MZ-E60
SERVICE MANUAL
US Model
Canadian Model
AEP Model
E Model
(Photo: Silver)
US and foreign patents licensed from Dolby
Laboratories Licensing Corporation.
Model Name Using Similar Mechanism MZ-E90
MD Mechanism Type
MT-MZE60-169
LCX-2E
Optical Pick-up Mechanism Type
SPECIFICATIONS
General
Power requirements
One LR6 (size AA) battery (not supplied)
Battery operation time
You can check the battery condition with the
battery indication which is displayed while using
the player.
t Battery power decreasing
v
r Weak battery
v
e The battery has gone out. “LOW BATT”
flashes in the display on the remote control,
and the power goes off.
System
Audio playing system
MiniDisc digital audio system
Laser diode properties
Material: GaAlAs
Wavelength: λ = 790 nm
Emission duration: continuous
Laser output: less than 44.6 µW
(This output is the value measured at a distance
of 200 mm from the objective lens surface on the
optical pick-up block with 7 mm aperture.)
Revolutions
800 rpm to 1,800 rpm
Error correction
Advanced Cross Interleave Reed Solomon
Code (ACIRC)
Sampling frequency
44.1 kHz
Coding
Battery Life
Approximately 12 hours of playback can be
expected with one LR6 (size AA) alkaline battery
(not supplied).
Note
The battery life may shorter depending on
operating conditions and temperature of the
location.
Adaptive TRansform Acoustic Coding (ATRAC)
Modulation system
EFM (Eight to Fourteen Modulation)
Number of channels
2 stereo channels
1 monaural channel
Frequency response
20 to 20,000 Hz ± 3 dB
Wow and Flutter
– Continued on next page –
Below measurable limit
Outputs
Headphones: stereo mini-jack,
maximum output level 5 mW + 5 mW, load
impedance 16 ohms
PORTABLE MINIDISC PLAYER
MICROFILM
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TABLE OF CONTENTS
1. SERVICING NOTE ......................................................... 4
6. DIAGRAMS..................................................................... 14
6-1. IC Pin Description .............................................................. 14
6-1-1. IC801 RU6915MF-0006 (System Control) ................. 14
6-2. Block Diagrams .................................................................. 17
6-2-1. MD Block Diagram ..................................................... 17
6-2-2. Servo, System Control Block Diagram ....................... 19
6-3. Printed Wiring Boards and Schematic Diagrams................ 21
6-3-1. Printed Wiring Board – Main Board – ........................ 21
6-3-2. Schematic Diagram – Main Board (1/4) – .................. 25
6-3-3. Schematic Diagram – Main Board (2/4) – .................. 27
6-3-4. Schematic Diagram – Main Board (3/4) – .................. 29
6-3-5. Schematic Diagram – Main Board (4/4) – .................. 31
6-4. IC Block Diagrams ............................................................. 33
2. GENERAL......................................................................... 5
Playing an MD right away! ................................................... 5
3. DISASSEMBLY ............................................................... 7
3-1. Panel Assy, Upper ................................................................. 7
3-2. Holder Assy........................................................................... 7
3-3. Mechanism Deck .................................................................. 8
3-4. Main Board ........................................................................... 8
3-5. Service Assy, OP ................................................................... 9
4. TEST MODE................................................................... 10
4-1. General ................................................................................ 10
4-2. Setting the Test Mode ......................................................... 10
4-2-1. How to Set the Test Mode ........................................... 10
4-2-2. Operations when the Test Mode is Set ........................ 10
4-2-3. How to Release the Test Mode .................................... 10
4-3. Test Mode Structure ............................................................ 10
4-4. Manual Mode ...................................................................... 11
4-4-1. Outline of the Function ............................................... 11
4-4-2. How to Set the Manual Mode ...................................... 11
4-5. Overall Adjustment Mode ................................................... 11
4-5-1. Outline of the Function ............................................... 11
7. EXPLODED VIEWS ..................................................... 37
7-1. Main Unit Section ............................................................... 37
7-2. Mechanism Deck Section ................................................... 38
8. ELECTRICAL PARTS LIST...................................... 39
5. ELECTRICAL ADJUSTMENTS .............................. 12
5-1. General ................................................................................ 12
5-2. Notes for Adjustment .......................................................... 12
5-2-1. Jigs ............................................................................... 12
5-2-2. Adjustment Sequence .................................................. 12
5-2-3. Power ........................................................................... 12
5-3. Reset NV ............................................................................. 12
5-3-1. How to Reset NV ........................................................ 12
5-4. Overall Adjustment Mode ................................................... 12
5-4-1. Overall Adjustment Mode Structure............................ 12
5-4-2. Overall CD and MO Adjustment Method ................... 12
5-4-3. Overall CD and MO Adjustment Items ....................... 13
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SECTION 1
SERVICING NOTE
1) When repairing this device with the power on, if you remove
the main board or open the upper panel assy, this device stops
working.
In this case, you can work without the device stopping by
fastening the hook of the OPEN/CLOSE switch (MAIN board
S809) with tape.
MAIN board S809
2) This set is designed to perform automatic adjustment for each
adjustment and write its value to EEPROM. Therefore, when
EEPROM (MAIN board IC802) has been replaced in service,
be sure to perform automatic adjustment and write resultant
values to the new EEPROM.
Refer to section 4 Test Mode (page 10) for details.
– 4 –
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SECTION 2
GENERAL
This section is extracted from
instruction manual.
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– 6 –
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SECTION 3
DISASSEMBLY
Note : This set can be disassemble according to the following sequence.
Set
Panel Assy, Upper
Holder Assy
Mechanism Deck
Main Board
Service Assy, OP
Note : Follow the disassembly procedure in the numerical order given.
3-1. PANEL ASSY, UPPER
4 screws(1.4),MI
5 panel assy, upper
3 screws(1.4),MI
2
1
3-2. HOLDER ASSY
3 holder assy
2 shaft
1 shaft
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3-3. MECHANISM DECK
1 sheet (BLIND)
2 screw (MD), step
4
7 mechanism deck
3
5 CN501
6 CN551
claw
3-4. MAIN BOARD
Note : When installing, fit the knobs (HOLD, MB) and the switchs (S806, 807, 808).
2 screws(1.7x2.5)
1 screws(1.7x2.5)
S808
S806
S807
3
4 MAIN board
knobs (MB)
knob (HOLD)
– 8 –
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3-7. SERVICE ASSY, OP
4 M 1.4
3 M 1.4
5 service assy, OP
1 washer
2 gear (SA)
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SECTION 4
TEST MODE
Remote control LCD
4-1. GENERAL
• When entered in the TEST MODE, this set provides the Overall
Adjustment mode which allows CD and MO discs to be auto-
matically adjusted. In the Overall Adjustment mode , the system
discriminates between CD and MO discs, performs adjustments
in sequence automatically, and displays the faulty location if any
fault is found. In the Manual mode, selected adjustments can be
performed automatically.
888
u
All on
• The attached remote control is used to operate the TEST MODE.
Unless otherwise specified in the text, the key means that on the
remote control.
All off
004 V1.100
4-2. SETTINGTHE TEST MODE
Microprocessor
version
display
4-2-1. How to set theTEST MODE
To set the TEST MODE, two methods are available.
1 Solder bridge and short TAP801 (TEST) on the main board.
Then turn on the power.
• Press and hold down PLAY MODE to hold the current display
while the key is being pressed.
MAIN BOARD (SIDE B)
4-2-3. How to release theTEST MODE
When method 1 was used:
1
Turn off the power and open the solder bridge on TAP801 on the
main board.
Note: The solder should be removed clean. The remaining
solder may make a short with the chassis and other part.
When method 2 was used:
5
CN551
8
5
1
10
15
L501
C518
Turn off the power.
TAP801
4-3.TEST MODE STRUCTURE
TP518
20
Test Mode
(Display Check Mode)
+
key
key
TAP801
Manual Mode
x
2 In the normal mode, operate the keys on the set and those on the
remote control as specified below:
+
key
key
Servo Mode
Turn on HOLD switch on the set. Holding down x (STOP)
key on the set, press the keys on the remote control in the
following sequence:
Audio Mode
> N t > N t . t . t > N
t . t > N t . t X t X
Power Mode
4-2-2. Operations when the TEST MODE is set
When the TEST MODE is entered, the system switches to the
display check mode within the TEST MODE. From this mode, the
other Test modes can be accessed.
When the TEST MODE is set, the LCD repeats a cycle of the
following displays:
OP Alignment Mode
key
key
Overall Adjustment Mode
x
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4-4. MANUAL MODE
4-4-1. Outline of the function
Address Value & Adjustment Value
LCD display
The Manual mode is designed to perform adjustments and
operational checks on the set’s operation according to each
individual function.
011XXXSXX
Usually, no adjustments are made in this mode.
However, the Manual mode is used to clear the memory before
performing automatic adjustments in the OverallAdjustment mode.
Block Error Value & Adjustment Value
LCD display
011XX BXX
4-4-2. How to set the Manual mode
1. Set the TEST MODE and press + key to set the Manual mode.
ADIP Error Value & Adjustment Value
LCD display
Remote control LCD display
011XX AXX
000 AAASCC
Jitter Value & Adjustment Value
LCD display
2. Each test item is assigned with a three-digit item number. The
third digit stands for a major item, the second digit for a middle
item, and the first digit for a moniro item.
011XXXJXX
Asy Mmetry Feed Back Gain Value & Adjustment Value
LCD display
+
+
key : Up
Change Major
Item
011XX RXX
key : Down
Power Adjustment Value
LCD display
x
> N key
key
731XX VXX
key : Up
Change Middle
Item
key : Down
Memory Monitor Mode
XXX: Each Value
XX: Adjustment Value
for Item number
x
> N key
key
Change Minor
Item
> N key : Up
Note: In the Power mode, the power adjustment value is only
displayed.
.
key : Down
+
4. During each test, press and hold down > N key or .
key for a while to move the optical pickup on the sled outer or
inner perimeter.
key : Up
Change Adjustment
Value
key : Down
Write Adjustment
Value
X key : Write
5. To terminate the Manual mode and return to the TEST MODE,
press x key.
3. During each test mode, the display is changed from one to
another each time DISPLAY key is pressed.
4-5. OVERALL ADJUSTMENT MODE
4-5-1. Outline of the function
This mode is designed to adjust the servo system automatically by
going through all the adjustment items.
Usually, this mode is used to perform automatic adjustments when
servicing the set.
For further information, refer to section 5. ELECTRICALADJUST-
MENTS (page 12).
– 11 –
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SECTION 5
ELECTRICAL ADJUSTMENTS
5-1. GENERAL
5-4. OVERALL ADJUSTMENT MODE
5-4-1. Overall adjustment mode structure
In this set, CD and MO discs can be automatically adjusted by set-
ting the Overall Adjustment mode within the TEST MODE,
Before performing these automatic adjustments, it is necessary to
clear the memory and adjust the power in the Manual mode.
Overall Adjustment Mode
5-2. NOTES FOR ADJUSTMENT
.
key
5-2-1. Jigs
• CD disc TDYS-1 (part code: 4-963-646-01)
• MO disc PTDM-1 (part code: J-2501-054-A)
or commercially available MO disc (recorded)
• Digital voltmeter
Overall CD Adjustment
x
key
.
> N key
key
5-2-2. Adjustment sequence
The adjustments should be always performed in the following
sequence:
> N key
Overall MO Adjustment
1 Reset NV (Clear the memory)
2 Overall CD adjustments
3 Overall MO adjustments
Manual mode
x
key
Overall adjustment mode
Note: The overall adjustments should be always performed in the
sequence of CD t MD adjustments.
5-4-2. Overall CD and MO adjustment method
1. Set the TEST MODE (see page 10) and press – key to set the
Overall Adjustment mode.
5-2-3. Power
A stablized power supply is used to supply 1.5 V DC to the battery
terminal.
Otherwise, an AA alkali battery with the remaining level of 1.5 V
DC or more is used. (In this case, make sure that the battery
indication on the remote control is “FULL”)
LCD display
044Assy ?
5-3. RESET NV
2. Insert CD disc in the set, and press . key to set the Overall
CD Adjustment mode.
5-3-1. How to reset NV
1. Set the TEST MODE. (See page 10)
Automatic adjustments are made.
Display on Adjustment state
for Each Items.
LCD display
2. Set the Manual mode and set the item No. 021, Reset NV.
LCD display
XXX XXXSXX
021AAASCC
XXX: Item No. for which an adjustment is being executed.
3. If NG in the overall CD adjustments, return to Reset NV and
perform the adjustment again.
3. Press X key on the remote control.
LCD display
LCD display
Adjustment Value becomed to NG.
021AAASCC
XXX NGXX
Note: CC is blink.
4. Press X key on the remote control again.
XXX: NG item No.
LCD display
4. If OK through the overall CD adjustments, then perform overall
MO adjustments.
021AAASCC
LCD display
Note: CC blink. t Finish the CC light on.
XXX End-OK
5. Press x key to terminate the Manual mode and return to the
TEST MODE.
5. Insert MO disc in the set, and press > N key to set the
Overall MOAdjustment mode. Automatic adjustments are made.
LCD display
XXX XXXSXX
XXX: Item No. for which an adjustment is being executed.
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6. If NG in the overall MO adjustments, return to Reset NV and
perform the adjustment again.
LCD display
XXX NGXX
XXX: NG item No.
7. If OK through the overall MO adjustments, press x key to
return to the TEST MODE and terminate the Overall Adjust-
ment mode.
LCD display
XXX End-OK
5-4-3. Overall CD and MO adjustment items
1. Overall CD adjustment items
Item No.
Contents
312
313
314
CD electrical offset adjustment
321
328
323
336
344
345
521
522
341
CD TE gain adjustment
CD TWPP gain adjustment
CD TE offset adjustment
CD ABCD gain adjustment
CD focus gain adjustment
CD tracking gain adjustment
CD two-axis sensitivity adjustment
CD focus bias adjustment
2. Overall MO adjustment items
Item No.
112
Contents
113
114
221
223
236
244
245
121
122
144
145
131
132
136
134
141
MO electrical offset adjustment
Low reflective CD TE gain adjustment
Low reflective CD TE offset adjustment
Low reflective CD ABCD gain adjustment
Low reflective CD focus gain adjustment
Low reflective CD tracking gain adjustment
MO TE gain adjustment
MO TE offset adjustment
MO focus gain adjustment
MO tracking gain adjustment
MO TWPP offset adjustment
MO ABCD gain adjustment
MO TWPP gain adjustment
MO focus bias adjustment
– 13 –
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SECTION 6
DIAGRAMS
6-1. IC PIN DESCRIPTION
6-1-1. IC801 RU6915MF-0006 (SYSTEM CONTROL)
Pin No.
Pin Name
I/O
Description
1
S MON
I
S-MON monitor signal input from the µPD63732GC (IC601)
Un-regulator power supply voltage monitor input terminal (A/D input)
Not used. (open)
2
3
4
5
6
7
8
UREG MON
NC
I
—
I
VREF
Input terminal for power supply voltage adjustment reference voltage (+2 V) (A/D input)
Not used. (Fixed at “H”.)
DVDD MON
NC
I
—
I
Not used. (open)
RMC KEY
SET KEY
Remote commander with headphone key input terminal (A/D input)
Set key input terminal (A/D input) S801 to S804 (x, >/N, ., +/– VOLUME keys input)
System reset signal input “L”: reset
I
9
MRST
I
For several hundreds msec. after the power supply rises, “L” is input, then it change to “H”
Power supply pin (+2.4 V or +2.8 V)
10
11
AVDD
AVSS
—
—
I
Ground terminal (forA/D converter)
12 – 15
16
TYPE0 – 3
XOUT
XIN
Setting terminal for model discrimination (bit 0 to bit 3) Fixed at “L” in this set
Main system clock output terminal (16.9344 MHz)
Main system clock input terminal (16.9344 MHz)
Sub system clock output terminal Not used. (open)
Sub system clock input terminal Not used. (fixed at “L”)
Not used. (open)
O
I
17
18
SX OUT
SXIN
O
I
19
20
COUT
O
—
—
I
21
VDD
Power supply terminal (+2 V) (digital system)
22
VSS
Ground terminal (digital system)
23
HOLD SW
VG CON
HOLD switch (S808) input terminal “L”: hold off, “H”: hold on
Power supply control signal output to each ICs
24
O
System clock supply output terminal (16.934 MHz) to the µPD63732GC (IC601) or AK4352
(IC302)
25
XCLK
O
26
27
KEY EN
AVLS SW
DSP SINT
DBB0, DBB1
OPR LED
O
I
Ground control output terminal of remote control
AVLS switch (S803) input terminal “L”: LIMIT “H”: NORM
Interruption status input from the µPD63732GC (IC601)
DIGITAL MEGABASS switch (S806) input terminal *1
OPERATE LED (D802) drive signal output terminal “H”: LED on
Upper panel open/close detect switch (S801) input terminal
“L”: upper panel close, “H” : upper panel open
28
I
29, 30
31
I
O
32
OPEN CLS SW
I
33
34
35
36
37
38
39
40
41
XWAKE RMC
XWAKE SET
SBUS CLK
SBUS DATA
XRST
I
I
Wake up signal input from remote control key
Wake up signal input from this set key
O
SSB serial clock signal output terminal
I/O SSB serial data input/output terminal
O
I
Reset signal output terminal to each ICs
SLD 1 MON
SLD 2 MON
VDD
Sled servo timing signal input from the TLC372CPW (IC552)
Sled servo timing signal input from the TLC372CPW (IC552)
Power supply terminal
I
—
—
VPP
Test terminal (fixed at “L”)
Spindle servo drive voltage control signal output to the BD6602KUT (IC551) or µPD63732GC
(IC601)
42
CLV VCON
O
43
44
45
46
47
48
49
APC REF
RM VCON
O
O
I
Laser power control signal output terminal
Remote control power voltage select signal output to power circuit “L”:2.4 V, “H”: 2.8 V
Spindle servo (U) timing signal input from the BD6602KUT (IC551)
Spindle servo (V) timing signal input from the BD6602KUT (IC551)
Spindle servo (W) timing signal input from the BD6602KUT (IC551)
Spindle servo (U) drive signal input from the BD6602KUT (IC551)
Spindle servo (V) drive signal input from the BD6602KUT (IC551)
CLV U MON
CLV V MON
CLV W MON
CLV U CON
CLV V CON
I
I
I
I
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Pin No.
Pin Name
I/O
Description
50
CLV W CON
I
Spindle servo (W) drive signal input from the BD6602KUT (IC551)
51
52
DRV VCON
NC
O
—
O
Driver output control terminal to the DB6602KUT (IC551) “L”: prohibited, “H”: permission
Not used. (open)
53
SLED 1R CON
SLED 1F CON
SLED 2R CON
SLED 2F CON
NC
Sled motor control signal output to the BD6602KUT (IC551)
Sled motor control signal output to the BD6602KUT (IC551)
Sled motor control signal output to the BD6602KUT (IC551)
Sled motor control signal output to the BD6602KUT (IC551)
Not used. (open)
54
O
55
O
56
O
57 – 60
61
—
—
—
VSS
Ground terminal (digital system)
62
NC
Not used. (open)
63
RMC DTCK
S0
I/O TSB serial communication data input/output terminal for remote commander with headphone
64
O
O
PD-IC mode select signal output
65
S1
PD-IC mode select signal output
66, 67
68
NC
—
O
Not used. (open)
SLD VCON
NC
Sled servo control PWM signal output to the BD6602KUT (IC551)
Not used. (open)
69
—
O
70
HP MUTE
Muting on/off control signal output to the headphone amplifier (IC301) “H”: muting on
Standby on/off control signal output to the headphone amplifier (IC301)
“L”: standby mode, “H”: amplifier on
71
HP STBY
O
72
73
74
75
76
77
78
79
80
NC
NV DI
—
I
Not used. (open)
Serial data input from the EEPROM (IC802)
Serial data output from the EEPROM (IC802)
Serial clock signal output to the EEPROM (IC802)
Chip select signal output to the EEPROM (IC802)
Test mode institution input terminal “L”: test mode (Normally, fixed at “H”)
System reboot control output terminal
NV DO
NV CLK
NV CS1
ADJUST
XREBOOT
VDD
O
O
O
I
O
—
—
Power supply terminal (+2 V) (digital system)
Ground terminal (digital system)
VSS
– 15 –
– 16 –
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MZ-E60
6-2. BLOCK DIAGRAMS
6-2-1. MD BLOCK DIAGRAM
(
)
1/2 MD SECTION
MAIN BOARD
DIGITAL SERVO
ATRAC
• Signal path
: MD
16M DRAM
IC602
IC601
B+
(Q907)
71
9
VREF
VSS
VSS
2
1
1
B+
(Q907)
74
•
12
•
13
70
15
A0
|
A11
DRA0
|
DRA11
66
•
19
•
62
•
21
•
VDD ADJ
65
•
8
•
MINIDISC
OPTICAL PICK-UP BLOCK
(LCX-2E)
20
•
64
6
B+
(Q907)
RF AMP, FOCUS/TRACKING ERROR AMP
IC501
37
•
52
•
2
•
51 VDD
•
DRD0
|
DRD3
D0
|
D3
53
•
3
75
•
CN501
•
VREF
6
VREF
3
58
•
24
•
87
DVDD 21
ly
lx
57
25
MCK I/O
47
97
98
–
+
AVCC 38
ID3
ID4
XRAS
XOE
XRAS
63
60
59
54
5
22
23
4
XOE VSS
XCAS VSS
XWE
14
26
18BIT D/A CONVERTER
IC302
–
+
XCAS
XWE
82V 30
Jx
RF OUT
–
+
AOUTL
AOUTR
Jx Jy Jx
RF
33
27
7
8X
∆ Σ
14
13
AOUTL
AOUTR
ly
lx
Jx
Jy
A
Iy
Ix
Jx
Jy
A
LPF
LPF
INTERPOLATOR
MODULATOR
9
7
8
LRCK
SDATA
BICK
Jy
LRCK 39
DFCT
5
4
3
SERVO,
SYSTEM CONTROL
SECTION
SERIAL
INPUT
INTERFACE
10
14
15
16
17
7
13 DEFECT
DFCT
–
+
RF AMP,
FOCUS
ERROR,
TRACKING
ERROR
lx ly lx
AUDATA
40
2
9
BCK 41
A
10
11
13
4
OFTRK
8X
∆ Σ
MODULATOR
OFTRK
26
14 OFTRK
–
+
INTERPOLATOR
(Page 19)
a b c d
B
B
ABCD
FE
B+
ABCD
FE
39
40
44
41
4
3
5
B
(Q907)
C
D
C
D
F
–
+
VREF
CKS
TE
11
16
10
2
8
5
TE
S MON
MCLK
CLOCK
DIVIDER
C
D
MCLK
50
1
VDD
A-C
D-C
–
+
12
6
TPP/WPP
APC
PD
MON
PD-NI
–
+
18
15
20
LD-VDD
PD-I
AVCC
(Q907)
16
17
MON
PD-O
–
+
LD-EMIT
PD-DRV
19
18
TF OUT
TF1
TR1
FR1
FF1
21
SERVO,
SYSTEM CONTROL
SECTION
5
TR OUT 22
FR OUT 23
LASER
3
4
LD-A
LD-K
AUTO POWER
CONTROL
Q501
12
FF OUT
24
LD
(Page 19)
13
T COUNT
T COUNT
ADIP
VREF
MCLK
SINT
ADIP
T-COUNT
28
12
9
AVCC (Q907)
ADIP IN
ADIP
AVCC
43
42
SINT 30
SCK
20
AVCC
29
S BUS 28
S0
S1
11
19
S0
S1
XRST
SCK
24
23
22
27 XRESET
SERIAL
I/F
SERVO,
SYSTEM CONTROL
SECTION
S BUS
XRST
S MON
PD
(Page 19)
SSB CLK
SSB DATA
S0
S1
TRK+
TRK–
2
TRACKING
COIL
1
4
SERVO,
SYSTEM CONTROL
SECTION
1
FCS+
FOCUS
COIL
(Page 19)
FCS–
3
04
– 17 –
– 18 –
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MZ-E60
6-2-2. SERVO, SYSTEM CONTROL BLOCK DIAGRAM
(
)
2/2
MAIN BOARD
B+
(UNREG)
SERVO, SYSTEM CONTROL SECTION
AOUTL
AOUTR
MD
SECTION
(Page 18)
HEADPHONE
AMP
IC301
2
• Signal path
B+
1
B+
(Q907)
B+
(Q907)
B+
(Q907)
: MD
EEPROM
IC802
20 VCC
22
J301
PW A
PW B
VCC CS
SK
NV CS1
NV CLK
NV DI
8
7
1
2
3
4
76
75
74
73
DVDD MON
5
2
4
i
DO
B+
(D901)
Q802
PE
DI
NV DO
SYSTEM
21
•
CONTROL
IC801
21
12
GND
KEY
40
•
VREF
MCLK
SINT
VREF
4
VDD
XCLK
25
28
79
DATA
VDD
B+
(D903)
PW
SW
B+
(D903)
DSP SINT
18
17
VREF
REFERENCE
VOLTAGE
SWITCHING
Q301
XRST
S MON
XRST
37
1
AVDD
10
S MON
MD
SECTION
(Page 18)
13
MUTE
4
PD
APC REF
SBUS CLK
SBUS DATA
43
35
36
SSB CLK
SSB DATA
HP MUTE
HP STB
70
71
S0
S1
S0
S1
64
65
KEY EN
26
7
RMC KEY
SLED
VOLTAGE MONITOR
IC552
Q801
XWAKE RMC
RMC DTCLK
33
63
5
+
–
SLD 2 MON
39
7
1
6
3
2
+
–
SLD 1 MON
XIN
38
17
16
S806
DIGITAL MEGABASS
S807
AVLS
NORM LIMIT
S808
HOLD
FOCUS/TRACKING COIL DRIVE,
SPINDLE/SERVO MOTOR DRIVE
IC551
0
1
2
X601
16.9344MHz
XOUT
VCC1
B+
(UNREG)
B+
(Q907)
45
64
1
42
43
40
41
38
39
DBB0
DBB1
29
30
27
23
TRK+
TF1
PREDRIVE
PREDRIVE
AVLS SW
HOLD SW
TR1
TRK–
MD
SECTION
(Page 18)
MD
1
(Page 17)
SET KEY
XWAKE SET
OPEN CLS SW
ADJUST
8
3
10
11
8
34
32
77
31
SECTION
FCS+
FF1
2
3
S801
MINIDISC
MECHANISM
BLOCK
9
OPR LED
S809
OPEN/
CLOSE
FR1
D802
OPERATE
FCS–
6
TAP801
TAP803
7
M902
(SLED)
CN551
S805 S804 S803 S802
SLED1+
62
61
60
57
58
56
SLD 1R CON
SLD 1F CON
SLD VCON
5
7
53
54
68
–
+
.
>N
PREDRIVE
PREDRIVE
SLED1–
RESET
IC803
VOL
B+
(D901)
VDD
51
52
50
4
5
SLED2+
54
55
SLD 2R CON
SLD2F CON
MRST
6
8
55
56
9
3
OUT
SLED2–
Q908
VSS
XREBOOT
D903
78
VCC2
B+
(Q907)
B+
46
32
B+
(UNREG)
CLVN
33
34
1
+
–
PWM/PFM CONTROL
IC903
CLV W MON
CLV V MON
CLV W MON
47
46
45
Q905
UNREG MON
RM VCOM
2
2
1
VDD
+
–
31
30
POWER SUPPLY
VOLTAGE CONTROL
SWITCH
35
EXT
5
44
VOUT
M901
(SPINDLE)
+
–
Q906
36
Q907
CLVU
CLVV
CLVW
23
24
26
29
28
2
3
4
B+
16
15
14
13
CLV U CON
CLV V CON
CLV W CON
CLV V CON
48
49
50
42
B+
(UNREG)
VG
B+
Q904
(2/2)
PREDRIVE
DECODER
VCC1
D901
Q904(1/2)
Q903
DRY BATTERY
SIZE "AA"
VG
2
1
3
VDD
FB
4
EXT
2
5
VDD
5
(IEC DESIGNATION R6)
1PC, 1.5V
OE
TO EACH
BLOCK
B+ SWITCH
Q902
17
DRV VCON
VG CON
51
24
VOUT
STANDBY
CE
1
VCC2
Q901
EXT
PWM/PFM CONTROL
IC902
TO BEMF
COMPARATOR
BIAS
VG
PWM/PFM CONTROL
IC901
04
– 19 –
– 20 –
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MZ-E60
6-3. PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
6-3-1. PRINTED WIRING BOARD — MAIN BOARD —
1
2
3
4
5
6
7
8
9
10
11
12
13
14
A
B
C
D
E
F
G
H
I
• Semiconductor
Location
MAIN BOARD (SIDE A)
Ref. No.
Location
GND1
D351
D352
D353
D354
D802
D855
D903
F-2
F-3
F-3
E-3
C-5
F-3
B-4
C511
22 20
23 25
15
IC501
10
5
1
C502
D
D903
E
B
TP530
Q908
GND2
C
C911
30
35
40 44
R903
G
S
IC302
IC501
IC601
IC602
IC801
IC802
IC803
IC903
F-4
S802
> N
VOL
B-9
E-9
F-11
G-6
H-6
G-7
C-4
S808
4
3
2
1
D802
OPERATE
R922
C910
C909
S801
x
S803
.
HOLD
S804
S805
R919 5
R920 R921 R923
R816
C515
E
B
R925 R924
TP529
C
Q801
Q802
Q905
Q906
Q908
D-4
D-3
C-4
D-4
B-5
TP810
E
B
R814
TP531
R827
G
FB801
C
S
C851
C852
C853
C854
TP811
TP812
TP813
R825
R837
Q802
R817
R818
FB802
25
26
20
15
10
5
1
L601
C609
C812
R822
100
D
R823
30
35
95
90
RB802
C614
C608
8
C806
R833 R810
1
2
5
4
TP302
IC601
3
40
45
13
14
6
1
TP203
85
D352
40
41
35
30
25
21
X601
C351
D351
20
15
10
8
9
1
80
76
D353
TP103
45
50
55
IC602
IC302
50
51
55
60
65
70
75
R809
16
IC803
3 2
IC801
70
R601
C304
19
21
26
4 1
C612
5
1
C801
R806
60
61
C813
C551
NORM
S806
DIGITAL MEGABASS
1
S807
AVLS
65
75
80
2
LIMIT
0
R201
R202
R101
R821
C552
1
4
8
5
C809
R102
IC802
TP826
11
( )
11
TP825
(CHASSIS)
1-676-495-
04
Note:
• Y : parts extracted from the conductor side.
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B) pattern face are indicated.
Parts face side: Parts on the parts face side seen from the
(Side A) parts face are indicated.
• Main board is four-layer printed board.
However, the patterns of layers 2 and 3 have not been in-
cluded in this diagrams.
f
•
: internal component.
• b : Pattern from the side which enables seeing.
(The other layer’s patterns are not indicated.)
– 21 –
– 22 –
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MZ-E60
14
13
12
11
10
9
8
7
6
5
4
3
2
1
DRY BATTERY
SIZE"AA"
(IEC DESIGNATION R6)
1PC,1.5V
A
B
C
D
E
• Semiconductor
Location
MAIN BOARD (SIDE B)
Ref. No.
Location
D901
D902
C-5
D-5
5
4
TP506
Q901
L901
TP513
B
IC301
IC551
IC552
IC901
IC902
H-5
IC901
C908
G-10
G-13
B-5
TP507
C
E
1 2 3
TP514
S809
(OPEN/CLOSE)
TP522
TP508
B
E
C504
C503
TP520
TP952
C
D-4
C509
R502
R506
TP519
R927
TP509
TP510TP515
G
S
D901
TP516
E
B
D
Q301
Q501
Q901
Q902
Q903
Q904
Q907
H-6
C-7
B-4
B-3
D-4
E-4
C-6
C901
TP528
TP523
TP809 TP610
TP613
TAP803
Q501
TP525
C
TP574TP572
R902
TP571 R926
TP805
C903
C904
TP576
C514
TP512
TP524
TP911
TP611
TP903
TP527
TP951
TP577
J301
TP575 TP573 TP570
C517
R913
C906
D902
TP505
TP607
1
5
7
VDD
TP604 TP605
TP606 TP603
TP612
3
2
1
TP526
TP804
TP608
6
5
S
DATA
KEY
TP601
CN551
IC902
4
D
TP609
G
5
8
5
1
10
15
TP563
TP806
MINI-DISC
TP615
GND
TP602
4
L501
OPTICAL
PICK-UP BLOCK
(LCX-2E)
TAP801
TP564
R928
TP503
TP518
C518
20
TP504
3
2
1
4
5
6
J301
TP565
i
TP558
TP555
R915
M901
SPINDLE
MOTOR
TP559
TP502
F
G
H
I
TP808
TP301
TP557
TP552 TP551
TP567
1
2
N
C561
TP501
C613
TP560
U
TP517
R203
C202
64
60
55
49
TP569 TP566
C555
1
C203
48
1
5
C553
L551
L553
L554
TP202
TP102
TP568
TP814
45
V
TP556
3
4
TP511
4
5
R103
C102
W
IC551
25
C307
40
E
B
IC552
10
TP803
L552
Q301
C
R204
TP561
TP562
TP553
12
13
7
M902
SLED
MOTOR
35
33
8
6
1
C103
C556
16
IC301
17 20
30 32
TP801
C554
TP554
TP802
11
5
C309
18
19
24
6
7
8
)
(
1-676-495- 11
11
04
12
MOTOR FLEXIBLE BOARD
1-675-668-
– 23 –
– 24 –
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MZ-E60
6-3-2. SCHEMATIC DIAGRAM — MAIN BOARD (1/4) — • Refer to page 33 for IC Block Diagrams.
(Page
27)
(Page
31)
(Page 29)
Note:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise
specified.
• A : B+ Line.
• Power voltage is dc 1.5V and fed with regulated dc power
supply from battery terminal.
• Voltage and waveforms are dc with respect to ground
under no-signal conditions.
no mark : PB
Note:
Note:
: Impossible to measure
∗
Les composants identifiés par
une marque 0 sont critiques
pour la sécurité.
Ne les remplacer que par une
piéce portant le numéro
spécifié.
The components identi-
fied by mark 0 or dotted
line with mark 0are criti-
cal for safety.
Replace only with part
number specified.
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
•Waveforms (MODE:PLAY)
0.5V/div 5µs/div
100mV/div 5µs/div
5mV/div 1µs/div
5mV/div 1µs/div
1
2
3
4
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
Approx.
12mVp-p
Approx.
Approx.
10mVp-p
Approx.
0.8Vp-p
180mVp-p
• Circled numbers refer to waveforms.
• Signal path.
IC501
(RF OUT) (TP528)
ed
IC501
(FE) (TP525)
IC501
(TE) (TP523)
rf
IC501
7890
r;
F
: PB
– 25 –
– 26 –
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MZ-E60
6-3-3. SCHEMATIC DIAGRAM — MAIN BOARD (2/4) — • Refer to page 34 for IC Block Diagrams.
(OPEN/CLOSE)
(Page
26)
(Page 31)
Note:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and / W or less unless otherwise
specified.
1
4
•
%
: indicates tolerance.
• C : panel designation.
• A : B+ Line.
• Power voltage is dc 1.5V and fed with regulated dc power
supply from battery terminal.
• Voltage is dc with respect to ground under no-signal
condition.
no mark : PB
: Impossible to measure
∗
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Signal path.
F
: PB
– 27 –
– 28 –
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MZ-E60
6-3-4. SCHEMATIC DIAGRAM — MAIN BOARD (3/4) — • Refer to page 34 for IC Block Diagrams.
(Page 26)
(Page 31)
(Page 31)
TOTAL CURRENT
PLAY : 40mA
PAUSE : 36mA
FF/REW : 60mA
Note:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and / W or less unless otherwise
specified.
1
4
•
%
: indicates tolerance.
• A : B+ Line.
• Power voltage is dc 1.5V and fed with regulated dc power
supply from battery terminal.
• Voltage is dc with respect to ground under no-signal
condition.
no mark : PB
: Impossible to measure
∗
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
– 29 –
– 30 –
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MZ-E60
6-3-5. SCHEMATIC DIAGRAM — MAIN BOARD (4/4) — • Refer to page 35 for IC Block Diagrams.
(Page 27)
(Page 30)
(Page 26)
(Page 30)
• Waveform
(MODE:PLAY)
Note:
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and / W or less unless otherwise
specified.
• Power voltage is dc 1.5V and fed with regulated dc power
supply from battery terminal.
• Voltage and waveforms are dc with respect to ground
under no-signal conditions.
0.2V/div 0.05µs/div
5
0.46Vp-p
1
4
no mark : PB
16.9344MHz
• A : B+ Line.
• Circled numbers refer to waveforms.
IC801
(XIN)
qj
– 31 –
– 32 –
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IC601 UPD63731GC-9EU
6-6. IC BLOCK DIAGRAMS
IC501 SN761056DBT
100 99 98 97 96 95 94 93 92 91 90 89 86 87 86 85 84 83 82 81 80 79 78 77 76
TE
44
43 ADIP IN
42 ADIP
REXT
1
820mV
ADIP
ADIP
PLL
ALFA B
IJ B
TE C
TON C
TWpp C
AwDw C
TON PEAK
TON BOTM
2
3
Wpp-LPF
VREF 1.1
VDD ADC
VREF
FE
1
2
3
4
5
6
7
RF
EFM
PLL
41 S MONIT
75 VDD
S-MONITOR
C
D
4
5
74 DRA3
FE
ABCD
TE
73
DRA2
TE
ABCD
SUBQ/ADIP
DECODER
DSSP
72 DRA1
71 DRA0
70 DRA4
69 DRA5
68 DRA6
TE
VRT1
RF
4
VRT2
ADIP
8
9
3
FLAG
67
DRA7
AC LRCK
AC WDCK
D-C
6
AC
WDCK
FE
40
39
38
37
VRT3
10
11
12
13
14
66 DRA8
SECTOR
DECODER
EFM ACIRC
DECODER
Tpp/Wpp
ABCD
AVCC
VSS ADC
T COUNT
DEFECT
OF TRX
65 DRA10
AC BYCK
AC DATA
64
63
62
61
DRA11
XRAS
DRA9
XOE2
S DATA
OFC C1
8
8
36 OFC C2
16
EFM DATA A/B
ECC DATA
EBA
VSS 15
OFC C3
OFC C4
35
34
8
NC
NC
60 XOE
16
17
18
19
20
21
22
23
24
25
RF
12
XCAS
DRD2
59
58
Iy
Ix
7
WR REQ etc.
RD DT ECC
8
8
NC
5
8
8
FE
57 DRD3
56 VSS
NC
RFOUT
33
Jx
9
VDD
SSB CONTROL
MONITOR I/O etc.
32 AGND
ATDT
16
10
11
12
13
Jy
A
10
LP
31
82V
30
29 TPP LPF
XWE2
XWE
DRD1
DRD0
VDD
55
54
53
52
51
ABCD
TFOUT
TROUT
FROUT
FFOUT
CK176
XATWE
DREQ
A-C
B
8
XBUSY
T COUNT
28
DFCT
DFCT
27
TON-C
PD-NI
PD-I
14
15
16
17
CLOCK
GENERATOR
ATRAC
DECODER
OFTRK
26
OFTRK
TON-C
PD-O
APC
LD-DRV 18
LD-EMIT 19
LD-VDD 20
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
T COUNT
25
24
DGND
RESET
23 SCK
SERIAL
I/F
ADIP
DVDD
SBUS
21
22
IC301 TA2131FL
IC902 XC6368B101MR
CE VDD
FB
1
IC302 AK4352VT-E2
3
2
18
17
16
15
14
13
VREF WITH
SOFT START,
CE
CLOCK DIVIDER
MCLK
PD
1
2
16 CKS
PW
SW
MT
SW
BST
SW
BEEP
VREF
LPF1
V REF
12
11
–
+
19
TC MT
15 VCML
14 AOUTL
PWM/PFM
CONTROLAR
PHASE
COMPENSATION
20
21
VCC1
VINR
ADD
8X
∆Σ
10 BST NF1
BICK
SDATA
LRCK
DIF0
3
4
5
6
7
8
LPF
LPF
INTERPOLATOR
MODULATOR
BST1
SERIAL
INPUT
INTERFACE
RAMP WAVE
GENERATOR,
OSC
VINL
22
9
LPF2
8X
∆Σ
13 AOUTR
12 VCMR
INTERPOLATOR
MODULATOR
–
+
PW
A
PW
B
BEEP
OUTB
BST2
BST NF2
BST OUT
23
24
8
7
DIF1
BEEP
OUTA
BUFFER,
DRIVER
DE-EMPHASIS
CONTROL
DEM
11 VREF
10 VDD
BST
AGC
5
4
1
2
3
4
5
6
EXT
GND
9
VSS
– 33 –
– 34 –
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IC602 MN41X17400CTT-10T1
VCC 1
26 VSS
D0
D1
2
3
25 D3
24 D2
XWE 4
23 XCAS
22 XOE
TIMING AND CONTROL
XRAS
5
A11
6
NC 7
A10 8
4M
ARRAY
ROW
ADDRESS
BUFFERS
4M
ARRAY
4M
I/O
ARRAY
BUFFER
A0
9
A1 10
A2 11
A3 12
4M
ARRAY
COLUMN
ADDRESS
BUFFERS
COLUMN
DECODER
21 A9
20 NC
19 A8
18 A7
17 A6
16 A5
15 A4
14 VSS
VCC 13
IC552 TLC372CPW
IC903 S-8328E20MC-EYA-T2
NC
3
VDD
2
VOUT
1
8
6
5
7
V+
VREF
+
–
SOFT
START
CIRCUIT
PWM
CONTROL
CIRCUIT
V–
1
3
4
2
5
EXT
4
VSS
IC803 S-8081ANNP-EDF-T2
4
3
VDD
OUT
NC 1
+
–
VREF
VSS
2
– 35 –
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IC551 BD6602KUT
48 47 46 45
44
43 42
41 40
39 38
37
36
35
34
33
H4PG2 49
RO4 50
+ –
+ –
+ –
VCC2
32 CPWO
31 CPVO
30 CPUO
PRE-DRIVE
H4VM 51
29 VMU
28 UO
FO4 52
H4PG1 53
27 GNDUV
26 VO
RI4 54
FI4 55
PRE-DRIVE
PRE-DRIVE
25 NC
PWM24 56
24 VMVW
23 WO
RI2 57
FI2 58
PRE-DRIVE
DECODER
H2PG2 59
RO2 60
22 GNDW
21 NC
20 NC
19 SGND
18 ASGND
VCC1
TO
EACH
H2VM 61
STANDBY
17 OE
BLOCK
VCC2
TO
BEMF
BIAS
FO2 62
H2PG1 63
FI3 64
COMPARATOR
PRE-DRIVE
1
2
3
4
5
6
7
8
9
10 11
12 13 14 15 16
IC802 AK93C55AV-L
VPP
GENERATOR
VREF
XCS
SK
1
2
VPP SW
8
VCC
INSTRUCTION
DECODE
CONTROL
AND
CLOCK
GENERATION
7
XBUSY
ADD
BUFFERS
DECODER
DO
DI
3
4
6
5
RST
GND
EEPROM
INSTRUCTION
REGISTER
R/W AMPS
AND
AUTO ERASE
DATA
REGISTER
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SECTION 7
EXPLODED VIEWS
NOTE:
• The mechanical parts with no reference
number in the exploded views are not supplied.
• Items marked “*” are not stocked since
they are seldom required for routine service.
Some delay should be anticipated
when ordering these items.
• -XX and -X mean standardized parts, so
they may have some difference from the
original one.
• Color Indication of Appearance Parts
Example :
The components identified by
mark 0 or dotted line with mark
0 are critical for safety.
Replace only with part number
specified.
KNOB, BALANCE (WHITE) ... (RED)
R
R
• Abbreviation
FR : French model
Les composants identifiés par une
marque 0 sont critiques pour
la sécurité.
Parts Color Cabinet’s Color
• Accessories and packing materials are
given in the last of this parts list.
Ne les remplacer que par une piéce
portant le numéro spécifié.
7-1. MAIN UNIT SECTION
8
11
9
10
A
12
12
MT-MZE60-169
14
8
7
15
12
13
16
A
23
22
6
1
20
17
21
18
2
3
19
4
5
Ref. No.
Part No.
Description
Remark
Ref. No.
9
Part No.
Description
Remark
1
2
3
4-225-573-01 KNOB (MB)
4-225-574-01 BUTTON (OPEN)
X-3378-853-1 CASE (REAR) ASSY (S1)
(SILVER)...(SILVER) (EXCEPT US)
X-3378-854-1 CASE (REAR) ASSY (L1) (BLUE)...(BLUE)
4-225-572-01 KNOB (HOLD)
X-3378-851-1 PANEL ASSY, (S-S), UPPER (SILVER)...(SILVER)
(EXCEPT US)
X-3378-852-1 PANEL ASSY, (S-L), UPPER (BLUE)...(BLUE)
4-225-587-01 SCREW (MD), STEP
X-4951-947-1 HOLDER ASSY
3-318-382-91 SCREW (1.7X2.5), TAPPING
9
10
11
12
3
4
5
X-3378-849-1 LID ASSY (S), BATTERY CASE
(SILVER)...(SILVER) (EXCEPT US)
X-3378-850-1 LID ASSY (L), BATTERY CASE (BLUE)...(BLUE)
4-225-566-01 FULCRUM (BATTERY CASE LID)
(SILVER)...(SILVER) (EXCEPT US)
13
13
14
15
16
A-3323-416-A MAIN BOARD, COMPLETE (EXCEPT FR)
A-3323-417-A MAIN BOARD, COMPLETE (FR)
4-225-567-01 SPRING (CONTACT)
4-225-568-01 SPRING, BATTERY COIL
4-225-580-01 SPRING (POP UP L)
5
6
6
7
8
8
4-225-566-11 FULCRUM (BATTERY CASE LID)
(BLUE)...(BLUE)
4-225-569-01 SHEET (BLIND)
17
18
19
20
21
X-4952-479-1 CHASSIS ASSY, REAR
4-225-581-01 SPRING (POP UP R)
4-225-583-01 SHEET, INSULATING
4-989-078-01 SPRING (OPEN), TENSION
3-045-227-01 SPACER (HOOK)
4-218-229-17 SCREW (1.4), MI (SILVER)...(SILVER)
(EXCEPT US)
4-218-229-19 SCREW (1.4), MI (BLUE)...(BLUE)
22
23
3-045-576-01 SPACER (KNOB)
3-045-221-01 RETAINER (REAR), SPACER CHASSIS
– 37 –
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7-2. MECHANISM DECK SECTION
(MT-MZE60-169)
55
54
53
56
57
M902
A
M901
59
58
61
60
A
52
62
57
60
51
63
57
57
The components identified by Les composants identifiés par une
mark 0 or dotted line with mark marque 0 sont critiques pour la
0 are critical for safety.
Replace only with part number Ne les remplacer que par une piéce
specified. portant le numéro spécifié.
sécurité.
Ref. No.
Part No.
Description
Remark
Ref. No.
Part No.
Description
Remark
51
52
53
54
55
1-675-668-11 MOTOR FLEXIBLE BOARD
4-963-883-42 SCREW (M1.4), PRECISION PAN
X-4951-926-1 CHASSIS ASSY
4-222-206-01 SPRING, THRUST
4-222-216-01 GEAR (SA)
59
60
61
062
63
4-222-208-01 GEAR (SB)
4-222-204-01 BEARING
4-222-203-01 SCREW, LEAD
X-4952-387-1 SERVICE ASSY, OP (LCX-2E)
4-222-205-01 SPRING, RACK
56
57
58
3-338-645-31 WASHER (0.8-2.5)
4-963-883-31 SCREW (M1.4), PRECISION PAN
3-349-825-21 SCREW
M901
M902
8-835-666-01 MOTOR, DC SSM-01C14A/C-NP (SPINDLE)
1-763-399-11 MOTOR, DC (SLED) (WITH PULLEY GEAR)
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SECTION 8
ELECTRICAL PARTS LIST
MAIN
NOTE:
• Due to standardization, replacements in
the parts list may be different from the
parts specified in the diagrams or the
components used on the set.
• -XX and -X mean standardized parts, so
they may have some difference from the
original one.
• Items marked “*” are not stocked since
they are seldom required for routine service.
Some delay should be anticipated
when ordering these items.
• SEMICONDUCTORS
In each case, u : µ, for example:
uA.. : µA.. uPA.. : µPA..
uPB.. : µPB.. uPC.. : µPC.. uPD.. : µPD..
• CAPACITORS
The components identified by
mark 0 or dotted line with mark
0 are critical for safety.
Replace only with part number
specified.
Les composants identifiés par une
marque 0 sont critiques pour
la sécurité.
Ne les remplacer que par une piéce
portant le numéro spécifié.
• RESISTORS
All resistors are in ohms.
METAL:Metal-film resistor.
METAL OXIDE: Metal oxide-film resistor.
F:nonflammable
uF : µF
• COILS
uH : µH
• Abbreviation
FR : France model
When indicating parts by reference
number, please include the board.
Ref. No.
Part No.
Description
Remark
Ref. No.
Part No.
Description
Remark
A-3323-416-A MAIN BOARD, COMPLETE (EXCEPT FR)
A-3323-417-A MAIN BOARD, COMPLETE (FR)
*********************
C558
C559
C561
C601
C602
1-164-677-11 CERAMIC CHIP 0.033uF 10%
1-164-677-11 CERAMIC CHIP 0.033uF 10%
1-164-156-11 CERAMIC CHIP 0.1uF
16V
16V
25V
25V
25V
1-164-156-11 CERAMIC CHIP 0.1uF
< CAPACITOR >
1-162-970-11 CERAMIC CHIP 0.01uF
10%
C101
C102
C103
C201
C202
1-135-181-21 TANTALUM CHIP 4.7uF
1-115-467-11 CERAMIC CHIP 0.22uF
20%
10%
20%
20%
10%
6.3V
10V
4V
6.3V
10V
C603
C604
C605
C607
C608
1-162-970-11 CERAMIC CHIP 0.01uF
1-162-970-11 CERAMIC CHIP 0.01uF
1-164-156-11 CERAMIC CHIP 0.1uF
1-164-156-11 CERAMIC CHIP 0.1uF
1-107-826-11 CERAMIC CHIP 0.1uF
10%
10%
25V
25V
25V
25V
16V
1-113-690-11 ELECT CHIP
220uF
1-135-181-21 TANTALUM CHIP 4.7uF
1-115-467-11 CERAMIC CHIP 0.22uF
10%
C203
C302
C303
C304
C305
1-113-690-11 ELECT CHIP
1-135-259-11 TANTAL. CHIP
1-135-259-11 TANTAL. CHIP
1-164-156-11 CERAMIC CHIP 0.1uF
1-135-259-11 TANTAL. CHIP 10uF
220uF
10uF
10uF
20%
20%
20%
4V
C609
C610
C611
C612
C613
1-119-750-11 TANTAL. CHIP
1-110-569-11 TANTAL. CHIP
1-164-156-11 CERAMIC CHIP 0.1uF
1-164-156-11 CERAMIC CHIP 0.1uF
1-164-156-11 CERAMIC CHIP 0.1uF
22uF
47uF
20%
20%
6.3V
6.3V
25V
25V
25V
6.3V
6.3V
25V
6.3V
20%
C306
C307
C308
C309
C310
1-107-826-11 CERAMIC CHIP 0.1uF
1-125-838-11 CERAMIC CHIP 2.2uF
10%
10%
20%
20%
10%
16V
C614
C801
C803
C805
C806
1-164-156-11 CERAMIC CHIP 0.1uF
1-162-962-11 CERAMIC CHIP 470PF
1-162-970-11 CERAMIC CHIP 0.01uF
1-164-156-11 CERAMIC CHIP 0.1uF
25V
50V
25V
25V
25V
6.3V
6.3V
6.3V
6.3V
10%
10%
1-135-259-11 TANTAL. CHIP
10uF
1-135-181-21 TANTALUM CHIP 4.7uF
1-125-837-11 CERAMIC CHIP 1uF
1-164-227-11 CERAMIC CHIP 0.022uF 10%
C351
C501
C502
C503
C504
1-164-156-11 CERAMIC CHIP 0.1uF
1-107-826-11 CERAMIC CHIP 0.1uF
1-110-563-11 CERAMIC CHIP 0.068uF 10%
1-162-969-11 CERAMIC CHIP 0.0068uF 10%
1-162-969-11 CERAMIC CHIP 0.0068uF 10%
25V
16V
16V
25V
25V
C809
C811
C812
C813
C814
1-164-156-11 CERAMIC CHIP 0.1uF
25V
25V
6.3V
25V
25V
10%
1-162-970-11 CERAMIC CHIP 0.01uF
1-125-837-11 CERAMIC CHIP 1uF
1-164-156-11 CERAMIC CHIP 0.1uF
1-164-156-11 CERAMIC CHIP 0.1uF
10%
10%
C505
C509
C510
C511
C512
1-162-970-11 CERAMIC CHIP 0.01uF
1-164-227-11 CERAMIC CHIP 0.022uF 10%
1-162-962-11 CERAMIC CHIP 470PF
1-164-156-11 CERAMIC CHIP 0.1uF
1-162-969-11 CERAMIC CHIP 0.0068uF 10%
10%
25V
25V
50V
25V
25V
C815
C851
C852
C853
C854
1-164-156-11 CERAMIC CHIP 0.1uF
1-164-156-11 CERAMIC CHIP 0.1uF
1-162-964-11 CERAMIC CHIP 0.001uF 10%
1-162-964-11 CERAMIC CHIP 0.001uF 10%
1-164-156-11 CERAMIC CHIP 0.1uF
25V
25V
50V
50V
25V
10%
C513
C514
C515
C516
C517
1-125-837-11 CERAMIC CHIP 1uF
1-125-837-11 CERAMIC CHIP 1uF
1-162-967-11 CERAMIC CHIP 0.0033uF 10%
1-162-945-11 CERAMIC CHIP 22PF
1-107-826-11 CERAMIC CHIP 0.1uF
10%
10%
6.3V
6.3V
50V
50V
16V
C901
C903
C904
C906
C907
1-119-749-11 TANTAL. CHIP
1-110-975-11 TANTAL. CHIP
1-110-975-11 TANTAL. CHIP
1-162-923-11 CERAMIC CHIP 47PF
1-109-982-11 CERAMIC CHIP 1uF
33uF
47uF
47uF
20%
20%
20%
5%
4V
6.3V
6.3V
50V
10V
5%
10%
10%
C518
C521
C524
C551
C552
1-117-720-11 CERAMIC CHIP 4.7uF
1-164-677-11 CERAMIC CHIP 0.033uF 10%
10V
16V
6.3V
16V
16V
C908
C909
C910
C911
C912
1-119-749-11 TANTAL. CHIP
1-162-962-11 CERAMIC CHIP 470PF
1-162-923-11 CERAMIC CHIP 47PF
1-104-630-11 TANTAL. CHIP
1-162-966-11 CERAMIC CHIP 0.0022uF 10%
33uF
20%
10%
5%
4V
50V
50V
6.3V
50V
1-117-920-11 TANTAL. CHIP
10uF
20%
10%
10%
1-107-826-11 CERAMIC CHIP 0.1uF
1-107-826-11 CERAMIC CHIP 0.1uF
33uF
20%
C553
C554
C555
C556
C557
1-107-765-11 TANTAL. CHIP
1-107-765-11 TANTAL. CHIP
1-135-238-21 TANTAL. CHIP
1-135-238-21 TANTAL. CHIP
3.3uF
3.3uF
6.8uF
6.8uF
20%
20%
20%
20%
16V
16V
10V
10V
16V
C951
C952
1-164-156-11 CERAMIC CHIP 0.1uF
25V
2.5V
1-125-976-11 TANTAL. CHIP
150uF
20%
1-164-677-11 CERAMIC CHIP 0.033uF 10%
– 39 –
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MAIN
Ref. No.
Part No.
Description
Remark
Ref. No.
Part No.
Description
Remark
< CONNECTOR >
Q801
Q802
Q901
Q902
Q903
8-729-905-35 TRANSISTOR 2SC4081-R
8-729-046-48 FET FDV303N
8-729-044-50 TRANSISTOR 2SD2153
8-729-230-60 TRANSISTOR 2SA1586-YG
8-729-046-48 FET FDV303N
* CN501 1-778-168-11 CONNECTOR, FFC/FPC (ZIF) 20P
CN551 1-784-228-21 CONNECTOR, FFC/FPC (ZIF) 8P
< DIODE >
Q904
Q905
Q906
Q907
Q908
8-729-402-16 TRANSISTOR XN4608
8-729-809-46 TRANSISTOR 2SD1935-CT6
8-729-420-44 TRANSISTOR UN5210
8-729-046-48 FET FDV303N
D351
D352
D353
D354
D802
8-719-017-58 DIODE MA8068
8-719-056-72 DIODE UDZ-TE-17-2.4B
8-719-056-72 DIODE UDZ-TE-17-2.4B
8-719-056-80 DIODE UDZ-TE-17-5.1B
8-729-046-48 FET FDV303N
8-719-061-82 LED TLSU1002(TPX1,SONY) (OPERATE)
< RESISTOR >
D855
D901
D902
D903
8-719-066-17 DIODE FTZ6.8E-T148
8-719-072-27 DIODE MA2Z748001S0
8-719-049-09 DIODE 1SS367-T3SONY
8-719-049-09 DIODE 1SS367-T3SONY
R101
R102
R103
R104
R201
1-216-833-11 RES-CHIP
1-216-827-11 METAL CHIP
1-216-797-11 METAL CHIP
1-216-829-11 METAL CHIP
1-216-833-11 RES-CHIP
10K
3.3K
10
4.7K
10K
5%
5%
5%
5%
5%
1/16W
1/16W
1/16W
1/16W
1/16W
< FERRITE BEAD >
FB801 1-414-228-11 FERRITE BEAD INDUCTOR
FB802 1-414-228-11 FERRITE BEAD INDUCTOR
R202
R203
R204
R301
R302
1-216-827-11 METAL CHIP
1-216-797-11 METAL CHIP
1-216-829-11 METAL CHIP
1-216-803-11 METAL CHIP
1-216-831-11 METAL CHIP
3.3K
10
4.7K
33
5%
5%
5%
5%
5%
1/16W
1/16W
1/16W
1/16W
1/16W
< IC >
6.8K
IC301 8-759-598-15 IC TA2131FL-EL
IC302 8-759-665-50 IC AK4352VT-E2
IC501 8-759-657-49 IC SN761055DBT
IC551 8-759-657-50 IC BD6602KUT
IC552 8-759-358-40 IC TLC372CPW-E20
R501
R502
R503
R504
R505
1-216-839-11 METAL CHIP
1-216-853-11 METAL CHIP
1-216-827-11 METAL CHIP
1-216-821-11 METAL CHIP
1-216-864-11 METAL CHIP
33K
470K
3.3K
1K
5%
5%
5%
5%
5%
1/16W
1/16W
1/16W
1/16W
1/16W
0
IC601 8-759-657-48 IC uPD63732GC-9EU
IC602 8-759-559-57 IC MN41X17400CTT-10T1
IC801 8-759-659-63 IC RU6915MF-0006
IC802 8-759-449-23 IC AK93C55AV-L
R506
R507
R508
R509
R513
1-216-793-11 RES-CHIP
1-216-843-11 METAL CHIP
1-216-864-11 METAL CHIP
1-216-864-11 METAL CHIP
1-216-864-11 METAL CHIP
4.7
68K
0
0
0
5%
5%
5%
5%
5%
1/16W
1/16W
1/16W
1/16W
1/16W
IC803 8-759-665-49 IC S-80818ANNP-EDF-T2
IC901 8-759-665-47 IC S-8328B24MC
IC902 8-759-657-26 IC XC6368B101MR
IC903 8-759-665-48 IC S-8328E20MC-EYA-T2
R514
R551
R552
R553
R554
1-216-864-11 METAL CHIP
1-216-833-11 RES-CHIP
1-216-833-11 RES-CHIP
1-216-829-11 METAL CHIP
1-216-829-11 METAL CHIP
0
5%
5%
5%
5%
5%
1/16W
1/16W
1/16W
1/16W
1/16W
10K
10K
4.7K
4.7K
< JACK >
J301
1-778-368-11 JACK, HEADPHONE (i)
R555
R556
R601
R801
R802
1-216-829-11 METAL CHIP
1-216-829-11 METAL CHIP
1-216-803-11 METAL CHIP
1-218-895-11 METAL CHIP
1-218-895-11 METAL CHIP
4.7K
4.7K
33
100K
100K
5%
5%
5%
1/16W
1/16W
1/16W
< COIL >
L501
L502
L551
L552
L553
1-412-006-31 INDUCTOR CHIP 10uH
1-412-006-31 INDUCTOR CHIP 10uH
1-410-389-31 INDUCTOR CHIP 47uH
1-410-389-31 INDUCTOR CHIP 47uH
0.5% 1/16W
0.5% 1/16W
R803
R804
R806
R809
R810
1-216-853-11 METAL CHIP
1-216-853-11 METAL CHIP
1-216-841-11 METAL CHIP
1-216-833-11 RES-CHIP
1-216-827-11 METAL CHIP
470K
470K
47K
10K
3.3K
5%
5%
5%
5%
5%
1/16W
1/16W
1/16W
1/16W
1/16W
1-414-400-41 INDUCTOR
22uH
L554
L601
L901
L902
L903
1-414-400-41 INDUCTOR
1-412-006-31 INDUCTOR CHIP 10uH
1-419-478-11 COIL, CHOKE 22uH
1-412-064-11 INDUCTOR CHIP 100uH
1-412-064-11 INDUCTOR CHIP 100uH
22uH
R811
R812
R813
R814
R816
1-216-825-11 METAL CHIP
1-216-829-11 METAL CHIP
1-216-831-11 METAL CHIP
1-216-835-11 METAL CHIP
1-216-825-11 METAL CHIP
2.2K
4.7K
6.8K
15K
5%
5%
5%
5%
5%
1/16W
1/16W
1/16W
1/16W
1/16W
< TRANSISTOR >
2.2K
Q301
Q501
8-729-037-52 TRANSISTOR 2SD2216J-QR
8-729-922-10 TRANSISTOR 2SA1577-QR
R817
1-216-809-11 METAL CHIP
100
5%
1/16W
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MAIN
Ref. No.
Part No.
Description
Remark
Ref. No.
Part No.
Description
Remark
R818
R819
R821
R822
R823
1-216-809-11 METAL CHIP
1-216-853-11 METAL CHIP
1-216-857-11 METAL CHIP
1-216-845-11 METAL CHIP
1-216-864-11 METAL CHIP
100
470K
1M
100K
0
5%
5%
5%
5%
5%
1/16W
1/16W
1/16W
1/16W
1/16W
MISCELLANEOUS
***************
51
062
M901
M902
1-675-668-12 MOTOR FLEXIBLE BOARD
X-4952-387-1 SERVICE ASSY, OP (LCX-2E)
8-835-666-01 MOTOR, DC SSM-01C14A/C-NP (SPINDLE)
1-763-399-11 MOTOR, DC (SLED) (WITH PULLEY GEAR)
R824
R825
R826
R827
R832
1-218-871-11 METAL CHIP
1-218-887-11 METAL CHIP
1-216-857-11 METAL CHIP
1-216-857-11 METAL CHIP
1-216-845-11 METAL CHIP
10K
47K
1M
1M
100K
0.5% 1/16W
0.5% 1/16W
5%
5%
5%
*************************************************************
1/16W
1/16W
1/16W
ACCESSORIES & PACKING MATERIALS
********************************
R833
R835
R836
R837
R902
1-216-864-11 METAL CHIP
1-216-864-11 METAL CHIP
1-216-839-11 METAL CHIP
1-216-864-11 METAL CHIP
1-216-853-11 METAL CHIP
0
0
33K
0
470K
5%
5%
5%
5%
5%
1/16W
1/16W
1/16W
1/16W
1/16W
1-418-493-71 REMOTE CONTROL UNIT (RM-MZ2N)
3-043-288-11 MANUAL, INSTRUCTION (ENGLISH,SPANISH,
TRADITIONAL CHINESE) (E)
3-043-288-21 MANUAL, INSTRUCTION (ENGLISH,FRENCH)
(US/CND/AEP)
3-043-288-31 MANUAL, INSTRUCTION (GERMAN,ITALIAN)
(AEP)
3-043-288-41 MANUAL, INSTRUCTION (DUTCH,PORTUGUESE)
(AEP)
R903
R911
R912
R913
R914
1-216-857-11 METAL CHIP
1-216-864-11 METAL CHIP
1-218-895-11 METAL CHIP
1-218-911-11 METAL CHIP
1-218-883-11 METAL CHIP
1M
0
100K
470K
33K
5%
5%
1/16W
1/16W
0.5% 1/16W
0.5% 1/16W
0.5% 1/16W
3-043-288-51 MANUAL, INSTRUCTION (SWEDISH,FINNISH)
(AEP)
R915
R916
R917
R919
R920
1-216-863-11 RES-CHIP
1-216-851-11 METAL CHIP
1-216-853-11 METAL CHIP
1-216-829-11 METAL CHIP
1-216-864-11 METAL CHIP
3.3M
330K
470K
4.7K
0
5%
5%
5%
5%
5%
1/16W
1/16W
1/16W
1/16W
1/16W
3-043-288-61 MANUAL, INSTRUCTION (SPANISH,RUSSIAN)
(AEP)
4-221-117-01 CASE, CARRYING
8-953-278-90 HEADPHONE MDR-A34SP SET (US)
8-953-304-90 RECEIVER MDR-E805SP SET (EXCEPT US)
R921
R922
R923
R924
R925
1-218-879-11 METAL CHIP
1-218-895-11 METAL CHIP
1-218-911-11 METAL CHIP
1-218-911-11 METAL CHIP
1-218-891-11 METAL CHIP
22K
0.5% 1/16W
0.5% 1/16W
0.5% 1/16W
0.5% 1/16W
0.5% 1/16W
100K
470K
470K
68K
R926
R927
R928
R929
1-216-853-11 METAL CHIP
1-216-857-11 METAL CHIP
1-216-857-11 METAL CHIP
1-216-823-11 METAL CHIP
470K
1M
1M
5%
5%
5%
5%
1/16W
1/16W
1/16W
1/16W
1.5K
< NETWORK RESISTOR >
RB551 1-233-965-11 RES, NETWORK (CHIP TYPE) 4.7K
RB552 1-233-979-11 RES, NETWORK (CHIP TYPE) 1M
RB802 1-233-977-11 RES, NETWORK (CHIP TYPE) 470K
< SWITCH >
S801
S802
S803
S804
S805
1-771-138-21 SWITCH, KEY BOARD (x)
1-771-138-21 SWITCH, KEY BOARD (> N)
1-771-138-21 SWITCH, KEY BOARD (.)
1-771-138-21 SWITCH, KEY BOARD (VOL +)
1-771-138-21 SWITCH, KEY BOARD (VOL –)
S806
S807
S808
S809
1-762-079-11 SWITCH, SLIDE (DIGITAL MEGABASS)
1-762-078-11 SWITCH, SLIDE (AVLS)
1-762-078-11 SWITCH, SLIDE (HOLD)
1-762-342-11 SWITCH, PUSH (1 KEY) (OPEN/CLOSE)
< VIBRATOR >
X601
1-767-621-11 VIBRATOR, CERAMIC (16.9344MHz)
*************************************************************
The components identified by Les composants identifiés par une
mark 0 or dotted line with mark marque 0 sont critiques pour la
0 are critical for safety.
Replace only with part number Ne les remplacer que par une piéce
specified.
sécurité.
portant le numéro spécifié.
– 41 –
Download from Www.Somanuals.com. All Manuals Search And Download.
MZ-E60
Sony Corporation
Personal Audio Division Company
2000A0478-1
Printed in Japan C2000. 1
9-927-633-11
Download from Www.Som–anu4a2ls.c–om. All Manuals Search And DoPwunblolisahde. d by General Engineering Dept.
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