Fujitsu LQFP 52P User Manual

FUJITSU SEMICONDUCTOR  
SUPPORT SYSTEM  
SS01-26015-1E  
F2MC-8FX Family  
LQFP-52P (0.65 mm pitch) HEADER BOARD  
MB2146-261  
OPERATION MANUAL  
The contents of this document are subject to change without notice.  
Customers are advised to consult with FUJITSU sales representatives before ordering.  
The information, such as descriptions of function and application circuit examples, in this document are presented sole-  
ly for the purpose of reference to show examples of operations and uses of FUJITSU semiconductor device; FUJITSU  
does not warrant proper operation of the device with respect to use based on such information. When you develop  
equipment incorporating the device based on such information, you must assume any responsibility arising out of such  
use of the information. FUJITSU assumes no liability for any damages whatsoever arising out of the use of the infor-  
mation.  
Any information in this document, including descriptions of function and schematic diagrams, shall not be construed  
as license of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right  
of FUJITSU or any third party or does FUJITSU warrant non-infringement of any third-party’s intellectual property  
right or other right by using such information. FUJITSU assumes no liability for any infringement of the intellectual  
property rights or other rights of third parties which would result from the use of information contained herein.  
The products described in this document are designed, developed and manufactured as contemplated for general use,  
including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not  
designed, developed and manufactured as contemplated (1) for use accompanying fatal risks or dangers that, unless  
extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal  
injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air  
traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2)  
for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite).  
Please note that FUJITSU will not be liable against you and/or any third party for any claims or damages arising in  
connection with above-mentioned uses of the products.  
Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from  
such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire pro-  
tection, and prevention of over-current levels and other abnormal operating conditions.  
If any products described in this document represent goods or technologies subject to certain restrictions on export un-  
der the Foreign Exchange and Foreign Trade Law of Japan, the prior authorization by Japanese government will be  
required for export of those products from Japan.  
Copyright ©2006 FUJITSU LIMITED All rights reserved  
ii  
1. Product Outline  
Product outline  
MB2146-261 is a header board (referred to as header board) used to connect the MCU board (model  
number : MB2146-301, MB2146-303) which mounts an evaluation MCU in the F2MC-8FX family  
of Fujitsu 8-bit microcontrollers to a user system. To build an F2MC-8FX evaluation environment,  
combine the three products as shown in Figure 1: the header board, a MCU board, and a BGM adapt-  
er (model number : MB2146-09).  
MCU board  
BGM adapter  
Header board  
Figure 1 System Configuration  
Product configuration  
Table 1 lists the product configuration in the header board, and Table 2 lists options.  
Table 1 Product Cofiguration  
Name  
Description  
Remarks  
F2MC-8FX  
Connector/LQFP52pin  
(0.65 mm pitch) Package conversion  
LQFP-52P (0.65 mm pitch)  
header board  
-
[Model number : MB2146-261]  
[Model number : YQPACK052SB]  
(Tokyo Eletech Corporation)  
I/F between header board and NQPACK  
For mounted on user system  
Accessory (connected)  
Accessory  
[Model number : NQPACK052SB]  
(Tokyo Eletech Corporation)  
[Model number : HQPACK052SB]  
(Tokyo Eletech Corporation)  
Used when mounting mass production MCU  
to NQPACK.  
Accessory  
Table 2 Options  
Description  
Name  
Remarks  
BGM adapter  
[Model number : MB2146-09]  
ICE unit for F2MC-8FX  
-
MCU board  
Built-inMB95FV100B-101,  
Built-in F2MC-8FX evaluation MCU *  
[Model number : MB2146-301, MB2146-303] MB95FV100B-103  
* : Multiple types of evaluation MCUs are available depending on their applications. Purchase the one that satisfies  
the service conditions.  
1
2. Checking the Delivered Product  
Before using the MB2146-261, confirm that the following components are included  
in the box:  
LQFP-52P (0.65 mm pitch) header board *1  
: 1  
: 4  
: 1  
: 1  
: 1  
Screws for securing header board (M2 × 10 mm, 0.4 mm pitch)  
NQPACK052SB *2  
HQPACK052SB *3  
Operation manual (English version, this manual)  
*1 : Header board manufactured by Tokyo Eletech Corporation, referred to as “YQPACK”, mounts  
YQPACK052SB.  
*2 : IC socket manufactured by Tokyo Eletech Coporation, referred to as “NQPACK”, is supplied  
with a special screwdriver and 2 guide pins. A socket offering higher reliability,  
NQPACK052SB-SL (manufactured by Tokyo Eletech Corporation and sold separately) , can  
be used by making an IC socket mounting hole on the user system board. For more information,  
contact Tokyo Eletech Corporation.  
*3 : IC socket cover manufactured by Tokyo Eletech Corporation, referred to as “HQPACK”, is  
supplied with 4 screws for securing HQPACK (M2 × 6 mm, 0.4 mm pitch) .  
3. Handling Precautions  
The header board is precision-manufactured to improve the dimensional accuracy and to ensure a  
reliable contact. The header board is therefore sensitive to mechanical shocks. To ensure a correct  
use of the header board in the proper environment, observe the following:  
Avoid placing a stress on the NQPACK mounted on the user system board when connecting  
the header board.  
2
4. Notes on Designing  
Notes on designing printed circuit board for the user system  
When the header board is connected to the user system, some part mounted around the NQPACK in  
the user system may be contacting the header board if the height of the part is tall. To prevent this,  
design the printed circuit board for the user system so that the components do not exceed the height  
shown in Figure 2. Figure 2 shows the dimension figure of the header board.  
PCW-1-1-1PW  
:MAC EIGHT  
40.0 mm  
30.0 mm  
㪚㪥㪊  
㪬㪈  
WR-120SB-VF-N1 : JAE *2  
WR-120SB-VF-N1 : JAE *2  
YQPACK052SB  
:Tokyo Eletech Corporation  
NQPACK052SB  
:Tokyo Eletech Corporation  
U1:  
User system I/F connector  
CN3:  
CN1/CN2:  
Incorrect insertion prevention socket  
MCU board I/F connector  
*1 : The height differs slightly depending on how the YQPACK and NQPACK are engaged.  
*2 : Japan Aviation Electronics Industry, Limited  
Figure 2 Header Board Dimensions  
3
MCU footprint design notes  
Figure 3 shows the recommended footprint dimensions of the NQPACK mounted on the printed cir-  
cuit board for the user system. Take the footprint in Figure 3 into consideration as well as the foot-  
print of the mass production MCU when designing the printed circuit board for the user system.  
To follow the most updated information, be sure to contact Tokyo Eletech Corporation whenever de-  
signing the printed circuit board.  
0.4 mm  
0.65 mm  
No.1 Pin  
Figure 3 Recommended Footprint Dimensions for Mounting the NQPACK  
4
5. Connecting to the User System  
Connecting  
Mount the supplied NQPACK on the user system before using the MB2146-261.  
1. To connect the header board to the user system, match pin 1 indicated by the index mark () on  
the NQPACK mounted on the user system with pin 1 indicated by the index mark (an angle cut  
linearly at one place only in silk screen) on the header board and then insert it (see “Figure 4”) .  
The pins of YQPACK are thin and easy to bend. Insert NQPACK after confirming that the pins  
of YQPACK are not bent.  
NQPACK index mark  
Header board index mark  
Figure 4 Index Position  
2. Insert each screw for securing the header board into each of the four tapped holes on the header  
board, and then tighten the screws diagonally. The center screw hole is not used. To tighten the  
screws, use the special screwdriver supplied with the NQPACK to equally tighten the four screws  
in sequence. Tightening the screws too tight might result in a defective contact.  
3. Connect the MCU board to the header board while being careful not to excessively force the NQ-  
PACK. The MCU board can be connected to the header board only in the correct orientation as  
they have an incorrect insertion prevention header socket to prevent a reverse connection. Figure  
5 illustrates how the MCU board, header board, NQPACK, and user system are connected togeth-  
er.  
5
MCU board  
Evaluation  
MCU  
MCU board  
Screws for securing  
header board  
Header board  
Connected  
at shipment  
YQPACK  
NQPACK  
User system  
Figure 5 Connecting MCU Board/Header Board to User System  
Disconnection  
1. Remove the MCU board from the header board. Detach the four corners slowly in sequence, not  
excessively forcing the junction with the NQPACK.  
2. Remove all of the four screws from the header board. Pull out the header board vertically from  
the NQPACK. Remove the header board slowly not excessively forcing the junction with the  
NQPACK.  
6
6. Mounting Mass Production MCUs  
Mounting  
To mount a mass production MCU on the user system, use the supplied HQPACK (IC socket cover)  
(see “Figure 6”) .  
1. To mount a mass production MCU on the user system, match the index mark () on the NQ-  
PACK mounted on the user system with the index mark () on the mass production MCU.  
2. Confirm that the mass production MCU is correctly mounted on the NQPACK. Next, match the  
index mark of HQPACK with the index mark of NQPACK and insert it (angle cut linearly at one  
place only) .  
The pins of HQPACK are thin and easy to bend. Insert NQPACK after confirming that pins of  
HQPACK are not bent.  
3. Insert each screw for securing HQPACK in each of four tapped holes on the HQPACK, and then  
tighten the screws diagonally. To tighten the screws, use the special screwdriver supplied with  
the NQPACK to finally tighten the four screws in sequence. Tightening the screws too tight  
might result in a defective contact.  
Screws for securing HQPACK  
HQPACK  
Mass production MCU  
NQPACK  
User system  
Figure 6 Mounting a Mass Production MCU  
Disconnection  
To remove the HQPACK, remove all of the four screws and pull out the HQPACK vertically from  
the NQPACK. When taking out the mass production MCU, absorb the mass production MCU using  
a vacuum pick-up tool special for removing IC. Do not attempt to remove the mass production MCU  
forcibly, for example, using a screwdriver to do so can bend the pins of the mass production MCU  
or break the NQPACK.  
7
7. Product Specifications  
General specifications  
Table 3 lists the general specifications of the header board.  
Table 3 General Specifications  
Item  
Description  
Operating temperature and storage temperature  
Operating humidity and storage humidity  
5 °C to 35 °C (operation) , 0 °C to 40 °C (storage)  
20 % to 80 % (operation) , 20 % to 80 % (storage)  
Approximately 40 mm × 40 mm × 16 mm  
(Height contains that of YQPACK and NQPACK)  
Dimensions  
Main part  
The main part of a header board is shown in Table 4.  
Table 4 Main Part  
Name  
Description  
120 pin, 0.5 mm pitch, 2-piece connector  
(straight) × 2  
[Model number : WR-120SB-VF-N1  
(from Japan Aviation Electronics Industry, Limited) ]  
MCU board I/F connector  
2 pin, 2.54 mm pitch, 1-piece socket  
(Straight)  
[Model number : PCW-1-1-1PW (from MAC EIGHT) ]  
Incorrect insertion prevention socket  
User target system I/F connector  
Functional block diagram  
Socket  
52 pin, 0.65 mm pitch  
[Model number : YQPACK052SB (from Tokyo Eletech Corporation) ]  
A header board performs socket conversion between the MCU board I/F connector and YQPACK.  
The header board does not contain any component such as an IC internally. Figure 7 shows the block  
diagram.  
MCU board I/F connector  
User target system I/F connector  
(Socket for package)  
Figure 7 Functional Block Diagram  
8
MCU board I/F connector (CN1, CN2, and CN3)  
CN1 and CN2 are MCU board I/F connectors. CN3 is the incorrect insertion prevention socket of a  
MCU board. The pin assignment of the MCU board I/F connector CN1 is shown in Table 5, and the  
pin assignment of the MCU board I/F connector CN2 is shown in Table 6.  
Table 5 Pin Assignment of the MCU Board I/F Connector CN1  
Connector  
Pin  
Number  
Connector  
Pin  
Number  
Connector  
Pin  
Number  
Evaluation  
MCU Pin  
Number  
Evaluation  
MCU Pin  
Number  
Evaluation  
MCU Pin  
Number  
Signal  
name  
Signal  
name  
Signal  
name  
1
A9  
B9  
C9  
D9  
A8  
B8  
C8  
D8  
A7  
B7  
C7  
D7  
A6  
B6  
C6  
D6  
A5  
B5  
C5  
D5  
A4  
A3  
-
PC4  
PC1  
41  
42  
43  
44  
45  
46  
47  
48  
49  
50  
51  
52  
53  
54  
55  
56  
57  
58  
59  
60  
61  
62  
63  
64  
65  
66  
67  
68  
69  
70  
71  
72  
73  
74  
75  
76  
77  
78  
79  
80  
E2  
E1  
F4  
F3  
F2  
F1  
-
LVR3  
LVSS  
LVDREXT  
LVDBGR  
LVDENX  
P22A  
GND  
GND  
P20A  
NC1  
81  
82  
P3  
P4  
R1  
R2  
R3  
R4  
T1  
T2  
T3  
T4  
U1  
U2  
U3  
U4  
V1  
V2  
-
BSOUT  
BDBMX  
P83  
2
3
PC2  
83  
4
PC3  
84  
BRSTX  
X0A  
5
PC0  
85  
6
PB4  
86  
RSTX  
7
PB5  
87  
ROMS1  
BSIN  
8
PB6  
-
88  
9
PB7  
G4  
G3  
G2  
G1  
H4  
H3  
H2  
H1  
J4  
89  
Vss  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
PB2  
90  
X0  
PB0  
P21A  
P23A  
P24A  
P25A  
P26A  
P27A  
P24B  
P50  
91  
BEXCK  
X1  
PB1  
92  
PB3  
93  
MOD  
PA2  
94  
PF2  
P95  
95  
X1A  
PA0  
96  
Vcc53  
PA3  
97  
GND  
P94  
J3  
98  
-
GND  
P90  
J2  
P23B  
P51  
99  
V3  
V4  
R5  
T5  
U5  
V5  
R6  
T6  
U6  
V6  
R7  
T7  
U7  
V7  
R8  
T8  
U8  
V8  
R9  
T9  
U9  
V9  
PINT0  
PSEL_EXT  
PF1  
P91  
J1  
100  
101  
102  
103  
104  
105  
106  
107  
108  
109  
110  
111  
112  
113  
114  
115  
116  
117  
118  
119  
120  
PA1  
K1  
K2  
K3  
K4  
L1  
L2  
L3  
L4  
M1  
M2  
M3  
M4  
-
P52  
P93  
P55  
PF0  
GND  
GND  
CSVENX  
Vss  
P54  
NC2  
-
P53  
PENABLE  
APBENX  
PINT1  
PCLK  
A2  
A1  
B4  
B3  
B2  
B1  
C4  
C3  
C2  
C1  
D4  
D3  
D2  
D1  
E4  
E3  
P70  
P74  
P92  
P73  
TCLK  
LVCC  
LVDIN  
Cpin  
P72  
PADDR0  
PACTIVE  
PLOCK  
PWRITE  
PADDR1  
PADDR2  
PADDR3  
PADDR4  
PADDR5  
PADDR7  
PRDATA0  
PADDR6  
PRDATA1  
P71  
P76  
P80  
Vcc51  
LVDENX2  
LVR4  
TESTO  
LVDOUT  
LVR2  
BGOENX  
LVR1  
LVR0  
P77  
GND  
GND  
P75  
-
N1  
N2  
N3  
N4  
P1  
P2  
P82  
PG0  
P84  
P81  
ROMS0  
9
Table 6 Pin Assignment of the MCU Board I/F Connector CN2  
Connector  
Pin  
Number  
Connector  
Pin  
Number  
Connector  
Pin  
Number  
Evaluation  
MCU Pin  
Number  
Evaluation  
MCU Pin  
Number  
Evaluation  
MCU Pin  
Number  
Signal  
name  
Signal  
name  
Signal  
name  
1
A10  
B10  
C10  
D10  
A11  
B11  
C11  
D11  
A12  
B12  
C12  
D12  
A13  
B13  
C13  
D13  
A14  
B14  
C14  
D14  
A15  
A16  
-
PC5  
PD0  
41  
42  
43  
44  
45  
46  
47  
48  
49  
50  
51  
52  
53  
54  
55  
56  
57  
58  
59  
60  
61  
62  
63  
64  
65  
66  
67  
68  
69  
70  
71  
72  
73  
74  
75  
76  
77  
78  
79  
80  
E17  
E18  
F15  
F16  
F17  
F18  
-
NC4  
SEL0  
SEL3  
SEL4  
SEL1  
P04C  
GND  
GND  
P06C  
P07C  
P05C  
P00C  
P01C  
P02C  
P03C  
P07A  
P04A  
P05A  
P06A  
P03A  
P02A  
P07B  
P01A  
P00A  
P06B  
P05B  
P04B  
P03B  
P02B  
P00B  
P46  
81  
82  
P16  
P15  
R18  
R17  
R16  
R15  
T18  
T17  
T16  
T15  
U18  
U17  
U16  
U15  
V18  
V17  
-
P34  
P35  
2
3
PC6  
83  
P44  
4
PC7  
84  
P36  
5
PD1  
85  
P31  
6
PD2  
86  
AVcc3  
P40  
7
PD3  
87  
8
PD4  
-
88  
P32  
9
PD5  
G15  
G16  
G17  
G18  
H15  
H16  
H17  
H18  
J15  
89  
AVss  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
PD7  
90  
AVR  
P61  
91  
P33  
P60  
92  
P30  
PD6  
93  
AVR3  
P64  
94  
P15  
P66  
95  
AVcc  
P65  
96  
DA0  
P62  
97  
GND  
PE0A  
PE3A  
PE2A  
P63  
J16  
J17  
J18  
K18  
K17  
K16  
K15  
L18  
L17  
L16  
L15  
M18  
M17  
M16  
M15  
-
98  
-
GND  
99  
V16  
V15  
R14  
T14  
U14  
V14  
R13  
T13  
U13  
V13  
R12  
T12  
U12  
V12  
R11  
T11  
U11  
V11  
R10  
T10  
U10  
V10  
P14  
100  
101  
102  
103  
104  
105  
106  
107  
108  
109  
110  
111  
112  
113  
114  
115  
116  
117  
118  
119  
120  
P10  
P16  
P67  
DA1  
GND  
GND  
PE4A  
Vcc54  
PE1A  
PE5A  
PE7A  
PE3B  
PE6A  
Vss  
P13  
-
PWDATA7  
P11  
A17  
A18  
B15  
B16  
B17  
B18  
C15  
C16  
C17  
C18  
D15  
D16  
D17  
D18  
E15  
E16  
P12  
NC3  
PWDATA3  
PWDATA5  
PWDATA6  
PWDATA4  
PRDATA7  
PWDATA0  
PWDATA1  
PWDATA2  
PRDATA6  
PRDATA3  
PRDATA4  
PRDATA5  
PRDATA2  
P47  
PE2B  
PE7B  
PE1B  
PE0B  
PE6B  
SEL2  
PE5B  
PE4B  
GND  
GND  
P01B  
P43  
-
N18  
N17  
N16  
N15  
P18  
P17  
P41  
P42  
P45  
P37  
10  
User system I/F YQPACK (U1)  
The pin assignment of user system I/F YQPACK in the header board is shown in Table 7.  
Table 7 Pin Assignment of the User System I/F YQPACK in Header Board  
Connector  
Connector  
Pin Number  
Signal name  
Signal name  
Pin Number  
1
P61/S09/PPG11  
P62/S10/TO10  
P63/S11/TO11  
P64/S12/EC1  
P65/S13/SCK  
P66/S14/SOT  
NC  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
41  
42  
43  
44  
45  
46  
47  
48  
49  
50  
51  
52  
VCC  
Cpin  
2
3
X1A  
4
X0A  
5
RSTX  
6
P90/V3  
7
NC  
8
P67/S15/SIN  
P14/PPG0  
P91/V2  
9
P92/V1  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
P13/TRG0/ADTG  
P12/UCK0  
P93/V0  
P94/C0  
P11/UO0  
P95/C1  
P10/UI0  
PA0/COM0  
PA1/COM1  
PA2/COM2  
PA3/COM3  
PB0/S00  
PB1/S01  
PB2/S02  
NC  
P07/INT07/AN07  
P06/INT06/AN06  
P05/INT05/AN05  
P04/INT04/AN04  
P03/INT03/AN03  
P02/INT02/AN02  
NC  
P01/INT01/AN01  
P00/INT00/AN00  
MO  
PB3/S03/PPG00  
PB4/S04/PPG01  
PB5/S05/TO00  
PB6/S06/TO01  
PB7/S07/EC0  
P60/S08/PPG10  
X0  
X1  
VSS  
11  
SS01-26015-1E  
FUJITSU SEMICONDUCTOR SUPPORT SYSTEM  
F2MC-8FX Family  
LQFP-52P (0.65 mm pitch) HEADER BOARD  
MB2146-261  
OPERATION MANUAL  
April 2006 the first edition  
Published FUJITSU LIMITED Electronic Devices  
Edited Business Promotion Dept.  

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