Philips Stereo Amplifier TDA6107AJF User Manual
TDA6107AJF  
Triple video output amplifier  
Rev. 02 — 28 April 2005  
Product data sheet  
1. General description  
The TDA6107AJF contains three video output amplifiers which are intended to drive the  
three cathodes of a color CRT. The device is contained in a plastic DIL-bent-SIL 9-pin  
medium power (DBS9MPF) package, and uses high-voltage DMOS technology.  
To obtain maximum performance, the amplifier should be used with black-current control.  
2. Features  
■ Typical bandwidth of 5.5 MHz for an output signal of 60 V (p-p)  
■ High slew rate of 900 V/µs  
■ No external components required  
■ Very simple application  
■ Single supply voltage of 200 V  
■ Internal reference voltage of 2.5 V  
■ Fixed gain of 81  
■ Black-Current Stabilization (BCS) circuit with voltage window from 1.8 V to 6 V and  
current window from +100 µA to −10 mA  
■ Thermal protection  
■ Internal protection against positive flashover discharges appearing on the CRT  
3. Ordering information  
Table 1:  
Ordering information  
Type number  
Package  
Name  
Description  
Version  
TDA6107AJF  
DBS9MPF plastic DIL-bent-SIL medium power package with fin; 9 leads  
SOT111-1  
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TDA6107AJF  
Philips Semiconductors  
Triple video output amplifier  
5. Pinning information  
5.1 Pinning  
1
2
3
4
5
6
7
8
9
V
V
V
i(1)  
i(2)  
i(3)  
GND  
I
TDA6107AJF  
om  
V
DD  
V
V
V
oc(3)  
oc(2)  
oc(1)  
001aac587  
Fig 2. Pin configuration  
5.2 Pin description  
Table 2:  
Symbol  
Vi(1)  
Pin description  
Pin  
1
Description  
inverting input 1  
inverting input 2  
inverting input 3  
ground (fin)  
Vi(2)  
2
Vi(3)  
3
GND  
Iom  
4
5
black-current measurement output  
supply voltage  
VDD  
6
Voc(3)  
Voc(2)  
Voc(1)  
7
cathode output 3  
cathode output 2  
cathode output 1  
8
9
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Product data sheet  
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Triple video output amplifier  
6. Internal circuitry  
V
DD  
6
GND  
4
to cascode  
stage  
to black-current  
measurement circuit  
TDA6107AJF  
1, 2, 3  
(1)  
esd  
from  
input  
circuit  
flash  
7, 8, 9  
esd  
esd  
esd  
V
to black-current  
bias  
from  
input  
circuit  
measurement circuit  
from  
control  
circuit  
5
from black-  
current  
esd  
measurement  
circuit  
esd  
6.8 V  
from  
control  
circuit  
to black-current  
measurement circuit  
to black-current  
measurement circuit  
mce458  
(1) All pins have an energy protection for positive or negative overstress situations.  
Fig 3. Internal pin configuration  
7. Limiting values  
Table 3:  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages measured with respect to ground; currents  
as specified in Figure 9; unless otherwise specified.  
Symbol  
VDD  
Parameter  
Conditions  
Min  
Max  
250  
12  
Unit  
V
supply voltage  
0
0
0
-
Vi  
input voltage at pins Vi(1), Vi(2) and Vi(3)  
measurement output voltage  
V
Vom  
6
V
|Iom(mean)  
|
absolute value of mean current of  
Voc = 0 V to VDD  
;
5.6  
mA  
measurement output (for three channels)  
Vom = 1.8 V to 6 V  
Voc  
Tstg  
Tj  
cathode output voltage  
storage temperature  
0
VDD  
V
−55  
+150  
+150  
±3000  
±300  
°C  
°C  
V
junction temperature  
−20  
Vesd  
electrostatic discharge voltage  
Human Body Model (HBM)  
Machine Model (MM)  
-
-
V
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Product data sheet  
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Triple video output amplifier  
8. Thermal characteristics  
Table 4:  
Symbol  
Rth(j-a)  
Thermal characteristics  
Parameter  
Conditions  
Typ  
56  
Unit  
K/W  
K/W  
thermal resistance from junction to ambient in free air  
thermal resistance from junction to fin  
[1]  
Rth(j-fin)  
11  
[1] An external heatsink is necessary; see Application Note AN10227-01.  
mbh989  
8
P
tot  
(W)  
(1)  
6
4
2
(2)  
0
−40  
0
40  
80  
120  
T
160  
(°C)  
amb  
(1) Infinite heatsink.  
(2) No heatsink.  
Fig 4. Power derating curves  
8.1 Thermal protection  
The internal thermal protection circuit gives a decrease of the slew rate at high  
temperatures: 10 % decrease at 130 °C and 30 % decrease at 145 °C (typical values on  
the spot of the thermal protection circuit).  
outputs  
5 K/W  
thermal protection circuit  
6 K/W  
mgk279  
fin  
Fig 5. Equivalent thermal resistance network  
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Product data sheet  
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Triple video output amplifier  
9. Characteristics  
Table 5:  
Operating range: Tj = −20 °C to +150 °C; VDD = 180 V to 210 V; test conditions: Tamb = 25 °C; VDD = 200 V;  
oc(1) = Voc(2) = Voc(3) = 1⁄2VDD; CL = 10 pF (CL consists of parasitic and cathode capacitance); Rth(h-a) = 18 K/W; measured in  
test circuit of Figure 9; unless otherwise specified.  
Characteristics  
V
Symbol  
Iq  
Parameter  
Conditions  
Min  
5.6  
-
Typ  
6
Max  
7.6  
-
Unit  
mA  
V
quiescent supply current  
Vref(int)  
internal reference voltage (input  
stage)  
2.5  
Ri  
input resistance  
-
2.1  
81  
0
-
kΩ  
G
gain of amplifier  
73  
89  
∆G  
gain difference  
−4.2  
+4.2  
[1]  
PSRR  
αct(DC)  
power supply rejection ratio  
DC crosstalk between channels  
f < 50 kHz  
-
-
55  
−50  
-
-
dB  
dB  
Measurement output pin Iom; Voc = Voc(min) to Voc(max)  
Iom(offset)  
offset current of measurement  
output (for three channels)  
Ioc = 0 µA;  
om = 1.8 V to 6 V  
−50  
-
+50  
−1.1  
−1.1  
µA  
V
∆Iom/∆Ioc  
linearity of current transfer  
(for three channels)  
Ioc = −100 µA to +100 µA;  
om = 1.8 V to 6 V  
−0.9  
−0.9  
−1.0  
−1.0  
V
Ioc = −100 µA to +10 mA;  
om = 1.8 V to 4 V  
V
Output pins Voc(1), Voc(2), Voc(3)  
Voc(DC) DC output voltage  
Ii = 0 µA  
76  
87  
0
97  
+5  
V
V
∆Voc(DC)(offset) differential DC output offset  
Ii = 0 µA  
−5  
voltage between two output pins  
∆Voc(T)  
output voltage temperature drift  
-
-
10  
0
-
-
mV/K  
mV/K  
∆Voc(T)(offset)  
differential output offset voltage  
temperature drift between two  
output pins  
Ioc(max)  
Voc(min)  
Voc(max)  
BS  
maximum peak output current  
minimum output voltage  
maximum output voltage  
small signal bandwidth  
large signal bandwidth  
Voc = 50 V to VDD − 50 V  
Vi = 4.5 V; at Ioc = 0 mA  
Vi = 0.5 V; at Ioc = 0 mA  
Voc = 60 V (p-p)  
-
20  
-
-
mA  
V
[2]  
[2]  
-
10  
-
VDD − 15  
-
V
-
-
-
5.5  
4.5  
60  
-
MHz  
MHz  
ns  
BL  
Voc = 100 V (p-p)  
-
[3]  
[3]  
tco(p)  
cathode output propagation time Voc = 100 V (p-p) square  
50 % input to 50 % output  
-
wave  
∆tco(p)  
difference in cathode output  
Voc = 100 V (p-p) square  
−10  
0
+10  
ns  
propagation time 50 % input to wave  
50 % output (between two  
output pins)  
[3]  
[3]  
toc(r)  
toc(f)  
cathode output rise time  
10 % output to 90 % output  
Voc = 50 V to 150 V square  
wave  
67  
67  
91  
91  
113  
113  
ns  
ns  
cathode output fall time  
90 % output to 10 % output  
Voc = 150 V to 50 V square  
wave  
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Product data sheet  
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Philips Semiconductors  
Triple video output amplifier  
Table 5:  
Operating range: Tj = −20 °C to +150 °C; VDD = 180 V to 210 V; test conditions: Tamb = 25 °C; VDD = 200 V;  
oc(1) = Voc(2) = Voc(3) = 1⁄2VDD; CL = 10 pF (CL consists of parasitic and cathode capacitance); Rth(h-a) = 18 K/W; measured in  
test circuit of Figure 9; unless otherwise specified.  
Characteristics …continued  
V
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
[3]  
[3]  
[3]  
tst  
settling time input (50 %) to  
output (99 % to 101 %)  
Voc = 100 V (p-p) square  
wave  
-
-
350  
ns  
SR  
Ov  
slew rate between  
50 V to VDD − 50 V  
Vi = 2.5 V (p-p) square  
wave  
-
-
900  
2
-
-
V/µs  
cathode output voltage  
overshoot  
Voc = 100 V (p-p) square  
wave  
%
[1] The ratio of the change in supply voltage to the change in input voltage when there is no change in output voltage.  
[2] See Figure 6 for the typical DC-to-DC transfer of Vi to Voc  
.
[3] f < 1 MHz; tr = tf = 40 ns [pins Vi(1), Vi(2) and Vi(3)]; see Figure 7 and Figure 8.  
mce455  
200  
V
oc  
(V)  
160  
120  
80  
40  
0
0
1
2
3
4
V (V)  
i
Fig 6. Typical DC-to-DC transfer of Vi to Voc  
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Triple video output amplifier  
2.96  
V
i
(V)  
2.34  
t
1.73  
t
st  
O
(in %)  
v
151  
149  
150  
140  
V
oc  
(V)  
100  
60  
50  
t
t
oc(r)  
t
mce477  
co(p)  
Fig 7. Output voltage [pins Voc(1), Voc(2) and Voc(3)] rising edge as a function of the AC input signal  
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Product data sheet  
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Philips Semiconductors  
Triple video output amplifier  
2.96  
V
i
(V)  
2.34  
t
1.73  
t
st  
150  
140  
V
oc  
(V)  
100  
O
(in %)  
v
51  
60  
50  
49  
t
t
oc(f)  
t
co(p)  
mce476  
Fig 8. Output voltage [pins Voc(1), Voc(2) and Voc(3)] falling edge as a function of the AC  
input signal  
10. Application information  
10.1 Cathode output  
The cathode output is protected against peak currents (caused by positive voltage peaks  
during high-resistance flash) of 3 A maximum with a charge content of 100 µC. External  
protection against higher currents is described in Application note AN10227-01.  
The cathode is also protected against peak currents (caused by positive voltage peaks  
during low-resistance flash) of 6 A maximum with a charge content of 100 nC. External  
protection against higher currents is described in Application note AN10227-01.  
The DC voltage of pin VDD must be within the operating range of 180 V to 210 V during  
the peak currents.  
10.2 Flashover protection  
The TDA6107AJF incorporates protection diodes against CRT flashover discharges that  
clamp the cathodes output voltage up to a maximum of VDD + Vd.  
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Triple video output amplifier  
To limit the diode current an external 1.5 kΩ carbon high-voltage resistor in series with the  
cathode output and a 2 kV spark gap are needed (for this resistor value, the CRT has to  
be connected to the main PCB).  
VDD must be decoupled to GND:  
1. With a capacitor > 20 nF with good HF behavior (e.g. foil); this capacitor must be  
placed as close as possible to pins VDD and GND and must be within 5 mm.  
2. With a capacitor > 3.3 µF on the picture tube base print, depending on the CRT size.  
10.3 Switch-off behavior  
The switch-off behavior of the TDA6107AJF is controllable. This is because the output  
pins of the TDA6107AJF are still under control of the input pins for low power supply  
voltages (approximately 30 V and higher).  
10.4 Bandwidth  
The addition of the flash resistor produces a decreased bandwidth and increases the rise  
and fall times.  
10.5 Dissipation  
A distinction must first be made between static dissipation (independent of frequency) and  
dynamic dissipation (proportional to frequency).  
The static dissipation of the TDA6107AJF is due to voltage supply currents and load  
currents in the feedback network and CRT.  
The static dissipation Pstat equals: Pstat = VDD × IDD + 3 × Voc × Ioc  
Where:  
VDD = supply voltage  
IDD = supply current  
Voc = DC value of cathode output voltage  
Ioc = DC value of cathode output current  
The dynamic dissipation Pdyn equals: Pdyn = 3 × VDD × (CL + Cint) × fi × Voc(p-p) ×δ  
Where:  
CL = load capacitance  
Cint = internal load capacitance (≈4 pF)  
fi = input frequency  
Voc(p-p) = cathode output voltage (peak-to-peak value)  
δ = non-blanking duty cycle  
The TDA6107AJF must be mounted on the picture tube base print to minimize the load  
capacitance.  
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Triple video output amplifier  
11. Test information  
V
DD  
C7  
C8  
20 nF  
10 µF  
J1  
6
R
C1  
f
f
f
R
i
R
i
R
i
V
V
V
22 µF  
i(1)  
i(2)  
i(3)  
V
I
1
2
3
of  
V
oc(1)  
V
oc(2)  
V
oc(3)  
9
C2  
1
R
a
R
a
R
a
C10  
6.8 pF  
R1  
2 MΩ  
om  
22 nF  
C9  
3.2 pF  
probe 1  
probe 2  
probe 3  
C11  
136 pF  
R2  
100 kΩ  
J2  
R
C3  
22 µF  
V
I
of  
8
C4  
2
C13  
6.8 pF  
R3  
2 MΩ  
om  
22 nF  
C12  
3.2 pF  
C14  
136 pF  
R4  
100 kΩ  
J3  
R
C5  
22 µF  
V
of  
7
C6  
3
C16  
6.8 pF  
R5  
2 MΩ  
22 nF  
C15  
3.2 pF  
C17  
R6  
136 pF  
100 kΩ  
VIP  
REFERENCE  
I
5
om  
TDA6107AJF  
V
om  
4
4 V  
GND  
mce459  
Current sources J1, J2 and J3 must be adjusted so that the DC output voltage of pins Voc(1), Voc(2) and Voc(3) is set to 100 V.  
Fig 9. Test circuit  
11.1 Quality information  
The General Quality Specification for Integrated Circuits, SNW-FQ-611 is applicable.  
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Triple video output amplifier  
12. Package outline  
DBS9MPF: plastic DIL-bent-SIL medium power package with fin; 9 leads  
SOT111-1  
D
D
1
A
2
q
P
P
1
Q
A
3
q
2
q
1
A
A
4
E
pin 1 index  
c
L
1
9
e
2
b
e
Z
b
w
M
2
θ
b
1
0
5
10 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
(1)  
Z
A
max.  
2
(1)  
(1)  
UNIT  
A
A
A
b
b
b
c
D
D
E
e
e
L
P
P
Q
q
q
q
2
w
θ
3
4
1
2
1
2
1
1
max.  
o
o
18.5  
17.8  
8.7 15.5 1.40 0.67 1.40 0.48 21.8 21.4 6.48  
8.0 15.1 1.14 0.50 1.14 0.38 21.4 20.7 6.20  
3.9 2.75 3.4 1.75 15.1  
3.4 2.50 3.2 1.55 14.9  
65  
55  
4.4 5.9  
4.2 5.7  
2.54 2.54  
mm  
3.7  
0.25  
1
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
95-03-11  
03-03-12  
SOT111-1  
Fig 10. Package outline SOT 111-1 (DBS9MPF)  
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13. Handling information  
Inputs and outputs are protected against electrostatic discharge in normal handling.  
However, to be completely safe, it is desirable to take normal precautions appropriate to  
handling integrated circuits.  
14. Soldering  
14.1 Introduction to soldering through-hole mount packages  
This text gives a brief insight to wave, dip and manual soldering. A more in-depth account  
of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages  
(document order number 9398 652 90011).  
Wave soldering is the preferred method for mounting of through-hole mount IC packages  
on a printed-circuit board.  
14.2 Soldering by dipping or by solder wave  
Driven by legislation and environmental forces the worldwide use of lead-free solder  
pastes is increasing. Typical dwell time of the leads in the wave ranges from  
3 seconds to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb  
or Pb-free respectively.  
The total contact time of successive solder waves must not exceed 5 seconds.  
The device may be mounted up to the seating plane, but the temperature of the plastic  
body must not exceed the specified maximum storage temperature (Tstg(max)). If the  
printed-circuit board has been pre-heated, forced cooling may be necessary immediately  
after soldering to keep the temperature within the permissible limit.  
14.3 Manual soldering  
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the  
seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is  
less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is  
between 300 °C and 400 °C, contact may be up to 5 seconds.  
14.4 Package related soldering information  
Table 6:  
Suitability of through-hole mount IC packages for dipping and wave soldering  
methods  
Package  
Soldering method  
Dipping  
Wave  
CPGA, HCPGA  
−
suitable  
DBS, DIP, HDIP, RDBS, SDIP, SIL  
PMFP[2]  
suitable  
suitable[1]  
−
not suitable  
[1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit  
board.  
[2] For PMFP packages hot bar soldering or manual soldering is suitable.  
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15. Revision history  
Table 7:  
Revision history  
Document ID  
TDA6107AJF_2  
Modifications:  
Release date Data sheet status  
20050428 Product data sheet  
Change notice Doc. number  
Supersedes  
-
9397 750 14728 TDA6107AJF_1  
• The format of this data sheet has been redesigned to comply with the new presentation and  
information standard of Philips Semiconductors.  
• Changed data sheet status to product data sheet  
TDA6107AJF_1  
20030919  
Preliminary specification -  
9397 750 11632  
-
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16. Data sheet status  
Level Data sheet status[1] Product status[2] [3]  
Definition  
I
Objective data  
Development  
This data sheet contains data from the objective specification for product development. Philips  
Semiconductors reserves the right to change the specification in any manner without notice.  
II  
Preliminary data  
Qualification  
This data sheet contains data from the preliminary specification. Supplementary data will be published  
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in  
order to improve the design and supply the best possible product.  
III  
Product data  
Production  
This data sheet contains data from the product specification. Philips Semiconductors reserves the  
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant  
changes will be communicated via a Customer Product/Process Change Notification (CPCN).  
[1]  
[2]  
Please consult the most recently issued data sheet before initiating or completing a design.  
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at  
URL http://www.semiconductors.philips.com.  
[3]  
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.  
17. Definitions  
18. Disclaimers  
Short-form specification — The data in a short-form specification is  
extracted from a full data sheet with the same type number and title. For  
detailed information see the relevant data sheet or data handbook.  
Life support — These products are not designed for use in life support  
appliances, devices, or systems where malfunction of these products can  
reasonably be expected to result in personal injury. Philips Semiconductors  
customers using or selling these products for use in such applications do so  
at their own risk and agree to fully indemnify Philips Semiconductors for any  
damages resulting from such application.  
Limiting values definition — Limiting values given are in accordance with  
the Absolute Maximum Rating System (IEC 60134). Stress above one or  
more of the limiting values may cause permanent damage to the device.  
These are stress ratings only and operation of the device at these or at any  
other conditions above those given in the Characteristics sections of the  
specification is not implied. Exposure to limiting values for extended periods  
may affect device reliability.  
Right to make changes — Philips Semiconductors reserves the right to  
make changes in the products - including circuits, standard cells, and/or  
software - described or contained herein in order to improve design and/or  
performance. When the product is in full production (status ‘Production’),  
relevant changes will be communicated via a Customer Product/Process  
Change Notification (CPCN). Philips Semiconductors assumes no  
responsibility or liability for the use of any of these products, conveys no  
license or title under any patent, copyright, or mask work right to these  
products, and makes no representations or warranties that these products are  
free from patent, copyright, or mask work right infringement, unless otherwise  
specified.  
Application information — Applications that are described herein for any  
of these products are for illustrative purposes only. Philips Semiconductors  
make no representation or warranty that such applications will be suitable for  
the specified use without further testing or modification.  
19. Contact information  
For additional information, please visit: http://www.semiconductors.philips.com  
For sales office addresses, send an email to: [email protected]  
9397 750 14728  
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.  
Product data sheet  
Rev. 02 — 28 April 2005  
15 of 16  
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TDA6107AJF  
Philips Semiconductors  
Triple video output amplifier  
20. Contents  
1
2
3
4
General description . . . . . . . . . . . . . . . . . . . . . . 1  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Ordering information. . . . . . . . . . . . . . . . . . . . . 1  
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
5
5.1  
5.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3  
6
Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . . 4  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Thermal characteristics. . . . . . . . . . . . . . . . . . . 5  
Thermal protection . . . . . . . . . . . . . . . . . . . . . . 5  
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 6  
7
8
8.1  
9
10  
Application information. . . . . . . . . . . . . . . . . . . 9  
Cathode output . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Flashover protection . . . . . . . . . . . . . . . . . . . . . 9  
Switch-off behavior . . . . . . . . . . . . . . . . . . . . . 10  
Bandwidth. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
10.1  
10.2  
10.3  
10.4  
10.5  
11  
11.1  
12  
Test information. . . . . . . . . . . . . . . . . . . . . . . . 11  
Quality information . . . . . . . . . . . . . . . . . . . . . 11  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12  
Handling information. . . . . . . . . . . . . . . . . . . . 13  
13  
14  
14.1  
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Introduction to soldering through-hole mount  
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Soldering by dipping or by solder wave . . . . . 13  
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 13  
Package related soldering information . . . . . . 13  
14.2  
14.3  
14.4  
15  
16  
17  
18  
19  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 14  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 15  
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Contact information . . . . . . . . . . . . . . . . . . . . 15  
© Koninklijke Philips Electronics N.V. 2005  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior  
written consent of the copyright owner. The information presented in this document does  
not form part of any quotation or contract, is believed to be accurate and reliable and may  
be changed without notice. No liability will be accepted by the publisher for any  
consequence of its use. Publication thereof does not convey nor imply any license under  
patent- or other industrial or intellectual property rights.  
Date of release: 28 April 2005  
Document number: 9397 750 14728  
Published in The Netherlands  
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