TECHNICAL USER MANUAL FOR:
smartCore Express
SMA200
Nordstrasse 11/F
CH - 4542 Luterbach
Tel.:
Fax:
Email:
++41 (0)32 681 58 00
++41 (0)32 681 58 01
Homepage: http://www.digitallogic.com
DIGITAL-LOGIC AG
SMA200 Manual V1.0
Table of Contents
PREFACE .....................................................................................................................................................4
Trademarks..................................................................................................................................... 4
Environmental Protection Statement........................................................................................... 4
Technical Support.......................................................................................................................... 5
Limited Two Year Warranty........................................................................................................... 5
1.10. For Your Safety............................................................................................................................... 8
1.11. RoHS Commitment......................................................................................................................... 8
1.12. Swiss Quality................................................................................................................................ 10
1.13. The Swiss Association for Quality and Management Systems............................................... 10
OVERVIEW .................................................................................................................................................11
Examples of Ordering Codes...................................................................................................... 14
DIMENSIONS & DIAGRAMS..........................................................................................................................15
3.1. Block Diagram .............................................................................................................................. 15
COM-EXPRESS CONNECTOR DESCRIPTION ................................................................................................20
Signal Terminology Descriptions............................................................................................... 20
smartCoreExpress Connector Pinout........................................................................................ 21
SIGNAL DESCRIPTIONS OF THE SMARTCOREEXPRESS .................................................................................23
Matching of the Differential Pairs............................................................................................... 23
HDA Audio Interface.............................................................................................................. 32
SD / SDIO Interface............................................................................................................... 33
GLAN..................................................................................................................................... 36
CAN / Serial........................................................................................................................... 37
SMARTCORE-EXPRESS CONNECTOR SPECIFICATIONS .................................................................................40
SMARTCORE-EXPRESS VERSUS COMEXPRESS...........................................................................................41
INDEX ........................................................................................................................................................42
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1. PREFACE
The information contained in this manual has been carefully checked and is believed to be accurate; it is
subject to change without notice. Product advances mean that some specifications may have changed.
DIGITAL-LOGIC AG assumes no responsibility for any inaccuracies, or the consequences thereof, that may
appear in this manual. Furthermore, DIGITAL-LOGIC AG does not accept any liability arising from the use or
application of any circuit or product described herein.
1.1. Trademarks
DIGITAL-LOGIC, DIGITAL-LOGIC-Logo, MICROSPACE, and smartModule are registered trademarks
owned worldwide by DIGITAL-LOGIC AG, Luterbach (Switzerland). In addition, this document may include
names, company logos, and registered trademarks which are, therefore, proprietary to their respective
owners.
1.2. Disclaimer
DIGITAL-LOGIC AG makes no representations or warranties with respect to the contents of this manual, and
specifically disclaims any implied warranty of merchantability or fitness, for any particular purpose. DIGITAL-
LOGIC AG shall, under no circumstances, be liable for incidental or consequential damages or related
expenses resulting from the use of this product, even if it has been notified of the possibility of such damage.
1.3. Environmental Protection Statement
This product has been manufactured to satisfy environmental protection requirements wherever possible.
Many of the components used (structural parts, printed circuit boards, connectors, batteries, etc.) are
capable of being recycled. Final disposal of this product after its service life must be accomplished in
accordance with applicable country, state, or local laws or regulations.
1.4. Who should use this Product
ꢀ Electrical engineers with know-how in PC-technology.
ꢀ Because of the complexity and the variability of PC-technology, we cannot guarantee that the product
will work in any particular situation or set-up. Our technical support will try to help you find a solution.
ꢀ Pay attention to electrostatic discharges; use a CMOS protected workplace.
ꢀ Power supply must be OFF when working on the board or connecting any cables or devices.
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1.5. Recycling Information
All components within this product fulfill the requirements of the RoHS (Restriction of Hazardous Substances
Directive). The product is soldered with a lead free process.
1.6. Technical Support
1. Contact your local DIGITAL-LOGIC Technical Support, in your country.
2. Use the Internet Support Request form at http://support.digitallogic.ch/ ꢀ embedded products ꢀ New
Support Request
Support requests are only accepted with detailed information about the product (i.e., BIOS-, Board-
version)!
1.7. Limited Two Year Warranty
DIGITAL-LOGIC AG guarantees the hardware and software products it manufactures and produces to be
free from defects in materials and workmanship for two years following the date of shipment from DIGITAL-
LOGIC AG, Switzerland. This warranty is limited to the original purchaser of the product and is not
transferable.
During the two year warranty period, DIGITAL-LOGIC AG will repair or replace, at its discretion, any
defective product or part at no additional charge, provided that the product is returned, shipping prepaid, to
DIGITAL-LOGIC AG. All replaced parts and products become property of DIGITAL-LOGIC AG.
Before returning any product for repair, direct customers of DIGITAL-LOGIC AG, Switzerland
are required to register a RMA (Return Material Authorization) number in the Support Center at
All other customers must contact their local distributors for returning defective materials.
This limited warranty does not extend to any product which has been damaged as a result of accident,
misuse, abuse (such as use of incorrect input voltages, wrong cabling, wrong polarity, improper or
insufficient ventilation, failure to follow the operating instructions that are provided by DIGITAL-LOGIC AG or
other contingencies beyond the control of DIGITAL-LOGIC AG), wrong connection, wrong information or as
a result of service or modification by anyone other than DIGITAL-LOGIC AG. Nor if the user has insufficient
knowledge of these technologies or has not consulted the product manuals or the technical support of
DIGITAL-LOGIC AG and therefore the product has been damaged.
Empty batteries (external and onboard), as well as all other battery failures, are not covered by this
manufacturer’s limited warranty.
Except, as directly set forth above, no other warranties are expressed or implied, including, but not limited to,
any implied warranty of merchantability and fitness for a particular purpose, and DIGITAL-LOGIC AG
expressly disclaims all warranties not stated herein. Under no circumstances will DIGITAL-LOGIC AG be
liable to the purchaser or any user for any damage, including any incidental or consequential damage,
expenses, lost profits, lost savings, or other damages arising out of the use or inability to use the product.
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1.8. Explanation of Symbols
CE Conformity
This symbol indicates that the product described in this manual is in compliance with all
applied CE standards.
Caution, Electric Shock!
This symbol and title warn of hazards due to electrical shocks (> 60V) when touching
products or parts of them. Failure to observe the precautions indicated and/or prescribed by
the law may endanger your life/health and/or result in damage to your equipment.
Caution, Electric Shock!
This symbol and title warn of hazards due to electrical shocks (> 32V) when touching
products or parts of them. Failure to observe the precautions indicated and/or prescribed by
the law may endanger your life/health and/or result in damage to your equipment
Warning, ESD Sensitive Device!
This symbol and title inform that electronic boards and their components are sensitive to
Electro Static Discharge (ESD). In order to ensure product integrity at all times, care must
always be taken while handling and examining this product.
Attention!
This symbol and title emphasize points which, if not fully understood and taken into
consideration by the reader, may endanger your health and/or result in damage to your
equipment.
Note...
This symbol and title emphasize aspects the user should read through carefully for his, or
her, own advantage.
Warning, Heat Sensitive Device!
This symbol indicates a heat sensitive component.
Safety Instructions
This symbol shows safety instructions for the operator to follow.
This symbol warns of general hazards from mechanical, electrical, and/or
chemical failure. This may endanger your life/health and/or result in damage
to your equipment.
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1.9. Applicable Documents and Standards
The following publications are used in conjunction with this manual. When any of the referenced
specifications are superseded by an approved revision, that revision shall apply. All documents may be
obtained from their respective organizations.
ꢀ Advanced Configuration and Power Interface Specification Revision 2.0c, August 25, 2003 Copyright
© 1996-2003 Compaq Computer Corporation, Intel Corporation, Microsoft Corporation, Phoenix
Technologies Ltd., Toshiba Corporation. All rights reserved. http://www.acpi.info/
ꢀ ANSI/TIA/EIA-644-A-2001: Electrical Characteristics of Low Voltage Differential Signaling (LVDS)
Interface Circuits, January 1, 2001. http://www.ansi.org/
ꢀ ANSI INCITS 361-2002: AT Attachment with Packet Interface - 6 (ATA/ATAPI-6), November 1, 2002.
ꢀ ANSI INCITS 376-2003: American National Standard for Information Technology – Serial Attached
SCSI (SAS), October 30, 2003. http://www.ansi.org/
ꢀ Audio Codec ’97 Revision 2.3 Revision 1.0, April 2002 Copyright © 2002 Intel Corporation. All rights
reserved. http://www.intel.com/labs/media/audio/
ꢀ Display Data Channel Command Interface (DDC/CI) Standard (formerly DDC2Bi) Version 1, August
14, 1998 Copyright © 1998 Video Electronics Standards Association. All rights reserved.
ꢀ ExpressCard Standard Release 1.0, December 2003 Copyright © 2003 PCMCIA. All rights reserved.
ꢀ IEEE 802.3-2002, IEEE Standard for Information technology, Telecommunications and information
exchange between systems–Local and metropolitan area networks–Specific requirements – Part 3:
Carrier Sense Multiple Access with Collision Detection (CSMA/CD) Access Method and Physical
Layer Specifications. http://www.ieee.org
ꢀ IEEE 802.3ae (Amendment to IEEE 802.3-2002), Part 3: Carrier Sense Multiple Access with Collision
Detection (CSMA/CD) Access Method and Physical Layer Specifications, Amendment: Media Access
Control (MAC) Parameters, Physical Layers, and Management Parameters for 10 GB/s Operation.
ꢀ Intel Low Pin Count (LPC) Interface Specification Revision 1.1, August 2002 Copyright © 2002 Intel
Corporation. All rights reserved. http://developer.intel.com/design/chipsets/industry/lpc.htm
ꢀ PCI Express Base Specification Revision 1.1, March 28, 2005, Copyright © 2002-2005 PCI Special
Interest Group. All rights reserved. http://www.pcisig.com/
ꢀ PCI Express Card Electromechanical Specification Revision 1.1, March 28, 2005, Copyright © 2002-
2005 PCI Special Interest Group. All rights reserved. http://www.pcisig.com/
ꢀ PCI Local Bus Specification Revision 2.3, March 29, 2002 Copyright © 1992, 1993, 1995, 1998, 2002
PCI Special Interest Group. All rights reserved. http://www.pcisig.com/
ꢀ PICMG® Policies and Procedures for Specification Development, Revision 2.0, September 14, 2004,
PCI Industrial Computer Manufacturers Group (PICMG®), 401 Edgewater Place, Suite 500,
Wakefield, MA 01880, USA, Tel: 781.224.1100, Fax: 781.224.1239. http://www.picmg.org/
ꢀ Serial ATA: High Speed Serialized AT Attachment Revision 1.0a January 7, 2003 Copyright © 2000-
2003, APT Technologies, Inc, Dell Computer Corporation, Intel Corporation, Maxtor Corporation,
Seagate Technology LLC. All rights reserved. http://www.sata-io.org/
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ꢀ System Management Bus (SMBus) Specification Version 2.0, August 3, 2000 Copyright © 1994, 1995,
1998, 2000 Duracell, Inc., Energizer Power Systems, Inc., Fujitsu, Ltd., Intel Corporation, Linear
Technology Inc., Maxim Integrated Products, Mitsubishi Electric Semiconductor Company, Power-
Smart, Inc., Toshiba Battery Co. Ltd., Unitrode Corporation, USAR Systems, Inc. All rights reserved.
ꢀ Universal Serial Bus Specification Revision 2.0, April 27, 2000 Copyright © 2000 Compaq Computer
Corporation, Hewlett-Packard Company, Intel Corporation, Lucent Technologies Inc., Microsoft
Corporation, NEC Corporation, Koninklijke Philips Electronics N.V. All rights reserved.
1.10. For Your Safety
Your new DIGITAL-LOGIC product was developed and tested carefully to provide all features
necessary to ensure its compliance with electrical safety requirements. It was also designed for a
long, fault-free life. However, this life expectancy can be drastically reduced by improper treatment
during unpacking and installation. Therefore, in the interest of your own safety and for the correct
operation of your new DIGITAL-LOGIC product, please comply with the following guidelines.
Attention!
All work on this device must only be carried out by sufficiently skilled personnel.
Caution, Electric Shock!
Before installing your new DIGITAL-LOGIC product, always ensure that your mains power is
switched off. This applies also to the installation of piggybacks or peripherals. Serious
electrical shock hazards can exist during all installation, repair and maintenance operations
with this product. Therefore, always unplug the power cable and any other cables which
provide external voltage before performing work.
Warning, ESD Sensitive Device!
Electronic boards and their components are sensitive to static electricity. In order to ensure
product integrity at all times, be careful during all handling and examinations of this product.
1.11. RoHS Commitment
DIGITAL-LOGIC AG is committed to develop and produce environmentally friendly products according to the
Restriction of Hazardous Substances (RoHS) Directive (2002/95/EC) and the Waste Electrical and Electronic
Equipment (WEEE) Directive (2002/96/EC) established by the European Union. The RoHS directive was
adopted in February 2003 by the European Union and came into effect on July 1, 2006. It is not a law but a
directive, which restricts the use of six hazardous materials in the manufacturing of various types of
electronic and electrical equipment. It is closely linked with the Waste Electrical and Electronic Equipment
Directive (WEEE) 2002/96/EC, which has set targets for collection, recycling and recovery of electrical goods
and is part of a legislative initiative to solve the problem of huge amounts of toxic e-waste.
Each European Union member state is adopting its own enforcement and implementation policies using the
directive as a guide. Therefore, there could be as many different versions of the law as there are states in
the EU. Additionally, non-EU countries like China, Japan, or states in the U.S. such as California may have
their own regulations for green products, which are similar, but not identical, to the RoHS directive.
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RoHS is often referred to as the "lead-free" directive but it restricts the use of the following substances:
ꢀ Lead
ꢀ Mercury
ꢀ Cadmium
ꢀ Chromium VI
ꢀ PBB and PBDE
The maximum allowable concentration of any of the above mentioned substances is 0.1% (except for
Cadmium, which is limited to 0.01%) by weight of homogeneous material. This means that the limits do not
apply to the weight of the finished product, or even to a component but to any single substance that could
(theoretically) be separated mechanically.
1.11.1. RoHS Compatible Product Design
All DIGITAL-LOGIC standard products comply with RoHS legislation.
Since July 1, 2006, there has been a strict adherence to the use of RoHS compliant electronic and
mechanical components during the design-in phase of all DIGITAL-LOGIC standard products.
1.11.2. RoHS Compliant Production Process
DIGITAL-LOGIC selects external suppliers that are capable of producing RoHS compliant devices. These
capabilities are verified by:
1. A confirmation from the supplier indicating that their production processes and resulting devices are
RoHS compliant.
2. If there is any doubt of the RoHS compliancy, the concentration of the previously mentioned
substances in a produced device will be measured. These measurements are carried out by an
accredited laboratory.
1.11.3. WEEE Application
The WEEE directive is closely related to the RoHS directive and applies to the following devices:
ꢀ Large and small household appliances
ꢀ IT equipment
ꢀ Telecommunications equipment (although infrastructure equipment is exempt in some countries)
ꢀ Consumer equipment
ꢀ Lighting equipment – including light bulbs
ꢀ Electronic and electrical tools
ꢀ Toys, leisure and sports equipment
ꢀ Automatic dispensers
It does not apply to fixed industrial plants and tools. The compliance is the responsibility of the company that
brings the product to market, as defined in the directive. Components and sub-assemblies are not subject to
product compliance. In other words, since DIGITAL-LOGIC does not deliver ready-made products to end
users the WEEE directive is not applicable for DIGITAL-LOGIC. Users are nevertheless encouraged to
properly recycle all electronic products that have reached the end of their life cycle.
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1.12. Swiss Quality
ꢀ 100% Made in Switzerland
ꢀ DIGITAL-LOGIC is a member of "Swiss-Label"
ꢀ This product was not manufactured by employees earning piecework wages
ꢀ This product was manufactured in humane work conditions
ꢀ All employees who worked on this product are paid customary Swiss market wages and are insured
ꢀ ISO 9000:2001 (quality management system)
1.13. The Swiss Association for Quality and Management
Systems
The Swiss Association for Quality and Management Systems (SQS) provides certification and assessment
services for all types of industries and services. SQS certificates are accepted worldwide thanks to
accreditation by the Swiss Accreditation Service (SAS), active membership in the International Certification
Network, IQNet, and co-operation contracts/agreements with accredited partners.
The SQS Certificate ISO 9001:2000 has been issued to DIGITAL-LOGIC AG, the entire company, in the field
of development, manufacturing and sales of embedded computer boards, embedded computer modules and
computer systems. The certification is valid for three years at which time an audit is performed for
recertification.
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2. OVERVIEW
2.1. Standard Features
The smartCoreExpress is an electrical and mechanical definition for a COM or Computer on Module
(miniaturized PC system), based on Intel's ATOM chip unit incorporating the major elements of a PC
compatible computer.
ꢀ Powerful though low consumption ATOM CPU
ꢀ Soldered DDR2 RAM 512k up to 2GByte
ꢀ Single 220pin connectors (Tyco) for the smartCoreExpress BUS
ꢀ 5x x1 PCI-Express lanes
ꢀ 8x USB V2.0
ꢀ 1x PATA or (4x SATA plus 1x GE-LAN)
ꢀ 1x SDVO interface
ꢀ 1x LVDS 24bit interface
ꢀ 1x AC97 HAD interface
ꢀ 1x LPC BUS
ꢀ 1x SPI BUS
ꢀ 1x SM BUS
ꢀ 1x Generic Serial BUS (ex. CAN)
ꢀ 4x GPIO (programmable global in/out)
ꢀ Maximum Thermal Design Power up to 40W
ꢀ Reserved pins for: 1x Ethernet interface 1GE
ꢀ Single 5Volt supply
ꢀ Legacy signals for SuperIO
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2.2. Technical Specifications
CPU
Specification
CoreDuo / Celeron M
Intel Atom 510
Intel Atom 530
1.1 or 1.6GHz
2x 32kByte
0.54 MByte (on die)
40nm
1.10GHz with 0.5MB L2-cache
1.60GHz with 0.5MB L2-cache
Clock
1st Level Cache
2nd Level Cache
Technology
VCCCore @ 1.6GHz
VCCCore @ 1.1GHz
VCCCore @ deep sleep
CPU BUS
1.050V
0.844V
0.748V
CMOS
AGTL+ Termination
FSB
Not needed
533MHz quad-pumped synchronous BUS
Mathematics Coprocessor
Available on the Atom CPU
Intel US15W Graphics Memory Controller Hub
Specification
Memory Controller
Supports
Socket
Technologies
Capacity
Voltage
Termination
Width
ECC-Support
DDR2 soldered memory
DDR2-667
512MByte up to 2GByte
1.8V
0.9V
64bit
No
Intel US15W Graphics Memory Controller Hub
Specification
Graphic Controller
Max. Video Memory
Graphic Core Frequency
SDVO Port
128MByte with Intel GMA
250MHz
2 channels (multiplexed with the PEG signals)
1x 200 Mpixel/sec
Support for up to 1x DVI, 1x VGA and 1x LVDS
Dotclock = 165MHz
Compliant with DVI Spec.1.5
2 channel LVDS interface
Flat Panel Interface
LVDS 24bit
1x 18, 2x 18, 1x 24, 2x 24bpp TFT
Dotclock = up to 2x 112 MHz
Resolutions 640 x 480 up to 1600 x 1200 (UXGA)
Automatic panel detection via VESA EDID 1.3
200Mpixel/sec
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Intel US15W
PCIe BUS
EIDE BUS
SATA BUS
USB V2.0
APIC
Specification
2x x1 Lane
1x Ultra P-ATA 100
-
8 channel USB
INTEL I/O APIC
V2.0 SMBus controller
FirmWare Hub for BIOS devices
SMB
FWH
LPC
Sound
Serialized BUS (no ISA) used for external SuperI/O
AC97 2.3 HDA Interface with 192kHz sampling rate and 8 channels
IRQ Controller
Timers
Power Management
8259 compatible
8254 compatible
Integrated
Reset & Power Management
Controller
Power Modes
ACPI
Specification
Atmel
S5, S3
V3.0
BUS
Specification
LPC
PCIexpress
8bit 33MHz
2x
x1 lane
Power Supply
DC Input
Specification
5.0V, max. 200mV ripple
Inrush Current
Standby Power
Onboard Voltages
Power Consumption
5.0V up to 2Amp for 100µs ꢀ
0.1W
VCC Core, 1.05V, 1.8V, 0.9V, CoreVCC, 1.5V
4W
ꢀ Use inductors in series to reduce the maximum inrush current!
Physical Characteristics
Specification
Dimensions
Length: 65 mm +/- 0.1mm
Depth:
58 mm +/- 0.1mm
Height: 11 mm +/- 0.2mm (with 5mm bus connectors)
14 mm +/- 0.2mm (with 8mm bus connectors)
The connector height is selected by the connector on the carrier board.
70 gr / 8 ounces
1.6 mm / 0.0625 inches nominal
Multilayer
Weight
PCB Thickness
PCB Layer
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Operating Environment
Relative Humidity
Vibration
Shock
Operating Temperature
Specification
5-90% non-condensing
5 to 2000 Hz
10 G
Standard: t.b.d. (depends on the CPU and the cooling concept)
Extended Range: t.b.d.
90°C
-55°C to +85°C
Maximum Copper Temperature
Storage Temperature
EMI / EMC (IEC1131-2 refer MIL 461/462) Specification
ESD Electro Static Discharge
IEC 801-2, EN55101-2, VDE 0843/0847 Part 2
Metallic protection needed
Separate Ground Layer included
15 kV single peak
REF Radiated Electromagnetic Field
EFT Electric Fast Transient (Burst)
IEC 801-3, VDE 0843 Part 3, IEC770 6.2.9.
Not tested
IEC 801-4, EN50082-1, VDE 0843 Part 4
250V - 4kV, 50 Ohm, Ts = 5ns
Grade 2: 1KV Supply, 500 I/O, 5Khz
IEC 801-5, IEEE587, VDE 0843 Part 5
SIR Surge Immunity Requirements
Supply:
I/O:
2kV, 6 pulse/minute
500V, 2 pulse/minute
FD, CRT: None
EN55022
High-Frequency Radiation
All information is subject to change without notice.
2.3. Examples of Ordering Codes
Product Name
Part Number
Description
SMA200-11G-xxGB
ATOM Z510, 1.1GHz
incl. 0.5GB RAM 805800
incl. 1.0GB RAM 805801
incl. 2.0GB RAM 805802
SMA200-16G-xxGB
ATOM Z530, 1.6GHz
incl. 0.5GB RAM 805810
incl. 1.0GB RAM 805811
incl. 2.0GB RAM 805812
SMA204-16G-xxGB
ATOM Z530, 1.6GHz, 4GB PATA SSD
incl. 0.5GB RAM 805820
incl. 1.0GB RAM 805821
incl. 2.0GB RAM 805822
Options/Accessories
SMX-CON5
SMX-CON8
SMA200DK
807139
807138
805850
5mm COM Express connector
8mm COM Express connector
SMA200 Development Kit
These are only examples; for current ordering codes, please see the current price list.
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Design IN with the smartModule
Attention!
When using an active/passive heatsink that is not from DLAG, be very careful!
The maximum depth the screws can go into the product is 3mm or the module will be
destroyed!
3.2. Dimensions of the smartCoreExpress Module
65.0mm
58.5mm
3.25
3.25
3.25
View of the bottom side of the
smartCoreExpress module.
All dimensions with +/-0.1mm tolerance
if not otherwise specified.
Units = millimeter.
58.0
44.0
50.2
d=1.6
d=1.0
B1
A1
Pin 1
3.65mm
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3.3. Connector Placement & Pin Definition on the Carrier
Board
View of the Top Side (mounting side) of the smartCoreExpress PCB:
d=2.2/D=4.5
3.25
3.25
smartCoreExpress
PCB pad design
44.0mm
58.5mm
d=2.2/D=4.5
0.3
1.6
B1
1.6
0.5
50.2mm
0.4
B110
1.8
d=1.0
d=1.6
3.6mm
A1 A2 A3 ...
A110
57.7mm
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3.5. Dimensions of the Carrier Board Connector
SMX-CON8:
Standard Height: 5.0mm
DLAG Part Nr:
AMP/Tyco:
(Available alternative: 8.0mm)
807138
8-6318491-6
(Components placed below the smartModule should total a maximum of 2.0mm.)
3.6. Component Heights between Module and Carrier Board
Parts mounted on the back side of the module (in the space between the bottom surface of the module PCB
and the carrier board) should have a maximum height of 8.0mm.
6.0mm
5.0mm
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4. COM-EXPRESS CONNECTOR DESCRIPTION
4.1. Signal Terminology Descriptions
Signal
PU
PD
I/O 3.3V
I/O 5V
I 3V
Description
Internally implemented pull up resistor
Internally implemented pull down resistor
Bi-directional signal 3.3V tolerant
Bi-directional signal 5V tolerant
Input 3.3V tolerant
I 5V
Input 5V tolerant
I/O 3.3VSB
O 3V
O 5V
P
Input 3.3V tolerant, active in standby state
Output 3.3V signal level
Output 5V signal level
Power input/output
Differential signal pair
D
DDC
PCIE
SATA
LVDS
LAN
Display data channel
In compliance with PCI Express Base Specification, Revision 1.0a
In compliance with Serial ATA Specification, Revision 1.0a
Low voltage differential signal: 350mV nominal; 450mV maximum differential signal
100/10Mbit/s LAN signals coming from the PHY
Trusted platform module
TPM
GE-LAN
1GB LAN signals
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4.2. smartCoreExpress Connector Pinout
BUS on the smartCoreExpress – Connectors A / B: Pins 1-55
Pin Signal
BUS
Type Remarks
Pin Signal
BUS
Type Remarks
A1
A2
A3
A4
A5
A6
A7
A8
A9
GND
B1
B2
B3
B4
B5
B6
B7
B8
B9
GND
PCIe_TX0_N
PCIe_TX0_P
PCIe_CLK0_N
PCIe_CLK0_P
GND
PCIe_TX1_N
PCIe_TX1_P
PCIe_TX2_N
PCIe
PCIe
PCIe
PCIe
Dif
Dif
Dif
Dif
AC
AC
AC
AC
PCIe_RX0_N
PCIe_RX0_P
PCIe_CLK1_N
PCIe_CLK1_P
GND
PCIe_RX1_N
PCIe_RX1_P
PCIe_RX2_N
PCIe
PCIe
PCIe
PCIe
Dif
Dif
Dif
Dif
AC
AC
AC
AC
PCIe
PCIe
PCIe
PCIe
Dif
Dif
Dif
Dif
AC
AC
AC
AC
PCIe
PCIe
PCIe
PCIe
Dif
Dif
Dif
Dif
AC
AC
AC
AC
A10 PCIe_TX2_P
A11 GND
B10 PCIe_RX2_P
B11 GND
A12 PCIe_CLK2_N
A13 PCIe_CLK2_P
A14 PCIe_TX3_N
A15 PCIe_TX3_P
A16 GND
PCIe
PCIe
PCIe
PCIe
Dif
Dif
Dif
Dif
AC
AC
AC
AC
B12 PCIe_CLK3_N
B13 PCIe_CLK3_P
B14 PCIe_RX3_N
B15 PCIe_RX3_P
B16 GND
PCIe
PCIe
PCIe
PCIe
Dif
Dif
Dif
Dif
AC
AC
AC
AC
A17 PCIe_REQ0#
A18 PCIe_REQ2#
A19 SDVO_CLK_N
A20 SDVO_CLK_P
A21 GND
PCIe
PCIe
3.3v-O Clk request
3.3v-O Clk request
B17 PCIe_REQ1#
B18 PCIe_REQ3#
B19 SDVO_INT_N
B20 SDVO_INT_P
B21 GND
PCIe
PCIe
3.3v-O Clock request
3.3v-O Clock request
SDVO
SDVO
Dif
Dif
AC
AC
SDVO
SDVO
Dif
Dif
AC
AC
A22 SDVO_GREEN_N
A23 SDVO_GREEN_P
A24 SDVO_TVCLK_N
A25 SDVO_TVCLK_P
A26 GND
SDVO
SDVO
SDVO
SDVO
Dif
Dif
Dif
Dif
AC
AC
AC
AC
B22 SDVO_BLUE_N
B23 SDVO_BLUE_P
B24 SDVO_STALL_N
B25 SDVO_STALL_P
B26 GND
SDVO
SDVO
SDVO
SDVO
Dif
Dif
Dif
Dif
AC
AC
AC
AC
A27 SDVO_RED_N
A28 SDVO_RED_P
A29 LVDS_D0_P
A30 LVDS_D0_N
A31 GND
SDVO
SDVO
LVDS
LVDS
Dif
Dif
Dif
Dif
AC
AC
LV
LV
B27 SDVO_DDC_CLK
B28 SDVO_DDC_DAT
B29 LVDS_D1_P
B30 LVDS_D1_N
B31 GND
SDVO
SDVO
LVDS
LVDS
3.3V Bidir.
3.3V Bidir.
Dif
Dif
LV
LV
A32 LVDS_D2_P
A33 LVDS_D2_N
A34 LVDS_D3_P
A35 LVDS_D3_N
A36 GND
A37 LVDS_DDC_DAT
A38 LVDS_DDC_CLK
A39 USB_0_P
A40 USB_0_N
A41 GND
LVDS
LVDS
LVDS
LVDS
Dif
Dif
Dif
Dif
LV
LV
LV
LV
B32 LVDS_CLK_P
B33 LVDS_CLK_N
B34 LVDS_BKL_CTR
B35 LVDS_BKL_EN
B36 LVDS_DETECT#
B37 LVDS_VDD_EN
B38 USB_C_DEV
B39 USB_1_P
LVDS
LVDS
LVDS
LVDS
LVDS
LVDS
USB
Dif
Dif
LV
LV
3.3v
3.3v
3.3V
3.3V
3.3V
Dif
LVDS
LVDS
USB
3.3v
3.3v
Dif
LV
LV
USB
USB
LV
LV
USB
Dif
B40 USB_1_N
B41 GND
Dif
A42 USB_2_P
A43 USB_2_N
A44 USB_4_P
A45 USB_4_N
A46 GND
A47 USB_6_P
A48 USB_6_N
A49 USB_OC01#
A50 USB_OC45#
A51 GND
USB
USB
USB
USB
Dif
Dif
Dif
Dif
LV
LV
LV
LV
B42 USB_3_P
B43 USB_3_N
B44 USB_5_P
B45 USB_5_N
B46 GND
B47 USB_7_P
B48 USB_7_N
B49 USB_OC23#
B50 USB_OC67#
B51 GND
USB
USB
USB
USB
Dif
Dif
Dif
Dif
LV
LV
LV
LV
USB
USB
USB
USB
Dif
Dif
3.3v
3.3v
LV
LV
USB
USB
USB
USB
Dif
Dif
3.3v
3.3v
LV
LV
A52 GE_CLK
A53 GE_TX0
A54 GE_TX1
A55 GE_TX2
GE-LAN
GE-LAN
GE-LAN
GE-LAN
B52 GE_RTS
B53 GE_RX0
B54 GE_RX1
B55 GE_RX2
GE-LAN
GE-LAN
GE-LAN
GE-LAN
21
DIGITAL-LOGIC AG
SMA200 Manual V1.0
BUS on the smartCoreExpress – Connectors A / B: Pins 56-110
Remarks
Remarks
Pin Signal
A56 SMB_CLK
A57 SMB_DAT
A58 SMB_ALERT#
A59 SATA_LED#
A60 GND
BUS Type
Pin Signal
B56 SPI_MISO
B57 SPI_MOSI
B58 SPI-CS#
B59 SPI_CLK
B60 GND
BUS Type
SMB
SMB
SMB
SAT
3.3V bidir
SPI
SPI
SPI
SPI
3.3V Bidir.
3.3V Bidir
3.3Vo
3.3V bidir
3.3V bidir
3.3Vo
3.3Vo
A61 IDE_D3 / SATA_Tx0P
A62 IDE_A0 / SATA_Tx0N
A63 IDE_A2 / SATA_Rx0P
A64 IDE_D8 / SATA_Rx0N
A65 IDERQ / GND
A66 IDE_A1 / SATA_Tx2P
A67 IDE_D13 / SATA_Tx2N
A68 IDE_D1 / SATA_Rx2P
A69 IDE_IRQ / SATA_Rx2N
A70 GND
HD
HD
HD
HD
HD
HD
HD
HD
HD
5 /DI
5 /Di
5 /Di
5 /Di
5 /
5 /Di
5 /Di
5 /Di
5 /Di
B61 IDE_CS3 / SATA_Tx0P
B62 IDE_DAK / SATA_Tx0N
B63 IDE_D4 / SATA_Rx0P
B64 IDE_D2 / SATA_Rx0N
B65 IDEIORDY / GND
B66 IDE_D10 / SATA_Tx2P
B67 IDE_D6 / SATA_Tx2N
B68 IDE_D12 / SATA_Rx2P
B69 IDE_D9 / SATA_Rx2N
B70 GND
HD
HD
HD
HD
HD
HD
HD
HD
HD
5 /DI
5 /Di
5 /Di
5 /Di
5 /
5 /Di
5 /Di
5 /Di
5 /Di
A71 IDE_D11 / PCIE_TX4_N
A72 IDE_D5 / PCIE_TX4_N
A73 IDE_RD# / PCIE_REQ4
A74 IDE_D14/ PCIE_CK4_N
A75 IDE_CS1/ PCIE_CK4_N
A76 LPC_AD3
HD
HD
HD
HD
5 /Di
5 /Di
5 / 3
5 /Di
5 /Di
3.3V
3.3V
3.3V
3.3V
B71 IDE_D15 / PCIE_RX4_N
B72 IDE_D0 / PCIE_RX4_N
B73 IDE_D7
HD
HD
HD
HD
HD
5 /Di
5 /Di
5
B74 IDE_WR#/ CAN_TX
B75 IDE_DET / CAN_RX
B76 LPC_CLK0
5 /Di
5 /Di
HD
LPC
LPC
LPC
LPC
LPC 3.3Vo 33MHz
LPC 3.3Vo 33MHz
LPC
LPC
A77 LPC_AD1
A78 LPC_AD0
B77 LPC_CLK1
B78 LPC_SERIRQ
B79 LPC_AD2
B80 GND
B81 SD_DATA7
B82 SD_PWR*
B83 SD_DATA2
B84 SD_LED
B85 SD_DATA4
B86 SD_DATA0
B87 SD_CMD
3.3V
3.3V
A79 LPC_FRAME#
A80 GND
A81 SD_WP
SDIO
SDIO
SDIO
SDIO
SDIO
SDIO
SDIO
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
SDIO 3.3V
SDIO 3.3V
SDIO 3.3V
SDIO 3.3V
SDIO 3.3V
SDIO 3.3V
SDIO 3.3V
SYS 3.3Vo
SYS 3.3Vo
A82 SD_CD#
A83 SD_CLK
A84 SD_DATA1
A85 SD_DATA3
A86 SD_DATA5
A87 SD_DATA6
A88 LVDS_CTLB_DAT
A89 LVDS_CTLB_CLK
A90 GND
LVDS 3.3Vo
LVDS 3.3Vo
B88 BIOS_Recovery / WDO
B89 Speaker Output
B90 GND
A91 AC97_DOCK_EN#
A92 AC97_SDATAIN1
A93 AC97_SDATAOUT
A94 AC97_RST#
A95 IDE_PCSEL
A96 GPIO0
HDA
HDA
HDA
HDA
HD
3.3Vi
3.3V
3.3V
3.3Vo
5V
B91 AC97_BITCLK
B92 AC97_DOCK_RST#
B93 AC97_SDATAIN0
B94 AC97_SYNC
B95 A20M#
B96 Powergood
HDA 3.3Vo
HDA 3.3Vo
HDA
HDA
SYS
SYS
SYS
SYS
3.3V
3.3V
5V
SYS
SYS
SYS
SYS
3.3V
3.3V
3.3V
3.3V
5Vi
3.3Vi
3.3Vi
A97 GPIO1
A98 GPIO2
B97 PSON#
B98 PWRBTN#
A99 GPIO3
A100 GND
B99 SUS_S3#_Output
B100 GND
SYS 3.3Vo
A101 Reset_Output#
A102 Reset_Input#
A103 WAKE_Input#
A104 +5Volt Supply Input
A105 +5Volt Supply Input
A106 +5Volt Supply Input
A107 +5Volt Supply Input
A108 +5Volt Supply Input
A109 +5Volt Supply Input
A110 GND
SYS
SYS
SYS
3.3Vo
3.3Vi
3.3Vi
5Vi
5Vi
5Vi
5Vi
5Vi
5Vi
B101 SUS_S4&5#_Output
B102 BIOS_Disable#
B103 Battery Supply 3.0-3.6V
B104 +5Volt_Always Input
B105 +5Volt Supply Input
B106 +5Volt Supply Input
B107 +5Volt Supply Input
B108 +5Volt Supply Input
B109 +5Volt Supply Input
B110 GND
SYS 3.3Vo
SYS
SYS
3.3Vi
3Vin
5Vi
PWR
PWR
PWR
PWR
PWR
PWR
PWR
PWR
PWR
PWR
PWR
PWR
5Vi
5Vi
5Vi
5Vi
5Vi
22
DIGITAL-LOGIC AG
SMA200 Manual V1.0
5.4. smartCoreExpress Signal Groups
5.4.1.
PCI-Express
On Module
Termination mination Length Ohm Length
Ext. Ter- Max.
Matched
Signal
BUS Type Description
Needed
in mm
in mm
PCIe_Tx [0-4] +/- PCIe
Dif Transmitter 2.5Gbit
100nF Series
-
200
100
100
0.2
Out Connected to an Rx pin pair Cap.
of the device.
Dif Receiver 2.5Gbit
PCIe_Rx [0..4] +/-
PCIe_CLK[0..4] +/-
PCIe
PCIe
-
-
Series
Cap.
100nF
As 0402
200
0.2
In
Connected to a Tx pin pair
of the device. The Tx output
of the device needs an AC
coupling capacitor.
Dif Reference clock (100MHz)
Out Connected to a Refclock pin
pair of the device.
-
-
200
200
100
0.2
-
PCIe_REQ#[0..4] PCIe 3.3V A low signal at this input will PU
Static
In
enable the PCI-Clk-Output integrated in
of the corresponding PCI- the CK540
Express lane.
If the signals are not used:
All these PCI-Express signals may be left open.
Remarks:
Pair to Pair spacing: 35mil = 0.9mm
BUS to BUS spacing: 20mil = 0.5mm
The AC coupling capacitors must be placed near the device for the Tx signals only. The maximum
number of vias per signal is less than 4.
EMV/EMI filters:
Are not needed.
25
DIGITAL-LOGIC AG
SMA200 Manual V1.0
5.4.2.
SDVO
On Module Ext. Ter- Max. Matched
Termination mination Length Ohm Length
Signal
BUS
Type Description
Needed
in mm
in mm
ꢀ
ꢀ
SDVO_CTRLCLK SDVO
SDVO_CTRLDAT SDVO
DDC signal
DDC signal
PU 4.7k to
3.3V
PU 4.7K to
3.3V
55
55
SDVO_CLK +/-
SDVO_INIT +/-
SDVO
SDVO
Dif
Needs a series 100nF
-
-
-
-
-
-
-
-
100
100
100
100
100
100
100
100
0.5
0.5
0.5
0.5
Out capacitor to connect to an
SDVO converter chip
Dif
In
Needs a series 100nF
capacitor to connect to an
SDVO converter chip
Needs a series 100nF
capacitor to connect to an
SDVO converter chip
Needs a series 100nF
capacitor to connect to an
SDVO converter chip
SDVO_STALL +/- SDVO
Dif
In
SDVO_TVCLKIN +/-
SDVO
Dif
In
SDVO_Red +/-
SDVO
Dif
Needs a series 100nF
-
-
-
-
-
-
100
100
100
100
100
100
0.5
0.5
0.5
Out capacitor to connect to an
SDVO converter chip
Dif
Out capacitor to connect to an
SDVO converter chip
Dif
SDVO_Green +/- SDVO
Needs a series 100nF
SDVO_Blue +/-
SDVO
Needs a series 100nF
Out capacitor to connect to an
SDVO converter chip
If the signals are not used:
All these SDVO signals may be left open.
Remarks:
For the DDC signals, a voltage translator to 3.3V or 5V is needed.
Pair to Pair spacing: 35mil = 0.9mm
Pair to Pair matching: better than 25mm
BUS to BUS spacing: 20mil = 0.5mm
The AC coupling capacitors (100nF / 0402) must be placed near the device for the Tx signals only.
The maximum number of vias per signal is less than 4.
Supported devices:
SiliConImage SIL1362 / SIL1364 (DVI)
Chrontel CH7021 (SDTV / HDTV / CRT)
EMV/EMI filters:
Chokes are needed.
26
DIGITAL-LOGIC AG
SMA200 Manual V1.0
5.4.3.
LVDS
On Module Ext. Ter- Max. Matched
Termination mination Length Ohm Length in
Signal
BUS Type Description
Needed
in mm
mm
LVDS_DDCCLK
LVDS_DDCDAT
LVDS 3.3V DDC signal
LVDS 3.3V DDC signal
PU 10k to
3.3V
PU 10k to
3.3V
-
150
55
55
-
-
150
150
LVDS_DATA[0..3] +/-
LVDS_CLK +/-
LVDS
LVDS
Dif LVDS data signal
Out Connected directly to the
display.
Dif LVDS clock signal
Out Connected directly to the
display.
-
100
100
0.5
-
-
150
0.5
LVDS_VDDEN
LVDS_BKLCTL
LVDS 3.3V LVDS control signal
100k pull
-
-
150
150
55
55
Out To switch on/off the VDD down
of the LVDS display.
LVDS 3.3V Connected to the LVDS
Out display’s PWM-based
backlight inverter
module. No multi-bus
master mode is
supported.
LVDS_BKLEN
LVDS 3.3V Connected to the LVDS
Out display’s backlight
inverter module switch.
100k pull
down
-
-
150
150
55
55
LVDS_CTLA_CLK LVDS 3.3V Connected to the LVDS
I/O display’s PWM-based
backlight inverter
PU 4.7k to
3.3V
module. No multi bus
master mode supported.
LVDS_CTLB_DATA
LVDS 3.3V Connected to the LVDS
I/O display’s PWM-based
backlight inverter
PU 4.7k to
3.3V
-
150
55
module.
If the signals are not used:
All these LVDS signals may be left open.
Remarks:
For the DDC signals, a voltage translator to 3.3V or 5V is needed.
Pair to Pair spacing: 35mil = 0.9mm
Pair to Pair matching: better than 25mm
Bus to Bus spacing:
Maximum via count:
20mil = 0.5mm
0 2.
EMV/EMI filters:
27
DIGITAL-LOGIC AG
SMA200 Manual V1.0
5.4.4.
USB
On Module
Termination mination Length Ohm Length
Ext. Ter- Max.
Matched
Signal
BUS Type Description
Needed
in mm
in mm
USB_[0..7] +/-
USB_OC[0..7]#
USB
Dif Differential USB data signal
pair
-
-
300
100
55
0.2
USB 3.3V USB overcurrent signal
In
PU 10k to
3.3V
-
300
If the signals are not used:
All these USB signals may be left open.
Remarks:
EMV/EMI-filters:
Use a choke and clamping diode on each signal pair.
28
DIGITAL-LOGIC AG
SMA200 Manual V1.0
5.4.5.
Parallel ATA
On Module Ext. Ter- Max. Matched
Terminatio mination Length Ohm Length
Signal
BUS
Type Description
n
Needed
in mm
in mm
PATA_D[15..0] CMOS
5V IDE data signals
I/O
5V IDE address signal.
Out Connect directly to the PATA
device.
5V IDE control signal.
Out Connect directly to the
PATA-device.
5V IDE control signal.
Out Connect directly to the
PATA-device.
5V IDE control signal.
Out Connect directly to the
PATA-device.
5V IDE control signal.
Out Connect directly to the
PATA-device.
Series 33
-
100
55
55
-
PATA_A[0..2]
PATA_IOR#]
PATA_IOW#]
CMOS
CMOS
CMOS
-
-
-
-
-
-
-
-
-
-
-
-
-
-
100
100
100
100
100
100
100
100
100
55
55
55
55
55
55
55
55
PATA_DACK#] CMOS
PATA_CS[3,1] CMOS
PATA_REQ
CMOS 3/5V IDE control signal.
In
Connect directly to the
PATA-device.
3V IDE control signal.
PATA_IORDY CMOS
PU 4.7k to
3.3V
In
Connect directly to the
PATA-device.
3V IDE control signal.
PATA_IRQ
CMOS
PU 10k to
3.3V
In
Connect directly to the
PATA-device.
PATA_PCSEL CMOS
3V GND = SSD works as master PD 4.7k to
In HIGH = SSD works as slave GND
If the signals are not used:
All this PATA signals may be left open.
Remarks:
EMV/EMI filters:
Are not needed.
29
DIGITAL-LOGIC AG
SMA200 Manual V1.0
5.4.6.
LPC BUS
On Module
Termination mination Length Ohm Length
Ext. Ter- Max.
Matched
Signal
BUS
Type Description
Needed
in mm
in mm
LPC_FRAME#
LPC_AD[3..0]
CMOS 3.3V
Out
CMOS 3.3V
I/O
CMOS 3.3V
I/O
CMOS 3.3V
Out
Connect to the LPC device
Connect to the LPC device
-
-
-
100
55
55
55
55
-
-
-
-
100
100
100
-
-
-
LPC_SERIRQ
LPC_CLKOUT[0..1]
Connect to the LPC device PU 10k to
3.3V
Connect to the Firmware Series 33
hub or the SuperIO
Ohm
If the signals are not used:
Leave the pins open.
Remarks:
Use 33 Ohm series termination in each LPC-CLKx-signal.
The LPC_CLKOUTx may drive only 2 loads.
EMV/EMI filters:
Are not needed.
30
DIGITAL-LOGIC AG
SMA200 Manual V1.0
5.4.7.
SMBus
On Module
Termination mination Length Ohm Length
Ext. Ter- Max.
Matched
Signal
BUS
Type Description
Needed
in mm
in mm
SMB_ALERT#
SMB_DATA
CMOS 3.3V Connect to the SMB device PU 10k to
In 3.3V
CMOS 3.3V Connect to the SMB device PU 4.7k to
I/O open drain 3.3V
CMOS 3.3V Connect to the SMB device PU 4.7k to
I/O open drain 3.3V
-
200
55
55
55
-
-
-
200
200
-
-
SMB_CLOCK
If the signals are not used:
The pins can stay open.
Remarks:
The SMB_ALERT# may be used to initiate an SMB event over APIC or an SMI.
Maximum BUS capacitance is 200pF. For higher BUS loads, the SMB repeater PCA9515 from Philips
is recommended. Each new SMB segment must be terminated with 2x 4.7k.
EMV/EMI filters:
Are not needed.
31
DIGITAL-LOGIC AG
SMA200 Manual V1.0
5.4.8.
HDA Audio Interface
On Module Ext. Ter- Max. Matched
Termination mination Length Ohm Length
Signal
BUS
Type Description
Needed
in mm
in mm
HDA_DOCKEN#
CMOS
3.3V HAD dock enable.
Out This signal controls the
external HD audio
-
-
200
55
-
docking isolation logic.
When de-asserted, the
switch is in isolate
mode.
3.3V Reset signals for the
Out external codecs.
3.3V Sample rate at 48kHz to Series 33
Out the codecs.
3.3V 24MHz signal for the
Out external codec.
3.3V Data input from the
HAD_RST#
CMOS
CMOS
CMOS
CMOS
CMOS
Series 33
-
200
200
200
200
55
55
55
55
-
-
-
-
HAD_SYNC
HAD_BITCLK
HAD_SDATAin [1..0]
Series 33
-
Series 33
-
Series
33 Ohm
In
external codecs.
HAD_SDATAout
3.3V Data output from the
Out ext. PC.
3.3V Reset signal for the
codecs.
HAD_DOCKRST# CMOS
-
200
55
-
If the signals are not used:
Remarks:
The 33 Ohm series termination should be placed directly next to the codecs.
Supported Codecs:
EMV/EMI filters:
Are not needed.
32
DIGITAL-LOGIC AG
SMA200 Manual V1.0
5.4.9.
SD / SDIO Interface
On Module Ext. Ter- Max. Matched
Termination mination Length Ohm Length
Signal
BUS
Type Description
Needed
in mm
in mm
SD0_CD#
SD0_CLK
CMOS 3.3V
Out
CMOS 3.3V
Out
Connect to an SDIO PU 10k to
device or card. 3.3V
Connects to the pin of Series 47
the SD/SDIO device or Ohm
card.
-
100
55
55
-
Series
49 Ohm
100
100
100
SD0_CMD#
CMOS 3.3V
I/O
Connects to the pin of PU 10k to
the SD/SDIO device or 3.3V
55
55
card.
Series 47
SD_Data [3..0] CMOS 3.3V
Connects to the pin of
the SD/SDIO device or
card.
Series
49 Ohm
SD0_LED
CMOS 3.3V
Out
CMOS Out
Optional.
SD0_PWR#
Connect to the power
pin on the SD/SDIO
device or card, voltage
translation might be
required.
SD0_WP
CMOS In
Connects to the pin of PU 10k
the SD/SDIO device or to 3.3V
card.
If the signals are not used:
Remarks:
EMV/EMI filters:
Are not needed.
33
DIGITAL-LOGIC AG
SMA200 Manual V1.0
5.4.10. SPI BUS
On Module
Termination
Ext. Ter- Max. Matched
mination Length Ohm Length
Signal
BUS
SPI_MISO CMOS
SPI_MOSI CMOS
Type Description
Needed in mm
in mm
3.3V Connect to the SPI
In device.
3.3V Connect to the SPI
Out device.
3.3V Connect to the SPI
Out device.
f = 17.86 and 31.25MHz
3.3V Connect to the SPI
Out device.
-
150
150
150
55
55
55
-
-
-
SPI_CLK
SPI_CS#
CMOS
CMOS
Series 33 Ohm
150
55
-
If the signals are not used:
Remarks:
EMV/EMI filters:
Are not needed.
34
DIGITAL-LOGIC AG
SMA200 Manual V1.0
5.4.11. SATA Interface (Option)
On Module Ext. Ter-
Termination mination
Needed
Max. Matched
Length Ohm Length
Signal
BUS Type Description
in mm
100
100
in mm
SATA_Tx[0..3] SATA
SATA_Rx[0..3] SATA
Dif
Dif
SATA transmitter pair
SATA receiver pair
Series 10nF
Series 10nF
100
100
-
-
If the signals are not used:
Unused SATA interfaces may be open.
Remarks:
The 10nF capacitors 0402 need to be placed directly at the SATA connector.
Maximum via count is 2 per signal.
BUS to BUS spacing is min. 20mil = 0.5mm
Pair to Pair spacing is min. 35mil = 0.9mm
The SATA_LED# output show the SATA (all ports) activity. The LED must be connected to +3.3V with
a series resistor of 330 Ohm to the “SATA_LED#” signal.
EMV/EMI filters:
Are not needed.
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DIGITAL-LOGIC AG
SMA200 Manual V1.0
5.4.12. GLAN
On Module
Termination mination Length Ohm
Needed in mm
Ext. Ter- Max.
Matched
Length in
mm
Signal
BUS
Type Description
GLAN_TX +/- GLAN
GLAN_RX +/- GLAN
GLAN-CLK +/- GLAN
Dif GLAN TX pair for 1GE
Dif GLAN RX pair for 1GE
Dif GLAN reference clock
pair
-
-
-
100nF
100nF
33 Ohm
250
250
250
95
95
50
0.5
0.5
-
LCI_TXD[2..0] LCI
LCI_RXD[2..0] LCI
3.3V 3x TX signal for
Out 10/100MB
3.3V 3x RX signal for
-
-
-
-
-
-
250
250
250
50
50
50
-
-
-
In
10/100MB
LCI_RST
LCI
3.3V LAN reset/synch
Out
If the signals are not used:
Unused GLAN /LCI interfaces may be open.
Remarks:
The 10nF capacitors 0402 need to be placed directly at the SATA connector.
Maximum via count is 2 per signal.
BUS to BUS spacing is min. 20mil = 0.5mm
Pair to Pair spacing is min. 35mil = 0.9mm
EMV/EMI filters:
Are not needed.
36
DIGITAL-LOGIC AG
SMA200 Manual V1.0
5.4.13. CAN / Serial
On Module
Termination mination Length Ohm Length
Ext. Ter- Max.
Matched
Signal
BUS
Type Description
Needed
in mm
in mm
CAN_TX
CAN_RX
CMOS 3.3V Serial output.
Out
CMOS 3.3V Serial input.
In
Res.
Res.
-
-
-
-
-
-
-
-
If the signals are not used:
Unused interfaces may be open.
Remarks:
EMV/EMI filters:
Are not needed.
37
DIGITAL-LOGIC AG
SMA200 Manual V1.0
5.4.14. PM
On Module Ext. Ter- Max. Matched
Termination mination Length Ohm Length in
Signal
BUS
Type Description
Needed
in mm
mm
WAKE#
CMOS
3.3V To wakeup the system,
In this input must be pulled 3.3V
to GND.
3.3V Indicates a watchdog
Out timeout event with a high
level. Cleared with a
reset and at power-on.
3.3V Low = system is in
Out suspend state S3/S4/S5
(ACPI).
3.3V Low = system is in
Out suspend state S4/S5
(ACPI).
3.3V General purpose I/O pin.
I/O
PU 1k0k
-
-
-
-
-
-
WD_OUT
CMOS
-
-
-
SUS_S3#
CMOS
CMOS
-
-
-
-
-
-
-
-
-
-
-
SUS_S4&5#
GPIO[3..0]
RST_IN#
CMOS
CMOS
-
-
-
-
-
-
-
-
3.3V To reset the system, this PU 10k to
input must be pulled to
GND.
In
3.3V
RST_OUT#
Power-Good
CMOS
CMOS
3.3V Goes low during the reset -
Out phase and stays at high
in the running phase.
-
-
-
-
-
-
-
-
3.3V High = feedback from the PU 10k to
In
external power supplies, 3.3V
that the voltages are in
the valid ranges.
PS_ON
CMOS
CMOS
3.3V High = power supply on
Out the baseboard is
switched on.
-
-
-
-
-
PWRBTN#
3.3V To activate this signal,
PU 1k to
In
the PWR_BTN# must be 3.3V
pulled to GND.
3.3V Low = onmodule BIOs is PU 1k to
BIOS_Disable# CMOS
-
-
-
-
-
-
-
-
In
disabled, an external
BIOS may be connected
over LPC.
3.3V
A20M#
CMOS
CMOS
3.3V Connect to the SuperIO's PU 100k to
In
KBC to switch between
real and protected mode.
5.0V
Speaker
3.3V Speaker
Out
If the signals are not used:
Leave the signal open.
Remarks:
EMV/EMI filters:
Are not needed.
38
DIGITAL-LOGIC AG
SMA200 Manual V1.0
5.4.15. Supply
On Module Ext. Ter- Max. Matched
Termination mination Length Ohm Length in
Signal
BUS
Type Description
Needed
in mm
mm
+5Volt
PWR
In
5V power supply input.
Switched with the
sus4signal
-
-
-
-
-
+5V Always
VCCRTC
PWR
PWR
In
In
5V Always available.
RTC supply 3.0-3.6Volt.
Connect to a lithium
battery, using a 1k series
resistor.
39
DIGITAL-LOGIC AG
SMA200 Manual V1.0
6. SMARTCORE-EXPRESS CONNECTOR SPECIFICATIONS
The connector type is equal to the COMexpress connector. This is a 220pin, surface-mounted connector
with 0.5mm pitch.
Parameter
Condition
Specification
Material
Contact
Housing
Copper alloy
Thermoplast molded compound LCP
Electrical
Current
Voltage
0.5 Amp
50 VAC
Termination Resistance
Insulation Resistance
Mating Cycles
Connector Mating Force
55mΩ max. ∆R = 20mΩ max.
500MΩ
30
0.9N per contact
Mechanical
Connector Un-mating Force 0.1N per contact
Pitch
0.5mm
220
-40°C to 85°C
Number of pins
Temperature rating
The manufacturer of the connector is:
Source on smartCore ꢀ
Carrier Board Connector
TYCO / AMP
Part Name
Part Number
H = 8mm Alternative
H = 5mm Standard
8-6318491-6
3-1827253-6
smartCoreExpress Module Connector
TYCO / AMP
Mating connector
8-1318490-6
The stack height may be defined on the carrier board as either 5 or 8mm using the two different connector
types available.
40
DIGITAL-LOGIC AG
SMA200 Manual V1.0
7. SMARTCORE-EXPRESS VERSUS COMEXPRESS
The smartCoreExpress supports small footprints and especially mobile applications. It is powered by the
modern Intel Atom CPU technology.
To select the correct module, this chapter compares the different PCIe-based module concepts. All concepts
allow minimum (required) and maximum (optional) features.
The following table summarizes the features of all PCIe COMs.
Examples:
2 / 6
1 / 1 (PCIe)
=
=
2 required, 6 optional from each module
1 required, no more optional, 1x PCI lane needed.
Depending on the concept, reduces the number of free PCIe lanes.
ETXexpress
COMexpress
Type 2
Basic form
factor
MicroETXexpress
NanoETXexpress
COMexpress
Type 1
SmartCore
Express
COMexpress
Type 2
Small form factor
Features
Q-Seven
Size [mm]
58 x 65
95 x 125
95 x 95
51 x 80
70 x 70
3770mm2
11875mm2
9025mm2
h = 5 + 13mm
4080mm2
h = 5 + 13mm
4900mm2
h = 12mm
h = 5 + 6mm h = 8 + 13mm
Supply Input
5V
12V
12V
5V-14V
typ. 8W
5V
typ. 5W
typ. 10-30W
typ. 10W
typ. 10W
PCI Express Lanes 2 / 6
4 / 6
2 / 6 (1-5 avail.)
1 / 6
2 / 4
(2 available)
PCI 32bit
–
1 / 1
8 / 8
–
1 / 1 (needs PCIe)
–
–
USB 2.0 Ports
USB Client Port
LAN Port
8 / 8
0 / 1
0 / 1
1 / 1
0 / 1
0 / 4
–
4 / 8
–
4 / 8
0 / 1
8 / 8
–
1 / 1
1 / 1
1 / 1
2 / 4
1 / 1
1 / 1
0 / 1
1 / 1
1 / 1
1 / 1
–
1 / 1 (needs PCIe) 1 / 1
1 / 1 (PCIe)
HD Audio AC97
PATA
0 / 1
1 / 1
0 / 1
0 / 0
1 / 1
–
SATA
2 / 4 (needs PCIe) 0 / 4
2 / 2 (PCIe)
Analog VGA
LVDS Ports
SDVO
0 / 1, not avail.
0 / 1
0 / 1
–
0 / 1
1 / 1
–
0 / 1
2 / 2
1 / 1
–
1 / 1
–
PEG x16
1 / 1, not avail.
1 / 1, not avail.
1 / 1
–
TV Output
LPC, SMB
SDIO/MMC Port
–
0 / 1
–
1 / 1
0 / 1
0 / 1
1 / 1
1 / 1
–
shared with GP
1 / 2, not avail.
shared with GP
1 / 2
Express Card
Support
1 / 2
–
CAN-Bus
0 / 1
–
–
–
–
Connector
220pin
2x 220pin
2x 220pin
1x 220pin
230pin
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DIGITAL-LOGIC AG
SMA200 Manual V1.0
8. INDEX
A
P
AC Coupling Capacitor............................................... 24
Photo of the Top Side of the PCB ..............................18
Pin Definition ..............................................................17
Power Management ...................................................13
Power Supply .............................................................13
B
Block Diagram............................................................ 15
BUS............................................................................ 13
R
Recycling Information...................................................5
RoHS Commitment.......................................................8
C
COM-Express Connector Description ........................ 20
COM-Express Connector Pinout................................ 21
COMexpress Connector Specifications................ 40, 41
Connector Placement................................................. 17
Coprocessor......................................................... 12, 13
S
Safety Precautions .......................................................8
Signal Descriptions.....................................................23
Signal Groups.............................................................25
CAN / Serial...........................................................37
GLAN.....................................................................36
HAD Audio.............................................................32
LPC BUS ...............................................................30
LVDS .....................................................................27
Parallel ATA...........................................................29
PCI-Express ..........................................................25
PM.........................................................................38
SATA .....................................................................35
SD / SDIO..............................................................33
SDVO ....................................................................26
SMBus...................................................................31
SPI BUS ................................................................34
Supply....................................................................39
USB .......................................................................28
Signal Terminology Descriptions................................20
SQS............................................................................10
Standards.....................................................................7
Swiss Association for Quality and Management
D
Design IN ................................................................... 16
Dimensions
Carrier Board Connector ....................................... 19
Component Heights............................................... 19
smartCoreExpress Module.................................... 16
Dimensions & Diagrams............................................. 15
Disclaimer .................................................................... 4
E
EMI / EMC.................................................................. 14
Environmental Protection Statement............................ 4
F
Systems.................................................................10
Swiss Quality..............................................................10
Symbols........................................................................6
Features, Standard .................................................... 11
I
T
ISO 9001:2000........................................................... 10
Technical Specifications.............................................12
Technical Support ........................................................5
Trademarks ..................................................................4
M
Manual, How to Use It.................................................. 2
Matching of the Differential Pairs ............................... 23
W
Warranty.......................................................................5
Watchdog ...................................................................13
Wire Design................................................................23
O
Ordering Codes.......................................................... 14
42
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