Intel Computer Hardware E8500 User Manual

4. Shown before motherboard attach; FCBGA has a convex (dome shaped) orientation before reflow and is expected to have a slightly concave (bowl shaped)

orientation after reflow

Intel 8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

Packaging Technology

Figure 2-3. NB Package Dimensions (Bottom View)

42.5 + 0.05

20.202

37X 1.092

20.202

42.5 + 0.05

0.2

NOTES:

1. All dimensions are in millimeters.

2. All dimensions and tolerances conform to ANSI Y14.5M-1994.

Intel 8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

Packaging Technology

Figure 2-4. XMB Package Dimensions (Top View)

Die

Keepout

Area

Handling

Exclusion

Area

14.02mm.

8.88mm.

XMB

Die

11.73mm. 6.65mm.

23.50mm. 27.50mm. 37.50mm.

23.50mm.

27.50mm.

37.50mm.

Figure 2-5. XMB Package Dimensions (Side View)

Substrate

Decoup

2.535 ± 0.123 mm

Die

Cap

2.100 ± 0.121 mm

0.84 ± 0.05 mm

0.7 mm Max

0.20

See Note 4

0.20 –C–

Seating Plane

0.435 ± 0.025 mm

See Note 3

See Note 1

Notes:

1. Primary datum -C- and seating plan are defined by the spherical crowns of the solder balls (shown before motherboard attach)

2. All dimensions and tolerances conform to ANSI Y14.5M-1994

3. BGA has a pre-SMT height of 0.5mm and post-SMT height of 0.41-0.46mm

4. Shown before motherboard attach; FCBGA has a convex (dome shaped) orientation before reflow and is expected to have a slightly concave

(bowl shaped) orientation after reflow

Intel 8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

Packaging Technology

Figure 2-6. XMB Package Dimensions (Bottom View)

42.5 + 0.0

20.202

37X 1.092

20.202

42.5 + 0.05

0.2

2.1

Package Mechanical Requirements

The E8500 chipset NB package has an IHS and the XMB package has an exposed bare die which is

capable of sustaining a maximum static normal load of 15-lbf. The package is NOT capable of

sustaining a dynamic or static compressive load applied to any edge of the bare die. These

mechanical load limits must not be exceeded during heatsink installation, mechanical stress testing,

standard shipping conditions and/or any other use condition.

Notes:

1. The heatsink attach solutions must not include continuous stress onto the chipset package with

the exception of a uniform load to maintain the heatsink-to-package thermal interface.

2. These specifications apply to uniform compressive loading in a direction perpendicular to the

bare die/IHS top surface.

3. These specifications are based on limited testing for design characterization. Loading limits

are for the package only

Intel 8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

3 Thermal Specifications

3.1

Thermal Design Power (TDP)

Analysis indicates that real applications are unlikely to cause the E8500 chipset NB/XMB

components to consume maximum power dissipation for sustained time periods. Therefore, in

order to arrive at a more realistic power level for thermal design purposes, Intel characterizes

power consumption based on known platform benchmark applications. The resulting power

consumption is referred to as the Thermal Design Power (TDP). TDP is the target power level that

the thermal solutions should be designed to. TDP is not the maximum power that the chipset can

dissipate.

For TDP specifications, see Table 3-1 for the E8500 chipset NB component and Table 3-2 for the

E8500 chipset XMB component FC-BGA packages have poor heat transfer capability into the

board and have minimal thermal capability without a thermal solution. Intel recommends that

system designers plan for one or more heatsinks when using the E8500 chipsets NB/XMB

components.

3.2

Die Case Temperature Specifications

To ensure proper operation and reliability of the E8500 chipset NB/XMB components, the die

temperatures must be at or between the maximum/minimum operating temperature ranges as

specified in Table 3-1 and Table 3-2. System and/or component level thermal solutions are required

to maintain these temperature specifications. Refer to Section 5 for guidelines on accurately

measuring package die temperatures.

Table 3-1. Intel E8500 Chipset NB Thermal Specifications

Parameter

Value

Notes

T_{case_max}

104°C

5°C

T_{case_min}

TDP_{with 1 XMB attached}

TDP_{with 2 XMBs attached}

TDP_{with 3 XMBs attached}

TDP_{with 4 XMBs attached}

17.9W

19.8W

22.4W

24.5W

NOTE:

1. These specifications are based on silicon characterization, however, they may be updated as further data

becomes available.

Intel E8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

Thermal Specifications

Table 3-2. Intel E8500 Chipset XMB Thermal Specifications

Parameter

Value

Notes

T_{case_max}

T_{case_min}

105°C

5°C

TDP_{dual channel}

9.1W

9.3W

8.5W

DDR-266

DDR-333

DDR2-400

NOTE:

1. These specifications are based on silicon characterization, however, they may be updated as further data

becomes available.

Intel E8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

4 Thermal Simulation

Intel provides thermal simulation models of the E8500 chipset NB/XMB components and

associated user's guides to aid system designers in simulating, analyzing, and optimizing their

thermal solutions in an integrated, system-level environment. The models are for use with the

commercially available Computational Fluid Dynamics (CFD)-based thermal analysis tool

FLOTHERM* (version 3.1 or higher) by Flomerics, Inc. These models are also available in

ICEPAK* format. Contact your Intel field sales representative to order the thermal models and

user's guides.

Intel E8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

Thermal Simulation

Intel E8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

5 Thermal Metrology

The system designer must make temperature measurements to accurately determine the thermal

performance of the system. Intel has established guidelines for proper techniques to measure the

NB/XMB die temperatures. Section 5.1 provides guidelines on how to accurately measure the

NB/XMB die temperatures. Section 5.2 contains information on running an application program

that will emulate anticipated maximum thermal design power. The flowchart in Figure 5-1 offers

useful guidelines for thermal performance and evaluation.

5.1

Die Case Temperature Measurements

To ensure functionality and reliability, the T

of the NB/XMB must be maintained at or between

case

the maximum/minimum operating range of the temperature specification as noted in Table 3-1 and

Table 3-2. The surface temperature at the geometric center of the die corresponds to T

case

Measuring T

requires special care to ensure an accurate temperature measurement.

case

Temperature differences between the temperature of a surface and the surrounding local ambient

air can introduce errors in the measurements. The measurement errors could be due to a poor

thermal contact between the thermocouple junction and the surface of the package, heat loss by

radiation and/or convection, conduction through thermocouple leads, and/or contact between the

thermocouple cement and the heatsink base (if a heatsink is used). For maximize measurement

accuracy, only the 0° thermocouple attach approach is recommended.

Zero Degree Angle Attach Methodology

1. Mill a 3.3 mm (0.13 in.) diameter and 1.5 mm (0.06 in.) deep hole centered on the bottom of

the heatsink base.

2. Mill a 1.3 mm (0.05 in.) wide and 0.5 mm (0.02 in.) deep slot from the centered hole to one

edge of the heatsink. The slot should be parallel to the heatsink fins (see Figure 5-2).

3. Attach thermal interface material (TIM) to the bottom of the heatsink base.

4. Cut out portions of the TIM to make room for the thermocouple wire and bead. The cutouts

should match the slot and hole milled into the heatsink base.

5. Attach a 36 gauge or smaller calibrated K-type thermocouple bead or junction to the center of

the top surface of the die using a high thermal conductivity cement. During this step, ensure no

contact is present between the thermocouple cement and the heatsink base because any contact

will affect the thermocouple reading. It is critical that the thermocouple bead makes

contact with the die (see Figure 5-3).

6. Attach heatsink assembly to the NB/XMB and route thermocouple wires out through the

milled slot.

Intel E8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

Thermal Metrology

Figure 5-1. Thermal Solution Decision Flowchart

001240

Figure 5-2. Zero Degree Angle Attach Heatsink Modifications

NOTE: Not to scale.

Figure 5-3. Zero Degree Angle Attach Methodology (Top View)

Die

Thermocouple

Wire

Cement +

Thermocouple Bead

Substrate

001321

NOTE: Not to scale.

Intel E8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

Thermal Metrology

5.2

Power Simulation Software

The power simulation software is a utility designed to dissipate the thermal design power on an

E8500 chipset NB component or XMB component when used in conjunction with the 64-bit Intel

Xeon™ processor MP. The combination of the above mentioned processor and the higher

bandwidth capability of the E8500 chipsets enable higher levels of system performance. To assess

the thermal performance of the chipset thermal solution under “worst-case realistic application”

conditions, Intel is developing a software utility that operates the chipset at near worst-case thermal

power dissipation.

The power simulation software being developed should only be used to test thermal solutions at or

near the thermal design power. Figure 5-1 shows a decision flowchart for determining thermal

solution needs. Real world applications may exceed the thermal design power limit for transient

time periods. For power supply current requirements under these transient conditions, please refer

to each component's datasheet for the ICC (Max Power Supply Current) specification. Contact

your Intel field sales representative to order the power utility software and user's guide.

Intel E8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

Thermal Metrology

Intel E8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

6 NB Reference Thermal Solution #1

Intel has developed two different reference thermal solutions designed to meet the cooling needs of

the E8500 chipset NB component under operating environments and specifications defined in this

document. This chapter describes the overall requirements for the 1 NB reference thermal

solution including critical-to-function dimensions, operating environment, and validation criteria.

Other chipset components may or may not need attached thermal solutions, depending on your

specific system local-ambient operating conditions. For information on the Intel 6700PXH 64-bit

PCI Hub, refer to thermal specification in the Intel 6700PXH 64-bit PCI Hub

Thermal/Mechanical Design Guide. For information on the ICH5, refer to thermal specification in

the Intel 82801EB I/O Controller Hub 5 (ICH5) and Intel 82801ER I/O Controller Hub 5 R

(ICH5R) Thermal Design Guide.

6.1

Operating Environment

The reference thermal solution was designed assuming a maximum local-ambient temperature of

52°C. The minimum recommended airflow velocity through the cross section of the heatsink fins is

400 linear feet per minute (lfm). The approaching airflow temperature is assumed to be equal to the

local-ambient temperature. The thermal designer must carefully select the location to measure

airflow to obtain an accurate estimate. These local-ambient conditions are based on a 35°C

external-ambient temperature at sea level. (External-ambient refers to the environment external to

the system.)

The fasteners associated for this reference thermal solution is intended to be used on 0.062”

thickness motherboard

6.2

Heatsink Performance

Figure 6-1 depicts the measured thermal performance of the 1 NB reference thermal solution

versus approach air velocity. Since this data was measured at sea level, a correction factor would be

required to estimate thermal performance at other altitudes.

Intel E8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

NB Reference Thermal Solution #1

Figure 6-1. First NB Reference Heatsink Measured Thermal Performance vs.

Approach Velocity

1.50

1.40

1.30

1.20

1.10

1.00

0.90

0.80

100

200

300

400

500

600

700

Flow Rate (LFM)

6.3

Mechanical Design Envelope

While each design may have unique mechanical volume and height restrictions or implementation

requirements, the height, width, and depth constraints typically placed on the E8500 chipset NB

thermal solution are shown in Figure 6-2.

When using heatsinks that extend beyond the NB reference heatsink envelope shown in

Figure 6-2, any motherboard components placed between the heatsink and motherboard cannot

exceed 4.14 mm (0.16 in.) in height.

Intel E8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

NB Reference Thermal Solution #1

Figure 6-2. First NB Reference Heatsink Volumetric Envelope

H e a ts in k

F in

H e a ts in k B a s e

IH S

T IM 2

F C B G A

S o ld e r B a lls

M o th e rb o a rd

6 4 .5 2 m m .

4 2 .5 0 m m .

T N B

H e a ts in k

F in

H e a ts in k B a s e

6.4

Board-Level Components Keepout Dimensions

The location of hole pattern and keepout zones for the reference thermal solution are shown in

Figure 6-3.

Intel E8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

NB Reference Thermal Solution #1

6.5

First NB Heatsink Thermal Solution Assembly

The reference thermal solution for the chipset NB component is a passive extruded heatsink with

thermal interface. It is attached to the board by using four retaining Tuflok* fasteners. Figure 6-4

shows the reference thermal solution assembly and associated components.

Full mechanical drawings of the thermal solution assembly and the heatsink are provided in

Appendix B. Appendix A contains vendor information for each thermal solution component.

Figure 6-3. First NB Heatsink Board Component Keepout

64.500mm.

55.245mm.

42.500mm.

42.500mm. 55.245mm. 64.500mm.

TNB Location

NB Location

4X Ø 5.5mm

4X Ø 2.95 ± 0.0254mm

No Component Keep Out Area

4.14mm Max Component Height

Heatsink Mounting Hole

NOTE: All dimensions are in millimeters.

Intel E8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

NB Reference Thermal Solution #1

6.5.1

Heatsink Orientation

Since this solution is based on a unidirectional heatsink, mean airflow direction must be aligned

with the direction of the heatsink fins.

Figure 6-4. First NB Heatsink Assembly

6.5.2

Extruded Heatsink Profiles

The reference NB thermal solution uses an extruded heatsink for cooling the chipset NB.

Figure 6-5 shows the heatsink profile. Appendix A lists a supplier for this extruded heatsink. Other

heatsinks with similar dimensions and increased thermal performance may be available. Full

mechanical drawing of this heatsink is provided in Appendix B.

6.5.3

6.5.4

Mechanical Interface Material

There is no mechanical interface material associated with this reference solution.

Thermal Interface Material

A TIM provides improved conductivity between the die and heatsink. The reference thermal

solution uses Chomerics THERMFLOW* T710, 0.127 mm (0.005 in.) thick, 38.5 mm x 38.5 mm

(1.5 in. x 1.5 in.) square.

Note: Unflowed or “dry” Chomerics THERMFLOW T710 has a material thickness of 0.005 inch.

The flowed or “wet” Chomerics THERMFLOW T710 has a material thickness of ~0.0025 inch

after it reaches its phase change temperature.

6.5.4.1

Effect of Pressure on TIM Performance

As mechanical pressure increases on the TIM, the thermal resistance of the TIM decreases. This

phenomenon is due to the decrease of the bond line thickness (BLT). BLT is the final settled

thickness of the thermal interface material after installation of heatsink. The effect of pressure on

Intel E8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

NB Reference Thermal Solution #1

the thermal resistance of the Chomerics THERMFLOW T710 TIM is shown in Table 6-1 The

heatsink clip provides enough pressure for the TIM to achieve a thermal conductivity of 0.17°C

inch /W.

Table 6-1. Chomerics THERMFLOW* T710 TIM Performance as a Function of Attach Pressure

Pressure (psi)

Thermal Resistance (°C × in²)/W

0.37

0.30

0.21

0.17

NOTE:

1. All measured at 50°C.

6.5.5

Heatsink Retaining Fastener

The reference solution uses four heatsink retaining Tufloks. The fasteners attach the heatsink to the

motherboard by expanding its Tuflok prong to snap into each of the four heatsink mounting holes.

These fasteners are intended to be used on a 0.062” thickness motherboard with either of the two

NB reference thermal solutions. See Appendix B for a mechanical drawing of the fastener.

Figure 6-5. First NB Heatsink Extrusion Profile

Intel E8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

NB Reference Thermal Solution #1

6.6

Reliability Guidelines

Each motherboard, heatsink and attach combination may vary the mechanical loading of the

component. Based on the end user environment, the user should define the appropriate reliability

test criteria and carefully evaluate the completed assembly prior to use in high volume. Some

general recommendations are shown in Table 6-2.

Table 6-2. Reliability Guidelines

Test ⁽¹⁾

Requirement

Pass/Fail Criteria ⁽²⁾

Mechanical

Shock

50 g, board level, 11 msec, 3 shocks/axis

Visual Check and Electrical Functional

Test

Random

Vibration

7.3 g, board level, 45 min/axis, 50 Hz to

2000 Hz

Visual Check and Electrical Functional

Test

Temperature Life 85°C, 2000 hours total, checkpoints at 168,

500, 1000, and 2000 hours

Visual Check

Thermal Cycling

Humidity

–5°C to +70°C, 500 cycles

Visual Check

85% relative humidity, 55°C, 1000 hours

NOTES:

1. It is recommended that the above tests be performed on a sample size of at least twelve assemblies from

three lots of material.

2. Additional pass/fail criteria may be added at the discretion of the user.

Intel E8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

NB Reference Thermal Solution #1

Intel E8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

7 NB Reference Thermal Solution #2

Intel has developed two different reference thermal solutions designed to meet the cooling needs of

the E8500 chipset NB component under operating environments and specifications defined in this

document. This chapter describes the overall requirements for the 2nd NB reference thermal

solution including critical-to-function dimensions, operating environment, and validation criteria.

Other chipset components may or may not need attached thermal solutions, depending on your

specific system local-ambient operating conditions. For information on the Intel 6700PXH 64-bit

PCI Hub, refer to thermal specification in the Intel 6700PXH 64-bit PCI Hub

Thermal/Mechanical Design Guidelines. For information on the ICH5, refer to thermal

specification in the Intel 82801EB I/O Controller Hub 5 (ICH5) and Intel 82801ER I/O

Controller Hub 5 R (ICH5R) Thermal Design Guide.

7.1

Operating Environment

The reference thermal solution was designed assuming a maximum local-ambient temperature of

52°C. The minimum recommended airflow velocity through the cross section of the heatsink fins is

400 linear feet per minutes (lfm). The approaching airflow temperature is assumed to be equal to

the local-ambient temperature. The thermal designer must carefully select the location to measure

airflow to obtain an accurate estimate. These local-ambient conditions are based on a 35°C

external-ambient temperature at sea level. (External-ambient refers to the environmental external

to the system.)

The fastener for this reference thermal solution is intended to be used on motherboard with

thickness between 0.085” and 0.093”.

7.2

Heatsink Performance

Figure 7-1 depicts the measured thermal performance of the 2 NB reference thermal solution

versus approach air velocity. Since this data was measured at sea level, a correction factor would be

required to estimate thermal performance at other altitudes.

Intel E8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

NB Reference Thermal Solution #2

Figure 7-1. Second NB Reference Heatsink Measured Thermal Performance vs.

Approach Velocity

2.3

1.7

1.4

1.1

0.8

0.5

100

200

300

400

500

600

Flow Rate (LFM)

7.3

Mechanical Design Envelope

While each design may have unique mechanical volume and height restrictions or implementation

requirements, the height, width, and depth constraints typically placed on the E8500 chipset NB

thermal solution are shown in Figure 7-2.

When using heatsinks that extend beyond the NB reference heatsink envelope shown in Figure 7-2,

any motherboard components placed between the heatsink and motherboard cannot exceed

4.14 mm (0.16 in.) in height.

Intel E8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

NB Reference Thermal Solution #2

Figure 7-2. Second NB Reference Heatsink Volumetric Envelope

H e a ts in k

F in

H e a ts in k B a s e

IH S

T IM

F C B G A

M o th e rb o a rd

6 4 .5 2 m m .

4 2 .5 0 m m .

H e a ts in k B a s e

H e a ts in k

F in

7.4

7.5

Board-Level Components Keepout Dimensions

Please refer to Section 6.4 for detail.

Second NB Heatsink Thermal Solution Assembly

The reference thermal solution for the chipset NB component is a passive extruded heatsink with

thermal interlace. It is attached to the board by using four retaining Tuflok fasteners. Figure 7-3

shows the reference thermal solution assembly and associated components.

Full mechanical drawings of the thermal solution assembly and the heatsink are provided in

Appendix B. Appendix A contains vendor information for each thermal solution component.

Intel E8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

NB Reference Thermal Solution #2

Figure 7-3. Second NB Heatsink Assembly

7.5.1

Heatsink Orientation

Since this solution is based on a unidirectional heatsink, mean airflow direction must be aligned

with the direction of the heatsink fins.

7.5.2

7.5.3

Extruded Heatsink Profiles

Please refer to Section 6.5.2 for detail.

Mechanical Interface Material

There is no mechanical interface material associated with this reference solution.

7.5.4

Thermal Interface Material

Please refer to Section 6.5.4 for detail.

7.5.4.1

Effect of Pressure on TIM Performance

Please refer to Section 6.5.4.1 for detail.

7.5.5

Heatsink Retaining Fastener

The reference solution uses four heatsink retaining Tufloks. The fasteners attached the heatsink to

the motherboard by expanding its Tuflok prong to snap into each of the four heatsink mounting

holes. These fasteners are intended to be used on 0.085” to 0.093” thickness motherboard with

either of the two NB reference thermal solutions. See Appendix B for a mechanical drawing of the

fastener.

Intel E8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

NB Reference Thermal Solution #2

7.6

Reliability Guidelines

Please refer to Section 6.6 for detail.

Intel E8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

NB Reference Thermal Solution #2

Intel E8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

8 XMB Reference Thermal Solution

Intel has developed one different reference thermal solution designed to meet the cooling needs of

the E8500 chipset XMB component under operating environments and specifications defined in

this document. This chapter describes the overall requirements for the XMB reference thermal

solution including critical-to-function dimensions, operating environment, and validation criteria.

Other chipset components may or may not need attached thermal solutions, depending on your

specific system local-ambient operating conditions. For information on the Intel 6700PXH 64-bit

PCI Hub, refer to thermal specification in the Intel 6700PXH 64-bit PCI Hub

Thermal/Mechanical Design Guide. For information on the ICH5, refer to thermal specification in

the Intel 82801EB I/O Controller Hub 5 (ICH5) and Intel 82801ER I/O Controller Hub 5 R

(ICH5R) Thermal Design Guide.

8.1

Operating Environment

The reference thermal solution was designed assuming a maximum local-ambient temperature of

57°C. The minimum recommended airflow velocity through the cross section of the heatsink fins is

300 linear feet per minute (lfm). The approaching airflow temperature is assumed to be equal to the

local-ambient temperature. The thermal designer must carefully select the location to measure

airflow to obtain an accurate estimate. These local-ambient conditions are based on a 35°C

external-ambient temperature at sea level. (External-ambient refers to the environment external to

the system.)

The fasteners associated for this reference thermal solution is intended to be used on 0.062”

thickness motherboard.

8.2

Heatsink Performance

Figure 8-1 depicts the measured thermal performance of the XMB reference thermal solution

versus approach air velocity. Since this data was measured at sea level, a correction factor would be

required to estimate thermal performance at other altitudes.

Figure 8-1. XMB Reference Heatsink Measured Thermal Performance vs. Approach Velocity

5.5

4.5

3.5

2.5

100

200

300

400

500

600

Flow Rate (LFM)

Intel E8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

XMB Reference Thermal Solution

8.3

Mechanical Design Envelope

While each design may have unique mechanical volume and height restrictions or implementation

requirements, the height, width and depth constraints typically placed on the E8500 chipset XMB

thermal solution are showing in Figure 8-2.

When using heatsinks that extend beyond the XMB reference heatsink envelope shown in

Figure 8-2, any motherboard components placed between the heatsink and motherboard cannot

exceed 2.48 mm (0.10 in.) in height.

Figure 8-2. XMB Reference Heatsink Volumetric Envelope

Heatsink Fin

Heatsink Base

Motherboard

Die + TIM

FCBGA + Solder Balls

63.50mm.

Heatsink Fin

45.50mm.

8.4

8.5

Board-Level Components Keepout Dimensions

The locations of holes pattern and keepout zones for the reference thermal solution are shown in

Figure 8-3.

XMB Heatsink Thermal Solution Assembly

The reference thermal solution for the chipset XMB component is a passive extruded heatsink with

thermal interface. It is attached to the board by using four retaining Tuflok fasteners. Figure 8-4

shows the reference thermal solution assembly and associated components.

Intel E8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

XMB Reference Thermal Solution

Full mechanical drawings of the thermal solution assembly and the heatsink are provided in

Appendix B. Appendix A contains vendor information for each thermal solution component.

Figure 8-3. XMB Heatsink Board Component Keepout

63.500mm.

55.250mm.

37.500mm.

37.5mm

38.097mm. 48.260mm.

XMB Location

4X Ø 5.5mm

4X Ø 2.95 ± 0.0254mm

No Component Keep Out Area

2.48mm Max Component Height

Heatsink Mounting Hole

8.5.1

Heatsink Orientation

Since this solution is based on a unidirectional heatsink, mean airflow direction must be aligned

with the direction of the heatsink fins.

Figure 8-4. XMB Heatsink Assembly

Intel E8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

XMB Reference Thermal Solution

8.5.2

Extruded Heatsink Profiles

The reference XMB thermal solution uses an extruded heatsink for cooling the chipset XMB.

Figure 8-5 shows the heatsink profile. Appendix A lists a supplier for this extruded heatsink. Other

heatsinks with similar dimensions and increased thermal performance may be available. A full

mechanical drawing of this heatsink is provided in Appendix B.

8.5.3

8.5.4

Mechanical Interface Material

There is no mechanical interface material associated with this reference solution.

Thermal Interface Material

A TIM provides improved conductivity between the die and the heatsink. The reference thermal

solution uses Chomerics THERMFLOW T710, 0.127 mm (0.005 in.) thick, 17.8 mm x 17.8 mm

(0.7 in. x 0.7 in.) square.

Note: Unflowed or “dry” Chomerics THERMFLOW T710 has a material thickness of 0.005 inch.

The flowed or “wet” Chomerics THERMFLOW T710 has a material thickness of ~0.0025 inch

after it reaches its phase change temperature.

8.5.4.1

Effect of Pressure on TIM Performance

Please refer to Section 6.5.4.1 for detail.

8.5.5

Heatsink Retaining Fastener

The reference solution uses four heatsink retaining Tufloks. The fasteners attached the heatsink to

the motherboard by expanding its Tuflok prong to snap into each of the four heatsink mounting

hole. These fasteners are intended to be used on a 0.062” thickness motherboard. See Appendix B

for a mechanical drawing of the fastener.

Intel E8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

XMB Reference Thermal Solution

Figure 8-5. XMB Heatsink Extrusion Profile

8.6

Reliability Guidelines

Please refer to Section 6.6 for detail.

Intel E8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

XMB Reference Thermal Solution

Intel E8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

A Thermal Solution Component

Suppliers

Table A-1.

NB Heatsink Thermal Solution #1

Supplier

(Part Number)

Part

Intel Part Number

Contact Information

Harry Lin (USA)

Heatsink Assembly includes:

C23120-001

CCI/ACK

•

Unidirectional Fin Heatsink

Thermal Interface Material

Retaining Fastener

714-739-5797

[email protected]

Monica Chih (Taiwan)

866-2-29952666, x131

[email protected]

Unidirectional Fin Heatsink

(64.52 x 64.52 x 50.8 mm)

C19221-001

CCI/ACK

Harry Lin (USA)

714-739-5797

[email protected]

Monica Chih (Taiwan)

866-2-29952666, x131

[email protected]

Thermal Interface

(T710)

689850-001

Chomerics

Todd Sousa (USA)

(69-12-21937-T710)

360-606-8171

[email protected]

Retaining Fastener

ITW Fastex*

Ron Schmidt (USA)

847-299-2222

(8034-00-9909)

[email protected]

Henry Lu (Taiwan)

(886) 7-811-9206 Ext. 10

[email protected]

Intel E8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

Thermal Solution Component Suppliers

Table A-2.

NB Heatsink Thermal Solution #2

Intel Part Number

Contact Information

Supplier

(Part Number)

Part

Heatsink Assembly includes:

C44148-001

CCI/ACK

Harry Lin (USA)

•

Unidirectional Fin Heatsink

Thermal Interface Material

Retaining Fastener

714-739-5797

[email protected]

Monica Chih (Taiwan)

866-2-29952666, x131

[email protected]

Unidirectional Fin Heatsink

(64.52 x 64.52 x 50.8 mm)

C44147-001

CCI/ACK

Harry Lin (USA)

714-739-5797

[email protected]

Monica Chih (Taiwan)

866-2-29952666, x131

[email protected]

Thermal Interface

(T710)

689850-001

Chomerics

Todd Sousa (USA)

(69-12-21937-T710)

360-606-8171

[email protected]

Retaining Fastener

ITW Fastex*

Ron Schmidt (USA)

847-299-2222

(8047-00-9909)

[email protected]

Henry Lu (Taiwan)

(886) 7-811-9206 Ext. 10

[email protected]

Table A-3.

XMB Heatsink Thermal Solution

Supplier

(Part Number)

Part

Intel Part Number

Contact Information

Heatsink Assembly includes:

C23124-001

CCI/ACK

Harry Lin (USA)

•

Unidirectional Fin Heatsink

Thermal Interface Material

Retaining Fastener

714-739-5797

[email protected]

Monica Chih (Taiwan)

866-2-29952666, x131

[email protected]

Unidirectional Fin Heatsink

(64.52 x 64.52 x 50.8 mm)

C19222-001

689850-001

CCI/ACK

Harry Lin (USA)

714-739-5797

[email protected]

Monica Chih (Taiwan)

866-2-29952666, x131

[email protected]

Thermal Interface

(T-710)

Chomerics

Todd Sousa (USA)

(69-12-22000-T710)

360-606-8171

[email protected]

Intel E8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

Thermal Solution Component Suppliers

Table A-3.

XMB Heatsink Thermal Solution

Retaining Fastener

ITW Fastex*

(8034-00-9909)

Ron Schmidt (USA)

847-299-2222

[email protected]

Henry Lu (Taiwan)

(886) 7-811-9206 Ext. 10

[email protected]

Note: The enabled components may not be currently available from all suppliers. Contact the supplier

directly to verify time of component availability.

Intel E8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

Thermal Solution Component Suppliers

Intel E8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

B Mechanical Drawings

Table B-1. Mechanical Drawing List

Drawing Description

Figure Number

NB Heatsink #1 Assembly Drawing

NB Heatsink #1 Drawing

Figure B-1

Figure B-2

Figure B-3

Figure B-4

Figure B-5

Figure B-6

NB Heatsink #2 Assembly Drawing

NB Heatsink #2 Drawing

XMB Heatsink Assembly Drawing

XMB Heatsink Drawing

Intel E8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

Mechanical Drawings

Figure B-1. NB Heatsink #1 Assembly Drawing

Intel 8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

Mechanical Drawings

Figure B-2. NB Heatsink #1 Drawing

Intel 8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

Mechanical Drawings

Figure B-3. NB Heatsink #2 Assembly Drawing

Intel 8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

Mechanical Drawings

Figure B-4. NB Heatsink #2 Drawing

Intel 8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

Mechanical Drawings

Figure B-5. XMB Heatsink Assembly Drawing

Intel 8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

Mechanical Drawings

Figure B-6. XMB Heatsink Drawing

Intel 8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

Mechanical Drawings

Intel E8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

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