INTEGRATED CIRCUITS
DATA SHEET
TDA7053A
Stereo BTL audio output amplifier
with DC volume control
1997 Jul 15
Product specification
Supersedes data of 1995 Nov 09
File under Integrated Circuits, IC01
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Philips Semiconductors
Product specification
Stereo BTL audio output amplifier with DC
volume control
TDA7053A
BLOCK DIAGRAM
V
P
5
TDA7053A
TDA7053AT
I
i
i
positive
output 1
16
13
4
input 1
2
DC volume
control 1
Ι
I
negative
output 1
TEMPERATURE
PROTECTION
STABILIZER
V
ref
I
I
i
12
9
negative
output 2
6
8
input 2
DC volume
control 2
ΙΙ
i
positive
output 2
1,3,11,15
7
14
10
MSA717 - 2
not
connected
signal
ground
power
ground 1
power
ground 2
Fig.1 Block diagram.
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Philips Semiconductors
Product specification
Stereo BTL audio output amplifier with DC
volume control
TDA7053A
PINNING
SYMBOL
PIN
DESCRIPTION
not connected
n.c.
1
2
VC1
DC volume control 1
not connected
n.c.
3
n.c.
VC1
n.c.
1
2
3
4
5
6
7
8
16
OUT1
15 n.c.
14 PGND1
VI (1)
4
voltage input 1
VP
5
positive supply voltage
voltage input 2
VI (2)
6
V
13
12
I (1)
OUT1
OUT2
TDA7053A
TDA7053AT
SGND
VC2
7
signal ground
V
P
8
DC volume control 2
positive output 2
power ground 2
not connected
V
OUT2+
PGND2
n.c.
9
I (2)
11 n.c.
10
11
12
13
14
15
16
PGND2
SGND
VC2
10
9
OUT2
OUT2−
OUT1−
PGND1
n.c.
negative output 2
negative output 1
power ground 1
not connected
MSA719 - 2
Fig.2 Pin configuration.
OUT1+
positive output 1
For portable applications there is a trend to decrease the
supply voltage, resulting in a reduction of output power at
conventional output stages. Using the BTL principle
increases the output power.
FUNCTIONAL DESCRIPTION
The TDA7053A and TDA7053AT are stereo output
amplifiers with two DC volume control stages, designed for
TV and monitors, but also suitable for battery-fed portable
recorders and radios.
The maximum gain of the amplifier is fixed at 40.5 dB.
The DC volume control stages have a logarithmic control
characteristic. Therefore, the total gain can be controlled
from +40.5 to −33 dB.
In conventional DC volume control circuits the control or
input stage is AC coupled to the output stage via external
capacitors to keep the offset voltage low.
If the DC volume control voltage falls below 0.4 V, the
device will switch to the mute mode.
The two DC volume control stages are integrated into the
input stages so that no coupling capacitors are required
and a low offset voltage is still maintained. The minimum
supply voltage also remains low.
The amplifier is short-circuit protected to ground, VP and
across the load. A thermal protection circuit is also
implemented. If the crystal temperature rises above
150 °C the gain will be reduced, thereby reducing the
output power.
The BTL principle offers the following advantages:
• Lower peak value of the supply current
• The frequency of the ripple on the supply voltage is twice
the signal frequency.
Special attention is given to switch-on and switch-off
clicks, low HF radiation and a good overall stability.
Consequently, a reduced power supply with smaller
capacitors can be used which results in cost reductions.
1997 Jul 15
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Philips Semiconductors
Product specification
Stereo BTL audio output amplifier with DC
volume control
TDA7053A
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
VP
PARAMETER
supply voltage
CONDITIONS
MIN.
MAX.
18
UNIT
−
−
−
V
A
A
IORM
IOSM
Ptot
repetitive peak output current
non-repetitive peak output current
total power dissipation
TDA7053A
1.25
1.5
Tamb ≤ 25 °C
−
−
−
−
2.5
1.32
1
W
W
hr
V
TDA7053AT
tsc
short-circuit time
Vn
input voltage pins 2, 4, 6 and 8
operating ambient temperature
storage temperature
5
Tamb
Tstg
Tvj
−40
−55
−
+85
+150
+150
°C
°C
°C
virtual junction temperature
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
VALUE
UNIT
Rth j-a
thermal resistance from junction to ambient in free air
TDA7053A
50
95
K/W
K/W
TDA7053AT
Power dissipation
TDA7053A:
Assume VP = 6 V and RL = 8 Ω.
The maximum sine wave dissipation is 2 × 0.9 W = 1.8 W.
The Rth j-a of the package is 50 K/W therefore Tamb(max) = 150 − (50 × 1.8) = 60 °C.
TDA7053AT:
Assume VP = 6 V and RL = 16 Ω.
The maximum sine wave dissipation is 2 × 0.46 W = 0.92 W.
The Rth j-a of the package is 95 K/W therefore Tamb(max) = 150 − (95 × 0.92) = 62.6 °C.
1997 Jul 15
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Philips Semiconductors
Product specification
Stereo BTL audio output amplifier with DC
volume control
TDA7053A
CHARACTERISTICS
VP = 6 V; Tamb = 25 °C; fi = 1 kHz; TDA7053A: RL = 8 Ω; TDA7053AT: RL = 16 Ω; unless otherwise specified
(see Fig.13).
SYMBOL
VP
Iq(tot)
Maximum gain; V2,8 ≥ 1.4 V
PARAMETER
supply voltage
total quiescent current
CONDITIONS
MIN.
4.5
TYP.
MAX.
18
UNIT
−
V
VP = 6 V; RL = ∞; note 1
−
22
25
mA
Pout
output power
TDA7053A
THD = 10%
1.0
0.5
1.1
−
−
W
W
TDA7053AT
0.55
THD
total harmonic distortion
TDA7053A
P
out = 0.5 W
−
−
39.5
1
0.3
0.3
40.5
−
1
%
TDA7053AT
Pout = 0.25 W
1
%
Gv
voltage gain
41.5
−
dB
V
VI(rms)
Vno
B
input signal handling (RMS value) Gv = 0 dB; THD < 1%
noise output voltage
bandwidth
fi = 500 kHz; note 2
at −1 dB
−
−
210
note 3
38
−
−
−
200
25
−
µV
Hz
dB
mV
kΩ
dB
dB
dB
SVRR
VO(os)
Zi
supply voltage ripple rejection
DC output offset voltage
input impedance (pins 4 and 6)
channel separation
note 4
34
−
15
40
−
V16 − V13 and V12 − V9
0
20
αcs
Gv
RS = 5 kΩ
note 5
−
−
−
channel unbalance
1
G1 = 0 dB; note 6
−
1
Mute position; V2,8 = 0.4 V ±30 mV
VO
output voltage in mute position
Vi = 1.0 V; note 7
V2 = V8 = 0 V
−
30
40
µV
DC volume control
GC
IDC
gain control
volume control current
68.5
73.5
−
−30
dB
−20
−25
µA
Notes
1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being
equal to the DC output offset voltage divided by RL.
2. The noise output voltage (RMS value) at fi = 500 kHz is measured with RS = 0 Ω and bandwidth = 5 kHz.
3. 20 Hz to 300 kHz (typical).
4. The ripple rejection is measured with RS = 0 Ω and fi = 100 Hz to 10 kHz. The ripple voltage of 200 mV (RMS value)
is applied to the positive supply rail.
5. The channel unbalance is measured with VDC1 = VDC2
6. The channel unbalance at G1 = 0 dB is measured with VDC1 = VDC2
7. The noise output voltage (RMS value) is measured with RS = 5 kΩ unweighted.
.
.
1997 Jul 15
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Philips Semiconductors
Product specification
Stereo BTL audio output amplifier with DC
volume control
TDA7053A
MBG671
MBG672
12
40
handbook, halfpage
handbook, halfpage
I
q
THD
(%)
(mA)
30
8
4
0
(1)
(2)
(3)
20
10
0
0
−2
−1
10
10
1
10
4
8
12
16
20
P
(W)
out
V
(V)
P
(1) VP = 4.5 V.
(2)
VP = 6 V; RL = 8 Ω.
(3) VP = 12 V; RL = 25 Ω.
Fig.3 Quiescent current as a function of supply
voltage.
Fig.4 THD as a function of output power.
MBG669
MBG670
2.5
10
handbook, halfpage
handbook, halfpage
P
out
(W)
THD
(%)
2.0
8
6
4
(1)
(2) (3)
1.5
1.0
0.5
(2)
2
(1)
0
0
0
10
−2
−1
2
4
8
12
16
10
1
10
10
V
(V)
f (kHz)
P
(1) RL = 8 Ω.
(2) RL = 16 Ω.
(3) RL = 25 Ω.
(1) Gv = 30 dB; Po = 0.1 W.
(2) Gv = 40 dB; Po = 0.1 W.
Fig.6 Output power as a function of supply
voltage.
Fig.5 THD as a function of frequency.
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Philips Semiconductors
Product specification
Stereo BTL audio output amplifier with DC
volume control
TDA7053A
MBG668
MBG667
4
80
handbook, halfpage
handbook, halfpage
G
v
P
diss
(dB)
40
(W)
3
(1)
(2)
(3)
0
−40
−80
2
1
0
0
−120
4
8
12
16
0
0.4
0.8
1.2
1.6
V
2.0
(V)
V
(V)
P
VC
(1) RL = 8 Ω.
(2)
RL = 16 Ω.
(3) RL = 25 Ω.
Fig.8 Voltage gain as a function of volume control
voltage.
Fig.7 Total worst case power dissipation as a
function of supply voltage.
MBG664
MBG663
1
0
handbook, halfpage
handbook, halfpage
SVRR
(dB)
V
no
(mV)
−20
(1)
−1
10
−40
−60
(2)
−2
−80
10
10
−2
−1
2
0
0.4
0.8
1.2
1.6
V
2.0
(V)
10
1
10
10
f (kHz)
VC
(1) VDC = 1.4 V;Vripple = 0.2 V.
(2) VDC = 0.4 V; Vripple = 0.2 V.
f = 22 Hz to 22 kHz.
Fig.9 Noise voltage as a function of volume
control voltage.
Fig.10 SVRR as a function of frequency.
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Philips Semiconductors
Product specification
Stereo BTL audio output amplifier with DC
volume control
TDA7053A
MBG666
MBG665
30
2.0
handbook, halfpage
handbook, halfpage
I
VC
V
in
(µA)
(V)
20
1.6
10
0
1.2
0.8
−10
−20
0.4
−30
0
0
0
0.4
0.8
1.2
1.6
V
2.0
(V)
4
8
12
16
20
V
(V)
P
VC
THD = 1 %.
Fig.12 Volume control current as a function of
volume control voltage.
Fig.11 Input signal handling.
The maximum input signal voltage is measured at
THD = 1% at the output with a voltage gain of 0 dB.
APPLICATION INFORMATION
The application diagram is illustrated in Fig.13.
To avoid instabilities and too high distortion, the input
ground and power ground must be separated as far as
possible and connected as close as possible to the IC.
Test conditions
T
V
amb = 25 °C unless otherwise specified; VP = 6 V;
The DC volume control can be applied in several ways.
Two possible circuits are shown below the main
application diagram. The circuits at the control pin will
influence the switch-on and switch-off behaviour and the
maximum voltage gain.
DC = 1.4 V; fi = 1 kHz; RL = 8 Ω.
The quiescent current has been measured without load
impedance.
The output power as a function of the supply voltage has
been measured at THD = 10%. The maximum output
power is limited by the maximum power dissipation and the
maximum available output current.
For single-end applications the output peak current must
not exceed 100 mA. At higher output currents the
short-circuit protection (MCL) will be active.
1997 Jul 15
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Philips Semiconductors
Product specification
Stereo BTL audio output amplifier with DC
volume control
TDA7053A
V
= 6 V
P
(1)
220 µF
100 nF
5
TDA7053A
16
+
470 nF
I + i
4
2
input 1
R = 5 kΩ
(2)
s
I − i
13
−
−
TEMPERATURE
MCL
PROTECTION
STABILIZER
12
9
470 nF
I − i
6
8
input 2
(2)
I + i
DC-
volume
+
R
= 5 kΩ
s
7
10
14
signal
ground
power
ground
V
P
= 6 V
56 kΩ
2, 8
volume
control
volume
control
2, 8
maximum voltage
gain 34 dB
maximum voltage
gain 40 dB
1 µF
1 MΩ
1 µF
22 kΩ
MBG673
(1) This capacitor can be omitted if the 220 µF electrolytic capacitor is connected close to pin 5.
(2) RL = 8 Ω.
Fig.13 Test and application diagram.
10
1997 Jul 15
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Philips Semiconductors
Product specification
Stereo BTL audio output amplifier with DC
volume control
TDA7053A
PACKAGE OUTLINES
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
SOT38-1
D
M
E
A
2
A
A
1
L
c
e
w M
Z
b
1
(e )
1
b
16
9
M
H
pin 1 index
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
Z
A
A
A
(1)
(1)
1
2
w
UNIT
mm
b
b
c
D
E
e
e
L
M
M
H
1
1
E
max.
max.
min.
max.
1.40
1.14
0.53
0.38
0.32
0.23
21.8
21.4
6.48
6.20
3.9
3.4
8.25
7.80
9.5
8.3
4.7
0.51
3.7
2.54
0.10
7.62
0.30
0.254
0.01
2.2
0.021
0.015
0.013
0.009
0.86
0.84
0.32
0.31
0.055
0.045
0.26
0.24
0.15
0.13
0.37
0.33
inches
0.19
0.020
0.15
0.087
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-10-02
95-01-19
SOT38-1
050G09
MO-001AE
1997 Jul 15
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Philips Semiconductors
Product specification
Stereo BTL audio output amplifier with DC
volume control
TDA7053A
SO16: plastic small outline package; 16 leads; body width 7.5 mm
SOT162-1
D
E
A
X
c
H
v
M
A
E
y
Z
16
9
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
8
detail X
e
w
M
b
p
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
max.
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
θ
1
2
3
p
E
p
Z
0.30
0.10
2.45
2.25
0.49
0.36
0.32
0.23
10.5
10.1
7.6
7.4
10.65
10.00
1.1
0.4
1.1
1.0
0.9
0.4
mm
2.65
0.25
0.01
0.25
0.1
0.25
0.01
1.27
0.050
1.4
8o
0o
0.012 0.096
0.004 0.089
0.019 0.013 0.41
0.014 0.009 0.40
0.30
0.29
0.419
0.394
0.043 0.043
0.016 0.039
0.035
0.016
inches 0.10
0.055
0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-01-24
97-05-22
SOT162-1
075E03
MS-013AA
1997 Jul 15
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Philips Semiconductors
Product specification
Stereo BTL audio output amplifier with DC
volume control
TDA7053A
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
WAVE SOLDERING
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
DIP
SOLDERING BY DIPPING OR BY WAVE
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
REPAIRING SOLDERED JOINTS
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
REPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
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Philips Semiconductors
Product specification
Stereo BTL audio output amplifier with DC
volume control
TDA7053A
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
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Philips Semiconductors
Product specification
Stereo BTL audio output amplifier with DC
volume control
TDA7053A
NOTES
1997 Jul 15
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Slovakia: see Austria
Czech Republic: see Austria
Slovenia: see Italy
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,
Tel. +45 32 88 2636, Fax. +45 31 57 0044
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. +27 11 470 5911, Fax. +27 11 470 5494
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615800, Fax. +358 9 61580920
South America: Rua do Rocio 220, 5th floor, Suite 51,
04552-903 São Paulo, SÃO PAULO - SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 829 1849
France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 3 301 6312, Fax. +34 3 301 4107
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 632 2000, Fax. +46 8 632 2745
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2686, Fax. +41 1 481 7730
Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. +90 212 279 2770, Fax. +90 212 282 6707
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Uruguay: see South America
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381
Middle East: see Italy
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Internet: http://www.semiconductors.philips.com
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
© Philips Electronics N.V. 1997
SCA55
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
547027/1200/04/pp16
Date of release: 1997 Jul 15
Document order number: 9397 750 02591
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