DISCRETE SEMICONDUCTORS
DATA SHEET
handbook, halfpage
BGY2016
UHF amplifier module
Product specification
2000 Oct 17
Supersedes data of 2000 Jan 04
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Philips Semiconductors
Product specification
UHF amplifier module
BGY2016
CHARACTERISTICS
Tmb = 25 °C; VS1 = 5 V; VS2 = 26 V; PL = 16 W; ZS = ZL = 50 Ω unless otherwise specified.
SYMBOL
PARAMETER
frequency
CONDITIONS
MIN.
1805
TYP.
MAX.
1990
UNIT
MHz
f
−
IS1
IS2
PL
supply current
supply current
load power
−
−
16
28
−
80
430
−
−
−
−
−
−
35
2
mA
mA
W
PD < −60 dBm
PD < 20 mW
Gp
∆Gp
power gain
dB
dB
dB
dB
in band gain variation
f = 1805 to 1880 MHz; PL = 5 W
f = 1930 to 1990 MHz; PL = 5 W
−
−
−
−
2
G
p1 - Gp2
gain expansion
Gp1 at PL = 160 mW;
Gp2 at PL = 5 mW
±1
η
H2
efficiency
PL = 16 W
PL = 16 W
PL = 16 W
30
−
−
−
−
−
−
−
−
−
−
%
second harmonic
third harmonic
input VSWR
stability
−35
−40
2 : 1
−60
dBc
dBc
H3
VSWRin
VSWR ≤ 2 : 1 through all phases;
PL ≤ 16 W; VS2 = 25 to 27 V
dBc
dBc
MHz
reverse intermodulation
AM bandwidth
P
carrier = 16 W; Preverse = −40 dBc;
−
−
−
−53
fi = fc ±200 kHz
B
corner frequency = 3 dB;
2
−
Pcarrier = 16 W; modulation = 20%
ruggedness
VSWR ≤ 5 : 1 through all phases
no degradation
2000 Oct 17
3
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Philips Semiconductors
Product specification
UHF amplifier module
BGY2016
APPLICATION INFORMATION
C7
C5
C8
C6
Z
Z
2
R1
L1
R2
L2
1
C3
C1
C4
C2
50 Ω
V
V
50 Ω
output
S1
S2
input
MGM861
Fig.2 Test circuit.
List of components (See Figs 2 and 3)
COMPONENT
C1, C2
DESCRIPTION
electrolytic capacitor
VALUE
CATALOGUE NO.
10 µF; 35 V
10 nF; 50 V
100 pF; 50 V
10 pF; 50 V
−
−
−
−
−
C3, C4
C5, C6
C7, C8
L1, L2
R1, R2
Z1, Z2
multilayer ceramic chip capacitor
multilayer ceramic chip capacitor
multilayer ceramic chip capacitor
Grade 4S2 Ferroxcube bead
metal film resistor
4330 030 36300
2322 195 13109
−
10 Ω; 0.4 W
50 Ω
stripline; note 1
Note
1. The striplines are on a double copper-clad printed-circuit board (RO5880) with εr = 2.2 and thickness = 0.79 mm.
2000 Oct 17
4
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Philips Semiconductors
Product specification
UHF amplifier module
BGY2016
90
42
C7
C5
C8
C6
R1
L1 L2
R2
C3
C1
C4
C2
Z
Z
1
2
MGM862
output V
V
input
S2
S1
Dimensions in mm.
Fig.3 Printed-circuit board component layout.
2000 Oct 17
5
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Philips Semiconductors
Product specification
UHF amplifier module
BGY2016
MOUNTING RECOMMENDATIONS
The module should be mounted to the heatsink using
3 mm bolts with flat washers. The bolts should first be
tightened to “finger tight” and then further tightened in
alternating steps to a maximum torque of 0.4 to 0.6 Nm.
To ensure a good thermal contact and to prevent
mechanical stress when bolted down, the flatness of the
mounting base is designed to be typically better than
0.1 mm. The mounting area of the heatsink should be flat
and free from burrs and loose particles. The heatsink
should be rigid and not prone to bowing under thermal
cycling conditions. The thickness of a solid heatsink
should be not less than 5 mm to ensure a rigid assembly.
Once mounted on the heatsink, the module leads can be
soldered to the printed-circuit board. A soldering iron may
be used up to a temperature of 250 °C for a maximum of
10 seconds at a distance of 2 mm from the plastic cap.
ESD precautions must be taken to protect the device from
electrostatic damage.
A thin, even layer of thermal compound should be applied
between the mounting base and the heatsink to achieve
the best possible thermal contact resistance. Excessive
use of thermal compound will result in an increase in
thermal resistance and possible bowing of the mounting
base; too little will also result in poor thermal conduction.
2000 Oct 17
6
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Philips Semiconductors
Product specification
UHF amplifier module
BGY2016
PACKAGE OUTLINE
Plastic rectangular single-ended flat package; flange mounted; 2 mounting holes; 4 in-line leads
SOT365A
D
A
F
y
U
q
A
U
2
p
U
1
E
L
1
2
3
4
b
p
w
M
v
c
A
e
e
e
Z
Q
1
0
10
20 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
b
c
D
E
e
e
F
L
p
Q
q
U
U
U
v
w
y
Z
p
1
1
2
9.5 0.56
9.0 0.46
4.0
3.8
0.3 30.1 18.6
0.2 29.9 18.4
3.25 6.5
3.15 6.1
4.1
3.9
40.74 48.0 15.4 7.75
40.54 48.4 15.2 7.55
12.8
12.6
mm
2.54 17.78
0.3 0.25 0.1
REFERENCES
JEDEC
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
EIAJ
SOT365A
99-02-06
2000 Oct 17
7
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Philips Semiconductors
Product specification
UHF amplifier module
BGY2016
DATA SHEET STATUS
PRODUCT
STATUS
DATA SHEET STATUS
DEFINITIONS (1)
Objective specification
Development This data sheet contains the design target or goal specifications for
product development. Specification may change in any manner without
notice.
Preliminary specification Qualification
This data sheet contains preliminary data, and supplementary data will be
published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.
Product specification
Production
This data sheet contains final specifications. Philips Semiconductors
reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.
Note
1. Please consult the most recently issued data sheet before initiating or completing a design.
DEFINITIONS
DISCLAIMERS
Short-form specification
The data in a short-form
Life support applications
These products are not
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes
Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
Application information
Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2000 Oct 17
8
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Philips Semiconductors
Product specification
UHF amplifier module
BGY2016
NOTES
2000 Oct 17
9
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Philips Semiconductors
Product specification
UHF amplifier module
BGY2016
NOTES
2000 Oct 17
10
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Philips Semiconductors
Product specification
UHF amplifier module
BGY2016
NOTES
2000 Oct 17
11
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Internet: http://www.semiconductors.philips.com
70
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Printed in The Netherlands
613524/04/pp12
Date of release: 2000 Oct 17
Document order number: 9397 750 07591
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