MDS-PC2
SERVICE MANUAL
US Model
Canadian Model
AEP Model
UK Model
E Model
Model Name Using Similar Mechanism MDS-S40
MD Mechanism Type
Optical Pick-up Type
MDM-5A
KMS-260B/J1N
SPECIFICATIONS
— Continued on next page —
MINIDISC DECK
MICROFILM
1
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ITEMS OF ERROR HISTORY MODE ITEMS AND CONTENTS
Selecting the Test Mode
Display
total rec
Details of History
Displays the recording time.
Displayed as “rππππππh”.
The displayed time is the total time the laser is set to the high power state.
This is about 1/4 of the actual recording time.
The time is displayed in decimal digits from 0h to 65535h.
Displays the play time.
total play
retry err
Displayed as “pππππππh”. The time displayed is the total actual play time. Pauses are not counted.
The time is displayed in decimal digits from 0h to 65535h.
Displays the total number of retries during recording and number of retry errors during play.
Displayed as “rππ pππ”.
“r” indicates the retries during recording while “p” indicates the retry errors during play.
The number of retries and retry errors are displayed in hexadecimal digits from 00 to FF.
Displays the total number of errors.
total err
Displayed as “total ππ”.
The number of errors is displayed in hexadecimal digits from 00 to FF.
Displays the 10 latest errors.
err history
Displayed as “0π E@@”.
π indicates the history number. The smaller the number, the more recent is the error. (00 is the latest).
@@ indicates the error code.
Refer to the following table for the details. The error history can be switched by pressing the + button.
Mode which erases the “retry err”, “total err”, and “err history” histories.
When returning the unit to the customer after completing repairs, perform this to erase the past error history,
After pressing the r “PROGRAM” button and “er refresh?” is displayed, press the ^ “PROGRAM” button
to erase the history.
er refresh
“Complete!” will be displayed momentarily.
Be sure to check the following when this mode has been executed.
• The data has been erased.
• The mechanism operates normally when recording and play are performed.
Mode which erases the “total rec” and “total play” histories.
These histories serve as approximate indications of when to replace the optical pickup.
If the optical pickup has been replaced, perform this operation and erase the history.
After pressing the ^ “PROGRAM” button and “tm refresh?” is displayed, press the r “PROGRAM” button
to erase the history.
tm refresh
“Complete!” will be displayed momentarily.
Be sure to check the following when this mode has been executed.
• The data has been erased.
• The mechanism operates normally when recording and play are performed.
Table of Error Codes
Error Code
Error Code
E05
Details of Error
Details of Error
FOK has deviated
E00
E01
No error
Read error. PTOC cannot be read
(DISC ejected)
E06
Cannot focus (Servo has deviated)
Recording retry
E07
E02
TOC error. UTOC error
(DISC not ejected)
E08
Recording retry error
Playback retry error
(Access error)
E09
E03
E04
Loading error
Address cannot be read (Servo has deviated)
E0A
Play retry error (C2 error)
3
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CAUTION
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type recommended by
the equipment manufacturer.
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER PROD-
UCT MARKING is located on
the rear exterior.
Discard used batteries according to manufacture’s instructions.
ADVARSEL!
Lithiumbatteri - Eksplosionsfare ved fejlagtig håndtering.
Udskiftning må kun ske med batteri af samme fabrikat og type.
Levér det brugte batteri tilbage til leverandøren.
This caution
label is located
inside the unit.
ADVARSEL
Eksplosjonsfare ved feilakting skifte av batteri.
Benytt samme batteritype eller en tilsvarende type anbefalt av
apparatfabrikanten.
Brukte batterier katterier kasseres i henhold til fabrikantens
VARNIG
Explosionsfara vid felaktigt batteribyte.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
Använd samma batterityp eller en likvärdig typ som rekommenderas
av apparattillverkaren.
Kassera använt batteri enligt gällande föreakrifter.
VAROITUS
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Parist voi räjähtää, jos se on virheellisesti asennettu.
Vaihda paristo ainoastaan laitevalmistajan suosittelemaan tyyppiin.
Hävitä käytetty paristo valmistajan ohjeiden mukaisesti.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
MODEL IDENTIFICATION
SAFETY-RELATED COMPONENT WARNING !!
— MODEL NUMBER LABEL —
COMPONENTS IDENTIFIED BY MARK !OR DOTTED LINE
WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
Parts No.
PARTS No.
4-220-576-0π US model
MODEL
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!!
4-220-577-0π Canadian model
4-220-578-0π AEP, UK model
4-220-579-0π Singapore model
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE !SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE
FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS
QUE PAR DES PIÈCES SONY DONT LES NUMÉROS
SONT DONNÉS DANS CE MANUEL OU DANS LES
SUPPLÉMENTS PUBLIÉS PAR SONY.
4
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SAFETY CHECK-OUT
TABLE OF CONTENTS
After correcting the original service problem, perform the follow-
ing safety checks before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, screws,
and all other exposed metal parts for AC leakage. Check leakage as
described below.
1. SERVICING NOTE .......................................................... 6
2. GENERAL ........................................................................ 12
3. DISASSEMBLY
3-1. Case and Front Panel .......................................................... 14
3-2. MD Mechanism .................................................................. 14
3-3. Slider (CAM) ...................................................................... 15
3-4. Base Unit (MBU-5A) BD Board ........................................ 15
3-5. SW Board and Loading Motor (M103) .............................. 16
LEAKAGE
The AC leakage from any exposed metal part to earth Ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microampers). Leak-
age current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
4.TEST MODE ..................................................................... 17
5. ELECTRICAL ADJUSTMENTS ............................... 22
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of aVOM
or battery-operated AC voltmeter. The “limit” indication is 0.75
V, so analog meters must have an accurate low-voltage scale.
The Simpson 250 and Sanwa SH-63Trd are examples of a pas-
sive VOM that is suitable. Nearly all battery operated digital
multimeters that have a 2V AC range are suitable. (See Fig. A)
6. DIAGRAMS
6-1. Circuit Boards Location ...................................................... 31
6-2. Block Diagrams
• BD Section ....................................................................... 33
• Main Section .................................................................... 34
6-3. Printed Wiring Board – BD Section –................................. 36
6-4. Schematic Diagram – BD (1/2) Section –........................... 37
6-5. Schematic Diagram – BD (2/2) Section –........................... 38
6-6. Schematic Diagram – Main (1/2) Section –........................ 39
6-7. Schematic Diagram – Main (2/2) Section –........................ 40
6-8. Printed Wiring Board – Main Section – .............................. 41
6-9. Schematic Diagram – Panel Section – ................................ 42
6-10. Printed Wiring Board – Panel Section –............................ 43
6-11. Schematic Diagram – Power Section – ............................. 44
6-12. Printed Wiring Board – Power Section – .......................... 45
6-13. Schematic Diagram – BD Switch Section – ..................... 46
6-14. Printed Wiring Board – BD Switch Section – ................... 46
6-15. IC Block Diagrams ........................................................... 46
6-15. IC Pin Functions ............................................................... 49
To Exposed Metal
Parts on Set
AC
voltmeter
(0.75V)
0.15µF
1.5kΩ
Earth Ground
7. EXPLODED VIEWS
7-1. Cabinet Section ................................................................... 53
7-2. Mechanism Section (MDM-5A) ......................................... 54
7-3. Base Unit Section (MBU-5A)............................................. 55
Fig. A. Using an AC voltmeter to check AC leakage.
8. ELECTRICAL PARTS LIST ........................................ 56
5
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SECTION 1
SERVICING NOTE
JIG FOR CHECKING BD BOARD WAVEFORM
The special jig (J-2501-149-A) is useful for checking the waveform of the BD board. The names of terminals and the checking items to be
performed are shown as follows.
GND : Ground
I+3V : For measuring IOP (Check the deterioration of the optical pick-up laser)
IOP : For measuring IOP (Check the deterioration of the optical pick-up laser)
TEO : TRK error signal (Traverse adjustment)
VC : Reference level for checking the signal
RF : RF signal (Check jitter)
Mechanism deck
CN110
6P connector
5P connector
VC
RF
TEO
IOP
I+3V
GND
1
RF
RF
VC
TEO For MDM-3
VC
IOP
5
1
I+3V
TEO
IOP
I+3V
GND
VC
RF
TEO
For MDM-5
IOP
I+3V
GND
6
6
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IOP DATA RECORDING AND DISPLAY WHEN OPTICAL PICK-UP AND NON-VOLATILE MEMORY (IC171 OF
BD BOARD) ARE REPLACED
The IOP value labeled on the optical pick-up can be recorded in the non-volatile memory. By recording the value, it will eliminate the need
to look at the value on the label of the optical pick-up. When replacing the optical pick-up or non-volatile memory (IC171 of BD board),
record the IOP value on the optical pick-up according to the following procedure.
Record Precedure:
1. While pressing the INPUT button and p button, connect the power plug to the outlet, and release the INPUT button and p button.
2. Press the + button to display “[Service]”, and press the ^ “PROGRAM” button.
3. Press the + button to display “lop.Write”, and press the ^ “PROGRAM” button.
4. The display becomes “Ref=@@@.@” (@ is an arbitrary number) and the numbers which can be changed will blink.
5. Input the IOP value written on the optical pick-up.
To select the number : Press the + button.
To select the digit
: Press the r “PROGRAM” button.
6. When the ^ “PROGRAM” button is pressed, the display becomes “Measu=@@@.@” (@ is an arbitrary number).
7. As the adjustment results are recorded for the 6 value. Leave it as it is and press the ^ “PROGRAM” button.
8. “Complete!” will be displayed momentarily. The value will be recorded in the non-volatile memory and the display will become “Iop
Write”.
9. Press the 6 “1” button to complete. “Standby” will be displayed.
Display Precedure:
1. While pressing the INPUT button and p button, connect the power plug to the outlet, and release the INPUT button and p button.
2. Press the + button to display “[Service]”, and press the ^ “PROGRAM” button.
3. Press the + button to display “lop.Read”, and press the ^ “PROGRAM” button.
4. “@@.@/##.#” is displayed and the recorded contents are displayed.
@@.@ : indicates the Iop value labeled on the pick-up.
##.#
: indicates the Iop value after adjustment
5. To end, press the r “PROGRAM” button or p “PROGRAM” button to display “Iop Read”. Then press the 6 “1” buttun.
*Note:
As this unit has only a few buttons, one button is assigned with several functions in the test mode.
Press the INPUT button to switch the functions.
Each time the INPUT button is pressed, the display switches in the following order; “PROGRAM” n “1” n blank n “PROGRAM”
The functions of each button change with the display.
For simplicity, operations of the INPUT button will not be described here.
Instead, symbols are added to the names of buttons. Press the INPUT button as required to switch the display.
Example) p “PROGRAM” : Display “PROGRAM” and press the p button. p “1” : Display “1” and press the p button.
7
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CHECKS PRIOR TO PARTS REPLACEMENT AND ADJUSTMENTS
Before performing repairs, perform the following checks to determine the faulty locations up to a certain extent.
Details of the procedures are described in “5 Electrical Adjustments”.
Criteria for Determination
(Unsatisfactory if specified value is not satisfied)
Measure if unsatisfactory:
Laser power check
(5-6-2 : See page 37)
• 0.9 mW power
Specified value : 0.84 to 0.92 mW
• 7.0 mW power
• Clean the optical pick-up
• Adjust again
• Replace the optical pick-up
Specified value : 6.8 to 7.2 mW
lop (at 7mW)
• Replace the optical pick-up
• Labeled on the optical pickup
Iop value ± 10mA
Traverse check
• Traverse waveform
Specified value : Below 10% offset
• Error rate check
Specified value : For points a, b, and c
C1 error : Below 220
• Replace the optical pick-up
• Replace the optical pick-up
(5-6-3 : See page 37)
Focus bias check
(5-6-4 : See page 38)
AD error : Below 2
C PLAY check
• Error rate check
• Replace the optical pick-up
(5-6-5 : See page 38)
Specified value:
a.When using test disc (MDW-74/AU-1)
C1 error : Below 80
AD error : Below 2
b.When using check disc (TDYS-1)
C1 error : Below 50
Self-recording/playback • CPLAY error rate check
If always unsatisfactory:
check
Specified value:
• Replace the overwrite head
(REC/PLAY)
(5-6-6 : See page 38)
C1 error : Below 80
AD error : Below 2
• Check for disconnection of the circuits around the
overwrite head
If occasionally unsatisfactory:
• Check if the overwrite head is distorted
• Check the mechanism around the sled
• Check for disconnection of the circuits around D101
(BD board)
TEMP check
(Temperature
• Unsatisfactory if displayed as T=@@ (##) [NG”
NG
compensation
offset check)
(@@, ## are both arbitrary numbers)
• Check the signals around IC101, IC121, CN102,
CN103 (BD board)
(5-6-1 : See page 37)
Note:
The criteria for determination above is intended merely to determine if satisfactory or not, and does not serve as the specified value for
adjustments.
When performing adjustments, use the specified values for adjustments.
8
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FORCED RESET
The system microprocessor can be reset in the following procedure.
Use these procedure when the unit cannot be operated normally due to the overrunning of the microprocessor, etc.
The line output level and PHONES output level can be varied in the range from 0 dB to -40 dB using the remote commander of this unit.
When forced reset is executed, these levels will be set to the initial value of -20 dB.
Procedure :
1. Disconnect the power plug from the outlet.
2. Remove the BACK UP board.
3. Insert the power plug into the outlet.
4. Mount the back up board.
5. Press the I/u button. When “Initialize” is displayed, it means that forced reset has been executed.
[POWER BOARD] (Component Side)
Back up board
FLUORESCENT DISPLAY TUBE ALL LIGHTING AND KEY CHECK MODE
In this mode, the fluorescent display tube check and key check can be performed.
Procedure:
1. While pressing the INPUT button and r (REC) button, insert the power plug into the outlet.”
2. The fluorescent display tube displays “FL ALL 10n Key” momentarily and lights up completely.”
3. The display goes off partially each time a button is pressed.
4. When all buttons are pressed, “Push INPUT” is displayed.
5. When the INPUT button is pressed, the fluorescent display tube displays “Seg Chk” momentarily and lights up partially.
6. When the INPUT button is pressed, it displays “Rmk Chk” momentarily followed by “Push Rmc Key”.
If not using a remote commander, end there and disconnect the power plug from the outlet. If using a remote commander, press any
button.”
7. The check is completed when “Chk End!”is displayed. Press the I/u button to end.”
9
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RETRY CAUSE DISPLAY MODE
• In this test mode, the causes for retry of the unit during recording can be displayed on the fluorescent indicator tube. During playback, the
“track mode” for obtaining track information will be set.
This is useful for locating the faulty part of the unit.
• The following will be displayed :
During recording and stop : Retry cause, number of retries, and number of retry errors.
During playback
: Information such as type of disc played, part played, copyright.
These are displayed in hexadecimal.
Precedure:
1. Load a recordable disc whose contents can be erased into the unit.
2. For discs with no disc name, set the name display using the remote commander. (The time display is set after some time. Leave as it is if
desired.)
3. Press the p button immediately. Wait for about 10 seconds while pressing the button. (The AMS knob can be pressed instead of the YES
button for the same results.)
4. The fluorescent display tube displays “RTs@@c##e**”.
5. Press the r button to start recording. Then press the ^ button and start recording.
6. To check the “track mode”, press the ^ button to start play.
7. To exit the test mode, press the 1/u button. If the test mode cannot be exited, refer to “Forced Reset” on page 8.
Fig. 2 Reading the Test Mode Display
(During playback)
Fig. 1 Reading theTest Mode Display
(During recording and stop)
@@####**$$
RTs@@c##c**
Fluorescent display tube display
Fluorescent display tube display
@@ : Parts No. (name of area named on TOC)
@@ : Cause of retry
## : Cluster
** : Sector
## : Number of retries
** : Number of retry errors
} Address (Physical address on disc)
$$ : Track mode (Track information such as copyright infor-
mation of each part)
Reading the Retry Cause Display
Higher Bits
Lower Bits
Hexa-
Hexadecimal
Bit
Cause of Retry
Occurring conditions
8
4
2
1
8
4
2
1
decimal
b7 b6 b5 b4 b3 b2 b1 b0
shock
ader5
Binary
01
02
When track jump (shock) is detected
When ADER was counted more than five times
continuously
0
0
0
0
0
0
0
1
0
0
0
0
0
0
1
0
Discontinuous address
DIN unlock
04
08
10
20
40
80
When ADIP address is not continuous
When DIN unlock is detected
0
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
FCS incorrect
IVR rec error
CLV unlock
When not in focus
When ABCD signal level exceeds the specified range
When CLV is unlocked
Access fault
When access operation is not performed normally
Reading the Display:
Convert the hexadecimal display into binary display. If more than two causes, they will be added.
Example
When 42 is displayed:
Higher bit : 4 = 0100 n b6
Lower bit : 2 = 0010 n b1
In this case, the retry cause is combined of “CLV unlock” and “ader5”.
When A2 is displayed:
Higher bit : A = 1010 n b7+b5
Lower bit : 2 = 0010 n b2
The retry cause in this case is combined of “access fault”, “IVR rec error”, and “ader5”.
10
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Reading the Track Mode Display
Higher Bits
Lower Bits
Details
Hexa-
Hexadecimal
Bit
8
4
2
1
8
4
2
1
decimal
b7 b6 b5 b4 b3 b2 b1 b0
When 0
When 1
Emphasis ON
Binary
01
02
04
08
10
20
40
80
0
0
0
0
0
0
0
1
0
0
0
0
0
0
1
0
0
0
0
0
0
1
0
0
0
0
0
0
1
0
0
0
0
0
0
1
0
0
0
0
0
0
1
0
0
0
0
0
0
1
0
0
0
0
0
0
1
0
0
0
0
0
0
0
Emphasis OFF
Monaural
Stereo
This is 2-bit display. Normally 01.
01:Normal audio. Others:Invalid
Audio (Normal)
Invalid
Digital copy
No copyright
Write allowed
Original
Copyright
Write prohibited
Reading the Display:
Convert the hexadecimal display into binary display. If more than two causes, they will be added.
Example When 84 is displayed:
Higher bit : 8 = 1000 n b7
Lower bit : 4 = 0100 n b2
In this case, as b2 and b7 are 1 and others are 0, it can be determined that the retry cause is combined of “emphasis OFF”, “monaural”,
“original”, “copyright exists”, and “write allowed”.
Example When 07 is displayed:
Higher bit : 0 = 1000 n All 0
Lower bit : 7 = 0111 n b0+b1+b2
In this case, as b0, b1, and b2 are 1 and others are 0, it can be determined that the retry cause is combined of “emphasis ON”, “stereo”,
“original”, “copyright exists”, and “write prohibited”.
Hexadecimal n Binary Conversion Table
Hexadecimal
Binary
0000
0001
0010
0011
0100
0101
0110
0111
Hexadecimal
Binary
1000
1001
1010
1011
1100
1101
1110
1111
8
9
0
1
2
3
4
5
6
7
A
B
C
D
E
F
11
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This section is extracted from
instruction manual.
SECTION 2
GENERAL
Front Panel
1
5
4
2
3
11
10
9
8
7
6
Location of Parts and Controls
12
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SECTION 3
DISASSEMBLY
Note: Follow the disassembly procedure in the numerical order given.
3-1. CASE AND FRONT PANEL
2 Two screws
(Flat head)
1 Two screws
(Flat head)
3 Case
7 Screw
Claw
(M2 x 6.0)
5 Screw
(BTT M3)
Claw
8 Front panel
(Take not of two claws)
9 Flat type wire
(CN701)
6 Screw
(M2 x 6.0)
4 Two screws
(BTT M3)
3-2. MD MECHANISM
0 MD mechanism
8 Two step screws
9 Two step screws
5 Screw
(BVTP 3 x 8)
1 Connector 8P
(CN503)
2 Flat type wire
(CN412)
3 Flat type wire
(CN501)
4 Flat type wire
(CN421)
7 Main board
6 Screw
(BVTP 3 x 8)
13
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3-3. SLIDER (CAM)
6 Slider (Cam)
• Note for Installation of Slider (Cam)
Set the shaft of Cam gear to
be at the position in the figure.
2 Bracket (Guide L)
1 Two screws
(BTP 2.6 x 6)
Set the shaft of Lever (O/C) to
be at the position in the figure.
3 Leaf spring
4 Two screws
(BTP 2.6 x 6)
5 Bracket (Guide R)
3-4. BASE UNIT (MBU-5A) AND BD BOARD
2 Base unit (MBU-5A)
5 Flexible board
(CN104)
6 Flexible board
(CN101)
1 Three screws
(BTP2.6 x 6)
3 Remove the solder (Five position)
7 BD board
4 Screw (M1.7 x 4)
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14
3-5. SW BOARD AND LOADING MOTOR (M103)
1 Screw (PTPWH M2.6 x 6)
2 Gear B
3 Two screws
(PWH 1.7 x 3)
4 Loading motor (M103)
6 SW board
5 Three screws
(BTP2.6 x 6)
15
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SECTION 4
TEST MODE
*Note:
As this unit has only a few buttons, one button is assigned with several functions in the test mode.”
Press the INPUT button to switch the functions.
Each time the INPUT button is pressed, the display switches in the following order;”
“PROGRAM” n “1” n blank n “PROGRAM”
The functions of each button change with the display.
Buttons and Corresponding Functions
Function when
nothing displayed
Function when “PROGRAM”
is displayed
Buttons
Function when “1” is displayed
TIME
1/u
1/u
6 (EJECT)
^
6 (EJECT)
^
REPEAT
CLEAR
PLAY MODE
ENTER/YES
0 (FR)
=
= (AMS)
+ (AMS)
p (STOP)
r (REC)
+
) (FF)
p (STOP)
r (REC)
DISPLAY
SCROLL
EDIT/NO
PUSH (AMS)
4-1. PRECAUTIONS FOR USE OF TEST MODE
• As loading related operations will be performed regardless of the test mode operations being performed, be sure to check that the disc is
stopped before setting and removing it.
Even if the 6 (EJECT) button is pressed while the disc is rotating during continuous playback, continuous recording, etc., the disc will not
stop rotating.
Therefore, it will be ejected while rotating.
Be sure to press the 6 (EJECT) button after pressing the p “PROGRAM” button and the rotation of disc is stopped.
4-1-1. Recording laser emission mode and operating buttons
• Continuous recording mode (CREC MODE)
• Laser power check mode (LDPWR CHECK)
• Laser power adjustment mode (LDPWR ADJUST)
• Traverse (MO) check (EF MO CHECK)
• Traverse (MO) adjustment (EF MO ADJUST)
• When pressing the r (REC) button.
4-2. SETTINGTHE TEST MODE
The following are two methods of entering the test mode.
Procedure 1: While pressing the INPUT button and p button, connect the power plug to an outlet, and release the INPUT button and p
button.
When the test mode is set, “[Check]” will be displayed. Rotating the INPUT button switches between the following four
groups; ···Nn Check Nn Adjust Nn Service Nn Develop Nn ···.
Procedure 2: While pressing the INPUT button, connect the power plug to the outlet and release the INPUT button.
When the test mode is set, “TEMP CHECK” will be displayed. By setting the test mode using this procedure, only the “Check”
group of procedure 1 can be executed.
4-3. EXITING THE TEST MODE
Press the p “1” button. The disc is ejected when loaded, and “Standby” display blinks, and the STANDBY state is set.
4-4. BASIC OPERATIONS OF THE TEST MODE
All operations are performed using the = , + button, ^ “PROGRAM” button, and p “PROGRAM” button.
The functions of these buttons are as follows.
Function name
Function
= , + button
Changes parameters and modes
^ “PROGRAM” button Proceeds onto the next step. Finalizes input.
p “PROGRAM” button Returns to previous step. Stops operations.
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4-5. SELECTING THE TEST MODE
There are 27 types of test modes as shown below. The groups can be switched by pressing the = and = buttons. After selecting the
group to be used, press the ^ “PROGRAM” button.After setting a certain group, pressing the = and = buttons switches between
these modes.
Refer to “Group” in the table for details selected.
All items used for servicing can be treated using group S. So be carefully not to enter other groups by mistake.
Display
Mark
Group (*)
Contents
Temperature compensation offset check
Laser power check
C
C
C
C
C
C
C
C
S
S
TEMP CHECK
LDPWR CHECK
EF MO CHECK
EF CD CHECK
FBIAS CHECK
S curve CHECK
VERIFY MODE
DETRK CHECK
TEMP ADJUST
LDPWR ADJUST
EF MO ADJUST
EF CD ADJUST
FBIAS ADJUST
EEP MODE
S
S
S
Traverse (MO) check
Traverse (CD) check
Focus bias check
(X)
S letter check
(X)
Non-volatile memory check
Detrack check
(X)
A
A
A
A
A
S
S
S
S
S
Temperature compensation offset adjustment
Laser power adjustment
Traverse (MO) adjustment
Traverse (CD) adjustment
Focus bias adjustment
(X) (!)
(X)
D
D
D
Non-volatile memory control
Command transmission
Status display
MANUAL CMD
SVDATA READ
ERR DP MODE
SLED MOVE
Inpossible
(X)
S
Error history display, clear
Sled check
(X)
D
D
(X)
No function
ADJ CLEAR
A
A
A
S
S
S
S
S
S
S
S
Initialization of non-volatile memory of adjustment value
Auto gain output level adjustment (MO)
Auto gain output level adjustment (CD)
IOP data display
AG Set (MO)
AG Set (CD)
Iop Read
C
Iop Write
A
IOP data write
C
C
C
INFORMATION
CPLAY MODE
CREC MODE
Microprocessing version display
Continuous play mode
A
A
D
D
Continuous recording mode
Group (*)
C: Check
S: Service
A: Adjust
D: Develop
• For details of each adjustment mode, refer to “5. Electrical Adjustments”.
For details of “ERR DP MODE”, refer to “Self-Diagnosis Function” on page 2.
• If a different mode has been selected by mistake, press the p “PROGRAM” button to exit that mode.
• Modes with (X) in the Mark column are not used for servicing and therefore are not described in detail. If these modes are set accidentally,
press the p “PROGRAM” button to exit the mode immediately. Be especially careful not to set the modes with (!) as they will overwrite
the non-volatile memory and reset it, and as a result, the unit will not operate normally.
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4-5-1. Operating the Continuous Playback Mode
1. Entering the continuous playback mode
1 Set the disc in the unit. (Whichever recordable discs or discs for playback only are available.)
2 Press the + button and display “CPLAY MODE”.
3 Press the ^ “PROGRAM” button to change the display to “CPLAY MID”.
4 When access completes, the display changes to “C1 =
AD = ”.
Note : The numbers “ ” displayed show you error rates and ADER.
2. Changing the parts to be played back
1 Press the ^ “PROGRAM” button during continuous playback to change the display as below.
“CPLAY MID” n “CPLAY OUT” n “CPLAY IN”
When pressed another time, the parts to be played back can be moved.
2 When access completes, the display changes to “C1 =
AD = ”.
Note : The numbers “ ” displayed show you error rates and ADER.
3. Ending the continuous playback mode
1 Press the p “PROGRAM” button. The display will change to “CPLAY MODE”.
2 Press the 6 (EJECT) button to remove the disc.
Note : The playback start addresses for IN, MID, and OUT are as follows.
IN
40h cluster
MID 300h cluster
OUT 700h cluster
4-5-2. Operating the Continuous Recording Mode (Use only when performing self-recording/palyback check.)
1. Entering the continuous recording mode
1 Set a recordable disc in the unit.
2 Press the + button and display “CREC MODE”.
3 Press the ^ “PROGRAM” button to change the display to “CREC MID”.
4 When access completes, the display changes to “CREC (
)” and REC lights up.
Note : The numbers “ ” displayed shows you the recording position addresses.
2. Changing the parts to be recorded
1 When the + “PROGRAM” button is pressed during continuous recording, the display changes as below.
“REC MID” n “REC OUT” n “REC IN”
When pressed another time, the parts to be recorded can be changed. REC goes off.
2 When access completes, the display changes to “CREC (
” and REC lights up.
Note : The numbers “ ” displayed shows you the recording position addresses.
3. Ending the continuous recording mode
1 Press the p “PROGRAM” button. The display changes to “CREC MODE” and REC goes off.
2 Press the 6 (EJECT) button to remove the disc.
Note 1 : The recording start addresses for IN, MID, and OUT are as follows.
IN
40h cluster
MID 300h cluster
OUT 700h cluster
Note 2 :The p “PROGRAM” button can be used to stop recording anytime.
Note 3 :Do not perform continuous recording for long periods of time above 5 minutes.
Note 4 :During continuous recording, be careful not to apply vibration.
4-5-3. Non-Volatile Memory Mode (EEP MODE)
This mode reads and writes the contents of the non-volatile memory.
It is not used in servicing. If set accidentally, press the p “PROGRAM” button immediately to exit it.
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4-6. FUNCTIONS OF OTHER BUTTONS
Contents
Function
Sets continuous playback when pressed in the STOP state. When pressed during continuous playback, the tracking servo turns
ON/OFF.
^
Stops continuous playback and continuous recording.
The sled moves to the outer circumference only when this is pressed.
The sled moves to the inner circumference only when this is pressed.
Switches between the pit and groove modes when pressed.
Switches the spindle servo mode (CLV S ˜ CLV A).
Switches the displayed contents each time the button is pressed
Ejects the disc
p
+ “PROGRAM”
= “PROGRAM”
r “1”
*
*
*
*
^ “1”
p “1”
6 (EJECT)
6 “1”
Exits the test mode
*
*Note:
As this unit has only a few buttons, one button is assigned with several functions in the test mode.”
Press the INPUT button to switch the functions.
Each time the INPUT button is pressed, the display switches in the following order;”
“PROGRAM” n “1” n blank n “PROGRAM”
The functions of each button change with the display.
4-7.TEST MODE DISPLAYS
Each time the p “1” button is pressed, the display changes in the following order.
1. Mode display
Displays “TEMP ADJUST”, “CPLAYMODE”, etc.
Mode display
Error rate display
2. Error rate display
Displays the error rate in the following way.
C1 =
AD =
Address display
C1 = Indicates the C1 error.
AD = Indicates ADER.
Auto gain display (Not used in servicing)
Detrack check display (Not used in servicing)
IVR display (Not used in servicing)
3. Address display
The address is displayed as follows. (MO:recordable disc, CD:playback only disc)
Pressing the r “1” button switches between the groove display and pit display.
h =
h =
s =
a =
(MO pit and CD)
(MO groove)
h = Indicates the header address.
s = Indicates the SUBQ address.
a = Indicates the ADIP address.
Note : “–” is displayed when servo is not imposed.
4. Auto gain display (Not used in servicing)
The auto gain is displayed as follows.
AG =
/
[
]
5. Detrack check display (Not used in servicing)
The detrack is displayed as follows.
ADR =
6. IVR display (Not used in servicing)
The IVR is displayed as follows.
[
][
][
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MEANINGS OF OTHER DISPLAYS
Contents
Display
When Lit
When Off
During continuous playback (CLV: ON)
Tracking servo OFF
Recording mode ON
CLV low speed mode
ABCD adjustment completed
Tracking offset cancel ON
Tracking auto gain OK
Focus auto gain OK
Pit
STOP (CLV: OFF)
Tracking servo ON
(
P
Recording mode OFF
CLV normal mode
REC
SYNC
L.SYNC
OVER
B
Tracking offset cancel OFF
A-
Groove
TRACK
DISC
SLEEP
MONO
High reflection
Low reflection
CLV A
CLV S
CLV LOCK
CLV UNLOCK
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SECTION 5
ELECTRICAL ADJUSTMENTS
5-1. PARTS REPLACEMENT AND ADJUSTMENT
• Check and adjust the MDM and MBU as follows.
The procedure changes according to the part replaced
• Abbreviation
OP : Optical pick-up
OWH: Overwrite head
• Temperature compensation offset check
• Laser power check
• Traverse check
• Focus bias check
• C PLAY check
• Self-recording/playback check
OK
NG
Check the sleding and spindle
mechanisms.
Other causes can be suspected.
Parts Replacement and Repair
YES
Has the OWH been replaced?
NO
Has OP, IC171, IC101, or
IC121 been replaced?
YES
Initial setting of the adjustment value
NO
Has OP or IC171 been replaced?
NO
YES
IOP information recording
(IOP value labeled on OP)
Has IC171 or D101
been replaced?
NO
YES
Temperature compensation offset adjustment
• Laser power adjustment
• Traverse adjustment
• Focus bias adjustment
• Error rate adjustment
• Focus bias check
• Auto gain adjustment
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4) Use the following tools and measuring devices.
• Check Disc (MD) TDYS-1
5-2. PRECAUTIONS FOR CHECKING LASER DIODE
EMISSINON
To check the emission of the laser diode during adjustments, never
(Parts No. 4-963-646-01)
• Test Disk (MDW-74/AU-1) (Parts No. 8-892-341-41)
• Laser power meter LPM-8001 (Parts No. J-2501-046-A)
or
MD Laser power meter 8010S (Parts No. J-2501-145-A)
• Oscilloscope (Measure after performing CAL of prove.)
• Digital voltmeter
• Thermometer
• Jig for checking BD board waveform
(Parts No. : J-2501-149-A)
view directly from the top as this may lose your eye-sight.
5-3. PRECAUTIONS FOR USE OF OPTICAL PICK-
UP (KMS-260A)
As the laser diode in the optical pick-up is easily damaged by static
electricity, solder the laser tap of the flexible board when using it.
Before disconnecting the connector, desolder first. Before connect-
ing the connector, be careful not to remove the solder. Also take
adequate measures to prevent damage by static electricity. Handle
the flexible board with care as it breaks easily.
5) When observing several signals on the oscilloscope, etc.,
make sure thatVC and ground do not connect inside the oscillo-
scope.
(VC and ground will become short-circuited.)
6) Using the above jig enables the waveform to be checked without
the need to solder.
pick-up
flexible board
(Refer to Servicing Note on page 6.)
7) As the disc used will affect the adjustment results, make sure
that no dusts nor fingerprints are attached to it.
Note:
When performing laser power checks and adjustment (electrical
adjustment), use of the new MD laser power meter 8010S (J-2501-
145-A) instead of the conventional laser power meter is convenient.
It sharply reduces the time and trouble to set the laser power meter
sensor onto the objective lens of the optical pick-up.
laser tap
Optical pick-up flexible board
5-5. CREATING CONTINUOUSLY RECORDED DISC
* This disc is used in focus bias adjustment and error rate check.
The following describes how to create a continuous recording disc.
1. Insert a disc (blank disc) commercially available.
2. Press the + button and display “CREC MODE”.
3. Press the ^ “PROGRAM” button again to display “CREC
MID”.
5-4. PRECAUTIONS FOR ADJUSTMENTS
1) When replacing the following parts, perform the adjustments
and checks with ¬ in the order shown in the following table.
BD Board
Optical
Pick-up
IC101, IC121 IC192
IC171
D101
Display “CREC (0300)” and start to recording.
4. Complete recording within 5 minutes.
5. Press the p “PROGRAM” button and stop recording .
6. Press the 6 (EJECT) button and remove the disc.
1.Initial setting of
adjustment value
¬
¬
G
¬
G
G
2.Recording of IOP
information
(Value written in
the pick-up)
¬
G
¬
¬
G
¬
G
The above has been how to create a continuous recorded data for
the focus bias adjustment and error rate check.
Note : Be careful not to apply vibration during continuous record-
ing.
3.Temperature
compensation
offset adjustment
G
G
4.Laser power
adjustment
¬
¬
¬
¬
G
G
¬
¬
¬
G
5.Traverse
adjustment
6.Focus bias
adjustment
¬
¬
¬
¬
¬
¬
G
G
G
¬
¬
¬
G
G
G
7.Error rate check
8.Auto gain output
level adjustment
2) Set the test mode when performing adjustments.
After completing the adjustments, exit the test mode.
Perform the adjustments and checks in “group S” of the test mode.
3) Perform the adjustments to be needed in the order shown.
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Note 1: After step 4, each time the ^ “PROGRAM” button is
5-6. CHECKS PRIOR TO REPAIRS
pressed, the display will be switched between “0.7 mW***
These checks are performed before replacing parts according to
“approximate specifications” to determine the faulty locations. For
details, refer to “Checks Prior to Parts Replacement and
Adjustments” (See page 8).
$
”, “6.2 mW*** $ ”, and “WP
*** $ ”.
Nothing needs to be performed here.
5-6-3.Traverse Check
Connection :
5-6-1.Temperature Compensation Offset Check
When performing adjustments, set the internal temperature and room
temperature to 22 to 28°C.
Oscilloscope
BD board
CN110 pin 3 (TE)
Checking Procedure:
CN110 pin 1 (VC)
1. Press the + button to display “TEMP CHECK”.
2. Press the ^ “PROGRAM” button.
V : 0.5 V/div
H : 10 ms/div
Input : DC mode
3. “T=@@(##) [OK]” should be displayed. If “T=@@ (##) [NG]”
is displayed, it means that the results are bad.
(@@ indicates the current value set, and ## indicates the value
written in the non-volatile memory.)
Checking Procedure:
1. Connect an oscilloscope to CN110 pin 3 (TE) and CN110 pin
1 (VC) of the BD board.
2. Load a disc (any available on the market). (Refer to Note 1.)
3. Press the + “PROGRAM” button and move the optical pick-
up outside the pit.
4. Press the + button and display “EF MO CHECK”.
5. Press the ^ “PROGRAM” button and display “EFB =
MO-R”.
5-6-2. Laser Power Check
Before checking, check the IOP value of the optical pick-up.
(Refer to 5-8. Recording and Displaying IOP Information.)
Connection :
Laser power
meter
(Laser power READ power/Focus servo ON/tracking servo OFF/
spindle (S) servo ON)
6. Observe the waveform of the oscilloscope, and check that the
specified value is satisfied. Do not press the = , + but-
tons.
Optical pick-up
objective lens
Digital volt meter
(Read power traverse checking)
(Traverse Waveform)
BD board
CN110 pin 5 (I+3V)
CN110 pin 4 (IOP)
A
VC
B
Checking Procedure:
1. Set the laser power meter on the objective lens of the optical
pick-up. (When it cannot be set properly, press the = “PRO-
GRAM” button or + “PROGRAM” button to move the
optical pick-up.)
Specified value : Below 10% offset value
IA – BI
Offset value (%) =
X 100
2 (A + B)
Connect the digital volt meter to CN110 pin 5 (I+3V) and
CN110 pin 4 (IOP).
7. Press the ^ “PROGRAM” button and display “EFB =
MO-W”.
8. Observe the waveform of the oscilloscope, and check that the
specified value is satisfied. Do not press the = , + but-
tons..
2. Then, press the + button and display “LDPWR CHECK” .
3. Press the ^ “PROGRAM” button once and display “0.9
mW*** $ ”. Check that the reading of the laser power meter
become 0.84 to 0.92 mW. (*** means IOP value)
4. Press the ^ “PROGRAM” button once more and display
“7.0 mW*** $ ”. Check that the reading the laser power meter
and digital volt meter satisfy the specified value.
(Write power traverse checking)
(Traverse Waveform)
Specified Value :
A
Laser power meter reading : 7.0 ± 0.2 mW
Digital voltmeter reading : Optical pick-up displayed value ± 10%
VC
B
(Optical pick-up label)
(For details of the method for checking
KMS260A
Specified value : Below 10% offset value
IA – BI
this value, refer to “5-8. Recording and
27X40
Displaying IOP Information”.)
Offset value (%) =
X 100
B0825
2 (A + B)
Iop = 82.5 mA in this case
Iop (mA) = Digital voltmeter reading (mV)/1 (Ω)
9. Press the ^ “PROGRAM” button display “EFB =
MO-
P”.
Then, the optical pick-up moves to the pit area automatically
and servo is imposed.
5. Press the p “PROGRAM” button and display “LDPWR
CHECK” and stop the laser emission.
(The p “PROGRAM” button is effective at all times to stop
the laser emission.)
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10. Observe the waveform of the oscilloscope, and check that the
specified value is satisfied. Do not press the = , + but-
tons.
5-6-4. Focus Bias Check
Change the focus bias and check the focus tolerance amount.
Checking Procedure :
1. Load a test disk (MDW-74/AU-1).
2. Rotate the + button and display “CPLAY MODE”.
3. Press the ^ “PROGRAM” button twice and display “CPLAY
MID”.
(Traverse Waveform)
A
VC
4. Press the p “PROGRAM” button when “C1 =
AD =
”
is displayed.
B
5. Press the + button and display “FBIAS CHECK”.
6. Press the ^ “PROGRAM” button and display “
/
c =
”.
Specified value : Below 10% offset value
IA – BI
The first four digits indicate the C1 error rate, the two digits
after “/” indicate ADER, and the 2 digits after “c =” indicate the
focus bias value.
Offset value (%) =
X 100
2 (A + B)
Check that the C1 error is below 220 and ADER is below 2.
11. Press the ^ “PROGRAM” button display “EF MO CHECK”
The disc stops rotating automatically.
12. Press the 6 (EJECT) button and remove the disc.
13. Load the check disc (MD) TDYS-1.
14. Press the + button and display “EF CD CHECK”.
15. Press the ^ “PROGRAM” button and display “EFB =
CD”. Servo is imposed automatically.
16. Observe the waveform of the oscilloscope, and check that the
specified value is satisfied. Do not press the = , + but-
tons.
7. Press the ^ “PROGRAM” button and display “
/
b =
”.
Check that the C1 error is below 220 and ADER is below 2.
8. Press the ^ “PROGRAM” button and display “
/
a =
”.
Check that the C1 error is below 220 and ADER is below 2.
9. Press the p “PROGRAM” button, next press the 6 (EJECT)
button, and remove the test disc.
5-6-5. C PLAY Checking
(Traverse Waveform)
MO Error Rate Check
Checking Procedure :
A
1. Press a test disk (MDW-74/AU-1).
VC
2. Rotate the + button knob and display “CPLAY MODE” .
3. Press the ^ “PROGRAM” button and display “CPLAY MID”.
B
4. The display changes to “C1 =
AD = ”.
5. If the C1 error rate is below 80, check that ADER is below 2.
6. Press the p “PROGRAM” button, stop playback, press the 6
(EJECT) button, and test disc.
Specified value : Below 10% offset value
IA – BI
Offset value (%) =
X 100
2 (A + B)
CD Error Rate Check
Checking Procedure :
1. Load a check disc (MD) TDYS-1.
2. Press the + button knob and display “CPLAY MODE”.
3. Press the ^ “PROGRAM” button and display “CPLAY MID”.
17. Press the ^ “PROGRAM” button and display “EF CD
CHECK”.
18. Press the 6 (EJECT) button and remove the check disc (MD)
TDYS-1.
4. The display changes to “C1 =
AD = ”.
Note 1 : MO reading data will be erased during if a recorded disc is
used in this adjustment.
Note 2 : If the traverse waveform is not clear, connect the oscillo-
scope as shown in the following figure so that it can be
5. Check that the C1 error rate is below 50.
6. Press the p “PROGRAM” button, stop playback, press the 6
(EJECT) button, and the test disc.
seen more clearly.
5-6-6. Self-Recording/playback Check
Prepare a continuous recording disc using the unit to be repaired
and check the error rate.
Oscilloscope
330 kΩ
BD board
CN110 pin 3 (TE)
CN110 pin 1 (VC)
Checking Procedure :
10pF
1. Insert a recordable disc (blank disc) into the unit.
2. Press the + button knob to display “CREC MODE”.
3. Press the ^“PROGRAM” button to display the “CREC MID”.
4. When recording starts, “ REC ” is displayed, this becomes
“CREC (@@@@)" (@@@@ is the address), and recording
starts.
5. About 1 minute later, press the p “PROGRAM” button to stop
continuous recording.
6. Press the = button to display “C PLAY MODE”.
7. Press the ^ “PROGRAM” button to display “C PLAY MID”.
8. “C1 =
AD = ” will be displayed.
9. Check that the C1 error becomes below 80 and the AD error
below 2.
10. Press the p “PROGRAM” button to stop playback, and press
the 6 (EJECT) button and remove the disc.
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5-7. INITIAL SETTING OF ADJUSTMENT VALUE
5-9. TEMPERATURE COMPENSATION OFFSET
ADJUTMENT
Save the temperature data at that time in the non-volatile memory
Note:
Mode which sets the adjustment results recorded in the non-volatile
memory to the initial setting value. However the results of the
temperature compensation offset adjustment will not change to the
initial setting value.
If initial setting is performed, perform all adjustments again
excluding the temperature compensation offset adjustment.
For details of the initial setting, refer to “5-4. Precautions on
Adjustments” and execute the initial setting before the adjustment
as required.
as 25 ˚C reference data.
Note :
1. Usually, do not perform this adjustment.
2. Perform this adjustment in an ambient temperature of 22 ˚C to
28 ˚C. Perform it immediately after the power is turned on when
the internal temperature of the unit is the same as the ambient
temperature of 22 ˚C to 28 ˚C.
3. When D101 has been replaced, perform this adjustment after
the temperature of this part has become the ambient tempera-
ture.
Setting Procedure :
Adjusting Procedure :
1. Press the + button to display “ADJ CLEAR”.
2. Press the ^ “PROGRAM” button. “Complete!” will be dis-
played momentarily and initial setting will be executed, after
which “ADJ CLEAR” will be displayed.
1. Press the + button and display “TEMP ADJUST”.
2. Press the ^ “PROGRAM” button and select the “TEMP
ADJUST” mode.
3. “TEMP =
displayed.
[OK]” and the current temperature data will be
5-8. RECORDING AND DISPLAYING THE IOP
INFORMATION
The IOP data can be recorded in the non-volatile memory. The IOP
value on the label of the optical pickup and the IOP value after the
adjustment will be recorded. Recording these data eliminates the
need to read the label on the optical pick-up.
4. To save the data, press the ^ “PROGRAM” button.
When not saving the data, press the p “PROGRAM” button.
5. When the ^ “PROGRAM” button is pressed, “TEMP =
SAVE” will be displayed and turned back to “TEMP ADJUST”
display then. When the p “PROGRAM” button is pressed,
“TEMP ADJUST” will be displayed immediatelly.
Specified Value :
Recording Procedure :
The “TEMP =
0F”, “10 - 1F” and “20 - 2F”.
” should be within “E0 - EF”, “F0 - FF”, “00 -
1. While pressing the INPUT button and p button, connect the
power plug to the outlet, and release the INPUT button and p
button.
5-10. LASER POWER ADJUSTMENT
Check the IOP value of the optical pick-up before adjustments.
2. Press the + button to display “[Service]”, and press the ^
“PROGRAM” button.
3. Rotate the + button to display “Iop.Write”, and press the
^ “PROGRAM” button.
(Refer to 5-8. Recording and Displaying IOP Information.)
4. The display becomes Ref=@@@.@ (@ is an arbitrary number)
and the numbers which can be changed will blink.
5. Input the IOP value written on the optical pick-up.
To select the number : Press the = , + buttons.
To select the digit : Press the r “PROGRAM” knob
6. When the ^ “PROGRAM” button is pressed, the display
becomes “Measu=@@@.@” (@ is an arbitrary number).
7. As the adjustment results are recorded for the 6 value. Leave it
as it is and press the ^ “PROGRAM” button.
8. “Complete!” will be displayed momentarily. The value will be
recorded in the non-volatile memory and the display will become
“Iop Write”.
Connection :
Laser power
meter
Optical pick-up
objective lens
Digital volt meter
BD board
CN110 pin 5 (I+3V)
CN110 pin 4 (IOP)
Display Procedure :
1. Press the + button to display “Iop.Read”.
2. “@@.@/##.#” is displayed and the recorded contents are
displayed.
@@.@ indicates the Iop value labeled on the pick-up.
##.# indicates the Iop value after adjustment
3. To end, press the r “PROGRAM” button or p “PROGRAM”
button to display “Iop Read”.
Adjusting Procedure :
1. Set the laser power meter on the objective lens of the optical
pick-up. (When it cannot be set properly, press the = “PRO-
GRAM” button or + “PROGRAM” button to move the
optical pick-up.)
Connect the digital volt meter to CN110 pin 5 (I+3V) and
CN110 pin 4 (IOP).
2. Press the + button and display “LDPWR ADJUST”.
(Laser power : For adjustment)
3. Press the ^ “PROGRAM” button once and display “LD 0.9
mW $ ”.
4. Press the = , + buttons so that the reading of the laser
power meter becomes 0.85 to 0.91 mW. Press the ^ “PRO-
GRAM” button after setting the range knob of the laser power
meter, and save the adjustment results. (“LD SAVE $ ” will
be displayed for a moment.)
5. Then “LD 7.0 mW $ ” will be displayed.
25
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6. Press the = , + buttons so that the reading of the laser
power meter becomes 6.9 to 7.1 mW, press the ^ “PRO-
GRAM” button and save it.
5-11.TRAVERSE ADJUSTMENT
Connection :
Oscilloscope
Note : Do not perform the emission with 7.0 mW more than 15
seconds continuously.
7. Then, press the + button and display “PWR CHECK”.
8. Press the ^ “PROGRAM” button once and display “0.9
mW*** $ ”. Check that the reading of the laser power meter
become 0.85 to 0.91 mW. (*** means IOP value)
BD board
CN110 pin 3 (TE)
CN110 pin 1 (VC)
V : 0.5 V/div
H : 10 ms/div
Input : DC mode
9. Press the ^ “PROGRAM” button once more and display
“7.0 mW*** $ ”. Check that the reading the laser power meter
and digital volt meter satisfy the specified value.
Adjusting Procedure :
Note down the digital voltmeter reading value.
1. Connect an oscilloscope to CN110 pin 3 (TE) and CN110 pin
1 (VC) of the BD board.
2. Load a disc (any available on the market). (Refer to Note 1.)
3. Press the + “PROGRAM” button and move the optical pick-
up outside the pit.
Specified Value :
Laser power meter reading : 7.0 ± 0.1 mW
Digital voltmeter reading : Optical pick-up displayed value ± 10%
4. Press the + button and display “EF MO ADJUST”.
5. Press the + button and display “EFB = MO-R”.
(Laser power READ power/Focus servo ON/tracking servo OFF/
spindle (S) servo ON)
6. Press the + button so that the waveform of the oscilloscope
becomes the specified value.
(Optical pick-up label)
(For details of the method for checking
KMS260A
this value, refer to “5-8. Recording and
27X40
Displaying IOP Information”.)
B0825
(When the = , + buttons is pressed, the of “EFB=
”
Iop = 82.5 mA in this case
Iop (mA) = Digital voltmeter reading (mV)/1 (Ω)
changes and the waveform changes.) In this adjustment, wave-
form varies at intervals of approx. 2%. Adjust the waveform so
that the specified value is satisfied as much as possible.
(Read power traverse adjustment)
10. Press the p “PROGRAM” button and display “LDPWR
CHECK” and stop the laser emission.
(The p “PROGRAM” button is effective at all times to stop
the laser emission.)
(Traverse Waveform)
11. Press the + button to display “Iop.Write”.
12. Press the ^ “PROGRAM” button. When the display be-
comes Ref=@@@.@ (@ is an arbitrary number), press the ^
“PROGRAM” button to display “Measu=@@@.@” (@ is an
arbitrary number).
A
VC
B
13. The numbers which can be changed will blink. Input the Iop
value noted down at step 9.
To select the number : Press the = , + buttons.
To select the digit : Press the r “PROGRAM” buttan
14. When the ^ “PROGRAM” button is pressed, “Complete!”
will be displayed momentarily. The value will be recorded in
the non-volatile memory and the display will become “Iop
Write”.
Specification A = B
7. Press the ^ “PROGRAM” button and save the result of ad-
justment to the non-volatile memory (“EFB = SAVE” will be
displayed for a moment. Then “EFB =
played).
MO-W” will be dis-
8. Press the = , + buttons so that the waveform of the
Note 1: After step 4, each time the ^ “PROGRAM” button is
oscilloscope becomes the specified value.
pressed, the display will be switched between “0.7 mW***
(When the = , + buttons is pressed, the of “EFB-
”
$
”, “6.2 mW*** $ ”, and “ WP
*** $ ”.
changes and the waveform changes.) In this adjustment, wave-
form varies at intervals of approx. 2%. Adjust the waveform so
that the specified value is satisfied as much as possible.
(Write power traverse adjustment)
Nothing needs to be performed here.
(Traverse Waveform)
A
VC
B
Specification A = B
9. Press the ^ “PROGRAM” button, and save the adjustment
results in the non-volatile memory. (“EFB =
SAVE” will be
displayed for a moment.)
10. “EFB = MO-P”. will be displayed.
The optical pick-up moves to the pit area automatically and servo
is imposed.
26
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11. Press the = , + buttons until the waveform of the oscil-
loscope moves closer to the specified value.
5-12. FOCUS BIAS ADJUSTMENT
Adjusting Procedure :
In this adjustment, waveform varies at intervals of approx. 2%.
Adjust the waveform so that the specified value is satisfied as
much as possible.
1. Load a test disk (MDW-74/AU-1).
2. Press the + button and display “CPLAY MODE”.
3. Press the ^“PROGRAM” button and display “CPLAY MID”.
4. Press the p “PROGRAM” button when “C1 =
AD =
”
(Traverse Waveform)
is displayed.
5. Press the + button and display “FBIAS ADJUST”.
6. Press the p “PROGRAM” button and display “
A
/
a =
”.
VC
The first four digits indicate the C1 error rate, the two digits
after “/” indicate ADER, and the 2 digits after [a =] indicate the
focus bias value.
B
7. Press the + button and find the focus bias value at which the
C1 error rate becomes about 200 (Refer to Note 2).
Specification A = B
8. Press the ^ “PROGRAM” button and display “
/
b =
12. Press the ^ “PROGRAM” button, and save the adjustment
results in the non-volatile memory. (“EFB = SAVE” will be
displayed for a moment.)
Next “EF MO ADJUST” is displayed. The disc stops rotating
automatically.
13. Press the 6 (EJECT) button and remove the disc.
14. Load the check disc (MD) TDYS-1.
15. Press + button and display “EF CD ADJUST”.
16. Press the ^ “PROGRAM” button and display “EFB =
CD”. Servo is imposed automatically.
17. Press the = , + buttons so that the waveform of the
oscilloscope moves closer to the specified value.
In this adjustment, waveform varies at intervals of approx. 2%.
Adjust the waveform so that the specified value is satisfied as
much as possible.
”.
9. Press the = button direction and find the focus bias value at
which the C1 error rate becomes about 200.
10. Press the ^ “PROGRAM” button and display “
/
c =
”.
11. Check that the C1 error rate is below 50 and ADER is 00. Then
press the ^ “PROGRAM” button.
12. If the “( )” in “
-
-
(
)” is above 20, press the p
“PROGRAM” button.
If below 20, press the p “PROGRAM” button and repeat the
adjustment from step 2.
13. Press the 6 (EJECT) button to remove the test disc.
Note 1 : The relation between the C1 error and focus bias is as
shown in the following figure. Find points a and b in the
following figure using the above adjustment. The focal
point position C is automatically calculated from points a
and b.
(Traverse Waveform)
A
Note 2 : As the C1 error rate changes, perform the adjustment us-
ing the average vale.
VC
B
C1 error
Specification A = B
about
200
18. Press the ^ “PROGRAM” button, display “EFB = SAVE”
for a moment and save the adjustment results in the non-vola-
tile memory.
Next “EF CD ADJUST” will be displayed.
19. Press the 6 (EJECT) button and remove the check disc (MD)
TDYS-1.
b
c
a
Focus bias value
(F. BIAS)
Note 1 : MO reading data will be erased during if a recorded disc is
used in this adjustment.
Note 2 : If the traverse waveform is not clear, connect the oscillo-
scope as shown in the following figure so that it can be
seen more clearly.
Oscilloscope
330 kΩ
BD board
CN110 pin 3 (TE)
CN110 pin 1 (VC)
10pF
27
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5-13. ERROR RATE CHECK
5-13-1. CD Error Rate Check
5-15. AUTO GAIN CONTROL OUTPUT LEVEL
ADJUSTMENT
Checking Procedure :
Be sure to perform this adjustment when the pickup is replaced.
If the adjustment results becomes “Adjust NG!”, the pickup may be
faulty or the servo system circuits may be abnormal.
1. Load a check disc (MD) TDYS-1.
2. Press the + button and display “CPLAY MODE”.
3. Press the ^ “PROGRAM” button twice and display “CPLAY
MID”.
5-15-1. CD Auto Gain Control Output Level Adjustment
Adjusting Procedure :
4. The display changes to “C1 =
AD = ”.
5. Check that the C1 error rate is below 20.
1. Insert the check disc (MD) TDYS-1.
6. Press the p “PROGRAM” button, stop playback, press the 6
(EJECT) button, and remove the test disc.
2. Press the + button to display “AG Set (CD)”.
3. When the ^ “PROGRAM” button is pressed, the adjustment
will be performed automatically.
5-13-2. MO Error Rate Check
“Complete!!” will then be displayed momentarily when the value
is recorded in the non-volatile memory, after which the display
changes to “AG Set (CD)”.
Checking Procedure :
1. Load a test disc (MDW-74/AU-1).
2. Press the + button and display “CPLAY MODE”.
3. Press the ^“PROGRAM” button and display “CPLAY MID”.
4. Press the 6 (EJECT) button to remove the disc.
5-15-2. MO Auto Gain Control Output Level Adjustment
4. The display changes to “C =
AD = ”.
5. If the C1 error rate is below 50, check that ADER is 00.
6. Press the p “PROGRAM” button, stop playback, press the 6
(EJECT) button, and remove the test disc.
Adjusting Procedure :
1. Insert the reference disc (MDW-74/AU-1) for recording.
2. Press the + button to display “AG Set (MO)”.
3. When the ^ “PROGRAM” button is pressed, the adjustment
will be performed automatically.
5-14. FOCUS BIAS CHECK
Change the focus bias and check the focus tolerance amount.
Checking Procedure :
1. Load a test disc (MDW-74/AU-1).
2. Press the + button and display “CPLAY MODE”.
3. Press the ^ “PROGRAM” button twice and display “CPLAY
MID”.
“Complete!!” will then be displayed momentarily when the value
is recorded in the non-volatile memory, after which the display
changes to “AG Set (MO)”.
4. Press the 6 (EJECT) button to remove the disc.
4. Press the p “PROGRAM” button when “C1 =
AD =
”
is displayed.
5. Press the + button and display “FBIAS CHECK”.
6. Press the ^ “PROGRAM” button and display “
/
c =
”.
The first four digits indicate the C1 error rate, the two digits
after “/” indicate ADER, and the 2 digits after “c =” indicate the
focus bias value.
Check that the C1 error is below 50 and ADER is below 2.
7. Press the ^ “PROGRAM” button and display “
/
b =
a =
”.
Check that the C1 error is below 220 and ADER is below 2.
8. Press the ^ “PROGRAM” button and display “
/
”.
Check that the C1 error is below 220 and ADER is below 2
9. Press the p “PROGRAM” button, next press the 6 (EJECT)
button, and remove the continuously recorded disc.
Note 1 : If the C1 error and ADER are above other than the speci-
fied value at points a (step 8. in the above) or b (step 7. in
the above), the focus bias adjustment may not have been
carried out properly. Adjust perform the beginning again.
28
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5-15. ADJUSTING POINTS AND CONNECTING POINTS
[BD BOARD] (SIDE A)
CN101
D101
GND
I+3V
CN110
IOP
TE
RF
VC
NOTE
IC171
[BD BOARD] (SIDE B)
IC101
IC121
IC192
NOTE:
It is useful to use the jig. for checking the waveform. (Refer to Ser-
vicing Note on page 6.)
29
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SECTION 6
DIAGRAMS
6-1. CIRCUIT BOARDS LOCATION
Back up board
SW board
BD board
Power board
Main board
Panel board
30
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MDS-PC2
DIGITAL SERVO SIGNAL PROCESSOR, DIGITAL SIGNAL PROCESSOR
EFM/ACIRC ENCODER/DECODER, SHOCK-PROOF MEMORY CONTROLLER,
ATRAC ENCODER/DECODER
6-2. BLOCK DIAGRAM – BD SECTION –
IC121
OVER WRITE HEAD DRIVE
IC181
SCTX
XINIT
HR901
OVER WRITE
HEAD
15
14
9
•
DIN0
DIN1
19
20
DIN0
DIN1
8
•
11
12
HEAD
DRIVE
Q181,182
10
EFMO
1
2
100
•
3
13
ADDT
• SIGNAL PATH
:PB
25
ADDT
4
5
6
:REC
EFM,
SHOCK
ATRAC
ENCODER/
DECODER
DIGITAL
AUDIO
I/F
ACIRC,
PCO
FILI
FILO
CLTV
RESISTANT
MEMORY
:PB (Digital out)
:REC (Digital in)
59
60
61
62
ENCODER/
DECODER
CONTROLLER
PLL
RF AMP
IC101
48 47 46 40
DADT
DOUT
26
21
DADT
DOUT
OPTICAL PICK-UP BLOCK
(KMS-260A/J1N)
RF
RFI
RF AGC & EQ
38
33
57
XBCK
LRCK
28
27
BCK
LRCK
I
J
1
2
SAMPLING
RF AMP
BPF
AUX
AUX1
CLOCK
P-P
RATE
67
GENERATOR
DETECTOR
F
CONVERTER
OSCI
7
3
16
512FS
BOTM
PEAK
BOTM
PEAK
PEAK
&
36
37
64
63
BUFFER IC123
BOTTOM
I
J
C
D
B
A
ANALOG
MUX
A
B
C
D
ABCD
ABCD
ABCD
AMP
SQSY
DQSY
4
5
6
7
8
9
35
65
11
12
SQSY
DQSY
SUBCODE
PROCESSOR
E
IV AMP
IV AMP
FOCUS
ERROR
AMP
FE
FE
VC
MNT3
MNT2
MNT1
MNT0
34
66
68
4
3
2
1
MNT3
E
F
VC
ADAGC
MNT2
MNT1
MNT0
MONITOR
CONTROL
31
29
VC
TE
SE
75
74
A/D
AT
AMP
BPF
CONVERTER
E-F
ADFM
BALANCE
SENS
SRDT
SCLK
SWDT
XLAT
ADIN
9
8
6
5
7
SENS
SRDT
SCLK
SWDT
XLAT CH
30
32
VCC
VC
SERVO
DSP
CPU
I/F
ADIP
DEMODULATOR/
DECODER
ADFG
APC
VC
ADFG
CVB
VC
3
78
MAIN
SECTION
(Page 32)
TEMPR
15
TE
SE
TRACKING
ERROR
AMP
26
28
D101
3
DRAM
IC124
TEMPI
PD
SPINDLE
SERVO
AUTO
SEQUENCER
PWM
GENERATOR
TEMP
AMP
14
10
CSLED
27
VC
XWE
XRAS
XCAS
XOE
LASER ON
SW
Q101
47
46
44
43
3
4
17
16
20
XWE
XRAS
XCAS
XOE
SWDT
SCLK
XLAT
PD
DTRF
CKRF
XLRF
SERIAL
16
17
18
82
81
80
VICONV
PARALLEL
DECODER
1
DQ1
•
2
FOCNT
FOCNT
•
20
79
18
•
DQ4
A0
19
D0
D3
A00
A09
11
12
22 23 25
6
93
13
83 88 89 86 85 92 91
94 95 10
49 • 48 • 50 • 51
34 31 • 36 40 • 45
9
•
APC
Q162,163
ILCC
11
LD
15
•
A9
5
LDON
WRPWR
MOD
HF MODULE
SW
IC103,Q102-104
HF
MODULE
TRACKING
COIL
SLED/SPINDLE MOTOR DRIVE
FOCUS/TRACKING COIL DRIVE
IC152
5
SDA
SCL
SDA
SCL
EEP ROM
IC171
6
FOCUS
COIL
TRK–
TRK+
TFDR
TRDR
10
12
14
15
LIMIT-IN
REFLECT
PROTECT
CHACK IN SW
PACK OUT SW
PLAY-P SW
REC P SW
DRIVER
DRIVER
DRIVER
DRIVER
DETECT SW
S101, S102,
S601-604
FSC+
FSC–
FRDR
FFDR
21
23
18
19
SFDR
SRDR
SLED+
SLED–
M102
M
M
27
25
29
30
SLED MOTOR
SPDL+
SPDL–
SPFD
SPRD
M101
6
8
3
4
LOAD-IN
LOAD-OUT
M103
LOADING MOTOR
SPINDLE MOTOR
M
XRST
16
DIG-RST
PSB
09
31
31
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MDS-PC2
– MAIN SECTION –
IC601
IC601
OPT IN 1
IC611
10
4
11
3
A/D,D/A CONVERTER
IC301
3
3
1
J101
OPT IN 2
IC621
L
18 DATAO
VINL1
VINR1
2
4
DIGITAL
(OPTICAL)
IN
DIN0
R-CH
R-CH
R
LINE AMP
IC381, 382
J101
LINE
R-CH
DIN1
OPT OUT
IC661
(ANALOG)
DOUT
VOUTL
VOUTR
26
24 R-CH
+
–
MUTE
Q191
L
OUT
ADDT
R
BCK
LRCK
DADT
BCK
16
17
19
WS
DATAI
L3MODE 13
L3CLK 14
IC351
IC351
3
6
5
2
12
SYSCLK
15
MUTE
DRIVE
Q390
L3DATA
X351
22.5792MHz
512FS
TXDI
8
SYSTEM CONTROL
IC501
RTSI
CLKI
RXDI
7
5
4
SCTX
XINT
80 SCTX
L3-CLOCK 28
D390
D391
XINT
SQSY
DQSY
23
5
30
47
49
L3-DATA
L3-MODE
MUTE
SQSY
DQSY
MNT3
MNT2
MNT1
MNT0
SENS
SRDT
SCLK
18
66
74
72
78
71
32
33
31
75
77
69
68
MNT3(S-LOCK)
MNT2(X-BUSY)
MNT1(SHOCK)
MNT0(F-OK)
SENS
J801
45
7
A1-OUT
A1-IN
CONTROL
A1II
RXDI
CLKI
TXDI
SRDT
SCLK
SWDT
XLATCH
SWDT
XLATCH
X513
10MHz
LIMIT-IN
REFLECT
PROTECT
LIMIT-IN
REFLECT
PROTECT
13
XIN 15
XOUT
BD SECTION
51 CHACKIN
CHACKIN SW
PACK-OUT SW
(Page 31)
PACK-OUT
PB-P
53
60
PB P SW
REC-P SW
LD ON
WRPWR
MOD
59 REC-P
IC601
70
67
76
LDON
WR PWR
MOD
INVERTER
RY911
8
9
6
5
RECTIFIER
D431,432
LOADING
MOTER
DRIVE
IC441
7
AC
IN
2
4
9
LOAD-IN
LD-IN
54
55
ANA+5V
SWITCHING REG
IC 411
LOAD OUT
10
LD OUT
LOADING 5V
H5V
POWER
TRANSFORMER
97
KEY0
MATRIX
SWITCH
LD LOW
SWITCH
Q441
D5V
56
LD-LOVO
KEY1 95
RECTIFIER
D411,412
M5V
1
+5V REG
3
FL
DRIVER
IC761
SDA
SCL
DIG-RST
SDA
65
79
73
SCL
DIG-RST
SYS+3.3V
5
4
6
+3.3V REG
D751
LED SW
Q751
P1
1
STANDBY
ANA+5V
FLDATA
35
37
34
63
DAT
62 CLK
CS
SIRCS
RECEIVER
IC781
+5V REG
BACK UP
1
RM
RMC
FLCLK
FLCS
6
GRID DRIVE
Q767
AC
RTSI
G13
S1
52
BACK+3.3V
61
56 VFL
-32V
RY912
5
I
51
FL701
–32V REG
IC421
S35
G1
19
P.DOWN
3
1
–32V
FLUORESCENT
STB 50
INDICATOR TUBE
BT451
LITHIUM
BATTERY
D421
12
2
G12
RST
ANA+5V
60
12
S.RST
• SIGNAL PATH
:PB
:REC
:PB (Digital out)
:REC (Digital in)
09
32
32
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MDS-PC2
WAVEFORMS
Note on Schematic Diagram:
Note:
– BD (1/2) SECTION –
– MAIN SECTION –
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and / W or less unless otherwise
specified.
1
1
1
4
3.2Vp-p
0.46Vp-p
¢
•
: internal component.
10MHz
• C : panel designation.
IC101 1, 2 (I, J) (PLAY mode)
IC701 !£ (XOUT)
Note:
Note:
2
Les composants identifiés par
une marque ! sont critiques
pour la sécurité.
Ne les remplacer que par une
piéce portant le numéro
spécifié.
The components identi-
fied by mark ! or dotted
line with mark ! are criti-
cal for safety.
Replace only with part
number specified.
2
3.8Vp-p
0.1Vp-p
44.1kHz
IC201 !™ (SYSCLK)
IC101 4 (A) (PLAY mode)
•
•
U : B+ Line.
V : B– Line.
3
4
3
• H : adjustment for repair.
0.06Vp-p
3.4Vp-p
no mark : STOP
(
<
) : Play the test disk (TDYS-1)
> : REC
2.822MHz
: Can not be measured.
IC101 8, 9 (E, F) (PLAY mode)
IC201 !¶ (LRCK1)
∗
• Voltages are taken with aVOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
3.0Vp-p
– BD (2/2) SECTION –
22.581MHz
• Signal path.
IC201 !§ (BCK)
E
: PB
4
: REC
p : PB (digital out)
3.1Vp-p
l : REC (digital in)
22.581MHz
Note on Printed Wiring Boards:
Note:
IC121 !§ (OSCI)
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
5
•
•
p
: parts mounted on the conductor side.
: Through hole.
3.2Vp-p
®
• b : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
44.1kHz
IC121 @¶ (LRCK)
Caution:
Pattern face side: Parts on the pattern face side seen from the
6
(Side B)
Parts face side: Parts on the parts face side seen from the
(Side A) parts face are indicated.
pattern face are indicated.
3.8Vp-p
2.822MHz
• Indication of transistor
IC121 @• (XBCK)
C
Q
7
These are omitted
B E
3.8Vp-p
11.29MHz
– PANEL SECTION –
IC121 @ª (FS256)
BC E
These are omitted
1
8
3.9Vp-p
3.2Vp-p
2.4MHz
176.4kHz
IC901 %• (OSCO)
IC121 (º (FS4)
33
33
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MDS-PC2
6-3. PRINTED WIRING BOARD – BD SECTION –
• See page 30 for Circuit Boards Location.
(Page 39)
(Page 43)
: SOLDER BRIDGE
• SEMICONDUCTOR
LOCATION
• SEMICONDUCTOR
LOCATION
Ref. No. Location
Ref. No. Location
D101
D181
D183
A-1
D-3
D-3
IC101
IC121
IC124
IC152
IC181
IC192
A-3
C-3
C-3
B-1
C-1
D-1
IC103
IC123
IC171
B-1
D-2
D-1
Q101
Q162
Q163
Q181
Q182
B-3
B-3
B-3
C-1
C-2
Q102
Q103
Q104
B-1
B-1
B-1
34
34
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MDS-PC2
6-4. SCHEMATIC DIAGRAM – BD (1/2) SECTION –
• See page 33 for Waveform.
• See page 45 for IC Block Diagrams.
• See page 48 for IC Pin Function.
(Page 36)
(Page 36)
(Page 36)
(Page 36)
(Page 36)
(Page 36)
(Page 36)
35
35
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MDS-PC2
6-5. SCHEMATIC DIAGRAM – BD (2/2) SECTION –
• See page 33 for Waveform.
• See page 34 for Printed Wiring Board.
(Page 35)
(Page 35)
(Page 35)
(Page 35)
(Page 35)
(Page 35)
(Page 35)
POWER BOARD
(Page 42)
MAIN BOARD
(1/2)
(Page 37)
BA033FP-E2
36
36
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MDS-PC2
6-6. SCHEMATIC DIAGRAM – MAIN (1/2) SECTION –
• See page 51 for IC Pin Function.
• See page 33 for Waveform.
• See page 39 for Printed Wiring Board.
(Page 38)
SW BOARD
(Page 44)
BD BOARD
(2/2)
(Page 38)
(Page 36)
(Page 38)
(Page 38)
POWER
BOARD
(Page 42)
37
37
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MDS-PC2
6-7. SCHEMATIC DIAGRAM – MAIN (2/2) SECTION –
• See page 33 for Waveform.
• See page 47 for IC Block Diagrams.
PANEL
BOARD
(Page
37)
(Page 40)
(Page
37)
(Page
37)
L
R
L
IN
LINE
(ANALOG)
OUT
R
(Page
37)
38
38
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MDS-PC2
6-8. PRINTED WIRING BOARD – MAIN SECTION –
• See page 30 for Circuit Boards Location.
L
L
IN
LINE
(ANALOG)
R
R
OUT
POWER
BOARD
BD SWITCH
BOARD
PANEL
BOARD
BD BOARD
(Page 43)
(Page 44)
(Page 34)
(Page 41)
• SEMICONDUCTOR
LOCATION
Ref. No. Location
D390
D391
A-2
A-2
IC301
IC308
IC351
IC381
IC382
IC441
IC501
A-3
A-1
A-4
A-2
A-2
A-5
B-7
Q191
Q192
Q291
Q292
Q390
Q441
A-1
A-1
A-1
A-1
A-2
B-6
39
39
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MDS-PC2
6-9. SCHEMATIC DIAGRAM – PANEL SECTION –
• See page 33 for Waveform.
MAIN
BOARD
(2/2)
(Page 38)
40
40
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MDS-PC2
6-10. PRINTED WIRING BOARD – PANEL SECTION –
• See page 30 for Circuit Boards Location.
MAIN BOARD
(Page 39)
41
41
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MDS-PC2
6-11. SCHEMATIC DIAGRAM – POWER SECTION –
MAIN
BOARD
(1/2)
(Page 37)
BD BOARD
(2/2)
RESET
(Page 36)
OUT
IN 1
IN 2
DIGITAL
(OPTICAL)
42
42
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MDS-PC2
6-12. PRINTED WIRING BOARD – POWER SECTION –
• See page 30 for Circuit Boards Location.
MAIN BOARD
(Page 39)
BD BOARD
(Page 34)
IN 2
DIGITAL
(OPTICAL)
IN 1
OUT
CONTROL
A1 II
• SEMICONDUCTOR
LOCATION
• SEMICONDUCTOR
LOCATION
Ref. No. Location
Ref. No. Location
Ref. No. Location
D411
D412
D421
D422
D451
D452
D461
D462
D911
D912
C-4
C-3
C-2
C-1
B-2
B-2
B-4
B-4
B-4
C-2
IC411
IC421
IC611
IC621
IC661
B-2
C-1
C-5
B-5
D-5
D431
D432
D433
D466
D467
D801
C-2
C-2
C-2
B-2
B-2
E-1
Q801
E-5
IC601
C-1
43
43
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MDS-PC2
6-13. SCHEMATIC DIAGRAM – BD SWITCH SECTION –
6-15. IC BLOCK DIAGRAM
• BD section
IC101 CXA2523AR
MAIN BOARD
(1/2)
48
47
46
45
44
43 42
41
40
39
38 37
USROP
–
+
RF AGC
EQ
EQ
+
–
(Page 37)
USRC
RFA1
DET
BPF3T
3T
RFA2
PEAK3T
I
1
2
–
HLPT
–1
1
2
–
–
P-P
–2
–
J
3T
WBL
CFST
PTGR
TEMP
PEAK
–
–
–
1
2
–2
–1
CVB
36
BOTTOM
WBL
BOTM
+
–
PBH
VC
A
3
4
GRV
GRVA
35
34
33
ABCD
FE
+
+
+
+
+
–
AUX
6-14. PRINTED WIRING BOARD – BD SWITCH SECTION –
• See page 30 for Circuit Boards Location.
AA
IVR
IVR
IVR
BPFC
ABCDA
32 ADFG
31 ADAGC
30 ADIN
+
–
B
C
5
6
BB
CC
+
+
–
–
MAIN BOARD
FEA
ATA
+
–
DET
BPF22
(Page 39)
–
–
+
+
ADIP
AGC
29 ADFM
28 SE
WBL
+
–
D
E
7
8
DD
EE
IVR
IVR
WBL
–1
TG
TG
PTGR
–
+
–
+
–2
+
–
SEA
TEA
+
–
EE'
27 CSLED
26 TE
–1
–2
EFB
TESW
+
–
F
9
+
–
FF
IVR
WBL
FF'
25 WBLADJ
3T
VI CONV
FBAL
EQ
GSW IV
PD 10
AUXSW
BGR
COMMAND
VREF
SCRI - PARA
DECODE
APC 11
APCREF 12
13
14
15
16 17 18
19
20
21
22 23
24
44
44
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IC121 CXD2654R
100 99 98 97 96 95 94 93
92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76
PWM
GENERATOR
SPINDLE
SERVO
75
74
73
TE
MNT0
MNT1
MNT2
MNT3
1
2
3
4
SE
MONITOR
CONTROL
EACH
AVSS
BLOCK
72
71
70
69
ADRB
ADRT
AVDD
ADIO
ADIP
DEMODULATOR/
DECODER
SWDT
SCLK
XLAT
SRDT
SENS
5
6
7
8
9
EACH
BLOCK
CPU I/F
68
67
66
65
64
63
VC
SERVO
DSP
A/D
CONVERTER
AUX1
FE
ANALOG
MUX
ABCD
BOTM
PEAK
XRST 10
APC
SQSY 11
DQSY 12
SUBCODE
PROCESSOR
62
61
60
59
CLTV
FILO
FILI
RECP 13
PCO
SHOCK RESISTANT
MEMORY CONTROLLER
XINT 14
TX 15
58
AVSS
OSCI 16
OSCO 17
XTSL 18
DIN0 19
DIN1 20
CLOCK
GENERATOR
EACH
BLOCK
57
56
55
54
53
RFI
COMP
DIGITAL
AUDIO
I/F
SAMPLING
RATE
CONVERTER
BIAS
AVDD
ASYI
ASYO
DOUT 21
DATAI 22
LRCKI 23
XBCKI 24
ADDT 25
ATRAC
ENCODER/DECODER
DRAM
52
51
MVCI
D3
ADDRESS/DATA BUS A00 - A11, D0 - D3
26 27 28 29 30
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
IC152 BH6511FS-E2
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
AMP
AMP
AMP
AMP
VDD
INTERFACE
INTERFACE
CHARGE
PUMP.
OSC
PREDRIVE
PREDRIVE
PREDRIVE
PREDRIVE
AMP
AMP
8
AMP
10
AMP
INTERFACE
INTERFACE
PSB
16
1
2
3
4
5
6
7
9
11
12
13
14
15
45
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• MAIN section
IC301 UDA1341TS/N2
3
1
7
5
VINL2
VINL1
6
2
PGA
PGA
8
4
VINR2
VINR1
0DB/6DB
SWITCH
0DB/6DB
SWITCH
ADC2R
ADC2L
ADC1L
ADC1R
AGCSTAT
22
10
11
VDDD
VSSD
DIGITAL AGC
DIGITAL MIXER
9
DECIMATION FILTER
OVERFLOW
L3CLOCK
18
16
17
19
DATAO
BCK
14
DIGITAL
L3-BUS
13 L3MODE
WS
INTERFACE
INTERFACE
L3DATA
15
DATAI
DSP FEATURES
SYSCLK
12
PRAK
23
28
INTERPOLATION FILTER
NOISE SHAPER
QMUTE
VREF
DETECTOR
20
21
TEST1
TEST2
VOUTL 26
24
VOUTR
25
27
IC441 LB1830M
IN2
10
IN1 VM
VREF
7
VCONT
6
9
8
VREF
LOGIC
PREDRIVER
2
3
4
5
1
VCC
OUT2
GND OUT1 VS
46
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6-16. IC PIN FUNCTIONS
• IC101 RF Amplifier (CXA2523AR) (BD board)
Pin No.
1
Pin Name
I/O
I
Function
I
I-V converted RF signal I input
I-V converted RF signal J input
I
2
J
O
I
3
VC
A to F
PD
APC
Middle point voltage (+1.5V) generation output
Signal input from the optical pick-up detector
Light amount monitor input
4 to 9
10
I
O
I
11
Laser APC output
12
APCREF
GND
Reference voltage input for setting laser power
Ground
—
I
13
14
TEMPI
TEMPR
SWDT
SCLK
Temperature sensor connection
O
I
15
Reference voltage output for the temperature sensor
Serial data input from the CXD2650R or CXD2652AR
Serial clock input from the CXD2650R or CXD2652AR
Latch signal input from the CXD2650R or CXD2652AR “L”: Latch
Stand by signal input “L”: Stand by
16
I
17
I
18
XLAT
I
19
XSTBY
Center frequency control voltage input of BPF22, BPF3T, EQ from the CXD2650R or
CXD2652AR
I
20
F0CNT
O
I/O
I/O
—
I/O
O
21
22
23
24
25
26
27
28
29
30
31
32
VREF
EQADJ
3TADJ
Vcc
Reference voltage output (Not used)
Center frequency setting pin for the internal circuit EQ
Center frequency setting pin for the internal circuit BPF3T
+3V power supply
WBLADJ
TE
Center frequency setting pin for the internal circuit BPF22
Tracking error signal output to the CXD2650R or CXD2652AR
External capacitor connection pin for the sled error signal LPF
Sled error signal output to the CXD2650R or CXD2652AR
FM signal output of ADIP
—
O
CSLED
SE
O
ADFM
ADIN
ADAGC
ADFG
I
ADIP signal comparator input ADFM is connected with AC coupling
External capacitor connection pin for AGC of ADIP
ADIP duplex signal output to the CXD2650R or CXD2652AR
I3 signal/temperature signal output to the CXD2650R or CXD2652AR
(Switching with a serial command)
—
O
O
33
AUX
O
O
O
O
O
—
I
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
FE
Focus error signal output to the CXD2650R or CXD2652AR
Light amount signal output to the CXD2650R or CXD2652AR
RF/ABCD bottom hold signal output to the CXD2650R or CXD2652AR
RF/ABCD peak hold signal output to the CXD2650R or CXD2652AR
RF equalizer output to the CXD2650R or CXD2652AR
External capacitor connection pin for the RF AGC circuit
Input to the RF AGC circuit The RF amplifier output is input with AC coupling
User comparator output (Not used)
ABCD
BOTM
PEAK
RF
RFAGC
AGCI
COMPO
COMPP
ADDC
OPO
O
I
User comparator input (Fixed at “L”)
I/O
O
I
External capacitor pin for cutting the low band of the ADIP amplifier
User operation amplifier output (Not used)
OPN
User operation amplifier inversion input (Fixed at “L”)
RF amplifier output
O
I
RFO
MORFI
MORFO
Groove RF signal is input with AC coupling
O
Groove RF signal output
• Abbreviation
APC: Auto Power Control
AGC: Auto Gain Control
47
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• IC121 Digital Signal Processor, Digital Servo Signal Processor, EFM/ACIRC Encoder/Decoder,
Shock-proof Memory Controller, ATRAC Encoder/Decoder, 2M Bit DRAM (CXD2654R) (BD board)
Pin No.
Pin Name
I/O
Function
FOK signal output to the system control (monitor output)
“H” is output when focus is on
MNT0 (FOK)
1
O
MNT1 (SHCK)
MNT2 (XBUSY)
MNT3 (SLOC)
SWDT
Track jump detection signal output to the system control (monitor output)
Monitor 2 output to the system control (monitor output)
Monitor 3 output to the system control (monitor output)
Writing data signal input from the system control
Serial clock signal input from the system control
Serial latch signal input from the system control
Reading data signal output to the system control
Internal status (SENSE) output to the system control
Reset signal input from the system control “L”: Reset
Subcode Q sync (SCOR) output to the system control
“L” is output every 13.3 msec. Almost all, “H” is output
Digital In U-bit CD format or MD format subcode Q sync (SCOR) output to the system
control
2
3
O
O
4
O
5
I
SCLK
6
I (S)
I (S)
O (3)
O (3)
I (S)
XLAT
7
SRDT
8
SENS
9
XRST
10
SQSY
DQSY
11
12
O
O
RECP
XINT
TX
Laser power switching input from the system control “H”: Recording, “L”: Playback
Interrupt status output to the system control
Recording data output enable input from the system control
System clock input (512Fs=22.5792 MHz)
System clock output (512Fs=22.5792 MHz) (Not used)
System clock frequency setting “L”: 45.1584 MHz, “H”: 22.5792 MHz (Fixed at “H”)
Digital audio input (Optical input)
13
14
I
O
I
15
OSCI
16
I
OSCO
XTSL
DIN0
17
O
I
18
19
I
DIN1
Digital audio input (Optical input)
20
I
DOUT
DADTI
LRCKI
XBCKI
ADDT
DADT
LRCK
XBCK
FS256
DVDD
A03 to A00
A10
Digital audio output (Optical output)
21
O
I
Serial data input
22
LR clock input “H” : Lch, “L” : R ch
23
I
Serial data clock input
24
I
Data input from the A/D converter
25
I
Data output to the D/A converter
26
O
O
O
O
—
O
O
O
O
—
O
O
O
O
O
LR clock output for the A/D and D/A converter (44.1 kHz)
Bit clock output to the A/D and D/A converter (2.8224 MHz)
11.2896 MHz clock output (Not used)
27
28
29
+3V power supply (Digital)
30
DRAM address output
31 to 34
35
DRAM address output (Not used)
A04 to A08
A11
DRAM address output
36 to 40
41
DRAM address output (Not used)
DVSS
XOE
Ground (Digital)
42
Output enable output for DRAM
43
XCAS
A09
CAS signal output for DRAM
44
Address output for DRAM
45
XRAS
XWE
RAS signal output for DRAM
46
Write enable signal output for DRAM (Used : CXD2652AR, Not used : CXD2650R)
47
* I (S) stands for Schmidt input, I (A) for analog input, O (3) for 3-state output, and O (A) for analog output in the column I/O
48
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Pin No.
48
49
50, 51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
Pin Name
I/O
I/O
I/O
I/O
I (S)
O
Function
D1
D0
Data input/output for DRAM
D2, D3
MVCI
ASYO
ASYI
AVDD
BIAS
RFI
Clock input from an external VCO (Fixed at “L”)
Playback EFM duplex signal output
I (A) Playback EFM comparator slice level input
+3V power supply (Analog)
—
Playback EFM comparator bias current input
I (A)
I (A) Playback EFM RF signal input
AVSS
PCO
Ground (Analog)
—
Phase comparison output for the recording/playback EFM master PLL
O (3)
FILI
I (A) Filter input for the recording/playback EFM master PLL
FILO
CLTV
PEAK
BOTM
ABCD
FE
Filter output for the recording/playback EFM master PLL
O (A)
I (A)
Internal VCO control voltage input for the recording/playback EFM master PLL
I (A) Light amount signal peak hold input from the CXA2523R
Light amount signal bottom hold input from the CXA2523R
Light amount signal input from the CXA2523R
I (A)
I (A)
I (A) Focus error signal input from the CXA2523R
AUX1
VC
Auxiliary A/D input
I (A)
I (A)
Middle point voltage (+1.5V) input from the CXA2523R
ADIO
AVDD
ADRT
ADRB
AVSS
SE
O (A) Monitor output of the A/D converter input signal (Not used)
+3V power supply (Analog)
—
A/D converter operational range upper limit voltage input (Fixed at “H”)
I (A)
I (A) A/D converter operational range lower limit voltage input (Fixed at “L”)
Ground (Analog)
—
Sled error signal input from the CXA2523R
I (A)
TE
I (A) Tracking error signal input from the CXA2523R
DCHG
APC
Connected to +3V power supply
I (A)
I (A)
Error signal input for the laser digital APC (Fixed at “L”)
ADFG
F0CNT
XLRF
CKRF
DTRF
APCREF
TEST0
TRDR
I (S) ADIP duplex FM signal input from the CXA2523R (22.05 ± 1 kHz)
Filter f0 control output to the CXA2523R
Control latch output to the CXA2523R
Control clock output to the CXA2523R
Control data output to the CXA2523R
Reference PWM output for the laser APC
PWM output for the laser digital APC (Not used)
Tracking servo drive PWM output (–)
O
O
O
O
O
O
O
• Abbreviation
EFM: Eight to Fourteen Modulation
PLL : Phase Locked Loop
VCO: Voltage Controlled Oscillator
49
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Pin No.
86
Pin Name
I/O
O
Function
Tracking servo drive PWM output (+)
+3V power supply (Digital)
TFDR
DVDD
FFDR
FRDR
FS4
87
—
O
Focus servo drive PWM output (+)
Focus servo drive PWM output (–)
88
89
O
176.4 kHz clock signal output (X’tal) (Not used)
Sled servo drive PWM output (–)
90
O
91
O
SRDR
SFDR
SPRD
SPFD
FGIN
Sled servo drive PWM output (+)
92
O
Spindle servo drive PWM output (–)
Spindle servo drive PWM output (+)
93
O
94
O
95
I (S)
I
Test input (Fixed at “L”)
96 to 98
99
TEST1 to TEST3
DVSS
Ground (Digital)
—
O
EFM output when recording
100
EFMO
• Abbreviation
EFM: Eight to Fourteen Modulation
50
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• IC501 System Control (M30620MC-406FP) (MAIN board)
Pin No.
1, 2
3
Pin Name
I/O
O
O
O
I
Function
Not used (Fixed at “L”)
NC
C1 error rate voltage output (Fixed at “L”) (Not used)
AD error rate voltage output (Fixed at “L”) (Not used)
ADIP sync or subcode Q sync input from CXD2654R
Remote controls
C1ER
ADER
SQSY
RMC
A1 IN
BYTE
4
5
I
6
I
A1 Control input (Fixed at “L”)
Data bus changed input (Fixed at “L”)
Ground
7
I
8
—
O
O
I
9
CNVSS
XIN-T
Not used (Fixed at “L”)
10
Not used (Fixed at “L”)
11
XOUT-T
S.RST
System rest input
12
O
—
I
Main clock output (7.0MHz)
Ground
13
XOUT
14
GND
Main clock input (7.0MHz)
15
XIN
—
I
+3.3V power supply
16
+3.3V
(Fixed at “H”)
17
NMI
I
Digital in sync input
18
DQSY
I
Power down detection input “L”: Power down
Not used
19
P.DOWN
KEYBOARD CLK
KEYBOARD DATA
BEEP OUT
XINIT
O
O
—
I
20
Not used
21
Not used
22
Interrupt status input from CXD2654R
Not used
23
O
O
O
O
O
I
24 to 27
28
NC
Serial clock signal output to IC301
Not used
L3 CLOCK
NC
29
Serial data signal input to IC301
Writing data signal output to the serial bus
Reading data signal input from the serial bus
Clock signal output to the serial bus
Chip select signal output to the display driver
Serial data signal output to the display driver
Not used (Fixed at “L”)
30
LC DATA
SWDT
SRDT
31
32
O
O
O
O
O
O
I
33
SCLK
34
FLCS
35
FLDATA
NC
36
Serial clock signal output to the display driver
Not used
37
FLCLK
NC
38 to 41
42, 43
44
Not used
JOG1, JOG0
NC
O
O
O
O
O
O
O
I
Not used
A1 output
45
A1 OUT
NC
Not used
46
Serial mode signal output to IC301
Not used Reset: “L”
47
L3 MODE
DA.RST
MUTE
STB
48
DA line out muting output Mute: “L”
Strobe signal output to the power supply circuit Power supply ON: “H”, stand by: “L”
Detection input from the chucking-in switch “L”: Chucking
Not used (Fixed at “L”)
49
50
51
CHACK IN
NC
I
52
I
Detection input from the loading out switch. Loaded out position: “L”, Others: “H”
Loading motor control input
Loading motor control output
Loading motor voltage control output Low voltage: “H”
Not used (Fixed at “L”)
53
PACK-OUT
LDIN
I
54
O
O
O
I
55
LDOUT
LD-LOW
NC
56
57, 58
59
Detection signal input from the recording position detection switch
REC-P
51
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Pin No.
60
Pin Name
I/O
I
Function
Detection signal input from the playback position detection switch
Not used Write: “H”
PB-P
61
REC/PB
+3.3V
O
62
+3.3V power supply
—
O
63
Not used (Fixed at “L”)
NC
64
Ground
GND
—
I/O
I
65
Data signal input/output pin with the backup memory
In the state of spindle servo lock from the CXD2564R
Write power ON/OFF output
SDA
66
MNT3 (SLOCK)
WR PWR
67
O
Recording-protection claw detection input from the protection detection switch
Protect: “H”
68
69
PROTECT
REFLECT
I
I
Disk reflection rate detection input from the reflect detection switch
Disk with low reflection rate: “H”
70
71
72
73
74
75
76
Laser ON/OFF control output “H”: Laser ON
Internal status (SENSE) input from the CXD2654R
Track jump signal input from the CXD2654R
Digital rest signal output to the CXD2654R and motor driver Reset: “L”
In the state of executive command from the CXD2654R
Latch signal output to the serial bus
LDON
O
I
SENS
NMT1 (SHOCK)
DIG-RST
MNT2 (XBUSY)
XLATCH
MOD
I
O
I
O
O
Laser modulation switching signal output
Detection input from the limit switch
77
LIMIT-IN
I
Sled limit-In: “L”
Focus OK signal input from the CXD26504R
“H” is input when focus is on
78
79
80
MNT0 (FOK)
SCL
I
Clock signal output to the backup memory
Writing data transmission timing output to the CXD2654R
Shared with the magnetic head ON/OFF output
Clock destination select pin US, Canadian: “L”, Except US, Canadian :“H”
Clock destination select pin US, Canadian: “H”, Except US, Canadian :“L”
O
O
SCTX
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
CLKSET0
CLKSET1
LED0
I
I
O
O
O
O
I
LED1
OPT DEL
OPT SEL
MODE SEL 0
MODE SEL 1
REC
Not used
O
O
O
I
Beep switch
Not used
BEEP SW
NC
NC
I
KEY 3
I
KEY 2
I
Key input pin (A/D input)
KEY 1
I
Ground (Analog)
AVSS
—
I
Key input pin (A/D input)
KEY0
A/D reference voltage (Fixed at “H”)
+3.3V power supply
VREF
—
—
I
+3.3V
Monaural, stereo change input Monaural: “L”
MONO/ST
52
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SECTION 7
EXPLODED VIEWS
NOTE:
The components identified by
mark ! or dotted line with mark
! are critical for safety.
Replace only with part number
specified.
• Abbreviation
CND : Canadian model
• Items marked “*” are not stocked since they are
seldom required for routine service. Some delay
should be anticipated when ordering these items.
• The mechanical parts with no reference number in
the exploded views are not supplied.
SP
: Singapore model
Les composants identifiés par une
marque ! sont critiques pour la
sécurité.
• Hardware (# mark) list and accessories and pack-
ing materials are given in the last of this parts list.
Ne les remplacer que par une
piéce portant le numéro spécifié.
7-1. CABINET SECTION
11
not supplied
#1
25
18
10
not supplied
24
not supplied
11
11
MDM-5A
#1
12
#7
12
21 (AEP,SP)
13 (SP)
5
7
11
not supplied
21 (UK)
21 (US,CND)
8
9
26
19
#1
5
20
5
#1
#1
#1
#1
#1
3
26
T901
4
23
FL701
not supplied
22
7
5
22
17
23
2
2
7
16
7
7
15
1
14
not supplied
7
#1
13
6
7
Ref. No.
Part No.
Description
Remark
Ref. No.
Part No.
Description
Remark
1
2
3
4
5
X-4951-678-1 PANEL ASSY, FRONT
4-220-561-01 FOOT
4-216-729-31 LID(CARTRIDGE)
4-976-593-01 SPRING (LID), TORSION
3-348-383-01 SCREW(M2X6.0), +B TAPPING
16
17
18
1-791-160-11 WIRE(FLAT TYPE) (23 CORE)(180mm)
1-791-158-11 WIRE(FLAT TYPE) (23 CORE)(90mm)
1-791-159-11 WIRE(FLAT TYPE) (21 CORE)
19
20
!21
!21
!21
4-220-570-11 PANEL, BACK
3-703-244-00 BUSHING (2104), CORD
1-696-586-21 CORD, POWER (UK)
1-751-275-11 CORD, POWER (AEP,SP)
1-783-531-31 CORD, POWER (US,CND)
6
7
8
8
9
X-4951-680-1 CHASSIS ASSY
3-703-599-01 SCREW, +BTT (M3) S TITE
A-4724-778-A PANEL BOARD, COMPLETE (US,CND)
A-4724-786-A PANEL BOARD, COMPLETE (AEP,UK,SP)
4-220-557-01 HOLDER (FL)
22
23
24
24
25
3-703-249-01 SCREW, S TIGHT, +PTTWH 3X6
4-965-822-01 FOOT
A-4724-780-A POWER BOARD, COMPLETE (US,CND)
A-4724-784-A POWER BOARD, COMPLETE (AEP,UK,SP)
1-674-897-11 BACK UP BOARD
10
11
12
13
14
4-220-569-01 CASE
4-976-827-21 SCREW, FLAT HEAD
4-999-839-01 SCREW (+BVTTWH M3), STEP
1-569-008-21 ADAPTOR, CONVERSION 2P (SP)
A-4724-776-A MAIN BOARD, COMPLETE (US,CND)
* 26
4-949-935-51 CUSHION (FL)
FL701 1-517-907-11 INDICATOR TUBE, FLUORESCENT
14
15
A-4724-782-A MAIN BOARD, COMPLETE (AEP,UK,SP)
1-791-161-11 WIRE(FLAT TYPE) (15 CORE)
!T901
!T901
1-433-910-11 TRANSFORMER, POWER (US,CND)
1-433-911-11 TRANSFORMER, POWER (AEP,UK,SP)
53
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7-2. MECHANISM SECTION (MDM-5A)
524
513
511
512
513
510
517
518
514
515
507
not supplied
519
521
509
520
522
508
#2
516
523
507
503
503
525
526
502
#2
506
501
504
M103
505
#3
MBU-5A
#2
Ref. No.
Part No.
Description
Remark
Ref. No.
515
Part No.
Description
Remark
* 501
* 502
503
* 504
505
1-668-111-11 SW BOARD
4-996-217-01 CHASSIS
4-996-223-01 INSULATOR (F)
4-996-218-01 BRACKET (GUIDE R)
4-996-277-01 SPRING (O/C), TENSION
4-996-227-01 LEVER (HEAD)
516
517
518
519
520
4-996-229-01 SPRING (HEAD LEVER), TORSION
4-996-212-01 LEVER (LIMITTER)
4-996-213-01 SPRING (LIMITTER), TORSION
4-996-214-01 SPRING (SLIDER), TENSION
4-996-216-01 SPRING (HOLDER), TENSION
506
507
* 508
509
4-996-226-01 LEVER (O/C)
4-999-347-01 INSULATOR (R)
4-996-225-01 BRACKET (GUIDE L)
521
522
4-210-396-01 SPRING (LOCK), TENSION
X-4951-631-1 SLIDER ASSY
4-988-466-21 SPRING (ELECTROSTATIC), LEAF
510
4-996-219-01 GEAR (CAM GEAR)
* 523
* 524
525
X-4949-245-7 HOLDER ASSY
4-996-211-01 SLIDER (CAM)
4-998-763-01 SPRING (SHUTTER), LEAF
511
512
513
514
4-996-220-01 GEAR (A)
4-996-221-01 GEAR (B)
4-933-134-01 SCREW (+PTPWH M2.6X6)
4-996-224-01 SCREW (1.7X3), +PWH
526
M103
A-4680-417-A HOLDER COMPLETE ASSY
X-4949-264-1 MOTOR ASSY, LOADING
54
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7-3. BASE UNIT SECTION (MBU-5A)
565
552
HR901
564
566
571
#5
567
563
#4
568
572
570
#4
569
not supplied
562
561
#4
555
#4
not supplied
M101
556
559
#6
560
#5
S102
558
#4
554
557
#4
552
553
M102
551
552
The components identified by mark !
or dotted line with mark ! are critical
for safety.
Les composants identifiés par une
marque !sont critiques pour la sécurité.
Ne les remplacer que par une piéce
portant le numéro spécifié.
Replace only with part number specified.
Ref. No.
Part No.
Description
Remark
Ref. No.
565
Part No.
Description
Remark
* 551
552
* 553
* 554
555
A-4699-893-A BD BOARD, COMPLETE
3-372-761-01 SCREW (M1.7), TAPPING
4-996-267-01 BASE (BU-D)
4-996-255-01 BASE (BU-C)
4-900-590-01 SCREW, PRECISION SMALL
4-996-261-01 GEAR (SL-B)
566
567
568
569
570
4-996-264-01 SPRING (SHAFT), LEAF
4-996-265-01 SHAFT, MAIN
4-996-256-01 SL(BASE)
4-996-257-01 RACK (SL)
4-996-263-01 SPRING (CLV), TORSION
556
557
4-996-258-01 SPRING, COMPRESSION
4-996-262-01 GEAR (SL-C)
558
* 559
1-667-954-11 FLEXIBLE BOARD
4-210-664-01 BASE (BU-A)
571
572
4-988-560-01 SCREW (+P 1.7X6)
4-211-036-01 SCREW (1.7X2.5), +PWH
!560
A-4672-541-A OPTICAL PICK-UP KMS-260B/J1N
HR901 1-500-502-11 HEAD, OVER LIGHT
M101
M102
A-4672-475-A MOTOR ASSY, SPINDLE
A-4672-474-A MOTOR ASSY, SLED
* 561
* 562
563
4-996-252-01 CHASSIS, BU
4-996-254-01 BASE (BU-B)
4-967-688-11 MAGNET, ABSORPTION
4-996-260-01 GEAR (SL-A)
S102
1-762-148-21 SWITCH, PUSH (2 KEY)
564
55
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SECTION 8
ELECTRICAL PARTS LIST
BD
BACK UP
Note:
• SEMICONDUCTORS
In each case, u: µ , for example:
uA...: µ A..., uPA...: µ PA..., uPB...: µ PB...,
uPC...: µ PC..., uPD...: µ PD...
• CAPACITORS
uF : µ F
• COILS
uH : µ H
• Abbreviation
• Due to standardization, replacements in the parts list
may be different from the parts specified in the
diagrams or the components used on the set.
• -XX, -X mean standardized parts, so they may have
some difference from the original one.
• Items marked “*” are not stocked since they are
seldom required for routine service. Some delay
should be anticipated when ordering these items.
• RESISTORS
The components identified by
mark ! or dotted line with mark
! are critical for safety.
Replace only with part number
specified.
Les composants identifiés par une
marque ! sont critiques pour la
sécurité.
Ne les remplacer que par une
piéce portant le numéro spécifié.
CND : Canadian model
All resistors are in ohms
METAL: Metal-film resistor
SP
: Singapore model
METAL OXIDE: Metal Oxide-film resistor
F : nonflammable
When indicating parts by reference
number, please include the board
name.
Ref. No.
Part No.
Description
Remark
Ref. No.
Part No.
Description
Remark
1-674-897-11 BACK UP BOARD
C142
C143
C144
C146
1-163-251-11 CERAMIC CHIP 100PF
1-163-251-11 CERAMIC CHIP 100PF
1-163-251-11 CERAMIC CHIP 100PF
1-163-038-91 CERAMIC CHIP 0.1uF
5%
5%
5%
50V
50V
50V
25V
************
< BATTERY >
BT451 1-528-887-11 BATTERY, LITHIUM SECONDARY
< CONNECTOR >
C151
C152
C153
C156
C158
1-126-206-11 ELECT CHIP
100uF
20%
10%
6.3V
25V
50V
25V
50V
1-163-038-91 CERAMIC CHIP 0.1uF
1-163-021-91 CERAMIC CHIP 0.01uF
1-163-038-91 CERAMIC CHIP 0.1uF
* CN452 1-569-499-11 PIN, CONNECTOR 3P
1-163-019-00 CERAMIC CHIP 0.0068uF 10%
**************************************************************
C160
C161
C163
C164
C167
1-104-601-11 ELECT CHIP
1-104-601-11 ELECT CHIP
1-163-021-91 CERAMIC CHIP 0.01uF
1-163-021-91 CERAMIC CHIP 0.01uF
1-163-038-91 CERAMIC CHIP 0.1uF
10uF
10uF
20%
20%
10%
10%
10V
10V
50V
50V
25V
*
A-4699-893-A BD BOARD, COMPLETE
*****************
< CAPACITOR >
C168
C169
C171
C181
C183
1-163-038-91 CERAMIC CHIP 0.1uF
25V
10V
25V
16V
25V
C101
C102
C103
C104
C105
1-125-822-11 TANTALUM
1-163-038-91 CERAMIC CHIP 0.1uF
1-125-822-11 TANTALUM
1-125-822-11 TANTALUM
1-163-021-91 CERAMIC CHIP 0.01uF
10uF
20%
10V
25V
10V
10V
50V
1-125-822-11 TANTALUM
1-163-038-91 CERAMIC CHIP 0.1uF
1-104-913-11 TANTAL. CHIP 10uF
1-163-038-91 CERAMIC CHIP 0.1uF
10uF
20%
20%
10uF
10uF
20%
20%
10%
C184
C185
C187
C188
C189
1-117-970-11 ELECT CHIP
1-164-611-11 CERAMIC CHIP 0.001uF 10%
1-104-913-11 TANTAL. CHIP
1-163-021-91 CERAMIC CHIP 0.01uF
22uF
20%
10V
500V
16V
50V
25V
C106
C107
C108
C109
C111
1-163-275-11 CERAMIC CHIP 0.001uF 5%
1-163-038-91 CERAMIC CHIP 0.1uF
1-163-038-91 CERAMIC CHIP 0.1uF
1-163-037-11 CERAMIC CHIP 0.022uF 10%
1-164-344-11 CERAMIC CHIP 0.068uF 10%
50V
25V
25V
25V
25V
10uF
20%
10%
1-163-989-11 CERAMIC CHIP 0.033uF 10%
C190
C191
C196
C197
1-126-206-11 ELECT CHIP 100uF 20%
6.3V
25V
25V
25V
C112
C113
C115
C116
C117
1-163-017-00 CERAMIC CHIP 0.0047uF 5%
50V
10V
16V
25V
25V
1-163-038-91 CERAMIC CHIP 0.1uF
1-163-038-91 CERAMIC CHIP 0.1uF
1-163-038-91 CERAMIC CHIP 0.1uF
1-109-982-11 CERAMIC CHIP 1uF
1-164-489-11 CERAMIC CHIP 0.22uF
10%
10%
1-163-037-11 CERAMIC CHIP 0.022uF 10%
1-163-809-11 CERAMIC CHIP 0.047uF 10%
< CONNECTOR >
C118
C119
C121
C122
C123
1-163-038-91 CERAMIC CHIP 0.1uF
25V
10V
10V
50V
25V
CN101 1-569-479-21 CONNECTOR, FPC 21P
1-125-822-11 TANTALUM
1-125-822-11 TANTALUM
10uF
10uF
20%
20%
10%
CN102 1-784-833-21 CONNECTOR,FFC(LIF(NON-ZIF))21P
CN103 1-784-834-21 CONNECTOR,FFC(LIF(NON-ZIF))23P
CN104 1-770-687-11 CONNECTOR, FFC/FPC 4P
1-163-021-91 CERAMIC CHIP 0.01uF
1-163-038-91 CERAMIC CHIP 0.1uF
CN110 1-695-440-21 PIN, CONNECTOR (PC BOARD) 6P
C124
C127
C128
C129
C130
1-163-038-91 CERAMIC CHIP 0.1uF
1-163-038-91 CERAMIC CHIP 0.1uF
1-163-021-91 CERAMIC CHIP 0.01uF
1-107-823-11 CERAMIC CHIP 0.47uF
1-163-251-11 CERAMIC CHIP 100PF
25V
25V
50V
16V
50V
< DIODE >
10%
10%
5%
D101
D181
D183
8-719-988-61 DIODE 1SS355TE-17
8-719-046-86 DIODE F1J6TP
8-719-046-86 DIODE F1J6TP
C131
C132
C133
C134
C135
1-163-023-00 CERAMIC CHIP 0.015uF 5%
50V
16V
50V
25V
25V
< IC >
1-107-823-11 CERAMIC CHIP 0.47uF
1-163-017-00 CERAMIC CHIP 0.0047uF 5%
1-163-038-91 CERAMIC CHIP 0.1uF
1-163-038-91 CERAMIC CHIP 0.1uF
10%
IC101
IC103
IC121
IC123
IC124
8-752-080-95 IC CXA2523AR
8-729-903-10 TRANSISTOR FMW1-T-148
8-752-389-44 IC CXD2654R
8-759-096-87 IC TC7WU04FU(TE12R)
8-759-498-44 IC MSM51V4400-70TS-K
C136
1-126-206-11 ELECT CHIP
100uF
20%
6.3V
56
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BD MAIN
Ref. No.
Part No.
Description
Remark
Ref. No.
Part No.
Description
Remark
IC152
IC171
IC181
IC192
8-759-430-25 IC BH6511FS-E2
8-759-487-04 IC BR24C02F-E2
8-759-481-17 IC MC74ACT08DTR2
8-759-460-72 IC BA033FP-E2
R136
R137
R140
R142
R143
1-216-049-91 RES,CHIP
1-216-295-91 SHORT
1-216-029-00 METAL CHIP
1-216-073-00 METAL CHIP
1-216-073-00 METAL CHIP
1K
0
150
10K
10K
5%
1/10W
5%
5%
5%
1/10W
1/10W
1/10W
< COIL >
R144
R145
R146
R147
R148
1-216-025-91 RES,CHIP
1-216-073-00 METAL CHIP
1-216-037-00 METAL CHIP
1-216-025-91 RES,CHIP
1-216-045-00 METAL CHIP
100
10K
330
100
680
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
L101
L102
L103
L105
L106
1-414-813-11 FERRITE
1-414-813-11 FERRITE
1-414-813-11 FERRITE
1-414-813-11 FERRITE
1-414-813-11 FERRITE
0uH
0uH
0uH
0uH
0uH
R149
R150
R151
R152
R158
1-216-073-00 METAL CHIP
1-216-295-91 SHORT
1-216-073-00 METAL CHIP
1-216-073-00 METAL CHIP
1-216-097-91 RES,CHIP
10K
0
10K
10K
100K
5%
1/10W
L121
L122
L151
L152
L153
1-414-813-11 FERRITE
1-414-813-11 FERRITE
1-412-029-11 INDUCTOR CHIP 10uH
1-412-029-11 INDUCTOR CHIP 10uH
1-412-032-11 INDUCTOR CHIP 100uH
0uH
0uH
5%
5%
5%
1/10W
1/10W
1/10W
R159
R160
R161
R162
R163
1-216-097-91 RES,CHIP
1-216-295-91 SHORT
1-216-057-00 METAL CHIP
1-216-057-00 METAL CHIP
1-216-057-00 METAL CHIP
100K
0
2.2K
2.2K
2.2K
5%
1/10W
L154
L161
L162
L181
1-412-032-11 INDUCTOR CHIP 100uH
1-414-813-11 FERRITE
1-414-813-11 FERRITE
1-216-295-91 SHORT
0uH
0uH
0
5%
5%
5%
1/10W
1/10W
1/10W
< TRANSISTOR >
R164
R165
R167
R169
R170
1-216-045-00 METAL CHIP
1-216-097-91 RES,CHIP
1-216-065-91 RES,CHIP
1-219-724-11 METAL CHIP
1-216-073-00 METAL CHIP
680
100K
4.7K
1
5%
5%
5%
1%
5%
1/10W
1/10W
1/10W
1/4W
Q101
Q102
Q103
Q104
Q162
8-729-403-35 TRANSISTOR
8-729-026-53 TRANSISTOR
8-729-402-93 TRANSISTOR
8-729-402-93 TRANSISTOR
8-729-101-07 TRANSISTOR
UN5113
2SA1576A-T106-QR
UN5214
UN5214
10K
1/10W
2SB798-DL
R171
R173
R175
R177
R179
1-216-073-00 METAL CHIP
1-216-121-91 RES,CHIP
1-216-065-91 RES,CHIP
1-216-061-00 METAL CHIP
1-216-085-00 METAL CHIP
10K
1M
4.7K
3.3K
33K
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
Q163
Q181
Q182
8-729-403-35 TRANSISTOR
8-729-018-75 TRANSISTOR
8-729-017-65 TRANSISTOR
UN5113
2SJ278MYTR
2SK1764KYTR
< RESISTOR >
R180
R182
R183
R184
R185
1-216-073-00 METAL CHIP
1-216-089-91 RES,CHIP
1-216-089-91 RES,CHIP
1-216-073-00 METAL CHIP
1-216-081-00 METAL CHIP
10K
47K
47K
10K
22K
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
R103
R104
R105
R106
R107
1-216-049-91 RES,CHIP
1-216-073-00 METAL CHIP
1-216-065-91 RES,CHIP
1-216-133-00 METAL CHIP
1-216-113-00 METAL CHIP
1K
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
10K
4.7K
3.3M
470K
R186
R188
R189
R190
R195
1-216-089-91 RES,CHIP
1-216-073-00 METAL CHIP
1-216-073-00 METAL CHIP
1-216-073-00 METAL CHIP
1-216-073-00 METAL CHIP
47K
10K
10K
10K
10K
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
R109
R110
R111
R112
R113
1-216-295-91 SHORT
1-216-073-00 METAL CHIP
1-216-295-91 SHORT
1-216-089-91 RES,CHIP
1-216-049-91 RES,CHIP
0
10K
0
47K
1K
5%
1/10W
5%
5%
1/10W
1/10W
R196
R197
R198
R198
1-216-295-91 SHORT
1-216-295-91 SHORT
1-216-286-00 RES,CHIP
1-216-296-91 SHORT
0
0
R115
R117
R120
R121
R123
1-216-049-91 RES,CHIP
1-216-113-00 METAL CHIP
1-216-025-91 RES,CHIP
1-216-097-91 RES,CHIP
1-216-295-91 SHORT
1K
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
4.7M
0
5%
1/8W
470K
100
100K
0
< SWITCH >
S101
1-762-596-21 SWITCH, PUSH (1 KEY)(LIMIT SW)
R124
R125
R127
R129
R130
1-216-025-91 RES,CHIP
1-216-025-91 RES,CHIP
1-216-025-91 RES,CHIP
1-216-295-91 SHORT
1-216-295-91 SHORT
100
100
100
0
5%
5%
5%
1/10W
1/10W
1/10W
**************************************************************
A-4724-776-A MAIN BOARD, COMPLETE (US,CND)
0
********************
R131
R132
R133
R134
R135
1-216-073-00 METAL CHIP
1-216-097-91 RES,CHIP
1-216-117-00 METAL CHIP
1-216-049-91 RES,CHIP
1-216-061-00 METAL CHIP
10K
100K
680K
1K
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
A-4724-782-A MAIN BOARD, COMPLETE (AEP,UK,SP)
********************
< CAPACITOR >
3.3K
C101
1-163-005-11 CERAMIC CHIP 470PF
10%
50V
57
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MAIN
Ref. No.
Part No.
Description
Remark
Ref. No.
Part No.
Description
< DIODE >
Remark
C102
C181
C182
C183
1-124-779-00 ELECT CHIP
1-126-395-11 ELECT
1-163-017-00 CERAMIC CHIP 0.0047uF 5%
1-163-009-11 CERAMIC CHIP 0.001uF 10%
10uF
22uF
20%
20%
16V
16V
50V
50V
D390
D391
8-719-016-74 DIODE 1SS352-TPH3
8-719-016-74 DIODE 1SS352-TPH3
C184
C185
C201
C202
C281
1-126-603-11 ELECT CHIP
1-163-117-00 CERAMIC CHIP 100PF
1-163-005-11 CERAMIC CHIP 470PF
1-124-779-00 ELECT CHIP
1-126-395-11 ELECT
4.7uF
20%
5%
10%
20%
20%
35V
50V
50V
16V
16V
< GROUND TERMINAL >
EP911 1-537-771-21 TERMINAL BOARD, GROUND
EP912 1-537-771-21 TERMINAL BOARD, GROUND
10uF
22uF
< FERRITE BEAD >
C282
C283
C284
C285
C300
1-163-017-00 CERAMIC CHIP 0.0047uF 5%
1-163-009-11 CERAMIC CHIP 0.001uF 10%
50V
50V
35V
50V
10V
FB301 1-414-235-22 INDUCTOR CHIP 0UH
FB302 1-414-235-22 INDUCTOR CHIP 0UH
FB303 1-414-235-22 INDUCTOR CHIP 0UH
FB306 1-414-235-22 INDUCTOR CHIP 0UH
FB307 1-414-235-22 INDUCTOR CHIP 0UH
1-126-603-11 ELECT CHIP
1-163-117-00 CERAMIC CHIP 100PF
1-126-177-11 ELECT 100uF
4.7uF
20%
5%
20%
C301
C302
C303
C304
C305
1-163-038-91 CERAMIC CHIP 0.1uF
1-126-177-11 ELECT 100uF
1-163-038-91 CERAMIC CHIP 0.1uF
1-163-038-91 CERAMIC CHIP 0.1uF
1-163-038-91 CERAMIC CHIP 0.1uF
25V
10V
25V
25V
25V
20%
FB351 1-414-235-22 INDUCTOR CHIP 0UH
FB352 1-414-235-22 INDUCTOR CHIP 0UH
FB356 1-414-235-22 INDUCTOR CHIP 0UH
< IC >
C306
C307
C308
C315
C316
1-126-934-11 ELECT
1-163-038-91 CERAMIC CHIP 0.1uF
1-126-177-11 ELECT 100uF
1-163-009-11 CERAMIC CHIP 0.001uF 10%
1-163-009-11 CERAMIC CHIP 0.001uF 10%
220uF
20%
20%
10V
25V
10V
50V
50V
IC301
IC308
IC351
IC381
IC382
8-759-553-65 IC UDA1341TS
8-759-636-55 IC M5218AFP-T1
8-759-242-70 IC TC7WU04F-TE12L
8-759-636-55 IC M5218AFP-T1
8-759-636-55 IC M5218AFP-T1
C317
C321
C322
C351
C352
1-163-117-00 CERAMIC CHIP 100PF
5%
50V
16V
16V
50V
50V
1-124-779-00 ELECT CHIP
10uF
20%
20%
5%
IC441
IC501
8-759-481-19 IC LB1830M-S-TE-L
8-759-599-90 IC M30620MC-406FP
1-124-779-00 ELECT CHIP
10uF
1-163-233-11 CERAMIC CHIP 18PF
1-163-234-11 CERAMIC CHIP 20PF
5%
< JACK >
1-793-344-11 JACK, PIN 4P
< COIL >
C353
C354
C370
C371
C385
1-163-038-91 CERAMIC CHIP 0.1uF
1-163-038-91 CERAMIC CHIP 0.1uF
25V
25V
16V
16V
25V
J101
1-126-933-11 ELECT
1-126-933-11 ELECT
100uF
100uF
20%
20%
1-163-038-91 CERAMIC CHIP 0.1uF
L450
L451
1-216-296-91 SHORT
1-216-296-91 SHORT
0
0
C386
C426
C500
C512
C516
1-163-038-91 CERAMIC CHIP 0.1uF
25V
35V
35V
25V
25V
1-128-551-11 ELECT
1-131-347-00 TANTALUM
22uF
1uF
20%
10%
< TRANSISTOR >
1-163-038-91 CERAMIC CHIP 0.1uF
1-163-038-91 CERAMIC CHIP 0.1uF
Q191
Q192
Q291
Q292
Q390
8-729-046-97 TRANSISTOR
8-729-046-97 TRANSISTOR
8-729-046-97 TRANSISTOR
8-729-046-97 TRANSISTOR
8-729-424-08 TRANSISTOR
2SD1938(F)-T(TX).SO
2SD1938(F)-T(TX).SO
2SD1938(F)-T(TX).SO
2SD1938(F)-T(TX).SO
UN2111-TX
C519
C562
C571
C572
C595
1-163-009-11 CERAMIC CHIP 0.001uF 10%
1-163-038-91 CERAMIC CHIP 0.1uF
1-163-117-00 CERAMIC CHIP 100PF
1-163-117-00 CERAMIC CHIP 100PF
50V
25V
50V
50V
50V
5%
5%
Q441
8-729-421-22 TRANSISTOR
< RESISTOR >
UN2211-TX
1-163-009-11 CERAMIC CHIP 0.001uF 10%
C597
C598
C599
C951
C953
1-163-009-11 CERAMIC CHIP 0.001uF 10%
1-163-038-91 CERAMIC CHIP 0.1uF
1-163-038-91 CERAMIC CHIP 0.1uF
50V
25V
25V
10V
25V
R82
1-216-097-91 RES,CHIP
1-216-049-91 RES,CHIP
1-216-097-91 RES,CHIP
1-216-075-00 METAL CHIP
1-216-073-00 METAL CHIP
100K
1K
100K
12K
10K
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
R101
R102
R106
R181
1-104-664-11 ELECT
47uF
20%
1-163-038-91 CERAMIC CHIP 0.1uF
1-163-038-91 CERAMIC CHIP 0.1uF
< CONNECTOR >
C954
25V
R182
R183
R184
R185
R186
1-216-073-00 METAL CHIP
1-216-080-00 METAL CHIP
1-216-683-11 METAL CHIP
1-216-041-00 METAL CHIP
1-216-041-00 METAL CHIP
10K
20K
22K
470
470
5%
5%
1/10W
1/10W
0.5% 1/10W
5%
5%
CN412 1-784-834-21 CONNECTOR,FFC(LIF(NON-ZIF))23P
CN421 1-793-448-11 CONNECTOR, FFC 15P
1/10W
1/10W
CN501 1-784-834-21 CONNECTOR,FFC(LIF(NON-ZIF))23P
CN502 1-770-215-11 PIN, CONNECTOR (PC BOARD) 7P
CN503 1-784-860-21 CONNECTOR, FFC(LIF(NON-ZIF))8P
R187
R188
1-216-089-91 RES,CHIP
1-216-045-00 METAL CHIP
47K
680
5%
5%
1/10W
1/10W
58
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MAIN PANEL
Ref. No.
Part No.
Description
Remark
Ref. No.
Part No.
Description
Remark
R189
R191
R192
1-216-037-00 METAL CHIP
1-216-057-00 METAL CHIP
1-216-057-00 METAL CHIP
330
2.2K
2.2K
5%
5%
5%
1/10W
1/10W
1/10W
< VIBRATOR >
X351
X513
1-579-314-11 VIBRATOR, CRYSTAL (22.5792MHz)
1-781-174-21 VIBRATOR, CERAMIC (10MHz)
R201
R202
R206
R281
R282
1-216-049-91 RES,CHIP
1-216-097-91 RES,CHIP
1-216-075-00 METAL CHIP
1-216-073-00 METAL CHIP
1-216-073-00 METAL CHIP
1K
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
100K
12K
10K
10K
**************************************************************
A-4724-778-A PANEL BOARD, COMPLETE (US,CND)
*********************
R283
R284
R285
R286
R287
1-216-080-00 METAL CHIP
1-216-683-11 METAL CHIP
1-216-041-00 METAL CHIP
1-216-041-00 METAL CHIP
1-216-089-91 RES,CHIP
20K
22K
470
470
47K
5%
1/10W
A-4724-786-A PANEL BOARD, COMPLETE (AEP,UK,SP)
0.5% 1/10W
*********************
5%
5%
5%
1/10W
1/10W
1/10W
4-220-557-01 HOLDER (FL)
4-949-935-51 CUSHION (FL)
*
7-685-647-79 SCREW +BVTP 3X10 TYPE2 IT-3
R288
R289
R291
R292
R311
1-216-045-00 METAL CHIP
1-216-037-00 METAL CHIP
1-216-057-00 METAL CHIP
1-216-057-00 METAL CHIP
1-216-025-91 RES,CHIP
680
330
2.2K
2.2K
100
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
< CAPACITOR >
C411
C412
C414
C415
C416
1-126-939-11 ELECT
1-126-964-11 ELECT
1-163-038-91 CERAMIC CHIP 0.1uF
1-126-916-11 ELECT
1-163-038-91 CERAMIC CHIP 0.1uF
10000uF 20%
16V
50V
25V
6.3V
25V
10uF
20%
R312
R313
R314
R339
R341
1-216-025-91 RES,CHIP
1-216-025-91 RES,CHIP
1-216-025-91 RES,CHIP
1-216-295-91 SHORT
1-216-295-91 SHORT
100
100
100
0
5%
5%
5%
1/10W
1/10W
1/10W
1000uF
20%
C417
C418
C419
C420
C421
1-104-664-11 ELECT
1-163-038-91 CERAMIC CHIP 0.1uF
1-126-964-11 ELECT
1-126-926-11 ELECT
1-163-021-91 CERAMIC CHIP 0.01uF
47uF
20%
10V
25V
50V
10V
50V
0
10uF
1000uF
20%
20%
10%
R342
R351
R352
R355
R356
1-216-295-91 SHORT
0
1-216-121-91 RES,CHIP
1-216-041-00 METAL CHIP
1-216-029-00 METAL CHIP
1-216-031-00 METAL CHIP
1M
470
150
180
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
C423
C424
C425
C427
C428
1-126-968-11 ELECT
1-163-038-91 CERAMIC CHIP 0.1uF
1-126-967-11 ELECT 47uF
1-163-038-91 CERAMIC CHIP 0.1uF
1-163-038-91 CERAMIC CHIP 0.1uF
100uF
20%
20%
50V
25V
50V
25V
25V
R357
R391
R392
R441
R442
1-216-296-91 SHORT
0
1-216-097-91 RES,CHIP
1-216-101-00 METAL CHIP
1-216-057-00 METAL CHIP
1-216-053-00 METAL CHIP
100K
150K
2.2K
1.5K
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
C431
C432
C461
C466
C601
1-126-966-11 ELECT
1-126-964-11 ELECT
1-126-935-11 ELECT
1-126-935-11 ELECT
33uF
10uF
470uF
470uF
20%
20%
20%
20%
10%
16V
50V
16V
16V
50V
R443
R500
R508
R509
R530
1-216-055-00 METAL CHIP
1-216-073-00 METAL CHIP
1-216-025-91 RES,CHIP
1-216-073-00 METAL CHIP
1-216-065-91 RES,CHIP
1.8K
10K
100
10K
4.7K
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
1-163-021-91 CERAMIC CHIP 0.01uF
C611
C612
C613
C621
C623
1-163-038-91 CERAMIC CHIP 0.1uF
1-126-205-11 ELECT CHIP
1-163-021-91 CERAMIC CHIP 0.01uF
1-163-038-91 CERAMIC CHIP 0.1uF
1-163-021-91 CERAMIC CHIP 0.01uF
25V
6.3V
50V
25V
50V
47uF
20%
10%
R531
R533
R549
R550
R551
1-216-073-00 METAL CHIP
1-216-073-00 METAL CHIP
1-216-025-91 RES,CHIP
1-216-073-00 METAL CHIP
1-216-073-00 METAL CHIP
10K
10K
100
10K
10K
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
10%
20%
C661
C662
C802
1-163-038-91 CERAMIC CHIP 0.1uF
1-126-205-11 ELECT CHIP
1-163-038-91 CERAMIC CHIP 0.1uF
25V
6.3V
25V
47uF
R553
R559
R560
R568
R569
1-216-073-00 METAL CHIP
1-216-073-00 METAL CHIP
1-216-073-00 METAL CHIP
1-216-073-00 METAL CHIP
1-216-073-00 METAL CHIP
10K
10K
10K
10K
10K
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
!C901
!C902
1-113-924-11 CERAMIC
1-113-924-11 CERAMIC
0.0047uF 20%
0.0047uF 20%
250V
250V
C911
C912
C913
1-163-038-91 CERAMIC CHIP 0.1uF
1-163-038-91 CERAMIC CHIP 0.1uF
1-163-038-91 CERAMIC CHIP 0.1uF
25V
25V
25V
R573
R575
R577
R581
R595
1-216-073-00 METAL CHIP
1-216-073-00 METAL CHIP
1-216-073-00 METAL CHIP
1-216-097-91 RES,CHIP
1-216-073-00 METAL CHIP
10K
10K
10K
100K
10K
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
< CONNECTOR >
* CN401 1-564-509-11 PLUG, CONNECTOR 6P
CN411 1-778-692-11 CONNECTOR, FFC/FPC 21P
CN414 1-770-651-11 CONNECTOR, FFC/FPC 23P
CN451 1-569-490-11 SOCKET, CONNECTOR 3P
* CN901 1-580-230-11 PIN, CONNECTOR (PC BOARD) 2P
R597
R852
1-216-073-00 METAL CHIP
1-216-097-91 RES,CHIP
10K
100K
5%
5%
1/10W
1/10W
* CN902 1-566-693-11 PIN, CONNECTOR 2P
The components identified by mark !
or dotted line with mark ! are critical
for safety.
Les composants identifiés par une
marque !sont critiques pour la sécurité.
Ne les remplacer que par une piéce
portant le numéro spécifié.
Replace only with part number specified.
59
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PANEL POWER
Ref. No.
Part No.
Description
< DIODE >
Remark
Ref. No.
Part No.
Description
Remark
R434
R435
R436
R437
R451
1-216-081-00 METAL CHIP
1-216-091-00 METAL CHIP
1-216-109-00 METAL CHIP
1-216-049-91 RES,CHIP
1-216-033-00 METAL CHIP
22K
56K
330K
1K
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
D411
D412
D421
D422
D431
8-719-210-39 DIODE EC10QS04-TE12L5
8-719-210-39 DIODE EC10QS04-TE12L5
8-719-210-33 DIODE EC10DS2TE12R
8-719-422-31 DIODE MA8047-M-TX
8-719-210-33 DIODE EC10DS2TE12R
220
R613
R614
R623
R624
R801
1-216-113-00 METAL CHIP
1-216-089-91 RES,CHIP
1-216-113-00 METAL CHIP
1-216-089-91 RES,CHIP
1-216-067-00 METAL CHIP
470K
47K
470K
47K
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
D432
D433
D451
D452
D461
8-719-210-33 DIODE EC10DS2TE12R
8-719-016-74 DIODE 1SS352-TPH3
8-719-016-74 DIODE 1SS352-TPH3
8-719-313-73 DIODE SFPB-52V
5.6K
8-719-210-39 DIODE EC10QS04-TE12L5
R802
R803
R804
R805
R806
1-216-295-91 SHORT
0
1-216-065-91 RES,CHIP
1-216-073-00 METAL CHIP
1-216-001-00 METAL CHIP
1-216-025-91 RES,CHIP
4.7K
10K
10
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
D462
D466
D467
D801
D911
8-719-210-39 DIODE EC10QS04-TE12L5
8-719-210-39 DIODE EC10QS04-TE12L5
8-719-210-39 DIODE EC10QS04-TE12L5
8-719-016-74 DIODE 1SS352-TPH3
8-719-016-74 DIODE 1SS352-TPH3
100
R912
1-216-296-91 SHORT
< RELAY >
0
D912
8-719-016-74 DIODE 1SS352-TPH3
< FLUORESCENT >
RY911 1-755-300-11 RELAY
RY912 1-755-300-11 RELAY
FL701 1-517-907-11 INDICATOR TUBE, FLUORESCENT
< IC >
< SWITCH >
1-571-839-11 SWITCH, KEY BOARD (RESET)
S401
IC411
IC421
IC601
IC611
IC621
8-759-525-48 IC LA5632
8-759-633-42 IC M5293L
8-759-269-92 IC SN74HCU04ANSR
8-749-012-70 IC GP1F38R
8-749-012-70 IC GP1F38R
**************************************************************
A-4724-780-A POWER BOARD, COMPLETE (US,CND)
*********************
IC661
8-749-012-69 IC GP1F38T
< JACK >
A-4724-784-A POWER BOARD, COMPLETE (AEP,UK,SP)
*********************
< CAPACITOR >
J801
1-779-655-21 JACK (SMALL TYPE) (2 GANG)
< JUMPER RESISTOR >
C760
C761
C762
C763
C764
1-163-038-91 CERAMIC CHIP 0.1uF
25V
50V
50V
50V
25V
1-163-009-11 CERAMIC CHIP 0.001uF 10%
1-163-009-11 CERAMIC CHIP 0.001uF 10%
1-163-009-11 CERAMIC CHIP 0.001uF 10%
1-163-038-91 CERAMIC CHIP 0.1uF
JW401 1-216-296-91 SHORT
< COIL >
0
C765
C766
C769
C781
C782
1-124-778-00 ELECT CHIP
1-163-038-91 CERAMIC CHIP 0.1uF
1-163-109-00 CERAMIC CHIP 47PF
1-126-206-11 ELECT CHIP
1-163-021-91 CERAMIC CHIP 0.01uF
22uF
20%
6.3V
25V
50V
6.3V
50V
L611
L661
!L901
1-412-784-41 INDUCTOR
1-412-784-41 INDUCTOR
1-424-485-11 FILTER, LINE
4.7uH
4.7uH
5%
20%
10%
100uF
< TRANSISTOR >
< CONNECTOR >
Q801
8-729-620-05 TRANSISTOR
< RESISTOR >
2SC2603TP-EF
CN701 1-793-448-11 CONNECTOR, FFC 15P
< DIODE >
R411
R412
R413
R420
R422
1-216-073-00 METAL CHIP
1-216-097-91 RES,CHIP
1-216-049-91 RES,CHIP
1-216-099-00 METAL CHIP
1-216-097-91 RES,CHIP
10K
100K
1K
120K
100K
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
D751
8-719-051-89 DIODE SML-010VT-T87 (STANDBY)
< IC >
IC761
IC781
8-759-426-98 IC MSM9202-02GS-K
8-749-013-92 IC GP1UC7X
R423
R424
R431
R432
R433
1-216-033-00 METAL CHIP
1-216-033-00 METAL CHIP
1-216-025-91 RES,CHIP
1-216-047-91 RES,CHIP
1-216-035-00 METAL CHIP
220
220
100
820
270
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
< JACK >
J751
1-793-439-11 JACK (SMALL TYPE)
The components identified by mark !
or dotted line with mark ! are critical
for safety.
Les composants identifiés par une
marque !sont critiques pour la sécurité.
Ne les remplacer que par une piéce
portant le numéro spécifié.
Replace only with part number specified.
60
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SW
POWER
Ref. No.
Part No.
Description
< COIL >
Remark
Ref. No.
Part No.
Description
Remark
MISCELLANEOUS
*************
L751
L752
L753
1-216-296-91 SHORT
1-216-296-91 SHORT
1-216-296-91 SHORT
0
0
0
15
16
17
18
!21
1-791-161-11 WIRE (FLAT TYPE) (15 CORE)
1-791-160-11 WIRE (FLAT TYPE) (23 CORE)(180mm)
1-791-158-11 WIRE (FLAT TYPE) (23 CORE)(90mm)
1-791-159-11 WIRE (FLAT TYPE) (21 CORE)
1-696-586-21 CORD, POWER (UK)
< TRANSISTOR >
Q751
Q767
8-729-424-08 TRANSISTOR
8-729-424-67 TRANSISTOR
UN2111-TX
UN2216-TX
!21
!21
27
1-751-275-11 CORD, POWER (AEP,SP)
1-783-531-11 CORD, POWER (US,CND)
1-569-008-21 ADAPTOR, CONVERSION 2P (SP)
1-667-954-11 FLEXIBLE BOARD
< RESISTOR >
558
R322
R323
R324
R325
R702
1-216-166-00 RES,CHIP
1-216-166-00 RES,CHIP
1-216-166-00 RES,CHIP
1-216-166-00 RES,CHIP
1-216-057-00 METAL CHIP
47
47
47
47
5%
5%
5%
5%
5%
1/8W
1/8W
1/8W
1/8W
1/10W
!560
A-4672-541-A OPTICAL PICK-UP KMS-260B/J1N
FL701 1-517-907-11 INDICATOR TUBE, FLUORESCENT
HR901 1-500-502-11 HEAD, OVER LIGHT
M101
M102
M103
2.2K
A-4672-475-A MOTOR ASSY, SPINDLE
A-4672-474-A MOTOR ASSY, SLED
X-4949-264-1 MOTOR ASSY, LOADING
R703
R704
R705
R706
R722
1-216-061-00 METAL CHIP
1-216-065-91 RES,CHIP
1-216-073-00 METAL CHIP
1-216-085-00 METAL CHIP
1-216-057-00 METAL CHIP
3.3K
4.7K
10K
33K
2.2K
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
S102
!T901
!T901
1-762-148-21 SWITCH, PUSH (2 KEY)
1-433-910-11 TRANSFORMER, POWER (US,CND)
1-433-911-11 TRANSFORMER, POWER (AEP,UK,SP)
R751
R752
R753
R760
R761
1-216-001-00 METAL CHIP
1-216-001-00 METAL CHIP
1-216-033-00 METAL CHIP
1-216-025-91 RES,CHIP
1-216-025-91 RES,CHIP
10
10
220
100
100
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
**************************************************************
ACCESSORIES & PACKING MATERIALS
*******************************
1-418-541-11 REMOTE COMMANDER (RM-D35)
1-558-271-11 CORD, CONNECTION (AUDIO 108cm)
1-574-264-11 CORD, OPTICAL PLUG (600mm)
1-777-172-11 CORD, CONNECTION (CONTROLA1II 100cm)(CND)
1-783-106-11 CORD, CONNECTION (MINI-PLUG 105cm)
R762
R763
R767
R769
R781
1-216-025-91 RES,CHIP
1-216-025-91 RES,CHIP
1-216-097-91 RES,CHIP
1-216-061-00 METAL CHIP
1-216-017-91 RES,CHIP
100
100
100K
3.3K
47
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
3-866-796-11 MANUAL, INSTRUCTION (ENGLISH,FRENCH)
3-866-796-21 MANUAL, INSTRUCTION
(GERMAN,NETHER LAND,SWEDISH,ITALIAN)(AEP)
3-866-796-31 MANUAL, INSTRUCTION
R782
1-216-025-91 RES,CHIP
< SWITCH >
100
5%
1/10W
(SPANISH,PORTUGUESE,CHINESE)(AEP,SP)
S701
S702
S703
S704
S705
1-762-400-11 SWITCH (r)
1-762-400-11 SWITCH (p)
1-762-400-11 SWITCH (+)
1-762-400-11 SWITCH (=)
1-762-400-11 SWITCH (^)
3-866-797-11 MANUAL, INSTRUCTION (ENGLISH,FRENCH)
3-866-797-21 MANUAL, INSTRUCTION
(GERMAN,NETHER LAND,SWEDISH,ITALIAN)(AEP)
3-866-797-31 MANUAL, INSTRUCTION
(SPANISH,PORTUGUESE,CHINESE)(AEP,SP)
4-981-643-31 LID, BATTERY (for RM-D35)
A-4680-289-A CORD, CONNECTION (CAV-50C)(US,CND)
S706
S721
S722
1-762-400-11 SWITCH (§)
1-762-400-11 SWITCH (INPUT)
1-762-400-11 SWITCH (1/u)
A-4406-082-A CORD, CONNECTION (EXCEPT US, CND)
************************************************************** **************************************************************
*
1-668-111-11 SW BOARD
**********
*******
HARDWARE LIST
**********
< CONNECTOR >
#1
#2
#3
#4
#5
7-685-646-79 SCREW +BVTP 3X8 TYPE2 N-S
7-685-133-19 SCREW (DIA. 2.6) (IT3B)
7-685-533-19 SCREW +BTP 2.6X6 TYPE2 N-S
7-621-772-20 SCREW +B 2X5
* CN601 1-506-486-11 PIN, CONNECTOR 7P
< SWITCH >
7-621-772-40 SCREW +B 2X8
S601
S602
S604
1-572-126-21 SWITCH, PUSH (1 KEY)(REC POSITION)
1-572-126-21 SWITCH, PUSH (1 KEY)(PACK OUT)
1-771-264-11 SWITCH, PUSH(DETECTION)(1 KEY)
#6
#7
7-627-852-08 SCREW,PRECISION +P 1.7X2.5
7-685-647-79 SCREW +BVTP 3X10 TYPE2 IT-3
(PB POSITION)
**************************************************************
The components identified by mark !
or dotted line with mark ! are critical
for safety.
Les composants identifiés par une
marque !sont critiques pour la sécurité.
Ne les remplacer que par une piéce
portant le numéro spécifié.
Replace only with part number specified.
61
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MDS-PC2
Sony Corporation
Home Audio Company
9-928-916-11
(SP)
99F0986-1
Printed in Japan © 1999. 6
Published by Quality Assurance Dept.
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62
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