INTEGRATED CIRCUITS
DATA SHEET
TDA6106Q
Video output amplifier
1997 Mar 03
Product specification
File under Integrated Circuits, IC02
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Philips Semiconductors
Product specification
Video output amplifier
TDA6106Q
PINNING
SYMBOL
PIN
DESCRIPTION
not connected
handbook, halfpage
n.c.
n.c.
Vin
1
2
3
4
5
6
7
8
9
n.c.
n.c.
1
2
3
4
5
6
7
8
9
not connected
inverting input voltage
ground, substrate
V
in
GND
Iom
GND
black current measurement output
supply voltage
I
TDA6106Q
om
VDD
n.c.
Voc
Vof
V
not connected
DD
n.c.
cathode output voltage
feedback output voltage
V
oc
V
of
MBG342
Fig.2 Pin configuration.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134); voltages with respect to pin 4 (ground) unless
otherwise specified; currents specified as in Fig.1.
SYMBOL
PARAMETER
supply voltage
CONDITIONS
MIN.
MAX.
250
UNIT
VDD
Vin
0
0
0
0
0
0
V
inverting input voltage
8
V
V
V
V
A
Vom
Voc
Vof
black current measurement output voltage
cathode DC output voltage
feedback output voltage
6
VDD
VDD
5
Ioc(l)
low non-repetitive peak cathode output
current
flashover discharge = 100 µC;
note 1
Ioc(h)
high non-repetitive peak cathode output
current
flashover discharge = 100 nC;
note 2
0
10
A
Pmax
Tstg
Tj
maximum power dissipation
storage temperature
0
tbf
W
°C
°C
V
−55
−20
−2000
−300
+150
+150
+2000
+300
junction temperature
Vesd
electrostatic discharge
note 3
note 4
V
Notes
1. The cathode output is protected against peak currents (caused by positive voltage peaks during high-resistance
flash) of 5 A maximum with a charge content of 100 µC.
2. The cathode output is also protected against peak currents (caused by positive voltage peaks during low-resistance
flash) of 10 A maximum with a charge content of 100 nC.
3. Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 kΩ resistor.
4. Machine model: equivalent to discharging a 200 pF capacitor through a 0 Ω resistor.
1997 Mar 03
3
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Philips Semiconductors
Product specification
Video output amplifier
TDA6106Q
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling MOS devices (see “Handling MOS Devices”).
QUALITY SPECIFICATION
Quality specification “SNW-FQ-611 part E” is applicable, except for ESD Human body model see Chapter “Limiting
values”, and can be found in the “Quality reference handbook” (ordering number 9397 750 00192).
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER(1)
thermal resistance from junction to ambient in free air
thermal resistance from junction to case
VALUE
UNIT
Rth j-a
Rth j-c
56
12
K/W
K/W
Note
1. External heatsink not required.
CHARACTERISTICS
Operating range: Tamb = −20 to +65 °C; VDD = 180 to 210 V (see note 1), Vom = 1.4 to 6 V.
Test conditions: Tamb = 25 °C; VDD = 200 V; Vom = 4 V; CL = 10 pF (CL consists of parasitic and cathode capacitance);
measured in test circuit of Fig.5; unless otherwise specified.
SYMBOL
IDD
PARAMETER
quiescent voltage supply current
input bias current (pin 3)
CONDITIONS
VocDC = 100 V
VocDC = 100 V
MIN.
2.8
TYP.
3.0
MAX. UNIT
3.3
20
−
mA
µA
V
Ibias
0
−
2.5
0
Vint
internal reference voltage input stage VocDC = 100 V
−
−10
Iom(os)
offset current of black current
measurement output
Ioc = 0 µA;
Vin = 1.5 to +3.5 V;
Vom = 1.4 to 6 V
+10
µA
∆VTint
temperature drift of internal
reference voltage input stage
VocDC = 100 V
−
0.5
1.0
−
mV/K
linearity of current transfer
Ioc = −10 µA to 3 mA;
0.9
1.1
∆Iom
------------
Vin = 1.5 to +3.5 V;
Vom = 1.4 to 6 V
∆Ioc
Iof(max)
Voc(min)
Voc(max)
GB
maximum peak output current (pin 9) Voc = 20 V to VDD −30 V
−
−
25
7
−
12
−
mA
V
minimum output voltage (pin 8)
maximum output voltage (pin 8)
Vin = 3.5 V
Vin = 1.5 V
VDD − 14 VDD − 10
−
V
gain bandwidth product of open-loop f = 500 kHz;
0.52
−
GHz
gain Vos/Vi, dm
VocDC = 100 V
BWS
BWL
small signal bandwidth
VocAC = 60 V (p-p);
VocDC = 100 V
5
6
−
−
MHz
MHz
large signal bandwidth
VocAC = 100 V (p-p);
VocDC = 100 V
4.7
5.7
1997 Mar 03
4
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Philips Semiconductors
Product specification
Video output amplifier
TDA6106Q
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX. UNIT
tpd
cathode output propagation delay
time 50% input to 50% output
Voc = 50 to 150 V square
wave; f < 1 MHz;
38
49
60
ns
t
rin = tfin = 40 ns;
see Figs 3 and 4
cathode output rise time 10% output Voc = 50 to 150 V square
tr
tf
62
62
−
74
74
−
87
ns
ns
ns
to 90% output
wave; f < 1 MHz;
tfin = 40 ns; see Fig.4
cathode output fall time 90% output to Voc = 150 to 50 V square
87
10% output
wave; f < 1 MHz;
rin = 40 ns; see Fig.4
t
ts
settling time 50% input to
(99% < output < 101%)
Voc = 50 to 150 V square
wave; f < 1 MHz;
350
trin = tfin = 40 ns;
see Figs 3 and 4
SR
OV
slew rate between 50 and 150 V
cathode output voltage overshoot
Vin = 2 V (p-p) square
wave; f < 1 MHz;
−
−
1200
1
−
−
V/µs
trin = tfin = 40 ns
Voc = 50 to 150 V square
wave; f < 1 MHz;
%
trin = tfin = 40 ns;
see Figs 3 and 4
PSRR
power supply rejection ratio
f < 50 kHz; note 2
−
60
−
dB
Notes
1. The rating of supply voltage is 250 V, but because of flash the maximum operating range for supply voltage is 210 V.
2. PSSR: The ratio of the change in supply voltage to the change in input voltage when there is no change in output
voltage.
1997 Mar 03
5
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Philips Semiconductors
Product specification
Video output amplifier
TDA6106Q
x
V
i
0
x
t
t
s
overshoot (in %)
151
149
150
140
V
oc
100
60
50
t
t
r
MGA974
t
pd
Fig.3 Output voltage (pin 8 rising edge) as a function of AC input signal.
1997 Mar 03
6
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Philips Semiconductors
Product specification
Video output amplifier
TDA6106Q
x
V
i
0
x
t
t
s
150
140
oc
V
100
overshoot (in %)
51
60
50
49
t
t
f
MGA975
t
pd
Fig.4 Output voltage (pin 8 falling edge) as a function of AC input signal.
VDD to GND must be decoupled:
Flashover protection
1. With a capacitor larger than 20 nF with good HF
The TDA6106Q incorporates a protection diode against
CRT flashover discharges that clamp the cathode output
voltage to a maximum of VDD + Vdiode. To limit the diode
current, an external 1.5 kΩ carbon high-voltage resistor in
series with the cathode output and a 2 kV spark gap are
needed (for this resistor-value, the CRT has to be
behaviour (e.g. foil). This capacitor must be placed as
close as possible to pins 6 and 4, but definitely within
5 mm.
2. With a capacitor larger than10 µF on the picture tube
base print (shared by three output stages).
connected to the main PCB). This addition produces an
increase in the rise and fall times of approximately 7.5 ns
and a decrease in the overshoot of approximately 1.3%.
Switch-off behaviour
The output pins of the TDA6106Q are still under the control
of the input pin for a supply voltage down to approximately
30 V.
1997 Mar 03
7
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Philips Semiconductors
Product specification
Video output amplifier
TDA6106Q
TEST AND APPLICATION INFORMATION
C
par
R
fb
C1
100 kΩ
R10
200 V
22 nF
R9
V
in
C2
866 Ω
C6
100 nF
22 µF
C
n
560 pF
6
9
R1
50 Ω
3
TDA6106Q
8
0.98 mA
C8
R3
4
5
20 MΩ
6.8 pF
C7
probe
A
3.2 pF
C9
R2
V
1 MΩ
om
4 V
136 pF
GND
MBG344
Cpar = 150 fF.
Fig.5 Test circuit with feedback factor 1⁄116.
The dynamic dissipation equals:
Dissipation
Pdyn = VDD × (CL + Cfb + Cint) ×f ×Vo (p – p) ×b
With respect to dissipation, distinction must be made
between static dissipation (independent of frequency) and
dynamic dissipation (proportional to frequency).
Where:
CL = load capacitance.
The static dissipation of the TDA6106Q is due to supply
currents and load currents in the feedback network and
CRT.
Cfb = feedback capacitance.
Cint = internal load capacitance (≈ 4 pF).
f = input frequency.
Vof
Vo(p-p) = output voltage (peak-to-peak value).
b = non-blanking duty-cycle.
Pstat = VDD ×IDD + Voc ×Ioc – Vof
×
--------
Rfb
Where:
The IC must be mounted on the picture tube base print to
minimize the load capacitance (CL).
Rfb = value of feedback resistor.
Ioc = DC value of cathode current.
1997 Mar 03
8
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Philips Semiconductors
Product specification
Video output amplifier
TDA6106Q
INTERNAL PIN CONFIGURATION
V
GND
DD
6
4
from
input
circuit
TDA6106Q
esd
esd
esd
9
V
V
of
bias
from
reference
circuit
from
input
circuit
3
V
in
esd
flash
prot.
flash
prot.
esd
from
pin 9
8
V
oc
5
I
om
from
pin 9
6.8 V
esd
from
reference
circuit
to BCS-circuit
output
MBG345
Fig.6 Internal pin configuration.
9
1997 Mar 03
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Philips Semiconductors
Product specification
Video output amplifier
TDA6106Q
PACKAGE OUTLINE
DBS9MPF: plastic DIL-bent-SIL medium power package with fin; 9 leads
SOT111-1
D
D
1
A
q
2
P
P
1
Q
A
3
q
2
q
1
A
A
4
E
pin 1 index
c
L
1
9
e
b
e
Z
2
b
w
M
2
θ
b
1
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
A
max.
2
(1)
(1)
Z
UNIT
A
A
A
b
b
b
c
D
D
E
e
e
L
P
P
Q
q
q
q
2
w
θ
3
4
1
2
1
2
1
1
max.
o
o
18.5
17.8
8.7 15.5 1.40 0.67 1.40 0.48 21.8 21.4 6.48
8.0 15.1 1.14 0.50 1.14 0.38 21.4 20.7 6.20
3.9 2.75 3.4 1.75 15.1
3.4 2.50 3.2 1.55 14.9
65
55
4.4 5.9
4.2 5.7
2.54 2.54
mm
3.7
0.25 1.0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-03-11
SOT111-1
1997 Mar 03
10
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Philips Semiconductors
Product specification
Video output amplifier
TDA6106Q
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1997 Mar 03
11
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© Philips Electronics N.V. 1997
SCA53
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
547047/1200/01/pp12
Date of release: 1997 Mar 03
Document order number: 9397 750 01869
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