Philips Stereo Amplifier TDA1521A User Manual

INTEGRATED CIRCUITS  
DATA SHEET  
TDA1521A  
2 x 6 W hi-fi audio power amplifier  
July 1994  
Product specification  
File under Integrated Circuits, IC01  
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Philips Semiconductors  
Product specification  
2 x 6 W hi-fi audio power amplifier  
TDA1521A  
Fig.1 Block diagram.  
July 1994  
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Philips Semiconductors  
Product specification  
2 x 6 W hi-fi audio power amplifier  
TDA1521A  
PINNING  
1
2
INV1  
INV1  
non-inverting input 1  
inverting input 1  
ground (symmetrical)  
12 VP (asymmetrical)  
output 1  
negative supply (symmetrical)  
ground (asymmetrical)  
output 2  
5
VP  
6
7
8
9
OUT2  
+ VP  
3
4
GND  
positive supply  
OUT1  
INV2  
INV2  
inverting input 2  
non-inverting input 2  
FUNCTIONAL DESCRIPTION  
This hi-fi stereo power amplifier is designed for mains fed applications. The circuit is designed for both symmetrical and  
asymmetrical power supply systems. An output power of 2 × 6 watts (THD = 0,5%) can be delivered into an 8 load with  
a symmetrical power supply of ± 12 V.  
The gain is fixed internally at 30 dB. Internal gain fixing gives low gain spread and very good balance between the  
amplifiers (0,2 dB).  
A special feature of this device is a mute circuit which suppresses unwanted input signals during switching on and off.  
Referring to Fig.12, the 100 µF capacitor creates a time delay when the voltage at pin 3 is lower than an internally fixed  
reference voltage. During the delay the amplifiers remain in their DC operating mode but are isolated from the  
non-inverting inputs on pins 1 and 9.  
Two thermal protection circuits are provided, one monitors the average junction temperature and the other the  
instantaneous temperature of the power transistors. Both protection circuits activate at 150 °C allowing safe operation to  
a maximum junction temperature of 150 °C without added distortion.  
RATINGS  
Limiting values in accordance with the Absolute Maximum System (IEC 134)  
PARAMETER  
Supply voltage  
CONDITIONS  
SYMBOL  
VP = V7-3  
MIN.  
MAX.  
+21  
21  
4
UNIT  
pin 7  
pin 5  
V
VP = V5-3  
IOSM  
V
A
Non-repetitive peak  
output current  
pins 4 and 6  
Total power dissipation  
Storage temperature range  
Junction temperature  
Short-circuit time:  
see Fig.2  
Ptot  
Tstg  
Tj  
55  
+ 150  
150  
°C  
°C  
see note 1  
outputs short-circuited  
to ground  
symmetrical  
power supply  
asymmetrical  
power supply  
(full signal drive)  
tsc  
tsc  
1
1
hour  
hour  
Note  
1. For asymmetrical power supplies (at short circuiting of the load) the maximum supply voltage is limited to VP = 28 V.  
July 1994  
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Philips Semiconductors  
Product specification  
2 x 6 W hi-fi audio power amplifier  
TDA1521A  
Fig.2 Power derating curve.  
THERMAL RESISTANCE  
From junction to case  
Rth j-c = 6 K/W  
HEATSINK DESIGN EXAMPLE  
With derating of 6 K/W, the value of heatsink thermal resistance is calculated as follows:  
given RL = 8 and VP = ± 12 V, the measured maximum dissipation is 7,8 W; then, for a maximum ambient temperature  
of 60 °C, the required thermal resistance of the heatsink is  
150 60  
Rth h-a  
=
6 = 5,5 K/W  
----------------------  
7, 8  
Note: The metal tab (heatsink) has the same potential as pin 5 ( VP).  
July 1994  
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Philips Semiconductors  
Product specification  
2 x 6 W hi-fi audio power amplifier  
TDA1521A  
CHARACTERISTICS  
PARAMETER  
Supply voltage range  
CONDITIONS  
SYMBOL  
MIN.  
TYP.  
MAX.  
UNIT  
operating mode  
input mute mode  
Repetitive peak  
output current  
VP  
± 7,5  
± 2,0  
± 12,0  
± 20,0  
±5,8  
V
V
VP  
IORM  
2,2  
A
Operating mode: symmetrical power supply; test circuit as per Fig.11;  
VP = ± 12 V; RL = 8 ; Tamb = 25 °C; f = 1 kHz  
Total quiescent current  
Output power  
without RL  
Itot  
Po  
Po  
18  
5
40  
6
70  
mA  
W
THD = 0,5%  
THD = 10%  
6,5  
8,0  
W
Total harmonic  
distortion  
Po = 4 W  
THD = 0,5%  
note 1  
THD  
B
0,15  
0,2  
%
Power bandwidth  
20 to  
16 k  
30  
Hz  
dB  
dB  
Voltage gain  
Gv  
29  
31  
Gain balance  
Gv  
0,2  
1,0  
Noise output voltage  
(r.m.s. value);  
unweighted (20 Hz  
to 20 kHz)  
RS = 2 kΩ  
Vno(rms)  
|Zi|  
70  
20  
60  
70  
0,3  
140  
26  
µV  
kΩ  
dB  
dB  
µA  
Input impedance  
Ripple rejection  
Channel separation  
Input bias current  
DC output offset  
voltage  
14  
40  
46  
note 2  
SVRR  
α
RS = 0 Ω  
Iib  
with respect  
to ground  
VOFF  
30  
200  
mV  
Input mute mode: symmetrical power supply; test circuit as per Fig.11;  
VP = ± 4 V; RL = 8 ; Tamb = 25 °C; f = 1 kHz  
Total quiescent current  
Output voltage  
without RL  
Itot  
9
30  
40  
mA  
mV  
Vi = 600 mV  
Vout  
0,6  
1,8  
Noise output voltage  
(r.m.s. value);  
unweighted (20 Hz to 20 kHz)  
Ripple rejection  
RS = 2 kΩ  
note 2  
Vno(rms)  
SVRR  
35  
70  
55  
140  
µV  
dB  
DC output offset  
voltage  
with respect  
to ground  
VOFF  
40  
200  
mV  
July 1994  
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Philips Semiconductors  
Product specification  
2 x 6 W hi-fi audio power amplifier  
TDA1521A  
PARAMETER  
CONDITIONS  
SYMBOL  
MIN.  
TYP.  
MAX.  
UNIT  
Operating mode: asymmetrical power supply; test circuit as per Fig.12;  
VP = 24 V; RL = 8 ; Tamb = 25 °C; f = 1 kHz  
Total quiescent current  
Output power  
Itot  
18  
40  
70  
mA  
THD = 0,5%  
THD = 10%  
Po = 4 W  
Po  
5
6
W
W
%
Po  
6,5  
8
Total harmonic distortion  
Power bandwidth  
THD  
0,13  
40 to  
16 k  
30  
0,2  
THD = 0,5%  
note 1  
B
Hz  
dB  
dB  
Voltage gain  
Gv  
Gv  
29  
31  
Gain balance  
0,2  
1,0  
Noise output voltage  
(r.m.s. value);  
unweighted (20 Hz to 20 kHz)  
Input impedance  
Ripple rejection  
RS = 2 kΩ  
Vno(rms)  
|Zi|  
70  
20  
44  
45  
140  
26  
µV  
kΩ  
dB  
dB  
14  
35  
SVRR  
α
Channel separation  
RS = 0 Ω  
Notes to the characteristics  
1. Power bandwidth at Po max 3 dB.  
2. Ripple rejection at RS = 0 , f = 100 Hz to 20 kHz; ripple voltage = 200 mV (r.m.s. value) applied to positive or  
negative supply rail.  
July 1994  
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Philips Semiconductors  
Product specification  
2 x 6 W hi-fi audio power amplifier  
TDA1521A  
APPLICATION INFORMATION  
Input mute circuit  
The input mute circuit operates only during switching on and off of the supply voltage. The circuit compares the 12 supply  
voltage (at pin 3) with an internally fixed reference voltage (Vref), derived directly from the supply voltage. When the  
voltage at pin 3 is lower than Vref the non-inverting inputs (pins 1 and 9) are disconnected from the amplifier. The voltage  
at pin 3 is determined by an internal voltage divider and the external 100 µF capacitor.  
During switching on, a time delay is created between the reference voltage and the voltage at pin 3, during which the  
input terminal is disconnected, (as illustrated in Fig.3).  
Fig.3 Input mute circuit; time delay.  
July 1994  
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Philips Semiconductors  
Product specification  
2 x 6 W hi-fi audio power amplifier  
TDA1521A  
Fig.4 Output power as a function of supply voltage; symmetrical supply; RL = 8 ; f = 1 kHz.  
Fig.5 Distortion as a function of frequency; symmetrical supply; VP = ±12 V; RL = 8 ; Po = 3 W.  
July 1994  
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Philips Semiconductors  
Product specification  
2 x 6 W hi-fi audio power amplifier  
TDA1521A  
Fig.6 Supply voltage ripple rejection; symmetrical supply, VP = ±12 V; VRR = 200 mV.  
Fig.7 Power dissipation as a function of output power; asymmetrical supply; VS = 24 V; RL = 8 ; f = 1 kHz.  
July 1994  
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Philips Semiconductors  
Product specification  
2 x 6 W hi-fi audio power amplifier  
TDA1521A  
Fig.8 Output power as a function of supply voltage; asymmetrical supply; RL = 8 ; f = 1 kHz.  
Fig.9 Distortion as a function of frequency; asymmetrical supply; VS = 24 V; RL = 8 ; Po = 3 W.  
July 1994  
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Philips Semiconductors  
Product specification  
2 x 6 W hi-fi audio power amplifier  
TDA1521A  
Fig.10 Supply voltage ripple rejection; asymmetrical supply; VS = 24 V; VRR = 200 mW.  
July 1994  
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Philips Semiconductors  
Product specification  
2 x 6 W hi-fi audio power amplifier  
TDA1521A  
(1) To be connected as close as possible to the I.C.  
Fig.11 Test and application circuit; symmetrical power supply.  
(1) To be connected as close as possible to the I.C.  
Fig.12 Test and application circuit; asymmetrical power supply.  
July 1994  
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Philips Semiconductors  
Product specification  
2 x 6 W hi-fi audio power amplifier  
TDA1521A  
PACKAGE OUTLINE  
SIL9MPF: plastic single in-line medium power package with fin; 9 leads  
SOT110-1  
D
D
1
q
A
2
P
P
1
A
3
q
2
q
1
A
A
4
E
pin 1 index  
c
L
1
9
b
Q
e
Z
b
w
M
2
b
1
0
5
10 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
(1)  
Z
max.  
A
max.  
2
(1)  
(1)  
E
UNIT  
A
A
b
b
b
c
D
D
e
L
P
P
Q
q
q
q
2
w
A
3
4
1
2
1
1
1
18.5  
17.8  
8.7 15.8 1.40 0.67 1.40 0.48 21.8 21.4 6.48  
8.0 15.4 1.14 0.50 1.14 0.38 21.4 20.7 6.20  
3.9 2.75 3.4 1.75 15.1  
3.4 2.50 3.2 1.55 14.9  
4.4  
4.2  
5.9  
5.7  
2.54  
mm  
3.7  
0.25 1.0  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
92-11-17  
95-02-25  
SOT110-1  
July 1994  
14  
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Philips Semiconductors  
Product specification  
2 x 6 W hi-fi audio power amplifier  
TDA1521A  
The device may be mounted up to the seating plane, but  
the temperature of the plastic body must not exceed the  
specified maximum storage temperature (Tstg max). If the  
printed-circuit board has been pre-heated, forced cooling  
may be necessary immediately after soldering to keep the  
temperature within the permissible limit.  
SOLDERING  
Introduction  
There is no soldering method that is ideal for all IC  
packages. Wave soldering is often preferred when  
through-hole and surface mounted components are mixed  
on one printed-circuit board. However, wave soldering is  
not always suitable for surface mounted ICs, or for  
printed-circuits with high population densities. In these  
situations reflow soldering is often used.  
Repairing soldered joints  
Apply a low voltage soldering iron (less than 24 V) to the  
lead(s) of the package, below the seating plane or not  
more than 2 mm above it. If the temperature of the  
soldering iron bit is less than 300 °C it may remain in  
contact for up to 10 seconds. If the bit temperature is  
between 300 and 400 °C, contact may be up to 5 seconds.  
This text gives a very brief insight to a complex technology.  
A more in-depth account of soldering ICs can be found in  
our “IC Package Databook” (order code 9398 652 90011).  
Soldering by dipping or by wave  
The maximum permissible temperature of the solder is  
260 °C; solder at this temperature must not be in contact  
with the joint for more than 5 seconds. The total contact  
time of successive solder waves must not exceed  
5 seconds.  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
July 1994  
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