INTEGRATED CIRCUITS
DATA SHEET
TDA2549
I.F. amplifier and demodulator for
multistandard TV receivers
April 1985
Product specification
File under Integrated Circuits, IC02
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Philips Semiconductors
Product specification
I.F. amplifier and demodulator for
multistandard TV receivers
TDA2549
Fig.1 Block diagram.
April 1985
3
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Philips Semiconductors
Product specification
I.F. amplifier and demodulator for
multistandard TV receivers
TDA2549
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
Supply voltage (pins 13 and 21)
Storage temperature range
VP
13,8
V
Tstg
Tamb
−25 to +125
−25 to +70
°C
°C
Operating ambient temperature range
CHARACTERISTICS (measured in fig.5)
VP = 12 V; Tamb = 25 °C
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
13,2
−
UNIT
Supply voltage range
VP
IP
10,8
12
82
V
Supply current (pins 13 and 21)
I.F. input signal for Vo = 2 V
(between pins 6 and 7)
−
mA
Vi = V6-7
−
−
−
50
2
150
−
−
µV
kΩ
pF
Input impedance (differential)
Input capacitance (differential)
Zero single output level
|Z6-7
|
C6-7
2
positive modulation
V22-3
V22-3
V22-3
Gv
1,6
3,7
1,7
50
2
2,3
4,3
2,3
−
V
negative modulation
4
V
Top sync output level
2
V
Gain control range
74
57
dB
dB
Signal-to-noise ratio at Vi = 10 mV (note 1)
Maximum video output amplitude for positive
modulation (peak-to-peak value)
Bandwidth of video amplifier (3 dB)
Differential gain at Vo = 2V
Differential phase at Vo = 2 V
Residual carrier signal (r.m.s. value)
Residual second harmonic of carrier signal
(r.m.s. value)
S/N
50
−
V22-3(p-p)
B
4,5
−
−
−
−
−
5,5
4
−
−
10
10
20
V
MHz
%
dG
dϕ
V24-3(rms)
2
%
10
mV
V24-3(rms)
−
20
60
mV
April 1985
4
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Philips Semiconductors
Product specification
I.F. amplifier and demodulator for
multistandard TV receivers
TDA2549
PARAMETER
SYMBOL
V15-3
MIN.
TYP.
MAX.
UNIT
A.F.C. output voltage swing
Change of frequency required for a.f.c.
output voltage swing of 10 V
A.F.C. switch off for a voltage lower than:
A.F.C. inverter switch
10
−
−
V
∆f
V17-3
−
−
70
200
1,5
kHz
V
−
positive a.f.c. (Fig.2)
V16-3
V16-3
0
4
−
−
1,5
12
V
V
negative a.f.c. (Fig.3)
Tuner A.G.C.
Leakage current
I10
−
−
15
µA
Saturation voltage
I
10 = 0,3 mA
V10-3
Vi
−
−
10
−
0,1
−
−
0,3
3
V
take-over point LOW
take-over point HIGH
mV
mV
dB
Vi
−
0,5
Signal expansion at Gv = 50 dB
Negative modulation (Fig.4)
white spot inverter threshold level
white spot insertion level
noise inverter threshold level
noise insertion level
∆V22-3
−
V22-3
V22-3
V22-3
V22-3
−
−
−
−
4,6
3,2
0,9
2,5
−
−
−
−
V
V
V
V
Positive modulation a.g.c. detector
reference level
V11-3
V12-3
3,0
0,7
3,2
1
3,4
1,4
V
V
Auxiliary video input signal for Vo(p-p) = 2 V
Auxiliary video output
output signal (note 2)
V14-3
V14-3
−
1
1
2
7
−
3
V
V
Ω
top sync level
output impedance
|Z14-3
|
−
−
Levels for video switches
positive video
V2-3
−
3
−
−
−
−
1
V
V
V
V
negative video
V2-3
−
1
internally demodulated signal
auxiliary video signal
V23-3
V23-3
−
3
−
Notes to the characteristics
Vo black-to-white
1. Signal – to – noise ratio S/N =
----------------------------------------------------------
Vn (rms) at B= 5 MHz
2. Measured in application of Fig. 5.
April 1985
5
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Philips Semiconductors
Product specification
I.F. amplifier and demodulator for
multistandard TV receivers
TDA2549
Fig.2 A.F.C. output voltage V15-3 for positive a.f.c.
Fig.3 A.F.C. output voltage V15-3 for negative a.f.c.
Fig.4 Video output waveform showing white spot and noise inverter threshold levels.
April 1985
6
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Philips Semiconductors
Product specification
I.F. amplifier and demodulator for
multistandard TV receivers
TDA2549
APPLICATION INFORMATION
Fig.5 Application diagram.
April 1985
7
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Philips Semiconductors
Product specification
I.F. amplifier and demodulator for
multistandard TV receivers
TDA2549
PACKAGE OUTLINE
DIP24: plastic dual in-line package; 24 leads (600 mil)
SOT101-1
D
M
E
A
2
A
L
A
1
c
e
w M
Z
b
1
(e )
1
b
M
H
24
13
pin 1 index
E
1
12
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
Z
A
A
A
(1)
(1)
1
2
UNIT
mm
b
b
c
D
E
e
e
L
M
M
H
w
1
1
E
max.
min.
max.
max.
1.7
1.3
0.53
0.38
0.32
0.23
32.0
31.4
14.1
13.7
3.9
3.4
15.80
15.24
17.15
15.90
5.1
0.51
4.0
2.54
0.10
15.24
0.60
0.25
0.01
2.2
0.066
0.051
0.021
0.015
0.013
0.009
1.26
1.24
0.56
0.54
0.15
0.13
0.62
0.60
0.68
0.63
inches
0.20
0.020
0.16
0.087
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-01-23
SOT101-1
051G02
MO-015AD
April 1985
8
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Philips Semiconductors
Product specification
I.F. amplifier and demodulator for
multistandard TV receivers
TDA2549
SOLDERING
Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often
used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook” (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the
joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may
be necessary immediately after soldering to keep the temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more
than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
April 1985
9
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