General Information
DDR3 SDRAM
DDR3 SDRAM Product Guide
October 2009
Memory Division
October 2009
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General Information
DDR3 SDRAM
2. DDR3 SDRAM Component Product Guide
Package & Power,
Density
Banks
Part Number
Org.
VDD Voltage
PKG
Avail.
Note
Temp. (-C/-L) & Speed
K4B1G0446D
K4B1G0846D
HC(L)F7/F8/H9
256M x 4
128M x 8
78 + 4 ball
FBGA
HC(L)F7/F8/H9
1Gb D-die
8Banks
1.5V
Now
96 + 4 ball
FBGA
K4B1G1646D
HC(L)F7/F8/H9
64M x 16
K4B1G0446E
K4B1G0846E
HC(L)F7/F8/H9/K0
HC(L)F7/F8/H9/K0
256M x 4
128M x 8
78 ball
FBGA
1.5V
96 ball
FBGA
1Gb E-die
1Gb F-die
2Gb B-die
2Gb C-die
8Banks
8Banks
8Banks
8Banks
K4B1G1646E
HC(L)F7/F8/H9/K0
64M x 16
Now
Now
Now
Now
K4B1G0446E
K4B1G0846E
K4B1G0446F
K4B1G0846F
K4B1G0446F
K4B1G0846F
K4B2G0446B
K4B2G0846B
HYF7/F8/H9/K0
HYF7/F8/H9/K0
HC(L)F8/H9
256M x 4
128M x 8
256M x 4
128M x 8
256M x 4
128M x 8
512M x 4
256M x 8
78 ball
FBGA
1.35V
1.5V
HC(L)F8/H9
78 ball
FBGA
HY(L)F8/H9
1.35V
HY(L)F8/H9
HC(L)F7/F8/H9
HC(L)F7/F8/H9
78 ball
FBGA
1.5V
96 ball
FBGA
K4B2G1646B
HC(L)F7/F8/H9
128M x 16
K4B2G0446B
K4B2G0846B
K4B2G0446C
K4B2G0846C
K4B2G0446C
K4B2G0846C
K4B2G0446D
K4B2G0846D
K4B2G0446E
K4B2G0846E
K4B4G0446B
K4B2G0846B
HYF7/F8/H9
512M x 4
256M x 8
512M x 4
256M x 8
512M x 4
256M x 8
512M x 4
256M x 8
512M x 4
256M x 8
1G x 4
78 ball
FBGA
1.35V
1.5V
1.35V
1.5V
1.5V
1.5V
HYF7/F8/H9
HC(L)F8/H9
HC(L)F8/H9
78 ball
FBGA
HY(L)F8/H9
HY(L)F8/H9
MC(L)F7/F8/H9
MC(L)F7/F8/H9
MC(L)F7/F8/H9
MC(L)F7/F8/H9
MC(L)F7/F8/H9
MC(L)F7/F8/H9
78 ball
FBGA
DDP 2Gb D-die
DDP 2Gb E-die
DDP 4Gb B-die
8Banks
8Banks
8Banks
Now
Now
Now
78 ball
FBGA
78 ball
FBGA
512M x 8
* Note : 1.35V product is 1.5V operatable.
October 2009
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General Information
DDR3 SDRAM
3. DDR3 SDRAM Module Ordering Information
1
2
3
4
5
6
7
8
9
10
11
12
M X X X B X X X X X X X - X X X
Memory Module
DIMM Type
Data bits
Speed
Temp & Power
PCB Revision
DRAM Component Type
Depth
Package
# of Banks in Comp. & Interface
Bit Organization
Component Revision
1. Memory Module : M
8. Component Revision
:
:
:
:
:
:
:
M
B
D
1st Gen.
3rd Gen.
5th Gen.
A
C
E
2nd Gen.
4th Gen.
6th Gen.
8th Gen.
2. DIMM Type
F : 7th Gen.
G
3 : DIMM
4 : SODIMM
9. Package
:
:
:
:
Z
H
J
FBGA(Lead-free)
FBGA(Lead-free & Halogen-free)
FBGA(Lead-free, DDP)
3. Data Bits
71 : x64 204pin Unbuffered SODIMM
78 : x64 240pin Unbuffered DIMM
91 : x72 240pin ECC unbuffered DIMM
92 : x72 240pin VLP Registered DIMM
93 : x72 240pin Registered DIMM
M
FBGA(Lead-free & Halogen-free, DDP)
10. PCB Revision
0 : None
1 : 1st Rev.
2 : 2nd Rev.
4 : 4th Rev.
3 : 3rd Rev.
S : Reduced Layer
4. DRAM Component Type
B : DDR3 SDRAM (1.5V VDD)
11. Temp & Power
5. Depth
C
Y
: Commercial Temp.( 0°C ~ 85°C) & Normal Power
: Commercial Temp.( 0°C ~ 85°C) & Low VDD(1.35V)
32 : 32M
64 : 64M
28 : 128M
56 : 256M
51 : 512M
1G : 1G
2G : 2G
33 : 32M (for 128Mb/512Mb)
65 : 64M (for 128Mb/512Mb)
29 : 128M (for 128Mb/512Mb)
57 : 256M (for 512Mb/2Gb)
52 : 512M (for 512Mb/2Gb)
1K : 1G (for 2Gb)
12. Speed
F7 : DDR3-800 (400MHz @ CL=6, tRCD=6, tRP=6)
2K : 2G (for 2Gb)
F8 : DDR3-1066 (533MHz @ CL=7, tRCD=7, tRP=7)
H9: DDR3-1333 (667MHz @ CL=9, tRCD=9, tRP=9)
: DDR3-1600 (800MHz @ CL=11, tRCD=11, tRP=11)
K0
6. # of Banks in comp. & Interface
7 : 8Banks & SSTL-1.5V
Note: PC3-6400(DDR3-800),PC3-8500(DDR3-1066),
PC3-10600(DDR3-1333), PC3-12800(DDR3-1600)
7. Bit Organization
0 : x 4
3 : x 8
4 : x16
October 2009
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General Information
DDR3 SDRAM
4. DDR3 SDRAM Module Product Guide
4.1 240Pin DDR3 Unbuffered DIMM (1.5V Product)
240Pin DDR3 Unbuffered DIMM
Comp.
Version
Internal
Banks
Org.
Density
Part Number
Speed
Raw Card
Composition
Rank
PKG
Height
Avail.
Note
78 + 4 ball
FBGA
M378B2873DZ1
CF8/H9
128M x 8
*
8 pcs 1Gb D-die
128Mx 64
1GB
A(1Rx8)
8
8
1
30mm
Now
M378B2873EH1
M378B2873FHS
CF8/H9/K0
CF8/H9
128M x 8
128M x 8
*
*
8 pcs 1Gb E-die
8 pcs 1Gb F-die
78 ball
FBGA
78 + 4 ball
FBGA
M391B2873DZ1
CF8/H9
128M x 8
*
9 pcs 1Gb D-die
128Mx 72
256Mx 64
1GB
2GB
D(1Rx8)
1
30mm
30mm
Now
Now
M391B2873EH1
M391B2873FH0
CF8/H9/K0
CF8/H9/K0
128M x 8
128M x 8
*
*
9 pcs 1Gb E-die
9 pcs 1Gb F-die
78 ball
FBGA
78 + 4 ball
FBGA
M378B5673DZ1
CF8/H9
128M x 8 * 16 pcs 1Gb D-die
B(2Rx8)
A(1Rx8)
E(2Rx8)
8
8
2
1
2
M378B5673EH1
M378B5673FH0
M378B5773CHS
CF8/H9/K0
CF8/H9/K0
CF8/H9/K0
128M x 8 * 16 pcs 1Gb E-die
128M x 8 * 16 pcs 1Gb F-die
78 ball
FBGA
256M x 8
*
8 pcs 2Gb C-die
78 + 4 ball
FBGA
M391B5673DZ1
CF8/H9
128M x 8 * 18 pcs 1Gb D-die
M391B5673EH1
M391B5673FH0
M391B5773CH0
M378B5273BH1
M378B5273CH0
M391B5273BH1
M391B5273CH0
CF8/H9/K0
CF8/H9/K0
CF8/H9/K0
CF8/H9
128M x 8 * 18 pcs 1Gb E-die
128M x 8 * 18 pcs 1Gb F-die
256Mx 72
2GB
8
30mm
Now
78 ball
FBGA
D(1Rx8)
B(2Rx8)
256M x 8
*
9 pcs 2Gb C-die
1
2
256M x 8 * 16 pcs 2Gb B-die
256M x 8 * 16 pcs 2Gb C-die
256M x 8 * 18 pcs 2Gb B-die
256M x 8 * 18 pcs 2Gb C-die
78 ball
FBGA
512Mx 64
512Mx 72
4GB
4GB
8
8
30mm
30mm
Now
Now
CF8/H9/K0
CF8/H9
78 ball
FBGA
E(2Rx8)
2
CF8/H9/K0
4.2 240Pin DDR3 Unbuffered DIMM (1.35V Product)
240Pin DDR3 Unbuffered DIMM
Comp.
Version
Internal
Banks
Org.
Density
Part Number
Speed
Raw Card
Composition
Rank
PKG
Height
Avail.
Note
M391B2873EH1
M391B2873FH0
M391B5673EH1
M391B5673FH0
M391B5773CH0
M391B5273BH1
M391B5273CH0
YF8/H9
YF8/H9
YF8/H9
YF8/H9
YF8/H9
YF8/H9
YF8/H9
128M x 8
128M x 8
*
*
9 pcs 1Gb E-die
9 pcs 1Gb F-die
78 ball
FBGA
128Mx 72
1GB
D(1Rx8)
8
1
30mm
Now
128M x 8 * 18 pcs 1Gb E-die
128M x 8 * 18 pcs 1Gb F-die
E(2Rx8)
D(1Rx8)
E(2Rx8)
8
8
8
2
1
2
78 ball
FBGA
256Mx 72
512Mx 72
2GB
4GB
30mm
30mm
Now
Now
256M x 8
*
9 pcs 2Gb C-die
256M x 8 * 18 pcs 2Gb B-die
256M x 8 * 18 pcs 2Gb C-die
78 ball
FBGA
* Note : 1.35V product is 1.5V operatable.
October 2009
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General Information
DDR3 SDRAM
4.3 204Pin DDR3 SoDIMM (1.5V Product)
204Pin DDR3 SODIMM
Composition
Comp.
Version
Internal
Banks
Org.
Density
Part Number
Speed
Raw Card
Rank
PKG
Height Avail.
Note
96 + 4 ball
FBGA
M471B2874DZ1
CF8/H9
A(2Rx16)
64M x 16 * 8 pcs 1Gb D-die
128M x 8 8 pcs 1Gb E-die
8
2
78 ball
FBGA
M471B2873EH1
M471B2874EH1
M471B2873FHS
CF8/H9
CF8/H9
CF8/H9
B(1Rx8)
A(2Rx16)
B(1Rx8)
*
8
8
8
1
2
1
128Mx 64
1GB
30mm
Now
64M x 16 * 8 pcs 1Gb E-die
64M x 16 * 8 pcs 1Gb F-die
96 ball
78 ball
FBGA
78 + 4 ball
FBGA
M471B5673DZ1
CF8/H9
128M x 8 * 16 pcs 1Gb D-die
F(2Rx8)
8
2
M471B5673EH1
M471B5673FH0
M471B5773CHS
M471B5273BH1
M471B5273CH0
CF8/H9
CF8/H9
CF8/H9
CF8/H9
CF8/H9
128M x 8 * 16 pcs 1Gb E-die
128M x 8 * 16 pcs 1Gb F-die
256Mx 64
512Mx 64
2GB
4GB
30mm
30mm
Now
Now
78 ball
FBGA
B(1Rx8)
F(2Rx8)
256M x 8
*
8 pcs 2Gb C-die
8
8
1
2
256M x 8 * 16 pcs 2Gb B-die
256M x 8 * 16 pcs 2Gb C-die
78 ball
FBGA
4.4 204Pin DDR3 SoDIMM (1.35V Product)
204Pin DDR3 SODIMM
Comp.
Composition
Internal
Banks
Org.
Density
Part Number
Speed
Raw Card
Rank
PKG
Height
Avail.
Note
Version
78 ball
FBGA
M471B2873EH1
M471B2874EH1
M471B2873FHS
YF8/H9
YF8/H9
YF8/H9
B(1Rx8)
A(1Rx16)
B(1Rx8)
128M x 8
64M x 16 * 8 pcs 1Gb E-die
128M x 8 8 pcs 1Gb F-die
*
8 pcs 1Gb E-die
8
8
8
1
2
1
128Mx 64
1GB
96 ball
30mm
Now
78 ball
FBGA
*
M471B5673EH1
M471B5673FH0
M471B5773CHS
M471B5273BH1
M471B5273CH0
YF8/H9
YF8/H9
YF8/H9
YF8/H9
YF8/H9
128M x 8 * 16 pcs 1Gb E-die
128M x 8 * 16 pcs 1Gb F-die
F(2Rx8)
B(1Rx8)
F(2Rx8)
8
8
8
2
1
2
78 ball
FBGA
256Mx 64
512Mx 64
2GB
4GB
30mm
30mm
Now
Now
256M x 8
*
8 pcs 2Gb C-die
256M x 8 * 16 pcs 2Gb B-die
256M x 8 * 16 pcs 2Gb C-die
78 ball
FBGA
* Note : 1.35V product is 1.5V operatable.
October 2009
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General Information
DDR3 SDRAM
4.5 240Pin DDR3 Registered DIMM (1.5V Product)
240Pin DDR3 Registered DIMM
Comp.
Version
Internal
Banks
Org.
Density
Part Number
Speed
Raw Card
Composition
Rank
PKG
Height Avail.
Note
78 + 4 ball
FBGA
M393B2873DZ1
CF8/H9
128M x 8
*
9 pcs
1Gb D-die
128Mx 72
1GB
A(1Rx8)
8
1
30mm
Now
M393B2873EH1
M393B2873FH0
CF8/H9
CF8/H9
128M x 8
128M x 8
*
*
9 pcs
9 pcs
1Gb E-die
1Gb F-die
78 ball
FBGA
78 + 4 ball
FBGA
M393B5673DZ1
CF8/H9
128M x 8
*
18 pcs 1Gb D-die
2
2
1
1
4
4
2
2
B(2Rx8)
C(1Rx4)
H(4Rx8)
E(2Rx4)
M393B5673EH1
M393B5673FH0
CF8/H9
CF8/H9
128M x 8
128M x 8
*
*
18 pcs 1Gb E-die
18 pcs 1Gb F-die
78 ball
FBGA
256Mx 72
2GB
8
30mm
Now
78 + 4 ball
FBGA
M393B5670DZ1
CF8/H9
256M x 4
*
18 pcs 1Gb D-die
M393B5670EH1
M393B5670FH0
CF8/H9
CF8/H9
256M x 4
256M x 4
*
*
18 pcs 1Gb E-die
18 pcs 1Gb F-die
78 ball
FBGA
78 + 4 ball
FBGA
M393B5173DZ1
CF7/F8
128M x 8
*
36 pcs 1Gb D-die
M393B5173EH1
M393B5173FH0
CF7/F8
CF7/F8
128M x 8
128M x 8
*
*
36 pcs 1Gb E-die
36 pcs 1Gb F-die
78 ball
FBGA
78 + 4 ball
FBGA
M393B5170DZ1
CF8/H9
256M x 4
*
36 pcs 1Gb D-die
512Mx 72
4GB
8
30mm
Now
M393B5170EH1
M393B5170FH0
M393B5273BH1
M393B5273CH0
M393B5270BH1
M393B5270CH0
CF8/H9
CF8/H9
CF8/H9
CF8/H9
CF8/H9
CF8/H9
256M x 4
256M x 4
256M x 8
256M x 8
512M x 4
512M x 4
*
*
*
*
*
*
36 pcs 1Gb E-die
36 pcs 1Gb F-die
18 pcs 2Gb B-die
18 pcs 2Gb C-die
18 pcs 2Gb B-die
18 pcs 2Gb C-die
78 ball
FBGA
B(2Rx8)
C(1Rx4)
2
1
DDP
x 4
M393B1G70DJ1
M393B1G70EM1
CF7/F8
CF7/F8
*
*
36 pcs 1Gb D-die
36 pcs 1Gb E-die
512M
F(4Rx4)
4
DDP
x 4
512M
78 ball
FBGA
1Gx 72
8GB
8
8
30mm
30mm
Now
Now
M393B1K73BH1
M393B1K73CH0
M393B1K70BH1
M393B1K70CH0
CF7/F8
CF7/F8
CF8/H9
CF8/H9
256M x 8
256M x 8
512M x 4
512M x 4
*
*
*
*
36 pcs 2Gb B-die
36 pcs 2Gb C-die
36 pcs 2Gb B-die
36 pcs 2Gb C-die
H(4Rx8)
E(2Rx4)
4
2
DDP
x 4
M393B2K70BM1
M393B2K70CM0
CF7/F8
CF7/F8
*
*
36 pcs 2Gb B-die
36 pcs 2Gb C-die
1G
78 ball
FBGA
2Gx 72
16GB
F(4Rx4)
4
DDP
x 4
1G
October 2009
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General Information
DDR3 SDRAM
4.6 240Pin DDR3 Registered DIMM (1.35V Product)
240Pin DDR3 Registered DIMM
Comp.
Version
Internal
Banks
Org.
Density
Part Number
Speed
Raw Card
Composition
Rank
PKG
Height Avail.
Note
M393B2873EH1
M393B2873FH0
M393B5673EH1
M393B5673FH0
M393B5670EH1
M393B5670FH0
M393B5773CH0
M393B5173EH1
M393B5173FH0
M393B5170EH1
M393B5170FH0
M393B5273BH1
M393B5273CH0
M393B5270BH1
M393B5270CH0
YF8/H9
YF8/H9
YF8/H9
YF8/H9
YF8/H9
YF8/H9
YF8/H9
YF7/F8
YF7/F8
YF8/H9
YF8/H9
YF8/H9
YF8/H9
YF8/H9
YF8/H9
128M x 8
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
9 pcs
1Gb E-die
1Gb F-die
1Gb E-die
1Gb F-die
1Gb E-die
1Gb F-die
2Gb C-die
1Gb E-die
1Gb F-die
1Gb E-die
1Gb F-die
2Gb B-die
2Gb C-die
2Gb B-die
2Gb C-die
78 ball
FBGA
128Mx 72
1GB
A(1Rx8)
8
8
1
30mm
Now
128M x 8
128M x 8
128M x 8
256M x 4
256M x 4
512M x 4
128M x 8
128M x 8
256M x 4
256M x 4
256M x 8
256M x 8
512M x 4
512M x 4
9 pcs
18 pcs
18 pcs
18 pcs
18 pcs
9 pcs
B(2Rx8)
2
1
78 ball
FBGA
256Mx 72
2GB
30mm
Now
C(1Rx4)
A(1Rx8)
H(4Rx8)
8
36 pcs
36 pcs
36 pcs
36 pcs
18 pcs
18 pcs
18 pcs
18 pcs
8
8
8
8
4
2
2
1
E(2Rx4)
B(2Rx8)
C(1Rx4)
78 ball
FBGA
512Mx 72
4GB
30mm
Now
DDP
x 4
M393B1G70EM1
M393B1G70FM0
YF7/F8
YF7/F8
*
*
36 pcs
36 pcs
1Gb E-die
1Gb F-die
Now
512M
F(4Rx4)
8
4
DDP
x 4
Nov. ’09
512M
78 ball
FBGA
1Gx 72
8GB
30mm
30mm
M393B1K73BH1
M393B1K73CH0
M393B1K70BH1
M393B1K70CH0
YF7/F8
YF7/F8
YF8/H9
YF8/H9
256M x 8
256M x 8
512M x 4
512M x 4
*
*
*
*
36 pcs
36 pcs
36 pcs
36 pcs
2Gb B-die
2Gb C-die
2Gb B-die
2Gb C-die
H(4Rx8)
E(2Rx4)
8
8
4
2
Now
DDP
x 4
M393B2K70BM1
M393B2K70CM0
YF7/F8
YF7/F8
*
*
36 pcs
36 pcs
2Gb B-die
2Gb C-die
Now
1G
78 ball
FBGA
2Gx 72
16GB
F(4Rx4)
8
4
DDP
x 4
Nov. ’09
1G
* Note : 1.35V product is 1.5V operatable.
October 2009
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General Information
DDR3 SDRAM
4.7 240Pin DDR3 VLP Registered DIMM (1.5V Product)
240Pin DDR3 VLP Registered DIMM
Comp.
Version
Internal
Banks
Org.
Density
Part Number
Speed
Raw Card
Composition
Rank
PKG
Height
Avail. Note
78 + 4 ball
FBGA
M392B2873DZ1
CF8/H9
128M x 8
*
9 pcs
1Gb D-die
128Mx 72
1GB
K(1Rx8)
8
1
18.75mm
Now
M392B2873EH1
M392B2873FH0
CF8/H9
CF8/H9
128M x 8
128M x 8
*
*
9 pcs
9 pcs
1Gb E-die
1Gb F-die
78 ball
FBGA
78 + 4 ball
FBGA
M392B5673DZ1
CF8/H9
128M x 8
*
18 pcs
1Gb D-die
L(2Rx8)
2
M392B5673EH1
M392B5673FH0
CF8/H9
CF8/H9
128M x 8
128M x 8
*
*
18 pcs
18 pcs
1Gb E-die
1Gb F-die
78 ball
FBGA
78 + 4 ball
FBGA
256Mx 72
2GB
M392B5670DZ1
CF8/H9
256M x 4
*
18 pcs
1Gb D-die
8
18.75mm
Now
M(1Rx4)
K(1Rx8)
1
1
M392B5670EH1
M392B5670FH0
CF8/H9
CF8/H9
256M x 4
256M x 4
*
*
18 pcs
18 pcs
1Gb E-die
1Gb F-die
78 ball
FBGA
78 ball
FBGA
M392B5773CH0
M392B5170DJ1
M392B5170EM1
M392B5170FM0
M392B5173FM0
CF8/H9
CF8/H9
CF8/H9
CF8/H9
CF7/F8
128M x 8
*
*
*
*
*
9 pcs
18 pcs
18 pcs
18 pcs
18 pcs
1Gb F-die
1Gb D-die
1Gb E-die
1Gb F-die
1Gb F-die
DDP
x 4
512M
Now
DDP
x 4
N(2Rx4)
2
512M
DDP
x 4
512M
Dec. ’09
78 ball
FBGA
512Mx 72
4GB
8
18.75mm
DDP
x 8
V(4Rx8)
L(2Rx8)
4
2
256M
M392B5273BH1
M392B5273CH0
M392B5270BH1
M392B5270CH0
CF8/H9
CF8/H9
CF8/H9
CF8/H9
256M x 8
256M x 8
512M x 4
512M x 4
*
*
*
*
18 pcs
18 pcs
18 pcs
18 pcs
2Gb B-die
2Gb C-die
2Gb B-die
2Gb C-die
Now
Now
M(1Rx4)
V(4Rx8)
1
4
DDP
x 8
M392B1K73BM1
M392B1K73CM0
M392B1K70BM1
M392B1K70CM0
CF7/F8
CF7/F8
CF8/H9
CF8/H9
*
*
*
*
18 pcs
18 pcs
18 pcs
18 pcs
2Gb B-die
2Gb C-die
2Gb B-die
2Gb C-die
512M
DDP
x 8
512M
78 ball
FBGA
1Gx 72
8GB
8
18.75mm
DDP
x 4
1G
N(2Rx4)
2
DDP
x 4
1G
October 2009
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General Information
DDR3 SDRAM
4.8 240Pin DDR3 VLP Registered DIMM (1.35V Product)
240Pin DDR3 VLP Registered DIMM
Comp.
Version
Internal
Banks
Org.
Density
Part Number
Speed
Raw Card
Composition
Rank
PKG
Height
Avail.
Note
M392B2873EH1
M392B2873FH0
M392B5673EH1
M392B5673FH0
M392B5670EH1
M392B5670FH0
M392B5773CH0
YF8/H9
YF8/H9
YF8/H9
YF8/H9
YF8/H9
YF8/H9
YF8/H9
128M x 8
128M x 8
*
*
9 pcs
9 pcs
1Gb
1Gb
E-die
F-die
E-die
F-die
E-die
F-die
C-die
78 ball
FBGA
128Mx 72
1GB
K(1Rx8)
8
8
1
18.75mm
Now
128M x 8 * 18 pcs 1Gb
128M x 8 * 18 pcs 1Gb
256M x 4 * 18 pcs 1Gb
256M x 4 * 18 pcs 1Gb
L(2Rx8)
M(1Rx4)
2
1
78 ball
FBGA
256Mx 72
2GB
18.75mm
Now
8
K(1Rx8)
N(2Rx4)
512M x 4
*
9 pcs
2Gb
DDP
512M
M392B5170EM1
YF8/H9
x 4 * 18 pcs 1Gb
E-die
8
8
2
4
Now
M392B5173FM0
M392B5170FM0
M392B5273BH1
M392B5273CH0
M392B5270BH1
M392B5270CH0
YF7/F8
YF8/H9
YF8/H9
YF8/H9
YF8/H9
YF8/H9
V(4Rx8)
N(2Rx4)
256M x 8 * 18 pcs 1Gb
512M x 4 * 18 pcs 1Gb
256M x 8 * 18 pcs 2Gb
256M x 8 * 18 pcs 2Gb
512M x 4 * 18 pcs 2Gb
512M x 4 * 18 pcs 2Gb
F-die
F-die
B-die
C-die
B-die
C-die
Dec. ’09
78 ball
FBGA
512Mx 72
4GB
18.75mm
8
8
2
1
L(2Rx8)
M(1Rx4)
Now
DDP
M392B1K73BM1
M392B1K73CM0
M392B1K70BM1
M392B1K70CM0
YF7/F8
YF7/F8
YF8/H9
YF8/H9
x 8 * 18 pcs 2Gb
512M
B-die
C-die
B-die
C-die
Now
Nov. ’09
Now
V(4Rx8)
N(2Rx4)
8
8
4
2
DDP
x 8 * 18 pcs 2Gb
512M
78 ball
FBGA
1Gx 72
8GB
18.75mm
DDP
x 4 * 18 pcs 2Gb
1G
DDP
x 4 * 18 pcs 2Gb
1G
Nov. ’09
* Note : 1.35V product is 1.5V operatable.
October 2009
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General Information
DDR3 SDRAM
5. RDIMM RCD Information
5.1 RCD Identification in JEDEC Description in Module Label
5.2 Label Example
4GB 2Rx4 PC3 - 10600R - 09 - 10 - E1 - P0
0920
M393B5170EH1-CH9
Made in Korea
5.3 RCD Information
- Example
Voltage
Vendor
Inphi
Revision
GS04 B2
Module P/N
JEDEC Description On Label
4GB 2Rx4 PC3-10600R-09-10-E1-P0
M393B5170EH1-CH9
M393B5170EH1-CH9
M393B5170EH1-YF8
M393B5170EH1-YF8
1.5V
IDT
Inphi
IDT
LV DDR3 B0
LV GS02 C0
LV DDR3 B0
4GB 2Rx4 PC3-10600R-09-10-E1-D2
4GB 2Rx4 PC3L-8500R-07-10-E1-P1
4GB 2Rx4 PC3L-8500R-07-10-E1-D2
1.35V
October 2009
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General Information
DDR3 SDRAM
78 + 4Ball FBGA for 1Gb D-die (x4/x8)
9.00 ± 0.10
A
0.80 x 10 = 8.00
#A1 INDEX MARK
B
(Datum A)
(Datum B)
0.80 1.60
11 10 9
4.00
9.00 ± 0.10
#A1
8
7
6
5
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
0.35 ± 0.05
(0.95)
82 - ∅0.45 Solder ball
(Post Reflow ∅0.05 ± 0.05)
MOLDING AREA
1.10 ± 0.10
(1.90)
0.2
M
A B
Top
Bottom
: Support Ball
96 + 4Ball FBGA for 1Gb D-die (x16)
9.00 ± 0.10
A
0.80 x 10 = 8.00
#A1 INDEX MARK
B
0.80 1.60
11 10 9
4.00
9.00 ± 0.10
#A1
8
7
6
5
4
3
2
1
A
B
C
D
E
F
(Datum A)
(Datum B)
G
H
J
K
L
M
N
P
R
T
0.35 ± 0.05
(0.95)
100 - ∅0.45 Solder ball
(Post Reflow ∅0.05 ± 0.05)
MOLDING AREA
1.10 ± 0.10
(1.90)
0.2
M
A B
Top
Bottom
: Support Ball
October 2009
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General Information
DDR3 SDRAM
78Ball FBGA for 1Gb E-die (x4/x8) / 1Gb F-die (x4/x8) / 2Gb C-die (x4/x8)
7.50 ± 0.10
A
0.80 x 8 = 6.40
#A1 INDEX MARK
(Datum A)
(Datum B)
0.80 1.60
3.20
7.50 ± 0.10
#A1
B
9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
0.35 ± 0.05
(0.95)
78 - ∅0.45 Solder ball
(Post Reflow ∅0.05 ± 0.05)
0.2 A B
MOLDING AREA
1.10 ± 0.10
(1.90)
M
Top
Bottom
96Ball FBGA for 1Gb E-die (x16)
7.50 ± 0.10
A
0.80 x 8 = 6.40
#A1 INDEX MARK
0.80 1.60
3.20
7.50 ± 0.10
#A1
B
9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
(Datum A)
(Datum B)
G
H
J
K
L
M
N
P
R
T
0.35 ± 0.05
(0.95)
96 - ∅0.45 Solder ball
(Post Reflow ∅0.05 ± 0.05)
0.2 A B
MOLDING AREA
1.10 ± 0.10
(1.90)
M
Top
Bottom
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General Information
DDR3 SDRAM
78Ball FBGA for 2Gb B-die (x4/x8)
9.00 ± 0.10
A
#A1 INDEX MARK
B
(Datum A)
(Datum B)
0.80 1.60
3.20
9.00 ± 0.10
#A1
9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
0.35 ± 0.05
(0.95)
78 - ∅0.45 Solder ball
(Post Reflow ∅0.50 ± 0.05)
0.2 A B
MOLDING AREA
1.10 ± 0.10
(1.90)
M
TOP VIEW
BOTTOM VIEW
96Ball FBGA for 2Gb B-die (x16)
9.00 ± 0.10
A
#A1 INDEX MARK
0.80 1.60
3.20
9.00 ± 0.10
#A1
B
9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
(Datum A)
(Datum B)
G
H
J
K
L
M
N
P
R
T
0.35 ± 0.05
(0.95)
96 - ∅0.45 Solder ball
(Post Reflow ∅0.50 ± 0.05)
0.2 A B
MOLDING AREA
1.10 ± 0.10
(1.90)
M
TOP VIEW
BOTTOM VIEW
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General Information
DDR3 SDRAM
78Ball DDP for 1Gb D-die (x4)
10.50 ± 0.10
A
0.80 x 8 = 6.40
#A1 INDEX MARK
B
(Datum A)
(Datum B)
0.80 1.60
4.00
10.50 ± 0.10
#A1
9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
0.35 ± 0.05
82 - ∅0.45 Solder ball
(Post Reflow ∅0.50 ± 0.05)
0.2 A B
1.40 ± 0.10
M
Top
Bottom
78Ball DDP for 1Gb E-die (x4/x8)
9.00 ± 0.10
A
0.80 x 8 = 6.40
#A1 INDEX MARK
B
(Datum A)
(Datum B)
0.80 1.60
3.20
3
9.00 ± 0.10
#A1
9
8
7
6
5
4
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
0.35 ± 0.05
78 - ∅0.45 Solder ball
(Post Reflow ∅0.50 ± 0.05)
0.2 A B
1.40 ± 0.10
M
Top
Bottom
October 2009
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General Information
DDR3 SDRAM
78Ball DDP for 2Gb B-die (x4/x8)
10.00 ± 0.10
A
0.80 x 8 = 6.40
#A1 INDEX MARK
B
(Datum A)
(Datum B)
0.80 1.60
3.20
10.00 ± 0.10
#A1
9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
0.35 ± 0.05
78 - ∅0.45 Solder ball
(Post Reflow ∅0.50 ± 0.05)
0.2 A B
1.40 ± 0.10
M
Top
Bottom
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General Information
DDR3 SDRAM
x64/x72 240pin DDR3 SDRAM Unbuffered DIMM
Units : Millimeters
133.35 ± 0.15
128.95
N/A
(for x64)
SPD
ECC
(for x72)
(2)
2.50
54.675
A
B
Max 4.0
47.00
71.00
N/A
(for x64)
ECC
(for x72)
1.270 ± 0.10
5.00
2x 2.10 ± 0.15
0.80 ± 0.05
0.2 ± 0.15
3.80
1.50±0.10
1.00
2.50
Detail A
Detail B
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General Information
DDR3 SDRAM
x64 204pin DDR3 SDRAM Unbuffered SODIMM
Units : Millimeters
0.10 M C A B
67.60
63.60
Max 3.8
1.00 ± 0.10
24.80
21.00
A
B
39.00
2X 1.80
0.10 M C A B
(OPTIONAL HOLES)
2X 4.00 ± 0.10
0.10 M C A B
0.60
0.45 ± 0.03
1.65
4.00 ± 0.10
2.55
0.25 MAX
1.00 ± 0.10
Detail A
Detail B
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General Information
DDR3 SDRAM
x72 240pin DDR3 SDRAM Registered DIMM
Units : Millimeters
Max 4.0
133.35 ± 0.15
128.95
C
9.76 10.9 18.92
32.40
18.93
9.74
2.50
1.0 max
54.675
47.00
A
B
1.27 ± 0.10
71.00
5.00
0.80 ± 0.05
3.80
0.2 ± 0.15
10.9
0.4
2.50
1.00
1.50±0.10
Detail A
Detail B
Detail C
2x 2.10 ± 0.15
Address, Command and Control lines
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General Information
DDR3 SDRAM
Registered DIMM Heat Spreader Design
1. FRONT PART
Outside
133.15 ± 0.2
0.65 ± 0.2
130.45 ± 0.15
9.26
29.77
11.9
31.4
0.15
1.3
1
127 ± 0.12
1.3
Inside
Green Line : TIM Attatch Line
Reg. pedestal line
80.78
119.29
128.5
2. BACK PART
Outside
Inside
Green Line : TIM Attatch Line
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General Information
DDR3 SDRAM
3. CLIP PART
39.3 ± 0.2
Upper Bending
Tilting Gap
29.77
0.1 ~ 0.3
A
B
C
0.5
4. DDR3 RDIMM ASS’Y View
Reference thickness total (Maximum) : Mono Package : 7.55mm, DDP Package 7.71mm (With Clip thickness)
132.95 ± 133.45
39.3 ± 0.2
D
K
E (Clip open size)
text mark ’B’ or ’K’
punch press_stamp
* Dimension Index
Mono
Typ.
43.9
6.8
DDP
Typ.
44.4
7.3
6.3
7.3
-
Note
Min.
-
Max.
-
Min.
-
Max.
-
A
B
6.7
-
6.9
-
7.2
-
7.4
-
C
5.8
D
6.7
2.5
6.8
6.9
3.6
7.2
2.6
7.4
3.8
E (Clip open size)
-
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