22.4.2.1 Access Source and Instruction Queue Status Signals
The access source (bus master) can be determined from the external bus control signals ACC[2:0] as
shown in Table 22-8.
Table 22-8. Determining Access Source from Control Signals
ACC[2:0]
Access Description
000
001
Repetition of previous access cycle
CPU access
010
BDM access
1
011
XGATE PRR access
2
100
No access
101, 110, 111
Reserved
1
2
Invalid IVD brought out in read cycles
Denotes also accesses to BDM firmware and BDM registers (IQSTATx are
‘XXXX’ and R/W = 1 in these cases)
The CPU instruction queue status (execution-start and data-movement information) is brought out as
IQSTAT[3:0] signals. For decoding of the IQSTAT values, refer to the S12X_CPU section.
22.4.2.2 Emulation Modes Timing
A bus access lasts 1 ECLK cycle. In case of a stretched external access (emulation expanded mode), up to
an infinite amount of ECLK cycles may be added. ADDRx values will only be shown in ECLK high
phases, while ACCx, IQSTATx, and IVDx values will only be presented in ECLK low phases.
Based on this multiplex timing, ACCx are only shown in the current (first) access cycle. IQSTATx and
(for read accesses) IVDx follow in the next cycle. If the access takes more than one bus cycle, ACCx
display NULL (0x000) in the second and all following cycles of the access. IQSTATx display NULL
(0x0000) from the third until one cycle after the access to indicate continuation.
The resulting timing pattern of the external bus signals is outlined in the following tables for read, write
and interleaved read/write accesses. Three examples represent different access lengths of 1, 2, and n–1 bus
cycles. Non-shaded bold entries denote all values related to Access #0.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
869
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Chapter 22 External Bus Interface (S12XEBIV2)
The following terminology is used:
‘addr’ — value(ADDRx); small letters denote the logic values at the respective pins
‘x’ — Undefined output pin values
‘z’ — Tristate pins
‘?’ — Dependent on previous access (read or write); IVDx: ‘ivd’ or ‘x’; DATAx: ‘data’ or ‘z’
22.4.2.2.1
Read Access Timing
Table 22-9. Read Access (1 Cycle)
Access #0
Access #1
3
...
...
...
...
...
...
Bus cycle ->
1
2
ECLK phase
high
low
high
low
acc 1
iqstat 0
ivd 0
z
high
low
acc 2
ADDR[22:20] / ACC[2:0]
acc 0
ADDR[19:16] / IQSTAT[3:0] ... addr 0
ADDR[15:0] / IVD[15:0] ...
iqstat -1
addr 1
addr 2
iqstat 1 ...
?
z
z
1
ivd 1
...
...
...
...
DATA[15:0] (internal read) ...
DATA[15:0] (external read) ...
?
?
1
z
data 0
1
z
data 1
1
z
z
1
z
R/W
...
1
Table 22-10. Read Access (2 Cycles)
Access #0
Access #1
...
...
...
...
...
...
...
...
...
...
...
Bus cycle ->
1
2
3
ECLK phase
high
low
high
low
high
low
acc 1
0000
ivd 0
z
ADDR[22:20] / ACC[2:0]
acc 0
000
ADDR[19:16] / IQSTAT[3:0] ... addr 0
ADDR[15:0] / IVD[15:0] ...
iqstat-1
addr 0
iqstat 0
addr 1
?
z
z
1
x
z
z
1
DATA[15:0] (internal read) ...
DATA[15:0] (external read) ...
?
?
1
z
z
1
z
data 0
1
z
R/W
...
1
Table 22-11. Read Access (n–1 Cycles)
Access #0
Access #1
n
...
...
...
...
...
...
...
...
...
...
...
...
...
...
Bus cycle ->
1
2
3
ECLK phase
high
low
high
low
high
low
000
0000
x
high
low
ADDR[22:20] / ACC[2:0]
acc 0
000
acc 1
0000
ivd 0
z
ADDR[19:16] / IQSTAT[3:0] ... addr 0
ADDR[15:0] / IVD[15:0] ...
iqstat-1
addr 0
iqstat 0
addr 0
... addr 1
...
?
z
z
1
x
z
z
1
DATA[15:0] (internal read) ...
DATA[15:0] (external read) ...
?
?
1
z
z
1
z
z
1
z
...
... data 0
...
z
z
z
R/W
...
1
1
1
MC9S12XDP512 Data Sheet, Rev. 2.11
870
Freescale Semiconductor
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Chapter 22 External Bus Interface (S12XEBIV2)
22.4.2.2.2
Write Access Timing
Table 22-12. Write Access (1 Cycle)
Access #0
1
Access #1
2
Access #2
3
...
...
...
...
...
...
Bus cycle ->
ECLK phase
high
low
high
low
high
low
acc 2
ADDR[22:20] / ACC[2:0]
acc 0
iqstat -1
?
acc 1
iqstat 0
x
ADDR[19:16] / IQSTAT[3:0] ... addr 0
addr 1
addr 2
iqstat 1 ...
...
data 2 ...
ADDR[15:0] / IVD[15:0]
DATA[15:0] (write)
R/W
...
...
...
x
?
0
data 0
data 1
0
1
1
1
1
...
Table 22-13. Write Access (2 Cycles)
Access #0
Access #1
3
...
...
...
...
...
...
...
...
...
...
Bus cycle ->
1
2
ECLK phase
high
low
acc 0
iqstat-1
?
high
low
000
high
low
ADDR[22:20] / ACC[2:0]
acc 1
ADDR[19:16] / IQSTAT[3:0] ... addr 0
addr 0
iqstat 0
x
addr 1
0000
ADDR[15:0] / IVD[15:0]
DATA[15:0] (write)
R/W
...
...
...
x
x
1
?
0
data 0
0
0
0
1
Table 22-14. Write Access (n–1 Cycles)
Access #0
Access #1
n
...
...
...
...
...
...
...
...
...
...
...
...
...
Bus cycle ->
1
2
3
ECLK phase
high
low
acc 0
iqstat-1
?
high
low
000
high
low
000
0000
x
high
low
ADDR[22:20] / ACC[2:0]
acc 1
ADDR[19:16] / IQSTAT[3:0] ... addr 0
addr 0
iqstat 0
x
addr 0
... addr 1
0000
ADDR[15:0] / IVD[15:0]
DATA[15:0] (write)
R/W
...
...
...
...
x
x
1
?
0
data 0
0
0
0
0
0
...
1
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
871
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Chapter 22 External Bus Interface (S12XEBIV2)
22.4.2.2.3
Read-Write-Read Access Timing
Table 22-15. Interleaved Read-Write-Read Accesses (1 Cycle)
Access #0
1
Access #1
2
Access #2
3
...
...
...
...
...
...
...
...
...
...
...
Bus cycle ->
ECLK phase
high
low
high
low
high
low
ADDR[22:20] / ACC[2:0]
acc 0
acc 1
iqstat 0
ivd 0
acc 2
ADDR[19:16] / IQSTAT[3:0] ...
ADDR[15:0] / IVD[15:0] ...
addr 0
iqstat -1
addr 1
addr 2
iqstat 1
?
z
z
1
x
z
z
1
DATA[15:0] (internal read) ...
DATA[15:0] (external read) ...
?
?
1
z
data 0
0
(write) data 1
(write) data 1
R/W
...
0
1
22.4.2.3 Internal Visibility Data
Depending on the access size and alignment, either a word of read data is made visible on the address lines
or only the related data byte will be presented in the ECLK low phase. For details refer to Table 22-16.
Table 22-16. IVD Read Data Output
Access
IVD[15:8]
IVD[7:0]
Word read of data at an even and even+1 address
Word read of data at an odd and odd+1 internal RAM address (misaligned)
Byte read of data at an even address
ivd(even)
ivd(odd+1)
ivd(even+1)
ivd(odd)
ivd(even)
addr[7:0] (rep.)
ivd(odd)
Byte read of data at an odd address
addr[15:8] (rep.)
22.4.3 Accesses to Port Replacement Registers
All read and write accesses to PRR addresses take two bus clock cycles independent of the operating mode.
If writing to these addresses in emulation modes, the access is directed to both, the internal register and
the external resource while reads will be treated external.
The MC9S12XDP512 control registers also belong to this category.
22.4.4 Stretched External Bus Accesses
In order to allow fast internal bus cycles to coexist in a system with slower external resources, the
MC9S12XDP512 supports stretched external bus accesses (wait states).
This feature is available in normal expanded mode and emulation expanded mode for accesses to all
external addresses except emulation memory and PRR. In these cases the fixed access times are 1 or 2
cycles, respectively.
MC9S12XDP512 Data Sheet, Rev. 2.11
872
Freescale Semiconductor
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Chapter 22 External Bus Interface (S12XEBIV2)
Stretched accesses are controlled by:
1. EXSTR[2:0] bits in the EBICTL1 register configuring fixed amount of stretch cycles
2. Activation of the external wait feature by EWAITE in EBICTL1 register
3. Assertion of the external EWAIT signal when EWAITE = 1
The EXSTR[2:0] control bits can be programmed for generation of a fixed number of 1 to 8 stretch cycles.
If the external wait feature is enabled, the minimum number of additional stretch cycles is 2. An arbitrary
amount of stretch cycles can be added using the EWAIT input.
EWAIT needs to be asserted at least for a minimal specified time window within an external access cycle
for the internal logic to detect it and add a cycle (refer to electrical characteristics). Holding it for additional
cycles will cause the external bus access to be stretched accordingly.
Write accesses are stretched by holding the initiator in its current state for additional cycles as programmed
and controlled by external wait after the data have been driven out on the external bus. This results in an
extension of time the bus signals and the related control signals are valid externally.
Read data are not captured by the system in normal expanded mode until the specified setup time before
the RE rising edge.
Read data are not captured in emulation expanded mode until the specified setup time before the falling
edge of ECLK.
In emulation expanded mode, accesses to the internal flash or the emulation memory (determined by
EROMON and ROMON bits; see S12X_MMC section for details) always take 1 cycle and stretching is
not supported. In case the internal flash is taken out of the map in user applications, accesses are stretched
as programmed and controlled by external wait.
22.4.5 Data Select and Data Direction Signals
The S12X_EBI supports byte and word accesses at any valid external address. The big endian system of
the MCU is extended to the external bus; however, word accesses are restricted to even aligned addresses.
The only exception is the visibility of misaligned word accesses to addresses in the internal RAM as this
module exclusively supports these kind of accesses in a single cycle.
With the above restriction, a fixed relationship is implied between the address parity and the dedicated bus
halves where the data are accessed: DATA[15:8] is related to even addresses and DATA[7:0] is related to
odd addresses.
In expanded modes the data access type is externally determined by a set of control signals, i.e., data select
and data direction signals, as described below. The data select signals are not available if using the external
bus interface with an 8-bit data bus.
22.4.5.1 Normal Expanded Mode
In normal expanded mode, the external signals RE, WE, UDS, LDS indicate the access type (read/write),
data size and alignment of an external bus access (Table 22-17).
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
873
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Chapter 22 External Bus Interface (S12XEBIV2)
Table 22-17. Access in Normal Expanded Mode
DATA[15:8]
DATA[7:0]
Access
RE WE UDS LDS
I/O data(addr) I/O data(addr)
Word write of data on DATA[15:0] at an even and even+1 address
Byte write of data on DATA[7:0] at an odd address
Byte write of data on DATA[15:8] at an even address
Word read of data on DATA[15:0] at an even and even+1 address
Byte read of data on DATA[7:0] at an odd address
Byte read of data on DATA[15:8] at an even address
Indicates No Access
1
1
1
0
0
0
1
1
1
0
0
0
1
1
1
1
1
1
0
1
0
0
1
0
1
1
0
0
0
1
0
0
1
1
0
1
Out data(even) Out data(odd)
In
Out data(even) In
In data(even) In data(odd)
In In data(odd)
In data(even) In
x
Out data(odd)
x
x
x
x
x
x
In
In
In
x
x
x
In
In
In
Unimplemented
22.4.5.2 Emulation Modes and Special Test Mode
In emulation modes and special test mode, the external signals LSTRB, R/W, and ADDR0 indicate the
access type (read/write), data size and alignment of an external bus access. Misaligned accesses to the
internal RAM and misaligned XGATE PRR accesses in emulation modes are the only type of access that
are able to produce LSTRB = ADDR0 = 1. This is summarized in Table 22-18.
Table 22-18. Access in Emulation Modes and Special Test Mode
DATA[15:8]
DATA[7:0]
Access
R/W LSTRB ADDR0
I/O data(addr) I/O
data(addr)
Word write of data on DATA[15:0] at an even and even+1
address
0
0
0
Out data(even) Out
data(odd)
Byte write of data on DATA[7:0] at an odd address
Byte write of data on DATA[15:8] at an even address
0
0
0
0
1
1
1
0
1
In
x
Out
In
data(odd)
x
Out data(odd)
Word write at an odd and odd+1 internal RAM address
(misaligned — only in emulation modes)
Out data(odd+1) Out
data(odd)
Word read of data on DATA[15:0] at an even and even+1
address
1
0
0
In
data(even)
In data(even+1)
Byte read of data on DATA[7:0] at an odd address
Byte read of data on DATA[15:8] at an even address
1
1
1
0
1
1
1
0
1
In
In
x
In
In
data(odd)
x
data(even)
Word read at an odd and odd+1 internal RAM address
(misaligned - only in emulation modes)
In data(odd+1) In
data(odd)
MC9S12XDP512 Data Sheet, Rev. 2.11
874
Freescale Semiconductor
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Chapter 22 External Bus Interface (S12XEBIV2)
22.4.6 Low-Power Options
The MC9S12XDP512 does not support any user-controlled options for reducing power consumption.
22.4.6.1 Run Mode
The MC9S12XDP512 does not support any options for reducing power in run mode.
Power consumption is reduced in single-chip modes due to the absence of the external bus interface.
Operation in expanded modes results in a higher power consumption, however any unnecessary toggling
of external bus signals is reduced to the lowest indispensable activity by holding the previous states
between external accesses.
22.4.6.2 Wait Mode
The MC9S12XDP512 does not support any options for reducing power in wait mode.
22.4.6.3 Stop Mode
The MC9S12XDP512 will cease to function in stop mode.
22.5 Initialization/Application Information
This section describes the external bus interface usage and timing. Typical customer operating modes are
normal expanded mode and emulation modes, specifically to be used in emulator applications. Taking the
availability of the external wait feature into account the use cases are divided into four scenarios:
•
Normal expanded mode
— External wait feature disabled
– External wait feature enabled
•
Emulation modes
– Emulation single-chip mode (without wait states)
– Emulation expanded mode (with optional access stretching)
Normal single-chip mode and special single-chip mode do not have an external bus. Special test mode is
used for factory test only. Therefore, these modes are omitted here.
All timing diagrams referred to throughout this section are available in the Electrical Characteristics
appendix of the SoC section.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
875
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Chapter 22 External Bus Interface (S12XEBIV2)
22.5.1 Normal Expanded Mode
This mode allows interfacing to external memories or peripherals which are available in the commercial
market. In these applications the normal bus operation requires a minimum of 1 cycle stretch for each
external access.
22.5.1.1 Example 1a: External Wait Feature Disabled
The first example of bus timing of an external read and write access with the external wait feature disabled
is shown in
•
Figure ‘Example 1a: Normal Expanded Mode — Read Followed by Write’
The associated supply voltage dependent timing are numbers given in
•
•
Table ‘Example 1a: Normal Expanded Mode Timing V
Table ‘Example 1a: Normal Expanded Mode Timing V
= 5.0 V (EWAITE = 0)’
= 3.0 V (EWAITE = 0)’
DD5
DD5
Systems designed this way rely on the internal programmable access stretching. These systems have
predictable external memory access times. The additional stretch time can be programmed up to 8 cycles
to provide longer access times.
22.5.1.2 Example 1b: External Wait Feature Enabled
The external wait operation is shown in this example. It can be used to exceed the amount of stretch cycles
over the programmed number in EXSTR[2:0]. The feature must be enabled by writing EWAITE = 1.
If the EWAIT signal is not asserted, the number of stretch cycles is forced to a minimum of 2 cycles. If
EWAIT is asserted within the predefined time window during the access it will be strobed active and
another stretch cycle is added. If strobed inactive, the next cycle will be the last cycle before the access is
finished. EWAIT can be held asserted as long as desired to stretch the access.
An access with 1 cycle stretch by EWAIT assertion is shown in
•
•
Figure ‘Example 1b: Normal Expanded Mode — Stretched Read Access’
Figure ‘Example 1b: Normal Expanded Mode — Stretched Write Access’
The associated timing numbers for both operations are given in
•
•
Table ‘Example 1b: Normal Expanded Mode Timing V
Table ‘Example 1b: Normal Expanded Mode Timing V
= 5.0 V (EWAITE = 1)’
= 3.0 V (EWAITE = 1)’
DD5
DD5
It is recommended to use the free-running clock (ECLK) at the fastest rate (bus clock rate) to synchronize
the EWAIT input signal.
MC9S12XDP512 Data Sheet, Rev. 2.11
876
Freescale Semiconductor
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Chapter 22 External Bus Interface (S12XEBIV2)
22.5.2 Emulation Modes
In emulation mode applications, the development systems use a custom PRU device to rebuild the
single-chip or expanded bus functions which are lost due to the use of the external bus with an emulator.
Accesses to a set of registers controlling the related ports in normal modes (refer to SoC section) are
directed to the external bus in emulation modes which are substituted by PRR as part of the PRU. Accesses
to these registers take a constant time of 2 cycles.
Depending on the setting of ROMON and EROMON (refer to S12X_MMC section), the program code
can be executed from internal memory or an optional external emulation memory (EMULMEM). No wait
state operation (stretching) of the external bus access is done in emulation modes when accessing internal
memory or emulation memory addresses.
In both modes observation of the internal operation is supported through the external bus (internal
visibility).
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
877
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Chapter 22 External Bus Interface (S12XEBIV2)
22.5.2.1 Example 2a: Emulation Single-Chip Mode
This mode is used for emulation systems in which the target application is operating in normal single-chip
Figure 22-5 shows the PRU connection with the available external bus signals in an emulator application.
S12X_EBI
Emulator
ADDR[22:0]/IVD[15:0]
DATA[15:0]
EMULMEM
PRU
PRR
Ports
LSTRB
R/W
ADDR[22:20]/ACC[2:0]
ADDR[19:16]/
IQSTAT[3:0]
ECLK
ECLKX2
Figure 22-5. Application in Emulation Single-Chip Mode
The timing diagram for this operation is shown in:
Figure ‘Example 2a: Emulation Single-Chip Mode — Read Followed by Write’
The associated timing numbers are given in:
Table ‘Example 2a: Emulation Single-Chip Mode Timing (EWAITE = 0)’
Timing considerations:
•
•
•
•
•
•
Signals muxed with address lines ADDRx, i.e., IVDx, IQSTATx and ACCx, have the same timing.
LSTRB has the same timing as R/W.
ECLKX2 rising edges have the same timing as ECLK edges.
The timing for accesses to PRU registers, which take 2 cycles to complete, is the same as the timing
for an external non-PRR access with 1 cycle of stretch as shown in example 2b.
MC9S12XDP512 Data Sheet, Rev. 2.11
878
Freescale Semiconductor
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Chapter 22 External Bus Interface (S12XEBIV2)
22.5.2.2 Example 2b: Emulation Expanded Mode
This mode is used for emulation systems in which the target application is operating in normal expanded
mode.
If the external bus is used with a PRU, the external device rebuilds the data select and data direction signals
UDS, LDS, RE, and WE from the ADDR0, LSTRB, and R/W signals.
Figure 22-6 shows the PRU connection with the available external bus signals in an emulator application.
S12X_EBI
Emulator
ADDR[22:0]/IVD[15:0]
DATA[15:0]
EMULMEM
PRU
PRR
Ports
UDS
LDS
RE
LSTRB
R/W
WE
ADDR[22:20]/ACC[2:0]
ADDR[19:16]/
IQSTAT[3:0]
EWAIT
ECLK
ECLKX2
CS[2:0]
Figure 22-6. Application in Emulation Expanded Mode
The timings of accesses with 1 stretch cycle are shown in
•
•
Figure ‘Example 2b: Emulation Expanded Mode — Read with 1 Stretch Cycle’
Figure ‘Example 2b: Emulation Expanded Mode — Write with 1 Stretch Cycle’
The associated timing numbers are given in
Table ‘Example 2b: Emulation Expanded Mode Timing V
•
= 5.0 V (EWAITE = 0)’ (this also
DD5
includes examples for alternative settings of 2 and 3 additional stretch cycles)
Timing considerations:
•
If no stretch cycle is added, the timing is the same as in Emulation Single-Chip Mode.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
879
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Chapter 22 External Bus Interface (S12XEBIV2)
MC9S12XDP512 Data Sheet, Rev. 2.11
880
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Chapter 23
Memory Mapping Control (S12XMMCV2)
23.1 Introduction
This section describes the functionality of the module mapping control (MMC) sub-block of the S12X
platform. The block diagram of the MMC is shown in Figure 1-1.
The MMC module controls the multi-master priority accesses, the selection of internal resources and
external space. Internal buses including internal memories and peripherals are controlled in this module.
The local address space for each master is translated to a global memory space.
23.1.1 Features
The main features of this block are:
•
•
•
•
•
Paging capability to support a global 8 Mbytes memory address space
Bus arbitration between the masters CPU, BDM, and XGATE
1
Simultaneous accesses to different resources (internal, external, and peripherals) (see Figure 1-1)
Resolution of target bus access collision
Access restriction control from masters to some targets (e.g., RAM write access protection for user
specified areas)
•
•
•
•
•
•
MCU operation mode control
MCU security control
Separate memory map schemes for each master CPU, BDM, and XGATE
ROM control bits to enable the on-chip FLASH or ROM selection
Port replacement registers access control
Generation of system reset when CPU accesses an unimplemented address (i.e., an address which
does not belong to any of the on-chip modules) in single-chip modes
23.1.2 Modes of Operation
This subsection lists and briefly describes all operating modes supported by the MMC.
23.1.2.1 Power Saving Modes
•
Run mode
MMC is functional during normal run mode.
1. Resources are also called targets.
Freescale Semiconductor
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 23 Memory Mapping Control (S12XMMCV2)
•
•
Wait mode
MMC is functional during wait mode.
Stop mode
MMC is inactive during stop mode.
23.1.2.2 Functional Modes
•
Single chip modes
In normal and special single chip mode the internal memory is used. External bus is not active.
Expanded modes
•
Address, data, and control signals are activated in normal expanded and special test modes when
accessing the external bus.
•
Emulation modes
External bus is active to emulate via an external tool the normal expanded or the normal single chip
mode.
23.1.3 Block Diagram
Figure 1-1 shows a block diagram of the MMC.
BDM
CPU
XGATE
EBI
MMC
Address Decoder & Priority
Target Bus Controller
DBG
EEPROM
FLASH
Peripherals
RAM
Figure 23-1. MMC Block Diagram
23.2 External Signal Description
The user is advised to refer to the SoC Guide for port configuration and location of external bus signals.
Some pins may not be bonded out in all implementations.
MC9S12XDP512 Data Sheet, Rev. 2.11
882
Freescale Semiconductor
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Chapter 23 Memory Mapping Control (S12XMMCV2)
Table 1-2 and Table 1-3 outline the pin names and functions. It also provides a brief description of their
operation.
Table 23-1. External Input Signals Associated with the MMC
Signal
I/O
Description
Availability
MODC
MODB
I
I
I
I
I
Mode input
Mode input
Latched after
RESET (active low)
MODA
Mode input
EROMCTL
ROMCTL
EROM control input
ROM control input
Table 23-2. External Output Signals Associated with the MMC
Available in Modes
Signal
I/O
Description
NS
SS
NX
ES
EX
ST
CS0
CS1
CS2
CS3
O
O
O
O
Chip select line 0
Chip select line 1
Chip select line 2
Chip select line 3
(see Table 1-4)
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
883
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Chapter 23 Memory Mapping Control (S12XMMCV2)
23.3 Memory Map and Registers
23.3.1 Module Memory Map
A summary of the registers associated with the MMC block is shown in Figure 1-2. Detailed descriptions
of the registers and bits are given in the subsections that follow.
Register
Name
Address
Bit 7
6
5
4
3
CS3E
0
2
CS2E
0
1
CS1E
0
Bit 0
CS0E
0
0x000A
MMCCTL0
R
0
0
0
0
W
0x000B
0x0010
0x0011
0x0012
0x0013
0x0014
0x0015
0x0016
0x0017
0x0030
0x0031
MODE
GPAGE
R
0
MODC
0
MODB
GP6
MODA
GP5
W
R
GP4
GP3
GP2
GP1
GP0
W
DIRECT
Reserved
MMCCTL1
Reserved
Reserved
RPAGE
R
DP15
0
DP14
0
DP13
0
DP12
0
DP11
0
DP10
0
DP9
0
DP8
0
W
R
W
R
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
EROMON ROMHM
ROMON
0
W
R
0
0
0
0
W
R
0
W
R
RP7
EP7
RP6
EP6
RP5
EP5
RP4
EP4
RP3
EP3
RP2
EP2
RP1
EP1
RP0
EP0
W
EPAGE
R
W
PPAGE
R
PIX7
0
PIX6
0
PIX5
0
PIX4
0
PIX3
0
PIX2
0
PIX1
0
PIX0
0
W
Reserved
R
W
= Unimplemented or Reserved
Figure 23-2. MMC Register Summary
MC9S12XDP512 Data Sheet, Rev. 2.11
884
Freescale Semiconductor
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Chapter 23 Memory Mapping Control (S12XMMCV2)
Register
Name
Address
Bit 7
RPWE
1
6
5
4
3
2
1
Bit 0
0x011C
RAMWPC
RAMXGU
RAMSHL
RAMSHU
R
0
0
0
0
0
AVIE
AVIF
W
0x011D
0x011E
0x011F
R
XGU6
SHL6
SHU6
XGU5
SHL5
SHU5
XGU4
SHL4
SHU4
XGU3
SHL3
SHU3
XGU2
SHL2
SHU2
XGU1
SHL1
SHU1
XGU0
SHL0
SHU0
W
R
1
1
W
R
W
= Unimplemented or Reserved
Figure 23-2. MMC Register Summary
23.3.2 Register Descriptions
23.3.2.1 MMC Control Register (MMCCTL0)
Address: 0x000A PRR
7
6
5
4
3
2
1
0
R
W
0
0
0
0
CS3E
CS2E
CS1E
0
CS0E
1
Reset
0
0
0
0
0
0
ROMON
1. ROMON is bit[0] of the register MMCTL1 (see Figure 1-10)
= Unimplemented or Reserved
Figure 23-3. MMC Control Register (MMCCTL0)
Read: Anytime. In emulation modes read operations will return the data from the external bus. In all other
modes the data is read from this register.
Write: Anytime. In emulation modes write operations will also be directed to the external bus.
Table 23-3. Chip Selects Function Activity
Chip Modes
Register Bit
CS3E, CS2E, CS1E, CS0E
NS
SS
NX
ES
EX
ST
1
2
Disabled
Disabled
Enabled
Disabled
Enabled
Enabled
1
2
Disabled: feature always inactive.
Enabled: activity is controlled by the appropriate register bit value.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
885
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Chapter 23 Memory Mapping Control (S12XMMCV2)
The MMCCTL0 register is used to control external bus functions, i.e., availability of chip selects.
CAUTION
XGATE write access to this register during an CPU access which makes use
of this register could lead to unexpected results.
Table 23-4. MMCCTL0 Field Descriptions
Field
Description
3–0
CS[3:0]E
Chip Select Enables — Each of these bits enables one of the external chip selects CS3, CS2, CS1, and CS0
outputs which are asserted during accesses to specific external addresses. The associated global address
ranges are shown in Table 1-6 and Table 1-21 and Figure 1-23.
Chip selects are only active if enabled in normal expanded mode, Emulation expanded mode and special test
mode. The function disabled in all other operating modes.
0 Chip select is disabled
1 Chip select is enabled
Table 23-5. Chip Select Signals
Global Address Range
Asserted Signal
0x00_0800–0x0F_FFFF
0x10_0000–0x1F_FFFF
0x20_0000–0x3F_FFFF
0x40_0000–0x7F_FFFF
CS3
CS2
CS1
1
CS0
1
When the internal NVM is enabled (see ROMON in Section 1.3.2.5, “MMC Control
Register (MMCCTL1)”) the CS0 is not asserted in the space occupied by this on-chip
memory block.
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 23 Memory Mapping Control (S12XMMCV2)
23.3.2.2 Mode Register (MODE)
Address: 0x000B PRR
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
MODC
MODB
MODA
1
1
1
Reset
MODC
MODB
MODA
0
0
0
0
0
1. External signal (see Table 1-2).
= Unimplemented or Reserved
Figure 23-4. Mode Register (MODE)
Read: Anytime. In emulation modes read operations will return the data read from the external bus. In all
other modes the data are read from this register.
Write: Only if a transition is allowed (see Figure 1-5). In emulation modes write operations will be also
directed to the external bus.
The MODE bits of the MODE register are used to establish the MCU operating mode.
CAUTION
XGATE write access to this register during an CPU access which makes use
of this register could lead to unexpected results.
Table 23-6. MODE Field Descriptions
Field
Description
7–5
Mode Select Bits — These bits control the current operating mode during RESET high (inactive). The external
mode pins MODC, MODB, and MODA determine the operating mode during RESET low (active). The state of
the pins is latched into the respective register bits after the RESET signal goes inactive (see Figure 1-5).
MODC,
MODB,
MODA
Write restrictions exist to disallow transitions between certain modes. Figure 1-5 illustrates all allowed mode
changes. Attempting non authorized transitions will not change the MODE bits, but it will block further writes to
these register bits except in special modes.
Both transitions from normal single-chip mode to normal expanded mode and from emulation single-chip to
emulation expanded mode are only executed by writing a value of 0b101 (write once). Writing any other value
will not change the MODE bits, but will block further writes to these register bits.
Changes of operating modes are not allowed when the device is secured, but it will block further writes to these
register bits except in special modes.
In emulation modes reading this address returns data from the external bus which has to be driven by the
emulator. It is therefore responsibility of the emulator hardware to provide the expected value (i.e. a value
corresponding to normal single chip mode while the device is in emulation single-chip mode or a value
corresponding to normal expanded mode while the device is in emulation expanded mode).
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
887
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Chapter 23 Memory Mapping Control (S12XMMCV2)
RESET
010
Special
Test
(ST)
010
Normal
Expanded
(NX)
Normal
Single-Chip
101
100
101
RESET
RESET
(NS)
100
110
111
101
Emulation
Single-Chip
(ES)
Emulation
Expanded
(EX)
001
011
101
RESET
RESET
011
001
Special
Single-Chip
(SS)
000
000
RESET
Transition done by external pins (MODC, MODB, MODA)
RESET
Transition done by write access to the MODE register
110
111
Illegal (MODC, MODB, MODA) pin values.
Do not use. (Reserved for future use).
Figure 23-5. Mode Transition Diagram when MCU is Unsecured
MC9S12XDP512 Data Sheet, Rev. 2.11
888
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Chapter 23 Memory Mapping Control (S12XMMCV2)
23.3.2.3 Global Page Index Register (GPAGE)
Address: 0x0010
7
6
5
4
3
2
1
0
R
W
0
GP6
GP5
GP4
GP3
GP2
GP1
GP0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 23-6. Global Page Index Register (GPAGE)
Read: Anytime
Write: Anytime
The global page index register is used only when the CPU is executing a global instruction (GLDAA,
GLDAB, GLDD, GLDS, GLDX, GLDY,GSTAA, GSTAB, GSTD, GSTS, GSTX, GSTY) (see CPU Block
Guide). The generated global address is the result of concatenation of the CPU local address [15:0] with
the GPAGE register [22:16] (see Figure 1-7).
CAUTION
XGATE write access to this register during an CPU access which makes use
of this register could lead to unexpected results.
Global Address [22:0]
Bit22
Bit16 Bit15
Bit 0
GPAGE Register [6:0]
CPU Address [15:0]
Figure 23-7. GPAGE Address Mapping
Table 23-7. GPAGE Field Descriptions
Description
Field
6–0
Global Page Index Bits 6–0 — These page index bits are used to select which of the 128 64-kilobyte pages is
GP[6:0]
to be accessed.
Example 23-1. This example demonstrates usage of the GPAGE register
LDAADR EQU $5000
;Initialize LDADDR to the value of $5000
MOVB
GLDAA
#$14, GPAGE
>LDAADR
;Initialize GPAGE register with the value of $14
;Load Accu A from the global address $14_5000
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
889
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Chapter 23 Memory Mapping Control (S12XMMCV2)
23.3.2.4 Direct Page Register (DIRECT)
Address: 0x0011
7
6
5
4
3
2
1
0
R
W
DP15
DP14
DP13
DP12
DP11
DP10
DP9
DP8
Reset
0
0
0
0
0
0
0
0
Figure 23-8. Direct Register (DIRECT)
Read: Anytime
Write: anytime in special modes, one time only in other modes.
This register determines the position of the direct page within the memory map.
Table 23-8. DIRECT Field Descriptions
Field
Description
7–0
Direct Page Index Bits 15–8 — These bits are used by the CPU when performing accesses using the direct
DP[15:8]
addressing mode. The bits from this register form bits [15:8] of the address (see Figure 1-9).
CAUTION
XGATE write access to this register during an CPU access which makes use
of this register could lead to unexpected results.
Global Address [22:0]
Bit22
Bit16 Bit15
Bit0
Bit8
Bit7
DP [15:8]
CPU Address [15:0]
Figure 23-9. DIRECT Address Mapping
Bits [22:16] of the global address will be formed by the GPAGE[6:0] bits in case the CPU executes a global
instruction in direct addressing mode or by the appropriate local address to the global address expansion
(refer to Expansion of the CPU Local Address Map).
Example 23-2. This example demonstrates usage of the Direct Addressing Mode by a global instruction
LDAADR EQU $0000
;Initialize LDADDR with the value of $0000
;Initialize DIRECT register with the value of $80
;Initialize GPAGE register with the value of $14
;Load Accu A from the global address $14_8000
MOVB
MOVB
GLDAA
#$80,DIRECT
#$14,GPAGE
<LDAADR
MC9S12XDP512 Data Sheet, Rev. 2.11
890
Freescale Semiconductor
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Chapter 23 Memory Mapping Control (S12XMMCV2)
23.3.2.5 MMC Control Register (MMCCTL1)
Address: 0x0013 PRR
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
EROMON
ROMHM
ROMON
Reset
0
0
0
0
0
EROMCTL
0
ROMCTL
= Unimplemented or Reserved
Figure 23-10. MMC Control Register (MMCCTL1)
Read: Anytime. In emulation modes read operations will return the data from the external bus. In all other
modes the data are read from this register.
Write: Refer to each bit description. In emulation modes write operations will also be directed to the
external bus.
CAUTION
XGATE write access to this register during an CPU access which makes use
of this register could lead to unexpected results.
Table 23-9. MMCCTL1 Field Descriptions
Field
Description
2
Enables emulated Flash or ROM memory in the memory map
EROMON Write: Never
0 Disables the emulated Flash or ROM in the memory map.
1 Enables the emulated Flash or ROM in the memory map.
1
FLASH or ROM only in higher Half of Memory Map
ROMHM
Write: Once in normal and emulation modes and anytime in special modes
0 The fixed page of Flash or ROM can be accessed in the lower half of the memory map. Accesses to
$4000–$7FFF will be mapped to $7F_4000-$7F_7FFF in the global memory space.
1 Disables access to the Flash or ROM in the lower half of the memory map.These physical locations of the
Flash or ROM can still be accessed through the program page window. Accesses to $4000–$7FFF will be
mapped to $14_4000-$14_7FFF in the global memory space (external access).
0
Enable FLASH or ROM in the memory map
ROMON
Write: Once in normal and emulation modes and anytime in special modes
0 Disables the Flash or ROM from the memory map.
1 Enables the Flash or ROM in the memory map.
EROMON and ROMON control the visibility of the Flash in the memory map for CPU or BDM (not for
XGATE). Both local and global memory maps are affected.
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 23 Memory Mapping Control (S12XMMCV2)
Table 23-10. Data Sources when CPU or BDM is Accessing Flash Area
1
2
Chip Modes
ROMON
EROMON
DATA SOURCE
Stretch
Normal Single Chip
Special Single Chip
Emulation Single Chip
X
X
Internal
N
X
X
0
1
0
1
1
0
1
0
1
Emulation Memory
Internal Flash
N
Normal Expanded
X
X
X
0
External Application
Internal Flash
Y
N
Y
N
Emulation Expanded
External Application
Emulation Memory
Internal Flash
1
Special Test
X
X
External Application
Internal Flash
N
1
2
Internal means resources inside the MCU are read/written.
Internal Flash means Flash resources inside the MCU are read/written.
Emulation memory means resources inside the emulator are read/written (PRU registers, flash
replacement, RAM, EEPROM and register space are always considered internal).
External application means resources residing outside the MCU are read/written.
The external access stretch mechanism is part of the EBI module (refer to EBI Block Guide for details).
23.3.2.6 RAM Page Index Register (RPAGE)
Address: 0x0016
7
6
5
4
3
2
1
0
R
W
RP7
RP6
RP5
RP4
RP3
RP2
RP1
RP0
Reset
1
1
1
1
1
1
0
1
Figure 23-11. RAM Page Index Register (RPAGE)
Read: Anytime
Write: Anytime
The RAM page index register allows accessing up to (1M minus 2K) bytes of RAM in the global memory
map by using the eight page index bits to page 4 Kbyte blocks into the RAM page window located in the
CPU local memory map from address $1000 to address $1FFF (see Figure 1-12).
CAUTION
XGATE write access to this register during an CPU access which makes use
of this register could lead to unexpected results.
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 23 Memory Mapping Control (S12XMMCV2)
Global Address [22:0]
Bit19 Bit18
Bit12
Bit0
Bit11
0
0
0
Address [11:0]
RPAGE Register [7:0]
Address: CPU Local Address
or BDM Local Address
Figure 23-12. RPAGE Address Mapping
NOTE
Because RAM page 0 has the same global address as the register space, it is
possible to write to registers through the RAM space when RPAGE = $00.
Table 23-11. RPAGE Field Descriptions
Description
Field
7–0
RAM Page Index Bits 7–0 — These page index bits are used to select which of the 256 RAM array pages is to
RP[7:0]
be accessed in the RAM Page Window.
The reset value of $FD ensures that there is a linear RAM space available between addresses $1000 and
$3FFF out of reset.
The fixed 4K page from $2000–$2FFF of RAM is equivalent to page 254 (page number $FE).
The fixed 4K page from $3000–$3FFF of RAM is equivalent to page 255 (page number $FF).
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 23 Memory Mapping Control (S12XMMCV2)
23.3.2.7 EEPROM Page Index Register (EPAGE)
Address: 0x0017
7
6
5
4
3
2
1
0
R
W
EP7
EP6
EP5
EP4
EP3
EP2
EP1
EP0
Reset
1
1
1
1
1
1
1
0
Figure 23-13. EEPROM Page Index Register (EPAGE)
Read: Anytime
Write: Anytime
The EEPROM page index register allows accessing up to 256 Kbyte of EEPROM in the global memory
map by using the eight page index bits to page 1 Kbyte blocks into the EEPROM page window located in
the local CPU memory map from address $0800 to address $0BFF (see Figure 1-14).
CAUTION
XGATE write access to this register during an CPU access which makes use
of this register could lead to unexpected results.
Global Address [22:0]
Bit17 Bit16
Bit10
Bit0
Bit9
0
0
1
0
0
Address [9:0]
EPAGE Register [7:0]
Address: CPU Local Address
or BDM Local Address
Figure 23-14. EPAGE Address Mapping
Table 23-12. EPAGE Field Descriptions
Description
Field
7–0
EEPROM Page Index Bits 7–0 — These page index bits are used to select which of the 256 EEPROM array
EP[7:0]
pages is to be accessed in the EEPROM Page Window.
The reset value of $FE ensures that there is a linear EEPROM space available between addresses $0800
and $0FFF out of reset.
The fixed 1K page $0C00–$0FFF of EEPROM is equivalent to page 255 (page number $FF).
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 23 Memory Mapping Control (S12XMMCV2)
23.3.2.8 Program Page Index Register (PPAGE)
Address: 0x0030
7
6
5
4
3
2
1
0
R
W
PIX7
PIX6
PIX5
PIX4
PIX3
PIX2
PIX1
PIX0
Reset
1
1
1
1
1
1
1
0
Figure 23-15. Program Page Index Register (PPAGE)
Read: Anytime
Write: Anytime
The program page index register allows accessing up to 4 Mbyte of FLASH or ROM in the global memory
map by using the eight page index bits to page 16 Kbyte blocks into the program page window located in
the CPU local memory map from address $8000 to address $BFFF (see Figure 1-16). The CPU has a
special access to read and write this register during execution of CALL and RTC instructions.
CAUTION
XGATE write access to this register during an CPU access which makes use
of this register could lead to unexpected results.
Global Address [22:0]
1
Bit21
Bit0
Bit14 Bit13
PPAGE Register [7:0]
Address [13:0]
Address: CPU Local Address
or BDM Local Address
Figure 23-16. PPAGE Address Mapping
NOTE
Writes to this register using the special access of the CALL and RTC
instructions will be complete before the end of the instruction execution.
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 23 Memory Mapping Control (S12XMMCV2)
Table 23-13. PPAGE Field Descriptions
Field
Description
7–0
Program Page Index Bits 7–0 — These page index bits are used to select which of the 256 FLASH or ROM
PIX[7:0]
array pages is to be accessed in the Program Page Window.
The fixed 16K page from $4000–$7FFF (when ROMHM = 0) is the page number $FD.
The reset value of $FE ensures that there is linear Flash space available between addresses $4000 and
$FFFF out of reset.
The fixed 16K page from $C000-$FFFF is the page number $FF.
23.3.2.9 RAM Write Protection Control Register (RAMWPC)
Address: 0x011C
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
RWPE
AVIE
AVIF
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 23-17. RAM Write Protection Control Register (RAMWPC)
Read: Anytime
Write: Anytime
Table 23-14. RAMWPC Field Descriptions
Description
Field
7
RAM Write Protection Enable — This bit enables the RAM write protection mechanism. When the RWPE bit
is cleared, there is no write protection and any memory location is writable by the CPU module and the XGATE
module. When the RWPE bit is set the write protection mechanism is enabled and write access of the CPU or
to the XGATE RAM region. Write access performed by the XGATE module to outside of the XGATE RAM region
or the shared region is suppressed as well in this case.
RWPE
0 RAM write protection check is disabled, region boundary registers can be written.
1 RAM write protection check is enabled, region boundary registers cannot be written.
1
AVIE
CPU Access Violation Interrupt Enable — This bit enables the Access Violation Interrupt. If AVIE is set and
AVIF is set, an interrupt is generated.
0 CPU Access Violation Interrupt Disabled.
1 CPU Access Violation Interrupt Enabled.
0
AVIF
CPU Access Violation Interrupt Flag — When set, this bit indicates that the CPU has tried to write a memory
location inside the XGATE RAM region. This flag can be reset by writing’1’ to the AVIF bit location.
0 No access violation by the CPU was detected.
1 Access violation by the CPU was detected.
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 23 Memory Mapping Control (S12XMMCV2)
23.3.2.10 RAM XGATE Upper Boundary Register (RAMXGU)
Address: 0x011D
7
6
5
4
3
2
1
0
R
W
1
1
XGU6
XGU5
XGU4
XGU3
XGU2
XGU1
XGU0
Reset
1
1
1
1
1
1
1
= Unimplemented or Reserved
Figure 23-18. RAM XGATE Upper Boundary Register (RAMXGU)
Read: Anytime
Write: Anytime when RWPE = 0
Table 23-15. RAMXGU Field Descriptions
Field
Description
6–0
XGU[6:0]
XGATE Region Upper Boundary Bits 6-0 — These bits define the upper boundary of the RAM region allocated
to the XGATE module in multiples of 256 bytes. The 256 byte block selected by this register is included in the
region. See Figure 1-25 for details.
23.3.2.11 RAM Shared Region Lower Boundary Register (RAMSHL)
Address: 0x011E
7
6
5
4
3
2
1
0
R
W
1
SHL6
SHL5
SHL4
SHL3
SHL2
SHL1
SHL0
Reset
1
1
1
1
1
1
1
1
= Unimplemented or Reserved
Figure 23-19. RAM Shared Region Lower Boundary Register (RAMSHL)
Read: Anytime
Write: Anytime when RWPE = 0
Table 23-16. RAMSHL Field Descriptions
Field
Description
6–0
SHL[6:0]
RAM Shared Region Lower Boundary Bits 6–0 — These bits define the lower boundary of the shared memory
region in multiples of 256 bytes. The block selected by this register is included in the region. See Figure 1-25 for
details.
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 23 Memory Mapping Control (S12XMMCV2)
23.3.2.12 RAM Shared Region Upper Boundary Register (RAMSHU)
Address: 0x011F
7
6
5
4
3
2
1
0
R
W
1
SHU6
SHU5
SHU4
SHU3
SHU2
SHU1
SHU0
Reset
1
1
1
1
1
1
1
1
= Unimplemented or Reserved
Figure 23-20. RAM Shared Region Upper Boundary Register (RAMSHU)
Read: Anytime
Write: Anytime when RWPE = 0
Table 23-17. RAMSHU Field Descriptions
Field
Description
6–0
SHU[6:0]
RAM Shared Region Upper Boundary Bits 6–0 — These bits define the upper boundary of the shared
memory in multiples of 256 bytes. The block selected by this register is included in the region. See Figure 1-25
for details.
23.4 Functional Description
The MMC block performs several basic functions of the S12X sub-system operation: MCU operation
modes, priority control, address mapping, select signal generation and access limitations for the system.
Each aspect is described in the following subsections.
23.4.1 MCU Operating Mode
•
Normal single-chip mode
There is no external bus in this mode. The MCU program is executed from the internal memory
and no external accesses are allowed.
•
Special single-chip mode
This mode is generally used for debugging single-chip operation, boot-strapping or security related
operations. The active background debug mode is in control of the CPU code execution and the
BDM firmware is waiting for serial commands sent through the BKGD pin. There is no external
bus in this mode.
•
Emulation single-chip mode
Tool vendors use this mode for emulation systems in which the user’s target application is normal
single-chip mode. Code is executed from external or internal memory depending on the set-up of
the EROMON bit (see Section 1.3.2.5, “MMC Control Register (MMCCTL1)”). The external bus
is active in both cases to allow observation of internal operations (internal visibility).
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 23 Memory Mapping Control (S12XMMCV2)
•
Normal expanded mode
The external bus interface is configured as an up to 23-bit address bus, 8 or 16-bit data bus with
dedicated bus control and status signals. This mode allows 8 or 16-bit external memory and
peripheral devices to be interfaced to the system. The fastest external bus rate is half of the internal
bus rate. An external signal can be used in this mode to cause the external bus to wait as desired by
the external logic.
•
•
Emulation expanded mode
Tool vendors use this mode for emulation systems in which the user’s target application is normal
expanded mode.
Special test mode
This mode is an expanded mode for factory test.
23.4.2 Memory Map Scheme
23.4.2.1 CPU and BDM Memory Map Scheme
The BDM firmware lookup tables and BDM register memory locations share addresses with other
modules; however they are not visible in the memory map during user’s code execution. The BDM
memory resources are enabled only during the READ_BD and WRITE_BD access cycles to distinguish
between accesses to the BDM memory area and accesses to the other modules. (Refer to BDM Block
Guide for further details).
When MCU enters active BDM mode the BDM firmware lookup tables and the BDM registers become
visible in the local memory map between addresses $FF00 and $FFFF and the CPU begins execution of
firmware commands or the BDM begins execution of hardware commands. The resources which share
memory space with the BDM module will not be visible in the memory map during active BDM mode.
Please note that after the MCU enters active BDM mode the BDM firmware lookup tables and the BDM
registers will also be visible between addresses $BF00 and $BFFF if the PPAGE register contains value of
$FF.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
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Chapter 23 Memory Mapping Control (S12XMMCV2)
CPU or BDM
Global Memory Map
Local Memory Map
$00_0000
2K Registers
2K RAM
$00_0800
$00_1000
$0000
RAM
253*4K paged
2K Registers
$0800
EEPROM
EPAGE
$0F_E000
$10_0000
1K window
8K RAM
$0C00
1K EEPROM
$1000
RAM
4K window
EEPROM
255*1K paged
RPAGE
$2000
$13_FC00
1K EEPROM
8K RAM
$14_0000
$14_4000
$4000
ROMHM=1
$14_8000
$40_0000
External
Space
Unpaged Flash
No
$8000
Flash
16K window
PPAGE
PPAGES
253 * 16K
$C000
$FFFF
Unpaged Flash
Reset Vectors
$7F_4000
$7F_8000
Unpaged
or PPAGE $FD
16K
Unpaged
16K
or PPAGE $FE
$7F_C000
$7F_FFFF
Unpaged
16K
or PPAGE $FF
Figure 23-21. Expansion of the Local Address Map
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 23 Memory Mapping Control (S12XMMCV2)
23.4.2.1.1
Expansion of the Local Address Map
Expansion of the CPU Local Address Map
The program page index register in MMC allows accessing up to 4 Mbyte of FLASH or ROM in the global
memory map by using the eight page index bits to page 256 16 Kbyte blocks into the program page
window located from address $8000 to address $BFFF in the local CPU memory map.
The page value for the program page window is stored in the PPAGE register. The value of the PPAGE
register can be read or written by normal memory accesses as well as by the CALL and RTC instructions
(see Section 1.5.1, “CALL and RTC Instructions”).
Control registers, vector space and parts of the on-chip memories are located in unpaged portions of the
64-kilobyte local CPU address space.
The starting address of an interrupt service routine must be located in unpaged memory unless the user is
certain that the PPAGE register will be set to the appropriate value when the service routine is called.
However an interrupt service routine can call other routines that are in paged memory. The upper
16-kilobyte block of the local CPU memory space ($C000–$FFFF) is unpaged. It is recommended that all
reset and interrupt vectors point to locations in this area or to the other upages sections of the local CPU
memory map.
Table 1-19 summarizes mapping of the address bus in Flash/External space based on the address, the
PPAGE register value and value of the ROMHM bit in the MMCCTL1 register.
Table 23-18. Global FLASH/ROM Allocated
Local
CPU Address
External
Access
ROMHM
Global Address
$4000–$7FFF
$8000–$BFFF
$C000–$FFFF
0
No
$7F_4000 –$7F_7FFF
$14_4000–$14_7FFF
$40_0000–$7F_FFFF
1
Yes
1
N/A
N/A
N/A
No
1
Yes
No
$7F_C000–$7F_FFFF
1
The internal or the external bus is accessed based on the size of the memory resources
implemented on-chip. Please refer to Figure 1-23 for further details.
The RAM page index register allows accessing up to 1 Mbyte –2 Kbytes of RAM in the global memory
map by using the eight RPAGE index bits to page 4 Kbyte blocks into the RAM page window located in
the local CPU memory space from address $1000 to address $1FFF. The EEPROM page index register
EPAGE allows accessing up to 256 Kbytes of EEPROM in the system by using the eight EPAGE index
bits to page 1 Kbyte blocks into the EEPROM page window located in the local CPU memory space from
address $0800 to address $0BFF.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
901
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Chapter 23 Memory Mapping Control (S12XMMCV2)
Expansion of the BDM Local Address Map
PPAGE, RPAGE, and EPAGE registers are also used for the expansion of the BDM local address to the
global address. These registers can be read and written by the BDM.
The BDM expansion scheme is the same as the CPU expansion scheme.
23.4.2.2 Global Addresses Based on the Global Page
CPU Global Addresses Based on the Global Page
The seven global page index bits allow access to the full 8 Mbyte address map that can be accessed with
23 address bits. This provides an alternative way to access all of the various pages of FLASH, RAM and
EEPROM as well as additional external memory.
The GPAGE Register is used only when the CPU is executing a global instruction (see Section 1.3.2.3,
“Global Page Index Register (GPAGE)”). The generated global address is the result of concatenation of
the CPU local address [15:0] with the GPAGE register [22:16] (see Figure 1-7).
BDM Global Addresses Based on the Global Page
The seven BDMGPR Global Page index bits allow access to the full 8 Mbyte address map that can be
accessed with 23 address bits. This provides an alternative way to access all of the various pages of
FLASH, RAM and EEPROM as well as additional external memory.
The BDM global page index register (BDMGPR) is used only in the case the CPU is executing a firmware
command which uses a global instruction (like GLDD, GSTD) or by a BDM hardware command (like
WRITE_W, WRITE_BYTE, READ_W, READ_BYTE). See the BDM Block Guide for further details.
The generated global address is a result of concatenation of the BDM local address with the BDMGPR
register [22:16] in the case of a hardware command or concatenation of the CPU local address and the
BDMGPR register [22:16] in the case of a firmware command (see Figure 1-22).
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 23 Memory Mapping Control (S12XMMCV2)
BDM HARDWARE COMMAND
Global Address [22:0]
Bit16 Bit15
Bit22
Bit0
BDMGPR Register [6:0]
BDM Local Address
BDM FIRMWARE COMMAND
Global Address [22:0]
Bit22
Bit16 Bit15
Bit0
BDMGPR Register [6:0]
CPU Local Address
Figure 23-22. BDMGPR Address Mapping
23.4.2.3 Implemented Memory Map
The global memory spaces reserved for the internal resources (RAM, EEPROM, and FLASH) are not
determined by the MMC module. Size of the individual internal resources are however fixed in the design
of the device cannot be changed by the user. Please refer to the Device User Guide for further details.
Figure 1-23 and Table 1-20 show the memory spaces occupied by the on-chip resources. Please note that
the memory spaces have fixed top addresses.
Table 23-19. Global Implemented Memory Space
Internal Resource
Bottom Address
Top Address
Registers
RAM
$00_0000
$00_07FF
$0F_FFFF
$13_FFFF
$7F_FFFF
1
$10_0000 minus RAMSIZE
2
EEPROM
FLASH
$14_0000 minus EEPROMSIZE
3
$80_0000 minus FLASHSIZE
1
2
3
RAMSIZE is the hexadecimal value of RAM SIZE in bytes
EEPROMSIZE is the hexadecimal value of EEPROM SIZE in bytes
FLASHSIZE is the hexadecimal value of FLASH SIZE in bytes
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 23 Memory Mapping Control (S12XMMCV2)
When the device is operating in expanded modes except emulation single-chip mode, accesses to the
global addresses which are not occupied by the on-chip resources (unimplemented areas or external space)
result in accesses to the external bus (see Figure 1-23).
In emulation single-chip mode, accesses to the global addresses which are not occupied by the on-chip
resources (unimplemented areas) result in accesses to the external bus. CPU accesses to the global
addresses which are occupied by the external space result in an illegal access reset (system reset). The
BDM accesses to the external space are performed but the data is undefined.
In single-chip modes an access to any of the unimplemented areas (see Figure 1-23) by the CPU (except
firmware commands) results in an illegal access reset (system reset). The BDM accesses to the
unimplemented areas are performed but the data is undefined.
Misaligned word accesses to the last location (Top address) of any of the on-chip resource blocks (except
RAM) by the CPU is performed in expanded modes. In single-chip modes these accesses (except Flash)
result in an illegal access reset (except firmware commands).
Misaligned word accesses to the last location (top address) of the on-chip RAM by the CPU is ignored in
expanded modes (read of undefined data). In single-chip modes these accesses result in an illegal access
reset (except firmware commands).
No misaligned word access from the BDM module will occur. These accesses are blocked in the BDM
(Refer to BDM Block Guide).
Misaligned word accesses to the last location of any global page (64 Kbyte) by using global instructions,
is performed by accessing the last byte of the page and the first byte of the same page, considering the
above mentioned misaligned access cases.
The non internal resources (unimplemented areas or external space) are used to generate the chip selects
(CS0,CS1,CS2 and CS3) (see Figure 1-23), which are only active in normal expanded mode, emulation
expanded mode, and special test mode (see Section 1.3.2.1, “MMC Control Register (MMCCTL0)”).
Table 1-21 shows the address boundaries of each chip select and the relationship with the implemented
resources (internal) parameters.
Table 23-20. Global Chip Selects Memory Space
Chip Selects
Bottom Address
Top Address
1
CS3
CS2
$00_0800
$10_0000
$14_0000
$20_0000
$40_0000
$0F_FFFF minus RAMSIZE
2
$13_FFFF minus EEPROMSIZE
$1F_FFFF
3
CS2
CS1
$3F_FFFF
4
5
CS0
$7F_FFFF minus FLASHSIZE
1
2
3
External RPAGE accesses in (NX, EX and ST)
External EPAGE accesses in (NX, EX and ST)
When ROMHM is set (see ROMHM in Table 1-19) the CS2 is asserted in the space occupied by this on-chip
memory block.
4
5
When the internal NVM is enabled (see ROMON in Section 1.3.2.5, “MMC Control Register (MMCCTL1)”)
the CS0 is not asserted in the space occupied by this on-chip memory block.
External PPAGE accesses in (NX, EX and ST)
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 23 Memory Mapping Control (S12XMMCV2)
CPU and BDM
Global Memory Map
Local Memory Map
$00_0000
$00_0800
2K Registers
Unimplemented
RAM
$0000
2K Registers
RAM
$0800
EEPROM
1K window
EPAGE
RPAGE
$0F_FFFF
$0C00
$1000
1K EEPROM
Unimplemented
EEPROM
RAM
4K window
$2000
$4000
$8000
EEPROM
$13_FFFF
$1F_FFFF
8K RAM
External
Space
Unpaged Flash
$40_0000
Unimplemented
FLASH
Flash
16K window
PPAGE
$C000
$FFFF
Unpaged Flash
Reset Vectors
FLASH
$7F_FFFF
Figure 23-23. Local to Implemented Global Address Mapping (Without GPAGE)
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
905
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Chapter 23 Memory Mapping Control (S12XMMCV2)
23.4.2.4 XGATE Memory Map Scheme
23.4.2.4.1
Expansion of the XGATE Local Address Map
The XGATE 64 Kbyte memory space allows access to internal resources only (Registers, RAM, and
FLASH). The 2 Kilobyte register address range is the same register address range as for the CPU and the
BDM module (see Table 1-22).
XGATE can access the FLASH in single chip modes, even when the MCU is secured. In expanded modes,
XGATE can not access the FLASH when MCU is secured.
The local address of the XGATE RAM access is translated to the global RAM address range. The XGATE
shares the RAM resource with the CPU and the BDM module (see Table 1-22).
XGATE RAM size (XGRAMSIZE) could be lower or equal than the MCU RAM size (RAMSIZE).
The local address of the XGATE FLASH access is translated to the global address as defined by
Table 1-22.
Table 23-21. XGATE Implemented Memory Space
Internal Resource
Bottom Address
Top Address
Registers
RAM
$00_0000
$10_0000 minus XGRAMSIZE
$80_0000 minus
$00_07FF
$0F_FFFF
1
FLASH
Bottom address plus $F800
minus XGRAMSIZE minus $1
2
3
FLASHSIZE plus $800
1
2
3
XGRAMSIZE is the hexadecimal value of XGATE RAM SIZE in bytes.
FLASHSIZE is the hexadecimal value of FLASH SIZE in bytes.
$F800 is the hexadecimal value of the 64 Kilobytes minus 2 Kilobytes (Registers).
Example 23-3.
The MCU FLASHSIZE is 64 Kbytes ($10000) and MCU RAMSIZE is 32 Kbytes ($8000).
The XGATE RAMSIZE is 16 Kbytes ($4000).
The space occupied by the XGATE RAM in the global address space will be:
Bottom address: ($10_0000 minus $4000) = $0F_C000
Top address: $0F_FFFF
XGATE accesses to local address range $0800–$BFFF will result in accesses to the following
FLASH block in the global address space:
Bottom address: ($80_0000 minus $01_0000 plus $800) = $7F_0800
Top address: ($7F_0800 plus ($F800 minus $4000 minus $1)) = $7F_BFFF
MC9S12XDP512 Data Sheet, Rev. 2.11
906
Freescale Semiconductor
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Chapter 23 Memory Mapping Control (S12XMMCV2)
XGATE
Global Memory Map
Local Memory Map
$00_0000
2K Registers
$00_0800
$0000
2K Registers
$0800
RAM
$0F_FFFF
FLASH
RAM
$FFFF
FLASH
$7F_FFFF
Figure 23-24. Local to Global Address Mapping (XGATE)
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
907
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Chapter 23 Memory Mapping Control (S12XMMCV2)
23.4.3 Chip Access Restrictions
23.4.3.1 Illegal XGATE Accesses
A possible access error is flagged by the MMC and signalled to XGATE under the following conditions:
•
•
•
•
XGATE performs misaligned word (in case of load-store or opcode or vector fetch accesses).
XGATE accesses the register space (in case of opcode or vector fetch).
XGATE performs a write to Flash in any modes (in case of load-store access).
XGATE performs an access to a secured Flash in expanded modes (in case of load-store or opcode
or vector fetch accesses).
•
XGATE performs a write to non-XGATE region in RAM (RAM protection mechanism) (in case
of load-store access).
For further details refer to the XGATE Block Guide.
23.4.3.2 Illegal CPU Accesses
After programming the protection mechanism registers (see Figure 1-17, Figure 1-18, Figure 1-19, and
Figure 1-20) and setting the RWPE bit (see Figure 1-17) there are 3 regions recognized by the MMC
module:
1. XGATE RAM region
2. CPU RAM region
3. Shared Region (XGATE AND CPU)
If the RWPE bit is set the CPU write accesses into the XGATE RAM region are blocked. If the CPU tries
to write the XGATE RAM region the AVIF bit is set and an interrupt is generated if enabled. Furthermore
if the XGATE tries to write to outside of the XGATE RAM or shared regions and the RWPE bit is set, the
write access is suppressed and the access error will be flagged to the XGATE module (see Section 1.4.3.1,
“Illegal XGATE Accesses” and the XGATE Block Guide).
The bottom address of the XGATE RAM region always starts at the lowest implemented RAM address.
The values stored in the boundary registers define the boundary addresses in 256 byte steps. The 256 byte
block selected by any of the registers is always included in the respective region. For example setting the
shared region lower boundary register (RAMSHL) to $C1 and the shared region upper boundary register
(RAMSHU) to $E0 defines the shared region from address $0F_C100 to address $0F_E0FF in the global
memory space (see Figure 1-25).
The interrupt requests generated by the MMC are listed in Table 1-23. Refer to the Device User Guide for
the related interrupt vector address and interrupt priority.
MC9S12XDP512 Data Sheet, Rev. 2.11
908
Freescale Semiconductor
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Chapter 23 Memory Mapping Control (S12XMMCV2)
The following conditions must be satisfied to ensure correct operation of the RAM protection mechanism:
•
•
Value stored in RAMXGU must be lower than the value stored in RAMSHL.
Value stored RAMSHL must be lower or equal than the value stored in RAMSHU.
Table 23-22. RAM Write Protection Interrupt Vectors
Interrupt Source
CCR Mask
Local Enable
CPU access violation
I Bit
AVIE in RAMWPC
$00_0000
$00_0800
2K Registers
Unimplemented
XGATE RAM
Region
Only XGATE is allowed to write
Only CPU is allowed to write
$0F_RAMXGU_FF
$0F_RAMSHL_00
$0F_RAMSHU_FF
Shared Region
CPU and XGATE are allowed to write
Only CPU is allowed to write
$0F_FFFF
Figure 23-25. RAM Write Protection Scheme
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
909
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Chapter 23 Memory Mapping Control (S12XMMCV2)
23.4.4 Chip Bus Control
The MMC controls the address buses and the data buses that interface the S12X masters (CPU, BDM and
XGATE) with the rest of the system (master buses). In addition the MMC handles all CPU read data bus
swapping operations. All internal and external resources are connected to specific target buses (see
Figure 1-26).
BDM
CPU
XGATE
XGATE
S12X
S12X
MMC
XBus2
XRAM
XBus1
BDM
ROM/REG
EBI
RAM
XBus0
P3
P2
P1
IPBI
P0
XEEPROM
XFLASH
IO
2 Kbyte Registers
Figure 23-26. S12X Architecture
23.4.4.1 Master Bus Prioritization
The following rules apply when prioritizing accesses over master buses:
•
The CPU has priority over the BDM, unless the BDM access is stalled for more than 128 cycles.
In the later case the CPU will be stalled after finishing the current operation and the BDM will gain
access to the bus.
•
XGATE access to PRU registers constitutes a special case. It is always granted and stalls the CPU
and BDM for its duration.
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 23 Memory Mapping Control (S12XMMCV2)
23.4.4.2 Access Conflicts on Target Buses
The arbitration scheme allows only one master to be connected to a target at any given time. The following
rules apply when prioritizing accesses from different masters to the same target bus:
•
•
•
CPU always has priority over XGATE.
BDM access has priority over XGATE.
XGATE access to PRU registers constitutes a special case. It is always granted and stalls the CPU
and BDM for its duration.
•
•
In emulation modes all internal accesses are visible on the external bus as well.
During access to the PRU registers, the external bus is reserved.
23.4.5 Interrupts
23.4.5.1 Outgoing Interrupt Requests
The following interrupt requests can be triggered by the MMC module:
CPU access violation: The CPU access violation signals to the CPU detection of an error condition in the
CPU application code which is resulted in write access to the protected XGATE RAM area (see
Section 1.4.3.2, “Illegal CPU Accesses”).
23.5 Initialization/Application Information
23.5.1 CALL and RTC Instructions
CALL and RTC instructions are uninterruptable CPU instructions that automate page switching in the
program page window. The CALL instruction is similar to the JSR instruction, but the subroutine that is
called can be located anywhere in the local address space or in any Flash or ROM page visible through the
program page window. The CALL instruction calculates and stacks a return address, stacks the current
PPAGE value and writes a new instruction-supplied value to the PPAGE register. The PPAGE value
controls which of the 256 possible pages is visible through the 16 Kbyte program page window in the
64 Kbyte local CPU memory map. Execution then begins at the address of the called subroutine.
During the execution of the CALL instruction, the CPU performs the following steps:
1. Writes the current PPAGE value into an internal temporary register and writes the new
instruction-supplied PPAGE value into the PPAGE register
2. Calculates the address of the next instruction after the CALL instruction (the return address) and
pushes this 16-bit value onto the stack
3. Pushes the temporarily stored PPAGE value onto the stack
4. Calculates the effective address of the subroutine, refills the queue and begins execution at the new
address
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
911
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Chapter 23 Memory Mapping Control (S12XMMCV2)
This sequence is uninterruptable. There is no need to inhibit interrupts during the CALL instruction
execution. A CALL instruction can be performed from any address to any other address in the local CPU
memory space.
The PPAGE value supplied by the instruction is part of the effective address of the CPU. For all addressing
mode variations (except indexed-indirect modes) the new page value is provided by an immediate operand
in the instruction. In indexed-indirect variations of the CALL instruction a pointer specifies memory
locations where the new page value and the address of the called subroutine are stored. Using indirect
addressing for both the new page value and the address within the page allows usage of values calculated
at run time rather than immediate values that must be known at the time of assembly.
The RTC instruction terminates subroutines invoked by a CALL instruction. The RTC instruction unstacks
the PPAGE value and the return address and refills the queue. Execution resumes with the next instruction
after the CALL instruction.
During the execution of an RTC instruction the CPU performs the following steps:
1. Pulls the previously stored PPAGE value from the stack
2. Pulls the 16-bit return address from the stack and loads it into the PC
3. Writes the PPAGE value into the PPAGE register
4. Refills the queue and resumes execution at the return address
This sequence is uninterruptable. The RTC can be executed from anywhere in the local CPU memory
space.
The CALL and RTC instructions behave like JSR and RTS instruction, they however require more
execution cycles. Usage of JSR/RTS instructions is therefore recommended when possible and
CALL/RTC instructions should only be used when needed. The JSR and RTS instructions can be used to
access subroutines that are already present in the local CPU memory map (i.e. in the same page in the
program memory page window for example). However calling a function located in a different page
requires usage of the CALL instruction. The function must be terminated by the RTC instruction. Because
the RTC instruction restores contents of the PPAGE register from the stack, functions terminated with the
RTC instruction must be called using the CALL instruction even when the correct page is already present
in the memory map. This is to make sure that the correct PPAGE value will be present on stack at the time
of the RTC instruction execution.
23.5.2 Port Replacement Registers (PRRs)
Registers used for emulation purposes must be rebuilt by the in-circuit emulator hardware to achieve full
emulation of single chip mode operation. These registers are called port replacement registers (PRRs) (see
Table 1-25). PRRs are accessible from all masters using different access types (word aligned,
word-misaligned and byte). Each access to PRRs will be extended to 2 bus cycles for write or read accesses
independent of the operating mode. In emulation modes all write operations result in writing into the
internal registers (peripheral access) and into the emulated registers (external access) located in the PRU
in the emulator at the same time. All read operations are performed from external registers (external
access) in emulation modes. In all other modes the read operations are performed from the internal
registers (peripheral access).
MC9S12XDP512 Data Sheet, Rev. 2.11
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Chapter 23 Memory Mapping Control (S12XMMCV2)
Due to internal visibility of CPU accesses the CPU will be halted during XGATE or BDM access to any
PRR. This rule applies also in normal modes to ensure that operation of the device is the same as in
emulation modes.
A summary of PRR accesses is the following:
•
•
An aligned word access to a PRR will take 2 bus cycles.
A misaligned word access to a PRRs will take 4 cycles. If one of the two bytes accessed by the
misaligned word access is not a PRR, the access will take only 3 cycles.
•
A byte access to a PRR will take 2 cycles.
Table 23-23. PRR Listing
PRR Name
PRR Local Address
PRR Location
PORTA
PORTB
DDRA
$0000
$0001
$0002
$0003
$0004
$0005
$0006
$0007
$0008
$0009
$000A
$000B
$000C
$000D
$000E
$000F
$0012
$0013
$001C
$001D
$0032
$0033
PIM
PIM
PIM
PIM
PIM
PIM
PIM
PIM
PIM
PIM
MMC
MMC
PIM
PIM
EBI
DDRB
PORTC
PORTD
DDRC
DDRD
PORTE
DDRE
MMCCTL0
MODE
PUCR
RDRIV
EBICTL0
EBICTL1
Reserved
MMCCTL1
ECLKCTL
Reserved
PORTK
DDRK
EBI
MMC
MMC
PIM
PIM
PIM
PIM
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
913
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Chapter 23 Memory Mapping Control (S12XMMCV2)
23.5.3 On-Chip ROM Control
The MCU offers two modes to support emulation. In the first mode (called generator) the emulator
provides the data instead of the internal FLASH and traces the CPU actions. In the other mode (called
observer) the internal FLASH provides the data and all internal actions are made visible to the emulator.
23.5.3.1 ROM Control in Single-Chip Modes
In single-chip modes the MCU has no external bus. All memory accesses and program fetches are internal
(see Figure 1-27).
MCU
No External Bus
Flash
Figure 23-27. ROM in Single Chip Modes
23.5.3.2 ROM Control in Emulation Single-Chip Mode
In emulation single-chip mode the external bus is connected to the emulator. If the EROMON bit is set,
the internal FLASH provides the data and the emulator can observe all internal CPU actions on the external
bus. If the EROMON bit is cleared, the emulator provides the data (generator) and traces the all CPU
actions (see Figure 1-28).
Observer
MCU
Emulator
Flash
EROMON = 1
Generator
MCU
Emulator
Flash
EROMON = 0
Figure 23-28. ROM in Emulation Single-Chip Mode
MC9S12XDP512 Data Sheet, Rev. 2.11
914
Freescale Semiconductor
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Chapter 23 Memory Mapping Control (S12XMMCV2)
23.5.3.3 ROM Control in Normal Expanded Mode
In normal expanded mode the external bus will be connected to the application. If the ROMON bit is set,
the internal FLASH provides the data. If the ROMON bit is cleared, the application memory provides the
data (see Figure 1-29).
MCU
Application
Flash
Memory
ROMON = 1
MCU
Application
Memory
ROMON = 0
Figure 23-29. ROM in Normal Expanded Mode
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
915
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Chapter 23 Memory Mapping Control (S12XMMCV2)
23.5.3.4 ROM Control in Emulation Expanded Mode
In emulation expanded mode the external bus will be connected to the emulator and to the application. If
the ROMON bit is set, the internal FLASH provides the data. If the EROMON bit is set as well the
emulator observes all CPU internal actions, otherwise the emulator provides the data and traces all CPU
actions (see Figure 1-30). When the ROMON bit is cleared, the application memory provides the data and
the emulator will observe the CPU internal actions (see Figure 1-31).
Observer
MCU
Emulator
Flash
Application
Memory
EROMON = 1
Generator
MCU
Emulator
Flash
Application
Memory
EROMON = 0
Figure 23-30. ROMON = 1 in Emulation Expanded Mode
MC9S12XDP512 Data Sheet, Rev. 2.11
916
Freescale Semiconductor
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Chapter 23 Memory Mapping Control (S12XMMCV2)
Observer
MCU
Emulator
Application
Memory
Figure 23-31. ROMON = 0 in Emulation Expanded Mode
23.5.3.5 ROM Control in Special Test Mode
In special test mode the external bus is connected to the application. If the ROMON bit is set, the internal
FLASH provides the data, otherwise the application memory provides the data (see Figure 1-32).
Application
MCU
Memory
ROMON = 0
Application
MCU
Memory
Flash
ROMON = 1
Figure 23-32. ROM in Special Test Mode
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
917
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Chapter 23 Memory Mapping Control (S12XMMCV2)
MC9S12XDP512 Data Sheet, Rev. 2.11
918
Freescale Semiconductor
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Appendix A Electrical Characteristics
Appendix A
Electrical Characteristics
A.1
General
NOTE
The electrical characteristics given in this section should be used as a guide
only. Values cannot be guaranteed by Freescale and are subject to change
without notice.
This supplement contains the most accurate electrical information for the MC9S12XDP512
microcontroller available at the time of publication.
This introduction is intended to give an overview on several common topics like power supply, current
injection etc.
A.1.1
Parameter Classification
The electrical parameters shown in this supplement are guaranteed by various methods. To give the
customer a better understanding the following classification is used and the parameters are tagged
accordingly in the tables where appropriate.
NOTE
This classification is shown in the column labeled “C” in the parameter
tables where appropriate.
P:
Those parameters are guaranteed during production testing on each individual device.
C:
Those parameters are achieved by the design characterization by measuring a statistically relevant
sample size across process variations.
T:
Those parameters are achieved by design characterization on a small sample size from typical
devices under typical conditions unless otherwise noted. All values shown in the typical column
are within this category.
D:
Those parameters are derived mainly from simulations.
A.1.2
Power Supply
The MC9S12XDP512 utilizes several pins to supply power to the I/O ports, A/D converter, oscillator, and
PLL as well as the digital core.
The V
The V
, V
pair supplies the A/D converter and parts of the internal voltage regulator.
SSA
DDA
, V , V
, and V
pairs supply the I/O pins, V
supplies also the internal voltage
DDX
SSX
DDR
SSR
DDR
regulator.
V
, V , V
, and V
are the supply pins for the digital logic, V
, V
supply the
SSPLL
DD1
SS1
DD2
SS2
DDPLL
oscillator and the PLL.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
919
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Appendix A Electrical Characteristics
V
V
and V
are internally connected by metal.
SS1
SS2
, V
, V
as well as V , V , V
are connected by anti-parallel diodes for ESD
SSR
DDA
DDX
DDR
SSA
SSX
protection.
NOTE
is used for either V
In the following context V
, V
, and V
;
DDX
DD35
DDA
DDR
V
is used for either V , V
and V
unless otherwise noted.
SS35
SSA
SSR
SSX
I
V
denotes the sum of the currents flowing into the V
pins.
, V
and
DDX
DD35
DDA
DDR
V
V
is used for V
, V
and V
, V is used for V , V
and
DD
DD1
DD2
DDPLL
SS
SS1
SS2
.
SSPLL
I
is used for the sum of the currents flowing into V
and V
.
DD
DD1
DD2
A.1.3
Pins
There are four groups of functional pins.
A.1.3.1
I/O Pins
Those I/O pins have a nominal level in the range of 3.15 V to 5.5 V. This class of pins is comprised of all
port I/O pins, the analog inputs, BKGD and the RESET pins.The internal structure of all those pins is
identical; however, some of the functionality may be disabled. For example, for the analog inputs the
output drivers, pull-up and pull-down resistors are disabled permanently.
A.1.3.2
Analog Reference
This group is made up by the V and V pins.
RH
RL
A.1.3.3
Oscillator
The pins XFC, EXTAL, XTAL dedicated to the oscillator have a nominal 2.5 V level. They are supplied
by V
.
DDPLL
A.1.3.4
TEST
This pin is used for production testing only.
A.1.3.5
V
REGEN
This pin is used to enable the on-chip voltage regulator.
A.1.4
Current Injection
Power supply must maintain regulation within operating V
or V range during instantaneous and
DD
DD35
operating maximum current conditions. If positive injection current (V > V
) is greater than I
,
in
DD35
DD35
MC9S12XDP512 Data Sheet, Rev. 2.11
920
Freescale Semiconductor
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Appendix A Electrical Characteristics
the injection current may flow out of V
and could result in external power supply going out of
DD35
regulation. Ensure external V
load will shunt current greater than maximum injection current. This
DD35
will be the greatest risk when the MCU is not consuming power; e.g., if no system clock is present, or if
clock rate is very low which would reduce overall power consumption.
A.1.5
Absolute Maximum Ratings
Absolute maximum ratings are stress ratings only. A functional operation under or outside those maxima
is not guaranteed. Stress beyond those limits may affect the reliability or cause permanent damage of the
device.
This device contains circuitry protecting against damage due to high static voltage or electrical fields;
however, it is advised that normal precautions be taken to avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage level (e.g., either V
or V
).
SS35
DD35
1
Table A-1. Absolute Maximum Ratings
Num
Rating
Symbol
Min
Max
Unit
1
2
I/O, regulator and analog supply voltage
V
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–25
6.0
3.0
3.0
0.3
0.3
6.0
6.0
3.0
10.0
+25
V
V
DD35
2
Digital logic supply voltage
V
DD
2
3
PLL supply voltage
V
V
DDPLL
4
Voltage difference V
Voltage difference V
to V
to V
and V
and V
∆
VDDX
V
DDX
SSX
DDR
DDA
5
∆
V
SSR
SSA
VSSX
6
Digital I/O input voltage
Analog reference
V
V
IN
7
V
V
V
RH, RL
8
XFC, EXTAL, XTAL inputs
TEST input
V
V
ILV
9
V
V
TEST
10
Instantaneous maximum current
I
mA
D
3
Single pin limit for all digital I/O pins
11
12
13
Instantaneous maximum current
I
–25
–0.25
–65
+25
0
mA
mA
°C
DL
4
Single pin limit for XFC, EXTAL, XTAL
Instantaneous maximum current
I
DT
5
Single pin limit for TEST
Storage temperature range
T
155
stg
1
2
Beyond absolute maximum ratings device might be damaged.
The device contains an internal voltage regulator to generate the logic and PLL supply out of the I/O supply. The absolute
maximum ratings apply when the device is powered from an external source.
3
4
5
All digital I/O pins are internally clamped to V
and V
, V
and V
or V
and V
.
SSX
DDX
SSR
DDR
SSA
DDA
Those pins are internally clamped to V
and V
.
DDPLL
SSPLL
This pin is clamped low to V
, but not clamped high. This pin must be tied low in applications.
SSPLL
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
921
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Appendix A Electrical Characteristics
A.1.6
ESD Protection and Latch-up Immunity
All ESD testing is in conformity with CDF-AEC-Q100 stress test qualification for automotive grade
integrated circuits. During the device qualification ESD stresses were performed for the Human Body
Model (HBM) and the Charge Device Model.
A device will be defined as a failure if after exposure to ESD pulses the device no longer meets the device
specification. Complete DC parametric and functional testing is performed per the applicable device
specification at room temperature followed by hot temperature, unless specified otherwise in the device
specification.
Table A-2. ESD and Latch-up Test Conditions
Model
Description
Symbol
Value
Unit
Human Body
Series resistance
R1
C
1500
100
Ohm
pF
Storage capacitance
Number of pulse per pin
Positive
—
—
3
3
Negative
Latch-up
Minimum input voltage limit
Maximum input voltage limit
–2.5
7.5
V
V
Table A-3. ESD and Latch-Up Protection Characteristics
Num
C
Rating
Human Body Model (HBM)
Symbol
Min
Max
Unit
1
2
3
C
C
C
V
V
I
2000
500
—
—
V
V
HBM
CDM
LAT
Charge Device Model (CDM)
Latch-up current at T = 125°C
mA
A
Positive
Negative
+100
–100
—
—
4
C
Latch-up current at T = 27°C
I
mA
A
LAT
Positive
+200
–200
—
—
Negative
MC9S12XDP512 Data Sheet, Rev. 2.11
922
Freescale Semiconductor
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Appendix A Electrical Characteristics
A.1.7
Operating Conditions
This section describes the operating conditions of the device. Unless otherwise noted those conditions
apply to all the following data.
NOTE
A
J
dissipation calculations refer to Section A.1.8, “Power Dissipation and
Thermal Characteristics”.
Table A-4. Operating Conditions
Rating
Symbol
Min
Typ
Max
Unit
I/O, regulator and analog supply voltage
V
3.15
2.35
2.35
–0.1
–0.1
0.5
5
2.5
2.5
0
5.5
2.75
2.75
0.1
0.1
16
V
V
DD35
1
Digital logic supply voltage
V
DD
2
PLL supply voltage
V
V
DDPLL
Voltage difference V
Voltage difference V
Oscillator
to V
to V
and V
and V
∆
VDDX
V
DDX
DDR
DDA
∆
0
V
SSX
SSR
SSA
VSSX
f
—
—
MHz
MHz
°C
osc
Bus frequency
f
0.5
40
bus
MC9S12XDP512C
Operating junction temperature range
Operating ambient temperature range
T
–40
–40
—
27
100
85
J
2
2
2
T
A
MC9S12XDP512V
°C
°C
Operating junction temperature range
Operating ambient temperature range
T
–40
–40
—
27
120
105
J
T
A
MC9S12XDP512M
Operating junction temperature range
Operating ambient temperature range
T
–40
–40
—
27
140
125
J
T
A
1
2
The device contains an internal voltage regulator to generate the logic and PLL supply out of the I/O supply. The absolute
maximum ratings apply when this regulator is disabled and the device is powered from an external source.
Please refer to Section A.1.8, “Power Dissipation and Thermal Characteristics” for more details about the relation between
ambient temperature T and device junction temperature T .
A
J
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
923
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Appendix A Electrical Characteristics
A.1.8
Power Dissipation and Thermal Characteristics
Power dissipation and thermal characteristics are closely related. The user must assure that the maximum
operating junction temperature is not exceeded. The average chip-junction temperature (T ) in °C can be
J
obtained from:
T
= T + (P • Θ
)
J
A
D
JA
T
T
P
= Junction Temperature, [°C]
= Ambient Temperature, [°C]
= Total Chip Power Dissipation, [W]
J
A
D
Θ
= Package Thermal Resistance, [°C/W]
JA
The total power dissipation can be calculated from:
P
= P
+ P
D
INT
IO
P
= Chip Internal Power Dissipation, [W]
INT
Two cases with internal voltage regulator enabled and disabled must be considered:
1. Internal voltage regulator disabled
P
= I
⋅ V
+ I
⋅ V
+ I
⋅ V
INT
DD DD DDPLL DDPLL DDA DDA
2
P
=
R
⋅ I
DSON IO
∑
IO
i
i
P
is the sum of all output currents on I/O ports associated with V
and V
.
IO
DDX
DDR
For R
is valid:
DSON
V
OL
R
= -----------;for outputs driven low
DSON
V
I
OL
respectively
– V
DD5
OH
R
= -----------------------------------;for outputs driven high
DSON
I
OH
2. Internal voltage regulator enabled
P
= I
⋅ V
+ I
⋅ V
INT
DDR DDR DDA DDA
I
is the current shown in Table A-10 and not the overall current flowing into V
, which
DDR
DDR
additionally contains the current flowing into the external loads with output high.
2
P
=
R
⋅ I
DSON IO
∑
IO
i
i
P
is the sum of all output currents on I/O ports associated with V
and V
.
IO
DDX
DDR
MC9S12XDP512 Data Sheet, Rev. 2.11
924
Freescale Semiconductor
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Appendix A Electrical Characteristics
1
Table A-5. Thermal Package Characteristics
Num
C
Rating
Symbol
Min
Typ
Max
Unit
LQFP144
2
1
2
T
T
Thermal resistance LQFP144, single sided PCB
θ
—
—
—
—
41
32
°C/W
°C/W
JA
Thermal resistance LQFP144, double sided PCB
θ
JA
3
with 2 internal planes
3
4
5
Junction to Board LQFP 144
θ
—
—
—
—
—
—
22
7.4
3
°C/W
°C/W
°C/W
JB
4
Junction to Case LQFP 144
θ
JC
5
Junction to Package Top LQFP144
Ψ
JT
LQFP112
2
6
7
T
T
Thermal resistance LQFP112, single sided PCB
θ
—
—
—
—
43
32
°C/W
°C/W
JA
Thermal resistance LQFP112, double sided PCB
θ
JA
3
with 2 internal planes
8
9
Junction to Board LQFP112
θ
—
—
—
—
—
—
22
7
°C/W
°C/W
°C/W
JB
4
Junction to Case LQFP112
θ
JC
5
10
Junction to Package Top LQFP112
Ψ
3
JT
QFP80
2
11
12
T
T
Thermal resistance QFP 80, single sided PCB
θ
—
—
—
—
45
33
°C/W
°C/W
JA
Thermal resistance QFP 80, double sided PCB
θ
JA
3
with 2 internal planes
13
14
15
T
T
T
Junction to Board QFP 80
θ
—
—
—
—
—
—
19
11
3
°C/W
°C/W
°C/W
JB
4
Junction to Case QFP 80
θ
JC
5
Junction to Package Top QFP 80
Ψ
JT
1
2
The values for thermal resistance are achieved by package simulations
Junction to ambient thermal resistance, θ was simulated to be equivalent to the JEDEC specification JESD51-2 in a
JA
horizontal configuration in natural convection.
3
4
Junction to ambient thermal resistance, θ was simulated to be equivalent to the JEDEC specification JESD51-7 in a
JA
horizontal configuration in natural convection.
Junction to case thermal resistance was simulated to be equivalent to the measured values using the cold plate technique with
the cold plate temperature used as the “case” temperature. This basic cold plate measurement technique is described by
MIL-STD 883D, Method 1012.1. This is the correct thermal metric to use to calculate thermal performance when the package
is being used with a heat sink.
5
Thermal characterization parameter Ψ is the “resistance” from junction to reference point thermocouple on top center of the
JT
case as defined in JESD51-2. Ψ is a useful value to use to estimate junction temperature in a steady state customer
JT
enviroment.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
925
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Appendix A Electrical Characteristics
A.1.9
I/O Characteristics
This section describes the characteristics of all I/O pins except EXTAL, XTAL,XFC,TEST and supply
pins.
Table A-6. 3.3-V I/O Characteristics
Conditions are 3.15 V < V
I/O Characteristics for all I/O pins except EXTAL, XTAL,XFC,TEST and supply pins.
< 3.6 V temperature from –40°C to +140°C, unless otherwise noted
DD35
Num
C
Rating
Symbol
Min
Typ
Max
Unit
1
P Input high voltage
T Input high voltage
P Input low voltage
T Input low voltage
C Input hysteresis
V
V
0.65*V
—
—
—
—
V
V
IH
IH
DD35
V
+ 0.3
DD35
2
V
V
—
—
0.35*V
V
IL
DD35
V
– 0.3
—
—
V
IL
SS35
3
4
V
250
—
mV
µA
HYS
P Input leakage current (pins in high impedance input
I
–1
1
in
1
mode)
V
= V
DD35
or V
SS35
in
5
6
7
8
9
C Output high voltage (pins in output mode)
Partial drive I = –0.75 mA
V
V
V
– 0.4
– 0.4
—
—
—
—
—
—
V
V
V
V
DD35
OH
OH
P Output high voltage (pins in output mode)
V
OH
DD35
Full drive I = –4 mA
OH
C Output low voltage (pins in output mode)
V
V
I
—
0.4
0.4
OL
Partial Drive I = +0.9 mA
OL
P Output low voltage (pins in output mode)
—
OL
Full Drive I
= +4.75 mA
OL
P Internal pull up device current, tested at V max.
—
-6
—
6
—
—
—
—
6
–60
-
µA
µA
µA
µA
pF
IL
PUL
PUH
PDH
10 C Internal pull up device current, tested at V min.
I
I
IH
11 P Internal pull down device current, tested at V min.
60
—
—
IH
12 C Internal pull down device current, tested at V max.
I
PDL
IL
13 D Input capacitance
C
—
in
2
14
T Injection current
Single pin limit
—
mA
I
I
–2.5
–25
2.5
25
ICS
ICP
Total device limit, sum of all injected currents
3
15 P Port H, J, P interrupt input pulse filtered
t
t
—
—
—
3
µs
µs
PULSE
PULSE
3
16 P Port H, J, P interrupt input pulse passed
10
—
1
Maximum leakage current occurs at maximum operating temperature. Current decreases by approximately one-half for each
8 C to 12 C in the tempearture range from 50°C to 125°C.
Refer to Section A.1.4, “Current Injection” for more details
2
3
Parameter only applies in stop or pseudo stop mode.
MC9S12XDP512 Data Sheet, Rev. 2.11
926
Freescale Semiconductor
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Appendix A Electrical Characteristics
Table A-7. 5-V I/O Characteristics
Conditions are 4.5 V < V
I/O Characteristics for all I/O pins except EXTAL, XTAL,XFC,TEST and supply pins.
< 5.5 V temperature from –40°C to +140°C, unless otherwise noted
DD35
Num
C
Rating
Symbol
Min
Typ
Max
Unit
1
P Input high voltage
T Input high voltage
P Input low voltage
T Input low voltage
C Input hysteresis
V
0.65*V
—
—
—
—
V
V
DD35
IH
V
V
+ 0.3
IH
DD35
2
V
—
—
0.35*V
V
IL
IL
DD35
V
V
– 0.3
—
—
—
1
V
SS35
3
4
V
250
—
mV
µA
HYS
P Input leakage current (pins in high impedance input
I
–1
in
1
mode)
V
= V
DD35
or V
SS35
in
5
6
7
8
9
C Output high voltage (pins in output mode)
Partial drive I = –2 mA
V
V
V
– 0.8
– 0.8
—
—
—
—
—
—
V
V
V
V
DD35
DD35
OH
OH
P Output high voltage (pins in output mode)
V
OH
Full drive I = –10 mA
OH
C Output low voltage (pins in output mode)
V
V
I
—
0.8
0.8
OL
Partial drive I = +2 mA
OL
P Output low voltage (pins in output mode)
—
OL
Full drive I
= +10 mA
OL
P Internal pull up device current, tested at V max
—
–10
—
—
—
—
—
6
–130
—
µA
µA
µA
µA
pF
IL
PUL
PUH
PDH
10 C Internal pull up device current, tested at V min
I
I
IH
11
P Internal pull down device current, tested at V min
130
—
IH
12 C Internal pull down device current, tested at V max
I
10
—
IL
PDL
13 D Input capacitance
C
—
in
2
14
T Injection current
Single pin limit
—
mA
I
I
–2.5
–25
2.5
25
ICS
ICP
Total device Limit, sum of all injected currents
3
15
16
P Port H, J, P interrupt input pulse filtered
t
t
—
—
—
3
µs
µs
PULSE
PULSE
3
P Port H, J, P interrupt input pulse passed
10
—
1
Maximum leakage current occurs at maximum operating temperature. Current decreases by approximately one-half for each
8 C to 12 C in the tempearture range from 50°C to 125°C.
Refer to Section A.1.4, “Current Injection” for more details
2
3
Parameter only applies in stop or pseudo stop mode.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
927
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Appendix A Electrical Characteristics
Table A-8. I/O Characteristics for Port C, D, PE5, PE6, and PE7
for Reduced Input Voltage Thresholds
Conditions are 4.5 V < V
< 5.5 V Temperature from –40°C to +140°C, unless otherwise noted
DD35
Num
C
Rating
Symbol
Min
Typ
Max
Unit
1
2
3
P Input high voltage
P Input low voltage
C Input hysteresis
V
1.75
—
—
—
—
0.75
—
V
V
IH
V
IL
V
—
100
mV
HYS
A.1.10 Supply Currents
This section describes the current consumption characteristics of the device as well as the conditions for
the measurements.
A.1.10.1 Measurement Conditions
All measurements are without output loads. Unless otherwise noted the currents are measured in single
chip mode and the CPU and XGATE code is executed from RAM, V
=5.5V, internal voltage regulator
DD35
is enabled and the bus frequency is 40MHz using a 4-MHz oscillator in loop controlled Pierce mode.
Production testing is performed using a square wave signal at the EXTAL input.
MC9S12XDP512 Data Sheet, Rev. 2.11
928
Freescale Semiconductor
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Appendix A Electrical Characteristics
Table A-9. shows the configuration of the peripherals for run current measurement.
Table A-9. Peripheral Configurations for Run Supply Current Measurements
Peripheral
Configuration
MSCAN
configured to loop-back mode using
a bit rate of 1Mbit/s
SPI
SCI
IIC
configured to master mode,
continously transmit data (0x55 or
0xAA) at 1Mbit/s
configured into loop mode,
continously transmit data (0x55) at
speed of 57600 baud
operate in master mode and
continously transmit data (0x55 or
0xAA) at the bit rate of 100Kbit/s
PWM
ECT
configured to toggle its pins at the
rate of 40kHz
the peripheral shall be configured to
output compare mode, Pulse
accumulator and modulus counter
enabled.
ATD
the peripheral is configured to
operate at its maximum specified
frequency and to continuously
convert voltages on all input
channels in sequence.
XGATE
XGATE fetches code from RAM,
XGATE runs in an infinite loop , it
reads the Status and Flag registers
of CAN’s, SPI’s, SCI’s in sequence
and does some bit manipulation on
the data
24
COP
RTI
COP Warchdog Rate 2
enabled, RTI Control Register
(RTICTL) set to $FF
API
PIT
the module is configured to run from
the RC oscillator clock source.
PIT is enabled, Micro-timer register 0
and 1 loaded with $0F and timer
registers 0 to 3 are loaded with
$03/07/0F/1F.
DBG
the module is enabled and the
comparators are configured to
trigger in outside range. The range
covers all the code executed by the
core.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
929
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Appendix A Electrical Characteristics
A.1.10.2 Additional Remarks
In expanded modes the currents flowing in the system are highly dependent on the load at the address, data,
and control signals as well as on the duty cycle of those signals. No generally applicable numbers can
given. A very good estimate is to take the single chip currents and add the currents due to the external loads.
Table A-10. Run and Wait Current Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num
C
Rating
Symbol
Min
Typ
Max
Unit
Run supply current (Peripheral Configuration see Table A-9.)
1
1
2
P
Peripheral Set
I
110
mA
DD35
f
=4MHz, f =40MHz
osc
bus
1
Peripheral Set
C
T
T
f
=4MHz, f =40MHz
90
45
18
osc
bus
f
=4MHz, f =20MHz
osc
bus
f
=4MHz, f =8MHz
osc
bus
2
3
4
5
6
7
Peripheral Set
T
T
T
f
=4MHz, f =40MHz
70
35
15
osc
bus
f
=4MHz, f =20MHz
osc
bus
f
=4MHz, f =8MHz
osc
bus
3
Peripheral Set
T
T
T
f
=4MHz, f =40MHz
60
30
13
osc
bus
f
=4MHz, f =20MHz
osc
bus
f
=4MHz, f =8MHz
osc
bus
4
Peripheral Set
T
T
T
f
=4MHz, f =40MHz
56
28
12
osc
bus
f
=4MHz, f =20MHz
osc
bus
f
=4MHz, f =8MHz
osc
bus
5
Peripheral Set
T
T
T
f
=4MHz, f =40MHz
53
26
11
osc
bus
f
=4MHz, f =20MHz
osc
bus
f
=4MHz, f =8MHz
osc
bus
6
Peripheral Set
T
T
T
f
=4MHz, f =40MHz
50
25
10
osc
bus
f
=4MHz, f =20MHz
osc
bus
f
=4MHz, f =8MHz
osc
bus
Wait supply current
1
8
9
P
Peripheral Set ,PLL on
I
95
10
mA
DDW
XGATE executing code from RAM
2
Peripheral Set
T
T
f
=4MHz, f =40MHz
50
10
osc
bus
f
=4MHz, f =8MHz
osc
bus
10
P
All modules disabled, RTI enabled, PLL off
1
2
3
4
5
6
The following peripherals are on: ATD0/ATD1/ECT/IIC1/PWM/SPI0-SPI2/SCI0-SCI2/CAN0-CAN4/XGATE
The following peripherals are on: ATD0/ATD1/ECT/IIC1/PWM/SPI0-SPI2/SCI0-SCI2/CAN0-CAN4
The following peripherals are on: ATD0/ATD1/ECT/IIC1/PWM/SPI0-SPI2/SCI0-SCI2/
The following peripherals are on: ATD0/ATD1/ECT/IIC1/PWM/SPI0-SPI2
The following peripherals are on: ATD0/ATD1/ECT/IIC1/PWM/
The following peripherals are on: ATD0/ATD1/ECT/IIC1/
MC9S12XDP512 Data Sheet, Rev. 2.11
930
Freescale Semiconductor
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Appendix A Electrical Characteristics
Table A-11. Pseudo Stop and Full Stop Current
Conditions are shown in Table A-4 unless otherwise noted
Num
C
Rating
Symbol
Min
Typ
Max
Unit
Pseudo stop current (API, RTI, and COP disabled) PLL off
10
C
P
C
C
P
C
P
C
P
–40°C
I
—
—
—
—
—
—
—
—
—
200
300
400
500
600
—
500
—
—
2500
—
3500
—
7000
µA
DDPS
27°C
70°C
85°C
"C" Temp Option 100°C
105°C
"V" Temp Option 120°C
125°C
"M" Temp Option 140°C
800
1000
1200
1500
Pseudo stop current (API, RTI, and COP enabled) PLL off
11
C
C
C
C
C
C
C
–40°C
27°C
I
—
—
—
—
—
—
—
500
750
850
1000
1200
1500
2000
—
—
—
—
—
—
—
µA
µA
DDPS
70°C
85°C
105°C
125°C
140°C
Stop Current
12
C
P
C
C
P
C
P
C
P
–40°C
I
—
—
—
—
—
—
—
—
—
20
30
—
100
—
—
2000
—
3000
—
7000
DDS
27°C
70°C
100
200
250
400
500
600
1000
85°C
"C" Temp Option 100°C
105°C
"V" Temp Option 120°C
125°C
"M" Temp Option 140°C
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
931
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Appendix A Electrical Characteristics
A.2
ATD Characteristics
This section describes the characteristics of the analog-to-digital converter.
A.2.1
ATD Operating Characteristics
The Table A-12 and Table A-13 show conditions under which the ATD operates.
The following constraints exist to obtain full-scale, full range results:
V
≤ V ≤ V ≤ V ≤ V
.
DDA
SSA
RL
IN
RH
This constraint exists since the sample buffer amplifier can not drive beyond the power supply levels that
it ties to. If the input level goes outside of this range it will effectively be clipped.
Table A-12. ATD 5-V Operating Characteristics
Conditions are shown in Table A-4 unless otherwise noted, supply voltage 4.5 V < V
< 5.5 V
DDA
Num
C
Rating
Symbol
Min
Typ
Max
Unit
1
D Reference potential
Low
High
V
V
—
—
V /2
DDA
V
V
RL
SSA
V
V
/2
V
RH
DDA
DDA
1
2
3
4
C Differential reference voltage
D ATD clock frequency
V
-V
4.50
0.5
5.00
5.5
2.0
V
RH RL
f
MHz
ATDCLK
D ATD 10-bit conversion period
2
Clock cycles
N
T
14
7
—
—
28
14
Cycles
µs
CONV10
Conv, time at 2.0 MHz ATD clock f
ATDCLK
ATDCLK
CONV10
5
D ATD 8-Bit conversion period
2
Clock cycles
N
T
12
6
—
—
26
13
Cycles
µs
CONV8
CONV8
Conv, time at 2.0 MHz ATD clock f
6
7
8
D Recovery time (V
= 5.0 Volts)
t
—
—
—
—
—
—
20
µs
DDA
REC
P Reference supply current 2 ATD blocks on
P Reference supply current 1 ATD block on
I
I
0.750
0.375
mA
mA
REF
REF
1
2
Full accuracy is not guaranteed when differential voltage is less than 4.50 V
The minimum time assumes a final sample period of 2 ATD clocks cycles while the maximum time assumes a final sample
period of 16 ATD clocks.
MC9S12XDP512 Data Sheet, Rev. 2.11
932
Freescale Semiconductor
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Appendix A Electrical Characteristics
Table A-13. ATD Operating Characteristics 3.3V
Conditions are shown in Table A-4 unless otherwise noted, Supply Voltage 3.15V < VDDA < 3.6V
Num
C
Rating
Symbol
Min
Typ
Max
Unit
1
D Reference potential
Low
High
V
V
—
—
V /2
DDA
V
V
RL
SSA
V
V
/2
V
RH
DDA
DDA
1
2
3
4
C Differential reference voltage
D ATD clock frequency
V
-V
3.15
0.5
3.3
—
3.6
2.0
V
RH RL
f
MHz
ATDCLK
D ATD 10-bit conversion period
2
Clock cycles
N
T
14
7
—
—
28
14
Cycles
µs
CONV10
Conv, time at 2.0 MHz ATD clock f
ATDCLK
ATDCLK
CONV10
5
D ATD 8-bit conversion period
2
Clock cycles
N
T
12
6
—
—
26
13
Cycles
µs
CONV8
CONV8
Conv, time at 2.0 MHz ATD clock f
6
7
8
D Recovery time (V
= 5.0 Volts)
t
—
—
—
—
—
—
20
µs
DDA
REC
P Reference supply current 2 ATD blocks on
P Reference supply current 1 ATD block on
I
I
0.500
0.250
mA
mA
REF
REF
1
2
Full accuracy is not guaranteed when differential voltage is less than 3.15 V
The minimum time assumes a final sample period of 2 ATD clocks cycles while the maximum time assumes a final sample
period of 16 ATD clocks.
A.2.2
Factors Influencing Accuracy
Three factors — source resistance, source capacitance and current injection — have an influence on the
accuracy of the ATD.
A.2.2.1
Source Resistance
Due to the input pin leakage current as specified in Table A-7 in conjunction with the source resistance
there will be a voltage drop from the signal source to the ATD input. The maximum source resistance R
specifies results in an error of less than 1/2 LSB (2.5 mV) at the maximum leakage current. If device or
S
operating conditions are less than worst case or leakage-induced error is acceptable, larger values of source
resistance is allowed.
A.2.2.2
Source Capacitance
When sampling an additional internal capacitor is switched to the input. This can cause a voltage drop due
to charge sharing with the external and the pin capacitance. For a maximum sampling error of the input
voltage ≤ 1LSB, then the external filter capacitor, C ≥ 1024 * (C –C ).
f
INS INN
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
933
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Appendix A Electrical Characteristics
A.2.2.3
Current Injection
There are two cases to consider.
1. A current is injected into the channel being converted. The channel being stressed has conversion
values of $3FF ($FF in 8-bit mode) for analog inputs greater than V and $000 for values less
RH
than V unless the current is higher than specified as disruptive condition.
RL
2. Current is injected into pins in the neighborhood of the channel being converted. A portion of this
current is picked up by the channel (coupling ratio K), This additional current impacts the accuracy
of the conversion depending on the source resistance.
The additional input voltage error on the converted channel can be calculated as:
V
= K * R * I
ERR
S
INJ
with I being the sum of the currents injected into the two pins adjacent to the converted channel.
INJ
Table A-14. ATD Electrical Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num
C
Rating
Symbol
Min
Typ
Max
Unit
1
2
C Max input source resistance
R
—
—
1
KΩ
S
T Total input capacitance
Non sampling
pF
C
C
—
—
—
—
10
22
INN
INS
Sampling
3
4
5
C Disruptive analog input current
I
–2.5
—
—
—
—
2.5
mA
A/A
A/A
NA
-4
C Coupling ratio positive current injection
C Coupling ratio negative current injection
K
K
10
p
n
-2
—
10
MC9S12XDP512 Data Sheet, Rev. 2.11
934
Freescale Semiconductor
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Appendix A Electrical Characteristics
A.2.3
ATD Accuracy
5-V Range
A.2.3.1
Table A-15 specifies the ATD conversion performance excluding any errors due to current injection, input
capacitance, and source resistance.
Table A-15. 5-V ATD Conversion Performance
Conditions are shown in Table A-4 unless otherwise noted
V
= V –V = 5.12 V. Resulting to one 8-bit count = 20 mV and one 10-bit count = 5 mV
REF
RH RL
f
= 2.0 MHz
ATDCLK
Num
C
Rating
Symbol
Min
Typ
Max
Unit
1
2
3
4
5
6
7
8
P 10-bit resolution
LSB
DNL
INL
AE
—
–1
5
—
1
mV
P 10-bit differential nonlinearity
P 10-bit integral nonlinearity
—
Counts
Counts
Counts
mV
–2.5
–3
1.5
2.0
20
—
2.5
3
1
P 10-bit absolute error
P 8-bit resolution
LSB
DNL
INL
AE
—
—
P 8-bit differential nonlinearity
P 8-bit integral nonlinearity
–0.5
–1.0
–1.5
0.5
1.0
1.5
Counts
Counts
Counts
0.5
1.0
1
P 8-bit absolute error
1
These values include the quantization error which is inherently 1/2 count for any A/D converter.
A.2.3.2
3.3-V Range
Table A-16 specifies the ATD conversion performance excluding any errors due to current injection, input
capacitance, and source resistance.
Table A-16. 3.3-V ATD Conversion Performance
Conditions are shown in Table A-4 unless otherwise noted
V
= V –V = 3.328 V. Resulting to one 8-bit count = 13mV and one 10-bit count = 3.25 mV
REF
RH RL
f
= 2.0 MHz
ATDCLK
Num
C
Rating
Symbol
Min
Typ
Max
Unit
1
2
3
4
5
6
7
8
P 10-bit resolution
LSB
DNL
INL
AE
—
3.25
—
—
1.5
3.5
5
mV
P 10-bit differential nonlinearity
P 10-bit integral nonlinearity
–1.5
–3.5
–5
Counts
Counts
Counts
mV
1.5
2.5
13
1
P 10-bit absolute error
P 8-bit resolution
LSB
DNL
INL
AE
—
—
P 8-bit differential nonlinearity
P 8-bit integral nonlinearity
–0.5
–1.5
–2.0
—
0.5
1.5
2.0
Counts
Counts
Counts
1.0
1.5
1
P 8-bit absolute error
1
These values include the quantization error which is inherently 1/2 count for any A/D converter.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
935
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Appendix A Electrical Characteristics
A.2.3.3
ATD Accuracy Definitions
For the following definitions see also Figure A-1.
Differential non-linearity (DNL) is defined as the difference between two adjacent switching steps.
V – V
i
i – 1
DNL(i) =
– 1
--------------------------
1LSB
The integral non-linearity (INL) is defined as the sum of all DNLs:
n
V – V
n
0
INL(n) =
DNL(i) =
– n
--------------------
∑
1LSB
i = 1
MC9S12XDP512 Data Sheet, Rev. 2.11
936
Freescale Semiconductor
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Appendix A Electrical Characteristics
DNL
10-Bit Absolute Error Boundary
LSB
Vi-1
Vi
$3FF
$3FE
$3FD
$3FC
$3FB
$3FA
$3F9
$3F8
$3F7
$3F6
$3F5
$3F4
$3F3
8-Bit Absolute Error Boundary
$FF
$FE
$FD
2
9
8
7
6
5
4
3
2
1
0
Ideal Transfer Curve
10-Bit Transfer Curve
1
8-Bit Transfer Curve
5
10 15 20 25 30 35 40 50
50555060506550705075508050855090509551005105511051155120
Vin
mV
Figure A-1. ATD Accuracy Definitions
NOTE
Figure A-1 shows only definitions, for specification values refer to
Table A-15.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
937
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Appendix A Electrical Characteristics
A.3
NVM, Flash, and EEPROM
NOTE
Unless otherwise noted the abbreviation NVM (nonvolatile memory) is used
for both Flash and EEPROM.
A.3.1
NVM Timing
The time base for all NVM program or erase operations is derived from the oscillator. A minimum
oscillator frequency f is required for performing program or erase operations. The NVM modules
NVMOSC
do not have any means to monitor the frequency and will not prevent program or erase operation at
frequencies above or below the specified minimum. Attempting to program or erase the NVM modules at
a lower frequency a full program or erase transition is not assured.
The Flash and EEPROM program and erase operations are timed using a clock derived from the oscillator
using the FCLKDIV and ECLKDIV registers respectively. The frequency of this clock must be set within
the limits specified as f
.
NVMOP
The minimum program and erase times shown in Table A-17 are calculated for maximum f
and
NVMOP
maximum f . The maximum times are calculated for minimum f
and a f of 2 MHz.
bus
NVMOP
bus
A.3.1.1
Single Word Programming
The programming time for single word programming is dependant on the bus frequency as a well as on the
frequency f
and can be calculated according to the following formula.
NVMOP
1
1
-----------
f
t
= 9 ⋅
+ 25 ⋅
------------------------
f
swpgm
NVMOP
bus
A.3.1.2
Burst Programming
This applies only to the Flash where up to 64 words in a row can be programmed consecutively using burst
programming by keeping the command pipeline filled. The time to program a consecutive word can be
calculated as:
1
1
-----------
f
t
= 4 ⋅
+ 9 ⋅
------------------------
f
bwpgm
NVMOP
bus
The time to program a whole row is:
t
= t
+ 63 ⋅ t
brpgm
swpgm
bwpgm
Burst programming is more than 2 times faster than single word programming.
MC9S12XDP512 Data Sheet, Rev. 2.11
938
Freescale Semiconductor
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Appendix A Electrical Characteristics
A.3.1.3
Sector Erase
Erasing a 1024-byte Flash sector or a 4-byte EEPROM sector takes:
1
t
≈ 4000 ⋅
------------------------
f
era
NVMOP
The setup time can be ignored for this operation.
A.3.1.4
Mass Erase
Erasing a NVM block takes:
1
t
≈ 20000 ⋅
------------------------
f
mass
NVMOP
The setup time can be ignored for this operation.
A.3.1.5
Blank Check
The time it takes to perform a blank check on the Flash or EEPROM is dependant on the location of the
first non-blank word starting at relative address zero. It takes one bus cycle per word to verify plus a setup
of the command.
t
≈ location ⋅ t
+ 10 ⋅ t
check
cyc
cyc
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
939
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Appendix A Electrical Characteristics
Table A-17. NVM Timing Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num
C
Rating
Symbol
Min
Typ
Max
Unit
1
1
2
3
4
5
6
7
8
9
D External oscillator clock
f
0.5
1
—
—
—
—
—
—
—
—
—
—
80
MHz
MHz
kHz
µs
NVMOSC
D Bus frequency for programming or erase operations
D Operating frequency
f
—
NVMBUS
f
150
200
NVMOP
2
3
P Single word programming time
t
t
46
74.5
swpgm
4
2
3
D Flash burst programming consecutive word
20.4
31
µs
bwpgm
4
2
3
D Flash burst programming time for 64 words
t
1331.2
2027.5
µs
brpgm
5
3
P Sector erase time
t
20
26.7
ms
ms
era
5
3
P Mass erase time
t
100
133
mass
6
7
D Blank check time Flash per block
t
t
11
65546
t
t
check
check
cyc
cyc
6
7
10 D Blank check time EEPROM per block
11
2058
1
2
Restrictions for oscillator in crystal mode apply.
Minimum programming times are achieved under maximum NVM operating frequency f
and maximum bus frequency
NVMOP
f
.
bus
3
Maximum erase and programming times are achieved under particular combinations of f
and bus frequency f . Refer
bus
NVMOP
to formulae in Sections Section A.3.1.1, “Single Word Programming” – Section A.3.1.4, “Mass Erase” for guidance.
4
5
6
7
Burst programming operations are not applicable to EEPROM
Minimum erase times are achieved under maximum NVM operating frequency, f
Minimum time, if first word in the array is not blank
.
NVMOP
Maximum time to complete check on an erased block
MC9S12XDP512 Data Sheet, Rev. 2.11
940
Freescale Semiconductor
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Appendix A Electrical Characteristics
A.3.2
NVM Reliability
The reliability of the NVM blocks is guaranteed by stress test during qualification, constant process
monitors and burn-in to screen early life failures. The program/erase cycle count on the sector is
incremented every time a sector or mass erase event is executed
1
Table A-18. NVM Reliability Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num
C
Rating
Symbol
Min
Typ
Max
Unit
Flash Reliability Characteristics
2
1
2
3
4
C Data retention after 10,000 program/erase cycles at an
t
15
100
100
—
—
—
—
—
Years
FLRET
average junction temperature of TJavg ≤ 85°C
C Data retention with <100 program/erase cycles at an
average junction temperature TJavg ≤ 85°C
C Number of program/erase cycles
2
20
n
10,000
10,000
Cycles
FL
(–40°C ≤ T ≤ 0°C)
J
3
C Number of program/erase cycles
100,000
(0°C ≤ T ≤ 140°C)
J
EEPROM Reliability Characteristics
2
5
6
7
8
T
C Data retention after up to 100,000 program/erase cycles
t
15
20
100
—
—
—
—
Years
EEPRET
at an average junction temperature of TJavg ≤ 85°C
C Data retention with <100 program/erase cycles at an
average junction temperature TJavg ≤ 85°C
C Number of program/erase cycles
2
100
n
10,000
—
Cycles
EEP
(–40°C ≤ T ≤ 0°C)
J
3
C Number of program/erase cycles
100,000 300,000
(0°C < T ≤ 140°C)
J
1
2
will not exeed 85°C considering a typical temperature profile over the lifetime of a consumer, industrial or automotive
Javg
application.
Typical data retention values are based on intrinsic capability of the technology measured at high temperature and de-rated to
25°C using the Arrhenius equation. For additional information on how Freescale defines Typical Data Retention, please refer
to Engineering Bulletin EB618.
3
Spec table quotes typical endurance evaluated at 25°C for this product family, typical endurance at various temperature can
be estimated using the graph below. For additional information on how Freescale defines Typical Endurance, please refer to
Engineering Bulletin EB619.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
941
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Appendix A Electrical Characteristics
Figure A-2. Typical Endurance vs Temperature
500
450
400
350
300
250
200
150
100
50
0
60
80
120
-40
-20
0
20
40
100
140
Operating Temperature T [°C]
J
------ Flash
------ EEPROM
MC9S12XDP512 Data Sheet, Rev. 2.11
942
Freescale Semiconductor
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Appendix A Electrical Characteristics
A.4
Voltage Regulator
Table A-19. Voltage Regulator Electrical Characteristics
Num
C
Characteristic
Symbol
Min
Typ
Max
Unit
1
3
P
P
Input voltages
V
3.15
—
5.5
V
VDDR,A
Output voltage core
Full performance mode
Reduced power mode
Shutdown mode
V
DD
2.35
1.4
—
2.54
2.25
2.75
2.75
—
V
V
V
1
—
4
7
P
P
Output Voltage PLL
Full Performance Mode
Reduced power mode
Shutdown mode
V
DDPLL
2.35
1.25
—
2.54
2.25
—
2.75
2.75
—
V
V
V
2
3
Low-voltage interrupt
Assert level
Deassert level
V
V
4.0
4.15
4.37
4.52
4.66
4.77
V
V
LVIA
LVID
4
8
9
P
C
Low-voltage reset
V
LVRA
Assert level
2.25
—
—
V
5
Power-on reset
Assert level
Deassert level
V
V
0.97
—
—
—
—
2.05
V
V
PORA
PORD
6
12
C
Trimmed API internal clock
df
– 10%
—
+ 10%
—
API
∆f / f
nominal
1
High impedance output
High impedance output
2
3
Monitors V
voltage.
, active only in full performance mode. Indicates I/O and ADC performance degradation due to low supply
DDA
4
5
6
Monitors V , active only in full performance mode. MCU is monitored by the POR in RPM (see Figure A-1)
DD
Monitors V . Active in all modes.
DD
The API Trimming bits must be set that the minimum periode equals to 0.2 ms. f
= 1/0.2ms
nominal
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
943
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Appendix A Electrical Characteristics
A.5
Reset, Oscillator, and PLL
This section summarizes the electrical characteristics of the various startup scenarios for oscillator and
phase-locked loop (PLL).
A.5.1
Startup
Table A-20 summarizes several startup characteristics explained in this section. Detailed description of the
startup behavior can be found in the Clock and Reset Generator (CRG) Block Guide.
Table A-20. Startup Characteristics
Conditions are shown in Table A-4unless otherwise noted
Num
C
Rating
Symbol
Min
Typ
Max
Unit
1
2
3
4
5
V
D Reset input pulse width, minimum input time
D Startup from reset
PW
2
192
20
—
—
—
—
—
50
—
196
—
t
osc
RSTL
n
n
osc
RST
D Interrupt pulse width, IRQ edge-sensitive mode
D Wait recovery startup time
PW
ns
IRQ
t
14
t
cyc
WRS
1
D Fast wakeup from STOP
t
—
—
µs
fws
1
/V
filter capacitors 220 nF, V
= 5 V, T= 25°C
DD1 DD2
DD35
A.5.1.1
POR
The release level V
and the assert level V
are derived from the V supply. They are also valid
PORA DD
PORR
if the device is powered externally. After releasing the POR reset the oscillator and the clock quality check
are started. If after a time t no valid oscillation is detected, the MCU will start using the internal self
CQOUT
clock. The fastest startup time possible is given by n
.
uposc
A.5.1.2
SRAM Data Retention
Provided an appropriate external reset signal is applied to the MCU, preventing the CPU from executing
code when V is out of specification limits, the SRAM contents integrity is guaranteed if after the reset
DD35
the PORF bit in the CRG flags register has not been set.
A.5.1.3
External Reset
When external reset is asserted for a time greater than PW
the CRG module generates an internal
RSTL
reset, and the CPU starts fetching the reset vector without doing a clock quality check, if there was an
oscillation before reset.
A.5.1.4
Stop Recovery
Out of stop the controller can be woken up by an external interrupt. A clock quality check as after POR is
performed before releasing the clocks to the system.
MC9S12XDP512 Data Sheet, Rev. 2.11
944
Freescale Semiconductor
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Appendix A Electrical Characteristics
If the MCU is woken-up by an interrupt and the fast wake-up feature is enabled (FSTWKP = 1 and
SCME = 1), the system will resume operation in self-clock mode after t
.
fws
A.5.1.5
Pseudo Stop and Wait Recovery
The recovery from pseudo stop and wait are essentially the same since the oscillator was not stopped in
both modes. The controller can be woken up by internal or external interrupts. After t the CPU starts
wrs
fetching the interrupt vector.
A.5.2
Oscillator
The device features an internal low-power loop controlled Pierce oscillator and a full swing Pierce
oscillator/external clock mode. The selection of loop controlled Pierce oscillator or full swing Pierce
oscillator/external clock depends on the XCLKS signal which is sampled during reset. Before asserting the
oscillator to the internal system clocks the quality of the oscillation is checked for each start from either
power-on, STOP or oscillator fail. t
specifies the maximum time before switching to the internal self
CQOUT
clock mode after POR or STOP if a proper oscillation is not detected. The quality check also determines
the minimum oscillator start-up time t . The device also features a clock monitor. A clock monitor
UPOSC
failure is asserted if the frequency of the incoming clock signal is below the assert frequency f
CMFA.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
945
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Appendix A Electrical Characteristics
Table A-21. Oscillator Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num
C
Rating
Symbol
Min
Typ
Max
Unit
1a
1b
2
C Crystal oscillator range (loop controlled Pierce)
f
f
i
4.0
0.5
100
—
—
—
—
16
40
—
MHz
MHz
µA
ms
s
OSC
OSC
1, 2
C Crystal oscillator range (full swing Pierce)
P Startup current
OSC
3
4
3
C Oscillator start-up time (loop controlled Pierce)
D Clock quality check time-out
t
—
50
UPOSC
CQOUT
4
t
0.45
50
2.5
200
80
—
—
1
5
P Clock monitor failure assert frequency
P External square wave input frequency
D External square wave pulse width low
D External square wave pulse width high
D External square wave rise time
D External square wave fall time
f
100
—
—
—
—
—
7
KHz
MHz
ns
CMFA
6
f
0.5
5
EXT
7
t
EXTL
EXTH
EXTR
8
t
t
5
ns
9
—
ns
10
11
12
t
—
1
ns
EXTF
D Input capacitance (EXTAL, XTAL inputs)
C
—
—
—
pF
IN
5
P EXTAL pin input high voltage
V
V
0.75*
—
V
IH,EXTAL
V
DDPLL
5
T EXTAL pin input high voltage
—
—
—
V
+
V
V
IH,EXTAL
DDPLL
0.3
5
13
14
P EXTAL pin input low voltage
V
V
—
0.25*
IL,EXTAL
V
DDPLL
5
T EXTAL pin input low voltage
V
–
—
—
V
IL,EXTAL
SSPLL
0.3
5
C EXTAL pin input hysteresis
V
—
250
—
mV
HYS,EXTAL
1
2
3
4
5
Depending on the crystal a damping series resistor might be necessary
XCLKS = 0
f
= 4 MHz, C = 22 pF.
osc
Maximum value is for extreme cases using high Q, low frequency crystals
If full swing Pierce oscillator/external clock circuitry is used. (XCLKS = 0)
MC9S12XDP512 Data Sheet, Rev. 2.11
946
Freescale Semiconductor
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Appendix A Electrical Characteristics
A.5.3
Phase Locked Loop
The oscillator provides the reference clock for the PLL. The PLL´s voltage controlled oscillator (VCO) is
also the system clock source in self clock mode.
A.5.3.1
XFC Component Selection
This section describes the selection of the XFC components to achieve a good filter characteristics.
C
p
V
DDPLL
R
C
XFC Pin
s
Phase
VCO
KV
f
f
vco
f
1
ref
osc
D
KF
refdv+1
Detector
fcmp
Loop Divider
1
1
2
synr+1
Figure A-3. Basic PLL Functional Diagram
The following procedure can be used to calculate the resistance and capacitance values using typical values
for K , f and i from Table A-22.
1
1
ch
The grey boxes show the calculation for f
= 80 MHz and f = 4 MHz. For example, these frequencies
ref
VCO
are used for f
= 4-MHz and a 40-MHz bus clock.
OSC
The VCO gain at the desired VCO frequency is approximated by:
(f – f
)
1
vco
126 – 80
-------------------
–195
---------------------------
K ⋅ 1V
1
= -154.0MHz/V
= –195MHz ⁄ V ⋅ e
K
= K ⋅ e
V
1
The phase detector relationship is given by:
K
= – i
⋅ K = –3.5µA ⋅ (–154MHz ⁄ V) = 539.1Hz ⁄ Ω
Φ
ch
V
i is the current in tracking mode.
ch
The loop bandwidth f should be chosen to fulfill the Gardner’s stability criteria by at least a factor of 10,
C
typical values are 50. ζ = 0.9 ensures a good transient response.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
947
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Appendix A Electrical Characteristics
f
2 ⋅ ζ ⋅ f
ref
→ f < ------------;(ζ = 0.9)
ref
1
10
f
<
⋅
------------------------------------------ -----
C
C
4 ⋅ 10
2
⎛
⎞
π ⋅ ζ + 1 + ζ
⎝
⎠
f < 100kHz
C
And finally the frequency relationship is defined as
f
VCO
= 20
n = --------------- = 2 ⋅ (synr + 1)
f
ref
With the above values the resistance can be calculated. The example is shown for a loop bandwidth
f = 20 kHz:
C
2 ⋅ π ⋅ n ⋅ f
C
2 ⋅ π ⋅ 20 ⋅ 20kHz
-----------------------------------------
(539.1Hz) ⁄ Ω
R =
=
= 4.7kΩ
-----------------------------
K
Φ
The capacitance C can now be calculated as:
s
2
2 ⋅ ζ
= ---------------------- =
π ⋅ f ⋅ R
C
0.516
--------------
C
C
;(ζ = 0.9)
= 5.5nF = ~ 4.7nF
s
f
⋅ R
The capacitance C should be chosen in the range of:
p
C
C
s
s
≤ C ≤
------
------
C = 470pF
P
p
20
10
A.5.3.2
Jitter Information
The basic functionality of the PLL is shown in Figure A-3. With each transition of the clock f , the
cmp
deviation from the reference clock f is measured and input voltage to the VCO is adjusted
ref
accordingly.The adjustment is done continuously with no abrupt changes in the clock output frequency.
Noise, voltage, temperature and other factors cause slight variations in the control loop resulting in a clock
jitter. This jitter affects the real minimum and maximum clock periods as illustrated in Figure A-4.
1
2
3
N-1
N
0
t
min1
t
nom
t
max1
t
minN
t
maxN
Figure A-4. Jitter Definitions
MC9S12XDP512 Data Sheet, Rev. 2.11
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Appendix A Electrical Characteristics
The relative deviation of t
is at its maximum for one clock period, and decreases towards zero for larger
nom
number of clock periods (N).
Defining the jitter as:
t
(N)
t
(N)
⎛
⎞
⎟
⎠
max
min
J(N) = max 1 –
, 1 –
----------------------
----------------------
⎜
N ⋅ t
N ⋅ t
⎝
nom
nom
For N < 1000, the following equation is a good fit for the maximum jitter:
j
1
N
J(N) =
+ j
--------
2
J(N)
1
5
10
20
N
Figure A-5. Maximum Bus Clock Jitter Approximation
This is very important to notice with respect to timers, serial modules where a prescaler will eliminate the
effect of the jitter to a large extent.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
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Appendix A Electrical Characteristics
Table A-22. PLL Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num
C
Rating
Symbol
Min
Typ
Max
Unit
1
2
3
4
5
6
7
8
9
P Self clock mode frequency
f
1
8
—
—
5.5
80
4
MHz
MHz
SCM
D VCO locking range
f
VCO
1
D Lock detector transition from acquisition to tracking mode
D Lock detection
|∆
|
3
—
%
trk
1
|∆
|
0
—
1.5
2.5
8
%
Lock
1
D Unlock detection
|∆
|
|
0.5
6
—
%
unl
1
D Lock detector transition from tracking to acquisition mode
|∆
—
%
unt
2
C PLLON total stabilization delay (auto mode)
t
—
—
—
—
—
—
—
—
—
0.24
0.09
0.16
–195
126
38.5
3.5
—
ms
ms
stab
2
D PLLON acquisition mode stabilization delay
t
—
acq
2
D PLLON tracking mode stabilization delay
t
—
ms
al
10 D Fitting parameter VCO loop gain
11 D Fitting parameter VCO loop frequency
12 D Charge pump current acquisition mode
13 D Charge pump current tracking mode
K
—
MHz/V
MHz
µA
1
f
—
1
| i
|
|
—
ch
ch
| i
—
µA
2
14 C Jitter fit parameter 1
j
0.9
1.3
0.12
%
1
2
15 C Jitter fit parameter 2
j
0.02
%
2
1
2
% deviation from target frequency
f
= 4 MHz, f
= 40 MHz equivalent f
= 80 MHz: REFDV = #$00, SYNR = #$09, C = 4.7 nF, C = 470 pF, R = 4.7 kΩ
VCO
osc
BUS
S
P
S
A.6
MSCAN
Table A-23. MSCAN Wake-up Pulse Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num
C
Rating
Symbol
Min
Typ
Max
Unit
1
2
P MSCAN wakeup dominant pulse filtered
P MSCAN wakeup dominant pulse pass
t
—
5
—
—
2
µs
µs
WUP
t
—
WUP
A.7
SPI Timing
This section provides electrical parametrics and ratings for the SPI. In Table A-24 the measurement
conditions are listed.
Table A-24. Measurement Conditions
Description
Value
Unit
Drive mode
Full drive mode
50
—
pF
V
1
Load capacitance C
on all outputs
LOAD ,
Thresholds for delay measurement points
(20% / 80%) V
DDX
1
Timing specified for equal load on all SPI output pins. Avoid asymmetric load.
MC9S12XDP512 Data Sheet, Rev. 2.11
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Appendix A Electrical Characteristics
A.7.1
Master Mode
In Figure A-6 the timing diagram for master mode with transmission format CPHA = 0 is depicted.
SS1
(Output)
2
1
12
12
13
13
3
SCK
(CPOL = 0)
(Output)
4
4
SCK
(CPOL = 1)
(Output)
5
6
MISO
Bit 6 . . . 1
MSB IN2
10
MSB OUT2
LSB IN
(Input)
9
11
MOSI
(Output)
Bit 6 . . . 1
LSB OUT
1. If configured as an output.
2. LSBF = 0. For LSBF = 1, bit order is LSB, bit 1, ..., bit 6, MSB.
Figure A-6. SPI Master Timing (CPHA = 0)
In Figure A-7 the timing diagram for master mode with transmission format CPHA=1 is depicted.
SS1
(Output)
1
12
12
13
13
3
2
SCK
(CPOL = 0)
(Output)
4
4
SCK
(CPOL = 1)
(Output)
5
6
MISO
(Input)
MSB IN2
Bit 6 . . . 1
LSB IN
11
Bit 6 . . . 1
9
MOSI
(Output)
Port Data
Master LSB OUT
Port Data
Master MSB OUT2
1.If configured as output
2. LSBF = 0. For LSBF = 1, bit order is LSB, bit 1, ..., bit 6, MSB.
Figure A-7. SPI Master Timing (CPHA = 1)
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
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Appendix A Electrical Characteristics
In Table A-25 the timing characteristics for master mode are listed.
Table A-25. SPI Master Mode Timing Characteristics
Num
C
Characteristic
SCK frequency
Symbol
Min
Typ
Max
Unit
1
1
D
D
D
D
D
D
D
D
D
D
D
D
f
1/2048
2
—
—
1/2
2048
—
f
sck
bus
SCK period
t
t
bus
sck
2
Enable lead time
t
—
—
—
8
1/2
1/2
1/2
—
t
t
t
lead
sck
sck
sck
3
Enable lag time
t
—
lag
4
Clock (SCK) high or low time
Data setup time (inputs)
Data hold time (inputs)
Data valid after SCK edge
Data valid after SS fall (CPHA = 0)
Data hold time (outputs)
Rise and fall time inputs
Rise and fall time outputs
t
—
wsck
5
t
—
ns
ns
ns
ns
ns
ns
ns
su
6
t
8
—
—
hi
9
t
—
—
20
—
—
—
29
15
—
vsck
10
11
12
13
t
—
vss
t
—
ho
t
—
8
rfi
t
—
8
rfo
A.7.2
Slave Mode
In Figure A-8 the timing diagram for slave mode with transmission format CPHA = 0 is depicted.
SS
(Input)
1
12
12
13
13
3
SCK
(CPOL = 0)
(Input)
4
4
2
SCK
(CPOL = 1)
10
7
(Input)
8
9
11
11
MISO
(Output)
See
See
Bit 6 . . . 1
Slave LSB OUT
Slave MSB
6
Note
Note
5
MOSI
(Input)
Bit 6 . . . 1
MSB IN
LSB IN
NOTE: Not defined
Figure A-8. SPI Slave Timing (CPHA = 0)
MC9S12XDP512 Data Sheet, Rev. 2.11
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Appendix A Electrical Characteristics
In Figure A-9 the timing diagram for slave mode with transmission format CPHA = 1 is depicted.
SS
(Input)
3
1
12
13
13
2
SCK
(CPOL = 0)
(Input)
4
4
12
11
SCK
(CPOL = 1)
(Input)
8
9
MISO
See
Bit 6 . . . 1
Slave MSB OUT
Slave LSB OUT
LSB IN
Note
(Output)
7
5
6
MOSI
(Input)
MSB IN
Bit 6 . . . 1
NOTE: Not defined
Figure A-9. SPI Slave Timing (CPHA = 1)
In Table A-26 the timing characteristics for slave mode are listed.
Table A-26. SPI Slave Mode Timing Characteristics
Num
C
Characteristic
SCK frequency
Symbol
Min
Typ
Max
Unit
1
1
D
D
D
D
D
D
D
D
D
D
D
D
D
D
f
DC
4
—
—
—
—
—
—
—
—
—
—
—
—
—
—
1/4
f
sck
bus
SCK period
t
∞
t
sck
bus
2
Enable lead time
t
4
—
t
t
t
lead
bus
bus
bus
3
Enable lag time
t
4
—
lag
4
Clock (SCK) high or low time
Data setup time (inputs)
Data hold time (inputs)
Slave access time (time to data active)
Slave MISO disable time
Data valid after SCK edge
Data valid after SS fall
Data hold time (outputs)
Rise and fall time inputs
Rise and fall time outputs
t
4
—
wsck
5
t
8
—
ns
ns
ns
ns
ns
ns
ns
ns
ns
su
6
t
8
—
hi
7
t
—
—
—
—
20
—
—
20
a
8
t
22
dis
1
1
9
t
29 + 0.5 ⋅ t
vsck
bus
10
11
12
13
0.5 t
t
29 + 0.5 ⋅ t
vss
bus
t
—
8
ho
t
rfi
t
8
rfo
1
added due to internal synchronization delay
bus
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
953
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Appendix A Electrical Characteristics
A.8
External Bus Timing
The following conditions are assumed for all following external bus timing values:
•
•
•
Crystal input within 45% to 55% duty
Equal loads of pins
Pad full drive (reduced drive must be off)
A.8.1
Normal Expanded Mode (External Wait Feature Disabled)
1
1
CSx
ADDRx
ADDR1
ADDR2
2
3
RE
4
5
WE
8
6
7
11
10
DATAx
EWAIT
UDS, LDS
(Read) DATA1
(Write) DATA2
9
Figure A-10. Example 1a: Normal Expanded Mode — Read Followed by Write
MC9S12XDP512 Data Sheet, Rev. 2.11
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Appendix A Electrical Characteristics
Table A-27. Example 1a: Normal Expanded Mode Timing V
Characteristic
= 5.0 V (EWAITE = 0)
DD35
No.
C
Symbol
Min
Max
Unit
—
—
—
1
—
—
—
—
D
Frequency of internal bus
Internal cycle time
f
D.C.
25
D.C.
50
5
40.0
∞
MHz
ns
i
t
cyc
Frequency of external bus
External cycle time (selected by EXSTR)
f
20.0
∞
MHz
ns
o
t
cyce
1
2
Address valid to RE fall
t
—
—
—
—
—
—
—
—
—
—
—
ns
ADRE
3
D
Pulse width, RE
PW
35
5
ns
RE
1
4
D
Address valid to WE fall
t
ns
ADWE
5
D
Pulse width, WE
PW
23
24
28
0
ns
WE
6
D
Read data setup time (if ITHRS = 0)
Read data setup time (if ITHRS = 1)
Read data hold time
t
t
ns
DSR
D
ns
DSR
DHR
7
8
D
t
ns
D
Read enable access time
Write data valid to WE fall
Write data setup time
t
11
7
ns
ACCR
9
D
t
ns
WDWE
10
11
D
t
31
8
ns
DSW
DHW
D
Write data hold time
t
ns
1
Includes the following signals: ADDRx, UDS, LDS, and CSx.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
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Appendix A Electrical Characteristics
A.8.2
Normal Expanded Mode (External Wait Feature Enabled)
1
CSx
ADDRx
ADDR1
3
ADDR2
2
RE
WE
6
8
7
(Read) DATA1
DATAx
EWAIT
UDS, LDS
12
13
Figure A-11. Example 1b: Normal Expanded Mode — Stretched Read Access
MC9S12XDP512 Data Sheet, Rev. 2.11
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Appendix A Electrical Characteristics
1
CSx
ADDRx
RE
ADDR1
ADDR2
4
5
WE
9
11
10
DATAx
EWAIT
UDS, LDS
(Write) DATA1
12
13
Figure A-12. Example 1b: Normal Expanded Mode — Stretched Write Access
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
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Appendix A Electrical Characteristics
Table A-28. Example 1b: Normal Expanded Mode Timing V
= 5.0 V (EWAITE = 1)
DD35
2 Stretch
Cycles
3 Stretch
Cycles
No.
C
Characteristic
Symbol
Unit
Min
Max
40.0
∞
Min
Max
40.0
∞
f
—
—
—
—
1
—
—
—
—
—
D
Frequency of internal bus
D.C.
25
D.C.
75
100
5
D.C.
25
D.C.
100
125
5
MHz
ns
i
t
Internal cycle time
cyc
f
Frequency of external bus
13.3
∞
10.0
∞
MHz
ns
o
t
External cycle time (selected by EXSTR)
External cycle time (EXSTR+1EWAIT)
cyce
t
∞
∞
ns
cycew
1
t
2
—
—
ns
Address valid to RE fall
ADRE
2
PW
3
D
85
5
—
110
5
—
ns
Pulse width, RE
RE
1
t
4
D
—
—
ns
Address valid to WE fall
ADWE
2
PW
5
D
73
24
28
0
—
98
24
28
0
—
ns
Pulse width, WE
WE
t
D
Read data setup time (if ITHRS = 0)
Read data setup time (if ITHRS = 1)
Read data hold time
—
—
ns
DSR
6
t
D
—
—
ns
DSR
t
7
8
D
—
—
ns
DHR
t
D
Read enable access time
Write data valid to WE fall
Write data setup time
71
7
—
86
7
—
ns
ACCR
t
9
D
—
—
ns
WDWE
t
10
11
12
13
D
81
8
—
106
8
—
ns
DSW
t
D
Write data hold time
—
—
ns
DHW
t
D
Address to EWAIT fall
0
20
47
0
45
72
ns
ADWF
t
D
Address to EWAIT rise
37
62
ns
ADWR
1
2
Includes the following signals: ADDRx, UDS, LDS, and CSx.
Affected by EWAIT.
MC9S12XDP512 Data Sheet, Rev. 2.11
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Appendix A Electrical Characteristics
A.8.3
Emulation Single-Chip Mode (Without Wait States)
1
1
2
3
ECLK2X
ECLK
5
7
4
6
ADDR
[22:20]/
ACC
ACC2
ADDR1
ADDR1
ACC1
ADDR2
ADDR2
ADDR3
[2:0]
ADDR
[19:16]/
IQSTAT
[3:0]
IQSTAT1
ADDR3
ADDR3
IQSTAT0
ADDR
[15:0]/
IVD
ADDR1
IVD0
ADDR2
IVD1
[15:0]
8
9
DATAx
DATA0
(Read) DATA1
12
(Write) DATA2
10
11
12
R/W
LSTRB
Figure A-13. Example 2a: Emulation Single-Chip Mode — Read Followed by Write
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
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Appendix A Electrical Characteristics
Table A-29. Example 2a: Emulation Single-Chip Mode Timing V
= 5.0 V (EWAITE = 0)
DD35
1
No.
C
Characteristic
Frequency of internal bus
Symbol
Min
Max
Unit
—
1
—
—
D
D
D
D
D
D
D
D
D
D
D
f
D.C.
25
11.5
11.5
—
40.0
∞
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
i
Cycle time
t
cyc
2
Pulse width, E high
Pulse width, E low
Address delay time
Address hold time
PW
—
—
5
EH
3
PW
EL
4
t
t
AD
AH
5
0
—
4.5
—
—
—
5
2
6
IVDx delay time
t
t
—
IVDD
IVDH
2
7
IVDx hold time
0
8
Read data setup time (ITHRS = 1 only)
Read data hold time
t
12
0
DSR
DHR
DDW
DHW
RWD
9
t
10
11
12
Write data delay time
t
—
Write data hold time
t
t
0
—
5
3
Read/write data delay time
–1
1
2
3
Typical supply and silicon, room temperature only
Includes also ACCx, IQSTATx
Includes LSTRB
MC9S12XDP512 Data Sheet, Rev. 2.11
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Appendix A Electrical Characteristics
A.8.4
Emulation Expanded Mode (With Optional Access Stretching)
1
2
3
ECLK2X
ECLK
5
7
4
6
ADDR
[22:20]/
ACC
ADDR1
ACC1
ADDR1
000
ADDR2
ADDR2
[2:0]
ADDR
[19:16]/
IQSTAT
[3:0]
ADDR1
ADDR1
IQSTAT0
?
ADDR1
ADDR1
IQSTAT1
ADDR
[15:0]/
IVD
IVD1
ADDR2
[15:0]
8
9
DATAx
DATA0
12
(Read) DATA1
12
R/W
LSTRB
Figure A-14. Example 2b: Emulation Expanded Mode — Read with 1 Stretch Cycle
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
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Appendix A Electrical Characteristics
1
2
3
ECLK2X
ECLK
5
7
4
6
ADDR
[22:20]/
ADDR1
ACC1
ADDR1
000
ADDR2
ADDR2
ACC
[2:0]
ADDR
[19:16]/
ADDR1
IQSTAT
IQSTAT0
?
ADDR1
ADDR1
IQSTAT1
[3:0]
ADDR
[15:0]/
ADDR1
IVD
x
ADDR2
[15:0]
10
11
DATAx
(write) data1
12
12
R/W
LSTRB
Figure A-15. Example 2b: Emulation Expanded Mode Ò Write with 1 Stretch Cycle
MC9S12XDP512 Data Sheet, Rev. 2.11
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Appendix A Electrical Characteristics
Table A-30. Example 2b: Emulation Expanded Mode Timing V
1 Stretch
= 5.0 V (EWAITE = 0)
DD35
2 Stretch
Cycles
3 Stretch
Cycles
Cycle
1
No.
C
Characteristic
Symbol
Unit
Min
Max
Min
Max
Min
25
Max
25
—
1
—
—
D
D
D
D
D
D
D
D
D
D
D
Internal cycle time
t
25
50
11.5
35
—
0
25
∞
25
75
11.5
60
—
0
25
∞
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
cyc
Cycle time
t
100
11.5
85
—
0
∞
14
89.5
5
cyce
2
Pulse width, E high
E falling to sampling E rising
Address delay time
Address hold time
PW
14
39.5
5
14
64.5
5
EH
3
t
EFSR
4
t
t
AD
AH
5
—
4.5
—
—
—
5
—
4.5
—
—
—
5
—
4.5
—
—
—
5
2
6
IVD delay time
t
—
0
—
0
—
0
IVDD
IVDH
2
7
IVD hold time
t
8
Read data setup time
Read data hold time
Write data delay time
Write data hold time
t
12
0
12
0
12
0
DSR
DHR
DDW
DHW
RWD
9
t
10
11
12
t
—
0
—
0
—
0
t
t
—
5
—
5
—
5
3
Read/write data delay time
–1
–1
–1
1
2
3
Typical supply and silicon, room temperature only
Includes also ACCx, IQSTATx
Includes LSTRB
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
963
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Appendix A Electrical Characteristics
A.8.5
External Tag Trigger Timing
1
ECLK
ADDR
ADDR
DATAx
DATA
R/W
2
TAGHI/TAGLO
3
Figure A-16. External Trigger Timing
Table A-31. External Tag Trigger Timing V
= 5.0 V
DD35
1
No.
C
Characteristic
Frequency of internal bus
Symbol
Min
Max
Unit
1
2
3
4
D
D
D
D
f
D.C.
25
40.0
∞
MHz
ns
i
Cycle time
t
t
cyc
TAGHI/TAGLO setup time
TAGHI/TAGLO hold time
t
11.5
0
—
ns
TS
—
ns
TH
1
Typical supply and silicon, room temperature only
MC9S12XDP512 Data Sheet, Rev. 2.11
964
Freescale Semiconductor
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Appendix B Package Information
B.2
144-Pin LQFP
0.20 T L-M N
0.20 T L-M N
4X
4X 36 TIPS
PIN 1
IDENT
144
109
1
108
4X
P
J1
J1
L
M
C
L
V
B
X
140X
G
B1
V1
VIEW Y
VIEW Y
NOTES:
36
73
1. DIMENSIONS AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS IN MILLIMETERS.
37
72
3. DATUMS L, M, N TO BE DETERMINED AT THE
SEATING PLANE, DATUM T.
N
4. DIMENSIONS S AND V TO BE DETERMINED
AT SEATING PLANE, DATUM T.
5. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE
A1
S1
A
S
PROTRUSION IS 0.25 PER SIDE. DIMENSIONS
A AND B DO INCLUDE MOLD MISMATCH
AND ARE DETERMINED AT DATUM PLANE H.
6. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL NOT CAUSE THE D
DIMENSION TO EXCEED 0.35.
VIEW AB
C
144X
MILLIMETERS
DIM MIN MAX
0.1 T
θ2
θ2
A
A1
B
B1
C
C1
C2
D
20.00 BSC
10.00 BSC
20.00 BSC
10.00 BSC
SEATING
PLANE
1.40
0.05
1.35
0.17
0.45
0.17
1.60
T
0.15
1.45
0.27
0.75
0.23
E
F
PLATING
G
J
0.50 BSC
J
C2
AA
F
0.09
0.20
0.05
K
P
0.50 REF
0.25 BSC
R2
R1
R2
S
S1
V
V1
Y
Z
0.13
0.13
0.20
0.20
θ
R1
22.00 BSC
11.00 BSC
22.00 BSC
11.00 BSC
0.25 REF
1.00 REF
BASE
METAL
0.25
D
GAGE PLANE
M
0.08
T L-M N
AA
θ
θ1
θ2
0.09
0
0.16
°
SECTION J1-J1
(ROTATED 90
144 PL
(K)
E
0
7
°
°
°
°
)
°
11
13
C1
θ 1
(Y)
VIEW AB
(Z)
Figure B-1. 144-Pin LQFP Mechanical Dimensions (Case No. 918-03)
MC9S12XDP512 Data Sheet, Rev. 2.11
966
Freescale Semiconductor
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Appendix B Package Information
B.3
112-Pin LQFP Package
4X
0.20
T
L-M
N
4X 28 TIPS
0.20
T
L-M
N
4X
P
J1
J1
PIN 1
IDENT
112
85
C
1
84
L
VIEW Y
X
108X
G
X=L, M OR N
VIEW Y
V
B
L
M
AA
J
B1
V1
28
57
BASE
METAL
F
D
29
56
M
0.13
T
L-M
N
N
SECTION J1-J1
A1
S1
ROTATED 90 COUNTERCLOCKWISE
°
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
A
2. DIMENSIONS IN MILLIMETERS.
3. DATUMS L, M AND N TO BE DETERMINED AT
SEATING PLANE, DATUM T.
S
4. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE, DATUM T.
5. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.25 PER SIDE. DIMENSIONS
A AND B INCLUDE MOLD MISMATCH.
6. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL NOT CAUSE THE D
DIMENSION TO EXCEED 0.46.
C2
VIEW AB
0.10
θ2
C
0.050
112X
T
SEATING
PLANE
MILLIMETERS
DIM MIN
MAX
20.000 BSC
10.000 BSC
θ3
A
A1
B
B1
C
T
20.000 BSC
10.000 BSC
---
1.600
C1 0.050
C2 1.350
0.150
1.450
0.370
0.750
0.330
θ
D
E
F
0.270
0.450
0.270
G
J
K
0.650 BSC
0.090
0.170
R R2
0.500 REF
0.325 BSC
P
R1 0.100
R2 0.100
0.200
0.200
0.25
R R1
S
S1
V
V1
Y
22.000 BSC
11.000 BSC
GAGE PLANE
22.000 BSC
11.000 BSC
0.250 REF
1.000 REF
Z
(K)
C1
θ1
AA 0.090
0.160
8 °
E
0 °
θ
θ1
θ2
θ3
3 °
11 °
11 °
7 °
(Y)
(Z)
13 °
13 °
VIEW AB
Figure B-2. 112-Pin LQFP Mechanical Dimensions (Case No. 987)
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
967
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Appendix B Package Information
B.4
80-Pin QFP Package
L
60
41
61
40
B
B
P
-A-
-B-
L
V
B
-A-,-B-,-D-
DETAIL A
DETAIL A
21
80
F
1
20
-D-
A
M
S
S
S
0.20
H
A-B
D
D
0.05 A-B
J
N
S
M
S
0.20
C
A-B
D
M
E
DETAIL C
M
S
S
0.20
C
A-B
D
SECTION B-B
VIEW ROTATED 90
C
DATUM
PLANE
-H-
°
-C-
SEATING
PLANE
0.10
H
M
G
NOTES:
MILLIMETERS
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
DIM MIN
MAX
14.10
14.10
2.45
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE -H- IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE
LEAD WHERE THE LEAD EXITS THE PLASTIC
BODY AT THE BOTTOM OF THE PARTING LINE.
4. DATUMS -A-, -B- AND -D- TO BE
DETERMINED AT DATUM PLANE -H-.
5. DIMENSIONS S AND V TO BE DETERMINED
AT SEATING PLANE -C-.
A
B
C
D
E
F
G
H
J
13.90
13.90
2.15
0.22
2.00
0.22
U
0.38
2.40
T
0.33
0.65 BSC
DATUM
PLANE
6. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE
---
0.13
0.65
0.25
0.23
0.95
-H-
R
PROTRUSION IS 0.25 PER SIDE. DIMENSIONS
A AND B DO INCLUDE MOLD MISMATCH
AND ARE DETERMINED AT DATUM PLANE -H-.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION. DAMBAR CANNOT
BE LOCATED ON THE LOWER RADIUS OR
THE FOOT.
K
L
12.35 REF
M
N
P
Q
R
S
T
5
°
0.13
10
°
0.17
0.325 BSC
0
K
7
Q
°
°
W
0.13
16.95
0.13
0.30
17.45
---
X
DETAIL C
U
V
W
X
0
---
°
16.95
0.35
17.45
0.45
1.6 REF
Figure B-3. 80-Pin QFP Mechanical Dimensions (Case No. 841B)
MC9S12XDP512 Data Sheet, Rev. 2.11
968
Freescale Semiconductor
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Appendix C Recommended PCB Layout
Appendix C
Recommended PCB Layout
The PCB must be carefully laid out to ensure proper operation of the voltage regulator as well as of the
MCU itself. The following rules must be observed:
•
Every supply pair must be decoupled by a ceramic capacitor connected as near as possible to the
corresponding pins (C1–C6).
•
•
•
•
Central point of the ground star should be the V
pin.
SSR
Use low ohmic low inductance connections between V , V , and V .
SSR
SS1
SS2
V
must be directly connected to V
.
SSR
SSPLL
Keep traces of V
, EXTAL, and XTAL as short as possible and occupied board area for C7,
SSPLL
C8, and Q1 as small as possible.
•
•
Do not place other signals or supplies underneath area occupied by C7, C8, and Q1 and the
connection area to the MCU.
Central power input should be fed in at the V
/V
pins.
DDA SSA
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
969
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Appendix C Recommended PCB Layout
Table C-1. Recommended Decoupling Capacitor Choice
Component
Purpose
Type
Value
C1
C2
V
V
filter capacitor
filter capacitor
Ceramic
220 nF
220 nF
DD1
Ceramic X7R
DD2
(not available on the 80-pin QFP
packaging option)
C3
C4
V
filter capacitor
filter capacitor
Ceramic X7R
X7R/tantalum
Ceramic X7R
X7R/tantalum
>=100 nF
>=100 nF
220 nF
DDA
DDR
V
C5
V
filter capacitor
DDPLL
C6
V
filter capacitor
>=100 nF
DDX
C7
OSC load capacitor
OSC load capacitor
Comes from crystal manufacturer
C8
C9
PLL loop filter capacitor
PLL loop filter capacitor
See PLL specification chapter
C10
C11
C12
R1
V
V
filter capacitor
filter capacitor
X7R/tantalum
X7R/tantalum
>=100 nF
>=100 nF
DDX
DDX
PLL loop filter resistor
Quartz
See PLL specification chapter
Q1
—
—
MC9S12XDP512 Data Sheet, Rev. 2.11
970
Freescale Semiconductor
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Appendix C Recommended PCB Layout
Figure C-1. 144-Pin LQFP Recommended PCB Layout
C3
V
SSA
V
REGEN
V
DDA
V
DD1
C1
V
SS2
V
SS1
C2
V
DD2
V
DDX2
V
DDR2
C11
C12
V
SSX2
V
SSR2
V
V
SSR1
1
DDR
Q1
V
SSPLL
V
DDPLL
R1
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
971
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Appendix C Recommended PCB Layout
Figure C-2. 112-Pin LQFP Recommended PCB Layout
V
C3
V
SSA
REGEN
V
SSX
V
DDA
V
DD1
C1
V
SS1
V
SS2
C2
V
DD2
V
SSR
V
SSPLL
V
DDR
Q1
V
DDPLL
R1
MC9S12XDP512 Data Sheet, Rev. 2.11
972
Freescale Semiconductor
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Appendix C Recommended PCB Layout
Figure C-3. 80-Pin QFP Recommended PCB Layout
C3
V
V
SSA
SSX
V
DDA
V
DD1
V
V
SS2
C1
V
C2
SS1
DD2
V
V
SSR
V
Q1
DDR
SSPLL
V
DDPLL
R1
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
973
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Appendix D Derivative Differences
Appendix D
Derivative Differences
D.1
Memory Sizes and Package Options S12XD - Family
Device
Package
144 LQFP
112 LQFP
144 LQFP
112 LQFP
80 QFP
Flash
RAM
EEPROM
ROM
32K
9S12XDP512
512K
9S12XDT512
9S12XDT384
20K
20K
144 LQFP
112 LQFP
80 QFP
384K
4K
144 LQFP
112 LQFP
80 QFP
1
9S12XDQ256
16K
144 LQFP
112 LQFP
80 QFP
1
9S12XDT256
256K
144 LQFP
112 LQFP
80 QFP
1
9S12XD256
14K
16K
144 LQFP
112 LQFP
80 QFP
1
3S12XDG256
256K
128K
112 LQFP
80 QFP
1
9S12XDG128
128K
2K
12K
112 LQFP
80 QFP
1
3S12XDG128
MC9S12XDP512 Data Sheet, Rev. 2.11
974
Freescale Semiconductor
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Appendix D Derivative Differences
Device
Package
112 LQFP
80 QFP
Flash
128K
64K
RAM
8K
EEPROM
ROM
1
1
2K
9S12XD128
9S12XD64
80 QFP
4K
1K
1
Part includes module versions S12XDBGV3 and S12XMMCV3 which arenot covered in this
data sheet. Please refer to the corresponding data sheets for detailed information.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
975
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Appendix D Derivative Differences
D.2
Memory Sizes and Package Options S12XA - Family
Device
Package
144 LQFP
112 LQFP
80 QFP
Flash
RAM
EEPROM
512K
9S12XA512
32K
4K
144 LQFP
112 LQFP
80 QFP
1
256K
128K
9S12XA256
16K
12K
112 LQFP
80 QFP
1
2K
9S12XA128
1
Part includes module versions S12XDBGV3 and S12XMMCV3 which are
not covered in this data sheet. Please refer to the corresponding data sheets
for detailed information.
MC9S12XDP512 Data Sheet, Rev. 2.11
976
Freescale Semiconductor
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Appendix D Derivative Differences
1 2 3 4 5
D.3
MC9S12XD-Family Flash Configuration
DG128/
D128
D64
DP512/
DT512
DT384
DT256/
DG256
Global Address
$78_0000 (PPAGE $E0)
128k
128k
128k
128k
128k
128k
$7A_0000 (PPAGE $E8)
$7C_0000 (PPAGE $F0)
$7E_0000 (PPAGE $F8)
128k
128k
128k
128k
64k
Shared XGATE/CPU area
Not implemented
1. XGATE read access to Flash not possible on DG128/D128 and D64
2. Program Pages available on DT384 are $E0 - $E7 and $F0 - $FF
3. Program Pages available on DT256/DG256 are $E0 - $E7 and $F8 - $FF
4. Shared XGATE/CPU area on DP512/DT512/DT384 at global address $78_0800 to $78_FFFF (30Kbyte)
5. Shared XGATE/CPU area on DT256/DG256 at global address $78_0800 to $79_3FFF (46Kbyte)
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
977
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Appendix D Derivative Differences
D.4
Peripheral Sets S12XD - Family
Device
Package
144LQFP
112LQFP
144LQFP
112LQFP
80QFP
XGATE CAN SCI SPI
IIC
2
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
ECT PIT
A/D
2/24
2/16
2/24
2/16
1/8
I/O
119
91
5
5
3
3
3
3
3
3
4
4
4
3
3
3
1
1
1
2
2
2
2
2
2
2
1
1
1
6
4
6
4
2
4
4
2
4
4
2
4
4
2
4
4
2
4
4
2
2
2
2
2
2
2
2
3
3
3
3
2
3
3
2
3
3
2
3
3
2
2
2
2
2
2
2
2
2
2
2
2
2
2
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
2
9S12XDP512
119
91
9S12XDT512
9S12XDT384
9S12XDQ256
9S12XDT256
9S12XD256
59
144LQFP
112LQFP
80QFP
2/24
2/16
1/8
119
91
59
144LQFP
112LQFP
80QFP
2/24
2/16
1/8
119
91
yes
59
144LQFP
112LQFP
80QFP
2/24
2/16
1/8
119
91
59
144LQFP
112LQFP
80QFP
2/24
2/16
1/8
119
91
59
144LQFP
112LQFP
80QFP
2/24
2/16
1/8
119
91
3S12XDG256
59
2
112LQFP
80QFP
1/16
1/8
91
9S12XDG128
3S12XDG128
9S12XD128
59
(2)
112LQFP
80QFP
1/16
1/8
91
1
59
yes
(2)
112LQFP
80QFP
1/16
1/8
91
59
9S12XD64
80QFP
1/8
59
1
Can execute code only from RAM
MC9S12XDP512 Data Sheet, Rev. 2.11
978
Freescale Semiconductor
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Appendix D Derivative Differences
2
ATD1 routed to PAD00-15 instead of PAD08-23.
D.5
Peripheral Sets S12XA - Family
Device
Package
144LQFP
112LQFP
80QFP
XGATE CAN SCI SPI
IIC
1
ECT PIT
A/D
2/24
2/16
1/8
I/O
119
91
6
4
2
4
4
2
2
2
3
3
2
3
3
2
2
2
8
8
8
8
8
8
8
8
4
4
4
4
4
4
2
2
9S12XA512
1
1
59
yes
144LQFP
112LQFP
80QFP
1
2/24
2/16
1/8
119
91
no
9S12XA256
9S12XA128
1
1
59
2
112LQFP
80QFP
1
1/16
1/8
91
1
yes
1
59
1
2
Can execute code only from RAM
ATD1 routed to PAD00-15 instead of PAD08-23
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
979
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Appendix D Derivative Differences
D.6
Pinout explanations:
•
A/D is the number of modules/total number of A/D channels.
•
I/O is the sum of ports capable to act as digital input or output.
–
144 Pin Packages:
Port A = 8, B = 8, C=8, D=8, E = 6 + 2 input only,
H = 8, J = 7, K = 8, M = 8, P = 8, S = 8, T = 8, PAD = 24
25 inputs provide Interrupt capability (H =8, P= 8, J = 7, IRQ, XIRQ)
–
–
112 Pin Packages:
Port A = 8, B = 8, E = 6 + 2 input only, H = 8, J = 4, K = 7, M = 8, P = 8, S = 8, T = 8, PAD = 16
22 inputs provide Interrupt capability (H =8, P= 8, J = 4, IRQ, XIRQ)
80 Pin Packages:
Port A = 8, B = 8, E = 6 + 2 input only, J = 2, M = 6, P = 7, S = 4, T = 8, PAD = 8
11 inputs provide Interrupt capability (P= 7, J = 2, IRQ, XIRQ)
•
•
•
•
•
•
•
•
•
•
•
•
•
CAN0 can be routed under software control from PM[1:0] to pins PM[3:2] or PM[5:4] or PJ[7:6].
CAN4 pins are shared between IIC0 pins.
CAN4 can be routed under software control from PJ[7:6] to pins PM[5:4] or PM[7:6].
Versions with 4 CAN modules will have CAN0, CAN1, CAN2 and CAN4
Versions with 3 CAN modules will have CAN0, CAN1 and CAN4.
Versions with 2 CAN modules will have CAN0 and CAN4.
Versions with 1 CAN modules will have CAN0
Versions with 2 SPI modules will have SPI0 and SPI1.
Versions with 4 SCI modules will have SCI0, SCI1, SCI2 and SCI4.
Versions with 2 SCI modules will have SCI0 and SCI1.
Versions with 1 IIC module will have IIC0.
SPI0 can be routed to either Ports PS[7:4] or PM[5:2].
SPI1 pins are shared with PWM[3:0]; In 144 and 112-pin versions, SPI1 can be routed under
software control to PH[3:0].
•
SPI2 pins are shared with PWM[7:4]; In 144 and 112-pin versions, SPI2 can be routed under
software control to PH[7:4]. In 80-pin packages, SS-signal of SPI2 is not bonded out!
MC9S12XDP512 Data Sheet, Rev. 2.11
980
Freescale Semiconductor
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Appendix E Ordering Information
Appendix E
Ordering Information
The following figure provides an ordering number example for the MC9S12XD-Family devices
MC9S12X DP512 C FU
Temperature Options
C = -40˚C to 85˚C
V = -40˚C to 105˚C
M = -40˚C to 125˚C
Package Option
Temperature Option
Device Title
Package Options
FU = 80 QFP
PV = 112 LQFP
FV = 144 LQFP
Controller Family
Figure E-1. Order Part Number Example
Customers who place orders using the generic MC partnumbers which are constructed using the above
rules will automatically receive our preferred maskset (ie preferred revision of silicon). If the product is
updated in the future and a newer maskset is put into production, then the newer maskset may
automatically ship against these generic MC partnumbers.
If required, a customer can specify a particular maskset when ordering product. To do this, the customer
must order the corresponding "SC" partnumber from the below table. Orders placed against these SC
partnumbers will only ever receive one specific maskset. If a new maskset is made available, customers
will be notified by PCN (Process Change Notification) but will have to order against a different SC part
number in order to receive the new maskset. The marking on the device will be as per the left hand column
in the below table independently of whether the MC or the SC partnumber is ordered.
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
981
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Appendix E Ordering Information
MC9S12XDP512 Data Sheet, Rev. 2.11
982
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Appendix E Ordering Information
Table E-1. MC and SC Part Numbers
MC PART NUMBER
SC PART NUMBER
PKG
(MASKSET-INDEPENDENT)
FOR OUR RECOMMENDED
MASKSET
(MASKSET-SPECIFIC)
FOR 0L15Y MASKSET ONLY
MC9S12XDP512CPV
MC9S12XDP512MPV
MC9S12XDP512VPV
MC9S12XDQ512CPV
MC9S12XDQ512MPV
MC9S12XDQ512VPV
MC9S12XDT512CPV
MC9S12XDT512MPV
MC9S12XDT512VPV
MC9S12XDT384CPV
MC9S12XDT384MPV
MC9S12XDT384VPV
MC9S12XA512CPV
MC9S12XA512VPV
SC104002CPV
SC104002MPV
SC104002VPV
SC104003CPV
SC104003MPV
SC104003VPV
SC104004CPV
SC104004MPV
SC104004VPV
SC104005CPV
SC104005MPV
SC104005VPV
SC104011CPV
SC104011VPV
112
112
112
112
112
112
112
112
112
112
112
112
112
112
MC9S12XDT512CFU
MC9S12XDT512MFU
MC9S12XDT512VFU
MC9S12XDT384CFU
MC9S12XDT384MFU
MC9S12XDT384VFU
MC9S12XA512CFU
MC9S12XA512VFU
SC104013CFU
SC104013MFU
SC104013VFU
SC104014CFU
SC104014MFU
SC104014VFU
SC104020CFU
SC104020VFU
80
80
80
80
80
80
80
80
MC9S12XDP512CFV
MC9S12XDP512MFV
MC9S12XDP512VFV
MC9S12XDT512CFV
MC9S12XDT512MFV
SC104023CFV
SC104023MFV
SC104023VFV
SC104024CFV
SC104024MFV
144
144
144
144
144
MC9S12XDP512 Data Sheet, Rev. 2.11
Freescale Semiconductor
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Appendix E Ordering Information
Table E-1. MC and SC Part Numbers
MC PART NUMBER
SC PART NUMBER
PKG
(MASKSET-INDEPENDENT)
FOR OUR RECOMMENDED
MASKSET
(MASKSET-SPECIFIC)
FOR 0L15Y MASKSET ONLY
MC9S12XDT512VFV
MC9S12XDT384CFV
MC9S12XDT384MFV
MC9S12XDT384VFV
MC9S12XD384CFV
MC9S12XD384MFV
MC9S12XD384VFV
SC104024VFV
SC104025CFV
SC104025MFV
SC104025VFV
SC104026CFV
SC104026MFV
SC104026VFV
144
144
144
144
144
144
144
MC9S12XDP512 Data Sheet, Rev. 2.11
984
Freescale Semiconductor
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