Philips Stereo Amplifier BGY148A User Manual

DISCRETE SEMICONDUCTORS  
DATA SHEET  
book, halfpage  
BGY148A; BGY148B  
HF amplifier modules  
1998 May 13  
Product specification  
Supersedes data of 1997 Jul 14  
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Philips Semiconductors  
Product specification  
HF amplifier modules  
BGY148A; BGY148B  
CHARACTERISTICS  
ZS = ZL = 50 ; PD = 10 mW; VS = 6 V; VC 3.5 V; Tmb = 25 °C; unless otherwise specified.  
SYMBOL PARAMETER CONDITIONS MIN.  
frequency range  
TYP. MAX. UNIT  
f
BGY148A  
BGY148B  
400  
53  
440  
488  
100  
500  
38  
38  
3 : 1  
MHz  
MHz  
µA  
µA  
W
430  
IQ  
total quiescent current  
control current  
load power  
VC = 0; PD = 0  
IC  
adjust VC for PL = 3 W  
PL  
Gp  
η
H2  
H3  
3
power gain  
adjust VC for PL = 3 W  
adjust VC for PL = 3 W  
adjust VC for PL = 3 W  
adjust VC for PL = 3 W  
adjust VC for PL = 3 W  
VC = 0 to 3.5 V  
24.8  
46  
dB  
efficiency  
%
second harmonic  
third harmonic  
input VSWR  
control range  
stability  
dBc  
dBc  
VSWRin  
10  
dB  
PD = 5 to 20 mW; VS = 5 to 8.5 V;  
PL 3.5 W;  
VSWR 4 : 1 through all phases  
60  
dBc  
ruggedness  
VS = 8.5 V; adjust VC for PL = 3.5 W;  
no degradation  
VSWR 4 : 1 through all phases  
MDA207  
5
handbook, halfpage  
P
L
(W)  
4
VSWR = 1:1  
3
2
VSWR = 3:1  
1
0
0
20  
40  
60  
80  
T
100  
o
( C)  
mb  
VS = 8.5 V.  
Fig.2 Load power derating curves.  
1998 May 13  
3
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Philips Semiconductors  
Product specification  
HF amplifier modules  
BGY148A; BGY148B  
MGD553  
MGD554  
5
60  
handbook, halfpage  
handbook, halfpage  
P
L
η
(%)  
(W)  
4
400 MHz  
440 MHz  
440 MHz  
400 MHz  
40  
20  
3
2
1
0
0
0
0
1
2
3
4
1
2
3
4
P
(W)  
V
(V)  
L
C
ZS = ZL = 50 ; PD = 10 mW; VS = 6 V; Tmb = 25 °C.  
ZS = ZL = 50 ; PD = 10 mW; VS = 6 V; Tmb = 25 °C.  
Fig.3 Load power as a function of control voltage;  
BGY148A; typical values.  
Fig.4 Efficiency as a function of load power;  
BGY148A; typical values.  
MGD555  
MGD556  
5
60  
handbook, halfpage  
handbook, halfpage  
P
L
η
(%)  
(W)  
4
40  
3
2
20  
1
0
0
380  
380  
400  
420  
440  
460  
400  
420  
440  
460  
f (MHz)  
f (MHz)  
ZS = ZL = 50 ; PD = 10 mW; VS = 6 V; VC = 3.5 V; Tmb = 25 °C.  
ZS = ZL = 50 ; PD = 10 mW; VS = 6 V; PL = 3 W; Tmb = 25 °C.  
Fig.5 Load power as a function of frequency;  
BGY148A; typical values.  
Fig.6 Efficiency as a function of frequency;  
BGY148A; typical values.  
1998 May 13  
4
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Philips Semiconductors  
Product specification  
HF amplifier modules  
BGY148A; BGY148B  
MGD557  
MGD558  
4
30  
3.0  
handbook, halfpage  
V
C
(V)  
VSWR  
H
H
3
in  
2,  
(dBc)  
2.5  
3
40  
H
3
VSWR  
in  
2.0  
1.5  
1.0  
2
H
2
V
C
50  
1
0
380  
60  
380  
400  
420  
440  
460  
400  
420  
440  
460  
f (MHz)  
f (MHz)  
ZS = ZL = 50 ; PD = 10 mW; VS = 6 V; PL = 3 W; Tmb = 25 °C.  
ZS = ZL = 50 ; PD = 2 mW; VS = 4.8 V; PL = 3 W; Tmb = 25 °C.  
Fig.7 Control voltage and input VSWR as functions  
of frequency; BGY148A; typical values.  
Fig.8 Harmonics as a function of frequency;  
BGY148A; typical values.  
MDA206  
5
handbook, halfpage  
P
L
(W)  
4
400 MHz  
440 MHz  
3
2
1
0
25  
0
25  
50  
75  
T
100  
o
( C)  
mb  
ZS = ZL = 50 ; PD = 2 mW; VS = 4.8 V; Tmb = 25 °C.  
Fig.9 Load power as a function of mounting base  
temperature; BGY148A; typical values.  
1998 May 13  
5
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Philips Semiconductors  
Product specification  
HF amplifier modules  
BGY148A; BGY148B  
MGD559  
MGD560  
5
60  
handbook, halfpage  
handbook, halfpage  
P
430 MHz  
L
η
(W)  
(%)  
4
430 MHz  
488 MHz  
488 MHz  
40  
20  
3
2
1
0
0
0
0
1
2
3
4
1
2
3
4
P
(W)  
V
(V)  
L
C
ZS = ZL = 50 ; PD = 10 mW; VS = 6 V; Tmb = 25 °C.  
ZS = ZL = 50 ; PD = 10 mW; VS = 6 V; Tmb = 25 °C.  
Fig.10 Load power as a function of control voltage;  
BGY148B; typical values.  
Fig.11 Efficiency as a function of load power;  
BGY148B; typical values.  
MGD561  
MGD562  
5
60  
handbook, halfpage  
handbook, halfpage  
P
L
η
(%)  
(W)  
4
40  
3
2
20  
1
0
0
420  
420  
440  
460  
480  
500  
440  
460  
480  
500  
f (MHz)  
f (MHz)  
ZS = ZL = 50 ; PD = 10 mW; VS = 6 V; VC = 3.5 V; Tmb = 25 °C.  
ZS = ZL = 50 ; PD = 10 mW; VS = 6 V; PL = 3 W; Tmb = 25 °C.  
Fig.12 Load power as a function of frequency;  
BGY148B; typical values.  
Fig.13 Efficiency as a function of frequency;  
BGY148B; typical values.  
1998 May 13  
6
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Philips Semiconductors  
Product specification  
HF amplifier modules  
BGY148A; BGY148B  
MGD563  
MGD564  
4
30  
3.0  
handbook, halfpage  
V
C
(V)  
H
H
3
2,  
VSWR  
in  
(dBc)  
2.5  
3
40  
H
2
V
C
2.0  
1.5  
1.0  
2
1
50  
60  
70  
H
3
VSWR  
in  
0
420  
440  
460  
480  
500  
420  
440  
460  
480  
500  
f (MHz)  
f (MHz)  
ZS = ZL = 50 ; PD = 10 mW; VS = 6 V; PL = 3 W; Tmb = 25 °C.  
ZS = ZL = 50 ; PD = 2 mW; VS = 4.8 V; PL = 3 W; Tmb = 25 °C.  
Fig.14 Control voltage and input VSWR as functions  
of frequency; BGY148B; typical values.  
Fig.15 Harmonics as a function of frequency;  
BGY148B; typical values.  
MDA205  
5
handbook, halfpage  
P
L
(W)  
4
430 MHz  
3
488 MHz  
2
1
0
25  
0
25  
50  
75  
T
100  
o
( C)  
mb  
ZS = ZL = 50 ; PD = 2 mW; VS = 4.8 V; Tmb = 25 °C.  
Fig.16 Load power as a function of mounting base  
temperature; BGY148B; typical values.  
1998 May 13  
7
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Philips Semiconductors  
Product specification  
HF amplifier modules  
BGY148A; BGY148B  
SOLDERING  
The indicated temperatures are those at the solder  
interfaces.  
MGM159  
300  
handbook, halfpage  
Advised solder types are types with a liquidus less than or  
T
(°C)  
equal to 210 °C.  
Solder dots or solder prints must be large enough to wet  
the contact areas.  
200  
100  
Soldering can be carried out using a conveyor oven, a hot  
air oven, an infrared oven or a combination of these ovens.  
A double reflow process is permitted.  
Hand soldering must be avoided because the soldering  
iron tip can exceed the maximum permitted temperature of  
250 °C and damage the module.  
0
0
The maximum allowed temperature is 250 °C for  
5 seconds.  
1
2
3
4
5
t (min)  
The maximum ramp-up is 10 °C per second.  
The maximum cool-down is 5 °C per second.  
Fig.17 Recommended reflow temperature profile.  
Cleaning  
The following fluids may be used for cleaning:  
Alcohol  
Bio-Act (Terpene Hydrocarbon)  
Acetone.  
Ultrasonic cleaning should not be used since this can  
cause serious damage to the product.  
1998 May 13  
8
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Philips Semiconductors  
Product specification  
HF amplifier modules  
BGY148A; BGY148B  
22.6  
2
DETAIL  
0.8  
0.4  
1.7  
1.5  
2
8.45  
0.6  
1
2.9  
2.7  
2.7  
0.1  
1.1  
1.1  
2.4  
2.6  
0.1  
7.48  
15.1  
DETAIL  
0.5  
0.7  
MGK391  
20.18  
footprint metallization  
solder area.  
21.8  
2
2
0.8  
2
7.05  
1.7  
3.2  
2
1.8  
7.08  
14.7  
MGK392  
19.78  
solder area.  
Dimensions in mm.  
Fig.18 SOT421A footprint.  
9
1998 May 13  
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Philips Semiconductors  
Product specification  
HF amplifier modules  
BGY148A; BGY148B  
PACKAGE OUTLINE  
Ceramic single-ended flat package; 4 in-line leads  
SOT421A  
U
D
A
y
Z
E
U
1
L
Q
1
2
3
4
b
w
M
c
e
e
e
d
1
0
5
10 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
UNIT  
A
b
c
D
d
E
e
e
L
Q
U
U
w
y
Z
1
1
3.0 0.56 0.30 22.1 2.4 13.4  
2.6 0.46 0.20 21.7 2.0 13.0  
0.7  
0.3  
3.4 22.4 8.2  
3.0 22.0 7.8  
0.25  
0.05  
0.25  
mm  
5.08 7.62  
0.15  
REFERENCES  
JEDEC  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
EIAJ  
SOT421A  
97-06-20  
1998 May 13  
10  
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Philips Semiconductors  
Product specification  
HF amplifier modules  
BGY148A; BGY148B  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
1998 May 13  
11  
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Philips Semiconductors – a worldwide company  
Argentina: see South America  
Middle East: see Italy  
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,  
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Tel. +47 22 74 8000, Fax. +47 22 74 8341  
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Pakistan: see Singapore  
Brazil: see South America  
Philippines: Philips Semiconductors Philippines Inc.,  
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Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474  
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United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,  
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077  
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Tel. +1 800 234 7381  
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,  
Uruguay: see South America  
Tel. +60 3 750 5214, Fax. +60 3 757 4880  
Vietnam: see Singapore  
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,  
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Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,  
Tel. +381 11 625 344, Fax.+381 11 635 777  
For all other countries apply to: Philips Semiconductors,  
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,  
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825  
© Philips Electronics N.V. 1998  
SCA60  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
125108/00/03/pp12  
Date of release: 1998 May 13  
Document order number: 9397 750 03849  
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