Samsung 1H 2011 User Manual
Product Selection Guide  
LCD, Memory and Storage - 1H 2011  
drAM  
Pages 4-12  
samsung.com/semi/dram  
• DDR3 SDRAM  
• DDR2 SDRAM  
• DDR SDRAM  
• SDRAM  
• Mobile DRAM  
• Graphics DDR SDRAM  
• DRAM Ordering  
Information  
FlASH  
Pages 13-15  
samsung.com/semi/flash  
• SLC Flash  
• MLC Flash  
• Solid State Drive  
• SATA SSD  
• SD and microSD Cards  
• moviNAND™ (eMMC)  
• Flash Ordering  
Information  
HiGH-SPeed SrAM  
Pages 16-20  
samsung.com/semi/sram  
• Asychronous  
• Synchronous  
• NtRAM™  
• DDR Synchronous SRAM  
• QDR Synchronous SRAM  
• SRAM Ordering  
• Late-Write RR SRAM  
Information  
Multi-cHiP PAcKAGe  
Page 21  
samsung.com/semi/mcp  
• NAND + MDDR  
• moviNAND + LPDDR2  
• NOR + UtRAM  
StorAGe  
Pages 22-24  
samsung.com/greenmemory • Solid State Drive  
• SATA SSD  
samsung.com/hdd  
samsungodd.com  
• Hard Disk Drive  
• Optical Disk Drive  
lcd  
Pages 25-27  
tftlcd.com  
• Exclusive Digital  
Information Display (E-DID)  
• Performance Digital  
• Basic Digital Information  
Display (B-DID)  
• Tablets  
Information Display (P-DID) • Notebooks/PCs  
• Monitors  
ddr3 SdrAM reGiStered ModuleS  
Density Voltage Organization Part Number  
M393B2873FH0-C(F8/H9/K0)(04/05)  
Composition  
1Gb (128M x8) * 9  
Compliance  
Speed (Mbps)  
Ranks Production  
Lead Free & Halogen Free  
1066/1333/1600  
1
1
2
2
1
1
1
1
4
4
2
2
2
2
1
1
4
4
2
2
4
4
1
2
2
2
4
4
4
4
1
2
2
2
4
4
4
4
1
1
4
4
2
2
2
2
1
1
4
4
2
2
4
4
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
1GB  
1.5V  
128Mx72  
M393B2873GB0-C(F8/H9/K0/MA)(08/09) 1Gb (128M x8) * 9  
Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866  
Lead Free & Halogen Free 1066/1333/1600  
Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866  
Lead Free & Halogen Free 1066/1333/1600  
Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866  
M393B5673FH0-C(F8/H9/K0)(04/05)  
M393B5673GB0-C(F8/H9/K0/MA)(08/09) 1Gb (128M x8) * 18  
M393B5670FH0-C(F8/H9/K0)(04/05) 1Gb (256M x4) * 18  
M393B5670GB0-C(F8/H9/K0/MA)(08/09) 1Gb (256M x4) * 18  
M393B5773CH0-C(F8/H9/K0)(04/05) 2Gb (256M x8) * 9  
M393B5773DH0-C(F8/H9/K0/MA)(08/09) 2Gb (256M x8) * 9  
1Gb (128M x8) * 18  
2GB  
1.5V  
256Mx72  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
1066/1333/1600  
1066/1333/1600/1866  
1066/1333/1600  
M393B5173FH0-C(F8/H9/K0)(04/05)  
M393B5173GB0-C(F8/H9)(08/09)  
M393B5170FH0-C(F8/H9/K0)(04/05)  
1Gb (128M x8) * 36  
1Gb (128M x8) * 36  
1Gb (256M x4) * 36  
Lead Free & Halogen Free, Flip Chip 1066/1333  
Lead Free & Halogen Free  
1066/1333/1600  
M393B5170GB0-C(F8/H9/K0/MA)(08/09) 1Gb (256M x4) * 36  
M393B5273CH0-C(F8/H9/K0)(04/05) 2Gb (256M x8) * 18  
M393B5273DH0-C(F8/H9/K0/MA)(08/09) 2Gb (256M x8) * 18  
M393B5270CH0-C(F8/H9/K0)(04/05) 2Gb (512M x4) * 18  
M393B5270DH0-C(F8/H9/K0/MA)(08/09) 2Gb (512M x4) * 18  
Lead Free & Halogen Free, Flip Chip 1066/1333/1600/1866  
4GB  
8GB  
1.5V  
1.5V  
512Mx72  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
1066/1333/1600  
1066/1333/1600/1866  
1066/1333/1600  
1066/1333/1600/1866  
1066/1333  
M393B1K73CH0-C(F8/H9)(04/05)  
M393B1K73DH0-C(F8/H9)(08/09)  
M393B1K70CH0-C(F8/H9/K0)(04/05)  
2Gb (256M x8) * 36  
2Gb (256M x8) * 36  
2Gb (512M x4) * 36  
1066/1333  
1Gx72  
1066/1333/1600  
1066/1333/1600/1866  
1066/1333  
M393B1K70DH0-C(F8/H9/K0/MA)(08/09) 2Gb (512M x4) * 36  
M393B2K70CM0-C(F8/H9)(04/05)  
M393B2K70DM0-C(F8/H9)(08/09)  
2Gb DDP (1024M x4) * 36  
2Gb DDP (1024M x4) * 36  
16GB  
8GB  
1.5V  
1.5V  
2Gx72  
1Gx72  
1066/1333  
M393B1G70BH0-C(F8/H9/K0/MA)(08/09) 4Gb (1G x4) * 18  
M393B1G73BH0-C(F8/H9/K0/MA)(08/09) 4Gb (512M x8) * 18  
1066/1333/1600/1866  
1066/1333/1600/1866  
1066/1333/1600  
1066/1333/1600  
1066/1333  
M393B2G70AH0-C(F8/H9/K0)(04/05)  
M393B2G70BH0-C(F8/H9/K0)(08/09)  
M393B2G73AH0-C(F8/H9)(04/05)  
M393B2G73BH0-C(F8/H9)(08/09)  
M393B4G70AM0-C(F8/H9)(04/05)  
M393B4G70BM0-C(F8/H9)(08/09)  
4Gb (1024M x4) * 36  
4Gb (1024M x4) * 36  
4Gb (512M x8) * 36  
16GB  
1.5V  
2Gx72  
4Gb (512M x8) * 36  
1066/1333  
4Gb DDP (2048M x4) * 36  
4Gb DDP (2048M x4) * 36  
1066/1333  
32GB  
8GB  
1.5V  
4Gx72  
1Gx72  
1066/1333  
M393B1G70BH0-Y(F8/H9/K0/MA)(08/09) 4Gb (1G x4) * 18  
M393B1G73BH0-Y(F8/H9/K0/MA)(08/09) 4Gb (512M x8) * 18  
1066/1333/1600  
1066/1333/1600  
1066/1333  
1.35V  
M393B2G70AH0-Y(F8/H9)(04/05)  
M393B2G70BH0-Y(F8/H9/K0)(08/09)  
M393B2G73AH0-Y(F8/H9)(04/05)  
M393B2G73AH0-Y(F8/H9)(04/05)  
M393B4G70AM0-Y(F8/H9)(04/05)  
M393B4G70BM0-Y(F8/H9)(08/09)  
M393B5773CH0-Y(F8/H9/K0)(04/05)  
M393B5773DH0-Y(F8/H9/K0)(08/09)  
M393B5173FH0-Y(F8/H9)(04/05)  
M393B5173GB0-Y(F8/H9)(08/09)  
M393B5170FH0-Y(F8/H9/K0)(04/05)  
M393B5170GB0-Y(F8/H9/K0)(08/09)  
M393B5273CH0-Y(F8/H9/K0)(04/05)  
M393B5273DH0-Y(F8/H9/K0)(08/09)  
M393B5270CH0-Y(F8/H9/K0)(04/05)  
M393B5270DH0-Y(F8/H9/K0)(08/09)  
M393B1K73CH0-Y(F8/H9)(04/05)  
M393B1K73DH0-Y(F8/H9)(08/09)  
M393B1K70CH0-Y(F8/H9/K0)(04/05)  
M393B1K70DH0-Y(F8/H9/K0)(08/09)  
M393B2K70CM0-Y(F8/H9)(04/05)  
M393B2K70DM0-Y(F8/H9)(08/09)  
4Gb (1024M x4) * 36  
4Gb (1024M x4) * 36  
4Gb (512M x8) * 36  
4Gb (512M x8) * 36  
4Gb DDP (2048M x4) * 36  
4Gb DDP (2048M x4) * 36  
2Gb (256M x4) * 9  
1066/1333/1600  
1066/1333  
16GB  
1.35V  
2Gx72  
1066/1333  
1066/1333  
32GB  
2GB  
1.35V  
1.35V  
4Gx72  
1066/1333  
1066/1333/1600  
1066/1333/1600  
1066/1333  
256Mx72  
2Gb (256M x4) * 9  
1Gb (128M x8) * 36  
1Gb (128M x8) * 36  
1Gb (256M x4) * 36  
1Gb (256M x4) * 36  
2Gb (256M x8) * 18  
2Gb (256M x8) * 18  
2Gb (512M x4) * 18  
2Gb (512M x4) * 18  
2Gb (256M x8) * 36  
2Gb (256M x8) * 36  
2Gb (512M x4) * 36  
2Gb (512M x4) * 36  
2Gb DDP (1024M x4) * 36  
2Gb DDP (1024M x4) * 36  
Lead Free & Halogen Free, Flip Chip 1066/1333  
Lead Free & Halogen Free 1066/1333  
Lead Free & Halogen Free, Flip Chip 1066/1333/1600  
4GB  
8GB  
1.35V  
512Mx72  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
1066/1333/1600  
1066/1333/1600  
1066/1333/1600  
1066/1333/1600  
1066/1333  
1066/1333  
1.35V  
1.35V  
1Gx72  
2Gx72  
1066/1333/1600  
1066/1333/1600  
1066/1333  
16GB  
1066/1333  
Notes:  
F7 = DDR3-800 (6-6-6)  
04 = IDt B0 register  
05 = Inphi C0 register  
08 = IDt  
09 = Inphi  
* K0 (1600Mbps) available in es only  
F8 = DDR3-1066 (7-7-7)  
H9 = DDR3-1333 (9-9-9)  
K0 = DDR3-1600 (11-11-11)  
MA = DDR3-1866 (13-13-13)  
DDR3 SDRAM  
1H 2011  
samsung.com/semi/dram  
4
ddr3 SdrAM VlP reGiStered ModuleS  
Density Voltage Organization Part Number  
M392B2873FH0-C(F8/H9/K0)(04/05)  
Composition  
Compliance  
Speed (Mbps)  
Ranks  
Production  
1Gb (128M x8) * 9  
Lead Free & Halogen Free  
1066/1333/1600  
1
Now  
1GB  
1.5V  
128Mx72  
Lead Free & Halogen Free,  
Flip Chip  
M392B2873GB0-C(F8/H9/K0/MA)(08/09) 1Gb (128M x8) * 9  
1066/1333/1600/1866  
1066/1333/K0  
1
2
2
1
1
Now  
Now  
Now  
Now  
Now  
M392B5673FH0-C(F8/H9/K0)(04/05)  
M392B5673GB0-C(F8/H9/K0/MA)(08/09) 1Gb (128M x8) * 18  
M392B5670FH0-C(F8/H9/K0)(04/05) 1Gb (256M x8) * 18  
M392B5670GB0-C(F8/H9/K0/MA)(08/09) 1Gb (256M x8) * 18  
1Gb (128M x8) * 18  
Lead Free & Halogen Free  
Lead Free & Halogen Free,  
Flip Chip  
1066/1333/1600/1866  
1066/1333/1600  
Lead Free & Halogen Free  
2GB  
1.5V  
256Mx72  
Lead Free & Halogen Free,  
Flip Chip  
1066/1333/1600/1866  
M392B5773CH0-C(F8/H9/K0)(04/05)  
2Gb (256M x8) * 9  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
1066/1333/1600  
1066/1333/1600/1866  
1066/1333/1600  
1066/1333/1600  
1066/1333/1600/1866  
1066/1333/1600  
1066/1333/1600/1866  
1066/1333  
1
1
2
2
2
1
1
4
4
2
2
1
1
2
2
4
4
1
1
2
2
4
4
1
1
2
2
2
1
1
4
4
2
2
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
M392B5773DH0-C(F8/H9/K0/MA)(08/09) 2Gb (256M x8) * 9  
M392B5170FM0-C(F8/H9/K0)(04/05)  
M392B5273CH0-C(F8/H9/K0)(04/05)  
1Gb DDP (512M x4) * 18  
2Gb (256M x8) * 18  
4GB  
1.5V  
512Mx72  
M392B5273DH0-C(F8/H9/K0/MA)(08/09) 2Gb (256M x8) * 18  
M392B5270CH0-C(F8/H9/K0)(04/05) 2Gb (512M x4) * 18  
M392B5270DH0-C(F8/H9/K0/MA)(08/09) 2Gb (512M x4) * 18  
M392B1K73CM0-C(F8/H9)(04/05)  
M392B1K73DM0-C(F8/H9)(08/09)  
M392B1K70CM0-C(F8/H9/K0)(04/05)  
2Gb DDP (512M x8) * 18  
2Gb DDP (512M x8) * 18  
1066/1333  
2Gb DDP (1024M x4) * 18 Lead Free & Halogen Free  
1066/1333/1600  
1066/1333/1600/1866  
1066/1333/1600/1866  
1066/1333/1600/1866  
1066/1333/1600  
1066/1333/1600/1866  
1066/1333  
8GB  
1.5V  
1Gx72  
M392B1K70DM0-C(F8/H9/K0/MA)(08/09) 2Gb DDP (1024M x4) * 18 Lead Free & Halogen Free  
M392B1G73BH0-C(F8/H9/K0/MA)(08/09) 4Gb (512M x8) * 18  
M392B1G70BH0-C(F8/H9/K0/MA)(08/09) 4Gb (1024M x4) * 18  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
M392B2G70AM0-C(F8/H9/K0)(04/05)  
4Gb DDP (2048M x4) * 18 Lead Free & Halogen Free  
M392B2G70BM0-C(F8/H9/K0/MA)(08/09) 4Gb DDP (2048M x4) * 18 Lead Free & Halogen Free  
16GB  
8GB  
1.5V  
2Gx72  
M392B2G73AM0-C(F8/H9)(04/05)  
M392B2G73BM0-C(F8/H9)(08/09)  
M392B1G73BH0-Y(F8/H9/K0)(08/09)  
M392B1G70BH0-Y(F8/H9/K0)(08/09)  
M392B2G70AM0-Y(F8/H9)(04/05)  
M392B2G70BM0-Y(F8/H9/K0)(08/09)  
M392B2G70AM0-Y(F8/H9)(04/05)  
M392B2G70BM0-Y(F8/H9)(08/09)  
M392B5773CH0-Y(F8/H9/K0)(04/05)  
M392B5773DH0-Y(F8/H9/K0)(08/09)  
M392B5170FM0-Y(F8/H9/K0)(04/05)  
M392B5273CH0-Y(F8/H9/K0)(04/05)  
M392B5273DH0-Y(F8/H9/K0)(08/09)  
M392B5270CH0-Y(F8/H9/K0)(04/05)  
M392B5270DH0-Y(F8/H9/K0)(08/09)  
M392B1K73CM0-Y(F8/H9/K0)(04/05)  
M392B1K73DM0-Y(F8/H9)(08/09)  
M392B1K70CM0-Y(F8/H9/K0)(04/05)  
M392B1K70DM0-Y(F8/H9/K0)(08/09)  
4Gb DDP (1024M x8) * 18 Lead Free & Halogen Free  
4Gb DDP (1024M x8) * 18 Lead Free & Halogen Free  
1066/1333  
4Gb (512M x8) * 18  
4Gb (1024M x4) * 18  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
1066/1333/1600  
1066/1333/1600  
1066/1333  
1.35V  
1.35V  
1.35V  
1Gx72  
4Gb DDP (2048M x4) * 18 Lead Free & Halogen Free  
4Gb DDP (2048M x4) * 18 Lead Free & Halogen Free  
4Gb DDP (1024M x8) * 18 Lead Free & Halogen Free  
4Gb DDP (1024M x8) * 18 Lead Free & Halogen Free  
1066/1333/1600  
1066/1333  
16GB  
2GB  
2Gx72  
1066/1333  
2Gb (256M x8) * 9  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
1066/1333/1600  
1066/1333/1600  
1066/1333/1600  
1066/1333/1600  
1066/1333/1600  
1066/1333/1600  
1066/1333/1600  
1066/1333/1600  
1066/1333  
256Mx72  
2Gb (256M x8) * 9  
1Gb DDP (512M x4) * 18  
2Gb (256M x8) * 18  
2Gb (256M x8) * 18  
2Gb (512M x4) * 18  
2Gb (512M x4) * 18  
2Gb DDP (512M x8) * 18  
2Gb DDP (512M x8) * 18  
4GB  
1.35V  
512Mx72  
8GB  
1.35V  
1Gx72  
2Gb DDP (1024M x4) * 18 Lead Free & Halogen Free  
2Gb DDP (1024M x4) * 18 Lead Free & Halogen Free  
1066/1333/1600  
1066/1333/1600  
Notes:  
F7 = DDR3-800 (6-6-6)  
F8 = DDR3-1066 (7-7-7)  
H9 = DDR3-1333 (9-9-9)  
K0 = DDR3-1600 (11-11-11)  
MA = DDR3-1866 (13-13-13)  
04 = IDt B0 register  
05 = Inphi C0 register  
08 = IDt  
09 = Inphi  
samsung.com/semi/dram  
1H 2011  
DDR3 SDRAM  
5
ddr3 SdrAM unBuFFered ModuleS  
Density Voltage Organization Part Number  
M378B2873FH0-C(F8/H9/K0)  
Composition  
Compliance  
Speed (Mbps)  
Ranks Production  
1Gb (128M x8) * 8  
1Gb (128M x8) * 8  
1Gb (128M x8) * 16  
1Gb (128M x8) * 16  
Lead Free & Halogen Free  
Lead Free & Halogen Free,  
Flip Chip  
Lead Free & Halogen Free  
Lead Free & Halogen Free,  
Flip Chip  
1066/1333/1600  
1
1
2
2
Now  
Now  
Now  
Now  
1GB  
1.5V  
128Mx64  
M378B2873GB0-C(F8/H9/K0/MA)  
M378B5673FH0-C(F8/H9/K0)  
M378B5673GB0-C(F8/H9/K0/MA)  
1066/1333/1600/1866  
1066/1333/1600  
1066/1333/1600/1866  
2GB  
1.5V  
256Mx64  
M378B5773CH0-C(F8/H9/K0)  
M378B5773DH0-C(F8/H9/K0/MA)  
M378B5273CH0-C(F8/H9/K0)  
M378B5273DH0-C(F8/H9/K0/MA)  
M378B5173BH0-C(F8/H9/K0/MA)  
M378B1G73AH0-C(F8/H9/K0)  
M378B1G73BH0-C(F8/H9/K0/MA)  
2Gb (256M x8) * 8  
2Gb (256M x8) * 8  
2Gb (256M x8) * 16  
2Gb (256M x8) * 16  
4Gb (512M x8) * 8  
4Gb (512M x8) * 16  
4Gb (512M x8) * 16  
Lead Free & Halogen Free  
1066/1333/1600  
1
1
2
2
1
2
2
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
1066/1333/1600/1866  
1066/1333/1600  
512Mx64  
1024Mx64  
1024Mx64  
4GB  
8GB  
1.5V  
1.5V  
1066/1333/1600/1866  
1066/1333/1600/1866  
1066/1333/1600  
1066/1333/1600/1866  
ddr3 SdrAM unBuFFered ModuleS (ecc)  
Density Voltage Organization Part Number  
Composition  
Compliance  
Speed (Mbps)  
Ranks Production  
M391B2873FH0-C(F8/H9/K0)  
1Gb (128M x8) * 9  
1Gb (128M x8) * 9  
Lead Free & Halogen Free  
Lead Free & Halogen Free,  
Flip Chip  
1066/1333/1600  
1066/1333/1600/1866  
1
1
Now  
Now  
1GB  
2GB  
1.5V  
1.5V  
128Mx72  
256Mx72  
M391B2873GB0-C(F8/H9/K0/MA)  
M391B5673FH0-C(F8/H9/K0)  
M391B5773CH0-C(F8/H9/K0)  
M391B5773DH0-C(F8/H9/K0/MA)  
M391B5273CH0-C(F8/H9/K0)  
M391B5273DH0-C(F8/H9/K0/MA)  
M391B5173BH0-C(F8/H9/K0/MA)  
M391B1G73AH0-C(F8/H9/K0)  
M391B1G73BH0-C(F8/H9/K0/MA)  
M391B5173BH0-Y(F8/H9/K0)  
M391B1G73AH0-Y(F8/H9/K0)  
M391B1G73BH0-Y(F8/H9/K0)  
M391B2873FH0-Y(F8/H9/K0)  
1Gb (128M x8) * 18  
2Gb (256M x8) * 9  
2Gb (256M x8) * 9  
2Gb (256M x8) * 18  
2Gb (256M x8) * 18  
4Gb (512M x8) * 9  
4Gb (512M x8) * 18  
4Gb (512M x8) * 18  
4Gb (512M x8) * 9  
4Gb (512M x8) * 18  
4Gb (512M x8) * 18  
1Gb (128M x8) * 9  
Lead Free & Halogen Free  
1066/1333/1600  
2
1
1
2
2
1
2
2
1
2
2
1
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
1066/1333/1600  
1066/1333/1600/1866  
1066/1333/1600  
4GB  
4GB  
8GB  
4GB  
8GB  
1.5V  
512Mx72  
1066/1333/1600/1866  
1066/1333/1600/1866  
1066/1333/1600  
1.5V  
1024Mx64  
1024Mx72  
1024Mx64  
1024Mx72  
1.5V  
1066/1333/1600/1866  
1066/1333/1600  
1.35V  
1.35V  
1066/1333/1600  
1066/1333/1600  
Lead Free & Halogen Free  
Lead Free & Halogen Free,  
Flip Chip  
1066/1333/1600  
1GB  
2GB  
1.35V  
128Mx72  
M391B2873GB0-Y(F8/H9/K0)  
1Gb (128M x8) * 9  
1066/1333/1600  
1
Now  
M391B5673FH0-Y(F8/H9/K0)  
M391B5773CH0-Y(F8/H9/K0)  
M391B5773DH0-Y(F8/H9/K0)  
M391B5273CH0-Y(F8/H9/K0)  
M391B5273DH0-Y(F8/H9/K0)  
1Gb (128M x8) * 18  
2Gb (256M x8) * 9  
2Gb (256M x8) * 9  
2Gb (256M x8) * 18  
2Gb (256M x8) * 18  
Lead Free & Halogen Free  
1066/1333/1600  
1066/1333/1600  
1066/1333/1600  
1066/1333/1600  
1066/1333/1600  
2
1
1
2
2
Now  
Now  
Now  
Now  
Now  
1.35V  
1.35V  
256Mx72  
512Mx72  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
4GB  
Notes:  
F7 = DDR3-800 (6-6-6)  
F8 = DDR3-1066 (7-7-7)  
H9 = DDR3-1333 (9-9-9)  
K0 = DDR3-1600 (11-11-11)  
MA = DDR3-1866 (13-13-13)  
ddr3 SdrAM SodiMM ModuleS  
Density  
Voltage Organization Part Number  
Composition  
Compliance  
Speed (Mbps)  
Ranks Production  
M471B2873FHs-C(F8/H9/K0)  
M471B2873GB0-C(F8/H9/K0/MA)  
M471B5673FH0-C(F8/H9/K0)  
M471B5673GB0-C(F8/H9/K0/MA)  
1Gb (128M x8) * 8  
1Gb (128M x8) * 8  
1Gb (128M x8) * 16  
1Gb (128M x8) * 16  
Lead Free & Halogen Free  
Lead Free & Halogen Free,  
Flip Chip  
Lead Free & Halogen Free  
Lead Free & Halogen Free,  
Flip Chip  
1066/1333/1600  
1
1
2
2
Now  
Now  
Now  
Now  
1GB  
1.5V  
128Mx64  
1066/1333/1600/1866  
1066/1333/1600  
1066/1333/1600/1866  
2GB  
1.5V  
256Mx64  
M471B5773CHs-C(F8/H9/K0)  
M471B5773DH0-C(F8/H9/K0/MA)  
M471B5273CH0-C(F8/H9/K0)  
M471B5273DH0-C(F8/H9/K0/MA)  
M471B5173BH0-C(F8/H9/K0)  
M471B1G73AH0-C(F8/H9/K0)  
M471B1G73BH0-C(F8/H9/K0/MA)  
M471B5773CHs-Y(F8/H9)  
2Gb (256M x8) * 8  
2Gb (256M x8) * 8  
2Gb (256M x8) * 16  
2Gb (256M x8) * 16  
4Gb (512M x8) * 8  
4Gb (512M x8) * 16  
4Gb (512M x8) * 16  
2Gb (256M x8) * 8  
2Gb (256M x8) * 8  
2Gb (256M x8) * 16  
2Gb (256M x8) * 16  
4Gb (512M x8) * 8  
4Gb (512M x8) * 16  
4Gb (512M x8) * 16  
Lead Free & Halogen Free  
1066/1333/1600  
1066/1333/1600/1866  
1066/1333/1600  
1066/1333/1600/1866  
1066/1333/1600  
1066/1333/1600  
1066/1333/1600/1866  
1066/1333/1600  
1066/1333/1600  
1066/1333/1600  
1066/1333/1600  
1066/1333/1600  
1066/1333/1600  
1066/1333/1600  
1
1
2
2
1
2
2
1
1
2
2
1
2
2
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
Lead Free & Halogen Free  
4GB  
4GB  
8GB  
1.5V  
1.5V  
1.5V  
512Mx64  
1024Mx64  
1024Mx64  
2GB  
1.35V  
256Mx64  
M471B5773DH0-Y(F8/H9/K0)  
M471B5273CH0-Y(F8/H9)  
4GB  
4GB  
8GB  
1.35V  
1.35V  
1.35V  
512Mx64  
1024Mx64  
1024Mx64  
M471B5273DH0-Y(F8/H9/K0)  
M471B5173BH0-Y(F8/H9/K0)  
M471B1G73AH0-Y(F8/H9/K0)  
M471B1G73BH0-Y(F8/H9/K0)  
Notes:  
F7 = DDR3-800 (6-6-6)  
F8 = DDR3-1066 (7-7-7)  
H9 = DDR3-1333 (9-9-9) K0 = DDR3-1600 (11-11-11) MA = DDR3-1866 (13-13-13)  
DDR3 SDRAM  
1H 2011  
samsung.com/semi/dram  
6
ddr3 SdrAM coMPonentS  
Density Voltage Organization Part Number  
# Pins-Package Compliance  
Speed (Mbps)  
Dimensions Production  
K4B1G0446F-HC(F8/H9/K0)  
K4B1G0446G-BC(F8/H9/K0/MA)  
K4B1G0846F-HC(F8/H9/K0)  
K4B1G0846G-BC(F8/H9/K0/MA)  
78 Ball -FBGA  
78 Ball -FBGA  
78 Ball -FBGA  
78 Ball -FBGA  
Lead Free & Halogen Free 1066/1333/1600  
Lead Free & Halogen Free,  
Flip Chip  
7.5x11mm  
7.5x11mm  
7.5x11mm  
7.5x11mm  
Now  
Now  
Now  
Now  
1Gb  
1Gb  
1.5V  
1.5V  
256M x4  
128M x8  
1066/1333/1600/1866  
Lead Free & Halogen Free 1066/1333/1600  
Lead Free & Halogen Free,  
1066/1333/1600/1866  
Flip Chip  
Lead Free & Halogen Free,  
Flip Chip  
1Gb  
2Gb  
1.5V  
1.5V  
128M x16  
512M x4  
K4B1G1646G-BC(F8/H9/K0/MA/NB) 96 Ball -FBGA  
1066/1333/1600/1866/2133 7.5x13.3mm Now  
K4B2G0446C-HC(F8/H9/K0)  
K4B2G0446D-HC(F8/H9/K0/MA)  
K4B2G0846C-HC(F8/H9/K0)  
K4B2G0846D-HC(F8/H9/K0/MA)  
K4B2G1646C-HC(F8/H9/K0/MA)  
K4B4G0446A-HC(F8/H9/K0)  
K4B4G0446B-HC(F8/H9/K0/MA)  
K4B4G0846A-HC(F8/H9/K0)  
K4B4G0846B-HC(F8/H9/K0/MA)  
K4B1G0446F-HY(F8/H9/K0)  
78 Ball -FBGA  
78 Ball -FBGA  
78 Ball -FBGA  
78 Ball -FBGA  
96 Ball -FBGA  
78 Ball -FBGA  
78 Ball -FBGA  
78 Ball -FBGA  
78 Ball -FBGA  
78 Ball -FBGA  
Lead Free & Halogen Free 1066/1333/1600  
Lead Free & Halogen Free 1066/1333/1600/1866  
Lead Free & Halogen Free 1066/1333/1600  
Lead Free & Halogen Free 1066/1333/1600/1866  
Lead Free & Halogen Free 1066/1333/1600/1866  
Lead Free & Halogen Free 1066/1333/1600  
Lead Free & Halogen Free 1066/1333/1600/1866  
Lead Free & Halogen Free 1066/1333/1600  
Lead Free & Halogen Free 1066/1333/1600/1866  
Lead Free & Halogen Free 1066/1333/1600  
Lead Free & Halogen Free,  
1066/1333/1600  
Flip Chip  
Lead Free & Halogen Free 1066/1333  
Lead Free & Halogen Free,  
1066/1333/1600  
Flip Chip  
7.5x11mm  
7.5x11mm  
7.5x11mm  
7.5x11mm  
Now  
Now  
Now  
Now  
2Gb  
2Gb  
4Gb  
1.5V  
1.5V  
1.5V  
256M x8  
128Mx16  
1024M x4  
7.5x13.3mm Now  
7.5x11mm  
7.5x11mm  
7.5x11mm  
7.5x11mm  
7.5x11mm  
Now  
Now  
Now  
Now  
Now  
4Gb  
1Gb  
1.5V  
512M x8  
256M x4  
1.35V  
K4B1G0446G-BY(F8/H9/K0)  
K4B1G0846F-HY(F8/H9/K0)  
K4B1G0846G-BY(F8/H9/K0)  
78 Ball -FBGA  
78 Ball -FBGA  
78 Ball -FBGA  
7.5x11mm  
7.5x11mm  
7.5x11mm  
Now  
Now  
Now  
1Gb  
1.35V  
128M x8  
K4B2G0446C-HY(F8/H9/K0)  
K4B2G0446D-HY(F8/H9/K0)  
K4B2G0846C-HY(F8/H9/K0)  
K4B2G0846D-HY(F8/H9/K0)  
K4B4G0446A-HY(F8/H9/K0)  
K4B4G0446B-HY(F8/H9/K0)  
K4B4G0846A-HY(F8/H9/K0)  
K4B4G0846B-HY(F8/H9/K0)  
78 Ball -FBGA  
78 Ball -FBGA  
78 Ball -FBGA  
78 Ball -FBGA  
78 Ball -FBGA  
78 Ball -FBGA  
78 Ball -FBGA  
78 Ball -FBGA  
Lead Free & Halogen Free 1066/1333/1600  
Lead Free & Halogen Free 1066/1333/1600  
Lead Free & Halogen Free 1066/1333/1600  
Lead Free & Halogen Free 1066/1333/1600  
Lead Free & Halogen Free 1066/1333/1600  
Lead Free & Halogen Free 1066/1333/1600  
Lead Free & Halogen Free 1066/1333/1600  
Lead Free & Halogen Free 1066/1333/1600  
7.5x11mm  
7.5x11mm  
7.5x11mm  
7.5x11mm  
7.5x11mm  
7.5x11mm  
7.5x11mm  
7.5x11mm  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
2Gb  
2Gb  
4Gb  
1.35V  
1.35V  
1.35V  
1.35V  
512M x4  
256M x8  
1024M x4  
512M x8  
4Gb  
Notes:  
F7 = DDR3-800 (6-6-6)  
F8 = DDR3-1066 (7-7-7)  
H9 = DDR3-1333 (9-9-9)  
K0 = DDR3-1600 (11-11-11)  
MA = DDR3-1866 (13-13-13)  
NB = DDR3-2133 (14-14-14)  
* MA, and NB are available in es only  
ddr2 SdrAM reGiStered ModuleS  
Density  
Organization  
Part Number  
Composition  
Compliance  
Speed (Mbps)  
Register  
Rank  
Production  
1GB  
128Mx72  
M393t2863FBA-C(e6/F7)  
M393t5660FBA-C(e6/F7)  
M393t5663FBA-C(e6/e7)  
M393t5160FBA-C(e6/F7)  
(128M x8)*9  
(256M x4)*18  
(128M x8)*18  
(256M x4)*36  
Lead free  
Lead free  
Lead free  
Lead free  
667/800  
667/800  
667/800  
667/800  
Y
Y
Y
Y
1
1
2
2
Now  
Now  
Now  
Now  
2GB  
256Mx72  
512Mx72  
4GB  
Notes:  
e6 = PC2-5300 (DDR2-667 @ CL=5)  
F7 = PC2-6400 (DDR2-800 @ CL=6)  
e7 = PC2-6400 (DDR2-800 @ CL=5)  
Voltage = 1.8V  
ddr2 SdrAM VlP reGiStered ModuleS  
Density  
Organization  
Part Number  
Composition  
Compliance  
Speed (Mbps)  
Register  
Rank  
Production  
2GB  
256Mx72  
M392t5660FBA-Ce6  
(256M x4)*18  
Lead free  
667  
Y
1
Now  
ddr2 SdrAM FullY BuFFered ModuleS  
Density  
Organization  
Part Number  
Composition  
Compliance  
Speed (Mbps)  
Voltage  
Rank  
Production  
2GB  
256Mx72  
M395t5663FB4-Ce68  
M395t5160FB4-Ce68  
M395t5163FB4-Ce68  
(128M x8)*18  
(256M x4)*36  
(128M x8)*36  
Lead free  
Lead free  
Lead free  
667  
667  
667  
1.8V  
1.8V  
1.8V  
2
2
4
Now  
Now  
Now  
4GB  
512Mx72  
Notes:  
e6 = PC2-5300 (DDR2-667 @ CL=5)  
Voltage = 1.8V (AMB Voltage = 1.5V)  
AMB = IDt L4  
samsung.com/semi/dram  
1H 2011  
DDR3 & DDR2 SDRAM  
7
ddr2 SdrAM unBuFFered ModuleS  
Density  
Organization  
Part Number  
Composition  
Compliance  
Speed (Mbps)  
Rank  
Production  
1GB  
2GB  
128Mx64  
256Mx64  
M378t2863FBs-C(e6/F7/e7)  
M378t5663FB3-C(e6/F7/e7)  
(128M x8)*8  
(128M x8)*16  
Lead free  
Lead free  
667/800  
667/800  
1
2
Now  
Now  
Notes:  
e6 = PC2-5300 (DDR2-667 @ CL=5)  
e7 = PC2-6400 (DDR2-800 @ CL=5)  
F7 = PC2-6400 (DDR2-800 @ CL=6)  
Voltage = 1.8V  
ddr2 SdrAM unBuFFered ModuleS (ecc)  
Density  
Organization  
Part Number  
Composition  
Compliance  
Speed (Mbps)  
Rank  
Production  
1GB  
2GB  
128Mx72  
256Mx64  
M391t2863FB3-C(e6/F7)  
M391t5663FB3-C(e6/F7)  
(128Mx8)*9  
(128Mx8)*18  
Lead free  
Lead free  
667/800  
667/800  
1
2
Now  
Now  
Notes:  
e6 = PC2-5300 (DDR2-667 @ CL=5)  
e7 = PC2-6400 (DDR2-800 @ CL=5)  
F7 = PC2-6400 (DDR2-800 @ CL=6)  
Voltage = 1.8V  
ddr2 SdrAM SodiMM ModuleS  
Density  
Organization  
Part Number  
Composition  
Compliance  
Speed (Mbps)  
Rank  
Production  
1GB  
2GB  
128Mx64  
256Mx64  
M470t2863FB3-C(e6/F7/e7)  
M470t5663FB3-C(e6/F7/e7)  
(64Mx16)*8  
(128M x8)*8  
Lead free  
Lead free  
667/800  
667/800  
2
2
Now  
Now  
Notes:  
e6 = PC2-5300 (DDR2-667 @ CL=5)  
e7 = PC2-6400 (DDR2-800 @ CL=5)  
F7 = PC2-6400 (DDR2-800 @ CL=6)  
Voltage = 1.8V  
ddr2 SdrAM coMPonentS  
Density Organization  
Part Number  
# Pins-Package Dimensions  
Package  
Speed (Mbps)  
Production  
256Mb  
16Mx16  
128M x4  
64M x8  
K4t56163QN-HC(e6/F7/e7/F8)  
K4t51043QI-HC(e6/F7/e7)  
84-FBGA  
60-FBGA  
60-FBGA  
84-FBGA  
60-FBGA  
60-FBGA  
84-FBGA  
60-FBGA  
60-FBGA  
84-FBGA  
7.5x12.5mm  
7.5x9.5mm  
7.5x9.5mm  
7.5x12.5mm  
7.5x9.5mm  
7.5x9.5mm  
7.5x12.5mm  
7.5x9.5mm  
7.5x9.5mm  
7.5x12.5mm  
Lead free & Halogen free  
Lead free & Halogen free  
Lead free & Halogen free  
Lead free & Halogen free  
Lead free & Halogen free  
Lead free & Halogen free  
Lead free & Halogen free  
Lead free & Halogen free  
Lead free & Halogen free  
Lead free & Halogen free  
667/800/1066  
667/800  
Now  
Now  
Now  
Now  
Q3  
K4t51083QI-HC(e6/F7/e7/F8)  
K4t51163QI-HC(e6/F7/e7/F8)  
K4t51043QJ-HC(e6/F7/e7)  
K4t51083QJ-HC(e6/F7/e7/F8)  
K4t51163QJ-HC(e6/F7/e7/F8)  
K4t1G044QF-BC(e6/F7/e7)  
K4t1G084QF-BC(e6/F7/e7/F8)  
K4t1G164QF-BC(e6/F7/e7/F8)  
667/800/1066  
667/800/1066  
667/800  
32M x16  
128M x4  
64M x8  
512Mb  
667/800/1066  
667/800/1066  
667/800  
Q3  
32M x16  
256M x4  
128M x8  
64M x16  
Q3  
Now  
Now  
Now  
1Gb  
667/800/1066  
667/800/1066  
Notes:  
e6 = DDR2-667 (5-5-5)  
F7 = DDR2-800 (6-6-6)  
e7 = DDR2-800 (5-5-5)  
F8 = DDR2-1066 (7-7-7)  
Voltage = 1.8V  
Package Type  
H = FBGA (Lead-free & Halogen-free)  
B = FBGA (Lead-free & Halogen-free, Flip Chip)  
ddr SdrAM coMPonentS  
Density  
Organization  
Part Number  
# Pins - Package  
Speed (Mbps)  
K4H510438J-LCB3/B0  
K4H510438J-HCCC/B3  
K4H510838J-LCCC/B3  
K4H510838J-HCCC/B3  
K4H511638J-LCCC/B3  
K4H560438N-LCB3/B0  
K4H560838N-LCCC/B3  
K4H561638N-LCCC/B3  
K4H281638o-LCCC  
66-tsoP  
60-FBGA  
66-tsoP  
60-FBGA  
66-tsoP  
66-tsoP  
66-tsoP  
66-tsoP  
66-tsoP  
266/333  
333/400  
333/400  
333/400  
333/400  
266/333  
333/400  
333/400  
400  
128Mx4  
512Mb  
64Mx8  
32Mx16  
64Mx4  
32Mx8  
16Mx16  
8Mx16  
256Mb  
128Mb  
Notes:  
B0 = DDR266 (133MHz @ CL=2.5)  
A2 = DDR266 (133MHz @ Cl=2)  
B3 = DDR333 (166MHz @ CL=2.5) CC = DDR400 (200MHz @ CL=3)  
SdrAM coMPonentS  
Density  
Organization  
Part Number  
# Pins - Package  
Speed (Mbps)  
Refresh  
64Mx4  
32Mx8  
16Mx16  
16Mx8  
8Mx16  
K4s560432N-LC(L)75000  
K4s560832N-LC(L)75000  
K4s561632N-LC(L)(75/60)000  
K4s280832o-LC(L)75000  
K4s281632o-LC(L)(75/60)000  
54-tsoP  
54-tsoP  
54-tsoP  
54-tsoP  
54-tsoP  
133  
8K  
8K  
8K  
4K  
4K  
256Mb  
133  
133/166  
133  
133/166  
128Mb  
Notes:  
L = Commercial temp., Low Power  
For Industrial temperature, check with ssI Marketing  
Banks: 4  
All products are Lead Free  
Voltage: 3.3V  
speed: PC133 (133MHz CL=3/PC100 CL2)  
DDR2, DDR & SDRAM Components  
1H 2011  
samsung.com/semi/dram  
8
MoBile drAM coMPonentS  
Type  
Density  
Organization  
Part Number  
Package  
Power  
Production  
32Mx16  
K4M51163PI-BG(1)  
K4M51323PI-HG(1)  
K4X56163PN-FG(1)  
K4X56323PN-8G(1)  
K4X51163PI-FG(1)  
K4X51323PI-8G(1)  
K4X1G323PF-8G(1)  
K4X2G323PC-8G(1)  
K4X4G303PC-AG(1)  
K4X4G303PC-7G(1)  
K4P1G324ee-AG(1)  
K4P2G324eC-AG(1)  
K3Pe3e300M-XG(1)  
K4P4G304eC-AG(1)  
K4P4G154eC-FG(1)  
K4P4G324eB-FG(1)  
K3Pe4e400M-XG(1)  
K3Pe4e400A-XG(1)  
K4P8G304eC-FC(1)  
K3Pe8e800M-XG(1)  
K3Pe7e700M-XG(1)  
K3Pe7e700A-XG(1)  
K3Pe0e00M-XG(1)  
54-FBGA  
1.8V  
1.8V  
1.8V  
1.8V  
1.8V  
1.8V  
1.8V  
1.8V  
1.8V  
1.8V  
1.2V  
1.2V  
1.2V  
1.2V  
1.2V  
1.2V  
1.2V  
1.2V  
1.2V  
1.2V  
1.2V  
1.2V  
1.2V  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
Now  
MsDR  
512Mb  
16Mx32  
90-FBGA  
16Mx16  
60-FBGA  
256Mb  
512Mb  
8Mx32  
90-FBGA  
32Mx16  
60-FBGA  
16Mx32  
90-FBGA  
MDDR  
1Gb  
2Gb  
32Mx32  
90-FBGA  
64Mx32  
90-FBGA  
x32 (2Cs, 2CKe)  
x32 (2Cs, 2CKe)  
1CH x32  
168-FBGA, 12x12 PoP, DDP  
240-FBGA, 14x14 PoP, DDP  
168-FBGA, 12x12 PoP  
4Gb  
1Gb  
2Gb  
1CH x32  
168-FBGA, 12x12 PoP  
2CH x32/ch  
1CH x32  
216-FBGA, 12x12 PoP  
168-FBGA, 12x12 PoP, DDP, 64Mx32*2  
134-FBGA, 11x11.5 PoP, DDP, 128x16*2  
168-FBGA, 12x12 PoP, MoNo, 128Mx32  
216-FBGA, 12x12 PoP, QDP, 64Mx32*2  
240-FBGA, 14x14 PoP, QDP, 64Mx32*2  
134-FBGA, 11x11.5 PoP, QDP, 128x16*4  
216-FBGA, 12x12 PoP, QDP, 64Mx32*4  
216-FBGA, 12x12 PoP, DDP, 128Mx32*2  
240-FBGA, 14x14 PoP, DDP, 128Mx32*2  
216-FBGA, 12x12 PoP, QDP, 128Mx32*4  
1CH x32  
4Gb  
1CH x32  
LPDDR2  
2CH x32/ch  
2CH x32/ch  
1CH x32  
2CH x32/ch  
2CH x32/ch  
2CH x32/ch  
2CH x32/ch  
8Gb  
16Gb  
Notes:  
(1) Speed:  
Mobile-sDR  
All products offered at extended, Low, i-tCsR & PAsR & Ds (temp, Power)  
Mobile-DDR  
LPDDR2  
60: 166MHz, CL3  
75: 133MHz, CL3  
D8: 200MHz, CL3  
C6: 166MHz, CL3  
C1: 800Mbps  
GrAPHicS drAM coMPonentS  
Type  
Density  
Organization  
Part Number  
Package  
VDD/VDDQ  
Speed Bin (MHz)  
K4G20325FC-HC(1)  
K4G20325FC-HC04  
K4G20325FC-HC03  
K4G10325Fe-HC(1)  
K4G10325Fe-HC04  
K4J10324Ke-HC(1)  
K4J52324KI-HC(1)  
K4W2G1646C-HC(1)  
K4W1G1646G-BC(1)  
K4N1G164Qe-HC(1)  
170-FBGA  
170-FBGA  
170-FBGA  
170-FBGA  
170-FBGA  
136-FBGA  
136-FBGA  
96 FBGA  
1.5/1.5V  
2000/2500/3000  
1800  
2Gb  
64Mx32  
1.35V/1.35V  
1.35V/1.35V  
1.5/1.5V  
GDDR5  
2000  
2000/2500  
1800  
1Gb  
32Mx32  
1.35V/1.35V  
1.8V/1.8V  
1.8/1.8V  
1Gb  
32Mx32  
16Mx32  
128Mx16  
64Mx16  
64Mx16  
700/800/1000/1200  
700/800/1000  
800/933/1066  
800/933/1066  
400/500  
GDDR3  
gDDR3  
512Mb  
2Gb  
1.5V/1.5V  
1.5V/1.5V  
1.8/1.8V  
1Gb  
1Gb  
96 FBGA  
84-FBGA  
gDDR2  
Notes:  
Package  
H: FBGA (Halogen Free & Lead Free)  
B: FBGA (Halogen Free & Lead Free)  
(1) Speeds (clock cycle - speed bin)  
03: 0.3ns (3000MHz)  
04: 0.4ns (2500MHz)  
05: 0.5ns (2000MHz)  
5C: 0.555 (1800MHz)  
08: 0.83ns (1200MHz)  
1A: 1ns (1000MHz GDDR3)  
1A: 1ns (1066MHz gDDR3) 14: 1.429ns (700MHz)  
11: 1.1ns (933MHz)  
12: 1.25ns (800MHz)  
20: 2.0ns (500MHz)  
25: 2.5ns (400MHz)  
samsung.com/semi/dram  
1H 2011  
Mobile & Graphics DRAM Components  
9
coMPonent drAM orderinG inForMAtion  
1
2
3
4
5
6
7
8
9
10  
11  
K
4
T
XX  
XX  
X
X
X
X
X
XX  
SAMSUNG Memory  
DRAM  
Speed  
Temp & Power  
Package Type  
Revision  
DRAM Type  
Density  
Interface (VDD, VDDQ)  
Bit Organization  
Number of Internal Banks  
08: x8  
1. Memory (K)  
2. DRAM: 4  
9. Package Type  
15: x16 (2Cs)  
16: x16  
DDR SDRAM  
L: tsoP II (Lead-free & Halogen-free)  
H: FBGA (Lead-free & Halogen-free)  
F: FBGA for 64Mb DDR (Lead-free & Halogen-free)  
6: stsoP II (Lead-free & Halogen-free)  
t: tsoP II  
26: x4 stack (JeDeC standard)  
27: x8 stack (JeDeC standard)  
30: x32 (2Cs, 2CKe)  
31: x32 (2Cs)  
3. DRAM Type  
B: DDR3 sDRAM  
D: GDDR sDRAM  
G: GDDR5 sDRAM  
H: DDR sDRAM  
J: GDDR3 sDRAM  
M: Mobile sDRAM  
N: sDDR2 sDRAM  
s: sDRAM  
32: x32  
N: stsoP II  
6. # of Internal Banks  
G: FBGA  
U: tsoP II (Lead-free)  
2: 2 Banks  
3: 4 Banks  
4: 8 Banks  
5: 16 Banks  
V: stsoP II (Lead-free)  
Z: FBGA (Lead-free)  
DDR2 SDRAM  
t: DDR sDRAM  
Z: FBGA (Lead-free)  
U: GDDR4 sDRAM  
7. Interface ( VDD, VDDQ)  
J: FBGA DDP (Lead-free)  
V: Mobile DDR sDRAM Power efficient Address  
W: sDDR3 sDRAM  
2: LVttL, 3.3V, 3.3V  
4: LVttL, 2.5V, 2.5V  
5: sstL-2 1.8V, 1.8V  
6: sstL-15 1.5V, 1.5V  
8: sstL-2, 2.5V, 2.5V  
A: sstL, 2.5V, 1.8V  
F: PoD-15 (1.5V,1.5V)  
H: sstL_2 DLL, 3.3V, 2.5V  
M: LVttL, 1.8V, 1.5V  
N: LVttL, 1.5V, 1.5V  
P: LVttL, 1.8V, 1.8V  
Q: sstL-2 1.8V, 1.8V  
R: sstL-2, 2.8V, 2.8V  
U: DRsL, 1.8V, 1.2V  
Q: FBGA QDP (Lead-free)  
H: FBGA (Lead-free & Halogen-free)  
M: FBGA DDP (Lead-free & Halogen-free)  
e: FBGA QDP (Lead-free & Halogen-free)  
t: FBGA DsP (Lead-free & Halogen-free, thin)  
X: Mobile DDR sDRAM  
Y: XDR DRAM  
Z: Value Added DRAM  
4. Density  
DDR3 SDRAM  
10: 1G, 8K/32ms  
Z: FBGA (Lead-free)  
16: 16M, 4K/64ms  
26: 128M, 4K/32ms  
28: 128M, 4K/64ms  
32: 32M, 2K/32ms  
50: 512M, 32K/16ms  
51: 512M, 8K/64ms  
52: 512M, 8K/32ms  
54: 256M, 16K/16ms  
55: 256M, 4K/32ms  
56: 256M, 8K/64ms  
62: 64M, 2K/16ms  
64: 64M, 4K/64ms  
68: 768M, 8K/64ms  
1G: 1G, 8K/64ms  
H: FBGA (Halogen-free & Lead-free)  
Graphics Memory  
Q: tQFP  
U: tQFP (Lead Free)  
G: 84/144 FBGA  
V: 144 FBGA (Lead Free)  
Z: 84 FBGA(Lead Free)  
t: tsoP  
8. Revision  
A: 2nd Generation  
B: 3rd Generation  
C: 4th Generation  
D: 5th Generation  
e: 6th Generation  
F: 7th Generation  
G: 8th Generation  
H: 9th Generation  
I: 10th Generation  
J: 11th Generation  
K: 12th Generation  
M: 1st Generation  
N: 14th Generation  
Q: 17th Generation  
L: tsoP (Lead Free)  
A: 136 FBGA  
B: 136 FBGA(Lead Free)  
H: FBGA(Hologen Free & Lead Free)  
e: 100 FBGA(Hologen Free & Lead Free)  
2G: 2G, 8K/64ms  
SDRAM  
4G: 4G, 8K/64ms  
L tsoP II (Lead-free & Halogen-free)  
N: stsoP II  
5. Bit Organization  
t: tsoP II  
02: x2  
U: tsoP II (Lead-free)  
V: stsoP II (Lead-free)  
04: x4  
06: x4 stack (Flexframe)  
07: x8 stack (Flexframe)  
DRAM Ordering Information  
1H 2011  
samsung.com/semi/dram  
10  
coMPonent drAM orderinG inForMAtion  
1
2
3
4
5
6
7
8
9
10  
11  
K
4
T
XX  
XX  
X
X
X
X
X
XX  
SAMSUNG Memory  
DRAM  
Speed  
Temp & Power  
Package Type  
Revision  
DRAM Type  
Density  
Interface (VDD, VDDQ)  
Bit Organization  
Number of Internal Banks  
XDR DRAM  
DDR2 SDRAM  
1 : 1.1ns (900MHz)  
55: 5.5ns (183MHz)  
12: 1.25ns (800MHz)  
60: 6.0ns (166MHz)  
14: 1.4ns (700MHz)  
16: 1.6ns (600MHz)  
J: BoC(LF) P: BoC  
CC: DDR2-400 (200MHz @ CL=3, tRCD=3,  
tRP=3)  
Mobile DRAM  
D5: DDR2-533 (266MHz @ CL=4, tRCD=4,  
Leaded / Lead Free  
tRP=4)  
G/A: 52balls FBGA Mono  
R/B: 54balls FBGA Mono  
X /Z: 54balls BoC Mono  
e6: DDR2-667 (333MHz @ CL=5, tRCD=5,  
tRP=5)  
SDRAM (Default CL=3)  
50: 5.0ns (200MHz CL=3)  
60: 6.0ns (166MHz CL=3)  
67: 6.7ns  
F7: DDR2-800 (400MHz @ CL=6, tRCD=6,  
J /V: 60(72)balls FBGA Mono 0.5pitch  
L /F: 60balls FBGA Mono 0.8pitch  
s/D: 90balls FBGA  
tRP=6)  
e7: DDR2-800 (400MHz @ CL=5, tRCD=5,  
tRP=5)  
Monolithic (11mm x 13mm)  
F/H: smaller 90balls FBGA Mono  
Y/P: 54balls CsP DDP  
75: 7.5ns PC133 (133MHz CL=3)  
DDR3 SDRAM  
XDR DRAM  
F7: DDR3-800 (400MHz @ CL=6, tRCD=6,  
A2: 2.4Gbps, 36ns, 16Cycles  
B3: 3.2Gbps, 35ns, 20Cycles  
C3: 3.2Gbps, 35ns, 24Cycles  
C4: 4.0Gbps, 28ns, 24Cycles  
Ds: Daisychain sample  
M/e: 90balls FBGA DDP  
tRP=6)  
F8: DDR3-1066 (533MHz @ CL=7, tRCD=7,  
10. Temp & Power - COMMON  
(Temp, Power)  
tRP=7)  
G8: DDR3-1066 (533MHz @ CL=8, tRCD=8,  
C: Commercial, Normal (0’C – 95’C) & Normal  
Power  
tRP=8)  
Mobile-SDRAM  
60: 166MHz, CL 3  
75: 133MHz, CL 3  
80: 125MHz, CL 3  
1H: 105MHz, CL 2  
1L: 105MHz, CL 3  
15: 66MHz, CL 2 & 3  
H9: DDR3-1333 (667MHz @ CL=9, tRCD=9,  
C: (Mobile only) Commercial (-25 ~ 70’C), Normal  
Power  
tRP=9)  
K0: DDR3-1600 (800MHz @ CL=11, tRCD=11,  
J: Commercial, Medium  
tRP=11)  
L: Commercial, Low (0’C – 95’C) & Low Power  
L: (Mobile only) Commercial, Low, i-tCsR  
F: Commercial, Low, i-tCsR & PAsR & Ds  
e: extended (-25~85’C), Normal  
N: extended, Low, i-tCsR  
Graphics Memory  
18: 1.8ns (550MHz)  
04: 0.4ns (2500MHz)  
20: 2.0ns (500MHz)  
05: 0.5ns (2000MHz)  
22: 2.2ns (450MHz)  
5C: 0.56ns (1800MHz)  
25: 2.5ns (400MHz)  
06: 0.62ns (1600MHz)  
2C: 2.66ns (375MHz)  
6A: 0.66ns (1500MHz)  
2A: 2.86ns (350MHz)  
07: 0.71ns (1400MHz)  
33: 3.3ns (300MHz)  
7A: 0.77ns (1300MHz)  
36: 3.6ns (275MHz)  
08: 0.8ns (1200MHz)  
40: 4.0ns (250MHz)  
09: 0.9ns (1100MHz)  
45: 4.5ns (222MHz)  
1 : 1.0ns (1000MHz)  
50/5A: 5.0ns (200MHz)  
Mobile-DDR  
C3: 133MHz, CL 3  
C2: 100MHz, CL 3  
C0: 66MHz, CL 3  
G: extended, Low, i-tCsR & PAsR & Ds  
I: Industrial, Normal (-40’C – 85’C) & Normal  
Power  
Note: All of Lead-free or Halogen-free product are in  
compliance with RoHs  
P: Industrial, Low (-40’C – 85’C) & Low Power  
H: Industrial, Low, i-tCsR & PAsR & Ds  
11. Speed (Wafer/Chip Biz/BGD: 00)  
DDR SDRAM  
CC: DDR400 (200MHz @ CL=3, tRCD=3, tRP=3)  
B3: DDR333 (166MHz @ CL=2.5, tRCD=3,  
tRP=3) *1  
A2: DDR266 (133MHz @ CL=2 , tRCD=3, tRP=3)  
B0: DDR266 (133MHz @ CL=2.5, tRCD=3,  
tRP=3)  
Note 1: "B3" has compatibility with "A2" and "B0"  
samsung.com/semi/dram  
1H 2011  
DRAM Ordering Information  
11  
Module drAM orderinG inForMAtion  
1
2
3
4
5
6
7
8
9
10  
11  
12  
13  
M
X
XX  
T
XX  
X
X
X
X
X
X
XX  
X
SAMSUNG Memory  
AMB Vendor  
Speed  
DIMM  
Data bits  
Temp & Power  
PCB Revision  
Package  
DRAM Component Type  
Depth  
Number of Banks  
Bit Organization  
Component Revision  
1. Memory Module: M  
2. DIMM Type  
5. Depth  
9. Package  
09: 8M (for 128Mb/512Mb)  
17: 16M (for 128Mb/512Mb)  
16: 16M  
e: FBGA QDP (Lead-free & Halogen-free)  
G: FBGA  
3: DIMM  
H: FBGA (Lead-free & Halogen-free)  
J: FBGA DDP (Lead-free)  
M: FBGA DDP (Lead-free & Halogen-free)  
N: stsoP  
4: soDIMM  
28: 128M  
29: 128M (for 128Mb/512Mb)  
32: 32M  
3. Data bits  
12: x72 184pin Low Profile Registered DIMM  
63: x63 PC100 / PC133 μsoDIMM with sPD for  
144pin  
33: 32M (for 128Mb/512Mb)  
51: 512M  
Q: FBGA QDP (Lead-free)  
t: tsoP II (400mil)  
52: 512M (for 512Mb/2Gb)  
56: 256M  
U: tsoP II (Lead-Free)  
64: x64 PC100 / PC133 soDIMM with sPD for  
144pin (Intel/JeDeC)  
V: stsoP II (Lead-Free)  
Z: FBGA(Lead-free)  
57: 256M (for 512Mb/2Gb)  
59: 256M (for 128Mb/512Mb)  
64: 64M  
66: x64 Unbuffered DIMM with sPD for  
144pin/168pin (Intel/JeDeC)  
10. PCB Revision  
68: x64 184pin Unbuffered DIMM  
70: x64 200pin Unbuffered soDIMM  
71: x64 204pin Unbuffered soDIMM  
74: x72 /eCC Unbuffered DIMM with sPD for  
168pin (Intel/JeDeC)  
0: Mother PCB  
1: 1st Rev  
65: 64M (for 128Mb/512Mb)  
1G: 1G  
2: 2nd Rev.  
1K: 1G (for 2Gb)  
3: 3rd Rev.  
6. # of Banks in Comp. & Interface  
4: 4th Rev.  
77: x72 /eCC PLL + Register DIMM with sPD for  
168pin (Intel PC100)  
1: 4K/64mxRef., 4Banks & sstL-2  
2 : 8K/ 64ms Ref., 4Banks & sstL-2  
2: 4K/ 64ms Ref., 4Banks & LVttL (sDR only)  
5: 8K/ 64ms Ref., 4Banks & LVttL (sDR only)  
5: 4Banks & sstL-1.8V  
A: Parity DIMM  
s: Reduced PCB  
U: Low Profile DIMM  
78: x64 240pin Unbuffered DIMM  
81: x72 184pin eCC unbuffered DIMM  
83: x72 184pin Registered DIMM  
90: x72 /eCC PLL + Register DIMM  
91: x72 240pin eCC unbuffered DIMM  
92: x72 240pin VLP Registered DIMM  
93: x72 240pin Registered DIMM  
95: x72 240pin Fully Buffered DIMM with sPD for  
168pin (JeDeC PC133)  
11. Temp & Power  
C: Commercial temp. (0°C ~ 95°C) & Normal  
Power  
6: 8Banks & sstL-1.8V  
7. Bit Organization  
L: Commercial temp. (0°C ~ 95°C) & Low Power  
0: x 4  
12. Speed  
3: x 8  
CC: (200MHz @ CL=3, tRCD=3, tRP=3)  
D5: (266MHz @ CL=4, tRCD=4, tRP=4)  
e6: (333MHz @ CL=5, tRCD=5, tRP=5)  
F7: (400MHz @ CL=6, tRCD=6, tRP=6)  
e7: (400MHz @ CL=5, tRCD=5, tRP=5)  
F8: (533MHz @ CL=7, tRCD=7, tRP=7)  
G8: (533MHz @ CL=8, tRCD=8, tRP=8)  
H9: (667MHz @ CL=9, tRCD=9, tRP=9)  
K0: (800MHz @ CL=10, tRCD=10, tRP=10)  
7A: (133MHz CL=3/PC100 CL2)  
4: x16  
6: x 4 stack (JeDeC standard)  
7: x 8 stack (JeDeC standard)  
8: x 4 stack  
4. DRAM Component Type  
B: DDR3 sDRAM (1.5V VDD)  
L: DDR sDRAM (2.5V VDD)  
s: sDRAM  
9: x 8 stack  
8. Component Revision  
t: DDR2 sDRAM (1.8V VDD)  
A: 2nd Gen.  
B: 3rd Gen.  
C: 4th Gen.  
D: 5th Gen.  
e: 6th Gen.  
F: 7th Gen.  
G: 8th Gen.  
M: 1st Gen.  
Q: 17th Gen.  
13. AMB Vendor for FBDIMM  
0, 5: Intel  
1, 6, 8: IDt  
9: Montage  
Note: All of Lead-free or Halogen-free product are in  
compliance with RoHs  
DRAM Ordering Information  
1H 2011  
samsung.com/semi/dram  
12  
Slc FlASH  
MOQ  
T/R  
Family  
Density  
Part Number  
Package Type  
Org.  
Vol(V)  
Tray  
-xxxx0xx  
960  
960  
960  
960  
960  
960  
960  
960  
960  
960  
960  
960  
960  
960  
960  
960  
960  
960  
960  
960  
Status  
-xxx0Txx  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
2000  
1000  
K9QDGD8s5M-HCB*  
K9QDGD8U5M-HCB*  
K9QDG08U5M-HCB*  
K9WCGD8s5M-HCB*  
K9WCGD8U5M-HCB*  
K9WCG08U5M-HCB*  
K9WCG08U5M-HIB*  
K9KBGD8s1M-HCB*  
K9KBGD8U1M-HCB*  
K9KBGD8U1M-HIB*  
K9KBG08U1M-HCB*  
K9KBG08U1M-HIB*  
K9FAG08U0M-HCB*  
K9FAG08U0M-HIB*  
K9WAG08U1D-sCB0  
K9WAG08U1D-sIB0  
K9WAG08U1B-PCB0  
K9WAG08U1B-PIB0  
K9WAG08U1B-KIB0  
K9K8G08U0D-sCB0  
BGA  
x8  
x8  
x8  
x8  
x8  
x8  
x8  
x8  
x8  
x8  
x8  
x8  
x8  
x8  
x8  
x8  
x8  
x8  
x8  
X8  
1.8  
3.3  
3.3  
1.8  
3.3  
3.3  
3.3  
1.8  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
C/s  
128Gb oDP  
BGA  
C/s  
BGA  
C/s  
BGA  
C/s  
BGA  
C/s  
64Gb QDP  
BGA  
C/s  
BGA  
C/s  
16Gb Based  
BGA  
C/s  
BGA  
C/s  
32Gb DDP  
16Gb Mono  
16Gb QDP  
BGA  
C/s  
BGA  
C/s  
BGA  
C/s  
BGA  
C/s  
BGA  
C/s  
tsoP1 HF&LF  
tsoP1 HF&LF  
tsoP1  
tsoP1  
ULGA HF & LF  
tsoP1 HF&LF  
C/s  
C/s  
eoL scheduled  
eoL scheduled  
eoL scheduled  
C/s  
K9K8G08U0D-sIB0  
tsoP1 HF&LF  
x8  
3.3  
960  
1000  
C/s  
4Gb Based  
8Gb DDP  
K9K8G08U0B-PCB0  
K9K8G08U0B-PIB0  
K9K8G08U1B-KIB0  
K9F4G08U0D-sCB0  
K9F4G08U0D-sIB0  
K9F4G08U0B-PCB0  
K9F4G08U0B-PIB0  
K9F4G08U0B-KIB0  
K9F2G08U0C-sCB0  
K9F2G08U0C-sIB0  
K9F2G08U0B-PCB0  
K9F2G08U0B-PIB0  
K9F1G08U0D-sCB0  
K9F1G08U0D-sIB0  
K9F1G08U0C-PCB0  
K9F1G08U0C-PIB0  
tsoP1  
x8  
x8  
x8  
x8  
X8  
x8  
x8  
x8  
x8  
x8  
x8  
x8  
x8  
x8  
x8  
x8  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
960  
960  
960  
960  
960  
960  
960  
960  
960  
960  
960  
960  
960  
960  
960  
960  
1000  
1000  
2000  
1000  
1000  
1000  
1000  
2000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
eoL scheduled  
eoL scheduled  
eoL scheduled  
C/s  
tsoP1  
ULGA HF & LF  
tsoP1 HF & LF  
tsoP1 HF& LF  
tsoP1  
C/s  
4Gb Mono  
eoL scheduled  
eoL scheduled  
eoL scheduled  
C/s  
tsoP1  
ULGA HF & LF  
tsoP-LF/HF  
tsoP-LF/HF  
tsoP1  
C/s  
2Gb Based  
2Gb Mono  
1Gb Mono  
eoL scheduled  
eoL scheduled  
C/s  
tsoP1  
tsoP-LF/HF  
tsoP-LF/HF  
tsoP1  
C/s  
1Gb Based  
eoL scheduled  
eoL scheduled  
tsoP1  
*D=DDR and 0=sDR  
Please contact your local samsung sales representative for latest product offerings.  
Note: All parts are lead free  
samsung.com/semi/flash  
1H 2011  
SLC Flash  
13  
Mlc FlASH  
MOQ  
T/R  
-xxxx0xx -xxx0Txx  
Package  
Type  
Type  
Family  
Density  
Technology  
Part Number  
Org.  
Vol(V)  
Tray  
Status  
256Gb oDP  
128Gb QDP  
64Gb DDP  
256Gb oDP  
128Gb QDP  
64Gb DDP  
32Gb mono  
64Gb QDP  
32Gb DDP  
16Gb mono  
8Gb  
32nm ep-MLC  
32nm ep-MLC  
32nm ep-MLC  
35nm  
K9PFGD8U5M-HCe*  
K9HDGD8U5M-HCe*  
K9LCGD8U1M-HCe*  
K9ACGD8U0M-sCB*  
K9HDG08U1A-sCB*  
K9LCG08U0A-sCB*  
K9GBG08U0A-sCB*  
K9HCG08U1e-sCB*  
K9LBG08U0e-sCB*  
K9GAG08U0e-sCB*  
K9G8G08U0C-sCB*  
K9CFGD8U1M-sCB*  
K9BDGD8U0M-sCB*  
K9ACGD8U0M-sCB*  
BGA  
x8  
x8  
x8  
x8  
x8  
x8  
x8  
x8  
x8  
x8  
x8  
x8  
x8  
x8  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
720  
720  
720  
720  
960  
960  
960  
960  
960  
960  
960  
960  
960  
960  
-
C/s Now  
C/s Now  
C/s Now  
MP  
32Gb Based  
64Gb Based  
32Gb Based  
BGA  
-
BGA  
-
52LGA  
48tsoP  
48tsoP  
48tsoP  
48tsoP  
48tsoP  
48tsoP  
48tsoP  
tsoP  
2000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
-
27nm  
MP  
2bit  
27nm  
MP  
27nm  
MP  
32nm  
MP  
16GB Based  
8Gb Based  
64Gb Based  
32nm  
MP  
32nm  
MP  
32nm  
MP  
256Gb QDP  
128Gb DDP  
64Gb mono  
3bit_27nm DDR  
3bit_27nm DDR  
3bit_27nm DDR  
C/s Now  
C/s Now  
C/s Now  
3bit  
tsoP  
-
tsoP  
-
*D=DDR and 0=sDR  
Please contact your local samsung sales representative for latest product offerings.  
Note: All parts are lead free  
Sd and MicroSd FlASH cArdS  
Application  
Density  
2GB  
4GB  
8GB  
sD Cards  
16GB  
32GB  
2GB  
4GB  
usD Cards  
8GB  
16GB  
32GB  
Please contact your local samsung sales representative for part numbers and latest product offerings.  
movinAnd™ (eMMc)  
Density  
Part Number  
Package Type  
Org.  
Vol (V)  
Status  
2GB  
KLM2G1DeHe-B101xxx  
KLM4G1FeQA-A001xxx  
KLMCGAFeJA-B001xxx  
KLMBG8FeJA-A001xxx  
KLMAG4FeJA-A001xxx  
KLM8G2FeJA-A001xxx  
11.5x13  
12x16  
12x16  
12x16  
12x16  
14x18  
x8  
x8  
x8  
x8  
x8  
x8  
1.8/3.3  
1.8/3.3  
1.8/3.3  
1.8/3.3  
1.8/3.3  
1.8/3.3  
C/s MP  
Cs-April  
C/s MP  
C/s MP  
C/s MP  
C/s MP  
4GB  
8GB  
16GB  
32GB  
64GB  
Solid StAte driVeS (SSd)  
Interface  
Size  
Connector  
Controller  
Component  
Density  
Part Number  
64GB  
MZ7PA064HMCD-01000  
MZ7PA128HMCD-01000  
MZ7PA256HMDR-01000  
MZ5PA064HMCD-01000  
MZ5PA128HMCD-01000  
MZ5PA256HMDR-01000  
MZMPA032HMCD-00000  
MZMPA064HMDR-00000  
MZMPA128HMFU-00000  
2.5"  
7mmt  
thin sAtA  
PM810  
16Gb  
128GB  
256GB  
64GB  
2.5"  
9.5mmt  
sAtA II - MLC  
thin sAtA  
PCle  
PM810  
PM810  
16Gb  
16Gb  
128GB  
256GB  
32GB  
msAtA  
64GB  
128GB  
Please contact your local samsung sales representative for latest product offerings  
Note: All parts are lead free  
MLC Flash, SD/MicroSD Flash, moviNAND & SSD  
1H 2011  
samsung.com/semi/flash  
14  
FlASH Product orderinG inForMAtion  
1
2
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
K
9
X
X
X
X
X
X
X
X
-
X
X
X
X
SAMSUNG Memory  
Pre-Program Version  
NAND Flash  
Small Classification  
Density  
Customer Bad Block  
Temp  
Package  
---  
Density  
Organization  
Organization  
Vcc  
Generation  
Mode  
1. Memory (K)  
8. Vcc  
13. Temp  
A : 1.65V~3.6V  
C : 5.0V (4.5V~5.5V)  
e : 2.3V~3.6V  
B : 2.7V (2.5V~2.9V)  
D : 2.65V (2.4V~2.9V)  
R : 1.8V (1.65V~1.95V)  
t : 2.4V~3.0V  
C : Commercial I : Industrial  
0 : NoNe (Containing Wafer, CHIP, BIZ, exception  
handling code)  
2. NAND Flash : 9  
3. Small Classification  
Q : 1.8V (1.7V~1.95V)  
U : 2.7V~3.6V  
14. Customer Bad Block  
(sLC : single Level Cell, MLC : Multi Level Cell)  
V : 3.3V (3.0V~3.6V)  
B : Include Bad Block  
W : 2.7V~5.5V, 3.0V~5.5V 0 : NoNe  
7 : sLC moviNAND  
8 : MLC moviNAND  
F : sLC Normal  
D : Daisychain sample  
L : 1~5 Bad Block  
9. Mode  
0 : Normal  
N : ini. 0 blk, add. 10 blk  
s : All Good Block  
G : MLC Normal  
H : MLC QDP  
1 : Dual nCe & Dual R/nB  
3 : tri /Ce & tri R/B  
4 : Quad nCe & single R/nB  
5 : Quad nCe & Quad R/nB  
9 : 1st block otP  
0 : NoNe (Containing Wafer, CHIP, BIZ, exception  
handling code)  
K : sLC DDP  
L : MLC DDP  
M : MLC DsP  
15. Pre-Program Version  
N : sLC DsP  
0 : None  
A : Mask option 1  
P : MLC 8 Die stack  
Q : sLC 8 Die stack  
s : sLC single sM  
t : sLC sINGLe (s/B)  
U : 2 stack MsP  
W : sLC 4 Die stack  
serial (1~9, A~Z)  
L : Low grade  
10. Generation  
M : 1st Generation  
A : 2nd Generation  
B : 3rd Generation  
C : 4th Generation  
D : 5th Generation  
4~5. Density  
12 : 512M  
56 : 256M  
1G : 1G  
11. “ ----”  
2G : 2G  
12. Package  
4G : 4G  
A : CoB  
8G : 8G  
B : FBGA (Halogen-Free, Lead-Free)  
C : CHIP BIZ D : 63-tBGA  
F : WsoP (Lead-Free) G : FBGA  
H : tBGA (Lead-Free)  
AG : 16G BG :  
32G CG : 64G  
DG : 128G  
eG : 256G  
LG : 24G  
I : ULGA (Lead-Free) (12*17)  
J : FBGA (Lead-Free)  
NG : 96G  
ZG : 48G  
L : ULGA (Lead-Free) (14*18)  
M : tLGA N : tLGA2  
00 : NoNe  
P : tsoP1 (Lead-Free)  
Q : tsoP2 (Lead-Free)  
6~7. Organization  
s : tsoP1 (Halogen-Free, Lead-Free)  
t : tsoP2 U : CoB (MMC)  
V : WsoP W : Wafer  
00 : NoNe  
08 : x8  
16 : x16  
Y : tsoP1 Z : WeLP (Lead-Free)  
samsung.com/semi/flash  
1H 2011  
Flash Ordering Information  
15  
HiGH-SPeed ASYncHronouS SrAM  
Density  
Organization Part Number  
Package  
Vcc (V)  
Speed (ns) Operating  
Temp.  
Operating  
Current (mA)  
Standby  
Current (uA)  
Production  
Status  
K6R4016C1D  
256Kx16  
44-soJ, 44-tsoP2  
44-soJ, 44-tsoP2  
36-soJ, 44-tsoP2  
36-soJ, 44-tsoP2  
5
10  
10  
10  
10  
I
I
I
I
65, 55  
80, 65  
65, 55  
80, 65  
20, 5  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
K6R4016V1D  
3.3  
5
20, 5 (1.2)  
20, 5  
4Mb  
K6R4008C1D  
512Kx8  
K6R4008V1D  
3.3  
20, 5  
SYncHronouS SrAM SPB & SB  
Density Organization  
Part  
Package  
Operating Vdd  
Access Time Cycle Time  
I/O Voltage Production  
Comments  
Number  
Mode  
sPB  
sB  
(V)  
tCD (ns)  
(MHz)  
(V)  
Status  
K7A321830C  
K7B321835C  
K7A323630C  
K7B323635C  
K7A163630B  
K7A163631B  
K7B163635B  
K7A161830B  
K7A161831B  
K7B161835B  
K7A803609B  
K7A803600B  
K7B803625B  
K7A801809B  
K7A801800B  
K7B801825B  
K7A403609B  
K7A403600B  
K7B403625B  
K7A403200B  
K7A401809B  
K7A401800B  
K7B401825B  
100-tQFP  
100-tQFP  
100-tQFP  
100-tQFP  
100-tQFP  
100-tQFP  
100-tQFP  
100-tQFP  
100-tQFP  
100-tQFP  
100-tQFP  
100-tQFP  
100-tQFP  
100-tQFP  
100-tQFP  
100-tQFP  
100-tQFP  
100-tQFP  
100-tQFP  
100-tQFP  
100-tQFP  
100-tQFP  
100-tQFP  
3.3, 2.5  
3.3, 2.5  
3.3, 2.5  
3.3, 2.5  
3.3, 2.5  
3.3, 2.5  
3.3, 2.5  
3.3, 2.5  
3.3, 2.5  
3.3, 2.5  
3.3  
3.1  
200  
3.3, 2.5  
3.3, 2.5  
3.3, 2.5  
3.3, 2.5  
3.3, 2.5  
3.3, 2.5  
3.3, 2.5  
3.3, 2.5  
3.3, 2.5  
3.3, 2.5  
3.3,2.5  
3.3,2.5  
3.3,2.5  
3.3,2.5  
3.3,2.5  
3.3,2.5  
3.3, 2.5  
3.3, 2.5  
3.3, 2.5  
3.3, 2.5  
3.3, 2.5  
3.3, 2.5  
3.3, 2.5  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
2e1D  
2Mx18  
36Mb  
7.5  
118  
sPB  
sB  
3.1  
200  
2e1D  
1Mx36  
7.5  
118  
sPB  
sPB  
sB  
2.6, 3.5  
3.1  
250, 167  
200  
2e1D  
1Mx36  
18Mb  
2e2D  
7.5  
117  
sPB  
sPB  
sB  
2.6, 3.5  
3.1  
250, 167  
200  
2e1D  
1Mx18  
2e2D  
7.5  
117  
sPB  
sPB  
sB  
2.6  
250  
Not for new designs  
Not for new designs  
Not for new designs  
Not for new designs  
Not for new designs  
Not for new designs  
Not for new designs  
Not for new designs  
Not for new designs  
Not for new designs  
Not for new designs  
Not for new designs  
Not for new designs  
2e1D  
256Kx36  
3.3  
3.5  
167  
2e1D  
3.3  
6.5  
133  
8Mb  
sPB  
sPB  
sB  
3.3  
2.6  
250  
2e1D  
512Kx18  
3.3  
3.5  
167  
2e1D  
3.3  
6.5  
133  
sPB  
sPB  
sB  
3.3  
2.4  
250  
2e1D  
3.3  
3.5  
167  
2e1D  
128Kx36  
3.3  
6.5  
133  
4Mb  
sPB  
sPB  
sPB  
sB  
3.3  
3.5  
167  
2e1D  
2e1D  
2e1D  
3.3  
2.4  
250  
256Kx18  
3.3  
3.5  
167  
3.3  
6.5  
133  
Notes:  
All tQFP products are Lead Free  
sPB speed recommendations: For 200MHz use 250MHz; For 133MHz use 167MHz  
2e1D = 2-cycle enable and 1-cycle Disable  
2e2D = 2-cycle enable and 2-cycle Disable  
sB speed recommendation: Use 7.5ns Access time; Use 6.5ns Access time  
Asynchronous & Synchronous SDRAM  
1H 2011  
samsung.com/semi/sram  
16  
ntrAM  
Type  
Density Organization Part Number  
Package  
Operating Vdd (V)  
Mode  
Access Time Speed  
I/O Voltage  
Production Status  
tCD (ns)  
2.6, 3.5  
2.6, 3.5  
2.6, 3.5  
2.6, 3.5  
7.5  
tCYC (MHz) (V)  
2Mx36  
K7N643645M  
K7N641845M  
K7N323631C  
K7N321831C  
K7M323635C  
K7M321835C  
K7N161831B  
K7N163631B  
K7M161835B  
K7M163635B  
K7N803601B  
K7N801801B  
K7N803609B  
K7N801809B  
K7N803645B  
K7N801845B  
K7N803649B  
K7N801849B  
K7M801825B  
K7M803625B  
K7N403609B  
K7N401809B  
K7B401825B  
100-tQFP  
sPB  
sPB  
sPB  
sPB  
Ft  
2.5  
250, 167  
250, 167  
250, 167  
250, 167  
118  
2.5  
Mass Production  
72Mb  
36Mb  
4Mx18  
100-tQFP  
2.5  
2.5  
Mass Production  
1Mx36  
100-tQFP, 165FBGA  
100-tQFP, 165FBGA  
100-tQFP  
3.3, 2.5  
3.3, 2.5  
3.3, 2.5  
3.3, 2.5  
3.3, 2.5  
3.3, 2.5  
3.3  
3.3, 2.5  
3.3, 2.5  
3.3, 2.5  
3.3, 2.5  
3.3, 2.5  
3.3, 2.5  
3.3, 2.5  
3.3, 2.5  
3.3,2.5  
3.3,2.5  
3.3,2.5  
3.3,2.5  
2.5  
Mass Production  
2Mx18  
Mass Production  
1Mx36  
Mass Production  
2Mx18  
100-tQFP  
Ft  
7.5  
118  
Mass Production  
1Mx18  
100-tQFP, 165FBGA  
100-tQFP, 165FBGA  
100-tQFP  
sPB  
sPB  
Ft (sB)  
Ft (sB)  
sPB  
sPB  
sPB  
sPB  
sPB  
sPB  
sPB  
sPB  
Ft  
2.6, 3.5  
2.6, 3.5  
6.5  
250, 167  
250, 167  
133  
Mass Production  
512Kx36  
1Mx18  
Mass Production  
18Mb  
Mass Production  
512Kx36  
256Kx36  
512Kx18  
256Kx36  
512Kx18  
256Kx36  
512Kx18  
256Kx36  
512Kx18  
512Kx18  
256Kx36  
128Kx36  
256Kx18  
256Kx18  
100-tQFP  
3.3  
6.5  
133  
Mass Production  
100-tQFP  
3.3  
3.5  
167  
Not for new designs  
Not for new designs  
Not for new designs  
Not for new designs  
Not for new designs  
Not for new designs  
Not for new designs  
Not for new designs  
Not for new designs  
Not for new designs  
Not for new designs  
Not for new designs  
Not for new designs  
NtRAM  
100-tQFP  
3.3  
3.5  
167  
100-tQFP  
3.3  
2.6  
250  
100-tQFP  
3.3  
2.6  
250  
100-tQFP  
2.5  
3.5  
167  
8Mb  
100-tQFP  
2.5  
3.5  
167  
2.5  
100-tQFP  
2.5  
2.6  
250  
2.5  
100-tQFP  
2.5  
2.6  
250  
2.5  
100-tQFP  
3.3  
6.5  
133  
3.3, 2.5  
3.3, 2.5  
3.3,2.5  
3.3,2.5  
3.3, 2.5  
100-tQFP  
Ft  
3.3  
6.5  
133  
100-tQFP  
sPB  
sPB  
sB  
3.3  
3
200  
4Mb  
sPB and Ft 4Mb  
100-tQFP  
3.3  
3
200  
100-tQFP  
3.3  
6.5  
133  
Notes:  
All tQFP products are lead free  
NtRAM speed recommendations: For 200MHz use 250MHz; For 133MHz use 167MHz  
NtRAM speed recommendation: Use 7.5ns Access time use 6.5ns Access time  
Recommended sPB speeds are 250MHz and 167MHz Recommended sB Acess speed is 7.5ns  
late-Write rr SrAM  
Density Organization  
Part Number  
Package  
Operating Vdd (V)  
Mode  
Access Time  
tCD (ns)  
Speed tCYC  
I/O Voltage  
(V)  
Production Status  
(MHz)  
300,250  
300,250  
300  
1Mx36  
32Mb  
K7P323674C  
K7P321874C  
K7P803611B  
K7P801811B  
K7P803666B  
K7P801866B  
119-BGA  
119-BGA  
119-BGA  
119-BGA  
119-BGA  
119-BGA  
sP  
sP  
sP  
sP  
sP  
sP  
1.8 / 2.5V  
1.8 / 2.5V  
3.3  
1.6, 2.0  
1.5 (Max 1.8)  
1.5 (Max 1.8)  
1.5 (Max.2.0)  
1.5 (Max.2.0)  
1.5 (Max.2.0)  
1.5 (Max.2.0)  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
2Mx18  
1.6, 2.0  
256Kx36  
1.6  
1.6  
2
512Kx18  
8Mb  
3.3  
300  
256Kx36  
2.5  
250  
512Kx18  
2.5  
2
250  
samsung.com/semi/sram  
1H 2011  
NtRAM & Late Write RR SRAM  
17  
ddr SYncHronouS SrAM  
Type  
Density Organization Part Number Package  
Vdd (V)  
Access Time  
tCD (ns)  
Cycle Time  
I/O Voltage Production  
Comments  
(V)  
Status  
512Kx36  
1Mx18  
K7D163674B 153-BGA  
K7D161874B 153-BGA  
K7D803671B 153-BGA  
K7D801871B 153-BGA  
1.8~2.5 2.3  
1.8~2.5 2.3  
330, 300  
1.5~1.9  
1.5~1.9  
Mass Production  
Mass Production  
16Mb  
8Mb  
330, 300  
DDR  
256Kx36  
512Kx18  
2.5  
2.5  
1.7/1.9/2.1  
1.7/1.9/2.1  
333, 330, 250  
333, 330, 250  
1.5 (Max 2.0) Not for new designs  
1.5 (Max 2.0) Not for new designs  
K7I641882M 165-FBGA 1.8  
K7I641884M 165-FBGA 1.8  
K7J641882M 165-FBGA 1.8  
K7I643682M 165-FBGA 1.8  
K7I643684M 165-FBGA 1.8  
K7J643682M 165-FBGA 1.8  
0.45,0.45,0.45,0.50 300,250,200,167 1.5,1.8  
0.45,0.45,0.45,0.50 300,250,200,167 1.5,1.8  
0.45,0.45,0.45,0.50 300,250,200,167 1.5,1.8  
0.45,0.45,0.45,0.50 300,250,200,167 1.5,1.8  
0.45,0.45,0.45,0.50 300,250,200,167 1.5,1.8  
0.45,0.45,0.45,0.50 300,250,200,167 1.5,1.8  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
CIo-2B  
CIo-4B  
sIo-2B  
CIo-2B  
CIo-4B  
sIo-2B  
CIo-2B  
CIo-4B  
sIo-2B  
CIo-2B  
CIo-4B  
sIo-2B  
CIo-2B  
CIo-4B  
sIo-2B  
sIo-2B  
CIo-2B  
CIo-4B  
4Mx18  
2Mx36  
2Mx18  
1Mx36  
1Mx18  
512Kx36  
72Mb  
36Mb  
18Mb  
K7I321882C  
K7I321884C  
165-FBGA 1.8  
165-FBGA 1.8  
0.45  
0.45  
0.45  
0.45  
0.45  
0.45  
300,250  
300,250  
300,250  
300,250  
300,250  
300,250  
1.5,1.8  
1.5,1.8  
1.5,1.8  
1.5,1.8  
1.5,1.8  
1.5,1.8  
K7J321882C 165-FBGA 1.8  
DDR II  
CIo/sIo  
K7I323682C  
K7I323684C  
165-FBGA 1.8  
165-FBGA 1.8  
K7J323682C 165-FBGA 1.8  
K7I161882B  
K7I161884B  
165-FBGA 1.8  
165-FBGA 1.8  
0.45,0.45,0.45,0.50 300,250,200,167 1.5,1.8  
0.45,0.45,0.45,0.50 250,200,167 1.5,1.8  
K7J161882B 165-FBGA 1.8  
K7J163682B 165-FBGA 1.8  
0.45,0.45,0.45,0.50 300,250,200,167 1.5,1.8  
0.45,0.45,0.45,0.50 300,250,200,167 1.5,1.8  
0.45,0.45,0.45,0.50 300,250,200,167 1.5,1.8  
K7I163682B  
K7I163684B  
165-FBGA 1.8  
165-FBGA 1.8  
0.45,0.45,0.45,0.50 250,200,167  
1.5,1.8  
DDRII + CIo-2B,  
2 clocks latancy  
K7K3218t2C 165-FBGA 1.8  
K7K3218U2C 165-FBGA 1.8  
K7K3236t2C 165-FBGA 1.8  
K7K3236U2C 165-FBGA 1.8  
K7K1618t2C 165-FBGA 1.8  
K7K1618U2C 165-FBGA 1.8  
K7K1636t2C 165-FBGA 1.8  
0.45  
0.45  
0.45  
0.45  
0.45  
0.45  
0.45  
400  
1.5  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
2Mx18  
1Mx36  
DDRII + CIo-2B,  
2.5 clocks latancy  
400  
2.5  
1.5  
2.5  
1.5  
2.5  
1.5  
36Mb  
DDRII + CIo-2B,  
2 clocks latancy  
400, 333  
400, 334  
400, 333  
400, 334  
400, 333  
DDR II+  
DDRII + CIo-2B,  
2.5clocks latancy  
CIo  
DDRII + CIo-2B,  
2 clocks latancy  
1Mx18  
DDRII + CIo-2B,  
2.5clocks latancy  
18Mb  
DDRII + CIo-2B,  
2 clocks latancy  
512Kx36  
Notes:  
2B = Burst of 2  
4B = Burst of 4  
For DDR II CIo/sIo: C-die use 330, 300, or 250MHz instad of 200MHz or 167MHz using a stable DLL circuit  
For DDR II+ CIo: 2-clock latency is available. A 2.5-clock latency can be supported on 18Mb at 500Mhz and 36Mb at 450MHz  
sIo = separate I/o  
CIo = Common I/o  
DDR I / II / II+  
1H 2011  
samsung.com/semi/sram  
18  
Qdr SYncHronouS SrAM  
Type  
Density Organization Part  
Number  
Package  
Vdd  
(V)  
Access Time  
tCD (ns)  
Cycle Time  
I/O Voltage Production  
Comments  
(V)  
Status  
K7Q161862B  
K7Q161864B  
K7Q163662B  
K7Q163664B  
K7R640982M  
K7R641882M  
K7R641884M  
K7R643682M  
K7R643684M  
K7R320982C  
K7R321882C  
K7R321884C  
K7R323682C  
K7R323684C  
K7R160982B  
K7R161882B  
K7R161884B  
K7R163682B  
K7R163684B  
165-FBGA 1.8v / 2.5v 2.5  
165-FBGA 1.8v / 2.5v 2.5  
165-FBGA 1.8v / 2.5v 2.5  
165-FBGA 1.8v / 2.5v 2.5  
167  
1.5,1.8  
1.5,1.8  
1.5,1.8  
1.5,1.8  
1.5,1.8  
1.5,1.8  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
QDR I - 2B  
QDR I - 4B  
QDR I - 2B  
QDR I - 4B  
QDR II-2B  
QDR II-2B  
QDR II-4B  
QDR II-2B  
QDR II-4B  
QDR II-2B  
QDR II-2B  
QDR II-4B  
QDR II-2B  
QDR II-4B  
QDR II - 2B  
QDR II - 2B  
QDR II - 4B  
QDR II - 2B  
QDR II - 4B  
1Mx18  
167  
QDR I  
18Mb  
72Mb  
167  
512Kx36  
8Mx9  
167  
165-FBGA 1.8  
165-FBGA 1.8  
165-FBGA 1.8  
165-FBGA 1.8  
165-FBGA 1.8  
165-FBGA 1.8  
165-FBGA 1.8  
165-FBGA 1.8  
165-FBGA 1.8  
165-FBGA 1.8  
165-FBGA 1.8  
165-FBGA 1.8  
165-FBGA 1.8  
165-FBGA 1.8  
165-FBGA 1.8  
0.45,0.45,0.50  
0.45,0.45,0.50  
250,200,167  
250,200,167  
4Mx18  
0.45,0.45,0.45,0.50 300,250,200,167 1.5,1.8  
0.45,0.45,0.50 250,200,167 1.5,1.8  
0.45,0.45,0.45,0.50 300,250,200,167 1.5,1.8  
2Mx36  
4Mx9  
0.45  
167, 250, 200  
167, 250, 200  
200, 300, 250  
300, 250, 200  
200, 300, 250  
250,200,167  
250,200,167  
1.5,1.8  
1.5,1.8  
1.5,1.8  
1.5,1.8  
1.5,1.8  
1.5,1.8  
1.5,1.8  
0.45  
2Mx18  
QDR II 36Mb  
0.45  
0.45  
1Mx36  
2Mx9  
0.45  
0.45,0.45,0.50  
0.45,0.45,0.50  
1Mx18  
18Mb  
0.45,0.45,0.45,0.50 300,250,200,167 1.5,1.8  
0.45,0.45,0.50 250,200,167 1.5,1.8  
0.45,0.45,0.45,0.50 300,250,200,167 1.5,1.8  
512Kx36  
1Mx36  
QDR II + 4B,  
2 clocks latancy  
K7s3236t4C  
K7s3236U4C  
K7s3218t4C  
K7s3218U4C  
K7s1618t4C  
K7s1636U4C  
165-FBGA 1.8  
165-FBGA 1.8  
165-FBGA 1.8  
165-FBGA 1.8  
165-FBGA 1.8  
165-FBGA 1.8  
0.45  
0.45  
0.45  
0.45  
0.45  
0.45  
400  
1.5  
2.5  
1.5  
1.5  
1.5  
1.5  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
Mass Production  
QDR II + 4B,  
2.5 clocks latancy  
400  
36Mb  
QDR II + 4B,  
2 clocks latancy  
400  
QDR II+  
2Mx18  
QDR II + 4B,  
2.5 clocks latancy  
400  
QDR II + 4B,  
2 clocks latancy  
1Mx18  
400, 333  
400, 333  
18Mb  
QDR II + 4B,  
2.5 clocks latancy  
512Kx36  
Notes: For QDR I, QDR II: 2B = Burst of 2, 4B = Burst of 4  
For QDR II (36Mb): C-die use 300, 250MHz or 200MHz instead of 167MHz using a stable DLL circuit  
For QDR II (72Mb): 2B = Burst of 2 and 250MHz or 200MHz is recommended, 4B = Burst of 4 and 300MHz or 250MHz is recommended  
For QDR II+: 2-clock latency supported. 2.5-clock latency can be supported with 450MHz speed  
samsung.com/semi/sram  
1H 2011  
QDR I / II / II+  
19  
SYncHronouS SrAM orderinG inForMAtion  
1
2
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
16  
K
7
X
X
X
X
X
X
X
X
-
X
X
X
X
X
SAMSUNG Memory  
Packaging Type  
Speed  
Sync SRAM  
Small Classification  
Density  
Speed  
Temp, Power  
Package  
---  
Density  
Organization  
Organization  
Vcc, Interface, Mode  
Generation  
Vcc, Interface, Mode  
49: 2.5V,LVttL,Hi sPeeD  
WAFER, CHIP BIZ Level Division  
0: NoNe,NoNe  
1. Memory (K)  
52: 2.5V,1.5/1.8V,HstL,Burst2  
54: 2.5V,1.5/1.8V,HstL,Burst4  
62: 2.5V/1.8V,HstL,Burst2  
64: 2.5V/1.8V,HstL,Burst4  
66: 2.5V,HstL,R-R  
2. Sync SRAM: 7  
3. Small Classification  
1: Hot DC sort  
2: Hot DC, selected AC sort  
14~15. Speed  
A: sync Pipelined Burst  
B: sync Burst  
74: 1.8V,2.5V,HstL,All  
Sync Burst,Sync Burst + NtRAM  
82: 1.8V,HstL,Burst2  
D: Double Data Rate  
< Mode is R-L > (Clock Accesss time)  
84: 1.8V,HstL,Burst4  
I: Double Data Rate II, Common I/o  
J: Double Data Rate, separate I/o  
K: Double Data II+, Common I/o  
M: sync Burst + NtRAM  
N: sync Pipelined Burst + NtRAM  
P: sync Pipe  
65: 6.5ns  
75: 7.5ns  
85: 8.5ns  
70: 7ns  
88: 1.8V,HstL,R-R  
80: 8ns  
t2: 1.8V,2Clock Latency,Burst2  
t4: 1.8V,2Clock Latency,Burst4  
U2: 1.8V,2.5Clock Latency,Burst2  
U4: 1.8V,2.5Clock Latency,Burst4  
Other Small Classification (Clock Cycle Time)  
10: 100MHz  
11: 117MHz  
14: 138MHz  
20: 200MHz  
13: 133MHz  
Q: Quad Data Rate I  
10. Generation  
16: 166MHz  
R: Quad Data Rate II  
25: 250MHz  
M: 1st Generation  
A: 2nd Generation  
B: 3rd Generation  
C: 4th Generation  
D: 5th Generation  
s: Quad Data Rate II+  
26: 250MHz(1.75ns)  
30: 300MHz  
27: 275MHz  
33: 333MHz  
37: 375MHz  
42: 425MHz  
4~5. Density  
35: 350MHz  
80: 8M  
40: 4M  
64: 72M  
16: 18M  
40: 400MHz(t-CYCLe)  
45: 450MHz  
32: 36M  
11. “--”  
50: 500MHz (except sync Pipe)  
6~7. Organization  
16. Packing Type (16 digit)  
12. Package  
08: x8  
09: x9  
- Common to all products, except of Mask RoM  
- Divided into tAPe & ReeL (In Mask RoM,  
divided into tRAY, AMMo packing separately)  
H: BGA,FCBGA,PBGA  
G: BGA, FCBGA, FBGA (LF)  
F: FBGA  
18: x18  
36: x36  
32: x32  
8~9. Vcc, Interface, Mode  
e: FBGA (LF)  
Type  
Packing Type  
New Marking  
Q: (L)QPF  
00: 3.3V,LVttL,2e1D WIDe  
01: 3.3V,LVttL,2e2D WIDe  
08: 3.3V,LVttL,2e2D Hi sPeeD  
09: 3.3V,LVttL,Hi sPeeD  
11: 3.3V,HstL,R-R  
Component tAPe & ReeL  
t
P: (L)QFP(LF)  
C: CHIP BIZ  
other (tray, tube, Jar) 0 (Number)  
stack  
s
Y
A
W: WAFeR  
Component tRAY  
(Mask RoM) AMMo PACKING  
13. Temp, Power  
12: 3.3V,HstL,R-L  
Module  
MoDULe tAPe & ReeL P  
14: 3.3V,HstL,R-R Fixed ZQ  
22: 3.3V,LVttL,R-R  
COMMON (Temp,Power)  
MoDULe other Packing M  
0: NoNe,NoNe (Containing of error  
handling code)  
23: 3.3V,LVttL,R-L  
25: 3.3V,LVttL,sB-Ft WIDe  
30: 1.8/2.5/3.3V,LVttL,2e1D  
31: 1.8/2.5/3.3V,LVttL,2e2D  
35: 1.8/2.5/3.3V,LVttL,sB-Ft  
44: 2.5V,LVttL,2e1D  
C: Commercial,Normal  
e: extended,Normal  
I: Industrial,Normal  
45: 2.5V,LVttL,2e2D  
SRAM Ordering Information  
1H 2011  
samsung.com/semi/sram  
20  
McP: nAnd + Mddr  
Memory  
NAND Density  
DRAM Density/Organization  
256/512Mb (x16)  
512Mb (x32)  
Voltage (NAND-DRAM)  
1.8V - 1.8V  
Package  
130/137FBGA  
137FBGA  
1Gb (x16)  
2Gb (x16)  
1.8V - 1.8V  
1Gb (x16,x32)  
1.8V - 1.8V  
130/137FBGA  
137FBGA  
2Gb (x32)  
1.8V - 1.8V  
NAND & MDRAM  
4Gb (x16)  
2Gb*2 (x32, 2Cs/2CKe)  
2Gb*2 (x32)  
1.8V - 1.8V  
137FBGA  
1.8V - 1.8V  
240FBGA PoP  
137FBGA  
4Gb*2 (x16)  
8Gb (x16)  
2Gb*2 (x32, 2Cs/2CKe)  
2Gb*2 (x32)  
1.8V - 1.8V  
1.8V - 1.8V  
240FGBA PoP  
McP: movinAnd + lPddr2  
Memory  
moviNAND Density  
DRAM Density/Organization  
Voltage  
Package  
2Gb*2 (x32, 1ch, 2Cs)  
4Gb*2 (x32, 1ch, 2Cs)  
2Gb*2 (x32, 1ch, 2Cs)  
2Gb*2 (x32, 1ch, 2Cs)  
4Gb*2 (x32, 1ch, 2Cs)  
1.8V - 1.8V  
1.8V - 1.8V  
1.8V - 1.8V  
1.8V - 1.8V  
1.8V - 1.8V  
186FBGA/162FBGA  
186FBGA/162FBGA  
186FBGA  
4GB  
8GB  
moviNAND & MDRAM  
186FBGA  
16GB  
186FBGA  
McP: nor + utrAM  
Memory  
NOR Density  
UtRAM Density/Organization  
Voltage  
MCP Package  
512Mb (Mux)  
512Mb (Demux)  
256Mb (Mux)  
256Mb (Mux)  
256Mb (Demux)  
128Mb (Mux)  
128Mb (Demux)  
256Mb  
128Mb  
128Mb  
64Mb  
64Mb  
64Mb  
64Mb  
1.8V - 1.8V  
1.8V - 1.8V  
1.8V - 1.8V  
1.8V - 1.8V  
1.8V - 1.8V  
1.8V - 1.8V  
1.8V - 1.8V  
56FBGA  
84FBGA  
56FBGA  
56FBGA  
56FBGA  
52FBGA  
84FBGA  
NOR & UtRAM  
samsung.com/semi/mcp  
1H 2011  
Multi-Chip Packages  
21  
3.5" HArd diSK driVeS  
Family  
Capacity (GB)  
RPM  
7200  
7200  
7200  
7200  
7200  
5400  
5400  
7200  
7200  
7200  
7200  
7200  
7200  
7200  
7200  
5400  
5400  
5400  
5400  
5400  
5400  
7200  
7200  
7200  
7200  
7200  
-
Interface  
Buffer  
8
Sector  
512  
512  
512  
512  
512  
4K  
Model  
160  
sAtA 3.0 Gbps  
sAtA 3.1 Gbps  
sAtA 3.2 Gbps  
sAtA 3.3 Gbps  
sAtA 3.4 Gbps  
sAtA 3.5 Gbps  
sAtA 3.6 Gbps  
sAtA 3.0 Gbps  
sAtA 3.0 Gbps  
sAtA 3.0 Gbps  
sAtA 3.0 Gbps  
sAtA 3.0 Gbps  
sAtA 3.0 Gbps  
sAtA 3.0 Gbps  
sAtA 3.0 Gbps  
sAtA 3.0 Gbps  
sAtA 3.0 Gbps  
sAtA 3.0 Gbps  
sAtA 3.0 Gbps  
sAtA 3.0 Gbps  
sAtA 3.0 Gbps  
sAtA 3.0 Gbps  
sAtA 3.0 Gbps  
sAtA 3.0 Gbps  
sAtA 3.0 Gbps  
sAtA 3.0 Gbps  
sAtA 3.0 Gbps  
sAtA 3.0 Gbps  
sAtA 3.0 Gbps  
sAtA 3.0 Gbps  
HD165GJ  
HD166GJ  
HD255GJ  
HD256GJ  
HD322GJ  
HD155UI  
HD204UI  
HD164GJ  
HD254GJ  
HD324HJ  
HD163GJ  
HD253GJ  
HD323HJ  
HD502HJ  
HD103sJ  
HD253GI  
HD503HI  
HD105sI  
HD502HI  
HD103sI  
HD154UI  
HD161GJ  
HD251HJ  
HD321HJ  
HD322HJ  
HD103UJ  
HD754JI  
HD105sI  
HD153WI  
HD203WI  
160  
16  
8
F4  
250  
250  
16  
16  
32  
32  
8
320  
1500  
2000  
160  
F4eG-3  
4K  
512  
512  
512  
512  
512  
512  
512  
512  
512  
512  
512  
512  
512  
512  
512  
512  
512  
512  
512  
512  
512  
512  
512  
250  
8
320  
8
160  
16  
16  
16  
16  
32  
16  
16  
32  
16  
32  
32  
8
F3  
250  
320  
500  
1tB  
250  
ecoGreen F3  
500  
1 tB  
500  
ecoGreen F2 (F2eG)  
1 tB  
1.5 tB  
160  
F1Dt  
250  
8
320  
8
320  
16  
32  
32  
32  
32  
32  
1 tB  
750  
1tB  
-
F3eG  
1.5 tB  
2 tB  
-
-
Hard Disk Drives  
1H 2011  
samsung.com/hdd  
22  
2.5" HArd diSK driVeS  
Family  
Capacity (GB)  
RPM  
5400  
5400  
5400  
5400  
5400  
5400  
5400  
5400  
5400  
5400  
5400  
5400  
5400  
5400  
5400  
5400  
7200  
7200  
7200  
7200  
5400  
5400  
5400  
Interface  
Buffer  
8
Sector  
512  
512  
512  
512  
512  
512  
512  
512  
512  
512  
512  
512  
512  
512  
Model  
160  
UsB 2.0  
HM162HX  
HM252HX  
HM322IX  
HM502JX  
HM161GI  
HM251HI  
HM321HI  
HM501II  
250  
UsB 2.0  
8
M7U  
320  
UsB 2.0  
8
500  
UsB 2.0  
8
160  
sAtA 3.0 Gbps  
sAtA 3.0 Gbps  
sAtA 3.0 Gbps  
sAtA 3.0 Gbps  
sAtA 3.0 Gbps  
sAtA 3.0 Gbps  
sAtA 3.0 Gbps  
sAtA 3.0 Gbps  
sAtA 3.0 Gbps  
sAtA 3.0 Gbps  
8
250  
8
M7e  
320  
8
500  
8
640  
8
HM641JI  
HM161HI  
HM250HI  
HM320II  
160  
8
250  
8
M7  
320  
8
400  
8
HM400JI  
HM500JI  
HM750LI  
HM100UI  
HM250HJ  
HM320HJ  
HM500JJ  
HM640JJ  
HM160HC  
HM160HI  
HM031HC  
500  
8
750  
8
Mt2  
MP4  
1000  
250  
8
16  
16  
16  
16  
8
320  
500  
640  
M5P  
160  
PAtA  
512  
512  
512  
M5s  
160  
sAtA 1.5 Gbps  
PAtA  
8
MC30  
30  
8
Solid StAte driVeS (SSd)  
Interface  
Size  
Connector  
Controller  
Component  
Density  
Part Number  
64GB  
MZ7PA064HMCD-01000  
MZ7PA128HMCD-01000  
MZ7PA256HMDR-01000  
MZ5PA064HMCD-01000  
MZ5PA128HMCD-01000  
MZ5PA256HMDR-01000  
MZMPA032HMCD-00000  
MZMPA064HMDR-00000  
MZMPA128HMFU-00000  
2.5"  
7mmt  
thin sAtA  
thin sAtA  
PCle  
PM810  
PM810  
PM810  
16Gb  
128GB  
256GB  
64GB  
2.5"  
9.5mmt  
sAtA II - MLC  
16Gb  
16Gb  
128GB  
256GB  
32GB  
msAtA  
64GB  
128GB  
Please contact your local samsung sales representative for latest product offerings  
Note: All parts are lead free  
samsung.com/hdd | samsung.com/greenmemory  
1H 2011  
Hard Disk Drives & Solid State Drives  
23  
Blu-rAY H/H  
Interface  
Speed  
Type  
Loading  
Lightscribe  
Model  
X
ts-HB43A / sH-B123A  
ts-HB43L / sH-B123L  
sAtA  
BD Combo 12X  
H/H  
tray  
o
Blu-rAY SliM  
Interface  
Speed  
Type  
Loading  
Lightscribe  
Model  
X
sN-B043D  
sN-B043P  
sAtA  
BD Combo 4X  
slim  
tray  
o
Blu-rAY coMBo SliM externAl  
Interface  
Speed  
Type  
Loading  
Lightscribe  
Model  
se-406AB  
UsB 2.0  
BD Combo 6X  
slim  
tray  
X
dVd-W H/H  
Interface  
Speed  
Type  
Loading  
Lightscribe  
Model  
PAtA  
sAtA  
PAtA  
sAtA  
sAtA  
DVD Write 22X  
DVD Write 22X  
DVD Write 22X  
DVD Write 22X  
DVD Write 22X  
H/H  
H/H  
H/H  
H/H  
H/H  
tray  
tray  
tray  
tray  
tray  
X
X
o
o
X
ts-H662A / sH-s222A  
ts-H663C / sH-s223C  
ts-H662L / sH-s222L  
ts-H663L / sH-s223L  
sH-222AB  
dVd-W Slim  
Interface  
Speed  
Type  
Loading  
Lightscribe  
Model  
ts-L633F / sN-s083F  
ts-L633J  
X
tray  
sAtA  
DVD Write 8X  
slim  
o
o
ts-L633R / sN-s083R  
ts-t633P  
slot  
dVd-W SliM externAl  
Interface  
Speed  
Type  
Loading  
Lightscribe  
Model  
Ultra slim  
tray  
tray  
X
X
se-s084D  
UsB 2.0  
DVD Write 8X  
se-s084F  
slim  
dVd-roM  
Interface  
Speed  
Type  
Loading  
Lightscribe  
Model  
DVD 16X  
DVD 8X  
H/H  
tray  
X
sH-D163C  
ts-L333H  
sAtA  
slim  
dVd-W loAder  
Interface  
Speed  
Type  
Loading  
Lightscribe  
Model  
ts-P632F  
PAtA  
DVD 8X  
H/H  
tray  
X
Optical Disk Drives  
1H 2011  
samsungodd.com  
24  
DID Product Classification  
outdoor: HiGH luMinAnce  
SuPer nArroW  
PAnorAMic diSPlAY  
e-did: exclusive did  
P-did: Performance did  
B-did: Basic did  
» 1500 – 2000nit  
nArroW  
» narrow  
WAll-Mounted  
» thin/light  
» (edge led)  
lArGe ForMAt diSPlAY  
» 70” / 82”  
» Black Bezel  
lAndScAPe / PortrAit conVertiBle  
Why DID Instead of TV?  
Commercial (DID)  
Consumer (TV)  
Warranty  
Reliability  
18 months to 2 years  
90 days to 1 year  
Designed for continuous use in different environments  
Turned on for 20 hours +  
Designed for in-home use in controlled environment  
Turned on for 6-8 hours  
Variety of temperatures & location  
In-home living room  
Designed for PC signals  
Designed for vable TV signals  
Picture Quality  
Location  
LCD backlight covers a wider color spectrum necessary for PC source  
integration giving better picture quality  
Have cooler color temperature settings producing blue/white image  
displaying less color accuracy  
Can be oriented in either portrait or landscape mode  
Can only be oriented in portrait mode  
Product Segmentation  
HEAVY USE  
e-did: exclusive  
Professional  
outdoor events  
Billboard  
» All Features of P-did  
» Specialty: SnB, Panoramic,  
High Brightness  
• Control Room  
• simulation  
• scoreboard  
• sports  
Broadcasting  
• Billboard  
» robust design  
entertainment  
transportation  
communication  
rental  
P-did: Performance  
» All Features of B-did  
• Casino  
• theatre  
• Poster  
• Menu  
• Airport  
• train/Bus station  
• Conference Room  
• Rental  
• staging  
» narrow & Black Bezel  
» typ. Brightness: 700 (cd/m2)  
B-did: Basic  
» landscape/Portrait  
» High reliability  
» Pol. (Haze 44%)  
commercial  
education  
• Kiosk  
• Mart Board  
• e-Board  
» long lifetime: More than 2 Years  
LIGHT USE  
Product Segmentation  
Suggested  
Run Time  
Type  
Abbr  
Warranty  
Bezel  
Brightness  
Usage  
Applications  
Pricing  
Narrow and  
Super Narrow  
Outdoor, Video Walls,  
Panormaic  
E-DID Exclusive  
2 years  
20 hours +  
20 hours +  
450 to 2000 nits Heavy  
600/700 nits Medium  
Light  
High-price Range  
Mid-price Range  
P-DID Performance 2 years  
Narrow  
Semi-Outdoor  
Indoor, e-Board  
B-DID Basic  
18 months Normal  
14-16 hours 450 nits  
Low-price Range; Comperable to Consumer Panels  
tftlcd.com  
1H 2011  
LCD  
25  
SAMSunG diGitAl inForMAtion diSPlAY (did) PAnel lineuP  
Current  
Model  
Model  
resolution  
Brightness Contrast  
Response  
Time  
Type  
New Model Size  
Bezel  
Backlight  
Frequency MP*  
Comment  
(typical)  
Ratio  
LtI430LA01-0  
-
43"  
1920X480 Narrow  
1920X480 Narrow  
CCFL  
700 nits  
3,000:1  
3,000:1  
8ms  
60Hz  
60Hz  
Now  
Panoramic  
Panoramic  
LtI430LA02 43"  
e-LeD  
450 nits  
6ms  
2011. Q2  
Narrow +  
Black  
LtI460AA03  
LtI460AA04  
LtI460AA05  
-
-
-
46"  
46"  
46"  
HD  
CCFL  
CCFL  
CCFL  
D-LeD  
1500 nits  
700 nits  
450 nits  
700 nits  
3,000:1  
3,000:1  
4,000:1  
3,000:1  
8ms  
8ms  
8ms  
tBD  
60Hz  
60Hz  
60Hz  
60Hz  
Now  
High bright  
super  
narrow  
7.3mm  
Active to Active  
HD  
Now  
e-DID  
super  
narrow  
7.3mm  
Active to Active  
HD  
Now  
super  
narrow  
5.7mm  
Active to Active  
LtI550HN01 55"  
FHD  
2011. Q2  
LtI700HD02  
LtI400HA02  
70"  
40"  
FHD  
FHD  
Normal  
Narrow  
D-LeD  
2000 nits  
2,500:1  
3,000:1  
8ms  
60Hz  
60Hz  
Now  
Now  
High Bright  
CCFL  
700 nits  
8ms  
Narrow +  
Black  
LtI400HA03  
LtI460HA02  
LtI460HA03  
40"  
FHD  
FHD  
FHD  
CCFL  
CCFL  
CCFL  
700 nits  
700 nits  
700 nits  
3,000:1  
3,500:1  
3,500:1  
8ms  
8ms  
8ms  
60Hz  
60Hz  
60Hz  
Now  
Now  
Now  
46"  
46"  
Narrow  
Narrow +  
Black  
P-DID  
LtI460HJ01 46"  
FHD  
FHD  
FHD  
FHD  
FHD  
HD  
Narrow  
Narrow  
Narrow  
Normal  
Normal  
Normal  
Normal  
Normal  
Normal  
e-LeD  
CCFL  
e-LeD  
CCFL  
CCFL  
CCFL  
CCFL  
CCFL  
CCFL  
600 nits  
700 nits  
600 nits  
600 nits  
600 nits  
450 nits  
450 nits  
450 nits  
450 nits  
3,000:1  
4,000:1  
4,000:1  
2,000:1  
2,000:1  
4,000:1  
3,500:1  
4,000:1  
3,000:1  
10ms  
8ms  
10ms  
8ms  
8ms  
8ms  
8ms  
8ms  
8ms  
120Hz  
60Hz  
120Hz  
60Hz  
60Hz  
60Hz  
60Hz  
60Hz  
60Hz  
2011. Q2  
Now  
LtI550HF02  
-
55"  
LtI550HJ02 55"  
2011. Q2  
Now  
LtI700HD01  
LtI820Ht-L01  
LtI260AP01  
LtI320AA02  
LtI400HA01  
LtI460HM01  
-
-
70"  
82"  
26"  
Now  
Now  
LtI320AP02 32"  
HD  
2011. Q2  
Now  
40"  
46"  
FHD  
FHD  
Now  
B-DID  
e-Board; Landscape  
mode only  
LtI700HD03  
LtI820HD03  
70"  
82"  
FHD  
FHD  
Normal  
Normal  
CCFL  
CCFL  
450 nits  
2,000:1  
2,000:1  
8ms  
60Hz  
60Hz  
Now  
Now  
e-Board; Landscape  
mode only  
450 nits  
8ms  
Notes: HD = 1366 x 768  
FHD = 1920 x 1080  
*MP Date subject to change  
Please contact your local samsung Rep for more information.  
LCD  
1H 2011  
tftlcd.com  
26  
tABletS  
Brightness  
(nits)  
Size  
PN  
Mode  
Resolution  
H(RGB)  
V
Aspect Ratio  
PPI  
MP  
LtN070NL01  
PLs  
PLs  
PLs  
PLs  
PLs  
WsVGA  
WXGA  
XGA  
1024  
1280  
1024  
1280  
1280  
600  
800  
768  
800  
800  
17:10  
16:10  
4:3  
170  
216  
132  
149  
149  
400  
400  
300  
400  
400  
Now  
7
June, 2011  
April, 2011  
April, 2011  
June, 2011  
9.7  
10.1  
LtN097LX01-H01  
LtN101AL02-P01  
WXGA  
WXGA  
16:10  
16:10  
noteBooKS / PerSonAl coMPuterS  
Brightness  
(nits)  
Size  
PN  
Mode  
Resolution  
H(RGB)  
V
Aspect Ratio PPI  
MP  
LtN101Nt06  
LtN101At03  
LtN116At  
LtN125At  
LtN133At  
LtN140At  
LtN140Kt  
LtN156At  
LtN156Kt  
LtN156Ht  
LtN173Kt01  
tN  
tN  
tN  
tN  
tN  
tN  
tN  
tN  
tN  
tN  
tN  
WsVGA  
HD  
1024  
1366  
1366  
1366  
1366  
1366  
1600  
1366  
1600  
1920  
1600  
600  
768  
768  
768  
768  
768  
900  
768  
900  
1080  
900  
17:10  
16:9  
16:9  
16:9  
16:9  
16:9  
16:9  
16:9  
16:9  
16:9  
16:9  
118  
155  
135  
125  
118  
112  
131  
100  
118  
141  
106  
200  
200  
200  
200  
200  
200  
250  
200  
250  
300  
200  
Now  
tBD  
tBD  
tBD  
tBD  
Now  
tBD  
Now  
tBD  
tBD  
Now  
10.1  
11.6  
12.5  
13.3  
HD  
HD  
HD  
HD  
14  
HD+  
HD  
15.6  
17.3  
HD+  
FHD  
HD+  
MonitorS  
Brightness  
(nits)  
Size  
PN  
Mode  
Resolution  
H(RGB)  
V
Aspect Ratio  
PPI  
MP  
17  
LtM170et01  
LtM185At01  
LtM185At04  
LtM200Kt03  
LtM200Kt07  
LtM220Mt05  
LtM230HP01  
LtM230Ht01  
LtM230Ht05  
LtM240Ct04  
LtM240CL01  
LtM270Ht03  
LtM270DL02  
tN  
tN  
tN  
tN  
tN  
tN  
PVA  
tN  
tN  
tN  
PLs  
tN  
PLs  
sXGA  
HD  
1280  
1366  
1366  
1600  
1600  
1680  
1920  
1920  
1920  
1920  
1920  
1920  
2560  
1024  
768  
5:4  
96  
85  
85  
92  
92  
90  
96  
96  
96  
94  
94  
82  
109  
250  
250  
250  
250  
250  
250  
300  
300  
300  
300  
300  
300  
300  
Now  
16:9  
16:9  
16:9  
16:9  
16:10  
16:9  
16:9  
16:9  
16:10  
16:9  
16:9  
16:9  
Now  
18.5  
HD  
768  
Now  
HD+  
900  
Now  
20  
22  
HD+  
900  
Now  
WsXGA+  
FHD  
1050  
1080  
1080  
1080  
1200  
1200  
1080  
1440  
Now  
Now  
23  
FHD  
Now  
FHD  
Now  
WUXGA  
WUXGA  
FHD  
Now  
24  
27  
May, 2011  
Now  
QHD  
May, 2011  
tftlcd.com  
1H 2011  
Tablets / Notebooks / Personal Computers / Monitors  
27  
MeMorY  
DRAM  
Flash  
SRAM  
MCP  
SYSteM lSi  
ASICs  
APs  
Display Drivers  
Imaging ICs  
Foundry  
StorAGe  
Solid State Drives  
Hard Drives  
Optical Disc Drives  
lcd PAnelS  
Displays  
Monitors  
Smartphones  
Tablets  
TVs  
samsung.com/us/business/oem-solutions  
Disclaimer: The information in this publication has been carefully checked and is believed to be accurate at the time of  
publication. Samsung assumes no responsibility, however, for possible errors or omissions, or for any consequences  
resulting from the use of the information contained herein. Samsung reserves the right to make changes in its products  
or product specifications with the intent to improve function or design at any time and without notice and is not required  
to update this documentation to reflect such changes. This publication does not convey to a purchaser of semiconductor  
devices described herein any license under the patent rights of Samsung or others. Samsung makes no warranty,  
representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Samsung assume  
any liability arising out of the application or use of any product or circuit and specifically disclaims any and all liability,  
including without limitation any consequential or incidental damages.  
Samsung Semiconductor, Inc.  
3655 North First Street  
San Jose, CA 95134-1713  
Copyright 2011. Samsung and Samsung Semiconductor, Inc. are registered trademarks of Samsung Electronics, Co.,  
Ltd. All other names and brands may be claimed as the property of others. The appearance of all products, dates, figures,  
diagrams and tables are subject to change at any time, without notice.  
BR-11-ALL-001 Printed 03/11  

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