INTEGRATED CIRCUITS
DATA SHEET
TDA1020
12 W car radio power amplifier
November 1982
Product specification
File under Integrated Circuits, IC01
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Philips Semiconductors
Product specification
12 W car radio power amplifier
TDA1020
Fig.1 Internal block diagram; the heavy lines indicate the signal paths.
PINNING
1. Negative supply (substrate)
2. Output power stage
3. Positive supply (V )
P
4. Bootstrap
5. Ripple rejection filter
6. Input power stage
7. Output preamplifier
8. Input preamplifier
9. Negative supply
November 1982
3
Preliminary Specification
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Philips Semiconductors
Product specification
12 W car radio power amplifier
TDA1020
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
Supply voltage; operating (pin 3)
Supply voltage; non-operating
V
V
V
max.
max.
max.
max.
18 V
28 V
45 V
6 A
P
P
Supply voltage; load dump
P
Non-repetitive peak output current
Total power dissipation
I
OSM
see derating curves Fig.2
Storage temperature range
T
−55 to + 150 °C
stg
Crystal temperature
T
max.
max.
150 °C
c
Short-circuit duration of load behind output electrolytic capacitor
at 1 kHz sine-wave overdrive (10 dB); V = 14,4 V
t
100 hours
sc
Fig.2 Power derating curves.
November 1982
4
Preliminary Specification
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Philips Semiconductors
Product specification
12 W car radio power amplifier
TDA1020
HEATSINK DESIGN EXAMPLE
The derating of 8 K/W of the encapsulation requires the following external heatsink (for sine-wave drive):
10 W in 2 Ω at V = 14,4 V
P
maximum sine-wave dissipation: 5,2 W
T
= 60 °C maximum
amb
150 – 60
----------------------
5, 2
Rth j-a = Rth j-tab + Rth tab-h + Rth h-a
Since R + R = 8 K/W, R
=
= 17,3 K/W
= 17,3 − 8 ≈ 9 K/W.
th j-tab
th tab-h
th h-a
D.C. CHARACTERISTICS
Supply voltage range (pin 3)
Repetitive peak output current
Total quiescent current
V
6 to 18 V
4 A
P
I
<
ORM
at V = 14,4 V
I
I
typ.
typ.
30 mA
P
tot
at V = 18 V
40 mA
P
tot
A.C. CHARACTERISTICS
T
= 25 °C; V = 14,4 V; R = 4 Ω; f = 1 kHz; unless otherwise specified; see also Fig.3
amb
P
L
Output power at d = 10%; with bootstrap (note 1)
tot
>
10 W
12 W
6 W
V = 14,4 V; R = 2 Ω
P
P
L
o
typ.
>
V = 14,4 V; R = 4 Ω
P
P
P
L
o
typ.
typ.
7 W
V = 14,4 V; R = 8 Ω
3,5 W
P
L
o
Output power at d = 1%; with bootstrap (note 1)
tot
V = 14,4 V; R = 2 Ω
P
P
P
typ.
typ.
typ.
9,5 W
6 W
P
L
o
o
o
V = 14,4 V; R = 4 Ω
P
L
V = 14,4 V; R = 8 Ω
3 W
P
L
Output voltage (r.m.s. value)
R = 1 kΩ; d = 0,5%
V
P
typ.
>
5 V
L
tot
o(rms)
Output power at d = 10%; without bootstrap
4,5 W
tot
o
Voltage gain
typ.
typ.
typ.
17,7 dB
16,7 to 18,7 dB
29,5 dB
preamplifier (note 2)
G
G
G
v1
power amplifier
total amplifier
v2
28,5 to 30,5 dB
47 dB
v tot
46,2 to 48,2 dB
November 1982
5
Preliminary Specification
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Philips Semiconductors
Product specification
12 W car radio power amplifier
TDA1020
Input impedance
preamplifier
typ.
typ.
40 kΩ
28 to 52 kΩ
40 kΩ
|Z |
i
power amplifier
Output impedance
preamplifier
|Z |
i
28 to 52 kΩ
typ.
typ.
2,0 kΩ
1,4 to 2,6 kΩ
50 mΩ
|Z |
o
power amplifier
|Z |
o
Output voltage (r.m.s. value) at d = 1%
tot
>
1 V
1,5 V
preamplifier (note 2)
V
B
o(rms)
typ.
Frequency response
50 Hz to 25 kHz
Noise output voltage (r.m.s. value; note 3)
typ.
<
0,3 mV
0,5 mV
0,5 mV
1,0 mV
R = 0 Ω
V
V
S
n(rms)
typ.
<
R = 8,2 kΩ
S
n(rms)
Ripple rejection (note 4)
at f = 100 Hz; C2 = 1 µF
RR
RR
typ.
>
44 dB
48 dB
54 dB
at f = 1 kHz to 10 kHz
typ.
Bootstrap current at onset of clipping (pin 4)
R = 4 Ω and 2 Ω
Stand-by current (note 5)
I
typ.
<
40 mA
1 mA
L
4
I
sb
Crystal temperature for −3 dB gain
T
>
150 °C
c
Notes
1. Measured with an ideal coupling capacitor to the speaker load.
2. Measured with a load resistor of 40 kΩ.
3. Measured according to IEC curve-A.
4. Maximum ripple amplitude is 2 V; input is short-circuited.
5. Total current when disconnecting pin 5 or short-circuited to ground (pin 9).
6. The tab must be electrically floating or connected to the substrate (pin 9).
November 1982
6
Preliminary Specification
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Philips Semiconductors
Product specification
12 W car radio power amplifier
TDA1020
(1) With R = 2 Ω, preferred value of C8 = 2200 µF.
L
Fig.3 Test circuit.
November 1982
7
Preliminary Specification
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Philips Semiconductors
Product specification
12 W car radio power amplifier
TDA1020
PACKAGE OUTLINE
SIL9MPF: plastic single in-line medium power package with fin; 9 leads
SOT110-1
D
D
1
q
A
2
P
P
1
A
3
q
2
q
1
A
A
4
E
pin 1 index
c
L
1
9
b
Q
e
Z
b
w
M
2
b
1
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
Z
max.
A
max.
2
(1)
(1)
E
UNIT
A
A
b
b
b
c
D
D
e
L
P
P
Q
q
q
q
2
w
A
3
4
1
2
1
1
1
18.5
17.8
8.7 15.8 1.40 0.67 1.40 0.48 21.8 21.4 6.48
8.0 15.4 1.14 0.50 1.14 0.38 21.4 20.7 6.20
3.9 2.75 3.4 1.75 15.1
3.4 2.50 3.2 1.55 14.9
4.4
4.2
5.9
5.7
2.54
mm
3.7
0.25 1.0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-02-25
SOT110-1
November 1982
8
Preliminary Specification
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Philips Semiconductors
Product specification
12 W car radio power amplifier
TDA1020
SOLDERING
Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often
used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook” (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the
joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
). If the printed-circuit board has been pre-heated, forced cooling may
stg max
be necessary immediately after soldering to keep the temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more
than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
November 1982
9
Preliminary Specification
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