TDA8566
2 × 40 W/2 Ω stereo BTL car radio power amplifier with
differential inputs and diagnostic outputs
Rev. 06 — 15 October 2007
Product data sheet
1. General description
The TDA8566 is an integrated class-B output amplifier which is available in several
packages. TDA8566TH is contained in a 20-lead small outline plastic package. The
TDA8566TH1 is a 24-lead small outline plastic package which is pin compatible with the
I2C-bus controlled amplifier TDA1566TH for one board layout. TDA8566Q is a 17-pin
DIL-bent-SIL package.
The device contains 2 amplifiers in a Bridge-Tied Load (BTL) configuration. The output
power is 2 × 25 W in a 4 Ω load or 2 × 40 W in a 2 Ω load. It has a differential input stage
and 2 diagnostic outputs. The device is primarily developed for car radio applications.
2. Features
I Differential inputs
I Very high Common Mode Rejection Ratio (CMRR)
I High common mode input signal handling
I Requires very few external components
I High output power
I 4 Ω and 2 Ω load driving capability
I Low offset voltage at output
I Fixed gain
I Diagnostic facility (distortion, short-circuit and temperature pre-warning)
I Good ripple rejection
I Mode select switch (operating, mute and standby)
I Load dump protection
I Short-circuit proof to ground, to VP and across the load
I Low power dissipation in any short-circuit condition
I Thermally protected
I Reverse polarity safe
I Protected against electrostatic discharge
I No switch-on/switch-off plops
I Low thermal resistance
I TDA8566TH1 is pin compatible with TDA1566TH
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TDA8566
NXP Semiconductors
2 × 40 W/2 Ω stereo BTL car radio power amplifier
5. Block diagram
V
V
P2
P1
mute
switch
IN1+
C
M
IN1−
OUT1+
V
A
2.3
kΩ
2.3 kΩ
(9×)
mute
switch
C
M
OUT1−
V
A
60
60
2.3
kΩ
kΩ
kΩ
2.3 kΩ
(9×)
n.c.
standby
MODE
switch
TDA8566
standby
V
A
reference
voltage
V
ref
mute
switch
CLIP
CLIP
DIAG
SGND
1×
DIAG
mute
reference
voltage
60
kΩ
60
kΩ
mute
switch
IN2+
C
M
IN2−
OUT2+
V
A
2.3
kΩ
2.3 kΩ
(9×)
mute
switch
C
M
OUT2−
V
A
2.3
kΩ
(1)
HEATTAB
2.3 kΩ
(9×)
mgu358
PGND2
PGND1
(1) Pin HEATTAB is available in TDA8566TH1 only.
Fig 1. Block diagram
TDA8566_6
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Product data sheet
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TDA8566
NXP Semiconductors
2 × 40 W/2 Ω stereo BTL car radio power amplifier
6. Pinning information
6.1 Pinning
24
23
22
21
20
19
18
17
16
15
14
13
1
2
HEATTAB
DIAG
IN2+
IN2−
n.c.
V
20
19
18
17
16
15
14
13
12
11
1
2
MODE
DIAG
IN2+
IN2−
n.c.
P2
3
n.c.
OUT2−
PGND2
OUT2+
OUT1−
PGND1
OUT1+
n.c.
V
P2
4
3
OUT2−
PGND2
OUT2+
OUT1−
PGND1
OUT1+
5
n.c.
4
6
n.c.
5
n.c.
TDA8566TH1
TDA8566TH
7
MODE
n.c.
6
n.c.
8
7
n.c.
9
n.c.
8
IN1+
IN1−
SGND
10
11
12
IN1+
IN1−
SGND
9
V
P1
V
10
CLIP
P1
CLIP
001aag902
001aah015
Fig 2. Pin configuration TDA8566TH
Fig 3. Pin configuration TDA8566TH1
1
2
IN1+
IN1−
SGND
CLIP
3
4
5
V
P1
6
OUT1+
PGND1
OUT1−
n.c.
7
8
9
TDA8566Q
10
11
12
13
14
15
16
17
OUT2+
PGND2
OUT2−
V
P2
MODE
DIAG
IN2+
IN2−
001aah059
Fig 4. Pin configuration TDA8566Q
TDA8566_6
© NXP B.V. 2007. All rights reserved.
Product data sheet
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TDA8566
NXP Semiconductors
2 × 40 W/2 Ω stereo BTL car radio power amplifier
6.2 Pin description
Table 3.
Symbol
Pin description TDA8566TH and TDA8566TH1
Pin
Description
TDA8566TH
TDA8566TH1
DIAG
1
1
short-circuit and temperature pre-warning
diagnostic output
IN2+
2
2
channel 2 input positive
channel 2 input negative
not connected
IN2−
n.c.
3
3
4
4
n.c.
5
5
not connected
n.c.
6
6
not connected
n.c.
7
-
not connected
n.c.
-
8
not connected
n.c.
-
9
not connected
IN1+
8
10
11
12
13
14
15
16
17
18
-
channel 1 input positive
channel 1 input negative
signal ground
IN1−
SGND
CLIP
VP1
9
10
11
12
-
clip detection output
supply voltage 1
n.c.
not connected
OUT1+
PGND1
OUT1−
n.c.
13
14
15
-
channel 1 output positive
power ground 1
channel 1 output negative
not connected
OUT2+
PGND2
OUT2−
n.c.
16
17
18
-
19
20
21
22
23
7
channel 2 output positive
power ground 2
channel 2 output negative
not connected
VP2
19
20
-
supply voltage 2
MODE
HEATTAB
mode select switch input (standby/mute/operating)
connect to ground, used for test purposes only
24
Table 4.
Symbol
IN1+
Pin description TDA8566Q
Pin
1
Description
channel 1 input positive
channel 1 input negative
signal ground
IN1−
2
SGND
CLIP
3
4
clip detection output
supply voltage 1
VP1
5
OUT1+
PGND1
OUT1−
n.c.
6
channel 1 output positive
power ground 1
7
8
channel 1 output negative
not connected
9
TDA8566_6
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Product data sheet
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TDA8566
NXP Semiconductors
2 × 40 W/2 Ω stereo BTL car radio power amplifier
Table 4.
Pin description TDA8566Q …continued
Symbol
OUT2+
PGND2
OUT2−
VP2
Pin
10
11
12
13
14
15
16
17
Description
channel 2 output positive
power ground 2
channel 2 output negative
supply voltage 2
MODE
DIAG
mode select switch input (standby/mute/operating)
short-circuit and temperature pre-warning diagnostic output
channel 2 input positive
IN2+
IN2−
channel 2 input negative
7. Functional description
The TDA8566 contains 2 identical amplifiers and can be used for BTL applications. The
gain of each amplifier is fixed at 26 dB. Special features of this device are:
• Mode select switch
• Clip detection
• Short-circuit diagnostic
• Temperature pre-warning
• Open-collector diagnostic outputs
• Differential inputs
7.1 Mode select switch (pin MODE)
• Standby: low supply current
• Mute: input signal suppressed
• Operating: normal on condition
Since this pin has a very low input current (< 40 µA), a low-cost supply switch can be
applied. To avoid switch-on plops, it is advisable to keep the amplifier in the mute mode for
a period of ≥ 150 ms (charging the input capacitors at pins IN1+, IN1−, IN2+ and IN2−).
This can be realized by using a microcontroller or by using an external timing circuit as
7.2 Clip detection (pin CLIP)
When clipping occurs at one or more output stages, the dynamic distortion detector
becomes active and pin CLIP goes LOW. This information can be used to drive a sound
processor or a DC volume control to attenuate the input signal and so limit the level of
distortion. The output level of pin CLIP is independent of the number of channels that are
being clipped. The clip detection circuit is disabled in a short-circuit condition, so if a fault
condition occurs at the outputs, pin CLIP will remain at a HIGH level. The clip detection
TDA8566_6
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Product data sheet
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TDA8566
NXP Semiconductors
2 × 40 W/2 Ω stereo BTL car radio power amplifier
V
O
(V)
0
0
V
CLIP
(V)
t (s)
mgu357
Fig 5. Clip detection waveforms
7.3 Short-circuit diagnostic (pin DIAG)
When a short-circuit occurs at one or more outputs to ground or to the supply voltage, the
output stages are switched off until the short-circuit is removed and the device is switched
on again (with a delay of approximately 20 ms after the removal of the short-circuit).
During this short-circuit condition, pin DIAG is continuously LOW.
When a short-circuit occurs across the load of one or both channels, the output stages are
switched off for approximately 20 ms. After that time the load condition is checked during
approximately 50 µs to see whether the short-circuit is still present. Due to this duty cycle
of 50 µs/20 ms the average current consumption during the short-circuit condition is very
low (approximately 40 mA). During this condition, pin DIAG is LOW for 20 ms and HIGH
current
in
output
stage
t (s)
short-circuit over the load
V
DIAG
20 ms
(V)
t (s)
50 µs
mgu360
Fig 6. Short-circuit diagnostic timing diagram
7.4 Temperature pre-warning (pin DIAG)
When the virtual junction temperature (Tvj) reaches 145 °C, pin DIAG will become
continuously LOW.
7.5 Open-collector diagnostic outputs
Pins DIAG and CLIP are open-collector outputs, therefore more devices can be tied
together. Pins DIAG and CLIP can also be tied together. An external pull-up resistor is
required.
TDA8566_6
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Product data sheet
Rev. 06 — 15 October 2007
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TDA8566
NXP Semiconductors
2 × 40 W/2 Ω stereo BTL car radio power amplifier
7.6 Differential inputs
The input stage is a high-impedance fully differential balanced input stage that is also
capable of operating in a single-ended mode with one of the inputs capacitively coupled to
an audio ground. It should be noted that if a source resistance is added (input voltage
dividers) the CMRR degrades to lower values.
8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
operating
Min
Max
18
Unit
V
VP
supply voltage
-
-
-
non-operating
30
V
load dump protection;
45
V
during 50 ms; tr ≥ 2.5 ms
IOSM
IORM
non-repetitive peak output
current
-
-
10
A
A
repetitive peak output
current
7.5
Tstg
Tvj
storage temperature
−55
+150
150
+85
18
°C
°C
°C
V
virtual junction temperature
ambient temperature
-
Tamb
Vpsc
Vrp
−40
short-circuit safe voltage
reverse polarity voltage
total power dissipation
-
-
-
6.0
V
Ptot
60
W
9. Thermal characteristics
Table 6.
Thermal characteristics
Thermal characteristics in accordance with IEC 60747-1.
Symbol Parameter
Conditions
Typ
Unit
Rth(j-c)
Rth(j-a)
thermal resistance from junction to case
see Figure 7
1.3
40
K/W
K/W
thermal resistance from junction to ambient in free air
output 1
output 2
virtual junction
2.2 K/W
2.2 K/W
0.2 K/W
case
001aaa155
Fig 7. Equivalent thermal resistance network
TDA8566_6
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Product data sheet
Rev. 06 — 15 October 2007
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TDA8566
NXP Semiconductors
2 × 40 W/2 Ω stereo BTL car radio power amplifier
10. Static characteristics
Table 7.
Static characteristics
Symbol Parameter
Supply
Conditions
Min
Typ
Max
Unit
VP
Iq
supply voltage
6
-
14.4
115
18
V
quiescent current
RL = ∞Ω
180
mA
Operating condition
VMODE mode select switch
8.5
-
-
VP
40
V
level
IMODE
mode select switch
current
VMODE = 14.4 V
15
µA
VO
output voltage
-
-
7.0
-
-
V
VOO
output offset voltage
100
mV
Mute condition
VMODE
mode select switch
3.3
-
6.4
V
level
VO
output voltage
output offset voltage
-
-
-
7.0
-
V
VOO
∆VOO
-
-
60
60
mV
mV
output offset voltage
difference
with respect to
operating condition
Standby condition
VMODE
mode select switch
level
0
-
-
2
V
Istb
standby current
0.1
10
µA
Diagnostic
VDIAG
diagnostic output
voltage
during any fault
condition
-
-
0.6
V
[1] The circuit is DC adjusted at VP = 6 V to 18 V and AC operating at VP = 8.5 V to 18 V.
[2] At VP = 18 V to 30 V the DC output voltage is ≤ 0.5VP.
TDA8566_6
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TDA8566
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2 × 40 W/2 Ω stereo BTL car radio power amplifier
11. Dynamic characteristics
Table 8.
Dynamic characteristics
otherwise specified.
Symbol Parameter
Conditions
Min
25
33
45
-
Typ
30
40
55
25
35
19
25
35
14
Max
Unit
W
Po
output power
THD = 0.5 %
-
-
-
-
-
-
-
-
-
THD = 10 %
W
THD = 30 %
W
VP = 13.5 V; THD = 0.5 %
VP = 13.5 V; THD = 10 %
THD = 0.5 %; RL = 4 Ω
THD = 10 %; RL = 4 Ω
THD = 30 %; RL = 4 Ω
W
-
W
16
21
28
-
W
W
W
VP = 13.5 V;
W
THD = 0.5 %; RL = 4 Ω
VP = 13.5 V; THD = 10 %;
-
22
-
W
RL = 4 Ω
THD
total harmonic
distortion
Po = 1 W
-
-
-
-
0.1
8
-
-
-
-
%
%
%
Hz
VCLIP = 0.6 V
Po = 1 W; RL = 4 Ω
0.05
B
power bandwidth
THD = 0.5 %; Po = −1 dB
with respect to 25 W
20 to
20000
fro(l)
fro(h)
Gv
low frequency roll
off
−1 dB
-
25
-
Hz
high frequency roll −1 dB
off
20
25
-
-
kHz
dB
closed loop voltage
gain
26
27
SVRR
supply voltage
ripple rejection
operating
50
50
80
100
50
-
60
-
-
dB
dB
dB
kΩ
kΩ
%
mute
-
standby
-
-
Zi
input impedance
differential
single-ended
120
60
2
150
75
-
|∆Zi|
input impedance
mismatch
Vn(o)
noise output
voltage
operating; Rs = 0 Ω
-
85
100
60
50
-
120
µV
µV
µV
dB
dB
operating; Rs = 10 kΩ
mute; independent of Rs
-
-
-
-
αcs
channel separation Po = 25 W; Rs = 10 kΩ
45
-
-
|∆Gv|
channel unbalance
1
TDA8566_6
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TDA8566
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2 × 40 W/2 Ω stereo BTL car radio power amplifier
Table 8.
Dynamic characteristics …continued
VP = 14.4 V; Tamb = 25 °C; RL = 2 Ω; fi = 1 kHz; measured in test circuit of Figure 9; unless
otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
Vo(mute)
output signal
Vin = Vin(max) = 1 V (RMS)
-
-
2
mV
voltage in mute
CMRR
common mode
rejection ratio
Rs = 0 Ω
60
40
75
-
-
-
dB
dB
Rs = 45 kΩ
[1] Dynamic distortion detector active; pin CLIP is LOW.
[2] Frequency response externally fixed.
[3] Vripple = Vripple(max) = 2 V (p-p); Rs = 0 Ω.
[4] Noise measured in a bandwidth of 20 Hz to 20 kHz.
[5] Common mode rejection ratio measured at the output (over RL) with both inputs tied together;
Vcommon ≤ 3.5 V (RMS); fi = 100 Hz to 10 kHz; Rs = 0 Ω.
[6] Common mode rejection ratio measured at the output (over RL) with both inputs tied together;
Vcommon ≤ 3.5 V (RMS); fi = 1 kHz; Rs = 45 kΩ. The mismatch of the input coupling capacitors is excluded.
12. Application information
12.1 Diagnostic output
Special care must be taken in the PCB layout to separate pin CLIP from
pins IN1+, IN1−, IN2+ and IN2− to minimize the crosstalk between the CLIP output and
the inputs.
12.2 Mode select switch
To avoid switch-on plops, it is advisable to keep the amplifier in the mute mode during
≥ 150 ms (charging of the input capacitors at pins IN1+, IN1−, IN2+ and IN2−). The circuit
and results in fast muting when switching off.
+V
P
S
10 kΩ
100 Ω
mode
select
switch
+
47 µF
100 kΩ
mgd102
Fig 8. Mode select switch circuit
TDA8566_6
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Product data sheet
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2 × 40 W/2 Ω stereo BTL car radio power amplifier
13. Test information
+
+
2200 µF
(16V)
100
nF
V
=
V
P
MODE
_
14.4 V
_
V
V
P2
MODE
P1
220 nF
220 nF
220 nF
220 nF
R /2
s
IN1+
OUT1+
60
kΩ
TDA8566
R
V
L1
in1
60
kΩ
V
V
P
P
OUT1−
R /2
s
IN1−
10
kΩ
10
kΩ
CLIP
DETECTOR
CLIP
DIAG
V
ref
−
SGND
IN2+
DIAGNOSTIC
INTERFACE
R /2
s
OUT2+
60
kΩ
R
V
L2
in2
60
kΩ
OUT2−
R /2
s
IN2−
PGND1 PGND2
mgu359
Fig 9. Stereo BTL test diagram
TDA8566_6
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Product data sheet
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TDA8566
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2 × 40 W/2 Ω stereo BTL car radio power amplifier
14. Package outline
HSOP20: plastic, heatsink small outline package; 20 leads; low stand-off height
SOT418-3
E
A
D
x
X
c
y
E
H
2
v
M
A
E
D
1
D
2
10
1
pin 1 index
Q
A
A
2
(A )
3
E
1
A
4
θ
L
p
detail X
20
11
w M
Z
b
p
e
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
A
max.
(1)
(2)
(2)
A
A
A
b
c
D
D
D
E
E
1
E
e
H
E
L
p
Q
v
w
x
y
Z
θ
UNIT
2
3
4
p
1
2
2
8°
0°
+0.08 0.53 0.32
−0.04 0.40 0.23
16.0 13.0 1.1 11.1 6.2
15.8 12.6 0.9 10.9 5.8
2.9
2.5
14.5 1.1
13.9 0.8
1.7
1.5
2.5
2.0
3.5
3.2
mm
1.27
3.5
0.35
0.25 0.25 0.03 0.07
Notes
1. Limits per individual lead.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
02-02-12
03-07-23
SOT418-3
Fig 10. Package outline SOT418-3 (HSOP20)
TDA8566_6
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TDA8566
NXP Semiconductors
2 × 40 W/2 Ω stereo BTL car radio power amplifier
HSOP24: plastic, heatsink small outline package; 24 leads; low stand-off height
SOT566-3
E
A
D
x
X
c
y
E
H
2
v
M
A
E
D
1
D
2
12
1
pin 1 index
Q
A
A
2
(A )
3
E
1
A
4
θ
L
p
detail X
24
13
w M
Z
b
p
e
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
A
max.
(1)
(2)
(2)
A
A
A
b
c
D
D
D
E
E
1
E
e
H
E
L
p
Q
v
w
x
y
Z
θ
UNIT
2
3
4
p
1
2
2
8°
0°
+0.08 0.53 0.32
−0.04 0.40 0.23
16.0 13.0 1.1 11.1 6.2
15.8 12.6 0.9 10.9 5.8
2.9
2.5
14.5 1.1
13.9 0.8
1.7
1.5
2.7
2.2
3.5
3.2
mm
1
3.5
0.35
0.25 0.25 0.03 0.07
Notes
1. Limits per individual lead.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
03-02-18
03-07-23
SOT566-3
Fig 11. Package outline SOT566-3 (HSOP24)
TDA8566_6
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Product data sheet
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TDA8566
NXP Semiconductors
2 × 40 W/2 Ω stereo BTL car radio power amplifier
DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm)
SOT243-1
non-concave
D
h
x
D
E
h
view B: mounting base side
A
2
d
B
j
E
A
L
3
L
Q
c
2
v
M
1
17
e
e
m
w
M
1
Z
b
p
e
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
(1)
(1)
UNIT
A
A
b
c
D
d
D
E
e
e
e
E
j
L
L
3
m
Q
v
w
x
Z
2
p
h
1
2
h
17.0 4.6 0.75 0.48 24.0 20.0
15.5 4.4 0.60 0.38 23.6 19.6
12.2
11.8
3.4 12.4 2.4
3.1 11.0 1.6
2.00
1.45
2.1
1.8
6
mm
10
2.54 1.27 5.08
0.8
4.3
0.4 0.03
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-17
03-03-12
SOT243-1
Fig 12. Package outline SOT243-1 (DBS17P)
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15. Soldering
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
15.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
15.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
• Board specifications, including the board finish, solder masks and vias
• Package footprints, including solder thieves and orientation
• The moisture sensitivity level of the packages
• Package placement
• Inspection and repair
• Lead-free soldering versus PbSn soldering
15.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
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15.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 13) than a PbSn process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 9 and 10
Table 9.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm3)
< 350
≥ 350
220
< 2.5
235
220
≥ 2.5
220
Table 10. Lead-free process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm3)
< 350
260
350 to 2000
> 2000
260
< 1.6
260
250
245
1.6 to 2.5
> 2.5
260
245
250
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 13.
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maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 13. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
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16. Revision history
Table 11. Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
TDA8566_6
20071015
Product data sheet
-
TDA8566Q_5
TDA8566TH_2
Modifications:
• The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
• Included TDA8566TH1 and TDA8566Q in the data sheet
TDA8566Q_5
TDA8566TH_2
20010221
Product specification
-
-
-
20030708
Product specification
-
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17. Legal information
17.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
malfunction of a NXP Semiconductors product can reasonably be expected to
17.2 Definitions
result in personal injury, death or severe property or environmental damage.
NXP Semiconductors accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or applications and therefore
such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
17.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
17.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
18. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: [email protected]
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19. Contents
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2007.
All rights reserved.
For sales office addresses, please send an email to: [email protected]
Date of release: 15 October 2007
Document identifier: TDA8566_6
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