Texas Instruments Computer Hardware TMS320C6454 User Manual
TMS320C6454  
Fixed-Point Digital Signal Processor  
www.ti.com  
SPRS311A–APRIL 2006–REVISED DECEMBER 2006  
1 TMS320C6454 Fixed-Point Digital Signal Processor  
1.1 Features  
•
32-Bit DDR2 Memory Controller (DDR2-533  
SDRAM)  
•
High-Performance Fixed-Point DSP (C6454)  
–
–
–
–
–
1.39-, 1.17-, and 1-ns Instruction Cycle Time  
720-MHz, 850-MHz, and 1-GHz Clock Rate  
Eight 32-Bit Instructions/Cycle  
8000 MIPS/MMACS (16-Bits)  
Commercial Temperature [0°C to 90°C]  
•
•
•
EDMA3 Controller (64 Independent Channels)  
32-/16-Bit Host-Port Interface (HPI)  
32-Bit 33-/66-MHz, 3.3-V Peripheral Component  
Interconnect (PCI) Master/Slave Interface  
Conforms to PCI Specification 2.3  
One Inter-Integrated Circuit (I2C) Bus  
•
•
TMS320C64x+™ DSP Core  
–
–
–
–
Dedicated SPLOOP Instruction  
Compact Instructions (16-Bit)  
Instruction Set Enhancements  
Exception Handling  
•
•
•
Two McBSPs  
10/100/1000 Mb/s Ethernet MAC (EMAC)  
–
–
IEEE 802.3 Compliant  
Supports Multiple Media Independent  
Interfaces (MII, GMII, RMII, and RGMII)  
TMS320C64x+ Megamodule L1/L2 Memory  
Architecture:  
–
–
–
256K-Bit (32K-Byte) L1P Program Cache  
[Direct Mapped]  
256K-Bit (32K-Byte) L1D Data Cache  
[2-Way Set-Associative]  
8M-Bit (1048K-Byte) L2 Unified Mapped  
RAM/Cache [Flexible Allocation]  
256K-Bit (32K-Byte) L2 ROM  
Time Stamp Counter  
–
8 Independent Transmit (TX) and  
8 Independent Receive (RX) Channels  
•
Two 64-Bit General-Purpose Timers,  
Configurable as Four 32-Bit Timers  
•
•
•
16 General-Purpose I/O (GPIO) Pins  
System PLL and PLL Controller  
–
–
Secondary PLL and PLL Controller, Dedicated  
to EMAC and DDR2 Memory Controller  
•
•
Endianess: Little Endian, Big Endian  
•
•
IEEE-1149.1 (JTAG™)  
Boundary-Scan-Compatible  
64-Bit External Memory Interface (EMIFA)  
–
Glueless Interface to Asynchronous  
Memories (SRAM, Flash, and EEPROM) and  
Synchronous Memories (SBSRAM and ZBT  
SRAM)  
Supports Interface to Standard Sync  
Devices and Custom Logic (FPGA, CPLD,  
ASICs, etc.)  
697-Pin Ball Grid Array (BGA) Package  
(ZTZ or GTZ Suffix), 0.8-mm Ball Pitch  
•
•
•
0.09-µm/7-Level Cu Metal Process (CMOS)  
3.3-/1.8-/1.5-V I/Os, 1.25-/1.2-V Internal  
–
–
Pin-Compatible with the TMS320C6455  
Fixed-Point Digital Signal Processor  
32M-Byte Total Addressable External  
Memory Space  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this document.  
All trademarks are the property of their respective owners.  
PRODUCT PREVIEW information concerns products in the  
formative or design phase of development. Characteristic data and  
other specifications are design goals. Texas Instruments reserves  
the right to change or discontinue these products without notice.  
Copyright © 2006–2006, Texas Instruments Incorporated  
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TMS320C6454  
Fixed-Point Digital Signal Processor  
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SPRS311A–APRIL 2006–REVISED DECEMBER 2006  
The C64x+ DSP core employs eight functional units, two register files, and two data paths. Like the earlier  
C6000 devices, two of these eight functional units are multipliers or .M units. Each C64x+ .M unit doubles  
the multiply throughput versus the C64x core by performing four 16-bit x 16-bit multiply-accumulates  
(MACs) every clock cycle. Thus, eight 16-bit x 16-bit MACs can be executed every cycle on the C64x+  
core. At a 1-GHz clock rate, this means 8000 16-bit MMACs can occur every second. Moreover, each  
multiplier on the C64x+ core can compute one 32-bit x 32-bit MAC or four 8-bit x 8-bit MACs every clock  
cycle.  
The C6454 DSP integrates a large amount of on-chip memory organized as a two-level memory system.  
The level-1 (L1) program and data memories on the C6454 device are 32KB each. This memory can be  
configured as mapped RAM, cache, or some combination of the two. When configured as cache, L1  
program (L1P) is a direct mapped cache where as L1 data (L1D) is a two-way set associative cache. The  
level 2 (L2) memory is shared between program and data space and is 1048KB in size. L2 memory can  
also be configured as mapped RAM, cache, or some combination of the two. The C64x+ Megamodule  
also has a 32-bit peripheral configuration (CFG) port, an internal DMA (IDMA) controller, a system  
component with reset/boot control, interrupt/exception control, a power-down control, and a free-running  
32-bit timer for time stamp.  
The peripheral set includes: an inter-integrated circuit bus module (I2C); two multichannel buffered serial  
ports (McBSPs); a user-configurable 16-bit or 32-bit host-port interface (HPI16/HPI32); a peripheral  
component interconnect (PCI); a 16-pin general-purpose input/output port (GPIO) with programmable  
interrupt/event generation modes; an 10/100/1000 Ethernet media access controller (EMAC), which  
provides an efficient interface between the C6454 DSP core processor and the network; a management  
data input/output (MDIO) module (also part of the EMAC) that continuously polls all 32 MDIO addresses in  
order to enumerate all PHY devices in the system; a glueless external memory interface (64-bit EMIFA),  
which is capable of interfacing to synchronous and asynchronous peripherals; and a 32-bit DDR2 SDRAM  
interface.  
The I2C ports on the C6454 allows the DSP to easily control peripheral devices and communicate with a  
host processor. In addition, the standard multichannel buffered serial port (McBSP) may be used to  
communicate with serial peripheral interface (SPI) mode peripheral devices.  
The C6454 has a complete set of development tools which includes: a new C compiler, an assembly  
optimizer to simplify programming and scheduling, and a Windows® debugger interface for visibility into  
source code execution.  
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SPRS311A–APRIL 2006–REVISED DECEMBER 2006  
1.3 Functional Block Diagram  
Figure 1-2 shows the functional block diagram of the C6454 device.  
C6454  
DDR2  
Mem Ctlr  
32  
DDR2 SDRAM  
PLL2 and  
PLL2  
(D)  
Controller  
L2 ROM  
32K  
Bytes  
SBSRAM  
L1P Cache Direct-Mapped  
32K Bytes  
(E)  
ZBT SRAM  
64  
EMIFA  
SRAM  
L1P Memory Controller (Memory Protect/Bandwidth Mgmt)  
C64x+ DSP Core  
ROM/FLASH  
I/O Devices  
Control Registers  
SPLOOP Buffer  
Instruction Fetch  
16-/32-bit  
Instruction Dispatch  
(A)  
McBSP0  
L2  
Cache  
Memory  
1048K  
Bytes  
Instruction  
Decode  
In-Circuit Emulation  
Data Path B  
(A)  
M
e
g
a
m
o
d
u
l
McBSP1  
Data Path A  
(B)  
A Register File  
A31−A16  
B Register File  
B31−B16  
HPI (32/16)  
A15−A0  
B15−B0  
(B)  
PCI66  
e
.M1  
xx  
xx  
.M2  
xx  
xx  
.L1 .S1  
.D1  
.D2  
.S2 .L2  
EMAC  
10/100/1000  
MII  
RMII  
L1D Memory Controller (Memory Protect/Bandwidth Mgmt)  
GMII  
(D)  
RMGII  
MDIO  
L1D Cache  
2-Way  
Set-Associative  
32K Bytes Total  
16  
(B)  
GPIO16  
I2C  
(C)  
Timer1  
HI  
LO  
EDMA 3.0  
Device  
Configuration  
Logic  
PLL1 and  
PLL1  
Controller  
(C)  
Timer0  
Secondary  
Switched Central  
Resource  
HI  
LO  
Boot Configuration  
A. McBSPs: Framing Chips − H.100, MVIP, SCSA, T1, E1; AC97 Devices; SPI Devices; Codecs  
B. The PCI peripheral pins are muxed with some of the HPI peripheral pins. For more detailed information, see the Device Configuration section  
of this document.  
C. Each of the TIMER peripherals (TIMER1 and TIMER0) is configurable as either two 64-bit general-purpose timers or two 32-bit general-purpose  
timers or a watchdog timer.  
D. The PLL2 controller also generates clocks for the EMAC.  
E. When accessing the internal ROM of the DSP, the CPU frequency must always be less than 750 MHz.  
Figure 1-2. Functional Block Diagram  
4
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SPRS311A–APRIL 2006–REVISED DECEMBER 2006  
Contents  
1
2
TMS320C6454 Fixed-Point Digital Signal  
5.5 Megamodule Resets ................................ 81  
5.6 Megamodule Revision............................... 82  
Processor.................................................. 1  
1.1 Features .............................................. 1  
1.1.1 ZTZ/GTZ BGA Package (Bottom View).............. 2  
1.2 Description............................................ 2  
1.3 Functional Block Diagram ............................ 4  
Device Overview ......................................... 6  
2.1 Device Characteristics................................ 6  
2.2 CPU (DSP Core) Description......................... 7  
2.3 Memory Map Summary ............................. 10  
2.4 Boot Sequence...................................... 12  
2.5 Pin Assignments .................................... 14  
2.6 Signal Groups Description .......................... 18  
2.7 Terminal Functions.................................. 24  
2.8 Development ........................................ 47  
Device Configuration .................................. 50  
3.1 Device Configuration at Device Reset .............. 50  
5.7  
C64x+ Megamodule Register Description(s)........ 83  
6
7
Device Operating Conditions ........................ 90  
6.1  
Absolute Maximum Ratings Over Operating Case  
Temperature Range (Unless Otherwise Noted)..... 90  
6.2 Recommended Operating Conditions............... 90  
6.3  
Electrical Characteristics Over Recommended  
Ranges of Supply Voltage and Operating Case  
Temperature (Unless Otherwise Noted) ............ 92  
C64x+ Peripheral Information and Electrical  
Specifications ........................................... 94  
7.1 Parameter Information .............................. 94  
7.2  
Recommended Clock and Control Signal Transition  
Behavior ............................................. 96  
7.3 Power Supplies...................................... 96  
7.4  
Enhanced Direct Memory Access (EDMA3)  
3
Controller ............................................ 98  
7.5 Interrupts........................................... 112  
7.6 Reset Controller.................................... 116  
7.7 PLL1 and PLL1 Controller ......................... 123  
7.8 PLL2 and PLL2 Controller ......................... 138  
7.9 DDR2 Memory Controller .......................... 147  
7.10 External Memory Interface A (EMIFA)............. 149  
7.11 I2C Peripheral...................................... 160  
7.12 Host-Port Interface (HPI) Peripheral............... 166  
7.13 Multichannel Buffered Serial Port (McBSP)........ 177  
7.14 Ethernet MAC (EMAC)............................. 187  
7.15 Timers.............................................. 205  
7.16 Peripheral Component Interconnect (PCI)......... 207  
7.17 General-Purpose Input/Output (GPIO)............. 214  
7.18 IEEE 1149.1 JTAG................................. 216  
Mechanical Data....................................... 217  
8.1 Thermal Data ...................................... 217  
8.2 Packaging Information ............................. 217  
3.2  
Peripheral Configuration at Device Reset........... 52  
Peripheral Selection After Device Reset ............ 53  
3.3  
3.4 Device State Control Registers ..................... 55  
3.5 Device Status Register Description ................. 65  
3.6  
JTAG ID (JTAGID) Register Description ............ 67  
3.7 Pullup/Pulldown Resistors........................... 67  
3.8 Configuration Examples............................. 69  
System Interconnect................................... 71  
4
5
4.1  
Internal Buses, Bridges, and Switch Fabrics........ 71  
4.2 Data Switch Fabric Connections .................... 72  
4.3 Configuration Switch Fabric ......................... 74  
4.4 Priority Allocation.................................... 76  
C64x+ Megamodule.................................... 77  
5.1 Memory Architecture ................................ 77  
5.2 Memory Protection .................................. 80  
5.3 Bandwidth Management ............................ 80  
5.4 Power-Down Control ................................ 81  
8
Revision History............................................ 218  
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Fixed-Point Digital Signal Processor  
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SPRS311A–APRIL 2006–REVISED DECEMBER 2006  
2 Device Overview  
2.1 Device Characteristics  
Table 2-1, provides an overview of the C6454 DSP. The tables show significant features of the C6454  
device, including the capacity of on-chip RAM, the peripherals, the CPU frequency, and the package type  
with pin count.  
Table 2-1. Characteristics of the C6454 Processor  
HARDWARE FEATURES  
C6454  
EMIFA (64-bit bus width)  
(clock source = AECLKIN or SYSCLK4)  
1
DDR2 Memory Controller (32-bit bus width) [1.8 V I/O]  
(clock source = CLKIN2)  
1
EDMA3 (64 independent channels) [CPU/3 clock rate]  
I2C  
1
1
Peripherals  
HPI (32- or 16-bit user selectable)  
PCI (32-bit), [66-MHz or 33-MHz]  
1 (HPI16 or HPI32)  
1 (PCI66 or PCI33)  
Not all peripherals pins  
are available at the same  
time (For more detail, see  
the Device Configuration  
section).  
McBSPs (internal CPU/6 or external clock source up  
to 100 Mbps)  
2
10/100/1000 Ethernet MAC (EMAC)  
1
1
Management Data Input/Output (MDIO)  
64-Bit Timers (Configurable)  
(internal clock source = CPU/6 clock frequency)  
2 64-bit or 4 32-bit  
General-Purpose Input/Output Port (GPIO)  
Size (Bytes)  
16  
1144K  
32K-Byte (32KB) L1 Program Memory Controller  
[SRAM/Cache]  
32KB Data Memory Controller [SRAM/Cache]  
1048KB L2 Unified Memory/Cache  
32KB L2 ROM  
On-Chip Memory  
Organization  
C64x+ Megamodule  
Revision ID  
Megamodule Revision ID Register (address location:  
0181 2000h)  
See Section 5.6, Megamodule Revision  
See Section 3.6, JTAG ID (JTAGID) Register  
JTAG BSDL_ID  
Frequency  
JTAGID register (address location: 0x02A80008)  
Description  
MHz  
ns  
720, 850, and 1000 (1 GHz)  
1.39 ns (C6454-720), 1.17 ns (C6454-850),  
1 ns (C6454-1000) [1 GHz CPU]  
Cycle Time  
1.25 V (-1000)  
1.2 V (-850/-720)  
Core (V)  
Voltage  
1.5/1.8 [EMAC RGMII], and  
1.8 and 3.3 V [I/O Supply Voltage]  
I/O (V)  
PLL1 and PLL1  
Controller Options  
CLKIN1 frequency multiplier  
Bypass (x1), x15, x20, x25, x30, x32  
x20  
CLKIN2 frequency multiplier  
[DDR2 Memory Controller and EMAC support only]  
PLL2  
697-Pin Flip-Chip Plastic BGA (ZTZ)  
697-Pin Plastic BGA (GTZ)  
BGA Package  
24 x 24 mm  
µm  
Process Technology  
Product Status(1)  
0.09 µm  
Product Preview (PP), Advance Information (AI),  
or Production Data (PD)  
PP  
(1) PRODUCT PREVIEW information concerns experimental products (designated as TMX) that are in the formative or design phase of  
development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or  
discontinue these products without notice.  
6
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Table 2-1. Characteristics of the C6454 Processor (continued)  
HARDWARE FEATURES  
C6454  
TMX320C6454ZTZ7,  
TMX320C6454ZTZ8,  
TMX320C6454ZTZ  
(For more details on the C64x+™ DSP part  
numbering, see Figure 2-12)  
Device Part Numbers  
2.2 CPU (DSP Core) Description  
The C64x+ Central Processing Unit (CPU) consists of eight functional units, two register files, and two  
data paths as shown in Figure 2-1. The two general-purpose register files (A and B) each contain  
32 32-bit registers for a total of 64 registers. The general-purpose registers can be used for data or can be  
data address pointers. The data types supported include packed 8-bit data, packed 16-bit data, 32-bit  
data, 40-bit data, and 64-bit data. Values larger than 32 bits, such as 40-bit-long or 64-bit-long values are  
stored in register pairs, with the 32 LSBs of data placed in an even register and the remaining 8 or  
32 MSBs in the next upper register (which is always an odd-numbered register).  
The eight functional units (.M1, .L1, .D1, .S1, .M2, .L2, .D2, and .S2) are each capable of executing one  
instruction every clock cycle. The .M functional units perform all multiply operations. The .S and .L units  
perform a general set of arithmetic, logical, and branch functions. The .D units primarily load data from  
memory to the register file and store results from the register file into memory.  
The C64x+ CPU extends the performance of the C64x core through enhancements and new features.  
Each C64x+ .M unit can perform one of the following each clock cycle: one 32 x 32 bit multiply, two  
16 x 16 bit multiplies, two 16 x 32 bit multiplies, four 8 x 8 bit multiplies, four 8 x 8 bit multiplies with add  
operations, and four 16 x 16 multiplies with add/subtract capabilities (including a complex multiply). There  
is also support for Galois field multiplication for 8-bit and 32-bit data. Many communications algorithms  
such as FFTs and modems require complex multiplication. The complex multiply (CMPY) instruction takes  
for 16-bit inputs and produces a 32-bit real and a 32-bit imaginary output. There are also complex  
multiplies with rounding capability that produces one 32-bit packed output that contain 16-bit real and  
16-bit imaginary values. The 32 x 32 bit multiply instructions provide the extended precision necessary for  
audio and other high-precision algorithms on a variety of signed and unsigned 32-bit data types.  
The .L or (Arithmetic Logic Unit) now incorporates the ability to do parallel add/subtract operations on a  
pair of common inputs. Versions of this instruction exist to work on 32-bit data or on pairs of 16-bit data  
performing dual 16-bit add and subtracts in parallel. There are also saturated forms of these instructions.  
The C64x+ core enhances the .S unit in several ways. In the C64x core, dual 16-bit MIN2 and MAX2  
comparisons were only available on the .L units. On the C64x+ core they are also available on the .S unit  
which increases the performance of algorithms that do searching and sorting. Finally, to increase data  
packing and unpacking throughput, the .S unit allows sustained high performance for the quad 8-bit/16-bit  
and dual 16-bit instructions. Unpack instructions prepare 8-bit data for parallel 16-bit operations. Pack  
instructions return parallel results to output precision including saturation support.  
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Other new features include:  
•
SPLOOP - A small instruction buffer in the CPU that aids in creation of software pipelining loops where  
multiple iterations of a loop are executed in parallel. The SPLOOP buffer reduces the code size  
associated with software pipelining. Furthermore, loops in the SPLOOP buffer are fully interruptible.  
•
Compact Instructions - The native instruction size for the C6000 devices is 32 bits. Many common  
instructions such as MPY, AND, OR, ADD, and SUB can be expressed as 16 bits if the C64x+  
compiler can restrict the code to use certain registers in the register file. This compression is  
performed by the code generation tools.  
•
Instruction Set Enhancements - As noted above, there are new instructions such as 32-bit  
multiplications, complex multiplications, packing, sorting, bit manipulation, and 32-bit Galois field  
multiplication.  
•
•
•
Exception Handling - Intended to aid the programmer in isolating bugs. The C64x+ CPU is able to  
detect and respond to exceptions, both from internally detected sources (such as illegal op-codes) and  
from system events (such as a watchdog time expiration).  
Privilege - Defines user and supervisor modes of operation, allowing the operating system to give a  
basic level of protection to sensitive resources. Local memory is divided into multiple pages, each with  
read, write, and execute permissions.  
Time-Stamp Counter - Primarily targeted for Real-Time Operating System (RTOS) robustness, a  
free-running time-stamp counter is implemented in the CPU which is not sensitive to system stalls.  
For more details on the C64x+ CPU and its enhancements over the C64x architecture, see the following  
documents:  
•
•
•
•
•
TMS320C64x/C64x+ DSP CPU and Instruction Set Reference Guide (literature number SPRU732)  
TMS320C64x+ DSP Cache User's Guide (literature number SPRU862)  
TMS320C64x+ Megamodule Reference Guide (literature number SPRU871)  
TMS320C6455 Technical Reference (literature number SPRU965)  
TMS320C64x to TMS320C64x+ CPU Migration Guide (literature number SPRAA84)  
8
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Even  
Odd  
src1  
src2  
register  
register  
file A  
file A  
(A0, A2,  
(A1, A3,  
A4...A30)  
A5...A31)  
.L1  
odd dst  
even dst  
long src  
(D)  
8
32 MSB  
32 LSB  
ST1b  
ST1a  
8
long src  
even dst  
odd dst  
src1  
(D)  
Data path A  
.S1  
src2  
32  
32  
(A)  
(B)  
dst2  
dst1  
src1  
.M1  
src2  
(C)  
32 MSB  
32 LSB  
LD1b  
LD1a  
dst  
src1  
src2  
.D1  
.D2  
DA1  
2x  
Even  
register  
file B  
(B0, B2,  
B4...B30)  
1x  
Odd  
register  
file B  
(B1, B3,  
B5...B31)  
src2  
DA2  
src1  
dst  
32 LSB  
LD2a  
LD2b  
32 MSB  
src2  
(C)  
.M2  
src1  
dst2  
32  
32  
(B)  
(A)  
dst1  
src2  
src1  
.S2  
odd dst  
even dst  
long src  
(D)  
Data path B  
8
8
32 MSB  
32 LSB  
ST2a  
ST2b  
long src  
even dst  
(D)  
odd dst  
.L2  
src2  
src1  
Control Register  
A. On .M unit, dst2 is 32 MSB.  
B. On .M unit, dst1 is 32 LSB.  
C. On C64x CPU .M unit, src2 is 32 bits; on C64x+ CPU .M unit, src2 is 64 bits.  
D. On .L and .S units, odd dst connects to odd register files and even dst connects to even register files.  
Figure 2-1. TMS320C64x+™ CPU (DSP Core) Data Paths  
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2.3 Memory Map Summary  
Table 2-2 shows the memory map address ranges of the C6454 device. The external memory  
configuration register address ranges in the C6454 device begin at the hex address location 0x7000 0000  
for EMIFA and hex address location 0x7800 0000 for DDR2 Memory Controller.  
Table 2-2. C6454 Memory Map Summary  
MEMORY BLOCK DESCRIPTION  
BLOCK SIZE (BYTES)  
1024K  
32K  
HEX ADDRESS RANGE  
0000 0000 - 000F FFFF  
0010 0000 - 0010 7FFF  
0010 8000 - 007F FFFF  
0080 0000 - 008F FFFF  
0090 0000 - 00DF FFFF  
00E0 0000 - 00E0 7FFF  
00E0 8000 - 00EF FFFF  
00F0 0000 - 00F0 7FFF  
00F0 8000 - 00FF FFFF  
0100 0000 - 017F FFFF  
0180 0000 - 01BF FFFF  
01C0 0000 - 0287 FFFF  
0288 0000 - 028B FFFF  
028C 0000 - 028F FFFF  
0290 0000 - 0293 FFFF  
0294 0000 - 0297 FFFF  
0298 0000 - 0299 FFFF  
029A 0000 - 029A 01FF  
029A 0200 - 029B FFFF  
029C 0000 - 029C 01FF  
029C 0200 - 029C FFFF  
02A0 0000 - 02A0 7FFF  
02A0 8000 - 02A1 FFFF  
02A2 0000 - 02A2 7FFF  
02A2 8000 - 02A2 FFFF  
02A3 0000 - 02A3 7FFF  
02A3 8000 - 02A3 FFFF  
02A4 0000 - 02A7 FFFF  
02A8 0000 - 02AB FFFF  
02AC 0000 - 02AF FFFF  
02B0 0000 - 02B0 3FFF  
02B0 4000 - 02B3 FFFF  
02B4 0000 - 02BF FFFF  
02C0 0000 - 02C3 FFFF  
02C4 0000 - 02C7 FFFF  
02C8 0000 - 02C8 0FFF  
02C8 1000 - 02C8 17FF  
02C8 1800 - 02C8 1FFF  
02C8 2000 - 02C8 3FFF  
02C8 4000 - 02CF FFFF  
02D0 0000 - 0FFF FFFF  
1000 0000 - 1FFF FFFF  
Reserved  
Internal ROM  
Reserved  
7M - 32K  
1M  
Internal RAM (L2) [L2 SRAM]  
Reserved  
5M  
L1P SRAM  
32K  
Reserved  
1M - 32K  
32K  
L1D SRAM  
Reserved  
1M - 32K  
8M  
Reserved  
C64x+ Megamodule Registers  
Reserved  
4M  
12.5M  
256K  
256K  
256K  
256K  
128K  
512  
HPI Control Registers  
McBSP 0 Registers  
McBSP 1 Registers  
Timer 0 Registers  
Timer 1 Registers  
PLL1 Controller (including Reset Controller) Registers  
Reserved  
256K - 512  
512  
PLL2 Controller Registers  
Reserved  
64K  
EDMA3 Channel Controller Registers  
Reserved  
32K  
96K  
EDMA3 Transfer Controller 0 Registers  
EDMA3 Transfer Controller 1 Registers  
EDMA3 Transfer Controller 2 Registers  
EDMA3 Transfer Controller 3 Registers  
Reserved  
32K  
32K  
32K  
32K  
256K  
256K  
256K  
16K  
Chip-Level Registers  
Device State Control Registers  
GPIO Registers  
I2C Data and Control Registers  
Reserved  
256K  
720K  
256K  
256K  
4K  
PCI Control Registers  
Reserved  
EMAC Control  
EMAC Control Module Registers  
MDIO Control Registers  
EMAC Descriptor Memory  
Reserved  
2K  
2K  
8K  
496K  
220M  
256M  
Reserved  
Reserved  
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Table 2-2. C6454 Memory Map Summary (continued)  
MEMORY BLOCK DESCRIPTION  
BLOCK SIZE (BYTES)  
256M  
HEX ADDRESS RANGE  
2000 0000 - 2FFF FFFF  
3000 0000 - 3000 00FF  
3000 0100 - 33FF FFFF  
3400 0000 - 3400 00FF  
3400 0100 - 37FF FFFF  
3C00 0000 - 3C00 07FF  
3C00 0800 - 3CFF FFFF  
3D00 0000 - 3FFF FFFF  
4000 0000 - 4FFF FFFF  
5000 0000 - 5FFF FFFF  
6000 0000 - 6FFF FFFF  
7000 0000 - 77FF FFFF  
7800 0000 - 7FFF FFFF  
8000 0000 - 8FFF FFFF  
9000 0000 - 9FFF FFFF  
A000 0000 - A07F FFFF  
A080 0000 - AFFF FFFF  
B000 0000 - B07F FFFF  
B080 0000 - BFFF FFFF  
C000 0000 - C07F FFFF  
C080 0000 - CFFF FFFF  
D000 0000 - D07F FFFF  
D080 0000 - DFFF FFFF  
E000 0000 - EFFF FFFF  
F000 0000 - FFFF FFFF  
Reserved  
McBSP 0 Data  
256  
Reserved  
64M - 256  
256  
McBSP 1 Data  
Reserved  
64M - 256  
2K  
Reserved  
Reserved  
16M - 2K  
48M  
Reserved  
PCI External Memory Space  
Reserved  
256M  
256M  
Reserved  
256M  
EMIFA (EMIF64) Configuration Registers  
DDR2 Memory Controller Configuration Registers  
Reserved  
128M  
128M  
256M  
Reserved  
256M  
EMIFA CE2 - SBSRAM/Async(1)  
8M  
Reserved  
256M - 8M  
8M  
EMIFA CE3 - SBSRAM/Async(1)  
Reserved  
EMIFA CE4 - SBSRAM/Async(1)  
256M - 8M  
8M  
Reserved  
256M - 8M  
8M  
EMIFA CE5 - SBSRAM/Async(1)  
Reserved  
256M - 8M  
256M  
DDR2 Memory Controller CE0 - DDR2 SDRAM  
Reserved  
256M  
(1) The EMIFA CE0 and CE1 are not functionally supported on the C6454 device, and therefore, are not pinned out.  
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2.4 Boot Sequence  
The boot sequence is a process by which the DSP's internal memory is loaded with program and data  
sections and the DSP's internal registers are programmed with predetermined values. The boot sequence  
is started automatically after each power-on reset, warm reset, and system reset. For more details on the  
initiators of these resets, see Section 7.6, Reset Controller.  
There are several methods by which the memory and register initialization can take place. Each of these  
methods is referred to as a boot mode. The boot mode to be used is selected at reset through the  
BOOTMODE[3:0] pins.  
Each boot mode can be classified as a hardware boot mode or as a software boot mode. Software boot  
modes require the use of the on-chip bootloader. The bootloader is DSP code that transfers application  
code from an external source into internal or external program memory after the DSP is taken out of reset.  
The bootloader is permanently stored in the internal ROM of the DSP starting at byte address 0010  
0000h. Hardware boot modes are carried out by the boot configuration logic. The boot configuration logic  
is actual hardware that does not require the execution of DSP code. Section 2.4.1, Boot Modes  
Supported, describes each boot mode in more detail.  
When accessing the internal ROM of the DSP, the CPU frequency must always be less than 750 MHz.  
Therefore, when using a software boot mode, care must be taken such that the CPU frequency does not  
exceed 750 MHz at any point during the boot sequence. After the boot sequence has completed, the CPU  
frequency can be programmed to the frequency required by the application.  
2.4.1 Boot Modes Supported  
The C6454 has six boot modes:  
•
No boot (BOOTMODE[3:0] = 0000b)  
With no boot, the CPU executes directly from the internal L2 SRAM located at address 0x80 0000.  
Note: device operations is undefined if invalid code is located at address 0x80 0000. This boot mode is  
a hardware boot mode.  
•
Host boot (BOOTMODE[3:0] = 0001b and BOOTMODE[3:0] = 0111b)  
If host boot is selected, after reset, the CPU is internally "stalled" while the remainder of the device is  
released. During this period, an external host can initialize the CPU's memory space as necessary  
through Host Port Interface (HPI) or the Peripheral Component Interconnect (PCI) interface. Internal  
configuration registers, such as those that control the EMIF can also be initialized by the host with two  
exceptions: Device State Control registers (Section 3.4), PLL1 and PLL2 Controller registers  
(Section 7.7 and Section 7.8) cannot be accessed through any host interface, including HPI and PCI.  
Once the host is finished with all necessary initialization, it must generate a DSP interrupt (DSPINT) to  
complete the boot process. This transition causes boot configuration logic to bring the CPU out of the  
"stalled" state. The CPU then begins execution from the internal L2 SRAM located at 0x80 0000. Note  
that the DSP interrupt is registered in bit 0 (channel 0) of the EDMA Event Register (ER). This event  
must be cleared by software before triggering transfers on DMA channel 0.  
All memory, with the exceptions previously described, may be written to and read by the host. This  
allows for the host to verify what it sends to the DSP if required. After the CPU is out of the "stalled"  
state, the CPU needs to clear the DSPINT, otherwise, no more DSPINTs can be received.  
As previously mentioned, for the C6454 device, the Host Port Interface (HPI) and the Peripheral  
Component Interconnect (PCI) interface can be used for host boot. To use the HPI for host boot, the  
PCI_EN pin (Y29) must be low [default] (enabling the HPI peripheral) and BOOTMODE[3:0] must be  
set to 0001b at device reset. Conversely, to use the PCI interface for host boot, the PCI_EN pin (Y29)  
must be high (enabling the PCI peripheral) and BOOTMODE[3:0] must be set to 0111b at device reset.  
For the HPI host boot, the DSP interrupt can be generated through the use of the DSPINT bit in the  
HPI Control (HPIC) register.  
For the HPI host boot, the CPU is actually held in reset until a DSP interrupt is generated by the host.  
The DSP interrupt can be generated through the use of the DSPINT bit in the HPI Control (HPIC)  
register. Since the CPU is held in reset during HPI host boot, it will not respond to emulation software  
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such as Code Composer Studio.  
For the PCI host boot, the CPU is out of reset, but it executes an IDLE instruction until a DSP interrupt  
is generated by the host. The host can generate a DSP interrupt through the PCI peripheral by setting  
the DSPINT bit in the Back-End Application Interrupt Enable Set Register (PCIBINTSET) and the  
Status Set Register (PCISTATSET).  
Note that the HPI host boot is a hardware boot mode while the PCI host boot is a software boot mode.  
If PCI boot is selected, the on-chip bootloader configures the PLL1 Controller such that CLKIN1 is  
multiplied by 15. More specifically, PLLM is set to 0Eh (x15) and RATIO is set to 0 (÷1) in the PLL1  
Multiplier Control Register (PLLM) and PLL1 Pre-Divider Register (PREDIV), respectively. The CLKIN1  
frequency must not be greater than 50 MHz so that the maximum speed of the internal ROM, 750  
MHz, is not violated. The CFGGP[2:0] pins must be set to 000b during reset for proper operation of the  
PCI boot mode.  
As mentioned previously, a DSP interrupt must be generated at the end of the host boot process to  
begin execution of the loaded application. Since the DSP interrupt generated by the HPI and PCI is  
mapped to the EDMA event DSP_EVT (DMA channel 0), it will get recorded in bit 0 of the EDMA  
Event Register (ER). This event must be cleared by software before triggering transfers on DMA  
channel 0.  
•
•
•
EMIFA 8-bit ROM boot (BOOTMODE[3:0] = 0100b)  
After reset, the device will begin executing software out of an Asynchronous 8-bit ROM located in  
EMIFA CE3 space using the default settings in the EMIFA registers. This boot mode is a hardware  
boot mode.  
Master I2C boot (BOOTMODE[3:0] = 0101b)  
After reset, the DSP can act as a master to the I2C bus and copy data from an I2C EEPROM or a  
device acting as an I2C slave to the DSP using a predefined boot table format. The destination  
address and length are contained within the boot table. This boot mode is a software boot mode.  
Slave I2C boot (BOOTMODE[3:0] = 0110b)  
A Slave I2C boot is also implemented, which programs the DSP as an I2C Slave and simply waits for a  
Master to send data using a standard boot table format.  
Using the Slave I2C boot, a single DSP or a device acting as an I2C Master can simultaneously boot  
multiple slave DSPs connected to the same I2C bus. Note that the Master DSP may require booting  
via an I2C EEPROM before acting as a Master and booting other DSPs.  
The Slave I2C boot is a software boot mode.  
2.4.2 2nd-Level Bootloaders  
Any of the boot modes can be used to download a 2nd-level bootloader. A 2nd-level bootloader allows for  
any level of customization to current boot methods as well as definition of a completely customized boot.  
TI offers a few 2nd-level bootloaders, such as an EMAC bootloader, which can be loaded using the  
Master I2C boot.  
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2.5 Pin Assignments  
2.5.1 Pin Map  
Figure 2-2 through Figure 2-5 show the C6454 pin assigments in four quadrants (A, B, C, and D).  
1
2
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
SYSCLK4/  
GP[1]  
AJ  
AH  
AG  
FSX0  
CLKS  
DR0  
TINPL1  
DV  
V
TMS  
RSV26  
RSV40  
V
AJ  
DV  
GP[5]  
TCK  
DV  
DD33  
DD33  
SS  
SS  
DD33  
DR1/  
AH  
V
GP[4]  
GP[7]  
FSR0  
GP[6]  
NMI  
TINPL0  
TRST  
TDO  
EMU17  
RSV38  
EMU3  
RSV27  
RSV39  
EMU8  
EMU1  
RSV36  
EMU16  
EMU9  
DV  
V
SS  
TDI  
SS  
DD33  
GP[8]  
FSX1/  
GP[11]  
DX1/  
AG  
AF  
AE  
AD  
AC  
AB  
AA  
Y
CLKR0  
EMU6  
DV  
V
RESET  
POR  
RSV46  
EMU2  
EMU4  
CLKX0  
DX0  
TOUTL1  
EMU0  
DD33  
SS  
GP[9]  
CLKR1/  
GP[0]  
HD11/  
AD11  
CLKX1/  
GP[3]  
AF  
AE  
DV  
V
TOUTL0  
EMU7  
EMU5  
EMU11  
EMU14  
EMU18  
RSV45  
DD33  
SS  
HD22/  
AD22  
HD0/  
AD0  
HD10/  
AD10  
FSR1/  
GP[10]  
V
DV  
V
DV  
EMU15  
RSV37  
EMU12  
EMU10  
RESETSTAT  
DV  
SS  
DD33  
SS  
DD33  
DD33  
HD25/  
AD25  
HD5/  
AD5  
HD3/  
AD3  
HD21/  
AD21  
AD  
AC  
AB  
AA  
Y
DV  
V
DV  
EMU13  
V
DV  
V
DD33  
SS  
DD33  
SS  
DD33  
SS  
HD19/  
AD19  
HD13/  
AD13  
HD23/  
AD23  
HD29/  
AD29  
HD27/  
AD27  
DV  
V
V
DV  
V
DV  
V
RSV64  
DV  
V
DD33  
SS  
SS  
DD33  
SS  
DD33  
SS  
DD33  
SS  
HD17/  
AD17  
HD15/  
AD15  
HD9/  
AD9  
HD7/  
AD7  
HD1/  
AD1  
V
DV  
DD33  
SS  
HD31/  
AD31  
HD28/  
AD28  
HD30/  
AD30  
DV  
V
DV  
V
SS  
DD33  
SS  
DD33  
HD26/  
AD26  
HD18/  
AD18  
HD16/  
AD16  
HD6/  
AD6  
HD4/  
AD4  
V
DV  
DD33  
SS  
HD24/  
AD24  
HD20/  
AD20  
HD14/  
AD14  
HD8/  
AD8  
HD2/  
AD2  
W
W
RSV03  
V
V
CV  
V
CV  
V
SS  
SS  
SS  
DD  
SS  
DD  
HHWIL/  
PCLK  
HD12/  
AD12  
V
V
DV  
V
RSV02  
V
DV  
CV  
V
CV  
V
SS  
RSV68  
DD33  
SS  
SS  
DD33  
DD  
SS  
DD  
HDS2/  
HDS1/  
HINT/  
HCNTL1/  
HCNTL0/  
PSTOP  
HCS/  
U
T
U
T
V
V
CV  
V
CV  
V
SS  
SS  
SS  
DD  
SS  
DD  
PCBE1  
PSERR  
PFRAME  
PDEVSEL  
PPERR  
HAS/  
PPAR  
HRDY/  
PIRDY  
HR/W/  
RSV15  
RSV16  
V
DV  
CV  
V
CV  
V
CV  
V
SS  
DD33  
DD  
SS  
DD  
SS  
DD  
PCBE2  
PGNT/  
GP[12]  
PRST/  
GP[13]  
R
R
DV  
V
DV  
V
V
CV  
V
CV  
DD  
PIDSEL  
3
DD33  
SS  
DD33  
6
SS  
SS  
DD  
SS  
SS  
1
2
4
5
7
8
9
10  
11  
12  
13  
14  
15  
Figure 2-2. C6454 Pin Map (Bottom View) [Quadrant A]  
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16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
AJ  
V
RSV77  
RSV56  
RSV60  
V
RSV61  
RSV57  
RSV78  
V
DV  
AED5  
AED6  
AED20  
DV  
DD33  
AJ  
SS  
SS  
SS  
DD33  
AH  
V
DV  
RSV59  
RSV55  
RSV48  
RSV51  
V
RSV76  
V
RSV58  
RSV49  
RSV54  
RSV62  
DV  
V
AED14  
SCL  
AED2  
AED9  
AED18  
AED16  
AED15  
AED13  
AED22  
SS  
AH  
DD33  
SS  
SS  
DD33  
SS  
AG  
AF  
AE  
AD  
AC  
AB  
AA  
Y
V
DV  
RSV52  
V
RSV53  
DV  
V
AED3  
AED30  
AED19  
AED17  
AED21  
SS  
AG  
AF  
DD33  
SS  
DD33  
SS  
DV  
RSV47  
RSV72  
V
RSV75  
V
RSV50  
RSV74  
DV  
AED1  
AED7  
AED0  
AED24  
SDA  
AED10  
AED4  
DD33  
SS  
SS  
DD33  
AE  
V
V
RSV73  
V
RSV17  
V
V
AED12  
AED11  
AED26  
AED23  
ABE0  
SS  
SS  
SS  
SS  
SS  
AD  
AC  
AB  
AA  
Y
RSV66  
V
DV  
V
RSV63  
V
DV  
V
DV  
AED8  
SS  
DD33  
SS  
SS  
DD33  
SS  
DD33  
V
RSV65  
V
DV  
V
DV  
V
AED28  
AED25  
AED31  
V
DV  
V
DV  
SS  
SS  
DD33  
SS  
DD33  
SS  
SS  
DD33  
SS  
DD33  
AAWE/  
ASWE  
V
DV  
AED29  
ABE3  
AED27  
ABE2  
SS  
DD33  
DV  
V
ABE1  
DD33  
SS  
AAOE/  
ASOE  
V
DV  
PCI_EN  
ABE7  
RSV43  
RSV42  
RSV44  
ACE2  
ACE5  
SS  
DD33  
W
W
V
RSV70  
V
RSV71  
V
DV  
V
AR/W  
ABA1/  
ACE3  
ABA0/  
RSV41  
ACE4  
SS  
SS  
DD33  
SS  
V
V
RSV69  
V
CV  
V
DV  
AECLKOUT  
RSV20  
SS  
SS  
DD  
SS  
DD33  
EMIFA_EN DDR2_EN  
AEA5/  
MCBSP1  
_EN  
AEA0/  
AEA1/  
AEA6/  
PCI66  
U
U
RSV67  
V
CV  
V
DV  
V
SS  
DD  
SS  
DD33  
SS  
CFGGP0  
CFGGP1  
AEA4/  
SYSCLKOUT  
_EN  
AEA2/  
T
T
AEA3  
V
CV  
DD  
V
CV  
V
V
DV  
DD33  
AEA11  
PLLV1  
SS  
SS  
DD  
SS  
CFGGP2  
AEA14/  
HPI_  
ASADS/  
ASRE  
AEA13/  
R
R
CV  
DD  
V
CV  
DV  
V
SS  
AHOLD  
29  
AEA12  
28  
SS  
DD  
SS  
DD33  
LENDIAN  
WIDTH  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
Figure 2-3. C6454 Pin Map (Bottom View) [Quadrant B]  
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16  
V
17  
18  
V
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
AEA16/  
BOOT  
AEA15/  
AECLKIN  
_SEL  
AEA8/  
P
N
M
L
P
N
M
L
CV  
DV  
V
SS  
CV  
RSV30  
RSV31  
SS  
DD  
DD33  
DD  
SS  
PCI_EEAI  
MODE0  
AEA19/  
BOOT  
AEA7  
V
V
CV  
V
V
CV  
V
DV  
AHOLDA  
CLKIN1  
AECLKIN  
SS  
SS  
DD  
SS  
DD  
DD33  
MODE3  
AEA10/  
AEA9/  
CV  
V
CV  
DV  
V
DV  
V
SS  
DD  
SS  
DD  
SS  
DD33  
SS  
DD33  
SS  
MACSEL1  
MACSEL0  
AEA17/  
BOOT  
AEA18/  
BOOT  
DV  
CV  
V
CV  
V
V
ABUSREQ  
AED32  
AED44  
AED43  
AED50  
AED56  
AED59  
AED57  
AED61  
AED49  
ABE4  
AED34  
AED42  
ABE5  
AARDY  
AED40  
DD33  
DD  
SS  
DD  
SS  
SS  
MODE1  
MODE2  
K
J
K
J
V
ABE6  
DV  
AED33  
AED38  
AED47  
AED55  
AED63  
SS  
DD33  
V
DV  
AED46  
AED45  
AED54  
AED36  
SS  
DD33  
H
G
F
H
G
F
DV  
V
DV  
V
SS  
DD33  
SS  
DD33  
V
DV  
V
DV  
V
DV  
DV  
V
DV  
DD18  
AED48  
AED52  
AED35  
AED37  
SS  
DD18  
SS  
DD18  
SS  
DD18  
DD18  
SS  
DSDDQ  
GATE3  
V
V
V
SS  
DV  
RSV19  
DV  
DV  
V
SS  
SS  
SS  
DD18  
DD18  
DD18  
DSDDQ  
GATE2  
E
D
C
B
A
E
D
C
B
A
DEODT0  
DEA8  
DEA4  
AV  
V
DSDDQS2  
DSDDQS2  
DSDDQM2  
DV  
DSDDQS3  
DV  
V
DV  
DV  
V
SS  
DLL2  
SS  
DD18  
DD18  
SS  
DD33  
DD33  
DEA5  
DEA6  
DEA7  
DEA0  
DEA1  
DEA2  
DED19  
DED23  
DED22  
DED21  
DED27  
DED26  
DED25  
DSDDQS3  
DSDDQM3  
RSV11  
RSV12  
DED29  
RSV32  
RSV33  
DED31  
RSV09  
RSV23  
RSV22  
AED58  
AED60  
AED51  
AED39  
AED41  
DEA9  
DED18  
DED16  
DV  
V
DEA10  
DV  
DD18  
SS  
DD18  
DEA11  
16  
DEODT1  
DEA3  
18  
DED17  
19  
V
DED20  
21  
DED24  
22  
V
DED28  
24  
DED30  
25  
DV  
AED62  
27  
AED53  
28  
DV  
DD33  
SS  
SS  
DD18MON  
17  
20  
23  
26  
29  
Figure 2-4. C6454 Pin Map (Bottom View) [Quadrant C]  
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1
2
3
4
5
6
7
8
9
10  
11  
12  
SS  
13  
14  
15  
PCBE0/  
GP[2]  
PREQ/  
GP[15]  
PINTA/  
GP[14]  
P
N
M
L
P
N
M
L
PTRDY  
PCBE3  
DV  
V
RSV05  
V
CV  
V
CV  
DD  
DD33  
SS  
DD  
SS  
MTCLK/  
MDIO  
CV  
V
MTXD7  
MDCLK  
MTXD5  
GMTCLK  
RSV29  
RSV28  
RSV04  
CV  
V
CV  
V
SS  
DDMON  
SS  
DD  
SS  
DD  
RMREFCLK  
MTXD0/  
MRXD7  
MRXD5  
MTXD6  
MTXD4  
MCOL  
MTXD2  
V
DV  
CV  
V
CV  
V
CV  
DD  
SS  
DD33  
DD  
SS  
DD  
SS  
RMTXD0  
MTXD1/  
MRXD4  
DV  
V
V
CV  
V
CV  
V
DD33MON  
SS  
SS  
DD  
SS  
DD  
SS  
RMTXD1  
K
J
K
J
DV  
V
MTXD3  
V
DV  
DD33  
DD33  
SS  
SS  
MRXD0/  
MCRS/  
MTXEN/  
MRXD2  
MRCLK  
MRXD3  
DV  
V
SS  
DD33  
RMRXD0  
RMCRSDV  
RMTXEN  
MRXD1/  
MRXER/  
H
G
F
H
G
F
MRXD6  
MRXDV  
V
DV  
DD15  
SS  
RMRXD1  
RMRXER  
V
V
DV  
CLKIN2  
RSV07  
V
DV  
V
DV  
DV  
V
DV  
V
DV  
V
SS  
SS  
DD33  
SS  
DD15  
SS  
DD18  
DD18  
SS  
DD18  
SS  
DD18  
SS  
DV  
DV  
V
DV  
V
DV  
RSV14  
RSV13  
DV  
V
DV  
V
V
DED11  
DED10  
DED9  
V
SS  
DD18  
DD18  
SS  
DD18  
SS  
DD18  
DBA2  
DBA1  
DD15MON  
SS  
DD15  
SS  
SS  
E
D
C
B
A
E
D
C
B
A
RGRXD0  
RGRXD1  
RGRXC  
RGRXD2  
RGTXC  
V
RSV34  
V
DSDDQS1  
DSDDQS1  
DSDDQM1  
DV  
DSDDQS0  
DSDDQS0  
DV  
RSV18  
DCE0  
SS  
SS  
DD18  
DD18  
V
DV  
RGTXCTL  
DV  
RSV35  
RSV25  
RSV24  
RSV21  
6
DED14  
DED7  
DED6  
DED5  
DED4  
10  
DED3  
DED2  
DED1  
DED0  
12  
DSDCAS  
DSDCKE  
SS  
DD15  
DD15  
RGRXD3  
RGRXCTL  
RGTXD2 RGREFCLK  
V
DED15  
DED12  
DED13  
7
DED8  
DSDDQM0  
DSDRAS  
DSDWE  
V
DBA0  
SS  
REFSSTL  
DDR2  
DSDDQ  
GATE1  
V
V
RGTXD1  
RGTXD0  
3
RGMDCLK  
RGMDIO  
4
DV  
DV  
DV  
DD18  
DEA13  
SS  
REFHSTL  
DD15  
DD18  
CLKOUT  
DSDDQ  
GATE0  
DDR2  
DV  
RGTXD3  
PLLV2  
V
V
AV  
DEA12  
15  
DD15  
SS  
SS  
DLL1  
CLKOUT  
1
2
5
8
9
11  
13  
14  
Figure 2-5. C6454 Pin Map (Bottom View) [Quadrant D]  
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SPRS311A–APRIL 2006–REVISED DECEMBER 2006  
2.6 Signal Groups Description  
RESETSTAT  
RESET  
NMI  
CLKIN1  
Clock/PLL1  
and  
PLL Controller  
(A)  
SYSCLK4/GP[1]  
Reset and  
Interrupts  
PLLV1  
POR  
CLKIN2  
PLLV2  
Clock/PLL2  
RSV02  
RSV03  
RSV04  
RSV05  
RSV06  
RSV07  
•
TMS  
TDO  
TDI  
TCK  
TRST  
Reserved  
•
IEEE Standard  
1149.1  
(JTAG)  
Emulation  
EMU0  
EMU1  
•
RSV76  
RSV77  
RSV78  
•
•
•
EMU14  
EMU15  
EMU16  
EMU17  
EMU18  
Peripheral  
Enable/Disable  
PCI_EN  
Control/Status  
A. This pin functions as GP[1] by default. For more details, see the Device Configuration section of this document.  
Figure 2-6. CPU and Peripheral Signals  
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TOUTL0  
TINPL1  
TOUTL1  
Timer 1  
Timer 0  
TINPL0  
Timers (64-Bit)  
(C)  
GP[7]  
GP[6]  
GP[5]  
GP[4]  
PREQ/GP[15]  
(C)  
(C)  
(C)  
PINTA/GP[14]  
PRST/GP[13]  
PGNT/GP[12]  
FSX1/GP[11]  
GPIO  
(B)  
(B)  
(B)  
CLKX1/GP[3]  
PCBE0/GP[2]  
SYSCLK4/GP[1]  
(C)  
FSR1/GP[10]  
(B)  
(A)  
DX1/GP[9]  
(B)  
(B)  
DR1/GP[8]  
CLKR1/GP[0]  
General-Purpose Input/Output 0 (GPIO) Port  
A. This pin functions as GP[1] by default. For more details, see the Device Configuration section of this document.  
B. These McBSP1 peripheral pins are muxed with the GPIO peripheral pins and by default these signals function as GPIO peripheral pins. For  
more details, see the Device Configuration section of this document.  
C. These PCI peripheral pins are muxed with the GPIO peripheral pins and by default these signals function as GPIO peripheral pins. For more  
details, see the Device Configuration section of this document.  
Figure 2-7. Timers/GPIO Peripheral Signals  
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SPRS311A–APRIL 2006–REVISED DECEMBER 2006  
64  
Data  
AED[63:0]  
AECLKIN  
(A)  
ACE5  
AECLKOUT  
(A)  
ACE4  
Memory Map  
Space Select  
(A)  
ACE3  
(A)  
ACE2  
External  
Memory I/F  
Control  
20  
Address  
AEA[19:0]  
ASWE/AAWE  
AARDY  
ABE7  
ABE6  
AR/W  
AAOE/ASOE  
ASADS/ASRE  
ABE5  
ABE4  
ABE3  
ABE2  
Byte Enables  
ABE1  
ABE0  
AHOLD  
Bus  
AHOLDA  
ABUSREQ  
Arbitration  
Bank Address  
ABA[1:0]  
EMIFA (64-bit Data Bus)  
32  
DDR2CLKOUT  
DDR2CLKOUT  
DSDCKE  
Data  
DED[31:0]  
DSDCAS  
Memory Map  
Space Select  
DSDRAS  
DCE0  
DSDWE  
External  
Memory I/F  
Control  
DSDDQS[3:0]  
DSDDQS[3:0]  
14  
Address  
DEA[13:0]  
DSDDQGATE[0]  
DSDDQGATE[1]  
DSDDQGATE[2]  
DSDDQGATE[3]  
DEODT[1:0]  
DSDDQM3  
DSDDQM2  
DSDDQM1  
DSDDQM0  
Byte Enables  
Bank Address  
DBA[2:0]  
DDR2 Memoty Controller (32-bit Data Bus)  
A. The EMIFA ACE0 and ACE1 are not functionally supported on the C6454 device.  
Figure 2-8. EMIFA/DDR2 Memory Controller Peripheral Signals  
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Fixed-Point Digital Signal Processor  
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SPRS311A–APRIL 2006–REVISED DECEMBER 2006  
(A)  
HPI  
(Host-Port Interface)  
32  
HD[15:0]/AD[15:0]  
Data  
HD[31:16]/AD[31:16]  
HAS/PPAR  
HR/W/PCBE2  
HCS/PPERR  
HDS1/PSERR  
HDS2/PCBE1  
HRDY/PIRDY  
HCNTL0/PSTOP  
HCNTL1/PDEVSEL  
Register Select  
Control  
Half-Word  
Select  
HHWIL/PCLK  
(HPI16 ONLY)  
HINT/PFRAME  
McBSP1  
Transmit  
McBSP0  
Transmit  
CLKX0  
CLKX1/GP[3]  
FSX0  
DX0  
FSX1/GP[11]  
DX1/GP[9]  
CLKR0  
FSR0  
CLKR1/GP[0]  
FSR1/GP[10]  
DR1/GP[8]  
Receive  
Clock  
Receive  
Clock  
DR0  
CLKS  
(SHARED)  
McBSPs  
(Multichannel Buffered Serial Ports)  
(B)  
SCL  
SDA  
I2C  
A. These HPI pins are muxed with the PCI peripheral. By default, these pins function as HPI. When the HPI is enabled, the number of HPI pins  
used depends on the HPI configuration (HPI16 or HPI32). For more details on these muxed pins, see the Device Configuration section of this  
document.  
B. These McBSP1 peripheral pins are muxed with the GPIO peripheral pins and by default these signals function as GPIO peripheral pins. For  
more details, see the Device Configuration section of this document.  
Figure 2-9. HPI/McBSP/I2C Peripheral Signals  
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SPRS311A–APRIL 2006–REVISED DECEMBER 2006  
Ethernet MAC  
(EMAC)  
Transmit  
MII  
MTXD[7:2],  
MTXD[1:0]/RMTXD[1:0]  
RMII  
GMII  
MDIO  
(A)  
RGTXD[3:0]  
RGMII  
Input/Output  
MII  
Receive  
MDIO  
RMII  
GMII  
MII  
MRXD[7:2],  
MRXD[1:0]/RMRXD[1:0]  
RMII  
GMII  
(A)  
RGMII  
RGMDIO  
(A)  
RGMII  
RGRXD[3:0]  
Clock  
MII  
Error Detect  
and Control  
MDCLK  
RMII  
GMII  
MII  
MRXER/RMRXER,  
MRXDV,  
MCRS/RMCRSDV,  
MCOL,  
RMII  
GMII  
(A)  
RGMII  
RGMDCLK  
MTXEN/RMTXEN  
(A)  
RGMII  
RGTXCTL, RGRXCTL  
Clocks  
MII  
MTCLK/RMREFCLK,  
MRCLK,  
RMII  
GMII  
GMTCLK  
(A)  
RGTXC,  
RGRXC,  
RGMII  
RGREFCLK  
Ethernet MAC (EMAC) and MDIO  
A. RGMII signals are mutually exclusive to all other EMAC signals.  
Figure 2-10. EMAC/MDIO [MII/RMII/GMII/RGMII] Peripheral Signals  
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32  
HD[15:0]/AD[15:0]  
HD[31:16]/AD[31:16]  
Data/Address  
Clock  
HHWIL/PCLK  
PIDSEL  
HCNTL1/PDEVSEL  
HINT/PFRAME  
PINTA/GP[14]  
HAS/PPAR  
PCBE3  
Command  
Byte Enable  
HR/W/PCBE2  
HDS2/PCBE1  
PCBE0/GP[2]  
Control  
PRST/GP[13]  
HRDY/PIRDY  
HCNTL0/PSTOP  
PTRDY  
PGNT/GP[12]  
PREQ/GP[15]  
Arbitration  
(A)  
HDS1/PSERR  
HCS/PPERR  
Error  
PCI Interface  
A. These PCI pins are muxed with the HPI or GPIO peripherals. By default, these signals function as HPI or GPIO or EMAC. For more  
details on these muxed pins, see the Device Configuration section of this document.  
Figure 2-11. PCI Peripheral Signals  
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SPRS311A–APRIL 2006–REVISED DECEMBER 2006  
2.7 Terminal Functions  
The terminal functions table (Table 2-3) identifies the external signal names, the associated pin (ball)  
numbers along with the mechanical package designator, the pin type (I, O/Z, or I/O/Z), whether the pin  
has any internal pullup/pulldown resistors, and a functional pin description. For more detailed information  
on device configuration, peripheral selection, multiplexed/shared pins, and pullup/pulldown resistors, see  
Section 3, Device Configuration.  
Table 2-3. Terminal Functions  
SIGNAL  
TYPE(1) IPD/IPU(2)  
CLOCK/PLL CONFIGURATIONS  
DESCRIPTION  
NAME  
NO.  
CLKIN1  
CLKIN2  
PLLV1  
PLLV2  
N28  
G3  
I
I
IPD  
IPD  
Clock Input for PLL1.  
Clock Input for PLL2.  
T29  
A5  
A
A
1.8-V I/O supply voltage for PLL1  
1.8-V I/O supply voltage for PLL2  
SYSCLK4 is the clock output at 1/8 of the device speed (O/Z) or this pin can be  
programmed as the GP1 pin (I/O/Z) [default].  
SYSCLK4/GP[1](3)  
AJ13  
I/O/Z  
IPD  
JTAG EMULATION  
TMS  
TDO  
TDI  
AJ10  
AH8  
AH9  
AJ9  
I
IPU  
IPU  
IPU  
IPU  
JTAG test-port mode select  
JTAG test-port data out  
JTAG test-port data in  
JTAG test-port clock  
O/Z  
I
I
TCK  
JTAG test-port reset. For IEEE 1149.1 JTAG compatibility, see the IEEE  
1149.1 JTAG compatibility statement portion of this document.  
TRST  
AH7  
I
IPD  
EMU0(4)  
EMU1(4)  
EMU2  
AF7  
AE11  
AG9  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
IPU  
IPU  
IPU  
IPU  
IPU  
IPU  
IPU  
IPU  
IPU  
IPU  
IPU  
IPU  
IPU  
IPU  
IPU  
IPU  
IPU  
IPU  
IPU  
Emulation pin 0  
Emulation pin 1  
Emulation pin 2  
Emulation pin 3  
Emulation pin 4  
Emulation pin 5  
Emulation pin 6  
Emulation pin 7  
Emulation pin 8  
Emulation pin 9  
Emulation pin 10  
Emulation pin 11  
Emulation pin 12  
Emulation pin 13  
Emulation pin 14  
Emulation pin 15  
Emulation pin 16  
Emulation pin 17  
Emulation pin 18  
EMU3  
AF10  
AF9  
EMU4  
EMU5  
AE12  
AG8  
EMU6  
EMU7  
AF12  
AF11  
AH13  
AD10  
AD12  
AE10  
AD8  
EMU8  
EMU9  
EMU10  
EMU11  
EMU12  
EMU13  
EMU14  
EMU15  
EMU16  
EMU17  
EMU18  
AF13  
AE9  
AH12  
AH10  
AE13  
RESETS, INTERRUPTS, AND GENERAL-PURPOSE INPUT/OUTPUTS  
Device reset  
RESET  
AG14  
I
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal  
(2) IPD = Internal pulldown, IPU = Internal pullup. For most systems, a 1-kΩ resistor can be used to oppose the IPU/IPD. For more detailed  
information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see Section 3.7,  
Pullup/Pulldown Resistors.  
(3) These pins are multiplexed pins. For more details, see Section 3, Device Configuration.  
(4) The C6454 DSP does not require external pulldown resistors on the EMU0 and EMU1 pins for normal or boundary-scan operation.  
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SPRS311A–APRIL 2006–REVISED DECEMBER 2006  
Table 2-3. Terminal Functions (continued)  
SIGNAL  
NAME  
TYPE(1) IPD/IPU(2)  
DESCRIPTION  
NO.  
Nonmaskable interrupt, edge-driven (rising edge)  
Any noise on the NMI pin may trigger an NMI interrupt; therefore, if the NMI pin  
is not used, it is recommended that the NMI pin be grounded versus relying on  
the IPD.  
NMI  
AH4  
I
IPD  
RESETSTAT  
POR  
AE14  
AF14  
AG2  
AG3  
AJ2  
AH2  
P2  
O
Reset Status pin. The RESETSTAT pin indicates when the device is in reset  
Power on reset.  
I
GP[7]  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
O/Z  
IPD  
IPD  
IPD  
IPD  
GP[6]  
General-purpose input/output (GPIO) pins (I/O/Z).  
GP[5]  
GP[4]  
PREQ/GP[15]  
PINTA(5)/GP[14]  
PRST/GP[13]  
PGNT/GP[12]  
FSX1/GP[11]  
FSR1/GP[10]  
DX1/GP[9]  
DR1/GP[8]  
CLKX1/GP[3]  
PCBE0/GP[2]  
SYSCLK4/GP[1](3)  
CLKR1/GP[0]  
P3  
PCI peripheral pins or general-purpose input/output (GPIO) [15:12, 2] pins  
(I/O/Z) [default]  
R5  
R4  
PCI bus request (O/Z) or GP[15] (I/O/Z) [default]  
PCI interrupt A (O/Z) or GP[14] (I/O/Z) [default]  
PCI reset (I) or GP[13] (I/O/Z) [default]  
PCI bus grant (I) or GP[12] (I/O/Z) [default]  
PCI command/byte enable 0 (I/O/Z) or GP[2] (I/O/Z) [default]  
AG4  
AE5  
AG5  
AH5  
AF5  
P1  
IPD  
IPD  
IPD  
IPD  
IPD  
McBSP1 transmit clock (I/O/Z) or GP[3] (I/O/Z) [default]  
McBSP1 receive clock (I/O/Z) or GP[0] (I/O/Z) [default]  
GP[1] pin (I/O/Z). SYSCLK4 is the clock output at 1/8 of the device speed (O/Z)  
or this pin can be programmed as a GP[1] pin (I/O/Z) [default].  
AJ13  
AF4  
IPD  
IPD  
I/O/Z  
HOST-PORT INTERFACE (HPI) or PERIPHERAL COMPONENT INTERCONNECT (PCI)  
PCI enable pin. This pin controls the selection (enable/disable) of the HPI and  
GP[15:8], or PCI peripherals. This pin works in conjunction with the  
MCBSP1_EN (AEA5 pin) to enable/disable other peripherals (for more details,  
see Section 3, Device Configuration).  
PCI_EN  
Y29  
I
IPD  
HINT/PFRAME  
U3  
U4  
I/O/Z  
I/O/Z  
Host interrupt from DSP to host (O/Z) or PCI frame (I/O/Z)  
Host control - selects between control, address, or data registers (I) [default] or  
PCI device select (I/O/Z)  
HCNTL1/PDEVSEL  
Host control - selects between control, address, or data registers (I) [default] or  
PCI stop (I/O/Z)  
HCNTL0/PSTOP  
HHWIL/PCLK  
U5  
V3  
I/O/Z  
I/O/Z  
Host half-word select - first or second half-word (not necessarily high or low  
order)  
[For HPI16 bus width selection only] (I) [default] or PCI clock (I)  
HR/W/PCBE2  
HAS/PPAR  
T5  
T3  
U6  
U2  
U1  
T4  
P2  
P3  
R5  
R4  
P1  
P5  
R3  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I
Host read or write select (I) [default] or PCI command/byte enable 2 (I/O/Z)  
Host address strobe (I) [default] or PCI parity (I/O/Z)  
HCS/PPERR  
HDS1/PSERR(5)  
HDS2/PCBE1  
HRDY/PIRDY  
PREQ/GP[15]  
PINTA(5)/GP[14]  
PRST/GP[13]  
PGNT/GP[12]  
PCBE0/GP[2]  
PCBE3  
Host chip select (I) [default] or PCI parity error (I/O/Z)  
Host data strobe 1 (I) [default] or PCI system error (I/O/Z)  
Host data strobe 2 (I) [default] or PCI command/byte enable 1 (I/O/Z)  
Host ready from DSP to host (O/Z) [default] or PCI initiator ready (I/O/Z)  
PCI bus request (O/Z) or GP[15] (I/O/Z) [default]  
PCI interrupt A (O/Z) or GP[14] (I/O/Z) default]  
PCI reset (I) or GP[13] (I/O/Z) [default]  
PCI bus grant (I) or GP[12] (I/O/Z)[default]  
PCI command/byte enable 0 (I/O/Z) or GP[2] (I/O/Z)[default]  
PCI command/byte enable 3 (I/O/Z). By default, this pin has no function.  
PCI initialization device select (I). By default, this pin has no function.  
PIDSEL  
(5) These pins function as open-drain outputs when configured as PCI pins.  
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TMS320C6454  
Fixed-Point Digital Signal Processor  
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SPRS311A–APRIL 2006–REVISED DECEMBER 2006  
Table 2-3. Terminal Functions (continued)  
SIGNAL  
NAME  
TYPE(1) IPD/IPU(2)  
DESCRIPTION  
NO.  
P4  
PTRDY  
I/O/Z  
PCI target ready (PRTDY) (I/O/Z). By default, this pin has no function.  
HD31/AD31  
HD30/AD30  
HD29/AD29  
HD28/AD28  
HD27/AD27  
HD26/AD26  
HD25/AD25  
HD24/AD24  
HD23/AD23  
HD22/AD22  
HD21/AD21  
HD20/AD20  
HD19/AD19  
HD18/AD18  
HD17/AD17  
HD16/AD16  
HD15/AD15  
HD14/AD14  
HD13/AD13  
HD12/AD12  
HD11/AD11  
HD10/AD10  
HD9/AD9  
AA3  
AA5  
AC4  
AA4  
AC5  
Y1  
AD2  
W1  
Host-port data [31:16] pin (I/O/Z) [default] or PCI data-address bus [31:16]  
(I/O/Z)  
I/O/Z  
AC3  
AE1  
AD1  
W2  
AC1  
Y2  
AB1  
Y3  
AB2  
W4  
AC2  
V4  
AF3  
AE3  
AB3  
W5  
HD8/AD8  
I/O/Z  
Host-port data [15:0] pin (I/O/Z) [default] or PCI data-address bus [15:0] (I/O/Z)  
HD7/AD7  
AB4  
Y4  
HD6/AD6  
HD5/AD5  
AD3  
Y5  
HD4/AD4  
HD3/AD3  
AD4  
W6  
HD2/AD2  
HD1/AD1  
AB5  
AE2  
HD0/AD0  
EMIFA (64-BIT) - CONTROL SIGNALS COMMON TO ALL TYPES OF MEMORY  
ABA1/EMIFA_EN  
ABA0/DDR2_EN  
V25  
O/Z  
IPD  
EMIFA bank address control (ABA[1:0])  
•
Active-low bank selects for the 64-bit EMIFA.  
When interfacing to 16-bit Asynchronous devices, ABA1 carries bit 1 of the  
byte address.  
For an 8-bit Asynchronous interface, ABA[1:0] are used to carry bits 1 and  
0 of the byte address  
DDR2 Memory Controller enable (DDR2_EN) [ABA0]  
0 - DDR2 Memory Controller peripheral pins are disabled (default)  
1 - DDR2 Memory Controller peripheral pins are enabled  
V26  
O/Z  
IPD  
EMIFA enable (EMIFA_EN) [ABA1]  
0 - EMIFA peripheral pins are disabled (default)  
1 - EMIFA peripheral pins are enabled  
26  
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Fixed-Point Digital Signal Processor  
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SPRS311A–APRIL 2006–REVISED DECEMBER 2006  
Table 2-3. Terminal Functions (continued)  
SIGNAL  
NAME  
TYPE(1) IPD/IPU(2)  
DESCRIPTION  
NO.  
V27  
ACE5  
ACE4  
ACE3  
ACE2  
ABE7  
ABE6  
ABE5  
ABE4  
ABE3  
ABE2  
ABE1  
ABE0  
O/Z  
O/Z  
O/Z  
O/Z  
O/Z  
O/Z  
O/Z  
O/Z  
O/Z  
O/Z  
O/Z  
O/Z  
IPU  
IPU  
IPU  
IPU  
IPU  
IPU  
IPU  
IPU  
IPU  
IPU  
IPU  
IPU  
EMIFA memory space enables  
V28  
•
•
Enabled by bits 28 through 31 of the word address  
W26  
W27  
W29  
K26  
Only one pin is asserted during any external data access  
Note: The C6454 device does not have ACE0 and ACE1 pins  
L29  
EMIFA byte-enable control  
L28  
•
Decoded from the low-order address bits. The number of address bits or  
byte enables used depends on the width of external memory.  
AA29  
AA28  
AA25  
AA26  
•
Byte-write enables for most types of memory.  
EMIFA (64-BIT) - BUS ARBITRATION  
AHOLDA  
AHOLD  
N26  
R29  
L27  
O
I
IPU  
IPU  
IPU  
EMIFA hold-request-acknowledge to the host  
EMIFA hold request from the host  
EMIFA bus request output  
ABUSREQ  
O
EMIFA (64-BIT) - ASYNCHRONOUS/SYNCHRONOUS MEMORY CONTROL  
EMIFA external input clock. The EMIFA input clock (AECLKIN or SYSCLK4  
AECLKIN  
N29  
I
IPD  
clock) is selected at reset via the pullup/pulldown resistor on the AEA[15] pin.  
Note: AECLKIN is the default for the EMIFA input clock.  
AECLKOUT  
V29  
O/Z  
O/Z  
IPD  
IPU  
EMIFA output clock [at EMIFA input clock (AECLKIN or SYSCLK4) frequency]  
Asynchronous memory write-enable/Programmable synchronous interface  
write-enable  
AAWE/ASWE  
AB25  
AARDY  
K29  
W25  
Y28  
I
IPU  
IPU  
IPU  
Asynchronous memory ready input  
AR/W  
O/Z  
O/Z  
Asynchronous memory read/write  
AAOE/ASOE  
Asynchronous/Programmable synchronous memory output-enable  
Programmable synchronous address strobe or read-enable  
•
For programmable synchronous interface, the r_enable field in the Chip  
Select x Configuration Register selects between ASADS and ASRE:  
ASADS/ASRE  
R26  
O/Z  
IPU  
–
If r_enable = 0, then the ASADS/ASRE signal functions as the ASADS  
signal.  
–
If r_enable = 1, then the ASADS/ASRE signal functions as the ASRE  
signal.  
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Fixed-Point Digital Signal Processor  
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SPRS311A–APRIL 2006–REVISED DECEMBER 2006  
Table 2-3. Terminal Functions (continued)  
SIGNAL  
NAME  
TYPE(1) IPD/IPU(2)  
DESCRIPTION  
NO.  
EMIFA (64-BIT) - ADDRESS  
EMIFA external address (word address) (O/Z)  
AEA19/BOOTMODE3  
AEA18/BOOTMODE2  
AEA17/BOOTMODE1  
AEA16/BOOTMODE0  
AEA15/AECLKIN_SEL  
AEA14/HPI_WIDTH  
AEA13/LENDIAN  
N25  
L26  
L25  
P26  
P27  
R25  
R27  
R28  
Controls initialization of the DSP modes at reset (I) via pullup/pulldown resistors  
[For more detailed information, see Section 3, Device Configuration.]  
Note: If a configuration pin must be routed out from the device, the internal  
pullup/pulldown (IPU/IPD) resistor should not be relied upon; TI recommends  
the use of an external pullup/pulldown resistor.  
O/Z  
O/Z  
IPD  
IPU  
•
Boot mode - device boot mode configurations (BOOTMODE[3:0]) [Note:  
the peripheral must be enabled to use the particular boot mode.]  
AEA[19:16]:  
0000 - No boot (default mode)  
0001 - Host boot (HPI)  
AEA12  
0010 -Reserved  
0011 - Reserved  
0100 - EMIFA 8-bit ROM boot  
0101 - Master I2C boot  
0110 - Slave I2C boot  
0111 - Host boot (PCI)  
1000 thru 1111 - Reserved  
For more detailed information on the boot modes, see Section 2.4, Boot  
Sequence.  
CFGGP[2:0] pins must be set to 000b during reset for proper operation of  
the PCI boot mode.  
•
•
•
EMIFA input clock source select  
Clock mode select for EMIFA (AECLKIN_SEL)  
AEA15:  
0 - AECLKIN (default mode)  
1 - SYSCLK4 (CPU/x) Clock Rate. The SYSCLK4 clock rate is software  
selectable via the Software PLL1 Controller. By default, SYSCLK4 is  
selected as CPU/8 clock rate.  
O/Z  
IPD  
AEA11  
T25  
HPI peripheral bus width (HPI_WIDTH) select  
[Applies only when HPI is enabled; PCI_EN pin = 0]  
AEA14:  
0 - HPI operates as an HPI16 (default). (HPI bus is 16 bits wide. HD[15:0]  
pins are used and the remaining HD[31:16] pins are reserved pins in the  
Hi-Z state.)  
1 - HPI operates as an HPI32.  
Device Endian mode (LENDIAN)  
AEA13:  
0 - System operates in Big Endian mode  
1 - System operates in Little Endian mode(default)  
Note: For proper C6454 device operation, the AEA12 and AEA11 pins must  
be externally pulled down with a 1-kΩ resistor at device reset.  
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Fixed-Point Digital Signal Processor  
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SPRS311A–APRIL 2006–REVISED DECEMBER 2006  
Table 2-3. Terminal Functions (continued)  
SIGNAL  
TYPE(1) IPD/IPU(2)  
DESCRIPTION  
NAME  
AEA10/MACSEL1  
AEA9/MACSEL0  
AEA8/PCI_EEAI  
AEA7  
NO.  
M25  
M27  
P25  
N27  
U27  
U28  
•
EMAC/MDIO interface select bits (MACSEL[1:0])  
There are two configuration pins — MACSEL[1:0] — to select the  
EMAC/MDIO interface.  
AEA[10:9]: MACSEL[1:0]  
00 - 10/100 EMAC/MDIO MII Mode Interface (default)  
01 - 10/100 EMAC/MDIO RMII Mode Interface  
10 - 10/100/1000 EMAC/MDIO GMII Mode Interface  
11 - 10/100/1000 with RGMII Mode Interface  
AEA6/PCI66  
AEA5/MCBSP1_EN  
AEA4/  
SYSCLKOUT_EN  
[RGMII interface requires a 1.8 V or 1.5 V I/O supply]  
PCI I2C EEPROM Auto-Initialization (PCI_EEAI)  
T28  
•
•
AEA3  
T27  
T26  
U26  
AEA8: PCI auto-initialization via external I2C EEPROM  
If the PCI peripheral is disabled (PCI_EN pin = 0), this pin must not be  
pulled up.  
0 - PCI auto-initialization through I2C EEPROM is disabled (default).  
1 - PCI auto-initialization through I2C EEPROM is enabled.  
AEA2/CFGGP2  
AEA1/CFGGP1  
PCI Frequency Selection (PCI66)  
[The PCI peripheral needs be enabled (PCI_EN = 1) to use this function]  
Selects the PCI operating frequency of 66 MHz or 33 MHz PCI operating  
frequency is selected at reset via the pullup/pulldown resistor on the PCI66  
pin:  
AEA6:  
O/Z  
IPD  
0 - PCI operates at 33 MHz (default).  
1 - PCI operates at 66 MHz.  
Note: If the PCI peripheral is disabled (PCI_EN = 0), this pin must not be  
pulled up.  
•
•
•
McBSP1 Enable bit (MCBSP1_EN)  
Selects which function is enabled on the McBSP1/GPIO muxed pins  
AEA5:  
AEA0/CFGGP0  
U25  
0 - GPIO pin functions enabled (default).  
1 - McBSP1 pin functions enabled.  
SYSCLKOUT Enable bit (SYSCLKOUT_EN)  
Selects which function is enabled on the SYSCLK4/GP[1] muxed pin  
AEA4:  
0 - GP[1] pin function of the SYSCLK4/GP[1] pin enabled (default).  
1 - SYSCLK4 pin function of the SYSCLK4/GP[1] pin enabled.  
Configuration GPI (CFGGP[2:0]) (AEA[2:0])  
These pins are latched during reset and their values are shown in the  
DEVSTAT register. These values can be used by software routines for boot  
operations.  
AEA3:  
For proper C6454 device operation, the AEA3 pin must be pulled down to VSS  
with a 1-kΩ resistor at device reset.  
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Fixed-Point Digital Signal Processor  
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SPRS311A–APRIL 2006–REVISED DECEMBER 2006  
Table 2-3. Terminal Functions (continued)  
SIGNAL  
NAME  
TYPE(1) IPD/IPU(2)  
DESCRIPTION  
NO.  
EMIFA (64-BIT) - DATA  
AED63  
AED62  
AED61  
AED60  
AED59  
AED58  
AED57  
AED56  
AED55  
AED54  
AED53  
AED52  
AED51  
AED50  
AED49  
AED48  
AED47  
AED46  
AED45  
AED44  
AED43  
AED42  
AED41  
AED40  
AED39  
AED38  
AED37  
AED36  
AED35  
AED34  
AED33  
AED32  
AED31  
AED30  
AED29  
AED28  
AED27  
AED26  
AED25  
AED24  
AED23  
AED22  
F25  
A27  
C27  
C28  
E27  
D28  
D27  
F27  
G25  
G26  
A28  
F28  
B28  
G27  
B27  
G28  
H25  
J26  
H26  
J27  
H27  
J28  
I/O/Z  
IPU  
EMIFA external data  
C29  
J29  
D29  
J25  
F29  
F26  
G29  
K28  
K25  
K27  
AA27  
AG29  
AB29  
AC27  
AB28  
AC26  
AB27  
AC25  
AB26  
AD28  
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Fixed-Point Digital Signal Processor  
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SPRS311A–APRIL 2006–REVISED DECEMBER 2006  
Table 2-3. Terminal Functions (continued)  
SIGNAL  
NAME  
TYPE(1) IPD/IPU(2)  
DESCRIPTION  
NO.  
AED21  
AED20  
AED19  
AED18  
AED17  
AED16  
AED15  
AED14  
AED13  
AED12  
AED11  
AED10  
AED9  
AD29  
AJ28  
AF29  
AH28  
AE29  
AG28  
AF28  
AH26  
AE28  
AE26  
AD26  
AF27  
AG27  
AD27  
AE25  
AJ27  
AJ26  
AE27  
AG25  
AH27  
AF25  
AD25  
I/O/Z  
IPU  
EMIFA external data  
AED8  
AED7  
AED6  
AED5  
AED4  
AED3  
AED2  
AED1  
AED0  
DDR2 MEMORY CONTROLLER (32-BIT) - CONTROL SIGNALS COMMON TO ALL TYPES OF MEMORY  
DDR2 Memory Controller memory space enable. When the DDR2 Memory  
Controller is enabled, it always keeps this pin low.  
DCE0  
E14  
O/Z  
DBA2  
DBA1  
DBA0  
E15  
D15  
C15  
B14  
A14  
D13  
C13  
B13  
D14  
A17  
O/Z  
O/Z  
O/Z  
O/Z  
O/Z  
O/Z  
O/Z  
O/Z  
O/Z  
O/Z  
DDR2 Memory Controller bank address control  
DDR2CLKOUT  
DDR2CLKOUT  
DSDCAS  
DDR2 Memory Controller output clock (CLKIN2 frequency × 10)  
Negative DDR2 Memory Controller output clock (CLKIN2 frequency × 10)  
DDR2 Memory Controller SDRAM column-address strobe  
DDR2 Memory Controller SDRAM row-address strobe  
DSDRAS  
DSDWE  
DDR2 Memory Controller SDRAM write-enable  
DSDCKE  
DDR2 Memory Controller SDRAM clock-enable (used for self-refresh mode).  
DEODT1  
On-die termination signals to external DDR2 SDRAM. These pins should not be  
connected to the DDR2 SDRAM.  
Note: There are no on-die termination resistors implemented on the C6454  
DSP die.  
DEODT0  
E16  
O/Z  
DSDDQGATE3  
DSDDQGATE2  
DSDDQGATE1  
DSDDQGATE0  
DSDDQM3  
F21  
E21  
B9  
I
DDR2 Memory Controller data strobe gate [3:0]  
O/Z  
I
For hookup of these signals, please refer to the Implementing DDR2 PCB  
Layout on a TMS320C6454 Hardware Design Application Report (literature  
number SPRAAA9).  
A9  
O/Z  
O/Z  
O/Z  
O/Z  
C23  
C20  
C8  
DDR2 Memory Controller byte-enable controls  
•
Decoded from the low-order address bits. The number of address bits or  
byte enables used depends on the width of external memory.  
DSDDQM2  
DSDDQM1  
•
•
Byte-write enables for most types of memory.  
DSDDQM0  
C11  
O/Z  
Can be directly connected to SDRAM read and write mask signal (SDQM).  
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Fixed-Point Digital Signal Processor  
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SPRS311A–APRIL 2006–REVISED DECEMBER 2006  
Table 2-3. Terminal Functions (continued)  
SIGNAL  
NAME  
DSDDQS3  
TYPE(1) IPD/IPU(2)  
DESCRIPTION  
NO.  
E23  
E20  
E8  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
DSDDQS2  
DSDDQS1  
DSDDQS0  
DSDDQS3  
DSDDQS2  
DSDDQS1  
DSDDQS0  
DDR2 Memory Controller data strobe [3:0] positive  
E11  
D23  
D20  
D8  
DDR2 data strobe [3:0] negative  
Note: These pins are used to meet AC timings.  
D11  
DDR2 MEMORY CONTROLLER (32-BIT) - ADDRESS  
DEA13  
DEA12  
DEA11  
DEA10  
DEA9  
DEA8  
DEA7  
DEA6  
DEA5  
DEA4  
DEA3  
DEA2  
DEA1  
DEA0  
B15  
A15  
A16  
B16  
C16  
D16  
B17  
C17  
D17  
E17  
A18  
B18  
C18  
D18  
O/Z  
DDR2 Memory Controller external address  
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Fixed-Point Digital Signal Processor  
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SPRS311A–APRIL 2006–REVISED DECEMBER 2006  
Table 2-3. Terminal Functions (continued)  
SIGNAL  
NAME  
TYPE(1) IPD/IPU(2)  
DESCRIPTION  
NO.  
DDR2 MEMORY CONTROLLER (32-BIT) - DATA  
DED31  
DED30  
DED29  
DED28  
DED27  
DED26  
DED25  
DED24  
DED23  
DED22  
DED21  
DED20  
DED19  
DED18  
DED17  
DED16  
DED15  
DED14  
DED13  
DED12  
DED11  
DED10  
DED9  
B25  
A25  
B24  
A24  
D22  
C22  
B22  
A22  
D21  
C21  
B21  
A21  
D19  
C19  
A19  
B19  
C7  
I/O/Z  
DDR2 Memory Controller external data  
D7  
A7  
B7  
F9  
E9  
D9  
DED8  
C9  
DED7  
D10  
C10  
B10  
A10  
D12  
C12  
B12  
A12  
DED6  
DED5  
DED4  
DED3  
DED2  
DED1  
DED0  
TIMER 1  
TOUTL1  
TINPL1  
AG7  
AJ6  
O/Z  
I
IPD  
IPD  
Timer 1 output pin for lower 32-bit counter  
Timer 1 input pin for lower 32-bit counter  
TIMER 0  
TOUTL0  
TINPL0  
AF8  
AH6  
O/Z  
I
IPD  
IPD  
Timer 0 output pin for lower 32-bit counter  
Timer 0 input pin for lower 32-bit counter  
INTER-INTEGRATED CIRCUIT (I2C)  
SCL  
SDA  
AG26  
AF26  
I/O/Z  
I/O/Z  
I2C clock. When the I2C module is used, use an external pullup resistor.  
I2C data. When I2C is used, ensure there is an external pullup resistor.  
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SPRS311A–APRIL 2006–REVISED DECEMBER 2006  
Table 2-3. Terminal Functions (continued)  
SIGNAL  
NAME  
TYPE(1) IPD/IPU(2)  
DESCRIPTION  
NO.  
MULTICHANNEL BUFFERED SERIAL PORT 1 AND MULTICHANNEL BUFFERED SERIAL PORT 0 (McBSP1 and McBSP0)  
McBSP external clock source (as opposed to internal) (I)  
[shared by McBSP1 and McBSP0]  
CLKS  
AJ4  
I
IPD  
MULTICHANNEL BUFFERED SERIAL PORT 1 (McBSP1)  
CLKR1/GP[0]  
FSR1/GP[10]  
DR1/GP[8]  
AF4  
AE5  
AH5  
AG5  
AG4  
AF5  
I/O/Z  
IPD  
IPD  
IPD  
IPD  
IPD  
IPD  
McBSP1 receive clock (I/O/Z) or GP[0] (I/O/Z) [default]  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
McBSP1 receive frame sync (I/O/Z) or GP[10] (I/O/Z)[default]  
McBSP1 receive data (I) or GP[8] (I/O/Z) [default]  
DX1/GP[9]  
McBSP1 transmit data (O/Z) or GP[9] (I/O/Z) [default]  
McBSP1 transmit frame sync (I/O/Z) or GP[11] (I/O/Z) [default]  
McBSP1 transmit clock (I/O/Z) or GP[3] (I/O/Z) [default]  
FSX1/GP[11]  
CLKX1/GP[3]  
MULTICHANNEL BUFFERED SERIAL PORT 0 (McBSP0)  
CLKR0  
FSR0  
DR0  
AG1  
AH3  
AJ5  
AF6  
AJ3  
AG6  
I/O/Z  
I/O/Z  
I
IPU  
IPD  
IPD  
IPD  
IPD  
IPU  
McBSP0 receive clock (I/O/Z)  
McBSP0 receive frame sync (I/O/Z)  
McBSP0 receive data (I)  
DX0  
I/O/Z  
I/O/Z  
I/O/Z  
McBSP0 transmit data (O/Z)  
McBSP0 transmit frame sync (I/O/Z)  
McBSP0 transmit clock (I/O/Z)  
FSX0  
CLKX0  
MANAGEMENT DATA INPUT/OUTPUT (MDIO) FOR MII/RMII/GMII  
MDCLK  
MDIO  
M5  
N3  
I/O/Z  
I/O/Z  
IPD  
IPU  
MDIO serial clock (MDCLK) for MII/RMII/RGMII mode (O)  
MDIO serial data (MDIO) for MII/RMII/RGMII mode (I/O)  
MANAGEMENT DATA INPUT/OUTPUT (MDIO) FOR RGMII  
RGMDCLK  
RGMDIO  
B4  
A4  
O/Z  
I/O/Z  
MDIO serial clock for RGMII mode (RGMDCLK) (O)  
MDIO serial data for RGMII mode (RGMDIO) (I/O)  
ETHERNET MAC (EMAC) [MII/RMII/GMII]  
There are two configuration pins — the MAC_SEL[1:0] (AEA[10:9] pins) that select one of the four interface modes (MII, RMII, GMII, or  
RGMII) for the EMAC/MDIO interface. For more detailed information on the EMAC configuration pins, see Section 3, Device Configuration.  
This pin is EMAC receive clock (MRCLK) for MII [default] or GMII.  
MACSEL[1:0] dependent.  
MRCLK  
H1  
I
This pin is EMAC carrier sense (MCRS) (I) for MII [default] or GMII, or EMAC  
carrier sense/receive data valid (RMCRSDV) (I) for RMII. MACSEL[1:0]  
dependent.  
MCRS/RMCRSDV  
J4  
I/O/Z  
This pin is EMAC receive error (MRXIR) (I) for MII [default], RMII, or GMII.  
MACSEL[1:0] dependent.  
MRXER/RMRXER  
MRXDV  
H4  
H5  
I
I
This pin is EMAC MII [default] or GMII receive data valid (MRXDV) (I).  
MACSEL[1:0] dependent.  
MRXD7  
M2  
H2  
L2  
L1  
J3  
MRXD6  
MRXD5  
EMAC receive data bus for MII [default], RMII, or GMII  
MRXD4  
I
These pins function as EMAC receive data pins for MII [default], RMII, or GMII  
MRXD3  
(MRXD[x:0]) (I). MACSEL[1:0] dependent.  
MRXD2  
J1  
MRXD1/RMRXD1  
MRXD0/RMRXD0  
GMTCLK  
H3  
J2  
K5  
O/Z  
I
This pin is EMAC GMII transmit clock (GMTCLK) (O). MACSEL[1:0] dependent.  
This pin is either EMAC MII [default] or GMII transmit clock (MTCLK) (I) or the  
EMAC RMII reference clock (RMREFCLK) (I). The EMAC function is controlled  
by the MACSEL[1:0] (AEA[10:9] pins). For more detailed information, see  
Section 3, Device Configuration.  
MTCLK/RMREFCLK  
N4  
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SPRS311A–APRIL 2006–REVISED DECEMBER 2006  
Table 2-3. Terminal Functions (continued)  
SIGNAL  
NAME  
TYPE(1) IPD/IPU(2)  
DESCRIPTION  
NO.  
This pin is the EMAC collision sense (MCDL) (I) for MII [default] or GMII.  
MACSEL[1:0] dependent.  
MCOL  
K3  
I/O/Z  
I/O/Z  
This pin is either the EMAC transmit enable (MTXEN) (O) for MII [default],  
RMII, or GMII. MACSEL[1:0] dependent.  
MTXEN/RMTXEN  
J5  
MTXD7  
N5  
M3  
L5  
MTXD6  
MTXD5  
EMAC transmit data bus for MII [default], RMII, or GMII.  
MTXD4  
L3  
O/Z  
These pins function as EMAC transmit data pins (MTXD[x:0]) (O) for MII, RMII,  
or GMII. MACSEL[1:0] dependent.  
MTXD3  
K4  
M4  
L4  
MTXD2  
MTXD1/RMTXD1  
MTXD0/RMTXD0  
M1  
ETHERNET MAC (EMAC) [RGMII]  
There are two configuration pins — the MAC_SEL[1:0] (AEA[10:9] pins) that select one of the four interface modes (MII, RMII, GMII, or  
RGMII) for the EMAC/MDIO interface. For more detailed information on the EMAC configuration pins, see Section 3, Device Configuration.  
RGMII reference clock (O). This 125-MHz reference clock is provided as a  
convenience. It can be used as a clock source to a PHY, so that the PHY may  
RGREFCLK  
C4  
O/Z  
O/Z  
generate RXC clock to communicate with the EMAC. This clock is stopped  
while the device is in reset. This pin is available only when RGMII mode is  
selected ( MACSEL[1:0] =11).  
RGMII transmit clock (O). This pin is available only when RGMII mode is  
selected (MACSEL[1:0] =11).  
RGTXC  
D4  
RGTXD3  
RGTXD2  
RGTXD1  
RGTXD0  
A2  
C3  
B3  
A3  
RGMII transmit data [3:0] (O). This pin is available only when RGMII mode is  
selected (MACSEL[1:0] =11).  
O/Z  
RGMII transmit enable (O). This pin is available only when RGMII mode is  
selected (MACSEL[1:0] =11).  
RGTXCTL  
RGRXC  
D3  
E3  
O/Z  
I
RGMII receive clock (I). This pin is available only when RGMII mode is selected  
(MACSEL[1:0] =11).  
RGRXD3  
RGRXD2  
RGRXD1  
RGRXD0  
C1  
E4  
E2  
E1  
I
I
I
I
RGMII receive data [3:0] (I). This pin is available only when RGMII mode is  
selected (MACSEL[1:0] =11).  
RGMII receive control (I). This pin is available only when RGMII mode is  
selected (MACSEL[1:0] =11).  
RGRXCTL  
C2  
I
RESERVED FOR TEST  
RSV02  
RSV03  
RSV04  
RSV05  
RSV07  
V5  
W3  
N11  
P11  
G4  
Reserved. These pins must be connected directly to core supply (CVDD) for  
proper device operation.  
I
I
Reserved. This pin must be connected directly to 1.5-/1.8-V I/O supply  
(DVDD15) for proper device operation.  
Note: If the EMAC RGMII is not used, these pins can be connected directly to  
ground (VSS) .  
RSV09  
D26  
Reserved. This pin must be connected to ground (VSS) via a 200-Ω resistor for  
proper device operation.  
NOTE: If the DDR2 Memory Controller is not used, the VREFSSTL, RSV11, and  
RSV12 pins can be connected directly to ground (VSS) to save power.  
However, connecting these pins directly to ground will prevent boundary-scan  
from functioning on the DDR2 Memory Controller pins. To preserve  
boundary-scan functionality on the DDR2 Memory Controller pins, see  
Section 7.3.4.  
RSV11  
D24  
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SPRS311A–APRIL 2006–REVISED DECEMBER 2006  
Table 2-3. Terminal Functions (continued)  
SIGNAL  
NAME  
TYPE(1) IPD/IPU(2)  
DESCRIPTION  
NO.  
Reserved. This pin must be connected to the 1.8-V I/O supply (DVDD18) via a  
200-Ω resistor for proper device operation.  
NOTE: If the DDR2 Memory Controller is not used, the VREFSSTL, RSV11, and  
RSV12 pins can be connected directly to ground (VSS) to save power.  
However, connecting these pins directly to ground will prevent boundary-scan  
from functioning on the DDR2 Memory Controller pins. To preserve  
boundary-scan functionality on the DDR2 Memory Controller pins, see  
Section 7.3.4.  
RSV12  
C24  
Reserved. This pin must be connected to ground (VSS) via a 200-Ω resistor for  
proper device operation.  
NOTE: If the RGMII mode of the EMAC is not used, the DVDD15, VREFHSTL  
,
RSV13  
RSV14  
F2  
F1  
RSV13, and RSV14 pins can be connected to directly ground (VSS) to save  
power. However, connecting these pins directly to ground will prevent  
boundary-scan from functioning on the RGMII pins of the EMAC. To preserve  
boundary-scan functionality on the RGMII pins, see Section 7.3.4.  
Reserved. This pin must be connected to the 1.5/1.8-V I/O supply (DVDD15) via  
a 200-Ω resistor for proper device operation.  
NOTE: If the RGMII mode of the EMAC is not used, the DVDD15, VREFHSTL  
,
RSV13, and RSV14 pins can be connected to directly ground (VSS) to save  
power. However, connecting these pins directly to ground will prevent  
boundary-scan from functioning on the RGMII pins of the EMAC. To preserve  
boundary-scan functionality on the RGMII pins, see Section 7.3.4.  
Reserved. This pin must be connected via a 39-Ω resistor directly to ground  
(VSS) for proper device operation. The resistor used should have a minimal  
rating of 1/10 W.  
RSV15  
RSV16  
T1  
T2  
Reserved. This pin must be connected via a 20-Ω resistor directly to 3.3-V I/O  
Supply (DVDD33) for proper device operation. The resistor used should have a  
minimal rating of 1/10 W.  
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SPRS311A–APRIL 2006–REVISED DECEMBER 2006  
Table 2-3. Terminal Functions (continued)  
SIGNAL  
NAME  
TYPE(1) IPD/IPU(2)  
DESCRIPTION  
NO.  
AE21  
E13  
RSV17  
RSV18  
RSV19  
RSV20  
RSV21  
RSV22  
RSV23  
RSV24  
RSV25  
RSV26  
RSV27  
RSV36  
RSV37  
RSV38  
RSV39  
RSV40  
RSV41  
RSV42  
RSV43  
RSV44  
RSV45  
RSV46  
RSV47  
RSV48  
RSV49  
RSV50  
RSV51  
RSV52  
RSV53  
RSV54  
RSV55  
RSV56  
RSV57  
RSV58  
RSV59  
RSV60  
RSV61  
RSV62  
RSV28  
RSV29  
RSV30  
RSV31  
A
A
A
A
A
O
O
O
O
A
A
F18  
U29  
A6  
B26  
C26  
B6  
C6  
AJ11  
AH11  
AD11  
AD9  
AG10  
AG11  
AJ12  
W28  
Y26  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
I/O/Z  
O/Z  
O/Z  
O/Z  
O/Z  
I
IPU  
IPU  
IPU  
IPU  
IPU  
IPU  
IPU  
IPU  
Y25  
Reserved. (Leave unconnected, do not connect to power or ground.)  
Y27  
AF15  
AG15  
AF17  
AG18  
AG22  
AF23  
AF18  
AG19  
AG21  
AF22  
AH18  
AJ18  
AJ22  
AH22  
AH17  
AJ19  
AJ21  
AH23  
N7  
I
O/Z  
O/Z  
O/Z  
O/Z  
O/Z  
O/Z  
O/Z  
O/Z  
I
I
I
I
I
I
I
I
A
N6  
A
Reserved. These pins must be connected directly to VSS for proper device  
operation.  
P23  
A
P24  
A
Reserved. This pin must be connected to the 1.8-V I/O supply (DVDD18) via a  
1-kΩ resistor for proper device operation.  
RSV32  
RSV33  
D25  
C25  
Reserved. This pin must be connected directly to ground for proper device  
operation.  
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SPRS311A–APRIL 2006–REVISED DECEMBER 2006  
Table 2-3. Terminal Functions (continued)  
SIGNAL  
NAME  
TYPE(1) IPD/IPU(2)  
DESCRIPTION  
NO.  
Reserved. This pin must be connected to the 1.8-V I/O supply (DVDD18) via a  
1-kΩ resistor for proper device operation.  
RSV34  
RSV35  
E6  
Reserved. This pin must be connected directly to ground for proper device  
operation.  
D6  
RSV63  
RSV64  
RSV65  
RSV66  
RSV67  
RSV68  
RSV69  
RSV70  
RSV71  
RSV72  
RSV73  
RSV74  
RSV75  
RSV76  
RSV77  
RSV78  
AD20  
AC15  
AC17  
AD16  
U16  
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
V15  
V17  
W16  
Reserved. These pins must be connected directly to VSS for proper device  
operation.  
W18  
AE17  
AE19  
AE23  
AF20  
AH20  
AJ17  
AJ23  
SUPPLY VOLTAGE MONITOR PINS  
Die-side 1.2-V core supply (CVDD) voltage monitor pin. The monitor pins  
indicate the voltage on the die and, therefore, provide the best probe point for  
voltage monitoring purposes. For more information regarding the use of this  
and other voltage monitoring pins. If the CVDDMON pin is not used, it should be  
connected directly to the 1.2-V core supply (CVDD).  
CVDDMON  
N1  
L6  
Die-side 3.3-V I/O supply (DVDD33) voltage monitor pin. The monitor pins  
indicate the voltage on the die and, therefore, provide the best probe point for  
voltage monitoring purposes. For more information regarding the use of this  
and other voltage monitoring pins. If the DVDD33MON pin is not used, it should  
be connected directly to the 3.3-V I/O supply (DVDD33).  
DVDD33MON  
Die-side 1.5-/1.8-V I/O supply (DVDD15) voltage monitor pin. The monitor pins  
indicate the voltage on the die and, therefore, provide the best probe point for  
voltage monitoring purposes. For more information regarding the use of this  
and other voltage monitoring pins. If the DVDD15MON pin is not used, it should  
be connected directly to the 1.5-/1.8-V I/O supply (DVDD15).  
DVDD15MON  
F3  
I
NOTE: If the RGMII mode of the EMAC is not used, the DVDD15, DVDD15MON  
,
VREFHSTL, RSV13, and RSV14 pins can be connected directly to ground (VSS  
)
to save power. However, connecting these pins directly to ground will prevent  
boundary-scan from functioning on the RGMII pins of the EMAC. To preserve  
boundary-scan functionality on the RGMII pins, see Section 7.3.4.  
Die-side 1.8-V I/O supply (DVDD18) voltage monitor pin. The monitor pins  
indicate the voltage on the die and, therefore, provide the best probe point for  
voltage monitoring purposes. For more information regarding the use of this  
and other voltage monitoring pins. If the DVDD18MON pin is not used, it should  
be connected directly to the 1.8-V I/O supply (DVDD18).  
DVDD18MON  
A26  
SUPPLY VOLTAGE PINS  
(DVDD18/2)-V reference for SSTL buffer (DDR2 Memory Controller). This input  
voltage can be generated directly from DVDD18 using two 1-kΩ resistors to form  
a resistor divider circuit.  
NOTE: The DDR2 Memory Controller is not used, the VREFSSTL, RSV11, and  
RSV12 pins can be connected directly to ground (VSS) to save power.  
However, connecting these pins directly to ground will prevent boundary-scan  
from functioning on the DDR2 Memory Controller pins. To preserve  
boundary-scan functionality on the DDR2 Memory Controller pins, see  
Section 7.3.4.  
VREFSSTL  
C14  
A
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SPRS311A–APRIL 2006–REVISED DECEMBER 2006  
Table 2-3. Terminal Functions (continued)  
SIGNAL  
NAME  
TYPE(1) IPD/IPU(2)  
DESCRIPTION  
NO.  
(DVDD15/2)-V reference for HSTL buffer (EMAC RGMII). VREFHSTL can be  
generated directly from DVDD15 using two 1-kΩ resistors to form a resistor  
divider circuit.  
NOTE: If the RGMII mode of the EMAC is not used, the DVDD15, VREFHSTL  
,
VREFHSTL  
B2  
A
A
RSV13, and RSV14 pins can be connected to directly ground (VSS) to save  
power. However, connecting these pins directly to ground will prevent  
boundary-scan from functioning on the RGMII pins of the EMAC. To preserve  
boundary-scan functionality on the RGMII pins, see Section 7.3.4.  
AVDLL1  
AVDLL2  
A13  
E18  
A1  
1.8-V I/O supply voltage.  
B5  
1.8-V or 1.5-V I/O supply voltage for the RGMII function of the EMAC.  
NOTE: If the RGMII mode of the EMAC is not used, the DVDD15, VREFHSTL  
,
D2  
RSV13, and RSV14 pins can be connected to directly ground (VSS) to save  
power. However, connecting these pins directly to ground will prevent  
boundary-scan from functioning on the RGMII pins of the EMAC. To preserve  
boundary-scan functionality on the RGMII pins, see Section 7.3.4.  
DVDD15  
D5  
S
F5  
G6  
H7  
B8  
B11  
B20  
B23  
E10  
E12  
E22  
E24  
F7  
F11  
F13  
F15  
F17  
F19  
F23  
G8  
DVDD18  
S
1.8-V I/O supply voltage (DDR2 Memory Controller)  
G10  
G12  
G14  
G16  
G18  
G20  
G22  
G24  
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SPRS311A–APRIL 2006–REVISED DECEMBER 2006  
Table 2-3. Terminal Functions (continued)  
SIGNAL  
NAME  
TYPE(1) IPD/IPU(2)  
DESCRIPTION  
NO.  
A29  
E26  
E28  
G2  
H23  
H28  
J6  
J24  
K1  
K7  
K23  
L24  
M7  
M23  
M28  
N24  
P6  
P28  
R1  
R6  
R23  
T7  
DVDD33  
S
3.3-V I/O supply voltage  
T24  
U23  
V1  
V7  
V24  
W23  
Y7  
Y24  
AA1  
AA6  
AA23  
AB7  
AB24  
AC6  
AC9  
AC11  
AC13  
AC19  
AC21  
AC23  
AC29  
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Table 2-3. Terminal Functions (continued)  
SIGNAL  
NAME  
TYPE(1) IPD/IPU(2)  
DESCRIPTION  
NO.  
AD5  
AD7  
AD14  
AD18  
AD22  
AD24  
AE6  
AE8  
AE15  
AF1  
AF16  
AF24  
AG12  
AG17  
AG23  
AH14  
AH16  
AH24  
AJ1  
DVDD33  
S
3.3-V I/O supply voltage  
AJ7  
AJ15  
AJ25  
AJ29  
L12  
L14  
L16  
L18  
M11  
M13  
M15  
M17  
M19  
N12  
CVDD  
S
1.2-V core supply voltage  
N14  
N16  
N18  
P13  
P15  
P17  
P19  
R12  
R14  
R16  
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Table 2-3. Terminal Functions (continued)  
SIGNAL  
NAME  
TYPE(1) IPD/IPU(2)  
DESCRIPTION  
NO.  
R18  
T11  
T13  
T15  
T17  
T19  
U12  
U14  
U18  
V11  
V13  
V19  
W12  
W14  
CVDD  
S
1.2-V core supply voltage  
GROUND PINS  
A8  
A11  
A20  
A23  
B1  
B29  
C5  
D1  
E5  
E7  
VSS  
GND  
Ground pins  
E19  
E25  
E29  
F4  
F6  
F8  
F10  
F12  
F14  
F16  
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Table 2-3. Terminal Functions (continued)  
SIGNAL  
NAME  
TYPE(1) IPD/IPU(2)  
DESCRIPTION  
NO.  
F20  
F22  
F24  
G1  
G5  
G7  
G9  
G11  
G13  
G15  
G17  
G19  
G21  
G23  
H6  
H24  
H29  
J7  
VSS  
GND  
Ground pins  
J23  
K2  
K6  
K24  
L7  
L11  
L13  
L15  
L17  
L19  
L23  
M6  
M12  
M14  
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SPRS311A–APRIL 2006–REVISED DECEMBER 2006  
Table 2-3. Terminal Functions (continued)  
SIGNAL  
NAME  
TYPE(1) IPD/IPU(2)  
DESCRIPTION  
NO.  
M16  
M18  
M24  
M26  
M29  
N2  
N13  
N15  
N17  
N19  
N23  
P7  
P12  
P14  
P16  
P18  
P29  
R2  
VSS  
GND  
Ground pins  
R7  
R11  
R13  
R15  
R17  
R19  
R24  
T6  
T12  
T14  
T16  
T18  
T23  
U7  
U11  
U13  
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Table 2-3. Terminal Functions (continued)  
SIGNAL  
NAME  
TYPE(1) IPD/IPU(2)  
DESCRIPTION  
NO.  
U15  
U17  
U19  
U24  
V2  
V6  
V12  
V14  
V16  
V18  
V23  
W7  
W11  
W13  
W15  
W17  
W19  
W24  
Y6  
VSS  
GND  
Ground pins  
Y23  
AA2  
AA7  
AA24  
AB6  
AB23  
AC7  
AC8  
AC10  
AC12  
AC14  
AC16  
AC18  
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Table 2-3. Terminal Functions (continued)  
SIGNAL  
NAME  
TYPE(1) IPD/IPU(2)  
DESCRIPTION  
NO.  
AC20  
AC22  
AC24  
AC28  
AD6  
AD13  
AD15  
AD17  
AD19  
AD21  
AD23  
AE4  
AE7  
AE16  
AE18  
AE20  
AE22  
AE24  
AF2  
VSS  
GND  
Ground pins  
AF19  
AF21  
AG13  
AG16  
AG20  
AG24  
AH1  
AH15  
AH19  
AH21  
AH25  
AH29  
AJ8  
AJ14  
AJ16  
AJ20  
AJ24  
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2.8 Development  
2.8.1 Development Support  
In case the customer would like to develop their own features and software on the C6454 device, TI offers  
an extensive line of development tools for the TMS320C6000™ DSP platform, including tools to evaluate  
the performance of the processors, generate code, develop algorithm implementations, and fully integrate  
and debug software and hardware modules. The tool's support documentation is electronically available  
within the Code Composer Studio™ Integrated Development Environment (IDE).  
The following products support development of C6000™ DSP-based applications:  
Software Development Tools: Code Composer Studio™ Integrated Development Environment (IDE):  
including Editor C/C++/Assembly Code Generation, and Debug plus additional development tools  
Scalable, Real-Time Foundation Software (DSP/BIOS™), which provides the basic run-time target  
software needed to support any DSP application.  
Hardware Development Tools: Extended Development System (XDS™) Emulator (supports C6000™  
DSP multiprocessor system debug) EVM (Evaluation Module)  
2.8.2 Device Support  
2.8.2.1 Device and Development-Support Tool Nomenclature  
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all  
DSP devices and support tools. Each DSP commercial family member has one of three prefixes: TMX,  
TMP, or TMS (e.g., TMX320C6454ZTZ). Texas Instruments recommends two of three possible prefix  
designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of  
product development from engineering prototypes (TMX/TMDX) through fully qualified production  
devices/tools (TMS/TMDS).  
Device development evolutionary flow:  
TMX  
TMP  
TMS  
Experimental device that is not necessarily representative of the final device's electrical  
specifications  
Final silicon die that conforms to the device's electrical specifications but has not completed  
quality and reliability verification  
Fully qualified production device  
Support tool development evolutionary flow:  
TMDX  
Development-support product that has not yet completed Texas Instruments internal  
qualification testing.  
TMDS  
Fully qualified development-support product  
TMX and TMP devices and TMDX development-support tools are shipped with against the following  
disclaimer:  
"Developmental product is intended for internal evaluation purposes."  
TMS devices and TMDS development-support tools have been characterized fully, and the quality and  
reliability of the device have been demonstrated fully. TI's standard warranty applies.  
Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard  
production devices. Texas Instruments recommends that these devices not be used in any production  
system because their expected end-use failure rate still is undefined. Only qualified production devices are  
to be used.  
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TI device nomenclature also includes a suffix with the device family name. This suffix indicates the  
package type (for example, ZTZ), the temperature range (for example, blank is the default commercial  
temperature range), and the device speed range, in megahertz (for example, blank is 1000 MHz [1 GHz]).  
Figure 2-12 provides a legend for reading the complete device name for any TMS320C64x+™ DSP  
generation member.  
For device part numbers and further ordering information for TMS320C6454 in the ZTZ/GTZ package  
type, see the TI website ( www.ti.com) or contact your TI sales representative.  
TMX  
320  
C6454  
ZTZ  
(
)
(
)
PREFIX  
DEVICE SPEED RANGE  
7 = 720 MHz  
TMX = Experimental device  
TMS = Qualified device  
8 = 850 MHz  
Blank = 1 GHz  
TEMPERATURE RANGE  
DEVICE FAMILY  
Blank = 0°C to +90°C (default commercial temperature)  
320 = TMS320t DSP family  
(A)  
DEVICE  
PACKAGE TYPE  
C64x+tDSP:  
ZTZ = 697-pin plastic BGA, with Pb-Free solder balls  
GTZ = 697-pin plastic BGA, with Pb-ed solder balls  
C6454  
A. BGA = Ball Grid Array  
Figure 2-12. TMS320C64x+™ DSP Device Nomenclature (including the TMS320C6454 DSP)  
2.8.2.2 Documentation Support  
The following documents describe the TMS320C6454 Fixed-Point Digital Signal Processor. Copies of  
these documents are available on the Internet at www.ti.com. Tip: Enter the literature number in the  
search box provided at www.ti.com.  
The current documentation that describes the TMS320C6454, related peripherals, and other technical  
collateral, is available in the C6000 DSP product folder at: www.ti.com/c6000.  
SPRU732  
TMS320C64x/C64x+ DSP CPU and Instruction Set Reference Guide. Describes the CPU  
architecture, pipeline, instruction set, and interrupts for the TMS320C64x and TMS320C64x+  
digital signal processors (DSPs) of the TMS320C6000 DSP family. The C64x/C64x+ DSP  
generation comprises fixed-point devices in the C6000 DSP platform. The C64x+ DSP is an  
enhancement of the C64x DSP with added functionality and an expanded instruction set.  
SPRU862  
TMS320C64x+ DSP Cache User's Guide. Explains the fundamentals of memory caches  
and describes how the two-level cache-based internal memory architecture in the  
TMS320C64x+ digital signal processor (DSP) of the TMS320C6000 DSP family can be  
efficiently used in DSP applications. Shows how to maintain coherence with external  
memory, how to use DMA to reduce memory latencies, and how to optimize your code to  
improve cache efficiency. The internal memory architecture in the C64x+ DSP is organized  
in a two-level hierarchy consisting of a dedicated program cache (L1P) and a dedicated data  
cache (L1D) on the first level. Accesses by the CPU to the these first level caches can  
complete without CPU pipeline stalls. If the data requested by the CPU is not contained in  
cache, it is fetched from the next lower memory level, L2 or external memory.  
SPRU871  
TMS320C64x+ DSP Megamodule Reference Guide. Describes the TMS320C64x+ digital  
signal processor (DSP) megamodule. Included is a discussion on the internal direct memory  
access (IDMA) controller, the interrupt controller, the power-down controller, memory  
protection, bandwidth management, and the memory and cache.  
SPRAA84 TMS320C64x to TMS320C64x+ CPU Migration Guide. Describes migrating from the Texas  
Instruments TMS320C64x digital signal processor (DSP) to the TMS320C64x+ DSP. The  
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objective of this document is to indicate differences between the two cores. Functionality in  
the devices that is identical is not included.  
SPRU889  
High-Speed DSP Systems Design Reference Guide. Provides recommendations for  
meeting the many challenges of high-speed DSP system design. These recommendations  
include information about DSP audio, video, and communications systems for the C5000 and  
C6000 DSP platforms.  
SPRU970  
SPRU966  
SPRU975  
TMS320C645x DSP DDR2 Memory Controller User's Guide. This document describes the  
DDR2 memory controller in the TMS320C645x digital-signal processors (DSPs).  
TMS320C645x DSP Enhanced DMA (EDMA3) Controller User's Guide. This document  
describes the Enhanced DMA (EDMA3) Controller on the TMS320C645x device.  
TMS320C645x DSP EMAC/MDIO Module User's Guide. This document provides a  
functional description of the Ethernet Media Access Controller (EMAC) and Physical layer  
(PHY) device Management Data Input/Output (MDIO) module integrated with the devices of  
the TMS320C645x family.  
SPRU971  
SPRU724  
TMS320C645x DSP External Memory Interface (EMIF) User's Guide. This document  
describes the operation of the external memory interface (EMIF) in the digital signal  
processors (DSPs) of the TMS320C645x DSP family.  
TMS320C645x DSP General-Purpose Input/Output (GPIO) User's Guide. This document  
describes the general-purpose input/output (GPIO) peripheral in the digital signal processors  
(DSPs) of the TMS320C645x DSP family. The GPIO peripheral provides dedicated  
general-purpose pins that can be configured as either inputs or outputs. When configured as  
an input, you can detect the state of the input by reading the state of an internal register.  
When configured as an output, you can write to an internal register to control the state driven  
on the output pin.  
SPRU969  
SPRU974  
TMS320C645x DSP Host Port Interface (HPI) User's Guide. This guide describes the host  
port interface (HPI) on the TMS320C645x digital signal processors (DSPs). The HPI enables  
an external host processor (host) to directly access DSP resources (including internal and  
external memory) using a 16-bit (HPI16) or 32-bit (HPI32) interface.  
TMS320C645x DSP Inter-Integrated Circuit (I2C) Module User's Guide. This document  
describes the inter-integrated circuit (I2C) module in the TMS320C645x Digital Signal  
Processor (DSP). The I2C provides an interface between the TMS320C645x device and  
other devices compliant with Philips Semiconductors Inter-IC bus (I2C-bus) specification  
version 2.1 and connected by way of an I2C-bus. This document assumes the reader is  
familiar with the I2C-bus specification.  
SPRUE60 TMS320C645x DSP Peripheral Component Interconnect (PCI) User's Guide. This  
document describes the peripheral component interconnect (PCI) port in TMS320C645x  
devices. See the PCI Specification revision 2.3 for details on the PCI interface.  
SPRUE56 TMS320C645x DSP Software-Programmable Phase-Locked Loop (PLL) Controller  
User's Guide. This document describes the operation of the software-programmable  
phase-locked loop (PLL) controller in the TMS320C645x digital signal processors (DSPs).  
The PLL controller offers flexibility and convenience by way of software-configurable  
multipliers and dividers to modify the input signal internally. The resulting clock outputs are  
passed to the TMS320C645x DSP core, peripherals, and other modules inside the  
TMS320C645x DSP.  
SPRU968  
TMS320C645x DSP 64-Bit Timer User's Guide. This document provides an overview of the  
64-bit timer in the TMS320C645x DSP. The timer can be configured as a general-purpose  
64-bit timer, dual general-purpose 32-bit timers, or a watchdog timer. When configured as a  
dual 32-bit timers, each half can operate in conjunction (chain mode) or independently  
(unchained mode) of each other.  
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3 Device Configuration  
On the C6454 device, certain device configurations like boot mode, pin multiplexing, and endianess, are  
selected at device reset. The status of the peripherals (enabled/disabled) is determined after device reset.  
By default, the peripherals on the C6454 device are disabled and need to be enabled by software before  
being used.  
3.1 Device Configuration at Device Reset  
Table 3-1 describes the C6454 device configuration pins. The logic level of the AEA[19:0], ABA[1:0], and  
PCI_EN pins is latched at reset to determine the device configuration. The logic level on the device  
configuration pins can be set by using external pullup/pulldown resistors or by using some control device  
(e.g., FPGA/CPLD) to intelligently drive these pins. When using a control device, care should be taken to  
ensure there is no contention on the lines when the device is out of reset. The device configuration pins  
are sampled during reset and are driven after the reset is removed. To avoid contention, the control device  
should only drive the EMIFA pins when RESETSTAT is low.  
NOTE  
If a configuration pin must be routed out from the device and 3-stated (not driven), the  
internal pullup/pulldown (IPU/IPD) resistor should not be relied upon; TI recommends the  
use of an external pullup/pulldown resistor. For more detailed information on  
pullup/pulldown resistors and situations where external pullup/pulldown resistors are  
required, see Section 3.7, Pullup/Pulldown Resistors.  
Table 3-1. C6454 Device Configuration Pins (AEA[19:0], ABA[1:0], and PCI_EN)  
CONFIGURATION  
PIN  
IPD/  
NO.  
FUNCTIONAL DESCRIPTION  
IPU(1)  
Boot Mode Selections (BOOTMODE [3:0]).  
These pins select the boot mode for the device.  
0000  
0001  
0010  
0011  
0100  
0101  
0110  
0111  
No boot (default mode)  
Host boot (HPI)  
Reserved  
Reserved  
[N25,  
L26,  
L25,  
P26]  
EMIFA 8-bit ROM boot  
Master I2C boot  
Slave I2C boot  
Host boot (PCI)  
AEA[19:16]  
IPD  
1000 thru Reserved  
1111  
If selected for boot, the corresponding peripheral is automatically enabled after device reset.  
For more detailed information on boot modes, see Section 2.4, Boot Sequence.  
CFGGP[2:0] pins must be set to 000b during reset for proper operation of the PCI boot  
mode.  
EMIFA input clock source select (AECLKIN_SEL).  
0
1
AECLKIN (default mode)  
AEA15  
P27  
IPD  
SYSCLK4 (CPU/x) Clock Rate. The SYSCLK4 clock rate is software selectable  
via the Software PLL1 Controller. By default, SYSCLK4 is selected as CPU/8  
clock rate.  
(1) IPD = Internal pulldown, IPU = Internal pullup. For most systems, a 1-kΩ resistor can be used to oppose the IPU/IPD. For more detailed  
information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see Section 3.7,  
Pullup/Pulldown Resistors.  
50  
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Table 3-1. C6454 Device Configuration Pins (AEA[19:0], ABA[1:0], and PCI_EN) (continued)  
CONFIGURATION  
IPD/  
NO.  
FUNCTIONAL DESCRIPTION  
PIN  
IPU(1)  
HPI peripheral bus width select (HPI_WIDTH).  
0
1
HPI operates in HPI16 mode (default).  
HPI bus is 16 bits wide; HD[15:0] pins are used and the remaining HD[31:16]  
pins are reserved pins in the Hi-Z state.  
AEA14  
R25  
IPD  
HPI operates in HPI32 mode.  
HPI bus is 32 bits wide; HD[31:0] pins are used.  
Applies only when HPI function of HPI/PCI multiplexed pins is selected (PCI_EN pin = 0).  
Device Endian mode (LENDIAN).  
AEA13  
R27  
IPU  
0
1
System operates in Big Endian mode.  
System operates in Little Endian mode (default).  
For proper C6454 device operation, this pin must be externally pulled down with a 1-kΩ  
AEA12  
AEA11  
R28  
T25  
IPD  
IPD  
resistor at device reset.  
For proper C6454 device operation, this pin must be externally pulled down with a 1-kΩ  
resistor at device reset.  
EMAC Interface Selects (MACSEL[1:0]).  
These pins select the interface used by the EMAC/MDIO peripheral.  
00  
01  
10  
11  
10/100 EMAC/MDIO with MII Interface [default]  
10/100 EMAC/MDIO with RMII Interface  
[M25,  
M27]  
AEA[10:9]  
IPD  
10/100/1000 EMAC/MDIO with GMII Interface  
10/100/1000 EMAC/MDIO with RGMII Interface  
For more detailed information on the MAC_SEL[1:0] control pin selections, see Table 3-3.  
PCI I2C EEPROM Auto-Initialization (PCI_EEAI).  
PCI auto-initialization via external I2C EEPROM  
0
PCI auto-initialization through external I2C EEPROM is disabled. The PCI  
peripheral uses the specified PCI default values (default).  
AEA8  
P25  
IPD  
1
PCI auto-initialization through external I2C EEPROM is enabled. The PCI  
peripheral is configured through external I2C EEPROM provided the PCI  
peripheral pins are enabled (PCI_EN = 1).  
Note: If the PCI pin function is disabled (PCI_EN pin = 0), this pin must not be pulled up.  
AEA7  
AEA6  
N27  
U27  
IPD  
IPD  
For proper C6454 device operation, do not oppose the IPD on this pin.  
PCI Frequency Selection (PCI66).  
Selects the operating frequency of the PCI (either 33 MHz or 66 MHz).  
0
1
PCI operates at 33 MHz (default)  
PCI operates at 66 MHz  
Note: If the PCI pin function is disabled (PCI_EN pin = 0), this pin must not be pulled up.  
McBSP1 pin function enable bit (MCBSP1_EN).  
Selects which function is enabled on the McBSP1/GPIO multiplexed pins.  
0
GPIO pin function enabled (default).  
This means all multiplexed McBSP1/GPIO pins function as GPIO pins.  
AEA5  
AEA4  
U28  
IPD  
IPD  
1
McBSP1 pin function enabled.  
This means all multiplexed McBSP1/GPIO pins function as McBSP1 pins.  
SYSCLKOUT Enable bit (SYSCLKOUT_EN).  
Selects which function is enabled on the SYSCLK4/GP[1] muxed pin.  
T28  
T27  
0
1
GP[1] pin function is enabled (default)  
SYSCLK4 pin function is enabled  
For proper C6454 device operation, the AEA3 pin must be pulled down to VSS using a 1-kΩ  
resistor.  
AEA3  
IPD  
IPD  
Configuration General-Purpose Inputs (CFGGP[2:0])  
[T26,  
U26,  
U25]  
The value of these pins is latched to the Device Status Register following device reset and is  
used by the on-chip bootloader for some boot modes. For more information on the boot  
modes, see Section 2.4, Boot Sequence.  
AEA[2:0]  
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Table 3-1. C6454 Device Configuration Pins (AEA[19:0], ABA[1:0], and PCI_EN) (continued)  
CONFIGURATION  
IPD/  
NO.  
FUNCTIONAL DESCRIPTION  
PIN  
IPU(1)  
PCI pin function enable bit (PCI_EN).  
Selects which function is enabled on the HPI/PCI multiplexed pins.  
0
HPI pin function enabled (default)  
This means all multiplexed HPI/PCI pins function as HPI pins.  
PCI_EN  
Y29  
IPD  
1
PCI pin function enabled  
This means all multiplexed HPI/PCI pins function as PCI pins.  
DDR2 Memory Controller enable (DDR2_EN).  
ABA0  
ABA1  
V26  
V25  
IPD  
IPD  
0
1
DDR2 Memory Controller peripheral pins are disabled (default)  
DDR2 Memory Controller peripheral pins are enabled  
EMIFA enable (EMIFA_EN).  
0
1
EMIFA peripheral pins are disabled (default)  
EMIFA peripheral pins are enabled  
3.2 Peripheral Configuration at Device Reset  
Some C6454 peripherals share the same pins (internally multiplexed) and are mutually exclusive.  
Therefore, not all peripherals may be used at the same time. The device configuration pins described in  
Section 3.1, Device Configuration at Device Reset, determine which function is enabled for the multiplexed  
pins.  
Note that when the pin function of a peripheral is disabled at device reset, the peripheral is permanently  
disabled and cannot be enabled until its pin function is enabled and another device reset is executed.  
Also, note that enabling the pin function of a peripheral does not enable the corresponding peripheral. All  
peripherals on the C6454 device are disabled by default, except when used for boot, and must be enabled  
through software before being used.  
Other peripheral options like PCI clock speed and EMAC/MDIO interface mode can also be selected at  
device reset through the device configuration pins. The configuration selected is also fixed at device reset  
and cannot be changed until another device reset is executed with a different configuration selected.  
The multiply factor of the PLL1 Controller is not selected through the configuration pins. The PLL1 multiply  
factor is set in software through the PLL1 controller registers after device reset. The PLL2 multiply factor is  
fixed. For more information, see Section 7.7, PLL1 and PLL1 Controller, and Section 7.8,PLL2 and PLL2  
Controller.  
On the C6454 device, the PCI peripheral pins are multiplexed with the HPI pins. The PCI_EN pin selects  
the function for the HPI/PCI multiplexed pins. The PCI66, PCI_EEAI, and HPI_WIDTH control other  
functions of the PCI and HPI peripherals. Table 3-2 describes the effect of the PCI_EN, PCI66, PCI_EEAI,  
and HPI_WIDTH configuration pins.  
Table 3-2. PCI_EN, PCI66, PCI_EEAI, and HPI_WIDTH Peripheral Selection (HPI and PCI)  
CONFIGURATION PIN SETTING(1)  
PERIPHERAL FUNCTION SELECTED  
PCI66  
AEA6 PIN  
[U27]  
PCI_EEAI  
AEA8 PIN  
[P25](1)  
HPI_WIDTH  
AEA14 PIN  
[R25]  
PCI_EN PIN  
[Y29]  
HPI DATA  
LOWER  
HPI DATA  
UPPER  
32-BIT PCI  
(66-/33-MHz)  
PCI  
AUTO-INIT  
0
0
0
0
0
0
0
1
Enabled  
Enabled  
Hi-Z  
Disabled  
Disabled  
N/A  
N/A  
Enabled  
Enabled  
(via External I2C  
EEPROM)  
1
1
1
1
1
0
X
X
Disabled  
Disabled  
Enabled  
(66 MHz)  
Disabled  
(1) PCI_EEAI is latched at reset as a configuration input. If PCI_EEAI is set as one, then default values are loaded from an external I2C  
EEPROM.  
52  
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Table 3-2. PCI_EN, PCI66, PCI_EEAI, and HPI_WIDTH Peripheral Selection (HPI and PCI) (continued)  
CONFIGURATION PIN SETTING(1)  
PERIPHERAL FUNCTION SELECTED  
PCI66  
AEA6 PIN  
[U27]  
PCI_EEAI  
AEA8 PIN  
[P25](1)  
HPI_WIDTH  
AEA14 PIN  
[R25]  
PCI_EN PIN  
[Y29]  
HPI DATA  
LOWER  
HPI DATA  
UPPER  
32-BIT PCI  
(66-/33-MHz)  
PCI  
AUTO-INIT  
Disabled  
(default values)  
1
1
0
0
X
Disabled  
Disabled  
Enabled  
(33 MHz)  
Enabled  
(via External I2C  
EEPROM)  
0
1
X
The MAC_SEL[1:0] configuration pins (AEA[10:9) control which interface is used by the EMAC/MDIO.  
Table 3-3 describes the effect of the MACSEL[1:0] configuration pins.  
Table 3-3. MAC_SEL[1:0] Peripheral Selection (EMAC)  
MAC_SEL[1:0]/  
EMAC/MDIO  
AEA[10:9] PINS [M25, M27]  
PERIPHERAL FUNCTION SELECTED  
CONFIGURATION PIN SETTING  
00b  
01b  
10b  
11b  
10/100 EMAC/MDIO with MII Interface [default]  
10/100 EMAC/MDIO with RMII Interface  
10/100/1000 EMAC/MDIO with GMII Interface  
10/100/1000 EMAC/MDIO with RGMII Interface(1)  
(1) RGMII interface requires a 1.5-/1.8-V I/O supply.  
3.3 Peripheral Selection After Device Reset  
On the C6454 device, peripherals can be in one of several states. These states are listed in Table 3-4.  
Table 3-4. Peripheral States  
PERIPHERALS THAT CAN  
STATE  
DESCRIPTION  
BE IN THIS STATE  
HPI  
PCI  
Peripheral pin function has been completely disabled through the device  
configuration pins. Peripheral is held in reset and clock is turned off.  
McBSP1  
EMAC/MDIO  
EMIFA  
Static powerdown  
DDR2 Memory Controller  
I2C  
Timer 0  
Timer 1  
GPIO  
EMAC/MDIO  
McBSP0  
McBSP1  
HPI  
Peripheral is held in reset and clock is turned off. Default state for all  
peripherals not in static powerdown mode.  
Disabled  
PCI  
I2C  
Timer 0  
Timer 1  
GPIO  
MDIO  
EMAC/MDIO  
McBSP0  
Enabled  
Clock to the peripheral is turned on and the peripheral is taken out of reset.  
McBSP1  
HPI  
PCI  
EMIFA  
DDR2 Memory Controller  
Not a user-programmable state. This is an intermediate state when  
transitioning from an disabled state to an enabled state.  
All peripherals that can be in  
an enabled state.  
Enable in progress  
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Following device reset, all peripherals that are not in the static powerdown state are in the disabled state  
by default. Peripherals used for boot such as HPI and PCI are enabled automatically following a device  
reset.  
Peripherals are only allowed certain transitions between states (see Figure 3-1).  
Static  
Powerdown  
Reset  
Enable In  
Progress  
Disabled  
Enabled  
Figure 3-1. Peripheral Transitions Between States  
Figure 3-2 shows the flow needed to change the state of a given peripheral on the C6454 device.  
Unlock the PERCFG0 register by  
using the PERLOCK register.  
Write to the PERCFG0 register  
within 16 SYSCLK3 clock cycles  
to change the state of the  
peripherals.  
Poll the PERSTAT registers to  
verify state change.  
Figure 3-2. Peripheral State Change Flow  
A 32-bit key (value = 0x0F0A 0B00) must be written to the Peripheral Lock register (PERLOCK) in order to  
allow access to the PERCFG0 register. Writes to the PERCFG1 register can be done directly without  
going through the PERLOCK register.  
NOTE  
The instructions that write to the PERLOCK and PERCFG0 registers must be in the same  
fetch packet if code is being executed from external memory. If the instructions are in  
different fetch packets, fetching the second instruction from external memory may stall the  
instruction long enough such that PERCFG0 register will be locked before the instruction  
is executed.  
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3.4 Device State Control Registers  
The C6454 device has a set of registers that are used to control the status of its peripherals. These  
registers are shown in Table 3-5 and described in the next sections.  
NOTE  
The device state control registers can only be accessed using the CPU or the emulator.  
Table 3-5. Device State Control Registers  
HEX ADDRESS RANGE  
02AC 0000  
ACRONYM  
REGISTER NAME  
-
Reserved  
02AC 0004  
PERLOCK  
Peripheral Lock Register  
Peripheral Configuration Register 0  
Reserved  
02AC 0008  
PERCFG0  
02AC 000C  
-
02AC 0010  
-
Reserved  
02AC 0014  
PERSTAT0  
Peripheral Status Register 0  
Peripheral Status Register 1  
Reserved  
02AC 0018  
PERSTAT1  
02AC 001C - 02AC 001F  
02AC 0020  
-
EMACCFG  
EMAC Configuration Register  
Reserved  
02AC 0024 - 02AC 002B  
02AC 002C  
-
PERCFG1  
Peripheral Configuration Register 1  
Reserved  
02AC 0030 - 02AC 0053  
02AC 0054  
-
EMUBUFPD  
-
Emulator Buffer Powerdown Register  
Reserved  
02AC 0058  
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3.4.1 Peripheral Lock Register Description  
When written with correct 32-bit key (0x0F0A0B00), the Peripheral Lock Register (PERLOCK) allows one  
write to the PERCFG0 register within 16 SYSCLK3 cycles.  
NOTE  
The instructions that write to the PERLOCK and PERCFG0 registers must be in the same  
fetch packet if code is being executed from external memory. If the instructions are in  
different fetch packets, fetching the second instruction from external memory may stall the  
instruction long enough such that PERCFG0 register will be locked before the instruction  
is executed.  
31  
0
LOCKVAL  
R/W-F0F0 F0F0  
LEGEND: R/W = Read/Write; -n = value after reset  
Figure 3-3. Peripheral Lock Register (PERLOCK) - 0x02AC 0004  
Table 3-6. Peripheral Lock Register (PERLOCK) Field Descriptions  
Bit  
Field  
Value Description  
31:0  
LOCKVAL  
When programmed with 0x0F0A 0B00 allows one write to the PERCFG0 register within 16  
SYSCLK3 clock cycles.  
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3.4.2 Peripheral Configuration Register 0 Description  
The Peripheral Configuration Register (PERCFG0) is used to change the state of the peripherals. One  
write is allowed to this register within 16 SYSCLK3 cycles after the correct key is written to the PERLOCK  
register.  
NOTE  
The instructions that write to the PERLOCK and PERCFG0 registers must be in the same  
fetch packet if code is being executed from external memory. If the instructions are in  
different fetch packets, fetching the second instruction from external memory may stall the  
instruction long enough such that PERCFG0 register will be locked before the instruction  
is executed.  
31  
24  
Reserved  
R/W-0  
23  
21  
20  
19  
18  
17  
16  
Reserved  
R/W-0  
PCICTL  
Reserved  
HPICTL  
Reserved  
McBSP1CTL  
R/W-0  
R/W-0  
R/W-0  
R/W-0  
R/W-0  
15  
14  
13  
12  
11  
10  
9
8
Reserved  
McBSP0CTL  
Reserved  
I2CCTL  
Reserved  
GPIOCTL  
Reserved  
TIMER0CTL  
R/W-0  
R/W-0  
R/W-0  
R/W-0  
R/W-0  
3
R/W-0  
R/W-0  
R/W-0  
0
7
6
5
4
Reserved  
TIMER1CTL  
Reserved  
EMACCTL  
Reserved  
R/W-0  
R/W-0  
R/W-0  
R/W-0  
R/W-0  
LEGEND: R/W = Read/Write; -n = value after reset  
Figure 3-4. Peripheral Configuration Register 0 (PERCFG0) - 0x02AC 0008  
Table 3-7. Peripheral Configuration Register 0 (PERCFG0) Field Descriptions  
Bit  
Field  
Value Description  
31:21 Reserved  
Reserved.  
20  
PCICTL  
Mode control for PCI. This bit defaults to 1 when Host boot is used (BOOTMODE[3:0] = 0111b).  
0
1
Set PCI to disabled mode  
Set PCI to enabled mode  
19  
18  
Reserved  
HPICTL  
Reserved.  
Mode control for HPI. This bit defaults to 1 when Host boot is used (BOOTMODE[3:0] = 0001b).  
0
1
1
Set HPI to disabled mode  
Set HPI to enabled mode  
Reserved.  
17  
16  
Reserved  
McBSP1CTL  
Mode control for McBSP1  
Set McBSP1 to disabled mode  
Set McBSP1 to enabled mode  
Reserved.  
0
1
15  
14  
Reserved  
McBSP0CTL  
Mode control for McBSP0  
Set McBSP0 to disabled mode  
Set McBSP0 to enabled mode  
Reserved.  
0
1
13  
Reserved  
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Table 3-7. Peripheral Configuration Register 0 (PERCFG0) Field Descriptions (continued)  
Bit  
Field  
Value Description  
Mode control for I2C  
12  
I2CCTL  
0
1
Set I2C to disabled mode  
Set I2C to enabled mode  
Reserved.  
11  
10  
Reserved  
GPIOCTL  
Mode control for GPIO  
Set GPIO to disabled mode  
Set GPIO to enabled mode  
Reserved.  
0
1
9
8
Reserved  
TIMER0CTL  
Mode control for Timer 0  
Set Timer 0 to disabled mode  
Set Timer 0 to enabled mode  
Reserved.  
0
1
7
6
Reserved  
TIMER1CTL  
Mode control for Timer 1  
Set Timer 1 to disabled mode  
Set Timer 1 to enabled mode  
Reserved.  
0
1
5
4
Reserved  
EMACCTL  
Mode control for EMAC/MDIO  
Set EMAC/MDIO to disabled mode  
Set EMAC/MDIO to enabled mode  
Reserved.  
0
1
3:0  
Reserved  
58  
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3.4.3 Peripheral Configuration Register 1 Description  
The Peripheral Configuration Register (PERCFG1) is used to enable the EMIFA and DDR2 Memory  
Controller. EMIFA and the DDR2 Memory Controller do not have corresponding status bits in the  
Peripheral Status Registers. The EMIFA and DDR2 Memory Controller peripherals can be used within 16  
SYSCLK3 cycles after EMIFACTL and DDR2CTL are set to 1. Once EMIFACTL and DDR2CTL are set to  
1, they cannot be set to 0. Note that if the DDR2 Memory Controller and EMIFA are disabled at reset  
through the device configuration pins (DDR2.EN[ABA0] and EMIFA[ABA1]), they cannot be enabled  
through the PERCFG1 register.  
31  
8
Reserved  
R-0x00  
7
2
1
0
Reserved  
R-0x00  
DDR2CTL  
EMIFACTL  
R/W-0  
R/W-0  
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset  
Figure 3-5. Peripheral Configuration Register 1 (PERCFG1) - 0x02AC 002C  
Table 3-8. Peripheral Configuration Register 1 (PERCFG1) Field Descriptions  
Bit  
31:2  
1
Field  
Value Description  
Reserved  
DDR2CTL  
Reserved.  
Mode Control for DDR2 Memory Controller. Once this bit is set to 1, it cannot be changed to 0.  
0
1
Set DDR2 to disabled  
Set DDR2 to enabled  
0
EMIFACTL  
Mode control for EMIFA. Once this bit is set to 1, it cannot be changed to 0. This bit defaults to 1 if  
EMIFA 8-bit ROM boot is used (BOOTMODE[3:0] = 0100b).  
0
1
Set EMIFA to disabled  
Set EMIFA to enabled  
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3.4.4 Peripheral Status Registers Description  
The Peripheral Status Registers (PERSTAT0 and PERSTAT1) show the status of the C6454 peripherals.  
31  
30  
29  
27  
26  
24  
Reserved  
R-0  
HPISTAT  
R-0  
McBSP1STAT  
R-0  
17  
23  
21  
20  
18  
16  
McBSP0STAT  
I2CSTAT  
R-0  
GPIOSTAT  
R-0  
R-0  
14  
15  
12  
11  
9
8
GPIOSTAT  
TIMER1STAT  
TIMER0STAT  
R-0  
EMACSTAT  
R-0  
7
R-0  
5
R-0  
0
6
EMACSTAT  
R-0  
LEGEND: R = Read only; -n = value after reset  
Reserved  
R-0  
Figure 3-6. Peripheral Status Register 0 (PERSTAT0) - 0x02AC 0014  
Table 3-9. Peripheral Status Register 0 (PERSTAT0) Field Descriptions  
Bit  
Field  
Value Description  
Reserved.  
31:30 Reserved  
29:27 HPISTAT  
HPI status  
000  
001  
011  
101  
HPI is in the disabled state  
HPI is in the enabled state  
HPI is in the static powerdown state  
HPI is in the enable in progress state  
Others Reserved  
McBSP1 status  
26:24 McBSP1STAT  
23:21 McBSP0STAT  
20:18 I2CSTAT  
000  
001  
011  
101  
McBSP1 is in the disabled state  
McBSP1 is in the enabled state  
McBSP1 is in the static powerdown state  
McBSP1 is in the enable in progress state  
Others Reserved  
McBSP0 status  
000  
001  
011  
101  
McBSP0 is in the disabled state  
McBSP0 is in the enabled state  
McBSP0 is in the static powerdown state  
McBSP0 is in the enable in progress state  
Others Reserved  
I2C status  
000  
001  
011  
101  
I2C is in the disabled state  
I2C is in the enabled state  
I2C is in the static powerdown state  
I2C is in the enable in progress state  
Others Reserved  
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Table 3-9. Peripheral Status Register 0 (PERSTAT0) Field Descriptions (continued)  
Bit  
Field  
Value Description  
17:15 GPIOSTAT  
GPIO status  
000  
001  
011  
101  
GPIO is in the disabled state  
GPIO is in the enabled state  
GPIO is in the static powerdown state  
GPIO is in the enable in progress state  
Others Reserved  
Timer1 status  
14:12 TIMER1STAT  
000  
001  
011  
101  
Timer1 is in the disabled state  
Timer1 is in the enabled state  
Timer1 is in the static powerdown state  
Timer1 is in the enable in progress state  
Others Reserved  
Timer0 status  
11:9  
TIMER0STAT  
EMACSTAT  
Reserved  
000  
001  
011  
101  
Timer0 is in the disabled state  
Timer0 is in the enabled state  
Timer0 is in the static powerdown state  
Timer0 is in the enable in progress state  
Others Reserved  
EMAC/MDIO status  
8:6  
000  
001  
011  
101  
EMAC/MDIO is in the disabled state  
EMAC/MDIO is in the enabled state  
EMAC/MDIO is in the static powerdown state  
EMAC/MDIO is in the enable in progress state  
Others Reserved  
Reserved  
5:0  
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31  
16  
Reserved  
R-0  
15  
3
2
0
Reserved  
R-0  
PCISTAT  
R-0  
LEGEND: R = Read only; -n = value after reset  
Figure 3-7. Peripheral Status Register 1 (PERSTAT1) - 0x02AC 0018  
Table 3-10. Peripheral Status Register 1 (PERSTAT1) Field Descriptions  
Bit  
31:3  
2:0  
Field  
Value Description  
Reserved  
Reserved  
PCISTAT  
PCI status  
000  
001  
011  
101  
PCI is in the disabled state  
PCI is in the enabled state  
PCI is in the static powerdown state  
PCI is in the enable in progress state  
Others Reserved  
62  
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3.4.5 EMAC Configuration Register (EMACCFG) Description  
The EMAC Configuration Register (EMACCFG) is used to assert and deassert the reset of the Reduced  
Media Independent Interface (RMII) logic of the EMAC. For more details on how to use this register, see  
Section 7.14, Ethernet MAC (EMAC).  
31  
24  
Reserved  
R/W-0  
23  
19  
18  
17  
16  
Reserved  
RMII_RST  
Reserved  
R/W-0  
R/W-0001b  
R/W-1  
15  
0
Reserved  
R/W-0  
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset  
Figure 3-8. EMAC Configuration Register (EMACCFG) - 0x02AC 0020  
Table 3-11. EMAC Configuration Register (EMACCFG) Field Descriptions  
Bit  
Field  
Value Description  
31:19 Reserved  
Reserved. Writes to this register must keep the default values of these bits.  
RMII reset bit. This bit is used to reset the RMII logic of the EMAC.  
18  
RMII_RST  
Reserved  
0
1
RMII logic reset is released.  
RMII logic reset is asserted.  
17:0  
Reserved. Writes to this register must keep this bit as 0.  
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3.4.6 Emulator Buffer Powerdown Register (EMUBUFPD) Description  
The Emulator Buffer Powerdown Register (EMUBUFPD) is used to control the state of the pin buffers of  
emulator pins EMU[18:2]. These buffers can be powered down if the device trace feature is not needed.  
31  
8
Reserved  
R-0  
7
1
0
Reserved  
R-0  
EMUCTL  
R/W-0  
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset  
Figure 3-9. Emulator Buffer Powerdown Register (EMUBUFPD) - 0x02AC 0054  
Table 3-12. Emulator Buffer Powerdown Register (EMUBUFPD) Field Descriptions  
Bit  
31:1  
0
Field  
Value Description  
Reserved  
EMUCTL  
Reserved  
Buffer powerdown for EMU[18:2] pins  
Power-up buffers  
0
1
Power-down buffers  
64  
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3.5 Device Status Register Description  
The device status register depicts the device configuration selected upon device reset. Once set, these  
bits will remain set until a device reset. For the actual register bit names and their associated bit field  
descriptions, see Figure 3-10 and Table 3-13.  
Note that enabling or disabling peripherals through the Peripheral Configuration Registers (PERCFG0 and  
PERCFG1) does not affect the DEVSTAT register. To determine the status of peripherals following writes  
to the PERCFG0 and PERCFG1 registers, read the Peripherals Status Registers (PERSTAT0 and  
PERSTAT1).  
31  
24  
Reserved  
R-0000 0000  
23  
22  
21  
20  
19  
18  
17  
16  
Reserved  
EMIFA_EN  
DDR2_EN  
PCI_EN  
CFGGP2  
CFGGP1  
CFGGP0  
Reserved  
R-0  
15  
R-x  
14  
R-x  
13  
R-x  
R-x  
11  
R-x  
10  
R-x  
9
R-1  
8
12  
SYSCLKOUT_  
EN  
MCBSP1_EN  
PCI66  
Reserved  
PCI_EEAI  
MAC_SEL1  
MAC_SEL0  
Reserved  
R-x  
R-x  
R-x  
R-0  
R-x  
3
R-x  
2
R-x  
1
R-1  
0
7
6
5
4
Reserved  
LENDIAN  
HPI_WIDTH  
AECLKINSEL  
BOOTMODE3 BOOTMODE2 BOOTMODE1 BOOTMODE0  
R-0  
R-x  
R-x  
R-x  
R-x R-x R-x R-x  
LEGEND: R/W = Read/Write; R = Read only; -x = value after reset  
Figure 3-10. Device Status Register (DEVSTAT) - 0x02A8 0000  
Table 3-13. Device Status Register (DEVSTAT) Field Descriptions  
Bit  
Field  
Value Description  
31:23 Reserved  
Reserved. Read-only, writes have no effect.  
22  
21  
20  
EMIFA_EN  
DDR2_EN  
PCI_EN  
EMIFA Enable (EMIFA_EN) status bit  
Shows the status of whether the EMIFA peripheral pins are enabled/disabled.  
0
1
EMIFA peripheral pins are disabled (default)  
EMIFA peripheral pins are enabled  
DDR2 Memory Controller Enable (DDR2_EN) status bit  
Shows the status of whether the DDR2 Memory Controller peripheral pins are enabled/disabled.  
0
1
DDR2 Memory Controller peripheral pins are disabled (default)  
DDR2 Memory Controller peripheral pins are enabled  
PCI Enable (PCI_EN) status bit  
Shows the status of which function is enabled on the HPI/PCI multiplexed pins.  
0
1
HPI pin functions are enabled (default)  
PCI pin functions are enabled  
19:17 CFGGP[2:0]  
Used as General-Purpose inputs for configuration purposes.  
These pins are latched at reset. These values can be used by S/W routines for boot operations.  
16  
15  
Reserved  
Reserved. Read-only, writes have no effect.  
SYSCLKOUT_EN  
SYSCLKOUT Enable (SYSCLKOUT_EN) status bit  
Shows the status of which function is enabled on the SYSCLK4/GP[1] muxed pin.  
0
1
GP[1] pin function of the SYSCLK4/GP[1] pin enabled (default)  
SYSCLK4 pin function of the SYSCLK4/GP[1] pin enabled  
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Table 3-13. Device Status Register (DEVSTAT) Field Descriptions (continued)  
Bit  
Field  
Value Description  
14  
MCBSP1_EN  
McBSP1 Enable (MCBSP1_EN) status bit  
Shows the status of which function is enabled on the McBSP1/GPIO muxed pins.  
0
1
GPIO pin functions enabled (default)  
McBSP1 pin functions enabled  
13  
PCI66  
PCI Frequency Selection (PCI66) status bit  
Shows the PCI operating frequency selected at reset.  
0
1
PCI operates at 33 MHz (default)  
PCI operates at 66 MHz  
12  
11  
Reserved  
PCI_EEAI  
Reserved. Read-only, writes have no effect.  
PCI I2C EEPROM Auto-Initialization (PCI_EEAI) status bit  
Shows whether the PCI auto-initialization via external I2C EEPROM is enabled/disabled.  
0
1
PCI auto-initialization through external I2C EEPROM is disabled; the PCI peripheral uses the  
specified PCI default values (default).  
PCI auto-initialization through external I2C EEPROM is enabled; the PCI peripheral is configured  
through external I2C EEPROM provided the PCI peripheral pin is enabled (PCI_EN = 1).  
10:9  
MACSEL[1:0]  
EMAC Interface Select (MACSEL[1:0]) status bits  
Shows which EMAC interface mode has been selected.  
00  
01  
10  
11  
10/100 EMAC/MDIO with MII Interface (default)  
10/100 EMAC/MDIO with RMII Interface  
10/100/1000 EMAC/MDIO with GMII Interface  
10/100/1000 EMAC/MDIO with RGMII Mode Interface  
[RGMII interface requires a 1.8 V or 1.5 V I/O supply]  
8:7  
6
Reserved  
LENDIAN  
Reserved. Read-only, writes have no effect.  
Device Endian mode (LENDIAN)  
Shows the status of whether the system is operating in Big Endian mode or Little Endian mode  
(default).  
0
1
System is operating in Big Endian mode  
System is operating in Little Endian mode (default)  
5
4
HPI_WIDTH  
HPI bus width control bit.  
Shows the status of whether the HPI bus operates in 32-bit mode or in 16-bit mode (default).  
0
1
HPI operates in 16-bit mode. (default)  
HPI operates in 32-bit mode  
AECLKINSEL  
EMIFA input clock select  
Shows the status of what clock mode is enabled or disabled for EMIFA.  
0
1
AECLKIN (default mode)  
SYSCLK4 (CPU/x) Clock Rate. The SYSCLK4 clock rate is software selectable via the PLL1  
Controller. By default, SYSCLK4 is selected as CPU/8 clock rate.  
66  
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Table 3-13. Device Status Register (DEVSTAT) Field Descriptions (continued)  
Bit  
3:0  
Field  
Value Description  
BOOTMODE[3:0]  
Boot mode configuration bits  
Shows the status of what device boot mode configuration is operational.  
BOOTMODE[3:0]  
[Note: if selected for boot, the corresponding peripheral is automatically enabled after device reset.]  
0000 No boot (default mode)  
0001 Host boot (HPI)  
0010 Reserved  
0011 Reserved  
0100 EMIFA 8-bit ROM boot  
0101 Master I2C boot  
0110 Slave I2C boot  
0111 Host boot (PCI)  
1000 Reserved  
thru  
1111  
For more detailed information on the boot modes, see Section 2.4, Boot Sequence.  
3.6 JTAG ID (JTAGID) Register Description  
The JTAG ID register is a read-only register that identifies to the customer the JTAG/Device ID. For the  
C6454 device, the JTAG ID register resides at address location 0x02A8 0008. For the actual register bit  
names and their associated bit field descriptions, see Figure 3-11 and Table 3-14.  
31  
28 27  
12 11  
1
0
VARIANT  
(4-bit)  
PART NUMBER  
(16-bit)  
MANUFACTURER  
(11-bit)  
LSB  
R-n  
R-0000 0000 1000 1010b  
0000 0010 111b  
R-1  
LEGEND: R = Read only; -n = value after reset  
Figure 3-11. JTAG ID (JTAGID) Register - 0x02A8 0008  
Table 3-14. JTAG ID (JTAGID) Register Field Descriptions  
Bit  
Field  
Value  
Description  
31:28 VARIANT  
Variant (4-Bit) value. The value of this field depends on the silicon revision being  
used. For more information, see the TMS320C6455/54 Digital Signal Processor  
Silicon Errata (literature number SPRZ234).  
Note: the VARIANT field may be invalid if no CLKIN1 signal is applied.  
Part Number (16-Bit) value. C6454 value: 0000 0000 1000 1010b.  
Manufacturer (11-Bit) value. C6454 value: 0000 0010 111b.  
LSB. This bit is read as a "1" for C6454.  
27:12 PART NUMBER  
11:1 MANUFACTURER  
0
LSB  
3.7 Pullup/Pulldown Resistors  
Proper board design should ensure that input pins to the C6454 device always be at a valid logic level and  
not floating. This may be achieved via pullup/pulldown resistors. The C6454 device features internal pullup  
(IPU) and internal pulldown (IPD) resistors on most pins to eliminate the need, unless otherwise noted, for  
external pullup/pulldown resistors.  
An external pullup/pulldown resistor needs to be used in the following situations:  
•
Device Configuration Pins: If the pin is both routed out and 3-stated (not driven), an external  
pullup/pulldown resistor must be used, even if the IPU/IPD matches the desired value/state.  
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•
Other Input Pins: If the IPU/IPD does not match the desired value/state, use an external  
pullup/pulldown resistor to pull the signal to the opposite rail.  
For the device configuration pins (listed in Table 3-1), if they are both routed out and 3-stated (not driven),  
it is strongly recommended that an external pullup/pulldown resistor be implemented. Although, internal  
pullup/pulldown resistors exist on these pins and they may match the desired configuration value,  
providing external connectivity can help ensure that valid logic levels are latched on these device  
configuration pins. In addition, applying external pullup/pulldown resistors on the device configuration pins  
adds convenience to the user in debugging and flexibility in switching operating modes.  
Tips for choosing an external pullup/pulldown resistor:  
•
Consider the total amount of current that may pass through the pullup or pulldown resistor. Make sure  
to include the leakage currents of all the devices connected to the net, as well as any internal pullup or  
pulldown resistors.  
•
Decide a target value for the net. For a pulldown resistor, this should be below the lowest VIL level of  
all inputs connected to the net. For a pullup resistor, this should be above the highest VIH level of all  
inputs on the net. A reasonable choice would be to target the VOL or VOH levels for the logic family of  
the limiting device; which, by definition, have margin to the VIL and VIH levels.  
•
•
Select a pullup/pulldown resistor with the largest possible value; but, which can still ensure that the net  
will reach the target pulled value when maximum current from all devices on the net is flowing through  
the resistor. The current to be considered includes leakage current plus, any other internal and  
external pullup/pulldown resistors on the net.  
For bidirectional nets, there is an additional consideration which sets a lower limit on the resistance  
value of the external resistor. Verify that the resistance is small enough that the weakest output buffer  
can drive the net to the opposite logic level (including margin).  
•
•
Remember to include tolerances when selecting the resistor value.  
For pullup resistors, also remember to include tolerances on the DVDD rail.  
For most systems, a 1-kΩ resistor can be used to oppose the IPU/IPD while meeting the above criteria.  
Users should confirm this resistor value is correct for their specific application.  
For most systems, a 20-kΩ resistor can be used to compliment the IPU/IPD on the device configuration  
pins while meeting the above criteria. Users should confirm this resistor value is correct for their specific  
application.  
For more detailed information on input current (II), and the low-/high-level input voltages (VIL and VIH) for  
the C6454 device, see Section 6.3, Electrical Characteristics Over Recommended Ranges of Supply  
Voltage and Operating Case Temperature.  
To determine which pins on the C6454 device include internal pullup/pulldown resistors, see Table 2-3,  
Terminal Functions.  
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3.8 Configuration Examples  
Figure 3-12 and Figure 3-13 illustrate examples of peripheral selections/options that are configurable on  
the C6454 device.  
32  
HD[31:0]  
HPI  
HRDY, HINT  
(32-Bit)  
HCNTL0, HCNTL1, HHWIL,  
HAS, HR/W, HCS, HDS1, HDS2  
64  
AED[63:0]  
PCI  
EMIFA  
AECLKIN, AARDY, AHOLD  
AEA[22:3], ACE[3:0], ABE[7:0],  
AECLKOUT, ASDCKE, AHOLDA,  
ABUSREQ, ASADS/ASRE,  
AAOE/ASOE, AAWE/ASWE  
GP[15:12,2,1]  
GPIO  
32  
PLL1  
and PLL1  
Controller  
CLKIN1, PLLV1  
SYSCLK4  
ED[31:0]  
DDR2  
EMIF  
DEA[21:2], DCE[1:0], DBE[3:0], DDRCLK, DDRCLK,  
DSDCKE, DDQS, DDQS, DSDCAS, DSDRAS,  
DSDWE  
PLL2  
CLKIN2, PLLV2  
McBSP1  
McBSP0  
EMAC  
and PLL2  
Controller  
CLKR0, FSR0, DR0, CLKS0,  
DX0, FSX0, CLKX0  
TINP1L  
TIMER1  
TOUT1L  
TINP0  
MRXD[7:0], MRXER, MRXDV, MCOL,  
MCRS, MTCLK, MRCLK  
TIMER0  
I2C  
TOUT0  
SCL  
SDA  
MTXD[7:0], MTXEN,  
MDIO, MDCLK  
MDIO  
Shading denotes a peripheral module not available for this configuration.  
DEVSTAT Register: 0x0061 8161  
PCI_EN = 0 (PCI disabled, default)  
ABA1 (EMIFA_EN) = 1(EMIFA enabled)  
ABA0 (DDR2_EN) = 1 (DDR2 Memory Controller enabled)  
AEA[19:16] (BOOTMODE[3:0]) = 0001, (HPI Boot)  
AEA[15] (AECLKIN_SEL) = 0, (AECLKIN, default)  
AEA[14] (HPI_WIDTH) = 1, (HPI, 32-bit Operation)  
AEA[13] (LENDIAN) = IPU, (Little Endian Mode, default)  
AEA[12] = 0, (do not oppose IPD)  
AEA[8] (PCI_EEAI) = 0, (PCI I2C EEPROM Auto-Init disabled, default)  
AEA[7] = 0, (do not oppose IPD)  
AEA[6] (PCI66) = 0, (PCI 33 MHz [default, don’t care])  
AEA[5] (MCBSP1_EN) = 0, (McBSP1 disabled, default)  
AEA[4] (SYSCLKOUT_EN) = 1, (SYSCLK4 pin function)  
AEA[3] = 0, (do not oppose IPD)  
AEA[11] = 0, (do not oppose IPD)  
AEA[10:9] (MACSEL[1:0]) = 00, (10/100 MII Mode)  
AEA[2:0] (CFGGP[2:0]) = 000, (default)  
Figure 3-12. Configuration Example A (McBSP + HPI32 + I2C + EMIFA + DDR2 Memory Controller +  
TIMERS + EMAC (MII) + MDIO)  
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32  
HD[31:0]  
HPI  
(32-Bit)  
HRDY, HINT  
HCNTL0, HCNTL1, HHWIL,  
HAS, HR/W, HCS, HDS1, HDS2  
64  
AED[63:0]  
PCI  
EMIFA  
AECLKIN, AARDY, AHOLD  
AEA[22:3], ACE[3:0], ABE[7:0],  
AECLKOUT, ASDCKE,  
AHOLDA, ABUSREQ,  
ASADS/ASRE, AAOE/ASOE,  
AAWE/ASWE  
GP[15:12,2,1]  
GPIO  
32  
PLL1  
and PLL1  
Controller  
CLKIN1, PLLV1  
SYSCLK4  
ED[31:0]  
DDR2  
EMIF  
DEA[21:2], DCE[1:0], DBE[3:0], DDRCLK, DDRCLK,  
DSDCKE, DDQS, DDQS, DSDCAS, DSDRAS,  
DSDWE  
PLL2  
and PLL2  
Controller  
CLKR1, FSR1, DR1, CLKS1,  
DX1, FSX1, CLKX1  
CLKIN2, PLLV2  
McBSP1  
McBSP0  
EMAC  
CLKR0, FSR0, DR0, CLKS0,  
DX0, FSX0, CLKX0  
TINP1L  
TIMER1  
TOUT1L  
TINP0  
MRXD[7:0], MRXER, MRXDV, MCOL,  
MCRS, MTCLK, MRCLK  
TIMER0  
I2C  
TOUT0  
SCL  
SDA  
MTXD[7:0], MTXEN,  
MDIO, MDCLK  
MDIO  
Shading denotes a peripheral module not available for this configuration.  
DEVSTAT Register: 0x0061 C161  
PCI_EN = 0 (PCI disabled, default)  
ABA1 (EMIFA_EN) = 1(EMIFA enabled)  
ABA0 (DDR2_EN) = 1 (DDR2 Memory Controller enabled)  
AEA[19:16] (BOOTMODE[3:0]) = 0001, (HPI Boot)  
AEA[15] (AECLKIN_SEL) = 0, (AECLKIN, default)  
AEA[14] (HPI_WIDTH) = 1, (HPI, 32-bit Operation)  
AEA[13] (LENDIAN) = IPU, (Little Endian Mode, default)  
AEA[12] = 0, (do not oppose IPD)  
AEA[8] (PCI_EEAI) = 0, (PCI I2C EEPROM Auto-Init disabled, default)  
AEA[7] = 0, (do not oppose IPD)  
AEA[6] (PCI66) = 0, (PCI 33 MHz [default, don’t care])  
AEA[5] (MCBSP1_EN) = 1, (McBSP1 enabled)  
AEA[4] (SYSCLKOUT_EN) = 1, (SYSCLK4 pin function)  
AEA[3] = 0, (do not oppose IPD)  
AEA[11] = 0, (do not oppose IPD)  
AEA[10:9] (MACSEL[1:0]) = 00, (10/100 MII Mode)  
AEA[2:0] (CFGGP[2:0]) = 000, (default)  
Figure 3-13. Configuration Example B (2 McBSPs + HPI32 + I2C + EMIFA + DDR2 Memory Controller +  
TIMERS + EMAC (GMII) + MDIO  
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4 System Interconnect  
On the C6454 device, the C64x+ Megamodule, the EDMA3 transfer controllers, and the system  
peripherals are interconnected through two switch fabrics. The switch fabrics allow for low-latency,  
concurrent data transfers between master peripherals and slave peripherals. Through a switch fabric the  
CPU can send data to the EMIFA without affecting a data transfer between the PCI and the DDR2  
memory controller. The switch fabrics also allow for seamless arbitration between the system masters  
when accessing system slaves.  
4.1 Internal Buses, Bridges, and Switch Fabrics  
Two types of buses exist in the C6454 device: data buses and configuration buses. Some C6454  
peripherals have both a data bus and a configuration bus interface, while others only have one type of  
interface. Furthermore, the bus interface width and speed varies from peripheral to peripheral.  
Configuration buses are mainly used to access the register space of a peripheral and the data buses are  
used mainly for data transfers. However, in some cases, the configuration bus is also used to transfer  
data. For example, data is transferred to the McBSP via its configuration bus. Similarly, the data bus can  
also be used to access the register space of a peripheral. For example, the EMIFA and DDR2 memory  
controller registers are accessed through their data bus interface.  
The C64x+ Megamodule, the EDMA3 traffic controllers, and the various system peripherals can be  
classified into two categories: masters and slaves. Masters are capable of initiating read and write  
transfers in the system and do not rely on the EDMA3 for their data transfers. Slaves on the other hand  
rely on the EDMA3 to perform transfers to and from them. Masters include the EDMA3 traffic controllers  
and PCI. Slaves include the McBSP and I2C.  
The C6454 device contains two switch fabrics through which masters and slaves communicate. The data  
switch fabric, known as the data switched central resource (SCR), is a high-throughput interconnect  
mainly used to move data across the system (for more information, see Section 4.2). The data SCR  
connects masters to slaves via 128-bit data buses running at a SYSCLK2 frequency (SYSCLK2 is  
generated from PLL1 controller). Peripherals that have a 128-bit data bus interface running at this speed  
can connect directly to the data SCR; other peripherals require a bridge.  
The configuration switch fabric, also known as the configuration switch central resource (SCR) is mainly  
used by the C64x+ Megamodule to access peripheral registers (for more information, see Section 4.3).  
The configuration SCR connects C64x+ Megamodule to slaves via 32-bit configuration buses running at a  
SYSCLK2 frequency (SYSCLK2 is generated from PLL1 controller). As with the data SCR, some  
peripherals require the use of a bridge to interface to the configuration SCR. Note that the data SCR also  
connects to the configuration SCR.  
Bridges perform a variety of functions:  
•
•
•
Conversion between configuration bus and data bus.  
Width conversion between peripheral bus width and SCR bus width.  
Frequency conversion between peripheral bus frequency and SCR bus frequency.  
For example, the EMIFA and DDR2 memory controller require a bridge to convert their 64-bit data bus  
interface into a 128-bit interface so that they can connect to the data SCR.  
Note that some peripherals can be accessed through the data SCR and also through the configuration  
SCR.  
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4.2 Data Switch Fabric Connections  
Figure 4-1 shows the connection between slaves and masters through the data switched central resource  
(SCR). Masters are shown on the right and slaves on the left. The data SCR connects masters to slaves  
via 128-bit data buses running at a SYSCLK2 frequency. SYSCLK2 is supplied by the PLL1 controller and  
is fixed at a frequency equal to the CPU frequency divided by 3.  
Some peripherals, like PCI and the C64x+ Megamodule, have both slave and master ports. Note that  
each EDMA3 transfer controller has an independent connection to the data SCR.  
Note that masters can access the configuration SCR through the data SCR. The configuration SCR is  
described in Section 4.3.  
Not all masters on the C6454 DSP may connect to all slaves. Allowed connections are summarized in  
Table 4-1.  
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EDMA3 Channel  
Controller  
Events  
MASTER  
Data SCR  
128 (SYSCLK2)  
128 (SYSCLK2)  
M0  
M1  
M2  
M3  
S0  
128  
(SYSCLK2)  
S1  
S2  
S3  
EDMA3  
Transfer  
Controllers  
32 (SYSCLK2)  
CFG  
SCR  
M
Bridge  
S
128 (SYSCLK2)  
128 (SYSCLK2)  
128-bit  
(SYSCLK2)  
32  
32 (SYSCLK3)  
128  
EMAC  
M
(SYSCLK3)  
(SYSCLK3)  
32 (SYSCLK3)  
32 (SYSCLK3)  
32  
S
S
McBSPs  
PCI  
(SYSCLK3)  
32  
M
Bridge  
(SYSCLK3)  
HPI  
PCI  
M
M
Bridge  
S
128 (SYSCLK2)  
32 (SYSCLK3)  
128  
(SYSCLK2)  
64  
128 (SYSCLK2)  
DDR2  
Memory  
Controller  
(SYSCLK2)  
Megamodule  
M
S
M
M
M
Bridge  
Bridge  
S
S
S
128  
(SYSCLK2)  
64  
(SYSCLK2)  
EMIFA  
128 (SYSCLK2)  
Megamodule  
Configuration Bus  
Data Bus  
Figure 4-1. Switched Central Resource Block Diagram  
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Table 4-1. SCR Connection Matrix  
DDR2 MEMORY  
CONTROLLER  
McBSPs  
CONFIGURATION SCR  
PCI  
EMIFA  
MEGAMODULE  
TC0  
TC1  
TC2  
TC3  
EMAC  
HPI  
N
Y
N
N
N
N
N
N
Y
N
N
N
Y
Y
N
Y
Y
Y
N
N
N
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
PCI  
4.3 Configuration Switch Fabric  
Figure 4-2 shows the connection between the C64x+ Megamodule and the configuration switched central  
resource (SCR). The configuration SCR is mainly used by the C64x+ Megamodule to access peripheral  
registers. The data SCR also has a connection to the configuration SCR which allows masters to access  
most peripheral registers. The only registers not accessible by the data SCR through the configuration  
SCR are the device configuration registers and the PLL1 and PLL2 controller registers; these can only be  
accessed by the C64x+ Megamodule.  
The configuration SCR uses 32-bit configuration buses running at SYSCLK2 frequency. SYSCLK2 is  
supplied by the PLL1 controller and is fixed at a frequency equal to the CPU frequency divided by 3.  
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CFG SCR  
32  
(SYSCLK3)  
S
GPIO  
32  
(SYSCLK3)  
S
McBSPs  
32  
(SYSCLK3)  
S
PCI  
32  
32  
(SYSCLK3)  
32-bit  
(SYSCLK2)  
S
S
S
S
S
S
I2C  
(SYSCLK3)  
32  
(SYSCLK3)  
Bridge  
7
MUX  
Timers  
M
32  
(SYSCLK3)  
HPI  
EMAC/MDIO  
PLL  
32 (SYSCLK2)  
32 (SYSCLK2)  
32 (SYSCLK2)  
M
M
S
S
Megamodule  
Data SCR  
32  
(SYSCLK3)  
32  
(SYSCLK3)  
(A)  
Controllers  
32  
(SYSCLK3)  
Device  
Configuration  
(A)  
Registers  
32  
(SYSCLK2)  
S
EDMA3 CC  
EDMA3 TC0  
32  
(SYSCLK2)  
S
S
S
S
32  
32  
(SYSCLK2)  
(SYSCLK2)  
M
MUX  
EDMA3 TC1  
EDMA3 TC2  
32  
(SYSCLK2)  
32  
(SYSCLK2)  
EDMA3 TC3  
Configuration Bus  
Data Bus  
A. Only accessible by the C64x+ Megamodule.  
B. All clocks in this figure are generated by the PLL1 controller.  
Figure 4-2. C64x+ Megamodule - SCR Connection  
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4.4 Priority Allocation  
On the C6454 device, each of the masters (excluding the C64x+ Megamodule) are assigned a priority via  
the Priority Allocation Register (PRI_ALLOC), see Figure 4-3. The priority is enforced when several  
masters in the system are vying for the same endpoint. A value of 000b has the highest priority, while  
111b has the lowest priority.  
Note that the configuration SCR port on the data SCR is considered a single endpoint meaning priority will  
be enforced when multiple masters try to access the configuration SCR. Priority is also enforced on the  
configuration SCR side when a master (through the data SCR) tries to access the same endpoint as the  
C64x+ Megamodule.  
Other Master peripherals are not present in the PRI_ALLOC register as they have their own registers to  
program their priorities. For more information on the default priority values in these peripheral registers,  
see the device-compatible peripheral reference guides. TI recommends that these priority registers be  
reprogrammed upon initial use.  
31  
15  
16  
Reserved  
R-0000 0000 0000 0000  
12  
11  
9
8
6
5
3
2
0
Reserved  
R-000 0  
Reserved  
R/W-001  
Reserved  
R-0  
HOST  
EMAC  
R/W-010  
R/W-001  
LEGEND: R/W = Read/Write; R = Read only; -n = value at reset  
Figure 4-3. Priority Allocation Register (PRI_ALLOC)  
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5 C64x+ Megamodule  
The C64x+ Megamodule consists of several components — the C64x+ CPU, the L1 program and data  
memory controllers, the L2 memory controller, the internal DMA (IDMA), the interrupt controller,  
power-down controller, and external memory controller. The C64x+ Megamodule also provides support for  
memory protection (for L1P, L1D, and L2 memories) and bandwidth management (for resources local to  
the C64x+ Megamodule). Figure 5-1 shows a block diagram of the C64x+ Megamodule.  
L1P cache/SRAM  
256  
L1 program memory controller  
256  
Cache control  
L2 memory  
controller  
Advanced event  
triggering  
256  
256  
L2  
cache/  
SRAM  
Bandwidth management  
Memory protection  
(AET)  
Cache  
control  
256  
256  
C64x+ CPU  
Bandwidth  
management  
Instruction fetch  
SPLOOP buffer  
Internal  
ROM  
(A)  
256  
Memory  
protection  
IDMA  
16/32−bit instruction dispatch  
Instruction decode  
Data path 1  
Data path 2  
128  
M1  
xx  
xx  
M2  
xx  
xx  
L1  
S1  
D1  
D2  
S2  
L2  
External memory  
controller  
A register file  
B register file  
32  
Configuration  
Registers  
To Chip  
registers  
256  
64  
64  
128  
Interrupt  
and exception  
controller  
Slave DMA  
L1 data memory controller  
Cache control  
To primary  
switch fabric  
128  
Bandwidth management  
Memory protection  
256  
Power control  
Master DMA  
32  
L1D cache/SRAM  
A. When accessing the internal ROM of the DSP, the CPU frequency must always be less than 750 MHz.  
Figure 5-1. 64x+ Megamodule Block Diagram  
For more detailed information on the TMS320C64x+ Megamodule on the C6454 device, see the  
TMS320C64x+ Megamodule Reference Guide (literature number SPRU871).  
5.1 Memory Architecture  
The TMS320C6454 device contains a 1048KB level-2 memory (L2), a 32KB level-1 program memory  
(L1P), and a 32KB level-1 data memory (L1D).  
The L1P memory configuration for the C6454 device is as follows:  
•
•
Region 0 size is 0K bytes (disabled).  
Region 1 size is 32K bytes with no wait states.  
The L1D memory configuration for the C6454 device is as follows:  
Region 0 size is 0K bytes (disabled).  
•
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•
Region 1 size is 32K bytes with no wait states.  
L1D is a two-way set-associative cache while L1P is a direct-mapped cache.  
The L1P and L1D cache can be reconfigured via software through the L1PMODE field of the L1P  
Configuration Register (L1PMODE) and the L1DMODE field of the L1D Configuration Register (L1DCFG)  
of the C64x+ Megamodule. After device reset, L1P and L1D cache are configured as all cache or all  
SRAM. The on-chip Bootloader changes the reset configuration for L1P and L1D. For more information,  
see the TMS320C645x Bootloader User's Guide (literature number SPRUEC6).  
Figure 5-2 and Figure 5-3 show the available SRAM/cache configurations for L1P and L1D, respectively.  
L1P mode bits  
Block base  
000  
001  
010  
011  
100  
L1P memory  
16K bytes  
address  
00E0 0000h  
1/2  
SRAM  
3/4  
SRAM  
7/8  
SRAM  
direct  
mapped  
cache  
All  
SRAM  
00E0 4000h  
00E0 6000h  
8K bytes  
direct  
mapped  
cache  
4K bytes  
4K bytes  
direct  
mapped  
cache  
00E0 7000h  
00E0 8000h  
dm  
cache  
Figure 5-2. TMS320C6454 L1P Memory Configurations  
L1D mode bits  
Block base  
address  
00F0 0000h  
000  
001  
010  
011  
100  
L1D memory  
16K bytes  
1/2  
SRAM  
3/4  
SRAM  
7/8  
SRAM  
All  
SRAM  
2-way  
cache  
00F0 4000h  
00F0 6000h  
8K bytes  
2-way  
cache  
4K bytes  
4K bytes  
2-way  
cache  
00F0 7000h  
00F0 8000h  
2-way  
cache  
Figure 5-3. TMS320C6454 L1D Memory Configurations  
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The L2 memory configuration for the C6454 device is as follows:  
•
Port 0 configuration:  
–
–
–
–
Memory size is 1048KB  
Starting address is 0080 0000h  
2-cycle latency  
4 × 128-bit bank configuration  
•
Port 1 configuration:  
–
–
–
–
Memory size is 32K bytes (this corresponds to the internal ROM)  
Starting address is 0010 0000h  
1-cycle latency  
1 × 256-bit bank configuration  
L2 memory can be configured as all SRAM or as part 4-way set-associative cache. The amount of L2  
memory that is configured as cache is controlled through the L2MODE field of the L2 Configuration  
Register (L2CFG) of the C64x+ Megamodule. Figure 5-4 shows the available SRAM/cache configurations  
for L2. By default, L2 is configured as all SRAM after device reset.  
L2 mode bits  
Block base  
000  
001  
010  
011  
111  
L2 memory  
792K bytes  
address  
0080 0000h  
3/4  
SRAM  
7/8  
SRAM  
15/16  
SRAM  
All  
SRAM  
31/32  
SRAM  
008C 0000h  
128K bytes  
64K bytes  
4-way  
cache  
008E 0000h  
008F 0000h  
008F 8000h  
0090 0000h  
4-way  
cache  
32K bytes  
32K bytes  
4-way  
cache  
4-way  
Figure 5-4. TMS320C6454 L2 Memory Configurations  
For more information on the operation L1 and L2 caches, see the TMS320C64x+ DSP Cache User's  
Guide (literature number SPRU862).  
All memory on the C6454 has a unique location in the memory map (see Table 2-2, C6454 Memory Map  
Summary).  
When accessing the internal ROM of the DSP, the CPU frequency must always be less than 750 MHz.  
Therefore, when using a software boot mode, care must be taken such that the CPU frequency does not  
exceed 750 MHz at any point during the boot sequence. After the boot sequence has completed, the CPU  
frequency can be programmed to the frequency required by the application. For more detailed information  
ont he boot modes, see Section 2.4, Boot Sequence.  
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5.2 Memory Protection  
Memory protection allows an operating system to define who or what is authorized to access L1D, L1P,  
and L2 memory. To accomplish this, the L1D, L1P, and L2 memories are divided into pages. There are 16  
pages of L1P (2KB each), 16 pages of L1D (2KB each), and 16 pages of L2 (64KB each). The L1D, L1P,  
and L2 memory controllers in the C64x+ Megamodule are equipped with a set of registers that specify the  
permissions for each memory page.  
Each page may be assigned with fully orthogonal user and supervisor read, write, and execute  
permissions. Additionally, a page may be marked as either (or both) locally or globally accessible. A local  
access is a direct CPU access to L1D, L1P, and L2, while a global access is initiated by a DMA (either  
IDMA or the EDMA3) or by other system masters. Note that EDMA or IDMA transfers programmed by the  
CPU count as global accesses.  
The CPU and the system masters on the C6454 device are all assigned a privilege ID of 0. Therefore it is  
only possible to specify whether memory pages are locally or globally accessible. The AID0 and LOCAL  
bits of the memory protection page attribute registers specify the memory page protection scheme, see  
Table 5-1.  
Table 5-1. Available Memory Page Protection Schemes  
AID0 Bit  
LOCAL Bit  
Description  
0
0
1
0
1
0
No access to memory page is permitted.  
Only direct access by CPU is permitted.  
Only accesses by system masters and IDMA are permitted (includes EDMA and IDMA  
accesses initiated by the CPU).  
1
1
All accesses permitted  
For more information on memory protection for L1D, L1P, and L2, see the TMS320C64x+ Megamodule  
Reference Guide (literature number SPRU871).  
5.3 Bandwidth Management  
When multiple requestors contend for a single C64x+ Megamodule resource, the conflict is solved by  
granting access to the highest priority requestor. The following four resources are managed by the  
Bandwidth Management control hardware:  
•
•
•
•
Level 1 Program (L1P) SRAM/Cache  
Level 1 Data (L1D) SRAM/Cache  
Level 2 (L2) SRAM/Cache  
Memory-mapped registers configuration bus  
The priority level for operations initiated within the C64x+ Megamodule; e.g., CPU-initiated transfers,  
user-programmed cache coherency operations, and IDMA-initiated transfers, are declared through  
registers in the C64x+ Megamodule. The priority level for operations initiated outside the C64x+  
Megamodule by system peripherals is declared through the Priority Allocation Register (PRI_ALLOC), see  
Section 4.4. System peripherals with no fields in PRI_ALLOC have their own registers to program their  
priorities.  
More information on the bandwidth management features of the C64x+ Megamodule can be found in the  
TMS320C64x+ Megamodule Reference Guide (literature number SPRU871).  
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5.4 Power-Down Control  
The C64x+ Megamodule supports the ability to power-down various parts of the C64x+ Megamodule. The  
power-down controller (PDC) of the C64x+ Megamodule can be used to power down L1P, the cache  
control hardware, the CPU, and the entire C64x+ Megamodule. These power-down features can be used  
to design systems for lower overall system power requirements.  
NOTE  
The C6454 does not support power-down modes for the L2 memory at this time.  
More information on the power-down features of the C64x+ Megamodule can be found in the  
TMS320C64x+ Megamodule Reference Guide (literature number SPRU871).  
5.5 Megamodule Resets  
Table 5-2 shows the reset types supported on the C6454 device and they affect the resetting of the  
Megamodule, either both globally or just locally.  
Table 5-2. Megamodule Reset (Global or Local)  
GLOBAL  
MEGAMODULE  
RESET  
LOCAL  
MEGAMODULE  
RESET  
RESET TYPE  
Power-On Reset  
Y
Y
Y
N
Y
Y
Y
Y
Warm Reset  
System Reset  
CPU Reset  
For more detailed information on the global and local Megamodule resets, see the TMS320C64x+  
Megamodule Reference Guide (literature number SPRU871). And for more detailed information on device  
resets, see Section 7.6, Reset Controller.  
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5.6 Megamodule Revision  
The version and revision of the C64x+ Megamodule can be read from the Megamodule Revision ID  
Register (MM_REVID) located at address 0181 2000h. The MM_REVID register is shown in Figure 5-5  
and described in Table 5-3. The C64x+ Megamodule revision is dependant on the silicon revision being  
used. For more information, see the TMS320C6455/54 Digital Signal Processor Silicon Errata (literature  
number SPRZ234).  
31  
16 15  
0
VERSION  
R-1h  
REVISION(A)  
R-n  
LEGEND: R = Read only; -n = value after reset  
A. The C64x+ Megamodule revision is dependant on the silicon revision being used. For more information, see  
the TMS320C6455/54 Digital Signal Processor Silicon Errata (literature number SPRZ234).  
Figure 5-5. Megamodule Revision ID Register (MM_REVID) [Hex Address: 0181 2000h]  
Table 5-3. Megamodule Revision ID Register (MM_REVID) Field Descriptions  
Bit  
Field  
Value Description  
1h Version of the C64x+ Megamodule implemented on the device. This field is always read as 1h.  
31:16 VERSION  
15:0  
REVISION  
Revision of the C64x+ Megamodule version implemented on the device. The C64x+ Megamodule  
revision is dependant on the silicon revision being used. For more information, see the  
TMS320C6455/54 Digital Signal Processor Silicon Errata (literature number SPRZ234).  
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5.7 C64x+ Megamodule Register Description(s)  
Table 5-4. Megamodule Interrupt Registers  
HEX ADDRESS RANGE  
0180 0000  
ACRONYM  
EVTFLAG0  
EVTFLAG1  
EVTFLAG2  
EVTFLAG3  
-
REGISTER NAME  
Event Flag Register 0 (Events [31:0])  
0180 0004  
Event Flag Register 1  
0180 0008  
Event Flag Register 2  
0180 000C  
Event Flag Register 3  
0180 0010 - 0180 001C  
0180 0020  
Reserved  
EVTSET0  
EVTSET1  
EVTSET2  
EVTSET3  
-
Event Set Register 0 (Events [31:0])  
Event Set Register 1  
0180 0024  
0180 0028  
Event Set Register 2  
0180 002C  
Event Set Register 3  
0180 0030 - 0180 003C  
0180 0040  
Reserved  
EVTCLR0  
EVTCLR1  
EVTCLR2  
EVTCLR3  
-
Event Clear Register 0 (Events [31:0])  
Event Clear Register 1  
0180 0044  
0180 0048  
Event Clear Register 2  
0180 004C  
Event Clear Register 3  
0180 0050 - 0180 007C  
0180 0080  
Reserved  
EVTMASK0  
EVTMASK1  
EVTMASK2  
EVTMASK3  
-
Event Mask Register 0 (Events [31:0])  
Event Mask Register 1  
0180 0084  
0180 0088  
Event Mask Register 2  
0180 008C  
Event Mask Register 3  
0180 0090 - 0180 009C  
0180 00A0  
Reserved  
MEVTFLAG0  
MEVTFLAG1  
MEVTFLAG2  
MEVTFLAG3  
-
Masked Event Flag Status Register 0 (Events [31:0])  
Masked Event Flag Status Register 1  
Masked Event Flag Status Register 2  
Masked Event Flag Status Register 3  
Reserved  
0180 00A4  
0180 00A8  
0180 00AC  
0180 00B0 - 0180 00BC  
0180 00C0  
EXPMASK0  
EXPMASK1  
EXPMASK2  
EXPMASK3  
-
Exception Mask Register 0 (Events [31:0])  
Exception Mask Register 1  
Exception Mask Register 2  
Exception Mask Register 3  
Reserved  
0180 00C4  
0180 00C8  
0180 00CC  
0180 00D0 - 0180 00DC  
0180 00E0  
MEXPFLAG0  
MEXPFLAG1  
MEXPFLAG2  
MEXPFLAG3  
-
Masked Exception Flag Register 0  
Masked Exception Flag Register 1  
Masked Exception Flag Register 2  
Masked Exception Flag Register 3  
Reserved  
0180 00E4  
0180 00E8  
0180 00EC  
0180 00F0 - 0180 00FC  
0180 0100  
-
Reserved  
0180 0104  
INTMUX1  
INTMUX2  
INTMUX3  
-
Interrupt Multiplexor Register 1  
Interrupt Multiplexor Register 2  
Interrupt Multiplexor Register 3  
Reserved  
0180 0108  
0180 010C  
0180 0110 - 0180 013C  
0180 0140  
AEGMUX0  
AEGMUX1  
-
Advanced Event Generator Mux Register 0  
Advanced Event Generator Mux Register 1  
Reserved  
0180 0144  
0180 0148 - 0180 017C  
0180 0180  
INTXSTAT  
Interrupt Exception Status Register  
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Table 5-4. Megamodule Interrupt Registers (continued)  
HEX ADDRESS RANGE  
0180 0184  
ACRONYM  
INTXCLR  
INTDMASK  
-
REGISTER NAME  
Interrupt Exception Clear Register  
0180 0188  
Dropped Interrupt Mask Register  
Reserved  
0180 0188 - 0180 01BC  
0180 01C0  
EVTASRT  
-
Event Asserting Register  
Reserved  
0180 01C4 - 0180 FFFF  
Table 5-5. Megamodule Powerdown Control Registers  
HEX ADDRESS RANGE  
0181 0000  
ACRONYM  
PDCCMD  
-
REGISTER NAME  
Power-down controller command register  
Reserved  
0181 0004 - 0181 1FFF  
Table 5-6. Megamodule Revision Register  
HEX ADDRESS RANGE  
0181 2000  
ACRONYM  
MM_REVID  
-
REGISTER NAME  
Megamodule Revision ID Register  
Reserved  
0181 2004 – 0181 2FFF  
Table 5-7. Megamodule IDMA Registers  
HEX ADDRESS RANGE  
0182 0000  
ACRONYM  
IDMA0STAT  
IDMA0MASK  
IMDA0SRC  
IDMA0DST  
IDMA0CNT  
-
REGISTER NAME  
IDMA Channel 0 Status Register  
IDMA Channel 0 Mask Register  
IDMA Channel 0 Source Address Register  
IDMA Channel 0 Destination Address Register  
IDMA Channel 0 Count Register  
Reserved  
0182 0004  
0182 0008  
0182 000C  
0182 0010  
0182 0014 - 0182 00FC  
0182 0100  
IDMA1STAT  
-
IDMA Channel 1 Status Register  
Reserved  
0182 0104  
0182 0108  
IMDA1SRC  
IDMA1DST  
IDMA1CNT  
-
IDMA Channel 1 Source Address Register  
IDMA Channel 1 Destination Address Register  
IDMA Channel 1 Count Register  
Reserved  
0182 010C  
0182 0110  
0182 0114 - 0182 017C  
0182 0180  
-
Reserved  
0182 0184 - 0182 01FF  
-
Reserved  
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Table 5-8. Megamodule Cache Configuration Registers  
HEX ADDRESS RANGE  
0184 0000  
ACRONYM  
L2CFG  
-
REGISTER NAME  
L2 Cache Configuration Register  
0184 0004 - 0184 001F  
0184 0020  
Reserved  
L1PCFG  
L1PCC  
-
L1P Configuration Register  
0184 0024  
L1P Cache Control Register  
0184 0028 - 0184 003F  
0184 0040  
Reserved  
L1DCFG  
L1DCC  
-
L1D Configuration Register  
0184 0044  
L1D Cache Control Register  
0184 0048 - 0184 0FFF  
0184 1000 - 0184 104F  
0184 1050 - 0184 3FFF  
0184 4000  
Reserved  
-
See Table 5-10, CPU Megamodule Bandwidth Management Registers  
Reserved  
-
L2WBAR  
L2WWC  
-
L2 Writeback Base Address Register - for Block Writebacks  
L2 Writeback Word Count Register  
Reserved  
0184 4004  
0184 4008 - 0184 400C  
0184 4010  
L2WIBAR  
L2WIWC  
L2IBAR  
L2IWC  
L1PIBAR  
L1PIWC  
L1DWIBAR  
L1DWIWC  
-
L2 Writeback and Invalidate Base Address Register - for Block Writebacks  
L2 Writeback and Invalidate word count register  
L2 Invalidate Base Address Register  
L2 Invalidate Word Count Register  
L1P Invalidate Base Address Register  
L1P Invalidate Word Count Register  
L1D Writeback and Invalidate Base Address Register  
L1D Writeback and Invalidate Word Count Register  
Reserved  
0184 4014  
0184 4018  
0184 401C  
0184 4020  
0184 4024  
0184 4030  
0184 4034  
0184 4038  
0184 4040  
L1DWBAR  
L1DWWC  
L1DIBAR  
L1DIWC  
-
L1D Writeback Base Address Register - for Block Writebacks  
L1D Writeback Word Count Register  
L1D Invalidate Base Address Register  
L1D Invalidate Word Count Register  
Reserved  
0184 4044  
0184 4048  
0184 404C  
0184 4050 - 0184 4FFF  
0184 5000  
L2WB  
L2WBINV  
L2INV  
-
L2 Global Writeback Register  
0184 5004  
L2 Global Writeback and Invalidate Register  
L2 Global Invalidate Register  
0184 5008  
0184 500C - 0184 5024  
0184 5028  
Reserved  
L1PINV  
-
L1P Global Invalidate Register  
Reserved  
0184 502C - 0184 503C  
0184 5040  
L1DWB  
L1DWBINV  
L1DINV  
L1D Global Writeback Register  
L1D Global Writeback and Invalidate Register  
L1D Global Invalidate Register  
0184 5044  
0184 5048  
MAR0 to  
MAR127  
0184 8000 - 0184 81FC  
0184 8200 - 0184 823C  
0184 8240 - 0184 827C  
Reserved  
Reserved  
Reserved  
MAR128 to  
MAR143  
MAR144 to  
MAR159  
0184 8280  
0184 8284  
0184 8288  
0184 828C  
0184 8290  
MAR160  
MAR161  
MAR162  
MAR163  
MAR164  
Controls EMIFA CE2 Range A000 0000 - A0FF FFFF  
Controls EMIFA CE2 Range A100 0000 - A1FF FFFF  
Controls EMIFA CE2 Range A200 0000 - A2FF FFFF  
Controls EMIFA CE2 Range A300 0000 - A3FF FFFF  
Controls EMIFA CE2 Range A400 0000 - A4FF FFFF  
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Table 5-8. Megamodule Cache Configuration Registers (continued)  
HEX ADDRESS RANGE  
0184 8294  
0184 8298  
0184 829C  
0184 82A0  
0184 82A4  
0184 82A8  
0184 82AC  
0184 82B0  
0184 82B4  
0184 82B8  
0184 82BC  
0184 82C0  
0184 82C4  
0184 82C8  
0184 82CC  
0184 82D0  
0184 82D4  
0184 82D8  
0184 82DC  
0184 82E0  
0184 82E4  
0184 82E8  
0184 82EC  
0184 82F0  
0184 82F4  
0184 82F8  
0184 82FC  
0184 8300  
0184 8304  
0184 8308  
0184 830C  
0184 8310  
0184 8314  
0184 8318  
0184 831C  
0184 8320  
0184 8324  
0184 8328  
0184 832C  
0184 8330  
0184 8334  
0184 8338  
0184 833C  
0184 8340  
0184 8344  
0184 8348  
0184 834C  
ACRONYM  
MAR165  
MAR166  
MAR167  
MAR168  
MAR169  
MAR170  
MAR171  
MAR172  
MAR173  
MAR174  
MAR175  
MAR176  
MAR177  
MAR178  
MAR179  
MAR180  
MAR181  
MAR182  
MAR183  
MAR184  
MAR185  
MAR186  
MAR187  
MAR188  
MAR189  
MAR190  
MAR191  
MAR192  
MAR193  
MAR194  
MAR195  
MAR196  
MAR197  
MAR198  
MAR199  
MAR200  
MAR201  
MAR202  
MAR203  
MAR204  
MAR205  
MAR206  
MAR207  
MAR208  
MAR209  
MAR210  
MAR211  
REGISTER NAME  
Controls EMIFA CE2 Range A500 0000 - A5FF FFFF  
Controls EMIFA CE2 Range A600 0000 - A6FF FFFF  
Controls EMIFA CE2 Range A700 0000 - A7FF FFFF  
Controls EMIFA CE2 Range A800 0000 - A8FF FFFF  
Controls EMIFA CE2 Range A900 0000 - A9FF FFFF  
Controls EMIFA CE2 Range AA00 0000 - AAFF FFFF  
Controls EMIFA CE2 Range AB00 0000 - ABFF FFFF  
Controls EMIFA CE2 Range AC00 0000 - ACFF FFFF  
Controls EMIFA CE2 Range AD00 0000 - ADFF FFFF  
Controls EMIFA CE2 Range AE00 0000 - AEFF FFFF  
Controls EMIFA CE2 Range AF00 0000 - AFFF FFFF  
Controls EMIFA CE3 Range B000 0000 - B0FF FFFF  
Controls EMIFA CE3 Range B100 0000 - B1FF FFFF  
Controls EMIFA CE3 Range B200 0000 - B2FF FFFF  
Controls EMIFA CE3 Range B300 0000 - B3FF FFFF  
Controls EMIFA CE3 Range B400 0000 - B4FF FFFF  
Controls EMIFA CE3 Range B500 0000 - B5FF FFFF  
Controls EMIFA CE3 Range B600 0000 - B6FF FFFF  
Controls EMIFA CE3 Range B700 0000 - B7FF FFFF  
Controls EMIFA CE3 Range B800 0000 - B8FF FFFF  
Controls EMIFA CE3 Range B900 0000 - B9FF FFFF  
Controls EMIFA CE3 Range BA00 0000 - BAFF FFFF  
Controls EMIFA CE3 Range BB00 0000 - BBFF FFFF  
Controls EMIFA CE3 Range BC00 0000 - BCFF FFFF  
Controls EMIFA CE3 Range BD00 0000 - BDFF FFFF  
Controls EMIFA CE3 Range BE00 0000 - BEFF FFFF  
Controls EMIFA CE3 Range BF00 0000 - BFFF FFFF  
Controls EMIFA CE4 Range C000 0000 - C0FF FFFF  
Controls EMIFA CE4 Range C100 0000 - C1FF FFFF  
Controls EMIFA CE4 Range C200 0000 - C2FF FFFF  
Controls EMIFA CE4 Range C300 0000 - C3FF FFFF  
Controls EMIFA CE4 Range C400 0000 - C4FF FFFF  
Controls EMIFA CE4 Range C500 0000 - C5FF FFFF  
Controls EMIFA CE4 Range C600 0000 - C6FF FFFF  
Controls EMIFA CE4 Range C700 0000 - C7FF FFFF  
Controls EMIFA CE4 Range C800 0000 - C8FF FFFF  
Controls EMIFA CE4 Range C900 0000 - C9FF FFFF  
Controls EMIFA CE4 Range CA00 0000 - CAFF FFFF  
Controls EMIFA CE4 Range CB00 0000 - CBFF FFFF  
Controls EMIFA CE4 Range CC00 0000 - CCFF FFFF  
Controls EMIFA CE4 Range CD00 0000 - CDFF FFFF  
Controls EMIFA CE4 Range CE00 0000 - CEFF FFFF  
Controls EMIFA CE4 Range CF00 0000 - CFFF FFFF  
Controls EMIFA CE5 Range D000 0000 - D0FF FFFF  
Controls EMIFA CE5 Range D100 0000 - D1FF FFFF  
Controls EMIFA CE5 Range D200 0000 - D2FF FFFF  
Controls EMIFA CE5 Range D300 0000 - D3FF FFFF  
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SPRS311A–APRIL 2006–REVISED DECEMBER 2006  
Table 5-8. Megamodule Cache Configuration Registers (continued)  
HEX ADDRESS RANGE  
0184 8350  
0184 8354  
0184 8358  
0184 835C  
0184 8360  
0184 8364  
0184 8368  
0184 836C  
0184 8370  
0184 8374  
0184 8378  
0184 837C  
0184 8380  
0184 8384  
0184 8388  
0184 838C  
0184 8390  
0184 8394  
0184 8398  
0184 839C  
0184 83A0  
0184 83A4  
0184 83A8  
0184 83AC  
0184 83B0  
0184 83B4  
0184 83B8  
0184 83BC  
ACRONYM  
MAR212  
MAR213  
MAR214  
MAR215  
MAR216  
MAR217  
MAR218  
MAR219  
MAR220  
MAR221  
MAR222  
MAR223  
MAR224  
MAR225  
MAR226  
MAR227  
MAR228  
MAR229  
MAR230  
MAR231  
MAR232  
MAR233  
MAR234  
MAR235  
MAR236  
MAR237  
MAR238  
MAR239  
REGISTER NAME  
Controls EMIFA CE5 Range D400 0000 - D4FF FFFF  
Controls EMIFA CE5 Range D500 0000 - D5FF FFFF  
Controls EMIFA CE5 Range D600 0000 - D6FF FFFF  
Controls EMIFA CE5 Range D700 0000 - D7FF FFFF  
Controls EMIFA CE5 Range D800 0000 - D8FF FFFF  
Controls EMIFA CE5 Range D900 0000 - D9FF FFFF  
Controls EMIFA CE5 Range DA00 0000 - DAFF FFFF  
Controls EMIFA CE5 Range DB00 0000 - DBFF FFFF  
Controls EMIFA CE5 Range DC00 0000 - DCFF FFFF  
Controls EMIFA CE5 Range DD00 0000 - DDFF FFFF  
Controls EMIFA CE5 Range DE00 0000 - DEFF FFFF  
Controls EMIFA CE5 Range DF00 0000 - DFFF FFFF  
Controls DDR2 CE0 Range E000 0000 - E0FF FFFF  
Controls DDR2 CE0 Range E100 0000 - E1FF FFFF  
Controls DDR2 CE0 Range E200 0000 - E2FF FFFF  
Controls DDR2 CE0 Range E300 0000 - E3FF FFFF  
Controls DDR2 CE0 Range E400 0000 - E4FF FFFF  
Controls DDR2 CE0 Range E500 0000 - E5FF FFFF  
Controls DDR2 CE0 Range E600 0000 - E6FF FFFF  
Controls DDR2 CE0 Range E700 0000 - E7FF FFFF  
Controls DDR2 CE0 Range E800 0000 - E8FF FFFF  
Controls DDR2 CE0 Range E900 0000 - E9FF FFFF  
Controls DDR2 CE0 Range EA00 0000 - EAFF FFFF  
Controls DDR2 CE0 Range EB00 0000 - EBFF FFFF  
Controls DDR2 CE0 Range EC00 0000 - ECFF FFFF  
Controls DDR2 CE0 Range ED00 0000 - EDFF FFFF  
Controls DDR2 CE0 Range EE00 0000 - EEFF FFFF  
Controls DDR2 CE0 Range EF00 0000 - EFFF FFFF  
MAR240 to  
MAR255  
0184 83C0 -0184 83FC  
Reserved  
Table 5-9. Megamodule L1/L2 Memory Protection Registers  
HEX ADDRESS RANGE  
0184 A000  
ACRONYM  
L2MPFAR  
L2MPFSR  
L2MPFCR  
-
REGISTER NAME  
L2 memory protection fault address register  
0184 A004  
L2 memory protection fault status register  
L2 memory protection fault command register  
Reserved  
0184 A008  
0184 A00C - 0184 A0FF  
0184 A100  
L2MPLK0  
L2MPLK1  
L2MPLK2  
L2MPLK3  
L2MPLKCMD  
L2MPLKSTAT  
-
L2 memory protection lock key bits [31:0]  
L2 memory protection lock key bits [63:32]  
L2 memory protection lock key bits [95:64]  
L2 memory protection lock key bits [127:96]  
L2 memory protection lock key command register  
L2 memory protection lock key status register  
Reserved  
0184 A104  
0184 A108  
0184 A10C  
0184 A110  
0184 A114  
0184 A118 - 0184 A1FF  
0184 A200  
L2MPPA0  
L2MPPA1  
L2MPPA2  
L2 memory protection page attribute register 0  
L2 memory protection page attribute register 1  
L2 memory protection page attribute register 2  
0184 A204  
0184 A208  
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SPRS311A–APRIL 2006–REVISED DECEMBER 2006  
Table 5-9. Megamodule L1/L2 Memory Protection Registers (continued)  
HEX ADDRESS RANGE  
0184 A20C  
ACRONYM  
L2MPPA3  
L2MPPA4  
L2MPPA5  
L2MPPA6  
L2MPPA7  
L2MPPA8  
L2MPPA9  
L2MPPA10  
L2MPPA11  
L2MPPA12  
L2MPPA13  
L2MPPA14  
L2MPPA15  
L2MPPA16  
L2MPPA17  
L2MPPA18  
L2MPPA19  
L2MPPA20  
L2MPPA21  
L2MPPA22  
L2MPPA23  
L2MPPA24  
L2MPPA25  
L2MPPA26  
L2MPPA27  
L2MPPA28  
L2MPPA29  
L2MPPA30  
L2MPPA31  
-
REGISTER NAME  
L2 memory protection page attribute register 3  
L2 memory protection page attribute register 4  
L2 memory protection page attribute register 5  
L2 memory protection page attribute register 6  
L2 memory protection page attribute register 7  
L2 memory protection page attribute register 8  
L2 memory protection page attribute register 9  
L2 memory protection page attribute register 10  
L2 memory protection page attribute register 11  
L2 memory protection page attribute register 12  
L2 memory protection page attribute register 13  
L2 memory protection page attribute register 14  
L2 memory protection page attribute register 15  
L2 memory protection page attribute register 16  
L2 memory protection page attribute register 17  
L2 memory protection page attribute register 18  
L2 memory protection page attribute register 19  
L2 memory protection page attribute register 20  
L2 memory protection page attribute register 21  
L2 memory protection page attribute register 22  
L2 memory protection page attribute register 23  
L2 memory protection page attribute register 24  
L2 memory protection page attribute register 25  
L2 memory protection page attribute register 26  
L2 memory protection page attribute register 27  
L2 memory protection page attribute register 28  
L2 memory protection page attribute register 29  
L2 memory protection page attribute register 30  
L2 memory protection page attribute register 31  
Reserved  
0184 A210  
0184 A214  
0184 A218  
0184 A21C  
0184 A220  
0184 A224  
0184 A228  
0184 A22C  
0184 A230  
0184 A234  
0184 A238  
0184 A23C  
0184 A240  
0184 A244  
0184 A248  
0184 A24C  
0184 A250  
0184 A254  
0184 A258  
0184 A25C  
0184 A260  
0184 A264  
0184 A268  
0184 A26C  
0184 A270  
0184 A274  
0184 A278  
0184 A27C  
0184 A280 - 0184 A3FF  
0184 A400  
L1PMPFAR  
L1PMPFSR  
L1PMPFCR  
-
L1 program (L1P) memory protection fault address register  
L1P memory protection fault status register  
L1P memory protection fault command register  
Reserved  
0184 A404  
0184 A408  
0184 A40C - 0184 A4FF  
0184 A500  
L1PMPLK0  
L1PMPLK1  
L1PMPLK2  
L1PMPLK3  
L1P memory protection lock key bits [31:0]  
L1P memory protection lock key bits [63:32]  
L1P memory protection lock key bits [95:64]  
L1P memory protection lock key bits [127:96]  
0184 A504  
0184 A508  
0184 A50C  
0184 A510  
L1PMPLKCMD L1P memory protection lock key command register  
L1PMPLKSTAT L1P memory protection lock key status register  
0184 A514  
0184 A518 - 0184 ABFF  
0184 AC00  
-
Reserved  
L1DMPFAR  
L1DMPFSR  
L1DMPFCR  
-
L1 data (L1D) memory protection fault address register  
L1D memory protection fault status register  
L1D memory protection fault command register  
Reserved  
0184 AC04  
0184 AC08  
0184 AC0C - 0184 ACFF  
0184 AD00  
L1DMPLK0  
L1DMPLK1  
L1D memory protection lock key bits [31:0]  
L1D memory protection lock key bits [63:32]  
0184 AD04  
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SPRS311A–APRIL 2006–REVISED DECEMBER 2006  
Table 5-9. Megamodule L1/L2 Memory Protection Registers (continued)  
HEX ADDRESS RANGE  
0184 AD08  
ACRONYM  
L1DMPLK2  
L1DMPLK3  
REGISTER NAME  
L1D memory protection lock key bits [95:64]  
L1D memory protection lock key bits [127:96]  
0184 AD0C  
0184 AD10  
L1DMPLKCMD L1D memory protection lock key command register  
L1DMPLKSTAT L1D memory protection lock key status register  
0184 AD14  
0184 AD18 - 0185 FFFF  
-
Reserved  
Table 5-10. CPU Megamodule Bandwidth Management Registers  
HEX ADDRESS RANGE  
0182 0200  
ACRONYM  
REGISTER NAME  
EMCCPUARBE EMC CPU Arbitration Control Register  
EMCIDMAARBE EMC IDMA Arbitration Control Register  
EMCSDMAARBE EMC Slave DMA Arbitration Control Register  
EMCMDMAARBE EMC Master DMA Arbitration Control Resgiter  
0182 0204  
0182 0208  
0182 020C  
0182 0210 - 0182 02FF  
0184 1000  
-
Reserved  
L2DCPUARBU L2D CPU Arbitration Control Register  
L2DIDMAARBU L2D IDMA Arbitration Control Register  
L2DSDMAARBU L2D Slave DMA Arbitration Control Register  
0184 1004  
0184 1008  
0184 100C  
L2DUCARBU  
-
L2D User Coherence Arbitration Control Resgiter  
Reserved  
0184 1010 - 0184 103F  
0184 1040  
L1DCPUARBD L1D CPU Arbitration Control Register  
L1DIDMAARBD L1D IDMA Arbitration Control Register  
L1DSDMAARBD L1D Slave DMA Arbitration Control Register  
0184 1044  
0184 1048  
0184 104C  
L1DUCARBD  
L1D User Coherence Arbitration Control Resgiter  
Table 5-11. Device Configuration Registers (Chip-Level Registers)  
HEX ADDRESS RANGE  
02A8 0000  
ACRONYM  
DEVSTAT  
PRI_ALLOC  
JTAGID  
REGISTER NAME  
Device Status Register  
COMMENTS  
Read-only. Provides status of the  
user's device configuration on reset.  
02A8 0004  
Priority Allocation Register  
Sets priority for Master peripherals  
JTAG and BSDL Identification  
Register  
Read-only. Provides 32-bit JTAG ID of  
the device.  
02A8 0008  
02A8 000C - 02AB FFFF  
02AC 0000  
-
Reserved  
-
Reserved  
02AC 0004  
PERLOCK  
Peripheral Lock Register  
Peripheral Configuration Register 0  
Reserved  
02AC 0008  
PERCFG0  
02AC 000C  
-
02AC 0010  
-
Reserved  
02AC 0014  
PERSTAT0  
Peripheral Status Register 0  
Peripheral Status Register 1  
Reserved  
02AC 0018  
PERSTAT1  
02AC 001C - 02AC 001F  
02AC 0020  
-
EMACCFG  
EMAC Configuration Register  
Reserved  
02AC 0024 - 02AC 002B  
02AC 002C  
-
PERCFG1  
Peripheral Configuration Register 1  
Reserved  
02AC 0030 - 02AC 0053  
02AC 0054  
-
EMUBUFPD  
-
Emulator Buffer Powerdown Register  
Reserved  
02AC 0058  
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SPRS311A–APRIL 2006–REVISED DECEMBER 2006  
6 Device Operating Conditions  
6.1 Absolute Maximum Ratings Over Operating Case Temperature Range (Unless Otherwise  
Noted)(1)  
Supply voltage range:  
(2)  
CVDD  
-0.5 V to 1.5 V  
-0.5 V to 4.2 V  
(2)  
DVDD33  
(2)  
DVDD15, DVDD18, AVDLL1, AVDLL2  
PLLV1, PLLV2(2)  
-0.5 V to 2.5 V  
-0.5 V to 2.5 V  
Input voltage (VI) range:  
Output voltage (VO) range:  
3.3-V pins (except PCI-capable pins)  
PCI-capable pins  
-0.5 V to DVDD33 + 0.5 V  
-0.5 V to DVDD33 + 0.5 V  
-0.5 V to 2.5 V  
RGMII pins  
DDR2 memory controller pins  
3.3-V pins (except PCI-capable pins)  
PCI-capable pins  
-0.5 V to 2.5 V  
-0.5 V to DVDD33 + 0.5 V  
-0.5 V to DVDD33 + 0.5 V  
-0.5 V to 2.5 V  
RGMII pins  
DDR2 memory controller pins  
-0.5 V to 2.5 V  
Operating case temperature range, TC: (default)  
Storage temperature range, Tstg  
0°C to 90°C  
-65°C to 150°C  
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating  
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) All voltage values are with respect to VSS.  
6.2 Recommended Operating Conditions  
MIN  
NOM  
MAX UNIT  
-1000  
1.2125  
1.25  
1.2875  
V
CVDD  
Supply voltage, Core  
-850  
-720  
1.1640  
1.20  
1.2360  
V
DVDD33  
DVDD18  
AVDLL1  
AVDLL2  
VREFSSTL  
Supply voltage, I/O  
Supply voltage, I/O  
Supply voltage, I/O  
Supply voltage, I/O  
Reference voltage  
3.14  
1.71  
3.3  
3.46  
1.89  
V
V
V
V
V
V
V
V
V
1.8  
1.71  
1.8  
1.89  
1.71  
1.8  
0.50DVDD18  
1.8  
1.89  
0.49DVDD18  
1.71  
0.51DVDD18  
1.89  
1.8-V operation  
1.5-V operation  
1.8-V operation  
1.5-V operation  
Supply voltage, I/O [required only  
for EMAC RGMII]  
DVDD15  
1.43  
1.5  
1.57  
0.855  
0.9  
0.945  
VREFHSTL  
Reference voltage  
0.713  
0.75  
0.787  
PLLV1,  
PLLV2  
Supply voltage, PLL  
Supply ground  
1.71  
0
1.8  
0
1.89  
0
V
V
VSS  
3.3 V pins (except  
PCI-capable and  
I2C pins)  
2
V
PCI-capable pins  
I2C pins  
0.5DVDD33  
0.7DVDD33  
DVDD33 + 0.5  
V
V
V
VIH  
High-level input voltage  
RGMII pins  
VREFHSTL + 0.10  
DVDD15 + 0.30  
DVDD18 + 0.3  
DDR2 memory  
controller pins  
(DC)  
VREFSSTL + 0.125  
V
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Fixed-Point Digital Signal Processor  
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SPRS311A–APRIL 2006–REVISED DECEMBER 2006  
Recommended Operating Conditions (continued)  
MIN  
NOM  
MAX UNIT  
3.3 V pins (except  
PCI-capable and  
I2C pins)  
0.8  
V
PCI-capable pins  
-0.5  
0
0.3DVDD33  
0.3DVDD33  
V
V
V
VIL  
Low-level input voltage  
I2C pins  
RGMII pins  
-0.3  
VREFHSTL - 0.1  
DDR2 memory  
controller pins  
(DC)  
-0.3  
0
VREFSSTL - 0.125  
V
TC  
Operating case temperature  
90 °C  
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SPRS311A–APRIL 2006–REVISED DECEMBER 2006  
6.3 Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating  
Case Temperature (Unless Otherwise Noted)  
PARAMETER  
TEST CONDITIONS(1)  
MIN  
TYP  
MAX UNIT  
3.3-V pins (except  
PCI-capable and I2C  
pins)  
DVDD33 = MIN,  
IOH = MAX  
0.8DVDD33  
V
IOH = -0.5 mA,  
DVDD33 = 3.3 V  
PCI-capable pins(2)  
0.9DVDD33  
DVDD15 - 0.4  
DVDD18 - 0.28  
V
V
V
High-level  
output voltage  
VOH  
RGMII pins  
DDR2 memory  
controller pins  
3.3-V pins (except  
PCI-capable and I2C  
pins)  
DVDD33 = MIN,  
IOL = MAX  
0.22DVDD33  
V
V
IOL = 1.5 mA,  
DVDD33 = 3.3 V  
PCI-capable pins(2)  
0.1DVDD33  
Low-level output  
voltage  
VOL  
Pulled up to 3.3 V, 3 mA sink  
current  
I2C pins  
0.4  
0.4  
V
V
V
RGMII pins  
DDR2 memory  
controller pins  
0.28  
VI = VSS to DVDD33, pins  
without internal pullup or  
pulldown resistor  
-1  
1
uA  
3.3-V pins (except  
PCI-capable and I2C  
pins)  
VI = VSS to DVDD33, pins with  
internal pullup resistor  
50  
100  
400  
-50  
uA  
uA  
Input current  
[DC]  
II(3)  
VI = VSS to DVDD33, pins with  
internal pulldown resistor  
-400  
-100  
I2C pins  
PCI-capable pins(4)  
0.1DVDD33≤ VI≤ 0.9DVDD33  
-10  
10  
1000  
0.4  
uA  
uA  
V
-1000  
RGMII pins  
AECLKOUT,  
CLKR1/GP[0],  
CLKX1/GP[3],  
SYSCLK4/GP[1],  
EMU[18:0], CLKR0,  
CLKX0  
-8  
mA  
EMIF pins (except  
AECLKOUT), NMI,  
TOUT0L, TINP0L,  
TOUT1L, TINP1L,  
PCI_EN,  
EMAC-capable pins  
(except RGMII pins),  
RESETSTAT,  
High-level  
output current  
[DC]  
IOH  
-4  
mA  
McBSP-capable pins  
(except CLKR1/GP[0],  
CLKX1/GP[3], CLKR0,  
CLKX0), GP[7:4], and  
TDO  
PCI-capable pins(2)  
-0.5  
-8  
mA  
mA  
RGMII pins  
DDR2 memory  
controller pins  
-13.4  
mA  
(1) For test conditions shown as MIN, MAX, or NOM, use the appropriate value specified in the recommended operating conditions table.  
(2) These rated numbers are from the PCI Local Bus Specification (version 2.3). The DC specification and AC specifications are defined in  
Table 4-3 and Table 4-4, respectively, of the PCI Local Bus Specification.  
(3) II applies to input-only pins and bi-directional pins. For input-only pins, II indicates the input leakage current. For bi-directional pins, II  
includes input leakage current and off-state (hi-Z) output leakage current.  
(4) PCI input leakage currents include Hi-Z output leakage for all bidirectional buffers with 3-state outputs.  
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SPRS311A–APRIL 2006–REVISED DECEMBER 2006  
Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating Case  
Temperature (Unless Otherwise Noted) (continued)  
PARAMETER  
TEST CONDITIONS(1)  
MIN  
TYP  
MAX UNIT  
AECLKOUT,  
CLKR1/GP[0],  
CLKX1/GP[3],  
SYSCLK4/GP[1],  
EMU[18:0], CLKR0,  
CLKX0  
8
mA  
EMIF pins (except  
AECLKOUT), NMI,  
TOUT0L, TINP0L,  
TOUTP1L, TINP1L,  
PCI_EN,  
EMAC-capable pins  
(except RGMII pins),  
RESETSTAT,  
Low-level output  
current [DC]  
IOL  
4
mA  
McBSP-capable pins  
(except CLKR1/GP[0],  
CLKX1/GP[3], CLKR0,  
CLKX0), GP[7:4], and  
TDO  
PCI-capable pins(2)  
1.5  
8
mA  
mA  
RGMII pins  
DDR2 memory  
controller pins  
13.4  
20  
mA  
uA  
W
Off-state output  
current [DC]  
(5)  
IOZ  
3.3-V pins  
VO = DVDD33 or 0 V  
-20  
CVDD = 1.25 V,  
CPU frequency = 1000 MHz  
1.57  
1.30  
1.18  
CVDD = 1.2 V,  
CPU frequency = 850 MHz  
PCDD Core supply power(6)  
W
CVDD = 1.2 V,  
CPU frequency = 720 MHz  
W
DVDD33 = 3.3 V,  
DVDD18 = 1.8 V,  
PLLV1 = PLLV2 = AVDLL1  
AVDLL2 = 1.8 V,  
CPU frequency = 1000 MHz  
=
0.54  
0.53  
0.52  
W
W
W
DVDD33 = 3.3 V,  
DVDD18 = 1.8 V,  
PLLV1 = PLLV2 = AVDLL1  
AVDLL2 = 1.8 V,  
PDDD I/O supply power(6)  
=
CPU frequency = 850 MHz  
DVDD33 = 3.3 V,  
DVDD18 = 1.8 V,  
PLLV1 = PLLV2 = AVDLL1  
AVDLL2 = 1.8 V,  
=
CPU frequency = 720 MHz  
Ci  
Input capacitance  
Output capacitance  
10  
10  
pF  
pF  
Co  
(5) IOZ applies to output-only pins, indicating off-state (hi-Z) output leakage current.  
(6) Assumes the following conditions: 60% CPU utilization; DDR2 at 50% utilization (250 MHz), 50% writes, 32 bits, 50% bit switching; two  
2-MHz McBSPs at 100% utilization, 50% switching; two 75-MHz Timers at 100% utilization; device configured for HPI32 mode with  
pull-up resistors on HPI pins; room temperature (25°C). The actual current draw is highly application-dependent. For more details on  
core and I/O activity, see the TMS320C6455/54 Power Consumption Summary application report (literature number SPRAAE8).  
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7 C64x+ Peripheral Information and Electrical Specifications  
7.1 Parameter Information  
Tester Pin Electronics  
Data Sheet Timing Reference Point  
42 Ω  
3.5 nH  
Output  
Under  
Test  
Transmission Line  
Z0 = 50 Ω  
(see Note)  
Device Pin  
(see Note)  
4.0 pF  
1.85 pF  
NOTE: The data sheet provides timing at the device pin. For output timing analysis, the tester pin electronics and its transmission line effects must  
be taken into account. A transmission line with a delay of 2 ns can be used to produce the desired transmission line effect. The transmission  
line is intended as a load only. It is not necessary to add or subtract the transmission line delay (2 ns) from the data sheet timings.  
Input requirements in this data sheet are tested with an input slew rate of < 4 Volts per nanosecond (4 V/ns) at the device pin.  
Figure 7-1. Test Load Circuit for AC Timing Measurements  
The load capacitance value stated is only for characterization and measurement of AC timing signals. This  
load capacitance value does not indicate the maximum load the device is capable of driving.  
7.1.1 3.3-V Signal Transition Levels  
All input and output timing parameters are referenced to 1.5 V for both "0" and "1" logic levels.  
V
ref  
= 1.5 V  
Figure 7-2. Input and Output Voltage Reference Levels for AC Timing Measurements  
All rise and fall transition timing parameters are referenced to VIL MAX and VIH MIN for input clocks,  
VOLMAX and VOH MIN for output clocks.  
V
ref  
= V MIN (or V MIN)  
IH OH  
V
ref  
= V MAX (or V MAX)  
IL OL  
Figure 7-3. Rise and Fall Transition Time Voltage Reference Levels  
7.1.2 3.3-V Signal Transition Rates  
All timings are tested with an input edge rate of 4 volts per nanosecond (4 V/ns).  
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7.1.3 Timing Parameters and Board Routing Analysis  
The timing parameter values specified in this data sheet do not include delays by board routings. As a  
good board design practice, such delays must always be taken into account. Timing values may be  
adjusted by increasing/decreasing such delays. TI recommends utilizing the available I/O buffer  
information specification (IBIS) models to analyze the timing characteristics correctly. To properly use IBIS  
models to attain accurate timing analysis for a given system, see the Using IBIS Models for Timing  
Analysis application report (literature number SPRA839). If needed, external logic hardware such as  
buffers may be used to compensate any timing differences.  
For inputs, timing is most impacted by the round-trip propagation delay from the DSP to the external  
device and from the external device to the DSP. This round-trip delay tends to negatively impact the input  
setup time margin, but also tends to improve the input hold time margins (see Table 7-1 and Figure 7-4).  
Figure 7-4 represents a general transfer between the DSP and an external device. The figure also  
represents board route delays and how they are perceived by the DSP and the external device.  
Table 7-1. Board-Level Timing Example  
(see Figure 7-4)  
NO.  
1
DESCRIPTION  
Clock route delay  
2
Minimum DSP hold time  
3
Minimum DSP setup time  
External device hold time requirement  
External device setup time requirement  
Control signal route delay  
External device hold time  
4
5
6
7
8
External device access time  
DSP hold time requirement  
DSP setup time requirement  
Data route delay  
9
10  
11  
AECLKOUT  
(Output from DSP)  
1
AECLKOUT  
(Input to External Device)  
2
3
(A)  
Control Signals  
(Output from DSP)  
4
5
6
Control Signals  
(Input to External Device)  
7
8
(B)  
Data Signals  
(Output from External Device)  
9
10  
11  
(B)  
Data Signals  
(Input to DSP)  
A. Control signals include data for Writes.  
B. Data signals are generated during Reads from an external device.  
Figure 7-4. Board-Level Input/Output Timings  
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7.2 Recommended Clock and Control Signal Transition Behavior  
All clocks and control signals must transition between VIH and VIL (or between VIL and VIH) in a monotonic  
manner.  
7.3 Power Supplies  
7.3.1 Power-Supply Sequencing  
TI recommends the power-supply sequence shown in Figure 7-5. After the DVDD33 supply is stable, the  
remaining power supplies can be powered up at the same time as CVDD as long as their supply voltage  
never exceeds the CVDD voltage during powerup. Some TI power-supply devices include features that  
facilitate power sequencing; for example, Auto-Track or Slow-Start/Enable features. For more information,  
visit www.ti.com/dsppower.  
DV  
CV  
DD33  
1
DD12  
2
All other  
power supplies  
Figure 7-5. Power-Supply Sequence  
Table 7-2. Timing Requirements for Power-Supply Sequence  
-720  
-850  
-1000  
NO.  
UNIT  
MIN  
MAX  
200  
1
tsu(DVDD33-CVDD12) Setup time, DVDD33 supply stable before CVDD12 supply stable  
tsu(CVDD12-ALLSUP) Setup time, CVDD12 supply stable before all other supplies stable  
0.5  
0
ms  
ms  
2
200  
7.3.2 Power-Supply Decoupling  
In order to properly decouple the supply planes from system noise, place as many capacitors (caps) as  
possible close to the DSP. These caps need to be close to the DSP, no more than 1.25 cm maximum  
distance to be effective. Physically smaller caps are better, such as 0402, but need to be evaluated from a  
yield/manufacturing point-of-view. Parasitic inductance limits the effectiveness of the decoupling  
capacitors, therefore physically smaller capacitors should be used while maintaining the largest available  
capacitance value. As with the selection of any component, verification of capacitor availability over the  
product's production lifetime should be considered.  
7.3.3 Power-Down Operation  
One of the power goals for the C6454 is to reduce power dissipation due to unused peripherals. There are  
different ways to power down peripherals on the C6454 device.  
Some peripherals can be statically powered down at device reset through the device configuration pins  
(see Section 3.1, Device Configuration at Device Reset). Once in a static power-down state, the peripheral  
is held in reset and its clock is turned off. Peripherals cannot be enabled once they are in a static  
power-down state. To take a peripheral out of the static power-down state, a device reset must be  
executed with a different configuration pin setting.  
After device reset, all peripherals on the C6454 device are in a disabled state and must be enabled by  
software before being used. It is possible to enable only the peripherals needed by the application while  
keeping the rest disabled. Note that peripherals in a disabled state are held in reset with their clocks  
gated. For more information on how to enable peripherals, see Section 3.3, Peripheral Selection After  
Device Reset.  
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Peripherals used for booting, like I2C and HPI, are automatically enabled after device reset. It is not  
possible to disable these peripherals after the boot process is complete.  
The C64x+ Megamodule also allows for software-driven power-down management for all of the C64x+  
megamodule components through its Power-Down Controller (PDC). The CPU can power-down part or  
the entire C64x+ megamodule through the power-down controller based on its own execution thread or in  
response to an external stimulus from a host or global controller. More information on the power-down  
features of the C64x+ Megamodule can be found in the TMS320C64x+ Megamodule Reference Guide  
(literature number SPRU871).  
7.3.4 Preserving Boundary-Scan Functionality on RGMII and DDR2 Memory Pins  
When the RGMII mode of the EMAC is not used, the DVDD15, DVDD15MON, VREFHSTL, RSV13, and RSV14  
pins can be connected directly to ground (VSS) to save power. However, this will prevent boundary-scan  
from functioning on the RGMII pins of the EMAC. To preserve boundary-scan functionality on the RGMII  
pins, DVDD15, VREFHSTL, RSV14, and RSV13 should be connected as follows:  
•
•
DVDD15 and DVDD15MON - connect these pins to the 1.8-V I/O supply (DVDD18).  
VREFHSTL - connect to a voltage of DVDD18/2. The DVDD18/2 voltage can be generated directly from the  
DVDD18 supply using two 1-kΩ resistors to form a resistor divider circuit.  
•
•
RSV13 - connect this pin to ground (VSS) via a 200-Ω resistor.  
RSV14 - connect this pin to the 1.8-V I/O supply (DVDD18) via a 200-Ω resistor.  
Similarly, when the DDR2 Memory Controller is not used, the VREFSSTL, RSV11, and RSV12 pins can be  
connected directly to ground (VSS) to save power. However, this will prevent boundary-scan from  
functioning on the DDR2 Memory Controller pins. To preserve boundary-scan functionality on the DDR2  
Memory Controller pins, VREFSSTL, RSV11, and RSV12 should be connected as follows:  
•
VREFSSTL - connect to a voltage of DVDD18/2. The DVDD18/2 voltage can be generated directly from the  
DVDD18 supply using two 1-kΩ resistors to form a resistor divider circuit.  
•
•
RSV11 - connect this pin to ground (VSS) via a 200-Ω resistor.  
RSV12 - connect this pin to the 1.8-V I/O supply (DVDD18) via a 200-Ω resistor.  
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7.4 Enhanced Direct Memory Access (EDMA3) Controller  
The primary purpose of the EDMA3 is to service user-programmed data transfers between two  
memory-mapped slave endpoints on the device. The EDMA3 services software-driven paging transfers  
(e.g., data movement between external memory and internal memory), performs sorting or subframe  
extraction of various data structures, services event driven peripherals such as the McBSP, and offloads  
data transfers from the device CPU.  
The EDMA3 includes the following features:  
•
Fully orthogonal transfer description  
–
–
–
3 transfer dimensions: array (multiple bytes), frame (multiple arrays), and block (multiple frames)  
Single event can trigger transfer of array, frame, or entire block  
Independent indexes on source and destination  
•
Flexible transfer definition:  
–
–
Increment or FIFO transfer addressing modes  
Linking mechanism allows for ping-pong buffering, circular buffering, and repetitive/continuous  
transfers, all with no CPU intervention  
–
Chaining allows multiple transfers to execute with one event  
•
256 PaRAM entries  
–
–
Used to define transfer context for channels  
Each PaRAM entry can be used as a DMA entry, QDMA entry, or link entry  
•
•
64 DMA channels  
–
Manually triggered (CPU writes to channel controller register), external event triggered, and chain  
triggered (completion of one transfer triggers another)  
8 Quick DMA (QDMA) channels  
–
–
Used for software-driven transfers  
Triggered upon writing to a single PaRAM set entry  
•
•
•
4 transfer controllers/event queues with programmable system-level priority  
Interrupt generation for transfer completion and error conditions  
Memory protection support  
–
Active memory protection for accesses to PaRAM and registers  
•
Debug visibility  
–
–
Queue watermarking/threshold allows detection of maximum usage of event queues  
Error and status recording to facilitate debug  
Each of the transfer controllers has a direct connection to the switched central resource (SCR). Table 4-1  
lists the peripherals that can be accessed by the transfer controllers.  
7.4.1 EDMA3 Device-Specific Information  
A DSP interrupt must be generated at the end of an HPI or PCI boot operation to begin execution of the  
loaded application. Since the DSP interrupt generated by the HPI and PCI is mapped to the EDMA event  
DSP_EVT (DMA channel 0), it will get recorded in bit 0 of the EDMA Event Register (ER). This event must  
be cleared by software before triggering transfers on DMA channel 0. The EDMA3 on the C6454 DSP  
supports active memory protection, but it does not support proxied memory protection.  
The EDMA supports two addressing modes: constant addressing and increment addressing mode. On the  
C6454 DSP, constant addressing mode is not supported by any peripheral or internal memory. For more  
information on these two addressing modes, see the TMS320C645x DSP Enhanced DMA (EDMA)  
Controller User's Guide (literature number SPRU966).  
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7.4.2 EDMA3 Channel Synchronization Events  
The EDMA3 supports up to 64 DMA channels that can be used to service system peripherals and to move  
data between system memories. DMA channels can be triggered by synchronization events generated by  
system peripherals. Table 7-3 lists the source of the synchronization event associated with each of the  
DMA channels. On the C6454, the association of each synchronization event and DMA channel is fixed  
and cannot be reprogrammed.  
For more detailed information on the EDMA3 module and how EDMA3 events are enabled, captured,  
processed, prioritized, linked, chained, and cleared, etc., see the TMS320C645x DSP Enhanced DMA  
(EDMA) Controller User's Guide (literature number SPRU966).  
Table 7-3. C6454 EDMA3 Channel Synchronization Events(1)  
EDMA  
CHANNEL  
BINARY  
EVENT NAME  
EVENT DESCRIPTION  
0(2)  
000 0000  
000 0001  
000 0010  
000 0011  
000 0100  
000 0101  
000 0110  
000 0111  
000 1000  
000 1001  
000 1010  
000 1011  
000 1100  
000 1101  
000 1110  
000 1111  
001 0000  
001 0001  
-
DSP_EVT  
TEVTLO0  
TEVTHI0  
-
HPI/PCI-to-DSP event  
1
Timer 0 lower counter event  
Timer 0 high counter event  
None  
2
3
4
-
None  
5
-
None  
6
-
None  
7
-
None  
8
-
None  
9
-
None  
10  
11  
12  
13  
14  
15  
16  
17  
18-43  
44  
45  
46-47  
48  
49  
50  
51  
52  
53  
54  
55  
56  
57  
-
None  
-
None  
XEVT0  
REVT0  
XEVT1  
REVT1  
TEVTLO1  
TEVTHI1  
-
McBSP0 transmit event  
McBSP0 receive event  
McBSP1 transmit event  
McBSP1 receive event  
Timer 1 lower counter event  
Timer 1 high counter event  
None  
010 1100  
010 1101  
-
ICREVT  
ICXEVT  
-
I2C receive event  
I2C transmit event  
None  
011 0000  
011 0001  
011 0010  
011 0011  
011 0100  
011 0101  
011 0110  
011 0111  
011 1000  
011 1001  
GPINT0  
GPINT1  
GPINT2  
GPINT3  
GPINT4  
GPINT5  
GPINT6  
GPINT7  
GPINT8  
GPINT9  
GPIO event 0  
GPIO event 1  
GPIO event 2  
GPIO event 3  
GPIO event 4  
GPIO event 5  
GPIO event 6  
GPIO event 7  
GPIO event 8  
GPIO event 9  
(1) In addition to the events shown in this table, each of the 64 channels can also be synchronized with the transfer completion or alternate  
transfer completion events. For more detailed information on EDMA event-transfer chaining, see the TMS320C645x DSP Enhanced  
DMA (EDMA) Controller User's Guide (literature number SPRU966).  
(2) HPI boot and PCI boot are terminated using a DSP interrupt. The DSP interrupt is registered in bit 0 (channel 0) of the EDMA Event  
Register (ER). This event must be cleared by software before triggering transfers on DMA channel 0.  
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Table 7-3. C6454 EDMA3 Channel Synchronization Events (continued)  
EDMA  
CHANNEL  
BINARY  
EVENT NAME  
EVENT DESCRIPTION  
58  
59  
60  
61  
62  
63  
011 1010  
011 1011  
011 1100  
011 1101  
011 1110  
011 1111  
GPINT10  
GPINT11  
GPINT12  
GPINT13  
GPINT14  
GPINT15  
GPIO event 10  
GPIO event 11  
GPIO event 12  
GPIO event 13  
GPIO event 14  
GPIO event 15  
7.4.3 EDMA3 Peripheral Register Description(s)  
Table 7-4. EDMA3 Channel Controller Registers  
HEX ADDRESS RANGE  
02A0 0000  
02A0 0004  
02A0 0008 - 02A0 00FC  
02A0 0100  
02A0 0104  
02A0 0108  
02A0 010C  
02A0 0110  
02A0 0114  
02A0 0118  
02A0 011C  
02A0 0120  
02A0 0124  
02A0 0128  
02A0 012C  
02A0 0130  
02A0 0134  
02A0 0138  
02A0 013C  
02A0 0140  
02A0 0144  
02A0 0148  
02A0 014C  
02A0 0150  
02A0 0154  
02A0 0158  
02A0 015C  
02A0 0160  
02A0 0164  
02A0 0168  
02A0 016C  
02A0 0170  
02A0 0174  
02A0 0178  
02A0 017C  
ACRONYM  
PID  
REGISTER NAME  
Peripheral ID Register  
CCCFG  
EDMA3CC Configuration Register  
Reserved  
-
DCHMAP0  
DCHMAP1  
DCHMAP2  
DCHMAP3  
DCHMAP4  
DCHMAP5  
DCHMAP6  
DCHMAP7  
DCHMAP8  
DCHMAP9  
DCHMAP10  
DCHMAP11  
DCHMAP12  
DCHMAP13  
DCHMAP14  
DCHMAP15  
DCHMAP16  
DCHMAP17  
DCHMAP18  
DCHMAP19  
DCHMAP20  
DCHMAP21  
DCHMAP22  
DCHMAP23  
DCHMAP24  
DCHMAP25  
DCHMAP26  
DCHMAP27  
DCHMAP28  
DCHMAP29  
DCHMAP30  
DCHMAP31  
DMA Channel 0 Mapping Register  
DMA Channel 1 Mapping Register  
DMA Channel 2 Mapping Register  
DMA Channel 3 Mapping Register  
DMA Channel 4 Mapping Register  
DMA Channel 5 Mapping Register  
DMA Channel 6 Mapping Register  
DMA Channel 7 Mapping Register  
DMA Channel 8 Mapping Register  
DMA Channel 9 Mapping Register  
DMA Channel 10 Mapping Register  
DMA Channel 11 Mapping Register  
DMA Channel 12 Mapping Register  
DMA Channel 13 Mapping Register  
DMA Channel 14 Mapping Register  
DMA Channel 15 Mapping Register  
DMA Channel 16 Mapping Register  
DMA Channel 17 Mapping Register  
DMA Channel 18 Mapping Register  
DMA Channel 19 Mapping Register  
DMA Channel 20 Mapping Register  
DMA Channel 21 Mapping Register  
DMA Channel 22 Mapping Register  
DMA Channel 23 Mapping Register  
DMA Channel 24 Mapping Register  
DMA Channel 25 Mapping Register  
DMA Channel 26 Mapping Register  
DMA Channel 27 Mapping Register  
DMA Channel 28 Mapping Register  
DMA Channel 29 Mapping Register  
DMA Channel 30 Mapping Register  
DMA Channel 31 Mapping Register  
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Table 7-4. EDMA3 Channel Controller Registers (continued)  
HEX ADDRESS RANGE  
02A0 0180  
ACRONYM  
DCHMAP32  
DCHMAP33  
DCHMAP34  
DCHMAP35  
DCHMAP36  
DCHMAP37  
DCHMAP38  
DCHMAP39  
DCHMAP40  
DCHMAP41  
DCHMAP42  
DCHMAP43  
DCHMAP44  
DCHMAP45  
DCHMAP46  
DCHMAP47  
DCHMAP48  
DCHMAP49  
DCHMAP50  
DCHMAP51  
DCHMAP52  
DCHMAP53  
DCHMAP54  
DCHMAP55  
DCHMAP56  
DCHMAP57  
DCHMAP58  
DCHMAP59  
DCHMAP60  
DCHMAP61  
DCHMAP62  
DCHMAP63  
QCHMAP0  
QCHMAP1  
QCHMAP2  
QCHMAP3  
-
REGISTER NAME  
DMA Channel 32 Mapping Register  
02A0 0184  
DMA Channel 33 Mapping Register  
DMA Channel 34 Mapping Register  
DMA Channel 35 Mapping Register  
DMA Channel 36 Mapping Register  
DMA Channel 37 Mapping Register  
DMA Channel 38 Mapping Register  
DMA Channel 39 Mapping Register  
DMA Channel 40 Mapping Register  
DMA Channel 41 Mapping Register  
DMA Channel 42 Mapping Register  
DMA Channel 43 Mapping Register  
DMA Channel 44 Mapping Register  
DMA Channel 45 Mapping Register  
DMA Channel 46 Mapping Register  
DMA Channel 47 Mapping Register  
DMA Channel 48 Mapping Register  
DMA Channel 49 Mapping Register  
DMA Channel 50 Mapping Register  
DMA Channel 51 Mapping Register  
DMA Channel 52 Mapping Register  
DMA Channel 53 Mapping Register  
DMA Channel 54 Mapping Register  
DMA Channel 55 Mapping Register  
DMA Channel 56 Mapping Register  
DMA Channel 57 Mapping Register  
DMA Channel 58 Mapping Register  
DMA Channel 59 Mapping Register  
DMA Channel 60 Mapping Register  
DMA Channel 61 Mapping Register  
DMA Channel 62 Mapping Register  
DMA Channel 63 Mapping Register  
QDMA Channel 0 Mapping Register  
QDMA Channel 1 Mapping Register  
QDMA Channel 2 Mapping Register  
QDMA Channel 3 Mapping Register  
Reserved  
02A0 0188  
02A0 018C  
02A0 0190  
02A0 0194  
02A0 0198  
02A0 019C  
02A0 01A0  
02A0 01A4  
02A0 01A8  
02A0 01AC  
02A0 01B0  
02A0 01B4  
02A0 01B8  
02A0 01BC  
02A0 01C0  
02A0 01C4  
02A0 01C8  
02A0 01CC  
02A0 01D0  
02A0 01D4  
02A0 01D8  
02A0 01DC  
02A0 01E0  
02A0 01E4  
02A0 01E8  
02A0 01EC  
02A0 01F0  
02A0 01F4  
02A0 01F8  
02A0 01FC  
02A0 0200  
02A0 0204  
02A0 0208  
02A0 020C  
02A0 0210 - 02A0 021C  
02A0 0220 - 02A0 023C  
02A0 0240  
-
Reserved  
DMAQNUM0  
DMAQNUM1  
DMAQNUM2  
DMAQNUM3  
-
DMA Queue Number Register 0  
DMA Queue Number Register 1  
DMA Queue Number Register 2  
DMA Queue Number Register 3  
Reserved  
02A0 0244  
02A0 0248  
02A0 024C  
02A0 0250 - 02A0 025C  
02A0 0260  
QDMAQNUM  
-
QDMA Queue Number Register  
Reserved  
02A0 0264 - 02A0 0280  
02A0 0284  
QUEPRI  
Queue Priority Register  
02A0 0288 - 02A0 02FC  
-
Reserved  
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Table 7-4. EDMA3 Channel Controller Registers (continued)  
HEX ADDRESS RANGE  
02A0 0300  
02A0 0304  
02A0 0308  
02A0 030C  
02A0 0310  
02A0 0314  
02A0 0318  
02A0 031C  
02A0 0320  
02A0 0324 - 02A0 033C  
02A0 0340  
02A0 0344  
02A0 0348  
02A0 034C  
02A0 0350  
02A0 0354  
02A0 0358  
02A0 035C  
02A0 0360  
02A0 0364  
02A0 0368  
02A0 036C  
02A0 0370  
02A0 0374  
02A0 0378  
02A0 037C  
02A0 0380  
02A0 0384  
02A0 0388  
02A0 038C  
02A0 0390 - 02A0 039C  
02A0 0400  
02A0 0404  
02A0 0408  
02A0 040C  
02A0 0410  
02A0 0414  
02A0 0418  
02A0 041C  
02A0 0420  
02A0 0424  
02A0 0428  
02A0 042C  
02A0 0430  
02A0 0434  
02A0 0438  
02A0 043C  
ACRONYM  
EMR  
REGISTER NAME  
Event Missed Register  
EMRH  
EMCR  
EMCRH  
QEMR  
QEMCR  
CCERR  
CCERRCLR  
EEVAL  
-
Event MissedRegister High  
Event Missed Clear Register  
Event Missed Clear Register High  
QDMA Event Missed Register  
QDMA Event Missed Clear Register  
EDMA3CC Error Register  
EDMA3CC Error Clear Register  
Error Evaluate Register  
Reserved  
DRAE0  
DRAEH0  
DRAE1  
DRAEH1  
DRAE2  
DRAEH2  
DRAE3  
DRAEH3  
DRAE4  
DRAEH4  
DRAE5  
DRAEH5  
DRAE6  
DRAEH6  
DRAE7  
DRAEH7  
QRAE0  
QRAE1  
QRAE2  
QRAE3  
-
DMA Region Access Enable Register for Region 0  
DMA Region Access Enable Register High for Region 0  
DMA Region Access Enable Register for Region 1  
DMA Region Access Enable Register High for Region 1  
DMA Region Access Enable Register for Region 2  
DMA Region Access Enable Register High for Region 2  
DMA Region Access Enable Register for Region 3  
DMA Region Access Enable Register High for Region 3  
DMA Region Access Enable Register for Region 4  
DMA Region Access Enable Register High for Region 4  
DMA Region Access Enable Register for Region 5  
DMA Region Access Enable Register High for Region 5  
DMA Region Access Enable Register for Region 6  
DMA Region Access Enable Register High for Region 6  
DMA Region Access Enable Register for Region 7  
DMA Region Access Enable Register High for Region 7  
QDMA Region Access Enable Register for Region 0  
QDMA Region Access Enable Register for Region 1  
QDMA Region Access Enable Register for Region 2  
QDMA Region Access Enable Register for Region 3  
Reserved  
Q0E0  
Event Queue 0 Entry Register 0  
Q0E1  
Event Queue 0 Entry Register 1  
Q0E2  
Event Queue 0 Entry Register 2  
Q0E3  
Event Queue 0 Entry Register 3  
Q0E4  
Event Queue 0 Entry Register 4  
Q0E5  
Event Queue 0 Entry Register 5  
Q0E6  
Event Queue 0 Entry Register 6  
Q0E7  
Event Queue 0 Entry Register 7  
Q0E8  
Event Queue 0 Entry Register 8  
Q0E9  
Event Queue 0 Entry Register 9  
Q0E10  
Q0E11  
Q0E12  
Q0E13  
Q0E14  
Q0E15  
Event Queue 0 Entry Register 10  
Event Queue 0 Entry Register 11  
Event Queue 0 Entry Register 12  
Event Queue 0 Entry Register 13  
Event Queue 0 Entry Register 14  
Event Queue 0 Entry Register 15  
102  
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SPRS311A–APRIL 2006–REVISED DECEMBER 2006  
Table 7-4. EDMA3 Channel Controller Registers (continued)  
HEX ADDRESS RANGE  
02A0 0440  
02A0 0444  
02A0 0448  
02A0 044C  
02A0 0450  
02A0 0454  
02A0 0458  
02A0 045C  
02A0 0460  
02A0 0464  
02A0 0468  
02A0 046C  
02A0 0470  
02A0 0474  
02A0 0478  
02A0 047C  
02A0 0480  
02A0 0484  
02A0 0488  
02A0 048C  
02A0 0490  
02A0 0494  
02A0 0498  
02A0 049C  
02A0 04A0  
02A0 04A4  
02A0 04A8  
02A0 04AC  
02A0 04B0  
02A0 04B4  
02A0 04B8  
02A0 04BC  
02A0 04C0  
02A0 04C4  
02A0 04C8  
02A0 04CC  
02A0 04D0  
02A0 04D4  
02A0 04D8  
02A0 04DC  
02A0 04E0  
02A0 04E4  
02A0 04E8  
02A0 04EC  
02A0 04F0  
02A0 04F4  
02A0 04F8  
ACRONYM  
Q1E0  
Q1E1  
Q1E2  
Q1E3  
Q1E4  
Q1E5  
Q1E6  
Q1E7  
Q1E8  
Q1E9  
Q1E10  
Q1E11  
Q1E12  
Q1E13  
Q1E14  
Q1E15  
Q2E0  
Q2E1  
Q2E2  
Q2E3  
Q2E4  
Q2E5  
Q2E6  
Q2E7  
Q2E8  
Q2E9  
Q2E10  
Q2E11  
Q2E12  
Q2E13  
Q2E14  
Q2E15  
Q3E0  
Q3E1  
Q3E2  
Q3E3  
Q3E4  
Q3E5  
Q3E6  
Q3E7  
Q3E8  
Q3E9  
Q3E10  
Q3E11  
Q3E12  
Q3E13  
Q3E14  
REGISTER NAME  
Event Queue 1 Entry Register 0  
Event Queue 1 Entry Register 1  
Event Queue 1 Entry Register 2  
Event Queue 1 Entry Register 3  
Event Queue 1 Entry Register 4  
Event Queue 1 Entry Register 5  
Event Queue 1 Entry Register 6  
Event Queue 1 Entry Register 7  
Event Queue 1 Entry Register 8  
Event Queue 1 Entry Register 9  
Event Queue 1 Entry Register 10  
Event Queue 1 Entry Register 11  
Event Queue 1 Entry Register 12  
Event Queue 1 Entry Register 13  
Event Queue 1 Entry Register 14  
Event Queue 1 Entry Register 15  
Event Queue 2 Entry Register 0  
Event Queue 2 Entry Register 1  
Event Queue 2 Entry Register 2  
Event Queue 2 Entry Register 3  
Event Queue 2 Entry Register 4  
Event Queue 2 Entry Register 5  
Event Queue 2 Entry Register 6  
Event Queue 2 Entry Register 7  
Event Queue 2 Entry Register 8  
Event Queue 2 Entry Register 9  
Event Queue 2 Entry Register 10  
Event Queue 2 Entry Register 11  
Event Queue 2 Entry Register 12  
Event Queue 2 Entry Register 13  
Event Queue 2 Entry Register 14  
Event Queue 2 Entry Register 15  
Event Queue 3 Entry Register 0  
Event Queue 3 Entry Register 1  
Event Queue 3 Entry Register 2  
Event Queue 3 Entry Register 3  
Event Queue 3 Entry Register 4  
Event Queue 3 Entry Register 5  
Event Queue 3 Entry Register 6  
Event Queue 3 Entry Register 7  
Event Queue 3 Entry Register 8  
Event Queue 3 Entry Register 9  
Event Queue 3 Entry Register 10  
Event Queue 3 Entry Register 11  
Event Queue 3 Entry Register 12  
Event Queue 3 Entry Register 13  
Event Queue 3 Entry Register 14  
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SPRS311A–APRIL 2006–REVISED DECEMBER 2006  
Table 7-4. EDMA3 Channel Controller Registers (continued)  
HEX ADDRESS RANGE  
02A0 04FC  
ACRONYM  
Q3E15  
-
REGISTER NAME  
Event Queue 3 Entry Register 15  
02A0 0500 - 02A0 051C  
02A0 0520 - 02A0 05FC  
02A0 0600  
Reserved  
-
Reserved  
QSTAT0  
QSTAT1  
QSTAT2  
QSTAT3  
-
Queue Status Register 0  
02A0 0604  
Queue Status Register 1  
02A0 0608  
Queue Status Register 2  
02A0 060C  
Queue Status Register 3  
02A0 0610 - 02A0 061C  
02A0 0620  
Reserved  
QWMTHRA  
-
Queue Watermark Threshold A Register  
Reserved  
02A0 0624 - 02A0 063C  
02A0 0640  
CCSTAT  
-
EDMA3CC Status Register  
Reserved  
02A0 0644 - 02A0 06FC  
02A0 0700 - 02A0 07FC  
02A0 0800  
-
Reserved  
MPFAR  
MPFSR  
MPFCR  
MPPA0  
MPPA1  
MPPA2  
MPPA3  
MPPA4  
MPPA5  
MPPA6  
MPPA7  
-
Memory Protection Fault Address Register  
Memory Protection Fault Status Register  
Memory Protection Fault Command Register  
Memory Protection Page Attribute Register 0  
Memory Protection Page Attribute Register 1  
Memory Protection Page Attribute Register 2  
Memory Protection Page Attribute Register 3  
Memory Protection Page Attribute Register 4  
Memory Protection Page Attribute Register 5  
Memory Protection Page Attribute Register 6  
Memory Protection Page Attribute Register 7  
Reserved  
02A0 0804  
02A0 0808  
02A0 080C  
02A0 0810  
02A0 0814  
02A0 0818  
02A0 081C  
02A0 0820  
02A0 0824  
02A0 0828  
02A0 082C - 02A0 0FFC  
02A0 1000  
ER  
Event Register  
02A0 1004  
ERH  
Event Register High  
02A0 1008  
ECR  
Event Clear Register  
02A0 100C  
ECRH  
ESR  
Event Clear Register High  
Event Set Register  
02A0 1010  
02A0 1014  
ESRH  
CER  
Event Set Register High  
02A0 1018  
Chained Event Register  
02A0 101C  
CERH  
EER  
Chained Event Register High  
Event Enable Register  
02A0 1020  
02A0 1024  
EERH  
EECR  
EECRH  
EESR  
EESRH  
SER  
Event Enable Register High  
Event Enable Clear Register  
Event Enable Clear Register High  
Event Enable Set Register  
Event Enable Set Register High  
Secondary Event Register  
Secondary Event Register High  
Secondary Event Clear Register  
Secondary Event Clear Register High  
Reserved  
02A0 1028  
02A0 102C  
02A0 1030  
02A0 1034  
02A0 1038  
02A0 103C  
SERH  
SECR  
SECRH  
-
02A0 1040  
02A0 1044  
02A0 1048 - 02A0 104C  
02A0 1050  
IER  
Interrupt Enable Register  
02A0 1054  
IERH  
Interrupt Enable High Register  
Interrupt Enable Clear Register  
02A0 1058  
IECR  
104  
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SPRS311A–APRIL 2006–REVISED DECEMBER 2006  
Table 7-4. EDMA3 Channel Controller Registers (continued)  
HEX ADDRESS RANGE  
02A0 105C  
ACRONYM  
REGISTER NAME  
Interrupt Enable Clear High Register  
IECRH  
02A0 1060  
IESR  
Interrupt Enable Set Register  
Interrupt Enable Set High Register  
Interrupt Pending Register  
Interrupt Pending High Register  
Interrupt Clear Register  
Interrupt Clear High Register  
Interrupt Evaluate Register  
Reserved  
02A0 1064  
IESRH  
02A0 1068  
IPR  
02A0 106C  
IPRH  
02A0 1070  
ICR  
02A0 1074  
ICRH  
02A0 1078  
IEVAL  
02A0 107C  
-
02A0 1080  
QER  
QDMA Event Register  
02A0 1084  
QEER  
QDMA Event Enable Register  
QDMA Event Enable Clear Register  
QDMA Event Enable Set Register  
QDMA Secondary Event Register  
QDMA Secondary Event Clear Register  
Reserved  
02A0 1088  
QEECR  
02A0 108C  
QEESR  
02A0 1090  
QSER  
02A0 1094  
QSECR  
02A0 1098 - 02A0 1FFF  
02A0 2000 - 02A0 2097  
02A0 2098 - 02A0 21FF  
02A0 2200 - 02A0 2297  
02A0 2298 - 02A0 23FF  
02A0 2400 - 02A0 2497  
02A0 2498 - 02A0 25FF  
02A0 2600 - 02A0 2697  
02A0 2698 - 02A0 27FF  
02A0 2800 - 02A0 2897  
02A0 2898 - 02A0 29FF  
02A0 2A00 - 02A0 2A97  
02A0 2A98 - 02A0 2BFF  
02A0 2C00 - 02A0 2C97  
02A0 2C98 - 02A0 2DFF  
02A0 2E00 - 02A0 2E97  
02A0 2E98 - 02A0 2FFF  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Shadow Region 0 Channel Registers  
Reserved  
Shadow Region 1 Channel Registers  
Reserved  
Shadow Region 2 Channel Registers  
Reserved  
Shadow Region 3 Channel Registers  
Reserved  
Shadow Region 4 Channel Registers  
Reserved  
Shadow Region 5 Channel Registers  
Reserved  
Shadow Region 6 Channel Registers  
Reserved  
Shadow Region 7 Channel Registers  
Reserved  
Table 7-5. EDMA3 Parameter RAM(1)  
HEX ADDRESS RANGE  
02A0 4000 - 02A0 401F  
02A0 4020 - 02A0 403F  
02A0 4040 - 02A0 405F  
02A0 4060 - 02A0 407F  
02A0 4080 - 02A0 409F  
02A0 40A0 - 02A0 40BF  
02A0 40C0 - 02A0 40DF  
02A0 40E0 - 02A0 40FF  
02A0 4100 - 02A0 411F  
02A0 4120 - 02A0 413F  
ACRONYM  
REGISTER NAME  
-
-
-
-
-
-
-
-
-
-
Parameter Set 0  
Parameter Set 1  
Parameter Set 2  
Parameter Set 3  
Parameter Set 4  
Parameter Set 5  
Parameter Set 6  
Parameter Set 7  
Parameter Set 8  
Parameter Set 9  
(1) The C6454 device has 256 EDMA3 parameter sets total. Each parameter set can be used as a DMA entry, a QDMA entry, or a link  
entry.  
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SPRS311A–APRIL 2006–REVISED DECEMBER 2006  
Table 7-5. EDMA3 Parameter RAM (continued)  
HEX ADDRESS RANGE  
...  
ACRONYM  
REGISTER NAME  
...  
02A0 47E0 - 02A0 47FF  
02A0 4800 - 02A0 481F  
02A0 4820 - 02A0 483F  
...  
-
-
-
Parameter Set 63  
Parameter Set 64  
Parameter Set 65  
...  
02A0 5FC0 - 02A0 5FDF  
02A0 5FE0 - 02A0 5FFF  
-
-
Parameter Set 254  
Parameter Set 255  
Table 7-6. EDMA3 Transfer Controller 0 Registers  
HEX ADDRESS RANGE  
02A2 0000  
ACRONYM  
PID  
REGISTER NAME  
Peripheral Identification Register  
EDMA3TC Configuration Register  
Reserved  
02A2 0004  
TCCFG  
-
02A2 0008 - 02A2 00FC  
02A2 0100  
TCSTAT  
-
EDMA3TC Channel Status Register  
Reserved  
02A2 0104 - 02A2 011C  
02A2 0120  
ERRSTAT  
ERREN  
ERRCLR  
ERRDET  
ERRCMD  
-
Error Register  
02A2 0124  
Error Enable Register  
02A2 0128  
Error Clear Register  
02A2 012C  
Error Details Register  
02A2 0130  
Error Interrupt Command Register  
Reserved  
02A2 0134 - 02A2 013C  
02A2 0140  
RDRATE  
-
Read Rate Register  
02A2 0144 - 02A2 023C  
02A2 0240  
Reserved  
SAOPT  
SASRC  
SACNT  
SADST  
SABIDX  
SAMPPRXY  
SACNTRLD  
SASRCBREF  
SADSTBREF  
-
Source Active Options Register  
Source Active Source Address Register  
Source Active Count Register  
Source Active Destination Address Register  
Source Active Source B-Index Register  
Source Active Memory Protection Proxy Register  
Source Active Count Reload Register  
Source Active Source Address B-Reference Register  
Source Active Destination Address B-Reference Register  
Reserved  
02A2 0244  
02A2 0248  
02A2 024C  
02A2 0250  
02A2 0254  
02A2 0258  
02A2 025C  
02A2 0260  
02A2 0264 - 02A2 027C  
02A2 0280  
DFCNTRLD  
DFSRCBREF  
DFDSTBREF  
-
Destination FIFO Set Count Reload  
Destination FIFO Set Destination Address B Reference Register  
Destination FIFO Set Destination Address B Reference Register  
Reserved  
02A2 0284  
02A2 0288  
02A2 028C - 02A2 02FC  
02A2 0300  
DFOPT0  
DFSRC0  
DFCNT0  
DFDST0  
DFBIDX0  
DFMPPRXY0  
-
Destination FIFO Options Register 0  
Destination FIFO Source Address Register 0  
Destination FIFO Count Register 0  
Destination FIFO Destination Address Register 0  
Destination FIFO BIDX Register 0  
Destination FIFO Memory Protection Proxy Register 0  
Reserved  
02A2 0304  
02A2 0308  
02A2 030C  
02A2 0310  
02A2 0314  
02A2 0318 - 02A2 033C  
02A2 0340  
DFOPT1  
DFSRC1  
Destination FIFO Options Register 1  
Destination FIFO Source Address Register 1  
02A2 0344  
106  
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SPRS311A–APRIL 2006–REVISED DECEMBER 2006  
Table 7-6. EDMA3 Transfer Controller 0 Registers (continued)  
HEX ADDRESS RANGE  
02A2 0348  
ACRONYM  
DFCNT1  
DFDST1  
DFBIDX1  
DFMPPRXY1  
-
REGISTER NAME  
Destination FIFO Count Register 1  
Destination FIFO Destination Address Register 1  
Destination FIFO BIDX Register 1  
Destination FIFO Memory Protection Proxy Register 1  
Reserved  
02A2 034C  
02A2 0350  
02A2 0354  
02A2 0358 - 02A2 037C  
02A2 0380  
DFOPT2  
DFSRC2  
DFCNT2  
DFDST2  
DFBIDX2  
DFMPPRXY2  
-
Destination FIFO Options Register 2  
Destination FIFO Source Address Register 2  
Destination FIFO Count Register 2  
Destination FIFO Destination Address Register 2  
Destination FIFO BIDX Register 2  
Destination FIFO Memory Protection Proxy Register 2  
Reserved  
02A2 0384  
02A2 0388  
02A2 038C  
02A2 0390  
02A2 0394  
02A2 0398 - 02A2 03BC  
02A2 03C0  
DFOPT3  
DFSRC3  
DFCNT3  
DFDST3  
DFBIDX3  
DFMPPRXY3  
-
Destination FIFO Options Register 3  
Destination FIFO Source Address Register 3  
Destination FIFO Count Register 3  
Destination FIFO Destination Address Register 3  
Destination FIFO BIDX Register 3  
Destination FIFO Memory Protection Proxy Register 3  
Reserved  
02A2 03C4  
02A2 03C8  
02A2 03CC  
02A2 03D0  
02A2 03D4  
02A2 03D8 - 02A2 7FFF  
Table 7-7. EDMA3 Transfer Controller 1 Registers  
HEX ADDRESS RANGE  
02A2 8000  
ACRONYM  
PID  
REGISTER NAME  
Peripheral Identification Register  
EDMA3TC Configuration Register  
Reserved  
02A2 8004  
TCCFG  
-
02A2 8008 - 02A2 80FC  
02A2 8100  
TCSTAT  
-
EDMA3TC Channel Status Register  
Reserved  
02A2 8104 - 02A2 811C  
02A2 8120  
ERRSTAT  
ERREN  
ERRCLR  
ERRDET  
ERRCMD  
-
Error Register  
02A2 8124  
Error Enable Register  
02A2 8128  
Error Clear Register  
02A2 812C  
Error Details Register  
02A2 8130  
Error Interrupt Command Register  
Reserved  
02A2 8134 - 02A2 813C  
02A2 8140  
RDRATE  
-
Read Rate Register  
02A2 8144 - 02A2 823C  
02A2 8240  
Reserved  
SAOPT  
SASRC  
SACNT  
SADST  
SABIDX  
SAMPPRXY  
SACNTRLD  
SASRCBREF  
SADSTBREF  
-
Source Active Options Register  
Source Active Source Address Register  
Source Active Count Register  
Source Active Destination Address Register  
Source Active Source B-Index Register  
Source Active Memory Protection Proxy Register  
Source Active Count Reload Register  
Source Active Source Address B-Reference Register  
Source Active Destination Address B-Reference Register  
Reserved  
02A2 8244  
02A2 8248  
02A2 824C  
02A2 8250  
02A2 8254  
02A2 8258  
02A2 825C  
02A2 8260  
02A2 8264 - 02A2 827C  
02A2 8280  
DFCNTRLD  
Destination FIFO Set Count Reload  
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Table 7-7. EDMA3 Transfer Controller 1 Registers (continued)  
HEX ADDRESS RANGE  
02A2 8284  
ACRONYM  
DFSRCBREF  
DFDSTBREF  
-
REGISTER NAME  
Destination FIFO Set Destination Address B Reference Register  
Destination FIFO Set Destination Address B Reference Register  
Reserved  
02A2 8288  
02A2 828C - 02A2 82FC  
02A2 8300  
DFOPT0  
DFSRC0  
DFCNT0  
DFDST0  
DFBIDX0  
DFMPPRXY0  
-
Destination FIFO Options Register 0  
Destination FIFO Source Address Register 0  
Destination FIFO Count Register 0  
Destination FIFO Destination Address Register 0  
Destination FIFO BIDX Register 0  
02A2 8304  
02A2 8308  
02A2 830C  
02A2 8310  
02A2 8314  
Destination FIFO Memory Protection Proxy Register 0  
Reserved  
02A2 8318 - 02A2 833C  
02A2 8340  
DFOPT1  
DFSRC1  
DFCNT1  
DFDST1  
DFBIDX1  
DFMPPRXY1  
-
Destination FIFO Options Register 1  
Destination FIFO Source Address Register 1  
Destination FIFO Count Register 1  
Destination FIFO Destination Address Register 1  
Destination FIFO BIDX Register 1  
02A2 8344  
02A2 8348  
02A2 834C  
02A2 8350  
02A2 8354  
Destination FIFO Memory Protection Proxy Register 1  
Reserved  
02A2 8358 - 02A2 837C  
02A2 8380  
DFOPT2  
DFSRC2  
DFCNT2  
DFDST2  
DFBIDX2  
DFMPPRXY2  
-
Destination FIFO Options Register 2  
Destination FIFO Source Address Register 2  
Destination FIFO Count Register 2  
Destination FIFO Destination Address Register 2  
Destination FIFO BIDX Register 2  
02A2 8384  
02A2 8388  
02A2 838C  
02A2 8390  
02A2 8394  
Destination FIFO Memory Protection Proxy Register 2  
Reserved  
02A2 8398 - 02A2 83BC  
02A2 83C0  
DFOPT3  
DFSRC3  
DFCNT3  
DFDST3  
DFBIDX3  
DFMPPRXY3  
-
Destination FIFO Options Register 3  
Destination FIFO Source Address Register 3  
Destination FIFO Count Register 3  
Destination FIFO Destination Address Register 3  
Destination FIFO BIDX Register 3  
02A2 83C4  
02A2 83C8  
02A2 83CC  
02A2 83D0  
02A2 83D4  
Destination FIFO Memory Protection Proxy Register 3  
Reserved  
02A2 83D8 - 02A2 FFFF  
Table 7-8. EDMA3 Transfer Controller 2 Registers  
HEX ADDRESS RANGE  
02A3 0000  
ACRONYM  
PID  
REGISTER NAME  
Peripheral Identification Register  
EDMA3TC Configuration Register  
Reserved  
02A3 0004  
TCCFG  
-
02A3 0008 - 02A3 00FC  
02A3 0100  
TCSTAT  
-
EDMA3TC Channel Status Register  
Reserved  
02A3 0104 - 02A3 011C  
02A3 0120  
ERRSTAT  
ERREN  
ERRCLR  
ERRDET  
ERRCMD  
-
Error Register  
02A3 0124  
Error Enable Register  
Error Clear Register  
Error Details Register  
Error Interrupt Command Register  
Reserved  
02A3 0128  
02A3 012C  
02A3 0130  
02A3 0134 - 02A3 013C  
02A3 0140  
RDRATE  
Read Rate Register  
108  
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Table 7-8. EDMA3 Transfer Controller 2 Registers (continued)  
HEX ADDRESS RANGE  
02A3 0144 - 02A3 023C  
02A3 0240  
ACRONYM  
-
REGISTER NAME  
Reserved  
SAOPT  
Source Active Options Register  
02A3 0244  
SASRC  
Source Active Source Address Register  
Source Active Count Register  
02A3 0248  
SACNT  
02A3 024C  
SADST  
Source Active Destination Address Register  
Source Active Source B-Index Register  
Source Active Memory Protection Proxy Register  
Source Active Count Reload Register  
Source Active Source Address B-Reference Register  
Source Active Destination Address B-Reference Register  
Reserved  
02A3 0250  
SABIDX  
SAMPPRXY  
SACNTRLD  
SASRCBREF  
SADSTBREF  
-
02A3 0254  
02A3 0258  
02A3 025C  
02A3 0260  
02A3 0264 - 02A3 027C  
02A3 0280  
DFCNTRLD  
DFSRCBREF  
DFDSTBREF  
-
Destination FIFO Set Count Reload  
Destination FIFO Set Destination Address B Reference Register  
Destination FIFO Set Destination Address B Reference Register  
Reserved  
02A3 0284  
02A3 0288  
02A3 028C - 02A3 02FC  
02A3 0300  
DFOPT0  
DFSRC0  
DFCNT0  
DFDST0  
DFBIDX0  
DFMPPRXY0  
-
Destination FIFO Options Register 0  
Destination FIFO Source Address Register 0  
Destination FIFO Count Register 0  
02A3 0304  
02A3 0308  
02A3 030C  
Destination FIFO Destination Address Register 0  
Destination FIFO BIDX Register 0  
02A3 0310  
02A3 0314  
Destination FIFO Memory Protection Proxy Register 0  
Reserved  
02A3 0318 - 02A3 033C  
02A3 0340  
DFOPT1  
DFSRC1  
DFCNT1  
DFDST1  
DFBIDX1  
DFMPPRXY1  
-
Destination FIFO Options Register 1  
Destination FIFO Source Address Register 1  
Destination FIFO Count Register 1  
02A3 0344  
02A3 0348  
02A3 034C  
Destination FIFO Destination Address Register 1  
Destination FIFO BIDX Register 1  
02A3 0350  
02A3 0354  
Destination FIFO Memory Protection Proxy Register 1  
Reserved  
02A3 0358 - 02A3 037C  
02A3 0380  
DFOPT2  
DFSRC2  
DFCNT2  
DFDST2  
DFBIDX2  
DFMPPRXY2  
-
Destination FIFO Options Register 2  
Destination FIFO Source Address Register 2  
Destination FIFO Count Register 2  
02A3 0384  
02A3 0388  
02A3 038C  
Destination FIFO Destination Address Register 2  
Destination FIFO BIDX Register 2  
02A3 0390  
02A3 0394  
Destination FIFO Memory Protection Proxy Register 2  
Reserved  
02A3 0398 - 02A3 03BC  
02A3 03C0  
DFOPT3  
DFSRC3  
DFCNT3  
DFDST3  
DFBIDX3  
DFMPPRXY3  
-
Destination FIFO Options Register 3  
Destination FIFO Source Address Register 3  
Destination FIFO Count Register 3  
02A3 03C4  
02A3 03C8  
02A3 03CC  
Destination FIFO Destination Address Register 3  
Destination FIFO BIDX Register 3  
02A3 03D0  
02A3 03D4  
Destination FIFO Memory Protection Proxy Register 3  
Reserved  
02A3 03D8 - 02A3 7FFF  
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Table 7-9. EDMA3 Transfer Controller 3 Registers  
HEX ADDRESS RANGE  
02A3 8000  
ACRONYM  
PID  
REGISTER NAME  
Peripheral Identification Register  
EDMA3TC Configuration Register  
Reserved  
02A3 8004  
TCCFG  
-
02A3 8008 - 02A3 80FC  
02A3 8100  
TCSTAT  
-
EDMA3TC Channel Status Register  
Reserved  
02A3 8104 - 02A3 811C  
02A3 8120  
ERRSTAT  
ERREN  
ERRCLR  
ERRDET  
ERRCMD  
-
Error Register  
02A3 8124  
Error Enable Register  
02A3 8128  
Error Clear Register  
02A3 812C  
Error Details Register  
02A3 8130  
Error Interrupt Command Register  
Reserved  
02A3 8134 - 02A3 813C  
02A3 8140  
RDRATE  
-
Read Rate Register  
02A3 8144 - 02A3 823C  
02A3 8240  
Reserved  
SAOPT  
SASRC  
SACNT  
SADST  
SABIDX  
SAMPPRXY  
SACNTRLD  
SASRCBREF  
SADSTBREF  
-
Source Active Options Register  
Source Active Source Address Register  
Source Active Count Register  
02A3 8244  
02A3 8248  
02A3 824C  
Source Active Destination Address Register  
Source Active Source B-Index Register  
Source Active Memory Protection Proxy Register  
Source Active Count Reload Register  
Source Active Source Address B-Reference Register  
Source Active Destination Address B-Reference Register  
Reserved  
02A3 8250  
02A3 8254  
02A3 8258  
02A3 825C  
02A3 8260  
02A3 8264 - 02A3 827C  
02A3 8280  
DFCNTRLD  
DFSRCBREF  
DFDSTBREF  
-
Destination FIFO Set Count Reload  
Destination FIFO Set Destination Address B Reference Register  
Destination FIFO Set Destination Address B Reference Register  
Reserved  
02A3 8284  
02A3 8288  
02A3 828C - 02A3 82FC  
02A3 8300  
DFOPT0  
DFSRC0  
DFCNT0  
DFDST0  
DFBIDX0  
DFMPPRXY0  
-
Destination FIFO Options Register 0  
Destination FIFO Source Address Register 0  
Destination FIFO Count Register 0  
Destination FIFO Destination Address Register 0  
Destination FIFO BIDX Register 0  
Destination FIFO Memory Protection Proxy Register 0  
Reserved  
02A3 8304  
02A3 8308  
02A3 830C  
02A3 8310  
02A3 8314  
02A3 8318 - 02A3 833C  
02A3 8340  
DFOPT1  
DFSRC1  
DFCNT1  
DFDST1  
DFBIDX1  
DFMPPRXY1  
-
Destination FIFO Options Register 1  
Destination FIFO Source Address Register 1  
Destination FIFO Count Register 1  
Destination FIFO Destination Address Register 1  
Destination FIFO BIDX Register 1  
Destination FIFO Memory Protection Proxy Register 1  
Reserved  
02A3 8344  
02A3 8348  
02A3 834C  
02A3 8350  
02A3 8354  
02A3 8358 - 02A3 837C  
02A3 8380  
DFOPT2  
DFSRC2  
DFCNT2  
DFDST2  
DFBIDX2  
Destination FIFO Options Register 2  
Destination FIFO Source Address Register 2  
Destination FIFO Count Register 2  
Destination FIFO Destination Address Register 2  
Destination FIFO BIDX Register 2  
02A3 8384  
02A3 8388  
02A3 838C  
02A3 8390  
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Table 7-9. EDMA3 Transfer Controller 3 Registers (continued)  
HEX ADDRESS RANGE  
02A3 8394  
ACRONYM  
DFMPPRXY2  
-
REGISTER NAME  
Destination FIFO Memory Protection Proxy Register 2  
Reserved  
02A3 8398 - 02A3 83BC  
02A3 83C0  
DFOPT3  
DFSRC3  
DFCNT3  
DFDST3  
DFBIDX3  
DFMPPRXY3  
-
Destination FIFO Options Register 3  
Destination FIFO Source Address Register 3  
Destination FIFO Count Register 3  
Destination FIFO Destination Address Register 3  
Destination FIFO BIDX Register 3  
Destination FIFO Memory Protection Proxy Register 3  
Reserved  
02A3 83C4  
02A3 83C8  
02A3 83CC  
02A3 83D0  
02A3 83D4  
02A3 83D8 - 02A3 FFFF  
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7.5 Interrupts  
7.5.1 Interrupt Sources and Interrupt Controller  
The CPU interrupts on the C6454 device are configured through the C64x+ Megamodule Interrupt  
Controller. The interrupt controller allows for up to 128 system events to be programmed to any of the  
twelve CPU interrupt inputs, the CPU exception input, or the advanced emulation logic. Table 8-4 shows  
the mapping of system events to the interrupt controller inputs. Event numbers 0-31 correspond to the  
default interrupt mapping of the device. The remaining events must be mapped using software.  
For more information on the Interrupt Controller, see the TMS320C64x+ Megamodule Reference Guide  
(literature number SPRU871).  
Table 7-10. C6454 DSP Interrupts  
EVENT NUMBER  
INTERRUPT EVENT  
EVT0  
INTERRUPT SOURCE  
0(1)  
1(1)  
2(1)  
Interrupt Controller output of event combiner 0, for events 1 - 31.  
Interrupt Controller output of event combiner 1, for events 32 - 63.  
Interrupt Controller output of event combiner 2, for events 64 - 95.  
Interrupt Controller output of event combiner 3, for events 96 - 127.  
EVT1  
EVT2  
3(1)  
EVT3  
4 - 8(2)  
Reserved  
Reserved. Do not use.  
EMU interrupt for:  
1. Host scan access  
2. DTDMA transfer complete  
3. AET interrupt  
9(2)  
EMU_DTDMA  
10(2)  
11(2)  
12(2)  
13(2)  
14(2)  
15(2)  
16  
Reserved  
EMU_RTDXRX  
EMU_RTDXTX  
IDMA0  
Reserved. Do not use.  
EMU real-time data exchange (RTDX) receive complete  
EMU RTDX transmit complete  
IDMA channel 0 interrupt  
IDMA channel 1 interrupt  
HPI/PCI-to-DSP interrupt  
I2C interrupt  
IDMA1  
DSPINT  
I2CINT  
17  
MACINT  
AEASYNCERR  
Reserved  
EDMA3CC_GINT  
Reserved  
RINT0  
Ethernet MAC interrupt  
EMIFA error interrupt  
Reserved. Do not use.  
EDMA3 channel global completion interrupt  
Reserved. Do not use.  
McBSP0 receive interrupt  
McBSP0 transmit interrupt  
McBSP1 receive interrupt  
McBSP1 transmit interrupt  
Reserved. Do not use.  
GPIO interrupt  
18  
19 - 23  
24  
25 - 39  
40  
41  
XINT0  
42  
RINT1  
43  
XINT1  
44 - 50  
51  
Reserved  
GPINT0  
52  
GPINT1  
GPIO interrupt  
53  
GPINT2  
GPIO interrupt  
54  
GPINT3  
GPIO interrupt  
55  
GPINT4  
GPIO interrupt  
56  
GPINT5  
GPIO interrupt  
57  
GPINT6  
GPIO interrupt  
58  
GPINT7  
GPIO interrupt  
(1) Interrupts 0 through 3 are non-maskable and fixed.  
(2) Interrupts 4 through 15 are programmable by modifying the binary selector values in the Interrupt Selector Control registers fields.  
shows the default interrupt sources for Interrupts 4 through 15.  
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Table 7-10. C6454 DSP Interrupts (continued)  
EVENT NUMBER  
INTERRUPT EVENT  
GPINT8  
INTERRUPT SOURCE  
59  
60  
GPIO interrupt  
GPIO interrupt  
GPIO interrupt  
GPIO interrupt  
GPIO interrupt  
GPIO interrupt  
GPIO interrupt  
GPIO interrupt  
GPINT9  
61  
GPINT10  
62  
GPINT11  
63  
GPINT12  
64  
GPINT13  
65  
GPINT14  
66  
GPINT15  
67  
TINTLO0  
Timer 0 lower counter interrupt  
Timer 0 higher counter interrupt  
Timer 1 lower counter interrupt  
Timer 1 higher counter interrupt  
EDMA3CC completion interrupt - Mask0  
EDMA3CC completion interrupt - Mask1  
EDMA3CC completion interrupt - Mask2  
EDMA3CC completion interrupt - Mask3  
EDMA3CC completion interrupt - Mask4  
EDMA3CC completion interrupt - Mask5  
EDMA3CC completion interrupt - Mask6  
EDMA3CC completion interrupt - Mask7  
EDMA3CC error interrupt  
68  
TINTHI0  
69  
TINTLO1  
70  
TINTHI1  
71  
EDMA3CC_INT0  
EDMA3CC_INT1  
EDMA3CC_INT2  
EDMA3CC_INT3  
EDMA3CC_INT4  
EDMA3CC_INT5  
EDMA3CC_INT6  
EDMA3CC_INT7  
EDMA3CC_ERRINT  
Reserved  
72  
73  
74  
75  
76  
77  
78  
79  
80  
Reserved. Do not use.  
81  
EDMA3TC0_ERRINT  
EDMA3TC1_ERRINT  
EDMA3TC2_ERRINT  
EDMA3TC3_ERRINT  
Reserved  
EDMA3TC0 error interrupt  
82  
EDMA3TC1 error interrupt  
83  
EDMA3TC2 error interrupt  
84  
EDMA3TC3 error interrupt  
85  
Reserved. Do not use.  
86 - 95  
96  
Reserved  
Reserved. Do not use.  
INTERR  
Interrupt Controller dropped CPU interrupt event  
EMC invalid IDMA parameters  
Reserved. Do not use.  
97  
EMC_IDMAERR  
Reserved  
98  
99  
Reserved  
Reserved. Do not use.  
100  
101  
102 - 111  
112  
113  
114 - 115  
116  
117  
118  
119  
120  
121  
122  
123  
124  
EFIINTA  
EFI interrupt from side A  
EFIINTB  
EFI interrupt from side B  
Reserved  
Reserved. Do not use.  
Reserved  
Reserved. Do not use.  
L1P_ED1  
L1P single bit error detected during DMA read  
Reserved. Do not use.  
Reserved  
L2_ED1  
L2 single bit error detected  
L2_ED2  
L2 two bit error detected  
PDC_INT  
Powerdown sleep interrupt  
Reserved  
Reserved. Do not use.  
L1P_CMPA  
L1P_DMPA  
L1D_CMPA  
L1D_DMPA  
L2_CMPA  
L1P CPU memory protection fault  
L1P DMA memory protection fault  
L1D CPU memory protection fault  
L1D DMA memory protection fault  
L2 CPU memory protection fault  
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Table 7-10. C6454 DSP Interrupts (continued)  
EVENT NUMBER  
INTERRUPT EVENT  
L2_DMPA  
INTERRUPT SOURCE  
L2 DMA memory protection fault  
125  
126  
127  
IDMA_CMPA  
IDMA CPU memory protection fault  
IDMA bus error interrupt  
IDMA_BUSERR  
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7.5.2 External Interrupts Electrical Data/Timing  
Table 7-11. Timing Requirements for External Interrupts(1) (see Figure 7-6)  
-720  
-850  
-1000  
NO.  
UNIT  
MIN  
MAX  
1
2
tw(NMIL)  
tw(NMIH)  
Width of the NMI interrupt pulse low  
Width of the NMI interrupt pulse high  
6P  
6P  
ns  
ns  
(1) P = 1/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use P = 1 ns.  
2
1
NMI  
Figure 7-6. NMI Interrupt Timing  
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7.6 Reset Controller  
The reset controller detects the different type of resets supported on the C6454 device and manages the  
distribution of those resets throughout the device.  
The C6454 device has several types of resets: power-on reset, warm reset, system reset, and CPU reset.  
Table 7-12 explains further the types of reset, the reset initiator, and the effects of each reset on the chip.  
For more information on the effects of each reset on the PLL controllers and their clocks, see  
Section 7.6.7, Reset Electrical Data/Timing.  
Table 7-12. Reset Types  
TYPE  
INITIATOR  
EFFECT(s)  
Power-on Reset  
POR pin  
Resets the entire chip including the test and emulation logic.  
Resets everything except for the test and emulation logic and PLL2.  
Emulator stays alive during Warm Reset.  
Warm Reset  
RESET pin  
A system reset maintains memory contents and does not reset the  
test and emulation circuitry. The device configuration pins are also  
not re-latched and the state of the peripherals is also not affected.(1)  
System Reset  
Emulator  
HPI/PCI  
CPU Local Reset  
CPU local reset.  
(1) On the C6454 device, peripherals can be in one of several states. These states are listed in Table 3-4.  
7.6.1 Power-on Reset (POR Pin)  
Power-on Reset is initiated by the POR pin and is used to reset the entire chip, including the test and  
emulation logic. Power-on Reset is also referred to as a cold reset since the device usually goes through a  
power-up cycle. During power-up, the POR pin must be asserted (driven low) until the power supplies  
have reached their normal operating conditions. Note that a device power-up cycle is not required to  
initiate a Power-on Reset.  
The following sequence must be followed during a Power-on Reset:  
1. Wait for all power supplies to reach normal operating conditions while keeping the POR pin asserted  
(driven low).  
While POR is asserted, all pins will be set to high-impedance. After the POR pin is deasserted (driven  
high), all Z group pins, low group pins, and high group pins are set to their reset state and will remain  
at their reset state until the otherwise configured by their respective peripheral. All peripherals, except  
those selected for boot purposes, are disabled after a Power-on Reset and must be enabled through  
the Device State Control registers; for more details, see Section 3.3, Peripheral Selection After Device  
Reset.  
2. Once all the power supplies are within valid operating conditions, the POR pin must remain asserted  
(low) for a minimum of 256 CLKIN2 cycles. The PLL1 controller input clock, CLKIN1, and the PCI input  
clock, PCLK, must also be valid during this time. PCLK is only needed if the PCI module is being used.  
If the DDR2 memory controller and the EMAC peripheral are not needed, CLKIN2 can be tied low and,  
in this case, the POR pin must remain asserted (low) for a minimum of 256 CLKIN1 cycles after all  
power supplies have reached valid operating conditions.  
Within the low period of the POR pin, the following happens:  
–
The reset signals flow to the entire chip (including the test and emulation logic), resetting modules  
that use reset asynchronously.  
–
The PLL1 controller clocks are started at the frequency of the system reference clock. The clocks  
are propagated throughout the chip to reset modules that use reset synchronously. By default,  
PLL1 is in reset and unlocked.  
–
The PLL2 controller clocks are started at the frequency of the system reference clock. PLL2 is held  
in reset. Since the PLL2 controller always operates in PLL mode, the system reference clock and  
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all the system clocks are invalid at this point.  
The RESETSTAT pin stays asserted (low), indicating the device is in reset.  
•
3. The POR pin may now be deasserted (driven high).  
When the POR pin is deasserted, the configuration pin values are latched and the PLL controllers  
change their system clocks to their default divide-down values. PLL2 is taken out of reset and  
automatically starts its locking sequence. Other device initialization is also started.  
4. After device initialization is complete, the RESETSTAT pin is deasserted (driven high). By this time,  
PLL2 has already completed its locking sequence and is outputting a valid clock. The system clocks of  
both PLL controllers are allowed to finish their current cycles and then paused for 10 cycles of their  
respective system reference clocks. After the pause the system clocks are restarted at their default  
divide-by settings.  
5. The device is now out of reset, device execution begins as dictated by the selected boot mode (see  
Section 2.4, Boot Sequence).  
NOTE  
To most of the device, reset is de-asserted only when the POR and RESET pins are both  
de-asserted (driven high). Therefore, in the sequence described above, if the RESET pin  
is held low past the low period of the POR pin, most of the device will remain in reset. The  
only exception being that PLL2 is taken out of reset as soon as POR is de-asserted  
(driven high), regardless of the state of the RESET pin. The RESET pin should not be tied  
together with the POR pin.  
7.6.2 Warm Reset (RESET Pin)  
A Warm Reset has the same effects as a Power-on Reset, except that in this case, the test and emulation  
logic and PLL2 are not reset.  
The following sequence must be followed during a Warm Reset:  
1. Hold the RESET pin low for a minimum of 24 CLKIN1 cycles. Within the minimum 24 CLKIN1 cycles.  
Within the low period of the RESET pin, the following happens:  
–
The Z group pins, low group pins, and the high group pins are set to their reset state with one  
exception:  
The PCI pins are not affected by warm reset if the PCI module was enabled before RESET went  
low. In this case, PCI pins stay at whatever their value was before RESET went low.  
The reset signals flow to the entire chip (excluding the test and emulation logic), resetting modules  
that use reset asynchronously.  
The PLL1 controller is reset thereby switching back to bypass mode and resetting all its registers to  
their default values. PLL1 is placed in reset and loses lock. The PLL1 controller clocks start running  
at the frequency of the system reference clock. The clocks are propagated throughout the chip to  
reset modules that use reset synchronously.  
–
–
–
–
The PLL2 controller is reset thereby resetting all its registers to their default values. The PLL2  
controller clocks start running at the frequency of the system reference clock. PLL2 is not reset,  
therefore it remains locked.  
The RESETSTAT pin becomes active (low), indicating the device is in reset.  
2. The RESET pin may now be released (driven inactive high).  
When the RESET pin is released, the configuration pin values are latched and the PLL controllers  
immediately change their system clocks to their default divide-down values. Other device initialization  
is also started.  
3. After device initialization is complete, the RESETSTAT pin goes inactive (high). All system clocks are  
allowed to finish their current cycles and then paused for 10 cycles of their respective system reference  
clocks. After the pause the system clocks are restarted at their default divide-by settings.  
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4. The device is now out of reset, device execution begins as dictated by the selected boot mode (see  
Section 2.4, Boot Sequence).  
NOTE  
The POR pin should be held inactive (high) throughout the Warm Reset sequence.  
Otherwise, if POR is activated (brought low), the minimum POR pulse width must be met.  
The RESET pin should not be tied together with the POR pin.  
7.6.3 System Reset  
A System Reset is initiated by the emulator via the C64x+ emulation logic. This reset can be masked by  
the emulator.  
The following memory contents are maintained during a System Reset:  
•
DDR2 Memory Controller: The DDR2 Memory Controller registers are not reset. In addition, the DDR2  
SDRAM memory content is retained if the user places the DDR2 SDRAM in self-refresh mode before  
invoking the System Reset.  
•
EMIFA: The contents of the memory connected to the EMIFA are retained. The EMIFA registers are  
not reset.  
Test, emulation, and clock logic are unaffected. The device configuration pins are also not re-latched and  
the state of the peripherals (see Table 3-4) is not affected.  
During a System Reset, the following happens:  
1. The System Reset is initiated by the emulator.  
During this time, the following happens:  
–
–
–
The reset signals flow to the entire chip resetting all the modules on chip except the test and  
emulation logic.  
The PLL controllers are not reset. Internal system clocks are unaffected. If PLL1/PLL2 were locked  
before the System Reset, they remain locked.  
The RESETSTAT pin goes low to indicate an internal reset is being generated.  
2. After device initialization is complete, the RESETSTAT pin is deasserted (driven high). In addition, the  
PLL controllers pause their system clocks for about 10 cycles.  
At this point:  
–
The state of the peripherals before the System Reset is not changed. For example, if McBSP0 was  
in the enabled state before System Reset, it will remain in the enabled state after System Reset.  
The I/O pins are controlled as dictated by the DEVSTAT register.  
The DDR2 Memory Controller and EMIFA registers retain their previous values. Only the DDR2  
Memory Controller and EMIFA state machines are reset by the System Reset.  
The PLL controllers are operating in the mode prior to System Reset. System clocks are  
unaffected.  
–
–
–
The boot sequence is started after the system clocks are restarted. Since the configuration pins (including  
the BOOTMODE[3:0] pins) are not latched with a System Reset, the previous values, as shown in the  
DEVSTAT register, are used to select the boot mode.  
7.6.4 CPU Reset  
A CPU Reset is initiated by the HPI or PCI peripheral. This reset only affects the CPU. During a  
PCI-initiated CPU Reset, the PCI pins are set to their reset state. With the exception of the HRDY/PIRDY  
pin, the PCI pins have a reset state of high-impedance; the HRDY/PIRDY pin goes high during reset.  
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7.6.5 Reset Priority  
If any of the above reset sources occur simultaneously, the PLLCTRL only processes the highest priority  
reset request. The rest request priorities are as follows (high to low):  
•
•
•
•
•
Power-on Reset  
Maximum Reset  
Warm Reset  
System Reset  
CPU Reset  
7.6.6 Reset Controller Register  
The reset type status (RSTYPE) register (029A 00E4) is the only register for the reset controller. This  
register falls in the same memory range as the PLL1 controller registers [029A 0000 - 029A 01FF] (see  
Table 7-18).  
7.6.6.1 Reset Type Status Register Description  
The rest type status (RSTYPE) register latches the cause of the last reset. If multiple reset sources occur  
simultaneously, this register latches the highest priority reset source. The reset type status register is  
shown in Figure 7-7 and described in Table 7-13.  
31  
15  
16  
Reserved  
R-0  
4
3
2
1
0
Reserved  
R-0  
SRST Rsvd WRST POR  
R-0 R-0 R-0 R-0  
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset  
Figure 7-7. Reset Type Status Register (RSTYPE) [Hex Address: 029A 00E4]  
Table 7-13. Reset Type Status Register (RSTYPE) Field Descriptions  
Bit  
31:4  
3
Field  
Value Description  
Reserved  
SRST  
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.  
System reset.  
0
1
System Reset was not the last reset to occur.  
System Reset was the last reset to occur.  
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.  
Warm reset.  
2
1
Reserved  
WRST  
0
1
Warm Reset was not the last reset to occur.  
Warm Reset was the last reset to occur.  
0
POR  
Power-on reset.  
0
1
Power-on Reset was not the last reset to occur.  
Power-on Reset was the last reset to occur.  
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7.6.7 Reset Electrical Data/Timing  
NOTE  
If a configuration pin must be routed out from the device and 3-stated (not driven), the  
internal pullup/pulldown (IPU/IPD) resistor should not be relied upon; TI recommends the  
use of an external pullup/pulldown resistor. For more detailed information on  
pullup/pulldown resistors and situations where external pullup/pulldown resistors are  
required, see Section 3.7, Pullup/Pulldown Resistors.  
Table 7-14. Timing Requirements for Reset(1)(2)(3)(see Figure 7-8 and Figure 7-9)  
-720  
-850  
-1000  
NO.  
UNIT  
MIN  
MAX  
5
6
tw(POR)  
Pulse duration, POR low  
256D(4)  
ns  
ns  
tw(RESET)  
Pulse duration, RESET low  
24C  
Setup time, boot mode and configuration pins valid before POR high or  
RESET high(5)  
7
8
tsu(boot)  
th(boot)  
6P  
6P  
ns  
ns  
Hold time, boot mode and configuration pins valid after POR high or  
RESET high(5)  
(1) C = 1/CLKIN1 clock frequency in ns.  
(2) D = 1/CLKIN2 clock frequency in ns.  
(3) P = 1/CPU clock frequency in nanoseconds (ns). Note that after power-on reset and warm reset the CPU frequency is equal to the  
CLKIN1 frequency divided by three due to the PLL1 controller being reset (see Section 7.6, Reset Controller).  
(4) If CLKIN2 is not used, tw(POR) must be measured in terms of CLKIN1 cycles; otherwise, use CLKIN2 cycles.  
(5) AEA[19:0], ABA[1:0], and PCI_EN are the boot configuration pins during device reset.  
Table 7-15. Switching Characteristics Over Recommended Operating Conditions During Reset(1)  
(see Figure 7-9)  
-720  
-850  
-1000  
NO.  
PARAMETER  
UNIT  
MIN  
MAX  
9
td(PORH-RSTATH)  
Delay time, POR high AND RESET high to RESETSTAT high  
15000C  
ns  
(1) C = 1/CLKIN1 clock frequency in ns.  
For Figure 7-8, note the following:  
•
Z group consists of: all I/O/Z and O/Z pins, except for Low and High group pins. Pins become high  
impedance as soon as their respective power supply has reached normal operating coditions. Pins  
remain in high impedance until configured otherwise by their respective peripheral.  
•
Low group consists of: MTXD0/RMTXD0, MTXD1/RMTXD1, MTXD2/RMTXD2, MTXD3/RMTXD3,  
MTXD4/RMTXD4, MTXEN/RMTXEN, and ABUSREQ. Pins become low as soon as their respective  
power supply has reached normal operating conditions. Pins remain low until configured otherwise by  
their respective peripheral.  
•
High group consists of: AHOLD and HRDY/PIRDY. Pins become high as soon as their respective  
power supply has reached normal operating conditions. Pins remain high until configured otherwise by  
their respective peripheral.  
•
•
All peripherals must be enable through software following a Power-on Reset; for more details, see  
Section 7.6.1, Power-on Reset.  
For power-supply sequence requirements, see Section 7.3.1, Power-Supply Sequencing.  
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Power Supplies Ramping  
Power Supplies Stable  
CLKIN1  
PCLK  
POR  
5
RESET  
9
RESETSTAT  
SYSREFCLK (PLL1C)  
SYSCLK2  
SYSCLK3  
SYSCLK4  
SYSCLK5  
AECLKOUT (Internal)  
7
Boot and Device  
Configuration Pins  
8
High-Z  
Z Group  
Low Group  
High Group  
Undefined  
Undefined  
Undefined  
Low  
High  
CLKIN2  
Undefined  
Internal Reset PLL2C  
SYSREFCLK (PLL2C)  
SYSCLK1 (PLL2C)  
(A)  
Undefined  
Undefined  
PLL2 Locked  
PLL2 Unlocked  
PLL2 Unlocked  
(B)  
Clock Valid  
Clock Valid  
A. SYSREFCLK of the PLL2 controller runs at CLKIN2 ×10.  
B. SYSCLK1 of PLL2 controller runs at SYSREFCLK/2 (default).  
C. Power supplies, CLKIN1, CLKIN2 (if used), and PCLK (if used) must be stable before the start of tw(POR)  
.
Figure 7-8. Power-Up Timing  
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CLKIN1  
CLKIN2  
POR  
6
(A)(B)  
RESET  
9
RESETSTAT  
7
8
Boot and  
(C)  
Device Configuration Pins  
A. RESET should only be used after device has been powered up. For more details on the use of the RESET pin, see  
Section 7.6, Reset Controller.  
B. A reset signal is generated internally during a Warm Reset. This internal reset signal has the same effect as the  
RESET pin during a Warm Reset.  
C. Boot and Device Configurations Inputs (during reset) include: AEA[19:0], ABA[1:0], and PCI_EN.  
Figure 7-9. Warm Reset Timing  
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7.7 PLL1 and PLL1 Controller  
The primary PLL controller generates the input clock to the C64x+ megamodule (including the CPU) as  
well as most of the system peripherals such as the multichannel buffered serial ports (McBSPs) and the  
external memory interface (EMIF).  
As shown in Figure 7-10, the PLL1 controller features a software-programmable PLL multiplier controller  
(PLLM) and five dividers (PREDIV, D2, D3, D4, and D5). The PLL1 controller uses the device input clock  
CLKIN1 to generate a system reference clock (SYSREFCLK) and four system clocks (SYSCLK2,  
SYSCLK3, SYSCLK4, and SYSCLK5).  
PLL1 power is supplied externally via the PLL1 power-supply pin (PLLV1). An external EMI filter circuit  
must be added to PLLV1, as shown in Figure 7-10. The 1.8-V supply of the EMI filter must be from the  
same 1.8-V power plane supplying the I/O power-supply pin, DVDD18. TI requires EMI filter manufacturer  
Murata, part number NFM18CC222R1C3.  
All PLL external components (C1, C2, and the EMI Filter) must be placed as close to the C64x+ DSP  
device as possible. For the best performance, TI recommends that all the PLL external components be on  
a single side of the board without jumpers, switches, or components other than the ones shown. For  
reduced PLL jitter, maximize the spacing between switching signals and the PLL external components  
(C1, C2, and the EMI Filter).  
The minimum CLKIN1 rise and fall times should also be observed. For the input clock timing  
requirements, see Section 7.7.4, PLL1 Controller Input and Output Clock Electrical Data/Timing.  
CAUTION  
The PLL controller module as described in the TMS320C645x DSP  
Software-Programmable Phase-Locked Loop (PLL) Controller User's Guide (literature  
number SPRUE56) includes a superset of features, some of which are not supported  
on the C6454 DSP. The following sections describe the features that are supported; it  
should be assumed that any feature not included in these sections is not supported  
by the C6454 DSP.  
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TMS320C6454 DSP  
+1.8 V  
PLLV1  
C2  
C1  
EMI Filter  
560 pF 0.1 mF  
PLL1 Controller  
PLL1  
PLLEN (PLLCTL.[0])  
SYSREFCLK  
DIVIDER PREDIV  
/1, /2, /3  
(B)  
CLKIN1  
(C64x+ MegaModule)  
PLLM  
(A)  
DIVIDER D2  
x1, x15,  
x20, x25,  
x30, x32  
1
0
ENA  
SYSCLK2  
/3  
PREDEN (PREDIV.[15])  
(A)  
DIVIDER D3  
SYSCLK3  
SYSCLK4  
/6  
DIVIDER D4  
/2, /4,  
..., /16  
ENA  
(Internal EMIF Clock Input)  
D4EN (PLLDIV4.[15])  
D5EN (PLLDIV4.[15])  
DIVIDER D5  
/1, /2,  
..., /8  
ENA  
SYSCLK5  
(Emulation and Trace)  
AECLKIN (External EMIF Clock Input)  
/1, /2,  
..., /8  
GP0  
CLKDIV  
(CTRL.[18:16])  
0
1
1
0
AECLKINSEL  
(AEA[15] pin)  
SYSCLKOUT_EN  
(AEA[4] pin)  
(EMIF Input Clock)  
EMIFA  
AECLKOUT  
GP1/SYSCLK4  
A. DIVIDER D2 and DIVIDER D3 are always enabled.  
B. CLKIN1 is a 3.3-V signal.  
Figure 7-10. PLL1 and PLL1 Controller  
7.7.1 PLL1 Controller Device-Specific Information  
7.7.1.1 Internal Clocks and Maximum Operating Frequencies  
As shown in Figure 7-10, the PLL1 controller generates several internal clocks including the system  
reference clock (SYSREFCLK), and the system clocks (SYSCLK2/3/4/5). The high-frequency clock signal  
SYSREFCLK is directly used to clock the C64x+ megamodule (including the CPU) and also serves as a  
reference clock for the rest of the DSP system.  
Dividers D2, D3, D4, and D5 divide the high-frequency clock SYSREFCLK to generate SYSCLK2,  
SYSCLK3, SYSCLK4, and SYSCLK5, respectively. The system clocks are used to clock different portions  
of the DSP:  
•
SYSCLK2 is used to clock the switched central resources (SCRs), EDMA3, as well as the data bus  
interfaces of the EMIFA and DDR2 Memory Controller.  
•
SYSCLK3 clocks the PCI, HPI, McBSP, GPIO, TIMER, and I2C peripherals, as well as the  
configuration bus of the PLL2 Controller.  
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•
•
SYSCLK4 is used as the internal clock for the EMIFA. It is also used to clock other logic within the  
DSP.  
SYSCLK5 clocks the emulation and trace logic of the DSP.  
The divider ratio bits of dividers D2 and D3 are fixed at ÷3 and ÷6, respectively. The divider ratio bits of  
dividers D4 and 54 are programmable through the PLL controller divider registers PLLDIV4 and PLLDIV5,  
respectively.  
The PLL multiplier controller (PLLM) and the dividers (D4 and D5) must be programmed after reset. There  
is no hardware CLKMODE selection on the C6454 device.  
Since the divider ratio bits for dividers D2 and D3 are fixed, the frequency of SYSCLK2 and SYSCLK3 is  
tied to the frequency of SYSREFCLK. However, the frequency of SYSCLK4 and SYSCLK5 depends on  
the configuration of dividers D4 and D5. For example, with PLLM in the PLL1 multiply control register set  
to 10011b (x20 mode) and a 50 MHz CLKIN1 input, the PLL output PLLOUT is set to 1000 MHz and  
SYSCLK2 and SYSCLK3 run at 333 MHz and 166 MHz, respectively. Divider D4 can be programmed  
through the PLLDIV4 register to divide SYSREFCLK by 10 such that SYSCLK4, and hence the EMIF  
internal clock, runs at 100 MHz.  
All hosts (HPI, PCI, etc.) must hold off accesses to the DSP while the frequency of its internal clocks is  
changing. A mechanism must be in place such that the DSP notifies the host when the PLL configuration  
has completed.  
Note that there is a minimum and maximum operating frequency for PLLREF, PLLOUT, SYSCLK4, and  
SYSCLK5. The PLL1 Controller must not be configured to exceed any of these constraints (certain  
combinations of external clock input, internal dividers, and PLL multiply ratios might not be supported). For  
the PLL clocks input and output frequency ranges, see Table 7-16.  
Table 7-16. PLL1 Clock Frequency Ranges  
CLOCK SIGNAL  
MIN  
MAX  
66.6  
66.6  
1000  
166  
UNIT  
MHz  
MHz  
MHz  
MHz  
MHz  
CLKIN1  
PLLREF (PLLEN = 1)(1)  
PLLOUT(1)  
33.3  
400  
25  
SYSCLK4  
SYSCLK5  
333  
(1) Only applies when the PLL1 Controller is set to PLL mode (PLLEN = 1 in the PLLCTL register).  
7.7.1.2 PLL1 Controller Operating Modes  
The PLL1 controller has two modes of operation: bypass mode and PLL mode. The mode of operation is  
determined by the PLLEN bit of the PLL control register (PLLCTL). In PLL mode, SYSREFCLK is  
generated from the device input clock CLKIN1 using the divider PREDIV and the PLL multiplier PLLM. In  
bypass mode, CLKIN1 is fed directly to SYSREFCLK.  
All hosts (HPI, PCI, etc.) must hold off accesses to the DSP while the frequency of its internal clocks is  
changing. A mechanism must be in place such that the DSP notifies the host when the PLL configuration  
has completed.  
7.7.1.3 PLL1 Stabilization, Lock, and Reset Times  
The PLL stabilization time is the amount of time that must be allotted for the internal PLL regulators to  
become stable after device powerup. The PLL should not be operated until this stabilization time has  
expired.  
The PLL reset time is the amount of wait time needed when resetting the PLL (writing PLLRST = 1), in  
order for the PLL to properly reset, before bringing the PLL out of reset (writing PLLRST = 0). For the  
PLL1 reset time value, see Table 7-17.  
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The PLL lock time is the amount of time needed from when the PLL is taken out of reset (PLLRST = 1  
with PLLEN = 0) to when to when the PLL controller can be switched to PLL mode (PLLEN = 1). The  
PLL1 lock time is given in Table 7-17.  
Table 7-17. PLL1 Stabilization, Lock, and Reset Times  
MIN  
TYP  
MAX  
UNIT  
µs  
PLL stabilization time  
PLL lock time  
150  
2000*C(1)  
ns  
PLL reset time  
128*C(1)  
ns  
(1) C = CLKIN1 cycle time in ns. For example, when CLKIN1 frequency is 50 MHz, use C = 20 ns.  
7.7.2 PLL1 Controller Memory Map  
The memory map of the PLL1 controller is shown in Table 7-18. Note that only registers documented here  
are accessible on the TMS320C6454. Other addresses in the PLL1 controller memory map should not be  
modified.  
Table 7-18. PLL1 Controller Registers (Including Reset Controller)  
HEX ADDRESS RANGE  
029A 0000 - 029A 00E3  
029A 00E4  
ACRONYM  
REGISTER NAME  
-
Reserved  
RSTYPE  
Reset Type Status Register (Reset Controller)  
029A 00E8 - 029A 00FF  
029A 0100  
-
Reserved  
PLLCTL  
PLL Control Register  
Reserved  
029A 0104  
-
029A 0108  
-
Reserved  
029A 010C  
-
Reserved  
029A 0110  
PLLM  
PLL Multiplier Control Register  
PLL Pre-Divider Control Register  
Reserved  
029A 0114  
PREDIV  
029A 0118  
-
029A 011C  
-
Reserved  
029A 0120  
-
Reserved  
029A 0124  
-
Reserved  
029A 0128  
-
Reserved  
029A 012C  
-
Reserved  
029A 0130  
-
Reserved  
029A 0134  
-
Reserved  
029A 0138  
PLLCMD  
PLL Controller Command Register  
PLL Controller Status Register  
PLL Controller Clock Align Control Register  
PLLDIV Ratio Change Status Register  
Reserved  
029A 013C  
PLLSTAT  
029A 0140  
ALNCTL  
029A 0144  
DCHANGE  
029A 0148  
-
029A 014C  
-
Reserved  
029A 0150  
SYSTAT  
SYSCLK Status Register  
Reserved  
029A 0154  
-
029A 0158  
-
Reserved  
029A 015C  
-
Reserved  
029A 0160  
PLLDIV4  
PLLDIV5  
-
PLL Controller Divider 4 Register  
PLL Controller Divider 5 Register  
Reserved  
029A 0164  
029A 0168 - 029B FFFF  
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7.7.3 PLL1 Controller Register Descriptions  
This section provides a description of the PLL1 controller registers. For details on the operation of the PLL  
controller module, see the TMS320C645x DSP Software-Programmable Phase-Locked Loop (PLL)  
Controller User's Guide (literature number SPRUE56).  
NOTE: The PLL1 controller registers can only be accessed using the CPU or the emulator.  
Not all of the registers documented in the TMS320C645x DSP Software-Programmable Phase-Locked  
Loop (PLL) Controller User's Guide (literature number SPRUE56) are supported on the TMS320C6454.  
Only those registers documented in this section are supported. Furthermore, only the bits within the  
registers described here are supported. You should not write to any reserved memory location or change  
the value of reserved bits.  
7.7.3.1 PLL1 Control Register  
The PLL control register (PLLCTL) is shown in Figure 7-11 and described in Table 7-19.  
31  
16  
Reserved  
R-0  
15  
8
7
6
5
4
3
2
1
0
PLL  
PWRDN  
Reserved  
R-0  
Rsvd  
Rsvd  
R-1  
Reserved  
R/W-0  
PLLRST  
R/W-1  
Rsvd  
R-0  
PLLEN  
R/W-0  
R/W-0  
R/W-0  
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset  
Figure 7-11. PLL1 Control Register (PLLCTL) [Hex Address: 029A 0100]  
Table 7-19. PLL1 Control Register (PLLCTL) Field Descriptions  
Bit  
31:8  
7
Field  
Value Description  
Reserved  
Reserved  
Reserved  
Reserved  
PLLRST  
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.  
Reserved. Writes to this register must keep this bit as 0.  
6
Reserved. The reserved bit location is always read as 1. A value written to this field has no effect.  
5:4  
3
Reserved. Writes to this register must keep this bit as 0.  
PLL reset bit  
0
1
PLL reset is released  
PLL reset is asserted  
2
1
Reserved  
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.  
PLLPWRDN  
PLL power-down mode select bit  
0
1
PLL is operational  
PLL is placed in power-down state, i.e., all analog circuitry in the PLL is turned-off  
PLL enable bit  
0
PLLEN  
0
1
Bypass mode. Divider PREDIV and PLL are bypassed. All the system clocks (SYSCLKn) are  
divided down directly from input reference clock.  
PLL mode. Divider PREDIV and PLL are not bypassed. PLL output path is enabled. All the system  
clocks (SYSCLKn) are divided down from PLL output.  
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7.7.3.2 PLL Multiplier Control Register  
The PLL multiplier control register (PLLM) is shown in Figure 7-12 and described in Table 7-20. The PLLM  
register defines the input reference clock frequency multiplier in conjunction with the PLL divider ratio bits  
(RATIO) in the PLL controller pre-divider register (PREDIV).  
31  
15  
16  
Reserved  
R-0  
5
4
0
Reserved  
R-0  
PLLM  
R/W-0h  
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset  
Figure 7-12. PLL Multiplier Control Register (PLLM) [Hex Address: 029A 0110]  
Table 7-20. PLL Multiplier Control Register (PLLM) Field Descriptions  
Bit  
31:5  
4:0  
Field  
Value Description  
Reserved  
PLLM  
0
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.  
PLL multiplier bits. Defines the frequency multiplier of the input reference clock in conjunction with  
the PLL divider ratio bits (RATIO) in PREDIV.  
0h  
Eh  
x1 multiplier rate  
x15 multiplier rate  
x20 multiplier rate  
x25 multiplier rate  
x30 multiplier rate  
x32 multiplier rate  
13h  
18h  
1Dh  
1Fh  
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7.7.3.3 PLL Pre-Divider Control Register  
The PLL pre-divider control register (PREDIV) is shown in Figure 7-13 and described in Table 7-21.  
31  
16  
0
Reserved  
R-0  
15  
14  
5
4
PREDEN  
R/W-1  
Reserved  
R-0  
RATIO  
R/W-2h  
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset  
Figure 7-13. PLL Pre-Divider Control Register (PREDIV) [Hex Address: 029A 0114]  
Table 7-21. PLL Pre-Divider Control Register (PREDIV) Field Descriptions  
Bit  
Field  
Value Description  
31:16 Reserved  
0
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.  
Pre-divider enable bit.  
15  
PREDEN  
0
1
0
Pre-divider is disabled. No clock output.  
Pre-divider is enabled.  
14:5  
4:0  
Reserved  
RATIO  
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.  
0-1Fh Divider ratio bits.  
0
÷1. Divide frequency by 1.  
1h  
2h  
÷2. Divide frequency by 2.  
÷3. Divide frequency by 3.  
3h-1Fh Reserved, do not use.  
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7.7.3.4 PLL Controller Divider 4 Register  
The PLL controller divider 4 register (PLLDIV4) is shown in Figure 7-14 and described in Table 7-22.  
Besides being used as the EMIFA internal clock, SYSCLK4 is also used in other parts of the system.  
Disabling this clock will cause unpredictable system behavior. Therefore, the PLLDIV4 register should  
never be used to disable SYSCLK4.  
31  
16  
Reserved  
R-0  
15  
14  
5
4
0
D4EN  
Reserved  
R-0  
RATIO  
R/W-3  
R/W-1  
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset  
Figure 7-14. PLL Controller Divider 4 Register (PLLDIV4) [Hex Address: 029A 0160]  
Table 7-22. PLL Controller Divider 4 Register (PLLDIV4) Field Descriptions  
Bit  
Field  
Value Description  
31:16 Reserved  
0
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.  
15  
D4EN  
Divider 4 enable bit.  
0
1
0
Divider 4 is disabled. No clock output.  
Divider 4 is enabled.  
14:5  
4:0  
Reserved  
RATIO  
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.  
0-1Fh Divider ratio bits.  
0
÷2. Divide frequency by 2.  
1h  
2h  
3h  
÷4. Divide frequency by 4.  
÷6. Divide frequency by 6.  
÷8. Divide frequency by 8.  
4h-7h ÷10 to ÷16. Divide frequency by 10 to divide frequency by 16.  
8h-1Fh Reserved, do not use.  
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7.7.3.5 PLL Controller Divider 5 Register  
The PLL controller divider 5 register (PLLDIV5) is shown in Figure 7-15 and described in Table 7-23.  
31  
16  
0
Reserved  
R-0  
15  
14  
5
4
D5EN  
Reserved  
R-0  
RATIO  
R/W-3  
R/W-1  
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset  
Figure 7-15. PLL Controller Divider 5 Register (PLLDIV5) [Hex Address: 029A 0164]  
Table 7-23. PLL Controller Divider 5 Register (PLLDIV5) Field Descriptions  
Bit  
Field  
Value Description  
31:16 Reserved  
0
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.  
15  
Dn4EN  
Divider 4 enable bit.  
0
1
0
Divider 4 is disabled. No clock output.  
Divider 4 is enabled.  
14:5  
4:0  
Reserved  
RATIO  
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.  
0-1Fh Divider ratio bits.  
0
÷1. Divide frequency by 1.  
1h  
2h  
3h  
÷2. Divide frequency by 2.  
÷3. Divide frequency by 3.  
÷4. Divide frequency by 4.  
4h-7h ÷5 to ÷8. Divide frequency by 5 to divide frequency by 8.  
8h-1Fh Reserved, do not use.  
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7.7.3.6 PLL Controller Command Register  
The PLL controller command register (PLLCMD) contains the command bit for GO operation. PLLCMD is  
shown in Figure 7-16 and described in Table 7-24.  
31  
15  
16  
Reserved  
R-0  
2
1
0
Reserved  
R-0  
Rsvd  
R/W-0  
GOSET  
R/W-0  
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset  
Figure 7-16. PLL Controller Command Register (PLLCMD) [Hex Address: 029A 0138]  
Table 7-24. PLL Controller Command Register (PLLCMD) Field Descriptions  
Bit  
31:2  
1
Field  
Value Description  
Reserved  
Reserved  
GOSET  
0
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.  
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.  
0
GO operation command for SYSCLK rate change and phase alignment. Before setting this bit to 1  
to initiate a GO operation, check the GOSTAT bit in the PLLSTAT register to ensure all previous  
GO operations have completed.  
0
1
No effect. Write of 0 clears bit to 0.  
Initiates GO operation. Write of 1 initiates GO operation. Once set, GOSET remains set but further  
writes of 1 can initiate the GO operation.  
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7.7.3.7 PLL Controller Status Register  
The PLL controller status register (PLLSTAT) shows the PLL controller status. PLLSTAT is shown in  
Figure 7-17 and described in Table 7-25.  
31  
15  
16  
Reserved  
R-0  
1
0
Reserved  
R-0  
GOSTAT  
R-0  
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset  
Figure 7-17. PLL Controller Status Register (PLLSTAT) [Hex Address: 029A 013C]  
Table 7-25. PLL Controller Status Register (PLLSTAT) Field Descriptions  
Bit  
31:1  
0
Field  
Value Description  
Reserved  
GOSTAT  
0
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.  
GO operation status.  
0
1
GO operation is not in progress. SYSCLK divide ratios are not being changed.  
GO operation is in progress. SYSCLK divide ratios are being changed.  
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7.7.3.8 PLL Controller Clock Align Control Register  
The PLL controller clock align control register (ALNCTL) is shown in Figure 7-18 and described in  
Table 7-26.  
31  
15  
16  
Reserved  
R-0  
5
4
3
2
0
Reserved  
R-0  
ALN5 ALN4  
Reserved  
R-1  
R-1 R-1  
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset  
Figure 7-18. PLL Controller Clock Align Control Register (ALNCTL) [Hex Address: 029A 0140]  
Table 7-26. PLL Controller Clock Align Control Register (ALNCTL) Field Descriptions  
Bit  
31:5  
4:3  
Field  
Value Description  
Reserved  
0
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.  
ALNn  
SYSCLKn alignment. Do not change the default values of these fields.  
0
1
0
Do not align SYSCLKn to other SYSCLKs during GO operation. If SYSn in DCHANGE is set to 1,  
SYSCLKn switches to the new ratio immediately after the GOSET bit in PLLCMD is set.  
Align SYSCLKn to other SYSCLKs selected in ALNCTL when the GOSET bit in PLLCMD is set.  
The SYSCLKn ratio is set to the ratio programmed in the RATIO bit in PLLDIVn.  
2:0  
Reserved  
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.  
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7.7.3.9 PLLDIV Ratio Change Status Register  
Whenever a different ratio is written to the PLLDIVn registers, the PLLCTRL flags the change in the  
PLLDIV ratio change status registers (DCHANGE). During the GO operation, the PLL controller will only  
change the divide ratio of the SYSCLKs with the bit set in DCHANGE. Note that changed clocks will be  
automatically aligned to other clocks. The PLLDIV divider ratio change status register is shown in  
Figure 7-19 and described in Table 7-27.  
31  
15  
16  
Reserved  
R-0  
5
4
3
2
0
Reserved  
R-0  
SYS5 SYS4  
Reserved  
R-0  
R-0 R-0  
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset  
Figure 7-19. PLLDIV Divider Ratio Change Status Register (DCHANGE) [Hex Address: 029A 0144]  
Table 7-27. PLLDIV Divider Ratio Change Status Register (DCHANGE) Field Descriptions  
Bit  
31:5  
4
Field  
Value Description  
Reserved  
SYS5  
0
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.  
Identifies when the SYSCLK5 divide ratio has been modified.  
0
1
SYSCLK5 ratio has not been modified. When GOSET is set, SYSCLK5 will not be affected.  
SYSCLK5 ratio has been modified. When GOSET is set, SYSCLK5 will change to the new ratio.  
Identifies when the SYSCLK4 divide ratio has been modified.  
3
SYS4  
0
1
0
SYSCLK4 ratio has not been modified. When GOSET is set, SYSCLK4 will not be affected.  
SYSCLK4 ratio has been modified. When GOSET is set, SYSCLK4 will change to the new ratio.  
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.  
2:0  
Reserved  
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7.7.3.10 SYSCLK Status Register  
The SYSCLK status register (SYSTAT) shows the status of the system clocks (SYSCLKn). SYSTAT is  
shown in Figure 7-20 and described in Table 7-28.  
31  
16  
Reserved  
R-0  
15  
8
Reserved  
R-0  
7
5
4
3
2
1
0
Reserved  
R-0  
SYS5ON  
SYS4ON  
SYS3ON  
SYS2ON  
Reserved  
R-1  
R-1  
R-1  
R-1  
R-1  
LEGEND: R = Read only; -n = value after reset  
Figure 7-20. SYSCLK Status Register (SYSTAT) [Hex Address: 029A 0150]  
Table 7-28. SYSCLK Status Register (SYSTAT) Field Descriptions  
Bit  
31:4  
4:1  
Field  
Value Description  
Reserved  
SYSnON  
0
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.  
SYSCLKn on status.  
0
1
1
SYSCLKn is gated.  
SYSCLKn is on.  
0
Reserved  
Reserved. The reserved bit location is always read as 1. A value written to this field has no effect.  
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7.7.4 PLL1 Controller Input and Output Clock Electrical Data/Timing  
Table 7-29. Timing Requirements for CLKIN1 Devices(1)(2)(3) (see Figure 7-21)  
-720  
-850  
-1000  
NO.  
PLL MODES  
UNIT  
x1 (Bypass), x15,  
x20, x25, x30, x32  
MIN  
15  
MAX  
1
2
3
4
5
tc(CLKIN1)  
tw(CLKIN1H)  
tw(CLKIN1L)  
tt(CLKIN1)  
Cycle time, CLKIN1(4)  
30.3  
ns  
ns  
ns  
ns  
ps  
Pulse duration, CLKIN1 high  
Pulse duration, CLKIN1 low  
Transition time, CLKIN1  
0.4C  
0.4C  
1.2  
tJ(CLKIN1)  
Period jitter (peak-to-peak), CLKIN1  
100  
(1) The reference points for the rise and fall transitions are measured at 3.3 V VIL MAX and VIH MIN.  
(2) For more details on the PLL multiplier factors (x1 [BYPASS], x 15, x20, x25, x30, x32), see Section 7.7.1.2, PLL1 Controller Operating  
Modes.  
(3) C = CLKIN1 cycle time in ns. For example, when CLKIN1 frequency is 50 MHz, use C = 20 ns.  
(4) The PLL1 multiplier factors (x1 [BYPASS], x 15, x20, x25, x30, x32) further limit the MIN and MAX values for tc(CLKIN1). For more  
detailed information on these limitations, see Section 7.7.1.1, Internal Clocks and Maximum Operating Frequencies.  
1
5
4
2
CLKIN1  
3
4
Figure 7-21. CLKIN1 Timing  
Table 7-30. Switching Characteristics Over Recommended Operating Conditions for SYSCLK4  
[CPU/8 - CPU/12](1)(2) (see Figure 7-22)  
-720  
-850  
NO.  
PARAMETER  
-1000  
UNIT  
MIN  
MAX  
6P + 0.7  
6P + 0.7  
1
2
3
4
tw(CKO3H)  
tw(CKO3L)  
tt(CKO3)  
Pulse duration, SYSCLK4 high  
Pulse duration, SYSCLK4 low  
Transition time, SYSCLK4  
4P – 0.7  
4P – 0.7  
ns  
ns  
ns  
(1) The reference points for the rise and fall transitions are measured at 3.3 V VOL MAX and VOH MIN.  
(2) P = 1/CPU clock frequency in nanoseconds (ns)  
4
2
SYSCLK4  
3
4
Figure 7-22. SYSCLK4 Timing  
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7.8 PLL2 and PLL2 Controller  
The secondary PLL controller generates interface clocks for the Ethernet media access controller (EMAC)  
and the DDR2 memory controller.  
As shown in Figure 7-23, the PLL2 controller features a PLL multiplier controller and one divider (D1). The  
PLL multiplier is fixed to a x20 multiplier rate and the divider D1 can be programmed to a ÷2 or ÷5 mode.  
PLL2 power is supplied externally via the PLL2 power supply (PLLV2). An external PLL filter circuit must  
be added to PLLV2 as shown in Figure 7-23. The 1.8-V supply for the EMI filter must be from the same  
1.8-V power plane supplying the I/O power-supply pin, DVDD18. TI requires EMI filter manufacturer Murata,  
part number NFM18CC222R1C3.  
All PLL external components (C161, C162, and the EMI Filter) should be placed as close to the C64x+  
DSP device as possible. For the best performance, TI requires that all the PLL external components be on  
a single side of the board without jumpers, switches, or components other than the ones shown. For  
reduced PLL jitter, maximize the spacing between switching signals and the PLL external components  
(C161, C162, and the EMI Filter). The minimum CLKIN2 rise and fall times should also be observed. For  
the input clock timing requirements, see Section 7.8.4, PLL2 Controller Input Clock Electrical Data/Timing.  
CAUTION  
The PLL controller module as described in the TMS320C645x DSP  
Software-Programmable Phase-Locked Loop (PLL) Controller User's Guide (literature  
number SPRUE56) includes a superset of features, some of which are not supported  
on the C6454 DSP. The following sections describe the features that are supported; it  
should be assumed that any feature not included in these sections is not supported  
by the C6454 DSP.  
TMS320C6454 DSP  
SYSCLK3 (From PLL1 Controller)  
PLLV2  
+1.8 V  
SYSCLK2 (From PLL1 Controller)  
0.1 pF  
C162  
560 pF  
C161  
DDR2  
Memory  
Controller  
EMI Filter  
PLLREF  
PLLOUT  
/2  
PLL2  
(B)(C)  
CLKIN2  
DIVIDER D1  
SYSCLK1  
PLLM  
x20  
EMAC  
1
0
SYSREFCLK  
(A)  
/x  
1
PLL2 Controller  
A. /x must be programmed to /2 for GMII (default) and to /5 for RGMII.  
B. If EMAC is enabled with RGMII, or GMII, CLKIN2 frequency must be 25 MHz.  
C. CLKIN2 is a 3.3-V signal.  
Figure 7-23. PLL2 Block Diagram  
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7.8.1 PLL2 Controller Device-Specific Information  
7.8.1.1 Internal Clocks and Maximum Operating Frequencies  
As shown in Figure 7-23, the output of PLL2, PLLOUT, is divided by 2 and directly fed to the DDR2  
memory controller. This clock is used by the DDR2 memory controller to generate DDR2CLKOUT and  
DDR2CLKOUT. Note that, internally, the data bus interface of the DDR2 memory controller is clocked by  
SYSCLK2 of the PLL1 controller.  
The PLLOUT/2 clock is also fed back into the PLL2 controller where it becomes SYSREFCLK. Divider D1  
of the PLL2 controller generates SYSCLK1 for the Ethernet media access controller (EMAC). The EMAC  
uses SYSCLK1 to generate the necessary clock for each of its interfaces. Divider D1 should be  
programmed to ÷2 mode [default] when using the Gigabit Media Independent Interface (GMII) mode and  
to ÷5 mode when using the Reduce Gigabit Media Independent Interface (RGMII). Divider D1 is software  
programmable and, if necessary, must be programmed after device reset to ÷5 when the RGMII mode of  
the EMAC is used. Note that, internally, the data bus interface of the EMAC is clocked by SYSCLK3 of the  
PLL2 controller.  
Note that there is a minimum and maximum operating frequency for PLLREF, PLLOUT, and SYSCLK1.  
The clock generator must not be configured to exceed any of these constraints. For the PLL clocks input  
and output frequency ranges, see Table 7-31. Also, when EMAC is enabled with RGMII or GMII, CLKIN2  
must be 25 MHz.  
Table 7-31. PLL2 Clock Frequency Ranges  
CLOCK SIGNAL  
MIN  
12.5  
250  
50  
MAX  
26.7  
533  
UNIT  
MHz  
MHz  
MHz  
PLLREF (PLLEN = 1)  
PLLOUT  
SYSCLK1(1)  
125  
(1) SYSCLK1 restriction applies only when the EMAC is enabled and the RGMII or GMII modes are used. SYSCLK1 must be programmed  
to 125 MHz when the GMII mode is used and to 50 MHz when the RGMII mode is used.  
7.8.1.2 PLL2 Controller Operating Modes  
Unlike the PLL1 controller which can operate in bypass and a PLL mode, the PLL2 controller only  
operates in PLL mode. In this mode, SYSREFCLK is generated outside the PLL2 controller by dividing the  
output of PLL2 by two.  
The PLL2 controller is affected by power-on reset and warm reset. During these resets the PLL2 controller  
registers get reset to their default values. The internal clocks of the PLL2 controller are also affected as  
described in Section 7.6, Reset Controller.  
PLL2 is only unlocked during the power-up sequence (see Section 7.6, Reset Controller ) and is locked by  
the time the RESETSTAT pin goes high. It does not lose lock during any of the other resets.  
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7.8.2 PLL2 Controller Memory Map  
The memory map of the PLL2 controller is shown in Table 7-32. Note that only registers documented here  
are accessible on the TMS320C6454. Other addresses in the PLL2 controller memory map should not be  
modified.  
Table 7-32. PLL2 Controller Registers  
HEX ADDRESS RANGE  
029C 0000 - 029C 0114  
029C 0118  
ACRONYM  
DESCRIPTION  
-
Reserved  
PLLDIV1  
PLL Controller Divider 1 Register  
Reserved  
029C 011C - 029C 0134  
029C 0138  
-
PLLCMD  
PLL Controller Command Register  
PLL Controller Status Register  
PLL Controller Clock Align Control Register  
PLLDIV Ratio Change Status Register  
Reserved  
029C 013C  
PLLSTAT  
029C 0140  
ALNCTL  
029C 0144  
DCHANGE  
029C 0148  
-
029C 014C  
-
Reserved  
029C 0150  
SYSTAT  
SYSCLK Status Register  
Reserved  
029C 0154 - 029C 0190  
029C 0194 - 029C 01FF  
029C 0200 - 029C FFFF  
-
-
-
Reserved  
Reserved  
7.8.3 PLL2 Controller Register Descriptions  
This section provides a description of the PLL2 controller registers. For details on the operation of the PLL  
controller module, see the TMS320C645x DSP Software-Programmable Phase-Locked Loop (PLL)  
Controller User's Guide (literature number SPRUE56).  
NOTE: The PLL2 controller registers can only be accessed using the CPU or the emulator.  
Not all of the registers documented in the TMS320C645x DSP Software-Programmable Phase-Locked  
Loop (PLL) Controller User's Guide (literature number SPRUE56) are supported on the TMS320C6454.  
Only those registers documented in this section are supported. Furthermore, only the bits within the  
registers described here are supported. You should not write to any reserved memory location or change  
the value of reserved bits.  
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7.8.3.1 PLL Controller Divider 1 Register  
The PLL controller divider 1 register (PLLDIV1) is shown in Figure 7-24 and described in Table 7-33.  
31  
16  
0
Reserved  
R-0  
15  
14  
5
4
D1EN  
Reserved  
R-0  
RATIO  
R/W-1  
R/W-1  
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset  
Figure 7-24. PLL Controller Divider 1 Register (PLLDIV1) [Hex Address: 029C 0118]  
Table 7-33. PLL Controller Divider 1 Register (PLLDIV1) Field Descriptions  
Bit  
Field  
Value Description  
31:16 Reserved  
0
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.  
Divider D1 enable bit.  
15  
D1EN  
0
1
0
Divider D1 is disabled. No clock output.  
Divider D1 is enabled.  
14:5  
4:0  
Reserved  
RATIO  
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.  
0-1Fh Divider ratio bits.  
1h  
4h  
÷2. Divide frequency by 2.  
÷5. Divide frequency by 5.  
Others Reserved  
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7.8.3.2 PLL Controller Command Register  
The PLL controller command register (PLLCMD) contains the command bit for GO operation. PLLCMD is  
shown in Figure 7-25 and described in Table 7-34.  
31  
15  
16  
Reserved  
R-0  
2
1
0
Reserved  
R-0  
Rsvd  
R/W-0  
GOSET  
R/W-0  
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset  
Figure 7-25. PLL Controller Command Register (PLLCMD) [Hex Address: 029C 0138]  
Table 7-34. PLL Controller Command Register (PLLCMD) Field Descriptions  
Bit  
31:2  
1
Field  
Value Description  
Reserved  
Reserved  
GOSET  
0
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.  
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.  
0
GO operation command for SYSCLK rate change and phase alignment. Before setting this bit to 1  
to initiate a GO operation, check the GOSTAT bit in the PLLSTAT register to ensure all previous  
GO operations have completed.  
0
1
No effect. Write of 0 clears bit to 0.  
Initiates GO operation. Write of 1 initiates GO operation. Once set, GOSET remains set but further  
writes of 1 can initiate the GO operation.  
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7.8.3.3 PLL Controller Status Register  
The PLL controller status register (PLLSTAT) shows the PLL controller status. PLLSTAT is shown in  
Figure 7-26 and described in Table 7-35.  
31  
16  
Reserved  
R-0  
15  
1
0
Reserved  
R-0  
GOSTAT  
R-0  
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset  
Figure 7-26. PLL Controller Status Register (PLLSTAT) [Hex Address: 029C 013C]  
Table 7-35. PLL Controller Status Register (PLLSTAT) Field Descriptions  
Bit  
31:1  
0
Field  
Value Description  
Reserved  
GOSTAT  
0
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.  
GO operation status.  
0
1
Go operation is not in progress. SYSCLK divide ratios are not being changed.  
GO operation is in progress. SYSCLK divide ratios are being changed.  
7.8.3.4 PLL Controller Clock Align Control Register  
The PLL controller clock align control register (ALNCTL) is shown in Figure 7-18 and described in  
Table 7-26.  
31  
16  
Reserved  
R-0  
15  
1
0
Reserved  
R-0  
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset  
ALN1  
R/W-1  
Figure 7-27. PLL Controller Clock Align Control Register (ALNCTL) [Hex Address: 029C 0140]  
Table 7-36. PLL Controller Clock Align Control Register (ALNCTL) Field Descriptions  
Bit  
31:1  
0
Field  
Value Description  
Reserved  
ALN1  
0
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.  
SYSCLK1 alignment. Do not change the default values of these fields.  
0
1
Do not align SYSCLK1 during GO operation. If SYS1 in DCHANGE is set to 1, SYSCLK1 switches  
to the new ratio immediately after the GOSET bit in PLLCMD is set.  
Align SYSCLK1 when the GOSET bit in PLLCMD is set. The SYSCLK1 ratio is set to the ratio  
programmed in the RATIO bit in PLLDIV1.  
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7.8.3.5 PLLDIV Ratio Change Status Register  
Whenever a different ratio is written to the PLLDIV1 register, the PLLCTRL flags the change in the  
DCHANGE status register. During the GO operation, the PLL controller will only change the divide ratio  
SYSCLK1 if SYS1 in DCHANGE is 1. The PLLDIV divider ratio change status register is shown in  
Figure 7-28 and described in Table 7-37.  
31  
15  
16  
Reserved  
R-0  
1
0
Reserved  
R-0  
SYS1  
R-0  
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset  
Figure 7-28. PLLDIV Divider Ratio Change Status Register (DCHANGE) [Hex Address: 029C 0144]  
Table 7-37. PLLDIV Divider Ratio Change Status Register (DCHANGE) Field Descriptions  
Bit  
31:1  
0
Field  
Value Description  
Reserved  
SYS1  
0
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.  
SYSCLK1 divide ratio has been modified. SYSCLK1 ratio will be modified during GO operation.  
SYSCLK1 ratio has not been modified. When GOSET is set, SYSCLK1 will not be affected.  
SYSCLK1 ratio has been modified. When GOSET is set, SYSCLK1 will change to the new ratio.  
0
1
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7.8.3.6 SYSCLK Status Register  
The SYSCLK status register (SYSTAT) shows the status of the system clock (SYSCLK1). SYSTAT is  
shown in Figure 7-29 and described in Table 7-38.  
31  
15  
16  
Reserved  
R-0  
1
0
Reserved  
R-0  
SYS1ON  
R-1  
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset  
Figure 7-29. SYSCLK Status Register [Hex Address: 029C 0150]  
Table 7-38. SYSCLK Status Register Field Descriptions  
Bit  
31:1  
0
Field  
Value Description  
Reserved  
SYS1ON  
0
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.  
SYSCLK1 on status.  
SYSCLK1 is gated.  
SYSCLK1 is on.  
0
1
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7.8.4 PLL2 Controller Input Clock Electrical Data/Timing  
Table 7-39. Timing Requirements for CLKIN2(1)(2)(3) (see Figure 7-30)  
-720  
-850  
-1000  
NO.  
UNIT  
MIN  
MAX  
1
2
3
4
5
tc(CLKIN2)  
tw(CLKIN2H)  
tw(CLKIN2L)  
tt(CLKIN2)  
Cycle time, CLKIN2  
37.5  
0.4C  
0.4C  
80  
ns  
ns  
ns  
ns  
ps  
Pulse duration, CLKIN2 high  
Pulse duration, CLKIN2 low  
Transition time, CLKIN2  
1.2  
tJ(CLKIN2)  
Period jitter (peak-to-peak), CLKIN2  
100  
(1) The reference points for the rise and fall transitions are measured at 3.3 V VIL MAX and VIH MIN.  
(2) C = CLKIN2 cycle time in ns. For example, when CLKIN2 frequency is 25 MHz, use C = 40 ns.  
(3) If EMAC is enabled with RGMII or GMII, CLKIN2 cycle time must be 40 ns (25 MHz).  
1
5
4
2
CLKIN2  
3
4
Figure 7-30. CLKIN2 Timing  
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7.9 DDR2 Memory Controller  
The 32-bit DDR2 Memory Controller bus of the C6454 is used to interface to JESD79D-2A  
standard-compliant DDR2 SDRAM devices. The DDR2 external bus only interfaces to DDR2 SDRAM  
devices; it does not share the bus with any other types of peripherals. The decoupling of DDR2 memories  
from other devices both simplifies board design and provides I/O concurrency from a second external  
memory interface, EMIFA.  
The internal data bus clock frequency and DDR2 bus clock frequency directly affect the maximum  
throughput of the DDR2 bus. The clock frequency of the DDR2 bus is equal to the CLKIN2 frequency  
multiplied by 10. The internal data bus clock frequency of the DDR2 Memory Controller is fixed at a  
divide-by-three ratio of the CPU frequency. The maximum DDR2 throughput is determined by the smaller  
of the two bus frequencies. For example, if the internal data bus frequency is 333 MHz (CPU frequency is  
1 GHz) and the DDR2 bus frequency is 250 MHz (CLKIN2 frequency is 25 MHz), the maximum data rate  
achievable by the DDR2 memory controller is 2.0 Gbytes/sec. The DDR2 bus is designed to sustain a  
maximum throughput of up to 2.0 Gbytes/sec at a 533-MHz data rate (250-MHz clock rate), as long as  
data requests are pending in the DDR2 Memory Controller.  
7.9.1 DDR2 Memory Controller Device-Specific Information  
The approach to specifying interface timing for the DDR2 memory bus is different than on other interfaces  
such as EMIF, HPI, and McBSP. For these other interfaces the device timing was specified in terms of  
data manual specifications and I/O buffer information specification (IBIS) models.  
For the C6454 DDR2 memory bus, the approach is to specify compatible DDR2 devices and provide the  
printed circuit board (PCB) solution and guidelines directly to the user. Texas Instruments (TI) has  
performed the simulation and system characterization to ensure all DDR2 interface timings in this solution  
are met. The complete DDR2 system solution is documented in the Implementing DDR2 PCB Layout on  
the TMS320C6454 application report (literature number SPRAAA7).  
TI only supports designs that follow the board design guidelines outlined in the SPRAAA7  
application report.  
The DDR2 Memory Controller pins must be enabled by setting the DDR2_EN configuration pin (ABA0)  
high during device reset. For more details, see Section 3.1, Device Configuration at Device Reset.  
The ODT[1:0] pins of the memory controller must be left unconnected. The ODT pins on the DDR2  
memory device(s) must be connected to ground.  
The DDR2 memory controller on the C6454 device supports the following memory topologies:  
•
•
A 32-bit wide configuration interfacing to two 16-bit wide DDR2 SDRAM devices.  
A 16-bit wide configuration interfacing to a single 16-bit wide DDR2 SDRAM device.  
A race condition may exist when certain masters write data to the DDR2 memory controller. For example,  
if master A passes a software message via a buffer in external memory and does not wait for indication  
that the write completes, when master B attempts to read the software message, then the master B read  
may bypass the master A write and, thus, master B may read stale data and, therefore, receive an  
incorrect message.  
Some master peripherals (e.g., EDMA3 transfer controllers) will always wait for the write to complete  
before signaling an interrupt to the system, thus avoiding this race condition. For masters that do not have  
hardware guarantee of write-read ordering, it may be necessary to guarantee data ordering via software.  
If master A does not wait for indication that a write is complete, it must perform the following workaround:  
1. Perform the required write.  
2. Perform a dummy write to the DDR2 memory controller module ID and revision register.  
3. Perform a dummy read to the DDR2 memory controller module ID and revision register.  
4. Indicate to master B that the data is ready to be read after completion of the read in step 3. The  
completion of the read in step 3 ensures that the previous write was done.  
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7.9.2 DDR2 Memory Controller Peripheral Register Description(s)  
Table 7-40. DDR2 Memory Controller Registers  
HEX ADDRESS RANGE  
7800 0000  
ACRONYM  
REGISTER NAME  
DDR2 Memory Controller Module and Revision Register  
DDR2 Memory Controller Status Register  
DDR2 Memory Controller SDRAM Configuration Register  
DDR2 Memory Controller SDRAM Refresh Control Register  
DDR2 Memory Controller SDRAM Timing 1 Register  
DDR2 Memory Controller SDRAM Timing 2 Register  
Reserved  
MIDR  
7800 0004  
DMCSTAT  
7800 0008  
SDCFG  
7800 000C  
SDRFC  
7800 0010  
SDTIM1  
7800 0014  
SDTIM2  
7800 0018  
-
7800 0020  
BPRIO  
DDR2 Memory Controller Burst Priority Register  
Reserved  
7800 0024 - 7800 004C  
7800 0050 - 7800 0078  
7800 007C - 7800 00BC  
7800 00C0 - 7800 00E0  
7800 00E4  
-
-
Reserved  
-
Reserved  
-
Reserved  
DMCCTL  
DDR2 Memory Controller Control Register  
Reserved  
7800 00E8 - 7800 00FC  
7800 0100 - 7FFF FFFF  
-
-
Reserved  
7.9.3 DDR2 Memory Controller Electrical Data/Timing  
The Implementing DDR2 PCB Layout on the TMS320C6454 application report (literature number  
SPRAAA7) specifies a complete DDR2 interface solution for the C6454 as well as a list of compatible  
DDR2 devices. TI has performed the simulation and system characterization to ensure all DDR2 interface  
timings in this solution are met; therefore, no electrical data/timing information is supplied here for this  
interface.  
TI only supports designs that follow the board design guidelines outlined in the SPRAAA7  
application report.  
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7.10 External Memory Interface A (EMIFA)  
The EMIFA can interface to a variety of external devices or ASICs, including:  
•
•
•
•
Pipelined and flow-through Synchronous-Burst SRAM (SBSRAM)  
ZBT (Zero Bus Turnaround) SRAM and Late Write SRAM  
Synchronous FIFOs  
Asynchronous memory, including SRAM, ROM, and Flash  
7.10.1 EMIFA Device-Specific Information  
Timing analysis must be done to verify all AC timings are met. TI recommends utilizing I/O buffer  
information specification (IBIS) to analyze all AC timings.  
To properly use IBIS models to attain accurate timing analysis for a given system, see the Using IBIS  
Models for Timing Analysis application report (literature number SPRA839).  
To maintain signal integrity, serial termination resistors should be inserted into all EMIF output signal lines  
(for the EMIF output signals, see Table 2-3, Terminal Functions).  
A race condition may exist when certain masters write data to the EMIFA. For example, if master A  
passes a software message via a buffer in external memory and does not wait for indication that the write  
completes, when master B attempts to read the software message, then the master B read may bypass  
the master A write and, thus, master B may read stale data and, therefore, receive an incorrect message.  
Some master peripherals (e.g., EDMA3 transfer controllers) will always wait for the write to complete  
before signaling an interrupt to the system, thus avoiding this race condition. For masters that do not have  
hardware guarantee of write-read ordering, it may be necessary to guarantee data ordering via software.  
If master A does not wait for indication that a write is complete, it must perform the following workaround:  
1. Perform the required write.  
2. Perform a dummy write to the EMIFA module ID and revision register.  
3. Perform a dummy read to the EMIFA module ID and revision register.  
4. Indicate to master B that the data is ready to be read after completion of the read in step 3. The  
completion of the read in step 3 ensures that the previous write was done.  
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7.10.2 EMIFA Peripheral Register Description(s)  
Table 7-41. EMIFA Registers  
HEX ADDRESS RANGE  
7000 0000  
ACRONYM  
REGISTER NAME  
MIDR  
Module ID and Revision Register  
Status Register  
7000 0004  
STAT  
7000 0008  
-
Reserved  
7000 000C - 7000 001C  
7000 0020  
-
Reserved  
BURST_PRIO  
Burst Priority Register  
Reserved  
7000 0024 - 7000 004C  
7000 0050 - 7000 007C  
7000 0080  
-
-
CE2CFG  
CE3CFG  
CE4CFG  
CE5CFG  
-
Reserved  
EMIFA CE2 Configuration Register  
EMIFA CE3 Configuration Register  
EMIFA CE4 Configuration Register  
EMIFA CE5 Configuration Register  
Reserved  
7000 0084  
7000 0088  
7000 008C  
7000 0090 - 7000 009C  
7000 00A0  
AWCC  
-
EMIFA Async Wait Cycle Configuration Register  
Reserved  
7000 00A4 - 7000 00BC  
7000 00C0  
INTRAW  
INTMSK  
INTMSKSET  
INTMSKCLR  
-
EMIFA Interrupt RAW Register  
EMIFA Interrupt Masked Register  
EMIFA Interrupt Mask Set Register  
EMIFA Interrupt Mask Clear Register  
Reserved  
7000 00C4  
7000 00C8  
7000 00CC  
7000 00D0 - 7000 00DC  
7000 00E0 - 77FF FFFF  
-
Reserved  
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7.10.3 EMIFA Electrical Data/Timing  
Table 7-42. Timing Requirements for AECLKIN for EMIFA(1)(2) (see Figure 7-31)  
-720  
-850  
-1000  
NO.  
UNIT  
MIN  
MAX  
1
2
3
4
5
tc(EKI)  
tw(EKIH)  
tw(EKIL)  
tt(EKI)  
Cycle time, AECLKIN  
6(3)  
2.7  
2.7  
40  
ns  
ns  
ns  
ns  
ns  
Pulse duration, AECLKIN high  
Pulse duration, AECLKIN low  
Transition time, AECLKIN  
Period Jitter, AECLKIN  
2
tJ(EKI)  
0.02E(4)  
(1) The reference points for the rise and fall transitions are measured at VIL MAX and VIH MIN.  
(2) E = the EMIF input clock (AECLKIN or SYSCLK4) period in ns for EMIFA.  
(3) Minimum AECLKIN cycle times must be met, even when AECLKIN is generated by an internal clock source. Minimum AECLKIN times  
are based on internal logic speed; the maximum useable speed of the EMIF may be lower due to AC timing requirements.  
(4) This timing only applies when AECLKIN is used for EMIFA.  
1
5
4
2
AECLKIN  
3
4
Figure 7-31. AECLKIN Timing for EMIFA  
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Table 7-43. Switching Characteristics Over Recommended Operating Conditions for AECLKOUT for the  
EMIFA Module(1)(2)(3) (see Figure 7-32)  
-720  
-850  
-1000  
NO.  
PARAMETER  
UNIT  
MIN  
MAX  
1
2
3
4
5
6
tc(EKO)  
Cycle time, AECLKOUT  
E – 0.7  
EH – 0.7  
EL – 0.7  
E + 0.7  
ns  
ns  
ns  
ns  
ns  
ns  
tw(EKOH)  
tw(EKOL)  
Pulse duration, AECLKOUT high  
EH + 0.7  
Pulse duration, AECLKOUT low  
EL + 0.7  
tt(EKO)  
Transition time, AECLKOUT  
1
8
8
td(EKIH-EKOH)  
td(EKIL-EKOL)  
Delay time, AECLKIN high to AECLKOUT high  
Delay time, AECLKIN low to AECLKOUT low  
1
1
(1) E = the EMIF input clock (AECLKIN or SYSCLK4) period in ns for EMIFA.  
(2) The reference points for the rise and fall transitions are measured at VOL MAX and VOH MIN.  
(3) EH is the high period of E (EMIF input clock period) in ns and EL is the low period of E (EMIF input clock period) in ns for EMIFA.  
AECLKIN  
5
2
3
3
1
4
AECLKOUT1  
Figure 7-32. AECLKOUT Timing for the EMIFA Module  
7.10.3.1 Asynchronous Memory Timing  
Table 7-44. Timing Requirements for Asynchronous Memory Cycles for EMIFA Module(1)(2)(3)  
(see Figure 7-33 and Figure 7-34)  
-720  
-850  
-1000  
NO.  
UNIT  
MIN  
MAX  
3
4
5
6
7
tsu(EDV-AOEH)  
th(AOEH-EDV)  
tsu(ARDY-EKOH)  
th(EKOH-ARDY)  
tw(ARDY)  
Setup time, AEDx valid before AAOE high  
Hold time, AEDx valid after AAOE high  
6.5  
ns  
ns  
ns  
ns  
ns  
3
Setup time, AARDY valid before AECLKOUT low  
Hold time, AARDY valid after AECLKOUT low  
Pulse width, AARDY assertion and deassertion  
1
2
2E + 5  
Delay time, from AARDY sampled deasserted on AECLKOUT falling to  
beginning of programmed hold period  
8
9
td(ARDY-HOLD)  
tsu(ARDY-HOLD)  
4E  
ns  
ns  
Setup time, before end of programmed strobe period by which AARDY  
should be asserted in order to insert extended strobe wait states.  
2E  
(1) E = AECLKOUT period in ns for EMIFA  
(2) To ensure data setup time, simply program the strobe width wide enough.  
(3) AARDY is internally synchronized. To use AARDY as an asynchronous input, the pulse width of the AARDY signal should be at least 2E  
to ensure setup and hold time is met.  
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Table 7-45. Switching Characteristics Over Recommended Operating Conditions for Asynchronous  
Memory Cycles for EMIFA Module(1)(2)(3) (see Figure 7-33 and Figure 7-34)  
-720  
-850  
-1000  
NO.  
PARAMETER  
UNIT  
MIN  
MAX  
7
1
tosu(SELV-AOEL)  
toh(AOEH-SELIV)  
td(EKOH-AOEV)  
tosu(SELV-AWEL)  
toh(AWEH-SELIV)  
td(EKOH-AWEV)  
Output setup time, select signals valid to AAOE low  
Output hold time, AAOE high to select signals invalid  
Delay time, AECLKOUT high to AAOE valid  
RS * E – 1.5  
RS * E – 1.9  
1
ns  
ns  
ns  
ns  
ns  
ns  
2
10  
11  
12  
13  
Output setup time, select signals valid to AAWE low  
Output hold time, AAWE high to select signals invalid  
Delay time, AECLKOUT high to AAWE valid  
WS * E – 1.7  
WH * E – 1.8  
1.3  
7.1  
(1) E = AECLKOUT period in ns for EMIFA  
(2) RS = Read setup, RST = Read strobe, RH = Read hold, WS = Write setup, WST = Write strobe, WH = Write hold. These parameters  
are programmed via the EMIFA CE Configuration registers (CEnCFG).  
(3) Select signals for EMIFA include: ACEx, ABE[7:0], AEA[19:0], ABA[1:0]; and for EMIFA writes, also include AR/W, AED[63:0].  
Strobe = 4  
Setup = 1  
Hold = 1  
2
AECLKOUT  
ACEx  
1
1
2
2
Byte Enables  
Address  
ABE[7:0]  
1
AEA[19:0]/  
ABA[1:0]  
3
4
Read Data  
AED[63:0]  
10  
10  
(A)  
AAOE/ASOE  
(A)  
AAWE/ASWE  
AR/W  
(B)  
DEASSERTED  
AARDY  
A
B
AAOE/ASOE and AAWE/ASWE operate as AAOE (identified under select signals) and AAWE, respectively, during asynchronous  
memory accesses.  
Polarity of the AARDY signal is programmable through the AP field of the EMIFA Async Wait Cycle Configuration register (AWCC).  
Figure 7-33. Asynchronous Memory Read Timing for EMIFA  
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Strobe = 4  
Hold = 1  
Setup = 1  
AECLKOUT  
ACEx  
12  
12  
12  
11  
11  
Byte Enables  
Address  
ABE[7:0]  
11  
AEA[19:0]/  
ABA[1:0]  
11  
12  
Write Data  
AED[63:0]  
(A)  
AAOE/ASOE  
13  
13  
(A)  
AAWE/ASWE  
11  
12  
AR/W  
(B)  
DEASSERTED  
AARDY  
A
B
AAOE/ASOE and AAWE/ASWE operate as AAOE (identified under select signals) and AAWE, respectively, during asynchronous memory  
accesses.  
Polarity of the AARDY signal is programmable through the AP field of the EMIFA Async Wait Cycle Configuration register (AWCC).  
Figure 7-34. Asynchronous Memory Write Timing for EMIFA  
Strobe  
Strobe  
Hold = 2  
Setup = 2  
Extended Strobe  
9
8
AECLKOUT  
6
5
7
7
(A)  
ASSERTED  
DEASSERTED  
AARDY  
A
Polarity of the AARDY signal is programmable through the AP field of the EMIFA Async Wait Cycle Configuration register (AWCC).  
Figure 7-35. AARDY Timing  
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7.10.3.2 Programmable Synchronous Interface Timing  
Table 7-46. Timing Requirements for Programmable Synchronous Interface Cycles for EMIFA Module  
(see Figure 7-36)  
-720  
-850  
-1000  
NO.  
UNIT  
MIN  
MAX  
6
7
tsu(EDV-EKOH)  
th(EKOH-EDV)  
Setup time, read AEDx valid before AECLKOUT high  
Hold time, read AEDx valid after AECLKOUT high  
2
ns  
ns  
1.5  
Table 7-47. Switching Characteristics Over Recommended Operating Conditions for Programmable  
Synchronous Interface Cycles for EMIFA Module(1) (see Figure 7-36–Figure 7-38)  
-720  
-850  
-1000  
NO.  
PARAMETER  
UNIT  
MIN  
MAX  
4.9  
1
2
td(EKOH-CEV)  
td(EKOH-BEV)  
td(EKOH-BEIV)  
td(EKOH-EAV)  
td(EKOH-EAIV)  
td(EKOH-ADSV)  
td(EKOH-OEV)  
td(EKOH-EDV)  
td(EKOH-EDIV)  
td(EKOH-WEV)  
Delay time, AECLKOUT high to ACEx valid  
Delay time, AECLKOUT high to ABEx valid  
Delay time, AECLKOUT high to ABEx invalid  
Delay time, AECLKOUT high to AEAx valid  
Delay time, AECLKOUT high to AEAx invalid  
Delay time, AECLKOUT high to ASADS/ASRE valid  
Delay time, AECLKOUT high to ASOE valid  
Delay time, AECLKOUT high to AEDx valid  
Delay time, AECLKOUT high to AEDx invalid  
Delay time, AECLKOUT high to ASWE valid  
1.3  
1.3  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
4.9  
3
4
4.9  
5
1.3  
1.3  
1.3  
8
4.9  
4.9  
4.9  
9
10  
11  
12  
1.3  
1.3  
4.9  
(1) The following parameters are programmable via the EMIFA CE Configuration registers (CEnCFG):  
•
•
•
Read latency (R_LTNCY): 0-, 1-, 2-, or 3-cycle read latency  
Write latency (W_LTNCY): 0-, 1-, 2-, or 3-cycle write latency  
ACEx assertion length (CE_EXT): For standard SBSRAM or ZBT SRAM interface, ACEx goes inactive after the final command has  
been issued (CE_EXT = 0). For synchronous FIFO interface with glue, ACEx is active when ASOE is active (CE_EXT = 1).  
•
Function of ASADS/ASRE (R_ENABLE): For standard SBSRAM or ZBT SRAM interface, ASADS/ASRE acts as ASADS with  
deselect cycles (R_ENABLE = 0). For FIFO interface, ASADS/ASRE acts as ASRE with NO deselect cycles (R_ENABLE = 1).  
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READ latency = 2  
AECLKOUT  
1
1
3
5
ACEx  
2
BE1  
ABE[7:0]  
AEA[19:0]/ABA[1:0]  
AED[63:0]  
BE2  
BE3  
BE4  
4
EA1  
EA2  
EA3  
EA4  
7
6
Q1  
Q2  
Q3  
Q4  
8
9
8
(B)  
ASADS/ASRE  
9
(B)  
AAOE/ASOE  
(B)  
AAWE/ASWE  
A
B
The following parameters are programmable via the EMIFA Chip Select n Configuration Register (CESECn):  
−Read latency (R_LTNCY): 1-, 2-, or 3-cycle read latency  
−Write latency (W_LTNCY): 0-, 1-, 2-, or 3-cycle read latency  
−ACEx assertion length (CE_EXT): For standard SBSRAM or ZBT SRAM interface, ACEx goes inactive after the final command has been  
issued (CE_EXT = 0). For synchronous FIFO interface, ACEx is active when ASOE is active (CE_EXT = 1).  
−Function of ASADS/ASRE (R_ENABLE): For standard SBSRAM or ZBT SRAM interface, ASADS/ASRE acts as ASADS with deselect  
cycles (R_ENABLE = 0). For FIFO interface, ASADS/ASRE acts as SRE with NO deselect cycles (R_ENABLE = 1).  
−In this figure R_LTNCY = 2, CE_EXT = 0, R_ENABLE = 0, and SSEL = 1.  
AAOE/ASOE, and AAWE/ASWE operate as ASOE, and ASWE, respectively, during programmable synchronous interface accesses.  
Figure 7-36. Programmable Synchronous Interface Read Timing for EMIFA (With Read Latency = 2)(A)  
AECLKOUT  
1
2
1
3
ACEx  
ABE[7:0]  
BE1  
BE2  
EA2  
Q2  
BE3  
EA3  
Q3  
BE4  
EA4  
Q4  
5
4
AEA[19:0]/ABA[1:0]  
AED[63:0]  
EA1  
10  
Q1  
10  
11  
8
8
(B)  
ASADS/ASRE  
(B)  
AAOE/ASOE  
12  
12  
(B)  
AAWE/ASWE  
A
The following parameters are programmable via the EMIFA Chip Select n Configuration Register (CESECn):  
− Read latency (R_LTNCY): 1-, 2-, or 3-cycle read latency  
− Write latency (W_LTNCY): 0-, 1-, 2-, or 3-cycle read latency  
− ACEx assertion length (CE_EXT): For standard SBSRAM or ZBT SRAM interface, ACEx goes inactive after the final command has been  
issued (CE_EXT = 0). For synchronous FIFO interface, ACEx is active when ASOE is active (CE_EXT = 1).  
− Function of ASADS/ASRE (R_ENABLE): For standard SBSRAM or ZBT SRAM interface, ASADS/ASRE acts as ASADS with deselect  
cycles (R_ENABLE = 0). For FIFO interface, ASADS/ASRE acts as SRE with NO deselect cycles (R_ENABLE = 1).  
− In this figure W_LTNCY = 0, CE_EXT = 0, R_ENABLE = 0, and SSEL = 1.  
B
AAOE/ASOE, and AAWE/ASWE operate as ASOE, and ASWE, respectively, during programmable synchronous interface accesses.  
Figure 7-37. Programmable Synchronous Interface Write Timing for EMIFA (With Write Latency = 0)(A)  
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Write  
Latency =  
(B)  
1
AECLKOUT  
1
1
ACEx  
3
2
ABE[7:0]  
BE1  
BE2  
BE3  
EA3  
Q2  
BE4  
5
4
AEA[19:0]/ABA[1:0]  
AED[63:0]  
EA1  
10  
EA2  
10  
EA4  
11  
Q1  
Q3  
Q4  
8
8
(B)  
ASADS/ASRE  
(B)  
AAOE/ASOE  
12  
12  
(B)  
AAWE/ASWE  
A
B
The following parameters are programmable via the EMIFA Chip Select n Configuration Register (CESECn):  
− Read latency (R_LTNCY): 1-, 2-, or 3-cycle read latency  
− Write latency (W_LTNCY): 0-, 1-, 2-, or 3-cycle read latency  
− ACEx assertion length (CE_EXT): For standard SBSRAM or ZBT SRAM interface, ACEx goes inactive after the final command has been  
issued (CE_EXT = 0). For synchronous FIFO interface, ACEx is active when ASOE is active (CE_EXT = 1).  
− Function of ASADS/ASRE (R_ENABLE): For standard SBSRAM or ZBT SRAM interface, ASADS/ASRE acts as ASADS with deselect  
cycles (R_ENABLE = 0). For FIFO interface, ASADS/ASRE acts as SRE with NO deselect cycles (R_ENABLE = 1).  
− In this figure W_LTNCY = 1, CE_EXT = 0, R_ENABLE = 0, and SSEL = 1.  
AAOE/ASOE, and AAWE/ASWE operate as ASOE, and ASWE, respectively, during programmable synchronous interface accesses.  
Figure 7-38. Programmable Synchronous Interface Write Timing for EMIFA (With Write Latency = 1) (A)  
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7.10.4 HOLD/HOLDA Timing  
Table 7-48. Timing Requirements for the HOLD/HOLDA Cycles for EMIFA Module(1) (see Figure 7-39)  
-720  
-850  
-1000  
NO.  
UNIT  
MIN  
MAX  
3
th(HOLDAL-HOLDL)  
Hold time, HOLD low after HOLDA low  
E
ns  
(1) E = the EMIF input clock (ECLKIN) period in ns for EMIFA.  
Table 7-49. Switching Characteristics Over Recommended Operating Conditions for the HOLD/HOLDA  
Cycles for EMIFA Module(1)(2) (see Figure 7-39)  
-720  
-850  
-1000  
NO.  
PARAMETER  
UNIT  
MIN  
MAX  
(3)  
1
2
4
5
td(HOLDL-EMHZ)  
td(EMHZ-HOLDAL)  
td(HOLDH-EMLZ)  
td(EMLZ-HOLDAH)  
Delay time, HOLD low to EMIFA Bus high impedance  
Delay time, EMIF Bus high impedance to HOLDA low  
Delay time, HOLD high to EMIF Bus low impedance  
Delay time, EMIFA Bus low impedance to HOLDA high  
2E  
0
ns  
ns  
ns  
ns  
2E  
7E  
2E  
2E  
0
(1) E = the EMIF input clock (ECLKIN) period in ns for EMIFA.  
(2) EMIFA Bus consists of: ACE[5:2], ABE[7:0], AED[63:0], AEA[19:0], ABA[1:0], AR/W, ASADS/ASRE, AAOE/ASOE, and AAWE/ASWE.  
(3) All pending EMIF transactions are allowed to complete before HOLDA is asserted. If no bus transactions are occurring, then the  
minimum delay time can be achieved.  
External Requestor  
DSP Owns Bus  
DSP Owns Bus  
Owns Bus  
3
HOLD  
2
5
HOLDA  
(A)  
1
4
EMIF Bus  
DSP  
DSP  
AECLKOUT  
A. EMIFA Bus consists of: ACE[5:2], ABE[7:0], AED[63:0], AEA[19:0], ABA[1:0], AR/W, ASADS/ASRE, AAOE/ASOE,  
and AAWE/ASWE.  
Figure 7-39. HOLD/HOLDA Timing for EMIFA  
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7.10.5 BUSREQ Timing  
Table 7-50. Switching Characteristics Over Recommended Operating Conditions for the BUSREQ Cycles  
for EMIFA Module (see Figure 7-40)  
-720  
-850  
-1000  
NO.  
PARAMETER  
UNIT  
MIN  
MAX  
1
td(AEKOH-ABUSRV)  
Delay time, AECLKOUT high to ABUSREQ valid  
1
5.5  
ns  
AECLKOUTx  
1
1
ABUSREQ  
Figure 7-40. BUSREQ Timing for EMIFA  
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7.11 I2C Peripheral  
The inter-integrated circuit (I2C) module provides an interface between a C64x+ DSP and other devices  
compliant with Philips Semiconductors Inter-IC bus (I2C bus) specification version 2.1 and connected by  
way of an I2C-bus. External components attached to this 2-wire serial bus can transmit/receive up to 8-bit  
data to/from the DSP through the I2C module.  
7.11.1 I2C Device-Specific Information  
The C6454 device includes an I2C peripheral module (I2C). NOTE: when using the I2C module, ensure  
there are external pullup resistors on the SDA and SCL pins.  
The I2C modules on the C6454 may be used by the DSP to control local peripherals ICs (DACs, ADCs,  
etc.) or may be used to communicate with other controllers in a system or to implement a user interface.  
The I2C port supports:  
•
•
•
•
•
•
•
Compatible with Philips I2C Specification Revision 2.1 (January 2000)  
Fast Mode up to 400 Kbps (no fail-safe I/O buffers)  
Noise Filter to remove noise 50 ns or less  
7- and 10-Bit Device Addressing Modes  
Multi-Master (Transmit/Receive) and Slave (Transmit/Receive) Functionality  
Events: DMA, Interrupt, or Polling  
Slew-Rate Limited Open-Drain Output Buffers  
Figure 7-41 is a block diagram of the I2C module.  
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I2C Module  
Clock  
Prescale  
Peripheral Clock  
(CPU/6)  
I2CPSC  
Control  
I2COAR  
I2CSAR  
I2CMDR  
I2CCNT  
I2CEMDR  
Bit Clock  
Own  
Generator  
Address  
SCL  
Noise  
Filter  
I2C Clock  
Slave  
Address  
I2CCLKH  
I2CCLKL  
Mode  
Data  
Count  
Transmit  
I2CXSR  
Transmit  
Shift  
Extended  
Mode  
Transmit  
Buffer  
I2CDXR  
SDA  
Interrupt/DMA  
I2CIMR  
Noise  
Filter  
I2C Data  
Interrupt  
Mask/Status  
Receive  
I2CDRR  
Receive  
Buffer  
Interrupt  
Status  
I2CSTR  
Interrupt  
Vector  
Receive  
Shift  
I2CRSR  
I2CIVR  
Shading denotes control/status registers.  
Figure 7-41. I2C Module Block Diagram  
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7.11.2 I2C Peripheral Register Description(s)  
Table 7-51. I2C Registers  
HEX ADDRESS RANGE  
02B0 4000  
ACRONYM  
REGISTER NAME  
ICOAR  
ICIMR  
ICSTR  
ICCLKL  
ICCLKH  
ICCNT  
ICDRR  
ICSAR  
ICDXR  
ICMDR  
ICIVR  
ICEMDR  
ICPSC  
ICPID1  
ICPID2  
-
I2C own address register  
02B0 4004  
I2C interrupt mask/status register  
I2C interrupt status register  
I2C clock low-time divider register  
I2C clock high-time divider register  
I2C data count register  
02B0 4008  
02B0 400C  
02B0 4010  
02B0 4014  
02B0 4018  
I2C data receive register  
02B0 401C  
I2C slave address register  
I2C data transmit register  
I2C mode register  
02B0 4020  
02B0 4024  
02B0 4028  
I2C interrupt vector register  
I2C extended mode register  
I2C prescaler register  
02B0 402C  
02B0 4030  
02B0 4034  
I2C peripheral identification register 1 [Value: 0x0000 0105]  
I2C peripheral identification register 2 [Value: 0x0000 0005]  
Reserved  
02B0 4038  
02B0 403C - 02B0 405C  
02B0 4060 - 02B3 407F  
02B0 4080 - 02B3 FFFF  
-
Reserved  
-
Reserved  
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7.11.3 I2C Electrical Data/Timing  
7.11.3.1 Inter-Integrated Circuits (I2C) Timing  
Table 7-52. Timing Requirements for I2C Timings(1) (see Figure 7-42)  
-720  
-850  
-1000  
NO.  
UNIT  
STANDARD MODE  
FAST MODE  
MIN  
MIN  
MAX  
MAX  
1
2
tc(SCL)  
Cycle time, SCL  
10  
2.5  
µs  
Setup time, SCL high before SDA low (for a  
repeated START condition)  
tsu(SCLH-SDAL)  
4.7  
4
0.6  
µs  
Hold time, SCL low after SDA low (for a  
START and a repeated START condition)  
3
th(SCLL-SDAL)  
0.6  
µs  
4
5
6
tw(SCLL)  
Pulse duration, SCL low  
4.7  
4
1.3  
0.6  
100(2)  
µs  
µs  
ns  
tw(SCLH)  
Pulse duration, SCL high  
tsu(SDAV-SDLH)  
Setup time, SDA valid before SCL high  
250  
Hold time, SDA valid after SCL low (For I2C  
bus™ devices)  
7
th(SDA-SDLL)  
0(3)  
0(3)  
0.9(4)  
µs  
Pulse duration, SDA high between STOP and  
8
tw(SDAH)  
START  
conditions  
4.7  
1.3  
µs  
(5)  
9
tr(SDA)  
tr(SCL)  
tf(SDA)  
tf(SCL)  
Rise time, SDA  
Rise time, SCL  
Fall time, SDA  
Fall time, SCL  
1000 20 + 0.1Cb  
1000 20 + 0.1Cb  
300 20 + 0.1Cb  
300 20 + 0.1Cb  
300  
300  
300  
300  
ns  
ns  
ns  
ns  
(5)  
(5)  
(5)  
10  
11  
12  
Setup time, SCL high before SDA high (for  
STOP condition)  
13  
tsu(SCLH-SDAH)  
4
0.6  
0
µs  
14  
15  
tw(SP)  
Pulse duration, spike (must be suppressed)  
Capacitive load for each bus line  
50  
ns  
(5)  
Cb  
400  
400  
pF  
(1) The I2C pins SDA and SCL do not feature fail-safe I/O buffers. These pins could potentially draw current when the device is powered  
down.  
(2) A Fast-mode I2C-bus™ device can be used in a Standard-mode I2C-bus™ system, but the requirement tsu(SDA-SCLH)≥ 250 ns must then  
be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch  
the LOW period of the SCL signal, it must output the next data bit to the SDA line tr max + tsu(SDA-SCLH) = 1000 + 250 = 1250 ns  
(according to the Standard-mode I2C-Bus Specification) before the SCL line is released.  
(3) A device must internally provide a hold time of at least 300 ns for the SDA signal (referred to the VIHmin of the SCL signal) to bridge the  
undefined region of the falling edge of SCL.  
(4) The maximum th(SDA-SCLL) has only to be met if the device does not stretch the low period [tw(SCLL)] of the SCL signal.  
(5) Cb = total capacitance of one bus line in pF. If mixed with HS-mode devices, faster fall-times are allowed.  
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11  
9
SDA  
6
8
14  
4
13  
5
10  
SCL  
1
12  
3
2
7
3
Stop  
Start  
Repeated  
Start  
Stop  
Figure 7-42. I2C Receive Timings  
Table 7-53. Switching Characteristics for I2C Timings(1) (see Figure 7-43)  
-720  
-850  
-1000  
NO.  
PARAMETER  
UNIT  
STANDARD MODE  
FAST MODE  
MIN  
MIN  
MAX  
MAX  
16  
17  
tc(SCL)  
td(SCLH-SDAL)  
td(SDAL-SCLL)  
Cycle time, SCL  
10  
2.5  
µs  
Delay time, SCL high to SDA low (for a  
repeated START condition)  
4.7  
4
0.6  
µs  
Delay time, SDA low to SCL low (for a START  
and a repeated START condition)  
18  
0.6  
µs  
19  
20  
21  
tw(SCLL)  
Pulse duration, SCL low  
4.7  
4
1.3  
0.6  
µs  
µs  
ns  
tw(SCLH)  
Pulse duration, SCL high  
td(SDAV-SDLH)  
Delay time, SDA valid to SCL high  
250  
100  
Valid time, SDA valid after SCL low (For I2C  
bus™ devices)  
22  
23  
tv(SDLL-SDAV)  
tw(SDAH)  
0
0
0.9  
µs  
Pulse duration, SDA high between STOP and  
START conditions  
4.7  
1.3  
µs  
(1)  
24  
25  
26  
27  
tr(SDA)  
tr(SCL)  
tf(SDA)  
tf(SCL)  
Rise time, SDA  
Rise time, SCL  
Fall time, SDA  
Fall time, SCL  
1000 20 + 0.1Cb  
1000 20 + 0.1Cb  
300 20 + 0.1Cb  
300 20 + 0.1Cb  
300  
300  
300  
300  
ns  
ns  
ns  
ns  
(1)  
(1)  
(1)  
Delay time, SCL high to SDA high (for STOP  
condition)  
28  
29  
td(SCLH-SDAH)  
Cp  
4
0.6  
µs  
Capacitance for each I2C pin  
10  
10  
pF  
(1) Cb = total capacitance of one bus line in pF. If mixed with HS-mode devices, faster fall-times are allowed.  
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26  
24  
SDA  
21  
23  
19  
28  
20  
25  
SCL  
16  
27  
18  
17  
22  
18  
Stop  
Start  
Repeated  
Start  
Stop  
Figure 7-43. I2C Transmit Timings  
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7.12 Host-Port Interface (HPI) Peripheral  
7.12.1 HPI Device-Specific Information  
The C6454 device includes a user-configurable 16-bit or 32-bit Host-port interface (HPI16/HPI32). The  
AEA14 pin controls the HPI_WIDTH, allowing the user to configure the HPI as a 16-bit or 32-bit peripheral.  
Software handshaking via the HRDY bit of the Host Port Control Register (HPIC) is not supported on the  
C6454.  
An HPI boot is terminated using a DSP interrupt. The DSP interrupt is registered in bit 0 (channel 0) of the  
EDMA Event Register (ER). This event must be cleared by software before triggering transfers on DMA  
channel 0.  
7.12.2 HPI Peripheral Register Description(s)  
Table 7-54. HPI Control Registers  
HEX ADDRESS RANGE  
ACRONYM  
REGISTER NAME  
COMMENTS  
0288 0000  
-
Reserved  
PWREMU_MGMT has both  
Host/CPU read/write access.  
0288 0004  
PWREMU_MGMT  
HPI power and emulation management register  
0288 0008 - 0288 0024  
0288 0028  
-
-
-
Reserved  
Reserved  
Reserved  
0288 002C  
The Host and the CPU have  
read/write access to the  
HPIC register.(1)  
0288 0030  
HPIC  
HPI control register  
HPIA  
HPI address register  
(Write)  
The Host has read/write  
access to the HPIA registers.  
The CPU has only read  
0288 0034  
0288 0038  
(HPIAW)(2)  
HPIA  
HPI address register  
(Read)  
(HPIAR)(2)  
access to the HPIA registers.  
0288 000C - 028B 007F  
0288 0080 - 028B FFFF  
-
-
Reserved  
Reserved  
(1) The CPU can write 1 to the HINT bit to generate an interrupt to the host and it can write 1 to the DSPINT bit to clear/acknowledge an  
interrupt from the host.  
(2) There are two 32-bit HPIA registers: HPIAR for read operations and HPIAW for write operations. The HPI can be configured such that  
HPIAR and HPIAW act as a single 32-bit HPIA (single-HPIA mode) or as two separate 32-bit HPIAs (dual-HPIA mode) from the  
perspective of the host. The CPU can access HPIAW and HPIAR independently. For details about the HPIA registers and their modes,  
see the TMS320C645x DSP Host Port Interface (HPI) User's Guide (literature number SPRU969).  
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7.12.3 HPI Electrical Data/Timing  
Table 7-55. Timing Requirements for Host-Port Interface Cycles(1)(2) (see Table 7-56 through Figure 7-51)  
-720  
-850  
-1000  
NO.  
UNIT  
MIN  
MAX  
9
tsu(HASL-HSTBL)  
th(HSTBL-HASL)  
tsu(SELV-HASL)  
th(HASL-SELV)  
tw(HSTBL)  
Setup time, HAS low before HSTROBE low  
Hold time, HAS low after HSTROBE low  
Setup time, select signals(3) valid before HAS low  
Hold time, select signals(3) valid after HAS low  
Pulse duration, HSTROBE low  
5
2
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
10  
11  
12  
13  
14  
15  
16  
17  
18  
37  
5
5
15  
2M  
5
tw(HSTBH)  
Pulse duration, HSTROBE high between consecutive accesses  
Setup time, select signals(3) valid before HSTROBE low  
Hold time, select signals(3) valid after HSTROBE low  
Setup time, host data valid before HSTROBE high  
Hold time, host data valid after HSTROBE high  
Setup time, HCS low before HSTROBE low  
tsu(SELV-HSTBL)  
th(HSTBL-SELV)  
tsu(HDV-HSTBH)  
th(HSTBH-HDV)  
tsu(HCSL-HSTBL)  
5
5
1
0
Hold time, HSTROBE low after HRDY low. HSTROBE should not be  
inactivated until HRDY is active (low); otherwise, HPI writes will not  
complete properly.  
38  
th(HRDYL-HSTBL)  
1.1  
ns  
(1) HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.  
(2) M = SYSCLK3 period = 6/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use M = 6 ns.  
(3) Select signals include: HCNTL[1:0] and HR/W. For HPI16 mode only, select signals also include HHWIL.  
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Table 7-56. Switching Characteristics for Host-Port Interface Cycles(1)(2)  
(see Table 7-56 through Figure 7-51)  
-720  
-850  
-1000  
NO.  
PARAMETER  
UNIT  
MIN  
MAX  
Case 1. HPIC or HPIA read  
5
15  
Case 2. HPID read with no  
auto-increment(3)  
9 * M + 20  
Delay time, HSTROBE low to  
DSP data valid  
Case 3. HPID read with auto-increment  
and read FIFO initially empty(3)  
1
td(HSTBL-HDV)  
ns  
9 * M + 20  
15  
Case 4. HPID read with auto-increment  
and data previously prefetched into the  
read FIFO  
5
2
3
4
5
tdis(HSTBH-HDV)  
ten(HSTBL-HD)  
td(HSTBL-HRDYH)  
td(HSTBH-HRDYH)  
Disable time, HD high-impedance from HSTROBE high  
Enable time, HD driven from HSTROBE low  
Delay time, HSTROBE low to HRDY high  
Delay time, HSTROBE high to HRDY high  
Case 1. HPID read with no  
1
3
4
15  
12  
12  
ns  
ns  
ns  
ns  
10 * M + 20  
10 * M + 20  
auto-increment(3)  
Delay time, HSTROBE low to  
6
td(HSTBL-HRDYL)  
ns  
HRDY low  
Case 2. HPID read with auto-increment  
and read FIFO initially empty(3)  
7
td(HDV-HRDYL)  
td(DSH-HRDYL)  
Delay time, HD valid to HRDY low  
0
ns  
ns  
Case 1. HPIA write(3)  
5 * M + 20  
5 * M + 20  
Delay time, HSTROBE high to  
HRDY low  
34  
Case 2. HPID write with no  
auto-increment(3)  
Delay time, HSTROBE low to HRDY low for HPIA write and FIFO not  
empty(3)  
35  
36  
td(HSTBL-HRDYL)  
td(HASL-HRDYH)  
40 * M + 20  
12  
ns  
ns  
Delay time, HAS low to HRDY high  
(1) M = SYSCLK3 period = 6/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use M = 6 ns.  
(2) HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.  
(3) Assumes the HPI is accessing L2/L1 memory and no other master is accessing the same memory location.  
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HCS  
HAS  
HCNTL[1:0]  
HR/W  
HHWIL  
13  
16  
15  
16  
15  
37  
37  
14  
13  
(A)  
HSTROBE  
3
3
1
1
2
2
HD[15:0]  
38  
4
7
6
(B)  
HRDY  
A. HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.  
B. Depending on the type of write or read operation (HPID without auto-incrementing; HPIA, HPIC, or HPID with  
auto-incrementing) and the state of the FIFO, transitions on HRDY may or may not occur. For more detailed  
information on the HPI peripheral, see the TMS320C645x DSP Host Port Interface (HPI) User's Guide (literature  
number SPRU969).  
Figure 7-44. HPI16 Read Timing (HAS Not Used, Tied High)  
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HCS  
HAS  
12  
11  
12  
11  
HCNTL[1:0]  
12  
11  
12  
11  
HR/W  
12  
11  
12  
11  
HHWIL  
10  
9
10  
9
37  
13  
13  
37  
14  
(A)  
HSTROBE  
1
3
1
3
2
2
HD[15:0]  
7
38  
36  
6
(B)  
HRDY  
A. HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.  
B. Depending on the type of write or read operation (HPID without auto-incrementing; HPIA, HPIC, or HPID with  
auto-incrementing) and the state of the FIFO, transitions on HRDY may or may not occur. For more detailed  
information on the HPI peripheral, see the TMS320C645x DSP Host Port Interface (HPI) User's Guide (literature  
number SPRU969).  
Figure 7-45. HPI16 Read Timing (HAS Used)  
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HCS  
HAS  
HCNTL[1:0]  
HR/W  
HHWIL  
16  
13  
16  
15  
37  
15  
37  
13  
14  
(A)  
HSTROBE  
18  
18  
17  
17  
HD[15:0]  
34  
38  
4
34  
5
35  
5
(B)  
HRDY  
A. HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.  
B. Depending on the type of write or read operation (HPID without auto-incrementing; HPIA, HPIC, or HPID with  
auto-incrementing) and the state of the FIFO, transitions on HRDY may or may not occur. For more detailed  
information on the HPI peripheral, see the TMS320C645x DSP Host Port Interface (HPI) User's Guide (literature  
number SPRU969).  
Figure 7-46. HPI16 Write Timing (HAS Not Used, Tied High)  
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HCS  
HAS  
12  
11  
12  
11  
HCNTL[1:0]  
12  
12  
11  
11  
HR/W  
12  
11  
12  
11  
14  
HHWIL  
9
10  
10  
9
37  
37  
13  
(A)  
HSTROBE  
13  
18  
18  
17  
17  
HD[15:0]  
34  
35  
34  
5
36  
5
38  
(B)  
HRDY  
A. HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.  
B. Depending on the type of write or read operation (HPID without auto-incrementing; HPIA, HPIC, or HPID with  
auto-incrementing) and the state of the FIFO, transitions on HRDY may or may not occur. For more detailed  
information on the HPI peripheral, see the TMS320C645x DSP Host Port Interface (HPI) User's Guide (literature  
number SPRU969).  
Figure 7-47. HPI16 Write Timing (HAS Used)  
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HAS (input)  
16  
15  
HCNTL[1:0] (input)  
HR/W (input)  
13  
(A)  
HSTROBE (input)  
37  
HCS (input)  
1
2
3
HD[31:0] (output)  
38  
7
6
4
(B)  
HRDY (output)  
A. HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.  
B. Depending on the type of write or read operation (HPID without auto-incrementing; HPIA, HPIC, or HPID with  
auto-incrementing) and the state of the FIFO, transitions on HRDY may or may not occur. For more detailed  
information on the HPI peripheral, see the TMS320C645x DSP Host Port Interface (HPI) User's Guide (literature  
number SPRU969).  
Figure 7-48. HPI32 Read Timing (HAS Not Used, Tied High)  
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10  
HAS (input)  
12  
11  
HCNTL[1:0] (input)  
HR/W (input)  
9
13  
(A)  
HSTROBE (input)  
37  
HCS (input)  
1
2
3
HD[31:0] (output)  
7
38  
6
36  
(B)  
HRDY (output)  
A. HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.  
B. Depending on the type of write or read operation (HPID without auto-incrementing; HPIA, HPIC, or HPID with  
auto-incrementing) and the state of the FIFO, transitions on HRDY may or may not occur. For more detailed  
information on the HPI peripheral, see the TMS320C645x DSP Host Port Interface (HPI) User's Guide (literature  
number SPRU969).  
Figure 7-49. HPI32 Read Timing (HAS Used)  
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HAS (input)  
16  
15  
HCNTL[1:0]  
(input)  
HR/W (input)  
13  
(A)  
HSTROBE  
(input)  
37  
HCS (input)  
18  
17  
HD[31:0] (input)  
38  
34  
5
35  
4
(B)  
HRDY (output)  
A. HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.  
B. Depending on the type of write or read operation (HPID without auto-incrementing; HPIA, HPIC, or HPID with  
auto-incrementing) and the state of the FIFO, transitions on HRDY may or may not occur. For more detailed  
information on the HPI peripheral, see the TMS320C645x DSP Host Port Interface (HPI) User's Guide (literature  
number SPRU969).  
Figure 7-50. HPI32 Write Timing (HAS Not Used, Tied High)  
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10  
HAS (input)  
12  
11  
HCNTL[1:0]  
(input)  
HR/W (input)  
9
13  
(A)  
HSTROBE  
(input)  
37  
HCS (input)  
18  
17  
HD[31:0] (input)  
35  
34  
38  
36  
5
(B)  
HRDY (output)  
A. HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.  
B. Depending on the type of write or read operation (HPID without auto-incrementing; HPIA, HPIC, or HPID with  
auto-incrementing) and the state of the FIFO, transitions on HRDY may or may not occur. For more detailed  
information on the HPI peripheral, see the TMS320C645x DSP Host Port Interface (HPI) User's Guide (literature  
number SPRU969).  
Figure 7-51. HPI32 Write Timing (HAS Used)  
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7.13 Multichannel Buffered Serial Port (McBSP)  
The McBSP provides these functions:  
•
•
•
•
Full-duplex communication  
Double-buffered data registers, which allow a continuous data stream  
Independent framing and clocking for receive and transmit  
Direct interface to industry-standard codecs, analog interface chips (AICs), and other serially  
connected analog-to-digital (A/D) and digital-to-analog (D/A) devices  
•
External shift clock or an internal, programmable frequency shift clock for data transfer  
For more detailed information on the McBSP peripheral, see the TMS320C6000 DSP Multichannel  
Buffered Serial Port ( McBSP) Reference Guide (literature number SPRU580, rev. E or later).  
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7.13.1 McBSP Device-Specific Information  
The CLKS signal is shared by both McBSP0 and McBSP1 on this device. Also, the CLKGDV field of the  
Sample Rate Generator Register (SRGR) must always be set to a value of 1 or greater.  
The McBSP Data Receive Register (DRR) and Data Transmit Register (DXR) can be accessed through  
two separate busses: a configuration bus and a data bus. Both paths can be used by the CPU and the  
EDMA. The data bus should be used to service the McBSP as this path provides better performance.  
However, since the data path shares a bridge with the PCI peripheral (see Figure 4-1), the configuration  
path should be used in cases where this peripheral is being used to avoid any performance degradation.  
Note that the PCI peripheral consists of an independent master and slave. Performance degradation is  
only a concern when this peripheral is used to initiate transactions on the external bus.  
7.13.1.1 McBSP Peripheral Register Description(s)  
Table 7-57. McBSP 0 Registers  
HEX ADDRESS RANGE  
ACRONYM  
REGISTER NAME  
COMMENTS  
The CPU and EDMA3  
controller can only read  
this register; they cannot  
write to it.  
028C 0000  
DRR0  
McBSP0 Data Receive Register via Configuration Bus  
3000 0000  
028C 0004  
3000 0010  
028C 0008  
028C 000C  
028C 0010  
028C 0014  
028C 0018  
DRR0  
DXR0  
DXR0  
SPCR0  
RCR0  
XCR0  
SRGR0  
MCR0  
McBSP0 Data Receive Register via EDMA3 Bus  
McBSP0 Data Transmit Register via Configuration Bus  
McBSP0 Data Transmit Register via EDMA Bus  
McBSP0 Serial Port Control Register  
McBSP0 Receive Control Register  
McBSP0 Transmit Control Register  
McBSP0 Sample Rate Generator register  
McBSP0 Multichannel Control Register  
McBSP0 Enhanced Receive Channel Enable  
Register 0 Partition A/B  
028C 001C  
RCERE00  
McBSP0 Enhanced Transmit Channel Enable  
Register 0 Partition A/B  
028C 0020  
028C 0024  
028C 0028  
XCERE00  
PCR0  
McBSP0 Pin Control Register  
McBSP0 Enhanced Receive Channel Enable  
Register 1 Partition C/D  
RCERE10  
McBSP0 Enhanced Transmit Channel Enable  
Register 1 Partition C/D  
028C 002C  
028C 0030  
028C 0034  
028C 0038  
XCERE10  
RCERE20  
XCERE20  
RCERE30  
McBSP0 Enhanced Receive Channel Enable  
Register 2 Partition E/F  
McBSP0 Enhanced Transmit Channel Enable  
Register 2 Partition E/F  
McBSP0 Enhanced Receive Channel Enable  
Register 3 Partition G/H  
McBSP0 Enhanced Transmit Channel Enable  
Register 3 Partition G/H  
028C 003C  
XCERE30  
-
028C 0040 - 028F FFFF  
Reserved  
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Table 7-58. McBSP 1 Registers  
HEX ADDRESS RANGE  
ACRONYM  
REGISTER NAME  
COMMENTS  
The CPU and EDMA  
controller can only read  
this register; they cannot  
write to it.  
0290 0000  
DRR1  
McBSP1 Data Receive Register via Configuration Bus  
3400 0000  
0290 0004  
3400 0010  
0290 0008  
0290 000C  
0290 0010  
0290 0014  
0290 0018  
DRR1  
DXR1  
DXR1  
SPCR1  
RCR1  
XCR1  
SRGR1  
MCR1  
McBSP1 Data Receive Register via EDMA bus  
McBSP1 Data Transmit Register via configuration bus  
McBSP1 Data Transmit Register via EDMA bus  
McBSP1 serial port control register  
McBSP1 Receive Control Register  
McBSP1 Transmit Control Register  
McBSP1 sample rate generator register  
McBSP1 multichannel control register  
McBSP1 Enhanced Receive Channel Enable  
Register 0 Partition A/B  
0290 001C  
RCERE01  
McBSP1 Enhanced Transmit Channel Enable  
Register 0 Partition A/B  
0290 0020  
0290 0024  
0290 0028  
XCERE01  
PCR1  
McBSP1 Pin Control Register  
McBSP1 Enhanced Receive Channel Enable  
Register 1 Partition C/D  
RCERE11  
McBSP1 Enhanced Transmit Channel Enable  
Register 1 Partition C/D  
0290 002C  
0290 0030  
0290 0034  
0290 0038  
XCERE11  
RCERE21  
XCERE21  
RCERE31  
McBSP1 Enhanced Receive Channel Enable  
Register 2 Partition E/F  
McBSP1 Enhanced Transmit Channel Enable  
Register 2 Partition E/F  
McBSP1 Enhanced Receive Channel Enable  
Register 3 Partition G/H  
McBSP1 Enhanced Transmit Channel Enable  
Register 3 Partition G/H  
0290 003C  
XCERE31  
-
0290 0040 - 0293 FFFF  
Reserved  
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7.13.2 McBSP Electrical Data/Timing  
7.13.2.1 Multichannel Buffered Serial Port (McBSP) Timing  
Table 7-59. Timing Requirements for McBSP(1) (see Figure 7-52)  
-720  
-850  
-1000  
NO.  
UNIT  
MIN  
MAX  
2
3
tc(CKRX)  
tw(CKRX)  
Cycle time, CLKR/X  
CLKR/X ext  
CLKR/X ext  
CLKR int  
CLKR ext  
CLKR int  
CLKR ext  
CLKR int  
CLKR ext  
CLKR int  
CLKR ext  
CLKX int  
CLKX ext  
CLKX int  
CLKX ext  
6P or 10(2)(3)  
0.5tc(CKRX)– 1(4)  
ns  
ns  
Pulse duration, CLKR/X high or CLKR/X low  
9
1.3  
6
5
6
tsu(FRH-CKRL)  
th(CKRL-FRH)  
tsu(DRV-CKRL)  
th(CKRL-DRV)  
tsu(FXH-CKXL)  
th(CKXL-FXH)  
Setup time, external FSR high before CLKR low  
Hold time, external FSR high after CLKR low  
Setup time, DR valid before CLKR low  
ns  
ns  
ns  
ns  
ns  
ns  
3
8
7
0.9  
3
8
Hold time, DR valid after CLKR low  
3.1  
9
10  
11  
Setup time, external FSX high before CLKX low  
Hold time, external FSX high after CLKX low  
1.3  
6
3
(1) CLKRP = CLKXP = FSRP = FSXP = 0. If polarity of any of the signals is inverted, then the timing references of that signal are also  
inverted.  
(2) P = 1/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use P = 1 ns.  
(3) Use whichever value is greater. Minimum CLKR/X cycle times must be met, even when CLKR/X is generated by an internal clock  
source. The minimum CLKR/X cycle times are based on internal logic speed; the maximum usable speed may be lower due to EDMA  
limitations and AC timing requirements.  
(4) This parameter applies to the maximum McBSP frequency. Operate serial clocks (CLKR/X) in the reasonable range of 40/60 duty cycle.  
Table 7-60. Switching Characteristics Over Recommended Operating Conditions for McBSP(1)(2)  
(see Figure 7-52)  
-720  
-850  
-1000  
NO.  
PARAMETER  
UNIT  
MIN  
MAX  
Delay time, CLKS high to CLKR/X high for internal CLKR/X  
generated from CLKS input(3)  
1
2
td(CKSH-CKRXH)  
tc(CKRX)  
1.4  
10  
ns  
ns  
Cycle time, CLKR/X  
CLKR/X int  
6P or 10(4)(5)(6)  
(1) CLKRP = CLKXP = FSRP = FSXP = 0. If polarity of any of the signals is inverted, then the timing references of that signal are also  
inverted.  
(2) Minimum delay times also represent minimum output hold times.  
(3) The CLKS signal is shared by both McBSP0 and McBSP1 on this device.  
(4) Minimum CLKR/X cycle times must be met, even when CLKR/X is generated by an internal clock source. Minimum CLKR/X cycle times  
are based on internal logic speed; the maximum usable speed may be lower due to EDMA limitations and AC timing requirements.  
(5) P = 1/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use P = 1 ns.  
(6) Use whichever value is greater.  
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Table 7-60. Switching Characteristics Over Recommended Operating Conditions for McBSP  
(see Figure 7-52) (continued)  
-720  
-850  
NO.  
PARAMETER  
-1000  
UNIT  
MIN  
C – 1(7)  
MAX  
C + 1(7)  
3
4
tw(CKRX)  
Pulse duration, CLKR/X high or CLKR/X low  
Delay time, CLKR high to internal FSR valid  
CLKR/X int  
CLKR int  
CLKX int  
CLKX ext  
CLKX int  
CLKX ext  
CLKX int  
CLKX ext  
FSX int  
ns  
ns  
td(CKRH-FRV)  
–2.1  
–1.7  
3.3  
3
9
td(CKXH-FXV)  
tdis(CKXH-DXHZ)  
td(CKXH-DXV)  
Delay time, CLKX high to internal FSX valid  
ns  
ns  
ns  
1.7  
9
4
–3.9  
Disable time, DX high impedance following  
last data bit from CLKX high  
12  
13  
2.1  
9
–3.9 + D1(8)  
2.1 + D1(8)  
–2.3 + D1(9)  
4 + D2(8)  
9 + D2(8)  
5.6 + D2(9)  
Delay time, CLKX high to DX valid  
Delay time, FSX high to DX valid  
14  
td(FXH-DXV)  
ns  
ONLY applies when in data  
delay 0 (XDATDLY = 00b) mode  
FSX ext  
1.9 + D1(9)  
9 + D2(9)  
(7) C = H or L  
S = sample rate generator input clock = 6P if CLKSM = 1 (P = 1/CPU clock frequency)  
S = sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period)  
H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even  
H = (CLKGDV + 1)/2 * S if CLKGDV is odd  
L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even  
L = (CLKGDV + 1)/2 * S if CLKGDV is odd  
CLKGDV should be set appropriately to ensure the McBSP bit rate does not exceed the maximum limit (see (4) above).  
(8) Extra delay from CLKX high to DX valid applies only to the first data bit of a device, if and only if DXENA = 1 in SPCR.  
if DXENA = 0, then D1 = D2 = 0  
if DXENA = 1, then D1 = 6P, D2 = 12P  
(9) Extra delay from FSX high to DX valid applies only to the first data bit of a device, if and only if DXENA = 1 in SPCR.  
if DXENA = 0, then D1 = D2 = 0  
if DXENA = 1, then D1 = 6P, D2 = 12P  
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CLKS  
1
2
3
3
CLKR  
4
4
FSR (int)  
5
6
FSR (ext)  
DR  
7
8
Bit(n-1)  
(n-2)  
(n-3)  
2
3
3
CLKX  
9
FSX (int)  
11  
10  
FSX (ext)  
FSX (XDATDLY=00b)  
(A)  
13  
14  
13  
(A)  
12  
DX  
Bit 0  
Bit(n-1)  
(n-2)  
(n-3)  
A. Parameter No. 13 applies to the first data bit only when XDATDLY ≠ 0.  
B. The CLKS signal is shared by both McBSP0 and McBSP1 on this device.  
Figure 7-52. McBSP Timing(B)  
Table 7-61. Timing Requirements for FSR When GSYNC = 1 (see Figure 7-53)  
-720  
-850  
-1000  
NO.  
UNIT  
MIN  
MAX  
1
2
tsu(FRH-CKSH)  
th(CKSH-FRH)  
Setup time, FSR high before CLKS high  
Hold time, FSR high after CLKS high  
4
4
ns  
ns  
CLKS  
1
2
FSR external  
CLKR/X (no need to resync)  
CLKR/X (needs resync)  
Figure 7-53. FSR Timing When GSYNC = 1  
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Table 7-62. Timing Requirements for McBSP as SPI Master or Slave: CLKSTP = 10b, CLKXP = 0(1)(2)  
(see Figure 7-54)  
-720  
-850  
-1000  
NO.  
UNIT  
MASTER  
SLAVE  
MIN  
MIN  
12  
4
MAX  
MAX  
4
5
tsu(DRV-CKXL)  
th(CKXL-DRV)  
Setup time, DR valid before CLKX low  
Hold time, DR valid after CLKX low  
2 – 18P  
5 + 36P  
ns  
ns  
(1) P = 1/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use P = 1 ns.  
(2) For all SPI Slave modes, CLKG is programmed as 1/6 of the CPU clock by setting CLKSM = CLKGDV = 1.  
Table 7-63. Switching Characteristics Over Recommended Operating Conditions for McBSP as SPI  
Master or Slave: CLKSTP = 10b, CLKXP = 0(1)(2) (see Figure 7-54)  
-720  
-850  
-1000  
NO.  
PARAMETER  
UNIT  
MASTER(3)  
MIN  
SLAVE  
MIN  
MAX  
T + 3  
L + 3  
4
MAX  
1
2
3
th(CKXL-FXL)  
td(FXL-CKXH)  
td(CKXH-DXV)  
Hold time, FSX low after CLKX low(4)  
Delay time, FSX low to CLKX high(5)  
Delay time, CLKX high to DX valid  
T – 2  
ns  
ns  
ns  
L – 2  
–2  
18P + 2.8  
30P + 17  
Disable time, DX high impedance following  
last data bit from CLKX low  
6
tdis(CKXL-DXHZ)  
L – 2  
L + 3  
ns  
Disable time, DX high impedance following  
last data bit from FSX high  
7
8
tdis(FXH-DXHZ)  
td(FXL-DXV)  
6P + 3  
18P + 17  
24P + 17  
ns  
ns  
Delay time, FSX low to DX valid  
12P + 2  
(1) P = 1/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use P = 1 ns.  
(2) For all SPI Slave modes, CLKG is programmed as 1/6 of the CPU clock by setting CLKSM = CLKGDV = 1.  
(3) S = Sample rate generator input clock = 6P if CLKSM = 1 (P = 1/CPU clock frequency)  
S = Sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period)  
T = CLKX period = (1 + CLKGDV) * S  
H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even  
H = (CLKGDV + 1)/2 * S if CLKGDV is odd  
L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even  
L = (CLKGDV + 1)/2 * S if CLKGDV is odd  
(4) FSRP = FSXP = 1. As a SPI Master, FSX is inverted to provide active-low slave-enable output. As a Slave, the active-low signal input  
on FSX and FSR is inverted before being used internally.  
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for Master McBSP  
CLKXM = CLKRM = FSXM = FSRM = 0 for Slave McBSP  
(5) FSX should be low before the rising edge of clock to enable Slave devices and then begin a SPI transfer at the rising edge of the Master  
clock (CLKX).  
CLKX  
1
2
8
FSX  
7
6
3
DX  
DR  
Bit 0  
Bit(n-1)  
Bit(n-1)  
(n-2)  
(n-3)  
(n-3)  
(n-4)  
4
5
Bit 0  
(n-2)  
(n-4)  
Figure 7-54. McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 0  
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Table 7-64. Timing Requirements for McBSP as SPI Master or Slave: CLKSTP = 11b, CLKXP = 0(1)(2)  
(see Figure 7-55)  
-720  
-850  
-1000  
NO.  
UNIT  
MASTER  
SLAVE  
MIN  
MIN  
12  
4
MAX  
MAX  
4
5
tsu(DRV-CKXH)  
th(CKXH-DRV)  
Setup time, DR valid before CLKX high  
Hold time, DR valid after CLKX high  
2 – 18P  
5 + 36P  
ns  
ns  
(1) P = 1/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use P = 1 ns.  
(2) For all SPI Slave modes, CLKG is programmed as 1/6 of the CPU clock by setting CLKSM = CLKGDV = 1.  
Table 7-65. Switching Characteristics Over Recommended Operating Conditions for McBSP as SPI  
Master or Slave: CLKSTP = 11b, CLKXP = 0(1)(2) (see Figure 7-55)  
-720  
-850  
-1000  
NO.  
PARAMETER  
UNIT  
MASTER(3)  
MIN  
SLAVE  
MIN  
MAX  
L + 3  
T + 3  
4
MAX  
1
2
3
th(CKXL-FXL)  
td(FXL-CKXH)  
td(CKXL-DXV)  
Hold time, FSX low after CLKX low(4)  
Delay time, FSX low to CLKX high(5)  
Delay time, CLKX low to DX valid  
L – 2  
ns  
ns  
ns  
T – 2  
–2  
18P + 2.8  
18P + 3  
12P + 2  
30P + 17  
30P + 17  
24P + 17  
Disable time, DX high impedance following  
last data bit from CLKX low  
6
7
tdis(CKXL-DXHZ)  
td(FXL-DXV)  
–2  
4
ns  
ns  
Delay time, FSX low to DX valid  
H – 2  
H + 4  
(1) P = 1/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use P = 1 ns.  
(2) For all SPI Slave modes, CLKG is programmed as 1/6 of the CPU clock by setting CLKSM = CLKGDV = 1.  
(3) S = Sample rate generator input clock = 6P if CLKSM = 1 (P = 1/CPU clock frequency)  
S = Sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period)  
T = CLKX period = (1 + CLKGDV) * S  
H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even  
H = (CLKGDV + 1)/2 * S if CLKGDV is odd  
L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even  
L = (CLKGDV + 1)/2 * S if CLKGDV is odd  
(4) FSRP = FSXP = 1. As a SPI Master, FSX is inverted to provide active-low slave-enable output. As a Slave, the active-low signal input  
on FSX and FSR is inverted before being used internally.  
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for Master McBSP  
CLKXM = CLKRM = FSXM = FSRM = 0 for Slave McBSP  
(5) FSX should be low before the rising edge of clock to enable Slave devices and then begin a SPI transfer at the rising edge of the Master  
clock (CLKX).  
CLKX  
1
2
7
FSX  
DX  
6
3
Bit 0  
Bit(n-1)  
Bit(n-1)  
(n-2)  
(n-3)  
(n-3)  
(n-4)  
4
5
DR  
Bit 0  
(n-2)  
(n-4)  
Figure 7-55. McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 0  
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Table 7-66. Timing Requirements for McBSP as SPI Master or Slave: CLKSTP = 10b, CLKXP = 1(1)(2)  
(see Figure 7-56)  
-720  
-850  
-1000  
NO.  
UNIT  
MASTER  
SLAVE  
MIN  
MIN  
12  
4
MAX  
MAX  
4
5
tsu(DRV-CKXH)  
th(CKXH-DRV)  
Setup time, DR valid before CLKX high  
Hold time, DR valid after CLKX high  
2 – 18P  
5 + 36P  
ns  
ns  
(1) P = 1/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use P = 1 ns.  
(2) For all SPI Slave modes, CLKG is programmed as 1/6 of the CPU clock by setting CLKSM = CLKGDV = 1.  
Table 7-67. Switching Characteristics Over Recommended Operating Conditions for McBSP as SPI  
Master or Slave: CLKSTP = 10b, CLKXP = 1(1)(2) (see Figure 7-56)  
-720  
-850  
-1000  
NO.  
PARAMETER  
UNIT  
MASTER(3)  
MIN  
SLAVE  
MIN  
MAX  
T + 3  
H + 3  
4
MAX  
1
2
3
th(CKXH-FXL)  
td(FXL-CKXL)  
td(CKXL-DXV)  
Hold time, FSX low after CLKX high(4)  
Delay time, FSX low to CLKX low(5)  
Delay time, CLKX low to DX valid  
T – 2  
ns  
ns  
ns  
H – 2  
–2  
18P + 2.8  
30P + 17  
Disable time, DX high impedance following  
last data bit from CLKX high  
6
tdis(CKXH-DXHZ)  
H – 2  
H + 3  
ns  
Disable time, DX high impedance following  
last data bit from FSX high  
7
8
tdis(FXH-DXHZ)  
td(FXL-DXV)  
6P + 3  
18P + 17  
24P + 17  
ns  
ns  
Delay time, FSX low to DX valid  
12P + 2  
(1) P = 1/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use P = 1 ns.  
(2) For all SPI Slave modes, CLKG is programmed as 1/6 of the CPU clock by setting CLKSM = CLKGDV = 1.  
(3) S = Sample rate generator input clock = 6P if CLKSM = 1 (P = 1/CPU clock frequency)  
S = Sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period)  
T = CLKX period = (1 + CLKGDV) * S  
H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even  
H = (CLKGDV + 1)/2 * S if CLKGDV is odd  
L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even  
L = (CLKGDV + 1)/2 * S if CLKGDV is odd  
(4) FSRP = FSXP = 1. As a SPI Master, FSX is inverted to provide active-low slave-enable output. As a Slave, the active-low signal input  
on FSX and FSR is inverted before being used internally.  
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for Master McBSP  
CLKXM = CLKRM = FSXM = FSRM = 0 for Slave McBSP  
(5) FSX should be low before the rising edge of clock to enable Slave devices and then begin a SPI transfer at the rising edge of the Master  
clock (CLKX).  
CLKX  
1
2
8
FSX  
7
6
3
DX  
DR  
Bit 0  
Bit(n-1)  
Bit(n-1)  
(n-2)  
(n-3)  
(n-4)  
4
5
Bit 0  
(n-2)  
(n-3)  
(n-4)  
Figure 7-56. McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 1  
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Table 7-68. Timing Requirements for McBSP as SPI Master or Slave: CLKSTP = 11b, CLKXP = 1(1)(2)  
(see Figure 7-57)  
-720  
-850  
-1000  
NO.  
UNIT  
MASTER  
SLAVE  
MIN  
MIN  
12  
4
MAX  
MAX  
4
5
tsu(DRV-CKXH)  
th(CKXH-DRV)  
Setup time, DR valid before CLKX high  
Hold time, DR valid after CLKX high  
2 – 18P  
5 + 36P  
ns  
ns  
(1) P = 1/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use P = 1 ns.  
(2) For all SPI Slave modes, CLKG is programmed as 1/6 of the CPU clock by setting CLKSM = CLKGDV = 1.  
Table 7-69. Switching Characteristics Over Recommended Operating Conditions for McBSP as SPI  
Master or Slave: CLKSTP = 11b, CLKXP = 1(1)(2) (see Figure 7-57)  
-720  
-850  
-1000  
NO.  
PARAMETER  
UNIT  
MASTER(3)  
MIN  
SLAVE  
MIN  
MAX  
H + 3  
T + 1  
4
MAX  
1
2
3
th(CKXH-FXL)  
td(FXL-CKXL)  
td(CKXH-DXV)  
Hold time, FSX low after CLKX high(4)  
Delay time, FSX low to CLKX low(5)  
Delay time, CLKX high to DX valid  
H – 2  
T – 2  
ns  
ns  
ns  
–2  
18P + 2.8  
18P + 3  
12P + 2  
30P + 17  
30P + 17  
24P + 17  
Disable time, DX high impedance following  
last data bit from CLKX high  
6
7
tdis(CKXH-DXHZ)  
td(FXL-DXV)  
–2  
4
ns  
ns  
Delay time, FSX low to DX valid  
L – 2  
L + 4  
(1) P = 1/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use P = 1 ns.  
(2) For all SPI Slave modes, CLKG is programmed as 1/6 of the CPU clock by setting CLKSM = CLKGDV = 1.  
(3) S = Sample rate generator input clock = 6P if CLKSM = 1 (P = 1/CPU clock frequency)  
S = Sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period)  
T = CLKX period = (1 + CLKGDV) * S  
H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even  
H = (CLKGDV + 1)/2 * S if CLKGDV is odd  
L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even  
L = (CLKGDV + 1)/2 * S if CLKGDV is odd  
(4) FSRP = FSXP = 1. As a SPI Master, FSX is inverted to provide active-low slave-enable output. As a Slave, the active-low signal input  
on FSX and FSR is inverted before being used internally.  
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for Master McBSP  
CLKXM = CLKRM = FSXM = FSRM = 0 for Slave McBSP  
(5) FSX should be low before the rising edge of clock to enable Slave devices and then begin a SPI transfer at the rising edge of the Master  
clock (CLKX).  
CLKX  
1
2
FSX  
DX  
7
6
3
Bit 0  
Bit 0  
Bit(n-1)  
Bit(n-1)  
(n-2)  
(n-3)  
(n-4)  
4
5
DR  
(n-2)  
(n-3)  
(n-4)  
Figure 7-57. McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 1  
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7.14 Ethernet MAC (EMAC)  
The Ethernet Media Access Controller (EMAC) module provides an efficient interface between the C6454  
DSP core processor and the networked community. The EMAC supports 10Base-T (10 Mbits/second  
[Mbps]), and 100BaseTX (100 Mbps), in either half- or full-duplex mode, and 1000BaseT (1000 Mbps) in  
full-duplex mode, with hardware flow control and quality-of-service (QOS) support.  
The EMAC module conforms to the IEEE 802.3-2002 standard, describing the “Carrier Sense Multiple  
Access with Collision Detection (CSMA/CD) Access Method and Physical Layer” specifications. The IEEE  
802.3 standard has also been adopted by ISO/IEC and re-designated as ISO/IEC 8802-3:2000(E).  
Deviation from this standard, the EMAC module does not use the Transmit Coding Error signal MTXER.  
Instead of driving the error pin when an underflow condition occurs on a transmitted frame, the EMAC will  
intentionally generate an incorrect checksum by inverting the frame CRC, so that the transmitted frame  
will be detected as an error by the network.  
The EMAC control module is the main interface between the device core processor, the MDIO module,  
and the EMAC module. The relationship between these three components is shown in Figure 7-58. The  
EMAC control module contains the necessary components to allow the EMAC to make efficient use of  
device memory, plus it controls device interrupts. The EMAC control module incorporates 8K-bytes of  
internal RAM to hold EMAC buffer descriptors. The relationship between these three components is  
shown in Figure 7-58.  
Interrupt  
Controller  
DMA Memory  
Transfer Controller  
Configuration Bus  
Peripheral Bus  
EMAC Control Module  
MDIO Module  
EMAC/MDIO  
Interrupt  
EMAC Module  
MDIO Bus  
Ethernet Bus  
Figure 7-58. EMAC, MDIO, and EMAC Control Modules  
For more detailed information on the EMAC/MDIO, see the TMS320C645x DSP EMAC/MDIO Module  
Reference Guide (literature number SPRU975).  
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7.14.1 EMAC Device-Specific Information  
Interface Modes  
The EMAC module on the TMS320C6454 supports four interface modes: Media Independent Interface  
(MII), Reduced Media Independent Interface (RMII), Gigabit Media Independent Interface (GMII), and  
Reduced Gigabit Media Independent Interface (RGMII). The MII and GMII interface modes are defined in  
the IEEE 802.3-2002 standard.  
The RGMII mode of the EMAC conforms to the Reduced Gigabit Media Independent Interface (RGMII)  
Specification (version 2.0). The RGMII mode implements the same functionality as the GMII mode, but  
with a reduced number of pins. Data and control information is transmitted and received using both edges  
of the transmit and receive clocks (TXC and RXC).  
Note: The EMAC internally delays the transmit clock (TXC) with respect to the transmit data and control  
pins. Therefore, the EMAC conforms to the RGMII-ID operation of the RGMII specification. However, the  
EMAC does not delay the receive clock (RXC); this signal must be delayed with respect to the receive  
data and control pins outside of the DSP.  
The RMII mode of the EMAC conforms to the RMII Specification (revision 1.2), as written by the RMII  
Consortium. As the name implies, the Reduced Media Independent Interface (RMII) mode is a reduced  
pin count version of the MII mode.  
Interface Mode Select  
The EMAC uses the same pins for the MII, GMII, and RMII modes. Standalone pins are included for the  
RGMII mode due to specific voltage requirements. Only one mode can be used at a time. The mode used  
is selected at device reset based on the MACSEL[1:0] configuration pins (for more detailed information,  
see Section 3, Device Configuration). Table 7-70 shows which multiplexed pins are used in the MII, GMII,  
and RMII modes on the EMAC. For a detailed description of these pin functions, see Table 2-3, Terminal  
Functions.  
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Table 7-70. EMAC/MDIO Multiplexed Pins (MII, RMII, and GMII Modes)  
BALL NUMBER  
DEVICE PIN NAME  
MII  
(MAC_SEL =  
00b)  
RMII  
(MAC_SEL =  
01b)  
GMII  
(MAC_SEL =  
10b)  
J2  
H3  
J1  
MRXD0/RMRXD0  
MRXD1/RMRXD1  
MRXD2  
MRXD0  
MRXD1  
MRXD2  
MRXD3  
RMRXD0  
RMRXD1  
MRXD0  
MRXD1  
MRXD2  
MRXD3  
MRXD4  
MRXD5  
MRXD6  
MRXD7  
J3  
MRXD3  
L1  
L2  
H2  
M2  
MRXD4  
MRXD5  
MRXD6  
MRXD7  
M1  
L4  
MTXD0/RMTXD0  
MTXD1/RMTXD1  
MTXD2  
MTXD0  
MTXD1  
MTXD2  
MTXD3  
RMTXD0  
RMTXD1  
MTXD0  
MTXD1  
MTXD2  
MTXD3  
MTXD4  
MTXD5  
MTXD6  
MTXD7  
M4  
K4  
L3  
MTXD3  
MTXD4  
L5  
MTXD5  
M3  
N5  
MTXD6  
MTXD7  
H4  
H5  
J5  
MRXER/RMRXER  
MRXDV  
MRXER  
MRXDV  
MTXEN  
MCRS  
RMRXER  
MRXER  
MRXDV  
MTXEN  
MCRS  
MTXEN/RMTXEN  
MCRS/RMCRSDV  
MCOL  
RMTXEN  
J4  
RMCRSDV  
K3  
MCOL  
MCOL  
K5  
H1  
N4  
GMTCLK  
GMTCLK  
MRCLK  
MTCLK  
MRCLK  
MRCLK  
MTCLK  
MTCLK/REFCLK  
RMREFCLK  
N3  
M5  
GMDIO  
MDIO  
MDIO  
MDIO  
GMDCLK  
MDCLK  
MDCLK  
MDCLK  
Using the RMII Mode of the EMAC  
The Ethernet Media Access Controller (EMAC) contains logic that allows it to communicate using the  
Reduced Media Independent Interface (RMII) protocol. This logic must be taken out of reset before being  
used. To use the RMII mode of the EMAC follow these steps:  
1. Enable the EMAC/MDIO through the Device State Control Registers.  
–
–
–
Unlock the PERCFG0 register by writing 0x0F0A 0B00 to the PERLOCK register.  
Set bit 4 in the PERCFG0 register within 16 SYSCLK3 clock cycles to enable the EMAC/MDIO.  
Poll the PERSTAT0 register to verify state change.  
2. Initialize the EMAC/MDIO as needed.  
3. Release the RMII logic from reset by clearing the RMII_RST bit of the EMAC Configuration Register  
(see Section 3.4.5).  
As described in the previous section, the RMII mode of the EMAC must be selected by setting  
MACSEL[1:0] = 01b at device reset.  
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Interface Mode Clocking  
The on-chip PLL2 and PLL2 Controller generate all the clocks to the EMAC module. When enabled, the  
input clock to the PLL2 Controller (CLKIN2) must have a 25 MHz frequency. For more information, see  
Section 7.8, PLL2 and PLL2 Controller.  
The EMAC uses SYSCLK1 of the PLL2 Controller to generate the necessary clocks for the GMII and  
RGMII modes. When these modes are used, the frequency of CLKIN2 must be 25 MHz. Also, divider D1  
should be programmed to ÷2 mode [default] when using the GMII mode and to ÷5 mode when using the  
RGMII mode. Divider D1 is software programmable and, if necessary, must be programmed after device  
reset to ÷5 when the RGMII mode of the EMAC is used.  
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7.14.2 EMAC Peripheral Register Description(s)  
Table 7-71. Ethernet MAC (EMAC) Control Registers  
HEX ADDRESS RANGE  
02C8 0000  
ACRONYM  
TXIDVER  
REGISTER NAME  
Transmit Identification and Version Register  
Transmit Control Register  
02C8 0004  
TXCONTROL  
02C8 0008  
TXTEARDOWN  
-
Transmit Teardown Register  
02C8 000F  
Reserved  
02C8 0010  
RXIDVER  
Receive Identification and Version Register  
Receive Control Register  
02C8 0014  
RXCONTROL  
02C8 0018  
RXTEARDOWN  
-
Receive Teardown Register  
02C8 001C  
Reserved  
02C8 0020 - 02C8 007C  
02C8 0080  
-
Reserved  
TXINTSTATRAW  
TXINTSTATMASKED  
TXINTMASKSET  
TXINTMASKCLEAR  
MACINVECTOR  
-
Transmit Interrupt Status (Unmasked) Register  
Transmit Interrupt Status (Masked) Register  
Transmit Interrupt Mask Set Register  
Transmit Interrupt Mask Clear Register  
MAC Input Vector Register  
02C8 0084  
02C8 0088  
02C8 008C  
02C8 0090  
02C8 0194 - 02C8 019C  
02C8 01A0  
Reserved  
RXINTSTATRAW  
RXINTSTATMASKED  
RXINTMASKSET  
RXINTMASKCLEAR  
MACINTSTATRAW  
MACINTSTATMASKED  
MACINTMASKSET  
MACINTMASKCLEAR  
-
Receive Interrupt Status (Unmasked) Register  
Receive Interrupt Status (Masked) Register  
Receive Interrupt Mask Set Register  
Receive Interrupt Mask Clear Register  
MAC Interrupt Status (Unmasked) Register  
MAC Interrupt Status (Masked) Register  
MAC Interrupt Mask Set Register  
01C8 01A4  
01C8 01A8  
01C8 01AC  
01C8 01B0  
01C8 01B4  
01C8 01B8  
01C8 01BC  
02C8 00C0 - 02C8 00FC  
02C8 0100  
MAC Interrupt Mask Clear Register  
Reserved  
RXMBPENABLE  
RXUNICASTSET  
RXUNICASTCLEAR  
RXMAXLEN  
Receive Multicast/Broadcast/Promiscuous Channel Enable Register  
Receive Unicast Enable Set Register  
Receive Unicast Clear Register  
02C8 0104  
02C8 0108  
02C8 010C  
Receive Maximum Length Register  
Receive Buffer Offset Register  
02C8 0110  
RXBUFFEROFFSET  
RXFILTERLOWTHRESH  
-
02C8 0114  
Receive Filter Low Priority Frame Threshold Register  
Reserved  
02C8 0118 - 02C8 011C  
02C8 0120  
RX0FLOWTHRESH  
RX1FLOWTHRESH  
RX2FLOWTHRESH  
RX3FLOWTHRESH  
RX4FLOWTHRESH  
RX5FLOWTHRESH  
RX6FLOWTHRESH  
RX7FLOWTHRESH  
RX0FREEBUFFER  
RX1FREEBUFFER  
RX2FREEBUFFER  
RX3FREEBUFFER  
RX4FREEBUFFER  
Receive Channel 0 Flow Control Threshold Register  
Receive Channel 1 Flow Control Threshold Register  
Receive Channel 2 Flow Control Threshold Register  
Receive Channel 3 Flow Control Threshold Register  
Receive Channel 4 Flow Control Threshold Register  
Receive Channel 5 Flow Control Threshold Register  
Receive Channel 6 Flow Control Threshold Register  
Receive Channel 7 Flow Control Threshold Register  
Receive Channel 0 Free Buffer Count Register  
Receive Channel 1 Free Buffer Count Register  
Receive Channel 2 Free Buffer Count Register  
Receive Channel 3 Free Buffer Count Register  
Receive Channel 4 Free Buffer Count Register  
02C8 0124  
02C8 0128  
02C8 012C  
02C8 0130  
02C8 0134  
02C8 0138  
02C8 013C  
02C8 0140  
02C8 0144  
02C8 0148  
02C8 014C  
02C8 0150  
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Table 7-71. Ethernet MAC (EMAC) Control Registers (continued)  
HEX ADDRESS RANGE  
02C8 0154  
ACRONYM  
RX5FREEBUFFER  
RX6FREEBUFFER  
RX7FREEBUFFER  
MACCONTROL  
MACSTATUS  
EMCONTROL  
FIFOCONTROL  
MACCONFIG  
SOFTRESET  
-
REGISTER NAME  
Receive Channel 5 Free Buffer Count Register  
Receive Channel 6 Free Buffer Count Register  
Receive Channel 7 Free Buffer Count Register  
MAC Control Register  
02C8 0158  
02C8 015C  
02C8 0160  
02C8 0164  
MAC Status Register  
02C8 0168  
Emulation Control Register  
02C8 016C  
FIFO Control Register (Transmit and Receive)  
MAC Configuration Register  
Soft Reset Register  
02C8 0170  
02C8 0174  
02C8 0178 - 02C8 01CC  
02C8 01D0  
Reserved  
MACSRCADDRLO  
MACSRCADDRHI  
MACHASH1  
MACHASH2  
BOFFTEST  
TPACETEST  
RXPAUSE  
MAC Source Address Low Bytes Register (Lower 32-bits)  
MAC Source Address High Bytes Register (Upper 32-bits)  
MAC Hash Address Register 1  
MAC Hash Address Register 2  
Back Off Test Register  
02C8 01D4  
02C8 01D8  
02C8 01DC  
02C8 01E0  
02C8 01E4  
Transmit Pacing Algorithm Test Register  
Receive Pause Timer Register  
Transmit Pause Timer Register  
Reserved  
02C8 01E8  
02C8 01EC  
TXPAUSE  
02C8 01F0 - 02C8 01FC  
02C8 0200 - 02C8 02FC  
02C8 0300 - 02C8 03FC  
02C8 0400 - 02C8 04FC  
-
(see Table 7-72)  
-
EMAC Statistics Registers  
Reserved  
-
Reserved  
MAC Address Low Bytes Register (used in receive address  
matching)  
02C8 0500  
02C8 0504  
MACADDRLO  
MACADDRHI  
MAC Address High Bytes Register (used in receive address  
matching)  
02C8 0508  
02C8 050C - 02C8 05FC  
02C8 0600  
MACINDEX  
-
MAC Index Register  
Reserved  
TX0HDP  
TX1HDP  
TX2HDP  
TX3HDP  
TX4HDP  
TX5HDP  
TX6HDP  
TX7HDP  
RX0HDP  
RX1HDP  
RX2HDP  
RX3HDP  
RX4HDP  
RX5HDP  
RX6HDP  
RX7HDP  
Transmit Channel 0 DMA Head Descriptor Pointer Register  
Transmit Channel 1 DMA Head Descriptor Pointer Register  
Transmit Channel 2 DMA Head Descriptor Pointer Register  
Transmit Channel 3 DMA Head Descriptor Pointer Register  
Transmit Channel 4 DMA Head Descriptor Pointer Register  
Transmit Channel 5 DMA Head Descriptor Pointer Register  
Transmit Channel 6 DMA Head Descriptor Pointer Register  
Transmit Channel 7 DMA Head Descriptor Pointer Register  
Receive Channel 0 DMA Head Descriptor Pointer Register  
Receive Channel 1 DMA Head Descriptor Pointer Register  
Receive Channel 2 DMA Head Descriptor Pointer Register  
Receive Channel 3 DMA Head Descriptor Pointer Register  
Receive Channel 4 DMA Head Descriptor Pointer Register  
Receive Channel 5 DMA Head Descriptor Pointer Register  
Receive Channel 6 DMA Head Descriptor Pointer Register  
Receive Channel 7 DMA Head Descriptor Pointer Register  
02C8 0604  
02C8 0608  
02C8 060C  
02C8 0610  
02C8 0614  
02C8 0618  
02C8 061C  
02C8 0620  
02C8 0624  
02C8 0628  
02C8 062C  
02C8 0630  
02C8 0634  
02C8 0638  
02C8 063C  
Transmit Channel 0 Completion Pointer (Interrupt Acknowledge)  
Register  
02C8 0640  
02C8 0644  
TX0CP  
TX1CP  
Transmit Channel 1 Completion Pointer (Interrupt Acknowledge)  
Register  
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Table 7-71. Ethernet MAC (EMAC) Control Registers (continued)  
HEX ADDRESS RANGE  
ACRONYM  
REGISTER NAME  
Transmit Channel 2 Completion Pointer (Interrupt Acknowledge)  
Register  
02C8 0648  
TX2CP  
Transmit Channel 3 Completion Pointer (Interrupt Acknowledge)  
Register  
02C8 064C  
02C8 0650  
02C8 0654  
02C8 0658  
02C8 065C  
02C8 0660  
02C8 0664  
02C8 0668  
02C8 066C  
02C8 0670  
02C8 0674  
02C8 0678  
TX3CP  
TX4CP  
TX5CP  
TX6CP  
TX7CP  
RX0CP  
RX1CP  
RX2CP  
RX3CP  
RX4CP  
RX5CP  
RX6CP  
Transmit Channel 4 Completion Pointer (Interrupt Acknowledge)  
Register  
Transmit Channel 5 Completion Pointer (Interrupt Acknowledge)  
Register  
Transmit Channel 6 Completion Pointer (Interrupt Acknowledge)  
Register  
Transmit Channel 7 Completion Pointer (Interrupt Acknowledge)  
Register  
Receive Channel 0 Completion Pointer (Interrupt Acknowledge)  
Register  
Receive Channel 1 Completion Pointer (Interrupt Acknowledge)  
Register  
Receive Channel 2 Completion Pointer (Interrupt Acknowledge)  
Register  
Receive Channel 3 Completion Pointer (Interrupt Acknowledge)  
Register  
Receive Channel 4 Completion Pointer (Interrupt Acknowledge)  
Register  
Receive Channel 5 Completion Pointer (Interrupt Acknowledge)  
Register  
Receive Channel 6 Completion Pointer (Interrupt Acknowledge)  
Register  
Receive Channel 7 Completion Pointer (Interrupt Acknowledge)  
Register  
02C8 067C  
RX7CP  
-
02C8 0680 - 02C8 06FC  
Reserved  
Reserved  
was State RAM Test Access Registers  
Processor Read and Write Access to Head Descriptor Pointers and  
Interrupt Acknowledge Registers  
02C8 0700 - 02C8 077C  
02C8 0780 - 02C8 0FFF  
-
-
Reserved  
Table 7-72. EMAC Statistics Registers  
HEX ADDRESS RANGE  
ACRONYM  
REGISTER NAME  
02C8 0200  
RXGOODFRAMES  
Good Receive Frames Register  
Broadcast Receive Frames Register  
(Total number of good broadcast frames received)  
02C8 0204  
RXBCASTFRAMES  
Multicast Receive Frames Register  
(Total number of good multicast frames received)  
02C8 0208  
02C8 020C  
02C8 0210  
RXMCASTFRAMES  
RXPAUSEFRAMES  
RXCRCERRORS  
Pause Receive Frames Register  
Receive CRC Errors Register (Total number of frames received with  
CRC errors)  
Receive Alignment/Code Errors Register  
(Total number of frames received with alignment/code errors)  
02C8 0214  
02C8 0218  
02C8 021C  
RXALIGNCODEERRORS  
RXOVERSIZED  
Receive Oversized Frames Register  
(Total number of oversized frames received)  
Receive Jabber Frames Register  
(Total number of jabber frames received)  
RXJABBER  
Receive Undersized Frames Register  
(Total number of undersized frames received)  
02C8 0220  
02C8 0224  
RXUNDERSIZED  
RXFRAGMENTS  
Receive Frame Fragments Register  
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Table 7-72. EMAC Statistics Registers (continued)  
HEX ADDRESS RANGE  
02C8 0228  
ACRONYM  
RXFILTERED  
REGISTER NAME  
Filtered Receive Frames Register  
Received QOS Filtered Frames Register  
02C8 022C  
RXQOSFILTERED  
Receive Octet Frames Register  
(Total number of received bytes in good frames)  
02C8 0230  
02C8 0234  
RXOCTETS  
Good Transmit Frames Register  
(Total number of good frames transmitted)  
TXGOODFRAMES  
02C8 0238  
02C8 023C  
02C8 0240  
02C8 0244  
02C8 0248  
02C8 024C  
02C8 0250  
02C8 0254  
02C8 0258  
02C8 025C  
02C8 0260  
02C8 0264  
02C8 0268  
02C8 026C  
02C8 0270  
02C8 0274  
02C8 0278  
02C8 027C  
02C8 0280  
02C8 0284  
02C8 0288  
TXBCASTFRAMES  
TXMCASTFRAMES  
TXPAUSEFRAMES  
TXDEFERRED  
Broadcast Transmit Frames Register  
Multicast Transmit Frames Register  
Pause Transmit Frames Register  
Deferred Transmit Frames Register  
Transmit Collision Frames Register  
Transmit Single Collision Frames Register  
Transmit Multiple Collision Frames Register  
Transmit Excessive Collision Frames Register  
Transmit Late Collision Frames Register  
Transmit Underrun Error Register  
TXCOLLISION  
TXSINGLECOLL  
TXMULTICOLL  
TXEXCESSIVECOLL  
TXLATECOLL  
TXUNDERRUN  
TXCARRIERSENSE  
TXOCTETS  
Transmit Carrier Sense Errors Register  
Transmit Octet Frames Register  
FRAME64  
Transmit and Receive 64 Octet Frames Register  
FRAME65T127  
FRAME128T255  
FRAME256T511  
FRAME512T1023  
FRAME1024TUP  
NETOCTETS  
Transmit and Receive 65 to 127 Octet Frames Register  
Transmit and Receive 128 to 255 Octet Frames Register  
Transmit and Receive 256 to 511 Octet Frames Register  
Transmit and Receive 512 to 1023 Octet Frames Register  
Transmit and Receive 1024 to 1518 Octet Frames Register  
Network Octet Frames Register  
RXSOFOVERRUNS  
RXMOFOVERRUNS  
Receive FIFO or DMA Start of Frame Overruns Register  
Receive FIFO or DMA Middle of Frame Overruns Register  
Receive DMA Start of Frame and Middle of Frame Overruns  
Register  
02C8 028C  
RXDMAOVERRUNS  
-
02C8 0290 - 02C8 02FC  
Reserved  
Table 7-73. EMAC Control Module Registers  
HEX ADDRESS RANGE  
02C8 1000  
ACRONYM  
REGISTER NAME  
-
EWCTL  
EWINTTCNT  
-
Reserved  
02C8 1004  
EMAC Control Module Interrupt Control Register  
EMAC Control Module Interrupt Timer Count Register  
Reserved  
02C8 1008  
02C8 100C - 02C8 17FF  
Table 7-74. EMAC Descriptor Memory  
HEX ADDRESS RANGE  
ACRONYM  
DESCRIPTION  
02C8 2000 - 02C8 3FFF  
-
EMAC Descriptor Memory  
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7.14.3 EMAC Electrical Data/Timing  
7.14.3.1 EMAC MII and GMII Electrical Data/Timing  
Table 7-75. Timing Requirements for MRCLK - MII and GMII Operation (see Figure 7-59)  
-720  
-850  
-1000  
NO.  
UNIT  
1000 Mbps  
(GMII Only)  
100 Mbps  
10 Mbps  
MIN  
8
MAX  
MIN  
40  
MAX  
MIN  
400  
140  
140  
MAX  
1
2
3
4
tc(MRCLK)  
tw(MRCLKH)  
tw(MRCLKL)  
tt(MRCLK)  
Cycle time, MRCLK  
ns  
ns  
ns  
ns  
Pulse duration, MRCLK high  
Pulse duration, MRCLK low  
Transition time, MRCLK  
2.8  
2.8  
14  
14  
1
3
3
4
1
4
2
3
MRCLK  
(Input)  
Figure 7-59. MRCLK Timing (EMAC – Receive) [MII and GMII Operation]  
Table 7-76. Timing Requirements for MTCLK - MII and GMII Operation (see Figure 7-60)  
-720  
-850  
-1000  
NO.  
UNIT  
100 Mbps  
10 Mbps  
MIN  
MIN  
40  
MAX  
MAX  
1
2
3
4
tc(MTCLK)  
tw(MTCLKH)  
tw(MTCLKL)  
tt(MTCLK)  
Cycle time, MTCLK  
400  
ns  
ns  
ns  
ns  
Pulse duration, MTCLK high  
Pulse duration, MTCLK low  
Transition time, MTCLK  
14  
140  
14  
140  
3
3
4
1
4
2
3
MTCLK  
(Input)  
Figure 7-60. MTCLK Timing (EMAC – Transmit) [MII and GMII Operation]  
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Table 7-77. Switching Characteristics Over Recommended Operating Conditions for GMTCLK - GMII  
Operation (see Figure 7-61)  
-720  
-850  
-1000  
NO.  
UNIT  
1000 Mbps  
MIN  
8
MAX  
1
2
3
4
tc(GMTCLK)  
tw(GMTCLKH)  
tw(GMTCLKL)  
tt(GMTCLK)  
Cycle time, GMTCLK  
ns  
ns  
ns  
ns  
Pulse duration, GMTCLK high  
Pulse duration, GMTCLK low  
Transition time, GMTCLK  
2.8  
2.8  
1
4
1
4
2
3
GMTCLK  
(Output)  
Figure 7-61. GMTCLK Timing (EMAC – Transmit) [GMII Operation]  
Table 7-78. Timing Requirements for EMAC MII and GMII Receive 10/100/1000 Mbit/s(1) (see Figure 7-62)  
-720  
-850  
-1000  
NO.  
UNIT  
1000 Mbps  
MIN  
100/10 Mbps  
MIN  
MAX  
MAX  
Setup time, receive selected signals valid before  
MRCLK high  
1
2
tsu(MRXD-MRCLKH)  
th(MRCLKH-MRXD)  
2
0
8
8
ns  
ns  
Hold time, receive selected signals valid after  
MRCLK high  
(1) For MII, Receive selected signals include: MRXD[3:0], MRXDV, and MRXER. For GMII, Receive selected signals include: MRXD[7:0],  
MRXDV, and MRXER.  
1
2
MRCLK (Input)  
MRXD7−MRXD4(GMII only),  
MRXD3−MRXD0,  
MRXDV, MRXER (Inputs)  
Figure 7-62. EMAC Receive Interface Timing [MII and GMII Operation]  
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Table 7-79. Switching Characteristics Over Recommended Operating Conditions for EMAC MII and GMII  
Transmit 10/100 Mbit/s(1) (see Figure 7-63)  
-720  
-850  
-1000  
NO.  
PARAMETER  
UNIT  
100/10 Mbps  
MIN  
MAX  
1
td(MTCLKH-MTXD)  
Delay time, MTCLK high to transmit selected signals valid  
5
25  
ns  
(1) For MII, Transmit selected signals include: MTXD[3:0] and MTXEN. For GMII, Transmit selected signals include: GMTXD[7:0] and  
MTXEN.  
1
MTCLK (Input)  
MTXD7−MTXD4(GMII only),  
MTXD3−MTXD0,  
MTXEN (Outputs)  
Figure 7-63. EMAC Transmit Interface Timing [MII and GMII Operation]  
Table 7-80. Switching Characteristics Over Recommended Operating Conditions for EMAC GMII Transmit  
1000 Mbit/s(1) (see Figure 7-64)  
-720  
-850  
-1000  
NO.  
PARAMETER  
UNIT  
1000 Mbps  
MIN  
MAX  
1
td(GMTCLKH-MTXD) Delay time, GMTCLK high to transmit selected signals valid  
0.5  
5
ns  
(1) For GMII, Transmit selected signals include: GMTXD[7:0] and MTXEN.  
1
GMTCLK (Output)  
MTXD7−MTXD0,  
MTXEN (Outputs)  
Figure 7-64. EMAC Transmit Interface Timing [GMII Operation]  
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7.14.3.2 EMAC RMII Electrical Data/Timing  
The RMREFCLK pin is used to source a clock to the EMAC when it is configured for RMII operation. The  
RMREFCLK frequency should be 50 MHz ±50 PPM with a duty cycle between 35% and 65%, inclusive.  
Table 7-81. Timing Requirements for RMREFCLK - RMII Operation (see Figure 7-65)  
-720  
-850  
-1000  
NO.  
PARAMETER  
UNIT  
MIN  
MAX  
13  
1
2
3
tw(RMREFCLKH)  
tw(RMREFCLKL)  
tt(RMREFCLK)  
Pulse duration, RMREFCLK high  
Pulse duration, RMREFCLK low  
Transition time, RMREFCLK  
7
7
ns  
ns  
ns  
13  
2
3
1
RMREFCLK  
(Input)  
2
3
Figure 7-65. RMREFCLK Timing  
Table 7-82. Switching Characteristics Over Recommended Operating Conditions for EMAC RMII Transmit  
10/100 Mbit/s(1) (see Figure 7-66)  
-720  
-850  
-1000  
NO.  
PARAMETER  
UNIT  
1000 Mbps  
MIN  
MAX  
1
td(RMREFCLKH-MTXD)  
Delay time, RMREFCLK high to transmit selected signals valid  
3
10  
ns  
(1) For RMII, transmit selected signals include: MTXD[1:0] and MTXEN.  
1
RMREFCLK  
(Input)  
MTXD1-MTXD0,  
MTXEN (Outputs)  
Figure 7-66. EMAC Transmit Interface Timing [RMII Operation]  
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Table 7-83. Timing Requirements for EMAC RMII Input Receive for 100 Mbps(1) (see Figure 7-67)  
-720  
-850  
-1000  
NO.  
UNIT  
MIN  
MAX  
Setup time, receive selected signals valid before MREFCLK (at DSP)  
high/low  
1
2
tsu(MRXD-MREFCLK)  
4.0  
2.0  
ns  
ns  
th(MREFCLK-MRXD) Hold time, receive selected signals valid after MREFCLK (at DSP) high/low  
(1) For RMII, receive selected signals include: MRXD[1:0], MRXER, and MCRSDV.  
3
1
RMREFCLK  
(Input)  
2
3
4
5
MRXD1-MRXD0,  
MCRSDV,  
MRXER (Inputs)  
Figure 7-67. EMAC Receive Interface Timing [RMII Operation]  
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7.14.3.3 EMAC RGMII Electrical Data/Timing  
An extra clock signal, RGREFCLK, running at 125 MHz is included as a convenience to the user. Note  
that this reference clock is not a free-running clock. This should only be used by an external device if it  
does not expect a valid clock during device reset.  
Table 7-84. Switching Characteristics Over Recommended Operating Conditions for EMAC RGREFCLK -  
RGMII Operation (see Figure 7-68)  
-720  
-850  
-1000  
NO.  
PARAMETER  
UNIT  
MIN  
MAX  
8 + 0.8  
4.8  
1
2
3
4
tc(RGFCLK)  
tw(RGFCLKH)  
tw(RGFCLKL)  
tt(RGFCLK)  
Cycle time, RGREFCLK  
8 - 0.8  
3.2  
ns  
ns  
ns  
ns  
Pulse duration, RGREFCLK high  
Pulse duration, RGREFCLK low  
Transition time, RGREFCLK  
3.2  
4.8  
0.75  
1
4
2
RGREFCLK  
(Output)  
3
4
Figure 7-68. RGREFCLK Timing  
Table 7-85. Timing Requirements for RXC - RGMII Operation (see Figure 7-69)  
-720  
-850  
-1000  
NO.  
UNIT  
MIN  
MAX  
10 Mbps  
360  
36  
440  
44  
1
2
3
4
tc(RXC)  
Cycle time, RXC  
100 Mbps  
1000 Mbps  
10 Mbps  
ns  
ns  
ns  
ns  
7.2  
8.8  
0.40*tc(RXC) 0.60*tc(RXC)  
0.40*tc(RXC) 0.60*tc(RXC)  
0.45*tc(RXC) 0.55*tc(RXC)  
0.40*tc(RXC) 0.60*tc(RXC)  
0.40*tc(RXC) 0.60*tc(RXC)  
0.45*tc(RXC) 0.55*tc(RXC)  
0.75  
tw(RXCH)  
tw(RXCL)  
tt(RXC)  
Pulse duration, RXC high  
Pulse duration, RXC low  
Transition time, RXC  
100 Mbps  
1000 Mbps  
10 Mbps  
100 Mbps  
1000 Mbps  
10 Mbps  
100 Mbps  
1000 Mbps  
0.75  
0.75  
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Table 7-86. Timing Requirements for EMAC RGMII Input Receive for 10/100/1000 Mbps(1) (see Figure 7-69)  
-720  
-850  
-1000  
NO.  
UNIT  
MIN  
MAX  
5
6
tsu(RXD-RXCH)  
th(RXCH-RXD)  
Setup time, receive selected signals valid before RXC (at DSP) high/low  
Hold time, receive selected signals valid after RXC (at DSP) high/low  
1.0  
1.0  
ns  
ns  
(1) For RGMII, receive selected signals include: RXD[3:0] and RXCTL.  
1
4
2
4
3
RXC  
(B)  
(at DSP)  
5
1st Half-byte  
6
2nd Half-byte  
(A)  
RXD[3:0]  
RXD[3:0]  
RXDV  
RXD[7:4]  
RXERR  
(A)  
RXCTL  
A. Data and control information is received using both edges of the clocks. RXD[3:0] carries data bits 3-0 on the rising  
edge of RXC and data bits 7-4 on the falling edge of RXC. Similarly, RXCTL carries RXDV on rising edge of RXC and  
RXERR on falling edge  
B. RXC must be externally delayed relative to the data and control pins.  
Figure 7-69. EMAC Receive Interface Timing [RGMII Operation](A)(B)  
Table 7-87. Switching Characteristics Over Recommended Operating Conditions for TXC - RGMII  
Operation for 10/100/1000 Mbit/s (see Figure 7-70)  
-720  
-850  
-1000  
NO.  
UNIT  
MIN  
MAX  
10 Mbps  
360  
440  
44  
1
2
3
4
tc(TXC)  
Cycle time, TXC  
100 Mbps  
1000 Mbps  
10 Mbps  
36  
ns  
ns  
ns  
ns  
7.2  
8.8  
0.40*tc(TXC) 0.60*tc(TXC)  
0.40*tc(TXC) 0.60*tc(TXC)  
0.45*tc(TXC) 0.55*tc(TXC)  
0.40*tc(TXC) 0.60*tc(TXC)  
0.40*tc(TXC) 0.60*tc(TXC)  
0.45*tc(TXC) 0.55*tc(TXC)  
0.75  
tw(TXCH)  
tw(TXCL)  
tt(TXC)  
Pulse duration, TXC high  
Pulse duration, TXC low  
Transition time, TXC  
100 Mbps  
1000 Mbps  
10 Mbps  
100 Mbps  
1000 Mbps  
10 Mbps  
100 Mbps  
1000 Mbps  
0.75  
0.75  
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Table 7-88. Switching Characteristics Over Recommended Operating Conditions for EMAC RGMII  
Transmit (1)(see Figure 7-70)  
-720  
-850  
-1000  
NO.  
PARAMETER  
UNIT  
MIN  
MAX  
5
6
tsu(TXD-TXCH)  
th(TXCH-TXD)  
Setup time, transmit selected signals valid before TXC (at DSP) high/low  
Hold time, transmit selected signals valid after TXC (at DSP) high/low  
1.2  
1.2  
ns  
(1) For RGMII, transmit selected signals include: TXD[3:0] and TXCTL.  
TXC at DSP pins  
1
Internal TXC  
4
4
2
3
(B)  
TXC (at DSP)  
1
5
(A)  
1st Half-byte  
2nd Half-byte  
TXERR  
TXD[3:0]  
TXCTL  
6
2
(A)  
TXEN  
A. Data and control information is transmitted using both edges of the clocks. TXD[3:0] carries data bits 3-0 on the rising  
edge of TXC and data bits 7-4 on the falling edge of TXC. Similarly, TX_CTL carries TXEN on rising edge of TXC and  
TXERR of falling edge.  
B. TXC is delayed internally before being driven to the TXC pin.  
Figure 7-70. EMAC Transmit Interface Timing [RGMII Operation](A)(B)  
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7.14.4 Management Data Input/Output (MDIO)  
The Management Data Input/Output (MDIO) module implements the 802.3 serial management interface to  
interrogate and controls up to 32 Ethernet PHY(s) connected to the device, using a shared two-wire bus.  
Application software uses the MDIO module to configure the auto-negotiation parameters of each PHY  
attached to the EMAC, retrieve the negotiation results, and configure required parameters in the EMAC  
module for correct operation. The module is designed to allow almost transparent operation of the MDIO  
interface, with very little maintenance from the core processor.  
The EMAC control module is the main interface between the device core processor, the MDIO module,  
and the EMAC module. The relationship between these three components is shown in Figure 7-58.  
The MDIO uses the same pins for the MII, GMII, and RMII modes. Standalone pins are included for the  
RGMII mode due to specific voltage requirements. Only one mode can be used at a time. The mode used  
is selected at device reset based on the MACSEL[1:0] configuration pins (for more detailed information,  
see Section 3, Device Configuration). Table 7-70 above shows which multiplexed pin are used in the MII,  
GMII, and RMII modes on the MDIO.  
For more detailed information on the EMAC/MDIO, see the TMS320C645x DSP EMAC/MDIO Module  
Reference Guide (literature number SPRU975).  
7.14.4.1 MDIO Device-Specific Information  
Clocking Information  
The MDIO clock is based on a divide-down of the SYSCLK3 (from the PLL1 controller) and is specified to  
run up to 2.5 MHz, although typical operation is 1.0 MHz. Since the peripheral clock frequency is variable,  
the application software or driver controls the divide-down amount.  
7.14.4.2 MDIO Peripheral Register Description(s)  
Table 7-89. MDIO Registers  
HEX ADDRESS RANGE  
02C8 1800  
ACRONYM  
VERSION  
REGISTER NAME  
MDIO Version Register  
MDIO Control Register  
02C8 1804  
CONTROL  
02C8 1808  
ALIVE  
MDIO PHY Alive Status Register  
02C8 180C  
LINK  
MDIO PHY Link Status Register  
02C8 1810  
LINKINTRAW  
LINKINTMASKED  
-
MDIO Link Status Change Interrupt (Unmasked) Register  
MDIO Link Status Change Interrupt (Masked) Register  
Reserved  
02C8 1814  
02C8 1818 - 02C8 181C  
02C8 1820  
USERINTRAW  
USERINTMASKED  
USERINTMASKSET  
USERINTMASKCLEAR  
-
MDIO User Command Complete Interrupt (Unmasked) Register  
MDIO User Command Complete Interrupt (Masked) Register  
MDIO User Command Complete Interrupt Mask Set Register  
MDIO User Command Complete Interrupt Mask Clear Register  
Reserved  
02C8 1824  
02C8 1828  
02C8 182C  
02C8 1830 - 02C8 187C  
02C8 1880  
USERACCESS0  
USERPHYSEL0  
USERACCESS1  
USERPHYSEL1  
-
MDIO User Access Register 0  
02C8 1884  
MDIO User PHY Select Register 0  
02C8 1888  
MDIO User Access Register 1  
02C8 188C  
MDIO User PHY Select Register 1  
02C8 1890 - 02C8 1FFF  
Reserved  
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7.14.4.3 MDIO Electrical Data/Timing  
Table 7-90. Timing Requirements for MDIO Input (R)(G)MII (see Figure 7-71)  
-720  
-850  
-1000  
NO.  
UNIT  
MIN  
MAX  
1
2a  
2b  
3
tc(MDCLK)  
Cycle time, MDCLK  
400  
180  
180  
ns  
ns  
ns  
ns  
ns  
ns  
tw(MDCLK)  
Pulse duration, MDCLK high  
tw(MDCLK)  
Pulse duration, MDCLK low  
tt(MDCLK)  
Transition time, MDCLK  
5
4
tsu(MDIO-MDCLKH)  
th(MDCLKH-MDIO)  
Setup time, MDIO data input valid before MDCLK high  
Hold time, MDIO data input valid after MDCLK high  
10  
10  
5
1
MDCLK  
3
4
MDIO  
(input)  
Figure 7-71. MDIO Input Timing  
Table 7-91. Switching Characteristics Over Recommended Operating Conditions for MDIO Output  
(see Figure 7-72)  
-720  
-850  
-1000  
NO.  
PARAMETER  
UNIT  
MIN  
MAX  
7
td(MDCLKL-MDIO)  
Delay time, MDCLK low to MDIO data output valid  
100  
ns  
1
MDCLK  
7
MDIO  
(output)  
Figure 7-72. MDIO Output Timing  
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7.15 Timers  
The timers can be used to: time events, count events, generate pulses, interrupt the CPU, and send  
synchronization events to the EDMA3 channel controller.  
7.15.1 Timers Device-Specific Information  
The C6454 device has two general-purpose timers, Timer0 and Timer1, each of which can be configured  
as a general-purpose timer or a watchdog timer. When configured as a general-purpose timer, each timer  
can be programmed as a 64-bit timer or as two separate 32-bit timers.  
Each timer is made up of two 32-bit counters: a high counter and a low counter. The timer pins, TINPLx  
and TOUTLx are connected to the low counter. The high counter does not have any external device pins.  
7.15.2 Timers Peripheral Register Description(s)  
Table 7-92. Timer 0 Registers  
HEX ADDRESS RANGE  
ACRONYM  
REGISTER NAME  
COMMENTS  
0294 0000  
-
Reserved  
Timer 0 Emulation Management/Clock Speed  
Register  
0294 0004  
EMUMGT_CLKSPD0  
0294 0008  
0294 000C  
-
-
Reserved  
Reserved  
0294 0010  
CNTLO0  
CNTHI0  
PRDLO0  
PRDHI0  
TCR0  
TGCR0  
WDTCR0  
-
Timer 0 Counter Register Low  
Timer 0 Counter Register High  
Timer 0 Period Register Low  
Timer 0 Period Register High  
Timer 0 Control Register  
Timer 0 Global Control Register  
Timer 0 Watchdog Timer Control Register  
Reserved  
0294 0014  
0294 0018  
0294 001C  
0294 0020  
0294 0024  
0294 0028  
0294 002C  
0294 0030  
-
Reserved  
0294 0034 - 0297 FFFF  
-
Reserved  
Table 7-93. Timer 1 Registers  
HEX ADDRESS RANGE  
0298 0000  
ACRONYM  
REGISTER NAME  
Reserved  
COMMENTS  
-
0298 0004  
EMUMGT_CLKSPD1  
Timer 1 Emulation Management/Clock Speed Register  
Reserved  
0298 0008  
-
-
0298 000C  
Reserved  
0298 0010  
CNTLO1  
CNTHI1  
PRDLO1  
PRDHI1  
TCR1  
TGCR1  
WDTCR1  
-
Timer 1 Counter Register Low  
Timer 1 Counter Register High  
Timer 1 Period Register Low  
Timer 1 Period Register High  
Timer 1 Control Register  
Timer 1 Global Control Register  
Timer 1 Watchdog Timer Control Register  
Reserved  
0298 0014  
0298 0018  
0298 001C  
0298 0020  
0298 0024  
0298 0028  
0298 002C  
0298 0030  
-
Reserved  
0298 0034 - 0299 FFFF  
-
Reserved  
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7.15.3 Timers Electrical Data/Timing  
Table 7-94. Timing Requirements for Timer Inputs(1) (see Figure 7-73)  
-720  
-850  
-1000  
NO.  
UNIT  
MIN  
MAX  
1
2
tw(TINPH)  
tw(TINPL)  
Pulse duration, TINPLx high  
Pulse duration, TINPLx low  
12P  
12P  
ns  
ns  
(1) P = 1/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use P = 1 ns.  
Table 7-95. Switching Characteristics Over Recommended Operating Conditions for Timer Outputs(1)  
(see Figure 7-73)  
-720  
-850  
-1000  
NO.  
PARAMETER  
UNIT  
MIN  
MAX  
3
4
tw(TOUTH)  
tw(TOUTL)  
Pulse duration, TOUTLx high  
Pulse duration, TOUTLx low  
12P – 3  
12P – 3  
ns  
ns  
(1) P = 1/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use P = 1 ns.  
2
1
TINPLx  
4
3
TOUTLx  
Figure 7-73. Timer Timing  
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7.16 Peripheral Component Interconnect (PCI)  
The C6454 DSP supports connections to a PCI backplane via the integrated PCI master/slave bus  
interface. The PCI port interfaces to DSP internal resources via the data switched central resource. The  
data switched central resource is described in more detail in Section 4.  
For more detailed information on the PCI port peripheral module, see the TMS320C645x DSP Peripheral  
Component Interconnect (PCI) User's Guide (literature number SPRUE60).  
7.16.1 PCI Device-Specific Information  
The PCI peripheral on the C6454 DSP conforms to the PCI Local Bus Specification (version 2.3). The PCI  
peripheral can act both as a PCI bus master and as a target. It supports PCI bus operation of speeds up  
to 66 MHz and uses a 32-bit data/address bus.  
On the C6454 device, the pins of the PCI peripheral are multiplexed with the pins of the HPI and GPIO  
peripherals. PCI functionality for these pins is controlled (enabled/disabled) by the PCI_EN pin (Y29). The  
maximum speed of the PCI, 33 MHz or 66 MHz, is controlled through the PCI66 pin (U27). For more  
detailed information on the peripheral control, see Section 3, Device Configuration.  
The C6454 device provides an initialization mechanism through which the default values for some of the  
PCI configuration registers can be read from an I2C EEPROM. Table 7-96 shows the registers which can  
be initialized through the PCI auto-initialization. Also shown is the default value of these registers when  
PCI auto-initialization is not used. PCI auto-initialization is controlled (enabled/disabled) through the  
PCI_EEAI pin (P25). For more information on this feature, see the TMS320C645x DSP Peripheral  
Component Interconnect (PCI) User's Guide (literature number SPRUE60) and the TMS320C645x  
Bootloader User's Guide (literature number SPRUEC6).  
Table 7-96. Default Values for PCI Configuration  
Registers  
DEFAULT  
REGISTER  
VALUE  
Vendor ID/Device ID Register (PCIVENDEV)  
Class Code/Revision ID Register (PCICLREV)  
104C B000h  
0000 0001h  
0000 0000h  
Subsystem Vendor ID/Subsystem ID Register  
(PCISUBID)  
Max Latency/Min Grant/Interrupt Pin/Interrupt Line  
Register (PCILGINT)  
0000 0100h  
The on-chip Bootloader supports a host boot which allows an external PCI device to load application code  
into the DSP's memory space. The PCI boot is terminated when the Host generates a DSP interrupt. The  
Host can generate a DSP interrupt through the PCI peripheral by setting the DSPINT bit in the Back-End  
Application Interrupt Enable Set Register (PCIBINTSET) and the Status Set Register (PCISTATSET). For  
more information on the boot sequence of the C6454 DSP, see Section 2.4.  
NOTE  
After the host boot is complete, the DSP interrupt is registered in bit 0 (channel 0) of the  
EDMA Event Register (ER). This event must be cleared by software before triggering  
transfers on DMA channel 0.  
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7.16.2 PCI Peripheral Register Description(s)  
Table 7-97. PCI Configuration Registers  
PCI HOST ACCESS  
HEX ADDRESS OFFSET  
ACRONYM  
PCI HOST ACCESS REGISTER NAME  
Vendor ID/Device ID  
0x00  
0x04  
PCIVENDEV  
PCICSR  
PCICLREV  
PCICLINE  
PCIBAR0  
PCIBAR1  
PCIBAR2  
PCIBAR3  
PCIBAR4  
PCIBAR5  
-
Command/Status  
0x08  
Class Code/Revision ID  
BIST/Header Type/Latency Timer/Cacheline Size  
Base Address 0  
0x0C  
0x10  
0x14  
Base Address 1  
0x18  
Base Address 2  
0x1C  
Base Address 3  
0x20  
Base Address 4  
0x24  
Base Address 5  
0x28 - 0x2B  
0x2C  
Reserved  
PCISUBID  
-
Subsystem Vendor ID/Subsystem ID  
Reserved  
0x30  
0x34  
PCICPBPTR  
-
Capabilities Pointer  
Reserved  
0x38 - 0x3B  
0x3C  
PCILGINT  
-
Max Latency/Min Grant/Interrupt Pin/Interrupt Line  
Reserved  
0x40 - 0x7F  
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Table 7-98. PCI Back End Configuration Registers  
DSP ACCESS  
ACRONYM  
DSP ACCESS REGISTER NAME  
HEX ADDRESS RANGE  
02C0 0000 - 02C0 000F  
02C0 0010  
-
Reserved  
PCISTATSET  
PCISTATCLR  
-
PCI Status Set Register  
02C0 0014  
PCI Status Clear Register  
02C0 0018 - 02C0 001F  
02C0 0020  
Reserved  
PCIHINTSET  
PCIHINTCLR  
-
PCI Host Interrupt Enable Set Register  
PCI Host Interrupt Enable Clear Register  
Reserved  
02C0 0024  
02C0 0028 - 02C0 002F  
02C0 0030  
PCIBINTSET  
PCIBINTCLR  
PCIBCLKMGT  
-
PCI Back End Application Interrupt Enable Set Register  
PCI Back End Application Interrupt Enable Clear Register  
PCI Back End Application Clock Management Register  
Reserved  
02C0 0034  
02C0 0038  
02C0 003C - 02C0 00FF  
02C0 0100  
PCIVENDEVMIR PCI Vendor ID/Device ID Mirror Register  
PCICSRMIR PCI Command/Status Mirror Register  
PCICLREVMIR PCI Class Code/Revision ID Mirror Register  
02C0 0104  
02C0 0108  
02C0 010C  
PCICLINEMIR  
PCIBAR0MSK  
PCIBAR1MSK  
PCIBAR2MSK  
PCIBAR3MSK  
PCIBAR4MSK  
PCIBAR5MSK  
-
PCI BIST/Header Type/Latency Timer/Cacheline Size Mirror Register  
02C0 0110  
PCI Base Address Mask Register 0  
PCI Base Address Mask Register 1  
PCI Base Address Mask Register 2  
PCI Base Address Mask Register 3  
PCI Base Address Mask Register 4  
PCI Base Address Mask Register 5  
Reserved  
02C0 0114  
02C0 0118  
02C0 011C  
02C0 0120  
02C0 0124  
02C0 0128 - 02C0 012B  
02C0 012C  
PCISUBIDMIR  
-
PCI Subsystem Vendor ID/Subsystem ID Mirror Register  
Reserved  
02C0 0130  
02C0 0134  
PCICPBPTRMIR PCI Capabilities Pointer Mirror Register  
02C0 0138 - 02C0 013B  
02C0 013C  
-
Reserved  
PCILGINTMIR  
-
PCI Max Latency/Min Grant/Interrupt Pin/Interrupt Line Mirror Register  
Reserved  
02C0 0140 - 02C0 017F  
02C0 0180  
PCISLVCNTL  
-
PCI Slave Control Register  
02C0 0184 - 02C0 01BF  
02C0 01C0  
Reserved  
PCIBAR0TRL  
PCIBAR1TRL  
PCIBAR2TRL  
PCIBAR3TRL  
PCIBAR4TRL  
PCIBAR5TRL  
-
PCI Slave Base Address 0 Translation Register  
PCI Slave Base Address 1 Translation Register  
PCI Slave Base Address 2 Translation Register  
PCI Slave Base Address 3 Translation Register  
PCI Slave Base Address 4 Translation Register  
PCI Slave Base Address 5 Translation Register  
Reserved  
02C0 01C4  
02C0 01C8  
02C0 01CC  
02C0 01D0  
02C0 01D4  
02C0 01D8 - 02C0 01DF  
02C0 01E0  
PCIBAR0MIR  
PCIBAR1MIR  
PCIBAR2MIR  
PCIBAR3MIR  
PCIBAR4MIR  
PCIBAR5MIR  
-
PCI Base Address Register 0 Mirror Register  
PCI Base Address Register 1 Mirror Register  
PCI Base Address Register 2 Mirror Register  
PCI Base Address Register 3 Mirror Register  
PCI Base Address Register 4 Mirror Register  
PCI Base Address Register 5 Mirror Register  
Reserved  
02C0 01E4  
02C0 01E8  
02C0 01EC  
02C0 01F0  
02C0 01F4  
02C0 01F8 - 02C0 02FF  
02C0 0300  
PCIMCFGDAT PCI Master Configuration/IO Access Data Register  
PCIMCFGADR PCI Master Configuration/IO Access Address Register  
02C0 0304  
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Table 7-98. PCI Back End Configuration Registers (continued)  
DSP ACCESS  
HEX ADDRESS RANGE  
ACRONYM  
DSP ACCESS REGISTER NAME  
02C0 0308  
02C0 030C - 02C0 030F  
02C0 0310  
PCIMCFGCMD PCI Master Configuration/IO Access Command Register  
-
Reserved  
PCIMSTCFG  
PCI Master Configuration Register  
Table 7-99. DSP-to_PCI Address Translation Registers  
DSP ACCESS  
HEX ADDRESS RANGE  
ACRONYM  
DSP ACCESS REGISTER NAME  
02C0 0314  
02C0 0318  
02C0 031C  
02C0 0320  
02C0 0324  
02C0 0328  
02C0 032C  
02C0 0330  
02C0 0334  
02C0 0338  
02C0 033C  
02C0 0340  
02C0 0344  
02C0 0348  
02C0 034C  
02C0 0350  
02C0 0354  
02C0 0358  
02C0 035C  
02C0 0360  
02C0 0364  
02C0 0368  
02C0 036C  
02C0 0370  
02C0 0374  
02C0 0378  
02C0 037C  
02C0 0380  
02C0 0384  
02C0 0388  
02C0 038C  
02C0 0390  
PCIADDSUB0  
PCIADDSUB1  
PCIADDSUB2  
PCIADDSUB3  
PCIADDSUB4  
PCIADDSUB5  
PCIADDSUB6  
PCIADDSUB7  
PCIADDSUB8  
PCIADDSUB9  
PCI Address Substitute 0 Register  
PCI Address Substitute 1 Register  
PCI Address Substitute 2 Register  
PCI Address Substitute 3 Register  
PCI Address Substitute 4 Register  
PCI Address Substitute 5 Register  
PCI Address Substitute 6 Register  
PCI Address Substitute 7 Register  
PCI Address Substitute 8 Register  
PCI Address Substitute 9 Register  
PCIADDSUB10 PCI Address Substitute 10 Register  
PCIADDSUB11 PCI Address Substitute 11 Register  
PCIADDSUB12 PCI Address Substitute 12 Register  
PCIADDSUB13 PCI Address Substitute 13 Register  
PCIADDSUB14 PCI Address Substitute 14 Register  
PCIADDSUB15 PCI Address Substitute 15 Register  
PCIADDSUB16 PCI Address Substitute 16 Register  
PCIADDSUB17 PCI Address Substitute 17 Register  
PCIADDSUB18 PCI Address Substitute 18 Register  
PCIADDSUB19 PCI Address Substitute 19 Register  
PCIADDSUB20 PCI Address Substitute 20 Register  
PCIADDSUB21 PCI Address Substitute 21 Register  
PCIADDSUB22 PCI Address Substitute 22 Register  
PCIADDSUB23 PCI Address Substitute 23 Register  
PCIADDSUB24 PCI Address Substitute 24 Register  
PCIADDSUB25 PCI Address Substitute 25 Register  
PCIADDSUB26 PCI Address Substitute 26 Register  
PCIADDSUB27 PCI Address Substitute 27 Register  
PCIADDSUB28 PCI Address Substitute 28 Register  
PCIADDSUB29 PCI Address Substitute 29 Register  
PCIADDSUB30 PCI Address Substitute 30 Register  
PCIADDSUB31 PCI Address Substitute 31 Register  
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Table 7-100. PCI Hook Configuration Registers  
DSP ACCESS  
HEX ADDRESS RANGE  
ACRONYM  
DSP ACCESS REGISTER NAME  
02C0 0394  
PCIVENDEVPRG PCI Vendor ID and Device ID Program Register  
PCICMDSTATPRG PCI Command and Status Program Register  
02C0 0398  
02C0 039C  
02C0 03A0  
02C0 03A4  
02C0 03A8  
02C0 03AC  
02C0 03B0  
02C0 03B4  
02C0 03B8  
02C0 03BC  
02C0 03C0  
02C0 03C4  
02C0 03C8  
02C0 03CC  
02C0 03D0  
02C0 03D4  
02C0 03D8  
02C0 03DC  
02C0 03E0  
02C0 03E4  
02C0 03E8  
02C0 03EC  
02C0 03F0  
PCICLREVPRG  
PCISUBIDPRG  
PCI Class Code and Revision ID Program Register  
PCI Subsystem Vendor ID and Subsystem ID Program Register  
PCIMAXLGPRG PCI Max Latency and Min Grant Program Register  
PCILRSTREG  
PCICFGDONE  
PCI LRESET Register  
PCI Configuration Done Register  
PCIBAR0MPRG PCI Base Address Mask Register 0 Program Register  
PCIBAR1MPRG PCI Base Address Mask Register 1 Program Register  
PCIBAR2MPRG PCI Base Address Mask Register 2 Program Register  
PCIBAR3MPRG PCI Base Address Mask Register 3 Program Register  
PCIBAR4MPRG PCI Base Address Mask Register 4 Program Register  
PCIBAR5MPRG PCI Base Address Mask Register 5 Program Register  
PCIBAR0PRG  
PCIBAR1PRG  
PCIBAR2PRG  
PCIBAR3PRG  
PCIBAR4PRG  
PCIBAR5PRG  
PCI Base Address Register 0 Program Register  
PCI Base Address Register 1 Program Register  
PCI Base Address Register 2 Program Register  
PCI Base Address Register 3 Program Register  
PCI Base Address Register 4 Program Register  
PCI Base Address Register 5 Program Register  
PCIBAR0TRLPRG PCI Base Address Translation Register 0 Program Register  
PCIBAR1TRLPRG PCI Base Address Translation Register 1 Program Register  
PCIBAR2TRLPRG PCI Base Address Translation Register 2 Program Register  
PCIBAR3TRLPRG PCI Base Address Translation Register 3 Program Register  
PCIBAR4TRLPRG PCI Base Address Translation Register 4 Program Register  
PCIBAR5TRLPRG PCI Base Address Translation Register 5 Program Register  
PCIBASENPRG PCI Base En Prog Register  
02C0 03F4  
02C0 03F8  
02C0 03FC - 02C0 03FF  
-
Reserved  
Table 7-101. PCI External Memory Space  
HEX ADDRESS OFFSET  
4000 0000 - 407F FFFF  
4080 0000 - 40FF FFFF  
4100 0000 - 417F FFFF  
4180 0000 - 41FF FFFF  
4200 0000 - 427F FFFF  
4280 0000 - 42FF FFFF  
4300 0000 - 437F FFFF  
4380 0000 - 43FF FFFF  
4400 0000 - 447F FFFF  
4480 0000 - 44FF FFFF  
4500 0000 - 457F FFFF  
4580 0000 - 45FF FFFF  
4600 0000 - 467F FFFF  
4680 0000 - 46FF FFFF  
4700 0000 - 477F FFFF  
ACRONYM  
REGISTER NAME  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
PCI Master Window 0  
PCI Master Window 1  
PCI Master Window 2  
PCI Master Window 3  
PCI Master Window 4  
PCI Master Window 5  
PCI Master Window 6  
PCI Master Window 7  
PCI Master Window 8  
PCI Master Window 9  
PCI Master Window 10  
PCI Master Window 11  
PCI Master Window 12  
PCI Master Window 13  
PCI Master Window 14  
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Table 7-101. PCI External Memory Space (continued)  
HEX ADDRESS OFFSET  
4780 0000 - 47FF FFFF  
4800 0000 - 487F FFFF  
4880 0000 - 48FF FFFF  
4900 0000 - 497F FFFF  
4980 0000 - 49FF FFFF  
4A00 0000 - 4A7F FFFF  
4A80 0000 - 4AFF FFFF  
4B00 0000 - 4B7F FFFF  
4B80 0000 - 4BFF FFFF  
4C00 0000 - 4C7F FFFF  
4C80 0000 - 4CFF FFFF  
4D00 0000 - 4D7F FFFF  
4D80 0000 - 4DFF FFFF  
4E00 0000 - 4E7F FFFF  
4E80 0000 - 4EFF FFFF  
4F00 0000 - 4F7F FFFF  
4F80 0000 - 4FFF FFFF  
ACRONYM  
REGISTER NAME  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
PCI Master Window 15  
PCI Master Window 16  
PCI Master Window 17  
PCI Master Window 18  
PCI Master Window 19  
PCI Master Window 20  
PCI Master Window 21  
PCI Master Window 22  
PCI Master Window 23  
PCI Master Window 24  
PCI Master Window 25  
PCI Master Window 26  
PCI Master Window 27  
PCI Master Window 28  
PCI Master Window 29  
PCI Master Window 30  
PCI Master Window 31  
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7.16.3 PCI Electrical Data/Timing  
Texas Instruments (TI) has performed the simulation and system characterization to ensure that the PCI  
peripheral meets all AC timing specifications as required by the PCI Local Bus Specification (version 2.3).  
The AC timing specifications are not reproduced here. For more information on the AC timing  
specifications, see section 4.2.3, Timing Specification (33 MHz timing), and section 7.6.4, Timing  
Specification (66 MHz timing), of the PCI Local Bus Specification (version 2.3). Note that the C6454 PCI  
peripheral only supports 3.3-V signaling.  
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7.17 General-Purpose Input/Output (GPIO)  
7.17.1 GPIO Device-Specific Information  
On the C6454 the GPIO peripheral pins GP[15:8] and GP[3:0] are muxed with the PCI and McBSP1  
peripheral pins and the SYSCLK4 signal. For more detailed information on device/peripheral configuration  
and the C6454 device pin muxing, see Section 3, Device Configuration.  
7.17.2 GPIO Peripheral Register Description(s)  
Table 7-102. GPIO Registers  
HEX ADDRESS RANGE  
02B0 0008  
ACRONYM  
REGISTER NAME  
GPIO interrupt per bank enable register  
Reserved  
BINTEN  
02B0 000C  
-
02B0 0010  
DIR  
GPIO Direction Register  
02B0 0014  
OUT_DATA  
SET_DATA  
CLR_DATA  
IN_DATA  
SET_RIS_TRIG  
CLR_RIS_TRIG  
SET_FAL_TRIG  
CLR_FAL_TRIG  
-
GPIO Output Data register  
GPIO Set Data register  
02B0 0018  
02B0 001C  
GPIO Clear Data Register  
GPIO Input Data Register  
GPIO Set Rising Edge Interrupt Register  
GPIO Clear Rising Edge Interrupt Register  
GPIO Set Falling Edge Interrupt Register  
GPIO Clear Falling Edge Interrupt Register  
Reserved  
02B0 0020  
02B0 0024  
02B0 0028  
02B0 002C  
02B0 0030  
02B0 008C  
02B0 0090 - 02B0 00FF  
02B0 0100 - 02B0 3FFF  
-
Reserved  
-
Reserved  
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7.17.3 GPIO Electrical Data/Timing  
Table 7-103. Timing Requirements for GPIO Inputs(1)(2) (see Figure 7-74)  
-720  
-850  
-1000  
NO.  
UNIT  
MIN  
MAX  
1
2
tw(GPIH)  
tw(GPIL)  
Pulse duration, GPIx high  
Pulse duration, GPIx low  
12P  
12P  
ns  
ns  
(1) P = 1/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use P = 1 ns.  
(2) The pulse width given is sufficient to generate a CPU interrupt or an EDMA event. However, if a user wants to have the DSP recognize  
the GPIx changes through software polling of the GPIO register, the GPIx duration must be extended to at least 12P to allow the DSP  
enough time to access the GPIO register through the CFGBUS.  
Table 7-104. Switching Characteristics Over Recommended Operating Conditions for GPIO Outputs(1)  
(see Figure 7-74)  
-720  
-850  
-1000  
NO.  
PARAMETER  
UNIT  
MIN  
MAX  
3
4
tw(GPOH)  
tw(GPOL)  
Pulse duration, GPOx high  
Pulse duration, GPOx low  
36P – 8(2)  
36P – 8(2)  
ns  
ns  
(1) P = 1/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use P = 1 ns.  
(2) This parameter value should not be used as a maximum performance specification. Actual performance of back-to-back accesses of the  
GPIO is dependent upon internal bus activity.  
2
1
GPIx  
4
3
GPOx  
Figure 7-74. GPIO Port Timing  
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7.18 IEEE 1149.1 JTAG  
7.18.1 JTAG Device-Specific Information  
7.18.1.1 IEEE 1149.1 JTAG Compatibility Statement  
For maximum reliability, the C6454 DSP includes an internal pulldown (IPD) on the TRST pin to ensure  
that TRST will always be asserted upon power up and the DSP's internal emulation logic will always be  
properly initialized when this pin is not routed out. JTAG controllers from Texas Instruments actively drive  
TRST high. However, some third-party JTAG controllers may not drive TRST high but expect the use of  
an external pullup resistor on TRST. When using this type of JTAG controller, assert TRST to initialize the  
DSP after powerup and externally drive TRST high before attempting any emulation or boundary scan  
operations.  
7.18.2 JTAG Peripheral Register Description(s)  
7.18.3 JTAG Electrical Data/Timing  
Table 7-105. Timing Requirements for JTAG Test Port (see Figure 7-75)  
-720  
-850  
-1000  
NO.  
UNIT  
MIN  
MAX  
1
3
4
tc(TCK)  
Cycle time, TCK  
35  
10  
9
ns  
ns  
ns  
tsu(TDIV-TCKH)  
th(TCKH-TDIV)  
Setup time, TDI/TMS/TRST valid before TCK high  
Hold time, TDI/TMS/TRST valid after TCK high  
Table 7-106. Switching Characteristics Over Recommended Operating Conditions for JTAG Test Port  
(see Figure 7-75)  
-720  
-850  
-1000  
MIN  
-3  
NO.  
PARAMETER  
UNIT  
MAX  
2
td(TCKL-TDOV)  
Delay time, TCK low to TDO valid  
18  
ns  
1
TCK  
TDO  
2
2
4
3
TDI/TMS/TRST  
Figure 7-75. JTAG Test-Port Timing  
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8 Mechanical Data  
8.1 Thermal Data  
Table 8-1 shows the thermal resistance characteristics for the PBGA - ZTZ/GTZ mechanical package.  
Table 8-1. Thermal Resistance Characteristics (S-PBGA Package) [ZTZ/GTZ]  
NO.  
°C/W  
AIR FLOW  
(m/s(1)  
N/A  
N/A  
0.00  
1.0  
)
1
2
3
4
5
6
RΘJC  
Junction-to-case  
Junction-to-board  
1.45  
8.34  
16.1  
13.0  
11.9  
10.7  
0.37  
0.89  
1.01  
1.17  
7.6  
RΘJB  
RΘJA  
PsiJT  
PsiJB  
Junction-to-free air  
Junction-to-package top  
Junction-to-board  
2.0  
3.0  
0.00  
1.0  
7
8
1.5  
3.00  
0.00  
1.0  
6.7  
6.4  
1.5  
5.8  
3.00  
(1) m/s = meters per second  
8.2 Packaging Information  
The following packaging information reflects the most current released data available for the designated  
device(s). This data is subject to change without notice and without revision of this document.  
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Revision History  
This data sheet revision history highlights the technical changes made to the SPRS311 device-specific  
data sheet to make it an SPRS311A revision.  
Scope: Applicable updates to the C64x device family, specifically relating to the TMS320C6454 device,  
have been incorporated.  
C6454 Revision History  
SEE  
ADDITIONS/MODIFICATIONS/DELETIONS  
Changed DDR2 Memory Controller speed to 533 MHz  
Global  
Changed L2 Memory size to 1048KB  
Section 1.1  
Features:  
Changed EMIFA bullet to 64-Bit External Memory Interface (EMIFA)  
Added 1.25-V Internal  
Section 1.1.1  
Section 1.3  
Section 2.1  
Change section title to ZTZ/GTZ BGA Package (Bottom View):  
Added GTZ to Section 1.1.1, ZTZ/GTZ BGA Package (Bottom View)  
Functional Block Diagram:  
Updated Figure 1-2, Functional Block Diagram  
Device Characteristics:  
Table 2-1, Characteristics of the C6454 Processor:  
Deleted [133 MHz] from EMIFA (64-bit bus width)  
Changed On-Chip Memory Size to 1144K  
Updated Core Voltages  
Updated Megamodule Revision ID  
Updated JTAG BSDL_ID  
Added GTZ Package  
Section 2.3  
Memory Map Summary:  
Added EDMA Transfer Controller 0-3 Registers to Table 2-2, C6454 Memory Map Summary  
Section 2.4.1  
Boot Modes Supported:  
Updated paragraphs under Host boot bullet  
Replaced TBD document reference with TMS320C645x Bootloader User's Guide (literature number  
SPRUEC6)  
Section 2.5.1  
Pin Map:  
Updated Figure 2-4, C6454 Pin Map (Bottom View) [Quadrant C] and Figure 2-5, C6454 Pin Map (Bottom  
View) [Quadrant D]  
Section 2.6  
Table 2-3  
Signal Groups Description:  
Updated Figure 2-6, CPU and Peripheral Signals  
Terminal Functions:  
Updated Footnote (2)  
Added footnote (5) reference to Signals PSERR and PINTA  
Updated Signal Description for AR/W  
Updated Signal Description for DEODT1 and DEODT2  
Updated Signal Descriptions for RSV07, RSV09, RSV15, RSV16, RSV32, RSV33, RSV34, and RSV35  
Changed Signal N1 to CVDDMON, updated Description, and moved under Supply Voltage Monitor Pins  
Changed Signal L6 to DVDD33MON, updated Description, and moved under Supply Voltage Monitor Pins  
Changed Signal F3 to DVDD15MON, updated Description, and moved under Supply Voltage Monitor Pins  
Changed Signal A26 to DVDD18MON, updated Description, and moved under Supply Voltage Monitor Pins  
Updated Descriptions for Signals AVDDA, DVDDRM, DVDD12, AVDDT, and CVDD  
Section 2.8.2.1  
Section 2.8.2.2  
Section 3.1  
Device and Development-Support Tool Nomenclature:  
Updated Figure 2-12, TMS320C64x+ DSP Device Nomenclature (including the TMS320C6454 DSP)  
Documentation Support:  
Updated list of related documentation  
Device Configuration at Device Reset:  
Updated paragraph and Note  
Updated Footnote (1) and Configuration Pin AEA3 Description in Table 3-1, C6454 Device Configuration  
Pins (AEA[19:0], ABA[1:0], and PCI_EN)  
Section 3.3  
Peripheral Selection After Device Reset:  
Updated Table 3-4, Peripheral States  
Added Note  
Section 3.4.1  
Peripheral Lock Register Description:  
Added Note  
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TMS320C6454  
Fixed-Point Digital Signal Processor  
www.ti.com  
SPRS311A–APRIL 2006–REVISED DECEMBER 2006  
C6454 Revision History (continued)  
SEE  
ADDITIONS/MODIFICATIONS/DELETIONS  
Peripheral Configuration Register 0 Description:  
Updated paragraph and added Note  
Section 3.4.2  
Changed all bit field resets to R/W-0 and updated Figure 3-4, Peripheral Configuration Register 0  
(PERCFG0)  
Updated Table 3-7, Peripheral Configuration Register 0 (PERCFG0) Field Descriptions  
Section 3.4.5  
EMAC Configuration Register (EMACCFG) Description:  
Changed bits 23:19 reset value to R/W-0001b and moved in RMII_RST field to bit 18 Figure 3-8, EMAC  
Configuration Register (EMACCFG)  
Updated Reserved Bits 31:19 Description and RMII_RST Bit 18 Description Values 0 and 1 in Table 3-11,  
EMAC Configuration Register (EMACCFG) Field Descriptions  
Section 3.7  
Section 3.8  
Deleted Debugging Considerations  
Added new section, Pullup/Pulldown Resistors  
Configuration Examples:  
Added comments for AEA[12], AEA[11], and AEA[3] and changed SYSCLK3 to SYSCLK4 in comment for  
AEA[4] in Figure 3-12, Configuration Example A, and Figure 3-13, Configuration Example B  
Section 5.1  
Section 6  
Memory Architecture:  
Updated paragraphs  
Updated Figure 5-4, TMS320C6454 L2 Memory Configurations  
Device Operating Conditions:  
Updated Section 6.1, Absolute Maximum Ratings Over Operating Case Temperature Range  
Updated Section 6.2, Recommended Operating Conditions  
Updated Section 6.3, Electrical Characteristics Over Recommended Ranges of Supply Voltage and  
Operating Case Temperature  
Section 7.3.1  
Power-Supply Sequencing:  
Updated paragraph  
Deleted Power-Supply Sequence (Option 1) figure and Timing Requirements for Power-Supply Sequence  
(Option 1) table  
Section 7.3.4  
Section 7.4  
Preserving Boundary-Scan Functionality on RGMII and DDR2 Memory Pins section:  
Added DVDD15MON to paragraph and list  
Enhanced Direct Memory Access (EDMA3) Controller:  
Changed "4 Quick DMA (QDMA) channels" to "8 Quick DMA (QDMA) channels"  
Section 7.4.1  
Section 7.4.3  
EDMA3 Device-Specific Information:  
Updated paragraph  
EDMA3 Peripheral Register Description(s):  
Changed Table 7-4 title to EDMA3 Channel Controller Registers  
Updated Hex Address Ranges for Parameter Sets 7, 9, 254, and 255 on Table 7-5, EDMA3 Parameter RAM  
Added Table 7-6, EDMA3 Transfer Controller 0 Registers, Table 7-7, EDMA3 Transfer Controller 1  
Registers, Table 7-8, EDMA3 Transfer Controller 2 Registers, and Table 7-9, EDMA3 Transfer Controller 3  
Registers  
Section 7.5.1  
Section 7.6  
Interrupt Sources and Interrupt Controller:  
Changed Event Number 80 to Reserved in Table 7-10, C6454 DSP Interrupts  
Reset Controller:  
Updated System Reset Effect(s), and added Footnote (2) in Table 7-12, Reset Types  
Deleted System Reset Timing figure  
Section 7.6.7  
Reset Electrical Data/Timing:  
Updated Note  
Added new Footnote (3) and renumbered Footnotes to (4) and (5) in Table 7-14, Timing Requirements for  
Reset  
Section 7.7  
PLL1 and PLL1 Controller:  
Updated Figure 7-10, PLL1 and PLL1 Controller  
Section 7.7.1  
PLL1 Controller Device-Specific Information:  
Updated SYSCLK4 bullet  
Updated paragraphs  
Updated Footnote (1) in Table 7-16, PLL1 Clock Frequency Ranges  
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TMS320C6454  
Fixed-Point Digital Signal Processor  
www.ti.com  
SPRS311A–APRIL 2006–REVISED DECEMBER 2006  
C6454 Revision History (continued)  
SEE  
ADDITIONS/MODIFICATIONS/DELETIONS  
Section 7.7.3  
PLL1 Controller Register Descriptions:  
Added Values and Descriptions for RATIO bit field in Table 7-21, PLL Pre-Divider Control Register (PREDIV)  
Field Descriptions  
Deleted PLL Controller Divider Registers section  
Added new sections for PLL Controller Divider 4 Register and PLL Controller Divider 5 Register  
Change RATIO bit field reset to R/W-3 in Figure 7-14, PLL Controller Divider 4 Register (PLLDIV4)  
Changed RATIO bit field reset to R/W-3 in Figure 7-15, PLL Controller Divider 5 Register (PLLDIV5)  
Section 7.7.4  
Section 7.8  
PLL1 Controller Input and Output Clock Electrical Data/Timing:  
Updated Figure 7-22, SYSCLK4 Timing  
PLL2 and PLL2 Controller:  
Updated Notes A and B on Figure 7-23, PLL2 Block Diagram  
Section 7.8.1  
Section 7.8.1.1  
Section 7.8.4  
Section 7.9  
PLL2 Controller Device-Specific Information:  
Updated Footnote (1) in Table 7-31, PLL2 Clock Frequency Ranges  
Internal Clocks and Maximum Operating Frequencies:  
Updated paragraphs  
PLL2 Controller Input Clock Electrical Data/Timing:  
Updated Footnote (3) in Table 7-39, Timing Requirements for CLKIN2  
DDR2 Memory Controller:  
Updated paragraphs  
Section 7.10.2  
Section 7.10.3  
EMIFA Peripheral Register Description(s):  
Changed Burst Priority Register acronym to BURST_PRIO in Table 7-41, EMIFA Registers  
EMIFA Electrical Data/Timing:  
Updated footnotes for Table 7-45, Table 7-47 and Figure 7-33, Figure 7-36, Figure 7-37, and Figure 7-38  
Updated Figure 7-34, Asynchronous Memory Write Timing for EMIFA  
Section 7.12.2  
Section 7.12.3  
HPI Peripheral Register Description(s):  
Updated Comments for HPIC in Table 7-54, HPI Control Registers  
Updated Hex Address and Comments for HPIA registers  
Added Footnote (1)  
Updated Footnote (2)  
HPI Electrical Data/Timing:  
Changed Parameter NO. 18 MIN value to 1 ns and Parameter NO. 38 MIN value to 1.1 ns in Table 7-55,  
Timing Requirements for Host-Port Interface Cycles  
Replaced TBD document reference with TMS320C645x DSP Host Port Interface User's Guide (literature  
number SPRU969) in Figure 7-44 through Figure 7-51  
Section 7.13.1  
Section 7.13.2  
McBSP Device-Specific Information:  
Added paragraph  
McBSP Electrical Data/Timing:  
Changed Parameter NO. 4 MAX value to 3.3 ns in Table 7-60, Switching Characteristics Over  
Recommended Operating Conditions for McBSP  
Section 7.14.1  
EMAC Device-Specific Information:  
Deleted Step 1 and changed setting to clearing under Using the RMII Mode of the EMAC  
Moved Table 7-70, EMAC/MDIO Multiplexed Pins (MII, RMII, and GMII Modes), under Interface Mode Select  
Added Interface Mode Clocking section and paragraphs  
Section 7.14.2  
EMAC Peripheral Register Description(s):  
Corrected Hex Addresses for 02C8 0080 through 02C8 0090 in Table 7-71, Ethernet MAC (EMAC) Control  
Registers  
Section 7.14.3.1  
EMAC MII and GMII Electrical Data/Timing:  
Updated Figure 7-59, MRCLK Timing (EMAC – Receive) [MII and GMII Operation]  
Updated Figure 7-60, MTCLK Timing (EMAC – Transmit) [MII and GMII Operation]  
Changed Table 7-77 title to Switching Characteristics Over Recommended Operating Conditions for  
GMTCLK - GMII Operation  
Updated Figure 7-61, GMTCLK Timing (EMAC – Transmit) [GMII Operation]  
Updated Figure 7-64, EMAC Transmit Interface Timing [GMII Operation]  
Section 7.14.3.2  
EMAC RMII Electrical Data/Timing:  
Added the following tables and figures:  
Table 7-82, Switching Characteristics Over Recommended Operating Conditions for EMAC RMII Transmit  
10/100 Mbit/s  
Figure 7-66, EMAC Transmit Interface Timing [RMII Operation]  
Table 7-83, Timing Requirements for EMAC RMII Input Receive for 100 Mbps  
Figure 7-67, EMAC Receive Interface Timing [RMII Operation]  
220  
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TMS320C6454  
Fixed-Point Digital Signal Processor  
www.ti.com  
SPRS311A–APRIL 2006–REVISED DECEMBER 2006  
C6454 Revision History (continued)  
SEE  
ADDITIONS/MODIFICATIONS/DELETIONS  
Section 7.14.3.3  
EMAC RGMII Electrical Data/Timing:  
Updated Table 7-84, Switching Characteristics Over Recommended Operating Conditions for EMAC  
RGREFCLK - RGMII Operation  
Updated Figure 7-68, RGREFCLK Timing  
Changed Table 7-87 title to Switching Characteristics Over Recommended Operating Conditions for TXC -  
RGMII Operation for 10/100/100 Mbit/s  
Section 7.14.4.1  
Section 7.16.1  
MDIO Device-Specific Information:  
Updated paragraph  
PCI Device-Specific Information:  
Updated paragraphs  
Added Table 7-96, Default Values for PCI Configuration Registers  
Section 7.16.3  
Section 8  
PCI Electrical Data/Timing:  
Deleted Peripheral Component Interconnect (PCI) Timing section  
Added new paragraph  
Mechanical Data:  
Added the GTZ (S-PBGA-N697) Plastic Ball Grid Array mechanical package drawing  
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PACKAGE OPTION ADDENDUM  
www.ti.com  
7-Dec-2006  
PACKAGING INFORMATION  
Orderable Device  
TMS320C6454BZTZ  
TMS320C6454BZTZ7  
TMS320C6454BZTZ8  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
FCBGA  
ZTZ  
697  
697  
697  
44 Pb-Free (RoHS  
Exempt)  
SNAGCU  
SNAGCU  
SNAGCU  
Level-4-260C-72HR  
Level-4-260C-72HR  
Level-4-260C-72HR  
FCBGA  
FCBGA  
ZTZ  
ZTZ  
44 Pb-Free (RoHS  
Exempt)  
44 Pb-Free (RoHS  
Exempt)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
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