Cypress CY8C23433 User Manual

CY8C23433, CY8C23533

PSoC^®Programmable System-on-Chip™

Features

■ Powerful Harvard Architecture Processor

❐ M8C Processor Speeds to 24 MHz

❐ 8x8 Multiply, 32-Bit Accumulate

■ Complete Development Tools

❐ Free Development Software (PSoC Designer™)

❐ Full-Featured In-Circuit Emulator and Programmer

❐ Full Speed Emulation

❐ Low Power at High Speed

❐ 3.0 to 5.25V Operating Voltage

❐ Complex Breakpoint Structure

❐ Industrial Temperature Range: -40°C to +85°C

❐ 128K Bytes Trace Memory

■ Advanced Peripherals (PSoC Blocks)

❐ 4 Rail-to-Rail analog PSoC Blocks Provide:

• Up to 14-Bit ADCs

Logic Block Diagram

• Up to 8-Bit DACs

Analog

Port 3 Port 2 Port 1 Port 0

Drivers

• Programmable Gain Amplifiers

• Programmable Filters and Comparators

❐ 4 Digital PSoC Blocks Provide:

• 8 to 32-Bit Timers, Counters, and PWMs

• CRC and PRS Modules

PSoC CORE

System Bus

• Full-Duplex UART

Global Digital Interconnect

Global Analog Interconnect

• Multiple SPI™ Masters or Slaves

• Connectable to All GPIO Pins

SRAM

256 Bytes

SROM

Flash 8K

❐ Complex Peripherals by Combining Blocks

❐ High-Speed 8-Bit SAR ADC Optimized for Motor Control

Sleep and

Watchdog

CPUCore(M8C)

Interrupt

Controller

■ Precision, Programmable Clocking

❐ Internal ±2.5% 24/48 MHz Oscillator

MultipleClockSources

(IncludesIMO,ILO, PLL, andECO)

❐ High Accuracy 24 MHz with Optional 32 kHz Crystal and PLL

❐ Optional External Oscillator, up to 24 MHz

❐ Internal Oscillator for Watchdog and Sleep

DIGITAL SYSTEM

ANALOG SYSTEM

Analog

Ref

Digital

Block

Array

Analog

■ Flexible On-Chip Memory

Block Array

❐ 8K Bytes Flash Program Storage 50,000 Erase/Write Cycles

❐ 256 Bytes SRAM Data Storage

❐ In-System Serial Programming (ISSP)

❐ Partial Flash Updates

2 Columns

4 Blocks

1 Row

4 Blocks

Analog

Input

Muxing

SAR8 ADC

❐ Flexible Protection Modes

❐ EEPROM Emulation in Flash

■ Programmable Pin Configurations

❐ 25 mA Sink on all GPIO

❐ Pull up, Pull Down, High Z, Strong, or Open Drain Drive

Modes on All GPIO

❐ Up to Ten Analog Inputs on GPIO

❐ Two 30 mA Analog Outputs on GPIO

❐ Configurable Interrupt on All GPIO

Internal

Voltage

Ref.

Digital

Clocks

Multiply

Accum.

POR and LVD

System Resets

I²C

Decimator

SYSTEM RESOURCES

■ Additional System Resources

❐ I C™ Slave, Master, and Multi-Master to 400 kHz

❐ Watchdog and Sleep Timers

❐ User-Configurable Low Voltage Detection

❐ Integrated Supervisory Circuit

❐ On-chip Precision Voltage Reference

Cypress Semiconductor Corporation

Document Number: 001-44369 Rev. *B

•

198 Champion Court

•

San Jose, CA 95134-1709

•

408-943-2600

Revised December 05, 2008

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Figure 2. Analog System Block Diagram

Analog System

P0[7]

P0[6]

P0[4]

The Analog system consists of an 8-bit SAR ADC and four

configurable blocks. The programmable 8-bit SAR ADC is an

optimized ADC that runs up to 300 Ksps, with monotonic

guarantee. It also has the features to support a motor control

application.

P0[5]

P0[3]

P0[1]

P0[2]

P0[0]

Each analog block consists of an opamp circuit allowing the

creation of complex analog signal flows. Analog peripherals are

very flexible and can be customized to support specific

application requirements. Some of the more common PSoC

analog functions (most available as user modules) are:

P2[6]

P2[4]

P2[3]

P2[1]

P2[2]

P2[0]

■ Filters (2 band pass, low-pass)

■ Amplifiers (up to 2, with selectable gain to 48x)

■ Instrumentation amplifiers (1 with selectable gain to 93x)

■ Comparators (1, with 16 selectable thresholds)

■ DAC (6 or 9 -bit DAC)

Array Input Configuration

■ Multiplying DAC (6 or 9 -bit DAC)

■ High current output drivers (two with 30 mA drive)

■ 1.3V reference (as a System Resource)

■ DTMF dialer

ACI0[1:0]

ACI1[1:0]

Block Array

ACB00 ACB01

■ Modulators

ASD11

ASC21

■ Correlators

■ Peak detectors

■ Many other topologies possible

P0[7:0]

Analog blocks are arranged in a column of three, which includes

one CT (Continuous Time) and two SC (Switched Capacitor)

blocks. The Analog Column 0 contains the SAR8 ADC block

rather than the standard SC blocks.

ACI2[3:0]

8-Bit SAR ADC

Analog Reference

Interface to

Digital System

Re fere nce

Generators

Ref Hi

RefLo

AGND

AGNDIn

Ref In

Bandgap

M8C Interface (Address Bus, Data Bus, Etc.)

Document Number: 001-44369 Rev. *B

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Additional System Resources

Getting Started

System Resources, some of which are listed in the previous

sections, provide additional capability useful to complete

systems. Additional resources include a multiplier, decimator,

low voltage detection, and power on reset. Brief statements

describing the merits of each system resource follow:

The quickest path to understanding the PSoC silicon is by

reading this data sheet and using the PSoC Designer Integrated

Development Environment (IDE). This data sheet is an overview

of the PSoC integrated circuit and presents specific pin, register,

and electrical specifications. For in-depth information, along with

detailed programming information, refer the PSoC Mixed-Signal

Array Technical Reference Manual.

■ Digital clock dividers provide three customizable clock

frequencies for use in applications. The clocks can be routed

to both the digital and analog systems. Additional clocks can

be generated using digital PSoC blocks as clock dividers.

For latest Ordering, Packaging, and Electrical Specification

information, refer the latest PSoC device data sheets on the web

at http://www.cypress.com/psoc.

■ A multiply accumulate (MAC) provides a fast 8-bit multiplier

with 32-bit accumulate, to assist in both general math and

digital filters.

To determine which PSoC device meets your requirements,

navigate through the PSoC Decision Tree in the Application Note

AN2209 at http://www.cypress.com and select Application Notes

under the Design Resources.

■ The decimator provides a custom hardware filter for digital

signal processing applications including the creation of Delta

Sigma ADCs.

Development Kits

■ TheI2Cmoduleprovides100and400kHzcommunicationover

two wires. Slave, master, and multi-master modes are all

supported.

Development Kits are available from the following distributors:

Digi-Key, Avnet, Arrow, and Future. The Cypress Online Store

contains development kits, C compilers, and all accessories for

PSoC development. Go to the Cypress Online Store web site at

http://www.cypress.com/onlinestore.

■ Low Voltage Detection (LVD) interrupts can signal the

application of falling voltage levels, while the advanced POR

(Power On Reset) circuit eliminates the need for a system

supervisor.

Technical Training Modules

Free PSoC technical training modules are available for users

new to PSoC. Training modules cover designing, debugging,

■ An internal 1.3V reference provides an absolute reference for

the analog system, including ADCs and DACs.

advanced

analog

and

CapSense.

http://www.cypress.com.

PSoC Device Characteristics

Consultants

Depending on the PSoC device characteristics, the digital and

analog systems can have 16, 8, or 4 digital blocks and 12, 6, or

3 analog blocks. The following table lists the resources available

for specific PSoC device groups.

Certified PSoC Consultants offer everything from technical

assistance to completed PSoC designs. To contact or become a

PSoC Consultant go to http://www.cypress.com, click on Design

Support located at the top of the web page, and select CYPros

Consultants.

Table 1. PSoC Device Characteristics

Technical Support

PSoC Part

Number

PSoC application engineers take pride in fast and accurate

response. They can be reached with a 4-hour guaranteed

response at http://www.cypress.com/support.

CY8C29x66 upto 4

16 12

Application Notes

CY8C27x43 upto 2

A long list of application notes can assist you in every aspect of

your design effort. To view the PSoC application notes, go to

http://www.cypress.com/psocapnotes.

CY8C24x94 56

2^[1]

CY8C23X33 upto 1

Yes

CY8C24x23A upto 1

[2]

CY8C21x34 upto 1

[2]

[3]

CY8C21x23 16

CY8C20x34 upto 0

Notes

1. One complete column, plus one Continuous Time Block.

2. Limited analog functionality.

3. Two analog blocks and one CapSense.

Document Number: 001-44369 Rev. *B

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PSoC Designer Software Subsystems

Development Tools

PSoC Designer is a Microsoft^®Windows-based, integrated

Device Editor

development

environment

for

the

Programmable

The Device Editor subsystem allows the user to select different

onboard analog and digital components called user modules

using the PSoC blocks. Examples of user modules are ADCs,

DACs, Amplifiers, and Filters.

System-on-Chip (PSoC) devices. The PSoC Designer IDE and

application runs on Windows NT 4.0, Windows 2000, Windows

Millennium (Me), or Windows XP (refer section PSoC Designer

Subsystems on page 5).

The device editor also supports easy development of multiple

configurations and dynamic reconfiguration. Dynamic

configuration allows for changing configurations at run time.

PSoC Designer helps the customer to select an operating

configuration for the PSoC, write application code that uses the

PSoC, and debug the application. This system provides design

database management by project, an integrated debugger with

In-Circuit Emulator, in-system programming support, and the

CYASM macro assembler for the CPUs.

PSoC Designer sets up power on initialization tables for selected

PSoC block configurations and creates source code for an

application framework. The framework contains software to

operate the selected components and, if the project uses more

than one operating configuration, contains routines to switch

between different sets of PSoC block configurations at run time.

PSoC Designer can print out a configuration sheet for a given

project configuration for use during application programming in

conjunction with the Device Data Sheet. Once the framework is

generated, the user can add application-specific code to flesh

out the framework. It is also possible to change the selected

components and regenerate the framework.

PSoC Designer also supports a high-level C language compiler

developed specifically for the devices in the family.

Figure 3. PSoC Designer Subsystems

Context

Sensitive

Help

Graphical Designer

PSoC

Designer

Interface

Design Browser

The Design Browser allows users to select and import

preconfigured designs into the user’s project. Users can easily

browse

catalog of preconfigured designs to facilitate

time-to-design. Examples provided in the tools include a

300-baud modem, LIN Bus master and slave, fan controller, and

magnetic card reader.

Importable

Design

Database

Application Editor

PSoC

Configuration

Sheet

Device

Database

In the Application Editor you can edit your C language and

Assembly language source code. You can also assemble,

compile, link, and build.

PSoC

Designer

Core

Application

Database

Assembler. The macro assembler allows the assembly code to

be merged seamlessly with C code. The link libraries

automatically use absolute addressing or can be compiled in

relative mode, and linked with other software modules to get

absolute addressing.

Manufacturing

Information

File

Engine

Project

Database

User

Modules

Library

C Language Compiler. A C language compiler is available that

supports the PSoC family of devices. Even if you have never

worked in the C language before, the product quickly allows you

to create complete C programs for the PSoC family devices.

The embedded, optimizing C compiler provides all the features

of C tailored to the PSoC architecture. It comes complete with

embedded libraries providing port and bus operations, standard

keypad and display support, and extended math functionality.

Emulation

Pod

In-Circuit

Emulator

Device

Programmer

Document Number: 001-44369 Rev. *B

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Debugger

of resolution. The user module parameters permit you to

establish the pulse width and duty cycle. User modules also

provide tested software to cut your development time. The user

module application programming interface (API) provides high

level functions to control and respond to hardware events at

run-time. The API also provides optional interrupt service

routines that you can adapt as needed.

The PSoC Designer Debugger subsystem provides hardware

in-circuit emulation, allowing the designer to test the program in

a physical system while providing an internal view of the PSoC

device. Debugger commands allow the designer to read and

program and read and write data memory, read and write IO

registers, read and write CPU registers, set and clear

breakpoints, and provide program run, halt, and step control. The

debugger also allows the designer to create a trace buffer of

registers and memory locations of interest.

The API functions are documented in user module data sheets

that are viewed directly in the PSoC Designer IDE. These data

sheets explain the internal operation of the user module and

provide performance specifications. Each data sheet describes

the use of each user module parameter and documents the

setting of each register controlled by the user module.

Online Help System

The online help system displays online, context-sensitive help

for the user. Designed for procedural and quick reference, each

functional subsystem has its own context-sensitive help. This

system also provides tutorials and links to FAQs and an Online

Support Forum to aid the designer in getting started.

The development process starts when you open a new project

and bring up the Device Editor, a graphical user interface (GUI)

for configuring the hardware. You pick the user modules you

need for your project and map them onto the PSoC blocks with

point-and-click simplicity. Next, you build signal chains by

interconnecting user modules to each other and the IO pins. At

this stage, you also configure the clock source connections and

enter parameter values directly or by selecting values from

drop-down menus. When you are ready to test the hardware

configuration or move on to developing code for the project, you

perform the “Generate Application” step. This causes PSoC

Designer to generate source code that automatically configures

the device to your specification and provides the high-level user

module API functions.

Hardware Tools

In-Circuit Emulator

A low cost, high functionality ICE (In-Circuit Emulator) is

available for development support. This hardware has the

capability to program single devices.

The emulator consists of a base unit that connects to the PC by

way of a USB port. The base unit is universal and can operate

with all PSoC devices. Emulation pods for each device family are

available separately. The emulation pod takes the place of the

PSoC device in the target board and performs full speed (24

MHz) operation.

Figure 4. User Module/Source Code Development Flows

Device Editor

Designing with User Modules

Placement

User

Module

Selection

Source

Code

Generator

and

Parameter

-ization

The development process for the PSoC device differs from that

of a traditional fixed function microprocessor. The configurable

analog and digital hardware blocks give the PSoC architecture a

unique flexibility that pays dividends in managing specification

change during development and by lowering inventory costs.

These configurable resources, called PSoC Blocks, have the

ability to implement a wide variety of user-selectable functions.

Each block has several registers that determine its function and

connectivity to other blocks, multiplexers, buses and to the IO

pins. Iterative development cycles permit you to adapt the

hardware and the software. This substantially lowers the risk of

having to select a different part to meet the final design

requirements.

Generate

Application

Application Editor

Source

Code

Editor

Project

Manager

Build

Manager

To speed the development process, the PSoC Designer

Integrated Development Environment (IDE) provides a library of

pre-built, pre-tested hardware peripheral functions, called “User

Modules.” User modules make selecting and implementing

peripheral devices simple, and come in analog, digital, and

mixed signal varieties. The standard User Module library

contains over 50 common peripherals such as ADCs, DACs

Timers, Counters, UARTs, and other uncommon peripherals

such as DTMF Generators and Bi-Quad analog filter sections.

Build

All

Debugger

Event &

Breakpoint

Manager

Interface

to ICE

Storage

Each user module establishes the basic register settings that

implement the selected function. It also provides parameters that

allow you to tailor its precise configuration to your particular

application. For example, a Pulse Width Modulator User Module

configures one or more digital PSoC blocks, one for each 8 bits

Inspector

Document Number: 001-44369 Rev. *B

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The next step is to write your main program, and any

sub-routines using PSoC Designer’s Application Editor

subsystem. The Application Editor includes a Project Manager

that allows you to open the project source code files (including

all generated code files) from a hierarchal view. The source code

editor provides syntax coloring and advanced edit features for

both C and assembly language. File search capabilities include

simple string searches and recursive “grep-style” patterns. A

single mouse click invokes the Build Manager. It employs a

professional-strength “makefile” system to automatically analyze

all file dependencies and run the compiler and assembler as

necessary. Project-level options control optimization strategies

used by the compiler and linker. Syntax errors are displayed in a

console window. Double clicking the error message takes you

directly to the offending line of source code. When all is correct,

the linker builds a HEX file image suitable for programming.

Table 2. Acronyms Used (continued)

Acronym

PWM

RAM

Description

pulse width modulator

random access memory

read only memory

ROM

switched capacitor

Units of Measure

A units of measure table is located in the section Electrical

Specifications on page 14. T a ble 8 on page 14 lists all the

abbreviations used to measure the PSoC devices.

Numeric Naming

Hexadecimal numbers are represented with all letters in

uppercase with an appended lowercase ‘h’ (for example, ‘14h’ or

‘3Ah’). Hexadecimal numbers may also be represented by a ‘0x’

prefix, the C coding convention. Binary numbers have an

appended lowercase ‘b’ (for example, 01010100b’ or

‘01000011b’). Numbers not indicated by an ‘h’ or ‘b’ are decimal.

The last step in the development process takes place inside the

PSoC Designer’s Debugger subsystem. The Debugger

downloads the HEX image to the In-Circuit Emulator (ICE) where

it runs at full speed. Debugger capabilities rival those of systems

costing many times more. In addition to traditional single-step,

run-to-breakpoint and watch-variable features, the Debugger

provides a large trace buffer and allows you define complex

breakpoint events that include monitoring address and data bus

values, memory locations and external signals.

Document Conventions

Acronyms Used

The following table lists the acronyms that are used in this

document.

Table 2. Acronyms Used

Acronym

Description

alternating current

ADC

API

analog-to-digital converter

application programming interface

central processing unit

continuous time

CPU

DAC

digital-to-analog converter

direct current

EEPROM electrically erasable programmable read-only

memory

FSR

GPIO

full scale range

general purpose IO

input/output

IPOR

LSb

imprecise power on reset

least-significant bit

low voltage detect

most-significant bit

program counter

LVD

MSb

POR

PPOR

PSoC®

power on reset

precision power on reset

Programmable System-on-Chip™

Document Number: 001-44369 Rev. *B

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Pinouts

The PSoC CY8C23X33 is available in 32-pin QFN and 28-pin SSOP packages. Every port pin (labeled with a “P”), except for Vss and

Vdd in the following table and figure, is capable of Digital IO.

32-Pin Part Pinout

Table 3. Pin Definitions - 32-Pin (QFN)

Type

Figure 5. CY8C23533 32-Pin PSoC Device

No.

Name

Description

Digital Analog

P2[7] GPIO

P2[5] GPIO

P2[3] Direct Switched Capacitor Block Input

GPIO, P2[7]

GPIO, P2[5]

A, I, P2[3]

A, I, P2[1]

AVref, P3[0]

P0[2], A, I

P0[0], A, I

P2[1] Direct Switched Capacitor Block Input

P2[6], Vref

P2[4], AGnd

P2[2], A, I

P2[0], A, I

XRES

[4]

QFN

(Top View)

AVref P3[0] GPIO/ADC Vref (optional)

NC No Connection

I2C SCL, P1[7]

I2C SDA, P1[5]

P1[7] I2C Serial Clock (SCL)

P1[5] I2C Serial Data (SDA)

NC No Connection

17 P1[6], GPIO

P1[3] GPIO

P1[1] GPIO, Crystal Input (XTALin), I2C Serial Clock

(SCL), ISSP-SCLK*

Power

Vss Ground Connection

P1[0] GPIO, Crystal Output (XTALout), I2C Serial Data

(SDA), ISSP-SDATA*

P1[2] GPIO

P1[4] GPIO, External Clock IP

NC No Connection

P1[6] GPIO

Input

XRES Active High External Reset with Internal Pull Down

P2[0] Direct Switched Capacitor Block Input

P2[2] Direct Switched Capacitor Block Input

P2[4] External Analog Ground (AGnd)

P2[6] External Voltage Reference (VRef)

P0[0] Analog Column Mux Input and ADC Input

P0[2] Analog Column Mux Input and ADC Input

NC No Connection

P0[4] Analog Column Mux Input and ADC Input

P0[6] Analog Column Mux Input and ADC Input

Vdd Supply Voltage

Power

P0[7] Analog Column Mux Input and ADC Input

P0[5] Analog Column Mux Input, Column Output and

ADC Input

P0[3] Analog Column Mux Input, Column Output and

ADC Input

P0[1] Analog Column Mux Input.and ADC Input

LEGEND: A = Analog, I = Input, and O = Output.

Note

4. Even though P3[0] is an odd port, it resides on the left side of the pinout.

Document Number: 001-44369 Rev. *B

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28-Pin Part Pinout

Table 4. Pin Definitions - 28-Pin (SSOP)

Figure 6. CY8C23433 28-Pin PSoC Device

Description

AIO, P0[7]

IO, P0[5]

IO, P0[3]

AIO, P0[1]

Vdd

P0[6], AIO, AnColMux and ADC IP

P0[4], AIO, AnColMux and ADC IP

P0[2], AIO, AnColMux and ADC IP

P0[0], AIO, AnColMux and ADC IP

P2[6], VREF

P0[7]

P0[5]

Analog Column Mux IP and ADC IP

IO, P2[7]

IO, P2[5]

IO IO

Analog Column Mux IP and Column

O/P and ADC IP

AIO, P2[3]

P2[4], AGND

P2[2], AIO

P2[0], AIO

SSOP

AIO, P2[1]

AVref, IO, P3[0]

I2C SCL, IO, P1[7]

IO IO

P0[3]

Analog Column Mux IP and Column

O/P and ADC IP

P3[1], IO

I2C SDA, IO, P1[5]

P1[6], IO

IO, P1[3]

I2C SCL,ISSP SCL,XTALin,IO, P1[1]

Vss

P1[4], IO, EXTCLK

P1[2], IO

P0[1]

P2[7]

P2[5]

P2[3]

P2[1]

Analog Column Mux IP and ADC IP

GPIO

P1[0],IO,XTALout,ISSP SDA,I2C SDA

GPIO

Direct Switched Capacitor Input

GPIO/ADC Vref (optional)

[5]

IO AVref

P3[0]

P1[7]

P1[5]

P1[3]

10 IO

11 IO

12 IO

13 IO

I2C SCL

I2C SDA

GPIO

[6]

GPIO, Xtal Input, I2C SCL, ISSP SCL

P1[1]

Vss

14 Power

15 IO

Ground Pin

GPIO, Xtal Output, I2C SDA, ISSP

SDA

P1[0]

16 IO

17 IO

18 IO

19 IO

P1[2]

P1[4]

P1[6]

GPIO

GPIO, External Clock IP

GPIO

[7]

P3[1]

P2[0]

P2[2]

P2[4]

P2[6]

P0[0]

P0[2]

P0[4]

P0[6]

Vdd

20 IO

21 IO

22 IO

23 IO

24 IO

25 IO

26 IO

27 IO

Direct Switched Capacitor Input

External Analog Ground (AGnd)

Analog Voltage Reference (VRef)

Analog Column Mux IP and ADC IP

Supply Voltage

28 Power

LEGEND: A = Analog, I = Input, and O = Output.

Notes

5. Even though P3[0] is an odd port, it resides on the left side of the pinout.

6. ISSP pin, which is not High Z at POR.

7. Even though P3[1] is an even port, it resides on the right side of the pinout.

Document Number: 001-44369 Rev. *B

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The PSoC device has a total register address space of 512

bytes. The register space is referred to as IO space and is

divided into two banks. The XOI bit in the Flag register (CPU_F)

determines which bank the user is currently in. When the XOI bit

is set the user is in Bank 1.

This section lists the registers of the CY8C23433 PSoC device

by using mapping tables, in offset order.

Abbreviations Used

Note In the following register mapping tables, blank fields are

reserved and must not be accessed.

The register conventions specific to this section are listed in the

following table.

Table 5. Abbreviations

Convention

Description

Read register or bits

Write register or bits

Logical register or bits

Clearable register or bits

Access is bit specific

Document Number: 001-44369 Rev. *B

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Table 6. Register Map Bank 0 Table: User Space

PRT0DR

PRT0IE

PRT0GS

PRT0DM2

PRT1DR

PRT1IE

PRT1GS

PRT1DM2

PRT2DR

PRT2IE

PRT2GS

PRT2DM2

PRT3DR

PRT3IE

ASD11CR0

ASD11CR1

ASD11CR2

ASD11CR3

PRT3GS

PRT3DM2

ASC21CR0

ASC21CR1

ASC21CR2

ASC21CR3

I2C_CFG

I2C_SCR

I2C_DR

I2C_MSCR

INT_CLR0

INT_CLR1

INT_CLR3

INT_MSK3

DBB00DR0

DBB00DR1

DBB00DR2

DBB00CR0

DBB01DR0

DBB01DR1

DBB01DR2

DBB01CR0

DCB02DR0

DCB02DR1

DCB02DR2

DCB02CR0

DCB03DR0

DCB03DR1

DCB03DR2

DCB03CR0

AMX_IN

INT_MSK0

INT_MSK1

INT_VC

RES_WDT

DEC_DH

ARF_CR

CMP_CR0

ASY_CR

CMP_CR1

SARADC_DL

DEC_DL

DEC_CR0

DEC_CR1

MUL0_X

SARADC_CR0

SARADC_CR1

MUL0_Y

MUL0_DH

MUL0_DL

ACC0_DR1

ACC0_DR0

ACC0_DR3

ACC0_DR2

TMP_DR0

TMP_DR1

TMP_DR2

TMP_DR3

ACB00CR3

ACB00CR0

ACB00CR1

ACB00CR2

ACB01CR3

ACB01CR0

ACB01CR1 *

ACB01CR2 *

RDI0RI

RDI0SYN

RDI0IS

RDI0LT0

RDI0LT1

RDI0RO0

RDI0RO1

CPU_F

Gray fields are reserved.

# Access is bit specific.

Document Number: 001-44369 Rev. *B

Page 11 of 37

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CY8C23433, CY8C23533

Table 6. Register Map Bank 0 Table: User Space (continued)

CPU_SCR1

CPU_SCR0

Gray fields are reserved.

# Access is bit specific.

Table 7. Register Map Bank 1 Table: Configuration Space

PRT0DM0

PRT0DM1

PRT0IC0

PRT0IC1

PRT1DM0

PRT1DM1

PRT1IC0

PRT1IC1

PRT2DM0

PRT2DM1

PRT2IC0

PRT2IC1

PRT3DM0

PRT3DM1

PRT3IC0

PRT3IC1

ASD11CR0

ASD11CR1

ASD11CR2

ASD11CR3

GDI_O_IN

GDI_E_IN

GDI_O_OU

GDI_E_OU

ASC21CR0

ASC21CR1

ASC21CR2

ASC21CR3

OSC_GO_EN

OSC_CR4

OSC_CR3

OSC_CR0

OSC_CR1

OSC_CR2

VLT_CR

DBB00FN

DBB00IN

DBB00OU

CLK_CR0

CLK_CR1

ABF_CR0

AMD_CR0

DBB01FN

DBB01IN

DBB01OU

VLT_CMP

AMD_CR1

ALT_CR0

DCB02FN

DCB02IN

DCB02OU

SARADC_TRS

SARADC_TRCL

SARADC_TRCH

SARADC_CR2

SARADC_LCR

IMO_TR

ILO_TR

BDG_TR

ECO_TR

DCB03FN

DCB03IN

DCB03OU

TMP_DR0

TMP_DR1

TMP_DR2

TMP_DR3

ACB00CR3

ACB00CR0

ACB00CR1

ACB00CR2

ACB01CR3

RDI0RI

RDI0SYN

RDI0IS

RDI0LT0

RDI0LT1

Gray fields are reserved.

# Access is bit specific.

Document Number: 001-44369 Rev. *B

Page 12 of 37

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CY8C23433, CY8C23533

Table 7. Register Map Bank 1 Table: Configuration Space (continued)

ACB01CR0

ACB01CR1

ACB01CR2 *

RDI0RO0

RDI0RO1

CPU_F

FLS_PR1

CPU_SCR1

CPU_SCR0

Gray fields are reserved.

# Access is bit specific.

Document Number: 001-44369 Rev. *B

Page 13 of 37

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CY8C23433, CY8C23533

Electrical Specifications

This section presents the DC and AC electrical specifications of the CY8C23433 PSoC device. For the latest electrical specifications,

visit http://www.cypress.com/psoc. Specifications are valid for -40°C ≤ T ≤ 85°C and T ≤ 100°C, except where noted. Refer to

T a ble 24 on page 25 for the electrical specifications on the internal main oscillator (IMO) using SLIMO mode.

Figure 7. Voltage versus CPU Frequency

Figure 8. IMO Frequency Trim Options

5.25

4.75

5.25

4.75

SLIMO

Mode=1

SLIMO

Mode=0

3.60

3.00

SLIMO

Mode=0

SLIMO

Mode=1

3.00

93 kHz 3 MHz

CPU Frequency

12 MHz

24 MHz

93 kHz

6 MHz

12 MHz

24 MHz

IMO Frequency

The following table lists the units of measure that are used in this section.

Table 8. Units of Measure

Symbol

°C

Unit of Measure

degree Celsius

Symbol

μW

Unit of Measure

micro watts

decibels

milli-ampere

milli-second

milli-volts

femto farad

hertz

1024 bytes

1024 bits

nano ampere

nanosecond

nanovolts

Kbit

kHz

kΩ

kilohertz

kilohm

ohm

MHz

MΩ

μA

megahertz

megaohm

pico ampere

pico farad

peak-to-peak

micro ampere

micro farad

micro henry

microsecond

micro volts

micro volts root-mean-square

μF

ppm

parts per million

picosecond

μH

μs

sps

samples per second

sigma: one standard deviation

volts

μV

μVrms

Document Number: 001-44369 Rev. *B

Page 14 of 37

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CY8C23433, CY8C23533

Absolute Maximum Ratings

Exceeding maximum ratings may shorten the useful life of the device. User guidelines are not tested.

Table 9. Absolute Maximum Ratings

Symbol

Description

Storage Temperature

Min

Typ

Max

Units

Notes

-55

+100

°C Higher storage temperatures

reduce data retention time.

Recommended storage

STG

temperature is +25°C ± 25°C.

Extended duration storage

temperatures above 65°C

degrade reliability.

Ambient Temperature with Power Applied

Supply Voltage on Vdd Relative to Vss

DC Input Voltage

-40

-0.5

–

+85

+6.0

°C

Vdd

Vss - 0.5

-25

Vdd + 0.5

+50

IOZ

MIO

DC Voltage Applied to Tri-state

Maximum Current into any Port Pin

Electro Static Discharge Voltage

Latch-up Current

ESD

2000

–

Human Body Model ESD.

200

Operating Temperature

Table 10. Operating Temperature

Symbol

Description

Min

-40

Typ

–

Max

+85

Units

Notes

Ambient Temperature

Junction Temperature

°C

–

+100

°C The temperature rise from

ambient to junction is package

specific. See Thermal Imped-

ances by Package on page 35.

The user must limit the power

consumption to comply with this

requirement.

Document Number: 001-44369 Rev. *B

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CY8C23433, CY8C23533

DC Electrical Characteristics

DC Chip-Level Specifications

The following table lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V

and -40°C ≤ T ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ T ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and

are for design guidance only.

Table 11. DC Chip-Level Specifications

Symbol

Description

Min

Typ

Max

Units

Notes

Vdd

Supply Voltage

Supply Current

3.0

–

5.25

See DC POR and LVD

Specifications on page 22.

–

3.3

mA Conditions are Vdd = 5.0V,

T =25°C, CPU=3MHz, SYSCLK

doubler disabled,

VC1 = 1.5 MHz, VC2 = 93.75 kHz,

VC3 = 93.75 kHz,

analog power = off.

SLIMO mode = 0. IMO = 24 MHz.

Supply Current

6.0

6.5

mA Conditions are Vdd = 3.3V,

DD3

T =25°C, CPU=3MHz, SYSCLK

doubler disabled,

VC1 = 1.5 MHz, VC2 = 93.75 kHz,

VC3 = 93.75 kHz, analog power =

off. SLIMO mode = 0.

IMO = 24 MHz.

Sleep (Mode) Current with POR, LVD, Sleep

Timer, and WDT.

μA Conditions are with internal slow

[8]

speed oscillator, Vdd = 3.3V,

-40°C ≤ T ≤ 55°C,

analog power = off.

Sleep (Mode) Current with POR, LVD, Sleep

Timer, and WDT at high temperature.

–

μA Conditions are with internal slow

SBH

[8]

speed oscillator, Vdd = 3.3V, 55°C

< T ≤ 85°C, analog power = off.

Sleep (Mode) Current with POR, LVD, Sleep

7.5

μA Conditions are with properly

SBXTL

[8]

Timer, WDT, and external crystal.

loaded, 1 μW max, 32.768 kHz

crystal. Vdd = 3.3V, -40°C ≤ T ≤

55°C, analog power = off.

Sleep (Mode) Current with POR, LVD, Sleep

Timer, WDT, and external crystal at high

temperature.

–

μA Conditions are with properly

SBXTLH

loaded, 1μW max, 32.768 kHz

[8]

crystal. Vdd = 3.3 V, 55°C < T ≤

85°C, analog power = off.

Reference Voltage (Bandgap)

1.28

1.30

1.33

Trimmed for appropriate Vdd.

Vdd > 3.0V

REF

Note

8. Standby current includes all functions (POR, LVD, WDT, Sleep Time) needed for reliable system operation. This must be compared with devices that have similar

functions enabled.

Document Number: 001-44369 Rev. *B

Page 16 of 37

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CY8C23433, CY8C23533

DC General Purpose IO Specifications

The following table lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V

and -40°C ≤ T ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ T ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and

are for design guidance only.

Table 12. 5V and 3.3V DC GPIO Specifications

Symbol

Description

Min

Typ

5.6

–

Max

Units

kΩ

Notes

Pull up Resistor

–

Pull down Resistor

High Output Level

kΩ

Vdd - 1.0

IOH = 10 mA, Vdd = 4.75 to

5.25V(maximum40mAoneven

port pins (for example, P0[2],

P1[4]), maximum 40 mA on odd

port pins (for example, P0[3],

P1[5])). 80 mA maximum

combined IOH budget.

Low Output Level

–

0.75

0.8

IOL = 25 mA, Vdd = 4.75 to

5.25V (maximum 100 mA on

even port pins (for example,

P0[2], P1[4]), maximum 100 mA

on odd port pins (for example,

P0[3],P1[5])).100mAmaximum

combined IOH budget.

Input Low Level

–

2.1

–

Vdd = 3.0 to 5.25

Input High Level

Input Hysterisis

–

Input Leakage (Absolute Value)

Capacitive Load on Pins as Input

–

nA Gross tested to 1 μA

–

3.5

pF Package and pin dependent.

Temp = 25°C

Capacitive Load on Pins as Output

–

3.5

pF Package and pin dependent.

Temp = 25°C

OUT

Document Number: 001-44369 Rev. *B

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CY8C23433, CY8C23533

DC Operational Amplifier Specifications

The following table lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V

and -40°C ≤ T ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ T ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and

are for design guidance only.

The Operational Amplifier is a component of both the Analog Continuous Time PSoC blocks and the Analog Switched Cap PSoC

blocks. The guaranteed specifications are measured in the Analog Continuous Time PSoC block. Typical parameters apply to 5V at

25°C and are for design guidance only.

Table 13. 5V DC Operational Amplifier Specifications

Symbol

Description

Min

Typ

Max

Units

Notes

Input Offset Voltage (absolute value)

Power = Low, Opamp Bias = High

Power = Medium, Opamp Bias = High

Power = High, Opamp Bias = High

OSOA

–

1.6

1.3

1.2

7.5

TCV

Average Input Offset Voltage Drift

–

7.0

35.0

–

μV/°C

OSOA

Input Leakage Current (Port 0 Analog Pins)

Input Capacitance (Port 0 Analog Pins)

pA Gross tested to 1 μA

EBOA

4.5

9.5

pF Package and pin dependent.

Temp = 25°C

INOA

Common Mode Voltage Range

Common Mode Voltage Range (high power or high

opamp bias)

0.0

0.5

–

Vdd

Vdd - 0.5

The common-mode input

voltage range is measured

through an analog output

buffer. The specification

includes the limitations

imposed by the character-

istics of the analog output

buffer.

CMOA

Open Loop Gain

–

dB Specification is applicable at

high power. For all other bias

modes (except high power,

highopampbias), minimumis

60 dB.

OLOA

Power = Low, Opamp Bias = High

Power = Medium, Opamp Bias = High

Power = High, Opamp Bias = High

High Output Voltage Swing (internal signals)

Power = Low, Opamp Bias = High

Power = Medium, Opamp Bias = High

Power = High, Opamp Bias = High

OHIGHOA

OLOWOA

SOA

Vdd - 0.2

Vdd - 0.5

–

Low Output Voltage Swing (internal signals)

Power = Low, Opamp Bias = High

Power = Medium, Opamp Bias = High

Power = High, Opamp Bias = High

–

0.2

0.5

Supply Current (including associated AGND buffer)

Power = Low, Opamp Bias = High

Power = Medium, Opamp Bias = Low

Power = Medium, Opamp Bias = High

Power = High, Opamp Bias = Low

–

300

600

1200

2400

4600

400

800

1600

3200

6400

μA

Power = High, Opamp Bias = High

PSRR

Supply Voltage Rejection Ratio

–

dB Vss ≤ VIN ≤ (Vdd - 2.25) or

(Vdd - 1.25V) ≤ VIN ≤ Vdd

Document Number: 001-44369 Rev. *B

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CY8C23433, CY8C23533

Table 14. 3.3V DC Operational Amplifier Specifications

Symbol

Description

Min

Typ

Max

Units

Notes

Input Offset Voltage (absolute value)

Power = Low, Opamp Bias = High

Power = Medium, Opamp Bias = High

High Power is 5 Volts Only

OSOA

–

1.65

1.32

TCV

Average Input Offset Voltage Drift

–

7.0

35.0

–

μV/°C

OSOA

Input Leakage Current (Port 0 Analog Pins)

Input Capacitance (Port 0 Analog Pins)

pA Gross tested to 1 μA.

EBOA

4.5

9.5

pF Package and pin dependent.

Temp = 25°C

INOA

Common Mode Voltage Range

0.2

–

Vdd - 0.2

The common-mode input

voltage range is measured

through an analog output

buffer. The specification

includes the limitations

imposed by the character-

istics of the analog output

buffer.

CMOA

Open Loop Gain

–

dB Specification is applicable at

high power. For all other bias

modes (except high power,

high opamp bias), minimum is

60 dB.

OLOA

Power = Low, Opamp Bias = Low

Power = Medium, Opamp Bias = Low

Power = High, Opamp Bias = Low

High Output Voltage Swing (internal signals)

Power = Low, Opamp Bias = Low

Power = Medium, Opamp Bias = Low

Power = High is 5V only

OHIGHOA

OLOWOA

SOA

Vdd - 0.2

–

Low Output Voltage Swing (internal signals)

Power = Low, Opamp Bias = Low

Power = Medium, Opamp Bias = Low

Power = High, Opamp Bias = Low

–

0.2

Supply Current (including associated AGND buffer)

Power = Low, Opamp Bias = High

Power = Medium, Opamp Bias = Low

Power = Medium, Opamp Bias = High

Power = High, Opamp Bias = Low

–

300

600

1200

2400

4600

400

800

1600

3200

6400

μA

Power = High, Opamp Bias = High

PSRR

Supply Voltage Rejection Ratio

–

dB Vss ≤ VIN ≤ (Vdd - 2.25) or

(Vdd - 1.25V) ≤ VIN ≤ Vdd

DC Low Power Comparator Specifications

The following table lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V

and -40°C ≤ T ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ T ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and

are for design guidance only.

Table 15. DC Low Power Comparator Specifications

Symbol

Description

Min

Typ

Max

Units

Low power comparator (LPC) reference voltage

range

0.2

–

Vdd - 1

REFLPC

LPC supply current

LPC voltage offset

–

μA

SLPC

2.5

OSLPC

Document Number: 001-44369 Rev. *B

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CY8C23433, CY8C23533

DC Analog Output Buffer Specifications

The following table lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V

and -40°C ≤ T ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ T ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and

are for design guidance only.

Table 16. 5V DC Analog Output Buffer Specifications

Symbol

Description

Input Offset Voltage (Absolute Value)

Average Input Offset Voltage Drift

Common-Mode Input Voltage Range

Min

–

Typ

Max

Units

Notes

OSOB

TCV

–

μV/°C

OSOB

CMOB

0.5

Vdd - 1.0

Output Resistance

Power = Low

Power = High

OUTOB

–

High Output Voltage Swing (Load = 32 ohms to Vdd/2)

Power = Low

Power = High

OHIGHOB

OLOWOB

SOB

0.5 x Vdd+ 1.1

–

Low Output Voltage Swing (Load = 32 ohms to Vdd/2)

Power = Low

Power = High

–

0.5 x Vdd - 1.3

Supply Current Including Bias Cell (No Load)

Power = Low

Power = High

–

1.1

2.6

5.1

8.8

PSRR

Supply Voltage Rejection Ratio

–

>(Vdd - 1.25)

OUT

Table 17. 3.3V DC Analog Output Buffer Specifications

Symbol

Description

Input Offset Voltage (Absolute Value)

Average Input Offset Voltage Drift

Common-Mode Input Voltage Range

Min

–

Typ

Max

Units

Notes

OSOB

TCV

–

μV/°C

OSOB

CMOB

0.5

Vdd - 1.0

Output Resistance

Power = Low

Power = High

OUTOB

–

High Output Voltage Swing (Load = 1k ohms to Vdd/2)

Power = Low

Power = High

OHIGHOB

OLOWOB

SOB

0.5 x Vdd + 1.0

–

Low Output Voltage Swing (Load = 1k ohms to Vdd/2)

Power = Low

Power = High

–

0.5 x Vdd - 1.0

Supply Current Including Bias Cell (No Load)

Power = Low

Power = High

0.8

2.0

4.3

–

PSRR

Supply Voltage Rejection Ratio

–

> (Vdd - 1.25)

OUT

Document Number: 001-44369 Rev. *B

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DC Analog Reference Specifications

The following table lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V

and -40°C ≤ T ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ T ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and

are for design guidance only.

The guaranteed specifications are measured through the Analog Continuous Time PSoC blocks. The power levels for AGND refer to

the power of the Analog Continuous Time PSoC block. The power levels for RefHi and RefLo refer to the Analog Reference Control

register. The limits stated for AGND include the offset error of the AGND buffer local to the Analog Continuous Time PSoC block.

Reference control power is high.

Table 18. 5V DC Analog Reference Specifications

Symbol

Description

Bandgap Voltage Reference

AGND = Vdd/2

Min

1.28

Typ

1.30

Max

1.33

Units

–

Vdd/2 - 0.04

2 x BG - 0.048

P2[4] - 0.011

BG - 0.009

1.6 x BG - 0.022

-0.034

Vdd/2 - 0.01

2 x BG - 0.030

P2[4]

Vdd/2 + 0.007

2 x BG + 0.024

P2[4] + 0.011

BG + 0.016

1.6 x BG + 0.018

0.034

–

AGND = 2 x BandGap

AGND = P2[4] (P2[4] = Vdd/2)

AGND = BandGap

–

BG + 0.008

1.6 x BG - 0.010

0.000

–

AGND = 1.6 x BandGap

–

AGND Block to Block Variation

(AGND = Vdd/2)

–

RefHi = Vdd/2 + BandGap

RefHi = 3 x BandGap

Vdd/2 + BG - 0.10

3 x BG - 0.06

Vdd/2 + BG

3 x BG

Vdd/2 + BG + 0.10

3 x BG + 0.06

RefHi = 2 x BandGap + P2[6]

(P2[6] = 1.3V)

2 x BG + P2[6] - 0.113 2 x BG + P2[6] - 0.018 2 x BG + P2[6] + 0.077

–

RefHi = P2[4] + BandGap (P2[4] = Vdd/2) P2[4] + BG - 0.130

P2[4] + BG - 0.016

P2[4] + BG + 0.098

RefHi = P2[4] + P2[6] (P2[4] = Vdd/2,

P2[6] = 1.3V)

P2[4] + P2[6] - 0.133 P2[4] + P2[6] - 0.016 P2[4] + P2[6]+ 0.100

–

RefHi = 3.2 x BandGap

RefLo = Vdd/2 – BandGap

RefLo = BandGap

3.2 x BG - 0.112

Vdd/2 - BG - 0.04

BG - 0.06

3.2 x BG

Vdd/2 - BG + 0.024

3.2 x BG + 0.076

Vdd/2 - BG + 0.04

BG + 0.06

RefLo = 2 x BandGap - P2[6]

(P2[6] = 1.3V)

2 x BG - P2[6] - 0.084 2 x BG - P2[6] + 0.025 2 x BG - P2[6] + 0.134

P2[4] - BG - 0.056 P2[4] - BG + 0.026 P2[4] - BG + 0.107

P2[4] - P2[6] - 0.057 P2[4] - P2[6] + 0.026 P2[4] - P2[6] + 0.110

–

RefLo = P2[4] – BandGap

(P2[4] = Vdd/2)

RefLo = P2[4]-P2[6] (P2[4] = Vdd/2,

P2[6] = 1.3V)

Table 19. 3.3V DC Analog Reference Specifications

Symbol

Description

Bandgap Voltage Reference

AGND = Vdd/2

Min

1.28

Typ

1.30

Max

1.33

Units

–

Vdd/2 - 0.03

Vdd/2 - 0.01

Vdd/2 + 0.005

–

AGND = 2 x BandGap

AGND = P2[4] (P2[4] = Vdd/2)

AGND = BandGap

Not Allowed

–

P2[4] - 0.008

BG - 0.009

P2[4] + 0.001

BG + 0.005

1.6 x BG - 0.010

0.000

P2[4] + 0.009

BG + 0.015

1.6 x BG + 0.018

0.034

–

AGND = 1.6 x BandGap

1.6 x BG - 0.027

-0.034

–

AGND Column to Column Variation

(AGND = Vdd/2)

–

RefHi = Vdd/2 + BandGap

RefHi = 3 x BandGap

Not Allowed

Document Number: 001-44369 Rev. *B

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CY8C23433, CY8C23533

Table 19. 3.3V DC Analog Reference Specifications (continued)

Symbol

Description

Min

Typ

Max

Units

–

RefHi = 2 x BandGap + P2[6]

(P2[6] = 0.5V)

Not Allowed

–

RefHi = P2[4] + BandGap (P2[4] = Vdd/2)

Not Allowed

RefHi = P2[4] + P2[6] (P2[4] = Vdd/2,

P2[6] = 0.5V)

P2[4] + P2[6] - 0.075 P2[4] + P2[6] - 0.009 P2[4] + P2[6] + 0.057

–

RefHi = 3.2 x BandGap

RefLo = Vdd/2 - BandGap

RefLo = BandGap

Not Allowed

RefLo = 2 x BandGap - P2[6] (P2[6] =

0.5V)

–

RefLo = P2[4] – BandGap (P2[4] = Vdd/2)

Not Allowed

RefLo = P2[4]-P2[6] (P2[4] = Vdd/2, P2[6] P2[4] - P2[6] - 0.048

= 0.5V)

P2[4]- P2[6] + 0.022 P2[4] - P2[6] + 0.092

DC Analog PSoC Block Specifications

The following table lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V

and -40°C ≤ T ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ T ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and

are for design guidance only.

Table 20. DC Analog PSoC Block Specifications

Symbol

Description

Min

–

Typ

Max

–

Units

kΩ

Resistor Unit Value (Continuous Time)

Capacitor Unit Value (Switch Cap)

12.2

[9]

–

DC POR and LVD Specifications

The following table lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V

and -40°C ≤ T ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ T ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and

are for design guidance only.

Note The bits PORLEV and VM in the following table refer to bits in the VLT_CR register. See the PSoC Mixed-Signal Array Technical

Reference Manual for more information on the VLT_CR register.

Table 21. DC POR and LVD Specifications

Symbol

Description

Vdd Value for PPOR Trip

PORLEV[1:0] = 01b

PORLEV[1:0] = 10b

Min

Typ

Max

Units

Notes

Vdd must be greater than or equal

to 2.5V during startup or reset from

Watchdog.

–

2.82

4.55

2.95

4.70

PPOR1

PPOR2

Vdd Value for LVD Trip

VM[2:0] = 001b

VM[2:0] = 010b

VM[2:0] = 011b

VM[2:0] = 100b

VM[2:0] = 101b

VM[2:0] = 110b

VM[2:0] = 111b

[10]

2.85

2.95

3.06

4.37

4.50

4.62

4.71

2.92

3.02

3.13

4.48

4.64

4.73

4.81

2.99

LVD1

LVD2

LVD3

LVD4

LVD5

LVD6

LVD7

3.09

3.20

4.55

4.75

4.83

4.95

Notes

is a design guarantee parameter, not tested value

10. Always greater than 50 mV above V

(PORLEV=01) for falling supply.

PPOR

Document Number: 001-44369 Rev. *B

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DC Programming Specifications

The following table lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V

and -40°C ≤ T ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ T ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and

are for design guidance only.

Table 22. DC Programming Specifications

Symbol

Vdd

Description

Min

2.7

–

Typ

–

Max

–

Units

Notes

Supply Voltage for Flash Write Operations

Supply Current During Programming or Verify

IWRITE

DDP

Input Low Voltage During Programming or

Verify

–

0.8

ILP

Input High Voltage During Programming or

Verify

2.1

–

0.2

IHP

Input Current when Applying Vilp to P1[0] or

P1[1] During Programming or Verify

–

mA Driving internal pull down

resistor

ILP

Input Current when Applying Vihp to P1[0] or

P1[1] During Programming or Verify

–

1.5

mA Driving internal pull down

resistor

IHP

Output Low Voltage During Programming or

Verify

Vss + 0.75

Vdd

OLV

Output High Voltage During Programming or

Verify

Vdd - 1.0

OHV

Flash

Flash Endurance (per block)

50,000

–

Erase/write cycles per block

Erase/write cycles

ENPB

[11]

1,800,000

Flash Endurance (total)

ENT

Flash

Flash Data Retention

–

Years

Note

11. A maximum of 36 x 50,000 block endurance cycles is allowed. This may be balanced between operations on 36x1 blocks of 50,000 maximum cycles each, 36x2 blocks

of 25,000 maximum cycles each, or 36x4 blocks of 12,500 maximum cycles each (to limit the total number of cycles to 36x50,000 and that no single block ever sees

more than 50,000 cycles).

For the full industrial range, the user must employ a temperature sensor user module (Flash T e mp) and feed the result to the temperature argument before writing.

Refer to 0xthe Flash APIs Application Note AN2015 at http://www.cypress.com under Application Notes for more information.

Document Number: 001-44369 Rev. *B

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SAR8 ADC DC Specifications

The following table lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V

and -40°C ≤ T ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ T ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and

are for design guidance only.

Table 23. SAR8 ADC DC Specifications

Symbol

Description

Min

Typ

Max

Units

Notes

Reference voltageatpin P3[0] when configured

as ADC reference voltage

3.0

–

5.25

The voltage level at P3[0]

(when configured as ADC

reference voltage) must

always be maintained to be

less than chip supply voltage

level on Vdd pin.

ADCVREF

< Vdd.

ADCVREF

Current when P3[0] is configured as ADC V

Integral Non-linearity

–

ADCVREF

REF

INL

-1.5

+1.5

+1.2

LSB

[12]

INL

(limited

Integral Non-linearity accommodating a shift in

the offset at 0x80

LSB The maximum LSB is over a

sub-range not exceeding

1/16 of the full-scale range.

0x7F and 0x80 points specs

are excluded here

-1.2

range)

DNL

Differential Non-linearity

-2.3

-1

–

+2.3

LSB ADC conversion is

monotonic over full range

DNL

(limited

range)

Differential Non-linearity excluding 0x7F-0x80

transition

LSB ADC conversion is

monotonic over full range.

0x7Fto0x80transitionspecs

are excluded here.

Notes

12. SAR converters require a stable input voltage during the sampling period. If the voltage into the SAR8 changes by more than 1 LSB during the sampling period then

the accuracy specifications may not be met

Document Number: 001-44369 Rev. *B

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AC Electrical Characteristics

AC Chip-Level Specifications

The following table lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V

and -40°C ≤ T ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ T ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and

are for design guidance only.

Table 24. 5V and 3.3V AC Chip-Level Specifications

Symbol

Description

Min

Typ

Max

Units

Notes

[13],[14],[15]

Internal Main Oscillator Frequency for 24

MHz

23.4

MHz Trimmed for 5V or 3.3V

operation using factory trim

values. Se e Figure 8 on page 14.

SLIMO mode = 0.

IMO24

24.6

[13],[14],[15]

Internal Main Oscillator Frequency for 6 MHz

5.75

MHz Trimmed for 5V or 3.3V

operation using factory trim

values. Se e Figure 8 on page 14.

SLIMO mode = 1.

IMO6

6.35

[13],[14]

CPU Frequency (5V Nominal)

CPU Frequency (3.3V Nominal)

Digital PSoC Block Frequency

0.093

MHz

CPU1

CPU2

48M

24.6

[13],[14]

12.3

[13],[14],[16]

MHz Refer to the AC Digital Block

Specifications.

49.2

[14],[16]

Digital PSoC Block Frequency

MHz

kHz

24M

24.6

Internal Low Speed Oscillator Frequency

External Crystal Oscillator

–

32K1

32.768

kHz Accuracyiscapacitorandcrystal

dependent. 50% duty cycle.

32K2

PLL Frequency

–

23.986

–

MHz Is a multiple (x732) of crystal

frequency.

PLL

Jitter24M2

24 MHz Period Jitter (PLL)

–

0.5

–

600

PLL Lock Time

PLLSLEW

PLLSLEWSLOW

PLL Lock Time for Low Gain Setting

External Crystal Oscillator Startup to 1%

External Crystal Oscillator Startup to 100 ppm

–

1700

2800

2620

3800

–

ms The crystal oscillator frequency

iswithin100ppmofits finalvalue

OSACC

by the end of the T

period.

osacc

Correct operation assumes a

properly loaded 1 uW maximum

drive level 32.768 kHz crystal.

3.0V ≤ Vdd ≤ 5.5V, -40 °C ≤ T ≤

85°C.

Jitter32k

32 kHz Period Jitter

–

100

–

μs

External Reset Pulse Width

24 MHz Duty Cycle

–

XRST

DC24M

Step24M

Fout48M

24 MHz Trim Step Size

48 MHz Output Frequency

kHz

[13],[15]

46.8

48.0

MHz Trimmed. Using factory trim

values.

49.2

Jitter24M1R

24 MHz Period Jitter (IMO) Root Mean

Squared

–

600

12.3

–

MHz

μs

Maximum frequency of signal on row input or

row output.

MAX

Supply Ramp Time

RAMP

Notes

13. 4.75V < Vdd < 5.25V.

14. Accuracy derived from Internal Main Oscillator with appropriate trim for Vdd range.

15. 3.0V < Vdd < 3.6V. See Application Note AN2012 “Adjusting PSoC Microcontroller Trims for Dual Voltage-Range Operation” for information on trimming for operation

at 3.3V.

16. See the individual user module data sheets for information on maximum frequencies for user modules.

Document Number: 001-44369 Rev. *B

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Figure 9. PLL Lock Timing Diagram

PLL

Enable

24 MHz

PLLSLEW

F_PLL

PLL

Gain

Figure 10. PLL Lock for Low Gain Setting Timing Diagram

PLL

Enable

24 MHz

PLLSLEWLOW

F_PLL

PLL

Gain

Figure 11. External Crystal Oscillator Startup Timing Diagram

32K

Select

32 kHz

F_32K2

Figure 12. 24 MHz Period Jitter (IMO) Timing Diagram

Jitter24M1

F_24M

Figure 13. 32 kHz Period Jitter (ECO) Timing Diagram

Jitter32k

F_32K2

Document Number: 001-44369 Rev. *B

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AC General Purpose IO Specifications

The following table lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V

and -40°C ≤ T ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ T ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and

are for design guidance only.

Table 25. 5V and 3.3V AC GPIO Specifications

Symbol

Description

Min

Typ

–

Max

12.3

–

Units

Notes

GPIO Operating Frequency

MHz Normal Strong Mode

GPIO

TRiseF

Rise Time, Normal Strong Mode, Cload = 50 pF

Fall Time, Normal Strong Mode, Cload = 50 pF

Rise Time, Slow Strong Mode, Cload = 50 pF

Fall Time, Slow Strong Mode, Cload = 50 pF

–

Vdd = 4.5 to 5.25V, 10% - 90%

TFallF

TRiseS

TFallS

–

Vdd = 4.5 to 5.25V, 10% - 90%

Vdd = 3 to 5.25V, 10% - 90%

–

Figure 14. GPIO Timing Diagram

90%

GPIO

Output

Voltage

10%

TRiseF

TRiseS

TFallF

TFallS

AC Operational Amplifier Specifications

The following table lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V

and -40°C ≤ T ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ T ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and

are for design guidance only.

Settling times, slew rates, and gain bandwidth are based on the Analog Continuous Time PSoC block.

Power = High and Opamp Bias = High is not supported at 3.3V.

Table 26. 5V AC Operational Amplifier Specifications

Symbol

Description

Min

Typ

Max

Units

Rising Settling Time from 80% of ΔV to 0.1% of ΔV (10 pF load, Unity Gain)

Power = Low, Opamp Bias = Low

Power = Medium, Opamp Bias = High

ROA

–

3.9

0.72

0.62

μs

Power = High, Opamp Bias = High

Falling Settling Time from 20% of ΔV to 0.1% of ΔV (10 pF load, Unity Gain)

Power = Low, Opamp Bias = Low

Power = Medium, Opamp Bias = High

SOA

–

5.9

0.92

0.72

μs

Power = High, Opamp Bias = High

Rising Slew Rate (20% to 80%)(10 pF load, Unity Gain)

Power = Low, Opamp Bias = Low

Power = Medium, Opamp Bias = High

Power = High, Opamp Bias = High

ROA

0.15

1.7

6.5

–

V/μs

Falling Slew Rate (20% to 80%)(10 pF load, Unity Gain)

Power = Low, Opamp Bias = Low

Power = Medium, Opamp Bias = High

Power = High, Opamp Bias = High

FOA

0.01

0.5

4.0

–

V/μs

Gain Bandwidth Product

Power = Low, Opamp Bias = Low

Power = Medium, Opamp Bias = High

Power = High, Opamp Bias = High

0.75

3.1

5.4

–

MHz

Document Number: 001-44369 Rev. *B

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Table 27. 3.3V AC Operational Amplifier Specifications

Symbol

Description

Min

Typ

Max

Units

Rising Settling Time from 80% of ΔV to 0.1% of ΔV (10 pF load, Unity Gain)

Power = Low, Opamp Bias = Low

Power = Medium, Opamp Bias = High

ROA

–

3.92

0.72

μs

Falling Settling Time from 20% of ΔV to 0.1% of ΔV (10 pF load, Unity Gain)

Power = Low, Opamp Bias = Low

Power = Medium, Opamp Bias = High

SOA

–

5.41

0.72

μs

Rising Slew Rate (20% to 80%)(10 pF load, Unity Gain)

Power = Low, Opamp Bias = Low

Power = Medium, Opamp Bias = High

ROA

0.31

2.7

–

V/μs

Falling Slew Rate (20% to 80%)(10 pF load, Unity Gain)

Power = Low, Opamp Bias = Low

Power = Medium, Opamp Bias = High

FOA

0.24

1.8

–

V/μs

Gain Bandwidth Product

Power = Low, Opamp Bias = Low

Power = Medium, Opamp Bias = High

0.67

2.8

–

MHz

Document Number: 001-44369 Rev. *B

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When bypassed by a capacitor on P2[4], the noise of the analog ground signal distributed to each block is reduced by a factor of up

to 5 (14 dB). This is at frequencies above the corner frequency defined by the on-chip 8.1k resistance and the external capacitor.

Figure 15. Typical AGND Noise with P2[4] Bypass

dBV/rtHz

10000

0.01

0.1

1.0

1000

100

0.001

0.01

0.1 Freq (kHz)

100

At low frequencies, the opamp noise is proportional to 1/f, power independent, and determined by device geometry. At high

frequencies, increased power level reduces the noise spectrum level.

Figure 16. Typical Opamp Noise

nV/rtHz

10000

PH_BH

PH_BL

PM_BL

PL_BL

1000

100

0.001

0.01

0.1

100

Freq (kHz)

Document Number: 001-44369 Rev. *B

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AC Low Power Comparator Specifications

The following table lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V

and -40°C ≤ T ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ T ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and

are for design guidance only.

Table 28. AC Low Power Comparator Specifications

Symbol Description

LPC response time

Min

Typ

Max

Units

Notes

–

μs

≥ 50 mV overdrive comparator

RLPC

reference set within V

REFLPC

AC Digital Block Specifications

The following table lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V

and -40°C ≤ T ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ T ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and

are for design guidance only.

Table 29. 5V and 3.3V AC Digital Block Specifications

Symbol Description

Timer Capture Pulse Width

Min

Typ

Max

Units

Notes

[17]

–

Maximum Frequency, No Capture

Maximum Frequency, With Capture

Enable Pulse Width

–

49.2

24.6

–

MHz 4.75V < Vdd < 5.25V

MHz

[17]

Counter

Maximum Frequency, No Enable Input

Maximum Frequency, Enable Input

–

49.2

24.6

MHz 4.75V < Vdd < 5.25V

MHz

Dead Band Kill Pulse Width:

Asynchronous Restart Mode

–

[17]

Synchronous Restart Mode

Disable Mode

[17]

–

Maximum Frequency

–

49.2

MHz 4.75V < Vdd < 5.25V

CRCPRS

(PRS

Mode)

Maximum Input Clock Frequency

–

CRCPRS

(CRC

Mode)

Maximum Input Clock Frequency

–

24.6

8.2

MHz

SPIM

Maximum Input Clock Frequency

–

MHz Maximum data rate at 4.1 MHz due

to 2 x over clocking.

SPIS

–

4.1

–

MHz

[17]

Width of SS_ Negated Between

Transmissions

Transmitter Maximum Input Clock Frequency

–

24.6

49.2

MHz Maximum data rate at 3.08 MHz due

to 8 x over clocking.

MHz Maximum data rate at 6.15 MHz due

to 8 x over clocking.

Maximum Input Clock Frequency with Vdd ≥

4.75V, 2 Stop Bits

Receiver

Maximum Input Clock Frequency

–

24.6

49.2

MHz Maximum data rate at 3.08 MHz due

to 8 x over clocking.

MHz Maximum data rate at 6.15 MHzdue

to 8 x over clocking.

Maximum Input Clock Frequency with Vdd ≥

4.75V, 2 Stop Bits

Note

17. 50 ns minimum input pulse width is based on the input synchronizers running at 24 MHz (42 ns nominal period).

Document Number: 001-44369 Rev. *B

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AC Analog Output Buffer Specifications

The following table lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V

and -40°C ≤ T ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ T ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and

are for design guidance only.

Table 30. 5V AC Analog Output Buffer Specifications

Symbol

Description

Min

Typ

Max

Units

Rising Settling Time to 0.1%, 1V Step, 100 pF Load

Power = Low

Power = High

ROB

–

2.5

μs

Falling Settling Time to 0.1%, 1V Step, 100 pF Load

Power = Low

Power = High

SOB

–

2.2

μs

Rising Slew Rate (20% to 80%), 1V Step, 100 pF Load

Power = Low

Power = High

ROB

0.65

–

V/μs

Falling Slew Rate (80% to 20%), 1V Step, 100 pF Load

Power = Low

Power = High

FOB

0.65

–

V/μs

Small Signal Bandwidth, 20mV , 3 dB BW, 100 pF Load

Power = Low

Power = High

0.8

–

MHz

Large Signal Bandwidth, 1V , 3 dB BW, 100 pF Load

Power = Low

Power = High

300

–

kHz

Table 31. 3.3V AC Analog Output Buffer Specifications

Symbol

Description

Min

Typ

Max

Units

Rising Settling Time to 0.1%, 1V Step, 100 pF Load

Power = Low

Power = High

ROB

–

3.8

μs

Falling Settling Time to 0.1%, 1V Step, 100 pF Load

Power = Low

Power = High

SOB

–

2.6

μs

Rising Slew Rate (20% to 80%), 1V Step, 100 pF Load

Power = Low

Power = High

ROB

FOB

0.5

–

V/μs

Falling Slew Rate (80% to 20%), 1V Step, 100 pF Load

Power = Low

Power = High

0.5

–

V/μs

Small Signal Bandwidth, 20mV , 3 dB BW, 100 pF Load

Power = Low

Power = High

0.7

–

MHz

Large Signal Bandwidth, 1V , 3 dB BW, 100 pF Load

Power = Low

Power = High

200

–

kHz

Document Number: 001-44369 Rev. *B

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AC External Clock Specifications

The following table lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V

and -40°C ≤ T ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ T ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and

are for design guidance only.

Table 32. 5V AC External Clock Specifications

Symbol

Description

Min

0.093

20.6

150

Typ

–

Max

24.6

5300

–

Units

MHz

–

Frequency

OSCEXT

High Period

–

Low Period

–

Power Up IMO to Switch

–

μs

Table 33. 3.3V AC External Clock Specifications

Symbol

OSCEXT

Description

Min

Typ

Max

Units

[18]

0.093

–

12.3

MHz

Frequency with CPU Clock divide by 1

[19]

0.186

–

24.6

MHz

Frequency with CPU Clock divide by 2 or greater

High Period with CPU Clock divide by 1

Low Period with CPU Clock divide by 1

Power Up IMO to Switch

–

41.7

150

–

5300

μs

–

AC Programming Specifications

The following table lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V

and -40°C ≤ T ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ T ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and

are for design guidance only.

Table 34. AC Programming Specifications

Symbol

Description

Min

Typ

–

Max Units

Notes

Rise Time of SCLK

Fall Time of SCLK

–

RSCLK

FSCLK

SSCLK

HSCLK

SCLK

–

Data Set up Time to Falling Edge of SCLK

Data Hold Time from Falling Edge of SCLK

Frequency of SCLK

–

MHz

Flash Erase Time (Block)

–

ERASEB

WRITE

DSCLK

DSCLK3

Flash Block Write Time

–

Data Out Delay from Falling Edge of SCLK

–

ns Vdd > 3.6

–

ns 3.0 ≤ Vdd ≤ 3.6

SAR8 ADC AC Specifications

The following table lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V

and -40°C ≤ T ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ T ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and

are for design guidance only.

Table 35. SAR8 ADC AC Specifications^[20]

Symbol

Description

Min

–

Typ

–

Max

3.075

Units

MHz

Freq

Input clock frequency 3V

Input clock frequency 5V

Freq

–

Notes

18. Maximum CPU frequency is 12 MHz at 3.3V. With the CPU clock divider set to 1, the external clock must adhere to the maximum frequency and duty cycle requirements.

19. If the frequency of the external clock is greater than 12 MHz, the CPU clock divider must be set to 2 or greater. In this case, the CPU clock divider ensures that the

fifty percent duty cycle requirement is met.

20. The max sample rate in this R2R ADC is 3.0/8=375KSPS

Document Number: 001-44369 Rev. *B

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AC I C Specifications

The following table lists the guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to

5.25V and -40°C ≤ T ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ T ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C

and are for design guidance only.

Table 36. AC Characteristics of the I C SDA and SCL Pins for Vdd > 3.0V

Standard Mode

Fast Mode

Symbol

Description

Units

Min

Max

100

–

Min

Max

400

–

SCL Clock Frequency

kHz

SCLI2C

Hold Time (repeated) START Condition. After this period, the

first clock pulse is generated.

4.0

0.6

μs

HDSTAI2C

LOW Period of the SCL Clock

HIGH Period of the SCL Clock

Setup Time for a Repeated START Condition

Data Hold Time

4.7

4.0

4.7

–

1.3

0.6

–

μs

LOWI2C

HIGHI2C

SUSTAI2C

HDDATI2C

SUDATI2C

[21]

Data Setup Time

250

100

Setup Time for STOP Condition

4.0

4.7

–

0.6

1.3

–

μs

SUSTOI2C

BUFI2C

SPI2C

Bus Free Time Between a STOP and START Condition

Pulse Width of spikes are suppressed by the input filter.

Table 37. AC Characteristics of the I C SDA and SCL Pins for Vdd < 3.0V (Fast Mode Not Supported)

Standard Mode

Fast Mode

Symbol

Description

Units

Min

Max

100

–

Min

–

Max

–

SCL Clock Frequency

kHz

SCLI2C

Hold Time (repeated) START Condition. After this period, the

first clock pulse is generated.

4.0

–

μs

HDSTAI2C

LOW Period of the SCL Clock

4.7

4.0

4.7

–

μs

LOWI2C

HIGH Period of the SCL Clock

HIGHI2C

SUSTAI2C

HDDATI2C

SUDATI2C

SUSTOI2C

BUFI2C

Setup Time for a Repeated START Condition

Data Hold Time

Data Setup Time

250

4.0

4.7

–

Setup Time for STOP Condition

Bus Free Time Between a STOP and START Condition

Pulse Width of spikes are suppressed by the input filter.

SPI2C

Figure 17. Definition for Timing for Fast/Standard Mode on the I C Bus

SDA

SCL

T_SPI2C

LOWI2C

T_SUDATI2C

T_HDSTAI2C

T_BUFI2C

T_SUSTOI2C

T_SUSTAI2C

T_HDDATI2C

T_HDSTAI2C

T_HIGHI2C

Note

21. A Fast-Mode I2C-bus device can be used in a Standard-Mode I2C-bus system, but the requirement t

≥ 250 ns must then be met. This is automatically the case

SU;DAT

if the device does not stretch the LOW period of the SCL signal. If such device does stretch the LOW period of the SCL signal, it must output the next data bit to the

Figure 18.

= 1000 + 250 = 1250 ns (according to the Standard-Mode I2C-bus specification) before the SCL line is released.

SU;DAT

SDA line t

+ t

rmax

Document Number: 001-44369 Rev. *B

Page 33 of 37

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CY8C23433, CY8C23533

Packaging Information

This section illustrates the packaging specifications for the CY8C23x33 PSoC device, along with the thermal impedances for each

package, solder reflow peak temperature, and the typical package capacitance on crystal pins.

Figure 19. 32-Pin (5x5 mm) QFN

SEE NOTE 1

TOP VIEW

BOTTOM VIEW

SIDE VIEW

NOTES:

HATCH AREA IS SOLDERABLE EXPOSED PAD

CYPRESS

2. BASED ON REF JEDEC # MO-248

3. PACKAGE WEIGHT: 0.0388g

COMPANY CONFIDENTIAL

TITLE

32L QFN

0.55 MM PACKAGE

001-^O4^U2^TL1^IN6^E8^3.5*^XC^{3.5 EPAD}

(SAWN TYPE)

SIZE

PART NO.

DWG NO

REV

4. DIMENSIONS ARE IN MILLIMETERS

001-42168

LQ32

Document Number: 001-44369 Rev. *B

Page 34 of 37

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CY8C23433, CY8C23533

Figure 20. 28-Pin (210-Mil) SSOP

51-85079 *C

Thermal Impedances

Capacitance on Crystal Pins

Table 39. Typical Package Capacitance on Crystal Pins

Package Package Capacitance

2.0 pF

2.8 pF

Table 38. Thermal Impedances by Package

[22]

Package

Typical θ

19.4°C/W

95°C/W

32 QFN

28 SSOP

Solder Reflow Peak Temperature

Following is the minimum solder reflow peak temperature to achieve good solderability.

Table 40. Solder Reflow Peak Temperature

[23]

Package

Minimum Peak Temperature

Maximum Peak Temperature

32 QFN

240°C

260°C

28 SSOP

Notes

22. T = T + POWER x θ_JA.

23. Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5 C with Sn-Pb or 245 ± 5 C with Sn-Ag-Cu paste.

Refer to the solder manufacturer specifications.

Document Number: 001-44369 Rev. *B

Page 35 of 37

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CY8C23433, CY8C23533

Ordering Information

The following table lists the CY8C23X33 PSoC device family key package features and ordering codes.

Table 41. CY8C23X33 PSoC Device Family Key Features and Ordering Information

32 Pin QFN

CY8C23533-24LQXI

256 -40°C to +85°C

Yes

32 Pin QFN (Tape and Reel) CY8C23533-24LQXIT

28 Pin (210 Mil) SSOP

CY8C23433-24PVXI

CY8C23433-24PVXIT

28 Pin (210 Mil) SSOP

(Tape and Reel)

Document Number: 001-44369 Rev. *B

Page 36 of 37

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CY8C23433, CY8C23533

Document History Page

Document Title: CY8C23433, CY8C23533 PSoC Programmable System-on-Chip™

Document Number: 001-44369

Orig. of

Change

Submission

Date

Revision

ECN

Description of Change

2044848

KIY/AESA

01/30/2008 Data sheet creation

2482967 HMI/AESA

05/14/2008 Moved from Preliminary to Final. Part number changed to CY8C23433,

CY8C23533. Adjusted placement of the block diagram; updated description

of DAC; updated package pinout description, updated POR and LVD spec,

Added Csc , Flash Vdd, SAR ADC spec. Updated package diagram

001-42168 to *A. Updated data sheet template.

2616862 OGNE/AESA 12/05/2008

Changed title to: “CY8C23433, CY8C23533 PSoC Programmable

System-on-Chip™”

Updated package diagram 001-42168 to *C.

Changed names of registers on page 11.

"SARADC_C0" to "SARADC_CR0"

"SARADC_C1" to "SARADC_CR1"

Sales, Solutions, and Legal Information

Worldwide Sales and Design Support

Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office

closest to you, visit us at cypress.com/sales.

Products

PSoC

PSoC Solutions

General

psoc.cypress.com/solutions

psoc.cypress.com/low-power

psoc.cypress.com/precision-analog

psoc.cypress.com/lcd-drive

psoc.cypress.com/can

Clocks & Buffers

Wireless

Low Power/Low Voltage

Precision Analog

LCD Drive

Memories

Image Sensors

CAN 2.0b

USB

psoc.cypress.com/usb

circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical,

life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical

components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems

application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.

Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),

United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,

and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress

integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without

the express written permission of Cypress.

Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES

OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not

assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where

a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer

assumes all risk of such use and in doing so indemnifies Cypress against all charges.

Use may be limited by and subject to the applicable Cypress software license agreement.

Document Number: 001-44369 Rev. *B

Revised December 05, 2008

Page 37 of 37

PSoC Designer™, Programmable System-on-Chip™, and PSoC Express™ are trademarks and PSoC® is a registered trademark of Cypress Semiconductor Corp. All other trademarks or registered

trademarks referenced herein are property of the respective corporations. Purchase of I2C components from Cypress or one of its sublicensed Associated Companies conveys a license under the

Philips I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips. All products and company names

mentioned in this document may be the trademarks of their respective holders.

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